WO2023133953A1 - 校正装置及校正方法 - Google Patents

校正装置及校正方法 Download PDF

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Publication number
WO2023133953A1
WO2023133953A1 PCT/CN2022/075439 CN2022075439W WO2023133953A1 WO 2023133953 A1 WO2023133953 A1 WO 2023133953A1 CN 2022075439 W CN2022075439 W CN 2022075439W WO 2023133953 A1 WO2023133953 A1 WO 2023133953A1
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WO
WIPO (PCT)
Prior art keywords
support rods
distance information
detection
functional device
edge ring
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PCT/CN2022/075439
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English (en)
French (fr)
Inventor
董帮亮
汪兵
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长鑫存储技术有限公司
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Publication of WO2023133953A1 publication Critical patent/WO2023133953A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Definitions

  • the present disclosure relates to but not limited to a calibration device and a calibration method.
  • Etching technology can be divided into wet etching and dry etching, and etching technology is an important step in semiconductor manufacturing process, microelectronics manufacturing process and micro-nano manufacturing process.
  • the relative distance between the edge ring and the electrostatic chuck needs to be corrected and adjusted.
  • the method of correcting and adjusting the edge ring includes visually placing the edge ring, and measuring the relative distance between the edge of the edge ring and the edge of the electrostatic chuck with a vernier caliper, thereby correcting and adjusting the position of the edge ring.
  • the disclosure provides a calibration device and a calibration method.
  • the first aspect of the embodiments of the present disclosure provides a correction device for correcting the relative position between an edge ring of a semiconductor device and a functional device
  • the correction device includes: a plurality of support rods, the plurality of support rods The position of one end is relatively fixed, the other ends of the plurality of support rods are respectively installed in the plurality of mounting holes of the functional device, and the support rods are arranged obliquely relative to the functional device;
  • a plurality of detection devices are arranged on the support rods, the detection devices are arranged in one-to-one correspondence with the support rods, and the detection devices are used to detect the distance between the detection devices and the edge ring first distance information;
  • the controller is electrically connected to the plurality of detection devices respectively.
  • the detection device includes a detection unit that can rotate relative to the support rod, and the detection unit is used to detect a first distance between the detection unit and the edge ring information.
  • the detection unit includes a laser ranging sensor.
  • the detection device further includes a display unit, and the display unit is connected in communication with the detection unit;
  • the display unit is used to display the first distance information.
  • angles formed between the plurality of support rods and the functional device are all the same.
  • one end of the plurality of support rods away from the functional device has an intersection point; or,
  • the extension lines of the ends of the plurality of support rods away from the functional device have intersection points; or,
  • the orthographic projection of the plurality of support rods on the functional device has a midpoint.
  • intersection point or the midpoint is located on a vertical line passing through the center point of the functional device.
  • the correction device further includes a fixing member, and the fixing member is used for fixing one end of the plurality of support rods away from the functional device.
  • the fixing member includes a fixing base, and the fixing base is provided with a plurality of insertion holes, wherein one ends of the plurality of support rods are respectively inserted into the plurality of insertion holes. Inside.
  • the correction device further includes a plurality of locking pieces, and the support rod is fixed on the fixing base through the locking pieces.
  • the number of the support rods is at least three.
  • a second aspect of the present disclosure provides a calibration method applied to the calibration device described above, the calibration method comprising:
  • the first distance information and the second distance information determine the relative distance between the functional device and the edge ring in the area where the support rod is located;
  • the position of the edge ring is adjusted according to the difference between the relative distances.
  • the adjusting the position of the edge ring according to the difference between the relative distances includes:
  • the position of the edge ring is adjusted.
  • the acquiring the second distance information of each support rod, the second distance information being used to characterize the geometric positional relationship between the two ends of the support rod and the functional device includes :
  • a second length is acquired, where the second length is used to characterize the distance between the mounting hole and the edge of the functional device.
  • the determining the relative distance between the functional device and the edge ring in the area where the support rod is located according to the first distance information and the second distance information includes:
  • the relative distance is determined according to the first distance information, the first length, the inclination angle, and the second length.
  • Fig. 1 is a schematic diagram of a calibration device according to an exemplary embodiment.
  • Fig. 2 is a schematic diagram of a fixing part of a calibration device according to an exemplary embodiment.
  • Fig. 3 is a schematic diagram showing deflection of an edge ring according to an exemplary embodiment.
  • Fig. 4 is a schematic diagram showing the position alignment of an edge ring according to an exemplary embodiment.
  • Fig. 5 is a schematic diagram of determining a relative distance according to an exemplary embodiment.
  • Fig. 6 is a flow chart of a calibration method according to an exemplary embodiment.
  • A tilt angle
  • H first vertical height
  • Etching technology can be divided into wet etching and dry etching, and etching technology is an important step in semiconductor manufacturing process, microelectronics manufacturing process and micro-nano manufacturing process.
  • the method of correcting and adjusting the edge ring includes visually placing the edge ring, and measuring the relative distance between the edge of the edge ring and the edge of the electrostatic chuck with a vernier caliper, thereby correcting and adjusting the position of the edge ring.
  • the edge ring when the edge ring is placed on the machine used for semiconductor structure manufacturing after the cleaning process, the edge ring is first placed on the edge of the electrostatic chuck. Then, the relative spacing between the edge of the edge ring and the edge of the electrostatic chuck is measured with a vernier caliper. Select several positions to measure respectively. When the relative gaps of the above-mentioned positions are all predetermined values, for example, when the measurement results of the relative gaps of several positions are all 0.125mm, it means that the position of the edge ring has been corrected.
  • FIG. 1 shows a schematic diagram of a calibration device provided according to an exemplary embodiment.
  • the calibration device will be introduced below with reference to FIG. 1 to FIG. 5 .
  • an exemplary embodiment of the present disclosure provides a calibration device for correcting the relative position between an edge ring 10 and a functional device 20 of a semiconductor device.
  • the functional device 20 includes an electrostatic chuck, it should be noted that the functional device 20 may also be other structures in a semiconductor device, which is not specifically limited here.
  • the calibration device includes a plurality of support rods 1 , a plurality of detection devices 2 and a controller 3 .
  • each support rod 1 there are multiple support rods 1 .
  • the position of one end of any one support rod 1 in a plurality of support rods 1 is relatively fixed, and wherein, the relatively fixed end of support rod 1 can be the upper end or the lower end of support rod 1.
  • the upper end of the support rod 1 is fixed.
  • the other ends of the plurality of support rods 1 are respectively installed in the plurality of installation holes 210 of the functional device 20 (such as an electrostatic chuck), and the number of the installation holes 210 is the same as the number of the support rods 1 .
  • each support rod 1 is arranged obliquely relative to the top surface of the functional device 20 .
  • each support rod 1 among the plurality of support rods 1 is fixedly connected.
  • the way of fixed connection may be that the upper ends of any two support rods 1 are fixedly overlapped, or the upper ends of multiple support rods 1 are fixedly connected by a fixing member, thereby forming a structural form of a support frame, wherein the fixing member may include a fixed blocks or connecting rods, etc.
  • a plurality of detection devices 2 are arranged on a plurality of support rods 1 in one-to-one correspondence, and the support rods 1 are arranged obliquely.
  • the detection device 2 can be arranged at any position of the support rod 1 .
  • the detection device 2 is used to detect the first distance information between the detection end of the detection device 2 on each support rod 1 and the edge of the edge ring 10 .
  • the edge of the edge ring 10 involved in this embodiment refers to the inner edge of the edge ring 10.
  • the detection end of the detection device 2 and the inner edge of the edge ring 10 may also be The distance between is used as the first distance information.
  • the detection device 2 may be set at half of the effective length of the support rod 1 . It should be noted that the effective length of the support rod 1 is used to represent the length from the surface of the functional device 20 to the fixed position at the top of the support rod 1 .
  • the detection device 2 is arranged at half of the effective length of the support rod 1, and the support rod 1 is arranged obliquely, thus, the vertical distance between the support rod 1, the support rod 1 and the functional device 20
  • the distance and the surface of the functional device 20 are connected to each other to form a triangle or a right triangle, so that the first information can be quickly obtained according to the similar triangle theorem, the Pythagorean theorem, etc., the correction time of the edge ring 10 is saved, and the correction efficiency is improved, thereby improving the semiconductor structure. production capacity.
  • the calibration device further includes a controller 3 , and the controller 3 is electrically connected to a plurality of detection devices 2 .
  • the controller 3 may include a Programmable Logic Controller (Programmable Logic Controller, PLC), and the Programmable Logic Controller adopts a programmable memory to store and execute logical operations, sequence control, timing, counting and arithmetic operations in its interior. Operation instructions, etc., control various types of mechanical equipment or production processes through digital or analog input and output.
  • the controller 3 may also include a single-chip microcomputer or the like.
  • a detection device is provided on each support rod, and the detection device is used to accurately obtain the first distance information of the edge position corresponding to the detection device and the edge ring, and then through the comparison of multiple first distance information, Correcting the relative position of the edge ring effectively improves the measurement accuracy, thereby ensuring the consistency of the critical dimensions of the semiconductor structure and improving the yield rate of the semiconductor structure.
  • the detection device 2 includes a detection unit 21 , and the detection unit 21 can rotate relative to the support rod 1 .
  • the detection unit 21 is used to detect the first distance information between the detection unit and the inner edge of the edge ring 10 .
  • the detection angle of the detection end of the detection unit 21 can be adjusted, so as to facilitate subsequent direct acquisition of detection data of the corresponding detection unit 21 (ie, the first distance information).
  • the detection angle of the detection unit 21 can also be adjusted correspondingly according to the different positions of the mounting holes 210 on the functional device 20, for example, according to the card pinholes (i.e. The position of the mounting hole 210) adjusts the detection angle of the detection end of the detection unit accordingly, so as to facilitate the operation and use of the detection device 2 and save the detection period.
  • the detection unit 21 includes a laser ranging sensor.
  • a plurality of first distance information between the inner edge of the edge ring 10 and the outer edge of the functional device 20 are respectively detected by a plurality of laser ranging sensors.
  • Multiple relative distances between the outer edge of the functional device 20 and the inner edge of the edge ring 10 are deduced based on the multiple first distances, and then it is determined whether the position of the edge ring 10 needs to be corrected according to the multiple relative distance differences.
  • the electronic laser ranging sensor is used to effectively improve the accuracy of the detection results, reduce the detection error caused by manual measurement, and at the same time, avoid the manual measurement of semiconductor equipment. Particle pollution and other problems brought about in the process, so as to effectively ensure and improve the consistency and yield of the critical dimensions of the subsequent semiconductor structure.
  • the detection device 2 further includes a display unit 22 for displaying the first distance information.
  • the display unit 22 is communicatively connected with the detection unit 21 , and the display unit 22 is set on the support pole 1 .
  • the display unit 22 may include, but is not limited to, an electronic display screen, a tablet, a mobile phone or a computer monitor, and the like.
  • the display unit 22 adopts an electronic display screen. There is at least one electronic display screen. When the number of electronic display screens is one, multiple detection units 21 are all communicatively connected to the electronic display screen.
  • each support rod 1 is correspondingly provided with an electronic display screen, that is, the number of electronic display screens is consistent with the number of detection units 21 .
  • the electronic display screen can be arranged at any position on the support rod 1 , wherein, in order to facilitate the detection of the detection unit 21 , the electronic display screen can be arranged at a position above the detection unit 21 on the support rod 1 .
  • the length of the electronic display screen may be 30 mm, and the width may be 20 mm, so as to facilitate the detection by the detection unit 21 while reading the detection result.
  • the display unit 22 can read the detection results of each detection unit 21 more intuitively, improving the detection efficiency.
  • the angles formed between the plurality of support rods 1 and the functional device 20 are all the same. That is, a plurality of support rods 1 cooperate with the surface of the functional device 20 to form a regular pyramid structure. Wherein, the vertical line from the apex of the regular pyramid to the surface of the functional device 20 passes through the center of the functional device 20, so that the first distance information can be obtained quickly and accurately, and the subsequent relative spacing between the functional device 20 and the edge ring 10 is simplified. The calculation and derivation process improves the detection efficiency.
  • one end of the plurality of support rods 1 away from the functional device 20 has an intersection point P.
  • the end of the support rod 1 away from the functional device 20 is its upper end, and the upper ends of the plurality of support rods 1 can be fixed by connecting rods or fixing blocks, so as to ensure that the lengths of each support rod 1 above the functional device 20 are the same, Then, a plurality of laser ranging sensors are fixed on the same position on the plurality of support rods 1 one by one, and then the laser ranging sensors can be used to quickly detect the first distance information, and accurately determine the inner edge of the edge ring 10 and the functional device 20. The relative spacing between the outer edges of the ring 10 is used to determine whether the relative position of the edge ring 10 needs to be corrected.
  • the extension lines of the ends of the plurality of support rods 1 away from the functional device 20 have an intersection point P.
  • the upper ends of the plurality of support rods 1 can be fixedly connected through the fixed block.
  • the upper ends of the plurality of support rods 1 are inserted into the fixed block, and the lower ends of the plurality of support rods 1 are installed on the functional device 20 Inside the multiple mounting holes 210.
  • a plurality of support rods 1 are stably fixed between the functional device 20 and the fixed block, thereby improving the detection accuracy of the laser distance measuring sensor, and then improving the accuracy and efficiency of the detection results.
  • the projection pattern surrounded by the orthographic projections of the plurality of support rods 1 on the functional device 20 has a midpoint P1. That is, the orthographic projection of the intersecting positions of the plurality of support rods 1 coincides with the midpoint of the projection pattern, and the multiple support rods 1 of this structure are convenient to be installed on the functional device 20, and can ensure that the plurality of support rods 1 are in the distance measurement process. stability.
  • the laser ranging sensor can be arranged at a predetermined position below the staggered positions of the support rods, and then the laser ranging sensor can be used to quickly detect the first distance information and improve the accuracy of the detection result.
  • the intersection or midpoint in the above example is located on a vertical line passing through the center point of the functional device 20 . That is, the intersection point or the midpoint of the orthographic projection of the plurality of support rods 1 is located directly above the central point of the functional device 20 .
  • a plurality of support rods 1 cooperate with the top surface of the functional device 20 to form a regular pyramid structure, so as to facilitate subsequent rapid detection of a plurality of first distance information by the detection unit 21 . Then, use a plurality of first distance information to judge whether the placement position of the edge ring 10 needs to be corrected.
  • the regular pyramid structure has good stability, which can improve the accuracy of the detection result of the detection unit 21, improve the detection efficiency and detection accuracy, and then Ensure and improve the consistency and yield of critical dimensions of semiconductor structures.
  • the calibration device further includes a fixing member 4 .
  • the fixing member 4 is used for fixing one end of the plurality of support rods 1 away from the functional device 20 .
  • the upper ends of the plurality of support rods 1 are fixed by the fixing member 4, so as to improve the stability of the detection unit 21 during the detection process, thereby improving the accuracy of the detection results.
  • the fixing member 4 includes a fixing seat 41, and a plurality of insertion holes 42 are provided on the bottom surface of the fixing seat 41, wherein one ends (such as upper ends) of the plurality of support rods 1 are respectively Inserted in a plurality of socket holes 42 .
  • the insertion hole 42 may be obliquely provided on the fixing base 41 to facilitate the insertion of the support rod 1 .
  • the insertion hole on the fixing seat is used to facilitate the rapid assembly or disassembly of the support rod between the functional device and the fixing seat, improving the efficiency of installation and disassembly, thereby improving the detection efficiency and effectively improving the detection efficiency. unit stability.
  • the correction device further includes a locking member 5 .
  • a locking member 5 there are multiple locking pieces 5 , and the multiple locking pieces 5 correspond to the multiple support rods 1 one by one.
  • One end of the locking member 5 passes through the side wall of the fixing seat 41 and extends into the insertion hole 42 to fix the support rod 1 on the fixing seat 41, thereby improving the gap between the fixing seat 41 and the supporting rod 1. The stability of the connection.
  • the locking member 5 includes a locking bolt, and the locking bolt is screwed on the side wall of the fixing seat, wherein the side wall of the fixing seat is perpendicular to the bottom surface of the fixing seat.
  • the number of support rods 1 is at least three, for example, the number of support rods 1 may be three, four or more than four.
  • a regular triangular pyramid structure can be constructed.
  • three installation holes 210 can be arranged on the three vertices of an equilateral triangle, and the vertices of the regular triangular pyramid reach the surface of the functional device 20.
  • the vertical line passes through the center of the functional device 20 and the center of the equilateral triangle, so as to quickly obtain three first distance information through the detection device 2, and use the first distance information to judge whether the placement position of the edge ring 10 is correct.
  • the three support rods 1 can also be constructed into a triangular pyramid structure, and the perpendicular line from the apex of the triangular pyramid to the surface of the functional device 20 may not pass through the center of the functional device 20 .
  • information such as the inclination angle of each support rod 1, the length of the support rod 1, and the position height of the detection device 2 on the support rod 1, a plurality of first distance information, and judge whether the position of the edge ring 10 needs to be corrected according to the first distance information.
  • the number of support rods 1 When the number of support rods 1 is four or more, it can be constructed into a polygonal pyramid structure, such as a regular quadrangular pyramid, a regular hexagonal pyramid, and the like.
  • a perpendicular line passing through the apex of the regular pyramid passes through the center of the functional device 20 , or a perpendicular line passing through the apex of the polygonal pyramid structure does not pass through the center of the functional device 20 . Therefore, the calculation process of judging whether the position of the edge ring 10 needs to be corrected in this embodiment can refer to the calculation process of three support rods 1 .
  • a plurality of support rods 1 are constructed into a regular pyramid structure or a polygonal pyramid structure, and the similar triangle theorem, the Pythagorean theorem, etc. are used to quickly determine the first distance between the detection device 2 and the inner edge of the edge ring 10 Information is detected to improve detection efficiency and detection accuracy, thereby ensuring and improving the consistency and yield of critical dimensions of semiconductor structures.
  • an exemplary embodiment of the present disclosure provides a calibration method, which is applied to the above-mentioned calibration device.
  • the correction method of this embodiment includes:
  • S100 Acquire first distance information detected by each detection device, where the first distance information is used to characterize the distance between each detection device and the edge ring.
  • Step S200 Obtain second distance information of each support rod, the second distance information is used to characterize the geometric positional relationship between the two ends of the support rod and the functional device.
  • Step S300 According to the first distance information and the second distance information, determine the relative spacing between the functional device and the edge ring in the area where the support rod is located.
  • Step S400 Adjust the position of the edge ring according to the difference between the relative distances.
  • the detection device is used to obtain a plurality of first distance information, and then, according to the plurality of first distance information and the second distance information of each support rod, a plurality of relative distances between the functional device and the edge ring are determined , and then, according to the difference between the relative spacing brackets, it is determined whether the position of the edge ring needs to be adjusted.
  • the above calibration method is simple to operate, and can effectively ensure and improve the consistency and yield of critical dimensions of subsequent semiconductor structures.
  • this embodiment is a further description of step S100 above.
  • the first distance information a can be detected by the detection device 2 .
  • the detection device 2 includes a detection unit 21 and a display unit 22 , the detection unit 21 may be a laser ranging sensor, and the laser ranging sensor is connected to the display unit 22 in communication.
  • the laser distance measuring sensor is installed on the preset position of the support rod 1 first, and the angle of the detection end of the laser distance measuring sensor is adjusted.
  • the orthographic projection of the detection light emitted by the detection end of the laser ranging sensor on the functional device 20 and the orthographic projection of the support rod 1 on the functional device 20 are located on the same straight line, which means that the detection angle of the laser ranging sensor is adjusted.
  • the laser ranging sensor is turned on, and the detection light is emitted by the laser ranging sensor. After the detection light touches the inner edge of the edge ring 10, part of the detection light is reflected back to the laser ranging sensor, thereby quickly detecting the first distance information. a.
  • the first distance information a is digitally displayed by the display unit 22 .
  • the orthographic projection of the detection light emitted by the detection end of the laser ranging sensor on the functional device 20 and the orthographic projection of the support rod 1 on the functional device 20 are located on the same straight line, which can simplify the subsequent edge ring 10.
  • the orthographic projection of the detection light emitted by the laser ranging sensor on the functional device 20 and the orthographic projection of the support rod 1 on the functional device 20 may not be located on the same straight line.
  • the relative distance between the edge ring 10 and the functional device 20 can also be calculated by deflecting the detecting ends of the multiple laser distance measuring sensors in the same direction and by the same angle.
  • the detection ends of multiple laser distance measuring sensors can be deflected by the same angle clockwise or counterclockwise.
  • the distance between the edge ring 10 and the functional device 20 can also be calculated by using the similar triangle theorem and the Pythagorean theorem. relative spacing.
  • this embodiment is a further description of step S200 above.
  • the second distance information is used to characterize the geometric positional relationship between the two ends of the support rod 1 and the functional device 20 , where the distance information of each support rod 1 is obtained.
  • the process of the second distance information is as follows:
  • the first length b is obtained, and the first length b is used to characterize the distance between the detection device 2 and the installation hole 210 on the functional device 20 , wherein the first length b can be obtained by direct measurement.
  • both ends of the support rod 1 are respectively installed in the mounting hole 210 and the insertion hole of the fixing seat.
  • the length of the support rod 1 between the mounting hole 210 and the bottom surface of the fixing seat is S
  • the first length b since the position of the mounting hole 210 is preset, the first length b may also be pre-stored in the controller through pre-storage, and the first length b may be called directly when needed.
  • the inclination angle A of the support rod 1 is obtained, and the inclination angle A is used to characterize the acute angle between the support rod 1 and the functional device 20 .
  • the acute angle can be quickly measured by an angle measuring instrument, or the acute angle can be determined according to the specification of the functional device 20 .
  • the specifications of the functional device 20 are determined, and then the third length d is determined.
  • the third length d is used to represent the distance from the mounting hole 210 on the functional device 20 to the center of the functional device 20 .
  • the length S of the support rod 1 can be set to twice the third length d, and when the orthographic projection of the top of the support rod 1 on the functional device 20 coincides with the center of the functional device 20, the tilt Angle A is 60 degrees.
  • the second length e is acquired, and the second length e is used to characterize the distance between the mounting hole 210 and the edge of the functional device 20 .
  • the actual value of the second length e can be known after the use specification of the functional device 20 is determined.
  • the second distance information includes a first length b, an inclination angle A, a second length e, and a third length d.
  • the second length e and the third length d can be obtained directly by using the specifications of the functional device, and the inclination angle A can be directly obtained by using a measuring tool such as an angle measuring instrument, and the length of the support rod 1 can be calculated and processed Prepared. Therefore, the acquisition rate of the second distance information is effectively improved, and then the efficiency of subsequent edge ring position correction is improved.
  • this embodiment is a further description of step S300 above.
  • the relative spacing L between the functional device 20 and the edge ring 10 in the area where the support rod 1 is located is determined.
  • the specific calculation process of the relative distance L may adopt the following method:
  • the first distance information a is detected and acquired by using a laser ranging sensor.
  • the first step through the length S of the support rod 1 and the third length d, the first vertical height H1 can be determined by using the Pythagorean theorem, and the first vertical height H1 is used to characterize the distance between the top of the support rod 1 and the functional device 20 The vertical distance; or, the first vertical height H1 is used to characterize the vertical distance between the intersection points of the plurality of support rods 1 and the functional device 20 .
  • the second step through the first vertical height H1 and the first length b, use the similar triangle theorem and the Pythagorean theorem to determine the fourth length f and the second vertical height H2, wherein the fourth length f is used to characterize the detection unit 21 in The linear distance between the orthographic projection on the functional device 20 and the installation hole 210 , the second vertical height H2 is used to represent the vertical distance between the height of the detection unit 21 and the functional device 20 .
  • Step 3 Using the first distance information a, the second vertical height H2, and using the Pythagorean theorem, determine the fifth length g, which is used to represent the orthographic projection of the detection unit 21 on the functional device 20 and the edge ring 10 The distance between the inner edges of .
  • the relative distance L is determined. That is, the fourth length f and the second length e are directly subtracted from the fifth length g, and the remaining value is the relative distance L.
  • the specific calculation process of the relative distance L may also adopt the following method:
  • the fourth length f and the second vertical height H2 are determined by using the law of sine or the law of cosines, wherein the fourth length f is used to characterize the positive position of the detection unit 21 on the functional device 20
  • the linear distance between the projection and the installation hole 210 , the second vertical height H2 is used to represent the vertical distance between the height of the detection unit 21 and the functional device 20 .
  • the fifth length g is determined, and the fifth length g is used to characterize the orthographic projection of the detection unit 21 on the functional device 20 and the interior of the edge ring 10 the distance between the edges,
  • the relative distance L is determined. That is, the fourth length f and the second length e are directly subtracted from the fifth length g, and the remaining value is the relative distance L.
  • this embodiment is a further description of step S400 above.
  • the position of the edge ring 10 is adjusted when the difference between any two relative distances L exceeds a preset threshold range.
  • the preset threshold range may be 0 mm ⁇ 0.05 mm.
  • three support rods 1 are evenly distributed on the functional device 20 . Therefore, during the position calibration process of the edge ring 10, using the laser ranging sensor and implementing the above calibration method, three relative distances L can be determined, namely the relative distance L1, the relative distance L2 and the relative distance L3.
  • multiple relative distances L between the edge ring 10 and the functional device 20 are deduced according to the first distance information a and the second distance information, and the difference between any two relative distances L and the preset Threshold range is compared, when the difference exceeds the preset threshold range, then the position of the edge ring 10 needs to be corrected, when the difference is within the preset threshold range, it means that the position of the edge ring 10 has been corrected, at this time No adjustments to the position of the edge ring 10 are required.
  • the above method is simple to operate, and the use of an electronic laser ranging sensor can effectively improve the accuracy of the detection results, reduce the detection error caused by manual measurement, and at the same time avoid the semiconductor equipment in the manual measurement process. Particle pollution caused by the particles, so as to effectively ensure and improve the consistency and yield of the critical dimensions of the subsequent semiconductor structure.
  • the detection device on each support rod is used for detection, and the first distance information between the detection device and the edge ring is obtained, and then completed through a plurality of first distance information.
  • the position correction of the edge ring effectively improves the measurement accuracy, thereby ensuring the consistency of the critical dimensions of the semiconductor structure, and effectively improving the yield rate of the semiconductor structure.

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Abstract

本公开公布了一种校正装置及校正方法，涉及半导体技术领域。该校正装置用于校正半导体设备的边缘环与功能器件之间的相对位置，校正装置包括：支撑杆、检测装置和控制器，多个支撑杆的一端相对固定，另一端分别安装在功能器件的多个安装孔中，支撑杆倾斜设置；多个检测装置一一对应置设在多个支撑杆上，检测装置用于检测检测装置与边缘环之间的第一距离信息；控制器分别与多个检测装置电连接。

Description

校正装置及校正方法
本公开基于申请号为202210047504.3，申请日为2022年01月17日，申请名称为“校正装置及校正方法”的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本公开作为参考。
技术领域
本公开涉及但不限于一种校正装置及校正方法。
背景技术
在半导体结构的制程工艺中，需要对不同制程中的半导体结构进行刻蚀。刻蚀技术可以分为湿法刻蚀和干法刻蚀，且刻蚀技术是半导体制造工艺、微电子制造工艺以及微纳米级制造工艺中的重要步骤。
而在对半导体结构进行刻蚀过程中，需要对边缘环和静电卡盘之间的相对间距进行校正调整。
其中，对边缘环的校正调整方式包括通过目测方式放置边缘环，并利用游标卡尺等对边缘环的边缘与静电卡盘的边缘之间的相对间距进行测量，从而对边缘环的位置进行校正调整。
但上述边缘环的相对位置的校正调整的方式存在测量误差，从而使得后续半导体结构的关键尺寸不易控制，进而降低了半导体结构的性能和良率。
发明内容
以下是对本公开详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开提供一种校正装置及校正方法。
本公开实施例的第一方面提供了一种校正装置，用于校正半导体设备的边缘环与功能器件之间的相对位置，所述校正装置包括：多个支撑杆，所 述多个支撑杆的一端的位置相对固定，所述多个支撑杆的另一端分别安装在所述功能器件的多个安装孔中，所述支撑杆相对所述功能器件倾斜设置；
多个检测装置，所述检测装置设置于所述支撑杆上，所述检测装置与所述支撑杆一一对应设置，所述检测装置用于检测所述检测装置与所述边缘环之间的第一距离信息；
控制器，分别与所述多个检测装置电连接。
根据本公开的一些实施例，所述检测装置包括检测单元，所述检测单元能够相对所述支撑杆转动，所述检测单元用于检测所述检测单元与所述边缘环之间的第一距离信息。
根据本公开的一些实施例，所述检测单元包括激光测距传感器。
根据本公开的一些实施例，所述检测装置还包括显示单元，所述显示单元与所述检测单元通信连接；
所述显示单元用于显示所述第一距离信息。
根据本公开的一些实施例，所述多个支撑杆与所述功能器件之间形成的夹角均相同。
根据本公开的一些实施例，所述多个支撑杆的远离所述功能器件的一端具有交点；或者，
所述多个支撑杆的远离所述功能器件的一端的延伸线具有交点；或者，
所述多个支撑杆位于所述功能器件上的正投影具有中点。
根据本公开的一些实施例，所述交点或中点位于经过所述功能器件的中心点的垂线上。
根据本公开的一些实施例，所述校正装置还包括固定件，所述固定件用于固定多个所述支撑杆的远离所述功能器件的一端。
根据本公开的一些实施例，所述固定件包括固定座，所述固定座上设有多个插接孔，其中，所述多个支撑杆的一端分别插接于多个所述插接孔内。
根据本公开的一些实施例，所述校正装置还包括多个锁紧件，所述支撑杆通过所述锁紧件固定于所述固定座上。
根据本公开的一些实施例，所述支撑杆的个数至少为三个。
本公开的第二方面提供了一种校正方法，应用于如上所述的校正装置， 所述校正方法包括：
获取各所述检测装置检测到的第一距离信息，所述第一距离信息用于表征各所述检测装置到所述边缘环之间的距离；
获取每个支撑杆的第二距离信息，所述第二距离信息用于表征所述支撑杆的两个端部与功能器件之间的几何位置关系；
根据所述第一距离信息和所述第二距离信息，确定所述支撑杆所在区域内所述功能器件与所述边缘环之间的相对间距；
根据各所述相对间距之间的差值，对所述边缘环的位置进行调整。
根据本公开的一些实施例，所述根据各所述相对间距之间的差值，对所述边缘环的位置进行调整，包括：
当所述差值超出预设阈值范围时，调整所述边缘环的位置。
根据本公开的一些实施例，所述获取每个支撑杆的第二距离信息，所述第二距离信息用于表征所述支撑杆的两个端部与功能器件之间的几何位置关系，包括：
获取第一长度，所述第一长度用于表征所述检测装置与所述功能器件上的安装孔之间的距离；
获取所述支撑杆的倾斜角度，所述倾斜角度用于表征所述支撑杆与所述功能器件之间的锐角；
获取第二长度，所述第二长度用于表征所述安装孔与所述功能器件边缘的距离。
根据本公开的一些实施例，所述根据所述第一距离信息和所述第二距离信息，确定所述支撑杆所在区域内所述功能器件与所述边缘环之间的相对间距，包括：
根据所述第一距离信息、所述第一长度、所述倾斜角度、所述第二长度，确定所述相对间距。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
并入到说明书中并且构成说明书的一部分的附图示出了本公开的实 施例，并且与描述一起用于解释本公开实施例的原理。在这些附图中，类似的附图标记用于表示类似的要素。下面描述中的附图是本公开的一些实施例，而不是全部实施例。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，可以根据这些附图获得其他的附图。
图1是根据一示例性实施例示出的校正装置的示意图。
图2是根据一示例性实施例示出的校正装置的固定件的示意图。
图3是根据一示例性实施例示出的边缘环放偏的示意图。
图4是根据一示例性实施例示出的边缘环位置放正的示意图。
图5是根据一示例性实施例示出的确定相对间距的示意图。
图6是根据一示例性实施例示出的校正方法的流程图。
附图标记：
1、支撑杆；2、检测装置；
3、控制器；4、固定件；
5、锁紧件；10、边缘环；
20、功能器件；21、检测单元；
22、显示单元；41、固定座；
42、插接孔；210、安装孔；
a、第一距离信息；b、第一长度；
d、第三长度；e、第二长度；
f、第四长度；g、第五长度；
A、倾斜角度；H1、第一垂直高度；
H2、第二垂直高度；L、相对间距；
P、交点；P1、中点；
S、支撑杆的长度。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例中的附图，对公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本 公开中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。需要说明的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。
在半导体结构的制程工艺中，需要对不同制程中的半导体结构进行刻蚀。刻蚀技术可以分为湿法刻蚀和干法刻蚀，且刻蚀技术是半导体制造工艺、微电子制造工艺以及微纳米级制造工艺中的重要步骤。
而在对半导体结构进行刻蚀过程中，需要对边缘环与静电卡盘之间的相对间距进行校正调整。
其中，对边缘环的校正调整方式包括通过目测方式放置边缘环，并利用游标卡尺等对边缘环的边缘和静电卡盘的边缘之间的相对间距进行测量，从而对边缘环的位置进行校正调整。
其中，用于半导体结构制造的机台在进行清理工序之后，放置边缘环时，先将边缘环放置在静电卡盘的边缘。而后，利用游标卡尺对边缘环的边缘与静电卡盘的边缘之间的相对间距进行测量。选取几个位置分别进行测量，当上述几个位置的相对间隙均为预定数值时，比如几个位置的相对间隙的测量结果均为0.125mm时，则代表边缘环位置已放正。
但上述边缘环的相对位置的校正调整的方式存在测量误差，从而使得后续半导体结构的关键尺寸不易控制，进而降低了半导体结构的性能和良率。
为了解决上述技术问题之一，本公开示例性的实施例提供了一种校正装置。如图1所示，图1示出了根据一示例性的实施例提供的校正装置的示意图，下面结合图1至图5对校正装置进行介绍。
如图1至图4所示，本公开一示例性的实施例提供了一种校正装置，该校正装置用于校正半导体设备的边缘环10与功能器件20之间的相对位置。其中，功能器件20包括静电卡盘，需要说明的是，功能器件20还可以是半导体设备中的其他结构，在此不做具体限定。其中，校正装置包括多个支撑杆1、多个检测装置2和控制器3。
参照图1至图4所示，在一些实施例中，支撑杆1的个数为多个。多个支撑杆1中的任意一个支撑杆1的一端的位置相对固定，其中，支撑杆 1相对固定的一端可以是支撑杆1的上端或者下端。在本实施例中，支撑杆1的上端固定。多个支撑杆1的另一端分别安装在功能器件20(比如静电卡盘)的多个安装孔210中，安装孔210的个数与支撑杆1的个数相同。同时，每个支撑杆1相对于功能器件20的顶面倾斜设置。
在一些实施例中，多个支撑杆1中的每一个支撑杆1的上端均固定连接。固定连接的方式可以是任意两个支撑杆1的上端固定搭接，或者多个支撑杆1的上端通过固定件进行固定连接，从而形成一种支撑架的结构形式，其中，固定件可以包括固定块或者连接杆等。
如图1至图4所示，多个检测装置2一一对应设置在多个支撑杆1上，支撑杆1倾斜设置。其中，检测装置2可以设置在支撑杆1的任意位置处。检测装置2用于检测每个支撑杆1上的检测装置2的检测端与边缘环10的边缘之间的第一距离信息。在此需要说明的是，本实施例中涉及到的边缘环10的边缘是指边缘环10的内边缘，在其他实施例中，也可以将检测装置2的检测端与边缘环10的内边缘之间的距离作为第一距离信息。
在一些实施例中，为了便于后续快速获取第一距离信息，并且方便安装定位，可以将检测装置2设置在支撑杆1的有效长度的二分之一位置。需要说明的是，支撑杆1的有效长度用于表征功能器件20的表面到支撑杆1的顶端固定位置处之间的长度。该实施例中将检测装置2设置在支撑杆1的有效长度的二分之一位置处，并且支撑杆1为倾斜设置，由此，支撑杆1、支撑杆1与功能器件20之间的垂直距离以及功能器件20的表面等相互连接成三角形或直角三角形，从而可以根据相似三角形定理、勾股定理等快速获取第一信息，节省边缘环10的校正时间，并提高校正效率，从而提高半导体结构的产能。
参照图1所示，在一些实施例中，该校正装置还包括控制器3，控制器3与多个检测装置2电连接。其中，控制器3可以包括可编程逻辑控制器(Programmable Logic Controller，PLC)，可编程逻辑控制器采用一种可编程的存储器，在其内部存储执行逻辑运算、顺序控制、定时、计数和算术运算等操作的指令，通过数字式或模拟式的输入输出来控制各种类 型的机械设备或生产过程。或者，控制器3还可以包括单片机等。
本实施例中，在每个支撑杆上设置一个检测装置，利用检测装置，精确获取该检测装置与边缘环相对应的边缘位置的第一距离信息，而后通过多个第一距离信息的对比，对边缘环的相对位置进行校正，有效提高了测量精度，进而保证半导体结构关键尺寸的一致性，并提高半导体结构的良率。
如图1所示，在一些实施例中，检测装置2包括检测单元21，检测单元21能够相对支撑杆1转动。其中，检测单元21用于检测该检测单元与边缘环10的内边缘之间的第一距离信息。
在本实施例中，通过检测单元21的相对转动，可以调整检测单元21的检测端的检测角度，从而便于后续直接获取相对应的检测单元21的检测数据(即第一距离信息)。
另一方面，也可以根据功能器件20上安装孔210的不同位置，相应的调整检测单元21的检测角度，比如，根据不同尺寸的静电卡盘(即功能器件20)中的卡针孔(即安装孔210)的位置相应的调整检测单元的检测端的检测角度，以便于检测装置2的操作使用，节省检测周期。
如图1所示，在一些实施例中，检测单元21包括激光测距传感器。其中，待激光测距传感器的检测端的检测角度调整完成后，利用多个激光测距传感器分别检测边缘环10的内边缘与功能器件20外边缘的之间的多个第一距离信息。基于多个第一距离推导出功能器件20的外边缘与边缘环10的内边缘之间的多个相对间距，而后再根据多个相对间距差值判断边缘环10的位置是否需要校正。由此，在本实施例中，利用电子式的激光测距传感器，有效提高检测结果的准确性，降低了因采用手动测量所带来的检测误差，同时，也能避免半导体设备在手动测量过程中所带来的颗粒污染等问题，从而有效保证并提高后续半导体结构的关键尺寸的一致性和良率。
如图1所示，在一些实施例中，检测装置2还包括用于显示第一距离信息的显示单元22，显示单元22与检测单元21通信连接，显示单元22设置支撑杆1上。其中，显示单元22可以包括但不限于电子显示屏、平板、手机或电脑显示器等。
需要说明的是，在一个示例中，显示单元22采用电子显示屏。电子显示屏的个数至少为一个。当电子显示屏的个数为一个时，多个检测单元21均与该电子显示屏通信连接。
或者，每个支撑杆1上均对应设置有一个电子显示屏，即，电子显示屏的个数与检测单元21的个数相一致。电子显示屏可以设在支撑杆1上的任意位置处，其中，为了便于检测单元21的检测，电子显示屏可以设在支撑杆1上的检测单元21的上方位置。在一些实施例中，电子显示屏的长度可以为30mm，宽度可以为20mm，从而在方便读取检测结果的同时，便于检测单元21的检测。
本实施例中，显示单元22可以更加直观的读取每个检测单元21的检测结果，提高检测效率。
如图1所示，在一些实施例中，多个支撑杆1与功能器件20之间形成的夹角均相同。即，多个支撑杆1配合功能器件20的表面，形成一个正棱锥结构。其中，该正棱锥的顶点到功能器件20的表面的垂线经过功能器件20的中心，从而能够快速且准确的获取第一距离信息，简化后续对功能器件20与边缘环10之间的相对间距的计算推导过程，提高检测效率。
如图1至图5所示，在一些实施例中，多个支撑杆1的远离功能器件20的一端具有交点P。其中，支撑杆1远离功能器件20的一端为其上端，多个支撑杆1的上端可以通过连接杆或者固定块进行固定，从而保证位于功能器件20上方的每个支撑杆1的长度均相同，而后，将多个激光测距传感器一一对应固定在多个支撑杆1上相同的位置，进而可利用激光测距传感器快速检测第一距离信息，精确确定边缘环10的内边缘与功能器件20的外边缘之间的相对间距，以判断边缘环10的相对位置是否需要校正。
或者，多个支撑杆1的远离功能器件20的一端的延伸线具有交点P。即，多个支撑杆1的上端可以通过固定块进行固定连接，在一个示例中，多个支撑杆1的上端均插接于固定块中，而多个支撑杆1的下端安装于功能器件20的多个安装孔210内。由此，多个支撑杆1稳定的固定在功能 器件20和固定块之间，从而提高激光测距传感器的检测精度，继而提高检测结果的精准度和效率。
又或者，多个支撑杆1位于功能器件20上的正投影围成的投影图案具有中点P1。即，多个支撑杆1的交叉位置的正投影与投影图案的中点重合，该结构的多个支撑杆1便于安装在功能器件20上，并且可以保证多个支撑杆1在测距过程中的稳定性。其中，激光测距传感器可以设置在支撑杆交错位置处的下方的预定位置处，进而利用激光测距传感器快速检测第一距离信息，并提高检测结果的准确性。
如图5所示，在一些实施例中，上述示例中的交点或中点位于经过功能器件20的中心点的垂线上。即，多个支撑杆1的交点或正投影的中点位于功能器件20中心点的正上方。多个支撑杆1配合功能器件20的顶面构建成一个正棱锥结构，从而便于后续通过检测单元21快速检测多个第一距离信息。而后，利用多个第一距离信息判断边缘环10的放置位置是否需要校正，同时，正棱锥结构具有良好的稳定性，能提高检测单元21检测结果的精准性，提高检测效率和检测精度，进而保证并提高半导体结构的关键尺寸的一致性和良率。
如图1和图2所示，在一些实施例中，校正装置还包括固定件4。固定件4用于固定多个支撑杆1的远离功能器件20的一端。本实施例中，利用固定件4将多个支撑杆1的上端进行固定，从而提高检测单元21在检测过程中的稳定性，继而提高检测结果的精准度。
如图2所示，在一些实施例中，固定件4包括固定座41，在固定座41的底面上设有多个插接孔42，其中，多个支撑杆1的一端(比如上端)分别插接于多个插接孔42中。需要说明的是，插接孔42可以是倾斜设置在固定座41上的，以便于支撑杆1的插接。本实施例中，利用固定座上的插接孔，便于支撑杆在功能器件和固定座之间进行快速组装或拆卸，提高安装和拆卸效率，从而在提高检测效率的同时，也能有效提高检测单元的稳定性。
需要说明的是，在一些实施例中，校正装置还包括锁紧件5。其中，锁紧件5的个数为多个，多个锁紧件5与多个支撑杆1一一对应。锁紧件 5的一端穿过固定座41的一侧壁后，并伸入至插接孔42内，以将支撑杆1固定在固定座41上，从而提高固定座41与支撑杆1之间连接的稳定性。
在一个示例中，锁紧件5包括锁紧螺栓，锁紧螺栓螺纹连接在固定座的侧壁上，其中，该固定座的侧壁与固定座的底面相互垂直。
如图1所示，在一些实施例中，支撑杆1的个数至少为三个，比如，支撑杆1的个数可以是三个、四个或四个以上。
当支撑杆1的个数为三个时可以构建成一个正三棱锥结构，相应的，三个安装孔210可以设置在等边三角形的三个顶点上，该正三棱锥的顶点到功能器件20的表面的垂线经过功能器件20的中心以及等边三角形的中心，以便于后续通过检测装置2快速获取三个第一距离信息，并利用第一距离信息判断边缘环10的放置位置是否正确。
需要说明的是，在一些实施例中，三个支撑杆1也可以构建成一个三棱锥结构，该三棱锥的顶点到功能器件20的表面的垂线可以不经过功能器件20的中心。由此，根据每个支撑杆1的倾斜角度、支撑杆1的长度、以及检测装置2在支撑杆1上的位置高度等信息，利用勾股定理和相似三角形定理等也可以获取多个第一距离信息，并通过第一距离信息来判断边缘环10的位置是否需要校正。
当支撑杆1的个数为四个及以上时，可以构建成多棱锥结构，比如正四棱锥、正六棱锥等。经过该正棱锥顶点的垂线经过功能器件20的中心，或者经过多棱锥结构的顶点的垂线不经过功能器件20的中心。由此，该实施例中判断边缘环10的位置是否需要校正的计算过程可以参考个数为三个的支撑杆1的计算过程。
需要说明的是，上述利用多个支撑杆1和多个检测装置2计算并判断边缘环10的位置是否需要校正的过程在下述校正方法中进行介绍。
在本实施例中，通过多个支撑杆1构建成正棱锥结构或多棱锥结构，利用相似三角形定理、勾股定理等，从而快速对检测装置2与边缘环10的内边缘之间的第一距离信息进行检测，提高检测效率和检测精度，进而保证并提高半导体结构的关键尺寸的一致性和良率。
如图6所示，本公开一示例性的实施例提供了一种校正方法，该校正方法应用于上述的校正装置。其中，本实施例的校正方法包括：
S100：获取各检测装置检测到的第一距离信息，第一距离信息用于表征各检测装置到边缘环之间的距离。
步骤S200：获取每个支撑杆的第二距离信息，第二距离信息用于表征支撑杆的两个端部与功能器件之间的几何位置关系。
步骤S300：根据第一距离信息和第二距离信息，确定支撑杆所在区域内功能器件与边缘环之间的相对间距。
步骤S400：根据各相对间距之间的差值，对边缘环的位置进行调整。
本实施例中，利用检测装置获取多个第一距离信息，而后，根据多个第一距离信息以及每个支撑杆的第二距离信息，从而确定功能器件与边缘环之间的多个相对间距，然后，根据各相对间距支架之间的差值，确定是否需要对边缘环的位置进行调整。上述校正方法操作简单，能有效保证并提高后续半导体结构的关键尺寸的一致性和良率。
根据一个示例性实施例，本实施例是对上文中步骤S100的进一步说明。
参照图4所示，在一些实施例中，可以通过检测装置2检测第一距离信息a。而检测装置2包括检测单元21和显示单元22，检测单元21可以采用激光测距传感器，激光测距传感器与显示单元22通讯连接。
在获取第一距离信息a的过程中，先将激光测距传感器安装在支撑杆1的预设位置上，并调整好激光测距传感器的检测端的角度。其中，激光测距传感器的检测端发射出的检测光线在功能器件20上的正投影与支撑杆1在功能器件20上的正投影位于同一条直线上，即表示激光测距传感器的检测角度调整完成。而后，开启激光测距传感器，由激光测距传感器发射出检测光线，检测光线碰触到边缘环10的内边缘后，部分检测光线反射回激光测距传感器中，从而快速检测出第一距离信息a。最后，由显示单元22数显第一距离信息a。
该实施例中，使激光测距传感器的检测端发射出的检测光线在功能器件20上的正投影与支撑杆1在功能器件20上的正投影位于同一条直线上，可 以简化后续边缘环10与功能器件20之间的相对间距的计算过程，从而提高检测效率。
需要说明的是，在另一些实施例中，激光测距传感器发射的检测光线在功能器件20上的正投影与支撑杆1在功能器件20上的正投影也可以并非位于同一条直线上。在该实施例中，只要将多个激光测距传感器的检测端沿同一方向偏转并且转动相同的角度也可以计算出边缘环10与功能器件20之间的相对间距。比如，多个激光测距传感器的检测端均沿顺时针或沿逆时针偏转相同角度即可，然后，利用相似三角形定理、勾股定理等也可以计算出边缘环10与功能器件20之间的相对间距。
根据一个示例性实施例，本实施例是对上文中步骤S200的进一步说明。
如图3和图4所示，在一些实施例中，第二距离信息用于表征支撑杆1的两个端部与功能器件20之间的几何位置关系，其中，获取每个支撑杆1的第二距离信息的过程如下：
获取第一长度b，第一长度b用于表征检测装置2与功能器件20上的安装孔210之间的距离，其中，第一长度b可以直接测量获得。在一些实施例中，支撑杆1的两端分别安装在安装孔210以及固定座的插接孔中，此时，安装孔210与固定座底面之间的支撑杆1的长度为S，检测装置2安装在支撑杆1的任意位置处，比如，第一长度b与支撑杆1的长度S的比例关系为b：S＝1：(2～5)。在另一些实施例中，由于安装孔210的位置是预先设置好的，因此，也可以通过预存方式，将第一长度b预存在控制器中，当需要使用时，直接调用第一长度b。
获取支撑杆1的倾斜角度A，倾斜角度A用于表征支撑杆1与功能器件20之间的锐角。其中，可以通过角度测量仪等对该锐角进行快速测量，或者，可以根据功能器件20的规格来确定该锐角。比如，根据半导体结构的制程工艺需要，确定功能器件20的规格，进而确定第三长度d，第三长度d用于表征功能器件20上安装孔210到功能器件20的中心的距离。在一个示例中，可以将支撑杆1的长度S设定为第三长度d的两倍，待支撑杆1的顶端在功能器件20上的正投影与功能器件20的中心重 合时，此时倾斜角度A即为60度。
获取第二长度e，第二长度e用于表征安装孔210与功能器件20边缘的距离。其中，待确定了功能器件20的使用规格之后，即可获知第二长度e的实际数值。
需要说明的是，第二距离信息包括第一长度b、倾斜角度A、第二长度e、第三长度d。在本实施例中，利用功能器件的规格可以直接获取第二长度e和第三长度d，利用测量工具比如角度测量仪可以直接获取倾斜角度A，而支撑杆1的长度可以在计算后并加工制备而成。从而有效提高第二距离信息的获取速率，继而提高后续边缘环位置校正的效率。
根据一个示例性实施例，本实施例是对上文中步骤S300的进一步说明。
参照图3和图4所示，根据第一距离信息a和第二距离信息，确定支撑杆1所在区域内功能器件20与边缘环10之间的相对间距L。
其中，在确定相对间距L的过程中，需要利用第一距离信息a、第一长度b、支撑杆1长度S、倾斜角度A和第二长度e的参数按照预设规则进行计算。
在一个示例中，相对间距L的具体计算过程可以采用以下方法：
首先，利用激光测距传感器检测并获取第一距离信息a。
而后，根据所使用的功能器件20的规格确定第二长度e和第三长度d；直接测量并获取支撑杆1长度S，并根据激光测距传感器的安装位置经过测量或推导确定第一长度b。
然后，第一步：通过支撑杆1长度S、第三长度d，利用勾股定理可以确定第一垂直高度H1，第一垂直高度H1用于表征支撑杆1的顶端与功能器件20之间的垂直距离；或者，第一垂直高度H1用于表征多个支撑杆1的交点与功能器件20之间的垂直距离。
第二步：通过第一垂直高度H1和第一长度b，利用相似三角形定理和勾股定理，确定第四长度f和第二垂直高度H2，其中，第四长度f用于表征检测单元21在功能器件20上的正投影与安装孔210之间的直线距离，第二垂直高度H2用于表征检测单元21所处位置高度与功能器件20 之间的垂直距离。
第三步：通过第一距离信息a、第二垂直高度H2，利用勾股定理，确定第五长度g，第五长度g用于表征检测单元21在功能器件20上的正投影与边缘环10的内边缘之间的距离。
最后，利用第五长度g、第四长度f和第二长度e，确定相对间距L。即，通过第五长度g直接减去第四长度f和第二长度e，剩余的值即为相对间距L。
在另一个示例中，相对间距L的具体计算过程还可以采用以下方法：
首先，根据所使用的功能器件20的规格确定第二长度e；直接测量并获取支撑杆1长度S，并根据激光测距传感器的安装位置经过测量或推导确定第一长度b；利用测量工具获取倾斜角度A；利用激光测距传感器检测并获取第一距离信息a。
而后，通过倾斜角度A和第一长度b，利用正弦定理或余弦定理，确定第四长度f和第二垂直高度H2，其中，第四长度f用于表征检测单元21在功能器件20上的正投影与安装孔210之间的直线距离，第二垂直高度H2用于表征检测单元21所处位置高度与功能器件20之间的垂直距离。
然后，通过第一距离信息a、第二垂直高度H2，利用勾股定理，确定第五长度g，第五长度g用于表征检测单元21在功能器件20上的正投影与边缘环10的内边缘之间的距离，
最后，利用第五长度g、第四长度f和第二长度e，确定相对间距L。即，通过第五长度g直接减去第四长度f和第二长度e，剩余的值即为相对间距L。
在上述实施例中，通过获取上述几何位置关系的相关参数后，以便于后续依据上述参数和第一距离信息a，并利用预设规则比如相似三角形定理、勾股定理和正余弦定理，可以精确计算出边缘环的内边缘与功能器件的外边缘之间的相对间距，进而通过多个相对间距之间的差值，判断边缘环10的位置是否需要校正。
根据一个示例性实施例，本实施例是对上文中步骤S400的进一步说明。
参照图2和图3所示，在一些实施例中，根据多个相对间距L之间的差值，对边缘环10的位置进行调整的过程中，可以采用以下方法：
待确定多个相对间距L之后，其中任意两个相对间距L的差值超过预设阈值范围时，调整边缘环10的位置。需要说明的是，该预设阈值范围可以是0mm～0.05mm。
其中，一个示例中，功能器件20上均匀分布有三个支撑杆1。因此，在边缘环10的位置校正过程中，利用激光测距传感器和上述校正方法的实施，可以确定三个相对间距L，即相对间距L1、相对间距L2和相对间距L3。
进而，确定相对间距L1与相对间距L2的差值、相对间距L2与相对间距L3的差值、以及相对间距L1与相对间距L3的差值，其中，当上述三个差值均在0.05mm以内时，则表示边缘环10的位置已放正。
但当相对间距L1和相对间距L2的差值大于0.05mm；或者，相对间距L1和相对间距L3的差值大于0.05mm；又或者，相对间距L2和相对间距L3的差值大于0.05mm时，则表示边缘环10的位置没有放正，需要对边缘环10的位置进行校正。
在本实施例中，根据第一距离信息a和第二距离信息，从而推导出边缘环10和功能器件20之间的多个相对间距L，将任意两个相对间距L的差值与预设阈值范围进行比较，当差值超出预设阈值范围时，则需要对边缘环10的位置进行校正，当差值在预设阈值范围内时，则表示边缘环10的位置已放正，此时不需要对边缘环10的位置进行调整。上述方法操作简单，并且利用电子式的激光测距传感器，能有效提高检测结果的准确性，降低了因采用手动测量所带来的检测误差，同时，也能避免半导体设备在手动测量过程中所带来的的颗粒污染等，从而有效保证并提高后续半导体结构的关键尺寸的一致性和良率。
本说明书中各实施例或实施方式采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分相互参 见即可。
在本说明书的描述中，参考术语“实施例”、“示例性的实施例”、“一些实施方式”、“示意性实施方式”、“示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。
在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
在本公开的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
可以理解的是，本公开所使用的术语“第一”、“第二”等可在本公开中用于描述各种结构，但这些结构不受这些术语的限制。这些术语仅用于将第一个结构与另一个结构区分。
在一个或多个附图中，相同的元件采用类似的附图标记来表示。为了清楚起见，附图中的多个部分没有按比例绘制。此外，可能未示出某些公知的部分。为了简明起见，可以在一幅图中描述经过数个步骤后获得的结构。在下文中描述了本公开的许多特定的细节，例如器件的结构、材料、尺寸、处理工艺和技术，以便更清楚地理解本公开。但正如本领域技术人员能够理解的那样，可以不按照这些特定的细节来实现本公开。
最后应说明的是：以上各实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
工业实用性
本公开实施例多提供的校正装置和校正方法中，通过每个支撑杆上的检测装置进行检测，获取该检测装置与边缘环之间的第一距离信息，而后通过多个第一距离信息完成对边缘环的位置校正，有效提高了测量精度，进而保证半导体结构关键尺寸的一致性，有效提高半导体结构的良率。

Claims (15)

  1. 一种校正装置，用于校正半导体设备的边缘环与功能器件之间的相对位置，所述校正装置包括：多个支撑杆，所述多个支撑杆的一端的位置相对固定，所述多个支撑杆的另一端分别安装在所述功能器件的多个安装孔中，所述支撑杆相对所述功能器件倾斜设置；
    多个检测装置，所述检测装置设置于所述支撑杆上，所述检测装置与所述支撑杆一一对应设置，所述检测装置用于检测所述检测装置与所述边缘环之间的第一距离信息；
    控制器，分别与所述多个检测装置电连接。
  2. 根据权利要求1所述的校正装置，其中，所述检测装置包括检测单元，所述检测单元能够相对所述支撑杆转动，所述检测单元用于检测所述检测单元与所述边缘环之间的第一距离信息。
  3. 根据权利要求2所述的校正装置，其中，所述检测单元包括激光测距传感器。
  4. 根据权利要求2所述的校正装置，其中，所述检测装置还包括显示单元，所述显示单元与所述检测单元通信连接；
    所述显示单元用于显示所述第一距离信息。
  5. 根据权利要求1所述的校正装置，其中，所述多个支撑杆与所述功能器件之间形成的夹角均相同。
  6. 根据权利要求1所述的校正装置，其中，所述多个支撑杆的远离所述功能器件的一端具有交点；或者，
    所述多个支撑杆的远离所述功能器件的一端的延伸线具有交点；或者，
    所述多个支撑杆位于所述功能器件上的正投影具有中点。
  7. 根据权利要求6所述的校正装置，其中，所述交点或中点位于经过所述功能器件的中心点的垂线上。
  8. 根据权利要求1所述的校正装置，其中，所述校正装置还包括固定件，所述固定件用于固定多个所述支撑杆的远离所述功能器件的一端。
  9. 根据权利要求8所述的校正装置，其中，所述固定件包括固定座，所述固定座上设有多个插接孔，其中，所述多个支撑杆的一端分别插接于多个所述插接孔内。
  10. 根据权利要求9所述的校正装置，其中，所述校正装置还包括多个锁紧件，所述支撑杆通过所述锁紧件固定于所述固定座上。
  11. 根据权利要求1-10任一项所述的校正装置，其中，所述支撑杆的个数至少为三个。
  12. 一种校正方法，应用于如权利要求1-11任一项所述的校正装置，所述校正方法包括：
    获取各所述检测装置检测到的第一距离信息，所述第一距离信息用于表征各所述检测装置到所述边缘环之间的距离；
    获取每个支撑杆的第二距离信息，所述第二距离信息用于表征所述支撑杆的两个端部与功能器件之间的几何位置关系；
    根据所述第一距离信息和所述第二距离信息，确定所述支撑杆所在区域内所述功能器件与所述边缘环之间的相对间距；
    根据各所述相对间距之间的差值，对所述边缘环的位置进行调整。
  13. 根据权利要求12所述的校正方法，其中，所述根据各所述相对间距之间的差值，对所述边缘环的位置进行调整，包括：
    当所述差值超出预设阈值范围时，调整所述边缘环的位置。
  14. 根据权利要求12所述的校正方法，其中，所述获取每个支撑杆的第二距离信息，所述第二距离信息用于表征所述支撑杆的两个端部与功能器件之间的几何位置关系，包括：
    获取第一长度，所述第一长度用于表征所述检测装置与所述功能器件上的安装孔之间的距离；
    获取所述支撑杆的倾斜角度，所述倾斜角度用于表征所述支撑杆与所述功能器件之间的锐角；
    获取第二长度，所述第二长度用于表征所述安装孔与所述功能器件边缘的距离。
  15. 根据权利要求14所述的校正方法，其中，所述根据所述第一距离 信息和所述第二距离信息，确定所述支撑杆所在区域内所述功能器件与所述边缘环之间的相对间距，包括：
    根据所述第一距离信息、所述第一长度、所述倾斜角度、所述第二长度，确定所述相对间距。
PCT/CN2022/075439 2022-01-17 2022-02-08 校正装置及校正方法 WO2023133953A1 (zh)

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