WO2023032724A1 - Composition de revêtement isolant à faible constante diélectrique, produit durci de celle-ci et dispositif d'affichage - Google Patents
Composition de revêtement isolant à faible constante diélectrique, produit durci de celle-ci et dispositif d'affichage Download PDFInfo
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- WO2023032724A1 WO2023032724A1 PCT/JP2022/031482 JP2022031482W WO2023032724A1 WO 2023032724 A1 WO2023032724 A1 WO 2023032724A1 JP 2022031482 W JP2022031482 W JP 2022031482W WO 2023032724 A1 WO2023032724 A1 WO 2023032724A1
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- Prior art keywords
- dielectric constant
- insulating coating
- coating composition
- component
- low dielectric
- Prior art date
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- 239000008199 coating composition Substances 0.000 title claims abstract description 31
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 31
- 239000000047 product Substances 0.000 claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- -1 polycyclic hydrocarbon Chemical class 0.000 claims abstract description 25
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 17
- 238000007259 addition reaction Methods 0.000 claims abstract description 15
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 13
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 12
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims abstract description 7
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 32
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 claims description 22
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 6
- PUNGSQUVTIDKNU-UHFFFAOYSA-N 2,4,6,8,10-pentamethyl-1,3,5,7,9,2$l^{3},4$l^{3},6$l^{3},8$l^{3},10$l^{3}-pentaoxapentasilecane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O[Si](C)O1 PUNGSQUVTIDKNU-UHFFFAOYSA-N 0.000 claims description 5
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003054 catalyst Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 125000003342 alkenyl group Chemical group 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 7
- 230000003078 antioxidant effect Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 6
- HGPDWMTUQRNTQT-UHFFFAOYSA-N 2,4,6,8,10-pentamethyl-1,3,5,7,9,2,4,6,8,10-pentaoxapentasilecane Chemical group C[SiH]1O[SiH](C)O[SiH](C)O[SiH](C)O[SiH](C)O1 HGPDWMTUQRNTQT-UHFFFAOYSA-N 0.000 description 5
- BQYPERTZJDZBIR-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical group C[SiH]1O[SiH](C)O[SiH](C)O[SiH](C)O1 BQYPERTZJDZBIR-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 125000003367 polycyclic group Chemical group 0.000 description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000005024 alkenyl aryl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- UHXCHUWSQRLZJS-UHFFFAOYSA-N (4-dimethylsilylidenecyclohexa-2,5-dien-1-ylidene)-dimethylsilane Chemical compound C[Si](C)C1=CC=C([Si](C)C)C=C1 UHXCHUWSQRLZJS-UHFFFAOYSA-N 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- NWNPESVXYXCGLH-UHFFFAOYSA-N 4-ethenylbicyclo[2.2.1]hept-2-ene Chemical class C1CC2C=CC1(C=C)C2 NWNPESVXYXCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- OQJPAHYVGNJBJK-UHFFFAOYSA-N (3-dimethylsilylphenyl)-dimethylsilane Chemical compound C[SiH](C)C1=CC=CC([SiH](C)C)=C1 OQJPAHYVGNJBJK-UHFFFAOYSA-N 0.000 description 1
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- OTTZHAVKAVGASB-UHFFFAOYSA-N 2-heptene Natural products CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- MUUXBTFQEXVEEI-UHFFFAOYSA-N [2-(dimethyl-$l^{3}-silanyl)phenyl]-dimethylsilicon Chemical compound C[Si](C)C1=CC=CC=C1[Si](C)C MUUXBTFQEXVEEI-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- LJKNRSBEKUSSIE-UHFFFAOYSA-N hept-2-ene Chemical compound [CH2]CCCC=CC LJKNRSBEKUSSIE-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- ZPNJBTBYIHBSIG-UHFFFAOYSA-N phenyl-(2,2,6,6-tetramethylpiperidin-4-yl)methanone Chemical compound C1C(C)(C)NC(C)(C)CC1C(=O)C1=CC=CC=C1 ZPNJBTBYIHBSIG-UHFFFAOYSA-N 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
- H01B3/22—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils hydrocarbons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
Definitions
- the present invention relates to a low dielectric constant insulating coating composition, a cured product thereof, and a display device.
- Patent Document 1 a polycyclic hydrocarbon skeleton-containing compound having two addition-reactive carbon-carbon double bonds in one molecule and three or more silicon-bonded hydrogen atoms in one molecule. and a hydrosilylation catalyst as essential components.
- the present invention aims to provide a low dielectric constant insulating coating composition which has a low dielectric constant and a low dielectric loss tangent in a cured product obtained by curing, and has excellent workability when applied to a substrate. aim.
- the present inventors have conducted intensive studies to achieve the above object, and have found that a curable silicone composition containing a specific component containing a polycyclic hydrocarbon skeleton has excellent workability and a low dielectric constant.
- the present invention was completed by discovering that a cured product having a low dielectric constant and a low dielectric loss tangent can be obtained. That is, the present invention provides a low dielectric constant insulating coating composition, a cured product thereof, and a display device as described below.
- R is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms.
- a compound having two silicon-bonded hydrogen atoms in one molecule represented by (b) an addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and an addition-reactive carbon-carbon double bond in one molecule; an addition reaction product having at least two in A low dielectric constant insulating coating composition comprising (B) a compound having 3 or more silicon-bonded hydrogen atoms in one molecule and (C) a hydrosilylation reaction catalyst.
- the polycyclic hydrocarbon of (b) is 5-vinylbicyclo[2.2.1]hept-2-ene, 6-vinylbicyclo[2.2.1]hept-2-ene, or a combination of the two.
- the low dielectric constant insulating coating composition according to [1].
- the component (B) contains 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, or a mixture of both [1] or [2 ].
- the component (B) is 5-vinylbicyclo[2.2.1]hept-2-ene, 6-vinylbicyclo[2.2.1]hept-2-ene or a mixture of both; including addition reaction products with 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, or mixtures of both [1]-[3]
- the low dielectric constant insulating coating composition according to any one of .
- [5] A cured product of the low dielectric constant insulating coating composition according to any one of [1] to [4].
- the low dielectric constant insulating coating composition of the present invention has a viscosity suitable for coating on a substrate, is excellent in workability, and the obtained cured product has a low dielectric constant and a low dielectric loss tangent. It is useful as a coating material for electronic and electrical devices with low transmission loss in the high frequency range.
- the component is (a) the following general formula (1):
- R is independently an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms or an alkoxy group having 1 to 6 carbon atoms.
- a compound having two silicon-bonded hydrogen atoms in one molecule represented by (b) an addition reaction product with a polycyclic hydrocarbon having two addition-reactive carbon-carbon double bonds in one molecule, and an addition-reactive carbon-carbon double bond in one molecule; is an addition reaction product having at least two in
- ⁇ (a) component> (a) A compound having two silicon-bonded hydrogen atoms (hereinafter sometimes referred to as "SiH") represented by the above general formula (1) in one molecule is a reaction raw material for component (A). .
- SiH silicon-bonded hydrogen atoms
- R is the above monovalent hydrocarbon group, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert-butyl group, pentyl group, isopentyl group, hexyl Alkyl groups such as group, sec-hexyl group; Cycloalkyl groups such as cyclopentyl group and cyclohexyl group; Aryl groups such as phenyl group and o-, m-, p-tolyl group; Aralkyl groups such as benzyl group and 2-phenylethyl group groups; alkenyl groups such as vinyl group, allyl group, 1-butenyl group and 1-hexenyl group; alkenylaryl groups such as p-vinylphenyl group; and one or more hydrogen atoms bonded to carbon atoms in these groups is substituted with a halogen atom, a cyano group, an epoxy
- R is the alkoxy group
- examples of the case where R is the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a sec-butoxy group, and a tert-butoxy group.
- the above R is preferably a group other than an alkenyl group and an alkenylaryl group, and in particular, the component (a) in which all of the Rs are methyl groups is easy to industrially produce. is preferred due to its availability.
- addition-reactive means It means the ability to undergo the addition of a hydrogen atom (known as a hydrosilylation reaction).
- the component (b) is (i) those in which an addition-reactive carbon-carbon double bond is formed between two adjacent carbon atoms among the carbon atoms forming the polycyclic skeleton of the polycyclic hydrocarbon; (ii) hydrogen atoms bonded to carbon atoms forming the polycyclic skeleton of the polycyclic hydrocarbon are replaced by addition-reactive carbon-carbon double bond-containing groups, or (iii) of the carbon atoms forming the polycyclic skeleton of the polycyclic hydrocarbon, an addition-reactive carbon-carbon double bond is formed between two adjacent carbon atoms, and the polycyclic Any hydrogen atom bonded to a carbon atom forming the hydrocarbon polycyclic skeleton may be replaced by an addition-reactive carbon-carbon double bond-containing group.
- Structural formula (x) below: 5-vinylbicyclo[2.2.1]hept-2-ene represented by Structural formula (y) below: 6-vinylbicyclo[2.2.1]hept-2-ene represented by Combinations of both are included. (Hereinafter, when there is no need to distinguish between these three substances, they may be collectively referred to as "vinylnorbornene.")
- the substitution position of the vinyl group of the vinylnorbornene may be either cis configuration (exo type) or trans configuration (endo type). Since there is no difference between the two configurations, a combination of isomers of both configurations may be used.
- Component (A) is the above component (b) having two addition-reactive carbon-carbon double bonds in one molecule, per 1 mol of the component (a) having two SiH in one molecule.
- the (A) component thus obtained is derived from the component (a) in addition to the addition-reactive carbon-carbon double bond derived from the component (b) (specifically, R in the general formula (1) can contain addition-reactive carbon-carbon double bonds (derived from There are two. If there are too many addition-reactive carbon-carbon double bonds, the cured product obtained by curing the composition of the present invention tends to crack.
- hydrosilylation reaction catalyst all conventionally known catalysts can be used.
- platinum group metal catalysts such as palladium catalysts and rhodium catalysts.
- the addition reaction conditions, the use of solvents, etc. are not particularly limited, and may be as usual.
- component (A) As described above, in the preparation of component (A), an excess molar amount of component (b) is used with respect to component (a), so component (A) is derived from the structure of component (b). It has two addition-reactive carbon-carbon double bonds in one molecule. Furthermore, component (A) has a residue derived from component (a) above, which residue is derived from the structure of component (b) above but does not have an addition-reactive carbon-carbon double bond. It may also include structures joined by divalent residues of polycyclic hydrocarbons.
- component (A) for example, the following general formula (4): YX-(Y'-X) p -Y (4) (Wherein, X is the divalent residue of the compound of component (a) above, Y is the monovalent residue of the polycyclic hydrocarbon of component (b) above, and Y′ is the residue of the above (b ) is a divalent residue of the component and p is an integer from 0 to 10, preferably from 0 to 5)
- X is the divalent residue of the compound of component (a) above
- Y is the monovalent residue of the polycyclic hydrocarbon of component (b) above
- Y′ is the residue of the above (b ) is a divalent residue of the component
- p is an integer from 0 to 10, preferably from 0 to 5
- the value of p which is the number of repeating units represented by (Y'-X), can be adjusted by adjusting the excess molar amount of the component (b) to be reacted with respect to 1 mol of the component (a). can be set by
- Y in the general formula (4) includes, for example, the following structural formula: (hereinafter, if it is not necessary to distinguish between these six groups, they are collectively referred to as "NB groups", and the six types of structures are referred to as “NB” without distinguishing may be abbreviated).
- Y′ in the general formula (4) include the following structural formula: A bivalent residue represented by is included.
- the asymmetric divalent residue represented by the above structural formula is not limited to the left-right direction as described above, and the above structural formula substantially represents each of the above structures on paper. It also shows the structure rotated 180 degrees.
- Suitable specific examples of the component (A) represented by the general formula (4) are shown below, but are not limited thereto. (The meaning of "NB” is as described above, and “Me” in the formula represents a methyl group (the same applies hereinafter).)
- the (A) component of the present invention can be used singly or in combination of two or more.
- the component (B) is a compound having 3 or more SiH in one molecule.
- the SiH in the component (B) is added to the addition-reactive carbon-carbon double bond that the component (A) has at least two in one molecule by a hydrosilylation reaction to form a cured product with a three-dimensional network structure. give.
- the (B) component is, for example, the following general formula (5):
- R 1 is independently a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group, having 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms, and q is 3 to 10 , preferably an integer of 3 to 8, r is an integer of 0 to 7, preferably 0 to 2, and the sum of q + r is an integer of 3 to 10, preferably 3 to 6)
- a cyclic siloxane compound represented by is mentioned.
- R 1 in the general formula (5) is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group
- R 1 in the general formula (5) is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group
- R 1 in the general formula (5) is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group
- R 1 in the general formula (5) is an unsubstituted or substituted monovalent hydrocarbon group other than an alkenyl group
- R 1 in the general formula (5) examples include methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert- Alkyl groups such as butyl group, pentyl group, isopentyl group, hexyl group and sec-hexyl group; Cycloalkyl groups such as cyclopentyl group and cyclohexyl group; Aryl groups such as phenyl group and
- R 1 is preferably a methyl group, and in particular, component (B) in which all R 1 are methyl groups is easy to industrially produce and readily available.
- component (B) for example, one or two of the above vinylnorbornenes and 1,3,5,7-tetramethylcyclotetrasiloxane are hydrosilylated to obtain SiH in one molecule.
- the component (B) can be used singly or in combination of two or more.
- the composition of the present invention contains a component having hydrogen atoms bonded to silicon atoms other than component (B) and/or an addition-reactive carbon-carbon dihydrogen atom bonded to silicon atoms other than component (A).
- a component with a double bond can be included. Therefore, the amount of hydrogen atoms bonded to silicon atoms in the present composition per mol of addition-reactive carbon-carbon double bonds bonded to silicon atoms in the present composition is usually 0.5 to 3.0. mol, preferably 0.8 to 2.0 mol.
- the amount of component (B) to be added to the low dielectric constant insulating coating composition of the present invention is the addition reactive carbon-carbon double bond in component (A).
- the amount of SiH in component (B) is generally 0.5 to 3.0 mol, preferably 0.8 to 2.0 mol, per 1 mol.
- the hydrosilylation reaction catalyst which is the component (C) of the present invention is the same as described in ⁇ Preparation of the component (A)> above.
- the amount of component (C) is not particularly limited as long as it is an effective amount as a catalyst. It is preferable to add an amount of about 1 to 500 ppm, particularly about 2 to 100 ppm. By setting the blending amount within the above range, the time required for the curing reaction becomes appropriate, and problems such as coloring of the cured product do not occur.
- the low dielectric constant insulating coating composition of the present invention may optionally contain other components within a range that does not impair the objects and effects of the present invention.
- the addition-reactive carbon-carbon double bond in the component (A) may remain unreacted.
- antioxidant all conventionally known ones can be used.
- the amount to be blended is not particularly limited as long as it is an effective amount as an antioxidant. , usually 10 to 10,000 ppm, preferably 100 to 1,000 ppm. By setting the blending amount within the above range, the antioxidant ability is fully exhibited, and a cured product having excellent optical properties without causing coloration, white turbidity, deterioration due to oxidation, etc., can be obtained.
- ⁇ Viscosity/hardness modifier> In order to adjust the viscosity of the low dielectric constant insulating coating composition of the present invention or the hardness of the cured product obtained from the low dielectric constant insulating coating composition of the present invention, it has an alkenyl group or SiH bonded to a silicon atom.
- the blending amount thereof is such that the alkenyl groups and the above (A) SiH in the above component (B) is usually 0.5 to 3.0 mol, preferably 0.8 to 2.0 mol, per 1 mol of the total amount of addition-reactive carbon-carbon double bonds possessed by the component. It is preferable to use a molar amount.
- the blending amounts thereof are the same as the above SiH and the SiH possessed by the component (B).
- the viscosity of the low dielectric constant insulating coating composition of the present invention at 25°C is preferably 10 to 10,000 mPa ⁇ s, more preferably 30 to 3,000 mPa ⁇ s. Within such a range, workability is excellent.
- the viscosity in the present invention indicates the viscosity measured at 25°C with a rotational viscometer according to JIS K 7117-1:1999.
- addition reaction controllers such as 1-ethynylcyclohexanol and 3,5-dimethyl-1-hexyn-3-ol can be blended.
- an inorganic filler such as fumed silica may be blended to improve strength within a range that does not affect transparency, and if necessary, dyes, pigments, flame retardants, etc. may be blended. good too.
- a light stabilizer to impart resistance to photodegradation due to light energy such as sunlight.
- Hindered amine-based stabilizers that capture radicals generated by photo-oxidative deterioration are suitable as the light stabilizer, and the antioxidant effect is further improved by using them together with antioxidants.
- Specific examples of light stabilizers include bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate and 4-benzoyl-2,2,6,6-tetramethylpiperidine.
- the total amount of components (A), (B) and (C) is preferably 50 to 100% by mass, more preferably 80 to 100% by mass. Preferably, it is more preferably 90 to 100% by mass. Also, the low dielectric constant insulating coating composition of the present invention can be produced by uniformly mixing the components described above.
- the curing conditions for the low-dielectric-constant insulating coating composition of the present invention vary depending on the amount thereof, and are not particularly limited, but the conditions of 60 to 180° C. and 10 to 300 minutes are usually preferred.
- the cured product obtained by curing the low dielectric constant insulating coating composition of the present invention preferably has a dielectric constant of 3.0 or less at 10 GHz and a dielectric loss tangent of 0.01 or less. Within such a range, high-frequency dielectric properties are excellent.
- An insulating coating layer can be formed by applying the low dielectric constant insulating coating composition of the present invention to various substrates, parts, etc. directly or via another layer and curing the composition.
- the cured product obtained by curing the low dielectric constant insulating coating composition of the present invention has transparency, it is suitable for use in display devices.
- platinum-vinylsiloxane complex an amount of 20 ppm relative to the total mass of (A) and (B) as platinum metal atoms
- 1-ethynylcyclohexanol 0.03 parts by mass were uniformly mixed
- a composition having a viscosity of 50 mPa ⁇ s was obtained. This composition was poured into a metal frame with a thickness of 0.3 mm and heated at 150° C. for 2 hours to obtain a cured product.
- a methyl silicone resin-based curable composition (trade name: KER-2300, manufactured by Shin-Etsu Chemical Co., Ltd., viscosity: 5,000 mPa s) was added to 0 in the same manner as in Example 1. It was poured into a metal frame with a thickness of 0.3 mm and heated at 150° C. for 2 hours to obtain a cured product.
- compositions of Examples 1 to 3 had suitable viscosities when applied to substrates and were excellent in workability.
- the cured products obtained in Examples 1 to 3 had a relative dielectric constant of 3.0 or less at 10 GHz and a dielectric loss tangent of 0.01 or less, indicating excellent high-frequency dielectric properties.
- the methyl-based silicone resin of Comparative Example 1 had a large dielectric loss tangent and did not satisfy the high frequency characteristics.
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Abstract
La présente invention possède une composition de revêtement isolant à faible constante diélectrique, dont un produit durci possède une faible constante diélectrique relative et une faible tangente de perte diélectrique, et présentant une excellente maniabilité lorsqu'il est appliqué sur un substrat. La présente invention fournit une composition de revêtement isolant à faible constante diélectrique contenant les éléments suivants : (A) un produit de réaction d'addition d' (a) un composé de formule (1) possédant deux atomes d'hydrogène dans chaque molécule, chacun des atomes d'hydrogène étant lié à un atome de silicium, et (b) un hydrocarbure polycyclique possédant deux doubles liaisons carbone-carbone réactives à l'addition dans chaque molécule ; (B) un composé possédant trois atomes d'hydrogène ou plus dans chaque molécule, chacun des atomes d'hydrogène étant lié à un atome de silicium ; et (C) un catalyseur d'hydrosilylation. (Dans la formule (1), R représente indépendamment un groupe hydrocarbure monovalent non substitué ou substitué possédant 1 à 12 atomes de carbone, ou un groupe alcoxy possédant 1 à 6 atomes de carbone).
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JP2005133073A (ja) * | 2003-10-10 | 2005-05-26 | Shin Etsu Chem Co Ltd | 硬化性組成物 |
JP2018523737A (ja) * | 2015-08-31 | 2018-08-23 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 低温硬化組成物、それから形成された硬化膜、および前記硬化膜を有する電子装置 |
JP2020193243A (ja) * | 2019-05-24 | 2020-12-03 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、硬化物および光半導体素子 |
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JP2005133073A (ja) * | 2003-10-10 | 2005-05-26 | Shin Etsu Chem Co Ltd | 硬化性組成物 |
JP2018523737A (ja) * | 2015-08-31 | 2018-08-23 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 低温硬化組成物、それから形成された硬化膜、および前記硬化膜を有する電子装置 |
JP2020193243A (ja) * | 2019-05-24 | 2020-12-03 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、硬化物および光半導体素子 |
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