WO2022259893A1 - Curable resin composition, hard coat film, and production method for hard coat film - Google Patents

Curable resin composition, hard coat film, and production method for hard coat film Download PDF

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Publication number
WO2022259893A1
WO2022259893A1 PCT/JP2022/021816 JP2022021816W WO2022259893A1 WO 2022259893 A1 WO2022259893 A1 WO 2022259893A1 JP 2022021816 W JP2022021816 W JP 2022021816W WO 2022259893 A1 WO2022259893 A1 WO 2022259893A1
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Prior art keywords
group
structural unit
resin composition
curable resin
mol
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PCT/JP2022/021816
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French (fr)
Japanese (ja)
Inventor
考浩 加藤
哲 北村
壮一郎 渡邉
慶介 吉政
彩子 松本
顕夫 田村
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富士フイルム株式会社
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Priority to JP2023527618A priority Critical patent/JPWO2022259893A1/ja
Priority to KR1020237041281A priority patent/KR20240001251A/en
Publication of WO2022259893A1 publication Critical patent/WO2022259893A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/22Esters containing halogen
    • C08F220/24Esters containing halogen containing perhaloalkyl radicals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/283Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52Amides or imides
    • C08F220/54Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/58Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14Protective coatings, e.g. hard coatings

Definitions

  • the present invention relates to a curable resin composition, a hard coat film, and a method for producing a hard coat film.
  • the curable resin composition can be used, for example, as a composition for forming a hard coat layer, and the hard coat layer can be formed by coating it on a substrate and curing it.
  • image display devices such as liquid crystal display devices (LCD), plasma display panels (PDP), electroluminescence displays (ELD), micro LEDs (Light Emitting Diodes), and micro OLEDs (Organic Light Emitting Diodes)
  • LCD liquid crystal display devices
  • PDP plasma display panels
  • ELD electroluminescence displays
  • micro LEDs Light Emitting Diodes
  • micro OLEDs Organic Light Emitting Diodes
  • Patent Document 1 describes a curable resin composition containing a polymer having a structural unit having a plurality of acryloyl groups and a structural unit containing a carboxy group, and a solvent.
  • An object of the present invention is to provide a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. to provide.
  • At least one structural unit selected from the group consisting of a structural unit (a) containing a fluorine atom and a structural unit (b) containing a cationically polymerizable group, and a structural unit (z ) and a curable resin composition containing a polymer (S) having
  • D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 .
  • R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • R Z2 represents a hydrogen atom or a methyl group.
  • a 1 represents -O- or -NR Z3 -.
  • R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • w represents an integer of 2 to 5;
  • L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group.
  • R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
  • L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond.
  • R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
  • E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
  • R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
  • R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. * represents a binding position.
  • the content of the structural unit (a) based on the amount of substance is represented by Wa
  • the content of the structural unit (b) based on the amount of material is represented by Wb
  • the above constitution When Wz is the content of the unit (z) based on the amount of substance, Wa, Wb and Wz satisfy 0 mol% ⁇ Wa ⁇ 90 mol%, 0 mol% ⁇ Wb ⁇ 90 mol%, and 0 mol% ⁇ Wz ⁇ 100 mol% and the curable resin composition according to ⁇ 1>, wherein both Wa and Wb are not 0 mol %.
  • the content of the structural unit (a) based on the amount of substance is represented by Wa
  • the content of the structural unit (b) based on the amount of material is represented by Wb
  • Wc is the content of the unit (c) based on the substance amount
  • Wz is the content of the structural unit (z) based on the substance amount
  • Wa, Wb, Wc and Wz are each 0 mol% ⁇ Wa ⁇ 90 mol %, 0 mol% ⁇ Wb ⁇ 90 mol%, 0 mol% ⁇ Wc ⁇ 90 mol%, 0 mol% ⁇ Wz ⁇ 100 mol%, and both Wa and Wb are not 0 mol%, curing according to ⁇ 4> elastic resin composition.
  • ⁇ 6> The curable resin composition according to ⁇ 4> or ⁇ 5>, wherein the structural unit (c) has at least one selected from the group consisting of a boronic acid group, an isocyanate group, an aldehyde group, and an alkoxysilyl group.
  • the structural unit (c) has at least one selected from the group consisting of a boronic acid group, an isocyanate group, an aldehyde group, and an alkoxysilyl group.
  • ⁇ 7> The curable resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the polymer (S) has the structural unit (a), the structural unit (b), and the structural unit (z). thing.
  • ⁇ 8> The curable resin composition according to any one of ⁇ 1> to ⁇ 7>, wherein L Z1 in general formula (Z-1) represents a w+1-valent aliphatic group.
  • L Z2 in the general formula (Z-1) represents a divalent linking group having at least one selected from the group consisting of an alkylene group, —CO—, and —O—, or a single bond
  • ⁇ 10> The curable resin composition according to any one of ⁇ 1> to ⁇ 9>, wherein the total number of carbon atoms contained in L Z1 and L Z2 in the general formula (Z-1) is 1 to 6. .
  • ⁇ 11> The curable resin composition according to any one of ⁇ 1> to ⁇ 10>, wherein the number of fluorine atoms contained in the structural unit (a) is 3 or more and 17 or less.
  • n represents an integer of 1 or more.
  • a plurality of n may be the same or different.
  • R b1 represents a hydrogen atom or a substituent.
  • R b2 represents a hydrogen atom or a substituent.
  • a plurality of R b2 may be the same or different.
  • L b1 represents an n+1-valent linking group.
  • a plurality of L b1 may be the same or different.
  • Z b1 represents a group containing a fluorine atom. Plural Z's may be the same or different.
  • * represents a binding position.
  • a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. can provide.
  • the curable resin composition of the present invention contains a polymer (S).
  • the polymer (S) has at least one structural unit selected from the group consisting of a structural unit (a) containing a fluorine atom and a structural unit (b) containing a cationically polymerizable group, and is represented by general formula (Z-1). and a structural unit (z).
  • a structural unit (a) containing a fluorine atom is also referred to as a “structural unit (a)”.
  • a structural unit (b) containing a cationically polymerizable group is also referred to as a “structural unit (b)”.
  • a structural unit (z) represented by general formula (Z-1) is also referred to as a “structural unit (z)”.
  • D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 .
  • R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • R Z2 represents a hydrogen atom or a methyl group.
  • a 1 represents -O- or -NR Z3 -.
  • R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • w represents an integer of 2 to 5;
  • L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group.
  • R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
  • L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond.
  • R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
  • E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
  • R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
  • R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. * represents a binding position.
  • the polymer (S) has a structural unit (z) and at least one of a structural unit (a) and a structural unit (b). That is, the polymer (S) may be a polymer having the structural unit (a) and the structural unit (z), or may be a polymer having the structural unit (b) and the structural unit (z). Alternatively, it may be a polymer having a structural unit (a), a structural unit (b) and a structural unit (z).
  • the structural unit (a), the structural unit (b) and the structural unit (z) are preferably different structural units. That is, the structural unit (a) preferably does not contain a cationically polymerizable group.
  • Structural unit (a) is preferably not a structural unit represented by general formula (Z-1).
  • Structural unit (b) preferably does not contain a fluorine atom.
  • Structural unit (b) is preferably not a structural unit represented by general formula (Z-1).
  • Structural unit (z) preferably does not contain a fluorine atom.
  • the structural unit (z) preferably does not contain a cationic polymerizable group.
  • the polymer (S) has a structural unit (b) containing a cationically polymerizable group in addition to the structural unit (z) containing two or more radically polymerizable groups such as (meth)acryloyl groups, cationic curing and radical curing It is considered that high scratch resistance can be obtained due to the formation of a double network of Further, in addition to the structural unit (z) containing two or more radically polymerizable groups such as (meth)acryloyl groups, when the structural unit (a) containing a fluorine atom is present, the effect of the low surface energy of the fluorine atom maximizes It is thought that the crosslink density is increased by increasing the amount of surface radically polymerizable sites that are unevenly distributed on the surface, thereby improving the scratch resistance.
  • Wb be the content of the structural unit (b) based on the material amount
  • the structural unit (z) When the content of the substance amount standard is Wz, Wa, Wb and Wz respectively satisfy 0 mol% ⁇ Wa ⁇ 90 mol%, 0 mol% ⁇ Wb ⁇ 90 mol%, 0 mol% ⁇ Wz ⁇ 100 mol%, and Wa and It is preferable that both Wb and Wb are not 0 mol %.
  • the polymer (S) preferably has a structural unit (a), a structural unit (b) and a structural unit (z). It is more preferable to satisfy 0 mol% ⁇ Wa ⁇ 90 mol%, 0 mol% ⁇ Wb ⁇ 90 mol%, and 0 mol% ⁇ Wz ⁇ 100 mol%.
  • Wz preferably satisfies 30 mol% ⁇ Wz ⁇ 95 mol%.
  • the main chain structure of the polymer (S) is not particularly limited, it is preferably a (meth)acryl polymer or a (meth)acrylamide polymer.
  • the number of fluorine atoms contained in the structural unit (a) is preferably 3 or more and 17 or less.
  • Group containing a fluorine atom Structural unit (a) preferably contains a fluorine atom-containing group.
  • a group containing a fluorine atom (also referred to as a “fluorine-containing group”) is a group containing at least one fluorine atom, and examples thereof include a fluorine atom and an organic group having at least one fluorine atom.
  • the number of carbon atoms in the organic group is not particularly limited, it preferably has 1 to 20 carbon atoms, more preferably 2 to 15 carbon atoms, even more preferably 4 to 10 carbon atoms, and 4 carbon atoms. ⁇ 8 is particularly preferred.
  • the organic group may have a linear structure, a branched structure, or a cyclic structure.
  • Examples of the organic group include an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, a cycloalkynyl group, an alkoxy group, an aryl group, an aryloxy group, and a group formed by combining at least two of these groups. and preferably an alkyl group.
  • the alkyl group, cycloalkyl group, alkenyl group, cycloalkenyl group, alkynyl group, cycloalkynyl group, alkoxy group, aryl group, and aryloxy group may further have a substituent other than the fluorine atom.
  • the fluorine-containing group is preferably an aliphatic hydrocarbon group having a fluorine atom.
  • the aliphatic hydrocarbon group may have an oxygen atom.
  • fluorine-containing groups include fluorine-containing alkyl groups, fluorine-containing alkyl groups in which one or more of -CH 2 - constituting the fluorine-containing alkyl group are substituted with -O-, and fluorine-containing alkenyl groups.
  • the fluorine atom-containing alkyl group includes an alkyl group in which some of the hydrogen atoms of —CH 2 — constituting the alkyl group are substituted with fluorine atoms, and a part of the carbon atoms constituting the alkyl group are fluorine atoms. (e.g., —CF 3 ), but is preferably a perfluoroalkyl group in which all hydrogen atoms of —CH 2 — constituting the alkyl group are substituted with fluorine atoms, and — (CF 2 ) fa CF 3 is more preferred.
  • fa represents an integer from 0 to 12.
  • fb represents an integer of 1-10
  • fc represents an integer of 1-10.
  • the number of carbon atoms in the aliphatic hydrocarbon group having a fluorine atom is not particularly limited, and is preferably 1-30, more preferably 3-20, and even more preferably 3-10.
  • the number of fluorine atoms contained in the aliphatic hydrocarbon group having fluorine atoms is not particularly limited, and is preferably 1-30, more preferably 5-25, and even more preferably 7-20.
  • the fluorine-containing group is preferably a fluoroalkyl group or a fluoropolyether group.
  • a fluoropolyether group is a divalent group in which a plurality of fluorocarbon groups are linked by ether bonds.
  • the fluoropolyether group is preferably a divalent group in which multiple fluoroalkylene groups are linked via ether linkages, and a divalent group in which multiple perfluoroalkylene groups are linked via ether linkages (perfluoropolyether group).
  • the fluorine-containing group is preferably a fluoroalkyl group having 1 to 20 carbon atoms, more preferably a fluoroalkyl group having 2 to 15 carbon atoms, and further preferably a fluoroalkyl group having 4 to 10 carbon atoms.
  • a fluoroalkyl group having 4 to 8 carbon atoms is particularly preferred.
  • the number of fluorine atoms contained in one fluorine-containing group is preferably 3 or more and 17 or less, more preferably 5 or more and 15 or less, and further preferably 9 or more and 13 or less. preferable.
  • the fluorine-containing group is preferably a group represented by general formula (f-1) below. That is, the structural unit (a) preferably has a group represented by general formula (f-1) below.
  • q1 represents an integer of 0 to 12
  • q2 represents an integer of 1 to 8
  • Rq1 represents a hydrogen atom or a fluorine atom.
  • * represents a binding position.
  • q1 preferably represents an integer of 1 to 7, more preferably an integer of 1 to 5, even more preferably 1 or 2.
  • q2 preferably represents an integer of 2 to 8, more preferably an integer of 4 to 8, even more preferably an integer of 4 to 6.
  • Rq 1 preferably represents a fluorine atom.
  • the structural unit (a) may contain a group represented by the following general formula (1).
  • X 1 and X 2 each independently represent an oxygen atom or a sulfur atom.
  • R 1 and R 2 each independently represent a hydrogen atom or a substituent, and at least one of R 1 and R 2 represents a substituent.
  • R 1 and R 2 may combine to form a ring.
  • At least one of R 1 and R 2 may be combined with a portion other than the group represented by general formula (1) of the structural unit (a) to form a ring.
  • m and n each independently represent 0 or 1; However, n represents 1 when R 1 or R 2 represents a hydrogen atom. *1 and *2 represent binding positions.
  • the group represented by general formula (1) may be an acid-cleavable group.
  • An acid-cleavable group is a group that is cleaved by the action of an acid, typically a group that is cleaved by the action of an acid to produce a polar group (eg, a hydroxy group, a carboxyl group, a ketone group, etc.).
  • X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, preferably an oxygen atom.
  • R 1 and R 2 each independently represent a hydrogen atom or a substituent.
  • the type of substituent is not particularly limited, and any known substituent may be used.
  • substituents include alkyl groups, cycloalkyl groups, alkenyl groups, cycloalkenyl groups, alkynyl groups, cycloalkynyl groups, aryl groups, heterocyclic groups, amino groups, alkoxy groups, aryloxy groups, heterocyclicoxy groups, acyl group, alkoxycarbonyl group, aryloxycarbonyl group, acyloxy group, acylamino group, alkoxycarbonylamino group, aryloxycarbonylamino group, sulfonylamino group, sulfamoyl group, carbamoyl group, alkylthio group, arylthio group, heterocyclicthio group, Phosphate amide group, hydroxy group, hydroxy group,
  • substituents can further have one or more substituents, they may have the above-described substituents as further substituents.
  • R 1 and R 2 represent a substituent
  • the substituent is preferably an organic group, and the organic group may have a linear structure, a branched structure, or a cyclic structure.
  • the above organic group is more preferably an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, a cycloalkynyl group, an aryl group, an alkoxy group, or a group formed by combining at least two of these.
  • a cycloalkyl group, an aryl group or an alkoxy group is more preferred.
  • the number of carbon atoms in the organic group is not particularly limited, it is preferably 1-20, more preferably 1-10.
  • the organic group may further have a substituent. However, at least one of R 1 and R 2 represents a substituent. That is, it is not the case that both R 1 and R 2 represent hydrogen atoms.
  • R 1 and R 2 may combine to form a ring, and the ring is preferably an aliphatic hydrocarbon ring having 3 to 20 carbon atoms, more preferably an aliphatic hydrocarbon ring having 4 to 12 carbon atoms. It is more preferable to have The aliphatic hydrocarbon ring may have a substituent.
  • the above aliphatic hydrocarbon ring has —O—, —CO—, —COO—, —OCO—, —S—, —SO 2 —, —NR—, or these between the carbon-carbon bonds of the ring members. You may have the linking group which combines two or more.
  • R above represents a hydrogen atom or a substituent.
  • n 0 or 1, preferably 1;
  • *1 and *2 represent binding positions.
  • *1 and *2 include a partial structure other than the group represented by the general formula (1) of the structural unit (a) (one atom such as a hydrogen atom, a fluorine-containing group, the main chain of the polymer (S), etc. Atomic groups consisting of multiple atoms of ) bond.
  • specific embodiments of the structural unit (a) include the following embodiments. 1) A mode in which a fluorine-containing group is bonded to *2 in general formula (1) directly or via a linking group. 2) A fluorine-containing group is bonded to at least one of R 1 and R 2 in general formula (1). 3) A mode in which a fluorine-containing group is bonded directly or via a linking group to *1 in the general formula (1)
  • the linking group in 1) and 3) above may be -O-, -CO-, -COO-, -OCO-, -S-, -SO 2 -, -NR-, or a combination of two or more thereof. groups, with —O— or —S— being preferred.
  • R above represents a hydrogen atom or a substituent. Examples of the substituent when R represents a substituent include an alkyl group and an aryl group.
  • alkyl group for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
  • the aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an ⁇ -methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
  • Structural unit (a) may have an acetal structure, a thioacetal structure or a dithioacetal structure.
  • the acetal structure is preferably a structure represented by the following general formula (AC1) or (AC2).
  • the thioacetal structure is preferably a structure represented by the following general formula (SA1), (SA2) or (SA3).
  • the dithioacetal structure is preferably a structure represented by the following general formula (DS1) or (DS2).
  • R 1 and R 2 each independently represent a hydrogen atom or a substituent, and at least one of R 1 and R 2 represents a substituent. R 1 and R 2 may combine to form a ring. At least one of R 1 and R 2 may combine with a portion other than the structure represented by general formula (AC1), (SA1) or (DS1) of structural unit (a) to form a ring.
  • R 3 represents a substituent and k represents an integer of 0-3. When k represents 2 or 3, multiple R 3 may be the same or different.
  • * represents a binding position.
  • R 1 and R 2 each have the same meaning as in general formula (1), and specific examples and preferred ranges are also the same.
  • R 3 represents a substituent
  • specific examples and preferred ranges are R 1 and R 2 in general formula (1) It is the same as the one mentioned as a substituent in the case of representing.
  • k represents 0 or 1.
  • the structural unit (a) has the following general formula (A- It may be a structural unit represented by any one of 1) to (A-5).
  • Ra 1 represents a hydrogen atom or a methyl group.
  • A represents -O- or -NH-.
  • L1 represents a single bond or a divalent linking group.
  • Q1 represents a group containing a fluorine atom.
  • L2 represents a single bond or a divalent linking group.
  • X 1 , X 2 , m, n, R 1 and R 2 each have the same meaning as in formula (1).
  • R 3 and k each have the same meaning as in general formula (AC2).
  • A represents -O- or -NH-, preferably -O-.
  • L 1 represents a single bond or a divalent linking group.
  • L 1 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these.
  • R above represents a hydrogen atom or a substituent.
  • R represents a substituent
  • examples of the substituent when R represents a substituent include an alkyl group and an aryl group.
  • the alkyl group for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
  • the aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an ⁇ -methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
  • L 1 is preferably a single bond, an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group consisting of a combination of two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
  • Q1 represents a fluorine atom-containing group.
  • the groups containing fluorine atoms are the same as those described above.
  • L2 represents a single bond or a divalent linking group. Specific examples and preferred ranges when L 2 represents a divalent linking group are the same as in the case where L 1 represents a divalent linking group.
  • X 1 , X 2 , m, n, R 1 and R 2 in general formulas (A-1) to (A-5) above each have the same meaning as in general formula (1), and specific examples and preferred The range is also the same.
  • R 3 and k each have the same meaning as in formula (AC2), and specific examples and preferred ranges are also the same.
  • the structural unit (a) has a group represented by the following general formula (B1). is preferred.
  • n represents an integer of 1 or more.
  • a plurality of n may be the same or different.
  • R b1 represents a hydrogen atom or a substituent.
  • R b2 represents a hydrogen atom or a substituent.
  • a plurality of R b2 may be the same or different.
  • L b1 represents an n+1-valent linking group.
  • a plurality of L b1 may be the same or different.
  • Z b1 represents a group containing a fluorine atom. Plural Z's may be the same or different. * represents a binding position.
  • R b1 represents a hydrogen atom or a substituent, preferably a substituent.
  • the type of substituent represented by one embodiment of R b1 is not particularly limited, and examples thereof include known substituents.
  • substituents include monovalent aliphatic hydrocarbon groups which may have an oxygen atom, and monovalent aromatic hydrocarbon groups which may have an oxygen atom. Specific examples include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, alkoxy groups, aryloxy groups, acyl groups, acyloxy groups, and combinations thereof.
  • the said substituent may be further substituted by the substituent.
  • an aliphatic hydrocarbon group having 1 to 18 carbon atoms is preferable, an alkyl group having 1 to 12 carbon atoms is more preferable, and an alkyl group having 1 to 8 carbon atoms is preferable.
  • a linear alkyl group or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is particularly preferable.
  • R b2 represents a hydrogen atom or a substituent.
  • a plurality of R b2 may be the same or different.
  • the type of substituent represented by one aspect of R b2 is not particularly limited, and examples include known substituents, and examples include the groups exemplified as the substituent represented by one aspect of R b1 in the general formula (B1). Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable. preferable.
  • R b2 preferably represents a hydrogen atom.
  • L b1 represents an n+1-valent linking group.
  • the n+1-valent linking group is an optionally substituted n+1-valent hydrocarbon group having 1 to 24 carbon atoms, wherein some of the carbon atoms constituting the hydrocarbon group are substituted with heteroatoms.
  • the number of carbon atoms contained in the n+1-valent linking group is not particularly limited, and is preferably 1-24, more preferably 1-10.
  • the n+1-valent linking group is preferably a divalent to tetravalent linking group, more preferably a divalent to trivalent linking group, and still more preferably a divalent linking group.
  • the divalent linking group for example, a divalent hydrocarbon group optionally having a substituent, a divalent heterocyclic group, -O-, -S-, -N(Q)-, -CO -, or groups in which these are combined.
  • Q represents a hydrogen atom or a substituent.
  • the divalent hydrocarbon group includes, for example, an alkylene group having 1 to 10 carbon atoms (preferably 1 to 5), an alkenylene group having 1 to 10 carbon atoms, and an alkynylene group having 1 to 10 carbon atoms.
  • divalent aliphatic hydrocarbon groups divalent aromatic hydrocarbon groups such as arylene groups
  • divalent heterocyclic groups include divalent aromatic heterocyclic groups, and specific examples thereof include pyridylene group (pyridine-diyl group), pyridazine-diyl group, imidazole-diyl group, thienylene (thiophene -diyl group), quinolylene group (quinoline-diyl group), and the like.
  • the group consisting of the above-mentioned divalent hydrocarbon group, divalent heterocyclic group, -O-, -S-, -N(Q)-, and -CO- Groups in which two or more selected from are combined include, for example, —O-divalent hydrocarbon group —, —(O-divalent hydrocarbon group) p —O— (p is 1 or more represents an integer), and -divalent hydrocarbon group -O-CO-.
  • divalent linking groups linear alkylene groups having 1 to 10 carbon atoms, branched alkylene groups having 3 to 10 carbon atoms, cyclic alkylene groups having 3 to 10 carbon atoms, and 6 carbon atoms.
  • a divalent linking group is preferably a combination of 12 arylene groups and at least two groups selected from the group consisting of -O-.
  • L b1 is particularly preferably an alkylene group.
  • Examples of the substituents that the divalent hydrocarbon group and the divalent heterocyclic group may have and the substituents represented by Q include a halogen atom, an alkyl group, an alkoxy group, an aryl group, and an aryl Examples include oxy, cyano, carboxy, alkoxycarbonyl, and hydroxy groups.
  • Halogen atoms include, for example, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a fluorine atom or a chlorine atom.
  • alkyl group for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
  • alkoxy group for example, an alkoxy group having 1 to 18 carbon atoms is preferable, an alkoxy group having 1 to 4 carbon atoms is more preferable, and a methoxy group or an ethoxy group is even more preferable.
  • the aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an ⁇ -methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
  • the aryloxy group may be an aromatic heterocyclic oxy group such as phenoxy group, naphthoxy group, imidazoyloxy group, benzimidazolyloxy group, pyridin-4-yloxy group, pyrimidinyloxy group, quinazolinyl oxy, purinyloxy, and thiophen-3-yloxy groups.
  • Alkoxycarbonyl groups include, for example, methoxycarbonyl and ethoxycarbonyl groups.
  • Z b1 represents a group containing a fluorine atom.
  • a plurality of Z b1 may be the same or different.
  • the groups containing fluorine atoms are the same as those described above.
  • the structural unit (a) is preferably a structural unit represented by the following general formula (10).
  • r represents an integer of 1 or more.
  • R B1 represents a hydrogen atom or a substituent.
  • Y 1 represents -O- or -NR Z -.
  • R Z represents a hydrogen atom or a substituent.
  • L B1 represents an r+1-valent linking group.
  • B1 represents a group represented by the general formula (B1). However, when * in the above general formula (B1) represents the bonding position with L B1 and r is an integer of 2 or more, the plurality of B1 may be the same or different.
  • R B1 represents a hydrogen atom or a substituent.
  • the type of the substituent represented by one aspect of R B1 is not particularly limited, and examples include known substituents, and examples include the groups exemplified as the substituent represented by one aspect of R b1 in the general formula (B1). Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable. preferable.
  • R B1 preferably represents a hydrogen atom or a methyl group.
  • Y 1 represents —O— or —NR Z —.
  • R Z represents a hydrogen atom or a substituent.
  • the type of the substituent represented by one aspect of R Z is not particularly limited, and includes known substituents. mentioned. Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable.
  • Y 1 preferably represents -O- or -NH-, more preferably -O-.
  • L B1 represents an r+1-valent linking group.
  • the r+1-valent linking group is an optionally substituted r+1-valent hydrocarbon group having 1 to 24 carbon atoms, in which part of the carbon atoms constituting the hydrocarbon group is substituted with a hetero atom.
  • the number of carbon atoms contained in the r+1-valent linking group is not particularly limited, and is preferably 1-24, more preferably 1-10.
  • a divalent to trivalent linking group is preferable, and a divalent linking group is more preferable.
  • the divalent linking group include the same as those exemplified as the divalent linking group represented by one embodiment of L b1 in the general formula (B1).
  • r represents an integer of 1 or more.
  • an integer of 1 to 3 is preferable, an integer of 1 to 2 is more preferable, and 1 is even more preferable.
  • Structural unit (a) may have a perfluoropolyether group.
  • a perfluoropolyether group refers to a perfluoroalkyl group having an ether bond, and may be a monovalent group or a divalent or higher group.
  • Perfluoropolyether groups may be linear, branched or cyclic. The number of carbon atoms contained in the perfluoropolyether group is preferably 1-200, more preferably 2-150, even more preferably 3-100.
  • perfluoropolyether groups examples include -(CF 2 O) pf -(CF 2 CF 2 O) qf -, -[CF(CF 3 )CF 2 O] pf -[CF(CF 3 )] qf - , -(CF 2 CF 2 CF 2 O) pf -, -(CF 2 CF 2 O) pf - and the like.
  • the above pf and qf each independently represent an integer of 0-20. However, pf+qf is an integer of 1 or more.
  • the sum of pf and qf is preferably 1-100, more preferably 1-75, even more preferably 3-50.
  • s and t below each independently represent an integer of 0 to 10; n represents an integer of 0 to 10, preferably an integer of 1 to 10, more preferably an integer of 1 to 4.
  • the structural unit (a ) is preferably more than 0 mol% and 90 mol% or less, more preferably 1 mol% or more and 50 mol% or less, based on the total structural units contained in the polymer (S), It is more preferably 2 mol% or more and 40 mol% or less, particularly preferably 3 mol% or more and 30 mol% or less, even more preferably 4 mol% or more and 20 mol% or less, and 5 mol% or more and 15 mol% or more. It is most preferably mol % or less.
  • the structural unit (b) containing a cationically polymerizable group will be described.
  • the cationically polymerizable group of the structural unit (b) is not particularly limited, and may be any known cationically polymerizable group.
  • Examples of cationic polymerizable groups include alicyclic ether groups, cyclic acetal groups, cyclic lactone groups, cyclic thioether groups, spiroorthoester groups, and vinyloxy groups.
  • the cationic polymerizable group is preferably an alicyclic ether group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group, an oxetanyl group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group or an oxetanyl group, and an epoxy group or Epoxycyclohexyl groups are most preferred.
  • each group described above may have a substituent.
  • the cationically polymerizable group is preferably a group represented by any one of the following formulas (C1) to (C3).
  • R C represents a hydrogen atom or a substituent.
  • R 1 C in formula (C3) represents a substituent
  • the substituent is not particularly limited, but is preferably an alkyl group, more preferably an alkyl group having 1 to 6 carbon atoms.
  • alkyl groups having 1 to 6 carbon atoms include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, n-hexyl group and the like.
  • R C preferably represents a hydrogen atom, a methyl group or an ethyl group, more preferably a methyl group or an ethyl group.
  • the structural unit (b) has the following general formula (CA- A structural unit represented by any one of 1) to (CA-3) is preferred.
  • Ra 1 represents a hydrogen atom or a methyl group.
  • A represents -O- or -NH-.
  • L3 represents a single bond or a divalent linking group.
  • R 1 C has the same meaning as in formula (C3) above.
  • A represents -O- or -NH-, preferably -O-.
  • L 3 represents a single bond or a divalent linking group.
  • L 3 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these.
  • R above represents a hydrogen atom or a substituent.
  • L 3 is preferably a single bond, or an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
  • R 1 C has the same meaning as in formula (C3) above, and specific examples and preferred ranges are also the same.
  • the structural unit (b) in the polymer (S) ) is preferably more than 0 mol% and 90 mol% or less, more preferably 5 mol% or more and 80 mol% or less, based on the total structural units contained in the polymer (S), It is more preferably 10 mol % or more and 70 mol % or less, particularly preferably 20 mol % or more and 60 mol % or less, and most preferably 30 mol % or more and 50 mol % or less.
  • D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 .
  • R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • R Z2 represents a hydrogen atom or a methyl group.
  • a 1 represents -O- or -NR Z3 -.
  • R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
  • w represents an integer of 2 to 5;
  • L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group.
  • R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
  • L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond.
  • R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
  • E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
  • R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
  • R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. * represents a binding position.
  • D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 .
  • R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
  • D 1 preferably represents a hydrogen atom or a methyl group.
  • a 1 represents -O- or -NR Z3 -.
  • R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
  • a 1 preferably represents -O- or -NH-, more preferably -O-.
  • w preferably represents an integer of 2 to 4, more preferably 2 or 3, and even more preferably 2.
  • R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
  • L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group.
  • the aromatic group is preferably an aromatic hydrocarbon group, more preferably an aromatic hydrocarbon group having 6 to 10 carbon atoms.
  • L Z1 preferably represents a w+1-valent aliphatic group, more preferably a w+1-valent aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a w+1-valent aliphatic hydrocarbon group having 1 to 5 carbon atoms.
  • the w+1 valent aliphatic hydrocarbon group is preferably linear or branched.
  • the w+1 valent aliphatic hydrocarbon group is preferably a group obtained by removing arbitrary w ⁇ 1 hydrogen atoms from an alkylene group.
  • L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond.
  • R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
  • the alkylene group may be linear or branched, preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and an alkylene group having 1 to 3 carbon atoms. more preferably a group.
  • the aryl group is preferably an aryl group having 6 to 10 carbon atoms.
  • L Z2 preferably represents an alkylene group, a divalent linking group having at least one selected from the group consisting of —CO—, —O—, and —NR Z5 —, or a single bond, and an alkylene group, —CO It more preferably represents a divalent linking group having at least one selected from the group consisting of - and -O-, or a single bond, and more preferably represents an alkylene group or a single bond.
  • the group consisting of L Z1 and L Z2 (-L Z1 -(L Z2 ) w -) is at least one selected from the group consisting of carbon atoms, hydrogen atoms and oxygen atoms for the reason that the scratch resistance is improved. is preferably composed of atoms, and more preferably composed of carbon atoms and hydrogen atoms.
  • the total number of carbon atoms contained in L Z1 and L Z2 is preferably 1 to 6, more preferably 1 to 5, still more preferably 1 to 4, and preferably 1 to 3.
  • the total number of oxygen atoms contained in L Z1 and L Z2 is preferably 0-4, more preferably 0-2.
  • R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
  • E 1 preferably represents a group represented by general formula (Ea-1).
  • E1 of the structural unit (z) is preferably a radically polymerizable group.
  • the content of the structural unit (z) in the polymer (S) is the constitution contained in the polymer (S). It is preferably more than 0 mol% and less than 100 mol%, more preferably 20 mol% or more and 97 mol% or less, and still more preferably 30 mol% or more and 95 mol% or less, relative to the entire unit. , is particularly preferably 40 mol % or more and 80 mol % or less, and most preferably 50 mol % or more and 70 mol % or less.
  • the polymer (S) may have any other structural unit in addition to the above structural units (a) to (c).
  • the polymer (S) may further have a structural unit (c) which is a structural unit different from the structural unit (b) and has hydroxyl group bonding properties.
  • a structural unit (c) having a hydroxyl group bonding property is also referred to as a “structural unit (c)”. “Having a hydroxyl group bonding property” means being able to bond to a hydroxyl group.
  • the structural unit (c) preferably contains a hydroxyl-bonding group, more preferably a group capable of chemically bonding with a hydroxyl group.
  • Structural unit (c) preferably has at least one selected from the group consisting of a boronic acid group, a boronate ester group, an isocyanate group, an aldehyde group, and an alkoxysilyl group. and an isocyanate group, and more preferably at least one selected from the group consisting of a boronic acid group and a boronate ester group.
  • the alkoxysilyl group is preferably an alkoxysilyl group having 1 to 20 carbon atoms, more preferably an alkoxysilyl group having 1 to 10 carbon atoms, still more preferably an alkoxysilyl group having 1 to 7 carbon atoms, and an alkoxysilyl group having 1 to 4 carbon atoms. Alkoxysilyl groups are particularly preferred.
  • the structural unit (c) preferably contains a group represented by the following general formula (BR-1) or (BR-2).
  • R 31 and R 32 each independently represent a hydrogen atom or an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms).
  • the above alkyl group may have a substituent.
  • substituents include monovalent non - metallic atomic groups excluding hydrogen atoms. It is the same as a thing.
  • * represents a binding position.
  • E 21 and E 22 each independently represent —O— or —NR K1 —.
  • R K1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R K1 are present, the multiple R K1 may be the same or different.
  • L 31 represents an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms) or an arylene group (preferably an arylene group having 6 to 10 carbon atoms).
  • the alkylene group and the arylene group may have substituents. Examples of substituents include monovalent non - metallic atomic groups excluding hydrogen atoms. It is the same as a thing. * represents a binding position.
  • the structural unit (c) is preferably represented by the following general formula (3).
  • R4 represents a hydrogen atom, a fluorine atom, a chlorine atom or an alkyl group having 1 to 20 carbon atoms.
  • U 1 and U 2 each independently represent -O-, -S-, -COO-, -OCO-, -CONH-, -NHCOO- or -NH-.
  • R5 and R6 each independently represent a hydrogen atom, an aliphatic hydrocarbon group, an aryl group or a heteroaryl group. R5 and R6 may be combined.
  • L4 represents a single bond or a divalent linking group.
  • R 4 in general formula (3) represents a hydrogen atom, a fluorine atom, a chlorine atom or an alkyl group having 1 to 20 carbon atoms.
  • the alkyl group represented by R 4 may be linear or branched, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 7 carbon atoms, and more preferably 1 to 4 carbon atoms. is more preferably an alkyl group, and particularly preferably a methyl group.
  • R 4 preferably represents a hydrogen atom or a methyl group.
  • U 1 and U 2 in general formula (3) each independently represent -O-, -S-, -COO-, -OCO-, -CONH-, -NHCOO- or -NH-, and -O- or -NH- is preferred, and -O- is more preferred.
  • R 5 and R 6 in general formula (3) each independently represent a hydrogen atom, an aliphatic hydrocarbon group, an aryl group or a heteroaryl group. R5 and R6 may be combined.
  • the aliphatic hydrocarbon group represented by R5 and R6 may have a substituent.
  • Aliphatic hydrocarbon groups represented by R 5 and R 6 include alkyl groups, cycloalkyl groups, alkenyl groups, cycloalkenyl groups and alkynyl groups which may have a substituent.
  • the alkyl group is preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, still more preferably an alkyl group having 1 to 7 carbon atoms, and particularly preferably an alkyl group having 1 to 4 carbon atoms. .
  • alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, and tridecyl groups.
  • hexadecyl group, octadecyl group, eicosyl group isopropyl group, isobutyl group, sec-butyl group, tert-butyl group, isopentyl group, neopentyl group, 1-methylbutyl group, isohexyl group, 2-methylhexyl group, etc. or a branched alkyl group.
  • the cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms, more preferably a cycloalkyl group having 5 to 15 carbon atoms.
  • Specific examples of cycloalkyl groups include cyclopentyl, cyclohexyl, 1-adamantyl, and 2-norbornyl groups.
  • the alkenyl group is preferably an alkenyl group having 2 to 20 carbon atoms, more preferably an alkenyl group having 2 to 10 carbon atoms, still more preferably an alkenyl group having 2 to 7 carbon atoms, and particularly preferably an alkenyl group having 2 to 4 carbon atoms.
  • alkenyl groups include linear or branched alkenyl groups such as vinyl, 1-propenyl, 1-butenyl and 1-methyl-1-propenyl groups.
  • the cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms, more preferably a cycloalkenyl group having 5 to 15 carbon atoms.
  • Specific examples of the cycloalkenyl group include a 1-cyclopentenyl group and a 1-cyclohexenyl group.
  • the alkynyl group is preferably an alkynyl group having 2 to 20 carbon atoms, more preferably an alkynyl group having 2 to 10 carbon atoms, still more preferably an alkynyl group having 2 to 7 carbon atoms, and particularly preferably an alkynyl group having 2 to 4 carbon atoms.
  • Specific examples of alkynyl groups include ethynyl, 1-propynyl, 1-butynyl, and 1-octynyl groups.
  • the aryl group represented by R5 and R6 may have a substituent.
  • the aryl group represented by R 5 and R 6 is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and even more preferably an aryl group having 6 to 12 carbon atoms.
  • the aryl group represented by R 5 and R 6 may be, for example, one in which 1 to 4 benzene rings form a condensed ring, or a benzene ring and an unsaturated five-membered ring form a condensed ring. .
  • aryl group represented by R 5 and R 6 include phenyl group, naphthyl group, anthryl group, phenanthryl group, indenyl group, acenabutenyl group, fluorenyl group and pyrenyl group.
  • the heteroaryl group represented by R5 and R6 may have a substituent.
  • the heteroaryl group represented by R 5 and R 6 is, for example, a heteroaromatic ring containing at least one heteroatom selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, and a hetero Examples include those with aryl groups.
  • Specific examples of heteroaromatic rings containing one or more heteroatoms selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom include pyrrole, furan, thiophene, pyrazole, imidazole, triazole, oxazole, and isoxazole.
  • R 5 and R 6 may have include monovalent nonmetallic atomic groups excluding hydrogen atoms. is the same as those exemplified as the substituent when represents the substituent.
  • R5 and R6 preferably represent a hydrogen atom, an alkyl group or an aryl group, more preferably a hydrogen atom or an alkyl group. It is further preferred that both R 5 and R 6 represent a hydrogen atom or both represent an alkyl group, and that R 5 and R 6 are bonded (i.e., R 5 and R 6 represent an alkylene linking group). preferable.
  • L4 in general formula ( 3 ) represents a single bond or a divalent linking group.
  • the divalent linking group represented by L 4 is -O-, -S-, -COO-, -OCO-, -CONR 13 -, -NR 13 COO-, -CR 13 N-, substituted or unsubstituted 2 It preferably represents a divalent linking group selected from the group consisting of a valent aliphatic group, a substituted or unsubstituted divalent aromatic group, and a combination thereof.
  • R 13 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.
  • L 4 contains a substituted or unsubstituted divalent aliphatic group
  • the number of carbon atoms in the aliphatic group is preferably 1-20, more preferably 1-15, even more preferably 1-10.
  • the number of aromatic rings is preferably 1-3, more preferably 1-2, even more preferably 1.
  • L 4 is -O-, -COO-, -OCO-, -CONR 13 -, -NR 13 COO-, a substituted or unsubstituted divalent aliphatic group, a substituted or unsubstituted divalent aromatic group , And preferably a divalent linking group selected from the group consisting of combinations thereof, -O-, -COO-, -OCO-, substituted or unsubstituted divalent aliphatic group, substituted or unsubstituted A substituted divalent aromatic group, and more preferably a divalent linking group selected from the group consisting of combinations thereof, -O-, -COO-, -OCO-, substituted or unsubstituted alkylene It is more preferably a divalent linking group selected from the group consisting of a group, a substituted or unsubstituted arylene group, and a combination thereof.
  • the repeating unit represented by general formula (3) is obtained by polymerizing a compound represented by general formula (3m) below.
  • R 4 , U 1 , U 2 , R 5 , R 6 and L 4 are R 4 , U 1 , U 2 , R 5 , R 6 and L in general formula (3), respectively. 4 , and the description, specific examples, and preferred ranges for each are also the same.
  • Wb be the content of the structural unit (b) based on the material amount
  • Wc is the content based on the amount of substance
  • Wz is the content of the structural unit (z) based on the amount of material
  • the content of the structural unit (c) in the polymer (S) is more than 0 mol% 90% with respect to the total structural units contained in the polymer (S). It is preferably mol % or less, more preferably 5 mol % or more and 85 mol % or less, and even more preferably 10 mol % or more and 80 mol % or less.
  • the weight average molecular weight (Mw) of the polymer (S) is preferably 5,000 to 200,000, more preferably 8,000 to 150,000, even more preferably 10,000 to 100,000.
  • the molecular weight dispersity (Mw/Mn) of the polymer (S) is, for example, 1.00 to 4.00, preferably 1.10 to 3.70, more preferably 1.20 to 3.00. , more preferably 1.20 to 2.50.
  • Mw represents the weight average molecular weight
  • Mn represents the number average molecular weight.
  • the weight average molecular weight and molecular weight dispersity of the polymer (S) are the values measured by GPC (converted to polystyrene). Specifically, the weight average molecular weight is obtained by preparing HLC-8220 (manufactured by Tosoh Corporation) as an apparatus, using tetrahydrofuran as an eluent, using TSKgel (registered trademark) G3000HXL + TSKgel (registered trademark) G2000HXL as a column, at a temperature of 23 ° C. , at a flow rate of 1 mL/min, using a differential refractive index (RI) detector.
  • RI differential refractive index
  • polymer (S) Specific examples of the polymer (S) are shown below, but are not limited to these.
  • Polymer (S) can be produced by a known method.
  • a monomer containing a group containing a fluorine atom as described above, a monomer containing a cationically polymerizable group as described above, a monomer containing a radically polymerizable group as described above, and any other monomer are mixed, and in an organic solvent, a radical It can be produced by polymerization using a polymerization initiator.
  • the radical polymerization it is preferable to protect the radically polymerizable group of the structural unit (z) by a known method in order to prevent the radically polymerizable group from reacting.
  • the content of the polymer (S) in the curable resin composition of the present invention is not particularly limited, and can be appropriately adjusted depending on the application of the curable resin composition.
  • the polymer (S) can be used as a main component or as an additive.
  • the main component is the component with the highest content among the solids contained in the curable resin composition.
  • the additive is a component that is not the main component among the solids contained in the curable resin composition.
  • the content of the polymer (S) is It is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more, relative to the total solid content in the resin composition).
  • the upper limit of the polymer (S) content is not particularly limited, but is preferably 99% by mass or less, more preferably 98% by mass or less, and even more preferably 97% by mass or less.
  • the total solid content means all components other than the solvent.
  • the content of the polymer (S) is With respect to the total solid content in the resin composition), for example, it can be 0.001 to 10% by mass, it can be 0.01 to 7% by mass, and it is 0.1 to 5% by mass It can also be 0.1 to 3% by mass.
  • curable resin composition of the present invention only one type of polymer (S) may be used, or two or more types having different structures may be used in combination.
  • curable resin composition preferably hard coat layer-forming composition
  • curable resin composition preferably hard coat layer-forming composition
  • the curable resin composition of the present invention can contain a polyorganosilsesquioxane (a1) having a cationically polymerizable group (also referred to as "polyorganosilsesquioxane (a1)").
  • the cationic polymerizable group in the polyorganosilsesquioxane (a1) is not particularly limited, and may be any known cationic polymerizable group.
  • Examples of cationic polymerizable groups include alicyclic ether groups, cyclic acetal groups, cyclic lactone groups, cyclic thioether groups, spiroorthoester groups, and vinyloxy groups.
  • the cationic polymerizable group is preferably an alicyclic ether group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group, an oxetanyl group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group or an oxetanyl group, and an epoxy group or Epoxycyclohexyl groups are most preferred.
  • each group described above may have a substituent.
  • the cationically polymerizable group is preferably a group represented by any one of the following formulas (ca1) to (ca3).
  • the polyorganosilsesquioxane (a1) preferably has structural units represented by any of the following general formulas (csa-1) to (csa-3).
  • L5 represents a single bond or a divalent linking group.
  • Rca has the same meaning as in formula (ca3).
  • SiO 1.5 represents a structural portion (silsesquioxane unit) composed of siloxane bonds (Si—O—Si) in polysilsesquioxane.
  • Polysilsesquioxane is a network-type polymer or polyhedral cluster having siloxane structural units derived from a hydrolyzable trifunctional silane compound, and can form a random structure, ladder structure, cage structure, etc. by siloxane bonds.
  • SiO 1.5 described in this specification is the same as above.
  • L5 represents a single bond or a divalent linking group.
  • L 5 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these.
  • R above represents a hydrogen atom or a substituent.
  • L 5 is preferably a single bond, an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
  • Rca has the same meaning as in formula (ca3), and specific examples and preferred ranges are also the same.
  • the content of the structural unit represented by any of the above general formulas (csa-1) to (csa-3) in the polyorganosilsesquioxane (a1) is included in the polyorganosilsesquioxane (a1). It is preferably 50 mol% or more and 100 mol% or less, more preferably 70 mol% or more and 100 mol% or less, and 90 mol% or more and 100 mol% or less with respect to the entire structural unit. More preferred.
  • the polyorganosilsesquioxane (a1) may have any other structural unit in addition to the structural units represented by any of the general formulas (csa-1) to (csa-3). good.
  • the polyorganosilsesquioxane (a1) has a standard polystyrene-equivalent number average molecular weight (Mn) measured by gel permeation chromatography (GPC), preferably 500 to 6000, more preferably 1000 to 4500, still more preferably 1500-3000.
  • Mn polystyrene-equivalent number average molecular weight measured by gel permeation chromatography
  • the polyorganosilsesquioxane (a1) has a standard polystyrene-equivalent molecular weight dispersity (Mw/Mn) measured by GPC, for example, 1.0 to 4.0, preferably 1.1 to 3.7, and more It is preferably 1.2 to 3.0, more preferably 1.3 to 2.5.
  • Mw represents the weight average molecular weight
  • Mn represents the number average molecular weight.
  • the method for measuring the weight average molecular weight and molecular weight dispersity of the polyorganosilsesquioxane (a1) is the same as the method for measuring the weight average molecular weight and molecular weight dispersity of the polymer (S) described above.
  • polyorganosilsesquioxane (a1) Only one type of polyorganosilsesquioxane (a1) may be used, or two or more types having different structures may be used in combination.
  • the content of the polyorganosilsesquioxane (a1) in the curable resin composition of the present invention is not particularly limited, but may be 50% by mass or more with respect to the total solid content of the curable resin composition. , 70% by mass or more, and may be 80% by mass or more.
  • the upper limit of the content of the polyorganosilsesquioxane (a1) in the curable resin composition is not particularly limited, but it can be 99.999% by mass or less, and can be 99.99% by mass or less. , 99.9% by mass or less.
  • the total solid content means all components other than the solvent.
  • the curable resin composition of the present invention may contain a radical polymerization initiator.
  • One radical polymerization initiator may be used alone, or two or more different structures may be used in combination.
  • the radical polymerization initiator may be a photopolymerization initiator or a thermal polymerization initiator.
  • the content of the radical polymerization initiator in the curable resin composition of the present invention is not particularly limited, but is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of polymer (S), 0.5 to 20 parts by mass is more preferable.
  • the curable resin composition of the present invention may contain a cationic polymerization initiator.
  • the cationic polymerization initiator may be a photocationic polymerization initiator or a thermal cationic polymerization initiator.
  • Examples of cationic polymerization initiators include, but are not limited to, sulfonium salts, ammonium salts, iodonium salts (eg, diaryliodonium salts), triarylsulfonium salts, diazonium salts, and iminium salts.
  • a cationic polymerization initiator can be synthesized by a known method and is also available as a commercial product.
  • iodonium salt-based photocationic polymerization initiator examples include, for example, B2380 manufactured by Tokyo Chemical Co., Ltd., BBI-102 manufactured by Midori Chemical Co., Ltd., WPI-113 manufactured by Fuji Film Wako Pure Chemical, and manufactured by Fuji Film Wako Pure Chemical. WPI-124, WPI-169 manufactured by Fuji Film Wako Pure Chemical, WPI-170 manufactured by Fuji Film Wako Pure Chemical, and DTBPI-PFBS manufactured by Toyo Gosei Chemical Co., Ltd. can be mentioned.
  • the content of the cationic polymerization initiator in the curable resin composition of the present invention is not particularly limited. Parts by mass are preferable, and 1 to 50 parts by mass are more preferable.
  • the curable resin composition of the present invention may contain a solvent.
  • a solvent an organic solvent is preferable, and one or two or more organic solvents can be mixed in an arbitrary ratio and used.
  • organic solvents include alcohols such as methanol, ethanol, propanol, n-butanol and i-butanol; ketones such as acetone, methyl isobutyl ketone, methyl ethyl ketone and cyclohexanone; cellosolves such as ethyl cellosolve; toluene.
  • the content of the solvent in the curable resin composition of the present invention can be appropriately adjusted within a range in which the coating suitability of the curable resin composition can be ensured. For example, it can be 50 to 500 parts by mass, preferably 80 to 200 parts by mass, per 100 parts by mass of the total solid content of the curable resin composition.
  • a curable resin composition is usually in the form of a liquid.
  • the solid content concentration of the curable resin composition is usually 10 to 90% by mass, preferably 20 to 80% by mass, and particularly preferably 40 to 75% by mass.
  • the curable resin composition of the present invention may contain components other than those described above. may contain.
  • the curable resin composition of the present invention can be prepared by mixing the various components described above simultaneously or sequentially in any order.
  • the preparation method is not particularly limited, and a known stirrer or the like can be used for preparation.
  • the hard coat film of the present invention is a hard coat film comprising a substrate (preferably a plastic substrate) and a hard coat layer formed from the curable resin composition of the present invention described above.
  • the thickness of the hard coat layer that can be formed from the curable resin composition of the present invention is not particularly limited, but is preferably 0.5 to 30 ⁇ m, more preferably 1 to 25 ⁇ m, and more preferably 2 to 20 ⁇ m. is more preferable.
  • the film thickness of the hard coat layer is calculated by observing the cross section of the laminate with an optical microscope.
  • a cross-section sample can be prepared by a microtome method using a cross-section cutting device ultramicrotome, a cross-section processing method using a focused ion beam (FIB) device, or the like.
  • the curable resin composition of the present invention can be applied onto a substrate and cured to form a hard coat layer.
  • the substrate used for the hard coat film preferably has a transmittance in the visible light region of 70% or more, more preferably 80% or more, and even more preferably 90% or more.
  • the substrate is preferably a plastic substrate and preferably comprises a polymer.
  • a polymer excellent in optical transparency, mechanical strength, thermal stability and the like is preferable.
  • polymers examples include polycarbonate-based polymers, polyester-based polymers such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and styrene-based polymers such as polystyrene and acrylonitrile-styrene copolymer (AS resin).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • AS resin styrene-based polymers
  • Polyolefins such as polyethylene and polypropylene, norbornene resins, polyolefin polymers such as ethylene/propylene copolymers, (meth)acrylic polymers such as polymethyl methacrylate, vinyl chloride polymers, nylon, and amides such as aromatic polyamides.
  • -based polymer imide-based polymer, sulfone-based polymer, polyethersulfone-based polymer, polyetheretherketone-based polymer, polyphenylene sulfide-based polymer, vinylidene chloride-based polymer, vinyl alcohol-based polymer, vinyl butyral-based polymer, arylate-based polymer, polyoxy A methylene-based polymer, an epoxy-based polymer, a cellulose-based polymer represented by triacetyl cellulose, a copolymer of the above-mentioned polymers, and a polymer obtained by mixing the above-mentioned polymers are also included.
  • amide-based polymers such as aromatic polyamides and imide-based polymers have a large number of times of breaking and bending measured by an MIT tester according to JIS (Japanese Industrial Standards) P8115 (2001), and have relatively high hardness. It can be preferably used.
  • aromatic polyamides such as those described in Example 1 of Japanese Patent No. 5699454, JP-T-2015-508345, JP-T-2016-521216, and polyimides described in WO2017/014287 are preferably used as a base material. can be used.
  • aromatic polyamide (aramid-based polymer) is preferable.
  • the substrate preferably contains at least one polymer selected from imide-based polymers and aramid-based polymers.
  • the substrate is preferably film-like.
  • the thickness of the substrate is more preferably 100 ⁇ m or less, still more preferably 80 ⁇ m or less, and most preferably 50 ⁇ m or less. From the viewpoint of ease of handling of the substrate, the thickness of the substrate is preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more, and most preferably 15 ⁇ m or more.
  • the hard coat film of the present invention has excellent scratch resistance.
  • an index of scratch resistance the surface of the hard coat layer of the hard coat film of the present invention was subjected to a rubbing test using a rubbing tester under the following conditions. It is more preferable that no scratch occurs when rubbed back and forth 100 times, and more preferably no scratch occurs when rubbed back and forth 300 times.
  • the hard coat film of the present invention may further have a scratch resistant layer.
  • a scratch resistant layer it preferably has a substrate, a hard coat layer, and a scratch resistant layer in this order.
  • the scratch-resistant layer is not particularly limited, it is preferably a layer obtained by curing a composition for forming a scratch-resistant layer containing the radically polymerizable compound (c1).
  • the radically polymerizable compound (c1) (also referred to as “compound (c1)”) will be described.
  • Compound (c1) is a compound having a radically polymerizable group.
  • the radically polymerizable group in the compound (c1) is not particularly limited, and generally known radically polymerizable groups can be used.
  • the radically polymerizable group includes a polymerizable unsaturated group, specifically a (meth)acryloyl group, a vinyl group, an allyl group, and the like, preferably a (meth)acryloyl group.
  • each group described above may have a substituent.
  • Compound (c1) is preferably a compound having two or more (meth)acryloyl groups in one molecule, more preferably a compound having three or more (meth)acryloyl groups in one molecule.
  • the molecular weight of compound (c1) is not particularly limited, and may be a monomer, an oligomer, or a polymer.
  • the content of the compound (c1) in the scratch-resistant layer-forming composition is preferably 80% by mass or more, more preferably 85% by mass or more, based on the total solid content in the scratch-resistant layer-forming composition.
  • 90% by mass or more is more preferable.
  • the scratch-resistant layer-forming composition preferably contains a radical polymerization initiator.
  • a radical polymerization initiator may be used alone, or two or more different structures may be used in combination. Further, the radical polymerization initiator may be a photopolymerization initiator or a thermal polymerization initiator.
  • the content of the radical polymerization initiator in the scratch-resistant layer-forming composition is not particularly limited. ⁇ 50 parts by mass is more preferable.
  • the scratch-resistant layer-forming composition may contain a solvent.
  • the solvent is the same as the solvent that the curable resin composition may contain.
  • the content of the solvent in the composition for forming a scratch resistant layer in the present invention can be appropriately adjusted within a range in which the applicability of the composition for forming a scratch resistant layer can be ensured. For example, it can be 50 to 500 parts by mass, preferably 80 to 200 parts by mass, per 100 parts by mass of the total solid content of the scratch-resistant layer-forming composition.
  • the scratch-resistant layer-forming composition usually takes the form of a liquid.
  • the concentration of the solid content of the scratch-resistant layer-forming composition is usually 10 to 90% by mass, preferably 15 to 80% by mass, and particularly preferably 20 to 70% by mass.
  • the scratch-resistant layer-forming composition may contain components other than those described above, such as inorganic particles, leveling agents, antifouling agents, antistatic agents, slip agents, and solvents.
  • the thickness of the scratch-resistant layer is preferably less than 3.0 ⁇ m, more preferably 0.1 to 2.0 ⁇ m, and more preferably 0.1 to 1.0 ⁇ m. More preferred.
  • the method for producing a hard coat film of the present invention is a method for producing a hard coat film including a substrate and a hard coat layer, and the curable resin composition of the present invention is applied onto the substrate to form a coating film.
  • the method for producing a hard coat film comprises forming a hard coat layer by subjecting the coating film to a curing treatment.
  • the base material is as described above.
  • the curing treatment is preferably a curing treatment using at least one of light and heat, and more preferably a curing treatment using light and heat because the curing reaction rate can be increased.
  • Curing treatment with light is treatment in which a polymerization reaction proceeds by irradiation with light (preferably ionizing radiation).
  • the curing treatment by heat is a treatment for promoting a polymerization reaction by heating.
  • the method of applying the curable resin composition is not particularly limited, and known methods can be used. Examples thereof include dip coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating and die coating.
  • the type of light is not particularly limited and includes X-rays, electron beams, ultraviolet rays, visible light, infrared rays and the like, but ultraviolet rays are preferably used.
  • the hard coat layer coating film is UV curable, it is preferable to semi-cure the curable compound by irradiating UV rays with an irradiation dose of 10 mJ/cm 2 to 2000 mJ/cm 2 from an UV lamp. It is more preferably 50 mJ/cm 2 to 1800 mJ/cm 2 and even more preferably 100 mJ/cm 2 to 1500 mJ/cm 2 .
  • a metal halide lamp, a high-pressure mercury lamp, or the like is preferably used as the type of ultraviolet lamp.
  • the temperature reached by heating the hard coat layer is not particularly limited, but is preferably 80° C. or higher and 200° C. or lower, more preferably 100° C. or higher and 180° C. or lower. It is preferably 120° C. or higher and 160° C. or lower, more preferably.
  • the oxygen concentration during curing is preferably 0 to 1.0% by volume, more preferably 0 to 0.1% by volume, and most preferably 0 to 0.05% by volume.
  • the hard coat film of the present invention has excellent surface properties and scratch resistance, and can be used, for example, as an optical film. Further, the hard coat film of the present invention can be used as a surface protective film for image display devices (surface protective film for image display devices).
  • a surface protective film for an image display device is a protective film placed on the surface of an image display device in order to protect the display surface (display surface) of the image display device.
  • the present invention also relates to an article provided with the hard coat film of the present invention and an image display apparatus provided with the hard coat film of the present invention as a surface protection film.
  • BHT dibutylhydroxytoluene
  • the resulting solid was dissolved in 15 g of MEK, 11 g of triethylamine and 0.01 g of p-methoxyphenol were added, and the mixture was stirred at 60° C. for 4 hours. After cooling the reaction solution to room temperature, it was reprecipitated using 500 mL of a 1:1 mixed solvent of methanol and water, and dissolved in 25 g of MEK to obtain 7.0 g of polymer (S-1) (yield 70%). .
  • Polymers (S-2) to (S-6) and (S2-1) to (S2-7) are synthesized according to the synthesis method of the polymer (S-1), respectively, the type and amount of the monomer, the polymerization initiator was synthesized by changing the amount of
  • the structural formula and weight average molecular weight (Mw) of each polymer used are shown below.
  • the content (content ratio) of each structural unit in the following structural formula is based on the amount of substance, and the unit is "mol %".
  • ⁇ Preparation of base material> (Manufacturing of polyimide powder) 832 g of N,N-dimethylacetamide (DMAc) was added to a 1 L reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser under a nitrogen stream, and then the temperature of the reactor was reduced to 25. °C. 64.046 g (0.2 mol) of bistrifluoromethylbenzidine (TFDB) was added thereto and dissolved.
  • DMAc N,N-dimethylacetamide
  • TFDB bistrifluoromethylbenzidine
  • base material K-1 100 g of the above polyimide powder was dissolved in 670 g of N,N-dimethylacetamide (DMAc) to obtain a 13% by weight solution. The resulting solution was cast on a stainless plate and dried with hot air at 130° C. for 30 minutes. After that, the film was peeled off from the stainless steel plate and fixed to the frame with pins. The frame with the film fixed was placed in a vacuum oven and heated for 2 hours while gradually increasing the heating temperature from 100°C to 300°C, and then gradually. cooled to After the cooled film was separated from the frame, it was further heat-treated at 300° C. for 30 minutes as the final heat-treatment step to obtain a base material K-1 made of a polyimide film and having a thickness of 30 ⁇ m.
  • DMAc N,N-dimethylacetamide
  • Example 1 ⁇ Preparation of curable resin composition (composition for forming hard coat layer)> (Curable resin composition HC-1)
  • the following components were put into a mixing tank in the following amounts and stirred.
  • the resulting composition was filtered through a polypropylene filter having a pore size of 0.45 ⁇ m to obtain a curable resin composition HC-1.
  • Polymer (S-1) 94.75 parts by mass Irgacure 127 5.00 parts by mass RS-90 0.25 parts by mass MIBK (methyl isobutyl ketone) 100.00 parts by mass
  • Irgacure 127 (Irg.127): Photoradical polymerization initiator, manufactured by BASF RS-90: Slip agent, manufactured by DIC Corporation
  • the curable resin composition HC-1 was bar-coated on a polyimide substrate K-1 having a thickness of 30 ⁇ m using a wire bar #18 so that the film thickness after curing was 18 ⁇ m. A coat layer coating was applied. Next, after drying the hard coat layer coating film at 120° C. for 1 minute, it was irradiated with ultraviolet rays using an air-cooled mercury lamp under conditions of 25° C. and an oxygen concentration of 100 ppm (parts per million). Thus, the hard coat layer coating film was cured. Thus, a hard coat film having a hard coat layer (a layer obtained by curing the curable resin composition HC-1) on the substrate was obtained.
  • Examples 2 to 13, Comparative Examples 1 to 5 Hard coat films of Examples 2 to 13 and Comparative Examples 1 to 5 were produced in the same manner as in Example 1, except that the polymers listed in Table 1 below were used instead of the polymer (S-1). .
  • polymer (SX-1) and polymer (SX-4) were used at a mass ratio of polymer (SX-1):polymer (SX-4) of 1:1, and polymer (SX-1) and The total content of polymer (SX-4) was the same as the content of polymer (S-1) in Example 1.
  • the hard coat films of Examples 1 to 13 were excellent in scratch resistance.
  • a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. can provide.

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Abstract

Provided are: a curable resin composition comprising a polymer (S) having at least one structural unit that is selected from the group consisting of structural units (a) which include a fluorine atom and structural units (b) which include a cationically polymerizable group and a structural unit (z) that is represented by general formula (Z-1) which is set forth in the specification; a hard coat film formed using the curable resin composition; and a production method for the hard coat film. Thus, provided are a curable resin composition which makes it possible to form cured layer having excellent abrasion resistance, a hard coat film formed using the curable resin composition, and a production method for the hard coat film.

Description

硬化性樹脂組成物、ハードコートフィルム及びハードコートフィルムの製造方法Curable resin composition, hard coat film and method for producing hard coat film
 本発明は、硬化性樹脂組成物、ハードコートフィルム及びハードコートフィルムの製造方法に関する。 The present invention relates to a curable resin composition, a hard coat film, and a method for producing a hard coat film.
 硬化性樹脂組成物は、例えばハードコート層形成用組成物として用いることができ、基材上に塗布して硬化することでハードコート層を形成することができる。例えば、液晶表示装置(LCD)、プラズマディスプレイパネル(PDP)、エレクトロルミネッセンスディスプレイ(ELD)やマイクロLED(Light Emitting Diode)、マイクロOLED(Organic Light Emitting Diode)のような画像表示装置では、表示面への傷付きを防止するために、基材上にハードコート層を有する光学フィルム(ハードコートフィルム)を設けることが好適であり、ハードコート層の形成のために硬化性樹脂組成物が用いられている。 The curable resin composition can be used, for example, as a composition for forming a hard coat layer, and the hard coat layer can be formed by coating it on a substrate and curing it. For example, in image display devices such as liquid crystal display devices (LCD), plasma display panels (PDP), electroluminescence displays (ELD), micro LEDs (Light Emitting Diodes), and micro OLEDs (Organic Light Emitting Diodes), In order to prevent scratches on the substrate, it is preferable to provide an optical film (hard coat film) having a hard coat layer on the substrate, and a curable resin composition is used to form the hard coat layer. there is
 特許文献1には、複数のアクリロイル基を有する構造単位とカルボキシ基を含む構造単位とを有する重合体、及び溶媒を含有する硬化性樹脂組成物が記載されている。 Patent Document 1 describes a curable resin composition containing a polymer having a structural unit having a plurality of acryloyl groups and a structural unit containing a carboxy group, and a solvent.
日本国特開2015-175923号公報Japanese Patent Application Laid-Open No. 2015-175923
 しかしながら、本発明者らが検討したところ、従来の硬化性樹脂組成物を硬化することで形成した硬化層は、十分な耐擦傷性が得られないことが分かった。
 本発明の課題は、耐擦傷性に優れた硬化層を形成することができる硬化性樹脂組成物、上記硬化性樹脂組成物を用いて形成されたハードコートフィルム及び上記ハードコートフィルムの製造方法を提供することにある。
However, as a result of investigation by the present inventors, it has been found that a cured layer formed by curing a conventional curable resin composition does not have sufficient scratch resistance.
An object of the present invention is to provide a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. to provide.
 本発明者らは鋭意検討し、下記手段により上記課題が解消できることを見出した。 The inventors diligently studied and found that the above problems could be solved by the following means.
<1>
 フッ素原子を含む構成単位(a)及びカチオン重合性基を含む構成単位(b)からなる群より選ばれる少なくとも1つの構成単位と、下記一般式(Z-1)で表される構成単位(z)とを有するポリマー(S)を含む硬化性樹脂組成物。
<1>
At least one structural unit selected from the group consisting of a structural unit (a) containing a fluorine atom and a structural unit (b) containing a cationically polymerizable group, and a structural unit (z ) and a curable resin composition containing a polymer (S) having
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
 一般式(Z-1)中、
 Dは水素原子、メチル基、-CHORZ1又は-CHCOORZ2を表す。RZ1は水素原子又は炭素数1~4のアルキル基を表す。RZ2は水素原子又はメチル基を表す。
 Aは-O-又は-NRZ3-を表す。RZ3は水素原子又は炭素数1~4のアルキル基を表す。
 wは2~5の整数を表す。
 LZ1は脂肪族基及び芳香族基からなる群より選ばれる少なくとも1つを有するw+1価の連結基を表す。上記脂肪族基に含まれる1つ以上の-CH-はそれぞれ独立に-CO-、-O-又は-NRZ4-に置き換わってもよい。RZ4は水素原子又は炭素数1~4のアルキル基を表す。RZ4が複数存在する場合、複数のRZ4は同一でも異なっていてもよい。
 LZ2はアルキレン基、アリーレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す。RZ5は水素原子又は炭素数1~4のアルキル基を表す。RZ5が複数存在する場合、複数のRZ5は同一でも異なっていてもよい。
 Eは下記一般式(Ea-1)又は(Ea-2)で表される基を表す。
In the general formula (Z-1),
D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 . R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. R Z2 represents a hydrogen atom or a methyl group.
A 1 represents -O- or -NR Z3 -. R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
w represents an integer of 2 to 5;
L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group. One or more —CH 2 — contained in the aliphatic group may be independently replaced with —CO—, —O— or —NR Z4 —. R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond. R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
 一般式(Ea-1)及び(Ea-2)中、
 RE1及びRE2はそれぞれ独立に水素原子又はメチル基を表す。
 RE3は水素原子又は炭素数1~4のアルキル基を表す。
 *は結合位置を表す。
<2>
 上記ポリマー(S)に含まれる全ての構成単位に対する、上記構成単位(a)の物質量基準の含有量をWaとし、上記構成単位(b)の物質量基準の含有量をWbとし、上記構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはない、<1>に記載の硬化性樹脂組成物。
<3>
 上記Wzが、30mol%≦Wz≦95mol%を満たす、<2>に記載の硬化性樹脂組成物。
<4>
 上記ポリマー(S)が、更に、上記構成単位(b)とは異なる構成単位であって、かつ水酸基結合性を有する構成単位(c)を有する、<1>~<3>のいずれか1つに記載の硬化性樹脂組成物。
<5>
 上記ポリマー(S)に含まれる全ての構成単位に対する、上記構成単位(a)の物質量基準の含有量をWaとし、上記構成単位(b)の物質量基準の含有量をWbとし、上記構成単位(c)の物質量基準の含有量をWcとし、上記構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb、Wc及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wc<90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはない、<4>に記載の硬化性樹脂組成物。
<6>
 上記構成単位(c)が、ボロン酸基、イソシアネート基、アルデヒド基、及びアルコキシシリル基からなる群より選ばれる少なくとも1つを有する、<4>又は<5>に記載の硬化性樹脂組成物。
<7>
 上記ポリマー(S)が、上記構成単位(a)と上記構成単位(b)と上記構成単位(z)とを有する、<1>~<6>のいずれか1つに記載の硬化性樹脂組成物。
<8>
 上記一般式(Z-1)中のLZ1がw+1価の脂肪族基を表す、<1>~<7>のいずれか1つに記載の硬化性樹脂組成物。
<9>
 上記一般式(Z-1)中のLZ2がアルキレン基、-CO-、及び-O-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す、<1>~<8>のいずれか1つに記載の硬化性樹脂組成物。
<10>
 上記一般式(Z-1)中のLZ1とLZ2に含まれる炭素原子数が合計で1~6である、<1>~<9>のいずれか1つに記載の硬化性樹脂組成物。
<11>
 上記構成単位(a)に含まれるフッ素原子の数が、3個以上17個以下である、<1>~<10>のいずれか1つに記載の硬化性樹脂組成物。
<12>
 上記構成単位(a)が、下記一般式(f-1)で表される基を有する、<1>~<11>のいずれか1つに記載の硬化性樹脂組成物。
In general formulas (Ea-1) and (Ea-2),
R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
* represents a binding position.
<2>
With respect to all the structural units contained in the polymer (S), the content of the structural unit (a) based on the amount of substance is represented by Wa, the content of the structural unit (b) based on the amount of material is represented by Wb, and the above constitution When Wz is the content of the unit (z) based on the amount of substance, Wa, Wb and Wz satisfy 0 mol% ≤ Wa ≤ 90 mol%, 0 mol% ≤ Wb ≤ 90 mol%, and 0 mol% < Wz < 100 mol% and the curable resin composition according to <1>, wherein both Wa and Wb are not 0 mol %.
<3>
The curable resin composition according to <2>, wherein Wz satisfies 30 mol%≦Wz≦95 mol%.
<4>
Any one of <1> to <3>, wherein the polymer (S) further has a structural unit (c) which is a structural unit different from the structural unit (b) and has hydroxyl group bonding properties. The curable resin composition according to .
<5>
With respect to all the structural units contained in the polymer (S), the content of the structural unit (a) based on the amount of substance is represented by Wa, the content of the structural unit (b) based on the amount of material is represented by Wb, and the above constitution Where Wc is the content of the unit (c) based on the substance amount, and Wz is the content of the structural unit (z) based on the substance amount, Wa, Wb, Wc and Wz are each 0 mol% ≤ Wa ≤ 90 mol %, 0 mol% ≤ Wb ≤ 90 mol%, 0 mol% < Wc < 90 mol%, 0 mol% < Wz < 100 mol%, and both Wa and Wb are not 0 mol%, curing according to <4> elastic resin composition.
<6>
The curable resin composition according to <4> or <5>, wherein the structural unit (c) has at least one selected from the group consisting of a boronic acid group, an isocyanate group, an aldehyde group, and an alkoxysilyl group.
<7>
The curable resin composition according to any one of <1> to <6>, wherein the polymer (S) has the structural unit (a), the structural unit (b), and the structural unit (z). thing.
<8>
The curable resin composition according to any one of <1> to <7>, wherein L Z1 in general formula (Z-1) represents a w+1-valent aliphatic group.
<9>
L Z2 in the general formula (Z-1) represents a divalent linking group having at least one selected from the group consisting of an alkylene group, —CO—, and —O—, or a single bond <1> The curable resin composition according to any one of <8>.
<10>
The curable resin composition according to any one of <1> to <9>, wherein the total number of carbon atoms contained in L Z1 and L Z2 in the general formula (Z-1) is 1 to 6. .
<11>
The curable resin composition according to any one of <1> to <10>, wherein the number of fluorine atoms contained in the structural unit (a) is 3 or more and 17 or less.
<12>
The curable resin composition according to any one of <1> to <11>, wherein the structural unit (a) has a group represented by the following general formula (f-1).
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000008
 一般式(f-1)中、q1は0~12の整数を表し、q2は1~8の整数を表し、Rqは水素原子又はフッ素原子を表す。*は結合位置を表す。
<13>
 上記構成単位(a)が、下記一般式(B1)で表される基を有する、<1>~<12>のいずれか1つに記載の硬化性樹脂組成物。
In general formula (f-1), q1 represents an integer of 0 to 12, q2 represents an integer of 1 to 8, and Rq1 represents a hydrogen atom or a fluorine atom. * represents a binding position.
<13>
The curable resin composition according to any one of <1> to <12>, wherein the structural unit (a) has a group represented by the following general formula (B1).
Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000009
 一般式(B1)中、
 nは1以上の整数を表す。複数のnは同一であっても異なっていてもよい。
 Rb1は水素原子又は置換基を表す。
 Rb2は水素原子又は置換基を表す。複数のRb2は同一であっても異なっていてもよい。
 Lb1は、n+1価の連結基を表す。複数のLb1は同一であっても異なっていてもよい。
 Zb1は、フッ素原子を含有する基を表す。複数のZは同一であっても異なっていてもよい。
 *は、結合位置を表す。
<14>
 上記構成単位(a)が、パーフルオロポリエーテル基を有する、<1>~<13>のいずれか1つに記載の硬化性樹脂組成物。
<15>
 上記構成単位(b)の上記カチオン重合性基が下記一般式(C1)~(C3)のいずれかで表される基である、<1>~<14>のいずれか1つに記載の硬化性樹脂組成物。
In general formula (B1),
n represents an integer of 1 or more. A plurality of n may be the same or different.
R b1 represents a hydrogen atom or a substituent.
R b2 represents a hydrogen atom or a substituent. A plurality of R b2 may be the same or different.
L b1 represents an n+1-valent linking group. A plurality of L b1 may be the same or different.
Z b1 represents a group containing a fluorine atom. Plural Z's may be the same or different.
* represents a binding position.
<14>
The curable resin composition according to any one of <1> to <13>, wherein the structural unit (a) has a perfluoropolyether group.
<15>
Curing according to any one of <1> to <14>, wherein the cationic polymerizable group of the structural unit (b) is a group represented by any one of the following general formulas (C1) to (C3): elastic resin composition.
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000010
 一般式(C1)~(C3)中、*は結合位置を表す。一般式(C3)中、Rは水素原子又は置換基を表す。
<16>
 上記ポリマー(S)の重量平均分子量が5000~200000である、<1>~<15>のいずれか1つに記載の硬化性樹脂組成物。
<17>
 基材と、<1>~<16>のいずれか1つに記載の硬化性樹脂組成物から形成されたハードコート層とを含むハードコートフィルム。
<18>
 基材とハードコート層とを含むハードコートフィルムの製造方法であって、<1>~<16>のいずれか1つに記載の硬化性樹脂組成物を上記基材上に塗布して塗膜を形成し、上記塗膜に硬化処理を施すことにより上記ハードコート層を形成する、ハードコートフィルムの製造方法。
<19>
 上記硬化処理が、光と熱による硬化処理である、<18>に記載のハードコートフィルムの製造方法。
In general formulas (C1) to (C3), * represents a bonding position. In general formula (C3), R 2 C represents a hydrogen atom or a substituent.
<16>
The curable resin composition according to any one of <1> to <15>, wherein the polymer (S) has a weight average molecular weight of 5,000 to 200,000.
<17>
A hard coat film comprising a substrate and a hard coat layer formed from the curable resin composition according to any one of <1> to <16>.
<18>
A method for producing a hard coat film comprising a substrate and a hard coat layer, wherein the curable resin composition according to any one of <1> to <16> is applied onto the substrate to form a coating film. and subjecting the coating film to a curing treatment to form the hard coat layer.
<19>
The method for producing a hard coat film according to <18>, wherein the curing treatment is a curing treatment using light and heat.
 本発明によれば、耐擦傷性に優れた硬化層を形成することができる硬化性樹脂組成物、上記硬化性樹脂組成物を用いて形成されたハードコートフィルム及び上記ハードコートフィルムの製造方法を提供することができる。 According to the present invention, a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. can provide.
 以下、本発明を実施するための形態について詳細に説明するが、本発明はこれらに限定されるものではない。
 本明細書において、数値が物性値、特性値等を表す場合に、「(数値1)~(数値2)」という記載は「(数値1)以上(数値2)以下」の意味を表す。
 本明細書において、「(メタ)アクリレート」との記載は、「アクリレート及びメタクリレートの少なくともいずれか」の意味を表す。「(メタ)アクリル酸」、「(メタ)アクリロイル」等も同様である。
 本明細書において、各成分は、各成分に当てはまる物質を1種単独でも用いても、2種以上を併用してもよい。ここで、各成分について2種以上の物質を併用する場合、その成分についての含有量とは、特段の断りが無い限り、併用した物質の合計の含有量を指す。
 また、本明細書において表記される2価の基の結合方向は特に限定されない。
Modes for carrying out the present invention will be described in detail below, but the present invention is not limited to these.
In this specification, when a numerical value represents a physical property value, a characteristic value, etc., the description “(numerical value 1) to (numerical value 2)” means “(numerical value 1) or more and (numerical value 2) or less”.
As used herein, the term "(meth)acrylate" means "at least one of acrylate and methacrylate." The same applies to "(meth)acrylic acid", "(meth)acryloyl" and the like.
In the present specification, for each component, one type of substance applicable to each component may be used alone, or two or more types may be used in combination. Here, when two or more substances are used in combination for each component, the content of the component refers to the total content of the substances used in combination unless otherwise specified.
Moreover, the bonding direction of the divalent group described in this specification is not particularly limited.
[硬化性樹脂組成物]
 本発明の硬化性樹脂組成物は、ポリマー(S)を含む。
[Curable resin composition]
The curable resin composition of the present invention contains a polymer (S).
<ポリマー(S)>
 ポリマー(S)は、フッ素原子を含む構成単位(a)及びカチオン重合性基を含む構成単位(b)からなる群より選ばれる少なくとも1つの構成単位と、一般式(Z-1)で表される構成単位(z)とを有する。
 フッ素原子を含む構成単位(a)を、「構成単位(a)」とも呼ぶ。
 カチオン重合性基を含む構成単位(b)を「構成単位(b)」とも呼ぶ。
 一般式(Z-1)で表される構成単位(z)を「構成単位(z)」とも呼ぶ。
<Polymer (S)>
The polymer (S) has at least one structural unit selected from the group consisting of a structural unit (a) containing a fluorine atom and a structural unit (b) containing a cationically polymerizable group, and is represented by general formula (Z-1). and a structural unit (z).
A structural unit (a) containing a fluorine atom is also referred to as a “structural unit (a)”.
A structural unit (b) containing a cationically polymerizable group is also referred to as a “structural unit (b)”.
A structural unit (z) represented by general formula (Z-1) is also referred to as a “structural unit (z)”.
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000011
 一般式(Z-1)中、
 Dは水素原子、メチル基、-CHORZ1又は-CHCOORZ2を表す。RZ1は水素原子又は炭素数1~4のアルキル基を表す。RZ2は水素原子又はメチル基を表す。
 Aは-O-又は-NRZ3-を表す。RZ3は水素原子又は炭素数1~4のアルキル基を表す。
 wは2~5の整数を表す。
 LZ1は脂肪族基及び芳香族基からなる群より選ばれる少なくとも1つを有するw+1価の連結基を表す。上記脂肪族基に含まれる1つ以上の-CH-はそれぞれ独立に-CO-、-O-又は-NRZ4-に置き換わってもよい。RZ4は水素原子又は炭素数1~4のアルキル基を表す。RZ4が複数存在する場合、複数のRZ4は同一でも異なっていてもよい。
 LZ2はアルキレン基、アリーレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す。RZ5は水素原子又は炭素数1~4のアルキル基を表す。RZ5が複数存在する場合、複数のRZ5は同一でも異なっていてもよい。
 Eは下記一般式(Ea-1)又は(Ea-2)で表される基を表す。
In the general formula (Z-1),
D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 . R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. R Z2 represents a hydrogen atom or a methyl group.
A 1 represents -O- or -NR Z3 -. R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
w represents an integer of 2 to 5;
L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group. One or more —CH 2 — contained in the aliphatic group may be independently replaced with —CO—, —O— or —NR Z4 —. R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond. R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000012
 一般式(Ea-1)及び(Ea-2)中、
 RE1及びRE2はそれぞれ独立に水素原子又はメチル基を表す。
 RE3は水素原子又は炭素数1~4のアルキル基を表す。
 *は結合位置を表す。
In general formulas (Ea-1) and (Ea-2),
R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
* represents a binding position.
 ポリマー(S)は、構成単位(z)を有し、かつ構成単位(a)と構成単位(b)のいずれか少なくとも1つを有する。すなわち、ポリマー(S)は、構成単位(a)と構成単位(z)とを有するポリマーであってもよいし、構成単位(b)と構成単位(z)とを有するポリマーであってもよいし、構成単位(a)と構成単位(b)と構成単位(z)とを有するポリマーであってもよい。 The polymer (S) has a structural unit (z) and at least one of a structural unit (a) and a structural unit (b). That is, the polymer (S) may be a polymer having the structural unit (a) and the structural unit (z), or may be a polymer having the structural unit (b) and the structural unit (z). Alternatively, it may be a polymer having a structural unit (a), a structural unit (b) and a structural unit (z).
 ポリマー(S)において、構成単位(a)、構成単位(b)及び構成単位(z)は互いに異なる構成単位であることが好ましい。すなわち、構成単位(a)は、カチオン重合性基を含まないことが好ましい。構成単位(a)は、一般式(Z-1)で表される構成単位ではないことが好ましい。構成単位(b)は、フッ素原子を含まないことが好ましい。構成単位(b)は、一般式(Z-1)で表される構成単位ではないことが好ましい。構成単位(z)は、フッ素原子を含まないことが好ましい。構成単位(z)は、カチオン重合性基を含まないことが好ましい。 In the polymer (S), the structural unit (a), the structural unit (b) and the structural unit (z) are preferably different structural units. That is, the structural unit (a) preferably does not contain a cationically polymerizable group. Structural unit (a) is preferably not a structural unit represented by general formula (Z-1). Structural unit (b) preferably does not contain a fluorine atom. Structural unit (b) is preferably not a structural unit represented by general formula (Z-1). Structural unit (z) preferably does not contain a fluorine atom. The structural unit (z) preferably does not contain a cationic polymerizable group.
 ポリマー(S)は(メタ)アクリロイル基などのラジカル重合性基を2つ以上含む構成単位(z)に加えて、カチオン重合性基を含む構成単位(b)を有する場合、カチオン硬化及びラジカル硬化のダブルネットワークを形成するため高い耐擦傷性が得られると考えられる。また、(メタ)アクリロイル基などのラジカル重合性基を2つ以上含む構成単位(z)に加えて、フッ素原子を含む構成単位(a)を有する場合、フッ素原子の低表面エネルギーの効果により最表面に偏在し、表面ラジカル重合性部位の量を増やすことで架橋密度を上げて耐擦傷性を向上していると考えられる。 When the polymer (S) has a structural unit (b) containing a cationically polymerizable group in addition to the structural unit (z) containing two or more radically polymerizable groups such as (meth)acryloyl groups, cationic curing and radical curing It is considered that high scratch resistance can be obtained due to the formation of a double network of Further, in addition to the structural unit (z) containing two or more radically polymerizable groups such as (meth)acryloyl groups, when the structural unit (a) containing a fluorine atom is present, the effect of the low surface energy of the fluorine atom maximizes It is thought that the crosslink density is increased by increasing the amount of surface radically polymerizable sites that are unevenly distributed on the surface, thereby improving the scratch resistance.
 ポリマー(S)に含まれる全ての構成単位に対する、構成単位(a)の物質量基準の含有量をWaとし、構成単位(b)の物質量基準の含有量をWbとし、構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはないことが好ましい。 With respect to all structural units contained in the polymer (S), let Wa be the content of the structural unit (a) based on the material amount, Wb be the content of the structural unit (b) based on the material amount, and the structural unit (z) When the content of the substance amount standard is Wz, Wa, Wb and Wz respectively satisfy 0 mol% ≤ Wa ≤ 90 mol%, 0 mol% ≤ Wb ≤ 90 mol%, 0 mol% < Wz < 100 mol%, and Wa and It is preferable that both Wb and Wb are not 0 mol %.
 耐擦傷性向上の観点から、ポリマー(S)が、構成単位(a)と構成単位(b)と構成単位(z)とを有することが好ましい。0mol%<Wa≦90mol%、0mol%<Wb≦90mol%、0mol%<Wz<100mol%を満たすことがより好ましい。 From the viewpoint of improving scratch resistance, the polymer (S) preferably has a structural unit (a), a structural unit (b) and a structural unit (z). It is more preferable to satisfy 0 mol%<Wa≦90 mol%, 0 mol%<Wb≦90 mol%, and 0 mol%<Wz<100 mol%.
 耐擦傷性向上の観点から、Wzが、30mol%≦Wz≦95mol%を満たすことが好ましい。 From the viewpoint of improving scratch resistance, Wz preferably satisfies 30 mol% ≤ Wz ≤ 95 mol%.
 ポリマー(S)の主鎖構造は特に限定されないが、(メタ)アクリルポリマー、又は(メタ)アクリルアミドポリマーであることが好ましい。 Although the main chain structure of the polymer (S) is not particularly limited, it is preferably a (meth)acryl polymer or a (meth)acrylamide polymer.
〔フッ素原子を含む構成単位(a)〕
 フッ素原子を含む構成単位(a)について説明する。
[Structural Unit (a) Containing Fluorine Atom]
The structural unit (a) containing a fluorine atom will be explained.
 構成単位(a)に含まれるフッ素原子の数は、3個以上17個以下であることが好ましい。 The number of fluorine atoms contained in the structural unit (a) is preferably 3 or more and 17 or less.
(フッ素原子を含有する基)
 構成単位(a)は、フッ素原子を含有する基を含むことが好ましい。
 フッ素原子を含有する基(「フッ素含有基」とも呼ぶ。)は、少なくとも1つのフッ素原子を含んでなる基であり、例えば、フッ素原子、少なくとも1つのフッ素原子を有する有機基などが挙げられる。上記有機基の炭素数は特に限定されないが、炭素数1~20であることが好ましく、炭素数2~15であることがより好ましく、炭素数4~10であることが更に好ましく、炭素数4~8であることが特に好ましい。上記有機基は直鎖構造であっても分岐構造であっても環状構造であっても良い。上記有機基としては、例えば、アルキル基、シクロアルキル基、アルケニル基、シクロアルケニル基、アルキニル基、シクロアルキニル基、アルコキシ基、アリール基、アリールオキシ基、及びこれらの少なくとも2つを組み合わせてなる基が挙げられ、アルキル基であることが好ましい。また、上記アルキル基、シクロアルキル基、アルケニル基、シクロアルケニル基、アルキニル基、シクロアルキニル基、アルコキシ基、アリール基、アリールオキシ基は、フッ素原子以外に更に置換基を有していてもよい。
 フッ素含有基は、フッ素原子を有する脂肪族炭化水素基であることが好ましい。上記脂肪族炭化水素基は、酸素原子を有していてもよい。フッ素含有基としては、例えば、フッ素原子含有アルキル基、フッ素原子含有アルキル基を構成する-CH-の1個以上が-O-で置換されたもの、フッ素原子含有アルケニル基などが挙げられる。
 ここで、フッ素原子含有アルキル基としては、アルキル基を構成する-CH-の水素原子の一部がフッ素原子に置換されたアルキル基や、アルキル基を構成する一部の炭素原子がフッ素原子を含有する置換基(例えば、-CF)を有するものであってもよいが、アルキル基を構成する-CH-の水素原子が全てフッ素原子に置換されたパーフルオロアルキル基が好ましく、-(CFfaCFがより好ましい。なお、faは、0~12の整数を表す。
 また、フッ素原子含有アルキル基を構成する-CH-の1個以上が-O-で置換されたものとしては、例えば、-(CFfbOC(CF、-CFCFO(CFCFO)fcCFCFCF、-CF(CF)OCFCF(CF)OCFCFCFなどが挙げられる。なお、fbは、1~10の整数を表し、fcは、1~10の整数を表す。
 また、フッ素原子含有アルケニル基としては、例えば、-C(CF)=C(CF(CFなどが挙げられる。
 フッ素原子を有する脂肪族炭化水素基の炭素数は特に限定されず、1~30が好ましく、3~20がより好ましく、3~10がさらに好ましい。
 フッ素原子を有する脂肪族炭化水素基に含まれるフッ素原子の数は特に限定されず、1~30が好ましく、5~25がより好ましく、7~20がさらに好ましい。
 フッ素含有基は、フルオロアルキル基又はフルオロポリエーテル基であることが好ましい。フルオロポリエーテル基とは、複数のフッ化炭素基がエーテル結合で結合された2価の基である。フルオロポリエーテル基は、複数のフルオロアルキレン基がエーテル結合で結合された2価の基であることが好ましく、複数のパーフルオロアルキレン基がエーテル結合で結合された2価の基(パーフルオロポリエーテル基)であることが好ましい。
 フッ素含有基は、炭素数1~20のフルオロアルキル基であることが好ましく、炭素数2~15のフルオロアルキル基であることがより好ましく、炭素数4~10のフルオロアルキル基であることが更に好ましく、炭素数4~8のフルオロアルキル基であることが特に好ましい。
 1つのフッ素含有基に含まれるフッ素原子の数は、3個以上17個以下であることが好ましく、5個以上15個以下であることがより好ましく、9個以上13個以下であることが更に好ましい。
(Group containing a fluorine atom)
Structural unit (a) preferably contains a fluorine atom-containing group.
A group containing a fluorine atom (also referred to as a “fluorine-containing group”) is a group containing at least one fluorine atom, and examples thereof include a fluorine atom and an organic group having at least one fluorine atom. Although the number of carbon atoms in the organic group is not particularly limited, it preferably has 1 to 20 carbon atoms, more preferably 2 to 15 carbon atoms, even more preferably 4 to 10 carbon atoms, and 4 carbon atoms. ~8 is particularly preferred. The organic group may have a linear structure, a branched structure, or a cyclic structure. Examples of the organic group include an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, a cycloalkynyl group, an alkoxy group, an aryl group, an aryloxy group, and a group formed by combining at least two of these groups. and preferably an alkyl group. In addition, the alkyl group, cycloalkyl group, alkenyl group, cycloalkenyl group, alkynyl group, cycloalkynyl group, alkoxy group, aryl group, and aryloxy group may further have a substituent other than the fluorine atom.
The fluorine-containing group is preferably an aliphatic hydrocarbon group having a fluorine atom. The aliphatic hydrocarbon group may have an oxygen atom. Examples of fluorine-containing groups include fluorine-containing alkyl groups, fluorine-containing alkyl groups in which one or more of -CH 2 - constituting the fluorine-containing alkyl group are substituted with -O-, and fluorine-containing alkenyl groups.
Here, the fluorine atom-containing alkyl group includes an alkyl group in which some of the hydrogen atoms of —CH 2 — constituting the alkyl group are substituted with fluorine atoms, and a part of the carbon atoms constituting the alkyl group are fluorine atoms. (e.g., —CF 3 ), but is preferably a perfluoroalkyl group in which all hydrogen atoms of —CH 2 — constituting the alkyl group are substituted with fluorine atoms, and — (CF 2 ) fa CF 3 is more preferred. Note that fa represents an integer from 0 to 12.
Examples of -CH 2 - constituting a fluorine atom-containing alkyl group substituted with -O- for one or more -(CF 2 ) fb OC(CF 3 ) 3 and -CF 2 CF 2 O(CF 2 CF 2 O) fc CF 2 CF 2 CF 3 , —CF(CF 3 )OCF 2 CF(CF 3 )OCF 2 CF 2 CF 3 and the like. Note that fb represents an integer of 1-10, and fc represents an integer of 1-10.
Examples of fluorine atom-containing alkenyl groups include -C(CF 3 )=C(CF(CF 3 ) 2 ) 2 and the like.
The number of carbon atoms in the aliphatic hydrocarbon group having a fluorine atom is not particularly limited, and is preferably 1-30, more preferably 3-20, and even more preferably 3-10.
The number of fluorine atoms contained in the aliphatic hydrocarbon group having fluorine atoms is not particularly limited, and is preferably 1-30, more preferably 5-25, and even more preferably 7-20.
The fluorine-containing group is preferably a fluoroalkyl group or a fluoropolyether group. A fluoropolyether group is a divalent group in which a plurality of fluorocarbon groups are linked by ether bonds. The fluoropolyether group is preferably a divalent group in which multiple fluoroalkylene groups are linked via ether linkages, and a divalent group in which multiple perfluoroalkylene groups are linked via ether linkages (perfluoropolyether group).
The fluorine-containing group is preferably a fluoroalkyl group having 1 to 20 carbon atoms, more preferably a fluoroalkyl group having 2 to 15 carbon atoms, and further preferably a fluoroalkyl group having 4 to 10 carbon atoms. A fluoroalkyl group having 4 to 8 carbon atoms is particularly preferred.
The number of fluorine atoms contained in one fluorine-containing group is preferably 3 or more and 17 or less, more preferably 5 or more and 15 or less, and further preferably 9 or more and 13 or less. preferable.
 フッ素含有基は、下記一般式(f-1)で表される基であることが好ましい。すなわち、構成単位(a)は、下記一般式(f-1)で表される基を有することが好ましい。 The fluorine-containing group is preferably a group represented by general formula (f-1) below. That is, the structural unit (a) preferably has a group represented by general formula (f-1) below.
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000013
 一般式(f-1)中、q1は0~12の整数を表し、q2は1~8の整数を表し、Rqは水素原子又はフッ素原子を表す。*は結合位置を表す。
 q1は1~7の整数を表すことが好ましく、1~5の整数を表すことがより好ましく、1又は2を表すことが更に好ましい。
 q2は2~8の整数を表すことが好ましく、4~8の整数を表すことがより好ましく、4~6の整数を表すことが更に好ましい。
 Rqはフッ素原子を表すことが好ましい。
In general formula (f-1), q1 represents an integer of 0 to 12, q2 represents an integer of 1 to 8, and Rq1 represents a hydrogen atom or a fluorine atom. * represents a binding position.
q1 preferably represents an integer of 1 to 7, more preferably an integer of 1 to 5, even more preferably 1 or 2.
q2 preferably represents an integer of 2 to 8, more preferably an integer of 4 to 8, even more preferably an integer of 4 to 6.
Rq 1 preferably represents a fluorine atom.
 構成単位(a)は、下記一般式(1)で表される基を含んでもよい。 The structural unit (a) may contain a group represented by the following general formula (1).
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000014
 一般式(1)中、
 X及びXは各々独立に酸素原子又は硫黄原子を表す。
 R及びRは各々独立に水素原子又は置換基を表し、R及びRのうち少なくとも一方は置換基を表す。RとRとは結合して環を形成しても良い。R及びRの少なくとも一方は構成単位(a)の一般式(1)で表される基以外の部分と結合して環を形成しても良い。
 m及びnは各々独立に0又は1を表す。ただし、R又はRが水素原子を表す場合、nは1を表す。
 *1及び*2は結合位置を表す。
In general formula (1),
X 1 and X 2 each independently represent an oxygen atom or a sulfur atom.
R 1 and R 2 each independently represent a hydrogen atom or a substituent, and at least one of R 1 and R 2 represents a substituent. R 1 and R 2 may combine to form a ring. At least one of R 1 and R 2 may be combined with a portion other than the group represented by general formula (1) of the structural unit (a) to form a ring.
m and n each independently represent 0 or 1; However, n represents 1 when R 1 or R 2 represents a hydrogen atom.
*1 and *2 represent binding positions.
 一般式(1)で表される基は酸開裂性基であってもよい。酸開裂性基は、酸の作用により開裂する基であり、典型的には酸の作用により開裂して極性基(例えば、ヒドロキシ基、カルボキシ基、ケトン基等)を生じる基である。 The group represented by general formula (1) may be an acid-cleavable group. An acid-cleavable group is a group that is cleaved by the action of an acid, typically a group that is cleaved by the action of an acid to produce a polar group (eg, a hydroxy group, a carboxyl group, a ketone group, etc.).
 一般式(1)中、X及びXは各々独立に酸素原子又は硫黄原子を表し、酸素原子を表すことが好ましい。 In general formula (1), X 1 and X 2 each independently represent an oxygen atom or a sulfur atom, preferably an oxygen atom.
 一般式(1)中、R及びRは各々独立に水素原子又は置換基を表す。R及びRが置換基を表す場合の置換基の種類は特に限定されず、公知のいずれの置換基であっても良い。置換基としては、例えば、アルキル基、シクロアルキル基、アルケニル基、シクロアルケニル基、アルキニル基、シクロアルキニル基、アリール基、ヘテロ環基、アミノ基、アルコキシ基、アリールオキシ基、ヘテロ環オキシ基、アシル基、アルコキシカルボニル基、アリールオキシカルボニル基、アシルオキシ基、アシルアミノ基、アルコキシカルボニルアミノ基、アリールオキシカルボニルアミノ基、スルホニルアミノ基、スルファモイル基、カルバモイル基、アルキルチオ基、アリールチオ基、ヘテロ環チオ基、リン酸アミド基、ヒドロキシ基、メルカプト基、ハロゲン原子、シアノ基、スルホ基、カルボキシ基、ニトロ基、シリル基が挙げられる。また、これらの置換基が更に1個以上の置換基を有することができる場合は、更なる置換基として上記した置換基などを有していても良い。
 R及びRが置換基を表す場合の置換基は、有機基であることが好ましく、上記有機基は直鎖構造であっても分岐構造であっても環状構造であっても良い。上記有機基は、アルキル基、シクロアルキル基、アルケニル基、シクロアルケニル基、アルキニル基、シクロアルキニル基、アリール基、アルコキシ基、及びこれらの少なくとも2つを組み合わせてなる基がより好ましく、アルキル基、シクロアルキル基、アリール基又はアルコキシ基であることが更に好ましい。上記有機基の炭素数は特に限定されないが、1~20であることが好ましく、1~10であることがより好ましい。上記有機基は更に置換基を有していても良い。
 ただし、R及びRのうち少なくとも一方は置換基を表す。すなわち、R及びRが両方とも水素原子を表す場合はない。
In general formula (1), R 1 and R 2 each independently represent a hydrogen atom or a substituent. When R 1 and R 2 represent a substituent, the type of substituent is not particularly limited, and any known substituent may be used. Examples of substituents include alkyl groups, cycloalkyl groups, alkenyl groups, cycloalkenyl groups, alkynyl groups, cycloalkynyl groups, aryl groups, heterocyclic groups, amino groups, alkoxy groups, aryloxy groups, heterocyclicoxy groups, acyl group, alkoxycarbonyl group, aryloxycarbonyl group, acyloxy group, acylamino group, alkoxycarbonylamino group, aryloxycarbonylamino group, sulfonylamino group, sulfamoyl group, carbamoyl group, alkylthio group, arylthio group, heterocyclicthio group, Phosphate amide group, hydroxy group, mercapto group, halogen atom, cyano group, sulfo group, carboxy group, nitro group and silyl group. Moreover, when these substituents can further have one or more substituents, they may have the above-described substituents as further substituents.
When R 1 and R 2 represent a substituent, the substituent is preferably an organic group, and the organic group may have a linear structure, a branched structure, or a cyclic structure. The above organic group is more preferably an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, a cycloalkynyl group, an aryl group, an alkoxy group, or a group formed by combining at least two of these. A cycloalkyl group, an aryl group or an alkoxy group is more preferred. Although the number of carbon atoms in the organic group is not particularly limited, it is preferably 1-20, more preferably 1-10. The organic group may further have a substituent.
However, at least one of R 1 and R 2 represents a substituent. That is, it is not the case that both R 1 and R 2 represent hydrogen atoms.
 RとRとは結合して環を形成しても良く、上記環は炭素数3~20の脂肪族炭化水素環であることが好ましく、炭素数4~12の脂肪族炭化水素環であることがより好ましい。上記脂肪族炭化水素環は置換基を有していても良い。また上記脂肪族炭化水素環は、環員の炭素-炭素結合間に、-O-、-CO-、-COO-、-OCO-、-S-、-SO-、-NR-又はこれらを2つ以上組み合わせてなる連結基を有していても良い。上記Rは水素原子又は置換基を表す。 R 1 and R 2 may combine to form a ring, and the ring is preferably an aliphatic hydrocarbon ring having 3 to 20 carbon atoms, more preferably an aliphatic hydrocarbon ring having 4 to 12 carbon atoms. It is more preferable to have The aliphatic hydrocarbon ring may have a substituent. The above aliphatic hydrocarbon ring has —O—, —CO—, —COO—, —OCO—, —S—, —SO 2 —, —NR—, or these between the carbon-carbon bonds of the ring members. You may have the linking group which combines two or more. R above represents a hydrogen atom or a substituent.
 mは0又は1を表し、0を表すことが好ましい。
 nは0又は1を表し、1を表すことが好ましい。
m represents 0 or 1, preferably 0;
n represents 0 or 1, preferably 1;
 一般式(1)中、*1及び*2は結合位置を表す。*1及び*2には、構成単位(a)の一般式(1)で表される基以外の部分構造(水素原子などの1つの原子、又はフッ素含有基やポリマー(S)の主鎖などの複数の原子からなる原子団)が結合する。 In general formula (1), *1 and *2 represent binding positions. *1 and *2 include a partial structure other than the group represented by the general formula (1) of the structural unit (a) (one atom such as a hydrogen atom, a fluorine-containing group, the main chain of the polymer (S), etc. Atomic groups consisting of multiple atoms of ) bond.
 構成単位(a)がフッ素含有基と酸開裂性基とを含む場合、構成単位(a)の具体的な態様としては以下の態様が挙げられる。
 1) 一般式(1)中の*2に直接又は連結基を介してフッ素含有基が結合する態様
 2) 一般式(1)中のR及びRのうち少なくとも一方にフッ素含有基が結合する態様
 3) 一般式(1)中の*1に直接又は連結基を介してフッ素含有基が結合する態様
When the structural unit (a) contains a fluorine-containing group and an acid-cleavable group, specific embodiments of the structural unit (a) include the following embodiments.
1) A mode in which a fluorine-containing group is bonded to *2 in general formula (1) directly or via a linking group. 2) A fluorine-containing group is bonded to at least one of R 1 and R 2 in general formula (1). 3) A mode in which a fluorine-containing group is bonded directly or via a linking group to *1 in the general formula (1)
 上記1)、3)における連結基としては、-O-、-CO-、-COO-、-OCO-、-S-、-SO-、-NR-又はこれらを2つ以上組み合わせてなる連結基が挙げられ、-O-又は-S-が好ましい。上記Rは水素原子又は置換基を表す。上記Rが置換基を表す場合の置換基としては、例えば、アルキル基、アリール基等が挙げられる。
 アルキル基としては、例えば、炭素数1~18の直鎖状、炭素数3~18の分岐鎖状または環状のアルキル基が好ましく、炭素数1~4の直鎖状アルキル基がより好ましく、メチル基またはエチル基が更に好ましい。
 アリール基としては、例えば、炭素数6~12のアリール基が挙げられ、例えば、フェニル基、α-メチルフェニル基、および、ナフチル基が挙げられ、フェニル基が好ましい。
The linking group in 1) and 3) above may be -O-, -CO-, -COO-, -OCO-, -S-, -SO 2 -, -NR-, or a combination of two or more thereof. groups, with —O— or —S— being preferred. R above represents a hydrogen atom or a substituent. Examples of the substituent when R represents a substituent include an alkyl group and an aryl group.
As the alkyl group, for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
The aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an α-methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
 構成単位(a)は、アセタール構造、チオアセタール構造又はジチオアセタール構造を有してもよい。
 アセタール構造は下記一般式(AC1)又は(AC2)で表される構造であることが好ましい。
 チオアセタール構造は下記一般式(SA1)、(SA2)又は(SA3)で表される構造であることが好ましい。
 ジチオアセタール構造は下記一般式(DS1)又は(DS2)で表される構造であることが好ましい。
Structural unit (a) may have an acetal structure, a thioacetal structure or a dithioacetal structure.
The acetal structure is preferably a structure represented by the following general formula (AC1) or (AC2).
The thioacetal structure is preferably a structure represented by the following general formula (SA1), (SA2) or (SA3).
The dithioacetal structure is preferably a structure represented by the following general formula (DS1) or (DS2).
Figure JPOXMLDOC01-appb-C000015
Figure JPOXMLDOC01-appb-C000015
 一般式(AC1)、(SA1)及び(DS1)中、R及びRは各々独立に水素原子又は置換基を表し、R及びRのうち少なくとも一方は置換基を表す。RとRとは結合して環を形成しても良い。R及びRの少なくとも一方は構成単位(a)の一般式(AC1)、(SA1)又は(DS1)で表される構造以外の部分と結合して環を形成しても良い。
 一般式(AC2)、(SA2)、(SA3)及び(DS2)中、Rは置換基を表し、kは0~3の整数を表す。kが2又は3を表す場合、複数のRは同じでも異なっていても良い。
 一般式(AC1)、(AC2)、(SA1)、(SA2)、(SA3)、(DS1)及び(DS2)中、*は結合位置を表す。
In general formulas (AC1), (SA1) and (DS1), R 1 and R 2 each independently represent a hydrogen atom or a substituent, and at least one of R 1 and R 2 represents a substituent. R 1 and R 2 may combine to form a ring. At least one of R 1 and R 2 may combine with a portion other than the structure represented by general formula (AC1), (SA1) or (DS1) of structural unit (a) to form a ring.
In general formulas (AC2), (SA2), (SA3) and (DS2), R 3 represents a substituent and k represents an integer of 0-3. When k represents 2 or 3, multiple R 3 may be the same or different.
In general formulas (AC1), (AC2), (SA1), (SA2), (SA3), (DS1) and (DS2), * represents a binding position.
 一般式(AC1)、(SA1)及び(DS1)中、R及びRは各々一般式(1)中におけるものと同じ意味を表し、具体例及び好ましい範囲も同じである。
 一般式(AC2)、(SA2)、(SA3)及び(DS2)中、Rは置換基を表し、具体例及び好ましい範囲は、一般式(1)中のR及びRが置換基を表す場合の置換基として挙げたものと同様である。
 kは0又は1を表すことが好ましい。
In general formulas (AC1), (SA1) and (DS1), R 1 and R 2 each have the same meaning as in general formula (1), and specific examples and preferred ranges are also the same.
In general formulas (AC2), (SA2), (SA3) and (DS2), R 3 represents a substituent, specific examples and preferred ranges are R 1 and R 2 in general formula (1) It is the same as the one mentioned as a substituent in the case of representing.
Preferably, k represents 0 or 1.
 ポリマー(S)が(メタ)アクリルポリマー、(メタ)アクリルアミドポリマー等の(メタ)アクリロイル基を有するモノマーのラジカル重合によって合成されるポリマーである場合、構成単位(a)は下記一般式(A-1)~(A-5)のいずれかで表される構成単位であってもよい。 When the polymer (S) is a polymer synthesized by radical polymerization of a monomer having a (meth)acryloyl group such as a (meth)acrylic polymer or a (meth)acrylamide polymer, the structural unit (a) has the following general formula (A- It may be a structural unit represented by any one of 1) to (A-5).
Figure JPOXMLDOC01-appb-C000016
Figure JPOXMLDOC01-appb-C000016
 上記一般式中、Raは水素原子又はメチル基を表す。Aは-O-又は-NH-を表す。Lは単結合又は2価の連結基を表す。Qはフッ素原子を含有する基を表す。Lは単結合又は2価の連結基を表す。X、X、m、n、R及びRは各々一般式(1)中におけるものと同じ意味を表す。R及びkは各々一般式(AC2)中におけるものと同じ意味を表す。 In the general formula above, Ra 1 represents a hydrogen atom or a methyl group. A represents -O- or -NH-. L1 represents a single bond or a divalent linking group. Q1 represents a group containing a fluorine atom. L2 represents a single bond or a divalent linking group. X 1 , X 2 , m, n, R 1 and R 2 each have the same meaning as in formula (1). R 3 and k each have the same meaning as in general formula (AC2).
 一般式(A-1)~(A-4)中、Aは-O-又は-NH-を表し、-O-を表すことが好ましい。 In general formulas (A-1) to (A-4), A represents -O- or -NH-, preferably -O-.
 一般式(A-1)~(A-4)中、Lは単結合又は2価の連結基を表す。Lが2価の連結基を表す場合、-O-、-CO-、-COO-、-S-、-SO-、-NR-、炭素数1~20の有機連結基(例えば、置換基を有してもよいアルキレン基、置換基を有してもよいシクロアルキレン基、置換基を有してもよいアリーレン基など)、又はこれらを2つ以上組み合わせてなる連結基などが挙げられる。上記Rは水素原子又は置換基を表す。上記Rが置換基を表す場合の置換基としては、例えば、アルキル基、アリール基等が挙げられる。
 アルキル基としては、例えば、炭素数1~18の直鎖状、炭素数3~18の分岐鎖状または環状のアルキル基が好ましく、炭素数1~4の直鎖状アルキル基がより好ましく、メチル基またはエチル基が更に好ましい。
 アリール基としては、例えば、炭素数6~12のアリール基が挙げられ、例えば、フェニル基、α-メチルフェニル基、および、ナフチル基が挙げられ、フェニル基が好ましい。
 Lは単結合、又は、炭素数1~10のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることが好ましく、単結合、又は、炭素数1~6のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることがより好ましい。
In general formulas (A-1) to (A-4), L 1 represents a single bond or a divalent linking group. When L 1 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these. . R above represents a hydrogen atom or a substituent. Examples of the substituent when R represents a substituent include an alkyl group and an aryl group.
As the alkyl group, for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
The aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an α-methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
L 1 is preferably a single bond, an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group consisting of a combination of two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
 一般式(A-1)~(A-5)中、Qはフッ素原子を含有する基を表す。フッ素原子を含有する基については前述したものと同様である。 In general formulas (A-1) to (A-5), Q1 represents a fluorine atom-containing group. The groups containing fluorine atoms are the same as those described above.
 一般式(A-1)~(A-5)中、Lは単結合又は2価の連結基を表す。Lが2価の連結基を表す場合の具体例及び好ましい範囲は上記Lが2価の連結基を表す場合と同じである。 In general formulas (A-1) to (A-5), L2 represents a single bond or a divalent linking group. Specific examples and preferred ranges when L 2 represents a divalent linking group are the same as in the case where L 1 represents a divalent linking group.
 上記一般式(A-1)~(A-5)におけるX、X、m、n、R及びRは各々一般式(1)中におけるものと同じ意味を表し、具体例及び好ましい範囲も同じである。また、R及びkは各々一般式(AC2)中におけるものと同じ意味を表し、具体例及び好ましい範囲も同じである。 X 1 , X 2 , m, n, R 1 and R 2 in general formulas (A-1) to (A-5) above each have the same meaning as in general formula (1), and specific examples and preferred The range is also the same. R 3 and k each have the same meaning as in formula (AC2), and specific examples and preferred ranges are also the same.
 本発明の硬化性樹脂組成物を硬化してなる硬化層の耐擦傷性を更に向上させることができるという理由から、構成単位(a)は、下記一般式(B1)で表される基を有することが好ましい。 Since the scratch resistance of the cured layer obtained by curing the curable resin composition of the present invention can be further improved, the structural unit (a) has a group represented by the following general formula (B1). is preferred.
Figure JPOXMLDOC01-appb-C000017
Figure JPOXMLDOC01-appb-C000017
 一般式(B1)中、
 nは1以上の整数を表す。複数のnは同一であっても異なっていてもよい。
 Rb1は水素原子又は置換基を表す。
 Rb2は水素原子又は置換基を表す。複数のRb2は同一であっても異なっていてもよい。
 Lb1は、n+1価の連結基を表す。複数のLb1は同一であっても異なっていてもよい。
 Zb1は、フッ素原子を含有する基を表す。複数のZは同一であっても異なっていてもよい。
 *は、結合位置を表す。
In general formula (B1),
n represents an integer of 1 or more. A plurality of n may be the same or different.
R b1 represents a hydrogen atom or a substituent.
R b2 represents a hydrogen atom or a substituent. A plurality of R b2 may be the same or different.
L b1 represents an n+1-valent linking group. A plurality of L b1 may be the same or different.
Z b1 represents a group containing a fluorine atom. Plural Z's may be the same or different.
* represents a binding position.
 上記一般式(B1)中、Rb1は、水素原子又は置換基を表し、置換基を表すことが好ましい。
 Rb1の一態様が表す置換基の種類は特に限定されず、公知の置換基が挙げられる。
 置換基としては、例えば、酸素原子を有していてもよい1価の脂肪族炭化水素基、および、酸素原子を有していてもよい1価の芳香族炭化水素基が挙げられ、より具体的には、アルキル基、アルケニル基、アルキニル基、アリール基、アルコキシ基、アリールオキシ基、アシル基、アシルオキシ基および、これらを組み合わせた基が挙げられる。なお、上記置換基は、さらに置換基で置換されていてもよい。
 なかでも、Rb1の一態様が表す置換基としては、炭素数1~18の脂肪族炭化水素基が好ましく、炭素数1~12のアルキル基であることがより好ましく、炭素数1~8の直鎖状アルキル基または炭素数3~8の分岐状アルキル基であることが更に好ましく、メチル基であることが特に好ましい。
In general formula (B1) above, R b1 represents a hydrogen atom or a substituent, preferably a substituent.
The type of substituent represented by one embodiment of R b1 is not particularly limited, and examples thereof include known substituents.
Examples of substituents include monovalent aliphatic hydrocarbon groups which may have an oxygen atom, and monovalent aromatic hydrocarbon groups which may have an oxygen atom. Specific examples include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, alkoxy groups, aryloxy groups, acyl groups, acyloxy groups, and combinations thereof. In addition, the said substituent may be further substituted by the substituent.
Among them, as the substituent represented by one embodiment of R b1 , an aliphatic hydrocarbon group having 1 to 18 carbon atoms is preferable, an alkyl group having 1 to 12 carbon atoms is more preferable, and an alkyl group having 1 to 8 carbon atoms is preferable. A linear alkyl group or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is particularly preferable.
 上記一般式(B1)中、Rb2は、水素原子又は置換基を表す。ただし、複数のRb2は、それぞれ同一であっても異なっていてもよい。
 Rb2の一態様が表す置換基の種類は特に限定されず、公知の置換基が挙げられ、上記一般式(B1)中のRb1の一態様が表す置換基で例示した基が挙げられる。なかでも、炭素数1~12のアルキル基が好ましく、炭素数1~8の直鎖状アルキル基または炭素数3~8の分岐状アルキル基であることがより好ましく、メチル基であることが更に好ましい。
 Rb2は、水素原子を表すことが好ましい。
In general formula (B1) above, R b2 represents a hydrogen atom or a substituent. However, a plurality of R b2 may be the same or different.
The type of substituent represented by one aspect of R b2 is not particularly limited, and examples include known substituents, and examples include the groups exemplified as the substituent represented by one aspect of R b1 in the general formula (B1). Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable. preferable.
R b2 preferably represents a hydrogen atom.
 上記一般式(B1)中、Lb1は、n+1価の連結基を表す。ただし、複数のLb1は、それぞれ同一であっても異なっていてもよい。
 n+1価の連結基としては、置換基を有していてもよい炭素数1~24のn+1価の炭化水素基であって、炭化水素基を構成する炭素原子の一部がヘテロ原子で置換されていてもよい炭化水素基が好ましく、炭素数1~10の酸素原子または窒素原子を含んでいてもよい脂肪族炭化水素基がより好ましい。
In general formula (B1) above, L b1 represents an n+1-valent linking group. However, a plurality of L b1 may be the same or different.
The n+1-valent linking group is an optionally substituted n+1-valent hydrocarbon group having 1 to 24 carbon atoms, wherein some of the carbon atoms constituting the hydrocarbon group are substituted with heteroatoms. is preferably a hydrocarbon group which may contain a carbon atom, more preferably an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain an oxygen atom or a nitrogen atom.
 n+1価の連結基に含まれる炭素数は特に限定されず、1~24が好ましく、1~10がより好ましい。 The number of carbon atoms contained in the n+1-valent linking group is not particularly limited, and is preferably 1-24, more preferably 1-10.
 n+1価の連結基としては、2~4価の連結基が好ましく、2~3価の連結基がより好ましく、2価の連結基が更に好ましい。
 2価の連結基としては、例えば、置換基を有していてもよい2価の炭化水素基、2価の複素環基、-O-、-S-、-N(Q)-、-CO-、または、これらを組み合わせた基が挙げられる。Qは、水素原子または置換基を表す。
 2価の炭化水素基としては、例えば、炭素数1~10(好ましくは、1~5)のアルキレン基、炭素数1~10のアルケニレン基、および、炭素数1~10のアルキニレン基などの2価の脂肪族炭化水素基;アリーレン基などの2価の芳香族炭化水素基;が挙げられる。
 2価の複素環基としては、例えば、2価の芳香族複素環基が挙げられ、具体的には、ピリジレン基(ピリジン-ジイル基)、ピリダジン-ジイル基、イミダゾール-ジイル基、チエニレン(チオフェン-ジイル基)、キノリレン基(キノリン-ジイル基)などが挙げられる。
 また、これらを組み合わせた基としては、上述した、2価の炭化水素基、2価の複素環基、-O-、-S-、-N(Q)-、および、-CO-からなる群から選択される2種以上を組み合わせた基が挙げられ、例えば、-O-2価の炭化水素基-、-(O-2価の炭化水素基)-O-(pは、1以上の整数を表す)、および、-2価の炭化水素基-O-CO-などが挙げられる。
 これらの2価の連結基のうち、炭素数1~10の直鎖状のアルキレン基、炭素数3~10の分岐鎖状のアルキレン基、炭素数3~10の環状のアルキレン基、炭素数6~12のアリーレン基、および、-O-からなる群から選択される少なくとも2以上の基を組み合わせた2価の連結基であることが好ましい。
 Lb1はアルキレン基であることが特に好ましい。
The n+1-valent linking group is preferably a divalent to tetravalent linking group, more preferably a divalent to trivalent linking group, and still more preferably a divalent linking group.
As the divalent linking group, for example, a divalent hydrocarbon group optionally having a substituent, a divalent heterocyclic group, -O-, -S-, -N(Q)-, -CO -, or groups in which these are combined. Q represents a hydrogen atom or a substituent.
The divalent hydrocarbon group includes, for example, an alkylene group having 1 to 10 carbon atoms (preferably 1 to 5), an alkenylene group having 1 to 10 carbon atoms, and an alkynylene group having 1 to 10 carbon atoms. valent aliphatic hydrocarbon groups; divalent aromatic hydrocarbon groups such as arylene groups;
Examples of divalent heterocyclic groups include divalent aromatic heterocyclic groups, and specific examples thereof include pyridylene group (pyridine-diyl group), pyridazine-diyl group, imidazole-diyl group, thienylene (thiophene -diyl group), quinolylene group (quinoline-diyl group), and the like.
Further, as a group in which these are combined, the group consisting of the above-mentioned divalent hydrocarbon group, divalent heterocyclic group, -O-, -S-, -N(Q)-, and -CO- Groups in which two or more selected from are combined include, for example, —O-divalent hydrocarbon group —, —(O-divalent hydrocarbon group) p —O— (p is 1 or more represents an integer), and -divalent hydrocarbon group -O-CO-.
Among these divalent linking groups, linear alkylene groups having 1 to 10 carbon atoms, branched alkylene groups having 3 to 10 carbon atoms, cyclic alkylene groups having 3 to 10 carbon atoms, and 6 carbon atoms. A divalent linking group is preferably a combination of 12 arylene groups and at least two groups selected from the group consisting of -O-.
L b1 is particularly preferably an alkylene group.
 2価の炭化水素基および2価の複素環基が有していてもよい置換基、ならびに、Qで表される置換基としては、例えば、ハロゲン原子、アルキル基、アルコキシ基、アリール基、アリールオキシ基、シアノ基、カルボキシ基、アルコキシカルボニル基、および、ヒドロキシ基が挙げられる。
 ハロゲン原子としては、例えば、フッ素原子、塩素原子、臭素原子、および、ヨウ素原子が挙げられ、フッ素原子、または、塩素原子が好ましい。
 アルキル基としては、例えば、炭素数1~18の直鎖状、炭素数3~18の分岐鎖状または環状のアルキル基が好ましく、炭素数1~4の直鎖状アルキル基がより好ましく、メチル基またはエチル基が更に好ましい。
 アルコキシ基としては、例えば、炭素数1~18のアルコキシ基が好ましく、炭素数1~4のアルコキシ基がより好ましく、メトキシ基またはエトキシ基が更に好ましい。
 アリール基としては、例えば、炭素数6~12のアリール基が挙げられ、例えば、フェニル基、α-メチルフェニル基、および、ナフチル基が挙げられ、フェニル基が好ましい。
 アリールオキシ基は、芳香族複素環オキシ基であってもよく、例えば、フェノキシ基、ナフトキシ基、イミダゾイルオキシ基、ベンゾイミダゾイルオキシ基、ピリジン-4-イルオキシ基、ピリミジニルオキシ基、キナゾリニルオキシ基、プリニルオキシ基、および、チオフェン-3-イルオキシ基が挙げられる。
 アルコキシカルボニル基としては、例えば、メトキシカルボニル基、および、エトキシカルボニル基が挙げられる。
Examples of the substituents that the divalent hydrocarbon group and the divalent heterocyclic group may have and the substituents represented by Q include a halogen atom, an alkyl group, an alkoxy group, an aryl group, and an aryl Examples include oxy, cyano, carboxy, alkoxycarbonyl, and hydroxy groups.
Halogen atoms include, for example, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a fluorine atom or a chlorine atom.
As the alkyl group, for example, a linear alkyl group having 1 to 18 carbon atoms, a branched or cyclic alkyl group having 3 to 18 carbon atoms is preferable, a linear alkyl group having 1 to 4 carbon atoms is more preferable, methyl groups or ethyl groups are more preferred.
As the alkoxy group, for example, an alkoxy group having 1 to 18 carbon atoms is preferable, an alkoxy group having 1 to 4 carbon atoms is more preferable, and a methoxy group or an ethoxy group is even more preferable.
The aryl group includes, for example, an aryl group having 6 to 12 carbon atoms, such as a phenyl group, an α-methylphenyl group, and a naphthyl group, with a phenyl group being preferred.
The aryloxy group may be an aromatic heterocyclic oxy group such as phenoxy group, naphthoxy group, imidazoyloxy group, benzimidazolyloxy group, pyridin-4-yloxy group, pyrimidinyloxy group, quinazolinyl oxy, purinyloxy, and thiophen-3-yloxy groups.
Alkoxycarbonyl groups include, for example, methoxycarbonyl and ethoxycarbonyl groups.
 上記一般式(B1)中、Zb1は、フッ素原子を含有する基を表す。ただし、複数のZb1は、それぞれ同一であっても異なっていてもよい。フッ素原子を含有する基については前述したものと同様である。 In general formula (B1) above, Z b1 represents a group containing a fluorine atom. However, a plurality of Z b1 may be the same or different. The groups containing fluorine atoms are the same as those described above.
 構成単位(a)は、下記一般式(10)で表される構成単位であることが好ましい。 The structural unit (a) is preferably a structural unit represented by the following general formula (10).
Figure JPOXMLDOC01-appb-C000018
Figure JPOXMLDOC01-appb-C000018
 上記一般式(10)中、
 rは1以上の整数を表す。
 RB1は水素原子または置換基を表す。
 Yは-O-、または、-NR-を表す。Rは水素原子または置換基を表す。
 LB1はr+1価の連結基を表す。
 B1は、上記一般式(B1)で表される基を表す。ただし、上記一般式(B1)中の*が、LB1との結合位置を表し、rが2以上の整数である場合、複数のB1は、それぞれ同一であっても異なっていてもよい。
In the above general formula (10),
r represents an integer of 1 or more.
R B1 represents a hydrogen atom or a substituent.
Y 1 represents -O- or -NR Z -. R Z represents a hydrogen atom or a substituent.
L B1 represents an r+1-valent linking group.
B1 represents a group represented by the general formula (B1). However, when * in the above general formula (B1) represents the bonding position with L B1 and r is an integer of 2 or more, the plurality of B1 may be the same or different.
 上記一般式(10)中、RB1は、水素原子または置換基を表す。
 RB1の一態様が表す置換基の種類は特に限定されず、公知の置換基が挙げられ、上記一般式(B1)中のRb1の一態様が表す置換基で例示した基が挙げられる。なかでも、炭素数1~12のアルキル基が好ましく、炭素数1~8の直鎖状アルキル基または炭素数3~8の分岐状アルキル基であることがより好ましく、メチル基であることが更に好ましい。
 RB1としては、水素原子またはメチル基を表すことが好ましい。
In general formula (10) above, R B1 represents a hydrogen atom or a substituent.
The type of the substituent represented by one aspect of R B1 is not particularly limited, and examples include known substituents, and examples include the groups exemplified as the substituent represented by one aspect of R b1 in the general formula (B1). Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable. preferable.
R B1 preferably represents a hydrogen atom or a methyl group.
 上記一般式(10)中、Yは、-O-、または、-NR-を表す。ただし、Rは、水素原子または置換基を表す。
 ここで、Rの一態様が表す置換基の種類は特に限定されず、公知の置換基が挙げられ、上記一般式(B1)中のRb1の一態様が表す置換基で例示した基が挙げられる。なかでも、炭素数1~12のアルキル基が好ましく、炭素数1~8の直鎖状アルキル基または炭素数3~8の分岐状アルキル基であることがより好ましく、メチル基であることが更に好ましい。
 Yとしては、-O-、または、-NH-を表すことが好ましく、-O-を表すことがより好ましい。
In general formula (10) above, Y 1 represents —O— or —NR Z —. However, R Z represents a hydrogen atom or a substituent.
Here, the type of the substituent represented by one aspect of R Z is not particularly limited, and includes known substituents. mentioned. Among them, an alkyl group having 1 to 12 carbon atoms is preferable, a linear alkyl group having 1 to 8 carbon atoms or a branched alkyl group having 3 to 8 carbon atoms is more preferable, and a methyl group is further preferable. preferable.
Y 1 preferably represents -O- or -NH-, more preferably -O-.
 上記一般式(10)中、LB1は、r+1価の連結基を表す。
 r+1価の連結基としては、置換基を有していてもよい炭素数1~24のr+1価の炭化水素基であって、炭化水素基を構成する炭素原子の一部がヘテロ原子で置換されていてもよい炭化水素基が好ましく、炭素数1~10の酸素原子または窒素原子を含んでいてもよい脂肪族炭化水素基がより好ましい。
In general formula (10) above, L B1 represents an r+1-valent linking group.
The r+1-valent linking group is an optionally substituted r+1-valent hydrocarbon group having 1 to 24 carbon atoms, in which part of the carbon atoms constituting the hydrocarbon group is substituted with a hetero atom. is preferably a hydrocarbon group which may contain a carbon atom, more preferably an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may contain an oxygen atom or a nitrogen atom.
 r+1価の連結基に含まれる炭素数は特に限定されず、1~24が好ましく、1~10がより好ましい。 The number of carbon atoms contained in the r+1-valent linking group is not particularly limited, and is preferably 1-24, more preferably 1-10.
 r+1価の連結基としては、2~3価の連結基が好ましく、2価の連結基がより好ましい。
 2価の連結基としては、例えば、上記一般式(B1)中のLb1の一態様が表す2価の連結基で例示したものと同様のものが挙げられる。
As the r+1-valent linking group, a divalent to trivalent linking group is preferable, and a divalent linking group is more preferable.
Examples of the divalent linking group include the same as those exemplified as the divalent linking group represented by one embodiment of L b1 in the general formula (B1).
 上記一般式(10)中、rは、1以上の整数を表す。なかでも、合成適性の観点から、1~3の整数が好ましく、1~2の整数がより好ましく、1が更に好ましい。 In the above general formula (10), r represents an integer of 1 or more. Among them, from the viewpoint of synthesis suitability, an integer of 1 to 3 is preferable, an integer of 1 to 2 is more preferable, and 1 is even more preferable.
 構成単位(a)は、パーフルオロポリエーテル基を有していても良い。
 パーフルオロポリエーテル基は、パーフルオロアルキル基がエーテル結合を有している場合を指し、1価でも2価以上の基であってもよい。パーフルオロポリエーテル基は、直鎖状でも分岐状でも環状でもよい。パーフルオロポリエーテル基に含まれる炭素原子数は1~200が好ましく、2~150がより好ましく、3~100が更に好ましい。
Structural unit (a) may have a perfluoropolyether group.
A perfluoropolyether group refers to a perfluoroalkyl group having an ether bond, and may be a monovalent group or a divalent or higher group. Perfluoropolyether groups may be linear, branched or cyclic. The number of carbon atoms contained in the perfluoropolyether group is preferably 1-200, more preferably 2-150, even more preferably 3-100.
 パーフルオロポリエーテル基としては、例えば、-(CFO)pf-(CFCFO)qf-、-[CF(CF)CFO]pf―[CF(CF)]qf-、-(CFCFCFO)pf-、-(CFCFO)pf-などが挙げられる。
 上記pf及びqfはそれぞれ独立に0~20の整数を表す。ただしpf+qfは1以上の整数である。
 pf及びqfの総計は1~100が好ましく、1~75がより好ましく、3~50がさらに好ましい。
Examples of perfluoropolyether groups include -(CF 2 O) pf -(CF 2 CF 2 O) qf -, -[CF(CF 3 )CF 2 O] pf -[CF(CF 3 )] qf - , -(CF 2 CF 2 CF 2 O) pf -, -(CF 2 CF 2 O) pf - and the like.
The above pf and qf each independently represent an integer of 0-20. However, pf+qf is an integer of 1 or more.
The sum of pf and qf is preferably 1-100, more preferably 1-75, even more preferably 3-50.
 構成単位(a)の具体例を以下に示すが、これらに限定されるものではない。下記s及びtは各々独立に0~10の整数を表す。nは0~10の整数を表し、1~10の整数を表すことが好ましく、1~4の整数を表すことがより好ましい。 Specific examples of the structural unit (a) are shown below, but are not limited to these. s and t below each independently represent an integer of 0 to 10; n represents an integer of 0 to 10, preferably an integer of 1 to 10, more preferably an integer of 1 to 4.
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000024
Figure JPOXMLDOC01-appb-C000024
Figure JPOXMLDOC01-appb-C000025
Figure JPOXMLDOC01-appb-C000025
 本発明の硬化性樹脂組成物を硬化してなる硬化層の耐擦傷性をより向上させる観点から、ポリマー(S)が構成単位(a)を含む場合、ポリマー(S)中の構成単位(a)の含有量は、ポリマー(S)に含まれる構成単位の全体に対して、0モル%超90モル%以下であることが好ましく、1モル%以上50モル%以下であることがより好ましく、2モル%以上40モル%以下であることが更に好ましく、3モル%以上30モル%以下であることが特に好ましく、4モル%以上20モル%以下であることが一層好ましく、5モル%以上15モル%以下であることが最も好ましい。 From the viewpoint of further improving the scratch resistance of the cured layer obtained by curing the curable resin composition of the present invention, when the polymer (S) contains the structural unit (a), the structural unit (a ) is preferably more than 0 mol% and 90 mol% or less, more preferably 1 mol% or more and 50 mol% or less, based on the total structural units contained in the polymer (S), It is more preferably 2 mol% or more and 40 mol% or less, particularly preferably 3 mol% or more and 30 mol% or less, even more preferably 4 mol% or more and 20 mol% or less, and 5 mol% or more and 15 mol% or more. It is most preferably mol % or less.
〔カチオン重合性基を含む構成単位(b)〕
 カチオン重合性基を含む構成単位(b)について説明する。
 構成単位(b)のカチオン重合性基は、特に限定されず、公知のいずれのカチオン重合性基であっても良い。カチオン重合性基としては、例えば、脂環式エーテル基、環状アセタール基、環状ラクトン基、環状チオエーテル基、スピロオルソエステル基、ビニルオキシ基などを挙げることができる。
 カチオン重合性基としては、脂環式エーテル基又はビニルオキシ基が好ましく、エポキシ基、エポキシシクロヘキシル基、オキセタニル基又はビニルオキシ基がより好ましく、エポキシ基、エポキシシクロヘキシル基又はオキセタニル基が更に好ましく、エポキシ基又はエポキシシクロヘキシル基が最も好ましい。なお、上記した各基は置換基を有していてもよい。
[Structural Unit (b) Containing Cationic Polymerizable Group]
The structural unit (b) containing a cationically polymerizable group will be described.
The cationically polymerizable group of the structural unit (b) is not particularly limited, and may be any known cationically polymerizable group. Examples of cationic polymerizable groups include alicyclic ether groups, cyclic acetal groups, cyclic lactone groups, cyclic thioether groups, spiroorthoester groups, and vinyloxy groups.
The cationic polymerizable group is preferably an alicyclic ether group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group, an oxetanyl group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group or an oxetanyl group, and an epoxy group or Epoxycyclohexyl groups are most preferred. In addition, each group described above may have a substituent.
 カチオン重合性基は下記式(C1)~(C3)のいずれかで表される基であることが好ましい。 The cationically polymerizable group is preferably a group represented by any one of the following formulas (C1) to (C3).
Figure JPOXMLDOC01-appb-C000026
Figure JPOXMLDOC01-appb-C000026
 式(C1)~(C3)中、*は結合位置を表す。式(C3)中、Rは水素原子又は置換基を表す。 In formulas (C1) to (C3), * represents a bonding position. In formula (C3), R C represents a hydrogen atom or a substituent.
 式(C3)中のRが置換基を表す場合の置換基は特に限定されないが、アルキル基であることが好ましく、炭素数1~6のアルキル基であることがより好ましい。炭素数1~6のアルキル基としては、例えば、メチル基、エチル基、n-プロピル基、i-プロピル基、n-ブチル基、n-ヘキシル基等が挙げられる。
 Rは水素原子、メチル基又はエチル基を表すことが好ましく、メチル基又はエチル基を表すことがより好ましい。
When R 1 C in formula (C3) represents a substituent, the substituent is not particularly limited, but is preferably an alkyl group, more preferably an alkyl group having 1 to 6 carbon atoms. Examples of alkyl groups having 1 to 6 carbon atoms include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, n-hexyl group and the like.
R C preferably represents a hydrogen atom, a methyl group or an ethyl group, more preferably a methyl group or an ethyl group.
 ポリマー(S)が(メタ)アクリルポリマー、(メタ)アクリルアミドポリマー等の(メタ)アクリロイル基を有するモノマーのラジカル重合によって合成されるポリマーである場合、構成単位(b)は下記一般式(CA-1)~(CA-3)のいずれかで表される構成単位であることが好ましい。 When the polymer (S) is a polymer synthesized by radical polymerization of a monomer having a (meth)acryloyl group such as a (meth)acrylic polymer or a (meth)acrylamide polymer, the structural unit (b) has the following general formula (CA- A structural unit represented by any one of 1) to (CA-3) is preferred.
Figure JPOXMLDOC01-appb-C000027
Figure JPOXMLDOC01-appb-C000027
 一般式(CA-1)~(CA-3)中、Raは水素原子又はメチル基を表す。Aは-O-又は-NH-を表す。Lは単結合又は2価の連結基を表す。一般式(CA-3)中、Rは上記式(C3)中におけるものと同じ意味を表す。 In general formulas (CA-1) to (CA-3), Ra 1 represents a hydrogen atom or a methyl group. A represents -O- or -NH-. L3 represents a single bond or a divalent linking group. In general formula (CA-3), R 1 C has the same meaning as in formula (C3) above.
 一般式(CA-1)~(CA-3)中、Aは-O-又は-NH-を表し、-O-を表すことが好ましい。 In general formulas (CA-1) to (CA-3), A represents -O- or -NH-, preferably -O-.
 一般式(CA-1)~(CA-3)中、Lは単結合又は2価の連結基を表す。
 Lが2価の連結基を表す場合、-O-、-CO-、-COO-、-S-、-SO-、-NR-、炭素数1~20の有機連結基(例えば、置換基を有してもよいアルキレン基、置換基を有してもよいシクロアルキレン基、置換基を有してもよいアリーレン基など)、又はこれらを2つ以上組み合わせてなる連結基などが挙げられる。上記Rは水素原子又は置換基を表す。
 Lは単結合、又は、炭素数1~10のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることが好ましく、単結合、又は、炭素数1~6のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることがより好ましい。
In general formulas (CA-1) to (CA-3), L 3 represents a single bond or a divalent linking group.
When L 3 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these. . R above represents a hydrogen atom or a substituent.
L 3 is preferably a single bond, or an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
 一般式(CA-3)中、Rは上記式(C3)中におけるものと同じ意味を表し、具体例及び好ましい範囲も同じである。 In general formula (CA-3), R 1 C has the same meaning as in formula (C3) above, and specific examples and preferred ranges are also the same.
 カチオン重合性基を含む構成単位(b)の具体例を以下に示すが、これらに限定されるものではない。 Specific examples of the structural unit (b) containing a cationic polymerizable group are shown below, but are not limited to these.
Figure JPOXMLDOC01-appb-C000028
Figure JPOXMLDOC01-appb-C000028
 本発明の硬化性樹脂組成物を硬化してなる硬化層の耐擦傷性をより向上させる観点から、ポリマー(S)が構成単位(b)を含む場合、ポリマー(S)中の構成単位(b)の含有量は、ポリマー(S)に含まれる構成単位の全体に対して、0モル%超90モル%以下であることが好ましく、5モル%以上80モル%以下であることがより好ましく、10モル%以上70モル%以下であることが更に好ましく、20モル%以上60モル%以下であることが特に好ましく、30モル%以上50モル%以下であることが最も好ましい。 From the viewpoint of further improving the scratch resistance of the cured layer obtained by curing the curable resin composition of the present invention, when the polymer (S) contains the structural unit (b), the structural unit (b) in the polymer (S) ) is preferably more than 0 mol% and 90 mol% or less, more preferably 5 mol% or more and 80 mol% or less, based on the total structural units contained in the polymer (S), It is more preferably 10 mol % or more and 70 mol % or less, particularly preferably 20 mol % or more and 60 mol % or less, and most preferably 30 mol % or more and 50 mol % or less.
〔一般式(Z-1)で表される構成単位(z)〕
 一般式(Z-1)で表される構成単位(z)について説明する。
[Structural Unit (z) Represented by General Formula (Z-1)]
The structural unit (z) represented by general formula (Z-1) will be described.
Figure JPOXMLDOC01-appb-C000029
Figure JPOXMLDOC01-appb-C000029
 一般式(Z-1)中、
 Dは水素原子、メチル基、-CHORZ1又は-CHCOORZ2を表す。RZ1は水素原子又は炭素数1~4のアルキル基を表す。RZ2は水素原子又はメチル基を表す。
 Aは-O-又は-NRZ3-を表す。RZ3は水素原子又は炭素数1~4のアルキル基を表す。
 wは2~5の整数を表す。
 LZ1は脂肪族基及び芳香族基からなる群より選ばれる少なくとも1つを有するw+1価の連結基を表す。上記脂肪族基に含まれる1つ以上の-CH-はそれぞれ独立に-CO-、-O-又は-NRZ4-に置き換わってもよい。RZ4は水素原子又は炭素数1~4のアルキル基を表す。RZ4が複数存在する場合、複数のRZ4は同一でも異なっていてもよい。
 LZ2はアルキレン基、アリーレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す。RZ5は水素原子又は炭素数1~4のアルキル基を表す。RZ5が複数存在する場合、複数のRZ5は同一でも異なっていてもよい。
 Eは下記一般式(Ea-1)又は(Ea-2)で表される基を表す。
In the general formula (Z-1),
D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 . R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. R Z2 represents a hydrogen atom or a methyl group.
A 1 represents -O- or -NR Z3 -. R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
w represents an integer of 2 to 5;
L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group. One or more —CH 2 — contained in the aliphatic group may be independently replaced with —CO—, —O— or —NR Z4 —. R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond. R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
Figure JPOXMLDOC01-appb-C000030
Figure JPOXMLDOC01-appb-C000030
 一般式(Ea-1)及び(Ea-2)中、
 RE1及びRE2はそれぞれ独立に水素原子又はメチル基を表す。
 RE3は水素原子又は炭素数1~4のアルキル基を表す。
 *は結合位置を表す。
In general formulas (Ea-1) and (Ea-2),
R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
* represents a binding position.
 Dは水素原子、メチル基、-CHORZ1又は-CHCOORZ2を表す。RZ1は水素原子又は炭素数1~4のアルキル基を表し、水素原子又はメチル基を表すことが好ましく、水素原子を表すことがより好ましい。
 Dは水素原子又はメチル基を表すことが好ましい。
D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 . R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
D 1 preferably represents a hydrogen atom or a methyl group.
 Aは-O-又は-NRZ3-を表す。
 RZ3は水素原子又は炭素数1~4のアルキル基を表し、水素原子又はメチル基を表すことが好ましく、水素原子を表すことがより好ましい。
 Aは-O-又は-NH-を表すことが好ましく、-O-を表すことがより好ましい。
A 1 represents -O- or -NR Z3 -.
R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
A 1 preferably represents -O- or -NH-, more preferably -O-.
 wは2~4の整数を表すことが好ましく、2又は3を表すことがより好ましく、2を表すことが更に好ましい。 w preferably represents an integer of 2 to 4, more preferably 2 or 3, and even more preferably 2.
 RZ4は水素原子又は炭素数1~4のアルキル基を表し、水素原子又はメチル基を表すことが好ましく、水素原子を表すことがより好ましい。
 LZ1は脂肪族基及び芳香族基からなる群より選ばれる少なくとも1つを有するw+1価の連結基を表す。上記芳香族基は、芳香族炭化水素基であることが好ましく、炭素数6~10の芳香族炭化水素基であることがより好ましい。
 LZ1はw+1価の脂肪族基を表すことが好ましく、炭素数1~10のw+1価の脂肪族炭化水素基を表すことがより好ましく、炭素数1~5のw+1価の脂肪族炭化水素基を表すことがより好ましく、炭素数1~3のw+1価の脂肪族炭化水素基を表すことが更に好ましい。w+1価の脂肪族炭化水素基は、直鎖状又は分岐鎖状であることが好ましい。w+1価の脂肪族炭化水素基は、アルキレン基から任意のw-1個の水素原子を除してなる基であることが好ましい。
R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group. The aromatic group is preferably an aromatic hydrocarbon group, more preferably an aromatic hydrocarbon group having 6 to 10 carbon atoms.
L Z1 preferably represents a w+1-valent aliphatic group, more preferably a w+1-valent aliphatic hydrocarbon group having 1 to 10 carbon atoms, and a w+1-valent aliphatic hydrocarbon group having 1 to 5 carbon atoms. More preferably, it represents a w+1-valent aliphatic hydrocarbon group having 1 to 3 carbon atoms. The w+1 valent aliphatic hydrocarbon group is preferably linear or branched. The w+1 valent aliphatic hydrocarbon group is preferably a group obtained by removing arbitrary w−1 hydrogen atoms from an alkylene group.
 LZ2はアルキレン基、アリーレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す。
 RZ5は水素原子又は炭素数1~4のアルキル基を表し、水素原子又はメチル基を表すことが好ましく、水素原子を表すことがより好ましい。
 上記アルキレン基は、直鎖状でも分岐鎖状でもよく、炭素数1~10のアルキレン基であることが好ましく、炭素数1~5のアルキレン基であるがより好ましく、炭素数1~3のアルキレン基であることが更に好ましい。
 上記アリール基は、炭素数6~10のアリール基であることが好ましい。
 LZ2はアルキレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表すことが好ましく、アルキレン基、-CO-、及び-O-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表すことがより好ましく、アルキレン基又は単結合を表すことが更に好ましい。
L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond.
R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
The alkylene group may be linear or branched, preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, and an alkylene group having 1 to 3 carbon atoms. more preferably a group.
The aryl group is preferably an aryl group having 6 to 10 carbon atoms.
L Z2 preferably represents an alkylene group, a divalent linking group having at least one selected from the group consisting of —CO—, —O—, and —NR Z5 —, or a single bond, and an alkylene group, —CO It more preferably represents a divalent linking group having at least one selected from the group consisting of - and -O-, or a single bond, and more preferably represents an alkylene group or a single bond.
 耐擦傷性が向上するという理由から、LZ1とLZ2とからなる基(-LZ1-(LZ2-)が炭素原子、水素原子及び酸素原子からなる群より選択される1種以上の原子からなることが好ましく、炭素原子及び水素原子からなることがより好ましい。LZ1とLZ2に含まれる炭素原子数が合計で1~6であることが好ましく、1~5であることがより好ましく、1~4であることが更に好ましく、1~3であることが特に好ましい。LZ1とLZ2に含まれる酸素原子数が合計で0~4であることが好ましく、0~2であることがより好ましい。 The group consisting of L Z1 and L Z2 (-L Z1 -(L Z2 ) w -) is at least one selected from the group consisting of carbon atoms, hydrogen atoms and oxygen atoms for the reason that the scratch resistance is improved. is preferably composed of atoms, and more preferably composed of carbon atoms and hydrogen atoms. The total number of carbon atoms contained in L Z1 and L Z2 is preferably 1 to 6, more preferably 1 to 5, still more preferably 1 to 4, and preferably 1 to 3. Especially preferred. The total number of oxygen atoms contained in L Z1 and L Z2 is preferably 0-4, more preferably 0-2.
 一般式(Ea-2)中、RE3は水素原子又は炭素数1~4のアルキル基を表し、水素原子又はメチル基を表すことが好ましく、水素原子を表すことがより好ましい。
 Eは一般式(Ea-1)で表される基を表すことが好ましい。
 構成単位(z)のEはラジカル重合性基であることが好ましい。
In general formula (Ea-2), R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, preferably a hydrogen atom or a methyl group, more preferably a hydrogen atom.
E 1 preferably represents a group represented by general formula (Ea-1).
E1 of the structural unit (z) is preferably a radically polymerizable group.
 構成単位(z)の具体例を以下に示すが、これらに限定されるものではない。 Specific examples of the structural unit (z) are shown below, but are not limited to these.
Figure JPOXMLDOC01-appb-C000031
Figure JPOXMLDOC01-appb-C000031
 本発明の硬化性樹脂組成物を硬化してなる硬化層の耐擦傷性をより向上させる観点から、ポリマー(S)中の構成単位(z)の含有量は、ポリマー(S)に含まれる構成単位の全体に対して、0モル%超100モル%未満であることが好ましく、20モル%以上97モル%以下であることがより好ましく、30モル%以上95モル%以下であることが更に好ましく、40モル%以上80モル%以下であることが特に好ましく、50モル%以上70モル%以下であることが最も好ましい。 From the viewpoint of further improving the scratch resistance of the cured layer obtained by curing the curable resin composition of the present invention, the content of the structural unit (z) in the polymer (S) is the constitution contained in the polymer (S). It is preferably more than 0 mol% and less than 100 mol%, more preferably 20 mol% or more and 97 mol% or less, and still more preferably 30 mol% or more and 95 mol% or less, relative to the entire unit. , is particularly preferably 40 mol % or more and 80 mol % or less, and most preferably 50 mol % or more and 70 mol % or less.
 ポリマー(S)は、上記構成単位(a)~(c)に加えて、任意のその他の構成単位を有していても良い。 The polymer (S) may have any other structural unit in addition to the above structural units (a) to (c).
〔水酸基結合性を有する構成単位(c)〕
 ポリマー(S)は、更に、構成単位(b)とは異なる構成単位であって、かつ水酸基結合性を有する構成単位(c)を有していても良い。
 水酸基結合性を有する構成単位(c)を、「構成単位(c)」とも呼ぶ。
 「水酸基結合性を有する」とは、水酸基に結合することができるという意味である。
 構成単位(c)は、水酸基結合性を有する基を含むことが好ましく、水酸基と化学結合可能な基を含むことがより好ましい。
[Structural Unit (c) Having Hydroxyl Group Bonding Property]
The polymer (S) may further have a structural unit (c) which is a structural unit different from the structural unit (b) and has hydroxyl group bonding properties.
A structural unit (c) having a hydroxyl group bonding property is also referred to as a “structural unit (c)”.
“Having a hydroxyl group bonding property” means being able to bond to a hydroxyl group.
The structural unit (c) preferably contains a hydroxyl-bonding group, more preferably a group capable of chemically bonding with a hydroxyl group.
 構成単位(c)は、ボロン酸基、ボロン酸エステル基、イソシアネート基、アルデヒド基、及びアルコキシシリル基からなる群より選ばれる少なくとも1つを有することが好ましく、ボロン酸基、ボロン酸エステル基、及びイソシアネート基からなる群より選ばれる少なくとも1つを有することがより好ましく、ボロン酸基及びボロン酸エステル基からなる群より選ばれる少なくとも1つを有することが更に好ましい。
 上記アルコキシシリル基は、炭素数1~20のアルコキシシリル基が好ましく、炭素数1~10のアルコキシシリル基がより好ましく、炭素数1~7のアルコキシシリル基が更に好ましく、炭素数1~4のアルコキシシリル基が特に好ましい。
Structural unit (c) preferably has at least one selected from the group consisting of a boronic acid group, a boronate ester group, an isocyanate group, an aldehyde group, and an alkoxysilyl group. and an isocyanate group, and more preferably at least one selected from the group consisting of a boronic acid group and a boronate ester group.
The alkoxysilyl group is preferably an alkoxysilyl group having 1 to 20 carbon atoms, more preferably an alkoxysilyl group having 1 to 10 carbon atoms, still more preferably an alkoxysilyl group having 1 to 7 carbon atoms, and an alkoxysilyl group having 1 to 4 carbon atoms. Alkoxysilyl groups are particularly preferred.
 構成単位(c)は、下記一般式(BR-1)又は(BR-2)で表される基を含むことが好ましい。 The structural unit (c) preferably contains a group represented by the following general formula (BR-1) or (BR-2).
Figure JPOXMLDOC01-appb-C000032
Figure JPOXMLDOC01-appb-C000032
 上記一般式(BR-1)中、R31及びR32は各々独立に水素原子又はアルキル基(好ましくは炭素数1~10のアルキル基)を表す。上記アルキル基は置換基を有してもよい。置換基としては、水素原子を除く1価の非金属原子団を挙げることができ、例えば、前述の一般式(1)中のR及びRが置換基を表す場合の置換基として挙げたものと同様である。*は結合位置を表す。
 上記一般式(BR-2)中、E21及びE22は各々独立に-O-又は-NRK1-を表す。RK1は水素原子又は炭素数1~4のアルキル基を表す。RK1が複数存在する場合、複数のRK1は同一でも異なっていてもよい。L31はアルキレン基(好ましくは炭素数1~10のアルキレン基)又はアリーレン基(好ましくは炭素数6~10のアリーレン基)を表す。上記アルキレン基及び上記アリーレン基は置換基を有してもよい。置換基としては、水素原子を除く1価の非金属原子団を挙げることができ、例えば、前述の一般式(1)中のR及びRが置換基を表す場合の置換基として挙げたものと同様である。*は結合位置を表す。
In general formula (BR-1) above, R 31 and R 32 each independently represent a hydrogen atom or an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms). The above alkyl group may have a substituent. Examples of substituents include monovalent non - metallic atomic groups excluding hydrogen atoms. It is the same as a thing. * represents a binding position.
In general formula (BR-2) above, E 21 and E 22 each independently represent —O— or —NR K1 —. R K1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R K1 are present, the multiple R K1 may be the same or different. L 31 represents an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms) or an arylene group (preferably an arylene group having 6 to 10 carbon atoms). The alkylene group and the arylene group may have substituents. Examples of substituents include monovalent non - metallic atomic groups excluding hydrogen atoms. It is the same as a thing. * represents a binding position.
 構成単位(c)は、下記一般式(3)で表されることが好ましい。 The structural unit (c) is preferably represented by the following general formula (3).
Figure JPOXMLDOC01-appb-C000033
Figure JPOXMLDOC01-appb-C000033
 一般式(3)中、
 Rは水素原子、フッ素原子、塩素原子又は炭素数1~20のアルキル基を表す。
 U及びUはそれぞれ独立に-O-、-S-、-COO-、-OCO-、-CONH-、-NHCOO-又は-NH-を表す。
 R及びRはそれぞれ独立に水素原子、脂肪族炭化水素基、アリール基又はヘテロアリール基を表す。
 RとRとは結合してもよい。
 Lは単結合又は2価の連結基を表す。
In general formula (3),
R4 represents a hydrogen atom, a fluorine atom, a chlorine atom or an alkyl group having 1 to 20 carbon atoms.
U 1 and U 2 each independently represent -O-, -S-, -COO-, -OCO-, -CONH-, -NHCOO- or -NH-.
R5 and R6 each independently represent a hydrogen atom, an aliphatic hydrocarbon group, an aryl group or a heteroaryl group.
R5 and R6 may be combined.
L4 represents a single bond or a divalent linking group.
 一般式(3)中のRは水素原子、フッ素原子、塩素原子又は炭素数1~20のアルキル基を表す。
 Rが表すアルキル基は直鎖状でも分岐状でもよく、炭素数1~10のアルキル基であることが好ましく、炭素数1~7のアルキル基であることがより好ましく、炭素数1~4のアルキル基であることが更に好ましく、メチル基であることが特に好ましい。
 Rは水素原子又はメチル基を表すことが好ましい。
R 4 in general formula (3) represents a hydrogen atom, a fluorine atom, a chlorine atom or an alkyl group having 1 to 20 carbon atoms.
The alkyl group represented by R 4 may be linear or branched, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 7 carbon atoms, and more preferably 1 to 4 carbon atoms. is more preferably an alkyl group, and particularly preferably a methyl group.
R 4 preferably represents a hydrogen atom or a methyl group.
 一般式(3)中のU及びUはそれぞれ独立に-O-、-S-、-COO-、-OCO-、-CONH-、-NHCOO-又は-NH-を表し、-O-又は-NH-を表すことが好ましく、-O-を表すことがより好ましい。 U 1 and U 2 in general formula (3) each independently represent -O-, -S-, -COO-, -OCO-, -CONH-, -NHCOO- or -NH-, and -O- or -NH- is preferred, and -O- is more preferred.
 一般式(3)中のR及びRはそれぞれ独立に水素原子、脂肪族炭化水素基、アリール基又はヘテロアリール基を表す。RとRとは結合してもよい。 R 5 and R 6 in general formula (3) each independently represent a hydrogen atom, an aliphatic hydrocarbon group, an aryl group or a heteroaryl group. R5 and R6 may be combined.
 R及びRが表す脂肪族炭化水素基は、置換基を有していてもよい。
 R及びRが表す脂肪族炭化水素基としては、置換基を有していてもよい、アルキル基、シクロアルキル基、アルケニル基、シクロアルケニル基又はアルキニル基が挙げられる。
 アルキル基は、炭素数1~20のアルキル基が好ましく、炭素数1~10のアルキル基がより好ましく、炭素数1~7のアルキル基が更に好ましく、炭素数1~4のアルキル基が特に好ましい。
 アルキル基としては、具体的には、例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、トリデシル基、ヘキサデシル基、オクタデシル基、エイコシル基、イソプロピル基、イソブチル基、sec-ブチル基、tert-ブチル基、イソペンチル基、ネオペンチル基、1-メチルブチル基、イソヘキシル基、2-メチルヘキシル基等の直鎖状又は分枝状のアルキル基が挙げられる。
 シクロアルキル基は、炭素数3~20のシクロアルキル基が好ましく、炭素数5~15のシクロアルキル基がより好ましい。
 シクロアルキル基としては、具体的には、例えば、シクロペンチル基、シクロヘキシル基、1-アダマンチル基、2-ノルボルニル基等が挙げられる。
The aliphatic hydrocarbon group represented by R5 and R6 may have a substituent.
Aliphatic hydrocarbon groups represented by R 5 and R 6 include alkyl groups, cycloalkyl groups, alkenyl groups, cycloalkenyl groups and alkynyl groups which may have a substituent.
The alkyl group is preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, still more preferably an alkyl group having 1 to 7 carbon atoms, and particularly preferably an alkyl group having 1 to 4 carbon atoms. .
Specific examples of alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, and tridecyl groups. , hexadecyl group, octadecyl group, eicosyl group, isopropyl group, isobutyl group, sec-butyl group, tert-butyl group, isopentyl group, neopentyl group, 1-methylbutyl group, isohexyl group, 2-methylhexyl group, etc. or a branched alkyl group.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms, more preferably a cycloalkyl group having 5 to 15 carbon atoms.
Specific examples of cycloalkyl groups include cyclopentyl, cyclohexyl, 1-adamantyl, and 2-norbornyl groups.
 アルケニル基は、炭素数2~20のアルケニル基が好ましく、炭素数2~10のアルケニル基がより好ましく、炭素数2~7のアルケニル基が更に好ましく、炭素数2~4のアルケニル基が特に好ましい。
 アルケニル基としては、具体的には、例えば、ビニル基、1-プロペニル基、1-ブテニル基、1-メチル-1-プロペニル基等の直鎖状又は分枝状のアルケニル基が挙げられる。
 シクロアルケニル基は、炭素数3~20のシクロアルケニル基が好ましく、炭素数5~15のシクロアルケニル基がより好ましい。
 シクロアルケニル基としては、具体的には、例えば、1-シクロペンテニル基、1-シクロヘキセニル基等が挙げられる。
The alkenyl group is preferably an alkenyl group having 2 to 20 carbon atoms, more preferably an alkenyl group having 2 to 10 carbon atoms, still more preferably an alkenyl group having 2 to 7 carbon atoms, and particularly preferably an alkenyl group having 2 to 4 carbon atoms. .
Specific examples of alkenyl groups include linear or branched alkenyl groups such as vinyl, 1-propenyl, 1-butenyl and 1-methyl-1-propenyl groups.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms, more preferably a cycloalkenyl group having 5 to 15 carbon atoms.
Specific examples of the cycloalkenyl group include a 1-cyclopentenyl group and a 1-cyclohexenyl group.
 アルキニル基は、炭素数2~20のアルキニル基が好ましく、炭素数2~10のアルキニル基がより好ましく、炭素数2~7のアルキニル基が更に好ましく、炭素数2~4のアルキニル基が特に好ましい。
 アルキニル基としては、具体的には、例えば、エチニル基、1-プロピニル基、1-ブチニル基、1-オクチニル基等が挙げられる。
The alkynyl group is preferably an alkynyl group having 2 to 20 carbon atoms, more preferably an alkynyl group having 2 to 10 carbon atoms, still more preferably an alkynyl group having 2 to 7 carbon atoms, and particularly preferably an alkynyl group having 2 to 4 carbon atoms. .
Specific examples of alkynyl groups include ethynyl, 1-propynyl, 1-butynyl, and 1-octynyl groups.
 R及びRが表すアリール基は、置換基を有していてもよい。
 R及びRが表すアリール基は、炭素数6~20のアリール基が好ましく、炭素数6~15のアリール基がより好ましく、炭素数6~12のアリール基が更に好ましい。
 R及びRが表すアリール基は、例えば、1個から4個のベンゼン環が縮合環を形成したもの、ベンゼン環と不飽和五員環とが縮合環を形成したものであってもよい。
 R及びRが表すアリール基としては、具体的には、フェニル基、ナフチル基、アントリル基、フェナントリル基、インデニル基、アセナブテニル基、フルオレニル基、ピレニル基等が挙げられる。
The aryl group represented by R5 and R6 may have a substituent.
The aryl group represented by R 5 and R 6 is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and even more preferably an aryl group having 6 to 12 carbon atoms.
The aryl group represented by R 5 and R 6 may be, for example, one in which 1 to 4 benzene rings form a condensed ring, or a benzene ring and an unsaturated five-membered ring form a condensed ring. .
Specific examples of the aryl group represented by R 5 and R 6 include phenyl group, naphthyl group, anthryl group, phenanthryl group, indenyl group, acenabutenyl group, fluorenyl group and pyrenyl group.
 R及びRが表すヘテロアリール基は、置換基を有していてもよい。
 R及びRが表すヘテロアリール基としては、例えば、窒素原子、酸素原子及び硫黄原子からなる群から選ばれるヘテロ原子を1個以上含む複素芳香環上の水素原子を1個除し、ヘテロアリール基としたものが挙げられる。
 窒素原子、酸素原子および硫黄原子からなる群から選ばれるヘテロ原子を1個以上含む複素芳香環としては、具体的には、例えば、ピロール、フラン、チオフェン、ピラゾール、イミダゾール、トリアゾール、オキサゾール、イソオキサゾール、オキサジアゾール、チアゾール、チアジアゾール、インドール、カルバゾール、ベンゾフラン、ジベンゾフラン、チアナフテン、ジベンゾチオフェン、インダゾールベンズイミダゾール、アントラニル、ベンズイソオキサゾール、ベンズオキサゾール、ベンゾチアゾール、プリン、ピリジン、ピリダジン、ピリミジン、ピラジン、トリアジン、キノリン、アクリジン、イソキノリン、フタラジン、キナゾリン、キノキザリン、ナフチリジン、フェナントロリン、プテリジン等が挙げられる。
The heteroaryl group represented by R5 and R6 may have a substituent.
The heteroaryl group represented by R 5 and R 6 is, for example, a heteroaromatic ring containing at least one heteroatom selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, and a hetero Examples include those with aryl groups.
Specific examples of heteroaromatic rings containing one or more heteroatoms selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom include pyrrole, furan, thiophene, pyrazole, imidazole, triazole, oxazole, and isoxazole. , oxadiazole, thiazole, thiadiazole, indole, carbazole, benzofuran, dibenzofuran, thianaphthene, dibenzothiophene, indazole benzimidazole, anthranil, benzisoxazole, benzoxazole, benzothiazole, purine, pyridine, pyridazine, pyrimidine, pyrazine, triazine, quinoline, acridine, isoquinoline, phthalazine, quinazoline, quinoxaline, naphthyridine, phenanthroline, pteridine and the like.
 R及びRが有していてもよい置換基としては、水素原子を除く1価の非金属原子団を挙げることができ、例えば、前述の一般式(1)中のR及びRが置換基を表す場合の置換基として挙げたものと同様である。 Examples of substituents that R 5 and R 6 may have include monovalent nonmetallic atomic groups excluding hydrogen atoms. is the same as those exemplified as the substituent when represents the substituent.
 R及びRは、水素原子、アルキル基又はアリール基を表すことが好ましく、水素原子又はアルキル基を表すことがより好ましい。
 R及びRは共に水素原子を表すか、又は共にアルキル基を表し、RとRとが結合している(すなわち、RとRとがアルキレン連結基を表す)ことが更に好ましい。
R5 and R6 preferably represent a hydrogen atom, an alkyl group or an aryl group, more preferably a hydrogen atom or an alkyl group.
It is further preferred that both R 5 and R 6 represent a hydrogen atom or both represent an alkyl group, and that R 5 and R 6 are bonded (i.e., R 5 and R 6 represent an alkylene linking group). preferable.
 一般式(3)中のLは単結合又は2価の連結基を表す。
 Lが表す2価の連結基は、-O-、-S-、-COO-、-OCO-、-CONR13-、-NR13COO-、-CR13N-、置換若しくは無置換の2価の脂肪族基、置換若しくは無置換の2価の芳香族基、及び、これらの組み合わせからなる群より選ばれる2価の連結基を表すことが好ましい。R13は水素原子又は炭素数1~20のアルキル基を表す。
 Lが置換若しくは無置換の2価の脂肪族基を含む場合には、脂肪族基の炭素数は1~20が好ましく、1~15がより好ましく、1~10であることが更に好ましい。
 Lが置換若しくは無置換の2価の芳香族基を含む場合には、芳香族環の数は1~3が好ましく、1~2がより好ましく、1であることが更に好ましい。
 Lは、-O-、-COO-、-OCO-、-CONR13-、-NR13COO-、置換若しくは無置換の2価の脂肪族基、置換若しくは無置換の2価の芳香族基、及び、これらの組み合わせからなる群より選ばれる2価の連結基であることが好ましく、-O-、-COO-、-OCO-、置換若しくは無置換の2価の脂肪族基、置換若しくは無置換の2価の芳香族基、及び、これらの組み合わせからなる群より選ばれる2価の連結基であることがより好ましく、-O-、-COO-、-OCO-、置換若しくは無置換のアルキレン基、置換若しくは無置換のアリーレン基、及び、これらの組み合わせからなる群より選ばれる2価の連結基であることが更に好ましい。
L4 in general formula ( 3 ) represents a single bond or a divalent linking group.
The divalent linking group represented by L 4 is -O-, -S-, -COO-, -OCO-, -CONR 13 -, -NR 13 COO-, -CR 13 N-, substituted or unsubstituted 2 It preferably represents a divalent linking group selected from the group consisting of a valent aliphatic group, a substituted or unsubstituted divalent aromatic group, and a combination thereof. R 13 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.
When L 4 contains a substituted or unsubstituted divalent aliphatic group, the number of carbon atoms in the aliphatic group is preferably 1-20, more preferably 1-15, even more preferably 1-10.
When L 4 contains a substituted or unsubstituted divalent aromatic group, the number of aromatic rings is preferably 1-3, more preferably 1-2, even more preferably 1.
L 4 is -O-, -COO-, -OCO-, -CONR 13 -, -NR 13 COO-, a substituted or unsubstituted divalent aliphatic group, a substituted or unsubstituted divalent aromatic group , And preferably a divalent linking group selected from the group consisting of combinations thereof, -O-, -COO-, -OCO-, substituted or unsubstituted divalent aliphatic group, substituted or unsubstituted A substituted divalent aromatic group, and more preferably a divalent linking group selected from the group consisting of combinations thereof, -O-, -COO-, -OCO-, substituted or unsubstituted alkylene It is more preferably a divalent linking group selected from the group consisting of a group, a substituted or unsubstituted arylene group, and a combination thereof.
 一般式(3)で表される繰り返し単位は、下記一般式(3m)で表される化合物を重合することで得られる。 The repeating unit represented by general formula (3) is obtained by polymerizing a compound represented by general formula (3m) below.
Figure JPOXMLDOC01-appb-C000034
Figure JPOXMLDOC01-appb-C000034
 一般式(3m)中、R、U、U、R、R及びLは、それぞれ一般式(3)中のR、U、U、R、R及びLと同じ意味を表し、それぞれについての説明、具体例及び好ましい範囲も同じである。 In general formula (3m), R 4 , U 1 , U 2 , R 5 , R 6 and L 4 are R 4 , U 1 , U 2 , R 5 , R 6 and L in general formula (3), respectively. 4 , and the description, specific examples, and preferred ranges for each are also the same.
 一般式(3)で表される繰り返し単位を形成できる一般式(3m)で表される化合物の具体例を以下に記載するが、これらに限定されない。 Specific examples of the compound represented by general formula (3m) capable of forming the repeating unit represented by general formula (3) are described below, but are not limited thereto.
Figure JPOXMLDOC01-appb-C000035
Figure JPOXMLDOC01-appb-C000035
Figure JPOXMLDOC01-appb-C000036
Figure JPOXMLDOC01-appb-C000036
Figure JPOXMLDOC01-appb-C000037
Figure JPOXMLDOC01-appb-C000037
 ポリマー(S)に含まれる全ての構成単位に対する、構成単位(a)の物質量基準の含有量をWaとし、構成単位(b)の物質量基準の含有量をWbとし、構成単位(c)の物質量基準の含有量をWcとし、構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb、Wc及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wc<90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはないことが好ましい。 With respect to all structural units contained in the polymer (S), let Wa be the content of the structural unit (a) based on the material amount, Wb be the content of the structural unit (b) based on the material amount, and the structural unit (c) Wc is the content based on the amount of substance, and Wz is the content of the structural unit (z) based on the amount of material, where Wa, Wb, Wc and Wz are respectively 0 mol% ≤ Wa ≤ 90 mol% and 0 mol% ≤ It is preferable that Wb≦90 mol%, 0 mol%<Wc<90 mol%, 0 mol%<Wz<100 mol%, and that both Wa and Wb are not 0 mol%.
 ポリマー(S)が構成単位(c)を含む場合、ポリマー(S)中の構成単位(c)の含有量は、ポリマー(S)に含まれる構成単位の全体に対して、0モル%超90モル%以下であることが好ましく、5モル%以上85モル%以下であることがより好ましく、10モル%以上80モル%以下であることが更に好ましい。 When the polymer (S) contains the structural unit (c), the content of the structural unit (c) in the polymer (S) is more than 0 mol% 90% with respect to the total structural units contained in the polymer (S). It is preferably mol % or less, more preferably 5 mol % or more and 85 mol % or less, and even more preferably 10 mol % or more and 80 mol % or less.
 ポリマー(S)の重量平均分子量(Mw)は、重量平均分子量が5000~200000であることが好ましく、8000~150000であることがより好ましく、10000~100000であることが更に好ましい。 The weight average molecular weight (Mw) of the polymer (S) is preferably 5,000 to 200,000, more preferably 8,000 to 150,000, even more preferably 10,000 to 100,000.
 ポリマー(S)の分子量分散度(Mw/Mn)は、例えば1.00~4.00であり、好ましくは1.10~3.70であり、より好ましくは1.20~3.00であり、さらに好ましくは1.20~2.50である。Mwは重量平均分子量を表し、Mnは数平均分子量を表す。 The molecular weight dispersity (Mw/Mn) of the polymer (S) is, for example, 1.00 to 4.00, preferably 1.10 to 3.70, more preferably 1.20 to 3.00. , more preferably 1.20 to 2.50. Mw represents the weight average molecular weight and Mn represents the number average molecular weight.
 ポリマー(S)の重量平均分子量、分子量分散度は、特に断りがない限り、GPCの測定値(ポリスチレン換算)である。重量平均分子量は、具体的には装置としてHLC-8220(東ソー株式会社製)を用意し、溶離液としてテトラヒドロフランを用い、カラムとしてTSKgel(登録商標)G3000HXL+TSKgel(登録商標)G2000HXLを用い、温度23℃、流量1mL/minの条件下、示差屈折率(RI)検出器を用いて測定する。 Unless otherwise specified, the weight average molecular weight and molecular weight dispersity of the polymer (S) are the values measured by GPC (converted to polystyrene). Specifically, the weight average molecular weight is obtained by preparing HLC-8220 (manufactured by Tosoh Corporation) as an apparatus, using tetrahydrofuran as an eluent, using TSKgel (registered trademark) G3000HXL + TSKgel (registered trademark) G2000HXL as a column, at a temperature of 23 ° C. , at a flow rate of 1 mL/min, using a differential refractive index (RI) detector.
 ポリマー(S)の具体例を以下に示すが、これらに限定されない。 Specific examples of the polymer (S) are shown below, but are not limited to these.
Figure JPOXMLDOC01-appb-C000038
Figure JPOXMLDOC01-appb-C000038
Figure JPOXMLDOC01-appb-C000039
Figure JPOXMLDOC01-appb-C000039
Figure JPOXMLDOC01-appb-C000040
Figure JPOXMLDOC01-appb-C000040
Figure JPOXMLDOC01-appb-C000041
Figure JPOXMLDOC01-appb-C000041
Figure JPOXMLDOC01-appb-C000042
Figure JPOXMLDOC01-appb-C000042
Figure JPOXMLDOC01-appb-C000043
Figure JPOXMLDOC01-appb-C000043
Figure JPOXMLDOC01-appb-C000044
Figure JPOXMLDOC01-appb-C000044
Figure JPOXMLDOC01-appb-C000045
Figure JPOXMLDOC01-appb-C000045
Figure JPOXMLDOC01-appb-C000046
Figure JPOXMLDOC01-appb-C000046
Figure JPOXMLDOC01-appb-C000047
Figure JPOXMLDOC01-appb-C000047
Figure JPOXMLDOC01-appb-C000048
Figure JPOXMLDOC01-appb-C000048
Figure JPOXMLDOC01-appb-C000049
Figure JPOXMLDOC01-appb-C000049
Figure JPOXMLDOC01-appb-C000050
Figure JPOXMLDOC01-appb-C000050
<ポリマー(S)の製造方法>
 ポリマー(S)は公知の方法により製造することができる。
 例えば、前述したフッ素原子を含有する基を含むモノマー、前述したカチオン重合性基を含むモノマー、前述したラジカル重合性基を含むモノマー、及び任意のその他のモノマーを混合し、有機溶媒中で、ラジカル重合開始剤を用いて重合することにより製造することができる。ラジカル重合の際には構成単位(z)のラジカル重合性基の反応を防ぐために公知の方法により保護することが好ましい。
<Method for producing polymer (S)>
Polymer (S) can be produced by a known method.
For example, a monomer containing a group containing a fluorine atom as described above, a monomer containing a cationically polymerizable group as described above, a monomer containing a radically polymerizable group as described above, and any other monomer are mixed, and in an organic solvent, a radical It can be produced by polymerization using a polymerization initiator. In the radical polymerization, it is preferable to protect the radically polymerizable group of the structural unit (z) by a known method in order to prevent the radically polymerizable group from reacting.
 本発明の硬化性樹脂組成物中のポリマー(S)の含有率は特に限定されず、硬化性樹脂組成物の用途などに応じて適宜調整することができる。
 本発明の硬化性樹脂組成物では、ポリマー(S)を主成分として用いることもできるし、添加剤として用いることもできる。主成分とは、硬化性樹脂組成物に含まれる固形分のうち、最も含有率が高い成分である。添加剤とは、硬化性樹脂組成物に含まれる固形分のうち、主成分ではない成分である。
 本発明の硬化性樹脂組成物をハードコート層形成用組成物として用い、かつポリマー(S)を主成分として用いる場合、ポリマー(S)の含有率は、ハードコート層形成用組成物(硬化性樹脂組成物)中の全固形分に対して、50質量%以上であることが好ましく、70質量%以上であることがより好ましく、80質量%以上であることが更に好ましい。ポリマー(S)の含有率の上限は、特に限定されないが、99質量%以下であることが好ましく、98質量%以下であることがより好ましく、97質量%以下であることが更に好ましい。
 なお、全固形分とは溶媒以外の全成分のことである。
 本発明の硬化性樹脂組成物をハードコート層形成用組成物として用い、かつポリマー(S)を添加剤として用いる場合、ポリマー(S)の含有率は、ハードコート層形成用組成物(硬化性樹脂組成物)中の全固形分に対して、例えば、0.001~10質量%とすることができ、0.01~7質量%とすることもでき、0.1~5質量%とすることもでき、0.1~3質量%とすることもできる。
The content of the polymer (S) in the curable resin composition of the present invention is not particularly limited, and can be appropriately adjusted depending on the application of the curable resin composition.
In the curable resin composition of the present invention, the polymer (S) can be used as a main component or as an additive. The main component is the component with the highest content among the solids contained in the curable resin composition. The additive is a component that is not the main component among the solids contained in the curable resin composition.
When the curable resin composition of the present invention is used as a composition for forming a hard coat layer and the polymer (S) is used as a main component, the content of the polymer (S) is It is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more, relative to the total solid content in the resin composition). The upper limit of the polymer (S) content is not particularly limited, but is preferably 99% by mass or less, more preferably 98% by mass or less, and even more preferably 97% by mass or less.
In addition, the total solid content means all components other than the solvent.
When the curable resin composition of the present invention is used as a composition for forming a hard coat layer and the polymer (S) is used as an additive, the content of the polymer (S) is With respect to the total solid content in the resin composition), for example, it can be 0.001 to 10% by mass, it can be 0.01 to 7% by mass, and it is 0.1 to 5% by mass It can also be 0.1 to 3% by mass.
 本発明の硬化性樹脂組成物中、ポリマー(S)は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。 In the curable resin composition of the present invention, only one type of polymer (S) may be used, or two or more types having different structures may be used in combination.
 以下、本発明の硬化性樹脂組成物(好ましくはハードコート層形成用組成物)が含んでも良いその他の成分について説明する。 Other components that the curable resin composition (preferably hard coat layer-forming composition) of the present invention may contain are described below.
(カチオン重合性基を有するポリオルガノシルセスキオキサン(a1))
 本発明の硬化性樹脂組成物は、カチオン重合性基を有するポリオルガノシルセスキオキサン(a1)(「ポリオルガノシルセスキオキサン(a1)」ともいう。)を含むことができる。
 ポリオルガノシルセスキオキサン(a1)におけるカチオン重合性基は特に限定されず、公知のいずれのカチオン重合性基であっても良い。カチオン重合性基としては、例えば、脂環式エーテル基、環状アセタール基、環状ラクトン基、環状チオエーテル基、スピロオルソエステル基、ビニルオキシ基などを挙げることができる。
 カチオン重合性基としては、脂環式エーテル基又はビニルオキシ基が好ましく、エポキシ基、エポキシシクロヘキシル基、オキセタニル基又はビニルオキシ基がより好ましく、エポキシ基、エポキシシクロヘキシル基又はオキセタニル基が更に好ましく、エポキシ基又はエポキシシクロヘキシル基が最も好ましい。なお、上記した各基は置換基を有していてもよい。
(Polyorganosilsesquioxane (a1) having a cationic polymerizable group)
The curable resin composition of the present invention can contain a polyorganosilsesquioxane (a1) having a cationically polymerizable group (also referred to as "polyorganosilsesquioxane (a1)").
The cationic polymerizable group in the polyorganosilsesquioxane (a1) is not particularly limited, and may be any known cationic polymerizable group. Examples of cationic polymerizable groups include alicyclic ether groups, cyclic acetal groups, cyclic lactone groups, cyclic thioether groups, spiroorthoester groups, and vinyloxy groups.
The cationic polymerizable group is preferably an alicyclic ether group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group, an oxetanyl group or a vinyloxy group, more preferably an epoxy group, an epoxycyclohexyl group or an oxetanyl group, and an epoxy group or Epoxycyclohexyl groups are most preferred. In addition, each group described above may have a substituent.
 カチオン重合性基は下記式(ca1)~(ca3)のいずれかで表される基であることが好ましい。 The cationically polymerizable group is preferably a group represented by any one of the following formulas (ca1) to (ca3).
Figure JPOXMLDOC01-appb-C000051
Figure JPOXMLDOC01-appb-C000051
 式(ca1)~(ca3)中、*は結合位置を表す。式(ca3)中、Rcaは水素原子又は置換基を表す。 In formulas (ca1) to (ca3), * represents a bonding position. In formula (ca3), Rca represents a hydrogen atom or a substituent.
 式(ca)中のRcaが置換基を表す場合の置換基の具体例及び好ましい範囲は前述の式(C3)中のRが置換基を表す場合の置換基と同様である。 Specific examples and preferred ranges of the substituent when R 2 ca in formula (ca) represents a substituent are the same as the substituent when R 2 C in formula (C3) above represents a substituent.
 ポリオルガノシルセスキオキサン(a1)は、下記一般式(csa-1)~(csa-3)のいずれかで表される構成単位を有することが好ましい。 The polyorganosilsesquioxane (a1) preferably has structural units represented by any of the following general formulas (csa-1) to (csa-3).
Figure JPOXMLDOC01-appb-C000052
Figure JPOXMLDOC01-appb-C000052
 一般式(csa-1)~(csa-3)中、Lは単結合又は2価の連結基を表す。一般式(csa-3)中、Rcaは式(ca3)中におけるものと同じ意味を表す。
 「SiO1.5」は、ポリシルセスキオキサン中のシロキサン結合(Si-O-Si)により構成される構造部分(シルセスキオキサン単位)を表す。
 ポリシルセスキオキサンとは、加水分解性三官能シラン化合物に由来するシロキサン構成単位を有するネットワーク型ポリマー又は多面体クラスターであり、シロキサン結合によって、ランダム構造、ラダー構造、ケージ構造などを形成し得る。
 以下、本明細書に記載されている「SiO1.5」も上記と同様である。
In general formulas (csa-1) to (csa- 3 ), L5 represents a single bond or a divalent linking group. In general formula (csa-3), Rca has the same meaning as in formula (ca3).
“SiO 1.5 ” represents a structural portion (silsesquioxane unit) composed of siloxane bonds (Si—O—Si) in polysilsesquioxane.
Polysilsesquioxane is a network-type polymer or polyhedral cluster having siloxane structural units derived from a hydrolyzable trifunctional silane compound, and can form a random structure, ladder structure, cage structure, etc. by siloxane bonds.
Hereinafter, "SiO 1.5 " described in this specification is the same as above.
 一般式(csa-1)~(csa-3)中、Lは単結合又は2価の連結基を表す。Lが2価の連結基を表す場合、-O-、-CO-、-COO-、-S-、-SO-、-NR-、炭素数1~20の有機連結基(例えば、置換基を有してもよいアルキレン基、置換基を有してもよいシクロアルキレン基、置換基を有してもよいアリーレン基など)、又はこれらを2つ以上組み合わせてなる連結基などが挙げられる。上記Rは水素原子又は置換基を表す。
 Lは単結合、又は、炭素数1~10のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることが好ましく、単結合、又は、炭素数1~6のアルキレン基、-O-、-CO-、-COO-、-S-若しくはこれらを2つ以上組み合わせてなる連結基であることがより好ましい。
In general formulas (csa-1) to (csa- 3 ), L5 represents a single bond or a divalent linking group. When L 5 represents a divalent linking group, -O-, -CO-, -COO-, -S-, -SO 2 -, -NR-, an organic linking group having 1 to 20 carbon atoms (e.g., substituted an alkylene group optionally having a group, a cycloalkylene group optionally having a substituent, an arylene group optionally having a substituent, etc.), or a linking group formed by combining two or more of these. . R above represents a hydrogen atom or a substituent.
L 5 is preferably a single bond, an alkylene group having 1 to 10 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these. More preferably, it is a bond, an alkylene group having 1 to 6 carbon atoms, —O—, —CO—, —COO—, —S—, or a linking group formed by combining two or more of these.
 一般式(csa-3)中、Rcaは式(ca3)中におけるものと同じ意味を表し、具体例及び好ましい範囲も同じである。 In general formula (csa-3), Rca has the same meaning as in formula (ca3), and specific examples and preferred ranges are also the same.
 ポリオルガノシルセスキオキサン(a1)における前述の一般式(csa-1)~(csa-3)のいずれかで表される構成単位の含有量は、ポリオルガノシルセスキオキサン(a1)に含まれる構成単位の全体に対して、50モル%以上100モル%以下であることが好ましく、70モル%以上100モル%以下であることがより好ましく、90モル%以上100モル%以下であることが更に好ましい。 The content of the structural unit represented by any of the above general formulas (csa-1) to (csa-3) in the polyorganosilsesquioxane (a1) is included in the polyorganosilsesquioxane (a1). It is preferably 50 mol% or more and 100 mol% or less, more preferably 70 mol% or more and 100 mol% or less, and 90 mol% or more and 100 mol% or less with respect to the entire structural unit. More preferred.
 ポリオルガノシルセスキオキサン(a1)は、上記一般式(csa-1)~(csa-3)のいずれかで表される構成単位に加えて、その他の任意の構成単位を有していても良い。 The polyorganosilsesquioxane (a1) may have any other structural unit in addition to the structural units represented by any of the general formulas (csa-1) to (csa-3). good.
 ポリオルガノシルセスキオキサン(a1)のゲル浸透クロマトグラフィー(GPC)による標準ポリスチレン換算の数平均分子量(Mn)は、好ましくは500~6000であり、より好ましくは1000~4500であり、更に好ましくは1500~3000である。 The polyorganosilsesquioxane (a1) has a standard polystyrene-equivalent number average molecular weight (Mn) measured by gel permeation chromatography (GPC), preferably 500 to 6000, more preferably 1000 to 4500, still more preferably 1500-3000.
 ポリオルガノシルセスキオキサン(a1)のGPCによる標準ポリスチレン換算の分子量分散度(Mw/Mn)は、例えば1.0~4.0であり、好ましくは1.1~3.7であり、より好ましくは1.2~3.0であり、さらに好ましくは1.3~2.5である。Mwは重量平均分子量を表し、Mnは数平均分子量を表す。 The polyorganosilsesquioxane (a1) has a standard polystyrene-equivalent molecular weight dispersity (Mw/Mn) measured by GPC, for example, 1.0 to 4.0, preferably 1.1 to 3.7, and more It is preferably 1.2 to 3.0, more preferably 1.3 to 2.5. Mw represents the weight average molecular weight and Mn represents the number average molecular weight.
 ポリオルガノシルセスキオキサン(a1)の重量平均分子量及び分子量分散度の測定方法は、前述のポリマー(S)の重量平均分子量及び分子量分散度の測定方法と同様である。 The method for measuring the weight average molecular weight and molecular weight dispersity of the polyorganosilsesquioxane (a1) is the same as the method for measuring the weight average molecular weight and molecular weight dispersity of the polymer (S) described above.
 ポリオルガノシルセスキオキサン(a1)は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。 Only one type of polyorganosilsesquioxane (a1) may be used, or two or more types having different structures may be used in combination.
 本発明の硬化性樹脂組成物におけるポリオルガノシルセスキオキサン(a1)の含有率は、特に限定されないが、硬化性樹脂組成物の全固形分に対して、50質量%以上とすることができ、70質量%以上とすることができ、80質量%以上とすることができる。硬化性樹脂組成物におけるポリオルガノシルセスキオキサン(a1)の含有率の上限は、特に限定されないが、99.999質量%以下とすることができ、99.99質量%以下とすることができ、99.9質量%以下とすることができる。
 なお、全固形分とは溶媒以外の全成分のことである。
The content of the polyorganosilsesquioxane (a1) in the curable resin composition of the present invention is not particularly limited, but may be 50% by mass or more with respect to the total solid content of the curable resin composition. , 70% by mass or more, and may be 80% by mass or more. The upper limit of the content of the polyorganosilsesquioxane (a1) in the curable resin composition is not particularly limited, but it can be 99.999% by mass or less, and can be 99.99% by mass or less. , 99.9% by mass or less.
In addition, the total solid content means all components other than the solvent.
(ラジカル重合開始剤)
 本発明の硬化性樹脂組成物は、ラジカル重合開始剤を含んでいても良い。
 ラジカル重合開始剤は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。また、ラジカル重合開始剤は光重合開始剤でも良く、熱重合開始剤でも良い。
 本発明の硬化性樹脂組成物中のラジカル重合開始剤の含有率は、特に限定されるものではないが、例えばポリマー(S)100質量部に対して、0.1~500質量部が好ましく、0.5~20質量部がより好ましい。
(Radical polymerization initiator)
The curable resin composition of the present invention may contain a radical polymerization initiator.
One radical polymerization initiator may be used alone, or two or more different structures may be used in combination. Further, the radical polymerization initiator may be a photopolymerization initiator or a thermal polymerization initiator.
The content of the radical polymerization initiator in the curable resin composition of the present invention is not particularly limited, but is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of polymer (S), 0.5 to 20 parts by mass is more preferable.
(カチオン重合開始剤)
 本発明の硬化性樹脂組成物は、カチオン重合開始剤を含んでいても良い。
 カチオン重合開始剤は、光カチオン重合開始剤であっても良いし、熱カチオン重合開始剤であっても良い。
 カチオン重合開始剤としては、特に限定されないが、例えば、スルホニウム塩、アンモニウム塩、ヨードニウム塩(例えばジアリールヨードニウム塩)、トリアリールスルホニウム塩、ジアゾニウム塩、イミニウム塩などが挙げられる。より具体的には、例えば、芳香族スルホニウム、芳香族ヨードニウム、芳香族ジアゾニウム及びピリジニウムから選ばれる少なくとも1種のカチオンと、BF 、PF 、SbF 、AsF 、CFSO 、(CFSO及びB(C から選ばれる少なくとも1種のアニオンとから構成されるオニウム塩、アルミニウム錯体等のカチオン重合開始剤が挙げられる。
 カチオン重合開始剤は、公知の方法で合成可能であり、市販品としても入手可能である。市販品としては、例えば、日本曹達社製CI-1370、CI-2064、CI-2397、CI-2624、CI-2639、CI-2734、CI-2758、CI-2823、CI-2855およびCI-5102等、ローディア社製PHOTOINITIATOR2047等、ユニオンカーバイト社製UVI-6974、UVI-6990、サンアプロ社製CPI-10P、CPI-100P、CPI-101P、CPI-110P、TA-100等、三新化学工業社製サンエイドSI-B2A、サンエイドSI-B3A等を挙げることができる。
(Cationic polymerization initiator)
The curable resin composition of the present invention may contain a cationic polymerization initiator.
The cationic polymerization initiator may be a photocationic polymerization initiator or a thermal cationic polymerization initiator.
Examples of cationic polymerization initiators include, but are not limited to, sulfonium salts, ammonium salts, iodonium salts (eg, diaryliodonium salts), triarylsulfonium salts, diazonium salts, and iminium salts. More specifically, for example, at least one cation selected from aromatic sulfonium, aromatic iodonium, aromatic diazonium and pyridinium, and BF 4 , PF 6 , SbF 6 , AsF 6 , CF 3 SO 3 , (CF 3 SO 2 ) 2 N and at least one anion selected from B(C 6 F 5 ) 4 , and cationic polymerization initiators such as onium salts and aluminum complexes.
A cationic polymerization initiator can be synthesized by a known method and is also available as a commercial product. Commercially available products include, for example, CI-1370, CI-2064, CI-2397, CI-2624, CI-2639, CI-2734, CI-2758, CI-2823, CI-2855 and CI-5102 manufactured by Nippon Soda Co., Ltd. etc., PHOTOINITIATOR 2047 manufactured by Rhodia, etc., UVI-6974, UVI-6990 manufactured by Union Carbite, CPI-10P, CPI-100P, CPI-101P, CPI-110P, TA-100 manufactured by Sun-Apro, etc., Sanshin Chemical Industry Co., Ltd. San-Aid SI-B2A, San-Aid SI-B3A and the like manufactured by San-Aid Co., Ltd. can be mentioned.
 ヨードニウム塩系の光カチオン重合開始剤の具体的な市販品としては、例えば、東京化成社製B2380、みどり化学社製BBI-102、富士フイルム和光純薬製WPI-113、富士フイルム和光純薬製WPI-124、富士フイルム和光純薬製WPI-169、富士フイルム和光純薬製WPI-170、東洋合成化学社製DTBPI-PFBSを挙げることができる。 Specific commercial products of the iodonium salt-based photocationic polymerization initiator include, for example, B2380 manufactured by Tokyo Chemical Co., Ltd., BBI-102 manufactured by Midori Chemical Co., Ltd., WPI-113 manufactured by Fuji Film Wako Pure Chemical, and manufactured by Fuji Film Wako Pure Chemical. WPI-124, WPI-169 manufactured by Fuji Film Wako Pure Chemical, WPI-170 manufactured by Fuji Film Wako Pure Chemical, and DTBPI-PFBS manufactured by Toyo Gosei Chemical Co., Ltd. can be mentioned.
 カチオン重合開始剤は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。
 本発明の硬化性樹脂組成物中のカチオン重合開始剤の含有率は、特に限定されるものではないが、例えばポリオルガノシルセスキオキサン(a1)100質量部に対して、0.1~200質量部が好ましく、1~50質量部がより好ましい。
Only one type of cationic polymerization initiator may be used, or two or more types having different structures may be used in combination.
The content of the cationic polymerization initiator in the curable resin composition of the present invention is not particularly limited. Parts by mass are preferable, and 1 to 50 parts by mass are more preferable.
(溶媒)
 本発明の硬化性樹脂組成物は、溶媒を含んでいてもよい。
 溶媒としては、有機溶媒が好ましく、有機溶媒の一種又は二種以上を任意の割合で混合して用いることができる。有機溶媒の具体例としては、例えば、メタノール、エタノール、プロパノール、n-ブタノール、i-ブタノール等のアルコール類;アセトン、メチルイソブチルケトン、メチルエチルケトン、シクロヘキサノン等のケトン類;エチルセロソルブ等のセロソルブ類;トルエン、キシレン等の芳香族類;プロピレングリコールモノメチルエーテル等のグリコールエーテル類;酢酸メチル、酢酸エチル、酢酸ブチル等の酢酸エステル類;ジアセトンアルコール等が挙げられる。
 本発明の硬化性樹脂組成物における溶媒の含有率は、硬化性樹脂組成物の塗布適性を確保できる範囲で適宜調整することができる。例えば、硬化性樹脂組成物の全固形分100質量部に対して、50~500質量部とすることができ、好ましくは80~200質量部とすることができる。
 硬化性樹脂組成物は、通常、液の形態をとる。
 硬化性樹脂組成物の固形分の濃度は、通常、10~90質量%であり、好ましくは20~80質量%であり、特に好ましくは40~75質量%である。
(solvent)
The curable resin composition of the present invention may contain a solvent.
As the solvent, an organic solvent is preferable, and one or two or more organic solvents can be mixed in an arbitrary ratio and used. Specific examples of organic solvents include alcohols such as methanol, ethanol, propanol, n-butanol and i-butanol; ketones such as acetone, methyl isobutyl ketone, methyl ethyl ketone and cyclohexanone; cellosolves such as ethyl cellosolve; toluene. , xylene and the like; glycol ethers such as propylene glycol monomethyl ether; acetic esters such as methyl acetate, ethyl acetate and butyl acetate; diacetone alcohol and the like.
The content of the solvent in the curable resin composition of the present invention can be appropriately adjusted within a range in which the coating suitability of the curable resin composition can be ensured. For example, it can be 50 to 500 parts by mass, preferably 80 to 200 parts by mass, per 100 parts by mass of the total solid content of the curable resin composition.
A curable resin composition is usually in the form of a liquid.
The solid content concentration of the curable resin composition is usually 10 to 90% by mass, preferably 20 to 80% by mass, and particularly preferably 40 to 75% by mass.
 本発明の硬化性樹脂組成物は、上記以外の成分を含有していてもよく、例えば、無機微粒子、分散剤、レベリング剤、防汚剤、帯電防止剤、紫外線吸収剤、酸化防止剤等を含有していてもよい。 The curable resin composition of the present invention may contain components other than those described above. may contain.
 本発明の硬化性樹脂組成物は、以上説明した各種成分を同時に、または任意の順序で順次混合することにより調製することができる。調製方法は特に限定されるものではなく、調製には公知の攪拌機等を用いることができる。 The curable resin composition of the present invention can be prepared by mixing the various components described above simultaneously or sequentially in any order. The preparation method is not particularly limited, and a known stirrer or the like can be used for preparation.
[ハードコートフィルム]
 本発明のハードコートフィルムは、基材(好ましくはプラスチック基材)と、前述の本発明の硬化性樹脂組成物から形成されたハードコート層とを含むハードコートフィルムである。
[Hard coat film]
The hard coat film of the present invention is a hard coat film comprising a substrate (preferably a plastic substrate) and a hard coat layer formed from the curable resin composition of the present invention described above.
(ハードコート層の膜厚)
 本発明の硬化性樹脂組成物により形成することができるハードコート層の膜厚は特に限定されないが、0.5~30μmであることが好ましく、1~25μmであることがより好ましく、2~20μmであることが更に好ましい。
 ハードコート層の膜厚は、積層体の断面を光学顕微鏡で観察して算出する。断面試料は、断面切削装置ウルトラミクロトームを用いたミクロトーム法や、集束イオンビーム(FIB)装置を用いた断面加工法などにより作成できる。
(Film thickness of hard coat layer)
The thickness of the hard coat layer that can be formed from the curable resin composition of the present invention is not particularly limited, but is preferably 0.5 to 30 μm, more preferably 1 to 25 μm, and more preferably 2 to 20 μm. is more preferable.
The film thickness of the hard coat layer is calculated by observing the cross section of the laminate with an optical microscope. A cross-section sample can be prepared by a microtome method using a cross-section cutting device ultramicrotome, a cross-section processing method using a focused ion beam (FIB) device, or the like.
<基材>
 本発明の硬化性樹脂組成物は、基材上に塗布して、塗膜を硬化することで、ハードコート層とすることができる。
 ハードコートフィルムに用いられる基材は、可視光領域の透過率が70%以上であることが好ましく、80%以上であることがより好ましく、90%以上であることが更に好ましい。
<Base material>
The curable resin composition of the present invention can be applied onto a substrate and cured to form a hard coat layer.
The substrate used for the hard coat film preferably has a transmittance in the visible light region of 70% or more, more preferably 80% or more, and even more preferably 90% or more.
(ポリマー)
 基材はプラスチック基材であることが好ましく、ポリマーを含むことが好ましい。
 ポリマーとしては、光学的な透明性、機械的強度、熱安定性などに優れるポリマーが好ましい。
(polymer)
The substrate is preferably a plastic substrate and preferably comprises a polymer.
As the polymer, a polymer excellent in optical transparency, mechanical strength, thermal stability and the like is preferable.
 ポリマーとしては、例えば、ポリカーボネート系ポリマー、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)等のポリエステル系ポリマー、ポリスチレン、アクリロニトリル・スチレン共重合体(AS樹脂)等のスチレン系ポリマーなどが挙げられる。また、ポリエチレン、ポリプロピレン等のポリオレフィン、ノルボルネン系樹脂、エチレン・プロピレン共重合体などのポリオレフィン系ポリマー、ポリメチルメタクリレート等の(メタ)アクリル系ポリマー、塩化ビニル系ポリマー、ナイロン、芳香族ポリアミド等のアミド系ポリマー、イミド系ポリマー、スルホン系ポリマー、ポリエーテルスルホン系ポリマー、ポリエーテルエーテルケトン系ポリマー、ポリフェニレンスルフィド系ポリマー、塩化ビニリデン系ポリマー、ビニルアルコール系ポリマー、ビニルブチラール系ポリマー、アリレート系ポリマー、ポリオキシメチレン系ポリマー、エポキシ系ポリマー、トリアセチルセルロースに代表されるセルロース系ポリマー、又は上記ポリマー同士の共重合体、上記ポリマー同士を混合したポリマーも挙げられる。 Examples of polymers include polycarbonate-based polymers, polyester-based polymers such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and styrene-based polymers such as polystyrene and acrylonitrile-styrene copolymer (AS resin). Polyolefins such as polyethylene and polypropylene, norbornene resins, polyolefin polymers such as ethylene/propylene copolymers, (meth)acrylic polymers such as polymethyl methacrylate, vinyl chloride polymers, nylon, and amides such as aromatic polyamides. -based polymer, imide-based polymer, sulfone-based polymer, polyethersulfone-based polymer, polyetheretherketone-based polymer, polyphenylene sulfide-based polymer, vinylidene chloride-based polymer, vinyl alcohol-based polymer, vinyl butyral-based polymer, arylate-based polymer, polyoxy A methylene-based polymer, an epoxy-based polymer, a cellulose-based polymer represented by triacetyl cellulose, a copolymer of the above-mentioned polymers, and a polymer obtained by mixing the above-mentioned polymers are also included.
 特に、芳香族ポリアミド等のアミド系ポリマー及びイミド系ポリマーは、JIS(日本工業規格) P8115(2001)に従いMIT試験機によって測定した破断折り曲げ回数が大きく、硬度も比較的高いことから、基材として好ましく用いることができる。例えば、特許第5699454号公報の実施例1にあるような芳香族ポリアミド、特表2015-508345号公報、特表2016-521216号公報、及びWO2017/014287号公報に記載のポリイミドを基材として好ましく用いることができる。
 アミド系ポリマーとしては、芳香族ポリアミド(アラミド系ポリマー)が好ましい。
 基材は、イミド系ポリマー及びアラミド系ポリマーから選ばれる少なくとも1種のポリマーを含有することが好ましい。
In particular, amide-based polymers such as aromatic polyamides and imide-based polymers have a large number of times of breaking and bending measured by an MIT tester according to JIS (Japanese Industrial Standards) P8115 (2001), and have relatively high hardness. It can be preferably used. For example, aromatic polyamides such as those described in Example 1 of Japanese Patent No. 5699454, JP-T-2015-508345, JP-T-2016-521216, and polyimides described in WO2017/014287 are preferably used as a base material. can be used.
As the amide-based polymer, aromatic polyamide (aramid-based polymer) is preferable.
The substrate preferably contains at least one polymer selected from imide-based polymers and aramid-based polymers.
(基材の厚み)
 基材はフィルム状であることが好ましい。
 基材の厚みは、100μm以下であることがより好ましく、80μm以下であることが更に好ましく、50μm以下が最も好ましい。また、基材の取り扱いの容易さの観点から基材の厚みは3μm以上であることが好ましく、5μm以上であることがより好ましく、15μm以上が最も好ましい。
(Thickness of base material)
The substrate is preferably film-like.
The thickness of the substrate is more preferably 100 μm or less, still more preferably 80 μm or less, and most preferably 50 μm or less. From the viewpoint of ease of handling of the substrate, the thickness of the substrate is preferably 3 μm or more, more preferably 5 μm or more, and most preferably 15 μm or more.
(耐擦傷性)
 本発明のハードコートフィルムは耐擦傷性に優れる。
 耐擦傷性の指標として、本発明のハードコートフィルムのハードコート層の表面を、ラビングテスターを用いて、以下の条件で擦り試験を行った場合、往復50回擦った場合に傷が生じないことが好ましく、往復100回擦った場合に傷が生じないことがより好ましく、往復300回擦った場合に傷が生じないことが更に好ましい。
 評価環境条件:25℃、相対湿度60%
 擦り材:スチールウール(日本スチールウール(株)製、グレードNo.#0000番)
 試料と接触するテスターの擦り先端部(1cm×1cm)に巻いて、バンド固定
 移動距離(片道):13cm
 擦り速度:13cm/秒
 荷重:100g/cm
 先端部接触面積:1cm×1cm
 擦り回数:往復50回、往復100回、往復300回
 試験後のハードコートフィルムの擦った面(ハードコート層の表面)とは逆側の面(基材の表面)に油性黒インキを塗り、反射光で目視観察して、スチールウールと接触していた部分に傷が生じたときの擦り回数を計測し評価する。
(Scratch resistance)
The hard coat film of the present invention has excellent scratch resistance.
As an index of scratch resistance, the surface of the hard coat layer of the hard coat film of the present invention was subjected to a rubbing test using a rubbing tester under the following conditions. It is more preferable that no scratch occurs when rubbed back and forth 100 times, and more preferably no scratch occurs when rubbed back and forth 300 times.
Evaluation environment conditions: 25°C, relative humidity 60%
Rubbing material: steel wool (manufactured by Japan Steel Wool Co., Ltd., grade No. #0000)
Wrap around the rubbing tip (1 cm x 1 cm) of the tester in contact with the sample and fix the band Moving distance (one way): 13 cm
Rubbing speed: 13 cm/sec Load: 100 g/cm 2
Tip contact area: 1 cm x 1 cm
Number of times of rubbing: 50 times reciprocating, 100 times reciprocating, 300 times reciprocating After the test, the surface of the hard coat film opposite to the rubbed surface (surface of the hard coat layer) (surface of base material) is painted with oil-based black ink, It is visually observed with reflected light, and the number of times of rubbing when a scratch occurs in the portion in contact with the steel wool is counted and evaluated.
<耐擦傷層>
 本発明のハードコートフィルムは、更に、耐擦傷層を有していてもよい。本発明のハードコートフィルムが耐擦傷層を有する場合、基材、ハードコート層、耐擦傷層をこの順に有することが好ましい。
 耐擦傷層は、特に限定されないが、好ましくは、ラジカル重合性化合物(c1)を含む耐擦傷層形成用組成物を硬化してなる層である。
<Scratch resistant layer>
The hard coat film of the present invention may further have a scratch resistant layer. When the hard coat film of the present invention has a scratch resistant layer, it preferably has a substrate, a hard coat layer, and a scratch resistant layer in this order.
Although the scratch-resistant layer is not particularly limited, it is preferably a layer obtained by curing a composition for forming a scratch-resistant layer containing the radically polymerizable compound (c1).
(ラジカル重合性化合物(c1))
 ラジカル重合性化合物(c1)(「化合物(c1)」ともいう。)について説明する。
 化合物(c1)は、ラジカル重合性基を有する化合物である。
 化合物(c1)におけるラジカル重合性基としては、特に限定されず、一般に知られているラジカル重合性基を用いることができる。ラジカル重合性基としては、重合性不飽和基が挙げられ、具体的には、(メタ)アクリロイル基、ビニル基、アリル基などが挙げられ、(メタ)アクリロイル基が好ましい。なお、上記した各基は置換基を有していてもよい。
 化合物(c1)は、1分子中に2個以上の(メタ)アクリロイル基を有する化合物であることが好ましく、1分子中に3個以上の(メタ)アクリロイル基を有する化合物であることがより好ましい。
 化合物(c1)の分子量は特に限定されず、モノマーでもよいし、オリゴマーでもよいし、ポリマーでもよい。
(Radical polymerizable compound (c1))
The radically polymerizable compound (c1) (also referred to as “compound (c1)”) will be described.
Compound (c1) is a compound having a radically polymerizable group.
The radically polymerizable group in the compound (c1) is not particularly limited, and generally known radically polymerizable groups can be used. The radically polymerizable group includes a polymerizable unsaturated group, specifically a (meth)acryloyl group, a vinyl group, an allyl group, and the like, preferably a (meth)acryloyl group. In addition, each group described above may have a substituent.
Compound (c1) is preferably a compound having two or more (meth)acryloyl groups in one molecule, more preferably a compound having three or more (meth)acryloyl groups in one molecule. .
The molecular weight of compound (c1) is not particularly limited, and may be a monomer, an oligomer, or a polymer.
 化合物(c1)は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。 Only one type of compound (c1) may be used, or two or more types having different structures may be used in combination.
 耐擦傷層形成用組成物中の化合物(c1)の含有率は、耐擦傷層形成用組成物中の全固形分に対して、80質量%以上であることが好ましく、85質量%以上がより好ましく、90質量%以上が更に好ましい。 The content of the compound (c1) in the scratch-resistant layer-forming composition is preferably 80% by mass or more, more preferably 85% by mass or more, based on the total solid content in the scratch-resistant layer-forming composition. Preferably, 90% by mass or more is more preferable.
(ラジカル重合開始剤)
 耐擦傷層形成用組成物は、ラジカル重合開始剤を含むことが好ましい。
 ラジカル重合開始剤は一種のみ用いてもよく、構造の異なる二種以上を併用してもよい。また、ラジカル重合開始剤は光重合開始剤でも良く、熱重合開始剤でも良い。
 耐擦傷層形成用組成物中のラジカル重合開始剤の含有率は、特に限定されるものではないが、例えば化合物(c1)100質量部に対して、0.1~200質量部が好ましく、1~50質量部がより好ましい。
(Radical polymerization initiator)
The scratch-resistant layer-forming composition preferably contains a radical polymerization initiator.
One radical polymerization initiator may be used alone, or two or more different structures may be used in combination. Further, the radical polymerization initiator may be a photopolymerization initiator or a thermal polymerization initiator.
The content of the radical polymerization initiator in the scratch-resistant layer-forming composition is not particularly limited. ~50 parts by mass is more preferable.
(溶媒)
 耐擦傷層形成用組成物は、溶媒を含んでいてもよい。
 溶媒としては、前述の硬化性樹脂組成物が含んでいてもよい溶媒と同様である。
 本発明における耐擦傷層形成用組成物における溶媒の含有率は、耐擦傷層形成用組成物の塗布適性を確保できる範囲で適宜調整することができる。例えば、耐擦傷層形成用組成物の全固形分100質量部に対して、50~500質量部とすることができ、好ましくは80~200質量部とすることができる。
 耐擦傷層形成用組成物は、通常、液の形態をとる。
 耐擦傷層形成用組成物の固形分の濃度は、通常、10~90質量%であり、好ましくは15~80質量%であり、特に好ましくは20~70質量%である。
(solvent)
The scratch-resistant layer-forming composition may contain a solvent.
The solvent is the same as the solvent that the curable resin composition may contain.
The content of the solvent in the composition for forming a scratch resistant layer in the present invention can be appropriately adjusted within a range in which the applicability of the composition for forming a scratch resistant layer can be ensured. For example, it can be 50 to 500 parts by mass, preferably 80 to 200 parts by mass, per 100 parts by mass of the total solid content of the scratch-resistant layer-forming composition.
The scratch-resistant layer-forming composition usually takes the form of a liquid.
The concentration of the solid content of the scratch-resistant layer-forming composition is usually 10 to 90% by mass, preferably 15 to 80% by mass, and particularly preferably 20 to 70% by mass.
(その他添加剤)
 耐擦傷層形成用組成物は、上記以外の成分を含有していてもよく、たとえば、無機粒子、レベリング剤、防汚剤、帯電防止剤、滑り剤、溶媒等を含有していてもよい。
(Other additives)
The scratch-resistant layer-forming composition may contain components other than those described above, such as inorganic particles, leveling agents, antifouling agents, antistatic agents, slip agents, and solvents.
(耐擦傷層の膜厚)
 耐擦傷層の膜厚は、繰り返し折り曲げ耐性の観点から、3.0μm未満であることが好ましく、0.1~2.0μmであることがより好ましく、0.1~1.0μmであることが更に好ましい。
(Film thickness of scratch resistant layer)
From the viewpoint of resistance to repeated bending, the thickness of the scratch-resistant layer is preferably less than 3.0 μm, more preferably 0.1 to 2.0 μm, and more preferably 0.1 to 1.0 μm. More preferred.
<ハードコートフィルムの製造方法>
 本発明のハードコートフィルムの製造方法について説明する。
 本発明のハードコートフィルムの製造方法は、基材とハードコート層とを含むハードコートフィルムの製造方法であって、本発明の硬化性樹脂組成物を基材上に塗布して塗膜を形成し、塗膜に硬化処理を施すことによりハードコート層を形成する、ハードコートフィルムの製造方法であることが好ましい。
<Method for producing hard coat film>
A method for producing the hard coat film of the present invention will be described.
The method for producing a hard coat film of the present invention is a method for producing a hard coat film including a substrate and a hard coat layer, and the curable resin composition of the present invention is applied onto the substrate to form a coating film. Preferably, the method for producing a hard coat film comprises forming a hard coat layer by subjecting the coating film to a curing treatment.
 上記基材については前述したとおりである。 The base material is as described above.
 上記硬化処理は、光及び熱の少なくとも一方による硬化処理であることが好ましく、硬化反応率を高めることができるという理由から、光と熱による硬化処理であることがより好ましい。光による硬化処理とは、光(好ましくは電離放射線)の照射によって重合反応を進行させる処理である。熱による硬化処理とは、加熱によって重合反応を進行させる処理である。 The curing treatment is preferably a curing treatment using at least one of light and heat, and more preferably a curing treatment using light and heat because the curing reaction rate can be increased. Curing treatment with light is treatment in which a polymerization reaction proceeds by irradiation with light (preferably ionizing radiation). The curing treatment by heat is a treatment for promoting a polymerization reaction by heating.
 硬化性樹脂組成物の塗布方法としては、特に限定されず公知の方法を用いることができる。例えば、ディップコート法、エアーナイフコート法、カーテンコート法、ローラーコート法、ワイヤーバーコート法、グラビアコート法、ダイコート法等が挙げられる。 The method of applying the curable resin composition is not particularly limited, and known methods can be used. Examples thereof include dip coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating and die coating.
 光(好ましくは電離放射線)の種類については、特に制限はなく、X線、電子線、紫外線、可視光、赤外線などが挙げられるが、紫外線が好ましく用いられる。例えばハードコート層塗膜が紫外線硬化性であれば、紫外線ランプにより10mJ/cm~2000mJ/cmの照射量の紫外線を照射して硬化性化合物を半硬化するのが好ましい。50mJ/cm~1800mJ/cmであることがより好ましく、100mJ/cm~1500mJ/cmであることが更に好ましい。紫外線ランプ種としては、メタルハライドランプや高圧水銀ランプ等が好適に用いられる。 The type of light (preferably ionizing radiation) is not particularly limited and includes X-rays, electron beams, ultraviolet rays, visible light, infrared rays and the like, but ultraviolet rays are preferably used. For example, if the hard coat layer coating film is UV curable, it is preferable to semi-cure the curable compound by irradiating UV rays with an irradiation dose of 10 mJ/cm 2 to 2000 mJ/cm 2 from an UV lamp. It is more preferably 50 mJ/cm 2 to 1800 mJ/cm 2 and even more preferably 100 mJ/cm 2 to 1500 mJ/cm 2 . A metal halide lamp, a high-pressure mercury lamp, or the like is preferably used as the type of ultraviolet lamp.
 熱により硬化する場合、ハードコート層塗膜が加熱されることにより到達する温度に特に制限はないが、80℃以上200℃以下であることが好ましく、100℃以上180℃以下であることがより好ましく、120℃以上160℃以下であることがさらに好ましい。 In the case of thermal curing, the temperature reached by heating the hard coat layer is not particularly limited, but is preferably 80° C. or higher and 200° C. or lower, more preferably 100° C. or higher and 180° C. or lower. It is preferably 120° C. or higher and 160° C. or lower, more preferably.
 硬化時の酸素濃度は0~1.0体積%であることが好ましく、0~0.1体積%であることが更に好ましく、0~0.05体積%であることが最も好ましい。 The oxygen concentration during curing is preferably 0 to 1.0% by volume, more preferably 0 to 0.1% by volume, and most preferably 0 to 0.05% by volume.
 本発明のハードコートフィルムは、表面の面状及び耐擦傷性に優れるものであり、例えば、光学フィルムとして用いることができる。また、本発明のハードコートフィルムは、画像表示装置の表面保護フィルム(画像表示装置用表面保護フィルム)として用いることができる。画像表示装置用表面保護フィルムは、画像表示装置の表示面(ディスプレイ表面)を保護するために、画像表示装置の表面に配置される保護フィルムである。 The hard coat film of the present invention has excellent surface properties and scratch resistance, and can be used, for example, as an optical film. Further, the hard coat film of the present invention can be used as a surface protective film for image display devices (surface protective film for image display devices). A surface protective film for an image display device is a protective film placed on the surface of an image display device in order to protect the display surface (display surface) of the image display device.
 本発明は、本発明のハードコートフィルムを備えた物品、及び本発明のハードコートフィルムを表面保護フィルムとして備えた画像表示装置にも関する。 The present invention also relates to an article provided with the hard coat film of the present invention and an image display apparatus provided with the hard coat film of the present invention as a surface protection film.
 以下、実施例により本発明を更に具体的に説明するが、本発明の範囲はこれによって限定して解釈されるものではない。 The present invention will be described in more detail below with reference to examples, but the scope of the present invention should not be construed as being limited by these examples.
<モノマーm1の合成>
 攪拌機及び滴下ロートを設置した2L反応器内に、グリセリンモノメタクリレート100g、N,N-ジメチルアセトアミド544gを仕込み、反応器内を0℃に冷却しながら、3-クロロプロピオン酸クロライド237.8gを1時間かけて滴下ロートで滴下した。室温に昇温した後、25℃で4時間攪拌して反応させた。得られた反応液を炭酸水素ナトリウム水溶液及び飽和食塩水で順次洗浄した後に減圧濃縮し、シリカゲルカラムクロマトグラフィーで精製することにより、下記式m1で表されるモノマーm1を191g得た(収率90%)。
<Synthesis of Monomer m1>
A 2 L reactor equipped with a stirrer and a dropping funnel was charged with 100 g of glycerin monomethacrylate and 544 g of N,N-dimethylacetamide. It was added dropwise with a dropping funnel over a period of time. After raising the temperature to room temperature, the mixture was stirred at 25° C. for 4 hours to react. The resulting reaction solution was washed successively with an aqueous sodium hydrogencarbonate solution and saturated brine, concentrated under reduced pressure, and purified by silica gel column chromatography to obtain 191 g of a monomer m1 represented by the following formula m1 (yield: 90 %).
Figure JPOXMLDOC01-appb-C000053
Figure JPOXMLDOC01-appb-C000053
<モノマーm2の合成>
 下記スキームに従い、下記式m2で表されるモノマーm2を合成した。
<Synthesis of monomer m2>
A monomer m2 represented by the following formula m2 was synthesized according to the following scheme.
Figure JPOXMLDOC01-appb-C000054
Figure JPOXMLDOC01-appb-C000054
 <bの合成>
 2000mLナスフラスコに、2-アセチルブチロラクトン(上記スキーム中、式aで表される化合物)200g、臭化水素水溶液(48%)320g、トルエン300mLを量りとり、60℃で1時間撹拌した。反応液を室温まで冷却し、分液ロートに移しヘキサン100mLを加えた。チオ硫酸ナトリウム10gを加えた飽和炭酸水素ナトリウム水100mLと飽和食塩水100mLで分液洗浄し、得られた有機層を無水硫酸マグネシウムで乾燥し、濃縮することで褐色液体として化合物b(上記スキーム中、式bで表される化合物)を260.0g得た。
<Synthesis of b>
200 g of 2-acetylbutyrolactone (compound represented by formula a in the above scheme), 320 g of hydrogen bromide aqueous solution (48%) and 300 mL of toluene were weighed into a 2000 mL eggplant flask and stirred at 60° C. for 1 hour. The reaction solution was cooled to room temperature, transferred to a separating funnel, and 100 mL of hexane was added. The resulting organic layer was washed with 100 mL of saturated sodium bicarbonate solution containing 10 g of sodium thiosulfate and 100 mL of saturated brine, dried over anhydrous magnesium sulfate, and concentrated to give compound b as a brown liquid ( , the compound represented by the formula b) was obtained in an amount of 260.0 g.
<cの合成>
 2000mLナスフラスコに、化合物bを256g、ギ酸トリメチル165.6g、p-トルエンスルホン酸一水和物9g、メタノール400mLを量り取り、室温で1時間攪拌した。ジイソプロピルエチルアミン15mLを加え、エバポレーターにて溶媒を留去した。ヘキサン500mL、酢酸エチル50mLを加え、分液ロートに移し、飽和炭酸水素ナトリウム水溶液500mLで2回分液洗浄し、得られた有機層を無水硫酸マグネシウムで乾燥し、濃縮することで褐色液体として化合物c(上記スキーム中、式cで表される化合物)を248.0g得た。
<Synthesis of c>
256 g of compound b, 165.6 g of trimethyl formate, 9 g of p-toluenesulfonic acid monohydrate and 400 mL of methanol were weighed into a 2000 mL eggplant flask and stirred at room temperature for 1 hour. 15 mL of diisopropylethylamine was added, and the solvent was distilled off with an evaporator. Add 500 mL of hexane and 50 mL of ethyl acetate, transfer to a separating funnel, separate and wash twice with 500 mL of a saturated aqueous sodium hydrogen carbonate solution, dry the resulting organic layer over anhydrous magnesium sulfate, and concentrate to give compound c as a brown liquid. 248.0 g of (compound represented by formula c in the above scheme) was obtained.
<dの合成>
 500mLナスフラスコに、化合物cを50g、p-トルエンスルホン酸一水和物0.45g、1H,1H,2H,2H-パーフルオロヘキサンー1-オール172.5g、ヘキサン100mLを量り取り、77℃でディーンスタークを装着し、6時間攪拌した。 
 次いで、ジイソプロピルエチルアミン1mLを加え、エバポレーターにて溶媒を留去した。ヘキサン700mL、アセトニトリル400mLを加え、分液ロートに移し、ヘキサン層を分取しエバポレーターで濃縮することで褐色液体として化合物d(上記スキーム中、式dで表される化合物)を73.0g得た。
<Synthesis of d>
50 g of compound c, 0.45 g of p-toluenesulfonic acid monohydrate, 172.5 g of 1H,1H,2H,2H-perfluorohexan-1-ol, and 100 mL of hexane were weighed into a 500 mL eggplant flask and heated to 77°C. was fitted with a Dean Stark and stirred for 6 hours.
Then, 1 mL of diisopropylethylamine was added, and the solvent was distilled off using an evaporator. Add 700 mL of hexane and 400 mL of acetonitrile, transfer to a separating funnel, separate the hexane layer and concentrate with an evaporator to obtain 73.0 g of compound d (compound represented by formula d in the above scheme) as a brown liquid. .
<モノマーm2の合成>
 300mLナスフラスコに、化合物dを50g、ジブチルヒドロキシトルエン(BHT)を50mg、ヨウ化カリウムを1.23g、メタクリル酸ナトリウム12g、N、N-ジメチルアセトアミド50mLを量り取り、80℃で5時間攪拌した。室温まで冷却し、水200mLを加え5分間攪拌後、分液ロートに移し、ヘキサン200mL、酢酸エチル20mLを加えた。分液ロートを振盪させたのち水層を除去した。飽和塩化ナトリウム水溶液を加え、分液洗浄した。得られた有機層を無水硫酸ナトリウムで乾燥して濃縮し、カラムクロマトグラフィーを行うことで、モノマーm2を41g得た。
<Synthesis of monomer m2>
50 g of compound d, 50 mg of dibutylhydroxytoluene (BHT), 1.23 g of potassium iodide, 12 g of sodium methacrylate, and 50 mL of N,N-dimethylacetamide were weighed into a 300 mL eggplant flask and stirred at 80° C. for 5 hours. . After cooling to room temperature, 200 mL of water was added, and after stirring for 5 minutes, the mixture was transferred to a separating funnel, and 200 mL of hexane and 20 mL of ethyl acetate were added. After shaking the separating funnel, the aqueous layer was removed. A saturated sodium chloride aqueous solution was added to separate and wash. The resulting organic layer was dried over anhydrous sodium sulfate, concentrated, and subjected to column chromatography to obtain 41 g of monomer m2.
<ポリマー(S-1)の合成>
 モノマーm2を2.0g、サイクロマーM100(株式会社ダイセル製)を1.71g、モノマーm1を6.29g、メチルエチルケトン(MEK)を18.57g、2,2’-アゾビス(イソ酪酸)ジメチル(重合開始剤、富士フイルム和光純薬株式会社製)を2.85g量りとり、70℃で6時間撹拌した。
 反応後、ヘキサン500mLを用いて再沈殿した。得られた固体をMEK15gで溶解させ、トリエチルアミン11g、p-メトキシフェノール0.01gを添加後、60℃で4時間撹拌した。反応液を室温に戻した後、メタノールと水の1:1混合溶媒500mLを用いて再沈殿し、MEK25gで溶解することによりポリマー(S-1)を7.0g得た(収率70%)。
<Synthesis of polymer (S-1)>
2.0 g of monomer m2, 1.71 g of cyclomer M100 (manufactured by Daicel Co., Ltd.), 6.29 g of monomer m1, 18.57 g of methyl ethyl ketone (MEK), 2,2′-azobis(isobutyrate) dimethyl (polymerization 2.85 g of an initiator (manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.) was measured and stirred at 70° C. for 6 hours.
After the reaction, reprecipitation was performed using 500 mL of hexane. The resulting solid was dissolved in 15 g of MEK, 11 g of triethylamine and 0.01 g of p-methoxyphenol were added, and the mixture was stirred at 60° C. for 4 hours. After cooling the reaction solution to room temperature, it was reprecipitated using 500 mL of a 1:1 mixed solvent of methanol and water, and dissolved in 25 g of MEK to obtain 7.0 g of polymer (S-1) (yield 70%). .
 ポリマー(S-2)~(S-6)、(S2-1)~(S2-7)はポリマー(S-1)の合成に準じた合成法により、それぞれモノマーの種類及び量、重合開始剤の量を変更して合成した。 Polymers (S-2) to (S-6) and (S2-1) to (S2-7) are synthesized according to the synthesis method of the polymer (S-1), respectively, the type and amount of the monomer, the polymerization initiator was synthesized by changing the amount of
 使用した各ポリマーの構造式及び重量平均分子量(Mw)を以下に示す。下記構造式中の各構成単位の含有量(含有比率)は物質量基準であり、単位は「モル%」である。 The structural formula and weight average molecular weight (Mw) of each polymer used are shown below. The content (content ratio) of each structural unit in the following structural formula is based on the amount of substance, and the unit is "mol %".
Figure JPOXMLDOC01-appb-C000055
Figure JPOXMLDOC01-appb-C000055
Figure JPOXMLDOC01-appb-C000056
Figure JPOXMLDOC01-appb-C000056
Figure JPOXMLDOC01-appb-C000057
Figure JPOXMLDOC01-appb-C000057
Figure JPOXMLDOC01-appb-C000058
Figure JPOXMLDOC01-appb-C000058
Figure JPOXMLDOC01-appb-C000059
Figure JPOXMLDOC01-appb-C000059
Figure JPOXMLDOC01-appb-C000060
Figure JPOXMLDOC01-appb-C000060
Figure JPOXMLDOC01-appb-C000061
Figure JPOXMLDOC01-appb-C000061
Figure JPOXMLDOC01-appb-C000062
Figure JPOXMLDOC01-appb-C000062
Figure JPOXMLDOC01-appb-C000063
Figure JPOXMLDOC01-appb-C000063
Figure JPOXMLDOC01-appb-C000064
Figure JPOXMLDOC01-appb-C000064
Figure JPOXMLDOC01-appb-C000065
Figure JPOXMLDOC01-appb-C000065
Figure JPOXMLDOC01-appb-C000066
Figure JPOXMLDOC01-appb-C000066
Figure JPOXMLDOC01-appb-C000067
Figure JPOXMLDOC01-appb-C000067
Figure JPOXMLDOC01-appb-C000068
Figure JPOXMLDOC01-appb-C000068
Figure JPOXMLDOC01-appb-C000069
Figure JPOXMLDOC01-appb-C000069
Figure JPOXMLDOC01-appb-C000070
Figure JPOXMLDOC01-appb-C000070
Figure JPOXMLDOC01-appb-C000071
Figure JPOXMLDOC01-appb-C000071
<基材の作製>
(ポリイミド粉末の製造)
 攪拌器、窒素注入装置、滴下漏斗、温度調節器及び冷却器を取り付けた1Lの反応器に、窒素気流下、N,N-ジメチルアセトアミド(DMAc)832gを加えた後、反応器の温度を25℃にした。ここに、ビストリフルオロメチルベンジジン(TFDB)64.046g(0.2mol)を加えて溶解した。得られた溶液を25℃に維持しながら、2,2-ビス(3,4-ジカルボキシフェニル)ヘキサフルオロプロパン二無水物(6FDA)31.09g(0.07mol)とビフェニルテトラカルボン酸二無水物(BPDA)8.83g(0.03mol)を投入し、一定時間撹拌して反応させた。その後、塩化テレフタロイル(TPC)20.302g(0.1mol)を添加して、固形分濃度13質量%のポリアミック酸溶液を得た。次いで、このポリアミック酸溶液にピリジン25.6g、無水酢酸33.1gを投入して30分撹拌し、さらに70℃で1時間撹拌した後、常温に冷却した。ここにメタノール20Lを加え、沈澱した固形分を濾過して粉砕した。その後、100℃下、真空で6時間乾燥させて、111gのポリイミド粉末を得た。
<Preparation of base material>
(Manufacturing of polyimide powder)
832 g of N,N-dimethylacetamide (DMAc) was added to a 1 L reactor equipped with a stirrer, a nitrogen injector, a dropping funnel, a temperature controller and a condenser under a nitrogen stream, and then the temperature of the reactor was reduced to 25. °C. 64.046 g (0.2 mol) of bistrifluoromethylbenzidine (TFDB) was added thereto and dissolved. While maintaining the resulting solution at 25° C., 31.09 g (0.07 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and biphenyltetracarboxylic dianhydride were added. 8.83 g (0.03 mol) of product (BPDA) was added and stirred for a certain period of time to react. After that, 20.302 g (0.1 mol) of terephthaloyl chloride (TPC) was added to obtain a polyamic acid solution with a solid concentration of 13% by mass. Next, 25.6 g of pyridine and 33.1 g of acetic anhydride were added to the polyamic acid solution, stirred for 30 minutes, further stirred at 70° C. for 1 hour, and then cooled to room temperature. 20 L of methanol was added thereto, and the precipitated solid matter was filtered and pulverized. Then, it was dried under vacuum at 100° C. for 6 hours to obtain 111 g of polyimide powder.
(基材K-1の作製)
 100gの上記ポリイミド粉末を670gのN,N-ジメチルアセトアミド(DMAc)に溶かして13質量%の溶液を得た。得られた溶液をステンレス板に流延し、130℃の熱風で30分乾燥させた。その後フィルムをステンレス板から剥離して、フレームにピンで固定し、フィルムが固定されたフレームを真空オーブンに入れ、100℃から300℃まで加熱温度を徐々に上げながら2時間加熱し、その後、徐々に冷却した。冷却後のフィルムをフレームから分離した後、最終熱処理工程として、さらに300℃で30分間熱処理して、ポリイミドフィルムからなる、厚み30μmの基材K-1を得た。
(Preparation of base material K-1)
100 g of the above polyimide powder was dissolved in 670 g of N,N-dimethylacetamide (DMAc) to obtain a 13% by weight solution. The resulting solution was cast on a stainless plate and dried with hot air at 130° C. for 30 minutes. After that, the film was peeled off from the stainless steel plate and fixed to the frame with pins. The frame with the film fixed was placed in a vacuum oven and heated for 2 hours while gradually increasing the heating temperature from 100°C to 300°C, and then gradually. cooled to After the cooled film was separated from the frame, it was further heat-treated at 300° C. for 30 minutes as the final heat-treatment step to obtain a base material K-1 made of a polyimide film and having a thickness of 30 μm.
[実施例1]
 <硬化性樹脂組成物(ハードコート層形成用組成物)の調製>
 (硬化性樹脂組成物HC-1)
 下記成分を下記量でミキシングタンクに投入し、攪拌した。得られた組成物を孔径0.45μmのポリプロピレン製フィルターで濾過し、硬化性樹脂組成物HC-1とした。
 ポリマー(S-1)           94.75質量部
 イルガキュア127            5.00質量部
 RS-90                0.25質量部
 MIBK(メチルイソブチルケトン)  100.00質量部
[Example 1]
<Preparation of curable resin composition (composition for forming hard coat layer)>
(Curable resin composition HC-1)
The following components were put into a mixing tank in the following amounts and stirred. The resulting composition was filtered through a polypropylene filter having a pore size of 0.45 μm to obtain a curable resin composition HC-1.
Polymer (S-1) 94.75 parts by mass Irgacure 127 5.00 parts by mass RS-90 0.25 parts by mass MIBK (methyl isobutyl ketone) 100.00 parts by mass
 イルガキュア127(Irg.127):光ラジカル重合開始剤、BASF社製
 RS-90:滑り剤、DIC(株)製
Irgacure 127 (Irg.127): Photoradical polymerization initiator, manufactured by BASF RS-90: Slip agent, manufactured by DIC Corporation
(ハードコートフィルムの製造)
 厚さ30μmのポリイミド基材K-1上に上記硬化性樹脂組成物HC-1をワイヤーバー#18を用いて、硬化後の膜厚が18μmとなるようにバー塗布し、基材上にハードコート層塗膜を設けた。
 次いで、ハードコート層塗膜を120℃で1分間乾燥した後、25℃、酸素濃度100ppm(parts per million)の条件にて空冷水銀ランプを用いて、紫外線を照射した。このようにしてハードコート層塗膜を硬化した。
 このようにして、基材上に、ハードコート層(硬化性樹脂組成物HC-1を硬化してなる層)を有するハードコートフィルムを得た。
(Manufacturing of hard coat film)
The curable resin composition HC-1 was bar-coated on a polyimide substrate K-1 having a thickness of 30 μm using a wire bar #18 so that the film thickness after curing was 18 μm. A coat layer coating was applied.
Next, after drying the hard coat layer coating film at 120° C. for 1 minute, it was irradiated with ultraviolet rays using an air-cooled mercury lamp under conditions of 25° C. and an oxygen concentration of 100 ppm (parts per million). Thus, the hard coat layer coating film was cured.
Thus, a hard coat film having a hard coat layer (a layer obtained by curing the curable resin composition HC-1) on the substrate was obtained.
[実施例2~13、比較例1~5]
 ポリマー(S-1)に代えて、下記表1に記載したポリマーを用いた以外は、実施例1と同様にして、実施例2~13、比較例1~5のハードコートフィルムをそれぞれ製造した。
 比較例5では、ポリマー(SX-1)とポリマー(SX-4)とを、ポリマー(SX-1):ポリマー(SX-4)の質量比1:1で用い、ポリマー(SX-1)とポリマー(SX-4)の合計の含有量を実施例1のポリマー(S-1)の含有量と同じにした。
[Examples 2 to 13, Comparative Examples 1 to 5]
Hard coat films of Examples 2 to 13 and Comparative Examples 1 to 5 were produced in the same manner as in Example 1, except that the polymers listed in Table 1 below were used instead of the polymer (S-1). .
In Comparative Example 5, polymer (SX-1) and polymer (SX-4) were used at a mass ratio of polymer (SX-1):polymer (SX-4) of 1:1, and polymer (SX-1) and The total content of polymer (SX-4) was the same as the content of polymer (S-1) in Example 1.
(耐擦傷性の評価)
 製造した各実施例及び比較例のハードコートフィルムのハードコート層の表面を、ラビングテスターを用いて、以下の条件で擦り試験を行うことで、耐擦傷性の指標とした。
 評価環境条件:25℃、相対湿度60%
 擦り材:スチールウール(日本スチールウール(株)製、グレードNo.#0000番)
 試料と接触するテスターの擦り先端部(1cm×1cm)に巻いて、バンド固定
 移動距離(片道):13cm
 擦り速度:13cm/秒
 荷重:100g/cm
 先端部接触面積:1cm×1cm
 擦り回数:往復10回、往復50回、往復100回、往復300回
 試験後のハードコートフィルムの擦った面(ハードコート層の表面)とは逆側の面(基材の表面)に油性黒インキを塗り、反射光で目視観察して、スチールウールと接触していた部分に傷が生じたときの擦り回数を計測し評価した。
 A:往復300回擦った場合に傷が生じない
 B:往復100回擦った場合に傷が生じないが、往復300回擦った場合に傷が生じる
 C:往復50回擦った場合に傷が生じないが、往復100回擦った場合に傷が生じる
 D:往復10回擦った場合に傷が生じないが、往復50回擦った場合に傷が生じる
 E:往復10回擦った場合に傷が生じる
(Evaluation of scratch resistance)
Using a rubbing tester, the surface of the hard coat layer of the hard coat film of each of the manufactured examples and comparative examples was subjected to a rubbing test under the following conditions to obtain an index of scratch resistance.
Evaluation environment conditions: 25°C, relative humidity 60%
Rubbing material: steel wool (manufactured by Japan Steel Wool Co., Ltd., grade No. #0000)
Wrap around the rubbing tip (1 cm x 1 cm) of the tester in contact with the sample and fix the band Moving distance (one way): 13 cm
Rubbing speed: 13 cm/sec Load: 100 g/cm 2
Tip contact area: 1 cm x 1 cm
Number of times of rubbing: 10 times reciprocating, 50 times reciprocating, 100 times reciprocating, 300 times reciprocating After the test, oily black was applied to the surface of the hard coat film opposite to the rubbed surface (surface of hard coat layer) (surface of base material). The ink was applied, and the surface was visually observed with reflected light, and the number of rubbing times when the portion in contact with the steel wool was scratched was counted and evaluated.
A: No scratches when rubbed back and forth 300 times B: No scratches when rubbed back and forth 100 times, but scratches when rubbed 300 times back and forth C: Scratches when rubbed 50 times back and forth D: No scratches when rubbed 10 times back and forth, but scratches when rubbed 50 times back and forth E: Scratches when rubbed 10 times back and forth
 結果を下記表1に示す。 The results are shown in Table 1 below.
Figure JPOXMLDOC01-appb-T000072
Figure JPOXMLDOC01-appb-T000072
 表1に示したとおり、実施例1~13のハードコートフィルムは、耐擦傷性に優れていた。 As shown in Table 1, the hard coat films of Examples 1 to 13 were excellent in scratch resistance.
 本発明によれば、耐擦傷性に優れた硬化層を形成することができる硬化性樹脂組成物、上記硬化性樹脂組成物を用いて形成されたハードコートフィルム及び上記ハードコートフィルムの製造方法を提供することができる。 According to the present invention, a curable resin composition capable of forming a cured layer having excellent scratch resistance, a hard coat film formed using the curable resin composition, and a method for producing the hard coat film. can provide.
 本発明を詳細にまた特定の実施態様を参照して説明したが、本発明の精神と範囲を逸脱することなく様々な変更や修正を加えることができることは当業者にとって明らかである。
 本出願は、2021年6月7日出願の日本特許出願(特願2021-95314)、2021年6月28日出願の日本特許出願(特願2021-106802)、及び2022年2月4日出願の日本特許出願(特願2022-16722)に基づくものであり、その内容はここに参照として取り込まれる。
Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is a Japanese patent application (Japanese patent application 2021-95314) filed on June 7, 2021, a Japanese patent application (Japanese patent application 2021-106802) filed on June 28, 2021, and a Japanese patent application filed on February 4, 2022 (Japanese Patent Application No. 2022-16722), the contents of which are incorporated herein by reference.

Claims (19)

  1.  フッ素原子を含む構成単位(a)及びカチオン重合性基を含む構成単位(b)からなる群より選ばれる少なくとも1つの構成単位と、下記一般式(Z-1)で表される構成単位(z)とを有するポリマー(S)を含む硬化性樹脂組成物。
    Figure JPOXMLDOC01-appb-C000001

     一般式(Z-1)中、
     Dは水素原子、メチル基、-CHORZ1又は-CHCOORZ2を表す。RZ1は水素原子又は炭素数1~4のアルキル基を表す。RZ2は水素原子又はメチル基を表す。
     Aは-O-又は-NRZ3-を表す。RZ3は水素原子又は炭素数1~4のアルキル基を表す。
     wは2~5の整数を表す。
     LZ1は脂肪族基及び芳香族基からなる群より選ばれる少なくとも1つを有するw+1価の連結基を表す。上記脂肪族基に含まれる1つ以上の-CH-はそれぞれ独立に-CO-、-O-又は-NRZ4-に置き換わってもよい。RZ4は水素原子又は炭素数1~4のアルキル基を表す。RZ4が複数存在する場合、複数のRZ4は同一でも異なっていてもよい。
     LZ2はアルキレン基、アリーレン基、-CO-、-O-、及び-NRZ5-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す。RZ5は水素原子又は炭素数1~4のアルキル基を表す。RZ5が複数存在する場合、複数のRZ5は同一でも異なっていてもよい。
     Eは下記一般式(Ea-1)又は(Ea-2)で表される基を表す。
    Figure JPOXMLDOC01-appb-C000002

     一般式(Ea-1)及び(Ea-2)中、
     RE1及びRE2はそれぞれ独立に水素原子又はメチル基を表す。
     RE3は水素原子又は炭素数1~4のアルキル基を表す。
     *は結合位置を表す。
    At least one structural unit selected from the group consisting of a structural unit (a) containing a fluorine atom and a structural unit (b) containing a cationically polymerizable group, and a structural unit (z ) and a curable resin composition containing a polymer (S) having
    Figure JPOXMLDOC01-appb-C000001

    In the general formula (Z-1),
    D 1 represents a hydrogen atom, a methyl group, -CH 2 OR Z1 or -CH 2 COOR Z2 . R Z1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. R Z2 represents a hydrogen atom or a methyl group.
    A 1 represents -O- or -NR Z3 -. R Z3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
    w represents an integer of 2 to 5;
    L Z1 represents a w+1-valent linking group having at least one selected from the group consisting of an aliphatic group and an aromatic group. One or more —CH 2 — contained in the aliphatic group may be independently replaced with —CO—, —O— or —NR Z4 —. R Z4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z4 are present, the multiple R Z4 may be the same or different.
    L Z2 represents a divalent linking group having at least one selected from the group consisting of an alkylene group, an arylene group, —CO—, —O— and —NR Z5 —, or a single bond. R Z5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. When multiple R Z5 are present, the multiple R Z5 may be the same or different.
    E 1 represents a group represented by the following general formula (Ea-1) or (Ea-2).
    Figure JPOXMLDOC01-appb-C000002

    In general formulas (Ea-1) and (Ea-2),
    R E1 and R E2 each independently represent a hydrogen atom or a methyl group.
    R E3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
    * represents a binding position.
  2.  前記ポリマー(S)に含まれる全ての構成単位に対する、前記構成単位(a)の物質量基準の含有量をWaとし、前記構成単位(b)の物質量基準の含有量をWbとし、前記構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはない、請求項1に記載の硬化性樹脂組成物。 With respect to all the structural units contained in the polymer (S), the content of the structural unit (a) based on the amount of substance is represented by Wa, the content of the structural unit (b) based on the amount of material is represented by Wb, and the constitution When Wz is the content of the unit (z) based on the amount of substance, Wa, Wb and Wz satisfy 0 mol% ≤ Wa ≤ 90 mol%, 0 mol% ≤ Wb ≤ 90 mol%, and 0 mol% < Wz < 100 mol% 2. The curable resin composition according to claim 1, wherein both Wa and Wb are not 0 mol %.
  3.  前記Wzが、30mol%≦Wz≦95mol%を満たす、請求項2に記載の硬化性樹脂組成物。 The curable resin composition according to claim 2, wherein the Wz satisfies 30mol%≤Wz≤95mol%.
  4.  前記ポリマー(S)が、更に、前記構成単位(b)とは異なる構成単位であって、かつ水酸基結合性を有する構成単位(c)を有する、請求項1~3のいずれか1項に記載の硬化性樹脂組成物。 4. The polymer (S) according to any one of claims 1 to 3, further comprising a structural unit (c) which is a structural unit different from the structural unit (b) and has hydroxyl bonding properties. curable resin composition.
  5.  前記ポリマー(S)に含まれる全ての構成単位に対する、前記構成単位(a)の物質量基準の含有量をWaとし、前記構成単位(b)の物質量基準の含有量をWbとし、前記構成単位(c)の物質量基準の含有量をWcとし、前記構成単位(z)の物質量基準の含有量をWzとした場合、Wa、Wb、Wc及びWzがそれぞれ、0mol%≦Wa≦90mol%、0mol%≦Wb≦90mol%、0mol%<Wc<90mol%、0mol%<Wz<100mol%を満たし、かつWaとWbとがともに0mol%であることはない、請求項4に記載の硬化性樹脂組成物。 With respect to all the structural units contained in the polymer (S), the content of the structural unit (a) based on the amount of substance is represented by Wa, the content of the structural unit (b) based on the amount of material is represented by Wb, and the constitution Where Wc is the content of the unit (c) based on the substance amount, and Wz is the content of the structural unit (z) based on the substance amount, Wa, Wb, Wc and Wz are each 0 mol% ≤ Wa ≤ 90 mol %, 0 mol% ≤ Wb ≤ 90 mol%, 0 mol% < Wc < 90 mol%, 0 mol% < Wz < 100 mol%, and both Wa and Wb are not 0 mol%. elastic resin composition.
  6.  前記構成単位(c)が、ボロン酸基、イソシアネート基、アルデヒド基、及びアルコキシシリル基からなる群より選ばれる少なくとも1つを有する、請求項4又は5に記載の硬化性樹脂組成物。 The curable resin composition according to claim 4 or 5, wherein the structural unit (c) has at least one selected from the group consisting of boronic acid groups, isocyanate groups, aldehyde groups, and alkoxysilyl groups.
  7.  前記ポリマー(S)が、前記構成単位(a)と前記構成単位(b)と前記構成単位(z)とを有する、請求項1~6のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 6, wherein the polymer (S) has the structural unit (a), the structural unit (b) and the structural unit (z).
  8.  前記一般式(Z-1)中のLZ1がw+1価の脂肪族基を表す、請求項1~7のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 7, wherein L Z1 in the general formula (Z-1) represents a w+1 valent aliphatic group.
  9.  前記一般式(Z-1)中のLZ2がアルキレン基、-CO-、及び-O-からなる群より選ばれる少なくとも1つを有する2価の連結基、又は単結合を表す、請求項1~8のいずれか1項に記載の硬化性樹脂組成物。 Claim 1, wherein L Z2 in the general formula (Z-1) represents a divalent linking group having at least one selected from the group consisting of an alkylene group, -CO-, and -O-, or a single bond. 9. The curable resin composition according to any one of 8.
  10.  前記一般式(Z-1)中のLZ1とLZ2に含まれる炭素原子数が合計で1~6である、請求項1~9のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 9, wherein the total number of carbon atoms contained in L Z1 and L Z2 in general formula (Z-1) is 1 to 6.
  11.  前記構成単位(a)に含まれるフッ素原子の数が、3個以上17個以下である、請求項1~10のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 10, wherein the number of fluorine atoms contained in the structural unit (a) is 3 or more and 17 or less.
  12.  前記構成単位(a)が、下記一般式(f-1)で表される基を有する、請求項1~11のいずれか1項に記載の硬化性樹脂組成物。
    Figure JPOXMLDOC01-appb-C000003

     一般式(f-1)中、q1は0~12の整数を表し、q2は1~8の整数を表し、Rqは水素原子又はフッ素原子を表す。*は結合位置を表す。
    The curable resin composition according to any one of claims 1 to 11, wherein the structural unit (a) has a group represented by the following general formula (f-1).
    Figure JPOXMLDOC01-appb-C000003

    In general formula (f-1), q1 represents an integer of 0 to 12, q2 represents an integer of 1 to 8, and Rq1 represents a hydrogen atom or a fluorine atom. * represents a binding position.
  13.  前記構成単位(a)が、下記一般式(B1)で表される基を有する、請求項1~12のいずれか1項に記載の硬化性樹脂組成物。
    Figure JPOXMLDOC01-appb-C000004

     一般式(B1)中、
     nは1以上の整数を表す。複数のnは同一であっても異なっていてもよい。
     Rb1は水素原子又は置換基を表す。
     Rb2は水素原子又は置換基を表す。複数のRb2は同一であっても異なっていてもよい。
     Lb1は、n+1価の連結基を表す。複数のLb1は同一であっても異なっていてもよい。
     Zb1は、フッ素原子を含有する基を表す。複数のZは同一であっても異なっていてもよい。
     *は、結合位置を表す。
    The curable resin composition according to any one of claims 1 to 12, wherein the structural unit (a) has a group represented by the following general formula (B1).
    Figure JPOXMLDOC01-appb-C000004

    In general formula (B1),
    n represents an integer of 1 or more. A plurality of n may be the same or different.
    R b1 represents a hydrogen atom or a substituent.
    R b2 represents a hydrogen atom or a substituent. A plurality of R b2 may be the same or different.
    L b1 represents an n+1-valent linking group. A plurality of L b1 may be the same or different.
    Z b1 represents a group containing a fluorine atom. Plural Z's may be the same or different.
    * represents a binding position.
  14.  前記構成単位(a)が、パーフルオロポリエーテル基を有する、請求項1~13のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 13, wherein the structural unit (a) has a perfluoropolyether group.
  15.  前記構成単位(b)の前記カチオン重合性基が下記一般式(C1)~(C3)のいずれかで表される基である、請求項1~14のいずれか1項に記載の硬化性樹脂組成物。
    Figure JPOXMLDOC01-appb-C000005

     一般式(C1)~(C3)中、*は結合位置を表す。一般式(C3)中、Rは水素原子又は置換基を表す。
    The curable resin according to any one of claims 1 to 14, wherein the cationic polymerizable group of the structural unit (b) is a group represented by any one of the following general formulas (C1) to (C3). Composition.
    Figure JPOXMLDOC01-appb-C000005

    In general formulas (C1) to (C3), * represents a bonding position. In general formula (C3), R 2 C represents a hydrogen atom or a substituent.
  16.  前記ポリマー(S)の重量平均分子量が5000~200000である、請求項1~15のいずれか1項に記載の硬化性樹脂組成物。 The curable resin composition according to any one of claims 1 to 15, wherein the polymer (S) has a weight average molecular weight of 5,000 to 200,000.
  17.  基材と、請求項1~16のいずれか1項に記載の硬化性樹脂組成物から形成されたハードコート層とを含むハードコートフィルム。 A hard coat film comprising a substrate and a hard coat layer formed from the curable resin composition according to any one of claims 1 to 16.
  18.  基材とハードコート層とを含むハードコートフィルムの製造方法であって、請求項1~16のいずれか1項に記載の硬化性樹脂組成物を前記基材上に塗布して塗膜を形成し、前記塗膜に硬化処理を施すことにより前記ハードコート層を形成する、ハードコートフィルムの製造方法。 A method for producing a hard coat film comprising a substrate and a hard coat layer, wherein the curable resin composition according to any one of claims 1 to 16 is applied onto the substrate to form a coating film. and forming the hard coat layer by subjecting the coating film to a curing treatment.
  19.  前記硬化処理が、光と熱による硬化処理である、請求項18に記載のハードコートフィルムの製造方法。 The method for producing a hard coat film according to claim 18, wherein the curing treatment is a curing treatment using light and heat.
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056221A (en) * 2005-08-26 2007-03-08 Jsr Corp Polymer, radiation-sensitive resin composition and spacer for liquid crystal display element
JP2008298859A (en) * 2007-05-29 2008-12-11 Asahi Glass Co Ltd Photosensitive composition, partition using the same, method for producing partition, method for producing color filter, method for producing organic el display element and method for producing organic tft array
JP2009096990A (en) * 2007-09-26 2009-05-07 Fujifilm Corp Photocurable coating composition, overprint, and method for producing it
JP2010047680A (en) * 2008-08-21 2010-03-04 Neos Co Ltd Reactive fluorine-containing oligomer and method for producing the same
WO2018062077A1 (en) * 2016-09-30 2018-04-05 富士フイルム株式会社 Polymer compound
WO2020175337A1 (en) * 2019-02-27 2020-09-03 富士フイルム株式会社 Laminated body, article provided with laminated body, and image display device
WO2021039803A1 (en) * 2019-08-29 2021-03-04 富士フイルム株式会社 Photo-aligning polymer, binder composition, binder layer, optical laminate, optical laminate manufacturing method, and image display apparatus
WO2022004746A1 (en) * 2020-06-29 2022-01-06 富士フイルム株式会社 Laminate, production method for laminate, laminate-containing surface protective film for image display device, and article and image display device provided with laminate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6390125B2 (en) 2014-03-13 2018-09-19 Jsr株式会社 Curable resin composition, cured film for display element, method for forming the same, and display element

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056221A (en) * 2005-08-26 2007-03-08 Jsr Corp Polymer, radiation-sensitive resin composition and spacer for liquid crystal display element
JP2008298859A (en) * 2007-05-29 2008-12-11 Asahi Glass Co Ltd Photosensitive composition, partition using the same, method for producing partition, method for producing color filter, method for producing organic el display element and method for producing organic tft array
JP2009096990A (en) * 2007-09-26 2009-05-07 Fujifilm Corp Photocurable coating composition, overprint, and method for producing it
JP2010047680A (en) * 2008-08-21 2010-03-04 Neos Co Ltd Reactive fluorine-containing oligomer and method for producing the same
WO2018062077A1 (en) * 2016-09-30 2018-04-05 富士フイルム株式会社 Polymer compound
WO2020175337A1 (en) * 2019-02-27 2020-09-03 富士フイルム株式会社 Laminated body, article provided with laminated body, and image display device
WO2021039803A1 (en) * 2019-08-29 2021-03-04 富士フイルム株式会社 Photo-aligning polymer, binder composition, binder layer, optical laminate, optical laminate manufacturing method, and image display apparatus
WO2022004746A1 (en) * 2020-06-29 2022-01-06 富士フイルム株式会社 Laminate, production method for laminate, laminate-containing surface protective film for image display device, and article and image display device provided with laminate

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