WO2023124214A1 - Écouteur sans fil et antenne de terminal - Google Patents

Écouteur sans fil et antenne de terminal Download PDF

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Publication number
WO2023124214A1
WO2023124214A1 PCT/CN2022/117660 CN2022117660W WO2023124214A1 WO 2023124214 A1 WO2023124214 A1 WO 2023124214A1 CN 2022117660 W CN2022117660 W CN 2022117660W WO 2023124214 A1 WO2023124214 A1 WO 2023124214A1
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WO
WIPO (PCT)
Prior art keywords
antenna
radiator
terminal antenna
reference ground
module
Prior art date
Application number
PCT/CN2022/117660
Other languages
English (en)
Chinese (zh)
Inventor
罗健
董凯明
邸希剑
孟胤
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2023124214A1 publication Critical patent/WO2023124214A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • the present application relates to the technical field of antennas, in particular to a wireless earphone and a terminal antenna.
  • a wireless communication function can be realized through an antenna provided therein.
  • the Bluetooth headset through the antenna set in it covering the Bluetooth frequency band, it can be wirelessly connected to an electronic device (such as a mobile phone) in order to receive audio signals from the electronic device for audio playback; or send audio signals to the electronic device for voice. input etc.
  • the loss of the headform has a significant impact on the performance of the antenna, which will affect the communication quality of the wireless headset.
  • the embodiment of the present application provides a wireless earphone and a terminal antenna, which can solve the problem of poor communication performance of the wireless earphone caused by high loss of the headform during the working process of the antenna installed in the current wireless earphone.
  • a terminal antenna is provided.
  • the terminal antenna is set in a wireless earphone, and the wireless earphone includes an ear bag part and an ear bar part.
  • the terminal antenna includes: a first radiator and a first reference ground arranged in the ear bar part.
  • the first radiator is provided with a feed source and a ground point, the first radiator is connected to the first reference ground through the ground point, the ground point is set at the lower half of the first radiator, and the first radiator The lower half of the body is the part of the first radiator away from the ear wrap.
  • the terminal antenna installed in the wireless earphone can be installed on the ear bar, so that during the wearing process of the wireless earphone, the antenna will not be embedded into the human ear along with the ear bag, thereby avoiding the serious impact of the embedded human ear on the performance of the antenna , that is, to reduce the loss of the headform.
  • the opening of the U-shaped structure formed by the antenna radiator and the reference ground is upward through the ground point, thereby obtaining a lower electric field value in the radiator and the surrounding space , thereby reducing the loss of the head mold and improving communication performance.
  • the electric field value at the first position on the first radiator is the first electric field value
  • the first radiator's The upper part is the part of the first radiator close to the ear wrap.
  • the electric field value at the first position on the first radiator is the second electric field value.
  • the second electric field value is smaller than the first electric field value
  • the first position is any position on the first radiator.
  • the grounding point is set on the lower half of the first radiator, corresponding to the opening upward. It should be noted that, in the opening-down scheme, in addition to the lower electric field value at the same position on the radiator in this example, the electric field distributed in the space around the radiator also has a lower electric field value at the same position.
  • the working frequency band of the terminal antenna includes a first frequency band, and the length of the first radiator is determined according to 1/4 wavelength of the first frequency band.
  • a 1/4 wavelength mode is excited on the first radiator to cover the first frequency band.
  • the first radiator can excite the 1/4 wavelength mode to cover the working frequency band. Therefore, the length of the first radiator may correspond to a dimension of 1/4 wavelength of the working frequency band. The specific implementation can be adjusted around 1/4 wavelength.
  • the terminal antenna further includes a second reference ground disposed on the earbud, and the second reference ground is connected to an end of the first reference ground that is far away from the ground point.
  • a second reference ground disposed on the earbud
  • the flexible board provided in the ear wrap part can be used as a second reference ground
  • the second reference ground can be connected with the flexible board and the hard board in the ear bar part.
  • the working frequency band of the terminal antenna includes a first frequency band, and the sum of the lengths of the first reference ground and the second reference ground is determined according to 1/2 wavelength of the first frequency band.
  • the first reference ground and the second reference ground jointly excite a 1/2 wavelength mode, and the frequency band covered by the 1/2 wavelength mode at least partially overlaps with the first frequency band.
  • the first reference ground and the second reference ground also referred to as the reference ground extension part
  • the mode jointly excited by the first reference ground and the second reference ground can also be other frequency multiplications of the 1/4 wavelength mode, such as 3/4 mode, 1 frequency multiplication mode, etc. for extending 1/4 wavelength bandwidth.
  • the total length of the first reference ground and the second reference ground can be flexibly adjusted corresponding to the excitation mode.
  • the first frequency band includes a Bluetooth frequency band.
  • the terminal antenna can be used to cover the Bluetooth (2.4GHz) frequency band.
  • the first reference ground is realized by a printed circuit board PCB and/or a flexible circuit board FPC. Based on this solution, a specific implementation of the first reference ground is provided. For example, its bearing function for other components can be realized through the combination of rigid board (PCB) and flexible board (FPC).
  • the first radiator is realized by laser direct structuring LDS and/or FPC. Based on the solution, a specific implementation of the antenna is provided.
  • the second reference ground is realized by FPC. Based on this solution, a specific implementation of the second reference ground is provided. For example, the FPC enables the second reference ground to obtain a larger board area in a more complex space in the earbud.
  • the wireless earphone is also provided with a metal dust-proof net assembly
  • the first radiator of the terminal antenna is connected to the metal dust-proof net assembly
  • the metal dust-proof net assembly Static electricity on the terminal returns to ground through the ground point of the terminal antenna.
  • a wireless earphone is provided, and the wireless earphone is provided with the terminal antenna provided in the first aspect and any possible design thereof.
  • the wireless earphones can be a pair of earphones symmetrically arranged on the left ear and the right ear.
  • Each earphone may be provided with the above-mentioned terminal antenna, so based on the setting of the above-mentioned terminal antenna, better communication quality can be obtained.
  • the first reference ground of the wireless earphone is provided with a baseband module and a radio frequency module, and the terminal antenna is sequentially connected to the radio frequency module and the baseband module through the feed.
  • the terminal antenna is connected to the zero potential point on the first reference ground through the ground point.
  • the first reference ground is provided with a first conductive member and a second conductive member
  • the terminal antenna is sequentially connected to the radio frequency module and the baseband module through the feed source, specifically: the terminal antenna passes through The first conductive member at the corresponding position of the feed source is sequentially connected to the radio frequency module and the baseband module.
  • the terminal antenna is connected to the zero potential point on the first reference ground through the ground point, specifically: the terminal antenna is connected to the zero potential point on the first reference ground through the second conductive member corresponding to the ground point.
  • the first conductive element and/or the second conductive element is a conductive spring. Based on this solution, a specific realization of the electrical connection solution is provided.
  • a first antenna matching circuit is provided between the feed source of the terminal antenna and the radio frequency module, and the first antenna matching circuit includes at least one of the following: capacitance, inductance, resistance, variable Capacitors, variable inductors, variable resistors.
  • the first antenna matching circuit is used to adjust the port impedance of the terminal antenna. Based on this solution, a solution for adjusting the impedance of the antenna port to obtain better radiation performance is provided.
  • the first reference ground includes a first PCB and a first FPC.
  • the first conductive part is arranged on the first PCB, the first antenna matching module, the radio frequency module and the baseband module are arranged on the first FPC, and the first conductive part is matched with the first antenna through a connecting cable module connection.
  • the first conductive member and the first antenna matching module are arranged on the first PCB, the radio frequency module and the baseband module are arranged on the first FPC, and the first antenna matching module is connected to the radio frequency through a connecting cable. module connection.
  • the first conductive member, the first antenna matching module and the radio frequency module are disposed on the first PCB, the baseband module is disposed on the first FPC, and the radio frequency module is connected to the baseband module through a connecting cable.
  • a setting based on flexible connecting cables is provided, so that each module on the communication link may not be set on a circuit board at the same time, thereby realizing flexible setting of components.
  • a second antenna matching circuit is provided between the ground point of the terminal antenna and the first reference ground, and the second antenna matching circuit includes at least one of the following: a microstrip line, a capacitor, Inductor, bandpass filter.
  • the response frequency band of the bandpass filter includes the working frequency band of the terminal antenna.
  • the wireless earphone is provided with a metal dust-proof mesh assembly, and the metal dust-proof mesh assembly is used to be arranged near the sound pickup hole provided on the ear bar.
  • the metal dust filter assembly includes a metal dust filter and a metal dust filter gasket that are connected to each other.
  • the metal dust filter gasket is provided with a conductive shrapnel, and the metal dust mesh gasket is connected to the terminal through the conductive shrapnel.
  • the first radiator of the antenna is electrically connected.
  • FIG. 1 is a schematic diagram of a wireless headset usage scenario
  • FIG. 2 is a schematic diagram of the composition of a wireless earphone
  • Fig. 3 is a schematic diagram of antenna implementation in a wireless earphone
  • Fig. 4 is a schematic diagram of the installation position of the antenna in a wireless earphone provided by the embodiment of the present application;
  • FIG. 5A is a schematic composition diagram of a wireless earphone provided by an embodiment of the present application.
  • Fig. 5B is a schematic diagram of a metal dust filter assembly provided in the embodiment of the present application.
  • FIG. 6 is a schematic diagram of an antenna bracket and an antenna provided in an embodiment of the present application.
  • FIG. 7 is a schematic diagram of an antenna solution provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an antenna implementation provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of an antenna-related communication link provided in an embodiment of the present application.
  • FIG. 10A is a schematic diagram of a communication link corresponding to an antenna feed point provided in an embodiment of the present application.
  • FIG. 10B is a schematic diagram of a communication link corresponding to an antenna ground point provided in an embodiment of the present application.
  • FIG. 10C is a schematic diagram of the antenna grounding sheet and feed point setting positions provided by the embodiment of the present application.
  • Figure 11 is a schematic diagram of the comparison of electric field values in different opening directions provided by the embodiment of the present application.
  • Figure 12 is a schematic diagram of the comparison of S-parameter simulations of different opening directions provided by the embodiment of the present application.
  • FIG. 13 is a schematic diagram of another antenna solution provided by the embodiment of the present application.
  • Fig. 14 is a schematic diagram of electric field value distribution of an antenna scheme provided by an embodiment of the present application.
  • FIG. 15 is a schematic diagram of an S-parameter simulation comparison provided by the embodiment of the present application.
  • FIG. 1 it is a schematic diagram of a wireless headset usage scenario.
  • the wireless headset can be worn on the human ear, and communicate with other electronic devices through wireless signals, thereby realizing audio playback.
  • the wireless communication may be communication based on Bluetooth.
  • Other electronic equipment such as a mobile phone
  • a wireless connection such as a Bluetooth connection
  • audio signals are transmitted to wireless earphones through a wireless connection to realize music playback.
  • Another example is to receive audio signals from wireless earphones to implement functions such as voice input. In this way, different from traditional wired earphones, the earphone can be separated from the audio input/output device, which is more convenient to use.
  • an antenna whose working frequency band covers the Bluetooth frequency band (such as 2.4GHz-2.483GHz) can be set in the wireless headset for wireless communication with the audio output device.
  • the wireless earphone may include an ear wrap part that can be put into a human ear, and an ear bar part that is exposed when worn.
  • the antenna of the wireless earphone can be arranged in the ear bag.
  • a battery may be provided in the ear bar for powering the wireless earphone. It should be understood that, due to the influence of the battery on the performance of the antenna, the arrangement of the battery in the earbar part is also one of the reasons why the antenna is arranged in the earbag part.
  • the antenna in the wireless headset can have different forms.
  • the antennas commonly used in wireless earphones may be IFA antennas or PIFA antennas.
  • an IFA antenna is taken as an example.
  • the IFA antenna may include a strip radiator, a feed source may be provided on the radiator for feeding the IFA antenna, and a grounding point may also be provided on the radiator.
  • the feed can be set at one end of the radiator or near the end, and the grounding point can be set at a part of the radiator close to the feed.
  • a PIFA antenna is used as an example. Similar to the IFA antenna, the radiator of the PIFA antenna may be provided with a feed source and a ground point. Different from the IFA antenna, the radiator of the PIFA antenna generally has a larger area, and better radiation performance is obtained through surface radiation. For example, as shown in FIG. 3 , the radiator of the PIFA antenna may be rectangular. As an example, the length of the IFA antenna and/or the PIFA antenna may be determined according to 1/4 of the working wavelength.
  • the radiation performance of the antenna can be identified by the efficiency in free space (for example, called free space efficiency) and the efficiency under head mold (for example, called head mold efficiency).
  • the free space efficiency may be the efficiency of the antenna in a free space (Freespace).
  • the headform efficiency may be the efficiency of the antenna system (such as the wireless headset provided with the antenna in the above example) when worn on the headform. Headform efficiency can be understood as the efficiency of the human head for radiation absorption and reflection based on free space radiation.
  • the loss of the radiation performance of the antenna due to radiation absorption by the human head may be referred to as headform loss.
  • the efficiency in different scenarios may include radiation efficiency and system efficiency.
  • the radiation efficiency can identify the highest efficiency that the antenna system can achieve under the condition of complete impedance matching in the current environment (such as in free space, or under the head mold, etc.).
  • the system efficiency may identify the efficiency of the antenna system under the current environment and the current port matching state. That is to say, the radiation efficiency may indicate the maximum radiation capability of the antenna system, and the system efficiency may indicate the actual efficiency of the antenna in the current state.
  • the system efficiency can generally be improved. Under the condition that the radiation efficiency remains unchanged, the purpose of improving the system efficiency can also be achieved by improving the port matching.
  • the ability to communicate between wireless earphones around the headform can be identified by the head-around gain of the antenna.
  • the head-around gain may be an average gain value of the wireless earphone near the ear on the non-wearing side. The higher the head-around gain, the stronger the communication capability between wireless earphones bypassing the head-form.
  • the average free space efficiency of the headphone antenna is generally around -6dB
  • the headform drop is generally 6dB to 8dB when worn
  • the average efficiency of the headform is -12dB to -14dB.
  • this part of the gain is mainly formed by diffraction.
  • the reference industry generally ranges from -28dBi to -32dBi. That is to say, the current solutions are not ideal in terms of head-form efficiency or head-around gain, which affects the communication quality of wireless earphones.
  • the antenna solution provided by the embodiments of the present application can be applied to portable mobile terminals such as wireless earphones, and can reduce head-form loss, thereby achieving the effects of improving head-form efficiency and head-winding gain.
  • the antenna solution provided by the embodiment of the present application can generate a smaller electric field value during the working process through the configuration of the antenna structure under the same conditions (such as the same environment, the same input power, etc.), so as to reduce the head mold Loss effect, thereby improving the communication quality of the wireless headset.
  • the antenna solution with a smaller electric field value may also be referred to as a low-field antenna.
  • the antenna solution provided in the embodiment of the present application can be applied to wireless earphones to support wireless connections between the wireless earphones and other terminal devices, and can also be used to support mutual communication between paired wireless earphones.
  • the low-field antenna can also be applied to other electronic devices with similar communication requirements, such as headsets, smart glasses, etc., which will not be described here one by one.
  • FIG. 4 shows a schematic composition diagram of an earphone 400 provided by an embodiment of the present application.
  • the earphone 400 may also include an ear bag part 402 and an ear bar part 401 .
  • the ear wrap part 402 is the part where the earphone 400 is worn in the human ear.
  • the ear bar part 401 may be the part exposed outside the human ear when the earphone 400 is worn.
  • the ear bar part 401 may further include a connecting part and an ear post part.
  • the ear post part may be a part arranged along the Y direction in the ear bar part 401 .
  • the connecting part may be a part of the ear bar part 401 connecting the ear wrap part 402 and the ear post part.
  • an antenna may be provided to support the wireless connection function between the earphone 400 and other terminal devices (eg, audio input and output devices such as mobile phones).
  • the antenna can also be used to support wireless interconnection between earphones 400 set in pairs.
  • the earphone 400 may also be provided with a battery for supplying power to the earphone 400 to output.
  • the battery can also be arranged in the connection part in the ear bar part 401 .
  • the antenna can be arranged on the earbar part 401 .
  • the battery can be arranged in the ear bag part 402 . Therefore, when the earphone 400 is worn and working, the antenna radiator will not be wrapped by the human ear, thereby reducing the influence of the human body (such as the human ear, head, etc.) on the antenna operation.
  • the human body such as the human ear, head, etc.
  • the earphone 400 shown in FIG. 4 may also be provided with multiple hardware components for realizing the functions of the earphone.
  • FIG. 5A it is a schematic composition diagram of another earphone provided by the embodiment of the present application.
  • the earphone 500 may be a specific composition of the earphone 400 shown in FIG. 4 . It should be understood that the composition of the earphone 500 shown in FIG. 5A does not constitute a specific limitation on the earphone, but is only a possible example. In some other embodiments, the earphone 500 may also include more or fewer components. The embodiment of the present application does not limit the specific composition of the earphone.
  • the earphone 500 may include a battery 501, a speaker assembly 502, a microphone (not shown in FIG. 5A), a first circuit board 504, a second circuit board 505, a main chip 506, and a touch control assembly. 507 , components such as a charging module (not shown in FIG. 5A ), an antenna support 508 , and an antenna 509 .
  • the appearance part of the ear wrap part 402 of the earphone 500 may be the ear wrap part 515 .
  • components such as a battery 501, a speaker assembly 502, and a second circuit board 505 may be provided inside the ear shell 515 .
  • the speaker assembly 502 and the battery 501 are connected to the second circuit board 505 .
  • the second circuit board 505 can be a flexible circuit board, which is convenient for compact layout and wiring in the irregular space in the ear bag part 402 .
  • the speaker assembly 502 is used to amplify the audio signal processed by the main chip 506 and send it to the human ear.
  • the battery 501 supplies power to the headset 500 as a whole.
  • the outer periphery of the earbar part 401 of the earphone 500 may include an outer earbar shell part 510 and an inner earbar shell part 511 .
  • the outer shell part 510 of the ear bar and the inner shell part 511 of the ear bar can be used to form the appearance surface of the ear bar part 401 , and other functional components can be arranged in the appearance surface.
  • functional components included in the earbar portion 401 may include a first circuit board 504 and an antenna bracket 508 .
  • the ear bar part 401 may further include a main chip 506 disposed on the first circuit board 504 , a touch control component 507 , and an antenna 509 disposed on the antenna bracket 508 .
  • the first circuit board 504 may also be provided with a microphone (not shown in FIG. 5A ).
  • the microphone can be used to collect the user's voice signal.
  • the number of microphones can be one or more.
  • the microphone can convert the sound signal into an electrical signal and transmit it to the main chip 506 .
  • the main chip 506 can transmit the electrical signal corresponding to the sound signal to the terminal device through the wireless transmission link between the earphone 500 and the terminal device, so as to achieve the voice function.
  • one or more sound pickup holes may be provided on the outer shell member 510 of the ear bar. Taking two sound pickup holes as an example, a first sound pickup hole 512 and a second sound pickup hole 513 may be provided on the ear bar outer shell 510 .
  • a dust-proof net assembly may be provided at a position corresponding to the sound pickup hole.
  • corresponding dust filter components may be provided at corresponding positions of the first sound pickup hole 512 and/or the second sound pickup hole 513 .
  • a dust filter assembly 514 is disposed at a position corresponding to the first sound pickup hole 512 .
  • the material constituting the dust filter assembly 514 may be a conductive material or a non-conductive material.
  • the dust filter assembly 514 is made of metal material as an example.
  • the avoidance area of the antenna 509 on the antenna bracket 508 may be larger than the area of the first sound pickup hole 512 .
  • the key components of the metal dust filter assembly 514 may include the metal dust filter 514A, and the metal dust filter gasket 514B.
  • the metal dust-proof net 514A can be fixed on the inner surface of the ear bar outer shell 510 by glue, and the metal dust-proof net 514A and the metal dust-proof net gasket 514B can use large-area conductive glue or spot welding Make an electrical connection to make the two parts of the metal conduct.
  • FIG. 5B shows a top view of the metal dust filter 514A and the metal dust filter gasket 514B included in the metal dust filter assembly 514 .
  • FIG. 5B shows an oblique side view of the metal dust filter 514A and the metal dust filter gasket 514B included in the metal dust filter assembly 514 . It should be understood that the metal dust filter assembly 514 generally needs to be grounded, so as to protect nearby electronic devices from being affected by static electricity on the metal dust filter assembly 514 .
  • the metal dust filter gasket 514B may be directly electrically connected to the radiator of the antenna 509 .
  • the metal dustproof mesh gasket 514B is elastically connected to the radiator of the antenna 509 by arranging conductive shrapnel. In this way, the metal dust filter assembly 514 can be used as a part of the radiator of the antenna 509 to perform auxiliary radiation during the working process of the antenna 509 . By increasing the area of the antenna 509, the performance of the antenna 509 is improved.
  • the antenna 509 itself has a path to the ground, it also realizes the electrostatic conduction from the metal dust filter assembly 514 to the ground, and realizes the multiplexing of functions of the same structural component.
  • the first circuit board 504 may be implemented by a printed circuit board (printed circuit board, PCB) and/or a flexible circuit board (Flexible Printed Circuit, FPC).
  • the first circuit board 504 may be realized by combining a PCB and an FPC.
  • the first circuit board 504 may be realized by a simple FPC or PCB.
  • the touch component 507 can be realized through related settings on the FPC.
  • the touch component 507 can realize the touch control function of the earphone 500 .
  • the earphone 500 can receive a user's instruction through the touch component 507 .
  • the user's instruction can realize corresponding input through operations such as touch and slide.
  • a sensing part may be disposed in the touch component 507 , and the sensing part may be disposed on the inner surface of the outer shell part 510 of the ear bar.
  • the control chip of the touch control unit can be arranged on the first circuit board 504 .
  • the first circuit board 504 one or more circuits formed by multiple electronic devices may also be arranged. This circuit can be used to cooperate with the main chip 506 to realize the processing of analog signals and/or digital signals. Some circuits on the first circuit board 504 may be connected to the antenna 509 for feeding power to the antenna 509 in a transmitting scenario and/or receiving signals from the antenna 509 for processing in a receiving scenario.
  • the circuit coupling the antenna 509 and the main chip 506 may be a radio frequency circuit.
  • One or more filtering devices, signal amplifying devices, etc. may be provided on the radio frequency circuit.
  • the radio frequency circuit can be used for signal processing in the radio frequency domain, where the signal in the radio frequency domain can be an analog signal.
  • various components and circuits provided on the radio frequency circuit may be collectively referred to as a radio frequency module.
  • the antenna 509 connected to the radio frequency module may be set on the antenna bracket 508 .
  • the antenna bracket 508 may be located between the outer ear bar housing member 510 and the first circuit board 504 .
  • the antenna 509 correspondingly arranged on the antenna bracket 508 may be implemented as any of the following: ceramic antenna, steel sheet antenna, laser direct structuring (LDS) antenna or in-mold injection antenna, etc.
  • FIG. 6 shows a schematic diagram of an antenna bracket 508 and a corresponding antenna 509 .
  • (a) in FIG. 6 is a schematic diagram of the antenna bracket 508 .
  • the antenna 509 shown in (b) of FIG. 6 may be assembled or provided on the antenna bracket 508 .
  • the shape of the antenna bracket 508 may match the projection of the ear bar part 401 on the XOY plane. As a result, the antenna 509 arranged on the antenna support 508 can obtain the largest area.
  • the antenna bracket 508 can move at the corresponding positions of the first sound hole 512, the second sound hole 513, and the touch assembly 507. line avoidance.
  • the antenna bracket 508 may also include a part of the Z-direction overlapping area with the touch control component (the first trace overlapping area shown in (a) of FIG. 6 ). In the overlapping area of the first wiring, the antenna bracket 508 can be adjusted through the Z-direction recess, and while ensuring the integrity of the antenna bracket 508, a height space is reserved for the touch component 507 to realize coexistence between components.
  • the touch component 507 needs to arrange metal wires and the like to realize signal transmission. Since the metal trace is relatively close to the antenna 509, it may affect the radiation of the antenna (such as introducing clutter, reducing efficiency, etc.).
  • a filtering component may be provided on the metal wiring (and/or the corresponding wiring path of the circuit board), so as to reduce or eliminate the influence of the metal wiring on the antenna.
  • a filter circuit corresponding to the Bluetooth frequency band can be set on the metal wiring to prevent the clutter generated by the metal wiring (such as the wiring in the touch component 507) from falling.
  • the bluetooth frequency band so as to achieve the effect of reducing or eliminating the influence of the touch component 507 on the antenna.
  • An antenna 509 as shown in (b) in FIG. 6 may be provided on the antenna bracket 508 as shown in (a) in FIG. 6 .
  • the antenna 509 may correspond to the largest radiator area.
  • the area of the antenna radiator may also be smaller than the area shown in (b) of FIG. 6 .
  • the structural relationship between the antenna radiator and the antenna bracket 508 may be flexibly set.
  • the FPC may be mounted on the antenna bracket 508 .
  • the antenna radiator may be etched on the surface of the antenna bracket 508 by using the LDS process.
  • the antenna 509 solutions provided in the embodiments of the present application can all be applied to the composition shown in FIG. 5A or FIG. 6 .
  • the low electric field antenna 509 provided in the embodiment of the present application may be realized based on the antenna bracket 508 and the antenna 509 as shown in FIG. 6 .
  • the antenna solution provided by the embodiment of the present application is exemplarily described below.
  • FIG. 7 is a schematic diagram of a low electric field antenna provided in an embodiment of the present application.
  • the antenna may be arranged in the earbar portion.
  • a feed source that is, a feed point
  • a ground point may be set on the antenna.
  • FIG. 7 is an example of an antenna solution provided in a wireless earphone according to an embodiment of the present application.
  • the antenna may include a radiator, and the radiator may be L-shaped.
  • One end of the radiator may be provided with a ground point G1.
  • the other end of the radiator may be provided with a feed F1.
  • the position of the ground point may be different from that of one end of the radiator as shown in FIG. 7 .
  • the ground point G1 can be set at any position on the lower half of the antenna radiator.
  • the position of the feed source F1 on the radiator can be flexibly adjusted according to the position of the ground point G1.
  • the length of the radiator may be 1/4 wavelength of the working frequency band (such as the Bluetooth frequency band).
  • the grounding point G1 may be relatively fixed, and the position of the corresponding feed source F1 may be flexibly selected.
  • the opening of the U-shaped structure formed by the antenna radiator and the reference ground may be upward. That is to say, when the antenna is arranged in the wireless earphone, when the user wears the wireless earphone, the opening of the U-shaped structure can point to the top of the user's head instead of the user's chin. From another perspective, in the antenna solution provided by the embodiment of the present application, the grounding point may be set on the lower half of the radiator.
  • FIG. 8 is the hard board part (such as the first hard board 801 ) in the first circuit board 504 .
  • the hard board part may be a part of the PCB in the first circuit board 504 .
  • the first circuit board 504 may also include a part made of a flexible board (such as FPC).
  • FPC flexible board
  • a first conductive member 802 and a second conductive member 803 may be included.
  • the first conductive member 802 and the second conductive member 803 can be used to realize electrical connection between the antenna radiator on the antenna bracket and the corresponding circuit on the first hard board 801 .
  • the first conductive member 802 and/or the second conductive member 803 may realize their functions through electrical connection components such as conductive foam, conductive shrapnel, and conductive thimbles.
  • electrical connection components such as conductive foam, conductive shrapnel, and conductive thimbles.
  • the elastic piece at the first conductive member 802 can realize the connection between the corresponding circuit on the first hard board 801 and the antenna radiator by springing. conduction.
  • the first conductive member 802 may be connected to the first conductive point 804 on the antenna 509, so as to realize a feed point for the antenna.
  • the second conductive member 803 can be connected to the second conductive point 805 on the antenna 509, so as to realize the grounding of the antenna.
  • the first conductive member 802 and/or the second conductive member 803 may also realize their electrical connection function through other conductive processes.
  • the corresponding pads on the first hard board 801 can be welded (such as spot welding) to the exposed pads at the corresponding positions on the antenna radiator, so as to realize the connection of the first conductive member 802. Electrical connection function.
  • connection components such as the first conductive member 802 and the second conductive member 803 provided on the first hard board 801 shown in (a) in FIG. 8 , as shown in (b) in FIG. 8
  • the connection between the first conductive point 804 and the first conductive member 802 may correspond to the feed source F1 (or feed point) of the antenna 509 .
  • the connection between the second conductive point 806 and the second conductive member 803 may correspond to the ground point of the antenna 509 .
  • the arrangement manner of the first conductive point 804 and the second conductive point 805 on the antenna 509 may correspond to the specific preparation manner of the antenna 509 .
  • the outer surface of the antenna support can be coated with an LDS corresponding material that can be converted from a non-conductor to a conductor after lasering.
  • the corresponding antenna radiator can be obtained by performing laser along the preset antenna line on the surface of the antenna bracket.
  • the antenna is mounted on an FPC on an antenna bracket as an example.
  • the external surface of the antenna is generally coated with non-conductive ink to protect internal wiring.
  • a first conductive point 804 and a second conductive point 805 may be provided on the antenna.
  • the first conductive point 804 and the second conductive point 805 may be exposed copper points on the FPC of the antenna.
  • the positions of the first conductive point 804 and the second conductive point 805 may correspond to the first conductive element 802 and the second conductive element 803 respectively.
  • the antenna FPC can be mounted on the antenna bracket, and when the antenna bracket and the first hard board 801 are assembled in the earphone, the first conductive point 804 can be electrically connected to the first conductive member 802, and the second conductive point 805 may be electrically connected to the second conductive member 803 .
  • the second conductive point 805 can be used for grounding through the second conductive member 803 .
  • the first conductive point 804 may be connected to the radio frequency circuit corresponding to the feed source through the first conductive member 802 .
  • the effect of feeding through the first conductive point 804 and grounding through the second conductive point 805 is realized.
  • the U-shaped structure formed by the antenna and the first hard plate 801 serving as a reference ground can have a structural feature with an opening upward, thereby obtaining the effect of low electric field distribution.
  • the antenna feed F1 can be connected to the radio frequency module through the first matching module, and can be connected to the baseband module through the radio frequency module.
  • the baseband module can realize its functions through a baseband processor, or realize its functions through other components with digital processing capabilities (such as a microprocessor (MCU), etc.).
  • the antenna ground point G1 may be connected to the reference ground on the first hard board 801 through the second matching module.
  • the baseband module may also be referred to as a communication module.
  • the matching circuit may include at least one of the following components: capacitor, inductor, resistor, variable capacitor, variable inductor, variable resistor wait.
  • the components in the matching circuit can be connected in series or in parallel.
  • the quantity of the components can be flexibly adjusted according to actual needs. It should be understood that, taking the first matching circuit provided between the first conductive point 804 (that is, the feed source) and the radio frequency circuit as an example, by adjusting the type, quantity and/or value of the components on the first matching circuit, The matching of the antenna port can be realized, so as to achieve the effect of tuning the corresponding resonance of the antenna to the working frequency band.
  • the 1/4 wavelength resonance of the antenna can be tuned to the Bluetooth working frequency band through port matching.
  • a second matching circuit may be provided between the second conductive point 805 (that is, the ground point) and the reference ground of the first rigid board 801, and by adjusting the The type, quantity and/or value of the components can achieve matching to the ground terminal, and can also obtain the effect of tuning the corresponding resonance of the antenna to the working frequency band.
  • the functions of the first matching circuit and/or the second matching circuit may also be implemented in other forms, such as a band-pass filter, a band-stop filter, and the like.
  • the embodiment of the present application does not limit the specific implementation of the first matching circuit and/or the second matching circuit.
  • the working frequency band of the antenna includes the Bluetooth frequency band.
  • the second matching circuit can be set to exhibit a band-pass characteristic in the Bluetooth frequency band, so that the current in the Bluetooth frequency band can return to ground through the second matching circuit.
  • the second matching module may also realize direct current return to ground through a microstrip line or the like.
  • the setting of the first matching circuit and/or the second matching circuit may be performed according to specific situations.
  • the first matching circuit is set to tune port matching, and the second matching circuit is not set to tune ground.
  • the tuning ground of the second matching circuit is set, and the tuning port matching of the first matching circuit is not set.
  • the first matching circuit is set to tune port matching, and the second matching circuit is set to tune ground.
  • the tuning port of the first matching circuit is not set to match, and the second matching circuit is not set to be grounded for tuning.
  • connection relationship between the modules on the communication link shown in FIG. 9 Combining the connection relationship between the modules on the communication link shown in FIG. 9 and the functions of the above modules. It should be understood that, in different implementations, the connection relationship between modules on the communication link may be flexibly set according to actual conditions. The number of each module can also be adjusted accordingly.
  • FIG. 10A is an example of setting conditions of various modules on several possible communication links provided by the embodiment of the present application.
  • the communication link where the first conductive point 804 (ie, the feed source F1 ) is located is taken as an example for illustration.
  • the antenna can be connected to the first conductive member 802 , the first antenna matching module, the radio frequency module and the communication module in sequence through the first conductive point 804 .
  • the first antenna matching module may be a set of devices mainly based on inductance and capacitance to adjust the input impedance of the antenna or limit the boundary conditions of the antenna.
  • the first antenna matching module may adopt a high-impedance matching form (such as a series of large inductors, a series of small capacitors, or a band-stop matching form).
  • the first antenna matching module may also be provided with a parallel position, which is used to set a parallel inductance and capacitance when necessary, so as to adjust the resonant position of the antenna.
  • the first antenna matching module may include one or more devices.
  • the first conductive member 802 is a connecting device for connecting the antenna matching module and the conductive point of the antenna, and may be a conductive device such as a shrapnel or conductive foam.
  • the antenna can be fed through the link shown in (a) in FIG. 10A .
  • connection cables may also be provided between the modules.
  • the connecting cable may include at least one of the following: coaxial cable, microstrip cable, liquid crystal polymer (Liquid Crystal Polymer, LCP) and the like.
  • the connection cable can be used for transmission of feed signals between boards.
  • the connection cable can be used for the transmission of the feed signal between the first circuit board 504 and the second circuit board 505 as shown in FIG. 5A .
  • the connection cable can be used for the transmission of the feed signal between the first rigid board 801 on the first circuit board 504 and other circuit boards (such as flexible boards).
  • the connecting cable may be arranged between the first conductive member 802 and the first antenna matching module. Therefore, the first conductive member 802 can be arranged on a circuit board (such as the first hard board 801), and correspondingly, the first antenna matching module, the radio frequency module and the communication module can be arranged on another circuit board (such as the first circuit board 801). flex portion of the board, and/or the second circuit board). In this way, the separation of module settings can be realized, and the design flexibility can be improved.
  • a circuit board such as the first hard board 801
  • the first antenna matching module, the radio frequency module and the communication module can be arranged on another circuit board (such as the first circuit board 801). flex portion of the board, and/or the second circuit board).
  • the connecting cable may be arranged between the radio frequency module and the first antenna matching module. Therefore, the first conductive member 802 and the first antenna matching module can be arranged on one circuit board (such as the first hard board 801), and correspondingly, the radio frequency module and the communication module can be arranged on another circuit board (such as the first circuit board flex portion of the board, and/or the second circuit board). In this way, the separation of module settings can be realized, and the design flexibility can be improved.
  • a connection cable may be provided between the radio frequency module and the communication module.
  • the first conductive member 802 the first antenna matching module and the radio frequency module can be arranged on one circuit board (such as the first hard board 801), and correspondingly, the communication module can be arranged on another circuit board (such as the first circuit board flex portion of the board, and/or the second circuit board). In this way, the separation of module settings can be realized, and the design flexibility can be improved.
  • the specific implementation of the first matching module may be flexibly selected according to actual port matching conditions. For example, in some implementations, if the original port matches well, the first matching module may not be set, so as to simplify the module setting.
  • the communication link where the second conductive point 805 ie, the ground point G1 ) is located is taken as an example for illustration.
  • the antenna can be connected to the second conductive element 803 , the second antenna matching module and the reference ground (such as the reference ground provided by the first circuit board) sequentially through the second conductive point 805 .
  • the second conductive member 803 is a connecting device connecting the antenna matching module and the antenna conductive point, and may be a conductive device such as a shrapnel or conductive foam.
  • the second antenna matching module may include small inductors, large capacitors, or bandpass matching.
  • the large electric field area of the antenna can be adjusted to the +Y direction of the ear bar, that is, on the top of the ear bar, and the large current area is located in the -Y direction of the ear bar, that is, at the top of the ear bar. bottom. In addition, it can also play the role of lowering the metal dust filter assembly to the ground.
  • the first and/or second matching module may also include a parallel transient voltage suppression diode (Transient Voltage Suppression, TVS), used to prevent static electricity from invading the communication path, and make static electricity go to the ground as soon as possible.
  • the TVS may be arranged in the first antenna matching module corresponding to the first conductive member 802, and the static electricity is introduced into the floor through parallel connection.
  • the antenna may also adopt a direct current grounding scheme.
  • the antenna may be connected to the second conductive member 803 and the reference ground (such as the reference ground provided by the first circuit board) sequentially through the second conductive point 805 .
  • the setting overhead of the second matching module is saved by connecting the direct current to the ground.
  • the arrangement of the first conductive member 802 and the second conductive member 803 as shown in (a) in FIG. 8 is the same as that shown in (b) in FIG.
  • the arrangement positions of the first conductive point 804 and the second conductive point 805 shown in are an example.
  • the electrical connection positions on the antenna and on the first hard board 801 may also be different from the examples shown in FIG. 8 .
  • FIG. 10C it is an example of setting positions of several first conductive points 804 and second conductive points 805 on the antenna provided in the embodiment of the present application.
  • first conductive point 804 as the feed source F1 and the second conductive point 805 as the ground point G1 as an example.
  • the positions of the first conductive point 804 and the second conductive point 805 on the first hard board 801 correspond thereto, and details are not repeated here.
  • the positions of the first conductive point 804 and the second conductive point 805 may be similar to those shown in (b) in FIG. 8 .
  • the position of the ground point G1 (that is, the second conductive point 805) can be unchanged, for example, it is set on the lower half radiator of the antenna, and the position of the feed source F1 can be flexibly adjusted of.
  • the feed F1 may be arranged on the antenna radiator on the left radiator close to the first sound pickup hole (ie, the upper sound pickup hole).
  • the feed source F1 can be set on the top of the antenna radiator.
  • the feed source F1 may be arranged on the right radiator of the antenna radiator close to the first sound pickup hole.
  • the feed source F1 can be set on the right side near the middle of the antenna radiator.
  • the feed source F1 can be set on the antenna radiator close to the upper side of the ground point G1. As shown in 10-6, the feed source F1 can be set at the bottom of the antenna radiator. As shown in 10-7, the feed source F1 may be arranged on the antenna radiator on the left radiator close to the second sound pickup hole (that is, the lower sound pickup hole). As shown in 10-8, the feed source F1 can be set on the left side of the antenna radiator close to the middle.
  • the position of the ground point G1 may also be flexibly adjusted, for example, it may be set on the lower part of the radiator of the antenna. Take the feed F1 disposed on the antenna radiator on the left radiator close to the first sound pickup hole (ie, the upper sound pickup hole) as an example.
  • the ground point G1 may be set at the bottom of the antenna radiator.
  • the ground point G1 may be set on the antenna radiator on the left radiator near the second sound pickup hole (ie, the lower sound pickup hole).
  • the ground point G1 may be set on the right radiator of the antenna radiator close to the second sound pickup hole (that is, the lower sound pickup hole).
  • the positions of the conductive dots 805 may also alternate with each other.
  • the U-shaped structure formed by the antenna radiator and the reference ground can be opened upward through the ground point, so that when the antenna is working, the large electric field area is located In the +Y direction of the ear bar, that is, at the top of the ear bar.
  • the high current area is located in the -Y direction of the ear bar, that is, at the bottom of the ear bar.
  • a lower electric field distribution can be obtained to reduce the loss of the head mold.
  • the field value distribution of the two antenna schemes with the aperture upward and the aperture downward is compared through simulation.
  • the darker the color of the electric field distribution that is, the higher the gray value
  • FIG. 11 shows the arrangement scheme of the antenna with the opening upward and the distribution of the corresponding electric field.
  • the ground point G1 may be set at the end of the radiator away from the earbud.
  • the grounding point G1 can realize its grounding function by connecting with the ground (such as a printed circuit board as a reference ground, etc.).
  • the feed source F1 may be arranged at the end of the radiator close to the ear bag.
  • FIG. 11 shows the arrangement scheme of the antenna with the opening downward and the distribution of the corresponding electric field.
  • the grounding point G2 may be set at the end of the radiator close to the earbud.
  • the grounding point G2 can also realize its grounding function by connecting with the floor.
  • the feed source F2 may be set at the end of the radiator away from the ear wrap.
  • the electric field value is smaller and the distribution area is less, mainly concentrated near the ear bag.
  • the electric field value is larger and the distribution area is more, mainly concentrated near the end of the ear rod.
  • the upward-opening solution with a larger electric field distribution area ie the solution provided by the present application
  • the solution provided by the embodiment of the present application not only has a lower spatial electric field value distribution, but also has a lower electric field distribution on the radiator.
  • the antenna solution provided by the embodiment of the present application with a lower electric field value distribution has a corresponding lower loss of the headform.
  • the following description will be made in conjunction with the S-parameter simulation in the headform scenario shown in FIG. 12 .
  • the upward-opening scheme has better radiation performance.
  • the electric field simulation shown in FIG. 11 it can be proved that in the foregoing example, under the same other conditions, the low electric field type antenna with lower electric field value distribution can have better headform radiation performance.
  • the composition of the antenna solution is described from the perspective of setting the feed source and the ground point.
  • Antenna schemes having the characteristics of setting the above-mentioned feed source and ground point may specifically be IFA, PIFA, left-handed (CRLH), T-shaped antenna, and the like.
  • the embodiment of the present application does not limit the specific implementation of the low electric field antenna with an upward opening.
  • the resonance covering the working frequency band can be obtained by excitation when the antenna radiator works at 1/4 wavelength.
  • the embodiment of the present application also provides an antenna solution, which can reuse the reference ground and obtain double resonance near the working frequency band. Therefore, the distribution area of the electric field during the working process of the antenna can be further increased, thereby reducing the field value of the electric field at each point. In turn, the loss of the head mold is further reduced, so that the wireless headset can obtain better communication quality.
  • the part of the reference ground far away from the ground point can also be connected to the extension part of the reference ground.
  • the extended part of the reference ground can also be a zero-potential reference similar to the reference ground.
  • the extended part of the reference ground when the antenna solution is set in the earphone, can pass through the flexible board part set in the first circuit board of the ear bar part and set in the ear bag part
  • the second circuit board (such as the flexible board corresponding to the second circuit board) is jointly formed.
  • the reference ground extension part and the reference ground can jointly excite the 1/2 wavelength mode, thereby forming a dual resonance effect.
  • the extended part of the reference ground and the reference ground can also jointly stimulate the frequency doubling of the 1/2 wavelength mode, such as the 1 times wavelength mode, the 3/2 wavelength mode, etc., for use with 1
  • the /4 wavelength modes together form a dual resonance covering the working frequency band.
  • the extended part of the reference ground and the reference ground jointly excite the 1/2 wavelength mode as an example.
  • the length of the antenna radiator can be determined according to the 1/4 wavelength of the working frequency band, so that the 1/4 wavelength mode is excited to cover the working frequency band.
  • the total length of the extended part of the reference ground and the reference ground may be determined according to 1/2 wavelength of the working frequency band, so as to excite the 1/2 wavelength mode to cover the working frequency band.
  • the total length of the first circuit board and the second circuit board can be controlled so as to meet the above size requirements, and the excitation 1/2 wavelength mode covers the working frequency band. For example, if the first circuit board and the second circuit board constitute the reference ground, the sum of the lengths of the first circuit board and the second circuit board may correspond to 1/2 wavelength.
  • components such as inductors can be arranged at appropriate positions, so as to increase the length of the reference ground.
  • a band stop network based on the working frequency band may be set at an appropriate position, so as to adjust the electrical length of the reference ground to an appropriate position.
  • the opening of the antenna since the opening of the antenna is set upward, it can have the effect of low electric field distribution, so that the whole antenna system has low head-form loss. At the same time, due to the coverage of the double resonance described in the above example, the working performance of the antenna is further improved.
  • the electric field simulation results shown in FIG. 13 are combined with the electric field simulation effects of the opening-up scheme and the opening-down scheme shown in FIG.
  • the electric field distribution is extended from the ear bar to the ear wrap, so that under the same input power, the electric field distribution range is larger and the local electric field value is lower.
  • the electric field simulation that at the antenna opening (that is, the end of the antenna radiator close to the ear bag), the field value on the radiator or in the surrounding space is lower than that before the expansion part of the reference ground is added.
  • the upward plan also has a significant decline. Combined with the effect of the aforementioned opening-up scheme, the scheme provided in this example has less headform loss and better antenna performance. The following description will be made in conjunction with the S-parameter simulation results shown in FIG. 15 .
  • the length corresponding to at least part of the antenna radiator and the first circuit board and the second circuit board can also be 1/2 wavelength of the working frequency band.
  • the excited 1/2 wavelength mode may be located in the low frequency direction of the working frequency band. Therefore, it can be used to expand the bandwidth in the low-frequency direction of the working frequency band and improve the performance in the low-frequency direction.
  • the 1/4 wavelength mode excited on the antenna radiator can be shifted to the high frequency direction of the working frequency band, so as to improve the high frequency performance of the working frequency band through the 1/4 wavelength mode.
  • the excited 1/2 wavelength mode may be located in the high frequency direction of the working frequency band. Therefore, it can be used to expand the high-frequency direction bandwidth of the working frequency band and improve the high-frequency direction performance.
  • the 1/4 wavelength mode excited on the antenna radiator can be shifted to the low frequency direction of the working frequency band, so as to improve the low frequency performance of the working frequency band through the 1/4 wavelength mode.
  • the system efficiency of the dual-wavelength solution is improved to within -10dB, which is significantly higher than that of the single-wavelength solution.
  • the radiation efficiency has also been significantly improved (for example, both are within -10dB).
  • the upward-opening solution provided by the embodiment of the present application whether it is single-wave or double-wave, has a significant improvement compared to the existing solution.
  • the loss of the head-form can be reduced, and then when it is applied to an electronic device (such as an earphone) in a head-form scene, the communication quality of the electronic device can be significantly improved.

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Abstract

Selon des modes de réalisation, la présente demande se rapporte au domaine technique des antennes. Sont divulgués un écouteur sans fil et une antenne de terminal. La présente demande permet de résoudre le problème de mauvaise performance de communication d'un écouteur sans fil provoqué par une usure élevée et une déchirure d'une forme de tête. L'écouteur sans fil comprend une partie bouchon d'oreille et une partie tige d'oreille. L'antenne du terminal comprend un premier rayonneur et une première masse de référence, qui sont agencés dans la partie tige d'oreille. Une source d'alimentation et un point de mise à la terre sont disposés sur le premier rayonneur, le premier rayonneur est relié à la première masse de référence au moyen du point de mise à la terre, le point de mise à la terre est disposé sur une moitié inférieure du premier rayonneur, et la moitié inférieure du premier rayonneur est la partie du premier rayonneur qui est éloignée de la partie bouchon d'oreille. L'antenne du terminal et un filet métallique antipoussière sont agencés dans l'écouteur sans fil. Le filet métallique antipoussière comprend un filet métallique antipoussière et un joint filet métallique antipoussière, qui sont en communication l'un avec l'autre. Le filet métallique anti-poussière est connecté électriquement au joint du filet métallique anti-poussière, et le joint du filet métallique anti-poussière est relié élastiquement à une antenne au moyen d'une pièce élastique conductrice, de sorte que le filet métallique anti-poussière est mis à la terre de manière électrostatique, ce qui empêche le filet métallique anti-poussière d'affecter l'antenne.
PCT/CN2022/117660 2021-12-31 2022-09-07 Écouteur sans fil et antenne de terminal WO2023124214A1 (fr)

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