WO2023021908A1 - Substrate module, drive module, and electronic apparatus - Google Patents

Substrate module, drive module, and electronic apparatus Download PDF

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Publication number
WO2023021908A1
WO2023021908A1 PCT/JP2022/028170 JP2022028170W WO2023021908A1 WO 2023021908 A1 WO2023021908 A1 WO 2023021908A1 JP 2022028170 W JP2022028170 W JP 2022028170W WO 2023021908 A1 WO2023021908 A1 WO 2023021908A1
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WO
WIPO (PCT)
Prior art keywords
coil
laminate
vertical direction
main surface
viewed
Prior art date
Application number
PCT/JP2022/028170
Other languages
French (fr)
Japanese (ja)
Inventor
哲聡 奥田
伸郎 池本
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN202290000246.7U priority Critical patent/CN220357894U/en
Priority to JP2023540833A priority patent/JP7351440B2/en
Publication of WO2023021908A1 publication Critical patent/WO2023021908A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Definitions

  • the present invention relates to a board module with coils.
  • Patent Document 1 discloses a laminated coil component.
  • This laminated coil component includes a first laminated substrate, a second laminated substrate, and a coil.
  • the first laminated substrate is mounted on the second laminated substrate.
  • the coil includes a first coil element and a second coil element.
  • the first coil element is provided on the first laminated substrate.
  • the second coil element is provided on the second laminated substrate.
  • the first coil element is electrically connected to the second coil element via a conductive bonding material.
  • an object of the present invention is to provide a substrate module, a drive module, and an electronic device that can reduce the DC resistance value of the coil and improve the inductance value of the coil.
  • a substrate module includes: One of the vertical directions is the first direction, the other of the vertical directions is the second direction,
  • the board module a first laminate having a first main surface of the first laminate and a second main surface of the first laminate arranged vertically; It has a second laminated body first main surface and a second laminated body second main surface arranged in the vertical direction, is located in the second direction from the first laminated body, and is viewed in the vertical direction a second laminate overlapping the first laminate; a first coil provided in the first laminate, the first coil having a helical shape winding around a first coil axis extending in the vertical direction; A second coil provided in the second laminate, the second coil having a helical shape winding around a second coil axis extending in the vertical direction, when viewed in the vertical direction, a second coil overlapping the first coil; and
  • the first laminate is fixed with respect to the second laminate, The area of the second laminate seen in the vertical direction is larger than the area of the first laminate seen in the vertical direction,
  • the drive module of the present invention it is possible to reduce the DC resistance value of the coil and improve the inductance value of the coil.
  • FIG. 1 is a cross-sectional view of drive module 10 .
  • FIG. 2 is an exploded perspective view of the first laminate 13.
  • FIG. 3 is an exploded perspective view of the second laminate 14.
  • FIG. 4 is a cross-sectional view of the drive module 10a.
  • FIG. 5 is a cross-sectional view of drive module 10b.
  • FIG. 6 is a cross-sectional view of drive module 10c.
  • FIG. 7 is a cross-sectional view of drive module 10d.
  • FIG. 8 is a cross-sectional view of the drive module 10e.
  • FIG. 9 is a cross-sectional view of the drive module 10f.
  • FIG. 10 is a cross-sectional view of the electronic device 1.
  • FIG. 10 is a cross-sectional view of the electronic device 1.
  • FIG. 1 is a cross-sectional view of drive module 10 .
  • FIG. 2 is an exploded perspective view of the first laminate 13.
  • FIG. 3 is an exploded perspective view of the second laminate 14.
  • FIG. 1 is a cross-sectional view of drive module 10 .
  • FIG. 2 is an exploded perspective view of the first laminate 13.
  • FIG. 3 is an exploded perspective view of the second laminate 14.
  • the direction in which the first laminated body first main surface S1 and the first laminated body second main surface S2 of the first laminated body 13 are arranged is defined as the vertical direction.
  • One of the vertical directions is the first direction DIR1.
  • the other vertical direction is the second direction DIR2.
  • the first direction DIR1 is upward.
  • the second direction DIR2 is downward.
  • the left-right direction and the front-rear direction are orthogonal to the up-down direction.
  • the left-right direction is perpendicular to the front-rear direction. Note that the vertical direction, the front-rear direction, and the left-right direction in the present embodiment do not have to match the vertical direction, the front-rear direction, and the left-right direction when the drive module 10 is in use.
  • X is a part or member of the drive module 10.
  • each part of X is defined as follows.
  • front of X is meant the front half of X.
  • Back of X means the back half of X.
  • the left part of X means the left half of X.
  • the right part of X means the right half of X.
  • Top of X means the top half of X.
  • the lower part of X means the lower half of X.
  • the leading edge of X means the leading edge of X.
  • the trailing end of X means the trailing end of X.
  • the left end of X means the end of X in the left direction.
  • the right end of X means the end of X in the right direction.
  • the upper end of X means the end of X in the upward direction.
  • the lower end of X means the lower end of X.
  • the front end of X means the front end of X and its vicinity.
  • the rear end of X means the rear end of X and its vicinity.
  • the left end of X means the left end of X and its vicinity.
  • the right end of X means the right end of X and its vicinity.
  • the upper end of X means the upper end of X and its vicinity.
  • the lower end of X means the lower end of X and its vicinity.
  • the drive module 10 is used in wireless communication terminals such as smartphones.
  • the drive module 10 comprises a substrate module 11 and magnets 50 .
  • the board module 11 includes a first laminate 13, a second laminate 14, a first coil L1, a second coil L2, mounting electrodes 20a to 20f, 26a to 26f, 60a, 60b. , signal conductors 28, 29, 62a, 62b and interlayer connection conductors v6, v15, v31, v32.
  • the first laminate 13 has a plate shape. More specifically, as shown in FIG. 1, the first stacked body 13 has a first stacked body first main surface S1 and a first stacked body second main surface S2 arranged vertically. The first laminated body first main surface S1 is located above the first laminated body second main surface S2 (in the first direction DIR1). The first laminated body first main surface S1 and the first laminated body second main surface S2 have a rectangular shape when viewed in the vertical direction.
  • the first laminate 13 has a structure in which resin layers 15a to 15e (a plurality of first resin layers) and a protective layer 16 are laminated vertically.
  • the protective layer 16 and the resin layers 15a to 15e are arranged in this order from top to bottom.
  • the resin layers 15a to 15e have a rectangular shape when viewed in the vertical direction. However, a through hole h is provided in the center of each of the resin layers 15a to 15e so as to penetrate vertically. The through hole h has a rectangular shape when viewed in the vertical direction. A plurality of through holes h form a through hole H by connecting to one. In this manner, as shown in FIG. 1, the first laminate 13 is provided with a through hole H penetrating through the first laminate 13 in the vertical direction.
  • the material of the resin layers 15a to 15e is thermoplastic resin.
  • Thermoplastic resins are, for example, thermoplastic resins such as liquid crystal polymer and PTFE (polytetrafluoroethylene).
  • the material of the resin layers 15a-15e may be polyimide. Therefore, the material of the first laminate 13 is a non-magnetic material.
  • the protective layer 16 is a resist layer.
  • the protective layer 16 is located on the upper main surface of the resin layer 15a.
  • a through hole h is provided in the center of the protective layer 16 so as to penetrate vertically.
  • the protective layer 16 protects the first coil conductor 18a located on the upper main surface of the resin layer 15a.
  • the protective layer 16 may be formed by attaching an insulating sheet to the upper main surface of the resin layer 15a, or by printing an insulating resin paste on the upper main surface of the resin layer 15a. may be
  • the first coil L1 is provided on the first laminate 13, as shown in FIG.
  • the first coil L1 has a spiral shape winding around a first coil axis Ax1 extending in the vertical direction.
  • the first coil axis Ax1 is positioned in the through hole H when viewed in the vertical direction. Therefore, the first coil L1 winds around the through hole H when viewed in the vertical direction.
  • the first coil L1 includes first coil conductors 18a to 18d and interlayer connection conductors v1 to v5, as shown in FIG.
  • the first coil conductors 18a-18d are located on the upper main surfaces of the resin layers 15a-15d, respectively. As shown in FIG. 1, each of the first coil conductors 18a to 18d winds around the first coil axis Ax1 when viewed in the vertical direction. As shown in FIG. 2, the first coil conductors 18a and 18c have a spiral shape approaching the center while rotating counterclockwise when viewed downward. When viewed downward, the first coil conductors 18b and 18d have a spiral shape that rotates clockwise and approaches the center.
  • the ends of the first coil conductors 18a to 18d on the outer peripheral side are referred to as outer peripheral ends.
  • the inner peripheral side end portions of the first coil conductors 18a to 18d are referred to as inner peripheral end portions.
  • the mounting electrodes 20a to 20f are located on the lower main surface of the resin layer 15e, as shown in FIG.
  • the mounting electrode 20a is positioned near the front left corner of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrode 20b is positioned near the center of the left side of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrode 20c is positioned near the left rear corner of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrode 20d is positioned near the front right corner of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrode 20e is positioned near the center of the right side of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrode 20f is positioned near the right rear corner of the lower main surface of the resin layer 15e when viewed in the vertical direction.
  • the mounting electrodes 20a to 20f have a rectangular shape when
  • Each of the interlayer connection conductors v1 to v5 vertically penetrates the resin layers 15a to 15e, as shown in FIG.
  • the interlayer connection conductor v1 electrically connects the inner peripheral end of the first coil conductor 18a and the inner peripheral end of the first coil conductor 18b.
  • the interlayer connection conductor v2 electrically connects the outer peripheral edge of the first coil conductor 18b and the outer peripheral edge of the first coil conductor 18c.
  • the interlayer connection conductor v3 electrically connects the inner peripheral end of the first coil conductor 18c and the inner peripheral end of the first coil conductor 18d.
  • the interlayer connection conductor v4 and the interlayer connection conductor v5 are connected in series in the vertical direction.
  • the interlayer connection conductors v4 and v5 electrically connect the outer peripheral end of the first coil conductor 18d and the mounting electrode 20b.
  • the interlayer connection conductor v6 vertically penetrates the resin layers 15a to 15e, as shown in FIG.
  • the interlayer connection conductor v6 electrically connects the outer peripheral end of the first coil conductor 18a and the mounting electrode 20a.
  • the first coil conductors 18a to 18d and the mounting electrodes 20a to 20f are conductor layers formed by etching metal foils attached to the upper or lower main surfaces of the resin layers 15a to 15e.
  • the metal foil is, for example, copper foil.
  • the interlayer connection conductors v1 to v6 are via-hole conductors formed by filling conductive paste in through-holes penetrating vertically through the resin layers 15a to 15e and solidifying the conductive paste by heating.
  • the interlayer connection conductors v1 to v6 may be through-hole conductors formed by plating the inner peripheral surfaces of through holes penetrating vertically through the resin layers 15a to 15e.
  • the second laminated body 14 has a second laminated body first main surface S3 and a second laminated body second main surface S4 arranged vertically.
  • the second laminated body first main surface S3 is located above the second laminated body second main surface S4 (in the first direction DIR1).
  • the first main surface S3 of the second laminate and the second main surface S4 of the second laminate have a rectangular shape when viewed in the vertical direction.
  • the second laminate 14 has a structure in which resin layers 22a to 22f (a plurality of second resin layers) are laminated vertically.
  • the resin layers 22a to 22f are arranged in this order from top to bottom.
  • the resin layers 22a to 22f have a rectangular shape when viewed in the vertical direction.
  • the material of the resin layers 22a-22f is a thermoplastic resin.
  • Thermoplastic resins are, for example, thermoplastic resins such as liquid crystal polymer and PTFE (polytetrafluoroethylene).
  • the material of the resin layers 22a-22f may be polyimide. Therefore, the material of the second laminate 14 is a non-magnetic material.
  • the material of the resin layers 22a-22f (second resin layer) is the same as the material of the resin layers 15a-15e (first resin layer).
  • the second coil L2 is provided on the second laminate 14, as shown in FIG.
  • the second coil L2 has a helical shape winding around a vertically extending second coil axis Ax2.
  • the second coil axis Ax2 is positioned in the through hole H when viewed in the vertical direction.
  • the second coil axis Ax2 overlaps the first coil axis Ax1 when viewed in the vertical direction.
  • the second coil L2 overlaps the first coil L1 when viewed in the vertical direction.
  • the second coil L2 includes second coil conductors 24a to 24d and interlayer connection conductors v11 to v14, as shown in FIG.
  • the second coil conductors 24a-24d are located on the upper main surfaces of the resin layers 22b-22e, respectively.
  • Each of the second coil conductors 24a to 24d winds around the second coil axis Ax2 when viewed in the vertical direction.
  • the second coil conductors 24a and 24c have a spiral shape approaching the center while rotating counterclockwise when viewed downward. When viewed downward, the second coil conductors 24b and 24d have a spiral shape that rotates clockwise and approaches the center.
  • the ends of the second coil conductors 24a to 24d on the outer peripheral side are referred to as outer peripheral ends.
  • the ends on the inner peripheral side of the second coil conductors 24a to 24d are called inner peripheral ends.
  • the mounting electrodes 26a to 26f are located on the upper main surface of the resin layer 22a.
  • the mounting electrode 26a is positioned near the front left corner of the upper main surface of the resin layer 22a when viewed in the vertical direction.
  • the mounting electrode 26b is positioned near the center of the left side of the upper main surface of the resin layer 22a when viewed in the vertical direction.
  • the mounting electrode 26c is positioned near the left rear corner of the upper main surface of the resin layer 22a when viewed in the vertical direction.
  • Each of the mounting electrodes 26d to 26f is positioned to the right of the mounting electrodes 26a to 26c when viewed in the vertical direction.
  • the mounting electrodes 26a to 26f have a rectangular shape when viewed in the vertical direction.
  • Each of the interlayer connection conductors v11 to v14 vertically penetrates the resin layers 22a to 22d.
  • the interlayer connection conductor v11 electrically connects the mounting electrode 26b and the outer peripheral end of the second coil conductor 24a.
  • the interlayer connection conductor v12 electrically connects the inner peripheral end of the second coil conductor 24a and the inner peripheral end of the second coil conductor 24b.
  • the interlayer connection conductor v13 electrically connects the outer peripheral end of the second coil conductor 24b and the outer peripheral end of the second coil conductor 24c.
  • the interlayer connection conductor v14 electrically connects the inner peripheral end of the second coil conductor 24c and the inner peripheral end of the second coil conductor 24d.
  • the signal conductor 28 is located on the upper main surface of the resin layer 22d.
  • the signal conductor 28 has a linear shape extending in the left-right direction.
  • the left end of the signal conductor 28 overlaps the mounting electrode 26a when viewed in the vertical direction.
  • the signal conductor 29 is located on the upper main surface of the resin layer 22e.
  • the signal conductor 29 has a linear shape extending in the left-right direction.
  • the left end of the signal conductor 29 is connected to the outer peripheral end of the second coil conductor 24d.
  • the interlayer connection conductor v15 vertically penetrates the resin layers 22a to 22c.
  • the interlayer connection conductor v15 electrically connects the left end of the signal conductor 28 and the mounting electrode 26a.
  • the mounting electrodes 60a and 60b are located on the first main surface S3 of the second laminate, as shown in FIG. Accordingly, the mounting electrodes 60a and 60b are located on the upper main surface of the resin layer 22a. As shown in FIG. 1, the mounting electrodes 60a and 60b overlap the through holes H when viewed in the vertical direction. The mounting electrodes 60a and 60b are arranged in this order from left to right. The mounting electrodes 60a and 60b have a rectangular shape when viewed in the vertical direction.
  • the signal conductor 62a is located on the upper main surface of the resin layer 22f, as shown in FIG.
  • the signal conductor 62a has a linear shape extending in the left-right direction.
  • the left end of the signal conductor 62a overlaps the mounting electrode 60a when viewed in the vertical direction.
  • the signal conductor 62b is located on the upper main surface of the resin layer 22f.
  • the signal conductor 62b has a linear shape extending in the left-right direction.
  • the left end of the signal conductor 62b overlaps the mounting electrode 60b when viewed in the vertical direction.
  • the interlayer connection conductor v31 vertically penetrates the resin layers 22a to 22e.
  • the interlayer connection conductor v31 electrically connects the mounting electrode 60a and the left end of the signal conductor 62a.
  • the interlayer connection conductor v32 vertically penetrates the resin layers 22a to 22e.
  • the interlayer connection conductor v32 electrically connects the mounting electrode 60b and the left end of the signal conductor 62b.
  • the second coil conductors 24a-24d, the signal conductors 28, 29, 62a, 62b and the mounting electrodes 60a, 60b are formed by etching a metal foil attached to the upper main surface of the resin layers 22a-22e. It is a conductive layer.
  • the metal foil is, for example, copper foil.
  • the interlayer connection conductors v11 to v15, v31, and v32 are via-hole conductors formed by filling conductive paste in through-holes vertically penetrating the resin layers 22a to 22e and solidifying the conductive paste by heating.
  • the interlayer connection conductors v11 to v15, v31, and v32 may be through-hole conductors formed by plating the inner peripheral surfaces of through holes penetrating the resin layers 22a to 22e in the vertical direction. .
  • the first laminate 13 is mounted on the second laminate first main surface S3 of the second laminate 14 .
  • the second stacked body 14 is located below the first stacked body 13 (in the second direction DIR2).
  • the second laminate 14 overlaps the first laminate 13 when viewed in the vertical direction.
  • the first stacked body 13 is positioned within a region surrounded by the outer edges of the second stacked body 14 when viewed in the vertical direction. That is, the area of the second stacked body 14 seen in the vertical direction is larger than the area of the first stacked body 13 seen in the vertical direction.
  • the first laminate 13 does not protrude from the outer edge of the second laminate 14 .
  • Each of the mounting electrodes 20a to 20f is fixed to the mounting electrodes 26a to 26f with a conductive bonding material.
  • the first coil L1 is electrically connected to the second coil L2 by mounting the first laminate 13 on the second laminate 14 with the conductive bonding material. More precisely, the first coil L1 is connected in series with the second coil L2.
  • the conductive bonding material is, for example, solder.
  • the magnet 50 is located above the first coil L1 (in the first direction DIR1), as shown in FIG.
  • the magnet 50 overlaps the first coil L1 when viewed in the vertical direction.
  • Magnet 50 extends in the left-right direction.
  • the left side of magnet 50 is the north pole.
  • the right portion of magnet 50 is the south pole.
  • Magnet 50 is a permanent magnet.
  • the magnet 50 may be an electromagnet.
  • the magnetic sensor 30 detects the magnetic force of the magnet 50.
  • the magnetic sensor 30 is a mounted component mounted on the first main surface S3 of the second laminate.
  • the magnetic sensor 30 includes a magnetic sensor body 32 and magnetic sensor mounting electrodes 34a and 34b.
  • the magnetic sensor main body 32 incorporates a magnetic sensor.
  • the magnetic sensor main body 32 has a rectangular parallelepiped shape.
  • the magnetic sensor mounting electrodes 34 a and 34 b are located on the lower surface of the magnetic sensor main body 32 .
  • Each of the magnetic sensor mounting electrodes 34a, 34b is fixed to the mounting electrodes 60a, 60b with a conductive bonding material such as solder.
  • the magnetic sensor 30 is surrounded by the first coil L1 and the second coil L2 when viewed in the vertical direction. Accordingly, at least a portion of the magnetic sensor 30 is positioned within the through hole H. As shown in FIG.
  • the upper end of the magnetic sensor 30 (the end in the first direction DIR1) is positioned below the first main surface S1 of the first laminate (second direction DIR2). That is, the upper surface of the magnetic sensor main body 32 of the magnetic sensor 30 is positioned below the first main surface S1 of the first laminate. Therefore, the magnetic sensor 30 does not protrude upward from the first main surface of the first laminate.
  • the average number of turns of the first coil conductors 18a to 18d is defined as the number of turns N1 of the first coil conductors 18a to 18d.
  • the average number of turns of the second coil conductors 24a-24d is defined as the number of turns N2 of the second coil conductors 24a-24d.
  • Each of the number of turns of the first coil conductors 18a-18d is approximately 1.5 turns. Therefore, the number of turns N1 of the first coil conductors 18a to 18d is approximately 1.5 turns.
  • Each of the number of turns of the second coil conductors 24a-24d is approximately 1.5 turns. Therefore, the number of turns N2 of the second coil conductors 24a to 24d is approximately 1.5 turns. Therefore, the number of turns N1 of the first coil conductors 18a-18d is substantially equal to the number of turns N2 of the second coil conductors 24a-24d.
  • the direction orthogonal to the direction in which the first coil conductors 18a to 18d and the second coil conductors 24a to 24d extend when viewed in the vertical direction is the line width direction.
  • the average width of the first coil conductors 18a to 18d in the line width direction is defined as the width W1 of the first coil conductors 18a to 18d in the line width direction.
  • the average width of the second coil conductors 24a to 24d in the line width direction is defined as the width W2 of the second coil conductors 24a to 24d in the line width direction.
  • the width W1 is smaller than the width W2.
  • the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the number of turns N2 of the second coil conductors 24a to 24d. It is smaller than the product X2 with the width W2 of 24d in the line width direction.
  • the drive module 10 as described above includes a control circuit (not shown).
  • the magnetic sensor 30, the first coil L1 and the second coil L2 are electrically connected to a control circuit.
  • the magnetic sensor 30 generates an output signal according to the magnitude of the magnetic force of the magnet 50 detected by the magnetic sensor 30 .
  • the control circuit controls the magnitude of the current that flows through the first coil L1 and the second coil L2. For example, when viewed downward, when a clockwise current flows through the first coil L1 and the second coil L2, a forward current flows through the conductors positioned to the left of the first coil L1 and the second coil L2. A current flows in the rearward direction through the conductors located on the right side of the first coil L1 and the second coil L2.
  • the lines of magnetic force are emitted from the N pole and the lines of magnetic force are applied to the S pole. Therefore, when a current flows forward in the conductors located on the left side of the first coil L1 and the second coil L2, the conductors located on the left side of the first coil L1 and the second coil L2 are subjected to the Lorentz force in the left direction. receive. When a current flows backward through the conductors located on the right side of the first coil L1 and the second coil L2, the conductors located on the right side of the first coil L1 and the second coil L2 receive Lorentz force in the left direction. . That is, the first coil L1 and the second coil L2 receive force from the magnet 50 in the left direction.
  • the magnet 50 receives force rightward from the first coil L1 and the second coil L2. As a result, the magnet 50 is displaced to the right with respect to the first coil L1 and the second coil L2. However, the first coil L1 and the second coil L2 may be displaced leftward with respect to the magnet 50 .
  • the conductors positioned on the right side of the first coil L1 and the second coil L2 receive Lorentz force in the right direction.
  • the first coil L1 and the second coil L2 receive force from the magnet 50 in the right direction.
  • the magnet 50 receives force in the left direction from the first coil L1 and the second coil L2.
  • the magnet 50 is displaced leftward with respect to the first coil L1 and the second coil L2.
  • the first coil L ⁇ b>1 and the second coil L ⁇ b>2 may be displaced to the right with respect to the magnet 50 .
  • the magnetic force generated by the first coil L1 and the second coil L2 changes the position of the magnet 50 with respect to the first coil L1 and the second coil L2.
  • the board module 11 it is possible to reduce the DC resistance value of the second coil L2 and improve the inductance value of the second coil L2. More specifically, the area of the second stacked body 14 seen in the vertical direction is larger than the area of the first stacked body 13 seen in the vertical direction. Therefore, it is easy to make the size of the second coil conductors 24a to 24d larger than the size of the first coil conductors 18a to 18d. Therefore, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil conductors.
  • the magnetic force generated by the first coil L1 and the second coil L2 changes the position of the magnet 50 with respect to the first coil L1 and the second coil L2.
  • a large current flows through the first coil L1 and the second coil L2. Therefore, in the drive module 10, it is desired to reduce the DC resistance value of the second coil L2. Therefore, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil conductors. It is smaller than the product X2 with the width W2 of 24a to 24d in the line width direction. Thereby, the DC resistance value of the second coil L2 is reduced.
  • the substrate module 11 has a structure suitable for the drive module 10. As shown in FIG.
  • the upper end of the magnetic sensor 30 (the end in the first direction DIR1) is located below the first main surface S1 of the first laminate (second direction DIR2). That is, the upper surface of the magnetic sensor main body 32 of the magnetic sensor 30 is positioned below the first main surface S1 of the first laminate. Therefore, the magnetic sensor 30 does not protrude upward from the first main surface S1 of the first laminate. As a result, the size of the substrate module 11 can be reduced in the vertical direction.
  • FIG. 4 is a cross-sectional view of the drive module 10a.
  • the drive module 10a differs from the drive module 10 in the number of turns N2 of the second coil conductors 24a to 24d. More specifically, the number of turns N1 of the first coil conductors 18a-18d is less than the number of turns N2 of the second coil conductors 24a-24d. In other words, the number of turns N2 of the second coil conductors 24a-24d is greater than the number of turns N1 of the first coil conductors 18a-18d.
  • the width W1 of the first coil conductors 18a to 18d in the line width direction is smaller than the width W2 of the second coil conductors 24a to 24d in the line width direction.
  • the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil It is smaller than the product X2 with the width W2 of the conductors 24a to 24d in the line width direction.
  • the rest of the structure of the drive module 10a is the same as that of the drive module 10, so the explanation is omitted.
  • the driving module 10 a can have the same effects as the driving module 10 .
  • the number of turns N1 of the first coil conductors 18a-18d is less than the number of turns N2 of the second coil conductors 24a-24d. In other words, the number of turns N2 of the second coil conductors 24a-24d is greater than the number of turns N1 of the first coil conductors 18a-18d. Thereby, the inductance value of the second coil L2 can be further improved.
  • FIG. 5 is a cross-sectional view of drive module 10b.
  • the drive module 10b differs from the drive module 10a in the width W2 in the line width direction of the second coil conductors 24a to 24d. More specifically, the width W1 of the first coil conductors 18a to 18d in the line width direction is equal to the width W2 of the second coil conductors 24a to 24d in the line width direction. However, in the drive module 10b, similarly to the drive module 10a, the number of turns N1 of the first coil conductors 18a-18d is smaller than the number of turns N2 of the second coil conductors 24a-24d.
  • the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil It is smaller than the product X2 with the width W2 of the conductors 24a to 24d in the line width direction.
  • the rest of the structure of the drive module 10b is the same as that of the drive module 10a, so the description is omitted.
  • the drive module 10b can have the same effects as the drive module 10a.
  • FIG. 6 is a cross-sectional view of drive module 10c.
  • the drive module 10c differs from the drive module 10 in that the first laminate 13 and the second laminate 14 are integrated by thermocompression bonding. More specifically, the resin layer 15e of the first laminate 13 and the resin layer 22a of the second laminate 14 are integrated by thermocompression bonding. Other structures of the drive module 10c are the same as those of the drive module 10, so description thereof is omitted. The drive module 10c can have the same effects as the drive module 10. FIG.
  • FIG. 7 is a cross-sectional view of drive module 10d.
  • the drive module 10d differs from the drive module 10b in the shape of the first coil L1. More specifically, the first coil L1 overlaps the innermost portion and the second innermost portion of the second coil L2 when viewed in the vertical direction. Therefore, the outermost portion of the second coil L2 does not overlap the first coil L1 when viewed in the vertical direction.
  • Other structures of the drive module 10d are the same as those of the drive module 10, so description thereof is omitted.
  • the drive module 10 d can have the same effects as the drive module 10 .
  • FIG. 8 is a cross-sectional view of the drive module 10e.
  • the drive module 10e differs from the drive module 10 in that it further includes a mounting component 70, mounting electrodes 80a and 80b, and interlayer connection conductors v41 and v42.
  • the mounting electrodes 80a and 80b are located on the first main surface S3 of the second laminate.
  • the interlayer connection conductor v41 vertically penetrates the resin layers 22a to 22d.
  • the interlayer connection conductor v41 electrically connects the mounting electrode 80a and the right end of the signal conductor .
  • the interlayer connection conductor v42 vertically penetrates the resin layers 22a to 22e.
  • the interlayer connection conductor v42 electrically connects the mounting electrode 80b and the right end of the signal conductor 62b.
  • the mounted component 70 is an electronic component mounted on the second laminate 14 .
  • the mounting component 70 is, for example, a control circuit that controls the magnitude of the current that flows through the first coil L1 and the second coil L2 based on the output signal generated by the magnetic sensor 30 .
  • the mounted component 70 is, for example, an IC (Integrated Circuit).
  • the mounting component 70 includes a mounting component body 72 and mounting component electrodes 74a and 74b.
  • the mounting component main body 72 has a rectangular parallelepiped shape. Mounted component electrodes 74 a and 74 b are provided on the lower surface of mounted component body 72 .
  • the mounting component electrodes 74a and 74b are fixed to the mounting electrodes 80a and 80b with a conductive bonding material, respectively. In this way, by mounting the mounted component 70 on the second laminate 14 with the conductive bonding material, the mounted component 70 and the second coil L2 are electrically connected to each other, and the mounted component 70 and the magnetic coupling are electrically connected to each other.
  • the sensor 30 is electrically connected to each other.
  • the conductive bonding material is, for example, solder.
  • Other structures of the drive module 10e are the same as those of the drive module 10, so description thereof is omitted.
  • the driving module 10 e can have the same effects as the driving module 10 .
  • interlayer connection conductor v31 and the signal conductor 62a may be electrically connected to the mounting component 70 via an interlayer connection conductor (not shown).
  • signal conductor 29 may be electrically connected to the mounting component 70 via an interlayer connection conductor (not shown).
  • FIG. 9 is a cross-sectional view of the drive module 10f.
  • the drive module 10f includes two sets of drive modules 10g and 10h.
  • Drive modules 10 g and 10 h have the same structure as drive module 10 .
  • the structure of the drive module 10h is symmetrical with the structure of the drive module 10g.
  • the second laminate 14 of the drive module 10g and the second laminate 14 of the drive module 10h are connected to form one laminate.
  • the drive modules 10g and 10h are integrated. Therefore, when the drive module 10f is attached to the electronic device, the drive module 10g and the drive module 10h are positioned more accurately than when the two drive modules are separately attached to the electronic device. Become.
  • FIG. 10 is a cross-sectional view of the electronic device 1.
  • the electronic device 1 is a wireless communication terminal such as a smartphone.
  • the electronic device 1 includes a drive module 10 , a battery 100 , a circuit board 110 and a housing 120 .
  • the drive module 10 is electrically connected to the circuit board 110 via a connector.
  • the substrate module 11 of the drive module 10 is flexible and therefore bent.
  • the deformation of the board module 11 may be plastic deformation, elastic deformation, or both plastic deformation and elastic deformation.
  • the battery 100 is located on the upper main surface of the circuit board 110 .
  • the battery 100 is electrically connected to the circuit board 110 by wiring (not shown).
  • Battery 100 supplies power to drive module 10 through circuit board 110 .
  • the housing 120 houses the drive module 10 , the battery 100 and the circuit board 110 .
  • the drive modules according to the present invention are not limited to the drive modules 10, 10a to 10f, and can be modified within the scope of the subject matter.
  • the configuration of the drive modules 10, 10a to 10f may be combined arbitrarily.
  • the board modules according to the present invention are not limited to the board modules 11, 11a to 11f, and can be modified within the scope of the gist thereof.
  • the configurations of the board modules 11, 11a to 11f may be combined arbitrarily.
  • the material of the resin layers 15a to 15e and 22a to 22f may be a material other than thermoplastic resin.
  • the magnetic sensor 30 does not have to be surrounded by the first coil L1 and the second coil L2 when viewed in the vertical direction.
  • the magnetic sensor 30 does not have to be positioned within the through hole H.
  • the magnetic sensor 30 may be positioned to the right of the first stack 13, for example.
  • the upper surface of the magnetic sensor 30 may be positioned above the first main surface S1 of the first laminate.
  • the material of the resin layers 22a-22f may be different from the material of the resin layers 15a-15e (first resin layer).
  • the substrate module 11 may be used in devices other than the drive modules 10, 10a to 10f.
  • the first coil L1 and the second coil L2 of the board module 11 may function as antennas, for example.
  • the first coil L1 and the second coil L2 may transmit and receive electric power, or transmit and receive high-frequency signals.
  • the signal conductors 62a and 62b may be positioned on the lower main surface of the resin layer 22f.
  • a protective layer is provided under the resin layer 22f to protect the signal conductors 62a and 62b.
  • the width of the signal conductors 28 and 29 in the line width direction may be larger than the width W1 of the first coil conductors 18a to 18d in the line width direction. That is, the width of the signal conductors 28 and 29 in the line width direction may be equal to the width W2 of the second coil conductors 24a to 24d in the line width direction. Thereby, the resistance of the signal conductors 28 and 29 is reduced.
  • the downward direction may be the first direction DIR1 and the upward direction may be the second direction DIR2.
  • first coil L1 may include one or more first coil conductors.
  • the second coil L2 may include one or more second coil conductors.
  • the electronic device 1 may include any one of the drive modules 10a to 10f instead of the drive module 10.

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Abstract

A first coil is provided in a first stacked body and has a spiral shape. A second coil is provided in a second stacked body and has a spiral shape. The first coil includes one or more first coil conductors that encircle the periphery of a first coil axis, when viewed in a vertical direction. The second coil includes one or more second coil conductors that encircle the periphery of a second coil axis, when viewed in the vertical direction. The area of the second stacked body when viewed in the vertical direction is greater than the area of the first stacked body when viewed in the vertical direction. The product of a number of turns of the first coil conductor and a width, in a line width direction, of the first coil conductor is less than the product of a number of turns of the second coil conductor and a width, in a line width direction, of the second coil conductor.

Description

基板モジュール、駆動モジュール及び電子機器Substrate modules, drive modules and electronics
　本発明は、コイルを備える基板モジュールに関する。 The present invention relates to a board module with coils.
　従来の基板モジュールに関する発明としては、例えば、特許文献１に積層コイル部品が知られている。この積層コイル部品は、第１積層基板、第２積層基板及びコイルを備えている。第１積層基板は、第２積層基板の上に実装されている。コイルは、第１コイル要素及び第２コイル要素を含んでいる。第１コイル要素は、第１積層基板に設けられている。第２コイル要素は、第２積層基板に設けられている。第１コイル要素は、第２コイル要素と導電性接合材を介して電気的に接続されている。 As an invention related to conventional board modules, for example, Patent Document 1 discloses a laminated coil component. This laminated coil component includes a first laminated substrate, a second laminated substrate, and a coil. The first laminated substrate is mounted on the second laminated substrate. The coil includes a first coil element and a second coil element. The first coil element is provided on the first laminated substrate. The second coil element is provided on the second laminated substrate. The first coil element is electrically connected to the second coil element via a conductive bonding material.
国際公開第２０１６／１３６６５３号公報International Publication No. 2016/136653
　ところで、特許文献１に記載の積層コイル部品において、コイルの直流抵抗値の低減及びコイルのインダクタンス値の向上が望まれている。 By the way, in the laminated coil component described in Patent Document 1, it is desired to reduce the DC resistance value of the coil and improve the inductance value of the coil.
　そこで、本発明の目的は、コイルの直流抵抗値の低減及びコイルのインダクタンス値の向上を実現できる基板モジュール、駆動モジュール及び電子機器を提供することである。 Therefore, an object of the present invention is to provide a substrate module, a drive module, and an electronic device that can reduce the DC resistance value of the coil and improve the inductance value of the coil.
　本発明の一形態に係る基板モジュールは、
　上下方向の一方が第１方向であり、上下方向の他方が第２方向であり、
　基板モジュールは、
　上下方向に並ぶ第１積層体第１主面及び第１積層体第２主面を有している第１積層体と、
　上下方向に並ぶ第２積層体第１主面及び第２積層体第２主面を有しており、かつ、前記第１積層体より前記第２方向に位置し、かつ、上下方向に見て前記第１積層体と重なっている第２積層体と、
　前記第１積層体に設けられている第１コイルであって、上下方向に延びる第１コイル軸の周囲を周回する螺旋形状を有している第１コイルと、
　前記第２積層体に設けられている第２コイルであって、上下方向に延びる第２コイル軸の周囲を周回する螺旋形状を有している第２コイルであって、上下方向に見て、前記第１コイルと重なっている第２コイルと、
　を備えており、
　前記第１積層体は、前記第２積層体に対して固定されており、
　上下方向に見た前記第２積層体の面積は、上下方向に見た前記第１積層体の面積より大きく、
　前記第１コイルは、前記第２コイルと電気的に接続されており、
　前記第１コイルは、上下方向に見て、前記第１コイル軸の周囲を周回する１以上の第１コイル導体を含んでおり、
　前記第２コイルは、上下方向に見て、前記第２コイル軸の周囲を周回する１以上の第２コイル導体を含んでおり、
　上下方向に見て、前記第１コイル導体及び前記第２コイル導体が延びる方向に直交する方向は、線幅方向であり、
　前記第１コイル導体の周回数と前記第１コイル導体の前記線幅方向の幅との積は、前記第２コイル導体の周回数と前記第２コイル導体の前記線幅方向の幅との積より小さい。 A substrate module according to one aspect of the present invention includes:
One of the vertical directions is the first direction, the other of the vertical directions is the second direction,
The board module
a first laminate having a first main surface of the first laminate and a second main surface of the first laminate arranged vertically;
It has a second laminated body first main surface and a second laminated body second main surface arranged in the vertical direction, is located in the second direction from the first laminated body, and is viewed in the vertical direction a second laminate overlapping the first laminate;
a first coil provided in the first laminate, the first coil having a helical shape winding around a first coil axis extending in the vertical direction;
A second coil provided in the second laminate, the second coil having a helical shape winding around a second coil axis extending in the vertical direction, when viewed in the vertical direction, a second coil overlapping the first coil;
and
The first laminate is fixed with respect to the second laminate,
The area of the second laminate seen in the vertical direction is larger than the area of the first laminate seen in the vertical direction,
The first coil is electrically connected to the second coil,
The first coil includes one or more first coil conductors winding around the first coil axis when viewed in the vertical direction,
The second coil includes one or more second coil conductors winding around the second coil axis when viewed in the vertical direction,
A direction orthogonal to the extending direction of the first coil conductor and the second coil conductor when viewed in the vertical direction is the line width direction,
The product of the number of turns of the first coil conductor and the width of the first coil conductor in the line width direction is the product of the number of turns of the second coil conductor and the width of the second coil conductor in the line width direction. less than
　本発明に係る駆動モジュールによれば、コイルの直流抵抗値の低減及びコイルのインダクタンス値の向上を実現できる。 According to the drive module of the present invention, it is possible to reduce the DC resistance value of the coil and improve the inductance value of the coil.
図１は、駆動モジュール１０の断面図である。FIG. 1 is a cross-sectional view of drive module 10 . 図２は、第１積層体１３の分解斜視図である。FIG. 2 is an exploded perspective view of the first laminate 13. FIG. 図３は、第２積層体１４の分解斜視図である。FIG. 3 is an exploded perspective view of the second laminate 14. FIG. 図４は、駆動モジュール１０ａの断面図である。FIG. 4 is a cross-sectional view of the drive module 10a. 図５は、駆動モジュール１０ｂの断面図である。FIG. 5 is a cross-sectional view of drive module 10b. 図６は、駆動モジュール１０ｃの断面図である。FIG. 6 is a cross-sectional view of drive module 10c. 図７は、駆動モジュール１０ｄの断面図である。FIG. 7 is a cross-sectional view of drive module 10d. 図８は、駆動モジュール１０ｅの断面図である。FIG. 8 is a cross-sectional view of the drive module 10e. 図９は、駆動モジュール１０ｆの断面図である。FIG. 9 is a cross-sectional view of the drive module 10f. 図１０は、電子機器１の断面図である。FIG. 10 is a cross-sectional view of the electronic device 1. FIG.
（実施形態）
［駆動モジュールの構造］
　以下に、本発明の実施形態に係る駆動モジュール１０の構造について図面を参照しながら説明する。図１は、駆動モジュール１０の断面図である。図２は、第１積層体１３の分解斜視図である。図３は、第２積層体１４の分解斜視図である。 (embodiment)
[Structure of drive module]
The structure of the driving module 10 according to the embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of drive module 10 . FIG. 2 is an exploded perspective view of the first laminate 13. FIG. FIG. 3 is an exploded perspective view of the second laminate 14. FIG.
　本明細書において、方向を以下のように定義する。第１積層体１３の第１積層体第１主面Ｓ１及び第１積層体第２主面Ｓ２が並ぶ方向を上下方向と定義する。上下方向の一方が第１方向ＤＩＲ１である。上下方向の他方が第２方向ＤＩＲ２である。本実施形態では、第１方向ＤＩＲ１は、上方向である。第２方向ＤＩＲ２は、下方向である。また、左右方向及び前後方向は、上下方向に直交している。左右方向は、前後方向に直交している。なお、本実施形態における上下方向、前後方向及び左右方向は、駆動モジュール１０の使用時における上下方向、前後方向及び左右方向と一致していなくてもよい。 In this specification, directions are defined as follows. The direction in which the first laminated body first main surface S1 and the first laminated body second main surface S2 of the first laminated body 13 are arranged is defined as the vertical direction. One of the vertical directions is the first direction DIR1. The other vertical direction is the second direction DIR2. In this embodiment, the first direction DIR1 is upward. The second direction DIR2 is downward. Moreover, the left-right direction and the front-rear direction are orthogonal to the up-down direction. The left-right direction is perpendicular to the front-rear direction. Note that the vertical direction, the front-rear direction, and the left-right direction in the present embodiment do not have to match the vertical direction, the front-rear direction, and the left-right direction when the drive module 10 is in use.
　以下では、Ｘは、駆動モジュール１０の部品又は部材である。本明細書において、特に断りのない場合には、Ｘの各部について以下のように定義する。Ｘの前部とは、Ｘの前半分を意味する。Ｘの後部とは、Ｘの後半分を意味する。Ｘの左部とは、Ｘの左半分を意味する。Ｘの右部とは、Ｘの右半分を意味する。Ｘの上部とは、Ｘの上半分を意味する。Ｘの下部とは、Ｘの下半分を意味する。Ｘの前端とは、Ｘの前方向の端を意味する。Ｘの後端とは、Ｘの後方向の端を意味する。Ｘの左端とは、Ｘの左方向の端を意味する。Ｘの右端とは、Ｘの右方向の端を意味する。Ｘの上端とは、Ｘの上方向の端を意味する。Ｘの下端とは、Ｘの下方向の端を意味する。Ｘの前端部とは、Ｘの前端及びその近傍を意味する。Ｘの後端部とは、Ｘの後端及びその近傍を意味する。Ｘの左端部とは、Ｘの左端及びその近傍を意味する。Ｘの右端部とは、Ｘの右端及びその近傍を意味する。Ｘの上端部とは、Ｘの上端及びその近傍を意味する。Ｘの下端部とは、Ｘの下端及びその近傍を意味する。 In the following, X is a part or member of the drive module 10. In this specification, unless otherwise specified, each part of X is defined as follows. By front of X is meant the front half of X. Back of X means the back half of X. The left part of X means the left half of X. The right part of X means the right half of X. Top of X means the top half of X. The lower part of X means the lower half of X. The leading edge of X means the leading edge of X. The trailing end of X means the trailing end of X. The left end of X means the end of X in the left direction. The right end of X means the end of X in the right direction. The upper end of X means the end of X in the upward direction. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.
　まず、図１を参照しながら、駆動モジュール１０の構造について説明する。駆動モジュール１０は、スマートフォン等の無線通信端末に用いられる。駆動モジュール１０は、基板モジュール１１及び磁石５０を備えている。 First, the structure of the drive module 10 will be described with reference to FIG. The drive module 10 is used in wireless communication terminals such as smartphones. The drive module 10 comprises a substrate module 11 and magnets 50 .
　基板モジュール１１は、図１ないし図３に示すように、第１積層体１３，第２積層体１４，第１コイルＬ１、第２コイルＬ２、実装電極２０ａ～２０ｆ，２６ａ～２６ｆ，６０ａ，６０ｂ、信号導体２８，２９，６２ａ，６２ｂ及び層間接続導体ｖ６，ｖ１５，ｖ３１，ｖ３２を備えている。第１積層体１３は、板形状を有している。より詳細には、第１積層体１３は、図１に示すように、上下方向に並ぶ第１積層体第１主面Ｓ１及び第１積層体第２主面Ｓ２を有している。第１積層体第１主面Ｓ１は、第１積層体第２主面Ｓ２より上（第１方向ＤＩＲ１）に位置している。第１積層体第１主面Ｓ１及び第１積層体第２主面Ｓ２は、上下方向に見て、長方形状を有している。 As shown in FIGS. 1 to 3, the board module 11 includes a first laminate 13, a second laminate 14, a first coil L1, a second coil L2, mounting electrodes 20a to 20f, 26a to 26f, 60a, 60b. , signal conductors 28, 29, 62a, 62b and interlayer connection conductors v6, v15, v31, v32. The first laminate 13 has a plate shape. More specifically, as shown in FIG. 1, the first stacked body 13 has a first stacked body first main surface S1 and a first stacked body second main surface S2 arranged vertically. The first laminated body first main surface S1 is located above the first laminated body second main surface S2 (in the first direction DIR1). The first laminated body first main surface S1 and the first laminated body second main surface S2 have a rectangular shape when viewed in the vertical direction.
　第１積層体１３は、図２に示すように、樹脂層１５ａ～１５ｅ（複数の第１樹脂層）及び保護層１６が上下方向に積層された構造を有している。本実施形態では、保護層１６及び樹脂層１５ａ～１５ｅが上から下へとこの順に並んでいる。 As shown in FIG. 2, the first laminate 13 has a structure in which resin layers 15a to 15e (a plurality of first resin layers) and a protective layer 16 are laminated vertically. In this embodiment, the protective layer 16 and the resin layers 15a to 15e are arranged in this order from top to bottom.
　樹脂層１５ａ～１５ｅは、上下方向に見て、長方形状を有している。ただし、樹脂層１５ａ～１５ｅのそれぞれの中央には、上下方向に貫通する貫通孔ｈが設けられている。貫通孔ｈは、上下方向に見て、長方形状を有している。複数の貫通孔ｈは、一つにつながることにより、貫通孔Ｈを形成している。このように、第１積層体１３には、図１に示すように、第１積層体１３を上下方向に貫通する貫通孔Ｈが設けられている。樹脂層１５ａ～１５ｅの材料は、熱可塑性樹脂である。熱可塑性樹脂は、例えば、液晶ポリマー、ＰＴＦＥ（ポリテトラフロオロエチレン）等の熱可塑性樹脂である。樹脂層１５ａ～１５ｅの材料は、ポリイミドであってもよい。従って、第１積層体１３の材料は、非磁性材料である。 The resin layers 15a to 15e have a rectangular shape when viewed in the vertical direction. However, a through hole h is provided in the center of each of the resin layers 15a to 15e so as to penetrate vertically. The through hole h has a rectangular shape when viewed in the vertical direction. A plurality of through holes h form a through hole H by connecting to one. In this manner, as shown in FIG. 1, the first laminate 13 is provided with a through hole H penetrating through the first laminate 13 in the vertical direction. The material of the resin layers 15a to 15e is thermoplastic resin. Thermoplastic resins are, for example, thermoplastic resins such as liquid crystal polymer and PTFE (polytetrafluoroethylene). The material of the resin layers 15a-15e may be polyimide. Therefore, the material of the first laminate 13 is a non-magnetic material.
　保護層１６は、レジスト層である。保護層１６は、樹脂層１５ａの上主面に位置している。保護層１６の中央には、上下方向に貫通する貫通孔ｈが設けられている。保護層１６は、樹脂層１５ａの上主面に位置する第１コイル導体１８ａを保護している。保護層１６は、絶縁性のシートが樹脂層１５ａの上主面に貼り付けられることにより形成されてもよいし、絶縁性の樹脂ペーストが樹脂層１５ａの上主面に印刷されることにより形成されてもよい。 The protective layer 16 is a resist layer. The protective layer 16 is located on the upper main surface of the resin layer 15a. A through hole h is provided in the center of the protective layer 16 so as to penetrate vertically. The protective layer 16 protects the first coil conductor 18a located on the upper main surface of the resin layer 15a. The protective layer 16 may be formed by attaching an insulating sheet to the upper main surface of the resin layer 15a, or by printing an insulating resin paste on the upper main surface of the resin layer 15a. may be
　第１コイルＬ１は、図１に示すように、第１積層体１３に設けられている。第１コイルＬ１は、上下方向に延びる第１コイル軸Ａｘ１の周囲を周回する螺旋形状を有している。第１コイル軸Ａｘ１は、上下方向に見て、貫通孔Ｈに位置している。従って、第１コイルＬ１は、上下方向に見て、貫通孔Ｈの周囲を周回している。 The first coil L1 is provided on the first laminate 13, as shown in FIG. The first coil L1 has a spiral shape winding around a first coil axis Ax1 extending in the vertical direction. The first coil axis Ax1 is positioned in the through hole H when viewed in the vertical direction. Therefore, the first coil L1 winds around the through hole H when viewed in the vertical direction.
　第１コイルＬ１は、図２に示すように、第１コイル導体１８ａ～１８ｄ、層間接続導体ｖ１～ｖ５を含んでいる。第１コイル導体１８ａ～１８ｄのそれぞれは、樹脂層１５ａ～１５ｄの上主面に位置している。第１コイル導体１８ａ～１８ｄのそれぞれは、図１に示すように、上下方向に見て、第１コイル軸Ａｘ１の周囲を周回している。第１コイル導体１８ａ，１８ｃは、図２に示すように、下方向に見て、反時計回りに周回しながら中心に近づく渦巻形状を有している。第１コイル導体１８ｂ，１８ｄは、下方向に見て、時計回りに周回しながら中心に近づく渦巻形状を有している。以下では、第１コイル導体１８ａ～１８ｄの外周側の端部を外周端部と呼ぶ。第１コイル導体１８ａ～１８ｄの内周側の端部を内周端部と呼ぶ。 The first coil L1 includes first coil conductors 18a to 18d and interlayer connection conductors v1 to v5, as shown in FIG. The first coil conductors 18a-18d are located on the upper main surfaces of the resin layers 15a-15d, respectively. As shown in FIG. 1, each of the first coil conductors 18a to 18d winds around the first coil axis Ax1 when viewed in the vertical direction. As shown in FIG. 2, the first coil conductors 18a and 18c have a spiral shape approaching the center while rotating counterclockwise when viewed downward. When viewed downward, the first coil conductors 18b and 18d have a spiral shape that rotates clockwise and approaches the center. Hereinafter, the ends of the first coil conductors 18a to 18d on the outer peripheral side are referred to as outer peripheral ends. The inner peripheral side end portions of the first coil conductors 18a to 18d are referred to as inner peripheral end portions.
　実装電極２０ａ～２０ｆは、図２に示すように、樹脂層１５ｅの下主面に位置している。実装電極２０ａは、上下方向に見て、樹脂層１５ｅの下主面の左前の角近傍に位置している。実装電極２０ｂは、上下方向に見て、樹脂層１５ｅの下主面の左辺の中央近傍に位置している。実装電極２０ｃは、上下方向に見て、樹脂層１５ｅの下主面の左後の角近傍に位置している。実装電極２０ｄは、上下方向に見て、樹脂層１５ｅの下主面の右前の角近傍に位置している。実装電極２０ｅは、上下方向に見て、樹脂層１５ｅの下主面の右辺の中央近傍に位置している。実装電極２０ｆは、上下方向に見て、樹脂層１５ｅの下主面の右後の角近傍に位置している。実装電極２０ａ～２０ｆは、上下方向に見て、長方形状を有している。 The mounting electrodes 20a to 20f are located on the lower main surface of the resin layer 15e, as shown in FIG. The mounting electrode 20a is positioned near the front left corner of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrode 20b is positioned near the center of the left side of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrode 20c is positioned near the left rear corner of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrode 20d is positioned near the front right corner of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrode 20e is positioned near the center of the right side of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrode 20f is positioned near the right rear corner of the lower main surface of the resin layer 15e when viewed in the vertical direction. The mounting electrodes 20a to 20f have a rectangular shape when viewed in the vertical direction.
　層間接続導体ｖ１～ｖ５のそれぞれは、図２に示すように、樹脂層１５ａ～１５ｅを上下方向に貫通している。層間接続導体ｖ１は、第１コイル導体１８ａの内周端部と第１コイル導体１８ｂの内周端部とを電気的に接続している。層間接続導体ｖ２は、第１コイル導体１８ｂの外周端部と第１コイル導体１８ｃの外周端部とを電気的に接続している。層間接続導体ｖ３は、第１コイル導体１８ｃの内周端部と第１コイル導体１８ｄの内周端部とを電気的に接続している。層間接続導体ｖ４と層間接続導体ｖ５は、上下方向に直列に接続されている。層間接続導体ｖ４，ｖ５は、第１コイル導体１８ｄの外周端部と実装電極２０ｂとを電気的に接続している。 Each of the interlayer connection conductors v1 to v5 vertically penetrates the resin layers 15a to 15e, as shown in FIG. The interlayer connection conductor v1 electrically connects the inner peripheral end of the first coil conductor 18a and the inner peripheral end of the first coil conductor 18b. The interlayer connection conductor v2 electrically connects the outer peripheral edge of the first coil conductor 18b and the outer peripheral edge of the first coil conductor 18c. The interlayer connection conductor v3 electrically connects the inner peripheral end of the first coil conductor 18c and the inner peripheral end of the first coil conductor 18d. The interlayer connection conductor v4 and the interlayer connection conductor v5 are connected in series in the vertical direction. The interlayer connection conductors v4 and v5 electrically connect the outer peripheral end of the first coil conductor 18d and the mounting electrode 20b.
　層間接続導体ｖ６は、図２に示すように、樹脂層１５ａ～１５ｅを上下方向に貫通している。層間接続導体ｖ６は、第１コイル導体１８ａの外周端部と実装電極２０ａとを電気的に接続している。 The interlayer connection conductor v6 vertically penetrates the resin layers 15a to 15e, as shown in FIG. The interlayer connection conductor v6 electrically connects the outer peripheral end of the first coil conductor 18a and the mounting electrode 20a.
　第１コイル導体１８ａ～１８ｄ及び実装電極２０ａ～２０ｆは、樹脂層１５ａ～１５ｅの上主面又は下主面に張り付けられた金属箔にエッチングが施されることにより形成された導体層である。金属箔は、例えば、銅箔である。 The first coil conductors 18a to 18d and the mounting electrodes 20a to 20f are conductor layers formed by etching metal foils attached to the upper or lower main surfaces of the resin layers 15a to 15e. The metal foil is, for example, copper foil.
　層間接続導体ｖ１～ｖ６は、樹脂層１５ａ～１５ｅを上下方向に貫通する貫通孔に導電性ペーストが充填され、加熱により導電性ペーストが固化することにより形成されたビアホール導体である。ただし、層間接続導体ｖ１～ｖ６は、樹脂層１５ａ～１５ｅを上下方向に貫通する貫通孔の内周面にメッキが施されることにより形成されたスルーホール導体であってもよい。 The interlayer connection conductors v1 to v6 are via-hole conductors formed by filling conductive paste in through-holes penetrating vertically through the resin layers 15a to 15e and solidifying the conductive paste by heating. However, the interlayer connection conductors v1 to v6 may be through-hole conductors formed by plating the inner peripheral surfaces of through holes penetrating vertically through the resin layers 15a to 15e.
　第２積層体１４は、図１に示すように、上下方向に並ぶ第２積層体第１主面Ｓ３及び第２積層体第２主面Ｓ４を有している。第２積層体第１主面Ｓ３は、第２積層体第２主面Ｓ４より上（第１方向ＤＩＲ１）に位置している。第２積層体第１主面Ｓ３及び第２積層体第２主面Ｓ４は、上下方向に見て、長方形状を有している。 As shown in FIG. 1, the second laminated body 14 has a second laminated body first main surface S3 and a second laminated body second main surface S4 arranged vertically. The second laminated body first main surface S3 is located above the second laminated body second main surface S4 (in the first direction DIR1). The first main surface S3 of the second laminate and the second main surface S4 of the second laminate have a rectangular shape when viewed in the vertical direction.
　第２積層体１４は、図３に示すように、樹脂層２２ａ～２２ｆ（複数の第２樹脂層）が上下方向に積層された構造を有している。本実施形態では、樹脂層２２ａ～２２ｆが上から下へとこの順に並んでいる。 As shown in FIG. 3, the second laminate 14 has a structure in which resin layers 22a to 22f (a plurality of second resin layers) are laminated vertically. In this embodiment, the resin layers 22a to 22f are arranged in this order from top to bottom.
　樹脂層２２ａ～２２ｆは、上下方向に見て、長方形状を有している。樹脂層２２ａ～２２ｆの材料は、熱可塑性樹脂である。熱可塑性樹脂は、例えば、液晶ポリマー、ＰＴＦＥ（ポリテトラフロオロエチレン）等の熱可塑性樹脂である。樹脂層２２ａ～２２ｆの材料は、ポリイミドであってもよい。従って、第２積層体１４の材料は、非磁性材料である。本実施形態では、樹脂層２２ａ～２２ｆ（第２樹脂層）の材料は、樹脂層１５ａ～１５ｅ（第１樹脂層）の材料と同じである。 The resin layers 22a to 22f have a rectangular shape when viewed in the vertical direction. The material of the resin layers 22a-22f is a thermoplastic resin. Thermoplastic resins are, for example, thermoplastic resins such as liquid crystal polymer and PTFE (polytetrafluoroethylene). The material of the resin layers 22a-22f may be polyimide. Therefore, the material of the second laminate 14 is a non-magnetic material. In this embodiment, the material of the resin layers 22a-22f (second resin layer) is the same as the material of the resin layers 15a-15e (first resin layer).
　第２コイルＬ２は、図１に示すように、第２積層体１４に設けられている。第２コイルＬ２は、上下方向に延びる第２コイル軸Ａｘ２の周囲を周回する螺旋形状を有している。第２コイル軸Ａｘ２は、上下方向に見て、貫通孔Ｈに位置している。本実施形態では、第２コイル軸Ａｘ２は、上下方向に見て、第１コイル軸Ａｘ１と重なっている。また、第２コイルＬ２は、上下方向に見て、第１コイルＬ１と重なっている。 The second coil L2 is provided on the second laminate 14, as shown in FIG. The second coil L2 has a helical shape winding around a vertically extending second coil axis Ax2. The second coil axis Ax2 is positioned in the through hole H when viewed in the vertical direction. In this embodiment, the second coil axis Ax2 overlaps the first coil axis Ax1 when viewed in the vertical direction. In addition, the second coil L2 overlaps the first coil L1 when viewed in the vertical direction.
　第２コイルＬ２は、図３に示すように、第２コイル導体２４ａ～２４ｄ、層間接続導体ｖ１１～ｖ１４を含んでいる。第２コイル導体２４ａ～２４ｄのそれぞれは、樹脂層２２ｂ～２２ｅの上主面に位置している。第２コイル導体２４ａ～２４ｄのそれぞれは、上下方向に見て、第２コイル軸Ａｘ２の周囲を周回している。第２コイル導体２４ａ，２４ｃは、下方向に見て、反時計回りに周回しながら中心に近づく渦巻形状を有している。第２コイル導体２４ｂ，２４ｄは、下方向に見て、時計回りに周回しながら中心に近づく渦巻形状を有している。以下では、第２コイル導体２４ａ～２４ｄの外周側の端部を外周端部と呼ぶ。第２コイル導体２４ａ～２４ｄの内周側の端部を内周端部と呼ぶ。 The second coil L2 includes second coil conductors 24a to 24d and interlayer connection conductors v11 to v14, as shown in FIG. The second coil conductors 24a-24d are located on the upper main surfaces of the resin layers 22b-22e, respectively. Each of the second coil conductors 24a to 24d winds around the second coil axis Ax2 when viewed in the vertical direction. The second coil conductors 24a and 24c have a spiral shape approaching the center while rotating counterclockwise when viewed downward. When viewed downward, the second coil conductors 24b and 24d have a spiral shape that rotates clockwise and approaches the center. Hereinafter, the ends of the second coil conductors 24a to 24d on the outer peripheral side are referred to as outer peripheral ends. The ends on the inner peripheral side of the second coil conductors 24a to 24d are called inner peripheral ends.
　実装電極２６ａ～２６ｆは、樹脂層２２ａの上主面に位置している。実装電極２６ａは、上下方向に見て、樹脂層２２ａの上主面の左前の角近傍に位置している。実装電極２６ｂは、上下方向に見て、樹脂層２２ａの上主面の左辺の中央近傍に位置している。実装電極２６ｃは、上下方向に見て、樹脂層２２ａの上主面の左後の角近傍に位置している。実装電極２６ｄ～２６ｆのそれぞれは、上下方向に見て、実装電極２６ａ～２６ｃの右に位置している。実装電極２６ａ～２６ｆは、上下方向に見て、長方形状を有している。 The mounting electrodes 26a to 26f are located on the upper main surface of the resin layer 22a. The mounting electrode 26a is positioned near the front left corner of the upper main surface of the resin layer 22a when viewed in the vertical direction. The mounting electrode 26b is positioned near the center of the left side of the upper main surface of the resin layer 22a when viewed in the vertical direction. The mounting electrode 26c is positioned near the left rear corner of the upper main surface of the resin layer 22a when viewed in the vertical direction. Each of the mounting electrodes 26d to 26f is positioned to the right of the mounting electrodes 26a to 26c when viewed in the vertical direction. The mounting electrodes 26a to 26f have a rectangular shape when viewed in the vertical direction.
　層間接続導体ｖ１１～ｖ１４のそれぞれは、樹脂層２２ａ～２２ｄを上下方向に貫通している。層間接続導体ｖ１１は、実装電極２６ｂと第２コイル導体２４ａの外周端部とを電気的に接続している。層間接続導体ｖ１２は、第２コイル導体２４ａの内周端部と第２コイル導体２４ｂの内周端部とを電気的に接続している。層間接続導体ｖ１３は、第２コイル導体２４ｂの外周端部と第２コイル導体２４ｃの外周端部とを電気的に接続している。層間接続導体ｖ１４は、第２コイル導体２４ｃの内周端部と第２コイル導体２４ｄの内周端部とを電気的に接続している。 Each of the interlayer connection conductors v11 to v14 vertically penetrates the resin layers 22a to 22d. The interlayer connection conductor v11 electrically connects the mounting electrode 26b and the outer peripheral end of the second coil conductor 24a. The interlayer connection conductor v12 electrically connects the inner peripheral end of the second coil conductor 24a and the inner peripheral end of the second coil conductor 24b. The interlayer connection conductor v13 electrically connects the outer peripheral end of the second coil conductor 24b and the outer peripheral end of the second coil conductor 24c. The interlayer connection conductor v14 electrically connects the inner peripheral end of the second coil conductor 24c and the inner peripheral end of the second coil conductor 24d.
　信号導体２８は、樹脂層２２ｄの上主面に位置している。信号導体２８は、左右方向に延びる線形状を有している。信号導体２８の左端部は、上下方向に見て、実装電極２６ａと重なっている。信号導体２９は、樹脂層２２ｅの上主面に位置している。信号導体２９は、左右方向に延びる線形状を有している。信号導体２９の左端部は、第２コイル導体２４ｄの外周端部に接続されている。 The signal conductor 28 is located on the upper main surface of the resin layer 22d. The signal conductor 28 has a linear shape extending in the left-right direction. The left end of the signal conductor 28 overlaps the mounting electrode 26a when viewed in the vertical direction. The signal conductor 29 is located on the upper main surface of the resin layer 22e. The signal conductor 29 has a linear shape extending in the left-right direction. The left end of the signal conductor 29 is connected to the outer peripheral end of the second coil conductor 24d.
　層間接続導体ｖ１５は、樹脂層２２ａ～２２ｃを上下方向に貫通している。層間接続導体ｖ１５は、信号導体２８の左端部と実装電極２６ａとを電気的に接続している。 The interlayer connection conductor v15 vertically penetrates the resin layers 22a to 22c. The interlayer connection conductor v15 electrically connects the left end of the signal conductor 28 and the mounting electrode 26a.
　実装電極６０ａ，６０ｂは、図３に示すように、第２積層体第１主面Ｓ３に位置している。従って、実装電極６０ａ，６０ｂは、樹脂層２２ａの上主面に位置している。実装電極６０ａ，６０ｂは、図１に示すように、上下方向に見て、貫通孔Ｈと重なっている。実装電極６０ａ，６０ｂは、左から右へとこの順に並んでいる。実装電極６０ａ，６０ｂは、上下方向に見て、長方形状を有している。 The mounting electrodes 60a and 60b are located on the first main surface S3 of the second laminate, as shown in FIG. Accordingly, the mounting electrodes 60a and 60b are located on the upper main surface of the resin layer 22a. As shown in FIG. 1, the mounting electrodes 60a and 60b overlap the through holes H when viewed in the vertical direction. The mounting electrodes 60a and 60b are arranged in this order from left to right. The mounting electrodes 60a and 60b have a rectangular shape when viewed in the vertical direction.
　信号導体６２ａは、図３に示すように、樹脂層２２ｆの上主面に位置している。信号導体６２ａは、左右方向に延びる線形状を有している。信号導体６２ａの左端部は、上下方向に見て、実装電極６０ａと重なっている。信号導体６２ｂは、樹脂層２２ｆの上主面に位置している。信号導体６２ｂは、左右方向に延びる線形状を有している。信号導体６２ｂの左端部は、上下方向に見て、実装電極６０ｂと重なっている。 The signal conductor 62a is located on the upper main surface of the resin layer 22f, as shown in FIG. The signal conductor 62a has a linear shape extending in the left-right direction. The left end of the signal conductor 62a overlaps the mounting electrode 60a when viewed in the vertical direction. The signal conductor 62b is located on the upper main surface of the resin layer 22f. The signal conductor 62b has a linear shape extending in the left-right direction. The left end of the signal conductor 62b overlaps the mounting electrode 60b when viewed in the vertical direction.
　層間接続導体ｖ３１は、樹脂層２２ａ～２２ｅを上下方向に貫通している。層間接続導体ｖ３１は、実装電極６０ａと信号導体６２ａの左端部とを電気的に接続している。層間接続導体ｖ３２は、樹脂層２２ａ～２２ｅを上下方向に貫通している。層間接続導体ｖ３２は、実装電極６０ｂと信号導体６２ｂの左端部とを電気的に接続している。 The interlayer connection conductor v31 vertically penetrates the resin layers 22a to 22e. The interlayer connection conductor v31 electrically connects the mounting electrode 60a and the left end of the signal conductor 62a. The interlayer connection conductor v32 vertically penetrates the resin layers 22a to 22e. The interlayer connection conductor v32 electrically connects the mounting electrode 60b and the left end of the signal conductor 62b.
　第２コイル導体２４ａ～２４ｄ、信号導体２８，２９，６２ａ，６２ｂ及び実装電極６０ａ，６０ｂは、樹脂層２２ａ～２２ｅの上主面に張り付けられた金属箔にエッチングが施されることにより形成された導体層である。金属箔は、例えば、銅箔である。 The second coil conductors 24a-24d, the signal conductors 28, 29, 62a, 62b and the mounting electrodes 60a, 60b are formed by etching a metal foil attached to the upper main surface of the resin layers 22a-22e. It is a conductive layer. The metal foil is, for example, copper foil.
　層間接続導体ｖ１１～ｖ１５，ｖ３１，ｖ３２は、樹脂層２２ａ～２２ｅを上下方向に貫通する貫通孔に導電性ペーストが充填され、加熱により導電性ペーストが固化することにより形成されたビアホール導体である。ただし、層間接続導体ｖ１１～ｖ１５，ｖ３１，ｖ３２は、樹脂層２２ａ～２２ｅを上下方向に貫通する貫通孔の内周面にメッキが施されることにより形成されたスルーホール導体であってもよい。 The interlayer connection conductors v11 to v15, v31, and v32 are via-hole conductors formed by filling conductive paste in through-holes vertically penetrating the resin layers 22a to 22e and solidifying the conductive paste by heating. . However, the interlayer connection conductors v11 to v15, v31, and v32 may be through-hole conductors formed by plating the inner peripheral surfaces of through holes penetrating the resin layers 22a to 22e in the vertical direction. .
　第１積層体１３は、第２積層体１４の第２積層体第１主面Ｓ３に実装されている。これにより、第２積層体１４は、第１積層体１３より下（第２方向ＤＩＲ２）に位置している。また、第２積層体１４は、上下方向に見て第１積層体１３と重なっている。このとき、第１積層体１３は、上下方向に見て、第２積層体１４の外縁に囲まれた領域内に位置している。すなわち、上下方向に見た第２積層体１４の面積は、上下方向に見た第１積層体１３の面積より大きい。更に、上下方向に見て、第１積層体１３は、第２積層体１４の外縁からはみ出していない。 The first laminate 13 is mounted on the second laminate first main surface S3 of the second laminate 14 . Thereby, the second stacked body 14 is located below the first stacked body 13 (in the second direction DIR2). In addition, the second laminate 14 overlaps the first laminate 13 when viewed in the vertical direction. At this time, the first stacked body 13 is positioned within a region surrounded by the outer edges of the second stacked body 14 when viewed in the vertical direction. That is, the area of the second stacked body 14 seen in the vertical direction is larger than the area of the first stacked body 13 seen in the vertical direction. Furthermore, when viewed in the vertical direction, the first laminate 13 does not protrude from the outer edge of the second laminate 14 .
　実装電極２０ａ～２０ｆのそれぞれは、実装電極２６ａ～２６ｆに導電性接合材により固定されている。このように、第１積層体１３が第２積層体１４に導電性接合材により実装されることにより、第１コイルＬ１は、第２コイルＬ２と電気的に接続されている。より正確には、第１コイルＬ１は、第２コイルＬ２に直列に接続されている。導電性接合材は、例えば、半田である。 Each of the mounting electrodes 20a to 20f is fixed to the mounting electrodes 26a to 26f with a conductive bonding material. In this way, the first coil L1 is electrically connected to the second coil L2 by mounting the first laminate 13 on the second laminate 14 with the conductive bonding material. More precisely, the first coil L1 is connected in series with the second coil L2. The conductive bonding material is, for example, solder.
　磁石５０は、図１に示すように、第１コイルＬ１より上（第１方向ＤＩＲ１）に位置している。磁石５０は、上下方向に見て、第１コイルＬ１と重なっている。磁石５０は、左右方向に延びている。磁石５０の左部は、Ｎ極である。磁石５０の右部は、Ｓ極である。磁石５０は、永久磁石である。ただし、磁石５０は、電磁石であってもよい。 The magnet 50 is located above the first coil L1 (in the first direction DIR1), as shown in FIG. The magnet 50 overlaps the first coil L1 when viewed in the vertical direction. Magnet 50 extends in the left-right direction. The left side of magnet 50 is the north pole. The right portion of magnet 50 is the south pole. Magnet 50 is a permanent magnet. However, the magnet 50 may be an electromagnet.
　磁気センサ３０は、磁石５０の磁力を検知する。磁気センサ３０は、第２積層体第１主面Ｓ３に実装されている実装部品である。具体的には、磁気センサ３０は、磁気センサ本体３２及び磁気センサ実装電極３４ａ，３４ｂを含んでいる。磁気センサ本体３２は、磁気センサを内蔵している。磁気センサ本体３２は、直方体形状を有している。磁気センサ実装電極３４ａ，３４ｂは、磁気センサ本体３２の下面に位置している。磁気センサ実装電極３４ａ，３４ｂのそれぞれは、実装電極６０ａ，６０ｂに半田等の導電性接合材により固定される。磁気センサ３０は、上下方向に見て、第１コイルＬ１及び第２コイルＬ２に囲まれている。これにより、磁気センサ３０の少なくとも一部分は、貫通孔Ｈ内に位置している。 The magnetic sensor 30 detects the magnetic force of the magnet 50. The magnetic sensor 30 is a mounted component mounted on the first main surface S3 of the second laminate. Specifically, the magnetic sensor 30 includes a magnetic sensor body 32 and magnetic sensor mounting electrodes 34a and 34b. The magnetic sensor main body 32 incorporates a magnetic sensor. The magnetic sensor main body 32 has a rectangular parallelepiped shape. The magnetic sensor mounting electrodes 34 a and 34 b are located on the lower surface of the magnetic sensor main body 32 . Each of the magnetic sensor mounting electrodes 34a, 34b is fixed to the mounting electrodes 60a, 60b with a conductive bonding material such as solder. The magnetic sensor 30 is surrounded by the first coil L1 and the second coil L2 when viewed in the vertical direction. Accordingly, at least a portion of the magnetic sensor 30 is positioned within the through hole H. As shown in FIG.
　ここで、磁気センサ３０の上端（第１方向ＤＩＲ１の端）は、第１積層体第１主面Ｓ１より下（第２方向ＤＩＲ２）に位置している。すなわち、磁気センサ３０の磁気センサ本体３２の上面は、第１積層体第１主面Ｓ１より下に位置している。そのため、磁気センサ３０は、第１積層体第１主面から上方向に突出していない。 Here, the upper end of the magnetic sensor 30 (the end in the first direction DIR1) is positioned below the first main surface S1 of the first laminate (second direction DIR2). That is, the upper surface of the magnetic sensor main body 32 of the magnetic sensor 30 is positioned below the first main surface S1 of the first laminate. Therefore, the magnetic sensor 30 does not protrude upward from the first main surface of the first laminate.
　第１コイル導体１８ａ～１８ｄの周回数の平均値を第１コイル導体１８ａ～１８ｄの周回数Ｎ１と定義する。第２コイル導体２４ａ～２４ｄの周回数の平均値を第２コイル導体２４ａ～２４ｄの周回数Ｎ２と定義する。第１コイル導体１８ａ～１８ｄの周回数のそれぞれは、約１．５周である。従って、第１コイル導体１８ａ～１８ｄの周回数Ｎ１は、約１．５周である。第２コイル導体２４ａ～２４ｄの周回数のそれぞれは、約１．５周である。従って、第２コイル導体２４ａ～２４ｄの周回数Ｎ２は、約１．５周である。従って、第１コイル導体１８ａ～１８ｄの周回数Ｎ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と略等しい。 The average number of turns of the first coil conductors 18a to 18d is defined as the number of turns N1 of the first coil conductors 18a to 18d. The average number of turns of the second coil conductors 24a-24d is defined as the number of turns N2 of the second coil conductors 24a-24d. Each of the number of turns of the first coil conductors 18a-18d is approximately 1.5 turns. Therefore, the number of turns N1 of the first coil conductors 18a to 18d is approximately 1.5 turns. Each of the number of turns of the second coil conductors 24a-24d is approximately 1.5 turns. Therefore, the number of turns N2 of the second coil conductors 24a to 24d is approximately 1.5 turns. Therefore, the number of turns N1 of the first coil conductors 18a-18d is substantially equal to the number of turns N2 of the second coil conductors 24a-24d.
　上下方向に見て、第１コイル導体１８ａ～１８ｄ及び第２コイル導体２４ａ～２４ｄが延びる方向に直交する方向は、線幅方向である。第１コイル導体１８ａ～１８ｄの線幅方向の幅の平均値を第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１と定義する。第２コイル導体２４ａ～２４ｄの線幅方向の幅の平均値を第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２と定義する。図１からも明らかなように、幅Ｗ１は、幅Ｗ２より小さい。 The direction orthogonal to the direction in which the first coil conductors 18a to 18d and the second coil conductors 24a to 24d extend when viewed in the vertical direction is the line width direction. The average width of the first coil conductors 18a to 18d in the line width direction is defined as the width W1 of the first coil conductors 18a to 18d in the line width direction. The average width of the second coil conductors 24a to 24d in the line width direction is defined as the width W2 of the second coil conductors 24a to 24d in the line width direction. As is clear from FIG. 1, the width W1 is smaller than the width W2.
　以上より、周回数Ｎ１，Ｎ２及び幅Ｗ１，Ｗ２の間には以下の関係が成立する。第１コイル導体１８ａ～１８ｄの周回数Ｎ１と第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１との積Ｘ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２との積Ｘ２より小さい。 From the above, the following relationship is established between the number of turns N1, N2 and the widths W1, W2. The product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the number of turns N2 of the second coil conductors 24a to 24d. It is smaller than the product X2 with the width W2 of 24d in the line width direction.
　以上のような駆動モジュール１０は、図示しない制御回路を備えている。磁気センサ３０及び第１コイルＬ１及び第２コイルＬ２は、制御回路に電気的に接続されている。磁気センサ３０は、磁気センサ３０により検知された磁石５０の磁力の大きさに応じた出力信号を生成する。制御回路は、磁気センサ３０が生成した出力信号に基づいて、第１コイルＬ１及び第２コイルＬ２に流す電流の大きさを制御する。例えば、下方向に見て、第１コイルＬ１及び第２コイルＬ２に時計回り方向の電流が流れると、第１コイルＬ１及び第２コイルＬ２の左部に位置する導体には前方向に電流が流れ、第１コイルＬ１及び第２コイルＬ２の右部に位置する導体には後方向に電流が流れる。磁石５０では、Ｎ極から磁力線が出ると共に、Ｓ極へと磁力線が入る。従って、第１コイルＬ１及び第２コイルＬ２の左部に位置する導体に前方向に電流が流れると、第１コイルＬ１及び第２コイルＬ２の左部に位置する導体は、左方向にローレンツ力を受ける。第１コイルＬ１及び第２コイルＬ２の右部に位置する導体に後方向に電流が流れると、第１コイルＬ１及び第２コイルＬ２の右部に位置する導体は、左方向にローレンツ力を受ける。すなわち、第１コイルＬ１及び第２コイルＬ２は、磁石５０から左方向に力を受ける。換言すれば、磁石５０は、第１コイルＬ１及び第２コイルＬ２から右方向に力を受ける。その結果、磁石５０は、第１コイルＬ１及び第２コイルＬ２に対して右方向に変位する。ただし、第１コイルＬ１及び第２コイルＬ２が、磁石５０に対して左方向に変位してもよい。 The drive module 10 as described above includes a control circuit (not shown). The magnetic sensor 30, the first coil L1 and the second coil L2 are electrically connected to a control circuit. The magnetic sensor 30 generates an output signal according to the magnitude of the magnetic force of the magnet 50 detected by the magnetic sensor 30 . Based on the output signal generated by the magnetic sensor 30, the control circuit controls the magnitude of the current that flows through the first coil L1 and the second coil L2. For example, when viewed downward, when a clockwise current flows through the first coil L1 and the second coil L2, a forward current flows through the conductors positioned to the left of the first coil L1 and the second coil L2. A current flows in the rearward direction through the conductors located on the right side of the first coil L1 and the second coil L2. In the magnet 50, the lines of magnetic force are emitted from the N pole and the lines of magnetic force are applied to the S pole. Therefore, when a current flows forward in the conductors located on the left side of the first coil L1 and the second coil L2, the conductors located on the left side of the first coil L1 and the second coil L2 are subjected to the Lorentz force in the left direction. receive. When a current flows backward through the conductors located on the right side of the first coil L1 and the second coil L2, the conductors located on the right side of the first coil L1 and the second coil L2 receive Lorentz force in the left direction. . That is, the first coil L1 and the second coil L2 receive force from the magnet 50 in the left direction. In other words, the magnet 50 receives force rightward from the first coil L1 and the second coil L2. As a result, the magnet 50 is displaced to the right with respect to the first coil L1 and the second coil L2. However, the first coil L1 and the second coil L2 may be displaced leftward with respect to the magnet 50 .
　一方、下方向に見て、第１コイルＬ１及び第２コイルＬ２に反時計回り方向の電流が流れると、第１コイルＬ１及び第２コイルＬ２の左部に位置する導体には後方向に電流が流れ、第１コイルＬ１及び第２コイルＬ２の右部に位置する導体には前方向に電流が流れる。第１コイルＬ１及び第２コイルＬ２の左部に位置する導体に後方向に電流が流れると、第１コイルＬ１及び第２コイルＬ２の左部に位置する導体は、右方向にローレンツ力を受ける。第１コイルＬ１及び第２コイルＬ２の右部に位置する導体に前方向に電流が流れると、第１コイルＬ１及び第２コイルＬ２の右部に位置する導体は、右方向にローレンツ力を受ける。すなわち、第１コイルＬ１及び第２コイルＬ２は、磁石５０から右方向に力を受ける。換言すれば、磁石５０は、第１コイルＬ１及び第２コイルＬ２から左方向に力を受ける。その結果、磁石５０は、第１コイルＬ１及び第２コイルＬ２に対して左方向に変位する。ただし、第１コイルＬ１及び第２コイルＬ２が、磁石５０に対して右方向に変位してもよい。以上のように、第１コイルＬ１及び第２コイルＬ２が発生する磁力により、磁石５０の第１コイルＬ１及び第２コイルＬ２に対する位置が変化する。 On the other hand, when viewed downward, when a counterclockwise current flows through the first coil L1 and the second coil L2, the current flows backward through the conductors positioned to the left of the first coil L1 and the second coil L2. current flows forward in the conductors positioned on the right side of the first coil L1 and the second coil L2. When a current flows backward through the conductors located on the left side of the first coil L1 and the second coil L2, the conductors located on the left side of the first coil L1 and the second coil L2 receive a rightward Lorentz force. . When current flows forward in the conductors positioned on the right side of the first coil L1 and the second coil L2, the conductors positioned on the right side of the first coil L1 and the second coil L2 receive Lorentz force in the right direction. . That is, the first coil L1 and the second coil L2 receive force from the magnet 50 in the right direction. In other words, the magnet 50 receives force in the left direction from the first coil L1 and the second coil L2. As a result, the magnet 50 is displaced leftward with respect to the first coil L1 and the second coil L2. However, the first coil L<b>1 and the second coil L<b>2 may be displaced to the right with respect to the magnet 50 . As described above, the magnetic force generated by the first coil L1 and the second coil L2 changes the position of the magnet 50 with respect to the first coil L1 and the second coil L2.
［効果］
　基板モジュール１１によれば、第２コイルＬ２の直流抵抗値の低減及び第２コイルＬ２のインダクタンス値の向上を実現できる。より詳細には、上下方向に見た第２積層体１４の面積は、上下方向に見た第１積層体１３の面積より大きい。そのため、第２コイル導体２４ａ～２４ｄの大きさを第１コイル導体１８ａ～１８ｄの大きさよりも大きくしやすい。そこで、第１コイル導体１８ａ～１８ｄの周回数Ｎ１と第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１との積Ｘ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２との積Ｘ２より小さい。これにより、第２コイル導体２４ａ～２４ｄの周回数Ｎ２及び／又は第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２を大きくすることができる。その結果、第２コイルＬ２の直流抵抗値の低減及び第２コイルＬ２のインダクタンス値の向上を実現できる。 [effect]
According to the board module 11, it is possible to reduce the DC resistance value of the second coil L2 and improve the inductance value of the second coil L2. More specifically, the area of the second stacked body 14 seen in the vertical direction is larger than the area of the first stacked body 13 seen in the vertical direction. Therefore, it is easy to make the size of the second coil conductors 24a to 24d larger than the size of the first coil conductors 18a to 18d. Therefore, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil conductors. It is smaller than the product X2 with the width W2 of 24a to 24d in the line width direction. This makes it possible to increase the number of turns N2 of the second coil conductors 24a to 24d and/or the width W2 of the second coil conductors 24a to 24d in the line width direction. As a result, it is possible to reduce the DC resistance value of the second coil L2 and improve the inductance value of the second coil L2.
　駆動モジュール１０では、第１コイルＬ１及び第２コイルＬ２が発生する磁力により、磁石５０の第１コイルＬ１及び第２コイルＬ２に対する位置が変化する。このような駆動モジュール１０では、第１コイルＬ１及び第２コイルＬ２に大きな電流が流れる。そのため、駆動モジュール１０では、第２コイルＬ２の直流抵抗値の低減が望まれる。そこで、第１コイル導体１８ａ～１８ｄの周回数Ｎ１と第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１との積Ｘ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２との積Ｘ２より小さい。これにより、第２コイルＬ２の直流抵抗値の低減が図られている。以上のように、基板モジュール１１は、駆動モジュール１０に適した構造を有している。 In the drive module 10, the magnetic force generated by the first coil L1 and the second coil L2 changes the position of the magnet 50 with respect to the first coil L1 and the second coil L2. In such a drive module 10, a large current flows through the first coil L1 and the second coil L2. Therefore, in the drive module 10, it is desired to reduce the DC resistance value of the second coil L2. Therefore, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil conductors. It is smaller than the product X2 with the width W2 of 24a to 24d in the line width direction. Thereby, the DC resistance value of the second coil L2 is reduced. As described above, the substrate module 11 has a structure suitable for the drive module 10. As shown in FIG.
　基板モジュール１１によれば、磁気センサ３０の上端（第１方向ＤＩＲ１の端）は、第１積層体第１主面Ｓ１より下（第２方向ＤＩＲ２）に位置している。すなわち、磁気センサ３０の磁気センサ本体３２の上面は、第１積層体第１主面Ｓ１より下に位置している。そのため、磁気センサ３０は、第１積層体第１主面Ｓ１から上方向に突出していない。これにより、基板モジュール１１の上下方向の小型化が図られる。 According to the substrate module 11, the upper end of the magnetic sensor 30 (the end in the first direction DIR1) is located below the first main surface S1 of the first laminate (second direction DIR2). That is, the upper surface of the magnetic sensor main body 32 of the magnetic sensor 30 is positioned below the first main surface S1 of the first laminate. Therefore, the magnetic sensor 30 does not protrude upward from the first main surface S1 of the first laminate. As a result, the size of the substrate module 11 can be reduced in the vertical direction.
（第１変形例）
　以下に、第１変形例に係る駆動モジュール１０ａ及び基板モジュール１１ａについて、図面を参照しながら説明する。図４は、駆動モジュール１０ａの断面図である。 (First modification)
A drive module 10a and a substrate module 11a according to the first modified example will be described below with reference to the drawings. FIG. 4 is a cross-sectional view of the drive module 10a.
　駆動モジュール１０ａは、第２コイル導体２４ａ～２４ｄの周回数Ｎ２において駆動モジュール１０と相違する。より詳細には、第１コイル導体１８ａ～１８ｄの周回数Ｎ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２より少ない。換言すれば、第２コイル導体２４ａ～２４ｄの周回数Ｎ２は、第１コイル導体１８ａ～１８ｄの周回数Ｎ１より大きい。ただし、駆動モジュール１０ａでは、駆動モジュール１０と同様に、第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１は、第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２より小さい。これにより、第１コイル導体１８ａ～１８ｄの周回数Ｎ１と第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１との積Ｘ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２との積Ｘ２より小さい。駆動モジュール１０ａのその他の構造は、駆動モジュール１０と同じであるので説明を省略する。駆動モジュール１０ａは、駆動モジュール１０と同じ作用効果を奏することができる。 The drive module 10a differs from the drive module 10 in the number of turns N2 of the second coil conductors 24a to 24d. More specifically, the number of turns N1 of the first coil conductors 18a-18d is less than the number of turns N2 of the second coil conductors 24a-24d. In other words, the number of turns N2 of the second coil conductors 24a-24d is greater than the number of turns N1 of the first coil conductors 18a-18d. However, in the drive module 10a, similarly to the drive module 10, the width W1 of the first coil conductors 18a to 18d in the line width direction is smaller than the width W2 of the second coil conductors 24a to 24d in the line width direction. As a result, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil It is smaller than the product X2 with the width W2 of the conductors 24a to 24d in the line width direction. The rest of the structure of the drive module 10a is the same as that of the drive module 10, so the explanation is omitted. The driving module 10 a can have the same effects as the driving module 10 .
　駆動モジュール１０ａでは、第１コイル導体１８ａ～１８ｄの周回数Ｎ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２より少ない。換言すれば、第２コイル導体２４ａ～２４ｄの周回数Ｎ２は、第１コイル導体１８ａ～１８ｄの周回数Ｎ１より大きい。これにより、第２コイルＬ２のインダクタンス値をより向上させることができる。 In the drive module 10a, the number of turns N1 of the first coil conductors 18a-18d is less than the number of turns N2 of the second coil conductors 24a-24d. In other words, the number of turns N2 of the second coil conductors 24a-24d is greater than the number of turns N1 of the first coil conductors 18a-18d. Thereby, the inductance value of the second coil L2 can be further improved.
（第２変形例）
　以下に、第２変形例に係る駆動モジュール１０ｂ及び基板モジュール１１ｂについて、図面を参照しながら説明する。図５は、駆動モジュール１０ｂの断面図である。 (Second modification)
A drive module 10b and a substrate module 11b according to the second modification will be described below with reference to the drawings. FIG. 5 is a cross-sectional view of drive module 10b.
　駆動モジュール１０ｂは、第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２において駆動モジュール１０ａと相違する。より詳細には、第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１は、第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２と等しい。ただし、駆動モジュール１０ｂでは、駆動モジュール１０ａと同様に、第１コイル導体１８ａ～１８ｄの周回数Ｎ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２より少ない。これにより、第１コイル導体１８ａ～１８ｄの周回数Ｎ１と第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１との積Ｘ１は、第２コイル導体２４ａ～２４ｄの周回数Ｎ２と第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２との積Ｘ２より小さい。駆動モジュール１０ｂのその他の構造は、駆動モジュール１０ａと同じであるので説明を省略する。駆動モジュール１０ｂは、駆動モジュール１０ａと同じ作用効果を奏することができる。 The drive module 10b differs from the drive module 10a in the width W2 in the line width direction of the second coil conductors 24a to 24d. More specifically, the width W1 of the first coil conductors 18a to 18d in the line width direction is equal to the width W2 of the second coil conductors 24a to 24d in the line width direction. However, in the drive module 10b, similarly to the drive module 10a, the number of turns N1 of the first coil conductors 18a-18d is smaller than the number of turns N2 of the second coil conductors 24a-24d. As a result, the product X1 of the number of turns N1 of the first coil conductors 18a to 18d and the width W1 in the line width direction of the first coil conductors 18a to 18d is the number of turns N2 of the second coil conductors 24a to 24d and the second coil It is smaller than the product X2 with the width W2 of the conductors 24a to 24d in the line width direction. The rest of the structure of the drive module 10b is the same as that of the drive module 10a, so the description is omitted. The drive module 10b can have the same effects as the drive module 10a.
（第３変形例）
　以下に、第３変形例に係る駆動モジュール１０ｃ及び基板モジュール１１ｃについて、図面を参照しながら説明する。図６は、駆動モジュール１０ｃの断面図である。 (Third modification)
A drive module 10c and a substrate module 11c according to a third modified example will be described below with reference to the drawings. FIG. 6 is a cross-sectional view of drive module 10c.
　駆動モジュール１０ｃは、第１積層体１３と第２積層体１４とが熱圧着により一体化されている点において駆動モジュール１０と相違する。より詳細には、第１積層体１３の樹脂層１５ｅと第２積層体１４の樹脂層２２ａとは、熱圧着により一体化されている。駆動モジュール１０ｃのその他の構造は、駆動モジュール１０と同じであるので説明を省略する。駆動モジュール１０ｃは、駆動モジュール１０と同じ作用効果を奏することができる。 The drive module 10c differs from the drive module 10 in that the first laminate 13 and the second laminate 14 are integrated by thermocompression bonding. More specifically, the resin layer 15e of the first laminate 13 and the resin layer 22a of the second laminate 14 are integrated by thermocompression bonding. Other structures of the drive module 10c are the same as those of the drive module 10, so description thereof is omitted. The drive module 10c can have the same effects as the drive module 10. FIG.
（第４変形例）
　以下に、第４変形例に係る駆動モジュール１０ｄ及び基板モジュール１１ｄについて、図面を参照しながら説明する。図７は、駆動モジュール１０ｄの断面図である。 (Fourth modification)
A drive module 10d and a substrate module 11d according to the fourth modification will be described below with reference to the drawings. FIG. 7 is a cross-sectional view of drive module 10d.
　駆動モジュール１０ｄは、第１コイルＬ１の形状において駆動モジュール１０ｂと相違する。より詳細には、第１コイルＬ１は、上下方向に見て、第２コイルＬ２の最も内周に位置する部分及び最も内周から２番目に位置する部分と重なっている。そのため、第２コイルＬ２の最も外周に位置する部分は、上下方向に見て、第１コイルＬ１と重なっていない。駆動モジュール１０ｄのその他の構造は、駆動モジュール１０と同じであるので説明を省略する。駆動モジュール１０ｄは、駆動モジュール１０と同じ作用効果を奏することができる。 The drive module 10d differs from the drive module 10b in the shape of the first coil L1. More specifically, the first coil L1 overlaps the innermost portion and the second innermost portion of the second coil L2 when viewed in the vertical direction. Therefore, the outermost portion of the second coil L2 does not overlap the first coil L1 when viewed in the vertical direction. Other structures of the drive module 10d are the same as those of the drive module 10, so description thereof is omitted. The drive module 10 d can have the same effects as the drive module 10 .
（第５変形例）
　以下に、第５変形例に係る駆動モジュール１０ｅ及び基板モジュール１１ｅについて、図面を参照しながら説明する。図８は、駆動モジュール１０ｅの断面図である。 (Fifth modification)
A drive module 10e and a substrate module 11e according to the fifth modification will be described below with reference to the drawings. FIG. 8 is a cross-sectional view of the drive module 10e.
　駆動モジュール１０ｅは、実装部品７０、実装電極８０ａ，８０ｂ及び層間接続導体ｖ４１，ｖ４２を更に備えている点において駆動モジュール１０と相違する。実装電極８０ａ，８０ｂは、第２積層体第１主面Ｓ３に位置している。層間接続導体ｖ４１は、樹脂層２２ａ～２２ｄを上下方向に貫通している。層間接続導体ｖ４１は、実装電極８０ａと信号導体２８の右端部とを電気的に接続している。層間接続導体ｖ４２は、樹脂層２２ａ～２２ｅを上下方向に貫通している。層間接続導体ｖ４２は、実装電極８０ｂと信号導体６２ｂの右端部とを電気的に接続している。 The drive module 10e differs from the drive module 10 in that it further includes a mounting component 70, mounting electrodes 80a and 80b, and interlayer connection conductors v41 and v42. The mounting electrodes 80a and 80b are located on the first main surface S3 of the second laminate. The interlayer connection conductor v41 vertically penetrates the resin layers 22a to 22d. The interlayer connection conductor v41 electrically connects the mounting electrode 80a and the right end of the signal conductor . The interlayer connection conductor v42 vertically penetrates the resin layers 22a to 22e. The interlayer connection conductor v42 electrically connects the mounting electrode 80b and the right end of the signal conductor 62b.
　実装部品７０は、第２積層体１４に実装される電子部品である。実装部品７０は、例えば、磁気センサ３０が生成した出力信号に基づいて、第１コイルＬ１及び第２コイルＬ２に流す電流の大きさを制御する制御回路である。実装部品７０は、例えば、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）である。実装部品７０は、実装部品本体７２及び実装部品電極７４ａ，７４ｂを含んでいる。実装部品本体７２は、直方体形状を有している。実装部品電極７４ａ，７４ｂは、実装部品本体７２の下面に設けられている。 The mounted component 70 is an electronic component mounted on the second laminate 14 . The mounting component 70 is, for example, a control circuit that controls the magnitude of the current that flows through the first coil L1 and the second coil L2 based on the output signal generated by the magnetic sensor 30 . The mounted component 70 is, for example, an IC (Integrated Circuit). The mounting component 70 includes a mounting component body 72 and mounting component electrodes 74a and 74b. The mounting component main body 72 has a rectangular parallelepiped shape. Mounted component electrodes 74 a and 74 b are provided on the lower surface of mounted component body 72 .
　実装部品電極７４ａ，７４ｂのそれぞれは、実装電極８０ａ，８０ｂに導電性接合材により固定されている。このように、実装部品７０が第２積層体１４に導電性接合材により実装されることにより、実装部品７０と第２コイルＬ２とが互いに電気的に接続されていると共に、実装部品７０と磁気センサ３０とが互いに電気的に接続されている。導電性接合材は、例えば、半田である。駆動モジュール１０ｅのその他の構造は、駆動モジュール１０と同じであるので説明を省略する。駆動モジュール１０ｅは、駆動モジュール１０と同じ作用効果を奏することができる。 The mounting component electrodes 74a and 74b are fixed to the mounting electrodes 80a and 80b with a conductive bonding material, respectively. In this way, by mounting the mounted component 70 on the second laminate 14 with the conductive bonding material, the mounted component 70 and the second coil L2 are electrically connected to each other, and the mounted component 70 and the magnetic coupling are electrically connected to each other. The sensor 30 is electrically connected to each other. The conductive bonding material is, for example, solder. Other structures of the drive module 10e are the same as those of the drive module 10, so description thereof is omitted. The driving module 10 e can have the same effects as the driving module 10 .
　なお、層間接続導体ｖ３１及び信号導体６２ａ（図３参照）は、図示しない層間接続導体を介して実装部品７０に電気的に接続されていてもよい。同様に、信号導体２９は、図示しない層間接続導体を介して実装部品７０に電気的に接続されていてもよい。 Note that the interlayer connection conductor v31 and the signal conductor 62a (see FIG. 3) may be electrically connected to the mounting component 70 via an interlayer connection conductor (not shown). Similarly, the signal conductor 29 may be electrically connected to the mounting component 70 via an interlayer connection conductor (not shown).
（第６変形例）
　以下に、第６変形例に係る駆動モジュール１０ｆ及び基板モジュール１１ｆについて、図面を参照しながら説明する。図９は、駆動モジュール１０ｆの断面図である。 (Sixth modification)
A drive module 10f and a substrate module 11f according to the sixth modification will be described below with reference to the drawings. FIG. 9 is a cross-sectional view of the drive module 10f.
　駆動モジュール１０ｆは、２組の駆動モジュール１０ｇ，１０ｈを備えている。駆動モジュール１０ｇ，１０ｈは、駆動モジュール１０と同様の構造を有している。ただし、駆動モジュール１０ｈの構造は、駆動モジュール１０ｇの構造と左右対称である。また、駆動モジュール１０ｇの第２積層体１４と駆動モジュール１０ｈの第２積層体１４とは、互いに繋がることにより一つの積層体である。 The drive module 10f includes two sets of drive modules 10g and 10h. Drive modules 10 g and 10 h have the same structure as drive module 10 . However, the structure of the drive module 10h is symmetrical with the structure of the drive module 10g. In addition, the second laminate 14 of the drive module 10g and the second laminate 14 of the drive module 10h are connected to form one laminate.
　駆動モジュール１０ｆによれば、駆動モジュール１０ｇ，１０ｈが一体化されている。そのため、２つの駆動モジュールが別々に電子機器に取り付けられる場合に比べて、駆動モジュール１０ｆが電子機器に取り付けられる場合の方が、駆動モジュール１０ｇと駆動モジュール１０ｈとが精度よく互いに位置決めされるようになる。 According to the drive module 10f, the drive modules 10g and 10h are integrated. Therefore, when the drive module 10f is attached to the electronic device, the drive module 10g and the drive module 10h are positioned more accurately than when the two drive modules are separately attached to the electronic device. Become.
（電子機器）
　以下に、電子機器１について図面を参照しながら説明する。図１０は、電子機器１の断面図である。 (Electronics)
The electronic device 1 will be described below with reference to the drawings. FIG. 10 is a cross-sectional view of the electronic device 1. FIG.
　電子機器１は、スマートフォン等の無線通信端末である。電子機器１は、駆動モジュール１０、バッテリ１００、回路基板１１０及び筐体１２０を備えている。駆動モジュール１０は、回路基板１１０とコネクタを介して電気的に接続されている。また、駆動モジュール１０の基板モジュール１１は、可撓性を有しているので、折れ曲がっている。基板モジュール１１の変形は、塑性変形であってもよいし、弾性変形であってもよいし、塑性変形及び弾性変形であってもよい。 The electronic device 1 is a wireless communication terminal such as a smartphone. The electronic device 1 includes a drive module 10 , a battery 100 , a circuit board 110 and a housing 120 . The drive module 10 is electrically connected to the circuit board 110 via a connector. Also, the substrate module 11 of the drive module 10 is flexible and therefore bent. The deformation of the board module 11 may be plastic deformation, elastic deformation, or both plastic deformation and elastic deformation.
　バッテリ１００は、回路基板１１０の上主面に位置している。バッテリ１００は、図示しない配線により回路基板１１０と電気的に接続されている。バッテリ１００は、回路基板１１０を介して駆動モジュール１０に電力を供給する。筐体１２０は、駆動モジュール１０、バッテリ１００及び回路基板１１０を収容している。 The battery 100 is located on the upper main surface of the circuit board 110 . The battery 100 is electrically connected to the circuit board 110 by wiring (not shown). Battery 100 supplies power to drive module 10 through circuit board 110 . The housing 120 houses the drive module 10 , the battery 100 and the circuit board 110 .
（その他の実施形態）
　本発明に係る駆動モジュールは、駆動モジュール１０，１０ａ～１０ｆに限らず、その要旨の範囲内において変更可能である。なお、駆動モジュール１０，１０ａ～１０ｆの構成を任意に組み合わせてもよい。 (Other embodiments)
The drive modules according to the present invention are not limited to the drive modules 10, 10a to 10f, and can be modified within the scope of the subject matter. The configuration of the drive modules 10, 10a to 10f may be combined arbitrarily.
　本発明に係る基板モジュールは、基板モジュール１１，１１ａ～１１ｆに限らず、その要旨の範囲内において変更可能である。なお、基板モジュール１１，１１ａ～１１ｆの構成を任意に組み合わせてもよい。 The board modules according to the present invention are not limited to the board modules 11, 11a to 11f, and can be modified within the scope of the gist thereof. The configurations of the board modules 11, 11a to 11f may be combined arbitrarily.
　なお、駆動モジュール１０，１０ａ～１０ｆにおいて、樹脂層１５ａ～１５ｅ，２２ａ～２２ｆの材料は、熱可塑性樹脂以外の材料であってもよい。 In the drive modules 10, 10a to 10f, the material of the resin layers 15a to 15e and 22a to 22f may be a material other than thermoplastic resin.
　なお、磁気センサ３０は、上下方向に見て、第１コイルＬ１及び第２コイルＬ２に囲まれていなくてもよい。 Note that the magnetic sensor 30 does not have to be surrounded by the first coil L1 and the second coil L2 when viewed in the vertical direction.
　なお、磁気センサ３０の全体は、貫通孔Ｈ内に位置していなくてもよい。磁気センサ３０は、例えば、第１積層体１３の右に位置してもよい。 Note that the entire magnetic sensor 30 does not have to be positioned within the through hole H. The magnetic sensor 30 may be positioned to the right of the first stack 13, for example.
　なお、磁気センサ３０の上面は、第１積層体第１主面Ｓ１より上に位置していてもよい。 Note that the upper surface of the magnetic sensor 30 may be positioned above the first main surface S1 of the first laminate.
　なお、樹脂層２２ａ～２２ｆ（第２樹脂層）の材料は、樹脂層１５ａ～１５ｅ（第１樹脂層）の材料と異なっていてもよい。 The material of the resin layers 22a-22f (second resin layer) may be different from the material of the resin layers 15a-15e (first resin layer).
　なお、基板モジュール１１は、駆動モジュール１０，１０ａ～１０ｆ以外の機器に使用されてもよい。基板モジュール１１の第１コイルＬ１及び第２コイルＬ２は、例えば、アンテナとして機能してもよい。この場合、第１コイルＬ１及び第２コイルＬ２は、電力の送受信を行ってもよいし、高周波信号の送受信を行ってもよい。 Note that the substrate module 11 may be used in devices other than the drive modules 10, 10a to 10f. The first coil L1 and the second coil L2 of the board module 11 may function as antennas, for example. In this case, the first coil L1 and the second coil L2 may transmit and receive electric power, or transmit and receive high-frequency signals.
　なお、信号導体６２ａ，６２ｂは、樹脂層２２ｆの下主面に位置していてもよい。この場合、信号導体６２ａ，６２ｂを保護する保護層が樹脂層２２ｆの下に設けられる。 The signal conductors 62a and 62b may be positioned on the lower main surface of the resin layer 22f. In this case, a protective layer is provided under the resin layer 22f to protect the signal conductors 62a and 62b.
　なお、信号導体２８，２９の線幅方向の幅は、第１コイル導体１８ａ～１８ｄの線幅方向の幅Ｗ１より大きくてもよい。すなわち、信号導体２８，２９の線幅方向の幅は、第２コイル導体２４ａ～２４ｄの線幅方向の幅Ｗ２と等しくてもよい。これにより、信号導体２８，２９の低抵抗化が図られる。 The width of the signal conductors 28 and 29 in the line width direction may be larger than the width W1 of the first coil conductors 18a to 18d in the line width direction. That is, the width of the signal conductors 28 and 29 in the line width direction may be equal to the width W2 of the second coil conductors 24a to 24d in the line width direction. Thereby, the resistance of the signal conductors 28 and 29 is reduced.
　なお、下方向が第１方向ＤＩＲ１であり、上方向が第２方向ＤＩＲ２であってもよい。 Note that the downward direction may be the first direction DIR1 and the upward direction may be the second direction DIR2.
　なお、第１コイルＬ１は、１以上の第１コイル導体を含んでいればよい。 It should be noted that the first coil L1 may include one or more first coil conductors.
　なお、第２コイルＬ２は、１以上の第２コイル導体を含んでいればよい。 The second coil L2 may include one or more second coil conductors.
　なお、電子機器１は、駆動モジュール１０の代わりに駆動モジュール１０ａ～１０ｆのいずれかを備えていてもよい。 Note that the electronic device 1 may include any one of the drive modules 10a to 10f instead of the drive module 10.
１：電子機器
１０，１０ａ～１０ｈ：駆動モジュール
１１，１１ａ～１１ｆ：基板モジュール
１３：第１積層体
１４：第２積層体
１５ａ～１５ｅ，２２ａ～２２ｆ：樹脂層
１６：保護層
１８ａ～１８ｄ：第１コイル導体
２４ａ～２４ｄ：第２コイル導体
３０：磁気センサ
５０：磁石
７０：実装部品
１２０：筐体
Ａｘ１：第１コイル軸
Ａｘ２：第２コイル軸
ＤＩＲ１：第１方向
ＤＩＲ２：第２方向
Ｈ：貫通孔
Ｌ１：第１コイル
Ｌ２：第２コイル
Ｓ１：第１積層体第１主面
Ｓ２：第１積層体第２主面
Ｓ３：第２積層体第１主面
Ｓ４：第２積層体第２主面 1: Electronic device 10, 10a-10h: Drive module 11, 11a-11f: Board module 13: First laminate 14: Second laminate 15a-15e, 22a-22f: Resin layer 16: Protective layers 18a-18d: First coil conductors 24a to 24d: Second coil conductor 30: Magnetic sensor 50: Magnet 70: Mounting component 120: Housing Ax1: First coil axis Ax2: Second coil axis DIR1: First direction DIR2: Second direction H : through hole L1: first coil L2: second coil S1: first laminate first main surface S2: first laminate second main surface S3: second laminate first main surface S4: second laminate second main surface 2 principal surfaces

Claims (13)

  1. 　上下方向の一方が第１方向であり、上下方向の他方が第２方向であり、
    　基板モジュールは、
    　上下方向に並ぶ第１積層体第１主面及び第１積層体第２主面を有している第１積層体と、
    　上下方向に並ぶ第２積層体第１主面及び第２積層体第２主面を有しており、かつ、前記第１積層体より前記第２方向に位置し、かつ、上下方向に見て前記第１積層体と重なっている第２積層体と、
    　前記第１積層体に設けられている第１コイルであって、上下方向に延びる第１コイル軸の周囲を周回する螺旋形状を有している第１コイルと、
    　前記第２積層体に設けられている第２コイルであって、上下方向に延びる第２コイル軸の周囲を周回する螺旋形状を有している第２コイルであって、上下方向に見て、前記第１コイルと重なっている第２コイルと、
    　を備えており、
    　前記第１積層体は、前記第２積層体に対して固定されており、
    　上下方向に見た前記第２積層体の面積は、上下方向に見た前記第１積層体の面積より大きく、
    　前記第１コイルは、前記第２コイルと電気的に接続されており、
    　前記第１コイルは、上下方向に見て、前記第１コイル軸の周囲を周回する１以上の第１コイル導体を含んでおり、
    　前記第２コイルは、上下方向に見て、前記第２コイル軸の周囲を周回する１以上の第２コイル導体を含んでおり、
    　上下方向に見て、前記第１コイル導体及び前記第２コイル導体が延びる方向に直交する方向は、線幅方向であり、
    　前記第１コイル導体の周回数と前記第１コイル導体の前記線幅方向の幅との積は、前記第２コイル導体の周回数と前記第２コイル導体の前記線幅方向の幅との積より小さい、
    　基板モジュール。     One of the vertical directions is the first direction, the other of the vertical directions is the second direction,
    The board module
    a first laminate having a first main surface of the first laminate and a second main surface of the first laminate arranged vertically;
    It has a second laminated body first main surface and a second laminated body second main surface arranged in the vertical direction, is located in the second direction from the first laminated body, and is viewed in the vertical direction a second laminate overlapping the first laminate;
    a first coil provided in the first laminate, the first coil having a helical shape winding around a first coil axis extending in the vertical direction;
    A second coil provided in the second laminate, the second coil having a helical shape winding around a second coil axis extending in the vertical direction, when viewed in the vertical direction, a second coil overlapping the first coil;
    and
    The first laminate is fixed with respect to the second laminate,
    The area of the second laminate seen in the vertical direction is larger than the area of the first laminate seen in the vertical direction,
    The first coil is electrically connected to the second coil,
    The first coil includes one or more first coil conductors winding around the first coil axis when viewed in the vertical direction,
    The second coil includes one or more second coil conductors winding around the second coil axis when viewed in the vertical direction,
    A direction orthogonal to the extending direction of the first coil conductor and the second coil conductor when viewed in the vertical direction is the line width direction,
    The product of the number of turns of the first coil conductor and the width of the first coil conductor in the line width direction is the product of the number of turns of the second coil conductor and the width of the second coil conductor in the line width direction. less than
    board module.
  2. 　前記第２積層体第１主面は、前記第２積層体第２主面より前記第１方向に位置しており、
    　前記基板モジュールは、
    　前記第２積層体第１主面に実装される実装部品を、
    　更に備えている、
    　請求項１に記載の基板モジュール。     the first main surface of the second laminate is located in the first direction from the second main surface of the second laminate, and
    The substrate module is
    Mounting components to be mounted on the first main surface of the second laminate,
    is further equipped with
    The substrate module according to claim 1.
  3. 　前記実装部品は、磁石の磁力を検知する磁気センサである、
    　請求項２に記載の基板モジュール。     The mounting component is a magnetic sensor that detects the magnetic force of a magnet,
    The board module according to claim 2.
  4. 　前記磁気センサは、上下方向に見て、前記第１コイル及び前記第２コイルに囲まれている、
    　請求項３に記載の基板モジュール。     The magnetic sensor is surrounded by the first coil and the second coil when viewed in the vertical direction,
    The board module according to claim 3.
  5. 　前記第１積層体には、前記第１積層体を上下方向に貫通する貫通孔が設けられており、
    　前記磁気センサの少なくとも一部は、前記貫通孔内に位置している、
    　請求項３又は請求項４に記載の基板モジュール。     The first laminate is provided with a through hole penetrating the first laminate in the vertical direction,
    at least a portion of the magnetic sensor is positioned within the through hole;
    The board module according to claim 3 or 4.
  6. 　前記第１積層体第１主面は、前記第１積層体第２主面より前記第１方向に位置しており、
    　前記磁気センサの前記第１方向の端は、前記第１積層体第１主面より前記第２方向に位置している、
    　請求項３ないし請求項５のいずれかに記載の基板モジュール。     the first main surface of the first laminate is located in the first direction from the second main surface of the first laminate, and
    The end of the magnetic sensor in the first direction is positioned in the second direction from the first main surface of the first laminate,
    The board module according to any one of claims 3 to 5.
  7. 　前記実装部品と前記第２コイルとが互いに電気的に接続されている、
    　請求項２に記載の基板モジュール。     the mounting component and the second coil are electrically connected to each other;
    The board module according to claim 2.
  8. 　前記第１コイル導体の周回数は、前記第２コイル導体の周回数より少ない、
    　請求項１ないし請求項７のいずれかに記載の基板モジュール。     The number of turns of the first coil conductor is less than the number of turns of the second coil conductor.
    The board module according to any one of claims 1 to 7.
  9. 　前記第１コイル導体の前記線幅方向の幅は、前記第２コイル導体の前記線幅方向の幅より小さい、
    　請求項１ないし請求項８のいずれかに記載の基板モジュール。     the width of the first coil conductor in the line width direction is smaller than the width of the second coil conductor in the line width direction;
    The board module according to any one of claims 1 to 8.
  10. 　前記第１積層体は、複数の第１樹脂層が上下方向に積層された構造を有しており、
    　前記第２積層体は、複数の第２樹脂層が上下方向に積層された構造を有している、
    　請求項１ないし請求項９のいずれかに記載の基板モジュール。     The first laminate has a structure in which a plurality of first resin layers are laminated in the vertical direction,
    The second laminate has a structure in which a plurality of second resin layers are laminated in the vertical direction,
    The board module according to any one of claims 1 to 9.
  11. 　前記第２樹脂層の材料は、前記第１樹脂層の材料と同じである、
    　請求項１０に記載の基板モジュール。     The material of the second resin layer is the same as the material of the first resin layer,
    The substrate module according to claim 10.
  12. 　請求項１ないし請求項１１のいずれかに記載の基板モジュールと、
    　前記第１コイルより前記第１方向に位置し、かつ、上下方向に見て、前記第１コイルと重なる磁石と、
    　を備えており、
    　前記第１コイル及び前記第２コイルが発生する磁力により、前記磁石の前記第１コイル及び前記第２コイルに対する位置が変化する、
    　駆動モジュール。     a substrate module according to any one of claims 1 to 11;
    a magnet located in the first direction from the first coil and overlapping the first coil when viewed in the vertical direction;
    and
    The magnetic force generated by the first coil and the second coil changes the position of the magnet with respect to the first coil and the second coil,
    drive module.
  13. 　請求項１２に記載の駆動モジュールと、
    　前記駆動モジュールを収容している筐体と、
    　を備えている、
    　電子機器。     a drive module according to claim 12;
    a housing housing the drive module;
    is equipped with
    Electronics.
PCT/JP2022/028170 2021-08-19 2022-07-20 Substrate module, drive module, and electronic apparatus WO2023021908A1 (en)

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JPH07272935A (en) * 1995-03-20 1995-10-20 Taiyo Yuden Co Ltd Laminate chip inductor and production process thereof
JP2002208515A (en) * 2001-01-09 2002-07-26 Murata Mfg Co Ltd Laminated inductor
JP2014170869A (en) * 2013-03-05 2014-09-18 Omron Automotive Electronics Co Ltd Magnetic device
WO2019021764A1 (en) * 2017-07-24 2019-01-31 株式会社村田製作所 Actuator and method for manufacturing actuator

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JP7272935B2 (en) 2019-11-18 2023-05-12 三菱重工業株式会社 Vibration suppression device for rotating machinery and rotating machinery

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JPH07272935A (en) * 1995-03-20 1995-10-20 Taiyo Yuden Co Ltd Laminate chip inductor and production process thereof
JP2002208515A (en) * 2001-01-09 2002-07-26 Murata Mfg Co Ltd Laminated inductor
JP2014170869A (en) * 2013-03-05 2014-09-18 Omron Automotive Electronics Co Ltd Magnetic device
WO2019021764A1 (en) * 2017-07-24 2019-01-31 株式会社村田製作所 Actuator and method for manufacturing actuator

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