WO2023036094A1 - 一种扬声器 - Google Patents
一种扬声器 Download PDFInfo
- Publication number
- WO2023036094A1 WO2023036094A1 PCT/CN2022/117134 CN2022117134W WO2023036094A1 WO 2023036094 A1 WO2023036094 A1 WO 2023036094A1 CN 2022117134 W CN2022117134 W CN 2022117134W WO 2023036094 A1 WO2023036094 A1 WO 2023036094A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- diaphragm
- bracket
- fixed
- rear adjustment
- Prior art date
Links
- 238000013016 damping Methods 0.000 claims description 25
- 238000010586 diagram Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
Definitions
- the invention relates to an electroacoustic device, in particular to a loudspeaker.
- the quality of the structure of the speaker determines its sound quality.
- the utility model patent No.: CN202021319275.9 discloses a speaker and a sound box.
- the speaker includes a vibration system and a magnetic circuit system.
- the vibration system includes a diaphragm.
- the magnetic circuit includes a magnet, and the loudspeaker also includes a diaphragm support arranged on the magnet and between the diaphragm and the magnet; there is a gap between the diaphragm support and the diaphragm; when the diaphragm When pressed, the diaphragm support supports the diaphragm.
- the single diaphragm of this utility model cannot simultaneously simulate the low-frequency direct arrival and reflection delay in the natural sound field, and it is also difficult to obtain a balance between low-frequency strength and low-frequency dive, and the sound quality is poor.
- the technical problem to be solved by the present invention is to provide a loudspeaker with better sound quality.
- a loudspeaker includes a bracket, a vibration system and a magnetic circuit assembly
- the vibration system includes a diaphragm, a passive diaphragm and a voice coil
- the magnetic circuit assembly includes an inner magnetic ring and a magnetic circuit assembly.
- the outer magnetic ring, the periphery of the diaphragm is fixed on the top of the bracket, the voice coil is suspended under the diaphragm, and is located in the magnetic gap between the inner magnetic ring and the outer magnetic ring; the space between the diaphragm and the magnetic circuit assembly is the vibration Cavity; the bracket is a ring structure; the periphery of the passive diaphragm is fixed on the bottom of the bracket, and the space between the passive diaphragm and the magnetic circuit assembly forms a resonant cavity; connected.
- the conduction hole is located at the center of the inner magnetic ring.
- the loudspeaker described above comprises a damping net, an annular rear adjustment board and an annular PCB board, the periphery of the passive diaphragm is fixed on the top surface of the rear adjustment board, and the PCB board is fixed on the bottom surface of the rear adjustment board; the periphery of the rear adjustment board It is fixed on the bottom of the bracket; the middle part of the passive diaphragm includes a through hole, and the damping net is installed on the through hole of the passive diaphragm.
- the loudspeaker described above comprises a damping net, an annular rear adjustment plate and an annular PCB board, the periphery of the passive diaphragm is fixed on the edge of the rear adjustment plate inner hole, and the PCB board is fixed on the bottom surface of the rear adjustment plate; The periphery is fixed on the bottom of the bracket; the middle part of the passive diaphragm includes a through hole, and the damping net is installed on the through hole of the passive diaphragm.
- the loudspeaker described above comprises a damping net, an annular rear adjustment plate and an annular PCB board, the periphery of the passive diaphragm is fixed on the edge of the rear adjustment plate inner hole, and the PCB board is fixed on the bottom surface of the rear adjustment plate; The periphery is fixed on the bottom of the bracket; the rear adjustment board and the PCB board include through holes communicating with each other, and the damping net is installed on the through holes of the rear adjustment board and the PCB board.
- the inner hole of the annular rear adjustment plate is a stepped hole with a large upper part and a smaller lower part.
- the inner hole of the annular bracket is a stepped hole with a large upper part and a smaller lower part.
- the large hole of the stepped hole includes an annular bottom plate.
- the annular bottom plate includes a plurality of damping holes, and the damping holes communicate the vibration cavity with the outside.
- the loudspeaker described above includes a damping net and a C-shaped PCB board.
- the inner hole of the bracket is a stepped hole with a large upper part and a smaller lower part.
- the large hole of the stepped hole includes a circular bottom plate.
- the bottom surface; the annular bottom plate includes a through hole connecting the vibration cavity and the outside, the through hole is arranged at the opening of the C-shaped PCB, and the damping net is installed on the through hole of the annular bottom plate.
- the above-mentioned loudspeaker includes a ventilating cover, the cover is installed above the diaphragm, and the periphery of the cover is fixed on the top of the ring support; the bottom surface of the periphery of the cover is pressed against the edge of the diaphragm.
- the invention adds a passive radiator on the basis of the traditional loudspeaker, so that an acoustic lever structure is formed in the package cavity of the bracket, which greatly reduces the natural frequency f 0 of the small-sized loudspeaker unit, and realizes low-frequency dual-phase output on one loudspeaker, It provides effective support for restoring the natural sound field of terminal products using speakers of this structure.
- Fig. 1 is an exploded view of the speaker of Embodiment 1 of the present invention.
- Fig. 2 is a cross-sectional structure diagram of the speaker of Embodiment 1 of the present invention.
- Fig. 3 is a cross-sectional structure diagram of a speaker according to Embodiment 2 of the present invention.
- Fig. 4 is a cross-sectional structure diagram of a speaker in Embodiment 3 of the present invention.
- Fig. 5 is a cross-sectional structure diagram of a loudspeaker according to Embodiment 4 of the present invention.
- Fig. 6 is a left side view of the speaker of Embodiment 5 of the present invention.
- Fig. 7 is a cross-sectional structure diagram of a speaker according to Embodiment 6 of the present invention.
- FIG. 1 The structure of the loudspeaker with the passive radiator in Example 1 of the present invention is shown in Figure 1 and Figure 2, including a ring-shaped support 1, a breathable cover 4, a ring-shaped rear adjustment plate 8, a ring-shaped PCB board 9, a vibration system and Magnetic circuit assembly 5.
- the vibration system includes a diaphragm 2, a passive diaphragm 2 and a voice coil 3.
- the magnetic circuit assembly 5 is fixed in the middle of the inner hole of the support 1, including an inner magnetic ring and an outer magnetic ring.
- the bottom of the inner magnetic ring and the bottom of the outer magnetic ring pass through a magnetic
- the yoke is connected, and the center of the inner magnetic ring has a vertically arranged via hole.
- the periphery of the diaphragm 2 is fixed on the top of the support 1
- the protective cover 4 is installed above the diaphragm 2
- the periphery of the protective cover 4 is fixed on the top of the annular support 1 .
- the bottom surface of the periphery of the cover 4 presses against the edge of the diaphragm 2 .
- the voice coil 3 is suspended below the diaphragm 2, and the lower part of the voice coil 3 is located in the magnetic gap between the inner magnetic ring and the outer magnetic ring.
- the space between the diaphragm 2 and the magnetic circuit assembly 5 constitutes a vibration cavity.
- the periphery of the passive diaphragm 2 is fixed on the bottom of the bracket 1, and the space between the passive diaphragm 2 and the magnetic circuit assembly 5 forms a resonant cavity.
- the resonance cavity communicates with the vibration cavity through the via hole.
- the periphery of the passive diaphragm 2 is fixed on the top surface of the rear adjustment plate 8 , and the PCB board 9 is fixed on the bottom surface of the rear adjustment plate 8 .
- the periphery of rear adjusting plate 8 is fixed on the bottom of support 1.
- There is a through hole 601 in the middle of the passive diaphragm 2 and the damping net 7 is installed on the through hole 601 of the passive diaphragm 2 .
- the passive diaphragm 2, the rear adjustment plate 8 and the damping net 7 of the first embodiment constitute the passive radiator of the first embodiment.
- Embodiment 2 of the present invention The structure of the loudspeaker with a passive radiator in Embodiment 2 of the present invention is shown in FIG. 3 .
- the difference between Embodiment 2 and Embodiment 1 lies in that the structure of the passive radiator is slightly different.
- the periphery of the passive diaphragm 2 is fixed on the edge of the inner hole of the rear adjustment board 8
- the PCB board 9 is fixed on the bottom surface of the rear adjustment board 8
- the periphery of rear adjusting plate 8 is fixed on the bottom of support 1.
- Embodiment 3 The structure of a loudspeaker with a passive radiator in Embodiment 3 of the present invention is shown in FIG. 4 .
- the difference between Embodiment 3 and Embodiment 1 lies in the slight difference in the structure of the passive radiator.
- the periphery of the passive diaphragm 2 is fixed on the edge of the inner hole of the rear adjustment board 8
- the PCB board 9 is fixed on the bottom surface of the rear adjustment board 8
- the periphery of rear adjusting plate 8 is fixed on the bottom of support 1.
- Embodiment 4 The structure of the loudspeaker with the passive radiator in Embodiment 4 of the present invention is shown in FIG. 5 .
- the difference between Embodiment 4 and Embodiment 1 lies in the slight difference in the structure of the passive radiator.
- the inner hole of the annular rear adjusting plate 8 is a stepped hole with a larger upper part and a smaller lower one, and the periphery of the rear adjusting plate 8 is fixed on the bottom of the bracket 1 .
- the periphery of the passive diaphragm 2 is fixed on the top surface of the large hole in the step hole of the rear adjustment plate 8, and the PCB board 9 is fixed on the bottom surface of the rear adjustment plate 8. Same diameter.
- Embodiment 5 of the present invention The structure of the loudspeaker with a passive radiator in Embodiment 5 of the present invention is shown in FIG. 6 .
- the difference between Embodiment 5 and Embodiment 1 lies in the slightly different structure of the bracket.
- the annular support 1 is a T-shaped structure with a large top and a small bottom.
- the inner hole of the support 1 is a stepped hole with a large top and a small bottom.
- the large hole of the stepped hole includes a ring-shaped bottom plate.
- the damping hole communicates the vibration chamber with the outside.
- Embodiment 6 The structure of the loudspeaker with a passive radiator in Embodiment 6 of the present invention is shown in FIG. 7 .
- the difference between Embodiment 6 and Embodiment 1 mainly lies in the structure of the passive radiator and the structure of the bracket.
- the annular bracket 1 is a T-shaped structure with a large top and a small bottom
- the inner hole of the bracket 1 is a stepped hole with a large top and a small bottom.
- the large hole of the stepped hole includes a circular bottom plate
- the PCB board 9 is C-shaped. There is an opening.
- the C-shaped PCB board 9 is fixed on the bottom surface outside the annular bottom plate of the bracket 1 .
- the annular bottom plate has a through hole connecting the vibration chamber and the outside, the through hole is arranged at the opening of the C-shaped PCB board 9, and the damping net 7 is installed on the through hole of the annular bottom plate.
- Embodiment 6 The periphery of the passive diaphragm 2 is directly fixed on the bottom of the bracket 1 .
- the passive diaphragm 2 is an integral film, with or without a through hole in the middle.
- the speakers in the above embodiments of the present invention add a passive radiator to the traditional speakers, which has better acoustic performance, effectively increases the low-frequency response of the speaker unit, and is beneficial to the performance improvement of end products.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
Abstract
Description
Claims (9)
- 一种扬声器,包括支架、振动系统和磁路组件,所述振动系统包括振膜和音圈,磁路组件包括内磁环及外磁环,振膜的周边固定在支架的顶部,音圈悬挂于振膜的下方,位于内磁环与外磁环之间的磁隙中;振膜与磁路组件之间的空间为振动腔;其特征在于,所述的振动系统包括被动振膜,支架为环形结构;被动振膜的周边固定在支架的底部,被动振膜与磁路组件之间的空间构成共振腔;磁路组件包括导通孔,共振腔通过导通孔与振动腔连通。
- 根据权利要求1所述的扬声器,其特征在于,所述的导通孔位于内磁环的中心。
- 根据权利要求1所述的扬声器,其特征在于,包括阻尼网、环形的后调节板和环形的PCB板,被动振膜的周边固定在后调节板的顶面,PCB板固定在后调节板的底面;后调节板的周边固定在支架的底部;被动振膜的中部包括通孔,阻尼网安装在被动振膜的通孔上。
- 根据权利要求1所述的扬声器,其特征在于,包括阻尼网、环形的后调节板和环形的PCB板,被动振膜的周边固定在后调节板内孔的边沿,PCB板固定在后调节板的底面;后调节板的周边固定在支架的底部;被动振膜的中部包括通孔,阻尼网安装在被动振膜的通孔上。
- 根据权利要求1所述的扬声器,其特征在于,包括阻尼网、环形的后调节板和环形的PCB板,被动振膜的周边固定在后调节板内孔的边沿,PCB板固定在后调节板的底面;后调节板的周边固定在支架的底部;后调节板和PCB板包括相互连通的通孔,阻尼网安装在后调节板和PCB板的通孔上。
- 根据权利要求3所述的扬声器,其特征在于,环形后调节板的内孔为上大下小的阶梯孔。
- 根据权利要求3所述的扬声器,其特征在于,环形支架的内孔为上大下小的阶梯孔,阶梯孔的大孔包括环形的底板,环形底板包括复数个阻尼孔,阻尼孔将振动腔与外部连通。
- 根据权利要求1所述的扬声器,其特征在于,包括阻尼网和C形的PCB板,支架的内孔为上大下小的阶梯孔,阶梯孔的大孔包括环形的底板,C形的PCB板固定在支架环形底板的底面;环形底板包括连通振动腔与外部的通孔,通孔布置在C形PCB板的开口部位,阻尼网安装在环形底板的通孔上。
- 根据权利要求1所述的扬声器,其特征在于,包括透气的护盖,护盖安装在振膜的上方,护盖的周边固定在环形支架的顶部;护盖的周边的底面压在振膜的边缘上。
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JP2024515355A JP2024531630A (ja) | 2021-09-08 | 2022-09-05 | ラウドスピーカー |
EP22866557.6A EP4401424A1 (en) | 2021-09-08 | 2022-09-05 | Loudspeaker |
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CN202111049674.7 | 2021-09-08 | ||
CN202111049674 | 2021-09-08 |
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EP (1) | EP4401424A1 (zh) |
JP (1) | JP2024531630A (zh) |
CN (1) | CN114222228A (zh) |
WO (1) | WO2023036094A1 (zh) |
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CN114222228A (zh) * | 2021-09-08 | 2022-03-22 | 深圳市万红苹果电子有限公司 | 一种扬声器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101909234A (zh) * | 2010-08-04 | 2010-12-08 | 宁波音王集团有限公司 | 一种复合磁路扬声器 |
CN205491048U (zh) * | 2016-03-25 | 2016-08-17 | 捷音特科技股份有限公司 | 具有集流管的耳机装置 |
US20180184198A1 (en) * | 2016-12-28 | 2018-06-28 | Mitek Corp., Inc. | Water resistant loudspeaker |
CN207884874U (zh) * | 2017-12-29 | 2018-09-18 | 深圳市冠旭电子股份有限公司 | 防水喇叭 |
CN110300358A (zh) * | 2018-03-22 | 2019-10-01 | 宏碁股份有限公司 | 一种扬声器结构 |
CN114222228A (zh) * | 2021-09-08 | 2022-03-22 | 深圳市万红苹果电子有限公司 | 一种扬声器 |
-
2021
- 2021-12-30 CN CN202111653570.7A patent/CN114222228A/zh active Pending
-
2022
- 2022-09-05 WO PCT/CN2022/117134 patent/WO2023036094A1/zh active Application Filing
- 2022-09-05 JP JP2024515355A patent/JP2024531630A/ja active Pending
- 2022-09-05 EP EP22866557.6A patent/EP4401424A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101909234A (zh) * | 2010-08-04 | 2010-12-08 | 宁波音王集团有限公司 | 一种复合磁路扬声器 |
CN205491048U (zh) * | 2016-03-25 | 2016-08-17 | 捷音特科技股份有限公司 | 具有集流管的耳机装置 |
US20180184198A1 (en) * | 2016-12-28 | 2018-06-28 | Mitek Corp., Inc. | Water resistant loudspeaker |
CN207884874U (zh) * | 2017-12-29 | 2018-09-18 | 深圳市冠旭电子股份有限公司 | 防水喇叭 |
CN110300358A (zh) * | 2018-03-22 | 2019-10-01 | 宏碁股份有限公司 | 一种扬声器结构 |
CN114222228A (zh) * | 2021-09-08 | 2022-03-22 | 深圳市万红苹果电子有限公司 | 一种扬声器 |
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Publication number | Publication date |
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JP2024531630A (ja) | 2024-08-29 |
EP4401424A1 (en) | 2024-07-17 |
CN114222228A (zh) | 2022-03-22 |
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