WO2022266376A1 - Systèmes de communication comprenant des modules enfichables - Google Patents

Systèmes de communication comprenant des modules enfichables Download PDF

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Publication number
WO2022266376A1
WO2022266376A1 PCT/US2022/033870 US2022033870W WO2022266376A1 WO 2022266376 A1 WO2022266376 A1 WO 2022266376A1 US 2022033870 W US2022033870 W US 2022033870W WO 2022266376 A1 WO2022266376 A1 WO 2022266376A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
module
substrate
electrical contacts
electrical
Prior art date
Application number
PCT/US2022/033870
Other languages
English (en)
Inventor
Peter Johannes Winzer
Peter James PUPALAIKIS
Brett Michael Dunn SAWYER
Ron Zhang
Clinton Randy Giles
Original Assignee
Nubis Communications, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nubis Communications, Inc. filed Critical Nubis Communications, Inc.
Priority to CN202280055455.6A priority Critical patent/CN117957471A/zh
Priority to EP22825860.4A priority patent/EP4356175A1/fr
Publication of WO2022266376A1 publication Critical patent/WO2022266376A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements

Definitions

  • the fiber guide can be rigid along a direction from the first optical connector to the optical module and can have a strength sufficient to withstand a compression force exerted on the pluggable module when the pluggable module is inserted through the opening in the front panel and coupled to the first substrate.
  • the fiber guide can have a spatial fan-out design such that a first portion of the fiber guide near the optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.
  • the at least one first optical connector can have an overall footprint that is larger than a footprint of the optical module.
  • the photonic integrated circuit can include at least one of (i) a photodetector to convert optical signals to electrical signals, or (ii) a modulator to convert electrical signals to optical signals.
  • the system can include a co-packaged optical module (CPO) mount and a bolster plate, in which the co-packaged optical module is mounted on the substrate through the CPO mount, and the bolster plate is positioned to the rear of the substrate and configured to exert a force in a front direction when the guide rails are fastened to a front portion of the fiber guide or to the front panel.
  • the optical module can have a first side and a second side, the first fiber optical cable can have a first end that has a two-dimensional arrangement of optical fiber cores, the first side of the optical module can be optically coupled to the two-dimensional arrangement of
  • the fiber guide can have a spatial fan-out design such that a first portion of the fiber guide near the co-packaged optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.
  • the at least one first optical connector can have an overall footprint that is larger than a footprint of the co-packaged optical module.
  • the co-packaged optical module can have a first side and a second side, the first fiber optical cable can have a first end that has a two-dimensional arrangement of optical fiber cores, the first side of the optical module can be optically coupled to the two-dimensional arrangement of optical fiber cores, and the second side of the optical module can have a two- dimensional arrangement of electrical contacts.
  • the pluggable optical module can include a housing having an inner upper wall and an inner lower wall, the edge connector can have an upper surface extending along a first plane that is at a first distance d1 relative to the inner upper wall, the edge connector can have a lower surface extending along a second plane that is at a second distance d2 relative to the inner lower wall.
  • the fiber harness can be substantially vertically coupled to the first surface of the photonic integrated circuit such that light from the fiber harness is directed toward the first surface of the photonic integrated circuit at an angle ⁇ 1 relative to a direction vertical to the first surface of the photonic integrated circuit, 0 ⁇ ⁇ 1 ⁇ 10°.
  • the photonic integrated circuit can be mounted on a substrate or circuit board that is electrically coupled to the edge connector by one or more flexible cables.
  • the photonic integrated circuit can be mounted on an upper surface of a substrate or circuit board, the edge connector can have an upper surface and a lower surface, the lower surface of the edge connector can be attached to the upper surface of the substrate or circuit board.
  • the upper surface of the substrate or circuit board can be at a distance d4 relative to the inner upper wall of the housing in which d3 ⁇ d4.
  • the first set of at least two electrical integrated circuits can include two electrical integrated circuits that are positioned on opposite sides of the optical fiber connector along a plane parallel to the first surface of the photonic integrated circuit.
  • the first set of at least one electrical integrated circuit can include four electrical integrated circuits that surround four sides of the optical fiber connector along the plane parallel to the first surface of the photonic integrated circuit.
  • the optical module can include a substrate or circuit board.
  • the photonic integrated circuit is mounted on the substrate or circuit board.
  • the optical module can include a second set of at least one electrical integrated circuit mounted on the substrate or circuit board and electrically coupled to the photonic integrated circuit through one or more signal conductors and/or traces.
  • the data processing system has a high power efficiency, a low construction cost, a low operation cost, and high flexibility in reconfiguring optical network connections.
  • FIG.1 is a block diagram of an example optical communication system.
  • FIG.2 is a schematic side view of an example data processing system.
  • FIG.3 is a schematic side view of an example integrated optical device.
  • FIG.82E is an enlarged diagram of the lower portion of the optical cable assembly of FIG. 82B.
  • FIG.82F is an enlarged view of a portion of the diagram of FIG.82A.
  • FIG.82G is an enlarged view of the diagram of FIG.82D.
  • FIG.82H is an enlarged view of the diagram of FIG.82E.
  • FIG.83 is a block diagram of an example of an optical communication system.
  • FIG.84A is a diagram of an example of an optical communication system.
  • FIG.84B is a diagram of an example of an optical cable assembly.
  • FIG.84C is an enlarged diagram of the optical cable assembly of FIG.84B.
  • FIG.131 is a top view of an example of a rackmount server that has a hinge-mounted front panel.
  • FIG.132 is a diagram of an example of an optical cable.
  • FIG.133 shows a top view diagram and a side view diagram of a rackmount server that has a hinged front panel.
  • FIG.134 shows a top view, a vertical application specific integrated circuit (VASIC)- plane front view, and a front-panel front view of an example of a rackmount server.
  • FIG.135 shows a top view, a VASIC-plane front view, and a front-panel front view of an example of another rackmount server.
  • VASIC vertical application specific integrated circuit
  • FIG.143 is an enlarged view of the diagram of FIG.90.
  • FIG.144 shows the diagram of FIG.91.
  • FIG.145 shows the diagram of FIG.92.
  • FIG.146 shows the diagram of FIG.93.
  • FIGS.147 to 151 are diagrams of examples of a system that can provide a large memory bank or memory pool.
  • FIG.152A is a diagram of an example pluggable optical module.
  • FIG.152B is a cross-sectional diagram of the pluggable optical module.
  • FIG.153A is a side view of an example pluggable optical module.
  • FIG.153B is a perspective view of a rear portion of the pluggable optical module.
  • hybrid circuit can refer to a multi-component circuit constructed of multiple monolithic integrated circuits, and possibly some discrete circuit components, all attached to each other to be mountable on and electrically connectable to a common base, carrier, or substrate.
  • a representative hybrid circuit can include (i) one or more packaged or non-packaged dies, with some or all of the dies including optical, optoelectronic, and/or semiconductor devices, and (ii) one or more optional discrete components, such as connectors, resistors, capacitors, and inductors. Electrical connections between the integrated circuits, dies, and discrete components can be formed, e.g., using patterned conducting (such as metal) layers, ball-grid arrays, solder bumps, wire bonds, etc. Electrical connections can also be removable, e.g., by using land-grid arrays and/or compression interposers.
  • the individual integrated circuits can include any combination of one or more respective
  • individual chips can be stacked.
  • stack refers to an orderly arrangement of packaged or non-packaged dies in which the main planes of the stacked dies are substantially parallel to each other.
  • a stack can typically be mounted on a carrier in an orientation in which the main planes of the stacked dies are parallel to each other and/or to the main plane of the carrier.
  • the connector part 213 can be mechanically connected (e.g., glued) to the photonic integrated circuit 214.
  • the photonic integrated circuit 214 can contain active and/or passive optical and/or opto-electronic components including optical modulators, optical detectors, optical phase shifters, optical power splitters, optical wavelength splitters, optical polarization splitters, optical filters, optical waveguides, or lasers.
  • the photonic integrated circuit 214 can further include monolithically integrated active or passive electronic elements such as resistors, capacitors, inductors, heaters, or transistors.
  • the first serializers/deserializers module is capable of operating as serializer units upon receipt of a first control signal, and operating as deserializer units upon receipt of a second control signal.
  • the second serializers/deserializers module is capable of operating as serializer units upon receipt of a first control signal, and operating as deserializer units upon receipt of a second control signal.
  • Signals can be transmitted between the optical fibers 226 and the electronic processor integrated circuit 240.
  • signals can be transmitted from the optical fibers 226 to the photonic integrated circuit 214, to the first array of serializers/deserializers 216, to the second array of serializers/deserializers 217, and to the electronic processor integrated circuit 240.
  • signals can be transmitted from the electronic processor integrated circuit 240 to the second array of serializers/deserializers 217, to the first array of serializers/deserializers 216, to the photonic integrated circuit 214, and to the optical fibers 226.
  • the electronic communication integrated circuit 215 is implemented as a first integrated circuit and a second integrated circuit that are electrically coupled each other.
  • the first integrated circuit includes the array of
  • FIG.9 shows the layout of the optical and electrical terminals when viewed from the top or bottom side of the device 282.
  • the photonic integrated circuit 284 has a width of about 5 mm and a length of about 2.2 mm to 18 mm.
  • the optical signals provided to the photonic integrated circuit 284 can have a total bandwidth of about 1.6 Tbps.
  • the optical signals provided to the photonic integrated circuit can have a total bandwidth of about 12.8 Tbps.
  • the width of the integrated optical communication device 282 can be about 8 mm.
  • the electrical terminals 366 are electrically coupled to the third serializers/deserializers module 247 through electrical connectors or traces 372 on or in the package substrate 230.
  • optical signals are converted by the photonic integrated circuit 352 to electrical signals, which are conditioned by the first serializers/deserializers module 216 (or the second serializers/deserializers module 217), and processed by the host application specific integrated circuit 240.
  • the host application specific integrated circuit 240 generates electrical signals that are converted by the photonic integrated circuit 352 into optical signals.
  • FIG.12 is a schematic side view of an example data processing system 380, which includes an integrated optical communication device 382, a package substrate 230, and a host application specific integrated circuit 240.
  • the integrated optical communication device 428 includes a photonic integrated circuit 422 (which does not include a transimpedance amplifier and driver), a first serializers/deserializers module 394, a second serializers/deserializers module 396, a third serializers/deserializers module 398, and a fourth serializers/deserializers module 400 that are mounted on a substrate 410.
  • the integrated optical communication device 428 includes a first set of transimpedance amplifiers and driver circuits 424 positioned at the right of the photonic integrated circuit 422, and a second set of transimpedance amplifiers and driver circuits 426 positioned at the left of the photonic integrated circuit 422.
  • FIG.15 is a bottom view of an example of the integrated optical communication device 428 of FIG.14.
  • the photonic integrated circuit 422 includes modulator and photodetector blocks on both sides of a center line 432 in the longitudinal direction.
  • the photonic integrated circuit 422 includes a fiber coupling region 430 arranged either at the bottom side of the photonic integrated circuit 392 or at the top side of the photonic integrated circuit (see FIG.32), in which the fiber coupling region 430 includes multiple optical coupling elements 310, e.g., receiver optical coupling elements (RX), transmitter optical coupling elements (TX), and remote optical power supply (e.g., 103 in FIG.1) optical coupling elements (PS).
  • RX receiver optical coupling elements
  • TX transmitter optical coupling elements
  • PS remote optical power supply
  • Complementary metal oxide semiconductor (CMOS) transimpedance amplifier and driver blocks 424 are arranged on the right side of the photonic integrated circuit 424, and CMOS transimpedance amplifier and driver blocks 426 are arranged on the left side of the photonic integrated circuit 424.
  • a first serializers/deserializers module 394 and a second serializers/deserializers module 396 are arranged on the right side of the CMOS transimpedance amplifier and driver blocks 424.
  • a third serializers/deserializers module 398 and a fourth serializers/deserializers module 400 are arranged on the left side of the CMOS transimpedance amplifier and driver blocks 426.
  • each of the first, second, third, and fourth serializers/deserializers module 394, 396, 398, 400 includes 8 serial differential transmitter blocks and 8 serial differential receiver blocks.
  • the integrated optical communication device 428 has a width of about 3.5 mm and a length of slightly more than about 3.6 mm.
  • FIG.16 is a bottom view of an example of the integrated optical communication device 428 of FIG.14, in which the electrical terminals 406 and 408 are also shown.
  • the top side of the photonic integrated circuit 464 is electrically coupled to the bottom side of the substrate 454.
  • a first optical connector part 456 is optically coupled to the bottom side of the photonic integrated circuit 450.
  • An array of electrical terminals 460 is arranged on the top side of the substrate 454 and configured to enable the integrated optical communication device 462 to be removably coupled to the substrate 442.
  • the integrated optical communication device 462 is similar to the integrated optical communication device 448, except that either the photonic integrated circuit 464 or the serializers/deserializers module 446 includes the set of transimpedance amplifiers and driver circuitry.
  • T Gbps NRZ serial signals received at the receivers RX1, RX2, RX3, RX4 can be re-encoded and routed to transmitters TX5, TX6 to output 2 lanes of 2 ⁇ T Gbps PAM4 serial signals.
  • serial electrical signals received at the receivers RX5, RX6, RX7, RX8 are converted to parallel electrical signals and routed by the bus processing unit 218 to the transmitters TX1, TX2, TX3, TX4, which convert the parallel electrical signals to serial electrical signals.
  • serial electrical signals received at the receivers RX3, RX4, RX7, RX8 are converted to parallel electrical signals and routed by the bus processing unit 218 to the transmitters TX1, TX2, TX5, TX6, which convert the parallel electrical signals to serial electrical signals.
  • the electronic processor integrated circuit or host application specific integrated circuit can send serial electrical signals to the receivers RX3, RX4, RX7, RX8, and the transmitters TX1, TX2, TX5, TX6 can transmit serial electrical signals to the photonic integrated circuit.
  • the bus processing unit 538 is configured to enable switching of the signals, allowing the routing of signals to be re-mapped, in which 8 x 50 Gbps serial electrical signals using NRZ modulation that are serially interfaced to the first and second octal serializers/deserializers blocks 532 and 534 are re-routed or combined into 8 x 100 Gbps serial electrical signals using PAM4 modulation that are serially interfaced to the third octal serializers/deserializers block 536.
  • An example of the bus processing unit 538 is shown in FIG.41A.
  • the demultiplexer 419 is then individually detected using receivers 421.
  • the demultiplexer 419 is not provided, i.e., the output of each coupling interface 414_R1 through 414_RM can be directly coupled to a corresponding receiver 421.
  • the receiver 421 can include one or more p-i-n photodiodes, one or more avalanche photodiodes, one or more self-coherent receivers, or one or more analog (heterodyne/homodyne) or digital (intradyne) coherent receivers.
  • the photonic integrated circuit 214 is electrically coupled to the integrated circuit 215.
  • the input/output interfaces 556 can include one or more of small form-factor pluggable (SFP), SFP+, SFP28, QSFP, QSFP28, or QSFP56 transceivers.
  • SFP small form-factor pluggable
  • the electrical signals from the transceiver outputs are routed to the data processing chip 554 through electrical connectors on or in the printed circuit board 558.
  • various embodiments can have various form factors, e.g., in some embodiments the top panel and the bottom panel 546 can have the largest area, in other embodiments the side panels 548 and 550 can have the largest area, and in yet other embodiments the front panel 544 and the rear panel 552 can have the largest area.
  • the printed circuit board 570 perpendicular to the bottom panel of the housing allows for more easily accessible connections to the integrated communication device 574 that may be removed and re-connected without, e.g., removing the housing from a rack.
  • the bundle of optical fibers 582 can be firmly attached to the photonic integrated circuit 586 without the use of the first and second optical connectors 578, 580.
  • the printed circuit board 570 can be secured to the side panels 564 and 566, and the bottom and top panels of the housing using, e.g., brackets, screws, clips, and/or other types of fastening mechanisms.
  • the integrated communication device 612 includes a photonic integrated circuit 614 and an electronic communication integrated circuit 588 mounted on a substrate 618.
  • the electronic communication integrated circuit 588 includes a first serializers/deserializers module 590 and a second serializers/deserializers module 592.
  • the integrated communication device 612 includes a first optical connector 578 that is configured to receive a second optical connector 580 that is coupled to a bundle of optical fibers 582.
  • the integrated communication device 612 is electrically coupled to the data processing chip 572 through electrical connectors or traces 616 that pass through the printed circuit board 610 in the thickness direction.
  • the circuit board 642 is oriented at an angle in a range -60° to 60° relative to a vertical direction of the bottom panel.
  • the side of the circuit board 642 facing the user is configured to be aesthetically pleasing.
  • the optical/electrical communication interface 644 is electrically coupled to the data processing chip 640 by electrical connectors or traces 646 on or in the circuit board 642.
  • the circuit board 642 can be a printed circuit board that has one or more layers.
  • the electrical connectors or traces 646 can be signal lines printed on the one or more layers of the printed circuit board 642 and provide high bandwidth data paths (e.g., one or more Gigabits per
  • the optical connector 648 can be similar to, e.g., the first optical connector part 213 (FIGS.2, 4), the first optical connector 356 (FIGS.11, 12), the first optical connector 404 (FIGS.13, 14), and the first optical connector part 456 (FIG.17).
  • a portion of the optical connector 648 can be part of the optical/electrical communication interface 644.
  • the optical connector 648 can also include the second optical connector part 223 (FIGS.2, 4),
  • FIG.24 shows that the optical connector 648 passes through the circuit board 642.
  • the optical connector 648 can be short so that the optical fibers pass through, or partly through, the circuit board 642.
  • the circuit board 654 is substantially parallel to the front panel 656, e.g., the angle between the surface of the circuit board 654 and the surface of the front panel 656 can be in a range of -5° to 5°. In some examples, the circuit board 654 is at an angle relative to the front panel 656, in which the angle is in a range of -45° to 45°.
  • the optical/electrical communication interface 652 is electrically coupled to the data processing chip 670 by electrical connectors or traces 666 on or in the circuit board 654,
  • the optical/electrical communication interface 652 can be similar to, e.g., the integrated communication device 210 (FIG.2), 252 (FIG.4), 374 (FIG.11), 382 (FIG.12), 402 (FIG.13), and 428 (FIG.14).
  • the optical/electrical communication interface 652 can be similar to the integrated optical communication device 448, 462, 466, 472 (FIG.17), except that the optical/electrical communication interface 652 is mounted on the same side of the circuit board 654 as the data processing chip 640.
  • the optical connector is not attached vertically to a photonic integrated circuit that is part of the optical/electrical communication interface 652 but rather can be attached in-plane to the photonic integrated circuit using, e.g., V-groove fiber attachments, tapered or un-tapered fiber edge coupling, etc., followed by a mechanism to direct the light interfacing to the photonic integrated circuit to a direction that is substantially perpendicular to the photonic integrated circuit, such as one or more substantially 90-degree turning mirrors, one or more substantially 90-degree bent optical fibers, etc.
  • a portion of the optical connector 668 can be part of the optical/electrical communication interface 652.
  • the data processing chip 682 is mounted on a first side of a circuit board 686 that functions as a front panel of an enclosure 688 of the system 680.
  • the data processing chip 682 is mounted on a substrate (e.g., a ceramic substrate), and the substrate is attached to the circuit board 686.
  • the optical/electrical communication interfaces 684 are mounted on a second side of the circuit board 686, in which the second side faces the exterior of the enclosure 688.
  • the optical/electrical communication interfaces 684 are mounted on an exterior side of the enclosure 688, allowing optical fibers to be easily coupled to the optical/electrical communication interfaces 684.
  • the signal paths between the data processing chip 682 and each of the optical/electrical communication interfaces 684 can be unidirectional or bidirectional, similar to those of the systems 630 and 650.
  • the system 680 can be configured such that signals are transmitted unidirectionally between the data processing chip 682 and one of the optical/electrical communication interfaces 684, and bidirectionally between the data processing chip 682 and another one of the optical/electrical communication interfaces 684.
  • the system 680 can be configured such that signals are transmitted unidirectionally between the data processing chip 682 and one of the optical/electrical communication interfaces 684, and bidirectionally between the data processing chip 682 and another one of the optical/electrical communication interfaces 684.
  • the optical connector is not attached vertically to a photonic integrated circuit that is part of the optical/electrical communication interface 684 but rather can be attached in-plane to the photonic integrated circuit using, e.g., V-groove fiber attachments, tapered or un-tapered fiber edge coupling, etc., followed by a mechanism to direct the light interfacing to the photonic integrated circuit to a direction that is substantially perpendicular to the photonic integrated circuit, such as one or more substantially 90-degree turning mirrors, one or more substantially 90-degree bent optical fibers, etc.
  • a portion of the optical connector 668 can be part of the optical/electrical communication interface 652.
  • the circuit board 693b is oriented at an angle in a range -60° to 60° (or -30° to 30°, or -10° to 10°, or -1° to 1°) relative to a vertical direction of the bottom panel.
  • Each of the optical/electrical communication interfaces 692 is electrically coupled to the data processing chip 691b by electrical connectors or traces 698b that pass through the circuit board 693b in the thickness direction.
  • the electrical connectors or traces 698b can be configured as vias of the circuit board 693b.
  • Optical connectors 699a, 699b, 699c are provided to couple optical signals from the optical fibers to the optical/electrical communication interfaces 692a, 692b, 692c, respectively.
  • the optical connectors 699 can be securely fixed, or releasably connected, to the optical/electrical communication interfaces 692, similar to those of the systems 630, 650, and 680.
  • optical connector 699b and optical connector 699c can connect to optical fibers at the front of the enclosure 694b and the optical connector 699a can connect to optical fibers at the rear of the enclosure 694b.
  • the optical connector 699a connects to an optical fiber at the rear of the enclosure 694b by being connected to a fiber 1000b that connects to a rear panel interface 1001b (e.g., a backplane, etc.) that is mounted to the rear panel 697b.
  • the optical connectors 699 can be securely or fixedly attached to communication interfaces 692.
  • the optical connectors 699 can be securely or fixedly attached to an array of optical fibers.
  • FIG.26C is a top view of an example data processing system 690c in which a data processing chip 691c is mounted near optical/electrical communication interfaces 692d, 692e, 692f (collectively referenced as 692) to enable high bandwidth data paths (e.g., one, ten, or more Gigabits per second per data path) between the data processing chip 691c and each of the optical/electrical communication interfaces 692.
  • the data processing chip 691c is mounted on a first side of a circuit board 693c that functions as a front panel of an enclosure 694c of the system 690c.
  • Each of the optical/electrical communication interfaces 692 is electrically coupled to the data processing chip 691c by electrical connectors or traces 698c that pass through the circuit board 693c in the thickness direction.
  • the electrical connectors or traces 698c can be configured as vias of the circuit board 693c.
  • the electrical connectors or traces 698c extend to both sides of the circuit board 693b (e.g., for connecting to optical/electrical communication interfaces 692 located internal to and external of the enclosure 694b.
  • the signal paths between the data processing chip 691c and each of the optical/electrical communication interfaces 692 can be unidirectional or bidirectional, similar to those of the systems 630, 650 and 680.
  • FIG.27 is a top view of an example data processing system 700 in which a data processing chip 702 is mounted near optical/electrical communication interfaces 704a, 704b, 704c (collectively referenced as 704) to enable high bandwidth data paths (e.g., one, ten, or more Gigabits per second per data path) between the data processing chip 702 and each of the optical/electrical communication interfaces 704.
  • the data processing chip 702 is mounted on a first side of a circuit board 706 that is positioned near a front panel of an enclosure 710 of the system 700, similar to the configuration of the system 650 (FIG.25).
  • the thermal solutions including the placement of fans and heat dissipating devices, and the configuration of airflows around the main data processing modules and the communication interface modules, are adjusted accordingly.
  • a data processing server is mounted to the ceiling of a room or a vehicle, the main data processing module and the communication interface modules can be positioned near the bottom panel for easy access.
  • the main data processing module and the communication interface modules can be positioned near the top panel for easy access.
  • the optical fibers can be coupled to the edges of the photonic integrated circuits, e.g., using fiber edge couplers.
  • the signal conditioning e.g., clock and data recovery, signal equalization, or coding
  • the signal conditioning can be performed on the serial signals, the parallel signals, or both.
  • the signal conditioning can also be performed during the transition from serial to parallel signals.
  • the data processing systems described above can be used in, e.g., data center switching systems, supercomputers, internet protocol (IP) routers, Ethernet switching systems, graphics processing work stations, and systems that apply artificial intelligence algorithms.
  • IP internet protocol
  • a bus processing unit 218 can be positioned between the first and second serializers/deserializers modules and perform, e.g., switching, re-routing, and/or coding functions described above.
  • the cameras and/or sensors can send the video data and/or sensor data to one or more data processing modules through optical fibers.
  • the one or more data processing modules can apply artificial intelligence technology (e.g., using one or more neural networks) to recognize individual objects, collections of objects, scenes,
  • FIG.34 is a flow diagram of an example process for processing high bandwidth data.
  • a process 830 includes receiving 832 a plurality of channels of first optical signals from a plurality of optical fibers.
  • the process 830 includes generating 834 a plurality of first serial electrical signals based on the received optical signals, in which each first serial electrical signal is generated based on one of the channels of first optical signals.
  • the process 830 includes generating 836 a plurality of sets of first parallel electrical signals based on the plurality of first serial electrical signals, and conditioning the electrical signals, in which each set of first parallel electrical signals is generated based on a corresponding first serial electrical signal.
  • Each integrated communication device or optical/electrical communication interface includes a photonic integrated circuit that receives optical signals and generates electrical signals based on the optical signals.
  • the optical signals are provided to the photonic integrated circuit through one or more optical paths (or spatial paths) that are provided by, e.g., cores of the fiber-optic cables, which can incorporate techniques described in U.S. patent application 16/822,103.
  • a large number of parallel optical paths (or spatial paths) can be arranged in two-dimensional arrays using connector structures, which can incorporate techniques described in U.S. patent application 16/816,171.
  • FIG.35A illustrates a switch-to-switch use case.
  • An external optical power supply or photon supply 1256 provides optical power supply signals, which can be, e.g., continuous-wave light, one or more trains of periodic optical pulses, or one or more trains of non-periodic optical pulses.
  • the power supply light is provided from the photon supply 1256 to the co-packaged optical interconnect modules 1258 through optical fibers 1730 and 1732, respectively.
  • the optical power supply 1256 can provide continuous wave light, or both pulsed light for data modulation and synchronization, as described in U.S. patent 11,153,670. This allows the first chip 1252 to be synchronized with the second chip 1254.
  • the photon supply 1256 can correspond to the optical power supply 103 of FIG.1.
  • the pulsed light from the photon supply 1256 can be provided to the link 102_6 of the data processing system 200 of FIG.20.
  • the photon supply 1256 can provide a sequence of optical frame templates, in which each of the optical frame templates includes a respective frame header and a respective frame body, and the frame body includes a respective optical pulse train.
  • the modulators 417 can load data into the respective frame bodies to convert the sequence of optical frame templates into a corresponding sequence of loaded optical frames that are output through optical fiber link 102_1.
  • the high-capacity chip 1262 communicates with the lower- capacity chips 1264a, 1264b, 1264c through a high-capacity optical fiber interconnection cable 1740 that later branches out into several lower-capacity optical fiber interconnection cables 1742a, 1742b, 1742c that are connected to the lower-capacity chips 1264a, 1264b, 1264c, respectively.
  • This example illustrates a switch-to-servers use case.
  • An external optical power supply or photon supply 1266 provides optical power supply signals, which can be continuous-wave light, one or more trains of periodic optical pulses, or one or more trains of non-periodic optical pulses.
  • the power supply light is provided from the photon supply 1266 to the optical interconnect modules 1258 through optical fibers 1744, 1746a, 1746b, 1746c, respectively.
  • the optical power supply 1266 can provide both pulsed light for data modulation and synchronization, as described in U.S. patent 11,153,670. This allows the high-capacity chip 1262 to be synchronized with the lower-capacity chips 1264a, 1264b, and 1264c.
  • FIG.37 shows an optical communications system 1270 providing high-speed communications between a high-capacity chip 1262 (e.g., an Ethernet switch chip) and multiple lower-capacity chips 1264a, 1264b, e.g., multiple network interface chips, attached to computer servers using a mix of co-packaged optical interconnect modules 1258 similar to those shown in FIG.35 as well as conventional pluggable optical interconnect modules 1272.
  • An external optical power supply or photon supply 1274 provides optical power supply signals, which can be continuous-wave light, one or more trains of periodic optical pulses, or one or more trains of non-periodic optical pulses.
  • the front-mounted module 860 can be, e.g., the front panel of the housing of the data processing system, similar to the configuration shown in FIGS.26A, 28A or positioned near the front panel of the housing, similar to the configuration shown in FIGS.27, 28B.
  • Three optical modules with connectors, e.g., 868a, 868b, 868c, collectively referenced as 868, are shown in the figure. Additional optical modules with connectors can be used.
  • the data processing system can be similar to, e.g., the data processing system 680 (FIG.26A) or 700 (FIG.27).
  • the printed circuit board 862 can be similar to, e.g., the printed circuit board 686 (FIG.26A) or 706 (FIG.27).
  • the optical module with connector 868 can be inserted into a first grid structure 870, which can function as both (i) a heat spreader/heat sink and (ii) a mechanical holding fixture for the optical modules with connectors 868.
  • the first grid structure 870 includes an array of receptors, and each receptor can receive an optical module with connector 868. When assembled, the first grid structure 870 is connected to the printed circuit board 862.
  • the first grid structure 870 can be firmly held in place relative to the printed circuit board 862 by sandwiching the printed circuit board 862 in between the first grid structure 870 and a second structure 872 (e.g., a second grid structure) located on the opposite side of the printed circuit board 862 and connected to the first grid structure 870 through the printed circuit board 862, e.g., by use of screws.
  • Thermal vias between the first grid structure 870 and the second structure 872 can conduct heat from the front-side of the printed circuit board 862 to the heat sink 866 on the back-side of the printed circuit board 862. Additional heat sinks can also be mounted directly onto the first grid structure 870 to provide cooling in the front.
  • the printed circuit board 862 includes electrical contacts 876 configured to electrically connect to the removable optical module with connectors 868 after the removable optical module with connectors 868 are inserted into the first grid structure 870.
  • the first grid structure 870 can include an opening 874 at the location in which the host application specific integrated circuit 864 is mounted on the other side of the printed circuit board 862 to allow for components such as voltage regulators, filters, and/or decoupling capacitors to be mounted on the printed circuit board 862 in immediate lateral vicinity to the host application specific integrated circuit 864.
  • the host application specific integrated circuit 864 is mounted on a substrate (e.g., a ceramic substrate), and the substrate is attached to the circuit board 862, similar to the examples shown in FIGS.136 to 159.
  • the substrate can be similar to the substrate 13602 of FIGS.136 to 159
  • the second grid structure 872 can be similar to the rear lattice structure 13626
  • the circuit board 862 can be similar to the printed circuit board 13604
  • the host application specific integrated circuit 864 can be similar to the data processing chip 12382
  • the heat sink 866 can be similar to the heat dissipating device 13610.
  • the first grid structure 870 can have an overall shape similar to the front lattice structure 13606 of
  • the optical module 880 can have any of various configurations, including an optical module containing silicon photonics integrated optics, indium phosphide integrated optics, one or more vertical-cavity surface-emitting lasers (VCSEL)s, one or more direct-detection optical receivers, or one or more coherent optical receivers.
  • VCSEL vertical-cavity surface-emitting lasers
  • the first serializers/deserializers chip 892 can include circuitry similar to, e.g., the third serializers/deserializers module 398 and the fourth serializers/deserializers module 400 of FIG.32.
  • the second serializers/deserializers chip 894 can include circuitry similar to, e.g., the first serializers/deserializers module 394 and the second serializers/deserializers module 396.
  • a second slab 898 (which can be similar to the second slab 518 of FIG.32) can be provided on the underside of the substrate 890 to provide a removable connection to a package substrate (e.g., 230).
  • FIGS.46 and 47 show an exploded view and an assembled view, respectively, of a mechanical connector structure 900 built around the functional optical module 880 of FIGS. 44, 45.
  • the mechanical connector structure 900 includes a lower mechanical part 902 and an upper mechanical part 904 that together receive the optical module 880.
  • Both lower and upper mechanical connector parts 902, 904 can be made of a heat-conducting and rigid material, e.g., a metal.
  • the upper mechanical part 904 at its underside, is brought in thermal contact with the first serializers/deserializers chip 892 and the second serializers/deserializers chip 894.
  • the upper mechanical part 904 is also brought in thermal contact with the lower mechanical part 902.
  • the lower mechanical part 902 includes a removable latch mechanism, e.g., two wings 906 that can be elastically bent inwards (the movement of the wings 906 are represented by a double-arrow 908 in FIG.47), and each wing 906 includes a tongue 910 on an outer side.
  • FIG.48 is a diagram of a portion of the first grid structure 870 and the circuit board 862.
  • a substrate e.g., a ceramic substrate
  • Grooves 920 are provided on the walls of the first grid structure 870.
  • the printed circuit board 862 (or substrate) has electrical contacts 876 that can be electrically coupled to electrical contacts on the second slab 898 of the optical module 880.
  • the electrical contacts 876 can include an array of electrical contacts that has at least four rows and four columns of electrical contacts.
  • the array of electrical contacts can have ten or more rows or columns of electrical contacts.
  • the electrical contacts 876 can be arranged in any two-dimensional pattern and do not necessarily have to be arranged in rows and columns.
  • the circuit board 862 (or substrate) can also have three-dimensional features, such as on protruding elements or recessed elements, and the electrical contacts can be provided on the three-dimensional features.
  • the optical module can include an array of electrical contacts that has at least four rows and four columns of electrical contacts.
  • the array of electrical contacts can have ten or more rows or columns of electrical contacts.
  • the electrical contacts 876 can be arranged in any two-dimensional pattern and do not necessarily have to be arranged in rows and columns.
  • the circuit board 862 (or substrate) can also have three-dimensional
  • the tongues 910 on the wings 906 of the lower mechanical part 902 can snap into corresponding grooves 920 within the first grid structure 870 to mechanically hold the optical module 880 in place.
  • the position of the tongues 910 on the wings 906 is selected such that when the mechanical connector structure 900 and the optical module 880 are inserted into the first grid structure 870, the electrical connectors at the bottom of the second slab 898 are electrically coupled to the electrical contacts 876 on the printed circuit board 862 (or substrate).
  • FIG.50 shows the front-view of an assembled front module 860.
  • Three optical module with connectors e.g., 868a, 868b, 868c
  • the optical modules 880 are arranged in a checkerboard pattern, whereby adjacent optical modules 880 and the corresponding mechanical connector structures 900 are rotated by 90 degrees such as to not allow any two wings to touch. This facilitates the removal of individual modules.
  • the optical module with connector 868a is rotated 90 degrees relative to the optical module with connectors 868b, 868c.
  • FIG.51A shows a first side view of the mechanical connector structure 900.
  • FIG.51B shows a cross-sectional view of the mechanical connector structure 900 along a plane 930 shown in FIG. 51A.
  • the compression interposer e.g., spring-loaded contacts
  • FIG.52A shows a first side view of the mechanical connector structure 900 mounted within the first grid structure 870.
  • FIG.52B shows a cross-sectional view of the mechanical connector structure 900 mounted within the first grid structure 870 along a plane 940 shown in FIG.52A.
  • FIG.53 is a diagram of an assembly 958 that includes a fiber cable 956 that includes a plurality of optical fibers, an optical fiber connector 950, the mechanical connector module
  • the optical fiber connector 950 can be inserted into the mechanical connector module 900, which can be further inserted into the first grid structure 870.
  • the printed circuit board 862 (or substrate) is attached to the first grid structure 870, in which the electrical contacts 876 face electrical contacts 954 on the bottom side of the second slab 898 of the optical module 880.
  • FIG.53 shows the individual components before they are connected.
  • FIG.54 is a diagram that shows the components after they are connected.
  • the optical fiber connector 950 includes a lock mechanism 952 that disables the snap-in mechanism of the mechanical connector structure 900 so as to lock in place the mechanical connector structure 900 and the optical module 880.
  • FIG.56 is a perspective view showing that the optical module 880 and the mechanical connector structure 900 are inserted into the first grid structure 870, and the optical fiber connector 950 is separated from the mechanical connector structure 900.
  • FIG.57 is a perspective view showing that the optical fiber connector 950 is mated with the mechanical connector structure 900, locking the optical module 880 within the mechanical connector structure 900.
  • FIGS.58A to 58D show an alternate embodiment in which an optical module with connector 970 includes a latch mechanism 972 that acts as a mechanical fastener that joins the optical module 880 to the printed circuit board 862 (or substrate) using the first grid structure 870 as a support.
  • FIG.60B shows an example in which the lever 974 is pulled up, causing the latch mechanism 972 to be released from the support structure 976.
  • FIG.61 is a diagram of an example of a fiber cable connection design 980 that includes nested fiber optic cable and co-packaged optical module connections. In this design,
  • the co-packaged optical module 982 includes a mechanical connector structure 984 and a smart optical assembly 986.
  • the smart optical assembly 986 includes, e.g., a photonic integrated circuit (e.g., 896 of FIG.44), and components for guiding light, power splitting, polarization management, optical filtering, and other light beam management before the photonic integrated circuit.
  • the components can include, e.g., optical couplers, waveguides, polarization optics, filters, and/or lenses. Additional examples of the components that can be included in the co-packaged optical module 982 are described in U.S. published application US 2021/0286140.
  • the guide pins 998 can be chamfered shaped, or elliptical shaped that reduces wear.
  • the fiber connector 983 prevents the co-packaged optical module latches 990 from bending inwards, thus preventing the co-packaged optical module 982 from being inserted into, or released from, the co-packaged optical port 1000.
  • the co-packaged optical module 982 is first inserted into the co-packaged optical port 1000 without the fiber connector 983, then the fiber connector 983 is inserted into the mechanical connector structure 984. To remove the fiber cable 996 from the data processing system, the fiber connector 983 can be removed from the mechanical connector structure 984 while the co-packaged optical module 982 is still coupled to the co-packaged optical port 1000. [0586] In some implementations, the nested connection latches can be designed to allow the co-packaged optical module 982 to be inserted in, or removed from, the co-packaged optical port 1000 when a fiber cable is connected to the co-packaged optical module 982.
  • the rack unit thermal architectures use air cooling to remove heat generated by the data processing chips.
  • the heat-generating data processing chips are positioned near the input/output interfaces, which can include, e.g., one or more of the integrated optical communication device 448, 462, 466, or 472 of FIG. 17, the integrated communication device 574 of FIG.22 or 612 of FIG.23, the optical/electrical communication interface 644 of FIG.24, 684 of FIG.26, 724 of FIG.28, or 760 of FIG.29, or the optical module with connector 868 of FIG.43, that are positioned at or near the front panel to enable users to conveniently connect/disconnect optical transceivers to/from the rackmount systems.
  • the housing 1042 can have a 2 rack unit (RU) form factor, having a width of about 482.6 mm (19 inches) and a height of 2 rack units.
  • One rack unit is about 44.45 mm (approximately 1.75 inches).
  • a printed circuit board 1042 is mounted on the bottom panel 1038, and at least one data processing chip 1044 is electrically coupled to the printed circuit board 1042.
  • a microcontroller unit 1046 is provided to control various modules, such as power supplies 1048 and exhaust fans 1050.
  • the exhaust fans 1050 are mounted at the rear panel 1036.
  • single mode optical connectors 1052 are provided at the front panel 1034 for connection to external optical cables.
  • a rackmount server 1060 includes a housing or case 1062 having a front panel 1064 (or face plate), a rear panel 1036, a bottom panel 1038, a top panel, and side panels 1040.
  • the housing 1062 can have a form factor of 1RU, 2RU, 3RU, or 4RU, having a width of about 482.6 mm (19 inches) and a height of 1, 2, 3, or 4 rack units.
  • a first printed circuit board 1066 is mounted on the bottom panel 1038, and a microcontroller unit 1046 is electrically coupled to the first printed circuit board 1066 and configured to control various modules, such as power supplies 1048 and exhaust fans 1050.
  • the front panel 1064 includes a second printed circuit board 1068 that is oriented in a vertical direction, e.g., substantially perpendicular to the first circuit board 1066 and the bottom panel 1038.
  • the second printed circuit board 1068 is referred to as the vertical printed circuit board 1068.
  • the figures show that the second printed circuit board 1066 forms part of the front panel 1064, but in some examples the second printed circuit board 1066 can also be attached to the front panel 1064, in which the front panel 1064 includes openings to allow input/output connectors to pass through.
  • the second printed circuit board 1066 includes a first side facing the front direction relative to the housing 1062 and a second side facing the rear direction relative to the housing 1062. At least one data processing chip 1070 is electrically coupled to the second side of the vertical printed
  • the co-packaged optical module 1074 can include a first optical connector part (e.g., 456 of FIG.17, 578 of FIG.22 or 23, 746 of FIG.28) that is configured to be removably coupled to a second optical connector part (e.g., 458 of FIG.17, 580 of FIG.22 or 23, 748 of FIG.28) that is attached to the external fiber cable 1076.
  • the co-packaged optical module 1074 includes a photonic integrated circuit (e.g., 450, 464, 468, or 474 of FIG.17, 586 of FIG.22, 618 of FIG.23, or 726 of FIG. 28) that is optically coupled to the first optical connector part.
  • the fiber cable 1076 can include 100 or more cores of optical fibers, and the first optical connector part is configured to couple 100 or more channels of optical signals to the photonic integrated circuit. In some examples, the fiber cable 1076 can include 500 or more cores of optical fibers, and the first optical connector part is configured to couple 500 or more channels of optical signals to the photonic integrated circuit. In some examples, the fiber cable 1076 can include 1000 or more cores of optical fibers, and the first optical connector part is configured to couple 1000 or more channels of optical signals to the photonic integrated circuit. [0599] In some implementations, the photonic integrated circuit can be configured to
  • Each co-packaged optical module 1074 can include a second serializers/deserializers module that includes serializer units and deserializer units, in which the second serializers/deserializers module is configured to generate second serial electrical signals based on the sets of first parallel electrical signals, and each second serial electrical signal is generated based on a corresponding set of first parallel electrical signals.
  • the rackmount server 1060 can include 4 or more co-packaged optical modules 1074 that are configured to be removably coupled to corresponding second optical connector parts that are attached to corresponding fiber cables 1076.
  • the rackmount server 1060 can include 16 or more co-packaged optical modules 1074 that are configured to be removably coupled to corresponding second optical connector parts that are attached to corresponding fiber cables 1076.
  • each fiber cable 1076 can include 10 or more cores of optical fibers.
  • each fiber cable 1076 can include 100 or more cores of optical fibers.
  • each fiber cable 1076 can include 500 or more cores of optical fibers.
  • each fiber cable 1076 can include 1000 or more cores of optical fibers.
  • Each optical fiber can transmit one or more channels of optical signals.
  • a rackmount server 1080 includes a housing 1082 having a front panel 1084.
  • the rackmount server 1080 is similar to the rackmount server 1060 of FIG.68A, except that one or more fans are mounted on the front panel 1084, and one or more air louvers installed in the housing 1082 to direct air flow towards the heat dissipating device.
  • the rackmount server 1080 can include a first inlet fan 1086a mounted on the front panel 1084 to the left of the vertical printed circuit board 1068, and a second inlet fan 1086b mounted on the front panel 1084 to the right of the vertical printed circuit board 1068.
  • a left air louver 1088a and a right air louver 1088b are installed in the housing 1082 to direct airflow toward the heat dissipating device 1072.
  • the air louvers 1088a, 1088b (collectively referenced as 1088) partition the space in the housing 1082 and force air to flow from the inlet fans 1086a and 1086b, pass over surfaces of fins of the heat dissipating device 1072, and towards an opening 1090 between distal ends of the air louvers 1088.
  • the directions of air flow near the inlet fans 1086a and 1086b are represented by arrows 1092a and 1092b.
  • the heat sink configuration e.g., pin pitch, length of pins or fins
  • the louver configuration can be designed to optimize heat sink efficiency.
  • the co-packaged optical modules 1074 can be electrically coupled to the vertical printed circuit board 1068 using electrical contacts that include, e.g., spring-loaded elements, compression interposers, or land-grid arrays.
  • the vertical circuit board 1068 can be positioned such that the face of compression interposers of the co-packaged optical module 1074 is coplanar with the face plate 1064 and the inlet fans1086.
  • the face plate 1104 has a recessed portion or an inset portion 1106 that is offset at a distance d (referred to as the “front panel inset distance”) toward the rear of the housing 1102 relative to the other portions (e.g., the portions on which the inlet fans 1086a and 1086b are mounted) of the front panel 1104.
  • the inset portion 1106 is referred to as the “recessed front panel,” “recessed face plate,” “front panel inset,” or “face plate inset.”
  • the vertical printed circuit board 1068 is attached to the inset portion 1106, which includes openings to allow the co-packaged optical modules 1074 to pass through.
  • the inset portion 1106 is configured to have sufficient area to accommodate the co-packaged optical modules 1074.
  • the fins of the heat dissipating device 1072 can be more optimally positioned to be closer to the main air flow generated by the inlet fans 1086, while maintaining serviceability of the co-packaged optical modules 1074, e.g., allowing the user to repair or replace damaged co-packaged optical modules 1074 without opening the housing 1102.
  • the heat sink configuration e.g., pin pitch, length of pins or fins
  • the louver configuration can be designed to optimize heat sink efficiency.
  • the front panel inset distance d can be optimized to improve heat sink efficiency.
  • a rackmount server 1110 is similar to the rackmount server 1100 of FIG.71, except that the server 1110 includes a heat dissipating device 1112 that has fins 1114a and 1114b that extend beyond the edge of the vertical printed circuit board 1068 and closer to the inlet fans 1086a, 1086b, as compared to the fins in the example of FIG.71.
  • the configuration of the fins e.g., the shapes, sizes, and number of fins
  • the server 1120 includes one or more inlet fans 1086 mounted on the front panel 1124 and one or more exhaust fans 1050 mounted on the rear panel 1036.
  • the air flow in the housing 1122 is generally in the front-to-rear direction.
  • the directions of the air flows are represented by the arrows 1134.
  • Each vertical printed circuit board 1126 has a first surface and a second surface.
  • the first surface defines the length and width of the vertical printed circuit board 1126.
  • the distance between the first and second surfaces defines the thickness of the vertical printed circuit board 1126.
  • the vertical printed circuit board 1126a or 1126b is oriented such that the first surface extends along a plane that is substantially parallel to the front-to-rear direction relative to the housing 1122.
  • a rackmount server 1180 includes a housing 1182 having a front panel 1184 that has an inset portion 1186 (referred to as the “front panel inset” or “face plate inset”).
  • the server 1180 Comparing the rackmount server 1180 with the rackmount server 1150 of FIG.74A, the server 1180 allows the user to more easily access the co- packaged optical modules that are positioned farther away from the nominal plane of the front panel.
  • the angles ⁇ 1 and ⁇ 2 are selected to strike a balance between increasing the number of fiber cables that can be connected to the server and providing easy access to all of the co-packaged optical modules of the server.
  • the front panel inset width and angle are configured to enable hot-swap, in-field serviceability to avoid taking the switch and rack out of service for maintenance.
  • the front panel 1184 includes an upper air vent 1194a and baffles to direct outside air to enter through the upper air vent 1194a, flows downward and rearward such that the air passes over the surfaces of some of the fins and/or pins of the heat sinks 1186 (e.g., including the fins and/or pins closer to the top of the heat sinks 1186) and then flows toward an intake fan 1086c mounted at or near the distal or rear end of the front panel inset portion 1186.
  • an intake fan 1086c mounted at or near the distal or rear end of the front panel inset portion 1186.
  • the front panel 1184 includes a lower air vent 1194b and baffles to direct outside air to enter through the lower air vent 1194b, flows upward and rearward such that the air passes over the surfaces of some of the fins and/or pins of the heat sinks 1186 (e.g., including the fins and/or pins closer to the bottom of the heat sinks 1186) and then flows toward the intake fan 1086c.
  • Examples of the air flows through the upper and lower air vents 1194a, 1194b to the intake fan 1086c are represented by arrows 1196a, 1196b, 1196c, and 1196d in FIG.75C.
  • a rackmount server 1220 includes a housing 1222 having a front panel 1224, a rear panel 1036, a top panel 1226, a bottom panel 1038, and side panels 1040.
  • the front panel 1224 can be opened to allow the user to access components without removing the rackmount server 1220 from the rack.
  • the co-packaged optical module 1316 includes a photonic integrated circuit that modulates the power supply light based on data provided by a data processor to generate a modulated optical signal, and transmits the modulated optical signal to the co-packaged optical module 1312 through one of the optical fibers in the fiber bundle 1318.
  • the optical power supply 1330 is configured to provide optical power supply light to the co-packaged optical module 1316 through multiple links that have built-in redundancy in case of malfunction in some of the optical power supply modules.
  • the optical communication system 1380 can be expanded to include additional communication transponders.
  • An external photon supply 1382 provides optical power supply light to the first communication transponder 1282 through a first optical power supply link 1384, and provides optical power supply light to the second communication transponder 1284 through a second optical power supply link 1386.
  • the external photon supply 1282 provides continuous wave light to the first communication transponder 1282 and to the second communication transponder 1284.
  • the continuous wave light can be at the same optical wavelength. In another example, the continuous wave light can be at different optical wavelengths.
  • the first co-packaged optical module 1312 communicates with the second co-packaged optical module 1316 through an optical fiber bundle 1318 that includes multiple optical fibers.
  • the first and second switch boxes 1302, 1304 can have other configurations.
  • horizontally mounted ASICs can be used.
  • a fiber-optic array connector attached to a front panel can be used to optically connect the optical cable assembly 1340 to another fiber-optic cable that connects to a co- packaged optical module mounted on a circuit board inside the switch box.
  • the front panel can be mounted on hinges and a vertical ASIC mount can be recessed behind it.
  • the switch boxes can be replaced by other types of server computers.
  • the optical fiber guide modules 1504, 1506 are similar to the optical fiber guide module 1350 of FIG. 80B.
  • the common sheaths gather the optical fibers in a bundle so that they can be more easily handled, and the optical fiber guide modules guide the optical fibers so that they extend in various directions toward the devices that need to be optically coupled by the optical cable assembly 1490.
  • the optical fiber guide modules restrict bending of the optical fibers such that the bending radiuses are greater than minimum values specified by the optical fiber manufacturers to prevent excess optical light loss or damage to the optical fibers.
  • the optical fibers 1480 that extend from the include optical fibers that extend from the optical 1482 are surrounded and protected by a common sheath 1508.
  • the optical fibers 1480 separate into a first group of optical fibers 1510 and a second group of optical fibers 1512.
  • the first group of optical fibers 1510 extend to the first optical fiber connector 1492.
  • the second group of optical fibers 1512 extend toward the optical fiber guide modules 1504, 1506, which together function as a 1:3 splitter that separates the optical fibers 1512 into a third group of optical fibers 1514, a fourth group of optical fibers 1516, and a fifth group of optical fibers 1518.
  • the group of optical fibers 1514 extend to the optical fiber connector 1494
  • the group of optical fibers 1516 extend to the optical fiber connector 1496
  • the group of optical fibers 1518 extend to the optical fiber connector 1498.
  • each rack 1524 includes 15 servers 1522.
  • Each server 1522 directly communicates with a tier 1 switch 1526.
  • the left portion of the figure shows an enlarged view of a portion 1528 of the system 1520.
  • a server 1522a directly communicates with a tier 1 switch 1526a through a communication link 1530a.
  • servers 1522b, 1522c directly communicate with the tier 1 switch 1526a through communication links 1530b, 1530c, respectively.
  • the server 1522a directly communicates with a tier 1 switch 1526b through a communication link 1532a.
  • a data processing system e.g., data center
  • a data processing system 1540 includes tier-1 switches 1526 that are co-located in a rack 1540 separate from the N servers 1522 that are spread across K racks 1524.
  • Each server 1522 has a direct link to each of the tier-1 switches 1526.
  • the optical fiber extension cable 1572 includes a first optical fiber connector 1570 and a second optical fiber connector 1574.
  • the first optical fiber connector 1570 is connected to the server rack connector 1568
  • the second optical fiber connector 1574 is connected to the switch rack connector 1576.
  • the optical fibers 1578 include 288 optical fibers, of which 32 optical fibers 1580 are optically coupled to the optical power supply 1558.
  • the 256 optical fibers that carry 128 bi-directional communication channels are separated into four groups of 64 optical fibers, in which each group of 64 optical fibers is optically coupled to a co-packaged optical module 1582 in one of the switch boxes 1556.
  • the server rack on which the switch boxes 1556 are mounted is provided with switch rack connectors 1576 attached to the switch rack chassis, and corresponding optical fiber cable systems that each includes the optical fibers 1578 optically connected to the corresponding switch rack connector 1576, in which the optical fibers 1578 divides into separate bundles of optical fibers that are optically connected to the switch boxes 1556 and the optical power supply 1558.
  • a switch rack that is configured to connect up to 32 racks of servers 1552 can include 32 built-in switch rack connectors 1576, and 32 corresponding optical fiber cable systems that are optically connected to 32 co-packaged optical modules in each of the switch boxes 1556, and 32 laser sources in the optical power supply 1556.
  • the data processing system 1550 includes an optical fiber guide module 1590 that helps organize the optical fibers so that they are directed to the appropriate directions.
  • the optical fiber guide module 1590 also restricts bending of the optical fibers to be within the specified limits to prevent excess optical light loss or damage to the optical fibers.
  • the optical fiber guide module 1590 includes a first port 1592, a second port 1594, and a third port 1596.
  • the optical fibers that extend outward from the first port 1592 are optically coupled to the switch rack connector 1576.
  • the optical fibers that extend outward from the second port 1594 are optically coupled to the switch boxes.
  • the optical fibers that extend outward from the third port 1596 are optically coupled to the optical power supply 1558.
  • FIG. 87A shows the same modules as FIG.87A.
  • FIGS.136B, 136D, and 136F show enlarged portions 13600, 13602, and 13604, respectively, of the data processing system 1550 shown in FIG.136A.
  • FIG.136C shows an enlarged portion 13606 of the portion 13600 in FIG.136B.
  • the bundle 1562 of 9 optical fibers is optically coupled to the co-packaged optical module 1564 of the server 1552.
  • each bundle 1562 of optical fibers extends from the switch rack connector 1576 toward the servers 1552, in which each bundle 1562 includes 9 optical fibers as shown in FIG.136C. Only 4 bundles 1562 of optical fibers are shown in the figure.
  • the bundle 1562 of 9 optical fibers includes a bundle 13162 of 8 data optical fibers and 1 power supply optical fiber 13610.
  • the bundle 13612 of 8 data fibers extend from the switch rack connector 1576 toward the switch boxes 1556.
  • the power supply optical fiber 13610 extend towards the optical power supply 1558.
  • Power supply optical fibers 13616 extend from the
  • a bundle 13618 of 48 power supply optical fibers are used to carry power supply light from the optical power supply 1558 to the servers 1552 and the switch boxes 1556.
  • the bundle 13618 of power supply optical fibers includes a bundle 13620 of 32 power supply optical fibers 13612 that provide power supply light to the 32 servers 1552, and a bundle 13622 of 16 power supply optical fibers 13616 that provide power supply light to the 4 switch boxes 1556, in which each switch box 1556 receives power supply light from 4 power supply optical fibers 13616.
  • FIG.136E shows the portion 13602 with the optical fiber guide module 1590.
  • the optical fiber guide module 1590 includes the first port 1592, the second port 1594, and the third port 1596.
  • the optical fibers that extend outward from the first port 1592 are optically coupled to the switch rack connector 1576.
  • the optical fibers that extend outward from the second port 1594 are optically coupled to the switch boxes 1556.
  • the optical fibers that extend outward from the third port 1596 are optically coupled to the optical power supply 1558.
  • FIG.136F shows an enlarged view of the portion 13604 of the data processing system 1550 in FIG.136A.
  • FIG.136G shows an enlarged portion 13626 of the portion 13604 in FIG.136F.
  • FIG.136H shows an enlarged portion 13628 of the portion 13626 in FIG.136G.
  • each server 1552 is in optical communication with each of the 4 switch boxes 1556, and each switch box 1556 is in optical communication with every server 1552 in every server rack.
  • Each co-packaged optical module 13624 in the switch box 1556 is also optically connected to 4 power supply optical fibers 13616 (see FIG.136D).
  • Each co-packaged optical module 13624 can be optically connected to any number of power supply optical fibers, depending on the amount of power supply light needed for the operation of optical modulators in the co-packaged optical module 13624.
  • each co-packaged optical module can be optically connected through multiple power supply optical fibers to multiple optical power supplies to provide redundancy and increase reliability.
  • the co-packaged optical modules 13624 of the switch boxes 1556 receive power supply light from a remote optical power supply 1558 that is located outside of the housings of the switch boxes 1556 and optically connected to the co-packaged optical modules 13624 through power supply
  • the second segment 13704 includes an optical fiber connector 13718 that is optically coupled to an optical fiber connector 13720 of the third segment 13706.
  • the second segment 13704 includes 4 optical fiber connectors 13710 that are optically coupled to 4 switch boxes 1556 and 1 optical fiber connector 13722 that is optically coupled to the optical power supply 1558.
  • the optical fiber connector 13720 includes 32 power supply fiber ports, 128 transmitter fiber ports, and 128 receiver fiber ports.
  • the optical fiber connector 13722 includes 48 power supply fiber ports.
  • Each optical fiber connector 13710 includes 4 power supply fiber ports, 32 transmitter fiber ports, and 32 receiver fiber ports.
  • the number of power supply fiber ports, transmitter fiber ports, and receiver fiber ports described above are used as examples only, it is possible to have different numbers of power supply fiber ports, transmitter fiber ports, and receiver fiber ports depending on application. It is also possible to have different numbers of optical fiber connectors 13708, 13710, and 13722 depending on application. [0729] For example, when a data center is set up to include a first rack of servers 1552 and a rack of switch boxes 1556 and optical power supply 1558, the optical fiber cable 13700 can be used to optically connect the servers 1552 in the first rack to the switch boxes 1556 and the optical power supply 1558.
  • a data processing system 13800 uses wavelength division multiplexing (WMD) to transmit signals having multiple wavelengths (e.g., w1, w2, w3, w4) in the optical fibers, thereby reducing the number of optical fibers needed between the servers 1552 and the switch boxes 1556 for a given bandwidth, or increasing the bandwidth for a given number of optical fibers.
  • WMD wavelength division multiplexing
  • optical fibers 13816 that are connected to the servers 153802 of a rack 13804 terminate at a server rack connector 13818.
  • optical fibers 13820 that are connected to the switch boxes 13806 and the optical power supply 13808) terminate at a switch rack WDM translator 13822.
  • Each switch box 13806 is connected to each server 13802 of the rack 13804 through a pair of optical fibers that carry a bandwidth of 100 Gbps in each direction.
  • the optical power supply 13810 provides optical power supply light to co-packaged optical modules 13834 at the switch boxes 13806.
  • An optical fiber guide module can be provided to help organize the optical fibers so that they are directed to the appropriate directions.
  • the server rack on which the servers 13802 are mounted is provided with a server rack connector 13818 attached to the server rack chassis, and an optical fiber cable system that includes the optical fibers 13816 optically connected to the server rack connector 13818, in which the optical fibers 13816 divide into separate bundles 13812 of optical fibers that are optically connected to the servers 13802.
  • a switch rack that is configured to connect up to 32 racks of servers 13802 can include 32 built- in switch rack WDM translators 13822, and 32 corresponding optical fiber cable systems that are optically connected to 32 co-packaged optical modules in each of the switch boxes 13806, and 32 laser sources in the optical power supply 13808.
  • FIG.139B is a diagram of the wavelength/space shuffle matrix 13970.
  • the WDM signals use four different wavelengths (e.g., w1, w2, w3, w4), and the switch rack WDM translator 13822 uses 4x4 wavelength/space shuffle
  • the switch rack WDM translator 13822 includes eight 4x4 wavelength/space shuffle matrices 13970 to process the WDM signals from and to the 32 servers 13802.
  • the multiplexer/demultiplexer 13972a receives WDM signals from server 1 through optical fiber 13976a1, and sends WDM signals to server 1 through optical fiber 13976a2.
  • the multiplexer/demultiplexer 13972b receives WDM signals from server 2 through optical fiber 13976b1, and sends WDM signals to server 2 through optical fiber 13976b2.
  • the multiplexer/demultiplexer 13972c receives WDM signals from server 3 through optical fiber 13976c1, and sends WDM signals to server 3 through optical fiber 13976c2.
  • the multiplexer/demultiplexer 13974b receives a signal having the wavelength w1 from the multiplexer/demultiplexer 13972b, receives a signal having the wavelength w2 from the multiplexer/demultiplexer 13972a, receives a signal having the wavelength w3 from the multiplexer/demultiplexer 13972d, receives a signal having the wavelength w4 from the multiplexer/demultiplexer 13972c, combines the signals having the wavelengths w1, w2, w3, w4 into a WDM signal having wavelengths w1, w2, w3, w4, and sends the WDM signal to switch 2 through the optical fiber 13978b1.
  • the multiplexer/demultiplexer 13974a receives a WDM signal from switch 1, demultiplexes the WDM signal, and provides a signal having the wavelength w1 to the multiplexer/demultiplexer 13972a, provides a signal having the wavelength w2 to the multiplexer/demultiplexer 13972d, provides a signal having the wavelength w3 to the
  • the multiplexer/demultiplexer 13972b receives a signal having the wavelength w1 from the multiplexer/demultiplexer 13974b, receives a signal having the wavelength w2 from the multiplexer/demultiplexer 13974c, receives a signal having the wavelength w3 from the multiplexer/demultiplexer 13974d, receives a signal having the wavelength w4 from the
  • the multiplexer/demultiplexer 13972d receives a signal having the wavelength w1 from the multiplexer/demultiplexer 13974d, receives a signal having the wavelength w2 from the multiplexer/demultiplexer 13974a, receives a signal having the wavelength w3 from the multiplexer/demultiplexer 13974b, receives a signal having the wavelength w4 from the multiplexer/demultiplexer 13974c, combines the signals having the wavelengths w1, w2, w3, w4 into a WDM signal having wavelengths w1, w2, w3, w4, and sends the WDM signal to sever 4 through the optical fiber 13976d2.
  • 16 data optical fibers are used to connect the switch rack WDM translator 13822 to a co-packaged optical module of a switch 13806.
  • Each of 8 data optical fiber transmits a WDM signal have 4 wavelengths carrying signals from 4 servers 13802 to the switch 13806.
  • Each of 8 data optical fiber transmits a WDM signal have 4 wavelengths carrying signals from the switch 13806 to 4 servers 13802.
  • the power supply optical fibers pass through the switch rack WDM translator 13822 without being affected by the wavelength/space shuffle matrices 13970.
  • each multiplexer/demultiplexer 13972 functions as a demultiplexer that demultiplexes a WDM signal (from a corresponding server 13802) having multiple wavelengths into the component signals, in which each component signal has a single wavelength, and the different component signals are sent to different switches 13806.
  • Each multiplexer/demultiplexer 13974 functions as re-multiplexer that multiplexes the component signals from different servers 13802 into a WDM signal having multiple wavelengths that is sent to a corresponding switch 13806.
  • the second interface of the WDM translator includes a third set of optical fiber ports that output WDM signals having N wavelengths to the switches 13806, a fourth set of optical fiber ports that receive WDM signals having N wavelengths from the switches 13806, and a second set of power supply fiber ports that are optically coupled to the optical power supply module 13808.
  • the optical power supply 13808 provides power supply light having multiple wavelengths that correspond to the wavelengths in the WDM signals transmitted by the servers 13802 and the switches 13806. Any technique for providing power supply light for supporting photonic integrated circuits that process WDM signals can be used.
  • FIG.140A shows the same data processing system 13800 of FIG.138.
  • the bundle 13846 of power supply optical fibers includes a bundle 13848 of 32 power supply optical fibers 13840 that provide power supply light to the 32 servers 13802, and a bundle 13850 of 8 power supply optical fibers 13844 that provide power supply light to the 4 switch boxes 13806, in which each switch box 13806 receives power supply light from 2 power supply optical fibers 13844.
  • FIG.140E shows the portion 13902 with an optical fiber guide module 13854.
  • the optical fiber guide module 13854 includes a first port 13856, a second port 13858, and a third port 13860.
  • the optical fibers that extend outward from the first port 13856 are optically coupled to the switch rack WDM translator 13822.
  • the optical fibers that extend outward from the second port 13858 are optically coupled to the switch boxes 13806.
  • the optical fibers that extend outward from the first port 13856 are optically coupled to the switch rack WDM translator 13822.
  • each server 13802 is in optical communication with each of the 4 switch boxes 13806, and each switch box 13806 is in optical communication with every one of the 32 servers 13802 in every one of the 32 server racks.
  • each co-packaged optical module 1391 in the switch box 13806 is optically connected to 2 power supply optical fibers 13844 (see FIG.140D).
  • an optical fiber cable 14100 configured to optically connect the servers 13802, the switch boxes 13806, and the optical power supply 13808 includes three main segments: (i) a first segment 14102 that includes optical fiber connectors 14108 that are optically coupled to the co-packaged optical modules of the servers 13802, (ii) a second segment includes optical fiber connectors 14110 that are optically coupled to the co-packaged optical modules of the switch boxes 13806, and an optical fiber connector 14112 that is optically coupled to the optical power supply 13808, and (iii) an optical fiber extension cable
  • the data processing system 13800 of FIG.138 uses 4 wavelengths over a fiber pair as opposed to 4 parallel spatial paths over 8 fibers used in the data processing system 1550 of FIG.87A.
  • the data processing system 13800 of FIG.138 includes a switch-to-rack WDM translator that has combinations of demultiplexers and multiplexers that function as wavelength/space shuffle matrices.
  • the switch-to-rack WDM translator 13822 can be replaced with an optical fiber
  • the first and second optical fiber connectors 1602, 1604 can be, e.g., the optical fiber connectors 1342 and 1344 of FIGS.80B, 80C, the optical fiber connectors 1402 and 1404 of FIGS. 82B, 82C, or the optical fiber connectors 1570 and 1574 of FIG.87A.
  • the principles for designing the optical fiber interconnection cable 1600 can be used to design the optical cable assembly 1340 of FIGS.80B, 80C, the optical cable assembly 1400 of FIGS. 82B, 82C, and the optical cable assembly 1490 of FIGS.84B, 84C.
  • each optical fiber connector 1602 or 1604 includes 3 rows of optical fiber ports, each row including 12 optical fiber ports.
  • the optical transponder can be connected to either the optical fiber connector 1602 or the optical fiber connector 1604.
  • the mapping of the fiber ports is designed such that each transmitter port of the optical fiber connector 1602 is mapped to a corresponding receiver port of the optical fiber connector 1604, and each receiver port of the
  • the optical fiber connectors 1662 and 1664 are designed such that either the first optical fiber connector 1662 or the second optical fiber connector 1664 can be connected to a given communication transponder that is compatible with the optical fiber interconnection cable 1660.
  • the diagram shows the fiber port mapping when viewed from the outer edge of the optical fiber connector into the optical fiber connector (i.e., toward the optical fibers in the interconnection cable 1660).
  • the first optical fiber connector 1662 includes transmitter fiber ports (e.g., 1614a, 1616a), receiver fiber ports (e.g., 1618a, 1620a), and optical power supply fiber ports (e.g., 1622a, 1624a).
  • the first optical transponder transmits first data and/or control signals through the transmitter ports (e.g., 1614a, 1616a) of the first optical fiber connector 1662, and the second optical transponder receives the first data and/or control signals from the corresponding receiver fiber ports (e.g., 1618b, 1620b) of the second optical fiber connector 1664.
  • the transmitter ports 1614a, 1616a are optically coupled to the corresponding receiver fiber ports 1618b, 1620b through optical fibers 1628, 1630, respectively.
  • the second optical transponder transmits second data and/or control signals through the transmitter ports (e.g., 1614b, 1616b) of the second optical fiber connector 1664, and the first optical transponder receives the second data and/or control signals from the corresponding receiver fiber ports (1618a, 1620a) of the first optical fiber connector 1662.
  • the transmitter port 1616b is optically coupled to the corresponding receiver fiber port 1620a through an optical fiber 1632.
  • a first optical power supply transmits optical power supply light to the first optical
  • a second optical power supply transmits optical power supply light to the second optical transponder through the power supply fiber ports of the second optical fiber connector 1664.
  • the first and second power supplies can be different (such as the example of FIG.80B) or the same (such as the example of FIG.82B).
  • an optical fiber interconnection cable having a pair of optical fiber connectors i.e., a first optical fiber connector and a second optical fiber connector
  • the arrangement of the transmitter fiber ports, the receiver fiber ports, and the power supply fiber ports in the optical fiber connectors have a number of properties. These properties are referred to as the “universal optical fiber interconnection cable port mapping properties.”
  • the term “mapping” here refers to the arrangement of the transmitter fiber ports, the receiver fiber ports, and the power supply fiber ports at particular locations within the optical fiber connector.
  • the larger distance from the bottom row (the third row in the examples of FIGS.89 and 90) to the connector edge can be used as a “marker” to guide the user to attach the optical fiber connector to the
  • a universal optical fiber interconnection cable has a first optical fiber connector and a second optical fiber connector that are mirror images of each other after swapping the transmitter fiber ports to receiver fiber ports and swapping the receiver fiber ports to transmitter fiber ports in the mirror image, and the mirror image is
  • each optical fiber connector should be TX-RX pairwise symmetric and PS symmetric with respect to a center axis parallel to the column direction.
  • a universal optical fiber interconnection cable has a first optical fiber connector and a second optical fiber connector that are mirror images of each other after swapping the transmitter and receiver fiber ports in the mirror image, and the mirror image is generated with respect to a reflection axis parallel to the row direction, as in the example of FIG.90, then each optical fiber connector should be TX-RX pairwise symmetric and PS symmetric with respect to a center axis parallel to the row direction.
  • a universal optical fiber interconnection cable a.
  • n_trx strands of TX/RX fibers and n_p strands of power supply fibers in which 0 ⁇ n_p ⁇ n_trx.
  • the n_trx strands of TX/RX fibers are mapped 1:1 from a first optical fiber connector to the same port positions on a second optical fiber connector through the optical fiber cable, i.e. the optical fiber cable can be laid out in a straight manner without leading to any cross-over fiber strands.
  • Those connector ports that are not 1:1 connected by TX/RX fibers may be connected to power supply fibers via a break-out cable.
  • a universal optical module connector has the following properties: a.
  • the mapping of the transmitter, receiver, and power supply fiber ports in the first optical fiber connector 1662 is the same as the mapping of the transmitter, receiver, and power supply fiber ports in the optical fiber connector 1664.
  • Row 1, column 1 of the optical fiber connector 1662 is a power supply fiber port (1622a), and row 1, column 1 of the optical fiber connector 1664 is also a power supply fiber port (1622b).
  • Row 1, column 3 of the optical fiber connector 1662 is a transmitter fiber port (1614a), and row 1, column 3 of the optical fiber connector 1664 is also a transmitter fiber port (1614b).
  • each optical fiber connector 1662, 1664 is TX-RX pairwise symmetric and PS symmetric with respect to the center axis that is parallel to the column direction.
  • the power supply fiber ports are symmetric with respect to the center axis, i.e., if there is a power supply fiber port in the left half portion of the first optical fiber connector 1662, there will also be a power supply fiber port at the mirror location in the right half portion of the first optical fiber connector 1662.
  • the transmitter fiber ports and the receiver fiber ports are pairwise symmetric with respect to the main axis, i.e., if there is a transmitter fiber port in the left half portion of the first optical fiber connector 1662, there will be a receiver fiber port at a mirror location in the right half portion of the first optical fiber connector 1662.
  • FIG.90 is a diagram showing another example of the fiber port mapping for an optical fiber interconnection cable 1670 that includes a pair of optical fiber connectors, i.e., a first optical fiber connector 1672 and a second optical fiber connector 1674.
  • FIG.143 is an enlarged view of the diagram of FIG.90.
  • the power supply power ports are labeled ‘P’
  • the transmitter fiber ports are labeled ‘T’
  • the receiver fiber ports are labeled ‘R’. Only some
  • Each of the first and second optical fiber connectors 1672, 1674 is TX-RX pairwise symmetric and PS symmetric with respect to the central axis that is parallel to the row direction.
  • the optical fiber connector 1672 can be divided in two halves along a central axis parallel to the row direction.
  • the power supply fiber ports e.g., 1678, 1680 are symmetric with respect to the center axis.
  • the transmitter fiber ports (e.g., 1682, 1684) and the receiver fiber ports (e.g., 1686, 1688) are pairwise symmetric with respect to the center axis, i.e., if there is a transmitter fiber port (e.g., 1682 or 1684) in the upper half portion of the first optical fiber connector 1672, then there will be a receiver fiber port (e.g., 1686, 1688) at a mirror location in the lower half of the optical fiber connector 1672. Likewise, if there is a receiver fiber port in the upper half portion of the optical fiber connector 1672, then there is a transmitter fiber port at a mirror location in the lower half portion of the optical fiber connector 1672. In the example of FIG.
  • FIG.91 is a diagram of an example of a viable port mapping for an optical fiber connector 1700 of a universal optical fiber interconnection cable.
  • FIG. 144 shows the diagram of FIG.91 in which the power supply power ports 1702 are labeled ‘P’, the transmitter fiber ports 1704 are labeled ‘T’, and the receiver fiber ports 1706 are labeled ‘R’.
  • the optical fiber connector 1700 includes power supply fiber ports (e.g., 1702), transmitter fiber ports (e.g., 1704), and receiver fiber ports (e.g., 1706).
  • the optical fiber connector 1700 is TX-RX pairwise symmetric and PS symmetric with respect to the center axis that is parallel to the column direction.
  • FIG.92 is a diagram of an example of a viable port mapping for an optical fiber connector 1710 of a universal optical fiber interconnection cable.
  • FIG. 145 shows the diagram of FIG.92 in which the power supply power ports are labeled ‘P’, the transmitter fiber ports are labeled ‘T’, and the receiver fiber ports are labeled ‘R’.
  • the optical fiber connector 1710 includes power supply fiber ports (e.g., 1712), transmitter fiber ports (e.g., 1714), and receiver fiber ports (e.g., 1716).
  • the optical fiber connector 1710 is TX-RX pairwise symmetric and PS symmetric with respect to the center axis that is parallel to the column direction.
  • FIG.93 is a diagram of an example of a port mapping for an optical fiber connector 1720 that is not appropriate for a universal optical fiber interconnection cable.
  • FIG.146 shows the diagram of FIG.93 in which the power supply power ports are labeled ‘P’, the transmitter fiber ports are labeled ‘T’, and the receiver fiber ports are labeled ‘R’.
  • the optical fiber connector 1720 includes power supply fiber ports (e.g., 1722), transmitter fiber ports (e.g., 1724), and receiver fiber ports (e.g., 1726).
  • the optical fiber connector 1720 is not TX- RX pairwise symmetric with respect to the center axis that is parallel to the column direction, or the center axis that is parallel to the row direction.
  • FIG.94 is a diagram of an example of a viable port mapping for a universal optical fiber interconnection cable that includes a pair of optical fiber connectors, i.e., a first optical fiber connector 1800 and a second optical fiber connector 1802.
  • the mapping of the transmitter, receiver, and power supply fiber ports in the first optical fiber connector 1800 is the same as the mapping of the transmitter, receiver, and power supply fiber ports in the second optical fiber connector 1802.
  • the port mapping of the first optical fiber connector 1800 is a mirror image of the port mapping of the second optical fiber connector 1802 after swapping the transmitter and receiver ports in the mirror image. The mirror image is generated with respect to a reflection axis 1804 at the connector edge parallel to the column direction.
  • the optical fiber connector 1800 is TX-RX pairwise symmetric and PS symmetric with respect to the center axis 1806 that is parallel to the column direction.
  • FIG.95 is a diagram of an example of a viable port mapping for a universal optical fiber interconnection cable that includes a pair of optical fiber connectors, i.e., a first optical fiber connector 1810 and a second optical fiber connector 1812.
  • the power supply power ports are labeled ‘P’
  • the transmitter fiber ports are labeled ‘T’
  • the receiver fiber ports are labeled ‘R’.
  • the mapping of the transmitter, receiver, and power supply fiber ports in the first optical fiber connector 1810 is the same as the mapping of the transmitter, receiver, and power supply fiber ports in the second optical fiber connector 1812.
  • the port mapping of the first optical fiber connector 1810 is a mirror image of the port mapping of the second optical fiber connector 1812 after swapping the transmitter and receiver ports in the mirror image.
  • a viable port mapping for a universal optical fiber interconnection cable can be designed such that an optical fiber connector includes (i) columns that all have even numbers of fiber ports, (ii) columns that all have odd numbers of fiber ports, or (iii) columns that have mixed even and odd numbers of fiber ports.
  • the switch boxes (e.g., 1302, 1304) includes co-packaged optical modules (e.g., 1312, 1316) that is optically coupled to the optical fiber interconnection cables or optical cable assemblies (e.g., 1340, 1400, 1490) through fiber array connectors.
  • the fiber array connector can correspond to the first optical connector part 213 in FIG.20.
  • the optical fiber connector (e.g., 1342, 1344, 1402, 1404, 1492, 1498) of the optical cable assembly can correspond to the second optical connector part 223 in FIG.20.
  • the port map (i.e., mapping of power supply fiber ports, transmitter fiber ports, and receiver fiber ports) of the fiber array connector (which is optically coupled to the photonic integrated circuit) is a mirror image of the port map of the optical fiber connector (which is optically coupled to the optical fiber interconnection cable).
  • the port map of the fiber array connector refers to the arrangement of the power supply, transmitter, and receiver fiber ports when viewed from an external edge of the fiber array connector into the fiber array connector.
  • universal optical fiber connectors have symmetrical properties, e.g., each optical fiber connector is TX-RX pairwise symmetric and PS symmetric with respect to one of the main or center axes, which can be parallel to the row direction or the column direction.
  • each fiber array connector also has the same symmetrical properties, e.g., each fiber array connector is TX-RX pairwise symmetric and PS symmetric with respect to one of the main or center axes, which can be parallel to the row direction or the column direction.
  • a restriction can be imposed on the port mapping of the optical fiber connectors of the optical cable assembly such that the optical fiber connector can be pluggable when rotated by 180 degrees, or by 90 degrees in the case of a square connector. This results in further port mapping constraints.
  • FIG.101 is a diagram of an example of an optical fiber connector 1910 having a port map 1912 that is invariant against a 180-degree rotation. Rotating the optical fiber connector 1910180 degrees results in a port map 1914 that is the same as the port map 1912. The port map 1912 also satisfies the second universal optical fiber interconnection cable port mapping property, e.g., the optical fiber connector is TX-RX pairwise symmetric and PS symmetric with respect to the center axis parallel to the column direction.
  • FIG.102 is a diagram of an example of an optical fiber connector 1920 having a port map 1922 that is invariant against a 90-degree rotation.
  • FIG.103A is a diagram of an example of an optical fiber connector 1930 having a port map 1932 that is TX-RX pairwise symmetric and PS symmetric with respect to the center axis parallel to the column direction.
  • the original port map 1932 is recovered.
  • the mirror image 1934 is generated with respect to a reflection axis at the connector edge parallel to the column direction.
  • the port map 1932 of the optical fiber connector 1930 is also TX-RX pairwise symmetric and PS symmetric with respect to the center axis parallel to the row direction.
  • the mirror image 1936 is generated with respect to a reflection axis at the connector edge parallel to the row direction.
  • one or more fans e.g., 1086, 1092, 1848, 1894 blow air across the heatsink (e.g., 1072, 1114, 1130, 1168, 1846) thermally coupled to the data processor (e.g., 1844).
  • the co-packaged optical modules can generate heat, in which some of the heat can be directed toward the heatsink and dissipated through the heatsink. To further improve heat dissipation from the co-packaged optical
  • the rackmount system includes two fans placed side-by- side, in which a first fan blows air toward the co-packaged optical modules that are mounted on a front side of the printed circuit board (e.g., 1068), and a second fan blows air toward the heatsink that is thermally coupled to the data processor mounted on a rear side of the printed circuit board.
  • the one or more fans can have a height that is smaller than the height of the housing (e.g., 1824) of the rackmount server (e.g., 1820).
  • the co-packaged optical modules can occupy a region on the printed circuit board (e.g., 1068) that extends in the height direction greater than the height of the one or more fans.
  • One or more baffles can be provided to guide the cool air from the one or more fans or intake air duct to the heatsink and the co-packaged optical modules.
  • One or more baffles can be provided to guide the warm air from the heatsink and the co-packaged optical modules to an air duct that directs the air toward the rear of the housing.
  • FIG.104 shows a top view of an example of a rackmount device 1940.
  • the rackmount device 1940 includes a vertically oriented printed circuit board or substrate 1230 positioned at a distance behind a front panel 1224 that can be closed during normal operation of the device, and opened for maintenance of the device, similar to the configuration of the rackmount server 1220 of FIG.77A.
  • a data processing chip 1070 is electrically coupled to the rear side of the vertical printed circuit board or substrate 1230, and a heat dissipating device or heat sink 1072 is thermally coupled to the data processing chip 1070.
  • Co-packaged optical modules 1074 are attached to the front side (i.e., the side facing the front exterior of the housing 1222) of the vertical printed circuit board or substrate 1230.
  • a first fan 1942 is provided to blow air across the co-packaged optical modules 1074 at the front side of the printed circuit board or substrate 1230.
  • a second fan 1944 is provided to blow air across the heatsink 1072 to the rear of the printed circuit board or substrate 1230.
  • the first and second fans 1942, 1944 are positioned at the left of the printed circuit board or substrate 1230. Cooler air (represented by arrows 1946) is directed from the first and second fans 1942, 1944
  • FIG.105 shows a front view of an example of the rackmount device 1940 when the front panel 1224 is opened to allow access to the co-packaged optical modules 1074.
  • the first and second fans 1942, 1944 have a height that is smaller than the height of the region occupied by the co-packaged optical modules 1074.
  • a first baffle 1952 directs the air from the fan 1942 to the region where the co-packaged optical modules 1074 are mounted, and a second baffle 1954 directs the air from the region where the co-packaged optical modules 1074 are mounted to the air duct 1950.
  • the first and second fans 1942, 1944 have a height that is smaller than the height of the housing of the rackmount device 1940.
  • Remote laser sources 1956 can be positioned above and below the fans. Remote laser sources 1956 can also be positioned above and below the air duct 1950.
  • a switch device having a 51.2 Tbps bandwidth can use thirty-two 1.6 Tbps co-packaged optical modules.
  • FIG.108 is a diagram of an example of a rackmount device 1970 that is similar to the rackmount device 1940 of FIGS.104, 105, 107, except that the optical axes of the laser modules 1956 are oriented at an angle ⁇ relative to the front-to-rear direction, 0 ⁇ ⁇ ⁇ 90°. This can reduce the bending of the optical fibers that are optically connected to the laser modules 1956.
  • FIG.109 is a diagram showing the front view of the rackmount device 1970, with the optical cable assembly 1960 optically connected to modules of the rackmount device 1970.
  • the laser modules 1956 are oriented at an angle ⁇ relative to the front-to-rear direction, 0 ⁇ ⁇ ⁇ 90°, fewer laser modules 1956 can be placed in the spaces above and below the fans 1942, 1944 and the air duct 1950, as compared to the example of FIGS.104, 105, 107, in which the optical axes of the laser modules 1956 are oriented parallel to the front-to-rear direction.
  • a total of 64 laser modules are placed in the spaces above and below the fans 1942, 1944 and the air duct 1950.
  • FIG.111 is a front view diagram of the rackmount device 1980, with the optical cable assembly 1960 optically connected to modules of the rackmount device 1980.
  • the laser modules 1956a are positioned to the left side of the space above and below the fans 1942, 1944. Sufficient space (e.g., 1982) is provided at the right of the laser modules 1956a to allow the user to conveniently connect or disconnect the fiber connectors 1964 to the laser modules 1956a.
  • the laser modules 1956b are positioned above and below the air duct 1950. Sufficient space (e.g., 1984) is provided at the left of the laser modules 1956b to allow the user to conveniently connect or disconnect the fiber connectors 1964 to the laser modules 1956b.
  • FIG.112 a table 1990 shows example parameter values of the rackmount device 1940.
  • FIGS.113 and 114 show another example of a rackmount device 2000 and example parameter values.
  • FIGS.115 and 116 are a top view and a front view, respectively, of the rackmount device 2000.
  • An upper baffle 2002 and a lower baffle 2004 are provided to guide the air flowing from the fans 1942, 1944 to the heatsink 1072 and the co-packaged optical modules 1074, and from the heatsink 1072 and the co-packaged optical modules 1074 to the air duct 1950.
  • portions of the upper and lower baffles 2002, 2004 form portions of the upper and lower walls of the air duct 1950.
  • the upper baffle 2002 includes a cutout or opening 2006 that allows optical fibers 2008 to pass through. As shown in FIG.116, the optical fibers 2008 extend from the co- packaged optical modules 1074 upward, through the cutout or opening 2006 in the upper baffle 2002, and extend toward the laser modules 1956 along the space above the upper baffle 2002.
  • the upper baffle 2002 allows the optical fibers 2008 to be better organized to reduce the obstruction to the air flow caused by the optical fibers 2008.
  • the lower baffle 2004 has a similar cutout or opening to help organize the optical fibers that are optically connected to the laser modules located in the space below the fans 1942, 1944.
  • the hinged front panel includes a mechanism that shuts off the remote laser source modules 1956, or reduces the power to the remote laser source modules 1956, once the front panel 11702 is opened. This prevents the technicians from being exposed to harmful radiation.
  • the laser source modules 1956 and the optical fibers for providing the power supply light are disposed behind the front panel 11702.
  • FIG.118 is a diagram of an example of a system 2120 that includes a recirculating reservoir 2122 that circulates a coolant 2124 to carry heat away from the data processor 2126, which for example can be a switch integrated circuit.
  • the data processor 2126 is mounted at the back side of the substrate and obscured from view.
  • FIGS.119 to 122 are examples that provide heat dissipating solutions for co-packaged optical modules, taking into consideration the locations of “hot aisles” in data centers.
  • FIG.119 shows a top view of an environment 11900, e.g., in a data center, in which multiple rackmount servers 11902 are installed.
  • the servers 11902 include inlet fans 11904 positioned at the front 11906 and outlet fans 11908 at the rear 11910.
  • FIG.120 is a simulation of the thermal properties of the rackmount server 11902 in which the heat sink 1846 is thermally coupled a second heat sink 17202 through heat pipes 17204. In this simulation, the temperature distribution of the server 11902 ranged from about 27°C to about 110.5°C.
  • the region 11920 where the inlet fans 11904 are located has a temperature of about 27°C, which is the room temperature used in the simulation.
  • the junction 11922 between the data processor and the heat sink has a temperatures below 105°C, which shows that the thermal design used in this example can provide adequate cooling to the data processor electrically coupled to the vertical circuit board positioned near the front panel.
  • a rackmount server 12000 can include a duct 12002 inside the housing 11912 to transfer cold air to the co-packaged optical modules 12004 that are now mounted on the back side.
  • one or more inlet fans 12006 are provided at the front of the duct 12002, and one or more fans 12008 are provided at the rear of the duct 12002 to blow the air toward the heat sink 12010 thermally coupled to the data processor, and to the co-packaged optical modules 12004.
  • An electronic processor 12308 is mounted on the first side 12304 of the substrate 12302, in which the electronic processor 12308 is configured to process or store data.
  • the electronic processor 12308 can be a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, or an application specific integrated circuit (ASIC).
  • the electronic processor 12308 can be a memory device or a storage device.
  • processing of data includes writing data to, or reading data from, the memory or storage device, and optionally performing error correction.
  • the memory device can be, e.g., random access memory (RAM), which can include, e.g., dynamic RAM (DRAM) or static RAM (SRAM).
  • RAM random access memory
  • the storage device can include, e.g., solid state memory or drive, which can include, e.g., one or more non-volatile memory (NVM) Express® (NVMe) SSD (solid state drive) modules, or Intel® OptaneTM persistent memory.
  • NVM non-volatile memory
  • FIG. 123 shows one electronic processor 12308, through there can also be multiple electronic processors 12308 mounted on the substrate 12302.
  • the vertically mounted processor blade 12300 includes one or more optical interconnect modules or co-packaged optical modules 12310 mounted on the second side 12306 of the substrate 12302.
  • the optical interconnect module 12310 includes
  • the optical interconnect module or co-packaged optical module 12310 can be similar to, e.g., the integrated optical communication device 262 of FIG.6; 282 of FIGS.
  • the optical interconnect module or co-packaged optical module 12310 does not necessarily have to include serializers/deserializers (SerDes), e.g., 216, 217 of FIGS.2 to 8 and 10 to 12.
  • the optical interconnect module or co-packaged optical module 12310 can include the photonic integrated circuit 12314 without any serializers/deserializers.
  • the serializers/deserializers can be mounted on the substrate separate from the optical interconnect module or co-packaged optical module 12310.
  • the substrate 12302 can include electrical connectors that extend from the first side 12304 to the second side 12306 of the substrate 12302, in which the electrical connectors pass through the substrate 12302 in a thickness direction.
  • the optical fiber cables 12314 can be connected to the optical interconnect modules 12310 through a fixed connector (in which the optical fiber cable 12314 is securely fixed to the optical interconnect module 12310) or a removable connector in which the optical fiber cable 12314 can be easily detached from the optical interconnect module 12310, such as with the use of an optical connector part 266 as shown in FIG.6.
  • the removable connector can include a structure similar to the mechanical connector structure 900 of FIGS.46, 47 and 51A to 57.
  • the substrate 12302 can be positioned near the front panel of the housing of the server that includes the vertically mounted processor blade 12300, or away from the front panel and located anywhere inside the housing.
  • the substrate 12302 can be parallel to the front panel of the housing, perpendicular to the front panel, or oriented in any angle relative to the front panel.
  • the substrate 12302 can be oriented vertically to facilitate the flow of hot air and improve dissipation of heat generated by the electronic processor 12308 and/or the optical interconnect modules 12310.
  • the optical interconnect module or co-packaged optical module 12310 can receive optical signals through vertical or edge coupling.
  • FIG.123 shows an example in which the optical fiber cables are vertically coupled to the optical interconnect modules or co- packaged optical modules 12310. It is also possible to connect the optical fiber cables to the edges of the optical interconnect modules or co-packaged optical modules 12310.
  • optical fibers in the optical fiber cable can be attached in-plane to the photonic integrated circuit using, e.g., V-groove fiber attachments, tapered or un-tapered fiber edge coupling, etc., followed by a mechanism to direct the light interfacing to the photonic integrated circuit to a direction that is substantially perpendicular to the photonic integrated circuit, such as one or more substantially 90-degree turning mirrors, one or more substantially 90-degree bent optical fibers, etc.
  • the optical interconnect modules 12310 can receive optical power from an optical power supply, such as 1322 of FIG.80A, 1558 of FIG.87A.
  • the optical interconnect modules 12310 can include one or more of optical coupling interfaces 414, demultiplexers 419, splitters 415, multiplexers 418, receivers 421, or modulators 417 of FIG.20.
  • FIG.124 is a top view of an example of a rack system 12400 that includes several vertically mounted processor blades 12300.
  • the vertically mounted processor blades 12300 can be positioned such that the optical fiber connectors 12312 are near the front of the rack system 12400 (which allows external optical fiber cables to be optically coupled to the front of the rack system 12400), or near the back of the rack system 12400 (which allows external optical fiber cables to be optically coupled to the back of the rack system 12400).
  • rack systems 12400 can be stacked vertically similar to the example shown in FIG.76, in which the server rack 1214 includes several servers 1212 stacked vertically, or the example shown in FIG.87A, in which several servers 1552 are stacked vertically in a rack 1554.
  • the optical interconnect modules 12310 can receive optical power from an optical power supply, such as 1558 of FIG.87A.
  • the vertically mounted processor blades 12300 can include blade pairs, in which each blade pair includes a switch blade and a processor blade.
  • the electronic processor of the switch blade includes a switch, and the electronic processor of the processor blade is configured to process data provided by the switch.
  • the electronic processor of the processor blade is configured to send processed data to the switch, which switches the processed data with other data, e.g., data from other processor blades.
  • the optical interconnect module or co- packaged optical module 12310 is mounted on the second side of the substrate 12302.
  • the optical interconnect module 12310 or the optical fiber cable 12314 extends through or partially through an opening in the substrate 12302, similar to the example shown in FIGS.35A to 35C.
  • the photonic integrated circuit in the optical interconnect module 12310 is electrically coupled to the electronic processor 12308 or to another electronic circuit, such as a serializers/deserializers module positioned at or near the first side of the substrate 12302.
  • the optical interconnect module 12310 and the optical fiber cable 12314 define a signal path that allows a signal from the optical fiber cable 12314 to be transmitted from the second side of the substrate 12302 through the opening to the electronic processor 12308.
  • the signal is converted from an optical signal to an electric signal by the photonic integrated circuit, which defines part of the signal path.
  • a rackmount server 12370 can have a hinge-mounted front panel, similar to the example shown in FIG.77A.
  • server 12370 includes a housing 12372 having a top panel 12374, a bottom panel 12376, and a front panel 12378 that is coupled to the bottom panel 12376 using a hinge 12324.
  • a vertically mounted substrate 12880 is positioned substantially perpendicular to the bottom panel 12376 and recessed from the front panel 12378.
  • the substrate 12380 includes a first side facing the front direction relative to the housing 12372 and a second side facing the rear direction relative to the housing 12372.
  • At least one electronic processor or data processing chip 12382 is electrically coupled to the second side of the vertical substrate 12380, and a heat dissipating device or heat sink 12384 is thermally coupled to the at least one data processing chip 12382.
  • Co-packaged optical modules 12386 are attached to the first side of the vertical substrate 12380.
  • the substrate 12380 provides high-speed connections between the co-packaged optical modules 12386 and the data processing chip 12382.
  • the co-packaged optical module 12386 is optically connected to a first fiber connector part 12388, which is optically connected through a fiber pigtail 12320 to one or more second fiber connector parts 12322 mounted on the front panel 12378.
  • the front panel 12378 is rotatably connected to the bottom panel by the hinge 12324.
  • the front panel 12378 can be rotatably connected to the top panel 12374 or the side panel 12376 so as to flap upwards or to flap sideways when opened.
  • the electronic processor or data processing chip 12382 can be a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, or an application specific integrated circuit (ASIC).
  • the electronic processor 12382 can be a memory device or a storage device. In this context, processing of data includes writing data to, or reading data from, the memory or storage device, and optionally performing error correction.
  • the co-packaged optical module (or optical interconnect module) 12386 can be similar to, e.g., the integrated optical communication device 262 of FIG.6; 282 of FIGS.7-9; 462, 466, 448, 472 of FIG.17; 612 of FIG.23; 684 of FIG.26; 704 of FIG.27; 724 of FIG.28; the co-packaged optical module 1074 of FIGS.68A, 69A, 70, 71A; 1132 of FIG.73A; 1160 of FIG.
  • FIG.130 is a side view of an example of a rackmount server 13000 that has a hinge- mounted front panel.
  • the rackmount server 13000 includes a housing 13002 having a top panel 13004, a bottom panel 13006, and an upper swivel front panel 13008 that is coupled to a lower fixed front panel 13030 using a hinge 13010.
  • the hinge can be attached to the side panel so that the front panel is opened horizontally.
  • a horizontally mounted host printed circuit board 13012 is attached to the bottom panel 13006.
  • the co-packaged optical module 13022 is optically connected to a first fiber connector part 13024, which is optically connected through a fiber pigtail 13026 to one or more second fiber connector parts 13028 attached to the back side of the front panel 13008.
  • the second fiber connector parts 13028 can be optically connected to optical fiber cables that pass through openings in the hinged front panel 13008.
  • FIG.131 is a top view of an example of a rackmount server 13100 that is similar to the rackmount server 13000 of FIG.130 except that one or more rows of external laser sources 13102 are placed inside the housing 13002.
  • the first MPO connector 13200 is optically coupled to the CPO module 13022 and includes, e.g., 36 fiber ports (e.g., 3 rows of fiber ports, each row having 12 fiber ports, similar to the fiber ports shown in FIGS.80D, 80E, 82D, 82E, 89 to 93), which includes 4 power supply fiber ports and 32 data fiber ports.
  • the laser supply MPO connector 13202 is
  • the datapath MPO connectors 13204 are optically coupled to external optical fiber cables.
  • each external optical fiber cable can support a 400GBASE-DR4 link, so the four datapath MPO connectors 13204 can support 16 full-duplex 400G DR4+ signals (100G per fiber).
  • the jumper cable 13206 fans the MPO connector 13200 out to datapath MPOs 13204 on the front panel 13008 (e.g., 4 x 400G DR4+ using 4 x 1x12 MPOs or 2 x 800G DR8+ using 2 x 2x12 MPOs) and the laser supply MPO 13202.
  • the eight (8) data optical fibers 13208 optically connect eight (8) transmit or receive fiber ports of each datapath MPO connector 13204 to the corresponding transmit or receive fiber ports of the first MPO connector 13200.
  • the power supply optical fibers 13034 can be polarization maintaining optical fibers.
  • the fan-out cable 13206 can handle multiple functions including merging the external laser source and data paths, splitting of external light source between multiple CPO modules 13022, and handling polarization.
  • the optical connector leverages an MPO type connection and can have a similar or smaller force as compared to a standard MPO connector.
  • Each pluggable module 12404 includes a co- packaged optical module 12386, one or more multi-fiber push on (MPO) connectors 12406, a fiber guide 12408 that mechanically connects the co-packaged optical module 12386 to the one or more multi-fiber push on connectors 12406, and a fiber pigtail 12410 that optically connects the co-packaged optical module 12386 to the one or more multi-fiber push on connectors 12406.
  • the length of the fiber guide 12408 is designed such that
  • the housing 12372 can include guide rails or guide cage 12412 that help guide the pluggable modules 12404 so that the electrical connectors of the co-packaged optical modules 12386 are aligned with the electrical connectors on the printed circuit board.
  • the rackmount server 12420 has inlet fans mounted near the front panel 12402 and blow air in a direction substantially parallel to the front panel 12402, similar to the examples shown in FIGS.96 to 98, 100, 104, 105, 107 to 116.
  • the height h1 of the fiber guide 12408 (measured along a direction perpendicular to the bottom panel) can be designed to be smaller than the height h2 of the multi-fiber push on connectors 12406 so that there is space 12412 between adjacent fiber guides 12408 (in the vertical direction) to allow air to flow between the fiber guides 12408.
  • the fiber guide 12408 can be a hollow tube with inner dimensions sufficiently large to accommodate the fiber pigtail 12410.
  • the fiber guide 12408 can be made of metal or other thermally conductive material to help dissipate heat generated by the co-packaged optical module 12386.
  • the fiber guide 12408 can have arbitrary shapes, e.g., to optimize thermal properties.
  • a front view 12512 (at the upper right of FIG.126A) shows an example of a front panel 12514 with an upper group of array connectors 12516, a lower group of array connectors 12518, a left group of array connectors 12520, and a right group of array connectors 12522.
  • Each rectangle in the groups of array connectors 12516, 12518, 12520, 12522 in the front view 12512 represents an array connector 12506.
  • each group of array connectors 12516, 12518, 12520, 12522 includes 16 array connectors 12506.
  • a front view 12524 (at the middle right of FIG.126A) shows an example of a recessed vertically mounted printed circuit board or substrate 12526 on which an application specific integrated circuit (ASIC) or data processing chip 12382 is mounted on the rear side and not shown in the front view 12524.
  • the printed circuit board or substrate 12526 has an upper group of electrical contacts 12528, a lower group of electrical contacts 12530, a left group of electrical contacts 12532, and a right group of electrical contacts 12534.
  • Each rectangle in the groups of electrical contacts 12528, 12530, 12532, 12534 in the front view 12524 represents an array of electrical contacts associated with one co-packaged optical module 12504.
  • each group of electrical contacts 12528, 12530, 12532, 12534 includes 8 arrays of electrical contacts that are configured to be electrically coupled to the electrical contacts of 8 co-packaged optical modules 12504.
  • each co- packaged optical module 12504 is optically coupled to two array connectors 12506, so the number of rectangles shown in the front view 12512 is twice the number of squares shown in the front view 12524.
  • the front panel 12514 includes openings that allow insertion of the pluggable modules 12502. In this example, each opening has a size that can accommodate two array connectors 12506.
  • a top view 12536 (at the lower right of FIG.126A) of the front portion of the rackmount server 12500 shows a top view of the pluggable modules 12506.
  • the two left-most pluggable modules 12538 include co-packaged optical modules 12504 that are electrically coupled to the electrical contacts in the left group of electrical contacts 12532 shown in the front view 12524, and include array connectors 12506 in the left group of array connectors 12520 shown in the front view 12512.
  • the two right-most pluggable modules 12540 include co-packaged optical modules 12504 that are electrically coupled to the electrical contacts in the right group of electrical contacts 12534
  • the four middle pluggable modules 12542 include co-packaged optical modules 12504 that are electrically coupled to the electrical contacts in the upper group of electrical contacts 12528 shown in the front view 12524, and include array connectors 12506 in the upper group of array connectors 12516 shown in the front view 12512.
  • the front view 12524 (at the middle right of FIG.126A) shows a first inlet fan 12544 that blows air from left to right across the space between the front panel 12514 and the printed circuit board or substrate 12526.
  • the top view 12536 (at the lower right of FIG. 126A) shows the first inlet fan 12544 and a second inlet fan 12546.
  • the first inlet fan 12544 is mounted at the front side of the printed circuit board or substrate 12526 and blows air across the pluggable modules 12502 to help dissipate the heat generated by the co-packaged optical modules 12504.
  • the second inlet fan 12546 is mounted at the rear side of the printed circuit board or substrate 12526 and blows air across the data processing chip 12382 and the heat dissipating device 12314.
  • the left side view 12550 also shows pluggable modules 12554 that correspond to the lower group of array connectors 12518 in the front view 12512 and the lower group of electrical contacts 12530 in the front view 12524.
  • guide rails or guide cage 12556 can be provided to help guide the pluggable modules 12502 so that the electrical connectors of the co-packaged optical modules 12504 are aligned with the electrical contacts on the printed circuit board or substrate 12526.
  • the pluggable modules 12502 can be fastened at the front panel 12514, e.g., using clip mechanisms.
  • a left side view 12558 of the front portion of the rackmount server 12500 shows pluggable modules 12560 that correspond to the left group of array connectors 12520 in the
  • each co-packaged optical module can receive optical signals from a large number of fiber cores, and each co-packaged optical module can be optically coupled to external fiber optic cables through three or more array connectors that occupy an overall area at the front panel that is larger than the overall area occupied by the co-packaged optical module on the printed circuit board.
  • a rackmount server 12600 is designed to use pluggable modules 12602 having a spatial fan-out design.
  • Each pluggable module 12602 includes a co-packaged optical module 12604 that is optically coupled, through a fiber pigtail 12606, to one or more array connectors 12608 that have an overall area larger than the area of the co-packaged optical module 12604. The area is measured along the plane parallel to the front panel.
  • each co-packaged optical module 12604 is optically coupled to 4 array connectors 12608.
  • the pluggable module 12602 includes a tapered fiber guide 12610 that is narrower near the co-packaged optical module 12604 and wider near the array connectors 12608.
  • a front view 12612 (at the upper right of FIG.126B) shows an example of a front panel 12614 that can accommodate an array of 128 array connectors 12608 arranged in 16 rows and 8 columns.
  • the front view 12524 (at the middle right of FIG. 126B) of the recessed printed circuit board or substrate 12526 and the top view (at the lower right of FIG.126B) of the front portion of the rackmount server 12600 are similar to corresponding views in FIG.126A.
  • a left side view 12616 (at the middle left of FIG.126B) shows an example of pluggable modules 12602 that have co-packaged optical modules that are connected to the upper and lower groups of electrical contacts on the printed circuit board or substrate 12526.
  • a left side view 12618 (at the lower left of FIG.126B) shows an example of pluggable modules 12602 that have co-packaged optical modules that are connected to the left group of
  • a CPO front panel pluggable module 12700 can include a blind mate connector 12702 that is designed receive optical power supply light.
  • FIG.127 includes a side view 12704 of a rackmount server 12706 that includes laser sources 12708 that provide optical power supply light to the co-packaged optical modules 12710 in the pluggable modules 12700.
  • the laser sources 12708 are optically coupled, through optical fibers 12712, to optical connectors 12714 that are configured to mate with the blind-mate connectors 12702 on the pluggable modules 12700.
  • a safety shut-off mechanism is provided.
  • a mechanical shutter can be provided on disconnection of the blind-mate connector 12702 from the optical connector 12712.
  • one or more photon supplies 12800 can be provided in the fiber guide 12408 to provide power supply light to the co-packaged optical module 12386 through one or more power supply optical fibers 12802.
  • the one or more photon supplies 12800 can be selected to have a wavelength (or wavelengths) and
  • Each photon supply 12800 can include, e.g., one or more diode lasers having the same or different wavelengths.
  • Electrical connections can be used to provide electrical power to the one or more photon supplies 12800. In some implementations, the electrical connections are configured such that when the co-packaged optical module 12386 is removed from the substrate 12380, the electrical power to the one or more photon supplies 12800 is turned off. This prevents light from the one or more photon supplies 12800 from harming operators. Additional signals lines (not shown in the figure) can provide control signals to the photon supply 12800.
  • electrical connections to the photon supplies 12800 are made to the system through the CPO module 12386.
  • electrical connections to the photon supplies 12800 use parts of the fiber guide 12408, which in some embodiments is made from electrically conductive materials.
  • the fiber guide 12408 is made of multiple parts, some of which are made from electrically conductive materials and some of which are made from electrically insulating materials.
  • two electrically conductive parts are mechanically connected but electrically separated by an electrical insulating part.
  • the photon supply can be thermally coupled to a heat dissipating device that is isolated from the other heat dissipating device(s) thermally coupled to other heat-generating electronic circuitry in the pluggable module so as to maintain the photon supply at a more stable temperature or lower temperature.
  • a pluggable module 16700 includes a co-packaged optical module 16702, one or more multi-fiber push on (MPO) connectors 16704, a fiber guide 16706 that mechanically connects the co-packaged optical module 16702 to the one or more multi-fiber push on connectors 16704, a fiber array pigtail 16708 that optically connects the co-packaged optical module 16702 to the one or more multi-fiber push on connectors 16704, a photon supply (e.g., one or more lasers) 16710, and one or more
  • MPO multi-fiber push on
  • the pluggable module 16700 includes a CPO module heat sink 16714 and a laser heat sink 16716 that are thermally isolated from each other.
  • the fiber guide 16706 can be made of thermally conductive material, such as metal, and functions as the CPO module heat sink 16714.
  • the CPO module heat sink 16714 is thermally coupled to the CPO module 16702, and the laser heat sink 16716 is thermally coupled to the laser(s) of the photon supply 16710.
  • an air gap can be provided between the CPO module heat sink 16714 and the laser heat sink 16716 to thermally isolate the laser heat sink 16716 from the CPO module heat sink 16714.
  • a thermally insulating material 16718 can be positioned between the CPO module heat sink 16714 and the laser heat sink 16716.
  • the CPO module heat sink 16714 and the laser heat sink 16716 can be made of a material having a thermal conductivity greater than 50 W/mK (Watts per meter- Kelvin), preferably greater than 100 W/mK, and more preferably greater than 200 W/mK.
  • the CPO module heat sink 16714 and the laser heat sink 16716 can be made of a metal or a metal alloy, such as aluminum, aluminum alloy, brass, copper, zinc, or a combination of the above.
  • the CPO module heat sink 16714 and the laser heat sink 16716 can have fins to increase the heat dissipation surface area.
  • the CPO module heat sink 16714 and the laser heat sink 16716 can be made of the same material or different materials.
  • the thermally insulating material 16718 can have a thermal conductivity less than 10 W/mK, preferably less than 1 W/mK.
  • the thermally insulating material 16718 can be made of quartz, silicone rubber, or plastic.
  • the CPO module 16702 has a first side that is optically coupled to a two- dimensional arrangement (e.g., 2D array) of optical fibers of the fiber array pigtail 16708.
  • the CPO module 16702 has a second side that has (or is coupled to) a two-dimensional array electrical interface 16720 that includes a two-dimensional arrangement (e.g., 2D array) of electrical contacts 16722.
  • the CPO module 16702 enables a high throughput data path between external optical fiber cable(s) and the data processor (e.g., 12382 of FIGS.125B, 129). In order to process the large amount of data passing through the
  • the electronic circuitry that processes the electrical signals can generate a significant amount of heat.
  • the heat generated by the electronic circuity for processing the electrical signals associated with the CPO module 16712 can vary significantly depending on the amount of data passing through the CPO module 16712 at a given time.
  • the temperature of the CPO module heat sink 16714 can vary greatly.
  • Thermally isolating the laser heat sink 16716 from the CPO module heat sink 16712 can have one or more of the following advantages.
  • the technique of thermally isolating the heat sink for the laser(s) of the photon supply from the heat sink(s) for the other heat-generating electronic circuitry in the pluggable module can be applied to other types of pluggable modules, such as pluggable modules that have form factors that comply with common industry standards, such as SFP (small form- factor pluggable), SFP+ (or 10 Gb SFP), SFP28, OSFP (octal SFP), OSFP-XD (OSFP extra dense), QSFP (quad small form-factor pluggable), QSFP+, QSFP28, QSFP56, or QSFP-DD (quad small form-factor pluggable double density).
  • SFP small form- factor pluggable
  • SFP+ or 10 Gb SFP
  • SFP28 or 10 Gb SFP
  • OSFP octal SFP
  • OSFP-XD OSFP extra dense
  • QSFP quad small form-factor pluggable
  • QSFP+ quad small form-factor pluggable
  • a pluggable module 16800 has a form factor that complies with, e.g., SFP, SFP+ (or 10 Gb SFP), SFP28, OSFP, OSFP-XD, QSFP, QSFP+, QSFP28, QSFP56, or QSFP-DD standard.
  • the pluggable module 16800 includes a photonic integrated circuit (which is obscured from view in the figure) and two laser modules 16802 that provide optical power supply light to the photonic integrated circuit.
  • the photonic integrated circuit is thermally coupled to the housing 16804, which is thermally conductive.
  • the housing 16804 is thermally coupled to a CPO module heat sink 16806 mounted on a top side of the housing 16804.
  • the laser modules 16802 are thermally coupled to a laser heat sink 16808 using thermal gap pads (TIM) 16810.
  • the laser heat sink 16808 is thermally isolated from the CPO module heat sink 16806, either by an air gap, or by a thermally insulating material 16812.
  • FIG.168B is a diagram of an example of the top panel 16814 of the housing 16804 of
  • FIG.170A is a diagram showing the results of a simulation demonstrating the thermal isolation of the laser modules 16802.
  • FIG.170B is a diagram of a cross section of the laser heat sink 16808 used in the simulation.
  • the air flow is about 2.5 CFM, and each of the laser modules is rated at 1.25 W.
  • Table 1 shows, for various ambient air temperatures, the temperature of the pluggable module case or housing, and the temperature of the laser heat sink.
  • Table 1 shows that in this example, the laser heat sink 16808 can have a temperature that is about 1.3 °C to 1.4 °C lower than the case temperature during operation of the pluggable module 16800.
  • the parameter values described above, such as air flow CFM, laser power wattage, and ambient air temperature are used as examples only. It is understood that the pluggable modules can operate in different environmental conditions, such as having different ambient temperatures and air flows.
  • the amount of heat generated by the electronic circuitry can vary.
  • the design of the CPO module heat sink and the laser heat sink can vary, such as having different configurations (e.g., geometry and number) of fins to increase the heat dissipation
  • the material of the housing and heat sinks can vary, such as using aluminum, aluminum alloy, copper, copper alloy, or a combination of the above.
  • the CPO module heat sink can be integrated with the housing and made of a same material.
  • the material for the housing with the integrated CPO module heat sink can be the same or different from the material for the laser heat sink.
  • the temperature of the laser heat sink can be much lower than the temperature of the CPO module heat sink.
  • the CPO module heat sink can have a temperature of about 67.6 °C, while the laser heat sink can have a lower temperature of about 39.0 °C.
  • the CPO module heat sink can have a temperature of about 69.5 °C, while the laser heat sink can have a lower temperature of about 38.5 °C.
  • the laser heat sink is thermally isolated from the CPO module heat sink, we mean that an air gap or a thermally insulating material is provided between the laser heat sink and the CPO module heat sink to significantly reduce the amount of heat transferred between the CPO module heat sink and the laser heat sink.
  • the CPO module 12386 is coupled to spring-loaded elements or compression interposers mounted on the substrate 12380.
  • a rackmount server 12920 includes a substrate 12380 that is attached to a printed circuit board 12906, which has an opening to allow the data processing chip 12382 to protrude or partially protrude through the opening and be attached to the substrate 12380.
  • the printed circuit board 12906 can have many functions, such as providing support for a large number of electrical power connections for
  • the CPO module 12386 can be mounted on the substrate 12380 through a CPO mount or a front lattice 12902.
  • a bolster plate 12914 is attached to the rear side of the printed circuit board 12906. Both the substrate 12380 and the printed circuit board 12906 are sandwiched between the CPO mount or front lattice 12902 and the bolster plate 12914 to provide mechanical strength so that CPO modules 12386 can exert the required pressure onto the substrate 12380.
  • Guide rails/cage 12900 extend from the front panel 12904 or the front portion of the fiber guide 12408 to the bolster plate 12914 and provide rigid connections between the CPO mount 12902 and the front panel 12904 or the front portion of the fiber guide 12408.
  • Clamp mechanisms 12908 such as screws, are used to fasten the guide rails/cage 12900 to the front portion of the fiber guide 12408.
  • the screws 12908 are tightened, which pulls the guide rails/cage 12900 forward, thereby pulling the bolster plate 12914 forward and provide a counteracting force that pushes the spring-loaded elements or the compression interposers in the direction of the CPO module 12386.
  • Springs 12910 can be provided between the guide rails 12900 and the front portion of the fiber guide 12408 to provide some tolerance in the positioning of the front portion of the fiber guide 12408 relative to the guide rails 12900.
  • FIG.129 shows front views of the guide rails/cage 12900.
  • the guide rails 12900 can include multiple rods (e.g., four rods) that are arranged in a configuration based on the shape of the front portion of the fiber guide 12408. If the front portion of the fiber guide 12408 has a square shape, the four rods of the guide rails 12900 can be positioned near the four corners of the front portion of the squared-shaped fiber guide 12408.
  • a guide cage 12912 can be provided to enclose the guide rails 12900. The guide rails 12900 can also be used without the guide cage 12912.
  • the data processing chip 12382 includes electrical contacts that are electrically coupled to electrical contacts on a first side (the side facing toward the rear panel of the housing) of the substrate 12380, and the co-packaged optical modules 12386 include electrical contacts that are coupled to electrical contacts on a second side (the side facing toward the front panel of the housing) of the substrate 12380. At least some of the electrical contacts on the first side of the substrate 12380 are electrically coupled to at least some of the electrical contacts on the second side of the substrate 12380,
  • the electrical signals can be transmitted between the co-packaged optical module(s) 12386 and the data processor 12382.
  • the electrical signals generated by the co-packaged optical modules are transmitted to the data processor 12382, it is understood that the electrical signals from the co-packaged optical module(s) 12386 are not necessarily transmitted directly to the data processor 12382. Rather, the electrical signals from the co- packaged optical module(s) 12386 can be further processed, such as by amplifiers, serializers/deserializers, retimers, and/or digital signal processors.
  • the electrical signals from the co-packaged optical modules(s) can be modulated or demodulated, or the modulation method can be changed, prior to being sent to the data processor.
  • the electrical signals generated by the data processor are transmitted to the co-packaged optical module(s)
  • the electrical signals from the data processor are not necessarily transmitted directly to the co-packaged optical module(s). Rather, the electrical signals from the data processor can be further processed, such as by amplifiers, serializers/deserializers, retimers, and/or digital signal processors.
  • the electrical signals from the data processor can be modulated or demodulated, or the modulation method can be changed, prior to being sent to the co-package optical module(s).
  • the substrate 12380 can be, e.g., a ceramic substrate, an organic high density build-up substrate, or a silicon substrate. In some examples, the substrate 12380 can be replaced by a printed circuit board.
  • the data processing chip 12380 has electrical contacts that are electrically coupled to electrical contacts on a first side of a first substrate
  • the co- packaged optical modules 12386 has electrical contacts that are coupled to electrical contacts on a first side of a second substrate. Electrical contacts on a second side of the first substrate are electrically coupled to electrical contacts on a second side of the second substrate. This allows electrical signals to be transmitted between the data processing chip and the co- packaged optical modules.
  • the first substrate can be replaced by a first printed circuit board.
  • the second substrate can be replaced by a second printed circuit board.
  • the data processor is electrically coupled to a first substrate
  • the co-packaged optical module(s) are electrically coupled to a second substrate
  • the first substrate is mounted to a first side of a third substrate
  • the second substrate is mounted to a second side of the third substrate.
  • the third substrate can function as an interposer in which
  • the arrangement of the electrical contacts on a first side of the third substrate can be different from the arrangement of electrical contacts on a second side of the third substrate.
  • one or more of the first, second, and third substrates can be replaced by one or more printed circuit boards.
  • Each substrate can be, e.g., a ceramic substrate, an organic high density build-up substrate, or a silicon substrate.
  • Each substrate or printed circuit board can function as an interposer in which the arrangement of the electrical contacts on a first side of the substrate or printed circuit board can be different from the arrangement of electrical contacts on a second side of the substrate or printed circuit board.
  • Each co-packaged optical module 12386 can include a substrate, a photonic integrated circuit mounted on the substrate, and one or more electronic integrated circuits.
  • One or more electronic integrated circuits can be mounted on the photonic integrated circuit, and one or more electronic integrated circuits can be mounted on the substrate beside the photonic integrated circuit. Additional examples of the arrangements of the photonic integrated circuit and the electronic integrated circuits are shown in FIGS.162 to 166D.
  • FIG.133 shows a top view diagram 17600 and a side view diagram 17601 of a rackmount server 17602 that has a hinged front panel 17604 having front panel fiber connectors 13028 (see FIG.130).
  • Co-packaged optical modules 13022 are optically coupled to the fiber connectors 13028 through fiber pigtails 13026.
  • Pluggable external laser sources (ELS) 13032 provide power supply light that are transmitted through optical fibers 13034 to the CPO modules 13022.
  • ELS external laser sources
  • the server 17602 is similar to the server 11700 of FIG.117, except that the air inlet grid 17608 is larger, and the external laser sources 13032 (or 1956 of FIG. 105) have front-to-back airflow cooling through the use of two extra fans behind the laser
  • the configuration of the inlet fans 17710 results in unidirectional airflow, as represented by the arrows 17712.
  • the VASIC- plane front view 17704 shows the front view when the hinged front panel is opened and lowered.
  • the front-panel front view 17706 shows the air inlet grid 17714 and front panel fiber connectors 17716.
  • the connectors 17716 can include 64 LC connectors (providing a bandwidth of 1.6 Tbps FR16) or 128 MPO connectors (providing a bandwidth of 400 Gbps DR4).
  • FIG.135 shows a top view 17800 of an example of a rackmount server 17802 in which the external laser sources 17804 are mounted below the VASIC-plane and directly accessible from the front panel for easy front-panel access/serviceability.
  • a VASIC-plane front view 17806 shows the front view when the hinged front panel is opened and lowered.
  • a front-panel front view 17808 shows the air intake grid, the front panel fiber connectors, and the external laser sources.
  • one of the inlet fans is mounted, attached, or coupled to the front panel, or positioned very close to the front panel.
  • the inlet fan nearest the front panel can be positioned at a distance from the front panel, e.g., a few inches from the front panel, or within one-fourth of the distance between the front panel and the rear panel (which can correspond to the depth of the housing).
  • the distance between the fan and the front panel refers to the distance between the tip of the fan blade and the front panel.
  • the fan blade rotates during operation, so when we say that the distance between the fan and the front panel is within one-fourth the distance between the front panel and the rear panel, we mean that the fan is positioned near the front panel in which at least a portion of a fan blade
  • the pluggable optical module 15200 it may be useful to adopt two-dimensional arrays of fiber interfaces to connect two- dimensional arrays of optical fibers to the photonic integrated circuits.
  • the inventors realized that by orienting the substrate or circuit board vertically, i.e., perpendicular to the bottom surface of the housing 15202, it is possible to implement two- dimensional fiber array interfacing to the photonic integrated circuits, thereby significantly increasing the bandwidth supported by the pluggable optical module.
  • FIG.154C is a diagram of an example co-packaged optical module 15310 that can fit inside the housing 15304 of the OSFP module 15300 with the substrate or circuit board oriented vertically (relative to the horizontal bottom wall of the housing).
  • the co-packaged optical module 15310 includes a photonic integrated circuit 15312 mounted on a substrate (or circuit board) 15314, in which a first set of electrical integrated circuits 15316 are mounted on the photonic integrated circuit 15312, and a second set of electrical integrated circuits 15318 are mounted on the substrate 15314 adjacent to the photonic integrated circuit 15312.
  • a micro optics connector 15322 optically couples the photonic integrated circuit 15312 to an optical fiber cable.
  • FIG.154F is a cross-sectional diagram of an example OSFP-XD pluggable optical module 15340 in which the co-packaged optical module 15320 is fitted in the space defined by the housing 15306, with the substrate 15314 of the co-packaged optical module 15320 substantially perpendicular to the bottom surface of the housing 15304 of the OSFP pluggable optical module 15340.
  • the top surface of the photonic integrated circuit 15312 is substantially perpendicular to the bottom surface of the housing 15304, allowing a two- dimensional array of optical fibers to be coupled to the photonic integrated circuit 15312.
  • FIG.155B is a front view (along a plane parallel to the x-y plane) of the co-packaged optical module 15502.
  • FIG.155C is a rear view of the connector module 15504.
  • the fiber harness 15706 includes a bundle of fibers 15708 that are coupled to an optical fiber connector 15710 that is coupled to the photonic integrated circuit 15312.
  • the fiber harness 15706 includes the optical fibers 15704, which are also optically connected to the optical fiber connector 15710. Power supply light is transmitted from the laser sources 15702 through the optical fibers 15704 and the power supply fiber ports of the optical fiber connector 15710 to the photonic integrated circuit 15312.
  • FIG.157D is a diagram of an example of the fiber port mapping for the optical fiber connector 15710.
  • the power supply power ports 1702 are labeled ‘P’
  • the transmitter fiber ports 1704 are labeled ‘T’
  • the receiver fiber ports 1706 are labeled ‘R’.
  • FIG.161 is a side view cross-sectional diagram of an example pluggable optical module 16100 plugged into a cage 15402, in which an edge connector 15404 (e.g., a paddle card) is mated with a receptacle 15406.
  • the pluggable optical module 16100 includes a housing 15306 and a co-packaged optical module 16102.
  • the co-packaged optical module 16102 includes a photonic integrated circuit 15312 mounted on a substrate (or circuit board) 16104 that is oriented parallel to the bottom surface of the housing and is positioned lower than the edge connector (or paddle card or connector tongue) 15404.
  • a tongue-to-board connector 16106 is provided to mechanically and electrically couple the substrate (or circuit board) 16104 to the edge connector (or paddle card or connector tongue) 15404.
  • the substrate 16104 and the edge connector 15404 can be mechanically coupled by solder joints.
  • a fiber harness 16104 optically connects the optical connector 15204 to a fiber bend or turning mirror 16108 that interfaces with the photonic integrated circuit 15312.
  • a co-packaged optical module 16700 includes a substrate 16702 and a photonic integrated circuit 16704 mounted on the substrate 16702.
  • a lens array 16706 and a micro optics connector 16708 optically couples the photonic integrated circuit 16704 to an optical fiber cable.
  • the lens array 16706 and the micro optics connector 16708 will be referred to as the optical connector.
  • a first set of one or more integrated circuits 16710 are mounted on the top side of the photonic integrated circuit 16704 using, e.g., copper pillars, or solder bumps.
  • the first set of one or more integrated circuits 16710 is positioned adjacent to or near the optical connector.
  • two or more integrated circuits 16710 can be positioned on two or more sides of the optical connector, surrounding or partially
  • FIG.163A shows the substrate 16702, the photonic integrated circuit 16704, the first set of electrical integrated circuits 16710 mounted on the photonic integrate circuit 16704, and a second set of electrical integrated circuits 16712 mounted on the substrate 16702.
  • FIG.163B shows the same components as those shown in the left diagram, with the addition of a smart connector 16800 that connects to an optical fiber cable, and a socket 16802 that electrically couples to the electrical contacts on the bottom side of the substrate 16702.
  • the socket 16802 can be on another substrate or circuit board 16804.
  • FIGS.164A and 164B shows additional examples of perspective views of the co- packaged optical module 16700.
  • FIG.166A shows an example in which a photonic integrated circuit 16704 has an active layer 17100 that is positioned near the top surface of the photonic integrated circuit
  • the bottom surface of the photonic integrated circuit 16704 in FIG.166B corresponds to the rear surface of photonic integrated circuit 15312 in FIG.155A.
  • the through silicon vias 17104 provide signal conduction paths in the thickness direction through the silicon die or substrate of the photonic integrated circuit 16704.
  • the drivers and transimpedance amplifiers in the electrical integrated circuits 16710 can be positioned directly under the photonic integrated circuit active components, such as the photodiodes and the electro-optic modulators, so that the shortest electrical signal paths can be used between the photonic integrated circuit 16704 and the electrical integrated circuits 16710.
  • FIG.166C shows an example in which the fiber connection 17102 is coupled to the photonic integrated circuit 16704 through the bottom side (in a configuration referred to as “backside illumination”), such that the optical signals from the fiber connection 17102 pass through the silicon die or substrate before being received by the photodetectors in the active PIC layer 17100.
  • the bottom side of the photonic integrated circuit 16704 in FIG.166C corresponds to the front side of the photonic integrated circuit facing the optical connector
  • the integrated circuit can have an L-shape that surrounds two sides of the vertical fiber connector (e.g., two of north, east, south, and west sides).
  • the integrated circuit can have a U-shape that surrounds three sides of the vertical fiber connector (e.g., three of north, east, south, and west sides).
  • the integrated circuit can have an opening in the center region to allow the vertical fiber connector to pass through, in which the integrated circuit completely surrounds the vertical fiber connector.
  • the dimensions of the opening in the integrated circuit are selected to allow the optical fiber connector to pass through to enable an optical fiber to be optically coupled to the photonic integrated circuit.
  • the integrated circuit with an opening in the center region can have a circular or polygonal shape at the outer perimeter.
  • a feature of the integrated circuit mounted on the same surface as the vertical fiber connector is that it takes advantage of the space available on the surface of the photonic integrated circuit that is not occupied by the vertical fiber connector so that the electrical integrated circuit can be placed near or adjacent to the active components (e.g., photodetectors and/or modulators) of the photonic integrated circuit.
  • active components e.g., photodetectors and/or modulators
  • an integrated circuit defining an opening can be manufactured by the following process: [0985] Step 1: Use semiconductor lithography to form an integrated circuit on a semiconductor die (or wafer or substrate), in which a first interior region of the semiconductor die does not have integrated circuit component intended to be used for the final integrated circuit (but can have components intended to be used for other products). [0986] Step 2: Use a laser (or any other suitable cutting tool) to cut an opening in the first interior region of the semiconductor die. [0987] Step 3: Place the semiconductor die on a lower mold resin that defines an opening in an interior region. A lead frame or electrical connectors are attached to the lower mold resin.
  • An integrated circuit having an L-shape or a U-shape can be manufactured using a similar process. For example, in step 1, circuitry is formed in an L-shaped or U-shaped footprint. In step 2, the laser or cutting tool cuts the die according to the L-shape or U-shape footprint. In steps 3 and 5, a lower mold resin and an upper mold resin having the desired L- shape or U-shape are used. [0991] Additional details of the components used in the data processing systems described in this document, e.g., the co-packaged optical modules, the optical modules, the optical communication interfaces, the photonic integrated circuits, the electronic integrated circuits, etc., can be found in U.S. patent application 17/478,483, filed on September 17, 2021,
  • Embodiment 5 The system of any of embodiments 1 to 3 in which the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector has a front surface that is flush with, or protrudes from, a front surface of the front panel to enable a user to attach at least one external fiber optic cable to the at least one first optical connector.
  • Embodiment 6 The system of any of embodiments 1 to 3 in which the fiber guide has a length configured such that when the pluggable module is inserted through the opening in the front panel and the optical module is coupled to the first substrate or a module mounted on the first substrate, the at least one first optical connector has a front face that is within an inch of a front surface of the front panel.
  • Embodiment 7 The system of any of embodiments 1 to 6 in which the fiber guide has a length of at least one inch.
  • Embodiment 8 The system of any of embodiments 1 to 6 in which the fiber guide has a length of at least two inches.
  • Embodiment 19 The system of embodiment 18 in which each of the first and second substrate comprises at least one of a ceramic substrate, an organic high density build-up substrate, or a silicon substrate.
  • Embodiment 20 The system of any of embodiments 1 to 19, comprising an inlet fan mounted near the front panel and configured to increase an air flow across a surface of at least one of (i) the optical module, or (ii) a heat dissipating device thermally coupled to the optical module.
  • Embodiment 21 The system of embodiment 20, comprising two or more pluggable modules, in which each pluggable module comprises an optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the optical module and the first optical connector, and a fiber guide that is positioned between the optical module and the first optical connector; wherein the fiber guides are configured to allow air blown from the inlet fan to flow past the fiber guides and carry away heat generated by the optical module.
  • Embodiment 22 The system of any of embodiments 1 to 21, comprising a laser module configured to provide optical power to the optical module.
  • Embodiment 23 The system of embodiment 22, comprising a second optical connector optically coupled to the laser module, wherein the pluggable module comprises a third optical connector that is configured to mate with the second optical connector when the pluggable module is coupled to the first substrate, and wherein the first optical connector is optically coupled to the optical module to enable the optical module to receive the optical power from the laser module.
  • Embodiment 24 The system of embodiment 22 or 23, comprising a first heat dissipating device and a second heat dissipating device, the first heat dissipating device is thermally isolated from the second heat dissipating device, the first heat dissipating device is thermally coupled to the optical module, and the second heat dissipating device is thermally coupled to the laser module.
  • Embodiment 25 The system of any of embodiments 1 to 23 in which the fiber guide comprise at least one of metal or a thermal conductive material.
  • Embodiment 26 The system of any of embodiments 1 to 25 in which the fiber guide comprises a hollow tube.
  • Embodiment 27 The system of any of embodiments 1 to 26 in which the fiber guide is rigid along a direction from the first optical connector to the optical module and has a strength sufficient to withstand a compression force exerted on the pluggable module when the pluggable module is inserted through the opening in the front panel and coupled to the first substrate.
  • Embodiment 28 The system of any of embodiments 1 to 27 in which the fiber guide has a spatial fan-out design such that a first portion of the fiber guide near the optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.
  • Embodiment 29 The system of embodiment 28 in which the at least one first optical connector has an overall footprint that is larger than a footprint of the optical module.
  • Embodiment 30 The system of any of embodiments 1 to 29 in which the data processor comprises at least a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a digital signal processor, a microcontroller, an application specific integrated circuit (ASIC), or a storage device.
  • Embodiment 31 The system of any of embodiments 1 to 30 in which a photon supply is disposed in, on, or near the fiber guide, and the photon supply is configured to provide optical power supply light to the optical module.
  • Embodiment 32 The system of embodiment 31 in which the photon supply is thermally coupled to an inner surface or an outer surface of the fiber guide, and the fiber guide is configured to assist in dissipating heat from the photon supply.
  • Embodiment 33 The system of any of embodiments 1 to 32, comprising guide rails configured to guide the optical module as the optical module move from a first position near the front panel to a second position near the first substrate.
  • Embodiment 34 The system of embodiment 33 in which the optical module comprises a co-packaged optical module comprising a photonic integrated circuit and one or
  • Embodiment 35 The system of embodiment 34, comprising a co-packaged optical module (CPO) mount attached to the first substrate, and the guide rails are configured to provide rigid connections between the CPO mount and the front panel or a front portion of the fiber guide.
  • Embodiment 36 The system of embodiment 34 or 35 in which the photonic integrated circuit comprises at least one of (i) a photodetector to convert optical signals to electrical signals, or (ii) a modulator to convert electrical signals to optical signals.
  • Embodiment 41 The system of embodiment 40 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.
  • Embodiment 42 An apparatus comprising: a pluggable module comprising a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector; wherein the co-packaged optical module is configured to receive optical signals from the at least one first optical connector, and generate electronic signals based on the optical signals.
  • Embodiment 46 The apparatus of any of embodiments 42 to 45 in which the fiber guide has a spatial fan-out design such that a first portion of the fiber guide near the co- packaged optical module has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one first optical connector.
  • Embodiment 47 The apparatus of any of embodiments 42 to 45 in which the at least one first optical connector has an overall footprint that is larger than a footprint of the co- packaged optical module.
  • Embodiment 48 The system of any of embodiments 42 to 47 in which the co- packaged optical module has a first side and a second side, the first fiber optical cable has a first end that has a two-dimensional arrangement of optical fiber cores, the first side of the optical module is optically coupled to the two-dimensional arrangement of optical fiber cores, and the second side of the optical module has a two-dimensional arrangement of electrical contacts.
  • Embodiment 49 The apparatus of embodiment 48 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least two rows of electrical contacts, and each row includes at least two electrical contacts.
  • Embodiment 50 The apparatus of embodiment 49 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least four rows of electrical contacts, and each row includes at least four electrical contacts.
  • Embodiment 51 The apparatus of embodiment 50 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.
  • Embodiment 52 A rackmount server comprising: a housing having a front panel and a rear panel, in which the front panel defines an opening, and the rear panel is at a first distance from the front panel; and a substrate that is positioned at a second distance from the front panel, in which the second distance is less than one-third of the first distance, a data processor is mounted on the substrate, the substrate has a main surface that is oriented at an angle in a range of 0 to 45 degrees relative to the front panel; wherein at least one of (i) the substrate has electrical contacts that are configured to the electrically coupled to electrical contacts of a co-packaged optical module, or (ii) a first module is mounted on the substrate, in which the first module has electrical contacts that are configured to the electrically coupled to electrical contacts of a co-packaged optical module.
  • Embodiment 53 The rackmount server of embodiment 52 in which the substrate is oriented substantially parallel to the front panel.
  • Embodiment 54 The rackmount server of embodiment 52 or 53 in which the opening in the front panel is configured to allow a pluggable module that includes the co-packaged
  • Embodiment 55 The rackmount server of embodiment 53, comprising the pluggable module.
  • Embodiment 56 The rackmount server of embodiment 55, in which the pluggable module comprises the co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector.
  • Embodiment 59 The rackmount server of any of embodiments 52 to 58 in which the substrate has a two-dimensional arrangement of electrical contacts that are configured to be electrically coupled to a two-dimensional arrangement of electrical contacts of the co- package optical module.
  • Embodiment 60 The rackmount server of embodiment 59 in which the two- dimensional arrangement of electrical contacts of the substrate comprise at least two rows of electrical contacts, and each row includes at least two electrical contacts.
  • Embodiment 61 The rackmount server of embodiment 60 in which the two- dimensional arrangement of electrical contacts of the substrate comprise at least four rows of electrical contacts, and each row includes at least four electrical contacts.
  • Embodiment 62 The rackmount server of embodiment 61 in which the two- dimensional arrangement of electrical contacts of the substrate comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.
  • Embodiment 63 The rackmount server of any of embodiments 52 to 58 in which the substrate has a plurality of groups of two-dimensional arrangement of electrical contacts that are configured to be electrically coupled to a corresponding plurality of groups of two- dimensional arrangement of electrical contacts of co-package optical modules.
  • Embodiment 64 The rackmount server of embodiment 63 in which the plurality of groups of two-dimensional arrangement of electrical contacts comprises at least four groups of two-dimensional arrangement of electrical contacts, and each group of two-dimensional arrangement of electrical contacts comprise at least four rows of electrical contacts, and each row includes at least four electrical contacts.
  • Embodiment 65 The rackmount server of embodiment 64 in which the plurality of groups of two-dimensional arrangement of electrical contacts comprises at least ten groups of two-dimensional arrangement of electrical contacts, and each group of two-dimensional arrangement of electrical contacts comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.
  • Embodiment 68 The apparatus of embodiment 67 in which the optical transceiver module comprises a pluggable optical transceiver module, the plurality of electrical contacts of the pluggable optical transceiver module are configured to be removably and electrically coupled to corresponding electrical contacts of a data processing apparatus.
  • Embodiment 69 The apparatus of embodiment 67 in which the plurality of electrical contacts of the optical transceiver module are configured to be fixedly and electrically coupled to corresponding electrical contacts of a data processing apparatus.
  • Embodiment 70 The apparatus of any of embodiments 67 to 69 in which the at least one electronic component comprises at least one of a serializer, a deserializer, a serializer/deserializer, a digital signal processor, a driver module, or an amplifier module.
  • Embodiment 71 The apparatus of any of embodiments 67 to 70 in which the at least one laser is positioned closer to the at least one optical connector and farther away from the plurality of electrical contacts.
  • Embodiment 72 The apparatus of any of embodiments 67, 68, 70, and 71 in which the optical transceiver module has a form factor that complies with at least one of SFP (small form-factor pluggable), SFP+ (or 10 Gb SFP), SFP28, OSFP (octal SFP), OSFP-XD (OSFP extra dense), QSFP (quad small form-factor pluggable), QSFP+, QSFP28, QSFP56, or QSFP-DD (quad small form-factor pluggable double density) standard.
  • Embodiment 73 The apparatus of any of embodiments 67 to 72 in which the at least one optical connector has a first end that has a two-dimensional arrangement of optical fiber cores, and the photonic integrated circuit is optically coupled to the two-dimensional arrangement of optical fiber cores using a two-dimensional arrangement of optical couplers.
  • Embodiment 74b The apparatus of embodiment 74 in which the optical transceiver module includes a thermally insulating material positioned between the first heat dissipating device and the second heat dissipating device.
  • Embodiment 74c The apparatus of embodiment 74b in which each of the heat dissipating device and the second heat dissipating device is made of a material having a thermal conductivity greater than 50 W/mK.
  • Embodiment 74d The apparatus of embodiment 74c in which each of the heat dissipating device and the second heat dissipating device is made of a material having a thermal conductivity greater than 100 W/mK.
  • Embodiment 75 The apparatus of any of embodiments 67 to 73 in which the optical transceiver module comprises a fiber guide that is positioned between the photonic integrated circuit and the at least one optical connector and provides mechanical support for the first optical connector and the photonic integrated circuit or a module that includes the photonic integrated circuit.
  • Embodiment 76 The apparatus of embodiment 75 in which the fiber guide comprise at least one of metal or a thermal conductive material.
  • Embodiment 77 The apparatus of embodiment 75 or 76 in which the fiber guide comprises a hollow tube.
  • Embodiment 78 The apparatus of any of embodiments 75 to 77 in which the fiber guide is rigid along a direction from the at least one optical connector to the photonic integrated circuit or the module that includes the photonic integrated circuit and has a
  • Embodiment 79 The apparatus of any of embodiments 75 to 78 in which the fiber guide has a spatial fan-out design such that a first portion of the fiber guide near the photonic integrated circuit has a smaller dimension compared to the dimension of a second portion of the fiber guide near the at least one optical connector.
  • Embodiment 80 The apparatus of any of embodiments 75 to 79 in which the plurality of electrical contacts comprise a two-dimensional arrangement of electrical contacts.
  • Embodiment 81 The apparatus of embodiment 80 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least two rows of electrical contacts, and each row includes at least two electrical contacts.
  • Embodiment 82 The apparatus of embodiment 81 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least four rows of electrical contacts, and each row includes at least four electrical contacts.
  • Embodiment 83 The apparatus of embodiment 82 in which the two-dimensional arrangement of electrical contacts of the optical module comprise at least ten rows of electrical contacts, and each row includes at least ten electrical contacts.
  • Embodiment 84 A rackmount server comprising a plurality of the systems of any of embodiments 1 to 41 and 66.
  • a substrate positioned in the housing spaced apart from the front panel, in which a data processor is electrically coupled to a rear side of the substrate; providing a pluggable module comprising an optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the optical module and the first optical connector, and a fiber guide that is positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector; optically coupling an external fiber optic cable to the optical connector of the pluggable module; inserting the pluggable module through the opening in the front panel and electrically coupling a two-dimensional arrangement of electrical contacts of the optical module with a corresponding two-dimensional arrangement of electrical contacts on a front side of the substrate; and establishing a communication path between the data processor and the external fiber optic cable through the pluggable module.
  • Embodiment 88 The method of embodiment 87, comprising transmitting data between the data processor and the external fiber optic cable through the pluggable module with a bandwidth of at least 500 Gbps.
  • Embodiment 89 The method of embodiment 88, comprising transmitting data between the data processor and the external fiber optic cable through the pluggable module with a bandwidth of at least 1 Tbps.
  • Embodiment 91 The method of embodiment 90 in which the plurality of pluggable modules comprise at least 10 pluggable modules, and the method comprises transmitting data between the data processor and the external fiber optic cables through the pluggable modules with an aggregate bandwidth of at least 5 Tbps.
  • Embodiment 92 The method of embodiment 91 in which the plurality of pluggable modules comprise at least 30 pluggable modules, and the method comprises transmitting data between the data processor and the external fiber optic cables through the pluggable modules with an aggregate bandwidth of at least 15 Tbps.
  • Embodiment 93 A method including: operating the system of any of embodiments 1 to 41 and 66.
  • Embodiment 94 A method including: operating the apparatus of any of embodiments 42 to 51 and 67 to 83.
  • Embodiment 95 A method including: operating the rackmount server of any of embodiments 52 to 64, 84, and 85.
  • Embodiment 96 A method including: operating the data center of embodiment 86.
  • Embodiment 97 A method including: assembling the system of any of embodiments 1 to 41 and 66.
  • Embodiment 98 A method including: assembling the apparatus of any of embodiments 42 to 51 and 67 to 83.
  • Embodiment 99 A method including: assembling the rackmount server of any of embodiments 52 to 64, 84, and 85.
  • a pluggable optical module comprising: a fiber connector configured to be optically coupled to an optical fiber cable; an optical module comprising a photonic integrated circuit having a first surface, in which a plurality of optical couplers are provided at the first surface of the photonic integrated circuit; a fiber harness optically coupled between the fiber connector and the first surface of the photonic integrated circuit, in which the fiber harness comprises a plurality of optical fibers and an optical fiber connector, the optical fiber connector is configured to optically couple the plurality of optical fibers to the first surface of the photonic integrated circuit, the optical fiber connector comprises a two-dimensional arrangement of fiber ports, the two- dimensional arrangement of fiber ports and the optical couplers at the first surface of the photonic integrated circuit are configured to enable light signals to be transmitted between the photonic integrated circuit and the plurality of optical fibers; and an edge connector having conductive pads configured to be electrically coupled to conductive pads of a receptacle when the edge connector is mated with the receptacle, in which the conductive pads of the edge connector are
  • Embodiment 2 The apparatus of embodiment 1 in which the two-dimensional arrangement of fiber ports comprise at least two rows of fiber ports, and each row includes at least eight fiber ports.
  • Embodiment 3 The apparatus of embodiment 2 in which the two-dimensional arrangement of fiber ports comprise at least three rows of fiber ports, and each row includes at least eight fiber ports.
  • Embodiment 4 The apparatus of embodiment 3 in which the two-dimensional arrangement of fiber ports comprise at least four rows of fiber ports, and each row includes at least eight fiber ports.
  • Embodiment 6 The apparatus of any of embodiments 1 to 5 in which the pluggable optical module has a length not more than 200 mm, a width not more than 50 mm, and a height not more than 26 mm.
  • Embodiment 7 The apparatus of any of embodiments 1 to 6 in which the pluggable optical module comprises a housing having an inner upper wall and an inner lower wall, the edge connector has an upper surface extending along a first plane that is at a first distance d1 relative to the inner upper wall, the edge connector has a lower surface extending along a second plane that is at a second distance d2 relative to the inner lower wall, wherein the fiber harness is substantially vertically coupled to the first surface of the photonic integrated circuit such that light from the fiber harness is directed toward the first surface of the photonic integrated circuit at an angle ⁇ 1 relative to a direction vertical to the first surface of the photonic integrated circuit, 0 ⁇ ⁇ 1 ⁇ 10°, the fiber harness when extending from the first surface of the photonic integrated
  • Embodiment 8 The apparatus of embodiment 7 in which the housing has a first inner side wall and a second inner side wall, the substrate or circuit board is attached to the first inner side wall, wherein a distance from the first surface of the photonic integrated circuit to the second inner side wall is d4, and d3 ⁇ d4.
  • Embodiment 9 The apparatus of embodiment 7 in which the first surface of the photonic integrated circuit is oriented at an angle ⁇ 2 relative to the inner upper wall, and 45° ⁇ ⁇ 2 ⁇ 135°.
  • Embodiment 10 The apparatus of embodiment 9 in which 70° ⁇ ⁇ 2 ⁇ 110°.
  • Embodiment 11 The apparatus of embodiment 10 in which 80° ⁇ ⁇ 2 ⁇ 100°.
  • Embodiment 12 The apparatus of embodiment 11 in which 85° ⁇ ⁇ 2 ⁇ 95°.
  • Embodiment 13 The apparatus of embodiment 9 in which the photonic integrated circuit is mounted on a substrate or circuit board that is electrically coupled to the edge connector by one or more flexible cables.
  • Embodiment 14 The apparatus of embodiment 7 in which the photonic integrated circuit is mounted on an upper surface of a substrate or circuit board, the edge connector has an upper surface and a lower surface, the lower surface of the edge connector is attached to the upper surface of the substrate or circuit board, the upper surface of the substrate or circuit board is at a distance d4 relative to the inner upper wall of the housing, and d3 ⁇ d4.
  • Embodiment 15 The apparatus of any of embodiments 1 to 14 in which the photonic integrated circuit is configured to perform at least one of (i) convert optical signals received from the optical fiber cable to electrical signals that are transmitted to the edge connector, or (ii) convert electrical signals that are received from the edge connector to optical signals that are transmitted to the optical fiber cable.
  • Embodiment 16 The apparatus of any of embodiments 1 to 15 in which the optical module comprises a first set of at least two electrical integrated circuits that are mounted on the first surface of the photonic integrated circuit.
  • Embodiment 17 The apparatus of embodiment 16 in which the first set of at least two electrical integrated circuits comprise two electrical integrated circuits that are positioned on opposite sides of the optical fiber connector along a plane parallel to the first surface of the photonic integrated circuit.
  • Embodiment 18 The apparatus of embodiment 17 in which the first set of at least one electrical integrated circuit comprises four electrical integrated circuits that surround four sides of the optical fiber connector along the plane parallel to the first surface of the photonic integrated circuit.
  • Embodiment 19 The apparatus of any of embodiments 16 to 18 in which the optical module comprises: a substrate or circuit board, in which the photonic integrated circuit is mounted on the substrate or circuit board, and
  • Embodiment 20 The apparatus of any of embodiments 16 to 19 in which the photonic integrated circuit comprises at least one of a photodetector or an optical modulator, and the first set of at least one integrated circuit comprises at least one of a transimpedance amplifier configured to amplify a current generated by the photodetector or a driver configured to drive the optical modulator.
  • Embodiment 21 The apparatus of embodiment 19 or 20 in which the second set of at least one electrical integrated circuit comprises a serializers/deserializers module.
  • Embodiment 22 The apparatus of any of embodiments 1 to 21 in which the pluggable optical module comprises at least one laser source that is configured to provide power supply light to the photonic integrated circuit.
  • Embodiment 23 The apparatus of embodiment 22 in which the fiber harness comprises at least one optical fiber that optically couples the at least one laser source to the photonic integrated circuit.
  • Embodiment 24 The apparatus of embodiment 23 in which the optical fiber connector comprises at least one power supply fiber port.
  • Embodiment 25 The apparatus of any of embodiments 1 to 24, comprising a second circuit board and a cage mounted on the second circuit board, in which the pluggable optical module is plugged into the cage, and the receptacle is located inside the cage.
  • Embodiment 26 The apparatus of embodiment 25, comprising a server computer comprising a first data processor, in which the second circuit board is part of the server computer, the pluggable optical module is configured to provide a communication interface that enables the first data processor to communicate with a second data processor through the optical fiber cable.
  • Embodiment 27 The apparatus of embodiment 26 in which the first data processor comprises at least a network switch, a central processor unit, a graphics processor unit, a tensor processing unit, a neural network processor, an artificial intelligence accelerator, a
  • Embodiment 28 The apparatus of embodiment 27, comprising at least one of a supercomputer, an autonomous vehicle, or a robot, wherein the supercomputer, the autonomous vehicle, or the robot comprises the server computer.
  • Embodiment 29 The apparatus of any of embodiments 26 to 28 in which the server computer comprises a plurality of cages of embodiment 25 and a plurality of pluggable optical modules of any of embodiments 1 to 25, the plurality of pluggable optical modules are plugged into the plurality of cages, each pluggable optical module is plugged into a corresponding cage.
  • Embodiment 30 A system comprising: a data center comprising: a plurality of server computers of embodiment 26 or 27; and a plurality of pluggable optical modules of any of embodiments 1 to 24; wherein each server computer communicates with one or more other server computers through one or more optical fiber cables and the plurality of pluggable optical modules.
  • Embodiment 31 An apparatus comprising: a pluggable optical module comprising: a fiber connector configured to be optically coupled to an optical fiber cable; an optical module comprising: a photonic integrated circuit having a first surface; and a first set of at least two electrical integrated circuits that are mounted on the first surface of the photonic integrated circuit; a fiber harness optically coupled between the fiber connector and the first surface of the photonic integrated circuit; and an edge connector having conductive pads configured to be electrically coupled to conductive pads of a receptacle when the edge connector is mated with the receptacle, in which the conductive pads of the edge connector are electrically coupled to the optical module.
  • Embodiment 32 The apparatus of embodiment 31 in which the pluggable optical module complies with a small form factor pluggable module specification comprising at least one of SFP (small form-factor pluggable), SFP+, 10 Gb SFP, SFP28, OSFP (octal SFP), OSFP-XD (OSFP extra dense), QSFP (quad small form-factor pluggable), QSFP+, QSFP28, QSFP56, or QSFP-DD (quad small form-factor pluggable double density).
  • Embodiment 33 The apparatus of embodiment 31 or 32 in which the fiber harness comprises an optical connector that is coupled to the photonic integrated circuit, the first set of at least two electrical integrated circuits comprise two electrical integrated circuits that are positioned on opposite sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.
  • Embodiment 34 The apparatus of embodiment 33 in which the first set of at least one electrical integrated circuit comprises four electrical integrated circuits that surround four sides of the optical connector along the plane parallel to the first surface of the photonic integrated circuit.
  • Embodiment 37 The apparatus of embodiment 35 or 36 in which the second set of at least one electrical integrated circuit comprises a serializers/deserializers module.
  • Embodiment 38 The apparatus of any of embodiments 31 to 37 in which the pluggable optical module comprises a housing having an inner bottom wall, an inner upper
  • Embodiment 39 The apparatus of embodiment 38 in which the optical module is oriented relative to the housing such that the first surface of the photonic integrated circuit is at an angle between 70° to 110° relative to the bottom surface of the housing.
  • Embodiment 40 The apparatus of embodiment 39 in which the optical module is oriented relative to the housing such that the first surface of the photonic integrated circuit is at an angle between 80° to 100° relative to the bottom surface of the housing.
  • Embodiment 41 The apparatus of embodiment 40 in which the optical module is oriented relative to the housing such that the first surface of the photonic integrated circuit is at an angle between 85° to 95° relative to the bottom surface of the housing.
  • Embodiment 42 The apparatus of any of embodiments 35 to 37 in which the pluggable optical module comprises a housing having an inner upper wall and an inner lower wall, the edge connector has an upper surface extending along a first plane that is at a first distance d1 relative to the inner upper wall, the edge connector has a lower surface extending along a second plane that is at a second distance d2 relative to the inner lower wall, wherein the fiber harness is substantially vertically coupled to the first surface of the photonic integrated circuit such that light from the fiber harness is directed toward the first surface of the photonic integrated circuit at an angle ⁇ 1 relative to a direction vertical to the first surface of the photonic integrated circuit, 0 ⁇ ⁇ 1 ⁇ 10°, the fiber harness when extending from the first surface of the photonic integrated circuit and
  • Embodiment 44 The apparatus of any of embodiments 31 to 43 in which the photonic integrated circuit is configured to perform at least one of (i) convert optical signals received from the optical fiber cable to electrical signals that are transmitted to the edge connector, or (ii) convert electrical signals that are received from the edge connector to optical signals that are transmitted to the optical fiber cable.
  • Embodiment 45 A method comprising: transmitting signals between an optical fiber cable and a data processing apparatus through a pluggable optical module having a photonic integrated circuit, including: transmitting optical signals between the optical fiber cable and the photonic integrated circuit through a fiber harness and a plurality of optical couplers provided at a first surface of the photonic integrated circuit; and transmitting electrical signals between the photonic integrated circuit and the data processing apparatus through an edge connector of the pluggable optical module; wherein the fiber harness comprises a plurality of optical fibers and an optical fiber connector that optically couples the plurality of optical fibers to the plurality of optical couplers at the first surface of the photonic integrated circuit; and wherein the optical fiber connector comprises a two-dimensional arrangement of fiber ports that are optically coupled to the optical couplers at the first surface of the photonic integrated circuit.

Abstract

Système comprenant un boîtier ayant un panneau avant, un substrat positionné à une certaine distance du panneau avant et un processeur de données monté sur le substrat. Le système comprend un module enfichable ayant un module optique, au moins un premier connecteur optique, un premier câble à fibres optiques couplé optiquement entre le module optique et le premier connecteur optique, ainsi qu'un guide de fibre qui est positionné entre le module optique et le premier connecteur optique et fournit un support mécanique pour le module optique et le premier connecteur optique. Le module optique reçoit des signaux optiques provenant du premier connecteur optique et génère des signaux électriques sur la base des signaux optiques reçus ; les signaux électriques sont transmis au processeur de données. Le module enfichable a une forme qui permet au module enfichable de passer à travers une ouverture dans le panneau avant pour permettre au module optique d'être couplé au substrat.
PCT/US2022/033870 2021-06-17 2022-06-16 Systèmes de communication comprenant des modules enfichables WO2022266376A1 (fr)

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US202163225779P 2021-07-26 2021-07-26
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US202163245011P 2021-09-16 2021-09-16
US202163245005P 2021-09-16 2021-09-16
US63/245,005 2021-09-16
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