WO2023115465A1 - 显示面板及显示模组、移动终端 - Google Patents

显示面板及显示模组、移动终端 Download PDF

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Publication number
WO2023115465A1
WO2023115465A1 PCT/CN2021/140907 CN2021140907W WO2023115465A1 WO 2023115465 A1 WO2023115465 A1 WO 2023115465A1 CN 2021140907 W CN2021140907 W CN 2021140907W WO 2023115465 A1 WO2023115465 A1 WO 2023115465A1
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WO
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Prior art keywords
layer
light
display panel
cutting surface
shielding
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Application number
PCT/CN2021/140907
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English (en)
French (fr)
Inventor
周文君
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/597,239 priority Critical patent/US20230200122A1/en
Priority to KR1020227009460A priority patent/KR20230098087A/ko
Priority to JP2022530789A priority patent/JP7494300B2/ja
Publication of WO2023115465A1 publication Critical patent/WO2023115465A1/zh

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  • the present application relates to the field of display technology, in particular to a display panel, a display module, and a mobile terminal.
  • OLED Organic Light-Emitting Diode
  • Organic Light-Emitting Diode panels have the advantages of thinness, large viewing angle and power saving, and will become the mainstream of future development.
  • the OLED panel in order to reduce the thickness of the display panel, the OLED panel can be manufactured by using a depolarizer technology, that is, the existing polarizer is replaced by a color resist layer and a black matrix layer.
  • the existing polarizer is replaced by a color resist layer and a black matrix layer.
  • the present application provides a display panel, a display module, and a mobile terminal, so as to solve the technical problem of carbon dust existing in edge gaps of the existing display panel.
  • the application provides a display panel, which includes:
  • the color filter layer is arranged on the light-emitting device layer, the color filter layer includes a light-shielding layer and a plurality of color-resist units embedded in the light-shielding layer, and the light-shielding layer includes a cutting surface close to the display panel the first shading part provided;
  • the first light-shielding portion includes a first edge on a side close to the cutting surface
  • the substrate includes a second edge on a side close to the cutting surface
  • the distance between the first edge and the cutting surface is greater than the distance from the second edge to the cutting surface
  • the distance between the first edge and the cut surface is greater than or equal to 50 microns and less than or equal to 150 microns.
  • the light-shielding layer further includes a second light-shielding portion away from the cutting surface, and the thickness of the second light-shielding portion is greater than that of the first light-shielding portion.
  • the display panel further includes a first flat layer disposed on the color filter layer, and the first flat layer covers the color filter layer;
  • the first flat layer covers the first light shielding portion and extends toward the cutting surface.
  • the display panel further includes a first flat layer disposed on the color filter layer, and the first flat layer covers the color filter layer;
  • the area of the light-shielding layer close to the cut surface of the display panel is provided with a first notch
  • the area of the first flat layer close to the cut surface is provided with a second notch
  • the first notch and the first notch face to the cutting surface.
  • the thickness of the first flat layer is less than or equal to the thickness of the second light shielding portion.
  • the distance between the boundary of the film layer on the side of the display panel close to the cut surface and the second edge gradually increases.
  • the acute angle between the cut surface and the substrate is in a range of 60° to 80°.
  • the display panel includes multiple organic layers, and at least one side of the organic layer close to the cut surface is provided with a black material.
  • the present application also proposes a display module, which includes the above-mentioned display panel and a cover layer on the display panel;
  • the orthographic projection of the display panel on the cover layer is located within the cover layer.
  • the present application also proposes a mobile terminal, wherein the mobile terminal includes a terminal body and the above-mentioned display module, and the terminal body and the display module are combined into one.
  • the distance from the first edge to the cutting surface is greater than the distance from the second edge to the cutting surface, so that the light-shielding layer is separated from the cutting surface, so as to avoid the carbonization of the light-shielding material due to the high temperature of the laser L during the panel cutting process. , thereby avoiding carbonized carbon dust remaining in the edge gap of the display panel, and improving the cleanliness of the product.
  • FIG. 1 is a cross-sectional view of an existing display panel
  • FIG. 2 is an enlarged view of an abnormal region of a conventional display panel
  • Fig. 3 is a schematic diagram of the cutting of the display panel of the present application.
  • Fig. 4 is the first cross-sectional view of section AA in Fig. 3;
  • Fig. 5 is the detailed structural diagram of part film layer in Fig. 4;
  • Fig. 6 is a schematic diagram of a Gaussian spot of a laser
  • FIG. 7 is a top view structural view of the display panel in the cutting area of the present application.
  • FIG. 8 is a cross-sectional structure diagram of the display panel of the present application in the cutting area
  • Fig. 9 is a second sectional view of section AA in Fig. 3;
  • Fig. 10 is a third sectional view of section AA in Fig. 3;
  • Fig. 11 is a sectional view of section AA in Fig. 3 before cutting
  • FIG. 12 is a schematic structural diagram of a display module of the present application.
  • FIG. 1 is a film layer structure diagram of a conventional display panel after cutting.
  • the existing OLED display panel in order to reduce the thickness of the display panel, it can use the depolarizer technology to make the OLED panel, that is, replace the existing polarizer with the color resist layer and the black matrix layer, and in order to ensure the flatness of the product, It usually coats a first flat layer on the color filter layer, and attaches a protective layer on the first flat layer to protect the film layer.
  • the temperature of the laser L may carbonize the black light-shielding layer 71 close to the cutting surface 200, and at the same time, due to the small peeling force between the first protective layer 81 and the first flat layer 80, the carbonized black Material enters the gap between the first protective layer 81 and the first flat layer 80, affecting the cleanliness of the display panel.
  • the circled structure in the figure is the black unevenness in area BB in FIG. 1 . Therefore, the present application proposes a display panel to solve the above technical problems
  • the present application provides a display panel 100, which may include a substrate 10, a light emitting device layer 30, and a color filter layer 70, and the light emitting device layer 30 is disposed on the substrate 10;
  • the color filter layer 70 is disposed on the light-emitting device layer 30, the color filter layer 70 includes a light-shielding layer 71 and a plurality of color-resist units 72 embedded in the light-shielding layer 71, and the light-shielding layer 71 includes The first light shielding portion 711 provided on the cutting surface 200 of the display panel 100;
  • the first light shielding portion 711 includes a first edge M1 near the side of the cutting surface 200
  • the substrate 10 includes a second edge M2 near the side of the cutting surface 200
  • the first edge M1 The distance to the cutting surface 200 is larger than the distance from the second edge M2 to the cutting surface 200 .
  • the distance between the first edge M1 and the cutting surface is greater than the distance between the second edge M2 and the cutting surface, so that the light-shielding layer 71 is separated from the cutting surface 200, so as to avoid the high temperature of the laser L during the cutting process of the panel.
  • the light-shielding material is carbonized, thereby preventing carbonized carbon dust from remaining in the edge gap of the display panel 100 , and improving the cleanliness of the product.
  • the dotted line in FIG. 3 is the cutting line GG of the target panel, and the shape surrounded by the cutting line GG is the peripheral shape of the display panel 100 .
  • FIG. 4 is a first cross-sectional view of section AA in FIG. 3
  • FIG. 5 is a detailed structure diagram of some film layers in FIG. 4 .
  • the display panel 100 may include a thin film transistor array layer 20 disposed on the substrate 10, a pixel definition layer 40 disposed on the thin film transistor array layer 20, and a light emitting layer disposed on the same layer as the pixel definition layer 40.
  • the material of the substrate 10 may be glass, quartz or polyimide and other materials.
  • the thin film transistor array layer 20 may include a plurality of thin film transistors 21, and the thin film transistors 21 may be of an etch barrier type, a back channel etch type, or according to gate and active
  • the positions of the layers are divided into structures such as bottom-gate thin film transistors and top-gate thin film transistors, which are not specifically limited.
  • the thin film transistor 21 may include a light-shielding metal layer 211 disposed on the substrate 10, a buffer layer disposed on the light-shielding metal layer 211 212, the active layer 213 disposed on the buffer layer 212, the gate insulating layer 214 disposed on the active layer 213, the gate layer 215 disposed on the gate insulating layer 214, disposed on the The inter-insulation layer 216 on the gate layer 215 , the source-drain layer 217 disposed on the inter-insulation layer 216 , and the second flat layer 218 disposed on the source-drain layer 217 .
  • the display panel 100 may further include an anode layer 31 disposed on the second planar layer 218 , a light emitting layer 33 disposed on the anode layer 31 , and a The cathode layer 32 on the light emitting layer 33 .
  • the anode layer 31 includes a plurality of anodes 311
  • the pixel definition layer 40 includes a plurality of pixel openings corresponding to the plurality of anodes 311, and each of the pixel openings correspondingly exposes an upper surface of the anode 311.
  • the light-emitting layer 33 may include a plurality of light-emitting pixels corresponding to the plurality of anodes 311 one-to-one.
  • the encapsulation layer 50 covers the pixel definition layer 40 and continuously covers a plurality of pixel openings and a plurality of the light-emitting pixels; wherein, the encapsulation layer 50 It may at least include a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer stacked on the pixel definition layer 40 .
  • the touch layer 60 may include a first touch metal layer and a second touch metal layer disposed on the encapsulation layer 50 , and a touch layer disposed between the first touch metal layer and the An insulation layer between the second touch metal layer.
  • the touch layer 60 provided in the embodiment of the present application may be a mutual capacitance or a self capacitance.
  • the color filter layer 70 can be disposed on the touch layer 60 , and the color filter layer 70 can include a light-shielding layer 71 and a light-shielding layer embedded in the light-shielding layer 71 A plurality of color-resisting units 72 of different colors, one color-resisting unit 72 corresponds to one light-emitting pixel, and the color of the color-resisting unit 72 is the same as the light emitted by the corresponding light-emitting pixel.
  • the light-emitting layer 33 includes a first light-emitting pixel 331 emitting a first color, a second light-emitting pixel 332 emitting a second color, and a third light-emitting pixel 333 emitting a third color
  • the color filter layer 70 includes a first color-resist unit 721, a second color-resist unit 722, and a third color-resist unit 723, the first light-emitting pixel 331 corresponds to the first color-resist unit 721, and the second The light emitting pixels 332 correspond to the second color resistance unit 722 , and the third light emitting pixels 333 correspond to the third color resistance unit 723 .
  • the first light-emitting pixel 331 is a red light-emitting pixel
  • the second light-emitting pixel 332 is a green light-emitting pixel
  • the third light-emitting pixel 333 is a blue light-emitting pixel
  • the first color resistance unit 721 is a red color resistance
  • the second color resistance unit 722 is a green color resistance
  • the third color resistance unit 723 is a blue color resistance.
  • the orthographic projection of the first light emitting pixel 331 on the first color resistance unit 721 is located in the first color resistance unit 721, and the second light emitting pixel 332 is located in the second color resistance unit 721.
  • the orthographic projection on the resistance unit 722 is located in the second color resistance unit 722
  • the orthographic projection of the third light-emitting pixel 333 on the third color resistance unit 723 is located in the third color resistance unit 723 .
  • the material of the first planar layer 80 may be the same organic material as that of the second planar layer 218 .
  • the material of the first protective layer 81 may be a flexible material such as polyethylene terephthalate.
  • the display panel 100 may further include a backplane 90 and a second protective layer 91 bonded to the backplane 90.
  • the backplane 90 is disposed on a side of the substrate 10 away from the light emitting direction.
  • the second protective film is located on the side of the back plate 90 away from the light emitting direction.
  • the function of the second protective layer 91 is the same as that of the first protective layer 81 , and the material of the second protective layer 91 may be the same as that of the first protective layer 81 .
  • the peeling force between the first protective layer 81 and the first flat layer 80 is 1 to 4 g/inch
  • the peeling force between the second protective layer 91 and the back plate 90 is The force is 45 to 55g/inch.
  • the first protective layer 81 and the second protective layer 91 are intermediate products in the manufacturing process of the display panel 100, and only exist in the middle of the manufacturing process to protect the first flat layer 80 and other film layer structures below; and in the final product, the first protective layer 81 and the second protective layer 91 will be peeled off.
  • the display panel 100 may include a display area 300 and a non-display area 400 located on the periphery of the display area 300 , while a cutting area 500 and cutting products left by cutting are provided on the side away from the non-display area 400 600.
  • the display panel 100 needs to be cut with a laser L, such as the structure in FIG. Cut product 600.
  • the laser spot of the laser L is a Gaussian spot, as shown in FIG.
  • the cross-section may take the shape of an inverted triangle as shown in Figure 4.
  • the distance between the second edge M2 gradually increases; that is, in the direction from the substrate 10 to the color filter layer 70, without considering the patterning of each film layer, the outer surface of the film layer in the display panel 100 The contour area gradually decreases.
  • the film layer near the light emitting direction has more organic materials, such as the first flat layer 80, the color filter layer 70, the organic packaging layer and the pixel definition layer 40, etc., and the high temperature of the laser L will carbonize the organic material and produce carbon dust that affects the cleanliness of the panel. Therefore, the area of the film layer on the side near the light-emitting direction can be smaller than the area of the film layer on the side away from the light-emitting direction.
  • the distance between the boundary of the film layer on the side close to the light-emitting direction and the second edge M2 is greater than the distance between the boundary of the film layer on the side away from the light-emitting direction and the second edge M2, so as to avoid the accumulation of carbon dust.
  • the cutting surface 200 of the display panel 100 is affected by the characteristics of the laser L itself, making the cutting surface 200 a slope with a certain inclination angle.
  • the acute angle m between the cutting surface 200 and the substrate 10 may range from 60° to 80°, and the acute angle m may be the actual angle between the cutting surface 200 and the substrate 10. horn. Due to the characteristics of the laser L itself, it can control the energy of the laser L to make the angle between the cutting surface 200 and the substrate 10 as close to 90° as possible, but currently it can only reach 80° due to the limitation of the process. Edge or other processing makes the side of the display panel 100 close to 90° with the substrate 10 .
  • the display panel 100 includes multiple organic layers, and at least one side of the organic layer close to the cutting surface 200 is provided with a black material.
  • the high temperature of the laser light L may carbonize the organic material, so After the cutting is completed, there may be residual carbonized carbon dust in the edge region of the above-mentioned film layer, which cannot be completely eliminated in the subsequent edging process, and thus may remain on the cutting surface 200 .
  • the carbonized organic layer adheres to the side of the organic layer, which can protect the organic material in the display area 300 to a certain extent, such as blocking water and oxygen.
  • FIG. 7 and Figure 8 are respectively the top view structure diagram and the cross-sectional structure diagram before the display panel is completely cut.
  • Existing display panels generally use a laser L to cut the mother board, and the high temperature of the laser laser L is harmful to the organic
  • the material has a certain carbonization effect, so the application separates the light-shielding material that may be carbonized from the cutting area 500 .
  • the light-shielding layer 71 includes a first light-shielding portion 711 close to the cutting surface 200 of the display panel 100 , the first edge M1 of the first light-shielding portion 711 is in contact with the cutting surface
  • the distance between the faces 200 is greater than or equal to 50 microns and less than or equal to 150 microns.
  • area a in the figure is the distance between the boundary of the light-shielding part and the center of the cutting line GG
  • area b is the width of the cutting line GG
  • area d is the heat-affected zone H of the laser L, that is The structure in the area b will be cut, and the structure in the area d will be affected by the high temperature of the laser L, so in order to avoid the carbonization of the light-shielding material due to the high temperature of the laser L, the application needs to make the first light-shielding part
  • the boundary of 711 is far away from the area that the laser L can affect, that is, a needs to be greater than d.
  • the range of the difference c between a and b may be: 50um ⁇ c ⁇ 150um. That is, the minimum distance between the boundary of the first light shielding portion 711 and the boundary of the scribe line GG is 50 microns, and the maximum distance is 150 microns.
  • the first light-shielding part 711 is set away from the center of the cutting line GG, so that there is a certain distance between the light-shielding material in the non-display area 400 and the center of the cutting line GG, so as to avoid carbonization of the light-shielding material by the laser L having a relatively high temperature. , and at the same time solve the problem of carbon dust remaining between the first protective layer 81 and the flat layer.
  • the light-shielding layer 71 further includes a second light-shielding portion 712 away from the cut surface 200 , and the thickness of the second light-shielding portion 712 is greater than that of the first light-shielding portion. 711 thickness.
  • the light-shielding layer 71 may include a second light-shielding portion 712 disposed in the display area 300 and a first light-shielding portion 711 disposed in the non-display area 400 , and since the first light-shielding portion 711 is close to
  • the cutting surface 200 is set, that is, when the display panel 100 is cut, the distance between the boundary of the first light-shielding portion 711 and the laser L with a relatively high temperature is relatively small, and there is a laser L that carbonizes the boundary of the first light-shielding portion 711 possibility; and the present application reduces the thickness of the first light-shielding portion 711, and can reduce the generation of carbon dust when the first light-shielding portion 711 is carbonized, and alleviate the first protective layer 81 and flatness. The residual amount of carbon dust between the layers.
  • the display panel 100 further includes a first flat layer 80 disposed on the color filter layer 70, the first flat layer 80 covers the color filter layer 70, and the first The flat layer 80 may cover the first light shielding portion 711 and extend toward the cutting surface 200 .
  • the light-shielding layer 71 is provided with a first notch 710 near the cutting surface 200 of the display panel 100 , and the first notch 710 faces the cutting surface 200 ; meanwhile, the first A region of the flat layer 80 close to the cutting surface 200 is provided with a second notch 810 , and the second notch 810 faces the cutting surface 200 .
  • FIG. 11 is a cross-sectional structure diagram of a section AA of the display panel 100 of the present application before cutting.
  • the display panel 100 and the first flat layer 80 are hollowed out at the side close to the scribe line GG, since both the first flat layer 80 and the light-shielding layer 71 can be made of photoresist organic materials, the hollowed out area It can be formed by a photomask process, for example, by exposing and developing processes, hollowing out the edges of the first flat layer 80 and the light shielding layer 71, so that the first flat layer 80 and the light shielding layer 71 The boundary of is away from the cutting road GG.
  • the second notch 810 corresponds to the first notch 710, and the area of the second notch 810 may be greater than or equal to the area of the first notch 710, so as to further increase the size of the second notch.
  • the second notch 810 is formed in the area of the first flat layer 80 close to the cut surface 200, so that the boundary of the first flat layer 80 is far away from the cut surface 200, even if the first flat layer 80 The boundary is far away from the scribe line GG, avoiding the high-temperature carbonization of the organic material constituting the first flat layer 80 by the laser L, and avoiding carbonized carbon debris remaining between the first flat layer 80 and the first protective layer 81 .
  • the thickness of the first flat layer 80 may be less than or equal to the thickness of the second light shielding portion 712 . Since the first flat layer 80 is disposed close to the cutting surface 200 , in order to avoid a proportion of the first flat layer 80 being carbonized by the laser L, the present application can reduce the thickness of the first flat layer 80 .
  • the first flat layer 80 since the first flat layer 80 is mainly used to smooth the uneven surface of the color filter layer 70, the first flat layer 80 only needs to ensure the flatness of the surface of the color filter layer 70. That is, the minimum thickness of the first flat layer 80 is the difference between the thicknesses of the color-resist unit 72 and the light-shielding layer 71, so as to ensure that the thickness of the area corresponding to the light-shielding layer 71 is the same as the thickness of the area corresponding to the color-resist unit 72.
  • the present application also proposes a display module 700, please refer to FIG. 12, the display module 700 includes the above-mentioned display panel 100 and the cover layer CG on the display panel 100; The orthographic projection on the cover layer is located within said cover layer CG.
  • the structure in FIG. 12 removes the first protection layer 81 and the second protection layer 91 in FIG.
  • the first flat layer 80 is attached to the cover layer CG.
  • the cover layer CG mainly protects the lower panel structure, so in the top view direction of the display module 700 , the outer boundary of the cover layer CG should be larger than the outer boundary of the display panel 100 .
  • the present application also proposes a mobile terminal, which includes a terminal body and the above-mentioned display module, and the terminal body and the display module are combined into one.
  • the terminal body may be a component such as a circuit board bound to a display module.
  • the mobile terminal may include electronic devices such as mobile phones, television sets, and notebook computers.
  • the application discloses a display panel, a display module, and a mobile terminal;
  • the display panel includes a substrate, a light-emitting device layer disposed on the substrate, and a color filter layer disposed on the light-emitting device layer, and the color filter layer includes a light-shielding layer and a plurality of color-resist units embedded in the light-shielding layer,
  • the light-shielding layer includes a first light-shielding portion disposed close to the cutting surface of the display panel;
  • the first light-shielding portion includes a first edge near the cutting surface, and the substrate includes a first edge near the cutting surface The second edge on one side of the surface;
  • the application makes the distance between the first edge and the cutting surface larger than the distance between the second edge and the cutting surface, so that the light-shielding layer is separated from the cutting surface, so as to prevent the panel from being damaged by the laser during the cutting process.
  • the high temperature of L causes the shading material to be carbonized

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Abstract

本申请公开了一种显示面板及显示模组、移动终端；该显示面板包括衬底、设置于衬底上的发光器件层、设置于发光器件层上的彩膜层，彩膜层包括遮光层和内嵌于遮光层内的多个色阻单元，遮光层包括靠近显示面板的切割面设置的第一遮光部；第一遮光部包括靠近切割面一侧的第一边缘，衬底包括靠近切割面一侧的第二边缘。

Description

显示面板及显示模组、移动终端 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及显示模组、移动终端。
 背景技术
OLED（Organic Light-Emitting Diode，有机发光二极管）面板具有轻薄、可视角度大和节电等优势，成为未来的发展主流。
在现有OLED显示面板中，为了降低显示面板的厚度，其可以采用去偏光片技术制作OLED面板，即通过色阻层和黑色矩阵层代替现有的偏光片。而在进行面板切割时，由于需要利用镭射激光L对显示面板外围的黑色矩阵进行切割，镭射激光L的高温将导致黑色矩阵的碳化，而碳化后的碳屑可能残留在显示面板的边缘缝隙中，影响显示面板的洁净度。
因此，亟需一种显示面板以解决上述技术问题。
 技术问题
本申请提供一种显示面板及显示模组、移动终端，以解决现有显示面板的边缘缝隙存在碳屑的技术问题。
 技术解决方案
本申请提供一种显示面板，其包括：
衬底；
发光器件层，设置于所述衬底上；以及
彩膜层，设置于所述发光器件层上，所述彩膜层包括遮光层和内嵌于所述遮光层内的多个色阻单元，所述遮光层包括靠近所述显示面板的切割面设置的第一遮光部；
其中，所述第一遮光部包括靠近所述切割面一侧的第一边缘，所述衬底包括靠近所述切割面一侧的第二边缘，所述第一边缘至所述切割面的间距大于所述第二边缘至所述切割面的间距。
在本申请的显示面板中，所述第一边缘与所述切割面的间距大于或等于50微米且小于或等于150微米。
在本申请的显示面板中，所述遮光层还包括远离所述切割面的第二遮光部，所述第二遮光部的厚度大于所述第一遮光部的厚度。
在本申请的显示面板中，所述显示面板还包括设置于所述彩膜层上第一平坦层，所述第一平坦层覆盖所述彩膜层；
其中，所述第一平坦层覆盖所述第一遮光部以及向所述切割面延伸。
在本申请的显示面板中，所述显示面板还包括设置于所述彩膜层上第一平坦层，所述第一平坦层覆盖所述彩膜层；
其中，所述遮光层靠近所述显示面板的切割面的区域设有第一缺口，所述第一平坦层靠近所述切割面的区域设有第二缺口，所述第一缺口和所述第二缺口朝向所述切割面。
在本申请的显示面板中，所述第一平坦层的厚度小于或等于所述第二遮光部的厚度。
在本申请的显示面板中，在所述衬底至所述彩膜层的方向上，所述显示面板靠近所述切割面一侧的膜层边界和所述第二边缘的间距逐渐增加。
在本申请的显示面板中，所述切割面与所述衬底的锐角夹角范围为60°至80°。
在本申请的显示面板中，所述显示面板包括多层有机层，至少一所述有机层靠近所述切割面的一侧设置有黑色材料。
本申请还提出了一种显示模组，所述显示模组包括上述显示面板及位于所述显示面板上的盖板层；
其中，所述显示面板在所述盖板层上的正投影位于所述盖板层内。
本申请还提出了一种移动终端，其中，所述移动终端包括终端主体和上述显示模组，所述终端主体和所述显示模组组合为一体。
 有益效果
本申请通过使得第一边缘至切割面的间距大于第二边缘至切割面的间距，以使遮光层与切割面分离设置，以避免面板在切割过程中因镭射激光L的高温导致遮光材料被碳化，进而避免了碳化后的碳屑残留在显示面板的边缘缝隙，提高了产品的洁净度。
 附图说明
图1为现有显示面板的剖视图；
图2为现有显示面板的异常区域的放大图；
图3为本申请显示面板在切割示意图；
图4为图3中截面AA的第一种剖面图；
图5为图4中部分膜层的详细结构图；
图6为镭射激光的高斯光斑示意图；
图7为本申请显示面板在切割区域的俯视结构图；
图8为本申请显示面板在切割区域的剖面结构图；
图9为图3中截面AA的第二种剖面图；
图10为图3中截面AA的第三种剖面图；
图11为图3中截面AA在切割前的剖面图；
图12为本申请显示模组的结构示意图。
 本发明的实施方式
为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
请参阅图1，图1为现有显示面板切割后的膜层结构图。在现有OLED显示面板中，为了降低显示面板的厚度，其可以采用去偏光片技术制作OLED面板，即通过色阻层和黑色矩阵层代替现有的偏光片，而为了保证产品的平坦性，其通常在彩膜层上涂覆第一平坦层，以及在第一平坦层上贴合保护层以保护膜层。而在进行面板切割时，镭射激光L的温度可能将靠近切割面200的黑色遮光层71碳化，同时由于第一保护层81和第一平坦层80之间的剥离力较小，使得碳化的黑色材料进入第一保护层81和第一平坦层80之间的缝隙，影响显示面板的洁净度，具体请参阅图2，图中圈圈的结构图1中区域BB的黑色不均匀物。因此，本申请提出了一种显示面板以解决上述技术问题
请参阅图3至图12，本申请提供一种显示面板100，其可以包括衬底10、发光器件层30以及彩膜层70，所述发光器件层30设置于所述衬底10上；所述彩膜层70设置于所述发光器件层30上，所述彩膜层70包括遮光层71和内嵌于所述遮光层71内的多个色阻单元72，所述遮光层71包括靠近所述显示面板100的切割面200设置的第一遮光部711；
其中，所述第一遮光部711包括靠近所述切割面200一侧的第一边缘M1，所述衬底10包括靠近所述切割面200一侧的第二边缘M2，所述第一边缘M1至所述切割面200的间距大于所述第二边缘M2至所述切割面200的间距。
本申请通过使得第一边缘M1至切割面的间距大于第二边缘M2至切割面的间距，以使遮光层71与切割面200分离设置，以避免面板在切割过程中因镭射激光L的高温导致遮光材料被碳化，进而避免了碳化后的碳屑残留在显示面板100的边缘缝隙，提高了产品的洁净度。
现结合具体实施例对本申请的技术方案进行描述。
请参阅图3，图3中虚线为目标面板的切割道GG，切割道GG围成的形状为所述显示面板100外围形状。
请参阅图4和图5，图4为图3中截面AA的第一种剖面图，图5为图4中部分膜层的详细结构图。
所述显示面板100可以包括设置于所述衬底10上的薄膜晶体管阵列层20、设置于所述薄膜晶体管阵列层20上的像素定义层40、与所述像素定义层40同层设置的发光器件层30、设置于所述像素定义层40上的封装层50、设置于所述封装层50上的触控层60、设置于所述触控层60上的彩膜层70、设置于所述彩膜层70上的第一平坦层80、以及设置于所述第一平坦层80上的第一保护层81。
在本实施例中，所述衬底10的材料可以为玻璃、石英或聚酰亚胺等材料。
在本实施例中，请参阅图5，所述薄膜晶体管阵列层20可以包括多个薄膜晶体管21，所述薄膜晶体管21可以为蚀刻阻挡型、背沟道蚀刻型，或者根据栅极与有源层的位置划分为底栅薄膜晶体管、顶栅薄膜晶体管等结构，具体没有限制。例如，图5中所示的薄膜晶体管21为顶栅型薄膜晶体管，该薄膜晶体管21可以包括设置于所述衬底10上的遮光金属层211、设置于所述遮光金属层211上的缓冲层212、设置于所述缓冲层212上的有源层213、设置于所述有源层213上的栅绝缘层214、设置于所述栅绝缘层214上的栅极层215、设置于所述栅极层215上的间绝缘层216、设置于所述间绝缘层216上的源漏极层217、设置于所述源漏极层217上的第二平坦层218。
在本实施例中，请参阅图5，所述显示面板100还可以包括设置于所述第二平坦层218上的阳极层31、设置于所述阳极层31上的发光层33、以及设置于所述发光层33上的阴极层32。所述阳极层31包括多个阳极311，所述像素定义层40包括与多个所述阳极311一一对应的多个像素开口，且每一所述像素开口对应露出一所述阳极311的上表面，所述发光层33可包括与多个所述阳极311一一对应的多个发光像素。
在本实施例中，请参阅图4，所述封装层50覆盖于所述像素定义层40上，并连续地覆盖多个像素开口以及多个所述发光像素上；其中，所述封装层50可以至少包括层叠设置于像素定义层40上的第一无机封装层、第一有机封装层以及第二无机封装层。
在本实施例中，请参阅图4，所述触控层60可以包括设置于封装层50上的第一触控金属层与第二触控金属层，以及设置于第一触控金属层与第二触控金属层之间的绝缘层。
在本实施例中，本申请实施例提供的所述触控层60可为互容式或自容式。
在本实施例中，请参阅图4，所述彩膜层70可以设置于所述触控层60上，所述彩膜层70可以包括遮光层71和内嵌于所述遮光层71内的多个不同颜色的色阻单元72，一所述色阻单元72与一所述发光像素对应，所述色阻单元72的颜色和对应的所述发光像素发出的光线相同。
在本实施例中，请参阅图4，所述发光层33包括发射第一颜色的第一发光像素331、发射第二颜色的第二发光像素332、发射第三颜色的第三发光像素333，所述彩膜层70包括第一色阻单元721、第二色阻单元722以及第三色阻单元723，所述第一发光像素331与所述第一色阻单元721对应，所述第二发光像素332与所述第二色阻单元722对应，所述第三发光像素333与所述第三色阻单元723对应。
在本实施例中，所述第一发光像素331为红色发光像素，所述第二发光像素332为绿色发光像素，所述第三发光像素333为蓝色发光像素，所述第一色阻单元721为红色色阻，所述第二色阻单元722为绿色色阻，所述第三色阻单元723为蓝色色阻。
在本实施例中，所述第一发光像素331在所述第一色阻单元721上的正投影位于所述第一色阻单元721内，所述第二发光像素332在所述第二色阻单元722上的正投影位于所述第二色阻单元722内，所述第三发光像素333在所述第三色阻单元723上的正投影位于所述第三色阻单元723内。
在本实施例中，所述第一平坦层80的材料可以与所述第二平坦层218设置相同的有机材料。
在本实施例中，所述第一保护层81的材料可以为聚对苯二甲酸乙二醇酯等柔性材料。
在本实施例中，所述显示面板100还可以包括背板90和与所述背板90贴合的第二保护层91，所述背板90设置于所述衬底10背离出光方向的一侧，所述第二保护膜位于所述背板90背离出光方向的一侧。
在本实施例中，所述第二保护层91的作用与所述第一保护层81的相同，所述第二保护层91的材料可以与所述第一保护层81的材料相同。
在本实施例中，所述第一保护层81与所述第一平坦层80之间的剥离力为1至4g/inch，所述第二保护层91与所述背板90之间的剥离力为45至55g/inch。
在本实施例中，所述第一保护层81和所述第二保护层91为所述显示面板100制作过程中的中间产物，仅仅在制程的中间过程存在，以保护第一平坦层80及下方的其他膜层结构；而在最终的产品中，所述第一保护层81和所述第二保护层91将会被剥离。
请参阅图4，所述显示面板100可以包括显示区300以及位于显示区300外围的非显示区400，同时在远离非显示区400一侧设有切割区500和因切割而留下的切割产物600。
而显示面板100在切割过程中，需要利用的镭射激光L对显示面板100进行切割，例如图4中的结构，切割区500左侧的产物为目标产品，切割区500右侧的产物为无用的切割产物600。
在本实施例中，由于镭射激光L的光斑为高斯光斑，请参阅图6所示，所述镭射激光L具有中间能量高以及四周能量依次递减的特性，因此利用镭射激光L切割后的膜层剖面可能呈现如图4所示的倒三角形状。
在本申请的显示面板100中，请参阅图4，在所述衬底10至所述彩膜层70的方向上，所述显示面板100靠近所述切割面200一侧的膜层边界和所述第二边缘M2的间距逐渐增加；即在所述衬底10至所述彩膜层70的方向上，在不考虑各膜层图案化的情况下，所述显示面板100中膜层的外轮廓面积逐渐减小。
在本实施例中，除了镭射激光L本身的特性外，由于靠近出光方向一侧的膜层具有较多的有机材料，例如第一平坦层80、彩膜层70、有机封装层以及像素定义层40等，而镭射激光L的高温作用将使得该有机材料碳化，产生影响面板洁净度的碳屑，因此靠近出光方向一侧的膜层的面积可以小于远离出光方向一侧的膜层的面积，即靠近出光方向一侧的膜层的边界与第二边缘M2的间距大于远离出光方向一侧的膜层的边界与第二边缘M2的间距，避免碳屑的堆积。
在切割过程中，随着镭射激光L向背离显示面板100的发光方向运动，显示面板100的切割面200由于镭射激光L自身特性的影响，使得切割面200为一具有一定倾斜角度的斜面。
在本实施例中，所述切割面200与所述衬底10的锐角夹角m范围可以为60°至80°，该锐角夹角m可以为所述切割面200与衬底10的实际夹角。由于镭射激光L自身的特性，其可以通过控制镭射激光L能量尽量使得切割面200与所述衬底10的夹角接近90°，而目前由于工艺的限制只能达到80°，后续可以通过磨边或者其他处理使得显示面板100的侧边与衬底10接近90°。
在本申请的显示面板100中，所述显示面板100包括多层有机层，至少一所述有机层靠近所述切割面200的一侧设置有黑色材料。
在本实施例中，由于所述显示面板100中包括第一平坦层80、彩膜层70、有机封装层以及像素定义层40等有机层，镭射激光L的高温可能使得该有机材料碳化，因此在切割完成后，上述膜层的边缘区可能存在碳化后的碳屑残留，在后续的磨边工艺中，该碳屑无法完全消除，因此可能残留在切割面200上。同时，碳化后的有机层附着在有机层的侧边，可以对显示区300中的有机材料起到一定的保护作用，例如阻水氧等。
图7和图8所示的结构分别为显示面板未完全切割前的俯视结构图和剖面结构图，现有的显示面板一般采用镭射激光L对母板进行切割，而镭射激光L的高温对有机材料具有一定的碳化作用，因此本申请将可能发生碳化的遮光材料与切割区500分离设置。
在本申请的显示面板100中，所述遮光层71包括靠近所述显示面板100的切割面200的第一遮光部711，所述第一遮光部711的所述第一边缘M1与所述切割面200的间距大于或等于50微米且小于或等于150微米。
请参阅图7和图8，图中区域a为所述遮光部的边界与切割道GG的中心的间距，区域b为切割道GG的宽度，区域d为镭射激光L的热影响区H，即在区域b中的结构将被切割，而区域d内的结构将因镭射激光L的高温被影响，因此为了避免遮光材料因镭射激光L的高温所碳化，本申请需要使得所述第一遮光部711的边界远离镭射激光L所能影响的区域，即a需要大于d。
在本实施例中，a与b的差值c的范围可以为：50um≤c≤150um。即所述第一遮光部711的边界与所述切割道GG的边界的最小间距为50微米，以及最大间距为150微米。
本实施例通过将第一遮光部711远离切割道GG的中心设置，使得非显示区400中的遮光材料与切割道GG中心存在一定距离，避免具有较高温度的镭射激光L对遮光材料的碳化，同时解决了第一保护层81和平坦层之间碳屑的残留。
在本申请的显示面板100中，请参阅图9，所述遮光层71还包括远离所述切割面200的第二遮光部712，所述第二遮光部712的厚度大于所述第一遮光部711的厚度。
在本实施例中，所述遮光层71可以包括设置于显示区300内的第二遮光部712和设置于非显示区400内的第一遮光部711，而由于所述第一遮光部711靠近切割面200设置，即显示面板100在切割时，所述第一遮光部711的边界与具有较高温度的镭射激光L的间距较小，存在镭射激光L碳化所述第一遮光部711的边界的可能性；而本申请通过减小所述第一遮光部711的厚度，可以在所述第一遮光部711被碳化的情况下，减少碳屑的生成，缓解了第一保护层81和平坦层之间碳屑的残留量。
在本申请的显示面板100中，所述显示面板100还包括设置于所述彩膜层70上第一平坦层80，所述第一平坦层80覆盖所述彩膜层70，所述第一平坦层80可以覆盖所述第一遮光部711以及向所述切割面200延伸。
请参阅图9和10，所述遮光层71靠近所述显示面板100的切割面200的区域设有第一缺口710，所述第一缺口710朝向所述切割面200；同时，所述第一平坦层80靠近所述切割面200的区域设有第二缺口810，所述第二缺口810朝向所述切割面200。
请参阅图9和10，由于色阻单元72和遮光层71的厚度不一致，因此在完成彩膜的工艺后，彩膜层70的平整度较低，因此需要在彩膜层70上设置所述第一平坦层80；同时，由于所述第一平坦层80由有机材料构成，镭射激光L在切割时，平坦层的材料同样能被碳化而形成黑色的碳屑，因此所述第一平坦层80靠近切割面200的一侧不能设置平坦层材料。
请参阅图11，图11为本申请显示面板100在切割前截面AA的剖面结构图。所述显示面板100和所述第一平坦层80在靠近切割道GG的一侧被挖空，由于第一平坦层80和遮光层71均可以有光阻型有机材料构成，因此该挖空区域可以通过光罩工艺形成，例如通过曝光及显影工艺，对所述第一平坦层80和所述遮光层71的边缘进行挖空处理，以使所述第一平坦层80和所述遮光层71的边界远离所述切割道GG。
在本实施例中，所述第二缺口810和所述第一缺口710对应，所述第二缺口810的面积可以大于或等于所述第一缺口710的面积，以进一步增大所述第二缺口810的边界和所述切割面200的间距。
本申请通过在所述第一平坦层80靠近切割面200的区域形成第二缺口810，以使所述第一平坦层80的边界远离所述切割面200，即使所述第一平坦层80的边界远离切割道GG，避免了构成所述第一平坦层80的有机材料被镭射激光L的高温碳化，以及避免了碳化后的碳屑在第一平坦层80和第一保护层81之间残留。
在本申请的显示面板100中，请参阅图4，所述第一平坦层80的厚度可以小于或等于所述第二遮光部712的厚度。由于所述第一平坦层80靠近所述切割面200设置，因此为了避免所述第一平坦层80被镭射激光L碳化的占比，本申请可以减小所述第一平坦层80的厚度。
在本实施例中，由于所述第一平坦层80主要用于使凹凸不平的彩膜层70的表面平整，因此所述第一平坦层80只要保证彩膜层70的表面的平整度即可，即所述第一平坦层80的最小厚度为色阻单元72和遮光层71厚度的差值，以保证遮光层71对应的区域的厚度和色阻单元72对应的区域的厚度相同。
本申请还提出了一种显示模组700，请参阅图12，所述显示模组700包括上述显示面板100及位于所述显示面板100上的盖板层CG；所述显示面板100在所述盖板层上的正投影位于所述盖板层CG内。
在本实施例中，与图4中的结构相比，图12中的结构将图4中的第一保护层81以及第二保护层91去除，同时，显示面板100可以通过光学胶将所述第一平坦层80和所述盖板层CG贴合。
在本实施例中，盖板层CG主要对下方的面板结构起到保护作用，因此在所述显示模组700的俯视图方向，盖板层CG的外边界应大于显示面板100的外边界。
本申请还提出了一种移动终端，其包括终端主体和上述显示模组，所述终端主体和所述显示模组组合为一体。该终端主体可以为绑定于显示模组的电路板等器件等。所述移动终端可以包括手机、电视机、笔记本电脑等电子设备。
本申请公开了一种显示面板及显示模组、移动终端；该显示面板包括衬底、设置于衬底上的发光器件层、设置于发光器件层上的彩膜层，彩膜层包括遮光层和内嵌于遮光层内的多个色阻单元，遮光层包括靠近显示面板的切割面设置的第一遮光部；第一遮光部包括靠近切割面一侧的第一边缘，衬底包括靠近切割面一侧的第二边缘；本申请通过使得第一边缘至切割面的间距大于第二边缘至切割面的间距，以使遮光层与切割面分离设置，以避免面板在切割过程中因镭射激光L的高温导致遮光材料被碳化，进而避免了碳化后的碳屑残留在显示面板的边缘缝隙，提高了产品的洁净度。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种显示面板，其特征在于，包括：
    衬底；
    发光器件层，设置于所述衬底上；以及
    彩膜层，设置于所述发光器件层上，所述彩膜层包括遮光层和内嵌于所述遮光层内的多个色阻单元，所述遮光层包括靠近所述显示面板的切割面设置的第一遮光部；
    其中，所述第一遮光部包括靠近所述切割面一侧的第一边缘，所述衬底包括靠近所述切割面一侧的第二边缘，所述第一边缘至所述切割面的间距大于所述第二边缘至所述切割面的间距。
  2. 根据权利要求1所述的显示面板，其特征在于，所述第一边缘与所述切割面的间距大于或等于50微米且小于或等于150微米。
  3. 根据权利要求2所述的显示面板，其特征在于，所述遮光层还包括远离所述切割面的第二遮光部，所述第二遮光部的厚度大于所述第一遮光部的厚度。
  4. 根据权利要求3所述的显示面板，其特征在于，所述显示面板还包括设置于所述彩膜层上第一平坦层，所述第一平坦层覆盖所述彩膜层。
  5. 根据权利要求3所述的显示面板，其特征在于，所述第一平坦层覆盖所述第一遮光部以及向所述切割面延伸。
  6. 根据权利要求3所述的显示面板，其特征在于，所述遮光层靠近所述显示面板的切割面的区域设有第一缺口，所述第一平坦层靠近所述切割面的区域设有第二缺口，所述第一缺口和所述第二缺口朝向所述切割面。
  7. 根据权利要求4所述的显示面板，其特征在于，所述第一平坦层的厚度小于或等于所述第二遮光部的厚度。
  8. 根据权利要求1所述的显示面板，其特征在于，在所述衬底至所述彩膜层的方向上，所述显示面板靠近所述切割面一侧的膜层边界和所述第二边缘的间距逐渐增加。
  9. 根据权利要求8所述的显示面板，其特征在于，所述切割面与所述衬底的锐角夹角范围为60°至80°。
  10. 根据权利要求1所述的显示面板，其特征在于，所述显示面板包括多层有机层，至少一所述有机层靠近所述切割面的一侧设置有黑色材料。
  11. 一种显示模组，其特征在于，所述显示模组包括显示面板及位于所述显示面板上的盖板层，所述显示面板在所述盖板层上的正投影位于所述盖板层内；其中，所述显示面板包括：
    衬底；
    发光器件层，设置于所述衬底上；以及
    彩膜层，设置于所述发光器件层上，所述彩膜层包括遮光层和内嵌于所述遮光层内的多个色阻单元，所述遮光层包括靠近所述显示面板的切割面设置的第一遮光部；
    其中，所述第一遮光部包括靠近所述切割面一侧的第一边缘，所述衬底包括靠近所述切割面一侧的第二边缘，所述第一边缘至所述切割面的间距大于所述第二边缘至所述切割面的间距。
  12. 根据权利要求11所述的显示模组，其特征在于，所述第一边缘与所述切割面的间距大于或等于50微米且小于或等于150微米。
  13. 根据权利要求12所述的显示模组，其特征在于，所述遮光层还包括远离所述切割面的第二遮光部，所述第二遮光部的厚度大于所述第一遮光部的厚度。
  14. 根据权利要求13所述的显示模组，其特征在于，所述显示面板还包括设置于所述彩膜层上第一平坦层，所述第一平坦层覆盖所述彩膜层。
  15. 根据权利要求13所述的显示模组，其特征在于，所述第一平坦层覆盖所述第一遮光部以及向所述切割面延伸。
  16. 根据权利要求13所述的显示模组，其特征在于，所述遮光层靠近所述显示面板的切割面的区域设有第一缺口，所述第一平坦层靠近所述切割面的区域设有第二缺口，所述第一缺口和所述第二缺口朝向所述切割面。
  17. 根据权利要求14所述的显示模组，其特征在于，所述第一平坦层的厚度小于或等于所述第二遮光部的厚度。
  18. 根据权利要求11所述的显示模组，其特征在于，在所述衬底至所述彩膜层的方向上，所述显示面板靠近所述切割面一侧的膜层边界和所述第二边缘的间距逐渐增加。
  19. 根据权利要求11所述的显示模组，其特征在于，所述显示面板包括多层有机层，至少一所述有机层靠近所述切割面的一侧设置有黑色材料。
  20. 一种移动终端，其特征在于，所述移动终端包括终端主体和权利要求11所述的显示模组，所述终端主体和所述显示模组组合为一体。
PCT/CN2021/140907 2021-12-22 2021-12-23 显示面板及显示模组、移动终端 WO2023115465A1 (zh)

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