WO2023074449A1 - Feuille thermoconductrice - Google Patents

Feuille thermoconductrice Download PDF

Info

Publication number
WO2023074449A1
WO2023074449A1 PCT/JP2022/038641 JP2022038641W WO2023074449A1 WO 2023074449 A1 WO2023074449 A1 WO 2023074449A1 JP 2022038641 W JP2022038641 W JP 2022038641W WO 2023074449 A1 WO2023074449 A1 WO 2023074449A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive sheet
mass
parts
heat conductive
heat
Prior art date
Application number
PCT/JP2022/038641
Other languages
English (en)
Japanese (ja)
Inventor
政宏 齋藤
Original Assignee
北川工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北川工業株式会社 filed Critical 北川工業株式会社
Priority to CN202280061848.8A priority Critical patent/CN117940493A/zh
Publication of WO2023074449A1 publication Critical patent/WO2023074449A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Definitions

  • the present disclosure relates to a thermally conductive sheet made of an acrylic resin composition for heat dissipation material and having excellent thermal conductivity, moldability, flexibility, and insulation.
  • thermally conductive material in which a thermally conductive filler such as silicon carbide or alumina (aluminum oxide) is added to a flexible resin.
  • a thermally conductive sheet formed by molding this type of thermally conductive material into a sheet is used by placing it between a heating element such as an electric/electronic component and a radiator such as a heat sink or a housing panel. .
  • the heat conductive sheet is arranged in this way, the heat generated by the heating element can be efficiently released to the radiator side.
  • the thermally conductive sheet is required to have electrical insulation to prevent conduction between the heating element and the radiator when the sheet is arranged.
  • there is a demand for flexibility and the like that can increase the contact area by deforming the sheet in accordance with the surface shapes of the heating element and the radiator.
  • silicone-based resins have been widely used as flexible resins.
  • silicone-based resins have problems such as insufficient flexibility, high cost of resin materials, long curing times, and potential contact failures due to generation of low-molecular-weight siloxane. rice field.
  • the applicant of the present application has proposed a thermally conductive material in which a thermally conductive filler is added to an acrylic resin obtained by polymerizing a monomer containing an acrylic acid ester.
  • Silicon carbide which has been commonly used as a thermally conductive filler, has very good thermal conductivity but poor insulation. Therefore, a thermally conductive material in which a large amount of silicon carbide is mixed with an acrylic resin has a problem that although the thermal conductivity is improved, the insulation is deteriorated.
  • Alumina which has been generally used as another thermally conductive filler, has relatively good thermal conductivity and excellent insulating properties, although it is inferior to silicon carbide.
  • a thermally conductive material in which a large amount of alumina is mixed with an acrylic resin has a problem of insufficient viscosity and inferior moldability. Accordingly, the present disclosure provides a thermally conductive sheet of an acrylic resin that is excellent in thermal conductivity, flexibility, insulation, and moldability into a sheet shape.
  • One aspect of the present disclosure is a thermally conductive sheet obtained by blending silicon carbide, soft ferrite, and a plasticizer with an acrylic resin composed of 20 to 35 mass% acrylic monomer and 65 to 80 mass% acrylic polymer.
  • the heat conductive sheet is composed of 100 parts by mass of the acrylic resin and 230 to 250 parts by mass of the silicon carbide, 10 to 20 parts by mass of the soft ferrite, and 40 to 55 parts by mass of the plasticizer.
  • the cured sheet has a thermal conductivity of 2 W/m ⁇ K or more, an Asker C hardness of 2 to 10, and a volume resistivity of 10 10 ⁇ cm or more.
  • one aspect of the present disclosure may further include the following configuration or characteristics.
  • the soft ferrite may be, for example, Ni--Zn ferrite powder having a median diameter of 20 to 40 ⁇ m measured with a laser diffraction device.
  • the silicon carbide may be powder having a median diameter of 60 to 80 ⁇ m as measured by a measuring device such as a laser diffraction device, and the plasticizer may be trimellitic acid alkyl ester.
  • the rotor No. 7 Viscosity measured by a viscometer such as a Brookfield viscometer under conditions of 2 revolutions/minute and 25° C. may be 100 to 200 Pa ⁇ s.
  • the applicant of the present application has achieved thermal conductivity of 2 W/m ⁇ K or more and volume resistivity of 10 10 ⁇ cm or more by blending soft ferrite into a heat conductive material made of acrylic resin blended with silicon carbide. It has been found that a flexible thermally conductive sheet having an Asker C hardness of 2 to 10 can be easily molded.
  • a thermally conductive sheet can be manufactured in a short time by applying a thermally conductive material using a coater or the like, molding it into a sheet, and curing it.
  • a thermally conductive material such as silicone carbide, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate, polymethyl methacrylate
  • a thermally conductive sheet (or a thermally conductive material) according to one aspect of the present disclosure contains a conventionally known acrylic resin, silicon carbide, soft ferrite, and a plasticizer as essential components.
  • the acrylic resin of the present disclosure is obtained by radical (co)polymerization of a conventionally known acrylic monomer (acrylic monomer) and an acrylic polymer (acrylic polymer).
  • acrylic resin in the present disclosure various materials can be used as long as they contain an acrylic acid ester.
  • the acrylic resin in the present disclosure is obtained by (co)polymerizing an acrylic monomer and an acrylic polymer obtained by polymerizing the acrylic monomer by a known polymerization method. Further, the acrylic monomer and the acrylic polymer in the acrylic resin are preferably contained at a ratio of 20 to 35 mass% and 65 to 80 mass%, respectively, more preferably 25 to 30 mass% respectively. %, 70 to 75 mass%.
  • Silicon carbide in the present disclosure is a thermally conductive filler that is blended to enhance the thermal conductivity of the thermally conductive sheet.
  • Silicon carbide alone is a substance having a thermal conductivity of 200 W/m ⁇ K or higher.
  • silicon carbide is a semiconductor (for example, volume resistivity; about 108 ⁇ cm), and is also a substance having high hardness (for example, Vickers hardness; 23.0 GPa). Therefore, if the amount of silicon carbide blended with respect to the acrylic resin is too large, the insulating properties and flexibility of the thermally conductive sheet may become unsuitable as a thermally conductive sheet.
  • the silicon carbide used in the present disclosure is a conventionally known powder for grinding abrasives, and has a median diameter (D50) of 60 to 80 ⁇ m, more preferably 65 to 75 ⁇ m, as measured by a laser diffractometer.
  • D50 median diameter
  • the thermally conductive sheet of the present disclosure has a thermal conductivity of 2 W/m ⁇ K or more and a thickness of a certain value (e.g., 2 mm or more) and can be formed into a sheet shape. can have viscosity.
  • the median diameter of silicon carbide is smaller than the above range, paths with high thermal conductivity cannot be formed in the thermally conductive sheet of the present disclosure, and thermal conductivity of 2 W/m ⁇ K or more may not be achieved.
  • the median diameter of silicon carbide is larger than the above range, there is a risk of clogging in a coater or the like during coating of the heat conductive material, and a risk of being unable to remove voids (holes) generated during sheet molding. be.
  • Soft ferrite has magnetism, and is generally used to impart magnetism to compounded materials.
  • the soft ferrite in the present disclosure is a filler that is added in a small amount to adjust the thermal conductivity, insulation, and flexibility of the thermal conductive sheet, and the viscosity of the thermal conductive material before molding and curing into the thermal conductive sheet. Yes, it is different from materials that are blended in large amounts with the intention of imparting magnetism to the heat conductive sheet.
  • the soft ferrite used in the present disclosure is a Ni—Zn soft magnetic ferrite powder, and has a median diameter (D50) of 20 to 40 ⁇ m, more preferably 25 to 35 ⁇ m, as measured by a laser diffraction device.
  • D50 median diameter
  • the thermally conductive material of the present disclosure has appropriate thermal conductivity, insulating properties, and viscosity, and can be easily formed into a sheet. If the median diameter of the soft ferrite is smaller than the above range, the viscosity of the thermally conductive material cannot be sufficiently increased, and the insufficient viscosity may prevent the thermally conductive material from being formed into a sheet.
  • the median diameter of the soft ferrite is larger than the above range, a conductive path is easily formed in the heat conductive sheet of the present disclosure, and a certain level or more of insulation (for example, volume resistivity; 1010 ⁇ cm or more). There is a risk that it will disappear.
  • the plasticizer used in the present disclosure is a non-radical polymerizable trimellitate alkyl ester that does not radically polymerize with acrylic monomers or acrylic polymers.
  • the plasticizer affects the viscosity of the thermally conductive material and the moldability and flexibility (or hardness) of the thermally conductive sheet.
  • the thermally conductive material or thermally conductive sheet of the present disclosure may contain a polymerization initiator and an antioxidant.
  • the polymerization initiator affects the reaction speed of the thermally conductive material and can improve the productivity of the thermally conductive sheet.
  • the antioxidant can suppress the oxidation of the heat conductive material in the air and adjust the usable time (pot life) of the heat conductive material.
  • the thermally conductive material or thermally conductive sheet of the present disclosure may contain conventionally known additives to the extent that they do not contradict the purpose of the present disclosure.
  • Additives include, for example, polyfunctional fillers, reinforcing fibers, release agents, antifoaming agents, dispersants, organic flame retardants, metal hydroxide inorganic flame retardants, coupling agents, pigments, and antistatic agents. etc.
  • a heat conductive material was obtained using a conventionally known kneader for the materials used in the present disclosure.
  • kneaders include continuous kneaders such as mixers, roll mills, Banbury mixers, kneaders, pressure kneaders, and twin-screw kneaders, but these devices are not particularly limited. Also, if necessary, it is possible to depressurize or deaerate the materials during kneading.
  • a thermally conductive material prepared by kneading various materials used in the present disclosure with a kneader was coated on a PET film to a predetermined thickness using a conventionally known coater or the like, and formed into a sheet. After that, the sheet-shaped thermally conductive material was heat-cured in a heating furnace at a predetermined temperature for a predetermined period of time to obtain a thermally conductive sheet.
  • the heat conductive material in a state before being molded and cured into a sheet by a coater device or the like is subjected to a Brookfield viscometer (B type rotational viscometer), the rotor No. 7. Viscosity was measured at a rotation speed of 2 rpm.
  • the viscosity of the heat conductive material before molding is preferably 100 to 200 Pa ⁇ s.
  • the thermally conductive material of the present disclosure can be easily formed into a sheet shape using a coater or the like and the shape can be easily maintained. If the viscosity is lower than the above range, the fluidity is high, making it difficult to maintain the shape of the sheet and to form a thick sheet. If the viscosity is higher than the above range, the fluidity is low, and coating with a coater or the like and removal of voids (holes) mixed in the inside of the sheet become difficult.
  • the heat conductive sheet of the present disclosure preferably has an Asker C hardness value of 2 or more and 10 or less. The lower the hardness value, the higher the flexibility.
  • the thermal conductive sheet deforms according to the shape of the surface, increasing the contact area (heat conduction efficiency can be increased).
  • the heat conductive sheet of the present disclosure deforms according to the shape of the heat generating element or the heat dissipating body even if the surface of the heat generating element or the heat dissipating body has an uneven shape, and secures a sufficient contact area. be able to. If the value of the Asker C hardness is higher than the above range, a sufficient contact area with the heat conductive sheet cannot be ensured depending on the surface shape of the heating element or radiator, making it difficult to achieve the expected heat conduction efficiency. . When the value of Asker C hardness is lower than the above range, although the flexibility is high, the durability of the heat conductive sheet is low and it is likely to be torn.
  • thermal conductivity of sheet The thermal conductivity of the molded and cured thermal conductive sheet was measured at a temperature of 25° C. using a rapid thermal conductivity meter (manufactured by Kyoto Electronics Industry Co., Ltd.; product number “QTM-500”).
  • the thermally conductive sheet of the present disclosure preferably has a thermal conductivity of 2 W/m ⁇ K or more. In the thermally conductive sheet, the higher the thermal conductivity, the better. However, if the thermal conductivity is lower than the above range, the heat cannot be sufficiently conducted from the heating element to the radiator, resulting in problems such as thermal runaway. There is fear.
  • the volume resistivity of the molded and cured heat conductive sheet is measured using a resistivity meter (manufactured by Mitsubishi Chemical Corporation; product number "MCP-HT450”) in accordance with the JIS K6911 standard at a temperature of 25 ° C. I made a measurement.
  • the thermally conductive sheet of the present disclosure preferably has a volume resistivity of 10 10 ⁇ cm or more. The higher the volume resistivity, the higher the insulation, and when the thermal conductive sheet is placed between the heating element and the radiator, it makes it difficult for the current generated from either the heating element or the radiator to be transmitted to the other ( conduction can be suppressed). In the heat conductive sheet of the present disclosure, the higher the volume resistivity, the better. There is a possibility that troubles such as damage or malfunction of the device may occur due to transmission to the inside (heating element side) of a certain electronic/electric device.
  • Tables 1 to 6 show composition ratios and characteristic evaluation results of Examples and Comparative Examples described later.
  • the unit of formulation in Tables 1 to 6 is "parts by mass” unless otherwise specified.
  • thermal conductivity evaluation in Tables 1 to 6, it has a thermal conductivity (about 0.2 W / m K) that is 10 times higher than the acrylic resin that does not contain any filler, and the heating element A configuration of 2 W/m ⁇ K or more capable of appropriately releasing heat from the heat sink to the radiator side was rated as “ ⁇ ”, and a configuration of less than 2 W/m ⁇ K was rated as “x”.
  • volume resistivity evaluation a configuration with a standard of 1010 ⁇ cm or more, which is generally referred to as antistatic (electrostatic) prevention, is " ⁇ ", and a configuration with less than 1010 ⁇ cm is "x "
  • Example 10 to 18 and Comparative Examples 11 to 18 220 to 260 parts by mass of silicon carbide, 10 to 25 parts by mass of soft ferrite, and 45 parts by mass of a plasticizer are added to 100 parts by mass of an acrylic resin to form a thermal conductive material using a kneader, which is molded and cured by a coater or the like. Then, a heat conductive sheet was obtained. These formulations and evaluation results are shown in Table 2.
  • Example 19-27 and Comparative Examples 19-26 Add 220 to 260 parts by mass of silicon carbide, 10 to 25 parts by mass of soft ferrite, and 50 parts by mass of a plasticizer to 100 parts by mass of acrylic resin, use a kneader to make a thermal conductive material, and mold and cure with a coater or the like. Then, a heat conductive sheet was obtained. These formulations and evaluation results are shown in Table 3.
  • Example 28-36 and Comparative Examples 27-34 220 to 260 parts by mass of silicon carbide, 10 to 25 parts by mass of soft ferrite, and 55 parts by mass of a plasticizer are added to 100 parts by mass of an acrylic resin to form a thermal conductive material using a kneader, followed by molding and curing using a coater or the like. Then, a heat conductive sheet was obtained. These formulations and evaluation results are shown in Table 4.
  • the compounding amount of silicon carbide is 220 in the compounding of the present disclosure.
  • the thermal conductivity of the thermally conductive sheet was less than 2 W/m ⁇ K. was found to be less than 2 W/m ⁇ K.
  • the compounding amount of silicon carbide compounded in the heat conductive sheet of the present disclosure is 230 to 250 parts by mass. have understood.
  • the thermal conductivity of the thermally conductive sheet is less than 2 W/m ⁇ K even though the amount of silicon carbide compounded is 230 parts by mass. This is presumably because when a large amount of plasticizer is blended, the filler in the thermally conductive sheet becomes unevenly distributed (precipitates according to gravity), making it impossible to form an efficient thermal conduction path.
  • the present disclosure is a heat conductive material that is obtained by blending 230 to 250 parts by mass of silicon carbide, 10 to 20 parts by mass of soft ferrite, and 40 to 55 parts by mass of a plasticizer with respect to 100 parts by mass of acrylic resin. It was found that the conductive sheet is excellent in flexibility, thermal conductivity and insulation.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une feuille thermoconductrice. La feuille thermoconductrice est préparée par mélange d'une résine acrylique composée de 20 à 35 % en masse d'un monomère acrylique et de 65 à 80 % en masse d'un polymère acrylique avec du carbure de silicium, de la ferrite molle et un agent plastifiant. La feuille thermoconductrice comprend de 230 à 250 parties en masse du carbure de silicium, de 10 à 20 parties en masse de la ferrite molle et de 40 à 55 parties en masse de l'agent plastifiant qui sont mélangées avec 100 parties en masse de la résine acrylique. Après durcissement de la feuille thermoconductrice, un produit durci a une conductivité thermique de 2 W/m·K ou plus, une dureté Asker C de 2 à 10 et une résistivité volumique de 1010 Ω·cm ou plus.
PCT/JP2022/038641 2021-10-28 2022-10-17 Feuille thermoconductrice WO2023074449A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280061848.8A CN117940493A (zh) 2021-10-28 2022-10-17 热传导片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021176680A JP2023066138A (ja) 2021-10-28 2021-10-28 熱伝導シート
JP2021-176680 2021-10-28

Publications (1)

Publication Number Publication Date
WO2023074449A1 true WO2023074449A1 (fr) 2023-05-04

Family

ID=86157786

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/038641 WO2023074449A1 (fr) 2021-10-28 2022-10-17 Feuille thermoconductrice

Country Status (3)

Country Link
JP (1) JP2023066138A (fr)
CN (1) CN117940493A (fr)
WO (1) WO2023074449A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080107195A (ko) * 2007-06-05 2008-12-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
JP2011184557A (ja) * 2010-03-08 2011-09-22 Kaneka Corp 熱伝導材料
JP2015124332A (ja) * 2013-12-27 2015-07-06 北川工業株式会社 熱伝導シート
WO2016068240A1 (fr) * 2014-10-31 2016-05-06 北川工業株式会社 Matériau thermo-conducteur
CN106046770A (zh) * 2016-07-12 2016-10-26 蚌埠高华电子股份有限公司 一种能吸波的led灯用尼龙导热复合材料及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080107195A (ko) * 2007-06-05 2008-12-10 주식회사 엘지화학 전자파 저감용 조성물 및 이를 포함하는 시트
JP2011184557A (ja) * 2010-03-08 2011-09-22 Kaneka Corp 熱伝導材料
JP2015124332A (ja) * 2013-12-27 2015-07-06 北川工業株式会社 熱伝導シート
WO2016068240A1 (fr) * 2014-10-31 2016-05-06 北川工業株式会社 Matériau thermo-conducteur
CN106046770A (zh) * 2016-07-12 2016-10-26 蚌埠高华电子股份有限公司 一种能吸波的led灯用尼龙导热复合材料及其制备方法

Also Published As

Publication number Publication date
CN117940493A (zh) 2024-04-26
JP2023066138A (ja) 2023-05-15

Similar Documents

Publication Publication Date Title
JP7389014B2 (ja) 絶縁放熱シート
JP5105740B2 (ja) 表面改質コランダム及び樹脂組成物
JP2004315663A (ja) アクリル系熱伝導性組成物及び熱伝導性シート
JP2011127053A (ja) 樹脂シート及び積層体
JP2012064691A (ja) 熱拡散シート
CN109844048B (zh) 导热性复合硅橡胶片及其制造方法
WO2015190270A1 (fr) Feuille thermoconductrice
CN113677717A (zh) 共聚物、分散剂、及树脂组合物
JP2008189814A (ja) 熱伝導性フィラーとその製造方法ならびに樹脂成形品製造方法
JP5048974B2 (ja) 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート
JP2010001402A (ja) 高熱伝導性樹脂成形体
TW201816072A (zh) 熱傳導性樹脂成形品
WO2012039324A1 (fr) Composition de résine thermoconductrice, feuille de résine, feuille métallique revêtue de résine, feuille de résine durcie et élément dissipateur de chaleur
JP6586606B2 (ja) 熱伝導材
JP7188070B2 (ja) 放熱絶縁シートおよび該シート硬化物を絶縁層とする積層構造体
WO2021044867A1 (fr) Composition de silicone thermoconductrice et matériau de silicone thermoconducteur
WO2023074449A1 (fr) Feuille thermoconductrice
JP2016169281A (ja) 複合フィラーおよびこれを含む樹脂組成物
JP2004161856A (ja) 熱伝導性樹脂成形体用組成物およびそれから得られる成形体
JP5480191B2 (ja) 熱伝導性ゴム組成物及びその製造方法
TW202307099A (zh) 熱傳導片材及熱傳導片材之製造方法
JP2009235146A (ja) アクリル系樹脂シート状成形体
TW202223064A (zh) 導熱性片材及導熱性片材之製造方法
JP2007291344A (ja) アクリル系樹脂組成物及びそれを用いたシート状成形体
JP2004331835A (ja) 放熱シート

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22886777

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202280061848.8

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE