WO2023010895A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2023010895A1
WO2023010895A1 PCT/CN2022/088272 CN2022088272W WO2023010895A1 WO 2023010895 A1 WO2023010895 A1 WO 2023010895A1 CN 2022088272 W CN2022088272 W CN 2022088272W WO 2023010895 A1 WO2023010895 A1 WO 2023010895A1
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WO
WIPO (PCT)
Prior art keywords
screen
middle frame
chip
electronic device
skirt
Prior art date
Application number
PCT/CN2022/088272
Other languages
English (en)
French (fr)
Inventor
严斌
周国统
马冬
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US17/795,100 priority Critical patent/US20240237237A1/en
Priority to EP22744364.5A priority patent/EP4152903A4/en
Publication of WO2023010895A1 publication Critical patent/WO2023010895A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1635Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1647Details related to the display arrangement, including those related to the mounting of the display in the housing including at least an additional display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0086Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0247Electrical details of casings, e.g. terminals, passages for cables or wiring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0262Details of the structure or mounting of specific components for a battery compartment

Definitions

  • the present application relates to the field of terminal equipment, and in particular to an electronic equipment.
  • the electronic device can include a casing, a screen arranged on the casing, a middle frame, a screen chip, a screen outlet and a battery arranged in the casing, the middle frame is arranged parallel to the screen, and the side of the middle frame away from the screen Set the battery, and set the screen chip and screen outlet on the side of the middle frame close to the screen.
  • the screen outlet is usually located in the length direction of the electronic device, the screen chip and the screen outlet are just above the battery, and the battery is separated from the screen chip and the screen outlet by the middle frame of the housing.
  • the screen chip is attached to the screen outlet line, which makes the screen chip form a raised structure relative to the screen outlet line; and in order to ensure the reliability of each device inside the electronic device, the gap between the screen chip and the middle frame needs to be larger than the screen outlet line and the middle frame.
  • the frame gap which makes the partially protruding screen chip will lead to thicker electronic equipment.
  • the present application provides an electronic device to solve the problem that the thickness of the whole device is thickened due to local protrusions.
  • the present application provides an electronic device, including: a casing, a display screen is arranged on the casing, a cavity is formed between the casing and the display screen, and a middle frame, Screen chips, screen outlets and batteries;
  • the middle frame is provided with a middle frame opening, and the thickness of the middle frame opening is equal to the thickness of the middle frame;
  • the battery is arranged on a side of the middle frame away from the display screen;
  • the screen outlet is set on the side of the middle frame close to the display screen, the screen outlet is connected to one end of the display screen, and the large surface of the screen outlet is located between the display screen and the middle frame between;
  • the screen chip is arranged on the large surface of the screen outlet, and is located between the middle frame and the large surface of the screen outlet; the raised structure formed by the screen chip relative to the large surface of the screen outlet It is located in the opening of the middle frame, and the protrusion height of the raised structure is smaller than the thickness of the opening of the middle frame.
  • the present application provides an electronic device, including: a housing, a display screen is arranged on the housing, a cavity is formed between the housing and the display screen, and a middle frame, Screen chips, screen outlets and batteries;
  • a groove is provided on the middle frame, and the depth of the groove is smaller than the thickness of the middle frame;
  • the battery is arranged on a side of the middle frame away from the display screen;
  • the screen outlet is set on the side of the middle frame close to the display screen, the screen outlet is connected to one end of the display screen, and the large surface of the screen outlet is located between the display screen and the middle frame between;
  • the screen chip is arranged on the large surface of the screen outlet, and is located between the middle frame and the large surface of the screen outlet; the raised structure formed by the screen chip relative to the large surface of the screen outlet in the groove.
  • the embodiment of the present application provides an electronic device, and inside the device, the middle frame is provided with a middle frame opening.
  • the screen chip and screen outlet are located on the side of the middle frame close to the display, the battery is located on the side of the middle frame away from the display, and the screen chip is attached to the large surface of the screen outlet.
  • the screen chip is accommodated by the opening of the middle frame.
  • the protrusion height of the large surface of the screen chip relative to the screen outlet is smaller than the thickness of the middle frame opening, and the distance between the screen chip and the battery is greater than The avoidance distance of the screen chip.
  • the electronic device avoids the screen chip through the hole in the middle frame, which can prevent the screen chip from moving down and contacting the middle frame due to the user pressing the display screen, causing damage; Just set the minimum wall thickness that satisfies reliability requirements.
  • This avoidance method can make full use of the internal space of the electronic device, and reduce the wall thickness of the middle frame while realizing the avoidance of the screen chip, which can further reduce the thickness of the entire electronic device.
  • FIG. 1A is a front structural view of the electronic device in the embodiment of the present application.
  • FIG. 1B is a structural diagram of the back of the electronic device in the embodiment of the present application.
  • Figure 2A is a back view of the screen of the electronic device in the embodiment of the present application.
  • Fig. 2B is the rear perspective view of the electronic device in the embodiment of the present application.
  • FIG. 2C is a perspective view of the entire electronic device in the embodiment of the present application.
  • Fig. 3 is a partial sectional view of the A-A section of Fig. 2C in the embodiment of the present application;
  • Fig. 4 is a partial cross-sectional view of the A-A section of the middle frame opening of the battery compartment in the embodiment of the present application;
  • Fig. 5A is a perspective view of the back of the whole machine with the opening in the middle frame of the battery compartment in the embodiment of the present application;
  • Fig. 5B is a perspective view of the back of the whole machine when the screen chip is accommodated by the opening of the middle frame in the embodiment of the present application;
  • Fig. 6A is a schematic structural view of setting reinforcement components at the opening of the middle frame in the embodiment of the present application.
  • Fig. 6B is a cross-sectional view of a reinforcing component in an embodiment of the present application.
  • Fig. 7 is a perspective view of the back of the whole machine in which reinforcing components are installed at the opening of the middle frame in the embodiment of the present application;
  • Fig. 8 is a partially enlarged view of opening a card slot in the middle frame in the embodiment of the present application.
  • Fig. 9 is a perspective view of the back of the electronic device with reinforcing components in the embodiment of the present application.
  • Figure 10 is a partial cross-sectional view of the B-B section in Figure 9 in the embodiment of the present application.
  • Fig. 11A is a structural schematic view of a reinforcement member with a notched skirt viewed from the convex side of the bottom edge in the embodiment of the present application;
  • Fig. 11B is a structural schematic view of the reinforcement member with a notched skirt in the embodiment of the present application viewed from the concave side of the bottom edge;
  • Fig. 12A is a structural perspective view of a reinforcing member with a notched skirt arranged in the contact area in the embodiment of the present application;
  • Fig. 12B is a structural effect diagram of setting a reinforcing part with a notched skirt in the contact area in the embodiment of the present application;
  • Fig. 13A is a schematic view of the structure of the reinforcement member with unequal skirt heights viewed from the protruding side of the bottom edge in the embodiment of the present application;
  • Fig. 13B is a structural schematic view of the reinforcement member with unequal skirts in the embodiment of the present application viewed from the concave side of the bottom edge;
  • Fig. 14 is a side view of the reinforcing member with unequal skirt shown in Fig. 13A in the embodiment of the present application;
  • Fig. 15A is a perspective view of the structure of a reinforcing part with skirts of different heights in the contact area in the embodiment of the present application;
  • Fig. 15B is a structural effect diagram of reinforcing parts with unequal skirts in the contact area in the embodiment of the present application;
  • Fig. 16 is a front perspective view of an electronic device with two screen chips in an embodiment of the present application.
  • Figure 17 is a perspective view of the back of the whole machine in which the battery compartment is provided with two openings in the middle frame in the embodiment of the present application;
  • Figure 18 is a perspective view of the back of the whole machine when two screen chips are accommodated by two middle frame openings in the embodiment of the present application;
  • Fig. 19 is a perspective view of the back of the whole machine in which two reinforcing components are arranged at the openings of the two middle frames in the embodiment of the present application.
  • first”, second, etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first”, “second”, etc. may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • FIG. 1A is a front structural view of the electronic device in the embodiment of the present application
  • FIG. 1B is a rear structural view of the electronic device in the embodiment of the present application.
  • the electronic device 100 provided by the embodiment of the present application includes a housing, and a display area 103 provided on the housing.
  • the display area 103 is provided with a display screen, which can be a bendable screen or a flexible screen.
  • the casing includes a first frame body 101 and a second frame body 102, and a rotating shaft is arranged between the two frame bodies, and the ends of two adjacent frame bodies close to the rotating shaft can rotate around the rotating shaft between the two frame bodies. Rotate, so that the ends of the two frames away from the rotating shaft are relatively close to or relatively far away, and the electronic device 100 can be in different states such as closed or unfolded.
  • the display screen on the display area 103 covers the surfaces of the two frames, and can be folded or unfolded as the position between the two frames changes.
  • the first frame body 101 and the second frame body 102 are unfolded, they will be arranged side by side and coplanar with each other. surface, which can be displayed as a separate display screen.
  • the state shown in FIG. 1B is the state formed after the structure in FIG. 1A is turned upside down in the horizontal direction.
  • the number of frames of the electronic device 100 can be two or more, and when the number of frames is more than two, each adjacent frame can rotate around a mutually parallel rotation axis, thereby forming multiple The layer collapses the structure, or expands to get a larger display area.
  • the electronic device 100 has two housings as an example for illustration.
  • the electronic device 100 includes various components inside the electronic device, such as a processor, a memory, a camera assembly, a screen chip 110, a screen outlet line 120, a cable 140 and a battery 150, etc., exemplary Yes, components such as the processor, the memory, and the camera assembly can be arranged inside the first frame body 101 (as shown in FIG.
  • the second frame body 102 can be used to carry components such as the screen chip 110 , the screen outlet wire 120 , the cable 140 and the battery 150 .
  • the screen chip 110 that is, a screen IC (integrated circuit, IC), refers to a chip used to drive and light up the screen.
  • the material of the screen chip is fragile, generally glass, and it is fragile after being hit. Therefore, when the screen chip is installed inside the electronic device, a certain avoidance space must be reserved between the screen chip and other internal components.
  • a screen chip is set in the electronic device to realize the lighting of the screen.
  • two screen chips can also be arranged in the electronic device.
  • the two screen chips may be arranged sequentially along the length direction of the device (for example, for an electronic device with a folding screen, it may be the length direction when the screen is folded).
  • the screen outlet 120 that is, the screen COP (chip on pi, COP), is a circuit board formed based on a flexible screen packaging process.
  • the cable 140 also called a flexible printed circuit (FPC) is used for data transmission in moving parts and moving areas.
  • FPC flexible printed circuit
  • Flexwires can be moved, bent, and twisted without damaging the wires, and can conform to different shapes and special package sizes.
  • Fig. 3 is a partial sectional view of the section A-A of Fig. 2C in the embodiment of the present application.
  • the display screen on the display area 103 covers the first frame body 101 and the second frame body 102, from the display area 103 to the direction of the back of the device, the gasket 121 is attached to the bottom of the display screen, and one end of the display screen There is a screen outlet 120 at the bottom, and the screen outlet 120 is connected with one end of the display screen.
  • the screen outlet wire 120 is bent along the direction from the display screen to the back of the device.
  • the large surface (not shown in the figure) of the screen outlet wire 120 is attached to the underside of the gasket 121, that is, the side of the gasket 121 that is close to the back of the device.
  • the large surface of the screen outlets 120 is evenly distributed on the upper surface, and the gasket 121 is used to support the large surface.
  • the screen chip 110 is pasted under the large surface of the screen outlet wire 120 , and the screen chip 110 is located between the middle frame 131 and the large surface of the screen outlet wire 120 .
  • the large surface of the screen outlet 120 is not shown in the figure. From the display area 103 to the back of the device, the internal structure sequence of the electronic device is the display screen, the gasket 121 , the large surface of the screen outlet 120 , the screen chip 110 , and the middle frame 131 .
  • the flex cable 140 is located between the display screen and the middle frame 131.
  • the flex cable 140 is attached to the bottom of the display screen, and one end of the flex cable 140 extends to the large surface of the screen outlet line 120, and is bonded to the large surface, which is equivalent to a flat cable
  • One end of the cable 140 extends to the spacer 121 , and the extended end of the cable 140 is attached to the same side of the large surface as the screen chip 110 .
  • One end (ie, the extension end) of the cable 140 is connected to the screen outlet cable 120 , and the other end of the cable 140 is connected to the processor.
  • the extension end of the cable 140 and the screen chip 110 are attached to the large surface, the extension end of the cable 140 and the screen chip 110 are not in contact.
  • the thickness of the extension end of the cable 140 must be It is less than or equal to the thickness of the screen chip 110 . If the thickness of the extension end of the cable 140 is greater than the thickness of the screen chip 110 , a higher avoidance space will be created, resulting in an increase in the overall thickness.
  • the battery 150 is disposed on a side of the screen chip 110 away from the screen, that is, the battery 150 is disposed below the screen chip 110 .
  • the battery compartment 130 is formed by the casing of the electronic device.
  • the battery compartment 130 may be formed in the second frame body 102 , and the battery 150 is fixed in the battery compartment 130 .
  • the opening direction of the battery compartment 130 faces the side away from the screen, so that the battery 150 and the screen chip 110 are separated by the bottom of the battery compartment 130 .
  • the bottom of the battery compartment 130 is used as the middle frame 131 of the electronic device, the middle frame 131 and the display screen can be arranged in parallel, and the top of the middle frame 131 (the side close to the display screen) is provided with a screen chip 110 , a screen outlet line 120 and a cable 140 , A battery 150 is provided under the middle frame 131 (on the side away from the display screen).
  • the function of the middle frame 131 is not only to separate the components inside the electronic device, but also to improve the stability of the housing of the electronic device. If the user touches and presses the display screen with a finger when using an electronic device, the screen chip 110, the screen outlet line 120 and the cable 140 will move downward, and these three components are all located above the battery 150.
  • the middle frame 131 If The downward movement of the three components will contact the middle frame 131 , and then drive the middle frame 131 to move downward to contact the battery 150 , causing the battery 150 to wear out. Therefore, the battery 150 and the three components are separated by the middle frame 131 , which can prevent the three components from continuously moving downwards, avoid contact with the battery 150 , and protect the battery 150 .
  • the rest of the devices without data transmission do not directly contact each other, but reserve a certain safety gap.
  • a safety gap is reserved between the middle frame 131 and the large surface of the screen outlet 120 (equivalent to the position of the gasket 121)
  • a safety gap is reserved between the middle frame 131 and the cable 140, and the middle frame 131 and the screen chip 110 to reserve a safety gap.
  • the safety gap to be reserved between the middle frame 131 and the large surface of the screen outlet 120 or the cable 140 may be about 0.1 mm.
  • the thickness of the screen chip 110 is about 0.25-0.3mm, and the large surface of the screen chip 110 relative to the screen outlet 120 (equivalent to the position of the spacer 121) forms a raised structure, that is, the thickness of the raised structure is about 0.25-0.3mm.
  • the user presses the display screen it will drive the screen chip 110 to move down and touch the middle frame 131 , and the screen chip 110 is made of glass, which is fragile after being hit, causing the screen chip 110 to be worn. Therefore, in order to protect the screen chip 110 from being worn out, a certain avoidance space needs to be reserved between the screen chip 110 and the middle frame.
  • the avoidance space should reserve at least a distance of about 0.25 mm, that is, the avoidance distance of the screen chip 110 is at least about 0.25 mm.
  • the middle frame 131 (ie, the bottom of the battery compartment 130) needs to be moved down toward the back of the device as a whole, which will increase the overall thickness of the electronic device.
  • the relative position of the middle frame 131 and the screen chip 110 is partially sunk, so that the center
  • the frame 131 presents a partially sunken groove for accommodating the screen chip 110 , and the depth of the groove is smaller than the thickness of the middle frame 131 .
  • the groove formed on the middle frame 131 can also avoid the cable 140 at the same time. Since the groove on the middle frame 131 can avoid the screen chip 110 and the wiring 140 at the same time, but the protrusion heights of the raised structures formed by the screen chip 110 and the wiring 140 relative to the screen outlet 120 are different, therefore, the concave The structure of the groove can be irregular, and it is enough to avoid the screen chip 110 and the wiring 140 .
  • the gap between the screen chip 110 and the middle frame 131 needs to be larger than the gap between the large surface of the screen outlet 120 (equivalent to the position of the gasket 121) and the middle frame 131, so that the concave hole set in the middle frame 131
  • the depth of the groove should be increased.
  • the middle frame 131 produces a minimum thickness at the position where the groove is set, and the minimum thickness is smaller than that of the middle frame. 131 does not set the overall thickness of the groove location.
  • the thickness of the middle frame 131 needs to be thickened as a whole to ensure that the remaining thickness of the middle frame 131 after the local grooves are set can still meet the requirements. Reliability requirements.
  • the overall thickness H1 of the middle frame 131 needs to be higher than 0.65 mm, the depth of the groove formed in the middle frame 131 by local sinking is at least greater than 0.25 mm, and the middle frame 131 is provided with a concave
  • the minimum thickness at the slot location shall be at least 0.4mm.
  • the electronic device provided in another embodiment of the present application improves the internal components of the electronic device, that is, as shown in FIG.
  • the screen chip 110 is opposite to the hole, and the middle frame opening 132 is formed on the middle frame 131 .
  • the middle frame opening 132 is a through hole, and the depth of the middle frame opening 132 is equal to the thickness of the middle frame 131 .
  • the protruding screen chip 110 is avoided through the opening 132 of the middle frame, so that the thickness of the rest of the middle frame 131 will not be increased, thereby achieving the effect of reducing the thickness of the whole machine.
  • the black structure (not marked in the figure) between the large surface of the screen outlet 120 and the middle frame 131 is adhesive backing, which is used to stick the screen outlet and the middle frame 131 together for Cushioned and waterproof.
  • the electronic device may be a folding screen device, or may be a tablet computer or the like.
  • the electronic device may be a folding screen device, or may be a tablet computer or the like.
  • Fig. 4 is a partial cross-sectional view of the A-A cross-section of the opening in the middle frame of the battery compartment in the embodiment of the present application.
  • the middle frame 131 in the interior of the electronic device, in order to make the middle frame 131 avoid the raised screen chip 110, the position corresponding to the screen chip 110 of the middle frame 131 is hollowed out to form a middle frame opening 132. At this time, the middle frame The position of the frame 131 relative to the screen chip 110 has no thickness.
  • the relative position between the middle frame 131 and the large surface of the screen outlet 120 is set according to the minimum safety gap, and the distance between the middle frame 131 and the large surface meets the requirement of the minimum safety gap, so that the raised screen chip 110 Embed in the opening 132 of the middle frame.
  • the screen chip 110 is entirely in the opening 132 of the middle frame.
  • the space of the opening 132 of the middle frame is used to accommodate the screen chip 110.
  • the convex surface formed by the screen chip 110 relative to the large surface of the screen outlet The raised structure is located in the opening 132 of the middle frame, and the protrusion height of the raised structure is smaller than the thickness of the opening 132 of the middle frame.
  • the overall thickness of the middle frame 131 of the electronic device should be as thin as possible under the premise of ensuring its own reliability.
  • the overall thickness of the middle frame 131 should be set at least 0.4mm. Since the electronic device provided by this embodiment avoids the raised screen chip 110 by setting the middle frame opening 132 on the middle frame 131, it is no longer necessary to use the groove to accommodate the screen chip 110, therefore, the middle frame 131 is no longer
  • a thicker thickness needs to be set, that is, the thickness of the middle frame 131 adjacent to the screen or the thickness of the position where the middle frame 131 contacts the battery 150 (such as the bottom of the battery compartment 130) can be set to the minimum wall thickness that can ensure reliability.
  • the thickness of the middle frame 131 adjacent to the screen can be set to 0.4 mm, or the thickness of the position where the middle frame 131 contacts the battery can be set to 0.4 mm.
  • the overall thickness H1 of the middle frame 131 is greater than 0.65 mm; while in the solution provided by the embodiment of the present application shown in Figure 4, the overall thickness H2 of the middle frame 131 can be set to a minimum wall thickness of 0.4 mm. Therefore, it can be seen from the comparison that the thickness of the middle frame 131 shown in FIG. 4 used in the embodiment of the present application is smaller than the thickness of the middle frame 131 shown in FIG. 3 . Therefore, by reducing the thickness of the middle frame 131, the overall thickness of the electronic device can be further reduced.
  • the size of the middle frame opening 132 is adapted to the size of the screen chip 110 . From the perspective of reliability, the size of the opening 132 of the middle frame should not be too large; from the perspective of avoiding the screen chip 110 , the size of the opening 132 of the middle frame should not be too small.
  • Fig. 5A is a perspective view of the back of the whole machine with a middle frame opening in the battery compartment in the embodiment of the present application
  • Fig. 5B is a perspective view of the back of the whole machine when the screen chip is accommodated by the middle frame opening in the embodiment of the present application.
  • the structure of the middle frame opening 132 can also be A strip-shaped structure along the length of the device, such as a rectangular structure.
  • the opening 132 of the middle frame can also be in other shapes, such as rounded rectangle, ellipse and so on.
  • the screen chip 110 when the screen chip 110 is accommodated by the middle frame opening 132 , since the middle frame opening 132 corresponds to the position of the screen chip 110 relative to the middle frame 131 , the screen chip 110 can be embedded in the middle frame opening 132 .
  • the size of the opening 132 of the middle frame is slightly larger than that of the screen chip 110 .
  • the middle frame opening 132 is offset by a certain distance to the periphery of the screen chip 110 , and the offset distance can be set to about 1 mm.
  • the offset distance is greater than 1 mm. From the perspective of the overall offset size, the length of the middle frame opening 132 is about 2 mm longer than that of the screen chip 110 , and the width of the middle frame opening 132 is about 2 mm larger than the width of the screen chip 110 .
  • the extended end of the cable 140 is in contact with the large surface of the screen outlet 120 (equivalent to the position of the pad 121 ), the extended end of the cable 140 is also higher than the large surface to form a raised structure.
  • the thickness of the extension end of the cable 140 is less than or equal to the thickness of the screen chip 110 (that is, the protruding height relative to the large surface of the screen outlet), so as to avoid a larger avoidance space at the middle frame 131, thereby avoiding an increase in the overall thickness.
  • the middle frame opening 132 needs to avoid the screen chip 110 and the extension end of the cable 140 at the same time. Therefore, the extension end of the cable 140 is located in the opening 132 of the middle frame, and the size of the opening 132 of the middle frame is larger than the sum of the dimensions enclosed by the screen chip 110 and the extension end of the cable 140 , that is, the size of the opening 132 of the middle frame. It should be larger than the peripheral size of the overlapping part of the large surface of the screen chip 110 and the extended end of the cable and the screen outlet line 120 .
  • the starting position (a) of one side of the opening 132 of the middle frame can be opposite to the starting position of the extension end of the cable 140, and the ending position (b) of the other side of the opening 132 of the middle frame can be The position corresponding to the minimum distance required when the middle frame opening 132 is offset from the screen chip 110 .
  • the screen chip 110 due to the relative positional relationship and structural characteristics of the screen chip 110 and the screen outlet 120 , the screen chip 110 forms a convex structure relative to the large surface of the screen outlet 120 .
  • the middle frame 131 needs to avoid the screen chip 110 .
  • the avoidance method of the embodiment of the present application is to set the middle frame opening 132 at the position of the middle frame 131 relative to the screen chip 110, and the middle frame opening 132 accommodates the screen chip 110, so as to prevent the screen chip 110 from moving downward due to the user pressing the display screen Contact with the middle frame 131 will cause damage; at the same time, to avoid the screen chip 110 by means of the middle frame opening 132, it is only necessary to set the minimum wall thickness that meets the reliability requirements. It can be seen that this avoidance method can make full use of the internal space of the electronic device. While realizing the avoidance of the screen chip 110, the wall thickness of the middle frame 131 can be reduced, which can further reduce the thickness of the electronic device.
  • the relative position of the bottom of the battery compartment 130 (middle frame 131) is hollowed out to set the middle frame opening 132. At this time, the distance between the screen chip 110 and the battery 150 There is no middle frame 131 for separation. In this case, if the user presses the display screen hard, the linked screen chip 110 will be forced to sink. Since the position of the screen chip 110 is no longer blocked by the middle frame 110, it may occur that the screen chip 110 sinks excessively. The case of contact with the battery 150 .
  • a reinforcing member 160 can be provided at the position of the middle frame opening 132, and the reinforcing member 160 is located between the screen chip 110 and the battery 150, and the The strong part 160 is fixed around the opening of the middle frame.
  • the reinforcing component 160 plays the role of supporting and limiting, which can not only improve the reliability of the middle frame 131, but also prevent the large deformation of the screen chip 110 due to force.
  • the reinforcing component 160 prevents the continuous sinking of the screen chip 110 , prevents the screen chip 110 from contacting the battery 150 and causing damage, and protects the battery 150 from being punctured and damaged by the screen chip 110 to avoid risks.
  • FIG. 6A is a schematic structural view of a reinforcing component provided at the opening of the middle frame in the embodiment of the present application
  • FIG. 6B is a cross-sectional view of the reinforcing component in the embodiment of the present application.
  • a reinforcement member 160 is provided at the opening 132 of the middle frame, and the reinforcement member 160 includes a bottom edge 161 and a skirt edge 162 And midside 163.
  • the bottom edge 161 is a solid structure, and the skirt edge 162 and the middle edge 163 are both hollow annular structures.
  • the reinforcing component 160 may be made of steel to ensure reliability.
  • the skirt 162 is surrounded by the middle edge 163 around the bottom edge 161, and the plane of the bottom edge 161 is parallel to but not coincident with the plane of the skirt edge 162, that is, after the two are connected by the middle edge 163, the plane of the bottom edge 161 and The planes of the skirt 162 are separated by a certain distance in the parallel direction, so that the cross section of the reinforcing member 160 has a groove structure for accommodating the screen chip 110 , and the depth of the groove structure is greater than the avoidance distance of the screen chip 110 .
  • the middle edge 163 can be connected to the bottom edge 161 and the skirt edge 162 respectively in a vertical state. At this time, the planes where the two adjacent sides of the reinforcement member 160 are located are perpendicular to each other, and the bottom of the groove formed by the reinforcement member 160 and the size of the opening same.
  • the middle edge 163 can also be connected to the bottom edge 161 and the skirt edge 162 respectively in an inclined state. At this time, the planes of the two adjacent sides of the reinforcing member 160 are at non-perpendicular angles, and the bottom of the groove formed by the reinforcing member 160 reaches The size of the opening gradually increases, as shown in Fig. 6B.
  • the reinforcement part 160 When the reinforcement part 160 is installed, the reinforcement part 160 is installed in the middle frame opening 132 in a concave state with the bottom edge 161 below and the skirt edge 162 above, so that the skirt edge 162 is fixed in the center around the middle frame opening 132.
  • the skirt 162 On the frame 131 , the skirt 162 is located between the middle frame 131 and the large surface of the screen outlet 120 .
  • the groove formed by the reinforcing member 160 accommodates the screen chip 110, as shown in FIG.
  • the skirt 162 of the reinforcing member 160 is higher than the bottom edge 161 , the bottom edge 161 is close to the position of the battery 150 , and the skirt 162 is close to the large surface of the screen outlet 120 (equivalent to the position of the spacer 121 ).
  • the bottom edge 161 of the reinforcement member 160 is located on the side of the middle frame opening 132 away from the screen chip 110, that is, the side close to the battery 150, and the distance between the bottom edge 161 and the screen chip 110 is greater than the avoidance distance of the screen chip 110, That is, the depth of the groove formed by the reinforcing component 160 is greater than the escape distance of the screen chip 110 . Therefore, fixing the reinforcing component 160 on the middle frame 131 can not only improve the reliability of the middle frame 131 , but also avoid the screen chip 110 .
  • the screen chip 110 and the battery 150 are separated by the bottom edge 161 of the reinforcing part 160. If the user presses the display screen to cause a large deformation of the screen chip 110, the bottom edge 161 of the reinforcing part 160 can prevent the screen chip 110 from continuing to operate. Sink to avoid contact with battery 150 . Even if the screen chip 110 is damaged due to contact with the bottom edge 161 , the reinforcing component 160 can receive the debris to prevent the debris from contacting the battery 150 to protect the battery 150 .
  • Fig. 7 is a perspective view of the back of the whole machine in which reinforcing components are arranged at the opening of the middle frame in the embodiment of the present application.
  • a middle frame opening 132 is set at the bottom of the battery compartment 130 (middle frame 131) corresponding to the screen chip 110, and a reinforcing member 160 is arranged at the middle frame opening 132, as viewed from a rear perspective view , the bottom edge 161 of the reinforcement component 160 passes through the opening 132 of the middle frame.
  • the dotted frame in the left structure of the content shown in FIG. 7 is the boundary of the reinforcing component 160 , that is, the boundary position of the skirt 162 .
  • the complete structure after the reinforcing component 160 is taken out from the electronic device is shown in the structure on the right side of the content shown in FIG.
  • the protruding structure of 110 corresponds to the effect that the screen chip 110 is accommodated by the protruding part of the reinforcing member 160 .
  • the overall thickness of the reinforcing member 160 is smaller than the wall thickness of the middle frame 131, that is, the vertical distance from the bottom edge 161 to the skirt 162 is smaller than the wall thickness of the middle frame 131, which means that the vertical height of the middle edge 163 is smaller than the wall thickness of the middle frame 131 , the distance between the bottom edge 161 and the battery 150 can be greater than or equal to the distance between the battery 150 and the side of the middle frame 131 close to the battery 150, so that when the reinforcing member 160 is fixed on the middle frame 131, the bottom edge 161 The frame opening 132 passes through, and the bottom of the middle frame 131 will not be exposed, and the bottom of the middle frame 131 is the side close to the battery 150 .
  • the bottom edge 161 is at a certain distance from the bottom of the middle frame 131 , so as to prevent the bottom edge 161 from contacting the battery 150 .
  • the distance between the bottom edge 161 and the bottom of the middle frame 131 can be set to be 0.1-0.15 mm.
  • the skirt 162 is fixed on the middle frame 131 , and the skirt 162 is located between the middle frame 131 and the large surface (corresponding to the position of the spacer 121 ). Since the minimum safety gap is reserved between the middle frame 131 and the large surface, the reinforcing member 160 must have a certain thickness to ensure its own strength, which is greater than the minimum safety gap. Therefore, in order to avoid fixing the skirt 162 between the middle frame 131 and the large surface, because of the need to increase the gap between the middle frame 131 and the large surface, resulting in thickening of the thickness of the electronic device, the middle frame 131 can A slot 133 is provided at the position where the skirt 162 is attached. The slot 133 is used to fix the skirt 162 . The slot 133 is located around the opening 132 of the middle frame and close to the large surface.
  • Fig. 8 is a partially enlarged view of opening a card slot in the middle frame in the embodiment of the present application.
  • a card slot 133 is provided in a sinking manner around the position of the middle frame 131 close to the middle frame opening 132, and when the reinforcing member 160 is installed, the skirt 162 is fitted in the card slot 133 to realize reinforcement. Fastening of the strong part 160 .
  • the way of fitting and connecting the skirt 162 with the slot 133 on the middle frame 131 can be dispensing, spot welding, or back glue, etc., so as to fix the reinforcing component 160 on the edge of the opening 132 of the middle frame, The reinforcing component 160 is fixed and integrated with the middle frame 131 .
  • the top of the skirt 162 exposes the top of the middle frame 131, which is the side close to the large surface, causing the middle frame 131
  • the safety gap between the middle frame 131 and the large surface increases, and if the safety gap between the middle frame 131 and the large surface increases, the overall thickness of the electronic device will increase.
  • the depth H of the slot 133 is set to be greater than the sum of the thickness of the reinforcing member 160 and the thickness of the glue (or spot welding or back glue), so that the top of the skirt 162 is lower than the top of the middle frame 131 , so as to ensure that the minimum safety gap is reserved between the middle frame 131 and the large surface, thereby reducing the overall thickness of the electronic device.
  • the thickness of the dispensing (or spot welding or back glue) between the skirt 162 and the slot 133 is about 0.1 mm, and the thickness of the skirt 162 is about 0.1 mm, then the depth H of the slot 133 is greater than 0.2 mm .
  • the depth tolerance of the slot 133 can be set to 0.05mm, so the depth H of the slot 133 can be 0.25mm.
  • the purpose of setting the depth tolerance of the slot 133 is to make the height of the skirt 162 lower than the height of the middle frame 131 by 0.05 mm when the slot 133 on the middle frame 131 fully accommodates the skirt 162 .
  • the width of the slot 133 provided on the middle frame 131 can be adapted to the width of the skirt 162 .
  • the width of the slot 133 can completely accommodate the skirt 162 , so as to ensure the stability of the skirt 162 .
  • the width of the skirt 162 is about 1-1.5 mm, and the width of the card slot 133 can also be set at 1-1.5 mm.
  • a middle frame opening 132 is set at the position of the middle frame 131 relative to the screen chip 110, and the middle frame opening 132 accommodates the screen chip 110, and the middle frame 131 Use the minimum wall thickness.
  • the middle frame 131 there is no middle frame 131 to separate the screen chip 110 from the battery 150 , and the screen chip 110 will sink excessively and contact the battery 150 after being stressed.
  • the reinforcement member 160 is provided at the position of the opening 132 of the middle frame, and the reinforcement member 160 acts as a support limit, which can not only improve the reliability of the middle frame 131, but also prevent the continuous sinking of the screen chip 110, avoiding The screen chip 110 is in contact with the battery 150 to cause damage, so as to protect the battery 150 and avoid risks.
  • a slot 133 is provided at the contact position between the middle frame 131 and the reinforcement member 160, and the skirt 162 of the reinforcement member 160 is accommodated by the slot 133, so as to prevent the top of the skirt 162 from protruding from the top of the middle frame 131, causing the middle frame 131
  • the safety gap between the large surface of the screen outlet 120 (equivalent to the position of the gasket 121) is increased to ensure that the minimum safety gap is reserved between the middle frame 131 and the large surface of the screen outlet 120, thereby reducing the size of the electronic equipment. machine thickness.
  • Fig. 9 is a perspective view of the back of the electronic device with reinforcing components in the embodiment of the present application
  • Fig. 10 is a partial cross-sectional view of the section B-B in Fig. 9 in the embodiment of the present application.
  • the contact position between the two is the contact area 170 . If the reinforcing member 160 is provided at the opening 132 of the middle frame in the electronic device, the contact position between the reinforcing member 160 and the middle frame 131 will pass through the contact area 170 formed by the extended end of the cable 140 and the large surface.
  • the flat wire 140 is higher than the large surface by a layer of flat wire 140 , so when the reinforcing component 160 passes over the contact area 170 , the thickness of the flat wire 140 will also be higher than one layer of flat wire 140 .
  • the height of the reinforcing component 160 passing through the contact area 170 is higher than the height of the height not passing through the contact area 170 by the thickness of one layer of the wiring 140 , and the height here refers to the height relative to the large surface.
  • the interior of the electronic device will increase the accommodation area from the thickness direction (ie, the direction from the display screen to the rear case), which will affect the overall thickness of the electronic device.
  • the protruding portion of the reinforcement member 160 faces the back of the electronic device (towards the battery), and the opening of the reinforcement member 160 faces the electronic device. the front side (towards the display).
  • the reinforcement component 160 is installed in the opening 132 of the middle frame, part of the skirt 162 of the reinforcement component 160 passes through the contact area 170 formed by the extended end of the cable 140 and the large surface of the screen outlet cable 120 . Therefore, in order to remove the increased height (thickness of the cable 140 ) of the reinforcing component 160 when it passes over the contact area 170 , it can be realized by changing the structural form of the reinforcing component 160 .
  • the height of the cable 140 is about 0.1-0.15 mm
  • the height of the reinforcing component 160 to be removed is also about 0.1-0.15 mm when passing above the contact area 170 .
  • the part of the reinforcing part 160 that passes above the contact area 170 is cut off, that is, the skirt 162 corresponding to the position passing through the contact area 170 is directly cut off to form a reinforcing part 160 with a notched skirt 162, and the remaining
  • the skirt 162 is fixed to the middle frame 131 to prevent the partial thickness of the reinforcing component 160 from increasing the overall thickness of the electronic device.
  • the thickness of the skirt 162 is generally 0.1mm. If the part of the skirt 162 is not enough to accommodate the area adjacent to the contact area 170 and the reinforcing member 160, a part of the middle edge 163 can be further cut, and the part of the middle edge 163 adjacent to the skirt can be cut off. resection.
  • Fig. 11A is a structural schematic view of the reinforcing member with a notched skirt in the embodiment of the present application viewed from the convex side of the bottom edge;
  • Fig. 11B is a view of the reinforcing member with a notched skirt in the embodiment of the present application viewed from the concave side of the bottom edge Schematic diagram of the structure. It can be seen from FIG. 9 that when the reinforcing member 160 passes through the contact area 170 formed by the extended end of the cable 140 and the large surface of the screen outlet cable 120, the reinforcing member 160 has a raised part facing the back of the device (that is, facing the battery side).
  • the skirt 162 at the left upper and lower corners of the reinforcing member 160 is cut off or the skirt 162 at the left upper and lower corners of the reinforcing member 160 is combined with The edge 163 of the adjacent portion of the skirt is cut away to form a first notch 164 and a second notch 165, as shown in FIG. 11A.
  • the state of the reinforcement member 160 with a notched skirt shown in FIG. 11A is a protruding state in which the bottom edge 161 is higher than the skirt edge 162 .
  • Fig. 12A is a structural perspective view of a reinforcing member with a notched skirt in the contact area in the embodiment of the present application
  • Fig. 12B is a structural effect diagram of a reinforcing member with a notched skirt in the contact area in the embodiment of the present application.
  • the cable 140 and the screen outlet 120 form a contact area 170 (white dotted line frame), when the reinforcing member 160 is arranged at the opening 132 of the middle frame to accommodate the raised screen chip 110 by the reinforcing member 160 , the upper and lower corners on the left side of the reinforcing member 160 will pass through the contact area 170 .
  • the reinforcement member 160 is in a convex state.
  • the skirt 162 at the upper and lower corners on the left side of the contact area 170 can be cut off, that is, the formed first gap can be used 164 and the second notch 165 to accommodate the height formed by the contact region 170 .
  • the height of one end of the contact area 170 is accommodated by the first gap 164 of the reinforcing part 160, and the height of the other end of the contact area 170 is accommodated by the second gap 165 of the reinforcing part 160, the two sides of the skirt 162
  • the notch part is no longer fixed to the middle frame 131 and is suspended, while the rest of the skirt 162 is fixed to the middle frame 131 .
  • the reinforcing member 160 will not be in contact with the contact area 170, therefore, the reinforcing member 160 will not have a thickness higher than one layer of the wiring 140 in this part, so , will not affect the increase in the thickness of the electronic device.
  • the determination of the starting point and the ending point of the opening of the first notch 164 or the second notch 165 in the reinforcing member 160 is based on ensuring that the reinforcing member 160 does not come into contact with the contact area 170 .
  • the distance between the opening start point (end point) and the contact area 170 can be set to be about 1 mm.
  • the skirt 162 of the reinforcing member 160 passing through the contact area 170 may be partially stamped to form a reinforcing steel sheet with unequal heights of the skirt.
  • the stamped partial skirt and the middle frame 131 are zero-matched, and no dispensing treatment is performed here, which can save the dispensing space at this position and avoid increasing the height of this position.
  • Fig. 13A is a structural schematic view of the reinforcement member with unequal skirt in the embodiment of the present application viewed from the protruding side of the bottom edge;
  • Fig. 13B is a reinforcement member with unequal skirt height in the embodiment of the present application viewed from the concave side of the bottom edge Schematic diagram of the observed structure. It can be seen from FIG. 9 that when the reinforcement member 160 passes through the contact area 170 formed by the extended end of the cable 140 and the large surface of the screen outlet cable 120, the reinforcement member 160 is in a state where the convex part faces the back of the device, and the reinforcement member 160 The skirt 162 at the upper and lower corners on the left side of 160 will be in contact with the contact area 170 .
  • the skirt 162 at the upper and lower corners on the left side of the reinforcing member 160 is partially punched to form a first punched area 166 and a second punched area 167, as shown in FIG. 13A Show.
  • the reinforcing member 160 with unequal skirts shown in FIG. 13A is in a protruding state where the bottom edge 161 is higher than the skirt edge 162 .
  • the first stamping area 166 and the second stamping area 167 are closer to the bottom edge 161 than the skirt 162, that is The vertical distance between the first stamping area 166 and the second stamping area 167 and the bottom edge 161 is smaller than the vertical distance between the skirt 162 and the bottom edge 161 .
  • Fig. 14 is a side view of the reinforcing member with unequal skirts shown in Fig. 13A in the embodiment of the present application.
  • the part of the skirt 162 where the reinforcing member 160 is easily in contact with the contact area 170 is partially lifted to form a stamping area. Since the skirt edge of the reinforcing part 160 passing through the contact area 170 is located at the upper and lower corners of the left side (taking the reinforcing part in a raised state as an example), therefore, the upper and lower corners of the left side of the reinforcing part 160 can be adjusted respectively.
  • the skirt 162 at the corner is partially stamped, so that the skirt 162 at the two positions is partially raised to form a first stamping area 166 and a second stamping area 167 .
  • the first stamping area 166 and the second stamping area 167 protrude a certain height relative to the skirt 162 that has not been partially stamped. Protrusion in the same direction.
  • the height of the skirt 162 of the reinforcing member 160 is equal to that of the stamped area and that of the skirt 162 that has not been partially stamped.
  • the sum of the heights of the skirts 162 makes the height of the punched area greater than that of the skirts 162 without partial punching, so as to form a reinforcing part 160 with unequal skirts.
  • the first stamping area 166 and the second stamping area 167 sink to a certain height relative to the skirt 162 that has not been partially stamped, and the sinking direction is the bottom edge 161 The direction of sinking relative to the skirt 162 is the same.
  • Fig. 15A is a perspective view of the structure of reinforcing parts with unequal skirts in the contact area in the embodiment of the present application
  • Fig. 15B is the structural effect of setting reinforcing parts with unequal skirts in the contact area in the embodiment of the present application picture.
  • the cable 140 and the screen outlet 120 form a contact area 170 (white dotted line frame), when the reinforcing member 160 is arranged at the opening 132 of the middle frame to accommodate the raised screen chip 110 by the reinforcing member 160 , the upper and lower corners on the left side of the reinforcing member 160 will pass through the contact area 170 .
  • the reinforcement member 160 is in a convex state.
  • the skirt 162 at the upper and lower corners on the left side of the contact area will be partially punched, that is, the formed first punched area 166 and the second The stamped area 167 is formed to accommodate the height of the contact area 170 .
  • the height of one end of the contact area 170 is accommodated by the first stamping area 166 of the reinforcing member 160
  • the height of the other end of the contact area 170 is accommodated by the second stamping area 167 of the reinforcing member 160 .
  • the contact between the skirt 162 and the large surface of the screen outlet 120 and the cable 140 can be connected by dispensing (or spot welding or back glue), and due to the unequal height of the skirt
  • the two stamping areas of the strong part 160 protrude relative to the remaining skirt 162, there is a spacing distance between the first stamping area 166 and the second stamping area 167 and the contact area 170, and the first stamping area 166 and the second stamping area 167 are in contact with the contact area 170.
  • the vertical distance between the bottom edge 161 is smaller than the vertical distance between the skirt edge 162 and the bottom edge 161 , that is, the two stamping areas are suspended, so as to accommodate the height formed by the contact area 170 by the two suspended stamping areas. Therefore, when the two stamping areas pass through the contact area 170 , no more glue is dispensed.
  • the reinforcing part 160 is stamped on part of the skirt 162, and the stamped area (166, 167) is lifted up toward the protruding direction of the bottom edge 161 as a whole, so that the stamped area forms a concave shape relative to the rest of the skirt 162. groove. Since the height of the contact zone 170 is about 0.1-0.15 mm, the raised height of the two stamping zones (166, 167) is set to be 0.1-0.15 mm, so that the stamping zone (166, 167) is relative to the rest of the skirt 162 The depth of the groove is about 0.1-0.15mm.
  • the thickness of the dispensing is less than or equal to that of the stamping area (166, 167) relative to the rest of the skirt.
  • the edge 162 forms the depth of the groove. Therefore, glue dispensing may not be performed at the position where the two stamping areas (166, 167) pass the contact area 170, which saves the dispensing space at this position and avoids increasing the height of this position. Glue is only dispensed at the remaining skirts 162 to secure the reinforcing component 160 .
  • the two stamping areas (166, 167) are suspended relative to the contact area 170, and the height of the contact area 170 is accommodated by the grooves at the two stamping areas (166, 167), so as to avoid increasing the height of the contact area 170 when directly fixing the reinforcing member 160.
  • the overall height of the reinforcing component 160 further affects the overall thickness of the electronic device.
  • the reinforcing member 160 will not be in contact with the contact area 170, therefore, the reinforcing member 160 will not have a thickness higher than one layer of the wiring 140 in this part. , therefore, it will not affect the increase of the overall thickness of the electronic equipment.
  • the determination of the starting point and the ending point of the first punching area 166 and the second punching area 167 in the reinforcing member 160 is based on ensuring that the reinforcing member 160 does not come into contact with the contact area 170 .
  • the distance between the opening start point (end point) and the contact area 170 can be set to be about 1 mm.
  • a reinforcing member 160 is provided at the position of the opening 132 of the middle frame to improve the reliability of the middle frame 131 and prevent the screen chip 110 from continuously sinking.
  • the structural form of the reinforcing component 160 can be a reinforcing component with a notched skirt or a reinforcing component with unequal skirts.
  • the first notch 164 and the second notch 165 formed by the reinforcing member 160 with a notched skirt accommodate the height of the contact area 170 formed by the extended end of the cable 140 and the large surface of the screen outlet cable 120, or, the height of the contact area 170 formed by the skirt
  • the first stamping area 166 and the second stamping area 167 formed by the reinforcing member 160 with sides of unequal height accommodate the height of the contact area 170 formed by the extended end of the cable 140 and the large surface of the screen outlet line 120 .
  • the above two methods can avoid the increase of the local height when the skirt 162 passes through the contact area 170 , thereby avoiding the increase of the overall thickness of the electronic device.
  • the structural form of the reinforcing member 160 is not limited to the method provided in the above-mentioned embodiments, and the reinforcing member 160 may also adopt other structural forms on the premise of avoiding the local height increase caused by the reinforcing member 160 passing through the contact area 170 , not specifically limited here.
  • one screen chip can be provided in the electronic device provided in the foregoing embodiments, and two screen chips can also be provided in the electronic device in order to improve the efficiency of turning on the brightness of the screen.
  • the two screen chips can be arranged in sequence along the length direction of the device.
  • Fig. 16 is a front perspective view of an electronic device provided with two screen chips in an embodiment of the present application.
  • two screen chips are set in the electronic device, the first screen chip 110a and the second screen chip 110b are arranged along the length direction of the device in sequence according to the length direction, and are sequentially pasted on the large surface of the screen outlet 120, Both the first screen chip 110a and the second screen chip 110b are located above the battery 150, and the distance between the two screen chips is set on the premise of maximizing the utilization of the internal space of the device. Under the premise of the length of the whole machine, the internal space of the equipment is used to the maximum extent.
  • the large surface of the screen outlet 120 (equivalent to the position of the spacer 121) includes two raised screen chips (110a, 110b). Therefore, considering avoiding the raised structure of the screen chip to reduce the overall size of the electronic device When the machine thickness is lower, two screen chips (110a, 110b) need to be avoided at the same time.
  • Information about the shape, size, structure, position and other information of the two screen chips (110a, 110b) can refer to the relevant content of setting up one screen chip provided in the foregoing embodiment, and will not be repeated here.
  • the electronic device provided by the embodiment of the present application improves the internal components of the electronic device, that is, the bottom of the battery compartment 130 (middle frame 131) and the two screen chips (110a, 110b) opposite positions are opened, and two middle frame openings (132a, 132b) are formed on the middle frame 131, and the raised screen chips (110a, 110b) are avoided through the middle frame openings (132a, 132b) , will not increase the thickness of the remaining positions of the middle frame 131, thereby achieving the effect of reducing the thickness of the whole machine.
  • Fig. 17 is a perspective view of the back of the whole machine in which the battery compartment is provided with two openings in the middle frame in the embodiment of the present application.
  • the bottom of the battery compartment 130 (middle frame 131 ) defines a first middle frame opening 132a and a second middle frame opening 132b along the length direction of the electronic device.
  • the setting positions of the first middle frame opening 132a and the second middle frame opening 132b are opposite to the positions of the first screen chip 110a and the second screen chip 110b bonded on the large surface, that is, the first middle frame opening 132a and the second screen chip 110b are opposite to each other.
  • the first screen chip 110a is opposite to each other, and the second middle frame opening 132b is opposite to the second screen chip 110b.
  • the distance between the two middle frame openings (132a, 132b) is adapted to the distance between the two screen chips (110a, 110b).
  • the shape, size, structure and other information of the two middle frame openings can refer to the relevant content of the battery compartment provided with one middle frame opening 132 provided in the foregoing embodiment, and will not be repeated here.
  • Fig. 18 is a perspective view of the back of the whole machine when two screen chips are accommodated by two middle frame openings in the embodiment of the present application.
  • the first screen chip 110a is accommodated by the first middle frame opening 132a, so that the first screen chip 110a It can be completely embedded in the opening 132a of the first middle frame.
  • the second screen chip 110b is accommodated by the second middle frame opening 132b, so that the second screen chip 110b can be completely embedded in the second middle frame opening 132b.
  • the extended end of the cable 140 is attached to the large surface of the screen outlet line 120 , the extended end of the cable 140 is also higher than the large surface to form a raised structure.
  • the thickness of the extension end of the cable 140 is smaller than the thickness of the screen chip 110, so as to avoid a larger avoidance space at the middle frame 131, thereby avoiding an increase in the overall thickness.
  • the first middle frame opening 132a needs to avoid the first screen chip 110a
  • the second middle frame opening 132b needs to avoid the extending end of the flat cable 140 while avoiding the second screen chip 110b.
  • the size of the two middle frame openings ( 132 a , 132 b ) is larger than the sum of the corresponding screen chip ( 110 a , 110 b ) and the extension end of the cable 140 .
  • Two screen chips (110a, 110b) are provided inside the electronic device provided by the embodiment of the present application, and both screen chips (110a, 110b) form a convex structure relative to the large surface of the screen outlet 120 .
  • the middle frame 131 needs to avoid the two screen chips (110a, 110b).
  • the avoidance method of the embodiment of the present application adopts setting two middle frame openings (132a, 132b) at the positions of the middle frame 131 relative to the two screen chips (110a, 110b), and the first middle frame opening 132a accommodates the first screen
  • the chip 110a accommodates the second screen chip 110b through the opening 132b of the second middle frame, so as to prevent the two screen chips (110a, 110b) from moving down and contacting the middle frame 131 due to the user pressing the display screen, causing damage;
  • the method of opening the frame avoids the screen chip, and there is no need to increase the wall thickness of the middle frame 131, only the minimum wall thickness that meets the reliability requirements is sufficient. It can be seen that this avoidance method can make full use of the internal space of the electronic device. While realizing the avoidance of the two screen chips (110a, 110b), the wall thickness of the middle frame 131 is reduced, which can further reduce the thickness of the electronic device.
  • the relative position of the bottom (middle frame 131) of the battery compartment 130 is hollowed out to set two middle frame openings (132a, 132b) ).
  • two middle frame openings (132a, 132b) are set on the middle frame 131, which will also lead to the reliability of the middle frame 131. sex decline. Therefore, from the perspective of avoiding large deformation and damage of the two screen chips (110a, 110b) and protecting the battery 150, corresponding reinforcement components (160a, 160a, 160b).
  • the two reinforcing parts (160a, 160b) play the role of supporting and limiting, which can not only improve the reliability of the middle frame 131, but also avoid the large deformation of the two screen chips (110a, 110b) due to the force.
  • the continuous sinking of the two screen chips (110a, 110b) is prevented by the two reinforcing parts (160a, 160b), so as to prevent the two screen chips (110a, 110b) from contacting the battery 150 and causing damage, and to protect the battery 150 from being damaged by the two screen chips (110a, 110b).
  • Each screen chip (110a, 110b) is punctured and damaged to avoid the risk.
  • Fig. 19 is a perspective view of the back of the whole machine in which two reinforcing components are arranged at the openings of the two middle frames in the embodiment of the present application.
  • a first reinforcement member 160a is provided at the first middle frame opening 132a
  • a second reinforcement member 160a is provided at the second middle frame opening 132b.
  • Reinforcing member 160b is provided.
  • the two reinforcing parts (160a, 160b) are identical in structure, including a bottom edge, a skirt edge and a middle edge.
  • the first dotted frame in FIG. 19 is the border of the skirt of the first reinforcing part 160a
  • the second dashed frame is the border of the skirt of the second reinforcing part 160b.
  • the two reinforcement components ( 160a, 160b ) are set in a raised state
  • the bottom of the two reinforcement components ( 160a , 160b ) are corresponding screen chips ( 110a , 110b ).
  • the skirts of the two reinforcing components (160a, 160b) are located between the corresponding screen chips and the middle frame 131, and the bottom structures of the two reinforcing components (160a, 160b) pass through the corresponding openings of the middle frame.
  • the skirt of the first reinforcement part 160a is located between the first screen chip 110a and the middle frame 131, and is used to prevent the first screen chip 110a from contacting the battery 150 when it sinks under force.
  • the bottom edge structure of the first reinforcement part 160a passes through the opening 132a of the first middle frame to realize the effect of accommodating the first screen chip 110a by the protruding part of the first reinforcement part 160a; the skirt of the second reinforcement part 160b The edge is located between the second screen chip 110b and the middle frame 131, and is used to prevent the second screen chip 110b from contacting the battery 150 when it sinks under force.
  • the bottom structure of the second reinforcement member 160b passes through the second middle frame opening 132b to achieve the effect of accommodating the second screen chip 110b by the protruding part of the second reinforcement member 160b.
  • the two screen chips (110a, 110b) and the battery 150 are separated by the bottom edges of the two reinforcing components (160a, 160b). If the user presses the display screen, the two screen chips (110a, 110b) will deform , then the bottom edges of the two reinforcing components (160a, 160b) can prevent the corresponding screen chip (110a, 110b) from continuously sinking, and avoid contact with the battery 150. Even if the two screen chips (110a, 110b) are damaged due to contact with the bottom edge of the corresponding reinforcing part, the two reinforcing parts (160a, 160b) can receive the fragments to prevent the fragments from contacting the battery 150, so as to protect the battery 150.
  • two middle frame openings are set at the position of the middle frame 131 relative to the two screen chips (110a, 110b).
  • the openings (132a, 132b) of the middle frame accommodate the corresponding screen chips (110a, 110b), and the middle frame 131 can adopt the minimum wall thickness.
  • the corresponding reinforcing parts (160a, 160b) are provided at the positions of the two middle frame openings (132a, 132b), and the reinforcing parts (160a, 160b) play the role of supporting and limiting, which can improve the height of the middle frame.
  • the reliability of 131 can also prevent the corresponding screen chips (110a, 110b) from continuously sinking, avoiding damage caused by the contact of the two screen chips (110a, 110b) with the battery 150, protecting the battery 150 and avoiding risks. It can be seen that by setting two middle frame openings (132a, 132b) and setting two reinforcing parts (160a, 160b) in the middle frame 131, the reliability of the middle frame 131 can be improved, and the two protrusions can be avoided.
  • the screen chips (110a, 110b) can further reduce the overall thickness of the electronic device.
  • the structural features such as the size and shape of the only middle frame opening should match the size and shape of the area surrounded by the two screen chips, that is, the size of the middle frame opening 132 is larger than the first The size enclosed by the screen chip 110a and the second screen chip 110b.
  • the electronic device provided by the embodiment of the present application solves the problem of thickening of the whole device due to local protrusions inside the device, while ensuring that the large surface of the middle frame 131 and the screen outlet 120 meets the minimum safety gap
  • the position of the middle frame 131 corresponding to the screen chip 110 is hollowed out to form a middle frame opening 132, and the space of the middle frame 131 wall thickness is used to accommodate the screen chip 110.
  • the method of avoiding the screen chip 110 only needs to set the minimum wall thickness that meets the reliability requirement.
  • the reinforcement member 160 is provided at the position of the opening 132 of the middle frame, and the reinforcement member 160 acts as a support limit, which can not only improve the reliability of the middle frame 131, but also prevent the screen chip 110 from continuously sinking.
  • the skirt 162 of the reinforcement member 160 is accommodated by the draw-in groove 133 on the middle frame 131, so as to prevent the top of the skirt 162 from exposing the top of the middle frame 131, so as to ensure that there is a reserve space between the middle frame 131 and the large surface of the screen outlet 120.
  • the smallest safety gap can reduce the overall thickness of electronic equipment.
  • the structural form of the reinforcing part 160 can be a reinforcing part with a notched skirt or a reinforcing part with unequal skirts to avoid the height of the contact area 170 formed by the cable 140 and the screen outlet 120, thereby avoiding affecting the electronic
  • the overall thickness of the equipment is increased. It can be seen that the electronic device can make full use of the internal space of the whole machine. While avoiding the screen chip 110, the wall thickness of the middle frame 131 and the height formed by avoiding the contact of adjacent devices can be reduced, which can further reduce the thickness of the whole machine of the electronic device.

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Abstract

本申请公开了一种电子设备,中框上设有中框开孔。屏幕芯片和屏幕出线位于中框的靠近显示屏的一侧,电池位于中框的远离显示屏的一侧,屏幕芯片贴合在屏幕出线的大面上。为避免中框与屏幕芯片接触,由中框开孔容纳屏幕芯片,屏幕芯片的相对于屏幕出线的大面的凸出高度小于中框开孔的厚度,屏幕芯片与电池之间的间隔距离大于屏幕芯片的避让距离。可见,该电子设备通过中框开孔避让屏幕芯片,可避免屏幕芯片因用户按压显示屏而向下移动与中框接触,造成破损;同时,中框只需设置满足可靠性要求的最小壁厚即可,充分利用电子设备的整机内部空间,在实现屏幕芯片避让的同时,减小中框的壁厚,可进一步降低电子设备的整机厚度。

Description

一种电子设备
本申请要求于2021年8月2日提交到国家知识产权局、申请号为202110878914.8、发明名称为“一种电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端设备领域,尤其涉及一种电子设备。
背景技术
随着人们生活水平的不断提高,手机等电子设备被广泛应用。电子设备在结构上可以包括壳体,以及设置在壳体上的屏幕,设置在壳体内的中框、屏幕芯片、屏幕出线和电池,中框与屏幕平行设置,中框的远离屏幕的一侧设置电池,中框的靠近屏幕的一侧设置屏幕芯片和屏幕出线。
为实现电子设备的大屏显示效果,屏幕出线端通常位于电子设备的长度方向,屏幕芯片和屏幕出线正好位于电池上方,电池与屏幕芯片和屏幕出线之间通过壳体的中框隔开。而屏幕芯片贴合在屏幕出线上,这就使得屏幕芯片相对于屏幕出线形成凸起结构;而为保证电子设备内部各器件的可靠性,需要屏幕芯片与中框的间隙要大于屏幕出线与中框的间隙,这就使得局部突起的屏幕芯片将导致电子设备整机厚度加厚。
发明内容
本申请提供了一种电子设备,以解决因为局部突起导致整机厚度加厚的问题。
第一方面,本申请提供了一种电子设备,包括:壳体,所述壳体上设置有显示屏,所述壳体与所述显示屏形成腔体,所述腔体内设有中框、屏幕芯片、屏幕出线和电池;
所述中框上设有中框开孔,所述中框开孔的厚度等于所述中框的厚度;
所述电池设置在所述中框的远离所述显示屏的一侧;
所述屏幕出线设置在所述中框的靠近所述显示屏的一侧,所述屏幕出线与所述显示屏的一端连接,所述屏幕出线的大面位于所述显示屏和所述中框之间;
所述屏幕芯片设置在所述屏幕出线的大面上,且位于所述中框与所述屏幕出线的大面之间;所述屏幕芯片相对于所述屏幕出线的大面形成的凸起结构位于所述中框开孔内,且凸起结构的凸出高度小于所述中框开孔的厚度。
第二方面,本申请提供了一种电子设备,包括:壳体,所述壳体上设置有显示屏,所述壳体与所述显示屏形成腔体,所述腔体内设有中框、屏幕芯片、屏幕出线和电池;
所述中框上设有凹槽,所述凹槽的深度小于所述中框的厚度;
所述电池设置在所述中框的远离所述显示屏的一侧;
所述屏幕出线设置在所述中框的靠近所述显示屏的一侧,所述屏幕出线与所述显示屏的一端连接,所述屏幕出线的大面位于所述显示屏和所述中框之间;
所述屏幕芯片设置在所述屏幕出线的大面上,且位于所述中框与所述屏幕出线的大面之间;所述屏幕芯片相对于所述屏幕出线的大面形成的凸起结构位于所述凹槽内。
由以上技术方案可知,本申请实施例提供一种电子设备,在设备内部,中框上设有中框 开孔。屏幕芯片和屏幕出线位于中框的靠近显示屏的一侧,电池位于中框的远离显示屏的一侧,屏幕芯片贴合在屏幕出线的大面上。为避免中框与屏幕芯片接触,由中框开孔容纳屏幕芯片,屏幕芯片的相对于屏幕出线的大面的凸出高度小于中框开孔的厚度,屏幕芯片与电池之间的间隔距离大于屏幕芯片的避让距离。可见,该电子设备通过中框开孔避让屏幕芯片,可避免屏幕芯片因用户按压显示屏而向下移动与中框接触,造成破损;同时,以中框开孔的方式避让屏幕芯片,中框只需设置满足可靠性要求的最小壁厚即可。该避让方式可充分利用电子设备的整机内部空间,在实现屏幕芯片避让的同时,减小中框的壁厚,可进一步降低电子设备的整机厚度。
附图说明
为了更清楚地说明本申请的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1A是本申请实施例中电子设备的整机正面结构图;
图1B是本申请实施例中电子设备的整机背面结构图;
图2A是本申请实施例中电子设备的屏幕背视图;
图2B是本申请实施例中电子设备的背面透视图;
图2C是本申请实施例中电子设备的整机透视图;
图3是本申请实施例中图2C的A-A截面的局部剖视图;
图4是本申请实施例中电池仓设置中框开孔的A-A截面的局部剖视图;
图5A是本申请实施例中电池仓设置中框开孔的整机背面透视图;
图5B是本申请实施例中由中框开孔容纳屏幕芯片时的整机背面透视图;
图6A是本申请实施例中在中框开孔处设置补强部件的结构示意图;
图6B是本申请实施例中补强部件的剖视图;
图7是本申请实施例中在中框开孔处设置补强部件的整机背面透视图;
图8是本申请实施例中在中框开设卡槽的局部放大图;
图9是本申请实施例中电子设备内设置补强部件的整机背面透视图;
图10是本申请实施例中图9中B-B截面的局部剖视图;
图11A是本申请实施例中具有缺口裙边的补强部件从底边凸起侧观察的结构示意图;
图11B是本申请实施例中具有缺口裙边的补强部件从底边凹陷侧观察的结构示意图;
图12A是本申请实施例中在接触区设置具有缺口裙边的补强部件的结构透视图;
图12B是本申请实施例中在接触区设置具有缺口裙边的补强部件的结构效果图;
图13A是本申请实施例中裙边不等高的补强部件从底边凸出侧观察的结构示意图;
图13B是本申请实施例中裙边不等高的补强部件从底边凹陷侧观察的结构示意图;
图14是本申请实施例中图13A所示的裙边不等高的补强部件的侧视图;
图15A是本申请实施例中在接触区设置裙边不等高的补强部件的结构透视图;
图15B是本申请实施例中在接触区设置裙边不等高的补强部件的结构效果图;
图16是本申请实施例中电子设备设置两个屏幕芯片的正面透视图;
图17是本申请实施例中电池仓设置两个中框开孔的整机背面透视图;
图18是本申请实施例中由两个中框开孔容纳两个屏幕芯片时的整机背面透视图;
图19是本申请实施例中在两个中框开孔处设置两个补强部件的整机背面透视图。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚地描述。显然,所描述的实施例是本申请的一部分实施例,而不是全部实施例。基于本申请的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所得到的其他实施例,都属于本申请的保护范围。
以下,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。
此外,本申请中,“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的,应当理解到,这些方向性术语是相对的概念,它们用于相对于的描述和澄清,其可以根据附图中部件所放置的方位的变化而相应地发生变化。
图1A是本申请实施例中电子设备的整机正面结构图;图1B是本申请实施例中电子设备的整机背面结构图。参见图1A和图1B,本申请实施例提供的电子设备100包括壳体,以及,设置在壳体上的显示区103,显示区103设置显示屏,显示屏可为可弯折屏幕或柔性屏幕。壳体包括第一框体101和第二框体102,两个框体之间设有转轴,相邻两个框体的靠近转轴的端部可以绕着位于两个框体之间的转轴进行旋转,从而令两个框体的远离转轴的一端相对靠近或者相对远离,电子设备100即可相应呈现合上或者展开等不同状态。
显示区103上的显示屏覆盖在两个框体表面,并可以随着两个框体之间的位置变化而相应呈现折叠或者展开等状态。在第一框体101和第二框体102展开时,两者会相互并列且共面设置,此时,覆盖在两个框体表面的显示屏(显示区103)展开,形成较大的显示表面,该显示表面可以作为单独的显示屏幕进行显示。其中,图1B所示状态为图1A的结构沿水平方向上下翻转后所形成的状态。
需要说明的是,电子设备100的框体的数量可以为两个或两个以上,且框体的数量为两个以上时,各相邻框体可以绕着相互平行的转轴转动,从而形成多层折叠结构,或者展开得到更大的显示面积。本申请实施例中,主要以电子设备100中具有两个框体为例进行说明。
图2A是本申请实施例中电子设备的屏幕背视图;图2B是本申请实施例中电子设备的背面透视图;图2C是本申请实施例中电子设备的整机透视图。参见图2A、图2B和图2C,电子设备100包括有电子设备内部的各部件,例如是处理器、存储器、摄像头组件、屏幕芯片110、屏幕出线120、排线140和电池150等,示例性的,可以将处理器、存储器以及摄像头组件等部件设置在第一框体101内部(如图2B所示内容中第一框体101对应的左侧未标附图标记的所示位置),而第二框体102可以用于承载屏幕芯片110、屏幕出线120、排线140和电池150等部件。
屏幕芯片110,即屏幕IC(integrated circuit,IC),是指用于驱动点亮屏幕的芯片。屏幕芯片的材质易碎,一般为玻璃,被碰撞后易碎,因此,在电子设备内部设置屏幕芯片时,要使屏幕芯片与内部其他部件预留一定的避让空间。
在一些实施例中,电子设备内设置一个屏幕芯片,可实现屏幕的点亮。但是,为了提高点亮屏幕亮度的效率,还可在电子设备内设置两个屏幕芯片。示例性的,两个屏幕芯片可沿设备的长度方向顺次排列(如对于具有折叠屏的电子设备,可以是屏幕折叠时的长度方向)。
屏幕出线120,即屏幕COP(chip on pi,COP),是一种基于柔性屏幕封装工艺形成的电路板。
排线140,也叫软性电路板(flexible printed circuit,FPC),用于活动部件及活动区域内的数据传输。在电子设备领域,FPC为手机主板连接显示屏的数据线。排线可移动、弯曲、扭转而不会损坏导线,可以遵从不同形状和特殊的封装尺寸。
图3是本申请实施例中图2C的A-A截面的局部剖视图。参见图3,显示区103上的显示屏覆盖在第一框体101和第二框体102上,由显示区103至设备背面的方向,显示屏的下方贴合垫片121,显示屏的一端下方具有屏幕出线120,屏幕出线120与显示屏的一端连接。屏幕出线120沿显示屏到设备背面的方向弯折,弯折后屏幕出线120的大面(图中未示出)贴合在垫片121的下面,即垫片121的靠近设备背面的那一面上均布屏幕出线120的大面,垫片121用于对大面进行支撑。屏幕出线120的大面的下方贴合屏幕芯片110,屏幕芯片110位于中框131与屏幕出线120的大面之间。图中未示出屏幕出线120的大面。从显示区103至设备背面的方向,电子设备内部的结构顺序为显示屏、垫片121、屏幕出线120的大面、屏幕芯片110、中框131。
排线140位于显示屏和中框131之间,排线140贴合在显示屏的下方,且排线140的一端延伸至屏幕出线120的大面,并与大面贴合,相当于排线140的一端延伸至垫片121处,排线140的延伸端与屏幕芯片110贴合在大面的同一侧。排线140的一端(即延伸端)与屏幕出线120连接,排线140的另一端与处理器连接。排线140的延伸端和屏幕芯片110虽然都贴合在大面上,但排线140的延伸端和屏幕芯片110并未产生接触,二者存在一定间隙,且排线140的延伸端的厚度要小于或等于屏幕芯片110的厚度。如果排线140的延伸端的厚度大于屏幕芯片110的厚度,则会造成更高的避让空间,造成整体厚度增加。
电池150设置在屏幕芯片110的远离屏幕的一侧,即电池150设置在屏幕芯片110的下方。为对电池150进行固定,由电子设备的壳体形成电池仓130,示例性的,可在第二框体102内形成电池仓130,电池150固定在电池仓130内。电池仓130开口方向朝向背离屏幕的一侧,使得电池150与屏幕芯片110通过电池仓130的底部分隔开。
将电池仓130的底部作为电子设备的中框131,中框131与显示屏可平行设置,中框131的上方(靠近显示屏的一侧)设有屏幕芯片110、屏幕出线120和排线140,中框131的下方(远离显示屏的一侧)设有电池150。中框131的作用是既起到分隔电子设备内部的各部件的作用,又可提高电子设备的壳体稳定性。若用户在使用电子设备时,手指触摸显示屏并按压时,将会联动屏幕芯片110、屏幕出线120和排线140产生向下移动的趋势,而该三个部件均位于电池150的上方,如果三个部件向下移动会与中框131接触,进而带动中框131向下移动与电池150接触,造成电池150磨损。因此,在电池150和三个部件之间通过中框131分隔开,可阻止三个部件持续向下移动,避免与电池150接触,起到保护电池150的作用。
在电子设备的内部布置各个器件时,为保证各个器件的安全,除实现数据传输的必 要接触外,其余没有数据传输的各器件之间并非直接进行接触,而是要预留一定的安全间隙。例如,需要保证中框131与屏幕出线120的大面(相当于垫片121的位置)之间要预留安全间隙,中框131与排线140之间要预留安全间隙,以及,中框131与屏幕芯片110之间要预留安全间隙。在一些实施例中,中框131分别与屏幕出线120的大面或排线140之间要预留的安全间隙可为0.1mm左右。
屏幕芯片110的厚度约为0.25-0.3mm,屏幕芯片110相对于屏幕出线120的大面(相当于垫片121的位置)形成凸起结构,即凸起结构的厚度约为0.25-0.3mm。在用户按压显示屏时,会带动屏幕芯片110向下移动而触碰到中框131,而屏幕芯片110为玻璃材质,被碰撞后易碎,造成屏幕芯片110磨损。因此,为保护屏幕芯片110不被磨损,需要屏幕芯片110与中框之间预留一定的避让空间。在一些实施例中,在保证避让效果的条件下,该避让空间至少要预留0.25mm左右的距离,即屏幕芯片110的避让距离至少为0.25mm左右。
可见,为避让凸起的屏幕芯片110,中框131(即电池仓130的底部)需整体向设备背面的方向下移,这将导致电子设备的整机厚度增加。为保证电子设备的整机厚度和对屏幕芯片110的避让,在保证中框131与屏幕出线120的间隙要求的同时,将中框131的与屏幕芯片110的相对位置进行局部下沉,使得中框131呈现局部下沉的凹槽,该凹槽用于容纳屏幕芯片110,凹槽的深度小于中框131的厚度。在进行避让时,屏幕芯片110相对于屏幕出线的大面形成的凸起结构位于凹槽内,屏幕芯片110与凹槽底部的距离大于屏幕芯片110的避让距离。
由于屏幕芯片110的位置与排线140的位置相近,且均贴合在大面上,因此,该中框131上形成的凹槽也可同时实现对排线140的避让。由于中框131上的凹槽可同时避让屏幕芯片110与排线140,但屏幕芯片110与排线140分别相对于屏幕出线120形成的凸起结构的凸出高度并不相同,因此,该凹槽的结构可为不规则形式,可实现对屏幕芯片110与排线140的避让即可。
基于电子设备的可靠性要求,需要屏幕芯片110与中框131的间隙要大于屏幕出线120的大面(相当于垫片121的位置)与中框131的间隙,使得中框131中设置的凹槽的深度要加大。基于图3所示避让方案,为避让屏幕芯片110,在中框131与屏幕芯片110对应的局部位置设置凹槽,则中框131在设置凹槽的位置产生最小厚度,该最小厚度小于中框131未设置凹槽位置的整体厚度。而即使中框131中设置凹槽,还需要保证中框131的原本可靠性,因此,需要整体加厚中框131的厚度,以保证中框131的局部设置凹槽后的剩余厚度仍能够满足可靠性要求。
示例性的,上述避让方案中,中框131的整体厚度H1需高于0.65mm,中框131中通过局部下沉的方式形成凹槽的深度至少要大于0.25mm,而中框131中设置凹槽位置的最小厚度要至少为0.4mm。
为了进一步降低电子设备的整机厚度,本申请另一个实施例提供的电子设备,对电子设备的内部部件进行改进,即如图4所示,在电池仓130的底部(即中框131)与屏幕芯片110相对的位置开孔,在中框131上形成中框开孔132,中框开孔为132为贯通孔,中框开孔132的深度等于中框131的厚度。通过中框开孔132避让凸起的屏幕芯片110,不会造成中框131的其余位置的厚度增加,进而达到降低整机厚度的效果。其中,在靠近屏幕侧边,屏幕出线120的大面与中框131之间的黑色结构(图中未标记)为背胶, 背胶用于将屏幕出线和中框131粘在一起,用于缓冲和防水。
在一些实施例中,电子设备可为折叠屏设备,也可为平板电脑等。只要是设备中的屏幕芯片下方设有电池或其他原因导致屏幕芯片成为整机厚度瓶颈的情况,均可以适用本申请实施例提出的方案。
图4是本申请实施例中电池仓设置中框开孔的A-A截面的局部剖视图。参见图4,在电子设备的内部,为使中框131能够避让凸起的屏幕芯片110,将中框131的与屏幕芯片110对应的位置挖空,形成中框开孔132,此时,中框131相对于屏幕芯片110的位置没有厚度。将中框131与屏幕出线120的大面之间按照最小安全间隙进行相对位置设置,在中框131与大面之间的距离满足预留最小安全间隙的要求下,使得凸起的屏幕芯片110嵌入中框开孔132中,此时,屏幕芯片110整体均在中框开孔132中,利用中框开孔132的空间容纳屏幕芯片110,屏幕芯片110相对于屏幕出线的大面形成的凸起结构位于中框开孔132内,且凸起结构的凸出高度小于中框开孔132的厚度,屏幕芯片110与电池150之间的间隔距离大于屏幕芯片110的避让距离。
在这种情况下,即使用户按压显示屏带动屏幕芯片110向下移动,也不会与中框131产生接触,避免屏幕芯片110被磨损。同时,在电池仓130的底部与屏幕芯片110重合的位置,将中框131的壁厚切除,无需通过图3所示方式避让屏幕芯片110,进一步减少了中框的厚度,充分利用整机内部空间的要求。
本申请实施例中,为降低整机厚度,电子设备的中框131在保证自身可靠性的前提下整体厚度要尽可能薄,例如,中框131的整体厚度至少要设置0.4mm。由于本实施例提供的电子设备,已通过在中框131上设置中框开孔132的方式避让凸起的屏幕芯片110,不再需要利用凹槽容纳屏幕芯片110,因此,中框131不再需要设置较厚的厚度,即将中框131与屏幕相邻处的厚度或者中框131与电池150接触的位置的厚度(如电池仓130的底部)设置为能够保证可靠性的最小壁厚即可,如中框131与屏幕相邻处的厚度可以设置为0.4mm,或中框131与电池接触的位置的厚度可以设置为0.4mm。
由于图3所示避让方案中,中框131的整体厚度H1大于0.65mm;而图4所示本申请实施例提供的方案中,中框131的整体厚度H2可设为最小壁厚0.4mm。因此,对比可知,本申请实施例采用的图4中所示的中框131的厚度要小于图3中所示的中框131的厚度。因此,通过减少中框131的厚度,可进一步降低电子设备的整机厚度。
在一些实施例中,中框开孔132的尺寸要适应屏幕芯片110的尺寸。从可靠性角度,中框开孔132的尺寸不宜过大;从避让屏幕芯片110的角度,中框开孔132的尺寸不宜过小。
图5A是本申请实施例中电池仓设置中框开孔的整机背面透视图;图5B是本申请实施例中由中框开孔容纳屏幕芯片时的整机背面透视图。参见图5A,由于屏幕芯片110为沿设备长度方向的长条形结构,因此,为便于中框131上设置的中框开孔132能够容纳屏幕芯片110,中框开孔132的结构也可为沿设备长度方向的长条形结构,如矩形结构。而在其他实施例中,中框开孔132也可为其他形状,如圆角矩形、椭圆形等。
参见图5B,在由中框开孔132容纳屏幕芯片110时,由于中框开孔132和屏幕芯片110相对于中框131的位置相对应,使得屏幕芯片110可嵌入中框开孔132中。
为保证中框开孔132的空间能够容纳屏幕芯片110,以及,不影响自身的可靠性,中框开孔132的尺寸要略大于屏幕芯片110的尺寸。例如,中框开孔132向屏幕芯片110 的四周偏移一定距离,该偏移距离可设定为1mm左右,示例性的,该偏移距离大于1mm。从整体偏移尺寸角度,中框开孔132的长度要大于屏幕芯片110的长度约2mm,中框开孔132的宽度要大于屏幕芯片110的宽度约2mm。
再次参见图4,由于排线140的延伸端与屏幕出线120的大面(相当于垫片121的位置)贴合,使得排线140的延伸端也会高于大面形成凸起结构。排线140的延伸端的厚度小于或等于屏幕芯片110的厚度(即相对于屏幕出线的大面的突出高度),避免中框131处要产生更大的避让空间,进而可避免造成整体厚度增加。
此时,需要中框开孔132在避让屏幕芯片110的同时,还需避让排线140的延伸端。因此,排线140的延伸端位于中框开孔132内,中框开孔132的尺寸要大于屏幕芯片110和排线140的延伸端所围成的总和尺寸,即中框开孔132的尺寸要大于屏幕芯片110和排线的延伸端与屏幕出线120的大面重叠部分的外围尺寸。从整机宽度方向上,中框开孔132的一侧起始位置(a)可与排线140产生延伸端的起始位置相对,中框开孔132的另一侧终止位置(b)可为与中框开孔132在偏移屏幕芯片110时所需的最小距离所对应的位置。
本申请实施例提供的电子设备,由于屏幕芯片110与屏幕出线120的相对位置关系及结构特点,使得屏幕芯片110相对于屏幕出线120的大面形成凸起结构。在保证中框131与大面满足最小安全间隙的情况下,为避免中框131与屏幕芯片110接触,需要中框131对屏幕芯片110进行避让。本申请实施例的避让方式采用在中框131相对于屏幕芯片110的位置设置中框开孔132,由中框开孔132容纳屏幕芯片110,避免屏幕芯片110因用户按压显示屏而向下移动与中框131接触,造成破损;同时,以中框开孔132的方式避让屏幕芯片110,只需设置满足可靠性要求的最小壁厚即可。可见,该避让方式可充分利用电子设备的整机内部空间,在实现屏幕芯片110避让的同时,减小中框131的壁厚,可进一步降低电子设备的整机厚度。
在一些实施例中,由于为实现屏幕芯片110的避让,电池仓130的底部(中框131)的相对位置采用挖空的方式设置中框开孔132,此时,屏幕芯片110与电池150之间无中框131进行分隔。在这种情况下,若用户用力按压显示屏,则将联动屏幕芯片110受力下沉,由于屏幕芯片110的位置不再有中框110进行阻挡,有可能会出现屏幕芯片110过度下沉而与电池150接触的情况。
屏幕芯片110与电池150接触,会造成屏幕芯片110出现破损,同时,屏幕芯片110如果破裂,产生的碎屑将会刺破电池150,影响电池150的使用。另外,中框131上开设中框开孔132,也可能导致中框131的可靠性下降。因此,从避免屏幕芯片110产生较大形变受损以及保护电池150的角度,可在中框开孔132的位置设置补强部件160,补强部件160位于屏幕芯片110和电池150之间,补强部件160固定在中框开孔周围。通过补强部件160起到支撑限位的作用,既可提高中框131的可靠性,也可避免屏幕芯片110因受力产生较大形变。由补强部件160阻挡屏幕芯片110持续下沉,避免屏幕芯片110与电池150接触而造成破损,保护电池150不会被屏幕芯片110扎破损坏而避免风险。
图6A是本申请实施例中在中框开孔处设置补强部件的结构示意图;图6B是本申请实施例中补强部件的剖视图。参见图6A和图6B,在前述实施例提供的降低电子设备的整机厚度的方案基础上,在中框开孔132处设置补强部件160,补强部件160包括底边161、裙边162和中边163。底边161为实心结构,裙边162和中边163均为中空的环状 结构。示例性的,补强部件160的材质可为钢材质,以保证可靠性。
裙边162通过中边163围绕在底边161的四周,底边161的所在平面和裙边162的所在平面平行但不重合,即二者通过中边163连接后,底边161的所在平面和裙边162的所在平面在平行方向上相距一定距离,使得补强部件160的截面呈凹槽结构,凹槽结构用于容纳屏幕芯片110,凹槽结构的深度大于屏幕芯片110的避让距离。
中边163可以垂直状态分别与底边161和裙边162连接,此时,补强部件160的相邻两条边的所在平面相互垂直,补强部件160所形成凹槽的底部与开口的尺寸相同。中边163还可以倾斜状态分别与底边161和裙边162连接,此时,补强部件160的相邻两条边的所在平面呈非垂直角度,补强部件160所形成凹槽的底部至开口的尺寸逐渐增大,如图6B所示状态。
在安装补强部件160时,补强部件160以底边161在下方、裙边162在上方的凹形状态安装在中框开孔132,使得裙边162固定在中框开孔132周围的中框131上,裙边162位于中框131与屏幕出线120的大面之间。为在提高中框131可靠性的同时能够避让屏幕芯片110,由补强部件160形成的凹槽容纳屏幕芯片110,如图6A所示状态,补强部件160的裙边162高于底边161,底边161靠近电池150的位置,裙边162靠近屏幕出线120的大面的位置(相当于垫片121的位置)。
补强部件160的底边161位于中框开孔132远离屏幕芯片110的一侧,即靠近电池150的一侧,且底边161与屏幕芯片110之间的距离大于屏幕芯片110的避让距离,即补强部件160所形成的凹槽深度大于屏幕芯片110的避让距离。因此,将补强部件160固定在中框131上,既可以提高中框131的可靠性,又可以避让屏幕芯片110。
屏幕芯片110与电池150之间通过补强部件160的底边161进行分隔,若用户按压显示屏使得屏幕芯片110产生较大形变,则由补强部件160的底边161可阻挡屏幕芯片110持续下沉,避免与电池150接触。即使屏幕芯片110与底边161接触导致出现破损,也可以由补强部件160盛接碎片,避免该碎片与电池150接触,以保护电池150。
图7是本申请实施例中在中框开孔处设置补强部件的整机背面透视图。参见图7所示,在电池仓130的底部(中框131)与屏幕芯片110对应的位置开设中框开孔132,并在中框开孔132处设置补强部件160,从背面透视图看,补强部件160的底边161由中框开孔132穿过。
图7中所示内容的左侧结构中的虚线框为补强部件160的边界,即裙边162的边界位置。将补强部件160由电子设备内取出后的完整结构如图7中所示内容的右侧结构所示,补强部件160为中心凸出的圆角矩形结构,该中心凸出位置与屏幕芯片110的凸出结构对应,实现由补强部件160的凸出部位容纳屏幕芯片110的效果。
补强部件160的整体厚度小于中框131的壁厚,即由底边161至裙边162的垂直距离小于中框131的壁厚,相当于中边163的垂直高度小于中框131的壁厚,底边161与电池150之间的距离可大于等于电池150与中框131的靠近电池150一侧之间的距离,使得补强部件160在固定在中框131上时,底边161由中框开孔132处穿过,也不会露出中框131的底部,中框131的底部即为靠近电池150的那一侧。此时,底边161与中框131的底部相距一定距离,也可避免底边161与电池150接触。示例性的,底边161与中框131的底部相距的距离可设定为0.1~0.15mm。
在一些实施例中,裙边162固定在中框131上,且裙边162位于中框131与大面(相 当于垫片121的位置)之间。由于中框131与大面之间预留最小的安全间隙,而补强部件160为保证自身强度,要具有一定厚度,该厚度大于最小安全间隙。因此,为避免在中框131与大面之间固定裙边162时,因需要增大中框131与大面之间的间隙,而导致电子设备的整机厚度加厚,可在中框131贴合裙边162的位置开设卡槽133,卡槽133用于固定裙边162,卡槽133位于中框开孔132周围且靠近大面,卡槽133的深度大于裙边162的厚度。
图8是本申请实施例中在中框开设卡槽的局部放大图。参见图8,在中框131的靠近中框开孔132的位置周围以下沉的方式开设卡槽133,在设置补强部件160时,将裙边162贴合在卡槽133内,以实现补强部件160的固定。示例性的,裙边162与中框131上的卡槽133贴合连接的方式可为点胶、点焊或背胶等方式,以将补强部件160固定在中框开孔132的边缘,以使补强部件160与中框131固定成为一体。
为避免将补强部件160的裙边162贴合在卡槽133上时,裙边162的顶部露出中框131的顶部,中框131的顶部为靠近大面的那一侧,导致中框131与大面之间的安全间隙增大,如果中框131与大面之间的安全间隙增大,将增大电子设备的整机厚度。因此,本申请实施例设定卡槽133的深度H大于补强部件160的厚度与点胶(或点焊或背胶)的厚度之和,使得裙边162的顶部低于中框131的顶部,以保证中框131与大面之间预留最小的安全间隙,进而可以降低电子设备的整机厚度。
示例性的,裙边162与卡槽133的点胶(或点焊或背胶)厚度约为0.1mm,而裙边162的厚度约为0.1mm,那么卡槽133的深度H要大于0.2mm。卡槽133的深度容差可设为0.05mm,那么卡槽133的深度H可为0.25mm。设定卡槽133的深度容差的目的是使中框131上的卡槽133在完全容纳裙边162时,裙边162的高度要低于中框131高度0.05mm。
在中框131上开设的卡槽133的宽度可与裙边162的宽度相适应,卡槽133的宽度能够完全容纳裙边162即可,以保证裙边162的固定稳定性。示例性的,裙边162的宽度约为1~1.5mm,那么卡槽133的宽度也可设定为1~1.5mm。
本申请实施例提供的电子设备,为降低电子设备的整机厚度,在中框131相对于屏幕芯片110的位置设置中框开孔132,由中框开孔132容纳屏幕芯片110,中框131采用最小壁厚即可。但是,这种情况下屏幕芯片110与电池150之间无中框131进行分隔,屏幕芯片110会在受力后过度下沉而与电池150接触。因此,在中框开孔132的位置设置补强部件160,通过补强部件160起到支撑限位的作用,既可提高中框131的可靠性,也可阻挡屏幕芯片110持续下沉,避免屏幕芯片110与电池150接触而造成破损,保护电池150而避免风险。同时,在中框131与补强部件160的接触位置开设卡槽133,利用卡槽133容纳补强部件160的裙边162,避免裙边162的顶部露出中框131的顶部,导致中框131与屏幕出线120的大面(相当于垫片121的位置)之间的安全间隙增大,以保证中框131与屏幕出线120的大面之间预留最小的安全间隙,进而可以降低电子设备的整机厚度。
图9是本申请实施例中电子设备内设置补强部件的整机背面透视图;图10是本申请实施例中图9中B-B截面的局部剖视图。在一些实施例中,参见图9和图10,由于排线140的延伸端与屏幕出线120的大面接触,那么二者接触的位置为接触区170。如果电子设备内的中框开孔132位置设置补强部件160,那么补强部件160与中框131的接触位置 会经过排线140的延伸端与大面形成的接触区170。而在接触区170,排线140会比大面高出一层排线140的高度,那么在补强部件160经过接触区170上方时,也会高出一层排线140的厚度。此时,补强部件160的经过接触区170处的高度要较未经过接触区170的高度高出一层排线140的厚度,此处的高度是指相对于大面的高度。为适配补强部件160经过接触区高出的厚度,电子设备内部会从厚度方向(即显示屏至后壳的方向)上增大容纳面积,进而将会影响电子设备的整机厚度增加。
结合图7,在利用补强部件160容纳相对于屏幕出线120突出的屏幕芯片110时,补强部件160的突出部分朝向电子设备的背面(朝向电池),补强部件160的开口部分朝向电子设备的正面(朝向显示屏)。在将补强部件160安装在中框开孔132处时,补强部件160的部分裙边162会经过排线140的延伸端与屏幕出线120的大面形成的接触区170。因此,为将补强部件160在经过接触区170上方时增加的高度(排线140的厚度)去除,可通过改变补强部件160的结构形式来实现。示例性的,排线140的高度约为0.1~0.15mm,那么需要去除掉的补强部件160在经过接触区170上方时增加的高度也约为0.1~0.15mm。
在一些实施例中,将补强部件160的经过接触区170上方的部位切除,即直接将经过接触区170位置对应的裙边162切除,形成具有缺口裙边162的补强部件160,将剩余的裙边162与中框131固定,避免补强部件160的局部厚度导致电子设备的整机厚度变大。裙边162厚度一般为0.1mm,如果切除部分裙边162不足以容纳接触区170与补强部件160相邻的区域,可以进一步切除部分中边163,把与裙边相邻的部分中边163切除。
图11A是本申请实施例中具有缺口裙边的补强部件从底边凸起侧观察的结构示意图;图11B是本申请实施例中具有缺口裙边的补强部件从底边凹陷侧观察的的结构示意图。结合图9可知,补强部件160在经过排线140的延伸端与屏幕出线120的大面所形成的接触区170时,补强部件160为凸起部位朝向设备背面(即朝向电池侧)的状态,且补强部件160的左侧上下两个角处的裙边162会与接触区170接触。因此,为避免该接触位置的厚度增厚,将补强部件160的左侧上下两个角处的裙边162切除或将补强部件160的左侧上下两个角处的裙边162和与该裙边相邻的部分中边163切除,形成第一缺口164和第二缺口165,如图11A所示。图11A所示的具有缺口裙边的补强部件160的状态为底边161高于裙边162所呈现的凸出状态。
结合图6A可知,在具有缺口裙边的补强部件160以凹字形结构设置在中框开孔132处时,具有缺口裙边的补强部件160的状态为底边161低于裙边162所呈现的凹陷状态,如图11B所示状态。
图12A是本申请实施例中在接触区设置具有缺口裙边的补强部件的结构透视图;图12B是本申请实施例中在接触区设置具有缺口裙边的补强部件的结构效果图。参见图12A,排线140与屏幕出线120形成接触区170(白色虚线框),在将补强部件160设置在中框开孔132处,以由补强部件160容纳凸起的屏幕芯片110时,补强部件160的左侧上下两个角均会经过接触区170。此时,补强部件160呈现凸起状态。
为避免补强部件160经过接触区170导致该部位的高度增加,导致整机厚度增加,可以将经过接触区170的左侧上下两个角处的裙边162切除,即利用形成的第一缺口164和第二缺口165去容纳接触区170所形成的高度。参见图12B,由补强部件160的第一缺口164去容纳接触区170一端的高度,由补强部件160的第二缺口165去容纳接触区 170另一端的高度,裙边162的这两个缺口部分不再与中框131固定,为悬空状态,而其余裙边162与中框131固定。
在第一缺口164和第二缺口165处,补强部件160均不会与接触区170产生接触关系,因此,在该部分补强部件160不会产生高出一层排线140的厚度,因此,不会影响电子设备的整机厚度增加。
在一些实施例中,补强部件160中的第一缺口164或第二缺口165的开设起始点和终止点的确定以保证补强部件160不与接触区170造成接触为依据。示例性的,开设起始点(终止点)与接触区170之间的距离可设定约为1mm。
在一些实施例中,为抵消补强部件160在经过接触区170上方时增加的高度(排线140的厚度),避免导致电子设备的整机厚度变大,改变补强部件160的结构形式还可为对补强部件160经过接触区170位置的裙边162进行局部冲压处理,形成裙边不等高的补强钢片。冲压的局部裙边与中框131进行零配设计,此处不进行点胶处理,可节省该位置的点胶空间,避免增加该位置的高度。
图13A是本申请实施例中裙边不等高的补强部件从底边凸出侧观察的结构示意图;图13B是本申请实施例中裙边不等高的补强部件从底边凹陷侧观察的结构示意图。结合图9可知,补强部件160在经过排线140的延伸端与屏幕出线120的大面所形成的接触区170时,补强部件160为凸起部位朝向设备背面的状态,且补强部件160的左侧上下两个角处的裙边162会与接触区170接触。因此,为避免该接触位置的高度增加,对补强部件160的左侧上下两个角处的裙边162进行局部冲压处理,形成第一冲压区166和第二冲压区167,如图13A所示。图13A所示的裙边不等高的补强部件160的状态为底边161高于裙边162所呈现的凸出状态。
如图13A中C截面所示内容,在裙边不等高的补强部件的结构中,第一冲压区166和第二冲压区167相对于裙边162来说,更靠近底边161,即第一冲压区166和第二冲压区167与底边161的垂直距离小于裙边162与底边161的垂直距离。
结合图6A可知,在裙边不等高的补强部件160以凹字形结构设置在中框开孔132处时,裙边不等高的补强部件160的状态为底边161低于裙边162所呈现的凹陷状态,如图13B所示状态。
图14是本申请实施例中图13A所示的裙边不等高的补强部件的侧视图。参见图14,在采用局部冲压方式改变补强部件160的结构形式时,将在补强部件160易与接触区170接触的部分裙边162进行局部上抬,形成冲压区。由于补强部件160中会经过接触区170的裙边位于左侧上下两个角处(以补强部件呈现凸起状态为例),因此,可分别对补强部件160的左侧上下两个角处的裙边162进行局部冲压处理,使得该两个位置的裙边162局部上抬,形成第一冲压区166和第二冲压区167。
第一冲压区166和第二冲压区167相对于未进行局部冲压处理的裙边162突出一段高度,第一冲压区166和第二冲压区167的突出方向与底边161相对于裙边162的突出方向相同。
由于第一冲压区166和第二冲压区167相对于未进行局部冲压处理的裙边162突出,那么在该位置处,补强部件160的裙边162高度为冲压区与未进行局部冲压处理的裙边162的高度总和,使得冲压区的高度要大于未进行局部冲压处理的裙边162的高度,以形成裙边不等高的补强部件160。
在以图13B所示补强部件160呈凹陷状态为例,第一冲压区166和第二冲压区167相对于未进行局部冲压处理的裙边162下沉一段高度,下沉方向为底边161相对于裙边162的下沉方向相同。
图15A是本申请实施例中在接触区设置裙边不等高的补强部件的结构透视图;图15B是本申请实施例中在接触区设置裙边不等高的补强部件的结构效果图。参见图15A,排线140与屏幕出线120形成接触区170(白色虚线框),在将补强部件160设置在中框开孔132处,以由补强部件160容纳凸起的屏幕芯片110时,补强部件160的左侧上下两个角均会经过接触区170。此时,补强部件160呈现凸起状态。
为避免补强部件160经过接触区170导致该部位的高度增加,将经过接触区的左侧上下两个角处的裙边162进行局部冲压处理,即利用形成的第一冲压区166和第二冲压区167去容纳接触区170所形成的高度。参见图15B,由补强部件160的第一冲压区166去容纳接触区170一端的高度,由补强部件160的第二冲压区167去容纳接触区170另一端的高度。
在安装补强部件160时,裙边162与屏幕出线120的大面和排线140的接触处可通过点胶(或点焊或背胶)方式进行连接,而由于裙边不等高的补强部件160的两个冲压区相对于其余裙边162突出,第一冲压区166和第二冲压区167均与接触区170之间存在间隔距离,第一冲压区166和第二冲压区167与底边161的垂直距离均小于裙边162与底边161的垂直距离,即该两个冲压区为悬空状态,以便于由悬空的两个冲压区去容纳接触区170形成的高度。因此,两个冲压区在经过接触区170时,不再进行点胶。
在一些实施例中,补强部件160在裙边162的部分位置进行冲压处理,冲压区(166、167)整体向底边161的突出方向上抬,使得冲压区相对于其余裙边162形成凹槽。由于接触区170的高度约为0.1~0.15mm,因此,两个冲压区(166、167)上抬的高度设定为0.1~0.15mm,使得冲压区(166、167)相对于其余裙边162形成凹槽的深度约为0.1~0.15mm。
在固定裙边不等高的补强部件160时,由于点胶(或点焊或背胶)层的厚度约为0.1mm,点胶厚度小于或等于冲压区(166、167)相对于其余裙边162形成凹槽的深度,因此,在两个冲压区(166、167)经过接触区170的位置可不进行点胶,可节省该位置的点胶空间,避免增加该位置的高度。而仅在其余裙边162处进行点胶,实现补强部件160的固定。此时,两个冲压区(166、167)与接触区170相对悬空,由两个冲压区(166、167)处的凹槽容纳接触区170的高度,避免直接将补强部件160固定时增加补强部件160的整体高度,进而影响电子设备的整机厚度。
在第一冲压区166和第二冲压区167处,补强部件160均不会与接触区170产生接触关系,因此,在该部分补强部件160不会产生高出一层排线140的厚度,因此,不会影响电子设备的整机厚度增加。
在一些实施例中,补强部件160中的第一冲压区166和第二冲压区167的开设起始点和终止点的确定以保证补强部件160不与接触区170造成接触为依据。示例性的,开设起始点(终止点)与接触区170之间的距离可设定约为1mm。
本申请实施例提供的电子设备,在中框开孔132的位置设置补强部件160,以提高中框131的可靠性,并阻挡屏幕芯片110持续下沉。而为降低电子设备的整机厚度,补强部件160的结构形式可采用具有缺口裙边的补强部件或裙边不等高的补强部件。具体地,由具有缺口裙边的补强部件160形成的第一缺口164和第二缺口165容纳排线140的延 伸端与屏幕出线120的大面形成的接触区170的高度,或者,由裙边不等高的补强部件160形成的第一冲压区166和第二冲压区167容纳排线140的延伸端与屏幕出线120的大面形成的接触区170的高度。上述两种方式均可避免裙边162经过接触区170时导致局部高度增高,进而可避免影响电子设备的整机厚度增加。
需要说明的是,补强部件160的结构形式并不限定于上述实施例提供的方式,以避免补强部件160经过接触区170导致局部高度增加为前提,补强部件160也可采用其他结构形式,此处不进行具体限定。
在一些实施例中,前述实施例提供的电子设备内可以设置一个屏幕芯片,而为了提高点亮屏幕亮度的效率,还可在电子设备内设置两个屏幕芯片。示例性的,两个屏幕芯片可沿设备的长度方向顺次排列。
图16是本申请实施例中电子设备设置两个屏幕芯片的正面透视图。参见图16,在电子设备内设置两个屏幕芯片,第一屏幕芯片110a与第二屏幕芯片110b按照长度方向依次沿设备的长度方向排列,且顺次贴合在屏幕出线120的大面上,第一屏幕芯片110a与第二屏幕芯片110b均位于电池150的上方,两个屏幕芯片之间的距离以提高设备内部空间利用率最大化为前提进行设定,在保证数据传输和不会增加设备的整机长度的前提下,最大限度利用设备内部空间。
此时,屏幕出线120的大面(相当于垫片121的位置)上包括两个凸起的屏幕芯片(110a、110b),因此,在考虑避让屏幕芯片的凸起结构以降低电子设备的整机厚度时,需同时避让两个屏幕芯片(110a、110b)。两个屏幕芯片(110a、110b)的形状、尺寸、结构、位置等信息均可参照前述实施例提供的设置一个屏幕芯片的相关内容,此处不再赘述。
在一些实施例中,为了降低电子设备的整机厚度,本申请实施例提供的电子设备,对电子设备的内部部件进行改进,即在电池仓130的底部(中框131)与两个屏幕芯片(110a、110b)相对的位置开孔,在中框131上形成两个中框开孔(132a、132b),通过中框开孔(132a、132b)避让凸起的屏幕芯片(110a、110b),不会造成中框131的其余位置的厚度增加,进而达到降低整机厚度的效果。
图17是本申请实施例中电池仓设置两个中框开孔的整机背面透视图。参见图17,电池仓130的底部(中框131)沿电子设备的长度方向开设第一中框开孔132a和第二中框开孔132b。第一中框开孔132a和第二中框开孔132b的设置位置与大面上贴合的第一屏幕芯片110a与第二屏幕芯片110b的位置相对,即第一中框开孔132a与第一屏幕芯片110a的位置相对,第二中框开孔132b与第二屏幕芯片110b的位置相对。两个中框开孔(132a、132b)之间的距离与两个屏幕芯片(110a、110b)之间的距离相适应。
两个中框开孔(132a、132b)的形状、尺寸、结构等信息均可参照前述实施例提供的电池仓设置一个中框开孔132的相关内容,此处不再赘述。
图18是本申请实施例中由两个中框开孔容纳两个屏幕芯片时的整机背面透视图。参见图18,在由两个中框开孔(132a、132b)容纳两个屏幕芯片(110a、110b)时,由第一中框开孔132a容纳第一屏幕芯片110a,使得第一屏幕芯片110a可完全嵌入第一中框开孔132a中。由第二中框开孔132b容纳第二屏幕芯片110b,使得第二屏幕芯片110b可完全嵌入第二中框开孔132b中。
在一些实施例中,由于排线140的延伸端与屏幕出线120的大面贴合,使得排线140 的延伸端也会高于大面形成凸起结构。排线140的延伸端的厚度要小于屏幕芯片110的厚度,避免中框131处要产生更大的避让空间,进而可避免造成整体厚度增加。需要第一中框开孔132a在避让第一屏幕芯片110a,以及,第二中框开孔132b在避让第二屏幕芯片110b的同时,还需避让排线140的延伸端。因此,两个中框开孔(132a、132b)的尺寸要大于对应屏幕芯片(110a、110b)和排线140的延伸端的总和尺寸。具体实现内容可参照前述实施例提供的电池仓设置一个中框开孔132的相关内容,此处不再赘述。
本申请实施例提供的电子设备内部设置两个屏幕芯片(110a、110b),两个屏幕芯片(110a、110b)相对于屏幕出线120的大面均形成凸起结构。在保证中框131与大面满足最小安全间隙的情况下,为避免中框131与两个屏幕芯片(110a、110b)接触,需要中框131对两个屏幕芯片(110a、110b)进行避让。本申请实施例的避让方式采用在中框131相对于两个屏幕芯片(110a、110b)的位置设置两个中框开孔(132a、132b),由第一中框开孔132a容纳第一屏幕芯片110a,由第二中框开孔132b容纳第二屏幕芯片110b,避免两个屏幕芯片(110a、110b)因用户按压显示屏而向下移动与中框131接触,造成破损;同时,以中框开孔的方式避让屏幕芯片,无需增加中框131的壁厚,只需设置满足可靠性要求的最小壁厚即可。可见,该避让方式可充分利用电子设备的整机内部空间,在实现两个屏幕芯片(110a、110b)避让的同时,减小中框131的壁厚,可进一步降低电子设备的整机厚度。
在一些实施例中,由于为实现两个屏幕芯片(110a、110b)的避让,电池仓130的底部(中框131)的相对位置采用挖空的方式设置两个中框开孔(132a、132b)。此时,两个屏幕芯片(110a、110b)与电池150之间无中框131进行分隔,而中框131上开设两个中框开孔(132a、132b),也将导致中框131的可靠性下降。因此,从避免两个屏幕芯片(110a、110b)产生较大形变受损以及保护电池150的角度,可在两个中框开孔(132a、132b)的位置分别设置对应补强部件(160a、160b)。通过两个补强部件(160a、160b)起到支撑限位的作用,既可提高中框131的可靠性,也可避免两个屏幕芯片(110a、110b)因受力产生较大形变。由两个补强部件(160a、160b)阻挡两个屏幕芯片(110a、110b)持续下沉,避免两个屏幕芯片(110a、110b)与电池150接触而造成破损,保护电池150不会被两个屏幕芯片(110a、110b)扎破损坏而避免风险。
图19是本申请实施例中在两个中框开孔处设置两个补强部件的整机背面透视图。参见图19,在前述实施例提供的降低电子设备的整机厚度的方案基础上,在第一中框开孔132a处设置第一补强部件160a,在第二中框开孔132b设置第二补强部件160b。两个补强部件(160a、160b)的结构相同,均包括底边、裙边和中边。两个补强部件(160a、160b)的结构、材质、安装方式、贴合方式等信息均可参照前述实施例提供的在中框开孔132设置一个补强部件160的相关内容,此处不再赘述。
图19中的第一个虚线框为第一补强部件160a的裙边的边界,第二个虚线框为第二补强部件160b的裙边的边界。以图19所示状态,两个补强部件(160a、160b)均以凸起状态进行设置,且两个补强部件(160a、160b)的下方均为对应的屏幕芯片(110a、110b)。
两个补强部件(160a、160b)的裙边位于对应的屏幕芯片与中框131之间,两个补强部件(160a、160b)的底边结构由对应的中框开孔穿过。第一补强部件160a的裙边位于第一屏幕芯片110a与中框131之间,用于阻止第一屏幕芯片110a在受力下沉时与电 池150接触。第一补强部件160a的底边结构由第一中框开孔132a穿过,实现由第一补强部件160a的凸出部位容纳第一屏幕芯片110a的效果;第二补强部件160b的裙边位于第二屏幕芯片110b与中框131之间,用于阻止第二屏幕芯片110b在受力下沉时与电池150接触。第二补强部件160b的底边结构由第二中框开孔132b穿过,实现由第二补强部件160b的凸出部位容纳第二屏幕芯片110b的效果。
将两个补强部件(160a、160b)由电子设备内取出后的完整结构如图7所示,两个补强部件(160a、160b)的结构形式可采用图11A、图11B所示的具有缺口裙边的补强部件或图13A、图13B所示的裙边不等高的补强部件。两个补强部件(160a、160b)的结构形式在进行避让接触区170的实现方案可参照前述实施例提供的补强部件160避让接触区170的相关内容,此处不再赘述。
两个屏幕芯片(110a、110b)与电池150之间通过两个补强部件(160a、160b)的底边进行分隔,若用户按压显示屏使得两个屏幕芯片(110a、110b)产生较大形变,则由两个补强部件(160a、160b)的底边可阻挡对应的屏幕芯片(110a、110b)持续下沉,避免与电池150接触。即使两个屏幕芯片(110a、110b)与对应补强部件的底边接触导致出现破损,也可以由两个补强部件(160a、160b)承接碎片,避免该碎片与电池150接触,以保护电池150。
本申请实施例提供的电子设备,为降低电子设备的整机厚度,在中框131相对于两个屏幕芯片(110a、110b)的位置设置两个中框开孔(132a、132b),由两个中框开孔(132a、132b)容纳对应的屏幕芯片(110a、110b),中框131采用最小壁厚即可。以及,在两个中框开孔(132a、132b)的位置设置对应的补强部件(160a、160b),通过补强部件(160a、160b)起到支撑限位的作用,既可提高中框131的可靠性,也可阻挡对应的屏幕芯片(110a、110b)持续下沉,避免两个屏幕芯片(110a、110b)与电池150接触而造成破损,保护电池150而避免风险。可见,通过在中框131开设两个中框开孔(132a、132b)以及设置两个补强部件(160a、160b),既可以提高中框131的可靠性,又可以避让两个凸起的屏幕芯片(110a、110b),进而可以降低电子设备的整机厚度。
在一些实施例中,在电子设备内部设置两个屏幕芯片(110a、110b)时,也可仅在中框131上开设一个中框开孔132,由一个中框开孔132同时对两个屏幕芯片进行容纳。此时,该唯一的中框开孔的尺寸和形状等结构特征,要与两个屏幕芯片所围成区域的尺寸和形状等结构特征相适配,即中框开孔132的尺寸大于第一屏幕芯片110a和第二屏幕芯片110b所围成的尺寸。采用一个中框开孔同时容纳两个屏幕芯片的方案可参照前述各个实施例的内容,此处不再赘述。
由以上技术方案可知,本申请实施例提供的一种电子设备,为解决设备内部因局部突起导致整机厚度加厚的问题,在保证中框131与屏幕出线120的大面满足最小安全间隙的情况下,为避免中框131与屏幕芯片110接触,将中框131的与屏幕芯片110对应的位置挖空,形成中框开孔132,利用中框131壁厚的空间容纳屏幕芯片110。该避让屏幕芯片110的方式,只需设置满足可靠性要求的最小壁厚即可。以及,在中框开孔132的位置设置补强部件160,通过补强部件160起到支撑限位的作用,既可提高中框131的可靠性,也可阻挡屏幕芯片110持续下沉。同时,利用中框131上的卡槽133容纳补强部件160的裙边162,避免裙边162的顶部露出中框131的顶部,以保证中框131与屏幕出线120的大面之间预留最小的安全间隙,进而可以降低电子设备的整机厚度。补强 部件160的结构形式可采用具有缺口裙边的补强部件或裙边不等高的补强部件,以避让排线140与屏幕出线120形成的接触区170的高度,进而可避免影响电子设备的整机厚度增加。可见,该电子设备可充分利用整机内部空间,在实现屏幕芯片110避让的同时,减小中框131的壁厚以及避让相邻器件接触形成的高度,可进一步降低电子设备的整机厚度。
需要说明的是,本领域技术人员在考虑说明书及实践这里公开的申请后,将容易想到本申请的其它实施方案。本申请旨在涵盖本申请的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本申请的一般性原理并包括本申请未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本申请的真正范围和精神由下面的权利要求指出。
应当理解的是,本申请并不局限于上面已经描述并在附图中示出的精确结构,并且可以在不脱离其范围进行各种修改和改变。本申请的范围仅由所附的权利要求来限制。

Claims (14)

  1. 一种电子设备,其特征在于,包括:壳体,所述壳体上设置有显示屏,所述壳体与所述显示屏形成腔体,所述腔体内设有中框(131)、屏幕芯片(110)、屏幕出线(120)和电池(150);
    所述中框(131)上设有中框开孔(132),所述中框开孔(132)贯穿所述中框(131);
    所述电池(150)设置在所述中框(131)的远离所述显示屏的一侧;
    所述屏幕出线(120)设置在所述中框(131)的靠近所述显示屏的一侧,所述屏幕出线(120)与所述显示屏的一端连接,所述屏幕出线(120)的大面位于所述显示屏和所述中框(131)之间;
    所述屏幕芯片(110)设置在所述屏幕出线(120)的大面上,且位于所述中框(131)与所述屏幕出线(120)的大面之间;所述屏幕芯片(110)相对于所述屏幕出线(120)的大面形成的凸起结构位于所述中框开孔(132)内,且凸起结构的凸出高度小于所述中框开孔(132)的深度。
  2. 根据权利要求1所述的电子设备,其特征在于,所述腔体内还包括设置在所述显示屏和所述中框(131)之间的排线(140);
    所述排线(140)的一端延伸至所述屏幕出线(120)的大面的设有所述屏幕芯片(110)的一侧贴合,所述排线(140)的一端的厚度小于或等于所述屏幕芯片(110)的厚度,所述排线(140)的一端位于所述中框开孔(132)内。
  3. 根据权利要求2所述的电子设备,其特征在于,所述中框开孔(132)的尺寸大于所述屏幕芯片(110)和所述排线(140)的一端所围成的尺寸。
  4. 根据权利要求1-3任一项所述的电子设备,其特征在于,还包括设置于所述屏幕芯片和所述电池之间的补强部件(160);
    所述补强部件(160)固定在所述中框开孔周围,用于阻止所述屏幕芯片在受力下沉时与所述电池接触。
  5. 根据权利要求4所述的电子设备,其特征在于,所述补强部件(160)包括底边(161)、裙边(162)和中边(163),所述裙边(162)通过所述中边(163)与所述底边(161)连接,以形成凹槽结构,所述凹槽结构用于容纳所述屏幕芯片(110)。
  6. 根据权利要求5所述的电子设备,其特征在于,所述裙边(162)位于所述中框(131)与所述屏幕出线(120)的大面之间,固定在所述中框开孔(132)周围且靠近显示屏一侧的所述中框(131)上;
    所述底边(161)位于所述中框开孔(132)靠近所述电池(150)的一侧;所述底边(161)至所述裙边(162)的垂直距离小于所述中框(131)的厚度。
  7. 根据权利要求5或6所述的电子设备,其特征在于,所述中框(131)上设有用 于固定所述裙边(162)的卡槽(133),所述卡槽(133)位于所述中框开孔(132)周围且靠近所述大面,所述卡槽(133)的深度大于所述裙边(162)的厚度。
  8. 根据权利要求7所述的电子设备,其特征在于,所述裙边(162)上设有用于容纳接触区(170)的第一缺口(164)和第二缺口(165),所述接触区(170)为所述排线(140)的一端与所述屏幕出线(120)的大面接触所形成的区域。
  9. 根据权利要求7所述的电子设备,其特征在于,所述裙边(162)上设有用于容纳接触区(170)的第一冲压区(166)和第二冲压区(167),所述接触区(170)为所述排线(140)的延伸端与所述屏幕出线(120)的大面接触所形成的区域。
  10. 根据权利要求9所述的电子设备,其特征在于,所述第一冲压区(166)和所述第二冲压区(167)与所述底边(161)的垂直距离均小于所述裙边(162)与所述底边(161)的垂直距离。
  11. 根据权利要求1-10任一项所述的电子设备,其特征在于,所述屏幕芯片(110)包括在所述屏幕出线(120)的大面上顺次设置的第一屏幕芯片(110a)和第二屏幕芯片(110b);
    所述中框开孔(132)的尺寸大于所述第一屏幕芯片(110a)和所述第二屏幕芯片(110b)所围成的尺寸,所述中框开孔(132)用于容纳所述第一屏幕芯片(110a)和所述第二屏幕芯片(110b)。
  12. 根据权利要求11所述的电子设备,其特征在于,所述中框开孔(132)包括第一中框开孔(132a)和第二中框开孔(132b);
    所述第一中框开孔(132a)用于容纳所述第一屏幕芯片(110a);
    所述第二中框开孔(132b)用于容纳所述第二屏幕芯片(110b)。
  13. 根据权利要求12所述的电子设备,其特征在于,所述补强部件包括第一补强部件(160a)和第二补强部件(160b)
    所述第一补强部件(160a)位于所述第一屏幕芯片(110a)和所述电池之间,用于阻止所述第一屏幕芯片(110a)在受力下沉时与所述电池接触;
    所述第二补强部件(160b)位于所述第二屏幕芯片(110b)和所述电池之间,用于阻止所述第二屏幕芯片(110b)在受力下沉时与所述电池接触。
  14. 一种电子设备,其特征在于,包括:壳体,所述壳体上设置有显示屏,所述壳体与所述显示屏形成腔体,所述腔体内设有中框(131)、屏幕芯片(110)、屏幕出线(120)和电池(150);
    所述中框(131)上设有凹槽,所述凹槽的深度小于所述中框(131)的厚度;
    所述电池(150)设置在所述中框(131)的远离所述显示屏的一侧;
    所述屏幕出线(120)设置在所述中框(131)的靠近所述显示屏的一侧,所述屏幕 出线(120)与所述显示屏的一端连接,所述屏幕出线(120)的大面位于所述显示屏和所述中框(131)之间;
    所述屏幕芯片(110)设置在所述屏幕出线(120)的大面上,且位于所述中框与所述屏幕出线(120)的大面之间;所述屏幕芯片(110)相对于所述屏幕出线(120)的大面形成的凸起结构位于所述凹槽内。
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