WO2022267597A1 - 天线装置及电子设备 - Google Patents

天线装置及电子设备 Download PDF

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Publication number
WO2022267597A1
WO2022267597A1 PCT/CN2022/083885 CN2022083885W WO2022267597A1 WO 2022267597 A1 WO2022267597 A1 WO 2022267597A1 CN 2022083885 W CN2022083885 W CN 2022083885W WO 2022267597 A1 WO2022267597 A1 WO 2022267597A1
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WO
WIPO (PCT)
Prior art keywords
sub
substrate
antenna array
antenna
feed
Prior art date
Application number
PCT/CN2022/083885
Other languages
English (en)
French (fr)
Inventor
钟永卫
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022267597A1 publication Critical patent/WO2022267597A1/zh
Priority to US18/494,668 priority Critical patent/US20240055775A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/24Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/20Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path
    • H01Q21/205Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a curvilinear path providing an omnidirectional coverage

Definitions

  • the present application relates to the technical field of communications, and in particular to an antenna device and electronic equipment.
  • the present application provides an antenna device and electronic equipment, and the space occupied by the antenna device is relatively small.
  • an antenna device including:
  • a dielectric substrate including a first sub-substrate and a second sub-substrate connected to each other, the extension direction of the second sub-substrate intersects the extension direction of the first sub-substrate;
  • the first antenna array is arranged on the first sub-substrate, the first antenna array is provided with a feed point, and the feed point is used for electrical connection with a feed source, and the first antenna array has a first radiation direction;
  • a second antenna array is disposed on the second sub-substrate, the second antenna array has a second radiation direction, and the second radiation direction is different from the first radiation direction.
  • the present application provides an electronic device, including an antenna device, and the antenna device includes:
  • a dielectric substrate including a first sub-substrate and a second sub-substrate connected to each other, the extension direction of the second sub-substrate intersects the extension direction of the first sub-substrate;
  • the first antenna array is arranged on the first sub-substrate, the first antenna array is provided with a feed point, and the feed point is used for electrical connection with a feed source, and the first antenna array has a first radiation direction;
  • a second antenna array is disposed on the second sub-substrate, the second antenna array has a second radiation direction, and the second radiation direction is different from the first radiation direction.
  • the present application provides an electronic device, including an antenna device and a circuit board; the antenna device includes:
  • a dielectric substrate including a first sub-substrate and a second sub-substrate connected to each other, the extension direction of the second sub-substrate intersects the extension direction of the first sub-substrate;
  • the first antenna array is arranged on the first sub-substrate, the first antenna array is provided with a feed point, and the feed point is used for electrical connection with a feed source, and the first antenna array has a first radiation direction;
  • a second antenna array disposed on the second sub-substrate, the second antenna array has a second radiation direction, and the second radiation direction is different from the first radiation direction;
  • the circuit board includes a first surface and a second surface connected to each other, the extension direction of the second surface intersects the extension direction of the first surface, the first sub-substrate is connected to the first surface, and the The second sub-substrate is connected to the second surface.
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a first type of antenna device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of connection of the feed shown in FIG. 2 .
  • FIG. 4 is a schematic diagram of an electrical connection of the antenna device shown in FIG. 2 .
  • FIG. 5 is a schematic diagram of a radiation direction of the antenna device shown in FIG. 2 .
  • FIG. 6 is a schematic diagram of a second structure of the antenna device provided by the embodiment of the present application.
  • FIG. 7 is a schematic diagram of a third structure of an antenna device provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a radiation direction of the antenna device shown in FIG. 6 .
  • FIG. 9 is a schematic diagram of a fourth structure of an antenna device provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of the main board shown in FIG. 9 .
  • FIG. 11 is a schematic diagram of a fifth structure of the antenna device provided by the embodiment of the present application.
  • FIG. 12 is a schematic diagram of a sixth structure of an antenna device provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a seventh structure of an antenna device provided by an embodiment of the present application.
  • FIG. 14 is a schematic diagram of an eighth structure of an antenna device provided by an embodiment of the present application.
  • FIG. 15 is a schematic diagram of a ninth structure of an antenna device provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of a tenth structure of the antenna device provided by the embodiment of the present application.
  • Embodiments of the present application provide an antenna device and electronic equipment.
  • the antenna device can realize the wireless communication function of the electronic equipment.
  • the antenna device can transmit Wi-Fi signals, Global Positioning System (Global Positioning System, referred to as GPS) signals, third-generation mobile communication technology (3th-Generation, referred to as 3G), fourth-generation mobile communication technology (4th-Generation, referred to as 4G), fifth-generation mobile communication technology (5th-Generation, referred to as 5G), near field communication (Near field communication, referred to as NFC) signal, Bluetooth (Bluetooth, referred to as BT) signal, ultra-wideband (Ultra WideBand, referred to as UWB) signal etc.
  • Electronic devices can be smart phones, tablet computers and other devices, and can also be gaming devices, augmented reality (Augmented Reality, AR) devices, automotive devices, data storage devices, audio playback devices, video playback devices, laptops, desktop computing devices Wait.
  • augmented reality Augmented Reality, AR
  • automotive devices data
  • FIG. 1 is a schematic diagram of a first structure of an electronic device provided by an embodiment of the present application.
  • the electronic device 10 may include an antenna device 100 , a display screen 200 , a middle frame 300 , a circuit board 400 , a battery 500 and a rear case 600 .
  • the display screen 200 can be installed on the middle frame 300 and connected to the rear case 600 through the middle frame 300 to form the display surface of the electronic device 10 .
  • the display screen 200 is used for displaying information such as images and texts.
  • the display screen 200 may include a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display and other types of display screens.
  • the display screen 200 may be a full screen display or a non-full screen display.
  • the middle frame 300 may include a frame (not shown) and a carrying board (not shown), and the carrying board may provide support for electronic devices or electronic devices in the electronic device 10 .
  • the frame is connected to the edge of the carrier board and protrudes from the carrier board.
  • the frame can form the side wall of the electronic device, and the frame and the carrier board form a housing space.
  • the electronic components and electronic devices in the electronic device 10 can be installed and fixed in the housing. placed in the space.
  • the circuit board 400 is disposed on the middle frame 300, and the circuit board 400 can be connected with the middle frame 300 to realize fixing.
  • a processor may be integrated on the circuit board 400, and one or more functional components such as an earphone jack, an acceleration sensor, a gyroscope, and a motor may also be integrated. Meanwhile, the circuit board 400 may be electrically connected to the display screen 200 to control the display of the display screen 200 through the processor on the circuit board 400 .
  • the battery 500 is arranged on the middle frame 300, and the battery 500 can be connected with the middle frame 300 for fixing.
  • the battery 500 can be electrically connected to the circuit board 400 so that the battery 500 can provide power for the electronic device 10 .
  • the circuit board 400 may be provided with a power management circuit.
  • the power management circuit is used to distribute the voltage provided by the battery 500 to various electronic devices in the electronic device 10.
  • the rear case 600 may be connected to the middle frame 300 .
  • the rear case 600 can work together with the middle frame 300 and the display screen 200 to seal the electronic devices and functional components of the electronic device 10 inside the electronic device 10 to protect the electronic devices and functional components of the electronic device 10 .
  • the antenna device 100 may be but not limited to be connected to the circuit board 400 , small board, or main board of the electronic device 10 .
  • FIG. 2 is a schematic diagram of a first structure of an antenna device provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a connection of a feed source shown in FIG. 2 .
  • the antenna device 100 may include a feed source 110 , a dielectric substrate 120 , a first antenna array 130 and a second antenna array 140 .
  • the feed source 110 can be arranged on the dielectric substrate 120. At this time, the distance between the feed source 110 and the first antenna array 130 and the second antenna array 140 arranged on the dielectric substrate 120 is relatively close, which is convenient for the feed source 110 design traces.
  • the feed source 110 may not be disposed on the dielectric substrate 120 .
  • the feed source 110 may be disposed on the main board of the antenna device 100 , and the feed source may also be disposed on the circuit board 400 of the electronic device 10 .
  • the embodiment of the present application does not limit the specific setting position of the feed source 110 .
  • the feed source 110 may be directly or indirectly electrically connected to the first antenna array 130, and the feed source 110 may provide an excitation signal to excite the first antenna array 130 to transmit the first wireless signal.
  • the feed source 110 may also be directly or indirectly electrically connected to the second antenna array 140 to stimulate the second antenna array 140 to transmit the second wireless signal.
  • the feed source 110 may be directly or indirectly electrically connected to the first antenna array 130 and the second antenna array 140 through conductive connectors such as metal traces, feeder network, metal plated holes and the like.
  • the feed source 110 can also be connected to the first antenna array 130 and the second antenna array 140 to feed excitation signals to the first antenna array 130 and the second antenna array 140 .
  • the feed source 110 can also be directly or indirectly electrically connected only to the first antenna array 130 to encourage the first antenna array 130 to transmit the first wireless signal.
  • the second antenna array 140 can be electrically connected to the first antenna array 130 or The feeding connection is coupled to enable the second antenna array 140 to transmit the second wireless signal.
  • the embodiment of the present application does not limit the specific electrical connection relationship of the feed source 110 , the first antenna array 130 , and the second antenna array 140 .
  • the dielectric substrate 120 may include a first sub-substrate 121 and a second sub-substrate 122 connected to each other.
  • the sub-substrate 121 may be on different planes.
  • first sub-substrate 121 and the second sub-substrate 122 may form an angle of 90 degrees or approximately 90 degrees.
  • the first sub-substrate 121 and the second sub-substrate 122 can be L-shaped or close to L-shaped.
  • first sub-substrate 121 and the second sub-substrate 122 may also form other included angles, such as acute angle or obtuse angle, and the embodiment of the present application does not limit the specific connection manner of the first sub-substrate 121 and the second sub-substrate 122 .
  • the first sub-substrate 121 can carry a first antenna array 130 , and the first antenna array 130 can be disposed on the first sub-substrate 121 .
  • the first antenna array 130 may be disposed on the upper surface of the first sub-substrate 121 .
  • a feed point 150 may be provided on the first antenna array 130, and the feed point 150 may be electrically connected to the feed source 110, so that the first antenna array 130 may be electrically connected to the feed source 110 through the feed point 150 to transmit the second A wireless signal.
  • the feed point 150 may be a feed pad or a feed solder ball.
  • the feeding point 150 and the first antenna array 130 may be disposed on opposite sides of the first sub-substrate 121 , for example, the feeding point 150 may be disposed on the lower surface of the first sub-substrate 121 .
  • the second sub-substrate 122 can carry a second antenna array 140 , and the second antenna array 140 can be disposed on the second sub-substrate 122 , for example, the second antenna array 140 can be disposed on the outer surface of the second sub-substrate 122 .
  • the second antenna array 140 can also be electrically connected to the feed source 110 to transmit the second wireless signal.
  • a feed point may also be provided on the second antenna array 140 so as to be electrically connected to the feed source 110 through the feed point.
  • the second antenna array 140 may also be electrically connected to the feed source 110 by means of coupling feed.
  • the second antenna array 140 may also share the feed point 150 with the first antenna array 130 so as to be electrically connected to the feed source 110 through the feed point 150 .
  • FIG. 4 is a schematic diagram of electrical connection of the antenna device shown in FIG. 2 .
  • the second antenna array 140 may be connected to the feed point 150 through the first feeder network 160 .
  • the first feeder network 160 can bend and extend from the second sub-substrate 122 toward the direction where the first sub-substrate 121 is located.
  • the second antenna array 140 is connected to the feed source 110 through the first feeder network 160 and the feed point 150 and transmits the Two wireless signals.
  • the feed point 150 is set on the first sub-substrate 121, and the second antenna array 140 set on the second sub-substrate 122 is connected to the feed source 110 through the feed point 150, so that the second sub-substrate The feed point 150 does not need to be disposed on the substrate 122 , which reduces the difficulty of connecting the second antenna array 140 and the feed source 110 .
  • first wireless signal and the second wireless signal may be wireless signals of the same frequency band, and of course, the first wireless signal and the second wireless signal may also be wireless signals of different frequency bands. This embodiment of the present application does not limit it.
  • the first antenna array 130 and the second antenna array 140 may be millimeter wave antenna arrays.
  • the fifth generation mobile communication 5th generation mobile networks, referred to as 5G
  • the frequency range of FR1 frequency band is 450MHz ⁇ 6GHz, also known as sub-6GHz frequency band; the frequency range of FR2 frequency band is 24.25GHz ⁇ 52.6GHz, usually called millimeter wave (mm Wave).
  • 3GPP Release 15 specifies the current 5G millimeter wave frequency bands: N257 (26.5-29.5GHz), N258 (24.25-27.5GHz), N261 (27.5-28.35GHz) and N260 (37-40GHz).
  • both the first antenna array 130 and the second antenna array 140 may include a plurality of millimeter wave antenna units arranged in an array.
  • the feeding point 150 may include a plurality of them, so as to integrate with the plurality of millimeter-wave antenna units of the first antenna array 130 One-to-one correspondence, so that one millimeter-wave antenna unit is connected to one feeding point 150 .
  • each millimeter-wave antenna unit on the second antenna array 140 can be connected to the corresponding feeder on the first feeder network 160 At a feed point 150.
  • each millimeter-wave antenna unit on the second antenna array 140 can also be connected to a millimeter-wave antenna unit on the first antenna array 130 through a corresponding feeder on the first feeder network 160, so that the first antenna array 130 A millimeter-wave antenna element on , is indirectly connected to a feeding point 150 .
  • the antenna device 100 of the embodiment of the present application effectively enhances the transmission performance of the first antenna array 130 and the second antenna array 140 by arranging a plurality of millimeter wave antenna elements Multiple millimeter wave antenna units can meet the requirements of the first antenna array 130 and the second antenna array 140 for transmission in the 5G millimeter wave frequency band.
  • transmission used in transmitting wireless signals includes receiving wireless signals, transmitting wireless signals, and simultaneously receiving and transmitting wireless signals.
  • FIG. 5 is a schematic diagram of a radiation direction of the antenna device shown in FIG. 2 .
  • the first antenna array 130 When the first antenna array 130 is electrically connected to the feed source 110 and transmits the first wireless signal, the first antenna array 130 may have a first radiation direction A1, and the first radiation direction A1 may be determined by the first sub-substrate of the main dielectric substrate 120 121 extends outward and forms a first radiation area.
  • the second antenna array 140 when the second antenna array 140 is electrically connected to the feed source 110 and transmits the second wireless signal, the second antenna array 140 may have a second radiation direction A2, and the second radiation direction A2 may be determined by the second radiation direction A2 of the dielectric substrate 120.
  • the sub-substrate 122 extends outward and forms a second radiation area.
  • first radiation direction A1 may be the main radiation direction of the first antenna array 130
  • second radiation direction A2 may be the main radiation direction of the second antenna array 140 .
  • the first antenna The first radiation direction A1 of the array 130 is different from the second radiation direction A2 of the second antenna array 140 .
  • the first antenna array 130 is disposed on the first sub-substrate 121 of the dielectric substrate 120
  • the second antenna array 140 is disposed on the second sub-substrate 122 of the dielectric substrate 120
  • the first antenna The array 130 and the second antenna array 140 are electrically connected to the feed 110, so that the first antenna array 130 has a first radiation direction A1, and the second antenna array 140 has a second radiation direction A2, which is different from the first radiation direction A2. Radiation direction A1.
  • the antenna device 100 of the embodiment of the present application on the one hand, the antenna device 100 has two different radiation directions, the signal direction covered by the antenna device 100 is wider, and the radiation performance of the antenna device 100 is better; on the other hand, the first The extension direction of a sub-substrate 121 intersects the extension direction of the second sub-substrate 122, the dielectric substrate 120, the first antenna array 130 and the second antenna array 140 can form a special-shaped antenna, and the special-shaped antenna can be based on the circuit board of the electronic device 10 400, so that the special-shaped antenna does not need to improve the circuit board 400 of the electronic device 10, and the adaptability of the special-shaped antenna is better; On the second sub-substrate 122 , the second antenna array 140 can be fixed on an installation object through the second sub-substrate 122 and the first sub-substrate 121 , which can reduce the installation difficulty of the second antenna array 140 .
  • FIG. 6 is a schematic diagram of the second structure of the antenna device provided by the embodiment of the present application
  • FIG. 7 is a schematic structural diagram of the third structure of the antenna device provided by the embodiment of the present application.
  • the dielectric substrate 120 may include one or more third sub-substrates 123 in addition to the first sub-substrate 121 and the second sub-substrate 122.
  • the antenna device 100 includes the first antenna array 130 and the second antenna array 140.
  • a third antenna array 170 may also be included.
  • each third sub-substrate 123 may intersect with the extension direction of the first sub-substrate 121, and may also intersect with the extension direction of the second sub-substrate 122, so that any third sub-substrate 123 and The first sub-substrate 121 and the second sub-substrate 122 are not coplanar.
  • the third sub-substrate 123 may form an X-Y-Z coordinate system.
  • the third sub-substrate 123 may not be perpendicular to the first sub-substrate 121 and the second sub-substrate 122.
  • the angle between the third sub-substrate 123 and the first sub-substrate 121 and the second sub-substrate 122 may be acute or obtuse angles.
  • the embodiment of the present application does not limit the specific positional relationship of the third sub-substrate 123 , the first sub-substrate 121 , and the second sub-substrate 122 , as long as the extension direction of the third sub-substrate 123 intersects the extension direction of the first sub-substrate 121
  • the schemes are all within the protection scope of the present application.
  • first sub-substrate 121 and the second sub-substrate 122 of the dielectric substrate 120 may be integrally formed.
  • the first sub-substrate 121 , the second sub-substrate 122 , and one or more third sub-substrates 123 may also be integrally formed.
  • the number of the third antenna arrays 170 may not be greater than the number of one or more third sub-substrates 123 , and each third antenna array 170 may be disposed on one third sub-substrate 123 .
  • third antenna arrays 170 when the number of third antenna arrays 170 is one or more and equal to the number of third sub-substrates 123 , one third antenna array 170 may correspond to one third sub-substrate 123 , a third antenna array 170 may be disposed on each third sub-substrate 123 .
  • the number of the third antenna array 170 may be less than the number of the third sub-substrate 123 and be zero.
  • the antenna device 100 may not include The third antenna array 170 , at this time, the third sub-substrate 123 may not be provided with the third antenna array 170 , and the third sub-substrate 123 may be used as a wiring flexible board to realize the electrical connection between the feed point 150 and the feed source 110 .
  • the number of sub-substrates included in the dielectric substrate 120 is greater than the number of antenna arrays, some sub-substrates in the dielectric substrate 120 may not be provided with antenna arrays.
  • the sub-substrates on the dielectric substrate 120 that are not provided with an antenna array may serve the functions of assembling, setting up a feeder network, and the like.
  • FIG. 8 is a schematic diagram of a radiation direction of the antenna device shown in FIG. 6 .
  • the third antenna array 170 of the antenna device 100 is arranged on the third sub-substrate 123, the third antenna array 170 can be directly or indirectly electrically connected to the feed source 110, and the third antenna array 170 can also be connected to the feed source 110 through coupling.
  • the third antenna array 170 may also be coupled and connected to the first antenna array 130 or the second antenna array 140 to implement feeding, so that the third antenna array 170 can transmit a third wireless signal and have a third radiation Direction A3.
  • the third radiation direction A3 may extend outward from the third sub-substrate 123 of the dielectric substrate 120 to form a third radiation area.
  • the third radiation direction A3 may be the main radiation direction of the third antenna array 170 .
  • the extension direction of the third sub-substrate 123 intersects the extension directions of the first sub-substrate 121 and the second sub-substrate 122, most of the third radiation area is consistent with the first radiation area and the second radiation area. Most of the areas do not overlap, and the third radiation direction A3 of the third antenna array 170 is different from the first radiation direction A1 of the first antenna array 130 and also different from the second radiation direction A2 of the second antenna array 140 .
  • the antenna device 100 includes a first antenna array 130 with a first radiation direction A1, a second antenna array 140 with a second radiation direction A2, and a third antenna array with a third radiation direction A3 170.
  • the antenna device 100 includes three different radiation directions, and the signal direction covered by the antenna device 100 is wider, so that the radiation performance of the antenna device 100 can be improved.
  • FIG. 9 is a schematic diagram of a fourth structure of an antenna device provided by an embodiment of the present application
  • FIG. 10 is a schematic structural diagram of a main board shown in FIG. 9
  • the antenna device 100 may further include a main board 180 .
  • the motherboard 180 may include a first surface 181 and a third surface 183 oppositely disposed, and a second surface 182 , a fourth surface 184 , and a fifth surface disposed between the first surface 181 and the third surface 183 . face 185 and sixth face 186 .
  • the extension directions of the second surface 182, the fourth surface 184, the fifth surface 185 and the sixth surface 186 can all intersect with the extension directions of the first surface 181 and the third surface 183, so that the second surface 182, the fourth surface 184 , the fifth surface 185 and the sixth surface 186 are not coplanar with the first surface 181 and the third surface 183 .
  • the second surface 182, the fourth surface 184, the fifth surface 185 and the sixth surface 186 can be directly or indirectly connected with the first surface 181 and the third surface 183, and at this time, the main board 180 can be a rectangular thin plate structure.
  • main board 180 can also be a structure of other shapes, such as but not limited to prisms, pentagons, hexagons, polygons, etc., and the main board 180 can also include more faces, such as the seventh face, the eighth face noodle.
  • the present application does not limit the specific structure of the main board 180 .
  • the main board 180 can carry the dielectric substrate 120 and the antenna array. at least a portion of the circuit board 400 .
  • the circuit board 400 of the electronic device 10 may include the main board 180 of the antenna device 100 .
  • the embodiment of the present application does not limit the specific structure of the main board 180 , and any structure capable of carrying the dielectric substrate 120 and the antenna array can be within the scope of protection of the embodiment of the present application.
  • the first surface 181 and the second surface 182 of the main board 180 are connected to each other, and the extending direction of the second surface 182 may intersect with the extending direction of the first surface 181.
  • the second surface of the dielectric substrate 120 A sub-substrate 121 can be connected to the first surface 181 of the main board 180, for example, the lower surface of the first sub-substrate 121 can be bonded and connected to the first surface 181; the second sub-substrate 122 of the dielectric substrate 120 can be connected to the main board 180
  • the second surface 182 for example, the inner surface of the second sub-substrate 122 can be attached and connected to the second surface 182 .
  • each third sub-substrate 123 can be connected to other suitable surfaces of the main board 180 that are different from the first surface 181 and the second surface 182.
  • the third sub-substrate 123 can be connected to the fourth side 184 , the fifth side 185 , the sixth side 186 . . . .
  • the extension direction of the surface connected to the third sub-substrate 123 on the main board 180 may intersect with the extension directions of the first surface 181 and the second surface 182, so that when the third array antenna 170 is arranged on the third sub-substrate When the substrate 123 is used, the radiation direction of the third antenna array 170 is different from the radiation directions of the first antenna array 130 and the second antenna array 140 .
  • the first antenna array 130 is connected to the first surface 181 of the main board 180 through the first sub-substrate 121
  • the second antenna array 140 is connected to the second surface 182 of the main board 180 through the second sub-substrate 122
  • the size of the first antenna array 130 and the second antenna array 140 in the thickness direction of the main board 180 is relatively small, which can reduce the section height of the antenna device 100 and realize the miniaturization of the antenna device 100; and, due to the second The size of the surface 182 in the thickness direction of the main board 180 is small, and it is difficult to fix the antenna radiator on the second surface 182.
  • the second The antenna array 140 can be connected to the second surface 182 of the main board 180 through the second sub-substrate 122 and the first sub-substrate 121 , which can reduce the installation difficulty of the second antenna array 140 .
  • FIG. 11 is a schematic diagram of a fifth structure of the antenna device provided by the embodiment of the present application.
  • the first antenna array 130 and the feed point 150 can be connected to the first surface 181 of the main board 180 through the first sub-substrate 121, the feed source 110 can be arranged on the third surface 183 of the main board 180, and the feed source 110 can be connected to the first antenna array. 130 is disposed on a different surface of the main board 180 .
  • the metal plated hole 187 that runs through the first surface 181 and the third surface 183 can also be provided on the main board 180, and metal plating operation can be performed on the hole wall of the metal plated hole 187, so that it is connected to the first
  • the feed point 150 on the surface can be electrically connected to the feed source 110 on the third surface 183 through the wall of the metal plated hole 187 , so as to realize the electrical connection between the feed source 110 and the first antenna array 130 and the second antenna array 140 .
  • the feed source 110 can also be coupled and fed to the first antenna array 130 through the metal plated hole 187. At this time, the feed source 110 and the first antenna array 130 can be coupled and fed without using physical electrical devices. Electricity.
  • the feed source 110 can be arranged opposite to the first antenna array 130 , so that the plated metal hole 187 can vertically pass through along the thickness direction of the main board 180 .
  • the number of metal plated holes 187 may not be less than the number of feed points 150 , and each feed point 150 may be electrically connected to the feed source 110 through one metal plated hole 187 .
  • the antenna device 100 may also include a feed end 111 electrically connected to the feed source 110, the feed end 111 may be disposed on the third surface 183 of the main board 180, and the number of the feed end 111 may be the same as that of the feed point 150 , the number of metal plated holes 187 is equal, and the multiple feed terminals 111 correspond to the multiple metal plated holes 187 and the multiple feed points 150 one by one.
  • One end of the metal plated hole 187 can be electrically connected to the feed point 150, and the other end of the metal plated hole 187 can be electrically connected to the feed end 111, so that the first antenna array 130 can pass through the feed point 150, the metal plated hole 187,
  • the feed end 111 is electrically connected to the feed source 110 .
  • the feed source 110 and the first antenna array 130 are arranged on different surfaces of the main board 180.
  • the first antenna array 130 can be arranged directly opposite to the feed source 110 and can be directly or indirectly realized through the metal plated hole 187. Therefore, the difficulty of electrical connection between the first antenna array 130 and the feed source 110 can be reduced, and the number of wirings for the electrical connection between the two can be reduced.
  • FIG. 12 is a schematic diagram of the sixth structure of the antenna device provided by the embodiment of the present application.
  • the first antenna array 130 , the feed point 150 and the feed source 110 can all be connected to the first surface 181 of the main board 180 , the feed source 110 and the first antenna array 130 may be disposed on the same surface of the main board 180 .
  • first antenna array 130 and the feed source 110 can be arranged at intervals, so that the first antenna array 130 and the feed source 110 can be connected to different areas of the first surface 181 of the main board 180 .
  • the antenna device 100 may further include a second feeder network 190 , and at least part of the second feeder network 190 may be disposed on the first surface 181 .
  • One end of the second feeder network 190 can be electrically connected to the feed point 150, and the other end of the second feeder network 190 can be electrically connected to the feed end 111, so that the feed point 150 can be connected to the feed source through the second feeder network 190. 110 electrical connections.
  • the dielectric substrate 120 may further include an extension sub-substrate 124 .
  • the extension sub-substrate 124 can be connected to the first sub-substrate 121 and extend toward the direction where the feed source 110 is located.
  • the lower surface of the extension sub-substrate 124 can be attached to the first surface 181 .
  • extension sub-substrate 124 may be a feeder soft board, and the feed point 150 of the first antenna array 130 may be electrically connected to the feed source 110 through the extension sub-substrate 124 .
  • extension sub-substrate 124 can also serve as a carrier for the feeder network, at least part of the second feeder network 190 can be located on the first sub-substrate 121 and the extension sub-substrate 124 at the same time, and the second feeder network 190 can pass through the extension sub-substrate 124 It is electrically connected with the feed source 110 .
  • the feed source 110 and the first antenna array 130 are arranged on the same surface of the main board 180 , and the size of the antenna device 100 in the thickness direction is smaller, which facilitates miniaturization of the antenna device 100 .
  • the feed source 110 may also be disposed on the dielectric substrate 120, such as the first sub-substrate 121 of the dielectric substrate 120.
  • the antenna device 100 may also include a third feeder network (not shown), the third feeder network may be disposed inside the first sub-substrate 121, and the third feeder network may be connected to the first antenna array disposed on the first sub-substrate 121 130 and feed 110.
  • the second antenna array 140 may also be electrically connected to the feed source 110 through the third feed line network.
  • the feed source 110 can also be arranged on other areas on the dielectric substrate 120, such as the second sub-substrate 122 and the third sub-substrate 123, and the embodiment of the present application does not discuss the specific location of the feed source 110. limited.
  • the feed source 110 and the feed point 150 can also be connected through hot-press soldering, board-to-board connectors (Board-to-board connectors), etc. -board Connectors) and other methods to achieve electrical connection, which will not be repeated here.
  • the dielectric substrate 120 may include a flexible material substrate.
  • the first sub-substrate 121 of the dielectric substrate 120 may include a first flexible layer
  • the second sub-substrate 122 of the dielectric substrate 120 may include a second flexible layer.
  • the feed source 110 may be disposed on the first sub-substrate 121 .
  • first flexible layer can be connected to the first surface 181, and the other side of the first flexible layer can be provided with the first antenna array 130; one side of the second flexible layer can be connected to the second surface 182, The other side of the second flexible layer may be provided with a second antenna array 140 .
  • the second flexible layer can be connected with the first flexible layer, for example, the first flexible layer and the second flexible layer can be integrally formed and connected, so that the dielectric substrate 120 can be a flexible substrate, which is convenient to be connected with the first flexible layer of the motherboard 180.
  • the surface 181 and the second surface 182 are connected.
  • the dielectric substrate 120 may also include flexible materials and rigid materials at the same time.
  • FIG. 14 is a schematic diagram of an eighth structure of an antenna device provided by an embodiment of the present application.
  • the first sub-substrate 121 of the dielectric substrate 120 may include a base layer 1212 and a first flexible layer 1211 which are stacked, and the second sub-substrate 122 may include a second flexible layer 1221 .
  • the hardness of the base layer 1212 may be greater than that of the first flexible layer 1211 .
  • the base layer 1212 may be connected to the first surface 181 , and the first antenna array 130 may be disposed on a side of the first flexible layer 1211 away from the base layer 1212 .
  • the second flexible layer 1221 can be provided with the second antenna array 140 on the side away from the main board 180 , the second flexible layer 1221 is connected to the second surface 182 , and the second flexible layer 1221 can be connected to the first flexible layer 1211 .
  • the feed source 110 when the feed source 110 is disposed on the first sub-substrate 121 , the feed source 110 may be disposed on the first flexible layer 1211 or the base layer 1212 .
  • the first sub-substrate 121 includes a rigid base layer 1212 and a first flexible layer 1211.
  • the base layer 1212 can carry the first flexible layer 1211, which can increase the hardness of the first sub-substrate 121.
  • the rigid base layer 1212 is more easily fixedly connected to the main board 180 , which can increase the connection stability of the dielectric substrate 120 .
  • FIG. 15 is a schematic diagram of the ninth structure of the antenna device provided by the embodiment of the present application.
  • the feed source 110 may include a first sub-feed source 112, and the first sub-feed source 112 may be connected to the first antenna array 130 is directly or indirectly electrically connected, so that the first antenna array 130 can transmit a first wireless signal; the first sub-feed 112 can also be directly or indirectly electrically connected with the second antenna array 140, so that the second antenna array 140 can Transmit a second wireless signal.
  • the first sub-feed 112 can provide an excitation signal to the first antenna array 130 and the second antenna array 140 at the same time, and the excitation signal can excite the first antenna array 130 to transmit the first wireless signal, and excite the second antenna array 130 to transmit the first wireless signal.
  • the array 140 transmits the second wireless signal.
  • first wireless signal and the second wireless signal may be wireless signals with the same frequency band, but they have different radiation directions.
  • first wireless signal and the second wireless signal may also be wireless signals with different frequency bands and different radiation directions.
  • the embodiment of the present application does not limit the specific frequency bands of the first wireless signal and the second wireless signal.
  • the feed source 110 only includes the first sub-feed source 112, and the first sub-feed source 112 can provide excitation signals to the first antenna array 130 and the second antenna array 140 at the same time, so that the feed source 110 Smaller size.
  • FIG. 16 is a schematic diagram of a tenth structure of the antenna device provided by the embodiment of the present application.
  • the feed 110 may include a first sub-feed 112 and a second sub-feed 113, and the first sub-feed 112 may be directly or indirectly electrically connected to the first antenna array 130, so that the transmission of the first antenna array 130 may be first wireless signal; the second sub-feed 113 can be directly or indirectly electrically connected to the second antenna array 140, or the second sub-feed 113 can be coupled to the second antenna array 140 so that the second antenna array 140 can transmit Second wireless signal.
  • first sub-feed 112 and the second sub-feed 113 can provide excitation signals of different frequency bands, so that the frequency bands of the first wireless signal and the second wireless signal are different; the first sub-feed 112 and the second sub-feed The sub-feed 113 may also provide excitation signals of the same frequency band, so that the frequency bands of the first wireless signal and the second wireless signal are the same.
  • the feed 110 includes a first sub-feed 112 and a second sub-feed 113.
  • the first sub-feed 112 can provide an excitation signal to the first antenna array 130 alone, and the second sub-feed
  • the source 113 may separately provide an excitation signal to the second antenna array 140 , thereby facilitating separate tuning of the first antenna array 130 and the second antenna array 140 .
  • the electronic device 10 may include a radio frequency transceiver module (not shown in the figure) that provides and transmits an excitation signal.
  • the radio frequency transceiver module may be but not limited to be arranged on the circuit board 400 of the electronic device 10.
  • the source 110, the first antenna array 130 and the second antenna array 140 of the antenna device 100 can be electrically connected with the transceiver module of the device to transmit the first wireless signal and the second wireless signal.

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Abstract

一种天线装置及电子设备,天线装置包括介质基板、第一天线阵列和第二天线阵列,介质基板的第二子基板的延伸方向与介质基板的第一子基板的延伸方向相交,第一天线阵列设置于第一子基板,第二天线阵列设置于第二子基板,第一天线阵列具有第一辐射方向,第二天线阵列具有第二辐射方向,第二辐射方向不同于第一辐射方向。

Description

天线装置及电子设备
本申请要求于2021年06月21日提交中国专利局、申请号为202110687580.6、发明名称为“天线装置及电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域,特别涉及一种天线装置及电子设备。
背景技术
随着通信技术的发展,诸如智能手机等电子设备能够实现的功能越来越多,电子设备的通信模式也更加多样化。可以理解的,电子设备的每一种通信模式都需要相应的天线来支持。
发明内容
本申请提供一种天线装置及电子设备,天线装置占据的空间较小。
第一方面,本申请提供一种天线装置,包括:
介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向。
第二方面,本申请提供一种电子设备,包括天线装置,所述天线装置包括:
介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向。
第三方面,本申请提供一种电子设备,包括天线装置和电路板;所述天线装置包括:
介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向;
所述电路板包括相互连接的第一面和第二面,所述第二面的延伸方向与所述第一面的延伸方向相交,所述第一子基板连接于所述第一面,所述第二子基板连接于所述第二面。
附图说明
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的第一种结构示意图。
图2为本申请实施例提供的天线装置的第一种结构示意图。
图3为图2所示的馈源的一种连接示意图。
图4为图2所示的天线装置的一种电连接示意图。
图5为图2所示的天线装置的一种辐射方向示意图。
图6为本申请实施例提供的天线装置的第二种结构示意图。
图7为本申请实施例提供的天线装置的第三种结构示意图。
图8为图6所述的天线装置的一种辐射方向示意图。
图9为本申请实施例提供的天线装置的第四种结构示意图。
图10为图9所示的主板的一种结构示意图。
图11本申请实施例提供的天线装置的第五种结构示意图。
图12为本申请实施例提供的天线装置的第六种结构示意图。
图13为本申请实施例提供的天线装置的第七种结构示意图。
图14为本申请实施例提供的天线装置的第八种结构示意图。
图15为本申请实施例提供的天线装置的第九种结构示意图。
图16为本申请实施例提供的天线装置的第十种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图1至附图16,对本申请实施例中的技 术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
本申请实施例提供一种天线装置和电子设备。天线装置可以实现电子设备的无线通信功能。例如天线装置可以传输Wi-Fi信号、全球定位系统(Global Positioning System,简称GPS)信号、第三代移动通信技术(3th-Generation,简称3G)、第四代移动通信技术(4th-Generation,简称4G)、第五代移动通信技术(5th-Generation,简称5G)、近场通信(Near field communication,简称NFC)信号、蓝牙(Blue tooth,简称BT)信号、超宽带(Ultra WideBand,简称UWB)信号等。电子设备可以是智能手机、平板电脑等设备,还可以是游戏设备、增强现实(Augmented Reality,简称AR)设备、汽车装置、数据存储装置、音频播放装置、视频播放装置、笔记本电脑、桌面计算设备等。
请参考图1,图1为本申请实施例提供的电子设备的第一种结构示意图。电子设备10可以包括天线装置100、显示屏200、中框300、电路板400、电池500和后壳600。
显示屏200可以安装在中框300上,并通过中框300连接至后壳600上,以形成电子设备10的显示面。显示屏200用于显示图像、文本等信息。其中,显示屏200可以包括液晶显示屏(Liquid Crystal Display,LCD)或有机发光二极管(Organic Light-Emitting Diode,OLED)显示屏等类型的显示屏。显示屏200可以是全面屏显示屏,也可以是非全面屏显示屏。
中框300可以包括边框(图未示)和承载板(图未示),承载板可以为电子设备10中的电子器件或电子器件提供支撑作用。边框连接于承载板的边缘并凸出于承载板,边框可以形成电子设备的侧壁,边框和承载板形成一容置空间,电子设备10中的电子元件、电子器件可以安装并固定在该容置空间内。
电路板400设置在中框300上,电路板400可以与中框300连接以实现固定。电路板400上可以集成有处理器,此外还可以集成耳机接口、加速度传感器、陀螺仪、马达等功能组件中的一个或多个。同时,电路板400可以电连接至显示屏200,以通过电路板400上的处理器对显示屏200的显示进行控制。
电池500设置在中框300上,电池500可以与中框300连接以实现固定。电池500可电连接至电路板400,以实现电池500为电子设备10供电。其中,电路板400上可以设置有电源管理电路。电源管理电路用于将电池500提供的 电压分配到电子设备10中的各个电子器件。
后壳600可以与中框300连接。后壳600可与中框300、显示屏200共同将电子设备10的电子器件和功能组件密封在电子设备10内部,以对电子设备10的电子器件和功能组件形成保护作用。
天线装置100可以但不限于连接于电子设备10的电路板400、小板、主板上。请参考图2和图3,图2为本申请实施例提供的天线装置的第一种结构示意图,图3为图2所示的馈源的一种连接示意图。天线装置100可以包括馈源110、介质基板120、第一天线阵列130和第二天线阵列140。
如图3所示,馈源110可以设置于介质基板120上,此时,馈源110与设置于介质基板120上的第一天线阵列130和第二天线阵列140的距离较近,便于馈源110设计走线。
当然,如图2所示,馈源110也可以不设置于介质基板120上。例如,馈源110可以设置于天线装置100的主板上,馈源还可以设置于电子设备10的电路板400上。本申请实施例对馈源110的具体设置位置不进行限定。
馈源110可以与第一天线阵列130直接或间接电连接,馈源110可以提供激励信号,以激励第一天线阵列130传输第一无线信号。当然,馈源110也可以与第二天线阵列140直接或间接电连接,以激励第二天线阵列140传输第二无线信号。
可以理解的是,馈源110可以通过导电连接件例如金属走线、馈线网络、金属镀孔等与第一天线阵列130、第二天线阵列140直接或间接电连接。
可以理解的是,馈源110也可以通过耦合连接的方式实现与第一天线阵列130、第二天线阵列140馈电,以向第一天线阵列130和第二天线阵列140馈入激励信号。当然,馈源110还可以只与第一天线阵列130直接或间接电连接以激励第一天线阵列130传输第一无线信号,此时,第二天线阵列140可与第一天线阵列130电连接或者耦合馈电连接,以实现第二天线阵列140传输第二无线信号。
需要说明的是,本申请实施例对馈源110、第一天线阵列130、第二天线阵列140的具体电连接关系不进行限定。
介质基板120可以包括相互连接的第一子基板121和第二子基板122,第二子基板122的延伸方向可与第一子基板121的延伸方向相交,以使得第二子基板122和第一子基板121可以处于不同的平面上。
可以理解的是,第一子基板121和第二子基板122可呈90度或大致为90度的角度,此时,在介质基板120的横截面上,第一子基板121和第二子基板122可呈L型或接近L型。
当然,第一子基板121和第二子基板122也可以呈其他的夹角,例如锐角或钝角,本申请实施例对第一子基板121和第二子基板122的具体连接方式不进行限定。
第一子基板121可以承载第一天线阵列130,第一天线阵列130可以设置于第一子基板121。例如,第一天线阵列130可以设置于第一子基板121的上表面。第一天线阵列130上可以设有馈电点150,该馈电点150可以与馈源110电连接,从而第一天线阵列130可以通过该馈电点150与馈源110电连接,以传输第一无线信号。
可以理解的是,馈电点150可以是馈电焊盘、馈电焊球。馈电点150和第一天线阵列130可相对设置于第一子基板121的两面,例如,该馈电点150可以设置于第一子基板121的下表面。
第二子基板122可以承载第二天线阵列140,第二天线阵列140可以设置于第二子基板122,例如,第二天线阵列140可以设置于第二子基板122的外侧面。第二天线阵列140也可以与馈源110电连接,以传输第二无线信号。
可以理解的是,第二天线阵列140上也可以设置馈电点,以通过馈电点与馈源110电连接。当然,第二天线阵列140也可以通过耦合馈电的方式与馈源110电连接。
可以理解的是,第二天线阵列140也可以与第一天线阵列130共用馈电点150,以通过馈电点150与馈源110电连接。
示例性的,请参考图4,图4为图2所示的天线装置的一种电连接示意图。第二天线阵列140可以通过第一馈线网络160连接于馈电点150。第一馈线网络160可以从第二子基板122朝着第一子基板121所在的方向弯折延伸,第二天线阵列140通过第一馈线网络160和馈电点150连接于馈源110并传输第二无线信号。
本申请实施例的天线装置100,馈电点150设置于第一子基板121,设置于第二子基板122的第二天线阵列140通过该馈电点150与馈源110连接,使得第二子基板122上不需要设置于馈电点150,可以降低了第二天线阵列140与馈源110的连接难度。
可以理解的是,第一无线信号和第二无线信号可以是同频段的无线信号,当然,第一无线信号和第二无线信号也可以是不同频段的无线信号。本申请实施例对此不进行限定。
可以理解的是,第一天线阵列130和第二天线阵列140可以是毫米波天线阵列。根据5GPP TS 38.103(5rd Generation Partnership Project第五代合作伙伴计划)协议的规定,第五代移动通信(5th generation mobile networks,简称5G)主要使用两段频率:FR1频段和FR2频段。FR1频段的频率范围是450MHz~6GHz,又叫sub-6GHz频段;FR2频段的频率范围是24.25GHz~52.6GHz,通常叫它毫米波(mm Wave)。3GPP Release 15版本规范了目前5G毫米波频段:N257(26.5~29.5GHz),N258(24.25~27.5GHz),N261(27.5~28.35GHz)和N260(37~40GHz)。
上述毫米波对应的波长范围为1mm~10mm。由于毫米波的波长较短,传输过程中容易受到阻碍,因此,第一天线阵列130和第二天线阵列140均可以包括阵列排布的多个毫米波天线单元。
可以理解的是,当第一天线阵列130包括阵列排布的多个毫米波天线单元时,该馈电点150可以包括多个,以便于与第一天线阵列130的多个毫米波天线单元一一对应,使得一个毫米波天线单元连接于一个馈电点150。
可以理解的是,当第二天线阵列140通过第一馈线网络160连接于馈电点150时,第二天线阵列140上的每一个毫米波天线单元可以通过第一馈线网络160上对应的馈线连接于一个馈电点150。当然,第二天线阵列140上的每一个毫米波天线单元也可以通过第一馈线网络160上对应的馈线连接于一个第一天线阵列130上的一个毫米波天线单元,以通过第一天线阵列130上的一个毫米波天线单元与一个馈电点150间接连接。
本申请实施例的天线装置100,通过将多个毫米波天线单元间隔排布,有效地增强了第一天线阵列130和第二天线阵列140的传输性能,通过在介质基板120上设置矩阵排列的多个毫米波天线单元,可以满足第一天线阵列130、第二天线阵列140的5G毫米波频段传输的需求。需要说明的是,上述用于传输无线信号中的“传输”包含接收无线信号、发射无线信号,以及同时接收和发射无线信号。
请结合图2并请参考图5,图5为图2所示的天线装置的一种辐射方向示意图。当第一天线阵列130与馈源110电连接并传输第一无线信号时,第一天 线阵列130可以具有第一辐射方向A1,该第一辐射方向A1可以由主介质基板120的第一子基板121向外延伸并形成第一辐射区域。同理,当第二天线阵列140与馈源110电连接并传输第二无线信号时,第二天线阵列140可以具有第二辐射方向A2,该第二辐射方向A2可以由介质基板120的第二子基板122向外延伸并形成第二辐射区域。
可以理解的是,第一辐射方向A1可以是第一天线阵列130的主辐射方向,第二辐射方向A2可以是第二天线阵列140的主辐射方向。
可以理解的是,由于第一子基板121的延伸方向与第二子基板122的延伸方向相交,进而,第一辐射区域的大部分区域与第二辐射区域的大部分区域不重叠,第一天线阵列130的第一辐射方向A1不同于第二天线阵列140的第二辐射方向A2。
本申请实施例的电子设备10及天线装置100,第一天线阵列130设置于介质基板120的第一子基板121,第二天线阵列140设置于介质基板120的第二子基板122,第一天线阵列130和第二天线阵列140电连接于馈源110,使得第一天线阵列130具有第一辐射方向A1,第二天线阵列140具有第二辐射方向A2,第二辐射方向A2不同于与第一辐射方向A1。基于此,本申请实施例的天线装置100,一方面,天线装置100具有两个不同的辐射方向,天线装置100覆盖的信号方向更广,天线装置100的辐射性能更优;另一方面,第一子基板121的延伸方向与第二子基板122的延伸方向相交,介质基板120、第一天线阵列130和第二天线阵列140可形成一异型天线,该异型天线可根据电子设备10的电路板400的形状进行设计,从而该异型天线对电子设备10的电路板400没有改进需求,异形天线的适应性更好;并且,由于第二天线阵列140设置在与第一子基板121相互连接的第二子基板122上,第二天线阵列140可以通过第二子基板122和第一子基板121固定于安装物体上,可以降低第二天线阵列140的安装难度。
其中,请参考图6和图7,图6为本申请实施例提供的天线装置的第二种结构示意图,图7为本申请实施例提供的天线装置的第三种结构示意图。介质基板120除了包括第一子基板121、第二子基板122外还可以包括一个或多个第三子基板123,相应的,天线装置100除了包括第一天线阵列130和第二天线阵列140外还可以包括第三天线阵列170。
可以理解的是,每一个第三子基板123的延伸方向可以与第一子基板121 的延伸方向相交,也可与第二子基板122的延伸方向相交,从而,任意一个第三子基板123与第一子基板121、第二子基板122不共面。
可以理解的是,如图6、图7所示,当第三子基板123垂直于或近似垂直第一子基板121和第二子基板122时,第一子基板121、第二子基板122和第三子基板123可以形成X-Y-Z坐标系。
当然,第三子基板123也可以不垂直于第一子基板121、第二子基板122,例如,第三子基板123与第一子基板121、第二子基板122之间的夹角可为锐角或钝角。本申请实施例对第三子基板123、第一子基板121、第二子基板122的具体位置关系不进行限定,凡是满足第三子基板123的延伸方向与第一子基板121的延伸方向相交的方案均在本申请的保护范围内。
可以理解的是,介质基板120的第一子基板121、第二子基板122可以为一体成型结构。第一子基板121、第二子基板122、一个或多个第三子基板123也可以为一体成型结构。
其中,第三天线阵列170的数量可以不大于一个或多个第三子基板123的数量,每一个第三天线阵列170可以设置于一个第三子基板123上。
可以理解的是,如图6所示,当第三天线阵列170的数量为一个或多个且等于第三子基板123的数量时,一个第三天线阵列170可与一个第三子基板123对应,每一个第三子基板123上均可以设置一个第三天线阵列170。
再例如,如图7所示,当第三子基板123的数量为一个时,第三天线阵列170的数量可以少于第三子基板123的数量而为零,此时,天线装置100可不包括第三天线阵列170,此时,第三子基板123上可不设置第三天线阵列170,第三子基板123可作为走线软板实现馈电点150与馈源110的电连接。
本申请实施例的天线装置100,当介质基板120包括的子基板的数量多于天线阵列的数量时,介质基板120存在部分子基板可以不设置天线阵列。介质基板120上未设置天线阵列的子基板可以起到装配作用、设置馈线网络作用等。
需要说明的是,本申请实施例的第三天线阵列170和第三子基板123的具体数量可不局限于上述举例,本申请实施例对此不进行具体限定。
请结合图6并请参考图8,图8为图6所述的天线装置的一种辐射方向示意图。当天线装置100的第三天线阵列170设置于第三子基板123时,第三天线阵列170可以与馈源110直接或间接电连接,第三天线阵列170也可以与馈源110通过耦合连接的方式实现馈电,或者,第三天线阵列170也可以与第一 天线阵列130或第二天线阵列140耦合连接实现馈电,以使得第三天线阵列170可以传输第三无线信号并具有第三辐射方向A3。
可以理解的是,第三辐射方向A3可以由介质基板120的第三子基板123向外延伸并形成第三辐射区域。第三辐射方向A3可以是第三天线阵列170的主辐射方向。
可以理解的是,由于第三子基板123的延伸方向与第一子基板121、第二子基板122的延伸方向相交,进而,第三辐射区域的大部分区域与第一辐射区域、第二辐射区域的大部分区域不重叠,第三天线阵列170的第三辐射方向A3不同于第一天线阵列130的第一辐射方向A1、也不同于第二天线阵列140的第二辐射方向A2。
本申请实施例的天线装置100,天线装置100包括具有第一辐射方向A1的第一天线阵列130、具有第二辐射方向A2的第二天线阵列140和具有第三辐射方向A3的第三天线阵列170,天线装置100包括三个不同的辐射方向,天线装置100覆盖的信号方向更广,可以提高天线装置100的辐射性能。
其中,请参考图9和图10,图9为本申请实施例提供的天线装置的第四种结构示意图,图10为图9所示的主板的一种结构示意图。天线装置100还可以包括主板180。
如图10所示,主板180可以包括相对设置的第一面181和第三面183,以及设置于第一面181、第三面183之间的第二面182、第四面184、第五面185和第六面186。第二面182、第四面184、第五面185和第六面186的延伸方向可与第一面181、第三面183的延伸方向均相交,以使得第二面182、第四面184、第五面185和第六面186与第一面181、第三面183不共面。
可以理解的是,第二面182、第四面184、第五面185和第六面186可以与第一面181、第三面183直接或间接连接,此时,主板180可为矩形的薄板结构。
可以理解的是,主板180也可以为其他形状的结构,例如但不限于棱柱、五边体、六边体、多边体等,主板180还可以包括更多的面,例如第七面、第八面……。本申请对主板180的具体结构不进行限定。
可以理解的是,主板180可以承载介质基板120及天线阵列,主板180可以但不限于是电子设备10的中框300的承载板的至少一部分、电子设备10的天线支架的至少一部分、电子设备10的电路板400的至少一部分。例如, 电子设备10的电路板400可以包括天线装置100的主板180。
需要说明的是,本申请实施例对主板180的具体结构不进行限定,凡是能承载介质基板120及天线阵列的结构均可在本申请实施例的保护范围内。
其中,如图9所示,主板180的第一面181与第二面182相互连接,且第二面182的延伸方向可与第一面181的延伸方向相交,此时,介质基板120的第一子基板121可以连接于主板180的第一面181,例如,第一子基板121的下表面可贴合并连接于第一面181;介质基板120的第二子基板122可以连接于主板180的第二面182,例如第二子基板122的内表面可贴合并连接于第二面182上。
可以理解的是,当介质基板120还包括一个或多个第三子基板123时,每一个第三子基板123可以连接于主板180的区别于第一面181、第二面182的其他适宜的面上,例如第三子基板123可以连接于第四面184、第五面185、第六面186……。
可以理解的是,主板180上与第三子基板123连接的面的延伸方向可以与第一面181、第二面182的延伸方向相交,以使得当第三阵列天线170设置于该第三子基板123时,第三天线阵列170的辐射方向不同于第一天线阵列130、第二天线阵列140的辐射方向。
本申请实施例的天线装置100,第一天线阵列130通过第一子基板121连接于主板180的第一面181,第二天线阵列140通过第二子基板122连接于主板180的第二面182上,第一天线阵列130和第二天线阵列140在主板180的厚度方向上的尺寸较小,可以减少天线装置100的剖面高度,实现天线装置100的小型化;并且,由于主板180的第二面182在主板180厚度方向上的尺寸较小,第二面182上较难以固定天线辐射体,而本申请实施例中由于第二子基板122与第一子基板121相互连接,从而,第二天线阵列140可以通过第二子基板122和第一子基板121连接于主板180的第二面182,可以降低第二天线阵列140的安装难度。
基于上述天线装置100的结构,请参考图11,图11本申请实施例提供的天线装置的第五种结构示意图。第一天线阵列130、馈电点150可通过第一子基板121连接于主板180的第一面181,馈源110可以设置于主板180的第三面183,馈源110可以与第一天线阵列130设置于主板180的异面。
如图10所示,主板180上还可以设置有贯穿第一面181和第三面183的 金属镀孔187,该金属镀孔187的孔壁上可以进行金属镀操作,以使得连接于第一面的馈电点150可以通过金属镀孔187的孔壁与第三面183的馈源110电连接,从而实现馈源110与第一天线阵列130、第二天线阵列140的电连接。
可以理解的是,馈源110也可以通过金属镀孔187与第一天线阵列130耦合馈电,此时,馈源110可与第一天线阵列130不通过物理上的电性器件而实现耦合馈电。
可以理解的是,馈源110可以与第一天线阵列130正对设置,以使得金属镀孔187可以沿主板180的厚度方向垂直穿过。
可以理解的是,金属镀孔187的数量可以不少于馈电点150的数量,每一馈电点150可以通过一个金属镀孔187电连接于馈源110。
可以理解的是,天线装置100还可以包括与馈源110电连接的馈电端111,馈电端111可以设置于主板180的第三面183上,馈电端111的数量可以与馈电点150、金属镀孔187的数量相等,多个馈电端111与多个金属镀孔187、多个馈电点150一一对应。金属镀孔187的一端可以与馈电点150电连接,金属镀孔187的另一端可以与馈电端111电连接,从而,第一天线阵列130可以通过馈电点150、金属镀孔187、馈电端111与馈源110电连接。
本申请实施例的天线装置100,馈源110与第一天线阵列130设置于主板180的异面,第一天线阵列130可以与馈源110正对设置并可通过金属镀孔187实现直接或间接连接,从而,可以降低第一天线阵列130与馈源110的电连接难度,减少二者电连接的布线数量。
其中,请参考图12,图12为本申请实施例提供的天线装置的第六种结构示意图,第一天线阵列130、馈电点150和馈源110可以均连接于主板180的第一面181,馈源110与第一天线阵列130可以设置于主板180的同一面。
可以理解的是,第一天线阵列130与馈源110可以间隔设置,以使得第一天线阵列130与馈源110可以连接于主板180的第一面181的不同区域。
可以理解的是,如图12所示,天线装置100还可以包括第二馈线网络190,至少部分第二馈线网络190可以设置于第一面181。第二馈线网络190的一端可以与馈电点150电连接,第二馈线网络190的另一端可以与馈电端111电连接,以使得馈电点150可以通过该第二馈线网络190与馈源110电连接。
其中,当第一天线阵列130与馈源110连接于主板180的同面且馈源110与第一天线阵列130之间的距离较远时,请参考图13,图13为本申请实施例 提供的天线装置的第七种结构示意图,介质基板120还可以包括延伸子基板124。
延伸子基板124可以与第一子基板121连接且朝着馈源110所在的方向延伸,延伸子基板124与第一子基板121可以位于第二子基板122的同一侧,延伸子基板124可以连接于主板180的第一面181,例如延伸子基板124的下表面可与第一面181贴合。
可以理解的是,延伸子基板124可为馈线软板,第一天线阵列130的馈电点150可以通过延伸子基板124与馈源110电连接。
可以理解的是,延伸子基板124也可作为馈线网络的承载体,至少部分第二馈线网络190可以同时位于第一子基板121和延伸子基板124,第二馈线网络190可以通过延伸子基板124与馈源110电连接。
本申请实施例的天线装置100,馈源110与第一天线阵列130设置于主板180的同一面,天线装置100在厚度方向上的尺寸更小,便于实现天线装置100的小型化。
可以理解的是,馈源110除了设置于主板180的第一面181或者第三面183,还可以设置于介质基板120上,例如设置于介质基板120的第一子基板121上,此时,天线装置100还可以包括第三馈线网络(图未示),第三馈线网络可以设置于第一子基板121的内部,第三馈线网络可以连接设置于第一子基板121上的第一天线阵列130和馈源110。当然,第二天线阵列140也可以通过该第三馈线网络与馈源110电连接。
可以理解的是,馈源110也可以设置于介质基板120上的其他区域上,例如设置于第二子基板122、第三子基板123,本申请实施例对馈源110额具体设置位置不进行限定。
可以理解的是,馈源110和馈电点150除了通过上述金属镀孔187、第二馈线网络190等方式电连接外,还可以通过热压熔锡焊接、板对板连接器(Board-to-board Connectors)等方式实现电连接,在此不再赘述。
基于上述实施例的天线装置100,其中,介质基板120可以包括柔性材料基板。例如,介质基板120的第一子基板121可以包括第一柔性层,介质基板120的第二子基板122可以包括第二柔性层。当馈源110设置于第一子基板121时,馈源110可以设置于第一柔性层。
可以理解的是,第一柔性层的一面可以与第一面181相连接,第一柔性层 的另一面可以设置第一天线阵列130;第二柔性层的一面可以与第二面182相连接,第二柔性层的另一面可以设置第二天线阵列140。
可以理解的是,第二柔性层可以与第一柔性层连接,例如,第一柔性层和第二柔性层可以一体成型连接,以使得介质基板120可以为柔性基板,便于与主板180的第一面181和第二面182连接。
其中,介质基板120也可以同时包括柔性材料与刚性材料。示例性的,请参考图14,图14为本申请实施例提供的天线装置的第八种结构示意图。介质基板120的第一子基板121可以包括层叠设置的基底层1212和第一柔性层1211,第二子基板122可以包括第二柔性层1221。
可以理解的是,基底层1212的硬度可以大于第一柔性层1211的硬度。基底层1212可以与第一面181连接,第一柔性层1211上远离基底层1212的一面可以设置第一天线阵列130。第二柔性层1221远离主板180的一面可以设置第二天线阵列140,第二柔性层1221与第二面182连接,第二柔性层1221可以与第一柔性层1211连接。
可以理解的是,当馈源110设置于第一子基板121时,馈源110可以设置于第一柔性层1211或基底层1212。
本申请实施例的天线装置100,第一子基板121包括刚性的基底层1212和第一柔性层1211,一方面,基底层1212可以承载第一柔性层1211,可以增加第一子基板121的硬度;另一方面,刚性的基底层1212与主板180更容易固定连接,可以增加介质基板120的连接稳固性。
其中,请参考图15,图15为本申请实施例提供的天线装置的第九种结构示意图,馈源110可以包括第一子馈源112,该第一子馈源112可以与第一天线阵列130直接或间接电连接,以使得第一天线阵列130传输可以第一无线信号;该第一子馈源112也可以与第二天线阵列140直接或间接电连接,以使得第二天线阵列140可以传输第二无线信号。
可以理解的是,第一子馈源112可以同时向第一天线阵列130和第二天线阵列140提供激励信号,该激励信号可以激励第一天线阵列130传输第一无线信号,并激励第二天线阵列140传输第二无线信号。
可以理解的是,第一无线信号和第二无线信号可以是频段相同的无线信号,但二者具有不同的辐射方向。当然,第一无线信号和第二无线信号也可以是频段不同且辐射方向也不同的无线信号。本申请实施例对第一无线信号和第二无 线信号的具体频段不进行限定。
本申请实施例的天线装置100,馈源110仅包括第一子馈源112,第一子馈源112可以同时向第一天线阵列130和第二天线阵列140提供激励信号,使得馈源110的体积较小。
其中,请参考图16,图16为本申请实施例提供的天线装置的第十种结构示意图。馈源110可以包括第一子馈源112和第二子馈源113,该第一子馈源112可以与第一天线阵列130直接或间接电连接,以使得第一天线阵列130传输可以第一无线信号;该第二子馈源113可以与第二天线阵列140直接或间接电连接,或者,第二子馈源113可以与第二天线阵列140耦合连接,以使得第二天线阵列140可以传输第二无线信号。
可以理解的是,第一子馈源112和第二子馈源113可以提供不同频段的激励信号,以使得第一无线信号与第二无线信号的频段不同;第一子馈源112和第二子馈源113也可以提供相同频段的激励信号,以使得第一无线信号和第二无线信号的频段相同。
本申请实施例的天线装置100,馈源110同时包括第一子馈源112和第二子馈源113,第一子馈源112可以单独对第一天线阵列130提供激励信号,第二子馈源113可以单独对第二天线阵列140提供激励信号,从而便于对第一天线阵列130和第二天线阵列140进行单独调谐。
可以理解的是,电子设备10可以包括提供并传输激励信号的射频收发模块(图未示),射频收发模块可以但不限于设置于电子设备10的电路板400上,射频收发模块可以包括上述馈源110,天线装置100的第一天线阵列130和第二天线阵列140可与该设收发模块电连接,以传输第一无线信号和第二无线信号。
在本申请的描述中,需要理解的是,诸如“第一”、“第二”等术语仅用于区分类似的对象,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
以上对本申请实施例提供的天线装置及电子设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种天线装置,包括:
    介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
    第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
    第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向。
  2. 根据权利要求1所述的天线装置,其中,所述介质基板还包括:
    一个或多个第三子基板,每一所述第三子基板的延伸方向与所述第一子基板、所述第二子基板的延伸方向均相交;
    所述天线装置还包括:
    第三天线阵列,所述第三天线阵列的数量不大于所述一个或多个第三子基板的数量,每一所述第三天线阵列设置于一个所述第三子基板。
  3. 根据权利要求1所述的天线装置,其中,所述第二天线阵列通过所述馈电点与所述馈源电连接。
  4. 根据权利要求1所述的天线装置,其中,所述天线装置包括:
    主板,所述主板包括相互连接的第一面和第二面,所述第二面的延伸方向与所述第一面的延伸方向相交,所述第一子基板连接于所述第一面,所述第二子基板连接于所述第二面。
  5. 根据权利要求4所述的天线装置,其中,所述主板还包括与所述第一面相对设置的第三面,所述馈源设置于所述第三面,所述主板还包括贯穿所述第一面和所述第三面的金属镀孔,所述馈源通过所述金属镀孔与所述馈电点电连接。
  6. 根据权利要求4所述的天线装置,其中,所述馈源设置于所述第一面;所述天线装置还包括:
    馈线网络,至少部分所述馈线网络设置于所述第一面,所述馈电点通过所述馈线网络与所述馈源电连接。
  7. 根据权利要求4所述的天线装置,其中,所述馈源设置于所述第一面,所述介质基板还包括:
    延伸子基板,连接于所述第一面,所述延伸子基板与所述第一子基板连接 且朝着所述馈源所在的方向延伸设置,所述馈电点通过所述延伸子基板与所述馈源电连接。
  8. 根据权利要求1所述的天线装置,其中,所述馈源设置于所述介质基板上。
  9. 根据权利要求1所述的天线装置,其中,所述馈源包括:
    第一子馈源,与所述第一天线阵列电连接,以使得所述第一天线阵列传输第一无线信号;及
    第二子馈源,与所述第二天线阵列电连接或耦合连接,以使得所述第二天线阵列传输第二无线信号。
  10. 根据权利要求1所述的天线装置,其中,所述第一子基板包括第一柔性层,所述第一天线阵列设置于所述第一柔性层;所述第二子基板包括与所述第一柔性层连接的第二柔性层,所述第二天线阵列设置于所述第二柔性层上。
  11. 根据权利要求1所述的天线装置,其中所述第一子基板包括层叠设置的基底层和第一柔性层,所述第一天线阵列设置于所述第一柔性层;所述第二子基板包括与所述第一柔性层连接的第二柔性层,所述第二天线阵列设置于所述第二柔性层上。
  12. 一种电子设备,包括天线装置,所述天线装置包括:
    介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
    第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
    第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向。
  13. 根据权利要求12所述的电子设备,其中,所述电子设备还包括:
    射频收发模块,所述射频收发模块包括所述天线装置的馈源。
  14. 根据权利要求12所述的电子设备,其中,所述介质基板还包括:
    一个或多个第三子基板,每一所述第三子基板的延伸方向与所述第一子基板、所述第二子基板的延伸方向均相交;
    所述天线装置还包括:
    第三天线阵列,所述第三天线阵列的数量不大于所述一个或多个第三子基板的数量,每一所述第三天线阵列设置于一个所述第三子基板。
  15. 根据权利要求12所述的电子设备,其中,所述天线装置还包括:
    主板,所述主板包括相互连接的第一面和第二面,所述第二面的延伸方向与所述第一面的延伸方向相交,所述第一子基板连接于所述第一面,所述第二子基板连接于所述第二面。
  16. 根据权利要求15所述的电子设备,其中,所述主板还包括与所述第一面相对设置的第三面,所述馈源设置于所述第三面,所述主板还包括贯穿所述第一面和所述第三面的金属镀孔,所述馈源通过所述金属镀孔与所述馈电点电连接。
  17. 根据权利要求15所述的电子设备,其中,所述馈源设置于所述第一面;所述天线装置还包括:
    馈线网络,至少部分所述馈线网络设置于所述第一面,所述馈电点通过所述馈线网络与所述馈源电连接。
  18. 根据权利要求15所述的电子设备,其中,所述馈源设置于所述第一面,所述介质基板还包括:
    延伸子基板,连接于所述第一面,所述延伸子基板与所述第一子基板连接且朝着所述馈源所在的方向延伸设置,所述馈电点通过所述延伸子基板与所述馈源电连接。
  19. 一种电子设备,包括天线装置和电路板;所述天线装置包括:
    介质基板,包括相互连接的第一子基板和第二子基板,所述第二子基板的延伸方向与所述第一子基板的延伸方向相交;
    第一天线阵列,设置于所述第一子基板,所述第一天线阵列上设有馈电点,所述馈电点用于与馈源电连接,所述第一天线阵列具有第一辐射方向;及
    第二天线阵列,设置于所述第二子基板,所述第二天线阵列具有第二辐射方向,所述第二辐射方向不同于所述第一辐射方向;
    所述电路板包括相互连接的第一面和第二面,所述第二面的延伸方向与所述第一面的延伸方向相交,所述第一子基板连接于所述第一面,所述第二子基板连接于所述第二面。
  20. 根据权利要求19所述的电子设备,其中,所述电路板还包括与所述第一面相对设置的第三面,所述馈源设置于所述第三面,所述电路板还包括贯穿所述第一面和所述第三面的金属镀孔,所述馈源通过所述金属镀孔与所述馈电点电连接。
PCT/CN2022/083885 2021-06-21 2022-03-30 天线装置及电子设备 WO2022267597A1 (zh)

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