WO2023082565A1 - Mmic microwave power amplifier and radio frequency front-end module - Google Patents

Mmic microwave power amplifier and radio frequency front-end module Download PDF

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Publication number
WO2023082565A1
WO2023082565A1 PCT/CN2022/090598 CN2022090598W WO2023082565A1 WO 2023082565 A1 WO2023082565 A1 WO 2023082565A1 CN 2022090598 W CN2022090598 W CN 2022090598W WO 2023082565 A1 WO2023082565 A1 WO 2023082565A1
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power
input
balun
planar
transmission line
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PCT/CN2022/090598
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French (fr)
Chinese (zh)
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彭艳军
宣凯
郭嘉帅
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深圳飞骧科技股份有限公司
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Publication of WO2023082565A1 publication Critical patent/WO2023082565A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/211—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers

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  • the invention relates to the technical field of wireless communication, in particular to an MMIC microwave power amplifier and a radio frequency front-end module.
  • the radio frequency/microwave power amplifier in the transmission link of the wireless communication system is used to amplify the transmission signal to a certain power level, and then drive the antenna to radiate the signal to a sufficient distance without distortion. to be detected by the receiving device.
  • the microwave power amplifier designed using the Microwave Monolithic Integrated Circuit (MMIC) process is limited by the breakdown voltage and power density of the device.
  • the output power of a single device is limited due to the limitation of physical characteristics.
  • the method of power synthesis is adopted to perform in-phase power synthesis of multi-channel microwave solid-state devices, which is an effective method to obtain high output microwave power, including: chip-level power synthesis, circuit-level power synthesis, and space power synthesis. . Since space power combining technology is not suitable for MMIC process manufacturing, chip-level power combining and circuit-level power combining are common methods for high-power MMIC microwave power amplifiers.
  • the circuit-level power combining technology is to combine two or more power tube amplifiers through a power combiner to obtain greater output power. Its advantage is that the mutual influence between each power unit is small, the adjustment is convenient, and the matching performance is good. It is a relatively mature high-power synthesis technology at present.
  • the most commonly used microwave power circuit-level synthesis method in engineering is the power synthesis of two-way power signals. This is because in most applications, wireless communication systems require the input and output of microwave power amplifiers to be single-ended, and it is very convenient to use a balun. It realizes the conversion from single-ended signal to two-way differential signal, and has a simple structure and is easy to implement.
  • the differential power amplifier not only doubles the output power of the single-ended amplifier, but also has strong anti-interference and anti-noise capabilities, is easy to ground, and has even harmonic suppression capabilities.
  • the differential microwave power amplifier is widely used in MMIC circuit design. for use.
  • the differential type MMIC microwave power amplifier in the related art often adopts a coaxial transmission line transformer balun or a helical wire transformer balun to realize two-way power synthesis.
  • the coaxial transmission line transformer balun uses a coaxial line, which is a non-planar circuit technology, which is not conducive to product miniaturization.
  • the currents inside the coaxial cable are equal in size and opposite in phase.
  • the output currents at the two output terminals can be guaranteed to be equal, the output voltages are not necessarily equal, and the consistency and stability of the output power are also affected; the insertion loss of the helical balun is relatively high.
  • the primary coil and secondary coil of the helical balun must be connected in parallel or in series with multiple off-chip passive components, which is detrimental to the overall cost, product chain supply and reliability.
  • the present invention proposes a MMIC microwave power amplifier and radio frequency front-end module with high output power, small size, low cost and high reliability.
  • an MMIC microwave power amplifier which includes:
  • Input terminal used to connect single-ended input signal
  • an input power divider the input of the input power divider is connected to the input end, and is used to receive the input signal and convert the input signal into two differential signals;
  • a power amplifying unit the input terminals of the power amplifying unit are respectively connected to the two outputs of the input power divider, and are used to respectively amplify the power of the two differential signals and output them;
  • a power combining unit the input of the power combining unit is respectively connected to the two outputs of the power amplifying unit, and is used to output the two differential signals amplified by the power amplifying unit after power combining;
  • the power The synthesis unit is a planar delay line balun with a planar structure, and the planar delay line balun is made by a planar circuit process;
  • the output terminal is connected to the output of the power combining unit.
  • the planar delay line balun includes a first differential port, a second differential port, a first transmission line disposed on the same plane, a second transmission line opposite to the first transmission line and spaced from each other, and a common port;
  • the first end of the first transmission line is connected to the first differential port, the second end of the first transmission line is connected to the common common port;
  • the first end of the second transmission line is connected to the second differential port connected, the second end of the second transmission line is connected to the common port;
  • the first differential port and the second differential port are respectively connected to two outputs of the power amplifying unit;
  • the length of the second transmission line is set to be 1/4 wavelength, the length of the second transmission line is set to be 3/4 wavelength, and the line widths of the first transmission line and the second transmission line are the same.
  • the impedances of the first differential port, the second differential port and the common port are all 50 ohms.
  • the first transmission line is bent to form a plurality of n-type structures with downward openings, and the plurality of n-type structures are arranged from left to right and the opening ends are sequentially connected end to end to form a first linear structure;
  • the second transmission line is bent to form a plurality of u-shaped structures with upward openings, and the plurality of u-shaped structures are arranged from left to right and the opening ends are connected end to end in turn to form a second linear structure, and the plurality of n-shaped structures It is arranged in direct opposition to a plurality of said u-shaped structures one by one.
  • the width of the first linear structure along the direction from top to bottom is one-third of the width of the second linear structure along the direction from top to bottom.
  • the planar delay line balun further includes an impedance transition section, one end of the impedance transition section is respectively connected to the second end of the first transmission line and the second end of the second transmission line, and the impedance transition section Connect the other end to the common port.
  • the input power divider is a second planar delay line balun with a planar structure
  • the second planar delay line balun is made by a planar circuit process
  • the structure of the second planar delay line balun The same structure as the planar delay line balun; the common port of the second planar delay line balun is connected to the input end, the first differential end of the second planar delay line balun and the second The second differential ports of the planar delay line balun are respectively connected to the input ends of the power amplifying units.
  • the input power divider includes an on-chip helical transformer balun and a second power amplifying unit; the first end of the primary coil of the on-chip helical transformer balun is connected to the input end, and the primary The second end of the coil is connected to the ground; the two ends of the secondary coil of the on-chip helical transformer balun are respectively connected to the power amplification unit as two outputs of the input power divider; the second power The amplifying unit is connected in series between the input end and the first end of the primary coil.
  • the two outputs of the input power divider are respectively connected in series with the input matching network with the power amplifying unit, and the two outputs of the power amplifying unit are respectively connected in series with the output matching network with the power combining unit.
  • An embodiment of the present invention also provides a radio frequency front-end module, which includes the above-mentioned MMIC microwave power amplifier provided by the embodiment of the present invention.
  • the input of the power synthesis unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplification unit for combining the power
  • the two-way differential signals amplified by the amplifying unit are output after power synthesis, so as to achieve the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier.
  • the present invention sets the power synthesis unit as a plane Structured planar delay line balun, the planar delay line balun is made by planar circuit technology, the junction is simple, and the planar delay line balun made by planar circuit technology can realize product miniaturization because of its small size, and at the same time, the planar circuit
  • the planar delay line balun made by the technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.
  • Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier that the embodiment of the present invention provides;
  • Fig. 2 is the structure diagram of the planar delay line balun circuit of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention
  • Fig. 3 is the circuit schematic diagram of another kind of MMIC microwave power amplifier provided by the embodiment of the present invention.
  • Fig. 4 is a structural block diagram of a radio frequency front-end module provided by an embodiment of the present invention.
  • Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention
  • Fig. 2 is the planar delay line of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention Balun circuit diagram.
  • the present invention provides an MMIC microwave power amplifier 100, comprising: an input terminal RFin, an input power divider 1, a power amplification unit 2, a power combining unit 3, and an output terminal RFout.
  • the input terminal RFin is used to connect a single-ended input signal.
  • the input of the input power splitter 1 is connected to the input terminal RFin, for receiving the input signal and converting the input signal into two differential signals.
  • the input terminals of the power amplifying unit 2 are respectively connected to the two outputs of the input power divider 1 for respectively amplifying the power of the two differential signals and outputting them.
  • the power amplifying unit 2 can be two sets of power amplifiers PA1 and PA2 respectively connected in series to the two differential signals, or it can be a power amplifying chip PA Die, which is easy to understand, and its functions and purposes are the same.
  • the input of the power combining unit 3 is respectively connected to the two outputs of the power amplifying unit 2 for combining the two differential signals amplified by the power amplifying unit 2 before outputting.
  • the power combining unit 3 of the present invention is a differential power amplification structure, so that the output power of the single-ended input signal input by the input terminal RFin is effectively doubled and then output to achieve the purpose of high power output, and the anti-interference and noise capabilities Strong, and has the ability to suppress even harmonics.
  • the power combining unit 3 is a planar delay line balun with a planar structure, and the planar delay line balun is made by planar circuit technology.
  • the performance of the power combining unit 3 is the key to ensure the performance of the MMIC microwave power amplifier 100.
  • the power combining unit 3 is set as a planar delay line balun with a planar structure. Due to its small size, the delay line balun can realize product miniaturization. At the same time, the insertion loss of the planar delay line balun made by planar circuit technology is small, and it can achieve better transmission without additional parallel or series connection of multiple off-chip passive components. Power, to achieve the purpose of high reliability and consistency of power transmission.
  • the planar delay line balun includes a first differential port P + , a second differential port P ⁇ arranged on the same plane, a first transmission line 31 , and a second transmission line 31 opposite to and spaced from each other.
  • Transmission line 32 and common port CM are common ports.
  • the first end A of the first transmission line 31 is connected to the first differential port P + , and the second end B of the first transmission line 31 is connected to the common port CM.
  • the first end C of the second transmission line 32 is connected to the second differential port 32
  • the second end D of the second transmission line 34 is connected to the common port CM.
  • the first differential port P + and the second differential port P ⁇ are respectively connected to two outputs of the power amplifying unit 2 .
  • the length of the first transmission line 31 is set to be a quarter of the wavelength, that is, the length from the first end A to the second end B of the first transmission line 31 is a quarter of the working wavelength.
  • the length of the second transmission line 32 is set to three-quarters of the working wavelength, that is, the length from the first end C to the second end D of the second transmission line 32 is three-quarters of the wavelength to achieve a phase difference of 180 Degree conversion, and the line width of the first transmission line 31 and the second transmission line 32 are the same. After the microwave signal passes through the first transmission line 31 and the second transmission line 32, the phase difference is 180°.
  • the impedances of the first differential port P + , the second differential port P ⁇ , and the common port CM are all 50 ohms, so as to facilitate direct connection with a 50 ohm system.
  • the planar delay line balun further includes an impedance transition section 33, one end of the impedance transition section 33 is respectively connected to the second end B of the first transmission line 31 and the second end of the second transmission line 32 D, the other end of the impedance transition section 33 is connected to the common port CM, thereby realizing a smooth transition from the impedance of the first transmission line 31 and the second transmission line 32 to the 50 ohm impedance of the common port CM, further improving the power Transmission reliability and consistency.
  • the first transmission line 31 is bent to form a plurality of n-type structures 311 with downward openings, and the plurality of n-type structures 311 are arranged from left to right (that is, from the first end A to the second end A).
  • the two ends B) are arranged and the open ends are sequentially connected end to end to form a first linear structure.
  • the second transmission line 32 is bent to form a plurality of u-shaped structures 321 with upward openings, and the plurality of u-shaped structures 321 are arranged from left to right (that is, from the first end C to the second end D) and the open ends are
  • the end-to-end connections are sequentially formed to form a second linear structure.
  • the plurality of n-type structures 311 and the plurality of u-type structures 321 are arranged opposite to each other. The symmetry in the structure makes the planar delay line balun occupy the smallest area, which is convenient for product miniaturization.
  • the width L of the first linear structure along the direction from top to bottom is greater than that of the second linear structure along the direction from top to bottom (that is, the direction from D to F).
  • One-third of the width L2 is a size ratio setting. This size ratio setting makes the symmetry of the planar delay line balun better, thus ensuring that the phase difference between the upper and lower channels is 180 degrees.
  • the input power divider 1 can be set as a second planar delay line balun with a planar structure, the second planar delay line balun is made by a planar circuit process, and the The structure of the second planar delay line balun is the same as that of the planar delay line balun serving as the power combining unit 3 , that is, the structure of the second planar delay line balun is also the same as shown in FIG. 3 .
  • the common port CM of the second planar delay line balun is connected to the input terminal RFin, the first differential terminal output signal P + of the second planar delay line balun and the second planar delay line barun
  • the second differential port P of L - connected to the input terminals of the power amplifying unit 2 respectively, for example, connected to the input terminals of two groups of power amplifiers to realize power amplification.
  • the two outputs of the input power divider 1 and the power amplifying unit 2 are respectively connected in series with input matching networks, that is, the first input matching network 411 and the second input matching network 412, and the power amplifying
  • the two outputs of the unit 2 and the power combining unit 3 are respectively connected in series with output matching networks, that is, the first output matching network 413 and the second output matching network 414 to achieve impedance matching.
  • the input signal is transmitted to the second plane delay balun of the power amplifying unit 2 through the input terminal RFin and converted into differential signals RF - and RF + , wherein one differential signal RF - is matched by the first input
  • the network 411 is input to the power amplifier PA1 of the power amplifying unit 2, and the other differential signal RF+ is input to the power amplifier PA2 of the power amplifying unit 2 through the second input matching network 412 for amplification.
  • the output signal of the power amplifier PA1 is connected to the input terminal (the first differential port P + ) of the planar delay line balun serving as the power combining unit 3 via the first output matching network 413 .
  • the output signal of the power amplifier PA2 is connected to the input end of the planar delay line balun (the second differential port P ⁇ ) serving as the power combination unit 3 via the second output matching network 414 .
  • the planar delay line balun realizes the power combination of the two output differential signals of the power amplifier PA1 and the power amplifier PA2, and then outputs it through the output terminal RFout.
  • the present invention also provides another embodiment, as shown in FIG. 3 , which is a schematic circuit diagram of another MMIC microwave power amplifier provided by the embodiment of the present invention.
  • This embodiment is essentially the same as the embodiment shown in FIGS. 1-2 above, and its output still uses a planar delay balun as the power combining unit 303 .
  • the difference lies in the structure of the input power splitter, specifically:
  • the input power divider 301 includes an on-chip helical transformer balun 3011 and a second power amplifying unit PA0; the first end of the primary coil of the on-chip helical transformer balun 3011 is connected to the input terminal RFin, so The second end of the primary coil is connected to ground; the two ends of the secondary coil of the on-chip helical transformer balun 3011 are respectively connected to the power amplifying unit 302 as two outputs of the input power divider 3011 ( That is, the power amplifier PA1 and the power amplifier PA2).
  • the second power amplifying unit PA0 is connected in series between the input end RFin and the first end of the primary coil to form an inter-stage differential switching planar delay line balun structure MMIC microwave power amplifier.
  • the radio frequency input signal is amplified by the second power amplifier PA0 of the first-stage single-ended structure, it is connected to the on-chip helical transformer balun 3011 to realize the conversion from the single-ended signal to the differential signal, and the converted
  • the differential signal drives the power amplifying unit 302 (ie, the power amplifier PA1 and the power amplifier PA2)
  • its output signal is combined by the power combining unit 303 outside the chip.
  • the second power amplifier PA0 is added to increase the gain of the driver stage. accomplish.
  • the embodiment of the present invention also provides a radio frequency front-end module, as shown in Figure 4, which includes the above-mentioned MMIC microwave power amplifier PA, filter Filter, radio frequency switch SW and low noise amplifier LNA provided by the embodiment of the present invention.
  • the input of the power combining unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplifying unit, for combining the
  • the two-way differential signals amplified by the power amplification unit are output after power synthesis, thereby achieving the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier, and the present invention sets the power synthesis unit as A planar delay line balun with a planar structure.
  • the planar delay line balun is made by a planar circuit process and has a simple junction.
  • the planar delay line balun made by a planar circuit process can realize product miniaturization due to its small size.
  • the planar delay line balun made by circuit technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.

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Abstract

Provided in the present invention is an MMIC microwave power amplifier. The MMIC microwave power amplifier comprises: an input end; an input power divider, an input of which is connected to the input end, and is used for converting an input signal into two differential signals; a power amplification unit, an input end of which is respectively connected to two outputs of the input power divider, and is used for performing power amplification on the two differential signals and outputting same; a power synthesis unit, an input of which is respectively connected to two outputs of the power amplification unit, and is used for realizing power synthesis of the two differential signals that are amplified by the power amplification unit, wherein the power synthesis unit is a planar delay line balun of a planar structure, and the planar delay line balun is made by means of a planar circuit process; and an output end, which is connected to an output end of the power synthesis unit. Further provided in the present invention is a radio frequency front-end module. Compared with the prior art, the MMIC microwave power amplifier and the radio frequency front-end module of the present invention are have a high output power, small size, low cost and high reliability.

Description

MMIC微波功率放大器及射频前端模组MMIC microwave power amplifier and RF front-end module 技术领域technical field
本发明涉及无线通信技术领域，尤其涉一种MMIC微波功率放大器及射频前端模组。The invention relates to the technical field of wireless communication, in particular to an MMIC microwave power amplifier and a radio frequency front-end module.
背景技术Background technique
为了将无线通信信号传播一定的通讯距离，无线通信系统发射链路的射频/微波功率放大器被用于将发射信号放大到一定功率水平，进而驱动天线将信号不失真地辐射到足够远的距离，以能够被接收设备检测出来。射频/微波功率放大器输出功率越大，信号传播的距离越远，然而，采用微波单片集成电路(Microwave Monolithic Integrated Circuit，MMIC)工艺设计的微波功率放大器受限于器件的击穿电压、功率密度等物理特性的限制，单个器件的输出功率有限。为了获得更大的输出功率，采用功率合成的方法，将多路微波固态器件进行同相功率合成，是获得高输出微波功率的有效方法，包括：芯片级功率合成、电路级功率合成、空间功率合成。由于空间功率合成技术不适合MMIC工艺制造，芯片级功率合成和电路级功率合成是高功率MMIC微波功率放大器常用方法。In order to propagate the wireless communication signal over a certain communication distance, the radio frequency/microwave power amplifier in the transmission link of the wireless communication system is used to amplify the transmission signal to a certain power level, and then drive the antenna to radiate the signal to a sufficient distance without distortion. to be detected by the receiving device. The greater the output power of the RF/microwave power amplifier, the farther the signal travels. However, the microwave power amplifier designed using the Microwave Monolithic Integrated Circuit (MMIC) process is limited by the breakdown voltage and power density of the device. The output power of a single device is limited due to the limitation of physical characteristics. In order to obtain greater output power, the method of power synthesis is adopted to perform in-phase power synthesis of multi-channel microwave solid-state devices, which is an effective method to obtain high output microwave power, including: chip-level power synthesis, circuit-level power synthesis, and space power synthesis. . Since space power combining technology is not suitable for MMIC process manufacturing, chip-level power combining and circuit-level power combining are common methods for high-power MMIC microwave power amplifiers.
其中，电路级功率合成技术是通过功率合成器把两个和多个功率管放大器组合在一起，以获得较大的输出功率。它的优点是各功率单元间的相互影响较小，调整方便，匹配性能好，是目前较为成熟的一种大功率合成技术。工程上最常用的微波功率电路级合成方式是两路功率信号的功率合成，这是因为在大多数应用中，无线通信系统要求微波功率放大器的输入输出是单端形式，采用巴伦可以很方便地实现单端信号到两路差分信号的转换，结构简单，容易实现。差分功率放大器不仅输出功率比单端形式的放大器增大了一 倍，而且抗干扰和抗噪声能力强，容易接地，具有偶数谐波抑制能力，差分形式的微波功率放大器在MMIC电路设计中被广为使用。Among them, the circuit-level power combining technology is to combine two or more power tube amplifiers through a power combiner to obtain greater output power. Its advantage is that the mutual influence between each power unit is small, the adjustment is convenient, and the matching performance is good. It is a relatively mature high-power synthesis technology at present. The most commonly used microwave power circuit-level synthesis method in engineering is the power synthesis of two-way power signals. This is because in most applications, wireless communication systems require the input and output of microwave power amplifiers to be single-ended, and it is very convenient to use a balun. It realizes the conversion from single-ended signal to two-way differential signal, and has a simple structure and is easy to implement. The differential power amplifier not only doubles the output power of the single-ended amplifier, but also has strong anti-interference and anti-noise capabilities, is easy to ground, and has even harmonic suppression capabilities. The differential microwave power amplifier is widely used in MMIC circuit design. for use.
然而，相关技术的差分形式MMIC微波功率放大器常采用同轴传输线变压器巴伦或螺旋线变压器巴伦实现两路功率的合成。而同轴传输线变压器巴伦要用到同轴线，为非平面电路工艺，不利于产品小型化。同轴电缆内部的电流大小相等且相位相反，虽然可保证两个输出端的输出电流相等，但输出电压不一定相等，输出功率的一致性和稳定性也受到影响；螺旋线巴伦的插损较大，为了更好地传递功率，螺旋线巴伦初级线圈和次级线圈还要并联或串联多个片外无源元件，对总体成本、产品链供应和可靠性都是不利的。However, the differential type MMIC microwave power amplifier in the related art often adopts a coaxial transmission line transformer balun or a helical wire transformer balun to realize two-way power synthesis. The coaxial transmission line transformer balun uses a coaxial line, which is a non-planar circuit technology, which is not conducive to product miniaturization. The currents inside the coaxial cable are equal in size and opposite in phase. Although the output currents at the two output terminals can be guaranteed to be equal, the output voltages are not necessarily equal, and the consistency and stability of the output power are also affected; the insertion loss of the helical balun is relatively high. Large, in order to better transmit power, the primary coil and secondary coil of the helical balun must be connected in parallel or in series with multiple off-chip passive components, which is detrimental to the overall cost, product chain supply and reliability.
因此，有必要提供一种新的功率合成技术设计高功率的MMIC微波功率放大器及射频前端模组以解决上述技术问题。Therefore, it is necessary to provide a new power combining technology to design high-power MMIC microwave power amplifiers and radio frequency front-end modules to solve the above technical problems.
发明内容Contents of the invention
针对以上相关技术的不足，本发明提出一种输出功率高、体积小、成本低且可靠性高的MMIC微波功率放大器及射频前端模组。In view of the deficiencies of the above related technologies, the present invention proposes a MMIC microwave power amplifier and radio frequency front-end module with high output power, small size, low cost and high reliability.
为了解决上述技术问题，本发明实施例提供了一种MMIC微波功率放大器，其包括，In order to solve the above technical problems, an embodiment of the present invention provides an MMIC microwave power amplifier, which includes:
输入端，用于连接单端的输入信号；Input terminal, used to connect single-ended input signal;
输入功率分配器，所述输入功率分配器的输入连接至所述输入端，用于接收所述输入信号并将所述输入信号转换为两路差分信号；an input power divider, the input of the input power divider is connected to the input end, and is used to receive the input signal and convert the input signal into two differential signals;
功率放大单元，所述功率放大单元的输入端分别连接至所述输入功率分配器的两路输出，用于分别将两路所述差分信号进行功率放大并输出；A power amplifying unit, the input terminals of the power amplifying unit are respectively connected to the two outputs of the input power divider, and are used to respectively amplify the power of the two differential signals and output them;
功率合成单元，所述功率合成单元的输入分别连接至所述功率放大单元的两路输出，用于将经所述功率放大单元放大的两路所述差分信号实现功率合成后输出；所述功率合成单元为呈平面结构的平面延迟线巴伦，所述平面延迟线巴伦通过平面电路工艺制成；以及，A power combining unit, the input of the power combining unit is respectively connected to the two outputs of the power amplifying unit, and is used to output the two differential signals amplified by the power amplifying unit after power combining; the power The synthesis unit is a planar delay line balun with a planar structure, and the planar delay line balun is made by a planar circuit process; and,
输出端，所述输出端连接至所述功率合成单元的输出。an output terminal, the output terminal is connected to the output of the power combining unit.
优选的，所述平面延迟线巴伦包括设置于同一平面的第一差分端口、第二差分端口、第一传输线、与所述第一传输线相对设置且相互间隔的第二传输线以及公共端口；所述第一传输线的第一端与所述第一差分端口连接，所述第一传输线的第二端与所述共公端口连接；所述第二传输线的第一端与所述第二差分端口连接，所述第二传输线的第二端与所述共公端口连接；所述第一差分端口和所述第二差分端口分别连接至所述功率放大单元的两路输出；所述第一传输线的长度设置为四分之一波长，所述第二传输线的长度设置为四分三波长，且所述第一传输线和所述第二传输线的线宽相同。Preferably, the planar delay line balun includes a first differential port, a second differential port, a first transmission line disposed on the same plane, a second transmission line opposite to the first transmission line and spaced from each other, and a common port; The first end of the first transmission line is connected to the first differential port, the second end of the first transmission line is connected to the common common port; the first end of the second transmission line is connected to the second differential port connected, the second end of the second transmission line is connected to the common port; the first differential port and the second differential port are respectively connected to two outputs of the power amplifying unit; the first transmission line The length of the second transmission line is set to be 1/4 wavelength, the length of the second transmission line is set to be 3/4 wavelength, and the line widths of the first transmission line and the second transmission line are the same.
优选的，所述第一差分端口、所述第二差分端口以及所述公共端口的阻抗均为50欧姆。Preferably, the impedances of the first differential port, the second differential port and the common port are all 50 ohms.
优选的，所述第一传输线弯折呈多个开口向下的n型结构，且多个所述n型结构从左向右排布且开口端依次首尾连接形成第一直线型结构；所述第二传输线弯折呈多个开口向上的u型结构，且多个所述u型结构从左向右排布且开口端依次首尾连接形成第二直线型结构，多个所述n型结构与多个所述u型结构一一正对设置。Preferably, the first transmission line is bent to form a plurality of n-type structures with downward openings, and the plurality of n-type structures are arranged from left to right and the opening ends are sequentially connected end to end to form a first linear structure; The second transmission line is bent to form a plurality of u-shaped structures with upward openings, and the plurality of u-shaped structures are arranged from left to right and the opening ends are connected end to end in turn to form a second linear structure, and the plurality of n-shaped structures It is arranged in direct opposition to a plurality of said u-shaped structures one by one.
优选的，所述第一直线型结构沿由上向下方向的宽度为所述第二直线型结构沿由上向下方向的宽度的三分之一。Preferably, the width of the first linear structure along the direction from top to bottom is one-third of the width of the second linear structure along the direction from top to bottom.
优选的，所述平面延迟线巴伦还包括阻抗过渡段，所述阻抗过渡段的一端分别连接所述第一传输线的第二端和所述第二传输线的第二端，所述阻抗过渡段的另一端连接至所述公共端口。Preferably, the planar delay line balun further includes an impedance transition section, one end of the impedance transition section is respectively connected to the second end of the first transmission line and the second end of the second transmission line, and the impedance transition section Connect the other end to the common port.
优选的，所述输入功率分配器为呈平面结构的第二平面延迟线巴伦，所述第二平面延迟线巴伦通过平面电路工艺制成，且所述第二平面延迟线巴伦的结构与所述平面延迟线巴伦的结构相同；所述第二平面延迟线巴伦的公共端口连接至所述输入端，所述第二平面延迟线巴伦的第一差分端和所述第二平面延迟线巴伦的第二差分端口分别连接至所述功率放大单元的输入端。Preferably, the input power divider is a second planar delay line balun with a planar structure, the second planar delay line balun is made by a planar circuit process, and the structure of the second planar delay line balun The same structure as the planar delay line balun; the common port of the second planar delay line balun is connected to the input end, the first differential end of the second planar delay line balun and the second The second differential ports of the planar delay line balun are respectively connected to the input ends of the power amplifying units.
优选的，所述输入功率分配器包括片内螺旋线变压器巴伦和第二功率放大单元；所述片内螺旋线变压器巴伦的初级线圈的第一端连接至所述输入端，所述初级线圈的第二端连接至接地；所述片内螺旋线变压器巴伦的次级线圈的两端分别作为所述输入功率分配器的两路输出连接至所述功率放大单元；所述第二功率放大单元串联至所述输入端与所述初级线圈的第一端之间。Preferably, the input power divider includes an on-chip helical transformer balun and a second power amplifying unit; the first end of the primary coil of the on-chip helical transformer balun is connected to the input end, and the primary The second end of the coil is connected to the ground; the two ends of the secondary coil of the on-chip helical transformer balun are respectively connected to the power amplification unit as two outputs of the input power divider; the second power The amplifying unit is connected in series between the input end and the first end of the primary coil.
优选的，所述输入功率分配器的两路输出与所述功率放大单元之间分别串联输入匹配网络，所述功率放大单元的两路输出与所述功率合成单元之间分别串联输出匹配网络。Preferably, the two outputs of the input power divider are respectively connected in series with the input matching network with the power amplifying unit, and the two outputs of the power amplifying unit are respectively connected in series with the output matching network with the power combining unit.
本发明实施例还提供一种射频前端模组，其包括本发明实施例提供的上述MMIC微波功率放大器。An embodiment of the present invention also provides a radio frequency front-end module, which includes the above-mentioned MMIC microwave power amplifier provided by the embodiment of the present invention.
与现有技术相比，本发明的MMIC微波功率放大器及射频前端模组，MMIC微波功率放大器的功率合成单元的输入分别连接至所述功率放大单元的两路输出，用于将经所述功率放大单元放大的两路所述差分信号实现功率合成后输出，从而实现输出功率高的目的；而功率合成单元的性能是保证功率放大器性能的关键，本发明将所述功率合成单元设置为呈平面结构的平面延迟线巴伦，所述平面延迟线巴伦通过平面电路工艺制成，结简单，通过平面电路工艺制成的平面延迟线巴伦因体积小可实现产品小型化，同时，平面电路工艺制成的平面延迟线巴伦插损小，无需额外并联或串联多个片外无源元件即可达实现更好的传递功率，达到了功率传递可靠性和一致性高的目的。Compared with the prior art, in the MMIC microwave power amplifier and the radio frequency front-end module of the present invention, the input of the power synthesis unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplification unit for combining the power The two-way differential signals amplified by the amplifying unit are output after power synthesis, so as to achieve the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier. The present invention sets the power synthesis unit as a plane Structured planar delay line balun, the planar delay line balun is made by planar circuit technology, the junction is simple, and the planar delay line balun made by planar circuit technology can realize product miniaturization because of its small size, and at the same time, the planar circuit The planar delay line balun made by the technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.
附图说明Description of drawings
下面结合附图详细说明本发明。通过结合以下附图所作的详细描述，本发明的上述或其他方面的内容将变得更清楚和更容易理解。附图中：The present invention will be described in detail below in conjunction with the accompanying drawings. The content of the above or other aspects of the present invention will become clearer and easier to understand through the detailed description in conjunction with the following drawings. In the attached picture:
图1为本发明实施例提供的一种MMIC微波功率放大器的电路原理图；Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier that the embodiment of the present invention provides;
图2为本发明实施例提供的一种MMIC微波功率放大器的平面延迟线巴伦电路结构图；Fig. 2 is the structure diagram of the planar delay line balun circuit of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention;
图3为本发明实施例提供的另一种MMIC微波功率放大器的电路原理图；Fig. 3 is the circuit schematic diagram of another kind of MMIC microwave power amplifier provided by the embodiment of the present invention;
图4为本发明实施例提供的射频前端模组的结构框图。Fig. 4 is a structural block diagram of a radio frequency front-end module provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图详细说明本发明的具体实施方式。Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
在此记载的具体实施方式/实施例为本发明的特定的具体实施方式，用于说明本发明的构思，均是解释性和示例性的，不应解释为对本发明实施方式及本发明范围的限制。除在此记载的实施例外，本领域技术人员还能够基于本申请权利要求书和说明书所公开的内容采用显而易见的其它技术方案，这些技术方案包括采用对在此记载的实施例的做出任何显而易见的替换和修改的技术方案，都在本发明的保护范围之内。The specific implementations/examples described here are specific specific implementations of the present invention, and are used to illustrate the concept of the present invention. limit. In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the description, and these technical solutions include adopting any obvious changes made to the embodiments described here. The replacement and modified technical solutions are all within the protection scope of the present invention.
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如上、下、前、后、左、右、内、外、侧面等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. The directional terms mentioned in the present invention, such as up, down, front, back, left, right, inside, outside, side, etc., are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.
请参图1-2所示，其中，图1为本发明实施例提供的一种MMIC微波功率放大器的电路原理图；图2为本发明实施例提供的一种MMIC微波功率放大器的平面延迟线巴伦电路结构图。本发明提供了一种MMIC微波功率放大器100，包括：输入端RFin、输入功率分配器1、功率放大单元2、功率合成单元3、输出端RFout。Please refer to shown in Fig. 1-2, wherein, Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention; Fig. 2 is the planar delay line of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention Balun circuit diagram. The present invention provides an MMIC microwave power amplifier 100, comprising: an input terminal RFin, an input power divider 1, a power amplification unit 2, a power combining unit 3, and an output terminal RFout.
输入端RFin，用于连接单端的输入信号。The input terminal RFin is used to connect a single-ended input signal.
所述输入功率分配器1的输入连接至所述输入端RFin，用于接收所述输入信号并将所述输入信号转换为两路差分信号。The input of the input power splitter 1 is connected to the input terminal RFin, for receiving the input signal and converting the input signal into two differential signals.
所述功率放大单元2的输入端分别连接至所述输入功率分配器1 的两路输出，用于分别将两路所述差分信号进行功率放大并输出。所述功率放大单元2可以为分别串联至两路所述差分信号上的两组功率放大器PA1和PA2，也可以为功率放大芯片PA Die，这是容易理解的，其功能和目的都一样。The input terminals of the power amplifying unit 2 are respectively connected to the two outputs of the input power divider 1 for respectively amplifying the power of the two differential signals and outputting them. The power amplifying unit 2 can be two sets of power amplifiers PA1 and PA2 respectively connected in series to the two differential signals, or it can be a power amplifying chip PA Die, which is easy to understand, and its functions and purposes are the same.
所述功率合成单元3的输入分别连接至所述功率放大单元2的两路输出，用于将经所述功率放大单元2放大的两路所述差分信号实现功率合成后输出。即本发明的功率合成单元3为差分功率放大结构，从而有效的将输入端RFin输入的单端输入信号的输出功率增大一倍后输出，实现高功率输出的目的，而且抗干扰和噪声能力强，且具有偶数谐波抑制能力。The input of the power combining unit 3 is respectively connected to the two outputs of the power amplifying unit 2 for combining the two differential signals amplified by the power amplifying unit 2 before outputting. That is to say, the power combining unit 3 of the present invention is a differential power amplification structure, so that the output power of the single-ended input signal input by the input terminal RFin is effectively doubled and then output to achieve the purpose of high power output, and the anti-interference and noise capabilities Strong, and has the ability to suppress even harmonics.
本实施方式中，所述功率合成单元3为呈平面结构的平面延迟线巴伦，所述平面延迟线巴伦通过平面电路工艺制成。功率合成单元3的性能是保证MMIC微波功率放大器100性能的关键，本发明将所述功率合成单元3设置为呈平面结构的平面延迟线巴伦，其结简单，通过平面电路工艺制成的平面延迟线巴伦因体积小可实现产品小型化，同时，平面电路工艺制成的平面延迟线巴伦插损小，无需额外并联或串联多个片外无源元件即可达实现更好的传递功率，达到了功率传递可靠性和一致性高的目的。In this embodiment, the power combining unit 3 is a planar delay line balun with a planar structure, and the planar delay line balun is made by planar circuit technology. The performance of the power combining unit 3 is the key to ensure the performance of the MMIC microwave power amplifier 100. In the present invention, the power combining unit 3 is set as a planar delay line balun with a planar structure. Due to its small size, the delay line balun can realize product miniaturization. At the same time, the insertion loss of the planar delay line balun made by planar circuit technology is small, and it can achieve better transmission without additional parallel or series connection of multiple off-chip passive components. Power, to achieve the purpose of high reliability and consistency of power transmission.
具体的，所述平面延迟线巴伦包括设置于同一平面的第一差分端口P +、第二差分端口P －、第一传输线31、与所述第一传输线31相对设置且相互间隔的第二传输线32以及公共端口CM。 Specifically, the planar delay line balun includes a first differential port P + , a second differential port P − arranged on the same plane, a first transmission line 31 , and a second transmission line 31 opposite to and spaced from each other. Transmission line 32 and common port CM.
所述第一传输线31的第一端A与所述第一差分端口P +连接，所述第一传输线31的第二端B与所述共公端口CM连接。 The first end A of the first transmission line 31 is connected to the first differential port P + , and the second end B of the first transmission line 31 is connected to the common port CM.
所述第二传输线32的第一端C与所述第二差分端口32连接，所述第二传输线34的第二端D与所述共公端口CM连接。The first end C of the second transmission line 32 is connected to the second differential port 32 , and the second end D of the second transmission line 34 is connected to the common port CM.
所述第一差分端口P +和所述第二差分端口P －分别连接至所述功率放大单元2的两路输出。 The first differential port P + and the second differential port P − are respectively connected to two outputs of the power amplifying unit 2 .
本实施方式中，所述第一传输线31的长度设置为四分之一波长， 即从所述第一传输线31的第一端A到第二端B的长度为四分之一工作波长。所述第二传输线32的长度设置为四分之三工作波长，即从所述第二传输线32的第一端C到第二端D的长度为四分之三波长，以实现相位差为180度的转换，且所述第一传输线31和所述第二传输线32的线宽相同。微波信号经过第一传输线31和第二传输线32后，相位相差180°。In this embodiment, the length of the first transmission line 31 is set to be a quarter of the wavelength, that is, the length from the first end A to the second end B of the first transmission line 31 is a quarter of the working wavelength. The length of the second transmission line 32 is set to three-quarters of the working wavelength, that is, the length from the first end C to the second end D of the second transmission line 32 is three-quarters of the wavelength to achieve a phase difference of 180 Degree conversion, and the line width of the first transmission line 31 and the second transmission line 32 are the same. After the microwave signal passes through the first transmission line 31 and the second transmission line 32, the phase difference is 180°.
本实施方式中，所述第一差分端口P +，所述第二差分端口P －，以及所述公共端口CM的阻抗均为50欧姆，以利于与50欧姆系统直接相连。 In this implementation manner, the impedances of the first differential port P + , the second differential port P − , and the common port CM are all 50 ohms, so as to facilitate direct connection with a 50 ohm system.
更优的，所述平面延迟线巴伦还包括阻抗过渡段33，所述阻抗过渡段33的一端分别连接所述第一传输线31的第二端B和所述第二传输线32的第二端D，所述阻抗过渡段33的另一端连接至所述公共端口CM，从而实现第一传输线31和第二传输线32的阻抗到所述公共端口CM的50欧姆阻抗的平滑过渡，进一步提高了功率传输的可靠性和一致性。More preferably, the planar delay line balun further includes an impedance transition section 33, one end of the impedance transition section 33 is respectively connected to the second end B of the first transmission line 31 and the second end of the second transmission line 32 D, the other end of the impedance transition section 33 is connected to the common port CM, thereby realizing a smooth transition from the impedance of the first transmission line 31 and the second transmission line 32 to the 50 ohm impedance of the common port CM, further improving the power Transmission reliability and consistency.
具体的，本实施方式中，所述第一传输线31弯折呈多个开口向下的n型结构311，且多个所述n型结构311从左向右(即从第一端A到第二端B)排布且开口端依次首尾连接形成第一直线型结构。所述第二传输线32弯折呈多个开口向上的u型结构321，且多个所述u型结构321从左向右(即从第一端C到第二端D)排布且开口端依次首尾连接形成第二直线型结构。多个所述n型结构311与多个所述u型结构321一一正对设置。结构上的对称，使得平面延迟线巴伦占用的面积最小，便于产品微型化。Specifically, in this embodiment, the first transmission line 31 is bent to form a plurality of n-type structures 311 with downward openings, and the plurality of n-type structures 311 are arranged from left to right (that is, from the first end A to the second end A). The two ends B) are arranged and the open ends are sequentially connected end to end to form a first linear structure. The second transmission line 32 is bent to form a plurality of u-shaped structures 321 with upward openings, and the plurality of u-shaped structures 321 are arranged from left to right (that is, from the first end C to the second end D) and the open ends are The end-to-end connections are sequentially formed to form a second linear structure. The plurality of n-type structures 311 and the plurality of u-type structures 321 are arranged opposite to each other. The symmetry in the structure makes the planar delay line balun occupy the smallest area, which is convenient for product miniaturization.
其中，所述第一直线型结构沿由上向下方向(即由E到B方向)的宽度L 1为所述第二直线型结构沿由上向下方向(即由D到F方向)的宽度L 2的三分之一。该尺寸比例设置使得平面延迟线巴伦的对称性更好，从而保证了上下两路的相位差为180度。 Wherein, the width L of the first linear structure along the direction from top to bottom (that is, the direction from E to B) is greater than that of the second linear structure along the direction from top to bottom (that is, the direction from D to F). One-third of the width L2 . This size ratio setting makes the symmetry of the planar delay line balun better, thus ensuring that the phase difference between the upper and lower channels is 180 degrees.
本实施方式中，更优的可将所述输入功率分配器1设置为呈平面 结构的第二平面延迟线巴伦，所述第二平面延迟线巴伦通过平面电路工艺制成，且所述第二平面延迟线巴伦的结构与作为功率合成单元3的所述平面延迟线巴伦的结构相同，即第二平面延迟线巴伦的结构也如图3所示一样。其中，所述第二平面延迟线巴伦的公共端口CM连接至所述输入端RFin，所述第二平面延迟线巴伦的第一差分端输出信号P +和所述第二平面延迟线巴伦的第二差分端口P －分别连接至所述功率放大单元2的输入端，比如分别连接至两组功率放大器的输入端以实现功率放大。 In this embodiment, more preferably, the input power divider 1 can be set as a second planar delay line balun with a planar structure, the second planar delay line balun is made by a planar circuit process, and the The structure of the second planar delay line balun is the same as that of the planar delay line balun serving as the power combining unit 3 , that is, the structure of the second planar delay line balun is also the same as shown in FIG. 3 . Wherein, the common port CM of the second planar delay line balun is connected to the input terminal RFin, the first differential terminal output signal P + of the second planar delay line balun and the second planar delay line barun The second differential port P of L - connected to the input terminals of the power amplifying unit 2 respectively, for example, connected to the input terminals of two groups of power amplifiers to realize power amplification.
本实施方式中，所述输入功率分配器1的两路输出与所述功率放大单元2之间分别串联输入匹配网络，即第一输入匹配网络411和第二输入匹配网络412，所述功率放大单元2的两路输出与所述功率合成单元3之间分别串联输出匹配网络，即第一输出匹配网络413和第二输出匹配网络414，实现阻抗匹配。In this embodiment, the two outputs of the input power divider 1 and the power amplifying unit 2 are respectively connected in series with input matching networks, that is, the first input matching network 411 and the second input matching network 412, and the power amplifying The two outputs of the unit 2 and the power combining unit 3 are respectively connected in series with output matching networks, that is, the first output matching network 413 and the second output matching network 414 to achieve impedance matching.
本实施方式的MMIC微波功率放大器100，输入信号经输入端RFin传输至功率放大单元2的第二平面延迟巴伦转换成差分信号RF －和RF +，其中一路差分信号RF-经过第一输入匹配网络411输入到功率放大单元2的功率放大器PA1，另一路差分信号RF+经过第二输入匹配网络412输入到功率放大单元2的功率放大器PA2进行放大。功率放大器PA1的输出信号经第一输出匹配网络413连接到作为功率合成单元3的平面延迟线巴伦的输入端(第一差分端口P +)。同样，功率放大器PA2的输出信号经第二输出匹配网络414连接到作为功率合成单元3的平面延迟线巴伦的输入端(第二差分端口P －)。平面延迟线巴伦实现对功率放大器PA1和功率放大器PA2两路输出差分信号的功率合成，再经输出端RFout输出。 In the MMIC microwave power amplifier 100 of this embodiment, the input signal is transmitted to the second plane delay balun of the power amplifying unit 2 through the input terminal RFin and converted into differential signals RF - and RF + , wherein one differential signal RF - is matched by the first input The network 411 is input to the power amplifier PA1 of the power amplifying unit 2, and the other differential signal RF+ is input to the power amplifier PA2 of the power amplifying unit 2 through the second input matching network 412 for amplification. The output signal of the power amplifier PA1 is connected to the input terminal (the first differential port P + ) of the planar delay line balun serving as the power combining unit 3 via the first output matching network 413 . Similarly, the output signal of the power amplifier PA2 is connected to the input end of the planar delay line balun (the second differential port P − ) serving as the power combination unit 3 via the second output matching network 414 . The planar delay line balun realizes the power combination of the two output differential signals of the power amplifier PA1 and the power amplifier PA2, and then outputs it through the output terminal RFout.
本发明还提供另一种实施例，如图3所示，为本发明实施例提供的另一种MMIC微波功率放大器的电路原理图。本实施例与上述图1-2所示的实施例其本相同，其输出仍使用平面延迟巴伦作为所述功率合成单元303。不同在于输入功率分配器结构不同，具体而言：The present invention also provides another embodiment, as shown in FIG. 3 , which is a schematic circuit diagram of another MMIC microwave power amplifier provided by the embodiment of the present invention. This embodiment is essentially the same as the embodiment shown in FIGS. 1-2 above, and its output still uses a planar delay balun as the power combining unit 303 . The difference lies in the structure of the input power splitter, specifically:
所述输入功率分配器301包括片内螺旋线变压器巴伦3011和第二功率放大单元PA0；所述片内螺旋线变压器巴伦3011的初级线圈的第一端连接至所述输入端RFin，所述初级线圈的第二端连接至接地；所述片内螺旋线变压器巴伦3011的次级线圈的两端分别作为所述输入功率分配器3011的两路输出连接至所述功率放大单元302(即功率放大器PA1和功率放大器PA2)。所述第二功率放大单元PA0串联至所述输入端RFin与所述初级线圈的第一端之间，形成级间差分转换平面延迟线巴伦结构MMIC微波功率放大器。The input power divider 301 includes an on-chip helical transformer balun 3011 and a second power amplifying unit PA0; the first end of the primary coil of the on-chip helical transformer balun 3011 is connected to the input terminal RFin, so The second end of the primary coil is connected to ground; the two ends of the secondary coil of the on-chip helical transformer balun 3011 are respectively connected to the power amplifying unit 302 as two outputs of the input power divider 3011 ( That is, the power amplifier PA1 and the power amplifier PA2). The second power amplifying unit PA0 is connected in series between the input end RFin and the first end of the primary coil to form an inter-stage differential switching planar delay line balun structure MMIC microwave power amplifier.
本实施方式中，射频输入信号经第一级单端结构的第二功率放大器PA0放大后，连接到所述片内螺旋线变压器巴伦3011，实现单端信号到差分信号的转换，转换后的差分信号驱动所述功率放大单元302(即功率放大器PA1和功率放大器PA2)后，其输出信号通过片外的所述功率合成单元303实现功率合成。受到片内螺旋线变压器巴伦3011的Q值较低的影响，输出增益会降低，当实现高增益的射频功率放大器时，则通过增加一级的第二功率放大器PA0，从而提高驱动级增益来实现。In this embodiment, after the radio frequency input signal is amplified by the second power amplifier PA0 of the first-stage single-ended structure, it is connected to the on-chip helical transformer balun 3011 to realize the conversion from the single-ended signal to the differential signal, and the converted After the differential signal drives the power amplifying unit 302 (ie, the power amplifier PA1 and the power amplifier PA2), its output signal is combined by the power combining unit 303 outside the chip. Affected by the low Q value of the on-chip helical transformer balun 3011, the output gain will decrease. When a high-gain RF power amplifier is realized, the second power amplifier PA0 is added to increase the gain of the driver stage. accomplish.
除上述区别外，其他结构、工作原理与实现的技术效果均与上述图1-2所示的实施例相同，在此不再赘述。Except for the above differences, other structures, working principles, and achieved technical effects are the same as those of the above-mentioned embodiment shown in FIGS. 1-2 , and will not be repeated here.
本发明实施例还提供一种射频前端模组，如图四所示，其包括本发明实施例提供的上述MMIC微波功率放大器PA、滤波器Filter、射频开关SW和低噪声放大器LNA。The embodiment of the present invention also provides a radio frequency front-end module, as shown in Figure 4, which includes the above-mentioned MMIC microwave power amplifier PA, filter Filter, radio frequency switch SW and low noise amplifier LNA provided by the embodiment of the present invention.
与现有技术相比，本发明的MMIC微波功率放大器及射频前端模组中，MMIC微波功率放大器的功率合成单元的输入分别连接至所述功率放大单元的两路输出，用于将经所述功率放大单元放大的两路所述差分信号实现功率合成后输出，从而实现输出功率高的目的；而功率合成单元的性能是保证功率放大器性能的关键，本发明将所述功率合成单元设置为呈平面结构的平面延迟线巴伦，所述平面延迟线巴伦通过平面电路工艺制成，结简单，通过平面电路工艺制成的平面延迟 线巴伦因体积小可实现产品小型化，同时，平面电路工艺制成的平面延迟线巴伦插损小，无需额外并联或串联多个片外无源元件即可达实现更好的传递功率，达到了功率传递可靠性和一致性高的目的。Compared with the prior art, in the MMIC microwave power amplifier and the radio frequency front-end module of the present invention, the input of the power combining unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplifying unit, for combining the The two-way differential signals amplified by the power amplification unit are output after power synthesis, thereby achieving the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier, and the present invention sets the power synthesis unit as A planar delay line balun with a planar structure. The planar delay line balun is made by a planar circuit process and has a simple junction. The planar delay line balun made by a planar circuit process can realize product miniaturization due to its small size. The planar delay line balun made by circuit technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.
需要说明的是，以上参照附图所描述的各个实施例仅用以说明本发明而非限制本发明的范围，本领域的普通技术人员应当理解，在不脱离本发明的精神和范围的前提下对本发明进行的修改或者等同替换，均应涵盖在本发明的范围之内。此外，除上下文另有所指外，以单数形式出现的词包括复数形式，反之亦然。另外，除非特别说明，那么任何实施例的全部或一部分可结合任何其它实施例的全部或一部分来使用。It should be noted that the various embodiments described above with reference to the accompanying drawings are only used to illustrate the present invention rather than limit the scope of the present invention. Those of ordinary skill in the art should understand that without departing from the spirit and scope of the present invention Any modifications or equivalent replacements made to the present invention shall fall within the scope of the present invention. Further, words appearing in the singular include the plural and vice versa unless the context otherwise requires. Additionally, all or a portion of any embodiment may be utilized with all or a portion of any other embodiment, unless stated otherwise.

Claims (10)

  1. 一种MMIC微波功率放大器，其特征在于，包括，A kind of MMIC microwave power amplifier is characterized in that, comprises,
    输入端，用于连接单端的输入信号；Input terminal, used to connect single-ended input signal;
    输入功率分配器，所述输入功率分配器的输入连接至所述输入端，用于接收所述输入信号并将所述输入信号转换为两路差分信号；an input power divider, the input of the input power divider is connected to the input end, and is used to receive the input signal and convert the input signal into two differential signals;
    功率放大单元，所述功率放大单元的输入端分别连接至所述输入功率分配器的两路输出，用于分别将两路所述差分信号进行功率放大并输出；A power amplifying unit, the input terminals of the power amplifying unit are respectively connected to the two outputs of the input power divider, and are used to respectively amplify the power of the two differential signals and output them;
    功率合成单元，所述功率合成单元的输入分别连接至所述功率放大单元的两路输出，用于将经所述功率放大单元放大的两路所述差分信号实现功率合成后输出；所述功率合成单元为呈平面结构的平面延迟线巴伦，所述平面延迟线巴伦通过平面电路工艺制成；以及输出端，所述输出端连接至所述功率合成单元的输出。A power combining unit, the input of the power combining unit is respectively connected to the two outputs of the power amplifying unit, and is used to output the two differential signals amplified by the power amplifying unit after power combining; the power The combination unit is a planar delay line balun with a planar structure, the planar delay line balun is made by planar circuit technology; and an output terminal, the output terminal is connected to the output of the power combination unit.
  2. 根据权利要求1所述的MMIC微波功率放大器，其特征在于，所述平面延迟线巴伦包括设置于同一平面的第一差分端口、第二差分端口、第一传输线、与所述第一传输线相对设置且相互间隔的第二传输线以及公共端口；所述第一传输线的第一端与所述第一差分端口连接，所述第一传输线的第二端与所述共公端口连接；所述第二传输线的第一端与所述第二差分端口连接，所述第二传输线的第二端与所述共公端口连接；所述第一差分端口和所述第二差分端口分别连接至所述功率放大单元的两路输出；所述第一传输线的长度设置为四分之一工作波长，所述第二传输线的长度设置为四分之三工作波长，且所述第一传输线和所述第二传输线的线宽相同。The MMIC microwave power amplifier according to claim 1, wherein the planar delay line balun includes a first differential port, a second differential port, a first transmission line arranged on the same plane, and is opposite to the first transmission line A second transmission line and a common port arranged and spaced apart from each other; the first end of the first transmission line is connected to the first differential port, and the second end of the first transmission line is connected to the common common port; the first end of the first transmission line is connected to the common port; The first end of the two transmission lines is connected to the second differential port, and the second end of the second transmission line is connected to the common common port; the first differential port and the second differential port are respectively connected to the Two outputs of the power amplifying unit; the length of the first transmission line is set to 1/4 of the working wavelength, the length of the second transmission line is set to 3/4 of the working wavelength, and the first transmission line and the second transmission line The two transmission lines have the same line width.
  3. 根据权利要求2所述的MMIC微波功率放大器，其特征在于，所述第一差分端口、所述第二差分端口以及所述公共端口的阻抗均为50欧姆。The MMIC microwave power amplifier according to claim 2, wherein the impedances of the first differential port, the second differential port and the common port are all 50 ohms.
  4. 根据权利要求2所述的MMIC微波功率放大器，其特征在于， 所述第一传输线弯折呈多个开口向下的n型结构，且多个所述n型结构从左向右排布且开口端依次首尾连接形成第一直线型结构；所述第二传输线弯折呈多个开口向上的u型结构，且多个所述u型结构从左向右排布且开口端依次首尾连接形成第二直线型结构，多个所述n型结构与多个所述u型结构一一正对设置。The MMIC microwave power amplifier according to claim 2, wherein the first transmission line is bent to form a plurality of n-type structures with downward openings, and the plurality of n-type structures are arranged from left to right with openings The ends are connected end to end in sequence to form a first linear structure; the second transmission line is bent to form a plurality of U-shaped structures with upward openings, and the plurality of U-shaped structures are arranged from left to right and the open ends are connected end to end in turn to form In the second linear structure, the plurality of n-type structures and the plurality of u-type structures are arranged opposite to each other.
  5. 根据权利要求4所述的MMIC微波功率放大器，其特征在于，所述第一直线型结构沿由上向下方向的宽度为所述第二直线型结构沿由上向下方向的宽度的三分之一。The MMIC microwave power amplifier according to claim 4, wherein the width of the first linear structure along the direction from top to bottom is three times the width of the second linear structure along the direction from top to bottom one-third.
  6. 根据权利要求2所述的MMIC微波功率放大器，其特征在于，所述平面延迟线巴伦还包括阻抗过渡段，所述阻抗过渡段的一端分别连接所述第一传输线的第二端和所述第二传输线的第二端，所述阻抗过渡段的另一端连接至所述公共端口。The MMIC microwave power amplifier according to claim 2, wherein the planar delay line balun also includes an impedance transition section, and one end of the impedance transition section is respectively connected to the second end of the first transmission line and the The second end of the second transmission line and the other end of the impedance transition section are connected to the common port.
  7. 根据权利要求2-6任意一项所述的MMIC微波功率放大器，其特征在于，所述输入功率分配器为呈平面结构的第二平面延迟线巴伦，所述第二平面延迟线巴伦通过平面电路工艺制成，且所述第二平面延迟线巴伦的结构与所述平面延迟线巴伦的结构相同；所述第二平面延迟线巴伦的公共端口连接至所述输入端，所述第二平面延迟线巴伦的第一差分端和所述第二平面延迟线巴伦的第二差分端口分别连接至所述功率放大单元的输入端。According to the MMIC microwave power amplifier described in any one of claims 2-6, it is characterized in that the input power divider is a second planar delay line balun in a planar structure, and the second planar delay line balun passes through manufactured by planar circuit technology, and the structure of the second planar delay line balun is the same as that of the planar delay line balun; the common port of the second planar delay line balun is connected to the input end, so The first differential end of the second planar delay line balun and the second differential port of the second planar delay line balun are respectively connected to the input end of the power amplification unit.
  8. 根据权利要求1-6任意一项所述的MMIC微波功率放大器，其特征在于，所述输入功率分配器包括片内螺旋线变压器巴伦和第二功率放大单元；所述片内螺旋线变压器巴伦的初级线圈的第一端连接至所述输入端，所述初级线圈的第二端连接至接地；所述片内螺旋线变压器巴伦的次级线圈的两端分别作为所述输入功率分配器的两路输出连接至所述功率放大单元；所述第二功率放大单元串联至所述输入端与所述初级线圈的第一端之间。According to the MMIC microwave power amplifier described in any one of claims 1-6, it is characterized in that the input power divider includes an on-chip helical transformer balun and a second power amplifying unit; the on-chip helical transformer balun The first end of the primary coil of the balun is connected to the input terminal, and the second end of the primary coil is connected to the ground; the two ends of the secondary coil of the on-chip helical transformer balun are respectively used as the input power distribution The two outputs of the device are connected to the power amplifying unit; the second power amplifying unit is connected in series between the input end and the first end of the primary coil.
  9. 根据权利要求1所述的MMIC微波功率放大器，其特征在于，所述输入功率分配器的两路输出与所述功率放大单元之间分别串联输 入匹配网络，所述功率放大单元的两路输出与所述功率合成单元之间分别串联输出匹配网络。MMIC microwave power amplifier according to claim 1, it is characterized in that, between the two-way output of described input power divider and described power amplifying unit, input matching network is connected in series respectively, the two-way output of described power amplifying unit and The power combining units are respectively connected in series to output matching networks.
  10. 一种射频前端模组，其特征在于，包括如权利要求1-9任意一项所述的MMIC微波功率放大器。A radio frequency front-end module, characterized in that it comprises the MMIC microwave power amplifier according to any one of claims 1-9.
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Publication number Priority date Publication date Assignee Title
CN114094960A (en) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 MMIC microwave power amplifier and radio frequency front end module
CN115549611B (en) * 2022-09-02 2023-06-06 佛山臻智微芯科技有限公司 Integrated outphasing radio frequency power amplifying circuit based on multipath power synthesis

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1845581A2 (en) * 2005-08-23 2007-10-17 Synergy Microwave Corproation Multilayer planar balun transformer, mixers and amplifiers
CN112019168A (en) * 2020-08-21 2020-12-01 武汉大学 Power amplifier based on slow wave microstrip line matching network
CN112187194A (en) * 2020-09-30 2021-01-05 锐石创芯（深圳）科技有限公司 Push-pull power amplifier, radio frequency front-end circuit and wireless device
CN113612456A (en) * 2021-10-11 2021-11-05 深圳飞骧科技股份有限公司 Broadband microwave power amplifier
CN114094960A (en) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 MMIC microwave power amplifier and radio frequency front end module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1845581A2 (en) * 2005-08-23 2007-10-17 Synergy Microwave Corproation Multilayer planar balun transformer, mixers and amplifiers
CN112019168A (en) * 2020-08-21 2020-12-01 武汉大学 Power amplifier based on slow wave microstrip line matching network
CN112187194A (en) * 2020-09-30 2021-01-05 锐石创芯（深圳）科技有限公司 Push-pull power amplifier, radio frequency front-end circuit and wireless device
CN113612456A (en) * 2021-10-11 2021-11-05 深圳飞骧科技股份有限公司 Broadband microwave power amplifier
CN114094960A (en) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 MMIC microwave power amplifier and radio frequency front end module

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