WO2023066406A1 - 一种用于清洗晶圆的排列式兆声清洗装置 - Google Patents

一种用于清洗晶圆的排列式兆声清洗装置 Download PDF

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Publication number
WO2023066406A1
WO2023066406A1 PCT/CN2022/130779 CN2022130779W WO2023066406A1 WO 2023066406 A1 WO2023066406 A1 WO 2023066406A1 CN 2022130779 W CN2022130779 W CN 2022130779W WO 2023066406 A1 WO2023066406 A1 WO 2023066406A1
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Prior art keywords
cleaning
shaft
driving shaft
wafer
wafers
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PCT/CN2022/130779
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English (en)
French (fr)
Inventor
徐枭宇
杨渊思
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杭州众硅电子科技有限公司
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Publication of WO2023066406A1 publication Critical patent/WO2023066406A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, in particular to an array megasonic cleaning device for cleaning wafers.
  • each process unit is to remove the polishing liquid residue and other contamination particles on the wafer, including three process units: megasonic cleaning unit, brushing unit and drying unit.
  • the principle of megasonic cleaning is that a high-frequency oscillating current is emitted by a high-frequency AC power supply, which is converted into a mechanical vibration wave by a transducer and transmitted to the cleaning medium, thereby generating cavitation and acoustic flow in the liquid.
  • the combined force of the two phenomena removes the particles attached to the wafer surface.
  • Megasonic cleaning has less damage to the surface and can remove particles below 0.2 ⁇ m.
  • the present invention provides an arrayed megasonic cleaning device for cleaning wafers that can clean multiple wafers at the same time, meet higher wafer output rates, and ensure uniformity and consistency of cleaning. .
  • an arrayed megasonic cleaning device for cleaning wafers comprising:
  • the first driving shaft and the second driving shaft are arranged in parallel in the cleaning tank, and can rotate around their own centerlines in a circumferential direction driven by the driving unit;
  • the length of the first driving shaft and the second driving shaft is 60-350mm;
  • the first drive shaft is provided with at least two first slots along the length direction
  • the second drive shaft is provided with at least two second slots along the length direction, and the second slots are connected with the first slots.
  • the plurality of wafers are respectively placed through the cooperation of the first card slot and the second card slot, and the first driving shaft and the second driving shaft are configured to be respectively located on both sides of the central axis of the wafer;
  • the first driving shaft and the second driving shaft rotate in the same direction, and can frictionally drive multiple wafers to rotate simultaneously to realize cleaning.
  • a driven shaft which is provided with at least two limiting grooves, the limiting grooves are located in the same vertical plane as the first locking groove and the second locking groove, and the edge part of the wafer falls into the limiting groove Inside.
  • Multiple wafers can be placed in the cleaning tank of the present invention for simultaneous cleaning.
  • the occupied area of the cleaning tank is minimized to ensure the consistency of the wafer cleaning effect; cleaning multiple wafers When it is round, it can save the amount of cleaning solution in the cleaning tank and reduce the cost; for the transfer of wafers, it can support a group of manipulators to pick and place multiple wafers at the same time, making the transfer more convenient.
  • the driven shaft is configured to be located below the wafer and deviated from the central axis of the wafer.
  • the distance between the megasonic cleaning device and the wafer 5 is relatively short, and the cleaning effect is better.
  • a gap is formed between the inner wall of the limiting groove and the wafer. Reduce the frictional resistance of the wafer rotation, and the limit groove can limit the excessive shaking of the wafer.
  • the side of the limiting groove is in contact with the wafer to drive the driven shaft to rotate, and the driven shaft is externally connected with a rotational speed detection unit to monitor the rotational speed of the wafer, and there is a gap between the bottom surface of the limiting groove and the wafer .
  • the wafer drives the driven shaft to rotate synchronously through the limiting groove, which is convenient for monitoring the rotation speed of the wafer; the bottom surface of the limiting groove is not in contact with the wafer, which reduces the machining accuracy and facilitates processing.
  • one end of the first driving shaft and/or the second driving shaft is connected to the side wall of the cleaning tank, and the other end is connected to the driving unit; or, one end of the first driving shaft and/or the second driving shaft It is suspended in the cleaning tank, and the other end is connected with the drive unit.
  • the driven shaft includes a first shaft body and a second shaft body, the first shaft body and the second shaft body are coaxially arranged, and the adjacent ends of the two are suspended.
  • first drive shaft and/or the second drive shaft include a left shaft body and a right side shaft body, the left shaft body and the right side shaft body are arranged coaxially, and are respectively driven to rotate by the drive unit.
  • the left shaft body of the first driving shaft and the left shaft body of the second driving shaft can cooperate to drive a batch of wafers to rotate and clean, and the left shaft body of the second driving shaft and the right shaft body of the second driving shaft It can be used to drive another batch of wafers to rotate and clean.
  • the rotation of the two batches of wafers is relatively independent, and the rotation speed can be different, so as to achieve the purpose of having two different cleaning rhythms in one cleaning tank.
  • the cleaning forms are more diverse and the use is more convenient. flexible.
  • the beneficial effect of the present invention is that multiple wafers can be placed in the cleaning tank for simultaneous cleaning, and on the premise of ensuring the same cleaning efficiency, the occupied area of the cleaning tank is minimized to ensure the consistency of the wafer cleaning effect; Satisfy the requirement of higher wafer output rate; the wafer rotates in the cleaning tank, which solves the problem of poor cleaning uniformity and consistency; when cleaning multiple wafers, it can save the amount of cleaning liquid in the cleaning tank and reduce the cost ; For the transfer of wafers, it can support a group of manipulators to pick and place multiple wafers at the same time, making the transfer more convenient.
  • Fig. 1 is a perspective view of an arrayed megasonic cleaning device provided by Embodiment 1 of the present invention.
  • Fig. 2 is a top view of the arrayed megasonic cleaning device provided by Embodiment 1 of the present invention.
  • Fig. 3 is a transverse cross-sectional view of the arrayed megasonic cleaning device provided by Embodiment 1 of the present invention.
  • Fig. 4 is a longitudinal sectional view of the arrayed megasonic cleaning device provided by Embodiment 1 of the present invention.
  • Fig. 5 is a perspective view of the arrayed megasonic cleaning device provided by Embodiment 1 of the present invention, except for the cleaning tank.
  • Fig. 6 is a top view of the arrayed megasonic cleaning device provided by Embodiment 2 of the present invention.
  • Fig. 7 is a transverse cross-sectional view of the arrayed megasonic cleaning device provided by Embodiment 2 of the present invention.
  • Fig. 8 is a perspective view of the row-type megasonic cleaning device provided by Embodiment 2 of the present invention, except for the cleaning tank.
  • An arrayed megasonic cleaning device for cleaning wafers comprising:
  • the cleaning tank 3 has a cleaning liquid inside and a megasound generating device 31 at the bottom;
  • the first drive shaft 1 is arranged in the cleaning tank 3 and can rotate around the center line of the first drive shaft 1 itself under the drive of the drive unit 4; its axial length is 60-350 mm;
  • the second drive shaft 2 is arranged in the cleaning tank 3 in parallel with the first drive shaft 1, and can rotate around the center line of the second drive shaft 2 itself under the drive of the drive unit.
  • the drive unit here can Share one with the drive unit of the first drive shaft 1, or it can be different; its axial length is 60-350mm;
  • the first drive shaft 1 is provided with at least two first slots 11 along its length direction;
  • the second driving shaft 2 is provided with at least two second card slots 21 along its length direction, and the second card slots 21 are set corresponding to the first card slots 11, and the correspondence here refers to the first card slots 11 and the first card slots 11.
  • the number of the second card slot 21 is corresponding, and the position is also corresponding, specifically referring to that the projection of the first card slot 11 on the side wall of the cleaning tank 3 overlaps with the projection of the second card slot 21 on the side wall of the cleaning tank 3, or overlap at least partially.
  • each wafer 5 is respectively placed through the cooperation of the first card slot 11 and the second card slot 21, and the first drive shaft 1 and the second drive shaft 2 are configured to be respectively located on the sides of the wafer 5.
  • Both sides of the central axis, that is, each wafer 5 is respectively placed on a corresponding set of first slots 11 and second slots 21, and the side walls of the wafer 5 and the first slots 11 and second slots 21 contact with the bottom wall.
  • the first driving shaft 1 and the second driving shaft 2 rotate in the same direction, and can drive the wafer 5 to rotate simultaneously under the action of friction, thereby realizing the rotary cleaning of the wafer 5 .
  • the driven shaft 6 may also be included, which is provided with at least two limiting grooves 63 , and the limiting grooves 63 are located in the same vertical plane as the first locking groove 11 and the second locking groove 21 . More specifically, the limiting slots 63 correspond to the number and position of the first locking slot 11 and the second locking slot 21 . The edge portion of the wafer 5 falls into the limiting groove 63 .
  • the driven shaft 6 is configured to be located below the wafer 5 and deviated from the central axis of the wafer 5 . Therefore, the distance between the megasonic cleaning device 31 and the wafer 5 is relatively short, and the cleaning effect is better.
  • a gap is formed between the inner wall of the limiting groove 63 and the wafer 5. At this time, there is a gap between the bottom wall of the limiting groove 63 and the side wall of the wafer 5, and there is a gap between the side wall of the limiting groove 63 and the surface of the wafer 5. There are also gaps.
  • the side surface of the limiting groove 63 is in contact with the surface of the wafer 5 , thereby driving the driven shaft 6 to rotate under the action of friction, but there is a gap between the bottom surface of the limiting groove 63 and the wafer 5 .
  • the driven shaft 6 is externally connected to the rotational speed detection unit 64 , and since the driven shaft 6 is rotated synchronously by the wafer 5 , the rotational speed of the wafer 5 can be indirectly monitored by monitoring the rotational speed of the driven shaft 6 .
  • the first drive shaft 1 and the second drive shaft 2 are powered by the same drive unit 4, in other words, the first drive shaft 1 and the second drive shaft
  • the rotation speeds of the two driving shafts 2 are the same.
  • the connection mode between the first drive shaft 1 and the second drive shaft 2 and the drive unit 4 may be motor direct drive, belt drive, etc., and is not specifically limited.
  • first drive shaft 1 is connected to the side wall of the cleaning tank 3 in rotation, and the other end is connected to the drive unit 4.
  • the second drive shaft 2 is arranged in parallel with the first drive shaft 1, and one end is connected to the side wall of the cleaning tank 3 in rotation. , the other end of which is connected to the drive unit 4 .
  • Both ends of the driven shaft 6 are connected to the side wall of the cleaning tank 3 .
  • the above structure can also be replaced with one end of the first driving shaft 1 connected to the drive unit 4, and the other end is not connected to the side wall of the cleaning tank 3 in rotation, but is suspended in the cleaning tank 3; the second One end of the drive shaft 2 is connected to the drive unit 4, and the other end is not connected to the side wall of the cleaning tank 3 in rotation, but is suspended in the cleaning tank 3; one end of the driven shaft 6 is connected to the side wall of the cleaning tank 3, and the other end is connected to the side wall of the cleaning tank 3 One end is suspended in the cleaning tank 3 .
  • one end of the first driving shaft 1 is connected to the driving unit 4, and the other end is suspended in the cleaning tank 3, and one end of the first driving shaft 1 is connected to the driving unit 4.
  • One end of the second driving shaft 2 is connected to the drive unit 4, the other end is connected to the side wall of the cleaning tank 3 in rotation, and one end of the second driving shaft 2 is connected to the drive unit 4 , the other end is suspended in the cleaning tank 3, one end of the driven shaft 6 is connected to the side wall of the cleaning tank 3, and the other end is suspended in the cleaning tank 3, and the two ends of the driven shaft 6 are connected to the side wall of the cleaning tank 3.
  • the walls are connected, the first driving shaft 1 and the second driving shaft 2 are driven by the same driving unit 4, the first driving shaft 1 and the second driving shaft 2 are driven by different driving units 4, and the driven shaft 6 is not provided, these nine Features can be freely combined without limitation.
  • the three wafers 5 are respectively clamped between the three first slots 11 on the first drive shaft 1 and the three second slots 21 on the second drive shaft 2, between the first drive shaft 1 and the second drive shaft 2. When the driving shaft 2 rotates in the same direction, the three wafers 5 rotate at the same time, and they are cleaned while rotating.
  • the driven shaft 6 is located below the wafer 5 , between the first driving shaft 1 and the second driving shaft 2 , and deviates from the central axis of the wafer 5 .
  • the driven shaft 6 can make the distance between the first driving shaft 1 and the second driving shaft 2 the largest, under the premise of ensuring the stability of wafer 5, the bottom of cleaning tank 3
  • the distance between the megasonic cleaning device 31 and the wafer 5 is relatively the shortest, and the cleaning effect is better.
  • each chemical liquid in the cleaning liquid in each cleaning tank 3 needs to have a complex closed-loop flow control to ensure that the cleaning liquid has an accurate ratio, and the same cleaning tank 3 can clean more
  • Each wafer 5 can ensure that each wafer 5 is in the same proportion of cleaning solution, ensuring cleaning consistency and reducing the cost of solution preparation.
  • a cleaning tank 3 places a plurality of wafers 5 and a plurality of cleaning tanks, and each tank puts a wafer, and the total volume of the cleaning solution is less; a cleaning tank 3 places a plurality of wafers 5 for each wafer
  • the pitch of 5 is small, which can support a group of manipulators to pick and place multiple wafers 5 at the same time.
  • the difference between this embodiment and Embodiment 1 is that the first drive shaft 1 includes a left shaft body 12 and a right shaft body 13 arranged coaxially, and the adjacent ends of the two Set in the air, the second drive shaft 2 includes a left shaft 22 and a right shaft 23 arranged coaxially, one end adjacent to the two is suspended, the left shaft 12 of the first drive shaft 1 and the second drive shaft 1
  • the left shaft body 22 of 2 is driven to rotate synchronously by the same driving unit 4
  • the right shaft body 13 of the first driving shaft 1 and the right shaft body 23 of the second driving shaft 2 are driven to rotate synchronously by another driving unit 4 .
  • the rotation speeds of the left shaft body 12 and the right shaft body 13 of the first driving shaft 1 may be different, and the rotation speeds of the left shaft body 22 and the right shaft body 23 of the second driving shaft 2 may be different.
  • the driven shaft 6 includes a first shaft body 61 and a second shaft body 62 arranged coaxially, and adjacent ends of the first shaft body 61 and the second shaft body 62 are suspended.
  • a batch of wafers 5 can be placed between the first slot 11 of the left shaft body 12 of the first driving shaft 1 and the second slot 21 of the left side shaft body 22 of the second driving shaft 2, while cooperating with the first
  • the limiting groove 63 on the shaft body 61 is used for rotation cleaning.
  • Another batch of wafers 5 can be placed between the first slot 11 of the right shaft body 13 of the first driving shaft 1 and the second slot 21 of the right shaft body 23 of the second driving shaft 2, and at the same time cooperate with the first The limit groove 63 on the two shafts 62 is rotated and cleaned.
  • the two batches of wafers 5 can be driven and rotated by different drive units 4 for cleaning, and the speed of rotation and cleaning can be different, forming a relatively independent cleaning rhythm and adapting to different cleaning requirements.
  • first driving shaft 1 is divided into a left shaft body 12 and a right shaft body 13
  • second driving shaft 2 is divided into a left shaft body 22 and a right shaft body 23
  • the driven shaft 6 is divided into a first shaft body 61 and the second shaft body 62

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cleaning Or Drying Semiconductors (AREA)
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Abstract

一种用于清洗晶圆（5）的排列式兆声清洗装置，包括：清洗槽（3）；第一主动轴（1）和第二主动轴（2），平行设于清洗槽（3）内，且在驱动单元（4）的驱动下可绕其自身中心线周向旋转，其轴向长度为60-350mm；第一主动轴（1）上沿长度方向设有至少两个第一卡槽（11），第二主动轴（2）上沿长度方向设有至少两个第二卡槽（21），第二卡槽（21）与第一卡槽（11）对应设置；多片晶圆（5）分别通过第一卡槽（11）和第二卡槽（21）的配合实现放置；第一主动轴（1）和第二主动轴（2）沿相同方向转动，可摩擦驱动多片晶圆（5）同时转动，以实现清洗。通过该设置，清洗槽（3）中可以放置多片晶圆（5）进行同时清洗，在确保同等清洗效率的前提下，最大程度减小了清洗槽（3）的占地面积，确保晶圆（5）清洗的效果一致性。

Description

一种用于清洗晶圆的排列式兆声清洗装置 技术领域
本发明属于半导体集成电路芯片制造技术领域，尤其是涉及一种用于清洗晶圆的排列式兆声清洗装置。
背景技术
清洗各工艺单元的功能是去除晶圆上的抛光液残留及其他玷污颗粒，包括三个工艺单元：兆声清洗单元、刷洗单元和干燥单元。其中兆声清洗的原理是由高频交流电源发出高频振荡电流，经换能器转变为机械振动波传入到清洗介质中，从而在液体中产生空化和声波流两种现象，在这两种现象的合力下将附着在晶圆表面的颗粒去除。兆声波清洗对表面损伤较小，可以清除0.2μm以下粒子。
目前存在问题：当前已知有将晶圆放置于清洗槽内，通过分隔板将多片晶圆分开，通过兆声波清洗CN206966220U。此方案中的晶圆在清洗槽中静止，清洗的均匀性和一致性较差。
目前对于化学机械平坦化设备单位时间的出片率要求越来越高，常规的单个槽单片兆声清洗模式的工作效率满足不了清洗需求。为了提高出片率，若放多个单片兆声清洗槽，兆声清洗占的空间太大且传输距离变长，传输效率下降，不能满足生产需求
发明内容
为了克服现有技术的不足，本发明提供一种可以同时清洗多片晶圆，满足更高的出片率，保证清洗的均匀性和一致性的用于清洗晶圆的排列式兆声清洗装置。
本发明解决其技术问题所采用的技术方案是：一种用于清洗晶圆的排列式兆声清洗装置，包括：
清洗槽，内部带有清洗液和兆声发生装置；
第一主动轴和第二主动轴，平行设于清洗槽内，且在驱动单元的驱动下可绕其自身中心线周向旋转；
所述第一主动轴和第二主动轴的长度为60-350mm；
所述第一主动轴上沿长度方向设有至少两个第一卡槽，所述第二主动轴上沿长度方向设有至少两个第二卡槽，该第二卡槽与第一卡槽对应设置；
多片晶圆分别通过第一卡槽和第二卡槽的配合实现放置，且所述第一主动轴和第二主动轴被构造为分别位于晶圆的中轴线的两侧；
第一主动轴和第二主动轴沿相同方向转动，可摩擦驱动多片晶圆同时转动，以实现清洗。
进一步的，还包括从动轴，其设有至少两个限位槽，该限位槽与第一卡槽、第二卡槽位于同一竖直平面内，晶圆的边缘部分落入限位槽内。
本发明的清洗槽中可以放置多片晶圆进行同时清洗，在确保同等清洗效率的前提下，最大程度减小了清洗槽的占地面积，确保晶圆清洗的效果一致性；清洗多片晶圆时，能节约清洗槽中清洗液的用量，降低成本；对于晶圆的转移，可以支持一组机械手同时取放多片晶圆，转移更方便。
进一步的，所述从动轴被构造为位于晶圆的下方，且偏离晶圆的 中轴线设置。兆声清洗装置与晶圆5之间的距离相对较短，清洗效果更佳。
进一步的，所述限位槽的内壁与晶圆之间形成间隙。减小晶圆旋转的摩擦阻力，限位槽可以限制晶圆的过度晃动。
进一步的，所述限位槽的侧面与晶圆接触，以带动所述从动轴旋转，从动轴外接转速检测单元以监测晶圆的转速，所述限位槽的底面与晶圆存在间隙。晶圆通过限位槽带动从动轴同步转动，便于监测晶圆的转速；限位槽的底面不与晶圆接触，加工精度降低，便于加工。
进一步的，所述第一主动轴和第二主动轴的旋转速度相同。
进一步的，所述第一主动轴和/或第二主动轴的一端与清洗槽侧壁相连，其另一端与驱动单元相连；或者，所述第一主动轴和/或第二主动轴的一端悬空设于清洗槽内，其另一端与驱动单元相连。
进一步的，所述从动轴包括第一轴体和第二轴体，该第一轴体和第二轴体同轴设置，且两者相邻的一端悬空设置。
进一步的，所述第一主动轴和/或第二主动轴包括左侧轴体和右侧轴体，该左侧轴体和右侧轴体同轴设置，且分别由驱动单元驱动旋转。第一主动轴的左侧轴体和第二主动轴的左侧轴体可以配合用于驱动一批晶圆旋转清洗，第二主动轴的左侧轴体和第二主动轴的右侧轴体可以配合用于驱动另一批晶圆旋转清洗，两批晶圆的旋转相对独立，旋转速度可以不同，实现在一个清洗槽内具有两种不同清洗节奏的目的，清洗形式更多样，使用更加灵活。
进一步的，所述左侧轴体和右侧轴体的旋转速度不相同。
本发明的有益效果是，清洗槽中可以放置多片晶圆进行同时清洗，在确保同等清洗效率的前提下，最大程度减小了清洗槽的占地面积，确保晶圆清洗的效果一致性；满足更高的出片率要求；晶圆在清洗槽中旋转，解决了清洗的均匀性和一致性较差的问题；清洗多片晶圆时，能节约清洗槽中清洗液的用量，降低成本；对于晶圆的转移，可以支持一组机械手同时取放多片晶圆，转移更方便。
附图说明
图1为本发明的实施例一提供的排列式兆声清洗装置的立体图。
图2为本发明的实施例一提供的排列式兆声清洗装置的俯视图。
图3为本发明的实施例一提供的排列式兆声清洗装置的横向剖视图。
图4为本发明的实施例一提供的排列式兆声清洗装置的纵向剖视图。
图5为本发明的实施例一提供的排列式兆声清洗装置除去清洗槽的立体图。
图6为本发明的实施例二提供的排列式兆声清洗装置的俯视图。
图7为本发明的实施例二提供的排列式兆声清洗装置的横向剖视图。
图8为本发明的实施例二提供的排列式兆声清洗装置除去清洗槽的立体图。
具体实施方式
为了使本技术领域的人员更好的理解本发明方案，下面将结合本 发明实施例中的附图，对发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
实施例一
一种用于清洗晶圆的排列式兆声清洗装置，包括：
清洗槽3，内部带有清洗液，底部设有兆声发生装置31；
第一主动轴1，设置在清洗槽3内，在驱动单元4的驱动下可绕着第一主动轴1自身的中心线周向旋转；其轴向长度为60-350mm；
第二主动轴2，与第一主动轴1相平行地设置在清洗槽3内，在驱动单元的驱动下可绕着第二主动轴2自身的中心线周向旋转，此处的驱动单元可以与第一主动轴1的驱动单元共用一个，也可以不相同；其轴向长度为60-350mm；
第一主动轴1上沿着其长度方向设置有至少两个第一卡槽11；
第二主动轴2上沿着其长度方向设置有至少两个第二卡槽21，该第二卡槽21与第一卡槽11对应设置，此处的对应指的是第一卡槽11和第二卡槽21的数量对应，且位置也对应，具体指的是第一卡槽11在清洗槽3侧壁上的投影与第二卡槽21在清洗槽3侧壁上的投影重叠，或至少部分重叠。
从而两片或多片晶圆5分别通过第一卡槽11和第二卡槽21的配合实现放置，且所述第一主动轴1和第二主动轴2被构造为分别位于 晶圆5的中轴线的两侧，即每片晶圆5分别放置在对应的一组第一卡槽11和第二卡槽21上，晶圆5的侧壁与第一卡槽11和第二卡槽21的底壁相接触。
第一主动轴1和第二主动轴2沿着相同的方向转动，可以在摩擦力的作用下驱动晶圆5同时转动，从而实现晶圆5的旋转清洗。
当然还可以包括从动轴6，其设置有至少两个限位槽63，该限位槽63与第一卡槽11、第二卡槽21位于同一竖直平面内。更具体的，限位槽63与第一卡槽11、第二卡槽21的数量对应，位置也对应。晶圆5的边缘部分落入限位槽63内。
从动轴6被构造为位于晶圆5的下方，且偏离晶圆5的中轴线设置。从而兆声清洗装置31与晶圆5之间的距离相对较短，清洗效果更佳。
限位槽63的内壁与晶圆5之间形成间隙，此时限位槽63的底壁与晶圆5的侧壁之间存在间隙，限位槽63的侧壁与晶圆5的表面之间也存在间隙。
当然在另一种形式下，限位槽63的侧面与晶圆5表面接触，从而在摩擦力作用下带动从动轴6旋转，但是限位槽63的底面与晶圆5之间存在间隙。此时，从动轴6外接转速检测单元64，由于从动轴6被晶圆5带着同步转动，通过监测从动轴6的转速可以间接监测到晶圆5的转动速度。
更具体的，在本实施例中，如图1-图5所示，第一主动轴1和第二主动轴2由同一个驱动单元4提供动力，换句话说，第一主动轴1 和第二主动轴2的旋转速度相同。第一主动轴1和第二主动轴2与驱动单元4的连接方式可以是电机直驱、皮带传动等，具体不作限制。
且第一主动轴1的一端与清洗槽3侧壁转动相连，其另一端与驱动单元4相连，第二主动轴2与第一主动轴1平行设置，其一端与清洗槽3侧壁转动相连，其另一端与驱动单元4相连。从动轴6的两端均与清洗槽3侧壁相连。
在其他实施例中，上述结构也可以替换成第一主动轴1的一端与驱动单元4相连，其另一端不与清洗槽3侧壁转动相连，而是悬空设置在清洗槽3内；第二主动轴2的一端与驱动单元4相连，其另一端不与清洗槽3侧壁转动相连，而是悬空设置在清洗槽3内；从动轴6的一端与清洗槽3侧壁相连，其另一端悬空设置在清洗槽3内。
当然也可以进行组合，即在同一个清洗槽3内，第一主动轴1的一端与驱动单元4相连、其另一端悬空设置在清洗槽3内，第一主动轴1的一端与驱动单元4相连、其另一端与清洗槽3侧壁相连，第二主动轴2的一端与驱动单元4相连、其另一端与清洗槽3侧壁转动相连，第二主动轴2的一端与驱动单元4相连、其另一端悬空设置在清洗槽3内，从动轴6的一端与清洗槽3侧壁相连、其另一端悬空设置在清洗槽3内，从动轴6的两端均与清洗槽3侧壁相连，第一主动轴1和第二主动轴2由同一个驱动单元4驱动，第一主动轴1和第二主动轴2由不同驱动单元4驱动，不设置从动轴6，这九个特征之间可以随意组合，不受限制。三片晶圆5分别卡设在第一主动轴1上的三个第一卡槽11和第二主动轴2上的三个第二卡槽21之间，在第一主 动轴1和第二主动轴2沿相同方向转动的情况下，三片晶圆5同时发生转动，转动的同时进行清洗。
如图4所示，从动轴6位于晶圆5的下方，在第一主动轴1和第二主动轴2之间，且偏离晶圆5的中轴线。从而相对于从动轴6位于晶圆5的中轴线，可以使得在第一主动轴1和第二主动轴2之间的间距最大、保证晶圆5的稳定性的前提下，清洗槽3底部的兆声清洗装置31与晶圆5之间的距离相对最短，清洗效果更佳。
为了确保晶圆清洗的效果的一致性，每个清洗槽3内的清洗液里的每种化学液需要有复杂的闭环流量控制，确保清洗液有精准的配比，同一个清洗槽3清洗多片晶圆5，可以确保每片晶圆5都处在同样的配比的清洗液中，确保清洗一致性，降低配液的成本。而且，一个清洗槽3放置多片晶圆5和多个清洗槽、每个槽放一片晶圆相比，清洗液的总体积较小；一个清洗槽3放置多片晶圆5每个晶圆5的间距较小，可以支持一组机械手同时取放多片晶圆5。
实施例二
如图6-图8所示，本实施例与实施例一的不同之处在于，第一主动轴1包括同轴布设的左侧轴体12和右侧轴体13，两者相邻的一端悬空设置，第二主动轴2包括同轴布设的左侧轴体22和右侧轴体23，两者相邻的一端悬空设置，第一主动轴1的左侧轴体12和第二主动轴2的左侧轴体22由同一个驱动单元4驱动同步旋转，第一主动轴1的右侧轴体13和第二主动轴2的右侧轴体23由另一个驱动单元4 驱动同步旋转。
因此，第一主动轴1的左侧轴体12和右侧轴体13的旋转速度可以不相同，第二主动轴2的左侧轴体22和右侧轴体23的旋转速度可以不相同。
从动轴6包括同轴布设的第一轴体61和第二轴体62，第一轴体61和第二轴体62相邻的一端悬空设置。
一批晶圆5可以放置在第一主动轴1的左侧轴体12的第一卡槽11、第二主动轴2的左侧轴体22的第二卡槽21之间，同时配合第一轴体61上的限位槽63进行旋转清洗。
另一批晶圆5可以放置在第一主动轴1的右侧轴体13的第一卡槽11、第二主动轴2的右侧轴体23的第二卡槽21之间，同时配合第二轴体62上的限位槽63进行旋转清洗。
因此，两批晶圆5可以分别由不同驱动单元4驱动旋转进行清洗，旋转清洗的速度可以不相同，形成相对独立的清洗节奏，适应不同的清洗要求。
当然，第一主动轴1分为左侧轴体12和右侧轴体13，第二主动轴2分为左侧轴体22和右侧轴体23，从动轴6分为第一轴体61和第二轴体62，这三个特征也可以和实施例一中的九个特征之间随意组合，不受限制。
上述具体实施方式用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利要求的保护范围内，对本发明作出的任何修改和改变，都落入本发明的保护范围。

Claims (10)

  1. 一种用于清洗晶圆的排列式兆声清洗装置，其特征在于包括：
    清洗槽(3)，内部带有清洗液和兆声发生装置(31)；
    第一主动轴(1)和第二主动轴(2)，平行设于清洗槽(3)内，且在驱动单元(4)的驱动下可绕其自身中心线周向旋转；
    所述第一主动轴(1)和第二主动轴(2)的长度为60-350mm；
    所述第一主动轴(1)上沿长度方向设有至少两个第一卡槽(11)，所述第二主动轴(2)上沿长度方向设有至少两个第二卡槽(21)，该第二卡槽(21)与第一卡槽(11)对应设置；
    多片晶圆(5)分别通过第一卡槽(11)和第二卡槽(21)的配合实现放置，且所述第一主动轴(1)和第二主动轴(2)被构造为分别位于晶圆(5)的中轴线的两侧；
    第一主动轴(1)和第二主动轴(2)沿相同方向转动，可摩擦驱动多片晶圆(5)同时转动，以实现清洗。
  2. 根据权利要求1所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：还包括从动轴(6)，其设有至少两个限位槽(63)，该限位槽(63)与第一卡槽(11)、第二卡槽(21)位于同一竖直平面内，晶圆(5)的边缘部分落入限位槽(63)内。
  3. 根据权利要求2所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述从动轴(6)被构造为位于晶圆(5)的下方，且偏离晶圆(5)的中轴线设置。
  4. 根据权利要求2所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述限位槽(63)的内壁与晶圆(5)之间形成间隙。
  5. 根据权利要求2所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述限位槽(63)的侧面与晶圆(5)接触，以带动所述从动轴(6)旋转，从动轴(6)外接转速检测单元(64)以监测晶圆(5)的转速，所述限位槽(63)的底面与晶圆(5)存在间隙。
  6. 根据权利要求1所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述第一主动轴(1)和第二主动轴(2)的旋转速度相同。
  7. 根据权利要求1所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述第一主动轴(1)和/或第二主动轴(2)的一端与清洗槽(3)侧壁相连，其另一端与驱动单元(4)相连；或者，所述第一主动轴(1)和/或第二主动轴(2)的一端悬空设于清洗槽(3)内，其另一端与驱动单元(4)相连。
  8. 根据权利要求2所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述从动轴(6)包括第一轴体(61)和第二轴体(62)，该第一轴体(61)和第二轴体(62)同轴设置，且两者相邻的一端悬空设置。
  9. 根据权利要求1所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述第一主动轴(1)和/或第二主动轴(2)包括左侧轴体和右侧轴体，该左侧轴体和右侧轴体同轴设置，且分别由驱动单元(4)驱动旋转。
  10. 根据权利要求9所述的用于清洗晶圆的排列式兆声清洗装置，其特征在于：所述左侧轴体和右侧轴体的旋转速度不相同。
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