WO2023008487A1 - 非接触給電モジュール及び非接触給電システム - Google Patents
非接触給電モジュール及び非接触給電システム Download PDFInfo
- Publication number
- WO2023008487A1 WO2023008487A1 PCT/JP2022/028967 JP2022028967W WO2023008487A1 WO 2023008487 A1 WO2023008487 A1 WO 2023008487A1 JP 2022028967 W JP2022028967 W JP 2022028967W WO 2023008487 A1 WO2023008487 A1 WO 2023008487A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power supply
- power
- power receiving
- module
- coil
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 21
- 230000001012 protector Effects 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 8
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000011151 fibre-reinforced plastic Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
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- 229910052751 metal Inorganic materials 0.000 description 4
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- 239000004020 conductor Substances 0.000 description 3
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- 206010017577 Gait disturbance Diseases 0.000 description 2
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- 238000004140 cleaning Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000009408 flooring Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
Definitions
- the present invention relates to a non-contact power supply module and a non-contact power supply system for non-contact power supply, and in particular to technology suitable for power supply to electrical equipment that requires protective grounding (for example, medical electrical equipment).
- a contactless power supply system includes, for example, a power supply module having a power supply coil to which a voltage is supplied from an AC power supply, and a power reception module having a power reception coil arranged opposite to the power supply coil and magnetically coupled to the power supply coil, Power is supplied in a non-contact manner using electromagnetic induction or magnetic resonance (see Patent Documents 1 and 2, for example).
- the power feeding module and the power receiving module are collectively referred to as "contactless power feeding module”.
- the floor surface should be flat from the viewpoints of ease of movement of heavy objects such as operating tables and medical electrical equipment, prevention of stumbling by medical staff, and ease of cleaning the floor surface.
- Liquids such as antiseptic solution and blood may also scatter on the floor of an operating room or the like. Therefore, it is not suitable from the standpoint of workability and safety to install a conventional power outlet on the floor, in which a terminal serving as an electrical contact is exposed to the outside.
- a contactless power supply system since the power supply coil and the power reception coil do not need to be exposed to the outside, the power supply module can be installed while maintaining the flatness of the floor surface. cable wiring can be simplified.
- An object of the present invention is to provide a contactless power supply module and a contactless power supply system that can easily realize protective grounding of electrical equipment and improve convenience.
- a contactless power supply module includes: A contactless power supply module provided on the power supply side or the power receiving side of a contactless power supply system, a coil used to transmit power; a housing having a recess for accommodating the coil; a grounding portion connected to a grounding line and arranged along the opening of the recess with its surface exposed.
- a contactless power supply system includes: a power supply module comprising the contactless power supply module; a power receiving module comprising the contactless power supply module; Power is transmitted while the ground portion of the power supply module and the ground portion of the power reception module are in contact with each other.
- protective grounding of electrical equipment can be easily achieved, and the size of the power supply module and the power reception module can be reduced.
- FIG. 1 is a diagram showing a schematic configuration of a contactless power supply system 1 according to an embodiment.
- 2A and 2B are a cross-sectional view and a plan view schematically showing the configuration of the power supply module.
- 3A and 3B are a cross-sectional view and a plan view schematically showing the configuration of the power receiving module.
- FIG. 4 is a diagram showing a usage state of the contactless power supply system.
- FIG. 1 is a diagram showing a schematic configuration of a contactless power supply system 1 according to an embodiment.
- the contactless power supply system 1 is used, for example, to supply power to the device power supply 44 of the medical electrical equipment 45 .
- the medical electrical equipment 45 is a Class I electrical equipment that requires protective grounding defined in JIS T 0601-1.
- the contactless power feeding system 1 includes a power feeding module 10 having a power feeding coil 11 and a power receiving module 20 having a power receiving coil 21 .
- the power supply module 10 is embedded in the floor F of an operating room or the like so as to surround, for example, an operating table.
- the power receiving module 20 is connected to a power cable 43 with a 3-pin plug of a medical electrical device 45 via a power receiving cable 41 and a power receiving circuit 42 .
- the power receiving module 20 is placed on the power feeding module 10, and the power feeding coil 11 and the power receiving coil 21 are arranged to face each other while being spaced apart.
- the feed coil 11 is connected via a feed cable 31 to a feed circuit 32 including a resonance capacitor (not shown) and the like.
- the power receiving coil 21 is connected via a power receiving cable 41 to a power receiving circuit 42 including a resonance capacitor (not shown).
- the power receiving circuit 42 is also connected to a device power source 44 of a medical electrical device 45 via a power cable 43 with a 3-pin plug.
- the power receiving circuit 42 has a socket structure that can be attached to and detached from the power cable 43 with a 3-pin plug.
- commercial power supplied from the AC power supply 33 is converted into a high-frequency AC voltage by the power supply circuit 32 and applied to the power supply coil 11 .
- an alternating current flows through the feeding coil 11
- a magnetic field is generated around the feeding coil 11
- the magnetic flux interlinking with both the feeding coil 11 and the receiving coil 21 causes a potential difference (voltage) in the receiving coil 21 .
- An induced current flows through the power receiving coil 21 , and power is supplied to the device power supply 44 of the medical electrical equipment 45 via the power receiving cable 41 , the power receiving circuit 42 and the power cable 43 with a 3-pin plug.
- FIG. 2A is a cross-sectional view of the power supply module 10
- FIG. 2B is a view of the power supply module 10 viewed from the opening end side of the power supply side housing 13.
- the power feeding module 10 includes a power feeding coil 11, a power feeding ground ring 12, a power feeding side housing 13, a power feeding side magnetic shield 14, a power feeding side protector 15, and the like.
- the feeding coil 11 is an annular spiral coil (also called a pancake coil) in which an electric wire is wound on the same plane with a predetermined number of turns.
- the shape of the feeding coil 11 is not limited to an annular shape, and may be, for example, an oval shape (an oval shape or a racetrack shape).
- a litz wire is applied, which is obtained by twisting a plurality of enamel wires (strand wires) in which an insulating coating is baked on a conductor.
- Terminal fittings (not shown) of the power line of the power supply cable 31 are connected to both ends of the power supply coil 11 by soldering, for example.
- the feeding-side housing 13 is a cylinder with a bottom having a concave portion 13a, and has, for example, a cylindrical shape.
- the feeding-side housing 13 accommodates the feeding coil 11 and the feeding-side magnetic shield 14 in the concave portion 13a.
- the feeding-side housing 13 is made of, for example, a metal material such as aluminum.
- the feeding-side housing 13 is connected to, for example, a terminal fitting (not shown) of the grounding wire of the feeding cable 31 and grounded.
- the feeding-side housing 13 also functions as an electromagnetic shield that prevents the radiation of electromagnetic waves to the outside and the incidence of electromagnetic waves from the outside.
- the power feeding side housing 13 may be grounded via a power feeding side grounding wire provided separately from the power feeding cable 31 .
- the power supply side housing 13 is made of a resin material such as fiber reinforced plastic (FRP), which is epoxy resin mixed with a filler (such as glass fiber). may be formed.
- FRP fiber reinforced plastic
- the power supply side grounding ring 12 is made of a conductive material and has an annular shape (for example, an annular shape) corresponding to the opening of the recess 13 a of the power supply side housing 13 .
- the feed-side ground ring 12 is arranged along the opening of the recess 13a with its surface exposed.
- the feed-side ground ring 12 is grounded via a feed-side ground wire.
- the feed-side grounding ring 12 is joined to the feed-side housing 13 made of metal and grounded through the feed-side housing 13 .
- the feeding-side grounding ring 12 may have an annular shape as a whole, and may be partially divided.
- the feed-side grounding ring 12 and the feed-side housing 13 may be made of the same material, or may be made of different materials.
- the feed-side grounding ring 12 and the feed-side housing 13 are made of the same material, that is, when a part of the feed-side housing 13 serves as the feed-side grounding ring 12, the number of parts is reduced. manufacturing process is simplified, and the manufacturing cost can be reduced.
- suitable materials can be selected to realize their respective functions.
- the weight of the power feeding side housing 13 can be reduced while the power feeding side exposed as the floor surface can be used.
- the corrosion resistance of the ground ring 12 can be improved.
- the surface of the power-supply-side grounding ring 12 may have an uneven structure like the power-receiving-side grounding ring 22, which will be described later. preferable.
- the power supply side magnetic shield 14 is arranged so as to cover the outer surface of the power supply coil 11 (excluding the surface facing the power reception coil 21).
- the feeding-side magnetic shield 14 is made of, for example, a magnetic material such as ferrite.
- the power supply side protector 15 fixes the power supply coil 11 and the power supply side magnetic shield 14 to the concave portion 13 a of the power supply side housing 13 .
- the power feed side protector 15 includes an insulating medium 151 (for example, epoxy resin) and a surface protective layer 152 .
- an insulating medium 151 e.g., epoxy resin
- the shield 14 is fixed in the recess 13a.
- the insulating medium 151 is formed to be recessed from the end surface of the feed-side ground ring 12 by the thickness of the surface protection layer 152 (for example, 2 mm).
- the surface protective layer 152 is formed on the open surface of the insulating medium 151 so as to be flush with the power supply side grounding ring 12 .
- the surface protection layer 152 protects the surface of the insulating medium 151 and forms the floor on which the power supply module 10 is installed.
- the surface protective layer 152 is formed of, for example, a cushioning resin flooring material (for example, vinyl chloride resin flooring material) used in an operating room or the like.
- the surface protective layer 152 is preferably made of the same material as the floor material used for the floor on which the power supply module 10 is installed.
- the power supply module 10 is installed on the floor F of an operating room or the like so that the power supply side grounding ring 12 and the surface protective layer 152 of the power supply module 10 are flush with the floor F. Although the power-supply-side grounding ring 12 is exposed on the surface, since the flatness of the floor surface is ensured, it does not hinder the movement of heavy objects such as the medical electrical equipment 45 .
- FIG. 3A is a cross-sectional view of the power receiving module 20, and FIG. 3B is a view of the power receiving module 20 viewed from the opening end side of the power receiving side housing 23.
- the power receiving module 20 includes a power receiving coil 21, a power receiving side grounding ring 22, a power receiving side housing 23, a power receiving side magnetic shield 24, and the like.
- the receiving coil 21 is an annular spiral coil formed by winding an electric wire on the same plane with a predetermined number of turns.
- the shape of power receiving coil 21 is typically the same as the shape of power feeding coil 11 .
- Terminal fittings (not shown) of the power line of the power receiving cable 41 are connected to both ends of the power receiving coil 21 by soldering, for example.
- the power receiving side housing 23 is a cylindrical body with a bottom having a recess 23a, and has, for example, a cylindrical shape.
- the power receiving side housing 23 accommodates the power receiving coil 21 and the power receiving side magnetic shield 24 in the concave portion 23a.
- the power receiving side housing 23 is made of, for example, a metal material such as aluminum.
- the power receiving side housing 23 is connected to, for example, a terminal fitting (not shown) of the ground wire of the power receiving cable 41 .
- the power receiving side housing 23 functions as an electromagnetic shield that prevents the radiation of electromagnetic waves to the outside and the incidence of electromagnetic waves from the outside.
- the power receiving side housing 23 may be formed of a resin material such as fiber reinforced plastic (FRP). In this case, it is possible to prevent the heat generation of the power receiving side housing 23 due to induction heating, and further, to improve the heat dissipation of the power receiving side housing 23 by adopting a filler of FRP having good thermal conductivity. can also
- the power receiving side grounding ring 22 is made of a conductive material and has an annular shape (for example, an annular shape) corresponding to the opening of the recess 23 a of the power receiving side housing 23 .
- the power-receiving-side grounding ring 22 is arranged along the opening of the recess 23a with its surface exposed.
- the power receiving side grounding ring 22 contacts the power feeding side grounding ring 12 and is grounded.
- the power receiving side ground ring 22 is joined to the metal power receiving side housing 23 , and the ground wire of the power receiving cable 41 is grounded via the power receiving side housing 23 .
- the power-receiving-side grounding ring 22 may have an annular shape as a whole, and may be partially divided.
- the power-receiving-side grounding ring 22 and the power-receiving-side housing 23 may be made of the same material, or may be made of different materials.
- the power receiving side grounding ring 22 and the power receiving side housing 23 are made of the same material, that is, when a part of the power receiving side housing 23 becomes the power receiving side grounding ring 22, the number of parts is reduced. manufacturing process is simplified, and the manufacturing cost can be reduced.
- suitable materials can be selected to realize their respective functions.
- the weight of the power receiving side housing 23 can be reduced and grounding can be achieved. Resistance can be efficiently reduced.
- a plated layer made of Ni or the like may be formed on the surface of the power receiving side grounding ring 22 in order to improve corrosion resistance.
- the power receiving side grounding ring 22 preferably has an uneven structure on its surface. Since the power supply module 10 is installed on the floor and the power supply side grounding ring 12 is exposed to the outside air, there is a risk that an oxide film will form on the surface of the power supply side grounding ring 12 over time. In the case where the surface of the power receiving side grounding ring 22 is formed with an uneven structure, when the power feeding side grounding ring 12 and the power receiving side grounding ring 22 come into contact with each other, the oxide film formed on the power feeding side grounding ring 12 is formed on the power receiving side grounding ring. It is destroyed by the uneven structure of 22, which is useful for ensuring good electrical continuity. The contact area of the power receiving side ground ring 22 is ensured so that the ground resistance in the ground path including the power receiving side ground ring 22 is 10 ⁇ or less.
- the power receiving side grounding ring 22 preferably has a spring structure on its surface.
- the spring structure is deformed under pressure due to the weight of the power receiving module 20 itself.
- the power-supplying-side grounding ring 12 and the power-receiving-side grounding ring 22 are reliably brought into contact with each other to prevent poor grounding, which is useful for ensuring electrical continuity.
- the spring structure for example, leaf springs (so-called shield fingers (trade name)) arranged at equal intervals in the circumferential direction of the power receiving side grounding ring 22 can be applied.
- the power receiving side magnetic shield 24 is arranged so as to cover the outer surface of the power receiving coil 21 (excluding the surface facing the power feeding coil 11).
- the power receiving side magnetic shield 24 is made of, for example, a magnetic material such as ferrite.
- a path with low magnetic resistance is formed.
- the performance (Q value) of the power receiving coil 21 is improved and leakage magnetic flux is reduced. Therefore, the lines of magnetic force can be efficiently focused to improve the power transmission efficiency, and noise generation can be suppressed.
- the heat generation of the power receiving side housing 23 made of metal can be suppressed.
- the power receiving side protector 25 fixes the power receiving coil 21 and the power receiving side magnetic shield 24 to the recess 23 a of the power receiving side housing 23 .
- the power receiving side protector 25 is made of, for example, an insulating material such as epoxy resin.
- an insulating material is filled and cured to form the power receiving side protector 25 .
- the side magnetic shield 24 is fixed to the recess 23a.
- the power receiving side protector 25 is formed recessed from the end surface of the power receiving side grounding ring 22 .
- FIG. 4 is a diagram showing a usage state of the contactless power supply system 1.
- the power reception module 20 when power is supplied from the power supply module 10 to the power reception module 20, the power reception module 20 is placed on the power supply module 10 so that the power supply coil 11 and the power reception coil 21 face each other.
- the ring-shaped power feeding side grounding ring 12 exposed on the floor F can be used as a mark for positioning.
- the power receiving module 20 is placed on the power feeding module 10
- the power feeding side grounding ring 12 and the power receiving side grounding ring 22 come into contact with each other, and the power receiving side grounding ring is connected through the power feeding side grounding ring 12 and the power feeding side housing 13. 22 is grounded.
- the power receiving side ground ring 22 is connected to the ground line of the power receiving cable 41 via the power receiving side housing 23, and the ground line of the power receiving cable 41 is connected to the ground line of the power cable 43 with a 3-pin plug via the power receiving circuit 42.
- the medical electrical equipment 45 is protectively grounded.
- the power supply module 10 (contactless power supply module) according to the embodiment includes the power supply coil 11 used for power transmission, the power supply side housing 13 having the recess 13a that accommodates the power supply coil 11, and the power supply cable. a power supply side ground ring 12 (ground portion) connected to the ground line 31 and arranged along the opening of the recess 13a with its surface exposed.
- the power receiving module 20 (contactless power supply module) is connected to a power receiving coil 21 used for power transmission, a power receiving side housing 23 having a concave portion 23 a for housing the power receiving coil 21 , and a ground wire of the power receiving cable 41 .
- the contactless power supply system 1 includes a power supply module 10 and a power receiving module 20, and power is supplied while the power supply side ground ring 12 of the power supply module 10 and the power receiving side ground ring 22 of the power reception module 20 are in contact with each other. transmission takes place.
- the power receiving module 20 when the power receiving module 20 is placed on the power feeding module 10, the power feeding side grounding ring 12 and the power receiving side grounding ring 22 come into contact with each other.
- a ground wire of a power cable 43 with a 3-pin plug connected to the power receiving module 20 via the power receiving cable 41 or the like is grounded.
- the power-supplying-side grounding ring 12 and the power-receiving-side grounding ring 22 are arranged along the openings of the concave portions 13a and 23a, respectively, that is, are formed in an annular shape, the power-receiving-side grounding ring 22 can be placed when the power-receiving module 20 is placed.
- the power supply side housing 13 is conductive, and the power supply side grounding ring 12 is arranged at the opening end of the recess 13a and physically and electrically connected.
- the power receiving side housing 23 is conductive, and the power receiving side grounding ring 22 is arranged at the opening end of the recess 23a and is physically and electrically connected.
- the power supply side housing 13 and the power supply side grounding ring 12 are made of different materials.
- the power receiving side housing 23 and the power receiving side grounding ring 22 are made of different materials. As a result, it is possible to select a suitable material for realizing each function, thereby improving the degree of freedom in design.
- the power supply module 10 further includes a protector 15 arranged in the opening of the recess 13a, and the power supply side ground ring 12 and the surface protective layer 152 (surface of the protector 15) are flush with each other. Accordingly, by installing the power supply module 10 so that the power supply side grounding ring 12 and the surface protective layer 152 are flush with the floor surface, the flatness of the floor surface is ensured. In addition to being able to move heavy objects smoothly, it is possible to prevent medical staff from stumbling and improve the workability of floor cleaning.
- the power receiving side grounding ring 22 has an uneven structure on its surface.
- the power-receiving-side grounding ring 22 has a pressure-deformable spring structure on its surface. This makes it easier to ensure good electrical continuity.
- the contactless power supply system 1 can position the power receiving module 20 in the XYZ directions, specifically, move a movable body (for example, a wagon for medical electrical equipment) including the power receiving module 20 on a plane, and move the power receiving module 20.
- a positioning device that automatically raises and lowers may be provided.
- a brush portion such as a wire brush may be provided on the surface of the power receiving side grounding ring 22 of the power receiving module 20 .
- a brush portion such as a wire brush may be provided on the surface of the power receiving side grounding ring 22 of the power receiving module 20 .
- the insulating medium 151 of the power feeding side protector 15 and the insulating material of the power receiving side protector 25 are not particularly limited as long as they can fix the power feeding coil 11 and the power receiving coil 21 .
- the insulating medium 151 of the power feeding side protector 15 and the insulating material of the power receiving side protector 25 may be made of a resin material obtained by adding a filler to epoxy resin. In this case, the waterproof effect of the epoxy resin can be obtained, and the strength of the power supply module 10 and the power reception module 20 can be increased. Furthermore, when a filler with high heat dissipation is employed, the heat dissipation of the power feeding coil 11 and the power receiving coil 21 can be enhanced.
- the present invention relates to a non-contact power supply module and a non-contact power supply system for non-contact power supply, and is particularly useful for power supply to electrical equipment that requires protective grounding.
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- Computer Networks & Wireless Communication (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Priority Applications (1)
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JP2023538598A JPWO2023008487A1 (de) | 2021-07-29 | 2022-07-27 |
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JP2021124410 | 2021-07-29 | ||
JP2021-124410 | 2021-07-29 |
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WO2023008487A1 true WO2023008487A1 (ja) | 2023-02-02 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002110294A (ja) * | 2000-08-14 | 2002-04-12 | Framatome Connectors Internatl | マイクロ同軸導線用電気コネクタ |
JP2007165876A (ja) * | 2005-12-01 | 2007-06-28 | General Electric Co <Ge> | 無接点電力伝達システム |
JP2018534808A (ja) * | 2015-09-03 | 2018-11-22 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | データ及び/又は電力のワイヤレス伝送のためのコネクタ及びデバイス |
JP2021061706A (ja) * | 2019-10-08 | 2021-04-15 | 昭和電線ケーブルシステム株式会社 | 非接触給電システム |
-
2022
- 2022-07-27 JP JP2023538598A patent/JPWO2023008487A1/ja active Pending
- 2022-07-27 WO PCT/JP2022/028967 patent/WO2023008487A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002110294A (ja) * | 2000-08-14 | 2002-04-12 | Framatome Connectors Internatl | マイクロ同軸導線用電気コネクタ |
JP2007165876A (ja) * | 2005-12-01 | 2007-06-28 | General Electric Co <Ge> | 無接点電力伝達システム |
JP2018534808A (ja) * | 2015-09-03 | 2018-11-22 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | データ及び/又は電力のワイヤレス伝送のためのコネクタ及びデバイス |
JP2021061706A (ja) * | 2019-10-08 | 2021-04-15 | 昭和電線ケーブルシステム株式会社 | 非接触給電システム |
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