WO2023065845A1

WO2023065845A1 - Smd debugger

Info

Publication number: WO2023065845A1
Application number: PCT/CN2022/116496
Authority: WO
Inventors: 朱魏; 郭嘉帅
Original assignee: 深圳飞骧科技股份有限公司
Priority date: 2021-10-22
Filing date: 2022-09-01
Publication date: 2023-04-27
Also published as: CN215956394U

Abstract

Provided in the present utility model is an SMD debugger. The SMD debugger comprises a shell, a telescopic rod, a sucker, a wire-wound inductor and metal wires, wherein one end of the shell is tapered, and a through telescopic rod hole is formed inside the shell along the axis thereof; the end of the shell which is tapered is a tapered end, and the other end of the shell away from the tapered end is a tail end; the telescopic rod passes through the telescopic rod hole, and the sucker is mounted at one end of the telescopic rod; the sucker is located on an outer side of the tapered end; the wire-wound inductor is buried in the tail end; the metal wires are buried inside the shell; and two metal wires are provided, and one end of each metal wire is arranged at the tapered end, and the other end thereof is connected to the wire-wound inductor. By means of the SMD debugger in the present utility model, during debugging, an SMD is fixed by means of the sucker, thereby avoiding tin soldering of the SMD and heating for replacement; in addition, the capacitance and inductance of the SMD can be measured, and therefore whether the values of the capacitance and the inductance of the SMD are correct is verified, thereby greatly shortening the debugging period and improving the debugging efficiency.

Description

A kind of SMD debugger

technical field

The utility model belongs to the technical field of electronic equipment, in particular to an SMD debugger.

Background technique

Wireless communication technology is a communication technology that uses electromagnetic wave signals to exchange information in space. It is widely used in mobile phones, wireless local area networks, Bluetooth and other electronic devices. The development of wireless communication technology is inseparable from the development of radio frequency and microwave technology. progress.

At present, in the debugging process of radio frequency chips, the SMD (chip component) is welded on the test substrate by soldering technology and electrically connected to judge whether the SMD meets the requirements by testing its output performance. If the requirements are met, a new SMD needs to be replaced for re-commissioning.

This method of SMD debugging through soldering, when it is necessary to replace the SMD, the old SMD can only be removed by heating the previous tin to melt, and then a new SMD is replaced. This debugging process usually requires dozens of SMDs to be replaced. Hundreds of times, which greatly prolongs the debugging cycle and efficiency, and it is impossible to measure the capacitance and inductance of SMD before debugging. Improve the debugging cycle and efficiency.

Utility model content

The technical problem to be solved in the embodiment of the utility model is how to provide a kind of SMD debugger, to solve the existing SMD debugging mode, in the process of debugging the SMD, if it is necessary to replace the SMD, it is inconvenient to replace, and it cannot be installed Capacitance and inductance are measured on SMD before debugging, which leads to the prolongation of its debugging cycle and efficiency.

In order to solve the above technical problems, the embodiment of the utility model provides an SMD debugger, including a shell, a telescopic rod, a sucker, a winding inductor and a metal wire;

One end of the shell is tapered, and the interior of the shell is provided with a penetrating telescopic rod hole along the axis; the tapered end of the shell is a tapered end, and the other end of the shell away from the tapered end is a tail end;

The telescopic rod passes through the hole of the telescopic rod, and the suction cup is installed at one end of the telescopic rod;

The suction cup is located outside the tapered end, and the diameter of the suction cup is larger than the port diameter of the telescopic rod hole of the tapered end;

The winding inductor is buried at the tail end;

The metal wires are buried in the shell, and there are two metal wires with one end arranged at the tapered end and the other end connected to the winding inductor; the ends of the two metal wires away from the winding inductor are connected to the An external network analyzer is electrically connected to measure the resonant frequency of the capacitor under test.

Further, the tapered end of the housing is provided with a card slot, the width of the card slot is equal to the width of the SMD, and the parts of the housing on both sides of the card slot are conductive structures, and are respectively connected to two One end of the metal wire away from the winding inductor is electrically connected.

Furthermore, the telescopic rod includes a thick rod part and a thin rod part, the diameter of the thick rod part is larger than the diameter of the thin rod part, the thick rod part is connected to the thin rod part, and the thin rod part is connected to the The suction cup; the telescopic rod hole is a stepped hole matched with the telescopic rod.

Furthermore, it also includes a spring, the spring is installed in the hole of the telescopic rod, the telescopic rod passes through the spring, one end of the spring contacts the connection between the thick rod part and the thin rod part, and the other One end contacts the joint of the stepped hole.

Furthermore, the telescopic rod further includes a pressing part, the pressing part is fixed on the top end of the thick rod part, and the pressing part is located outside the outer shell.

Furthermore, the tapered end is conical, and the tail end is cylindrical.

Furthermore, the material of the shell is carbon fiber.

Furthermore, the telescopic rod is made of carbon fiber.

Compared with the prior art, the SMD debugger of the present utility model adopts a movable telescopic rod inside, absorbs the SMD through the suction cup at the end of the telescopic rod, and presses the SMD on the test substrate through the SMD debugger during debugging. It is easy to replace the SMD. When the debugged SMD does not meet the requirements, remove the SMD on the suction cup and replace another SMD to test again, avoiding the soldering and heating replacement of the SMD during debugging, which greatly shortens the debugging. At the same time, through the setting of the winding inductance and the metal wire, the inductance value of the SMD can also be obtained, and the end of the two metal wires away from the winding inductance can be electrically connected to an external network analyzer to measure the The resonant frequency of the capacitor, so that the capacitance value of the SMD can be calculated by using the calculation formula, and then the correct value of the capacitance and inductance can be verified during the debugging process, which also greatly shortens the debugging cycle and efficiency.

Description of drawings

In order to make the content of the utility model clearer, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the utility model. Ordinary technicians can also obtain other drawings based on these drawings without any creative effort, among which:

FIG. 1 is an overall structural diagram of an SMD debugger according to an embodiment of the present invention.

Fig. 2 is an exploded view of the SMD debugger of the embodiment of the present invention.

Fig. 3 is a partially enlarged view of the SMD debugger of the embodiment of the present invention.

Fig. 4 is a partial enlarged view of the housing of the embodiment of the present invention.

Fig. 5 is a structural diagram of a telescopic rod according to an embodiment of the present invention.

Fig. 6 is a partially enlarged view of the telescopic rod according to the embodiment of the present invention.

Fig. 7 is a schematic diagram of the telescopic rod of the SMD debugger stretching out to pick up the SMD according to the embodiment of the present invention.

Fig. 8 is a schematic diagram of retraction of the telescopic rod after the SMD debugger absorbs the SMD according to the embodiment of the present invention.

Fig. 9 is a schematic circuit diagram of an embodiment of the present invention.

Fig. 10 is a resonance rating diagram of an embodiment of the present invention.

Among them, 1. shell; 11. telescopic rod hole; 12. tapered end; 13. tail end; 14. slot; 15. conductive structure; 2. telescopic rod; 21. thick rod part; 22. thin rod part; 23. Pressing part; 3. Suction cup; 4. Winding inductor; 5. Metal wire; 5. Spring; 6. SMD.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

The following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in this utility model, such as up, down, front, back, left, right, inside, outside, side, etc., are only referring to the directions of the attached drawings, so the directional terms used are only for illustration And to understand the utility model, but not to limit the utility model.

The embodiment of the utility model provides an SMD debugger, which includes a casing 1, a telescopic rod 2, a sucker 3, a winding inductor 4 and a metal wire 5, as shown in accompanying drawings 1 to 8.

Specifically, the housing 1 is elongated and has a tapered end, and the tapered end is the operator's handle, which is convenient for the operator to observe the SMD6 when performing detection.

Wherein, the tapered end of the housing 1 is the tapered end 12, and the other end of the housing 1 away from the tapered end 12 is the tail end 13; the tapered end 12 is conical, and the tail end 13 is cylindrical, conical and cylindrical. It facilitates the processing of the shell 1, but the present invention is not limited thereto.

Specifically, the interior of the casing 1 is provided with a through telescopic rod hole 11 along the axis.

Specifically, the telescopic rod 2 is a slender rod, and the telescopic rod 2 penetrates into the telescopic rod hole 11 . In this embodiment, the length of the telescopic rod 2 is longer than the length of the telescopic rod hole 11 , and the suction cup 3 is installed at one end of the telescopic rod 2 . Place the suction cup 3 on the SMD6, and when the suction cup 3 is pressed, the air in it will be discharged to suck the SMD6.

Specifically, when assembling the SMD debugger, the suction cup 3 is installed outside the tapered end 12 of the housing 1 , and the diameter of the suction cup 3 is larger than the port diameter of the telescopic rod hole 11 of the tapered end 12 . When the suction cup 3 moves, it will not all move into the telescopic rod hole 11, and the telescopic rod hole 11 plays a position-limiting effect on the suction cup 3.

Optionally, the telescopic rod 2 includes a thick rod part 21 and a thin rod part 22 , the diameter of the thick rod part 21 is larger than the diameter of the thin rod part 22 . In this embodiment, the diameter of the thick rod part 21 is 1 mm, the diameter of the thin rod part 22 is 0.5 mm, the length of the thick rod part 21 is about twice the length of the thin rod part 22, and the thick rod part 21 is connected to the thin rod part 22 , the end of the thin rod portion 22 is connected to the suction cup 3 .

Specifically, the telescopic rod hole 11 is a stepped hole matched with the telescopic rod 2 , the part with a larger diameter of the telescopic rod hole 11 is matched with the thick rod part 21 , and the part with a smaller diameter is matched with the thin rod part 22 . The telescopic rod hole 11 and the telescopic rod 2 are clearance fit, and the telescopic rod 2 can move freely in the telescopic rod hole 11.

Specifically, the telescopic rod 2 may further include a pressing portion 23 fixed on the top end of the thick rod portion 21 , and the pressing portion 23 is located outside the casing 1 .

Wherein, the diameter of the pressing part 23 is larger than that of the thick rod part 21 , which is convenient for the operator to press. When the pressing part 23 receives a pressing force, the telescopic rod 2 moves toward the tapered end 12 .

Optionally, the SMD debugger also includes a spring 5, the spring 5 is installed in the hole 11 of the telescopic rod, the telescopic rod 2 passes through the spring 5, one end of the spring 5 contacts the junction of the thick rod part 21 and the thin rod part 22, and the other end Contact the junction of the stepped hole.

Wherein, the spring 5 is located between the telescopic rod 2 and the housing 1, when the telescopic rod 2 is under pressure, the spring 5 is compressed accordingly, and when the pressure is removed, the elastic force of the spring 5 causes the telescopic rod 2 to reset.

Specifically, the wirewound inductor 4 is embedded in the tail end 13 and is formed by surrounding the tail end 13 with metal structural wires. In this embodiment, the inductance of the wire-wound inductor 4 is 1nH.

Specifically, the metal wire 5 is buried in the shell 1, and there are two metal wires 5 with one end arranged at the tapered end 12, and the other end connected to the winding inductor 4; the ends of the two metal wires 5 away from the winding inductor 4 are connected to the external The network analyzer is electrically connected to measure the resonant frequency of the capacitance to be measured (that is, the capacitance of the SMD6 to be tested).

Among them, the two metal wires 5 are not in contact; the ends of the two metal wires 5 away from the winding inductor 4 are exposed outside the casing 1, so as to resonate with the capacitor to be measured, and are electrically connected to an external network analyzer to measure The resonant frequency of the capacitor to be measured can be calculated by using the formula C=1/(4*π2*f2*L) to obtain the capacitance value of SMD6, where f in the formula is the measured resonance rate, and L is the winding The inductance value of inductor 4.

When the network analyzer measures the resonance rating, the rating of the minimum value of SMD6 can be obtained, as shown in Figure 10.

Specifically, the wound inductor 4 and the two metal wires 5 can also be formed by setting a metal structure wire, that is, a single metal structure wire extends from the tapered end 12 to the tail end 13, and is wound at the tail end 13 for multiple turns. The wound inductor 4 extends back to the tapered end 12, and the two ends of the single metal structure wire are used to resonate with the capacitor under test, and are electrically connected to an external network analyzer to measure the resonant frequency of the capacitor under test.

Optionally, the tapered end 12 of the housing 1 is provided with a card slot 14, the width of the card slot 14 is equal to the width of the SMD6, and the parts of the housing 1 on both sides of the card slot 14 are conductive structures 15, and are respectively connected to two metal wires 5 One end away from the winding inductor 4 is electrically connected. In this embodiment, the conductive structure 15 is made of conductive metal.

The circuit principle of the conductive structures 15 on both sides of the card slot 14 and the capacitance to be measured is shown in FIG. 9 , wherein term1 and term2 are the conductive structures 15 on both sides of the card slot 14 respectively.

After the suction cup 3 absorbs the SMD6, the telescopic rod 2 is retracted to drive the SMD6 into the slot 14 . When testing, press the SMD6 on the test substrate, the slot 14 can prevent the displacement of the SMD6 due to the unevenness of the test substrate, ensure that the debugging will not be interrupted by the displacement of the SMD6, and pass the conductive structure 15 on both sides of the slot 14 To generate resonance with the capacitance to be measured, it is not necessary to expose the ends of the two metal wires 5 away from the winding inductor 4 outside the casing 1 .

In this embodiment, the material of the housing 1 except the conductive structure 15 is carbon fiber, and the material of the telescopic rod 2 of the SMD debugger is carbon fiber. Carbon fiber material, non-conductive, high temperature resistance, corrosion resistance, high strength, will not affect the electrical performance of the circuit, and is not easy to damage and wear.

When absorbing SMD6 through the SMD debugger, press the pressing part 23 of the telescopic rod 2, and the telescopic rod 2 drives the suction cup 3 to extend out. After the suction cup 3 contacts the SMD6, the air is exhausted to absorb the SMD6; 2 Reset under the action of the spring 5, the telescopic rod hole 11 clamps the suction cup 3, and the SMD6 is embedded in the card slot 14; when debugging, use the SMD debugger to vertically press the SMD6 on the test substrate for debugging, and then determine whether the SMD6 conforms to requirements; if the SMD6 does not meet the requirements, remove the SMD6 on the suction cup 3 and replace it with another SMD6 for next debugging; at the same time, before debugging, you can obtain the inductance value by setting the winding inductor 4 and the metal wire 5, And the conductive structure 15 on both sides of the card slot 14 is electrically connected through an external network analyzer, so as to measure the resonance evaluation rate of the capacitance to be measured, so as to obtain the capacitance value of the SMD6 by using the above formula.

Compared with the prior art, the SMD debugger of the present utility model, by setting the movable telescopic rod 2 inside, absorbs the SMD6 through the suction cup 3 at the end of the telescopic rod 2, and presses the SMD6 through the SMD debugger when debugging. On the test substrate, it is convenient to replace the SMD6. When the debugged SMD6 does not meet the requirements, remove the SMD6 on the suction cup 3 and replace it with another SMD6 to test again, avoiding the soldering and heating of the SMD6 during debugging. The cycle and efficiency of debugging are greatly shortened. At the same time, the inductance value of SMD6 can also be obtained through the setting of the winding inductor 4 and the metal wire 5, and the end of the two metal wires 5 away from the winding inductor 4 can be connected to the external network. The analyzer is electrically connected to measure the resonant frequency of the capacitor under test, so that the capacitance value of SMD6 can be calculated by using the calculation formula, and then it can be verified whether the values of its capacitance and inductance are correct during the debugging process, which also greatly shortens the debugging time. cycle and efficiency.

The above embodiments are only examples for clearly illustrating the utility model, and are not intended to limit the implementation; the scope of the utility model includes and is not limited to the above examples, and all equivalent changes made according to the shape and structure of the utility model all include Within the protection scope of the present utility model.

Claims

A kind of SMD debugger, it is characterized in that, comprises shell, telescopic rod, sucker, wound inductor and metal wire;

One end of the shell is tapered, and the interior of the shell is provided with a penetrating telescopic rod hole along the axis; the tapered end of the shell is a tapered end, and the other end of the shell away from the tapered end is a tail end;

The telescopic rod passes through the hole of the telescopic rod, and the suction cup is installed at one end of the telescopic rod;

The suction cup is located outside the tapered end, and the diameter of the suction cup is larger than the port diameter of the telescopic rod hole of the tapered end;

The winding inductor is buried at the tail end;

The metal wires are buried in the shell, and there are two metal wires with one end arranged at the tapered end and the other end connected to the winding inductor; the ends of the two metal wires away from the winding inductor are connected to the An external network analyzer is electrically connected to measure the resonant frequency of the capacitor under test.
The SMD debugger according to claim 1, wherein the tapered end of the housing is provided with a draw-in slot, the width of the draw-in slot is equal to the width of the SMD, and the housing on both sides of the draw-in slot The part is a conductive structure, and is electrically connected to the ends of the two metal wires away from the winding inductor respectively.
The SMD debugger according to claim 1, wherein the telescopic rod comprises a thick rod part and a thin rod part, the diameter of the thick rod part is greater than the diameter of the thin rod part, and the thick rod part is connected to the A thin rod part, the thin rod part is connected with the suction cup; the telescopic rod hole is a stepped hole matched with the telescopic rod.
The SMD debugger according to claim 3, further comprising a spring, the spring is installed in the hole of the telescopic rod, the telescopic rod passes through the spring, and one end of the spring contacts the thick The other end of the joint of the rod part and the thin rod part contacts the joint of the stepped hole.
The SMD debugger according to claim 3, wherein the telescopic rod further includes a pressing part, the pressing part is fixed on the top end of the thick rod part, and the pressing part is located outside the shell.
The SMD debugger according to claim 1, wherein the tapered end is conical, and the tail end is cylindrical.
The SMD debugger according to claim 1, wherein the material of the shell is carbon fiber.
The SMD debugger according to claim 1, wherein the telescopic rod is made of carbon fiber.