WO2023065888A1 - Ensemble carte de circuit imprimé, et dispositif électronique et son procédé de commande - Google Patents

Ensemble carte de circuit imprimé, et dispositif électronique et son procédé de commande Download PDF

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Publication number
WO2023065888A1
WO2023065888A1 PCT/CN2022/118428 CN2022118428W WO2023065888A1 WO 2023065888 A1 WO2023065888 A1 WO 2023065888A1 CN 2022118428 W CN2022118428 W CN 2022118428W WO 2023065888 A1 WO2023065888 A1 WO 2023065888A1
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WO
WIPO (PCT)
Prior art keywords
signal
antenna
ground
connection
seat
Prior art date
Application number
PCT/CN2022/118428
Other languages
English (en)
Chinese (zh)
Inventor
杨江燕
Original Assignee
深圳市锐尔觅移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市锐尔觅移动通信有限公司 filed Critical 深圳市锐尔觅移动通信有限公司
Publication of WO2023065888A1 publication Critical patent/WO2023065888A1/fr

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

Definitions

  • the motherboard body 100 is configured with a ground terminal, and devices in the circuit board assembly can be connected to the ground terminal to realize the ground function.
  • the number of ground terminals on the motherboard body 100 can be multiple, and each device in the circuit board assembly can be connected to the corresponding ground terminal nearby, so as to reduce the number of wires in the motherboard body 100 .
  • the embodiments of the present application are described using ground terminals, but it can be understood that different devices can be connected to ground through different ground terminals, and the specific connection method between devices and ground terminals is not limited in this embodiment.
  • Step 1104 when the first distance is less than the distance threshold, control the ground pin of the first connection socket to be connected to the ground terminal through the filter path, so as to filter out the clutter signal generated on the signal cable;
  • the ground pin of the first connecting seat is controlled to be connected to the ground terminal through the direct connection path.
  • the filter path by setting the filter path, the clutter signal on the signal cable can be filtered out, thereby suppressing the influence of the clutter signal on the first antenna at an adjacent position, improving the radio frequency performance of the first antenna, thereby improving Communication quality of electronic devices.
  • the loss on the path between the ground pin and the ground terminal can be avoided to the greatest extent, thereby ensuring the radio frequency performance of the antenna connected to the first connection base.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un ensemble carte de circuit imprimé, comprenant : un corps de carte mère (100) configuré avec une borne de mise à la terre ; un premier siège de liaison (200) connecté au corps de carte mère (100), le premier siège de liaison (200) étant configuré avec des broches de mise à la terre (210), le premier siège de liaison (200) étant utilisé pour être connecté à un dispositif cible, et un trajet de transmission de signal étant formé entre le premier siège de raccordement (200) et le dispositif cible ; et un module de filtre (300) relié séparément aux broches de mise à la terre (210) du premier siège de connexion (200) et la borne de masse du corps de carte mère (100), le module de filtre (300) étant utilisé pour filtrer un signal de fouillis généré sur le trajet de transmission de signal.
PCT/CN2022/118428 2021-10-22 2022-09-13 Ensemble carte de circuit imprimé, et dispositif électronique et son procédé de commande WO2023065888A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111235510.3A CN113966071A (zh) 2021-10-22 2021-10-22 电路板组件、电子设备及其控制方法
CN202111235510.3 2021-10-22

Publications (1)

Publication Number Publication Date
WO2023065888A1 true WO2023065888A1 (fr) 2023-04-27

Family

ID=79466513

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/118428 WO2023065888A1 (fr) 2021-10-22 2022-09-13 Ensemble carte de circuit imprimé, et dispositif électronique et son procédé de commande

Country Status (2)

Country Link
CN (1) CN113966071A (fr)
WO (1) WO2023065888A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113966071A (zh) * 2021-10-22 2022-01-21 深圳市锐尔觅移动通信有限公司 电路板组件、电子设备及其控制方法
CN115802736B (zh) * 2023-01-31 2023-07-07 荣耀终端有限公司 抗干扰结构和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120146876A1 (en) * 2010-12-09 2012-06-14 Cirocomm Technology Corp. Surface mount device antenna module
CN107707268A (zh) * 2017-11-02 2018-02-16 深圳市金立通信设备有限公司 一种能够抑制谐波的天线电路、射频电路及终端
CN111555082A (zh) * 2020-04-26 2020-08-18 Oppo广东移动通信有限公司 射频连接器及射频组件、电子设备
CN113966071A (zh) * 2021-10-22 2022-01-21 深圳市锐尔觅移动通信有限公司 电路板组件、电子设备及其控制方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005244711A (ja) * 2004-02-27 2005-09-08 Hitachi Metals Ltd 高周波スイッチモジュール及びこれを用いた通信装置
JP2010040474A (ja) * 2008-08-08 2010-02-18 Sony Corp 同軸コネクタおよび同軸コネクタの製造方法
JP6210614B2 (ja) * 2012-09-04 2017-10-11 株式会社日立国際電気 無線通信機
CN104378914A (zh) * 2013-08-12 2015-02-25 鸿富锦精密工业(深圳)有限公司 印刷电路板及电子装置
CN106714450A (zh) * 2016-11-24 2017-05-24 青岛海信宽带多媒体技术有限公司 一种射频连接器的兼容pcb结构
US10312569B1 (en) * 2018-01-05 2019-06-04 Cirocomm Technology Corp. Surface-mounted signal transceiver module with multi-signal feed-in
CN112532270B (zh) * 2020-10-28 2022-11-01 深圳市锐尔觅移动通信有限公司 射频电路、终端设备及射频信号处理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120146876A1 (en) * 2010-12-09 2012-06-14 Cirocomm Technology Corp. Surface mount device antenna module
CN107707268A (zh) * 2017-11-02 2018-02-16 深圳市金立通信设备有限公司 一种能够抑制谐波的天线电路、射频电路及终端
CN111555082A (zh) * 2020-04-26 2020-08-18 Oppo广东移动通信有限公司 射频连接器及射频组件、电子设备
CN113966071A (zh) * 2021-10-22 2022-01-21 深圳市锐尔觅移动通信有限公司 电路板组件、电子设备及其控制方法

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Publication number Publication date
CN113966071A (zh) 2022-01-21

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