WO2023135733A1 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
WO2023135733A1
WO2023135733A1 PCT/JP2022/001080 JP2022001080W WO2023135733A1 WO 2023135733 A1 WO2023135733 A1 WO 2023135733A1 JP 2022001080 W JP2022001080 W JP 2022001080W WO 2023135733 A1 WO2023135733 A1 WO 2023135733A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
fixing
connector
electronic device
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/001080
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
崇 中島
稔 飯塚
慎吾 北山
英明 横山
雄一 老田
清 藤巻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takahata Precision Co Ltd
Elephantech Inc
Original Assignee
Takahata Precision Co Ltd
Elephantech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takahata Precision Co Ltd, Elephantech Inc filed Critical Takahata Precision Co Ltd
Priority to JP2022535940A priority Critical patent/JP7117705B1/ja
Priority to PCT/JP2022/001080 priority patent/WO2023135733A1/ja
Publication of WO2023135733A1 publication Critical patent/WO2023135733A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to electronic devices.
  • a multilayer structure having a first side and an opposite second side, preferably a flexible substrate film and a number of conductive layers optionally defining contact pads and/or conductors.
  • a conductive trace preferably printed on a first side of the substrate film, and a plastic layer, the plastic layer and the substrate, the traces preferably printed on the first side of the substrate film to establish a desired predetermined circuit design.
  • a plastic layer molded onto the first side of the substrate film to enclose the circuitry between the first side of the film and a plastic layer from the opposite second side of the substrate film to the first side;
  • a connector preferably flexible, for providing an external electrical connection to circuitry embedded thereon, one end of the connector having a predetermined contact on a first surface.
  • the other end While attached to the region, the other end is positioned on the second side of the substrate for coupling with an external element, and the intermediate connecting the two ends.
  • the section is fed through an opening in the base film and preferably the opening extending through the thickness of the base film is sized to accommodate the connector without substantial additional clearance.
  • a structure is known from U.S. Pat.
  • the present invention ensures reliability when a connector that provides electrical connection from the outside is mounted on a circuit board having a conductive pattern formed on a base material.
  • the electronic device comprises: A circuit board in which a conductive pattern is arranged on one surface of a deformable base material; a terminal portion provided on the base material, electrically connected to the conductive pattern and electrically connected to an external element provided outside; a body portion surrounding the terminal portion; a connector comprising a fixing portion provided at the lower end and fixed to the base material; a resin layer covering the other surface of the substrate opposite to the one surface; a fixing member to which the fixing portion is fixed while being embedded in the resin layer and in contact with the fixing portion; It is characterized by
  • the invention according to claim 2 is the electronic device according to claim 1,
  • the fixing member is exposed on one side of the base material and contacts the fixing part so that a contact surface that contacts the fixing part is flush with the one surface of the base material on which the conductive pattern is formed.
  • the electronic device includes: A circuit board in which a conductive pattern is arranged on one surface of a deformable base material; a resin layer covering the other surface opposite to the one surface of the base material; a terminal portion provided on the resin layer, penetrating the resin layer and the base material, electrically connected to the conductive pattern, and electrically connected to an external element provided outside; the terminal; a connector comprising a main body portion surrounding a portion, and a fixing portion provided at the lower end of the main body portion and fixed to the resin layer; a fixing member to which the fixing portion is fixed while being embedded in the resin layer and in contact with the fixing portion; It is characterized by
  • the invention according to claim 4 is the electronic device according to claim 3,
  • the fixing member is exposed on one surface side of the resin layer and is in contact with the fixing portion such that a contact surface that contacts the fixing portion is flush with one surface of the resin layer. It is characterized by
  • the invention according to claim 5 is the electronic device according to any one of claims 1 to 4,
  • the fixing member has an undercut shape formed at one end embedded in the resin layer, It is characterized by
  • the invention according to claim 6 is the electronic device according to any one of claims 1 to 5,
  • the fixing part is fixed to the fixing member by soldering, It is characterized by
  • the invention according to claim 7 is the electronic device according to any one of claims 1 to 5,
  • the fixing part is screw-fixed to the fixing member, It is characterized by
  • the invention according to claim 8 is the electronic device according to any one of claims 1 to 5,
  • the fixing part is fixed to the fixing member with an adhesive, It is characterized by
  • the electronic device includes: A circuit board in which a conductive pattern is arranged on one surface of a deformable base material; a terminal portion provided on the base material, electrically connected to the conductive pattern and electrically connected to an external element provided outside; a body portion surrounding the terminal portion; a connector comprising a fixing portion provided at the lower end and fixed to the base material; a resin layer covering the other surface of the substrate opposite to the one surface; a fixing body that partially extends through the base material and extends to one surface side of the base material and that is pressed and fixed while covering the fixing part, It is characterized by
  • the invention according to claim 10 is the electronic device according to any one of claims 1 to 9, wherein the connector is a commonly available connector; It is characterized by
  • the connector that provides external electrical connection to the circuit board having the conductive pattern formed on the base material.
  • the connector when the fixing portion is made of metal, the connector can be firmly fixed.
  • the connector can be firmly fixed regardless of the material of the fixing portion.
  • the connector can be fixed regardless of the material of the fixing portion.
  • a generally available connector can be mounted.
  • FIG. 1A is a schematic plan view showing an example of an electronic device according to this embodiment
  • FIG. 1B is a schematic cross-sectional view showing an example of the electronic device
  • FIG. 2A is a schematic partial plan view for explaining fixing of a connector of an electronic device
  • FIG. 2B is a schematic partial cross-sectional view for explaining fixing of a connector of an electronic device
  • FIG. 2C shows an example of an anchor portion of a fixing member for fixing the connector.
  • It is a partial cross-sectional schematic diagram.
  • 3A is a schematic partial plan view illustrating fixing of the connector of the electronic device according to Modification 1
  • FIG. 3B is a schematic partial cross-sectional view illustrating fixing of the connector of the electronic device according to Modification 1.
  • FIG. 1A is a schematic plan view showing an example of an electronic device according to this embodiment
  • FIG. 1B is a schematic cross-sectional view showing an example of the electronic device.
  • FIG. 2A is a schematic partial plan view for explaining fixing of a connector
  • FIG. 4A is a schematic partial cross-sectional view illustrating fixing of the connector of the electronic device according to Modification 2
  • FIG. 4B is a schematic partial plan view illustrating fixing of the connector of the electronic device according to Modification 2.
  • FIG. It is a flowchart figure which shows an example of the procedure of the outline of the manufacturing method of an electronic device. It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of an electronic device.
  • 7A is a schematic plan view showing an example of the electronic device according to the second embodiment
  • FIG. 7B is a schematic cross-sectional view showing an example of the electronic device according to the second embodiment.
  • 8A is a schematic partial plan view for explaining fixing of the connector of the electronic device according to the second embodiment
  • FIG. 8B is a schematic partial cross-sectional view for explaining fixing of the connector of the electronic device according to the second embodiment.
  • FIG. 10 is a flow chart diagram showing an example of a schematic procedure of a method for manufacturing an electronic device according to the second embodiment; It is a partial cross-sectional schematic diagram of the electronic device for demonstrating the manufacturing process of the electronic device which concerns on 2nd Embodiment.
  • FIG. 1A is a schematic plan view showing an example of the electronic device 1 according to the first embodiment
  • FIG. 1B is a schematic cross-sectional view showing an example of the electronic device 1
  • FIG. 2B is a partial schematic plan view for explaining fixing of the connector 5
  • FIG. 2B is a partial schematic cross-sectional view for explaining fixing of the connector 5 of the electronic device 1
  • FIG. It is a cross-sectional schematic diagram.
  • the configuration of the electronic device 1 according to the first embodiment will be described with reference to the drawings.
  • the electronic device 1 includes a circuit board 4 having a conductive pattern 3 arranged on one surface 2a of a deformable base material 2, and a circuit board 4 provided on the base material 2, electrically connected to the conductive pattern 3, and provided outside.
  • a connector 5 comprising a terminal portion 51 for electrically connecting to an external element, a body portion 52 surrounding the terminal portion 51, and a fixing portion 53 provided at the lower end of the body portion 52 and fixed to the base material 2.
  • a resin layer 6 covering the other surface 2b of the base material 2 opposite to the one surface 2a;
  • the base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material.
  • a "deformable substrate” is one that can be deformed after placement of the conductive pattern 3, i.e. from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or air pressure forming. It means a substrate that can be deformed into a shape.
  • Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyether ether ketone (PEEK), acrylic butadiene styrene ( ABS), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC) and other thermoplastic resins.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamides
  • PEEK polyether ether ketone
  • ABS acrylic butadiene styrene
  • PMMA polymethyl methacrylate
  • PVC polyvinyl chloride
  • polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.
  • a surface treatment to one surface 2a of the base material 2 in order to evenly apply catalyst ink such as metal nanoparticles.
  • catalyst ink such as metal nanoparticles.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, primer treatment, etc. can be used.
  • a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers growth of the metal plating is formed in a predetermined pattern.
  • the base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 2, followed by drying and baking.
  • the thickness ( ⁇ m) of the underlayer is preferably 0.1 to 20 ⁇ m, more preferably 0.2 to 5 ⁇ m, most preferably 0.5 to 2 ⁇ m. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  • gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferred.
  • the particle size (nm) of the catalyst is preferably 1-500 nm, more preferably 10-100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.
  • the conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating.
  • the plating metal copper, nickel, tin, silver, gold, or the like can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.
  • the thickness ( ⁇ m) of the plating layer is preferably 0.03-100 ⁇ m, more preferably 1-35 ⁇ m, and most preferably 3-18 ⁇ m. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plated layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.
  • the electronic components 3B include control circuits, strain, resistance, capacitance, contact sensing such as TIR, and photodetection components, tactile components such as piezoelectric actuators or vibration motors or vibration components, light emitting components such as LEDs, microphones and Producing or receiving sounds such as speakers, device operating components such as memory chips, programmable logic chips and CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.
  • DSP digital signal processors
  • the connector 5 is a generally available connector, and includes a terminal portion 51 for electrically connecting to the conductive pattern 3 and electrically connecting to an external element provided outside, and a body portion holding the terminal portion 51. 52, and a fixing portion 53 for fixing the body portion 52 to the circuit board 4 on which the connector 5 is arranged.
  • the terminal portion 51 has a connection portion 51 a surface-mounted on the circuit board 4 , and the connection portion 51 a is soldered to a connector connection pad 3 a formed at one end of the conductive pattern 3 .
  • the fixing portion 53 has a holding portion 53a held by the body portion 52 and a tail portion 53b fixed to the fixing member 7 in contact with the fixing member 7 embedded in the resin layer 6 described later.
  • the fixing part 53 is preferably made of metal and is fixed to the fixing member 7 by soldering, but it is not necessarily made of metal. good.
  • the fixing portion 53 Since the fixing portion 53 is fixed with the tail portion 53b in contact with the fixing member 7 embedded in the resin layer 6, the fixing strength of the connector 5 to the circuit board 4 is increased. In particular, when the connector 5 is fitted to the mating connector, the connector 5 collides with the mating connector, and a force acts on the connector 5 in a direction crossing the thickness direction of the substrate 2 . At this time, the fixing portion 53 is fixed in contact with the fixing member 7 embedded in the resin layer 6 covering the other surface 2b of the substrate 2 opposite to the one surface 2a on which the conductive pattern 3 is arranged. Therefore, the load applied to the solder between the conductive pattern 3 of the circuit board 4 and the connection portion 51a can be reliably reduced.
  • the resin layer 6 is formed so as to cover the other surface 2b of the substrate 2 via the adhesive layer AD with respect to the other surface 2b opposite to the one surface 2a of the substrate 2 on which the conductive pattern 3 is arranged.
  • the adhesive layer AD may be toned to hide the conductive pattern 3 invisibly from the outside.
  • the resin layer 6 is formed by making the adhesive layer AD light-transmitting and using a transparent resin material as the resin material. It can be visible.
  • the resin layer 6 is a thermoplastic resin made of a thermoplastic resin material that can be injection molded. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof.
  • a plastic resin can be used.
  • the fixing member 7 penetrates the anchor portion 71 embedded inside the resin layer 6 and the base material 2 in the thickness direction of the base material 2 and is exposed on the one surface 2a side of the base material 2. It consists of a contact surface 72 that contacts the tail portion 53b of the connector 5 that is surface-mounted.
  • the contact surface 72 is exposed on the one surface 2a side of the base material 2 so as to be flush with the one surface 2a of the base material 2.
  • the connector 5 surface-mounted on the circuit board 4 is fixed to the contact surface 72 by the tail portion 53 b of the fixing portion 53 .
  • Fixing methods include soldering, screw fixing, and bonding with an adhesive. Since the contact surface 72 is flush with the one surface 2 a of the base material 2 , the connector 5 can be prevented from floating from the base material 2 .
  • the fixing member 7 is made of metal, and the anchor part 71 is insert-molded with the resin layer 6 and embedded inside the resin layer 6 . Therefore, as shown in FIG. 2B, the anchor part 71 may be formed so as to connect the contact surfaces 72 provided in alignment with the tail parts 53b of the fixing parts 53 provided so as to protrude from both sides of the connector 5. It may well have an undercut feature 71a at one end, as shown in FIG. 2C. As a result, it is possible to prevent the fixing member 7 from coming off.
  • Modification 1 3A is a schematic partial plan view explaining fixing of the connector 5 of the electronic device 1 according to Modification 1
  • FIG. 3B is a schematic partial cross-sectional view explaining fixing of the connector 5 of the electronic device 1 according to Modification 1.
  • the electronic device 1 according to Modification 1 includes a fixing member 7 ⁇ /b>A that contacts and fixes the fixing portion 53 of the connector 5 that is surface-mounted on the circuit board 4 so as to press the fixing portion 53 from above.
  • the fixing member 7A includes an anchor portion 71 embedded inside the resin layer 6, and a connector 5 which penetrates the base material 2 in the thickness direction of the base material 2 and protrudes toward the one surface 2a side of the base material 2 to be surface-mounted.
  • the contact surface 72A contacts and fixes the tail portion 53b so as to press it from above.
  • Modification 2 4A is a partial cross-sectional schematic diagram illustrating fixing of the connector 5 of the electronic device 1 according to Modification 2
  • FIG. 4B is a partial plan view illustrating fixing of the connector 5 of the electronic device 1 according to Modification 2.
  • An electronic device 1 according to Modification 2 includes a circuit board 4 in which a conductive pattern 3 is arranged on one surface 2a of a deformable base material 2, and a resin covering the other surface 2b of the base material 2 opposite to the one surface 2a. a layer 6, and a terminal portion provided on the resin layer 6, penetrating the resin layer 6 and the base material 2, electrically connected to the conductive pattern 3, and electrically connected to an external element provided outside.
  • the fixing member 7B is composed of an anchor portion 71B embedded inside the resin layer 6 and a contact surface 72B that is exposed on the one surface 6a side of the resin layer 6 and contacts the tail portion 53b of the connector 5 that is surface-mounted.
  • the contact surface 72B is exposed on the one surface 6a side of the resin layer 6 so as to be flush with the one surface 6a of the resin layer 6.
  • a tail portion 53b of the fixing portion 53 of the connector 5 is fixed to the contact surface 72B.
  • Fixing methods include soldering, screw fixing, and bonding with an adhesive. Since the contact surface 72 ⁇ /b>B is flush with the surface 6 a of the resin layer 6 , the connector 5 can be prevented from floating from the resin layer 6 .
  • FIG. 5 is a flow chart showing an example of the outline procedure of the manufacturing method of the electronic device 1, and FIG. It is a diagram.
  • the electronic device 1 includes a preparation step S11 for the base material 2, a wiring plating step S12 for arranging the conductive pattern 3 on the base material 2, and positioning the circuit board 4 and the fixing member 7 in the injection mold.
  • a resin filling step S13 for insert-molding the resin layer 6 covering the other surface 2b of the base material 2 and the fixing member 7; It is manufactured through step S14 and fixing step S15 of fixing the tail portion 53b of the connector 5 to the contact surface 72 of the fixing member 7.
  • Base material preparation step S11 In the base material preparation step S11, first, the contact surface 72 of the fixing member 7 is exposed on the one surface 2a side of the substantially flat film-like base material 2 formed in a predetermined shape and size. notch 2c (see FIG. 6A).
  • a base layer made of catalyst particles such as metal nanoparticles that trigger the growth of the metal plating is formed on the base material 2 in a predetermined pattern.
  • the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, primer treatment, etc., in order to uniformly apply the catalyst ink composed of catalyst particles such as metal nanoparticles.
  • Methods for applying a catalyst ink composed of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method.
  • Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method.
  • an inkjet printing method is used.
  • the solvent is volatilized to leave only the metal nanoparticles.
  • the solvent is then removed (drying) and the metal nanoparticles are sintered (firing).
  • the firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the metal nanoparticles will not be sufficiently sintered, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.
  • Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 6B).
  • the plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.
  • an adhesive layer AD is formed on the other surface 2b of the substrate 2 opposite to the surface 2a on which the conductive pattern 3 is arranged, depending on the combination of the resin materials of the substrate 2 and the resin layer 6.
  • Apply the forming binder ink (see FIG. 6C). Further, it is preferable to apply the binder ink to the anchor portions 71 of the fixing member 7 as well.
  • the binder ink contains an adhesive resin, and is applied by screen printing, inkjet printing, spray coating, brush coating, or the like to improve the adhesiveness between the base material 2 and the injection-molded resin layer 6 and between the resin layer 6 and the fixing member 7. Improve.
  • the mold K is closed and the cavity CA1 is filled with resin.
  • the resin layer 6 covering the other surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1. It will be in the state exposed to the one surface 2a side of the base material 2 so that it may become flush with.
  • solder W is desirably a low-temperature solder having a melting temperature lower than the softening point of the base material 2.
  • PET polyethylene terephthalate
  • solder paste with a melting point lower than the softening point of the base material 2
  • the base material 2 does not melt or otherwise deform while the solder paste melts and bonds chemically and physically with the connector connection pads 3a. be ready to join.
  • the solder W is solidified, and the connecting portion 51a of the connector 5 is electrically joined to the conductive pattern 3 via the solder W (see FIG. 6E).
  • solder is not limited to low-temperature solder, but ordinary solder may be used because it is non-contact and does not apply a load to the base material 2 as compared to soldering with a soldering iron.
  • Fixing step S15 In the fixing step S15, the tail portion 53b of the connector 5 is mechanically joined and fixed to the contact surface 72 of the fixing member 7 exposed on the one surface 2a side of the base material 2 so as to be flush with the one surface 2a of the base material 2. do. Fixing methods include soldering, screw fixing, and bonding with an adhesive. By fixing the tail portion 53b of the connector 5 to the contact surface 72 of the fixing member 7, the load applied to the solder between the connector connection pad 3a of the circuit board 4 and the connection portion 51a of the connector 5 can be reliably reduced. , peeling of the conductive pattern 3 can be suppressed.
  • FIG. 7A is a schematic plan view showing an example of an electronic device 1A according to the second embodiment
  • FIG. 7B is a schematic cross-sectional view showing an example of the electronic device 1A according to the second embodiment
  • FIG. 8A is an electronic device according to the second embodiment.
  • FIG. 8B is a partial schematic plan view explaining fixing of the connector 5 of the device 1A
  • FIG. 8B is a partial schematic cross-sectional view explaining fixing of the connector 5 of the electronic device 1A according to the second embodiment.
  • the electronic device 1A includes a circuit board 4 in which a conductive pattern 3 is arranged on one surface 2a of a deformable base material 2, and a circuit board 4 provided on the base material 2. a terminal portion 51 for electrically connecting to an external element provided outside; a housing 52 surrounding the terminal portion 51; , a resin layer 6 covering the other surface 2b of the side opposite to the one surface 2a of the base material 2, and a part of the resin layer 6 penetrates the base material 2 to the one surface 2a side of the base material 2. and a fixing body 8 that covers and fixes the fixing portion 53 by pressing it.
  • the electronic device 1A in the electronic device 1A according to the second embodiment, a part of the resin layer 6 penetrates the base material 2 and extends toward the one surface 2a side of the base material 2 to cover the fixing portion 53 of the surface-mounted connector 5.
  • the electronic device 1 is different from the electronic device 1 according to the first embodiment in that it includes a fixing body 8 that presses and fixes the fixing portion 53 in a state. Therefore, the same reference numerals are given to the common parts with the first embodiment, and the detailed explanation thereof will be omitted.
  • the connector 5 has the terminal portion 51 soldered to the connector connection pad 3a of the conductive pattern 3, and the tail portion 53b of the fixing portion 53 is in contact with the surface 2a of the substrate 2. It is surface-mounted on the circuit board 4 in this state.
  • the base material 2 is provided with a through hole 2c (see FIG. 9A) passing through the base material 2 in the thickness direction on the side of the region where the tail portion 53b is in contact.
  • a fixed body 8 projecting from the substrate 2 toward the one surface 2a side is formed, and is fixed by pressing while covering the fixed portion 53 .
  • the connector 5 is fixed to the circuit board 4 by pressing and fixing the fixing portion 53 with the tail portion 53b covering the tail portion 53b with the fixing body 8 extending through the base material 2 from the resin layer 6 side.
  • the strength is increased, and the load applied to the solder between the conductive pattern 3 and the connection portion 51a can be reliably reduced.
  • FIG. 9 is a flow chart showing an example of a schematic procedure of a manufacturing method of the electronic device 1A, and FIG. It is a diagram.
  • the electronic device 1A includes a preparation step S21 of the substrate 2, a wiring plating step S22 of forming the conductive pattern 3 on the substrate 2, and an electrical connection between the conductive pattern 3 and the connection portion 51a of the connector 5 by soldering. and the circuit board 4 with the connector 5 mounted thereon is positioned in the injection mold, and the resin layer 6 covering the other surface 2b of the base material 2 and the tail portion 53b of the connector 5 are joined together. and a resin filling step S24 for integrally forming the fixed body 8 to be fixed.
  • Base material preparation step S21 In the base material preparation step S21, first, a substantially flat film-like base material 2 having a predetermined shape and size is formed with through holes 2c penetrating in the thickness direction of the base material 2 ( (see Figure 10A).
  • the through hole 2c is a hole that communicates between the cavity CA1 forming the resin layer 6 and the cavity CA2 forming the fixed body 8, and is formed in accordance with the position where the fixed body 8 is formed.
  • a base layer made of catalyst particles such as metal nanoparticles that trigger the growth of metal plating is formed on the base material 2 in a predetermined pattern, and the wiring plating step S22 is performed.
  • a conductive pattern 3 is placed through the hole (see FIG. 10B).
  • an adhesive layer AD is formed on the other surface 2b of the substrate 2 opposite to the surface 2a on which the conductive pattern 3 is arranged, depending on the combination of the resin materials of the substrate 2 and the resin layer 6.
  • Apply the forming binder ink It is also preferable to apply the binder ink to the tail portion 53b of the connector 5 (see FIG. 10D).
  • the binder ink contains an adhesive resin and improves the adhesiveness between the base material 2 and the injection-molded resin layer 6 and between the tail portion 53 b of the connector 5 and the fixed body 8 .
  • the mold K is closed and the cavity CA1 is filled with resin.
  • a resin layer 6 covering the other surface 2b of the substrate 2 is formed by the resin filled in the cavity CA1.
  • the resin filling the cavity CA1 is filled into the cavity CA2 formed on the one surface 2a side of the substrate 2 where the conductive pattern 3 is arranged from the through hole 2c formed in the substrate 2.
  • FIG. 10E The resin filled in the cavity CA2 forms a fixing body 8 that covers and fixes the tail part 53b of the fixing part 53 (see FIG. 10E).
  • the tail portion 53b of the connector 5 surface-mounted on the circuit board 4 having the conductive pattern 3 formed on the base material 2 is covered. It is possible to provide a fixing body 8 for pressing and fixing in the folded state.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PCT/JP2022/001080 2022-01-14 2022-01-14 電子装置 Ceased WO2023135733A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022535940A JP7117705B1 (ja) 2022-01-14 2022-01-14 電子装置
PCT/JP2022/001080 WO2023135733A1 (ja) 2022-01-14 2022-01-14 電子装置

Applications Claiming Priority (1)

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WO2025141864A1 (ja) * 2023-12-28 2025-07-03 日産自動車株式会社 コネクタ構造

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JP7212340B1 (ja) * 2022-09-14 2023-01-25 エレファンテック株式会社 コネクタ接続構造及びその製造方法

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JPH01109158U (https=) * 1988-01-18 1989-07-24
JPH0567043U (ja) * 1992-02-15 1993-09-03 松下電工株式会社 実装部品の保持構造
CN1805219A (zh) * 2005-01-12 2006-07-19 华为技术有限公司 一种连接装置
JP2017208273A (ja) * 2016-05-19 2017-11-24 株式会社デンソー 電子装置
JP2019204845A (ja) * 2018-05-22 2019-11-28 株式会社オートネットワーク技術研究所 回路装置

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JPH0567043U (ja) * 1992-02-15 1993-09-03 松下電工株式会社 実装部品の保持構造
CN1805219A (zh) * 2005-01-12 2006-07-19 华为技术有限公司 一种连接装置
JP2017208273A (ja) * 2016-05-19 2017-11-24 株式会社デンソー 電子装置
JP2019204845A (ja) * 2018-05-22 2019-11-28 株式会社オートネットワーク技術研究所 回路装置

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