WO2023005333A1 - 电子设备和摄像头模组 - Google Patents

电子设备和摄像头模组 Download PDF

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Publication number
WO2023005333A1
WO2023005333A1 PCT/CN2022/091799 CN2022091799W WO2023005333A1 WO 2023005333 A1 WO2023005333 A1 WO 2023005333A1 CN 2022091799 W CN2022091799 W CN 2022091799W WO 2023005333 A1 WO2023005333 A1 WO 2023005333A1
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WO
WIPO (PCT)
Prior art keywords
path
switch
camera
camera module
electronic device
Prior art date
Application number
PCT/CN2022/091799
Other languages
English (en)
French (fr)
Inventor
王峰
杨玉坤
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22777210.0A priority Critical patent/EP4149100B1/en
Priority to US17/996,299 priority patent/US20240223879A1/en
Publication of WO2023005333A1 publication Critical patent/WO2023005333A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/667—Camera operation mode switching, e.g. between still and video, sport and normal or high- and low-resolution modes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/222—Studio circuitry; Studio devices; Studio equipment
    • H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/268—Signal distribution or switching

Definitions

  • the embodiments of the present application relate to the technical field of terminals, and in particular, to an electronic device and a camera module.
  • the electronic device can process the image or video data collected by the camera to realize the display and storage of the image or video.
  • a pre-processing chip can be added on the main board of the electronic device, and the image or video data can be optimized through the pre-processing chip.
  • An embodiment of the present application provides an electronic device and a camera module, so as to reduce the area occupied by a pre-processing chip on a mainboard and reduce costs.
  • an embodiment of the present application provides an electronic device, including: a main board and a camera module; wherein, the camera module includes a camera, an image signal processing integrated circuit, and a first switch; a processor is arranged in the main board; the camera uses The image signal processing integrated circuit is used to process the image data collected by the camera; the first switch is a switch for realizing the single-pole double-throw function, and is specifically used to switch the camera to the first path or the second path; the first The path is the path for transmitting the image data collected by the camera to the processor, and the second path is the path for transmitting the image data collected by the camera to the processor after being processed by the image signal processing integrated circuit; the processor is used to process the image data from the first path data or data from the second channel.
  • the image signal processing integrated circuit and the first switch are arranged in the camera module, and the first switch can realize the single-pole-double-throw function between the camera and the two channels, so that after the switching of the first switch, the camera
  • the collected image data can be directly transmitted to the processor in the first path, or the image data collected by the camera can be processed by the image signal processing integrated circuit in the second path and then transmitted to the processor, because the process complexity of the camera module is low,
  • the cost required to arrange the image signal processing integrated circuit and the first switch in the camera module is relatively low, so the cost of electronic equipment can be reduced.
  • the board process of the camera module can be about 6 layers, and there are fewer devices in each layer, the circuit layout is relatively simple, and usually there may be vacant areas in the camera module, and the image signal processing integrated circuit and the first switch are set In the camera module, the manufacturing process of the camera module will not cause too much difficulty, and in specific implementation, the image signal processing integrated circuit and the first switch can also be arranged in the vacant area of the camera module, or integrated in the In the camera of the camera module, devices can be added without increasing the area of the camera module.
  • the processor uses the same interface to receive data from the first path or data from the second path. This can reduce the occupation of the processor interface.
  • the camera module also includes a second switch;
  • the second switch is a switch that realizes single-pole double-throw, and is specifically used to switch the processor to the first path or the second path in the camera module;
  • the first switch The moving end of the first switch is connected to the camera, one of the fixed ends of the first switch is connected to one end of the first channel, and the other fixed end of the first switch is connected to one end of the second channel;
  • the moving end of the second switch is connected to the processor
  • One of the fixed ends of the second switch is connected to the other end of the first path, and the other fixed end of the second switch is connected to the other end of the second path; wherein, the first switch and the second switch are used for When the image data collected by the camera is transmitted through the first path, turn on the connection of the first path in the circuit, and disconnect the connection of the second path in the circuit; or, when the image data collected by the camera is transmitted through the second path , turn on the connection of the second path in the circuit, and disconnect the connection of the first path in
  • the first path and/or the second path of the camera module is provided with an anti-jamming module, and the output end of the first path and the output end of the second path are connected in the camera module. In this way, the number of switches can be saved and the cost can be further reduced.
  • the motherboard also includes a third switch;
  • the third switch is a switch that realizes single-pole double-throw, and is specifically used to switch the processor to the first path or the second path in the motherboard;
  • the moving end of the first switch Connect with the camera, one of the fixed ends of the first switch is connected to one end of the first channel, and the other fixed end of the first switch is connected to one end of the second channel; the first channel and the second channel respectively pass through their own paths connected to the motherboard;
  • the moving end of the third switch is connected to the processor, one of the fixed ends of the third switch is connected to the end connected to the motherboard of the first channel, and the other fixed end of the third switch is connected to the second channel to the The terminal connection of the motherboard; wherein, the first switch and the third switch are used to turn on the connection of the first path in the circuit and disconnect the second path in the circuit when the image data collected by the camera is transmitted through the first path or, when the image data collected by the camera is transmitted through the second path, the connection of the second path in the circuit is
  • the processor uses two interfaces to respectively receive data from the first path or data from the second path. This can save the number of switches and further reduce the cost.
  • a metal shield is provided around the camera module. This can reduce the radiation or interference of the camera module to other components of the electronic equipment.
  • the camera module and the main board are connected by a flexible printed circuit board (FPC), and both the camera module and the main board are provided with a board-to-board connector BTB, and the BTB is used for accessing the FPC.
  • FPC flexible printed circuit board
  • the first path may correspond to path 1 or path 3 in the specific embodiment part
  • the second path may correspond to path 2 or path 4 in the specific embodiment part.
  • the first switch may correspond to the first switch and the fourth switch in the detailed description section.
  • the embodiment of the present application adopts a camera module
  • the camera module includes a camera, an image signal processing integrated circuit and a first switch
  • the camera is used to collect image data
  • the image signal processing integrated circuit is used to process the image data collected by the camera image data
  • the first switch is a switch that realizes the single-pole double-throw function, and is specifically used to switch the camera to the first path or the second path
  • the first path is the path that transmits the image data collected by the camera to the processor of the motherboard
  • the second path is the path for transmitting the image data collected by the camera to the processor after being processed by the image signal processing integrated circuit.
  • the camera module also includes a second switch;
  • the second switch is a switch that realizes single-pole double-throw, and is specifically used to switch the processor to the first path or the second path in the camera module;
  • the first switch The moving end of the first switch is connected to the camera, one of the fixed ends of the first switch is connected to one end of the first channel, and the other fixed end of the first switch is connected to one end of the second channel;
  • the moving end of the second switch is connected to the processor
  • One of the fixed ends of the second switch is connected to the other end of the first path, and the other fixed end of the second switch is connected to the other end of the second path; wherein, the first switch and the second switch are used for When the image data collected by the camera is transmitted through the first path, turn on the connection of the first path in the circuit, and disconnect the connection of the second path in the circuit; or, when the image data collected by the camera is transmitted through the second path , turn on the connection of the second path in the circuit, and disconnect the connection of the first path in
  • the first path and/or the second path of the camera module is provided with an anti-jamming module, and the output end of the first path and the output end of the second path are connected in the camera module.
  • a metal shield is provided around the camera module.
  • Fig. 1 is a schematic structural diagram of the connection between a camera module and a mainboard provided in a possible implementation
  • FIG. 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of the connection between a camera module and a main board provided by an embodiment of the present application;
  • FIG. 4 is a schematic structural diagram of a camera module connected to a main board provided in an embodiment of the present application
  • FIG. 5 is a schematic structural diagram of the connection between a camera module and a main board provided by an embodiment of the present application
  • FIG. 6 is a schematic structural diagram of the connection between a camera module and a main board provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of the connection between a camera module and a main board provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a SOC structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • plural herein means two or more.
  • the term “and/or” in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.
  • the character "/" in this paper generally indicates that the contextual objects are an “or” relationship; in the formula, the character "/" indicates that the contextual objects are a "division" relationship.
  • sequence numbers of the above-mentioned processes do not mean the order of execution, and the order of execution of the processes should be determined by their functions and internal logic, and should not be used in the implementation of this application.
  • the implementation of the examples constitutes no limitation.
  • the user can trigger the camera or video function of the electronic device.
  • the electronic device uses the camera to collect image or video data, and further optimizes the image or video through the pre-processing chip. Optimizing operations such as light fill, beautification, or deburring are performed on the video data.
  • the preprocessing chip includes, for example, an image signal processing (image signal processor, ISP) integrated circuit (integrated circuit, IC) and the like.
  • the preprocessing chip is set in the main board of the electronic device, the camera is set in the camera module, and the image or video data collected in the camera module can be transmitted to the preprocessing in the mainboard. Chip, the preprocessing chip further processes the image or video data.
  • FIG. 1 shows a schematic structural diagram of the connection between a camera module and a mainboard.
  • the camera module 110 and the main board 120 are connected through a flexible printed circuit (flexible printed circuit, FPC) 130 .
  • the camera module 110 includes an image sensor 111 (image sensor) and a board-to-board connector (board to board connectors, BTB) 112, and the image sensor can also be called a camera.
  • the motherboard 120 includes an ISP IC121, a system on chip (SOC) 122, a BTB123, a switch SW1 and a switch SW2.
  • SOC system on chip
  • Both ends of the FPC130 can be inserted into the BTB112 and the BTB123, respectively. Both SW1 and SW2 can be single pole double throw switches. After the image or video data collected by the image sensor 111 is transmitted to the main board through the FPC130, according to the selection of SW1 and SW2, it can be directly transmitted to the SOC122 via the channel 1, or can be processed by the ISP IC121 of the channel 2 and then transmitted to the SOC122.
  • the electronic device can control SW1 and SW2 to conduct path 1, and the image or video data collected by the image sensor 111 is transmitted to the main board through the FPC130. It is directly transmitted to SOC122 via channel 1. If the electronic device is performing steps such as taking pictures or beautifying video, the electronic device can control SW1 and SW2 to conduct the channel 2, and the image or video data collected by the image sensor 111 will be transmitted to the main board through the FPC130, and then passed through the ISP of the channel 2. After processing by IC121, it is transmitted to SOC122.
  • the process complexity of the main board is generally high, and the cost is also high.
  • the board material process of the main board may reach about 12 layers, and there are many devices in each layer, and the circuit layout is more complicated.
  • Setting ISP IC, SW1 and SW2 in the main board will not only increase the area of the main board, increase the cost of the main board, but also increase the cost of the main board.
  • Increasing the circuit complexity of the main board puts forward higher requirements on the manufacturing process of the main board, which will further increase the cost of the main board.
  • the ISP IC is arranged in the camera module, and part or all of SW1 or SW2 is also arranged in the camera module. Because the process complexity of the camera module is low and the cost is relatively low, for example, the plate process of the camera module can be about 6 layers, there are fewer devices in each layer, and the circuit layout is relatively simple, and it is usually available in the camera module.
  • the ISP IC is set in the camera module, and part or all of SW1 or SW2 is also set in the camera module, which will not cause too much difficulty in the manufacturing process of the camera module, and in the actual implementation, there are still
  • the ISP IC, SW1 and/or SW2 can be set in the vacant area of the camera module, which can realize the increase of devices without increasing the area of the camera module.
  • the implementation of setting the ISP IC, SW1 and SW2 in the main board can save costs and reduce the area of the main board.
  • the ISP IC and the switch device are integrated in the camera module, which can realize the decoupling of the camera module and the motherboard, so that the camera module can be applied to a general-purpose motherboard, and can also make the same motherboard compatible with ordinary camera modules and with The camera module of the pre-processing chip switching channel improves the versatility of the motherboard.
  • metal shielding can be added around the camera module, so as to reduce the possibility of the signal collected by the camera being interfered.
  • the metal shield may be a closed area surrounded by metal, for example, the metal shield around the camera module may be a metal sheet arranged around the camera module. It can be understood that the closed area enclosed by the metal may be similar to the uncapped area of the fence, or may be a completely closed area, which is not specifically limited in this embodiment of the present application.
  • FIG. 2 provides a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 200 may include: a system on chip (system on chip, SOC) 201, a main power management unit (master power management unit, master PMU) IC202, a charging chip 203, a universal serial bus (universal serial bus, USB) interface (connector) 204, power on key (power on key) 206, battery (battery) 207, slave PMU IC (slave PMU IC) 208, front camera (front camera) 209, rear camera (rear camera) ) 210, ISP IC205, rear camera 211, rear camera 212, modem (modem) 213, radio frequency (radio frequency, RF) IC214, antenna (antenna) 215, low power consumption memory (low power double data rate, LPDDR) 216.
  • SOC system on chip
  • master PMU master power management unit
  • charging chip 203 a universal serial bus (universal serial bus, USB) interface (connector) 204, power on key (power on key) 206, battery (battery)
  • UFS Universal flash storage
  • Touch panel touch panel
  • liquid crystal display liquid crystal display, LCD
  • Fingerprint module fingerprint module
  • Audio processing module audio codec
  • sensor sensor
  • motor motor
  • speaker speaker
  • microphone MIC
  • receiver receiver
  • the ISP IC 205 and the rear camera 210 of the embodiment of the present application can be integrated in the camera module, which can save costs and reduce the area of the main board. It can be understood that, some or all of the front camera 209, the rear camera 211 and the rear camera 212 can also be integrated with corresponding ISP ICs in respective camera modules (not shown in the figure). The example does not limit the number of cameras and the specific form of the camera module.
  • the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 200 .
  • the electronic device 200 may include more or fewer components than shown in the figure, or combine certain components, or separate certain components, or arrange different components.
  • the illustrated components can be realized in hardware, software or a combination of software and hardware.
  • the SOC201 can be a processor, and the SOC201 can include one or more processing units, for example: the SOC201 can include an application processor (application processor, AP), a modem 213, a graphics processing unit (graphics processing unit, GPU), a controller, Video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU), etc.
  • application processor application processor
  • AP application processor
  • modem 213 graphics processing unit
  • graphics processing unit graphics processing unit
  • GPU graphics processing unit
  • Video codec Video codec
  • digital signal processor digital signal processor
  • DSP digital signal processor
  • baseband processor baseband processor
  • neural network processor neural-network processing unit
  • a controller can be set in the SOC201, and the controller can generate an operation control signal according to the instruction operation code and timing signal, and complete the control of fetching and executing instructions.
  • a memory can also be set in the SOC201 for storing instructions and data.
  • the memory in SOC 201 is a cache memory. This memory can save the instructions or data that SOC201 has just used or recycled. If the SOC 201 needs to use the instruction or data again, it can be called directly from the memory. Repeated access is avoided, and the waiting time of SOC201 is reduced, thereby improving the efficiency of the system.
  • SOC 201 may include one or more interfaces.
  • the interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transmitter (universal asynchronous receiver/transmitter, UART) interface, mobile industry processor interface (mobile industry processor interface, MIPI), general-purpose input and output (general-purpose input/output, GPIO) interface, and/or subscriber identity module (subscriber identity module, SIM) interface etc.
  • I2C integrated circuit
  • I2S integrated circuit built-in audio
  • PCM pulse code modulation
  • PCM pulse code modulation
  • UART universal asynchronous transmitter
  • MIPI mobile industry processor interface
  • GPIO general-purpose input and output
  • SIM subscriber identity module
  • the I2C interface is a bidirectional synchronous serial bus, including a serial data line SDA and a serial clock line (derail clock line, SCL).
  • SOC 201 may contain multiple sets of I2C buses.
  • SOC201 can couple touch sensors, chargers, flashlights, cameras, etc. through different I2C bus interfaces.
  • the SOC 201 can couple the touch sensor through the I2C interface, so that the SOC 201 and the touch sensor can communicate through the I2C bus interface to realize the touch function of the electronic device 200 .
  • the I2S interface can be used for audio communication.
  • SOC 201 may contain multiple sets of I2S buses.
  • the SOC 201 can be coupled with the audio processing module 220 through the I2S bus to realize the communication between the SOC 201 and the audio processing module 220 .
  • the audio processing module 220 can transmit audio signals to the wireless communication module through the I2S interface, so as to realize the function of answering calls through the Bluetooth headset.
  • the PCM interface can also be used for audio communication, sampling, quantizing and encoding the analog signal.
  • the audio processing module 220 and the wireless communication module may be coupled through a PCM bus interface.
  • the audio processing module 220 can also transmit audio signals to the wireless communication module through the PCM interface, so as to realize the function of answering calls through the Bluetooth headset. Both the I2S interface and the PCM interface can be used for audio communication.
  • the UART interface is a universal serial data bus used for asynchronous communication.
  • the bus can be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication.
  • a UART interface is generally used to connect the SOC 201 with the wireless communication module.
  • SOC201 communicates with the Bluetooth module in the wireless communication module through the UART interface to realize the Bluetooth function.
  • the audio processing module 220 can transmit audio signals to the wireless communication module through the UART interface, so as to realize the function of playing music through the Bluetooth headset.
  • the MIPI interface can be used to connect SOC201 with display screen, camera and other peripheral devices.
  • MIPI interface includes camera serial interface (camera serial interface, CSI), display serial interface (display serial interface, DSI), etc.
  • the SOC 201 communicates with the camera through the CSI interface to realize the shooting function of the electronic device 200 .
  • the SOC 201 communicates with the display screen through the DSI interface to realize the display function of the electronic device 200 .
  • the GPIO interface can be configured by software.
  • the GPIO interface can be configured as a control signal or as a data signal.
  • the GPIO interface can be used to connect the SOC 201 , camera, display screen, wireless communication module, audio processing module 220 , sensors and so on.
  • the GPIO interface can also be configured as an I2C interface, I2S interface, UART interface, MIPI interface, etc.
  • the interface connection relationship among the modules shown in the embodiment of the present application is only a schematic illustration, and does not constitute a structural limitation of the electronic device 200 .
  • the electronic device 200 may also adopt different interface connection manners in the foregoing embodiments, or a combination of multiple interface connection manners.
  • Both the master PMU 202 and the slave PMU 208 may be referred to as power management modules.
  • the PMUs involved in the embodiments of the present application may be the master PMU 202 or the slave PMU 208 , which are not specifically limited in the embodiments of the present application.
  • the PMU 202 as the main PMU is used as an example for illustration.
  • the main PMU202 can be connected with the power button 206, the charging chip 203 and the SOC201.
  • the main PMU202 is used to receive the input of the battery 207 and/or the charging chip 203, and provide power for the SOC201, internal memory, display screen, camera, and wireless communication module.
  • the main PMU202 can also be used to monitor parameters such as battery capacity, battery cycle times, and battery health status (leakage, impedance).
  • the main PMU 202 can also be used to trigger the electronic device 200 to execute a boot process or wake up the system process when the charge or power button 206 is pressed.
  • the main PMU 202 can also be located in the SOC 201 .
  • the main PMU 202 and the charging chip 203 can also be set in the same device.
  • the charging chip 203 may also be called a charging management module or a charger chip, etc., and the charger chip includes, for example, a Charger IC.
  • the charging chip 203 is used for receiving charging input from the charger (or adapter).
  • the charger may be a wireless charger or a wired charger.
  • the charging chip 203 can receive charging input from a wired charger through the USB interface 204 .
  • the charging chip 203 can receive wireless charging input through a wireless charging coil of the electronic device. While the charging chip 203 is charging the battery 207 , it can also supply power to electronic equipment through the main PMU 202 .
  • the USB interface 204 is an interface that conforms to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, and the like.
  • the USB interface can be used to connect a charger to charge the electronic device 200, and can also be used to transmit data between the electronic device 200 and peripheral devices. It can also be used to connect headphones and play audio through them. This interface can also be used to connect other electronic devices.
  • the power-on key 206 may be a mechanical key, or a touch key.
  • the electronic device 200 may receive a power-on key input to implement a process of starting up or waking up the system.
  • the electronic device 200 can realize the shooting function through the ISP IC205, camera, video codec, graphics processing unit (graphics processing unit, GPU), display screen and application processor.
  • the camera can include a front camera 209, and three rear cameras 210-212, wherein any camera can be integrated with an ISP IC and a switch device in the camera module. It can be understood that the number of cameras and the specific form of the cameras can be adjusted according to actual applications.
  • ISP IC205 is used to process the data obtained by the camera. For example, ISP IC205 can optimize the algorithm for image noise, brightness, and skin color. ISP IC205 can also optimize the exposure, color temperature and other parameters of the shooting scene.
  • the photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor.
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element converts the light signal into an electrical signal
  • the electronics convert the electrical signal into a digital image signal.
  • DSP processes digital image signals. For example, DSP converts digital image signals into standard RGB, YUV and other image signals.
  • ISP IC205 can further optimize the image signal processed by DSP.
  • the electronic device 200 may include 1 or N cameras, where N is a positive integer greater than 1.
  • Digital signal processors are used to process digital signals. In addition to digital image signals, they can also process other digital signals. For example, when the electronic device 200 selects a frequency point, the digital signal processor is used to perform Fourier transform on the energy of the frequency point.
  • Video codecs are used to compress or decompress digital video.
  • the electronic device 200 may support one or more video codecs.
  • the electronic device 200 can play or record videos in various encoding formats, for example: moving picture experts group (moving picture experts group, MPEG) 1, MPEG2, MPEG3, MPEG4 and so on.
  • MPEG moving picture experts group
  • Neural network processor is a neural network (neural-network, NN) computing processor, by referring to the biological neural network structure, such as the transmission mode between human brain neurons, to quickly process input information , but also continuous self-learning.
  • Applications such as intelligent cognition of the electronic device 200 can be implemented through the NPU, such as image recognition, face recognition, speech recognition, text understanding, and the like.
  • the wireless communication function of the electronic device 200 can be realized by the modem 213, the radio frequency chip 214, the antenna 215, the mobile communication module, the wireless communication module, and the baseband processor.
  • the antenna 215 can transmit and receive electromagnetic wave signals based on the radio frequency chip 214 .
  • Each antenna in electronic device 200 may be used to cover single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas.
  • the antenna 215 can be multiplexed as a diversity antenna of a wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.
  • the mobile communication module can provide wireless communication solutions including 2G/3G/4G/5G applied on the electronic device 200 .
  • the mobile communication module may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA) and the like.
  • the mobile communication module can receive electromagnetic waves through the antenna 1, filter and amplify the received electromagnetic waves, and send them to the modem 213 for demodulation.
  • the mobile communication module can also amplify the signal modulated by the modem 213 , and convert it into electromagnetic wave and radiate it through the antenna 1 .
  • at least part of the functional modules of the mobile communication module may be set in the processor.
  • at least part of the functional modules of the mobile communication module and at least part of the modules of the processor may be set in the same device.
  • Modem 213 may include a modulator and a demodulator.
  • the modulator is used for modulating the low-frequency baseband signal to be transmitted into a medium-high frequency signal.
  • the demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator sends the demodulated low-frequency baseband signal to the baseband processor for processing.
  • the low-frequency baseband signal is passed to the application processor after being processed by the baseband processor.
  • the application processor outputs sound signals through audio equipment (not limited to speaker 223, receiver 225, etc.), or displays images or videos through a display screen.
  • modem 213 may be a stand-alone device. In some other embodiments, the modem 213 may be independent of the processor, and be set in the same device as the mobile communication module or other functional modules.
  • the wireless communication module can provide wireless local area networks (wireless local area networks, WLAN) (such as wireless fidelity (Wi-Fi) network), Bluetooth (blue tooth, BT), global navigation satellite System (global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions.
  • the wireless communication module may be one or more devices integrating at least one communication processing module.
  • the wireless communication module receives electromagnetic waves through the antenna, frequency-modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor.
  • the wireless communication module can also receive the signal to be sent from the processor, frequency-modulate it, amplify it, and convert it into electromagnetic wave and radiate it through the antenna.
  • the external memory interface can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 200.
  • the external memory card communicates with the SOC201 through the external memory interface to realize the data storage function. Such as saving music, video and other files in the external memory card.
  • the internal memory may be used to store computer-executable program code, including instructions.
  • the internal memory may include an area for storing programs and an area for storing data.
  • the stored program area can store an operating system, at least one application program required by a function (such as a sound playing function, an image playing function, etc.) and the like.
  • the storage data area can store data created during the use of the electronic device 200 (such as audio data, phonebook, etc.) and the like.
  • the internal memory may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, LPDDR 216, UFS 217, etc.
  • the SOC 201 executes various functional applications and data processing of the electronic device 200 by executing instructions stored in an internal memory and/or instructions stored in a memory provided in a processor.
  • the display screen includes a display panel.
  • the display panel can adopt LCD module 218, organic light emitting diode (organic light-emitting diode, OLED), active matrix organic light emitting diode or active matrix organic light emitting diode (active-matrix organic light emitting diode, AMOLED) , flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro-oLed, quantum dot light-emitting diodes (quantum dot light emitting diodes, QLED), etc.
  • the electronic device 200 may include 1 or N display screens, where N is a positive integer greater than 1.
  • the LCD module 218 can be a touch screen, based on which the LCD module can also receive user's touch operation.
  • the fingerprint module 219 is used for collecting fingerprints.
  • the electronic device 200 can use the collected fingerprint characteristics to implement fingerprint unlocking, access to the application lock, take pictures with the fingerprint, answer calls with the fingerprint, and the like.
  • the electronic device 200 can implement audio functions through the audio processing module 220, the speaker 223, the receiver 225, the microphone 224, the earphone interface, and the application processor. Such as music playback, recording, etc.
  • the audio processing module 220 is used for converting digital audio information into an output analog audio signal, and is also used for converting an input analog audio into a digital audio signal.
  • the audio processing module 220 can also be used to encode and decode audio signals.
  • the audio processing module 220 can be set in the SOC201, or some functional modules of the audio processing module 220 can be set in the SOC201.
  • the speaker 223, also called “horn”, is used to convert audio electrical signals into sound signals.
  • Electronic device 200 can listen to music through speaker 170A, or listen to hands-free calls.
  • the receiver 225 also called “earpiece” is used to convert audio electrical signals into audio signals.
  • the receiver 170B can be placed close to the human ear to receive the voice.
  • the microphone 224 also called “microphone” or “microphone”, is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can approach the microphone 224 to make a sound through the mouth, and input the sound signal to the microphone 224 .
  • the electronic device 200 may be provided with at least one microphone 224 . In other embodiments, the electronic device 200 may be provided with two microphones 224, which may also implement a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 200 can also be provided with three, four or more microphones 224 to collect sound signals, reduce noise, identify sound sources, and realize directional recording functions.
  • the motor 222 can generate a vibrating alert.
  • the motor 222 can be used for incoming call vibration prompts, and can also be used for touch vibration feedback.
  • touch operations applied to different applications may correspond to different vibration feedback effects.
  • touch operations acting on different areas of the display screen the motor 222 can also correspond to different vibration feedback effects.
  • Different application scenarios for example: time reminder, receiving information, alarm clock, games, etc.
  • the touch vibration feedback effect can also support customization.
  • the electronic device 200 may also include various sensors 221 (not shown in the figure) and the like.
  • the embodiment of the present application does not limit the specific structure of the electronic device 200.
  • the electronic device 200 in the embodiment of the present application may further include switch devices SW1 and SW2 (not shown in the figure), and part or all of SW1 or SW2 is also set in the camera module, which will not be repeated here.
  • the ISP IC is arranged in the camera module, and part or all of SW1 or SW2 is also arranged in the camera module, which can save costs, reduce the area of the motherboard, and integrate the ISP IC and the switching device in the camera module.
  • the decoupling of the camera module and the main board can be realized, so that the camera module can be applied to a general-purpose main board, and the same main board can also be compatible with ordinary camera modules and camera modules with pre-processing chip switching channels.
  • connection structure between the camera module and the main board in the embodiment of the present application will be described in detail below with reference to FIGS. 3-7 .
  • FIG. 3 shows a schematic diagram of a connection structure between a camera module and a main board provided by an embodiment of the present application.
  • the camera module 310 and the main board 320 are connected through an FPC330 .
  • the camera module 310 includes an image sensor 311, a BTB312, an ISP IC313, a first switch 314 and a second switch 315.
  • the motherboard 320 includes BTB321 and SOC322.
  • Both ends of the FPC330 can be respectively inserted into the BTB312 and the BTB321 to realize the connection between the camera module 310 and the main board 320 .
  • the embodiment of the present application uses FPC330, BTB312 and BTB321 to realize the connection between the camera module 310 and the main board 320 as an example.
  • the camera module The group 310 and the main board 320 may also be electrically connected in any other manner, which is not specifically limited in this embodiment of the present application.
  • the image or video data collected by the image sensor 311, according to the selection of the first switch 314 and the second switch 315, can be transmitted to the SOC322 by the FPC330 through the path 1, or can be transmitted to the SOC322 by the FPC330 after being processed by the ISP IC313 of the path 2 .
  • the ISP IC313 can be an independent chip, and can also be integrated in the image sensor 311, and the application does not limit the specific implementation of the ISP IC313.
  • the electronic device can control the first switch 314 and the second switch 315 to turn on the path 1, and the image or video data collected by the image sensor 311 is passed through Channel 1 is transmitted from FPC330 to SOC322. If the electronic device is performing steps such as taking pictures or beautifying the video, the electronic device can control the first switch 314 and the second switch 315 to turn on the path 2, and the image or video data collected by the image sensor 311 will pass through the ISP IC313 of the path 2 After processing, it is transmitted to SOC322 by FPC330.
  • both the first switch 314 and the second switch 315 in the camera module 310 are used to realize the switch function of single pole double throw.
  • a SPDT switch can have a moving end and two non-moving ends, and the moving end can switch the connection between the two non-moving ends.
  • the end of the first switch 314 connected to the image sensor 311 is the moving end
  • the end of the first switch 314 connected to the path 1 and the path 2 is the non-moving end.
  • Both the first switch 314 and the second switch 315 can be independent chips.
  • the first switch 314 and/or the second switch 315 can also be integrated in the image sensor 311 , so that the size of the camera module 310 can be reduced through integration.
  • the first switch 314 and/or the second switch 315 can also be implemented by building a circuit with electrical devices.
  • the specific devices of the first switch 314 and the second switch 315 include but are not limited to the following: a single metal oxide semiconductor field effect transistor ( Metal oxide semiconductor field effect transistor, MOSFET), multiple MOSFETs that jointly realize the switching function of single-pole double-throwing, integrated circuits to build circuits that realize the switching function, etc.
  • the MOSFET can be an N-type field effect transistor (negative channel MOS, NMOS), and can also be a P-type field effect transistor (positive channel MOS, NMOS). The implementation is not bound.
  • the SOC 322 can use an interface to receive the data transmitted by the channel 1 or the data transmitted by the channel 2, and through the first switch 314 and the second switch 315, the channel 1 and the channel 2 can be separated.
  • both ends of channel 1 are disconnected from the circuit to avoid radiation caused by any end of channel 1 being connected to the circuit.
  • both ends of path 2 are disconnected from the circuit, so as to avoid the phenomenon of radiation caused by connecting any end of path 2 to the circuit.
  • the second switch 315 can be omitted, but when the second switch 315 is omitted, when the channel 2 is selected to transmit data, the right end of the channel 1 is connected to the SOC322, which will cause one end of the channel 1 to be suspended and the other end to be connected to the circuit, resulting in Similar to the state of the antenna, and then generate radiation, causing interference to the data transmitted by channel 2.
  • an anti-interference module 316 can be set in the channel 1, and the interference caused by the channel 1 when not in use can be suppressed by the anti-interference module 316, so that the second channel can be omitted. switch 315 .
  • an anti-interference module (not shown in the figure) may also be provided in the channel 2 in FIG. 4 to suppress the interference caused by the channel 2 when it is not in use.
  • the anti-jamming module may include devices such as resistors or capacitors, which is not limited in the embodiment of the present application.
  • the cost of the anti-jamming module may be lower than the cost of the second switch 315, and the cost of the anti-jamming module may be further saved through the method shown in FIG. 4 .
  • the data of channel 1 and channel 2 can be connected to the SOC322 through two paths.
  • two interfaces can be used in the SOC322 respectively Receive the data transmitted by channel 1 or the data transmitted by channel 2, because SOC322 can control the logic of disconnecting the circuit and accessing the circuit inside the interface, therefore, through SOC322, when using channel 2 to transmit data, both ends of channel 1 All circuits are disconnected to avoid the phenomenon of radiation caused by connecting any end of channel 1 to the circuit.
  • both ends of path 2 are disconnected from the circuit, so as to avoid the phenomenon of radiation caused by connecting any end of path 2 to the circuit.
  • the second switch may also be arranged on the main board.
  • FIG. 6 shows another schematic diagram of the connection structure between the camera module and the main board provided by the embodiment of the present application.
  • the camera module 410 and the main board 420 are connected through an FPC430 .
  • the camera module 410 includes an image sensor 411, a BTB412, an ISP IC413 and a fourth switch 414.
  • the mainboard 420 includes a BTB421 , an SOC422 and a third switch 423 .
  • Both ends of the FPC430 can be respectively inserted into the BTB412 and the BTB421 to realize the connection between the camera module 410 and the main board 420 .
  • the image or video data collected by the image sensor 411 can be transmitted from the FPC 430 to the main board 420 through the path 3 according to the selection of the fourth switch 414 , and then transmitted to the SOC 422 through one of the third switches 423 .
  • the image or video data collected by the image sensor 411, according to the selection of the fourth switch 414, can also be transmitted to the main board 420 by the FPC430 after being processed by the ISP IC413 of the path 4, and then transmitted to the SOC422 through another path of the third switch 423.
  • the ISP IC413 can be an independent chip, and can also be integrated in the image sensor 411, and the application does not limit the specific implementation of the ISP IC413.
  • the electronic device can control the fourth switch 414 to turn on the channel 3, and the image or video data collected by the image sensor 411 is sent to the FPC430 and the channel 3 via the channel 3.
  • One of the third switches 423 is transmitted to the SOC422. If the electronic equipment performs steps such as taking photos or beautifying video recordings, the electronic equipment can control the fourth switch 414 to conduct the path 4, and the image or video data collected by the image sensor 411 will be processed by the ISP IC413 of the path 4
  • the other channel of the FPC430 and the third switch 423 is transmitted to the SOC422.
  • both the fourth switch 414 and the third switch 423 in the camera module 410 are used to realize the single pole double throw switching function.
  • Both the fourth switch 414 and the third switch 423 may be independent chips.
  • the fourth switch 414 can be integrated in the image sensor 411 , so that the size of the camera module 410 can be reduced through integration.
  • the third switch 423 can be integrated in the SOC422, so that the size of the SOC422 can be reduced through integration.
  • the channel 3 and the channel 4 can be used in time-sharing, and when the channel 4 is used to transmit data, both ends of the channel 3 are disconnected from the circuit, so as to avoid the Connecting either end to a circuit results in radiation. Similarly, when using path 3 to transmit data, both ends of path 4 are disconnected from the circuit, so as to avoid the phenomenon of radiation caused by connecting any end of path 4 to the circuit.
  • FIG. 7 shows a schematic diagram of the connection structure between the camera module and the motherboard when the third switch and the ISP IC are integrated in the image sensor, and the fourth switch is integrated in the SOC.
  • the camera module 510 and the main board 520 are connected through an FPC530 .
  • the camera module 510 includes an image sensor 511 , a BTB 512 , an ISP block (block) 513 and a stack (buffer) 514 .
  • the main board 520 includes BTB521 and SOC522.
  • the image sensor 511, the BTB 512, the ISP block 513, and the stack 514 can be integrated together.
  • the integrated devices may also be collectively referred to as an image sensor or a camera, which is not specifically limited in this embodiment of the present application.
  • Both ends of the FPC530 can be respectively inserted into the BTB512 and the BTB521 to realize the connection between the camera module 510 and the main board 520 .
  • the image or video data collected by the image sensor 511 can be stored in the stack 514 in RAW format, and transmitted to the SOC 522 of the main board 520 by the FPC 530 .
  • the image or video data collected by the image sensor 511 can also be stored in the stack 514 after being processed by the ISP, and transmitted to the SOC 522 of the main board 520 by the FPC 530 .
  • the switching device is integrated in the image sensor 511 and the SOC 522 respectively, so the switching device is not shown in FIG. 7 , but the data collected by the image sensor 511 in FIG. 7 is still similar to that in FIG. 6
  • FIG. 8 shows a schematic diagram of the internal structure of the SOC of the electronic device.
  • the SOC can include camera interface 0-camera interface 3, image processing (image process) DSP, video stack (video buffer), video encoder (video codec) and file system (file system).
  • image processing image process
  • DSP digital signal processor
  • video stack video buffer
  • video encoder video codec
  • file system file system
  • the camera interface 0-camera interface 3 are used to connect the camera module. It can be understood that the embodiment of the present application is described by taking the electronic device including four camera modules as an example, so the camera interface includes four. In a possible implementation, the electronic device can include N camera modules, and the number of camera interfaces It may also be N, where N is a natural number.
  • the video data collected by each camera can be transmitted to the DSP for processing through the camera interface.
  • the processed data can be divided into two channels for output.
  • the processed data can be set in the video stack to form a preview video, which supports displaying Displayed in the channel (display panel), it can be understood that the processed data of this channel may be data that has not been processed by the ISP such as channel 1 or channel 3 in the above embodiment.
  • the processed data can be processed by the video encoder and the file system to form a shooting file and stored in UFS.
  • the processed data in this way can be the ISP-processed data such as channel 2 or channel 4 in the above embodiment. data.
  • connection methods between the camera modules of the electronic device and the SOC may not be uniform, or it may be understood that the electronic device may include any one of Figures 1, 3-7 or Various connection methods.
  • the connection method between the camera module where the front camera 209 of the electronic device 200 is located and the SOC can be as shown in FIG. 1 .
  • the camera module where the front camera 209 of the electronic device 200 is located Refer to the description in Figure 1 for the devices included in the SOC.
  • the connection mode between the camera module where the rear camera 210 of the electronic device 200 is located and the SOC can be connected as shown in Figure 3.
  • the device contained in the camera module where the rear camera 210 of the electronic device 200 is located and the SOC can refer to Figure 3 records.
  • the connection mode between the camera module where the rear camera 211 of the electronic device 200 is located and the SOC can be connected as shown in Figure 4.
  • the device contained in the camera module where the rear camera 211 of the electronic device 200 is located and the SOC can refer to Figure 4. records.
  • the connection mode between the camera module where the rear camera 212 of the electronic device 200 is located and the SOC can be connected as shown in FIG. records.
  • connection relationship between the camera module and the SOC where each camera of the electronic device 200 is located can be arbitrarily selected in Fig. 1, Fig. 3, Fig. 4, Fig. 5, Fig. 6 or Fig. 7, any two or more cameras
  • connection relationship between the modules and the SOC may be the same or different, which is not specifically limited in this embodiment of the present application.
  • the ISP IC is arranged in the camera module, and part or all of the switching devices are also arranged in the camera module, which can save costs, reduce the area of the motherboard, and integrate the ISP IC and the switching devices in the camera module.
  • the decoupling of the camera module and the main board can be realized, so that the camera module can be applied to a general-purpose main board, and the same main board can also be compatible with ordinary camera modules and camera modules with pre-processing chip switching channels , to improve the versatility of the motherboard.
  • the electronic device in this embodiment of the present application may be a device capable of processing various image data signals, for example, a handheld device with a wireless connection function, a vehicle-mounted device, and the like.
  • some terminals are: mobile phone (mobile phone), tablet computer, notebook computer, palmtop computer, mobile internet device (mobile internet device, MID), wearable device, virtual reality (virtual reality, VR) device, augmented reality (augmented reality, AR) equipment, wireless terminals in industrial control, wireless terminals in self driving, wireless terminals in remote medical surgery, smart grid Wireless terminals in transportation safety, wireless terminals in smart city, wireless terminals in smart home, cellular phones, cordless phones, session initiation protocol , SIP) telephone, wireless local loop (wireless local loop, WLL) station, personal digital assistant (personal digital assistant, PDA), handheld device with wireless communication function, computing device or other processing device connected to a wireless modem, vehicle Devices, wearable devices, electronic devices in a 5G network or electronic devices in a future evolving public land mobile network (PLMN),
  • the electronic device may also be a wearable device.
  • Wearable devices can also be called wearable smart devices, which is a general term for the application of wearable technology to intelligently design daily wear and develop wearable devices, such as glasses, gloves, watches, clothing and shoes.
  • a wearable device is a portable device that is worn directly on the body or integrated into the user's clothing or accessories. Wearable devices are not only a hardware device, but also achieve powerful functions through software support, data interaction, and cloud interaction.
  • Generalized wearable smart devices include full-featured, large-sized, complete or partial functions without relying on smart phones, such as smart watches or smart glasses, etc., and only focus on a certain type of application functions, and need to cooperate with other devices such as smart phones Use, such as various smart bracelets and smart jewelry for physical sign monitoring.
  • the electronic device can also be an electronic device in the Internet of Things (IoT) system.
  • IoT Internet of Things
  • IoT is an important part of the future development of information technology, and its main technical feature is that items can be Connect with the network to realize the intelligent network of man-machine interconnection and object interconnection.
  • the electronic equipment in the embodiment of the present application may also be referred to as: user equipment (user equipment, UE), mobile station (mobile station, MS), mobile terminal (mobile terminal, MT), access terminal, subscriber unit, subscriber station, Mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent or user device, etc.
  • user equipment user equipment
  • MS mobile station
  • MS mobile terminal
  • MT mobile terminal
  • access terminal subscriber unit, subscriber station, Mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent or user device, etc.
  • the electronic device or each network device includes a hardware layer, an operating system layer running on the hardware layer, and an application layer running on the operating system layer.
  • the hardware layer includes hardware such as a central processing unit (CPU), a memory management unit (MMU), and memory (also called main memory).
  • the operating system may be any one or more computer operating systems that implement business processing through processes, for example, Linux operating system, Unix operating system, Android operating system, iOS operating system, or windows operating system.
  • the application layer includes applications such as browsers, address books, word processing software, and instant messaging software.
  • FIG. 9 shows a schematic structural diagram of a specific electronic device.
  • the electronic device may include a processor 110, an internal memory 121, a universal serial bus (universal serial bus, USB) interface, a charging management module 140, a power management module 141, an antenna 1, an antenna 2, a mobile communication module 150, and a wireless communication module 160 , an audio module 170, a speaker 170A, a receiver 170B, a sensor module 180, a button 190, an indicator 192, a camera 193, and a display screen 194, etc.
  • a processor 110 an internal memory 121, a universal serial bus (universal serial bus, USB) interface, a charging management module 140, a power management module 141, an antenna 1, an antenna 2, a mobile communication module 150, and a wireless communication module 160 , an audio module 170, a speaker 170A, a receiver 170B, a sensor module 180, a button 190, an indicator 192, a camera 193, and a display screen 194, etc.
  • USB universal serial bus
  • the sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, an inductance sensor 180F, a proximity light sensor 180G, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, bone Conductivity sensor 180M etc.
  • the structure shown in the embodiment of the present application does not constitute a specific limitation on the electronic device.
  • the electronic device may include more or fewer components than shown in the illustrations, or combine certain components, or separate certain components, or arrange different components.
  • the illustrated components can be realized in hardware, software or a combination of software and hardware.
  • Processor 110 may include one or more processing units. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.
  • a memory may also be provided in the processor 110 for storing instructions and data.
  • the charging management module 140 is configured to receive a charging input from a charger.
  • the charger may be a wireless charger or a wired charger.
  • the power management module 141 is used for connecting the charging management module 140 and the processor 110 .
  • the wireless communication function of the electronic device can be realized by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.
  • Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals.
  • Antennas in electronic devices can be used to cover single or multiple communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization.
  • the mobile communication module 150 can provide wireless communication solutions including 2G/3G/4G/5G applied to electronic devices.
  • the mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA) and the like.
  • the mobile communication module 150 can receive electromagnetic waves through the antenna 1, filter and amplify the received electromagnetic waves, and send them to the modem processor for demodulation.
  • the wireless communication module 160 can provide a wireless communication solution applied to electronic devices.
  • the electronic device realizes the display function through the GPU, the display screen 194, and the application processor.
  • the GPU is a microprocessor for image processing, and is connected to the display screen 194 and the application processor. GPUs are used to perform mathematical and geometric calculations for graphics rendering.
  • the display screen 194 is used to display images, videos and the like.
  • the display screen 194 includes a display panel.
  • the electronic device may include 1 or N display screens 194, where N is a positive integer greater than 1.
  • the electronic device can realize the shooting function through ISP, camera 193 , video codec, GPU, display screen 194 and application processor.
  • Camera 193 is used to capture still images or video.
  • the electronic device may include 1 or N cameras 193, where N is a positive integer greater than 1.
  • the internal memory 121 may be used to store computer-executable program codes including instructions.
  • the internal memory 121 may include an area for storing programs and an area for storing data.
  • the electronic device can implement audio functions through the audio module 170, the speaker 170A, the receiver 170B, and the application processor. Such as music playback, recording, etc.

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Abstract

本申请实施例提供电子设备和摄像头模组，涉及终端技术领域。本申请实施例中，将图像信号处理集成电路和第一开关设置在摄像头模组中，第一开关可以在摄像头与两个通路间实现单刀双掷的功能，使得经过第一开关的切换，摄像头采集的图像数据可以在第一通路中直接传输到处理器，或者摄像头采集的图像数据在第二通路中经过图像信号处理集成电路处理后传输到处理器，因为摄像头模组的工艺复杂度低，将图像信号处理集成电路和第一开关设置在摄像头模组所需的成本相对较低，因此能降低电子设备的成本。

Description

电子设备和摄像头模组
本申请要求于2021年07月26日提交中国国家知识产权局、申请号为202110846782.0、申请名称为“电子设备和摄像头模组”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端技术领域，尤其涉及一种电子设备和摄像头模组。
背景技术
随着终端技术的发展，摄像头在电子设备中得到越来越多的应用。电子设备可以对摄像头采集的图像或视频数据进行处理，实现图像或视频的显示和存储等。
电子设备对摄像头采集的图像或视频数据进行处理时，可以在电子设备的主板上增加预处理芯片，通过预处理芯片对图像或视频数据进行优化。
但是，在电子设备的主板上设置预处理芯片的方式会导致主板的面积较大，成本较高。
发明内容
本申请实施例提供一种电子设备和摄像头模组，以减少预处理芯片对主板面积的占用，降低成本。
第一方面，本申请实施例提供一种电子设备，包括：主板和摄像头模组；其中，摄像头模组包括摄像头、图像信号处理集成电路和第一开关；主板中设置有处理器；摄像头，用于采集图像数据；图像信号处理集成电路，用于处理摄像头采集的图像数据；第一开关为实现单刀双掷功能的开关，具体用于实现摄像头向第一通路或第二通路的切换；第一通路为将摄像头采集的图像数据传输到处理器的通路，第二通路为将摄像头采集的图像数据经过图像信号处理集成电路处理后传输到处理器的通路；处理器，用于处理来自第一通路的数据或者来自第二通路的数据。
本申请实施例中，将图像信号处理集成电路和第一开关设置在摄像头模组中，第一开关可以在摄像头与两个通路间实现单刀双掷的功能，使得经过第一开关的切换，摄像头采集的图像数据可以在第一通路中直接传输到处理器，或者摄像头采集的图像数据在第二通路中经过图像信号处理集成电路处理后传输到处理器，因为摄像头模组的工艺复杂度低，将图像信号处理集成电路和第一开关设置在摄像头模组所需的成本相对较低，因此能降低电子设备的成本。例如，摄像头模组的板材工艺可以在6层左右，各层中的器件较少，线路布局较简单，且通常在摄像头模组中可以存在空置区域，将图像信号处理集成电路和第一开关设置在摄像头模组中，对摄像头模组的制造工艺不会造成太大的难度，且具体实现中，还可以将图像信号处理集成电路和第一开关设置在摄像头模组的空置区域，或集成在摄像头模组的摄像头中，可以实现增加器件的 同时不增加摄像头模组面积。
可能的设计中，处理器采用同一个接口接收来自第一通路的数据或者来自第二通路的数据。这样可以减少对处理器接口的占用。
可能的设计中，摄像头模组还包括第二开关；第二开关为实现单刀双掷的开关，具体用于在摄像头模组中实现处理器向第一通路或第二通路的切换；第一开关的动端与摄像头连接，第一开关的其中一个不动端与第一通路的一端连接，第一开关的另一个不动端与第二通路的一端连接；第二开关的动端与处理器连接，第二开关的其中一个不动端与第一通路的另一端连接，第二开关的另一个不动端与第二通路的另一端连接；其中，第一开关和第二开关，用于在摄像头采集的图像数据经过第一通路传输时，导通第一通路在电路中的连接，以及断开第二通路在电路中的连接；或者，在摄像头采集的图像数据经过第二通路传输时，导通第二通路在电路中的连接，以及断开第一通路在电路中的连接。这样可以降低第一通路或第二通路在断开电路是产生的辐射。
可能的设计中，摄像头模组的第一通路和/或第二通路中设置有抗干扰模块，第一通路的输出端和第二通路的输出端在摄像模组中连接。这样，可以节约开关数量，进一步降低成本。
可能的设计中，主板中还包括第三开关；第三开关为实现单刀双掷的开关，具体用于在主板中实现处理器向第一通路或第二通路的切换；第一开关的动端与摄像头连接，第一开关的其中一个不动端与第一通路的一端连接，第一开关的另一个不动端与第二通路的一端连接；第一通路与第二通路分别通过各自的路径连接到主板；第三开关的动端与处理器连接，第三开关的其中一个不动端与第一通路连接到主板的端连接，第三开关的另一个不动端与第二通路连接到主板的端连接；其中，第一开关和第三开关，用于在摄像头采集的图像数据经过第一通路传输时，导通第一通路在电路中的连接，以及断开第二通路在电路中的连接；或者，在摄像头采集的图像数据经过第二通路传输时，导通第二通路在电路中的连接，以及断开第一通路在电路中的连接。这样可以降低第一通路或第二通路在断开电路是产生的辐射。
可能的设计中，处理器采用两个接口分别接收来自第一通路的数据或者来自第二通路的数据。这样可以节约开关数量，进一步降低成本。
可能的设计中，摄像头模组设置在电子设备中时，摄像头模组的四周设置金属屏蔽。这样可以减少摄像头模组对电子设备其他器件的辐射或干扰。
可能的设计中，摄像头模组与主板采用柔性印刷电路板FPC连接，摄像头模组和主板中均设置板对板连接器BTB，BTB用于FPC的接入。
其中，第一通路可以对应于具体实施例部分中的通路1或通路3，第二通路可以对应于具体实施例部分中的通路2或通路4。
第一开关可以对应于具体实施例部分中的第一开关和第四开关。
第二方面，本申请实施例通过一种摄像头模组，摄像头模组包括摄像头、图像信号处理集成电路和第一开关；摄像头，用于采集图像数据；图像信号处理集成电路，用于处理摄像头采集的图像数据；第一开关为实现单刀双掷功能的开关，具体用于实现摄像头向第一通路或第二通路的切换；第一通路为将摄像头采集的图像数据传输到主板的处理器的通路，第二通路为将摄像头采集的图像数据经过图像信号处理集成电 路处理后传输到处理器的通路。
可能的设计中，摄像头模组还包括第二开关；第二开关为实现单刀双掷的开关，具体用于在摄像头模组中实现处理器向第一通路或第二通路的切换；第一开关的动端与摄像头连接，第一开关的其中一个不动端与第一通路的一端连接，第一开关的另一个不动端与第二通路的一端连接；第二开关的动端与处理器连接，第二开关的其中一个不动端与第一通路的另一端连接，第二开关的另一个不动端与第二通路的另一端连接；其中，第一开关和第二开关，用于在摄像头采集的图像数据经过第一通路传输时，导通第一通路在电路中的连接，以及断开第二通路在电路中的连接；或者，在摄像头采集的图像数据经过第二通路传输时，导通第二通路在电路中的连接，以及断开第一通路在电路中的连接。
可能的设计中，摄像头模组的第一通路和/或第二通路中设置有抗干扰模块，第一通路的输出端和第二通路的输出端在摄像模组中连接。
可能的设计中，摄像头模组设置在电子设备中时，摄像头模组的四周设置金属屏蔽。
第二方面以及第二方面的可能的设计中，效果与第一方面以及第二方面的可能的设计中的效果类似，在此不再赘述。
附图说明
图1为可能的实现中提供的一种摄像头模组与主板连接的结构示意图；
图2为本申请实施例提供的一种电子设备结构示意图；
图3为本申请实施例提供的一种摄像头模组与主板连接的结构示意图；
图4为本申请实施例提供的一种摄像头模组与主板连接的结构示意图；
图5为本申请实施例提供的一种摄像头模组与主板连接的结构示意图；
图6为本申请实施例提供的一种摄像头模组与主板连接的结构示意图；
图7为本申请实施例提供的一种摄像头模组与主板连接的结构示意图；
图8为本申请实施例提供的一种SOC结构示意图；
图9为本申请实施例提供的一种电子设备结构示意图。
具体实施方式
本文中的术语“多个”是指两个或两个以上。本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系；在公式中，字符“/”，表示前后关联对象是一种“相除”的关系。
可以理解的是，在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分，并不用来限制本申请的实施例的范围。
可以理解的是，在本申请的实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请的实施例的实施过程构成任何限定。
随着终端技术的发展，用户对于电子设备的功能需求也越发多样化。为了满足用户的拍照需求，较多电子设备支持拍照功能，且伴随着电子设备的拍摄能力的提升，电子设备已经成为人们拍摄照片或视频的重要工具。
在拍摄时，用户可以触发电子设备的拍照或录像功能，电子设备利用摄像头采集图像或视频数据，并进一步通过预处理芯片对图像或视频进行优化，例如，电子设备可以通过预处理芯片对图像或视频数据进行补光、美化或去毛刺等优化操作。其中，预处理芯片例如包括：图像信号处理(image signal processor，ISP)集成电路(integrated circuit，IC)等。
可能的实现中，预处理芯片设置在电子设备的主板(main board)中，摄像头设置在摄像头模组(camera module)中，摄像头模组中采集的图像或视频数据可以传输到主板中的预处理芯片，预处理芯片进一步对图像或视频数据进行处理。
示例性的，图1示出了一种摄像头模组与主板连接的结构示意图。
如图1所示，摄像头模组110和主板120通过柔性印刷电路板(flexible printed circuit，FPC)130连接。其中，摄像头模组110中包括图像传感器111(image sensor)和板对板连接器(board to board connectors，BTB)112，图像传感器也可以称为摄像头。主板120包括ISP IC121、系统级芯片(system on chip，SOC)122、BTB123、开关SW1以及开关SW2。
FPC130的两端可以分别插入在BTB112和BTB123中。SW1和SW2均可以为单刀双掷开关。图像传感器111采集的图像或视频数据，经过FPC130传输到主板后，根据SW1和SW2的选择，可以经由通路1直接传输到SOC122，也可以经由通路2的ISP IC121的处理后再传输到SOC122。
示例性的，如果电子设备执行的是图像预览或者无美化录像等的步骤时，电子设备可以控制SW1和SW2导通通路1，图像传感器111采集的图像或视频数据，经过FPC130传输到主板后，经由通路1直接传输到SOC122。如果电子设备执行的是拍照或有美化录像等的步骤时，电子设备可以控制SW1和SW2导通通路2，图像传感器111采集的图像或视频数据，经过FPC130传输到主板后，经由通路2的ISP IC121的处理后再传输到SOC122。
但是，电子设备中，主板的工艺复杂度通常较高，成本也较高。例如，主板的板材工艺可能达到12层左右，各层中的器件较多，线路布局较复杂，在主板中设置ISP IC、SW1和SW2，不仅会增大主板的面积，提升主板成本，还会提升主板的线路复杂度，对主板的制造工艺提出更高的要求，这样会进一步提升主板成本。
基于此，本申请实施例中，将ISP IC设置在摄像头模组中，SW1或SW2的部分或全部也设置在摄像头模组中。因为摄像头模组的工艺复杂度低，成本相对较低，例如，摄像头模组的板材工艺可以在6层左右，各层中的器件较少，线路布局较简单，且通常在摄像头模组中可以存在空置区域，将ISP IC设置在摄像头模组中，SW1或SW2的部分或全部也设置在摄像头模组中，对摄像头模组的制造工艺不会造成太大的难度，且具体实现中，还可以将ISP IC、SW1和/或SW2设置在摄像头模组的空置区域，可以实现增加器件的同时不增加摄像头模组面积。
因此，相较于在主板中设置ISP IC、SW1和SW2的实现方式，将ISP IC、SW1 和/或SW2设置在摄像头模组的实现方式，可以节约成本，降低主板面积。且将ISP IC以及开关器件集成在摄像头模组中，可以实现摄像头模组与主板解耦，使得摄像头模组能应用于通用性的主板，也可以使同一种主板兼容普通摄像头模组和带有预处理芯片切换通路的摄像头模组，提升主板的通用性。
进一步的，在电子设备的组装中，可以在摄像头模组的四周增加金属屏蔽，从而可以降低摄像头采集的信号被干扰的可能性。其中，金属屏蔽可以是金属围成的闭合区域，例如，摄像头模组四周的金属屏蔽，可以为围绕摄像头模组一周设置的金属片。可以理解的是，金属围成的闭合区域可以类似于栅栏的不封顶区域，也可以是完全闭合的区域，本申请实施例不作具体限定。
示例性的，图2提供了本申请实施例的一种电子设备的结构示意图。
如图2所示，电子设备200可以包括：系统级芯片(system on chip，SOC)201、主电源管理单元(master power management unit，master PMU)IC202、充电芯片203、通用串行总线(universal serial bus，USB)接口(connector)204、开机键(power on key)206、电池(battery)207、从PMU IC(slave PMU IC)208、前置摄像头(front camera)209、后置摄像头(rear camera)210、ISP IC205、后置摄像头211、后置摄像头212、调制解调器(modem)213、射频(radio frequency，RF)IC214、天线(antenna)215、低功耗内存(low power double data rate，LPDDR)216、通用闪存存储(universal flash storage，UFS)217、触摸面板(touch panel)/液晶显示器(liquid crystal display，LCD)模组218、指纹模组(fingerprint module)219、音频处理模块(audio codec)220、传感器(sensor)221、马达(motor)222、扬声器(speaker)223、麦克风(MIC)224、受话器(receiver)225。
需要说明的是，本申请实施例的ISP IC205与后置摄像头210可以集成在摄像头模组中，这样可以节约成本，降低主板面积。可以理解的是，前置摄像头209、后置摄像头211以及后置摄像头212的部分或全部也可以分别与对应的ISP IC集成在各自的摄像头模组中(图中未示出)，本申请实施例对摄像头的数量，以及摄像头模组的具体形式不作限定。
可以理解的是，本申请实施例示意的结构并不构成对电子设备200的具体限定。在本申请另一些实施例中，电子设备200可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
其中，SOC201可以为处理器，SOC201可以包括一个或多个处理单元，例如：SOC201可以包括应用处理器(application processor，AP)，调制解调器213，图形处理器(graphics processing unit，GPU)，控制器，视频编解码器，数字信号处理器(digital signal processor，DSP)，基带处理器，和/或神经网络处理器(neural-network processing unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。
SOC201中可以设置控制器，控制器可以根据指令操作码和时序信号，产生操作控制信号，完成取指令和执行指令的控制。
SOC201中还可以设置存储器，用于存储指令和数据。在一些实施例中，SOC201 中的存储器为高速缓冲存储器。该存储器可以保存SOC201刚用过或循环使用的指令或数据。如果SOC201需要再次使用该指令或数据，可从所述存储器中直接调用。避免了重复存取，减少了SOC201的等待时间，因而提高了系统的效率。
在一些实施例中，SOC201可以包括一个或多个接口。接口可以包括集成电路(inter-integrated circuit，I2C)接口，集成电路内置音频(inter-integrated circuit sound，I2S)接口，脉冲编码调制(pulse code modulation，PCM)接口，通用异步收发传输器(universal asynchronous receiver/transmitter，UART)接口，移动产业处理器接口(mobile industry processor interface，MIPI)，通用输入输出(general-purpose input/output，GPIO)接口，和/或用户标识模块(subscriber identity module，SIM)接口等。
I2C接口是一种双向同步串行总线，包括一根串行数据线SDA和一根串行时钟线(derail clock line，SCL)。在一些实施例中，SOC201可以包含多组I2C总线。SOC201可以通过不同的I2C总线接口分别耦合触摸传感器，充电器，闪光灯，摄像头等。例如：SOC201可以通过I2C接口耦合触摸传感器，使SOC201与触摸传感器通过I2C总线接口通信，实现电子设备200的触摸功能。
I2S接口可以用于音频通信。在一些实施例中，SOC201可以包含多组I2S总线。SOC201可以通过I2S总线与音频处理模块220耦合，实现SOC201与音频处理模块220之间的通信。在一些实施例中，音频处理模块220可以通过I2S接口向无线通信模块传递音频信号，实现通过蓝牙耳机接听电话的功能。
PCM接口也可以用于音频通信，将模拟信号抽样，量化和编码。在一些实施例中，音频处理模块220与无线通信模块可以通过PCM总线接口耦合。在一些实施例中，音频处理模块220也可以通过PCM接口向无线通信模块传递音频信号，实现通过蓝牙耳机接听电话的功能。所述I2S接口和所述PCM接口都可以用于音频通信。
UART接口是一种通用串行数据总线，用于异步通信。该总线可以为双向通信总线。它将要传输的数据在串行通信与并行通信之间转换。在一些实施例中，UART接口通常被用于连接SOC201与无线通信模块。例如：SOC201通过UART接口与无线通信模块中的蓝牙模块通信，实现蓝牙功能。在一些实施例中，音频处理模块220可以通过UART接口向无线通信模块传递音频信号，实现通过蓝牙耳机播放音乐的功能。
MIPI接口可以被用于连接SOC201与显示屏，摄像头等外围器件。MIPI接口包括摄像头串行接口(camera serial interface，CSI)，显示屏串行接口(display serial interface，DSI)等。在一些实施例中，SOC201和摄像头通过CSI接口通信，实现电子设备200的拍摄功能。SOC201和显示屏通过DSI接口通信，实现电子设备200的显示功能。
GPIO接口可以通过软件配置。GPIO接口可以被配置为控制信号，也可被配置为数据信号。在一些实施例中，GPIO接口可以用于连接SOC201，摄像头，显示屏，无线通信模块，音频处理模块220，传感器等。GPIO接口还可以被配置为I2C接口，I2S接口，UART接口，MIPI接口等。
可以理解的是，本申请实施例示意的各模块间的接口连接关系，只是示意性说明，并不构成对电子设备200的结构限定。在本申请另一些实施例中，电子设备200也可以采用上述实施例中不同的接口连接方式，或多种接口连接方式的组合。
主PMU202和从PMU208均可以称为电源管理模块，本申请实施例以中涉及的PMU可以是主PMU202，也可以是从PMU208，本申请实施例不作具体限定。为了便于描述，本申请实施例中以PMU为主PMU202进行示例说明。
主PMU202可以连接开机键206，充电芯片203与SOC201。主PMU202用于接收电池207和/或充电芯片203的输入，为SOC201，内部存储器，显示屏，摄像头，和无线通信模块等供电。主PMU202还可以用于监测电池容量，电池循环次数，电池健康状态(漏电，阻抗)等参数。主PMU202还可以用于在充电或开机键206按下时，触发电子设备200执行开机流程或唤醒系统流程。在一些实施例中，主PMU202也可以设置于SOC201中。在另一些实施例中，主PMU202和充电芯片203也可以设置于同一个器件中。
充电芯片203也可以称为充电管理模块或充电器芯片等，充电器芯片例如包括Charger IC。充电芯片203用于从充电器(或称适配器)接收充电输入。其中，充电器可以是无线充电器，也可以是有线充电器。在一些有线充电的实施例中，充电芯片203可以通过USB接口204接收有线充电器的充电输入。在一些无线充电的实施例中，充电芯片203可以通过电子设备的无线充电线圈接收无线充电输入。充电芯片203为电池207充电的同时，还可以通过主PMU202为电子设备供电。
USB接口204是符合USB标准规范的接口，具体可以是Mini USB接口，Micro USB接口，USB Type C接口等。USB接口可以用于连接充电器为电子设备200充电，也可以用于电子设备200与外围设备之间传输数据。也可以用于连接耳机，通过耳机播放音频。该接口还可以用于连接其他电子设备。
开机键206可以是机械按键，也可以是触摸式按键。电子设备200可以接收开机键输入，实现开机或唤醒系统流程。
电子设备200可以通过ISP IC205，摄像头，视频编解码器，图形处理器(graphics processing unit，GPU)，显示屏以及应用处理器等实现拍摄功能。摄像头可以包括前置摄像头209，以及三个后置摄像头210-212，其中，任一个摄像头可以与ISP IC以及开关器件集成在摄像头模组中。可以理解的是，摄像头的数量，以及摄像头的具体形式可以根据实际应用进行调整。
ISP IC205用于处理摄像头获取的数据。例如，ISP IC205可以对图像的噪点，亮度，肤色进行算法优化。ISP IC205还可以对拍摄场景的曝光，色温等参数优化。
摄像头用于捕获静态图像或视频。物体通过镜头生成光学图像投射到感光元件。感光元件可以是电荷耦合器件(charge coupled device，CCD)或互补金属氧化物半导体(complementary metal-oxide-semiconductor，CMOS)光电晶体管。感光元件把光信号转换成电信号，之后电子设备将电信号转换成数字图像信号。DSP对数字图像信号加工处理。例如，DSP将数字图像信号转换成标准的RGB，YUV等格式的图像信号。进一步的，ISP IC205可以对DSP处理后的图像信号进一步优化。在一些实施例中，电子设备200可以包括1个或N个摄像头，N为大于1的正整数。
数字信号处理器用于处理数字信号，除了可以处理数字图像信号，还可以处理其他数字信号。例如，当电子设备200在频点选择时，数字信号处理器用于对频点能量进行傅里叶变换等。
视频编解码器用于对数字视频压缩或解压缩。电子设备200可以支持一种或多种视频编解码器。这样，电子设备200可以播放或录制多种编码格式的视频，例如：动态图像专家组(moving picture experts group，MPEG)1，MPEG2，MPEG3，MPEG4等。
神经网络处理器(neural-network processing unit，NPU)为神经网络(neural-network，NN)计算处理器，通过借鉴生物神经网络结构，例如借鉴人脑神经元之间传递模式，对输入信息快速处理，还可以不断的自学习。通过NPU可以实现电子设备200的智能认知等应用，例如：图像识别，人脸识别，语音识别，文本理解等。
电子设备200的无线通信功能可以通过调制解调器213、射频芯片214、天线215、移动通信模块，无线通信模块，以及基带处理器等实现。
天线215可以基于射频芯片214实现发射和接收电磁波信号。电子设备200中的每个天线可用于覆盖单个或多个通信频带。不同的天线还可以复用，以提高天线的利用率。例如：可以将天线215复用为无线局域网的分集天线。在另外一些实施例中，天线可以和调谐开关结合使用。
移动通信模块可以提供应用在电子设备200上的包括2G/3G/4G/5G等无线通信的解决方案。移动通信模块可以包括至少一个滤波器，开关，功率放大器，低噪声放大器(low noise amplifier，LNA)等。移动通信模块可以由天线1接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调器213进行解调。移动通信模块还可以对经调制解调器213调制后的信号放大，经天线1转为电磁波辐射出去。在一些实施例中，移动通信模块的至少部分功能模块可以被设置于处理器中。在一些实施例中，移动通信模块的至少部分功能模块可以与处理器的至少部分模块被设置在同一个器件中。
调制解调器213可以包括调制器和解调器。其中，调制器用于将待发送的低频基带信号调制成中高频信号。解调器用于将接收的电磁波信号解调为低频基带信号。随后解调器将解调得到的低频基带信号传送至基带处理器处理。低频基带信号经基带处理器处理后，被传递给应用处理器。应用处理器通过音频设备(不限于扬声器223，受话器225等)输出声音信号，或通过显示屏显示图像或视频。在一些实施例中，调制解调器213可以是独立的器件。在另一些实施例中，调制解调器213可以独立于处理器，与移动通信模块或其他功能模块设置在同一个器件中。
无线通信模块可以提供应用在电子设备200上的包括无线局域网(wireless local area networks，WLAN)(如无线保真(wireless fidelity，Wi-Fi)网络)，蓝牙(blue tooth，BT)，全球导航卫星系统(global navigation satellite system，GNSS)，调频(frequency modulation，FM)，近距离无线通信技术(near field communication，NFC)，红外技术(infrared，IR)等无线通信的解决方案。无线通信模块可以是集成至少一个通信处理模块的一个或多个器件。无线通信模块经由天线接收电磁波，将电磁波信号调频以及滤波处理，将处理后的信号发送到处理器。无线通信模块还可以从处理器接收待发送的信号，对其进行调频，放大，经天线转为电磁波辐射出去。
外部存储器接口可以用于连接外部存储卡，例如Micro SD卡，实现扩展电子设备200的存储能力。外部存储卡通过外部存储器接口与SOC201通信，实现数据存储功能。例如将音乐，视频等文件保存在外部存储卡中。
内部存储器可以用于存储计算机可执行程序代码，所述可执行程序代码包括指令。内部存储器可以包括存储程序区和存储数据区。其中，存储程序区可存储操作系统，至少一个功能所需的应用程序(比如声音播放功能，图像播放功能等)等。存储数据区可存储电子设备200使用过程中所创建的数据(比如音频数据，电话本等)等。此外，内部存储器可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件，闪存器件，LPDDR 216，UFS217等。SOC201通过运行存储在内部存储器的指令，和/或存储在设置于处理器中的存储器的指令，执行电子设备200的各种功能应用以及数据处理。
显示屏用于显示图像，视频等。显示屏包括显示面板。显示面板可以采用LCD模组218，有机发光二极管(organic light-emitting diode，OLED)，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light emitting diode的，AMOLED)，柔性发光二极管(flex light-emitting diode，FLED)，Miniled，MicroLed，Micro-oLed，量子点发光二极管(quantum dot light emitting diodes，QLED)等。在一些实施例中，电子设备200可以包括1个或N个显示屏，N为大于1的正整数。LCD模组218可以为触摸屏，基于LCD模组也可以接收用户的触摸操作。
指纹模组219用于采集指纹。电子设备200可以利用采集的指纹特性实现指纹解锁，访问应用锁，指纹拍照，指纹接听来电等。
电子设备200可以通过音频处理模块220，扬声器223，受话器225，麦克风224，耳机接口，以及应用处理器等实现音频功能。例如音乐播放，录音等。
音频处理模块220用于将数字音频信息转换成模拟音频信号输出，也用于将模拟音频输入转换为数字音频信号。音频处理模块220还可以用于对音频信号编码和解码。在一些实施例中，音频处理模块220可以设置于SOC201中，或将音频处理模块220的部分功能模块设置于SOC201中。
扬声器223，也称“喇叭”，用于将音频电信号转换为声音信号。电子设备200可以通过扬声器170A收听音乐，或收听免提通话。
受话器225，也称“听筒”，用于将音频电信号转换成声音信号。当电子设备200接听电话或语音信息时，可以通过将受话器170B靠近人耳接听语音。
麦克风224，也称“话筒”，“传声器”，用于将声音信号转换为电信号。当拨打电话或发送语音信息时，用户可以通过人嘴靠近麦克风224发声，将声音信号输入到麦克风224。电子设备200可以设置至少一个麦克风224。在另一些实施例中，电子设备200可以设置两个麦克风224，除了采集声音信号，还可以实现降噪功能。在另一些实施例中，电子设备200还可以设置三个，四个或更多麦克风224，实现采集声音信号，降噪，还可以识别声音来源，实现定向录音功能等。
马达222可以产生振动提示。马达222可以用于来电振动提示，也可以用于触摸振动反馈。例如，作用于不同应用(例如拍照，音频播放等)的触摸操作，可以对应不同的振动反馈效果。作用于显示屏不同区域的触摸操作，马达222也可对应不同的振动反馈效果。不同的应用场景(例如：时间提醒，接收信息，闹钟，游戏等)也可以对应不同的振动反馈效果。触摸振动反馈效果还可以支持自定义。
电子设备200还可以包括各种传感器221(图中未示出)等。本申请实施例对电 子设备200的具体结构不作限定。
本申请实施例的电子设备200中还可以包括开关器件SW1和SW2(图中未示出)，SW1或SW2的部分或全部也设置在摄像头模组中，不再赘述。
综上，本申请实施例将ISP IC设置在摄像头模组中，SW1或SW2的部分或全部也设置在摄像头模组中，可以节约成本，降低主板面积，且将ISP IC以及开关器件集成在摄像头模组中，可以实现摄像头模组与主板解耦，使得摄像头模组能应用于通用性的主板，也可以使同一种主板兼容普通摄像头模组和带有预处理芯片切换通路的摄像头模组，提升主板的通用性。
下面结合图3-图7对本申请实施例中摄像头模组与主板连接的结构的可能实现方式进行详细说明。
示例性的，图3示出了本申请实施例提供的一种摄像头模组与主板连接结构示意图。
如图3所示，摄像头模组310和主板320通过FPC330连接。其中，摄像头模组310中包括图像传感器311、BTB312、ISP IC313、第一开关314以及第二开关315。主板320包括BTB321以及SOC322。
FPC330的两端可以分别插入在BTB312和BTB321中，实现摄像头模组310与主板320的连接。可以理解的是，因为FPC具有柔性好和占用空间小等优点，本申请实施例以采用FPC330、BTB312和BTB321实现摄像头模组310与主板320的连接为例进行示例，可能的实现中，摄像头模组310与主板320也可以通过其他任意方式实现电连接，本申请实施例不作具体限定。
图像传感器311采集的图像或视频数据，根据第一开关314和第二开关315的选择，可以经通路1由FPC330传输到SOC322，也可以经通路2的ISP IC313的处理后再由FPC330传输到SOC322。其中，ISP IC313可以是独立的芯片，也可以集成在图像传感器311中，本申请是对ISP IC313的具体实现不作限定。
示例性的，如果电子设备执行的是图像预览或者无美化录像等的步骤时，电子设备可以控制第一开关314和第二开关315导通通路1，图像传感器311采集的图像或视频数据，经通路1由FPC330传输到SOC322。如果电子设备执行的是拍照或有美化录像等的步骤时，电子设备可以控制第一开关314和第二开关315导通通路2，图像传感器311采集的图像或视频数据，经通路2的ISP IC313的处理后再由FPC330传输到SOC322。
本申请实施例中，摄像头模组310中的第一开关314和第二开关315均用于实现单刀双掷的开关功能。单刀双掷的开关可以具有一个动端和两个不动端，动端可以向两个不动端之间切换连接。例如，以第一开关314为例，第一开关314连接图像传感器311的端为动端，第一开关314连接通路1和通路2的端为不动端。
第一开关314和第二开关315均可以为独立的芯片。第一开关314和/或第二开关315也可以集成在图像传感器311中，这样可以通过集成缩小摄像头模组310的尺寸。第一开关314和/或第二开关315也可以由电器件搭建电路实现，例如第一开关314和第二开关315的具体器件包括但不限于下述几种：单个金氧半场效晶体管(metal oxide semiconductor field effect transistor,MOSFET)，多个共同实现单刀双掷的开关功能的 MOSFET，集成电路搭建实现开关功能的电路，等。其中，MOSFET可以为N型场效应管(negative channel MOS，NMOS)，也可以为P型场效应管(positive channel MOS，NMOS)，本申请实施例对第一开关314和第二开关315的具体实现不作限定。
需要说明的是，图3对应的实施例中，SOC322可以采用一个接口接收通路1传输的数据或通路2传输的数据，通过第一开关314和第二开关315，可以使得通路1和通路2分时使用，且在采用通路2传输数据时，通路1的两端均断开电路，避免因为通路1任一端接入电路导致产生辐射的现象。类似的，采用通路1传输数据时，通路2的两端均断开电路，避免因为通路2任一端接入电路导致产生辐射的现象。
可能的实现中，第二开关315可以省略，但是第二开关315省略时，在选择通路2传输数据时，通路1的右端接入SOC322中，会导致通路1的一端悬空一端接入电路，出现类似天线的状态，进而产生辐射，对通路2传输的数据造成干扰。
因此，另一种可替代的方案中，如图4所示，可以再通路1中设置抗干扰模块316，通过抗干扰模块316抑制通路1在未使用时带来的干扰，从而可以省略第二开关315。可以理解的是，图4的通路2中也可以设置抗干扰模块(图中未示出)以抑制通路2在未使用时带来的干扰。其中，抗干扰模块可以包括电阻或电容等器件，本申请实施例不作限定，抗干扰模块的成本可以低于第二开关315的成本，通过图4的方式，可以进一步节约成本。
再一种可替代的方案中，如图5所示，省略第二开关315后，可以将通路1和通路2的数据采用两个路径连接到SOC322，适应的，SOC322中可以采用两个接口分别接收通路1传输的数据或通路2传输的数据，因为SOC322内部可以控制接口的断开电路与接入电路的逻辑，因此，通过SOC322，可以使得在采用通路2传输数据时，通路1的两端均断开电路，避免因为通路1任一端接入电路导致产生辐射的现象。类似的，采用通路1传输数据时，通路2的两端均断开电路，避免因为通路2任一端接入电路导致产生辐射的现象。
又一种可替代的方案中，也可以将第二开关设置在主板，示例性的，图6示出了本申请实施例提供的另一种摄像头模组与主板连接结构示意图。
如图6所示，摄像头模组410和主板420通过FPC430连接。其中，摄像头模组410中包括图像传感器411、BTB412、ISP IC413以及第四开关414。主板420包括BTB421、SOC422以及第三开关423。
FPC430的两端可以分别插入在BTB412和BTB421中，实现摄像头模组410与主板420的连接。
图像传感器411采集的图像或视频数据，根据第四开关414的选择，可以经通路3由FPC430传输到主板420，再经过第三开关423的其中一路传输到SOC422。图像传感器411采集的图像或视频数据，根据第四开关414的选择，也可以经通路4的ISP IC413的处理后由FPC430传输到主板420，再经过第三开关423的另一路传输到SOC422。其中，ISP IC413可以是独立的芯片，也可以集成在图像传感器411中，本申请是对ISP IC413的具体实现不作限定。
示例性的，如果电子设备执行的是图像预览或者无美化录像等的步骤时，电子设备可以控制第四开关414导通通路3，图像传感器411采集的图像或视频数据，经通 路3由FPC430以及第三开关423的其中一路传输到SOC422。如果电子设备执行的是拍照或有美化录像等的步骤时，电子设备可以控制第四开关414导通通路4，图像传感器411采集的图像或视频数据，经通路4的ISP IC413的处理后再由FPC430以及第三开关423的另一路传输到SOC422。
本申请实施例中，摄像头模组410中的第四开关414和第三开关423均用于实现单刀双掷的开关功能。第四开关414和第三开关423均可以为独立的芯片。
可能的实现中，第四开关414可以集成在图像传感器411中，这样可以通过集成缩小摄像头模组410的尺寸。第三开关423可以集成在SOC422，这样可以通过集成缩小SOC422的尺寸。
需要说明的是，通过第三开关423和第四开关414，可以使得通路3和通路4分时使用，且在采用通路4传输数据时，通路3的两端均断开电路，避免因为通路3任一端接入电路导致产生辐射的现象。类似的，采用通路3传输数据时，通路4的两端均断开电路，避免因为通路4任一端接入电路导致产生辐射的现象。
示例性的，图7示出了一种将第三开关和ISP IC集成在图像传感器中，以及将第四开关集成在SOC中时，摄像头模组与主板连接结构示意图。
如图7所示，摄像头模组510和主板520通过FPC530连接。其中，摄像头模组510中包括图像传感器511、BTB512、ISP块(block)513以及堆栈(buffer)514。主板520包括BTB521以及SOC522。
需要说明的是，图像传感器511、BTB512、ISP块513以及堆栈514可以集成在一起，可能的实现中，集成后的器件也可能统称为图像传感器或摄像头，本申请实施例不作具体限定。
FPC530的两端可以分别插入在BTB512和BTB521中，实现摄像头模组510与主板520的连接。
图像传感器511采集的图像或视频数据，可以以RAW格式的数据保存在堆栈514中，并由FPC530传输到主板520的SOC522。图像传感器511采集的图像或视频数据，也可以经过ISP处理后保存在堆栈514中，并由FPC530传输到主板520的SOC522。
需要说明的是，本申请实施例中将开关器件分别集成在图像传感器511和SOC522中，所以图7中未示出开关器件，但是图7中的图像传感器511采集的数据依然类似于图6的处理逻辑，可以根据不同的场景选择是否经ISP处理，在此不再赘述。
下面结合图8，对本申请实施例中电子设备的图像处理流程进一步说明。
如图8所示，示出了电子设备的SOC的内部结构示意图。
SOC中可以包括摄像头接口(camera interface)0-摄像头接口3、图像处理(image process)DSP、视频堆栈(video buffer)、视频编码器(video codec)和文件系统(file system)。
其中，摄像头接口0-摄像头接口3用于连接摄像头模组。可以理解的是，本申请实施例以电子设备包括四个摄像头模组为例进行说明，因此摄像头接口包括四个，可能的实现中，电子设备可以包括N个摄像头模组，则摄像头接口的数量也可以为N个，N为自然数。
各摄像头采集的视频数据经过摄像头接口可以传输到DSP进行处理，处理后的数 据可以分为两路进行输出，其中一路中，处理后的数据可以设置在视频堆栈中，形成预览视频，支持在显示通道(display panel)中显示，可以理解的是，该路处理后的数据可以为上述实施例中通道1或通道3等未经过ISP处理的数据。另一路中，处理后的数据可以经过视频编码器和文件系统的处理后，形成拍摄文件保存在UFS中，这路处理后的数据可以为上述实施例中通道2或通道4等经过ISP处理的数据。
需要说明的是，本申请实施例中，电子设备的各摄像头模组与SOC的连接方式可以不统一，或者可以理解为，电子设备可以包括如图1、图3-图7中任意一种或多种连接方式。
示例性的，结合图2，电子设备200的前置摄像头209所在的摄像头模组与SOC的连接方式可以如图1的连接方式，适应的，电子设备200的前置摄像头209所在的摄像头模组与SOC包含的器件参照图1的记载。电子设备200的后置摄像头210所在的摄像头模组与SOC的连接方式可以如图3的连接方式，适应的，电子设备200的后置摄像头210所在的摄像头模组与SOC包含的器件参照图3的记载。电子设备200的后置摄像头211所在的摄像头模组与SOC的连接方式可以如图4的连接方式，适应的，电子设备200的后置摄像头211所在的摄像头模组与SOC包含的器件参照图4的记载。电子设备200的后置摄像头212所在的摄像头模组与SOC的连接方式可以如图5的连接方式，适应的，电子设备200的后置摄像头212所在的摄像头模组与SOC包含的器件参照图5的记载。
当然，电子设备200各摄像头所在的摄像头模组与SOC之间的具体连接关系可以在图1、图3、图4、图5、图6或图7中任意选择，任意两个或多个摄像头模组与SOC之间的连接关系可以相同也可以不同，本申请实施例不作具体限定。
综上所述，本申请实施例将ISP IC设置在摄像头模组中，开关器件的部分或全部也设置在摄像头模组中，可以节约成本，降低主板面积，且将ISP IC以及开关器件集成在摄像头模组中，可以实现摄像头模组与主板解耦，使得摄像头模组能应用于通用性的主板，也可以使同一种主板兼容普通摄像头模组和带有预处理芯片切换通路的摄像头模组，提升主板的通用性。
本申请实施例的电子设备可以是能够处理多种图像数据信号的设备，例如，具有无线连接功能的手持式设备、车载设备等。目前，一些终端的举例为：手机(mobile phone)、平板电脑、笔记本电脑、掌上电脑、移动互联网设备(mobile internet device，MID)、可穿戴设备，虚拟现实(virtual reality，VR)设备、增强现实(augmented reality，AR)设备、工业控制(industrial control)中的无线终端、无人驾驶(self driving)中的无线终端、远程手术(remote medical surgery)中的无线终端、智能电网(smart grid)中的无线终端、运输安全(transportation safety)中的无线终端、智慧城市(smart city)中的无线终端、智慧家庭(smart home)中的无线终端、蜂窝电话、无绳电话、会话启动协议(session initiation protocol，SIP)电话、无线本地环路(wireless local loop，WLL)站、个人数字助理(personal digital assistant，PDA)、具有无线通信功能的手持设备、计算设备或连接到无线调制解调器的其它处理设备、车载设备、可穿戴设备，5G网络中的电子设备或者未来演进的公用陆地移动通信网络(public land mobile network，PLMN)中的电子设备等，本申请实施例对此并不限定。
作为示例而非限定，在本申请实施例中，该电子设备还可以是可穿戴设备。可穿戴设备也可以称为穿戴式智能设备，是应用穿戴式技术对日常穿戴进行智能化设计、开发出可以穿戴的设备的总称，如眼镜、手套、手表、服饰及鞋等。可穿戴设备即直接穿在身上，或是整合到用户的衣服或配件的一种便携式设备。可穿戴设备不仅仅是一种硬件设备，更是通过软件支持以及数据交互、云端交互来实现强大的功能。广义穿戴式智能设备包括功能全、尺寸大、可不依赖智能手机实现完整或者部分的功能，例如：智能手表或智能眼镜等，以及只专注于某一类应用功能，需要和其它设备如智能手机配合使用，如各类进行体征监测的智能手环、智能首饰等。
此外，在本申请实施例中，电子设备还可以是物联网(internet of things，IoT)系统中的电子设备，IoT是未来信息技术发展的重要组成部分，其主要技术特点是将物品通过通信技术与网络连接，从而实现人机互连，物物互连的智能化网络。
本申请实施例中的电子设备也可以称为：用户设备(user equipment，UE)、移动台(mobile station，MS)、移动终端(mobile terminal，MT)、接入终端、用户单元、用户站、移动站、移动台、远方站、远程终端、移动设备、用户终端、终端、无线通信设备、用户代理或用户装置等。
在本申请实施例中，电子设备或各个网络设备包括硬件层、运行在硬件层之上的操作系统层，以及运行在操作系统层上的应用层。该硬件层包括中央处理器(central processing unit，CPU)、内存管理单元(memory management unit，MMU)和内存(也称为主存)等硬件。该操作系统可以是任意一种或多种通过进程(process)实现业务处理的计算机操作系统，例如，Linux操作系统、Unix操作系统、Android操作系统、iOS操作系统或windows操作系统等。该应用层包含浏览器、通讯录、文字处理软件、即时通信软件等应用。
示例性的，图9示出了一种具体的电子设备的结构示意图。
电子设备可以包括处理器110，内部存储器121，通用串行总线(universal serial bus，USB)接口，充电管理模块140，电源管理模块141，天线1，天线2，移动通信模块150，无线通信模块160，音频模块170，扬声器170A，受话器170B，传感器模块180，按键190，指示器192，摄像头193，以及显示屏194等。其中传感器模块180可以包括压力传感器180A，陀螺仪传感器180B，气压传感器180C，磁传感器180D，加速度传感器180E，电感传感器180F、接近光传感器180G，温度传感器180J，触摸传感器180K，环境光传感器180L，骨传导传感器180M等。
可以理解的是，本申请实施例示意的结构并不构成对电子设备的具体限定。在本申请另一些实施例中，电子设备可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
处理器110可以包括一个或多个处理单元。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。处理器110中还可以设置存储器，用于存储指令和数据。
充电管理模块140用于从充电器接收充电输入。其中，充电器可以是无线充电器，也可以是有线充电器。电源管理模块141用于连接充电管理模块140与处理器110。
电子设备的无线通信功能可以通过天线1，天线2，移动通信模块150，无线通信模块160，调制解调处理器以及基带处理器等实现。
天线1和天线2用于发射和接收电磁波信号。电子设备中的天线可用于覆盖单个或多个通信频带。不同的天线还可以复用，以提高天线的利用率。
移动通信模块150可以提供应用在电子设备上的包括2G/3G/4G/5G等无线通信的解决方案。移动通信模块150可以包括至少一个滤波器，开关，功率放大器，低噪声放大器(low noise amplifier，LNA)等。移动通信模块150可以由天线1接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调处理器进行解调。
无线通信模块160可以提供应用在电子设备上的无线通信的解决方案。
电子设备通过GPU，显示屏194，以及应用处理器等实现显示功能。GPU为图像处理的微处理器，连接显示屏194和应用处理器。GPU用于执行数学和几何计算，用于图形渲染。
显示屏194用于显示图像，视频等。显示屏194包括显示面板。在一些实施例中，电子设备可以包括1个或N个显示屏194，N为大于1的正整数。
电子设备可以通过ISP，摄像头193，视频编解码器，GPU，显示屏194以及应用处理器等实现拍摄功能。
摄像头193用于捕获静态图像或视频。在一些实施例中，电子设备可以包括1个或N个摄像头193，N为大于1的正整数。
内部存储器121可以用于存储计算机可执行程序代码，可执行程序代码包括指令。内部存储器121可以包括存储程序区和存储数据区。
电子设备可以通过音频模块170，扬声器170A，受话器170B，以及应用处理器等实现音频功能。例如音乐播放，录音等。
需要说明的是，图9的电子设备中的结构部分可以参照图2对应的实施例的描述，在此不再赘述。
以上的实施方式、结构示意图或仿真示意图仅为示意性说明本申请的技术方案，其中的尺寸比例并不构成对该技术方案保护范围的限定，任何在上述实施方式的精神和原则之内所做的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (12)

  1. 一种电子设备，其特征在于，包括：主板和摄像头模组；
    其中，所述摄像头模组包括摄像头、图像信号处理集成电路和第一开关；所述主板中设置有处理器；
    所述摄像头，用于采集图像数据；
    所述图像信号处理集成电路，用于处理所述摄像头采集的图像数据；
    所述第一开关为实现单刀双掷功能的开关，具体用于实现所述摄像头向第一通路或第二通路的切换；所述第一通路为将所述摄像头采集的图像数据传输到所述处理器的通路，所述第二通路为将所述摄像头采集的图像数据经过所述图像信号处理集成电路处理后传输到所述处理器的通路；
    所述处理器，用于处理来自所述第一通路的数据或者来自所述第二通路的数据。
  2. 根据权利要求1所述的电子设备，其特征在于，所述摄像头模组还包括第二开关；
    所述第二开关为实现单刀双掷的开关，具体用于在所述摄像头模组中实现所述处理器向所述第一通路或所述第二通路的切换；
    所述第一开关的动端与所述摄像头连接，所述第一开关的其中一个不动端与所述第一通路的一端连接，所述第一开关的另一个不动端与所述第二通路的一端连接；
    所述第二开关的动端与所述处理器连接，所述第二开关的其中一个不动端与所述第一通路的另一端连接，所述第二开关的另一个不动端与所述第二通路的另一端连接；
    其中，所述第一开关和第二开关，用于在所述摄像头采集的图像数据经过所述第一通路传输时，导通所述第一通路在电路中的连接，以及断开所述第二通路在电路中的连接；或者，在所述摄像头采集的图像数据经过所述第二通路传输时，导通所述第二通路在电路中的连接，以及断开所述第一通路在电路中的连接。
  3. 根据权利要求1所述的电子设备，其特征在于，所述摄像头模组的第一通路和/或第二通路中设置有抗干扰模块，所述第一通路的输出端和所述第二通路的输出端在所述摄像模组中连接。
  4. 根据权利要求1所述的电子设备，其特征在于，所述主板中还包括第三开关；
    所述第三开关为实现单刀双掷的开关，具体用于在所述主板中实现所述处理器向所述第一通路或所述第二通路的切换；
    所述第一开关的动端与所述摄像头连接，所述第一开关的其中一个不动端与所述第一通路的一端连接，所述第一开关的另一个不动端与所述第二通路的一端连接；
    所述第一通路与所述第二通路分别通过各自的路径连接到所述主板；
    所述第三开关的动端与所述处理器连接，所述第三开关的其中一个不动端与所述第一通路连接到主板的端连接，所述第三开关的另一个不动端与所述第二通路连接到主板的端连接；
    其中，所述第一开关和第三开关，用于在所述摄像头采集的图像数据经过所述第一通路传输时，导通所述第一通路在电路中的连接，以及断开所述第二通路在电路中的连接；或者，在所述摄像头采集的图像数据经过所述第二通路传输时，导通所述第二通路在电路中的连接，以及断开所述第一通路在电路中的连接。
  5. 根据权利要求1-4任一项所述的电子设备，其特征在于，所述处理器采用同一个接口接收来自所述第一通路的数据或者来自所述第二通路。
  6. 根据权利要求1所述的电子设备，其特征在于，所述处理器采用两个接口分别接收来自所述第一通路的数据或者来自所述第二通路的数据。
  7. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述摄像头模组设置在所述电子设备中时，所述摄像头模组的四周设置金属屏蔽。
  8. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述摄像头模组与所述主板采用柔性印刷电路板FPC连接，所述摄像头模组和所述主板中均设置板对板连接器BTB，所述BTB用于所述FPC的接入。
  9. 一种摄像头模组，其特征在于，所述摄像头模组包括摄像头、图像信号处理集成电路和第一开关；
    所述摄像头，用于采集图像数据；
    所述图像信号处理集成电路，用于处理所述摄像头采集的图像数据；
    所述第一开关为实现单刀双掷功能的开关，具体用于实现所述摄像头向第一通路或第二通路的切换；所述第一通路为将所述摄像头采集的图像数据传输到主板的处理器的通路，所述第二通路为将所述摄像头采集的图像数据经过所述图像信号处理集成电路处理后传输到所述处理器的通路。
  10. 根据权利要求9所述的摄像头模组，其特征在于，所述摄像头模组还包括第二开关；
    所述第二开关为实现单刀双掷的开关，具体用于在所述摄像头模组中实现所述处理器向所述第一通路或所述第二通路的切换；
    所述第一开关的动端与所述摄像头连接，所述第一开关的其中一个不动端与所述第一通路的一端连接，所述第一开关的另一个不动端与所述第二通路的一端连接；
    所述第二开关的动端与所述处理器连接，所述第二开关的其中一个不动端与所述第一通路的另一端连接，所述第二开关的另一个不动端与所述第二通路的另一端连接；
    其中，所述第一开关和第二开关，用于在所述摄像头采集的图像数据经过所述第一通路传输时，导通所述第一通路在电路中的连接，以及断开所述第二通路在电路中的连接；或者，在所述摄像头采集的图像数据经过所述第二通路传输时，导通所述第二通路在电路中的连接，以及断开所述第一通路在电路中的连接。
  11. 根据权利要求9所述的摄像头模组，其特征在于，所述摄像头模组的第一通路和/或第二通路中设置有抗干扰模块，所述第一通路的输出端和所述第二通路的输出端在所述摄像模组中连接。
  12. 根据权利要求9-11任一项所述的摄像头模组，其特征在于，所述摄像头模组设置在电子设备中时，所述摄像头模组的四周设置金属屏蔽。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002125141A (ja) * 2001-10-09 2002-04-26 Sony Corp ビデオカメラ装置
CN107005625A (zh) * 2015-04-29 2017-08-01 华为技术有限公司 一种摄像头模组
CN108718372A (zh) * 2018-04-12 2018-10-30 Oppo广东移动通信有限公司 图像处理装置、方法、电子设备及存储介质
CN109068945A (zh) * 2016-03-29 2018-12-21 富士胶片株式会社 图像处理装置、图像处理装置的工作方法及图像处理程序
CN110383295A (zh) * 2017-03-14 2019-10-25 三菱电机株式会社 图像处理装置、图像处理方法以及图像处理程序

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208344076U (zh) * 2018-05-18 2019-01-08 深圳市豪恩汽车电子装备股份有限公司 流媒体后视镜
CN212303018U (zh) * 2020-06-05 2021-01-05 格科微电子（上海）有限公司 图像信号处理器件、终端
CN213211043U (zh) * 2020-09-28 2021-05-14 腾讯科技（深圳）有限公司 图像处理装置和设备及身份验证系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002125141A (ja) * 2001-10-09 2002-04-26 Sony Corp ビデオカメラ装置
CN107005625A (zh) * 2015-04-29 2017-08-01 华为技术有限公司 一种摄像头模组
CN109068945A (zh) * 2016-03-29 2018-12-21 富士胶片株式会社 图像处理装置、图像处理装置的工作方法及图像处理程序
CN110383295A (zh) * 2017-03-14 2019-10-25 三菱电机株式会社 图像处理装置、图像处理方法以及图像处理程序
CN108718372A (zh) * 2018-04-12 2018-10-30 Oppo广东移动通信有限公司 图像处理装置、方法、电子设备及存储介质

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4149100A4

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