WO2023109552A1 - 电子设备及信息卡识别方法 - Google Patents

电子设备及信息卡识别方法 Download PDF

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Publication number
WO2023109552A1
WO2023109552A1 PCT/CN2022/136647 CN2022136647W WO2023109552A1 WO 2023109552 A1 WO2023109552 A1 WO 2023109552A1 CN 2022136647 W CN2022136647 W CN 2022136647W WO 2023109552 A1 WO2023109552 A1 WO 2023109552A1
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WO
WIPO (PCT)
Prior art keywords
card
shrapnel
interface
memory card
card controller
Prior art date
Application number
PCT/CN2022/136647
Other languages
English (en)
French (fr)
Inventor
杨江涛
范姝男
周雷
张诗豪
Original Assignee
华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023109552A1 publication Critical patent/WO2023109552A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/16—Connectors or connections adapted for particular applications for telephony

Definitions

  • the present application relates to the technical field of communication, and in particular to an electronic device and an information card identification method.
  • the application provides an electronic device, the electronic device can communicate with a card compatible with Nano SIM card function and memory card function, and a card socket assembly can meet the card insertion requirements of the electronic device, thereby reducing the number of card socket components, which is beneficial The thinning and lightening of electronic equipment.
  • the present application also provides a method for identifying an information card, through which an electronic device can automatically identify the type of an inserted information card.
  • the present application provides an electronic device, including a card socket assembly and a processor; the card socket assembly includes a card connector, and when a card is inserted into the card socket assembly, the ten golden fingers of the card and the ten shrapnels of the card connector One-to-one correspondence and electrical connection.
  • the card is an information card.
  • the card includes a memory card circuit and a SIM card circuit, and the card may be a two-in-one card.
  • the processor includes a memory card controller, a SIM card controller, a power interface and a ground interface. The interfaces of the memory card controller and the SIM card controller are connected to eight of the ten shrapnels, and the power interface is connected to the ten shrapnels. The other shrapnel, the ground interface is connected to the other shrapnel among the ten shrapnel.
  • the card connector of the card socket assembly of the electronic device can communicate with the card through ten shrapnels, realize the SIM card function and the memory card function, improve the integration degree, and the electronic device can effectively reduce the number of information cards that need to be inserted. Reducing the number of card holder components is conducive to the thinning and lightening of electronic equipment, and can also improve user experience.
  • the electronic device further includes a switch, the switch is connected to the reset interface of the SIM card controller and one of the interfaces of the memory card controller, and the switch is also connected to one of the ten elastic pieces.
  • the reset operation of the SIM card circuit of the card since the reset operation of the SIM card circuit of the card is not frequently operated, and the reset process can be completed quickly, when the reset interface and one of the interfaces of the memory card controller reuse the same shrapnel, it can be time-shared
  • the method of multiplexing makes full use of the shrapnel for signal transmission. For example, when the SIM card circuit of the card needs to be reset, first connect a shrapnel of the card connector to the SIM card controller including the reset interface to ensure the user's networking experience. After the reset process of the SIM card module of the card is completed, the shrapnel is switched back to conduct the memory card controller, so as to continue to complete the read and write operations on the card, thereby improving the working efficiency of the electronic device.
  • the memory card controller supports the eMMC interface protocol; the switch is connected to the command and response multiplexing interface of the memory card controller; among the ten shrapnels, seven shrapnels are connected to the memory card controller one by one.
  • the circuit structure of the processor is simple and stable, which is beneficial to ensure Reliability of signal transmission and low cost.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, the ground interface is connected to the seventh shrapnel; the switch is connected to the sixth shrapnel; the four data interfaces of the memory card controller are connected to the first shrapnel, the second shrapnel, the ninth shrapnel and the tenth shrapnel correspondingly,
  • the clock interface of the memory card controller is connected to the fifth shrapnel; the data interface of the SIM card controller is connected to the third shrapnel, and the clock interface of the SIM card controller is connected to the fourth shrapnel.
  • the memory card controller supports the eMMC interface protocol; the switch is connected to the clock interface of the memory card controller; among the ten shrapnels, seven shrapnels are connected to the four data interfaces of the memory card controller one by one , a command and response multiplexing interface of the memory card controller, a data interface of the SIM card controller, and a clock interface of the SIM card controller.
  • the circuit structure of the processor is simple and stable, which is beneficial to ensure Reliability of signal transmission and low cost.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, the ground interface is connected to the seventh shrapnel; the switch is connected to the sixth shrapnel; the four data interfaces of the memory card controller are connected to the first shrapnel, the second shrapnel, the ninth shrapnel and the tenth shrapnel correspondingly,
  • the command and response multiplexing interface of the memory card controller is connected to the fifth shrapnel;
  • the data interface of the SIM card controller is connected to the third shrapnel, and the clock interface of the SIM card controller is connected to the fourth shrapnel.
  • the memory card controller supports the UFS interface protocol or the PCIe interface protocol; the switch is connected to the reference clock interface of the memory card controller; among the ten shrapnels, seven shrapnels are connected to the memory card controller one by one The four data interfaces of the memory card controller, the second power interface of the memory card controller, the data interface of the SIM card controller, and the clock interface of the SIM card controller.
  • the circuit structure of the processor is simple and stable, which is beneficial to ensure Reliability of signal transmission and low cost.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, the ground interface is connected to the seventh shrapnel; the switch is connected to the sixth shrapnel; the three data interfaces of the memory card controller are connected to the fifth shrapnel, the ninth shrapnel and the tenth shrapnel correspondingly, and the memory card controls
  • One of the other data interface of the memory card controller and the second power interface of the memory card controller is connected to the first shrapnel, and the other is connected to the second shrapnel;
  • the data interface of the SIM card controller is connected to the third shrapnel, and the SIM card controller’s data interface is connected to the third shrapnel.
  • the clock interface is connected to the fourth shrapnel.
  • the processor also includes a frequency divider
  • the memory card controller supports the eMMC interface protocol
  • the clock interface of the memory card controller is connected to one of the ten shrapnel
  • the clock interface of the memory card controller passes through the frequency divider Connect to the clock interface of the SIM card controller.
  • the frequency divider is used to align the clock of the memory card controller and the clock of the SIM card controller, so that the ten shrapnels of the card connector can be respectively connected to fixed interfaces, so that there is no need for circuit switching, and the circuit of the processor
  • the structure is simple and stable, which is beneficial to ensure the reliability of signal transmission, and the cost is low.
  • seven shrapnels are connected one by one to the four data interfaces of the memory card controller, the command and response multiplexing interface of the memory card controller, and the data interface of the SIM card controller. interface and the reset interface of the SIM card controller.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, the ground interface is connected to the seventh shrapnel; the clock interface of the memory card controller is connected to the fourth shrapnel, and the four data interfaces of the memory card controller are connected to the first shrapnel, the second shrapnel, and the ninth shrapnel in one-to-one correspondence.
  • the command and response multiplexing interface of the memory card controller is connected to the fifth shrapnel;
  • the data interface of the SIM card controller is connected to the third shrapnel, and the reset interface of the SIM card controller is connected to the sixth shrapnel.
  • the processor also includes a frequency divider
  • the memory card controller supports the UFS interface protocol or the PCIe interface protocol
  • the reference clock interface of the memory card controller is connected to one of the ten shrapnels
  • the reference clock interface of the memory card controller is connected to one of the ten shrapnels.
  • the clock interface is connected to the clock interface of the SIM card controller through a frequency divider.
  • the frequency divider is used to align the clock of the memory card controller and the clock of the SIM card controller, so that the ten shrapnels of the card connector can be respectively connected to fixed interfaces, so that there is no need for circuit switching, and the circuit of the processor
  • the structure is simple and stable, which is beneficial to ensure the reliability of signal transmission, and the cost is low.
  • seven of the shrapnels are connected to the four data interfaces of the memory card controller, the second power supply interface of the memory card controller, the data interface of the SIM card controller, and the The reset interface of the SIM card controller.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, the ground interface is connected to the seventh shrapnel; the clock interface of the memory card controller is connected to the fourth shrapnel, and the three data interfaces of the memory card controller are connected to the fifth shrapnel, the ninth shrapnel and the first shrapnel one by one.
  • Ten shrapnel, one of the other data interface of the memory card controller and the second power interface of the memory card controller is connected to the first shrapnel, and the other is connected to the second shrapnel; the data interface of the SIM card controller is connected to the third shrapnel , the reset interface of the SIM card controller is connected to the sixth shrapnel.
  • the memory card controller supports the UFS interface protocol or the PCIe interface protocol; among the ten shrapnels, eight of the shrapnels are connected to the four data interfaces of the memory card controller and the ports of the memory card controller one by one.
  • the memory card controller of the electronic device does not have a second power interface.
  • the card obtains the second power signal through the first power signal, thereby simplifying the communication path between the electronic device and the card.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, and the ground interface is connected to the seventh shrapnel; the four data interfaces of the memory card controller are connected to the first shrapnel, the second shrapnel, the ninth shrapnel and the tenth shrapnel one by one; the data of the SIM card controller
  • the interface is connected to the third shrapnel, and the clock interface of the SIM card controller is connected to the fourth shrapnel; one of the reference clock interface of the memory card controller and the reset interface of the SIM card controller is connected to the fifth shrapnel, and the other is connected to the sixth shrapnel .
  • the memory card controller supports the PCIe interface protocol.
  • the reference clock interface and the second power interface of the memory card controller are connected to the same shrapnel among the ten shrapnels; the four data interfaces of the memory card controller are connected to the other four shrapnels among the ten shrapnels correspondingly;
  • the reset interface of the card controller, the data interface of the SIM card controller and the clock interface of the SIM card controller are connected to the other three shrapnels among the ten shrapnels in a one-to-one correspondence.
  • the reference clock signal and the second power supply signal of the memory card are transmitted through the same shrapnel, and the two signals can be separated in the card, so that the number of shrapnels and the card holder can be reduced while ensuring normal communication.
  • the volume of components is conducive to the thinning and lightening of electronic equipment.
  • ten shrapnels are arranged in an array, and the ten shrapnels are arranged along the second direction to form a first row of shrapnels and a second row of shrapnels, and the first row of shrapnels includes first shrapnels arranged along the first direction
  • the third shrapnel, the fifth shrapnel, the seventh shrapnel and the ninth shrapnel, the second row of shrapnels include the second shrapnel, the fourth shrapnel, the sixth shrapnel, the eighth shrapnel and the tenth shrapnel arranged along the first direction, the first shrapnel
  • the direction is perpendicular to the second direction.
  • the power interface is connected to the eighth shrapnel, and the ground interface is connected to the seventh shrapnel; the four data interfaces of the memory card controller are connected to the first shrapnel, the second shrapnel, the ninth shrapnel, and the tenth shrapnel in one-to-one correspondence; the SIM card controller’s
  • the data interface is connected to the third shrapnel, the clock interface of the SIM card controller is connected to the fourth shrapnel;
  • the reference clock interface of the memory card controller and the second power interface of the memory card controller are connected to one of the fifth shrapnel or the sixth shrapnel , the reset interface of the SIM card controller is connected to the other of the fifth shrapnel or the sixth shrapnel.
  • the ten elastic sheets are arranged along the first direction into a first row to a fifth row of elastic sheets.
  • the center distance between the second row of shrapnel and the third row of shrapnel is greater than the center distance between the first row of shrapnel and the second row of shrapnel, and greater than the center distance between the fourth row of shrapnel and the fifth row of shrapnel.
  • the center distance between the third row of shrapnel and the fourth row of shrapnel is greater than the center distance between the first row of shrapnel and the second row of shrapnel, and greater than the center distance between the fourth row of shrapnel and the fifth row of shrapnel.
  • multiple elastic sheets can form various combinations.
  • the number and position are matched, so that the card connector can communicate with different types of information cards, realize multi-card compatibility, and have good expandability. Therefore, when the card connector is applied to a card holder assembly of an electronic device, the electronic device can be adapted to various types of information cards through the same card holder assembly, thereby reducing the number of card holder assemblies and reducing the need for internal space of the electronic device.
  • the occupation is conducive to the thinning and lightening of electronic equipment.
  • the present application also provides an information card identification method, including: executing the first initialization process; if the first reply instruction is received, then judging that the inserted information card is the first card; if the first reply instruction is not received , then it is judged that the inserted information card is not the first card, and the second initialization process is executed; if the second reply command is received, it is judged that the inserted information card is the second card; The information card is not the second card.
  • one of the first initialization process and the second initialization process is a two-in-one card initialization process, and the other is a SIM card initialization process.
  • the electronic device executes the initialization process of the information card, and if it receives a specific reply signal, it can judge that the information card is an information card corresponding to the initialization process; if it does not receive a specific reply signal, it can judge that the information
  • the card is not an information card corresponding to the initialization process, and the next initialization process is executed to determine whether the information card is an information card corresponding to the next initialization process.
  • electronic equipment can realize the automatic identification of Nano SIM card and two-in-one card.
  • the first initialization process when it is detected that the state of the card tray is switched from the disengaged state to the inserted state, or when it is detected that the electronic device is turned on or restarted, the first initialization process is executed.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • Fig. 2 is a schematic structural view of the deck assembly shown in Fig. 1 in some usage states;
  • Fig. 3 is a schematic diagram of an exploded structure of the deck shown in Fig. 2;
  • Fig. 4 is a structural schematic diagram of the card holder shown in Fig. 2 at another angle;
  • FIG. 5 is a schematic structural diagram of a card connector provided in an embodiment of the present application.
  • Fig. 6 is a structural schematic view 1 of the card connector shown in Fig. 5 at another angle;
  • Fig. 7 is a schematic structural view of the conductor of the card connector shown in Fig. 6;
  • Fig. 8 is a schematic diagram of the internal structure of the structure at A of the card connector shown in Fig. 6;
  • Fig. 9 is a structural schematic diagram II of the card connector shown in Fig. 5 at another angle;
  • Fig. 10 is a schematic block diagram of a Nano SIM card provided by the embodiment of the present application.
  • Fig. 11 is a schematic structural view of the Nano SIM card shown in Fig. 10 in some embodiments.
  • Fig. 12 is a structural schematic diagram when the Nano SIM card shown in Fig. 11 is connected to the card connector shown in Fig. 5;
  • Fig. 13 is a schematic block diagram of a first NM card provided by an embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of the first NM card shown in Fig. 13 in some embodiments.
  • Fig. 15 is a structural schematic diagram when the first NM card shown in Fig. 14 is connected to the card connector shown in Fig. 5;
  • Fig. 16 is a schematic block diagram of a two-in-one card provided by an embodiment of the present application.
  • Fig. 17 is a schematic structural view of some embodiments of the two-in-one card shown in Fig. 16;
  • Fig. 18 is a schematic diagram of the structure when the two-in-one card shown in Fig. 17 is connected to the card connector shown in Fig. 5;
  • Fig. 19 is a dimensional drawing of the two-in-one card shown in Fig. 17 in some embodiments.
  • Fig. 20A is a dimensional drawing of the two-in-one card shown in Fig. 16 in other embodiments;
  • Fig. 20B is another dimensional drawing of the two-in-one card shown in Fig. 20A;
  • Fig. 21 is a dimensional drawing of the two-in-one card shown in Fig. 16 in other embodiments;
  • Fig. 22 is a dimensional drawing of the two-in-one card shown in Fig. 16 in other embodiments;
  • Fig. 23 is a schematic diagram of some embodiments of the two-in-one card shown in Fig. 17;
  • FIG. 24A is a schematic diagram of a connection circuit between the two-in-one card shown in FIG. 23 and an electronic device;
  • Fig. 24B is a schematic diagram of a partial circuit structure of an electronic device provided in an embodiment of the present application in some embodiments;
  • Fig. 25 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • FIG. 26A is a schematic diagram of a connection circuit between the two-in-one card shown in FIG. 25 and an electronic device;
  • Fig. 26B is a schematic diagram of a partial circuit structure of an electronic device provided in an embodiment of the present application in other embodiments;
  • Fig. 27 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • FIG. 28A is a schematic diagram of a connection circuit between the two-in-one card shown in FIG. 27 and an electronic device;
  • Fig. 28B is a schematic diagram of a partial circuit structure of an electronic device provided in an embodiment of the present application in other embodiments;
  • Fig. 29 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 30 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 29 and an electronic device;
  • Fig. 31 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 32 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 31 and an electronic device;
  • Fig. 33 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 34 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 33 and an electronic device;
  • Fig. 35 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 36 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 35 and an electronic device;
  • Fig. 37 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 38 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 37 and an electronic device;
  • Fig. 39 is a schematic diagram of another embodiment of the two-in-one card shown in Fig. 17;
  • Fig. 40 is a schematic diagram of a connection circuit between the two-in-one card shown in Fig. 39 and an electronic device;
  • Figure 41 to Figure 79 are various appearances of the information card provided by this application.
  • first and second are used for description purposes only, and cannot be understood as implying or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • orientation terms mentioned in the embodiments of the present application for example, "upper”, “lower”, “front”, “rear”, “left”, “right”, “inner”, “outer”, “side”, “Top”, “bottom” and so on are only referring to the directions of the accompanying drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and therefore should not be construed as limitations on the embodiments of the present application.
  • connection may be detachable connection or non-detachable connection; it may be direct connection or indirect connection through an intermediary.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application.
  • the electronic device 100 may be an electronic product such as a mobile phone, a tablet, or a smart wearable device.
  • the electronic device 100 is a mobile phone as an example for illustration.
  • the electronic device 100 may include a socket assembly 10 , a processor 20 , a casing 30 , a display screen 40 and a circuit board 50 .
  • the display screen 40 can be installed in the casing 30, and the display screen 40 is used for displaying images, videos and the like.
  • the circuit board 50 is installed inside the housing 30 , and the processor 20 can be fixed on the circuit board 50 and electrically connected to the circuit board 50 .
  • the card holder assembly 10 includes a card holder 1 and a card holder 2 .
  • the card holder 1 can be installed inside the housing 30 , and the card holder 1 can also be fixedly connected with the circuit board 50 and electrically connected with the circuit board 50 .
  • the processor 20 can be electrically connected to the deck 1 through the circuit board 50 .
  • the card tray 2 is detachably plugged into the card holder 1 .
  • the card tray 2 is used to install one or more information cards.
  • the card tray 2 can carry the information cards and insert them into the card holder 1, so that the information cards can be inserted into the card holder assembly 10, and the information cards communicate with the electronic device 100.
  • the information card may be a Nano SIM (subscriber identification module, subscriber identification module) card, a Nano memory card or a Nano two-in-one card.
  • Nano SIM card is also called 4FF card, such as ETSI TS 102 221 V11.0.0 specification, the size of the card body is 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.
  • the user can insert a Nano SIM card into the card holder assembly 10, and the Nano SIM card communicates with the processor 20, and the electronic device 100 interacts with the network through the Nano SIM card to realize functions such as calling and data communication.
  • Nano memory card can also be referred to as NM (nano memory, nano storage) card for short.
  • the user can also insert an NM card into the deck assembly 10, and the NM card communicates with the processor 20 to realize the data storage function. For example, files such as music and video can be saved in the NM card.
  • the Nano two-in-one card may include a SIM card circuit and a memory card circuit, the SIM card circuit is used to support functions such as calling and data communication, and the memory card circuit is used to support data storage functions.
  • the user can also insert a Nano 2-in-1 card into the deck assembly 10, and the Nano 2-in-1 card communicates with the processor 20 to realize functions such as calling, data communication and data storage.
  • the electronic device 100 may also include an internal memory, a universal serial bus (universal serial bus, USB) interface, a charging management module, a power management module, a battery, an antenna, a mobile communication module, a wireless communication module, an audio module, One or more of a speaker, a receiver, a microphone, an earphone jack, a sensor module, a button, a motor, an indicator, and a camera.
  • the electronic device 100 may have more or fewer components than the above solutions, may combine two or more components, or may have different component configurations.
  • the various components described above may be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and/or application specific integrated circuits.
  • the processor may include one or more processing units, for example: the processor may include an application processor (application processor, AP), a modem processor, a graphics processing unit (graphics processing unit, GPU), Image signal processor (image signal processor, ISP), controller, memory, video codec, digital signal processor (digital signal processor, DSP), baseband processor, neural network processor (neural-network processing unit, NPU ), etc., which are not strictly limited in the embodiments of the present application. Wherein, different processing units may be independent devices, or may be integrated in one or more processors. Wherein, the processor may also include one or more interfaces, and the processor may communicate with other components of the electronic device through one or more interfaces.
  • application processor application processor, AP
  • modem processor graphics processing unit
  • GPU graphics processing unit
  • ISP image signal processor
  • controller memory
  • video codec digital signal processor
  • DSP digital signal processor
  • NPU neural-network processing unit
  • different processing units may be independent devices, or may be integrated in one or more processors.
  • the processor
  • the processor 20 may include one or more processing units, for example: the processor 20 may include an application processor (application processor, AP), a modem processor, a graphics processing unit (graphics processing unit, GPU) ), image signal processor (image signal processor, ISP), controller, memory, video codec, digital signal processor (digital signal processor, DSP), baseband processor, neural network processor (neural-network processing unit , NPU), etc., which are not strictly limited in this embodiment of the present application. Wherein, different processing units may be independent devices, or may be integrated in one or more processors 20 . Wherein, the processor 20 may further include one or more interfaces, and the processor 20 may communicate with other components of the electronic device 100 through one or more interfaces.
  • application processor application processor
  • AP application processor
  • modem processor graphics processing unit
  • ISP image signal processor
  • controller memory
  • video codec digital signal processor
  • DSP digital signal processor
  • NPU neural-network processing unit
  • different processing units may be independent devices, or may be integrated in one or more processors
  • FIG. 2 is a schematic structural view of the deck assembly 10 shown in FIG. A schematic diagram showing the structure of Cato 2 at another angle.
  • the card socket 1 may include a socket body 12 , a first card connector 13 , a second card connector 14 , an ejection component 15 and an insertion detection spring 16 .
  • the base 12 is generally in the shape of a cover, and the base 12 includes a top plate 121 and a plurality of side plates 122 connected to the top plate 121 .
  • the top plate 121 and the multiple side plates 122 together define an inner space 123 of the base 12 .
  • the first card connector 13 is located in the inner space 123 of the base body 12 and is fixedly connected to the base body 12 .
  • the first card connector 13 is opposite to the top plate 121 .
  • the structure of the second card connector 14 may be the same as or different from that of the first card connector 13 .
  • the second card connector 14 is located in the inner space 123 of the seat body 12, the second card connector 14 is located on the side of the first card connector 13 facing away from the top plate 121, the second card connector 14 is opposite to the first card connector 13 Set, a gap is formed between the second card connector 14 and the first card connector 13 .
  • the first card connector 13 , the second card connector 14 and the side plate 122 of the base body 12 together define the card slot 17 of the card base 1 . Wherein, one end of the slot 17 is opened to form an opening, and the other end of the slot 17 forms the bottom of the slot 17 .
  • the ends of the plurality of side plates 122 away from the top plate 121 are fixed to the circuit board 50 of the electronic device 100 .
  • the solder pins of the first card connector 13 are fixedly connected and electrically connected to the circuit board 50 , so that the first card connector 13 can be electrically connected to the processor 20 of the electronic device 100 .
  • the second card connector 14 can be fixedly connected to the circuit board 50 so as to be fixedly connected to the socket body 12 through the circuit board 50 . Alternatively, the second card connector 14 can also be fixedly connected to the seat body 12 directly.
  • the solder pins of the second card connector 14 are fixedly connected and electrically connected to the circuit board 50 , so that the second card connector 14 can be electrically connected to the processor 20 of the electronic device 100 .
  • the card tray 2 may have a first installation groove 21 and a second installation groove 22 arranged opposite to each other. Both the first installation slot 21 and the second installation slot 22 are used for installing an information card.
  • the opening dimensions of the first installation slot 21 and the second installation slot 22 may be the same or similar, and the sizes of the card bodies of the two information cards installed in the first installation slot 21 and the second installation slot 22 are the same.
  • the opening size of the first installation groove 21 and the second installation groove 22 can also be different, and the sizes of the card bodies of the two information cards installed in the first installation groove 21 and the second installation groove 22 are different.
  • the slot size of the first installation groove 21 and the second installation groove 22 is adapted to the size of the card body of the corresponding information card, for example, the slot size of the first installation groove 21 and the second installation groove 22 can be slightly larger than the corresponding The size of the card body of the information card, but the size difference is not large, so that the information card can be smoothly loaded into the first installation groove 21 and the second installation groove 22, and the installation position is relatively stable.
  • the card tray 2 can be alone or carry an information card, and be inserted into the card slot 17 through the opening of the card slot 17 .
  • the direction in which the card tray 2 and/or the information card is inserted into the card slot 17 (that is, the card insertion direction) is the direction from the opening of the card slot 17 to the bottom of the card slot 17 .
  • the size of the draw-in groove 17 is adapted to the size of the draw-in groove 2, for example, the size of the draw-in groove 17 can be slightly larger than the size of the draw-in groove 2 but the two are not much different, there is a gap between the draw-in groove 2 and the wall of the draw-in groove 17 With a certain fit gap, the card holder 2 can be smoothly inserted into the card slot 17 and can be stably installed in the card slot 17 .
  • the information card carried by the card tray 2 is inserted into the card slot 17
  • the information card mounted on the card tray 2 is electrically connected to the first card connector 13 or the second card connector 14 to electrically connect to the electronic device 100 .
  • the ejection assembly 15 can be installed on the seat body 12 and/or the first card connector 13 .
  • the user can control the ejection component 15 so that the ejection component 15 pushes the card tray 2 out of the card slot 17 so that the user can remove the card tray 2 .
  • the insertion detection spring 16 may be installed on the first card connector 13 and electrically connected to the circuit board 50 .
  • the insertion detection spring 16 may be at least partially located at the bottom of the slot 17 .
  • the insertion detection elastic piece 16 can be used to detect whether the card tray 2 is inserted into the card slot 17 .
  • the card holder 1 may also be provided with a card connector, the card holder assembly 10 is used to install an information card, and the structure of the card holder 2 is adjusted adaptively.
  • the card holder 1 can also be provided with three or more card connectors, so that the card holder assembly 10 can be used to install more than three information cards, and the structure of the card holder 2 can be adjusted adaptively.
  • the embodiment of the present application does not strictly limit the number and position of the card connectors of the card socket 1, the specific structure of the card tray 2, and the like.
  • the cartridge 1 may also be provided with an ejection component 15 and/or an insertion detection elastic piece 16 that is different from the structure shown in the figure.
  • the socket assembly 10 may include more or less components than those in the above embodiments, which is not strictly limited in this embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a card connector 11 provided by an embodiment of the present application
  • FIG. 6 is a structural schematic diagram 1 of the card connector 11 shown in FIG. 5 at another angle.
  • the card connector 11 shown in FIG. 5 can be applied to the card holder 1 shown in FIG. 3 as the first card connector 13 and/or the second card connector 14 .
  • the embodiment of the present application provides a card connector 11, which can be applied to the card holder 1 of the electronic device 100, and the card connector 11 is used for connecting an information card.
  • the card connector 11 includes a plurality of elastic pieces, and when the card connector 11 is connected with an information card, the elastic pieces bear against the information card.
  • the card connector 11 includes ten elastic pieces arranged in an array, and the ten elastic pieces are spaced apart from each other.
  • the ten shrapnel can be roughly arranged in a 2 ⁇ 5 array structure. For example, ten shrapnels are arranged along the first direction into a first row of shrapnel to a fifth row of shrapnel, and arranged along a second direction into a first row of shrapnel and a second row of shrapnel.
  • the first row of elastic sheets includes the first elastic sheet 11a, the third elastic sheet 11c, the fifth elastic sheet 11e, the seventh elastic sheet 11g and the ninth elastic sheet 11i arranged along the first direction
  • the second row of elastic sheets includes the first elastic sheet arranged along the first direction.
  • the first elastic sheet 11a and the second elastic sheet 11b are located in the first row of elastic sheets
  • the third elastic sheet 11c and the fourth elastic sheet 11d are located in the second row of elastic sheets
  • the fifth elastic sheet 11e and the sixth elastic sheet 11f are located in the third row of elastic sheets
  • the seventh elastic sheet 11g and The eighth elastic sheet 11h is located in the fourth row of elastic sheets
  • the ninth elastic sheet 11i and the tenth elastic sheet 11j are located in the fifth row of elastic sheets.
  • the center points of the plurality of elastic sheets in the same row can be aligned in the first direction
  • the arrangements may also be not aligned but slightly staggered, which is not strictly limited in this embodiment of the present application.
  • the center points of the two elastic sheets in the same row that is, the center points of the part of the elastic sheets used to hold the information card
  • the arrangements may also be not aligned but slightly staggered, which is not strictly limited in this embodiment of the present application.
  • the card insertion direction of the information card inserted into the card holder assembly 10 card slot 17 is parallel to the second direction, that is, The insertion direction of the information card when it is connected to the card connector 11 is parallel to the second direction.
  • the information card first contacts the structure arranged on the front side of the card connector 11 , and then contacts the structure arranged on the rear side of the card connector 11 .
  • the front structure of the card connector 11 is close to the opening of the card slot 17
  • the rear structure of the card connector 11 is away from the opening of the card slot 17 .
  • the second row of elastic pieces of the card connector 11 may be located behind the first row of elastic pieces, and the second row of elastic pieces is farther away from the opening of the card slot 17 of the card socket assembly 10 than the first row of elastic pieces.
  • the second row of elastic pieces of the card connector 11 may also be closer to the opening of the card slot 17 of the card socket assembly 10 than the first row of elastic pieces, and this solution will not be repeated in this embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of the conductor 113 of the card connector 11 shown in FIG. 6 .
  • the card connector 11 includes an insulating body 112 and a conductor 113 .
  • the insulating body 112 may be roughly plate-shaped, and the insulating body 112 is also provided with a plurality of hollowed-out areas arranged at intervals.
  • the insulating body 112 may include six first hollowed out regions 1121 , a plurality of second hollowed out regions 1122 and a plurality of third hollowed out regions 1123 .
  • the six first hollowed out areas 1121 can be arranged in two rows and three rows, including the first row of first hollowed out areas 1121 and the second row of first hollowed out areas 1121 located behind the first row of first hollowed out areas 1121 .
  • the second hollowed out areas 1122 can be arranged in two rows, and the two rows of second hollowed out areas 1122 are respectively located at the rear side of the two rows of first hollowed out areas 1121 .
  • the third hollow areas 1123 may be arranged in a row and located behind the first hollow areas 1121 in the second row.
  • the conductor 113 is embedded in the insulating body 112 .
  • the conductor 113 may be formed by punching an integral metal plate.
  • the conductor 113 includes ten elastic pieces and ten fixing pieces 1131.
  • the ten elastic pieces may include the above-mentioned first elastic piece 11a to the tenth elastic piece 11j.
  • the ten fixing pieces 1131 are connected to the ten elastic pieces in one-to-one correspondence. All are conductive materials.
  • the conductor 113 includes ten conductive blocks, a corresponding fixing piece 1131 and an elastic piece are located on the same conductive block, and the ten conductive blocks are spaced apart from each other.
  • ten fixing parts 1131 are embedded in the insulating body 112 to be fixedly connected to the insulating body 112 , and the ten elastic pieces are respectively fixedly connected to the insulating body 112 through the ten fixing parts 1131 .
  • each elastic piece (for the sake of brevity in the drawings, one of the elastic pieces (such as 11j) is marked) includes a fixed end 111a, an abutting end 111b and a movable end 111c, and the fixed end 111a, the abutting end 111b and the movable end 111c are sequentially arranged along the extending direction of the elastic pieces, and the extending direction of the elastic pieces is perpendicular to the first direction, that is, parallel to the second direction.
  • the fixed end 111 a is connected to the fixing member 1131 , and the fixed end 111 a is fixed to the insulating body 112 through the fixing member 1131 .
  • the abutting end 111b protrudes from one side surface of the insulating body 112 to elastically hold the information card when the card connector 11 is connected to the information card.
  • the movable end 111c is movably mounted on the insulating body 112 , and the movable end 111c can move relative to the insulating body 112 in a second direction.
  • the abutment end 111b abuts the information card, and the abutment end 111b moves toward the direction close to the insulating body 112, and the movable end 111c is displaced relative to the insulating body 112, and the shrapnel moves smoothly.
  • Deformation occurs, and the elastic force of the elastic piece against the information card is moderate, so that the information card can be smoothly connected to the card connector 11, and the risk of damage to the information card due to excessive elastic force of the elastic piece can be reduced, and the reliability is improved.
  • the shrapnel also includes a first connecting section 111d and a second connecting section 111e, the first connecting section 111d connects the fixed end 111a and the abutting end 111b, the second connecting section 111e connects the abutting end 111b and the movable end 111c, and the abutting end 111b protrudes relative to the first connecting section 111d and the second connecting section 111e.
  • the abutting end 111b is at the highest point, followed by the first connecting section 111d and the second connecting section 111e, and the fixed end 111a and The movable end 111c is located at the lowest position.
  • the elastic piece is held by the abutting end 111b and electrically connected to the information card.
  • the first connecting section 111d, the fixed end 111a, the second connecting section 111e and the movable end 111c do not contact the information card and are connected to the information card. A gap is formed.
  • the abutment end 111b may include a protruding abutment contact point 111f, and the abutment contact point 111f has a certain contact area.
  • the third elastic piece 11c to the eighth elastic piece 11h may be respectively located in six first hollow areas 1121, the first elastic piece 11a may be located in the same first hollow area 1121 as the third elastic piece 11c, and the second elastic piece 11b may be The fourth elastic piece 11d is located in the same first hollow area 1121, the seventh elastic piece 11g can be located in the same first hollow area 1121 as the ninth elastic piece 11i, and the eighth elastic piece 11h can be located in the same first hollow area 1121 as the tenth elastic piece 11j. In the hollow area 1121 .
  • Each fixing piece 1131 surrounds or partially surrounds the corresponding elastic piece.
  • the elastic piece located in a first hollow area 1121 is completely surrounded by the corresponding fixing piece 1131 .
  • the fifth elastic piece 11e is independently located in one of the first hollow areas 1121 , and the fixing member 1131 connecting the fifth elastic piece 11e completely surrounds the fifth elastic piece 11e.
  • the sixth elastic piece 11f is independently located in one of the first hollow areas 1121 , and the fixing piece 1131 connecting the sixth elastic piece 11f completely surrounds the sixth elastic piece 11f.
  • the corresponding two fixing pieces 1131 tend to enclose the two elastic pieces together, and half surround the corresponding elastic pieces respectively.
  • the first elastic piece 11a and the third elastic piece 11c are located in the same first hollow area 1121, and the fixing piece 1131 connecting the first elastic piece 11a and the fixing piece 1131 connecting the third elastic piece 11c surround the first elastic piece 11a and the third elastic piece 11c together.
  • the fixing piece 1131 connected to the first elastic piece 11a half surrounds the first elastic piece 11a
  • the fixing piece 1131 connected to the third elastic piece 11c half surrounds the third elastic piece 11c.
  • the seventh elastic piece 11g and the ninth elastic piece 11i are located in the same first hollow area 1121, the fixing piece 1131 connecting the seventh elastic piece 11g and the fixing piece 1131 connecting the ninth elastic piece 11i surround the seventh elastic piece 11g and the ninth elastic piece 11i together
  • the fixing piece 1131 connected to the seventh elastic piece 11g half surrounds the seventh elastic piece 11g
  • the fixing piece 1131 connected to the ninth elastic piece 11i half surrounds the ninth elastic piece 11i.
  • the relationship between the second elastic piece 11b and the fourth elastic piece 11d and its corresponding fixing member 1131 , and the relationship between the eighth elastic piece 11h and the tenth elastic piece 11j and its corresponding fixing member 1131 refer to the above description, which will not be repeated here.
  • FIG. 8 is a schematic diagram of the internal structure of the structure at A of the card connector 11 shown in FIG. 6 .
  • FIG. 8 schematically shows the connection structure between the movable end 111c of the elastic piece and the insulating body 112 .
  • the tenth elastic piece 11j is taken as an example for labeling.
  • the insulating body 112 further includes a communication hole 1124 , and the communication hole 1124 communicates with the adjacent first hollow area 1121 and the second hollow area 1122 .
  • the movable end 111c of the elastic piece is plugged into the communication hole 1124 , and the end of the movable end 111c includes a stop block 1111 , and the stop block 1111 cooperates with the insulating body 112 to form an anti-loosening structure.
  • the anti-detachment structure can effectively prevent the movable end 111 c of the elastic piece from detaching from the insulating body 112 , which improves the connection reliability between the elastic piece and the insulating body 112 , making the card connector 11 highly reliable.
  • the fixed end 111a and the abutting end 111b of the elastic piece are located in the first hollow area 1121, the movable end 111c of the elastic piece is inserted into the communication hole 1124, and extends to the second hollow area 1122 through the communication hole 1124, and the stop block 1111 is at least partially Located in the second hollow area 1122 .
  • the width of the communication hole 1124 in the locking direction is smaller than the width of the stop block 1111 in the locking direction
  • the locking direction can be any direction
  • the size of the communication hole 1124 in a certain direction is smaller than that of the stop block 1111.
  • the size in the same direction can make the stop block 1111 cooperate with the insulating body 112 to form an anti-off structure, so as to prevent the stop block 1111 from passing through the communication hole 1124 and cause the movable end 111c of the elastic piece to detach from the insulating body 112 .
  • the width of the stop block 1111 is greater than the width of the communication hole 1124 . It can be understood that, the embodiment of the present application does not strictly limit the shape and size of the communication hole 1124 and the shape and size of the stop block 1111 .
  • each conductive block of the conductor 113 also includes a welding leg 1132 (for the sake of brevity, part of the welding leg 1132 is marked in the drawings), and the welding leg 1132 is fixedly connected to the fixing member 1131.
  • the solder feet 1132 are used for soldering to the circuit board 50 (refer to FIG. 1 ), so that the card connector 11 is fixedly connected to the circuit board 50 , and the elastic piece is electrically connected to the circuit board 50 .
  • the number of welding feet 1132 in each conductive block is at least one.
  • At least one soldering leg 1132 of each conductive block includes a first soldering leg 1133, and the first soldering leg 1133 is disposed close to the fixed end 111a of the elastic piece. That is, the first welding leg 1133 is connected to the end of the fixing member 1131 close to the fixing end 111 a of the elastic piece.
  • a frictional force is generated between the information card and the abutting end 111b of the elastic piece, which makes the elastic piece have a tendency to move along the card insertion direction (that is, the second direction), and the fixed end 111a of the elastic piece under tension.
  • the conductive block is provided with the first soldering leg 1133 close to the fixed end 111a of the shrapnel, and the first soldering leg 1133 welds the circuit board 50, so that the force on the shrapnel is transmitted to the circuit board 50 by the first soldering leg 1133, and the fixing member of the conductive block 1131 is not easily deformed, and the connection relationship between the fixing member 1131 and the insulating body 112 is stable, which is beneficial to improving the reliability of the card connector 11 and the card socket assembly 10 . It can be understood that, during the process of pulling out the information card, the first welding leg 1133 can also transmit stress.
  • At least one soldering leg 1132 of a part of the conductive block may further include a second soldering leg 1134, and the second soldering leg 1134 is disposed close to the movable end 111c of the elastic piece. That is, the second welding leg 1134 is connected to the end of the fixing member 1131 close to the movable end 111c of the elastic piece.
  • the movable end 111c generates a pulling force on the insulating body 112 through the anti-off structure, and the conductive block is provided with the second welding leg 1134 close to the movable end 111c of the shrapnel, and the second welding leg 1134 welds the circuit board 50, so that the force on the insulating body 112 is determined by
  • the second welding leg 1134 is transmitted to the circuit board 50 , the fixing part 1131 of the conductive block is not easily deformed, and the connection relationship between the fixing part 1131 and the insulating body 112 is stable, which is beneficial to improving the reliability of the card connector 11 and the card socket assembly 10 .
  • the first welding leg 1133 can also transmit stress.
  • both the first welding leg 1133 and the second welding leg 1134 can transmit stress.
  • solder feet 1132 on the conductive block may also be connected to other positions of the fixing member 1131 , for example connecting to the middle of the fixing member 1131 , which is not strictly limited in this embodiment of the present application.
  • part of the plurality of solder legs 1132 of the conductor 113 may be located in the first hollow area 1121 , and part of the solder pins 1132 may be located in the third hollow area 1123 , and the arrangement positions may refer to FIG. 6 .
  • the plurality of welding feet 1132 of the conductor 113 may also have other arrangements.
  • the third hollow area 1123 is set, which is not strictly limited in this embodiment of the present application.
  • FIG. 9 is a second structural diagram of the card connector 11 shown in FIG. 5 at another angle.
  • the distance S2 between the centers of the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f) is larger than the center of the first row of shrapnel (11a, 11b) and the second row of shrapnel (11c, 11d)
  • the distance S1 is greater than the distance S4 between the centers of the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j).
  • the center distance S3 between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) is greater than the center distance S1 between the first row of shrapnel (11a, 11b) and the second row of shrapnel (11c, 11d), and greater than The center distance S4 between the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j).
  • the center distance S2 between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f), the center distance S3 between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) Larger, the center distance S1 between the first row of shrapnel (11a, 11b) and the second row of shrapnel (11c, 11d), the center distance S4 of the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j) smaller.
  • the center distance between the two rows of shrapnels is the center distance between the two shrapnels in the same row;
  • the spacing in the first direction between the center points of the part for example, the contact point 111f.
  • the center distance between the two rows of shrapnel is the average of the center distance between the two shrapnels of the first row of shrapnel and the center distance of the two shrapnels of the second row of shrapnel value.
  • the center distance between the third elastic piece 11c and the fifth elastic piece 11e is greater than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11i;
  • the center distance of the seventh elastic piece 11g is greater than the center distance between the first elastic piece 11a and the third elastic piece 11c and the center distance between the seventh elastic piece 11g and the ninth elastic piece 11i;
  • the center distance between the fourth elastic piece 11d and the sixth elastic piece 11f is larger than that of the second elastic piece
  • the center distance between the sixth elastic piece 11f and the eighth elastic piece 11h is greater than the center distance between the second elastic piece 11b and the fourth elastic piece 11d and the The distance between the centers of the eighth shrapnel 11h and the tenth shrapnel 11j.
  • the center-to-center distance S2 between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f) may be in the range of 1.0mm to 3.0mm, for example, may be in the range of 1.5mm to 2.8mm, For example, it can be 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and/or, the center distance S3 between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) can be 1.0mm to 3.0mm range, such as 1.5mm to 2.8mm, such as 2.48mm, 2.54mm, 2.59mm, 2.63mm, etc.; and/or, the first row of shrapnel (11a, 11b) and the second row of shrapnel (11c, 11d) center spacing S1 can be in the range of 1.0mm to 1.7mm, such as 1.03mm, 1.07mm, 1.12mm, etc
  • the center distance S2 between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f) and the center distance S3 between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) can be Equal or unequal, which is not strictly limited in this embodiment of the present application.
  • the distance between the centers of the corresponding two groups of elastic sheets in two adjacent rows of elastic sheets may be equal or unequal, which is not strictly limited in this embodiment of the present application.
  • the center distance between the first shrapnel 11a and the third shrapnel 11c, and the center distance between the second shrapnel 11b and the fourth shrapnel 11d May or may not be equal.
  • multiple elastic sheets can form various combinations.
  • the number and position are matched, so that the card connector 11 can communicate with different types of information cards, realize multi-card compatibility, and have good expandability. Therefore, when the card connector 11 is applied to the card socket assembly 10 of the electronic device 100, the electronic device 100 can be adapted to various types of information cards through the same card socket assembly 10, thereby reducing the number of card socket assemblies 10 and reducing the This reduces the occupation of the internal space of the electronic device 100 , which is conducive to thinning the electronic device 100 .
  • the card connector 11 can communicate with a Nano SIM card with six gold fingers (also referred to as terminals, ports, metal contacts, etc.), or with a two-in-one card with at least ten gold fingers. Letter, compatible with Nano SIM card and 2-in-1 card.
  • the size of the card body of the two-in-one card is the same as that of the Nano SIM card.
  • the card bodies of the two information cards have the same size, which may mean that the card bodies of the two information cards have the same size, or the card bodies of the two information cards are very similar in size and can be placed stably In the same installation groove of the card holder 2 of the card holder assembly 10 .
  • the card connector 11 can communicate with a Nano SIM card with six gold fingers, or with a two-in-one card with at least ten gold fingers, or with a first SIM card with eight gold fingers.
  • NM card communication compatible with Nano SIM card, 2-in-1 card and the first NM card.
  • the card connector 11 can communicate with a Nano SIM card with six gold fingers, or with a two-in-one card with at least ten gold fingers, or with a SIM card with ten gold fingers or eight gold fingers.
  • Golden finger or second NM card communication with other number of gold fingers, compatible with Nano SIM card, 2-in-1 card and second NM card.
  • the size of the card body of the second NM card is the same as that of the Nano SIM card.
  • the first NM card is a first-generation NM card
  • the second NM card is a second-generation NM card
  • the transmission rate of the second NM card is greater than that of the first NM card.
  • the size of the card body of the first NM card can be identical with the size of the card body of the Nano SIM card.
  • the card connector 11 may also be compatible with the first NM card and/or the second NM card when being compatible with the Nano SIM card and the 2-in-1 card, which is not strictly limited in this embodiment of the present application.
  • the present application provides a Nano SIM card, which can be adapted to the above-mentioned card connector 11.
  • the structure of the Nano SIM card and the connection structure between the Nano SIM card and the card connector 11 are described below with examples.
  • Figure 10 is a schematic block diagram of a Nano SIM card 3 provided by the embodiment of the present application
  • Figure 11 is a schematic structural diagram of the Nano SIM card 3 shown in Figure 10 in some embodiments
  • Figure 12 It is a structural schematic diagram when the Nano SIM card 3 shown in FIG. 11 is connected to the card connector 11 shown in FIG. 5 .
  • the Nano SIM card 3 may include a card body 31 and a card interface 32.
  • the card body 31 includes a package 311 and a control circuit 312 and a SIM circuit 313 disposed in the package 311 .
  • the card interface 32 is fixed on the card body 31 and exposed relative to the card body 31 .
  • the card interface 32 is electrically connected to the control circuit 312 .
  • the package 311 is used to package the control circuit 312, the SIM circuit 313 and the electrical connection lines between the control circuit 312, the SIM circuit 313 and the card interface 32 for protection.
  • the package 311 is made of a dielectric material, and the dielectric material includes but not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (polyvinyl butyral, PVB), ionomer, polyolefin (polyolefins, PO), silicon, thermoplastic polyurethane and other materials.
  • EVA ethylene-vinyl acetate
  • PVB polyvinyl butyral
  • ionomer polyolefin (polyolefins, PO), silicon, thermoplastic polyurethane and other materials.
  • the Nano SIM card 3 has length direction, width direction and thickness direction perpendicular to each other, the maximum dimension of the card body 31 of the Nano SIM card 3 in the length direction is its length, and the maximum dimension in the width direction is its width, The largest dimension in the thickness direction is its thickness.
  • the size of the card body 31 of the Nano SIM card 3 is 12.30mm in length, 8.80mm in width, and 0.67mm in thickness.
  • the size of the card body of the information card is the size of the outer contour of the package of the card body.
  • the card interface 32 of the Nano SIM card 3 in Fig. 11 is set up;
  • the card interface 32 of the SIM card 3 is arranged downwards, and the card connector 11 is positioned at the Nano SIM card 3 below.
  • the card body 31 of the Nano SIM card 3 includes a first side 3111, a second side 3112, a third side 3113 and a fourth side 3114, and the first side 3111 and the third side 3113 are arranged opposite and along the Nano SIM card 3 extends in the length direction, and the second side 3112 and the fourth side 3114 are oppositely arranged and extend along the width direction of the Nano SIM card 3.
  • the distance between the second side 3112 and the fourth side 3114 is greater than the distance between the first side 3111 and the third side 3113 .
  • the first side 3111 and the third side 3113 are long sides
  • the second side 3112 and the fourth side 3114 are short sides.
  • the first side 3111 and the third side 3113 may be arranged parallel or approximately parallel
  • the second side 3112 and the fourth side 3114 may be arranged parallel or approximately parallel.
  • one corner of the card body 31 of the Nano SIM card 3 is a cut corner, and the cut corner is arranged between the first side 3111 and the second side 3112.
  • the cut corner forms a cut edge 3115
  • the cut edge 3115 forms an obtuse angle with the first side 3111 and forms an obtuse angle with the second side 3112 .
  • a circular arc transition structure or an inverted Corner transition structure between the adjacent sides of the card body 31 of the Nano SIM card 3 (including the first side 3111, the second side 3112, the third side 3113, the fourth side 3114 and the cut side 3115), a circular arc transition structure or an inverted Corner transition structure.
  • the card body 31 of the Nano SIM card 3 may not be provided with the above-mentioned cut corners, which is not strictly limited in the present application.
  • the card interface 32 of the Nano SIM card 3 includes at least six gold fingers, for example, including a first gold finger 321, a second gold finger 322, a third gold finger 323, a fourth gold finger 324, a Hardware finger 325 and sixth gold finger 326 .
  • the first gold finger 321 is closer to the cut edge 3115 of the card body 31 of the Nano SIM card 3 than other gold fingers.
  • the Nano SIM card 3 When the card tray 2 is equipped with a Nano SIM card 3, the Nano SIM card 3 is inserted into the card holder assembly 10, and the Nano SIM card 3 is connected to the card connector 11, ten shrapnels of the card connector 11 are all against the Nano SIM card 3, wherein, The third elastic piece 11c to the eighth elastic piece 11h (that is, the second row of elastic pieces to the fourth row of elastic pieces) of the card connector 11 resist and electrically connect the first gold finger 321 to the sixth gold finger 321 of the Nano SIM card 3 in one-to-one correspondence. Finger 326 is electrically connected to the Nano SIM card 3.
  • the elastic piece of the card connector 11 abuts against the golden finger of the information card, the two can realize electrical connection.
  • the card connector 11 arranges the third elastic piece 11c to the eighth elastic piece 11h in two rows and three rows, and the third elastic piece 11c to the eighth elastic piece 11h can be against the first Nano SIM card 3 in one-to-one correspondence.
  • One gold finger 321 to the sixth gold finger 326, the card connector 11 can be electrically connected with the Nano SIM card 3 to realize communication.
  • the distance between the centers of the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f) and the distance between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11f) 11h) the center distance is set in the range of 1.5mm to 2.8mm, so that the electronic device 100 can communicate with the first golden finger 321 to the sixth golden finger 326 of the Nano SIM card 3 through the third elastic piece 11c to the eighth elastic piece 11h, And it can effectively reduce the risk of a short circuit between the gold fingers of the Nano SIM card 3, so that the electrical connection between the card connector 11 and the Nano SIM card 3 is reliable.
  • Nano SIM cards 3 of different countries/different operators may be different, resulting in different arrangements of gold fingers.
  • the Nano SIM card 3 shown in Figure 11 is one of the golden finger arrangements defined for compliance with the specification.
  • the card connector 11 and the card holder assembly 10 are compatible with Nano SIM cards 3 of various countries/different operators.
  • the first row of shrapnel (11a, 11b) and the fifth row of shrapnel (11i, 11j) of the card connector 11 bear against the Nano SIM card 3.
  • the first elastic piece 11a and the third elastic piece 11c can resist and electrically connect the first golden finger of the Nano SIM card 3 321
  • the second elastic piece 11b and the fourth elastic piece 11d can resist and be electrically connected to the second golden finger 322 of the Nano SIM card 3
  • the seventh elastic piece 11g and the ninth elastic piece 11i can resist and be electrically connected to the fifth golden finger of the Nano SIM card 3
  • the finger 325, the eighth elastic piece 11h and the tenth elastic piece 11j can resist and be electrically connected to the sixth gold finger 326 of the Nano SIM card 3.
  • the two shrapnel against the same gold finger can pass through the gold finger.
  • a plurality of golden fingers of the card interface 32 of the Nano SIM card 3 may also have an arrangement structure different from that of FIG.
  • One row of shrapnel (11a, 11b) and the fifth row of shrapnel (11i, 11j) bear against the card body 31 of the Nano SIM card 3; or, the first shrapnel 11a and the third shrapnel 11c of the card connector 11 can resist and electrically Connect the first gold finger 321 of the Nano SIM card 3, the second elastic piece 11b and the fourth elastic piece 11d can resist and electrically connect the second golden finger 322 of the Nano SIM card 3, the fifth row of elastic pieces (11i, 11j) resist the card body 31 of the Nano SIM card 3; or, the seventh elastic piece 11g and the ninth elastic piece 11i can resist and electrically connect the fifth golden finger 325 of the Nano SIM card 3, and the eighth elastic piece 11h and the tenth elastic piece 11j can The sixth golden finger 326 of the Nano SIM card 3 is resisted and electrically connected, and the first
  • the first row of elastic sheets (11a, 11b) and/or the fifth row of elastic sheets (11i, 11j) of the card connector 11 are against the card body 31 of the Nano SIM card 3
  • the first row of elastic sheets (11a, 11b) And/or the fifth row of shrapnel (11i, 11j) is not in contact with the gold fingers of the Nano SIM card 3, and there is no electrical connection between them.
  • the embodiment of the present application does not strictly limit the specific connection structure of the first row of elastic sheets (11a, 11b) and the fifth row of elastic sheets (11i, 11j) of the card connector 11 and the Nano SIM card 3.
  • the six golden fingers of the Nano SIM card 3 can be used to transmit data signal (DATA), clock signal (clock, CLK), programming voltage/input signal (programming voltage/input signal, VPP), reset signal ( reset signal, RST), ground signal (GND) and power signal (VCC).
  • data signal also known as the I/O signal
  • programming voltage/input signal programming voltage/input signal, VPP
  • NFC near field communication
  • Table 1 is a correspondence table between multiple shrapnels of the card connector 11 and multiple gold fingers of the Nano SIM card 3 and their transmission signals.
  • the third elastic piece 11c of the card connector 11 is electrically connected to the first golden finger 321 of the Nano SIM card 3, and the first golden finger 321 is used to transmit data signals (DATA);
  • the fourth elastic piece 11d is electrically connected to the Nano SIM card 3
  • the second gold finger 322, the second gold finger 322 is used to transmit the clock signal (CLK);
  • the fifth shrapnel 11e is electrically connected to the third gold finger 323 of the Nano SIM card 3, and the third gold finger 323 is used for programming voltage/input signal (VPP);
  • the sixth shrapnel 11f is electrically connected to the fourth golden finger 324 of the Nano SIM card 3, and the fourth golden finger 324 is used to transmit a reset signal (RST);
  • the seventh shrapnel 11g is electrically connected to the fifth golden finger 325 of the Nano SIM card 3 , the fifth gold finger 325 is
  • the six golden fingers of the Nano SIM card 3 may also have other correspondences with the above six signals, and the six golden fingers of the Nano SIM card 3 may also be used to transmit other combined signals, such as the Nano SIM card 3.
  • the programming voltage/input signal (VPP) may not be transmitted, and the third gold finger 323 is set in the air.
  • the fifth spring piece 11e corresponding to the third gold finger 323 may not provide the programming voltage/input signal (VPP).
  • VPP programming voltage/input signal
  • the gold finger is suspended, that is, the gold finger is not used to transmit signals, and is not used to provide a signal port for the information card.
  • the present application provides a first NM card, which can be adapted to the above-mentioned card connector 11 , and the structure of the first NM card and the connection structure between the first NM card and the card connector 11 are illustrated below.
  • Figure 13 is a schematic block diagram of a first NM card 4 provided by an embodiment of the present application
  • Figure 14 is a schematic block diagram of the first NM card 4 shown in Figure 13 in some embodiments Structural schematic diagram
  • FIG. 15 is a structural schematic diagram when the first NM card 4 shown in FIG. 14 is connected to the card connector 11 shown in FIG. 5 .
  • the first NM card 4 includes a card body 41 and a card interface 42 .
  • the card body 41 includes a package 411 and a control circuit 412 and a storage circuit 413 disposed in the package 411 .
  • the card interface 42 is fixed on the card body 41 and exposed relative to the card body 41 .
  • the card interface 42 is electrically connected to the control circuit 412 .
  • the package 411 is used to package the control circuit 412 , the storage circuit 413 , and the electrical connection lines between the control circuit 412 and the storage circuit 413 and the card interface 42 for protection.
  • the package 411 is made of a dielectric material, and the dielectric material includes but not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (polyvinyl butyral, PVB), ionomer, polyolefins (polyolefins, PO), silicon, thermoplastic polyurethane and other materials.
  • EVA ethylene-vinyl acetate
  • PVB polyvinyl butyral
  • ionomer polyolefins
  • PO polyolefins
  • silicon thermoplastic polyurethane and other materials.
  • the size of the card body 41 of the first NM card 4 can be identical with the size of the card body 31 of the Nano SIM card 3.
  • the first NM card 4 has two vertical length directions, width directions and thickness directions, the maximum dimension of the card body 41 of the first NM card 4 in the length direction is its length, and the maximum dimension in the width direction is its width.
  • the largest dimension in the thickness direction is its thickness.
  • the dimensions of the card body 41 of the first NM card 4 may be 12.30 mm in length, 8.80 mm in width, and 0.67 mm in thickness.
  • the card interface 42 of the first NM card 4 in Fig. 14 is set up; the angle of view of the first NM card 4 in Fig. 15 is flipped up and down relative to the angle of view of the first NM card 4 in Fig. 14, Fig. 15
  • the card interface 42 of the first NM card 4 is set downward, and the card connector 11 is located below the first NM card 4 .
  • the card body 41 of the first NM card 4 includes a first side 4111, a second side 4112, a third side 4113 and a fourth side 4114, the first side 4111 and the third side 4113 are arranged opposite and along the first
  • the NM card 4 extends along the length direction, and the second side 4112 and the fourth side 4114 are oppositely arranged and extend along the width direction of the first NM card 4 .
  • the distance between the second side 4112 and the fourth side 4114 is greater than the distance between the first side 4111 and the third side 4113 .
  • the first side 4111 and the third side 4113 are long sides, and the second side 4112 and the fourth side 4114 are short sides.
  • the first side 4111 and the third side 4113 may be arranged parallel or approximately parallel
  • the second side 4112 and the fourth side 4114 may be arranged parallel or approximately parallel.
  • one corner of the card body 41 of the first NM card 4 is a cut corner, and the cut corner is arranged between the first side 4111 and the second side 4112 .
  • the cut corner forms a cut edge 4115 , which forms an obtuse angle with the first side 4111 and forms an obtuse angle with the second side 4112 .
  • a circular arc transition structure or Chamfer transition structure between the adjacent sides (including the first side 4111, the second side 4112, the third side 4113, the fourth side 4114 and the cut side 4115) of the card body 41 of the first NM card 4, a circular arc transition structure or Chamfer transition structure.
  • the card body 41 of the first NM card 4 may not be provided with the aforementioned cut corners, which is not strictly limited in this application.
  • the size of the cut corner of the card body 41 of the first NM card 4 can be the same as or different from the size of the cut corner of the card body 31 of the Nano SIM card 3. When the two are different, it is also considered that the card body of the first NM card 4 The size of 41 is identical with the size of the card body 31 of Nano SIM card 3.
  • the card interface 42 of the first NM card 4 includes at least eight gold fingers, for example, may include a first gold finger 421, a second gold finger 422, a third gold finger 423, and a fourth gold finger 424 arranged in an array , the fifth golden finger 425 , the sixth golden finger 426 , the seventh golden finger 427 and the eighth golden finger 428 .
  • the first gold finger 421 is closer to the cut edge 4115 of the card body 41 than the other gold fingers.
  • the first NM card 4 When the first NM card 4 is installed on the card tray 2, the first NM card 4 is inserted into the card holder assembly 10, and the first NM card 4 is connected to the card connector 11, the ten shrapnels of the card connector 11 are all against the first NM card 4.
  • the third elastic piece 11c to the tenth elastic piece 11j that is, the second row of elastic pieces to the fourth row of elastic pieces) of the card connector 11 abut against the first gold finger 421 to the first gold finger 421 of the first NM card 4 in one-to-one correspondence.
  • Eight gold fingers 428 are electrically connected to the first NM card 4 .
  • the card connector 11 arranges the third elastic piece 11c to the tenth elastic piece 11j in four rows and two rows, and the center distance between the fourth row of elastic pieces (11g, 11h) and the fifth row of elastic pieces (11i, 11j) , less than the center distance between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f) and the center distance between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h), so that the card
  • the third elastic piece 11c to the eighth elastic piece 11h of the connector 11 can be electrically connected with the six golden fingers of the Nano SIM card 3 one by one, and the third elastic piece 11c to the tenth elastic piece 11j can also be connected to the first NM card 4 at the same time.
  • the eight golden fingers are electrically connected in one-to-one correspondence, so the card connector 11 can be compatible with the Nano SIM card 3 and the first NM card 4.
  • the spacing distance is also different, by adjusting the center distance between the second row of shrapnel (11c, 11d) and the third row of shrapnel (11e, 11f), and the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h)
  • the distance between the centers of the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j) is set within the range of 1.0mm to 1.7mm, so that the third The shrapnel 11c to the eighth shrapnel 11h can communicate with the six gold fingers of the Nano SIM card 3 respectively, and the third shrapnel 11c to the tenth sh
  • the seventh gold finger 427 and the eighth gold finger 428 of the first NM card 4 are in an "L" shape
  • the elastic piece of the card connector 11 contacts the information card through its abutting contact
  • a gap is formed between the rest of the shrapnel and the gold finger, so the ninth shrapnel 11i is electrically connected to the seventh gold finger 427, and there is no contact and no electrical connection between the seventh shrapnel 11g and the seventh gold finger 427
  • the tenth elastic piece 11j is electrically connected to the eighth gold finger 428 , and the eighth elastic piece 11h and the eighth gold finger 428 are not in contact and have no electrical connection.
  • the first row of elastic pieces ( 11 a , 11 b ) of the card connector 11 bears against the first NM card 4 .
  • the first elastic piece 11a and the third elastic piece 11c are resisted and electrically connected to the first golden finger 421 of the first NM card 4, and the second elastic piece 11b and the fourth elastic piece 11d are opposed to and electrically connected to the first NM card 4 the second golden finger 422; in some other embodiments, the first row of elastic pieces (11a, 11b) abuts against the card body 41 of the first NM card 4, at this time, the first row of elastic pieces (11a, 11b) and the first There is no electrical connection between the NM cards 4 .
  • the embodiment of the present application does not strictly limit the specific connection structure between the first row of elastic sheets (11a, 11b) of the card connector 11 and the first NM card 4 .
  • the first NM card 4 may adopt an embedded multimedia memory card (embedded multi media card, EMMC) interface protocol.
  • EMMC embedded multimedia memory card
  • the eight gold fingers of the first NM card 4 four gold fingers can be used to transmit data signals (DATA0, DATA1, DATA2, DATA3), one gold finger is used to transmit a clock signal (CLK), and one gold finger is used to transmit
  • CMD command and response signal
  • one gold finger is used to transmit the ground signal (GND)
  • VCC power signal
  • data signals (DATA0, DATA1, DATA2, DATA3) are used to realize data transmission communication.
  • the command and response signal (CMD) can send a command from the external device to the memory card, or allow the memory card to respond to the command of the external device.
  • Table 2 is a table of correspondence between multiple shrapnels of the card connector 11, multiple gold fingers of the Nano SIM card 3 and the first NM card 4, and their transmission signals.
  • the third elastic piece 11c to the tenth elastic piece 11j of the card connector 11 resist and electrically connect the first gold finger 421 to the eighth golden finger 421 of the first NM card 4 in one-to-one correspondence.
  • Goldfinger 428 In this application, if the two gold fingers on the two information cards are abutted against and electrically connected to the same elastic piece when they are connected to the card connector 11 of the electronic device 100 , it is considered that the positions of the two gold fingers correspond.
  • the positions of the first gold finger 421 to the sixth gold finger 426 of the first NM card 4 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the shape and size of the two golden fingers and their specific positions on the card body of the information card may be the same or different, which is not strictly limited in this embodiment of the present application .
  • the first gold finger 421, the fourth gold finger 424, the seventh gold finger 427 and the eighth gold finger 428 of the first NM card 4 can be used to transmit data signals; for example, the first gold finger 421 is used to transmit The data signal (DATA1), the fourth gold finger 424 is used to transmit the data signal (DATA0), the seventh gold finger 427 is used to transmit the data signal (DATA3), the eighth gold finger 428 is used to transmit the data signal (DATA2), the first The signals transmitted in the gold finger 421 , the fourth gold finger 424 , the seventh gold finger 427 and the eighth gold finger 428 may be interchanged in some other embodiments, which will not be repeated here.
  • the second gold finger 422 of the first NM card 4 is used to transmit the clock signal (CLK)
  • the third gold finger 423 is used to transmit the command and response signal (CMD)
  • the fifth gold finger 425 is used to transmit the ground signal (GND)
  • the third gold finger 423 is used to transmit the ground signal (GND).
  • the six gold fingers 426 are used to transmit the power signal (VCC).
  • the eight golden fingers of the first NM card 4 may also have other correspondences with the above-mentioned eight-way signals, and the eight golden fingers of the first NM card 4 may also be used to transmit signals of other combinations.
  • the embodiment does not strictly limit it.
  • the first gold finger 421, the fourth gold finger 424, and the eighth gold finger 428 of the first NM card 4 can all be electrically connected to a high voltage circuit or a protection switch, so as to prevent the third elastic piece 11c to the fifth elastic piece 11e from And the circuit that burns out the first NM card 4 when the eighth shrapnel 11h provides high voltage.
  • the high voltage withstand circuit or the protection switch are located in the package 411 of the first NM card 4 . In some other embodiments, it may also be implemented by providing a high-impedance protection circuit in the electronic device, for example, adding a protection circuit in the interface controller.
  • the application also provides a two-in-one card, the two-in-one card integrates a SIM card circuit and a memory card circuit, and the SIM card circuit and the memory card circuit realize communication with external devices such as electronic equipment through ten gold fingers, so as to achieve compatibility Call, data communication and data storage and other functions.
  • Figure 16 is a schematic block diagram of a two-in-one card 7 provided by an embodiment of the present application
  • Figure 17 is a schematic diagram of the two-in-one card 7 shown in Figure 16 in some embodiments Structural schematic diagram
  • FIG. 18 is a structural schematic diagram when the two-in-one card 7 shown in FIG. 17 is connected to the card connector shown in FIG. 5 .
  • the two-in-one card 7 includes a card body 71 and a card interface 72 .
  • the card body 71 includes a package 711 and a memory card circuit 712 and a SIM card circuit 713 disposed in the package 711 .
  • the card interface 72 is fixed on the card body 71 and exposed relative to the card body 71 .
  • the card interface 72 is electrically connected to the memory card circuit 712 and the SIM card circuit 713 .
  • the package 711 is used to package the memory card circuit 712, the SIM card circuit 713, and the electrical connection lines between the memory card circuit 712, the SIM card circuit 713 and the card interface 72 for protection.
  • the package 711 is made of a dielectric material, and the dielectric material includes but not limited to ethylene-vinyl acetate (EVA), polyvinyl butyral (polyvinyl butyral, PVB), ionomer, polyolefins (polyolefins, PO), silicon, thermoplastic polyurethane and other materials.
  • EVA ethylene-vinyl acetate
  • PVB polyvinyl butyral
  • ionomer polyolefins
  • PO polyolefins
  • silicon thermoplastic polyurethane and other materials.
  • the memory card circuit 712 can adopt an embedded multimedia memory card (embedded multi media card, EMMC) interface protocol, a flash storage (Universal Flash Storage, UFS) interface protocol, a high-speed peripheral component interconnect express (PCIE) Interface protocol, Secure Digital (SD) interface protocol and other interface protocols.
  • the memory card circuit 712 may include a control part and a storage part, the control part is electrically connected to the card interface 72 of the two-in-one card 7, the storage part is electrically connected to the storage part, the control part carries the content of the interface protocol, and the control part is used to receive the slave card interface 72 transmit data, and carry out command identification and processing according to the received basis, and the storage part is used to store data.
  • EMMC embedded multimedia memory card
  • UFS Universal Flash Storage
  • PCIE peripheral component interconnect express
  • SD Secure Digital
  • the SIM card circuit 713 can also include a control part and a SIM part, the control part is electrically connected to the card interface 72 of the two-in-one card 7, the storage part is electrically connected to the SIM part, the control part carries the interface protocol content, and the control part is used to receive the slave card
  • the data transmitted by the interface 72 is used to identify and process the command according to the received basis, and the SIM part is used to store the data.
  • the card interface 72 and the memory card circuit 712 and the SIM card circuit 713 may also be provided with other circuit parts, so that the card interface 72 and the memory card circuit 712 and the SIM card circuit 713 perform a signal transmission process of adaptation.
  • the size of the card body 71 of the two-in-one card 7 can be identical with the size of the card body of the Nano SIM card.
  • the two-in-one card 7 has two perpendicular length directions, width directions and thickness directions.
  • the maximum dimension of the card body 71 of the two-in-one card 7 in the length direction is its length
  • the maximum dimension in the width direction is its width
  • the largest dimension in the thickness direction is its thickness.
  • the dimensions of the card body 71 of the two-in-one card 7 may be 12.30 mm in length, 8.80 mm in width, and 0.67 mm in thickness.
  • the card interface 72 of the two-in-one card 7 in Figure 17 is set upward; the angle of view of the two-in-one card 7 in Figure 18 is reversed up and down relative to the angle of view of the two-in-one card 7 in Figure 17, Figure 18
  • the card interface 72 of the two-in-one card 7 is arranged downward, and the card connector is located below the two-in-one card 7 .
  • the card body 71 of the two-in-one card 7 includes a first side 7111, a second side 7112, a third side 7113, and a fourth side 7114, and the first side 7111 and the third side 7113 are arranged opposite to each other along the two-in-one card.
  • the first card 7 extends along the length direction
  • the second side 7112 and the fourth side 7114 are oppositely arranged and extend along the width direction of the two-in-one card 7 .
  • the distance between the second side 7112 and the fourth side 7114 is greater than the distance between the first side 7111 and the third side 7113 .
  • first side 7111 and the third side 7113 are long sides, and the second side 7112 and the fourth side 7114 are short sides.
  • the first side 7111 and the third side 7113 may be arranged parallel or approximately parallel, and the second side 7112 and the fourth side 7114 may be arranged parallel or approximately parallel.
  • one corner of the card body 71 of the 2-in-1 card 7 is a cut corner, and the cut corner is arranged between the first side 7111 and the second side 7112 .
  • the cut corner forms a cut edge 7115 which forms an obtuse angle with the first side 7111 and forms an obtuse angle with the second side 7112 .
  • a circular arc transition structure or a chamfer transition structure may be provided between adjacent sides of the card body 71 (including the first side 7111 , the second side 7112 , the third side 7113 , the fourth side 7114 and the cut side 7115 ).
  • the card body 71 of the 2-in-1 card 7 may not be provided with the aforementioned cut corners, which is not strictly limited in this application.
  • the size of the cut corner of the card body 71 of the two-in-one card 7 can be the same as or different from the size of the cut corner of the card body 31 of the Nano SIM card 3.
  • the card body of the two-in-one card 7 The size of 71 is identical with the size of the card body 31 of Nano SIM card 3.
  • the card interface 72 of the 2-in-1 card 7 includes a plurality of golden fingers, and the plurality of golden fingers are exposed on the same side of the card body 71 .
  • the number of gold fingers of the two-in-one card 7 is at least ten, and the multiple gold fingers may include, for example, a first gold finger 721, a second gold finger 722, a third gold finger 723, a fourth gold finger 724, and a fifth gold finger 725.
  • the first gold finger 721, the third gold finger 723, the fifth gold finger 725, the seventh gold finger 727 and the ninth gold finger 729 of the two-in-one card 7 are arranged in the first row of gold fingers along the width direction of the two-in-one card 7
  • the second gold finger 722, the fourth gold finger 724, the sixth gold finger 726, the eighth gold finger 728 and the tenth gold finger 7210 are arranged in the second row of gold fingers along the width direction of the two-in-one card 7, and the first row
  • the gold fingers and the second row of gold fingers are arranged in the length direction of the two-in-one card 7, and the five gold fingers of the first row of gold fingers (721, 723, 725, 727, 729) are connected with the second row of gold fingers (722, 722, 729).
  • the first gold fingers 321 to the tenth gold fingers 7210 are arranged in two rows and five rows.
  • the first row of gold fingers (721, 723, 725, 727, 729) is located between the second side 7112 and the second row of gold fingers (722, 724, 726, 728, 7210), that is, the first row of gold fingers (721, 723, 725, 727, 729) are arranged close to the second side 7112, and the second row of golden fingers (722, 724, 726, 728, 7210) are arranged close to the fourth side 7114.
  • the first gold finger 721 is located between the first side 7111 and the third gold finger 723
  • the second gold finger is located between the first side 7111 and the fourth gold finger 714 . That is, the first row of gold fingers (721, 722) is arranged close to the first side 7111, and the fifth row of gold fingers (729, 7210) is arranged close to the third side 7113.
  • the first gold finger 721 can be provided with a hypotenuse, forming a right-angled trapezoid, the hypotenuse of the first gold finger 721 is set facing the cut edge 7115 of the card body 71, and the distance between the two is greater than or equal to 0.1mm, for example, it can be 0.2 mm; the second gold finger 722 to the tenth gold finger 7210 may be rectangular. In some other embodiments, the first golden finger 721 may also be rectangular.
  • the distance between the centers of the second row of gold fingers (723, 724) and the third row of gold fingers (725, 726) is larger than that of the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724)
  • the distance between centers is greater than the distance between the centers of the fourth row of gold fingers (727, 728) and the fifth row of gold fingers (729, 7210).
  • the center distance between the third row of gold fingers (725, 726) and the fourth row of gold fingers (727, 728) is greater than the center distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) , and greater than the distance between the centers of the fourth row of gold fingers (727, 728) and the fifth row of gold fingers (729, 7210).
  • the distance between the centers of the second row of gold fingers (723, 724) and the third row of gold fingers (725, 726) can be in the range of 1.5 mm to 2.8 mm
  • the distance between the third row of gold fingers (725, 726) and the fourth row The center-to-center spacing of the gold fingers (727, 728) in the row can be in the range of 1.5 mm to 2.8 mm
  • the center-to-center spacing between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) can be 1.0 mm
  • the distance between the centers of the fourth row of gold fingers (727, 728) and the fifth row of gold fingers (729, 7210) may be within the range of 1.0mm to 1.7mm.
  • the two-in-one card 7 When the card tray 2 is equipped with a two-in-one card 7, the two-in-one card 7 is inserted into the card holder assembly 10, and the two-in-one card 7 is connected to the card connector 11, the width direction of the two-in-one card 7 is parallel to the width of the card connector 11. The first direction, the length direction is parallel to the second direction of the card connector 11 , and the ten elastic pieces of the card connector 11 are all against the two-in-one card 7 .
  • the ten elastic pieces of the card connector 11 are against the ten golden fingers of the two-in-one card 7 one by one, and the first elastic piece 11a to the tenth elastic piece 11j are one by one.
  • the first gold finger 721 to the tenth gold finger 7210 of the 2-in-1 card 7 are supported correspondingly.
  • the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 are arranged in two rows and five rows, and the center of the second row of elastic pieces (11c, 11d) and the third row of elastic pieces (11e, 11f) spacing and the center distance between the third row of shrapnel (11e, 11f) and the fourth row of shrapnel (11g, 11h) are greater than the center distance and The distance between the centers of the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j) enables the third shrapnel 11c to the eighth shrapnel 11h of the card connector 11 to resist and electrically connect the Nano SIM in one-to-one correspondence.
  • the first gold finger 321 to the sixth gold finger 326 of the card 3, and the third elastic piece 11c to the tenth elastic piece 11j of the card connector 11 can resist and electrically connect the first gold finger 421 of the first NM card 4 in one-to-one correspondence.
  • the eighth gold finger 428 the first elastic piece 11a to the tenth elastic piece 11j of the card connector 11 are in one-to-one correspondence and electrically connected to the first gold finger 721 to the tenth gold finger 7210 of the two-in-one card 7, so the card
  • the connector 11 is compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7.
  • the card connector 11 can also be designed to be compatible with the Nano SIM card 3 and the two-in-one card 7.
  • the distance between the centers of the second row of elastic sheets (11c, 11d) and the third row of elastic sheets (11e, 11f) of the card connector 11 and the third row of elastic sheets (11e, 11f) and the fourth row of shrapnel (11g, 11h) center spacing is set in the range of 1.5mm to 2.8mm
  • the spacing is set in the range of 1.0mm to 1.7mm
  • the center distance between the fourth row of shrapnel (11g, 11h) and the fifth row of shrapnel (11i, 11j) is set in the range of 1.0mm to 1.7mm, so that the third row of shrapnel 11c
  • the eighth shrapnel 11h can communicate with the six gold fingers of the Nano SIM card 3 respectively, the third shrapn
  • the shapes of the gold fingers are different, the arrangement positions of the gold fingers and the distance between the gold fingers are also different.
  • the unique design of the spacing from the first shrapnel 11a to the tenth shrapnel 11j enables the card connector 11 to be compatible with the Nano SIM card 3, the first NM card 4, and the two-in-one card 7, effectively reducing the setting of the Nano SIM card 3.
  • the card connector 11 Due to the risk of a short circuit between the gold finger of the Nano SIM card 3 and the shrapnel of the card connector 11 due to the card connector 11, when the first NM card 4 is set on the card connector 11, the gold finger of the first NM card 4 and the card connector 11, the risk of a short circuit on the shrapnel of the card connector 11, and when the two-in-one card 7 is set on the card connector 11, the risk of a short circuit between the golden finger of the two-in-one card 7 and the shrapnel of the card connector 11, so that the card connector 11 and the Nano SIM
  • the electrical connection relationship between the card 3, the first NM card 4 and the two-in-one card 7 is reliable, so that the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 can share the same card connector 11 in time-sharing. It can be understood that, in some other embodiments, the card connector 11 can also be designed to be compatible with the Nano SIM card 3 and the two-in-one card 7.
  • the card interface of the two-in-one card 7 can be implemented in various ways, and the following examples are used for illustration.
  • the two-in-one card 7 in the following embodiments can all be connected to the card connector 11 shown in FIG. 5 .
  • FIG. 19 is a dimension diagram of some embodiments of the 2-in-1 card 7 shown in FIG. 17 .
  • the ten golden fingers of the two-in-one card 7 are arranged in two rows and five rows, the first row of golden fingers (721, 723, 725, 727, 729) is arranged near the second side 7112, and the second row Gold fingers (722, 724, 726, 728, 7210) are arranged close to the fourth side 7114, each column of gold fingers is aligned in the width direction, and the first row of gold fingers (721, 722) is arranged close to the first side 7111 , the fifth row of gold fingers (729, 7210) is arranged close to the third side 7113, and each row of gold fingers is aligned in the length direction.
  • the first gold finger 721 can be provided with a cut edge, forming a right-angled trapezoid, the hypotenuse of the first gold finger 721 is set facing the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second gold finger 722 to the tenth gold finger 7210 may be rectangular.
  • the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, and the distance between the center of the third row of gold fingers (725, 726) and the first side 7111
  • the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 can be 4.55 mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 Can be 1.95mm.
  • the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) can be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first side 7111
  • the spacing can be 0.2mm.
  • the distance between the fourth row of gold fingers (727, 728) and the fifth row of gold fingers (729, 7210) can be 0.25mm, and the distance between the fifth row of gold fingers (729, 7210) and the third side 7113 The spacing can be 0.2mm.
  • the distance between the first row of gold fingers (721, 723, 725, 727, 729) and the second side 7112 may be 1.1mm, and the second row of gold fingers (722, 724, 726, 728, 7210 ) and the fourth side 7114 may be 1.1mm.
  • each golden finger may be 3.2 mm, and the width may be 1.0 mm.
  • the length of the first gold finger 721 is the size of its base, and the width of the first gold finger 721 is the size of its height.
  • the tolerance of the above-mentioned shape dimension and spacing dimension is ⁇ 0.1mm.
  • FIG. 20A is a dimensional drawing of the two-in-one card 7 shown in FIG. 16 in other embodiments
  • FIG. 20B is another dimensional drawing of the two-in-one card 7 shown in FIG. 20A .
  • the package 711 of the card body 71 of the 2-in-1 card 7 includes a first side 7111, a third side 7113, a second side 7112 and a fourth side 7114, and the first side 7111 and the third side 7113 are arranged opposite to each other. , is the long side, the second side 7112 and the fourth side 7114 are arranged oppositely, and is the short side, and a circular arc transition structure or a chamfer transition structure can be provided between adjacent sides.
  • the ten golden fingers of the two-in-one card 7 are arranged in two rows, the first row of golden fingers (721, 723, 725, 727, 729) is arranged near the second side 7112, and the second row of golden fingers ( 722, 724, 726, 728, 7210) are arranged near the fourth side 7114.
  • the first gold fingers 721 to the sixth gold fingers 726 are arranged in two rows and three rows, each row of gold fingers is aligned in the width direction, and the first row of gold fingers (721, 722) is arranged close to the first side 7111 , each row of gold fingers are aligned in the length direction.
  • the fourth row of golden fingers (727, 728) is aligned in the length direction.
  • the first gold finger 721 can be provided with a cut edge, forming a right-angled trapezoid, the hypotenuse of the first gold finger 721 is set facing the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second gold finger 722 to eighth golden fingers 728 may be rectangular.
  • the ninth gold finger 729 and the tenth gold finger 7210 may be L-shaped.
  • the ninth gold finger 729 half surrounds the seventh gold finger 727 .
  • the ninth gold finger 729 includes a first part 7291 and a second part, the first part 7291 extends along the length direction, and the second part 7292 extends along the width direction.
  • the first part 7291 of the ninth gold finger 729 is located between the seventh gold finger 727 and the third side 7113, and the second part 7292 of the ninth gold finger 729 connects the first part 7291 and is located between the seventh gold finger 727 and the second side 7112 between.
  • the tenth golden finger 7210 includes a first part 72101 and a second part 72102, the first part 72101 extends along the length direction, and the second part 72102 extends along the width direction.
  • the first part 72101 of the tenth gold finger 7210 is located between the eighth gold finger 728 and the third side 7113, and the second part 72102 of the tenth gold finger 7210 is connected to the first part 7291 and is located between the eighth gold finger 728 and the second side 7112 between.
  • the ninth gold finger 729 and the tenth gold finger 7210 can be understood as the fifth row of gold fingers (729, 7210).
  • the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, and the distance between the center of the third row of gold fingers (725, 726) and the first side 7111
  • the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 can be 4.55 mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 Can be 1.95mm.
  • the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) can be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first side 7111
  • the spacing can be 0.2mm.
  • the distance between the fourth row of gold fingers (727, 728) and the fifth row of gold fingers (729, 7210) can be 0.25mm, and the distance between the fifth row of gold fingers (729, 7210) and the third side 7113
  • the spacing can be 0.2mm. That is, in the width direction, the distance between the ninth gold finger 729 and the third side 7113 can be 0.2 mm, and the distance between the first part 7291 of the ninth gold finger 729 and the seventh gold finger 727 can be 0.25 mm;
  • the distance between the finger 7210 and the third side 7113 may be 0.2 mm, and the distance between the first part 72101 of the tenth gold finger 7210 and the eighth gold finger 728 may be 0.25 mm.
  • the top side of the second part 7292 of the ninth gold finger 729 close to the first side 7111 can be flush with the top side of the seventh gold finger 727 close to the first side 7111; the second part 72102 of the tenth gold finger 7210
  • the top side of the eighth gold finger 728 close to the first side 7111 may be flush with the top side of the eighth gold finger 728 close to the first side 7111 .
  • the width of the first part 7291 of the first gold finger 721 to the eighth gold finger 728 and the ninth gold finger 729 and the first part 72101 of the tenth gold finger 7210 can be 1.0 mm.
  • the distance between the first gold finger 721, the third gold finger 723 and the fifth gold finger 725 and the second side 7112 may be 1.1mm
  • the second gold finger 722, the fourth gold finger 724 and the second gold finger 724 The distance between the six gold fingers 726 and the fourth side 7114 may be 1.1 mm.
  • the side of the seventh gold finger 727 close to the fourth side 7114 and the side of the first part 7291 of the ninth gold finger 729 close to the fourth side 7114 can be close to the fifth gold finger 725.
  • the sides of the four sides 7114 are flush; the distance between the seventh gold finger 727 and the second part 7292 of the ninth gold finger 729 can be 0.2 mm, and the distance between the ninth gold finger 729 and the second side 7112 can be 0.5 mm; The width of the second portion 7292 of the nine golden fingers 729 may be 0.9 mm.
  • the side of the eighth gold finger 728 close to the second side 7112 and the side of the first part 72101 of the tenth gold finger 7210 close to the second side 7112 can be close to the sixth gold finger 726
  • the sides of the second side 7112 are flush; the distance between the eighth gold finger 728 and the second part 72102 of the tenth gold finger 7210 may be 0.2 mm, and the distance between the tenth gold finger 7210 and the fourth side 7114 may be 0.5 mm;
  • the width of the second portion 72102 of the tenth gold finger 7210 may be 0.9mm.
  • the tolerance of the above-mentioned shape dimension and spacing dimension is ⁇ 0.1 mm.
  • FIG. 21 is a dimension view of another embodiment of the two-in-one card 7 shown in FIG. 16 .
  • the package 711 of the card body 71 of the 2-in-1 card 7 includes a first side 7111, a third side 7113, a second side 7112 and a fourth side 7114, and the first side 7111 and the third side 7113 are arranged opposite to each other. , is the long side, the second side 7112 and the fourth side 7114 are arranged oppositely, and is the short side, and a circular arc transition structure or a chamfer transition structure can be set between adjacent sides.
  • the first golden fingers 721 to the tenth golden fingers 7210 of the two-in-one card 7 are arranged in two rows and five rows, and the first row of golden fingers (721, 723, 725, 727, 729) is close to the second side 7112 Arrangement, the second row of gold fingers (722, 724, 726, 728, 7210) is arranged near the fourth side 7114; the first row of gold fingers (721, 722) is arranged near the first side 7111, and the fifth row of gold fingers (729, 7210) are arranged close to the third side 7113, and each row of golden fingers is aligned in the length direction.
  • the two-in-one card 7 also includes an eleventh gold finger 7220 and a twelfth gold finger 7230, and the eleventh gold finger 7220 and the twelfth gold finger 7230 are arranged in the fourth row of gold fingers (727, 728, 7220, 7230 ), the eleventh gold finger 7220 is located between the second side 7112 and the seventh gold finger 727 , and the twelfth gold finger 7230 is located between the fourth side 7114 and the eighth gold finger 728 .
  • the first gold finger 721 can be provided with a cut edge, forming a right-angled trapezoid, the hypotenuse of the first gold finger 721 is set facing the cut edge 7115 of the card body 71, and the distance between the two can be 0.2mm; the second gold finger The 722 to twelfth gold fingers 7230 may be rectangular.
  • the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.95mm, and the distance between the center of the third row of gold fingers (725, 726) and the first side 7111
  • the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 can be 4.55mm, and the distance between the center of the fourth row of gold fingers (727, 728, 7220, 7230) and the third side
  • the spacing of sides 7113 may be 1.95mm.
  • the distance between the first row of gold fingers (721, 722) and the second row of gold fingers (723, 724) can be 0.25mm, and the distance between the first row of gold fingers (721, 722) and the first side 7111 The spacing can be 0.2mm.
  • the distance between the fourth row of gold fingers (727, 728, 7220, 7230) and the fifth row of gold fingers (729, 7210) can be 0.25 mm, and the distance between the fifth row of gold fingers (729, 7210) and The distance between the third sides 7113 may be 0.2mm.
  • the widths of the first gold finger 721 to the twelfth gold finger 7230 can be 1.0 mm.
  • the distance between the first gold finger 721, the third gold finger 723 and the fifth gold finger 725 and the second side 7112 may be 1.1mm
  • the second gold finger 722, the fourth gold finger 724 and the second gold finger 724 The distance between the six gold fingers 726 and the fourth side 7114 may be 1.1 mm.
  • the side of the seventh gold finger 727 close to the fourth side 7114 and the side of the ninth gold finger 729 close to the fourth side 7114 can be compared with the side of the fifth gold finger 725 close to the fourth side 7114
  • the sides are flush; the side of the eleventh gold finger 7220 close to the second side 7112 is flush with the side of the ninth gold finger 729 close to the second side 7112; the seventh gold finger 727 and the eleventh gold finger 7220
  • the distance between the eleventh gold fingers 7220 and the second side 7112 may be 0.5 mm, and the length of the eleventh gold fingers 7220 may be 0.9 mm.
  • the side of the eighth gold finger 728 close to the second side 7112 and the side of the tenth gold finger 7210 close to the second side 7112 can be close to the second side 7112 of the sixth gold finger 726 the side of the twelfth gold finger 7230 close to the fourth side 7114 is flush with the side of the tenth gold finger 7210 close to the fourth side 7114; the eighth gold finger 728 is aligned with the twelfth gold finger
  • the distance between 7230 may be 0.2 mm
  • the distance between the twelfth gold finger 7230 and the fourth side 7114 may be 0.5 mm
  • the length of the twelfth gold finger 7230 may be 0.9 mm.
  • the tolerance of the above-mentioned shape dimension and spacing dimension is ⁇ 0.1mm.
  • FIG. 22 is a dimension view of another embodiment of the two-in-one card 7 shown in FIG. 16 .
  • the package 711 of the card body 71 of the 2-in-1 card 7 includes a first side 7111, a third side 7113, a second side 7112 and a fourth side 7114, and the first side 7111 and the third side 7113 are arranged opposite to each other. , is the long side, the second side 7112 and the fourth side 7114 are arranged oppositely, and is the short side, and a circular arc transition structure or a chamfer transition structure can be set between adjacent sides.
  • the first golden fingers 721 to the tenth golden fingers 7210 of the two-in-one card 7 are arranged in two rows and five rows, and the first row of golden fingers (721, 723, 725, 727, 729) is close to the second side 7112 Arrangement, the second row of gold fingers (722, 724, 726, 728, 7210) is arranged close to the fourth side 7114, and each row of gold fingers is aligned in the width direction; the first row of gold fingers (721, 722) is close to The first side 7111 is arranged, the fifth row of gold fingers (729, 7210) is arranged close to the third side 7113, and each row of gold fingers is aligned in the length direction.
  • the first gold finger 721 to the tenth gold finger 7210 can all be rectangular.
  • the first gold finger 721 may be closer to the cut edge 7115 of the card body 71 than other gold fingers.
  • the distance between the center of the second row of gold fingers (723, 724) and the first side 7111 may be 1.86mm, and the distance between the center of the third row of gold fingers (725, 726) and the first side 7111
  • the distance between the center of the third row of gold fingers (725, 726) and the third side 7113 can be 4.4 mm, and the distance between the center of the fourth row of gold fingers (727, 728) and the third side 7113 Can be 1.86mm.
  • the distance between the first row of gold fingers (721, 722) and the first side 7111 may be 0.2 mm, and the distance between the fifth row of gold fingers (729, 7210) and the third side 7113 may be 0.2 mm.
  • the distance between the center of the first row of gold fingers (721, 723, 725, 727, 729) and the second side 7112 may be 2.68 mm
  • the second row of gold fingers (722, 724, 726 , 728, 7210) and the distance between the center of the fourth side 7114 may be 2.0mm
  • the length of the card body 71 of the two-in-one card 7 may be 12.3mm.
  • the tolerance of the above-mentioned shape dimension and spacing dimension is ⁇ 0.1mm.
  • the structural dimensions of the two-in-one card 7 shown in Figures 19 to 22 are partial examples of the two-in-one card 7, and the card interface 72 of the two-in-one card 7 can also have more gold finger arrangements
  • the card interface 72 of the 2-in-1 card 7 only needs to include at least the first gold finger 721 to the tenth gold finger 7210 , which is not strictly limited in this embodiment of the present application.
  • the signal arrangement and internal circuit of the card interface 72 of the two-in-one card 7 are illustrated below, and some circuits of electronic equipment that can be connected to the two-in-one card 7 are also illustrated as examples.
  • the signal arrangement of the card interface 72 of the two-in-one card 7 in the following embodiments can all be applied to the two-in-one card 7 with the first gold finger to the tenth gold finger, for example, FIG. 17, FIG. 19 to FIG.
  • FIG. 23 is a schematic diagram of some embodiments of the 2-in-1 card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 supports the EMMC interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 arranged in an array.
  • one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the gold fingers is used to transmit the clock signal (SIM CLK) of the SIM card
  • Two gold fingers are used to transmit the data signal of the memory card (NM DATA0, NM DATA1, NM DATA2, NM DATA3
  • one of the gold fingers is used to transmit the clock signal of the memory card (NM CLK)
  • one of the gold fingers is used to transmit the SIM Card reset signal (SIM RST) and memory card command and response signal (NM CMD)
  • one of the golden fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND), one of
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit the data signals of the memory card (NM DATA0, NM DATA1, NM DATA3 , NM DATA2).
  • the first gold finger 721 is used to transmit data signals (NM DATA0)
  • the second gold finger 722 is used to transmit data signals (NM DATA1)
  • the ninth gold finger 729 is used to transmit data signals (NM DATA3)
  • the second gold finger 722 is used to transmit data signals (NM DATA3).
  • Ten golden fingers 7210 are used to transmit data signals (NM DATA2), as an example to illustrate.
  • the data signals transmitted by the first gold finger 721 , the second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card; the fifth gold finger 725 is used to transmit the clock signal (NM) of the memory card CLK); the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card and the command and response signal (NM CMD) of the memory card; the seventh golden finger 727 is used to transmit the ground signal (SIM GND) of the SIM card and the ground signal (NM GND) of the memory card; the eighth golden finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the power signal (NM VCC) of the memory card.
  • Table 3 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the 2-in-1 card 7 shown in FIG. 23 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (DATA0, DATA1, DATA2, DATA3), a clock interface (CLK), a command and response multiplexing interface (CMD), a ground interface (GND) and a power interface (VCC ).
  • DATA0, DATA1, DATA2, DATA3 a clock interface
  • CMD command and response multiplexing interface
  • GND ground interface
  • VCC power interface
  • DATA0, DATA1, DATA2, DATA3 of the memory card circuit 712 are used to transmit the data signals (NM DATA0, NM DATA1, NM DATA2, NM DATA3) of the memory card, and the clock interface (CLK) of the memory card circuit 712
  • the command of the memory card circuit 712 and the response multiplexing interface (CMD) are used for transmitting the command of the memory card and the response signal (NM CMD)
  • the ground interface of the memory card circuit 712 ( GND) is used to transmit the ground signal (NM GND) of the memory card
  • the power interface (VCC) of the memory card circuit 712 is used to transmit the power signal (NM VCC) of the memory card.
  • the interface of the above-mentioned memory card circuit 712 may be located in the control part of the memory card circuit 712 .
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the interface of the above-mentioned SIM card circuit 713 may be located in the control part of the SIM card circuit 713 .
  • the two-in-one card 7 also includes a switching circuit 714 .
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (DATA0, DATA1, DATA3, DATA2) of the memory card circuit 712
  • the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713
  • the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713
  • the fifth gold finger 725 is electrically connected to the clock interface of the memory card circuit 712 (CLK)
  • the sixth golden finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the command and response multiplexing interface (CMD) of the memory card circuit 712 through the switching circuit 714
  • the seventh golden finger 727 is electrically connected to the SIM card
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the first gold finger 721, The second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 do not need to switch the connection circuit design of the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the third gold finger 723, the fourth gold finger 724, and the fifth gold finger 725 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the two-in-one The internal circuit design of One Card 7 is less difficult and easy to implement.
  • the switching circuit 714 is configured to detect the signal transmitted by the sixth gold finger 726 and implement corresponding switching. For example, if the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is the reset signal (SIM RST) of the SIM card, then the reset interface (RST) between the sixth gold finger 726 and the SIM card circuit 713 is turned on. At this time, the command and response multiplexing interface (CMD) of the sixth golden finger 726 and the memory card circuit 712 is in a disconnected state.
  • SIM RST reset signal
  • CMD command and response multiplexing interface
  • the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is the command and response signal (NM CMD) of the memory card, then the command and response multiplexing interface (CMD) of the sixth gold finger 726 and the memory card circuit 712 is turned on. . At this moment, the reset interface (RST) of the sixth gold finger 726 and the SIM card circuit 713 is in a disconnected state.
  • NM CMD command and response signal
  • CMD command and response multiplexing interface
  • the two-in-one card 7 realizes the transmission switching of the two-way signals through the switching circuit 714, so that the reset signal (SIM RST) of the SIM card and the command and response signal (CMD) of the memory card circuit 712 can pass through the first
  • the six golden fingers 726 realize the transmission, so that the card interface 72 of the two-in-one card 7 has a high degree of integration, and the switching difficulty of the connection circuit with the interface of the SIM card circuit 713 and the interface of the memory card circuit 712 is low and easy to realize, so that the two-in-one card 7 has a high degree of integration.
  • One card 7 has high reliability.
  • the default state of the switching circuit 714 can be set as the command and response multiplexing interface (CMD) of the sixth golden finger 726 and the memory card circuit 712, the sixth The gold finger 726 is disconnected from the reset interface (RST) of the SIM card circuit 713 .
  • CMD command and response multiplexing interface
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • a ground signal is transmitted through the seventh golden finger 727 , and the ground signal is transmitted to the ground interface (GND) of the SIM card circuit 713 and also transmitted to the ground interface (GND) of the memory card circuit 712 .
  • a power signal is transmitted through the eighth gold finger 728.
  • the power signal is transmitted to the power interface of the SIM card circuit 713 ( VCC) and the power supply interface (VCC) of memory card circuit 712;
  • VCC the power interface of the SIM card circuit 713
  • VCC the power supply interface
  • a branch and a voltage regulation branch, the direct transmission branch and the voltage regulation branch are connected in parallel, the direct transmission branch is used to transmit the power signal passing through the eighth gold finger 728, and the voltage regulation branch is connected to the power supply of the eighth gold finger 728
  • the signal continues to be transmitted after voltage regulation.
  • One of the direct transmission branch and the voltage regulation branch is electrically connected to the power interface (VCC) of the SIM card circuit 713, and the other is electrically connected to the power interface (VCC) of the memory card circuit 712.
  • the voltage regulation branch can be connected in series with a voltage regulator (regulator) to realize voltage regulation.
  • the eighth gold finger 728 can also be electrically connected to two parallel voltage regulation branches, The two voltage regulation branches are respectively connected to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712 .
  • the voltage regulation action of the power signal can also be performed by the memory card circuit 712 or the SIM card circuit 713
  • the power signal transmitted by the eighth golden finger 728 is directly transmitted to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712 .
  • the embodiments of the present application do not strictly limit whether the power signal (SIM VCC) of the SIM card and the power signal (NM VCC) of the memory card are voltage-regulated, and the manner in which the voltage regulation is implemented.
  • the power interface and the ground interface of the memory card circuit 712 and the SIM card circuit 713 may also be separated to form the power interface and the ground interface of the two-in-one card 7 .
  • FIG. 24A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 23 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a switch 203, a power interface, and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal (SIM VCC) of the SIM card interacting with the two-in-one card 7 or the power signal (NM VCC) of the memory card
  • the ground signal can be the memory card interacting with the two-in-one card 7
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the SIM card controller 202 includes a reset interface (RST), and the reset interface (RST) is used to transmit a reset signal (SIM RST) of the SIM card.
  • the switch 203 can be connected to one interface of the SIM card controller 202 including the reset interface (RST) and the memory card controller 201 , and the switch 203 is also connected to one of the ten elastic pieces of the card connector 11 .
  • the reset operation of the SIM card circuit of the two-in-one card 7 is not frequently operated, and the reset process can be completed very quickly, when the reset interface (RST) and one of the interfaces of the memory card controller 201 multiplex the same
  • the shrapnel can be fully utilized for signal transmission through time-division multiplexing.
  • the card controller 202 includes a reset interface (RST) to ensure the user's networking experience.
  • the shrapnel is switched back to the conductive memory card controller 201 to continue Complete the read and write operations on the two-in-one card 7, thereby improving the work efficiency of the electronic equipment.
  • the memory card controller 201 supports the EMMC interface protocol.
  • the memory card controller 201 includes four data interfaces (DATA0, DATA1, DATA2, DATA3), a clock interface (CLK) and a command and response multiplexing interface (CMD), and the four data interfaces (DATA0, DATA1, DATA2, DATA3) are used It is used to transmit the data signal of the memory card (NM DATA0, NM DATA1, NM DATA2, NM DATA3), the clock interface (CLK) is used to transmit the clock signal of the memory card (NM CLK), and the command and response multiplexing interface (CMD) is used for Transmits memory card command and response signals (NM CMD).
  • DATA0, DATA1, DATA2, DATA3 a clock interface
  • CMD command and response multiplexing interface
  • SIM card controller 202 also includes data interface (DATA) and clock interface (CLK), and data interface (DATA) is used to transmit the data signal (SIM DATA) of SIM card, and clock interface (CLK) is used to transmit the clock signal of SIM card (SIM CLK).
  • DATA data interface
  • CLK clock interface
  • the switch 203 is also connected to the command and response multiplexing interface (CMD) of the memory card controller 201 .
  • CMD command and response multiplexing interface
  • Seven of the ten shrapnels of the card connector 11 are connected to the four data interfaces (DATA0, DATA1, DATA2, DATA3) of the memory card controller 201 and the clock interface (CLK) of the memory card controller 201 one by one.
  • the data interface (DATA) of the SIM card controller 202 and the clock interface (CLK) of the SIM card controller 202 are connected to the command and response multiplexing interface (CMD) of the memory card controller 201 .
  • DATA0, DATA1, DATA2, DATA3 the data interface
  • CLK clock interface
  • the four data interfaces (DATA0, DATA1, DATA3, DATA2) of the memory card controller 201 are electrically connected to the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11 in one-to-one correspondence
  • the clock interface (CLK) of the memory card controller 201 is electrically connected to the fifth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11 .
  • the switch 203 is connected to the command and response multiplexing interface (CMD) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202 , and the switch 203 is also connected to the sixth shrapnel of the card connector 11 .
  • the switch 203 is used to connect the sixth shrapnel to the command and response multiplexing interface (CMD) of the memory card controller 201 , or to connect the sixth shrapnel to the reset interface (RST) of the SIM card controller 202 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the control switch 203 conducts the command and response multiplexing interface (CMD) of the memory card controller 201 and the sixth shrapnel, and the sixth shrapnel sends a signal to the sixth shrapnel of the two-in-one card 7.
  • CMD command and response multiplexing interface
  • the switching circuit 714 connected to the sixth gold finger 726 identifies the transmission signal or the signal to be transmitted as the command and response signal (NM CMD) of the memory card, and the switching circuit 714 conducts the connection between the sixth gold finger 726 and the memory card circuit 712 Command and response multiplexing interface (CMD) to realize the transmission of the memory card's command and response signal (NM CMD).
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the processor 20 controls the switch 203 to conduct the reset interface (RST) of the SIM card controller 202 and the sixth shrapnel, and the sixth shrapnel Send the signal to the sixth gold finger 726 of the two-in-one card 7, the switching circuit 714 connected to the sixth gold finger 726 identifies the transmission signal or the signal to be transmitted as the reset signal (SIM RST) of the SIM card, and the switching circuit 714 is turned on to the sixth gold finger 726.
  • Gold finger 726 and the reset interface (SIM RST) of SIM card circuit 713 to realize the transmission of the reset signal (SIM RST) of SIM card, control SIM card circuit 713 to reset.
  • the reset operation of the SIM card is not frequently operated, and the reset process can be completed quickly.
  • the sixth gold finger 726 of the two-in-one card 7 is first connected to the reset of the SIM card. Interface (RST) to ensure the user's networking experience.
  • RST Interface
  • the sixth golden finger 726 switches back to the memory card circuit 712 to continue to complete the read and write operations, thereby improving the performance of the two-in-one card. 7 work efficiency.
  • the signal arrangement of the card interface 72 of the 2-in-1 card 7 may be arranged in other ways.
  • the fifth gold finger 725 is used to transmit the command and response signal (NM CMD) of the memory card
  • the sixth gold finger 726 is used to transmit the reset signal (SIM RST) of the SIM card and the clock signal (NM CLK) of the transmission memory card
  • the signal layout of other golden fingers remains unchanged.
  • the switching circuit 714 of the two-in-one card 7 is electrically connected to the clock interface (CLK) of the memory card circuit 712 and the reset interface (RST) of the SIM card circuit 713
  • the fifth gold finger 725 is connected to the command and response reply of the memory card circuit 712.
  • the connection circuit between other interfaces and the golden finger remains unchanged;
  • the command and response multiplexing interface (CMD) of the memory card controller 201 of the electronic device is electrically connected to the fifth shrapnel, and the clock interface of the memory card controller 201 ( CLK) is electrically connected to the switch 203, and the connection circuit between other interfaces and the shrapnel of the card connector 11 remains unchanged; the work flow of the two-in-one card 7 and the electronic device is adjusted adaptively, and will not be repeated here.
  • Table 4 is a table of corresponding relations between multiple shrapnels of the card connector 11 and multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 23 and their transmission signals .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the clock interface (CLK) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The clock interface (CLK) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • CLK memory card control The clock interface
  • FIG. 24B is a schematic diagram of a partial circuit structure of an electronic device provided in an embodiment of the present application in some embodiments.
  • the electronic device of this embodiment may include most of the technical content of the electronic device corresponding to FIG. 24A , and the differences between the two are mainly described below.
  • the electronic device is compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 shown in FIG. 23 .
  • the processor 20 of the electronic device includes a memory card controller 201, a SIM card controller 202, and an interface controller 205, and the interface controller 205 is electrically connected to the memory card controller 201 and the SIM card controller 202, and the interface controller 205 returns power Multiple elastic pieces of the card connector 11 are connected.
  • the interface protocol (such as the EMMC interface protocol) of the memory card controller 201 can communicate with the memory card circuit of the first NM card 4 and the two-in-one card 7, for controlling the operation of the first NM card 4 and the control of the two-in-one card 7
  • the memory card circuit runs, and the SIM card controller 202 is used to control the Nano SIM card 3 to run.
  • the interface controller 205 can control the memory card controller 201 and/or the SIM card controller 202 to communicate with the information card through the card connector 11. communication.
  • the interface controller 205 controls the SIM card controller 202 to communicate with the Nano SIM card 3 through the card connector 11;
  • the first NM card 4 is installed, and when the first NM card 4 is inserted into the card holder assembly 10, the interface controller 205 controls the memory card controller 201 to communicate with the first NM card 4 via the card connector 11;
  • the interface controller 205 may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor 20 is switched, so as to realize communication requirements in different scenarios.
  • Interface controller 205 may also include multiple wires.
  • FIG. 24B For an exemplary solution of the interface controller 205, reference may be made to FIG. 24B , which will not be repeated here.
  • the switch 203 may be a part of the interface controller 205 .
  • FIG. 25 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 supports the UFS interface protocol.
  • the UFS interface protocol is a standard developed by the Joint Electron Device Engineering Council (JEDEC) Association to define the electrical interface of UFS universal flash memory and UFS storage devices.
  • JEDEC Joint Electron Device Engineering Council
  • UFS defines a complete protocol stack, which is the application layer, transport layer and interconnection layer from top to bottom.
  • UFS defines a unique UFS feature set, and uses the EMMC standard feature set as a subset, using the UniPro (interface) of the MIPI (Mobile Industry Processor Interface, Mobile Industry Processor Interface) Alliance as the data link layer and MIPI
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • MIPI Mobile Industry Processor Interface
  • the UFS interface protocol released version 1.0 in 2011, and then released version 1.1, version 2.0, version 2.1, and version 3.0 in 2012, 2013, 2016, and 2018. Each version update is accompanied by an increase in speed. .
  • the UFS interface protocol is a connection after version 4.5 of the EMMC interface protocol.
  • the main improvement of the UFS interface protocol lies in the transmission layer.
  • the UFS interface protocol adopts differential serial transmission, which supports simultaneous reading and writing of data. At the same time, because the differential signal has strong anti-interference ability and can provide wider bandwidth, it is relatively Compared with the previous generation protocol standard EMMC, the UFS interface protocol has the characteristics of fast speed and low power consumption.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • the first gold fingers 721 to tenth gold fingers 7210 one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit the clock signal (SIM CLK) of the SIM card, and four of them
  • One gold finger is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-)
  • one of the gold fingers is used to transmit the second power signal of the memory card (NM VCCQ)
  • one of the golden fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND)
  • one of the gold fingers is used to transmit the power signal of the SIM card
  • the data signal of the memory card (NM RX+) and the data signal of the memory card (NM RX-) are input differential signals;
  • the data signal of the memory card (NM TX+) and the data signal of the memory card (NM TX-) are output signals Differential signal;
  • the first power supply signal (NM VCC) of the memory card is responsible for the power supply of the flash memory particle (that is, the storage part) of the memory card circuit 712 of the two-in-one card 7;
  • the second power supply signal (NM VCCQ) of the memory card is responsible for two The power supply of the control part of the memory card circuit 712 of the integrated card 7.
  • the second power supply signal (NM VCCQ) of the memory card can also be responsible for the power supply of the M-PHY interface of the memory card circuit 712, the input and output of the flash memory and other internal low voltage circuits.
  • the voltage of the first power supply signal (NM VCC) of the memory card can be in the range of 1.7V to 1.95V, or in the range of 2.7V to 3.6V.
  • the voltage of the second power signal (NM VCCQ) of the memory card may be in the range of 1.1V to 1.3V.
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+ , NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the fifth gold finger 725 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the fifth gold finger 725 is used to transmit data signals (NM TX+).
  • Ten golden fingers 7210 are used to transmit data signals (NM TX-), as an example for illustration.
  • the data signals transmitted by the first gold finger 721 , the fifth gold finger 725 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the fifth gold finger 725 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the second gold finger 722 is used to transmit the second power signal (NM VCCQ) of the memory card; the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock of the SIM card signal (SIM CLK); the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card and the reference clock signal (NM RCLK) of the memory card; the seventh golden finger 727 is used to transmit the ground signal (SIM RST) of the SIM card GND) and the ground signal (NM GND) of the memory card; the eighth gold finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VCC) of the memory card.
  • Table 5 is a schematic diagram of the corresponding relationship between the golden finger and the circuit interface of the two-in-one card 7 shown in FIG. 25 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VCCQ), a reference clock interface (RCLK), a ground interface (GND) and a first power supply Interface (VCC).
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card.
  • the second power supply interface (VCCQ) is used to transmit the second power supply signal (NM VCCQ) of the memory card
  • the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VCC) of the memory card circuit 712 is used to transmit the first power signal (NM VCC) of the memory card.
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the two-in-one card 7 also includes a switching circuit 714 .
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+, TX- ), the second gold finger 722 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712, the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, and the fourth gold finger 724 is electrically connected to the SIM card circuit
  • the clock interface (CLK) of 713, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the reference clock interface (RCLK) of the memory card circuit 712 through the switching circuit 714, and the seventh gold finger 727 is electrically connected to the SIM The ground interface (GND) of the card circuit 713 and the ground interface (GND) of the memory
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the five gold fingers 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to be designed to switch the connection circuit between the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the second gold finger 722, the third gold finger 723, and the fourth gold finger 724 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the two The design difficulty of the internal circuit of the all-in-one card 7 is low and easy to realize.
  • the switching circuit 714 is configured to detect the signal transmitted by the sixth gold finger 726 and implement corresponding switching. For example, if the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is the reset signal (SIM RST) of the SIM card, then the reset interface (RST) between the sixth gold finger 726 and the SIM card circuit 713 is turned on. At this time, the sixth gold finger 726 is disconnected from the reference clock interface (RCLK) of the memory card circuit 712 . If the switching circuit 714 detects that the signal transmitted by the sixth golden finger 726 is the reference clock signal (NM RCLK) of the memory card, then the reference clock interface (RCLK) between the sixth golden finger 726 and the memory card circuit 712 is turned on. At this moment, the reset interface (RST) of the sixth gold finger 726 and the SIM card circuit 713 is in a disconnected state.
  • SIM RST reset signal
  • RST reset interface
  • the two-in-one card 7 realizes the transmission switching of the two-way signals through the switching circuit 714, so that the reset signal (SIM RST) of the SIM card and the reference clock interface (RCLK) of the memory card circuit 712 can pass through the sixth
  • the gold finger 726 realizes the transmission, so that the card interface 72 of the two-in-one card 7 has a high degree of integration, and the connection circuit switching difficulty with the interface of the SIM card circuit 713 and the interface of the memory card circuit 712 is low and easy to implement, making the two-in-one card 7 Card 7 has high reliability.
  • the default state of the switching circuit 714 can be set to conduct the reference clock interface (RCLK) of the sixth golden finger 726 and the memory card circuit 712, and the sixth golden finger 726 The reset interface (RST) with the SIM card circuit 713 is disconnected.
  • RCLK reference clock interface
  • the reset operation of the SIM card is not frequently operated, and the reset process can be completed quickly.
  • the sixth gold finger 726 of the two-in-one card 7 is first connected to the reset of the SIM card. Interface (RST) to ensure the user's networking experience.
  • RST Interface
  • the sixth golden finger 726 switches back to the memory card circuit 712 to continue to complete the read and write operations, thereby improving the performance of the two-in-one card. 7 work efficiency.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the related description of the previous embodiment for details, and details will not be repeated here.
  • FIG. 26A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 25 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a switch 203, a power interface, and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal (SIM VCC) of the SIM card or the first power signal (NM VCC) of the memory card
  • the ground signal can be the ground signal (NM GND) of the memory card or the ground signal (SIM GND) of the SIM card.
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the SIM card controller 202 includes a reset interface (RST), and the reset interface (RST) is used to transmit a reset signal (SIM RST) of the SIM card.
  • the switch 203 can be connected to one interface of the SIM card controller 202 including the reset interface (RST) and the memory card controller 201 , and the switch 203 is also connected to one of the ten elastic pieces of the card connector 11 .
  • the reset operation of the SIM card circuit of the two-in-one card 7 is not frequently operated, and the reset process can be completed very quickly, when the reset interface (RST) and one of the interfaces of the memory card controller 201 multiplex the same
  • the shrapnel can be fully utilized for signal transmission through time-division multiplexing.
  • the card controller 202 includes a reset interface (RST) to ensure the user's networking experience.
  • the shrapnel is switched back to the conductive memory card controller 201 to continue Complete the read and write operations on the two-in-one card 7, thereby improving the work efficiency of the electronic equipment.
  • the memory card controller 201 supports the UFS interface protocol.
  • Memory card controller 201 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VCCQ) and a reference clock interface (RCLK), four data interfaces (RX+, RX-, TX+, TX -) Used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), the second power interface (VCCQ) is used to transmit the second power signal of the memory card (NM VCCQ), the reference clock The interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card.
  • SIM card controller 202 also includes data interface (DATA) and clock interface (CLK), and data interface (DATA) is used to transmit the data signal (SIM DATA) of SIM card, and clock interface (CLK) is used to transmit the clock signal of SIM card (SIM CLK).
  • DATA data interface
  • CLK clock interface
  • the switch 203 is also connected to the reference clock interface (RCLK) of the memory card controller 201, and seven of the ten elastic pieces of the card connector 11 are connected to the four data interfaces (RX+ , RX-, TX+, TX-), the second power interface (VCCQ) of the memory card controller 201, the data interface (DATA) of the SIM card controller 202 and the data interface (DATA) of the SIM card controller 202.
  • RCLK reference clock interface
  • VCCQ second power interface
  • DATA data interface
  • DATA data interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are respectively electrically connected to the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11.
  • the second power interface (VCCQ) of the card controller 201 is electrically connected to the second elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11 .
  • the switch 203 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202 , and the switch 203 is also connected to the sixth shrapnel of the card connector 11 .
  • the switch 203 is used to connect the sixth elastic piece to the reference clock interface (RCLK) of the memory card controller 201 , or to connect the sixth elastic piece to the reset interface (RST) of the SIM card controller 202 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the transmission of the power signal (NM VCCQ) is through the transmission of the reference clock signal (NM RCLK) of the memory card between the sixth shrapnel and the two-in-one card 7;
  • the power interface of the processor 20 is connected to the two-in-one card through the eighth shrapnel 7 to transmit the first power signal (NM VCC) of the memory card, and the ground interface to transmit the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 Realize data storage function.
  • the control switch 203 conducts the reference clock interface (RCLK) of the memory card controller 201 and the sixth shrapnel, and the sixth shrapnel sends a signal to the sixth golden finger 726 of the two-in-one card 7 , the switching circuit 714 connected to the sixth gold finger 726 recognizes that the transmission signal or the signal to be transmitted is the reference clock signal (NM RCLK) of the memory card, and the switching circuit 714 conducts the reference clock interface of the sixth gold finger 726 and the memory card circuit 712 ( RCLK) to realize the transmission of the reference clock signal (NM RCLK) of the memory card.
  • RCLK reference clock interface
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the processor 20 controls the switch 203 to conduct the reset interface (RST) of the SIM card controller 202 and the sixth shrapnel, and the sixth shrapnel Send the signal to the sixth gold finger 726 of the two-in-one card 7, the switching circuit 714 connected to the sixth gold finger 726 identifies the transmission signal or the signal to be transmitted as the reset signal (SIM RST) of the SIM card, and the switching circuit 714 is turned on to the sixth gold finger 726.
  • Gold finger 726 and the reset interface (SIM RST) of SIM card circuit 713 to realize the transmission of the reset signal (SIM RST) of SIM card, control SIM card circuit 713 to reset.
  • the reset operation of the SIM card is not frequently operated, and the reset process can be completed quickly.
  • the sixth gold finger 726 of the two-in-one card 7 is first connected to the reset of the SIM card. Interface (RST) to ensure the user's networking experience.
  • RST Interface
  • the sixth golden finger 726 switches back to the memory card circuit 712 to continue to complete the read and write operations, thereby improving the performance of the two-in-one card. 7 work efficiency.
  • the signal arrangement of the card interface 72 of the 2-in-1 card 7 may be arranged in other ways.
  • the first gold finger 721 is used to transmit the second power signal (NM VCCQ) of the memory card
  • the second gold finger 722 is used to transmit one of the data signals (such as NM RX+) of the memory card
  • the signal arrangement of other gold fingers constant.
  • the first gold finger 721 of the two-in-one card 7 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712
  • the second gold finger 722 is connected to one of the data interfaces (such as RX+) of the memory card circuit 712
  • the other The connection circuit between the interface and the golden finger remains unchanged
  • the second power interface (VCCQ) of the memory card controller 201 of the electronic device is electrically connected to the first shrapnel
  • one of the data interfaces (such as RX+) of the memory card controller 201 is electrically connected to the second The shrapnel, other interfaces and the connection circuit of the shrapnel of the card connector 11 remain unchanged
  • the work flow of the two-in-one card 7 and the electronic equipment is adjusted adaptively, and will not be repeated here.
  • Table 6 is a table of corresponding relations between multiple shrapnels of the card connector 11, the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 25 and their transmission signals. .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the data interface (for example, RX-) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The data interface (such as RX-) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • FIG. 26B is a schematic diagram of a partial circuit structure of an electronic device provided by an embodiment of the present application in other embodiments.
  • the electronic device in this embodiment may include most of the technical content of the electronic device corresponding to FIG. 26A , and the differences between the two will be mainly described below.
  • the electronic device is compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 shown in FIG. 25 .
  • the processor 20 of the electronic device includes a memory card controller 201, a second memory card controller 206, a SIM card controller 202, and an interface controller 205, and the interface controller 205 is electrically connected to the memory card controller 201, the second memory card
  • the controller 206 and the SIM card controller 202 and the interface controller 205 are also electrically connected to multiple elastic pieces of the card connector 11 .
  • the interface protocol (such as the UFS interface protocol) of the memory card controller 201 can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller 202 is used to control the Nano The SIM card 3 runs, and the interface protocol (for example, EMMC interface protocol) of the second memory card controller 206 can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface protocol for example, EMMC interface protocol
  • the interface controller 205 can control the SIM card controller 202 to communicate with the information card via the card connector 11, or the memory card controller 201
  • the SIM card controller 202 communicates with the information card via the card connector 11, or the second memory card controller 206 communicates with the information card via the card connector 11.
  • the interface controller 205 controls the SIM card controller 202 to communicate with the Nano SIM card 3 through the card connector 11; 2 The first NM card 4 is installed, and when the first NM card 4 is inserted into the card holder assembly 10, the interface controller 205 controls the second memory card controller 206 to communicate with the first NM card 4 via the card connector 11; 2 The two-in-one card 7 is installed, and when the two-in-one card 7 is inserted into the card holder assembly 10, the interface controller 205 controls the memory card controller 201 and the SIM card controller 202 to communicate with the two-in-one card 7 via the card connector 11 .
  • the interface controller 205 may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor 20 is switched, so as to realize communication requirements in different scenarios.
  • Interface controller 205 may also include multiple wires.
  • FIG. 26B For an exemplary solution of the interface controller 205, reference may be made to FIG. 26B , which will not be repeated here.
  • the switch 203 may be a part of the interface controller 205 .
  • the two-in-one card 7 arranges a high-speed signal (such as NM RX+) on the first gold finger 721, because the first gold finger 721 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM All the golden fingers of the card 4 have no positional correspondence, so no matter whether the information card inserted into the electronic device is a two-in-one card 7, a Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch to the first shrapnel battery.
  • the connected interface can simplify the circuit of the processor 20 and reduce design difficulty and cost.
  • the two-in-one card 7 arranges the second power signal (NM VCCQ) of the memory card on the second gold finger 722, because the second gold finger 722 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM card 4 All gold fingers have no position correspondence, and the second gold finger 722 of the two-in-one card 7 does not need to be the same shrapnel as the card connector 11 of the Nano SIM card 3 and the first NM card 4 multiplexing electronic device, so as to avoid memory card
  • the second power signal (NM VCCQ) shares the same shrapnel with the data signals of the Nano SIM card 3 and the first NM card 4, so as to reduce the risk of the Nano SIM card 3 and the first NM card 4 being inserted into the electronic device and connected to the card connector 11.
  • the electronic equipment is compatible with the Nano SIM card 3 and the first NM card 4 and the reliability of the two-in-one card 7 is relatively high.
  • the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design for preventing the circuit from being burned by the second power signal (NM VCCQ) of the memory card, which can reduce costs.
  • FIG. 27 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 supports the PCIE interface protocol.
  • PCIE also known as PCI Express
  • PCI Express is a layered protocol consisting of a transaction layer, a data link layer, and a physical layer. Its main advantage is the high data transmission rate, and it also has the advantages of strong anti-interference ability, long transmission distance, and low power consumption.
  • the transmission mode of PCI Express is changed from PCI parallel to serial, by using differential transmission. This transmission method transmits the same content through one positive and one negative mirror to improve the efficiency of interference detection and correction, and PCI Express can use full duplex, so the transmission efficiency of PCI Express is greatly improved compared with PCI.
  • PCI Express Since 2001, PCI Express has been updated from version 1.0 to version 5.0 in 20 years, and will be officially updated to version 6.0 in 2021. There is no doubt that PCI Express is a popular transmission bus standard. For PCIE1.0, the bandwidth is nearly twice that of PCI, and the bandwidth of PCI Express6.0, which is planned to be released in 2021, can reach up to 256GB/s. In 2018, the SD Association officially announced that SD (Secure Digital) cards are compatible with PCI Express channels, and that PCI Express is compatible with mobile memory cards has become a reality. For NM cards, PCI Express has the advantage of providing large bandwidth.
  • SD Secure Digital
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • the first gold fingers 721 to tenth gold fingers 7210 one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card, one of the gold fingers is used to transmit the clock signal (SIM CLK) of the SIM card, and four of them
  • One gold finger is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-)
  • one of the gold fingers is used to transmit the second power signal of the memory card (NM VDD2)
  • one of the golden fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND)
  • one of the golden fingers is used to transmit the power signal of the SIM card (
  • the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+ , NM TX-).
  • the second gold finger 722 is used to transmit data signals (NM RX-)
  • the fifth gold finger 725 is used to transmit data signals (NM RX+)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the fifth gold finger 725 is used to transmit data signals (NM TX+).
  • Ten golden fingers 7210 are used to transmit data signals (NM TX-), as an example for illustration.
  • the data signals transmitted by the second gold finger 722 , the fifth gold finger 725 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the second gold finger 722 and the fifth gold finger 725 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the first gold finger 721 is used to transmit the second power signal (NM VDD2) of the memory card; the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock of the SIM card signal (SIM CLK); the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card and the reference clock signal (NM RCLK) of the memory card; the seventh golden finger 727 is used to transmit the ground signal (SIM RST) of the SIM card GND) and the ground signal (NM GND) of the memory card; the eighth golden finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VDD1) of the memory card.
  • Table 7 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the two-in-one card 7 shown in FIG. 27 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VDD2), a reference clock interface (RCLK), a ground interface (GND) and a first power supply interface (VDD1).
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card.
  • the second power supply interface (VDD2) is used to transmit the second power supply signal (NM VDD2) of the memory card
  • the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VDD1) of the memory card circuit 712 is used to transmit the first power signal (NM VDD1) of the memory card.
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+, TX-), the first gold finger 721 is electrically connected to the second power interface (VDD2) of the memory card circuit 712, the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, and the fourth gold finger 724 is electrically connected to the SIM The clock interface (CLK) of the card circuit 713, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713 and the reference clock interface (RCLK) of the memory card circuit 712 through the switching circuit 714, and the seventh gold finger 727 is electrically connected Connect the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712, and the eighth golden finger 728 is electrically connected to the power interface (
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the second gold finger 722, the fifth gold finger 725, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the five gold fingers 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to be designed to switch the connection circuit between the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the first gold finger 721, the third gold finger 723, and the fourth gold finger 724 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the two The design difficulty of the internal circuit of the all-in-one card 7 is low and easy to realize.
  • the switching circuit 714 is configured to detect the signal transmitted by the sixth gold finger 726 and implement corresponding switching. For example, if the switching circuit 714 detects that the signal transmitted by the sixth gold finger 726 is the reset signal (SIM RST) of the SIM card, then the reset interface (RST) between the sixth gold finger 726 and the SIM card circuit 713 is turned on. At this time, the sixth gold finger 726 is disconnected from the reference clock interface (RCLK) of the memory card circuit 712 . If the switching circuit 714 detects that the signal transmitted by the sixth golden finger 726 is the reference clock signal (NM RCLK) of the memory card, then the reference clock interface (RCLK) between the sixth golden finger 726 and the memory card circuit 712 is turned on. At this moment, the reset interface (RST) of the sixth gold finger 726 and the SIM card circuit 713 is in a disconnected state.
  • SIM RST reset signal
  • RST reset interface
  • the two-in-one card 7 realizes the transmission switching of the two-way signals through the switching circuit 714, so that the reset signal (SIM RST) of the SIM card and the reference clock interface (RCLK) of the memory card circuit 712 can pass through the sixth
  • the gold finger 726 realizes the transmission, so that the card interface 72 of the two-in-one card 7 has a high degree of integration, and the connection circuit switching difficulty with the interface of the SIM card circuit 713 and the interface of the memory card circuit 712 is low and easy to implement, making the two-in-one card 7 Card 7 has high reliability.
  • the default state of the switching circuit 714 can be set to conduct the reference clock interface (RCLK) of the sixth golden finger 726 and the memory card circuit 712, and the sixth golden finger 726 The reset interface (RST) with the SIM card circuit 713 is disconnected.
  • RCLK reference clock interface
  • the reset operation of the SIM card is not frequently operated, and the reset process can be completed very quickly.
  • Interface RST to ensure the user's networking experience.
  • the sixth golden finger 726 switches back to the memory card circuit 712 to continue to complete the read and write operations, thereby improving the performance of the two-in-one card. 7 work efficiency.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • FIG. 28A is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 27 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a switch 203, a power interface, and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal of the SIM card (SIM VCC) or the first power signal of the memory card (NM VDD1)
  • the ground signal can be the ground signal of the memory card (NM GND) or the ground signal of the SIM card (SIM GND ).
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the SIM card controller 202 includes a reset interface (RST), and the reset interface (RST) is used to transmit a reset signal (SIM RST) of the SIM card.
  • the switch 203 can be connected to one interface of the SIM card controller 202 including the reset interface (RST) and the memory card controller 201 , and the switch 203 is also connected to one of the ten elastic pieces of the card connector 11 .
  • the reset operation of the SIM card circuit of the two-in-one card 7 is not frequently operated, and the reset process can be completed very quickly, when the reset interface (RST) and one of the interfaces of the memory card controller 201 multiplex the same
  • the shrapnel can be fully utilized for signal transmission through time-division multiplexing.
  • the card controller 202 includes a reset interface (RST) to ensure the user's networking experience.
  • the shrapnel is switched back to the conductive memory card controller 201 to continue Complete the read and write operations on the two-in-one card 7, thereby improving the work efficiency of the electronic equipment.
  • the memory card controller 201 supports the PCIE interface protocol.
  • Memory card controller 201 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VDD2) and a reference clock interface (RCLK), four data interfaces (RX+, RX-, TX+, TX -) Used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), the second power interface (VDD2) is used to transmit the second power signal of the memory card (NM VDD2), the reference clock The interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card.
  • SIM card controller 202 also includes data interface (DATA) and clock interface (CLK), and data interface (DATA) is used to transmit the data signal (SIM DATA) of SIM card, and clock interface (CLK) is used to transmit the clock signal of SIM card (SIM CLK).
  • DATA data interface
  • CLK clock interface
  • the switch is also connected to the reference clock interface (RCLK) of the memory card controller 201, and seven of the ten elastic pieces of the card connector 11 are connected to the four data interfaces (RX+, RX-, TX+, TX-), the second power interface (VDD2) of the memory card controller 201, the data interface (DATA) of the SIM card controller 202 and the data interface (DATA) of the SIM card controller 202.
  • RCLK reference clock interface
  • DATA data interface
  • DATA data interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are respectively electrically connected to the second elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11, and the storage
  • the second power interface ( VDD2 ) of the card controller 201 is electrically connected to the first elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the fourth elastic piece of the card connector 11 .
  • the switch 203 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the reset interface (RST) of the SIM card controller 202 , and the switch 203 is also connected to the sixth shrapnel of the card connector 11 .
  • the switch 203 is used to connect the sixth elastic piece to the reference clock interface (RCLK) of the memory card controller 201 , or to connect the sixth elastic piece to the reset interface (RST) of the SIM card controller 202 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the second elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the transmission of the power signal (NM VDD2) is through the transmission of the reference clock signal (NM RCLK) of the memory card between the sixth shrapnel and the two-in-one card 7;
  • the power interface of the processor 20 is connected to the two-in-one card through the eighth shrapnel 7 to transmit the first power signal (NM VDD1) of the memory card, and the ground interface to transmit the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 Realize data storage function.
  • the control switch 203 conducts the reference clock interface (RCLK) of the memory card controller 201 and the sixth shrapnel, and the sixth shrapnel sends a signal to the sixth golden finger 726 of the two-in-one card 7 , the switching circuit 714 connected to the sixth gold finger 726 recognizes that the transmission signal or the signal to be transmitted is the reference clock signal (NM RCLK) of the memory card, and the switching circuit 714 conducts the reference clock interface of the sixth gold finger 726 and the memory card circuit 712 ( RCLK) to realize the transmission of the reference clock signal (NM RCLK) of the memory card.
  • RCLK reference clock interface
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the processor 20 controls the switch 203 to conduct the reset interface (RST) of the SIM card controller 202 and the sixth shrapnel, and the sixth shrapnel Send the signal to the sixth gold finger 726 of the two-in-one card 7, the switching circuit 714 connected to the sixth gold finger 726 identifies the transmission signal or the signal to be transmitted as the reset signal (SIM RST) of the SIM card, and the switching circuit 714 is turned on to the sixth gold finger 726.
  • Gold finger 726 and the reset interface (SIM RST) of SIM card circuit 713 to realize the transmission of the reset signal (SIM RST) of SIM card, control SIM card circuit 713 to reset.
  • the reset operation of the SIM card is not frequently operated, and the reset process can be completed quickly.
  • the sixth gold finger 726 of the two-in-one card 7 is first connected to the reset of the SIM card. Interface (RST) to ensure the user's networking experience.
  • RST Interface
  • the sixth golden finger 726 switches back to the memory card circuit 712 to continue to complete the read and write operations, thereby improving the performance of the two-in-one card. 7 work efficiency.
  • the signal arrangement of the card interface 72 of the 2-in-1 card 7 may be arranged in other ways.
  • the first gold finger 721 is used to transmit one of the data signals (such as NM RX-) of the memory card
  • the second gold finger 722 is used to transmit the second power signal (NM VDD2) of the memory card
  • the first gold finger 721 of the two-in-one card 7 is connected to one of the data interfaces (such as RX-) of the memory card circuit 712
  • the second gold finger 722 is electrically connected to the second power interface (VDD2) of the memory card circuit 712.
  • connection circuit between other interfaces and the golden finger remains unchanged; one of the data interfaces (such as RX-) of the memory card controller 201 of the electronic device is electrically connected to the first shrapnel, and the second power interface (VDD2) of the memory card controller 201 is electrically connected to The connection circuit between the second elastic piece and the other interfaces and the elastic piece of the card connector 11 remains unchanged; the work flow of the two-in-one card 7 and the electronic device is adaptively adjusted, and will not be repeated here.
  • Table 8 is a table of corresponding relations between multiple shrapnels of the card connector 11 and multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 27 and their transmission signals .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the data interface (such as RX+) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The data interface (such as RX+) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • FIG. 28B is a schematic diagram of a partial circuit structure of an electronic device provided by an embodiment of the present application in other embodiments.
  • the electronic device in this embodiment may include most of the technical content of the electronic device corresponding to FIG. 28A , and the differences between the two will be mainly described below.
  • the electronic device is compatible with the Nano SIM card 3, the first NM card 4 and the two-in-one card 7 shown in FIG. 27 .
  • the processor 20 of the electronic device includes a memory card controller 201, a second memory card controller 206, a SIM card controller 202, and an interface controller 205, and the interface controller 205 is electrically connected to the memory card controller 201, the second memory card
  • the controller 206 and the SIM card controller 202 and the interface controller 205 are also electrically connected to multiple elastic pieces of the card connector 11 .
  • the interface protocol (such as the EMMC interface protocol) of the memory card controller 201 can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller 202 is used to control the Nano The SIM card 3 runs, and the interface protocol (such as the PCIE interface protocol) of the second memory card controller 206 can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface protocol such as the PCIE interface protocol
  • the interface controller 205 can control the SIM card controller 202 to communicate with the information card via the card connector 11, or the memory card controller 201
  • the SIM card controller 202 communicates with the information card via the card connector 11, or the second memory card controller 206 communicates with the information card via the card connector 11.
  • the interface controller 205 controls the SIM card controller 202 to communicate with the Nano SIM card 3 through the card connector 11; 2 The first NM card 4 is installed, and when the first NM card 4 is inserted into the card holder assembly 10, the interface controller 205 controls the second memory card controller 206 to communicate with the first NM card 4 via the card connector 11; 2 The two-in-one card 7 is installed, and when the two-in-one card 7 is inserted into the card holder assembly 10, the interface controller 205 controls the memory card controller 201 and the SIM card controller 202 to communicate with the two-in-one card 7 via the card connector 11 .
  • the interface controller 205 may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor 20 is switched, so as to realize communication requirements in different scenarios.
  • Interface controller 205 may also include multiple wires.
  • FIG. 28B For an exemplary solution of the interface controller 205, reference may be made to FIG. 28B , which will not be repeated here.
  • the switch 203 may be a part of the interface controller 205 .
  • the two-in-one card 7 arranges the second power supply signal (NM VDD2) of the memory card on the first gold finger 721, because the first gold finger 721 of the two-in-one card 7 is connected to the Nano SIM card 3 and All gold fingers of the first NM card 4 have no position correspondence, and the first gold finger 721 of the two-in-one card 7 does not need to be the same as the card connector 11 of the Nano SIM card 3 and the first NM card 4 multiplexing electronic device.
  • NM VDD2 the second power supply signal of the memory card
  • the shrapnel prevents the second power signal (NM VDD2) of the memory card from sharing the same shrapnel with the data signals of the Nano SIM card 3 and the first NM card 4, so as to reduce the insertion and connection of the Nano SIM card 3 and the first NM card 4 into the electronic device.
  • the card connector 11 When the card connector 11 is used, the risk of being burned out by the second power signal (NM VDD2) of the memory card, the electronic equipment is compatible with the Nano SIM card 3 and the first NM card 4 and the reliability of the two-in-one card 7 is higher.
  • the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design for preventing the circuit from being burned by the second power signal (NM VDD2 ) of the memory card, which can reduce costs.
  • the two-in-one card 7 arranges a high-speed signal (for example, NM RX-) on the second gold finger 722, because the second gold finger 722 of the two-in-one card 7 is connected to all the gold fingers of the Nano SIM card 3 and the first NM card 4 Fingers have no position correspondence, so no matter whether the information card inserted in the electronic device is a two-in-one card 7, a Nano SIM card 3 or a first NM card 4, the processor 20 does not need to switch the interface electrically connected to the second shrapnel, thereby The circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.
  • a high-speed signal for example, NM RX-
  • FIG. 29 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 adopts the EMMC interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the gold fingers is used to transmit the reset signal of the SIM card (SIM RST)
  • four of them are
  • One gold finger is used to transmit the data signal of the memory card (NM DATA0, NM DATA1, NM DATA2, NM DATA3)
  • one of the gold fingers is used to transmit the command and response signal of the memory card (NM CMD)
  • one of the gold fingers is used for Transmit the clock signal of the SIM card (SIM CLK) and the clock signal of the memory card (NM CLK)
  • one of the gold fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND)
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit the data signals of the memory card (NM DATA0, NM DATA1, NM DATA3 , NM DATA2).
  • the first gold finger 721 is used to transmit data signals (NM DATA0)
  • the second gold finger 722 is used to transmit data signals (NM DATA1)
  • the ninth gold finger 729 is used to transmit data signals (NM DATA3)
  • the second gold finger 722 is used to transmit data signals (NM DATA3).
  • Ten golden fingers 7210 are used to transmit data signals (NM DATA2), as an example to illustrate.
  • the data signals transmitted by the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card and the clock signal (NM CLK) of the memory card; the fifth gold finger 725 Used to transmit the command and response signal (NM CMD) of the memory card; the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card; the seventh golden finger 727 is used to transmit the ground signal (SIM GND) of the SIM card and the ground signal (NM GND) of the memory card; the eighth golden finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the power signal (NM VCC) of the memory card.
  • Table 9 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the two-in-one card 7 shown in FIG. 29 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (DATA0, DATA1, DATA2, DATA3), a clock interface (CLK), a command and response multiplexing interface (CMD), a ground interface (GND) and a power interface (VCC ).
  • DATA0, DATA1, DATA2, DATA3 a clock interface
  • CMD command and response multiplexing interface
  • GND ground interface
  • VCC power interface
  • DATA0, DATA1, DATA2, DATA3 of the memory card circuit 712 are used to transmit the data signals (NM DATA0, NM DATA1, NM DATA2, NM DATA3) of the memory card, and the clock interface (CLK) of the memory card circuit 712
  • the command of the memory card circuit 712 and the response multiplexing interface (CMD) are used for transmitting the command of the memory card and the response signal (NM CMD)
  • the ground interface of the memory card circuit 712 ( GND) is used to transmit the ground signal (NM GND) of the memory card
  • the power interface (VCC) of the memory card circuit 712 is used to transmit the power signal (NM VCC) of the memory card.
  • the interface of the above-mentioned memory card circuit 712 may be located in the control part of the memory card circuit 712 .
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the interface of the above-mentioned SIM card circuit 713 may be located in the control part of the SIM card circuit 713 .
  • the two-in-one card 7 also includes a frequency divider 715 .
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (DATA0, DATA1, DATA3, DATA2) of the memory card circuit 712
  • the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713
  • the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the memory card circuit 712, and is electrically connected to the SIM card circuit 713 through the frequency divider 715.
  • the clock interface (CLK), the fifth gold finger 725 is electrically connected to the command and response multiplexing interface (CMD) of the memory card circuit 712
  • the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713
  • the seventh gold finger 727 The ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712 are electrically connected
  • the eighth golden finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the power interface (VCC) of the memory card circuit 712 ( VCC).
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the first gold finger 721, The second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 do not need to switch the connection circuit design of the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the third gold finger 723, the fifth gold finger 725, and the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712.
  • the internal circuit design of One Card 7 is less difficult and easy to implement.
  • the frequency divider 715 is used to change the frequency of the signal.
  • the initial clock signal transmitted by the fourth gold finger 724 can be the clock signal (NM CLK) of the memory card, and the clock signal (NM CLK) of the memory card is directly transmitted to the memory card.
  • the clock interface (CLK) of card circuit 712, frequency divider 715 carries out frequency adjustment to the clock signal (NM CLK) of memory card, forms the clock signal (SIM CLK) of SIM card, then the clock signal (SIM CLK) of SIM card
  • the frequency of the clock signal (NM CLK) of the memory card is 200MHz, and through the frequency divider 715, the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the two-in-one card 7 can realize the multiplexing of the clock signal (NM CLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 through the same gold finger (that is, the fourth gold finger 724). , so that the integration of the card interface 72 of the two-in-one card 7 is high, and the fourth golden finger 724 does not need to switch the connection circuit, the realization difficulty of the two-in-one card 7 is low and easy to implement, which makes the reliability of the two-in-one card 7 high.
  • the clock signal (NM CLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 can time-division multiplex the fourth golden finger 724, and can also use the fourth golden finger 724 synchronously, which is not strictly limited in the present application.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • FIG. 30 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 29 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a frequency divider 204, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal (SIM VCC) of the SIM card or the power signal (NM VCC) of the memory card
  • the ground signal can be the ground signal (NM GND) of the memory card or the ground signal (SIM GND) of the SIM card.
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the memory card controller 201 supports the EMMC interface protocol, and the memory card controller 201 includes a clock interface (CLK), and the clock interface (CLK) is used to transmit a clock signal (NM CLK) of the memory card.
  • the SIM card controller 202 includes a clock interface (CLK), and the clock interface (CLK) is used to transmit the clock signal (SIM CLK) of the SIM card.
  • the clock interface (CLK) of the memory card controller 201 is connected to one of the ten shrapnels of the card connector 11, and the clock interface (CLK) of the memory card controller 201 is connected to the clock interface of the SIM card controller 202 through the frequency divider 204 (CLK).
  • the frequency divider 204 connects the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and the frequency divider 204 is used for the clock interface of the memory card controller 201
  • the clock signal (NM CLK) of the memory card that (CLK) transmits carries out frequency adjustment, forms the clock signal (SIM CLK) of SIM card, and transmits with the clock interface (CLK) of SIM card controller 202, makes SIM card controller 202 implements clock alignment with the memory card controller 201.
  • the frequency of the clock signal (NM CLK) of the memory card is 200MHz, and through the frequency divider 204, the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the processor 20 of the electronic device provides the clock signal (NM CLK) of the memory card through one of the shrapnels of the card connector 11, thereby providing the required clock signal for the two-in-one card 7, at the same time, the clock interface of the memory card controller 201 (CLK) is connected to the clock interface (CLK) of the SIM card controller 202 through the frequency divider 204, so that the clock of the SIM card controller 202 can be aligned with the memory card controller 201, to improve the communication between the electronic equipment and the two-in-one card 7 efficiency and communication quality.
  • CLK clock interface of the memory card controller 201
  • the memory card controller 201 supports the EMMC interface protocol.
  • the memory card controller 201 also includes four data interfaces (DATA0, DATA1, DATA2, DATA3) and a command and response multiplexing interface (CMD), and the four data interfaces (DATA0, DATA1, DATA2, DATA3) are used to transmit data of the memory card.
  • Data signal (NM DATA0, NM DATA1, NM DATA2, NM DATA3), command and response multiplexing interface (CMD) is used to transmit memory card command and response signal (NM CMD).
  • the SIM card controller 202 also includes a reset interface (RST) and a data interface (DATA), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit the data signal of the SIM card (SIM DATA).
  • RST reset interface
  • DATA data interface
  • seven of the ten shrapnels of the card connector 11 are connected to the four data interfaces (DATA0, DATA1, DATA3, DATA2) of the memory card controller 201, and the command and response complexes of the memory card controller 201 in one-to-one correspondence.
  • a user interface (CMD) a data interface (DATA) of the SIM card controller 202 and a reset interface (RST) of the SIM card controller 202.
  • the four data interfaces (DATA0, DATA1, DATA3, DATA2) of the memory card controller 201 are electrically connected to the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11 in one-to-one correspondence
  • the clock interface (CLK) of the memory card controller 201 is electrically connected to the fourth elastic piece of the card connector 11
  • the command and response multiplexing interface (CMD) of the memory card controller 201 is electrically connected to the fifth elastic piece of the card connector.
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the data signal (NM DATA0, NM DATA1, NM DATA3, NM DATA2) of the memory card is transmitted between the two-in-one card 7, and the command and response signal of the memory card is carried out between the fifth shrapnel and the two-in-one card 7 (NM CMD) transmission, through the transmission of the clock signal (NM CLK) of the memory card between the fourth shrapnel and the two-in-one card 7; Carry out the transmission of the power signal (NM VCC) of the memory card, carry out the transmission of the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7 through the ground interface, and the two-in-one card 7 realizes the data storage function.
  • the SIM card controller 202 When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 is working, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM The card controller 202 carries out the transmission of the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7; The transmission of the power signal (SIM VCC), the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • SIM DATA data signal
  • SIM VCC power signal
  • SIM GND ground signal
  • the SIM card controller 202 when the electronic equipment needs to reset the SIM card circuit 713 of the two-in-one card 7, the SIM card controller 202 performs the reset signal (SIM RST) of the SIM card between the sixth shrapnel and the two-in-one card 7. transmission, and control the SIM card circuit 713 to reset.
  • SIM RST reset signal
  • the frequency divider 204 may not be set in the processor 20
  • the frequency divider 715 may not be set in the two-in-one card 7 .
  • the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11 .
  • the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 of the card interface 72 .
  • the memory card controller 201 sends the clock signal (NM CLK) of the memory card to the fourth golden finger 724 through the fourth elastic piece, and the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth golden finger through the fourth elastic piece. 724.
  • the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signal, that is, only process the clock signal that the circuit can recognize.
  • the memory card circuit 712 processes the clock signal (NM CLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only the SIM card
  • the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card; when the signal transmitted by the fourth gold finger 724 has the clock signal (NM CLK) of the memory card and the clock signal of the SIM card (SIM CLK)
  • the memory card circuit 712 processes the clock signal (NM CLK) of the memory card, such as collecting signals above 100MHz
  • the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card, such as collecting signals below 5MHz.
  • the frequency divider 204 may not be set in the processor 20, and the frequency divider 715 may not be set in the combo card 7, so that the frequency of the clock signal (SIM CLK) of the SIM card is increased to and stored
  • the frequency of the clock signal (NM CLK) of the card is the same, for example, the clock signal (SIM CLK) of the SIM card is raised to the 19.2MHz frequency or 20MHz frequency required by the clock signal (NM CLK) of the memory card, so as to realize the frequency of the clock shared.
  • the clock interface (CLK) of the memory card controller 201 is electrically connected to the clock interface (CLK) of the SIM card controller 202 , and one of the clock interfaces is electrically connected to the fourth elastic piece of the card connector 11 .
  • the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the frequency divider 204 in the processor 20 may be replaced with a switch, and the frequency divider 715 may not be provided in the two-in-one card 7 .
  • the switch connects the clock interface (CLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and also connects the fourth shrapnel; , the clock interface (CLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the electronic device provides the clock signal of the memory card and the clock signal of the SIM card through the time division multiplexing of the same shrapnel.
  • the processor 20 When there is a SIM card service, it provides the clock signal of the SIM card, and when there is a memory card service, it provides the clock signal of the memory card. In some cases, if the clock signal of the SIM card and the clock signal of the memory card are the same, the same clock signal can be provided. In some cases, if the SIM card and the memory card have services at the same time, the clock signal of the SIM card can be provided first, and the clock signal of the memory card will be resumed after the SIM card ends the service. In some other embodiments, in the solution where the processor 20 replaces the frequency divider 204 with a switch, the frequency divider 715 in the 2-in-1 card 7 may also be replaced with a switch.
  • Table 10 is a table of corresponding relations between multiple shrapnels of the card connector 11 and multiple golden fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 29 and their transmission signals .
  • the two-in-one card 7 is connected to the card connector 11, the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence. 7210, the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • VPP programming voltage/input signal interface
  • CMD command and response multiplexing interface
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The command and response multiplexing interface (CMD) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • CMD command and response multiplexing interface
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 29 .
  • the processor of the electronic device may include a memory card controller, a SIM card controller, and an interface controller.
  • the interface controller is electrically connected to the memory card controller and the SIM card controller. shrapnel.
  • the interface protocol (such as EMMC interface protocol) of the memory card controller can communicate with the memory card circuit of the first NM card 4 and the two-in-one card 7, for controlling the storage of the first NM card 4 operation and control two-in-one card 7
  • the card circuit runs, and the SIM card controller 202 is used to control the Nano SIM card 3 to run.
  • the interface controller can control the memory card controller and/or the SIM card controller to communicate with the information card via the card connector.
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the card tray 2 is installed There is a first NM card 4, and when the first NM card 4 is inserted into the deck assembly 10, the interface controller controls the memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • FIG. 31 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 supports the UFS interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the gold fingers is used to transmit the reset signal of the SIM card (SIM RST)
  • four of them are
  • One gold finger is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-)
  • one of the gold fingers is used to transmit the second power signal of the memory card (NM VCCQ)
  • NM VCCQ the second power signal of the memory card
  • one of the gold fingers It is used to transmit the clock signal of the SIM card (SIM CLK) and the reference clock signal of the memory card (NM RCLK), and one of the gold fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+ , NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the fifth gold finger 725 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the fifth gold finger 725 is used to transmit data signals (NM TX+).
  • Ten golden fingers 7210 are used to transmit data signals (NM TX-), as an example for illustration.
  • the data signals transmitted by the first gold finger 721 , the fifth gold finger 725 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the fifth gold finger 725 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card and the reference clock signal (NM RCLK) of the memory card;
  • the finger 722 is used to transmit the second power signal (NM VCCQ) of the memory card;
  • the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card;
  • the seventh golden finger 727 is used to transmit the ground signal (SIM RST) of the SIM card. GND) and the ground signal (NM GND) of the memory card; the eighth gold finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VCC) of the memory card.
  • Table 11 is a schematic diagram of the corresponding relationship between the golden finger and the circuit interface of the two-in-one card 7 shown in FIG. 31 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a reference clock interface (RCLK), a second power interface (VCCQ), a ground interface (GND) and a first power supply Interface (VCC).
  • RX+, RX-, TX+, TX- a reference clock interface
  • VCCQ second power interface
  • GND ground interface
  • VCC first power supply Interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card, the reference of the memory card circuit 712
  • the clock interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the second power interface (VCCQ) of the memory card circuit 712 is used to transmit the second power signal (NM VCCQ) of the memory card.
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card, and the first power interface (VCC) of the memory card circuit 712 is used to transmit the first power signal (NM VCC) of the memory card.
  • the interface of the above-mentioned memory card circuit 712 may be located in the control part of the memory card circuit 712 .
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the interface of the above-mentioned SIM card circuit 713 may be located in the control part of the SIM card circuit 713 .
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+, TX-), the second gold finger 722 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712, the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, and the fourth gold finger 724 is electrically connected to the storage
  • the reference clock interface (CLK) of the card circuit 712 is electrically connected to the clock interface (CLK) of the SIM card circuit 713 through the frequency divider 715, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, and the seventh
  • the gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712
  • the eighth gold finger 728 is
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the five gold fingers 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to be designed to switch the connection circuit between the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the second gold finger 722, the third gold finger 723 and the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the two The design difficulty of the internal circuit of the all-in-one card 7 is low and easy to implement.
  • the frequency divider 715 is used to change the frequency of the signal.
  • the initial clock signal transmitted by the fourth gold finger 724 can be the reference clock signal (NM RCLK) of the memory card, and the reference clock signal (NM RCLK) of the memory card is directly transmitted
  • the frequency divider 715 carries out frequency adjustment to the reference clock signal (NM RCLK) of the memory card to form the clock signal (SIM CLK) of the SIM card, and then the clock signal of the SIM card (SIM CLK) is transmitted to the clock interface (CLK) of SIM card circuit 713.
  • the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz
  • the frequency divider 715 the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the two-in-one card 7 can realize the multiplexing of the reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 through the same gold finger (that is, the fourth gold finger 724).
  • the integration of the card interface 72 of the two-in-one card 7 is high, and the fourth gold finger 724 does not need to switch the connection circuit. high sex.
  • the reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 can time-division multiplex the fourth gold finger 724, and can also use the fourth gold finger 724 synchronously, which is not strictly limited in this application .
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • FIG. 32 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 31 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a frequency divider 204, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal (SIM VCC) of the SIM card or the first power signal (NM VCC) of the memory card
  • the ground signal can be the ground signal (NM GND) of the memory card or the ground signal (SIM GND) of the SIM card.
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the memory card controller 201 supports the UFS interface protocol.
  • the memory card controller 201 includes a reference clock interface (RCLK), and the reference clock interface (RCLK) is used to transmit a reference clock signal (NM RCLK) of the memory card.
  • the SIM card controller 202 includes a clock interface (CLK), and the clock interface (CLK) is used to transmit the clock signal (SIM CLK) of the SIM card.
  • the reference clock interface (RCLK) of the memory card controller 201 is connected to one of the ten shrapnels of the card connector 11, and the reference clock interface (RCLK) of the memory card controller 201 is connected to the SIM card controller 202 through the frequency divider 204.
  • Clock interface (CLK) Clock interface
  • the frequency divider 204 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and the frequency divider 204 is used for reference of the memory card controller 201
  • the reference clock signal (NM RCLK) of the memory card that the clock interface (RCLK) transmits carries out frequency adjustment, forms the clock signal (SIM CLK) of SIM card, and transmits with the clock interface (CLK) of SIM card controller 202, makes SIM
  • the card controller 202 implements clock alignment with the memory card controller 201 .
  • the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz, and through the frequency divider 204, the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the processor 20 of the electronic device provides the reference clock signal (NM RCLK) of the memory card through one of the shrapnels of the card connector 11, thereby providing the required clock signal for the two-in-one card 7, at the same time, the reference clock signal of the memory card controller 201
  • the clock interface (RCLK) is connected to the clock interface (CLK) of the SIM card controller 202 through the frequency divider 204, so that the clock of the SIM card controller 202 can be aligned with the memory card controller 201, to improve the electronic equipment and the two-in-one card 7 Communication efficiency and communication quality.
  • the memory card controller 201 also includes four data interfaces (RX+, RX-, TX+, TX-) and a second power interface (VCCQ), four data interfaces (RX+, RX-, TX+, TX-) It is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), and the second power interface (VCCQ) is used to transmit the second power signal of the memory card (NM VCCQ).
  • RX+, RX-, TX+, TX- a second power interface
  • VCCQ second power interface
  • the SIM card controller 202 also includes a reset interface (RST) and a data interface (DATA), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit the data signal of the SIM card (SIM DATA).
  • RST reset interface
  • DATA data interface
  • seven of the ten elastic pieces of the card connector 11 are connected to the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201, the second A power interface (VCCQ), a data interface (DATA) of the SIM card controller 202 and a reset interface (RST) of the SIM card controller 202 .
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are electrically connected to the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11 in one-to-one correspondence.
  • the elastic piece, the second power interface (VCCQ) is electrically connected to the second elastic piece of the card connector 11
  • the reference clock interface (RCLK) is electrically connected to the fourth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the transmission of the power signal (NM VCCQ) is through the transmission of the reference clock signal (NM RCLK) of the memory card between the fourth shrapnel and the two-in-one card 7;
  • the power interface of the processor 20 is connected to the two-in-one card through the eighth shrapnel 7 to transmit the first power signal (NM VCC) of the memory card, and the ground interface to transmit the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 Realize data storage function.
  • the SIM card controller 202 When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 is working, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM The card controller 202 carries out the transmission of the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7; The transmission of the power signal (SIM VCC), the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • SIM DATA data signal
  • SIM VCC power signal
  • SIM GND ground signal
  • the SIM card controller 202 when the electronic equipment needs to reset the SIM card circuit 713 of the two-in-one card 7, the SIM card controller 202 performs the reset signal (SIM RST) of the SIM card between the sixth shrapnel and the two-in-one card 7. transmission, and control the SIM card circuit 713 to reset.
  • SIM RST reset signal
  • the frequency divider 204 may not be set in the processor 20
  • the frequency divider 715 may not be set in the two-in-one card 7 .
  • the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11 .
  • the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth gold finger 724 of the card interface 72 .
  • the memory card controller 201 sends the reference clock signal (NM RCLK) of the memory card to the fourth golden finger 724 through the fourth shrapnel, and the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth golden finger through the fourth shrapnel.
  • the finger 724, the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signal, that is, only process the clock signal that the circuit can recognize.
  • the memory card circuit 712 processes the reference clock signal (NM RCLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only During the clock signal (SIM CLK) of SIM card, SIM card circuit 713 processes the clock signal (SIM CLK) of SIM card; When the clock signal (SIM CLK) of the SIM card is used, the memory card circuit 712 processes the reference clock signal (NM RCLK) of the memory card, such as collecting signals above 100MHz, and the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card, such as collecting 5MHz the following signals.
  • the frequency divider 204 may not be set in the processor 20, and the frequency divider 715 may not be set in the combo card 7, so that the frequency of the clock signal (SIM CLK) of the SIM card is increased to and stored
  • the frequency of the reference clock signal (NM RCLK) of the card is the same, for example, the clock signal of the SIM card (SIM CLK) is raised to the 19.2MHz frequency or 20MHz frequency required by the reference clock signal (NM RCLK) of the memory card to achieve Sharing of clocks.
  • the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the clock interface (CLK) of the SIM card controller 202 , and one of the clock interfaces is electrically connected to the fourth elastic piece of the card connector 11 .
  • the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the frequency divider 204 in the processor 20 may be replaced with a switch, and the frequency divider 715 may not be provided in the two-in-one card 7 .
  • the switch connects the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and also connects the fourth shrapnel; the two-in-one card 7 Among them, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the electronic device provides the reference clock signal of the memory card and the clock signal of the SIM card through the same shrapnel time division multiplexing.
  • SIM card service When there is a SIM card service, it provides the clock signal of the SIM card.
  • memory card service When there is a memory card service, it provides the reference clock of the memory card. Signal.
  • the clock signal of the SIM card and the reference clock signal of the memory card are the same, the same clock signal can be provided.
  • the clock signal of the SIM card can be provided first, and the reference clock signal of the memory card will be resumed after the SIM card ends the service.
  • the frequency divider 715 in the 2-in-1 card 7 may also be replaced with a switch.
  • the signal arrangement of the card interface 72 of the 2-in-1 card 7 may be arranged in other ways.
  • the first gold finger 721 is used to transmit the second power signal (NM VCCQ) of the memory card
  • the second gold finger 722 is used to transmit one of the data signals (such as NM RX+) of the memory card
  • the signal arrangement of other gold fingers constant.
  • the first gold finger 721 of the two-in-one card 7 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712
  • the second gold finger 722 is connected to one of the data interfaces (such as RX+) of the memory card circuit 712
  • the other The connection circuit between the interface and the golden finger remains unchanged
  • the second power interface (VCCQ) of the memory card controller 201 of the electronic device is electrically connected to the first shrapnel
  • one of the data interfaces (such as RX+) of the memory card controller 201 is electrically connected to the second The shrapnel, other interfaces and the connection circuit of the shrapnel of the card connector 11 remain unchanged
  • the work flow of the two-in-one card 7 and the electronic equipment is adjusted adaptively, and will not be repeated here.
  • Table 12 is a table of corresponding relations between multiple shrapnels of the card connector 11, the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 31 and their transmission signals. .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the data interface (for example, RX-) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The data interface (such as RX-) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 31 .
  • the processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, and the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller.
  • the interface controller is also electrically connected to multiple elastic pieces of the card connector 11.
  • the interface protocol (such as UFS interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller is used to control the Nano SIM card 3
  • the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface controller can control the SIM card controller to communicate with the information card through the card connector 11, or the memory card controller and the SIM card
  • the controller communicates with the information card via the card connector 11
  • the second memory card controller communicates with the information card via the card connector 11 .
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • the two-in-one card 7 arranges a high-speed signal (such as NM RX+) on the first gold finger 721, because the first gold finger 721 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM All the golden fingers of the card 4 have no positional correspondence, so no matter whether the information card inserted into the electronic device is a two-in-one card 7, a Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch to the first shrapnel battery.
  • the connected interface can simplify the circuit of the processor 20 and reduce design difficulty and cost.
  • the two-in-one card 7 arranges the second power signal (NM VCCQ) of the memory card on the second gold finger 722, because the second gold finger 722 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM card 4 All gold fingers have no position correspondence, and the second gold finger 722 of the two-in-one card 7 does not need to be the same shrapnel as the card connector 11 of the Nano SIM card 3 and the first NM card 4 multiplexing electronic device, so as to avoid memory card
  • the second power signal (NM VCCQ) shares the same shrapnel with the data signals of the Nano SIM card 3 and the first NM card 4, so as to reduce the risk of the Nano SIM card 3 and the first NM card 4 being inserted into the electronic device and connected to the card connector 11.
  • the electronic equipment is compatible with the Nano SIM card 3 and the first NM card 4 and the reliability of the two-in-one card 7 is relatively high.
  • the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design for preventing the circuit from being burned by the second power signal (NM VCCQ) of the memory card, which can reduce costs.
  • FIG. 33 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the two-in-one card 7 adopts the PCIE interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the gold fingers is used to transmit the reset signal of the SIM card (SIM RST)
  • four of them are
  • One gold finger is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-)
  • one of the gold fingers is used to transmit the second power signal of the memory card (NM VDD2)
  • one of the gold fingers It is used to transmit the clock signal of the SIM card (SIM CLK) and the reference clock signal of the memory card (NM RCLK), and one of the golden fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+ , NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the fifth gold finger 725 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the fifth gold finger 725 is used to transmit data signals (NM TX+).
  • Ten golden fingers 7210 are used to transmit data signals (NM TX-), as an example for illustration.
  • the data signals transmitted by the first gold finger 721 , the fifth gold finger 725 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the fifth gold finger 725 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card and the reference clock signal (NM RCLK) of the memory card;
  • the finger 722 is used to transmit the second power signal (NM VDD2) of the memory card;
  • the sixth golden finger 726 is used to transmit the reset signal (SIM RST) of the SIM card;
  • the seventh golden finger 727 is used to transmit the ground signal (SIM RST) of the SIM card. GND) and the ground signal (NM GND) of the memory card; the eighth golden finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VDD1) of the memory card.
  • Table 13 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the 2-in-1 card 7 shown in FIG. 33 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a reference clock interface (RCLK), a second power supply interface (VDD2), a ground interface (GND) and a first power supply interface (VDD1).
  • RX+, RX-, TX+, TX- a reference clock interface
  • RCLK reference clock interface
  • VDD2 second power supply interface
  • GND ground interface
  • VDD1 first power supply interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card, the reference of the memory card circuit 712
  • the clock interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the second power interface (VDD2) of the memory card circuit 712 is used to transmit the second power signal (NM VDD2) of the memory card
  • the ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VDD1) of the memory card circuit 712 is used to transmit the first power signal (NM VDD1) of the memory card.
  • the interface of the above-mentioned memory card circuit 712 may be located in the control part of the memory card circuit 712 .
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the interface of the above-mentioned SIM card circuit 713 may be located in the control part of the SIM card circuit 713 .
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+, TX-), the second gold finger 722 is electrically connected to the second power interface (VDD2) of the memory card circuit 712, the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, and the fourth gold finger 724 is electrically connected to the storage
  • the reference clock interface (CLK) of the card circuit 712 is electrically connected to the clock interface (CLK) of the SIM card circuit 713 through the frequency divider 715, the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713, and the seventh
  • the gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface (GND) of the memory card circuit 712
  • the eighth gold finger 728 is electrical
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the fifth gold finger 725, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the five gold fingers 725, the ninth gold finger 729 and the tenth gold finger 7210 do not need to be designed to switch the connection circuit between the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the second gold finger 722, the third gold finger 723 and the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the two The design difficulty of the internal circuit of the all-in-one card 7 is low and easy to realize.
  • the frequency divider 715 is used to change the frequency of the signal.
  • the initial clock signal transmitted by the fourth gold finger 724 can be the reference clock signal (NM RCLK) of the memory card, and the reference clock signal (NM RCLK) of the memory card is directly transmitted
  • the frequency divider 715 carries out frequency adjustment to the reference clock signal (NM RCLK) of the memory card to form the clock signal (SIM CLK) of the SIM card, and then the clock signal of the SIM card (SIM CLK) is transmitted to the clock interface (CLK) of SIM card circuit 713.
  • the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz
  • the frequency divider 715 the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the two-in-one card 7 can realize the multiplexing of the reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 through the same gold finger (that is, the fourth gold finger 724).
  • the integration of the card interface 72 of the two-in-one card 7 is high, and the fourth gold finger 724 does not need to switch the connection circuit. high sex.
  • the reference clock signal (NM RCLK) of the memory card and the clock interface (CLK) of the SIM card circuit 713 can time-division multiplex the fourth gold finger 724, and can also use the fourth gold finger 724 synchronously, which is not strictly limited in this application .
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • FIG. 34 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 33 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a frequency divider 204, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal of the SIM card (SIM VCC) or the first power signal of the memory card (NM VDD1)
  • the ground signal can be the ground signal of the memory card (NM GND) or the ground signal of the SIM card (SIM GND ).
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the interface of the memory card controller 201 and the interface of the SIM card controller 202 are connected to eight elastic pieces among the ten elastic pieces of the card connector 11 .
  • the power interface is connected to another one of the ten shrapnels, and the ground interface is connected to another one of the ten shrapnels.
  • the electronic device realizes interaction with the two-in-one card 7 for communication, data communication, and data storage through the ten shrapnels of the card connector 11.
  • the number of shrapnels is small, and the size of the card connector 11 and the card holder assembly is small. , which is conducive to the thinning and lightening of electronic equipment.
  • the memory card controller 201 supports the PCIE interface protocol.
  • the memory card controller 201 includes a reference clock interface (RCLK), and the reference clock interface (RCLK) is used to transmit a reference clock signal (NM RCLK) of the memory card.
  • the SIM card controller 202 includes a clock interface (CLK), and the clock interface (CLK) is used to transmit the clock signal (SIM CLK) of the SIM card.
  • the reference clock interface (RCLK) of the memory card controller 201 is connected to one of the ten shrapnels of the card connector 11, and the reference clock interface (RCLK) of the memory card controller 201 is connected to the SIM card controller 202 through the frequency divider 204.
  • Clock interface (CLK) Clock interface
  • the frequency divider 204 is connected to the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and the frequency divider 204 is used for reference of the memory card controller 201
  • the reference clock signal (NM RCLK) of the memory card that the clock interface (RCLK) transmits carries out frequency adjustment, forms the clock signal (SIM CLK) of SIM card, and transmits with the clock interface (CLK) of SIM card controller 202, makes SIM
  • the card controller 202 implements clock alignment with the memory card controller 201 .
  • the frequency of the reference clock signal (NM RCLK) of the memory card is 200MHz, and through the frequency divider 204, the frequency can be adjusted to 5MHz to form the clock signal (SIM CLK) of the SIM card.
  • the processor 20 of the electronic device provides the reference clock signal (NM RCLK) of the memory card through one of the shrapnels of the card connector 11, thereby providing the required clock signal for the two-in-one card 7, at the same time, the reference clock signal of the memory card controller 201
  • the clock interface (RCLK) is connected to the clock interface (CLK) of the SIM card controller 202 through the frequency divider 204, so that the clock of the SIM card controller 202 can be aligned with the memory card controller 201, to improve the electronic equipment and the two-in-one card 7 Communication efficiency and communication quality.
  • the memory card controller 201 also includes four data interfaces (RX+, RX-, TX+, TX-) and a second power supply interface (VDD2), four data interfaces (RX+, RX-, TX+, TX-) It is used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), and the second power interface (VDD2) is used to transmit the second power signal of the memory card (NM VDD2).
  • VDD2 second power supply interface
  • the SIM card controller 202 includes a reset interface (RST) and a data interface (DATA), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit the data signal of the SIM card ( SIM DATA).
  • RST reset interface
  • DATA data interface
  • seven of the ten elastic pieces of the card connector 11 are connected to the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201, the second A power interface (VDD2), a data interface (DATA) of the SIM card controller 202, and a reset interface (RST) of the SIM card controller 202.
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are electrically connected to the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11 in one-to-one correspondence.
  • Elastic piece, the second power interface ( VDD2 ) is electrically connected to the second elastic piece of the card connector 11
  • the reference clock interface (RCLK) is electrically connected to the fourth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third elastic piece of the card connector 11
  • the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11 .
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the fifth elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the transmission of the power signal (NM VDD2) is through the transmission of the reference clock signal (NM RCLK) of the memory card between the fourth shrapnel and the two-in-one card 7;
  • the power interface of the processor 20 is connected to the two-in-one card through the eighth shrapnel 7 to transmit the first power signal (NM VDD1) of the memory card, and the ground interface to transmit the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 Realize data storage function.
  • the SIM card controller 202 When the two-in-one card 7 is inserted into the electronic device and the SIM card circuit 713 of the two-in-one card 7 is working, the SIM card controller 202 receives the clock signal sent by the memory card controller 201 and adjusted by the frequency divider 204, and the SIM The card controller 202 carries out the transmission of the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7; The transmission of the power signal (SIM VCC), the ground interface transmits the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • SIM DATA data signal
  • SIM VCC power signal
  • SIM GND ground signal
  • the SIM card controller 202 transmits the reset signal (SIM RST) of the SIM card between the sixth shrapnel and the two-in-one card. , to control the SIM card circuit 713 to reset.
  • SIM RST reset signal
  • the frequency divider 204 may not be set in the processor 20
  • the frequency divider 715 may not be set in the two-in-one card 7 .
  • the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202 are both electrically connected to the fourth elastic piece of the card connector 11 .
  • the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth gold finger 724 of the card interface 72 .
  • the memory card controller 201 sends the reference clock signal (NM RCLK) of the memory card to the fourth golden finger 724 through the fourth shrapnel, and the SIM card controller 202 sends the clock signal (SIM CLK) of the SIM card to the fourth golden finger through the fourth shrapnel.
  • the finger 724, the memory card circuit 712 and the SIM card circuit 713 perform corresponding processing according to the received signal, that is, only process the clock signal that the circuit can identify.
  • the memory card circuit 712 processes the reference clock signal (NM RCLK) of the memory card; when the signal transmitted by the fourth gold finger 724 is only When the clock signal (SIM CLK) of the SIM card, the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card; when the signal transmitted by the fourth gold finger 724 has the reference clock signal (NM RCLK) of the memory card and the SIM card
  • the memory card circuit 712 processes the reference clock signal (NM RCLK) of the memory card, such as collecting signals above 100MHz
  • the SIM card circuit 713 processes the clock signal (SIM CLK) of the SIM card, such as collecting 5MHz the following signals.
  • the frequency divider 204 may not be set in the processor 20, and the frequency divider 715 may not be set in the combo card 7, so that the frequency of the clock signal (SIM CLK) of the SIM card is increased to and stored
  • the frequency of the reference clock signal (NM RCLK) of the card is the same, for example, the clock signal of the SIM card (SIM CLK) is raised to the 19.2MHz frequency or 20MHz frequency required by the reference clock signal (NM RCLK) of the memory card to achieve Sharing of clocks.
  • the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the clock interface (CLK) of the SIM card controller 202 , and one of the clock interfaces is electrically connected to the fourth elastic piece of the card connector 11 .
  • the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the frequency divider 204 in the processor 20 may be replaced with a switch, and the frequency divider 715 may not be provided in the two-in-one card 7 .
  • the switch connects the reference clock interface (RCLK) of the memory card controller 201 and the clock interface (CLK) of the SIM card controller 202, and also connects the fourth shrapnel; the two-in-one card 7 Among them, the reference clock interface (RCLK) of the memory card circuit 712 and the clock interface (CLK) of the SIM card circuit 713 are both electrically connected to the fourth golden finger 724 .
  • the electronic device provides the reference clock signal of the memory card and the clock signal of the SIM card through the same shrapnel time division multiplexing.
  • SIM card service When there is a SIM card service, it provides the clock signal of the SIM card.
  • memory card service When there is a memory card service, it provides the reference clock of the memory card. Signal.
  • the clock signal of the SIM card and the reference clock signal of the memory card are the same, the same clock signal can be provided.
  • the clock signal of the SIM card can be provided first, and the reference clock signal of the memory card will be resumed after the SIM card ends the service.
  • the frequency divider 715 in the 2-in-1 card 7 may also be replaced with a switch.
  • the signal arrangement of the card interface 72 of the 2-in-1 card 7 may be arranged in other ways.
  • the second gold finger 722 is used to transmit one of the data signals of the memory card (such as NM RX+)
  • the first gold finger 721 is used to transmit the second power signal (NM VDD2) of the memory card
  • the signal arrangement of other gold fingers constant.
  • the second gold finger 722 of the two-in-one card 7 is connected to one of the data interfaces (such as RX+) of the memory card circuit 712, the first gold finger 721 is electrically connected to the second power interface (VDD2) of the memory card circuit 712, and the other The connection circuit between the interface and the golden finger remains unchanged; one of the data interfaces (such as RX+) of the memory card controller 201 of the electronic device is electrically connected to the second shrapnel, and the second power interface (VDD2) of the memory card controller 201 is electrically connected to the first The shrapnel, other interfaces and the connection circuit of the shrapnel of the card connector 11 remain unchanged; the work flow of the two-in-one card 7 and the electronic equipment is adjusted adaptively, and will not be repeated here.
  • the data interfaces such as RX+
  • VDD2 second power interface
  • Table 14 is a table of corresponding relations between multiple shrapnels of the card connector 11 and multiple golden fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 33 and their transmission signals .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the data interface (for example, RX-) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The data interface (such as RX-) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 31 .
  • the processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, and the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller.
  • the interface controller is also electrically connected to multiple elastic pieces of the card connector 11.
  • the interface protocol (such as the PCIE interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller is used to control the Nano SIM card 3
  • the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface controller can control the SIM card controller to communicate with the information card through the card connector 11, or the memory card controller and the SIM card
  • the controller communicates with the information card via the card connector 11
  • the second memory card controller communicates with the information card via the card connector 11 .
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • the two-in-one card 7 arranges a high-speed signal (such as NM RX+) on the first gold finger 721, because the first gold finger 721 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM All the golden fingers of the card 4 have no positional correspondence, so no matter whether the information card inserted into the electronic device is a two-in-one card 7, a Nano SIM card 3 or the first NM card 4, the processor 20 does not need to switch to the first shrapnel battery.
  • the connected interface can simplify the circuit of the processor 20 and reduce design difficulty and cost.
  • the two-in-one card 7 arranges the second power supply signal (NM VDD2) of the memory card on the second gold finger 722, because the second gold finger 722 of the two-in-one card 7 is connected to the Nano SIM card 3 and the first NM card 4 All gold fingers have no position correspondence, and the second gold finger 722 of the two-in-one card 7 does not need to be the same shrapnel as the card connector 11 of the Nano SIM card 3 and the first NM card 4 multiplexing electronic device, so as to avoid memory card
  • the second power signal (NM VDD2) shares the same shrapnel with the data signals of the Nano SIM card 3 and the first NM card 4, so as to reduce when the Nano SIM card 3 and the first NM card 4 are inserted into the electronic device and connected to the card connector 11.
  • the electronic equipment is compatible with the Nano SIM card 3 and the first NM card 4 and the reliability of the two-in-one card 7 is higher.
  • the first NM card 4 and the Nano SIM card 3 do not need to deploy a high-voltage resistant design for preventing the circuit from being burned by the second power signal (NM VDD2 ) of the memory card, which can reduce costs.
  • FIG. 35 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the 2-in-1 card 7 supports the UFS interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the golden fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the golden fingers is used to transmit the clock signal of the SIM card (SIM CLK)
  • one of the golden fingers is used to transmit the clock signal of the SIM card (SIM CLK).
  • Gold fingers are used to transmit the reset signal of the SIM card (SIM RST), four of which are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), and one of the gold fingers is used for Transmit the reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND), and one of the gold fingers is used to transmit the power of the SIM card signal (SIM VCC) and the first power supply signal (NM VCC) of the memory card.
  • the first golden finger 721, the second golden finger 722, the ninth golden finger 729 and the tenth golden finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the second gold finger 722 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the tenth gold finger 7210 is used to transmit data signals (NM TX-), which will be described as an example.
  • the data signals transmitted by the first gold finger 721 , the second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card; the fifth gold finger 725 is used to transmit the reference clock signal (SIM CLK) of the memory card NM RCLK); the sixth gold finger 726 is used to transmit the reset signal (SIM RST) of the SIM card; the seventh gold finger 727 is used to transmit the ground signal (SIM GND) of the SIM card and the ground signal (NM GND) of the memory card; The eighth gold finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VCC) of the memory card.
  • SIM DATA data signal
  • the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card
  • the fifth gold finger 725 is used to transmit the reference clock signal (SIM CLK) of the memory card NM RCLK)
  • the sixth gold finger 726 is used to transmit the
  • Table 15 is a schematic diagram of the corresponding relationship between the golden finger and the circuit interface of the 2-in-1 card 7 shown in FIG. 35 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VCCQ), a reference clock interface (RCLK), a ground interface (GND) and a first power supply Interface (VCC).
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card.
  • the second power supply interface (VCCQ) is used to transmit the second power supply signal (NM VCCQ) of the memory card
  • the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VCC) of the memory card circuit 712 is used to transmit the first power signal (NM VCC) of the memory card.
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the two-in-one card 7 also includes a voltage regulator 716 .
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+, TX) of the memory card circuit 712.
  • the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713
  • the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713
  • the fifth gold finger 725 is electrically connected to the memory card circuit 712
  • the sixth gold finger 726 is electrically connected to the reset interface (RST) of the SIM card circuit 713
  • the seventh gold finger 727 is electrically connected to the ground interface (GND) of the SIM card circuit 713 and the ground interface of the memory card circuit 712 (GND)
  • the eighth golden finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VCC) of the memory card circuit 712 .
  • the eighth golden finger 728 is also electrically connected to the second power interface (VCCQ) of the memory card circuit 712 through the voltage regulator 716 .
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the first gold finger 721, The second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 do not need to switch between the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of designing the internal circuit of the two-in-one card 7 and is easy to implement.
  • the third gold finger 723 to the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the inside of the two-in-one card 7 The difficulty of circuit design is low and easy to implement.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • the eighth golden finger 728 is electrically connected to the second power interface (VCCQ) of the memory card circuit 712 through the voltage regulator 716, and the voltage regulator 716 can regulate the voltage of the power signal transmitted by the eighth golden finger 728, thereby forming
  • the second power signal (NM VCCQ) of the memory card is transmitted to the second power interface (VCCQ) of the memory card circuit 712.
  • the voltage of the first power signal (NM VCC) of the memory card is 2.5V, and the voltage regulator 716 can be adjusted to 1.2V to 1.25V to form the second power signal (NM VCCQ) of the memory card.
  • the second power supply signal (NM VCCQ) of the memory card can be obtained by adjusting the voltage of the first power supply signal (NM VCC) of the memory card, there is no need to use a separate gold finger for data transmission, thereby saving two components.
  • the number of golden fingers of the card interface 72 of the one card 7 improves the integration of the card interface 72, and the internal circuit structure of the two-in-one card 7 is simple and easy to implement.
  • FIG. 36 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 35 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal (SIM VCC) of the SIM card or the first power signal (NM VCC) of the memory card
  • the ground signal can be the ground signal (NM GND) of the memory card or the ground signal (SIM GND) of the SIM card.
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are respectively marked as power and ground.
  • the memory card controller 201 supports the UFS interface protocol.
  • the memory card controller 201 includes four data interfaces (RX+, RX-, TX+, TX-) and a reference clock interface (RCLK), and the four data interfaces (RX+, RX-, TX+, TX-) are used to transmit
  • the data signal (NM RX+, NM RX-, NM TX+, NM TX-)
  • the reference clock interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card.
  • the SIM card controller 202 includes a reset interface (RST), a data interface (DATA) and a clock interface (CLK), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit The data signal (SIM DATA) of the SIM card, and the clock interface (CLK) are used to transmit the clock signal (SIM CLK) of the SIM card.
  • RST reset interface
  • DATA data interface
  • CLK clock interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are respectively electrically connected to the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11.
  • the reference clock interface (RCLK) of the card controller 201 is electrically connected to the fifth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third shrapnel of the card connector 11, and the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth shrapnel of the card connector 11.
  • the reset interface (RST) is electrically connected to the sixth shrapnel.
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the power supply interface of the processor 20 Carry out the transmission of the first power supply signal (NM VCC) of the memory card between the eighth shrapnel and the two-in-one card 7, and the first power supply signal (NM VCC) of the memory card VCC) in the two-in-one card 7 is adjusted to the second power supply signal (NM VCCQ) of the memory card through the voltage regulator 716, and is transmitted with the memory card circuit 712, and the ground interface is connected to the two-in-one card 7 through the seventh shrapnel.
  • Carry out the transmission of the ground signal (NM GND) of memory card between, two-in-one card 7 realizes data storage function.
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the transmission of the reset signal (SIM RST) of the SIM card is carried out through the sixth shrapnel and the two-in-one card 7 to control the SIM card circuit 713 Do a reset.
  • Table 16 is a table of corresponding relations between multiple shrapnels of the card connector 11, the multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 35 and their transmission signals. .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic equipment can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a switch, and the switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the memory
  • the reference clock interface (RCLK) of the card controller 201 is also connected to the fifth elastic piece of the card connector 11 .
  • the switch When the electronic equipment is inserted into the Nano SIM card 3, the switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the switch conducts the memory card control The reference clock interface (RCLK) of the device 201 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • RCLK reference clock interface
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 35 .
  • the processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, and the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller.
  • the interface controller is also electrically connected to multiple elastic pieces of the card connector 11.
  • the interface protocol (such as UFS interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller is used to control the Nano SIM card 3
  • the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface controller can control the SIM card controller to communicate with the information card through the card connector 11, or the memory card controller and the SIM card
  • the controller communicates with the information card via the card connector 11
  • the second memory card controller communicates with the information card via the card connector 11 .
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • the two-in-one card 7 arranges two high-speed signals (such as NM RX+, NM RX-) on the first gold finger 721 and the second gold finger 722 respectively.
  • the gold finger 721 and the second gold finger 722 have no corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, so no matter whether the information card inserted into the electronic device is a two-in-one card 7 or a Nano SIM card 3
  • the processor 20 does not need to switch the interface electrically connected to the first elastic piece and the second elastic piece, so the circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.
  • FIG. 37 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the two-in-one card 7 adopts the PCIE interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the golden fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the golden fingers is used to transmit the clock signal of the SIM card (SIM CLK)
  • one of the golden fingers is used to transmit the clock signal of the SIM card (SIM CLK).
  • Gold fingers are used to transmit the reset signal of the SIM card (SIM RST), four of which are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), and one of the gold fingers is used for Transmit the reference clock signal (NM RCLK) of the memory card, one of the gold fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND), and one of the gold fingers is used to transmit the power of the SIM card signal (SIM VCC) and the first power supply signal (NM VDD1) of the memory card.
  • the first golden finger 721, the second golden finger 722, the ninth golden finger 729 and the tenth golden finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the second gold finger 722 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the tenth gold finger 7210 is used to transmit data signals (NM TX-), which will be described as an example.
  • the data signals transmitted by the first gold finger 721 , the second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card; the fifth gold finger 725 is used to transmit the reset signal (SIM CLK) of the SIM card. RST); the sixth gold finger 726 is used to transmit the reference clock signal (NM RCLK) of the memory card; the seventh gold finger 727 is used to transmit the ground signal (SIM GND) of the SIM card and the ground signal (NM GND) of the memory card; The eighth gold finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VDD1) of the memory card.
  • Table 17 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the two-in-one card 7 shown in FIG. 37 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VDD2), a reference clock interface (RCLK), a ground interface (GND) and a first power supply interface (VDD1).
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card.
  • the second power supply interface (VDD2) is used to transmit the second power supply signal (NM VDD2) of the memory card
  • the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VDD1) of the memory card circuit 712 is used to transmit the first power signal (NM VDD1) of the memory card.
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+ , TX-), the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, and the fifth gold finger 725 is electrically connected to the SIM card circuit
  • the ground interface (GND) the eighth golden finger 728 is electrically connected to the power interface (VCC) of the SIM card circuit 713 and the first power interface (VDD1) of the memory card circuit 712 .
  • the eighth golden finger 728 is also electrically connected to the second power interface (VDD2 ) of the memory card circuit 712 through the voltage regulator 716 .
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the first gold finger 721, The second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 do not need to switch the connection circuit design of the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the third gold finger 723 to the sixth gold finger 726 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712, and these gold fingers also do not need to be designed to switch the connection circuit, so that the inside of the two-in-one card 7 The difficulty of circuit design is low and easy to implement.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • the eighth gold finger 728 is electrically connected to the second power interface (VDD2) of the memory card circuit 712 through the voltage regulator 716, and the voltage regulator 716 can regulate the voltage of the power signal transmitted by the eighth gold finger 728, thereby forming The second power signal (NM VDD2) of the memory card is transmitted to the second power interface (VDD2) of the memory card circuit 712.
  • the second power supply signal (NM VDD2) of the memory card can be obtained by adjusting the voltage of the first power supply signal (NM VDD1) of the memory card, there is no need to transmit data through a separate golden finger, thereby saving two
  • the number of golden fingers of the card interface 72 of the one card 7 improves the integration of the card interface 72, and the internal circuit structure of the two-in-one card 7 is simple and easy to implement.
  • FIG. 38 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 37 and an electronic device.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal of the SIM card (SIM VCC) or the first power signal of the memory card (NM VDD1)
  • the ground signal can be the ground signal of the memory card (NM GND) or the ground signal of the SIM card (SIM GND ).
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 for illustration, and are marked as power and ground respectively.
  • the memory card controller 201 supports the PCIE interface protocol.
  • the memory card controller 201 includes four data interfaces (RX+, RX-, TX+, TX-) and a reference clock interface (RCLK), and the four data interfaces (RX+, RX-, TX+, TX-) are used to transmit
  • the data signal (NM RX+, NM RX-, NM TX+, NM TX-)
  • the reference clock interface (RCLK) is used to transmit the reference clock signal (NM RCLK) of the memory card.
  • the SIM card controller 202 includes a reset interface (RST), a data interface (DATA) and a clock interface (CLK), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit The data signal (SIM DATA) of the SIM card, and the clock interface (CLK) are used to transmit the clock signal (SIM CLK) of the SIM card.
  • RST reset interface
  • DATA data interface
  • CLK clock interface
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are respectively electrically connected to the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11.
  • the reference clock interface (RCLK) of the card controller 201 is electrically connected to the sixth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third shrapnel of the card connector 11, and the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth shrapnel of the card connector 11.
  • the reset interface (RST) is electrically connected to the fifth shrapnel.
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the power interface of processor 20 Carry out the transmission of the first power signal (NM VDD1) of memory card between the eighth shrapnel and two-in-one card 7, the first power signal (NM VDD1) of memory card VDD1) in the two-in-one card 7 is adjusted to the second power supply signal (NM VDD2) of the memory card by the voltage regulator 716, and is transmitted with the memory card circuit 712, and the ground interface is connected to the two-in-one card 7 through the seventh shrapnel.
  • Carry out the transmission of the ground signal (NM GND) of memory card between, two-in-one card 7 realizes data storage function.
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the reset signal (SIM RST) of the SIM card is transmitted through the fifth shrapnel and the two-in-one card 7 to control the SIM card circuit 713 Do a reset.
  • the fifth gold finger 725 of the two-in-one card 7 can be used to transmit the reference clock signal (NM RCLK) of the memory card, and the sixth gold finger 726 is used to transmit the reset signal (SIM RST) of the SIM card.
  • the reference clock interface (RCLK) of the memory card circuit 712 is electrically connected to the fifth gold finger 725 of the card interface 72
  • the reset interface (RST) of the SIM card circuit 713 is electrically connected to the fifth gold finger 725 of the card interface 72 .
  • the reference clock interface (RCLK) of the memory card controller 201 is electrically connected to the fifth elastic piece of the card connector 11
  • the reset interface (RST) of the SIM card controller 202 is electrically connected to the sixth elastic piece of the card connector 11 .
  • Table 18 is a table of corresponding relations between multiple shrapnels of the card connector 11, multiple gold fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 37 and their transmission signals. .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a first switch, and the first switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 ( VPP) and the reset interface (RST) of the SIM card controller 202 are also connected to the fifth shrapnel of the card connector 11.
  • VPP programming voltage/input signal interface
  • the first switch When the electronic equipment is inserted into the Nano SIM card 3, the first switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the first switch conducts through the reset interface (RST) of the SIM card controller 202 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • RST reset interface
  • the processor 20 of the electronic device includes a second switch, the second switch connects the reset interface (RST) of the SIM card controller 202 and the reference clock interface (RCLK) of the memory card controller 201, and also connects the sixth shrapnel of the card connector 11 .
  • the second switch conducts the reset interface (RST) of the SIM card controller 202 and the sixth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the second switch conducts the memory card control The reference clock interface (RCLK) of the device 201 and the sixth shrapnel.
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 35 .
  • the processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, and the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller.
  • the interface controller is also electrically connected to multiple elastic pieces of the card connector 11.
  • the interface protocol (such as the PCIE interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller is used to control the Nano SIM card 3
  • the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface controller can control the SIM card controller to communicate with the information card through the card connector 11, or the memory card controller and the SIM card
  • the controller communicates with the information card via the card connector 11
  • the second memory card controller communicates with the information card via the card connector 11 .
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • the two-in-one card 7 arranges two high-speed signals (such as NM RX+, NM RX-) on the first gold finger 721 and the second gold finger 722 respectively.
  • the gold finger 721 and the second gold finger 722 have no corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, so no matter whether the information card inserted into the electronic device is a two-in-one card 7 or a Nano SIM card 3
  • the processor 20 does not need to switch the interface electrically connected to the first elastic piece and the second elastic piece, so the circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.
  • FIG. 39 is a schematic diagram of another embodiment of the two-in-one card 7 shown in FIG. 17 .
  • the memory card circuit 712 of the two-in-one card 7 adopts the PCIE interface protocol.
  • the card interface 72 of the 2-in-1 card 7 includes a first gold finger 721 to a tenth gold finger 7210 .
  • one of the gold fingers is used to transmit the data signal (SIM DATA) of the SIM card
  • one of the gold fingers is used to transmit the clock signal (SIM CLK) of the SIM card
  • one of the gold fingers is used to transmit the clock signal of the SIM card (SIM CLK).
  • Gold fingers are used to transmit the reset signal of the SIM card (SIM RST), four of which are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), and one of the gold fingers is used for Transmit the reference clock signal (NM RCLK) of the memory card and the second power supply signal (NM VDD2) of the memory card, and one of the golden fingers is used to transmit the ground signal of the SIM card (SIM GND) and the ground signal of the memory card (NM GND) , one of the gold fingers is used to transmit the power signal of the SIM card (SIM VCC) and the first power signal of the memory card (NM VDD1).
  • the first golden finger 721, the second golden finger 722, the ninth golden finger 729 and the tenth golden finger 7210 of the two-in-one card 7 are used to transmit data signals of the memory card (NM RX+, NM RX-, NM TX+, NM TX-).
  • the first gold finger 721 is used to transmit data signals (NM RX+)
  • the second gold finger 722 is used to transmit data signals (NM RX-)
  • the ninth gold finger 729 is used to transmit data signals (NM TX+)
  • the tenth gold finger 7210 is used to transmit data signals (NM TX-), which will be described as an example.
  • the data signals transmitted by the first gold finger 721 , the second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 can be exchanged with each other.
  • the data signals transmitted by the first gold finger 721 and the second gold finger 722 are exchanged, and the data signals transmitted by the ninth gold finger 729 and the tenth gold finger 7210 are exchanged.
  • Other embodiments will not be repeated here.
  • the third gold finger 723 is used to transmit the data signal (SIM DATA) of the SIM card; the fourth gold finger 724 is used to transmit the clock signal (SIM CLK) of the SIM card; the fifth gold finger 725 is used to transmit the reset signal (SIM CLK) of the SIM card. RST); the sixth gold finger 726 is used to transmit the reference clock signal (NM RCLK) of the memory card and the second power signal (NM VDD2) of the memory card; the seventh gold finger 727 is used to transmit the ground signal (SIM GND) of the SIM card ) and the ground signal (NM GND) of the memory card; the eighth golden finger 728 is used to transmit the power signal (SIM VCC) of the SIM card and the first power signal (NM VDD1) of the memory card.
  • Table 19 is a schematic diagram of the corresponding relationship between the gold finger and the circuit interface of the two-in-one card 7 shown in FIG. 39 .
  • the interfaces of the circuits or the interfaces of the controllers involved in the following text and drawings are correspondingly identified by the signals they transmit.
  • the memory card circuit 712 includes four data interfaces (RX+, RX-, TX+, TX-), a second power supply interface (VDD2), a reference clock interface (RCLK), a ground interface (GND) and a first power supply interface (VDD1).
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card circuit 712 are used to transmit data signals (NM RX+, NM RX-, NM TX+, NM TX-) of the memory card.
  • the second power supply interface (VDD2) is used to transmit the second power supply signal (NM VDD2) of the memory card
  • the reference clock interface (RCLK) of the memory card circuit 712 is used to transmit the reference clock signal (NM RCLK) of the memory card
  • the memory card circuit 712 The ground interface (GND) of the memory card is used to transmit the ground signal (NM GND) of the memory card
  • the first power interface (VDD1) of the memory card circuit 712 is used to transmit the first power signal (NM VDD1) of the memory card.
  • the SIM card circuit 713 includes a data interface (DATA), a clock interface (CLK), a reset interface (RST), a ground interface (GND), and a power interface (VCC).
  • the data interface (DATA) of SIM card circuit 713 is used for transmitting the data signal (SIM DATA) of SIM card
  • the clock interface (CLK) of SIM card circuit 713 is used for transmitting the clock signal (SIM CLK) of SIM card
  • SIM card circuit 713 The reset interface (RST) of the SIM card is used to transmit the reset signal (SIM RST) of the SIM card
  • the ground interface (GND) of the SIM card circuit 713 is used to transmit the ground signal (SIM GND) of the SIM card
  • the power interface of the SIM card circuit 713 ( VCC) is used to transmit the power signal of the SIM card (SIM VCC).
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729 and the tenth gold finger 7210 of the two-in-one card 7 are respectively electrically connected to the four data interfaces (RX+, RX-, TX+ , TX-), the third gold finger 723 is electrically connected to the data interface (DATA) of the SIM card circuit 713, the fourth gold finger 724 is electrically connected to the clock interface (CLK) of the SIM card circuit 713, and the fifth gold finger 725 is electrically connected to the SIM card circuit
  • the ground interface (GND) of 713 and the ground interface (GND) of the memory card circuit 712, and the eighth golden finger 728 is electrically connected to the power interface (VCC) of the SIM card
  • the two-in-one card 7 realizes the signal transmission of the SIM card circuit 713 and the signal transmission of the memory card circuit 712 through the first gold finger 721 to the tenth gold finger 7210, so that the two-in-one card 7 can integrate a SIM card function and memory card function, realizing multi-function and improving integration.
  • the electronic device is inserted into the two-in-one card 7, the number of information cards to be inserted can be effectively reduced, and the number of card holder components can be reduced, which is conducive to thinning and thinning the electronic device, and can also improve user experience.
  • the first gold finger 721, the second gold finger 722, the ninth gold finger 729, and the tenth gold finger 7210 are exclusive gold fingers of the memory card circuit 712, and are used to transmit high-speed data of the memory card.
  • the first gold finger 721, The second gold finger 722 , the ninth gold finger 729 and the tenth gold finger 7210 do not need to switch the connection circuit design of the high-speed data interface and the low-speed data interface, which can effectively reduce the difficulty of the internal circuit design of the two-in-one card 7 and is easy to implement.
  • the third gold finger 723 to the fifth gold finger 725 are also exclusive gold fingers of the SIM card circuit 713 or the memory card circuit 712. These gold fingers also do not need to be designed to switch the connection circuit, so that the internal circuit of the two-in-one card 7 Low design difficulty and easy implementation.
  • the SIM card circuit 713 and the memory card circuit 712 both transmit the ground signal through the seventh gold finger 727, and transmit the power signal through the eighth gold finger 728, and the two-in-one card 7 may not be provided with a switching scheme of the relevant connection circuit, Or the switching solution is easy to implement, so the integration of the card interface 72 of the two-in-one card 7 can be improved, and the difficulty of internal circuit design is low, so that the two-in-one card 7 has high reliability and low cost.
  • the SIM card circuit 713 and the memory card circuit 712 transmitting the ground signal and the power signal through the seventh gold finger 727 and the eighth gold finger 728 please refer to the relevant description of the previous embodiment for details, and details will not be repeated here.
  • a separation circuit 717 is set in the two-in-one card 7, and the separation circuit 717 is electrically connected to the reference clock interface (RCLK) of the sixth gold finger 726 and the memory card circuit 712 and the second power supply interface (VDD2) of the memory card circuit 712, and the separation circuit 717 Used to separate the signal transmitted by the sixth gold finger 726 from the reference clock signal (NM RCLK) of the memory card and transmit it to the reference clock interface (RCLK) of the memory card circuit 712, and also used to separate the signal transmitted by the sixth gold finger 726
  • the second power supply signal (NM VDD2) of the memory card is separated and transmitted to the second power supply interface (VDD2) of the memory card circuit 712.
  • FIG. 40 is a schematic diagram of a connection circuit between the two-in-one card 7 shown in FIG. 39 and an electronic device.
  • the first elastic piece to the tenth elastic piece of the card connector 11 are one-to-one against and electrically connected to the two-in-one card.
  • the processor 20 of the electronic device may include a memory card controller 201, a SIM card controller 202, a power interface and a ground interface.
  • the memory card controller 201 can be used to control the operation of the memory card circuit of the two-in-one card 7
  • the SIM card controller 202 can be used to control the operation of the SIM card circuit of the two-in-one card 7 .
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the multiple controllers of the processor 20 may be independent components, or may be combined through integrated components, or one controller may be split into multiple components, which is not strictly limited in this embodiment of the present application.
  • the power interface of the processor 20 is used to transmit power signals
  • the ground interface is used to transmit ground signals.
  • the power signal can be the power signal of the SIM card (SIM VCC) or the first power signal of the memory card (NM VDD1)
  • the ground signal can be the ground signal of the memory card (NM GND) or the ground signal of the SIM card (SIM GND ).
  • the power interface and the ground interface can be independent from the SIM card controller 202 and the memory card controller 201, or can be separated and integrated into the SIM card controller 202 and the memory card controller 201. This is not strictly limited.
  • the power interface and the ground interface are independent from the SIM card controller 202 and the memory card controller 201 as an example, and are respectively marked as power and ground.
  • the memory card controller 201 supports the PCIE interface protocol.
  • the memory card controller 201 includes four data interfaces (RX+, RX-, TX+, TX-), a reference clock interface (RCLK) and a second power supply interface (VDD2), four data interfaces (RX+, RX-, TX+, TX -) Used to transmit the data signal of the memory card (NM RX+, NM RX-, NM TX+, NM TX-), the reference clock interface (RCLK) is used to transmit the reference clock signal of the memory card (NM RCLK), the second power interface (VDD2) is used to transmit the second power supply signal (NM VDD2) of the memory card.
  • RX+, RX-, TX+, TX- a reference clock interface
  • VDD2 second power supply signal
  • the SIM card controller 202 includes a reset interface (RST), a data interface (DATA) and a clock interface (CLK), the reset interface (RST) is used to transmit the reset signal (SIM RST) of the SIM card, and the data interface (DATA) is used to transmit The data signal (SIM DATA) of the SIM card, and the clock interface (CLK) are used to transmit the clock signal (SIM CLK) of the SIM card.
  • RST reset interface
  • DATA data interface
  • CLK clock interface
  • the reference clock interface (RCLK) and the second power interface (VDD2 ) of the memory card controller 201 are connected to the same elastic piece among the ten elastic pieces of the card connector 11 .
  • the two signals are transmitted through the same shrapnel of the card connector 11, which can reduce the The number of elastic pieces of the card connector 11 reduces its area, which is beneficial to the miniaturization of electronic equipment.
  • the four data interfaces (RX+, RX-, TX+, TX-) of the memory card controller 201 are respectively electrically connected to the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece of the card connector 11.
  • the reference clock interface (RCLK) and the second power interface (VDD2 ) of the card controller 201 are electrically connected to the sixth elastic piece of the card connector 11 .
  • the data interface (DATA) of the SIM card controller 202 is electrically connected to the third shrapnel of the card connector 11, and the clock interface (CLK) of the SIM card controller 202 is electrically connected to the fourth shrapnel of the card connector 11.
  • the reset interface (RST) is electrically connected to the fifth shrapnel.
  • the power interface of the processor 20 is electrically connected to the eighth elastic piece of the card connector 11
  • the ground interface is electrically connected to the seventh elastic piece of the card connector 11 .
  • the memory card controller 201 passes through the first elastic piece, the second elastic piece, the ninth elastic piece and the tenth elastic piece.
  • the power supply interface of the processor 20 carries out the first power supply signal (NM VDD1) of the memory card between the eighth shrapnel and the two-in-one card 7 transmission, the ground interface transmits the ground signal (NM GND) of the memory card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes the data storage function.
  • the SIM card controller 202 carried out the data signal (SIM DATA) of the SIM card between the third shrapnel and the two-in-one card 7.
  • SIM CLK clock signal
  • SIM VCC power signal
  • the ground interface carries out the transmission of the ground signal (SIM GND) of the SIM card between the seventh shrapnel and the two-in-one card 7, and the two-in-one card 7 realizes call and data communication functions.
  • the reset signal (SIM RST) of the SIM card is transmitted through the fifth shrapnel and the two-in-one card 7 to control the SIM card circuit 713 Do a reset.
  • the fifth gold finger 725 of the two-in-one card 7 can be used to transmit the reference clock signal (NM RCLK) of the memory card and the second power supply signal (NM VDD2) of the memory card, and the sixth gold finger 726 can be used to It is used to transmit the reset signal (SIM RST) of the SIM card.
  • the reference clock interface (RCLK) and the second power supply interface (VDD2) of the memory card circuit 712 are electrically connected to the fifth golden finger 725 of the card interface 72
  • the reset interface (RST) of the SIM card circuit 713 is electrically connected to the second terminal of the card interface 72.
  • Hardware finger 725
  • the reference clock interface (RCLK) and the second power supply interface (VDD2) of the memory card controller 201 are electrically connected to the fifth shrapnel of the card connector 11, and the reset interface (RST) of the SIM card controller 202 is electrically connected to the card The sixth elastic piece of the connector 11.
  • Table 20 is a table of corresponding relations between multiple shrapnels of the card connector 11 and multiple golden fingers of the Nano SIM card 3, the first NM card 4, and the two-in-one card 7 shown in FIG. 39 and their transmission signals .
  • the first to tenth elastic pieces of the card connector 11 are pressed against and electrically connected to the first gold finger 721 to the tenth gold finger of the two-in-one card 7 in one-to-one correspondence.
  • the positions of the third gold finger 723 to the eighth gold finger 728 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 321 to the sixth gold finger 326 of the Nano SIM card 3 .
  • the positions of the third gold finger 723 to the tenth gold finger 7210 of the two-in-one card 7 are in one-to-one correspondence with the positions of the first gold finger 421 to the eighth gold finger 428 of the first NM card 4 .
  • the SIM card controller 202 of the electronic device may not support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also support the programming voltage/input signal.
  • the SIM card controller 202 of the electronic device can also include a programming voltage/input signal interface (VPP), and the processor 20 can set a first switch, and the first switch is connected to the programming voltage/input signal interface (VPP) of the SIM card controller 202 ( VPP) and the reset interface (RST) of the SIM card controller 202 are also connected to the fifth shrapnel of the card connector 11.
  • VPP programming voltage/input signal interface
  • the first switch When the electronic equipment is inserted into the Nano SIM card 3, the first switch conducts the programming voltage/input signal interface (VPP) of the SIM card controller 202 and the fifth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the first switch conducts through the reset interface (RST) of the SIM card controller 202 and the fifth shrapnel.
  • VPP programming voltage/input signal interface
  • RST reset interface
  • the processor 20 of the electronic equipment includes a second switch, the second switch connects the reset interface (RST) of the SIM card controller 202, the reference clock interface (RCLK) and the second power supply interface (VDD2) of the memory card controller 201, and also connects The sixth elastic piece of the card connector 11.
  • the second switch conducts the reset interface (RST) of the SIM card controller 202 and the sixth shrapnel; when the electronic equipment is inserted into the two-in-one card 7, the second switch conducts the memory card control The reference clock interface (RCLK) of the device 201, the second power supply interface (VDD2) and the sixth shrapnel.
  • the present application also provides an electronic device that is compatible with a Nano SIM card 3, a first NM card 4, and a two-in-one card 7 shown in FIG. 35 .
  • the processor of the electronic device may include a memory card controller, a second memory card controller, a SIM card controller, and an interface controller, and the interface controller is electrically connected to the memory card controller, the second memory card controller, and the SIM card controller.
  • the interface controller is also electrically connected to multiple elastic pieces of the card connector 11.
  • the interface protocol (such as the PCIE interface protocol) of the memory card controller can communicate with the memory card circuit of the two-in-one card 7, and is used to control the operation of the memory card circuit of the two-in-one card 7, and the SIM card controller is used to control the Nano SIM card 3
  • the interface protocol (for example, EMMC interface protocol) of the second memory card controller can communicate with the first NM card 4 for controlling the operation of the first NM card 4 .
  • the interface controller can control the SIM card controller to communicate with the information card through the card connector 11, or the memory card controller and the SIM card
  • the controller communicates with the information card via the card connector 11
  • the second memory card controller communicates with the information card via the card connector 11 .
  • the interface controller controls the SIM card controller to communicate with the Nano SIM card 3 through the card connector 11;
  • the interface controller controls the second memory card controller to communicate with the first NM card 4 through the card connector 11;
  • the interface controller controls the memory card controller and the SIM card controller to communicate with the two-in-one card 7 via the card connector 11.
  • the interface controller may include a plurality of switches, through which the connection relationship between the plurality of shrapnels of the card connector 11 and the plurality of controllers in the processor is switched, so as to realize communication requirements in different scenarios.
  • the interface controller may also include multiple wires.
  • the two-in-one card 7 arranges two high-speed signals (such as NM RX+, NM RX-) on the first gold finger 721 and the second gold finger 722 respectively.
  • the gold finger 721 and the second gold finger 722 have no corresponding relationship with all the gold fingers of the Nano SIM card 3 and the first NM card 4, so no matter whether the information card inserted into the electronic device is a two-in-one card 7 or a Nano SIM card 3
  • the processor 20 does not need to switch the interface electrically connected to the first elastic piece and the second elastic piece, so the circuit of the processor 20 can be simplified, and the design difficulty and cost can be reduced.
  • the first gold finger 721, the second gold finger 722 and the tenth gold finger 7210 of the two-in-one card 7 are used as data During the interface, it can be electrically connected to a high-voltage resistant circuit or a protection switch, which is used to prevent the third elastic piece of the card connector 11 from outputting the high-voltage data signal of the SIM card controller 202, and the fourth elastic piece from outputting the high-voltage clock of the SIM card controller 202.
  • the signal and the eighth shrapnel output a high-voltage power signal, the shrapnel short-circuits and burns out the circuit, so as to improve the reliability of the two-in-one card 7 .
  • the high-voltage resistant circuit or the protection switch are located in the package 711 of the two-in-one card 7 .
  • the 2-in-1 card may also have other designs, and the card connector and card socket assembly adapted therefor may not be compatible with the first NM card.
  • the 2-in-1 card may also have other designs, and the card connector and card socket assembly adapted therefor may not be compatible with the Nano SIM card.
  • the arrangement positions of the first gold finger to the tenth gold finger of the two-in-one card can be adjusted, and the signal arrangement positions of the first gold finger to the tenth gold finger can be exchanged.
  • Body dimensions can vary.
  • the electronic device can identify the type of the information card inserted into the electronic device through an information card identification method.
  • the information card identification method can identify whether the information card is a Nano SIM card or a two-in-one card, and the information card identification method can be applied to electronic devices that are compatible with the Nano SIM card and the two-in-one card.
  • Information card identification methods include:
  • Step 001 Execute the first initialization process
  • Step 002 If the first reply instruction is received, it is judged that the inserted information card is the first card; if the first reply instruction is not received, it is judged that the inserted information card is not the first card, and the second initialization process is executed;
  • Step 003 If the second reply instruction is received, determine that the inserted information card is the second card; if the second reply instruction is not received, determine that the inserted information card is not the second card.
  • the electronic device by executing the initialization process of the information card, if the electronic device receives a specific reply signal, it can judge that the information card is an information card corresponding to the initialization process; if it does not receive a specific reply signal, it can judge that the information card The card is not an information card corresponding to the initialization process, and the next initialization process is executed to determine whether the information card is an information card corresponding to the next initialization process.
  • the electronic device can automatically identify the type of information card through the processor, and control the controller corresponding to the information card to conduct with the card connector, so that the information card can be automatically matched with the electronic device, so as to communicate and improve user experience.
  • the first initialization process can be a SIM card initialization process, and the first card is a Nano SIM card; the second initialization process can be a two-in-one card initialization process, and the second card is a two-in-one card.
  • the first initialization process may be a 2-in-1 card initialization process, the first card is a 2-in-1 card; the second initialization process may be a SIM card initialization process, and the second card is a Nano SIM card.
  • the information card identification method responds to the electronic device being turned on or the electronic device being restarted.
  • the information card identification method switches from the disengaged state to the inserted state in response to detecting the state of the card tray.
  • the electronic device can detect whether the state of the card holder is in the disengaged state or the inserted state through the insertion detection shrapnel in the card holder assembly.
  • the information card identification method can identify whether the information card is a Nano SIM card, the first NM card or a two-in-one card, and the information card identification method can be applied to compatible Nano SIM cards, the first NM card, and two-in-one cards.
  • Information card identification methods include:
  • Step 001 Execute the first initialization process
  • Step 002 If the first reply instruction is received, it is judged that the inserted information card is the first card; if the first reply instruction is not received, it is judged that the inserted information card is not the first card, and the second initialization process is executed;
  • Step 003 If the second reply instruction is received, it is judged that the inserted information card is the second card; if the second reply instruction is not received, it is judged that the inserted information card is not the second card, and the third initialization process is executed;
  • Step 004 If the third reply instruction is received, determine that the inserted information card is the third card; if the third reply instruction is not received, determine that the inserted information card is not the third card.
  • step 003 when it is judged that the inserted information card is not the second card, the information card identification method then executes the third initialization process to It is judged whether the information card is the third card.
  • one is the SIM card initialization process
  • the other is the first NM card initialization process
  • the other is the two-in-one card initialization process process.
  • one is a Nano SIM card
  • the other is the first NM card
  • the other is a two-in-one card.
  • the information card identification method responds when the electronic device is turned on or the electronic device is restarted, wherein the first initialization process may be a SIM card initialization process or a two-in-one card initialization process.
  • the information card identification method when the electronic device is turned on or the electronic device is restarted, the information card identification method first performs a SIM card initialization process or a two-in-one card initialization process to determine whether the information card is a Nano SIM card or a two-in-one card. Go online.
  • the information card identification method may also perform other initialization procedures first, which is not strictly limited in this embodiment of the present application.
  • the processor may also be provided with a detection circuit for detecting the type of the information card, and the processor can identify the type of the information card according to the detection result of the detection circuit.
  • a detection circuit for detecting the type of the information card
  • the processor can identify the type of the information card according to the detection result of the detection circuit.
  • the embodiment of the present application does not strictly limit the specific manner in which the processor identifies the type of the information card.
  • Fig. 41 to Fig. 79 are various appearances of the information card provided by this application.
  • the appearance of the information card mentioned above can also be any appearance in Figure 41 to Figure 79, and this embodiment of the application is not strict limited.

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Abstract

一种电子设备和一种信息卡初始化方法，该电子设备能够与兼容Nano SIM卡功能和存储卡功能的卡进行通信，一个卡座组件即可满足电子设备的插卡需求，从而减少卡座组件的数量，有利于电子设备的轻薄化。该信息卡初始化方法使得电子设备能够自动识别插入的信息卡类型。

Description

电子设备及信息卡识别方法 技术领域
本申请涉及通信技术领域，尤其涉及一种电子设备及信息卡识别方法。
背景技术
随着电子设备产品的发展，电子设备内需要设置多张信息卡，以满足其功能性的需求。以手机为例，通常手机内需要设置客户识别模块(Subscriber Identification Module，SIM)卡及存储卡等。各类信息卡均需要对应的卡座组件与之相匹配，因此，电子设备内通常需要设置多个卡座组件，导致卡座组件的占板面积需求在变大，占用了电子设备内部的空间，严重制约了电子设备轻薄化的发展。
发明内容
本申请提供一种电子设备，电子设备能够与兼容Nano SIM卡功能和存储卡功能的卡进行通信，一个卡座组件即可满足电子设备的插卡需求，从而减少卡座组件的数量，有利于电子设备的轻薄化。
本申请还提供一种信息卡识别方法，电子设备通过信息卡识别方法能够自动识别插入的信息卡类型。
第一方面，本申请提供一种电子设备，包括卡座组件和处理器；卡座组件包括卡连接器，当卡插入卡座组件时，卡的十个金手指与卡连接器的十个弹片一一对应地抵持且电连接。其中，卡为信息卡。卡包括存储卡电路和SIM卡电路，卡可以为二合一卡。处理器包括存储卡控制器、SIM卡控制器、电源接口及地接口，存储卡控制器和SIM卡控制器的接口连接至十个弹片中的其中八个弹片，电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。
在本申请中，电子设备的卡座组件的卡连接器能够通过十个弹片与卡进行通信，实现SIM卡功能和存储卡功能，提高了集成度，电子设备能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
一些可能的实现方式中，电子设备还包括开关，开关连接SIM卡控制器的复位接口和存储卡控制器的其中一个接口，开关还连接十个弹片中的一个弹片。
在本实现方式中，由于卡的SIM卡电路的复位操作并非频繁操作，且复位过程能够很快完成，当复位接口和存储卡控制器的其中一个接口复用同一个弹片时，可以通过分时复用的方式充分利用该弹片进行信号传输，例如，在卡的SIM卡电路需要复位时，先将卡连接器的某一弹片导通至SIM卡控制器包括复位接口，以保证用户的联网体验，当卡的SIM卡模块的复位过程完成后，则该弹片切回至导通存储卡控制器，以继续完成对卡的读写操作，从而提高电子设备的工作效率。
一些可能的实现方式中，存储卡控制器支持eMMC接口协议；开关连接存储卡控制器的命令和响应复用接口；在十个弹片中，其中七个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的时钟接口、SIM卡控制器的数据接口以及SIM卡控制器的时钟接口。
在本实现方式中，由于卡连接器的十个弹片中的九个弹片分别用于连接固定的接口，其中一个弹片通过开关切换不同的接口，因此处理器的电路结构简单、稳定，有利于保证信号传输的可靠性，且成本较低。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；开关连接第六弹片；存储卡控制器的四个数据接口一一对应地连接第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器的时钟接口连接第五弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的时钟接口连接第四弹片。
一些可能的实现方式中，存储卡控制器支持eMMC接口协议；开关连接存储卡控制器的时钟接口；在十个弹片中，其中七个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的命令和响应复用接口、SIM卡控制器的数据接口以及SIM卡控制器的时钟接口。
在本实现方式中，由于卡连接器的十个弹片中的九个弹片分别用于连接固定的接口，其中一个弹片通过开关切换不同的接口，因此处理器的电路结构简单、稳定，有利于保证信号传输的可靠性，且成本较低。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；开关连接第六弹片；存储卡控制器的四个数据接口一一对应地连接第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器的命令和响应复用接口连接第五弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的时钟接口连接第四弹片。
一些可能的实现方式中，存储卡控制器支持UFS接口协议或PCIe接口协议；开关连接存储卡控制器的参考时钟接口；在十个弹片中，其中七个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的第二电源接口、SIM卡控制器的数据接口以及SIM卡控制器的时钟接口。
在本实现方式中，由于卡连接器的十个弹片中的九个弹片分别用于连接固定的接口，其中一个弹片通过开关切换不同的接口，因此处理器的电路结构简单、稳定，有利于保证信号传输的可靠性，且成本较低。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；开关连接第六弹片；存储卡控制器的 其中三个数据接口一一对应地连接第五弹片、第九弹片以及第十弹片，存储卡控制器的另一个数据接口和存储卡控制器的第二电源接口中的一者连接第一弹片、另一者连接第二弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的时钟接口连接第四弹片。
一些可能的实现方式中，处理器还包括分频器，存储卡控制器支持eMMC接口协议，存储卡控制器的时钟接口连接十个弹片的一个弹片，存储卡控制器的时钟接口经分频器连接SIM卡控制器的时钟接口。
在本实现方式中，通过分频器对齐存储卡控制器的时钟与SIM卡控制器的时钟，使得卡连接器的十个弹片能够分别连接固定的接口，从而无需进行电路切换，处理器的电路结构简单、稳定，有利于保证信号传输的可靠性，且成本较低。
一些可能的实现方式中，在十个弹片中，其中七个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的命令和响应复用接口、SIM卡控制器的数据接口以及SIM卡控制器的复位接口。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；存储卡控制器的时钟接口连接第四弹片，存储卡控制器的四个数据接口一一对应地连接第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器的命令和响应复用接口连接第五弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的复位接口连接第六弹片。
一些可能的实现方式中，处理器还包括分频器，存储卡控制器支持UFS接口协议或PCIe接口协议，存储卡控制器的参考时钟接口连接十个弹片的一个弹片，存储卡控制器的参考时钟接口经分频器连接SIM卡控制器的时钟接口。
在本实现方式中，通过分频器对齐存储卡控制器的时钟与SIM卡控制器的时钟，使得卡连接器的十个弹片能够分别连接固定的接口，从而无需进行电路切换，处理器的电路结构简单、稳定，有利于保证信号传输的可靠性，且成本较低。
一些可能的实现方式中，在十个弹片中，其中七个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的第二电源接口、SIM卡控制器的数据接口以及SIM卡控制器的复位接口。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；存储卡控制器的时钟接口连接第四弹片，存储卡控制器的其中三个数据接口一一对应地连接第五弹片、第九弹片以及第十弹片，存储卡控制器的另一个数据接口和存储卡控制器的第二电源接口中的一者连接第一弹片、另一者连接第二弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的复位接口连接第六弹片。
一些可能的实现方式中，存储卡控制器支持UFS接口协议或PCIe接口协议；在十个弹片中，其中八个弹片一一对应地连接存储卡控制器的四个数据接口、存储卡控制器的参考时钟接口、SIM卡控制器的复位接口、SIM卡控制器的数据接口以及SIM卡控制器的时钟接口。
在本实施例中，电子设备的存储卡控制器不设置第二电源接口，电子设备与卡通信时，卡通过第一电源信号获得第二电源信号，从而简化电子设备与卡的通信通路。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。电源接口连接第八弹片，地接口连接第七弹片；存储卡控制器的四个数据接口一一对应地连接第一弹片、第二弹片、第九弹片以及第十弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的时钟接口连接第四弹片；存储卡控制器的参考时钟接口和SIM卡控制器的复位接口中的一者连接第五弹片、另一者连接第六弹片。
一些可能的实现方式中，存储卡控制器支持PCIe接口协议。存储卡控制器的参考时钟接口和第二电源接口连接至十个弹片中的同一个弹片；存储卡控制器的四个数据接口一一对应地连接至十个弹片中的另外四个弹片；SIM卡控制器的复位接口、SIM卡控制器的数据接口以及SIM卡控制器的时钟接口一一对应地连接至十个弹片中的另外三个弹片。
在本实现方式中，存储卡的参考时钟信号和第二电源信号通过同一个弹片传输，这两个信号可以于卡中进行分离，从而在保证正常通信的情况下，减少弹片数量，缩小卡座组件的体积，有利于电子设备的轻薄化。
一些可能的实现方式中，十个弹片阵列排布，十个弹片沿第二方向排布成第一列弹片和第二列弹片，第一列弹片包括沿第一方向排布的第一弹片、第三弹片、第五弹片、第七弹片及第九弹片，第二列弹片包括沿第一方向排布的第二弹片、第四弹片、第六弹片、第八弹片及第十弹片，第一方向垂直于第二方向。
电源接口连接第八弹片，地接口连接第七弹片；存储卡控制器的四个数据接口一一对应地连接至第一弹片、第二弹片、第九弹片以及第十弹片；SIM卡控制器的数据接口连接第三弹片，SIM卡控制器的时钟接口连接第四弹片；存储卡控制器的参考时钟接口和存储卡控制器的第二电源接口连接至第五弹片或第六弹片中的一者，SIM卡控制器的复位接口连接至第五弹片或第六弹片中的另一者。
一些可能的实现方式中，十个弹片沿第一方向排布成第一排弹片至第五排弹片。第二排弹片与第三排弹片的中心间距大于第一排弹片与第二排弹片的中心间距，且大于第四排弹片与第五排弹片的中心间距。第三排弹片与第四排弹片的中心间距大于第一排弹片与第二排弹片的中心间距，且大于第四排弹片与第五排弹片的中心间距。
在本申请实现方式中，通过设置多个弹片的排布方式和中心间距，使得多个弹片能够形成多种组合，多种组合中的弹片数量及位置能够与多种类型的信息卡的金手指数量及位置相适配，使得卡连接器能够与不同类型的信息卡实现通信，实现多卡兼容，可拓展性较好。因此，当卡连接器应用于电子设备的卡座组件时，电子设备能够通过同一个卡座组件 适配多种类型的信息卡，从而减少了卡座组件的数量，降低了对电子设备内部空间的占用，有利于电子设备的轻薄化。
第二方面，本申请还提供一种信息卡识别方法，包括：执行第一初始化流程；若接收到第一回复指令，则判断插入的信息卡为第一卡；若未接收到第一回复指令，则判断插入的信息卡非第一卡，执行第二初始化流程；若接收到第二回复指令，则判断插入的信息卡为第二卡；若未接收到第二回复指令，则判断插入的信息卡非第二卡。其中，第一初始化流程和第二初始化流程中的一者为二合一卡初始化流程、另一者为SIM卡初始化流程。
在本实现方式中，电子设备通过执行信息卡的初始化流程，若接收到特定的回复信号，则能够判断信息卡是与初始化流程对应的信息卡，若未接收到特定的回复信号，则判断信息卡不是与初始化流程对应的信息卡，并执行下一个初始化流程，判断信息卡是否为与下一个初始化流程对应的信息卡。其中，电子设备可以实现Nano SIM卡和二合一卡的自动识别。
一些可能的实现方式中，在检测到卡托的状态由脱离状态切换为插入状态的情况下，或者在检测到电子设备开机或电子设备重启的情况下，执行第一初始化流程。
附图说明
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示卡座组件在一些使用状态中的结构示意图；
图3是图2所示卡座的分解结构示意图；
图4是图2所示卡托在另一角度的结构示意图；
图5是本申请实施例提供的一种卡连接器的结构示意图；
图6是图5所示卡连接器在另一个角度的结构示意图一；
图7是图6所示卡连接器的导电体的结构示意图；
图8是图6所示卡连接器的A处结构的内部结构示意图；
图9是图5所示卡连接器在另一角度的结构示意图二；
图10是本申请实施例提供的一种Nano SIM卡的示意框图；
图11是图10所示Nano SIM卡在一些实施例中的结构示意图；
图12是图11所示Nano SIM卡与图5所示卡连接器连接时的结构示意图；
图13是本申请实施例提供的一种第一NM卡的示意框图；
图14是图13所示第一NM卡在一些实施例中的结构示意图；
图15是图14所示第一NM卡与图5所示卡连接器连接时的结构示意图；
图16是本申请实施例提供的一种二合一卡的示意框图；
图17是图16所示二合一卡在一些实施例中的结构示意图；
图18是图17所示二合一卡与图5所示卡连接器连接时的结构示意图；
图19是图17所示二合一卡在一些实施例中的尺寸图；
图20A是图16所示二合一卡在另一些实施例中的尺寸图；
图20B是图20A所示二合一卡的另一尺寸图；
图21是图16所示二合一卡在另一些实施例中的尺寸图；
图22是图16所示二合一卡在另一些实施例中的尺寸图；
图23是图17所示二合一卡在一些实施例中的示意图；
图24A是图23所示二合一卡与一种电子设备的连接电路示意图；
图24B是本申请实施例提供的电子设备在一些实施例中的部分电路结构示意图；
图25是图17所示二合一卡在另一些实施例中的示意图；
图26A是图25所示二合一卡与一种电子设备的连接电路示意图；
图26B是本申请实施例提供的电子设备在另一些实施例中的部分电路结构示意图；
图27是图17所示二合一卡在另一些实施例中的示意图；
图28A是图27所示二合一卡与一种电子设备的连接电路示意图；
图28B是本申请实施例提供的电子设备在另一些实施例中的部分电路结构示意图；
图29是图17所示二合一卡在另一些实施例中的示意图；
图30是图29所示二合一卡与一种电子设备的连接电路示意图；
图31是图17所示二合一卡在另一些实施例中的示意图；
图32是图31所示二合一卡与一种电子设备的连接电路示意图；
图33是图17所示二合一卡在另一些实施例中的示意图；
图34是图33所示二合一卡与一种电子设备的连接电路示意图；
图35是图17所示二合一卡在另一些实施例中的示意图；
图36是图35所示二合一卡与一种电子设备的连接电路示意图；
图37是图17所示二合一卡在另一些实施例中的示意图；
图38是图37所示二合一卡与一种电子设备的连接电路示意图；
图39是图17所示二合一卡在另一些实施例中的示意图；
图40是图39所示二合一卡与一种电子设备的连接电路示意图；
图41至图79是本申请提供的信息卡的多种外观。
具体实施方式
下面将结合附图对本申请实施例中的技术方案进行描述。其中，在本申请实施例的描述中，除非另有说明，“/”表示或的意思，例如，A/B可以表示A或B；文本中的“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况；文本中的“至少部分”包括“部分”和“全部”两种情况；文本中的“多个”是指两个或多于两个，“多张”是指两张或多于两张。
以下，术语“第一”、“第二”等用词仅用于描述目的，而不能理解为暗示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
本申请实施例中所提到的方位用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”、“顶”、“底”等，仅是参考附图的方向，因此，使用的方位用语是为了更好、更清楚地说明及理解本申请实施例，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解，例如，“连接”可以是可拆卸地连接，也可以是不可拆卸地连接；可以是直接连接，也可以通过中间媒介间接连接。
请参阅图1，图1是本申请实施例提供的一种电子设备100的结构示意图。其中，电子设备100可以是手机、平板、智能穿戴设备等电子产品，本申请实施例以电子设备100是手机为例进行示意。
一些实施例中，电子设备100可以包括卡座组件10、处理器20、壳体30、显示屏40及电路板50。其中，显示屏40可以安装于壳体30，显示屏40用于显示图像、视频等。电路板50安装于壳体30的内侧，处理器20可以固定于电路板50且电连接电路板50。卡座组件10包括卡座1和卡托2。卡座1可以安装于壳体30的内侧，卡座1还可以固定连接电路板50，且与电路板50电连接。处理器20可以通过电路板50电连接卡座1。卡托2可拆卸地插接卡座1。卡托2用于安装一张或多张信息卡，卡托2可以携带信息卡插入卡座1，以使信息卡插接卡座组件10，信息卡与电子设备100实现通信。
示例性的，信息卡可以为Nano SIM(subscriber identification module，用户标识模块)卡、Nano存储卡或Nano二合一卡。Nano SIM卡也称为4FF卡，如ETSI TS 102 221 V11.0.0规范的、卡体的尺寸为长度12.30mm、宽度8.80mm、厚度0.67mm的SIM卡。用户可以在卡座组件10中插入Nano SIM卡，Nano SIM卡与处理器20通信，电子设备100通过Nano SIM卡和网络交互，实现通话以及数据通信等功能。Nano存储卡也可以简称为NM(nano memory，nano存储)卡。用户也可以在卡座组件10中插入NM卡，NM卡与处理器20通信，实现数据存储功能。例如可以将音乐、视频等文件保存在NM卡中。Nano二合一卡可以包括SIM卡电路和存储卡电路，SIM卡电路用于支持通话以及数据通信等功能，存储卡电路用于支持数据存储功能。用户也可以在卡座组件10中插入Nano二合一卡，Nano二合一卡与处理器20通信，实现通话、数据通信及数据存储等功能。
一些实施例中，电子设备100还可以包括内部存储器、通用串行总线(universal serial bus，USB)接口、充电管理模块、电源管理模块、电池、天线、移动通信模块、无线通信模块、音频模块、扬声器、受话器、麦克风、耳机接口、传感器模块、按键、马达、指示器以及摄像头等中的一者或多者。在其他一些实施例中，电子设备100可以具有比上述方案更多的或者更少的部件，可以组合两个或多个的部件，或者可以具有不同的部件配置。上述各种部件可以在包括一个或多个信号处理和/或专用集成电路在内的硬件、软件、或硬件和软件的组合中实现。
在一些实施例中，处理器可以包括一个或多个处理单元，例如：处理器可以包括应用处理器(application processor，AP)、调制解调处理器、图形处理器(graphics processing unit，GPU)、图像信号处理器(image signal processor，ISP)、控制器、存储器、视频编解码器、数字信号处理器(digital signal processor，DSP)、基带处理器、神经网络处理器(neural-network processing unit，NPU)等中的一者或多者，本申请实施例对此不作严格限定。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。其中，处理器还可以包括一个或多个接口，处理器可以通过一个或多个接口与电子设备的其他部 件通信。
在一些实施例中，处理器20可以包括一个或多个处理单元，例如：处理器20可以包括应用处理器(application processor，AP)、调制解调处理器、图形处理器(graphics processing unit，GPU)、图像信号处理器(image signal processor，ISP)、控制器、存储器、视频编解码器、数字信号处理器(digital signal processor，DSP)、基带处理器、神经网络处理器(neural-network processing unit，NPU)等中的一者或多者，本申请实施例对此不作严格限定。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器20中。其中，处理器20还可以包括一个或多个接口，处理器20可以通过一个或多个接口与电子设备100的其他部件通信。
请结合参阅图2至图4，图2是图1所示卡座组件10在一些使用状态中的结构示意图，图3是图2所示卡座1的分解结构示意图，图4是图2所示卡托2在另一角度的结构示意图。
一些实施例中，卡座1可以包括座体12、第一卡连接器13、第二卡连接器14、顶出组件15及插入检测弹片16。其中，座体12大体呈罩体形状，座体12包括顶板121及连接顶板121的多个侧板122，顶板121及多个侧板122共同围设出座体12的内侧空间123。第一卡连接器13位于座体12的内侧空间123且固定连接座体12，第一卡连接器13与顶板121相对设置。第二卡连接器14的结构与第一卡连接器13的结构可以相同或不同。第二卡连接器14位于座体12的内侧空间123，第二卡连接器14位于第一卡连接器13背向顶板121的一侧，第二卡连接器14与第一卡连接器13相对设置，第二卡连接器14与第一卡连接器13之间形成间隙。第一卡连接器13、第二卡连接器14及座体12的侧板122共同围设出卡座1的卡槽17。其中，卡槽17的一端敞开、形成开口，卡槽17的另一端形成卡槽17的底部。
其中，卡座1安装于电子设备100中时，多个侧板122的远离顶板121的端部固定至电子设备100的电路板50。第一卡连接器13的多个焊脚固定连接且电连接电路板50，使得第一卡连接器13能够电连接至电子设备100的处理器20。第二卡连接器14可以固定连接电路板50，以通过电路板50固定连接座体12。或者，第二卡连接器14也可以直接固定连接座体12。第二卡连接器14的多个焊脚固定连接且电连接电路板50，使得第二卡连接器14能够电连接至电子设备100的处理器20。
其中，卡托2可以具有相背设置的第一安装槽21和第二安装槽22，第一安装槽21的开口和第二安装槽22的开口分别位于卡托2的两侧表面。第一安装槽21和第二安装槽22均用于安装信息卡。例如图2和图4中，两张信息卡可以分别安装于第一安装槽21和第二安装槽22。其中，第一安装槽21和第二安装槽22的开槽尺寸可以相同或相近，安装于第一安装槽21和第二安装槽22的两张信息卡的卡体的尺寸相同。在其他一些实施例中，第一安装槽21和第二安装槽22的开槽尺寸也可以不同，安装于第一安装槽21和第二安装槽22的两张信息卡的卡体的尺寸不同。
第一安装槽21和第二安装槽22的开槽尺寸与对应的信息卡的卡体的尺寸相适配，例如，第一安装槽21和第二安装槽22的开槽尺寸可以略大于对应的信息卡的卡体的尺寸，但尺寸相差不大，使得信息卡可以顺利装入第一安装槽21和第二安装槽22中，且安装位 置较为稳定。
其中，卡托2可以单独、或者携带信息卡，经卡槽17的开口插入卡槽17中。卡托2和/或信息卡插入卡槽17的方向(也即插卡方向)为卡槽17的开口向卡槽17的底部的方向。卡槽17的尺寸与卡托2的尺寸相适配，例如，卡槽17的尺寸可以略大于卡托2的尺寸但两者相差不大，卡托2与卡槽17的槽壁之间具有一定的配合间隙，使得卡托2可以顺利插入卡槽17，且能够稳定安装于卡槽17中。卡托2携带信息卡插入卡槽17时，安装于卡托2的信息卡电连接第一卡连接器13或第二卡连接器14，以电连接电子设备100。
其中，顶出组件15可以安装于座体12和/或第一卡连接器13。卡托2插入卡槽17时，用户可以通过控制顶出组件15，使得顶出组件15将卡托2部分顶出卡槽17，以便于用户取下卡托2。示例性的，插入检测弹片16可以安装于第一卡连接器13，且电连接电路板50。插入检测弹片16可以至少部分位于卡槽17的底部。插入检测弹片16可以用于检测卡托2是否插入卡槽17。
在其他一些实施例中，卡座1也可以设置一个卡连接器，卡座组件10用于安装一张信息卡，卡托2的结构做适应性调整。在其他一些实施例中，卡座1也可以设有三个或更多个的卡连接器，使得卡座组件10能够用于安装三张以上的信息卡，卡托2的结构做适应性调整。本申请实施例对卡座1的卡连接器的数量、位置、卡托2的具体结构等不作严格限定。
在其他一些实施例中，卡座1也可以设置有不同于图示结构的顶出组件15和/或插入检测弹片16。在其他一些实施例中，卡座组件10可以包括比上述实施例更多的或更少的部件，本申请实施例对此不作严格限定。
请结合参阅图5和图6，图5是本申请实施例提供的一种卡连接器11的结构示意图，图6是图5所示卡连接器11在另一个角度的结构示意图一。示例性的，图5所示卡连接器11可以应用于图3所示卡座1中，作为第一卡连接器13和/或第二卡连接器14使用。
本申请实施例提供一种卡连接器11，卡连接器11可以应用于电子设备100的卡座1，卡连接器11用于连接信息卡。其中，卡连接器11包括多个弹片，卡连接器11连接信息卡时，弹片抵持信息卡。
一些实施例中，卡连接器11包括阵列排布的十个弹片，十个弹片彼此间隔。十个弹片可以大致排布成2×5的阵列结构。例如，十个弹片沿第一方向排布成第一排弹片至第五排弹片，沿第二方向排布成第一列弹片和第二列弹片。第一列弹片包括沿第一方向排布的第一弹片11a、第三弹片11c、第五弹片11e、第七弹片11g及第九弹片11i，第二列弹片包括沿第一方向排布的第二弹片11b、第四弹片11d、第六弹片11f、第八弹片11h及第十弹片11j。第一弹片11a和第二弹片11b位于第一排弹片，第三弹片11c和第四弹片11d位于第二排弹片，第五弹片11e和第六弹片11f位于第三排弹片，第七弹片11g和第八弹片11h位于第四排弹片，第九弹片11i和第十弹片11j位于第五排弹片。
其中，多个弹片沿第一方向成列排布时，位于同一列的多个弹片的中心点(也即弹片的用于抵持信息卡的部分的中心点)可以在第一方向上对齐，也可以不对齐、而稍微错开排布，本申请实施例对此不作严格限定。其中，多个弹片沿第二方向成排排布时，位于同一排的两个弹片的中心点(也即弹片的用于抵持信息卡的部分的中心点)可以在第二方向 上对齐，也可以不对齐、而稍微错开排布，本申请实施例对此不作严格限定。
其中，结合参阅图2、图3、图5以及图6，卡连接器11应用于卡座组件10时，信息卡插入卡座组件10卡槽17的插卡方向平行于第二方向，也即信息卡连接卡连接器11时的插入方向平行于第二方向。信息卡的插入过程中，信息卡先接触卡连接器11的排布于前侧的结构，后接触卡连接器11的排布于后侧的结构。卡连接器11安装于卡座1时，卡连接器11的排布于前侧的结构靠近卡槽17的开口，卡连接器11的排布于后侧的结构远离卡槽17的开口。例如，卡连接器11的第二列弹片可以位于第一列弹片的后侧，第二列弹片相对第一列弹片远离卡座组件10的卡槽17的开口。在其他一些实施例中，卡连接器11的第二列弹片也可以相对第一列弹片靠近卡座组件10的卡槽17的开口，本申请实施例对此方案不再进行赘述。
请结合参阅图6和图7，图7是图6所示卡连接器11的导电体113的结构示意图。
一些实施例中，卡连接器11包括绝缘本体112和导电体113。其中，绝缘本体112可以大致呈板状，绝缘本体112还设有多个彼此间隔设置的镂空区。例如，绝缘本体112可以包括六个第一镂空区1121、多个第二镂空区1122和多个第三镂空区1123。其中，六个第一镂空区1121可以排布成两列三排，包括第一列第一镂空区1121和位于第一列第一镂空区1121后侧的第二列第一镂空区1121。第二镂空区1122可以排布成两列，且两列第二镂空区1122分别位于两列第一镂空区1121的后侧。第三镂空区1123可以排布成一排，且位于第二列第一镂空区1121的后侧。
示例性的，导电体113嵌设于绝缘本体112。其中，导电体113可以由一体的金属板件冲压形成。导电体113包括十个弹片和十个固定件1131，十个弹片可以包括上述第一弹片11a至第十弹片11j,十个固定件1131一一对应地连接十个弹片，其中固定件1131和弹片都是导电材质。导电体113包括十个导电块，对应的一个固定件1131和一个弹片位于同一个导电块，十个导电块彼此间隔设置。其中，十个固定件1131嵌设于绝缘本体112中，以固定连接绝缘本体112，十个弹片分别通过十个固定件1131固定连接绝缘本体112。
示例性的，每个弹片(附图为了简洁，对其中一个弹片(例如11j)进行标示)均包括固定端111a、抵接端111b及活动端111c，固定端111a、抵接端111b及活动端111c沿弹片的延伸方向依次排布，弹片的延伸方向垂直于第一方向，也即平行于第二方向。固定端111a连接固定件1131，固定端111a通过固定件1131固定于绝缘本体112。抵接端111b相对绝缘本体112的一侧表面突出，以在卡连接器11连接信息卡时，弹性抵持信息卡。活动端111c活动安装于绝缘本体112，活动端111c能够相对绝缘本体112在第二方向上移动。
在本实施例中，卡连接器11与信息卡连接时，抵接端111b抵持信息卡，抵接端111b向靠近绝缘本体112的方向移动，活动端111c相对绝缘本体112发生位移，弹片顺利发生形变，弹片抵持信息卡的弹性力适中，使得信息卡能够顺利连接卡连接器11，并且能够降低由于弹片弹性力过大而损坏信息卡的风险，提高可靠性。
其中，弹片还包括第一连接段111d和第二连接段111e，第一连接段111d连接固定端111a与抵接端111b，第二连接段111e连接抵接端111b与活动端111c，抵接端111b相对第一连接段111d和第二连接段111e凸起。也即，在卡连接器11的厚度方向(垂直于第一方向和第二方向)上，抵接端111b处于最高处，第一连接段111d和第二连接段111e次之， 固定端111a和活动端111c位于最低处。弹片与信息卡连接时，弹片由抵接端111b抵持并电连接信息卡，第一连接段111d、固定端111a、第二连接段111e及活动端111c均不接触信息卡、并与信息卡形成间隙。
其中，抵接端111b可以包括凸起设置的抵接触点111f，抵接触点111f具有一定的接触面积。卡连接器11与信息卡连接时，抵接触点111f抵持信息卡的金手指，以使卡连接器11电连接信息卡。
示例性的，第三弹片11c至第八弹片11h可以分别位于六个第一镂空区1121中，第一弹片11a可以与第三弹片11c位于同一个第一镂空区1121中，第二弹片11b可以与第四弹片11d位于同一个第一镂空区1121中，第七弹片11g可以与第九弹片11i位于同一个第一镂空区1121中，第八弹片11h可以与第十弹片11j位于同一个第一镂空区1121中。
各固定件1131包围或半包围对应的弹片。其中，单独位于一个第一镂空区1121的弹片，其对应的固定件1131全包围该弹片。例如，第五弹片11e单独位于其中一个第一镂空区1121中，连接第五弹片11e的固定件1131全包围第五弹片11e。第六弹片11f单独位于其中一个第一镂空区1121中，连接第六弹片11f的固定件1131全包围第六弹片11f。
其中，共用同一个第一镂空区1121的两个弹片，其对应的两个固定件1131呈合围趋势，共同包括这两个弹片，且分别半包围对应的弹片。例如，第一弹片11a和第三弹片11c位于同一个第一镂空区1121中，连接第一弹片11a的固定件1131和连接第三弹片11c的固定件1131，共同环绕第一弹片11a和第三弹片11c，连接第一弹片11a的固定件1131半包围第一弹片11a，连接第三弹片11c的固定件1131半包围第三弹片11c。第七弹片11g和第九弹片11i位于同一个第一镂空区1121中，连接第七弹片11g的固定件1131和连接第九弹片11i的固定件1131，共同环绕第七弹片11g和第九弹片11i，连接第七弹片11g的固定件1131半包围第七弹片11g，连接第九弹片11i的固定件1131半包围第九弹片11i。第二弹片11b和第四弹片11d与其对应的固定件1131的关系，第八弹片11h和第十弹片11j与其对应的固定件1131的关系参考上述描述，此处不再赘述。
请结合参阅图6和图8，图8是图6所示卡连接器11的A处结构的内部结构示意图。图8中示意出弹片的活动端111c与绝缘本体112的连接结构。图6中以第十弹片11j为例进行标号。
一些实施例中，绝缘本体112还包括连通孔1124，连通孔1124连通相邻的第一镂空区1121和第二镂空区1122。弹片的活动端111c插接于连通孔1124，活动端111c的末端包括止位块1111，止位块1111与绝缘本体112配合形成防脱结构。在本实施例中，通过防脱结构能够有效防止弹片的活动端111c脱离绝缘本体112，提高了弹片与绝缘本体112的连接可靠性，使得卡连接器11的可靠性高。
示例性的，弹片的固定端111a和抵接端111b位于第一镂空区1121，弹片的活动端111c插接连通孔1124、经连通孔1124延伸至第二镂空区1122，止位块1111至少部分位于第二镂空区1122。其中，连通孔1124在卡位方向上的宽度小于止位块1111在卡位方向上的宽度，卡位方向可以为任意一个方向，连通孔1124在某一个方向上的尺寸小于止位块1111在同一个方向上的尺寸，即可以使得止位块1111与绝缘本体112配合形成防脱结构，以防止止位块1111穿过连通孔1124、而导致弹片的活动端111c脱离绝缘本体112。例如，在弹 片的延伸方向的垂直方向上，也即在第一方向上，止位块1111的宽度大于连通孔1124的宽度。可以理解的是，本申请实施例对连通孔1124的形状和尺寸、止位块1111的形状和尺寸不作严格限定。
请再次参阅图6和图7，一些实施例中，导电体113的各导电块均还包括焊脚1132(附图为了简洁，对部分焊脚1132进行标示)，焊脚1132固定连接固定件1131，焊脚1132用于焊接至电路板50(可参阅图1)，以使卡连接器11固定连接电路板50，弹片电连接电路板50。其中，每个导电块中的焊脚1132数量为至少一个。
示例性的，各导电块均的至少一个焊脚1132包括第一焊脚1133，第一焊脚1133靠近弹片的固定端111a设置。也即，第一焊脚1133连接于固定件1131的靠近弹片的固定端111a的端部。在信息卡的插卡过程中，信息卡与弹片的抵接端111b之间产生摩擦力，该摩擦力使得弹片具有沿插卡方向(也即第二方向)活动的趋势，弹片的固定端111a受到拉力。导电块通过设置靠近弹片的固定端111a的第一焊脚1133，第一焊脚1133焊接电路板50，使得弹片上的受力由第一焊脚1133传递至电路板50，导电块的固定件1131不易发生变形，固定件1131与绝缘本体112的连接关系稳定，有利于提高卡连接器11和卡座组件10的可靠性。可以理解的是，在信息卡的拔卡过程中，第一焊脚1133同样能够传递应力。
其中，部分导电块的至少一个焊脚1132还可以包括第二焊脚1134，第二焊脚1134靠近弹片的活动端111c设置。也即，第二焊脚1134连接于固定件1131的靠近弹片的活动端111c的端部。在信息卡的拔卡过程中，信息卡与弹片的抵接端111b之间产生摩擦力，该摩擦力使得弹片具有沿拔卡方向(也即第二方向的反方向)活动的趋势，弹片的活动端111c经防脱结构对绝缘本体112产生拉力，导电块通过设置靠近弹片的活动端111c的第二焊脚1134，第二焊脚1134焊接电路板50，使得绝缘本体112上的受力由第二焊脚1134传递至电路板50，导电块的固定件1131不易发生变形，固定件1131与绝缘本体112的连接关系稳定，有利于提高卡连接器11和卡座组件10的可靠性。可以理解的是，在信息卡的拔卡过程中，第一焊脚1133同样能够传递应力。在信息卡的插卡过程中，第一焊脚1133和第二焊脚1134均能够传递应力。
在其他一些实施例中，导电块上的焊脚1132也可以连接于固定件1131的其他位置，例如连接固定件1131的中部，本申请实施例对此不作严格限定。
示例性的，导电体113的多个焊脚1132中的部分焊脚1132可以位于第一镂空区1121中，部分焊脚1132可以位于第三镂空区1123中，排布位置可以参阅图6。在其他一些实施例中，导电体113的多个焊脚1132也可以有其他排布方式，例如，导电体113的多个焊脚1132均位于第一镂空区1121，则绝缘本体112也可以不设置第三镂空区1123，本申请实施例对此不作严格限定。
请参阅图9，图9是图5所示卡连接器11在另一角度的结构示意图二。
一些实施例中，第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距S2大于第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距S1，且大于第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距S4。第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距S3大于第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距S1，且大于第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距S4。 也即，第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距S2、第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距S3较大，第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距S1、第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距S4较小。
其中，当同一排的两个弹片对齐时，两排弹片的中心间距即为位于同一列的两个弹片的中心间距；两个弹片的中心间距是指，两个弹片的用于抵持信息卡的部分(例如抵接触点111f)的中心点在第一方向上的间距。当同一排的两个弹片在第二方向上有少许错位时，则两排弹片的中心间距为第一列弹片的两个弹片的中心间距和第二列弹片的两个弹片的中心间距的平均值。
如图9所示，第三弹片11c与第五弹片11e的中心间距大于第一弹片11a与第三弹片11c的中心间距及第七弹片11g与第九弹片11i的中心间距；第五弹片11e与第七弹片11g的中心间距大于第一弹片11a与第三弹片11c的中心间距及第七弹片11g与第九弹片11i的中心间距；第四弹片11d与第六弹片11f的中心间距大于第二弹片11b与第四弹片11d的中心间距及第八弹片11h与第十弹片11j的中心间距；第六弹片11f与第八弹片11h的中心间距大于第二弹片11b与第四弹片11d的中心间距及第八弹片11h与第十弹片11j的中心间距。
示例性的，第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距S2可以在1.0mm至3.0mm的范围内，例如可以在1.5mm至2.8mm的范围内，例如可以为2.48mm、2.54mm、2.59mm、2.63mm等；和/或，第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距S3可以在1.0mm至3.0mm的范围内，例如可以在1.5mm至2.8mm的范围内，例如可以为2.48mm、2.54mm、2.59mm、2.63mm等；和/或，第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距S1可以在1.0mm至1.7mm的范围内，例如可以为1.03mm、1.07mm、1.12mm等；和/或，第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距S4可以在1.0mm至1.7mm的范围内，例如可以为1.32mm、1.37mm、1.41mm等。
其中，第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距S2和第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距S3可以相等，也可以不相等，本申请实施例对此不作严格限定。相邻两排弹片中对应的两组弹片的中心间距可以相等，也可以不相等,本申请实施例对此不作严格限定。例如，第一排弹片(11a、11b)和第二排弹片(11c、11d)中，第一弹片11a与第三弹片11c的中心间距，和第二弹片11b与第四弹片11d的中心间距，可以相等，也可以不相等。
在本申请实施例中，通过设置多个弹片的排布方式和中心间距，使得多个弹片能够形成多种组合，多种组合中的弹片数量及位置能够与多种类型的信息卡的金手指数量及位置相适配，使得卡连接器11能够与不同类型的信息卡实现通信，实现多卡兼容，可拓展性较好。因此，当卡连接器11应用于电子设备100的卡座组件10时，电子设备100能够通过同一个卡座组件10适配多种类型的信息卡，从而减少了卡座组件10的数量，降低了对电子设备100内部空间的占用，有利于电子设备100的轻薄化。
在一些实施例中，卡连接器11可以与具有六个金手指(也可以称为端子、端口、金属 触点等)的Nano SIM卡通信，也可以与具有至少十个金手指的二合一卡通信，以兼容Nano SIM卡和二合一卡。其中，二合一卡的卡体的尺寸与Nano SIM卡的卡体的尺寸相同。在本申请中，两张信息卡的卡体的尺寸相同，可以是指两张信息卡的卡体的尺寸一致，也可以是两张信息卡的卡体的尺寸很相近、均能够稳定地放置于卡座组件10的卡托2的同一个安装槽中。
在另一些实施例中，卡连接器11可以与具有六个金手指的Nano SIM卡通信，也可以与具有至少十个金手指的二合一卡通信，还可以与具有八个金手指的第一NM卡通信，以兼容Nano SIM卡、二合一卡以及第一NM卡。
在另一些实施例中，卡连接器11可以与具有六个金手指的Nano SIM卡通信，也可以与具有至少十个金手指的二合一卡通信，还可以与具有十个金手指或八个金手指或其他数量金手指的第二NM卡通信，以兼容Nano SIM卡、二合一卡以及第二NM卡。其中，第二NM卡的卡体的尺寸与Nano SIM卡的卡体的尺寸相同。其中，第一NM卡为第一代NM卡，第二NM卡为第二代NM卡，第二NM卡的传输速率大于第一NM卡的传输速率。第一NM卡的卡体的尺寸可以与Nano SIM卡的卡体的尺寸相同。
在另一些实施例中，卡连接器11也可以在兼容Nano SIM卡和二合一卡时，还兼容第一NM卡和/或第二NM卡，本申请实施例对此不作严格限定。
本申请提供一种Nano SIM卡，该Nano SIM卡能够适配上述卡连接器11，以下对Nano SIM卡的结构、Nano SIM卡与卡连接器11的连接结构进行举例说明。
请结合参阅图10至图12，图10是本申请实施例提供的一种Nano SIM卡3的示意框图，图11是图10所示Nano SIM卡3在一些实施例中的结构示意图，图12是图11所示Nano SIM卡3与图5所示卡连接器11连接时的结构示意图。
一些实施例中，如图10和图11所示，Nano SIM卡3可以包括卡体31和卡接口32。卡体31包括封装件311和设置于封装件311内的控制电路312和SIM电路313。卡接口32固定于卡体31，且相对卡体31露出，卡接口32电连接控制电路312。封装件311用于封装控制电路312、SIM电路313以及控制电路312与SIM电路313及卡接口32之间的电连接线路，以进行保护。封装件311采用介电材料，介电材料包括但不限于乙烯醋酸乙烯酯(ethylene-vinyl acetate，EVA)、聚乙烯醇缩丁醛(polyvinyl butyral，PVB)、离聚物、聚烯烃(polyolefins，PO)、硅、热塑性聚氨酯等材料。
其中，Nano SIM卡3具有两两垂直的长度方向、宽度方向及厚度方向，Nano SIM卡3的卡体31在长度方向上的最大尺寸为其长度，在宽度方向上的最大尺寸为其宽度，在厚度方向上的最大尺寸为其厚度。Nano SIM卡3的卡体31的尺寸为长度12.30mm、宽度8.80mm、厚度0.67mm。在本申请实施例中，信息卡的卡体的尺寸即为卡体的封装件的外轮廓的尺寸。
其中，图11中的Nano SIM卡3的卡接口32朝上设置；图12中的Nano SIM卡3所处视角相对图11中的Nano SIM卡3所处视角进行上下翻转，图12中的Nano SIM卡3的卡接口32朝下设置，卡连接器11位于Nano SIM卡3下方。
一些实施例中，Nano SIM卡3的卡体31包括第一边3111、第二边3112、第三边3113以及第四边3114，第一边3111和第三边3113相对设置并沿Nano SIM卡3的长度方向延 伸，第二边3112和第四边3114相对设置并沿Nano SIM卡3的宽度方向延伸。其中，第二边3112与第四边3114的间距大于第一边3111与第三边3113的间距。换言之，第一边3111和第三边3113为长边，第二边3112和第四边3114为短边。其中，第一边3111和第三边3113可以平行或近似平行设置，第二边3112和第四边3114可以平行或近似平行设置。
其中，Nano SIM卡3的卡体31的一个角为切角，切角设置于第一边3111与第二边3112之间。该切角形成切边3115，切边3115与第一边3111之间形成钝角，且与第二边3112之间形成钝角。其中，Nano SIM卡3的卡体31的相邻边(包括第一边3111、第二边3112、第三边3113、第四边3114以及切边3115)之间可以设置圆弧过渡结构或倒角过渡结构。在其他一些实施例中，Nano SIM卡3的卡体31也可以不设置上述切角，本申请对此不作严格限定。
示例性的，Nano SIM卡3的卡接口32包括至少六个金手指，例如包括阵列排布的第一金手指321、第二金手指322、第三金手指323、第四金手指324、第五金手指325以及第六金手指326。第一金手指321相较于其他金手指更靠近Nano SIM卡3的卡体31的切边3115。
当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10，Nano SIM卡3连接卡连接器11时，卡连接器11的十个弹片均抵持Nano SIM卡3，其中，卡连接器11的第三弹片11c至第八弹片11h(也即第二排弹片至第四排弹片)一一对应地抵持且电连接Nano SIM卡3的第一金手指321至第六金手指326，以电连接Nano SIM卡3。在本申请实施例中，卡连接器11的弹片与信息卡的金手指抵持时，两者能够实现电连接。
在本实施例中，卡连接器11将第三弹片11c至第八弹片11h排布成两列三排，第三弹片11c至第八弹片11h能够一一对应地抵持Nano SIM卡3的第一金手指321至第六金手指326，卡连接器11能够与Nano SIM卡3电连接以实现通信。
其中，结合参阅图9和图12，第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距及第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距设置在1.5mm至2.8mm的范围内，使得电子设备100能够通过第三弹片11c至第八弹片11h与Nano SIM卡3的第一金手指321至第六金手指326通信，且能够有效降低Nano SIM卡3的金手指间发生短路的风险，使得卡连接器11与Nano SIM卡3的电连接关系可靠。
可以理解的是，各国/不同运营商的Nano SIM卡3的金手指形状及尺寸可以不同，形成不同的金手指排布方式。例如，图11中所示Nano SIM卡3是为符合规范定义的其中一种金手指排布方式。本申请实施例中卡连接器11和卡座组件10能够兼容各国/不同运营商的Nano SIM卡3。
其中，当Nano SIM卡3连接卡连接器11时，卡连接器11的第一排弹片(11a、11b)和第五排弹片(11i、11j)抵持Nano SIM卡3。一些实施例中，如图11和图12所示，当Nano SIM卡3连接卡连接器11时，第一弹片11a和第三弹片11c可以抵持且电连接Nano SIM卡3的第一金手指321，第二弹片11b和第四弹片11d可以抵持且电连接Nano SIM卡3的第二金手指322，第七弹片11g和第九弹片11i可以抵持且电连接Nano SIM卡3的第五金手指325，第八弹片11h和第十弹片11j可以抵持且电连接Nano SIM卡3的第六金手指326。其中，抵持同一个金手指的两个弹片可以通过金手指导通。
在其他一些实施例中，Nano SIM卡3的卡接口32的多个金手指也可以有不同于图11的排布结构，当Nano SIM卡3连接卡连接器11时，卡连接器11的第一排弹片(11a、11b)和第五排弹片(11i、11j)抵持Nano SIM卡3的卡体31；或者，卡连接器11的第一弹片11a和第三弹片11c可以抵持且电连接Nano SIM卡3的第一金手指321，第二弹片11b和第四弹片11d可以抵持且电连接Nano SIM卡3的第二金手指322，卡连接器11的第五排弹片(11i、11j)抵持Nano SIM卡3的卡体31；或者，第七弹片11g和第九弹片11i可以抵持且电连接Nano SIM卡3的第五金手指325，第八弹片11h和第十弹片11j可以抵持且电连接Nano SIM卡3的第六金手指326，卡连接器11的第一排弹片(11a、11b)抵持Nano SIM卡3的卡体31。其中，当卡连接器11的第一排弹片(11a、11b)和/或第五排弹片(11i、11j)抵持Nano SIM卡3的卡体31时，第一排弹片(11a、11b)和/或第五排弹片(11i、11j)与Nano SIM卡3的金手指不接触，相互之间无电连接关系。本申请实施例对卡连接器11的第一排弹片(11a、11b)和第五排弹片(11i、11j)与Nano SIM卡3的具体连接结构不作严格限定。
示例性的，Nano SIM卡3的六个金手指可以分别用于传输数据信号(DATA)、时钟信号(clock，CLK)、编程电压/输入信号(programming voltage/input signal，VPP)、复位信号(reset signal，RST)、地信号(GND)以及电源信号(VCC)。其中，数据信号(DATA)，也称为I/O信号，用于实现数据传输通讯；编程电压/输入信号(programming voltage/input signal，VPP)用于给Nano SIM卡3编程，也可以用在支持近场通信(near field communication，NFC)的卡上进行通讯。
如下表1所示，表1为卡连接器11的多个弹片与Nano SIM卡3的多个金手指及其传输信号的对应关系表。示例性的，卡连接器11的第三弹片11c电连接Nano SIM卡3的第一金手指321，第一金手指321用于传输数据信号(DATA)；第四弹片11d电连接Nano SIM卡3的第二金手指322，第二金手指322用于传输时钟信号(CLK)；第五弹片11e电连接Nano SIM卡3的第三金手指323，第三金手指323用于编程电压/输入信号(VPP)；第六弹片11f电连接Nano SIM卡3的第四金手指324，第四金手指324用于传输复位信号(RST)；第七弹片11g电连接Nano SIM卡3的第五金手指325，第五金手指325用于传输地信号(GND)；第八弹片11h电连接Nano SIM卡3的第六金手指326，第六金手指326用于传输电源信号(VCC)。
表1
Figure PCTCN2022136647-appb-000001
Figure PCTCN2022136647-appb-000002
在其他一些实施例中，Nano SIM卡3的六个金手指与上述六路信号也可以有其他对应关系，Nano SIM卡3的六个金手指也可以用于传输其他组合的信号，例如Nano SIM卡3也可以不传输编程电压/输入信号(VPP)，第三金手指323悬空设置，相应的，第三金手指323对应的第五弹片11e也可以不提供编程电压/输入信号(VPP)。本申请实施例对此不作严格限定。在本申请实施例中，金手指悬空设置也即该金手指不用于传输信号，不用于为信息卡提供信号端口。
本申请提供一种第一NM卡，该第一NM卡能够适配上述卡连接器11，以下对第一NM卡的结构、第一NM卡与卡连接器11的连接结构进行举例说明。
请结合参阅图13、图14以及图15，图13是本申请实施例提供的一种第一NM卡4的示意框图，图14是图13所示第一NM卡4在一些实施例中的结构示意图，图15是图14所示第一NM卡4与图5所示卡连接器11连接时的结构示意图。
一些实施例中，如图13和图14所示，第一NM卡4包括卡体41和卡接口42。卡体41包括封装件411和设置于封装件411内的控制电路412和存储电路413。卡接口42固定于卡体41，且相对卡体41露出，卡接口42电连接控制电路412。封装件411用于封装控制电路412、存储电路413、以及控制电路412与存储电路413及卡接口42之间的电连接线路，以进行保护。封装件411采用介电材料，介电材料包括但不限于乙烯醋酸乙烯酯(ethylene-vinyl acetate，EVA)、聚乙烯醇缩丁醛(polyvinyl butyral，PVB)、离聚物、聚烯烃(polyolefins，PO)、硅、热塑性聚氨酯等材料。
其中，第一NM卡4的卡体41的尺寸可以与Nano SIM卡3的卡体31的尺寸相同。第一NM卡4具有两两垂直的长度方向、宽度方向及厚度方向，第一NM卡4的卡体41在长度方向上的最大尺寸为其长度，在宽度方向上的最大尺寸为其宽度，在厚度方向上的最大尺寸为其厚度。例如，第一NM卡4的卡体41的尺寸可以为长度12.30mm、宽度8.80mm、厚度0.67mm。
其中，图14中的第一NM卡4的卡接口42朝上设置；图15中的第一NM卡4所处视角相对图14中的第一NM卡4所处视角进行上下翻转，图15中的第一NM卡4的卡接口42朝下设置，卡连接器11位于第一NM卡4下方。
一些实施例中，第一NM卡4的卡体41包括第一边4111、第二边4112、第三边4113以及第四边4114，第一边4111和第三边4113相对设置并沿第一NM卡4的长度方向延伸，第二边4112和第四边4114相对设置并沿第一NM卡4的宽度方向延伸。其中，第二边4112与第四边4114的间距大于第一边4111与第三边4113的间距。换言之，第一边4111和第三边4113为长边，第二边4112和第四边4114为短边。其中，第一边4111和第三边4113可以平行或近似平行设置，第二边4112和第四边4114可以平行或近似平行设置。
其中，第一NM卡4的卡体41的一个角为切角，切角设置于第一边4111与第二边4112之间。该切角形成切边4115，切边4115与第一边4111之间形成钝角，且与第二边4112之间形成钝角。其中，第一NM卡4的卡体41的相邻边(包括第一边4111、第二边4112、 第三边4113、第四边4114以及切边4115)之间可以设置圆弧过渡结构或倒角过渡结构。在其他一些实施例中，第一NM卡4的卡体41也可以不设置上述切角，本申请对此不作严格限定。其中，第一NM卡4的卡体41的切角的尺寸可以与Nano SIM卡3的卡体31的切角的尺寸相同或不同，两者不同时，也认为第一NM卡4的卡体41的尺寸与Nano SIM卡3的卡体31的尺寸相同。
示例性的，第一NM卡4的卡接口42包括至少八个金手指，例如可以包括阵列排布的第一金手指421、第二金手指422、第三金手指423、第四金手指424、第五金手指425、第六金手指426、第七金手指427及第八金手指428。第一金手指421相较于其他金手指更靠近卡体41的切边4115。
当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10，第一NM卡4连接卡连接器11时，卡连接器11的十个弹片均抵持第一NM卡4，其中，卡连接器11的第三弹片11c至第十弹片11j(也即第二排弹片至第四排弹片)一一对应地抵持第一NM卡4的第一金手指421至第八金手指428，以电连接第一NM卡4。
在本实施例中，卡连接器11将第三弹片11c至第十弹片11j排布成四排两列，第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距、小于第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距及第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距，使得卡连接器11的第三弹片11c至第八弹片11h能够与Nano SIM卡3的六个金手指一一对应地电连接，且第三弹片11c至第十弹片11j还能够同时与第一NM卡4的八个金手指一一对应地电连接，因此卡连接器11能够兼容Nano SIM卡3和第一NM卡4。
其中，结合参阅图9、图12和图15，由于Nano SIM卡3和第一NM卡4的金手指数量不同，金手指的形状不同，金手指的尺寸不同，金手指排布位置以及金手指间隔距离也不同，通过将第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距、及第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距设置在1.5mm至2.8mm的范围内，第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距设置在1.0mm至1.7mm的范围内，使得第三弹片11c至第八弹片11h能够分别与Nano SIM卡3的六个金手指通信，且三弹片11c至第十弹片11j能够分别与第一NM卡4的八个金手指通信，卡连接器11能够在兼容Nano SIM卡3和第一NM卡4的基础上，有效降低当Nano SIM卡3设置于卡连接器11时，Nano SIM卡3的金手指与卡连接器11的弹片发生短路的风险，以及当第一NM卡4设置于卡连接器11时，第一NM卡4的金手指与卡连接器11的弹片发生短路的风险，使得卡连接器11与Nano SIM卡3和第一NM卡4的电连接关系可靠，实现Nano SIM卡3和第一NM卡4可以分时共用同一个卡连接器11。
其中，如图15所示，虽然第一NM卡4的第七金手指427和第八金手指428呈“L”型，但是由于卡连接器11的弹片是通过其抵接触点与信息卡的金手指抵接的，弹片的其余部分与金手指之间均形成间隙，因此第九弹片11i电连接第七金手指427，第七弹片11g与第七金手指427之间不接触、无电连接关系，第十弹片11j电连接第八金手指428，第八弹片11h与第八金手指428之间不接触、无电连接关系。
其中，当第一NM卡4连接卡连接器11时，卡连接器11的第一排弹片(11a、11b) 抵持第一NM卡4。一些实施例中，第一弹片11a和第三弹片11c抵持且电连接第一NM卡4的第一金手指421，第二弹片11b和第四弹片11d抵持且电连接第一NM卡4的第二金手指422；在另一些实施例中，第一排弹片(11a、11b)抵接第一NM卡4的卡体41，此时，第一排弹片(11a、11b)与第一NM卡4之间无电连接关系。本申请实施例对卡连接器11的第一排弹片(11a、11b)与第一NM卡4的具体连接结构不作严格限定。
示例性的，第一NM卡4可以采用嵌入式多媒体存储卡(embedded multi media card，EMMC)接口协议。第一NM卡4的八个金手指中可以有四个金手指用于传输数据信号(DATA0、DATA1、DATA2、DATA3)，一个金手指用于传输时钟信号(CLK)，一个金手指用于传输命令和响应信号(CMD)，一个金手指用于传输地信号(GND)，一个金手指用于传输电源信号(VCC)。其中，数据信号(DATA0、DATA1、DATA2、DATA3)用于实现数据传输通讯。命令和响应信号(CMD)可以将命令由外部设备发给存储卡，或者是让存储卡对外部设备进行命令的应答响应。
如下表2所示，表2为卡连接器11的多个弹片与Nano SIM卡3和第一NM卡4的多个金手指及其传输信号的对应关系表。第一NM卡4与卡连接器11连接时，卡连接器11的第三弹片11c至第十弹片11j一一对应地抵持且电连接第一NM卡4的第一金手指421至第八金手指428。在本申请中，若两张信息卡上的两个金手指在与电子设备100的卡连接器11连接时，与同一个弹片抵持且电连接，则认为这两个金手指位置对应。例如，第一NM卡4的第一金手指421至第六金手指426一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。两张信息卡的两个金手指的位置对应时，两个金手指的形状、尺寸及在信息卡的卡体上具体位置，可以相同，也可以存在差异，本申请实施例对此不作严格限定。
示例性的，第一NM卡4的第一金手指421、第四金手指424、第七金手指427及第八金手指428可以用于传输数据信号；例如，第一金手指421用于传输数据信号(DATA1)、第四金手指424用于传输数据信号(DATA0)、第七金手指427用于传输数据信号(DATA3)、第八金手指428用于传输数据信号(DATA2)，第一金手指421、第四金手指424、第七金手指427及第八金手指428中传输的信号在其他一些实施例中可以互相调换，此处不再赘述。第一NM卡4的第二金手指422用于传输时钟信号(CLK)，第三金手指423用于传输命令和响应信号(CMD)，第五金手指425用于传输地信号(GND)，第六金手指426用于传输电源信号(VCC)。
表2
Figure PCTCN2022136647-appb-000003
Figure PCTCN2022136647-appb-000004
在其他一些实施例中，第一NM卡4的八个金手指与上述八路信号也可以有其他对应关系，第一NM卡4的八个金手指也可以用于传输其他组合的信号，本申请实施例对此不作严格限定。
示例性的，第一NM卡4的第一金手指421、第四金手指424和第八金手指428均可以电连接耐高压电路或保护开关，用于避免第三弹片11c至第五弹片11e以及第八弹片11h提供高压时烧坏第一NM卡4的电路。其中，耐高压电路或保护开关均位于第一NM卡4的封装件411内。在其他一些实施例中，也可通过在电子设备内提供高阻抗保护电路，例如在接口控制器内增加保护电路实现。
本申请还提供一种二合一卡，二合一卡集成SIM卡电路和存储卡电路，且SIM卡电路和存储卡电路通过十个金手指实现与电子设备等外部设备的通信，以兼容实现通话、数据通信及数据存储等功能。
请结合参阅图16、图17和图18，图16是本申请实施例提供的一种二合一卡7的示意框图，图17是图16所示二合一卡7在一些实施例中的结构示意图，图18是图17所示二合一卡7与图5所示卡连接器连接时的结构示意图。
一些实施例中，如图16和图17所示，二合一卡7包括卡体71和卡接口72。卡体71包括封装件711和设置于封装件711内的存储卡电路712和SIM卡电路713。卡接口72固定于卡体71，且相对卡体71露出，卡接口72电连接存储卡电路712和SIM卡电路713。封装件711用于封装存储卡电路712、SIM卡电路713、以及存储卡电路712及SIM卡电路713和卡接口72之间的电连接线路，以进行保护。封装件711采用介电材料，介电材料包括但不限于乙烯醋酸乙烯酯(ethylene-vinyl acetate，EVA)、聚乙烯醇缩丁醛(polyvinyl butyral，PVB)、离聚物、聚烯烃(polyolefins，PO)、硅、热塑性聚氨酯等材料。
其中，存储卡电路712可以采用嵌入式多媒体存储卡(embedded multi media card，EMMC)接口协议、闪存存储(Universal Flash Storage，UFS)接口协议、高速外设部件互连(peripheral component interconnect express，PCIE)接口协议、安全数据(Secure Digital，SD)接口协议等接口协议。其中，存储卡电路712可以包括控制部分和存储部分，控制部分电连接二合一卡7的卡接口72，存储部分电连接存储部分，控制部分承载接口协议内容，控制部分用于接收从卡接口72传输的数据，并依据接收的依据进行命令的识别和处理，存储部分用于存储数据。其中，SIM卡电路713同样可以包括控制部分和SIM部分，控制部分电连接二合一卡7的卡接口72，存储部分电连接SIM部分，控制部分承载接口协议内容，控制部分用于接收从卡接口72传输的数据，并依据接收的依据进行命令的识别和处理，SIM部分用于存储数据。
其中，卡接口72与存储卡电路712及SIM卡电路713也可以设置其他电路部分，以使卡接口72与存储卡电路712及SIM卡电路713进行适配的信号传输过程。
其中，二合一卡7的卡体71的尺寸可以与Nano SIM卡的卡体的尺寸相同。二合一卡 7具有两两垂直的长度方向、宽度方向及厚度方向，二合一卡7的卡体71在长度方向上的最大尺寸为其长度，在宽度方向上的最大尺寸为其宽度，在厚度方向上的最大尺寸为其厚度。例如，二合一卡7的卡体71的尺寸可以为长度12.30mm、宽度8.80mm、厚度0.67mm。
其中，图17中的二合一卡7的卡接口72朝上设置；图18中的二合一卡7所处视角相对图17中的二合一卡7所处视角进行上下翻转，图18中的二合一卡7的卡接口72朝下设置，卡连接器位于二合一卡7下方。
一些实施例中，二合一卡7的卡体71包括第一边7111、第二边7112、第三边7113以及第四边7114，第一边7111和第三边7113相对设置并沿二合一卡7的长度方向延伸，第二边7112和第四边7114相对设置并沿二合一卡7的宽度方向延伸。其中，第二边7112与第四边7114的间距大于第一边7111与第三边7113的间距。换言之，第一边7111和第三边7113为长边，第二边7112和第四边7114为短边。第一边7111和第三边7113可以平行或近似平行设置，第二边7112和第四边7114可以平行或近似平行设置。
其中，二合一卡7的卡体71的一个角为切角，切角设置于第一边7111与第二边7112之间。该切角形成切边7115，切边7115与第一边7111之间形成钝角，且与第二边7112之间形成钝角。其中，卡体71的相邻边(包括第一边7111、第二边7112、第三边7113、第四边7114以及切边7115)之间可以设置圆弧过渡结构或倒角过渡结构。在其他一些实施例中，二合一卡7的卡体71也可以不设置上述切角，本申请对此不作严格限定。其中，二合一卡7的卡体71的切角的尺寸可以与Nano SIM卡3的卡体31的切角的尺寸相同或不同，两者不同时，也认为二合一卡7的卡体71的尺寸与Nano SIM卡3的卡体31的尺寸相同。
示例性的，二合一卡7的卡接口72包括多个金手指，多个金手指露出于卡体71的同一侧。二合一卡7的金手指的数量为至少十个，多个金手指例如可以包括第一金手指721、第二金手指722、第三金手指723、第四金手指724、第五金手指725、第六金手指726、第七金手指727、第八金手指728、第九金手指729及第十金手指7210。二合一卡7的第一金手指721、第三金手指723、第五金手指725、第七金手指727及第九金手指729沿二合一卡7的宽度方向排成第一列金手指，第二金手指722、第四金手指724、第六金手指726、第八金手指728及第十金手指7210沿二合一卡7的宽度方向排成第二列金手指，第一列金手指和第二列金手指排布于二合一卡7的长度方向，第一列金手指(721、723、725、727、729)的五个金手指与第二列金手指(722、724、726、728、7210)的五个金手指一一对应、两两成排设置，也即十个金手指沿二合一卡7的宽度方向排布成第一排金手指(721、722)、第二排金手指(723、724)、第三排金手指(725、726)、第四排金手指(727、728)以及第五排金手指(729、7210)。也即，第一金手指321至第十金手指7210排布成两列五排。
其中，第一列金手指(721、723、725、727、729)位于第二边7112与第二列金手指(722、724、726、728、7210)之间，也即第一列金手指(721、723、725、727、729)靠近第二边7112排布，第二列金手指(722、724、726、728、7210)靠近第四边7114排布。
其中，第一金手指721位于第一边7111与第三金手指723之间，第二金手指位于第一边7111与第四金手指714之间。也即，第一排金手指(721、722)靠近第一边7111排布，第五排金手指(729、7210)靠近第三边7113排布。
其中，第一金手指721可以设有斜边，形成直角梯形，第一金手指721的斜边面向卡体71的切边7115设置，两者之间的间距大于或等于0.1mm，例如可以为0.2mm；第二金手指722至第十金手指7210可以为矩形。在其他一些实施例中，第一金手指721也可以为矩形。
其中，第二排金手指(723、724)与第三排金手指(725、726)的中心间距，大于第一排金手指(721、722)与第二排金手指(723、724)的中心间距，且大于第四排金手指(727、728)与第五排金手指(729、7210)的中心间距。第三排金手指(725、726)与第四排金手指(727、728)的中心间距，大于第一排金手指(721、722)与第二排金手指(723、724)的中心间距，且大于第四排金手指(727、728)与第五排金手指(729、7210)的中心间距。
例如，第二排金手指(723、724)与第三排金手指(725、726)的中心间距可以在1.5mm至2.8mm的范围内，第三排金手指(725、726)与第四排金手指(727、728)的中心间距可以在1.5mm至2.8mm的范围内，第一排金手指(721、722)与第二排金手指(723、724)的中心间距可以在1.0mm至1.7mm的范围内，第四排金手指(727、728)与第五排金手指(729、7210)的中心间距可以在1.0mm至1.7mm的范围内。
当卡托2安装有二合一卡7，二合一卡7插入卡座组件10，二合一卡7连接卡连接器11时，二合一卡7的宽度方向平行于卡连接器11的第一方向，长度方向平行于卡连接器11的第二方向，卡连接器11的十个弹片均抵持二合一卡7。其中，当二合一卡7连接卡连接器11时，卡连接器11的十个弹片一一对应地抵持二合一卡7的十个金手指，第一弹片11a至第十弹片11j一一对应地抵持二合一卡7的第一金手指721至第十金手指7210。
在本实施例中，卡连接器11的第一弹片11a至第十弹片11j排布成两列五排，且第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距和第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距，均大于第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距和第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距，使得卡连接器11的第三弹片11c至第八弹片11h能够一一对应地抵持且电连接Nano SIM卡3的第一金手指321至第六金手指326，卡连接器11的第三弹片11c至第十弹片11j能够一一对应地抵持且电连接第一NM卡4的第一金手指421至第八金手指428，卡连接器11的第一弹片11a至第十弹片11j一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，因此卡连接器11能够兼容Nano SIM卡3、第一NM卡4以及二合一卡7。在其他一些实施例中，卡连接器11也可以设计为兼容Nano SIM卡3和二合一卡7。
示例性的，结合参阅图9、图12、图15以及图18，卡连接器11的第二排弹片(11c、11d)与第三排弹片(11e、11f)的中心间距及第三排弹片(11e、11f)与第四排弹片(11g、11h)的中心间距设置在1.5mm至2.8mm的范围内，第一排弹片(11a、11b)与第二排弹片(11c、11d)的中心间距设置在1.0mm至1.7mm的范围内，第四排弹片(11g、11h)与第五排弹片(11i、11j)的中心间距设置在1.0mm至1.7mm的范围内，使得第三弹片11c至第八弹片11h能够分别与Nano SIM卡3的六个金手指通信，第三弹片11c至第十弹片11j能够分别与第一NM卡4的八个金手指通信，第一弹片11a至第十弹片11j能够分别与二合一卡7的十个金手指通信。
由于Nano SIM卡3、第一NM卡4以及二合一卡7三种卡的金手指的数量不同，金手指的形状不同，金手指的排布位置以及金手指的间隔距离也不同，通过第一弹片11a至第十弹片11j的间距的独特设计，实现卡连接器11能够在兼容Nano SIM卡3、第一NM卡4以及二合一卡7的基础上，有效降低当Nano SIM卡3设置于卡连接器11，Nano SIM卡3的金手指与卡连接器11的弹片发生短路的风险，当第一NM卡4设置于卡连接器11，第一NM卡4的金手指与卡连接器11的弹片发生短路的风险，以及当二合一卡7设置于卡连接器11，二合一卡7的金手指与卡连接器11的弹片发生短路的风险，使得卡连接器11与Nano SIM卡3、第一NM卡4及二合一卡7的电连接关系可靠，实现Nano SIM卡3、第一NM卡4以及二合一卡7可以分时共用同一个卡连接器11。可以理解的是，在其他一些实施例中，卡连接器11也可以设计为能够兼容Nano SIM卡3和二合一卡7即可的方案。
在本申请中，二合一卡7的卡接口可以有多种实现方式，以下进行举例说明，以下实施例中的二合一卡7均能够与图5所示卡连接器11连接。
请参阅图19，图19是图17所示二合一卡7在一些实施例中的尺寸图。
一些实施例中，二合一卡7的十个金手指排布成两列五排，第一列金手指(721、723、725、727、729)靠近第二边7112排布，第二列金手指(722、724、726、728、7210)靠近第四边7114排布，每一列金手指均在宽度方向上对齐排列，第一排金手指(721、722)靠近第一边7111排布，第五排金手指(729、7210)靠近第三边7113排布，每一排金手指均在长度方向上对齐排列。其中，第一金手指721可以设有切边，形成直角梯形，第一金手指721的斜边面向卡体71的切边7115设置，两者之间的间距可以为0.2mm；第二金手指722至第十金手指7210可以为矩形。
示例性的，在宽度方向上，第二排金手指(723、724)的中心与第一边7111的间距可以为1.95mm，第三排金手指(725、726)的中心与第一边7111的间距可以为4.25mm，第三排金手指(725、726)的中心与第三边7113的间距可以为4.55mm，第四排金手指(727、728)的中心与第三边7113的间距可以为1.95mm。其中，在宽度方向上，第一排金手指(721、722)与第二排金手指(723、724)的间距可以为0.25mm，第一排金手指(721、722)与第一边7111的间距可以为0.2mm。其中，在宽度方向上，第四排金手指(727、728)与第五排金手指(729、7210)的间距可以为0.25mm，第五排金手指(729、7210)与第三边7113的间距可以为0.2mm。其中，在长度方向上，第一列金手指(721、723、725、727、729)与第二边7112的间距可以为1.1mm，第二列金手指(722、724、726、728、7210)与第四边7114的间距可以为1.1mm。
其中，每个金手指的长度可以为3.2mm，宽度可以为1.0mm。其中，第一金手指721的长度即为其底边的尺寸，第一金手指721的宽度即为其高的尺寸。
其中，上述形状尺寸及间距尺寸的公差为±0.1mm。
请结合参阅图20A和图20B，图20A是图16所示二合一卡7在另一些实施例中的尺寸图，图20B是图20A所示二合一卡7的另一尺寸图。
一些实施例中，二合一卡7的卡体71的封装件711包括第一边7111、第三边7113、第二边7112以及第四边7114，第一边7111和第三边7113相对设置，为长边，第二边7112 和第四边7114相对设置，为短边，相邻边之间可以设置圆弧过渡结构或倒角过渡结构。
示例性的，二合一卡7的十个金手指排布成两列，第一列金手指(721、723、725、727、729)靠近第二边7112排布，第二列金手指(722、724、726、728、7210)靠近第四边7114排布。其中，第一金手指721至第六金手指726排布成两列三排，每一列金手指均在宽度方向上对齐排列，第一排金手指(721、722)靠近第一边7111排布，每一排金手指均在长度方向上对齐排列。第四排金手指(727、728)在长度方向上对齐排列。其中，第一金手指721可以设有切边，形成直角梯形，第一金手指721的斜边面向卡体71的切边7115设置，两者之间的间距可以为0.2mm；第二金手指722至第八金手指728可以为矩形。第九金手指729和第十金手指7210可以呈L形。第九金手指729半包围第七金手指727。第九金手指729包括第一部分7291和第二部分，第一部分7291沿长度方向延伸，第二部分7292沿宽度方向延伸。第九金手指729的第一部分7291位于第七金手指727与第三边7113之间，第九金手指729的第二部分7292连接第一部分7291且位于第七金手指727与第二边7112之间。第十金手指7210包括第一部分72101和第二部分72102，第一部分72101沿长度方向延伸，第二部分72102沿宽度方向延伸。第十金手指7210的第一部分72101位于第八金手指728与第三边7113之间，第十金手指7210的第二部分72102连接第一部分7291且位于第八金手指728与第二边7112之间。如上描述，可以将第九金手指729和第十金手指7210理解为第五排金手指(729、7210)。
示例性的，在宽度方向上，第二排金手指(723、724)的中心与第一边7111的间距可以为1.95mm，第三排金手指(725、726)的中心与第一边7111的间距可以为4.25mm，第三排金手指(725、726)的中心与第三边7113的间距可以为4.55mm，第四排金手指(727、728)的中心与第三边7113的间距可以为1.95mm。其中，在宽度方向上，第一排金手指(721、722)与第二排金手指(723、724)的间距可以为0.25mm，第一排金手指(721、722)与第一边7111的间距可以为0.2mm。其中，在宽度方向上，第四排金手指(727、728)与第五排金手指(729、7210)的间距可以为0.25mm，第五排金手指(729、7210)与第三边7113的间距可以为0.2mm。也即，在宽度方向上，第九金手指729与第三边7113的间距可以为0.2mm，第九金手指729的第一部分7291与第七金手指727的间距可以为0.25mm；第十金手指7210与第三边7113的间距可以为0.2mm，第十金手指7210的第一部分72101与第八金手指728的间距可以为0.25mm。其中，第九金手指729的第二部分7292的靠近第一边7111的顶边可以与第七金手指727的靠近第一边7111的顶边齐平；第十金手指7210的第二部分72102的靠近第一边7111的顶边可以与第八金手指728的靠近第一边7111的顶边齐平。其中，在宽度方向上，第一金手指721至第八金手指728以及第九金手指729的第一部分7291、第十金手指7210的第一部分72101的宽度均可以为1.0mm。
示例性的，在长度方向上，第一金手指721、第三金手指723及第五金手指725与第二边7112的间距可以为1.1mm，第二金手指722、第四金手指724及第六金手指726与第四边7114的间距可以为1.1mm。其中，在长度方向上，第七金手指727的靠近第四边7114的侧边和第九金手指729的第一部分7291的靠近第四边7114的侧边，均可以与第五金手指725靠近第四边7114的侧边齐平；第七金手指727与第九金手指729的第二部分7292的间距可以为0.2mm，第九金手指729与第二边7112的间距可以为0.5mm；第九金手指 729的第二部分7292的宽度可以为0.9mm。其中，在长度方向上，第八金手指728的靠近第二边7112的侧边和第十金手指7210的第一部分72101的靠近第二边7112的侧边，均可以与第六金手指726靠近第二边7112的侧边齐平；第八金手指728与第十金手指7210的第二部分72102的间距可以为0.2mm，第十金手指7210与第四边7114的间距可以为0.5mm；第十金手指7210的第二部分72102的宽度可以为0.9mm。
其中，上述形状尺寸及间距尺寸的公差为±0.1mm。
请参阅图21，图21是图16所示二合一卡7在另一些实施例中的尺寸图。
一些实施例中，二合一卡7的卡体71的封装件711包括第一边7111、第三边7113、第二边7112以及第四边7114，第一边7111和第三边7113相对设置，为长边，第二边7112和第四边7114相对设置，为短边，相邻边之间可以设置圆弧过渡结构或倒角过渡结构。
示例性的，二合一卡7的第一金手指721至第十金手指7210排布成两列五排，第一列金手指(721、723、725、727、729)靠近第二边7112排布，第二列金手指(722、724、726、728、7210)靠近第四边7114排布；第一排金手指(721、722)靠近第一边7111排布，第五排金手指(729、7210)靠近第三边7113排布，每一排金手指均在长度方向上对齐排列。二合一卡7还包括第十一金手指7220和第十二金手指7230，第十一金手指7220和第十二金手指7230排布于第四排金手指(727、728、7220、7230)，第十一金手指7220位于第二边7112与第七金手指727之间，第十二金手指7230位于第四边7114与第八金手指728之间。其中，第一金手指721可以设有切边，形成直角梯形，第一金手指721的斜边面向卡体71的切边7115设置，两者之间的间距可以为0.2mm；第二金手指722至第十二金手指7230可以为矩形。
示例性的，在宽度方向上，第二排金手指(723、724)的中心与第一边7111的间距可以为1.95mm，第三排金手指(725、726)的中心与第一边7111的间距可以为4.25mm，第三排金手指(725、726)的中心与第三边7113的间距可以为4.55mm，第四排金手指(727、728、7220、7230)的中心与第三边7113的间距可以为1.95mm。其中，在宽度方向上，第一排金手指(721、722)与第二排金手指(723、724)的间距可以为0.25mm，第一排金手指(721、722)与第一边7111的间距可以为0.2mm。其中，在宽度方向上，第四排金手指(727、728、7220、7230)与第五排金手指(729、7210)的间距可以为0.25mm，第五排金手指(729、7210)与第三边7113的间距可以为0.2mm。其中，在宽度方向上，第一金手指721至第十二金手指7230的宽度均可以为1.0mm。
示例性的，在长度方向上，第一金手指721、第三金手指723及第五金手指725与第二边7112的间距可以为1.1mm，第二金手指722、第四金手指724及第六金手指726与第四边7114的间距可以为1.1mm。其中，在长度方向上，第七金手指727的靠近第四边7114的侧边和第九金手指729的靠近第四边7114的侧边，均可以与第五金手指725靠近第四边7114的侧边齐平；第十一金手指7220的靠近第二边7112的侧边与第九金手指729的靠近第二边7112的侧边齐平；第七金手指727与第十一金手指7220的间距可以为0.2mm，第十一金手指7220与第二边7112的间距可以为0.5mm，第十一金手指7220的长度可以为0.9mm。其中，在长度方向上，第八金手指728的靠近第二边7112的侧边和第十金手指7210的靠近第二边7112的侧边，均可以与第六金手指726靠近第二边7112的侧边齐平；第十 二金手指7230的靠近第四边7114的侧边与第十金手指7210的靠近第四边7114的侧边齐平；第八金手指728与第十二金手指7230的间距可以为0.2mm，第十二金手指7230与第四边7114的间距可以为0.5mm，第十二金手指7230的长度可以为0.9mm。
其中，上述形状尺寸及间距尺寸的公差为±0.1mm。
请参阅图22，图22是图16所示二合一卡7在另一些实施例中的尺寸图。
一些实施例中，二合一卡7的卡体71的封装件711包括第一边7111、第三边7113、第二边7112以及第四边7114，第一边7111和第三边7113相对设置，为长边，第二边7112和第四边7114相对设置，为短边，相邻边之间可以设置圆弧过渡结构或倒角过渡结构。
示例性的，二合一卡7的第一金手指721至第十金手指7210排布成两列五排，第一列金手指(721、723、725、727、729)靠近第二边7112排布，第二列金手指(722、724、726、728、7210)靠近第四边7114排布，每一列金手指均在宽度方向上对齐排列；第一排金手指(721、722)靠近第一边7111排布，第五排金手指(729、7210)靠近第三边7113排布，每一排金手指均在长度方向上对齐排列。其中，第一金手指721至第十金手指7210均可以为矩形。其中，第一金手指721可以相较于其他金手指更靠近卡体71的切边7115。
示例性的，在宽度方向上，第二排金手指(723、724)的中心与第一边7111的间距可以为1.86mm，第三排金手指(725、726)的中心与第一边7111的间距可以为4.4mm，第三排金手指(725、726)的中心与第三边7113的间距可以为4.4mm，第四排金手指(727、728)的中心与第三边7113的间距可以为1.86mm。其中，第一排金手指(721、722)与第一边7111的间距可以为0.2mm，第五排金手指(729、7210)与第三边7113的间距可以为0.2mm。
示例性的，在长度方向上，第一列金手指(721、723、725、727、729)的中心与第二边7112的间距可以为2.68mm，第二列金手指(722、724、726、728、7210)的中心与第四边7114的间距可以为2.0mm。其中，二合一卡7的卡体71的长度可以为12.3mm。
其中，上述形状尺寸及间距尺寸的公差为±0.1mm。
可以理解的是，图19至图22所示二合一卡7的结构尺寸是为二合一卡7的部分示例，二合一卡7的卡接口72还可以有更多种金手指排布方式和尺寸，二合一卡7的卡接口72至少包括第一金手指721至第十金手指7210即可，本申请实施例对此不作严格限定。
以下对二合一卡7的卡接口72的信号排布方式及内部电路进行举例说明，同时对能够连接二合一卡7的电子设备的部分电路进行举例说明。其中，以下实施例中二合一卡7的卡接口72的信号排布方式均能够应用于具有第一金手指至第十金手指的二合一卡7中，例如图17、图19至图22所示二合一卡7及具有其他卡接口72结构的二合一卡7，以下实施例以图17所示卡接口72结构为例进行示意。
请参阅图23，图23是图17所示二合一卡7在一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712支持EMMC接口协议。二合一卡7的卡接口72包括阵列排布的第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中四个金手指用于传输存储卡的数据信号 (NM DATA0、NM DATA1、NM DATA2、NM DATA3)，其中一个金手指用于传输存储卡的时钟信号(NM CLK)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)和存储卡的命令和响应信号(NM CMD)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)。
示例性的，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA3、NM DATA2)。以下实施例以第一金手指721用于传输数据信号(NM DATA0)、第二金手指722用于传输数据信号(NM DATA1)、第九金手指729用于传输数据信号(NM DATA3)、第十金手指7210用于传输数据信号(NM DATA2)，为例进行说明。在其他一些实施例中，第一金手指721、第二金手指722、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第二金手指722传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第五金手指725用于传输存储卡的时钟信号(NM CLK)；第六金手指726用于传输SIM卡的复位信号(SIM RST)和存储卡的命令和响应信号(NM CMD)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)。
请结合参阅图23和图24A以及表3，表3是图23所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表3
Figure PCTCN2022136647-appb-000005
一些实施例中，存储卡电路712包括四个数据接口(DATA0、DATA1、DATA2、DATA3)、时钟接口(CLK)、命令和响应复用接口(CMD)、地接口(GND)以及电源接口(VCC)。 存储卡电路712的四个数据接口(DATA0、DATA1、DATA2、DATA3)用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA2、NM DATA3)，存储卡电路712的时钟接口(CLK)用于传输存储卡的时钟信号(NM CLK)，存储卡电路712的命令和响应复用接口(CMD)用于传输存储卡的命令和响应信号(NM CMD)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的电源接口(VCC)用于传输存储卡的电源信号(NM VCC)。上述存储卡电路712的接口可以位于存储卡电路712的控制部分。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。上述SIM卡电路713的接口可以位于SIM卡电路713的控制部分。
其中，二合一卡7还包括切换电路714。二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(DATA0、DATA1、DATA3、DATA2)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713的时钟接口(CLK)，第五金手指725电连接存储卡电路712的时钟接口(CLK)，第六金手指726经切换电路714电连接SIM卡电路713的复位接口(RST)和存储卡电路712的命令和响应复用接口(CMD)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的电源接口(VCC)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第二金手指722、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第二金手指722、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第三金手指723、第四金手指724及第五金手指725也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，切换电路714用于检测第六金手指726传输的信号并实现对应切换。例如，若切换电路714检测到第六金手指726传输的信号是SIM卡的复位信号(SIM RST)，则导通第六金手指726与SIM卡电路713的复位接口(RST)。此时第六金手指726与存储卡电 路712的命令和响应复用接口(CMD)处于断开状态。若切换电路714检测到第六金手指726传输的信号是存储卡的命令和响应信号(NM CMD)，则导通第六金手指726与存储卡电路712的命令和响应复用接口(CMD)。此时，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
在本实施例中，二合一卡7通过切换电路714实现两路信号的传输切换，使得SIM卡的复位信号(SIM RST)和存储卡电路712的命令和响应信号(CMD)均能够通过第六金手指726实现传输，使得二合一卡7的卡接口72的集成度高，且与SIM卡电路713的接口及存储卡电路712的接口的连接电路切换难度低，易实现，使得二合一卡7的可靠性高。
其中，由于SIM卡的复位信号(SIM RST)不是常用信号，切换电路714的默认状态可以设为导通第六金手指726与存储卡电路712的命令和响应复用接口(CMD)，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。
例如，通过第七金手指727传输一个地信号，该地信号即传输给SIM卡电路713的地接口(GND)，也传输给存储卡电路712的地接口(GND)。通过第八金手指728传输一个电源信号，当SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)的压力相同时，则该电源信号传输给SIM卡电路713的电源接口(VCC)和存储卡电路712的电源接口(VCC)；当SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)的压力不同时，则第八金手指728电连接一路直传支路和一路调压支路，直传支路与调压支路并联，直传支路用于传输经第八金手指728的电源信号，调压支路则对第八金手指728的电源信号进行调压后继续传输，直传支路和调压支路中的一者电连接SIM卡电路713的电源接口(VCC),另一者电连接存储卡电路712的电源接口(VCC)。其中，调压支路可以串联电压调节器(regulator)，以实现调压。
在其他一些实施例中，当SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)的压力相同时，第八金手指728也可以电连接两路并联的调压支路，两路调压支路分别连接SIM卡电路713的电源接口(VCC)和存储卡电路712的电源接口(VCC)。
在其他一些实施例中，当SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)的压力相同时，电源信号的调压动作也可以由存储卡电路712或SIM卡电路713完成，第八金手指728传输的电源信号直接传输至SIM卡电路713的电源接口(VCC)和存储卡电路712的电源接口(VCC)。本申请实施例对SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)是否进行调压、调压实现方式等不作严格限定。
在其他一些实施例中，也可以将存储卡电路712和SIM卡电路713的电源接口和地接口独立出来，形成二合一卡7的电源接口和地接口。
请结合参阅图23和图24A，图24A是图23所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连 接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、开关203、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为与二合一卡7进行交互的SIM卡的电源信号(SIM VCC)或存储卡的电源信号(NM VCC)，地信号可以为与二合一卡7进行交互的存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图24A中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，SIM卡控制器202包括复位接口(RST)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)。其中，开关203可以连接SIM卡控制器202包括复位接口(RST)和存储卡控制器201的其中一个接口，开关203还连接卡连接器11的十个弹片中的其中一个弹片。
在本实施例中，由于二合一卡7的SIM卡电路的复位操作并非频繁操作，且复位过程能够很快完成，当复位接口(RST)和存储卡控制器201的其中一个接口复用同一个弹片时，可以通过分时复用的方式充分利用该弹片进行信号传输，例如，在二合一卡7的SIM卡电路需要复位时，先将卡连接器11的某一弹片导通至SIM卡控制器202包括复位接口(RST)，以保证用户的联网体验，当二合一卡7的SIM卡模块的复位过程完成后，则该弹片切回至导通存储卡控制器201，以继续完成对二合一卡7的读写操作，从而提高电子设备的工作效率。
一些实施例中，存储卡控制器201支持EMMC接口协议。存储卡控制器201包括四个数据接口(DATA0、DATA1、DATA2、DATA3)、时钟接口(CLK)以及命令和响应复用接口(CMD)，四个数据接口(DATA0、DATA1、DATA2、DATA3)用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA2、NM DATA3)，时钟接口(CLK)用于传输存储卡的时钟信号(NM CLK)，命令和响应复用接口(CMD)用于传输存储卡的命令和响应信号(NM CMD)。SIM卡控制器202还包括数据接口(DATA)以及时钟接口(CLK)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
其中，开关203还连接存储卡控制器201的命令和响应复用接口(CMD)。卡连接器 11的十个弹片中的其中七个弹片一一对应地连接存储卡控制器201的四个数据接口(DATA0、DATA1、DATA2、DATA3)、存储卡控制器201的时钟接口(CLK)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的时钟接口(CLK)。
示例性的，存储卡控制器201的四个数据接口(DATA0、DATA1、DATA3、DATA2)一一对应地电连接卡连接器11的第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器201的时钟接口(CLK)电连接卡连接器11的第五弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的时钟接口(CLK)电连接卡连接器11的第四弹片。开关203连接存储卡控制器201的命令和响应复用接口(CMD)和SIM卡控制器202的复位接口(RST)，开关203还连接卡连接器11的第六弹片。开关203用于导通第六弹片与存储卡控制器201的命令和响应复用接口(CMD)，或者导通第六弹片与SIM卡控制器202的复位接口(RST)。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第二弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM DATA0、NM DATA1、NM DATA3、NM DATA2)的传输，经第五弹片与二合一卡7之间进行存储卡的时钟信号(NM CLK)的传输，经第六弹片与二合一卡7之间进行存储卡的命令和响应信号(NM CMD)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的电源信号(NM VCC)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
其中，当电子设备需要存储数据时，控制开关203导通存储卡控制器201的命令和响应复用接口(CMD)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为存储卡的命令和响应信号(NM CMD)，切换电路714导通第六金手指726与存储卡电路712的命令和响应复用接口(CMD)，以实现存储卡的命令和响应信号(NM CMD)的传输。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。
其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，处理器20控制开关203导通SIM卡控制器202的复位接口(RST)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为SIM卡的复位信号(SIM RST)，切换电路714导通第六金手指726与SIM卡电路713的复位接口(SIM RST)，以实现SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在本实施例中，SIM卡的复位操作并非频繁操作，且复位过程能够很快完成，在SIM卡需要复位时，先将二合一卡7的第六金手指726导通至SIM卡的复位接口(RST)，以保 证用户的联网体验，当SIM卡的复位过程完成后，则第六金手指726切回至导通存储卡电路712，以继续完成读写操作，从而提高二合一卡7的工作效率。
在其他一些实施例中，二合一卡7的卡接口72的信号排布可以有其他方式。例如，第五金手指725用于传输存储卡的命令和响应信号(NM CMD)，第六金手指726用于传输SIM卡的复位信号(SIM RST)和传输存储卡的时钟信号(NM CLK)，其他金手指的信号排布不变。此时，二合一卡7的切换电路714电连接存储卡电路712的时钟接口(CLK)和SIM卡电路713的复位接口(RST)，第五金手指725连接存储卡电路712的命令和响应复用接口(CMD)，其他接口与金手指的连接电路不变；电子设备的存储卡控制器201的命令和响应复用接口(CMD)电连接第五弹片，存储卡控制器201的时钟接口(CLK)电连接开关203，其他接口与卡连接器11的弹片的连接电路不变；二合一卡7和电子设备的工作流程做适应性调整，此处不再赘述。
请参阅表4，表4为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图23所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表4
Figure PCTCN2022136647-appb-000006
Figure PCTCN2022136647-appb-000007
当电子设备兼容Nano SIM卡3和图23所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的时钟接口(CLK)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的时钟接口(CLK)与第五弹片。
请结合参阅图24B和表4，图24B是本申请实施例提供的电子设备在一些实施例中的部分电路结构示意图。本实施例电子设备可以包括图24A对应电子设备的大部分技术内容，以下主要说明两者的区别。
一些实施例中，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图23所示二合一卡7。其中，电子设备的处理器20包括存储卡控制器201、SIM卡控制器202以及接口控制器205，接口控制器205电连接存储卡控制器201以及SIM卡控制器202，接口控制器205还电连接卡连接器11的多个弹片。存储卡控制器201的接口协议(例如EMMC接口协议)能够与第一NM卡4和二合一卡7的存储卡电路通信，用于控制第一NM卡4运行和控制二合一卡7的存储卡电路运行，SIM卡控制器202用于控制Nano SIM卡3运行。当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器205能够控制存储卡控制器201和/或SIM卡控制器202经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器205控制SIM卡控制器202经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器205控制存储卡控制器201经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器205控制存储卡控制器201和SIM卡控制器202经卡连接器11与二合一卡7进行通信。
其中，接口控制器205可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器20中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器205还可以包括多根导线。接口控制器205的示例性方案可以参阅图24B，此处不再赘述。本实施例的其他技术内容可以参考图24A对应实施例的相关描述，此处不再赘述。其中，开关203可以为接口控制器205的一部分。
请参阅图25，图25是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712支持UFS接口协议。UFS接口协议是由联合电子设备工程委员会(Joint Electron Device Engineering Council，JEDEC)协会制定的、用于定义UFS通用闪存的电气接口和UFS存储设备的标准。UFS定义了一个完整的协议 栈，从上到下依次为应用层、传输层和互联层。UFS定义了一个独特的UFS特性集，并将EMMC标准的特性集作为一个子集，使用MIPI(Mobile Industry Processor Interface，移动产业处理器20接口)联盟的UniPro(接口)作为数据链路层和MIPI的M-PHY(串行接口)作为物理层，两者合起来称之为互连层(UFS InterConnect Layer)。UFS接口协议自2011年发布了1.0版本，之后于2012年、2013年、2016年、2018年分别发布了1.1版本、2.0版本、2.1版本、3.0版本，每个版本的更新都伴随了速度的提升。UFS接口协议是EMMC接口协议4.5版本之后的衔接。UFS接口协议的主要改进在于传输层，在数据信号传输上UFS接口协议采用的是差分串行传输，支持同时读写数据，同时由于差分信号抗干扰能力强、能提供更宽的带宽，因此相对于前一代协议标准EMMC，UFS接口协议具有速度快、功耗低的特点。
二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的第二电源信号(NM VCCQ),其中一个金手指用于传输SIM卡的复位信号(SIM RST)和存储卡的参考时钟信号(NM RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VCC)。
其中，存储卡的数据信号(NM RX+)和存储卡的数据信号(NM RX-)为输入差分信号；存储卡的数据信号(NM TX+)和存储卡的数据信号(NM TX-)信号为输出差分信号；存储卡的第一电源信号(NM VCC)负责二合一卡7的存储卡电路712的闪存颗粒(也即存储部分)的供电；存储卡的第二电源信号(NM VCCQ)负责二合一卡7的存储卡电路712的控制部分的供电。其中，在一些实施例中，存储卡的第二电源信号(NM VCCQ)也可以负责存储卡电路712的M-PHY接口、闪存输入输出及其他内部低电压电路的供电。其中，存储卡的第一电源信号(NM VCC)的电压可以在1.7V至1.95V的范围内，或者在2.7V至3.6V的范围内。存储卡的第二电源信号(NM VCCQ)的电压可以在1.1V至1.3V的范围内。
示例性的，二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第五金手指725用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第五金手指725、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第五金手指725传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第二金手指722用于传输存储卡的第二电源信号(NM VCCQ)；第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第六金手指726用于传输SIM卡的复位信号(SIM RST)和存储卡的参考时钟信号 (NM RCLK)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VCC)。
请结合参阅图25和表5，表5是图25所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表5
Figure PCTCN2022136647-appb-000008
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VCCQ)、参考时钟接口(RCLK)、地接口(GND)以及第一电源接口(VCC)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的第二电源接口(VCCQ)用于传输存储卡的第二电源信号(NM VCCQ)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VCC)用于传输存储卡的第一电源信号(NM VCC)。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。
其中，二合一卡7还包括切换电路714。二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第二金手指722电连接存储卡电路712的第二电源接口(VCCQ)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713的时钟接口(CLK)，第六金手指726经切换电路714电连接SIM卡电路713的 复位接口(RST)和存储卡电路712的参考时钟接口(RCLK)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VCC)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第五金手指725、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第五金手指725、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第二金手指722、第三金手指723以及第四金手指724也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，切换电路714用于检测第六金手指726传输的信号并实现对应切换。例如，若切换电路714检测到第六金手指726传输的信号是SIM卡的复位信号(SIM RST)，则导通第六金手指726与SIM卡电路713的复位接口(RST)。此时第六金手指726与存储卡电路712的参考时钟接口(RCLK)处于断开状态。若切换电路714检测到第六金手指726传输的信号是存储卡的参考时钟信号(NM RCLK)，则导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)。此时，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
在本实施例中，二合一卡7通过切换电路714实现两路信号的传输切换，使得SIM卡的复位信号(SIM RST)和存储卡电路712的参考时钟接口(RCLK)均能够通过第六金手指726实现传输，使得二合一卡7的卡接口72的集成度高，且与SIM卡电路713的接口及存储卡电路712的接口的连接电路切换难度低，易实现，使得二合一卡7的可靠性高。
其中，由于SIM卡的复位信号(SIM RST)不是常用信号，切换电路714的默认状态可以设为导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
在本实施例中，SIM卡的复位操作并非频繁操作，且复位过程能够很快完成，在SIM卡需要复位时，先将二合一卡7的第六金手指726导通至SIM卡的复位接口(RST)，以保证用户的联网体验，当SIM卡的复位过程完成后，则第六金手指726切回至导通存储卡电路712，以继续完成读写操作，从而提高二合一卡7的工作效率。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的 相关描述，此处不再赘述。
请结合参阅图25和图26A，图26A是图25所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、开关203、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VCC)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图26A中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，SIM卡控制器202包括复位接口(RST)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)。其中，开关203可以连接SIM卡控制器202包括复位接口(RST)和存储卡控制器201的其中一个接口，开关203还连接卡连接器11的十个弹片中的其中一个弹片。
在本实施例中，由于二合一卡7的SIM卡电路的复位操作并非频繁操作，且复位过程能够很快完成，当复位接口(RST)和存储卡控制器201的其中一个接口复用同一个弹片时，可以通过分时复用的方式充分利用该弹片进行信号传输，例如，在二合一卡7的SIM卡电路需要复位时，先将卡连接器11的某一弹片导通至SIM卡控制器202包括复位接口(RST)，以保证用户的联网体验，当二合一卡7的SIM卡模块的复位过程完成后，则该弹片切回至导通存储卡控制器201，以继续完成对二合一卡7的读写操作，从而提高电子设备的工作效率。
一些实施例中，存储卡控制器201支持UFS接口协议。存储卡控制器201包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VCCQ)以及参考时钟接口(RCLK)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，第二电源接口(VCCQ)用于传输存储卡的第二电源信号(NM VCCQ)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202 还包括数据接口(DATA)以及时钟接口(CLK)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
其中，开关203还连接存储卡控制器201的参考时钟接口(RCLK)，卡连接器11的十个弹片中的其中七个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的第二电源接口(VCCQ)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的数据接口(DATA)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)分别电连接卡连接器11的第一弹片、第五弹片、第九弹片以及第十弹片，存储卡控制器201第二电源接口(VCCQ)电连接卡连接器11的第二弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第四弹片。开关203连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的复位接口(RST)，开关203还连接卡连接器11的第六弹片。开关203用于导通第六弹片与存储卡控制器201的参考时钟接口(RCLK)，或者导通第六弹片与SIM卡控制器202的复位接口(RST)。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第五弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第二弹片与二合一卡7之间进行存储卡的第二电源信号(NM VCCQ)的传输，经第六弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VCC)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
其中，当电子设备需要存储数据时，控制开关203导通存储卡控制器201的参考时钟接口(RCLK)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为存储卡的参考时钟信号(NM RCLK)，切换电路714导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)，以实现存储卡的参考时钟信号(NM RCLK)的传输。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。
其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，处理器20控制开关203导通SIM卡控制器202的复位接口(RST)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为SIM卡的复位信号(SIM RST)，切换电路714导通第六金手指726与SIM卡电路713的复位接口(SIM RST)，以实现SIM卡的复位信号(SIM RST)的传输，控制 SIM卡电路713进行复位。
在本实施例中，SIM卡的复位操作并非频繁操作，且复位过程能够很快完成，在SIM卡需要复位时，先将二合一卡7的第六金手指726导通至SIM卡的复位接口(RST)，以保证用户的联网体验，当SIM卡的复位过程完成后，则第六金手指726切回至导通存储卡电路712，以继续完成读写操作，从而提高二合一卡7的工作效率。
在其他一些实施例中，二合一卡7的卡接口72的信号排布可以有其他方式。例如，第一金手指721用于传输存储卡的第二电源信号(NM VCCQ)，第二金手指722用于传输存储卡的其中一个数据信号(例如NM RX+)，其他金手指的信号排布不变。此时，二合一卡7的第一金手指721电连接存储卡电路712的第二电源接口(VCCQ)，第二金手指722连接存储卡电路712的其中一个数据接口(例如RX+)，其他接口与金手指的连接电路不变；电子设备的存储卡控制器201的第二电源接口(VCCQ)电连接第一弹片，存储卡控制器201的其中一个数据接口(例如RX+)电连接第二弹片，其他接口与卡连接器11的弹片的连接电路不变；二合一卡7和电子设备的工作流程做适应性调整，此处不再赘述。
请参阅表6，表6为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图25所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表6
Figure PCTCN2022136647-appb-000009
Figure PCTCN2022136647-appb-000010
当电子设备兼容Nano SIM卡3和图25所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的数据接口(例如RX-)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的数据接口(例如RX-)与第五弹片。
请结合参阅图26B和表6，图26B是本申请实施例提供的电子设备在另一些实施例中的部分电路结构示意图。本实施例电子设备可以包括图26A对应电子设备的大部分技术内容，以下主要说明两者的区别。
一些实施例中，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图25所示二合一卡7。其中，电子设备的处理器20包括存储卡控制器201、第二存储卡控制器206、SIM卡控制器202以及接口控制器205，接口控制器205电连接存储卡控制器201、第二存储卡控制器206以及SIM卡控制器202，接口控制器205还电连接卡连接器11的多个弹片。
存储卡控制器201的接口协议(例如UFS接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器202用于控制Nano SIM卡3运行，第二存储卡控制器206的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器205能够控制SIM卡控制器202经卡连接器11与信息卡通信、或者存储卡控制器201和SIM卡控制器202经卡连接器11与信息卡通信、或者第二存储卡控制器206经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器205控制SIM卡控制器202经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器205控制第二存储卡控制器206经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器205控制存储卡控制器201和SIM卡控制器202经卡连接器11与二合一卡7进行通信。
其中，接口控制器205可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器20中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器205还可以包括多根导线。接口控制器205的示例性方案可以参阅图26B，此处不再赘述。本实施例的其他技术内容可以参考图26A对应实施例的相关描述，此处不再赘述。其中，开关203可以为接口控制器205的一部分。
在本实施例中，二合一卡7将一个高速信号(例如NM RX+)排布于第一金手指721，由于二合一卡7的第一金手指721与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
二合一卡7将存储卡的第二电源信号(NM VCCQ)排布于第二金手指722，由于二合一卡7的第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，二合一卡7的第二金手指722无需与Nano SIM卡3和第一NM卡4复用电子设备的卡连接器11的同一个弹片，避免存储卡的第二电源信号(NM VCCQ)与Nano SIM卡3和第一NM卡4的数据信号共用同一个弹片，以降低Nano SIM卡3和第一NM卡4插入电子设备、连接卡连接器11时，被存储卡的第二电源信号(NM VCCQ)烧坏的风险，电子设备兼容Nano SIM卡3和第一NM卡4以及二合一卡7的可靠性较高。此外，第一NM卡4和Nano SIM卡3也无需部署用于避免电路被存储卡的第二电源信号(NM VCCQ)烧坏的耐高压设计，能够降低成本。
请参阅图27，图27是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712支持PCIE接口协议。PCIE又称为PCI Express，是一种分层协议，由事务层、数据链路层和物理层组成。它的主要优势就是数据传输速率高，另外还有抗干扰能力强、传输距离远、功耗低等优点。PCI Express的传输方式由PCI的并行改为串行，通过使用差分信号传输(differential transmission)。这种传输方式将相同内容通过一正一反镜像传输以提高干扰被发现和纠正的效率，并且PCI Express可以采用全双工，因此PCI Express的传输效率相较PCI大大提升。自2001年起，PCI Express从1.0版本在20年间更新至5.0版本，且在2021年将会正式更新至6.0版本，无疑PCI Express是流行的传输总线标准。对于PCIE1.0，带宽达到PCI的近两倍，而在2021年计划发布的PCI Express6.0带宽最高可达256GB/s。2018年，SD Association正式宣布SD(Secure Digital)卡兼容PCI Express通道，PCI Express兼容于移动存储卡成为现实，对于NM卡来说，PCI Express具有提供大带宽的优势。
二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的第二电源信号(NM VDD2),其中一个金手指用于传输SIM卡的复位信号(SIM RST)和存储卡的参考时钟信号(NM RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
示例性的，二合一卡7的第二金手指722、第五金手指725、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第二金手指722用于传输数据信号(NM RX-)、第五金手指725用于传输数据信号 (NM RX+)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第二金手指722、第五金手指725、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第二金手指722与第五金手指725传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第一金手指721用于传输存储卡的第二电源信号(NM VDD2)；第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第六金手指726用于传输SIM卡的复位信号(SIM RST)和存储卡的参考时钟信号(NM RCLK)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
请结合参阅图27和表7，表7是图27所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表7
Figure PCTCN2022136647-appb-000011
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VDD2)、参考时钟接口(RCLK)、地接口(GND)以及第一电源接口(VDD1)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VDD1)用于传输存储卡的第一电源信号(NM VDD1)。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟 信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。
其中，二合一卡7的第二金手指722、第五金手指725、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第一金手指721电连接存储卡电路712的第二电源接口(VDD2)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713的时钟接口(CLK)，第六金手指726经切换电路714电连接SIM卡电路713的复位接口(RST)和存储卡电路712的参考时钟接口(RCLK)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VDD1)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第二金手指722、第五金手指725、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第二金手指722、第五金手指725、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第一金手指721、第三金手指723以及第四金手指724也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，切换电路714用于检测第六金手指726传输的信号并实现对应切换。例如，若切换电路714检测到第六金手指726传输的信号是SIM卡的复位信号(SIM RST)，则导通第六金手指726与SIM卡电路713的复位接口(RST)。此时第六金手指726与存储卡电路712的参考时钟接口(RCLK)处于断开状态。若切换电路714检测到第六金手指726传输的信号是存储卡的参考时钟信号(NM RCLK)，则导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)。此时，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
在本实施例中，二合一卡7通过切换电路714实现两路信号的传输切换，使得SIM卡的复位信号(SIM RST)和存储卡电路712的参考时钟接口(RCLK)均能够通过第六金手指726实现传输，使得二合一卡7的卡接口72的集成度高，且与SIM卡电路713的接口及存储卡电路712的接口的连接电路切换难度低，易实现，使得二合一卡7的可靠性高。
其中，由于SIM卡的复位信号(SIM RST)不是常用信号，切换电路714的默认状态可以设为导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)，第六金手指726与SIM卡电路713的复位接口(RST)处于断开状态。
在本实施例中，SIM卡的复位操作并非频繁操作，且复位过程能够很快完成，在SIM 卡需要复位时，先将二合一卡7的第六金手指726导通至SIM卡的复位接口(RST)，以保证用户的联网体验，当SIM卡的复位过程完成后，则第六金手指726切回至导通存储卡电路712，以继续完成读写操作，从而提高二合一卡7的工作效率。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
请结合参阅图27和图28A，图28A是图27所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、开关203、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VDD1)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图28A中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，SIM卡控制器202包括复位接口(RST)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)。其中，开关203可以连接SIM卡控制器202包括复位接口(RST)和存储卡控制器201的其中一个接口，开关203还连接卡连接器11的十个弹片中的其中一个弹片。
在本实施例中，由于二合一卡7的SIM卡电路的复位操作并非频繁操作，且复位过程能够很快完成，当复位接口(RST)和存储卡控制器201的其中一个接口复用同一个弹片时，可以通过分时复用的方式充分利用该弹片进行信号传输，例如，在二合一卡7的SIM卡电路需要复位时，先将卡连接器11的某一弹片导通至SIM卡控制器202包括复位接口 (RST)，以保证用户的联网体验，当二合一卡7的SIM卡模块的复位过程完成后，则该弹片切回至导通存储卡控制器201，以继续完成对二合一卡7的读写操作，从而提高电子设备的工作效率。
一些实施例中，存储卡控制器201支持PCIE接口协议。存储卡控制器201包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VDD2)以及参考时钟接口(RCLK)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202还包括数据接口(DATA)以及时钟接口(CLK)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
其中，开关还连接存储卡控制器201的参考时钟接口(RCLK)，卡连接器11的十个弹片中的其中七个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的第二电源接口(VDD2)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的数据接口(DATA)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)分别电连接卡连接器11的第二弹片、第五弹片、第九弹片以及第十弹片，存储卡控制器201的第二电源接口(VDD2)电连接卡连接器11的第一弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第四弹片。开关203连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的复位接口(RST)，开关203还连接卡连接器11的第六弹片。开关203用于导通第六弹片与存储卡控制器201的参考时钟接口(RCLK)，或者导通第六弹片与SIM卡控制器202的复位接口(RST)。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第二弹片、第五弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第一弹片与二合一卡7之间进行存储卡的第二电源信号(NM VDD2)的传输，经第六弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VDD1)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
其中，当电子设备需要存储数据时，控制开关203导通存储卡控制器201的参考时钟接口(RCLK)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为存储卡的参考时钟信号(NM RCLK)，切换电路714导通第六金手指726与存储卡电路712的参考时钟接口(RCLK)，以实现存储卡的参考时钟信号(NM RCLK)的传输。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经 第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。
其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，处理器20控制开关203导通SIM卡控制器202的复位接口(RST)与第六弹片，由第六弹片发送信号至二合一卡7的第六金手指726，连接第六金手指726的切换电路714识别传输信号或待传输信号为SIM卡的复位信号(SIM RST)，切换电路714导通第六金手指726与SIM卡电路713的复位接口(SIM RST)，以实现SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在本实施例中，SIM卡的复位操作并非频繁操作，且复位过程能够很快完成，在SIM卡需要复位时，先将二合一卡7的第六金手指726导通至SIM卡的复位接口(RST)，以保证用户的联网体验，当SIM卡的复位过程完成后，则第六金手指726切回至导通存储卡电路712，以继续完成读写操作，从而提高二合一卡7的工作效率。
在其他一些实施例中，二合一卡7的卡接口72的信号排布可以有其他方式。例如，第一金手指721用于传输存储卡的其中一个数据信号(例如NM RX-)，第二金手指722用于传输存储卡的第二电源信号(NM VDD2)，其他金手指的信号排布不变。此时，二合一卡7的第一金手指721连接存储卡电路712的其中一个数据接口(例如RX-)，第二金手指722电连接存储卡电路712的第二电源接口(VDD2)，其他接口与金手指的连接电路不变；电子设备的存储卡控制器201的其中一个数据接口(例如RX-)电连接第一弹片,存储卡控制器201的第二电源接口(VDD2)电连接第二弹片，其他接口与卡连接器11的弹片的连接电路不变；二合一卡7和电子设备的工作流程做适应性调整，此处不再赘述。
请参阅表8，表8为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图27所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表8
Figure PCTCN2022136647-appb-000012
Figure PCTCN2022136647-appb-000013
当电子设备兼容Nano SIM卡3和图27所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的数据接口(例如RX+)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的数据接口(例如RX+)与第五弹片。
请结合参阅图28B和表8，图28B是本申请实施例提供的电子设备在另一些实施例中的部分电路结构示意图。本实施例电子设备可以包括图28A对应电子设备的大部分技术内容，以下主要说明两者的区别。
一些实施例中，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图27所示二合一卡7。其中，电子设备的处理器20包括存储卡控制器201、第二存储卡控制器206、SIM卡控制器202以及接口控制器205，接口控制器205电连接存储卡控制器201、第二存储卡控制器206以及SIM卡控制器202，接口控制器205还电连接卡连接器11的多个弹片。
存储卡控制器201的接口协议(例如EMMC接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器202用于控制Nano SIM卡3运行，第二存储卡控制器206的接口协议(例如PCIE接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器205能够控制SIM卡控制器202经卡连接器11与信息卡通信、或者存储卡控制器201和SIM卡控制器202经卡连接器11与信息卡通信、或者第二存储卡控制器206经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器205控制SIM卡控制器202经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器205控制第二存储 卡控制器206经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器205控制存储卡控制器201和SIM卡控制器202经卡连接器11与二合一卡7进行通信。
其中，接口控制器205可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器20中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器205还可以包括多根导线。接口控制器205的示例性方案可以参阅图28B，此处不再赘述。本实施例的其他技术内容可以参考图28A对应实施例的相关描述，此处不再赘述。其中，开关203可以为接口控制器205的一部分。
在本实施例中，二合一卡7将存储卡的第二电源信号(NM VDD2)排布于第一金手指721，由于二合一卡7的第一金手指721与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，二合一卡7的第一金手指721无需与Nano SIM卡3和第一NM卡4复用电子设备的卡连接器11的同一个弹片，避免存储卡的第二电源信号(NM VDD2)与Nano SIM卡3和第一NM卡4的数据信号共用同一个弹片，以降低Nano SIM卡3和第一NM卡4插入电子设备、连接卡连接器11时，被存储卡的第二电源信号(NM VDD2)烧坏的风险，电子设备兼容Nano SIM卡3和第一NM卡4以及二合一卡7的可靠性较高。此外，第一NM卡4和Nano SIM卡3也无需部署用于避免电路被存储卡的第二电源信号(NM VDD2)烧坏的耐高压设计，能够降低成本。
二合一卡7将一个高速信号(例如NM RX-)排布于第二金手指722，由于二合一卡7的第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第二弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
请参阅图29，图29是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712采用EMMC接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA2、NM DATA3)，其中一个金手指用于传输存储卡的命令和响应信号(NM CMD)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)和存储卡的时钟信号(NM CLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)。
示例性的，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA3、NM DATA2)。以下实施例以第一金手指721用于传输数据信号(NM DATA0)、第二金手指722用于传输数据信号(NM DATA1)、第九金手指729用于传输数据信号(NM DATA3)、第十金手指7210用于传输数据信号(NM DATA2)，为例进行说明。在其他一些实施例中，第一金手指 721、第二金手指722、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第二金手指722传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)和存储卡的时钟信号(NM CLK)；第五金手指725用于传输存储卡的命令和响应信号(NM CMD)；第六金手指726用于传输SIM卡的复位信号(SIM RST)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的电源信号(NM VCC)。
请结合参阅图29和表9，表9是图29所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表9
Figure PCTCN2022136647-appb-000014
一些实施例中，存储卡电路712包括四个数据接口(DATA0、DATA1、DATA2、DATA3)、时钟接口(CLK)、命令和响应复用接口(CMD)、地接口(GND)以及电源接口(VCC)。存储卡电路712的四个数据接口(DATA0、DATA1、DATA2、DATA3)用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA2、NM DATA3)，存储卡电路712的时钟接口(CLK)用于传输存储卡的时钟信号(NM CLK)，存储卡电路712的命令和响应复用接口(CMD)用于传输存储卡的命令和响应信号(NM CMD)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的电源接口(VCC)用于传输存储卡的电源信号(NM VCC)。上述存储卡电路712的接口可以位于存储卡电路712的控制部分。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟 信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。上述SIM卡电路713的接口可以位于SIM卡电路713的控制部分。
其中，二合一卡7还包括分频器715。二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(DATA0、DATA1、DATA3、DATA2)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接存储卡电路712的时钟接口(CLK)，并经分频器715电连接SIM卡电路713的时钟接口(CLK)，第五金手指725电连接存储卡电路712的命令和响应复用接口(CMD)，第六金手指726电连接SIM卡电路713的复位接口(RST)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的电源接口(VCC)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第二金手指722、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第二金手指722、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第三金手指723、第五金手指725及第六金手指726也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，分频器715用于改变信号的频率。在本实施例中，通过设置分频器715，使得第四金手指724传输的初始的时钟信号可以为存储卡的时钟信号(NM CLK)，存储卡的时钟信号(NM CLK)直接传输给存储卡电路712的时钟接口(CLK)，分频器715对存储卡的时钟信号(NM CLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，而后将SIM卡的时钟信号(SIM CLK)传输给SIM卡电路713的时钟接口(CLK)。例如，存储卡的时钟信号(NM CLK)的频率为200MHz，经过分频器715，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
在本实施例中，二合一卡7可以通过同一个金手指(也即第四金手指724)实现存储卡的时钟信号(NM CLK)和SIM卡电路713的时钟接口(CLK)的复用，使得二合一卡7的卡接口72的集成度高，并且第四金手指724无需进行连接电路切换，二合一卡7的实现难度低，易实现，使得二合一卡7的可靠性高。其中，存储卡的时钟信号(NM CLK)和SIM卡电路713的时钟接口(CLK)可以时分复用第四金手指724，也可以同步使用第四金手指724，本申请对此不作严格限定。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通 过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
请结合参阅图29和图30，图30是图29所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、分频器204、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的电源信号(NM VCC)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图30中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，存储卡控制器201支持EMMC接口协议，存储卡控制器201包括时钟接口(CLK)，时钟接口(CLK)用于传输存储卡的时钟信号(NM CLK)。SIM卡控制器202包括时钟接口(CLK)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。存储卡控制器201的时钟接口(CLK)连接卡连接器11的十个弹片中的一个弹片，存储卡控制器201的时钟接口(CLK)经分频器204连接SIM卡控制器202的时钟接口(CLK)。
在本实施例中，分频器204连接存储卡控制器201的时钟接口(CLK)和SIM卡控制器202的时钟接口(CLK)，分频器204用于对存储卡控制器201的时钟接口(CLK)传输的存储卡的时钟信号(NM CLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，并与SIM卡控制器202的时钟接口(CLK)进行传输，使得SIM卡控制器202与存储卡控制器201实现时钟对齐。例如，存储卡的时钟信号(NM CLK)的频率为200MHz，经过分频 器204，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
由于电子设备的处理器20通过卡连接器11的其中一个弹片提供存储卡的时钟信号(NM CLK)，从而为二合一卡7提供需要的时钟信号，同时，存储卡控制器201的时钟接口(CLK)经分频器204连接SIM卡控制器202的时钟接口(CLK)，使得SIM卡控制器202的时钟能够与存储卡控制器201对齐，以提高电子设备与二合一卡7的通信效率和通信质量。
示例性的，存储卡控制器201支持EMMC接口协议。存储卡控制器201还包括四个数据接口(DATA0、DATA1、DATA2、DATA3)以及命令和响应复用接口(CMD)，四个数据接口(DATA0、DATA1、DATA2、DATA3)用于传输存储卡的数据信号(NM DATA0、NM DATA1、NM DATA2、NM DATA3)，命令和响应复用接口(CMD)用于传输存储卡的命令和响应信号(NM CMD)。SIM卡控制器202还包括复位接口(RST)和数据接口(DATA)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)。
其中，卡连接器11的十个弹片中的七个弹片一一对应地连接存储卡控制器201的四个数据接口(DATA0、DATA1、DATA3、DATA2)、存储卡控制器201的命令和响应复用接口(CMD)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的复位接口(RST)。
示例性的，存储卡控制器201的四个数据接口(DATA0、DATA1、DATA3、DATA2)一一对应地电连接卡连接器11的第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器201的时钟接口(CLK)电连接卡连接器11的第四弹片，存储卡控制器201的命令和响应复用接口(CMD)电连接卡连接器的第五弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的复位接口(RST)电连接卡连接器11的第六弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第二弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM DATA0、NM DATA1、NM DATA3、NM DATA2)的传输，经第五弹片与二合一卡7之间进行存储卡的命令和响应信号(NM CMD)的传输，经第四弹片与二合一卡7之间进行存储卡的时钟信号(NM CLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的电源信号(NM VCC)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202接收由存储卡控制器201发出的、经分频器204调整后的时钟信号，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。
其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，SIM卡控制器202经第六弹片与二合一卡7之间进行SIM卡的复位信号(SIM RST)的传输，控制SIM 卡电路713进行复位。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715。在电子设备的处理器20中，存储卡控制器201的时钟接口(CLK)和SIM卡控制器202的时钟接口(CLK)均电连接卡连接器11的第四弹片。在二合一卡7中，存储卡电路712的时钟接口(CLK)和SIM卡电路713的时钟接口(CLK)均电连接卡接口72的第四金手指724。存储卡控制器201经第四弹片发送存储卡的时钟信号(NM CLK)至第四金手指724，SIM卡控制器202经第四弹片发送SIM卡的时钟信号(SIM CLK)至第四金手指724，存储卡电路712和SIM卡电路713根据接收到的信号进行对应处理，也即，只处理电路可识别的时钟信号。例如，当第四金手指724传输的信号只有存储卡的时钟信号(NM CLK)时，存储卡电路712处理存储卡的时钟信号(NM CLK)；当第四金手指724传输的信号只有SIM卡的时钟信号(SIM CLK)时，SIM卡电路713处理SIM卡的时钟信号(SIM CLK)；当第四金手指724传输的信号有存储卡的时钟信号(NM CLK)和有SIM卡的时钟信号(SIM CLK)时，存储卡电路712处理存储卡的时钟信号(NM CLK)，例如采集100MHz以上的信号，SIM卡电路713处理SIM卡的时钟信号(SIM CLK)，例如采集5MHz以下的信号。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715，将SIM卡的时钟信号(SIM CLK)的频率提升至和存储卡的时钟信号(NM CLK)的频率相同，例如将SIM卡的时钟信号(SIM CLK)提升至存储卡的时钟信号(NM CLK)所需要的19.2MHz频率、或是20MHz频率，以实现时钟的共用。此时，电子设备中，存储卡控制器201的时钟接口(CLK)电连接SIM卡控制器202的时钟接口(CLK)，其中一个时钟接口电连接卡连接器11的第四弹片。二合一卡7中，存储卡电路712的时钟接口(CLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。
在其他一些实施例中，处理器20中可以将分频器204更换为开关，二合一卡7中可以不设置分频器715。此时，在电子设备的处理器20中，开关连接存储卡控制器201的时钟接口(CLK)和SIM卡控制器202的时钟接口(CLK)，还连接第四弹片；二合一卡7中，存储卡电路712的时钟接口(CLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。电子设备通过同一个弹片时分复用，提供存储卡的时钟信号和SIM卡的时钟信号，当有SIM卡业务时，提供SIM卡的时钟信号，当有存储卡业务时提供存储卡的时钟信号。在某些情况下，如果SIM卡的时钟信号和存储卡的时钟信号相同时，可提供相同的时钟信号。在某些情况下，如果SIM卡和存储卡同时有业务时，可优先提供SIM卡的时钟信号，存储卡的时钟信后待SIM卡结束业务后恢复提供。在其他一些实施例中，在处理器20将分频器204更换为开关的方案中，二合一卡7中的分频器715也可以更换为开关。
可以理解的是，存储卡的时钟信号(NM CLK)和SIM卡的时钟信号(SIM CLK)复用第四金手指724进行传输的实现方式还有其他方案，本申请对此不作严格限定。
请参阅表10，表10为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图29所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地 与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表10
Figure PCTCN2022136647-appb-000015
当电子设备兼容Nano SIM卡3和图29所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的命令与响应复用接口(CMD)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的命令与响应复用接口(CMD)与第五弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图29所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器以及SIM卡控制器，接口 控制器还电连接卡连接器11的多个弹片。存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4和二合一卡7的存储卡电路通信，用于控制第一NM卡4运行和控制二合一卡7的存储卡电路运行，SIM卡控制器202用于控制Nano SIM卡3运行。当不同的信息卡插入电子设备的卡座组件，与卡连接器11电连接时，接口控制器能够控制存储卡控制器和/或SIM卡控制器经卡连接器与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图30对应实施例的相关描述，此处不再赘述。
请参阅图31，图31是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712支持UFS接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的第二电源信号(NM VCCQ)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)和存储卡的参考时钟信号(NM RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VCC)。
示例性的，二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第五金手指725用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第五金手指725、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第五金手指725传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)和存储卡的参考时钟信号(NM RCLK)；第二金手指722用于传输存储卡的第二电源信号(NM VCCQ)；第六金手指726用于传输SIM卡的复位信号(SIM RST)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第 一电源信号(NM VCC)。
请结合参阅图31和表11，表11是图31所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表11
Figure PCTCN2022136647-appb-000016
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、参考时钟接口(RCLK)、第二电源接口(VCCQ)、地接口(GND)以及第一电源接口(VCC)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的第二电源接口(VCCQ)用于传输存储卡的第二电源信号(NM VCCQ)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VCC)用于传输存储卡的第一电源信号(NM VCC)。上述存储卡电路712的接口可以位于存储卡电路712的控制部分。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。上述SIM卡电路713的接口可以位于SIM卡电路713的控制部分。
其中，二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第二金手指722电连接存储卡电路712的第二电源接口(VCCQ)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接存储卡电路712的参考时钟接口(CLK)，并经分频器715电连接SIM卡电路713的时钟接口(CLK)，第六金手指726电连接SIM卡电路713的复位接口(RST)，第七金手指727电连接SIM卡电路713的地接口(GND) 和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VCC)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第五金手指725、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第五金手指725、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第二金手指722、第三金手指723及第六金手指726也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，分频器715用于改变信号的频率。在本实施例中，通过设置分频器715，使得第四金手指724传输的初始的时钟信号可以为存储卡的参考时钟信号(NM RCLK)，存储卡的参考时钟信号(NM RCLK)直接传输给存储卡电路712的参考时钟接口(RCLK)，分频器715对存储卡的参考时钟信号(NM RCLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，而后将SIM卡的时钟信号(SIM CLK)传输给SIM卡电路713的时钟接口(CLK)。例如，存储卡的参考时钟信号(NM RCLK)的频率为200MHz，经过分频器715，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
在本实施例中，二合一卡7可以通过同一个金手指(也即第四金手指724)实现存储卡的参考时钟信号(NM RCLK)和SIM卡电路713的时钟接口(CLK)的复用，使得二合一卡7的卡接口72的集成度高，并且第四金手指724无需进行连接电路切换，二合一卡7的实现难度低，易实现，使得二合一卡7的可靠性高。其中，存储卡的参考时钟信号(NM RCLK)和SIM卡电路713的时钟接口(CLK)可以时分复用第四金手指724，也可以同步使用第四金手指724，本申请对此不作严格限定。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
请结合参阅图31和图32,图32是图31所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制 器202、分频器204、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VCC)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图32中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，存储卡控制器201支持UFS接口协议。存储卡控制器201包括参考时钟接口(RCLK)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202包括时钟接口(CLK)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。存储卡控制器201的参考时钟接口(RCLK)连接卡连接器11的十个弹片中的一个弹片，存储卡控制器201的参考时钟接口(RCLK)经分频器204连接SIM卡控制器202的时钟接口(CLK)。
在本实施例中，分频器204连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)，分频器204用于对存储卡控制器201的参考时钟接口(RCLK)传输的存储卡的参考时钟信号(NM RCLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，并与SIM卡控制器202的时钟接口(CLK)进行传输，使得SIM卡控制器202与存储卡控制器201实现时钟对齐。例如，存储卡的参考时钟信号(NM RCLK)的频率为200MHz，经过分频器204，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
由于电子设备的处理器20通过卡连接器11的其中一个弹片提供存储卡的参考时钟信号(NM RCLK)，从而为二合一卡7提供需要的时钟信号，同时，存储卡控制器201的参考时钟接口(RCLK)经分频器204连接SIM卡控制器202的时钟接口(CLK)，使得SIM卡控制器202的时钟能够与存储卡控制器201对齐，以提高电子设备与二合一卡7的通信效率和通信质量。
示例性的，存储卡控制器201还包括四个数据接口(RX+、RX-、TX+、TX-)和第二电源接口(VCCQ)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号 (NM RX+、NM RX-、NM TX+、NM TX-)，第二电源接口(VCCQ)用于传输存储卡的第二电源信号(NM VCCQ)。SIM卡控制器202还包括复位接口(RST)和数据接口(DATA)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)。
其中，卡连接器11的十个弹片中的七个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的第二电源接口(VCCQ)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的复位接口(RST)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)一一对应地电连接卡连接器11的第一弹片、第五弹片、第九弹片以及第十弹片，第二电源接口(VCCQ)电连接卡连接器11的第二弹片，参考时钟接口(RCLK)电连接卡连接器11的第四弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的复位接口(RST)电连接卡连接器11的第六弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第五弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第二弹片与二合一卡7之间进行存储卡的第二电源信号(NM VCCQ)的传输，经第四弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VCC)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202接收由存储卡控制器201发出的、经分频器204调整后的时钟信号，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，SIM卡控制器202经第六弹片与二合一卡7之间进行SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715。在电子设备的处理器20中，存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)均电连接卡连接器11的第四弹片。在二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接卡接口72的第四金手指724。存储卡控制器201经第四弹片发送存储卡的参考时钟信号(NM RCLK)至第四金手指724，SIM卡控制器202经第四弹片发送SIM卡的时钟信号(SIM CLK)至第四金手指724，存储卡电路712和SIM卡电路713根据接收到的信号进行对应处理，也即，只处理电路可识别的时钟信号。例如，当第四金手指724传输的信号只有存储卡的参考时钟信号(NM RCLK)时，存储卡电路712处理存储卡的参考时钟信号(NM RCLK)；当第四金手指724传输的信号只有SIM卡的时钟信号(SIM CLK)时， SIM卡电路713处理SIM卡的时钟信号(SIM CLK)；当第四金手指724传输的信号有存储卡的参考时钟信号(NM RCLK)和有SIM卡的时钟信号(SIM CLK)时，存储卡电路712处理存储卡的参考时钟信号(NM RCLK)，例如采集100MHz以上的信号，SIM卡电路713处理SIM卡的时钟信号(SIM CLK)，例如采集5MHz以下的信号。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715，将SIM卡的时钟信号(SIM CLK)的频率提升至和存储卡的参考时钟信号(NM RCLK)的频率相同，例如将SIM卡的时钟信号(SIM CLK)提升至存储卡的参考时钟信号(NM RCLK)所需要的19.2MHz频率、或是20MHz频率，以实现时钟的共用。此时，电子设备中，存储卡控制器201的参考时钟接口(RCLK)电连接SIM卡控制器202的时钟接口(CLK)，其中一个时钟接口电连接卡连接器11的第四弹片。二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。
在其他一些实施例中，处理器20中可以将分频器204更换为开关，二合一卡7中可以不设置分频器715。此时，在电子设备的处理器20中，开关连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)，还连接第四弹片；二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。电子设备通过同一个弹片时分复用，提供存储卡的参考时钟信号和SIM卡的时钟信号，当有SIM卡业务时，提供SIM卡的时钟信号，当有存储卡业务时提供存储卡的参考时钟信号。在某些情况下，如果SIM卡的时钟信号和存储卡的参考时钟信号相同时，可提供相同的时钟信号。在某些情况下，如果SIM卡和存储卡同时有业务时，可优先提供SIM卡的时钟信号，存储卡的参考时钟信后待SIM卡结束业务后恢复提供。在其他一些实施例中，在处理器20将分频器204更换为开关的方案中，二合一卡7中的分频器715也可以更换为开关。
可以理解的是，存储卡的参考时钟信号(NM RCLK)和SIM卡的时钟信号(SIM CLK)复用第四金手指724进行传输的实现方式还有其他方案，本申请对此不作严格限定。
在其他一些实施例中，二合一卡7的卡接口72的信号排布可以有其他方式。例如，第一金手指721用于传输存储卡的第二电源信号(NM VCCQ)，第二金手指722用于传输存储卡的其中一个数据信号(例如NM RX+)，其他金手指的信号排布不变。此时，二合一卡7的第一金手指721电连接存储卡电路712的第二电源接口(VCCQ)，第二金手指722连接存储卡电路712的其中一个数据接口(例如RX+)，其他接口与金手指的连接电路不变；电子设备的存储卡控制器201的第二电源接口(VCCQ)电连接第一弹片，存储卡控制器201的其中一个数据接口(例如RX+)电连接第二弹片，其他接口与卡连接器11的弹片的连接电路不变；二合一卡7和电子设备的工作流程做适应性调整，此处不再赘述。
请参阅表12，表12为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图31所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡 7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表12
Figure PCTCN2022136647-appb-000017
当电子设备兼容Nano SIM卡3和图31所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的数据接口(例如RX-)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的数据接口(例如RX-)与第五弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图31所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、第二存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器、第二存储卡控制器以及SIM卡控制器，接口控制器还电连接卡连接器11的多个弹片。
存储卡控制器的接口协议(例如UFS接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器用于控制Nano SIM卡3运行，第二存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器能够控制SIM卡控制器经卡连接器11与信息卡通信、或者存储卡控制器和SIM卡控制器经卡连接器11与信息卡通信、或者第二存储卡控制器经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制第二存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图32对应实施例的相关描述，此处不再赘述。
在本实施例中，二合一卡7将一个高速信号(例如NM RX+)排布于第一金手指721，由于二合一卡7的第一金手指721与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
二合一卡7将存储卡的第二电源信号(NM VCCQ)排布于第二金手指722，由于二合一卡7的第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，二合一卡7的第二金手指722无需与Nano SIM卡3和第一NM卡4复用电子设备的卡连接器11的同一个弹片，避免存储卡的第二电源信号(NM VCCQ)与Nano SIM卡3和第一NM卡4的数据信号共用同一个弹片，以降低Nano SIM卡3和第一NM卡4插入电子设备、连接卡连接器11时，被存储卡的第二电源信号(NM VCCQ)烧坏的风险，电子设备兼容Nano SIM卡3和第一NM卡4以及二合一卡7的可靠性较高。此外，第一NM卡4和Nano SIM卡3也无需部署用于避免电路被存储卡的第二电源信号(NM VCCQ)烧坏的耐高压设计，能够降低成本。
请参阅图33，图33是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712采用PCIE接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的第二电源信号(NM VDD2)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)和存储卡的参考时钟信号(NM  RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
示例性的，二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第五金手指725用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第五金手指725、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第五金手指725传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)和存储卡的参考时钟信号(NM RCLK)；第二金手指722用于传输存储卡的第二电源信号(NM VDD2)；第六金手指726用于传输SIM卡的复位信号(SIM RST)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
请结合参阅图33和表13，表13是图33所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表13
Figure PCTCN2022136647-appb-000018
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、参考时钟接口(RCLK)、第二电源接口(VDD2)、地接口(GND)以及第一电源接口(VDD1)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的第二电源接口(VDD2)用于传 输存储卡的第二电源信号(NM VDD2)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VDD1)用于传输存储卡的第一电源信号(NM VDD1)。上述存储卡电路712的接口可以位于存储卡电路712的控制部分。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。上述SIM卡电路713的接口可以位于SIM卡电路713的控制部分。
其中，二合一卡7的第一金手指721、第五金手指725、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第二金手指722电连接存储卡电路712的第二电源接口(VDD2)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接存储卡电路712的参考时钟接口(CLK)，并经分频器715电连接SIM卡电路713的时钟接口(CLK)，第六金手指726电连接SIM卡电路713的复位接口(RST)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VDD1)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第五金手指725、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第五金手指725、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第二金手指722、第三金手指723及第六金手指726也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，分频器715用于改变信号的频率。在本实施例中，通过设置分频器715，使得第四金手指724传输的初始的时钟信号可以为存储卡的参考时钟信号(NM RCLK)，存储卡的参考时钟信号(NM RCLK)直接传输给存储卡电路712的参考时钟接口(RCLK)，分频器715对存储卡的参考时钟信号(NM RCLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，而后将SIM卡的时钟信号(SIM CLK)传输给SIM卡电路713的时钟接口(CLK)。例如，存储卡的参考时钟信号(NM RCLK)的频率为200MHz，经过分频器715，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
在本实施例中，二合一卡7可以通过同一个金手指(也即第四金手指724)实现存储卡的参考时钟信号(NM RCLK)和SIM卡电路713的时钟接口(CLK)的复用，使得二合一卡7的卡接口72的集成度高，并且第四金手指724无需进行连接电路切换，二合一卡7的实现难度低，易实现，使得二合一卡7的可靠性高。其中，存储卡的参考时钟信号(NM RCLK)和SIM卡电路713的时钟接口(CLK)可以时分复用第四金手指724，也可以同步使用第四金手指724，本申请对此不作严格限定。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
一些实施例中，请结合参阅图33和图34，图34是图33所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、分频器204、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VDD1)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图34中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201的接口和SIM卡控制器202的接口连接卡连接器11的十个弹片中的八个弹片。电源接口连接至十个弹片中的另一个弹片，地接口连接至十个弹片中的另一个弹片。在本实施例中，电子设备通过卡连接器11的十个弹片实现与二合一卡7的通话、数据通信及数据存储等交互，弹片数量少，卡连接器11及卡座组件的体积小，有利于电子设备的轻薄化。
示例性的，存储卡控制器201支持PCIE接口协议。存储卡控制器201包括参考时钟接口(RCLK)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202包括时钟接口(CLK)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。存储卡控制器201的参考时钟接口(RCLK)连接卡连接器11的十个弹片中的一个弹片，存储卡控制器201的参考时钟接口(RCLK)经分频器204连接SIM卡控制器202 的时钟接口(CLK)。
在本实施例中，分频器204连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)，分频器204用于对存储卡控制器201的参考时钟接口(RCLK)传输的存储卡的参考时钟信号(NM RCLK)进行频率调整，形成SIM卡的时钟信号(SIM CLK)，并与SIM卡控制器202的时钟接口(CLK)进行传输，使得SIM卡控制器202与存储卡控制器201实现时钟对齐。例如，存储卡的参考时钟信号(NM RCLK)的频率为200MHz，经过分频器204，可以将频率调整为5MHz，形成SIM卡的时钟信号(SIM CLK)。
由于电子设备的处理器20通过卡连接器11的其中一个弹片提供存储卡的参考时钟信号(NM RCLK)，从而为二合一卡7提供需要的时钟信号，同时，存储卡控制器201的参考时钟接口(RCLK)经分频器204连接SIM卡控制器202的时钟接口(CLK)，使得SIM卡控制器202的时钟能够与存储卡控制器201对齐，以提高电子设备与二合一卡7的通信效率和通信质量。
示例性的，存储卡控制器201还包括四个数据接口(RX+、RX-、TX+、TX-)和第二电源接口(VDD2)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)。SIM卡控制器202包括复位接口(RST)和数据接口(DATA)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)。
其中，卡连接器11的十个弹片中的七个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的第二电源接口(VDD2)、SIM卡控制器202的数据接口(DATA)以及SIM卡控制器202的复位接口(RST)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)一一对应地电连接卡连接器11的第一弹片、第五弹片、第九弹片以及第十弹片，第二电源接口(VDD2)电连接卡连接器11的第二弹片，参考时钟接口(RCLK)电连接卡连接器11的第四弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的复位接口(RST)电连接卡连接器11的第六弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第五弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第二弹片与二合一卡7之间进行存储卡的第二电源信号(NM VDD2)的传输，经第四弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VDD1)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202接收由存储卡控制器201发出的、经分频器204调整后的时钟信号，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输；处理器20的电 源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，SIM卡控制器202经第六弹片与二合一卡之间进行SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715。在电子设备的处理器20中，存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)均电连接卡连接器11的第四弹片。在二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接卡接口72的第四金手指724。存储卡控制器201经第四弹片发送存储卡的参考时钟信号(NM RCLK)至第四金手指724，SIM卡控制器202经第四弹片发送SIM卡的时钟信号(SIM CLK)至第四金手指724，存储卡电路712和SIM卡电路713根据接收到的信号进行对应处理，也即，只处理电路可识别的时钟信号。例如，当第四金手指724传输的信号只有存储卡的参考时钟信号(NM RCLK)时，存储卡电路712处理存储卡的参考时钟信号(NM RCLK)；当第四金手指724传输的信号只有SIM卡的时钟信号(SIM CLK)时，SIM卡电路713处理SIM卡的时钟信号(SIM CLK)；当第四金手指724传输的信号有存储卡的参考时钟信号(NM RCLK)和有SIM卡的时钟信号(SIM CLK)时，存储卡电路712处理存储卡的参考时钟信号(NM RCLK)，例如采集100MHz以上的信号，SIM卡电路713处理SIM卡的时钟信号(SIM CLK)，例如采集5MHz以下的信号。
在其他一些实施例中，处理器20中可以不设置分频器204，二合一卡7中也可以不设置分频器715，将SIM卡的时钟信号(SIM CLK)的频率提升至和存储卡的参考时钟信号(NM RCLK)的频率相同，例如将SIM卡的时钟信号(SIM CLK)提升至存储卡的参考时钟信号(NM RCLK)所需要的19.2MHz频率、或是20MHz频率，以实现时钟的共用。此时，电子设备中，存储卡控制器201的参考时钟接口(RCLK)电连接SIM卡控制器202的时钟接口(CLK)，其中一个时钟接口电连接卡连接器11的第四弹片。二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。
在其他一些实施例中，处理器20中可以将分频器204更换为开关，二合一卡7中可以不设置分频器715。此时，在电子设备的处理器20中，开关连接存储卡控制器201的参考时钟接口(RCLK)和SIM卡控制器202的时钟接口(CLK)，还连接第四弹片；二合一卡7中，存储卡电路712的参考时钟接口(RCLK)和SIM卡电路713的时钟接口(CLK)均电连接第四金手指724。电子设备通过同一个弹片时分复用，提供存储卡的参考时钟信号和SIM卡的时钟信号，当有SIM卡业务时，提供SIM卡的时钟信号，当有存储卡业务时提供存储卡的参考时钟信号。在某些情况下，如果SIM卡的时钟信号和存储卡的参考时钟信号相同时，可提供相同的时钟信号。在某些情况下，如果SIM卡和存储卡同时有业务时，可优先提供SIM卡的时钟信号，存储卡的参考时钟信后待SIM卡结束业务后恢复提供。在其他一些实施例中，在处理器20将分频器204更换为开关的方案中，二合一卡7中的分频器715也可以更换为开关。
可以理解的是，存储卡的参考时钟信号(NM RCLK)和SIM卡的时钟信号(SIM CLK)复用第四金手指724进行传输的实现方式还有其他方案，本申请对此不作严格限定。
在其他一些实施例中，二合一卡7的卡接口72的信号排布可以有其他方式。例如，第二金手指722用于传输存储卡的其中一个数据信号(例如NM RX+)，第一金手指721用于传输存储卡的第二电源信号(NM VDD2)，其他金手指的信号排布不变。此时，二合一卡7的第二金手指722连接存储卡电路712的其中一个数据接口(例如RX+)，第一金手指721电连接存储卡电路712的第二电源接口(VDD2)，其他接口与金手指的连接电路不变；电子设备的存储卡控制器201的其中一个数据接口(例如RX+)电连接第二弹片,存储卡控制器201的第二电源接口(VDD2)电连接第一弹片，其他接口与卡连接器11的弹片的连接电路不变；二合一卡7和电子设备的工作流程做适应性调整，此处不再赘述。
请参阅表14，表14为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图33所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表14
Figure PCTCN2022136647-appb-000019
Figure PCTCN2022136647-appb-000020
当电子设备兼容Nano SIM卡3和图33所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的数据接口(例如RX-)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的数据接口(例如RX-)与第五弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图31所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、第二存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器、第二存储卡控制器以及SIM卡控制器，接口控制器还电连接卡连接器11的多个弹片。
存储卡控制器的接口协议(例如PCIE接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器用于控制Nano SIM卡3运行，第二存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器能够控制SIM卡控制器经卡连接器11与信息卡通信、或者存储卡控制器和SIM卡控制器经卡连接器11与信息卡通信、或者第二存储卡控制器经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制第二存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图32对应实施例的相关描述，此处不再赘述。
在本实施例中，二合一卡7将一个高速信号(例如NM RX+)排布于第一金手指721，由于二合一卡7的第一金手指721与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
二合一卡7将存储卡的第二电源信号(NM VDD2)排布于第二金手指722，由于二合一卡7的第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关 系，二合一卡7的第二金手指722无需与Nano SIM卡3和第一NM卡4复用电子设备的卡连接器11的同一个弹片，避免存储卡的第二电源信号(NM VDD2)与Nano SIM卡3和第一NM卡4的数据信号共用同一个弹片，以降低Nano SIM卡3和第一NM卡4插入电子设备、连接卡连接器11时，被存储卡的第二电源信号(NM VDD2)烧坏的风险，电子设备兼容Nano SIM卡3和第一NM卡4以及二合一卡7的可靠性较高。此外，第一NM卡4和Nano SIM卡3也无需部署用于避免电路被存储卡的第二电源信号(NM VDD2)烧坏的耐高压设计，能够降低成本。
请参阅图35，图35是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712支持UFS接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的参考时钟信号(NM RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VCC)。
示例性的，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第二金手指722用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第二金手指722、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第二金手指722传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第五金手指725用于传输存储卡的参考时钟信号(NM RCLK)；第六金手指726用于传输SIM卡的复位信号(SIM RST)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VCC)。
请结合参阅图35和表15，表15是图35所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表15
Figure PCTCN2022136647-appb-000021
Figure PCTCN2022136647-appb-000022
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VCCQ)、参考时钟接口(RCLK)、地接口(GND)以及第一电源接口(VCC)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的第二电源接口(VCCQ)用于传输存储卡的第二电源信号(NM VCCQ)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VCC)用于传输存储卡的第一电源信号(NM VCC)。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。
其中，二合一卡7还包括电压调节器716。二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713的时钟接口(CLK)，第五金手指725电连接存储卡电路712的参考时钟接口(RCLK)，第六金手指726电连接SIM卡电路713的复位接口(RST)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VCC)。其中，第八金手指728还通过电压调节器716电连接存储卡电路712的第二电源接口(VCCQ)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第二金手指722、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第二金手指722、 第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第三金手指723至第六金手指726也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
示例性的，第八金手指728通过电压调节器716电连接存储卡电路712的第二电源接口(VCCQ)，电压调节器716能够对第八金手指728传输的电源信号进行调压，从而形成存储卡的第二电源信号(NM VCCQ)，并传输至存储卡电路712的第二电源接口(VCCQ)。例如，存储卡的第一电源信号(NM VCC)的电压为2.5V，电压调节器716可以调节至1.2V至1.25V，以形成存储卡的第二电源信号(NM VCCQ)。
在本实施例中，由于存储卡的第二电源信号(NM VCCQ)可以通过存储卡的第一电源信号(NM VCC)调压获得，因此无需通过单独的金手指进行数据传输，从而节约二合一卡7的卡接口72的金手指数量，提高了卡接口72的集成度，并且二合一卡7内部的电路结构简单，易实现。
请结合参阅图35和图36，图36是图35所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VCC)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图36中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201支持UFS接口协议。存储卡控制器201包括四个数据接口(RX+、RX-、TX+、TX-)和参考时钟接口(RCLK)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202包括复位接口(RST)、数据接口(DATA)以及时钟接口(CLK)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
其中，卡连接器11的十个弹片中的八个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的参考时钟接口(RCLK)、SIM卡控制器202的数据接口(DATA)、SIM卡控制器202的时钟接口(CLK)、以及SIM卡控制器202的复位接口(RST)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)分别电连接卡连接器11的第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器201的参考时钟接口(RCLK)电连接卡连接器11的第五弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的时钟接口(CLK)电连接卡连接器11的第四弹片，SIM卡控制器202的复位接口(RST)电连接第六弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第二弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第五弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VCC)的传输，存储卡的第一电源信号(NM VCC)在二合一卡7中，经电压调节器716调整为存储卡的第二电源信号(NM VCCQ)，与存储卡电路712进行传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，经第六弹片与二合一卡7进行SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
请参阅表16，表16为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图35所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡 7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表16
Figure PCTCN2022136647-appb-000023
当电子设备兼容Nano SIM卡3和图35所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置开关，开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及存储卡控制器201的参考时钟接口(RCLK)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，开关导通存储卡控制器201的参考时钟接口(RCLK)与第五弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图35所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、第二存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器、第二存储卡控制器以及SIM卡控制器，接口控制器还电连接卡连接器11的多个弹片。
存储卡控制器的接口协议(例如UFS接口协议)能够与二合一卡7的存储卡电路通信， 用于控制二合一卡7的存储卡电路运行，SIM卡控制器用于控制Nano SIM卡3运行，第二存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器能够控制SIM卡控制器经卡连接器11与信息卡通信、或者存储卡控制器和SIM卡控制器经卡连接器11与信息卡通信、或者第二存储卡控制器经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制第二存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图32对应实施例的相关描述，此处不再赘述。
在本实施例中，二合一卡7将两个高速信号(例如NM RX+、NM RX-)分别排布于第一金手指721和第二金手指722，由于二合一卡7的第一金手指721和第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片和第二弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
请参阅图37，图37是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712采用PCIE接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的参考时钟信号(NM RCLK)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
示例性的，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第二金手指722用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第二金手指722、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第二金手指722传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第五金手指725用于传输SIM卡的复位信号(SIM RST)；第六金手指726用于传输存储卡的参考时钟信号(NM RCLK)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
请结合参阅图37和表17，表17是图37所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表17
Figure PCTCN2022136647-appb-000024
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VDD2)、参考时钟接口(RCLK)、地接口(GND)以及第一电源接口(VDD1)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VDD1)用于传输存储卡的第一电源信号(NM VDD1)。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。
其中，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713 的时钟接口(CLK)，第五金手指725电连接SIM卡电路713的复位接口(RST)，第六金手指726电连接存储卡电路712的参考时钟接口(RCLK)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VDD1)。其中，第八金手指728还通过电压调节器716电连接存储卡电路712的第二电源接口(VDD2)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第二金手指722、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第二金手指722、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第三金手指723至第六金手指726也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
示例性的，第八金手指728通过电压调节器716电连接存储卡电路712的第二电源接口(VDD2)，电压调节器716能够对第八金手指728传输的电源信号进行调压，从而形成存储卡的第二电源信号(NM VDD2)，并传输至存储卡电路712的第二电源接口(VDD2)。
在本实施例中，由于存储卡的第二电源信号(NM VDD2)可以通过存储卡的第一电源信号(NM VDD1)调压获得，因此无需通过单独的金手指进行数据传输，从而节约二合一卡7的卡接口72的金手指数量，提高了卡接口72的集成度，并且二合一卡7内部的电路结构简单，易实现。
请结合参阅图37和图38，图38是图37所示二合一卡7与一种电子设备的连接电路示意图。
一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器 拆分在多个部件中，本申请实施例对此不作严格限定。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VDD1)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图38中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201支持PCIE接口协议。存储卡控制器201包括四个数据接口(RX+、RX-、TX+、TX-)和参考时钟接口(RCLK)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)。SIM卡控制器202包括复位接口(RST)、数据接口(DATA)以及时钟接口(CLK)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
其中，卡连接器11的十个弹片中的八个弹片一一对应地连接存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)、存储卡控制器201的参考时钟接口(RCLK)、SIM卡控制器202的数据接口(DATA)、SIM卡控制器202的时钟接口(CLK)、以及SIM卡控制器202的复位接口(RST)。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)分别电连接卡连接器11的第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器201的参考时钟接口(RCLK)电连接卡连接器11的第六弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的时钟接口(CLK)电连接卡连接器11的第四弹片，SIM卡控制器202的复位接口(RST)电连接第五弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第二弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第六弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VDD1)的传输，存储卡的第一电源信号(NM VDD1)在二合一卡7中，经电压调节器716调整为存储卡的第二电源信号(NM VDD2)，与存储卡电路712进行传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经 第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，经第五弹片与二合一卡7进行SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在其他一些实施例中，二合一卡7的第五金手指725可以用于传输存储卡的参考时钟信号(NM RCLK)，第六金手指726用于传输SIM卡的复位信号(SIM RST)。此时，存储卡电路712的参考时钟接口(RCLK)电连接卡接口72的第五金手指725，SIM卡电路713的复位接口(RST)电连接卡接口72的第五金手指725。在电子设备侧，存储卡控制器201的参考时钟接口(RCLK)电连接卡连接器11的第五弹片，SIM卡控制器202的复位接口(RST)电连接卡连接器11的第六弹片。
请参阅表18，表18为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图37所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表18
Figure PCTCN2022136647-appb-000025
Figure PCTCN2022136647-appb-000026
当电子设备兼容Nano SIM卡3和图37所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置第一开关，第一开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及SIM卡控制器202的复位接口(RST)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，第一开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，第一开关导通SIM卡控制器202的复位接口(RST)与第五弹片。
电子设备的处理器20包括第二开关，第二开关连接SIM卡控制器202的复位接口(RST)和存储卡控制器201的参考时钟接口(RCLK)，还连接卡连接器11的第六弹片。当电子设备插入Nano SIM卡3时，第二开关导通SIM卡控制器202的复位接口(RST)与第六弹片；当电子设备插入二合一卡7时，第二开关导通存储卡控制器201的参考时钟接口(RCLK)与第六弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图35所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、第二存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器、第二存储卡控制器以及SIM卡控制器，接口控制器还电连接卡连接器11的多个弹片。
存储卡控制器的接口协议(例如PCIE接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器用于控制Nano SIM卡3运行，第二存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器能够控制SIM卡控制器经卡连接器11与信息卡通信、或者存储卡控制器和SIM卡控制器经卡连接器11与信息卡通信、或者第二存储卡控制器经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制第二存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图32对应实施例的相关描述，此处不再赘述。
在本实施例中，二合一卡7将两个高速信号(例如NM RX+、NM RX-)分别排布于第一金手指721和第二金手指722，由于二合一卡7的第一金手指721和第二金手指722与 Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片和第二弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
请参阅图39，图39是图17所示二合一卡7在另一些实施例中的示意图。
一些实施例中，二合一卡7的存储卡电路712采用PCIE接口协议。二合一卡7的卡接口72包括第一金手指721至第十金手指7210。在第一金手指721至第十金手指7210中，其中一个金手指用于传输SIM卡的数据信号(SIM DATA)，其中一个金手指用于传输SIM卡的时钟信号(SIM CLK)，其中一个金手指用于传输SIM卡的复位信号(SIM RST)，其中四个金手指用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，其中一个金手指用于传输存储卡的参考时钟信号(NM RCLK)和存储卡的第二电源信号(NM VDD2)，其中一个金手指用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)，其中一个金手指用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
示例性的，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)。以下实施例以第一金手指721用于传输数据信号(NM RX+)、第二金手指722用于传输数据信号(NM RX-)、第九金手指729用于传输数据信号(NM TX+)、第十金手指7210用于传输数据信号(NM TX-)，为例进行说明。在其他一些实施例中，第一金手指721、第二金手指722、第九金手指729及第十金手指7210传输的数据信号能够互相调换。例如，第一金手指721与第二金手指722传输的数据信号互相调换，第九金手指729与第十金手指7210传输的数据信号互相调换，其他实施例此处不再赘述。
第三金手指723用于传输SIM卡的数据信号(SIM DATA)；第四金手指724用于传输SIM卡的时钟信号(SIM CLK)；第五金手指725用于传输SIM卡的复位信号(SIM RST)；第六金手指726用于传输存储卡的参考时钟信号(NM RCLK)和存储卡的第二电源信号(NM VDD2)；第七金手指727用于传输SIM卡的地信号(SIM GND)和存储卡的地信号(NM GND)；第八金手指728用于传输SIM卡的电源信号(SIM VCC)和存储卡的第一电源信号(NM VDD1)。
请结合参阅图39和表19，表19是图39所示二合一卡7的金手指与电路的接口对应关系的示意表。在本申请实施例中，为了便于示意，后文及附图中涉及的电路的接口或控制器的接口，均以其传输的信号进行对应标识。
表19
Figure PCTCN2022136647-appb-000027
Figure PCTCN2022136647-appb-000028
一些实施例中，存储卡电路712包括四个数据接口(RX+、RX-、TX+、TX-)、第二电源接口(VDD2)、参考时钟接口(RCLK)、地接口(GND)以及第一电源接口(VDD1)。存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，存储卡电路712的第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)，存储卡电路712的参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，存储卡电路712的地接口(GND)用于传输存储卡的地信号(NM GND)，存储卡电路712的第一电源接口(VDD1)用于传输存储卡的第一电源信号(NM VDD1)。
SIM卡电路713包括数据接口(DATA)、时钟接口(CLK)、复位接口(RST)、地接口(GND)、以及电源接口(VCC)。SIM卡电路713的数据接口(DATA)用于传输SIM卡的数据信号(SIM DATA)，SIM卡电路713的时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)，SIM卡电路713的复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，SIM卡电路713的地接口(GND)用于传输SIM卡的地信号(SIM GND)，SIM卡电路713的电源接口(VCC)用于传输SIM卡的电源信号(SIM VCC)。
其中，二合一卡7的第一金手指721、第二金手指722、第九金手指729及第十金手指7210分别电连接存储卡电路712的四个数据接口(RX+、RX-、TX+、TX-)，第三金手指723电连接SIM卡电路713的数据接口(DATA)，第四金手指724电连接SIM卡电路713的时钟接口(CLK)，第五金手指725电连接SIM卡电路713的复位接口(RST)，第六金手指726电连接存储卡电路712的参考时钟接口(RCLK)和存储卡电路712的第二电源接口(VDD2)，第七金手指727电连接SIM卡电路713的地接口(GND)和存储卡电路712的地接口(GND)，第八金手指728电连接SIM卡电路713的电源接口(VCC)和存储卡电路712的第一电源接口(VDD1)。
在本实施例中，二合一卡7通过第一金手指721至第十金手指7210实现SIM卡电路713的信号传输和存储卡电路712的信号传输，使得二合一卡7能够集成SIM卡功能和存储卡功能，实现了多功能化，提高了集成度。电子设备插接二合一卡7时，能够有效减少需要插接的信息卡数量，减少卡座组件的数量，有利于电子设备的轻薄化，也能够提高用户的使用体验。
此外，第一金手指721、第二金手指722、第九金手指729及第十金手指7210为存储卡电路712的独占金手指，用于传输存储卡的高速数据，第一金手指721、第二金手指722、第九金手指729及第十金手指7210无需进行高速数据接口与低速数据接口的连接电路切换设计，能够有效降低二合一卡7的内部电路设计难度，易实现。
此外，第三金手指723至第五金手指725也为SIM卡电路713或存储卡电路712独占的金手指，这部分金手指同样无需进行连接电路的切换设计，使得二合一卡7的内部电路设计难度低，易实现。
示例性的，SIM卡电路713和存储卡电路712均通过第七金手指727传输地信号，通过第八金手指728传输电源信号，二合一卡7可以不设置相关的连接电路的切换方案，或者切换方案易实现，因此既能够提高二合一卡7的卡接口72的集成度，并且内部电路设计难度低，使得二合一卡7的可靠性高，成本低。SIM卡电路713和存储卡电路712经第七金手指727和第八金手指728传输地信号和电源信号的方案，具体的可参考前文实施例的相关描述，此处不再赘述。
二合一卡7中设置分离电路717，分离电路717电连接第六金手指726和存储卡电路712的参考时钟接口(RCLK)和存储卡电路712的第二电源接口(VDD2)，分离电路717用于将第六金手指726传输的信号分离出存储卡的参考时钟信号(NM RCLK)并传输至存储卡电路712的参考时钟接口(RCLK)，还用于将第六金手指726传输的信号分离出存储卡的第二电源信号(NM VDD2)并传输至存储卡电路712的第二电源接口(VDD2)。
请结合参阅图39和图40，图40是图39所示二合一卡7与一种电子设备的连接电路示意图。一些实施例中，二合一卡7插入电子设备的卡座组件，与卡连接器11电连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持并电连接二合一卡7的第一金手指721至第十金手指7210。示例性的，电子设备的处理器20可以包括存储卡控制器201、SIM卡控制器202、电源接口及地接口。存储卡控制器201可以用于控制二合一卡7的存储卡电路的运行，SIM卡控制器202可以用于控制二合一卡7的SIM卡电路的运行。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。其中，处理器20的多个控制器可以为彼此独立的部件，也可以通过集成部件进行组合，也可以一个控制器拆分在多个部件中，本申请实施例对此不作严格限定。
示例性的，处理器20的电源接口用于传输电源信号，地接口用于传输地信号。其中，电源信号可以为SIM卡的电源信号(SIM VCC)或存储卡的第一电源信号(NM VDD1)，地信号可以为存储卡的地信号(NM GND)或SIM卡的地信号(SIM GND)。其中，电源接口和地接口可以独立在SIM卡控制器202和存储卡控制器201之外，也可以各自拆分后、集成在SIM卡控制器202和存储卡控制器201中，本申请实施例对此不作严格限定。图40中以及后续附图中，以电源接口和地接口相对SIM卡控制器202和存储卡控制器201独立为例进行示意，并分别标识为电源和地。
示例性的，存储卡控制器201支持PCIE接口协议。存储卡控制器201包括四个数据接口(RX+、RX-、TX+、TX-)、参考时钟接口(RCLK)以及第二电源接口(VDD2)，四个数据接口(RX+、RX-、TX+、TX-)用于传输存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)，参考时钟接口(RCLK)用于传输存储卡的参考时钟信号(NM RCLK)，第二电源接口(VDD2)用于传输存储卡的第二电源信号(NM VDD2)。SIM卡控制器202包括复位接口(RST)、数据接口(DATA)以及时钟接口(CLK)，复位接口(RST)用于传输SIM卡的复位信号(SIM RST)，数据接口(DATA)用于传输SIM卡的数据信号(SIM  DATA)，时钟接口(CLK)用于传输SIM卡的时钟信号(SIM CLK)。
示例性的，存储卡控制器201的参考时钟接口(RCLK)和第二电源接口(VDD2)连接至卡连接器11的十个弹片中的同一个弹片。在本实施例中，由于存储卡的参考时钟信号(NM RCLK)和存储卡的第二电源信号(NM VDD2)可以分离，因此通过卡连接器11的同一个弹片传输这两个信号，能够减少卡连接器11的弹片数量，从而减小其面积，有利于电子设备的小型化。
示例性的，存储卡控制器201的四个数据接口(RX+、RX-、TX+、TX-)分别电连接卡连接器11的第一弹片、第二弹片、第九弹片以及第十弹片，存储卡控制器201的参考时钟接口(RCLK)和第二电源接口(VDD2)电连接卡连接器11的第六弹片。SIM卡控制器202的数据接口(DATA)电连接卡连接器11的第三弹片，SIM卡控制器202的时钟接口(CLK)电连接卡连接器11的第四弹片，SIM卡控制器202的复位接口(RST)电连接第五弹片。处理器20的电源接口电连接卡连接器11的第八弹片，地接口电连接卡连接器11的第七弹片。
在本实施例中，当二合一卡7插入电子设备，二合一卡7的存储卡电路712工作时，存储卡控制器201经第一弹片、第二弹片、第九弹片及第十弹片与二合一卡7之间进行存储卡的数据信号(NM RX+、NM RX-、NM TX+、NM TX-)的传输，经第六弹片与二合一卡7之间进行存储卡的参考时钟信号(NM RCLK)和存储卡的第二电源信号(NM VDD2)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行存储卡的第一电源信号(NM VDD1)的传输，地接口经第七弹片与二合一卡7之间进行存储卡的地信号(NM GND)的传输，二合一卡7实现数据存储功能。
当二合一卡7插入电子设备，二合一卡7的SIM卡电路713工作时，SIM卡控制器202经第三弹片与二合一卡7之间进行SIM卡的数据信号(SIM DATA)的传输，经第四弹片与二合一卡7之间进行SIM卡的时钟信号(SIM CLK)的传输；处理器20的电源接口经第八弹片与二合一卡7之间进行SIM卡的电源信号(SIM VCC)的传输，地接口经第七弹片与二合一卡7之间进行SIM卡的地信号(SIM GND)的传输，二合一卡7实现通话、数据通信功能。其中，当电子设备需要对二合一卡7的SIM卡电路713进行复位操作时，经第五弹片与二合一卡7进行SIM卡的复位信号(SIM RST)的传输，控制SIM卡电路713进行复位。
在其他一些实施例中，二合一卡7的第五金手指725可以用于传输存储卡的参考时钟信号(NM RCLK)和存储卡的第二电源信号(NM VDD2)，第六金手指726用于传输SIM卡的复位信号(SIM RST)。此时，存储卡电路712的参考时钟接口(RCLK)和第二电源接口(VDD2)电连接卡接口72的第五金手指725，SIM卡电路713的复位接口(RST)电连接卡接口72的第五金手指725。在电子设备侧，存储卡控制器201的参考时钟接口(RCLK)和第二电源接口(VDD2)电连接卡连接器11的第五弹片，SIM卡控制器202的复位接口(RST)电连接卡连接器11的第六弹片。
请参阅表20，表20为卡连接器11的多个弹片与Nano SIM卡3、第一NM卡4以及图39所示二合一卡7的多个金手指及其传输信号的对应关系表。二合一卡7与卡连接器11连接时，卡连接器11的第一弹片至第十弹片一一对应地抵持且电连接二合一卡7的第一金 手指721至第十金手指7210，二合一卡7的第三金手指723至第八金手指728一一对应地与Nano SIM卡3的第一金手指321至第六金手指326位置对应。一些实施例中，二合一卡7的第三金手指723至第十金手指7210一一对应地与第一NM卡4的第一金手指421至第八金手指428位置对应。
表20
Figure PCTCN2022136647-appb-000029
当电子设备兼容Nano SIM卡3和图39所示二合一卡7时，电子设备的SIM卡控制器202可以不支持编程电压/输入信号。或者，电子设备的SIM卡控制器202也可以支持编程电压/输入信号。此时，电子设备的SIM卡控制器202还可以包括编程电压/输入信号接口(VPP)，处理器20可以设置第一开关，第一开关连接SIM卡控制器202的编程电压/输入信号接口(VPP)及SIM卡控制器202的复位接口(RST)，还连接卡连接器11的第五弹片。当电子设备插入Nano SIM卡3时，第一开关导通SIM卡控制器202的编程电压/输入信号接口(VPP)与第五弹片；当电子设备插入二合一卡7时，第一开关导通SIM卡控制器202的复位接口(RST)与第五弹片。
电子设备的处理器20包括第二开关，第二开关连接SIM卡控制器202的复位接口(RST)、存储卡控制器201的参考时钟接口(RCLK)和第二电源接口(VDD2)，还连接 卡连接器11的第六弹片。当电子设备插入Nano SIM卡3时，第二开关导通SIM卡控制器202的复位接口(RST)与第六弹片；当电子设备插入二合一卡7时，第二开关导通存储卡控制器201的参考时钟接口(RCLK)和第二电源接口(VDD2)与第六弹片。
在另一些实施例中，本申请还提供一种电子设备，电子设备能够兼容Nano SIM卡3、第一NM卡4以及图35所示二合一卡7。其中，电子设备的处理器可以包括存储卡控制器、第二存储卡控制器、SIM卡控制器以及接口控制器，接口控制器电连接存储卡控制器、第二存储卡控制器以及SIM卡控制器，接口控制器还电连接卡连接器11的多个弹片。
存储卡控制器的接口协议(例如PCIE接口协议)能够与二合一卡7的存储卡电路通信，用于控制二合一卡7的存储卡电路运行，SIM卡控制器用于控制Nano SIM卡3运行，第二存储卡控制器的接口协议(例如EMMC接口协议)能够与第一NM卡4通信，用于控制第一NM卡4运行。
当不同的信息卡插入电子设备的卡座组件10，与卡连接器11电连接时，接口控制器能够控制SIM卡控制器经卡连接器11与信息卡通信、或者存储卡控制器和SIM卡控制器经卡连接器11与信息卡通信、或者第二存储卡控制器经卡连接器11与信息卡通信。例如，当卡托2安装有Nano SIM卡3，Nano SIM卡3插入卡座组件10时，接口控制器控制SIM卡控制器经卡连接器11与Nano SIM卡3进行通信；当卡托2安装有第一NM卡4，第一NM卡4插入卡座组件10时，接口控制器控制第二存储卡控制器经卡连接器11与第一NM卡4进行通信；当卡托2安装有二合一卡7，二合一卡7插入卡座组件10时，接口控制器控制存储卡控制器和SIM卡控制器经卡连接器11与二合一卡7进行通信。
其中，接口控制器可以包括多个开关，通过多个开关切换卡连接器11的多个弹片与处理器中的多个控制器的连接关系，以实现在不同场景下的通信需求。接口控制器还可以包括多根导线。本实施例的其他技术内容可以参考图32对应实施例的相关描述，此处不再赘述。
在本实施例中，二合一卡7将两个高速信号(例如NM RX+、NM RX-)分别排布于第一金手指721和第二金手指722，由于二合一卡7的第一金手指721和第二金手指722与Nano SIM卡3和第一NM卡4的所有金手指均无位置对应关系，因此无论电子设备中插入的信息卡是二合一卡7、Nano SIM卡3还是第一NM卡4，处理器20均无需切换与第一弹片和第二弹片电连接的接口，从而可以简化处理器20的电路，降低设计难度和成本。
基于上述实施例的描述，在不冲突的情况下，在本申请的其他一些实施例中，二合一卡7的第一金手指721、第二金手指722以及第十金手指7210用作数据接口时，可以电连接耐高压电路或保护开关，用于避免在卡连接器11的第三弹片输出SIM卡控制器202的高压的数据信号、第四弹片输出SIM卡控制器202的高压的时钟信号、第八弹片输出高压的电源信号时，由于弹片短路，而烧坏电路，以提高二合一卡7的可靠性。其中，耐高压电路或保护开关均位于二合一卡7的封装件711内。在其他一些实施例中，也可通过在电子设备内提供高阻抗保护电路，避免烧坏二合一卡7的电路，例如在电子设备的接口控制器或其他控制器内增加保护电路实现。
在本申请的其他一些实施例中，二合一卡也可以有其他设计方式，其适配的卡连接器及卡座组件可以不兼容第一NM卡。
在本申请的其他一些实施例中，二合一卡也可以有其他设计方式，其适配的卡连接器及卡座组件可以不兼容Nano SIM卡。此时，二合一卡的第一金手指至第十金手指的排布位置可以进行调整，第一金手指至第十金手指的信号排布位置可以进行相互调换，二合一卡的卡体的尺寸可以发生变化。
一些实施例中，电子设备可以通过信息卡识别方法识别插入电子设备的信息卡的类型。
一些实施例中，信息卡识别方法能够识别信息卡是否为Nano SIM卡或二合一卡，信息卡识别方法可以应用于能够兼容Nano SIM卡和二合一卡的电子设备。
信息卡识别方法包括：
步骤001：执行第一初始化流程；
步骤002：若接收到第一回复指令，则判断插入的信息卡为第一卡；若未接收到第一回复指令，则判断插入的信息卡非第一卡，执行第二初始化流程；
步骤003：若接收到第二回复指令，则判断插入的信息卡为第二卡；若未接收到第二回复指令，则判断插入的信息卡非第二卡。
在本实施例中，电子设备通过执行信息卡的初始化流程，若接收到特定的回复信号，则能够判断信息卡是与初始化流程对应的信息卡，若未接收到特定的回复信号，则判断信息卡不是与初始化流程对应的信息卡，并执行下一个初始化流程，判断信息卡是否为与下一个初始化流程对应的信息卡。
在本实施例中，电子设备能够通过处理器自动识别信息卡类型，并控制与信息卡对应的控制器与卡连接器导通，使得信息卡能够与电子设备能够自动匹配，从而进行通信，提高了用户的使用体验。
一些实施例中，第一初始化流程可以为SIM卡初始化流程，第一卡为Nano SIM卡；第二初始化流程可以为二合一卡初始化流程，第二卡为二合一卡。或者，第一初始化流程可以为二合一卡初始化流程，第一卡为二合一卡；第二初始化流程可以为SIM卡初始化流程，第二卡为Nano SIM卡。
一些实施例中，信息卡识别方法响应于电子设备开机或电子设备重启。
一些实施例中，信息卡识别方法响应于检测到卡托状态由脱离状态切换为插入状态。其中，参阅图3，电子设备可以通过卡座组件中的插入检测弹片检测卡托状态为脱离状态还是插入状态。
另一些实施例中，信息卡识别方法能够识别信息卡是否为Nano SIM卡、第一NM卡或二合一卡，信息卡识别方法可以应用于能够兼容Nano SIM卡、第一NM卡以及二合一卡的电子设备。
信息卡识别方法包括：
步骤001：执行第一初始化流程；
步骤002：若接收到第一回复指令，则判断插入的信息卡为第一卡；若未接收到第一 回复指令，则判断插入的信息卡非第一卡，执行第二初始化流程；
步骤003：若接收到第二回复指令，则判断插入的信息卡为第二卡；若未接收到第二回复指令，则判断插入的信息卡非第二卡，执行第三初始化流程；
步骤004：若接收到第三回复指令，则判断插入的信息卡为第三卡；若未接收到第三回复指令，则判断插入的信息卡非第三卡。
本实施例信息卡识别方法与前文实施例中信息卡识别方法的主要区别在于，在步骤003中，当判断插入的信息卡非第二卡时，信息卡识别方法接着执行第三初始化流程，以判断信息卡是否为第三卡。
一些实施例中，在第一初始化流程、第二初始化流程、第三初始化流程中，一者为SIM卡初始化流程，另一者为第一NM卡初始化流程，另一者为二合一卡初始化流程。对应的，在第一卡、第二卡和第三卡中，一者为Nano SIM卡、另一者为第一NM卡、另一者为二合一卡。
一些实施例中，信息卡识别方法响应于电子设备开机或电子设备重启时，其中，第一初始化流程可以为SIM卡初始化流程或二合一卡初始化流程。在本实施例中，当电子设备开机或电子设备重启时，信息卡识别方法先进行SIM卡初始化流程或二合一卡初始化流程，判断信息卡是否为Nano SIM卡或二合一卡，以先进入联网状态。当然，在其他一些实施例中，当信息卡识别方法响应于电子设备开机或电子设备重启时，信息卡识别方法也可以先执行其他初始化流程，本申请实施例对此不作严格限定。
本实施例信息卡识别方法的其他内容可以参阅前文实施例中信息卡识别方法的相关描述，此处不再赘述。
在其他一些实施例中，处理器也可以设有用于检测信息卡类型的检测电路，处理器能够依据检测电路的检测结果识别信息卡的类型。本申请实施例不对处理器识别信息卡类型的具体方式进行严格限定。
请参阅图41至图79，图41至图79是本申请提供的信息卡的多种外观。在本申请中，上述内容提及的信息卡(例如第二NM卡、二合一卡等)的外观还可以是图41至图79中的任一项外观，本申请实施例对此不作严格限定。
以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (21)

  1. [根据细则26改正 06.02.2023]
    一种电子设备（100），其特征在于，包括卡座组件（10）和处理器（20）；所述卡座组件（10）包括卡连接器（11），当卡（7）插入所述卡座组件（10），所述卡（7）的十个金手指与所述卡连接器（11）的十个弹片一一对应地抵持且电连接，所述卡（7）包括存储卡电路（712）和SIM 卡电路（713）；所述处理器（20）包括存储卡控制器（201）、SIM 卡控制器（202）、电源接口及地接口，所述存储卡控制器（201）和所述SIM 卡控制器（202）的接口连接至十个所述弹片中的其中八个弹片，所述电源接口和所述地接口分别连接至十个所述弹片中的另两个弹片。
  2. [根据细则26改正 06.02.2023]
    根据权利要求1 所述的电子设备（100），其特征在于，所述电子设备（100）还包括开关（203），所述开关（203）连接所述SIM 卡控制器（202）的复位接口和所述存储卡控制器（201）的其中一个接口，所述开关（203）还连接十个所述弹片中的一个弹片。
  3. [根据细则26改正 06.02.2023]
    根据权利要求2 所述的电子设备（100），其特征在于，所述存储卡控制器（201）支持eMMC 接口协议；所述开关（203）连接所述存储卡控制器（201）的命令和响应复用接口；
    在十个所述弹片中，其中七个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的时钟接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的时钟接口。
  4. [根据细则26改正 06.02.2023]
    根据权利要求3 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述开关（203）连接所述第六弹片（11f）；所述存储卡控制器（201）的四个数据接口一一对应地连接所述第一弹片（11a）、所述第二弹片（11b）、所述第九弹片（11i）以及所述第十弹片（11j），所述存储卡控制器（201）的时钟接口连接所述第五弹片（11e）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的时钟接口连接所述第四弹片（11d）。
  5. [根据细则26改正 06.02.2023]
    根据权利要求2 所述的电子设备（100），其特征在于，所述存储卡控制器（201）支持eMMC 接口协议；所述开关（203）连接所述存储卡控制器（201）的时钟接口；在十个所述弹片中，其中七个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的命令和响应复用接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的时钟接口。
  6. [根据细则26改正 06.02.2023]
    根据权利要求5 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述开关（203）连接所述第六弹片（11f）；所述存储卡控制器（201）的四个数据接口一一对应地连接所述第一弹片（11a）、所述第二弹片（11b）、所述第九弹片（11i）以及所述第十弹片（11j），所述存储卡控制器（201）的命令和响应复用接口连接所述第五弹片（11e）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的时钟接口连接所述第四弹片（11d）。
  7. [根据细则26改正 06.02.2023]
    根据权利要求2 所述的电子设备（100），其特征在于，所述存储卡控制器（201）支持UFS 接口协议或PCIe 接口协议；所述开关（203）连接所述存储卡控制器（201）的参考时钟接口；
    在十个所述弹片中，其中七个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的第二电源接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的时钟接口。
  8. [根据细则26改正 06.02.2023]
    根据权利要求7 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；
    所述开关（203）连接所述第六弹片（11f）；所述存储卡控制器（201）的其中三个数据接口一一对应地连接所述第五弹片（11e）、所述第九弹片（11i）以及所述第十弹片（11j），所述存储卡控制器（201）的另一个数据接口和所述存储卡控制器（201）的第二电源接口中的一者连接所述第一弹片（11a）、另一者连接所述第二弹片（11b）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的时钟接口连接所述第四弹片（11d）。
  9. [根据细则26改正 06.02.2023]
    根据权利要求1 所述的电子设备（100），其特征在于，所述处理器（20）还包括分频器（204），所述存储卡控制器（201）支持eMMC 接口协议，所述存储卡控制器（201）的时钟接口连接十个所述弹片的一个弹片，所述存储卡控制器（201）的时钟接口经所述分频器（204）连接所述SIM 卡控制器（202）的时钟接口。
  10. [根据细则26改正 06.02.2023]
    根据权利要求9 所述的电子设备（100），其特征在于，在十个所述弹片中，其中七个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的命令和响应复用接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的复位接口。
  11. [根据细则26改正 06.02.2023]
    根据权利要求10 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述存储卡控制器（201）的时钟接口连接所述第四弹片（11d），所述存储卡控制器（201）的四个数据接口一一对应地连接所述第一弹片（11a）、所述第二弹片（11b）、所述第九弹片（11i）以及所述第十弹片（11j），所述存储卡控制器（201）的命令和响应复用接口连接所述第五弹片（11e）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的复位接口连接所述第六弹片（11f）。
  12. [根据细则26改正 06.02.2023]
    根据权利要求1 所述的电子设备（100），其特征在于，所述处理器（20）还包括分频器（204），所述存储卡控制器（201）支持UFS 接口协议或PCIe 接口协议，所述存储卡控制器（201）的参考时钟接口连接十个所述弹片的一个弹片，所述存储卡控制器（201）的参考时钟接口经所述分频器（204）连接所述SIM 卡控制器（202）的时钟接口。
  13. [根据细则26改正 06.02.2023]
    根据权利要求12 所述的电子设备（100），其特征在于，在十个所述弹片中，其中七个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的第二电源接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的复位接口。
  14. [根据细则26改正 06.02.2023]
    根据权利要求13 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述存储卡控制器（201）的时钟接口连接所述第四弹片（11d），所述存储卡控制器（201）的其中三个数据接口一一对应地连接所述第五弹片（11e）、所述第九弹片（11i）以及所述第十弹片（11j），所述存储卡控制器（201）的另一个数据接口和所述存储卡控制器（201）的第二电源接口中的一者连接所述第一弹片（11a）、另一者连接所述第二弹片（11b）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的复位接口连接所述第六弹片（11f）。
  15. [根据细则26改正 06.02.2023]
    根据权利要求1 所述的电子设备（100），其特征在于，所述存储卡控制器（201）支持UFS 接口协议或PCIe 接口协议；在十个所述弹片中，其中八个弹片一一对应地连接所述存储卡控制器（201）的四个数据接口、所述存储卡控制器（201）的参考时钟接口、所述SIM 卡控制器（202）的复位接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的时钟接口。
  16. [根据细则26改正 06.02.2023]
    根据权利要求15 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述存储卡控制器（201）的四个数据接口一一对应地连接所述第一弹片（11a）、所述第二弹片（11b）、所述第九弹片（11i）以及所述第十弹片（11j）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的时钟接口连接所述第四弹片（11d）；所述存储卡控制器（201）的参考时钟接口和所述SIM 卡控制器（202）的复位接口中的一者连接所述第五弹片（11e）、另一者连接所述第六弹片（11f）。
  17. [根据细则26改正 06.02.2023]
    根据权利要求1 所述的电子设备（100），其特征在于，所述存储卡控制器（201）支持PCIe 接口协议；所述存储卡控制器（201）的参考时钟接口和第二电源接口连接至十个所述弹片中的同一个弹片；所述存储卡控制器（201）的四个数据接口一一对应地连接至十个所述弹片中的另外四个弹片；所述SIM 卡控制器（202）的复位接口、所述SIM 卡控制器（202）的数据接口以及所述SIM 卡控制器（202）的时钟接口一一对应地连接至十个所述弹片中的另外三个弹片。
  18. [根据细则26改正 06.02.2023]
    根据权利要求17 所述的电子设备（100），其特征在于，十个所述弹片阵列排布，十个所述弹片沿第二方向排布成第一列弹片和第二列弹片，所述第一列弹片包括沿所述第一方向排布的第一弹片（11a）、第三弹片（11c）、第五弹片（11e）、第七弹片（11g）及第九弹片（11i），所述第二列弹片包括沿所述第一方向排布的第二弹片（11b）、第四弹片（11d）、第六弹片（11f）、第八弹片（11h）及第十弹片（11j），所述第一方向垂直于所述第二方向；所述电源接口连接所述第八弹片（11h），所述地接口连接第七弹片（11g）；所述存储卡控制器（201）的四个数据接口一一对应地连接至所述第一弹片（11a）、所述第二弹片（11b）、所述第九弹片（11i）以及所述第十弹片（11j）；所述SIM 卡控制器（202）的数据接口连接所述第三弹片（11c），所述SIM 卡控制器（202）的时钟接口连接所述第四弹片（11d）；所述存储卡控制器（201）的参考时钟接口和所述存储卡控制器（201）的第二电源接口连接至所述第五弹片（11e）或所述第六弹片（11f）中的一者，所述SIM 卡控制器（202）的复位接口连接至所述第五弹片（11e）或所述第六弹片（11f）中的另一者。
  19. [根据细则26改正 06.02.2023]
    根据权利要求4、6、8、11、14、16 及18 中的任一项所述的电子设备（100），其特征在于，十个所述弹片沿第一方向排布成第一排弹片（11a、11b）至第五排弹片（11i、11j）；第二排弹片（11c、11d）与第三排弹片（11e、11f）的中心间距大于第一排弹片（11a、11b）与第二排弹片（11c、11d）的中心间距，且大于第四排弹片（11g、11h）与第五排弹片（11i、11j）的中心间距；第三排弹片（11e、11f）与第四排弹片（11g、11h）的中心间距大于第一排弹片（11a、11b）与第二排弹片（11c、11d）的中心间距，且大于第四排弹片（11g、11h）与第五排弹片（11i、11j）的中心间距。
  20. [根据细则26改正 06.02.2023]
    一种信息卡识别方法，其特征在于，包括：执行第一初始化流程；若接收到第一回复指令，则判断插入的信息卡为第一卡；若未接收到第一回复指令，则判断插入的信息卡非第一卡，执行第二初始化流程；若接收到第二回复指令，则判断插入的信息卡为第二卡；若未接收到第二回复指令，则判断插入的信息卡非第二卡；其中，所述第一初始化流程和所述第二初始化流程中的一者为二合一卡初始化流程、另一者为SIM 卡初始化流程。
  21. [根据细则26改正 06.02.2023]
    根据权利要求20 所述的信息卡识别方法，其特征在于，在检测到卡托的状态由脱离状态切换为插入状态的情况下，或者在检测到电子设备开机或电子设备重启的情况下，执行第一初始化流程。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109983706A (zh) * 2018-02-01 2019-07-05 华为技术有限公司 一种电子设备
CN212626415U (zh) * 2020-08-28 2021-02-26 东莞市大为精密组件有限公司 一种二合一卡座连接器及电子设备
CN113128645A (zh) * 2019-12-30 2021-07-16 北京紫光青藤微系统有限公司 一种同时具有sim和ufs存储功能的智能卡
CN217693314U (zh) * 2021-12-15 2022-10-28 华为技术有限公司 电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109983706A (zh) * 2018-02-01 2019-07-05 华为技术有限公司 一种电子设备
CN113128645A (zh) * 2019-12-30 2021-07-16 北京紫光青藤微系统有限公司 一种同时具有sim和ufs存储功能的智能卡
CN212626415U (zh) * 2020-08-28 2021-02-26 东莞市大为精密组件有限公司 一种二合一卡座连接器及电子设备
CN217693314U (zh) * 2021-12-15 2022-10-28 华为技术有限公司 电子设备

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