WO2023058796A1 - Particules polymères conductrices présentant une excellente résistance à la corrosion - Google Patents
Particules polymères conductrices présentant une excellente résistance à la corrosion Download PDFInfo
- Publication number
- WO2023058796A1 WO2023058796A1 PCT/KR2021/013906 KR2021013906W WO2023058796A1 WO 2023058796 A1 WO2023058796 A1 WO 2023058796A1 KR 2021013906 W KR2021013906 W KR 2021013906W WO 2023058796 A1 WO2023058796 A1 WO 2023058796A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- silver
- polymer particles
- conductive polymer
- silver oxide
- Prior art date
Links
- 239000002245 particle Substances 0.000 title claims abstract description 141
- 229920001940 conductive polymer Polymers 0.000 title claims abstract description 66
- 238000005260 corrosion Methods 0.000 title abstract description 13
- 230000007797 corrosion Effects 0.000 title abstract description 13
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims abstract description 120
- 229920000642 polymer Polymers 0.000 claims abstract description 71
- 229910052709 silver Inorganic materials 0.000 claims abstract description 68
- 239000004332 silver Substances 0.000 claims abstract description 68
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910001923 silver oxide Inorganic materials 0.000 claims abstract description 60
- 239000010949 copper Substances 0.000 claims abstract description 48
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000007864 aqueous solution Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 239000011574 phosphorus Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 47
- 239000002184 metal Substances 0.000 abstract description 47
- 239000010410 layer Substances 0.000 description 147
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 31
- 239000011247 coating layer Substances 0.000 description 17
- 229910052763 palladium Inorganic materials 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 12
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 10
- 239000004926 polymethyl methacrylate Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000008367 deionised water Substances 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- 238000007772 electroless plating Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229960001484 edetic acid Drugs 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- -1 -OH Chemical group 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910001961 silver nitrate Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 101710134784 Agnoprotein Proteins 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 229920001890 Novodur Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- SDVHRXOTTYYKRY-UHFFFAOYSA-J tetrasodium;dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)P([O-])([O-])=O SDVHRXOTTYYKRY-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/18—Homopolymers or copolymers of nitriles
- C08L33/20—Homopolymers or copolymers of acrylonitrile
Definitions
- An object of the present invention is to provide a conductive polymer particle having a metal layer having excellent electrical conductivity and at the same time excellent corrosion resistance and bonding strength with the polymer particle.
- the third layer may include 0.1 to 13.0% by weight of phosphorus together with nickel.
- the first layer may further include palladium, and by including palladium, bonding between the surface of the polymer particle and silver oxide and bonding between the second layer may be further strengthened.
- the amount of palladium contained may be much smaller than that contained in conventional conductive polymer particles without silver oxide.
- the amount of palladium used in the manufacturing process of the conductive polymer particles is generally in the range of 100 to 1,000 ppm based on the conductive polymer particles, but the amount of palladium used in the conductive polymer particles according to the present invention exceeds 0 and is less than 50 ppm.
- the metal silver or silver oxide formed in the first layer must have a certain amount or more to provide a satisfactory bonding force to the second layer, and if it is too large, process costs increase, which is undesirable. More preferably, it may be 10 to 500 ppm.
- a hydrophilization step of hydrophilizing the surface of the polymer particle (b) a first layer formation step of coating silver oxide on the polymer particle whose surface is hydrophilic, (c) on the first layer
- a conductive polymer manufacturing method comprising the step of forming a second layer of electrolessly plating copper and (d) the step of forming a third layer of electroless plating of nickel or silver on the second layer.
- the hydrophilization treatment of the polymer particles can be carried out in the aqueous solution of strong alkali as described above, but by modifying the surface of the polymer particles through plasma treatment, it is also possible to hydrophilize the polymer particles dry.
- Example 2 In the same manner as in Example 1, a hydrophilization treatment and a tin layer were formed. Thereafter, electroless plating was performed immediately without forming a silver oxide layer to sequentially form a second layer containing copper and a third layer containing nickel. Electroless plating of copper and nickel was performed in the same manner as in Example 1.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
Abstract
L'objectif de la présente invention est de fournir une particule de polymère conducteur ayant, sur sa surface, une couche métallique qui a une excellente conductivité électrique et en même temps, a une excellente résistance à la corrosion et une excellente force de liaison avec la particule de polymère. Pour atteindre l'objectif ci-dessus, dans la présente invention, une particule de polymère conducteur peut être fournie, la particule de polymère conducteur comprenant : une première couche formée sur la surface de la particule de polymère et comprenant de l'oxyde d'argent ; une deuxième couche formée sur la première couche et comprenant du cuivre ; et une troisième couche formée sur la deuxième couche et comprenant du nickel ou de l'argent.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2021/013906 WO2023058796A1 (fr) | 2021-10-08 | 2021-10-08 | Particules polymères conductrices présentant une excellente résistance à la corrosion |
CN202180103116.6A CN118140279A (zh) | 2021-10-08 | 2021-10-08 | 具有优异耐蚀性的导电聚合物粒子 |
KR1020247010420A KR20240049614A (ko) | 2021-10-08 | 2021-10-08 | 내식성이 우수한 전도성 폴리머 입자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2021/013906 WO2023058796A1 (fr) | 2021-10-08 | 2021-10-08 | Particules polymères conductrices présentant une excellente résistance à la corrosion |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023058796A1 true WO2023058796A1 (fr) | 2023-04-13 |
Family
ID=85804375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2021/013906 WO2023058796A1 (fr) | 2021-10-08 | 2021-10-08 | Particules polymères conductrices présentant une excellente résistance à la corrosion |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20240049614A (fr) |
CN (1) | CN118140279A (fr) |
WO (1) | WO2023058796A1 (fr) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005294044A (ja) * | 2004-03-31 | 2005-10-20 | Sekisui Chem Co Ltd | 導電性微粒子、及び接続構造体 |
KR20150109331A (ko) * | 2013-01-21 | 2015-10-01 | 도레이 카부시키가이샤 | 도전성 미립자 |
KR20170106290A (ko) * | 2015-01-13 | 2017-09-20 | 미쓰비시마테리알덴시카세이가부시키가이샤 | 은 피복 수지 입자 및 그 제조 방법 그리고 그것을 사용한 도전성 페이스트 |
KR20200035633A (ko) * | 2018-09-27 | 2020-04-06 | 주식회사 씨앤씨머티리얼즈 | 자기적 특성이 우수한 니켈 피복 초경질 입자 및 이를 이용한 와이어 쏘우 |
KR20200046721A (ko) * | 2018-10-25 | 2020-05-07 | 주식회사 엘지화학 | 봉지 필름 |
-
2021
- 2021-10-08 WO PCT/KR2021/013906 patent/WO2023058796A1/fr unknown
- 2021-10-08 KR KR1020247010420A patent/KR20240049614A/ko unknown
- 2021-10-08 CN CN202180103116.6A patent/CN118140279A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005294044A (ja) * | 2004-03-31 | 2005-10-20 | Sekisui Chem Co Ltd | 導電性微粒子、及び接続構造体 |
KR20150109331A (ko) * | 2013-01-21 | 2015-10-01 | 도레이 카부시키가이샤 | 도전성 미립자 |
KR20170106290A (ko) * | 2015-01-13 | 2017-09-20 | 미쓰비시마테리알덴시카세이가부시키가이샤 | 은 피복 수지 입자 및 그 제조 방법 그리고 그것을 사용한 도전성 페이스트 |
KR20200035633A (ko) * | 2018-09-27 | 2020-04-06 | 주식회사 씨앤씨머티리얼즈 | 자기적 특성이 우수한 니켈 피복 초경질 입자 및 이를 이용한 와이어 쏘우 |
KR20200046721A (ko) * | 2018-10-25 | 2020-05-07 | 주식회사 엘지화학 | 봉지 필름 |
Also Published As
Publication number | Publication date |
---|---|
CN118140279A (zh) | 2024-06-04 |
KR20240049614A (ko) | 2024-04-16 |
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