WO2023075113A1 - Dispositif électronique comprenant un haut-parleur - Google Patents

Dispositif électronique comprenant un haut-parleur Download PDF

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Publication number
WO2023075113A1
WO2023075113A1 PCT/KR2022/013006 KR2022013006W WO2023075113A1 WO 2023075113 A1 WO2023075113 A1 WO 2023075113A1 KR 2022013006 W KR2022013006 W KR 2022013006W WO 2023075113 A1 WO2023075113 A1 WO 2023075113A1
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WIPO (PCT)
Prior art keywords
sound
electronic device
module
display
frame
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PCT/KR2022/013006
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English (en)
Korean (ko)
Inventor
이승혁
구도일
이상준
주완재
홍두윤
Original Assignee
삼성전자주식회사
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Publication of WO2023075113A1 publication Critical patent/WO2023075113A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material

Definitions

  • Various embodiments disclosed in this document relate to an electronic device including a speaker.
  • the electronic device includes a speaker for generating sound, and the speaker may generate sound waves through a diaphragm that vibrates according to an electrical signal.
  • the speaker may generate sound waves through a diaphragm that vibrates according to an electrical signal.
  • Electronic devices such as smart phones and tablets include speakers for outputting sound to the outside. Recently, electronic devices generating high-quality sound are required to satisfy consumers' purchase desires. In order to improve acoustic flatness and sound quality in a low-frequency region of the sound generated by the speaker, a resonance space for self-resonance of the sound generated by the speaker may be formed. In recent years, electronic devices have been miniaturized to enhance portability and aesthetics, and since a large number of parts that perform various functions are required to be placed inside, the sound of the speaker is improved within a limited space inside the electronic device, while the resonance of the sound A technology is being developed to secure a resonance space at a location where the influence of vibration on other parts can be minimized.
  • an electronic device including a speaker may be provided.
  • An electronic device includes a housing including a first surface, a second surface opposite to the first surface, and a side surface surrounding a space between the front and rear surfaces; A display exposed to the first substrate, a second substrate surface opposite to the first substrate surface, and an opening formed to penetrate the first substrate surface and the second substrate surface, wherein the first substrate A printed circuit board disposed inside the housing with a side facing the second surface of the display, a sound module connected to the printed circuit board and generating sound, and disposed between the display and the printed circuit board, wherein the display It may include a first frame spaced apart from and forming a resonance space. In one embodiment, the sound module may be disposed in the opening. In one embodiment, in a state of looking at the display, the first frame may include a resonance hole formed at a position overlapping the sound module and passing sound generated by the sound module into the resonance space.
  • An electronic device includes a first surface, a second surface opposite to the first surface, and a side surface surrounding an internal space between the first surface and the second surface, and communicates with the internal space.
  • a printed circuit board including a housing having a sound hole formed on an outer surface, a display disposed on the first surface and visually exposed to the outside, disposed in the internal space and including openings penetrating both sides of the housing, the printed circuit
  • a second frame disposed between the printed circuit board and the second surface may be included.
  • the sound module is disposed in the opening such that a front part faces the second frame and a rear part faces the first frame, and sound emitted to the rear part of the sound module is between the display and the first frame.
  • a resonant space that resonates may be formed.
  • a sound pipe communicating with the sound hole and moving sound emitted toward the front of the sound module may be formed between the printed circuit board and the second frame.
  • An electronic device includes a housing including a housing, a first surface, a second surface opposite to the first surface, and a side surface surrounding a space between the first surface and the second surface, and the housing
  • a display supported by and visually exposed to the outside through the first surface, a first substrate surface disposed inside the housing and facing the first surface and a second substrate surface facing the second surface,
  • a printed circuit board having an opening penetrating the first substrate surface and the second substrate surface, and disposed in the opening so that a front side faces the first surface and a rear side faces the second surface, and a sound generating sound module, a first frame disposed between the display and the printed circuit board and including a resonance hole through which sound generated by the sound module passes, disposed in front of the sound module, and housing the sound generated by the sound module
  • It may include a second frame forming a sound conduit for transmitting to the outside, and a battery disposed inside the housing.
  • a resonance space communicating with the resonance hole is formed between the display and the first frame, and the battery may
  • the effect of vibration caused by the operation of the sound module on other components in the electronic device can be minimized.
  • space utilization inside the electronic device may be improved by utilizing the space between the first frame and the rear surface of the display as a resonance space.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.
  • FIG. 2 is a block diagram of an audio module of an electronic device according to various embodiments.
  • 3A is a front perspective view of an electronic device according to various embodiments of the present disclosure.
  • 3B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is an exploded perspective view of a sound module according to various embodiments.
  • 6A is an exploded perspective view of an electronic device for illustrating a disposition of a sound module according to various embodiments of the present disclosure
  • 6B is a front view of an electronic device illustrating a state in which a display is omitted to indicate an arrangement of sound modules according to various embodiments of the present disclosure.
  • FIG. 7 is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • FIG. 8A is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • FIG. 8B is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • 8C is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • 8D is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • 8E is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network).
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
  • eMBB peak data rate for eMBB realization
  • a loss coverage for mMTC realization eg, 164 dB or less
  • U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC that is disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and can support a designated high frequency band (eg, mmWave band), and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the audio module 170 includes, for example, an audio input interface 210, an audio input mixer 220, an analog to digital converter (ADC) 230, an audio signal processor 240, and a DAC. (digital to analog converter) 250, an audio output mixer 260, or an audio output interface 270 may be included.
  • ADC analog to digital converter
  • ADC analog to digital converter
  • DAC digital to analog converter
  • the audio input interface 210 is a part of the input module 150 or through a microphone configured separately from the electronic device 101 (eg, a dynamic microphone, a condenser microphone, or a piezo microphone), obtained from the outside of the electronic device 101.
  • An audio signal corresponding to sound may be received.
  • the audio input interface 210 directly connects the external electronic device 102 through a connection terminal 178. , or may be connected wirelessly (eg, Bluetooth communication) through the wireless communication module 192 to receive an audio signal.
  • the audio input interface 210 may receive a control signal related to an audio signal acquired from the external electronic device 102 (eg, a volume control signal received through an input button).
  • the audio input interface 210 includes a plurality of audio input channels, and can receive different audio signals for each corresponding audio input channel among the plurality of audio input channels.
  • the audio input interface 210 may receive audio signals from other components (eg, the processor 120 or the memory 130 of FIG. 1 ) of the electronic device 101 . there is.
  • the audio input mixer 220 may synthesize a plurality of input audio signals into at least one audio signal.
  • the audio input mixer 220 may synthesize a plurality of analog audio signals input through the audio input interface 210 into at least one analog audio signal.
  • the ADC 230 may convert an analog audio signal into a digital audio signal.
  • ADC 230 converts an analog audio signal received via audio input interface 210, or an analog audio signal synthesized via audio input mixer 220 additionally or alternatively, into a digital audio signal. can be converted into signals.
  • the audio signal processor 240 may perform various processes on the digital audio signal received through the ADC 230 or the digital audio signal received from other components of the electronic device 101 .
  • the audio signal processor 240 changes the sampling rate of one or more digital audio signals, applies one or more filters, performs interpolation processing, amplifies or attenuates all or some frequency bands, It can perform noise processing (eg, noise or echo reduction), channel change (eg, switching between mono and stereo), mixing, or specified signal extraction.
  • noise processing eg, noise or echo reduction
  • channel change eg, switching between mono and stereo
  • mixing or specified signal extraction.
  • one or more functions of the audio signal processor 240 may be implemented in the form of an equalizer.
  • the DAC 250 may convert a digital audio signal into an analog audio signal.
  • the DAC 250 is a digital audio signal processed by the audio signal processor 240, or other components of the electronic device 101 (eg, processor 120 or memory 130). )) to convert the digital audio signal obtained from the analog audio signal.
  • the audio output mixer 260 may synthesize a plurality of audio signals to be output into at least one audio signal.
  • the audio output mixer 260 includes an audio signal converted to analog through the DAC 250 and another analog audio signal (eg, an analog audio signal received through the audio input interface 210). ) into at least one analog audio signal.
  • the audio output interface 270 transmits the analog audio signal converted through the DAC 250 or the analog audio signal synthesized by the audio output mixer 260 additionally or alternatively to the electronic device 101 through the sound output module 155. ) can be output to the outside.
  • the sound output module 155 may include, for example, a speaker or receiver such as a dynamic driver or a balanced armature driver.
  • the sound output module 155 may include a plurality of speakers.
  • the audio output interface 270 may output an audio signal having a plurality of different channels (eg, stereo or 5.1 channels) through at least some of the plurality of speakers.
  • the audio output interface 270 is directly connected to the external electronic device 102 (eg, an external speaker or headset) through a connection terminal 178 or wirelessly through a wireless communication module 192. and output an audio signal.
  • the audio module 170 does not separately include the audio input mixer 220 or the audio output mixer 260, and uses at least one function of the audio signal processor 240 to generate a plurality of digital audio signals. At least one digital audio signal may be generated by synthesizing them.
  • the audio module 170 is an audio amplifier (not shown) capable of amplifying an analog audio signal input through the audio input interface 210 or an audio signal to be output through the audio output interface 270. (e.g. speaker amplification circuit).
  • the audio amplifier may be configured as a separate module from the audio module 170.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium eg, internal memory 136 or external memory 138
  • a machine eg, electronic device 101
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components.
  • one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.
  • FIG. 3A is a front perspective view of an electronic device according to various embodiments
  • FIG. 3B is a rear perspective view of an electronic device according to various embodiments
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments.
  • an electronic device 301 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes a front surface 310a (eg, a first surface) and a rear surface 310b. ) (eg, a second surface), and a side surface 311c (eg, a third surface) surrounding an inner space between the front surface 310a and the rear surface 310b.
  • a front surface 310a eg, a first surface
  • side surface 311c eg, a third surface
  • the front surface 310a may be formed by a first plate 311a, at least a portion of which is substantially transparent.
  • the first plate 311a may include a glass plate or a polymer plate including at least one coating layer.
  • the rear surface 310b may be formed by a substantially opaque second plate 311b.
  • the second plate 311b may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination thereof.
  • the side surface 311c may be formed by a frame 340 coupled to the first plate 311a and the second plate 311b and including metal and/or polymer.
  • the second plate 311b and the frame 340 may be integrally and seamlessly formed.
  • the second plate 311b and the frame 340 may be formed of substantially the same material (eg, aluminum).
  • the first plate 311a is rounded in a direction from at least a portion of the front surface 310a toward the second plate 311b, and extends in one direction (eg, +/-X axis direction).
  • the plurality of first edge regions 312a-1 are rounded from at least a portion of the front surface 310a toward the second plate 311b and extend in other directions (eg, +/- Y-axis direction).
  • the second plate 311b is rounded in a direction from at least a portion of the rear surface 310b toward the first plate 311a and extends in one direction (eg, +/- X-axis direction).
  • a plurality of four fourth edge regions 312b-1 which are rounded from at least a portion of the rear surface 310b in a direction toward the first plate 311a and extend in other directions (eg, +/-Y axis direction).
  • fifth edge regions 312b-2 a plurality of fourth edge regions 312b-1 rounded from at least a portion of the rear surface 310b in a direction toward the first plate 311a, and a plurality of A plurality of sixth edge regions 312b - 3 between the fifth edge regions 312b - 2 may be included.
  • the frame 340 may surround at least a portion of the inner space between the front surface 310a and the rear surface 310b.
  • the frame 340 includes a first support structure 441 disposed on at least a portion of the side surface 311c and a second support structure connected to the first support structure 441 and forming an arrangement space for parts of the electronic device 301. (442).
  • the first support structure 441 connects the edges of the first plate 311a and the second plate 311b and surrounds the space between the first plate 311a and the second plate 311b. By wrapping, the side surface 311c of the housing 310 may be formed.
  • the second support structure 442 may be disposed inside (or a body portion) of the electronic device 301 .
  • the second support structure 442 may be integrally formed with the first support structure 441 or may be formed separately and connected to the first support structure 441 .
  • printed circuit boards 451 and 452 such as a PCB may be disposed on the second support structure 442 .
  • the second support structure 442 may be connected to grounds of the printed circuit boards 451 and 452 , for example.
  • the display 361 is positioned on one surface of the second support structure 442 (eg, the bottom surface of FIG.
  • a second plate 311b may be disposed on the upper surface of 4 (a surface in the -Z-axis direction).
  • the frame 340 may be formed of a conductive material.
  • the first support structure 441 may be formed of a metal and/or a conductive polymer material.
  • the second support structure 442 may be formed of a metal and/or a conductive polymer material.
  • the frame 340 may include a support area 450 for accommodating or supporting the acoustic modules 600 and 400 .
  • the support area 450 may accommodate the acoustic modules 600 and 400 and support the first circuit board 451 .
  • a sound pipe 455 through which sound is output from the sound module 600 or 400 may be formed inside the support area 450 .
  • the electronic device 301 may include a display 361 (eg, the display module 160 of FIG. 1 ). In one embodiment, the display 361 may be located on the front surface 310a. In one embodiment, the display 361 may include at least a portion of the first plate 311a (eg, a plurality of first edge regions 312a-1, a plurality of second edge regions 312a-2, and a plurality of first edge regions 312a-2). may be exposed through the third edge regions 312a-3).
  • the first plate 311a eg, a plurality of first edge regions 312a-1, a plurality of second edge regions 312a-2, and a plurality of first edge regions 312a-2).
  • an edge of the display 361 may substantially coincide with an outer edge of the first plate 311a.
  • the display 361 may include a touch sensing circuit, a pressure sensor capable of sensing the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • the display 361 may include a screen display area 361a that is visually exposed and displays content through a pixel or a plurality of cells.
  • the screen display area 361a may include a sensing area 361a-1 and a camera area 361a-2.
  • the sensing area 361a-1 may overlap at least a portion of the screen display area 361a.
  • the sensing region 361a - 1 may allow transmission of an input signal related to the sensor module 376 (eg, the sensor module 176 of FIG. 1 ).
  • the sensing area 361a-1 may display content similarly to the screen display area 361a that does not overlap with the sensing area 361a-1.
  • the sensing area 361a - 1 may display content while the sensor module 376 is not operating.
  • the camera area 361a-2 may overlap at least a portion of the screen display area 361a.
  • the camera area 361a - 2 may allow optical signals related to the first camera modules 380a and 380b (eg, the camera module 180 of FIG. 1 ) to pass through.
  • the camera area 361a-2 can display content similarly to the screen display area 361a that does not overlap with the camera area 361a-2.
  • the camera area 361a - 2 may display content while the first camera modules 380a and 380b are not operating.
  • the electronic device 301 may include an audio module 370 (eg, the audio module 170 of FIG. 1 ).
  • the audio module 370 may obtain sound from the outside of the electronic device 301 .
  • the audio module 370 may be located on the side surface 311c of the housing 310 .
  • the audio module 370 may acquire sound through at least one hole.
  • the electronic device 301 may include a sensor module 376.
  • the sensor module 376 may sense a signal applied to the electronic device 301 .
  • the sensor module 376 may be located on the front surface 310a of the electronic device 301, for example.
  • the sensor module 376 may form the sensing area 361a-1 in at least a portion of the screen display area 361a.
  • the sensor module 376 may receive an input signal passing through the sensing region 361a-1 and generate an electrical signal based on the received input signal.
  • the input signal may have a specified physical quantity (eg, heat, light, temperature, sound, pressure, ultrasound).
  • the input signal may include a signal related to the user's biometric information (eg, the user's fingerprint, voice, etc.).
  • the electronic device 301 may include camera modules 380a and 380b (eg, the camera module 180 of FIG. 1 ).
  • the camera modules 380a and 380b may include a first camera module 380a, a second camera module 380b, and a flash 380c.
  • the first camera module 380a is disposed to be exposed through the front surface 310a of the housing 310, and the second camera module 380b and the flash 380c are disposed on the rear surface 310b of the housing 310. ) can be arranged so as to be exposed through.
  • at least a portion of the first camera module 380a may be disposed on the housing 310 to be covered through the display 361 .
  • the first camera module 380a may receive an optical signal passing through the camera area 361a-2.
  • the second camera module 380b may include a plurality of cameras (eg, dual cameras, triple cameras, or quad cameras).
  • the flash 380c may include a light emitting diode or a xenon lamp.
  • the electronic device 301 may include external sound holes 315 and 355 .
  • the external sound holes 315 and 355 may output sound to the outside of the electronic device 301 , and the electronic device 301 may include a plurality of external sound holes 315 and 355 .
  • the first external sound hole 315 may be formed adjacent to the side surface 311c in one direction (eg, +Y direction) of the housing 310, and specifically, the front camera module 380a or It may be formed adjacent to the camera area 361a - 2 of the display 361 .
  • the second external sound hole 355 may be at least one hole formed on the side surface 311c of the housing 310 in one direction (eg, -Y direction).
  • the electronic device 301 may output stereoscopic sound to the outside of the electronic device 301 through the first external sound hole 315 and the second external sound hole 355 .
  • an intaglio area of the first external sound hole 315 may be provided on an outer rim of the first plate 311a, and the first plate 311a and the display 361 are coupled and the intaglio area is 1 may be implemented as an external sound hole 315 .
  • the display 361 may be provided with a sound hole 362 through which sound passes, and may guide sound from the sound module 600 or 500 toward the first external sound output hole 315 .
  • the electronic device 301 may directly output sound to the outside through the sound hole 362 without including the first external sound hole 315 .
  • the display 361 may include a notch structure in which the sound hole 362 and the camera module 380a are positioned.
  • the electronic device 301 may include an input module 350 (eg, the input module 150 of FIG. 1 ).
  • the input module 350 may receive a user's manipulation signal.
  • the input module 350 may include, for example, at least one key input device disposed to be exposed on the side surface 311c of the housing 310 .
  • the electronic device 301 may include a connection terminal 378 (eg, the connection terminal 178 of FIG. 1 ).
  • the connection terminal 378 may be disposed on the side surface 311c.
  • the connection terminal when looking at the electronic device 301 in one direction (eg, the +Y axis direction of FIG. 3A), the connection terminal is disposed in the central portion of the side surface 311c, and is located on the basis of the connection terminal 378.
  • the sound output module 355 may be disposed in a direction (eg, a right direction).
  • the electronic device 301 may include printed circuit boards 451 and 452 and a battery 489 (eg, the battery 189 of FIG. 1 .
  • the printed circuit board 451 , 452 may include a first circuit board 451 and a second circuit board 452.
  • the first circuit board 451 is the first board slot 442a of the second support structure 442.
  • the second circuit board 452 can be received in the second board slot 442b of the second support structure 442.
  • the battery 489 is the first board slot 442a.
  • the electronic device 301 may include a sound module 400 .
  • the sound module 400 may generate sound.
  • the sound module 400 may be connected to the printed circuit board 451 and generate sound according to an electrical signal.
  • the printed circuit board 451 may have an opening 453 partially open to penetrate the surface, and the sound module 400 may be disposed in the opening 453 .
  • the opening 453 is formed in a shape corresponding to the cross-sectional area of the sound module 400 in a planar direction (eg, X-Y plane), and the sound module 400 is accommodated in the opening 453 to form a printed circuit board. (451) and may be located on the substantially same plane.
  • a sound pipe 455 may be formed inside the electronic device 301 so that sound emitted from the sound module 400 may move to the sound hole 315 .
  • a processor may be disposed on the printed circuit boards 451 and 452 .
  • the processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor.
  • a wireless communication circuit eg, the wireless communication module 192 of FIG. 1
  • the wireless communication circuitry may communicate with an external device (eg, the electronic device 104 of FIG. 1 ).
  • the electronic device 301 includes an antenna structure (eg, the antenna module 197 of FIG. 1 ), and a wireless communication circuit may be electrically connected to the antenna structure.
  • the wireless communication circuitry may generate a signal to be transmitted through the antenna structure or detect a signal received through the antenna structure.
  • the printed circuit boards 451 and 452 include a ground, and the ground of the printed circuit boards 451 and 452 may function as a ground for an antenna structure implemented using a wireless communication circuit.
  • FIG. 5 is an exploded perspective view of a sound module according to various embodiments.
  • the acoustic module 500 shown in FIG. 5 is an exemplary structure of the acoustic modules 600 and 500, and the acoustic module applicable to various embodiments disclosed in this document ( 500) is described.
  • the acoustic module 500 applied to various embodiments is not limited to the description below, and may be modified and applied in various structures and shapes deformable by those skilled in the art.
  • a sound module 500 includes a speaker 510, a grill 520, a terminal board 540, a first compression member 530, and a second compression member 550. can do.
  • the speaker 510 may output sound.
  • the speaker 510 may include a diaphragm, a voice coil, a permanent magnet, and a main body.
  • the main body is supported by an external part, for example, an opening (eg, opening 453 in FIG. 4 ) or a frame (eg, frame 340 in FIG. 4 ), and the diaphragm is fixedly connected to the main body.
  • the diaphragm may generate sound corresponding to an electrical signal by vibrating by a voice coil and a permanent magnet.
  • the speaker 510 may be formed in a substantially rectangular shape, and a diaphragm may be installed at a central portion.
  • the speaker 510 may emit sound by disposing a diaphragm in a front direction (eg, a direction facing the grill 520 of FIG. 5), and may emit sound in a rear direction (eg, a terminal board of FIG. 5 ( 540), the first terminal 511 and a plurality of ventilation holes 515 may be disposed.
  • the first terminal 511 may receive an electrical signal by being connected to another component, for example, a printed circuit board (eg, the printed circuit boards 451 and 452 of FIG. 4 ).
  • the plurality of vents 515 may be used to transfer sound of the speaker 510 to the rear.
  • the sound generated by the speaker 510 is transferred to a resonance space (eg, the resonance space 691 of FIG. 7A ) formed in the rear direction, and can resonate within the closed resonance space.
  • the acoustic performance of the low-frequency sound emitted by the speaker may be improved through resonance in the resonance space.
  • a grill 520 may be connected to the front of the speaker 510, and a terminal board 540 may be connected to the rear side of the speaker 510.
  • the grill 520 may be used to guide sound emitted from the speaker 510 to the diaphragm in a set direction through the opening 521 and protect the diaphragm from external impact.
  • the terminal board 540 may include a second terminal 541 and a third terminal 545 .
  • the second terminal 541 is connected to the first terminal 511 of the speaker 510
  • the third terminal 545 is connected to a printed circuit board (eg, the printed circuit board 451 of FIG. 4). It can be.
  • the terminal board 540 may transfer power and electrical signals between the speaker 510 and the printed circuit board.
  • the terminal board 540 may be formed of a flexible printed circuit board (FPCB).
  • the first compression member 530 may be connected to the front side of the speaker 510, and the second compression member 550 may be connected to the rear side of the speaker 510.
  • the first compression member 530 and the second compression member 550 may be formed of an elastic material such as polyurethane, silicon, or rubber.
  • the first compression member 530 and the second compression member 550 may be formed by the acoustic module 600 or 500 being a part (eg, the frame 340 of FIG. 4) or the printed circuit board 471. ), it is possible to prevent sound from leaking from the speaker 510 and connection parts of other parts.
  • the first compression member 530 and the second compression member 550 may perform a buffering function of absorbing vibration generated when the speaker 510 generates sound.
  • FIG. 6A is an exploded perspective view of an electronic device for showing the arrangement of sound modules according to various embodiments
  • FIG. 6B illustrates a state in which a display is omitted to indicate the arrangement of sound modules in the electronic device according to various embodiments
  • 7 is a partial cross-sectional view of the electronic device taken along line A-A of FIG. 6 .
  • an electronic device includes a housing 610, a display, a printed circuit board 650, a sound module 600, a first frame 620, and a second frame 630.
  • a sealing member 640, a first shielding member 671, a second shielding member 672, and a battery 680 may be included.
  • the housing 610 may form the exterior of the electronic device.
  • the housing 610 surrounds a first surface 610A, a second surface 610B opposite to the first surface 610A, and a space between the first surface 610A and the second surface 610B. may include a side surface 610C.
  • the housing 610 may include one or more sound holes 678 through which sound generated by the sound module 600 is emitted to the outside of the electronic device.
  • the sound hole 678 may be formed on the first surface 610A of the housing 610 as shown in FIG. 6 .
  • the display 661 may be connected to the housing 610 and visually exposed to the outside through the first surface 610A of the housing 610 .
  • the first surface 610A of the housing 610 may be open, and the display 661 may be disposed on the open portion of the first surface 610A.
  • the display 661 includes a display panel 6611, a window layer 6612 disposed on the front surface of the display panel 6611, and a cover panel 6613 disposed on the rear surface of the display panel 6611. can do.
  • the display panel 6611, the window layer 6612, and the cover panel 6613 may be attached to each other by pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the display panel 6611 may include a display substrate, a plurality of display elements coupled to the display substrate, and one or more conductive lines coupled to the display substrate and electrically connected to the plurality of display elements.
  • the display substrate may be formed of a plastic material, for example, a material such as polyimide (PI).
  • the window layer 6612 is formed of a transparent material and can protect the display panel 6611 from the outside.
  • the window layer 6612 may include a plastic film (eg, polyimide film) or a thin glass (eg, ultra-thin glass (UTG)).
  • the cover panel 6613 may be disposed on the rear surface of the display panel 6611.
  • the cover panel 6613 may include a plurality of layers to implement each function. A plurality of layers included in the cover panel 6613 may be stacked through an adhesive member.
  • the cover panel 6613 may include an embossed layer that blocks light incident from the outside, a buffer layer that absorbs impact from the outside, or a metal layer that dissipates internal heat of the display 661.
  • a metal light guide plate may be disposed on the rear surface of the display panel 6611 .
  • the above-described laminated structure of the display 661 is only one example, and the type and structure of the display 661 applied to various embodiments disclosed in this document are not limited to the above-described example.
  • the display 661 may have a laminated structure formed of various materials. Accordingly, when a resonance space 691 described later is formed on the rear surface of the display 661, the display 661 may have relatively strong resistance to acoustic vibration within the resonance space 691. Details on this will be described later.
  • printed circuit board 650 may be disposed within housing 610 .
  • the printed circuit board 650 is formed in a plate shape, and various circuit elements may be mounted on the surface.
  • the printed circuit board 650 may include a first substrate surface 650A and a second substrate surface 650B opposite to the first substrate surface 650A. In this case, in a state where the printed circuit board 650 is disposed inside the housing 610, the first substrate surface 650A faces the rear surface of the display 661 and the second substrate surface 650B faces the housing 610. It may be disposed to face the second surface 610B.
  • the printed circuit board 650 may include an opening 651 formed open to pass through the first substrate surface 650A and the second substrate surface 650B.
  • the sound module 600 may include a speaker.
  • the acoustic module 600 may be electrically connected to the printed circuit board 650 and generate acoustic vibrations according to an applied electrical signal.
  • the sound module 600 may be disposed in the opening 651 of the printed circuit board 650.
  • the front part facing the front of the speaker eg, the end of the sound module toward the +Z axis
  • the rear part faces the rear of the speaker.
  • an end of the sound module facing the -Z axis may be disposed in the opening 651 so as to face the first surface 610A of the housing 610 .
  • the end of the acoustic module 600 facing the front of the speaker is referred to as a front part
  • the end of the acoustic module 600 facing the rear of the speaker opposite to the front part is referred to as a rear part.
  • the first frame 620 may be disposed between the display 661 and the printed circuit board 650 .
  • the first frame 620 may be disposed between the rear surface of the display 661 and the first substrate surface 650A of the printed circuit board 650 .
  • the first frame 620 may be spaced apart from the rear surface of the display 661 by a predetermined distance.
  • a resonance space 691 may be formed between the first frame 620 and the display 661 .
  • the resonance space 691 may function as a space in which sound emitted from the sound module 600 resonates.
  • the resonance space 691 When the resonance space 691 is disposed on the rear side of the acoustic module 600, the resonance space 691 acts as a back volume for resonating the sound emitted to the rear of the acoustic module 600, so that the acoustic module (600) can improve the acoustic performance of the low-band frequency emitted.
  • the space between the rear surface of the display 661 and the first frame 620 is utilized as the resonance space 691 of the sound module 600, thereby improving the space utilization inside the housing 610.
  • the display 661 is composed of multiple layers and thus has high impact resistance according to vibration, when the resonance space 691 is formed on the rear surface of the display 661, the sound module 600 operates The influence of vibration on other parts inside the housing 610 can be minimized.
  • the first frame 620 may support the rear portion of the sound module 600 .
  • the first frame 620 overlaps the opening 651 and the sound module 600 It may include a support area 621 connected to support the rear part of.
  • the first frame 620 may include a resonance hole 622 formed through the support area 621 . In this case, sound emitted to the rear of the sound module 600 may be transferred to the resonance space 691 through the resonance hole 622 .
  • a sealing member 640 may be disposed between the display 661 and the first frame 620 .
  • the sealing member 640 may form a resonance space 691 between the display 661 and the first frame 620 by being connected to surround the circumference of the resonance hole 622 .
  • the sealing member 640 in a state of looking at the front of the display 661, corresponds to the shape of the designed resonance space 691, the first frame 620 and the first frame 620 along the circumference of the resonance space 691 It may be placed between the displays 661 .
  • the size and shape of the resonance space 691 formed between the display 661 and the first frame 620 may be determined according to the arrangement shape of the sealing member 640 .
  • the sealing member 640 seals the resonance space 691 to prevent sound from escaping from the resonance space 691, while maintaining a distance between the display 661 and the first frame 620. Thus, the minimum space of the resonance space 691 can be secured.
  • the second frame 630 may be disposed between the printed circuit board 650 and the second surface 610B to face the second substrate surface 650B. In this case, the second frame 630 may face the front of the sound module 600 .
  • a sound pipe 692 is formed between the second frame 630 and the printed circuit board 650 to move the sound emitted from the front of the sound module 600 to the sound of the housing 610.
  • the second frame 630 includes a first support portion 631 parallel to the second substrate surface 650B and a second support portion 631 connected to the second substrate surface 650B.
  • It includes a second support portion 632 extending in the direction of the substrate surface 650B, and the first support portion 631 and the second support portion 632 transmit sound emitted to the front of the sound module 600 through the sound hole.
  • An outer wall of the acoustic conduit 692 passing through 678 may be formed.
  • the first shielding member 671 may be disposed between the first frame 620 and the printed circuit board 650 .
  • the first shielding member 671 may be disposed between the first frame 620 and the first substrate surface 650A along the circumference of the support area 621 based on a state in which the display 661 is viewed.
  • the first shielding member 671 may be formed of a compressible material, for example, a poron material.
  • the first shielding member 671 connects the first frame 620 and the printed circuit board 650 so that the first frame 620 and the first board surface 650A do not come into contact with each other, and the acoustic module 600 ) It is possible to prevent the sound generated from escaping through the gap between the first frame 620 and the printed circuit board 650 .
  • the second shielding member 672 may be disposed between the second frame 630 and the printed circuit board 650 .
  • the second shielding member 672 may be disposed between the second support portion 632 and the second substrate surface 650B along the circumference of the sound pipe 692 in a state in which the display 661 is viewed. there is.
  • the second shielding member 672 may be formed of a compressible material, for example, a poron material.
  • the second shielding member 672 connects the second frame 630 and the printed circuit board 650 so that the second frame 630 and the second board surface 650B do not come into direct contact, and at the same time, the sound module 600 It is possible to prevent the sound generated from escaping through the gap between the second frame 630 and the printed circuit board 650 .
  • the battery 680 may be disposed in the inner space of the housing 610 and electrically connected to components inside the electronic device to supply power. In one embodiment, the battery 680 may be disposed at a position opposite to the resonance space 691 with respect to the printed circuit board 650 . For example, the battery 680 may be disposed between the second frame 630 and the second surface 610B. According to this structure, in the process of generating sound by the sound module 600, the vibration of the sound in the resonance space 691 can reduce the effect on the battery 680. Thus, a phenomenon in which the cover of the battery 680 vibrates due to the vibration of the sound module 600 can be prevented.
  • 8A to 8E are partial cross-sectional views of the electronic device taken along line A-A of FIG. 6 . 8A to 8E respectively illustrate various embodiments of an electronic device.
  • electronic devices 801a, 801b, 801c, 801d, and 801e include a housing 810, a display 861, a printed circuit board 850, and a first frame ( 820) and a second frame 830.
  • the housing 810 includes a first surface 810A, a second surface 810B opposite to the first surface 810A, and a side surface 810C, and includes one or more acoustic surfaces formed on the outer surface. hole 878.
  • the display 861 may be disposed on the first surface 810A of the housing 810.
  • the printed circuit board 850 is disposed inside the housing 810, with a first board surface 850A facing the first surface 810A, and a second substrate surface 850A opposite to the first substrate surface 850A. It may include a second substrate surface 850B facing surface 810B. In this case, the printed circuit board 850 may include an opening 851 formed open to pass through the first substrate surface 850A and the second substrate surface 850B.
  • the acoustic module 800 may be disposed in the opening 851 of the printed circuit board 850 such that the rear part faces the first surface 810A and the front part faces the second surface 810B.
  • the first frame 820 is disposed between the rear surface of the display 861 and the first substrate surface 850A
  • the second frame 830 is disposed between the second substrate surface 850B and the second surface 810B. can be placed in between.
  • a resonance space 891 located behind the sound module 800 may be formed between the first frame 820 and the display 861 .
  • the first frame 820 is formed through an area overlapping the sound module 800, and the sound generated by the sound module 800 passes through the resonance space 891.
  • a resonance hole 821 may be formed.
  • the resonance space 891 may function as a back volume in which sound emitted to the rear of the sound module 800 resonates.
  • an acoustic conduit 892 for transmitting sound emitted from the front of the acoustic module 800 to the outside of the housing 810 is formed.
  • a heat dissipation member 862 may be disposed on the rear surface of the display 861 facing the resonance space 891 .
  • the heat dissipation member 862 may be formed of graphite or a metal material (eg, copper (cu)).
  • the heat dissipation member 862 may perform a function of radiating heat generated from the display 861 and improving the rigidity of the display 861 . According to this structure, while the sound generated by the sound module 800 vibrates in the resonance space 891, vibration resistance of the display 861 may be improved through the heat dissipation member 862.
  • the first frames 820 may be formed of different materials according to positions.
  • the first frame 820 may be metal injection molded to include a first region 8201 formed of a metal material and a second region 8202 formed of a plastic material.
  • the sound module 800 overlaps the second area 8202 of the first frame 820, and the second area 8202 has a resonance space 891 ), a resonance hole 821 for passing sound generated by the sound module 800 may be formed.
  • the first region 8201 may have a relatively thinner thickness than the second region 8202 .
  • the first region 8201 is made of a metal material, sufficient vibration resistance can be secured even when the thickness is thinner than that of the second region 8202 .
  • the distance between the display 861 and the first region 8201 may be increased, thereby expanding the volume of the resonance space 891 .
  • the second frame 830 connects a first support portion 831 parallel to the second substrate surface 850B and the first support portion 831 and the second substrate surface 850B.
  • a second support portion 832 extending in the direction of the second substrate surface 850B may be included.
  • the first support portion 831 and the second support portion 832 are formed between the printed circuit board 850 and the second frame 830, and sound emitted to the front of the sound module 800.
  • An outer wall of the sound pipe 892 passing through the sound hole 878 may be formed.
  • the second frame 830 may include a metal member 8301 inserted into the first support portion 831 .
  • the metal member 8301 may improve durability against vibration applied to the second frame 830 while the sound of the sound module 800 passes through the sound pipe 892 .
  • the thickness of the first support part 831 into which the metal member 8301 is inserted is relatively thin compared to other parts, so that the volume of the sound pipe 892 can be expanded.
  • a shield can 840 may be connected to the second substrate surface 850B of the printed circuit board 850 .
  • the shield can 840 may be connected to the second substrate surface 850B to cover the front portion of the acoustic module 800, and at least a portion may communicate with the acoustic hole 878 of the housing 810.
  • sound emitted from the sound module 800 may be transmitted to the sound hole 878 through a space between the printed circuit board 850 and the shield can 840 .
  • the shield can 840 may function as a sound pipe 892 through which sound generated by the sound module 800 passes through the sound hole 878 .
  • the first frame 820 may include a plurality of concave-convex portions 822 formed on an outer surface portion facing the resonance space 891 .
  • the plurality of concave-convex portions 822 may be recessed in the shape of a groove on the outer surface of the first frame 820 .
  • the plurality of concave-convex portions 822 may improve the acoustic resonance effect in the resonance space 891 and increase the volume of the resonance space 891 by the amount of the recessed volume.
  • the electronic device 601 includes a first surface 610A, a second surface 610B opposite to the first surface 610A, and a side surface 610C surrounding a space between the front and rear surfaces. ), a display 661 visually exposed to the outside through the first surface 610A, a first substrate surface 650A, and a first substrate surface 650A opposite to the first substrate surface 650A.
  • the acoustic module 600 is disposed such that a front portion faces the second surface 610B of the housing 610 and a rear portion opposite to the front portion faces the display 661, and the The resonance space 691 may function as a back volume of the acoustic module 600 .
  • the first frame 620 includes a support area 621 connected to support the rear portion of the acoustic module 600, and the resonance hole 622 is in the support area 621. can be formed
  • the electronic device 601 may extend the first frame 620 and the first substrate surface 650A along the circumference of the support area 621 . It may further include a first shielding member 671 disposed therebetween and made of a compressible material.
  • the electronic device 601 may include a second frame 630 disposed between the printed circuit board 650 and the second surface 610B to face the second substrate surface 650B. can include more.
  • the housing 610 includes a sound hole for emitting the sound to the outside, and communicates with the sound hole between the second frame 630 and the second substrate surface 650B, A sound pipe 692 may be formed to pass sound emitted from the sound module 600 into the sound hole.
  • the second frame 630 includes a first support portion 631 parallel to the second substrate surface 650B, and the first support portion 631 and the second substrate surface 650B. and a second support portion 632 extending in the direction of the second substrate surface 650B so as to connect the first support portion 631 and the second support portion 632 to an outer wall of the sound pipe 692.
  • the electronic device 601 may further include a second shielding member 672 disposed between the second support portion 632 and the second substrate surface 650B and formed of a compressible material.
  • the second frame 830 may further include a metal member 8301 inserted into the second support part 832 .
  • the electronic device 801d further includes a shield can 840 connected to the second substrate surface 850B to cover the front portion of the sound module 800, and the sound module 800 Sound emitted from may be transferred to the outside of the housing 810 through a space between the printed circuit board 850 and the shield can 840 .
  • a sealing member 640 disposed between the display 661 and the first frame 620 is further installed to surround the circumference of the resonance space 691.
  • the first frame 820 includes a first area 8201 formed of a metal material and a second area 8202 formed of a plastic material, in a state in which the display 861 is viewed.
  • the sound module 800 may overlap the second area 8202.
  • the first frame 820 may be formed by metal injection molding.
  • the first frame 820 may include a plurality of concave-convex portions 822 formed on an outer surface portion facing the resonance space 891 .
  • the electronic device 801a may further include a heat dissipation member 862 disposed on the rear surface of the display 661 so as to face the resonance space 891 .
  • the electronic device 601 includes a first surface 610A, a second surface 610B opposite to the first surface 610A, and the first surface 610A and the second surface 610B. ) including a side surface 610C surrounding the inner space between the housing 610 having a sound hole communicating with the inner space formed on the outer surface, disposed on the first surface 610A, and visually exposed to the outside.
  • a display 661 a printed circuit board 650 disposed in the inner space and including an opening 651 formed open to pass through both sides, and a sound module connected to the printed circuit board 650 and generating sound 600, the resonance hole 622 disposed between the printed circuit board 650 and the display 661 and formed through the support area overlapping the opening 651 in a state of looking at the display 661
  • a first frame 620 including a first frame 620 and a second frame 630 disposed between the printed circuit board 650 and the second surface 610B
  • the sound module 600 has a front portion of the second surface It faces the frame 630 and is disposed in the opening 651 so that the rear portion faces the first frame 620, and between the display 661 and the first frame 620, the rear portion of the sound module 600
  • a resonance space 691 in which the emitted sound resonates is formed, and between the printed circuit board 650 and the second frame 630, the sound is communicated with the sound hole and emitted to the front of the sound module 600.
  • the electronic device 601 is disposed between the first frame 620 and the printed circuit board 650 so as to surround the sound module 600 while looking at the display 661. Further comprising a first shielding member 671, and a second shielding member 672 disposed between the first frame 620 and the printed circuit board 650 along the circumference of the sound pipe 692, The first shielding member 671 and the second shielding member 672 may include a poron material.
  • the electronic device 601 may further include a sealing member 640 disposed between the display 661 and the first frame 620 to seal the resonance space 691 .
  • the electronic device 601 further includes a battery 680 disposed in the inner space, and the battery 680 is disposed between the second frame 630 and the second surface 610B. It can be.
  • An electronic device 601 includes a housing 610, a first surface 610A, a second surface 610B opposite to the first surface 610A, and the first surface 610A and A housing 610 including a side surface 610C surrounding a space between the second surfaces 610B, a display supported by the housing 610, and visually exposed to the outside through the first surface 610A.
  • the housing 610 disposed inside the housing 610, including a first substrate surface 650A facing the first surface 610A and a second substrate surface 650B facing the second surface 610B; , the printed circuit board 650 in which an opening 651 penetrating the first substrate surface 650A and the second substrate surface 650B is formed, and the front faces the first surface 610A and the rear faces the first substrate 650.
  • a sound module 600 disposed in the opening 651 facing the second surface 610B and disposed between the display 661 and the printed circuit board 650 for generating sound, the sound module 600
  • the first frame 620 including a resonance hole 622 through which the sound generated from passes is disposed in front of the sound module 600, and the sound generated by the sound module 600 is transmitted to the outside of the housing 610.
  • It includes a second frame 630 forming a sound conduit 692 for transmitting to the sound, and a battery 680 disposed inside the housing 610, between the display 661 and the first frame 620.
  • a resonance space 691 communicating with the resonance hole 622 is formed, and the battery 680 may be disposed on the opposite side of the resonance space 691 with respect to the printed circuit board 650.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Otolaryngology (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Telephone Set Structure (AREA)
  • Telephone Function (AREA)

Abstract

Un dispositif électronique comprenant un haut-parleur est divulgué. Un dispositif électronique selon divers modes de réalisation peut comprendre : un boîtier comprenant une première surface, une seconde surface opposée à la première surface, et une surface latérale entourant un espace entre la surface avant et la surface arrière ; un écran exposé visuellement à l'extérieur à travers la première surface ; une carte de circuit imprimé comprenant une première surface de substrat, une seconde surface de substrat opposée à la première surface de substrat, et une ouverture ouverte et formée à travers la première surface de substrat et la seconde surface de substrat, la carte de circuit imprimé étant disposée à l'intérieur du boîtier de telle sorte que la première surface de substrat fait face à la seconde surface de l'écran ; un module sonore connecté à la carte de circuit imprimé et générant un son ; et un premier cadre disposé entre l'écran et la carte de circuit imprimé et espacé de l'écran de façon à former un espace de résonance.
PCT/KR2022/013006 2021-11-01 2022-08-31 Dispositif électronique comprenant un haut-parleur WO2023075113A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0147900 2021-11-01
KR1020210147900A KR20230063059A (ko) 2021-11-01 2021-11-01 스피커를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2023075113A1 true WO2023075113A1 (fr) 2023-05-04

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090169041A1 (en) * 2007-12-27 2009-07-02 Motorola Inc Acoustic reconfiguration devices and methods
KR20130099460A (ko) * 2012-02-29 2013-09-06 주식회사 팬택 스피커부를 구비하는 단말기
JP2014123946A (ja) * 2012-12-24 2014-07-03 Chiun Mai Comm Systems Inc スピーカーモジュールを備えた携帯式電子装置
KR20170006075A (ko) * 2015-07-07 2017-01-17 엘지전자 주식회사 이동 단말기
KR102025573B1 (ko) * 2018-08-01 2019-09-26 주식회사 이엠텍 측면 음방사 구조의 마이크로스피커 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090169041A1 (en) * 2007-12-27 2009-07-02 Motorola Inc Acoustic reconfiguration devices and methods
KR20130099460A (ko) * 2012-02-29 2013-09-06 주식회사 팬택 스피커부를 구비하는 단말기
JP2014123946A (ja) * 2012-12-24 2014-07-03 Chiun Mai Comm Systems Inc スピーカーモジュールを備えた携帯式電子装置
KR20170006075A (ko) * 2015-07-07 2017-01-17 엘지전자 주식회사 이동 단말기
KR102025573B1 (ko) * 2018-08-01 2019-09-26 주식회사 이엠텍 측면 음방사 구조의 마이크로스피커 모듈

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