WO2023098503A1 - Structure de blindage, corps d'encapsulation, architecture au niveau de la carte, radiateur et dispositif électronique - Google Patents

Structure de blindage, corps d'encapsulation, architecture au niveau de la carte, radiateur et dispositif électronique Download PDF

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Publication number
WO2023098503A1
WO2023098503A1 PCT/CN2022/133199 CN2022133199W WO2023098503A1 WO 2023098503 A1 WO2023098503 A1 WO 2023098503A1 CN 2022133199 W CN2022133199 W CN 2022133199W WO 2023098503 A1 WO2023098503 A1 WO 2023098503A1
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WIPO (PCT)
Prior art keywords
shielding
package
shielding unit
shielding structure
newtonian fluid
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PCT/CN2022/133199
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English (en)
Chinese (zh)
Inventor
熊振兴
熊建波
赵才军
梁晓彤
赵亚涛
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华为技术有限公司
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Publication of WO2023098503A1 publication Critical patent/WO2023098503A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

Definitions

  • the present application relates to the field of electronic equipment, and in particular to a shielding structure, package body, board-level structure, radiator and electronic equipment.
  • Bare Die packaging refers to a chip packaging method that directly exposes the die (Die).
  • Die The periphery of the Die is no longer wrapped with a cover, but a layer of thermally conductive material (for example, Thermal Interface Materials (TIM) is covered on the die. )).
  • TIM Thermal Interface Materials
  • the Die in the package can directly transfer heat to the heat sink through the heat-conducting material, and the maximum The junction-to-case thermal resistance of the package is reduced to a certain extent.
  • the bare Die package can improve the heat dissipation efficiency by more than 10°C. Therefore, with the sharp increase of package power consumption, bare die packages have gradually become mainstream.
  • the bare Die package improves the heat dissipation effect of the package, it also lacks the shielding and support of the cover.
  • the electromagnetic noise generated by the package will deteriorate. , it is easy to cause the thermal conductive material to be crushed, thus causing damage to the package.
  • the present application provides a shielding structure, package body, board-level structure, radiator and electronic equipment, which can reduce the impact of external force on the package body while reducing the electromagnetic noise generated by the package body.
  • the embodiment of the present application provides a shielding structure, including at least one set of shielding unit groups, each shielding unit group includes at least one shielding unit, and each shielding unit includes a non-Newtonian fluid material and is arranged on the surface of the non-Newtonian fluid material the conductive layer.
  • the non-Newtonian fluid materials used in this application are solid at normal temperature.
  • the molecules in the non-Newtonian fluid material are separated from each other and have weak connection force with each other.
  • the non-Newtonian fluid material is bendable and easy to deform.
  • the connection force between the molecules in the material of the non-Newtonian fluid material is strengthened, the material becomes hard, and a large force is required to make it deform significantly.
  • the conductive layer Due to its conductivity, the conductive layer, on the other hand, because the conductive layer of the shielding structure has conductivity, can be electrically connected to the heat sink, so it can absorb part of the electromagnetic radiation emitted by the package and reduce the electromagnetic noise generated by the package. .
  • the shielding structure provided by the present application is used for board-level architecture packaging, for example, the shielding structure is provided at the gap between the package body (obtained based on the bare Die package) and the bottom of the heat sink, or at the periphery of the package body, The shielding structure is added between the PCB and the radiator.
  • the heat sink is steadily and slowly applied to the shielding structure when installing the heat sink, the non-Newtonian fluid material of the shielding structure is soft and easily deformed, so that the heat sink can be installed on the PCB normally. Ensure that the heat sink is in full contact with the package to ensure heat dissipation from the package.
  • the bottom of the heat sink will first give the shield structure a high-speed impact.
  • the shielding structure will give a greater resilience to the bottom of the heat sink, and the non-Newtonian fluid material of the shielding structure will become hard and not easily deformed, thereby preventing the package from being subjected to significant pressure and reducing the possibility of the package being damaged .
  • the conductive layer of the shielding structure since the conductive layer of the shielding structure has conductivity, it can absorb part of the electromagnetic radiation emitted by the package and reduce the electromagnetic noise generated by the package.
  • the thickness of the conductive layer is less than or equal to 0.2 mm.
  • the thickness of the conductive layer may be the thickness of the thickest part of the conductive layer, or the average thickness of the conductive layer.
  • the shielding unit further includes an adhesive layer, and the adhesive layer is used to fix the shielding unit at a target position.
  • the shielding unit By setting the sticking layer, the shielding unit can be flexibly set, so that it can be easily fixed at the target position.
  • the target position may be a position where a shielding unit needs to be used.
  • the target location may be on a support frame of a package, on the bottom of a heat sink, on a support, on a shield, and the like.
  • the non-Newtonian fluid material includes polyurethane or polyborosiloxane.
  • the non-Newtonian fluid material can be prepared by using polyurethane (PU) as the base material and polyborosiloxane (PBDMS) as the modification group.
  • PU polyurethane
  • PBDMS polyborosiloxane
  • the shear stress of the non-Newtonian fluid material is less than or equal to 0.3 MPa.
  • the first threshold is the strain limit value of the non-Newtonian fluid material entering the dense region.
  • the first threshold is 0.4
  • the strain of the non-Newtonian fluid material exceeds 0.4 (for example, in the volume dimension, the volume of the non-Newtonian fluid material is compressed by more than 40% of the initial volume)
  • the strain region above the first threshold is called the dense region.
  • the non-Newtonian fluid material entering the dense region is relatively hard and has a large shear stress. It often requires a greater external force to overcome the shear stress of the non-Newtonian fluid material in order to continue to deform the non-Newtonian fluid material.
  • the heat sink When packaging the board-level structure, the heat sink needs to be in full contact with the package to facilitate heat dissipation from the package. Then, when the heat sink is close to the package by squeezing the shielding unit, if the shielding unit generates a large shear stress to resist the external force given by the heat sink, it may cause the user to apply greater pressure on the heat sink to compress The shielding unit makes the heat sink approach the package body. If the pressure applied by the user is less than the shear stress of the shielding unit, it may cause poor contact between the heat sink and the package.
  • a non-Newtonian fluid material whose shear stress is less than or equal to 0.3 MPa before entering the dense region is selected to make the shielding unit.
  • it is convenient for users to package the board-level structure, on the other hand, it ensures good contact between the heat sink and the package.
  • the conductive layer completely covers the surface of the non-Newtonian fluid material.
  • the strain of the non-Newtonian fluid material is limited within the covering range of the conductive layer, avoiding that the shape change of the non-Newtonian fluid material under normal conditions cannot play a role in supporting the radiator.
  • the shielding unit group includes multiple shielding units
  • the multiple shielding units are arranged in a ring, and the distance between two adjacent shielding units is less than or equal to a quarter of the target wavelength, and the target wavelength The wavelength of electromagnetic waves to be suppressed by the shielding structure.
  • the shielding structure further includes a shielding case corresponding to each shielding unit in the first shielding unit group, the shielding unit is arranged on the top of the corresponding shielding case, the shielding case is used for shielding electromagnetic waves, the first shielding
  • the cell group is one of at least one set of masked cell groups.
  • the shielding cover may be made of conductive material, and the shielding effect of the shielding structure on electromagnetic noise is further enhanced by providing the shielding cover.
  • the shielding structure further includes a support corresponding to each shielding unit in the second shielding unit group, the shielding unit is arranged on the top of the corresponding support, and the support is used to support the corresponding shielding unit,
  • the second shielding unit group is one of at least one group of shielding unit groups.
  • the supporting member may also be made of a conductive material, and by providing the supporting member, while ensuring the supporting effect on the shielding unit, the shielding effect of the shielding structure on electromagnetic noise is further enhanced.
  • the shielding structure further includes a support and an insulating layer corresponding to each shielding unit in the second shielding unit group;
  • the shielding unit includes a first subunit and a second subunit, and the second shielding unit group being one of at least one set of shielded cell sets;
  • the insulating layer is located at the bottom of the support, the first subunit is located at the top of the support, and the second subunit is located at the sides of the support and the insulating layer.
  • each shielding unit in the second shielding unit group into a first subunit and a second subunit, the area where the shielding unit receives electromagnetic wave radiation is increased, thereby further increasing the electromagnetic shielding effect.
  • the surface resistance of the conductive layer is less than or equal to 0.1 ⁇ .
  • the surface resistance of the conductive layer can be measured by a multimeter. The smaller the surface resistance of the conductive layer is, the stronger the electromagnetic absorption capacity of the conductive layer is. In this application, the surface resistance of the conductive layer can be limited within 0.1 ⁇ , so as to enhance the electromagnetic shielding effect of the shielding structure.
  • the conductive layer is a metal film structure, a woven wire mesh structure or a conductive cloth structure.
  • the metal thin film structure may be an electroplated metal film
  • the conductive cloth structure may be a structure obtained by electroplating a layer of metal thin film on the fiber cloth.
  • the embodiment of the present application provides a package, including a substrate, a die, a support frame, a plastic package, and the shielding structure as described in the first aspect or any optional mode of the first aspect;
  • the Die is arranged in On the substrate, the support frame is arranged on the edge of the substrate and surrounds the Die, and the plastic package plastically seals the substrate, the Die and the support frame;
  • the shielding structure is arranged on the support frame.
  • the embodiment of the present application provides a radiator, the bottom of the radiator is provided with the shielding structure as described in the first aspect or any optional manner of the first aspect.
  • the embodiment of the present application provides a board-level architecture, including the package as described in the second aspect, the shielding structure as described in the first aspect or any optional mode of the first aspect, or the shielding structure as described in the third aspect
  • the heat sink and the shielding structure are used to shield the electromagnetic radiation generated by the package and reduce the impact of external force on the package.
  • a board-level architecture may include a PCB and a package as described in the second aspect. Since the package is provided with a shielding structure, it can shield the electromagnetic radiation generated by the package and reduce the impact of external force on the package.
  • the board-level architecture may include a PCB, a package body, and the shielding structure as described in the first aspect or any optional manner of the first aspect.
  • the board-level structure may include a PCB, a package body, and a heat sink as described in the third aspect. Since the shielding structure is arranged on the radiator, the electromagnetic radiation generated by the package can be shielded, and the impact of external force on the package can be reduced.
  • the board-level architecture may include a PCB, the shielding structure as described in the first aspect or any optional manner of the first aspect, the package as described in the second aspect, and the heat sink as described in the third aspect .
  • the board-level architecture may include a plastic encapsulation structure, which plastic-seals the board-level architecture to protect the stability of each component in the board-level architecture.
  • the embodiment of the present application provides an electronic device, including the shielding structure as described in the first aspect or any optional mode of the first aspect, the package as described in the second aspect, and the package as described in the fourth aspect.
  • FIG. 1 is a schematic structural diagram of a package provided in an embodiment of the present application.
  • FIG. 2 is a structural schematic diagram 1 of a board-level architecture provided by an embodiment of the present application.
  • Fig. 3 is a schematic diagram of a scene where a heat sink crushes a heat conduction layer according to an embodiment of the present application
  • FIG. 4 is a first structural schematic diagram of a shielding unit provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the relationship between shear stress and strain of a non-Newtonian fluid material provided in the embodiment of the present application;
  • Fig. 6 is a schematic diagram of the relationship between the rebound force and the compression ratio of a non-Newtonian fluid material provided by the embodiment of the present application;
  • FIG. 7 is a second structural schematic diagram of a shielding unit provided in an embodiment of the present application.
  • FIG. 8 is a partial structural schematic diagram 1 of a shielding structure provided by an embodiment of the present application.
  • Fig. 9 is a partial structural schematic diagram II of a shielding structure provided by the embodiment of the present application.
  • FIG. 10 is a schematic diagram of a partial structure of a shielding structure provided in the embodiment of the present application III;
  • FIG. 11 is a schematic structural diagram II of a board-level architecture provided by an embodiment of the present application.
  • Fig. 12 is a first schematic diagram of the shape of a first shielding unit group provided by the embodiment of the present application.
  • Fig. 13 is a second schematic diagram of the shape of a first shielding unit group provided by the embodiment of the present application.
  • FIG. 14 is a schematic structural diagram III of a board-level architecture provided by an embodiment of the present application.
  • FIG. 15 is a structural schematic diagram 4 of a board-level architecture provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a scene where a support is provided on a PCB according to an embodiment of the present application.
  • FIG. 17 is a schematic structural diagram five of a board-level architecture provided by an embodiment of the present application.
  • FIG. 18 is a sixth structural diagram of a board-level architecture provided by the embodiment of the present application.
  • FIG. 19 is a schematic structural diagram VII of a board-level architecture provided by an embodiment of the present application.
  • FIG. 20 is a schematic structural diagram eighth of a board-level architecture provided by an embodiment of the present application.
  • FIG. 21 is a schematic structural diagram of a board-level architecture provided in the embodiment of the present application (9);
  • Figure 22 is a schematic diagram of a noise test result based on the board-level architecture shown in Figure 11 provided by the embodiment of the present application;
  • FIG. 23 is a schematic diagram of a drop test result based on the board-level architecture shown in FIG. 11 provided by the embodiment of the present application;
  • FIG. 24 is a schematic structural diagram of a package provided with a shielding structure provided in an embodiment of the present application.
  • FIG. 25 is a schematic structural diagram of a radiator provided with a shielding structure according to an embodiment of the present application.
  • the structure of the package based on the bare Die package may be as shown in FIG. 1 , including a substrate, a Die, a supporting frame and a plastic package (not shown in FIG. 1 ).
  • the Die is welded on the substrate, and the substrate is provided with metal traces, which can transmit the signal on the bump of the Die to the corresponding Ball Grid Array (BGA) pin on the substrate.
  • a support frame (generally called a Ring) is provided around the die at the edge of the substrate for package protection and enhanced heat dissipation.
  • the substrate, Die and support frame are packaged and protected by a plastic package to enhance the mechanical properties of the package and ensure the reliability of the package. Exemplarily, it can be sealed by molding process.
  • some small packages such as capacitors and inductors may also be arranged on the substrate to improve the reliability of the signal of the entire package.
  • Die is the heat source of the package
  • a layer of heat conduction layer is usually covered on Die.
  • heat energy can be transferred to the heat sink through the heat conduction layer to enhance heat dissipation.
  • the heat conduction layer can be TIM1.5 or other heat conduction interface materials.
  • a boss can also be provided at the bottom of the heat sink. Screws secure the heatsink to the PCB.
  • the package based on the bare Die package can improve the heat dissipation efficiency by more than 10°C compared with other packages (for example, the package based on the lid package), it also increases the electromagnetic noise by 5-10dB .
  • the heat sink if the force is not appropriate, or the packaged board-level structure falls, it is easy to cause the heat conduction layer to be crushed.
  • the heat sink may tilt to one side during installation, drop, etc., so that the boss of the heat sink presses the edge of the heat conduction layer with a large impact force, causing the edge of the heat conduction layer to be crushed.
  • the Die cannot dissipate heat smoothly, making the Die work in a high-temperature environment, reducing the service life and reliability of the Die, and easily damaged.
  • the present application provides a shielding structure, which includes at least one shielding unit group, and each shielding unit group includes at least one shielding unit.
  • the shielding unit includes a non-Newtonian fluid material and a conductive layer disposed on the surface of the non-Newtonian fluid material.
  • Non-Newtonian fluid materials refer to fluid materials that do not satisfy Newton's experimental law of viscosity, and the relationship between shear stress and shear rate is not linear.
  • shear rate When the shear rate is low, the shear stress of the fluid is basically unchanged; when the shear rate exceeds a critical value, the shear stress increases with the increase of the shear rate, and the viscosity of the fluid will increase with the pressure or shear As the stress increases, the volume of the material expands.
  • the non-Newtonian fluid material is solid at room temperature.
  • the non-Newtonian fluid material is in a normal state (static or slowly compressed state)
  • the molecules in the material of the non-Newtonian fluid material are separated from each other and have a weak connection force with each other.
  • the non-Newtonian fluid material is bendable and easy to deformation.
  • the connection force between the molecules in the material of the non-Newtonian fluid material is strengthened, the material becomes hard, and a large force is required to make it deform significantly.
  • the relationship between the shear stress and the strain of the non-Newtonian fluid material for different shear rates can be shown in FIG. 5 .
  • a first threshold for example, 0.4 as shown in Figure 5
  • the strain interval is called the dense region. In the dense region, when the strain of the non-Newtonian fluid material increases, the non-Newtonian fluid material will generate greater shear stress.
  • the shielding structure provided by this application is used for board-level architecture packaging, for example, the shielding structure is provided at the gap between the support frame and the bottom of the radiator, or the shielding structure is added between the PCB and the radiator on the periphery of the package. shielding structure.
  • the radiator is installed to apply pressure to the shielding structure steadily and slowly, the non-Newtonian fluid material of the shielding structure is soft and easily deformed, so that the radiator can be normally installed on the PCB, Make sure that the boss of the heat sink is in full contact with the heat conduction layer of the package.
  • the bottom of the heat sink will first give the shield structure a high-speed impact.
  • the shielding structure will give a greater resilience to the bottom of the radiator, and the non-Newtonian fluid material of the shielding structure will become hard and not easily deformed, thereby avoiding obvious pressure on the heat conducting layer and reducing the possibility of the heat conducting layer being crushed .
  • the conductive layer of the shielding structure is conductive and can be electrically connected to the heat sink, it can absorb part of the electromagnetic radiation emitted by the package and reduce the electromagnetic noise generated by the package.
  • the conductive layer may be a flexible structure such as a metal film structure, a woven wire mesh structure or a conductive cloth structure, which does not affect the presentation of the mechanical properties of the non-Newtonian fluid material.
  • the metal thin film structure may be an electroplated metal thin film
  • the conductive cloth structure may be a metal thin film electroplated on the fiber cloth.
  • the thickness of the conductive layer is set to be thin, for example, the thickness of the conductive layer may be set to be less than or equal to 0.2 mm.
  • the surface resistance of the conductive layer may be set to be less than or equal to 0.1 ⁇ , so as to enhance the electromagnetic absorption capability of the conductive layer.
  • the conductive layer can be arranged on the side surface of the Newtonian fluid material when the shielding unit is packaged in the board-level structure, and the side surface is the side facing the package body, so as to absorb the heat produced by the package body. Electromagnetic radiation.
  • the conductive layer may also completely cover the surface of the non-Newtonian fluid material.
  • the strain of the non-Newtonian fluid material is limited within the covering range of the conductive layer, so as to prevent the shape change of the non-Newtonian fluid material from being unable to support the heat sink under normal conditions.
  • the non-Newtonian fluid material can be made of polyurethane or polyborosiloxane.
  • polyurethane PU
  • PBDMS polyborosiloxane
  • the compression ratio refers to the strain in the thickness or volume of the non-Newtonian fluid material.
  • the compression ratio of 40% refers to the ratio of the compressed thickness to the initial thickness, which means that the non-Newtonian fluid material is compressed by 40% on the basis of the initial thickness under the action of external force.
  • the rebound force refers to the force generated by the non-Newtonian fluid material on the unit area when the non-Newtonian fluid material is compressed, and the direction of the rebound force is opposite to that of the external force.
  • the heat sink when packaging a board-level structure, the heat sink needs to be in sufficient contact with the package body to facilitate heat dissipation from the package body. Then, when the heat sink is close to the package by squeezing the shielding unit, if the shielding unit generates a large rebound force to resist the external force given by the heat sink, it may cause the user to exert a greater force on the heat sink to compress the shield. unit so that the heat sink is closer to the package. If the force applied by the user is smaller than the resilience of the shielding unit, it may cause poor contact between the heat sink and the package.
  • the non-shear stress is less than or equal to 0.3 MPa (that is, the rebound force generated per unit area is less than or equal to 300N) can be selected.
  • Newtonian fluid material is used to make the shielding unit.
  • the shielding structure further includes an adhesive layer, and the adhesive layer is used to fix the shielding structure at a target position.
  • the adhesive layer can be pasted on the surface of the conductive layer.
  • the adhesive layer can be adhered to the surface of the non-Newtonian fluid material, and the adhesive layer and the conductive layer will completely cover the non-Newtonian fluid material.
  • At least one set of shielding unit groups in the shielding structure may include a first shielding unit group and/or a second shielding unit group, the first shielding unit group represents a shielding unit group arranged on the package body, The second shielding unit group indicates a shielding unit group for being disposed on the periphery of the package.
  • the shielding structure further includes a shielding case corresponding to each shielding unit in the first shielding unit group, and the shielding case has conductivity and is used for shielding electromagnetic waves.
  • a schematic diagram of a partial structure of the shielding case and the shielding unit may be shown in FIG. 8 .
  • (a) in FIG. 8 is a side view
  • (b) in FIG. 8 is a top view.
  • the shielding unit is arranged on the top of the corresponding shielding case.
  • the shielding structure further includes a support corresponding to each shielding unit in the second shielding unit group.
  • the shielding unit is arranged on the top of the corresponding support, and the support is used to support the corresponding shielding unit.
  • the shielding structure further includes a support and an insulating layer corresponding to each shielding unit in the second shielding unit group; as shown in FIG. 10 , the shielding unit includes a first subunit and a second subunit, and the insulating layer is located at At the bottom of the support, the first subunit is located at the top of the support, and the second subunit is located at the sides of the support and the insulating layer.
  • the shielding structure includes a set of shielding unit groups (ie, the first shielding unit group), which are arranged at the gap between the supporting frame of the package and the bottom of the heat sink.
  • a board-level architecture including a PCB, a package, a heat sink and a shielding structure; the package and the heat sink are respectively fixed on the PCB, and the package is located between the heat sink and the PCB Between, the shielding structure is arranged at the gap between the supporting frame of the package and the bottom of the radiator.
  • the shielding structure includes a first shielding unit.
  • the size of the shielding units in the first shielding unit group may be determined based on usage scenarios. For example, assume that the size of the substrate of the package is 65x65mm, the outer dimension of the supporting frame is consistent with the substrate, and the width is 6mm. Each shielding unit in the first shielding unit group may have a width of 6mm. Of course, the width of each shielding unit can be greater than 6mm or less than 6mm without affecting the installation of various components in the board-level architecture.
  • the shape of its cross section is also not limited to a rectangle, such as the cross-sectional shapes shown in FIGS. 7-11 . It can also be arc, triangle, trapezoid or other irregular figures.
  • the first shielding unit group may include one shielding unit.
  • the shape of the shielding unit may be set based on the shape of the supporting frame. For example, as shown in FIG. 12 , if the supporting frame is in the shape of a rectangle, the shielding unit can be correspondingly set in the shape of a rectangle. If the supporting frame is a ring, the shielding unit can be correspondingly set as a ring. If the supporting frame is in the shape of a hexagonal back, the shielding unit can be correspondingly set in a hexagonal back shape, etc.
  • the first shielding unit group may also include a plurality of shielding units, and the plurality of shielding units are arranged in a ring.
  • the distance d between two adjacent shielding units is less than or equal to 1/4 of the target wavelength.
  • the target wavelength is the wavelength corresponding to the electromagnetic wave to be suppressed.
  • the first shielding unit group may include a plurality of fan-shaped shielding units to form a circular ring. Assuming that the electromagnetic wave frequency to be suppressed by the package body is 29 GHz, then the distance between two adjacent fan-ring shielding units is set to correspond to a quarter of the wavelength of the 29 GHz electromagnetic wave. In order to make the first shielding unit group meet the requirements of the package on the gap under the condition that the package can effectively shield the electromagnetic noise generated by the package at the electromagnetic wave frequency point of 29 GHz.
  • each shielding unit in the first shielding unit group is arranged at the gap between the supporting frame of the package and the bottom of the heat sink
  • the thickness of each shielding unit can be determined according to the thickness of the supporting frame of the package and the bottom of the heat sink. The width of the gap between the bottoms is determined.
  • the thickness of the shielding unit can be set to 1.8 mm. Alternatively, it can also be set to exceed 1.8mm. For example, assume that the compression ratio of a non-Newtonian fluid material enters the dense region at 40%. Then, the thickness h of the shielding unit can be set to be 1.8 ⁇ h ⁇ 3mm.
  • the heat conduction of the package body The boss of the layer and the heat sink can be fully connected to avoid poor contact between the heat sink and the heat conduction layer. Ensure that the package body can dissipate heat normally.
  • the conductive layer of the shielding unit is electrically connected to the radiator, which can further enhance the electromagnetic shielding effect.
  • FIG. 14 another board-level architecture is provided for this application, including a PCB, a package, a heat sink and a shielding structure; the package and the heat sink are respectively fixed on the PCB, and the package is located between the heat sink and the PCB Between, the shielding structure is arranged at the gap between the supporting frame of the package and the bottom of the heat sink.
  • the shielding structure may be as shown in FIG. 8 , including a first shielding unit and a shielding case.
  • the top of the shield cover is covered on the supporting frame of the package, and the bottom is supported on the PCB.
  • the shielding structure is disposed between the top of the shielding case and the bottom of the heat sink.
  • the electromagnetic noise of the package is further reduced by setting the shield (material with conductivity) to ground on the PCB.
  • the shielding case may include a top and a side wall.
  • the shape of the top of the shield can be designed based on the shape of the supporting frame of the package.
  • the top of the shield can be shaped like a rectangle, a ring, or a hexagon.
  • the sidewall may be a cylindrical structure based on the peripheral shape of the top of the shield. The side wall is supported on the top edge, that is, the side wall and the top form a cover-like structure with an opening at the top.
  • the top of the shield cover can cover the supporting frame of the package body, the bottom of the side wall can be supported on the PCB, and the boss of the radiator can pass through the through hole to contact the heat conduction layer of the package body.
  • the top of the shield can also be set in the shape of a rectangle.
  • the shield cover may be a structure capable of covering a partial area of the support frame of the package.
  • the supporting frame of the package is in the shape of a rectangle, multiple shields can be provided when packaging the board-level structure. After each shield is fastened on the package, the top of the shield forms a rectangle.
  • each shielding unit in the first shielding unit group can be determined according to the gap width between the top of the shielding case and the heat sink in the packaging environment.
  • the thickness setting refer to the relevant description in the example shown in FIG. 11 , which will not be repeated here.
  • the shielding structure includes a set of shielding unit groups (ie, the second shielding unit group), and the shielding structure is arranged between the PCB and the radiator on the periphery of the package.
  • another board-level architecture provided by the present application includes a PCB, a package, a heat sink and a shielding structure; the package and the heat sink are respectively fixed on the PCB, and the package is located between the heat sink and the Between the PCBs; the shielding structure may be as shown in FIG. 9 , including a second shielding unit group and a support. The bottom of the support is supported on the PCB, and the shielding unit is arranged between the top of the support and the radiator.
  • the supporting member can also be made of conductive material, which is grounded on the PCB.
  • the thickness of the shielding unit can be determined according to the height of the support and the width of the gap between the bottom of the heat sink and the support when the package body is fully in contact with the heat sink. The thickness of the shielding unit can ensure that the thermal conduction layer of the package can fully contact the boss of the heat sink, and when a high-speed impact occurs, the shielding unit can support the pressure from the heat sink to prevent the heat sink from causing excessive damage to the heat conduction layer. pressure.
  • For the specific thickness setting refer to the relevant description in the example shown in FIG. 11 , which will not be repeated here.
  • the supports may be located around the first area of the PCB.
  • the first area is an area for soldering the package.
  • a schematic diagram of a PCB plane area may be as shown in FIG. 16 , and the first area may be a soldering area of a package on the PCB, or may be a soldering area of multiple packages in a high-density layout.
  • the supporting member may be an integral structure capable of surrounding the first region, for example, the supporting member shown in (a) and (c) of FIG. 16 .
  • the second shielding unit group may include a shielding unit with an integrated structure, or may include a plurality of shielding units arranged in a ring, and the distance between two adjacent shielding units is less than or equal to 1/4 of the target wavelength one.
  • the first area can be surrounded by a plurality of support members, and correspondingly, the second shielding unit assembly includes shielding units corresponding to the plurality of support members one by one. unit.
  • the second shielding unit assembly includes shielding units corresponding to the plurality of support members one by one. unit.
  • another board-level architecture provided by the present application includes a PCB, a package body, a heat sink and a shielding structure; the package body and the heat sink are respectively fixed on the PCB, and the package body is located on the heat sink Between the device and the PCB; the shielding structure can be shown in Figure 10, including a second shielding unit group, a support and an insulating layer.
  • Each shielding unit in the second shielding unit group includes a first subunit and a second subunit, the insulating layer is located at the bottom of the support and is arranged between the support and the PCB, the first subunit is located at the top of the support, and the second The subunits are located on the sides of the support and the insulating layer, and fill in the space of the support, PCB and insulating layer.
  • an insulating layer may be provided between the support member and the PCB to prevent short circuit and burn out of the package body.
  • each shielding unit in the second shielding unit group by dividing each shielding unit in the second shielding unit group into a first subunit and a second subunit, the area where the shielding unit receives electromagnetic wave radiation is increased, thereby further increasing the electromagnetic shielding effect.
  • the shielding structure includes two shielding unit groups (respectively a first shielding unit group and a second shielding unit group), which are respectively arranged on the supporting frame of the package and between the PCB and the heat sink on the periphery of the package.
  • the shielding structure includes a first shielding unit group, a second shielding unit group and a support. That is, the shielding structure used in the board-level architecture shown in FIG. 18 is a combination of the shielding structures in the board-level architecture shown in FIG. 11 and FIG. 15 .
  • FIG. 19 it is another board-level architecture provided by the present application, wherein the shielding structure includes a first shielding unit group, a shielding case, a second shielding unit group and a support. That is, the shielding structure used in the board-level architecture shown in FIG. 19 is a combination of the shielding structures in the board-level architecture shown in FIG. 14 and FIG. 15 .
  • FIG. 20 it is another board-level architecture provided by the present application, wherein the shielding structure includes a first shielding unit group, a second shielding unit group, an insulating layer and a support. That is, the shielding structure used in the board-level architecture shown in FIG. 20 is a combination of the shielding structures in the board-level architecture shown in FIG. 11 and FIG. 17 .
  • the shielding structure includes a first shielding unit group, a shielding cover, a second shielding unit group, an insulating layer and a support. That is, the shielding structure used in the board-level architecture shown in FIG. 21 is a combination of the shielding structures in the board-level architecture shown in FIG. 15 and FIG. 17 .
  • a corresponding shielding structure is provided on the supporting frame of the package and between the PCB and the heat sink on the periphery of the package to achieve double-layer protection and enhance the electromagnetic shielding effect of the shielding structure and the protection of the package. intensity.
  • a noise test and a drop test are performed on the obtained board-level structure.
  • the electromagnetic noise generated by the package is reduced by 10-20dB.
  • the board-level frame with the shielding structure and the board-level frame without the shielding structure at the same time from a height of 75mm, so that the board-level frame drops, and test the pressure on the surface of the package (for example, the heat conduction layer) in each board-level frame .
  • the pressure of the package in the board-level architecture with the shielding structure drops from 2102N to 1499N, which is 28% lower.
  • the heat conduction layer in the board-level structure provided with the shielding structure is not crushed, and the temperature of the board-level structure is in a safe temperature range during operation.
  • the shielding structure provided by the present application has the function of electromagnetic shielding and anti-seismic buffering function.
  • using the shielding structure provided by this application to package the package in a board-level structure can effectively suppress the deterioration of electromagnetic noise caused by bare Die packaging, and can also reduce the impact of the heat sink on the heat conduction layer of the package , so as to reduce the probability of the heat conduction layer of the package being crushed.
  • the shielding structure of the present application can realize electromagnetic shielding while ensuring heat dissipation, it solves the problem of incompatibility between heat dissipation and electromagnetic shielding in high-density layout scenarios, and is beneficial to high-density layout scenarios of packages.
  • the shielding structure can be an independent shielding product.
  • the device When packaging the board-level structure, the device can be soldered on the PCB first, and then the shielding structure can be pasted, screwed, welded, etc. fixed in place. Then install the radiator with screws.
  • each part in the shielding structure may also be an independent product.
  • the shielding structure provided by the present application is formed by fixing various parts at corresponding positions by pasting, screwing, welding, and the like.
  • each shielding unit in the first shielding unit group in the shielding structure may also be directly disposed on the package body.
  • the present application also provides a package provided with a shielding unit.
  • the package body provided by the present application has been fixed with the first shielding unit group when it leaves the factory. Then, when packaging the board-level structure, there is no need to add an additional assembly process for the first shielding unit group. It is only necessary to solder the device on the PCB according to the conventional packaging steps, and align the boss of the heat sink with the heat conduction of the device. layer, and then fixed on the PCB with screws.
  • the shielding structure can also be fixed on the radiator. Since the heat sink provided by the present application has already fixed the shielding structure when it leaves the factory. Then, when packaging the board-level structure, there is no need to add an additional assembly process for the shielding structure, just follow the conventional packaging steps, after soldering the device on the PCB, align the boss of the heat sink with the heat-conducting layer of the device, and then It can be fixed on the PCB by screws.
  • the first shielding unit group and/or the second shielding unit group may be arranged on the heat sink.
  • the first shielding unit group and/or the second shielding unit group may be arranged on the heat sink.
  • the second area of the bottom of the heat sink is provided with a first shielding unit group
  • the third area is provided with a second shielding unit group, wherein the second The area is the area where the bottom of the heat sink is opposite to the support frame on the package when the heat sink is mounted on the PCB.
  • the third area is the area where the bottom of the heat sink is opposite to the support on the PCB when the heat sink is installed on the PCB.
  • the heat sink provided by the present application has already fixed the shielding structure or some parts of the shielding structure when it leaves the factory. Then, when packaging the board-level structure, the assembly process for the shielding structure can be reduced, and the assembly efficiency can be improved.
  • some parts in the shielding structure can also be fixed on the PCB. Since the PCB provided by the present application has already fixed the shielding structure or some parts of the shielding structure when it leaves the factory. Then, when packaging the board-level structure, the assembly process for the shielding structure can be reduced, and the assembly efficiency can be improved.
  • the present application also provides an electronic device, including the above-mentioned shielding structure, a board-level structure, a PCB provided with a packaging structure, a package body provided with a packaging structure, or a heat sink provided with a packaging structure wait.
  • the electronic device may be a smart phone, a tablet computer, a vehicle-mounted device, an ultra-mobile personal computer (UMPC), a robot, a computer device, a server, a smart home appliance, and other electronic devices involving a package.
  • UMPC ultra-mobile personal computer
  • the embodiment of the present application does not impose any limitation on the specific type of the electronic device.
  • the terms “installation” and “connection” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated Ground connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • installation and “connection” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated Ground connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

La présente demande se rapporte au domaine des dispositifs électroniques et concerne une structure de blindage, un corps d'encapsulation, une architecture au niveau de la carte, un radiateur et un dispositif électronique, qui peuvent réduire l'impact d'une force externe sur le corps d'encapsulation tout en réduisant le bruit électromagnétique généré par le corps d'encapsulation. La structure de blindage comprend : au moins un groupe d'unités de blindage. Chaque groupe d'unités de blindage comprend au moins une unité de blindage. Chaque unité de blindage comprend une matière fluide non newtonienne et une couche conductrice disposée sur la surface de la matière fluide non newtonienne.
PCT/CN2022/133199 2021-11-30 2022-11-21 Structure de blindage, corps d'encapsulation, architecture au niveau de la carte, radiateur et dispositif électronique WO2023098503A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111449159.8A CN116207079A (zh) 2021-11-30 2021-11-30 一种屏蔽结构、封装体、板级架构、散热器及电子设备
CN202111449159.8 2021-11-30

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WO2023098503A1 true WO2023098503A1 (fr) 2023-06-08

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252282A (ja) * 1993-02-24 1994-09-09 Nec Corp パッケージのシールド構造
CN208798266U (zh) * 2018-08-13 2019-04-26 深圳市腾顺电子材料有限公司 电路板及用电器
CN209374444U (zh) * 2019-03-11 2019-09-10 深圳市腾顺电子材料有限公司 一种芯片emi屏蔽弹性体及芯片emi屏蔽与散热装置
CN209766398U (zh) * 2018-11-07 2019-12-10 浙江清华柔性电子技术研究院 可拉伸柔性电子器件
CN114496944A (zh) * 2020-10-26 2022-05-13 华为技术有限公司 减小芯片电磁噪声的散热组件、芯片封装组件及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252282A (ja) * 1993-02-24 1994-09-09 Nec Corp パッケージのシールド構造
CN208798266U (zh) * 2018-08-13 2019-04-26 深圳市腾顺电子材料有限公司 电路板及用电器
CN209766398U (zh) * 2018-11-07 2019-12-10 浙江清华柔性电子技术研究院 可拉伸柔性电子器件
CN209374444U (zh) * 2019-03-11 2019-09-10 深圳市腾顺电子材料有限公司 一种芯片emi屏蔽弹性体及芯片emi屏蔽与散热装置
CN114496944A (zh) * 2020-10-26 2022-05-13 华为技术有限公司 减小芯片电磁噪声的散热组件、芯片封装组件及电子设备

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