CN217591210U - PCB structure and switching power supply - Google Patents
PCB structure and switching power supply Download PDFInfo
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- CN217591210U CN217591210U CN202220909439.6U CN202220909439U CN217591210U CN 217591210 U CN217591210 U CN 217591210U CN 202220909439 U CN202220909439 U CN 202220909439U CN 217591210 U CN217591210 U CN 217591210U
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- circuit board
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Abstract
The utility model discloses a PCB structure and switching power supply, the PCB structure includes: the multilayer circuit board is provided with a through hole penetrating through the first surface of the multilayer circuit board and the second surface of the multilayer circuit board, and the through hole is used for realizing the electrical connection among layers of the multilayer circuit board; a first terminal portion passing through the through hole; a solder paste filled in a gap between the first terminal part outer surface and the through-hole inner surface. Compared with the hollow through hole in the prior art, the through hole in the PCB structure of the utility model increases the through-flow and heat-conducting capacity, and improves the product performance; under the condition of the same through-current capacity, the area of the through-hole cloth plate of the utility model is far smaller than that of the hollow through-hole; additionally the utility model discloses a through-hole plug terminal processing cost is far less than notes copper processing cost.
Description
Technical Field
The utility model relates to a PCB application, in particular to PCB structure and switching power supply.
Background
With the development of technology and the advancement of electronic technology, various electronic devices are becoming smaller and smaller. Accordingly, the power module inside the product is also developing to a high power and small volume. Therefore, the area of the power supply product PCB is gradually reduced, and the layer number and the copper thickness are gradually increased.
In order to realize a multilayer PCB structure, through holes are needed to realize electrical connection between circuit boards of each layer of the PCB, so as to achieve the purposes of signal transmission and through-current. Assuming that the through-hole requires a current of 12.5A, if a hollow through-hole is used, at least the diameter is requiredThe number of the through holes with 0.4mm and 30um copper walls is 8, and the occupied area of the plate is more than 1.1mm 2 . With the extremely pursuit of small volume and high power density in the communication power supply industry, the hollow through holes used in the market can not meet the requirements of products gradually due to large board distribution area and poor through-current capability.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model is to provide a PCB structure and switching power supply, solve the big problem of hollow through-hole fabric board area in the PCB.
As a first aspect of the present invention, there is provided an embodiment of a PCB structure as follows:
a PCB structure comprising:
the multilayer circuit board is provided with a through hole penetrating through the first surface of the multilayer circuit board and the second surface of the multilayer circuit board, and the through hole is used for realizing the electrical connection among layers of the multilayer circuit board;
a first terminal part passing through the through hole;
a welding material filled in a gap between the first terminal part outer surface and the through-hole inner surface.
Preferably, the solder material is tin.
Further, the length of the first terminal portion is less than or equal to the depth of the through hole, and the first terminal portion is completely located in the through hole.
Furthermore, the PCB structure further includes a second terminal portion, the second terminal portion is connected to the first terminal portion, the second terminal portion is disposed on the first surface of the multilayer circuit board, and a cross section of the second terminal portion and a cross section of the through hole form an anti-dropping structure.
Further, the first terminal portion and/or the second terminal portion is a copper terminal portion.
Further, the first terminal portion and/or the second terminal portion are/is a terminal portion whose surface is subjected to gold plating treatment.
Preferably, a cross section of any one, two or three phases of the through hole, the first terminal part and the second terminal part is circular, elliptical or square.
As a second aspect of the present invention, there is provided an embodiment of a switching power supply, comprising:
a switching power supply comprising the PCB structure of any of the above embodiments.
The beneficial effects of the utility model reside in that:
(1) The utility model discloses PCB structure is under the equal cloth board area condition, and the through-flow capacity of through-hole is stronger than prior art's hollow through-hole through-flow capacity to can reduce the cloth board area, accord with the development trend of present power product module high power density, little volume completely.
(2) The utility model discloses the strong heat conductivity of the usable terminal of PCB structure is derived PCB inside heat, improves the product temperature rise.
(3) The utility model discloses through-hole plug terminal technology of PCB structure preparation low cost, than PCB buried hole notes copper technology, the PCB cost reduces 30% at least.
Drawings
Fig. 1 is a schematic diagram of an embodiment of the PCB structure of the present invention.
Fig. 2 is a schematic diagram of another embodiment of the PCB diagram structure of the present invention.
Fig. 3 is a schematic diagram of another embodiment of the PCB diagram structure of the present invention.
Wherein the figures include the following reference numerals: 10-multilayer wiring board, 20-first terminal portion, 30-solder paste, 40-second terminal portion.
Detailed Description
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless stated to the contrary, use of the directional terms "upper, lower, left, right, etc. are generally directed to the orientation shown in the drawings, or to the orientation of the component itself in a vertical, or gravitational direction; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
In addition, the invention has universality, is suitable for other products needing stronger through-current capacity of the PCB besides the module power supply described in the background technology, and the application scene of the power supply module is not considered as the limitation of the protection range of the PCB structure of the utility model.
Fig. 1 is a schematic diagram of an embodiment of a PCB structure of the present invention, please refer to fig. 1, in which the PCB structure includes:
a multilayer wiring board 10 in which through holes penetrating a first surface of the multilayer wiring board and a second surface of the multilayer wiring board are provided, the through holes being used for realizing electrical connection between layers of the multilayer wiring board;
a first terminal portion 20, the first terminal portion 20 passing through the through hole;
and a welding material 30, the welding material 30 being filled in a gap between the outer surface of the first terminal portion and the inner surface of the through hole.
Wherein, the gap between the first terminal portion 20 and the through hole should be as small as possible, so as to increase the through-flow and heat dissipation capability of the through hole and reduce the area of the cloth board occupied by the brush welding material; and also to avoid the first terminal portion 20 from easily falling out of the through hole during the process.
The purpose of filling the welding material 30 in the gap between the outer surface of the first terminal portion and the inner surface of the through hole is that the welding material can fix the first terminal portion 20 in the through hole, and achieve effective electrical connection between the first terminal portion 20 and the through hole, so that the through-hole has improved current capacity.
Preferably, the solder material is tin.
Preferably, the length of the first terminal portion is less than or equal to the depth of the through hole, and the first terminal portion is completely located in the through hole. The design has the advantages that the first terminal part is prevented from exceeding the first surface of the multilayer circuit board and the second surface of the multilayer circuit board, the appearance and the reliability are not influenced, and the risk of poor static electricity and poor voltage resistance exists if the terminal is too long and a product has a shell. The optimum length of the first terminal portion is the same as the depth of the through hole, and if the first terminal portion is too short, the through hole needs to be filled with more solder material, and the current-carrying capacity is reduced.
Fig. 2 is a schematic diagram of another embodiment of the PCB diagram structure of the present invention, please refer to fig. 2, which is different from fig. 1 in that the length L1 of the first terminal portion is exactly equal to the depth L2 of the through hole, so that the advantage of the design is that the first terminal portion can be prevented from exceeding the first surface and the second surface of the multilayer circuit board, the product appearance is intact, there is no PCB protrusion, no electrostatic and voltage-withstanding risks are caused, and the maximum through-hole current-carrying capacity can be achieved.
Fig. 3 is a schematic diagram of another embodiment of the PCB structure of the present invention, referring to fig. 3, the PCB structure further includes a second terminal portion 40, the second terminal portion 40 is connected to the first terminal portion 20, the second terminal portion 40 is disposed on the first surface of the multilayer circuit board 10, and the cross section of the second terminal portion 40 and the cross section 20 of the through hole form an anti-releasing structure.
Wherein the second terminal 40 is added, and the cross section of the second terminal portion 40 and the cross section 20 of the through hole form a retaining structure, so as to further avoid the first terminal portion 20 from easily falling out of the through hole during the processing.
The anti-dropping structure can be implemented in various ways, and only the projection of the length of one center line of the cross section of the second terminal portion 40 on the through hole penetrates through the cross section of the through hole at the first surface of the multilayer circuit board. For example, the through-hole is designed to be circular, and the second terminal portion 40 is also designed to be circular, and the diameter of the second terminal portion 40 needs only to be larger than the diameter of the through-hole.
Preferably, the first terminal portion 20 and/or the second terminal portion 40 are copper terminal portions. The reason is that the current density J = I/S in the first terminal portion 20, where I is the current magnitude that needs to flow and is designed in the first terminal portion 20, and S is the cross-sectional area of the first terminal portion 20, in order to save the board layout area, the cross-sectional area of the through hole is as small as possible, and the cross-sectional area of the first terminal portion 20 should also be as small as possible, so the current density of the first terminal portion 20 is large, and therefore, a copper terminal with a strong current-carrying capacity is selected as the first terminal portion 20, which is beneficial to achieve the purpose of the present invention, and other metal material terminals with a strong current-carrying capacity may also be selected as the first terminal portion 20.
Note that, since the solder material 30 needs to be filled in the gap between the outer surface of the first terminal portion and the inner surface of the through hole, in order to make the present invention more meaningful in implementation, when other metal material terminals are selected as the first terminal portion 20, the resistivity of the selected material needs to be smaller than the resistivity of the solder material.
Furthermore, the present invention is implemented to ensure that the current density J of the first terminal portion 20 satisfies the following relation: j < Ja, ja is the maximum current density of the conductor in normal operation under any heat dissipation condition, and aims to control the loss of the terminal when current flows so as to avoid generating a large amount of heat energy.
Further, the first terminal portion 20 and/or the second terminal portion 40 are/is a terminal portion whose surface is subjected to gold plating treatment, and the gold plating treatment can prevent the surface of the first terminal portion 20 and/or the second terminal portion 40 from being oxidized, thereby ensuring the current capacity.
Note that the resistivity of the surface treatment material is not much different from the resistivity of the first terminal portion 20, otherwise the surface treatment will be meaningless.
Preferably, the cross-section of any one, two or three of the through-hole, the first terminal portion 20 and the second terminal portion 40 is circular, oval or square, so as to facilitate the processing.
The utility model also provides a switching power supply, including the concrete embodiment of above-mentioned arbitrary PCB structure.
Also as in the background art, the current of 12.5A flowing through the through hole is designed, and if the through hole is a circular through hole with a diameter of 0.65mm and the first terminal portion is a circular terminal with a diameter of 0.5mm, only 1 through hole is needed,occupying the area of the board is only 0.33mm 2 。
And the PCB cost is increased by at least 30% by using the PCB buried hole copper injection process, and the cost is too high, so that the cost of the switching power supply is increased.
According to the data, under the same on-current condition, the utility model discloses through-hole fabric board area in the PCB structure is less than prior art's hollow through-hole fabric board area far away, and low cost, is applicable to the circulation of heavy current very much to realized the lifting efficiency, the reinforcing heat dissipation reduces the effect of fabric board area, accords with power module product high power density, small development trend. Meanwhile, the PCB structure is low in manufacturing cost, and the product cost can be effectively inhibited while the product performance is improved.
The utility model discloses a processing technology of PCB structure as follows:
(1) Providing a multilayer wiring board 10 with through holes;
(2) Then, pasting a piece on the second surface of the multilayer circuit board, and brushing tin on the first surface of the multilayer circuit board, wherein in order to ensure that the tin filling of the through hole is complete, the amount of tin paste used for the through hole needs to be more than or equal to the volume of a gap between the through hole and the terminal, and the second terminal part 40 (if any) needs to be ensured not to block the tin paste from entering the through hole;
(3) The first terminal portion 20 is inserted into the through hole from the first surface of the multilayer wiring board, and then the mounting is completed and reflow-soldered.
Variations and modifications to the above-described embodiments may also occur to those skilled in the art based upon the above description and teachings. Therefore, the present invention is not limited to the above-mentioned embodiments, and any obvious modifications, replacements or variations made by those skilled in the art on the basis of the present invention are within the protection scope of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
Claims (8)
1. A PCB structure, comprising:
the multilayer circuit board is provided with a through hole penetrating through the first surface of the multilayer circuit board and the second surface of the multilayer circuit board, and the through hole is used for realizing the electrical connection among layers of the multilayer circuit board;
a first terminal portion passing through the through hole;
a welding material filled in a gap between the first terminal portion outer surface and the through-hole inner surface.
2. The PCB structure of claim 1, wherein: the solder material is tin.
3. The PCB structure of claim 1, wherein: the length of the first terminal part is less than or equal to the depth of the through hole, and the first terminal part is completely positioned in the through hole.
4. The PCB structure of claim 1, wherein: the PCB structure further comprises a second terminal part, the second terminal part is connected with the first terminal part, the second terminal part is arranged on the first surface of the multilayer circuit board, and the cross section of the second terminal part and the cross section of the through hole form an anti-falling structure.
5. The PCB structure of claim 4, wherein: the first terminal portion and/or the second terminal portion are copper terminal portions.
6. The PCB structure of claim 5, wherein: the first terminal portion and/or the second terminal portion are/is a terminal portion whose surface is subjected to gold plating treatment.
7. The PCB structure of any of claims 4-6, wherein: the cross section of any one, two or three phases of the through hole, the first terminal part and the second terminal part is circular, oval or square.
8. A switching power supply, characterized by: comprising a PCB structure according to any of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220909439.6U CN217591210U (en) | 2022-04-19 | 2022-04-19 | PCB structure and switching power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220909439.6U CN217591210U (en) | 2022-04-19 | 2022-04-19 | PCB structure and switching power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217591210U true CN217591210U (en) | 2022-10-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220909439.6U Active CN217591210U (en) | 2022-04-19 | 2022-04-19 | PCB structure and switching power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217591210U (en) |
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2022
- 2022-04-19 CN CN202220909439.6U patent/CN217591210U/en active Active
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