WO2023032962A1 - Dispositif de dessin direct et son procédé de commande - Google Patents

Dispositif de dessin direct et son procédé de commande Download PDF

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Publication number
WO2023032962A1
WO2023032962A1 PCT/JP2022/032547 JP2022032547W WO2023032962A1 WO 2023032962 A1 WO2023032962 A1 WO 2023032962A1 JP 2022032547 W JP2022032547 W JP 2022032547W WO 2023032962 A1 WO2023032962 A1 WO 2023032962A1
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WO
WIPO (PCT)
Prior art keywords
pattern
direct
substrate
error data
writing
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Application number
PCT/JP2022/032547
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English (en)
Japanese (ja)
Inventor
健 三宅
▲徳▼ 李
Original Assignee
サンエー技研株式会社
株式会社Eoric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サンエー技研株式会社, 株式会社Eoric filed Critical サンエー技研株式会社
Priority to JP2023545591A priority Critical patent/JPWO2023032962A1/ja
Priority to KR1020247010318A priority patent/KR20240055034A/ko
Priority to CN202280058943.2A priority patent/CN117882014A/zh
Publication of WO2023032962A1 publication Critical patent/WO2023032962A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Definitions

  • the present invention relates to a direct drawing device and its control method.
  • via processing devices and direct writing devices each have their own processing and drawing errors. Therefore, when vias C are formed in a substrate by a via processing apparatus in the arrangement shown by dots in FIG. 5A, processing errors actually occur as shown in FIG. 5B. Similarly, even if the direct writing apparatus writes on the substrate in the arrangement shown in FIG. 5A, the actually written pattern D has writing errors as shown in FIG. put away. Therefore, the position of the via C formed by the via processing apparatus and the pattern D drawn by the direct writing apparatus have a large positional relationship between the via C and the portion of the pattern D corresponding to the via C, as shown in FIG. There is a risk that an error will occur and that the via C and the drawing position of the pattern D corresponding to this via C will not match.
  • the pattern writing position is corrected based on error data corresponding to the processing accuracy of the processing apparatus.
  • the error data may be generated by measuring a measurement substrate processed by the processing apparatus.
  • the error data may be generated by measuring the substrate prior to pattern writing.
  • the correction amount of the pattern drawing position may be adjusted according to the number of remaining layers up to the final layer.
  • the pattern drawing position correction amount may be adjusted so that the pattern layer closer to the final layer approaches the design value.
  • the error data may include via position information corresponding to positions where vias are formed, and the pattern drawing positions may be adjusted based on the via position information.
  • the present invention provides a method of controlling a direct writing apparatus for writing a pattern on a substrate processed by a processing apparatus in a previous process, wherein error data corresponding to the processing accuracy of the processing apparatus is read, and based on the error data. and correcting the drawing position of the pattern.
  • the error data may be generated by measuring a measurement substrate processed by the processing apparatus.
  • the error data may be generated by measuring the substrate prior to pattern writing.
  • the correction amount of the pattern drawing position may be adjusted according to the number of remaining layers up to the final layer.
  • the pattern drawing position correction amount may be adjusted so that the pattern layer closer to the final layer approaches the design value.
  • the error data may include via position information corresponding to positions where vias are formed, and the pattern drawing positions may be adjusted based on the via position information.
  • FIG. 1 shows a perspective view of a direct writing apparatus according to a first embodiment of the present invention
  • FIG. 4 schematically shows how the direct writing apparatus corrects the pattern writing position.
  • 4 schematically shows how the pattern drawing position is corrected according to the number of remaining pattern layers to be laminated.
  • FIG. 8 schematically shows how the direct writing apparatus according to the second embodiment of the present invention corrects the pattern writing position.
  • 4 schematically shows how a pattern is drawn according to a conventional technique
  • 2 schematically shows the result of drawing a pattern according to the conventional technique;
  • FIG. 1 shows a perspective view of a direct drawing apparatus according to a first embodiment of the present invention.
  • the direct drawing apparatus 1 includes a pedestal 2, a bed 3, a drawing head 4, a pair of drawing stages 5A and 5B, and a pair of substrate measurement system cameras 6A and 6B.
  • the bed 3 extends in the arrow A direction and the arrow B direction on the pedestal 2.
  • a drawing head 4 Arranged on the bed 3 are a drawing head 4, a pair of drawing stages 5A and 5B, and a pair of substrate measurement system cameras 6A and 6B.
  • a drawing stage 5A on which the substrate 10A is mounted and a substrate measurement system camera 6A are arranged on the arrow A direction side of the drawing head 4 arranged in the center of the bed 3, and on the arrow B direction side of the drawing head 4.
  • a drawing stage 5B on which a substrate 10B is placed and a substrate measurement system camera 6B are arranged.
  • the drawing head 4 has a drawing head coordinate system for drawing patterns of conductive portions on the substrates 10A and 10B, and the substrate measurement system camera 6 has a substrate position detection coordinate system for detecting the position of the substrate 10. ing.
  • the drawing head 4 is provided so as to be reciprocally movable not only in the main scanning direction, ie, the directions of arrows A and B, but also in the sub-scanning direction, which is perpendicular to the directions of arrows A and B.
  • the direct drawing apparatus 1 places one substrate 10A, 10B on each of the two drawing stages 5A, 5B, and draws patterns on the two substrates 10A, 10B.
  • one drawing stage may be provided to draw a pattern on one substrate.
  • the drawing stages 5A and 5B are mounted on a carriage 7A or a carriage 7B, respectively, and the drawing stages 5A and 5B and the substrate measurement system cameras 6A and 6B are provided so as to be reciprocally movable in the directions of arrows A and B, respectively. ing.
  • the substrate measurement system cameras 6A and 6B are provided so as to be reciprocally movable not only in the directions of the arrows A and B, but also in directions perpendicular to the directions of the arrows A and B. It is
  • FIG. 2 schematically shows how the direct writing apparatus corrects the pattern writing position.
  • FIG. 2(a) shows a state in which the pattern writing position is not corrected, viewed from a direction perpendicular to the substrate surface
  • FIG. 2(b) shows a state in which the pattern writing position is corrected on the substrate surface. It shows how it looks from the vertical direction.
  • a multilayer substrate in which a plurality of pattern layers are laminated is provided so that different pattern layers are electrically connected to each other through vias, which are through holes.
  • vias are formed in the insulating layers between the pattern layers of the substrates 10A and 10B using a laser or the like by a via processing device (not shown) in the preceding process. Form.
  • a photosensitive material was applied to the pattern drawing surfaces of the substrates 10A and 10B, and the patterns were drawn by the direct drawing device 1 and developed.
  • the patterns drawn on the substrates 10A and 10B are electrically connected through vias after the processes of copper plating, peeling of the photosensitive material, and etching are performed later.
  • vias C formed on the same substrates 10A and 10B by the via processing device are illustrated by black dots, and patterns D drawn by the direct drawing device 1 at positions corresponding to the respective vias C are illustrated by white dots. indicated by dots.
  • the vias C processed by the via processing device are shifted in the vertical and horizontal directions due to errors caused by the processing accuracy of the via processing device.
  • an error occurs due to the drawing precision of the direct drawing device 1, so the drawing is performed in a state of being shifted in the vertical and horizontal directions.
  • the direct writing apparatus 1 is equipped with a storage unit (not shown), reads out error data corresponding to the processing accuracy of the via processing apparatus from the storage unit, and creates a pattern D based on the read error data.
  • the drawing position can be corrected.
  • the error data includes via position information corresponding to the position where the via C is formed, and this via position information allows the via position deviation that occurs when the via processing apparatus forms the via C to be known. .
  • the direct drawing apparatus 1 determines the drawing position of the pattern D corresponding to the via C as shown in FIG. Correction is made so as to approach the position of the via C.
  • FIG. As a result, the direct drawing apparatus 1 can draw the pattern D indicated by white dots so that the drawing position of the pattern overlaps with high accuracy the position of the via C indicated by the black dots formed by the via processing apparatus. .
  • the error data is generated by measuring the substrates 10A and 10B on which the vias C are formed by the via processing device, using the substrate measurement system cameras 6A and 6B.
  • the error data is stored in the storage unit after actually measuring the substrates 10A and 10B using the substrate measurement system cameras 6A and 6B.
  • the amount of deviation of the via C included in the error data is directly used as the correction value.
  • y) ( ⁇ 0.004, 0.002)
  • the value of this error is directly reflected in drawing by the drawing device 1 as a correction value. That is, the drawing position of the corresponding portion of the pattern D drawn by the direct writing device 1 is corrected, offset by -0.004 in the x direction and offset by 0.002 in the y direction.
  • FIG. 3 schematically shows how the pattern drawing position is corrected according to the number of remaining pattern layers to be laminated.
  • FIG. 3(a) schematically shows the pattern of the lower layers of the multilayer substrate
  • FIG. 3(b) schematically shows the pattern of the last layer of the multilayer substrate.
  • the direct drawing apparatus 1 When the substrates 10A and 10B are multilayer substrates in which a plurality of pattern layers are laminated, the direct drawing apparatus 1 generates error data according to the remaining number of pattern layers to be laminated up to the final layer of the completed multilayer substrate. , the degree of correction of the pattern drawing position can be adjusted. As a result, as shown in FIG. 3A, the pattern D of the lower layer of the multilayer substrate is drawn in a state of being shifted in the vertical and horizontal directions as a result of drawing in accordance with the formed via C. Even in this case, as shown in FIG. 3B, the pattern D can be drawn in the final layer after correction so that the pattern D is aligned in the vertical and horizontal directions.
  • another pattern D further laminated on the pattern D in the lower layer of the multilayer substrate is corrected step by step for each pattern layer toward the final layer.
  • the final layer has a pattern D as shown in FIG. 3(b). That is, the direct drawing apparatus 1 adjusts the correction amount of the drawing position of the pattern D so that the pattern layer closer to the final layer approaches the design value. For example, if the remaining number of processed layers, that is, the remaining number of pattern layers to be laminated from now on is n, and the accuracy difference is d, the correction amount for each pattern layer to be laminated from now on is d/n.
  • the drawing position of the pattern D after correction is obtained by multiplying the coordinates of the portions other than the portions where the vias C are formed, such as the intermediate portions of the points, by the correction coefficients that are linear function complements.
  • the direct writing apparatus 1 corrects the writing position of the pattern D based on error data corresponding to the processing accuracy of the via processing apparatus. As a result, even if the position of the via C formed by the via processing device is shifted, the drawing position of the pattern D can be brought closer to the position of the via C actually formed by the via processing device. Therefore, the direct drawing apparatus 1 can improve the interlayer overlay accuracy.
  • FIG. 4 schematically shows how the direct writing apparatus according to the second embodiment of the present invention corrects the pattern writing position.
  • FIG. 4(a) shows a substrate processed by a via processing device
  • FIG. 4(b) shows a substrate on which a pattern is drawn by a direct drawing device.
  • FIG. 4(a) shows a substrate processed by a via processing device
  • FIG. 4(b) shows a substrate on which a pattern is drawn by a direct drawing device.
  • portions different from the first embodiment will be explained, and the same reference numerals are used for substantially the same configurations as in the first embodiment in the drawing.
  • the direct drawing apparatus 1 acquires error data using a gauge substrate (measurement substrate) 10C used only for error measurement before starting writing on the substrates 10A and 10B used for actual products. generated in advance.
  • the gauge substrate 10C is processed by the same via processing apparatus as that for processing the substrates 10A and 10B, which are actual products.
  • the direct drawing apparatus 1 measures the gauge substrate 10C on which the vias C are formed by the via processing apparatus, using the substrate measurement system cameras 6A and 6B. As a result, via position data based on the position information of the vias C is generated for the gauge substrate 10C processed by the via processing apparatus.
  • the direct drawing device 1 prepares another gauge substrate (measurement substrate) on which the via C is not formed, as shown in FIG. 4(b).
  • the pattern D is drawn on 10D, and the drawn pattern D is measured using the substrate measurement system cameras 6A and 6B.
  • the pattern position data based on the position information of the pattern D is generated for the gauge substrate 10D on which the pattern D is drawn by the direct writing device 1.
  • the direct drawing device 1 compares the via position data and the pattern position data, and determines the positions of the vias C formed in the gauge substrate 10C and the positions of the vias C. Error data is generated based on the difference from the position of the pattern D formed on the corresponding gauge substrate 10D, and stored in the storage unit.
  • the direct drawing apparatus 1 generates error data for the entire surfaces of the gauge substrates 10C and 10D. For example, when correcting the position of a small area as shown in FIG. is read from the error data, and the position for writing the pattern D is corrected.
  • the direct drawing apparatus 1 generates error data in advance by measuring the gauge substrates 10C and 10D that are used only for measurement. This eliminates the need to measure the substrates 10A and 10B, which are actual products, each time the pattern D is drawn on the substrates 10A and 10B, thereby shortening the time required to manufacture the product.
  • via position data and pattern position data are measured using separate gauge substrates, but they may be measured using the same gauge substrate.
  • error data is generated based on via position data and pattern position data, but the present invention is not limited to this. If the direct drawing device 1 can correct the position of the pattern D according to the position of the via C formed by the via processing device, the error data may be generated based only on the via position data.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'objectif de la présente invention est de fournir un dispositif de dessin direct et un procédé de commande du dispositif de dessin direct, chacun d'eux permettant d'améliorer la précision de la superposition de couches intermédiaires.　L'invention concerne un dispositif de dessin direct qui dessine un motif sur un substrat qui a été traité par un dispositif de traitement dans une étape précédente, la position au niveau de laquelle le motif est dessiné étant corrigée sur la base de données d'erreur correspondant à la précision de traitement du dispositif de traitement.
PCT/JP2022/032547 2021-09-03 2022-08-30 Dispositif de dessin direct et son procédé de commande WO2023032962A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023545591A JPWO2023032962A1 (fr) 2021-09-03 2022-08-30
KR1020247010318A KR20240055034A (ko) 2021-09-03 2022-08-30 직접 묘화 장치 및 그 제어 방법
CN202280058943.2A CN117882014A (zh) 2021-09-03 2022-08-30 直接描绘装置及其控制方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021143710 2021-09-03
JP2021-143710 2021-09-03

Publications (1)

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WO2023032962A1 true WO2023032962A1 (fr) 2023-03-09

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PCT/JP2022/032547 WO2023032962A1 (fr) 2021-09-03 2022-08-30 Dispositif de dessin direct et son procédé de commande

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JP (1) JPWO2023032962A1 (fr)
KR (1) KR20240055034A (fr)
CN (1) CN117882014A (fr)
TW (1) TW202319841A (fr)
WO (1) WO2023032962A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311145A (ja) * 2004-04-23 2005-11-04 Canon Inc 露光装置、露光方法、デバイス製造方法、パターン形成装置および位置合わせ方法
JP2007220937A (ja) * 2006-02-17 2007-08-30 Toppan Printing Co Ltd 基板の重ね描画方法
JP2011158718A (ja) * 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2011237781A (ja) * 2010-05-06 2011-11-24 Samsung Electronics Co Ltd マスクレス露光装置とマスクレス露光でのオーバーレイのための整列方法
JP2014066870A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp パターン形成方法及び装置、露光装置並びに表示用パネル製造方法
JP2019061089A (ja) * 2017-09-27 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311145A (ja) * 2004-04-23 2005-11-04 Canon Inc 露光装置、露光方法、デバイス製造方法、パターン形成装置および位置合わせ方法
JP2007220937A (ja) * 2006-02-17 2007-08-30 Toppan Printing Co Ltd 基板の重ね描画方法
JP2011158718A (ja) * 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2011237781A (ja) * 2010-05-06 2011-11-24 Samsung Electronics Co Ltd マスクレス露光装置とマスクレス露光でのオーバーレイのための整列方法
JP2014066870A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp パターン形成方法及び装置、露光装置並びに表示用パネル製造方法
JP2019061089A (ja) * 2017-09-27 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

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TW202319841A (zh) 2023-05-16
KR20240055034A (ko) 2024-04-26
JPWO2023032962A1 (fr) 2023-03-09
CN117882014A (zh) 2024-04-12

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