IT201900004197A1 - Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico - Google Patents

Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico

Info

Publication number
IT201900004197A1
IT201900004197A1 IT102019000004197A IT201900004197A IT201900004197A1 IT 201900004197 A1 IT201900004197 A1 IT 201900004197A1 IT 102019000004197 A IT102019000004197 A IT 102019000004197A IT 201900004197 A IT201900004197 A IT 201900004197A IT 201900004197 A1 IT201900004197 A1 IT 201900004197A1
Authority
IT
Italy
Prior art keywords
electronic module
detection
device including
scanning device
integrated
Prior art date
Application number
IT102019000004197A
Other languages
English (en)
Inventor
Roberto Carminati
Fabio Bottinelli
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102019000004197A priority Critical patent/IT201900004197A1/it
Priority to EP20159897.6A priority patent/EP3712660A1/en
Priority to CN202020363455.0U priority patent/CN212277173U/zh
Priority to CN202010202895.2A priority patent/CN111725142A/zh
Priority to US16/826,983 priority patent/US11393183B2/en
Publication of IT201900004197A1 publication Critical patent/IT201900004197A1/it
Priority to US17/750,010 priority patent/US11620805B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/42—Simultaneous measurement of distance and other co-ordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V20/00—Scenes; Scene-specific elements
    • G06V20/60—Type of objects
    • G06V20/64—Three-dimensional objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/16—Human faces, e.g. facial parts, sketches or expressions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/16—Human faces, e.g. facial parts, sketches or expressions
    • G06V40/172—Classification, e.g. identification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
IT102019000004197A 2019-03-22 2019-03-22 Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico IT201900004197A1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT102019000004197A IT201900004197A1 (it) 2019-03-22 2019-03-22 Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico
EP20159897.6A EP3712660A1 (en) 2019-03-22 2020-02-27 Integrated electronic module for 3d sensing applications, and 3d scanning device including the integrated electronic module
CN202020363455.0U CN212277173U (zh) 2019-03-22 2020-03-20 电子模块和三维扫描设备
CN202010202895.2A CN111725142A (zh) 2019-03-22 2020-03-20 用于3d感测应用的集成电子模块以及包括集成电子模块的3d扫描设备
US16/826,983 US11393183B2 (en) 2019-03-22 2020-03-23 Integrated electronic module for 3D sensing applications, and 3D scanning device including the integrated electronic module
US17/750,010 US11620805B2 (en) 2019-03-22 2022-05-20 Integrated electronic module for 3D sensing applications, and 3D scanning device including the integrated electronic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102019000004197A IT201900004197A1 (it) 2019-03-22 2019-03-22 Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico

Publications (1)

Publication Number Publication Date
IT201900004197A1 true IT201900004197A1 (it) 2020-09-22

Family

ID=66776807

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102019000004197A IT201900004197A1 (it) 2019-03-22 2019-03-22 Modulo elettronico integrato per il rilevamento 3d, e dispositivo di scansione 3d che include il modulo elettronico

Country Status (4)

Country Link
US (2) US11393183B2 (it)
EP (1) EP3712660A1 (it)
CN (2) CN212277173U (it)
IT (1) IT201900004197A1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12029004B2 (en) 2020-09-18 2024-07-02 Nubis Communications, Inc. Data processing systems including optical communication modules
IT202000022715A1 (it) * 2020-09-25 2022-03-25 St Microelectronics Srl Modulo elettronico integrato includente due microspecchi, e sistema che include il modulo elettronico
EP4356175A1 (en) * 2021-06-17 2024-04-24 Nubis Communications, Inc. Communication systems having pluggable modules

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110188054A1 (en) * 2010-02-02 2011-08-04 Primesense Ltd Integrated photonics module for optical projection
US20160223319A1 (en) * 2015-01-30 2016-08-04 Adcole Corporation Optical three dimensional scanners and methods of use thereof
US9843779B2 (en) 2015-11-30 2017-12-12 Stmicroelectronics S.R.L. Resonant biaxial MEMS reflector with piezoelectric actuators, and projective MEMS system including the same
US20180180873A1 (en) 2016-12-28 2018-06-28 Stmicroelectronics S.R.L. Mems device with piezoelectric actuation, a projective mems system including the mems device and related control method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080784A (ja) * 2008-09-26 2010-04-08 Kyocera Corp 回路基板、回路基板の製造方法及び電子機器。
DE102015106708B4 (de) * 2015-04-30 2017-12-21 Visteon Global Technologies, Inc. Vorrichtung zur Emission von Licht, insbesondere zur Erzeugung eines Bildes
JP7143057B2 (ja) * 2016-12-28 2022-09-28 株式会社キーエンス 三次元測定装置
CN110679049A (zh) * 2017-04-12 2020-01-10 感应光子公司 超小型垂直腔表面发射激光器(vcsel)以及包括所述超小型垂直腔表面发射激光器的阵列
US10802117B2 (en) * 2018-01-24 2020-10-13 Facebook Technologies, Llc Systems and methods for optical demodulation in a depth-sensing device
JP6813042B2 (ja) * 2019-02-27 2021-01-13 富士ゼロックス株式会社 発光装置、発光デバイス、光学装置及び情報処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110188054A1 (en) * 2010-02-02 2011-08-04 Primesense Ltd Integrated photonics module for optical projection
US20160223319A1 (en) * 2015-01-30 2016-08-04 Adcole Corporation Optical three dimensional scanners and methods of use thereof
US9843779B2 (en) 2015-11-30 2017-12-12 Stmicroelectronics S.R.L. Resonant biaxial MEMS reflector with piezoelectric actuators, and projective MEMS system including the same
US20180180873A1 (en) 2016-12-28 2018-06-28 Stmicroelectronics S.R.L. Mems device with piezoelectric actuation, a projective mems system including the mems device and related control method

Also Published As

Publication number Publication date
US11393183B2 (en) 2022-07-19
CN111725142A (zh) 2020-09-29
US20200302205A1 (en) 2020-09-24
EP3712660A1 (en) 2020-09-23
US11620805B2 (en) 2023-04-04
CN212277173U (zh) 2021-01-01
US20220277536A1 (en) 2022-09-01

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