WO2023029926A1 - 一种脱胶装置和脱胶系统 - Google Patents

一种脱胶装置和脱胶系统 Download PDF

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Publication number
WO2023029926A1
WO2023029926A1 PCT/CN2022/111627 CN2022111627W WO2023029926A1 WO 2023029926 A1 WO2023029926 A1 WO 2023029926A1 CN 2022111627 W CN2022111627 W CN 2022111627W WO 2023029926 A1 WO2023029926 A1 WO 2023029926A1
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WIPO (PCT)
Prior art keywords
degumming
tank
spray
wall
solution
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Application number
PCT/CN2022/111627
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English (en)
French (fr)
Inventor
罗涛
吴世明
蒋堃
陆敏星
赵元明
李晓鹏
郑石林
杨春伟
Original Assignee
楚雄隆基硅材料有限公司
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Publication of WO2023029926A1 publication Critical patent/WO2023029926A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the utility model relates to the field of solar photovoltaic technology, in particular to a degumming device and a degumming system.
  • silicon rods In the manufacturing process of photovoltaic modules, silicon rods first need to be cut into silicon wafers, and then the silicon wafers are processed and assembled into photovoltaic modules. In the process of cutting silicon rods, it needs to go through the processes of sticking rods, slicing, degumming, cleaning and sorting in sequence. In the rod sticking process, colloid is usually used to connect the silicon rod and the crystal holder, and silicon wafers are obtained after the slicing process. In the degumming process, the silicon wafer and the crystal holder need to be placed in the degumming tank of the degumming device for degumming, so that the silicon wafer and the crystal holder are separated.
  • a soaking degumming device is usually used for degumming treatment, that is, the crystal holder and silicon rods are soaked in the degumming tank of the degumming device, and the colloid is dissolved by the degumming solution in the degumming tank to separate the crystal holder and the silicon wafer.
  • Immersion degumming needs to place more degumming solution in the degumming tank, and the loss of degumming solution is relatively large.
  • the utility model provides a degumming device and a degumming system, aiming at solving the problem of large degumming solution loss when soaking degumming is adopted.
  • the embodiment of the utility model provides a degumming device, including: a degumming tank and a spray assembly;
  • the inside of the tank body of the degumming tank is used to hang the crystal support, and accommodate the silicon wafer bonded on the side of the crystal support close to the bottom of the tank;
  • the spraying assembly is installed on the opposite inner wall of the degumming tank along the length direction of the crystal holder, and the spraying assembly is used to spray to the bonding position between the crystal holder and the silicon wafer Degumming solution.
  • the degumming device also includes a suspension bracket
  • a hooking portion is arranged on the side wall of the degumming tank, the hanging bracket is hooked on the hooking portion, and the hanging bracket is used for hanging the crystal holder.
  • an end of the suspension bracket close to the bottom of the degumming tank is provided with a receiving part, and the receiving part is used to receive the silicon wafer separated from the crystal holder.
  • the degumming device further includes a buffer member installed on a side of the receiving member away from the bottom of the degumming tank.
  • the degumming device further includes a lifting platform installed in the degumming tank for receiving the silicon wafers separated from the crystal tray.
  • the shower assembly includes a plurality of shower heads, and the plurality of shower heads are installed on two opposite inner walls at intervals along the length direction of the crystal holder.
  • the spray head is movably connected with the inner wall, so as to adjust the spray direction of the spray head and/or adjust the position of the spray head on the inner wall.
  • the spray assembly includes a spray pipe, the spray pipe surrounds the crystal holder and is installed on the inner wall of the degumming tank, and the spray pipe is spaced apart from a plurality of parts of the spray hole.
  • the spray pipe is movably connected with the inner wall of the degumming tank, so as to adjust the spraying direction of the spray hole and/or adjust the position of the spray pipe in the inner wall.
  • the embodiment of the utility model also provides a degumming system, including the degumming device as described above, and the degumming system also includes:
  • a liquid storage tank the liquid storage tank is used to store the degumming solution, and heat the degumming solution in the liquid storage tank;
  • An output pipeline one end of the output pipeline is connected to the liquid storage tank, and the other end is connected to the degumming tank, for delivering the degumming solution in the liquid storage tank to the spray assembly;
  • a recovery pipeline one end of which is connected to the liquid storage tank and the other end is connected to the degumming tank, for recovering the degumming solution in the degumming tank to the liquid storage tank.
  • the degumming device includes: a degumming tank and a spray assembly.
  • the inside of the tank body of the degumming tank is used to hang the crystal holder and accommodate the silicon wafer bonded on the side of the crystal holder near the bottom of the tank; the spray assembly is installed on the opposite inner wall of the degumming tank along the length direction of the crystal holder, spraying The assembly is used to spray the debonding solution on the bond between the crystal support and the silicon wafer.
  • the degumming solution can be sprayed on the bonding part between the crystal tray and the silicon wafer through the spray assembly.
  • the usage of the degumming solution is relatively small. Less, can reduce the loss of degumming solution.
  • Fig. 1 shows the structural representation of a kind of degumming device in the utility model embodiment
  • Fig. 2 shows a sectional view along the B direction of Fig. 1;
  • Fig. 3 shows a partial enlarged view of position A in Fig. 1;
  • Fig. 4 shows the sectional view of Fig. 2 along the C direction
  • Fig. 5 shows another cross-sectional view of Fig. 1 along the B direction
  • Fig. 6 shows the structural representation of another kind of degumming device in the utility model embodiment
  • Figure 7 shows a schematic structural view of another degumming device in the embodiment of the present invention.
  • Figure 8 shows a schematic structural view of a degumming system in an embodiment of the present invention
  • Figure 9 shows a schematic structural view of another degumming system in the embodiment of the present invention.
  • Fig. 10 shows a schematic structural diagram of another degumming system in the embodiment of the present invention.
  • Fig. 1 shows the structural representation of a kind of degumming device in the utility model embodiment
  • Fig. 2 shows the sectional view of Fig. 1 along B direction
  • degumming device comprises: degumming tank 101 and spray components.
  • the inside of the tank body of the degumming tank 101 is used to hang the crystal holder 103, and accommodate the silicon chip 104 bonded on the side of the crystal holder 101 near the bottom of the tank; the spray assembly is installed in the degumming tank 101 along the length direction of the crystal holder On the opposite inner wall, the spray assembly is used to spray the degumming solution to the bonded part between the crystal support 103 and the silicon wafer 104 .
  • the degumming tank 101 may be a rectangular tank as shown in FIG. 1 , matching the shape of the crystal holder 103 .
  • Hanging parts 105 are arranged on the opposite inner walls of the degumming tank 101.
  • the edge of the crystal holder 103 can be overlapped on the hanging parts 105, so that the crystal holder 101 is suspended in the degumming tank. 101 inside the tank body.
  • one side of the crystal holder 103 can be bonded to the resin plate 106 , and the side of the resin plate 106 away from the crystal holder 103 is used for bonding silicon rods.
  • the silicon slices 104 are bonded to the side of the resin plate 106 away from the crystal holder 103 .
  • the silicon wafer 104 was positioned under the crystal holder 103 , that is, between the crystal holder 103 and the bottom of the degumming tank 101 , so that the silicon wafer 104 was suspended under the crystal holder 103 .
  • the degumming tank can also be a tank body of other shapes, which only needs to match the shape of the crystal holder and the silicon wafer, and can accommodate the crystal holder and the silicon wafer.
  • the crystal tray can also be suspended inside the tank body of the degumming tank in other forms, which is not limited in this embodiment.
  • the shower assembly includes a plurality of shower heads, and the plurality of shower heads are installed at intervals on two opposite inner walls along the length direction of the crystal holder.
  • the shower assembly can be composed of a plurality of shower heads 102, and the plurality of shower heads 102 can be arranged at intervals along the length direction of the crystal holder 103 on two opposite side walls in the debonding tank 101.
  • the silicon rod is bonded to one side of the crystal holder 103 , and the length direction of the crystal holder is the length direction of the silicon rod.
  • a plurality of shower nozzles 102 are arranged at intervals on the left inner wall in the degumming tank 101, and a plurality of shower nozzles 102 are arranged at intervals on the right inner wall in the off-line tank 101, and many shower nozzles 102 are arranged on the left inner wall.
  • a spray head and a plurality of spray heads on the inner wall on the right side form a spray assembly.
  • the length direction of the crystal holder 103 is opposite to the two side walls on which the shower head 102 is installed. Adjusting the distance between the suspension part 105 and the shower head 102 can make the bonding position between the crystal support 103 and the silicon chip 104 face the shower head 102 , and the bonding position is where the resin plate 106 is located.
  • multiple nozzles operate simultaneously to spray a degumming solution, such as a lactic acid solution, to the bonding portion where the resin board 106 is located.
  • the degumming solution can dissolve the colloid between the crystal holder, the resin board and the silicon wafer, separate the silicon wafer from the crystal holder, and complete the degumming.
  • nozzles can also be installed at other positions of the degumming tank to spray the degumming solution on other positions of the silicon wafer according to requirements.
  • the spray assembly is composed of multiple spray heads, which can facilitate the installation of the spray assembly in the degumming tank. And according to the needs, the number of nozzles and the location of the nozzles can be flexibly set to spray the degumming solution to the bonding parts more accurately.
  • the spray head is movably connected with the inner wall, so as to adjust the spray direction of the spray head and/or adjust the position of the spray head on the inner wall.
  • the spray head is hinged to the inner wall of the degumming tank to adjust the spraying direction of the spray head.
  • Figure 3 shows a partial enlarged view of position A in Figure 1
  • the inner wall of the degumming tank 101 is provided with a spherical mounting hole 1011
  • the nozzle 102 is provided with a spherical connection part 1021 through one end close to the inner wall of the degumming tank 101
  • the spherical connecting portion 1021 is installed in the spherical mounting hole 1011
  • the spherical connecting portion 1021 can rotate in the spherical mounting hole 1011
  • the nozzle 102 can be moved up and down on the inner wall of the degumming tank Rotate left and right, so that the spraying direction of the spray head 102 can be adjusted.
  • the nozzle can also be hinged to the inner wall in other ways, for example, the nozzle can be hinged to the inner wall of the degumming tank through hinges, and the specific implementation method of the hinge can be set according to requirements, which is not limited in this embodiment.
  • the spray head can be slidably connected with the inner wall of the degumming tank through the guide rail.
  • Fig. 4 shows the cross-sectional view of Fig. 2 along the C direction
  • a plurality of guide rails 107 are installed on the inner wall of the degumming tank 101, each guide rail 107 corresponds to a shower head 102, and the guide rails 107 start from the groove bottom of the degumming tank 101
  • the spray head 102 is installed on the guide rail 107 and can slide up and down along the guide rail 107 to adjust the position of the spray head 102 on the inner wall of the degumming tank.
  • the nozzle can also realize the sliding connection with the inner wall through other methods.
  • a chute can be provided on the inner wall, and the chute extends from the bottom of the degumming tank to the direction of the slot, and the nozzle is installed in the chute and can slide along the chute.
  • the specific implementation manner of the sliding connection can be set according to requirements, which is not limited in this embodiment.
  • the nozzle can also be flexibly connected to the inner wall of the degumming tank in other ways to adjust the spraying direction and position of the nozzle, and this embodiment does not limit the specific implementation of the flex connection.
  • the nozzle and the inner wall of the degumming tank are flexibly connected.
  • the spray assembly includes a spray pipe, which surrounds the crystal holder and is installed on the inner wall of the degumming tank, and the spray pipe is spaced apart from a plurality of spray holes facing the bonding site.
  • the shower assembly consists of a shower pipe.
  • Figure 5 shows another cross-sectional view of Figure 1 along the direction B, the spray assembly is composed of an integrated spray pipe 501, and the spray pipe 501 is arranged on the inner wall of the off-line tank 101 around the crystal holder 103 superior.
  • the side of the spray pipe 501 close to the crystal tray 103 is provided with a plurality of spray holes at intervals.
  • the degumming solution with a certain pressure is passed into the spray pipe 501, the degumming solution is sprayed from the spray holes to the crystal tray 103 and the silicon wafer. 104 to dissolve the colloid between the crystal support and the silicon wafer.
  • the spray assembly can also be composed of multi-section spray pipes, and the multi-section spray pipes can be arranged on the left inner wall and right inner wall of the degumming tank at intervals along the length direction of the crystal holder shown in Figure 5, and can also be arranged on the upper side Some spray pipes are arranged on the inner wall and the lower inner wall, that is, arranged around the crystal holder.
  • the spray assembly when the spray assembly is composed of a spray pipe, the structure of the spray assembly can be simplified, and when the degumming solution is provided to the spray assembly, the integrated spray pipe can facilitate the supply of the degumming solution.
  • the spray pipe is movably connected with the inner wall of the degumming tank, so as to adjust the spraying direction of the spray hole and/or adjust the position of the spray pipe in the inner wall.
  • the spray pipe 501 can also be slidably connected with the inner wall of the degumming tank 101 through a sliding guide rail, and the spray pipe can be moved up and down on the inner wall of the degumming tank 101 through the sliding guide rail, and the spray pipe can be adjusted in the degumming tank. 101 position on the inner wall.
  • each section of spray pipe 501 can be hinged with the inner wall of the degumming tank 101, so that the spray pipe 501 can be rotated on the inner wall of the degumming tank 101 to adjust the amount of spray on the spray pipe.
  • the spray direction of the shower hole can include but not limited to the above examples.
  • the spray pipe is set on the inner wall of the degumming tank.
  • the spray pipe is flexibly connected to the inner wall of the degumming tank, when the spray pipe and the bonding part may be misaligned, and the degumming solution cannot be sprayed to the bonding part, through Adjusting the position of the spray pipe can adjust the spraying direction of the spray hole, so that the spray hole is opposite to the bonding part, and the degumming solution can be sprayed to the bonding part more accurately.
  • the degumming device further includes a lifting platform installed in the degumming tank for receiving the silicon wafers separated from the crystal tray.
  • Fig. 6 has shown the structural representation of another kind of degumming device in the utility model embodiment, at the groove bottom of degumming groove 101, can install lifting platform, and lifting platform is made by moving plate 107
  • driving device can be made up of one or more cylinders 108, and cylinder 108 is arranged between the groove bottom of mobile plate 107 and degumming tank 101, and cylinder 108 can drive mobile plate 107 to move up and down in degumming tank 101.
  • the cylinder 108 drives the moving plate 107 to move to a position close to the silicon wafer 104, so that the silicon wafer 104 is in a suspended state.
  • the silicon wafer 104 may drop onto the moving plate 107 .
  • the crystal tray 103 can be taken out first, and then the cylinder 108 is controlled to drive the mobile plate 107 to move toward the notch of the degumming tank 101, and the silicon wafer 104 is moved to a position close to the notch of the degumming tank 101, so that the staff can take out the silicon wafer 104.
  • Sheet 104 is controlled to drive the mobile plate 107 to move toward the notch of the degumming tank 101, and the silicon wafer 104 is moved to a position close to the notch of the degumming tank 101, so that the staff can take out the silicon wafer 104.
  • the mobile plate can be made up of a plate with a through hole, the through hole can avoid the accumulation of the degumming solution on the mobile plate, the driving device can also be a ball screw, etc., and the implementation of the lifting platform can be set according to the requirements. This is not limited.
  • a lifting platform is set in the degumming device.
  • the lifting platform can carry the silicon wafer falling from the crystal tray, and the silicon wafer can be lifted by the lifting platform after the degumming is completed. It is transported to the notch position of the degumming tank, which is convenient for the staff to take out the silicon wafer.
  • the degumming device may also include a suspension bracket; a hooking portion is provided on the side wall of the degumming tank, the suspension bracket is hooked to the hooking portion, and the suspension bracket is used for hanging the crystal holder.
  • a suspension bracket may be provided inside the degumming tank to suspend the crystal holder.
  • the degumming support is composed of a plurality of columns 109 arranged oppositely, and the plurality of columns 109 form a rectangular frame structure , the inside of the frame structure is used to accommodate the crystal holder 103 and the silicon wafer 104 .
  • the inner wall of the degumming tank 101 is provided with a first hooking portion 701, and the suspension bracket is provided with an overlapping portion 702 that matches the shape of the first hooking portion 701.
  • the suspension bracket can be put into the degumming groove, so that the overlapping portion 702 is overlapped on the hooking portion 701 , so that the suspension bracket is suspended in the degumming groove 101 .
  • the column body 109 is provided with a second hooking part 703, and the edge of the crystal holder 103 can be overlapped on the second hooking part 703, so that the crystal holder and the silicon wafer can be suspended in the suspension bracket .
  • the suspension bracket is a hollow structure, which does not prevent the spray assembly from spraying the degumming solution to the bonding part.
  • a fixing piece can also be arranged in the suspension bracket to fix the structure of the suspension bracket.
  • the bottom of the suspension bracket is provided with a fixing piece 704, the fixing piece 704 can be a fixing strip, the fixing strip is fixedly connected with a plurality of columns 109 in the suspension bracket, and the fixing piece 704 is used to enhance the stability of the suspension bracket sex.
  • FIG. 7 only shows a simple suspension bracket, and the specific structure of the suspension bracket can be flexibly set according to requirements, which is not limited in this embodiment.
  • the crystal tray and silicon wafer to be degummed can be hung in the suspension bracket first, and then the suspension bracket is put into the degumming tank, and the crystal tray and silicon wafer to be degummed are transported through the suspension bracket, which is convenient for work Personnel transport the trays and silicon wafers to be processed.
  • a receiving piece is provided at one end of the suspension bracket near the bottom of the degumming tank, and the receiving piece is used to receive the silicon wafer separated from the crystal support.
  • a receiving member may be provided to receive the silicon wafer.
  • the receiving member 705 is fixedly installed on the bottom of the suspension bracket, and the receiving member 705 may be a flat plate structure.
  • the silicon wafer can drop on the receiving member 705 to prevent the silicon wafer from falling to the bottom of the degumming tank 101 .
  • the hanging bracket can be directly extracted from the degumming tank 101 , so that the silicon wafer dropped on the receiving member 705 can be taken out, which is convenient for the staff to take out the silicon wafer.
  • a through hole can be provided on the receiving member, so as to prevent the degumming solution from staying on the receiving member.
  • the suspension bracket shown in FIG. 7 the suspension bracket includes a column and a receiving part, but the suspension bracket in actual application may not include a receiving part.
  • the degumming device may also include a cover plate, which is used to cover the notch of the degumming tank.
  • a cover plate which is used to cover the notch of the degumming tank.
  • the size of the cover plate 706 is smaller than the notch size of the degumming tank 101 , and the cover plate 706 can overlap the first hooking portion 701 .
  • the cover plate 706 can cover the notch of the degumming tank 101 to prevent the degumming solution from splashing to the outside of the degumming tank.
  • the degumming device further includes a buffer, and the buffer is installed on a side of the receiving member away from the bottom of the degumming tank.
  • the buffer member may be composed of multiple rubber tubes 707 , and the multiple rubber tubes 707 are arranged on the receiving member 705 at intervals.
  • the buffer member can prevent the silicon wafer 104 from being in hard contact with the receiving member 705 and protect the silicon wafer.
  • the buffer member may also be in other forms, such as a buffer pad, etc., and the specific form of the buffer member is not limited in this embodiment.
  • a buffer member may also be provided on the mobile plate shown in FIG. 6 to protect silicon wafers dropped onto the mobile plate.
  • the degumming device includes: a degumming tank and a spray assembly.
  • the inside of the tank body of the degumming tank is used to hang the crystal holder and accommodate the silicon wafer bonded on the side of the crystal holder near the bottom of the tank; the spray assembly is installed on the opposite inner wall of the degumming tank along the length direction of the crystal holder, spraying The assembly is used to spray the debonding solution on the bond between the crystal support and the silicon wafer.
  • the degumming solution can be sprayed on the bonding part between the crystal tray and the silicon wafer through the spray assembly.
  • the usage of the degumming solution is relatively small. Less, can reduce the loss of degumming solution.
  • spray degumming can use a lower concentration of degumming solution, for example, when using lactic acid solution for degumming, the concentration of lactic acid solution required for soaking degumming is 20% to 50%, while the concentration of lactic acid required for spray degumming At about 10%, the amount of lactic acid used can be reduced and the cost of degumming can be reduced.
  • a certain spray pressure can be provided to the bonding part through the spray assembly, so as to improve the dissolution efficiency of the colloid and shorten the degumming time.
  • the degumming time is about 800 seconds, but when using spray degumming, the degumming time can be shortened to about 400 seconds.
  • the degumming solution needs to be heated to about 70 degrees Celsius, while when spraying degumming is used, the temperature of the required degumming solution can be reduced to about 35 degrees Celsius due to the spray pressure provided by the spraying component, reducing the The degumming temperature is lowered, which can reduce the energy consumption in the degumming process.
  • the temperature is lowered, the problem of silicon wafer oxidation caused by high temperature can be avoided, thereby avoiding the reduction of the quality of the silicon wafer.
  • FIG. 8 shows a schematic structural view of a degumming system in an embodiment of the present invention.
  • the degumming system includes the above-mentioned degumming device, a liquid storage tank 801 , an output pipeline 802 and a recovery pipeline 803 .
  • a heating element is installed in the liquid storage tank 801, and the liquid storage tank 801 is used to store the degumming solution and heat the degumming solution in the liquid storage tank 801; one end of the output pipeline 802 is connected to the liquid storage tank 108, and the other end is connected to In the degumming tank 101, it is used to transport the degumming solution in the liquid storage tank 801 to the spray assembly; The degumming solution is recovered to the liquid storage tank 108.
  • the liquid storage tank 801 is used for storing the degumming solution and heating the degumming solution.
  • a first heating element 8011 and a second heating element 8012 are arranged in the liquid storage tank 801 , and the heating element can be a heating tube through which the degumming solution in the liquid storage tank 801 can be heated.
  • the liquid storage tank 801 is connected to the spray assembly through the output pipeline 802, the first delivery pump 8021 can be installed in the output pipeline 802, the input port of the first delivery pump 8021 is connected to the liquid storage tank 108, and the output port is connected to the spray assembly After the first delivery pump 8021 is started, the degumming solution in the liquid storage tank 108 can be pumped into the spray assembly, so that the spray assembly can spray the degumming solution at a certain pressure to the bonding part.
  • One end of the recovery pipeline 803 is connected to the degumming tank 101, and the other end is connected to the liquid storage tank 801.
  • a second delivery pump 8031 is arranged in the recovery pipeline 803.
  • the input port of the second delivery pump 8031 is connected to the degumming tank 101, and the output port is connected to the liquid storage tank. 801, when the second delivery pump 8031 is started, the degumming solution in the degumming tank 101 can be pumped into the liquid storage tank 801 to complete the recovery of the degumming solution.
  • the specific structure and heating method of the liquid storage tank, as well as the specific composition of the output pipeline and the recovery pipeline can be set according to requirements, which is not limited in this embodiment.
  • the degumming system may also include a liquid return transfer tank 804, and the liquid return transfer tank 804 is arranged on the recovery pipeline 803 Among them, one end of the liquid return transfer tank 804 is connected to the degumming tank 101, and the other end is connected to the input port of the second delivery pump 8031.
  • the liquid return transfer tank 804 is connected to the degumming tank 101 for adjusting the liquid level of the degumming solution in the degumming tank 101.
  • a first liquid level switch 8041 and a second liquid level switch 8042 can be installed in the liquid return transfer tank 804.
  • the second delivery pump 8031 When the liquid level in the liquid return transfer tank 804 is higher than the first liquid level switch 8041, the second delivery pump 8031 is controlled to start, The degumming solution in the liquid return transfer tank 804 is delivered to the liquid storage tank 801, and when the liquid level is lower than the second liquid level switch 8042, the second delivery pump 8031 is controlled to stop working. Since the liquid return transfer tank 804 is connected with the degumming tank 101, the liquid levels of the liquid return transfer tank 804 and the degumming tank 101 are the same, and the liquid level in the degumming tank 101 can be adjusted by adjusting the liquid level of the liquid return transfer tank 804. It should be noted that, when the transfer tank is not provided in the recovery pipeline, the first liquid level switch and the second liquid level switch can also be directly arranged in the degumming tank.
  • the liquid return filter 805 can also be included in the degumming system, and the liquid return filter 805 is arranged between the liquid storage tank 801 and the second output pump 8031, and is used for pumping the second delivery pump 8031 into the liquid storage tank 801.
  • the degumming solution is filtered to prevent impurities in the degumming solution from entering the liquid storage tank 801 .
  • the liquid return filter can be arranged at any position in the recovery pipeline, which is not limited in this embodiment.
  • Figure 10 shows a schematic structural view of another degumming system in an embodiment of the present invention
  • the degumming system also includes at least one water storage tank 901, at least one spray cleaning tank 902, at least one liquid storage tank Tank 801 , at least one degumming tank 101 and rinse tank 907 .
  • the spray cleaning tank 902 is provided with a cleaning component 908, such as a shower head or a shower pipe, etc.
  • the spray cleaning tank 902 is used to spray and clean the silicon wafers to be degummed
  • the water storage tank 901 is used to store cleaning water. And provide cleaning water to the cleaning components.
  • the degumming system includes two water storage tanks 901 and two spray cleaning tanks 902, the water storage tanks 901 and the spray cleaning tanks 902 are connected by a water supply pipeline, and a water supply pump 906 is arranged in the water supply pipeline to supply The input port of the water pump 906 is connected to the water storage tank 901 , and the output port is connected to the cleaning assembly 908 .
  • the cleaning water in the water storage tank 901 can be pumped into the cleaning component 908 , and the cleaning component 908 can clean the silicon wafers put into the spray cleaning tank 902 .
  • a return water pipeline is arranged between the spray cleaning tank 902 and the water storage tank 901, and devices such as a return water transfer tank 903, a return water pump 904 and a return water filter 905 are arranged in the return water pipeline.
  • the return water pump 904 starts, it can The cleaning water in the spray cleaning tank 902 is pumped into the water storage tank 901 to realize recovery of the cleaning water.
  • the return water transfer tank 903 is used to adjust the liquid level of cleaning water in the spray cleaning tank 902 , and the principle of the return water transfer tank 903 is the same as that of the return liquid transfer tank 805 .
  • the return water filter 905 is used to filter the cleaning water entering the water storage tank 901 to prevent impurities in the spray cleaning tank 902 from entering the water storage tank 901 .
  • the degumming system may also include one or more rinsing tanks 907 for rinsing the degummed silicon wafers.
  • the degumming system includes one or more spray cleaning tanks and one or more degumming tanks.
  • multiple spray cleaning tanks can be used to clean the silicon wafers bonded to multiple crystal holders at the same time. After cleaning, the cleaned crystal holders and silicon wafers can be taken out from the spray cleaning tanks.
  • into the degumming tank for spray degumming when the degumming is complete, take out the silicon wafer from the degumming tank, put it into the rinsing tank for rinsing, and complete the whole degumming process after rinsing.
  • multiple spray cleaning tanks and multiple degumming tanks are set in the degumming system, which can simultaneously clean and degumming silicon wafers bonded to multiple crystal trays, and can improve degumming efficiency.
  • the specific number of water storage tanks, spray cleaning tanks, liquid storage tanks, degumming tanks and rinsing tanks can be set according to requirements, which is not limited in this embodiment.

Abstract

一种脱胶装置和脱胶系统，脱胶装置包括：脱胶槽（101）和喷淋组件，脱胶槽（101）的槽体内部用于悬挂晶托（103），并容纳在晶托（103）靠近槽底一侧粘接的硅片（104）；喷淋组件沿晶托（103）的长度方向，安装在脱胶槽（101）中相对的内壁上，喷淋组件用于向晶托（103）和硅片（104）之间的粘接部位喷淋脱胶溶液。在脱胶过程中，可以通过喷淋组件向晶托（103）与硅片（104）之间的粘接部位喷射脱胶溶液，相对于浸泡式脱胶，只需要在粘接部位喷射脱胶溶液即可，脱胶溶液的使用量较少，可以降低脱胶溶液的损耗。

Description

一种脱胶装置和脱胶系统
相关申请的交叉引用
本公开要求在2021年9月06日提交中国专利局、申请号为202122140335.1、名称为“一种脱胶装置和脱胶系统”的专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本实用新型涉及太阳能光伏技术领域，特别是涉及一种脱胶装置和脱胶系统。
背景技术
在光伏组件的制造过程中，首先需要将硅棒切割为硅片，然后将硅片加工组装为光伏组件。在硅棒切割过程中，需要依次经过粘棒、切片、脱胶、清洗和分选等工序。在粘棒工序中，通常采用胶体连接硅棒和晶托，经过切片工序后得到硅片。在脱胶工序中，需要将硅片与晶托置于脱胶装置中的脱胶槽内进行脱胶，使硅片与晶托分离。
在先技术中，通常采用浸泡式脱胶装置进行脱胶处理，即将晶托和硅棒浸泡在脱胶装置中的脱胶槽内，通过脱胶槽内的脱胶溶液溶解胶体，使晶托和硅片分离。浸泡式脱胶需要在脱胶槽内放置较多脱胶溶液，脱胶溶液的损耗较大。
实用新型内容
本实用新型提供一种脱胶装置和脱胶系统，旨在解决采用浸泡式脱胶时脱胶溶液损耗较大的问题。
本实用新型实施例提供了一种脱胶装置，包括：脱胶槽和喷淋组件；
所述脱胶槽的槽体内部用于悬挂晶托，并容纳在所述晶托靠近槽底一侧粘接的硅片；
所述喷淋组件沿所述晶托的长度方向，安装在所述脱胶槽中相对的内壁 上，所述喷淋组件用于向所述晶托和所述硅片之间的粘接部位喷射脱胶溶液。
可选地，所述脱胶装置还包括悬挂支架；
所述脱胶槽的侧壁上设置有挂接部，所述悬挂支架挂接于所述挂接部，所述悬挂支架用于悬挂所述晶托。
可选地，所述悬挂支架靠近所述脱胶槽槽底的一端设置有承接件，所述承接件用于承接与所述晶托分离的硅片。
可选地，所述脱胶装置还包括缓冲件，所述缓冲件安装于所述承接件背离所述脱胶槽槽底的一侧。
可选地，所述脱胶装置还包括升降平台，所述升降平台安装在所述脱胶槽内，用于承接与所述晶托分离的硅片。
可选地，所述喷淋组件包括多个喷头，所述多个喷头沿所述晶托的长度方向，间隔安装在相对的两个所述内壁上。
可选地，所述喷头与所述内壁活动连接，以调节所述喷头的喷射方向和/或调节所述喷头在所述内壁上的位置。
可选地，所述喷淋组件包括喷淋管，所述喷淋管环绕所述晶托安装在所述脱胶槽的内壁上，所述喷淋管上间隔开设有多个朝向所述粘接部位的喷淋孔。
可选地，所述喷淋管与所述脱胶槽的内壁活动连接，以调节所述喷淋孔的喷射方向和/或调节所述喷淋管在所述内壁中的位置。
本实用新型实施例还提供了一种脱胶系统，包括如上所述的脱胶装置，所述脱胶系统还包括：
储液槽，所述储液槽用于存储所述脱胶溶液，并对所述储液槽内的脱胶溶液加热；
输出管路，所述输出管路的一端连接于所述储液槽，另一端连接于所述脱胶槽，用于将所述储液槽内的脱胶溶液输送至所述喷淋组件；
回收管路，所述回收管路的一端连接于所述储液槽，另一端连接于所述脱胶槽，用于将所述脱胶槽内的脱胶溶液回收至所述储液槽。
在本实用新型实施例中，脱胶装置包括：脱胶槽和喷淋组件。脱胶槽的槽体内部用于悬挂晶托，并容纳在晶托靠近槽底一侧粘接的硅片；喷淋组件沿晶托的长度方向，安装在脱胶槽中相对的内壁上，喷淋组件用于向晶托和 硅片之间的粘接部位喷淋脱胶溶液。在脱胶过程中，可以通过喷淋组件向晶托与硅片之间的粘接部位喷射脱胶溶液，相对于浸泡式脱胶，只需要在粘接部位喷射脱胶溶液即可，脱胶溶液的使用量较少，可以降低脱胶溶液的损耗。
上述说明仅是本实用新型技术方案的概述，为了能够更清楚了解本实用新型的技术手段，而可依照说明书的内容予以实施，并且为了让本实用新型的上述和其它目的、特征和优点能够更明显易懂，以下特举本实用新型的具体实施方式。
附图说明
为了更清楚地说明本实用新型实施例的技术方案，下面将对本实用新型实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1示出了本实用新型实施例中的一种脱胶装置的结构示意图；
图2示出了图1沿B方向的剖视图；
图3示出了图1中A位置的局部放大图；
图4示出了图2沿C方向的剖视图；
图5示出了另一种图1沿B方向的剖视图；
图6示出了本实用新型实施例中的另一种脱胶装置的结构示意图；
图7示出了本实用新型实施例中的又一种脱胶装置的结构示意图；
图8示出了本实用新型实施例中的一种脱胶系统的结构示意图；
图9示出了本实用新型实施例中的另一种脱胶系统的结构示意图；
图10示出了本实用新型实施例中的又一种脱胶系统的结构示意图。
附图标记说明：
101-脱胶槽，102-喷头，103-晶托，104-硅片，105-悬挂部件，106-树脂板，107-导轨，108-气缸，109-柱体，501-喷淋管，701-第一挂接部，702-搭接部，703-第二挂接部，704-固定件，705-承接件，706-盖板，707-胶皮管，801-储液槽，8011-第一加热件，8012-第二加热件，802-输出管路，802-第一输送泵，803-回收管路，8031-第二输送泵，804-回液中转槽，8041-第一液位开关，8042-第二液位开关，805-回液过滤器，901-储水槽，902-喷淋清洗槽，903- 回水中转槽，904-回水泵，905-回水过滤器，906-供水泵，907-漂洗槽，908-清洗组件。
具体实施例
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
参照图1和图2，图1示出了本实用新型实施例中的一种脱胶装置的结构示意图，图2示出了图1沿B方向的剖视图，脱胶装置包括：脱胶槽101和喷淋组件。
其中，脱胶槽101的槽体内部用于悬挂晶托103，并容纳在晶托101靠近槽底一侧粘接的硅片104；喷淋组件沿晶托的长度方向，安装在脱胶槽101中相对的内壁上，喷淋组件用于向晶托103和硅片104之间的粘接部位喷射脱胶溶液。
本实施例中，脱胶槽101可以是图1所示矩形槽体，与晶托103的形状匹配。脱胶槽101内相对的两个内壁上设置有悬挂部件105，当晶托103放入脱胶槽101内时，晶托103的边沿可以搭接在悬挂部件105上，使晶托101悬挂在脱胶槽101的槽体内部。在硅棒切割过程中，晶托103的一侧可以粘接树脂板106，树脂板106背离晶托103的一侧用于粘接硅棒。当硅棒被切割为硅片104之后，硅片104粘接于树脂板106背离晶托103的一侧。当晶托103放入脱胶槽101内时，硅片104位于晶托103的下方，即位于晶托103与脱胶槽101的槽底之间，使硅片104悬挂在晶托103的下方。实际应用中，脱胶槽也可以为其他形状的槽体，只需与晶托和硅片的形状匹配，可以容纳晶托和硅片即可。晶托也可以通过其他形式悬挂在脱胶槽的槽体内部，本实施例对此不做限制。
可选地，喷淋组件包括多个喷头，多个喷头沿晶托的长度方向，间隔安装在相对的两个内壁上。
在一种实施例中，喷淋组件可以由多个喷头102组成，多个喷头102可 以沿晶托103的长度方向间隔设置在脱胶槽101内相对的两个侧壁上。其中，在硅棒切割过程中，硅棒粘接于晶托103的一侧，晶托的长度方向即硅棒的长度方向。如图2所示，在脱胶槽101内的左侧内壁上间隔设置有多个喷头102，同样的在脱机槽101内的右侧内壁上间隔设置多个喷头102，左侧内壁上的多个喷头和右侧内壁上的多个喷头组成喷淋组件。如图1所示，当晶托103悬挂在脱胶槽101内时，晶托103的长度方向与安装喷头102的两个侧壁相对。调节悬挂部件105和喷头102之间的距离，可以使晶托103和硅片104之间的粘接部位与喷头102相对，粘接部位即树脂板106所在部位。在脱胶过程中，多个喷头同时动作，向树脂板106所在的粘接部位喷射脱胶溶液，脱胶溶液例如乳酸溶液。脱胶溶液可以溶解晶托、树脂板和硅片之间的胶体，使硅片与晶托分离，完成脱胶。实际应用中，也可以根据需求在脱胶槽的其他位置设置喷头，对硅片的其他位置喷射脱胶溶液。
在实际应用中，喷淋组件由多个喷头组成，可以便于将喷淋组件安装在脱胶槽内。并且可以根据需求，灵活设置喷头数量和喷头所在位置，以向粘接部位的更准确的喷射脱胶溶液。
可选地，喷头与内壁活动连接，以调节喷头的喷射方向和/或调节喷头在内壁上的位置。
在一种实施例中，喷头与脱胶槽的内壁铰接，以调节喷头的喷射方向。如图3所示，图3示出了图1中A位置的局部放大图，脱胶槽101的内壁上设置有球状安装孔1011，喷头102通过靠近脱胶槽101内壁的一端设置有球状连接部1021，球状连接部1021安装在球状安装孔1011内，球状连接部1021可以在球状安装孔1011内转动，当球状连接部1021在球状安装孔1011内转动时，可以使喷头102在脱胶槽的内壁上下左右转动，从而可以调节喷头102的喷射方向。其中，喷头也可以通过其他方式实现与内壁的铰接，例如喷头可以通过合页与脱胶槽的内壁铰接，铰接的具体实现方式可以根据需求设置，本实施例对此不做限制。
在另一种实施例中，喷头可以通过导轨与脱胶槽的内壁滑动连接。如图4所示，图4示出了图2沿C方向的剖视图，脱胶槽101的内壁上安装有多个导轨107，每个导轨107对应一个喷头102，导轨107从脱胶槽101的槽底向槽口方向延伸，喷头102安装在导轨107上，可以沿导轨107上下滑动，以 调节喷头102在脱胶槽内壁上的位置。其中，喷头也可以通过其他方式实现与内壁的滑动连接。例如，内壁上可以开设滑槽，滑槽从脱胶槽的槽底向槽口方向延伸，喷头安装在滑槽内，可以沿滑槽滑动。滑动连接的具体实现方式可以根据需求设置，本实施例对此不做限制。
需要说明的是，喷头也可以通过其他方式实现与脱胶槽内壁的活动连接，以调节喷头的喷射方向和位置，本实施例对活动连接的具体实现方式不做限制。在实际应用中，喷头与脱胶槽的内壁活动连接，当硅片和晶托之间的粘接部位在脱胶槽内的位置发生变化时，喷头与粘接部位可能发生错位，喷头无法向粘接部位喷射脱胶溶液。此时，调节喷头的位置或喷射方向，可以使喷头的喷射方向与粘接部位相对，从而可以更准确的向粘接部位喷射脱胶溶液。
可选地，喷淋组件包括喷淋管，喷淋管环绕晶托安装在脱胶槽的内壁上，喷淋管上间隔开设有多个朝向粘接部位的喷淋孔。
在一种实施例中，喷淋组件由喷淋管组成。如图5所示，图5示出了另一种图1沿B方向的剖视图，喷淋组件由一体式喷淋管501组成，喷淋管501环绕晶托103设置在脱机槽101的内壁上。喷淋管501靠近晶托103的一侧间隔设置有多个喷淋孔，当喷淋管501内通入具有一定压力的脱胶溶液时，脱胶溶液从喷淋孔喷向晶托103与硅片104之间的粘接部位，以溶解晶托与硅片之间的胶体。其中，喷淋组件也可以由多段喷淋管组成，多段喷淋管可以沿图5所示晶托的长度方向，间隔设置在脱胶槽的左侧内壁和右侧内壁，同时也可以在上侧内壁和下侧内壁设置部分喷淋管，也即环绕晶托设置。
在实际应用中，当喷淋组件由喷淋管组成时，可以简化喷淋组件的结构，并且在向喷淋组件提供脱胶溶液时，一体化的喷淋管可以便于提供脱胶溶液。
可选地，喷淋管与脱胶槽的内壁活动连接，以调节喷淋孔的喷射方向和/或调节喷淋管在内壁中的位置。
结合图4和图5所示，喷淋管501也可以与脱胶槽101的内壁通过滑动导轨滑动连接，通过滑动导轨可以在脱胶槽101的内壁上下移动喷淋管，调节喷淋管在脱胶槽101内壁上的位置。或者，当喷淋组件由多段喷淋管组成时，每段喷淋管501均可以与脱胶槽101的内壁铰接，从而可以在脱胶槽101的内壁转动喷淋管501，调节喷淋管上喷淋孔的喷射方向。喷淋管与脱胶槽内 壁之间的活动连接方式可以包括但不限于上述举例。
在实际应用中，喷淋管设置在脱胶槽的内壁，喷淋管与脱胶槽的内壁活动连接时，当喷淋管与粘接部位可能发生错位，无法向粘接部位喷射脱胶溶液时，通过调节喷淋管的位置可以调节喷淋孔的喷射方向，使喷淋孔与粘接部位相对，可以更准确的向粘接部位喷射脱胶溶液。
可选地，脱胶装置还包括升降平台，升降平台安装在脱胶槽内，用于承接与晶托分离的硅片。
示例性的，如图6所示，图6示出了本实用新型实施例中的另一种脱胶装置的结构示意图，在脱胶槽101的槽底，可以安装升降平台，升降平台由移动平板107和驱动装置组成，驱动装置可以由一个或多个气缸108组成，气缸108设置在移动平板107和脱胶槽101的槽底之间，气缸108可以驱动移动平板107在脱胶槽101内上下运动。当晶托103和硅片104放入脱胶槽101内时，气缸108驱动移动平板107移动到靠近硅片104的位置，使硅片104呈悬挂状态。在脱胶过程中，当硅片104与晶托103分离之后，硅片104可以掉落在移动平板上107。在脱胶完成之后，可以先取出晶托103，然后控制气缸108驱动移动平板107向脱胶槽101的槽口方向移动，将硅片104移动到靠近脱胶槽101槽口的位置，方便工作人员取出硅片104。其中，移动平板可以由具有通孔的平板组成，通孔可以避免脱胶溶液在移动平板上累计，驱动装置也可以为滚珠丝杠等结果，升降平台的实现方式可以根据需求设置，本实施例对此不做限制。
实际应用中，脱胶装置中设置升降平台，当脱胶过程中的晶托和硅片分离后，升降平台可以承载从晶托掉落的硅片，并且可以在脱胶完成之后，通过升降平台将硅片运送至脱胶槽的槽口位置，方便工作人员取出硅片。
可选地，脱胶装置中还可以包括悬挂支架；脱胶槽的侧壁上设置有挂接部，悬挂支架挂接于挂接部，悬挂支架用于悬挂晶托。
在一种实施例中，脱胶槽的内部可以设置悬挂支架，用以悬挂晶托。如图7所示，图7示出了本实用新型实施例中的又一种脱胶装置的结构示意图，脱胶支架由相对设置的多根柱体109组成，多根柱体109构成矩形的框架结构，框架结构的内部用于容纳晶托103和硅片104。脱胶槽101的内壁上设置有第一挂接部701，悬挂支架上设置有与第一挂接部701形状匹配的搭接部 702。悬挂支架可以放入脱胶槽内，使搭接部702搭接在挂接部701上，从而将悬挂支架悬挂在脱胶槽101内。同时，在悬挂支架内，柱体109上设置有第二挂接部703，晶托103的边沿可以搭接在第二挂接部703上，从而可以将晶托和硅片悬挂在悬挂支架内。在悬挂支架与喷淋组件相对的位置，悬挂支架为镂空结构，并不阻挡喷淋组件向粘接部位喷射脱胶溶液。同时，悬挂支架中还可以设置固定件，以固定悬挂支架的结构。如图7所示，在悬挂支架的底部设置有固定件704，固定件704可以为固定条，固定条与悬挂支架中的多个柱体109固定连接，固定件704用于增强悬挂支架的稳定性。需要说明的是，图7仅示出了一种简单的悬挂支架，悬挂支架的具体结构可以根据需求灵活设置，本实施对此不做限制。
实际应用中，在脱胶过程，可以将待脱胶的晶托和硅片先悬挂在悬挂支架内，然后再将悬挂支架放入脱胶槽，通过悬挂支架运送待脱胶的晶托和硅片，便于工作人员运送待晶托和硅片。
可选地，悬挂支架靠近脱胶槽槽底的一端设置有承接件，承接件用于承接与晶托分离的硅片。
在一种实施例中，可以设置承接件以承接硅片。如图7所示，承接件705固定安装在悬挂支架的底部，承接件705可以为平板结构。在脱胶过程中，当硅片与晶托分离之后，硅片可以掉落在承接件705上，避免硅片掉落在脱胶槽101的底部。并且，在完成脱胶之后，可以直接从脱胶槽101内提取悬挂支架，从而可以将掉落在承接件705上的硅片取出，便于工作人员取出硅片。其中，承接件为平板结构时，承接件上可以开设通孔，可以避免脱胶溶液停留在承接件上。
需要说明的是，在图7所示的悬挂支架中，悬挂支架包括柱体和承接件，而实际应用中的悬挂支架可以不包括承接件。脱胶过程中硅片与晶托分离之后，硅片可以直接掉落到脱胶槽的槽底，工作人员可以从脱胶槽的槽底取出硅片。
可选地，脱胶装置还可以包括盖板，盖板用于遮挡脱胶槽的槽口。如图7所示，盖板706的尺寸与小于脱胶槽101的槽口尺寸，盖板706可以搭接在第一挂接部701上。在脱胶过程中，盖板706可以遮挡脱胶槽101的槽口，避免脱胶溶液溅射到脱胶槽的外部。
可选地，脱胶装置还包括缓冲件，缓冲件安装于承接件背离脱胶槽槽底的一侧。
如图7示，缓冲件可以由多个胶皮管707组成，多个胶皮管707间隔设置在承接件705上。在硅片104与晶托103分离掉落在承接件705的过程中，缓冲件可以避免硅片104与承接件705硬接触，对硅片进行保护。其中，缓冲件也可以为其他形式，例如缓冲垫等，本实施例对缓冲件的具体形式不做限制。在一种实施例中，也可以在图6所示的移动平板上设置缓冲件，对掉落到移动平板的硅片进行保护。
综上所述，在本实施例中，脱胶装置包括：脱胶槽和喷淋组件。脱胶槽的槽体内部用于悬挂晶托，并容纳在晶托靠近槽底一侧粘接的硅片；喷淋组件沿晶托的长度方向，安装在脱胶槽中相对的内壁上，喷淋组件用于向晶托和硅片之间的粘接部位喷淋脱胶溶液。在脱胶过程中，可以通过喷淋组件向晶托与硅片之间的粘接部位喷射脱胶溶液，相对于浸泡式脱胶，只需要在粘接部位喷射脱胶溶液即可，脱胶溶液的使用量较少，可以降低脱胶溶液的损耗。
其中，喷淋式脱胶可以使用较低浓度的脱胶溶液，例如当采用乳酸溶液进行脱胶时，浸泡式脱胶所需乳酸溶液的浓度在20％至50％，而喷淋式脱胶所需乳酸的浓度在10％左右，可以降低乳酸使用量，降低脱胶成本。同时，当采用喷淋组件向粘接部位喷射脱胶溶液时，可以通过喷淋组件向粘接部位提供一定的喷射压力，提高胶体的溶解效率，缩短脱胶时间。采用传统的浸泡式脱胶，脱胶时间在800秒左右，而采用喷淋式脱胶时，可以将脱胶时间缩短到400秒左右。进一步的，采用浸泡式脱胶时，需要将脱胶溶液加热到70摄氏度左右，而采用喷淋式脱胶时，由于喷淋组件提供的喷射压力，所需脱胶溶液的温度可以降低到35摄氏度左右，降低了脱胶温度，从而可以降低脱胶过程中的能耗。并且，温度降低时，可以避免高温造成的硅片氧化问题，从而可以避免降低硅片质量。
参照图8，图8示出了本实用新型实施例中的一种脱胶系统的结构示意图，脱胶系统包括如上所述的脱胶装置，以及储液槽801、输出管路802和回收管路803。
其中，储液槽801内安装有加热件，储液槽801用于存储脱胶溶液，并 对储液槽801内的脱胶溶液加热；输出管路802的一端连接于储液槽108，另一端连接于脱胶槽101，用于将储液槽801内的脱胶溶液输送至喷淋组件；回收管路803的一端连接于储液槽801，另一端连接于脱胶槽101，用于将脱胶槽101内的脱胶溶液回收至储液槽108。
本实施例中，储液槽801用于存储脱胶溶液，并对脱胶溶液进行加热。如图8所示，储液槽801内设置有第一加热件8011和第二加热件8012，加热件可以为加热管，通过加热管可以对储液槽801内的脱胶溶液进行加热。储液槽801通过输出管路802与喷淋组件连接，输出管路802中可以设置第一输送泵8021，第一输送泵8021的输入口与储液槽108连接，输出口与喷淋组件连接，第一输送泵8021启动之后，可以将储液槽108内的脱胶溶液泵入喷淋组件，从而可以使喷淋组件向粘接部位喷射一定压力的脱胶溶液。回收管路803的一端连接脱胶槽101，另一端连接储液槽801，回收管路803中设置第二输送泵8031，第二输送泵8031的输入口连接脱胶槽101，输出口连接储液槽801，第二输送泵8031启动时，可以将脱胶槽101内的脱胶溶液泵入储液槽801，完成脱胶溶液的回收。储液槽的具体结构和加热方，以及输出管路和回收管路的具体组成式可以根据需求设置，本实施例对此不做限制。
如图9所示，图9示出了本实用新型实施例中的另一种脱胶系统的结构示意图，脱胶系统中还可以包括回液中转槽804，回液中转槽804设置在回收管路803中，回液中转槽804的一端连接脱胶槽101，另一端连接第二输送泵8031的输入口，回液中转槽804与脱胶槽101连通，用于调节脱胶槽101内脱胶溶液的液位。回液中转槽804内可以设置第一液位开关8041和第二液位开关8042，当回液中转槽804内的液位高于第一液位开关8041时，控制第二输送泵8031启动，将回液中转槽804内的脱胶溶液输送至储液槽801，当液位低于第二液位开关8042时，控制第二输送泵8031停止工作。由于回液中转槽804与脱胶槽101连通，因此回液中转槽804和脱胶槽101的液位相同，调节回液中转槽804的液位即可调节脱胶槽101内的液位。需要说明的是，当回收管路中未设置中转槽时，第一液位开关和第二液位开关也可以直接设置在脱胶槽中。
其中，脱胶系统中还可以包括回液过滤器805，回液过滤器805设置在储液槽801和第二输出泵8031之间，用于对第二输送泵8031泵入储液槽801 内的脱胶溶液进行过滤，以避免脱胶溶液内的杂质进入储液槽801。其中，回液过滤器可以设置在回收管路中的任意位置，本实施例对此不做限制。
如图10所示，图10示出了本实用新型实施例中的又一种脱胶系统的结构示意图，脱胶系统中还包括至少一个储水槽901、至少一个喷淋清洗槽902、至少一个储液槽801、至少一个脱胶槽101和漂洗槽907。
其中，喷淋清洗槽902中设置有清洗组件908，清洗组件例如喷头或喷淋管等，喷淋清洗槽902用于对待脱胶的硅片进行喷淋清洗，储水槽901用于存储清洁用水，并向清洗组件提供清洁用水。如图10所示，脱胶系统中包括2个储水槽901和两个喷淋清洗槽902，储水槽901和喷淋清洗槽902通过供水管路连接，供水管路中设置有供水泵906，供水泵906的输入口与储水槽901连接，输出口与清洗组件908连接。当供水泵906启动之后，可以将储水槽901内的清洁用水泵入清洗组件908，清洗组件908可以对放入喷淋清洗槽902的硅片进行清洗。同时，喷淋清洗槽902和储水槽901之间设置有回水管路，回水管路中设置有回水中转槽903、回水泵904和回水过滤器905等器件，回水泵904启动之后，可以将喷淋清洗槽902内的清洁用水泵入储水槽901，实现清洁用水的回收。回水中转槽903用于调节喷淋清洗槽902内清洁用水的液位，回水中转槽903与回液中转槽805的原理相同。回水过滤器905用于对进入储水槽901的清洁用水进行过滤，避免喷淋清洗槽902内的杂质进入储水槽901。脱胶系统中还可以包括一个或多个漂洗槽907，漂洗槽907用于对脱胶后的硅片进行漂洗。
本实施例中，脱胶系统中包括一个或多个喷淋清洗槽，一个或多个脱胶槽。在脱胶过程中，通过设置的多个喷淋清洗槽可以同时对多个晶托分别粘接的硅片进行清洗，在清洗之后，可以从喷淋清洗槽中取出清洗后的晶托和硅片，放入脱胶槽进行喷淋脱胶，当脱胶完成之后，从脱胶槽中取出硅片，放入漂洗槽进行漂洗，漂洗过后完成整个脱胶流程。
本实施例中，脱胶系统中设置多个喷淋清洗槽和多个脱胶槽，可以同时对多个晶托粘接的硅片进行清洗和脱胶，可以提供脱胶效率。在脱胶系统中，储水槽、喷淋清洗槽、储液槽、脱胶槽和漂洗槽的具体数量可以根据需求设置，本实施例对此不做限制。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变 体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本实用新型的实施例进行了描述，但是本实用新型并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本实用新型的启示下，在不脱离本实用新型宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些均属于本实用新型的保护之内。

Claims (10)

  1. 一种脱胶装置，其特征在于，包括：脱胶槽和喷淋组件；
    所述脱胶槽的槽体内部用于悬挂晶托，并容纳在所述晶托靠近槽底一侧粘接的硅片；
    所述喷淋组件沿所述晶托的长度方向，安装在所述脱胶槽中相对的内壁上，所述喷淋组件用于向所述晶托和所述硅片之间的粘接部位喷射脱胶溶液。
  2. 根据权利要求1所述的脱胶装置，其特征在于，还包括悬挂支架；
    所述脱胶槽的侧壁上设置有挂接部，所述悬挂支架挂接于所述挂接部，所述悬挂支架用于悬挂所述晶托。
  3. 根据权利要求2所述的脱胶装置，其特征在于，所述悬挂支架靠近所述脱胶槽槽底的一端设置有承接件，所述承接件用于承接与所述晶托分离的硅片。
  4. 根据权利要求3所述的脱胶装置，其特征在于，还包括缓冲件，所述缓冲件安装于所述承接件背离所述脱胶槽槽底的一侧。
  5. 根据权利要求1所述的脱胶装置，其特征在于，还包括升降平台，所述升降平台安装在所述脱胶槽内，用于承接与所述晶托分离的硅片。
  6. 根据权利要求1所述的脱胶装置，其特征在于，所述喷淋组件包括多个喷头，所述多个喷头沿所述晶托的长度方向，间隔安装在相对的两个所述内壁上。
  7. 根据权利要求6所述的脱胶装置，其特征在于，所述喷头与所述内壁活动连接，以调节所述喷头的喷射方向和/或调节所述喷头在所述内壁上的位置。
  8. 根据权利要求1所述的脱胶装置，其特征在于，所述喷淋组件包括喷淋管，所述喷淋管环绕所述晶托安装在所述脱胶槽的内壁上，所述喷淋管上间隔开设有多个朝向所述粘接部位的喷淋孔。
  9. 根据权利要求8所述的脱胶装置，其特征在于，所述喷淋管与所述脱胶槽的内壁活动连接，以调节所述喷淋孔的喷射方向和/或调节所述喷淋管在所述内壁中的位置。
  10. 一种脱胶系统，其特征在于，包括如权利要求1-9任一项所述的脱胶装置；所述脱胶系统还包括：
    储液槽，所述储液槽用于存储所述脱胶溶液，并对所述储液槽内的脱胶 溶液加热；
    输出管路，所述输出管路的一端连接于所述储液槽，另一端连接于所述脱胶槽，用于将所述储液槽内的脱胶溶液输送至所述喷淋组件；
    回收管路，所述回收管路的一端连接于所述储液槽，另一端连接于所述脱胶槽，用于将所述脱胶槽内的脱胶溶液回收至所述储液槽。
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CN203854109U (zh) * 2014-04-09 2014-10-01 阳光硅谷电子科技有限公司 一种硅棒切片预清洗脱胶机的喷淋槽
CN205614859U (zh) * 2016-05-13 2016-10-05 苏州晶樱光电科技有限公司 一种硅棒切割用晶托板脱胶装置
CN215969506U (zh) * 2021-09-06 2022-03-08 楚雄隆基硅材料有限公司 一种脱胶装置和脱胶系统

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