WO2022259889A1 - 光源装置 - Google Patents

光源装置 Download PDF

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Publication number
WO2022259889A1
WO2022259889A1 PCT/JP2022/021690 JP2022021690W WO2022259889A1 WO 2022259889 A1 WO2022259889 A1 WO 2022259889A1 JP 2022021690 W JP2022021690 W JP 2022021690W WO 2022259889 A1 WO2022259889 A1 WO 2022259889A1
Authority
WO
WIPO (PCT)
Prior art keywords
lid
frame
light source
source device
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/021690
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English (en)
French (fr)
Japanese (ja)
Inventor
良彦 大川内
靖夫 馬場
雅幸 畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
Original Assignee
Nuvoton Technology Corp Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nuvoton Technology Corp Japan filed Critical Nuvoton Technology Corp Japan
Publication of WO2022259889A1 publication Critical patent/WO2022259889A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/0222—Gas-filled housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements

Definitions

  • the present disclosure relates to a light source device including a semiconductor laser element.
  • semiconductor laser elements have advantages such as long life, high efficiency, and small size, they are used as light sources for various products such as projectors, optical discs, vehicle headlamps, lighting devices, and laser processing devices. 2. Description of the Related Art In recent years, as a semiconductor laser element, research and development of a nitride-based semiconductor laser element covering a wavelength band from ultraviolet to blue has been advanced.
  • the light source device includes a semiconductor laser element and a package that houses the semiconductor laser element.
  • a light source device including a package in which a semiconductor laser element is hermetically sealed is known (for example, Patent Document 1).
  • the package is hermetically sealed using a covering material made of ethylene-polyvinyl alcohol copolymer (EVOH).
  • EVOH is a resin material with excellent gas barrier properties. Therefore, even when a volatile organic gas is generated from a member existing in the internal space of the package, the EVOH covering material can prevent the volatile organic gas from leaking out of the package.
  • the coating material made of EVOH can also prevent low-molecular-weight siloxane, volatile organic gas, or the like existing outside (in the atmosphere) of the light source device from entering the interior space of the package.
  • a package for housing a semiconductor laser element includes, for example, a metal housing having an opening such as a frame, a translucent optical member covering the opening of the housing, and a metal supporting the housing. It is known to have a support made of
  • a TO-CAN package includes a metal cap as a housing, a metal stem base as a support, and a glass plate arranged to cover the opening of the cap.
  • the housing to which the optical member is attached and the support are fixed by resistance welding.
  • the frame body and the support body are fixed by joining the connecting portion between the frame body to which the optical member is attached and the support body by resistance welding.
  • optical member having a lens function is used as the optical member attached to the frame, it is necessary to align the optical member and the semiconductor laser element. Specifically, the optical member and the semiconductor laser element are aligned so that the laser light emitted from the semiconductor laser element passes through the optical axis of the optical member.
  • active alignment is sometimes used in which the semiconductor laser element and the optical member are aligned while the semiconductor laser element is driven to emit laser light.
  • the present disclosure has been made to solve such problems, and aims to provide a light source device having a package structure capable of achieving both airtightness maintenance and active alignment.
  • one aspect of the light source device is a base having a support portion and a frame body provided on the support portion, and a base body that is in close contact with the frame body via a sealing material. and a nitride-based semiconductor laser element disposed in a sealed space formed by the lid, the substrate, and the sealing material, wherein the lid includes the nitride
  • An optical element that imparts an optical effect to a laser beam emitted from the semiconductor laser element is included, and the lid body and the frame body are provided with a bonding material on the side of the sealing material opposite to the sealing space side. are joined through
  • FIG. 1A is a top view of a light source device according to Embodiment 1.
  • FIG. 1B is a cross-sectional view of the light source device according to Embodiment 1.
  • FIG. FIG. 2 is a top view of the light source device according to Embodiment 1 when the lid and the bonding material are omitted.
  • 3A and 3B are diagrams for explaining the method for manufacturing the light source device according to the first embodiment.
  • FIG. 4A is a top view of a light source device according to Embodiment 2.
  • FIG. 4B is a cross-sectional view of the light source device according to Embodiment 2.
  • FIG. 5A is a top view of a light source device according to Embodiment 3.
  • FIG. 5B is a cross-sectional view of the light source device according to Embodiment 3.
  • FIG. 6A is a top view of a light source device according to Embodiment 4.
  • FIG. 6B is a cross-sectional view of the light source device according to Embodiment 4.
  • FIG. 7A is a top view of a light source device according to Embodiment 5.
  • FIG. 7B is a cross-sectional view of the light source device according to Embodiment 5.
  • FIG. FIG. 8 is a top view of the light source device according to Embodiment 5 when the lid and the bonding material are omitted.
  • 9 is a cross-sectional view of a light source device according to a modification of Embodiment 5.
  • FIG. 5A is a top view of a light source device according to Embodiment 4.
  • FIG. 6B is a cross-sectional view of the light source device according to Embodiment 4.
  • FIG. 7A is a top view of a light
  • FIG. 10 is a cross-sectional view of a light source device according to Embodiment 6.
  • FIG. 11A and 11B are diagrams for explaining the method for manufacturing the light source device according to the sixth embodiment.
  • 12 is a cross-sectional view of a light source device according to a modification of Embodiment 6.
  • FIG. 13 is a cross-sectional view of a light source device according to a modification.
  • each figure is a schematic diagram and is not necessarily strictly illustrated. Therefore, scales and the like are not always the same in each drawing.
  • the same reference numerals are assigned to substantially the same configurations, and duplicate descriptions are omitted or simplified.
  • FIG. 1A is a top view of light source device 1 according to Embodiment 1.
  • FIG. 1B is a cross-sectional view of the light source device 1.
  • FIG. FIG. 2 is a top view of the same light source device 1 when the lid 4 and the bonding material 8 are omitted. In other words, FIG. 2 shows a state in which the bonding material 8 and the lid 4 are removed from the light source device 1 .
  • the same hatching is given to the same members as in FIG. 1A for the sake of convenience. The hatching in this plan view is the same for subsequent drawings.
  • the light source device 1 is a semiconductor laser light emitting device having a semiconductor laser element 2.
  • FIG. The light source device 1 includes a semiconductor laser element 2 , a base 3 having a support portion 10 and a frame 20 , and a lid 4 fixed to the base 3 .
  • Light source device 1 in the present embodiment further includes mirror 5 that reflects laser light emitted from semiconductor laser element 2 .
  • a package is composed of the base 3 and the lid 4, and the semiconductor laser element 2 is accommodated in this package.
  • the internal space of the package formed by the base 3 and the lid 4 is a sealed space 1a that is hermetically sealed. Therefore, the semiconductor laser element 2 is arranged in the sealing space 1a.
  • a plurality of semiconductor laser elements 2 are arranged in the sealing space 1a.
  • the semiconductor laser element 2 is a laser chip that emits laser light.
  • the semiconductor laser device 2 is a nitride semiconductor laser device made of a nitride semiconductor material.
  • the semiconductor laser element 2 is a GaN-based semiconductor laser element that emits blue laser light.
  • the semiconductor laser element 2 is arranged on the base 3 together with the mirror 5 .
  • the semiconductor laser element 2 is arranged on the substrate 3 via the submount 6 .
  • the submount 6 functions as a base for supporting the semiconductor laser element 2 and also functions as a heat sink for dissipating heat generated in the semiconductor laser element 2 .
  • the submount 6 is made of a ceramic material such as aluminum nitride (AlN) or a metal material such as copper.
  • the base 3 is a housing on which the semiconductor laser element 2 and the mirror 5 are placed.
  • a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on the substrate 3 .
  • the plurality of semiconductor laser elements 2 and the plurality of mirrors 5 are mounted on the supporting portion 10 of the base 3 .
  • a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are arranged in a matrix. As shown in FIG. 2, as an example, 16 semiconductor laser elements 2 and 16 mirrors 5 are arranged in 4 rows and 4 columns, respectively.
  • the 16 semiconductor laser elements 2 are electrically connected so as to form 4 in series and 4 in parallel. Power is supplied to the four semiconductor laser elements 2 connected in series by a pair of lead pins 2a. One of the pair of lead pins 2a is a cathode terminal and the other is an anode terminal.
  • the four semiconductor laser elements 2 connected in series are electrically connected to each other by, for example, gold wires (not shown).
  • a support portion 10 on the base 3 is a support for supporting the semiconductor laser element 2, the mirror 5 and the submount 6.
  • the support portion 10 is a mounting substrate for mounting the semiconductor laser element 2, the mirror 5, and the submount 6 thereon.
  • Each of the plurality of semiconductor laser elements 2 is mounted on the supporting portion 10 via the submount 6 .
  • Each semiconductor laser element 2 is mounted parallel to the upper surface of the support portion 10 . Therefore, the optical axis of the laser light emitted from each semiconductor laser element 2 is parallel to the upper surface of the support portion 10 .
  • the supporting portion 10 for example, a metal substrate made of a metal material, a ceramic plate made of a ceramic material, a glass plate made of a glass material, or a resin substrate made of a resin material can be used. can.
  • the supporting portion 10 is preferably made of a material having a high thermal conductivity such as a metal material. Examples of metal materials that have high thermal conductivity and are practical as mounting substrates include copper and aluminum.
  • the shape of the support portion 10 is flat as a whole, and the top view shape of the support portion 10 is substantially rectangular, but the shape is not limited to this.
  • the base body 3 includes a frame body 20 in addition to the support part 10.
  • the frame 20 is a frame-shaped member whose top view shape is substantially rectangular.
  • the frame 20 is provided on the support portion 10 .
  • the frame 20 is fixed to the support 10 so as to surround all the semiconductor laser elements 2 .
  • the frame body 20 is provided so as to be fitted into the support portion 10 , but may be provided on the upper surface of the support portion 10 .
  • the frame 20 has a frame-shaped frame main body 21 and a frame-shaped partition 22 .
  • the frame main body 21 is fixed to the support portion 10 .
  • the cross-sectional shape of the frame main body 21 is substantially rectangular.
  • the upper surface of the frame body 21 is provided with a recess 21a.
  • the concave portion 21 a is a groove formed over the entire circumference of the frame body 21 .
  • the top view shape of the concave portion 21a is a rectangular frame shape.
  • the screen part 22 is provided so as to stand on the upper surface of the frame body 21 .
  • the screen part 22 is provided outside the recessed part 21a. Specifically, the screen portion 22 is provided so that the outer side wall surface of the screen portion 22 is aligned with the outer surface of the frame main body 21 .
  • the frame body 20 is made of, for example, a metal material such as copper or aluminum, but is not limited to this. Also, the frame main body 21 and the screen portion 22 are integrally formed, but they may be separate.
  • the lid 4 is fixed to the frame 20.
  • the lid 4 is fixed to the frame 20 so as to close the opening of the frame 20 .
  • the lid 4 is an example of an optical member, and includes an optical element 4a (optical element) that imparts an optical effect to the laser beam emitted from the semiconductor laser element 2.
  • the optical element 4a is a lens having lens action.
  • the optical element 4a refracts the laser light emitted from the semiconductor laser element 2, thereby imparting a lens effect to the laser light.
  • the optical element 4a is a convex lens that collects light. Therefore, laser light emitted from the semiconductor laser element 2 is condensed by the optical element 4a.
  • the lid 4 includes a plurality of optical elements 4a.
  • Each of the plurality of optical elements 4 a is provided corresponding to each of the plurality of semiconductor laser elements 2 .
  • the plurality of optical elements 4a, mirrors 5, and semiconductor laser elements 2 are provided in one-to-one correspondence.
  • each optical element 4a is a convex lens, so laser light emitted from each semiconductor laser element 2 is focused by each optical element 4a.
  • the lid 4 is composed of a flat plate-shaped translucent flat plate portion 30a and a plurality of convex portions 30b provided on the flat plate portion 30a.
  • Each of the plurality of convex portions 30b is part of the optical element 4a, which is a convex lens.
  • each optical element 4a is composed of a flat plate portion 30a and a convex portion 30b.
  • each of the plurality of convex portions 30b is provided on the outer surface of the flat plate portion 30a. Therefore, each of the plurality of convex portions 30b has a convex surface that protrudes in the direction opposite to the sealing space 1a side.
  • the convex surface of each convex portion 30b is a curved surface such as a spherical surface.
  • a light incident surface of each optical element 4a on which laser light is incident forms part of the sealed space 1a.
  • the light incident surface of each optical element 4a on which laser light is incident is the inner surface of the flat plate portion 30a.
  • the lid body 4 is a light-transmitting member composed only of the flat plate portion 30a and the convex portion 30b. Therefore, the entire lid 4 is made of translucent material.
  • the lid 4 is made of a transparent material such as a transparent resin material or glass. In this embodiment, the lid 4 is made of glass.
  • the lid 4 is arranged on the frame 20 so as to close the opening of the frame 20 .
  • the lid 4 is fixed to the frame 20 so that the peripheral portion of the flat plate portion 30a of the lid 4 is placed on the upper surface of the frame main body 21 of the frame 20. be done.
  • the flat plate portion 30a of the lid 4 is surrounded by the screen portion 22 of the frame 20, and the side surface (end surface) of the flat plate portion 30a and the inner side surface of the screen portion 22 face each other with a gap therebetween.
  • the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is preferably lower than the height of the upper surface of the frame 20 with the support portion 10 as a reference.
  • the maximum height of the convex surface of the convex portion 30 b that is the light exit surface of the optical element 4 a of the lid 4 is lower than the height of the upper end surface of the screen portion 22 that is the upper surface of the frame 20 . Good.
  • the lid 4 is fixed in close contact with the frame 20 via the sealing material 7 . That is, the lid 4 and the frame 20 are fixed with the sealing material 7 interposed between the lid 4 and the frame 20 .
  • the sealing material 7 is an example of a joining member that joins the lid 4 and the frame 20 together.
  • the sealing material 7 is formed in a thin layer between the frame body 21 of the frame 20 and the lid 4 .
  • the sealing member 7 is formed in an annular shape when viewed from above. Specifically, the sealing material 7 extends over the entire circumference of the lid 4 and the frame 20 between the inner surface of the peripheral portion of the flat plate portion 30a of the lid 4 and the upper surface of the frame main body 21 of the frame 20. filled in the gap.
  • the thickness of the sealing material 7 is, for example, 1 mm or less. In this embodiment, the thickness of the sealing material 7 is 0.2 mm. As shown in FIG.
  • the sealing material 7 is also filled in the recess 21a formed in the frame main body 21, but the recess 21a may not be filled with the sealing material 7.
  • FIG. The sealing material 7 melts and spreads in the horizontal direction, but since the concave portion 21a is provided, the sealing material 7 that melts and spreads toward the inside of the frame 20 enters the concave portion 21a. Thereby, it is possible to prevent the melted sealing material 7 from reaching the support portion 10 .
  • the frame body 20 and the lid body 4 By bringing the frame body 20 and the lid body 4 into close contact with each other through the sealing material 7 in this way, the airtightness in the sealed space 1a is maintained. That is, the base 3, the lid 4, and the sealing material 7 form a hermetically sealed sealed space 1a.
  • the sealing material 7 is preferably made of a material that does not contain silicone. Moreover, the sealing material 7 is preferably made of a soft material. Ethylene-vinyl alcohol copolymer (EVOH) or indium can be used as such a sealing material 7 . In this embodiment, the sealing material 7 is made of EVOH.
  • the lid 4 and the frame 20 are joined by a joining material 8.
  • a joining material 8 As shown in FIG. Specifically, the lid body 4 and the frame body 20 are joined via the joining material 8 on the opposite side of the sealing material 7 from the sealing space 1a side.
  • the bonding material 8 is filled between the screen portion 22 of the frame 20 and the end face of the flat plate portion 30a of the lid 4 .
  • the bonding material 8 is an example of a bonding member that bonds the lid 4 and the frame 20 together.
  • the bonding material 8 is made of resin.
  • a thermosetting adhesive can be used as the bonding material 8 .
  • the resin forming the bonding material 8 is an epoxy resin.
  • a thermosetting adhesive made of an epoxy resin that cures at a temperature of room temperature to 160° C. can be used as the bonding material 8.
  • the bonding material 8 may be a photocurable adhesive such as an ultraviolet curable adhesive made of resin or the like instead of a thermosetting adhesive.
  • the bonding material 8 has a bonding strength higher than that of the sealing material 7 .
  • the adhesive strength of the bonding material 8 is greater than the adhesive strength of the sealing material 7 .
  • a laser beam emitted from the semiconductor laser element 2 is incident on the lid 4 through the mirror 5 .
  • the mirror 5 reflects the laser light emitted from the semiconductor laser element 2 to enter the optical element 4a.
  • the semiconductor laser element 2 is mounted in parallel with the upper surface of the support portion 10, so that the laser light emitted from the semiconductor laser element 2 is directed to the optical element 4a located above.
  • the mirror 5 is configured to reflect the laser beam traveling in the lateral direction so that the laser beam rises upward.
  • the mirror 5 is a rising mirror, and has a reflecting surface that reflects the incident light so that it rises upward.
  • the reflective surface of the mirror 5 is an inclined surface that is inclined with respect to the upper surface of the support portion 10 .
  • the inclination angle of the reflecting surface of the mirror 5 with respect to the upper surface of the supporting portion 10 is 45 degrees.
  • the laser light of the semiconductor laser element 2 emitted in the direction parallel to the upper surface of the support 10 is reflected by the reflecting surface of the mirror 5 and travels in the direction perpendicular to the upper surface of the support 10. , enter the optical element 4 a of the lid 4 .
  • Each of the plurality of mirrors 5 is arranged so that the optical axis of the laser beam reflected by each mirror 5 and the optical axis of the optical element 4a of the lid 4 are aligned.
  • FIG. 3A and 3B are diagrams for explaining a method for manufacturing the light source device 1 according to the first embodiment.
  • the base 3 having the supporting portion 10 and the frame 20 is prepared.
  • the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the supporting portion 10 of the base 3.
  • a plurality of semiconductor laser elements 2 and a plurality of mirrors 5 are mounted on support portion 10 .
  • each semiconductor laser element 2 is mounted on a support portion 10 via a submount 6 .
  • the submount 6 to which the semiconductor laser element 2 is bonded is mounted on the supporting portion 10 .
  • the sealing material 7S which is a sheet material, is placed on the frame 20 of the base 3. As shown in FIG. Specifically, the sealing material 7S is arranged on the upper surface of the frame main body 21 over the entire circumference of the frame 20 .
  • a resin sheet made of resin can be used as the sealing material 7S.
  • an annular EVOH sheet made of EVOH is used as the sealing material 7S.
  • An indium sheet made of indium may be used as the sheet-like sealing material 7S.
  • the sealing material 7S may be a plurality of separated sheet pieces instead of a sheet material made of an annular integral body. In this case, it is preferable that a plurality of sheet pieces are arranged continuously or intermittently in an annular shape and arranged on the frame main body 21 .
  • the previously prepared lid body 4 is placed on the frame body 20 on which the sealing material 7S is placed.
  • the lid 4 is arranged on the frame main body 21 of the frame 20 so as to cover the opening of the frame 20 .
  • the lid 4 is placed on the sealing material 7S.
  • the sealing material 7 ⁇ /b>S is sandwiched between the peripheral portion of the flat plate portion 30 a of the lid 4 and the frame main body 21 of the frame 20 .
  • the lid body 4 placed on the frame body 20 is aligned with the sealing material 7S interposed therebetween. That is, the lid 4 is aligned with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a.
  • the lid 4 is aligned by active alignment with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a. Specifically, the position of the lid 4 is adjusted so that the laser beam passes through the optical axis of the optical element 4 a of the lid 4 while the semiconductor laser element 2 is driven to emit a laser beam. In this case, the position of the lid 4 can be adjusted by moving the lid 4 in a direction (horizontal direction) parallel to the upper surface of the support portion 10 .
  • the lid 4 can be horizontally displaced. That is, the position of the lid 4 can be adjusted. Further, when aligning the lid 4, a sheet material made of EVOH, indium, or the like, which is a soft material, is used as the sealing material 7S, thereby reducing distortion caused when aligning the lid 4. be able to.
  • the lid 4 is surrounded by the screen portion 22 of the frame 20, but there is a gap between the side surface of the flat plate portion 30a of the lid 4 and the inner side surface of the screen portion 22. Since it exists, the lid 4 can be moved horizontally. In other words, this gap is a space for positioning the lid 4 .
  • the sealing material 7S is melted by heating. Since the EVOH sheet is used as the sealing material 7S in the present embodiment, the sealing material 7S can be melted by heating at about 220.degree.
  • the sealing material 7S melts and spreads in the horizontal direction, but since the frame main body 21 is provided with the concave portion 21a, the sealing material 7S is melted and the frame body 7S is expanded as shown in FIG. The sealing material 7S that spreads toward the inside of the 20 enters the concave portion 21a. As a result, it is possible to prevent the melted sealing material 7S from reaching the support portion 10 . That is, the recess 21a is a release recess for releasing the melted sealing material 7S.
  • the sealing material 7S is cured by stopping the heating.
  • the lid 4 and the frame 20 are fixed by the sealing material 7 .
  • the flat plate portion 30 a of the lid 4 and the frame main body 21 of the frame 20 are fixed by the sealing material 7 .
  • the sealing material 7 is interposed between the lid 4 and the frame 20.
  • the sealing material 7S may be hardened by positively cooling the sealing material 7.
  • the joint material 8 is inserted between the lid 4 and the frame 20 to fix the lid 4 and the frame 20 together.
  • the bonding material 8 is inserted between the side surface of the flat plate portion 30a of the lid 4 and the inner surface of the screen portion 22 so as to fill the gap.
  • a thermosetting adhesive made of epoxy resin is used as the bonding material 8 .
  • the fluid bonding material 8 is applied to the gap between the side surface of the flat plate portion 30 a of the lid 4 and the partition portion 22 of the frame 20 . After that, the bonding material 8 is cured by heating the bonding material 8 .
  • the bonding material 8 When heating the bonding material 8 , the bonding material 8 may be heated using a heating device such as a heater, or the bonding material 8 may be heated by driving the semiconductor laser element 2 . That is, the bonding material 8 may be heated by heat generated from the semiconductor laser element 2 without using a separate heating device. By driving the semiconductor laser element 2, the ambient temperature can be raised to about 160.degree.
  • the lid body 4 and the frame body 20 are bonded by the bonding material 8 . That is, the lid 4 and the frame 20 are fixed with the bonding material 8 . Thus, the light source device 1 is completed.
  • the bonding material 8 may be hardened by natural drying.
  • an ultraviolet curable adhesive may be used instead of the thermosetting adhesive.
  • the bonding material 8, which is an ultraviolet curable adhesive can be applied to the gap between the lid 4 and the frame 20, and the bonding material 8 can be cured by irradiating ultraviolet rays.
  • the bonding material 8 may be applied and cured while the lid body 4 is being aligned by active alignment.
  • the light source device 1 includes the base 3 having the support portion 10 and the frame 20, the lid 4 including the optical element 4a, the lid 4, the base 3, and the sealing material 7.
  • the lid body 4 is fixed in close contact with the frame body 20 via the sealing material 7, and the sealing material 7 is sealed.
  • the lid body 4 and the frame body 20 are joined via a joining material 8 on the side opposite to the stop space 1a side.
  • the joining member that joins the lid 4 and the frame 20 is functionally separated, rather than the lid 4, which is an optical member, is functionally separated.
  • the lid 4 has both the function of covering the opening of the frame 20 to ensure the airtightness of the package and the function of the optical action (such as light collecting ability) by the optical element 4a.
  • the sealing material 7 for securing the airtightness of the package composed of the lid 4 and the base 3, are used.
  • a bonding material 8 is used for fixing.
  • the lid 4 and the frame 20 are fixed, the internal space of the package composed of the lid 4 and the base 3 is hermetically sealed with the sealing material 7 to form a sealed space 1a.
  • the lid 4 can be aligned by active alignment. That is, it is possible to perform active alignment of the lid 4 including the optical element 4a while ensuring airtightness of the package composed of the lid 4 and the base 3 . Therefore, it is possible to realize the light source device 1 having a package structure capable of achieving both airtightness and active alignment.
  • the lid body 4 can be used as a single component having both functions of ensuring airtightness and optical action without being separated. Thereby, the structure of the light source device 1 can also be simplified.
  • the lid 4 and the frame 20 are bonded using two bonding members, the sealing material 7 and the bonding material 8, the lid 4 and the frame 20 are firmly attached. can also be fixed to
  • the optical element 4a (lens) and the semiconductor laser element 2, so the distance between the semiconductor laser element 2 and the optical element 4a can be shortened. As a result, it is also possible to reduce the size and height of the light source device 1 .
  • the bonding material 8 has a bonding strength higher than that of the sealing material 7 .
  • the sealing material 7 is preferably made of a soft material. If the bonding strength of the bonding material 8 is lower than that of the sealing material 7 , the desired bonding strength may not be obtained even if the lid 4 and the frame 20 are bonded with the bonding material 8 . Therefore, by using the bonding material 8 having a bonding strength higher than that of the sealing material 7, the bonding strength between the lid body 4 and the frame body 20 is improved even when the sealing material 7 made of a soft material is used. be able to.
  • the light incident surface of the optical element 4a of the lid 4 on which the laser beam of the semiconductor laser element 2 is incident forms part of the sealed space 1a.
  • the light incident surface of the optical element 4a forms part of the sealed space 1a, so that the tweezers effect in which the laser light emitted from the semiconductor laser element 2 traps a minute object can be suppressed. .
  • the optical element 4a of the lid 4 is a lens.
  • the light distribution of the laser light emitted from the semiconductor laser element 2 can be controlled by the optical element 4a.
  • the optical element 4a For example, by using a convex lens as the optical element 4a, the laser light from the semiconductor laser element 2 can be focused.
  • the sealing material 7 is made of a material that does not contain silicone.
  • the sealing material 7 is made of ethylene-vinyl alcohol copolymer (EVOH).
  • EVOH does not contain siloxane
  • the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed by forming the sealing material 7 from EVOH.
  • EVOH is a resin material having a high gas permeation prevention ability and an excellent gas barrier property, it is possible to prevent siloxane existing outside (in the air) of the light source device 1 from flowing into the sealed space 1a.
  • the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed.
  • the bonding material 8 is made of resin.
  • the resin forming the bonding material 8 is an epoxy resin.
  • the lid 4 and the frame 20 can be fixed with the resin, so that the lid 4 and the frame 20 can be joined together by other joining methods such as seam welding at a lower cost and in mass production.
  • the light source device 1 can be manufactured with good efficiency.
  • the curing temperature of the resin bonding material is generally lower than the operating temperature of the semiconductor laser element 2, by forming the bonding material 8 from a resin such as an epoxy resin, it is possible to align the lid 4 by active alignment.
  • the joint material 8 can be cured to join the lid member 4 and the frame member 20 while performing the above.
  • a plurality of semiconductor laser elements 2 are arranged in the sealed space 1a, and a plurality of optical elements 4a of the lid 4 are provided for each of the plurality of semiconductor laser elements 2. is provided.
  • the light output of the light source device 1 as a whole can be increased.
  • the difference in size between the lid 4 and the frame 20 increases as the sizes of the lid 4 and the frame 20 increase, and the airtightness may deteriorate. Since airtightness can be ensured in the present embodiment as described above, even when a plurality of semiconductor laser elements 2 are arranged, deterioration of airtightness can be effectively suppressed.
  • the light source device 1 further includes a mirror 5 that reflects the laser light emitted from the semiconductor laser element 2 and causes it to enter the optical element 4a. mounted parallel to the top surface of the
  • the heat generated in the semiconductor laser element 2 can be efficiently conducted to the support portion 10, and heat dissipation of the semiconductor laser element 2 can be achieved. can improve sexuality. Further, even if the semiconductor laser element 2 is mounted parallel to the upper surface of the support section 10, the laser light emitted from the semiconductor laser element 2 can be deflected by the mirror, so that the upper surface of the support section 10 and the optical element 4a are aligned. Geometric interference can be suppressed.
  • the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is preferably lower than the height of the upper surface of the frame 20 with the support portion 10 as a reference.
  • FIG. 4A is a top view of light source device 1A according to Embodiment 2
  • FIG. 4B is a cross-sectional view of light source device 1A.
  • a light source device 1A according to the present embodiment differs from the light source device 1 according to the first embodiment in the shape of a lid 4A.
  • the convex portion 30b constituting each optical element 4a in the lid 4 is provided on the outer surface of the flat plate portion 30a.
  • a convex portion 30b constituting each optical element 4a in 4A is provided on the inner surface of the flat plate portion 30a.
  • the convex portion 30b of each optical element 4a has a convex surface that protrudes toward the sealing space 1a side. That is, the convex portion 30b protrudes toward the support portion 10.
  • each optical element 4a is a convex lens
  • the convex surface of the convex portion 30b is a curved surface such as a spherical surface. All the convex portions 30b are provided on the inner surface of the flat plate portion 30a.
  • the light incident surface of each optical element 4a on which the laser beam is incident forms part of the sealing space 1a. Since it is provided on the inner surface of 30a, the light incident surface of each optical element 4a on which the laser beam is incident includes the convex surface of the convex portion 30b.
  • the configuration of the light source device 1A according to the present embodiment is the same as that of the light source device 1 according to the above embodiment except for the configuration of the lid member 4A.
  • the base body 3 having the support portion 10 and the frame body 20, the lid body 4A including the optical element 4a, the lid body 4A and the base body 3 and a semiconductor laser element 2 arranged in a sealing space 1a formed by a sealing material 7.
  • a lid body 4A is fixed in close contact with a frame body 20 with the sealing material 7 interposed therebetween. , the lid body 4A and the frame body 20 are joined via a joining material 8 on the opposite side of the sealing material 7 from the sealing space 1a side.
  • the light source device 1A according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, it is possible to perform active alignment of the lid 4A including the optical element 4a while ensuring the airtightness of the package composed of the lid 4A and the base 3. There is an effect such as realizing the light source device 1A having a package structure capable of achieving both.
  • the convex portions 30b forming each optical element 4a are provided not on the outer surface of the flat plate portion 30a but on the inner surface of the flat plate portion 30a. Therefore, the lower end of the lid 4A is closer to the support 10 than the upper end of the frame 20 is. Specifically, the apex of the convex portion 30b, which is the lower end of the lid 4A, is located closer to the support portion 10 than the upper edge of the screen portion 22, which is the upper end of the frame 20. As shown in FIG. In the present embodiment, the apex of the convex portion 30b is located closer to the support portion 10 than the upper surface of the frame main body 21 is.
  • the convex portion 30b of the optical element 4a which is a convex lens, is provided on the inner surface of the flat plate portion 30a and is not exposed to the outside, it is possible to prevent the convex portion 30b from being damaged.
  • the height of the light emitting surface of the optical element 4a of the lid 4A from which the laser beam is emitted is lower than the height of the upper surface of the frame 20 with the support portion 10 as a reference.
  • the plane that is the outer surface of the flat plate portion 30a that is the light emitting surface of the optical element 4a of the lid 4A is higher than the upper end surface of the screen portion 22 that is the upper surface of the frame 20. getting low. As a result, it is possible to prevent the outer surface of the lid 4A from hitting and being damaged by an external object.
  • the height difference between the outer surface of the flat plate portion 30a and the upper end surface of the screen portion 22 is approximately 0.8 mm to 1.0 mm.
  • FIG. 5A is a top view of a light source device 1B according to Embodiment 3
  • FIG. 5B is a cross-sectional view of the same light source device 1B.
  • the sealing material 7 is obtained by once melting the sealing material 7S, which is a sheet material, and then curing it.
  • the sealing material 7B is made of liquid metal.
  • the sealing material 7B which is a liquid metal, is a liquid metal that does not solidify above a predetermined temperature.
  • Indium gallium (InGa) made of indium and gallium can be used as the sealing material 7B, which is a liquid metal.
  • Indium gallium used in this embodiment is liquid at 50° C. or higher and solid at lower than 50° C. In other words, indium gallium is solid at room temperature.
  • the sealing material 7B is arranged in the recess 23 provided in the frame 20 .
  • recess 23 is provided in frame body 21 of frame 20 .
  • the recess 23 is provided in a portion of the frame body 21 that faces the lid 4 .
  • a recessed portion of the recess 23 is a cavity between the frame 20 and the lid 4 .
  • the recessed portion 23 is a groove formed over the entire circumference of the frame body 21 . Therefore, the recess 23 is formed in an annular shape.
  • the top view shape of the recess 23 is a rectangular frame shape.
  • the sealing material 7 ⁇ /b>B placed in the recess 23 exists over the entire circumference of the recess 23 . Therefore, the sealing material 7B is arranged in an annular shape.
  • the top view shape of the sealing material 7B is a rectangular frame shape.
  • the sealing material 7B arranged in the recess 23 supports the lid 4. Therefore, the upper surface of the sealing material 7B arranged in the recess 23 is in contact with the inner surface of the flat plate portion 30a of the lid 4. As shown in FIG. In addition, although the upper part of the sealing material 7B protrudes from the recessed part 23, it is not restricted to this.
  • the light source device 1B configured in this way can be manufactured according to the manufacturing method of the light source device 1 according to the first embodiment.
  • the base 3 having the support portion 10 and the frame 20 is prepared.
  • a frame main body 21 in which a concave portion 23 is formed is used.
  • the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the support portion 10 of the substrate 3 in the same manner as in the first embodiment.
  • a liquid sealing material 7B is placed on the frame 20 of the base 3.
  • a liquid metal is used as the sealing material 7B.
  • the recess 23 provided in the frame body 21 of the frame 20 is coated with the liquid sealing material 7B.
  • the sealing material 7B is applied to the concave portion 23 so that the upper portion of the sealing material 7B protrudes from the concave portion 23 due to surface tension. It should be noted that the sealing material 7B made of liquid metal is heated as necessary to make it liquefied (liquid).
  • the previously prepared lid body 4 is placed on the frame body 20 on which the sealing material 7B is placed.
  • the lid 4 is placed on the sealing material 7B.
  • the sealing material 7B is interposed between the lid member 4 and the frame member 20, and the internal space surrounded by the base member 3 and the lid member 4 becomes an airtight sealed space 1a.
  • lid 4 is placed on frame 20 at room temperature.
  • the sealing material 7B may be solid or liquid.
  • the lid 4 placed on the frame 20 is aligned with the sealing material 7B interposed therebetween. That is, the lid 4 is aligned with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a.
  • the lid 4 is aligned by active alignment with the internal space surrounded by the base 3 and the lid 4 being the sealed space 1a.
  • the active alignment of the lid 4 is performed at room temperature.
  • the sealing material 7B may be solid or liquid as long as it can support the lid 4 .
  • the sealing material 7B spreads laterally, but since the frame main body 21 is provided with the recess 21a, the sealing material 7B spreading toward the inside of the frame 20 enters the recess 21a. Become. Thereby, it is possible to prevent the sealing material 7B from reaching the support portion 10 . That is, the recess 21a is a release recess for releasing the sealing material 7B.
  • the joint material 8 is inserted between the lid 4 and the frame 20 to fix the lid 4 and the frame 20 together.
  • the lid 4 and the frame 20 are joined with the joining material 8 . That is, the lid 4 and the frame 20 are fixed with the bonding material 8 .
  • the light source device 1B is completed.
  • the base body 3 having the support portion 10 and the frame body 20, the lid body 4 including the optical element 4a, and the lid body 4 and a semiconductor laser element 2 arranged in a sealing space 1a formed by a base 3 and a sealing material 7B.
  • the lid body 4 and the frame body 20 are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7B.
  • the light source device 1B according to the present embodiment has the same effect as the light source device 1 according to the first embodiment. Specifically, since the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3, airtightness is maintained and active alignment is performed. There is an effect such as realizing the light source device 1B having a package structure capable of achieving both.
  • the frame 20 has a recess 23 in a portion facing the lid 4 , and the cavity between the frame 20 and the lid 4 is the recessed portion of the recess 23 .
  • the sealing material 7B is a liquid metal made of indium gallium.
  • indium gallium does not contain siloxane, the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed by configuring the sealing material 7B with indium gallium.
  • the liquid metal is a liquid that can be changed into any shape while maintaining the contact state with the object, using the liquid metal as the sealing material 7B makes it possible to align the lid 4 by active alignment. It is possible to suppress the deterioration of the airtightness.
  • indium gallium is solid at room temperature and becomes liquid when the temperature exceeds 50°C. Alignment can be easily performed.
  • the lid 4A in the second embodiment may be used instead of the lid 4.
  • FIG. 6A is a top view of light source device 1C according to Embodiment 4
  • FIG. 6B is a cross-sectional view of light source device 1C.
  • a light source device 1C according to the present embodiment has a configuration in which a sealing member 7C made of a ring wire is used instead of the sealing member 7B made of liquid metal in the light source device 1B according to the third embodiment.
  • the sealing material 7C which is a ring wire, is preferably made of a soft material.
  • a metal wire having a wire diameter of about 1 mm can be used as the sealing material 7C, which is an annular wire.
  • the sealing material 7C is, for example, a metal wire containing indium.
  • a metal wire containing indium is a soft wire.
  • an indium metal wire, an indium alloy wire made of an indium alloy, or the like can be used.
  • the sealing material 7C is arranged in a recess 23 provided in the frame 20. Since the sealing material 7C is a ring wire, the sealing material 7C arranged in the recess 23 exists over the entire circumference of the recess 23. As shown in FIG. In this case, the sealing material 7C, which is a ring-shaped wire, may be a ring-shaped one that is not interrupted in the middle, or a string-shaped metal wire that is routed around the entire circumference of the recess 23. good too.
  • the sealing material 7C, which is a ring-shaped wire arranged in the concave portion 23 in such a state functions as a packing. Thereby, the airtightness of the sealing space 1a can be ensured.
  • the sealing material 7C arranged in the recess 23 supports the lid 4. Therefore, the upper surface of the sealing material 7C arranged in the recess 23 is in contact with the inner surface of the flat plate portion 30a of the lid 4. As shown in FIG. Although the upper portion of the sealing material 7C protrudes from the recess 23 in the present embodiment, the present invention is not limited to this. In addition, when the sealing material 7C is a metal wire containing indium, the sealing material 7C is plastically deformed by being pressed against the lid 4 .
  • the configuration other than the sealing material 7C is the same as that of the light source device 1B according to the third embodiment. Further, the light source device 1C according to the present embodiment can be manufactured according to the manufacturing method of the light source device 1B according to the third embodiment.
  • the substrate 3 having the support portion 10 and the frame 20, the lid 4 including the optical element 4a, and the lid 4 The semiconductor laser element 2 is arranged in the sealing space 1a formed by the substrate 3 and the sealing material 7C, and the lid 4 is tightly fixed to the frame 20 via the sealing material 7C.
  • the lid body 4 and the frame body 20 are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7C.
  • the light source device 1C according to the present embodiment has the same effects as the light source device 1B according to the third embodiment. Specifically, since the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3, airtightness is maintained and active alignment is performed. There is an effect such as realizing a light source device 1C having a package structure that is compatible with the above.
  • the sealing material 7C is a ring wire.
  • the sealing material 7C can be arranged without gaps over the entire circumference of the sealing space 1a, so that the airtightness of the sealing space 1a can be easily ensured.
  • the sealing material 7C is made of indium.
  • indium does not contain siloxane, the optical tweezers effect due to the photochemical reaction of siloxane can be suppressed by configuring the sealing material 7C with indium.
  • the lid 4A in the second embodiment may be used instead of the lid 4, the lid 4A in the second embodiment.
  • FIG. 7A is a top view of a light source device 1D according to Embodiment 5
  • FIG. 7B is a cross-sectional view of the same light source device 1D
  • FIG. 8 is a top view of the light source device 1D when the lid 4 and the bonding material 8 are omitted.
  • the base 3D has the supporting portion 10 and the frame body 20D as in the light source device 1 according to the first embodiment.
  • the shape of the frame 20D is different from that of the light source device 1 according to the first embodiment.
  • frame 20D includes side frame 21D and inner frame 22D positioned inside side frame 21D. As shown in FIG. 8, each of the side frame 21D and the inner frame 22D has a rectangular frame shape when viewed from above.
  • the side frame 21D and the inner frame 22D are made of a metal material such as copper or aluminum.
  • the frame 20D is provided on the support portion 10. Specifically, as shown in FIG. 7B, the side frame 21D of the frame 20D is provided on the upper surface of the support portion 10. As shown in FIG. In the present embodiment, the side frame 21D is placed on the upper surface of the support section 10 and fixed to the support section 10 so as to stand on the support section 10 .
  • the inner frame 22D has an outer peripheral portion 22Da outside the lid 4 (including the fixing portion) in top view, and an inner peripheral portion 22Db located inside the outer peripheral portion 22Da.
  • the outer peripheral portion 22Da of the inner frame 22D is fixed to the upper end portion of the side frame 21D. Therefore, there is an opening through which the laser beam is transmitted inside the inner peripheral portion 22Db.
  • the inner frame 22D has a recess 23. As shown in FIG. In the present embodiment, recess 23 is provided in inner peripheral portion 22Db of inner frame 22D.
  • the recess 23 is provided in a portion of the inner frame 22D facing the lid 4. As shown in FIG. A concave portion of the concave portion 23 is a cavity between the frame 20D and the lid 4. As shown in FIG. 7B, the recess 23 is provided in a portion of the inner frame 22D facing the lid 4. As shown in FIG. A concave portion of the concave portion 23 is a cavity between the frame 20D and the lid 4. As shown in FIG.
  • the recess 23 is a groove formed along the entire circumference of the inner frame 22D. Therefore, as shown in FIG. 8, the recess 23 is formed in an annular shape. As an example, the top view shape of the recess 23 is a rectangular frame shape.
  • a sealing material 7 ⁇ /b>D is arranged in the concave portion 23 .
  • the sealing material 7 ⁇ /b>D arranged in the concave portion 23 exists over the entire circumference of the annular concave portion 23 . Therefore, the sealing material 7D is arranged in an annular shape.
  • the top view shape of the sealing material 7D is a rectangular frame shape.
  • the lid 4 can be easily displaced when the lid 4 is aligned by active alignment.
  • the sealing material 7D spreads in the lateral direction, but since the internal frame 22D is provided with the recess 22Dc, the sealing material 7D spreading toward the inside of the internal frame 22D does not enter the recess 22Dc. become. Thereby, it is possible to prevent the sealing material 7D from reaching the support portion 10 . That is, the recess 22Dc is a release recess for releasing the sealing material 7D.
  • the inner frame 22D has a bent portion 24.
  • the cross-sectional shape of the bent portion 24 is, for example, a crank-like bent shape having two right angles. Since the inner frame 22D has the bent portion 24 in this manner, the frame 20D has flexibility in a direction (horizontal direction) crossing the direction in which the lid 4 covers the frame 20D. That is, the frame 20D has flexibility in the direction parallel to the inner surface of the flat plate portion 30a of the lid 4 (the direction parallel to the upper surface of the support portion 10).
  • the lid 4 is arranged on the frame 20D so as to close the opening of the frame 20D.
  • the lid 4 is supported by the inner frame 22D of the frame 20D.
  • the lid 4 is fixed to the inner peripheral portion 22Db of the inner frame 22D.
  • the height of the light emitting surface of the optical element 4a of the lid 4 from which the laser beam is emitted is equal to the upper surface of the frame 20D, with the support portion 10 as a reference.
  • the maximum height of the convex surface of the convex portion 30b, which is the light exit surface of the optical element 4a of the lid 4 is preferably lower than the height of the upper end surface of the frame 20D.
  • the lid body 4 is fixed in close contact with the frame body 20D via the sealing material 7D. That is, the lid 4 and the frame 20D are fixed with the sealing material 7D interposed between the lid 4 and the frame 20D. In this manner, by bringing the inner peripheral portion 22Db of the frame 20D and the lid 4 into close contact with each other through the sealing material 7D, the airtightness in the sealed space 1a is maintained. That is, a sealed space 1a hermetically sealed is formed by the base 3D, the lid 4, and the sealing material 7D.
  • the sealing material 7D is preferably made of a material that does not contain silicone.
  • a sheet material made of EVOH or indium may be used as in the first embodiment, or a liquid metal made of indium gallium may be used as in the third embodiment.
  • an annular wire such as a metal wire containing indium may be used as in the fourth embodiment.
  • the lid body 4 and the frame body 20D are joined by the joining material 8. As shown in FIG. Specifically, the lid body 4 and the frame body 20D are joined via the joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7D. More specifically, the joining material 8 joins the inner peripheral portion 22Db of the frame 20D and the end portion of the flat plate portion 30a of the lid 4 . As a result, the lid 4 can be prevented from slipping, and the lid 4 and the frame 20D can be fixed.
  • the bent portion 24 of the inner frame 22D is formed in the outer peripheral portion 22Da and is formed inside the position where the side frame 21D and the inner frame 22D are fixed. In other words, it is positioned between the side frame and the lid when viewed from above. That is, the bent portion 24 is formed in a substantially annular shape inside the side frame 21D (on the sealing space 1a side) and outside the inner peripheral portion 22Db.
  • the light source device 1D according to the present embodiment can be manufactured according to the manufacturing method of the light source devices 1 to 1C according to the first to fourth embodiments according to the material of the sealing material 7D.
  • the light source device 1D includes the base body 3D having the supporting portion 10 and the frame body 20D, the lid body 4 including the optical element 4a, the lid body 4 and the base body, as in the first embodiment.
  • a semiconductor laser element 2 is arranged in a sealing space 1a formed by 3D and a sealing material 7D.
  • a lid 4 is fixed in close contact with a frame 20D via the sealing material 7D.
  • the lid 4 and the frame 20D are joined via a joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7D.
  • the light source device 1D according to the present embodiment has the same effect as the light source device 1 according to the first embodiment.
  • the lid 4 including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4 and the base 3D.
  • frame 20D includes side frame 21D and inner frame 22D positioned inside side frame 21D. It is fixed to the body 22D.
  • a bent portion can be provided by the side frame 21D and the inner frame 22D.
  • the bent portion 24 is provided in the inner frame 22D.
  • the frame 20D has flexibility in a direction crossing the direction in which the lid 4 covers the frame 20D.
  • the inner frame 22D is provided with a bent portion 24, and the bent portion 24 allows the frame 20D to have flexibility. That is, the bent portion 24 functions as a stress absorbing structure. In addition, by reducing the thickness of the inner frame 22D forming the bent portion 24, the flexibility of the bent portion 24 can be increased.
  • the inner frame 22D has an outer peripheral portion 22Da and an inner peripheral portion 22Db located inside the outer peripheral portion 22Da, and the lid 4 has an inner peripheral portion 22Db. is fixed to
  • the lid body 4A in the second embodiment may be used instead of the lid body 4 in the present embodiment as well.
  • FIG. 10 is a cross-sectional view of a light source device 1F according to Embodiment 6.
  • the light source device 1F according to the present embodiment differs from the light source device 1 according to the first embodiment in the shape of the frame 20F and the shape of the lid 4F in the base 3F.
  • the frame body 20F is a frame-shaped member whose top view shape is substantially rectangular.
  • the frame 20 ⁇ /b>F is provided on the support section 10 .
  • the frame 20 ⁇ /b>F is provided on the upper surface of the support portion 10 .
  • the frame 20F is fixed to the support portion 10 .
  • the frame 20F is made of a metal material such as copper or aluminum.
  • a concave portion 23 is provided on the upper surface of the frame 20F.
  • the recess 23 is a groove formed over the entire circumference of the frame 20F. Therefore, the recess 23 is formed in an annular shape.
  • the top view shape of the recess 23 is a rectangular frame shape.
  • the bottom surface of the recess 23 is a curved surface in the present embodiment, it may be a flat surface.
  • the recess 23 is provided in a portion of the frame 20F facing the lid 4F. Specifically, the recess 23 is provided in a portion of the frame 20F that faces the outer edge lid 32 of the lid 4F. A concave portion of the concave portion 23 is a cavity between the frame 20F and the lid 4F.
  • a sealing material 7F is arranged in the concave portion 23 .
  • the sealing material 7 ⁇ /b>F arranged in the recess 23 exists over the entire circumference of the recess 23 . Therefore, the sealing material 7F is arranged in an annular shape.
  • the top view shape of the sealing material 7F is a rectangular frame shape.
  • the lid 4F is arranged on the frame 20F so as to close the opening of the frame 20F.
  • the lid 4F is fixed to the frame 20F. Specifically, the lid 4F is fixed to the upper end of the frame 20F.
  • the lid body 4F includes a lid body body 31 including the optical element 4a and an outer edge lid body 32 located outside the lid body body 31 .
  • the outer edge lid 32 of the lid 4F is supported by the frame 20F. Specifically, the outer edge lid 32 is fixed in close contact with the frame 20F via the sealing material 7F. Further, the lid body main body 31 and the outer edge portion lid body 32 are joined by a joining material 33 .
  • the lid main body 31 is made of glass
  • the outer edge lid 32 is made of a metal material such as copper or aluminum. In this case, low-melting-point glass may be used as the bonding material 33 .
  • the outer edge lid 32 has an outer peripheral portion 32Da outside the lid main body 31 (including the fixing portion) in top view, and an inner peripheral portion 32Db positioned inside the outer peripheral portion 32Da. Therefore, there is an opening through which the laser beam is transmitted inside the inner peripheral portion 32Db. Specifically, the lid main body 31 is fixed to the inner peripheral portion 32Db.
  • the lid body main body 31 has the same configuration as the lid body 4 in the first embodiment. Therefore, the lid main body 31 has a flat plate portion 30a and a plurality of convex portions 30b provided on the flat plate portion 30a. Also, the plurality of convex portions 30b are provided on the outer surface of the flat plate portion 30a.
  • the outer edge cover 32 has a bent portion 34, and a gap is provided between the bent portion 34 and the frame 20F.
  • the cross-sectional shape of the bent portion 34 is, for example, a U-shaped bent shape. Since the lid 4F has the bent portion 34 in this manner, the lid 4F has flexibility in a direction (horizontal direction) crossing the direction in which the lid 4F covers the frame 20F. That is, the lid 4F has flexibility in the direction parallel to the inner surface of the flat plate portion 30a of the lid body 31 (the direction parallel to the upper surface of the support portion 10).
  • the maximum height of the convex surface of the convex portion 30b which is the light emitting surface of the optical element 4a of the lid body 31, is preferably lower than the height of the upper surface of the outer edge lid body 32. Thereby, it is possible to suppress damage to the optical element 4a due to collision with an external object.
  • the lid 4F is arranged on the frame 20F so as to close the opening of the frame 20F. Specifically, the lid 4F is fixed to the frame 20F so that the outer edge lid 32 is placed on the upper surface of the frame 20F.
  • the lid 4F is tightly fixed to the frame 20F via the sealing material 7F. That is, the lid 32 of the outer edge of the lid 4F and the frame 20F are fixed with the sealing material 7F interposed between the lid 4F and the frame 20F.
  • the sealing material 7F is preferably made of a material that does not contain silicone.
  • a sheet material made of EVOH or indium may be used as in the first embodiment, or a liquid metal made of indium gallium may be used as in the third embodiment.
  • the sealing material 7F spreads in the lateral direction, but since the frame 20F is provided with the recess 20Fa, the sealing material 7F spreading toward the inside of the frame 20F enters the recess 20Fa. . Thereby, it is possible to prevent the sealing material 7F from reaching the support portion 10 . That is, the recess 20Fa is a release recess for releasing the sealing material 7F.
  • a ring wire such as a metal wire containing indium may be used.
  • a sealed space 1a hermetically sealed is formed by the base 3F, the lid 4F, and the sealing material 7F.
  • a soft material such as EVOH as the material of the sealing material 7F and providing the bent portion 34 in the outer edge lid 32, the stress generated in the lid 4F is relieved and the lid main body 31 and the outer edge are separated. The airtightness of the low-melting-point glass portion, which is the joint with the lid 32, can be maintained.
  • the lid body 31 and the outer edge lid 32 are bonded together by using a metal material or a ceramic material as the bonding material 33 .
  • the stress generated in the lid body 4F can be relaxed as compared with the case of fixing with a metal material or a ceramic material.
  • the lid body 4F and the frame body 20F are joined by the joining material 8. As shown in FIG. Specifically, the lid body 4F and the frame body 20F are bonded via the bonding material 8 on the side opposite to the sealing space 1a side of the sealing material 7F. More specifically, the joint material 8 joins the frame 20F and the end of the outer peripheral portion 32Da.
  • the bent portion 34 of the outer edge lid 32 is formed in the outer peripheral portion 32Da, and is formed inside the position where the outer edge lid 32 and the frame 20F are fixed by the sealing material 7F. In other words, it is located between the frame body 20F and the lid body 31 in top view. That is, the bent portion 34 is located inside the position where the outer edge lid 32 and the frame 20F are fixed by the sealing material 7F (closer to the sealing space 1a), and the lid body 31 and the outer edge lid 32 are joined. It is formed in a substantially annular shape outside the position where it is joined by the material 33 .
  • FIG. 11A and 11B are diagrams for explaining the manufacturing method of the light source device 1F according to the sixth embodiment.
  • the light source device 1F according to the present embodiment can be manufactured according to the manufacturing method of the light source device 1 according to the first embodiment.
  • a base 3F having a support portion 10 and a frame 20F is prepared.
  • the semiconductor laser element 2 and the mirror 5 are mounted on the upper surface of the support portion 10 of the base 3F.
  • the semiconductor laser element 2 is mounted on the supporting portion 10 via the submount 6 .
  • the sealing material 7F is placed in the recess 23 of the frame 20F of the base 3F. At this time, the sealing material 7F is arranged in the recess 23 so that the upper part of the sealing material 7F protrudes from the recess 23. Next, as shown in FIG.
  • a lid body 4F is prepared in advance by bonding the lid body 31 and the outer edge lid body 32 with a bonding material 33 made of low-melting glass.
  • the lid 4F is placed on the frame 20F on which the sealing material 7F is placed.
  • the lid 4F is arranged on the frame 20F so as to cover the opening of the frame 20F.
  • the lid body 4F is arranged so that the outer edge lid body 32 is placed on the sealing material 7F.
  • the sealing material 7F is interposed between the lid body 4F and the frame body 20F, so that the internal space surrounded by the base body 3F and the lid body 4F becomes the hermetically sealed space 1a. Become.
  • the lid 4F arranged on the frame 20F is aligned with the sealing material 7F interposed therebetween. That is, the lid 4F is aligned with the internal space surrounded by the base 3F and the lid 4F being the sealed space 1a. In the present embodiment as well, the lid 4F is aligned by active alignment with the internal space surrounded by the base 3F and the lid 4F being the sealed space 1a.
  • the sealing material 7F spreads in the lateral direction, but since the recess 20Fa is provided in the frame 20F, the sealing material 7F spreads toward the inside of the frame 20F as shown in FIG. 11(f).
  • the material 7F enters the recess 20Fa. Thereby, it is possible to prevent the sealing material 7F from reaching the support portion 10 . That is, the recess 20Fa is a release recess for releasing the melted sealing material 7F.
  • a bonding material 8 is applied and cured to bond the lid 4F and the frame 20F with the bonding material 8 .
  • the lid 4F and the frame 20F are fixed with the bonding material 8.
  • FIG. This completes the light source device 1F.
  • the light source device 1F includes a base body 3F having a support portion 10 and a frame body 20F, a lid body 4F including an optical element 4a, a lid body 4F and a base body, as in the first embodiment. 3F and a semiconductor laser element 2 arranged in a sealing space 1a formed by a sealing material 7F. , the lid 4F and the frame 20F are joined via a joining material 8 on the side opposite to the sealing space 1a side of the sealing material 7F.
  • the light source device 1F according to the present embodiment has the same effect as the light source device 1 according to the first embodiment.
  • the lid 4F including the optical element 4a can be actively aligned while ensuring the airtightness of the package composed of the lid 4F and the base 3F.
  • the lid body 4F includes a lid body body 31 including the optical element 4a and an outer edge lid body 32 positioned outside the lid body body 31.
  • the body 32 is fixed to the frame 20F.
  • the lid body 31 including the optical element 4a and the outer edge lid 32 can be firmly bonded. Active alignment of the lid body 4F can be performed in this state.
  • the light source device 1F has a gap between the inner surface of the frame 20F and the surface of the outer edge lid 32 of the lid 4F facing the inner surface of the frame 20F.
  • the gap between the frame 20F and the outer edge lid 32 can be used as an adjustment gap when performing active alignment of the lid 4F.
  • the lid 4F has flexibility in a direction crossing the direction in which the lid 4F covers the frame 20F.
  • the outer edge lid 32 of the lid 4F has a bent portion 34, and the bent portion 34 allows the lid 4F to be flexible. That is, the bent portion 34 functions as a stress absorbing structure. In addition, by reducing the thickness of the outer edge lid 32 forming the bent portion 34, the flexibility of the bent portion 34 can be increased.
  • a lid 4G may be used instead of the lid 4F as in the light source device 1G shown in FIG.
  • the convex portion 30b constituting the optical element 4a is provided on the inner surface of the flat plate portion 30a. Therefore, the convex portion 30b in the optical element 4a has a convex surface that protrudes toward the sealing space 1a side.
  • the upper end portion of the screen portion 22 of the frame 20 of the base 3 is located above the upper surface of the flat plate portion 30a of the lid 4, but the present invention is not limited to this.
  • the bonding material 8 may be formed so as to ride on the screen portion 22H.
  • the optical elements 4a are lenses, but the present invention is not limited to this.
  • the optical element 4a may be a deflecting element such as a mirror or a prism having a concave or flat inclined surface.
  • the optical element 4a is not particularly limited as long as it is a light distribution control element capable of controlling the light distribution of the laser light emitted from the semiconductor laser element 2.
  • the cavity between the frame 20 and the lid 4 (that is, the portion where the sealing material 7B is arranged) is the concave portion of the recess 23 provided in the frame 20.
  • the cavity between the frame 20 and the lid 4 may be a recessed portion of a recess provided in the lid 4 .
  • the recess forming the cavity between the frame 20 and the lid 4 may be provided in either the frame 20 or the lid 4, or may be provided in both the frame 20 and the lid 4. may have been Note that this may also be applied to the fourth to sixth embodiments.
  • the bent portion 34 is provided in order to relieve the stress due to the difference in thermal expansion coefficient between the lid 4F and the frame 20D, but the present invention is not limited to this.
  • stress relief structures such as bellows may be provided to relieve stress.
  • the light source device is used for products in various fields such as image display devices such as projectors, automotive parts such as in-vehicle headlamps, lighting fixtures such as spotlights, or industrial equipment such as laser processing devices. Useful as a light source.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
PCT/JP2022/021690 2021-06-10 2022-05-27 光源装置 Ceased WO2022259889A1 (ja)

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JP2021097173A JP7718859B2 (ja) 2021-06-10 2021-06-10 光源装置

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WO2020230713A1 (ja) 2019-05-15 2020-11-19 ローム株式会社 抵抗器
EP4509757B1 (en) * 2023-08-17 2025-12-03 ZKW Group GmbH Method for assembling a light module for a vehicle headlamp

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JPH07183414A (ja) * 1993-12-24 1995-07-21 Matsushita Electron Corp 半導体レーザ装置とその製造方法
JP2012060039A (ja) * 2010-09-13 2012-03-22 Sanyo Electric Co Ltd 半導体レーザ装置及び光装置
CN203733832U (zh) * 2013-12-25 2014-07-23 深圳市瑞丰光电子股份有限公司 Led封装结构
JP2016119477A (ja) * 2014-12-23 2016-06-30 エルジー イノテック カンパニー リミテッド 発光素子及び照明システム
JP2016219779A (ja) * 2015-05-20 2016-12-22 日亜化学工業株式会社 発光装置
JP2019102582A (ja) * 2017-11-30 2019-06-24 日亜化学工業株式会社 発光装置
JP2020537332A (ja) * 2017-10-09 2020-12-17 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ オプトエレクトロニクス半導体部品、およびオプトエレクトロニクス半導体部品を製造するための方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183414A (ja) * 1993-12-24 1995-07-21 Matsushita Electron Corp 半導体レーザ装置とその製造方法
JP2012060039A (ja) * 2010-09-13 2012-03-22 Sanyo Electric Co Ltd 半導体レーザ装置及び光装置
CN203733832U (zh) * 2013-12-25 2014-07-23 深圳市瑞丰光电子股份有限公司 Led封装结构
JP2016119477A (ja) * 2014-12-23 2016-06-30 エルジー イノテック カンパニー リミテッド 発光素子及び照明システム
JP2016219779A (ja) * 2015-05-20 2016-12-22 日亜化学工業株式会社 発光装置
JP2020537332A (ja) * 2017-10-09 2020-12-17 オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ オプトエレクトロニクス半導体部品、およびオプトエレクトロニクス半導体部品を製造するための方法
JP2019102582A (ja) * 2017-11-30 2019-06-24 日亜化学工業株式会社 発光装置

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