WO2023035434A1

WO2023035434A1 - Method for adjusting transport position of wafer, adjustment apparatus, and semiconductor device

Info

Publication number: WO2023035434A1
Application number: PCT/CN2021/135675
Authority: WO
Inventors: 刘洋
Original assignee: 长鑫存储技术有限公司
Priority date: 2021-09-10
Filing date: 2021-12-06
Publication date: 2023-03-16
Also published as: CN113782470A

Abstract

Disclosed are a method for adjusting a transport position of a wafer, an adjustment apparatus, and a semiconductor device. The adjustment method comprises: obtaining preset orientation information of a wafer; obtaining current orientation information of the wafer; calculating an offset quantity according to a difference of the preset orientation information and the current orientation information, so as to determine adjustment information, and sending the adjustment information to an adjustment apparatus; in response to the adjustment information, acquiring the wafer at a current position, adjusting the wafer by means of the adjustment apparatus, and transporting the wafer to a preset position.

Description

Wafer transfer position adjustment method, adjustment device, and semiconductor equipment

This disclosure is based on the Chinese patent application with the application number 202111061137.4, the application date is September 10, 2021, and the application name is "Adjustment method, adjustment device and semiconductor equipment for wafer transfer position", and the priority of this Chinese patent application is required. Right, the entire content of this Chinese patent application is hereby incorporated into this disclosure as a reference.

technical field

The present disclosure relates to but not limited to a method for adjusting a wafer transfer position, an adjusting device and a semiconductor device.

Background technique

The semiconductor manufacturing process requires the use of various semiconductor equipment. Among them, the manufacturing of wafers includes multiple specific processes, and the manufacturing processes of different processes are in different process environments. Transfer in different process chambers.

Currently, there is a problem with wafer position shifts when robotic arms are used to transfer wafers back to the cassette, or when transferring wafers to wafer stages in each chamber. For wafer position offset, it is usually corrected by importing offset position parameters into the machine. However, the calibration process is cumbersome and error-prone. When the wrong position parameters are manually entered, the wafer will be damaged due to chip collision.

At the same time, during long-term use, the robot arm that transfers wafers will also have a movement position deviation. The movement position deviation of the robot arm itself will also affect the position deviation of the wafer, which reduces the accuracy of the wafer transfer process and leads to a decrease in the wafer yield.

Contents of the invention

The following is an overview of the subject matter described in detail in this disclosure. This summary is not intended to limit the scope of the claims.

The disclosure provides an adjustment method, an adjustment device, and a semiconductor device for a wafer transfer position.

According to a first aspect of an embodiment of the present disclosure, a method for adjusting a wafer transfer position is provided, including:

Obtain preset posture information of the wafer, where the preset posture information includes at least preset position information;

Acquiring current posture information of the wafer, the current posture information at least including current position information of the wafer;

calculating an offset according to the difference between the preset attitude information and the current attitude information to determine adjustment information, and sending the adjustment information to an adjustment device;

In response to the adjustment information, the wafer is obtained at the current position, the wafer is adjusted by the adjustment device, and the wafer is transferred to a preset position.

According to some embodiments of the present disclosure, the preset posture information includes preset angle information and preset distance information;

The offset calculated according to the difference between the preset attitude information and the current attitude information includes:

determining an angular offset of the wafer at the current position relative to the preset position according to the current attitude information and the preset angle information; or,

According to the current attitude information and the preset distance information, determine a distance offset of the wafer at the current position relative to the preset position.

According to some embodiments of the present disclosure, the step of determining adjustment information includes:

determining an angle compensation amount according to the angle offset;

The adjustment information includes the angle compensation amount;

or,

determining a distance compensation amount according to the position offset;

The adjustment information includes the distance compensation amount.

According to some embodiments of the present disclosure, the step of determining the adjustment information and sending the adjustment information to the adjustment device includes:

Sending the adjustment information including the angle compensation amount to the first carrier assembly, the adjustment information is configured to: drive the first carrier assembly to adjust the included angle of the wafer relative to the preset position; or,

Sending the adjustment information including the distance compensation amount to the first carrier assembly, the adjustment information is configured to: drive the first carrier assembly to adjust the distance of the wafer relative to the preset position.

According to some embodiments of the present disclosure, in response to the adjustment information, the wafer is obtained at the current position, the wafer is adjusted by the adjustment device, and the wafer is transferred to the preset location. The step of setting the location also includes:

sending the adjustment information including the angle compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the wafer, and after adjusting the included angle of the wafer relative to the preset position, driving the first carrying assembly to transport the wafer to the second carrying assembly;

or,

sending the adjustment information including the distance compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the After the wafer is adjusted and the distance between the wafer and the preset position is adjusted, the first carrying component is driven to transport the wafer to the second carrying component.

According to the second aspect of the embodiments of the present disclosure, a device for adjusting a wafer transfer position is provided, including:

An acquisition module, configured to acquire preset posture information of the wafer, the preset posture information at least including preset position information;

The acquisition module is also used to acquire the current attitude information of the wafer, the current attitude information at least includes the current position information of the wafer;

A processing module, configured to calculate an offset according to the difference between the preset attitude information and the current attitude information, to determine adjustment information, and send the adjustment information to the adjustment device;

The execution module is used for obtaining the wafer at the current position in response to the adjustment information, adjusting the wafer through the adjustment device, and sending the wafer to the preset position.

The processing module is also used to:

According to some embodiments of the present disclosure, the processing module is also used for:

determining an angle compensation amount according to the angle offset;

The adjustment information includes the angle compensation amount;

or,

determining a distance compensation amount according to the distance offset;

The adjustment information includes the distance compensation amount.

According to some embodiments of the present disclosure, the execution module is further used for:

Sending the adjustment information including the distance compensation amount to the first carrying assembly, the adjustment information being configured to: drive the first carrying assembly to adjust the distance of the wafer relative to the preset position.

or,

A third aspect of the embodiments of the present disclosure provides a semiconductor device, including:

a control device, configured to determine adjustment information and send the adjustment information to the first bearing component;

The first carrying component is used to adjust the posture of the wafer at the current position relative to the preset position according to the adjustment information;

The second carrier assembly is used to transport the wafer before or after adjustment.

According to some embodiments of the present disclosure, the first bearing assembly includes:

a clamping unit for clamping the wafer;

a rotating unit connected to the clamping unit;

a moving unit connected to the rotating unit to drive the clamping unit to move in the horizontal direction;

The lifting unit is connected with the moving unit to drive the clamping unit to move vertically.

According to some embodiments of the present disclosure, the clamping unit includes:

a clamping seat connected to the rotating unit;

The first clamping arm is movably connected to the clamping seat, and the end of the first clamping arm away from the clamping seat is provided with a first gripping portion;

The second clamping arm is movably connected to the clamping seat, and the end of the second clamping arm away from the clamping seat is provided with a second gripping portion;

Wherein, the second clamping arm is arranged opposite to the first clamping arm, and the second clamping arm and the first clamping arm can move relative to each other, so as to clamp the wafer.

According to some embodiments of the present disclosure, grooves are provided on the first holding portion and/or the second holding portion, and the grooves are used for accommodating the edge of the wafer.

According to some embodiments of the present disclosure, a driving unit is provided on the clamping seat, and the driving unit is used to drive the first clamping arm and the second clamping arm to swing relative therebetween, Or drive the first clamping arm and the second clamping arm to move relative to each other along a linear direction.

According to some embodiments of the present disclosure, the drive unit includes a drive cylinder or a variable frequency motor.

According to some embodiments of the present disclosure, the second bearing assembly includes:

The transfer arm is used to transfer the wafer to the process chamber, wherein the number of the process chambers is multiple, and the plurality of process chambers are distributed along the circumferential direction, and the transfer arm is located at the radially inside;

The detection unit is arranged on the transfer arm, and is used to obtain the current attitude information of the wafer at the current position.

The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below. Other features and advantages of the disclosure will be apparent from the description, drawings, and claims.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present disclosure. For those skilled in the art, other drawings can also be obtained according to these drawings without creative work.

Fig. 1 is a flow chart of a method for adjusting a wafer transfer position according to an exemplary embodiment.

FIG. 2 is a schematic diagram of an angular offset in a method for adjusting a wafer transfer position according to an exemplary embodiment.

Fig. 3 is a schematic diagram of a distance offset in a method for adjusting a wafer transfer position according to an exemplary embodiment.

Fig. 4 is a schematic diagram of a device for adjusting a wafer transfer position according to an exemplary embodiment.

Fig. 5 is a schematic diagram of a semiconductor device according to an exemplary embodiment.

Fig. 6 is a schematic diagram of a clamping unit in a semiconductor device according to an exemplary embodiment.

Fig. 7 is a schematic diagram of a first carrier component in a semiconductor device according to an exemplary embodiment.

Reference signs:

1. The control device; 2. The first bearing component;

3. The second carrying component; 10. Wafer;

20. Mechanical arm; 21. Clamping unit;

22. Rotation unit; 23. Mobile unit;

24. Lifting unit; 30. Process chamber;

31. Transmission arm; 32. Detection unit;

40. Transmission chamber; 100. Obtaining module;

110. Processing module; 120. Execution module;

211, clamping seat; 212, first clamping arm;

213, the second clamping arm; 2121, the first gripping part;

2131, the second holding part; A _n , the center point of the processing position;

B, rotation center point; L, horizontal extension line;

θ _m , the angle between the line connecting A _n and B and L;

P, the grabbing center of the wafer at the preset position;

P′, the grabbing center of the wafer at the current position;

The line distance between X, P' and P.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments It is a part of the embodiments of the present disclosure, but not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present disclosure. It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined arbitrarily with each other.

Among them, when the robot arm is used to transfer the wafer back to the wafer cassette, or when the wafer is transferred to the wafer carrier in each chamber, there will be a problem of offset of the wafer position, and when the wafer position After the offset occurs, it will affect the transfer of the wafer, resulting in the inability of the wafer to be accurately transferred to the designated process position, so that the processed wafer cannot achieve the expected effect, causing the wafer to be scrapped. When the position deviation is serious, the setting will cause the collision or fragmentation of the wafer, pollute the process chamber, and then affect the subsequent process. For wafer position deviation, it is usually corrected by importing offset position parameters into the machine, for example, through computer-aided design tool calibration. However, the calibration process is cumbersome and error-prone. When the wrong position parameters are entered manually, it will seriously cause damage to the wafer due to chip collision.

At the same time, during long-term use, the robot arm that transfers wafers will also have a movement position deviation. The movement position deviation of the robot arm itself will also affect the position deviation of the wafer, which reduces the accuracy of the wafer transfer process and leads to a decrease in the wafer yield. .

In the method for adjusting the transfer position of the wafer, the adjustment device, and the semiconductor equipment provided by the embodiments of the present disclosure, the adjustment device responds to the adjustment information, and according to the adjustment information, the wafer can be transferred in time when there is a deviation in the wafer position. The position of the wafer is adjusted, thereby effectively improving the accuracy of wafer transmission, reducing the damage rate of the wafer, and improving the product yield of the wafer.

An exemplary embodiment of the present disclosure provides a method for adjusting a wafer transfer position. The method for adjusting the wafer transfer position will be described in detail below with reference to FIGS. 1-3 .

As shown in FIG. 1 to FIG. 3 , an exemplary embodiment of the present disclosure provides a method for adjusting a wafer transfer position, and the adjustment method includes the following steps:

Step S100: Obtain preset pose information of the wafer, where the preset pose information includes at least preset position information.

Step S200: Obtain the current attitude information of the wafer, the current attitude information at least includes the current position information of the wafer.

Step S300: Calculate the offset according to the difference between the preset attitude information and the current attitude information to determine the adjustment information, and send the adjustment information to the adjustment device.

Step S400: Responding to the adjustment information, obtain the wafer at the current position, adjust the wafer through the adjustment device, and transfer the wafer to the preset position.

Wherein, in step S100, the preset posture information of the wafer 10 is used to characterize: the preset distance information and preset angle information of the preset position of the wafer 10 on the wafer carrier in each process chamber in the semiconductor equipment , preset flip information, preset rotation angle information, etc. At the same time, the preset posture information can also be used to characterize the accurate placement position information, placement angle information, flip information, and rotation angle information of the wafer 10 at the preset position on the robot arm that transfers it. It should be noted that the preset posture information may be pre-stored in the control system of the semiconductor device, or communicated with the storage device through a communication device during the process to obtain the preset posture information, the preset posture information stored in a storage device. Wherein, the control system of the semiconductor device may include a dynamic random access memory (Dynamic random access memory, DRAM for short) or a single-chip microcomputer. When it is necessary to use the preset posture information for comparison, it can be directly retrieved from the control system in the semiconductor device.

In step S200 , the current posture information of the wafer 10 can be acquired by a detection unit or a data information collection unit. Wherein, the detection unit or the data information acquisition unit includes one or more combinations of a position sensor, an optical sensor, an angle sensor, and the like.

As shown in FIG. 2 , in step S300 , in some embodiments, the preset pose information of the wafer 10 includes preset angle information.

In one example, as shown in FIG. 2 , take a robot arm 20 for transferring a wafer 10 cooperating with a plurality of process chambers 30 as an example, wherein the robot arm 20 is arranged in the transfer chamber 40, and the plurality of process chambers The chambers are arranged at intervals along the rotation direction of the robot arm 20 . Wafer 10 has a target processing position center point A ₁ , A ₂ , A ₃ , _. . The mechanical arm 20 has a rotation center point B along its height extension direction, and there is a lateral extension line L passing through the rotation center point B in the transfer chamber 40. The preset angle information in this embodiment is used to characterize: processing position The included angles between the connecting lines A _{1 B} , A ₂ B, A ₃ B, ...A _n B of the center points A ₁ , A ₂ , A ₃ ,...A _n and the rotation midline point B and the transverse extension line L are θ ₁ , θ ₂ , θ ₃ , ... θ _m , where the value of θ _m can be positive or negative. The included angle at the processing position of the wafer 10 in the process chamber 30 obtained by the detection unit or the data information acquisition unit is θ _m′ (m is an integer greater than or equal to zero), that is, the current position of the wafer 10 at the current position The attitude information is θ _m′ , wherein, when the angles corresponding to θ _m′ and θ _m are different, it means that there is an angular deviation during the process of transferring the wafer 10 by the robotic arm 20, that is, the transfer position deviation. At this time, it is necessary to Correction processing is performed on the angular deviation of the wafer 10 .

Then, according to the current posture information and the preset angle information, the angular offset of the wafer 10 at the current position relative to the preset position is determined. In this embodiment, the angular offset θ of the wafer 10 at the current position relative to the preset position can be calculated through the _difference between θ _m′ and θ _m . According to the angle offset, an angle compensation amount θ is _determined , wherein the adjustment information includes the angle compensation amount. It should be noted that the absolute values of theta _offset and theta _complement are the same, but the _offset direction of theta _offset is opposite to that of theta offset. For example, the _offset value of theta offset is determined in the clockwise direction, and the angle When compensating, it is necessary to carry out the angle compensation amount of θ _supplement angle value to the angle of the wafer in the counterclockwise direction.

After determining the angle compensation amount of the wafer 10 at the current position relative to the preset position, the adjustment information including the angle compensation amount is sent to the adjustment device. Wherein, the above-mentioned adjustment information can be sent to the adjustment device through a control system of the semiconductor equipment, such as a dynamic random access memory (DRAM) or a single-chip microcomputer. In this specific embodiment, the control system sends adjustment information including angle compensation to the first carrier component in the adjustment device, and the adjustment information is configured in this embodiment to: drive the first carrier component to adjust the relative preset position of the wafer The included angle, that is, the control system drives the first carrier assembly to perform angle compensation on the current position of the wafer.

In this embodiment, when the position of the wafer deviates during the transfer process, the angle compensation and correction are performed on the wafer by determining the angle compensation amount of the wafer, thereby simplifying the process of wafer position deviation and improving the wafer position. The accuracy of calibration can effectively avoid the impact of wafer collision or debris caused by wafer position deviation.

As shown in FIG. 3 , in some embodiments, the preset posture information further includes preset distance information.

In one example, as shown in FIG. 3 , when each wafer 10 is placed on the wafer stage of the process chamber 30 , it has a grabbing center P that is grabbed by the robot arm 20 . Wherein, the wafer 10 has operations such as flipping in the process chamber 30. When the wafer 10 is placed on the wafer stage of the process chamber 30 again, the placement position of the wafer 10 on the wafer stage There may be a deviation, and then the robotic arm 20 takes the wafer 10 out of the process chamber 30 , and the position of the wafer 10 on the robotic arm 20 will also deviate, and the gripping center of the wafer is P′ at this time. On the same horizontal plane, P′ can appear on any side of P, wherein the length of the line connecting P′ and P is used to represent the distance offset of the wafer 10 from the current position to the preset position. It should be noted that when the length of the line connecting P′ and P is zero, the gripping center of the wafer 10 at the current position coincides with the gripping center at the preset position. Only when the length of the connecting line between P′ and P is greater than zero, it means that there is a distance deviation of the wafer at the current position. At this time, the distance deviation of the wafer 10 needs to be corrected.

Subsequently, according to the current posture information and the preset distance information, the distance offset of the wafer 10 at the current position relative to the preset position is determined. In this embodiment, the grabbing center P′ of the wafer 10 at the current position can be obtained by the detection unit or the data information collection unit, and it is judged whether the length of the line between P′ and P is greater than zero. When the value of the connection length is greater than zero, the distance offset of the wafer 10 needs to be corrected.

The distance compensation amount is determined according to the distance offset amount, wherein the adjustment information includes the distance compensation amount, and it should be noted that the value of the distance compensation amount is equal to the value of the distance offset amount. When the grasping center P' of the wafer 10 at the current position is located on the left side of the grasping center P of the wafer 10 at the preset position and the length of the line between P' and P is X, the distance compensation is performed on the wafer 10 , it is necessary to move the wafer 10 toward the right side of the gripping center P by X length, and the length X at this time can be expressed as a distance compensation amount.

In this embodiment, after the distance offset of the wafer is calculated, the adjustment information of the wafer is determined, and then the adjustment information can be sent to the adjustment system through the control system of the semiconductor device, such as a dynamic random access memory (DRAM) or a single-chip microcomputer. device. In this specific embodiment, the control system sends adjustment information including the amount of distance compensation to the first carrier assembly in the adjustment device, and the adjustment information is configured in this embodiment to: drive the first carrier assembly to adjust the relative preset position of the wafer That is, the control system drives the first carrier assembly to compensate the distance offset of the wafer at the current position, and then controls the first carrier assembly to adjust the wafer to the preset position.

In this embodiment, after the wafer is processed in the process chamber, when the position of the wafer stage in the process chamber is shifted, or the wafer is taken out of the process chamber by a mechanical arm, the wafer When the distance deviation occurs between the circle and the grasping position of the robot arm, the distance compensation and correction are performed on the wafer by determining the distance deviation of the wafer, which simplifies the process of wafer position deviation and improves the accuracy of wafer position correction It can effectively avoid the impact of collision or debris caused by wafer position deviation.

In step S400, in some embodiments, sending adjustment information including an angle compensation amount to the first carrier assembly, the adjustment information is configured to: drive the first carrier assembly to pick up the wafer from the second carrier assembly at the current position, and After adjusting the included angle of the wafer relative to the preset position, the first carrying assembly is driven to transport the wafer to the second carrying assembly.

In this embodiment, the second carrier assembly is used to transfer wafers between the transfer chamber 40 and the process chamber 30 . When the wafer 10 is being transferred, the transfer position deviation may occur when the second carrier assembly transfers the wafer 10 , or, during the long-term use of the second carrier assembly, the second carrier assembly itself may have usage deviation. At this time, the detection unit or the data information acquisition unit obtains the current posture information of the wafer 10 on the second carrier assembly, compares the current posture information with the preset angle information, calculates the angular offset of the wafer, and Determines the amount of angle compensation. Then, the control system in the semiconductor device controls and drives the first carrying assembly to pick up the wafer 10 from the second carrying assembly, and adjusts the wafer 10 according to the angle compensation amount. Subsequently, the control system drives the first carrier assembly to place the wafer 10 on the second carrier assembly, and then the second carrier assembly transfers the wafer 10 to the process chamber 30 or takes the wafer out of the process chamber 30 .

In some other embodiments, the adjustment information including the distance compensation amount is sent to the first carrier assembly, and the adjustment information is configured to: drive the first carrier assembly to pick up the wafer from the second carrier assembly at the current position and adjust the relative After a predetermined distance, the first carrier assembly is driven to transfer the wafer to the second carrier assembly.

In this embodiment, when the placement position of the wafer 10 on the wafer stage in the process chamber 30 deviates, after the second carrier assembly grabs the wafer 10, the grasping of the wafer 10 at the current position The center point is offset from the grab center at the preset position. Obtain the current attitude information of the wafer 10 on the second carrier assembly through the detection unit or the data information acquisition unit, compare the current attitude information with the preset distance information, calculate the distance offset of the wafer 10, and determine Amount of distance compensation. Then, the control system in the semiconductor device controls and drives the first carrier assembly to pick up the wafer 10 from the second carrier assembly, and adjusts the wafer 10 according to the distance compensation amount. Then, the control system drives the first carrier assembly to place the wafer 10 on the second carrier assembly, and then the second carrier assembly transfers the wafer 10 to the process chamber 30, or takes the wafer 10 out of the process chamber 30 .

In the above embodiment, the adjustment device responds to the adjustment information, and according to the adjustment information, the position of the wafer can be adjusted in time when the wafer position deviates during the transfer of the wafer, thereby effectively improving the accuracy of the transfer of the wafer. , reduce the breakage rate of the wafer, and improve the product yield of the wafer.

As shown in FIG. 4 , the present disclosure provides an apparatus for adjusting a wafer transfer position in an exemplary embodiment, and the apparatus includes: an acquisition module 100 , a processing module 110 and an execution module 120 . The acquisition module 100 and the execution module 120 are electrically connected to the processing module 110 respectively.

Wherein, the obtaining module 100 is used to obtain the preset posture information of the wafer, and the preset posture information includes at least preset position information; the obtaining module 100 is also used to obtain the current posture information of the wafer, and the current posture information includes at least the location where the wafer is located Current location information.

The processing module 110 is used to calculate the offset according to the difference between the target attitude information and the current attitude information, so as to determine the adjustment information, and send the adjustment information to the adjustment device.

The execution module is used to obtain the wafer at the current position in response to the adjustment information, adjust the wafer through the adjustment device, and transfer the wafer to the preset position.

Exemplarily, in some embodiments, the preset posture information includes preset angle information.

In this embodiment, the processing module 110 is further configured to: determine the angular offset of the wafer at the current position relative to the preset position according to the current posture information and the preset angle information; determine the angle compensation amount according to the angular offset, Wherein, the adjustment information includes angle compensation amount.

Correspondingly, in this embodiment, the execution module 120 is further configured to: send adjustment information including an angle compensation amount to the first carrier assembly, and the adjustment information is configured to: drive the first carrier assembly to adjust the relative preset position of the wafer angle.

Specifically, the execution module 120 is configured to send adjustment information including an angle compensation amount to the first carrier assembly, and the adjustment information is configured to: drive the first carrier assembly to pick up the wafer from the second carrier assembly at the current position, and adjust After the wafer is at an angle relative to the preset position, the first carrying component is driven to transport the wafer to the second carrying component.

Exemplarily, in some other embodiments, the preset posture information further includes preset distance information.

In this embodiment, the processing module 110 is further configured to: determine the distance offset of the wafer at the current position relative to the preset position according to the current posture information and the preset distance information; determine the distance compensation amount according to the distance offset, Wherein, the adjustment information includes the distance compensation amount.

Correspondingly, in this embodiment, the executing module 120 is further configured to: send adjustment information including the distance compensation amount to the first carrier assembly, and the adjustment information is configured to: drive the first carrier assembly to adjust the relative preset position of the wafer distance.

Specifically, the execution module 120 is configured to send adjustment information including the distance compensation amount to the first carrier assembly, and the adjustment information is configured to: drive the first carrier assembly to pick up the wafer from the second carrier assembly at the current position and adjust the wafer After the distance from the circle relative to the preset position, the first carrier assembly is driven to transfer the wafer to the second carrier assembly.

The device for adjusting the wafer transfer position in this embodiment has a simple structural design and is easy to operate. During the wafer transfer process, the position of the wafer can be adjusted in time when the wafer position deviates, thereby effectively improving the efficiency of wafer transfer. Accuracy, reduce the breakage rate of the wafer, and improve the product yield of the wafer.

As shown in FIG. 5 , the present disclosure provides a semiconductor device in an exemplary embodiment, and the semiconductor device includes: a control device 1 , a first carrier component 2 and a second carrier component 3 . Wherein, the control device 1 is electrically connected to the first bearing assembly 2 and the second bearing assembly 3 respectively.

Referring to FIG. 5 , the control device 1 is used to determine the adjustment information of the wafer 10 and send the adjustment information to the first carrier assembly 2 . In some embodiments, the control device 1 may include a dynamic random access memory (DRAM) or a single-chip microcomputer.

The second carrier assembly 3 is used to adjust the posture of the wafer 10 at the current position relative to the preset position according to the adjustment information.

The second carrier assembly 3 is used for transferring the unadjusted or adjusted wafer 10 between each process chamber 30 and the transfer chamber 40 . Wherein, the second carrying component 3 may include a mechanical arm.

As shown in FIG. 7 , in some embodiments, the first bearing assembly 2 includes: a clamping unit 21 , a rotating unit 22 , a moving unit 23 and a lifting unit 24 .

The clamping unit 21 is used for clamping the wafer, so as to facilitate adjustment of the relative position of the wafer 10 .

The rotating unit 22 is connected to the clamping unit 21 , wherein the rotating unit 22 can drive the clamping unit 21 to rotate for turning over the wafer 10 . In some embodiments, the rotary unit 22 may comprise a rotary cylinder. The rotary cylinder is provided with an air source through external air supply equipment such as an air compressor, and the action of the rotary cylinder can be controlled by the control device 1 or the control system in the semiconductor device. The rotating unit 22 may also include a slewing support, and the movement of the slewing support is controlled by a driving motor.

The moving unit 23 is connected with the rotating unit 22 to drive the clamping unit 21 to move in the horizontal direction; the lifting unit 24 is connected to the moving unit 23 to drive the clamping unit 21 to move in the vertical direction. It should be noted that the moving unit 23 and the lifting unit 24 may adopt structural components similar to those in the six-degree-of-freedom robot arm.

Referring to FIG. 6 , the clamping unit 21 includes a clamping seat 211 , a first clamping arm 212 and a second clamping arm 213 . Wherein, the clamping seat 211 is connected with the rotating unit 22 .

One end of the first clamping arm 212 is movably connected to the clamping seat 211, and the other end of the first clamping arm 212, that is, the end away from the clamping seat 211, is provided with a first gripping portion 2121, and the first gripping portion 2121 Used to hold wafers.

One end of the second clamping arm 213 is movably connected to the clamping seat 211, and the other end of the second clamping arm 213, that is, the end of the second clamping arm 213 away from the clamping seat 211 is provided with a second gripping portion 2131. The second gripping part 2131 is used in conjunction with the first gripping part 2121 for clamping the wafer.

Wherein, in some embodiments, the second clamping arm 213 and the first clamping arm 212 are relatively arranged on the clamping seat 211, and the second clamping arm 213 and the first clamping arm 212 can move relatively, so as to realize The clamping of the wafer is convenient for adjusting the current angle or the current distance of the wafer in the current position, so as to correct the relative position of the wafer.

In some embodiments, one of the first gripping portion 2121 and the second gripping portion 2131 is provided with a groove (not shown in the figure), or, the first gripping portion 2121 and the second gripping portion 2131 Grooves are provided on each of them, and the grooves are used for accommodating the edge of the wafer 10 . In this embodiment, when there is a deviation in the current position of the wafer, the control device 1 drives the clamping unit 21 of the first carrying assembly 2 to move toward the position of the wafer 10, and then the control device 1 controls the first clamping arm 212 and the second clamping arm 213 are opened, and the wafer 10 is clamped by using the groove. Finally, according to the adjustment information, the control device 1 drives the first carrier assembly 2 to align the wafer 10 at the current position relative to the preset position. Posture adjustments.

In order to realize the relative movement between the first clamping arm 212 and the second clamping arm 213 , in some embodiments, a driving unit (not shown in the figure) is provided on the clamping seat 211 .

Wherein, in some embodiments, the driving unit may include a driving cylinder for driving the first clamping arm 212 and the second clamping arm 213 to swing relative therebetween. It should be noted that there is at least one driving cylinder. When the number of driving cylinders is two, the piston end of one of the driving cylinders is connected with the first clamping arm 212, and the piston end of the other driving cylinder is connected with the second clamping arm 213, thereby driving the first clamping arm 212. The first clamping arm 212 and the second clamping arm 213 swing relative therebetween.

In some other embodiments, the drive unit may also include a variable frequency motor, the output shaft end of the variable frequency motor is connected to a transmission rod with positive and negative threads at both ends, and the two ends of the transmission rod are connected to the first clamping arm 212 and the second clamping arm 212 respectively. The clamping arm 213 is screwed, and the first clamping arm 212 and the second clamping arm 213 are respectively hinged on the clamping seat 211 . The frequency conversion motor rotates, and then drives the first clamping arm 212 and the second clamping arm 213 to move relative to each other along a linear direction.

As shown in FIG. 5 , the second carrying assembly 3 includes a transfer arm 31 . The transfer arm 31 is used for transferring the wafer 10 into the process chamber 30 or taking the wafer 10 out of the process chamber 30 . Wherein, the transfer arm 31 is located in the transfer chamber 40, the number of process chambers 30 is multiple, and the plurality of process chambers 30 are distributed along the circumferential direction, and the transfer arm 31 is located on the radial inner side of the circumference. It should be noted that the transfer arm 31 also has the function of flipping the wafer. The transfer arm 31 can absorb the wafer through vacuum suction, so as to realize the flipping of the wafer, so as to perform other operations, such as cleaning the process chamber or Troubleshooting and other operations.

The second bearing component 3 further includes a detection unit 32 . The detection unit 32 is disposed on the transfer arm 31 and is used to acquire the current posture information of the wafer 10 at the current position. In some embodiments, when there is an angular deviation of the wafer 10 during transport, the detection unit 32 may use an optical sensor, wherein the number of the optical sensor is at least one. In other embodiments, when there is a position deviation on the wafer transfer arm 31 or on the wafer stage in the process chamber, the detection unit 32 may use a position sensor, and the number of the position sensor is at least one.

In the semiconductor equipment in this embodiment, the second carrier assembly transfers the wafer between the process chamber and the transfer chamber, and the detection unit acquires the current posture information of the wafer at the current position, and when the wafer is in the transfer process When there is an angle deviation or a position deviation, the first carrying assembly is used to pick up the wafer on the second carrying assembly and rise to a predetermined height, and then the control device calculates the offset. Then, after the control device compensates the offset, the first carrying assembly lowers the wafer onto the second carrying assembly to complete position correction. The wafer position calibration process in this embodiment is accurate and quick, saves time and effort, and has a low error rate, which reduces the cumbersome calibration process of the inspectors using computer-aided design tools to calibrate, and can save vacuum breakage caused by wafer collisions or debris The time cost is consumed, the pollution of the process chamber is avoided, and the production cost is saved, which makes the inspection process of the inspectors simple and fast, and shortens the correction time and recovery time of the inspectors. It can effectively improve the accuracy of wafer transmission, reduce the damage rate of wafers, and improve the product yield of wafers.

At the same time, it can effectively avoid the differences in the operation of semiconductor equipment by operators of different types of work, increase the fault tolerance rate, and provide great convenience for the inspection and troubleshooting of semiconductor equipment in the later stage.

Each embodiment or implementation manner in this specification is described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. mean that the embodiments are combined Specific features, structures, materials, or characteristics described in or examples are included in at least one embodiment or example of the present disclosure.

In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present disclosure. scope.

Industrial Applicability

In the method for adjusting the transfer position of the wafer, the adjustment device, and the semiconductor equipment of the embodiments of the present disclosure, the adjustment device responds to the adjustment information, and according to the adjustment information, the wafer can be adjusted in time when the wafer position deviates when the wafer is transferred. The position of the wafer is adjusted, thereby effectively improving the accuracy of the wafer transfer, reducing the damage rate of the wafer, and improving the product yield of the wafer.

Claims

A method for adjusting a wafer delivery position, comprising:

Obtain preset posture information of the wafer, where the preset posture information includes at least preset position information;

Acquiring current posture information of the wafer, the current posture information at least including current position information of the wafer;

calculating an offset according to the difference between the preset attitude information and the current attitude information to determine adjustment information, and sending the adjustment information to an adjustment device;

In response to the adjustment information, the wafer is obtained at the current position, the wafer is adjusted by the adjustment device, and the wafer is transferred to a preset position.
The method for adjusting the wafer transfer position according to claim 1, wherein the preset attitude information includes preset angle information and preset distance information;

The offset calculated according to the difference between the preset attitude information and the current attitude information includes:

determining an angular offset of the wafer at the current position relative to the preset position according to the current attitude information and the preset angle information; or,

According to the current attitude information and the preset distance information, determine a distance offset of the wafer at the current position relative to the preset position.
The method for adjusting the wafer transfer position according to claim 2, wherein the step of determining the adjustment information includes:

determining an angle compensation amount according to the angle offset;

The adjustment information includes the angle compensation amount;

or,

determining a distance compensation amount according to the position offset;

The adjustment information includes the distance compensation amount.
The method for adjusting the wafer transfer position according to claim 3, wherein the step of determining the adjustment information and sending the adjustment information to the adjustment device includes:

Send the adjustment information including the angle compensation amount to the first carrier assembly, the adjustment information is configured to: drive the first carrier assembly to adjust the angle of the wafer relative to the preset position; or,

Sending the adjustment information including the distance compensation amount to the first carrying assembly, the adjustment information being configured to: drive the first carrying assembly to adjust the distance of the wafer relative to the preset position.
The method for adjusting the wafer transfer position according to claim 4, wherein said wafer is obtained at said current position in response to said adjustment information, said wafer is adjusted by said adjustment device, and The step of transferring the wafer to the preset position also includes:

sending the adjustment information including the angle compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the wafer, and after adjusting the included angle of the wafer relative to the preset position, driving the first carrying assembly to transport the wafer to the second carrying assembly;

or,

sending the adjustment information including the distance compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the After the wafer is adjusted and the distance between the wafer and the preset position is adjusted, the first carrying component is driven to transport the wafer to the second carrying component.
A device for adjusting a wafer transfer position, comprising:

An acquisition module, configured to acquire preset posture information of the wafer, the preset posture information at least including preset position information;

The acquisition module is also used to acquire the current attitude information of the wafer, the current attitude information at least includes the current position information of the wafer;

A processing module, configured to calculate an offset according to the difference between the preset attitude information and the current attitude information, to determine adjustment information, and send the adjustment information to the adjustment device;

The execution module is used for obtaining the wafer at the current position in response to the adjustment information, adjusting the wafer through the adjustment device, and sending the wafer to the preset position.
The device for adjusting the wafer transfer position according to claim 6, wherein the preset attitude information includes preset angle information and preset distance information;

The processing module is also used to:

determining an angular offset of the wafer at the current position relative to the preset position according to the current attitude information and the preset angle information; or,

According to the current attitude information and the preset distance information, determine a distance offset of the wafer at the current position relative to the preset position.
The device for adjusting the wafer transfer position according to claim 7, wherein the processing module is further used for:

determining an angle compensation amount according to the angle offset;

The adjustment information includes the angle compensation amount;

or,

determining a distance compensation amount according to the distance offset;

The adjustment information includes the distance compensation amount.
The device for adjusting the wafer transfer position according to claim 8, wherein the execution module is further used for:

Sending the adjustment information including the angle compensation amount to the first carrier assembly, the adjustment information is configured to: drive the first carrier assembly to adjust the included angle of the wafer relative to the preset position; or,

Sending the adjustment information including the distance compensation amount to the first carrying assembly, the adjustment information being configured to: drive the first carrying assembly to adjust the distance of the wafer relative to the preset position.
The device for adjusting the wafer transfer position according to claim 9, wherein the execution module is further used for:

sending the adjustment information including the angle compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the wafer, and after adjusting the included angle of the wafer relative to the preset position, driving the first carrying assembly to transport the wafer to the second carrying assembly;

or,

sending the adjustment information including the distance compensation amount to the first bearing component, the adjustment information being configured to: drive the first bearing component to pick up the After the wafer is adjusted and the distance between the wafer and the preset position is adjusted, the first carrying component is driven to transport the wafer to the second carrying component.
A semiconductor device comprising:

a control device, configured to determine adjustment information and send the adjustment information to the first bearing component;

The first carrying component is used to adjust the posture of the wafer at the current position relative to the preset position according to the adjustment information;

The second carrier assembly is used to transport the wafer before or after adjustment.
The semiconductor device according to claim 11, wherein said first carrier assembly comprises:

a clamping unit for clamping the wafer;

a rotating unit connected to the clamping unit;

a moving unit connected to the rotating unit to drive the clamping unit to move in the horizontal direction;

The lifting unit is connected with the moving unit to drive the clamping unit to move vertically.
The semiconductor device according to claim 12, wherein the clamping unit comprises:

a clamping seat connected to the rotating unit;

The first clamping arm is movably connected to the clamping seat, and the end of the first clamping arm away from the clamping seat is provided with a first gripping portion;

The second clamping arm is movably connected to the clamping seat, and the end of the second clamping arm away from the clamping seat is provided with a second gripping portion;

Wherein, the second clamping arm is arranged opposite to the first clamping arm, and the second clamping arm and the first clamping arm can move relative to each other so as to clamp the wafer.
The semiconductor device according to claim 13, wherein a groove is provided on the first holding portion and/or the second holding portion, and the groove is used to accommodate the edge of the wafer.
The semiconductor device according to claim 13 , wherein a driving unit is provided on the clamping seat, and the driving unit is used to drive the first clamping arm and the second clamping arm between them. performing relative swing, or driving the first clamping arm and the second clamping arm to perform relative motion along a linear direction between the two.
The semiconductor device according to claim 15, wherein the drive unit includes a drive cylinder or an inverter motor.
The semiconductor device according to any one of claims 11-16, wherein the second carrier component comprises:

The transfer arm is used to transfer the wafer to the process chamber, wherein the number of the process chambers is multiple, and the plurality of process chambers are distributed along the circumferential direction, and the transfer arm is located at the radially inside;

The detection unit is arranged on the transfer arm, and is used to obtain the current attitude information of the wafer at the current position.