WO2023058227A1

WO2023058227A1 - Wiring forming method, and information processing device

Info

Publication number: WO2023058227A1
Application number: PCT/JP2021/037360
Authority: WO
Inventors: 亮二郎富永
Original assignee: 株式会社Fuji
Priority date: 2021-10-08
Filing date: 2021-10-08
Publication date: 2023-04-13

Abstract

This wiring forming method for forming wiring by stacking a plurality of layers of a metal-containing liquid, which contains metal fine particles, includes: a first ejecting step for ejecting the metal-containing liquid in a first array pattern comprising an array, extending in a predetermined direction, of a plurality of rows of ink dots; and a second ejecting step for ejecting the metal-containing liquid onto the metal-containing liquid ejected in the first ejecting step, in a position that is offset, in the predetermined direction, from an ejection position of the metal-containing liquid in the first ejecting step by a distance corresponding to a gap less than a pitch of the ink dots, in an array pattern obtained by removing from the first array pattern one row of ink dots positioned at an edge thereof in the predetermined direction.

Description

Wiring forming method and information processing device

The present invention relates to a wiring forming method for forming wiring with a metal-containing liquid containing fine metal particles.

The following patent document describes a technique for forming wiring with a metal-containing liquid containing fine metal particles.

JP 2012-084566 A

When the wiring is formed by the metal-containing liquid containing metal fine particles, the wiring is formed by laminating the metal-containing liquid. Therefore, the present specification aims to appropriately form wiring by stacking metal-containing liquids.

In order to solve the above problems, the present specification provides a first ejection step of ejecting a metal-containing liquid containing fine metal particles in a first array pattern consisting of a plurality of rows of ink dots extending in a predetermined direction; , an array pattern obtained by removing one row of ink dots located at an end in the predetermined direction from the first array pattern on the metal-containing liquid ejected in the first ejection step, and performing the first ejection; a second ejection step of ejecting the metal-containing liquid at a position shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid in the step, and Disclosed is a wiring forming method for forming wiring by laminating a containing liquid.

Further, in the present specification, the arrangement pattern of the N-th layer of metal ink when wiring is formed by laminating a metal-containing liquid containing fine metal particles is composed of a plurality of rows of ink dots extending in a predetermined direction. a first calculation unit for calculating a first array pattern; and a line of ink dots located at an end of the first array pattern in the predetermined direction as the array pattern of the (N+1)-th layer of metallic ink. The array pattern obtained by removing one row of ink dots located at the end in the direction intersecting the predetermined direction is set to be narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid in the first array pattern. Disclosed is an information processing apparatus including a distance corresponding to the interval and a second calculation unit that calculates the array pattern shifted in the predetermined direction.

In the present disclosure, the metal-containing liquid is ejected in a first array pattern consisting of multiple rows of ink dots extending in a predetermined direction. Then, on the metal-containing liquid, an array pattern obtained by removing one line of ink dots located at the end in a predetermined direction from the first array pattern is applied, and the pitch of the ink dots from the ejection position of the first array pattern is increased. The metal-containing liquid is discharged at a position shifted in a predetermined direction by a distance corresponding to a narrow interval. Also, as the arrangement pattern of the N-th layer of metal ink, a first arrangement pattern consisting of a plurality of rows of ink dots extending in a predetermined direction is calculated. Then, as the arrangement pattern of the (N+1)-th layer of metallic ink, one row of ink dots located at the end in a predetermined direction from the first arrangement pattern is removed, and at the end in the direction intersecting the predetermined direction, a row of ink dots is removed. The array pattern obtained by removing the ink dots in one row is shifted in a predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the first array pattern. Thereby, the metal-containing liquid can be layered and the wiring can be appropriately formed.

It is a figure which shows a circuit formation apparatus. It is a block diagram which shows a control apparatus. FIG. 4 is a cross-sectional view showing a circuit in which a resin laminate is formed; FIG. 4 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate; It is a figure which shows the nozzle surface of an inkjet head. It is a figure which shows an arrangement pattern. It is a figure which shows an arrangement pattern. FIG. 4 is a diagram showing arrangement patterns and wiring of odd-numbered layers and even-numbered layers; It is a figure which shows the conventional wiring. It is a figure which shows the arrangement pattern of an odd-numbered layer. FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers; 11. It is a figure which shows the wiring formed by the arrangement pattern of FIG. 10, and the arrangement pattern of FIG. It is a figure which shows the arrangement pattern of an odd-numbered layer. FIG. 10 is a diagram showing an arrangement pattern of even-numbered layers;

A circuit forming apparatus 10 is shown in FIG. The circuit forming apparatus 10 includes a conveying device 20, a first shaping unit 22, a second shaping unit 24, and a control device (see FIG. 2) . The conveying device 20 , the first shaping unit 22 and the second shaping unit 24 are arranged on the base 29 of the circuit forming device 10 . The base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the lateral direction of the base 29 is the Y-axis direction, and both the X-axis direction and the Y-axis direction are perpendicular to each other. The direction will be referred to as the Z-axis direction for explanation. Note that the Z-axis direction is the same direction as the vertical direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32 . The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36 . The X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction. Further, the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and by driving the electromagnetic motor 38, the X-axis slider 36 moves to any position in the X-axis direction. Also, the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a table 52 . The Y-axis slide rail 50 is arranged on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36 . A table 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the driving of the electromagnetic motor 56 moves the table 52 to any position in the Y-axis direction. As a result, the table 52 is moved to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 .

The table 52 has a base 60, a holding device 62, and an elevating device (see FIG. 2) 64. The base 60 is formed in a flat plate shape, and a pallet (see FIG. 3) 70 is placed on the upper surface thereof. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. Both edges in the X-axis direction of the pallet 70 placed on the base 60 are sandwiched by the holding device 62 , so that the pallet 70 is fixedly held. The lifting device 64 is arranged below the base 60 and lifts the base 60 up and down.

The first shaping unit 22 is a unit that shapes the wiring of the circuit board, and has a first printing section 72 and a baking section 74 . The first printing unit 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 linearly ejects the metal ink. The metal ink is a dispersion of fine particles of nanometer-sized metal, such as silver, in a solvent. The surfaces of the fine metal particles are coated with a dispersant to prevent aggregation in the solvent. In addition, the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using piezoelectric elements.

The baking unit 74 has an infrared irradiation device (see FIG. 2) 78. The infrared irradiation device 78 is a device for irradiating the ejected metal ink with infrared rays, and the metal ink irradiated with the infrared rays is baked to form wiring. Baking metal ink means that the solvent is vaporized and the protective film of the metal fine particles, that is, the dispersing agent is decomposed, by applying energy, and the metal fine particles come into contact or fuse to become conductive. This is a phenomenon in which the rate increases. Then, by baking the metal ink, a metal wiring is formed.

Also, the second molding unit 24 is a unit for molding the resin layer of the circuit board, and has a second printing section 84 and a curing section 86 . The second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 ejects ultraviolet curable resin. An ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays. The inkjet head 88 may be, for example, a piezo system using piezoelectric elements, or a thermal system in which resin is heated to generate bubbles and ejected from a plurality of nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the upper surface of the ultraviolet curable resin ejected by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the surplus resin is scraped off with a roller or a blade. to make the thickness of the UV curable resin uniform. Further, the irradiation device 92 has a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curable resin with ultraviolet rays. As a result, the discharged ultraviolet curable resin is cured to form a resin layer.

The control device 28 also includes a controller 110 and a plurality of drive circuits 112, as shown in FIG. A plurality of drive circuits 112 are connected to the

electromagnetic motors

38 , 56 , holding device 62 , lifting device 64 , inkjet head 76 , infrared irradiation device 78 , inkjet head 88 , flattening device 90 and irradiation device 92 . The controller 110 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 112 . Accordingly, the controller 110 controls the operations of the conveying device 20 , the first modeling unit 22 , and the second modeling unit 24 .

In the circuit forming apparatus 10, with the above-described configuration, the resin laminate is formed on the pallet 70 placed on the base 60 of the table 52, and the wiring is formed on the upper surface of the resin laminate to form the circuit. A substrate is formed.

Specifically, when the pallet 70 is set on the base 60 of the table 52 , the table 52 moves below the second modeling unit 24 . Then, in the second modeling unit 24, the resin laminate 122 is formed on the pallet 70, as shown in FIG. The resin layered body 122 is formed by repeating the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet ray by the irradiation device 92 to the ejected ultraviolet curable resin.

Specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 ejects the UV curable resin onto the upper surface of the pallet 70 in the form of a thin film. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film-like ultraviolet curable resin with ultraviolet rays. Thereby, a thin resin layer 124 is formed on the pallet 70 .

Subsequently, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin resin layer 124 . Then, the flattening device 90 flattens the thin film of ultraviolet curable resin, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the form of a thin film with ultraviolet rays, thereby forming a thin film on the resin layer 124 . A thin film resin layer 124 is laminated. In this way, the resin layered body 122 is formed by repeating the discharge of the ultraviolet curable resin onto the thin resin layer 124 and the irradiation of the ultraviolet rays to laminate a plurality of resin layers 124 .

Next, when the resin laminate 122 is formed, the table 52 moves below the first modeling unit 22 . Then, in the first printing unit 72 of the first modeling unit 22, the inkjet head 76 linearly ejects the metal ink 130 onto the upper surface of the resin laminate 122 according to the circuit pattern, as shown in FIG. Subsequently, the infrared irradiation device 78 irradiates the metal ink 130 ejected according to the circuit pattern with infrared rays in the baking section 74 of the first modeling unit 22 . Thereby, the metal ink 130 is baked, and the wiring 132 is formed on the upper surface of the resin layered body 122 .

In this manner, the resin laminate 122 is formed on the pallet 70 in the second modeling unit 24, and the wiring 132 is formed on the resin laminate 122 in the first modeling unit 22, thereby forming the circuit board 136. It is formed. Note that the wiring 132 formed on the resin layered body 122 is formed by layering the metal ink 130 . Specifically, the first layer of metal ink 130 is discharged onto the upper surface of the resin laminate 122, and the first layer of metal ink 130 is irradiated with infrared rays. As a result, the first-layer metal ink 130 is baked to form the first-layer metal thin film. Next, a second layer of metal ink 130 is discharged onto the first layer of metal thin film, and the second layer of metal ink 130 is irradiated with infrared rays. As a result, the second-layer metal ink 130 is baked to form a second-layer metal thin film. In this way, by repeating the ejection of the metal ink 130 and the irradiation of the infrared rays, metal thin films are laminated to form the wiring 132 with a predetermined thickness.

However, when the inkjet head 76 ejects the metal ink, the metal ink is ejected from the plurality of nozzle holes. There is a possibility that a disconnected wiring may be formed due to the positional deviation of . Specifically, as shown in FIG. 5, a nozzle surface 150 of the inkjet head 76 is formed with a plurality of nozzle holes 152 . The nozzle surface 150 is generally rectangular, and is disposed on the inkjet head 76 such that the longitudinal direction of the nozzle surface 150 faces the X direction. A plurality of nozzle holes 152 are formed in two rows on the nozzle surface 150 so as to extend in the X direction. That is, the longitudinal direction in which the plurality of nozzle holes 152 are arranged is the longitudinal direction of the nozzle surface 150 and is the X direction. Note that the plurality of nozzle holes 152 arranged in the X direction are formed at equal pitches. That is, the plurality of nozzle holes 152 arranged in the X direction are formed so that the distance between two adjacent nozzle holes 152 is the same. When the inkjet head 76 ejects the metal ink, the inkjet head 76 moves in the Y direction, thereby ejecting the metal ink in an array pattern consisting of a plurality of rows of ink dots.

Specifically, for example, as shown in FIG. 6, the metal ink is ejected in an array pattern consisting of a plurality of rows of ink dots 160 extending in the X direction. The array pattern is designed so that the ink dots 160 overlap (slanted lines in FIG. 5). Based on this, the ejection pitch of the metal ink in the Y direction is calculated. Then, by ejecting the metal ink at the calculated ejection pitch, the metal ink is ejected in an array pattern with overlapping areas of the ink dots 160 . The array pattern is an array pattern of one layer of metal ink, and a wiring is formed by stacking a plurality of metal inks ejected according to the array pattern. It should be noted that the ejection positions of the respective metal inks of the plurality of layers are the same. That is, the metal ink is ejected at predetermined positions according to the array pattern. Then, by irradiating the metal ink with infrared rays, the first metal thin film is formed. Subsequently, on the metal thin film of the first layer, the metal ink is ejected according to the arrangement pattern at the same position as the ejection position of the metal ink of the first layer, and by irradiating the metal thin film of the second layer. It is formed. In this way, by repeating the ejection of the metal ink to the same position according to the arrangement pattern and the irradiation of the infrared rays, the metal thin films are laminated to form the wiring.

However, positional deviation of the ink dots 160 may occur due to the tolerance of the positional accuracy of the plurality of nozzle holes formed in the nozzle surface 150 of the inkjet head 76 . Further, when a large print area is divided and printed by one inkjet head or a plurality of inkjet heads, positional deviation of the ink dots 160 may occur at the joints of the divided and printed areas. In such a case, if the positional deviation of the ink dots 160 becomes larger than the overlapping area of the ink dots 160, there is a possibility that a disconnected wiring is formed. Specifically, even if the metal ink is ejected according to the array pattern, gaps 166 without overlapping areas (hatched lines) of the ink dots 160 are generated as shown in FIG. 7 due to positional deviation of the ink dots 160 . Therefore, when the ejected metal ink is irradiated with infrared rays, a discontinuous metal thin film with gaps 166 is formed. Then, as described above, even if the ejection of the metal ink to the same position according to the array pattern and the irradiation of the infrared rays are repeated, the gap 166 remains and the disconnected wiring is formed.

In view of this, the wiring is formed by differentiating the ejection position of the metal ink for the odd-numbered layers from the ejection position of the metal ink for the even-numbered layers. Specifically, for example, when the first layer of metal thin film is formed, metal ink is ejected according to an arrangement pattern at a predetermined position, so that a plurality of rows of ink dots 160a are arranged as shown in FIG. Metal ink is ejected in an array pattern. Then, by irradiating the metal ink with infrared rays, the metal thin film 168a of the first layer is formed. A gap 166a is formed in the metal thin film 168a of the first layer. When forming the second layer of metal thin film, the metal ink is ejected according to the array pattern at a position shifted in the X direction by 0.5 pixels from the ejection position of the first layer of metal ink. As a result, as shown in FIG. 8, the metal ink is ejected in an array pattern consisting of a plurality of rows of ink dots 160b. Then, by irradiating the metal ink with infrared rays, the second metal thin film 168b is formed.

A gap 166b also occurs in the metal thin film 168b of the second layer. In this way, when each of the first-layer metal thin film 168a and the second-layer metal thin film 168b is individually described,

gaps

166a and 166b are generated between the metal

thin films

168a and 168b as shown in FIG. However, in practice, the metal thin film 168b of the second layer is laminated on the metal thin film 168a of the first layer, so that the wiring 170 without gaps is formed as shown in FIG. One pixel is the formation pitch of the plurality of nozzle holes 152 extending in the X direction. That is, one pixel is the distance between the center of one of two adjacent nozzle holes of the plurality of nozzle holes 152 extending in the X direction and the center of the other. It is the distance between the center of one of the two ink dots and the center of the other. In the above description, the wiring 170 is formed by stacking two layers of metal

thin films

168a and 168b. , 5th and 7th layers of metal ink are ejected at predetermined positions according to the arrangement pattern, and 2nd, 4th and 6th layers of metal ink are ejected at positions shifted by 0.5 pixels in the X direction from the predetermined positions according to the arrangement pattern. Dispensed. In this way, the odd-numbered layers of metal ink are ejected at a predetermined position according to the array pattern, and the even-numbered layers of metal ink are ejected at a position shifted in the X direction by 0.5 pixel from the predetermined position according to the array pattern. Thus, wiring without gaps can be formed.

However, the odd-numbered metal thin films are ejected according to the array pattern at predetermined positions, and the even-numbered metal thin films are displaced from the predetermined positions by 0.5 pixel in the X direction with metal ink according to the array pattern. By ejecting ink, the width of the wiring increases depending on the direction in which the wiring extends. Specifically, as shown in FIG. 9, even if the even-numbered metal thin film is ejected at a position shifted in the X direction by 0.5 pixels from the ejection position of the odd-numbered metal ink, The wiring 170a extending in the X direction increases in length and distance corresponding to 0.5 pixel, but does not increase in width (=W1). On the other hand, the even-numbered metal thin film is ejected at a position shifted in the X direction by 0.5 pixel from the ejection position of the odd-numbered metal ink. Although the height does not change, the distance corresponding to 0.5 pixel and the width (=W2) become thicker. Thus, the width dimension (=W2) of the wiring 170b extending in the Y direction is thicker than the width dimension (=W1) of the wiring 170a extending in the X direction by a distance corresponding to 0.5 pixel.

In this way, if the width of the wiring increases depending on the direction in which the wiring extends, the thickening of the wiring may cause a short circuit. Further, it is not desirable to form a wiring with a width of W2 when the width of the wiring is W1 in the circuit design, because the wiring is not formed as designed. In view of this, the even-layer arrangement pattern in which the metal ink is ejected at a position shifted in the X direction by 0.5 pixel from the ejection position of the metal ink in the odd-numbered layer is the odd-numbered array pattern. The array pattern is obtained by removing one row of ink dots 160 positioned at the end in the X direction from the top. Specifically, for example, an odd-numbered layer arrangement pattern 180a is shown in FIG. Then, one line of ink dots (dotted line in FIG. 10) 160c positioned at the end in the X direction from the odd-numbered array pattern 180a is removed. As a result, as shown in FIG. 11, the even-layer array pattern 180b becomes an array pattern obtained by removing one line of ink dots 160c positioned at the end in the X direction from the odd-layer array pattern 180a. Then, the odd-numbered layers of metallic ink are ejected at predetermined positions according to the arrangement pattern 180a (FIG. 10), and the even-numbered layers of metallic ink are ejected at positions shifted by 0.5 pixels in the X direction from the prescribed positions. Wiring having the same width can be formed regardless of the direction in which the wiring extends by discharging according to (FIG. 11). That is, as shown in FIG. 12, the width (=W1) of the wiring 170b extending in the Y direction can be made the same as the width (=W1) of the wiring 170a extending in the X direction.

However, the even-layered array pattern 180b is an array pattern obtained by removing one row of ink dots 160c located at the end in the X direction from the odd-layered array pattern 180a, thereby making the wiring widths the same. However, the electrical quality of the wiring varies depending on the direction in which the wiring extends. Specifically, when the even-numbered array pattern 180b is an array pattern obtained by removing one row of ink dots 160c located at the end in the X direction from the odd-numbered array pattern 180a, the dots extend in the Y direction. One row of ink dots 160c in the width direction (X direction) is removed from the wiring 170b. On the other hand, in the wiring 170a extending in the X direction, one row of ink dots 160c in the length direction (X direction) is removed. That is, in the wiring 170a extending in the X direction, the ink dots 160c in the width direction (Y direction) are not removed. Therefore, the cross-sectional area in the width direction of the wiring 170b extending in the Y direction is smaller than the cross-sectional area of the wiring 170a extending in the X direction. Thus, if the cross-sectional area of the wiring 170b extending in the Y direction in the width direction differs from the cross-sectional area of the wiring 170a extending in the X direction, the resistance value and the like differ depending on the direction in which the wiring extends, and the electrical quality of the wiring is affected. changes.

In view of this, the array pattern of the even-numbered layer is not only the one row of ink dots 160c located at the end in the X direction from the array pattern 180a of the odd-numbered layer, but also the ink dot 160c located at the end in the X direction. An array pattern in which one line of ink dots is also removed is formed. Specifically, as shown in FIG. 13, one column of ink dots 160c located at the end in the X direction is removed from the array pattern 180a of the odd-numbered layer, and one row of ink dots located at the end in the Y direction is removed. The ink dot (chain line in FIG. 10) 160d is also removed. As a result, as shown in FIG. 14, the even-numbered array pattern 180c includes not only one row of ink dots 160c positioned at the end in the X direction from the odd-numbered array pattern 180a, but also a row of ink dots 160c located at the end in the Y direction. 1 line of ink dots 160d positioned at . Then, the odd-numbered layers of metallic ink are ejected at predetermined positions according to the array pattern 180a (FIG. 13), and the even-numbered layers of metallic ink are ejected at positions shifted by 0.5 pixel in the X direction from the predetermined positions, in the array pattern 180c. By discharging according to (FIG. 14), the cross-sectional area in the width direction of the wiring can be made the same regardless of the direction in which the wiring extends. Thereby, the electrical quality of the wiring 170b extending in the Y direction can be made the same as the electrical quality of the wiring 170a extending in the X direction. In other words, wiring with the same electrical quality can be formed regardless of the direction in which the wiring extends.

By the way, the controller 110 of the control device 28 has a first calculation section 200, a second calculation section 202, a first ejection section 204, and a second ejection section 206, as shown in FIG. The first calculation unit 200 is a functional unit for the controller 110 to calculate the odd-numbered layer array pattern 180a composed of a plurality of lines of ink dot arrays. The second calculation unit 202 removes one column of ink dots 160c and one row of ink dots 160d from the odd-numbered layer array pattern 180a, and removes 0.5 pixels from the odd-numbered layer metal ink ejection position in the X direction. It is a functional unit for calculating the shifted array pattern as the even-layer array pattern 180c. The first ejection section 204 is a functional section for ejecting the metal ink according to the odd-numbered array pattern 180a. The second ejection unit 206 displaces 0.5 pixels in the X direction from the ejection position of the odd-numbered metallic ink onto the metallic ink ejected to the odd-numbered layer according to the even-numbered array pattern 180c. It is a functional part for ejecting metal ink.

It should be noted that in the above embodiment, the control device 28 is an example of an information processing device. The nozzle hole 152 is an example of a nozzle hole. The first calculator 200 is an example of a first calculator. The second calculator 202 is an example of a second calculator. Also, the process executed by the first ejection section 204 is an example of the first ejection process. The process executed by the second ejection section 206 is an example of the second ejection process.

It should be noted that the present invention is not limited to the above embodiments, and can be implemented in various aspects with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above-described embodiment, 0.5 pixels from the ejection position of the metal ink on the odd-numbered layer according to the array pattern 180c obtained by removing one column of ink dots 160c and one row of ink dots 160d from the odd-numbered layer array pattern 180a. , the even-numbered layers of metal ink are ejected at positions shifted in the X direction. On the other hand, according to the array pattern 180b obtained by removing one row of ink dots 160c from the array pattern 180a of the odd-numbered layer, the even-numbered layer is shifted in the X direction by 0.5 pixels from the ejection position of the metal ink on the odd-numbered layer. of metal ink may be ejected. In such a case, although the electrical quality of the wiring varies depending on the direction in which the wiring extends, it is possible to form the wiring with the same width regardless of the direction in which the wiring extends.

In the above-described embodiment, the metal ink is ejected according to the even-layer array pattern 180c at a position shifted in the X direction by 0.5 pixels from the ejection position of the odd-numbered metal ink, but the amount of deviation is 1. Any interval narrower than a pixel is sufficient. Therefore, the metal ink may be ejected according to the even-layer arrangement pattern 180c at a position shifted in the X direction by a distance of more than 0 pixel and narrower than 1 pixel from the ejection position of the metal ink on the odd-number layer.

Further, in the above embodiment, the controller 110 of the control device 28 calculates the array pattern, and controls the operation of the first modeling unit 22 so that the metal ink is ejected according to the calculated array pattern. On the other hand, the arrangement pattern may be calculated in an information processing device different from the control device 28 . The arrangement pattern calculated by the information processing device is input to the control device 28, and the control device 28 controls the operation of the first molding unit 22 so that the metal ink is ejected according to the input arrangement pattern. good. That is, the information processing device may include the first calculation section 200 and the second calculation section 202 , and the controller 110 of the control device 28 may include the first discharge section 204 and the second discharge section 206 .

Also, in the above examples, the metal ink for forming the wiring is used as the metal-containing liquid, but various metal-containing liquids can be used as long as they contain fine metal particles. Specifically, for example, a conductive paste in which micrometer-sized metal fine particles are dispersed in a solvent can be employed as the metal-containing liquid.

28: Control device (information processing device) 152: Nozzle hole 200: First calculation unit 202: Second calculation unit 204: First discharge unit (first discharge process) 206: Second discharge unit (second discharge process)

Claims

a first ejection step of ejecting a metal-containing liquid containing fine metal particles in a first array pattern consisting of a plurality of rows of ink dots extending in a predetermined direction;
An array pattern obtained by removing one line of ink dots located at an end in the predetermined direction from the first array pattern on the metal-containing liquid ejected in the first ejecting step, and the first ejecting step a second ejection step of ejecting the metal-containing liquid to a position shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid;
A wiring forming method for forming wiring by laminating a plurality of layers of a metal-containing liquid.
The second discharging step includes
On the metal-containing liquid ejected in the first ejection step, not only the one row of ink dots from the first array pattern, but also one row of ink dots located at the end in the direction intersecting the predetermined direction 2. The wiring forming method according to claim 1, wherein the metal-containing liquid is ejected in an array pattern from which ink dots are removed.
The wiring forming method according to claim 1 or 2, wherein the predetermined direction is a longitudinal direction in which a plurality of nozzle holes for ejecting the metal-containing liquid are arranged.
A first array pattern consisting of a plurality of rows of ink dots extending in a predetermined direction is calculated as the array pattern of the N-th layer of metal ink when wiring is formed by laminating the metal-containing liquid containing metal fine particles. a first computing unit for
As the arrangement pattern of the (N+1)-th layer of metallic ink, one line of ink dots located at the end in the predetermined direction is removed from the first arrangement pattern, and the end in the direction intersecting the predetermined direction is removed. The array pattern obtained by removing one line of ink dots located in the first array pattern is shifted in the predetermined direction by a distance corresponding to an interval narrower than the pitch of the ink dots from the ejection position of the metal-containing liquid in the first array pattern. a second computing unit that computes the pattern;
Information processing device.