WO2023035748A1 - Led显示模组的制造方法及led显示模组 - Google Patents

Led显示模组的制造方法及led显示模组 Download PDF

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WO2023035748A1
WO2023035748A1 PCT/CN2022/103700 CN2022103700W WO2023035748A1 WO 2023035748 A1 WO2023035748 A1 WO 2023035748A1 CN 2022103700 W CN2022103700 W CN 2022103700W WO 2023035748 A1 WO2023035748 A1 WO 2023035748A1
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display module
adhesive layer
chip
led chips
transparent
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PCT/CN2022/103700
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English (en)
French (fr)
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孙天鹏
张金刚
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深圳市洲明科技股份有限公司
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Priority claimed from CN202111069930.9A external-priority patent/CN113809114B/zh
Application filed by 深圳市洲明科技股份有限公司 filed Critical 深圳市洲明科技股份有限公司
Publication of WO2023035748A1 publication Critical patent/WO2023035748A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of display technology, in particular to a method for manufacturing an LED display module and the LED display module.
  • the LED flip-chip combined with the SMT manufacturing process is mainly used for chip welding, that is, the solder paste is printed on the active substrate first, and then the LED chip is removed from the blue film by a die-bonding machine.
  • the previous ones are transferred to the active substrate of the printed solder paste, and the chip and the active substrate are directly welded and fixed by reflow soldering or laser welding to form a stable electrical connection.
  • This method has the advantages of fast speed and simple process, but as the size of the LED chip continues to decrease, and the pad of the LED chip is only at the bottom of the chip, the chip is easily pulled by the surface tension of the melted solder paste during the reflow soldering process. In the end, the angle consistency of the finished soldered chip becomes very poor, especially in the upper and lower viewing angles. Therefore, how to solve the problem of chip flatness has become a major issue for the industry to improve the consistency of viewing angles.
  • a method for manufacturing an LED display module and the LED display module are provided.
  • a manufacturing method of an LED display module comprising the following steps: providing a plurality of LED chips and a transparent optical carrier with a transparent adhesive layer, and fixing the plurality of LED chips upside down in an array distribution on the transparent optical carrier On the transparent adhesive layer of the carrier board, a chip component is obtained; provide some of the chip components and a plane carrier with a UV glue layer, and fix the side of the transparent optical carrier of the plurality of the chip components on the On the UV adhesive layer of the flat carrier board, and several of the chip components are distributed in an array to obtain a chip component array; provide an active substrate with printed solder paste, and align the solder joints of the active substrate one by one After all the LED chips of the chip component array are welded, the active substrate is welded and fixed on the chip component array to obtain a prototype of the display module; After peeling, the LED display module is obtained.
  • An LED display module includes an active substrate and a plurality of chip components
  • the chip component includes a transparent optical carrier with a transparent adhesive layer and a plurality of LED chips
  • the plurality of LED chips are distributed in an array Inverted and fixed on the transparent adhesive layer of the transparent optical carrier to form a chip component
  • the solder joint surface of the active substrate is placed on all the LED chips of the plurality of chip components arranged in an array
  • each solder spot on the solder spot surface is welded and fixed to the solder pins of all the LED chips of the plurality of chip components in one-to-one correspondence.
  • FIG. 1 is a block flow diagram of a manufacturing method of an LED display module according to Embodiment 1 of the present application;
  • Fig. 2 is a structural schematic diagram of the chip assembly in the manufacturing method shown in Fig. 1;
  • FIG. 3 is a specific flowchart of step S110 in the manufacturing method shown in FIG. 1;
  • FIG. 4 is a schematic structural view of the prototype of the display module in the manufacturing method shown in FIG. 1;
  • FIG. 5 is a schematic structural diagram of the LED display module in the manufacturing method shown in FIG. 1 .
  • Embodiment 1 of the present application provides a manufacturing method of an LED display module, the manufacturing method includes the following steps:
  • Step S110 providing several LED chips and a transparent optical carrier with a transparent adhesive layer, and fixing the plurality of LED chips in an array distribution on the transparent adhesive layer of the transparent optical carrier upside down to obtain a chip assembly.
  • the transparent adhesive layer 121 is preferably a transparent polyurethane adhesive layer, and the thickness of the transparent adhesive layer 121 is preferably 1-100 microns, which can effectively bond and fix several LED chips 110 without affecting several LED chips. 110 glow effects.
  • the thickness of the transparent optical carrier 120 is also preferably 0.01-2 millimeters, which can protect the light emission of some LED chips 110 while ensuring the chip flatness of the chip assembly 100 and does not affect the light emission of some LED chips 110. Effect.
  • protective glue can also be applied to the gaps between several LED chips 110 , at this time, as shown in Figure 3, the steps of the method step "distribute a number of LED chips in an array and fix them upside down on the transparent adhesive layer of the transparent optical carrier to obtain a chip component" are as follows:
  • Step S111 distributing several LED chips in an array and placing them upside down on the transparent adhesive layer of the transparent optical carrier.
  • Step S112 After coating the protective glue in the gaps between several LED chips, heat and cure the whole, so that several LED chips are fixed upside down on the transparent adhesive layer of the transparent optical carrier, and a protective adhesive layer is formed between several LED chips , and then get the chip assembly.
  • the protective glue is preferably black protective glue.
  • the black protective glue is specifically epoxy resin glue with melanin.
  • the coating height of the protective glue is also high. Higher than the height of the solder leg of the LED chip 110 .
  • Step S120 Provide several chip components and a plane carrier with a UV glue layer, fix the side of the transparent optical carrier of the several chip components on the UV glue layer of the plane carrier, and several chip components are arranged in an array to obtain A chip component array.
  • the interval between two adjacent chip assemblies 100 should meet the requirements of a chip assembly 100 adjacent sides.
  • the distance between the LED chip 110 of the LED chip 110 and the LED chip 110 on the adjacent side of another adjacent chip assembly 100 should be consistent with the interval between two adjacent LED chips 110 in the chip assembly 100, that is, the adjacent LED chip 110 of the chip assembly 100 should be consistent.
  • the distance between the LED chips 110 on one side and the corresponding adjacent side also needs to be less than half of the distance between two adjacent LED chips 110 in the chip assembly 100 .
  • Step S130 Provide an active substrate with printed solder paste, align the solder joints of the active substrate with the solder feet of all the LED chips of the chip component array, and then solder and fix the active substrate on the chip component array, Obtain a prototype of a display module.
  • the active substrate 200 is welded and fixed on the chip component array to obtain a display module prototype 10 .
  • the above-mentioned welding and fixing method can be heat welding or laser welding. Through welding and fixing, all the LED chips 110 on the chip assembly array can be electrically connected to the active substrate 200 and formed correspondingly fixed.
  • Step S140 Carrying out the planar carrier stripping process on the prototype of the display module to obtain the LED display module.
  • the planar carrier 2 is only used to ensure The heights of all LED chips 110 on different optical substrates 120 of different chip components 100 are consistent, which is not required in the actual LED display module display process.
  • the specific process is as follows: irradiate the prototype 10 of the display module with UV light on the side where the flat carrier board 2 is located to remove the UV adhesive layer 21, so that the flat carrier board 2 can be removed from the display module.
  • the module prototype 10 is peeled off to form the LED display module 1 .
  • the manufacturing method of this LED display module uses a multi-layer planar structure and an adhesive structure (including a transparent optical carrier 120 with a transparent adhesive layer 121 and a flat carrier 2 with a UV adhesive layer 21), and all LEDs
  • the flatness of the chip 110 is unified on a benchmark, so that the chip height of the LED display module 1 is flat, so as to effectively solve the problem of chip flatness deterioration caused by the surface tension of the solder paste melting in the existing direct reflow soldering method , and the method is simple to manufacture, is conducive to large-scale manufacturing, and can effectively reduce manufacturing costs.
  • Embodiment 2 of the present application also provides an LED display module 1, which is mainly manufactured by the manufacturing method in Embodiment 1 above.
  • the LED display module 1 includes active The substrate 200 and a number of chip assemblies 100, the chip assembly 100 includes a transparent optical carrier 120 with a transparent adhesive layer 121 and a number of LED chips 110, the LED chips 110 are arranged in an array and fixed upside down on the transparent adhesive layer 121 of the transparent optical carrier 120 A chip component 100 is formed on it, and the solder joint surface of the active substrate 200 is placed on all the LED chips 110 of several chip components 100 arranged in an array, and each solder joint 210 on the solder joint surface is compatible with all the LED chips of the several chip components 100 The solder pins 111 of the chips 110 are soldered and fixed in one-to-one correspondence.
  • the manufacturing method of the LED display module and the LED display module provided by the embodiment of the present application when the LED display module is manufactured, firstly, a plurality of LED chips are arranged upside down in an array and fixed on the transparent adhesive layer of the transparent optical carrier to After obtaining a chip component, then fix the side of the transparent optical carrier of several chip components on the UV adhesive layer of the flat carrier, and distribute the chip components in an array to obtain a chip component array. Then, after aligning the welding points of the active substrate with the solder feet of all the LED chips of the chip component array, the active substrate is welded and fixed on the chip component array to obtain a display module prototype. Finally, the prototype of the display module is peeled off from the flat carrier to obtain the desired LED display module.
  • a plurality of LED chips are fixed upside down on a highly horizontal transparent optical carrier to form a chip assembly, which can ensure the singleness of the chip assembly. All the LED chips on the optical carrier board have the same height, thereby ensuring the chip flatness of the chip component.
  • the side of the transparent optical carrier of several chip components is fixed on a larger flat carrier to form a chip component array, which can ensure that all LED chips on different optical carrier boards of different chip components The height is consistent, thereby ensuring the chip flatness of the final manufactured LED display module.
  • the manufacturing method of this LED display module adopts a multi-layer planar structure and an adhesive structure (including a transparent optical carrier with a transparent adhesive layer and a flat carrier with a UV adhesive layer), so that the flatness of all LED chips is placed uniformly.
  • an adhesive structure including a transparent optical carrier with a transparent adhesive layer and a flat carrier with a UV adhesive layer
  • the method is simple to manufacture, which is beneficial to Large-scale manufacturing can effectively reduce manufacturing costs. It can be seen that this technical solution can effectively solve the technical problem that the existing LED display manufacturing method adopts the reflow soldering method to realize the direct welding and fixing of the chip and the active substrate and cannot ensure the flatness of the chip.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本申请涉及一种LED显示模组的制造方法。该制造方法包括：将若干LED芯片(110)呈阵列分布倒置固定在透明光学载板(120)的透明胶层(121)上，得到芯片组件(S110)；将若干芯片组件的透明光学载板(120)所在一侧固定在平面载板(2)的UV胶层(210)上，且若干芯片组件呈阵列分布，得到芯片组件阵列(S120)；将有源基板(200)的各焊点(210)一一对准芯片组件阵列的所有LED芯片(110)的焊脚(111)后，将有源基板(200)焊接固定在芯片组件阵列上，得到显示模组雏形(10)(S130)；对显示模组雏形(10)进行平面载板(2)剥离处理，得到LED显示模组(S140)。

Description

LED显示模组的制造方法及LED显示模组
相关申请的交叉引用
本申请要求于2021年09月13日提交中国专利局、申请号为2021110699309、发明名称为“一种LED显示模组的制造方法及LED显示模组”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，特别涉及一种LED显示模组的制造方法及LED显示模组。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
目前在Mini-LED显示屏制造上，主要采用LED倒装芯片结合SMT的制造工艺进行芯片的焊接，即采用先在有源基板上进行锡膏印刷，然后利用固晶机将LED芯片从蓝膜上一颗一颗转移到印好的锡膏的有源基板上，通过回流焊接或激光焊接的方式，实现芯片与有源基板的直接焊接固定，形成稳固的电气连接。该方法具有速度快，工艺简单等优势，但是随着LED芯片尺寸的不断减小，加上LED芯片焊盘只在芯片底部，因而，回流焊接过程中芯片容易被融化锡膏的表面张力拉扯，最终导致焊接成品的芯片角度一致性变得非常差，尤其在上下视角更为明显。因此如何解决芯片平整度的问题，成为行业提升视角一致性的重大课题。
发明内容
根据本申请的各种实施例，提供一种LED显示模组的制造方法及LED显示模组。
一种LED显示模组的制造方法，所述制造方法包括以下步骤：提供若干LED芯片与一带有透明胶层的透明光学载板，将所述若干LED芯片呈阵列分布倒置固定在所述透明光学载板的透明胶层上，得到一芯片组件；提供若干所述芯片组件与一带有UV胶层的平面载板，将若干所述芯片组件的所述透明光学载板所在一侧固定在所述平面载板的UV胶层上，且若干所述芯片组件呈阵列分布，得到一芯片组件阵列；提供一印刷好锡膏的有源基板，将所述有源基板的各焊点一一对准所述芯片组件阵列的所有所述LED芯片的焊脚后，将所述有源基板焊接固定在所述芯片组件阵列上，得到一显示模组雏形；对所述显示模组雏形进行平面载板剥离处理，得到LED显示模组。
一种LED显示模组，所述LED显示模组包括有源基板与若干芯片组件，所述芯片组件包括一带有透明胶层的透明光学载板以及若干LED芯片，所述若干LED芯片呈阵列分布倒置固定在所述透明光学载板的透明胶层上形成一所述芯片组件，所述有源基板的焊点面置于呈阵列排布的所述若干芯片组件的所有所述LED芯片上，且所述焊点面的各焊点与所述若干芯片组件的所有所述LED芯片的焊脚一一对应焊接固定。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其他特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更清楚地说明本申请实施例或示例性技术中的技术方案，下面将对实施例或示例性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为本申请实施例一LED显示模组的制造方法的流程框图；
图2为图1所示制造方法中的芯片组件的结构示意图；
图3为图1所示制造方法中的步骤S110的具体流程框图；
图4为图1所示制造方法中的显示模组雏形的结构示意图；
图5为图1所示制造方法中的LED显示模组的结构示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
实施例一
如图1所示，本申请实施例一提供一种LED显示模组的制造方法，该制造方法包括以下步骤：
步骤S110：提供若干LED芯片与一带有透明胶层的透明光学载板，将若干LED芯片呈阵列分布倒置固定在透明光学载板的透明胶层上，得到一芯片组件。
具体地，如图2所示，将若干LED芯片110呈阵列分布倒置固定在透明光学载板120的透明胶层121上，得到一芯片组件100，即芯片组件100的若干LED芯片110的发光面面向透明光学载板120。该透明胶层121优选采用透明聚氨酯类胶层，透明胶层121的厚度优选为1～100微米，其可对若干LED芯片110起到很好的粘接固定作用的同时，不影响若干LED芯片110的发光效果。透明光学载板120的厚度亦优选为0.01～2毫米，可在确保芯片组件100的芯片平整度的同时，对若干LED芯片110的发光起到一定的保护作用及不影响若干LED芯片110的发光效果。为使得若干LED芯片110更牢固地倒置固定在透明光学载板120的透明胶层121上，及对若干LED芯片110的四周形成保护，还可在若干LED芯片110之间的间隙涂覆保护胶水，此时，如图3所示，本方法步骤“将若干LED芯片呈阵列分布倒置固定在透 明光学载板的透明胶层上，得到一芯片组件”的步骤具体如下：
步骤S111：将若干LED芯片呈阵列分布倒置在透明光学载板的透明胶层上。
步骤S112：在若干LED芯片之间的间隙涂覆保护胶水后，整体进行加热固化处理，使得若干LED芯片倒置固定在透明光学载板的透明胶层上，且若干LED芯片之间形成保护胶层，进而得到芯片组件。
如图2所示，在若干LED芯片110之间的间隙涂覆保护胶水后，整体进行加热固化处理，即将若干LED芯片110连同带有透明胶层121的透明光学载板120一起置于预设高温环境中进行加热固化处理，使得若干LED芯片110倒置固定在透明光学载板120的透明胶层121上，且若干LED芯片110之间形成保护胶层130，进而得到芯片组件100，保护胶层130可对相邻的LED芯片110进行固定并形成保护，同时，为提高其对比度，该保护胶水优选采用黑色保护胶水，黑色保护胶水具体为带有黑色素的环氧树脂胶水，环氧树脂胶水中黑色素的重量占比为2％～30％，此时，可在不影响最终形成的LED显示模组的显示效果的同时，确保其具有最好的对比度，因而，保护胶水的涂覆高度亦不可高于LED芯片110的焊脚高度。
步骤S120：提供若干芯片组件与一带有UV胶层的平面载板，将若干芯片组件的透明光学载板所在一侧固定在平面载板的UV胶层上，且若干芯片组件呈阵列分布，得到一芯片组件阵列。
具体地，当通过上述方法步骤批量得到若干芯片组件100后，便可如图2及图4所示，将若干芯片组件100的透明光学载板120所在一侧固定在平面载板2的UV胶层21上，且若干芯片组件100呈阵列分布，来得到一芯片组件阵列。为确保最终形成的LED显示模组的各LED芯片110之间的间隔 保持一致，若干芯片组件100呈阵列分布时，两两相邻的芯片组件100之间的间隔应满足一芯片组件100邻边的LED芯片110与相邻的另一芯片组件100的相邻邻边的LED芯片110之间的间隔应与芯片组件100内两相邻LED芯片110之间的间隔保持一致，即芯片组件100邻边的LED芯片110到相应邻边的距离亦需小于芯片组件100内两相邻LED芯片110之间的间隔的一半。
步骤S130：提供一印刷好锡膏的有源基板，将有源基板的各焊点一一对准芯片组件阵列的所有LED芯片的焊脚后，将有源基板焊接固定在芯片组件阵列上，得到一显示模组雏形。
具体地，当通过上述方法步骤得到一芯片组件阵列后，便可如图2及图4所示，将有源基板200的各焊点210一一对准芯片组件阵列的所有LED芯片110的焊脚111后，将有源基板200焊接固定在芯片组件阵列上，得到一显示模组雏形10。上述焊接固定的方式可以是加温焊接或激光焊接，通过焊接固定，可使得芯片组件阵列上的所有LED芯片110均与有源基板200建立电气连接，并形成相应固定。
步骤S140：对显示模组雏形进行平面载板剥离处理，得到LED显示模组。
具体地，当通过上述方法步骤得到一显示模组雏形10后，由于显示模组雏形10还粘接有平面载板2，而平面载板2只是在LED显示模组制造过程中，用于确保不同芯片组件100的不同光学载板120上的所有LED芯片110的高度一致，实际LED显示模组显示过程中并不需要，因而，需如图4及图5所示，对显示模组雏形10进行平面载板剥离处理，得到LED显示模组1，具体过程如下：在平面载板2所在一侧对显示模组雏形10照射UV光进行UV胶层21的解除，使得平面载板2从显示模组雏形10上剥离下来，形成LED显 示模组1。
这样一来，本LED显示模组的制造方法通过多层平面结构和粘接结构(包括带透明胶层121的透明光学载板120与带UV胶层21的平面载板2)，将所有LED芯片110摆放的平度统一到一个基准上，从而实现LED显示模组1的芯片高度平整，以有效解决现有芯片直接回流焊接方式因为锡膏熔融表面张力拉扯导致的芯片平整度变差问题，且该方法制造简单，有利于大规模制造，可有效降低生产制造成本。
实施例二
如图5所示，本申请实施例二还提供了一种LED显示模组1，该LED显示模组1主要采用上述实施例一中的制造方法制造所得，该LED显示模组1包括有源基板200与若干芯片组件100，芯片组件100包括一带有透明胶层121的透明光学载板120以及若干LED芯片110，若干LED芯片110呈阵列分布倒置固定在透明光学载板120的透明胶层121上形成一芯片组件100，有源基板200的焊点面置于呈阵列排布的若干芯片组件100的所有LED芯片110上，且焊点面的各焊点210与若干芯片组件100的所有LED芯片110的焊脚111一一对应焊接固定。
为提高其对比度及对各LED芯片110形成固定保护，如图5所示，芯片组件100还包括黑色保护胶层130，黑色保护胶层130夹设于在若干LED芯片110之间的间隙内。
本申请实施例提供的LED显示模组的制造方法及LED显示模组，其在LED显示模组制造时，首先将若干LED芯片呈阵列分布倒置固定在透明光学载板的透明胶层上，来得到一芯片组件后，接着，将若干芯片组件的透明光学载板所在一侧固定在平面载板的UV胶层上，且若干芯片组件呈阵列分布， 来得到一芯片组件阵列。然后，再将有源基板的各焊点一一对准芯片组件阵列的所有LED芯片的焊脚后，将有源基板焊接固定在芯片组件阵列上，来得到一显示模组雏形。最后，再对显示模组雏形进行平面载板剥离处理，来得到所要的LED显示模组。因而，本LED显示模组的制造方法在制作LED显示模组时，其一方面将若干LED芯片倒置固定在一个高度水平的透明光学载板上，来形成一芯片组件，可确保芯片组件的单一光学载板上的所有LED芯片的高度一致，进而确保芯片组件的芯片平整度。其另一方面同时将若干芯片组件的透明光学载板所在一侧固定在一个更大的平面载板上，来形成一芯片组件阵列，可确保不同芯片组件的不同光学载板上的所有LED芯片的高度一致，进而确保最终制造所得的LED显示模组的芯片平整度。即本LED显示模组的制造方法通过多层平面结构和粘接结构(包括带透明胶层的透明光学载板与带UV胶层的平面载板)，将所有LED芯片摆放的平度统一到一个基准上，从而实现LED显示模组的芯片高度平整，以有效解决现有芯片直接回流焊接方式因为锡膏熔融表面张力拉扯导致的芯片平整度变差问题，且该方法制造简单，有利于大规模制造，可有效降低生产制造成本。可见，本技术方案，其可有效解决现有LED显示屏制造方法采用回流焊接方式实现芯片与有源基板的直接焊接固定无法确保芯片平整度的技术问题。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干 变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (12)

  1. 一种LED显示模组的制造方法，所述制造方法包括以下步骤：
    提供若干LED芯片与一带有透明胶层的透明光学载板，将所述若干LED芯片呈阵列分布倒置固定在所述透明光学载板的透明胶层上，得到一芯片组件；
    提供若干所述芯片组件与一带有UV胶层的平面载板，将若干所述芯片组件的所述透明光学载板所在一侧固定在所述平面载板的UV胶层上，且若干所述芯片组件呈阵列分布，得到一芯片组件阵列；
    提供一印刷好锡膏的有源基板，将所述有源基板的各焊点一一对准所述芯片组件阵列的所有所述LED芯片的焊脚后，将所述有源基板焊接固定在所述芯片组件阵列上，得到一显示模组雏形；以及
    对所述显示模组雏形进行平面载板剥离处理，得到LED显示模组。
  2. 根据权利要求1所述的制造方法，其中，所述透明胶层为透明聚氨酯类胶层，所述透明胶层的厚度为1～100微米。
  3. 根据权利要求1所述的制造方法，其中，所述透明光学载板的厚度0.01～2毫米。
  4. 根据权利要求1所述的制造方法，其中，所述将所述若干LED芯片呈阵列分布倒置固定在所述透明光学载板的透明胶层上，得到一芯片组件的步骤具体包括：
    将所述若干LED芯片呈阵列分布倒置在所述透明光学载板的透明胶层上；以及
    在所述若干LED芯片之间的间隙涂覆保护胶水后，整体进行加热固化处理，使得所述若干LED芯片倒置固定在所述透明光学载板的透明胶层上，且所述若干LED芯片之间形成保护胶层，进而得到所述芯片组件。
  5. 根据权利要求4所述的制造方法，其中，所述保护胶水为黑色保护胶水，所述黑色保护胶水为带有黑色素的环氧树脂胶水。
  6. 根据权利要求5所述的制造方法，其中，所述环氧树脂胶水中黑色素 的重量占比为2％～30％。
  7. 根据权利要求4所述的制造方法，其中，所述保护胶水的涂覆高度不高于所述LED芯片的焊脚高度。
  8. 根据权利要求1-7任一项所述的制造方法，其中，所述对所述显示模组雏形进行平面载板剥离处理，得到LED显示模组的步骤包括：
    在所述平面载板所在一侧对所述显示模组雏形照射UV光进行UV胶层解除，使得所述平面载板从所述显示模组雏形上剥离下来，形成所述LED显示模组。
  9. 一种LED显示模组，所述LED显示模组包括：
    有源基板；和
    若干芯片组件，所述芯片组件包括：
    一透明光学载板，其上带有透明胶层；以及
    若干LED芯片，呈阵列分布倒置固定在所述透明光学载板的透明胶层上形成一所述芯片组件；
    其中，所述有源基板的焊点面置于呈阵列排布的所述若干芯片组件的所有所述LED芯片上，且所述焊点面的各焊点与所述若干芯片组件的所有所述LED芯片的焊脚一一对应焊接固定。
  10. 根据权利要求9所述的LED显示模组，其中，所述透明胶层为透明聚氨酯类胶层，所述透明胶层的厚度为1～100微米。
  11. 根据权利要求9所述的LED显示模组，其中，所述透明光学载板的厚度0.01～2毫米。
  12. 根据权利要求9所述的LED显示模组，其中，所述芯片组件还包括：
    黑色保护胶层，夹设于在所述若干LED芯片之间的间隙内。
PCT/CN2022/103700 2021-09-13 2022-07-04 Led显示模组的制造方法及led显示模组 WO2023035748A1 (zh)

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