WO2023092261A1 - 显示基板及显示装置 - Google Patents

显示基板及显示装置 Download PDF

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Publication number
WO2023092261A1
WO2023092261A1 PCT/CN2021/132346 CN2021132346W WO2023092261A1 WO 2023092261 A1 WO2023092261 A1 WO 2023092261A1 CN 2021132346 W CN2021132346 W CN 2021132346W WO 2023092261 A1 WO2023092261 A1 WO 2023092261A1
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Prior art keywords
light
layer
display substrate
reflective structure
substrate
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PCT/CN2021/132346
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English (en)
French (fr)
Inventor
祝文秀
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/260,814 priority Critical patent/US20240074293A1/en
Priority to CN202180003529.7A priority patent/CN116649009A/zh
Priority to PCT/CN2021/132346 priority patent/WO2023092261A1/zh
Publication of WO2023092261A1 publication Critical patent/WO2023092261A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display substrate and a display device.
  • a fingerprint is a biological feature that can be distinguished from other people. It is composed of ridges and valleys on the surface of the skin, which determine the uniqueness of the fingerprint pattern.
  • a display device with a fingerprint recognition function has been used for personal identity verification, which increases the security of the display device.
  • Embodiments of the present disclosure provide a display substrate and a display device.
  • a display substrate includes: a substrate; a photosensitive device located on the substrate; a reflective structure located on a side of the photosensitive device away from the substrate and surrounding the photosensitive device in a direction parallel to the substrate, the reflective structure
  • the structure includes a first surface facing the photosensitive device, a second surface away from the photosensitive device, and a side surface connecting the first surface and the second surface; and a light processing part located on the light reflecting structure On at least one of the first surface and the side surface, the light reflectance of the light processing part is smaller than the light reflectance of the light reflective structure.
  • the display substrate further includes a light-emitting device for displaying, which is located on the substrate and spaced apart from the photosensitive device along a direction parallel to the substrate, wherein the light-emitting device comprising a first conductive layer, a light-emitting layer and a second conductive layer arranged in sequence along a direction away from the substrate, wherein the light-reflecting structure includes a first light-reflecting structure, and the second conductive layer includes the first light-reflecting structure,
  • the light processing portion includes a first light processing portion located on the first surface of the first light reflective structure.
  • the display substrate further includes a pixel defining layer on the substrate, and the pixel defining layer has a first opening for defining the photosensitive device and a first opening for defining the light emitting device. Second opening.
  • the material of the second conductive layer includes a transparent conductive material, wherein the second conductive layer continuously covers the pixel defining layer and the photosensitive device.
  • the first reflective structure includes a portion where the vertical projection of the second conductive layer on the substrate overlaps with the vertical projection of the pixel defining layer on the substrate.
  • the first light processing portion is located between the first light reflective structure and the pixel defining layer.
  • the first light processing portion at least partially covers the top surface of the pixel defining layer on a side away from the substrate.
  • the first light processing part covers the entire top surface of the pixel defining layer.
  • the first light processing portion only covers edge portions of the top surface of the pixel defining layer adjacent to the first opening and the second opening.
  • the size of the first optical processing portion in a direction parallel to the substrate is 3 microns.
  • the first light processing portion includes a portion of the pixel defining layer adjacent to the photosensitive device.
  • a portion of the pixel defining layer adjacent to the photosensitive device includes a light-absorbing material, and a portion of the pixel defining layer not adjacent to the photosensitive device includes a transparent material.
  • the reflective structure further includes a second reflective structure, the second reflective structure is located on the side of the first reflective structure away from the substrate, and the light processing part further includes The second light processing portion on the first surface of the second light reflective structure.
  • the light processing portion further includes a third light processing portion located on the side surface of the second light reflective structure adjacent to the photosensitive device.
  • the second reflective structure has an opening, wherein a vertical projection of the opening on the substrate at least partially overlaps a vertical projection of the photosensitive device on the substrate, wherein the first The three-light treatment part is located on the side wall of the opening.
  • the display substrate further includes a touch electrode layer located on a side of the second conductive layer away from the substrate, and the second reflective structure is disposed on the same layer as the touch electrode layer.
  • the optical processing part further includes a fourth optical processing part, and the fourth optical processing part is located on a surface of the touch electrode layer facing the substrate.
  • the display substrate further includes a first protection layer located between the first light reflective structure and the second light reflective structure, and a A black matrix layer, a polarizing layer, a second protective layer and a third protective layer are arranged in sequence.
  • the material of the second optical processing part, the third optical processing part, and the fourth optical processing part is the same as that of the black matrix layer.
  • a display device includes the display substrate according to the second aspect of the present disclosure.
  • FIG. 1 shows a schematic diagram of a display substrate.
  • FIG. 2 shows a schematic diagram of a display substrate according to an embodiment of the present disclosure.
  • FIG. 3 shows a schematic diagram of a display substrate according to an embodiment of the present disclosure.
  • FIG. 4 shows a schematic diagram of a display substrate according to an embodiment of the present disclosure.
  • FIG. 5 shows a schematic diagram of another display substrate according to an embodiment of the present disclosure.
  • FIG. 6 shows a schematic diagram of yet another display substrate according to an embodiment of the present disclosure.
  • FIG. 7 shows a schematic diagram of yet another display substrate according to an embodiment of the present disclosure.
  • FIG. 8A to 8C illustrate top views of a display substrate according to an embodiment of the present disclosure.
  • FIG. 9 shows a schematic diagram of the structure of a display device according to the present disclosure
  • FIG. 1 shows a schematic diagram of a display substrate 1 .
  • the display substrate 1 includes a substrate 10 , a photosensitive device 12 , reflective structures 142 and 144 generally including conductive structures such as metal wiring in the display substrate 1 , a light emitting device 18 , and a pixel defining layer 20 .
  • the light emitted by the light emitting device 18 passes through the laminated structure of the display substrate 1 to reach the finger, and then is reflected by the ridges and valleys of the finger to form reflected light, and finally the reflected light passes through the opening 1442 to reach the photosensitive device 12 .
  • the photosensitive device can measure the ratio of the light intensity reflected by the ridge line to the light intensity reflected by the valley line. The larger the ratio, the higher the accuracy of fingerprint identification.
  • the reflective structures 142 and 144 As shown in the light path of FIG. 1 , due to the existence of the reflective structures 142 and 144 , some of the light emitted by the light-emitting device 18 travels back and forth between the upper and lower surfaces of the reflective structure 142 during the process of passing through the stacked structure of the display substrate 1 . The reflected light finally reaches the photosensitive device 12 , and some light is reflected to the photosensitive device 12 by the lower surface of the light reflective structure 144 . However, considering that the reflectance difference between ridges and valleys is only 5%, the stray light reflected by these reflective structures will interfere with the light reflected by the finger, resulting in a smaller image difference between ridges and valleys (1:1.3 ), thereby reducing the accuracy of fingerprint recognition. .
  • FIG. 2 shows a schematic diagram of a display substrate 1 according to an embodiment of the present disclosure.
  • the display substrate 1 may include a substrate 10 , a photosensitive device 12 , light reflective structures 14 ( 142 , 144 ), and a light processing unit 16 ( 162 ).
  • the photosensitive device 12 is located on the substrate 10 .
  • the reflective structure 14 is located on the side 121 of the photosensitive device 12 away from the substrate 10, and surrounds the photosensitive device 12 along a direction parallel to the substrate 10, wherein the light reflective structure 14 includes a first surface facing the photosensitive device 12 and a second surface facing away from the photosensitive device 12. surface, and a side surface connecting the first surface and the second surface.
  • the light processing portion 16 is located on at least one of the first surface and the side surface of the light reflective structure 14 , wherein the light reflectivity of the light processing portion 16 is smaller than the light reflectivity of the light reflective structure 14 .
  • the display substrate by setting the light processing part on the reflective structure, it can prevent the reflective structure from reflecting light to the photosensitive device, thereby preventing the light reflected by the reflective structure from interfering with the light reflected by the finger, and improving fingerprint identification.
  • the accuracy enables users to obtain a better fingerprint identification experience.
  • the display substrate 1 may further include a light-emitting device 18 for display, which is located on the substrate 10 and spaced apart from the photosensitive device 12 along a direction parallel to the substrate 10 .
  • the light emitting device 18 may include a first conductive layer (eg, an anode layer (not shown)), a light emitting layer (not shown), and a second conductive layer 182 (eg, a cathode layer) sequentially disposed in a direction away from the substrate 10 .
  • the light reflective structure 14 may include a first light reflective structure 142
  • the second conductive layer 182 includes the first light reflective structure 142 .
  • the light processing part 16 may include a first light processing part 162 located on the first surface of the first light reflective structure 142 .
  • the display substrate 1 further includes a pixel defining layer 20 on the substrate 10 , and the pixel defining layer 20 has a first opening 202 and a second opening 204 .
  • the first opening 202 is used to define the photosensitive device 12 and the second opening 204 is used to define the light emitting device 18.
  • the material of the second conductive layer may include a transparent conductive material, such as indium tin oxide (ITO).
  • ITO indium tin oxide
  • the second conductive layer 182 continuously covers the pixel defining layer 20 and the photosensitive device 12 .
  • the first reflective structure 142 may include a portion 182 a of the second conductive layer 182 , and the vertical projection of the portion 182 a on the substrate 10 overlaps with the vertical projection of the pixel defining layer 20 on the substrate 10 .
  • the first light processing part 162 may be located between the first light reflective structure 142 and the pixel defining layer 142 . In this embodiment, the first light processing part 162 may at least partially cover the top surface of the pixel defining layer 20 on the side away from the substrate 10 .
  • the first light processing part 162 can cover the entire top surface of the pixel defining layer 20, so that the first light processing part 162 can absorb light from the first surface of the reflective structure 142 and the entire top surface of the pixel defining layer 20. The light is reflected back and forth between the top surfaces and thus transmitted, further improving the accuracy of fingerprint recognition.
  • the first light processing part 162 may only cover edge portions of the top surface of the pixel defining layer 20 adjacent to the first opening 202 and the second opening 204 .
  • the size of the first light processing portion 162 in the direction parallel to the substrate 10 is 3 micrometers.
  • FIG. 5 shows a schematic diagram of another display substrate 1 according to an embodiment of the present disclosure.
  • the first light processing part 162 may include a part 20 a of the pixel defining layer 20 adjacent to the photosensitive device 12 , that is, the first light processing part 162 is integrated with the part 20 a.
  • the portion 20a of the pixel defining layer 20 adjacent to the photosensitive device 12 may include a light-absorbing material
  • the portion 20b of the pixel defining layer 20 not adjacent to the photosensitive device 12 may include a transparent material.
  • FIG. 5 shows a schematic diagram of another display substrate 1 according to an embodiment of the present disclosure.
  • the first light processing part 162 may include a part 20 a of the pixel defining layer 20 adjacent to the photosensitive device 12 , that is, the first light processing part 162 is integrated with the part 20 a.
  • the portion 20a of the pixel defining layer 20 adjacent to the photosensitive device 12 may include a light-absorbing material
  • the light-emitting device 18 can emit light in various directions, and the light-absorbing material of the part 20a can absorb the light emitted by the light-emitting device 18 toward the photosensitive device 12, so as to reduce the entry of the part 20a through the pixel-defining layer 20 into the photosensitive device. 12 light, thereby avoiding the interference of the light on the light reflected by the finger, and further improving the accuracy of fingerprint identification.
  • FIGS. 3-5 are similar to those shown in FIG. 2 , and will not be described again here.
  • FIG. 6 shows a schematic diagram of yet another display substrate 1 according to an embodiment of the present disclosure.
  • the display substrate shown in FIG. 6 is similar to the display substrate shown in FIG. 4, the difference is that the reflective structure 14 shown in FIG.
  • the light processing part 16 may further include a second light processing part 164 , and the second light processing part 164 is located on the first surface of the second light reflecting structure 144 .
  • the second light processing part 164 can absorb the light incident on the first surface of the second light reflective structure 144, so as to prevent the first surface of the second light reflective structure 144 from reflecting light to the photosensitive device 12, and further improve the performance of fingerprints. Accuracy of recognition.
  • the light processing part 16 may further include a third light processing part 166, and the third light processing part 166 is located on the side surface of the second reflective structure 144 adjacent to the photosensitive device 12, so as to avoid the second The side surfaces of the reflective structure 144 reflect light to the photosensitive device 12 to further improve the accuracy of fingerprint identification.
  • the second reflective structure 144 may have an opening 1442, wherein the vertical projection of the opening 1442 on the substrate 10 and the vertical projection of the photosensitive device 12 on the substrate 10 at least partially overlap, so that the light reflected from the finger passes through the opening. 1442 reaches the photosensitive device 12 to realize fingerprint identification.
  • the third light processing part 166 is located on the sidewall of the opening 1442 .
  • the display substrate 1 may further include a touch electrode layer 22 located on a side of the second conductive layer 182 away from the substrate 10 , and the second reflective structure 144 is disposed on the same layer as the touch electrode layer 22 .
  • the second light-reflecting structure 144 and the touch electrode layer 22 are simultaneously formed by one patterning, thereby reducing the manufacturing process.
  • the light processing part 16 may further include a fourth light processing part 168 , and the fourth light processing part 168 is located on the surface of the touch electrode layer 22 facing the substrate 10 .
  • the fourth light processing part 168 can absorb the light incident on the surface of the touch electrode layer 22 facing the substrate 10, so as to prevent the surface of the touch electrode layer 22 from reflecting light to the photosensitive device 12, so as to further improve the accuracy of fingerprint identification. accuracy.
  • the ratio of the light intensity reflected by the ridge lines to the valley lines can be increased to 1:2.2.
  • the display substrate 1 further includes a first protective layer 24 located between the first light reflective structure 142 and the second light reflective structure 144 , and a protective layer 24 located between the second light reflective structure 144 .
  • a black matrix layer 26 , a polarizing layer 28 , a second protection layer 30 , and a third protection layer 32 are arranged in sequence away from the substrate 10 .
  • the vertical projection of the black matrix layer 26 on the substrate 10 is entirely within the vertical projection of the portion 20b of the pixel defining layer on the substrate 10 to reduce light shielding and further increase the aperture ratio of the display substrate 1 .
  • the material of the second light processing part, the third light processing part, and the fourth light processing part may be the same as that of the black matrix layer.
  • the first protective layer may be a thin film encapsulation layer, and the thin film encapsulation layer may adopt an inorganic/organic/inorganic three-layer structure or a multilayer structure.
  • the touch electrode layer may include a single-layer metal grid or a multi-layer metal grid, and the grid avoids the light-emitting area of the display substrate.
  • the polarizing layer may be a circular polarizer
  • the second protective layer may be an optical adhesive layer for bonding the third protective layer and the polarizing layer
  • the third protective layer may be a cover layer.
  • FIG. 7 shows a schematic diagram of yet another display substrate 1 according to an embodiment of the present disclosure.
  • the display substrate shown in FIG. 7 is similar to the display substrate shown in FIG. 6, the difference is that the optical processing part 16 of the display substrate 1 shown in FIG. Light processing unit 168 .
  • the ratio of the light intensity reflected by the ridge lines to the valley lines is 1:1.8.
  • the photosensitive device may be located in the display area of the display substrate, which may include a photosensor capable of sensing light and converting the light signal into an electrical signal, such as a thin film transistor, a photodiode or an organic Photodiode.
  • each light-emitting device 18 can be a pixel unit, and each pixel unit can include a red sub-pixel unit R, a green sub-pixel unit G, and a blue sub-pixel unit B, wherein, in FIGS. 8A to 8C Each sub-pixel unit has a different arrangement.
  • Each pixel unit can correspond to a photosensitive device to accurately identify fingerprints.
  • the light-absorbing material may include a black resin material, such as a resin material added with black light-shielding particles, or a black metal material or metal oxide material.
  • FIG. 9 shows a schematic diagram of the structure of a display device 2 according to the present disclosure.
  • the display device 2 includes the display substrate 1 as described above.
  • the display device 2 according to the embodiment of the present disclosure by providing a light processing part on the light-reflecting structure, it is possible to prevent the light-reflecting structure from reflecting light to the photosensitive device, thereby preventing the light reflected by the light-reflecting structure from interfering with the light reflected by the finger, and improving the quality of fingerprints.
  • the accuracy of recognition enables users to obtain a better fingerprint recognition experience.
  • the display device may be an organic light emitting diode.
  • the display device may be a quantum dot display device or a micro LED display device.

Abstract

本公开的实施例提供一种显示基板。显示基板包括：基板；感光器件，位于基板上；反光结构，位于感光器件远离基板的一侧且在沿平行于基板的方向围绕感光器件，反光结构包括朝向感光器件的第一表面、背离感光器件的第二表面、以及连接第一表面和第二表面的侧表面；以及光处理部，位于反光结构的第一表面和侧表面的至少一者上，光处理部的光反射率小于反光结构的光反射率。

Description

显示基板及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及显示装置。
背景技术
指纹是可以与其他人相区别的生物特征，它由皮肤表面上的脊线和谷线组成，这些脊线和谷线决定了指纹图案的唯一性。具有指纹识别功能的显示装置已经被用于个人身份验证上，这增加了显示装置的安全性。
发明内容
本公开的实施例提供了一种显示基板及显示装置。
根据本公开的第一方面，提供了一种显示基板。所述显示基板，包括：基板；感光器件，位于所述基板上；反光结构，位于所述感光器件远离基板的一侧且在沿平行于所述基板的方向围绕所述感光器件，所述反光结构包括朝向所述感光器件的第一表面、背离所述感光器件的第二表面、以及连接所述第一表面和所述第二表面的侧表面；以及光处理部，位于所述反光结构的所述第一表面和所述侧表面的至少一者上，所述光处理部的光反射率小于所述反光结构的光反射率。
在本公开的实施例中，所述显示基板还包括用于显示的发光器件，其位于所述基板上且沿平行于所述基板的方向与所述感光器件间隔设置，其中，所述发光器件包括沿远离所述基板的方向依次设置的第一导电层、发光层和第二导电层，其中，所述反光结构包括第一反光结构，所述第二导电层包括所述第一反光结构，所述光处理部包括位于所述第一反光结构的所述第一表面上的第一光处理部。
在本公开的实施例中，所述显示基板还包括位于所述基板上的像素限定层，所述像素限定层具有用于限定所述感光器件的第一开口和用于限定所述发光器件的第二开口。
在本公开的实施例中，所述第二导电层的材料包括透明导电材料，其中，所述第二导电层连续覆盖所述像素限定层和所述感光器件。
在本公开的实施例中，所述第一反光结构包括所述第二导电层的在所述基板的垂直投影与所述像素限定层在所述基板的垂直投影重叠的部分。
在本公开的实施例中，所述第一光处理部位于所述第一反光结构与所述像素限定层之间。
在本公开的实施例中，所述第一光处理部至少部分覆盖所述像素限定层的远离所述基板一侧的顶表面。
在本公开的实施例中，所述第一光处理部覆盖所述像素限定层的整个所述顶表面。
在本公开的实施例中，所述第一光处理部仅覆盖所述像素限定层的所述顶表面的邻近所述第一开口和所述第二开口的边缘部分。
在本公开的实施例中，所述第一光处理部在平行于所述基板的方向上的尺寸为3微米。
在本公开的实施例中，所述第一光处理部包括所述像素限定层的与所述感光器件邻近的部分。
在本公开的实施例中，所述像素限定层的与所述感光器件邻近的部分包括吸光材料，所述像素限定层的与所述感光器件不邻近的部分包括透明材料。
在本公开的实施例中，所述反光结构还包括第二反光结构，所述第二反光结构位于所述第一反光结构远离所述基板的一侧，所述光处理部还包括位于所述第二反光结构的所述第一表面上的第二光处理部。
在本公开的实施例中，所述光处理部还包括位于所述第二反光结构的与所述感光器件邻近的所述侧表面上的第三光处理部。
在本公开的实施例中，所述第二反光结构具有开口，其中，所述开口 在所述基板的垂直投影与所述感光器件在所述基板的垂直投影至少部分重叠，其中，所述第三光处理部位于所述开口的侧壁上。
在本公开的实施例中，所述显示基板还包括位于所述第二导电层的远离所述基板一侧的触控电极层，所述第二反光结构与所述触控电极层同层设置。
在本公开的实施例中，所述光处理部包括还包括第四光处理部，所述第四光处理部位于所述触控电极层的朝向所述基板一侧的表面上。
在本公开的实施例中，所述显示基板还包括位于所述第一反光结构与所述第二反光结构之间的第一保护层，以及位于所述第二反光结构的远离所述基板一侧且依次设置的黑矩阵层、偏光层、第二保护层和第三保护层。
在本公开的实施例中，所述第二光处理部、所述第三光处理部、以及所述第四光处理部的材料与所述黑矩阵层的材料相同。
根据本公开的第二方面，提供了一种显示装置。所述显示装置包括根据本公开的第二方面中的显示基板。
适应性的进一步的方面和范围从本文中提供的描述变得明显。应当理解，本申请的各个方面可以单独或者与一个或多个其它方面组合实施。还应当理解，本文中的描述和特定实施例旨在说明的目的，并不旨在限制本申请的范围。
附图说明
本文中描述的附图用于仅对所选择的实施例的说明的目的，并不是所有可能的实施方式，并且不旨在限制本申请的范围，其中：
图1示出了一种显示基板的示意图。
图2示出了根据本公开的实施例的显示基板的示意图。
图3示出了根据本公开的实施例的显示基板的示意图。
图4示出了根据本公开的实施例的显示基板的示意图。
图5示出了根据本公开的实施例的另一显示基板的示意图。
图6示出了根据本公开的实施例的又一显示基板的示意图。
图7示出了根据本公开的实施例的又一显示基板的示意图。
图8A至8C示出了根据本公开的实施例的显示基板的俯视图。
图9示出了根据本公开的显示装置的结构的示意图
具体实施方式
现将参考附图详细描述各种实施例，其作为本公开的示例性示例而提供，以使得本领域技术人员能够实现本公开。
值得注意的是，以下附图和示例并不意味着限制本公开的范围。在使用已知的组件(或方法或过程)可以部分或全部实现本公开的特定元件的情况下，将仅描述对理解本公开所需要的这种已知组件(或方法或过程)的那些部分，并且这种已知组件的其它部分的详细描述将被省略以便不会混淆本公开。进一步地，各种实施例通过说明的方式包含与在此涉及的组件等同的现在和未来已知的等同物。
除非上下文中另外明确地指出，否则在本文和所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。相似地，用语“包含”、“包括”、“含有”和“具有”及其语法变型旨在包括性的并且表示可以存在除所列要素之外的另外的要素。在本文中使用术语“示例”之处，特别是当其位于一组术语之后时，所述“示例”仅仅是示例性的和阐述性的，且不应当被认为是独占性的或广泛性的。术语“第一”、“第二”、“第三”等仅用于描述的目的，而不能理解为指示或暗示相对重要性及形成顺序。
图1示出了一种显示基板1的示意图。如图1所示，显示基板1包括基板10、感光器件12、通常包括显示基板1中的诸如金属布线等的导电结构的反光结构142和144、发光器件18、以及像素限定层20。发光器件18所发射的光穿过显示基板1的叠层结构到达手指，然后被手指的脊线和谷线反射形成反射光，最终反射光穿过开口1442到达感光器件12。感光器件可以测量脊线所反射的光强度与谷线所反射的光强度的比值，该比值越大，指纹识别的准确性越高。
如图1的光路所示，由于反光结构142和144的存在，发光器件18所发射的光在穿过显示基板1的叠层结构的过程中，一些光在反光结构142的上下表面之间来回反射，最终到达感光器件12，另一些光被反光结构144的下表面反射到感光器件12。然而，考虑到脊线与谷线反射率差异仅为5％，这些被反光结构反射的杂散光会对手指反射的光产生干扰，导致较小的脊线和谷线的图像差异(1:1.3)，从而降低指纹识别的准确性。。
图2示出了根据本公开的实施例的显示基板1的示意图。如图2所示，显示基板1可包括基板10、感光器件12、反光结构14(142、144)、以及光处理部16(162)。感光器件12位于基板10上。反光结构14位于感光器件12远离基板10的一侧121，并且沿平行于基板10的方向围绕感光器件12，其中，反光结构14包括朝向感光器件12的第一表面、背离感光器件12的第二表面、以及连接第一表面和第二表面的侧表面。光处理部16位于反光结构14的第一表面和侧表面的至少一者上，其中，光处理部16的光反射率小于反光结构14的光反射率。
采用根据本公开的实施例的显示基板，通过在反光结构上设置光处理部，能够避免反光结构将光反射到感光器件，从而防止反光结构反射的光对手指反射的光产生干扰，提高指纹识别的准确性，使得用户获得更好的指纹识别体验。
继续参考图2，该显示基板1还可以包括用于显示的发光器件18，其位于基板10上，并且沿平行于基板10的方向与感光器件12间隔设置。发光器件18可包括沿远离基板10的方向依次设置的第一导电层(例如，阳极层(未示出))、发光层(未示出)和第二导电层182(例如，阴极层)。反光结构14可包括第一反光结构142，第二导电层182包括第一反光结构142。即，第二导电层182与第一反光结构142同层设置。在本公开中，术语“同层设置”指通过一次构图同时形成。光处理部16可以包括第一光处理部162，第一光处理部162位于第一反光结构142的第一表面上。
如图2所示，该显示基板1还包括位于基板10上的像素限定层20，像素限定层20具有第一开口202和第二开口204。第一开口202用于限定 感光器件12，第二开口204用于限定发光器件18。
在本公开的实施例中，该第二导电层的材料可以包括透明导电材料，诸如，氧化铟锡(ITO)。在图2所示的实施例中，第二导电层182连续覆盖像素限定层20和感光器件12。
如图2所示，第一反光结构142可以包括第二导电层182的一部分182a，该部分182a在基板10的垂直投影与像素限定层20在基板10的垂直投影重叠。
在本公开的实施例中，第一光处理部162可位于第一反光结构142与像素限定层142之间。在该实施例中，第一光处理部162可以至少部分覆盖像素限定层20的远离基板10一侧的顶表面。
以下将参考图3和图4，详细说明第一光处理部162如何覆盖像素限定层20的顶表面。
在图3所示的实施例中，第一光处理部162可以覆盖像素限定层20的整个顶表面，这样第一光处理部162可以吸收在反光结构142的第一表面与像素限定层的整个顶表面之间来回反射并由此传播的光，从而进一步提高指纹识别的准确性。
在图4所示的实施例中，第一光处理部162可以仅覆盖像素限定层20的顶表面的邻近第一开口202和第二开口204的边缘部分。在该实施例中，第一光处理部162在平行于基板10的方向上的尺寸为3微米。通过使像素限定层的非边缘部分暴露，可以减少对光的遮挡，以增加显示基板1的开口率。采用图4所示的显示基板1进行指纹识别，脊线与谷线所反射的光强度的比值为1:1.8。
图5示出了根据本公开的实施例的另一显示基板1的示意图。如图5所示，第一光处理部162可以包括像素限定层20的与感光器件12邻近的部分20a，即，第一光处理部162与该部分20a为一个整体。在该实施例中，像素限定层20的与感光器件12邻近的部分20a可以包括吸光材料，像素限定层20的与感光器件12不邻近的部分20b可以包括透明材料。如图5所示，发光器件18可以朝向各个方向发射光，部分20a的吸光材料可 以吸收发光器件18朝向感光器件12所发射的光，以减少穿过像素限定层20的部分20a进入到感光器件12的光，从而避免该光对手指反射的光的干扰，进一步提高指纹识别的准确性。
需要说明的是，图3-5所示的显示基板的其它结构和/或功能与图2所示的结构和/或功能类似，在此不再重复描述。
图6示出了根据本公开的实施例的又一显示基板1的示意图。图6所示显示基板与图4所示显示基板相似，区别在于，如图6所示的反光结构14还可以包括第二反光结构144，第二反光结构144位于第一反光结构142远离基板10的一侧，光处理部16还可以包括第二光处理部164，第二光处理部164位于第二反光结构144的第一表面上。在该实施例中，第二光处理部164可以吸收入射到第二反光结构144的第一表面上的光，避免第二反光结构144的第一表面将光反射到感光器件12，进一步提高指纹识别的准确性。
在图6所示的实施例中，光处理部16还可以包括第三光处理部166，第三光处理部166位于第二反光结构144的与感光器件12邻近的侧表面上，避免第二反光结构144的侧表面将光反射到感光器件12，以进一步提高指纹识别的准确性。
如图6所示，第二反光结构144可以具有开口1442，其中，开口1442在基板10的垂直投影与感光器件12在基板10的垂直投影至少部分重叠，以使得从手指反射的光穿过开口1442到达感光器件12，以实现指纹的识别。在该实施例中，第三光处理部166位于开口1442的侧壁上。
如图6所示，显示基板1还可以包括位于第二导电层182的远离基板10一侧的触控电极层22，第二反光结构144与触控电极层22同层设置。通过一次构图同时形成第二反光结构144与触控电极层22，由此减少制造工艺。
如图6所示，光处理部16还可以包括第四光处理部168，第四光处理部168位于触控电极层22的朝向基板10一侧的表面上。第四光处理部168可以吸收入射到触控电极层22的朝向基板10一侧的表面上的光，避免触 控电极层22的该表面将光反射到感光器件12，以进一步提高指纹识别的准确性。采用图6所示的显示基板1进行指纹识别，脊线与谷线所反射的光强度的比值可提高到1:2.2。
在本公开的实施例中，如图2-6所示，显示基板1还包括位于第一反光结构142与第二反光结构144之间的第一保护层24，以及位于第二反光结构144的远离基板10一侧且依次设置的黑矩阵层26、偏光层28、第二保护层30、以及第三保护层32。如图2-6所示，黑矩阵层26在基板10的垂直投影完全位于像素限定层的部分20b在基板10的垂直投影内，以减少对光的遮挡，进一步增加显示基板1的开口率。
在本公开的实施例中，第二光处理部、第三光处理部、以及第四光处理部的材料可以与黑矩阵层的材料相同。第一保护层可以是薄膜封装层，薄膜封装层可以采用无机/有机/无机三层结构或多层结构。触控电极层可以包括单层金属网格或多层金属网格，网格避开显示基板的发光区域。偏光层可以是圆偏光片，第二保护层可以是用于实现第三保护层与偏光层的粘结的光学胶层，第三保护层可以是盖板层。
图7示出了根据本公开的实施例的又一显示基板1的示意图。图7所示显示基板与图6所示显示基板相似，区别在于，图7所示的显示基板1的光处理部16仅包括第二光处理部164、第三光处理部166、以及第四光处理部168。采用图7所示的显示基板1进行指纹识别，脊线与谷线所反射的光强度的比值为1:1.8。
需要说明的是，在本公开的实施例中，感光器件可以位于显示基板的显示区域，其可以包括能够感应光并将光信号转换成电信号的光电传感器，诸如，薄膜晶体管、光敏二极管或有机光敏二极管。
图8A至8C示出了图4所示的显示基板1的俯视图。如图8A至8C所示，感光器件12和发光器件18在平行于像素限定层20的方向上布置。在该实施例中，每个发光器件18可以为一个像素单元，每个像素单元可以包括红色子像素单元R、绿色子像素单元G、以及蓝光子像素单元B，其中，图8A至8C中的各个子像素单元具有不同的排布方式。每个像素单元 可以对应一个感光器件，以精确识别指纹。
此外，在本公开的实施例中，吸光材料可以包括黑色树脂材料，例如加入黑色遮光粒子的树脂材料，或者呈现为黑色的金属材料或金属氧化物材料。
图9示出了根据本公开的显示装置2的结构的示意图。如图9所示，显示装置2包括如上所述的显示基板1。采用根据本公开的实施例的显示装置2，通过在反光结构上设置光处理部，能够避免反光结构将光反射到感光器件，从而防止反光结构反射的光对手指反射的光产生干扰，提高指纹识别的准确性，使得用户获得更好的指纹识别体验。
在本公开的实施例中，显示装置可以是有机发光二极管。可替换地，显示装置可以是量子点显示装置或微LED显示装置。
以上为了说明和描述的目的提供了实施例的前述描述。其并不旨在是穷举的或者限制本申请。特定实施例的各个元件或特征通常不限于特定的实施例，但是，在合适的情况下，这些元件和特征是可互换的并且可用在所选择的实施例中，即使没有具体示出或描述。同样也可以以许多方式来改变。这种改变不能被认为脱离了本申请，并且所有这些修改都包含在本申请的范围内。

Claims (20)

  1. 一种显示基板，包括：
    基板；
    感光器件，位于所述基板上；
    反光结构，位于所述感光器件远离所述基板的一侧且在沿平行于所述基板的方向围绕所述感光器件，所述反光结构包括朝向所述感光器件的第一表面、背离所述感光器件的第二表面、以及连接所述第一表面和所述第二表面的侧表面；以及
    光处理部，位于所述反光结构的所述第一表面和所述侧表面的至少一者上，所述光处理部的光反射率小于所述反光结构的光反射率。
  2. 根据权利要求1所述的显示基板，还包括用于显示的发光器件，其位于所述基板上且沿平行于所述基板的方向与所述感光器件间隔设置，其中，所述发光器件包括沿远离所述基板的方向依次设置的第一导电层、发光层和第二导电层，其中，所述反光结构包括第一反光结构，所述第二导电层包括所述第一反光结构，所述光处理部包括位于所述第一反光结构的所述第一表面上的第一光处理部。
  3. 根据权利要求2所述的显示基板，还包括位于所述基板上的像素限定层，所述像素限定层具有用于限定所述感光器件的第一开口和用于限定所述发光器件的第二开口。
  4. 根据权利要求3所述的显示基板，其中，所述第二导电层的材料包括透明导电材料，其中，所述第二导电层连续覆盖所述像素限定层和所述感光器件。
  5. 根据权利要求4所述的显示基板，其中，所述第一反光结构包括所述第二导电层的在所述基板的垂直投影与所述像素限定层在所述基板的垂直投影重叠的部分。
  6. 根据权利要求5所述的显示基板，其中，所述第一光处理部位于所述第一反光结构与所述像素限定层之间。
  7. 根据权利要求6所述的显示基板，其中，所述第一光处理部至少部 分覆盖所述像素限定层的远离所述基板一侧的顶表面。
  8. 根据权利要求7所述的显示基板，其中，所述第一光处理部覆盖所述像素限定层的整个所述顶表面。
  9. 根据权利要求7所述的显示基板，其中，所述第一光处理部仅覆盖所述像素限定层的所述顶表面的邻近所述第一开口和所述第二开口的边缘部分。
  10. 根据权利要求9所述的显示基板，其中，所述第一光处理部在平行于所述基板的方向上的尺寸为3微米。
  11. 根据权利要求5所述的显示基板，其中，所述第一光处理部包括所述像素限定层的与所述感光器件邻近的部分。
  12. 根据权利要求11所述的显示基板，其中，所述像素限定层的与所述感光器件邻近的部分包括吸光材料，所述像素限定层的与所述感光器件不邻近的部分包括透明材料。
  13. 根据权利要求2至12中任一项所述的显示基板，其中，所述反光结构还包括第二反光结构，所述第二反光结构位于所述第一反光结构远离所述基板的一侧，所述光处理部还包括位于所述第二反光结构的所述第一表面上的第二光处理部。
  14. 根据权利要求13所述的显示基板，其中，所述光处理部还包括位于所述第二反光结构的与所述感光器件邻近的所述侧表面上的第三光处理部。
  15. 根据权利要求14所述的显示基板，其中，所述第二反光结构具有开口，其中，所述开口在所述基板的垂直投影与所述感光器件在所述基板的垂直投影至少部分重叠，其中，所述第三光处理部位于所述开口的侧壁上。
  16. 根据权利要求15所述的显示基板，还包括位于所述第二导电层的远离所述基板一侧的触控电极层，所述第二反光结构与所述触控电极层同层设置。
  17. 根据权利要求16所述的显示基板，所述光处理部包括还包括第四 光处理部，所述第四光处理部位于所述触控电极层的朝向所述基板一侧的表面上。
  18. 根据权利要求17所述的显示基板，还包括位于所述第一反光结构与所述第二反光结构之间的第一保护层，以及位于所述第二反光结构的远离所述基板一侧且依次设置的黑矩阵层、偏光层、第二保护层和第三保护层。
  19. 根据权利要求18所述的显示基板，其中，所述第二光处理部、所述第三光处理部、以及所述第四光处理部的材料与所述黑矩阵层的材料相同。
  20. 一种显示装置，包括根据权利要求1-19中任一项所述的显示基板。
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CN111599846A (zh) * 2020-05-29 2020-08-28 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN113327966A (zh) * 2021-05-31 2021-08-31 京东方科技集团股份有限公司 一种显示面板及其制备方法
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