WO2023003316A1 - Antenne de type à film mince dotée d'un contact simple face ou double face, et son procédé de préparation - Google Patents

Antenne de type à film mince dotée d'un contact simple face ou double face, et son procédé de préparation Download PDF

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Publication number
WO2023003316A1
WO2023003316A1 PCT/KR2022/010517 KR2022010517W WO2023003316A1 WO 2023003316 A1 WO2023003316 A1 WO 2023003316A1 KR 2022010517 W KR2022010517 W KR 2022010517W WO 2023003316 A1 WO2023003316 A1 WO 2023003316A1
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WIPO (PCT)
Prior art keywords
layer
thin film
metal layer
type antenna
film type
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PCT/KR2022/010517
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English (en)
Korean (ko)
Inventor
김경식
황재연
김수현
김정수
Original Assignee
주식회사 갤트로닉스 코리아
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Publication of WO2023003316A1 publication Critical patent/WO2023003316A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention relates to a thin film type antenna including a flexible printed circuit board (FPCB) and a manufacturing method thereof, and more specifically, the thin film type antenna includes a flexible cupper clad laminate (FCCL) ) is not used, so the number of layers is significantly reduced.
  • FPCB flexible printed circuit board
  • FCCL flexible cupper clad laminate
  • PCB which is an abbreviation of printed circuit board and is called a printed circuit board
  • PCB is a board that forms a conductor circuit on the surface or inside of an insulated board to connect parts based on circuit design. Of course, it serves to electrically connect the parts to each other and to mechanically fix the parts other than the electrical connection function of the parts.
  • PCB Compact Printed Circuit Board
  • FPCB Flexible Printed Circuit Board
  • FPCB forms a pattern through etching using Flexible Cupper Clad Laminate (FCCL), and another film processed thereon is hot pressed (coverlay) The product is manufactured by combining them through the hot press process.
  • FCCL Flexible Cupper Clad Laminate
  • FCCL as described above is produced through a hot press process after laminating copper on a polyimide (PI)-based film
  • the cost as a raw material is expensive.
  • PI polyimide
  • a more expensive double-sided FCCL must be used compared to single-sided FCCL, and a drilling process and a copper plating process are added to form a via hole, which increases the price. may occur.
  • lifting occurs during attachment by bending due to the tension of a coverlay film applied to an outer layer to prevent pattern corrosion.
  • the present inventors while studying to solve the above problems, developed a method for manufacturing a thin film type antenna without using the above FCCL, and the thin film type antenna manufactured using this method is a conventional FCCL.
  • the number of layers to be stacked is significantly reduced, and as a result, the required process is reduced, so the price is competitive, and it is found that it can act as a structure capable of single-sided or double-sided contact without causing lifting problems.
  • the present invention has been completed.
  • Korean Patent Publication No. 10-2017-0028662 discloses a method for manufacturing an FCCL for a high-speed transmission antenna and an FCCL for a high-speed transmission antenna.
  • the present invention has been made to solve the problems of the prior art, and an object of the present invention is to provide a thin film type antenna including a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the object is to provide a manufacturing method of the thin film type antenna.
  • the metal layer 10 may include a material selected from the group consisting of copper foil, conductive adhesive, and combinations thereof.
  • the metal layer 10 may have a thickness of 5 ⁇ m to 200 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer 20 may be 1 ⁇ m to 20 ⁇ m.
  • the base film layer 30 includes a material selected from the group consisting of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. it may be
  • the base film layer 30 may have a thickness of 1 ⁇ m to 20 ⁇ m.
  • the thin-film antenna may further include an anti-corrosion layer 40 interposed between the tape 1 and the metal layer 10 .
  • the anti-corrosion layer 40 may have a thickness of 1 ⁇ m to 10 ⁇ m.
  • the other surface of the adhesive layer 20 provides a method of manufacturing a thin film type antenna that is bonded to the base film layer 30.
  • the manufacturing method of the thin film type antenna may include forming a pattern on the other surface of the metal layer 10; Thereafter, plating the anti-corrosion layer 40 on the other surface of the metal layer 10; may be further included, and the tape 1 may be attached to the anti-corrosion layer 40.
  • the thin film type antenna according to the present invention can reduce the manufacturing cost by significantly reducing the number of stacked antennas by not using FCCL, and may improve the lifting problem due to film tension.
  • the thin film type antenna can be very efficient because it can function as a structure capable of single-sided or double-sided contact.
  • FIG. 1 is a schematic diagram showing a single-sided antenna using an FCCL according to a comparative example of the present invention.
  • FIG. 2 is a schematic diagram showing a double-sided antenna using FCCL according to a comparative example of the present invention.
  • 3 to 7 are schematic diagrams showing a thin film type antenna not using an FCCL according to an embodiment of the present invention, respectively.
  • the first aspect of the present application is,
  • It provides a thin film type antenna comprising a.
  • FPCB field-programmable gate array
  • FPCB In order to protect the copper foil, which is a major part of the FPCB for antenna, the copper foil is bonded to flexible polyimide, and then the coated insulator is pressed to the copper foil through a hot press process. were cut into individual units and used.
  • the role of the FPCB and the protection of the copper foil were achieved, there was a problem in that the area of the copper foil was limited and the efficiency was reduced as an antenna that serves to receive radio waves.
  • a conventionally used FPCB uses a flexible cupper clad laminate (FCCL, 100) including a polyimide 110, a first adhesive 120, and a copper foil 130. A pattern is formed through etching, and another film processed thereon is laminated with a coverlay (200) through a hot press process to manufacture a product.
  • FCCL flexible cupper clad laminate
  • FCCL 100 as described above is produced through a hot press process after laminating the copper foil 130 on a polyimide (PI)-based film, the cost as a raw material is expensive.
  • PI polyimide
  • a more expensive double-sided FCCL (100) must be used compared to the single-sided FCCL (100), and a drill to form a via hole (250) (Drill) process and copper plating process may be added to increase the price.
  • Drill drill to form a via hole
  • copper plating process may be added to increase the price.
  • lifting occurs during attachment by bending due to the tension of the coverlay (200) film applied to the outer layer to prevent pattern corrosion.
  • FIGS. 3 to 7 are schematic diagrams showing a thin film type antenna according to an embodiment of the present invention, respectively.
  • the thin film type antenna according to FIG. 3 will be mainly described, but the thin film type antennas of FIGS. 4 to 7 according to other embodiments will be additionally described.
  • the thin film type antennas shown in FIGS. 3 to 7 can be applied by appropriately selecting, replacing, omitting or modifying the thin film type antennas as needed by a person skilled in the art.
  • the thin film antenna may include a tape (1).
  • the tape 1 may be a conventional tape applicable to the antenna, and may have a thickness of 1 ⁇ m to 100 ⁇ m, and may be about 50 ⁇ m according to an embodiment of the present invention.
  • the thin film type antenna may include a metal layer 10 stacked on the tape 1.
  • the metal layer 10 may include a material selected from the group consisting of copper foil, conductive adhesive, and combinations thereof.
  • the copper foil may preferably be composed of an electrolytic foil, because the rolled foil made by heating the thick copper to a specific temperature to make it easy to process and pressing it with both rolls to make it thin is in FPCB that requires a thin copper foil. Not only is it cost-effective because a lot of thinning processes are added, but also because of the process of pressing with a roll to make it thin, the copper atoms on the surface are uniformly arranged and smooth.
  • the electrolytic foil that uses sulfuric acid to plate copper uses an oxidation-reduction reaction to build up thin copper on a roll in an atomic unit.
  • electrolytic foil which is stacked in atomic units, is more cost-effective than rolled foil, which makes thick copper foil thinner, and adhesives or inks are better adhered or applied when insulators are attached or ink is applied using the rough surface.
  • the conductive adhesive may preferably use a silver paste.
  • the thickness of the metal layer 10 may be 5 ⁇ m to 200 ⁇ m, preferably 5 ⁇ m to 30 ⁇ m, and according to an embodiment of the present invention, 12 ⁇ m or It may be 18 ⁇ m.
  • one surface and/or the other surface of the metal layer 10 may have a pattern formed thereon. This is a pattern to be applied to an antenna, and the shape of the pattern may be appropriately selected and formed according to the type of antenna to be applied.
  • the thin-film antenna may include an adhesive layer 20 laminated on the metal layer 10 .
  • the adhesive layer 20 is interposed to bond the metal layer 10 and the base film layer 30 to be described below, and the thickness of the adhesive layer 20 may be 1 ⁇ m to 20 ⁇ m. And, according to an embodiment of the present invention, it may be about 10 ⁇ m.
  • the type of adhesive used in the adhesive layer 20 may be any adhesive commonly used in the art without limitation.
  • the thin-film antenna may include a base film layer 30 laminated on the adhesive layer 20 .
  • the base film layer 30 is used as an insulator and is made of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. It may include a material selected from the group consisting of, and may preferably include polyimide (PI) or polyethylene terephthalate (PET).
  • the base film layer 30 may have a thickness of 1 ⁇ m to 20 ⁇ m, preferably 10 ⁇ m to 15 ⁇ m, and according to an embodiment of the present invention, about 12.5 ⁇ m It may be ⁇ m.
  • the thin film type antenna may further include an anti-corrosion layer 40 interposed between the tape 1 and the metal layer 10. That is, when exposed to the outside, the metal layer 10 may be easily corroded by contact with oxygen in the air depending on circumstances, but the anti-corrosion layer 40 may be interposed to prevent this. Meanwhile, as shown in FIG. 3 , one end of the metal layer 10 may protrude in the longitudinal direction compared to the tape 1, the adhesive layer 20, and the base film layer 30. In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper) and the other surface (lower) of the portion where the metal layer 10 protrudes.
  • the material of the anti-corrosion layer 40 may be nickel (Ni) and / or gold (Au), preferably high ductility nickel (Ni) may be used.
  • the anti-corrosion layer 40 may have a thickness of 1 ⁇ m to 10 ⁇ m, and according to an embodiment of the present invention, it may be about 3 ⁇ m to 7 ⁇ m.
  • FIGS. 4 to 7 a thin film type antenna according to another embodiment of the present application will be described with reference to FIGS. 4 to 7 . Meanwhile, since the description of each layer in the thin film type antenna shown in FIGS. 4 to 7 is the same as described above, a detailed description thereof will be omitted.
  • the thin film type antenna as shown in Figure 4, the tape (1); a base film layer 30 laminated on the tape 1; An adhesive layer 20 laminated on the base film layer 30; a metal layer 10 laminated on the adhesive layer 20; It may include an adhesive layer 20 laminated on the metal layer and a base film layer 30 laminated on the adhesive layer 20 .
  • the metal layer 10 may have one end protruding in the longitudinal direction compared to the tape 1, the adhesive layer 20, and the base film layer 30, and the anti-corrosion layer 40 is formed by protruding the It may be formed on one surface (upper) and the other surface (lower) of the metal layer 10, respectively.
  • the anti-corrosion layer 40 formed on the other side (lower side) may be formed only from the other side (lower side) of the metal layer 1 to the boundary between the tape 1 and the base film layer 30.
  • the thin film type antenna as shown in Figure 5, the tape (1); An anti-corrosion layer 40 laminated on the tape 1; a metal layer 10 laminated on the anti-corrosion layer 40; an adhesive layer 20 laminated on the metal layer; and a base film layer 30 laminated on the adhesive layer 20.
  • the tape 1, the metal layer 10, and the anti-corrosion layer 40 may have one end protruding in the longitudinal direction compared to the adhesive layer 20 and the base film layer 30, and the metal layer ( 10) may be that the anti-corrosion layer 40 is additionally formed on one surface (top) of the protruding portion.
  • the thin film antenna as shown in Figure 6, the tape (1); a base film layer 30 laminated on the tape 1; An adhesive layer 20 laminated on the base film layer 30; a metal layer 10 laminated on the adhesive layer 20; It may include an adhesive layer 20 laminated on the metal layer and a base film layer 30 laminated on the adhesive layer 20 .
  • the tape 1, the metal layer 10, the adhesive layer 20 and the base film layer 30 laminated adjacent to the tape 1 are the adhesive layer laminated on top of the metal layer 10 ( 20) and the base film layer 30, one end may protrude in the longitudinal direction.
  • the anti-corrosion layer 40 may be additionally formed on one surface (top) of the portion where the metal layer 10 protrudes.
  • the thin film type antenna as shown in Figure 7, the tape (1); a metal layer 10 laminated on the tape 1; An anti-corrosion layer 40 laminated on the metal layer; An adhesive layer 20 laminated on the anti-corrosion layer 40; And it may include a base film layer 30 laminated on the adhesive layer 20.
  • one end of the tape 1, the metal layer 10, and the anti-corrosion layer 40 may protrude in the longitudinal direction compared to the adhesive layer 20 and the base film layer 30.
  • the anti-corrosion layer 40 may be additionally formed on one surface (top) of the portion where the anti-corrosion layer 40 protrudes.
  • the second aspect of the present application is,
  • the other surface of the adhesive layer 20 provides a method of manufacturing a thin film type antenna that is bonded to the base film layer 30.
  • the manufacturing method of the thin film type antenna may include a step of laminating one surface of the metal layer 10 to one surface of the adhesive layer 20.
  • the other surface of the adhesive layer 20 may be bonded to the base film layer 30.
  • the base film layer 30 is used as an insulator and is made of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. It may include a material selected from the group consisting of, and may preferably include polyimide (PI) or polyethylene terephthalate (PET).
  • the base film layer 30 may have a thickness of 1 ⁇ m to 20 ⁇ m, preferably 10 ⁇ m to 15 ⁇ m, and according to an embodiment of the present invention, about 12.5 ⁇ m It may be ⁇ m.
  • the metal layer 10 may include a material selected from the group consisting of copper foil, conductive adhesive, and combinations thereof.
  • the copper foil may preferably be composed of an electrolytic foil, because the rolled foil made by heating the thick copper to a specific temperature to make it easy to process and pressing it with both rolls to make it thin is in FPCB that requires a thin copper foil. Not only is it cost-effective because a lot of thinning processes are added, but also because of the process of pressing with a roll to make it thin, the copper atoms on the surface are uniformly arranged and smooth.
  • the electrolytic foil that uses sulfuric acid to plate copper uses an oxidation-reduction reaction to build up thin copper on a roll in an atomic unit.
  • electrolytic foil which is stacked in atomic units, is more cost-effective than rolled foil, which makes thick copper foil thinner, and adhesives or inks are better adhered or applied when insulators are attached or ink is applied using the rough surface.
  • the conductive adhesive may preferably use a silver paste.
  • the thickness of the laminated metal layer 10 may be 5 ⁇ m to 200 ⁇ m, preferably 5 ⁇ m to 30 ⁇ m, and according to one embodiment of the present invention, 12 It may be ⁇ m or 18 ⁇ m.
  • the adhesive layer 20 is included to bond the metal layer 10 and the base film layer 30, and the thickness of the pressure-sensitive adhesive layer 20 is 1 ⁇ m to 20 ⁇ m. It may be, and according to one embodiment of the present invention it may be about 10 ⁇ m. Meanwhile, the type of adhesive used in the adhesive layer 20 may be any adhesive commonly used in the art without limitation.
  • the method of manufacturing the thin-film antenna includes forming a pattern on one surface and/or the other surface of the metal layer 10 before laminating the metal layer 10 to the adhesive layer 20; It may further include. That is, in the case of the conventionally used FCCL (100), since the metal layer 10, the adhesive layer 20, and the base film layer 30 are stacked, it is not easy to form a pattern on the metal layer 10. did not However, the manufacturing method of the thin film type antenna according to the present invention has the advantage of being able to form patterns on both sides because the metal layer 10 is formed alone and then laminated to the adhesive layer 20. can Meanwhile, the pattern is a pattern to be applied to an antenna, and the shape of the pattern may be appropriately selected and formed according to the type of antenna to be applied.
  • the manufacturing method of the thin film type antenna may include forming a pattern on the other surface of the metal layer 10 . That is, as described above, a pattern may be formed on the other surface in advance before laminating the metal layer 10 to the adhesive layer 20, but since the other surface is open after lamination, it is possible to form a pattern even after lamination. can
  • the pattern is a pattern to be applied to the antenna, and the shape of the pattern may be appropriately selected and formed according to the type of antenna to be applied, and the pattern formation method is also commonly used in the art. Since the method used may be adopted, detailed descriptions thereof will be omitted below.
  • the manufacturing method of the thin film type antenna may include attaching the tape 1 to the other surface of the metal layer 10.
  • the tape 1 may be a conventional tape that can be applied to an antenna, and its thickness may be 1 ⁇ m to 100 ⁇ m, and according to an embodiment of the present invention, about may be 50 ⁇ m.
  • the manufacturing method of the thin film type antenna forming a pattern on the other surface of the metal layer 10; Thereafter, plating the anti-corrosion layer 40 on the other surface of the metal layer 10; further comprising, in this case, the tape 1 may be attached to the anti-corrosion layer 40.
  • the metal layer 10 when the metal layer 10 is exposed to the outside, it may be easily corroded by contact with oxygen in the air depending on circumstances, and the anti-corrosion layer 40 may be plated to prevent this. there is. Meanwhile, as shown in FIG. 3 , one end of the metal layer 10 may protrude in the longitudinal direction compared to the tape 1, the adhesive layer 20, and the base film layer 30. In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper) and the other surface (lower) of the portion where the metal layer 10 protrudes.
  • the material of the anti-corrosion layer 40 may be nickel (Ni) and / or gold (Au), preferably high ductility nickel (Ni) may be used.
  • the anti-corrosion layer 40 may have a thickness of 1 ⁇ m to 10 ⁇ m, and according to an embodiment of the present invention, it may be about 3 ⁇ m to 7 ⁇ m.
  • the method for manufacturing the thin film type antenna may be manufactured in the form shown in FIGS. 4 to 7 .
  • the metal layer 10 is laminated to one surface of the adhesive layer 20, the other surface of which is bonded to the base film layer 30, and a pattern is formed on the other surface of the metal layer 10.
  • the layer shown in each figure may be laminated or plated on the other surface of the metal layer 10 (in the case of the anti-corrosion layer 40).
  • copper foil or silver paste composed of electrolytic foil was first laminated to polyimide (PI) or polyethylene terephthalate (PET) having a thickness of 12.5 ⁇ m (to which an adhesive layer having a thickness of 10 ⁇ m was attached). At this time, the thickness of the copper foil or silver paste was 12 ⁇ m or 18 ⁇ m.
  • PI polyimide
  • PET polyethylene terephthalate
  • the necessary antenna pattern is formed on the copper foil or silver paste through etching, and after corrosion prevention treatment through nickel (Ni) plating (nickel layer thickness: 3 ⁇ m to 7 ⁇ m), a processed tape (tape thickness: 50 ⁇ m) ⁇ m) was attached to prepare a thin film type antenna.
  • the total thickness of the finally manufactured thin film type antenna was about 90 ⁇ m to 100 ⁇ m.
  • a single-sided antenna using a conventional FCCL was prepared.
  • the thickness of each layer of the single-sided antenna was as follows.
  • the total thickness of the prepared single-sided antenna was about 130 ⁇ m to 140 ⁇ m.
  • a double-sided antenna using a conventional FCCL was prepared.
  • the total thickness of the prepared double-sided antenna was about 160 ⁇ m to 170 ⁇ m.

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Abstract

La présente invention concerne une antenne de type à film mince comprenant une carte de circuit imprimé souple (FPCB) et son procédé de préparation et, plus particulièrement, l'antenne de type à film mince est caractérisée en ce qu'un stratifié recouvert de cuivre souple (FCCL) n'est pas utilisé, ce qui permet d'obtenir un nombre particulièrement réduit de couches.
PCT/KR2022/010517 2021-07-20 2022-07-19 Antenne de type à film mince dotée d'un contact simple face ou double face, et son procédé de préparation WO2023003316A1 (fr)

Applications Claiming Priority (2)

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KR1020210094595A KR102395081B1 (ko) 2021-07-20 2021-07-20 단면 또는 양면 접촉이 가능한 박막 필름형 안테나 및 이의 제조방법
KR10-2021-0094595 2021-07-20

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WO2023003316A1 true WO2023003316A1 (fr) 2023-01-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115584216A (zh) * 2022-11-02 2023-01-10 江苏伊诺尔新材料科技有限公司 一种适用于柔性线路板的铜塑复合胶带

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102395081B1 (ko) * 2021-07-20 2022-05-10 주식회사 갤트로닉스 코리아 단면 또는 양면 접촉이 가능한 박막 필름형 안테나 및 이의 제조방법
KR102585983B1 (ko) * 2023-05-09 2023-10-05 김창순 압전발전·안전신호음·내마모성으로 이루어진 쓰리이펙트형 스마트 전봇대 안전벨트용 안전신호발생장치 및 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100019690A (ko) * 2008-08-11 2010-02-19 (주)에이스안테나 필름형 방사체 삽입 사출을 이용한 내장형 안테나 제조 방법 및 그에 따른 내장형 안테나 장치
KR20100053824A (ko) * 2008-11-13 2010-05-24 주식회사 케이티테크 유전체 시트를 이용한 안테나 및 유전체 시트를 이용하는 안테나를 구비한 이동통신 단말기
KR20130092785A (ko) * 2012-02-13 2013-08-21 이동주 필름 안테나 제조방법
KR20140124034A (ko) * 2013-04-15 2014-10-24 칠성산업 주식회사 단면테이프를 합지하여 제조하는 안테나 및 단면테이프를 합지하여 안테나를 제조하는 방법
KR102138341B1 (ko) * 2019-09-03 2020-07-27 주식회사 갤트로닉스 코리아 고연성 니켈/주석 도금을 이용한 필름형 안테나 및 그 제조방법
KR102395081B1 (ko) * 2021-07-20 2022-05-10 주식회사 갤트로닉스 코리아 단면 또는 양면 접촉이 가능한 박막 필름형 안테나 및 이의 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100019690A (ko) * 2008-08-11 2010-02-19 (주)에이스안테나 필름형 방사체 삽입 사출을 이용한 내장형 안테나 제조 방법 및 그에 따른 내장형 안테나 장치
KR20100053824A (ko) * 2008-11-13 2010-05-24 주식회사 케이티테크 유전체 시트를 이용한 안테나 및 유전체 시트를 이용하는 안테나를 구비한 이동통신 단말기
KR20130092785A (ko) * 2012-02-13 2013-08-21 이동주 필름 안테나 제조방법
KR20140124034A (ko) * 2013-04-15 2014-10-24 칠성산업 주식회사 단면테이프를 합지하여 제조하는 안테나 및 단면테이프를 합지하여 안테나를 제조하는 방법
KR102138341B1 (ko) * 2019-09-03 2020-07-27 주식회사 갤트로닉스 코리아 고연성 니켈/주석 도금을 이용한 필름형 안테나 및 그 제조방법
KR102395081B1 (ko) * 2021-07-20 2022-05-10 주식회사 갤트로닉스 코리아 단면 또는 양면 접촉이 가능한 박막 필름형 안테나 및 이의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115584216A (zh) * 2022-11-02 2023-01-10 江苏伊诺尔新材料科技有限公司 一种适用于柔性线路板的铜塑复合胶带

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