WO2023116081A1 - 一种柔性安装连接结构及相应的等离子体处理器 - Google Patents

一种柔性安装连接结构及相应的等离子体处理器 Download PDF

Info

Publication number
WO2023116081A1
WO2023116081A1 PCT/CN2022/119023 CN2022119023W WO2023116081A1 WO 2023116081 A1 WO2023116081 A1 WO 2023116081A1 CN 2022119023 W CN2022119023 W CN 2022119023W WO 2023116081 A1 WO2023116081 A1 WO 2023116081A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
connection structure
flexible installation
groove
deformation
Prior art date
Application number
PCT/CN2022/119023
Other languages
English (en)
French (fr)
Inventor
王明明
徐朝阳
Original Assignee
中微半导体设备(上海)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中微半导体设备(上海)股份有限公司 filed Critical 中微半导体设备(上海)股份有限公司
Priority to KR1020247013979A priority Critical patent/KR20240065169A/ko
Publication of WO2023116081A1 publication Critical patent/WO2023116081A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Definitions

  • the invention relates to the technical field of plasma etching and thermal expansion, in particular to a flexible installation connection structure and a corresponding plasma processor.
  • Plasma processing is a common technique in the field of integrated circuits, and the process steps are performed inside a reaction chamber of a plasma processor.
  • an assembly is arranged on the top of the reaction chamber, and the assembly includes an aluminum mounting base (Mount Base), and the bottom of the mounting base is fixedly connected to a ceramic made by a connecting device (such as SiC or Si) gas shower head plate is used to introduce external process gas into the reaction chamber.
  • a connecting device such as SiC or Si
  • gas shower head plate is used to introduce external process gas into the reaction chamber.
  • connection device between the installation substrate and the gas shower head board is mostly a rigid connection structure, for example, a plurality of evenly distributed screws (Screws) are usually used for connection and fixation.
  • screws evenly distributed screws
  • the gap between the mounting substrate and the gas shower head will easily become larger or relatively deformed, resulting in the distribution of the radio frequency electric field and heat distribution in the entire plasma processor.
  • Another example is at a room temperature of 20°C, using Hastelloy screws with a specification of M3 ⁇ 20 as a rigid connection structure, passing through an aluminum mounting substrate to lock a ceramic gas shower head plate;
  • the coefficient of thermal expansion CTE H of the alloy 10.5 ⁇ 10 -6 /K
  • the coefficient of thermal expansion CTE AL of AL6061-T6 aluminum 24 ⁇ 10 -6 /K
  • the calculation process of the thermal expansion is as follows:
  • E (F/A)/( ⁇ L/L), where F is the external force, A is the cross-sectional area of the screw, ⁇ L is the degree increment, and L is the original length;
  • the pre-tightening force is about 500N.
  • the etching process requires the temperature of the gas shower head board to be high, if the strength of the gas shower head board is not enough, it will be damaged, resulting in cracking of the gas shower head board, and may also damage the mounting substrate.
  • the object of the present invention is to provide a flexible installation and connection structure and a corresponding plasma processor, which can compensate the difference in thermal expansion between the installation substrate and the gas shower head plate of different materials through the elastic deformation of the flexible installation and connection structure, thereby protecting The gas shower head board and the mounting substrate will not be damaged by thermal stress, and have large displacement and deformation, which can be applied to high temperature etching process.
  • a flexible installation connection structure for connecting a first board body and a second board body with different thermal expansion coefficients is provided with a thermal stress release part, and the thermal stress release part is a structure capable of producing deformation , used to eliminate or reduce the thermal stress caused by the different thermal expansion coefficients of the first plate body and the second plate body when the temperature changes through deformation, so as to prevent the thermal stress from damaging the first plate body and the second plate body board body.
  • the thermal stress relief part includes:
  • the first release part including:
  • the first deformation groove is a groove provided at the bottom of the flexible installation connection structure along the horizontal direction, the bottom of each petal is separated by the first deformation groove, and the first deformation groove is used for the The petals provide room for deformation.
  • the thermal stress relief part further includes:
  • the second release part is a second deformation groove arranged on the inner wall surface of each of the petals, each of the second deformation grooves surrounds a buffer hole, and the bottom of the buffer hole is connected to the first deformation groove.
  • the top is connected, and the buffer hole is used to provide a deformation space for the petal and improve the elasticity of the petal.
  • the thermal stress relief part further includes:
  • the third release part is a third deformation groove provided along the horizontal direction on the outer wall of each of the petals, and is used to provide a deformation space for the petals and improve the elasticity of the petals.
  • the flexible installation connection structure is made of metal.
  • the flexible installation connection structure is made of stainless steel.
  • the flexible installation connection structure is a cylinder.
  • the flexible installation connection structure is composed of an upper connection component and a lower connection component vertically connected, wherein:
  • the upper connection component is fixed to the first board
  • the lower connecting component is fixed to the second board, and the lower connecting component is disposed below the upper connecting component and connected to the upper connecting component.
  • the thermal stress relief part is disposed at the bottom end of the lower connecting component.
  • the bottom end of the petal part of the thermal stress relief part is provided with a second fixing part protruding from the outer wall of the petal part;
  • the second plate body is correspondingly provided with a second fixing groove with an upward opening.
  • the diameter is smaller than the diameter of the bottom of the entire petal with the second fixing part, so as to prevent the bottom of the petal from breaking away from the second fixing groove;
  • the bottom end of the lower connecting component is fixedly inserted into the second fixing groove through the cooperation of the second fixing part and the second fixing groove.
  • the top ends of the two petals are not connected and a gap is provided, and the lower connection assembly further includes:
  • connection block arranged in the gap between the two petals, the shape and size of the connection block are adapted to the gap;
  • connection and positioning device is used for the connection and positioning between the two petals and the connection block.
  • the notch is wedge-shaped downward
  • the connecting block is a wedge-shaped block.
  • connection positioning device is a through hole passing through the two petals and the connecting block, and a pin matching the through hole, and the two petals are realized by inserting the pin into the through hole. Connection and positioning between parts and connection blocks.
  • the top of the upper connection assembly is provided with a first fixing portion protruding from its outer wall;
  • the first plate body is correspondingly provided with a first fixing groove, the shape and size of the first fixing groove are adapted to the first fixing part of the upper connection assembly, and the groove bottom of the first fixing groove is opened There is a first through hole vertically penetrating through the first plate, and the diameter of the first through hole is adapted to the outer diameter of the upper connecting component;
  • the upper connection assembly is fixed in the first plate through the cooperation of the first fixing part and the first fixing groove, so as to prevent the top of the upper connection assembly from breaking away from the first fixing groove;
  • the bottom end of the upper connecting component is provided with a connecting groove opening downward, and the connecting groove is sleeved on the outside of the lower connecting component.
  • connection groove of the upper connection component and the outer wall of the lower connection component are provided with an adapted screw fitting structure.
  • the height of the connecting groove is provided with a margin, so that after the upper connecting component and the lower connecting component are tightened, there is a deformation space between the top of the lower connecting component and the top of the connecting groove, which is used to realize the working temperature
  • the flexible mounting connection structure is used for a plasma processor, and the first board is a mounting substrate in the plasma processor, and the second board is a The gas shower head plate in.
  • a plasma processor comprising: a reaction chamber, a mounting substrate disposed on the top of the reaction chamber, a gas shower head plate disposed below the mounting substrate, and the mounting substrate is connected to the The gas shower head board connection is secured.
  • the present invention has the following advantages:
  • the thermal expansion difference between the gas shower head board and the installation substrate of different materials is compensated by the elastic deformation of the thermal stress release part, which can stably fix the installation substrate and the gas shower head board, and solve the problem of gas under the condition of temperature change.
  • the problem that the shower head plate and the mounting substrate may be damaged by thermal stress can achieve uniform and stable plasma processor treatment effect;
  • the structure of the present invention is simple, and the upper and lower connecting components are separated, and the design of the wedge-shaped block of the lower connecting component is more convenient for installation;
  • first release part the second release part and the third release part, it has all-round displacement, shrinkage, stretching and torsional thermal stress release capabilities such as horizontal and vertical, and has a large displacement deformation, which can be Effective release of high temperature thermal stress, can be applied to high temperature etching process.
  • Fig. 1 is a structural schematic diagram of a plasma processing device
  • FIG. 2 is a schematic structural diagram of a flexible installation connection structure in an embodiment of the present invention.
  • Fig. 3a is a schematic diagram of the front structure of the lower connection assembly in the embodiment of the present invention.
  • Fig. 3b is a schematic side view of the lower connection assembly in the embodiment of the present invention.
  • first ⁇ second ⁇ third are only used for similar objects, and do not represent a specific ordering of objects. Understandably, “first ⁇ second ⁇ third” Where permitted, the specific order or sequence may be interchanged such that the embodiments of the invention described herein can be practiced in other sequences than those illustrated or described.
  • Fig. 1 shows a schematic diagram of a plasma processing device, including a reaction chamber A for processing substrates; an aluminum mounting substrate 1 is arranged on the top of the reaction chamber A, and a ceramic mounting substrate 1 is arranged below the mounting substrate 1.
  • the formed gas shower head plate 2 is used to introduce the external process gas into the reaction chamber A.
  • the installation substrate 1 and the gas shower head plate 2 are fixed together by a plurality of screws evenly arranged in the horizontal direction to form an assembly.
  • the gas shower head plate 2 and the mounting substrate 1 will rise to a higher temperature (greater than 100 °C), and dropped to room temperature after the plasma treatment was completed.
  • a higher temperature greater than 100 °C
  • the temperature of the mounting substrate 1 and the gas shower head plate 2 will fluctuate frequently.
  • the connecting screws will loosen, causing the gap between the mounting substrate 1 and the gas shower head plate 2 to become larger or relatively deformed, so that the RF electric field and heat distribution in the plasma processor changes, resulting in uneven and unstable processing effects of the plasma processor; on the other hand, especially the high-temperature etching process, it will cause the gas shower head plate 2 to be subject to excessive tension and cracks, etc., and even reach a certain level.
  • the mounting substrate 1 may also be damaged at high temperature.
  • the present invention proposes a flexible installation connection structure 3, the top end of which is fixed to the installation substrate 1, and the bottom end is fixed to the gas shower head board 2, which is used to replace the screws to connect the installation substrate 1 to the gas shower head board. 2 are fixed together to solve the above-mentioned technical problems; its working principle is: the flexible installation connection structure 3 is provided with a thermal stress release part 31, and the thermal stress release part 31 is a structure capable of producing deformation.
  • the installation substrate 1 and the The thermal stress generated between the shower head boards 2 will be eliminated or reduced through the deformation of the thermal stress release part 31, so that the mounting substrate 1 and the shower head board 2 will always maintain a good bonding effect, and will not A gap is generated; and the tensile force on the gas shower head plate 2 and the installation substrate 1 is eliminated or reduced through deformation, so as to protect them from being damaged.
  • the flexible installation and connection structure 3 of the present invention is a cylinder, which is convenient for processing and does not easily generate particle contamination due to the existence of edges and corners.
  • the flexible installation connection structure 3 of the present invention is made of metal, preferably stainless steel.
  • the flexible installation connection structure 3 of the present invention is an integral structure.
  • the flexible installation connection structure 3 of the present invention is a split structure
  • FIG. 2 is a combined state diagram of one embodiment of the flexible installation connection structure 3 adopting a split structure, which includes: an upper connection assembly 32, a top end It is fixed with the installation substrate 1 ; the lower connection component 33 , the bottom end of which is fixed with the gas shower head plate 2 , is arranged under the upper connection component 32 and connected with the upper connection component 32 .
  • the thermal stress relief part 31 is disposed on the lower connecting component 33; in this embodiment, as shown in Figures 3a and 3b, the thermal stress releasing part 31 is disposed at the bottom of the lower connecting component 33.
  • the thermal stress release part 31 includes a first release part 311; the first release part 311 includes: a plurality of petals 3111 arranged at the bottom of the flexible installation connection structure 3, and the petals 3111 can be straight , or a structure with a curved or wavy profile; the first deformation groove 3112 is a groove provided at the bottom of the lower connection assembly 33 along the horizontal direction, and the bottom of each petal 3111 is separated by the first deformation groove 3112, the first The deformation groove 3112 is used to provide a deformation space for the petal member 3111 . In this embodiment, there are two petal pieces 3111 and one first deformation groove 3112 .
  • the thermal stress relief part 31 includes a second relief part 312; the second relief part 312 is a second deformation groove provided on the inner wall surface of each petal-shaped part 3111, and each second deformation groove surrounds and forms a buffer hole a, the bottom of the buffer hole a communicates with the top of the first deformation groove 3112 , the buffer hole a is used to provide a deformation space for the petal 3111 and improve the elasticity of the petal 3111 .
  • the thermal stress release part 31 includes a third release part 313; the third release part 313 is a third deformation groove provided along the horizontal direction on the outer wall of each petal-shaped part 3111, which is used to provide the petal-shaped part 3111 Deformation space and improve the elasticity of the petal 3111.
  • the first release part 311, the second release part 312 and the third release part 313 are provided at the same time, and its thermal stress release ability is better, and it has all-round displacement, shrinkage, stretching, etc. in the horizontal and vertical directions.
  • the ability to release torsional thermal stress, and has a large displacement deformation, can effectively release high-temperature thermal stress, and is suitable for high-temperature etching processes.
  • the thermal stress release part 31 can also use any structure or material that can be deformed at high temperature to release thermal stress, or various Combination of structures and materials.
  • connection relationship between the upper connection assembly 32 and the lower connection assembly 33 is realized through the following structure: the bottom end of the upper connection assembly 32 is provided with a connection groove 322 with an opening downward, and the connection groove 322 is sleeved on the lower The outside of the connection assembly 33; further, an adapted thread fitting structure can also be provided on the inner wall of the connection groove 322 of the upper connection assembly 32 and the outer wall of the lower connection assembly 33, and the upper connection assembly 32 is threaded on the outside of the lower connection assembly 33.
  • a gap is provided between the top of the connecting groove 322 and the top of the lower connecting assembly 33, as a deformation space between the upper connecting assembly 32 and the lower connecting assembly 33, so that after deformation, the upper connecting assembly 32 and the lower connecting assembly 33 can still Maintain a tight connection state so that the connection between the mounting substrate 1 and the gas shower head plate 2 will not be disengaged or excessively fitted, that is, the gap between the mounting substrate 1 and the gas shower head plate 2 can be adjusted
  • the degree of fit can adapt to different process application conditions and coordinate the tolerances that exist after the parts are processed.
  • connection relationship between the upper connection assembly 32 and the installation substrate 1 is realized through the following structure: the top of the upper connection assembly 32 is provided with a first fixing part 321 protruding from its outer wall; The corresponding position is provided with a first fixing groove 11, the shape and size of the first fixing groove 11 is adapted to the first fixing part 321 of the upper connection assembly 32, and the groove bottom of the first fixing groove 11 is provided with a vertical penetrating mounting substrate 1
  • the first through hole 12, the diameter of the first through hole 12 is adapted to the outer diameter of the upper connection assembly 32; the upper connection assembly 32 is fixed on the installation substrate 1 through the cooperation of the first fixing part 321 and the first fixing groove 11 In order to prevent the top of the upper connection assembly 32 from detaching from the first fixing groove 11 .
  • connection relationship between the lower connection assembly 33 and the gas shower head plate 2 is realized through the following structure: the bottom end of the petal-like member 3111 of the thermal stress relief part 31 is provided with a protruding outer wall of the petal-like member 3111
  • the second fixing part 331 of the gas shower head plate 2 is provided with a second fixing groove 21 opening upwards at a corresponding position, and the shape and size of the second fixing groove 21 are the same as those of the second fixing part 331 of the petal member 3111 Adapted, the diameter of the notch of the second fixing groove 21 is smaller than the diameter of the bottom of the entire petal 3111 with the second fixing part 331, so as to prevent the bottom of the petal 3111 from breaking away from the second fixing groove 21;
  • the head plate 2 is provided with a second through hole 22 that communicates with the top surface of the gas shower head plate 2 and the second fixing groove 21;
  • the fixed insertion is arranged in the second fixing groove 21 , and the top end is inserted and arranged in the second through hole
  • the flexible installation and connection structure 3 Between the side wall and the side wall of the first fixing groove 11, the side wall of the first through hole 12, the side wall of the second through hole 22 and the side wall of the second fixing groove 21, and the flexible installation connection structure 3 The top and the first fixing groove 11, the bottom of the flexible mounting connection structure 3 and the bottom of the second fixing groove 21, there is a gap between the flexible mounting and connecting structure 3, the mounting substrate 1, and the gas shower head plate 2. In this way, an appropriate space is reserved for the deformation of the flexible installation connection structure 3. After the deformation, the installation substrate 1 and the gas shower head plate 2 can still maintain the initial contact state under the connection of the flexible installation connection structure 3 without disengagement. Also not overly snug.
  • the lower connection assembly 33 adopts the following split structure design: the top ends of the two petals 3111 are not connected and are provided with The notch is provided with a connecting block 332 in the notch, and the shape and size of the connecting block 332 are adapted to the notch; preferably, the notch is set as a downward wedge, and the connecting block 332 is an adapted wedge, adopting a downward wedge
  • the design is convenient for installation and prevents the connection block 332 from falling from the gap to the bottom of the second fixing groove 21 during installation.
  • connection positioning device 333 When installing the connection block 332 in the gap, it is necessary to fix the connection block 332 and the petals 3111 on both sides through the connection positioning device 333; in this embodiment, the connection positioning device 333 includes: through two petals 3111 and The through hole of the connection block 332, and the pin adapted to the through hole; the connection and positioning between the two petals 3111 and the connection block 332 can be realized by inserting the pin into the through hole.
  • the assembly method of the flexible installation connection structure 3 in this embodiment is:
  • each lower connection assembly 33 with the gas shower head board 2 insert the second fixing parts 331 at the bottom ends of the two petal-shaped parts 3111 into the second fixing groove 21 successively from the top of the gas shower head board 2, and then Insert the connecting block 332 wedge-shaped downward into the gap between the two petals 3111, so that the through holes of the two petals 3111 and the connecting block 332 are connected, and the pins are inserted into the through holes to complete the two petals.
  • each upper connection assembly 32 with each lower connection assembly 33 align the installation substrate 1 with the gas shower head plate 2 up and down, align each upper connection assembly 32 with each lower connection assembly 33 one by one, and place one of them
  • the connection groove 322 at the bottom of the upper connection assembly 32 is threaded on the outside of the corresponding lower connection assembly 33 and moderately tightened; connect the other upper connection assemblies 32 with each lower connection assembly 33 according to the above steps, and then use the diagonal fastening method to fasten them
  • the threads between each upper connection component 32 and each lower connection component 33 are tightened, and the installation substrate 1 and the gas shower head plate 2 are combined into an assembly through the connection of the flexible installation connection structure 3;
  • the flexible installation connection structure 3 of the present invention is not limited to be applied to plasma processors, and it can be applied to the connection between any components with different thermal expansion coefficients.
  • this embodiment also provides a plasma processor, including: a reaction chamber A, a mounting substrate 1 disposed on the top of the reaction chamber A, a gas shower head plate 2 disposed below the mounting substrate, and a plurality of The flexible installation and connection structures 3 uniformly arranged in the horizontal direction of the installation substrate 1 are connected and fixed to the installation substrate 1 and the gas shower head board 2 through each flexible installation and connection structure 3 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Connection Of Plates (AREA)
  • Combinations Of Printed Boards (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

本发明公开了一种柔性安装连接结构，用于连接具有不同热膨胀系数的第一板体和第二板体，所述柔性安装连接结构设置有热应力释放部，所述热应力释放部为能够产生形变的结构，用于通过形变消除或减小在温度变化时因所述第一板体与第二板体不同的热膨胀系数而产生的热应力，防止所述热应力损坏所述第一板体和第二板体。本发明还公开了一种等离子体处理器，采用了上述的柔性安装连接结构。本发明通过柔性安装连接结构的弹性变形来补偿不同材料的安装基板与气体喷淋头板之间热膨胀量差值，从而保护气体喷淋头板、安装基板不会因热应力而破坏，并且具有大位移变形量，可应用于高温刻蚀工艺。

Description

一种柔性安装连接结构及相应的等离子体处理器 技术领域
本发明涉及等离子体刻蚀及热膨胀技术领域，具体涉及一种柔性安装连接结构及相应的等离子体处理器。
背景技术
等离子体处理是集成电路领域通用的技术，该工艺步骤在一等离子体处理器的反应腔内部进行。在本发明所应用的等离子体处理器中，反应腔的顶部设置有装配体，装配体包括一铝制的安装基板(Mount Base)，安装基板的下方通过连接装置固定连接一陶瓷制成(如SiC或Si)的气体喷淋头板，用于将外接的工艺气体引入反应腔。在处理过程中，需要对引入反应腔的工艺气体施加高功率的射频功率以生成等离子体，此步骤会导致气体喷淋头和安装基板均上升到较高温度(大于100℃)，并在等离子体处理完成后又下降到室温。所以，在频繁进行的等离子处理工艺中，安装基板和气体喷淋头的温度会经常性往复波动。目前，安装基板与气体喷淋头板之间的连接装置多为刚性连接结构，比如通常采用多个均匀分布的螺钉(Screw)来连接固定。在此高温环境下，由于安装基板、气体喷淋头及刚性连接结构三者的热膨胀系数不同，会产生一些问题：
例如，在这种频繁温度变化的环境中会导致安装基板与气体喷淋头之间很容易出现缝隙变大或者相对变形的情况，从而导致整个等离子体处理器中的射频电场分布和热量分布的变化，这些因素又会导致等离子体处理效果的变化，所以刚性连接结构有可能会导致整个等离子处理器处理效果的不均一和不稳定。
又例如室温20℃条件下，以规格M3×20的哈氏合金(Hastlloy)材料的螺钉作为刚性连接结构，穿过铝材料的安装基板锁紧陶瓷材料的气体喷淋头板；其中，哈氏合金的热膨胀系数CTE H＝10.5×10 -6/K，AL6061-T6铝的热膨胀系数CTE AL＝24×10 -6/K，其热膨胀量的计算过程如下：
当120℃，△L＝120℃-20℃＝100℃；
螺钉△L 1＝20×100×10.5×10 -6＝0.021mm；
底座△L 2＝20×100×24×10 -6＝0.048mm；
△L＝△L 2-△L 1＝0.027mm；
哈氏合金弹性模量E＝213GPa；
E＝(F/A)/(△L/L)，其中F为外力，A为螺钉的横截面积，△L为程度增量，L为原始长度；
F＝EA△L/L＝213×10 9×3.14×1.5 2×10 -6×0.027×10 -3/(20×10 -3)＝2031.5N
即，室温时扭矩30cn*m，那么预紧力大约500N，当温度到120摄氏度，20mm铝膨胀量是0.048mm，20mm哈氏合金膨胀量是0.021mm，那么螺丝就会被拉长△L＝0.027mm，从而螺丝的内应力就会增加2031.5N。尤其在刻蚀工艺要求气体喷淋头板温度很高的情况下，如果气体喷淋头板强度不够就会被破坏，造成气体喷淋头板龟裂现象，同时也有可能破坏安装基板。
发明的公开
本发明的目的在于提供一种柔性安装连接结构及相应的等离子体处理器，通过柔性安装连接结构的弹性变形来补偿不同材料的安装基板与气体喷淋头板之间热膨胀量差值，从而保护气体喷淋头板、安装基板不会因热应力而破坏，并且具有大位移变形量，可应用于高温刻蚀工艺。
为了达到上述目的，本发明通过以下技术方案实现：
一种柔性安装连接结构，用于连接具有不同热膨胀系数的第一板体和第二板体，所述柔性安装连接结构设置有热应力释放部，所述热应力释放部为能够产生形变的结构，用于通过形变消除或减小在温度变化时因所述第一板体与第二板体不同的热膨胀系数而产生的热应力，防止所述热应力损坏所述第一板体和第二板体。
优选地，所述热应力释放部包括：
第一释放部，包括：
设置在所述柔性安装连接结构底部的多个瓣状件；
第一形变槽，为设置于所述柔性安装连接结构底部的沿水平方向开设的槽，各所述瓣状件底部通过所述第一形变槽分隔，所述第一形变槽用于为所 述瓣状件提供形变空间。
优选地，所述热应力释放部还包括：
第二释放部，为设置在各所述瓣状件的内壁面的第二形变槽，各所述第二形变槽围合构成缓冲孔，所述缓冲孔的底部与所述第一形变槽的顶部连通，所述缓冲孔用于提供所述瓣状件的形变空间及提高所述瓣状件的弹性。
优选地，所述热应力释放部还包括：
第三释放部，为在各所述瓣状件外壁面沿水平方向设置的第三形变槽，用于提供所述瓣状件的形变空间及提高所述瓣状件的弹性。
可选地，所述柔性安装连接结构为金属材质。
优选地，所述柔性安装连接结构为不锈钢材质。
可选地，所述柔性安装连接结构为圆柱体。
可选地，所述柔性安装连接结构由上连接组件和下连接组件垂直连接构成，其中：
上连接组件与所述第一板体固定；
下连接组件与所述第二板体固定，所述下连接组件设置在所述上连接组件下方，并与所述上连接组件连接。
可选地，所述热应力释放部设置于所述下连接组件底端。
可选地，所述热应力释放部的瓣状件的底端设置有凸出所述瓣状件外壁的第二固定部；
所述第二板体上对应设置有开口向上的第二固定槽，该第二固定槽的形状与尺寸与所述瓣状件的第二固定部相适配，所述第二固定槽槽口的直径小于带有第二固定部的整个瓣状件底部的直径，以阻挡所述瓣状件的底部脱离所述第二固定槽；
所述下连接组件的底端通过所述第二固定部与第二固定槽的配合，固定插入设置在所述第二固定槽内。
可选地，所述瓣状件为两个，所述第一形变槽为一个。
可选地，两个所述瓣状件的顶端不连接且设置有缺口，所述下连接组件还包括：
设置在两个瓣状件之间的缺口内的连接块，所述连接块的形状、尺寸与所述缺口相适配；
连接定位装置，用于两个所述瓣状件和连接块之间的连接及定位。
优选地，所述缺口为向下的楔形，所述连接块为楔形块。
可选地，所述连接定位装置为贯通两个所述瓣状件及连接块的通孔，以及与所述通孔相适配的销钉，通过将销钉插入所述通孔实现两个所述瓣状件和连接块之间的连接及定位。
可选地，所述上连接组件的顶部设置有凸出其外壁的第一固定部；
所述第一板体上对应设置有第一固定槽，所述第一固定槽的形状与尺寸与所述上连接组件的第一固定部相适配，所述第一固定槽的槽底开设有垂直穿透所述第一板体的第一通孔，所述第一通孔的直径与所述上连接组件的外径相适配；
所述上连接组件通过所述第一固定部与第一固定槽的配合，固定在所述第一板体中，以阻挡所述上连接组件的顶部脱离所述第一固定槽；
所述上连接组件的底端设有开口向下的连接槽，该连接槽套设在所述下连接组件外部。
可选地，所述上连接组件的连接槽内壁及所述下连接组件的外壁上设置有适配的螺纹配合结构。
优选地，所述连接槽的高度设有余量，使得所述上连接组件与下连接组件拧紧后在所述下连接组件的顶部与连接槽的顶部之间具有形变空间，用于实现工作温度范围内所述第一板体与第二板体之间的紧密贴合安装。
可选地，所述柔性安装连接结构是用于等离子体处理器，并且所述第一板体为所述等离子体处理器中的安装基板，所述第二板体为所述等离子体处理器中的气体喷淋头板。
优选地，所述柔性安装连接结构为多个，沿所述安装基板的水平方向均匀设置，用于连接所述安装基板和气体喷淋头板。
一种等离子体处理器，包括：反应腔、设置在所述反应腔顶部的安装基板、设置在所述安装基板下方的气体喷淋头板，采用上述的柔性安装连接结构将所述安装基板与气体喷淋头板连接固定。
本发明与现有技术相比具有以下优点：
1、通过热应力释放部的弹性变形来补偿不同材料的气体喷淋头板与安装基板之间的热膨胀量差值，可以稳定固定安装基板和气体喷淋头板，解决了 温度变化情况下气体喷淋头板、安装基板可能被热应力破坏的问题，实现等离子体处理器处理效果的均一和稳定；
2、本发明结构简单，并且通过上、下连接组件分体，以及下连接组件的楔形块等设计，更加便于安装；
3、通过第一释放部、第二释放部和第三释放部的设计，具有水平、垂直等全方位的位移、收缩、拉伸、扭转热应力的释放能力，且具有大位移变形量，可有效释放高温热应力，可应用于高温刻蚀工艺。
附图的简要说明
图1为一种等离子体处理装置的结构示意图；
图2为本发明实施例中柔性安装连接结构的结构示意图；
图3a为本发明实施例中下连接组件的正视结构示意图；
图3b为本发明实施例中下连接组件的侧视结构示意图。
实现本发明的最佳方式
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地描述，所描述的实施例不应视为对本发明的限制，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在以下的描述中，涉及到“一些实施例”、“一个或多个实施例”，其描述了所有可能实施例的子集，但是可以理解，“一些实施例”、“一个或多个实施例”可以是所有可能实施例的相同子集或不同子集，并且可以在不冲突的情况下相互组合。
在以下的描述中，所涉及的术语“第一\第二\第三”仅仅用于分别类似的对象，不代表针对对象的特定排序，可以理解地，“第一\第二\第三”在允许的情况下可以互换特定的顺序或先后次序，以使这里描述的本发明实施例能够以除了在图示或描述的以外的顺序实施。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中所使用的术语只是为了描述本发明实施例的目的，不是旨在限制本发明。
图1示出一种等离子体处理装置示意图，包括一反应腔A，用于对基片进行处理；在反应腔A的顶部设置有一铝制的安装基板1，安装基板1的下方设置一陶瓷制成的气体喷淋头板2，气体喷淋头板2用于将外接的工艺气体引入反应腔A。现有技术中，通过多个在水平方向均匀布置的螺丝，将安装基板1与气体喷淋头板2固定在一起形成装配体。在基片处理过程中，需要对引入反应腔A的工艺气体施加高功率的射频功率以生成等离子体，此步骤会导致气体喷淋头板2和安装基板1均上升到较高温度(大于100℃)，并在等离子体处理完成后又下降到室温。在频繁进行的等离子处理工艺中，安装基板1和气体喷淋头板2的温度会经常性往复波动，由于铝制安装基板1与陶瓷气体喷淋头2的热膨胀系数有较大差值，在温度变化时，一方面会使连接的螺丝松动，导致安装基板1与气体喷淋头板2之间出现缝隙变大或者相对变形的情况，从而使得等离子体处理器中的射频电场分布和热量分布发生变化，造成等离子体处理器的处理效果不均一、不稳定；另一方面，尤其是高温刻蚀工艺，会导致气体喷淋头板2受到过大拉力从而发生龟裂等问题，甚至达到一定温度时安装基板1也可能会被破坏。
如图2所示，本发明提出一种柔性安装连接结构3，其顶端与安装基板1固定，底端与气体喷淋头板2固定，用于替代螺丝将安装基板1与气体喷淋头板2固定在一起，从而解决上述技术问题；其工作原理是：该柔性安装连接结构3设置有热应力释放部31，热应力释放部31为能够产生形变的结构，温度变化时，安装基板1与气体喷淋头板2之间产生的热应力会通过热应力释放部31的形变来消除或减小，从而使安装基板1和气体喷淋头板2始终保持较佳的贴合效果，不会产生缝隙；并且通过形变消除或减小了气体喷淋头板2及安装基板1受到的拉力，而保护其不被破坏。
在一些实施例中，本发明的柔性安装连接结构3为圆柱体，便于加工，且不会因存在棱角而易于产生颗粒污染物。
在一些实施例中，本发明的柔性安装连接结构3为金属材质，优选不锈钢材质。
在一些实施例中，本发明的柔性安装连接结构3为一体结构。
在一些实施例中，本发明的柔性安装连接结构3为分体结构，图2为采用分体结构的柔性安装连接结构3其中一个实施例的组合状态图，其包括： 上连接组件32，顶端与安装基板1固定；下连接组件33，底端与气体喷淋头板2固定，设置在上连接组件32下方，并与上连接组件32连接。
热应力释放部31设置于下连接组件33；本实施例中，如附图3a、3b所示，热应力释放部31设置于下连接组件33底端。
在一些实施例中，热应力释放部31包括第一释放部311；第一释放部311包括：设置在柔性安装连接结构3底部的多个瓣状件3111，瓣状件3111可以为直条状，或者为具有弯曲或波浪形轮廓的结构；第一形变槽3112，为设置于下连接组件33底部的沿水平方向开设的槽，各瓣状件3111底部通过第一形变槽3112分隔，第一形变槽3112用于为瓣状件3111提供形变空间。在本实施例中，瓣状件3111为两个，第一形变槽3112为一个。
在一些实施例中，热应力释放部31包括第二释放部312；第二释放部312为设置在各瓣状件3111的内壁面的第二形变槽，各第二形变槽围合构成缓冲孔a，缓冲孔a的底部与第一形变槽3112的顶部连通，缓冲孔a用于提供瓣状件3111的形变空间及提高瓣状件3111的弹性。
在一些实施例中，热应力释放部31包括第三释放部313；第三释放部313为在各瓣状件3111外壁面沿水平方向设置的第三形变槽，用于提供瓣状件3111的形变空间及提高瓣状件3111的弹性。
在同时设置有第二释放部312和第三释放部313的实施例中，可以为瓣状件3111提供更大的形变空间，具有更好的弹性。
在本实施例中，同时设置有第一释放部311、第二释放部312和第三释放部313，其热应力释放能力更佳，具有水平、垂直等全方位的位移、收缩、拉伸、扭转热应力的释放能力，且具有大位移变形量，可有效释放高温热应力，适用于高温刻蚀工艺。
除列举的第一释放部311、第二释放部312和第三释放部313之外，热应力释放部31还可以采用任何可以在高温时产生形变从而释放热应力的结构或者材料，或者各种结构及材料的组合。
本实施例中，上连接组件32与下连接组件33之间的连接关系是通过如下结构实现的：上连接组件32的底端设有开口向下的连接槽322，该连接槽322套设在下连接组件33外部；进一步，还可在上连接组件32的连接槽322内壁及下连接组件33的外壁上设置有适配的螺纹配合结构，上连接组件32 螺纹套设在下连接组件33外部。
为了保证常温下气体喷淋头板2上表面与安装基板1下表面之间紧密贴合的安装效果在高温状态下依旧保持，较佳的，上连接组件32与下连接组件33拧紧后，在连接槽322的顶部与下连接组件33的顶部之间设有间隙，作为上连接组件32与下连接组件33之间的形变空间，这样变形后上连接组件32与下连接组件33之间依旧可以保持紧密连接状态，使得安装基板1与气体喷淋头板2之间的连接不脱开也不会过度贴合，即通过该间隙的大小来调整安装基板1与气体喷淋头板2之间的贴合程度，可适应不同的工艺应用条件以及协调部件加工后存在的公差。
本实施例中，上连接组件32与安装基板1之间的连接关系是通过如下结构实现的：上连接组件32的顶部设置有凸出其外壁的第一固定部321；在安装基板1上的对应位置设置有第一固定槽11，第一固定槽11的形状与尺寸与上连接组件32的第一固定部321相适配，第一固定槽11的槽底开设有垂直穿透安装基板1的第一通孔12，第一通孔12的直径与上连接组件32的外径相适配；上连接组件32通过第一固定部321与第一固定槽11的配合，固定在安装基板1中，以阻挡上连接组件32的顶部脱离第一固定槽11。
本实施例中，下连接组件33与气体喷淋头板2之间的连接关系是通过如下结构实现的：热应力释放部31的瓣状件3111的底端设置有凸出瓣状件3111外壁的第二固定部331；在气体喷淋头板2上的对应位置设置有开口向上的第二固定槽21，该第二固定槽21的形状与尺寸与瓣状件3111的第二固定部331相适配，第二固定槽21槽口的直径小于带有第二固定部331的整个瓣状件3111底部的直径，以阻挡瓣状件3111的底部脱离第二固定槽21；在气体喷淋头板2上设置有连通气体喷淋头板2顶面和第二固定槽21的第二通孔22；下连接组件33的底端通过第二固定部331与第二固定槽21的配合，固定插入设置在第二固定槽21内，顶端插入设置在第二通孔22内。
为了保证常温下气体喷淋头板2上表面与安装基板1下表面之间紧密贴合的安装效果在高温状态下依旧保持，较佳的，柔性安装连接结构3安装后，在柔性安装连接结构3侧壁与第一固定槽11侧壁、第一通孔12侧壁、第二通孔22侧壁和第二固定槽21侧壁之间，以及柔性安装连接结构3顶部与第一固定槽11的槽底、柔性安装连接结构3底部与第二固定槽21的槽底之间， 均设有间隙，作为柔性安装连接结构3与安装基板1、气体喷淋头板2之间的形变空间，这样为柔性安装连接结构3的变形预留了适当空间，变形后安装基板1与气体喷淋头板2之间依旧可以在柔性安装连接结构3的连接下保持最初彼此接触的状态不脱开也不会过度贴合。
为了实现下连接组件33的底端能够插入设置在第二固定槽21内，本实施例中，下连接组件33采用如下的分体结构设计：两个瓣状件3111的顶端不连接且设置有缺口，在缺口内设置有连接块332，连接块332的形状、尺寸与缺口相适配；优选地，设置缺口为向下的楔形，连接块332为适配的楔形块，采用向下的楔形设计可以方便安装，防止安装时连接块332自缺口掉落至第二固定槽21槽底。
将连接块332安装在缺口内时，需要通过连接定位装置333将连接块332与两侧的瓣状件3111进行固定；本实施例中，连接定位装置333包括：贯通两个瓣状件3111及连接块332的通孔，以及与通孔相适配的销钉；通过将销钉插入通孔实现两个瓣状件3111和连接块332之间的连接及定位。
本发明的柔性安装连接结构3为多个，沿安装基板1的水平方向均匀设置，从而将安装基板1和气体喷淋头板2连接固定。
本实施例中的柔性安装连接结构3的装配方法为：
S1、将各上连接组件32与安装基板1连接：将各上连接组件32的底端自安装基板1的顶部向下插入第一通孔12内，使第一固定部321容纳于第一固定槽11内；
S2、将各下连接组件33与气体喷淋头板2连接：将两个瓣状件3111底端的第二固定部331自气体喷淋头板2的顶部先后插入第二固定槽21内，再将连接块332楔形向下地插入两个瓣状件3111之间的缺口中，使两个瓣状件3111及连接块332的通孔相贯通，将销钉插入贯通的通孔中完成两个瓣状件3111和连接块332的定位；按如上方法完成各下连接组件33与气体喷淋头板2的连接；
S3、将各上连接组件32与各下连接组件33连接：将安装基板1与气体喷淋头板2上下对齐，使各上连接组件32与各下连接组件33一一对准，将其中一个上连接组件32底端的连接槽322螺纹套设在对应的下连接组件33的外部并适度拧紧；按照上述步骤将其他上连接组件32与各下连接组件33 连接，然后采用对角紧固法将各上连接组件32与各下连接组件33之间的螺纹拧紧，安装基板1与气体喷淋头板2通过柔性安装连接结构3的连接组合为装配体；
S4、将装配体与等离子体处理器连接。
需要指出的是，本发明的柔性安装连接结构3不局限于应用于等离子体处理器，其可以应用于任何具有不同热膨胀系数的部件之间的连接。
另外，本实施例还提供一种等离子体处理器，包括：一反应腔A、一设置在反应腔A顶部的安装基板1、设置在安装基板下方的气体喷淋头板2，以及多个沿安装基板1的水平方向均匀设置的柔性安装连接结构3，并通过各柔性安装连接结构3将安装基板1与气体喷淋头板2连接固定。
以上所述，仅为本发明的实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和范围之内做出的任何修改、等同替换和改进等，均包含在本发明的保护范围之内。

Claims (20)

  1. 一种柔性安装连接结构，用于连接具有不同热膨胀系数的第一板体和第二板体，其特征在于，所述柔性安装连接结构设置有热应力释放部，所述热应力释放部为能够产生形变的结构，用于通过形变消除或减小在温度变化时因所述第一板体与第二板体不同的热膨胀系数而产生的热应力，防止所述热应力损坏所述第一板体和第二板体。
  2. 如权利要求1所述的柔性安装连接结构，其特征在于，所述热应力释放部包括：
    第一释放部，包括：
    设置在所述柔性安装连接结构底部的多个瓣状件；
    第一形变槽，为设置于所述柔性安装连接结构底部的沿水平方向开设的槽，各所述瓣状件底部通过所述第一形变槽分隔，所述第一形变槽用于为所述瓣状件提供形变空间。
  3. 如权利要求2所述的柔性安装连接结构，其特征在于，所述热应力释放部还包括：
    第二释放部，为设置在各所述瓣状件的内壁面的第二形变槽，各所述第二形变槽围合构成缓冲孔，所述缓冲孔的底部与所述第一形变槽的顶部连通，所述缓冲孔用于提供所述瓣状件的形变空间及提高所述瓣状件的弹性。
  4. 如权利要求2或3所述的柔性安装连接结构，其特征在于，所述热应力释放部还包括：
    第三释放部，为在各所述瓣状件外壁面沿水平方向设置的第三形变槽，用于提供所述瓣状件的形变空间及提高所述瓣状件的弹性。
  5. 如权利要求1所述的柔性安装连接结构，其特征在于，所述柔性安装连接结构为金属材质。
  6. 如权利要求5所述的柔性安装连接结构，其特征在于，所述柔性安装连接结构为不锈钢材质。
  7. 如权利要求1所述的柔性安装连接结构，其特征在于，所述柔性安装连接 结构为圆柱体。
  8. 如权利要求2所述的柔性安装连接结构，其特征在于，所述柔性安装连接结构由上连接组件和下连接组件垂直连接构成，其中：
    上连接组件与所述第一板体固定；
    下连接组件与所述第二板体固定，所述下连接组件设置在所述上连接组件下方，并与所述上连接组件连接。
  9. 如权利要求8所述的柔性安装连接结构，其特征在于，所述热应力释放部设置于所述下连接组件底端。
  10. 如权利要求9所述的柔性安装连接结构，其特征在于，所述热应力释放部的瓣状件的底端设置有凸出所述瓣状件外壁的第二固定部；
    所述第二板体上对应设置有开口向上的第二固定槽，该第二固定槽的形状与尺寸与所述瓣状件的第二固定部相适配，所述第二固定槽槽口的直径小于带有第二固定部的整个瓣状件底部的直径，以阻挡所述瓣状件的底部脱离所述第二固定槽；
    所述下连接组件的底端通过所述第二固定部与第二固定槽的配合，固定插入设置在所述第二固定槽内。
  11. 如权利要求10所述的柔性安装连接结构，其特征在于，所述瓣状件为两个，所述第一形变槽为一个。
  12. 如权利要求11所述的柔性安装连接结构，其特征在于，两个所述瓣状件的顶端不连接且设置有缺口，所述下连接组件还包括：
    设置在两个瓣状件之间的缺口内的连接块，所述连接块的形状、尺寸与所述缺口相适配；
    连接定位装置，用于两个所述瓣状件和连接块之间的连接及定位。
  13. 如权利要求12所述的柔性安装连接结构，其特征在于，所述缺口为向下的楔形，所述连接块为楔形块。
  14. 如权利要求13所述的柔性安装连接结构，其特征在于，所述连接定位装置为贯通两个所述瓣状件及连接块的通孔，以及与所述通孔相适配的销钉，通过将销钉插入所述通孔实现两个所述瓣状件和连接块之间的连接及定位。
  15. 如权利要求8所述的柔性安装连接结构，其特征在于，所述上连接组件的 顶部设置有凸出其外壁的第一固定部；
    所述第一板体上对应设置有第一固定槽，所述第一固定槽的形状与尺寸与所述上连接组件的第一固定部相适配，所述第一固定槽的槽底开设有垂直穿透所述第一板体的第一通孔，所述第一通孔的直径与所述上连接组件的外径相适配；
    所述上连接组件通过所述第一固定部与第一固定槽的配合，固定在所述第一板体中，以阻挡所述上连接组件的顶部脱离所述第一固定槽；
    所述上连接组件的底端设有开口向下的连接槽，该连接槽套设在所述下连接组件外部。
  16. 如权利要求15所述的柔性安装连接结构，其特征在于，所述上连接组件的连接槽内壁及所述下连接组件的外壁上设置有适配的螺纹配合结构。
  17. 如权利要求16所述的柔性安装连接结构，其特征在于，所述连接槽的高度设有余量，使得所述上连接组件与下连接组件拧紧后在所述下连接组件的顶部与连接槽的顶部之间具有形变空间，用于实现工作温度范围内所述第一板体与第二板体之间的紧密贴合安装。
  18. 如权利要求1～17任意一项所述的柔性安装连接结构，其特征在于：所述柔性安装连接结构是用于等离子体处理器，并且所述第一板体为所述等离子体处理器中的安装基板，所述第二板体为所述等离子体处理器中的气体喷淋头板。
  19. 如权利要求18所述的柔性安装连接结构，其特征在于，所述柔性安装连接结构为多个，沿所述安装基板的水平方向均匀设置，用于连接所述安装基板和气体喷淋头板。
  20. 一种等离子体处理器，包括：反应腔、设置在所述反应腔顶部的安装基板、设置在所述安装基板下方的气体喷淋头板，其特征在于，采用如权利要求19所述的柔性安装连接结构将所述安装基板与气体喷淋头板连接固定。
PCT/CN2022/119023 2021-12-21 2022-09-15 一种柔性安装连接结构及相应的等离子体处理器 WO2023116081A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247013979A KR20240065169A (ko) 2021-12-21 2022-09-15 플렉서블 장착 연결 구조 및 대응되는 플라즈마 프로세서

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111571461.0A CN116313717A (zh) 2021-12-21 2021-12-21 一种柔性安装连接结构及相应的等离子体处理器
CN202111571461.0 2021-12-21

Publications (1)

Publication Number Publication Date
WO2023116081A1 true WO2023116081A1 (zh) 2023-06-29

Family

ID=86819091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/119023 WO2023116081A1 (zh) 2021-12-21 2022-09-15 一种柔性安装连接结构及相应的等离子体处理器

Country Status (3)

Country Link
KR (1) KR20240065169A (zh)
CN (1) CN116313717A (zh)
WO (1) WO2023116081A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218620A (en) * 1978-07-20 1980-08-19 Eltec Instruments, Inc. Pyroelectric detector having improved suspension means
CN111383880A (zh) * 2018-12-27 2020-07-07 中微半导体设备(上海)股份有限公司 一种等离子体处理器的安装结构及相应的等离子体处理器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218620A (en) * 1978-07-20 1980-08-19 Eltec Instruments, Inc. Pyroelectric detector having improved suspension means
CN111383880A (zh) * 2018-12-27 2020-07-07 中微半导体设备(上海)股份有限公司 一种等离子体处理器的安装结构及相应的等离子体处理器

Also Published As

Publication number Publication date
KR20240065169A (ko) 2024-05-14
CN116313717A (zh) 2023-06-23
TW202326800A (zh) 2023-07-01

Similar Documents

Publication Publication Date Title
TWI785727B (zh) 用於高溫處理之具有金屬結合背板的靜電定位盤組件
KR100854804B1 (ko) 피처리 기판에 대하여 반도체 처리를 실시하는 장치
CN101578926B (zh) 等离子体处理装置的元件
KR101593920B1 (ko) 캐소드 전극판용 부시 조립체
TWI434363B (zh) A substrate stage and a substrate processing device
TWI445119B (zh) A substrate stage and a substrate processing device
KR20080109646A (ko) 탑재대 및 그것을 이용한 플라즈마 처리장치
KR102076311B1 (ko) 샤워 헤드와 상부 지지플레이트의 체결력을 향상시킨 이중 구조 볼트
US12104638B2 (en) Interlocking fastening upper electrode assembly having improved fastening force, and plasma device including same
WO2023116081A1 (zh) 一种柔性安装连接结构及相应的等离子体处理器
TWM602220U (zh) 用於散熱器的可重複使用的托持部件、熱轉移裝置及電子裝置
TWI855384B (zh) 一種柔性安裝連接結構及相應的電漿處理器
TWI752386B (zh) 電漿處理器的安裝結構及相應的電漿處理器
KR101112974B1 (ko) 대면적 기판 처리 장치
TW202232564A (zh) 緊固構造、電漿處理裝置以及緊固方法
TWI734293B (zh) 一種電漿處理器的安裝結構及相應的電漿處理器
JP2000164522A (ja) 半導体製造用炭化珪素質組立ウェーハボート
US20210331183A1 (en) Fasteners for coupling components of showerhead assemblies
US8052364B2 (en) Coupling member and plasma processing apparatus
US10522443B2 (en) Lid cover spring design
KR101093747B1 (ko) 플라즈마 식각용 상부전극 조립체
JP7546573B2 (ja) シャワーヘッドおよびこれを含む基板処理装置
TW202033082A (zh) 用於散熱器的可重複使用的托持部件
TW201430996A (zh) 用於在供基板處理之一真空腔室內之一環形組件的機械式夾具總成
CN112563185B (zh) 静电卡盘及半导体加工设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22909399

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20247013979

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE