CN116277015B - Data processing method, device, equipment and storage medium - Google Patents
Data processing method, device, equipment and storage medium Download PDFInfo
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- CN116277015B CN116277015B CN202310370077.7A CN202310370077A CN116277015B CN 116277015 B CN116277015 B CN 116277015B CN 202310370077 A CN202310370077 A CN 202310370077A CN 116277015 B CN116277015 B CN 116277015B
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- 238000012546 transfer Methods 0.000 claims abstract description 83
- 238000013507 mapping Methods 0.000 claims abstract description 50
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- 230000007547 defect Effects 0.000 claims description 31
- 238000012545 processing Methods 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 221
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- 238000004891 communication Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007599 discharging Methods 0.000 description 3
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
- B25J9/1697—Vision controlled systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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Abstract
The invention discloses a data processing method, a device, equipment and a storage medium. The data processing method is applied to wafer transfer equipment, the wafer transfer equipment comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the method comprises the following steps: acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box; based on the image to be identified, carrying out gesture identification on the current gesture of the wafer to generate current gesture information of the wafer; generating a control instruction according to the current gesture information and the target gesture information; the control instruction is used for controlling the rotary turntable to rotate the wafer to the target gesture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box. Compared with the prior mode that the wafer is firstly grabbed by the wafer conveying robot and placed in the aligning device, and then the wafer aligned by the aligning device is grabbed and placed in the blanking transfer box, the transfer efficiency of the wafer can be improved.
Description
Technical Field
The present invention relates to the field of data processing technologies, and in particular, to a data processing method, apparatus, device, and storage medium.
Background
In the process of semiconductor manufacturing, wafers need to undergo hundreds to thousands of moving and carrying processes, materials and production environments of the wafers need to be strictly controlled in a dust-free environment with extremely high grade, manual touch is avoided, and the wafers are automatically transported in the whole process, while a traditional semiconductor equipment front-end module (EFEM) and a wafer rewinder (Sorters) are used for controlling the positions of the wafers in a blanking transfer box when the wafers in the feeding transfer box are transported to the blanking transfer box, so that the next manufacturing process is better adapted, the wafers are grabbed from the feeding transfer box by a wafer transport robot (mechanical arm) and placed in a wafer alignment device, the alignment device is used for rotating and adjusting the wafers, the mechanical arm grabs and places the adjusted wafers in the blanking transfer box, and the wafer transfer process is complex and the transfer efficiency is lower.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide a data processing method, a device, equipment and a storage medium, and aims to solve the technical problem that in the prior art, a wafer is required to be placed in a wafer alignment device by a mechanical arm for rotation adjustment, and then the wafer after rotation adjustment is grabbed by the mechanical arm and placed in a blanking transfer box, so that the transfer efficiency of the wafer is low.
In order to achieve the above object, the present invention provides a data processing method, which is applied to a wafer transfer apparatus, the wafer transfer apparatus including a robot arm on which a rotary turntable is integrated, the data processing method comprising the steps of:
acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box;
based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer;
generating a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box.
Optionally, the step of performing gesture recognition on the current gesture of the wafer based on the image to be recognized to generate current gesture information of the wafer includes:
based on the image to be identified, identifying the notch position and the circle center position of the wafer;
And mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
Optionally, the step of identifying the notch position and the center position of the wafer based on the image to be identified includes:
establishing an image reference coordinate system based on the image to be identified;
and identifying the notch position and the circle center position of the wafer in the image to be identified in the image reference coordinate system.
Optionally, the step of mapping the notch position and the center position to a preset reference coordinate system to obtain current pose information of the notch position and the center position in the preset reference coordinate system includes:
and mapping the notch position and the circle center position in the image reference coordinate system into a preset reference coordinate system based on the image reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
Optionally, the target gesture information includes a target notch coordinate and a target center coordinate of a required gesture of the wafer placed in a target transfer box in the preset reference coordinate system;
The step of generating a control instruction according to the current gesture information and the target gesture information comprises the following steps:
determining a current notch coordinate and a current circle center coordinate of the wafer in the preset reference coordinate system according to the current posture information, wherein the current circle center coordinate and the target circle center coordinate coincide;
determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
Optionally, the target gesture information includes a target center coordinate, and the current gesture information includes a current center coordinate of the wafer in a preset reference coordinate system;
the step of generating a control instruction according to the current gesture information and the target gesture information comprises the following steps:
selecting reference circle center coordinates, wherein the reference circle center coordinates comprise any one of the current circle center coordinates, target circle center coordinates or reference coordinates different from the current circle center coordinates and the target circle center coordinates;
determining a current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate;
Determining a target notch matching coordinate according to the target attitude information based on the reference circle center coordinate;
determining rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
Optionally, before the step of generating the current pose information of the wafer, the step of performing pose recognition on the current pose of the wafer based on the image to be recognized further includes:
performing defect detection and identification on the image to be identified to generate a defect identification result;
and executing the step of carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized to generate the current gesture information of the wafer when the defect recognition result is that the defect does not exist.
In addition, to achieve the above object, the present invention also provides a data processing apparatus, including:
the acquisition module is used for acquiring target attitude information and an image to be identified containing the surface of the wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box;
The gesture recognition module is used for carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized, and generating current gesture information of the wafer;
the control instruction generation module is used for generating a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box.
In addition, to achieve the above object, the present invention also proposes a data processing apparatus comprising: a memory, a processor and a data processing program stored on the memory and executable on the processor, the data processing program being configured to implement the steps of the data processing method as described above.
In addition, in order to achieve the above object, the present invention also proposes a storage medium having stored thereon a data processing program which, when executed by a processor, implements the steps of the data processing method as described above.
The data processing method is applied to wafer transfer equipment, the wafer transfer equipment comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the method comprises the following steps: acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box; based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer; generating a control instruction according to the current gesture information and the target gesture information; the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box. Compared with the prior art that the wafer transport robot grabs the wafer from the feeding transfer box and places the wafer in the wafer alignment device, the wafer is rotationally adjusted through the wafer alignment device, and the wafer transport robot grabs the adjusted wafer and places the wafer in the discharging transfer box.
Drawings
FIG. 1 is a schematic diagram of a data processing apparatus of a hardware operating environment in which embodiments of the present invention are directed;
FIG. 2 is a flow chart of a first embodiment of a data processing method according to the present invention;
FIG. 3 is a schematic view of a wafer transferring apparatus according to a first embodiment of the data processing method of the present invention;
FIG. 4 is a diagram illustrating a coordinate mapping of a first embodiment of a data processing method according to the present invention;
FIG. 5 is a flow chart of a second embodiment of the data processing method of the present invention;
FIG. 6 is a diagram illustrating a coordinate mapping according to a second embodiment of the data processing method of the present invention;
FIG. 7 is a flowchart of a third embodiment of a data processing method according to the present invention;
fig. 8 is a block diagram showing the structure of a first embodiment of the data processing apparatus of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
With reference to fig. 1, fig. 1 is a schematic diagram of a data processing device structure of a hardware running environment according to an embodiment of the present invention.
As shown in fig. 1, the data processing apparatus may include: a processor 1001, such as a central processing unit (Central Processing Unit, CPU), a communication bus 1002, a user interface 1003, a network interface 1004, a memory 1005. Wherein the communication bus 1002 is used to enable connected communication between these components. The user interface 1003 may include a Display, an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may further include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a Wireless interface (e.g., a Wireless-Fidelity (WI-FI) interface). The Memory 1005 may be a high-speed random access Memory (Random Access Memory, RAM) or a stable nonvolatile Memory (NVM), such as a disk Memory. The memory 1005 may also optionally be a storage device separate from the processor 1001 described above.
It will be appreciated by those skilled in the art that the structure shown in fig. 1 does not constitute a limitation of the data processing apparatus and may include more or fewer components than shown, or may combine certain components, or a different arrangement of components.
As shown in fig. 1, an operating system, a network communication module, a user interface module, and a data processing program may be included in the memory 1005 as one type of storage medium.
In the data processing apparatus shown in fig. 1, the network interface 1004 is mainly used for data communication with a network server; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 in the data processing apparatus of the present invention may be provided in a data processing apparatus that calls a data processing program stored in the memory 1005 through the processor 1001 and executes the data processing method provided by the embodiment of the present invention.
Based on the above data processing apparatus, an embodiment of the present invention provides a data processing method, and referring to fig. 2, fig. 2 is a flowchart of a first embodiment of the data processing method of the present invention.
In this embodiment, the data processing method is applied to a wafer transfer apparatus, where the wafer transfer apparatus includes a mechanical arm, and a rotary turntable is integrated on the mechanical arm, and the data processing method includes the following steps:
Step S10: and acquiring target posture information and an image to be identified containing the surface of the wafer, wherein the target posture information is mapping information of the required posture of the wafer placed in the target transfer box.
Specifically, the execution body of the embodiment may be a wafer transfer apparatus including a mechanical arm. The mechanical arm is integrated with a rotary turntable, and this embodiment and the following embodiments will be described below by taking the wafer transfer apparatus as an example.
In particular, the image to be identified may be an image comprising wafer surface features. The target transfer box may be a transfer box corresponding to a next process of the wafer. The required attitude may be an attitude of a wafer that is adapted for a next process. The mapping information may be a target center coordinate and a target notch coordinate corresponding to a required gesture of the wafer placed in a target transfer box in a mapping coordinate system when the required gesture is mapped to the mapping coordinate system. The mapping coordinate system may be a pre-established coordinate system, which is not limited herein.
In a specific implementation, when the wafer transfer device needs to flow the wafer into the next process in a specific required gesture, the image to be identified including the surface of the wafer and the target gesture information are acquired, the image to be identified including the surface of the wafer may be acquired by placing the wafer at a shooting position corresponding to a camera for acquiring the image of the surface of the wafer through the mechanical arm, and then shooting the image to be identified including the surface characteristics of the wafer by the camera. Referring to fig. 3, fig. 3 is a schematic structural diagram of a wafer transferring apparatus according to a first embodiment of the data processing method of the present invention; the wafer in fig. 3 is clamped by a mechanical arm and placed under a light source, and a camera for shooting the surface image of the wafer is arranged above the light source. The mechanical arm is integrated with a rotary turntable, which can rotate the wafer clamped by the mechanical arm, and is not shown in the figure. The image shot by the camera and containing the wafer surface can be used for detecting and identifying the wafer, when the wafer has defects as a result of the defect detection and identification, the wafer is directly placed in a blanking box with unqualified wafers, the defective wafer is prevented from flowing into the next process, and the production efficiency of the wafer is reduced.
Step S20: and carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized, and generating current gesture information of the wafer.
Specifically, the current gesture information may include a center coordinate and a notch coordinate of the wafer in a preset reference coordinate system. The preset reference coordinate system may be a preset coordinate system for characterizing the posture of the wafer, and may be a two-dimensional coordinate system or a three-dimensional coordinate system, where the two-dimensional coordinate system may include a pixel coordinate system, a target coordinate system, and the like, and the embodiment is not limited herein.
As an implementation manner, the performing gesture recognition on the current gesture of the wafer based on the image to be recognized may be based on the image to be recognized, and identifying position information of a circle center and a notch of the wafer in the image to be recognized, and then mapping the position information to the preset reference coordinate system to obtain a position of the notch and a position of the circle center of the wafer in the preset reference coordinate system, that is, the current gesture information. The preset reference coordinate system may be a three-dimensional coordinate system established based on the shooting position corresponding to the image to be identified, a mapping coordinate system corresponding to the mapping information, or a reference coordinate system different from the three-dimensional coordinate system and the mapping coordinate system, which is not limited in this embodiment.
Step S30: generating a control instruction according to the current gesture information and the target gesture information; the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box.
Specifically, the generating the control instruction according to the current gesture information and the target gesture information may be mapping the current gesture information and the target gesture information into the same coordinate system, which is hereinafter referred to as a preset reference coordinate system. According to a preset reference coordinate system, a wafer is placed in a target circle center coordinate and a target notch coordinate corresponding to a required gesture of a target transfer box, angle information, which is required to be adjusted, of a notch of the wafer is determined by the current circle center coordinate and the current notch coordinate of the wafer, the angle information comprises an angle value and an adjusting direction, and a control instruction is generated according to the angle value and the adjusting direction.
In specific implementation, reference may be made to fig. 4, and fig. 4 is a schematic diagram of coordinate mapping according to a first embodiment of the data processing method of the present invention. The coordinate system in fig. 4 may be any one of the preset reference coordinate systems described above, 01 in fig. 4 may be used to represent a current pose of the wafer mapped to the preset reference coordinate system, 011 may be a current center coordinate of the wafer mapped to the preset reference coordinate system, and 012 may be a current notch coordinate of the wafer mapped to the preset reference coordinate system. 02 in fig. 4 may be used to characterize the desired pose of the wafer placed in the target transfer box as mapped to the target pose in the preset reference frame, 021 may be the target center coordinates and 022 may be the target notch coordinates. Referring to fig. 4, the angle information to be adjusted in the notch of the wafer determined according to the target center coordinates, the target notch coordinates, the current center coordinates, and the current notch coordinates may be adjusted by 90 degrees clockwise or 270 degrees counterclockwise. Thus, the angle information may be a clockwise adjustment of 90 degrees or a counterclockwise adjustment of 270 degrees.
The data processing method of the embodiment is applied to wafer transfer equipment, the wafer transfer equipment comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the method comprises the following steps: acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box; based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer; generating a control instruction according to the current gesture information and the target gesture information; the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box. Compared with the prior art that the wafer transportation robot grabs the wafer from the feeding transfer box and places the wafer in the wafer alignment device, the wafer is rotationally adjusted through the wafer alignment device, the wafer transportation robot grabs the adjusted wafer and places the wafer in the discharging transfer box, the wafer is not required to be placed on the alignment device for alignment through the mechanical arm, then the aligned wafer is transferred to the target transfer box through the mechanical arm, the workload of the mechanical arm can be reduced, and the transfer efficiency of the wafer is improved.
Based on the first embodiment of the data processing method, further, in order to accurately identify the current gesture of the wafer, the step S20 may specifically include: based on the image to be identified, identifying the notch position and the circle center position of the wafer; and mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
Specifically, the identifying the notch position and the center position of the wafer based on the image to be identified may be identifying the notch position and the center position of the wafer in the image to be identified. The method for mapping the notch position and the center position into a preset reference coordinate system may be that the notch position and the center position are mapped into the preset reference coordinate system according to the relative relation between the notch position and the center position. For example, according to the notch position and the circle center position, the notch is directly above the circle center and is 150mm apart, and the notch position and the circle center position can be mapped into a preset reference coordinate system according to the relative relation (the notch is directly above the circle center and is 150mm apart), so that current gesture information of the notch position and the circle center position in the preset reference coordinate system can be obtained. If the circle center is mapped to the origin of the preset reference coordinate system in the mapping process, and the unit length of the coordinate system is 1mm, in the current posture information, the circle center coordinate is (0, 0), and the notch coordinate is (0,150).
Further, in order to accurately identify the notch position and the center position of the wafer, the step of identifying the notch position and the center position of the wafer based on the image to be identified includes: establishing an image reference coordinate system based on the image to be identified; and identifying the notch position and the circle center position of the wafer in the image to be identified in the image reference coordinate system.
Specifically, the establishing an image reference coordinate system based on the image to be identified may be establishing an image reference coordinate system with any position in the image to be identified as a coordinate origin, and determining a notch position and a center position of the wafer in the image reference coordinate system according to the image reference coordinate system and the notch and the center of the wafer identified during gesture identification.
Further, in order to accurately rotate the wafer to the required gesture, the step of mapping the notch position and the center position to a preset reference coordinate system to obtain current gesture information of the notch position and the center position in the preset reference coordinate system includes: and mapping the notch position and the circle center position in the image reference coordinate system into a preset reference coordinate system based on the image reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
Specifically, the mapping the notch position and the center position in the image reference coordinate system to the preset reference coordinate system may be mapping the notch position and the center position to the preset reference coordinate system according to a relative positional relationship between the notch position and the center position in the image reference coordinate system, and the mapping process may be specifically referred to, which is not described herein.
Further, in order to improve the production efficiency of the wafer and avoid the defective wafer flowing into the next process, the step of performing gesture recognition on the current gesture of the wafer based on the image to be recognized, before generating the current gesture information of the wafer, further includes: performing defect detection and identification on the image to be identified to generate a defect identification result; and executing the step of carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized to generate the current gesture information of the wafer when the defect recognition result is that the defect does not exist.
Specifically, the performing defect detection and identification on the image to be identified may be performing defect detection and identification on the image to be identified by using a wafer defect detection model trained in advance, and generating a defect identification result, where the defect identification result includes that the wafer has a defect or the wafer does not have a defect, and the wafer is allowed to flow into the next process only when the defect identification result indicates that the wafer does not have a defect. And executing the step of carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized to generate current gesture information of the wafer when the defect recognition result is that the defect does not exist. And when the defect identification result is that the defect exists, transferring the wafer to a blanking box for storing unqualified wafers.
Referring to fig. 5, fig. 5 is a flowchart illustrating a second embodiment of a data processing method according to the present invention.
Based on the first embodiment, in this embodiment, the target posture information includes a target notch coordinate and a target center coordinate of a required posture of the wafer placed in the target transfer box in the preset reference coordinate system; the step S30 includes:
step S301: and determining the current notch coordinate and the current circle center coordinate of the wafer in the preset reference coordinate system according to the current posture information, wherein the current circle center coordinate and the target circle center coordinate coincide.
Specifically, the preset reference coordinate system may be a three-dimensional coordinate system established based on the shooting position corresponding to the image to be identified, a mapping coordinate system corresponding to the mapping information, or a reference coordinate system different from the three-dimensional coordinate system and the mapping coordinate system. Therefore, if the preset reference coordinate system is a mapping coordinate system corresponding to the mapping information, no coordinate system mapping is required for the target gesture information, and if the preset reference coordinate system is not a mapping coordinate system corresponding to the mapping information, the required gesture of the wafer placed in the target transfer box needs to be mapped to the preset reference coordinate system, so as to obtain the target notch coordinate and the target circle center coordinate of the required gesture of the wafer placed in the target transfer box in the preset reference coordinate system.
Specifically, referring to fig. 6, fig. 6 is a schematic diagram of coordinate mapping according to a second embodiment of the data processing method of the present invention; the coordinate system in fig. 6 is a preset reference coordinate system. In fig. 6, the current center coordinate and the target center coordinate are both coincident with the origin of the coordinate system, where 03 is used to characterize the wafer, 033 is used to characterize the current notch coordinate, 034 is used to characterize the target notch coordinate, 031 is used to characterize the included angle between the target notch coordinate and the current notch coordinate when the current center coordinate and the target center coordinate are coincident and at the origin in the preset reference coordinate system.
Step S302: and determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction.
Specifically, referring to fig. 6, the determining the rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target center coordinate may be determining the rotation information of the wafer according to an included angle formed by the current notch coordinate and the target notch coordinate with respect to the target center coordinate, referring to fig. 6, assuming that the included angle 031 in fig. 6 is 50 degrees, the rotation information in fig. 6 may be rotating the wafer clockwise by 50 degrees or counterclockwise by 310 degrees. The rotation angle may include a rotation angle value, and the rotation direction may be clockwise or counterclockwise, or the like, which may represent description information of the rotation direction.
Step S303: and generating a control instruction according to the rotation angle and the rotation direction.
Specifically, the generating the control instruction according to the rotation angle and the rotation direction may be generating a control instruction including the rotation angle and the rotation direction, so that when the control instruction is received by the rotary turntable, the attitude of the wafer may be adjusted according to the rotation angle and the rotation direction in the control instruction.
According to the embodiment, the current notch coordinate and the current circle center coordinate of the wafer in the preset reference coordinate system are determined according to the current posture information, wherein the current circle center coordinate and the target circle center coordinate coincide; determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction; and generating a control instruction according to the rotation angle and the rotation direction, so that when the control instruction is received by the rotary turntable, the posture of the wafer can be adjusted according to the rotation angle and the rotation direction in the control instruction. According to the wafer alignment device, the rotation information which needs to be adjusted when the wafer is adjusted to the required posture is determined through the target posture information and the current posture information of the wafer, so that a control instruction is generated, when the control instruction is received by the rotary turntable, the wafer can be rotationally aligned according to the rotation angle and the rotation direction in the control instruction, the wafer is not required to be placed on the alignment device for rotation alignment, the wafer is placed on the target transfer table through the mechanical arm, and the posture adjustment efficiency of the wafer is improved.
Referring to fig. 7, fig. 7 is a flowchart of a third embodiment of a data processing method according to the present invention.
Based on the above embodiments, in this embodiment, the target pose information includes a target center coordinate, and the current pose information includes a current center coordinate of the wafer in a preset reference coordinate system; the step S30 includes:
step S304: and selecting reference circle center coordinates, wherein the reference circle center coordinates comprise any one of the current circle center coordinates, target circle center coordinates or reference coordinates different from the current circle center coordinates and the target circle center coordinates.
Specifically, the embodiment is applied to the situation when the target center coordinate and the current center coordinate are not coincident, if the coordinate system corresponding to the target posture information and the current posture information is the same coordinate system, reference may be made to fig. 4, at this time, a reference center coordinate needs to be selected, and mapping is performed on the current posture of the wafer and the required posture of the wafer placed in the target transfer box according to the reference center coordinate. If the selected reference center coordinates are the origin of coordinates, reference is made to FIG. 6.
Step S305: and determining the current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate.
Specifically, since the reference circle center coordinates include any one of the current circle center coordinates, target circle center coordinates, or reference coordinates different from the current circle center coordinates and the target circle center coordinates. Therefore, when the reference circle center coordinate is the current circle center coordinate, the determining the current notch matching coordinate of the wafer according to the current gesture information based on the reference circle center coordinate may be to use the current notch coordinate in the current gesture information as the current notch matching coordinate.
When the reference circle center coordinate is the target circle center coordinate, the determining the current notch matching coordinate of the wafer according to the current gesture information based on the reference circle center coordinate may be determining the current notch matching coordinate of the wafer according to the target circle center coordinate, the current notch coordinate in the current gesture information, and the current circle center coordinate. Specifically, the position matching may be performed on the current notch coordinate according to the target circle center coordinate and the current circle center coordinate, so as to obtain a matching position corresponding to the current notch coordinate, that is, the current notch matching coordinate when the target circle center coordinate and the current circle center coordinate are overlapped.
When the reference circle center coordinate is a reference coordinate different from the current circle center coordinate and the target circle center coordinate, the determining the current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate may be determining the current notch matching coordinate of the wafer according to the reference coordinate, the current notch coordinate in the current posture information, and the current circle center coordinate. Specifically, the current notch coordinate may be subjected to position matching according to the reference coordinate and the current center coordinate, so as to obtain a matching position corresponding to the current notch coordinate, that is, a current notch matching coordinate when the reference coordinate and the current center coordinate are overlapped.
Step S306: and determining target notch matching coordinates according to the target attitude information based on the reference circle center coordinates.
Specifically, when the reference center coordinate is the target center coordinate, the determining the target notch matching coordinate according to the target pose information based on the reference center coordinate may be to use the target notch coordinate in the target pose information as the target notch matching coordinate.
When the reference circle center coordinate is the current circle center coordinate, the determining the target notch matching coordinate according to the target gesture information based on the reference circle center coordinate may be determining the target notch matching coordinate of the wafer according to the current circle center coordinate, the target notch coordinate in the target gesture information, and the target circle center coordinate. Specifically, the position matching may be performed on the target notch coordinate according to the target circle center coordinate and the current circle center coordinate, so as to obtain a matching position corresponding to the target notch coordinate, that is, a target notch matching coordinate when the target circle center coordinate and the current circle center coordinate are overlapped.
When the reference circle center coordinate is a reference coordinate different from the current circle center coordinate and the target circle center coordinate, the determining the target notch matching coordinate according to the target posture information based on the reference circle center coordinate may be determining the target notch matching coordinate of the wafer according to the reference coordinate, the target notch coordinate in the target posture information, and the target circle center coordinate. Specifically, the position matching may be performed on the target notch coordinate according to the reference coordinate and the target center coordinate, so as to obtain a matching position corresponding to the target notch coordinate, that is, a target notch matching coordinate when the reference coordinate and the target center coordinate are overlapped.
Step S307: determining rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction; and generating a control instruction according to the rotation angle and the rotation direction.
Specifically, the determining the rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate may be determining a rotation angle according to the current notch matching coordinate, an included angle between the target notch matching coordinate and the reference circle center coordinate, and determining a rotation direction according to a positional relationship between the current notch matching coordinate and the target notch matching coordinate.
The target gesture information in the embodiment comprises a target center coordinate, and the current gesture information comprises a current center coordinate of the wafer in a preset reference coordinate system; in this embodiment, a reference circle center coordinate is selected, where the reference circle center coordinate includes any one of the current circle center coordinate, a target circle center coordinate, or a reference coordinate different from the current circle center coordinate and the target circle center coordinate; determining a current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate; determining a target notch matching coordinate according to the target attitude information based on the reference circle center coordinate; determining rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction; and generating a control instruction according to the rotation angle and the rotation direction. According to the embodiment, the circle centers in the current posture and the required posture of the wafer are mapped to the reference circle centers in a mode of selecting the reference circle centers for coordinate matching, so that the rotation angle and the rotation direction of the wafer are obtained, and the posture adjustment efficiency of the wafer is improved.
With reference to fig. 8, fig. 8 is a block diagram showing a first embodiment of a data processing apparatus according to the present invention.
As shown in fig. 8, a data processing apparatus according to an embodiment of the present invention includes:
the acquisition module 10 is configured to acquire target gesture information and an image to be identified including a surface of a wafer, where the target gesture information is mapping information of a required gesture of the wafer placed in a target transfer box;
the gesture recognition module 20 is configured to perform gesture recognition on the current gesture of the wafer based on the image to be recognized, and generate current gesture information of the wafer;
a control instruction generation module 30, configured to generate a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box.
The data processing method of the embodiment is applied to wafer transfer equipment, the wafer transfer equipment comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the method comprises the following steps: acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box; based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer; generating a control instruction according to the current gesture information and the target gesture information; the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box. Compared with the prior art, the wafer transporting robot grabs the wafer from the feeding transporting box and is arranged in the wafer aligning device, the wafer is rotationally adjusted through the wafer aligning device, and the wafer transporting robot grabs the adjusted wafer and is arranged in the discharging transporting box.
Specifically, the above-described working procedure is merely illustrative, and does not limit the scope of the present invention, and in practical application, a person skilled in the art may select part or all of them according to actual needs to achieve the purpose of the embodiment, which is not limited herein.
In addition, technical details not described in detail in this embodiment may refer to the data processing method provided in any embodiment of the present invention, and are not described herein again.
Based on the above-described first embodiment of the data processing apparatus of the present invention, a second embodiment of the data processing apparatus of the present invention is proposed.
In this embodiment, the gesture recognition module 20 is further configured to recognize a notch position and a center position of the wafer based on the image to be recognized;
and mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
Further, the gesture recognition module 20 is further configured to establish an image reference coordinate system based on the image to be recognized;
and identifying the notch position and the circle center position of the wafer in the image to be identified in the image reference coordinate system.
Further, the gesture recognition module 20 is further configured to map the notch position and the center position in the image reference coordinate system to a preset reference coordinate system based on the image reference coordinate system, so as to obtain current gesture information of the notch position and the center position in the preset reference coordinate system.
Further, the control instruction generating module 30 is further configured to determine, according to the current pose information, a current notch coordinate and a current center coordinate of the wafer in the preset reference coordinate system, where the current center coordinate and the target center coordinate coincide;
determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
Further, the control instruction generating module 30 is further configured to select a reference center coordinate, where the reference center coordinate includes any one of the current center coordinate, a target center coordinate, or a reference coordinate different from the current center coordinate and the target center coordinate;
Determining a current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate;
determining a target notch matching coordinate according to the target attitude information based on the reference circle center coordinate;
determining rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
Further, the obtaining module 10 is further configured to perform defect detection and identification on the image to be identified, and generate a defect identification result;
and executing the step of carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized to generate the current gesture information of the wafer when the defect recognition result is that the defect does not exist.
Other embodiments or specific implementations of the data processing apparatus of the present invention may refer to the above method embodiments, and are not described herein.
In addition, the embodiment of the invention also provides a storage medium, wherein the storage medium stores a data processing program, and the data processing program realizes the steps of the data processing method when being executed by a processor.
In particular, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. read-only memory/random-access memory, magnetic disk, optical disk), comprising instructions for causing a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present invention.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (8)
1. A data processing method, wherein the data processing method is applied to a wafer transfer device, the wafer transfer device comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the data processing method comprises the following steps:
acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box;
based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer;
generating a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box;
The step of acquiring the image to be identified comprising the surface of the wafer comprises the following steps:
placing the wafer at a shooting position corresponding to a camera for acquiring the surface image of the wafer through the mechanical arm, and shooting an image to be identified containing the surface characteristics of the wafer by the camera;
the current gesture information comprises a circle center coordinate and a notch coordinate of the wafer in a preset reference coordinate system;
the step of generating the current posture information of the wafer by carrying out posture recognition on the current posture of the wafer based on the image to be recognized comprises the following steps:
based on the image to be identified, identifying the notch position and the circle center position of the wafer;
mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system;
the target attitude information comprises a target notch coordinate and a target center coordinate of a required attitude of the wafer placed in a target transfer box in the preset reference coordinate system;
the step of generating a control instruction according to the current gesture information and the target gesture information comprises the following steps:
Determining a current notch coordinate and a current circle center coordinate of the wafer in the preset reference coordinate system according to the current posture information, wherein the current circle center coordinate and the target circle center coordinate coincide;
determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
2. The data processing method according to claim 1, wherein the step of identifying the notch position and the center position of the wafer based on the image to be identified comprises:
establishing an image reference coordinate system based on the image to be identified;
and identifying the notch position and the circle center position of the wafer in the image to be identified in the image reference coordinate system.
3. The data processing method according to claim 2, wherein the step of mapping the notch position and the center position into a preset reference coordinate system to obtain current posture information of the notch position and the center position in the preset reference coordinate system includes:
And mapping the notch position and the circle center position in the image reference coordinate system into a preset reference coordinate system based on the image reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system.
4. A data processing method, wherein the data processing method is applied to a wafer transfer device, the wafer transfer device comprises a mechanical arm, a rotary turntable is integrated on the mechanical arm, and the data processing method comprises the following steps:
acquiring target attitude information and an image to be identified containing the surface of a wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box;
based on the image to be recognized, carrying out gesture recognition on the current gesture of the wafer to generate current gesture information of the wafer;
generating a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box;
The step of acquiring the image to be identified comprising the surface of the wafer comprises the following steps:
placing the wafer at a shooting position corresponding to a camera for acquiring the surface image of the wafer through the mechanical arm, and shooting an image to be identified containing the surface characteristics of the wafer by the camera;
the current gesture information comprises a circle center coordinate and a notch coordinate of the wafer in a preset reference coordinate system;
the step of generating the current posture information of the wafer by carrying out posture recognition on the current posture of the wafer based on the image to be recognized comprises the following steps:
based on the image to be identified, identifying the notch position and the circle center position of the wafer;
mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system;
the target attitude information comprises a target notch coordinate and a target center coordinate of a required attitude of the wafer placed in a target transfer box in the preset reference coordinate system;
the target attitude information comprises a target center coordinate, and the current attitude information comprises a current center coordinate of the wafer in a preset reference coordinate system;
The step of generating a control instruction according to the current gesture information and the target gesture information comprises the following steps:
selecting reference circle center coordinates, wherein the reference circle center coordinates comprise any one of the current circle center coordinates, target circle center coordinates or reference coordinates different from the current circle center coordinates and the target circle center coordinates;
determining a current notch matching coordinate of the wafer according to the current posture information based on the reference circle center coordinate;
determining a target notch matching coordinate according to the target attitude information based on the reference circle center coordinate;
determining rotation information of the wafer according to the current notch matching coordinate, the target notch matching coordinate and the reference circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
5. The method for processing data according to any one of claims 1 to 4, wherein, before the step of generating the current posture information of the wafer, performing posture recognition on the current posture of the wafer based on the image to be recognized, further comprises:
performing defect detection and identification on the image to be identified to generate a defect identification result;
And executing the step of carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized to generate the current gesture information of the wafer when the defect recognition result is that the defect does not exist.
6. A data processing apparatus, characterized in that the data processing apparatus is applied to the data processing method of any one of claims 1 to 3, the data processing apparatus comprising:
the acquisition module is used for acquiring target attitude information and an image to be identified containing the surface of the wafer, wherein the target attitude information is mapping information of a required attitude of the wafer placed in a target transfer box;
the gesture recognition module is used for carrying out gesture recognition on the current gesture of the wafer based on the image to be recognized, and generating current gesture information of the wafer;
the control instruction generation module is used for generating a control instruction according to the current gesture information and the target gesture information;
the control instruction is used for controlling the rotary turntable to rotate the wafer to a target posture and controlling the mechanical arm to transfer the rotated wafer to the target transfer box;
the acquisition module is further used for placing the wafer at a shooting position corresponding to a camera for acquiring the surface image of the wafer through the mechanical arm, and shooting an image to be identified containing the surface characteristics of the wafer through the camera;
The current gesture information comprises a circle center coordinate and a notch coordinate of the wafer in a preset reference coordinate system;
the gesture recognition module is used for recognizing the notch position and the circle center position of the wafer based on the image to be recognized;
mapping the notch position and the circle center position into a preset reference coordinate system to obtain current posture information of the notch position and the circle center position in the preset reference coordinate system;
the target attitude information comprises a target notch coordinate and a target center coordinate of a required attitude of the wafer placed in a target transfer box in the preset reference coordinate system;
the control instruction generation module is used for determining a current notch coordinate and a current circle center coordinate of the wafer in the preset reference coordinate system according to the current gesture information, wherein the current circle center coordinate and the target circle center coordinate coincide;
determining rotation information of the wafer according to the current notch coordinate, the target notch coordinate and the target circle center coordinate, wherein the rotation information comprises a rotation angle and a rotation direction;
and generating a control instruction according to the rotation angle and the rotation direction.
7. A data processing apparatus, the apparatus comprising: a memory, a processor and a data processing program stored on the memory and executable on the processor, the data processing program being configured to implement the steps of the data processing method of any one of claims 1 to 5.
8. A storage medium having stored thereon a data processing program which, when executed by a processor, implements the steps of the data processing method according to any one of claims 1 to 5.
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