WO2022182004A1 - Dispositif électronique comprenant un module de microphone et structure de conduit de microphone de dispositif électronique - Google Patents
Dispositif électronique comprenant un module de microphone et structure de conduit de microphone de dispositif électronique Download PDFInfo
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- WO2022182004A1 WO2022182004A1 PCT/KR2022/001324 KR2022001324W WO2022182004A1 WO 2022182004 A1 WO2022182004 A1 WO 2022182004A1 KR 2022001324 W KR2022001324 W KR 2022001324W WO 2022182004 A1 WO2022182004 A1 WO 2022182004A1
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- circuit board
- printed circuit
- hole
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- conduit
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- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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Definitions
- Various embodiments disclosed in this document relate to an electronic device including a microphone module and a structure of a microphone channel of the electronic device.
- the number of electronic components included in electronic devices is gradually increasing due to improvement in performance and diversification of functions of electronic devices.
- the internal space of the electronic device is gradually decreasing.
- the electronic device may include a plurality of cameras capable of capturing different angles of view, may include an optical image stabilizer (OIS) function, and may include a larger image sensor.
- OIS optical image stabilizer
- manufacturers of electronic devices are releasing electronic devices including cameras that can perform more functions.
- the electronic device may include a microphone disposed to face the rear of the electronic device so as to receive a sound of better quality from an image captured by the camera facing the rear of the electronic device.
- Various embodiments disclosed in this document may suggest a method for efficiently utilizing the internal space in relation to the arrangement of the microphone module disposed adjacent to the camera module.
- An electronic device includes a first printed circuit board, a second printed circuit board spaced apart from the first printed circuit board in a first direction, and the second printed circuit board facing the first direction.
- a microphone module disposed on a first surface of a printed circuit board, a first hole formed in the second printed circuit board at a position facing the microphone hole of the microphone module, the first printed circuit board and the second printed circuit board It may include a first conduit positioned therebetween and at least a portion of which is connected to the first hole, and an external hole formed to communicate with the outside of the electronic device and connected to the first conduit.
- the microphone pipe structure connecting the microphone hole of the microphone module included in the electronic device according to various embodiments disclosed herein and the external hole formed in the rear member of the electronic device to communicate with the outside of the electronic device includes the microphone hole and A first hole spaced apart from the first printed circuit board in a first direction to be connected and formed in a second printed circuit board on which the microphone hole is disposed, and a second hole spaced apart from the first hole and formed in the second printed circuit board and a first conduit connecting the first hole and the second hole, and the external hole may be connected to the first conduit.
- the printed circuit board area may be extended to a portion that is difficult to be utilized in the conventional structure.
- a space in which electronic components can be disposed may be further secured by the expanded printed circuit board. By securing a space in which the electronic component can be disposed, the efficiency of using the internal space may be increased.
- FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
- FIG. 2A is a front perspective view of an electronic device according to various embodiments of the present disclosure.
- FIG. 2B is a rear perspective view of the electronic device of FIG. 2A according to various embodiments of the present disclosure
- FIG. 3 is an exploded perspective view of the electronic device of FIG. 2A according to various embodiments of the present disclosure
- FIG. 4 is a view for explaining an arrangement structure of a microphone module in a conventional electronic device.
- FIG. 5 is a schematic cross-sectional view for explaining the structure of a microphone pipe in a conventional electronic device.
- FIG. 6 is a view for explaining an arrangement structure of a microphone module in an electronic device according to various embodiments disclosed in this document.
- FIG. 7 is a view for explaining a structure of a camera housing according to various embodiments disclosed in this document.
- FIG. 8 is an enlarged view of the P region shown in FIG. 6 .
- FIG. 9 is a schematic diagram of the structure of a microphone pipe disclosed in this document.
- Fig. 10 is a schematic cross-sectional view of the microphone pipe structure disclosed in this document.
- FIG. 11 is a view comparing the pipe structure of the conventional microphone module and the printed circuit board according to the microphone pipe structure according to various embodiments disclosed in this document.
- a or B at least one of A and B”, “or at least one of B,” “A, B or C,” “at least one of A, B and C,” and “B; or “at least one of C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
- Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. that one (e.g. first) component is “coupled” or “connected” to another (e.g. second) component with or without the terms “functionally” or “communicatively” When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
- FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
- an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
- a first network 198 eg, a short-range wireless communication network
- a second network 199 e.g., a second network 199
- the electronic device 101 may communicate with the electronic device 104 through the server 108 .
- the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
- at least one of these components eg, the connection terminal 178
- some of these components are integrated into one component (eg, display module 160 ). can be
- the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
- software eg, a program 140
- the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
- the volatile memory 132 may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
- the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
- the main processor 121 eg, a central processing unit or an application processor
- a secondary processor 123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
- the main processor 121 e.g, a central processing unit or an application processor
- a secondary processor 123 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a
- the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
- the coprocessor 123 eg, an image signal processor or a communication processor
- may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190 ). have.
- the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
- Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
- the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
- the artificial intelligence model may include a plurality of artificial neural network layers.
- Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
- the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
- the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
- the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
- the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
- the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
- the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
- the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
- the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
- the sound output module 155 may include, for example, a speaker or a receiver.
- the speaker can be used for general purposes such as multimedia playback or recording playback.
- the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
- the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
- the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
- the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
- the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 .
- the electronic device 102) eg, a speaker or headphones
- the electronic device 102 may output a sound.
- the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
- the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
- the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
- the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
- the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
- the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
- the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
- the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
- the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 188 may manage power supplied to the electronic device 101 .
- the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
- PMIC power management integrated circuit
- the battery 189 may supply power to at least one component of the electronic device 101 .
- battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
- the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
- the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
- the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
- a wireless communication module 192 eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module
- GNSS global navigation satellite system
- wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
- a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
- a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
- a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
- a telecommunication network
- the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
- subscriber information eg, International Mobile Subscriber Identifier (IMSI)
- IMSI International Mobile Subscriber Identifier
- the electronic device 101 may be identified or authenticated.
- the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
- NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
- eMBB enhanced mobile broadband
- mMTC massive machine type communications
- URLLC ultra-reliable and low-latency
- the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
- a high frequency band eg, mmWave band
- the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
- the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
- the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
- a peak data rate eg, 20 Gbps or more
- loss coverage eg, 164 dB or less
- U-plane latency for realizing URLLC
- the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
- the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
- the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
- other components eg, a radio frequency integrated circuit (RFIC)
- RFIC radio frequency integrated circuit
- the antenna module 197 may form a mmWave antenna module.
- the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
- peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
- GPIO general purpose input and output
- SPI serial peripheral interface
- MIPI mobile industry processor interface
- the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
- Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
- all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
- the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
- one or more external electronic devices may be requested to perform at least a part of the function or the service.
- One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
- the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
- cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
- the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
- the external electronic device 104 may include an Internet of things (IoT) device.
- the server 108 may be an intelligent server using machine learning and/or neural networks.
- the external electronic device 104 or the server 108 may be included in the second network 199 .
- the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
- 2A is a perspective view of a front side of an electronic device 200 (eg, a mobile electronic device) according to various embodiments of the present disclosure.
- 2B is a perspective view of a rear surface of the electronic device 200 of FIG. 2A according to various embodiments of the present disclosure.
- the electronic device 200 described below may include at least one of the components of the electronic device 101 described above with reference to FIG. 1 .
- the electronic device 200 includes a first side (or front side) 210A, a second side (or back side) 210B, and a first side 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B.
- the housing may refer to a structure forming a part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2A .
- the first surface 210A may be formed by a front plate 202 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent.
- the second surface 210B may be formed by a substantially opaque back plate 211 .
- the back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
- the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure 218 (or “side member”) including a metal and/or a polymer.
- the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).
- the front plate 202 has a first region 210D that extends seamlessly by bending from the first surface 210A toward the rear plate, including a long edge of the front plate. edge) can be included at both ends.
- the rear plate 211 may include a second region 210E that extends seamlessly from the second surface 210B toward the front plate at both ends of the long edge. have.
- the front plate 202 or the back plate 211 may include only one of the first region 210D or the second region 210E.
- the front plate 202 may not include the first region and the second region, but only a flat plane disposed parallel to the second surface 210B.
- the side bezel structure 218 when viewed from the side of the electronic device, has a first thickness ( or width), and may have a second thickness thinner than the first thickness on the side surface including the first region 210D or the second region 210E.
- the electronic device 200 includes a display 201 , an input device 203 , a sound output device 207 and 214 , sensor modules 204 and 219 , camera modules 205 and 212 , and a key. It may include at least one or more of an input device 217 , an indicator (not shown), and a connector 208 . In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or an indicator) or additionally include other components.
- the display 201 may be exposed through a substantial portion of the front plate 202 , for example. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C.
- the display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
- at least a portion of the sensor module 204 , 219 , and/or at least a portion of a key input device 217 is located in the first area 210D, and/or the second area 210E. can be placed.
- the input device 203 may include a microphone 203 .
- the input device 203 may include a plurality of microphones 203 arranged to sense the direction of the sound.
- the sound output devices 207 and 214 may include speakers 207 and 214 .
- the speakers 207 and 214 may include an external speaker 207 and a receiver 214 for a call.
- the microphone 203 , the speakers 207 , 214 , and the connector 208 may be at least partially disposed in the internal space of the electronic device 200 , and may be formed through at least one hole formed in the housing 210 . may be exposed to the external environment.
- the hole formed in the housing 210 may be used in common for the microphone 203 and the speakers 207 and 214 .
- the sound output devices 207 and 214 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 210 .
- the sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
- the sensor modules 204 and 219 include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 210A of the housing 210 . ) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, an HRM sensor) disposed on the second surface 210B of the housing 210 .
- the fingerprint sensor may be disposed on the first surface 210A (eg, a home key button) of the housing 210 , a portion of the second surface 210B, and/or under the display 201 .
- the electronic device 200 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
- a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
- the camera modules 205 and 212 include a first camera module 205 disposed on the first side 210A of the electronic device 200, and a second camera module 212 disposed on the second side 210B of the electronic device 200, and/or flash 213 .
- the camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
- the flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device 200 .
- the second camera module 212 may be protected by the camera housing 290 disposed on the second surface 210B of the electronic device 200 . At least a portion of the camera housing 290 may be exposed as the second surface 210B of the electronic device 200 .
- An external hole 291 may be formed in the camera housing 290 . In an embodiment, an external sound introduced through the external hole 291 may be transmitted to a microphone module (not shown) disposed adjacent to the second camera module 212 .
- the key input device 217 may be disposed on the side surface 210C of the housing 210 .
- the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 are displayed on the display 201 as soft keys, etc. It may be implemented in other forms.
- the key input device 217 may be implemented using a pressure sensor included in the display 201 .
- the indicator may be disposed, for example, on the first surface 210A of the housing 210 .
- the indicator may provide, for example, state information of the electronic device 200 in the form of a light (eg, a light emitting device).
- the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 205 .
- the indicator may include, for example, an LED, an IR LED and/or a xenon lamp.
- the connector hole 208 includes a first connector hole 208 capable of receiving a connector (eg, a universal serial bus (USB) connector) for transmitting and receiving power and/or data with an external electronic device, and/or It may include a second connector hole (or earphone jack) (not shown) capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.
- a connector eg, a universal serial bus (USB) connector
- USB universal serial bus
- Some camera modules 205 of the camera modules 205 and 212 , some sensor modules 204 of the sensor modules 204 and 219 , or an indicator may be disposed to be exposed through the display 201 .
- the camera module 205 , the sensor module 204 , or the indicator may come into contact with the external environment through an opening or a transmission area perforated to the front plate 202 of the display 201 in the internal space of the electronic device 200 . It can be arranged so that According to an embodiment, the area where the display 201 and the camera module 205 face each other may be formed as a transparent area having a predetermined transmittance as a part of an area displaying content.
- the transmission region may be formed to have a transmittance in a range of about 5% to about 20%.
- a transmission area may include an area overlapping an effective area (eg, an angle of view area) of the camera module 205 through which light for generating an image by being imaged by an image sensor passes.
- the transmissive area of the display 201 may include an area having a lower pixel density than the surrounding area.
- the transmissive area may replace the opening.
- the camera module 205 may include an under display camera (UDC).
- UDC under display camera
- some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device. For example, in this case, the area of the display 201 facing the sensor module may not need a perforated opening.
- the electronic device 200 has a bar-type or plate-type appearance, but the present invention is not limited thereto.
- the illustrated electronic device 200 may be a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a part of a rollable electronic device.
- foldable electronic device “slidable electronic device”, “stretchable electronic device” and/or “rollable electronic device” This means that bending deformation of the display (eg, the display 330 of FIG. 3 ) is possible, at least a part of it is folded, rolled or rolled, or at least partially the area is expanded and/or the housing It may refer to an electronic device that can be accommodated inside (eg, the housing 210 of FIGS.
- a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device expands a screen display area by unfolding a display or exposing a larger area of the display to the outside according to a user's needs. Can be used.
- FIG. 3 is an exploded perspective view of the electronic device 200 of FIG. 2A according to various embodiments of the present disclosure.
- the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 200 of FIGS. 2A and 2B , or may include another embodiment of the electronic device.
- the electronic device 300 (eg, the electronic device 200 of FIG. 2A or FIG. 2B ) includes a side member 310 (eg, a side bezel structure), a first support member 311 (for example: a bracket or support structure), a front plate 320 (such as a front cover), a display 330 (such as the display 201 in FIG. 2A ), a substrate 340 (such as a printed circuit board (PCB); A flexible PCB (FPCB), or rigid-flex PCB (RFPCB)), a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and a rear plate 380 (eg, a rear surface) cover) may be included.
- a side member 310 eg, a side bezel structure
- a first support member 311 For example: a bracket or support structure
- a front plate 320 such as a front cover
- a display 330 such as the display 201 in FIG. 2A
- the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2A or FIG. 2B , and overlapping descriptions will be omitted below.
- the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 , or may be integrally formed with the side member 310 .
- the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
- the first support member 311 may have a display 330 coupled to one surface and a substrate 340 coupled to the other surface.
- the substrate 340 may be equipped with a processor, memory, and/or an interface.
- the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
- Memory may include, for example, volatile memory or non-volatile memory.
- the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
- the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed, for example, on the same plane as the substrate 340 . The battery 350 may be integrally disposed inside the electronic device 300 . In another embodiment, the battery 350 may be detachably disposed from the electronic device 300 .
- the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
- the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
- the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
- an antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
- FIG. 4 is a view for explaining an arrangement structure of a microphone module in a conventional electronic device.
- 5 is a schematic cross-sectional view for explaining the structure of a microphone pipe in a conventional electronic device.
- Various embodiments disclosed in this document relate to an electronic device including a microphone module and a pipe structure of the microphone module.
- the microphone module may be one of the input devices 150 described above with reference to FIG. 1 .
- the microphone module and the pipe structure of the microphone module will be described by taking the electronic device 200 shown in FIGS. 2A, 2B and 3 as an example.
- the shape of the electronic device described in this document is not limited to the shape of the electronic device 200 illustrated in FIGS. 2A, 2B, and 3 by this description.
- channel may mean a passage that guides the transmission of sound (sound wave).
- a conduit may mean a physical space.
- the conduit may include a space filled with a medium capable of transmitting sound waves.
- transmission of sound through a pipe may mean transmission of sound through a specific space.
- that a certain component is connected through a conduit may mean that a space indicated by the component is connected to each other through a specific space.
- the electronic device may include a stacked structure of the camera housing 440 - the rear case 430 - the first printed circuit board 421 - the microphone module 410 in the portion where the microphone module 410 is located.
- An external hole 443 (eg, an external hole 291 of FIG. 2B ) may be formed in the camera housing 440 .
- the external hole 443 is an opening connected to the outside of the electronic device, and external sound may be transmitted to the microphone module 410 through the external hole 443 .
- the microphone module 410 may be disposed on the rear surface of the first printed circuit board 421 (eg, the surface facing the -Z direction of FIG. 4 ) and may be electrically connected to the first printed circuit board 421 .
- a first hole 421A may be formed in a portion of the first printed circuit board 421 where the microphone module 410 is disposed.
- the first hole 421A may be formed in the first printed circuit board 421 to be connected to the microphone hole 411 through which a sound is introduced from the microphone module 410 .
- the first hole 421A formed in the first printed circuit board 421 may connect the first conduit 431 formed in the rear case 430 and the microphone hole.
- the first hole 421A and the external hole 443 are connected to each other.
- a conduit 431 may be formed.
- the rear case 430 may be disposed between the camera housing 440 and the first printed circuit board 421 .
- a sealing member 510 may be disposed around the first conduit 431 so that the sound passing through the first conduit 431 does not leak to the outside of the first conduit 431 .
- the sealing member 510 may be disposed between the rear case 430 and the first printed circuit board 421 .
- the sealing member may be disposed between the rear case 430 and the camera housing 440 .
- An external hole 443 and a second pipe 444 connecting the external hole 443 to the first pipe 431 may be formed in the camera housing 440 .
- the camera housing 440 may include a body 441 and a window member 442 at least partially formed of a transparent material.
- the body portion 441 and the window member 442 may be bonded by an adhesive member 520 .
- the outer hole 443 may be formed in the window member 442
- the second conduit 444 may be formed in the body portion 441 .
- the sound outside the electronic device is transmitted to the microphone module 410 via the external hole 443 - the second tube 444 - the first tube 431 - the first hole 421A - the microphone hole 411. can be transmitted.
- 11A is a view for explaining a mounting area of a printed circuit board according to a structure of a microphone pipe of a conventional electronic device.
- the second printed circuit board 422 spaced apart from the first printed circuit board 421 in the first direction is the rear in which the first conduit 431 is formed. It cannot extend to the area A of the case 430 .
- the second printed circuit board 422 cannot be positioned in the area A in which the first conduit 431 is formed. Since the second printed circuit board 422 cannot extend to the area A where the first conduit 431 is located, the component mounting area of the second printed circuit board 422 may be reduced.
- FIG. 6 is a view for explaining an arrangement structure of a microphone module in an electronic device according to various embodiments disclosed in this document.
- 7 is a view for explaining a structure of a camera housing according to various embodiments disclosed in this document.
- FIG. 8 is an enlarged view of the P region shown in FIG. 6 .
- 9 is a schematic diagram of the structure of a microphone pipe disclosed in this document.
- Fig. 10 is a schematic cross-sectional view of the microphone pipe structure disclosed in this document. 10 is, for example, a cross-sectional view of the electronic device shown in FIG. 2B taken along line A-A.
- the electronic device (eg, the electronic device 101 of FIG. 1 or the electronic device 200 of FIGS. 2A and 2B ) of various embodiments disclosed in this document has a camera in a portion where the microphone module 610 is located.
- the housing 640 (eg, the camera housing 290 of FIG. 2B ) may include a stacked structure of the rear case 630 , the second printed circuit board 622 , and the first printed circuit board 621 .
- the external hole 644 - 1 may be an opening communicating with the outside of the electronic device. An external sound may be transmitted into the electronic device through the external hole 644 - 1 .
- the external hole 644 - 1 may be formed in the camera housing 640 as shown in FIGS. 7 and 10 ( a ).
- the camera housing 640 may refer to a mechanism for protecting the camera module by having a partial area to cover the camera module (eg, the camera module 180 of FIG. 1 or the camera module 211 of FIG. 2B ).
- the camera module may be electrically connected to at least one of the first printed circuit board 621 and the second printed circuit board 622 .
- the outer hole 644 - 1 may be formed in a rear member, at least a part of which forms a part of the exterior of the electronic device.
- the rear member may include a camera housing 640 .
- the camera housing 640 may be disposed to cover the camera module in the first direction (eg, the +Z direction of FIG. 6 ). Also, depending on the size of the camera housing 640 , a partial area of the camera housing 640 may cover the microphone module 610 in the first direction.
- the camera housing 640 may include a body portion 641 and a window member 642 .
- the body portion 641 may refer to a portion constituting the overall shape of the camera housing 640 .
- the window member 642 may be coupled to the body 641 . At least a portion of the window member 642 may be formed of a transparent material. At least a portion of the window member 642 may be formed of a transparent material so that external light may be incident on the lens of the camera module.
- the outer hole 644 - 1 may include an opening formed in the window member 642 of the camera housing 640 .
- the outer hole 644-2 is a spaced-apart outer hole formed between the body 641 and the window member 642 of the camera housing 640 ( 644-2). In this case, a separate opening may not be formed in the window member 642 .
- the outer hole 644 - 2 may be a slit-shaped gap provided between the body portion and the window member 642 .
- all of the external holes 644-1 or 644-2 will be described as the external holes 644-1 shown in FIG. 10A.
- the external hole 644 - 1 may be formed in the body portion 641 of the camera housing 640 .
- the external hole 644-1 is formed in the side surface of the body 641 to form the camera housing. It may be connected to the second conduit 642 formed in the 640 .
- the camera housing 640 may include a structure in which a body portion 641 - an adhesive member 645 - a window member 642 are stacked in this order.
- a plurality of holes 641-1, 641-2, and 641-3 may be formed in the body portion 641 .
- the holes 641-1, 641-2, and 641-3 may respectively correspond to a plurality of lenses included in the camera module (eg, the second camera module 112).
- a second conduit 642 connected to the external hole 644 - 1 may be formed in the body portion 641 .
- the adhesive member 645 may be disposed on the body portion 641 .
- the adhesive member 645 may provide an adhesive force so that the window member 642 may be coupled to the body 641 .
- the adhesive member 645 may include a material having low light transmittance so that the body 641 is not viewed through the window member 642 .
- a plurality of holes 641-1, 641-2, and 641-3 of the body portion 641 and a plurality of holes 645-1, 645-2, 645-3 corresponding to the plurality of holes 645-1, 645-2, 645-3 may be formed in the adhesive member 645.
- the window member 642 may be fixed on the body portion 641 by an adhesive member 645 . At least a portion of the window member 642 may be formed of a material having high light transmittance. An external hole 644 - 1 connected to the second conduit 643 of the body 641 may be formed in the window member 642 .
- the external hole 644 - 1 and the second conduit 643 are formed in the camera housing 640 , but the external hole 644 - 1 may be formed in a part other than the camera housing 640 .
- the outer hole 644 - 1 and the second conduit 643 may be formed in the rear member.
- the rear member may include various mechanisms disposed on the rear surface of the electronic device (eg, the surface facing the +Z direction of FIG. 6 ).
- the rear member may include a rear cover 650 forming a rear exterior of the electronic device and a mechanism disposed adjacent to the rear cover. It may be understood that the camera housing 640 described above is also included in the rear member 650 .
- the rear cover 650 may include a component (eg, the rear plate 211 of FIG. 2B ) constituting the rear exterior of the electronic device.
- the back cover 650 may be formed of various materials such as a transparent back glass, a metal plate, or a synthetic resin plate.
- the outer hole 644 - 1 is formed in the rear cover 650
- the second conduit 643 connected to the outer hole 644 - 1 is a mechanism disposed adjacent to the rear cover 650 . can be formed in
- the microphone module 610 may be disposed on the first surface 622-1 of the second printed circuit board 622 .
- the first surface 622-1 of the second printed circuit board 622 may refer to a surface facing the +Z direction with respect to FIG. 10 .
- the second printed circuit board 622 may be disposed to be spaced apart from the first printed circuit board 621 in the first direction (eg, the +Z direction of FIG. 10 ).
- the microphone hole 613 for transmitting sound to the microphone module 610 may be disposed to face the first surface 622-1 of the second printed circuit board 622 .
- the terminal parts 611 and 612 included in the microphone module 610 are bonded to the second printed circuit board 622 , so that the microphone module 610 is electrically connected to the second printed circuit board 622 .
- the terminal parts 611 and 612 of the microphone module 610 may be formed to surround the microphone hole 613 .
- the terminal unit 612 is bonded to the second printed circuit board 622 (eg, bonding through soldering)
- the periphery of the microphone hole 613 may be airtight.
- a first hole 622A and a second hole 622B may be formed in the second printed circuit board 622 .
- the first hole 622A and the second hole 622B may be holes formed to pass through the second printed circuit board 622 .
- the first hole 622A may be formed at a position facing the microphone hole 613 to be connected to the microphone hole 613 .
- the second hole 622B may be a hole formed at a position spaced apart from the first hole 622A.
- the first conduit 811 may be a passage connecting the first hole 622A and the second hole 622B.
- the first conduit 811 may be positioned between the first printed circuit board 621 and the second printed circuit board 622 .
- the second printed circuit board 622 may be disposed to be spaced apart from the first printed circuit board 621 in the first direction (eg, the +Z direction of FIG. 9 ).
- the second printed circuit board 622 is spaced apart from the first printed circuit board 621 by an interposer 820 disposed between the first printed circuit board 621 and the second printed circuit board 622 . and can be placed.
- the interposer 820 may be formed of a conductive material to electrically connect the first printed circuit board 621 and the second printed circuit board 622 .
- the first conduit 811 may be located in the mounting space 1000 formed by the first printed circuit board 621 , the second printed circuit board 622 , and the interposer 820 . .
- the first conduit 811 may be formed by a mechanism 810 whose outer circumference is in contact with the second surface 622 - 2 of the second printed circuit board 622 .
- the second surface 622 - 2 of the second printed circuit board 622 may refer to a surface facing the second direction opposite to the first direction (eg, the -Z direction of FIG. 10 ).
- the adhesive airtight member 812 is disposed on the outer periphery of the plate-shaped mechanism 810 , and the adhesive airtight member 812 is formed on the second surface 622 of the second printed circuit board 622 . -2), the first conduit 811 may be formed.
- the mechanism forming the first conduit 811 may be formed in a shape in which the outer periphery partially protrudes toward the second printed circuit board 622 .
- An airtight member is disposed on the outer periphery of the mechanism protruding toward the second printed circuit board 622, and the airtight member is attached to the second surface 622-2 of the second printed circuit board 622, whereby the first conduit ( 811) may be formed.
- the mechanism forming the first conduit 811 may be formed of various materials.
- the device may be formed of a metal material such as an aluminum alloy, or formed of a polymer compound such as a synthetic resin material.
- various electronic components eg, the electronic components 910 and 920 of FIG. 10 )
- various electronic components can be placed in the mounting space 1000 .
- the second surface 622-2 of the second printed circuit board 622 or the first surface 621-1 of the first printed circuit board 621 eg, FIG. 10
- a variety of electronic components may be disposed on the side facing the +Z and may be electrically connected to the second printed circuit board 622 or the first printed circuit board 621 .
- some of the electronic components 910 disposed on the first surface 621-1 of the first printed circuit board 621 partially overlap the first conduit 811 when viewed from the first direction. can be
- FIG. 11 is a view comparing the pipe structure of the conventional microphone module and the printed circuit board according to the microphone pipe structure according to various embodiments disclosed in this document.
- the interposer 820 is disposed up to area A of FIG. 11 (a) differently from the conventional structure described with reference to FIGS. 4 and 5 (a.
- a board 622 may be disposed (refer to (b) of FIG. 11 ).
- an area for arranging electronic components may be further secured compared to the conventional structure described with reference to FIGS. 4 and 5.
- Printed circuit board If the area of ' is expanded, an area where wiring can be arranged can be further secured.
- various components that can be arranged on a printed circuit board, such as electronic components or wiring, are arranged compared to the conventional structure. You can have more space to do it.
- the third conduit 631 may be a passage connecting the second conduit 643 and the second hole 622B.
- the third conduit 631 may be formed in the rear case 630 disposed between the second printed circuit board 622 and the rear member (or the camera housing 640 ).
- the third conduit 631 has one end in contact with the first surface 622-1 of the second printed circuit board 622 and the other end on one surface of the rear member (eg, one surface 644-1 in FIG. 10 ). )) and may include a sealing structure in contact with it.
- a sealing member (not shown) may be disposed between one end of the second printed circuit board 622 and the rear case 630 to seal the airtight between the second printed circuit board 622 and the rear case 630 .
- one surface 644 - 1 of the rear member and the other end of the rear case 630 may contact each other.
- a sealing member (not shown) may be disposed between the rear member and the rear case 630 to seal the space between the rear member and the rear case 630 .
- a third conduit 631 connecting the second hole 622B and the second conduit 643 may be formed by the sealing structure and the passage formed in the rear case 630 .
- An external sound may be introduced through the external hole 644 - 1 .
- the sound introduced through the external hole 644 - 1 may be transmitted through the second conduit 643 connected to the external hole 644 - 1 .
- the second conduit 643 is connected to the third conduit 631 , the sound transmitted through the second conduit 643 may be transmitted to the third conduit 631 .
- the third conduit 631 is connected to the second hole 622B, and is transmitted to the third conduit 631 through the first conduit 811 connecting the second hole 622B and the first hole 622A.
- Sound may be transmitted to the first hole 622A through a connection structure of the second hole 622B - the first pipe line 811 - the first hole 622A.
- the first hole 622A may be connected to the microphone hole 613 of the microphone module 610 .
- the sound transmitted to the first hole 622A may be transmitted to the microphone module 610 through the microphone hole 613 .
- the microphone module 610 described above may be replaced with a speaker module (not shown).
- the sound generated by the speaker module may be radiated to the outside of the electronic device through the aforementioned pipe structure.
- the sound generated by the speaker module is transmitted to the first conduit 811 through the first hole 622A of the second printed circuit board 622 , and the second hole 622B connected to the first conduit 811 . ), and may be transmitted to the third conduit 631 connected to the second hole 622B.
- the sound may be transmitted through the second conduit 643 connected to the third conduit 631 , and the sound may be radiated through the external hole 644 - 1 connected to the second conduit 643 .
- the electronic device may include a first printed circuit board (eg, the first printed circuit board of FIG. 10 ). 621), a second printed circuit board (eg, the second printed circuit board 622 of FIG. 10 ) disposed to be spaced apart from the first printed circuit board in a first direction, and the first printed circuit board facing the first direction
- a position facing the microphone module eg, the microphone module 610 of FIG. 10 disposed on the first surface of the second printed circuit board, and the microphone hole of the microphone module (eg, the microphone hole 613 of FIG. 10)
- a first hole eg, the first hole 622A in FIG.
- a first conduit eg, the first conduit 811 of FIG. 10
- an external hole eg, the external hole 644-1 of FIG. 10
- a first conduit eg, the first conduit 811 of FIG. 10
- an external hole eg, the external hole 644-1 of FIG. 10
- a second hole spaced apart from the first hole and formed in the second printed circuit board may be further included, wherein the first conduit is the first hole and the second hole may be connected.
- an interposer (eg, in FIG. 10 ) disposed between the first printed circuit board and the second printed circuit board to space the second printed circuit board apart from the first printed circuit board in the first direction.
- An interposer 820 may be further included, and the first conduit may include a mounting space formed by the first printed circuit board, the second printed circuit board, and the interposer (eg, the mounting space 1000 of FIG. 10 ). can be located in
- At least one electronic component may be disposed on the first printed circuit board and the second printed circuit board in the mounting space, and at least one of the electronic components may include , when viewed from the first direction, may be disposed on the first printed circuit board at a position overlapping the first conduit.
- it may further include a second conduit (eg, the second conduit 643 of FIG. 10 ) positioned in the first direction with respect to the second printed circuit board and connected to the rear member in which the external hole is formed and the external hole.
- a second conduit eg, the second conduit 643 of FIG. 10
- the external hole and the second conduit may be formed in the rear member.
- it may further include a camera module electrically connected to at least one of the first printed circuit board and the second printed circuit board (eg, the camera module 180 of FIG. 1 ), wherein the rear member includes the first and a camera housing (eg, the camera housing 640 of FIG. 6 ) disposed to cover the camera module in the direction.
- a camera module electrically connected to at least one of the first printed circuit board and the second printed circuit board (eg, the camera module 180 of FIG. 1 ), wherein the rear member includes the first and a camera housing (eg, the camera housing 640 of FIG. 6 ) disposed to cover the camera module in the direction.
- At least a portion of the camera housing may be disposed to cover the microphone module in the first direction.
- the camera housing includes a body (eg, the body 641 of FIG. 6 ) and a window member coupled to the body and at least partially formed of a transparent material (eg, the window member 642 of FIG. 6 ).
- a body eg, the body 641 of FIG. 6
- a window member coupled to the body and at least partially formed of a transparent material (eg, the window member 642 of FIG. 6 ).
- the second conduit may be formed in the body portion
- the external hole may include an opening formed in the window member.
- the camera housing may include a body portion and a window member coupled to the body portion and at least partially formed of a transparent material, and the outer hole includes a spaced space provided between the body portion and the window member. can do.
- a third conduit (eg, the third conduit 631 of FIG. 10 ) connecting the second conduit and the second hole may be further included.
- the third conduit may include a sealing structure in which one end is in contact with the first surface of the second printed circuit board and the other end is in contact with one surface of the rear member.
- the microphone module (eg, the microphone module 610 of FIG. 10 ) included in the electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 300 of FIG. 3 ) according to various embodiments disclosed herein Connecting a microphone hole (eg, the microphone hole 613 of FIG. 10 ) and an external hole (eg, the external hole 644-1 of FIG. 10 ) formed in the rear member of the electronic device to communicate with the outside of the electronic device
- the microphone pipe structure is spaced apart in a first direction with respect to a first printed circuit board (eg, the first printed circuit board 621 of FIG. 10 ) so as to be connected to the microphone hole and a second printed circuit board on which the microphone hole is disposed.
- a first hole (eg, the first hole 622A of FIG. 10 ) formed in (eg, the second printed circuit board 622 of FIG. 10 ), the first hole formed in the second printed circuit board spaced apart from the first hole 2 holes (eg, the second hole 622B in FIG. 10) and a first pipe connecting the first hole and the second hole (eg, the first pipe 811 in FIG. 10) may be included.
- the external hole may be connected to the first conduit.
- the first conduit includes the first printed circuit board, the second printed circuit board, and an interposer (eg, the interposer of FIG. 10 ) disposed between the first printed circuit board and the second printed circuit board. 820)) formed in the mounting space (eg, the mounting space 1000 of FIG. 10 ).
- an interposer eg, the interposer of FIG. 10
- a second conduit (eg, the second conduit 643 of FIG. 10 ) formed on the rear member to connect the external hole may be further included.
- the rear member may include a camera housing (eg, the camera housing 640 of FIG. 6 ) disposed to cover a camera module included in the electronic device.
- a camera housing eg, the camera housing 640 of FIG. 6
- the second conduit may be formed in a body portion (eg, the body portion 641 of FIG. 6 ) of the camera housing, and the external hole is coupled to the body portion of the camera housing and is at least partially transparent. It may be formed on a window member (eg, the window member 642 of FIG. 6 ) formed of a material.
- the second conduit may be formed in the body of the camera housing, and the external hole is between the body of the camera housing and a window member coupled to the body and at least partially formed of a transparent material. It may be a separation space.
- a third conduit (eg, the third conduit 631 of FIG. 10 ) connecting the second conduit and the second hole may be further included.
- the third conduit may include a sealing structure in which one end is in contact with the first surface of the second printed circuit board and the other end is in contact with one surface of the rear member.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Acoustics & Sound (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Telephone Set Structure (AREA)
Abstract
Selon divers modes de réalisation décrits dans le présent document, un dispositif électronique peut comprendre : une première carte de circuit imprimé ; une seconde carte de circuit imprimé disposée de manière à être espacée de la première carte de circuit imprimé dans une première direction ; un module de microphone disposé sur une première surface de la seconde carte de circuit imprimé qui fait face à la première direction ; un premier trou formé dans la seconde carte de circuit imprimé dans un emplacement faisant face à un trou de microphone du module de microphone ; un premier conduit situé entre la première carte de circuit imprimé et la seconde carte de circuit imprimé, et dont au moins une partie est reliée au premier trou ; et un trou externe relié au premier conduit et formé de façon à communiquer avec l'extérieur du dispositif électronique. Divers autres modes de réalisation sont possibles.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020210024547A KR20220120854A (ko) | 2021-02-24 | 2021-02-24 | 마이크 모듈을 포함하는 전자 장치 및 전자 장치의 마이크 관로 구조 |
KR10-2021-0024547 | 2021-02-24 |
Publications (1)
Publication Number | Publication Date |
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WO2022182004A1 true WO2022182004A1 (fr) | 2022-09-01 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/KR2022/001324 WO2022182004A1 (fr) | 2021-02-24 | 2022-01-25 | Dispositif électronique comprenant un module de microphone et structure de conduit de microphone de dispositif électronique |
Country Status (2)
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KR (1) | KR20220120854A (fr) |
WO (1) | WO2022182004A1 (fr) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011055300A (ja) * | 2009-09-02 | 2011-03-17 | Fujitsu Ltd | 携帯端末装置 |
JP2011120021A (ja) * | 2009-12-03 | 2011-06-16 | Funai Electric Co Ltd | マイクロホンユニットおよび携帯機器 |
KR20190022094A (ko) * | 2017-08-25 | 2019-03-06 | 삼성전자주식회사 | 전자 부품 및 이어폰 잭 어셈블리를 포함하는 전자 장치 |
US20190324496A1 (en) * | 2019-06-28 | 2019-10-24 | Intel Corporation | Methods and apparatus to implement microphones in thin form factor electronic devices |
KR20210017097A (ko) * | 2019-08-06 | 2021-02-17 | 삼성전자주식회사 | Fpcb 구조체를 포함하는 전자 장치 |
-
2021
- 2021-02-24 KR KR1020210024547A patent/KR20220120854A/ko unknown
-
2022
- 2022-01-25 WO PCT/KR2022/001324 patent/WO2022182004A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011055300A (ja) * | 2009-09-02 | 2011-03-17 | Fujitsu Ltd | 携帯端末装置 |
JP2011120021A (ja) * | 2009-12-03 | 2011-06-16 | Funai Electric Co Ltd | マイクロホンユニットおよび携帯機器 |
KR20190022094A (ko) * | 2017-08-25 | 2019-03-06 | 삼성전자주식회사 | 전자 부품 및 이어폰 잭 어셈블리를 포함하는 전자 장치 |
US20190324496A1 (en) * | 2019-06-28 | 2019-10-24 | Intel Corporation | Methods and apparatus to implement microphones in thin form factor electronic devices |
KR20210017097A (ko) * | 2019-08-06 | 2021-02-17 | 삼성전자주식회사 | Fpcb 구조체를 포함하는 전자 장치 |
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KR20220120854A (ko) | 2022-08-31 |
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