WO2023047986A1 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

Info

Publication number
WO2023047986A1
WO2023047986A1 PCT/JP2022/033892 JP2022033892W WO2023047986A1 WO 2023047986 A1 WO2023047986 A1 WO 2023047986A1 JP 2022033892 W JP2022033892 W JP 2022033892W WO 2023047986 A1 WO2023047986 A1 WO 2023047986A1
Authority
WO
WIPO (PCT)
Prior art keywords
phase
circuit unit
bus bar
power conversion
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/033892
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
淳史 細川
祥平 東谷
翔太 佐藤
基 豊田
亮 竹井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to CN202280062015.3A priority Critical patent/CN117957759A/zh
Priority to JP2023549475A priority patent/JP7570528B2/ja
Publication of WO2023047986A1 publication Critical patent/WO2023047986A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

Definitions

  • the present disclosure relates to a power converter.
  • a power converter that includes a plurality of semiconductor elements connected in parallel and a bus bar.
  • the semiconductor element is, for example, an insulated gate bipolar transistor (IGBT).
  • the bus bar connects each semiconductor element in parallel.
  • the bus bar connects each semiconductor element to a load.
  • the load is, for example, a hoist or a motor. If there is a large difference in the impedance of the busbar from each semiconductor element to the load, it will be difficult to pass a uniform current through each semiconductor element. That is, the current flowing through each semiconductor element may be biased.
  • a three-phase power conversion device (power conversion device) described in Japanese Patent No. 5557891 (Patent Document 1) includes a plurality of semiconductor elements (first phase first power conversion circuit unit and first phase second power conversion circuit unit), cooling fins (first cooling plate) connected to each of the plurality of semiconductor elements, and bus bars (first bus bars).
  • the plurality of semiconductor elements are arranged at symmetrical positions with respect to the bus bar. This reduces the difference in the length of the busbar from each of the plurality of semiconductor elements to the load. Therefore, the difference in the inductance values of the busbars from each of the plurality of semiconductor elements to the load is reduced. Therefore, the difference in impedance between the busbars from each of the plurality of semiconductor elements to the load is reduced.
  • the busbars have a three-dimensional shape arranged so as to sandwich the cooling fins. Therefore, the busbar is long.
  • the present disclosure has been made in view of the above problems, and an object of the present disclosure is to shorten the first bus bar and to reduce the impedance of the first bus bar from the first phase first power conversion circuit unit to the load and the first It is an object of the present invention to provide a power conversion device capable of reducing the difference in impedance between a phase second power conversion circuit unit and a load of a first bus bar.
  • a power conversion device of the present disclosure includes a first phase unit group, a first bus bar, and a first cooling plate.
  • the first phase unit group includes a first phase first power conversion circuit unit and a first phase second power conversion circuit unit.
  • the first phase second power inverter circuit unit is arranged so as to be adjacent to the first phase first power inverter circuit unit.
  • the first bus bar includes a first phase first connecting portion and a first phase second connecting portion.
  • the first phase first connection section is electrically connected to the first phase first power inverter circuit unit.
  • the first phase second connection portion is electrically connected to the first phase first connection portion.
  • the first phase second connection section is electrically connected to the first phase second power inverter circuit unit.
  • the first cold plate is connected to the first phase unit group.
  • the first phase first connecting portion and the first phase second connecting portion of the first bus bar are arranged in the same plane on the side opposite to the first cooling plate with respect to the first phase unit group.
  • the first phase first connection portion and the first phase second connection portion of the first bus bar are on the same plane on the side opposite to the first cooling plate with respect to the first phase unit group. placed inside. Therefore, the first bus bar can be shortened, and the impedance of the first bus bar from the first phase first power conversion circuit unit to the load and the impedance of the first bus bar from the first phase second power conversion circuit unit to the load The difference with impedance can be reduced.
  • FIG. 1 is a perspective view schematically showing the configuration of a power converter according to Embodiment 1;
  • FIG. 2 is a perspective view schematically showing a configuration of a first phase first power conversion circuit unit, a first cooling plate and bolts of the power converter according to Embodiment 1;
  • FIG. 3 is a perspective view schematically showing a configuration of a power conversion device according to a modification of Embodiment 1;
  • 1 is a perspective view schematically showing the configuration of an elevator control panel to which the power converter according to Embodiment 1 is applied;
  • FIG. 1 is a perspective view schematically showing the internal configuration of an elevator control panel to which the power converter according to Embodiment 1 is applied;
  • FIG. 1 is a circuit diagram schematically showing the configuration of a power converter according to Embodiment 1;
  • FIG. FIG. 2 is a circuit diagram schematically showing the configuration of a power conversion device according to a first comparative example;
  • FIG. 7 is a perspective view schematically showing the configuration of a power conversion device according to Embodiment 2;
  • FIG. 11 is a front view schematically showing the configuration of a conductor portion of a power conversion device according to Embodiment 3;
  • FIG. 8 is a perspective view schematically showing the configuration of a power conversion device according to another modification of Embodiment 1;
  • FIG. 2 is a side view schematically showing the general layout of a control panel
  • 1 is a side view schematically showing the layout of an elevator control panel to which the power converter according to Embodiment 1 is applied
  • FIG. FIG. 11 is a perspective view schematically showing the configuration of a power converter according to Embodiment 4
  • 10A and 10B are a front view and a side view schematically showing a configuration of an in-phase bus bar of a power converter according to Embodiment 4;
  • Embodiment 1 The configuration of a power converter 100 according to Embodiment 1 will be described with reference to FIGS. 1 to 4.
  • FIG. The power conversion device 100 is configured as a three-phase power conversion device. As will be described later, the power converter 100 according to the present embodiment can be applied to a control panel for elevators.
  • the power converter 100 mainly includes a first phase unit group 1U, a first bus bar 2U, and a first cooling plate 4U.
  • power converter 100 includes second phase unit group 1V, third phase unit group 1W, second bus bar 2V, third bus bar 2W, fourth bus bar 3U, and fifth bus bar 3V.
  • the bolt 6 is indicated by a double circle for convenience of explanation.
  • the first phase unit group 1U, second phase unit group 1V and third phase unit group 1W are configured to perform input and output of U phase, V phase and W phase, respectively.
  • the first phase unit group 1U, the second phase unit group 1V and the third phase unit group 1W have the same shape.
  • the first to sixth bus bars 2U to 3W have the same shape.
  • the first cooling plate 4U, the second cooling plate 4V and the third cooling plate 4W have the same shape.
  • the first phase unit group 1U includes a first phase first power inverter circuit unit 1U1 and a first phase second power inverter circuit unit 1U2.
  • the first phase unit group 1U may be configured in parallel with a first phase first power inverter circuit unit 1U1 and a first phase second power inverter circuit unit 1U2.
  • the first phase unit group 1U may further include a first phase third power inverter circuit unit 1U3.
  • the first phase unit group 1U is configured as three parallel units of a first phase first power conversion circuit unit 1U1, a first phase second power conversion circuit unit 1U2, and a first phase third power conversion circuit unit 1U3.
  • each of the first-phase first power inverter circuit unit 1U1 to the first-phase third power inverter circuit unit 1U3 is configured as a one-phase, one-parallel power inverter circuit unit.
  • each power inverter circuit unit of the first phase unit group 1U has the same shape as each other.
  • the first-phase second power inverter circuit unit 1U2 is arranged so as to be adjacent to the first-phase first power inverter circuit unit 1U1.
  • the first-phase third power inverter circuit unit 1U3 is arranged on the side opposite to the first-phase first power inverter circuit unit 1U1 with respect to the first-phase second power inverter circuit unit 1U2. are placed next to each other.
  • the first-phase first power inverter circuit unit 1U1, the first-phase second power inverter circuit unit 1U2, and the first-phase third power inverter circuit unit 1U3 are arranged adjacent to each other in this order.
  • the direction in which the first phase first power inverter circuit unit 1U1 and the first phase second power inverter circuit unit 1U2 are arranged is the first direction DR1.
  • a direction in which a first input-side semiconductor module 1U11 and a first output-side semiconductor module 1U12, which will be described later, are arranged is a second direction DR2.
  • the direction in which the first phase unit group 1U and the first cooling plate 4U are superimposed is the third direction DR3.
  • First direction DR1, second direction DR2 and third direction DR3 intersect each other.
  • first direction DR1, second direction DR2 and third direction DR3 are orthogonal to each other.
  • the first phase first power conversion circuit unit 1U1 includes a first input side semiconductor module 1U11, a first output side semiconductor module 1U12, a first phase first capacitor 1U13, and a first phase first substrate 1U14.
  • the first-phase first power conversion circuit unit 1U1 consists of the first input-side semiconductor module 1U11, the first-phase first capacitor 1U13, and the first output-side semiconductor module 1U12, or the first output-side semiconductor module 1U12, the first-phase first power conversion circuit unit 1U1.
  • 1 capacitor 1U13 and first input side semiconductor module 1U11 are configured to flow current in order.
  • the input-side semiconductor modules of each power conversion circuit unit have the same shape.
  • the output-side semiconductor modules of each power conversion circuit unit have the same shape.
  • the capacitors of each power conversion circuit unit have the same shape.
  • the substrates of each power inverter circuit unit have the same shape.
  • the first output side semiconductor module 1U12 is electrically connected to the first input side semiconductor module 1U11 via the first phase first capacitor 1U13.
  • the first phase first capacitor 1U13 is electrically connected to the first input side semiconductor module 1U11.
  • the first phase first capacitor 1U13 is mounted on the first phase first substrate 1U14. Therefore, the first phase first capacitor 1U13 is mounted on the substrate.
  • the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 are configured by, for example, a 2-in-1 package in which two insulated gate bipolar transistors (IGBT) are built in one package.
  • the first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 are not limited to the 2in1 package, and a 1in1 package or the like may be used. In this case, each package is connected by, for example, a bus bar.
  • the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 may be composed of metal oxide semiconductor field effect transistors (MOSFETs) or transistors.
  • MOSFETs metal oxide semiconductor field effect transistors
  • the types of the first phase first capacitor 1U13 are, for example, film capacitors and electrolytic capacitors.
  • the type of the first phase first capacitor 1U13 may be appropriately determined according to the application.
  • a plurality of capacitors connected in series or in parallel may be mounted on the first phase first substrate 1U14.
  • the first phase first capacitor 1U13 is mounted on the first phase first substrate 1U14 by soldering, for example.
  • the first phase first substrate 1U14 is fixed to the first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 by through holes and male screws provided in the substrate.
  • a through hole of the first phase first substrate 1U14 may be used as the through hole. It may be fixed to the first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 by terminals connected to the first phase first substrate 1U14.
  • the terminals are made of metal having high electrical conductivity, such as copper (Cu) and aluminum (Al).
  • the first phase first substrate 1U14 is, for example, a printed circuit board.
  • the first phase first substrate 1U14 may be, for example, a laminate busbar in which a busbar and an insulating film are combined.
  • the first phase first capacitor 1U13 mounted on the first phase first substrate 1U14 may interfere with the base portion 41 of the first cooling plate 4U.
  • a spacer may be arranged between the first phase first substrate 1U14 and the first input side semiconductor module 1U11 or the first output side semiconductor module 1U12.
  • the distance between the first phase first substrate 1U14 and the base portion 41 of the first cooling plate 4U can be increased, and interference between the first phase first substrate 1U14 and the first cooling plate 4U can be suppressed. .
  • the first input side semiconductor module 1U11, the first phase first capacitor 1U13 and the first output side semiconductor module 1U12 are arranged along the first cooling plate 4U.
  • the first input side semiconductor module 1U11, the first phase first capacitor 1U13 and the first output side semiconductor module 1U12 are arranged in a straight line on one side of the first cooling plate 4U.
  • first input side semiconductor module 1U11, first phase first capacitor 1U13 and first output side semiconductor module 1U12 are connected along second direction DR2.
  • first input side semiconductor module 1U11, first phase first capacitor 1U13 and first output side semiconductor module 1U12 are arranged on a straight line along second direction DR2.
  • the second phase unit group 1V is arranged so as to be adjacent to the first phase unit group 1U along the first direction DR1.
  • the second phase unit group 1V includes a second phase first power inverter circuit unit 1V1, a second phase second power inverter circuit unit 1V2, and a second phase third power inverter circuit unit 1V3.
  • the second phase unit group 1V is three parallel.
  • the second phase first power inverter circuit unit 1V1 is arranged so as to be adjacent to the first phase unit group 1U.
  • the second phase second power inverter circuit unit 1V2 is arranged on the opposite side of the second phase first power inverter circuit unit 1V1 from the first phase unit group 1U along the first direction DR1.
  • the second-phase third power inverter circuit unit 1V3 is arranged on the opposite side of the second-phase first power inverter circuit unit 1V1 with respect to the second-phase second power inverter circuit unit 1V2 along the first direction DR1.
  • the third phase unit group 1W is arranged so as to be adjacent to the second phase unit group 1V along the first direction DR1.
  • the third phase unit group 1W includes a third phase first power inverter circuit unit 1W1, a third phase second power inverter circuit unit 1W2, and a third phase third power inverter circuit unit 1W3.
  • the third phase unit group 1W is three parallel.
  • the third-phase first power inverter circuit unit 1W1 is arranged on the opposite side of the second-phase unit group 1V from the first-phase unit group 1U along the first direction DR1.
  • the third-phase second power inverter circuit unit 1W2 is arranged on the side opposite to the second-phase unit group 1V with respect to the third-phase first power inverter circuit unit 1W1 along the first direction DR1.
  • the third phase third power inverter circuit unit 1W3 is arranged on the side opposite to the third phase first power inverter circuit unit 1W1 with respect to the third phase second power inverter circuit unit 1W2 along the first direction DR1.
  • the conversion circuit unit 1V2, the second phase third power conversion circuit unit 1V3, the third phase first power conversion circuit unit 1W1, the third phase second power conversion circuit unit 1W2, and the third phase third power conversion circuit unit 1W3 are They are arranged in this order along the first direction DR1.
  • the first-phase first power inverter circuit unit 1U1, the first-phase second power inverter circuit unit 1U2, the second-phase first power inverter circuit unit 1V1, and the second-phase second power inverter circuit unit 1V2 are connected to the first They are arranged in this order along the direction DR1.
  • the first phase second power inverter circuit unit 1U2, the first phase third power inverter circuit unit 1U3, the second phase first power inverter circuit unit 1V1, the second phase second power inverter circuit unit 1V2, the second phase The third power conversion circuit unit 1V3, the third phase first power conversion circuit unit 1W1, the third phase second power conversion circuit unit 1W2, and the third phase third power conversion circuit unit 1W3 are connected to the first input side semiconductor module 1U11. It has the same input side semiconductor module and the same output side semiconductor module as the first output side semiconductor module 1U12. In this case, the structure of each power conversion circuit unit can be made common. Therefore, the manufacturing cost of the power conversion device 100 can be reduced by standardizing the manufacturing and assembly work of each power conversion circuit unit.
  • the power conversion device 100 Since the power conversion device 100 is a three-phase power conversion device, the power conversion device 100 includes at least three power conversion circuit units. In this embodiment, the power conversion device 100 is a three-phase three-parallel power conversion device, so the power conversion device 100 includes nine power conversion circuit units. When the power conversion device 100 is a three-phase two-parallel power conversion device, the power conversion device 100 includes six power conversion circuit units.
  • Each power conversion circuit unit of each phase unit group includes an input-side semiconductor module, an output-side semiconductor module, and a capacitor.
  • Each of the input-side semiconductor module and the output-side semiconductor module is configured as a 2-in-1 package in which two IGBT modules are mounted in one package.
  • the first bus bar 2U to the sixth bus bar 3W are bus bars for inputting and outputting electric current.
  • the first to third busbars 2U to 2W are input-side busbars.
  • the fourth bus bar 3U to the sixth bus bar 3W are bus bars on the output side.
  • the first busbar 2U to the third busbar 2W are the main power supply side busbars, and the fourth busbar 3U to the sixth busbar 3W. is the hoist side bus bar.
  • the first to sixth bus bars 2U to 3W are arranged on the same plane.
  • the first bus bar 2U is arranged only on the side opposite to the first cooling plate 4U with respect to the first phase unit group 1U.
  • the first bus bar 2U is arranged in the same plane on the side opposite to the first cooling plate 4U with respect to the first phase unit group 1U.
  • first bus bar 2U is configured as a flat plate, mounting of first bus bar 2U is easier than when first bus bar 2U is configured three-dimensionally.
  • first bus bar 2U has a shape that is line-symmetrical with respect to second direction DR2.
  • the first bus bar 2U electrically connects the first phase first power inverter circuit unit 1U1 to the first phase second power inverter circuit unit 1U2.
  • the first bus bar 2U electrically connects the first phase first power inverter circuit unit 1U1, the first phase second power inverter circuit unit 1U2 and the third phase unit group 1W to each other.
  • the first bus bar 2U includes a first phase first connection portion 2U1, a first phase second connection portion 2U2, and a first phase third connection portion 2U3.
  • the first phase first connection section 2U1 is electrically connected to the first phase first power inverter circuit unit 1U1.
  • the first phase second connection portion 2U2 is electrically connected to the first phase first connection portion 2U1.
  • the first phase second connection section 2U2 is electrically connected to the first phase second power inverter circuit unit 1U2.
  • the first phase third connection portion 2U3 is electrically connected to the first phase second connection portion 2U2.
  • the first phase third connection section 2U3 is electrically connected to the first phase third power inverter circuit unit 1U3.
  • the first phase first connection portion 2U1 and the first phase second connection portion 2U2 of the first bus bar 2U are arranged on the same plane on the side opposite to the first cooling plate 4U with respect to the first phase unit group 1U.
  • the plane mentioned above is a virtual plane formed by the first direction DR1 and the second direction DR2.
  • the first phase first connection portion 2U1, the first phase second connection portion 2U2, and the first phase third connection portion 2U3 are arranged in the same plane on the opposite side of the first phase unit group 1U as the first cooling plate 4U. are placed in The first phase first connection portion 2U1, the first phase second connection portion 2U2, and the first phase third connection portion 2U3 are arranged only on one side of the first cooling plate 4U.
  • the first phase first connection portion 2U1, the first phase second connection portion 2U2, and the first phase third connection portion 2U3 are arranged only on the opposite side of the first phase unit group 1U from the first cooling plate 4U. ing.
  • a first input side terminal 2U0 is provided on the first bus bar 2U.
  • An electric wire or a busbar connected to a component such as an input reactor is connected to the first input side terminal 2U0.
  • the shortest distance to the third phase input side semiconductor module 1U31 is longer than the shortest distance from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21 via the first phase second connection portion 2U2.
  • First-phase first connection portion 2U1 and first-phase third connection portion 2U3 have larger dimensions in first direction DR1 than first-phase second connection portion 2U2.
  • the resistance value from the first input side terminal 2U0 to the first input side semiconductor module 1U11, the resistance value from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21, and the first input side terminal 2U0 to the first phase third input side semiconductor module 1U31 can be made equal to each other.
  • the second bus bar 2V electrically connects the second phase first power conversion circuit unit 1V1 to the second phase second power conversion circuit unit 1V2.
  • the second bus bar 2V electrically connects the second-phase first power inverter circuit unit 1V1, the second-phase second power inverter circuit unit 1V2, and the second-phase third power inverter circuit unit 1V3 to each other.
  • the second bus bar 2V includes a second phase first connection portion 2V1, a second phase second connection portion 2V2, and a second phase third connection portion 2V3.
  • the second phase first connection section 2V1 is electrically connected to the second phase first power inverter circuit unit 1V1.
  • the second phase second connection portion 2V2 is electrically connected to the second phase first connection portion 2V1.
  • the second phase second connection portion 2V2 is electrically connected to the second phase second power inverter circuit unit 1V2.
  • the second phase third connection portion 2V3 is electrically connected to the second phase second connection portion 2V2.
  • the second phase third connection section 2V3 is electrically connected to the second phase third power conversion circuit unit 1V3.
  • the second phase first connection portion 2V1 and the second phase second connection portion 2V2 of the second bus bar 2V are arranged on the same plane on the side opposite to the second cooling plate 4V with respect to the second phase unit group 1V.
  • the second phase first connection portion 2V1, the second phase second connection portion 2V2, and the second phase third connection portion 2V3 are in the same plane on the side opposite to the second cooling plate 4V with respect to the second phase unit group 1V.
  • the second phase first connection portion 2V1, the second phase second connection portion 2V2, and the second phase third connection portion 2V3 are arranged only on one side of the second cooling plate 4V.
  • the second phase first connection portion 2V1, the second phase second connection portion 2V2, and the second phase third connection portion 2V3 are arranged only on the side opposite to the second cooling plate 4V with respect to the second phase unit group 1V. ing.
  • the third bus bar 2W electrically connects the third phase first power inverter circuit unit 1W1 to the third phase second power inverter circuit unit 1W2.
  • the third bus bar 2W electrically connects the third-phase first power inverter circuit unit 1W1, the third-phase second power inverter circuit unit 1W2, and the third-phase third power inverter circuit unit 1W3 to each other.
  • the third bus bar 2W includes a third phase first connection portion 2W1, a third phase second connection portion 2W2, and a third phase third connection portion 2W3.
  • the third phase first connection portion 2W1 is electrically connected to the third phase first power inverter circuit unit 1W1.
  • the third phase second connection portion 2W2 is electrically connected to the third phase first connection portion 2W1.
  • the third-phase second connection portion 2W2 is electrically connected to the third-phase second power inverter circuit unit 1W2.
  • the third phase third connection portion 2W3 is electrically connected to the third phase second connection portion 2W2.
  • the third phase third connection portion 2W3 is electrically connected to the third phase third power inverter circuit unit 1W3.
  • the third phase first connection portion 2W1 and the third phase second connection portion 2W2 of the third bus bar 2W are arranged on the same plane on the side opposite to the third cooling plate 4W with respect to the third phase unit group 1W.
  • the third phase first connection portion 2W1, the third phase second connection portion 2W2, and the third phase third connection portion 2W3 are arranged in the same plane on the side opposite to the third cooling plate 4W with respect to the third phase unit group 1W. are placed in The third phase first connection portion 2W1, the third phase second connection portion 2W2 and the third phase third connection portion 2W3 are arranged only on one side of the third cooling plate 4W.
  • the third phase first connection portion 2W1, the third phase second connection portion 2W2, and the third phase third connection portion 2W3 are arranged only on the side opposite to the third cooling plate 4W with respect to the third phase unit group 1W. ing.
  • the first bus bar 2U electrically connects the first phase first power conversion circuit unit 1U1, the first phase second power conversion circuit unit 1U2, and the third phase unit group 1W on the input side.
  • the second bus bar 2V electrically connects the second phase first power inverter circuit unit 1V1, the second phase second power inverter circuit unit 1V2, and the second phase third power inverter circuit unit 1V3 on the input side.
  • the third bus bar 2W electrically connects the third phase first power inverter circuit unit 1W1, the third phase second power inverter circuit unit 1W2, and the third phase third power inverter circuit unit 1W3 on the input side. .
  • the fourth bus bar 3U electrically connects the first phase first power inverter circuit unit 1U1, the first phase second power inverter circuit unit 1U2 and the third phase unit group 1W to each other on the output side.
  • the fifth bus bar 3V electrically connects the second phase first power inverter circuit unit 1V1, the second phase second power inverter circuit unit 1V2, and the second phase third power inverter circuit unit 1V3 to each other on the output side.
  • the sixth bus bar 3W electrically connects the third phase first power inverter circuit unit 1W1, the third phase second power inverter circuit unit 1W2, and the third phase third power inverter circuit unit 1W3 on the output side.
  • the conductor portion 5 includes an intraphase busbar 51 , an interphase busbar 52 , a first connection member 53 and a second connection member 54 .
  • the intra-phase bus bar 51 electrically connects the first phase first power inverter circuit unit 1U1 to the first phase second power inverter circuit unit 1U2.
  • the intra-phase bus bar 51 electrically connects the first phase third power inverter circuit unit 1U3 to the first phase second power inverter circuit unit 1U2.
  • the intra-phase bus bar 51 includes a first input side intra-phase bus bar 511, a first phase second input side intra-phase bus bar 512, a first output side intra-phase bus bar 513, a first phase second output side phase inner bus bar 514 .
  • the first input side intra-phase bus bar 511 electrically connects the first input side semiconductor module 1U11 to the first phase second input side semiconductor module 1U21.
  • the first phase second input side intra-phase bus bar 512 electrically connects the first phase third input side semiconductor module 1U31 to the first phase second input side semiconductor module 1U21.
  • the first output side intra-phase bus bar 513 electrically connects the first output side semiconductor module 1U12 to the first phase second output side semiconductor module 1U22.
  • the first phase second output side intra-phase bus bar 514 electrically connects the first phase third output side semiconductor module 1U32 to the first phase second output side semiconductor module 1U22.
  • the first input side internal phase bus bar 511 has the same shape as the first phase second input side internal phase bus bar 512 .
  • the first output side internal phase bus bar 513 has the same shape as the first phase second output side internal phase bus bar 514 .
  • the first input side inner phase bus bar 511, the first phase second input side inner phase bus bar 512, the first output side inner phase bus bar 513, and the first phase second output side inner phase bus bar 514 have the same shape. have.
  • each intra-phase bus bar 51 is connected to one terminal per semiconductor module. That is, each intra-phase bus bar 51 is connected to one terminal of each semiconductor module. As shown in FIG. 10, each in-phase bus bar 51 may be shaped to be connectable to the other terminal of each semiconductor module by extending the outer portion. For example, in the first input-side semiconductor module 1U11, the first input-side semiconductor module 1U11 includes two terminals. Each intra-phase bus bar 51 is connected to each terminal. As an effect of this, the conduction resistance from each semiconductor module to each interphase bus bar 52 is reduced, and the heat generated in each semiconductor module is equalized. In addition, in the case of this shape, it becomes impossible to make all the in-phase bus bars 51 the same shape.
  • the interphase bus bar 52 electrically connects the first phase first power conversion circuit unit 1U1 and the first phase second power conversion circuit unit 1U2 to the second phase unit group 1V.
  • Interphase bus bar 52 electrically connects first phase unit group 1U, second phase unit group 1V, and third phase unit group 1W to each other.
  • the interphase busbar 52 includes a first connection point 520 .
  • a first connection point 520 is electrically connected to each capacitor.
  • the first phase first power inverter circuit unit 1U1, the first phase second power inverter circuit unit 1U2 and the first phase third power inverter circuit unit 1U3 are connected to the intra-phase bus bar 51 and the first connection member. 53.
  • the shortest distance from the first phase first power inverter circuit unit 1U1 to the first connection point 520 is equal to the shortest distance from the first phase second power inverter circuit unit 1U2 to the first connection point 520.
  • the shortest distance from the first phase first power inverter circuit unit 1U1 to the first connection point 520 is equal to the shortest distance from the first phase third power inverter circuit unit 1U3 to the first connection point 520.
  • the phase-to-phase busbar 52 includes an input-side phase-to-phase busbar 521 and an output-side phase-to-phase busbar 522 .
  • Input side interphase bus bar 521 electrically connects first phase unit group 1U, second phase unit group 1V and third phase unit group 1W to each other on the input side.
  • Output-side interphase bus bar 522 electrically connects first phase unit group 1U, second phase unit group 1V, and third phase unit group 1W to each other on the output side.
  • the input side interphase busbar 521 has the same shape as the output side interphase busbar 522 .
  • the first connection member 53 connects the first input side intra-phase bus bar 511 and the first phase second input side intra-phase bus bar 512 to the input side inter-phase bus bar 521 .
  • the second connection member 54 connects the first output side intra-phase bus bar 513 and the first phase second output side intra-phase bus bar 514 to the output side inter-phase bus bar 522 .
  • the first connection member 53 and the second connection member 54 have a three-branched shape.
  • the shortest distance from the first phase first power inverter circuit unit 1U1 to the first connection point 520 via the first connection member 53 is the first distance from the first phase second power inverter circuit unit 1U2 to the first connection point 520. It is equal to the shortest distance via connecting member 53 .
  • the shortest distance from the first phase first power inverter circuit unit 1U1 to the first connection point 520 via the first connection member 53 is from the first phase third power inverter circuit unit 1U3 to the first connection point 520. is equal to the shortest distance via the first connecting member 53 of .
  • the intra-phase bus bar 51 and the inter-phase bus bar 52 may be connected to the terminal portions of the first connecting member 53 or the second connecting member 54 by, for example, fastening together.
  • the material of the conductor portion 5 is, for example, copper (Cu), aluminum (Al), brass, or alloys thereof.
  • the dimension (length) of the conductor portion 5 in the first direction DR1 is, for example, 100 mm or more and 1000 mm or less.
  • the dimension (width) of the conductor portion 5 in the second direction DR2 is, for example, 10 mm or more and 150 mm or less.
  • the dimension (thickness) of the conductor portion 5 in the third direction DR3 is, for example, 0.5 mm or more and 20 mm. If the number of parallel power conversion devices 100 is large, the dimensions of the conductor part 5 can be even larger.
  • the shape of in-phase bus bar 51 and inter-phase bus bar 52 is not limited to a linear shape. Intra-phase bus bar 51 and inter-phase bus bar 52 may be bent wholly or partially in consideration of ease of mounting in control panel 200 . In addition, as described later, the conductor portion 5 may be configured by a printed circuit board.
  • the power converter 100 further includes a plurality of bolts 6 and nuts (not shown).
  • Each of the plurality of bolts 6 is arranged on the opposite side of the conductor portion 5 from the first cooling plate 4U.
  • the multiple nuts are fixed by caulking, for example. Caulking improves ease of assembly (assemblability) and ease of maintenance (maintainability).
  • the conductor portion 5 is fixed to the first phase unit group 1U with a plurality of bolts 6 and a plurality of nuts.
  • In-phase bus bar 51 is connected to inter-phase bus bar 52 by a plurality of bolts 6 and a plurality of nuts.
  • a groove to which the bolt 6 can be fastened may be provided as a substitute for the nut.
  • the intra-phase bus bar 51 and the inter-phase bus bar 52 are connected to the first connecting member 53 or the second connecting member 54 at their connecting portions. If there is an oxide film and dirt on the connecting portion, or if the connecting portion has a low degree of flatness, the contact resistance of the connecting portion increases, which can cause uneven temperature rise. For this reason, preferably, the connecting portion of the conductor portion 5 is plated. If the connecting portion is not plated, it is desirable to polish the connecting portion by rubbing it with a metal brush or the like before connecting. In this case, by applying a compound or the like to the connection portion, the reliability is further improved.
  • Each of the plurality of bolts 6 is arranged on the side opposite to the first cooling plate 4U with respect to the first bus bar 2U.
  • the first bus bar 2U is fixed by a plurality of bolts 6 and a plurality of nuts to the holes provided at the ends of the first bus bar 2U and the terminals of the first phase unit group 1U, thereby forming the first phase unit group 1U. is fixed to
  • first cooling plate 4U, second cooling plate 4V, and third cooling plate 4W ⁇ Configuration of first cooling plate 4U, second cooling plate 4V, and third cooling plate 4W>
  • the first cooling plate 4U, the second cooling plate 4V and the third cooling plate 4W are arranged along the first direction DR1.
  • the material of the first cooling plate 4U, the second cooling plate 4V, and the third cooling plate 4W is, for example, aluminum (Al), copper (Cu), iron (Fe), or the like.
  • the first cooling plate 4U is connected to the first phase unit group 1U.
  • the first cooling plate 4U is connected to the first phase unit group 1U along the third direction DR3.
  • the first cooling plate 4U is configured as a heat sink.
  • the first cooling plate 4U includes a base portion 41 and a plurality of fin portions 42.
  • a first phase unit group 1U is connected to the base portion 41 .
  • the first phase unit group 1U is fixed to the base portion 41 by screws, for example.
  • the base portion 41 is connected to the first phase unit group 1U via, for example, heat dissipation grease or a heat dissipation sheet. Thereby, the heat generated in the first phase unit group 1U is diffused through the base portion 41.
  • a heat pipe (not shown) may be embedded in the base portion 41 .
  • the first phase first substrate 1U14 includes a mounting surface 14a on which the first phase first capacitor 1U13 is mounted and a facing surface 14b facing the mounting surface 14a.
  • the mounting surface 14 a faces the base portion 41 .
  • electronic components such as the first phase first capacitor 1U13 are not mounted on the facing surface 14b.
  • the facing surface 14b is flat. This can prevent the electronic component from protruding to the front side of the first phase unit group 1U. Therefore, it is possible to suppress the expansion of the mounting area in which the electronic component is mounted.
  • the plurality of fin portions 42 protrude from the base portion 41 toward the side opposite to the first phase unit group 1U with respect to the base portion 41 .
  • the base portion 41 and the plurality of fin portions 42 may be integrally molded.
  • the plurality of fin portions 42 may be connected to the base portion 41 by caulking. Cooling air is sent to the plurality of fin portions 42 by a cooling fan 7 (see FIG. 1).
  • the first cooling plate 4U includes a first input side cooling portion 4U11 and a first output side cooling portion 4U12.
  • the first input side cooling unit 4U11 is connected to the first input side semiconductor module 1U11.
  • the first output side cooling unit 4U12 is connected to the first output side semiconductor module 1U12.
  • the first input side cooling section 4U11 is configured as a separate body from the first output side cooling section 4U12.
  • the first input-side cooling unit 4U11 and the first output-side cooling unit 4U12 are arranged with an interval along the second direction DR2.
  • the first input side cooling section 4U11 has dimensions different from those of the first output side cooling section 4U12.
  • the dimension in the second direction DR2 of the first phase first cooling section is different from the dimension of the first phase second cooling section.
  • the dimensions of the first phase first cooling section and the first phase second cooling section are determined according to the heat generated in the first input side semiconductor module 1U11 and the first output side semiconductor module 1U12.
  • the dimension of the first phase first cooling section in the second direction DR2 is It is smaller than the dimension in the second direction DR2 of the first phase second cooling section.
  • the first-phase first cooling section and the first-phase second cooling section may differ in dimension in the third direction DR3, and may differ in the type of cooler. If the heat generated in the first input side semiconductor module 1U11 is the same as the heat generated in the first output side semiconductor module 1U12, the first input side cooling section 4U11 is the same as the first output side cooling section 4U12. It is desirable to have dimensions of
  • the heat generated in the first input side semiconductor module 1U11 and the first output side semiconductor module 1U12 is diffused through the base portion 41 and the plurality of fin portions 42 .
  • a cooling fan 7 is arranged on one side of the first cooling plate 4U.
  • the multiple fin portions 42 are cooled by the cooling fan 7 .
  • Heat is transported from one side of the first cooling plate 4U to the other side by the cooling fan 7 .
  • the cooling fan 7 is configured to cool the first cooling plate 4U along the second direction DR2.
  • An intake-side wind tunnel 81 and an exhaust-side wind tunnel 82 may be arranged on one side and the other side of the first cooling plate 4U, respectively.
  • the cooling fan 7 may include a first fan section and a second fan section.
  • the first fan section may be arranged on one side and the second fan section may be arranged on the other side.
  • the second cooling plate 4V is connected to the second phase unit group 1V.
  • the third cooling plate 4W is connected to the third phase unit group 1W.
  • Power converter 100 may include a first cooling fan, a second cooling fan, and a third cooling fan.
  • the first cooling fan, the second cooling fan, and the third cooling fan are configured to cool the first cooling plate 4U, the second cooling plate 4V, and the third cooling plate 4W, respectively.
  • each of input side inter-phase bus bar 521 and output side inter-phase bus bar 522 is arranged on one side of first input side inter-phase bus bar 511 and first output side inter-phase bus bar 513, respectively.
  • control panel 200 for elevator to which power converter 100 is applied As shown in FIGS. 4 and 5, the power converter 100 of this embodiment is applied to, for example, a control panel 200 for an elevator.
  • the elevator includes a car, a control panel 200 for the elevator, and a hoist (motor).
  • a control panel 200 for an elevator includes a power converter 100 , a housing 201 and a door 202 .
  • the power conversion device 100 is housed inside a housing 201 .
  • the door 202 is configured to open and close with respect to the housing 201 .
  • the car is configured to move within the hoistway.
  • a machine room is arranged above the hoistway.
  • a control panel 200 for an elevator is located in the hoistway or machine room.
  • the elevator control panel 200 is configured to receive three-phase AC power from a main power supply (commercial power supply) or the like supplied to the building where the elevator is installed.
  • the elevator control panel 200 is configured to convert the received three-phase AC power by the power converter 100 . This forms a power waveform for driving the elevator hoist (motor).
  • the control panel 200 for the elevator is configured to return regenerative power generated in the hoisting machine to mains power.
  • FIG. 6 is a circuit diagram showing the circuit configuration of the main circuit portion of the power converter 100 used in the elevator control panel.
  • the components of the first phase first power inverter circuit unit 1U1 are surrounded by dashed lines.
  • Components of the first-phase second power inverter circuit unit 1U2 are surrounded by a dashed line.
  • Components of the first-phase third power inverter circuit unit 1U3 are surrounded by a chain double-dashed line.
  • the first phase unit group 1U includes a main circuit having a pair of inverter circuit and converter circuit.
  • the main power supply PW is configured to supply three-phase AC power to the hoist M of the elevator control panel.
  • Three-phase AC power is supplied to the power conversion device 100 via an input reactor R1.
  • the power converter 100 is internally configured to convert the waveform of three-phase AC power by a first phase unit group 1U, a second phase unit group 1V, and a third phase unit group 1W.
  • the first-phase first power conversion circuit unit 1U1 and the first-phase second power conversion circuit unit 1U2 function as a converter circuit and an inverter circuit, respectively. Function. That is, when the hoisting machine M is operated by the three-phase AC power of the main power supply PW, the power conversion circuit unit on the input side and the power conversion circuit unit on the output side function as a converter circuit and an inverter circuit.
  • the power conversion device 100 supplies the three-phase AC power converted in each power conversion circuit unit to the hoisting machine via the output reactor R2.
  • the power conversion device 100 When the regenerative power generated from the hoist M is returned to the main power supply PW, the power conversion device 100 operates in a manner opposite to that described above. That is, when regenerative power generated from the hoist M is returned to the main power supply PW, the first-phase first power conversion circuit unit 1U1 and the first-phase second power conversion circuit unit 1U2 are connected to the inverter circuit and the converter circuit, respectively. function as That is, when the regenerated power generated from the hoist is returned to the main power supply, the power conversion circuit unit on the input side and the power conversion circuit unit on the output side function as an inverter circuit and a converter circuit. The power conversion device 100 returns the regenerated power generated from the hoist M to the main power supply PW via the input reactor R1.
  • the first phase first capacitor 1U13, the first phase second capacitor 1U23, and the first phase third capacitor 1U33 are configured as smoothing capacitors. That is, the first phase first capacitor 1U13, the first phase second capacitor 1U23, and the first phase third capacitor 1U33 are configured to smooth the three-phase AC power that has passed through the converter circuit.
  • Input-side electrodes of the capacitors of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W are electrically connected to each other.
  • Output-side electrodes of the capacitors of the first phase unit group 1U, the second phase unit group 1V, and the third phase unit group 1W are electrically connected to each other. Thereby, each capacitor is kept at the same potential.
  • the number of parallel power converters 100 may be determined as appropriate.
  • the power conversion device 100 With 2 parallels or 4 or more parallels is realized. Thereby, the capacity of the power conversion device 100 can be appropriately determined.
  • the power conversion device 100 is applied to an elevator control panel, but the power conversion device 100 can also be applied to other uses such as a general-purpose inverter or an air conditioner inverter.
  • first phase first connection portion 2U1 and the first phase second connection portion 2U2 of the first bus bar 2U are connected to the first phase unit. It is arranged in the same plane on the side opposite to the first cooling plate 4U with respect to the group 1U. Therefore, first bus bar 2U can be made shorter than when first bus bar 2U is arranged to sandwich first cooling plate 4U.
  • the distance of the first bus bar 2U from the first phase first power conversion circuit unit 1U1 to the load (hoisting machine) and the distance from the first phase second power conversion circuit unit 1U2 to the load The difference from the distance of the first bus bar 2U to . That is, the distance from the first input side terminal 2U0 to the first phase first connection portion 2U1, the distance from the first input side terminal 2U0 to the first phase second connection portion 2U2, and the distance from the first phase third connection portion 2U3
  • the difference in length can be reduced.
  • the resistance value and inductance value of the first bus bar 2U of the present embodiment are, for example, a fraction of the resistance value and inductance value of the components of the first phase unit group 1U. Therefore, the resistance value and the inductance value of the first bus bar 2U have little effect on the shunting performance, so that uniform shunting performance can be obtained in actual use.
  • the heat generation of the semiconductor elements of each semiconductor module can be made uniform.
  • the first phase first connection portion 2U1 and the first phase second connection portion 2U2 of the first bus bar 2U are located on the side opposite to the first cooling plate 4U with respect to the first phase unit group 1U. are arranged in the same plane at Therefore, the shape of the first bus bar 2U can be made simpler than when the first bus bar 2U extends on both sides of the first cooling plate 4U, and the size and weight of the first bus bar 2U can be reduced. be able to. Thereby, the manufacturability of the first bus bar 2U can be improved. Therefore, the manufacturing cost of the first bus bar 2U can be reduced. Therefore, the manufacturing cost of the power conversion device 100 can be reduced.
  • first phase first connection portion 2U1 and the first phase second connection portion 2U2 of the first bus bar 2U are located on the side opposite to the first cooling plate 4U with respect to the first phase unit group 1U. are arranged in the same plane at Therefore, the dimension of first bus bar 2U in the depth direction (third direction DR3) can be made smaller than when first bus bar 2U extends on both sides of first cooling plate 4U. Therefore, the power conversion device 100 can be easily applied to an elevator control panel.
  • a first phase first power inverter circuit unit 1U1, a first phase second power inverter circuit unit 1U2, a second phase first power inverter circuit unit 1V1, and a second phase second power inverter circuit unit 1V2 are arranged in this order along the first direction DR1. Therefore, the first bus bar 2U does not need to straddle the second-phase first power conversion circuit unit 1V1. Therefore, the first bus bar 2U can be shortened.
  • a power converter 101 according to the first comparative example includes a fourth unit group 1A, a fifth unit group 1B, and a sixth unit group 1C.
  • the power conversion device 101 according to the first comparative example at least the second phase first power conversion circuit unit and the first phase second power conversion circuit unit of the fourth unit group 1A are provided A power conversion circuit unit is arranged.
  • the first bus bar is configured to connect the first phase first power conversion circuit unit and the first phase second power conversion circuit unit to the second phase first power conversion circuit unit. It is necessary to straddle the power conversion circuit unit. Therefore, in the power conversion device 101 according to the first comparative example, the first busbar is long. Therefore, in the power conversion device 101 according to the first comparative example, the resistance and inductance components that become the impedance of the first bus bar are large.
  • the first phase first power conversion circuit unit 1U1, the first phase second power conversion circuit unit 1U2, the second phase The first power inverter circuit unit 1V1 and the second phase second power inverter circuit unit 1V2 are arranged in this order along the first direction DR1. no need to cross. Therefore, the first bus bar 2U can be shortened.
  • the inductance value from the first input side terminal 2U0 to the first phase first connection portion 2U1, the first phase second connection portion 2U2, and the first phase third connection portion 2U3 can be reduced to can be made smaller. Therefore, even if the distances from the first input side terminal 2U0 to the first phase first connection portion 2U1, the first phase second connection portion 2U2, and the first phase third connection portion 2U3 are different and the impedances are different, Impedance differences can be made relatively small.
  • the first phase first power inverter circuit unit 1U1 As a result, for example, between the first phase first power inverter circuit unit 1U1, the first phase second power inverter circuit unit 1U2, and the first phase third power inverter circuit unit 1U3 used as the elevator control panel 200
  • the reference value of the current bias (current difference) is set to 15%, it is possible to suppress the current bias from exceeding the reference value.
  • the highest resistance value of the first bus bar 2U is set to 1/10 or less of the resistance values of the other components, and the highest inductance value of the first bus bar 2U is set to 1/3 of the inductance values of the other components. By setting the values below, the current bias can be suppressed to 15% or less.
  • the first input side terminal 2U0 can be easily connected to the first input terminal 2U0 by forming the first bus bar 2U in a line-symmetrical shape.
  • the distance to the side semiconductor module 1U11 and the distance from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21 can be made equal.
  • the impedance from the first input side terminal 2U0 to the first input side semiconductor module 1U11 can be made equal to the impedance from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21. As a result, current imbalance is suppressed.
  • the first input side terminal 2U0 to the first input side semiconductor The distance to the module 1U11, the distance from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21, and the distance from the first input side terminal 2U0 to the first phase third input side semiconductor module 1U31 are all equal. It is difficult to Specifically, the distance from the first input side terminal 2U0 to the first phase second input side semiconductor module 1U21 is equal to the distance from the first input side terminal 2U0 to the first input side semiconductor module 1U11 and the distance from the first input side terminal 2U0 to the first input side semiconductor module 1U11.
  • the inductance value has a correlation with the path length through which the current flows. Therefore, although the inductance values of the first phase first connecting portion 2U1 and the first phase third connecting portion 2U3 are larger than the inductance values of the first phase second connecting portion 2U2, the length difference is compensated for as described above. Thus, the difference in inductance values can be made relatively small.
  • the first bus bar has a three-dimensional and symmetrical shape. Thereby, the difference in the length of the first bus bar from the terminal to each semiconductor module can be reduced.
  • the cross-sectional area of only a portion of the first bus bar can be reduced.
  • the central cross-sectional area of the first bus bar can be smaller than the cross-sectional area at both ends of the first bus bar. This may cause the temperature of the first bus bar to rise unevenly.
  • the first bus bar since the first bus bar has a three-dimensional shape, the first bus bar can protrude into the air passage of the cooling fan. This may reduce the cooling efficiency of the first bus bar.
  • the first phase first connection portion 2U1 and the first phase second connection portion 2U2 of the first bus bar 2U are connected to the first It is arranged in the same plane on the side opposite to the first cooling plate 4U with respect to the one-phase unit group 1U. Therefore, the shape of the first bus bar 2U can be planar. Therefore, even when the number of power converters 100 in parallel is an odd number, it is possible to prevent the cross-sectional area of a part of the first bus bar 2U from being reduced. Moreover, it is possible to prevent the first bus bar 2U from protruding into the air passage of the cooling fan 7 . Thereby, the first bus bar 2U can be efficiently cooled. Therefore, the first cooling plate 4U and the cooling fan 7 can be made smaller.
  • the first input side semiconductor module 1U11, the first phase first capacitor 1U13 and the first output side semiconductor module 1U12 are arranged in a straight line along the first cooling plate 4U. Therefore, the dimension of the first phase first power conversion circuit unit 1U1 in the depth direction (the third direction DR3 in which the first phase unit group 1U is connected to the first cooling plate 4U) can be reduced.
  • the first phase first capacitor 1U13 is mounted on a substrate (first phase first substrate 1U14). Therefore, the first phase first power inverter circuit unit 1U1 can be made smaller than when the first phase first capacitor 1U13 is not mounted on the substrate.
  • the shortest distance from the first phase first power inverter circuit unit 1U1 to the first connection point 520 is the shortest distance from the first phase second power inverter circuit unit 1U2 to the first connection point 520. is equal to Therefore, the inductance from the first phase first power conversion circuit unit 1U1 to the first connection point 520 can be made equal to the inductance from the first phase second power conversion circuit unit 1U2 to the first connection point 520. Also, the resistance value from the first phase first power inverter circuit unit 1U1 to the first connection point 520 can be made equal to the resistance value from the first phase second power inverter circuit unit 1U2 to the first connection point 520. Therefore, the input/output current flowing through the first phase first power conversion circuit unit 1U1 can be made equal to the current flowing through the first phase second power conversion circuit unit 1U2. Therefore, the input/output current can be made uniform.
  • each of the plurality of bolts 6 is arranged on the opposite side of the conductor portion 5 from the first cooling plate 4U. Therefore, the bolt 6 can be fastened to each of the plurality of nuts from one direction (the side opposite to the first cooling plate 4U with respect to the conductor portion 5). Therefore, the bolts 6 can be fastened to the nuts more easily than when the bolts 6 are fastened to each of the plurality of nuts from both sides of the first cooling plate 4U. Further, as shown in FIG. 5, when the power conversion device 100 is applied to an elevator control panel 200, the bolt 6 can be tightened or removed from the front side where the door 202 is opened. Assembly work and maintenance work of the conversion device 100 can be easily carried out.
  • the first input-side cooling section 4U11 has dimensions different from those of the first output-side cooling section 4U12. For this reason, the dimensions of the first input-side cooling unit 4U11 and the first output-side cooling unit 4U12 are set to the dimensions suitable for the respective heat generation amounts of the first input-side semiconductor module 1U11 and the first-phase second connection unit 2U2. can do. Therefore, it is possible to suppress the first input side cooling section 4U11 and the first output side cooling section from becoming large. Thereby, the manufacturing cost of the first input side cooling section 4U11 and the first output side cooling section can be reduced.
  • the first cooling plate 4U may be integrated if the power converter 100 does not increase in size.
  • the cooling fan 7 is configured to cool the first cooling plate 4U along the second direction DR2. Therefore, the first input-side semiconductor module 1U11 and the first output-side semiconductor module 1U12 connected to the first cooling plate 4U are collectively cooled by blowing air along the second direction DR2 with the cooling fan 7. be able to. Therefore, the cooling efficiency of the power conversion device 100 can be improved.
  • the lower opening is the intake port
  • the upper opening is the exhaust port.
  • the cooling fan 7 causes cooling air to flow upward from below. Since there is no intake/exhaust port on the rear surface of the control panel 200, the rear surface of the control panel 200 can be brought close to the wall WA.
  • the anchor bolts AB for fixing the control panel 200 to the floor FL are arranged at the four corners of the bottom surface of the control panel 200 as in the general arrangement shown in FIG. A space TS of several tens of centimeters is required around the anchor bolt AB. Therefore, the control panel 200 cannot be brought close to the wall WL. Therefore, as shown in FIG. 12, in the present embodiment, the control panel 200 can be arranged closer to the wall WA by arranging the anchor bolts AB on the wall WA side closer to the front surface FS of the control panel 200. becomes.
  • Embodiment 2 Next, the configuration of the power conversion device 100 according to Embodiment 2 will be described with reference to FIG.
  • the second embodiment has the same configuration and effects as those of the first embodiment unless otherwise specified. Therefore, the same reference numerals are given to the same configurations as in the above-described first embodiment, and description thereof will not be repeated.
  • the first bus bar 2U of the power converter 100 includes a first bent portion 2U9.
  • the first bent portion 2U9 is bent toward the side opposite to the first cooling plate 4U with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2.
  • the first bent portion 2U9 is bent toward the side opposite to the first cooling portion with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2, for example, at a right angle.
  • the angle at which the first bent portion 2U9 is bent may be determined appropriately.
  • the first input terminal is provided at the first bent portion 2U9.
  • a crimp nut may be provided on the first input terminal.
  • the fourth bus bar 3U of the power converter 100 includes a fourth bent portion 3U9.
  • the fourth bent portion 3U9 is bent toward the side opposite to the first cooling plate 4U with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2.
  • the fourth bent portion 3U9 is bent at a right angle, for example, toward the side opposite to the first cooling portion with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2.
  • the angle at which the fourth bent portion 3U9 is bent may be determined appropriately.
  • the output terminal is provided at the fourth bent portion 3U9.
  • the first bent portion 2U9 is provided with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2. It is bent toward the side opposite to the first cooling plate 4U. Therefore, the dimension of first bus bar 2U in second direction DR2 can be made smaller than when first bus bar 2U is not bent. Therefore, the dimension of the power conversion device 100 in the second direction DR2 can be reduced.
  • the shape of the first bus bar 2U differs depending on the parallel number of the first phase unit group 1U. If the first bus bar 2U were not bent, the dimensions of the first bus bar 2U would increase as the number of parallel first phase unit groups 1U increases.
  • a first bus bar 2U connected to three parallel first phase unit groups 1U includes a first phase first connection portion 2U1, a first phase second connection portion 2U2 and a first phase third connection portion 2U3.
  • the first bus bar 2U connected to the two parallel first phase unit groups 1U does not include the first phase third connection portion 2U3. Therefore, the first bus bar 2U connected to the three parallel first phase unit groups 1U has a more complicated shape than the first bus bar 2U connected to the two parallel first phase unit groups 1U.
  • the dimension in the second direction DR2 of the first bus bar 2U connected to the three parallel first phase unit groups 1U is equal to the second direction DR2 of the first bus bar 2U connected to the two parallel first phase unit groups 1U.
  • the dimension in the second direction DR2 of the first busbars 2U connected to the three parallel first phase unit groups 1U is the second direction DR2 of the first busbars 2U connected to the two parallel first phase unit groups 1U. is twice the size of
  • the housing 201 see FIG. 5 of the elevator control panel 200 to which the power conversion device 100 is applied (see FIG. 5 See) and the mounting structure, etc. must be individually designed according to the number of parallels. Therefore, the manufacturing cost of the power converter 100 increases.
  • the first bent portion 2U9 includes the first phase first connection portion 2U1 and the first phase second connection portion 2U1. It is bent toward the side opposite to the first cooling plate 4U with respect to the portion 2U2. Therefore, even when there are three parallel first phase unit groups 1U, the dimension of the first bus bar 2U in the second direction DR2 can be the same as that of the two parallel first phase unit groups 1U. Therefore, it is possible to suppress an increase in the dimension of the first bus bar 2U in the second direction DR2.
  • the dimension of the first bus bar 2U in the second direction DR2 can be made the same as the dimension in the second direction DR2 of the two parallel first phase unit groups 1U. . Therefore, it is not necessary to individually design the housing 201 (see FIG. 5) of the elevator control panel 200 (see FIG. 5) to which the power conversion device 100 is applied, the mounting structure, etc. according to the parallel number. Therefore, the housing 201 (see FIG. 5) of the elevator control panel 200 (see FIG. 5) to which the power conversion device 100 is applied, the mounting structure, etc. can be shared for each parallel number. As a result, the housing 201 (see FIG. 5) of the elevator control panel 200 (see FIG.
  • the mounting structure, and the like can be standardized. Therefore, the manufacturing cost and development period of the elevator control panel 200 (see FIG. 5) can be reduced. Also, the fixed parts used to implement the control scheme for the elevator (see FIG. 5) can be common for each parallel number. Therefore, the fixing parts can be standardized.
  • the first bent portion 2U9 is bent toward the side opposite to the first cooling plate 4U with respect to the first phase first connection portion 2U1 and the first phase second connection portion 2U2. ing. Therefore, the position of the first bus bar 2U can be easily made the same as the eye level of the operator. Therefore, it is possible to improve the efficiency of work performed by the operator during assembly and maintenance of the power conversion device 100 .
  • Embodiment 3 Next, the configuration of the power conversion device 100 according to Embodiment 3 will be described with reference to FIG. 9 .
  • Embodiment 3 has the same configuration and effects as those of Embodiment 1 described above unless otherwise specified. Therefore, the same reference numerals are given to the same configurations as in the above-described first embodiment, and description thereof will not be repeated.
  • the conductor section 5 of the power conversion device 100 is configured by a printed circuit board 5P.
  • the printed circuit board 5 ⁇ /b>P includes conductor patterns 58 and insulating patterns 59 .
  • the conductor pattern 58 is, for example, a copper foil pattern.
  • the insulating pattern 59 is, for example, an insulator such as a glass cloth-based epoxy resin.
  • the conductor patterns 58 are insulated by an insulator. The distance between the conductor patterns 58 is set according to the working voltage of the circuit used.
  • a plurality of through holes are provided in the printed circuit board 5P.
  • the plurality of through-holes includes female threads and through-holes or via-holes.
  • the female threaded portion is a hole for fastening a bolt.
  • Through holes or via holes connect each layer of the printed circuit board 5P.
  • the conductor portions 5 are insulated by not contacting each other except for the portions connected by bolts 6 and nuts.
  • the conductor portion 5 is insulated by insulating the conductor pattern 58 with the insulating pattern 59 .
  • FIG. 9 shows only the surface layer of the printed circuit board 5P.
  • the printed board 5P may be a multilayer board. In this case, by increasing the number of conductor patterns 58, it is possible to suppress the temperature rise of the printed circuit board 5P during energization.
  • the printed board 5P is composed of one board in FIG. 9, the printed board 5P may be composed of a plurality of boards.
  • printed circuit board 5P may be configured with a plurality of boards.
  • a plurality of substrates are connected to each phase unit group.
  • a plurality of boards are connected by bus bars.
  • the conductor part 5 may be configured by a plurality of printed circuit boards 5P by using two two-layered printed circuit boards 5P.
  • the conductor portion 5 is configured by the printed circuit board 5P. If the conductor portion 5 includes a plurality of parts (for example, the interphase busbar 52 and the intraphase busbar 51) as shown in FIG. 1, each part is bolted one by one to each phase unit group. It is necessary to assemble the power converter 100 by connecting. In contrast, according to the present embodiment, the power conversion device 100 can be assembled only by connecting the printed circuit board 5P to the unit groups of the respective phases. Therefore, the number of man-hours for assembling the power conversion device 100 can be reduced.
  • the conductor portion 5 includes a plurality of parts (for example, the interphase busbar 52 and the intraphase busbar 51) as shown in FIG. 1, each part is bolted one by one to each phase unit group. It is necessary to assemble the power converter 100 by connecting.
  • the power conversion device 100 can be assembled only by connecting the printed circuit board 5P to the unit groups of the respective phases. Therefore, the number of man-hours for assembling the power conversion device 100 can be reduced.
  • the conductor portion 5 is configured by a printed circuit board 5P. Therefore, the dimension of the conductor portion 5 in the depth direction (third direction DR3) is the thickness of the printed circuit board 5P. Therefore, as shown in FIG. 1, the depth direction of the conductor portion 5 (the third direction DR3) is greater than in the case where the conductor portion 5 is configured by a plurality of parts (for example, the interphase busbar 52 and the intraphase busbar 51). can be reduced in size.
  • Embodiment 4 Next, the configuration of the power conversion device 100 according to Embodiment 4 will be described with reference to FIG. 13 .
  • the fourth embodiment has the same configuration and effects as those of the first embodiment unless otherwise specified. Therefore, the same reference numerals are given to the same configurations as in the above-described first embodiment, and description thereof will not be repeated.
  • Embodiment 1 one board is arranged for each power conversion circuit unit, but as shown in FIG. 13, in this embodiment, one board is arranged for each phase.
  • a power converter 100 according to the first embodiment shown in FIG. 1 is configured with three-phase, three-parallel power converter circuit units, and the number of power converter circuit units is nine.
  • FIG. 1 there are nine substrates on which capacitors are mounted, but in this embodiment, one capacitor is mounted for each phase, so a total of three substrates are used. Since the number of capacitors remains the same, the size of the board increases.
  • the first phase first capacitor 1U13 and the first phase second capacitor 1U23 are mounted on the same substrate.
  • the role of the intra-phase bus bar 51 that connects the substrates can be played by the conductor pattern in the substrate, and the number of parts used can be reduced. .
  • the conductor patterns in the board are arranged with the positive side potential and negative side potential patterns of the capacitor facing each other.
  • these patterns having the same potential inside the substrate are connected inside the substrate.
  • the conductor pattern of the substrate is made of thin copper foil, but by using a single substrate on which capacitors of the same phase are mounted, it becomes possible to connect the conductor pattern over a wide area between the substrates, which was conventionally separated. , the same conductive performance as in-phase busbars made of copper or aluminum can be secured.
  • the in-phase bus bar 51 can be reduced, the weight of the power conversion device 100 can be reduced.
  • the intra-phase bus bar 51 In order to connect with the inter-phase bus bar 52, the intra-phase bus bar 51 whose shape is changed from that of the first embodiment is used.
  • the intra-phase bus bar 51 includes an input-side intra-phase bus bar 51a and an output-side intra-phase bus bar 51b.
  • the intra-phase bus bar 51 In order to equalize the currents flowing through the capacitors, the intra-phase bus bar 51 is basically connected to terminals provided between the power conversion circuit units. In the case of the three-phase, three-parallel power converter 100 shown in FIG. 13, two terminals are provided on the substrate. In the case of the three-phase two-parallel power converter 100 , there is only one terminal, the intra-phase bus bar 51 is unnecessary, and the inter-phase bus bar 52 can be directly connected.
  • this terminal has a screw thread so that the in-phase bus bar 51 can be fixed with a bolt, workability will be improved. Fastening with a nut or the like is also possible. Also, a spacer using a highly conductive material may be arranged between the substrate and the in-phase bus bar 51 . Materials such as copper or aluminum alloy with high conductivity are used for the terminal material. An example of using a terminal is described, but a method of energizing by directly contacting the pattern of the substrate is also possible.
  • 1U first phase unit group 1U1 first phase first power conversion circuit unit, 1U2 first phase second power conversion circuit unit, 1U11 first input side semiconductor module, 1U12 first output side semiconductor module, 1U13 first phase second 1 capacitor, 1V second phase unit group, 1V1 second phase first power conversion circuit unit, 1V2 second phase second power conversion circuit unit, 2U first bus bar, 2U1 first phase first connection, 2U2 first phase Second connection part, 2U9 First bent part, 2V Second bus bar, 2V1 Second phase first connection part, 2V2 Second phase second connection part, 4U First cooling plate, 4U11 First input side cooling part, 4U12 First input side cooling part, 5 conductor part, 5P printed circuit board, 51 intra-phase bus bar, 52 inter-phase bus bar, 6 volt, 7 cooling fan, 100 power conversion device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
PCT/JP2022/033892 2021-09-22 2022-09-09 電力変換装置 Ceased WO2023047986A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202280062015.3A CN117957759A (zh) 2021-09-22 2022-09-09 电力转换装置
JP2023549475A JP7570528B2 (ja) 2021-09-22 2022-09-09 電力変換装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-154426 2021-09-22
JP2021154426 2021-09-22

Publications (1)

Publication Number Publication Date
WO2023047986A1 true WO2023047986A1 (ja) 2023-03-30

Family

ID=85720619

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/033892 Ceased WO2023047986A1 (ja) 2021-09-22 2022-09-09 電力変換装置

Country Status (3)

Country Link
JP (1) JP7570528B2 (https=)
CN (1) CN117957759A (https=)
WO (1) WO2023047986A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209816A1 (ja) * 2023-04-05 2024-10-10 三菱電機株式会社 電力変換装置及びエレベータ制御盤

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5557891B2 (ja) * 2012-11-30 2014-07-23 株式会社日立製作所 三相電力変換装置
JP2014192936A (ja) * 2013-03-26 2014-10-06 Sumitomo Heavy Ind Ltd 電源ブスバー及びそれを用いる電力変換装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5557891B2 (ja) * 2012-11-30 2014-07-23 株式会社日立製作所 三相電力変換装置
JP2014192936A (ja) * 2013-03-26 2014-10-06 Sumitomo Heavy Ind Ltd 電源ブスバー及びそれを用いる電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209816A1 (ja) * 2023-04-05 2024-10-10 三菱電機株式会社 電力変換装置及びエレベータ制御盤

Also Published As

Publication number Publication date
CN117957759A (zh) 2024-04-30
JP7570528B2 (ja) 2024-10-21
JPWO2023047986A1 (https=) 2023-03-30

Similar Documents

Publication Publication Date Title
JP3724345B2 (ja) 配線の接続部構造
US11246244B2 (en) Power electronics assembly
US6987670B2 (en) Dual power module power system architecture
CN106043325B (zh) 逆变器驱动系统、汇流条及组件
US20110122669A1 (en) Modularly Constructed Power Converter Arrangement
US4975825A (en) Stacked power converter
KR20110104879A (ko) 전력 변환 장치
WO2010047366A1 (ja) 電力変換装置及び車載用電機システム
WO2018198290A1 (ja) 電力変換ユニット
JP6431838B2 (ja) 誘導加熱用電源装置
JP2005085840A (ja) 電力用半導体装置
HUT68302A (en) Inverter, especially a 3-point inverter
CN109412431A (zh) 叠层铜排及三相大功率逆变器
WO2023047986A1 (ja) 電力変換装置
JP2001352767A (ja) 電力変換器用パワーユニット
US12185504B2 (en) Electrical circuit device, electrical drive device and motor vehicle
CN209472561U (zh) 叠层铜排及三相大功率逆变器
CN117424425A (zh) 逆变器组件
JP7771523B2 (ja) 電力変換装置
CN111865099A (zh) 电力转换装置
JP7086308B2 (ja) Ｄｃ／ｄｃコンバータ装置
JP7728980B2 (ja) 電力変換装置
JP5869207B2 (ja) 回路部品実装構造ならびにその実装基板
CN222262517U (zh) 一种电机控制器
WO2024209816A1 (ja) 電力変換装置及びエレベータ制御盤

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22872740

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023549475

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 202280062015.3

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22872740

Country of ref document: EP

Kind code of ref document: A1