WO2023125614A1

WO2023125614A1 - Pcb with low electromagnetic interference, power source distribution unit, and vehicle

Info

Publication number: WO2023125614A1
Application number: PCT/CN2022/142637
Authority: WO
Inventors: 王超
Original assignee: 长春捷翼汽车科技股份有限公司
Priority date: 2021-12-29
Filing date: 2022-12-28
Publication date: 2023-07-06
Also published as: CN216565726U

Abstract

Provided herein are a PCB with a low electromagnetic interference, a power source distribution unit, and a vehicle. The PCB comprises a base layer, a first conductive layer, and a second conductive layer, wherein the first conductive layer and the second conductive layer are respectively arranged on two sides of the base layer; the position of an input end of the first conductive layer on the PCB corresponds to the position of an output end of the second conductive layer on the PCB, and the position of an output end of the first conductive layer on the PCB corresponds to the position of an input end of the second conductive layer on the PCB; the shape of at least part of the first conductive layer and the shape of the second conductive layer are mirror images of each other; and the direction of a current flowing through the first conductive layer is opposite to the direction of a current flowing through the second conductive layer. The two sides of a PCB are respectively provided with a first conductive layer and a second conductive layer, the conductive layers on the two sides of the PCB are mirror images of each other, and the currents, which flow through the conductive layer, are equal in magnitude and opposite in direction, such that magnetic fields with an equal magnitude and opposite directions, which are generated in loops on the two sides of the base layer, cancel each other out, thereby reducing electromagnetic interference.

Description

A PCB board, power distribution unit and vehicle with low electromagnetic interference

The present invention claims the priority of the Chinese patent application with the application number 2021233813130 and titled "a PCB board, power distribution unit and vehicle with low electromagnetic interference" submitted on December 29, 2021, the entire contents of which are incorporated herein by reference. Applying.

technical field

The invention relates to the field of high-voltage electrical technology for electric vehicles, in particular to a low-electromagnetic-interference PCB board, a power distribution unit and a vehicle.

Background technique

With the rapid development of transportation, aerospace, new energy and other fields, higher requirements are placed on existing power devices and converters, such as higher power density, higher efficiency, and smaller electromagnetic interference . At present, the methods for reducing electromagnetic interference of high-voltage electrical appliances for electric vehicles are mainly to use metal boxes and add filter circuits, etc., which are costly.

In view of this, this article aims to provide a PCB board, power distribution unit and vehicle with low electromagnetic interference, which can solve the problem of electromagnetic interference at low cost.

Contents of the invention

In view of the above problems in the prior art, the purpose of this paper is to provide a PCB board, a power distribution unit and a vehicle with low electromagnetic interference, so as to solve the problem of high cost of reducing electromagnetic interference in the prior art.

In order to solve the above technical problems, the specific technical solutions of this paper are as follows:

On the one hand, this paper provides a PCB board with low electromagnetic interference, including a base layer, a first conductive layer and a second conductive layer;

The first conductive layer and the second conductive layer are respectively arranged on both sides of the base layer; the position of the input end of the first conductive layer on the PCB board is the same as that of the output end of the second conductive layer Corresponding to the position on the PCB, the position of the output end of the first conductive layer on the PCB corresponds to the position of the input end of the second conductive layer on the PCB; at least The shape of part of the first conductive layer is a mirror image of that of the second conductive layer; the flow direction of the current in the first conductive layer is opposite to the flow direction of the current in the second conductive layer.

Specifically, a connection point for connecting with an electronic device is provided on the base layer, and the electronic device is connected with the first conductive layer through the connection point to form a via.

Further, the shape of the second conductive layer is consistent with the shape of the via.

Further, the second conductive layer is formed with a avoidance structure at the electronic device on the side of the first conductive layer.

Furthermore, the connection point is a connection opening, and the outer periphery of the connection opening connected to the front surface of the base layer is provided with the first conductive layer, which is used to connect two connection openings of the same electronic device. There is no communication between the holes with the first conductive layer; the second conductive layer forms an avoidance gap at the outer periphery of the connection opening.

Preferably, the PCB board includes a first connection part, a second connection part and a third connection part connected in sequence, the first connection part and the third connection part are close to each other, and the second connection part is connected to the third connection part The connection between the first connection part and the connection between the second connection part and the third connection part are smoothly transitioned.

Preferably, the electronic device is a contactor and/or a circuit breaker.

Specifically, the first conductive layer and the second conductive layer are made of the same material.

Further, the thickness and width of the first conductive layer are respectively the same as those of the second conductive layer.

Further, the cross-sectional area of the first conductive layer is the same as that of the second conductive layer.

Preferably, the cross-sectional area of the first conductive layer and the second conductive layer are between 10 mm ² and 300 mm ² .

Preferably, the thickness of the base layer is between 2mm and 8mm.

Specifically, a first coating layer is provided on a side of the first conductive layer away from the base layer, and a second coating layer is provided on a side of the second conductive layer away from the base layer.

Preferably, the first cladding layer and the second cladding layer are made of the same material, and both the first cladding layer and the second cladding layer are solder resist layers.

On the other hand, this paper also provides a power distribution unit with low electromagnetic interference, which includes a housing and a PCB board as described in the above technical solution, the PCB board is arranged in the housing, and the input of the first conductive layer end and the output end of the second conductive layer are drawn out through the first connection terminal on the housing, and the output end of the first conductive layer and the input end of the second conductive layer are drawn through the first connection terminal on the housing. The second connecting terminal leads out.

On the other hand, this paper also provides a vehicle, including a battery pack, an electric device, and the above-mentioned power distribution unit, the battery pack is connected to the power distribution unit through the first connection terminal, and the electric device is connected to the power distribution unit. The power distribution unit is connected through the second connection terminal.

Using the above technical solution, a low electromagnetic interference PCB board, a power distribution unit and a vehicle described in this paper have a first conductive layer and a second conductive layer for current flow on both sides of the PCB board, and the positive and negative sides of the PCB board are respectively provided with a first conductive layer and a second conductive layer The conductive layers on both sides are mirror images of each other, and the currents flowing through them are equal in size and opposite in direction, so that magnetic fields of equal size and opposite directions are generated in the loops on both sides of the base layer to cancel each other out, reducing electromagnetic interference; it is beneficial to improve The performance and lifetime of electronic devices; compared to existing methods of reducing electromagnetic interference, the cost is lower.

In order to make the above and other objects, features and advantages of this document more comprehensible, preferred embodiments will be described in detail below together with the attached drawings.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments or prior art herein, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or prior art. Obviously, the accompanying drawings in the following description are only For some embodiments herein, those skilled in the art can also obtain other drawings based on these drawings without creative effort.

Fig. 1 (a) to Fig. 1 (c) have shown the first schematic structural view of a kind of PCB board that the embodiment of this paper provides;

Fig. 2 (a) to Fig. 2 (b) have shown the structural representation of a kind of PCB board that the embodiment of this paper provides when being connected with electronic device;

Fig. 3 (a) to Fig. 3 (b) have shown the structural representation of another kind of PCB board that the embodiment of this paper provides;

Fig. 4 is the enlarged schematic diagram of place A in Fig. 1 (c);

Fig. 5 shows the cross-sectional view of the PCB board provided by the embodiment of this paper at its connection point;

Fig. 6 shows the second schematic structural view of a PCB board provided by the embodiment of this paper;

Fig. 7 shows the sectional view of the PCB board that the embodiment of this paper provides;

Fig. 8 shows the sectional view of another kind of PCB board that the embodiment of this paper provides;

FIG. 9 shows a schematic structural diagram of a power distribution unit provided by an embodiment of this document;

Fig. 10 shows a schematic structural diagram of a part of a vehicle provided by the embodiment of this document.

Explanation of reference symbols:

10, PCB board; 11, base layer; 12, the first conductive layer; 121, the input end of the first conductive layer; 122, the output end of the first conductive layer; 13, the second conductive layer; 131, the second conductive layer 132, the output end of the second conductive layer; 14, the connection point; 15, the first cladding layer; 16, the second cladding layer; 17, the first connection part; 18, the second connection part; 19, the third Connecting part; 20, electronic device; 30, power distribution unit; 31, housing; 32, first connecting terminal; 33, second connecting terminal; 40, battery pack; 50, electrical equipment.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments herein in conjunction with the accompanying drawings in the embodiments herein. Obviously, the described embodiments are only some of the embodiments herein, not all of them. Based on the embodiments herein, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts fall within the scope of protection herein.

It should be noted that the terms "first" and "second" in the description and claims herein and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments herein described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, means, product or equipment comprising a series of steps or elements need not be limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

Existing methods for reducing the Electromagnetic Interference (EMI) of high-voltage electrical appliances in electric vehicles are mainly through the shielding method of metal boxes and the addition of filter circuits, etc., and the cost is relatively high. The embodiments herein provide a low-electromagnetic-interference PCB board, a power distribution unit, and a vehicle, which can reduce equipment costs while achieving low electromagnetic interference. Figure 1(a) to Figure 1(c) are schematic structural views of a PCB board with low electromagnetic interference provided by the embodiment of this paper, specifically, Figure 1(a) is a schematic diagram of the front structure of the PCB board, Figure 1(b ) is a side view of the PCB board, and Figure 1(c) is a schematic diagram of the structure of the reverse side of the PCB board. Specifically, as shown in Figure 1(a) to Figure 1(c), the PCB board 10 with low electromagnetic interference may include: a base layer 11, a first conductive layer 12 and a second conductive layer 13;

The first conductive layer 12 and the second conductive layer 13 are arranged on both sides of the base layer 11 respectively; Correspondingly, the position of the output terminal 122 of the first conductive layer on the PCB corresponds to the position of the input terminal 131 of the second conductive layer on the PCB; at least part of the shape of the first conductive layer 12 is consistent with that of the second conductive layer 13 The shape is a mirror image; the current flowing through the first conductive layer 12 is opposite to the current flowing through the second conductive layer 13 .

A PCB board provided in the embodiment of this specification has a first conductive layer and a second conductive layer for current flow on both sides of the front and back, and the conductive layers on the front and back sides are mirror images of each other, and flow through the front and back. The current directions of the conductive layers on both sides are opposite, so that the magnetic fields in opposite directions are generated in the loops on both sides of the base layer 11 to cancel each other out, and play a role in reducing electromagnetic interference; it is beneficial to improve the performance and service life of electronic devices; Compared with the method for reducing electromagnetic interference, the PCB board provided by the embodiment of this specification has a simpler structure and lower manufacturing cost.

Preferably, the current flowing through the first conductive layer 12 and the current flowing through the second conductive layer 13 can also be equal in magnitude, so that the magnetic fields generated in the loops on both sides of the base layer 11 are also equal in magnitude to improve the mutual cancellation of the magnetic fields on both sides. effect, further reducing electromagnetic interference.

It should be noted that, in the embodiment of this specification, the position of the input end 121 of the first conductive layer on the PCB corresponds to the position of the output end 132 of the second conductive layer on the PCB. The positions on the PCB board are exactly the same, but it means that in order to make the current loop mirror, the positions of these two points are as close as possible without affecting the electrical performance. The situation of the output end 122 of the first conductive layer and the input end 131 of the second conductive layer is similar, and will not be repeated here.

Fig. 2 (a) and Fig. 2 (b) are the structural schematic diagrams of the PCB board that is connected with electronic device, and Fig. 2 (a) has shown the front of the PCB board that is connected with electronic device; Fig. 2 (b) has shown the connection The reverse side of a PCB board with electronic components. As shown in Fig. 1 (a) to Fig. 1 (c) and Fig. 2 (a) to Fig. 2 (b), the base layer 11 is provided with a connection point 14 for connecting with the electronic device, and the electronic device 20 is connected to the electronic device through the connection point 14. The first conductive layers 12 are connected to form vias. That is, in the embodiment of this specification, the electronic device 20 is assembled and connected on the front surface of the base layer 11 .

In order to avoid short circuit of the electronic device 20 connected on the base layer 11 , there is no first conductive layer 12 between the two connection points 14 of the base layer 11 for connecting the same electronic device 20 . Therefore, on the back side where the electronic device 20 is located, there are many ways to route the second conductive layer 13 . In some feasible embodiments, the shape of the second conductive layer 13 is consistent with the shape of the path, that is, the shape of the path formed by connecting the first conductive layer 12 with the electronic device 20 is consistent with the shape of the second conductive layer 13 .

That is, as shown in Figure 3(a) to Figure 3(b), it is a schematic structural diagram of another PCB board provided by the embodiment of this paper; Figure 3(a) is another PCB board connected with electronic devices provided by the embodiment of this specification Fig. 3(b) is the reverse side of another PCB board connected with electronic devices provided by the embodiment of this specification. As shown in FIG. 3( b ), the path formed by connecting the first conductive layer 12 and the electronic device 20 through the connection point 14 is consistent with the shape of the second conductive layer 13 .

In some other feasible embodiments, the second conductive layer 13 is formed with an avoidance structure at the electronic device 20 on the side of the first conductive layer 12 . As shown in Figure 2 (b), on the back side of the connection position of the electronic device 20, the wiring of the second conductive layer 13 is in a "bow" shape to avoid the electronic device 20, that is to say, on the front side of the base layer 11, the electronic device 20 is connected between the two connection points 14; at the corresponding position on the back of the base layer 11, the second conductive layer 13 between the two connection points 14 of the electronic device 20 is connected, and is bent away from the electronic device 20. Therefore, the influence of the magnetic field generated by the second conductive layer 13 on the backside where the electronic device 20 is located on the electronic device 20 can be reduced, and the service life of the electronic device 20 can be improved. Avoidance structures can also be used to avoid components such as hardware baselines on or off the PCB.

Since the first conductive layer 12 is not provided at the position of the electronic device 20 , but the second conductive layer 13 is provided on the back thereof, therefore, the mutual cancellation effect of the magnetic fields on the front and back sides of the position of the electronic device 20 is poor. At this time, the method of metal shielding can be used to reduce electromagnetic interference. For example, the electronic device 20 is covered with a metal box. Since the metal box only needs to cover the electronic device 20 instead of covering the entire PCB board, the metal box can be used. It has a smaller volume, which can reduce its manufacturing cost.

Further, the connection point 14 may be a connection opening penetrating through the base layer 11, and a first conductive layer 12 is provided on the outer periphery of the connection opening connected to the front surface of the base layer 11, and is used to connect two connection openings of the same electronic device 20. No first conductive layer 12 is connected between the holes, that is, the wiring of the first conductive layer 12 should avoid short circuit of the electronic device 20; as shown in Figure 4 and Figure 5, the second conductive layer 13 is connected to the outer periphery of the opening An avoidance gap is formed at the position (that is, on the back side where the connection opening is located, the second conductive layer 13 is also provided with an opening, but the aperture of the opening of the second conductive layer 13 at this position is larger than the aperture of the connection opening), Therefore, the electronic device 20 connected at the connection opening is conducted with the first conductive layer 12 and not conducted with the second conductive layer 13 .

Of course, the connection point 14 may also be a connection hole that does not penetrate the base layer 11 to the second conductive layer 13 , and the preparation of the second conductive layer 13 does not need to increase the avoidance process for the connection hole.

As shown in Figure 6, the PCB board 10 may include a first connecting portion 17, a second connecting portion 18 and a third connecting portion 19 connected in sequence, and the first connecting portion 17 and the third connecting portion 19 are close to each other (the first connecting portion 17 is substantially parallel to the third connecting portion 19 so that the free end of the first connecting portion 17 and the free end of the third connecting portion 19 are on the same side), the connection between the second connecting portion 18 and the first connecting portion 17 and The junctions between the second connecting portion 18 and the third connecting portion 19 are smoothly transitioned. The PCB board is in an inverted "U" shape, which is suitable for the requirements of its application scenarios. The electronic device 20 may be disposed on the first connection part 17 and/or the second connection part 18 and/or the third connection part 19 . Exemplarily, as shown in FIG. 6 , the electronic device 20 is disposed on the third connecting portion 19 .

The electronic device 20 is a contactor and/or a circuit breaker. Contactors and/or circuit breakers are used to secure electrical circuits.

The first conductive layer 12 and the second conductive layer 13 are made of the same material.

Specifically, the first conductive layer 12 and the second conductive layer 13 are made of copper or aluminum.

The copper material has good electrical conductivity and can carry relatively large current; the aluminum material has good heat dissipation and low cost; the first conductive layer 12 and the second conductive layer 13 can be made of suitable materials according to actual needs.

In some feasible embodiments, the thickness and width of the first conductive layer 12 are respectively the same as those of the second conductive layer 13 . As shown in Figure 7, the thickness of the first conductive layer 12 and the thickness of the second conductive layer 13 are both H; The width (referring to the width of the second conductive layer wiring) is W.

In some feasible embodiments, the cross-sectional area of the first conductive layer 12 can also be made the same as the cross-sectional area of the second conductive layer 13 . It should be noted that, in the embodiment of this specification, the cross-sectional area of the first conductive layer is the area of the cross-section obtained by cutting it perpendicular to the length direction of the first conductive layer, that is, the thickness and width of the first conductive layer The product of ; similarly, the cross-sectional area of the second conductive layer is the product of the thickness and width of the second conductive layer.

When the cross-sectional area of the first conductive layer 12 is the same or equivalent to the cross-sectional area of the second conductive layer 13 (quite means that the difference between the two cross-sectional areas is less than or equal to the preset allowable range, for example, less than or equal to 1%), the second A conductive layer 12 has the same or equivalent current flow capacity as the second conductive layer 13, so that a magnetic field of the same or equivalent size can be formed on the front and back sides of the base layer 11, and the magnetic field cancellation effect is improved, thereby improving the ability to eliminate electromagnetic interference .

A low electromagnetic interference PCB board and power distribution unit provided herein are suitable for high-voltage application scenarios. Therefore, preferably, the cross-sectional area of the first conductive layer 12 and the cross-sectional area of the second conductive layer 13 are between 10 mm ² and 300 mm ² to deal with the flow of high-voltage current.

Preferably, the cross-sectional areas of the first conductive layer 12 and the second conductive layer 13 are between 10 mm ² and 120 mm ² .

Since the first conductive layer 12 and the second conductive layer 13 are respectively arranged on the front and back sides of the base layer 11, the center of the magnetic field generated by the first conductive layer 12 and the center of the magnetic field generated by the second conductive layer 13 must not be exactly the same. Overlapping, therefore, the thickness of the base layer 11 should be made as small as possible to maximize the overlapping of the centers of the magnetic fields on both sides of the base layer 11, thereby improving the effect of magnetic field cancellation and reducing electromagnetic interference as much as possible. However, the thickness of the base layer 11 should also enable the base layer 11 to meet the hardness and rigidity requirements for opening holes and carrying some electronic devices. Therefore, in the embodiment of this specification, the thickness H1 of the base layer 11 is between 2 mm and 8 mm.

Preferably, the thickness of the base layer 11 is 4mm. When the thickness of the base layer 11 is 4 mm, the center distance of the magnetic field on both sides of the base layer 11 differs by 4 mm. On the premise that the base layer 11 meets the hardness and rigidity requirements, a better effect of reducing electronic interference is achieved.

In the embodiment of this specification, the base layer 11 can be a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate, an epoxy glass cloth laminate, etc. The preparation process is not specifically limited, and the material and preparation of the base layer 11 can refer to the prior art.

The chemical properties of aluminum are relatively active, and it is easy to oxidize with oxygen in the air; although the chemical properties of copper are not as active as aluminum, copper will still be oxidized when it comes into contact with oxygen in the presence of water. Since the thickness of the first conductive layer 12 and the second conductive layer 13 is generally thin, once oxidized, they will become poor conductors of electricity, which will greatly damage the electrical performance of the entire PCB board. In order to prevent copper oxidation, and to separate the soldered and non-soldered parts of the PCB board during soldering, and to protect the surface of the PCB board from insulation deterioration and corrosion caused by external environmental factors such as dust and moisture or mistakes, the first conductive layer 12 is provided with a first coating layer 15 on the side away from the base layer 11 , and a second coating layer 16 is provided on the side of the second conductive layer 13 away from the base layer 11 , as shown in FIG. 5 and FIG. 8 . The first cladding layer 15 and the second cladding layer 16 play a role of protecting the PCB board 10 and the upper conductive layer.

The first cladding layer 15 and the second cladding layer 16 are made of the same material, preferably, both the first cladding layer 15 and the second cladding layer 16 are solder resist layers. The solder resist layer can protect the formed circuit pattern for a long time, prevent the physical disconnection of the conductor circuit, prevent the short circuit caused by bridging, and reduce the copper pollution to the solder tank.

Of course, the second cladding layer 16 can also be made of different materials and/or different processes from the first cladding layer 15 . Since the second coating 16 is in close contact with the power distribution unit 30, that is, the second coating 16 can be less exposed, so the requirements for the performance of the second coating 16 such as wear resistance and radiation resistance are relatively higher than those of the first coating. 15 is relatively low, which can reduce the material cost and process cost of the second cladding layer 16, thereby reducing the PCB board manufacturing cost to a certain extent.

The embodiment of this specification also provides a power distribution unit 30 with low electromagnetic interference. As shown in FIG. Set in the casing 31, the input end of the first conductive layer 12 and the output end of the second conductive layer 13 are drawn out through the first connecting terminal 32 on the casing, the output end of the first conductive layer 12 is connected with the second conductive layer 13 The input end of the terminal is led out through the second connecting terminal 33 on the housing 31 .

In the embodiment of this specification, the power distribution unit with low electromagnetic interference, wherein the front and back sides of the PCB board are respectively provided with a first conductive layer and a second conductive layer for current flow, and the conductive layers on the front and back sides are mutually The current direction of the mirror image and flow is opposite, so that the magnetic fields with opposite directions are generated in the loops on both sides of the base layer to cancel each other, and finally play a role in reducing electromagnetic interference, which is beneficial to improve the performance and service life of the power distribution unit; and through A second conductive layer is added on the back of the PCB to offset the magnetic field generated by the current loop on the front of the PCB. Compared with the existing method for reducing electromagnetic interference, the manufacturing cost is low.

As shown in Figure 9, the first connection terminal 32 and the second connection terminal 33 are located on the same side of the housing 31, so that the PCB board is in an upside-down "U" shape. Of course, the shape and size of the PCB board can be determined according to the actual situation. Application needs to be adjusted.

Both the first connection terminal 32 and the second connection terminal 33 include a positive connection end and a negative connection end, and the positive connection ends of the first connection terminal 32 and the second connection terminal 33 are connected to the first conductive layer 12, and the first connection terminal 32 Both the negative connection end and the second connection terminal 33 are connected to the second conductive layer 13 .

The embodiment of this specification also provides a vehicle. As shown in FIG. 10, the vehicle includes a battery pack 40, an electrical device 50, and a power distribution unit 30. The device 50 is connected to the power distribution unit 30 through the second connection terminal 33 .

It should also be understood that in the embodiments herein, the term "and/or" is merely an association relationship describing associated objects, indicating that there may be three relationships. For example, A and/or B may mean that A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.

In this paper, specific embodiments are used to illustrate the principles and implementation methods herein, and are not intended to limit the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and without departing from The present invention can be realized in other specific forms without compromising the spirit or essential characteristics of the present invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

A PCB board with low electromagnetic interference is characterized in that it includes a base layer, a first conductive layer and a second conductive layer;

The first conductive layer and the second conductive layer are respectively arranged on both sides of the base layer; the position of the input end of the first conductive layer on the PCB board is the same as that of the output end of the second conductive layer Corresponding to the position on the PCB, the position of the output end of the first conductive layer on the PCB corresponds to the position of the input end of the second conductive layer on the PCB; at least The shape of part of the first conductive layer is a mirror image of that of the second conductive layer; the direction of the current flowing through the first conductive layer is opposite to the direction of the current flowing through the second conductive layer.
The PCB board according to claim 1, wherein a connection point for connecting with an electronic device is provided on the base layer, and the electronic device is connected with the first conductive layer through the connection point to form a via.
The PCB board according to claim 2, wherein the shape of the second conductive layer is consistent with the shape of the via.
The PCB board according to claim 2, characterized in that, the second conductive layer has a avoidance structure formed at the electronic device on the side of the first conductive layer.
The PCB board according to claim 2, wherein the connection point is a connection opening, and the outer periphery of the connection opening connected to the front surface of the base layer is provided with the first conductive layer for The first conductive layer is not connected between two connection openings connected to the same electronic device; the second conductive layer is formed with an avoidance gap at the outer periphery of the connection opening.
The PCB board according to claim 1, wherein the PCB board includes a first connection part, a second connection part and a third connection part connected in sequence, and the first connection part and the third connection part Close to each other, the connection between the second connection part and the first connection part and the connection between the second connection part and the third connection part are smoothly transitioned.
The PCB board according to claim 2, wherein the electronic device is a contactor and/or a circuit breaker.
The PCB board according to claim 1, wherein the first conductive layer and the second conductive layer are made of the same material.
The PCB board according to claim 1, wherein the width of the first conductive layer is the same as that of the second conductive layer.
The PCB board according to claim 1, wherein the cross-sectional area of the first conductive layer is the same as that of the second conductive layer.
The PCB board according to claim 1, wherein the cross-sectional area of the first conductive layer and the cross-sectional area of the second conductive layer are both between 10 mm 2 and 300 mm 2 .
The PCB board according to claim 1, wherein the thickness of the base layer is between 2mm and 8mm.
The PCB board according to claim 1, wherein the first conductive layer is provided with a first cladding layer on a side far away from the base layer, and the second conductive layer is provided with a second layer on a side far away from the base layer. Second cladding.
The PCB board according to claim 13, wherein the first cladding layer and the second cladding layer are made of the same material, and both the first cladding layer and the second cladding layer are resistive solder layer.
A power distribution unit with low electromagnetic interference, characterized in that it includes a housing and a PCB board according to any one of claims 1 to 14, the PCB board is arranged in the housing, and the first conductive layer The input end of the second conductive layer and the output end of the second conductive layer are drawn out through the first connection terminal on the housing, and the output end of the first conductive layer and the input end of the second conductive layer pass through the housing The second connection terminal on the lead out.
A vehicle, characterized by comprising a battery pack, an electrical device and the power distribution unit according to claim 15, the battery pack is connected to the power distribution unit through the first connection terminal, and the power The device is connected to the power distribution unit through the second connection terminal.