WO2023026709A1 - Condensateur électrolytique solide et procédé de fabrication de condensateur électrolytique solide - Google Patents

Condensateur électrolytique solide et procédé de fabrication de condensateur électrolytique solide Download PDF

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Publication number
WO2023026709A1
WO2023026709A1 PCT/JP2022/027209 JP2022027209W WO2023026709A1 WO 2023026709 A1 WO2023026709 A1 WO 2023026709A1 JP 2022027209 W JP2022027209 W JP 2022027209W WO 2023026709 A1 WO2023026709 A1 WO 2023026709A1
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Prior art keywords
electrolytic capacitor
anode
solid electrolytic
layer
cathode
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PCT/JP2022/027209
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English (en)
Japanese (ja)
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泰央 田中
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株式会社村田製作所
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Priority to JP2023543742A priority Critical patent/JPWO2023026709A1/ja
Publication of WO2023026709A1 publication Critical patent/WO2023026709A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes

Definitions

  • the present invention relates to a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor.
  • a masking portion (mask layer) is provided to insulate the anode portion and the cathode portion to prevent the solid electrolyte from creeping up, etc., and the thickness of the solid electrolyte layer in the peripheral portion of the valve-acting metal porous substrate is A solid electrolytic capacitor element having a thickness greater than the thickness of the solid electrolyte layer in the central portion of the porous valve metal substrate is disclosed.
  • the solid electrolyte layer tends to be thin and stress is likely to be applied near the mask layer. is likely to occur. As a result, there is a possibility that the breakdown voltage and reflow resistance may be deteriorated.
  • the reflow resistance means resistance to stress during reflow of the finished solid electrolytic capacitor.
  • Patent Document 1 there is no specific description of how to provide a conductive layer such as a conductive paste on the solid electrolyte layer. If formed, the entire solid electrolytic capacitor element becomes thick, and since there is no space for the conductive adhesive that connects the solid electrolytic capacitor elements to enter, the volumetric efficiency of the assembled solid electrolytic capacitor deteriorates.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a thin solid electrolytic capacitor.
  • a further object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor that can realize a thin solid electrolytic capacitor.
  • a solid electrolytic capacitor of the present invention is a solid electrolytic capacitor comprising a laminate in which a plurality of solid electrolytic capacitor elements are laminated via a conductive adhesive, wherein each of the solid electrolytic capacitor elements is formed from a valve action metal substrate.
  • an anode having a distal surface and a proximal surface; a dielectric layer provided on at least one main surface of the anode excluding at least the proximal surface; a mask layer provided on the dielectric layer; and a cathode provided on the dielectric layer on the tip surface side of the mask layer, wherein the cathode is provided on the dielectric layer.
  • the conductive adhesive is provided in a region sandwiched between the remaining portions of the cathodes of adjacent solid electrolytic capacitor elements without exceeding the maximum thickness of the cathode.
  • a method of manufacturing a solid electrolytic capacitor element of the present invention is a method of manufacturing a solid electrolytic capacitor element of the present invention, wherein the anode having the mask layer formed on the dielectric layer is removed from the tip surface side of the mask. a first step of immersing the anode in a treatment liquid containing a solid electrolyte until it contacts the layer; a second step of withdrawing the anode from the treatment liquid to dry the treatment liquid; a third step of immersing the anode in the conductive paste from the tip surface side, and a fourth step of pulling the anode out of the conductive paste and drying the conductive paste, the second step and the In at least one of the fourth steps, the anode is dried while being turned upside down from the time of immersion.
  • a thin solid electrolytic capacitor can be provided. Furthermore, according to the present invention, it is possible to provide a method for manufacturing a solid electrolytic capacitor that can realize a thin solid electrolytic capacitor.
  • FIG. 1 is a perspective view schematically showing an example of a solid electrolytic capacitor according to an embodiment of the invention.
  • FIG. 2 is a cross-sectional view of the solid electrolytic capacitor shown in FIG. 1 along line ZZ.
  • 3 is a plan view schematically showing an example of a solid electrolytic capacitor element included in the solid electrolytic capacitor shown in FIG. 1.
  • FIG. 4 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line XX.
  • FIG. 5 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line YY. 6 is an enlarged cross-sectional view of the base end portion of the solid electrolytic capacitor element shown in FIG. 4.
  • FIG. 7 is an enlarged cross-sectional view of the mask layer portion of the solid electrolytic capacitor element shown in FIG.
  • FIG. 8 is a cross-sectional view schematically showing an example of a solid electrolytic capacitor according to another embodiment of the invention.
  • 9 is a plan view schematically showing an example of a solid electrolytic capacitor element included in the solid electrolytic capacitor shown in FIG. 8.
  • FIG. 10 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 9 taken along line XX.
  • 11 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 9 taken along line YY.
  • FIG. 12 is a schematic diagram showing an example of a step of immersing an anode with a mask layer formed thereon in a treatment liquid containing a solid electrolyte or a conductive paste.
  • FIG. 13 is a schematic diagram showing an example of a process of pulling up the anode from the treatment liquid and drying the treatment liquid or the conductive paste.
  • 14 is a plan view schematically showing an example of a solid electrolytic capacitor element after forming a solid electrolyte layer or a conductive layer through the drying process shown in FIG. 13.
  • FIG. FIG. 15 is a schematic diagram showing an example of a process of preparing a valve metal substrate on which a mask layer is formed.
  • FIG. 16 is a schematic diagram showing an example of a process of forming a solid electrolyte layer or a cathode layer.
  • the solid electrolytic capacitor and the method for manufacturing the solid electrolytic capacitor of the present invention will be described below.
  • the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. Combinations of two or more of the individual desirable configurations described below are also part of the present invention.
  • FIG. 1 is a perspective view schematically showing an example of a solid electrolytic capacitor according to an embodiment of the invention.
  • FIG. 2 is a cross-sectional view of the solid electrolytic capacitor shown in FIG. 1 along line ZZ.
  • L indicates the length direction of the solid electrolytic capacitor 100 and the exterior body 110
  • W indicates the width direction
  • T indicates the height direction.
  • the length direction L, the width direction W, and the height direction T are orthogonal to each other.
  • the solid electrolytic capacitor 100 has a substantially rectangular parallelepiped outer shape.
  • Solid electrolytic capacitor 100 includes a laminate in which a plurality of solid electrolytic capacitor elements 1 are laminated via conductive adhesive 140 . Further, solid electrolytic capacitor 100 includes exterior body 110 , first external electrode 120 , second external electrode 130 , and multiple solid electrolytic capacitor elements 1 .
  • the exterior body 110 seals a plurality of solid electrolytic capacitor elements 1 . That is, a plurality of solid electrolytic capacitor elements 1 are embedded in exterior body 110 .
  • the exterior body 110 has a substantially rectangular parallelepiped outer shape.
  • the exterior body 110 has a first major surface 110a and a second major surface 110b that face each other in the height direction T, a first side face 110c and a second side face 110d that face each other in the width direction W, and a first side face 110c and a second side face 110d that face each other in the length direction L. It has one end face 110e and a second end face 110f.
  • the exterior body 110 has a substantially rectangular parallelepiped outer shape, and the corners and ridges are preferably rounded.
  • a corner is a portion where three surfaces of the exterior body 110 intersect, and a ridge is a portion where two surfaces of the exterior body 110 intersect.
  • the exterior body 110 is made of sealing resin, for example.
  • the sealing resin contains at least resin, and preferably contains resin and filler.
  • epoxy resin epoxy resin, phenol resin, polyimide resin, silicone resin, polyamide resin, liquid crystal polymer, etc. are preferably used.
  • Silica particles, alumina particles, etc. are preferably used as the filler.
  • a material containing solid epoxy resin, phenol resin, and silica particles is preferably used as the sealing resin.
  • resin molds such as compression molds and transfer molds are preferably used, and compression molds are more preferably used.
  • molding methods such as a dispensing method and a printing method are preferably used. Among them, it is preferable to seal the periphery of the solid electrolytic capacitor element 1 with a sealing resin by compression molding to form the exterior body 110 .
  • the exterior body 110 may be composed of a substrate and a sealing resin provided on the substrate.
  • the substrate is, for example, an insulating resin substrate such as a glass epoxy substrate.
  • the bottom surface of the substrate constitutes the second main surface 110b of the exterior body 110.
  • the thickness of the substrate is, for example, 100 ⁇ m.
  • a plurality of solid electrolytic capacitor elements 1 are stacked in the height direction T with conductive adhesive 140 interposed therebetween.
  • the extension direction of each of the plurality of solid electrolytic capacitor elements 1 is substantially parallel to the first main surface 110a and the second main surface 110b of the exterior body 110 .
  • Solid electrolytic capacitor elements 1 are bonded to each other via conductive adhesive 140 .
  • the conductive adhesive 140 contains, for example, metal particles such as gold, silver, copper, platinum, etc., and resin.
  • metal particles such as gold, silver, copper, platinum, etc.
  • resin such as gold, silver, copper, platinum, etc.
  • silver is used as the metal particles
  • acrylic resin is used as the resin.
  • Other examples of the resin contained in the conductive adhesive 140 include urethane resin, epoxy resin, polyimide resin, phenol resin, and the like.
  • Each solid electrolytic capacitor element 1 includes an anode 10 made of a valve action metal substrate 11, a dielectric layer 20, a mask layer 30, and a cathode 40.
  • the cathode 40 includes a solid electrolyte layer 50 and a cathode 40. , and a conductive layer 60 . The structure of each solid electrolytic capacitor element 1 will be described later.
  • the first external electrode 120 is provided on the first end face 110e of the exterior body 110.
  • the first external electrode 120 is provided from the first end surface 110e of the exterior body 110 over each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d.
  • First external electrode 120 is electrically connected to conductive layer 60 of cathode 40 of solid electrolytic capacitor element 1 exposed from exterior body 110 at first end face 110e.
  • the first external electrode 120 may be directly or indirectly connected to the conductive layer 60 on the first end face 110 e of the outer casing 110 .
  • the second external electrode 130 is provided on the second end face 110f of the exterior body 110.
  • the second external electrode 130 is provided from the second end surface 110f of the exterior body 110 over each of the first main surface 110a, the second main surface 110b, the first side surface 110c, and the second side surface 110d.
  • Second external electrode 130 is electrically connected to anode 10 (valve metal substrate 11) of solid electrolytic capacitor element 1 exposed from exterior body 110 at second end surface 110f.
  • the second external electrode 130 may be directly or indirectly connected to the anode 10 (valve metal substrate 11 ) at the second end surface 110 f of the exterior body 110 .
  • the first external electrode 120 and the second external electrode 130 are each formed by a dip coating method, a screen printing method, a transfer method, an inkjet printing method, a dispensing method, a spray coating method, a brush coating method, a drop casting method, an electrostatic coating method, It is preferably formed by at least one method selected from the group consisting of plating and sputtering.
  • the first external electrode 120 preferably has a resin electrode layer containing a conductive component and a resin component. Since the first external electrode 120 contains a resin component, the adhesion between the first external electrode 120 and the sealing resin of the exterior body 110 is enhanced, thereby improving reliability.
  • the second external electrode 130 preferably has a resin electrode layer containing a conductive component and a resin component. Since the second external electrode 130 contains a resin component, the adhesion between the second external electrode 130 and the sealing resin of the exterior body 110 is enhanced, thereby improving the reliability.
  • the conductive component preferably contains, as a main component, an elemental metal such as silver, copper, nickel, or tin, or an alloy containing at least one of these metals.
  • the resin component preferably contains epoxy resin, phenol resin, etc. as the main component.
  • the resin electrode layer is formed by methods such as dip coating, screen printing, transfer, inkjet printing, dispensing, spray coating, brush coating, drop casting, and electrostatic coating.
  • the resin electrode layer is preferably a printed resin electrode layer formed by applying a conductive paste by a screen printing method.
  • the resin electrode layer is formed by applying a conductive paste by a screen printing method, compared with the case where the resin electrode layer is formed by applying a conductive paste by a dip coating method, the first external electrode 120 And the second external electrode 130 tends to be flat. That is, the thicknesses of the first external electrode 120 and the second external electrode 130 tend to be uniform.
  • both the first external electrode 120 and the cathode conductor layer contain a resin component, so reliability is improved. improves.
  • At least one of the first external electrode 120 and the second external electrode 130 may have a so-called plated layer formed by a plating method.
  • plating layers include zinc/silver/nickel layers, silver/nickel layers, nickel layers, zinc/nickel/gold layers, nickel/gold layers, zinc/nickel/copper layers, and nickel/copper layers.
  • a copper plated layer, a nickel plated layer, and a tin plated layer are preferably provided in this order (or with the exception of some plated layers).
  • At least one of the first external electrode 120 and the second external electrode 130 may have both a resin electrode layer and a plating layer.
  • the second external electrode 130 may have a resin electrode layer connected to the anode 10 (valve metal substrate 11) and an outer plated layer provided on the surface of the resin electrode layer.
  • the second external electrode 130 includes an inner plated layer connected to the anode 10 (valve metal substrate 11), a resin electrode layer provided to cover the inner plated layer, and a resin electrode layer provided on the surface of the resin electrode layer. and an outer plated layer.
  • FIG. 3 is a plan view schematically showing an example of a solid electrolytic capacitor element included in the solid electrolytic capacitor shown in Fig. 1.
  • FIG. 4 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line XX.
  • FIG. 5 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line YY. 6 is an enlarged cross-sectional view of the base end portion of the solid electrolytic capacitor element shown in FIG. 4.
  • FIG. 4 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line XX.
  • FIG. 4 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 3 along line XX.
  • FIG. 5 is a cross-
  • the solid electrolytic capacitor element 1 shown in FIGS. 3, 4, 5 and 6 comprises a valve action metal substrate 11, an anode 10 having a distal end surface 10a and a proximal end surface 10b, and an anode 10 except for the proximal end surface 10b.
  • a dielectric layer 20 provided on the surface of the dielectric layer 20 a mask layer 30 made of an insulating material and provided on the dielectric layer 20 along the base end face 10b, and a dielectric layer 30 on the tip face 10a side of the mask layer 30 a cathode 40 provided on the body layer 20, the cathode 40 comprising a solid electrolyte layer 50 provided on the dielectric layer 20; a conductive layer 60 provided on the solid electrolyte layer 50; have.
  • the cathode 40 On one main surface 10c side of the anode 10, the cathode 40 has a convex portion 41a along the mask layer 30, and the cathode 40 (the solid electrolyte layer 50 and the conductive layer 60) does not exceed the maximum thickness t1 (see FIG. 6) of the cathode 40 (the solid electrolyte layer 50 and the conductive layer 60) in the convex portion 41a. Similarly, on the side of the other main surface 10d of the anode 10, the cathode 40 has convex portions 41b along the mask layer 30, and the cathode 40 (solid electrolyte layer 50 and the conductive layer 60) does not exceed the maximum thickness t2 (see FIG.
  • the cathode 40 (the solid electrolyte layer 50 and the conductive layer 60) in the convex portion 41b.
  • the conductive adhesive 140 is provided in a region sandwiched between the remaining portions 42 of the cathodes 40 of the adjacent solid electrolytic capacitor elements 1 in the solid electrolytic capacitor 100, as shown in FIG.
  • the conductive adhesive 140 does not cover the thickest portions 43 of the cathodes 40 of the adjacent solid electrolytic capacitor elements 1. It is preferable not to provide the entire area sandwiched between the projections 41 of the cathode 40 .
  • the term “convex portion” includes a projecting portion of the surface and a base portion overlapping the projecting portion.
  • thickness of the cathode in the remainder refers to the maximum thickness of the remainder of the cathode.
  • the thickness of the solid electrolytic capacitor element 1 at the remaining portions 42a and 42b does not exceed the thickness Tmax of the solid electrolytic capacitor element 1 at the thickest portions 43a and 43b of the convex portions 41a and 41b, similarly, the solid electrolytic capacitor The thickness of the entire element 1 can be suppressed more effectively.
  • the thickest portions 43a and 43b are portions where the thicknesses of the convex portions 41a and 41b are the thickest, respectively.
  • the cathode 40 has, on one main surface 10c side of the anode 10, an outer peripheral portion 45a including the protrusions 41a and a central portion 46a surrounded by the outer peripheral portion 45a. is greater than the thickness of the cathode 40 in the central portion 46a (see FIGS. 3-5).
  • the cathode 40 has, on the other main surface 10d side of the anode 10, an outer peripheral portion 45b including the protrusions 41b and a central portion 46b surrounded by the outer peripheral portion 45b.
  • the thickness of 40 is greater than the thickness of cathode 40 in central portion 46b.
  • a conductive adhesive 140 is then applied over the central portions 46a, 46b. Thereby, it is possible to prevent the conductive adhesive 140 from protruding from the cathode 40 .
  • the anode 10 is a square-shaped thin film (foil) formed from the valve action metal base 11, and preferably has a rectangular shape (strip shape) having a pair of long sides and a pair of short sides.
  • the distal end surface 10a and the proximal end surface 10b are end surfaces located on a pair of sides (preferably a pair of short sides) of the anode 10, and the proximal end surface 10b is an exposed end surface not covered with the dielectric layer 20, It is exposed at one end face of the solid electrolytic capacitor and connected to an external electrode which will be described later.
  • the anode 10 has a distal end surface 10a, a proximal end surface 10b, main surfaces 10c and 10d, and side surfaces 10e and 10f.
  • planar view means viewing from the direction normal to the main surface of the anode (valve action metal substrate).
  • FIG. 7 is an enlarged cross-sectional view of the mask layer portion of the solid electrolytic capacitor element shown in FIG.
  • each main surface of the valve metal substrate 11 (anode 10) is provided with a plurality of recesses. Therefore, each main surface of the valve metal substrate 11 is porous. As a result, the surface area of the valve metal substrate 11 is increased.
  • Both main surfaces of the valve action metal substrate 11 are not limited to being porous, and only one of the two main surfaces of the valve action metal substrate 11 may be porous.
  • the valve action metal substrate 11 is made of, for example, a single metal such as aluminum, tantalum, niobium, titanium, or zirconium, or a valve action metal such as an alloy containing these metals.
  • An oxide film can be formed on the surface of the valve metal.
  • the valve action metal substrate 11 may be composed of a core portion and a porous portion provided on at least one main surface of the core portion.
  • a porous fine powder sintered body or the like can be used as appropriate.
  • Dielectric layer 20 is provided here on the surface of anode 10 except for base end surface 10b. That is, the dielectric layer 20 is provided on the distal end surface 10a, the main surfaces 10c and 10d, and the side surfaces 10e and 10f of the anode 10, while the dielectric layer 20 is provided on the proximal end surface 10b of the anode 10. not However, dielectric layer 20 may be provided on at least one of major surfaces 10c and 10d of anode 10 except for base end surface 10b.
  • the dielectric layer 20 is preferably composed of an oxide film provided on the surface of the valve action metal substrate 11 .
  • dielectric layer 20 is composed of an oxide of aluminum.
  • the oxide of aluminum is formed by anodizing the surface of the valve action metal substrate 11, as will be described later.
  • the mask layer 30 is a linear (extending in a strip) insulating member provided on the dielectric layer 20 along the base end surface 10b of the anode 10, preferably along the short side of the anode 10, It separates the anode 10 and the cathode 40 to ensure insulation therebetween.
  • the mask layer 30 divides the anode 10 into a region on the side of the proximal end surface 10b and a region on the side of the distal end surface 10a.
  • the mask layer 30 is arranged at a predetermined distance from the base end surface 10b, but may be arranged up to the base end surface 10b.
  • the mask layer 30 is provided on the main surfaces 10c and 10d and the side surfaces 10e and 10f of the anode 10 with the dielectric layer 20 interposed therebetween. It may be provided on at least one of 10c and 10d (however, the main surface on which dielectric layer 20 is provided).
  • the mask layer 30 is preferably provided so as to fill a plurality of pores (concave portions) of the valve metal substrate 11 .
  • the mask layer 30 only needs to partially cover the outer surface of the dielectric layer 20, and there may be pores (recesses) in the valve metal substrate 11 that are not filled with the mask layer 30. .
  • the mask layer 30 is made of an insulating material.
  • the mask layer 30 is formed, for example, by applying a mask material such as a composition containing an insulating resin.
  • insulating resins include polyphenylsulfone (PPS), polyethersulfone (PES), cyanate ester resin, fluorine resin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), and soluble polyimide.
  • Compositions comprising siloxane and epoxy resins, polyimide resins, polyamideimide resins, derivatives or precursors thereof, and the like are included.
  • the application of the mask material can be performed, for example, by screen printing, roller transfer, dispenser, inkjet printing, or the like.
  • the cathode 40 has a solid electrolyte layer 50 provided on the dielectric layer 20 and a conductive layer 60 provided on the solid electrolyte layer 50 . Also, the cathode 40 is provided on the dielectric layer 20 on the tip surface 10 a side of the mask layer 30 . That is, it is provided on the dielectric layer 20 in a region on the tip surface 10 a side of the anode 10 partitioned by the mask layer 30 .
  • the cathode 40 has, on one main surface 10c side of the anode 10, a convex portion 41a along the mask layer 30 and a remaining portion 42a excluding the convex portion 41a, and on the other main surface 10d side of the anode 10. , a convex portion 41b along the mask layer 30 and a remaining portion 42b excluding the convex portion 41b.
  • the convex portion 41 is a thick film portion in which the cathode 40 is partially thickened, and is formed in a linear shape (strip shape) parallel to the mask layer 30 . That is, the convex portion 41 is a linear convex portion.
  • the convex portion 41 has an arcuate surface when viewed in cross section in the direction orthogonal to the mask layer 30, but has a trapezoidal or triangular surface.
  • the cathode 40 has a substantially line-symmetrical shape with the anode 10 as the axis of symmetry when viewed in a cross section in a direction perpendicular to the mask layer 30 . That is, the convex portions 41a and 41b have substantially the same shape, the remaining portions 42a and 42b have substantially the same shape, and the thickest portions 43a and 43b are located at substantially the same location on the anode 10.
  • the thickness of the cathode 40 in the remaining portion 42a does not exceed the maximum thickness t1 of the cathode 40 in the convex portion 41a. does not exceed the maximum thickness t2 of the cathode 40 at the projection 41b. That is, the thickness of the cathode 40 in the remaining portion 42a is smaller than or substantially the same as the maximum thickness t1 of the cathode 40 in the convex portion 41a, and the thickness of the cathode 40 in the remaining portion 42b is the maximum thickness t2 of the cathode 40 in the convex portion 41b. less than or about the same as
  • the difference between the maximum thickness t1 of the cathode 40 in the convex portion 41a and the thickness of the cathode 40 in the remaining portion 42a, particularly the central portion 46a is preferably 5 ⁇ m or more and 100 ⁇ m or less, for example, 10 ⁇ m or more, It is more preferably 70 ⁇ m or less, and even more preferably 15 ⁇ m or more and 40 ⁇ m or less.
  • the "thickness of the cathode” refers to the thickness in the direction normal to one main surface of the anode.
  • the cathode 40 has an outer peripheral portion 45a including the projections 41a and a central portion 46a surrounded by the outer peripheral portion 45a on the one main surface 10c side of the anode 10, and the other main surface 10d of the anode 10. It has an outer peripheral portion 45b including the convex portion 41b and a central portion 46b surrounded by the outer peripheral portion 45b.
  • Each of the outer peripheral portions 45a and 45b includes convex portions 41a and 41b along the mask layer 30, and a U-shaped portion 47a which is a substantially U-shaped portion along the tip surface 10a and side surfaces 10e and 10f of the anode 10, respectively. , 47b and .
  • the thickness of the convex portions 41a and 41b may be substantially the same as the thickness of the U-shaped portions 47a and 47b, respectively, or may be greater than the thickness of the U-shaped portions 47a and 47b.
  • Each of the U-shaped portions 47a and 47b has a cross-sectional shape similar to that of the convex portions 41a and 41b, respectively, and has an arc-shaped surface when viewed in cross section in a direction orthogonal to the extending direction. may have trapezoidal or triangular surfaces.
  • a base end 44 of the cathode 40 is located on the outer major surface of the mask layer 30 (the major surface opposite to the anode 10).
  • the cathode 40 may be provided so as to partially cover the outer main surface of the mask layer 30 as shown in FIG. 6, or may be provided so as to cover the entire outer main surface of the mask layer 30. good. Also, the cathode 40 may be arranged side by side in contact with the mask layer 30 so as not to cover the entire outer major surface of the mask layer 30 .
  • the solid electrolyte layer 50 is provided on the dielectric layer 20 . As shown in FIG. 7 , the solid electrolyte layer 50 is preferably provided so as to fill a plurality of pores (recesses) of the valve metal substrate 11 . However, it suffices that a portion of the outer surface of the dielectric layer 20 is covered with the solid electrolyte layer 50, and there are pores (recesses) of the valve action metal substrate 11 that are not filled with the solid electrolyte layer 50. good too.
  • the solid electrolyte layer 50 is provided on the dielectric layer 20 on the tip surface 10 a side of the mask layer 30 . That is, it is provided on the dielectric layer 20 in a region on the tip surface 10 a side of the anode 10 partitioned by the mask layer 30 .
  • the thickness of the solid electrolyte layer 50 gradually decreases from the vicinity of the tip surface 10a of the anode 10 toward the mask layer 30 on each main surface 10c, 10d side of the anode 10.
  • the material forming the solid electrolyte layer 50 for example, conductive polymers such as polypyrroles, polythiophenes, and polyanilines are used. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene) called PEDOT is particularly preferred. Moreover, the conductive polymer may contain a dopant such as polystyrene sulfonic acid (PSS).
  • PSS polystyrene sulfonic acid
  • the solid electrolyte layer 50 is formed by depositing a conductive material such as poly(3,4-ethylenedioxythiophene) on the surface of the dielectric layer 20 using a liquid containing a polymerizable monomer such as 3,4-ethylenedioxythiophene. It is formed by a method of forming a polymeric film, a method of applying a dispersion of a conductive polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric layer 20 and drying it, or the like. .
  • the inner layer can be formed by, for example, a dipping method, sponge transfer, screen printing, dispenser, inkjet printing, or the like.
  • the outer layer can be formed by, for example, a dipping method, sponge transfer, screen printing, dispenser, inkjet printing, or the like.
  • the conductive layer 60 is provided on the solid electrolyte layer 50 .
  • the conductive layer 60 has a larger thickness in the outer peripheral portion than in the central portion on each of the main surfaces 10c and 10d of the anode 10, so that the cathode 40 has the convex portion 41, the remaining portion 42, and the outer peripheral portion as described above. 45, central portion 46, etc. are formed.
  • the conductive layer 60 includes, for example, a carbon layer or a cathode conductor layer. Also, the conductive layer 60 may be a composite layer in which a cathode conductor layer is provided on the outer surface of a carbon layer, or a mixed layer containing carbon and a cathode conductor layer material.
  • the carbon layer is formed, for example, by applying a carbon paste containing carbon particles and resin to the surface of the solid electrolyte layer 50 and drying it.
  • Carbon paste can be applied by, for example, an immersion method, sponge transfer, screen printing, spray coating, dispenser, inkjet printing, or the like.
  • the cathode conductor layer is formed, for example, by a method of applying a conductive paste containing metal particles such as gold, silver, copper, platinum, and a resin to the surface of the solid electrolyte layer or carbon layer and drying the paste.
  • the cathode conductor layer is preferably a silver layer.
  • the conductive paste can be applied by, for example, dipping, sponge transfer, screen printing, spray coating, dispenser, inkjet printing, or the like.
  • the thickness of the solid electrolytic capacitor element 1 at the remaining portions 42a and 42b does not exceed the thickness Tmax of the solid electrolytic capacitor element 1 at the thickest portions 43a and 43b. That is, the thickness of the solid electrolytic capacitor element 1 at the remaining portions 42a and 42b is smaller than or substantially the same as the thickness Tmax of the solid electrolytic capacitor element 1 at the thickest portions 43a and 43b. Note that when the convex portions 41a and 41b are present on both main surface sides of the anode 10, the thickness Tmax of the solid electrolytic capacitor element 1 at the thickest portions 43a and 43b is two planes parallel to the anode 10 and the thickest portion It may be a biplanar spacing passing through the vertices of 43a and 43b respectively.
  • FIG. 8 is a cross-sectional view schematically showing an example of a solid electrolytic capacitor according to another embodiment of the invention.
  • the plurality of solid electrolytic capacitor elements 2 are laminated in the height direction T with the conductive adhesive 140 interposed.
  • Each solid electrolytic capacitor element 2 like the solid electrolytic capacitor element 1, comprises an anode 10 composed of a valve action metal substrate 11, a dielectric layer 20, a mask layer 30, and a cathode 40,
  • the cathode 40 has a solid electrolyte layer 50 and a conductive layer 60 .
  • FIG. 9 is a plan view schematically showing an example of a solid electrolytic capacitor element included in the solid electrolytic capacitor shown in FIG. 8.
  • FIG. 10 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 9 taken along line XX.
  • 11 is a cross-sectional view of the solid electrolytic capacitor element shown in FIG. 9 taken along line YY.
  • the solid electrolyte layer 50 includes, on one main surface 10c side of the anode 10, an outer peripheral portion 55a including convex portions 51a along the mask layer 30,
  • the solid electrolyte layer 50 has a central portion 56a surrounded by the outer peripheral portion 55a, and the thickness of the solid electrolyte layer 50 in the outer peripheral portion 55a is greater than the thickness of the solid electrolyte layer 50 in the central portion 56a.
  • solid electrolyte layer 50 has, on the other main surface 10d side of anode 10, outer peripheral portion 55b including protrusions 51b along mask layer 30, and central portion 56b surrounded by outer peripheral portion 55b.
  • the thickness of the solid electrolyte layer 50 in the peripheral portion 55b is greater than the thickness of the solid electrolyte layer 50 in the central portion 56b.
  • the conductive layer 60 on the solid electrolyte layer 50 has a substantially constant thickness.
  • the projection 41, the remaining portion 42, the outer peripheral portion 45, the central portion 46, and the like are formed on the cathode 40 as described above.
  • the outer peripheral portions 55a and 55b of the solid electrolyte layer 50 are projections 51a and 51b along the mask layer 30 and approximately U-shaped portions along the tip surface 10a and side surfaces 10e and 10f of the anode 10, respectively. and U-shaped portions 57a, 57b.
  • the thickness of the convex portions 51a and 51b may be substantially the same as the thickness of the U-shaped portions 57a and 57b, respectively, or may be greater than the thickness of the U-shaped portions 57a and 57b.
  • Solid electrolytic capacitors 100 and 200 can be manufactured by the following method. First, a method for manufacturing solid electrolytic capacitor elements 1 and 2 will be described.
  • FIG. 12 is a schematic diagram showing an example of a process of immersing an anode with a mask layer formed in a treatment liquid containing a solid electrolyte or a conductive paste.
  • FIG. 13 is a schematic diagram showing an example of a process of pulling up the anode from the treatment liquid and drying the treatment liquid or the conductive paste.
  • 14 is a plan view schematically showing an example of a solid electrolytic capacitor element after forming a solid electrolyte layer or a conductive layer through the drying process shown in FIG. 13.
  • FIG. 13 is a schematic diagram showing an example of a process of immersing an anode with a mask layer formed in a treatment liquid containing a solid electrolyte or a conductive paste.
  • FIG. 13 is a schematic diagram showing an example of a process of pulling up the anode from the treatment liquid and drying the treatment liquid or the conductive paste.
  • 14 is a plan view schematically showing an example of a solid electrolytic capacitor element after forming a solid
  • anode 10 having mask layer 30 formed on dielectric layer 20 is immersed in treatment liquid 70 containing a solid electrolyte until it contacts mask layer 30 from tip surface 10a.
  • the processing liquid 70 is supplied to a processing bath 75 .
  • the anode 10 is pulled up from the treatment liquid 70 to dry the treatment liquid 70 (second step).
  • the anode 10 from which the treatment liquid 70 has been dried is immersed in the conductive paste 71 from the tip side until it contacts the mask layer 30 (third step).
  • the conductive paste 71 is supplied to the processing bath 75 in FIG. 12, it is actually supplied to a processing bath different from the processing liquid 70.
  • the anode 10 is pulled up from the conductive paste 71 and the conductive paste 71 is dried (fourth step). Then, in at least one of the second step and the fourth step, as shown in FIG. 13, the anode 10 is dried while being turned upside down from when it was immersed. That is, the anode 10 is dried with the tip surface 10a of the anode 10 facing upward and the base end surface 10b of the anode 10 facing downward.
  • the cathode 40 having the projections 41 can be formed along the mask layer 30, and the thickness of the cathode 40 in the remaining portion 42 does not exceed the maximum thickness of the cathode in the projections 41. be able to.
  • the coffee ring effect of the treatment liquid 70 or the conductive paste 71 causes the solid electrolyte layer 50 and/or the conductive layer 50 to be thickened only in the peripheral portion 45 as shown in FIG. A layer 60 is formed.
  • This coffee ring effect is caused by the properties of the treatment liquid 70 or the conductive paste 71, such as viscosity, surface tension, and contact angle.
  • the anode 10 may be dried while being turned upside down from when it was immersed. That is, in the drying process for forming the conductive layer 60, the anode 10 may be turned upside down and dried. Thereby, as shown in FIG. 4, the thickness of the outer peripheral portion of the conductive layer 60 can be made larger than the thickness of the central portion of the conductive layer 60 .
  • the third step and the fourth step may be performed alternately a plurality of times in this order.
  • the anode 10 is turned upside down from the time of immersion. Drying is preferable, and it is more preferable to dry the anode 10 in a state in which the anode 10 is turned upside down from the time of immersion in each of the plurality of times of the fourth step.
  • the conductive layer 60 includes a carbon layer and a cathode conductor layer, as described above. That is, the concept of the conductive paste in which the anode 10 is immersed in the third step includes carbon paste.
  • the conductive pastes in which the anode 10 is immersed in the third step a plurality of times are usually different types of conductive pastes, but may be the same type of conductive paste.
  • the anode 10 may be dried while being turned upside down from when it was immersed. That is, in the drying process for forming the solid electrolyte layer 50, the anode 10 may be turned upside down and dried. Thereby, as shown in FIG. 10, the thickness of the peripheral portion 55 of the solid electrolyte layer 50 can be made larger than the thickness of the central portion 56 of the solid electrolyte layer 50 .
  • the first step and the second step may be performed alternately a plurality of times in this order.
  • the anode 10 is turned upside down from the time of immersion. It is preferable to dry, and it is more preferable to dry the anode 10 in a state in which the anode 10 is turned upside down from the time of immersion in each of the plurality of second steps.
  • This aspect is suitable when the inner layer and the outer layer of the solid electrolyte layer 50 are separately formed as described above.
  • the treatment liquids in which the anode 10 is immersed in the first step a plurality of times may be the same type of treatment liquid, or may be different types of treatment liquids.
  • the anode 10 is dried in the same direction as when immersed, while in the fourth step (for forming the conductive layer 60 drying step), the anode 10 may be dried in a state in which it is turned upside down from when it was immersed.
  • solid electrolytic capacitor element 1 in which solid electrolyte layer 50 swells only near tip surface 10a of anode 10 as shown in FIG. 4 can be formed.
  • the anode 10 is dried while being turned upside down from the time of immersion, and in the fourth step (forming the conductive layer 60 drying process), the anode 10 may be dried in a state in which it is turned upside down from when it was immersed.
  • solid electrolytic capacitor element 2 in which solid electrolyte layer 50 swells near tip surface 10a of anode 10 and near mask layer 30 as shown in FIG. 10 can be formed.
  • a method for manufacturing the solid electrolytic capacitor elements 1 and 2 will be described in more detail below. In the following example, a method for simultaneously manufacturing a plurality of solid electrolytic capacitor elements using a large-sized valve action metal substrate will be described.
  • FIG. 15 is a schematic diagram showing an example of a process for preparing a valve metal base on which a mask layer is formed.
  • Valve action metal substrate 11A having a dielectric layer 20 on its surface is prepared.
  • Valve action metal substrate 11A includes a plurality of element portions 12 and support portions 13 .
  • Each element portion 12 is strip-shaped and protrudes from the support portion 13 .
  • a mask layer 30 is formed on the dielectric layer 20 of each element portion 12 .
  • valve action metal substrate 11A having a porous portion on its surface is cut by laser processing, punching, or the like to be processed into a shape including a plurality of element portions 12 and support portions 13 .
  • mask layers 30 are formed on both main surfaces and both side surfaces of the element portions 12 along the short sides of each element portion 12 .
  • valve action metal substrate 11A is anodized to form an oxide film that will become the dielectric layer 20 on the surface of the valve action metal substrate 11A.
  • an oxide film is also formed on the side surfaces of the element portion 12 cut by laser processing, punching, or the like.
  • a chemically processed foil on which an oxide of a valve action metal has already been formed may be used as the valve action metal substrate 11A.
  • an oxide film is formed on the side surface of the cut element portion 12 by anodizing the cut valve metal substrate 11A.
  • FIG. 16 is a schematic diagram showing an example of a process of forming a solid electrolyte layer or a cathode layer.
  • a solid electrolyte layer 50 (see FIG. 7, etc.) is formed on the dielectric layer 20 of the element section 12 .
  • FIG. 16 shows a state in which a processing liquid 70 containing a solid electrolyte, a conductive paste 71 or a carbon paste 72 is supplied to the processing bath 75 .
  • a conductive polymer dispersion is used as the treatment liquid 70 containing a solid electrolyte.
  • a conductive polymer film can be formed by applying a conductive polymer dispersion to the outer surface of the dielectric layer 20 and drying it.
  • a liquid containing a polymerizable monomer such as 3,4-ethylenedioxythiophene and an oxidizing agent may be used as the treatment liquid 70 containing a solid electrolyte.
  • a liquid containing a polymerizable monomer can be attached to the outer surface of the dielectric layer 20 to form a conductive polymer film by chemical polymerization. This conductive polymer film becomes the solid electrolyte layer 50 .
  • the treatment liquid 70 is impregnated into the porous portion of the valve action metal substrate 11A.
  • the valve metal substrate 11A is pulled out of the treatment liquid 70 and dried at a predetermined temperature for a predetermined time.
  • the solid electrolyte layer 50 is formed by repeating immersion in the treatment liquid 70 , pulling up, and drying a predetermined number of times. At this time, at least one time of drying, for example, all times of drying, the valve metal substrate 11A is turned upside down from the time of immersion, that is, with the element portion 12 up and the support portion 13 down.
  • the treatment liquid 70 may be dried.
  • valve-acting metal substrate 11A After immersing the valve-acting metal substrate 11A in a first dispersion liquid containing a conductive polymer and pulling it out, the valve-acting metal substrate 11A is dried in a state in which the valve-acting metal substrate 11A is turned upside down from the time of immersion, thereby obtaining a first solid. forming an electrolyte layer; The immersion in the first dispersion, pulling up and drying may be performed multiple times.
  • the primer layer may be formed by immersing the valve metal substrate 11A in a solution containing a primer compound, pulling it out, and drying it.
  • valve-acting metal substrate 11A is immersed in a second dispersion liquid containing a conductive polymer and pulled out, and then dried in a state in which the valve-acting metal substrate 11A is turned upside down from the time of immersion to obtain a second solid. forming an electrolyte layer;
  • the solid electrolyte layer formed by the above method includes a first solid electrolyte layer provided on the dielectric layer and a second solid electrolyte layer provided on the first solid electrolyte layer.
  • valve action metal substrate 11A is washed with pure water to remove excess primer compound. After washing, a drying process is performed. As described above, the solid electrolyte layer 50 is formed in a predetermined region.
  • the valve metal substrate 11A is immersed in the carbon paste 72, pulled out, and dried to form a carbon layer in a predetermined region.
  • the carbon paste 72 may be dried with the valve metal substrate 11A turned upside down from the time of immersion, that is, with the element portion 12 up and the support portion 13 down.
  • the valve action metal substrate 11A is immersed in a conductive paste 71 containing metal particles such as silver paste, pulled out, and dried to form the cathode conductor layer in a predetermined region. Form.
  • the conductive paste 71 may be dried with the valve metal substrate 11A turned upside down, that is, with the element portion 12 up and the support portion 13 down.
  • valve action metal substrate 11A is cut to separate the element portion 12 to form the strip-shaped anode 10 .
  • a plurality of solid electrolytic capacitor elements 1 and 2 are stacked.
  • the conductive layers 60 of the adjacent solid electrolytic capacitor elements 1 and 2 are connected by a conductive adhesive.
  • a plurality of solid electrolytic capacitor elements 1 and 2 are molded using an insulating resin such as epoxy resin.
  • an insulating resin such as epoxy resin
  • a plurality of solid electrolytic capacitor elements 1 and 2 are mounted in the upper mold by molding, and an insulating resin such as epoxy resin is heated and melted in the cavity of the lower mold. and the lower mold are clamped to solidify the insulating resin, thereby forming the exterior body 110 .
  • the solid electrolytic capacitor elements 1 and 2 and the exterior body 110 are cut so that the base end portions of the solid electrolytic capacitor elements 1 and 2 are divided and the tip end portions of the solid electrolytic capacitor elements 1 and 2 are exposed.
  • the solid electrolytic capacitor elements 1 and 2 and the exterior body 110 are cut by press cutting, dicing, or laser cutting. A chip is formed by this process.
  • the base end surface 10b of the anode 10 is exposed on the cut surface on the base end side of the solid electrolytic capacitor elements 1 and 2, and the cathode 40 (conductive layer 60) is exposed on the cut surface on the tip side of the solid electrolytic capacitor elements 1 and 2. ) is exposed.
  • the tip is enclosed in a small box called a barrel together with an abrasive material, and the tip is polished by rotating the barrel. As a result, the corners and edges of the chip are rounded.
  • the first external electrode 120 and the second external electrode 130 are formed on both ends of the chip.
  • a Cu plating layer is formed on both ends of the chip by electroplating.
  • a Ni plating layer is formed on the Cu plating layer by electrolytic plating.
  • a Sn plating layer is formed on the Ni plating layer by electroplating.
  • the solid electrolytic capacitors 100 and 200 are manufactured through the above steps.
  • the cathode 40 has the outer peripheral portion 45 and the central portion 46 has been described. It may have a second protrusion (protrusion) along the tip surface 10a and a flat portion excluding the first and second protrusions, and the thickness of the first and second protrusions is flat. It may be larger than the thickness of the part.
  • Example 1 An aluminum foil having an etching layer on its surface was prepared as an anode (valve metal substrate), and immersed in an ammonium adipate aqueous solution for anodization to form a dielectric layer on the surface of the aluminum foil.
  • a mask layer was formed on both main surfaces and both side surfaces of the anode with the dielectric layer interposed therebetween by roller-transferring a composition composed of a soluble polyimidesiloxane and an epoxy resin onto the anode on which the dielectric layer was formed.
  • the element was immersed in a mixed solution of iron (III) p-toluenesulfonate, 3,4-ethylenedioxythiophene, and 1-butanol up to just below the mask layer, pulled out, and then dried in the same direction as the immersion direction. , a solid electrolyte layer was formed on the dielectric layer. As shown in FIG. 4, the thickness of the solid electrolyte layer gradually decreased from the vicinity of the tip surface of the anode toward the mask layer on each main surface side of the anode.
  • the thickness of the obtained element immediately below the mask layer that is, the thickness of the portion adjacent to the mask layer on the tip side of the anode was 125 ⁇ m
  • the thickness of the lower end portion of the obtained element that is, the thickness of the tip side of the anode
  • the thickness of the central portion of the resulting device was 140 ⁇ m.
  • the element was immersed in the carbon paste to the point directly below the mask layer, pulled up, and then dried in a state where the top and bottom of the immersion direction were reversed to form a carbon layer. Thereafter, the element was immersed in silver paste in the same manner as the carbon layer to form a silver layer as a cathode conductor layer, thereby forming a conductive layer and obtaining a solid electrolytic capacitor element. That is, the element pulled up from the silver paste was dried in a state in which it was turned upside down with respect to the direction in which it was immersed in the silver paste, and a silver layer was formed. As shown in FIG.
  • the cathode including the carbon layer and the silver layer has, on both main surfaces of the anode, an outer peripheral portion including protrusions along the mask layer and a thicker than the outer peripheral portion surrounded by the outer peripheral portion. It had a thin central portion.
  • the maximum thickness of the cathode was 45 ⁇ m at the projections of the outer peripheral portion, 40 ⁇ m at the tip side portion of the anode at the outer peripheral portion, and 25 ⁇ m at the central portion.
  • the thickness of the obtained solid electrolytic capacitor element immediately below the mask layer that is, the thickness at the thickest part of the convex portion of the cathode was 210 ⁇ m, and the thickness excluding the conductive layer (carbon layer and silver layer) immediately below the mask layer was 125 ⁇ m.
  • the thickness of the lower end of the obtained solid electrolytic capacitor element that is, the thickness of the tip side of the anode was 200 ⁇ m, and the thickness of the lower end excluding the conductive layer (carbon layer and silver layer) was 160 ⁇ m.
  • the thickness of the central portion of the element was 170 ⁇ m, and the thickness of the central portion excluding the conductive layer (carbon layer and silver layer) was 140 ⁇ m.
  • the obtained four solid electrolytic capacitor elements were laminated using a conductive adhesive to obtain a laminate.
  • the conductive adhesive was applied to the central portion of the cathode of the solid electrolytic capacitor element.
  • the laminate was sealed with an epoxy resin and separated into pieces using a dicer.
  • a silver paste containing a resin component is screen-printed on the cathode-side and anode-side end faces of the solidified exterior body (sealing body) to form external electrodes on the cathode and anode, completing the solid electrolytic capacitor. got the goods
  • the thickness in the height direction of the finished solid electrolytic capacitor obtained was 1240 ⁇ m.
  • Example 2 A finished solid electrolytic capacitor was obtained in the same manner as in Example 1, except that the solid electrolyte layer was dried upside down from the direction in which it was immersed in the mixed solution. As shown in FIG. 10, the solid electrolyte layer has, on both main surfaces of the anode, an outer peripheral portion including projections along the mask layer and a central portion surrounded by the outer peripheral portion and thinner than the outer peripheral portion. had.
  • the thickness of the obtained element just below the mask layer that is, the thickness at the thickest part of the convex portion of the solid electrolyte layer was 160 ⁇ m
  • the thickness of the lower end portion of the obtained element that is, the thickness at the tip side of the anode was 140 ⁇ m.
  • the thickness of the central portion of the device was 130 ⁇ m. Furthermore, after forming the cathode, the thickness of the obtained solid electrolytic capacitor element immediately below the mask layer (thickness at the thickest part of the convex portion of the solid electrolyte layer) was 200 ⁇ m, and the thickness of the lower end of the obtained solid electrolytic capacitor element ( The thickness of the tip of the anode) was 180 ⁇ m, and the thickness of the central portion of the obtained solid electrolytic capacitor element was 150 ⁇ m. The thickness in the height direction of the finished product of the obtained solid electrolytic capacitor was 1200 ⁇ m.
  • Example 1 A finished solid electrolytic capacitor was obtained in the same manner as in Example 1, except that the cathode (carbon paste and silver paste) was dried upside down from the direction in which it was immersed in the mixed solution. .
  • the thickness of the cathode including the carbon layer and the silver layer gradually decreased from the vicinity of the tip surface of the anode toward the outer peripheral portion.
  • the thickness of the obtained element immediately below the mask layer that is, the thickness of the portion adjacent to the mask layer on the tip side of the anode was 125 ⁇ m.
  • the thickness of the lower end that is, the thickness of the tip side of the anode was 180 ⁇ m, and the thickness of the central portion of the resulting device was 140 ⁇ m.
  • the thickness of the obtained solid electrolytic capacitor element immediately below the mask layer was 135 ⁇ m
  • the thickness of the lower end portion of the obtained solid electrolytic capacitor element (thickness on the tip side of the anode) was 220 ⁇ m
  • the obtained solid The thickness of the central portion of the electrolytic capacitor element was 160 ⁇ m.
  • the thickness in the height direction of the finished solid electrolytic capacitor obtained was 1310 ⁇ m.
  • the thickness of the finished product is the sum of the thickness of the four elements, the thickness of the epoxy resin of 400 ⁇ m, and the thickness of the external electrode of 20 ⁇ m.
  • the thickness of the finished product is the sum of the thickness of the four elements, the thickness of the conductive adhesive of 30 ⁇ m, the thickness of the epoxy resin of 400 ⁇ m, and the thickness of the external electrode of 20 ⁇ m.
  • the thickness of the conductive adhesive is 30 ⁇ m. Since there is a space for disposing the conductive adhesive in the central portion of the solid electrolytic capacitor element, there is no need to consider the thickness of the conductive adhesive itself. This is because the thickness of the conductive adhesive itself must be taken into consideration because there is no space for disposing the conductive adhesive.
  • Example 2 since the thickness of the outer peripheral portion of the cathode of the solid electrolytic capacitor element is thick, the laminate can be laminated without increasing the thickness of the laminate when laminating using a conductive adhesive, and the thickness of the finished product can be reduced. could be thinned.
  • Reference Signs List 1 2 solid electrolytic capacitor element 10 anode 10a tip surface 10b base end surface 10c, 10d main surface 10e, 10f side surface 11, 11A valve action metal base 12 element portion 13 support portion 20 dielectric layer 30 mask layer 40 cathode 41a, 41b, 41 Protrusions 42a, 42b, 42 Remainder 43a, 43b, 43 Thickest portion 44 Base end 45a, 45b, 45 Peripheral portion 46a, 46b, 46 Central portion 47a, 47b, 47 U-shaped portion 50 Solid electrolyte layer 51a, 51b , 51 convex portions 55a, 55b, 55 outer peripheral portion 56a, 56b, 56 central portion 57a, 57b, 57 U-shaped portion 60 conductive layer 70 treatment liquid 71 conductive paste 72 carbon paste 75 treatment tank 100, 200 solid electrolytic capacitor 110 Exterior body 110a First main surface 110b Second main surface 110c First side surface 110d Second side surface 110e First end surface 110f Second end surface 120 First external electrode 130 Second external electrode 140 Conductive adhesive t

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Abstract

L'invention concerne un condensateur électrolytique solide 100 comprenant un stratifié obtenu par stratification d'une pluralité d'éléments de condensateur électrolytique solide 1 avec un adhésif conducteur 140 interposé entre ceux-ci. Chacun des éléments de condensateur à électrolyte solide 1 comprend : une anode 10 qui est formée à partir d'un substrat métallique à action de valve 11 et a une surface d'extrémité distale 10a et une surface d'extrémité proximale 10b ; une couche diélectrique 20 disposée sur au moins une surface principale 10c, 10d de l'anode 10 à l'exception d'au moins la surface d'extrémité proximale 10b ; une couche de masque 30 qui est formée à partir d'un matériau isolant et est disposée sur la couche diélectrique 20 le long de la surface d'extrémité proximale 10b ; et une cathode 40 disposée sur la couche diélectrique 20 davantage vers le côté de la surface d'extrémité distale 10a que la couche de masque 30. La cathode 40 a une couche d'électrolyte solide 50 disposée sur la couche diélectrique 20, une couche conductrice 60 disposée sur la couche d'électrolyte solide 50, et une saillie 41 le long de la couche de masque 30. L'épaisseur de la cathode 40 au niveau d'une partie restante 42 à l'exclusion de la saillie 41 ne dépasse pas l'épaisseur maximale de la cathode 40 au niveau de la saillie 41. L'adhésif conducteur est disposé dans une région prise en sandwich par la partie restante de la cathode respective des éléments de condensateur électrolytique solide adjacents.
PCT/JP2022/027209 2021-08-26 2022-07-11 Condensateur électrolytique solide et procédé de fabrication de condensateur électrolytique solide WO2023026709A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001075917A1 (fr) * 2000-03-31 2001-10-11 Showa Denko K.K. Condensateur electrolytique solide et son procede de production
JP2002025863A (ja) * 2000-07-07 2002-01-25 Showa Denko Kk 固体電解コンデンサ素子及びその製造方法
JP2004186684A (ja) * 2002-11-21 2004-07-02 Showa Denko Kk 固体電解コンデンサ及びその製造方法
JP2010028139A (ja) * 1999-12-10 2010-02-04 Showa Denko Kk 積層型固体電解コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028139A (ja) * 1999-12-10 2010-02-04 Showa Denko Kk 積層型固体電解コンデンサ
WO2001075917A1 (fr) * 2000-03-31 2001-10-11 Showa Denko K.K. Condensateur electrolytique solide et son procede de production
JP2002025863A (ja) * 2000-07-07 2002-01-25 Showa Denko Kk 固体電解コンデンサ素子及びその製造方法
JP2004186684A (ja) * 2002-11-21 2004-07-02 Showa Denko Kk 固体電解コンデンサ及びその製造方法

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