WO2023082565A1 - Amplificateur de puissance hyperfréquence mmic et module frontal radiofréquence - Google Patents

Amplificateur de puissance hyperfréquence mmic et module frontal radiofréquence Download PDF

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Publication number
WO2023082565A1
WO2023082565A1 PCT/CN2022/090598 CN2022090598W WO2023082565A1 WO 2023082565 A1 WO2023082565 A1 WO 2023082565A1 CN 2022090598 W CN2022090598 W CN 2022090598W WO 2023082565 A1 WO2023082565 A1 WO 2023082565A1
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Prior art keywords
power
input
balun
planar
transmission line
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PCT/CN2022/090598
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English (en)
Chinese (zh)
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彭艳军
宣凯
郭嘉帅
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深圳飞骧科技股份有限公司
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Publication of WO2023082565A1 publication Critical patent/WO2023082565A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
    • H03F3/211—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers

Definitions

  • the invention relates to the technical field of wireless communication, in particular to an MMIC microwave power amplifier and a radio frequency front-end module.
  • the radio frequency/microwave power amplifier in the transmission link of the wireless communication system is used to amplify the transmission signal to a certain power level, and then drive the antenna to radiate the signal to a sufficient distance without distortion. to be detected by the receiving device.
  • the microwave power amplifier designed using the Microwave Monolithic Integrated Circuit (MMIC) process is limited by the breakdown voltage and power density of the device.
  • the output power of a single device is limited due to the limitation of physical characteristics.
  • the method of power synthesis is adopted to perform in-phase power synthesis of multi-channel microwave solid-state devices, which is an effective method to obtain high output microwave power, including: chip-level power synthesis, circuit-level power synthesis, and space power synthesis. . Since space power combining technology is not suitable for MMIC process manufacturing, chip-level power combining and circuit-level power combining are common methods for high-power MMIC microwave power amplifiers.
  • the circuit-level power combining technology is to combine two or more power tube amplifiers through a power combiner to obtain greater output power. Its advantage is that the mutual influence between each power unit is small, the adjustment is convenient, and the matching performance is good. It is a relatively mature high-power synthesis technology at present.
  • the most commonly used microwave power circuit-level synthesis method in engineering is the power synthesis of two-way power signals. This is because in most applications, wireless communication systems require the input and output of microwave power amplifiers to be single-ended, and it is very convenient to use a balun. It realizes the conversion from single-ended signal to two-way differential signal, and has a simple structure and is easy to implement.
  • the differential power amplifier not only doubles the output power of the single-ended amplifier, but also has strong anti-interference and anti-noise capabilities, is easy to ground, and has even harmonic suppression capabilities.
  • the differential microwave power amplifier is widely used in MMIC circuit design. for use.
  • the differential type MMIC microwave power amplifier in the related art often adopts a coaxial transmission line transformer balun or a helical wire transformer balun to realize two-way power synthesis.
  • the coaxial transmission line transformer balun uses a coaxial line, which is a non-planar circuit technology, which is not conducive to product miniaturization.
  • the currents inside the coaxial cable are equal in size and opposite in phase.
  • the output currents at the two output terminals can be guaranteed to be equal, the output voltages are not necessarily equal, and the consistency and stability of the output power are also affected; the insertion loss of the helical balun is relatively high.
  • the primary coil and secondary coil of the helical balun must be connected in parallel or in series with multiple off-chip passive components, which is detrimental to the overall cost, product chain supply and reliability.
  • the present invention proposes a MMIC microwave power amplifier and radio frequency front-end module with high output power, small size, low cost and high reliability.
  • an MMIC microwave power amplifier which includes:
  • Input terminal used to connect single-ended input signal
  • an input power divider the input of the input power divider is connected to the input end, and is used to receive the input signal and convert the input signal into two differential signals;
  • a power amplifying unit the input terminals of the power amplifying unit are respectively connected to the two outputs of the input power divider, and are used to respectively amplify the power of the two differential signals and output them;
  • a power combining unit the input of the power combining unit is respectively connected to the two outputs of the power amplifying unit, and is used to output the two differential signals amplified by the power amplifying unit after power combining;
  • the power The synthesis unit is a planar delay line balun with a planar structure, and the planar delay line balun is made by a planar circuit process;
  • the output terminal is connected to the output of the power combining unit.
  • the planar delay line balun includes a first differential port, a second differential port, a first transmission line disposed on the same plane, a second transmission line opposite to the first transmission line and spaced from each other, and a common port;
  • the first end of the first transmission line is connected to the first differential port, the second end of the first transmission line is connected to the common common port;
  • the first end of the second transmission line is connected to the second differential port connected, the second end of the second transmission line is connected to the common port;
  • the first differential port and the second differential port are respectively connected to two outputs of the power amplifying unit;
  • the length of the second transmission line is set to be 1/4 wavelength, the length of the second transmission line is set to be 3/4 wavelength, and the line widths of the first transmission line and the second transmission line are the same.
  • the impedances of the first differential port, the second differential port and the common port are all 50 ohms.
  • the first transmission line is bent to form a plurality of n-type structures with downward openings, and the plurality of n-type structures are arranged from left to right and the opening ends are sequentially connected end to end to form a first linear structure;
  • the second transmission line is bent to form a plurality of u-shaped structures with upward openings, and the plurality of u-shaped structures are arranged from left to right and the opening ends are connected end to end in turn to form a second linear structure, and the plurality of n-shaped structures It is arranged in direct opposition to a plurality of said u-shaped structures one by one.
  • the width of the first linear structure along the direction from top to bottom is one-third of the width of the second linear structure along the direction from top to bottom.
  • the planar delay line balun further includes an impedance transition section, one end of the impedance transition section is respectively connected to the second end of the first transmission line and the second end of the second transmission line, and the impedance transition section Connect the other end to the common port.
  • the input power divider is a second planar delay line balun with a planar structure
  • the second planar delay line balun is made by a planar circuit process
  • the structure of the second planar delay line balun The same structure as the planar delay line balun; the common port of the second planar delay line balun is connected to the input end, the first differential end of the second planar delay line balun and the second The second differential ports of the planar delay line balun are respectively connected to the input ends of the power amplifying units.
  • the input power divider includes an on-chip helical transformer balun and a second power amplifying unit; the first end of the primary coil of the on-chip helical transformer balun is connected to the input end, and the primary The second end of the coil is connected to the ground; the two ends of the secondary coil of the on-chip helical transformer balun are respectively connected to the power amplification unit as two outputs of the input power divider; the second power The amplifying unit is connected in series between the input end and the first end of the primary coil.
  • the two outputs of the input power divider are respectively connected in series with the input matching network with the power amplifying unit, and the two outputs of the power amplifying unit are respectively connected in series with the output matching network with the power combining unit.
  • An embodiment of the present invention also provides a radio frequency front-end module, which includes the above-mentioned MMIC microwave power amplifier provided by the embodiment of the present invention.
  • the input of the power synthesis unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplification unit for combining the power
  • the two-way differential signals amplified by the amplifying unit are output after power synthesis, so as to achieve the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier.
  • the present invention sets the power synthesis unit as a plane Structured planar delay line balun, the planar delay line balun is made by planar circuit technology, the junction is simple, and the planar delay line balun made by planar circuit technology can realize product miniaturization because of its small size, and at the same time, the planar circuit
  • the planar delay line balun made by the technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.
  • Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier that the embodiment of the present invention provides;
  • Fig. 2 is the structure diagram of the planar delay line balun circuit of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention
  • Fig. 3 is the circuit schematic diagram of another kind of MMIC microwave power amplifier provided by the embodiment of the present invention.
  • Fig. 4 is a structural block diagram of a radio frequency front-end module provided by an embodiment of the present invention.
  • Fig. 1 is the schematic circuit diagram of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention
  • Fig. 2 is the planar delay line of a kind of MMIC microwave power amplifier provided by the embodiment of the present invention Balun circuit diagram.
  • the present invention provides an MMIC microwave power amplifier 100, comprising: an input terminal RFin, an input power divider 1, a power amplification unit 2, a power combining unit 3, and an output terminal RFout.
  • the input terminal RFin is used to connect a single-ended input signal.
  • the input of the input power splitter 1 is connected to the input terminal RFin, for receiving the input signal and converting the input signal into two differential signals.
  • the input terminals of the power amplifying unit 2 are respectively connected to the two outputs of the input power divider 1 for respectively amplifying the power of the two differential signals and outputting them.
  • the power amplifying unit 2 can be two sets of power amplifiers PA1 and PA2 respectively connected in series to the two differential signals, or it can be a power amplifying chip PA Die, which is easy to understand, and its functions and purposes are the same.
  • the input of the power combining unit 3 is respectively connected to the two outputs of the power amplifying unit 2 for combining the two differential signals amplified by the power amplifying unit 2 before outputting.
  • the power combining unit 3 of the present invention is a differential power amplification structure, so that the output power of the single-ended input signal input by the input terminal RFin is effectively doubled and then output to achieve the purpose of high power output, and the anti-interference and noise capabilities Strong, and has the ability to suppress even harmonics.
  • the power combining unit 3 is a planar delay line balun with a planar structure, and the planar delay line balun is made by planar circuit technology.
  • the performance of the power combining unit 3 is the key to ensure the performance of the MMIC microwave power amplifier 100.
  • the power combining unit 3 is set as a planar delay line balun with a planar structure. Due to its small size, the delay line balun can realize product miniaturization. At the same time, the insertion loss of the planar delay line balun made by planar circuit technology is small, and it can achieve better transmission without additional parallel or series connection of multiple off-chip passive components. Power, to achieve the purpose of high reliability and consistency of power transmission.
  • the planar delay line balun includes a first differential port P + , a second differential port P ⁇ arranged on the same plane, a first transmission line 31 , and a second transmission line 31 opposite to and spaced from each other.
  • Transmission line 32 and common port CM are common ports.
  • the first end A of the first transmission line 31 is connected to the first differential port P + , and the second end B of the first transmission line 31 is connected to the common port CM.
  • the first end C of the second transmission line 32 is connected to the second differential port 32
  • the second end D of the second transmission line 34 is connected to the common port CM.
  • the first differential port P + and the second differential port P ⁇ are respectively connected to two outputs of the power amplifying unit 2 .
  • the length of the first transmission line 31 is set to be a quarter of the wavelength, that is, the length from the first end A to the second end B of the first transmission line 31 is a quarter of the working wavelength.
  • the length of the second transmission line 32 is set to three-quarters of the working wavelength, that is, the length from the first end C to the second end D of the second transmission line 32 is three-quarters of the wavelength to achieve a phase difference of 180 Degree conversion, and the line width of the first transmission line 31 and the second transmission line 32 are the same. After the microwave signal passes through the first transmission line 31 and the second transmission line 32, the phase difference is 180°.
  • the impedances of the first differential port P + , the second differential port P ⁇ , and the common port CM are all 50 ohms, so as to facilitate direct connection with a 50 ohm system.
  • the planar delay line balun further includes an impedance transition section 33, one end of the impedance transition section 33 is respectively connected to the second end B of the first transmission line 31 and the second end of the second transmission line 32 D, the other end of the impedance transition section 33 is connected to the common port CM, thereby realizing a smooth transition from the impedance of the first transmission line 31 and the second transmission line 32 to the 50 ohm impedance of the common port CM, further improving the power Transmission reliability and consistency.
  • the first transmission line 31 is bent to form a plurality of n-type structures 311 with downward openings, and the plurality of n-type structures 311 are arranged from left to right (that is, from the first end A to the second end A).
  • the two ends B) are arranged and the open ends are sequentially connected end to end to form a first linear structure.
  • the second transmission line 32 is bent to form a plurality of u-shaped structures 321 with upward openings, and the plurality of u-shaped structures 321 are arranged from left to right (that is, from the first end C to the second end D) and the open ends are
  • the end-to-end connections are sequentially formed to form a second linear structure.
  • the plurality of n-type structures 311 and the plurality of u-type structures 321 are arranged opposite to each other. The symmetry in the structure makes the planar delay line balun occupy the smallest area, which is convenient for product miniaturization.
  • the width L of the first linear structure along the direction from top to bottom is greater than that of the second linear structure along the direction from top to bottom (that is, the direction from D to F).
  • One-third of the width L2 is a size ratio setting. This size ratio setting makes the symmetry of the planar delay line balun better, thus ensuring that the phase difference between the upper and lower channels is 180 degrees.
  • the input power divider 1 can be set as a second planar delay line balun with a planar structure, the second planar delay line balun is made by a planar circuit process, and the The structure of the second planar delay line balun is the same as that of the planar delay line balun serving as the power combining unit 3 , that is, the structure of the second planar delay line balun is also the same as shown in FIG. 3 .
  • the common port CM of the second planar delay line balun is connected to the input terminal RFin, the first differential terminal output signal P + of the second planar delay line balun and the second planar delay line barun
  • the second differential port P of L - connected to the input terminals of the power amplifying unit 2 respectively, for example, connected to the input terminals of two groups of power amplifiers to realize power amplification.
  • the two outputs of the input power divider 1 and the power amplifying unit 2 are respectively connected in series with input matching networks, that is, the first input matching network 411 and the second input matching network 412, and the power amplifying
  • the two outputs of the unit 2 and the power combining unit 3 are respectively connected in series with output matching networks, that is, the first output matching network 413 and the second output matching network 414 to achieve impedance matching.
  • the input signal is transmitted to the second plane delay balun of the power amplifying unit 2 through the input terminal RFin and converted into differential signals RF - and RF + , wherein one differential signal RF - is matched by the first input
  • the network 411 is input to the power amplifier PA1 of the power amplifying unit 2, and the other differential signal RF+ is input to the power amplifier PA2 of the power amplifying unit 2 through the second input matching network 412 for amplification.
  • the output signal of the power amplifier PA1 is connected to the input terminal (the first differential port P + ) of the planar delay line balun serving as the power combining unit 3 via the first output matching network 413 .
  • the output signal of the power amplifier PA2 is connected to the input end of the planar delay line balun (the second differential port P ⁇ ) serving as the power combination unit 3 via the second output matching network 414 .
  • the planar delay line balun realizes the power combination of the two output differential signals of the power amplifier PA1 and the power amplifier PA2, and then outputs it through the output terminal RFout.
  • the present invention also provides another embodiment, as shown in FIG. 3 , which is a schematic circuit diagram of another MMIC microwave power amplifier provided by the embodiment of the present invention.
  • This embodiment is essentially the same as the embodiment shown in FIGS. 1-2 above, and its output still uses a planar delay balun as the power combining unit 303 .
  • the difference lies in the structure of the input power splitter, specifically:
  • the input power divider 301 includes an on-chip helical transformer balun 3011 and a second power amplifying unit PA0; the first end of the primary coil of the on-chip helical transformer balun 3011 is connected to the input terminal RFin, so The second end of the primary coil is connected to ground; the two ends of the secondary coil of the on-chip helical transformer balun 3011 are respectively connected to the power amplifying unit 302 as two outputs of the input power divider 3011 ( That is, the power amplifier PA1 and the power amplifier PA2).
  • the second power amplifying unit PA0 is connected in series between the input end RFin and the first end of the primary coil to form an inter-stage differential switching planar delay line balun structure MMIC microwave power amplifier.
  • the radio frequency input signal is amplified by the second power amplifier PA0 of the first-stage single-ended structure, it is connected to the on-chip helical transformer balun 3011 to realize the conversion from the single-ended signal to the differential signal, and the converted
  • the differential signal drives the power amplifying unit 302 (ie, the power amplifier PA1 and the power amplifier PA2)
  • its output signal is combined by the power combining unit 303 outside the chip.
  • the second power amplifier PA0 is added to increase the gain of the driver stage. accomplish.
  • the embodiment of the present invention also provides a radio frequency front-end module, as shown in Figure 4, which includes the above-mentioned MMIC microwave power amplifier PA, filter Filter, radio frequency switch SW and low noise amplifier LNA provided by the embodiment of the present invention.
  • the input of the power combining unit of the MMIC microwave power amplifier is respectively connected to the two outputs of the power amplifying unit, for combining the
  • the two-way differential signals amplified by the power amplification unit are output after power synthesis, thereby achieving the purpose of high output power; and the performance of the power synthesis unit is the key to ensure the performance of the power amplifier, and the present invention sets the power synthesis unit as A planar delay line balun with a planar structure.
  • the planar delay line balun is made by a planar circuit process and has a simple junction.
  • the planar delay line balun made by a planar circuit process can realize product miniaturization due to its small size.
  • the planar delay line balun made by circuit technology has small insertion loss, and can achieve better power transfer without additional parallel or series connection of multiple off-chip passive components, achieving the purpose of high reliability and consistency of power transfer.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)

Abstract

La présente invention concerne un amplificateur de puissance hyperfréquence MMIC. L'amplificateur de puissance hyperfréquence MMIC comprend : une extrémité d'entrée ; un diviseur de puissance d'entrée dont une entrée est connectée à l'extrémité d'entrée, et est utilisée pour convertir un signal d'entrée en deux signaux différentiels ; une unité d'amplification de puissance, dont une extrémité d'entrée est respectivement connectée à deux sorties du diviseur de puissance d'entrée, et est utilisée pour effectuer une amplification de puissance sur les deux signaux différentiels et délivrer celle-ci ; une unité de synthèse de puissance, dont une entrée est respectivement connectée à deux sorties de l'unité d'amplification de puissance, et est utilisée pour réaliser la synthèse de puissance des deux signaux différentiels qui sont amplifiés par l'unité d'amplification de puissance, l'unité de synthèse de puissance étant un symétriseur de ligne à retard planaire d'une structure plane, et le symétriseur de ligne à retard planaire étant réalisé au moyen d'un procédé de circuit planaire ; et une extrémité de sortie, qui est connectée à une extrémité de sortie de l'unité de synthèse de puissance. La présente invention concerne en outre un module frontal radiofréquence. Par rapport à l'état de la technique, l'amplificateur de puissance hyperfréquence MMIC et le module frontal radiofréquence de la présente invention présentent une puissance de sortie élevée, une petite taille, un faible coût et une fiabilité élevée.
PCT/CN2022/090598 2021-11-12 2022-04-29 Amplificateur de puissance hyperfréquence mmic et module frontal radiofréquence WO2023082565A1 (fr)

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CN202111344994.5A CN114094960A (zh) 2021-11-12 2021-11-12 Mmic微波功率放大器及射频前端模组
CN202111344994.5 2021-11-12

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CN114094960A (zh) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 Mmic微波功率放大器及射频前端模组
CN115549611B (zh) * 2022-09-02 2023-06-06 佛山臻智微芯科技有限公司 基于多路功率合成的集成式异相射频功率放大电路

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EP1845581A2 (fr) * 2005-08-23 2007-10-17 Synergy Microwave Corproation Transformateur à changement de mode à plusieurs couches, mélangeurs et amplificateurs
CN112019168A (zh) * 2020-08-21 2020-12-01 武汉大学 一种基于慢波微带线匹配网络的功率放大器
CN112187194A (zh) * 2020-09-30 2021-01-05 锐石创芯（深圳）科技有限公司 推挽功率放大器、射频前端电路和无线装置
CN113612456A (zh) * 2021-10-11 2021-11-05 深圳飞骧科技股份有限公司 一种宽带微波功率放大器
CN114094960A (zh) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 Mmic微波功率放大器及射频前端模组

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Publication number Priority date Publication date Assignee Title
EP1845581A2 (fr) * 2005-08-23 2007-10-17 Synergy Microwave Corproation Transformateur à changement de mode à plusieurs couches, mélangeurs et amplificateurs
CN112019168A (zh) * 2020-08-21 2020-12-01 武汉大学 一种基于慢波微带线匹配网络的功率放大器
CN112187194A (zh) * 2020-09-30 2021-01-05 锐石创芯（深圳）科技有限公司 推挽功率放大器、射频前端电路和无线装置
CN113612456A (zh) * 2021-10-11 2021-11-05 深圳飞骧科技股份有限公司 一种宽带微波功率放大器
CN114094960A (zh) * 2021-11-12 2022-02-25 深圳飞骧科技股份有限公司 Mmic微波功率放大器及射频前端模组

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