WO2023048016A1 - 樹脂組成物、遮光膜、および隔壁付き基板 - Google Patents

樹脂組成物、遮光膜、および隔壁付き基板 Download PDF

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Publication number
WO2023048016A1
WO2023048016A1 PCT/JP2022/034188 JP2022034188W WO2023048016A1 WO 2023048016 A1 WO2023048016 A1 WO 2023048016A1 JP 2022034188 W JP2022034188 W JP 2022034188W WO 2023048016 A1 WO2023048016 A1 WO 2023048016A1
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Prior art keywords
resin composition
group
light
substrate
partition walls
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Ceased
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PCT/JP2022/034188
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English (en)
French (fr)
Japanese (ja)
Inventor
飯塚英祐
諏訪充史
小林秀行
藤井真実
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Toray Industries Inc
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Toray Industries Inc
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Priority to KR1020247008749A priority Critical patent/KR20240058111A/ko
Priority to CN202280062985.3A priority patent/CN117957494A/zh
Priority to JP2022555633A priority patent/JP7823578B2/ja
Publication of WO2023048016A1 publication Critical patent/WO2023048016A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers

Definitions

  • the present invention relates to a resin composition, a light-shielding film formed from the resin composition, and a substrate with partition walls having patterned partition walls.
  • a color display device that includes a light source, a wavelength conversion section made of a wavelength conversion phosphor, a polarization separation means, and a polarization conversion means (for example, patent Reference 1).
  • a blue light source for example, a liquid crystal element, a phosphor that emits red fluorescence when excited by blue light, a phosphor that emits green fluorescence when excited by blue light, and a light scattering layer that scatters blue light.
  • a color display device including a conversion unit has been proposed (see, for example, Patent Document 2).
  • color filters containing color-converting phosphors such as those described in Patent Documents 1 and 2
  • high-definition display devices called 4K and 8K
  • the pixel size is small, the problem of brightness becomes significant, and higher brightness is required.
  • it is effective to separate the color-converting phosphors with highly reflective partition walls.
  • it is necessary to improve the light shielding property of the partition wall. Therefore, there is a demand for a barrier rib material that achieves both high reflectivity and high light-shielding properties.
  • barrier ribs having both high reflectivity and high light-shielding properties
  • the inventors first used a material obtained by adding a light-shielding pigment to a white barrier rib material using a titanium oxide white pigment that exhibits high reflectance. I considered how to do it.
  • the entire exposure light is absorbed by the white pigment and the light-shielding pigment, and the light does not reach the bottom of the film during exposure, resulting in poor pattern processability.
  • Patent Literatures 3 and 4 a technique has been proposed in which a specific metal compound is added to blacken the material by firing after pattern formation.
  • these blackening techniques require baking at 400° C. or higher, and there is a problem that the light-shielding property cannot be improved by heating at 250° C. or lower.
  • the inventors devised a design in which the exposure light is transmitted during the process of pattern exposure after film formation, and the light shielding property is increased after heating the exposed film at a temperature of 120°C or higher and 250°C or lower.
  • a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent is used. This was achieved by doing so (see Patent Document 5).
  • partition walls having high heat resistance can be formed by using polysiloxane as the resin.
  • pattern processing may be performed with a high exposure amount of about 300 to 500 mJ/cm 2 .
  • another problem that the line width of the formed barrier ribs is greatly increased has also been clarified.
  • the present invention provides a resin composition capable of forming a thick barrier rib that achieves both tackless properties after prebaking and heat resistance after curing, and which can be formed according to the designed line width of the photomask even during high-exposure processing. intended to
  • a photoradical generator a hindered phenol compound and/or a hindered amine compound, a polysiloxane containing a specific structure, a (meth)acrylic polymer containing a specific structure and/or A resin composition containing a cardo-based polymer containing a specific structure, wherein the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo-based polymer is 30/70 to 70/30.
  • barrier ribs By forming the barrier ribs with the composition, it is possible to form a thick barrier rib that achieves both tackless properties after prebaking and heat resistance after curing, and can be formed according to the designed line width of the photomask even during high-exposure processing. We found that and completed the present invention.
  • the present invention provides the following. [1] (i) a photoradical generator; (ii) a polysiloxane comprising a structure having an aromatic ring represented by the following general formula (1) or (2) and a structure having a photoradical polymerizable group represented by the following general formula (3); (iii) a (meth)acrylic polymer containing a structure having an aromatic ring represented by the following general formula (4) and a structure having a photoradical polymerizable group represented by the following general formula (5) and/or the following general a cardo-based polymer having a structure represented by formula (6) or the following general formula (7) and a photoradical polymerizable group; wherein the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo-based polymer is 30/70 to 70/30.
  • R 1 and R 2 each independently represent hydrogen, a hydroxy group, an alkoxy group, a group having a siloxane bond, or a monovalent organic group having 1 to 30 carbon atoms.
  • R 3 and R 4 each independently represent hydrogen, a hydroxy group or a monovalent organic group having 1 to 30 carbon atoms
  • R 5 to R 7 each independently represent hydrogen, a monovalent organic group having 1 to 30 carbon atoms, represents an aryl group having 6 to 20 carbon atoms or a group having an aromatic ring formed by adjacent R 5 to R 7.
  • R 8 represents hydrogen, a monovalent organic group having 1 to 30 carbon atoms, or a monovalent organic group having 1 to 30 carbon atoms.
  • X 1 , X 2 , X 3 and X 4 each independently represent an organic group having an aromatic ring
  • Y 1 and Y 2 each independently represent an organic group having a photoradical polymerizable group.
  • the polysiloxane has a weight-average molecular weight of 5,000 to 300,000, and 30 to 30 of the repeating units represented by the general formula (1) or (2)
  • the (A-1) patterned partition contains a resin, a white pigment, and a light-shielding pigment, and the light-shielding pigment includes titanium nitride, zirconium nitride, carbon black, a red pigment, and a blue pigment. and at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver.
  • A-2) patterned light shielding having an OD value of 0.5 or more per 1.0 ⁇ m of thickness
  • the substrate with partitions according to any one of [11] to [13], which has partitions.
  • a display device comprising the partition-attached substrate according to any one of [11] to [15] and a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini-LED cell and a micro-LED cell.
  • the resin composition of the present invention can form a fine thick-film barrier rib pattern that is excellent in tacklessness after prebaking and heat resistance after curing, and can be formed according to the designed line width of the photomask even during high-exposure processing.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions and a color-converting luminescent material;
  • FIG. 2 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention, which has patterned partitions, a color-converting luminescent material, and light-shielding partitions.
  • FIG. 2 is a cross-sectional view showing one embodiment of the substrate with partitions of the present invention, which has patterned partitions, a color-converting luminescent material, and a color filter.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions and a
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, and a low refractive index layer;
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer I.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer I.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a light-shielding partition, a color filter, a low refractive index layer, and an inorganic protective layer I.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer II.
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective
  • FIG. 2 is a cross-sectional view showing one embodiment of the substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a color filter, and an inorganic protective layer III and/or a yellow organic protective layer.
  • 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, an inorganic protective layer IV and/or a yellow organic protective layer;
  • FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions and light-emitting light sources selected from organic EL cells, mini-LED cells, and micro-LED cells.
  • FIG. 2 is a cross-sectional view showing the configuration of a display device used for color mixture evaluation in Examples.
  • the resin composition of the present invention can be suitably used as a material for forming a color-converting phosphor, a partition wall separating light sources selected from organic EL cells, mini-LED cells, and micro-LED cells.
  • the resin composition of the present invention comprises a photoradical generator, a hindered phenol compound and/or a hindered amine compound, a polysiloxane containing a specific structure, and a (meth)acrylic polymer containing a specific structure and/or a specific structure. It is preferable that the ratio of the weight of the polysiloxane to the total weight of the (meth)acrylic polymer and the cardo-based polymer is 30/70 to 70/30.
  • the resin composition of the present invention preferably has negative photosensitivity when used for pattern formation of partition walls (A-1) described below.
  • the resin composition of the present invention preferably contains a photoradical generator. By containing a photo-radical generator, it is possible to form partition walls having a highly precise pattern shape.
  • Any photoradical generator can be used as long as it decomposes and/or reacts with irradiation of light (including ultraviolet rays and electron beams) to generate radicals.
  • ⁇ -aminoalkylphenone compounds such as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4 phosphine oxide compounds such as ,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide; 1-phenyl-1,2-propanedione -2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione
  • oxime ester compounds which are resistant to oxygen damage and are effective for surface curability
  • phosphine which absorbs longer-wavelength light and generate radicals
  • It preferably contains an oxide compound.
  • the content of the photo-radical generator in the resin composition of the present invention is preferably 0.01% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of effectively promoting radical curing.
  • the content of the photo-radical generator is preferably 20% by weight or less, more preferably 10% by weight or less, based on the solid content.
  • the resin composition of the present invention preferably contains a hindered phenol compound and/or a hindered amine compound.
  • a hindered phenol compound and/or a hindered amine compound By containing a hindered phenol compound and/or a hindered amine compound, it is possible to moderately trap radicals, suppress overreaction, and suppress line width broadening when forming a barrier rib pattern with a high exposure dose.
  • a fine barrier rib pattern can be formed according to the designed line width of the mask.
  • the hindered phenol compound is preferably a hindered phenol compound having two or more hindered phenol groups in one molecule.
  • the hindered phenol group refers to a functional group containing a structure having at least one or more t-butyl groups at the carbon site adjacent to the carbon site to which the hydroxyl group of the phenolic hydroxyl group is bonded.
  • the hindered phenol group preferably has a structure having t-butyl groups at two carbon sites adjacent to the carbon site to which the hydroxyl group of the phenolic hydroxyl group is bonded.
  • a fine barrier rib pattern can be formed as follows. It is more preferable to have 3 or more hindered phenol groups in one molecule, and more preferably to have 4 or more hindered phenol groups in one molecule.
  • Hindered phenol compounds include, for example, 3,5-di-t-butyl-4-hydroxytoluene, octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, hexamethylenebis[3 (3,5-di-t-butyl-4-hydroxyphenylpropionate, thiodiethylenebis[3(3,5-di-t-butyl-4-hydroxyphenylpropionate, ethylenebis(oxyethylene)bis(3 -(5-t-butyl-4-hydroxy-m-tolyl)propionate, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-trimethyl-2, 4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, pentaerythritol tetrakis(3-(3,5-di-t-butyl-4
  • a hindered amine compound refers to a compound having at least one or more hindered amino groups in the molecule.
  • a hindered amino group is preferably a functional group having a secondary or tertiary amine structure bonded to two quaternary carbons.
  • the hindered amine compound is preferably a piperidine compound.
  • the radical trap effect is moderately limited, suppressing line width thickening when forming a barrier rib pattern with a high exposure dose, and forming a fine barrier rib pattern according to the designed line width of the photomask. can be done.
  • a piperidine compound having a 2,2,6,6-tetramethylpiperidine structure is more preferred.
  • Hindered amine compounds include, for example, bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalo bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, methyl-1,2,2,6,6-pentamethyl-4-piperidyl sebacate, 1,2,2,6, 6-pentamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-decanedioate Tetrakis(1,2,2,6,6-pentamethyl-4-pyridyl)butane-1,2,3,4-tetracarboxylate, reaction product of piperidinyl) ester with 1,1-dimethylethyl hydroperoxide and octane or t
  • 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate and 2,2,6,6-tetramethyl-4-piperidyl methacrylate which are piperidine compounds having a photopolymerizable group
  • piperidine compound having a photopolymerizable group By using a piperidine compound having a photopolymerizable group, a radical reaction proceeds while trapping radicals, and curing of the bottom of the film can be further promoted.
  • the photopolymerizable group may be photopolymerized in the partition walls (A-1) made of the photocured material of the negative photosensitive resin composition.
  • the content of the hindered phenol compound and/or hindered amine compound in the resin composition of the present invention is preferably 0.050% by weight or more, more preferably 0.070% by weight or more, based on the solid content, from the viewpoint of suppressing line thickening. preferable.
  • the content of the hindered phenol compound and/or the hindered amine compound is preferably 5.0% by weight or less, more preferably 3.0% by weight or less, based on the solid content.
  • the radical trapping effect is large, so it is more preferably 0.10% by weight or more and 0.50% by weight or less in the solid content.
  • a piperidine compound having a photopolymerizable group is used as the hindered amine compound, it is more preferably 0.10% by weight or more and 2.5% by weight or less from the viewpoint of accelerating the curing of the film bottom.
  • the resin composition of the present invention contains polysiloxane as a resin.
  • Polysiloxane has the function of improving the crack resistance, weather resistance and heat resistance of the partition walls.
  • the content of polysiloxane in the solid content of the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more, from the viewpoint of improving crack resistance of partition walls in heat treatment.
  • the content of polysiloxane in the solid content of the resin composition is preferably 55% by weight or less, more preferably 50% by weight or less.
  • the solid content means all the components excluding volatile components such as solvent among the components contained in the resin composition. The amount of solids can be determined by heating the resin composition to evaporate volatile components and weighing the residue.
  • Polysiloxane is a hydrolysis/dehydration condensate of organosilane.
  • Polysiloxane includes a structure having an aromatic ring represented by the following general formula (1) or (2) and a structure having a photoradical polymerizable group represented by the following general formula (3). Further, other repeating units may be included.
  • R 1 and R 2 each independently represent hydrogen, a hydroxy group, an alkoxy group, a group having a siloxane bond, or a monovalent organic group having 1 to 30 carbon atoms.
  • X 1 , X 2 and X 3 represent an organic group having an aromatic ring
  • Y 1 represents an organic group having a photoradical polymerizable group
  • a, b and c each independently represents an integer of 1 or more.
  • R 1 , R 2 , X 1 , X 2 , X 3 and Y 1 may be the same or different.
  • the "group having a siloxane bond" represented by R 1 or R 2 refers to a "--Si--O--Si--" bond generated by condensation of silanol groups.
  • the functional group bonded to the Si atom to which it is bonded is not particularly limited.
  • the "monovalent organic group having 1 to 30 carbon atoms" represented by R 1 or R 2 is preferably an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups). .
  • Preferred specific examples thereof include methyl group, ethyl group, n-propyl group and isopropyl group.
  • the “organic group having an aromatic ring” represented by X 1 , X 2 or X 3 is preferably an aromatic hydrocarbon group having 6 to 15 carbon atoms.
  • Preferable specific examples thereof include a phenyl group, a benzyl group, a styryl group, a naphthyl group and a biphenyl group.
  • the "radical photopolymerizable group” represented by Y1 is preferably an ethylenically unsaturated group, more preferably a functional group containing a methacrylic group and/or an acrylic group.
  • a, b, and c each independently represent an integer of 1 or more, a is preferably 10 to 60, more preferably 20 to 55, b is preferably 10 to 60, more preferably 20 to 55, c is preferably 5-60, more preferably 10-50.
  • the Tg of the polysiloxane can be improved, and the tackless property after prebaking can be improved. can be improved.
  • the content of the repeating unit represented by formula (1) or (2) is more preferably 25 mol % or more, still more preferably 30 mol % or more.
  • the content of the repeating unit represented by formula (1) or (2) is more preferably 75 mol % or less, even more preferably 70 mol % or less.
  • a bifunctional alkoxysilane containing two organic groups having an aromatic ring represented by general formula (2) It preferably contains a repeating unit derived from a compound.
  • the crack resistance can be further improved.
  • the content of the repeating unit represented by formula (2) is more preferably 15 mol % or more, and even more preferably 20 mol % or more.
  • the molecular weight of the polysiloxane can be sufficiently increased during polymerization, and the coatability can be improved.
  • the content of the repeating unit represented by formula (2) is more preferably 70 mol % or less.
  • the polysiloxane contains a repeating unit derived from an alkoxysilane compound containing an organic group having a photoradical polymerizable group represented by the general formula (3), the radicals generated from the photoradical generator in the exposed area can A cross-linking reaction proceeds and the degree of curing of the exposed portion can be increased.
  • the content of the repeating unit represented by formula (3) is more preferably 12 mol % or more, and even more preferably 15 mol % or more.
  • the content of the repeating unit represented by formula (3) is more preferably 75 mol % or less, even more preferably 70 mol % or less.
  • repeating units that may be contained in the polysiloxane include repeating units derived from an alkoxysilane compound containing an organic group having a cyclic ether group such as an epoxy group and/or an oxetanyl group, and an alkyl group having 1 to 30 carbon atoms. repeating units derived from an alkoxysilane compound containing an organic group having an acid anhydride, repeating units derived from an alkoxysilane compound containing an organic group having an acid anhydride, and repeating units derived from an alkoxysilane compound containing an organic group having a fluorine group. . These may not be contained, and if they are contained, their content is preferably 80 mol % or less, more preferably 70 mol % or less, of all repeating units.
  • the repeating units represented by the above general formulas (1), (2) and (3) are derived from alkoxysilane compounds represented by the following general formulas (8), (9) and (10), respectively. That is, the polysiloxane containing repeating units represented by the general formulas (1), (2) and (3) is an alkoxysilane compound represented by the following general formulas (8), (9) and (10) It can be obtained by hydrolyzing and polycondensing an alkoxysilane compound containing. Furthermore, other alkoxysilane compounds may be used.
  • R 1 , R 2 , X 1 , X 2 , X 3 and Y 1 are represented by general formulas (1), (2) and (3) respectively. represents the same group as R 1 , R 2 , X 1 , X 2 , X 3 and Y 1 in .
  • R 9 which may be the same or different, represents a monovalent organic group having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms.
  • the notation "-(OR 9 ) 2 " means that two "-(OR 9 )" are bonded to the Si atom. .
  • alkoxysilane compounds represented by general formula (8) include phenyltrimethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilanetolyltrimethoxysilane, biphenyltrimethoxysilane, and 3-trimethoxysilyl.
  • alkoxysilane compounds represented by general formula (8) include phenyltrimethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilanetolyltrimethoxysilane, biphenyltrimethoxysilane, and 3-trimethoxysilyl.
  • aromatic ring-containing alkoxysilane compounds such as propylphthalic anhydride, 3-triethoxysilylpropylphthalic anhydride, phenylmethyldimethoxysilane, phenylethyldimethoxysilane, phen
  • alkoxysilane compound represented by the general formula (9) examples include diphenyldimethoxysilane, 1-naphthylphenyldimethoxysilane, tolylphenyldimethoxysilane, biphenylphenyldimethoxysilane, 1-naphthyltolyldimethoxysilane, 1-naphthylbiphenyldimethoxysilane.
  • Alkoxysilane compounds containing two aromatic rings such as silanes are included. You may use 2 or more types of these.
  • diphenyldimethoxysilane, diphenyldiethoxysilane, styryltrimethoxysilane, and styryltriethoxysilane are preferred from the viewpoint of crack resistance and tacklessness.
  • alkoxysilane compounds represented by general formula (10) include vinyltrimethoxysilane, allyltrimethoxysilane, ⁇ -acryloylpropyltrimethoxysilane, ⁇ -acryloylpropyltriethoxysilane, and ⁇ -methacryloylpropyltrimethoxysilane.
  • ⁇ -methacryloylpropyltriethoxysilane vinylmethyldimethoxysilane, styrylmethyldimethoxysilane, ⁇ -methacryloylpropylmethyldimethoxysilane, ⁇ -acryloylpropylmethyldimethoxysilane, and other photoradical-polymerizable group-containing alkoxysilane compounds. You may use 2 or more types of these.
  • ⁇ -acryloylpropyltrimethoxysilane ⁇ -acryloylpropylmethyldimethoxysilane, ⁇ -methacryloylpropyltrimethoxysilane, and ⁇ -methacryloylpropylmethyldimethoxysilane are preferred from the viewpoint of photopolymerization reactivity.
  • the alkoxysilane compound represented by the general formula (10) contains a styryl group such as styryltrimethoxysilane or styryltriethoxysilane.
  • the alkoxysilane compound represented by general formula (8) or (9) may not be included. That is, when the polysiloxane contains a structure having a styryl group as the structure represented by general formula (3), it may not contain the structure represented by general formula (1) or (2).
  • alkoxysilane compound represented by the general formula (8) when a styryl group-containing alkoxysilane compound such as styryltrimethoxysilane or styryltriethoxysilane is used as the alkoxysilane compound represented by the general formula (8), it may also be represented by the general formula (10).
  • the alkoxysilane compound may not be included. That is, when polysiloxane contains a structure having a styryl group as the structure represented by general formula (1), it may not contain the structure represented by general formula (3).
  • the content of repeating units containing a structure having a styryl group is preferably 12 mol % or more, more preferably 15 mol % or more, from the viewpoint of improving tacklessness after prebaking.
  • the content of repeating units containing a structure having a styryl group is more preferably 70 mol% or less, and 60 mol% or less. is more preferred.
  • alkoxysilane compounds include, for example, dimethyldimethoxysilane, ethylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl).
  • ethylmethyldimethoxysilane 2-(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldimethoxysilane, Bifunctional alkoxy compounds such as fluoropropylethyldimethoxysilane; methyltrimethoxysilaneethyltrimethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane trifunctional alkoxysilane compounds such as silane, 3-ureidopropyltrimeth
  • the other alkoxysilane compound preferably contains at least one carboxyl group-containing alkoxysilane compound. Containing a carboxyl group-containing alkoxysilane compound improves the solubility of the unexposed area, and can improve the resolution during pattern processing.
  • the weight average molecular weight (Mw) of polysiloxane is preferably 1,000 or more, more preferably 2,000 or more, from the viewpoint of coating properties. From the viewpoint of tacklessness, it is more preferably 5,000 or more. On the other hand, from the viewpoint of developability, Mw of polysiloxane is preferably 500,000 or less, more preferably 300,000 or less.
  • the Mw of polysiloxane in the present invention refers to a polystyrene conversion value measured by gel permeation chromatography (GPC). The measuring method is as described in Examples below.
  • Polysiloxane can be obtained by hydrolyzing the aforementioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence or absence of a solvent.
  • Various conditions for hydrolysis can be set according to physical properties suitable for the intended use, taking into consideration the reaction scale, the size and shape of the reaction vessel, and the like.
  • Various conditions include, for example, acid concentration, reaction temperature, and reaction time.
  • Acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acids and their anhydrides, and ion exchange resins can be used for the hydrolysis reaction.
  • an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferred.
  • the amount of the acid catalyst added is 0.05 parts by weight with respect to 100 parts by weight of all the alkoxysilane compounds used in the hydrolysis reaction, from the viewpoint of making the hydrolysis proceed more rapidly. part or more is preferable, and 0.1 part by weight or more is more preferable.
  • the amount of the acid catalyst to be added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less with respect to 100 parts by weight of all the alkoxysilane compounds.
  • the total amount of alkoxysilane compound means the amount including all of the alkoxysilane compound, its hydrolyzate and its condensate. The same shall apply hereinafter.
  • a hydrolysis reaction can be performed in a solvent.
  • the solvent can be appropriately selected in consideration of the stability, wettability, volatility, etc. of the resin composition.
  • hydrolysis can be performed without a solvent.
  • the dehydration condensation reaction for example, there is a method of heating the silanol compound solution obtained by the hydrolysis reaction of the organosilane compound as it is.
  • the heating temperature is preferably 50° C. or higher and the boiling point of the solvent or lower, and the heating time is preferably 1 to 100 hours.
  • reheating or addition of a base catalyst may be performed in order to increase the degree of polymerization of polysiloxane.
  • an appropriate amount of the alcohol produced may be distilled off under heating and/or under reduced pressure, and then a suitable solvent may be added.
  • the resin composition of the present invention further includes, as a resin, a structure having an aromatic ring represented by the general formula (4) and a structure having a photoradical polymerizable group represented by the general formula (5) (meta ) contains an acrylic polymer and/or a cardo-based polymer having a structure represented by the general formula (6) or the general formula (7) and a photoradical polymerizable group.
  • the (meth)acrylic polymer and/or cardo-based polymer has the function of improving tacklessness after prebaking.
  • the content of the (meth)acrylic polymer and/or cardo-based polymer in the solid content of the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more, from the viewpoint of improving tacklessness after prebaking. .
  • the content of the (meth)acrylic polymer and/or cardo-based polymer in the solid content of the resin composition is preferably 55% by weight or less, more preferably 50% by weight or less. preferable.
  • the (meth)acrylic polymer is preferably a radical polymerized (meth)acrylic compound and/or a styrene compound.
  • the radical polymerization catalyst is not particularly limited, and azo compounds such as azobisisobutyronitrile and organic peroxides such as benzoyl peroxide are generally used.
  • the conditions for radical polymerization can be set as appropriate. For example, a (meth)acrylic compound and/or styrene compound and a radical polymerization catalyst are added in a solvent, and the reaction vessel is sufficiently filled by bubbling or vacuum degassing. After purging with nitrogen, it is preferable to react at 60 to 110° C. for 30 to 300 minutes. Moreover, you may use chain transfer agents, such as a thiol compound, as needed.
  • the (meth)acrylic polymer has an ethylenically unsaturated bond
  • the (meth)acrylic polymer has an ethylenically unsaturated double bond group after radical polymerization of a (meth)acrylic compound and/or a styrene compound, for example.
  • Those obtained by addition reaction of glycidyl compounds are preferred.
  • the catalyst used for the addition reaction of the glycidyl compound having an ethylenically unsaturated double bond group is not particularly limited, and known catalysts can be used.
  • Examples include dimethylaniline, 2,4,6-tris(dimethylaminomethyl ) Phenol, amino catalysts such as dimethylbenzylamine, tin catalysts such as tin (II) 2-ethylhexanoate and dibutyltin laurate, titanium catalysts such as titanium (IV) 2-ethylhexanoate, triphenylphosphine Phosphorus-based catalysts such as acetylacetonate chromium and chromium-based catalysts such as chromium chloride are used.
  • a phosphorus-based catalyst is preferable from the viewpoint of improving the storage stability of polysiloxane.
  • the (meth)acrylic polymer used in the resin composition of the present invention includes a structure represented by the following general formula (4) and a structure represented by the following general formula (5). Other structures may be included.
  • R 3 and R 4 each independently represent hydrogen, a hydroxy group, or a monovalent organic group having 1 to 30 carbon atoms.
  • X 4 represents an organic group having an aromatic ring.
  • Y 2 represents an organic group having a radically photopolymerizable group, d and e each independently represent an integer of 1 or more, and when d and e are 2 or more, a plurality of R 3 , R 4 and X 4 , and Y2 may be the same or different.
  • the “monovalent organic group having 1 to 30 carbon atoms” represented by R 3 or R 4 is preferably an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups).
  • Preferred specific examples thereof include methyl group, ethyl group, n-propyl group and isopropyl group.
  • the “organic group having an aromatic ring” represented by X 4 is preferably an aromatic hydrocarbon group having 6 to 15 carbon atoms.
  • Preferable specific examples thereof include a phenyl group, a benzyl group, a styryl group, a naphthyl group and a biphenyl group.
  • the "organic group having a photoradical polymerizable group” represented by Y2 an ethylenically unsaturated group is preferable, and a functional group containing a methacrylic group and/or an acrylic group is more preferable.
  • d and e each independently represent an integer of 1 or more; d is preferably 10-60, more preferably 20-50; e is preferably 5-60, more preferably 10-50.
  • the repeating unit represented by general formula (4) is derived from a (meth)acrylic acid compound and/or a styrene compound containing an organic group having an aromatic ring. By containing an organic group having an aromatic ring, tacklessness can be improved.
  • the (meth)acrylic polymer preferably contains 10 to 80 mol% of repeating units represented by general formula (4) in all repeating units.
  • the content of the repeating unit represented by formula (4) is more preferably 15 mol % or more, and even more preferably 20 mol % or more.
  • the content of the repeating unit represented by formula (4) is more preferably 75 mol % or less, even more preferably 70 mol % or less.
  • Examples of (meth)acrylic acid compounds containing an organic group having an aromatic ring include phenyl (meth)acrylate, benzyl (meth)acrylate, tolyl (meth)acrylate, naphthyl (meth)acrylate, and the like.
  • Examples of styrene compounds include p-methylstyrene, o-methylstyrene, m-methylstyrene, ⁇ -methylstyrene and the like. Among these, styrene is preferred. By copolymerizing styrene, the heat resistance and moist heat resistance of the resulting cured film are improved.
  • the repeating unit represented by formula (5) preferably has an ethylenically unsaturated group as a radically photopolymerizable group.
  • an ethylenically unsaturated group as the photoradical polymerizable group, a crosslinking reaction proceeds with radicals generated from the photoradical generator in the exposed area, and the degree of curing in the exposed area can be increased.
  • the (meth)acrylic polymer contains 10 to 80 mol % of repeating units represented by the general formula (5) in all repeating units. By including 10 mol % or more of the repeating unit represented by the general formula (5), radical cross-linking between resins in the film can be efficiently advanced, and the degree of curing of the film can be improved.
  • the content of the repeating unit represented by formula (5) is more preferably 15 mol % or more, and even more preferably 20 mol % or more.
  • the content of the repeating unit represented by formula (5) is more preferably 75 mol % or less, even more preferably 70 mol % or less.
  • ethylenically unsaturated groups examples include vinyl groups, allyl groups, acrylic groups, and methacrylic groups.
  • the carboxylic acid group of the acrylic (co)polymer may be an ethylenically unsaturated compound or (meth)
  • a common method is to add acrylic acid chloride.
  • an isocyanate can be used to add a compound having an ethylenically unsaturated group.
  • Examples of the ethylenically unsaturated compound having a glycidyl group and acrylic acid or methacrylic acid chloride herein include glycidyl (meth)acrylate, ⁇ -ethylglycidyl (meth)acrylate, ⁇ -n-(meth)acrylate, Propylglycidyl, ⁇ -n-butylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, ⁇ -ethyl-6 (meth)acrylate, 7-epoxyheptyl, allyl glycidyl ether, vinyl glycidyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, ⁇ -methyl-o-viny
  • repeating units in the (meth)acrylic polymer preferably contain a carboxyl group and/or an acid anhydride group.
  • a carboxyl group and/or an acid anhydride group By containing a carboxyl group and/or an acid anhydride group, the solubility contrast between the exposed area and the unexposed area is increased, and the patterning resolution is improved.
  • (Meth)acrylic compounds containing a carboxyl group and/or an acid anhydride group include (meth)acrylic acid, (meth)acrylic anhydride, itaconic acid, itaconic anhydride, succinic acid mono(2-acryloyloxy ethyl), mono(2-acryloyloxyethyl) phthalate, mono(2-acryloyloxyethyl) tetrahydrophthalate, and the like. You may use 2 or more types of these.
  • repeating units in the (meth)acrylic polymer may not be contained, and if they are contained, the content thereof is preferably 90 mol% or less, more preferably 80 mol% or less of all repeating units. is.
  • Mw weight average molecular weight
  • the weight average molecular weight (Mw) of the (meth)acrylic polymer is not particularly limited, it is preferably 2,000 or more and 200,000 or less in terms of polystyrene measured by gel permeation chromatography (GPC). By setting Mw within the above range, good coating properties can be obtained, and the solubility of unexposed areas in a developer during pattern formation is also good.
  • the (meth)acrylic polymer used in the resin composition of the present invention may be synthesized according to the synthesis examples described later, or may be a commercially available product.
  • Commercially available (meth)acrylic polymers include, for example, AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, AX3-BX-TR- 108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3-RD-TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nippon Shokubai Co., Ltd.), SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X (trade name, Showa Denko Co., Ltd.), X-40
  • the cardo-based polymer used in the resin composition of the present invention contains a structure represented by the following general formula (6) or the following general formula (7) and a photoradical polymerizable group. Other structures may be included.
  • R 5 to R 7 are hydrogen, monovalent organic groups having 1 to 30 carbon atoms, aryl groups having 6 to 20 carbon atoms, or adjacent R 5 to R 7 represents a group in which the formed ring is an aromatic ring
  • R 8 represents hydrogen, a monovalent organic group having 1 to 30 carbon atoms, or an aryl group having 6 to 20 carbon atoms
  • p, q, and r represent 0 to 2
  • s represents an integer of 1 to 2.
  • f to g each independently represent an integer of 1 or more.When f to g are 2 or more, a plurality of R 5 , R 6 , R 7 and Each R8 may be the same or different.
  • the "monovalent organic group having 1 to 30 carbon atoms” is preferably an alkyl group having 1 to 6 carbon atoms (including linear and branched alkyl groups). Preferred specific examples thereof include methyl group, ethyl group, n-propyl group and isopropyl group.
  • aryl group having 6 to 20 carbon atoms an aromatic hydrocarbon group having 6 to 15 carbon atoms is preferable.
  • R 5 , R 6 and R 7 are preferably hydrogen, and R 8 is preferably a phenyl group.
  • f and g each independently represent an integer of 1 or more; f is preferably 2-60, more preferably 3-50; e is preferably 2-60, more preferably 3-50.
  • an ethylenically unsaturated group is preferred.
  • a crosslinking reaction proceeds with radicals generated from the photoradical generator in the exposed area, and the degree of curing of the exposed area can be increased.
  • Ethylenically unsaturated groups include, for example, vinyl groups, allyl groups, styryl groups, acryl groups, methacryl groups, and the like.
  • Functional groups containing styryl, methacryl, acryl groups are preferred.
  • a preferred specific example is a functional group obtained by adding glycidyl methacrylate and/or glycidyl acrylate to a carboxylic acid group.
  • the cardo-based polymer used in the resin composition of the present invention preferably contains an alkali-soluble group as "another structure".
  • the alkali-soluble group preferably contains a carboxyl group and/or an acid anhydride group.
  • the weight average molecular weight (Mw) of the cardo-based polymer is not particularly limited, it is preferably 2,000 or more and 200,000 or less in terms of polystyrene measured by gel permeation chromatography (GPC) described later. By setting Mw within the above range, good coating properties can be obtained, and the solubility of unexposed areas in a developer during pattern formation is also good.
  • the cardo-based polymer used in the resin composition of the present invention may be synthesized and used, or a commercially available product may be used.
  • Commercially available cardo-based polymers include, for example, "Oxol” (registered trademark) CR-TR, CR-TR2, CR-TR3, CR-TR4, CR-TR5, CR-TR6 (these are trade names, Osaka Gas Chemicals ( Ltd.), INR-16 (trade name, manufactured by Nagase Chemtech Co., Ltd.), V-259ME (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), WR-301 (trade name, manufactured by ADEKA Corporation) etc.
  • V-259ME and WR-301 containing a structure represented by the general formula (6) or the general formula (7), a photoradical polymerizable group, and an alkali-soluble group are preferable. Two or more of these may be used.
  • the resin composition of the present invention preferably contains, as a resin, the total weight of the aforementioned polysiloxane and the aforementioned (meth)acrylic polymer and cardo-based polymer in a ratio of 30/70 to 70/30. By containing in this ratio, it is possible to achieve both high heat resistance derived from polysiloxane and tacklessness of the prebaked film derived from (meth)acrylic polymer and/or cardo-based polymer.
  • the ratio of the weight of polysiloxane to the total weight of (meth)acrylic polymer and cardo-based polymer is more preferably 35/65 to 65/35, more preferably 40/60 to 60/40.
  • the (meth)acrylic polymer and/or cardo-based polymer preferably has a glass transition temperature of 60°C or higher.
  • a high glass transition temperature can improve the tacklessness of the pre-baked film.
  • 65° C. or higher is more preferable.
  • the glass transition temperature can be measured as described in Examples below.
  • the resin composition of the present invention preferably further contains a white pigment.
  • a white pigment has a function of further improving the reflectance of the partition wall.
  • white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds thereof. You may contain 2 or more types of these. Among these, titanium dioxide is preferable because of its high reflectance and easy industrial use.
  • the crystal structure of titanium dioxide is classified into anatase, rutile and brookite types. Among these, rutile-type titanium oxide is preferable because of its low photocatalytic activity.
  • the white pigment may be surface-treated. Surface treatment with a metal oxide containing a metal selected from Al, Si and Zr is preferable, and the light resistance and heat resistance of the formed partition walls can be improved.
  • the average primary particle size of the white pigment is preferably from 100 to 500 nm, more preferably from 150 nm to 350 nm, from the viewpoint of further improving the reflectance of the partition walls.
  • the average primary particle size of the white pigment can be measured by a laser diffraction method using a particle size distribution analyzer (N4-PLUS; manufactured by Beckman Coulter, Inc.).
  • Titanium dioxide pigments preferably used as white pigments include, for example, R960 manufactured by DuPont (rutile type, SiO 2 /Al 2 O 3 treatment, average primary particle size 210 nm), CR-97 manufactured by Ishihara Sangyo Co., Ltd. (rutile type, Al 2 O 3 /ZrO 2 treatment, average primary particle size 250 nm), and the like. You may contain 2 or more types of these.
  • the content of the white pigment in the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more, based on the solid content.
  • the content of the white pigment is preferably 60% by weight or less, more preferably 55% by weight or less in the solid content.
  • the resin composition of the present invention further comprises a light-shielding pigment and/or an organometallic compound (hereinafter referred to as "organometallic compound") containing at least one metal selected from the group consisting of silver, gold, platinum and palladium. may be used) is preferably contained.
  • organometallic compound an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium. may be used.
  • the light-shielding pigment and the organometallic compound have the function of further improving the light-shielding properties of the partition walls.
  • the light-shielding pigment preferably contains a black pigment from the viewpoint of improving light-shielding properties.
  • black pigments include black organic pigments, mixed-color organic pigments, and black inorganic pigments.
  • black organic pigments include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with resin.
  • Mixed-color organic pigments include, for example, pseudo-black pigments obtained by mixing two or more pigments selected from red, blue, green, purple, yellow, magenta, cyan, and the like.
  • a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both a moderately high OD value and pattern workability.
  • the weight ratio of the red pigment and the blue pigment in the mixed pigment is preferably 20/80 to 80/20, more preferably 30/70 to 70/30. Specific examples of representative pigments are shown below by color index (CI) number.
  • red pigments include Pigment Red (hereinafter abbreviated as PR) 9, PR177, PR215, and PR254. You may contain 2 or more types of these.
  • Examples of blue pigments include Pigment Blue (hereinafter abbreviated as PB) 15, PB15:4, and PB15:6. You may contain 2 or more types of these.
  • Black inorganic pigments include, for example, graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxides; Metal sulfides; metal nitrides; metal oxynitrides; metal carbides and the like. You may contain 2 or more types of these.
  • pigments selected from titanium nitride, zirconium nitride, carbon black, and mixed pigments of red and blue pigments in a weight ratio of 20/80 to 80/20 are preferred because they have high light-shielding properties. preferable.
  • the content of the light-shielding pigment in the resin composition is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, based on the solid content, from the viewpoint of improving light-shielding properties.
  • the content of the light-shielding pigment is preferably 5% by weight or less, more preferably 3% by weight or less, based on the solid content.
  • the resin composition of the present invention may contain a light-shielding pigment other than the black pigment in order to improve the light-shielding property of a specific wavelength.
  • Other light-shielding pigments include, for example, red pigments, blue pigments, purple pigments, green pigments, yellow pigments, and the like. You may contain 2 or more types of these.
  • the organometallic compound decomposes and aggregates in the exposure step and/or the heating step to become black particles or yellow particles, which light-shield the partition walls (A-1) described later. It has the function of improving the quality (OD value). Since the OD value is low before exposure and the OD value increases after pattern formation, the exposed light can be sufficiently transmitted to the bottom in the exposure process to cause photocuring or photodecomposition. If a pattern is formed in advance using a resin composition containing a large amount of a light-shielding pigment in order to form partition walls (A-1) with a high OD value, photocuring at the bottom tends to be insufficient.
  • the shape of the obtained partition (A-1) tends to be a reverse tapered shape.
  • the taper angle can be easily set within the preferred range described later, since sufficient photocuring is performed up to the bottom.
  • organometallic compounds include silver-containing organometallic compounds such as silver neodecanoate, silver octylate, and silver salicylate; organometallic compounds containing gold, such as chloro(triphenylphosphine)gold; ) organometallic compounds containing platinum such as platinum and dichlorobis(triphenylphosphine)platinum; organometallic compounds containing bis(acetylacetonato)palladium and dichlorobis(triphenylphosphine)palladium palladium; You may contain 2 or more types of these.
  • organometallic compounds include silver-containing organometallic compounds such as silver neodecanoate, silver octylate, and silver salicylate; organometallic compounds containing gold, such as chloro(triphenylphosphine)gold; ) organometallic compounds containing platinum such as platinum and dichlorobis(triphenylphosphine)platinum; organometallic compounds
  • an organometallic compound containing silver such as silver neodecanoate, silver octylate, and silver salicylate is contained, it decomposes and aggregates in the exposure process and/or the heating process to generate nanosilver particles, resulting in a yellow color.
  • an organometallic compound containing platinum such as bis(acetylacetonato)platinum or an organometallic compound containing palladium such as bis(acetylacetonato)palladium is contained, decomposition and/or Agglomeration produces palladium oxide and turns black.
  • silver neodecanoate and bis(acetylacetonato)palladium are preferable from the viewpoint of further improving the OD value.
  • the content of the organometallic compound in the solid content is preferably 0.2 to 5% by weight.
  • the OD value of the obtained partition wall can be further improved.
  • the content of the organometallic compound is more preferably 0.5% by weight or more.
  • the reflectance can be further improved.
  • the resin composition of the present invention preferably further contains a coordinating compound having a phosphorus atom (hereinafter sometimes referred to as "coordinating compound").
  • the coordinating compound coordinates to the organometallic compound in the resin composition, improves the solubility of the organometallic compound in a solvent, promotes the decomposition of the organometallic compound, and further improves the OD value of the obtained partition walls.
  • coordinating compounds include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tris(O-tolyl)phosphine and the like. You may contain 2 or more types of these.
  • the content of the coordinating compound in the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents relative to the organometallic compound.
  • the resin composition of the present invention preferably further contains a photopolymerizable compound.
  • the photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in its molecule.
  • a radical cross-linking reaction can occur with (meth)acrylic groups in the resin, and the degree of curing of the film can be improved.
  • the photopolymerizable compound preferably has a (meth)acrylic group.
  • photopolymerizable compounds include 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, penta Erythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, tripentaerythritol heptamethacrylate, tripentaery
  • the content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more based on the solid content.
  • the content of the photopolymerizable compound is preferably 50% by weight or less in the solid content.
  • the resin composition of the present invention preferably contains a liquid-repellent compound having a photopolymerizable group.
  • a liquid-repellent compound is a compound that imparts the property of repelling water and organic solvents (liquid-repellent performance) to a resin composition.
  • the compound is not particularly limited as long as it has such properties, but specifically, a compound having a fluoroalkyl group is preferably used.
  • liquid-repellent performance can be imparted to the top of the partition walls (A-1) described later after the partition walls (A-1) are formed.
  • color-converting light-emitting materials having different compositions can be easily applied to each pixel.
  • a liquid-repellent compound refers to a compound having a fluoroalkyl or fluoroalkylene group at the terminal, main chain and/or side chain.
  • the liquid-repellent compound contained in the resin composition of the present invention is more preferably a liquid-repellent compound having a photopolymerizable group because it can form a strong bond with the resin.
  • Liquid-repellent compounds having a photopolymerizable group include, for example, “Megafac” (registered trademark) RS-72-A, RS-75-A, RS-56, RS-90 (trade names, DIC Corporation ) made) and the like.
  • the photopolymerizable group may be photopolymerized in the partition walls (A-1) made of the photocured product of the negative photosensitive resin composition.
  • the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, based on the solid content. more preferred.
  • the content of the liquid-repellent compound is preferably 10% by weight or less, more preferably 5% by weight or less, based on the solid content.
  • the resin composition of the present invention may contain surfactants, adhesion improvers, etc., if necessary.
  • a surfactant include "Megafac” (registered trademark) F445, F470, F475, F477 (trade names, manufactured by DIC Corporation), NBX-15, FTX-218 (trade names, ( Neos Co., Ltd.) and other fluorine-based surfactants; "BYK” (registered trademark)-333, 352, 301 (trade names, BYK Chemie Japan Co., Ltd.) and other silicone-based surfactants; polyalkylene Examples include oxide-based surfactants; poly(meth)acrylate-based surfactants; You may contain 2 or more types of these.
  • adhesion improvers include alicyclic epoxy compounds and silane coupling agents. Among these, alicyclic epoxy compounds are preferred from the viewpoint of heat resistance.
  • Examples of alicyclic epoxy compounds include 3′,4′-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(hydroxymethyl)-1-butanol and 1,2-epoxy- 4-(2-oxiranyl)cyclohexane adduct, ⁇ -caprolactone-modified 3′,4′-epoxycyclohexylmethyl 3′,4′-epoxycyclohexane carboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ⁇ -caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, diglycidyl 1,4-cyclohexanedicarboxylate, diglycidyl ether of 1,4-cyclohexanedimethanol and the like. You may contain 2 or more types of these
  • the content of the adhesion improving agent in the resin composition of the present invention is preferably 0.1% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of further improving the adhesion to the underlying substrate.
  • the content of the adhesion improver is preferably 20% by weight or less, more preferably 10% by weight or less, in the solid content from the viewpoint of pattern processability.
  • the resin composition of the present invention preferably further contains a solvent.
  • the solvent has the function of adjusting the viscosity of the resin composition to a range suitable for application and improving the uniformity of the partition walls.
  • As the solvent it is preferable to combine a solvent having a boiling point of more than 150° C. and 250° C. or less under atmospheric pressure and a solvent having a boiling point of 150° C. or less.
  • solvents include alcohols such as isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether.
  • ketones such as methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, Acetates such as methyl lactate, ethyl lactate and butyl lactate can be mentioned. You may contain 2 or more types of these. Among these, it is preferable to combine diacetone alcohol as a solvent with a boiling point of more than 150° C. and 250° C. or less under atmospheric pressure and propylene glycol monomethyl ether as a solvent with a boiling point of 150° C. or less from the viewpoint of coating properties.
  • the content of the solvent can be arbitrarily set according to the application method.
  • the content of the solvent is generally 50% by weight or more and 95% by weight or less in the resin composition.
  • the resin composition of the present invention can be produced, for example, by mixing the photo-radical generator, polysiloxane, (meth)acrylic polymer and/or cardo-based polymer and, if necessary, other components.
  • the light shielding film of the present invention will be described.
  • the light-shielding film of the present invention is obtained by curing the resin composition of the present invention described above.
  • the light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel, such as a decorative pattern for a cover base material, in addition to the barrier ribs (A-1) described later.
  • the film thickness of the light shielding film is preferably 10 ⁇ m or more.
  • the method for producing a light-shielding film of the present invention includes a film-forming step of applying the resin composition of the present invention on a base substrate and drying to obtain a dry film, an exposure step of pattern-exposing the obtained dry film, and a It is preferable to have a developing step of dissolving and removing a portion of the dry film that is soluble in a developer, and a heating step of heating and curing the dry film after development.
  • Examples of the method of applying the resin composition in the film-forming step include a slit coating method and a spin coating method.
  • Examples of the drying device include a hot air oven and a hot plate.
  • the drying time is preferably 80 to 120° C., preferably 1 to 15 minutes.
  • the exposure step is a step of photocuring the necessary portion of the dry film by exposure or photolyzing the unnecessary portion of the dry film to make any portion of the dry film soluble in the developer. .
  • exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask.
  • Examples of the exposure device include a proximity exposure machine.
  • Ultraviolet rays are preferable as the actinic rays irradiated in the exposure step.
  • the light source include high-pressure mercury lamps, ultra-high-pressure mercury lamps, and halogen lamps, with ultra-high-pressure mercury lamps being preferred.
  • Exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. In general, it is preferable to perform exposure using an ultra-high pressure mercury lamp with an output of 1 to 100 mW/cm 2 and an exposure amount of 1 to 10,000 mJ/cm 2 .
  • the developer-soluble portion of the dry film after exposure is dissolved and removed with the developer, leaving only the developer-insoluble portion, and the dry film patterned in an arbitrary pattern shape (hereinafter referred to as , which is called a pre-heating pattern).
  • the pattern shape includes, for example, a lattice shape, a stripe shape, a hole shape, and the like.
  • the developing method includes, for example, an immersion method, a spray method, a brush method, and the like.
  • the developer a solvent capable of dissolving the unnecessary portion of the dry film after exposure can be appropriately selected, and an aqueous solution containing water as the main component is preferable.
  • the developer is preferably an alkaline aqueous solution.
  • alkaline aqueous solutions include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; and organic alkaline aqueous solutions such as tetramethylammonium hydroxide.
  • a potassium hydroxide aqueous solution or a tetramethylammonium hydroxide aqueous solution is preferable from the viewpoint of improving resolution.
  • the developer may contain a surfactant.
  • the developing temperature is preferably 20 to 50° C. in order to facilitate process control.
  • the heating process is a process of heating and curing the preheated pattern formed in the developing process. Examples of heating devices include hot plates and ovens.
  • the heating temperature is preferably 250° C. or less from the viewpoint of suppressing the generation of cracks in the heated film.
  • the heating time is preferably 15 minutes to 2 hours.
  • the heating temperature is preferably 150° C. or higher from the viewpoint of further improving the OD value.
  • the substrate with partition walls of the present invention has (A-1) patterned partition walls (hereinafter sometimes referred to as “partition walls (A-1)”) formed on an underlying substrate.
  • the underlying substrate functions as a support for the substrate with partition walls.
  • the partition has a function of suppressing color mixture of light between adjacent pixels.
  • the partition walls (A-1) have a reflectance of 10% to 60% per 10 ⁇ m thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 ⁇ m thickness at a wavelength of 450 nm.
  • the reflectance is set to 10% or more and the OD value to 3.0 or less, (A-1) the luminance of the display device can be improved by utilizing the reflection on the side surface of the partition wall.
  • FIG. 1 shows a cross-sectional view of one embodiment of the substrate with partitions of the present invention having patterned partitions.
  • a base substrate 1 has partition walls 2 patterned thereon.
  • the base substrate examples include a glass plate, a resin plate, and a resin film.
  • Non-alkali glass is preferable as the material of the glass plate.
  • Polyester, (meth)acrylic polymer, transparent polyimide, polyethersulfone, and the like are preferable as materials for the resin plate and resin film.
  • the thickness of the glass plate and the resin plate is preferably 1 mm or less, and preferably 0.8 mm or less.
  • the thickness of the resin film is preferably 100 ⁇ m or less.
  • the barrier rib (A-1) preferably has a reflectance of 10% to 60% per 10 ⁇ m thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 ⁇ m thickness at a wavelength of 450 nm.
  • the thickness of the partition (A-1) refers to the height of the partition (A-1) and/or the width of the partition (A-1).
  • the height of the partition (A-1) refers to the length of the partition (A-1) in the direction perpendicular to the base substrate (height direction). In the case of the substrate with partition walls shown in FIG. 1, the height of the partition walls 2 is represented by symbol H.
  • the width of the partition (A-1) refers to the length of the partition (A-1) in the direction horizontal to the base substrate.
  • the width of the partition walls 2 is represented by symbol L.
  • "height” may be called “thickness.”
  • the reflectance on the side surface of the partition wall contributes to the improvement of the luminance of the display device, and the light shielding property contributes to the suppression of color mixture.
  • the present invention focuses on the reflectance and OD value per thickness of the partition walls.
  • the thickness (height) of the partition (A-1) is preferably 0.5 to 100 ⁇ m, and the width is preferably 1 to 100 ⁇ m. Therefore, in the present invention, 10 ⁇ m is selected as a representative value of the thickness of the partition (A-1), and the reflectance and OD value per 10 ⁇ m of thickness are focused on.
  • the reflectance per 10 ⁇ m thickness of the barrier ribs (A-1) at a wavelength of 550 nm is less than 10%, the visible light reflection on the side walls of the barrier ribs becomes small, resulting in insufficient brightness of the display device.
  • the reflectance per 10 ⁇ m thickness at a wavelength of 550 nm is preferably 10% or more, more preferably 20% or more, and even more preferably 30% or more.
  • the OD value per 10 ⁇ m thickness of the partition (A-1) at a wavelength of 450 nm is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more.
  • the higher the OD value per 10 ⁇ m thickness at a wavelength of 450 nm the greater the light-shielding property of the side walls of the barrier ribs, thereby preventing color mixture between adjacent pixels and improving the contrast of the display device.
  • the OD value per 10 ⁇ m thickness of the partition (A-1) at a wavelength of 450 nm is less than 1.0, the blue excitation light leaks to adjacent pixels, and the (B) color conversion luminescent material described later is contained between the partitions. In the case of including a pixel having the same color, the pixel emits light, resulting in color mixture.
  • the reflectance per 10 ⁇ m thickness of the partition wall (A-1) at a wavelength of 550 nm was measured using a spectrophotometer (for example, CM-2600d manufactured by Konica Minolta Co., Ltd.) from the top of the partition wall (A-1) with a thickness of 10 ⁇ m. can be measured by SCI mode.
  • a spectrophotometer for example, CM-2600d manufactured by Konica Minolta Co., Ltd.
  • the same composition as the partition wall (A-1) A solid film having a thickness of 10 ⁇ m may be prepared, and the reflectance per 10 ⁇ m thickness may be obtained by similarly measuring the reflectance of the solid film instead of the partition wall (A-1).
  • a solid film was prepared under the same processing conditions as for the formation of the partition wall (A-1) except that the thickness was 10 ⁇ m and no pattern was formed. Reflectance may be similarly measured from the top surface of the film.
  • the OD value per 10 ⁇ m thickness of the partition wall (A-1) at a wavelength of 450 nm is obtained from the top surface of the partition wall (A-1) with a thickness of 10 ⁇ m using an optical densitometer (e.g., Hitachi High-Tech Science U-4100). and the intensity of the transmitted light are measured, and it can be calculated by the following formula (1).
  • an optical densitometer e.g., Hitachi High-Tech Science U-4100
  • the partition ( A 10 ⁇ m-thick solid film having the same composition as A-1) may be prepared, and the OD value per 10 ⁇ m thickness may be obtained by similarly measuring the OD value of the solid film instead of the partition wall (A-1). .
  • OD value log10( I0 /I) (1) I 0 : incident light intensity I : transmitted light intensity.
  • Means for adjusting the reflectance and the OD value within the above ranges include, for example, making the partition wall (A-1) have a preferable composition described later.
  • the taper angle of the partition wall (A-1) is preferably 45° to 110°.
  • the taper angle of the partition wall (A-1) refers to the angle formed by the side and bottom sides of the cross section of the partition wall. In the case of the substrate with partition walls shown in FIG. 1, the taper angle of the partition walls 2 is represented by the symbol ⁇ .
  • the taper angle is 70° or more.
  • the taper angle is more preferably 95° or less.
  • the taper angle of the partition wall (A-1) is measured using an optical microscope (FE-SEM (eg, S-4800 manufactured by Hitachi, Ltd.)) at an acceleration voltage of 3. It can be obtained by observing at 0 kV and a magnification of 2,500 times and measuring the angle formed by the side and base of the cross section of the partition wall (A-1).
  • the partition wall (A-1) is made to have a preferable composition described later, or the resin composition of the present invention described above is used. forming.
  • the thickness of the partition (A-1) is preferably larger than the thickness of the pixel when the substrate with the partition has a pixel containing the (B) color-converting luminescent material described later.
  • the thickness of the partition wall (A-1) is preferably 0.5 ⁇ m or more, more preferably 10 ⁇ m or more.
  • the thickness of the partition wall (A-1) is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, from the viewpoint of extracting light emitted from the bottom of the pixel more efficiently.
  • the width of the partition (A-1) is preferably sufficient to further improve the brightness by utilizing light reflection on the side of the partition and to further suppress color mixture of light in adjacent pixels due to light leakage.
  • the width of the partition is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more.
  • the width of the partition wall (A-1) is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less, from the viewpoint of securing a large light-emitting region of the pixel and further improving luminance.
  • the partition (A-1) has a repeating pattern for a predetermined number of pixels according to the screen size of the image display device.
  • the number of pixels of the image display device is, for example, 4000 horizontally and 2000 vertically.
  • the number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form the number of pixels corresponding to the required image resolution and the screen size of the image display device, and it is preferable to determine the partition pattern formation dimensions accordingly.
  • the partition wall (A-1) preferably contains a resin, a white pigment, and a light-shielding pigment.
  • the resin has a function of improving crack resistance and light resistance of the partition walls.
  • a white pigment has a function of further improving the reflectance of the partition wall.
  • the light-shielding pigment has the function of adjusting the OD value and suppressing color mixture of light in adjacent pixels.
  • the light-shielding pigments are as described above as materials constituting the resin composition.
  • the light-shielding pigment preferably contains at least one pigment selected from black pigments, red pigments, blue pigments, purple pigments, and yellow pigments from the viewpoint of improving light-shielding properties. Among these, it is preferable to contain a black pigment and/or a yellow pigment from the viewpoint of suppressing color mixture of light in adjacent pixels.
  • the black pigment is as described above as a material constituting the resin composition.
  • Yellow pigments include, for example, pigment yellow (hereinafter abbreviated as PY), yellow organic pigments such as PY137, PY138, PY139, PY150, PY166, PY168, and PY185; metal fine particles such as nanosilver particles and nanogold particles; metal oxides; metal composite oxides; metal sulfides; metal nitrides; metal oxynitrides; and yellow inorganic pigments such as metal carbides.
  • PY pigment yellow
  • yellow organic pigments such as PY137, PY138, PY139, PY150, PY166, PY168, and PY185
  • metal fine particles such as nanosilver particles and nanogold particles
  • metal oxides metal composite oxides
  • metal sulfides metal nitrides
  • metal oxynitrides and yellow inorganic pigments such as metal carbides.
  • the light-shielding pigment is titanium nitride, zirconium nitride, carbon black, a mixed pigment of a red pigment and a blue pigment in a weight ratio of 20/80 to 80/20, and Containing at least one pigment selected from at least one metal oxide or metal particles selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver is preferred.
  • the partition wall (A-1) preferably further contains a hindered amine compound.
  • the partition wall (A-1) is as described above as a material constituting the resin composition.
  • the hindered amine compound may be immobilized on a resin by reaction of the photopolymerizable group in the molecule.
  • the content of the hindered amine compound in the partition wall (A-1) is preferably 0.005% by weight or more, more preferably 0.008% by weight or more, from the viewpoint of further improving weather resistance.
  • the content of the hindered amine compound in the partition walls (A-1) is preferably 5.0% by weight or less, more preferably 3.0% by weight or less.
  • the partition (A-1) preferably further contains a liquid-repellent compound.
  • liquid-repellent compound By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the partition wall (A-1).
  • color-converting light-emitting materials having different compositions can be easily applied separately.
  • the liquid-repellent compound is as described above as a material constituting the resin composition.
  • the surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, more preferably 20° or more, from the viewpoint of improving inkjet applicability and facilitating separate coating of the color-converting luminescent material. More preferably, 40° or more is even more preferable.
  • the surface contact angle of the partition wall (A-1) is preferably 70° or less, more preferably 60° or less.
  • the surface contact angle of the partition wall (A-1) conforms to the substrate glass surface wettability test method specified in JIS R3257 (enacted date: 1999/04/20) for the upper part of the partition wall. can be measured by As a method for adjusting the surface contact angle of the partition wall (A-1) to the above range, for example, a method using the liquid-repellent compound described above can be used.
  • the photosensitive paste method is preferable because the pattern shape can be easily adjusted.
  • the above-mentioned resin composition is applied onto a base substrate and dried to obtain a dry film.
  • a method comprising an exposure step of pattern-wise exposing according to the shape, a developing step of dissolving and removing portions soluble in the developer in the dry film after exposure, and a heating step of curing the barrier ribs after development is preferred.
  • the resin composition preferably has negative photosensitivity.
  • Pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask.
  • partition walls (A-1) are similarly formed on the color filters and/or light-shielding partition walls (A-2). Can be patterned. Each step is as described above for the method of manufacturing the light shielding film.
  • the substrate with partition walls of the present invention further includes pixels (hereinafter sometimes referred to as “pixels (B)”) containing (B) color-converting luminescent materials arranged separated by the partition walls (A-1). It is preferred to have The pixel (B) has a function of enabling color display by converting at least part of the wavelength range of incident light and emitting output light in a wavelength range different from that of the incident light.
  • FIG. 2 shows a cross-sectional view of one mode of the substrate with partitions of the present invention having patterned partitions (A-1) and pixels (B).
  • a base substrate 1 has partition walls 2 patterned thereon, and pixels 3 are arranged in regions separated by the partition walls 2 .
  • the color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.
  • the substrate with partition walls of the present invention can be used as a display device by combining, for example, a backlight that emits blue light, liquid crystals formed on TFTs, and pixels (B).
  • the region corresponding to the red pixel preferably contains a red phosphor that emits red fluorescence when excited by blue excitation light.
  • the region corresponding to the green pixel preferably contains a green phosphor that emits green fluorescence when excited by blue excitation light.
  • a region corresponding to a blue pixel preferably does not contain a phosphor.
  • the inorganic phosphor is preferably one that emits green or red light by blue excitation light, that is, one that is excited by excitation light with a wavelength of 400 to 500 nm and has a peak emission spectrum in the region of 500 to 700 nm.
  • examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn 4+ -activated fluoride complex phosphors, and inorganic semiconductors called quantum dots.
  • quantum dots are preferred. Since quantum dots have a smaller average particle size than other phosphors, the surface of the pixel (B) can be smoothed to suppress light scattering on the surface, so that the light extraction efficiency is further improved. Brightness can be further improved.
  • Quantum dot materials include, for example, II-IV group, III-V group, IV-VI group, and IV group semiconductors.
  • these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSe and the like. You may use 2 or more types of these.
  • the organic phosphor is preferably one that emits green, red, or other colors when excited by blue light.
  • a pyrromethene derivative having a basic skeleton represented by the following structural formula (11) as a phosphor emitting red fluorescence and a pyrromethene derivative having a basic skeleton represented by the following structural formula (12) as a phosphor emitting green fluorescence derivatives and the like.
  • Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of substituents. You may contain 2 or more types of these. Among these, pyrromethene derivatives are preferred because of their high quantum yield.
  • a pyrromethene derivative can be obtained, for example, by the method described in JP-A-2011-241160.
  • the thickness of the pixel (B) is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more.
  • the thickness of the pixel (B) is preferably 30 ⁇ m or less, more preferably 20 ⁇ m or less, from the viewpoint of thinning of the display device and curved surface workability.
  • the size of each pixel (B) is generally about 20 to 200 ⁇ m.
  • the pixels (B) are preferably arranged separated by partition walls (A-1). By providing a partition between pixels, diffusion and color mixture of emitted light can be further suppressed.
  • a method for forming the pixel (B) for example, a method of filling a space separated by the partition wall (A-1) with a coating liquid containing a color-converting light-emitting material (hereinafter referred to as a color-converting light-emitting material coating liquid) can be mentioned. be done.
  • the color conversion luminescent material coating liquid may further contain a resin and a solvent.
  • Examples of methods for filling the color-converting luminescent material coating liquid include photolithography and inkjet methods, but the inkjet coating method is preferable from the viewpoint of easily separately coating different types of color-converting luminescent materials on each pixel.
  • ⁇ Light shielding partition (A-2)> In the substrate with partition walls of the present invention, (A-1) between the base substrate and the patterned partition walls, and (A-2) an OD value per 1.0 ⁇ m of thickness of 0.5 or more. It is preferable to have a pattern-formed partition (hereinafter sometimes referred to as a “light-shielding partition (A-2)”). By having the light-shielding partition (A-2), the light-shielding property is improved, light leakage from the backlight in the display device is suppressed, and a high-contrast and clear image can be obtained.
  • FIG. 3 shows a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having light-shielding partitions. It has partition walls 2 and light-shielding partition walls 4 patterned on a base substrate 1 , and pixels 3 are arranged in regions separated by the partition walls 2 and the light-shielding partition walls 4 .
  • the light-shielding partition (A-2) has an OD value of 0.5 or more per 1.0 ⁇ m of thickness.
  • the thickness of the light shielding partition (A-2) is preferably 0.5 to 10 ⁇ m, as will be described later.
  • 1.0 ⁇ m was selected as a representative value of the thickness of the light-shielding barrier ribs (A-2), and attention was paid to the OD value per 1.0 ⁇ m of thickness.
  • the OD value per 1.0 ⁇ m of thickness is preferably 4.0 or less, which can improve pattern workability.
  • the OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1) described above.
  • the thickness of the light-shielding partition wall (A-2) is preferably 0.5 ⁇ m or more, more preferably 1.0 ⁇ m or more, from the viewpoint of improving light-shielding properties. On the other hand, from the viewpoint of improving flatness, the thickness of the light shielding partition (A-2) is more preferably 5 ⁇ m or less. Further, the width of the light-shielding partition (A-2) is preferably approximately the same as that of the above-described partition (A-1).
  • the light-shielding partition (A-2) preferably contains a resin and a light-shielding pigment.
  • the resin has a function of improving crack resistance and light resistance of the partition walls.
  • the light-shielding pigment has a function of absorbing incident light and reducing emitted light.
  • the resin and the light-shielding pigment the same materials as those described above as materials constituting the resin composition can be used.
  • a method for patterning the light-shielding partition (A-2) on the underlying substrate for example, a photosensitive material described in JP-A-2015-1654 is used, and the above-described partition (A-1) is photosensitive.
  • a method of forming a pattern by a transparent paste method is preferred.
  • the substrate with partition walls of the present invention preferably further has a color filter (hereinafter sometimes referred to as “color filter”) having a thickness of 1 to 5 ⁇ m between the base substrate and the pixels (B).
  • color filter has a function of transmitting visible light in a specific wavelength range to make the transmitted light have a desired hue, and can improve the color purity of the display device. Color purity can be further improved by setting the thickness of the color filter to 1 ⁇ m or more. On the other hand, by setting the thickness to 5 ⁇ m or less, the luminance can be further improved.
  • FIG. 4 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a color filter. It has patterned partition walls 2 and color filters 5 on a base substrate 1 , and pixels 3 on the color filters 5 .
  • color filters examples include color filters that use pigment-dispersed materials in which pigments are dispersed in photoresist, which are used in flat panel displays such as liquid crystal displays. Moreover, the color filter may be laminated separately from the pixel (B) containing the color-converting luminescent material, or may be integrally laminated.
  • the substrate with partition walls of the present invention preferably further has a color filter with a thickness of 1 to 5 ⁇ m separated by a light-shielding partition wall between the underlying substrate and the pixels (B).
  • FIG. 5 shows a cross-sectional view of one embodiment of the partition-attached substrate of the present invention having color filters separated by light-shielding partition walls. Color filters 5 separated by patterned light-shielding barrier ribs 4 are provided on a base substrate 1, and barrier ribs 2 and pixels 3 are provided thereon.
  • the substrate with partition walls of the present invention further includes (C) a low refractive index layer having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm (hereinafter referred to as "low refractive index layer (C)” may be described).
  • low refractive index layer (C) a low refractive index layer having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm.
  • FIG. 6 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer. It has patterned barrier ribs 2 and pixels 3 on an underlying substrate 1, and further has a low refractive index layer 6 thereon.
  • the refractive index of the low refractive index layer (C) is preferably 1.20 or more from the viewpoint of appropriately suppressing the reflection of light from the backlight and allowing light to enter the pixels (B) efficiently. 23 or more is more preferable.
  • the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less.
  • the refractive index of the low refractive index layer (C) is measured by irradiating light with a wavelength of 550 nm from a direction perpendicular to the cured film surface under atmospheric pressure and at 20° C. using a prism coupler. can be done.
  • the low refractive index layer (C) can be formed, for example, as in Examples 72 to 74 using the low refractive index layer-forming material obtained in Preparation Example 6 described later.
  • the thickness of the low refractive index layer (C) is preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more, from the viewpoint of covering the steps of the pixels (B) and suppressing the occurrence of defects.
  • the thickness of the low refractive index layer (C) is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).
  • the substrate with partition walls of the present invention preferably further has an inorganic protective layer I with a thickness of 50 to 1,000 nm on the low refractive index layer (C). Since the presence of the inorganic protective layer I makes it difficult for moisture in the atmosphere to reach the low refractive index layer (C), it is possible to suppress fluctuations in the refractive index of the low refractive index layer (C) and suppress luminance degradation. can.
  • FIG. 7 and 8 show cross-sectional views of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer (I). It has patterned partition walls 2 and pixels 3 on a base substrate 1, and further has a low refractive index layer 6 and an inorganic protective layer (I) 7 on or under these.
  • the substrate with partition walls of the present invention preferably has the low refractive index layer (C) between the pixel (B) and the color filter. It is preferred to have an inorganic protective layer (I) of 1,000 nm. By having the low refractive index layer (C) between the pixel (B) and the color filter, the effect of improving the light extraction of emitted light is increased, and the brightness of the display is improved.
  • FIG. 9 shows a cross-sectional view of one embodiment of the substrate with partitions of the present invention having the low refractive index layer and the inorganic protective layer (I) between the pixels (B) and the color filters.
  • a color filter 5 separated by a light-shielding partition wall 4 is provided on a base substrate 1, a low refractive index layer 6 and an inorganic protective layer (I) 7 are provided thereon, and a pattern is formed thereon. It has partition walls 2 and pixels 3 .
  • the substrate with partition walls of the present invention preferably further has an inorganic protective layer (II) with a thickness of 50 to 1,000 nm between the pixels (B) and the low refractive index layer (C).
  • an inorganic protective layer (II) with a thickness of 50 to 1,000 nm between the pixels (B) and the low refractive index layer (C).
  • FIG. 10 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer (II). It has patterned partition walls 2 and pixels 3 on a base substrate 1 , and further has an inorganic protective layer (II) 8 and a low refractive index layer 6 thereon.
  • II inorganic protective layer
  • the substrate with partition walls of the present invention preferably further has an inorganic protective layer (III) and/or a yellow organic protective layer with a thickness of 50 to 1,000 nm between the color filter and the pixel (B).
  • an inorganic protective layer (III) it becomes difficult for the raw materials for forming the color filter to reach the pixel (B) containing the color conversion light emitting material from the color filter. ) can be suppressed.
  • the yellow organic protective layer it is possible to cut blue leakage light that has not been completely converted by the pixels (B) containing the color-converting light-emitting material, thereby improving color reproducibility.
  • FIG. 11 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a color filter and an inorganic protective layer (III) and/or a yellow organic protective layer. It has patterned barrier ribs 2 and color filters 5 on a base substrate 1, has an inorganic protective layer (III) and/or a yellow organic protective layer 9 thereon, and further has barrier ribs thereon. It has pixels 3 arranged at 2 intervals.
  • the substrate with partition walls of the present invention preferably further has an inorganic protective layer (IV) having a thickness of 50 to 1,000 nm and/or a yellow organic protective layer on the underlying substrate.
  • the inorganic protective layer (IV) and/or the yellow organic protective layer act as a refractive index adjusting layer, extracting light emitted from the pixels (B) more efficiently, and can further improve the luminance of the display device.
  • the yellow organic protective layer cuts the blue leakage light that has not been completely converted by the pixels (B) containing the color-converting light-emitting material, and can improve color reproducibility.
  • FIG. 12 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having an inorganic protective layer (IV) and/or a yellow organic protective layer. It has an inorganic protective layer (IV) and/or a yellow organic protective layer 10 on a base substrate 1, and has patterned barrier ribs 2 and pixels 3 thereon.
  • Materials constituting the inorganic protective layers (I) to (IV) include, for example, metal oxides such as silicon oxide, indium tin oxide and gallium zinc oxide; metal nitrides such as silicon nitride; and the like. Among these, silicon nitride or silicon oxide is more preferable because of its low water vapor permeability and high permeability.
  • the thickness of the inorganic protective layers (I) to (IV) is preferably 50 nm or more, more preferably 100 nm or more, from the viewpoint of sufficiently suppressing permeation of substances such as water vapor. On the other hand, from the viewpoint of suppressing a decrease in transmittance, the thickness of the inorganic protective layers (I) to (IV) is preferably 800 nm or less, more preferably 500 nm or less.
  • the yellow organic protective layer is obtained, for example, by patterning a resin composition containing a yellow pigment and a resin.
  • the yellow pigment and the resin the same materials as those described above as the materials constituting the partition wall (A-1) can be used.
  • a method of patterning the yellow organic protective layer a method of forming a pattern by a photosensitive paste method is preferable, as in the case of the barrier ribs (A-1) described above.
  • the yellow organic protective layer 8 may serve as an overcoat layer that planarizes each pixel of the color filter.
  • the substrate with partitions of the present invention can also be used in a display device using mini or micro LEDs, in which a large number of LEDs corresponding to pixels separated by partitions formed on the substrate are arranged. ON/OFF of each pixel is enabled by ON/OFF of a mini or micro LED, no liquid crystal is required.
  • the substrate with partition walls of the present invention can be used not only for partition walls for separating pixels, but also for partition walls for separating mini or micro LEDs in a backlight.
  • the substrate with partition walls of the present invention preferably further has a light emitting source selected from organic EL cells, mini-LED cells and micro-LED cells on the base substrate.
  • a light emitting source selected from organic EL cells, mini-LED cells and micro-LED cells on the base substrate.
  • FIG. 13 shows a cross-sectional view of one embodiment of the partition-furnished substrate of the present invention having a light-emitting light source selected from organic EL cells, mini-LED cells and micro-LED cells.
  • a light emitting source 11 selected from organic EL cells, mini-LED cells and micro-LED cells is provided between partition walls 2 patterned on a base substrate 1 .
  • the substrate with partition walls of the present invention preferably further has pixels (B) on the light emitting light sources selected from organic EL cells, mini-LED cells and micro-LED cells.
  • FIG. 14 shows a cross-sectional view of one embodiment of the partition-furnished substrate of the present invention having light-emitting light sources and pixels selected from organic EL cells, mini-LED cells, and micro-LED cells.
  • a light emitting source 11 selected from organic EL cells, mini-LED cells and micro-LED cells is provided between partition walls 2 patterned on a base substrate 1, and pixels 3 are provided thereon.
  • a display device of the present invention includes the substrate with partition walls and a light emitting source.
  • a light emission source selected from a liquid crystal cell, an organic EL cell, a mini LED cell and a micro LED cell is preferable.
  • An organic EL cell is more preferable as the light source because of its excellent light emission characteristics.
  • a mini-LED cell is a cell in which a large number of LEDs each having a length and width of about 100 ⁇ m to 10 mm are arranged.
  • a micro LED cell refers to a cell in which a large number of LEDs each having a length and width of less than 100 ⁇ m are arranged.
  • the method for manufacturing the display device of the present invention will be described by taking an example of the display device having the substrate with partition walls and the organic EL cell of the present invention.
  • a photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed by photolithography. After aluminum is sputtered thereon, the aluminum is patterned by photolithography to form a back electrode layer made of aluminum in the openings where there is no insulating film.
  • Alq3 tris(8-quinolinolato)aluminum
  • Alq3 tris(8-quinolinolato)aluminum
  • ITO is deposited as a transparent electrode by sputtering to fabricate an organic EL cell having a white light-emitting layer.
  • a display device can be produced by bonding the aforementioned substrate with partition walls to the organic EL cell obtained in this manner so as to face each other with a sealant.
  • the solid content concentrations of the polysiloxane solutions in Synthesis Examples 1-6 and the (meth)acrylic polymer solutions in Synthesis Examples 7-9 were obtained by the following method. 1.5 g of polysiloxane solution or (meth)acrylic polymer solution was placed in an aluminum cup and heated at 250° C. for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration was obtained from the ratio to the weight before heating.
  • the weight average molecular weights of the polysiloxane solutions in Synthesis Examples 1 to 6 and the (meth)acrylic polymer solutions in Synthesis Examples 7 to 9 were obtained in terms of polystyrene by the following method.
  • Apparatus Waters GPC measuring apparatus with RI detector (2695) Column: PLgel MIXED-C column (manufactured by Polymer Laboratories, 300 mm) x 2 (connected in series) Measurement temperature: 40°C Flow rate: 1 mL/min Solvent: Tetrahydrofuran (THF) 0.5% by weight solution Standard substance: polystyrene Detection mode: RI.
  • the content ratio of each repeating unit in polysiloxane in Synthesis Examples 1 to 6 was obtained by the following method.
  • a polysiloxane solution is injected into a “Teflon” (registered trademark) NMR sample tube with a diameter of 10 mm and 29 Si-NMR measurement is performed, and the Si derived from a specific organosilane is compared with the integrated value of the entire Si derived from the organosilane.
  • the content ratio of each repeating unit was calculated from the ratio of the integrated value of. 29 Si-NMR measurement conditions are shown below.
  • Apparatus Nuclear magnetic resonance apparatus (JNM-GX270; manufactured by JEOL Ltd.) Measurement method: Gated decoupling method Measurement nucleus frequency: 53.6693 MHz ( 29 Si nuclei) Spectrum width: 20000Hz Pulse width: 12 ⁇ s (45° pulse) Pulse repetition time: 30.0 seconds Solvent: Acetone-d6 Reference substance: Tetramethylsilane Measurement temperature: 23°C Sample rotation speed: 0.0 Hz.
  • aqueous phosphoric acid solution was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 182.96 g of methanol and water, which are by-products, were distilled during the reaction.
  • PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-1) solution.
  • the weight average molecular weight of the obtained polysiloxane (PSL-1) was 12,000.
  • aqueous phosphoric acid solution was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 195.52 g of methanol and water, which are by-products, were distilled during the reaction.
  • PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-2) solution.
  • the weight average molecular weight of the obtained polysiloxane (PSL-2) was 5,500.
  • the molar ratio of each repeating unit derived from succinic anhydride was 47.5 mol %, 17.5 mol %, 5 mol %, 20 mol % and 10 mol %, respectively.
  • Aqueous phosphoric acid was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution.
  • a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 173.99 g of methanol and water, which are by-products, were distilled during the reaction.
  • PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-3) solution.
  • the weight average molecular weight of the obtained polysiloxane (PSL-3) was 6,000.
  • PSL-3 polysiloxane
  • an aqueous phosphoric acid solution prepared by dissolving 3.328 g of phosphoric acid (1.0% by weight based on the charged monomers) in 85.84 g of water was added with stirring at 40° C. over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution.
  • a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring.
  • PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-4) solution.
  • the weight average molecular weight of the obtained polysiloxane (PSL-4) was 15,000.
  • each repeat derived from styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-4)
  • PSL-4 polysiloxane
  • Synthesis Example 5 Polysiloxane (PSL-5) solution In a 1000 ml three-necked flask, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane were added.
  • the weight average molecular weight of the obtained polysiloxane (PSL-5) was 5,000.
  • 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-5) The molar ratio of each repeating unit derived was 17.5 mol %, 5 mol %, 67.5 mol % and 10 mol %, respectively.
  • aqueous phosphoric acid solution prepared by dissolving 3.495 g of phosphoric acid (1.0% by weight with respect to the charged monomers) in 70.88 g of water was added over 30 minutes while stirring at 40°C. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution.
  • a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring.
  • PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-6) solution.
  • the weight average molecular weight of the obtained polysiloxane (PSL-6) was 6,000.
  • each repeating unit derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride in polysiloxane (PSL-6) were 47.5 mol %, 5 mol %, 37.5 mol % and 10 mol %, respectively.
  • the compositions of Synthesis Examples 1 to 6 are summarized in Table 1.
  • Synthesis Example 8 Synthesis of (meth)acrylic polymer solution (PAL-2) A 500 mL flask was charged with 3.00 g of 2,2′-azobis(isobutyronitrile) and 50.0 g of PGMEA, and then 15% of methacrylic acid was added. 0 g (0.174 mol), 38.06 g (0.216 mol) of benzyl methacrylate, and 32.80 g (0.149 mol) of tricyclodecanyl methacrylate were charged, stirred at room temperature for a while, and the atmosphere in the flask was replaced with nitrogen. The mixture was heated and stirred at 70° C. for 5 hours.
  • PAL-2 (meth)acrylic polymer solution
  • Synthesis Example 9 Synthesis of (meth)acrylic polymer solution (PAL-3) After charging 3.00 g of 2,2'-azobis(isobutyronitrile) and 50.0 g of PGMEA into a 500 mL flask, 30 g of methacrylic acid was added. .0 g (0.349 mol) and 116.98 g (0.498 mol) of tricyclo[5.2.1.02,6]decan-8-yl methacrylate were charged, stirred at room temperature for a while, and the inside of the flask was replaced with nitrogen. The mixture was heated and stirred at 70° C. for 5 hours.
  • PAL-3 After charging 3.00 g of 2,2'-azobis(isobutyronitrile) and 50.0 g of PGMEA into a 500 mL flask, 30 g of methacrylic acid was added. .0 g (0.349 mol) and 116.98 g (0.498 mol) of tricyclo[5.2.1.0
  • the resulting reaction product was purified by silica gel column chromatography to give 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g) as a white solid.
  • 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, followed by anhydrous dichloromethane (200 mL) and trifluoroacetic acid (1 drop) was added and stirred for 4 hours under a nitrogen atmosphere.
  • Synthesis Example 12 Silica Particle-Containing Polysiloxane Solution (LS-1) 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, and 0.10 g (0.0 mmol) of trimethoxysilylpropylsuccinic anhydride are placed in a 500 ml three-necked flask. .4 mmol), 7.97 g (34 mmol) of ⁇ -acryloxypropyltrimethoxysilane, and 15.6% by weight of an isopropyl alcohol dispersion of silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.).
  • IPA-ST-UP isopropyl alcohol dispersion of silica particles
  • aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes while stirring at room temperature. After that, the flask was immersed in an oil bath at 40° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the internal temperature of the solution reached 100° C., and by further heating and stirring for 2 hours (the internal temperature was 100 to 110° C.), a silica particle-containing polysiloxane solution (LS-1) was obtained. rice field.
  • silica particle-containing polysiloxane solution had a solid content concentration of 24.3% by weight, and the content of polysiloxane and silica particles in the solid content was 15% by weight and 85% by weight, respectively.
  • Example 1 Partition wall resin composition (P-1) 5.00 g of titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter "R-960”)) as a white pigment, and the polysiloxane (PSL-1) solution obtained in Synthesis Example 1 as a resin. 5.00 g and 0.0188 g of titanium nitride as a light-shielding pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-1).
  • R-960 titanium dioxide pigment
  • PSL-1 polysiloxane
  • OXE-02 bis (2,4,6-trimethylbenzoyl)-phenylphosphine oxide
  • IC-819 bis (2,4,6-trimethylbenzoyl)-phenylphosphine oxide
  • IC-819 bis (2,4,6-trimethylbenzoyl)-phenylphosphine oxide
  • IC-819 1,3,5-tris(3,5-di-t-butyl-4-hydroxyphenylmethyl)-2,4,6- 0.0309 g of trimethylbenzene (“ADEKA STAB” (registered trademark) AO-330, manufactured by ADEKA Corporation (hereinafter “AO-330”)), and dipentaerythritol hexaacrylate (“KAYARAD” (registered trademark) as a photopolymerizable compound.
  • ADEKA STAB registered trademark
  • AO-330 dipentaerythritol hexaacrylate
  • KAYARAD dipentaerythritol hexaacrylate
  • DPHA manufactured by Shin Nihon Yakugyo Co., Ltd.
  • DPHA a photopolymerizable fluorine-containing compound
  • RS-72A a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • RS-72A a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable fluorine-containing compound
  • PGMEA a photopolymerizable
  • Example 2 Partition wall resin composition (P-2) R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-2). . Further, 0.103 g of bis(acetylacetonato)palladium as an organometallic compound and 0.089 g of triphenylphosphine as a coordinating compound having a phosphorus atom (equimolar amount relative to the organometallic compound) were added to DAA1. .726 g to obtain an organometallic compound solution (OM-1).
  • Example 3 Partition wall resin composition (P-3) As an organometallic compound, 0.103 g of silver neodecanoate was dissolved in 0.928 g of EDM to obtain an organometallic compound solution (OM-2). Instead of the organometallic compound solution (OM-1), 1.03 g of organometallic compound solution (OM-2), 2.72 g of polysiloxane (PSL-1) solution, and (meth)acrylic polymer (PAL-1) solution were added. A resin composition for partition walls (P-3) was obtained in the same manner as in Example 2, except that 4.37 g of PGMEA and 1.366 g of PGMEA were added.
  • Partition wall resin compositions (P-4) to (P-6) Resin for partition walls was prepared in the same manner as in Example 1, except that the polysiloxane (PSL-2), (PSL-3), and (PSL-4) solutions were used instead of the polysiloxane (PSL-1) solution. Compositions (P-4) to (P-6) were obtained.
  • Example 7 Partition wall resin composition (P-7) A partition wall resin composition (P-7) was prepared in the same manner as in Example 1, except that the (meth)acrylic polymer (PAL-2) solution was used instead of the (meth)acrylic polymer (PAL-1) solution. got
  • Example 8 Partition wall resin composition (P-8) A partition wall resin composition (P-8) was obtained in the same manner as in Example 1, except that the cardo-based polymer V-259ME was used instead of the (meth)acrylic polymer (PAL-1) solution.
  • Example 9 Partition wall resin composition (P-9) A partition wall resin composition (P-9) was obtained in the same manner as in Example 1, except that the cardo-based polymer WR-301 was used instead of the (meth)acrylic polymer (PAL-1) solution.
  • Example 10 Partition wall resin composition (P-10) Instead of the hindered phenol compound AO-330, pentaerythritol tetrakis (3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate (“adekastab” (registered trademark) AO-60, ADEKA Corporation) ) (hereinafter “AO-60”)) was used to obtain a partition wall resin composition (P-10) in the same manner as in Example 1.
  • AO-60 pentaerythritol tetrakis
  • Example 11 Partition wall resin composition (P-11) Instead of the hindered phenol compound AO-330, 6,6'-di-t-butyl-4,4'-butylidenedi-m-cresol (“ADEKA STAB” (registered trademark) AO-40, manufactured by ADEKA Corporation) (hereinafter referred to as "AO-40”)) was used in the same manner as in Example 1 to obtain a partition wall resin composition (P-11).
  • ADEKA STAB 6,6'-di-t-butyl-4,4'-butylidenedi-m-cresol
  • AO-40 6,6'-di-t-butyl-4,4'-butylidenedi-m-cresol
  • Example 12 Partition wall resin composition (P-12) Instead of the hindered phenol compound AO-330, octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate (“ADEKA STAB” (registered trademark) AO-50, manufactured by ADEKA Corporation ( A resin composition for partition walls (P-12) was obtained in the same manner as in Example 1, except that hereinafter "AO-50”)) was used.
  • ADEKA STAB registered trademark
  • AO-50 octadecyl 3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate
  • Example 13 Partition wall resin composition (P-13)
  • the hindered phenol compound AO-330 was added in an amount of 0.0474 g
  • polysiloxane (PSL-1) solution was 2.81 g
  • (meth)acrylic polymer (PAL-1) solution was 4.46 g
  • PGMEA was 0.46 g
  • a resin composition for partition walls (P-13) was obtained in the same manner as in Example 1, except that 538 g was added.
  • Example 14 Partition wall resin composition (P-14)
  • the hindered phenol compound AO-330 was added in an amount of 0.330 g
  • polysiloxane (PSL-1) solution was 2.46 g
  • (meth)acrylic polymer (PAL-1) solution was 4.10 g
  • PGMEA was 0.33 g
  • a resin composition for partition walls (P-14) was obtained in the same manner as in Example 1, except that 962 g was added.
  • Example 15 Partition wall resin composition (P-15)
  • the hindered phenol compound AO-330 was added in an amount of 0.00516 g
  • polysiloxane (PSL-1) solution was 2.86 g
  • (meth)acrylic polymer (PAL-1) solution was 4.51 g
  • PGMEA was 0.00 g
  • a resin composition for partition walls (P-15) was obtained in the same manner as in Example 1, except that 474 g was added.
  • Example 16 Partition wall resin composition (P-16) The hindered phenol compound AO-330 was added in an amount of 0.00309 g, 2.87 g of polysiloxane (PSL-1) solution, 4.51 g of (meth)acrylic polymer (PAL-1) solution, and 0.51 g of PGMEA.
  • a resin composition for partition walls (P-16) was obtained in the same manner as in Example 1, except that 474 g was added.
  • Example 17 Partition wall resin composition (P-17) As a hindered amine compound, 0.103 g of 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate (“ADEKA STAB” (registered trademark) LA-82, manufactured by ADEKA Corporation (hereinafter “LA-82”)) Partition walls in the same manner as in Example 1 except that 2.70 g of polysiloxane (PSL-1) solution, 4.35 g of (meth) acrylic polymer (PAL-1) solution, and 0.668 g of PGMEA were added. to obtain a resin composition (P-17) for
  • Example 18 Partition wall resin composition (P-18) Instead of the hindered amine compound LA-82, 2,2,6,6-tetramethyl-4-piperidyl methacrylate (“ADEKA STAB” (registered trademark) LA-87, manufactured by ADEKA Corporation (hereinafter “LA-87”) ) was used to obtain a partition wall resin composition (P-18) in the same manner as in Example 17.
  • ADEKA STAB 2,2,6,6-tetramethyl-4-piperidyl methacrylate
  • LA-87 2,2,6,6-tetramethyl-4-piperidyl methacrylate
  • Example 19 Partition wall resin composition (P-19) Without adding the hindered phenol compound AO-330, 2.74 g of polysiloxane (PSL-1) solution, 4.39 g of (meth)acrylic polymer (PAL-1) solution, and 0.621 g of PGMEA were added. A resin composition for partition walls (P-19) was obtained in the same manner as in Example 17 except for the above.
  • Example 20 Partition wall resin composition (P-20) Instead of the hindered amine compound LA-82, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate (“ADEKA STAB” (registered trademark) LA-72, manufactured by ADEKA Corporation (hereinafter “LA A resin composition for partition walls (P-20) was obtained in the same manner as in Example 19, except that the resin composition (P-20) was used.
  • ADEKA STAB registered trademark
  • LA-72 manufactured by ADEKA Corporation
  • Example 21 Partition wall resin composition (P-21) A partition wall resin composition (P-21) was obtained in the same manner as in Example 19, except that 1,2,2,5,5-pentamethylpiperidine was used instead of the hindered amine compound LA-82.
  • Example 22 Partition wall resin composition (P-22)
  • the hindered amine compound LA-82 was added in an amount of 0.248 g, and 2.56 g of polysiloxane (PSL-1) solution, 4.71 g of (meth)acrylic polymer (PAL-1) solution, and 0.838 g of PGMEA were added.
  • a partition wall resin composition (P-22) was obtained in the same manner as in Example 19, except that
  • Example 23 Partition wall resin composition (P-23)
  • the hindered amine compound LA-82 was added in an amount of 0.371 g, and 2.40 g of polysiloxane (PSL-1) solution, 4.05 g of (meth)acrylic polymer (PAL-1) solution, and 1.024 g of PGMEA were added.
  • a partition wall resin composition (P-23) was obtained in the same manner as in Example 19, except that
  • Example 24 Partition wall resin composition (P-24)
  • the hindered amine compound LA-82 was added in an amount of 0.0100 g, and 2.86 g of polysiloxane (PSL-1) solution, 4.51 g of (meth)acrylic polymer (PAL-1) solution, and 0.482 g of PGMEA were added.
  • a partition wall resin composition (P-24) was obtained in the same manner as in Example 19, except that
  • Example 25 Partition wall resin composition (P-25)
  • the hindered amine compound LA-82 was added in an amount of 0.0039, and 2.86 g of polysiloxane (PSL-1) solution, 4.51 g of (meth)acrylic polymer (PAL-1) solution, and 0.471 g of PGMEA were added.
  • a partition wall resin composition (P-25) was obtained in the same manner as in Example 19, except that
  • Example 26 Partition wall resin composition (P-26) A partition wall resin composition (P-26) was obtained in the same manner as in Example 1, except that the amount of IC-819 added was 0.413 g and OXE-02 was not added.
  • Example 27 Partition wall resin composition (P-27) A partition wall resin composition (P-27) was obtained in the same manner as in Example 1, except that the amount of OXE-02 added was 0.413 g and IC-819 was not added.
  • Example 28 Partition wall resin composition (P-28) A resin composition for partition walls was prepared in the same manner as in Example 1, except that the amount of polysiloxane (PSL-1) solution added was 1.33 g and the amount of (meth)acrylic polymer (PAL-1) solution added was 5.98 g. A product (P-28) was obtained.
  • PSL-1 polysiloxane
  • PAL-1 polymethacrylic polymer
  • Example 29 Partition wall resin composition (P-29) A resin composition for partition walls was prepared in the same manner as in Example 1, except that the amount of the polysiloxane (PSL-1) solution added was 4.73 g and the amount of the (meth)acrylic polymer (PAL-1) solution added was 2.58 g. A product (P-29) was obtained.
  • PSL-1 polysiloxane
  • PAL-1 polymethacrylic polymer
  • Example 30 Partition wall resin composition (P-30) 7.68 g of polysiloxane (PSL-1) solution, 7.68 g of (meth)acrylic polymer (PAL-1) solution, 0.123 g of OXE-02, 0.205 g of IC-819, and 1.0 g of DPHA. 64 g, 0.205 g of RS-72A, 0.016 g of Celoxide 2021P, 0.025 g of AO-330, and 0.103 g of a 10 wt. and stirred. The resulting mixture was filtered through a 5.0 ⁇ m filter to obtain a partition wall resin composition (P-30).
  • PSL-1 polysiloxane
  • PAL-1 (meth)acrylic polymer
  • Example 31 Partition wall resin composition (P-31) Without adding the organometallic compound solution (OM-1), the amount of polysiloxane (PSL-1) solution added was 2.85 g, the amount of (meth)acrylic polymer (PAL-1) solution added was 4.50 g, A partition wall resin composition (P-31) was obtained in the same manner as in Example 2, except that the amount of PGMEA added was changed to 0.284 g and the amount of DAA added was changed to 1.86 g.
  • Example 32 Partition wall resin composition (P-32) 0.20 g of titanium nitride as a light-shielding pigment and 7.00 g of a polysiloxane (PSL-1) solution as a resin are mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). Obtained.
  • Example 33 Partition wall resin composition (P-33) 4.00 g of the organometallic compound solution (OM-1), 6.21 g of polysiloxane (PSL-1) solution, 6.21 g of (meth)acrylic polymer (PAL-1) solution, 0 OXE-02 10 wt. 0.103 g was dissolved in 2.03 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 ⁇ m filter to obtain a partition wall resin composition (P-33).
  • OM-1 organometallic compound solution
  • PSL-1 polysiloxane
  • PAL-1 (meth)acrylic polymer
  • Example 34 Partition wall resin composition (P-34) Without adding the liquid-repellent compound RS-72A, the amount of polysiloxane (PSL-1) solution added was 2.67 g, the amount of (meth)acrylic polymer (PAL-1) solution added was 4.32 g, and PGMEA was added.
  • a resin composition for partition walls (P-34) was obtained in the same manner as in Example 2, except that the amount was changed to 0.830 g.
  • Comparative Example 7 Partition wall resin composition (P-41) 5.00 g of R-960 as a white pigment, 5.00 g of a (meth)acrylic polymer (PAL-1) solution as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment were mixed, and a mill-type dispersion filled with zirconia beads. A pigment dispersion liquid (MW-4) was obtained by dispersing using a machine.
  • P-41 Partition wall resin composition (P-41) 5.00 g of R-960 as a white pigment, 5.00 g of a (meth)acrylic polymer (PAL-1) solution as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment were mixed, and a mill-type dispersion filled with zirconia beads.
  • a pigment dispersion liquid (MW-4) was obtained by dispersing using a machine.
  • Comparative Example 8 Partition wall resin composition (P-42) Without adding the hindered phenol compound AO-330, 2.87 g of polysiloxane (PSL-1) solution, 4.52 g of (meth)acrylic polymer (PAL-1) solution, and 0.467 g of PGMEA were added. Except for this, the resin composition for partition walls (P-42) was obtained in the same manner as in Example 1.
  • the compositions of Examples 1 to 34 and Comparative Examples 1 to 8 are summarized in Tables 3-1 to 3-4.
  • Color Conversion Luminescent Material Composition (CL-1) Green quantum dot material (Lumidot 640 CdSe / ZnS, average particle size 6.3 nm: manufactured by Aldrich) 0.5 wt% toluene solution 20 parts by weight, DPHA 45 parts by weight, "Irgacure” (registered trademark) 907 ( 5 parts by weight of BASF Japan Co., Ltd.), 166 parts by weight of 30% by weight PGMEA solution of acrylic resin (SPCR-18 (trade name), Showa Denko Co., Ltd.) and 97 parts by weight of toluene are mixed and stirred. and dissolved uniformly. The resulting mixture was filtered through a 0.45 ⁇ m syringe filter to prepare a color-converting luminescent material composition (CL-1).
  • Preparation Example 2 Color-converting luminescent material composition (CL-2) Color in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 10 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight. A conversion luminescent material composition (CL-2) was prepared.
  • Preparation Example 3 Color Conversion Luminescent Material Composition (CL-3) Color in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 11 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight. A conversion luminescent material composition (CL-3) was prepared.
  • Color filter forming material C. I. Pigment Green 59, 90 g, C.I. I. 60 g of Pigment Yellow 150, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by BYK Chemie (hereinafter “BYK-6919”)), a binder resin (“Adeka Arkles” (registered trademark) ) 100 g of WR301 (trade name, manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry.
  • a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by BYK Chemie (hereinafter “BYK-6919”)
  • a binder resin (“Adeka Arkles” (registered trademark) ) 100 g of WR301 (trade name, manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry.
  • a beaker containing the slurry was connected to a Dyno mill and a tube, and zirconia beads with a diameter of 0.5 mm were used as media to perform dispersion treatment at a peripheral speed of 14 m/s for 8 hours to obtain Pigment Green 59 dispersion (GD-1). was made.
  • Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin (“Cyclomer” (registered trademark) P (ACA) Z250 (trade name) manufactured by Daicel Allnex Co., Ltd. (hereinafter “P (ACA) Z250” )) 3.14 g, DPHA 2.64 g, a photopolymerization initiator (“OPTOMER” (registered trademark) NCI-831 (trade name) manufactured by ADEKA Corporation (hereinafter “NCI-831”)) 0.330 g, 0.04 g of a surfactant (BYK” (registered trademark)-333 (trade name) manufactured by BYK-Chemie (hereinafter “BYK-333”)), 0.01 g of BHT as a polymerization inhibitor, and 37 g of PGMEA as a solvent. 30 g were mixed to prepare a color filter forming material (CF-1).
  • CF-1 color filter forming material
  • Preparation Example 5 Resin composition for light-shielding barrier ribs 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA were mixed. to prepare a slurry. A beaker containing the slurry was connected to a Dyno mill and a tube, and zirconia beads with a diameter of 0.5 mm were used as media to perform dispersion treatment at a peripheral speed of 14 m/s for 8 hours to prepare a pigment dispersion liquid (MB-1). bottom.
  • carbon black MA100 (trade name) manufactured by Mitsubishi Chemical Corporation
  • Pigment dispersion (MB-1) 56.54 g, P (ACA) Z250 3.14 g, DPHA 2.64 g, NCI-831 0.330 g, BYK-333 0.04 g, tertiary polymerization inhibitor 0.01 g of butylcatechol and 37.30 g of PGMEA were mixed to prepare a resin composition for light-shielding partition walls.
  • Preparation Example 6 Low Refractive Index Layer-Forming Material 5.350 g of the silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 12, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA After mixing, the mixture was filtered through a 0.45 ⁇ m syringe filter to prepare a low refractive index layer-forming material.
  • Yellow organic protective layer-forming material C.
  • 150 g of Pigment Yellow 150 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by BYK-Chemie (hereinafter “BYK-6919”)), a binder resin (“Adeka Arkles” (registered trademark) )
  • BYK-6919 a polymer dispersant
  • Adeka Arkles registered trademark
  • a beaker containing the slurry was connected to a Dyno mill and a tube, and using zirconia beads with a diameter of 0.5 mm as media, dispersion treatment was performed at a peripheral speed of 14 m / s for 8 hours to obtain Pigment Yellow 150 dispersion (YD-1). was made.
  • Pigment Yellow 150 dispersion liquid (YD-1) 3.09 g, polysiloxane (PSL-1) solution 23.54 g as resin, DPHA 6.02 g as photopolymerizable compound, silver neodecanoate as organometallic compound 6.02 g of the prepared organometallic compound solution (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and BYK 0.050 g of a 10% by weight diluted solution of PGMEA of -352 (equivalent to a concentration of 500 ppm) was dissolved in 61.15 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 ⁇ m filter to obtain a yellow organic protective layer-forming material (YL-1).
  • PSL-1 polysiloxane
  • DPHA 6.02 g photopolyme
  • Examples 35-69, Comparative Examples 9-16 A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. A partition wall resin composition shown in Tables 4 and 5 was spin-coated thereon, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film.
  • SCW-636 manufactured by Dainippon Screen Mfg. Co., Ltd.
  • the prepared dried film is exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source and an exposure amount of 100 mJ/cm 2 (g, h , i-line irradiation.The amount of exposure is the i-line conversion value.). Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development is performed using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, and then water is used for 30 seconds. Rinse for seconds.
  • AD-2000 automatic developing device
  • the regions separated by the partition walls of the obtained substrate with partition walls were coated with the color-converting light-emitting material compositions shown in Tables 4 and 5 using an inkjet method in a nitrogen atmosphere, dried at 100° C. for 30 minutes, and the thickness was reduced. Pixels of 5.0 ⁇ m were formed to obtain a substrate with partition walls having the configuration shown in FIG.
  • Example 70 A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate.
  • the light-shielding barrier rib forming material obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film.
  • the prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 40 mJ/cm 2 (g, h , i-line). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development is performed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. bottom. Furthermore, using an oven (trade name: IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230° C.
  • AD-2000 automatic developing device
  • IHPS-222 manufactured by ESPEC Co., Ltd.
  • a substrate with light-shielding barrier ribs was obtained, in which barrier ribs having an OD value of 2.0 per 0 ⁇ m were formed in a lattice pattern with a pitch of 40 ⁇ m on the short side and 280 ⁇ m on the long side.
  • barrier ribs having a height of 10 ⁇ m and a width of 20 ⁇ m were formed on the light shielding barrier ribs in a lattice pattern similar to that of the light shielding barrier ribs having a pitch of 40 ⁇ m on the short side and 280 ⁇ m on the long side. obtained a substrate with The color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method in a nitrogen atmosphere, and the mixture was heated at 100°C. After drying for 30 minutes, pixels with a thickness of 5.0 ⁇ m were formed to obtain a substrate with partition walls having the structure shown in FIG.
  • Example 71 The colorant obtained in Preparation Example 4 was applied to the regions separated by the partition walls of the substrate with partition walls before pixel formation, which was obtained by the same method as in Example 36, so that the film thickness after curing was 2.5 ⁇ m.
  • a filter-forming material (CF-1) was applied and vacuum dried. Exposure was performed at an exposure amount of 40 mJ/cm 2 (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C. for 30 minutes. A color filter layer was formed.
  • the color-converting light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the color filter in a nitrogen atmosphere using an inkjet method and dried at 100° C. for 30 minutes to obtain a thickness of 5.5. Pixels of 0 ⁇ m were formed to obtain a substrate with partition walls having the structure shown in FIG.
  • Example 72 The low refractive index layer-forming material obtained in Preparation Example 6 was spin-coated on the substrate with partition walls after forming pixels by the same method as in Example 36, and a hot plate (trade name: SCW-636, Dainippon Screen Mfg. Co., Ltd. (manufactured by Co., Ltd.), and dried at a temperature of 100° C. for 3 minutes to prepare a dry film. Furthermore, using an oven (trade name IHPS-222, manufactured by ESPEC Co., Ltd.), the mixture is heated in air at a temperature of 90° C. for 30 minutes to form a low refractive index layer having a height of 1.0 ⁇ m and a refractive index of 1.25. Then, a substrate with partition walls having the structure shown in FIG. 6 was obtained.
  • a hot plate trade name: SCW-636, Dainippon Screen Mfg. Co., Ltd. (manufactured by Co., Ltd.
  • IHPS-222 manufactured by ESPEC Co., Ltd.
  • Example 73 On the low refractive index layer of the substrate with partition walls having the low refractive index layer obtained in Example 72, using a plasma CVD apparatus (PD-220NL, manufactured by Samco), inorganic protection with a height of 50 to 1,000 nm A silicon nitride film having a thickness of 300 nm, which corresponds to layer I, was formed to obtain a substrate with partition walls having the structure shown in FIG.
  • a plasma CVD apparatus PD-220NL, manufactured by Samco
  • Example 74 A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate.
  • the light-shielding barrier rib forming material obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film.
  • the prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 40 mJ/cm 2 (g, h , i-line). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development is performed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. bottom. Furthermore, using an oven (trade name: IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230° C.
  • AD-2000 automatic developing device
  • IHPS-222 manufactured by ESPEC Co., Ltd.
  • a substrate with light-shielding barrier ribs was obtained, in which barrier ribs having an OD value of 2.0 per 0 ⁇ m were formed in a lattice pattern with a pitch of 40 ⁇ m on the short side and 280 ⁇ m on the long side.
  • the color filter forming material (CF-1) obtained in Preparation Example 4 was applied to the regions separated by the light-shielding partition walls so that the film thickness after curing was 2.5 ⁇ m, and dried in a vacuum. Exposure was performed at an exposure dose of 40 mJ/cm 2 (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C. for 30 minutes. A color filter layer was formed.
  • the low refractive index layer-forming material obtained in Preparation Example 6 was spin-coated and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film. Furthermore, using an oven (trade name IHPS-222, manufactured by ESPEC Co., Ltd.), the mixture is heated in air at a temperature of 90° C. for 30 minutes to form a low refractive index layer having a height of 1.0 ⁇ m and a refractive index of 1.25. bottom.
  • a hot plate trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.
  • IHPS-222 manufactured by ESPEC Co., Ltd.
  • a substrate with barrier ribs was formed thereon by the same method as in Example 36 to form barrier ribs having a height of 10 ⁇ m and a width of 20 ⁇ m in a lattice pattern similar to the light shielding barrier ribs having a pitch of 40 ⁇ m on the short side and 280 ⁇ m on the long side. got
  • the color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method in a nitrogen atmosphere, and the mixture was heated at 100°C. After drying for 30 minutes, pixels having a thickness of 5.0 ⁇ m were formed to obtain a substrate with partition walls having the structure shown in FIG.
  • Example 75 A plasma CVD apparatus ( PD-220NL (manufactured by Samco) was used to form a silicon nitride film with a thickness of 300 nm, which corresponds to the inorganic protective layer III with a thickness of 50 to 1,000 nm. Furthermore, on the inorganic protective layer III, in a nitrogen atmosphere, the color-converting light-emitting material composition (CL-2) obtained in Preparation Example 2 is applied using an inkjet method, dried at 100° C. for 30 minutes, and the thickness is Pixels of 5.0 ⁇ m were formed to obtain a substrate with partition walls having the configuration shown in FIG. 11 .
  • PD-220NL manufactured by Samco
  • Example 76 A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate.
  • a plasma CVD device (PD-220NL, manufactured by Samco) was used to form a silicon nitride film with a thickness of 300 nm thereon, which corresponds to the inorganic protective layer IV with a thickness of 50 to 1,000 nm.
  • a substrate with partition walls having the configuration shown in FIG. 12 was obtained in the same manner as in Example 36, except that the above substrate was used instead of the 10 cm square non-alkali glass substrate.
  • Example 77 A color filter layer having a thickness of 2.5 ⁇ m, a short side of 40 ⁇ m, and a long side of 280 ⁇ m was formed by the same method as in Example 71.
  • the resulting yellow organic protective layer-forming material (YL-1) was applied and vacuum-dried. Exposure was performed at an exposure amount of 300 mJ/cm 2 (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C.
  • a yellow organic protective layer having a thickness of 1.0 ⁇ m, a short side of 40 ⁇ m and a long side of 280 ⁇ m. Furthermore, on the yellow organic protective layer, in a nitrogen atmosphere, using an inkjet method, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 is applied, dried at 100 ° C. for 30 minutes, and the thickness is Pixels of 5.0 ⁇ m were formed to obtain a substrate with partition walls having the configuration shown in FIG. 11 .
  • Example 78 A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate.
  • the yellow organic protective layer-forming material (YL-1) obtained in Preparation Example 7 was applied thereon and vacuum dried. After exposing the dry film with an exposure dose of 300 mJ/cm 2 (g, h, i lines) without using a photomask, the film was developed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and the film was dried at 230°C for 30 seconds.
  • a yellow organic protective layer having a thickness of 1.0 ⁇ m was formed by heat curing for 1 minute.
  • a substrate with partition walls having the structure shown in FIG. 8 was obtained in the same manner as in Example 36, except that the above substrate was used instead of the 10 cm square non-alkali glass substrate. Tables 4 and 5 show the configuration of each example and comparative example.
  • the inflection point was the temperature corresponding to the peak in the DDSC (differential value of DSC) curve of the thermogram.
  • the DDSC curve was referred to as needed to confirm the DSC baseline.
  • the glass transition temperature (Tg) was evaluated as "A” when it was 60°C or higher, and as “B” when it was lower than 60°C.
  • ⁇ Refractive index of low refractive index layer> The low refractive index layer-forming material used in each example was applied onto a silicon wafer with a spinner, and a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) was used at a temperature of 90°C. Dried for 2 minutes. Then, using an oven (IHPS-222; manufactured by ESPEC Co., Ltd.), it was heated in the air at 90° C. for 30 minutes to prepare a cured film.
  • SCW-636 trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.
  • the refractive index was measured by irradiating light with a wavelength of 550 nm from the direction perpendicular to the surface of the cured film at 20° C. under atmospheric pressure. , rounded to the third decimal place.
  • a 10 cm square non-alkali glass substrate acting as a mask was placed on top of the prepared dry film for 1 minute, and the tackless property of the dry film was evaluated according to the following criteria. The lower the adhesiveness of the glass substrate, the higher the tackless property and the better the handleability.
  • B When the dry film and the glass substrate were superimposed, they stuck together, but the glass substrate was easily separated. The glass substrate was slightly stained due to the partition wall material.
  • C When the dry film and the glass substrate were overlapped, they adhered and stuck together. The glass substrate could not be easily separated. After separating the glass substrates, the glass substrates were stained by the partition wall material.
  • the barrier rib-forming resin composition used in each example and comparative example was spin-coated so that the film thickness after heating was 10 ⁇ m, 15 ⁇ m, 20 ⁇ m and 25 ⁇ m, respectively.
  • processing was performed under the same conditions as in each example and comparative example, and a solid film was formed on the glass substrate.
  • the resulting solid film was visually observed to evaluate the presence or absence of cracks in the solid film. If even one crack was confirmed, it was determined that the film had no crack resistance at that film thickness.
  • the crack resistant film thickness was judged to be “ ⁇ 15 ⁇ m”.
  • the crack resistant film thickness was determined as " ⁇ 25 ⁇ m” when there was no crack even at 25 ⁇ m, and the crack resistant film thickness was determined as " ⁇ 10 ⁇ m” when there was a crack even at 10 ⁇ m, and the crack resistance was determined.
  • ⁇ Wrinkle resistance> The partition-forming resin composition used in each example and comparative example was spin-coated so that the film thickness after heating was 10 ⁇ m, 15 ⁇ m, 20 ⁇ m and 25 ⁇ m, respectively.
  • processing was performed under the same conditions as in each example and comparative example, and a solid film was formed on the glass substrate.
  • the glass substrate having the solid film was visually observed to evaluate the presence or absence of wrinkles in the solid film. When wrinkles were confirmed, it was determined that the thickness had no wrinkle resistance.
  • the wrinkle resistance was determined as “ ⁇ 15 ⁇ m”.
  • the wrinkle resistance when there were no wrinkles even at 25 ⁇ m was judged as “ ⁇ 25 ⁇ m”
  • the wrinkle resistance when there were wrinkles at 10 ⁇ m was judged as “ ⁇ 10 ⁇ m”.
  • thermogravimetric analyzer TGA-50, manufactured by Shimadzu Corporation
  • the sample was held at 150°C for 30 minutes in a nitrogen atmosphere, then heated to 400°C at a heating rate of 10°C/min, and the weight was measured. bottom.
  • the temperature at which the weight decreased by 1% from the weight at the start of heating was taken as the 1% weight loss temperature. A higher 1% weight loss temperature indicates higher heat resistance.
  • the prepared dry film was measured using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, and each width of 100 ⁇ m, 80 ⁇ m, 60 ⁇ m, 50 ⁇ m, 40 ⁇ m, 30 ⁇ m and 20 ⁇ m. was exposed at an exposure amount of 300 mJ/cm 2 (i line) with a gap of 100 ⁇ m through a mask having a line and space pattern of . Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development is performed using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, and then water is used for 30 seconds. Rinse for seconds.
  • AD-2000 automatic developing device
  • the barrier rib-forming resin composition used in each example and comparative example was processed under the same conditions as in each example and comparative example, except that the entirety was exposed without passing through a photomask during exposure. A solid film with a thickness of 10 ⁇ m was produced. Using the obtained solid film as a model of the barrier ribs of the substrates with barrier ribs obtained in each example and comparative example, the glass substrate having the solid film was measured with a spectrophotometer (trade name: CM-2600d, manufactured by Konica Minolta Co., Ltd.).
  • ⁇ OD value> As a model of the barrier ribs of the substrate with barrier ribs obtained in each example and comparative example, a solid film having a height of 10 ⁇ m was formed on a glass substrate in the same manner as in the evaluation of the reflectance. For the glass substrate having the obtained solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (Hitachi High-Tech Science U-4100), and the OD at a wavelength of 300 to 800 nm was calculated according to the above formula (1). Values were calculated and compared with the value at 450 nm as a representative value.
  • Example 70 a solid film was similarly produced on a glass substrate as a model of the light shielding partition (A-2).
  • the intensity of incident light and transmitted light on the obtained glass substrate having the solid film was measured using an optical densitometer (Hitachi High-Tech Science U-4100), and the intensity was calculated according to the above formula (1).
  • ⁇ Taper angle> In each of the examples and comparative examples, an arbitrary cross section of the substrate with partition walls before pixel formation was measured using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) at an acceleration voltage of 3.0 kV. was observed and the taper angle was measured.
  • a 10 cm square non-alkali glass substrate manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm was used as the base substrate, and the barrier rib resin composition used in each example and comparative example was spin-coated thereon.
  • a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) was used to dry at a temperature of 100° C. for 3 minutes to prepare a dry film.
  • the prepared dry film is applied to a photomask (design: partition wall width 20 ⁇ m, opening short side 80 ⁇ m, opening length) using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source. 280 ⁇ m on the sides), exposure doses of 100 mJ/cm 2 and 500 mJ/cm 2 (irradiation with g, h, and i-rays; exposure doses are i-ray conversion values).
  • the line width of the barrier ribs processed with an exposure amount of 500 mJ/cm 2 is within +5.0 ⁇ m compared to the line width of the barrier ribs processed with an exposure amount of 100 mJ/cm 2 .
  • B The line width of the barrier ribs processed with an exposure amount of 500 mJ/cm 2 is +5.0 ⁇ m to +10 ⁇ m compared to the line width of the barrier ribs processed with an exposure amount of 100 mJ/cm 2 .
  • C The line width of the barrier ribs processed with an exposure amount of 500 mJ/cm 2 is +10 ⁇ m or more compared to the line width of the barrier ribs processed with an exposure amount of 100 mJ/cm 2 .
  • PGMEA was used as an ink for pixel portions surrounded by grid-shaped barrier ribs, and an inkjet coating device (InkjetLabo, cluster technology ( Co., Ltd.) was used for inkjet coating. 160 pL of PGMEA was applied to each grid pattern, and the presence or absence of breakage (a phenomenon in which ink crosses over the partition wall and mixes into the adjacent pixel portion) was observed, and the inkjet applicability was evaluated according to the following criteria. The smaller the breakage, the higher the liquid repellency and the better the inkjet applicability.
  • B Ink overflowed from the inside of the pixel to the upper surface of the partition in a part.
  • C Ink overflowed from the inside of the pixel to the upper surface of the partition on the entire surface.
  • the height of the structure before and after forming the pixel (B) was measured using a Surfcom stylus type film thickness measuring device, and the difference was calculated. , the height of the pixel (B) was measured. Further, for Examples 72 to 74, the film thickness of the low refractive index layer (C) is further measured. For Examples 71, 74 to 75, and 77, the film thickness of the color filter is further measured. The thickness (height) and the thickness (height) of the yellow organic protective layer of Examples 77 and 78 were measured in the same manner.
  • Examples 73 to 76 a cross section perpendicular to the base substrate was exposed using a polishing apparatus such as a cross section polisher, and the cross section was enlarged and observed with a scanning electron microscope or a transmission electron microscope. , respectively, the height of the inorganic protective layer was measured.
  • a planar light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the substrates with partition walls obtained in each example and comparative example were placed so that the pixel portion was on the light source side.
  • a current of 30 mA is passed through this planar light emitting device to light the LED element, and the luminance (unit: cd/m 2 ) based on the CIE1931 standard is measured using a spectral radiance meter (CS-1000, manufactured by Konica Minolta). measured and taken as the initial luminance.
  • CS-1000 spectral radiance meter
  • the luminance was similarly measured to evaluate the change in luminance over time.
  • the evaluation of the brightness was performed using a relative value with the initial brightness of Example 67 being 100 as the standard.
  • CM-2600d manufactured by Konica Minolta, measuring diameter ⁇ 8 mm
  • the substrate with partition walls was irradiated with light from the underlying substrate side, and the spectrum including regular reflection light was measured.
  • Color standard BT The color gamut defined by 2020 is defined as the three primary colors red, green and blue on the spectral locus shown in the chromaticity diagram, with the wavelengths of red, green and blue corresponding to 630 nm, 532 nm and 467 nm respectively.
  • R reflectance
  • Display characteristics The display characteristics of the display devices produced by combining the substrates with partition walls obtained in each of the examples and the comparative examples and the organic EL elements were evaluated based on the following criteria.
  • a color-converting luminescent material composition ( CL-2) was applied and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 ⁇ m. Then, of the pixel portions surrounded by the grid-like partition walls, the color-converting light-emitting material composition (CL -3) was applied and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 ⁇ m.
  • a blue organic EL cell having the same width as the pixel portion surrounded by the grid-like partition walls was prepared, and the substrate with the partition walls and the blue organic EL cell were opposed to each other and bonded with a sealant, as shown in FIG. A display device of the configuration was obtained.
  • the blue organic EL cells 11 in FIG. 15 only the blue organic EL cells bonded immediately below the pixels 3 (CL-2) formed of the color-converting light-emitting material composition (CL-2) are lit.
  • Tables 6 and 7 show the evaluation results of each example and comparative example.

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