WO2022257905A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022257905A1
WO2022257905A1 PCT/CN2022/097299 CN2022097299W WO2022257905A1 WO 2022257905 A1 WO2022257905 A1 WO 2022257905A1 CN 2022097299 W CN2022097299 W CN 2022097299W WO 2022257905 A1 WO2022257905 A1 WO 2022257905A1
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WO
WIPO (PCT)
Prior art keywords
groove
channel
sealing
electronic device
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/097299
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English (en)
French (fr)
Inventor
李满林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022257905A1 publication Critical patent/WO2022257905A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H04B1/3818—Arrangements for facilitating insertion or removal of identification devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets

Definitions

  • the present application belongs to the technical field of communication equipment, and in particular relates to an electronic equipment.
  • the casing of the electronic device is provided with both an thimble hole for ejecting the card holder and a sound guide hole for the electronic device to transmit sound, so that there are many exposed openings on the electronic device, causing the electronic device to The appearance of the device is less consistent.
  • the purpose of the embodiments of the present application is to provide an electronic device, which can solve the problem of low uniformity of appearance of the electronic device.
  • An embodiment of the present application provides an electronic device, including a casing, a card tray assembly, and an acoustic device;
  • Both the card tray assembly and the acoustic device are disposed in a cavity formed by the housing, and the housing is provided with an opening extending along a first direction, and the opening communicates the cavity and the external space ;
  • a first passage and a second passage communicated with the opening are arranged in the housing, the first passage extends along the first direction and is opposite to the opening, the opening and the opening
  • the first channel is used to take out the card tray assembly
  • the opening communicates with the acoustic device through the second channel
  • the second channel includes a first sub-channel, a second sub-channel and a third sub-channel connected in sequence, and the first sub-channel is set between the opening and the second sub-channel, and the first sub-channel extends along the second direction, the third sub-channel is disposed between the acoustic device and the second sub-channel, And the third subchannel extends along a third direction;
  • first direction, the second direction and the third direction intersect two by two.
  • the housing is provided with an opening, and the opening communicates with the external space and the cavity formed by the housing, so the opening is exposed to the housing.
  • a first passage and a second passage communicated with the opening are arranged in the casing, and the first passage and the second passage are arranged in the casing, so the first passage and the second passage are not exposed.
  • the first passage is arranged opposite to the opening, and the opening and the first passage are used for taking out the card tray assembly.
  • the opening communicates with the acoustic device through the second channel, and at this time, the opening and the second channel are used for sound guidance.
  • the opening is exposed, the first passage and the second passage are not exposed, and both the first passage and the second passage communicate with the external space through the opening, so the opening is a shared structure of the first passage and the second passage. Therefore, the number of exposed openings on the electronic device is reduced, thereby improving the appearance consistency of the electronic device.
  • FIG. 1 to 7 are schematic structural diagrams of the first electronic device disclosed in the embodiments of the present application.
  • 17 to 24 are schematic diagrams of sealing structures of the four middle frames and the upper cover of the main board of the second electronic device disclosed in the embodiments of the present application.
  • the embodiment of the present application discloses an electronic device, and the disclosed electronic device includes a housing 100 , a card tray assembly 200 and an acoustic device 300 .
  • the housing 100 provides a mounting base for the card tray assembly 200, the acoustic device 300, and other components of the electronic device.
  • the card tray assembly 200 can be used to carry an electronic card, and the electronic card can be a SIM (Subscriber Identification Module, user identification card) card, or a TF (Trans-flash, memory card) card.
  • the acoustic device 300 may be a sound pickup device or a sound emitting device.
  • Both the card tray assembly 200 and the acoustic device 300 are disposed in the cavity formed by the casing 100, and the casing 100 is provided with an opening 410 extending along the first direction, and the opening 410 communicates with the cavity and the external space, that is, the opening
  • the hole 410 runs through the outer surface of the housing 100 , the opening 410 is exposed, and the user can directly see the opening 410 .
  • the housing 100 is provided with a first channel 420 and a second channel 430 communicating with the opening 410. Since the first channel 420 and the second channel 430 are arranged in the housing 100, the first channel 420 and the second channel 430 do not exposed.
  • the first passage 420 extends along the first direction and is opposite to the opening 410 .
  • the opening 410 and the first passage 420 are used for taking out the card tray assembly 200 .
  • the card tray assembly 200 may include a card tray 210 and a push assembly 220 for driving the card tray 210. The user takes out the card tray assembly 200 through the opening 410 and the first channel 420 to take out the card tray 210.
  • the card tray 210 uses for carrying electronic cards.
  • a bracket mounting hole 103 may be opened on the housing 100 along a first direction, and the bracket 210 may be mounted to the housing 100 through the bracket mounting hole 103 , and the pushing assembly 220 is disposed opposite to the first channel 420 .
  • the specific card removal process is as follows: the thimble extends into the opening 410 and the first channel 420 in sequence, since the first channel 420 is set opposite to the push assembly 220, the thimble drives the push assembly 220 to move, and the push assembly 220 drives the card holder 210 to eject the card holder for installation Hole 103, so as to take out the card holder 210.
  • the opening 410 communicates with the acoustic device 300 through the second channel 430.
  • the second channel 430 includes a first sub-channel 431, a second sub-channel 432 and a third sub-channel 433 connected in sequence, the first sub-channel 431 is arranged between the opening 410 and the second sub-channel 432, and the first sub-channel 431
  • the channel 431 extends along the second direction
  • the third sub-channel 433 is disposed between the acoustic device 300 and the second sub-channel 432
  • the third sub-channel 433 extends along the third direction.
  • the first direction, the second direction and the third direction intersect in pairs.
  • the first direction may be parallel to the length direction of the electronic device
  • the second direction may be parallel to the width direction of the electronic device
  • the third direction may be parallel to the thickness direction of the electronic device.
  • the first direction can also be inclined at a certain angle relative to the length direction of the electronic device
  • the second direction can also be inclined at a certain angle relative to the width direction of the electronic device
  • the third direction can also be inclined at a certain angle relative to the thickness direction of the electronic device. Angle.
  • the acoustic device 300 when the acoustic device 300 is a sound pickup device, when the user makes a sound, the sound is passed through the opening 410, the first subchannel 431, the second subchannel 432 and the third subchannel 433 to the Acoustic device 300 .
  • the acoustic device 300 may be a microphone.
  • the acoustic device 300 is a sound-generating device, when the acoustic device 300 emits sound, the sound is transmitted to the outside of the casing 100 through the third sub-channel 433 , the second sub-channel 432 , the first sub-channel 431 and the opening 410 in sequence.
  • the acoustic device 300 may be a receiver or a speaker.
  • the opening 410 is exposed, the first channel 420 and the second channel 430 are not exposed, and both the first channel 420 and the second channel 430 communicate with the external space through the opening 410, so the opening 410 is the second channel.
  • the shared structure of the first channel 420 and the second channel 430 reduces the number of exposed openings 410 on the electronic device, thereby improving the appearance consistency of the electronic device.
  • the waterproof and dustproof performance of the electronic device can also be improved.
  • the first channel 420 also extends along the first direction
  • the first sub-channel 431 extends along the second direction. Since the first direction and the second direction intersect, the user can During the process of taking out the card, it is not easy to accidentally poke the acoustic device 300, thereby improving the safety and reliability of the electronic equipment.
  • the first sub-channel 431 extends along the second direction
  • the second sub-channel 432 extends along the first direction
  • the third sub-channel 433 extends along the third direction.
  • the second channel 430 is a bent structure, and the side walls of the bent structure can block dust and water vapor. At this time, most of the dust and water vapor can adhere to the side walls of the bent structure, thereby preventing dust and water vapor from entering the acoustic
  • the device 300 further makes the sound guide port of the acoustic device 300 not easy to be blocked, further improving the safety and reliability of the electronic equipment.
  • the direction of the first channel 420 is consistent with that of the opening 410, so the first channel 420 can be processed by continuing to process along the direction of the opening 410 into the housing 100, while the second channel 430 is a bent structure, Processing is difficult, thus increasing the difficulty of manufacturing electronic devices.
  • the housing 100 of an electronic device has various structures, please refer to FIGS. It includes the upper cover of the main board and the middle frame arranged around the upper cover of the main board. At this time, the middle frame and the upper cover of the main board are integral structural parts.
  • the upper cover of the main board is used to carry components such as the main board of the electronic device, and the middle frame is an appearance part of the electronic device and can be used to carry components such as a display module.
  • the opening 410 and the first passage 420 can be opened in the main body 160, and the main body 160 can be provided with a groove along the third direction. Since the third sub-channel 433 is used to communicate with the acoustic device 300, it can be seen that the third direction can pass through the main body. At this time, the acoustic device 300 is disposed in the cavity and is not exposed, so the grooves opened along the third direction are not exposed.
  • the opening 410 and the first channel 420 can pass through the two inner walls of the groove opposite to each other along the first direction, the blocking part is connected with the main body part 160 and covers the notch of the groove, the inner wall of the groove and the blocking part
  • the formed channel may be part of the second channel 430 .
  • the blocking portion, the two side walls of the groove and the bottom wall of the groove enclose a part of the second channel 430 .
  • the inner wall of the groove and the plugging portion can form part of the second passage 430. Since the groove is an open structure, the processing of the groove is simple, so the processing of the second passage 430 is simple, so that the manufacture of electronic equipment Less difficult.
  • the groove is formed along the third direction, and the direction of the groove is consistent with the stacking direction of the acoustic device 300 and the housing 100 , so the groove is not easy to be exposed, thereby improving the appearance performance of the electronic device.
  • the opening 410 and the first channel 420 may be opened on the middle frame 110 .
  • the opening 410 can be opened on the middle frame 110
  • the first channel 420 and the second channel 430 can be opened on the motherboard cover 120 .
  • a part of the opening 410 is opened in the middle frame 110
  • another part is opened in the upper cover of the motherboard 120
  • the specific opening positions of the opening 410 , the first channel 420 and the second channel 430 are not limited herein.
  • the first sub-channel 431 and the second sub-channel 432 are embedded in the housing 100, and the third sub-channel 433 runs through the housing 100 along the third direction, so the third sub-channel 433 can be opened directly along the third direction without Use the method of opening a craft tank. Therefore, the channel formed by the inner wall of the groove and the blocking part can be the first sub-channel 431 and the second sub-channel 432.
  • the plugging part can be made of PET (Polyethylene terephthalate, polyethylene terephthalate) material, foam, metal and other materials, and of course the plugging part can also be made of other materials, which is not limited herein .
  • PET Polyethylene terephthalate, polyethylene terephthalate
  • foam foam
  • metal and other materials and of course the plugging part can also be made of other materials, which is not limited herein .
  • the first sub-channel 431 and the second sub-channel 432 can be formed by the groove and the blocking part, and one or two grooves can be opened on one side of the main body part 160, and the opening of the groove on the same side needs to occupy the main body. There is a large space on this side of the part 160, so it is easy to occupy the installation space of other components, resulting in inconvenient assembly of electronic equipment.
  • the blocking part may include a first blocking part 130 and a second blocking part 140, and the first blocking part 130 and the second blocking part 140 may be located in the main body
  • the grooves may include a first groove 161 and a second groove 162, the orientation of the first groove 161 and the second groove 162 may be opposite, and the first groove 161 and the second groove 162 connected.
  • the first blocking member 130 can cover the notch of the first groove 161 , and the channel formed by the first blocking member 130 and the inner wall of the first groove 161 is a first sub-channel 431 .
  • the second blocking member 140 can cover the notch of the second groove 162, the channel formed by the second blocking member 140 and the inner wall of the second groove 162 is the second sub-channel 432, and the third sub-channel 433 runs through the second groove.
  • two opposite grooves are provided on both sides of the main body 160 , so that the size of the grooves is small and it is not easy to occupy the installation space of other components of the electronic device.
  • the first sub-channel 431 and the second sub-channel 432 need to be connected, so the first groove 161 and the second groove 162 need to be connected. At this time, the first groove 161 and the second groove 162 can be opened. Since the first groove 161 and the second groove 162 are both open structures, the opening of the communication hole 511 is relatively simple and convenient.
  • the projection of the first groove 161 may partially coincide with the projection of the second groove 162 .
  • the distance between the opening of the second groove 162 and the bottom of the first groove 161 is smaller than the distance between the opening of the second groove 162 and the bottom of the second groove 162 .
  • the first groove 161 and the second groove 162 have overlapping parts in the third direction, when the second groove 162 is processed, as long as the depth of the second groove 162 is greater than that of the second groove 162
  • the second groove 162 can pass through the first groove 161 , so that the second groove 162 communicates with the first groove 161 . Therefore, the processing of the second channel 430 is simple and convenient, and the processing technology of the second channel 430 is simplified.
  • the first groove 161 may include a first bent section 1611 and a second bent section 1612 whose extension directions intersect, the first bent section 1611 may extend along the second direction, and the second The second bent section 1612 may extend along a side away from the hole 410 , at this time, the second bent section 1612 extends toward the inside of the housing 100 .
  • the second bent section 1612 communicates with the second groove 162 , and the first channel 420 and the opening 410 both pass through two opposite side walls of the first bent section 1611 along the first direction.
  • first sub-channel 431 extends along the second direction, and at this time the first bent section 1611 and the second bent section 1612 are arranged along the second direction, so the first sub-channel 431
  • the overall extension direction of the first sub-channel 431 is still extending toward the second direction, but the first sub-channel 431 is divided into two parts, one part of which extends along the first direction, but the overall extension direction of the first sub-channel 431 is still along the second direction.
  • the first groove 161 is a groove with an approximate L-shaped structure.
  • the bending length of the first sub-channel 431 is increased, thereby further improving the waterproof and dustproof performance of the electronic device.
  • the first groove 161 is an approximately L-shaped groove, which further prevents the thimble from accidentally poking the acoustic device 300 .
  • the casing 100 may include a mainboard upper cover 120 and a middle frame 110 arranged around the mainboard upper cover 120.
  • the middle frame 110 and the mainboard upper cover The cover 120 is a separate structure. That is to say, the middle frame 110 and the motherboard cover 120 need to be assembled.
  • the opening 410 can be opened in the middle frame 110, and the side wall of the main board upper cover 120 opposite to the middle frame 110 is provided with a third groove 122 in the first direction, and the middle frame 110 covers the notch of the third groove 122, and the opening 410 is opposite to and communicated with the notch of the third groove 122, the side wall opposite to the notch of the middle frame 110 and the third groove 122 and the inner wall of the third groove 122 enclose the first sub-channel 431, the second sub-channel 431 Both the channel 432 and the first channel 420 pass through the bottom wall of the third groove 122 .
  • a third groove 122 is provided on the main board upper cover 120. After the middle frame 110 and the main board upper cover 120 are assembled, the middle frame 110 can be The third groove 122 is covered, so the third groove 122 is not exposed.
  • the direction from the opening of the third groove 122 to the bottom of the groove is parallel to the first direction, and the second sub-channel 432 extends along the first direction, so the second sub-channel 432 can be processed at the bottom of the third groove 122 , since the third groove 122 is an open structure, the second sub-channel 432 can be processed directly toward the inside of the casing 100 , so that the second channel 430 is conveniently manufactured, and the processing of the electronic device is less difficult.
  • a sealing assembly 150 may be provided in the assembly gap between the middle frame 110 and the main board upper cover 120 , and the sealing assembly 150 may be provided around the notch edge of the third groove 122 .
  • the sealing assembly 150 can realize the sealed connection between the middle frame 110 and the upper cover 120 of the main board, thereby preventing sound leakage of the electronic equipment, thereby improving the acoustic performance of the electronic equipment.
  • the sealing assembly 150 may include a first adhesive layer, a sealing gasket and a second adhesive layer, the sealing gasket is arranged between the first adhesive layer and the second adhesive layer, the first adhesive layer is bonded to the middle frame 110 , the second adhesive layer is The second adhesive layer is bonded to the main board upper cover 120 .
  • the sealing assembly 150 may also have other structures, which are not limited herein.
  • the middle frame 110 can be provided with a first sealing groove 111, and the first sealing groove 111 can be arranged around the third groove 122, and the main board cover 120 can be provided with a second sealing groove 121, and the second sealing groove 121 can be provided in On the notch edge of the third groove 122 , the direction of the first sealing groove 111 is opposite to that of the second sealing groove 121 .
  • Part of the sealing assembly 150 may be located in the first sealing groove 111 , and the inner sidewall of the first sealing groove 111 extends into the second sealing groove 121 .
  • the inner sidewall of the first sealing groove 111 refers to the sidewall near the opening 410 .
  • the inner side wall of the first sealing groove 111 can lift up the middle frame 110, thereby preventing the middle frame 110 from scratching the sealing assembly 150, therefore, it can protect the sealing component 150, thereby improving the reliability of the assembly of the electronic device.
  • the sealing assembly 150 since the inner sidewall of the first sealing groove 111 protrudes relatively, the effective sealing area between the first sealing groove 111 and the sealing assembly 150 increases, thereby further improving the sealing performance of the electronic device.
  • the sealing assembly 150 when the sealing assembly 150 is located in the first sealing groove 111 or/and the second sealing groove 121, the sealing assembly 150 occupies less space in the assembly gap, thus making the assembly gap between the middle frame 110 and the main board upper cover 120 smaller. , so that the assembly of electronic equipment is more compact, and the appearance and performance are better.
  • the second sealing groove and the third groove 122 form a stepped groove, and the first sealing groove is arranged around the opening 410 .
  • part of the sealing assembly 150 may be located in the second sealing groove 121 , and the inner sidewall of the second sealing groove 121 extends into the first sealing groove 111 .
  • This implementation manner has the same effect as the above-mentioned solution, and will not be repeated here.
  • the first sealing groove 111 and the opening 410 form a stepped structure, and the second sealing groove 121 is arranged around the third groove 122 .
  • a second sealing groove 121 may be formed on the main board upper cover 120, and the two opposite side walls of the second sealing groove 121 are flush with each other.
  • the sealing assembly 150 is disposed in the second sealing groove 121 .
  • the middle frame 110 is provided with a first sealing groove 111 , the two opposite side walls of the first sealing groove 111 are flush with each other, and the sealing assembly 150 is disposed in the first sealing groove 111 .
  • the electronic device disclosed in the present application may further include a scratch-resistant layer 710, the scratch-resistant layer 710 is attached between the assembly gap between the middle frame 110 and the main board cover 120, and the sealing assembly 150 may It is located between the anti-scratch layer 710 and the middle frame 110 or between the anti-scratch layer 710 and the upper cover 120 of the motherboard.
  • the anti-scratch layer 710 has a relatively large area, and can be firmly pasted between the middle frame 110 and the upper cover 120 of the main board, so the sealing assembly 150 is not easy to be scratched when the middle frame 110 and the upper cover 120 of the main board are assembled. Misalignment, thus improving the assembly performance of electronic devices.
  • the sealing performance of the middle frame 110 and the main board upper cover 120 is further improved.
  • one of the anti-scratch layer 710 and the middle frame 110 may be provided with a first protrusion, and the other may be provided with a first recess , the first protrusion and the first recess are embedded with each other.
  • the first concave part and the first convex part are limitedly matched to limit the displacement of the anti-scratch layer 710 , so that the anti-scratch layer 710 can be better fixed and the displacement of the anti-scratch layer 710 can be avoided.
  • one of the anti-scratch layer 710 and the mainboard cover 120 may be provided with a second protrusion, and the other may be provided with a second recess, and the second protrusion and the first The two recesses can be embedded with each other.
  • the housing 100 may define a receiving slot 101
  • the card tray assembly 200 may be located in the receiving slot 101 .
  • the direction from the notch of the receiving groove 101 to the groove bottom of the receiving groove 101 intersects or is parallel to the third direction, and the first channel 420 may communicate with the receiving groove 101 .
  • the extending direction of the first channel 420 may intersect the direction from the notch of the receiving groove 101 to the groove bottom of the receiving groove 101 .
  • the card holder assembly 200 can be hidden in the receiving groove 101, thereby reducing the stacking height of the card holder assembly 200 and the casing 100, thereby reducing the thickness of the electronic device.
  • the card tray assembly 200 since the card tray assembly 200 is hidden in the receiving groove 101 , it is also difficult for the card tray assembly 200 to interfere with other components of the electronic device, thereby improving the safety and reliability of the electronic device.
  • the card holder installation hole 103 above communicates with the receiving groove 101, when the card holder 210 is installed on the housing 100, part of the card holder 210 is located in the receiving groove 101, and the pushing assembly 220 is arranged in the receiving groove 101 Inside.
  • the electronic device disclosed in the present application may further include a circuit board 510, which is stacked with the casing 100 and covers the receiving groove 101, and the acoustic device 300 may be located on the side of the circuit board 510 away from the card tray assembly 200, And electrically connected with the circuit board 510 , the circuit board 510 may have a through hole 511 , and the acoustic device 300 communicates with the third sub-channel 433 through the through hole 511 .
  • the circuit board 510 can cover the notch of the receiving slot 101 , so as to prevent dust and water vapor from entering the receiving slot 101 , thereby avoiding phenomenon such as jamming of the card tray assembly 200 .
  • the electronic device disclosed in the present application may further include a push rod 720, at least a part of the push rod 720 may be located in the first channel 420, and one end of the push rod 720 is connected to the card holder assembly. 200 is in contact, specifically, the push rod 720 is in contact with the above-mentioned push assembly 220 .
  • the push rod 720 can block the first channel 420, so as to prevent sound leakage from the first channel 420, thereby improving the acoustic performance of the electronic device.
  • the thimble drives the card tray assembly 200 through the push rod 720 , the length of the thimble extending into the housing 100 is relatively short, and the force is relatively small. Therefore, it can prevent the thimble from being broken in the casing 100 due to its long length and excessive force.
  • the push rod 720 can block the first passage 420, thereby preventing dust and water vapor from entering the electronic device through the first passage 420, thus improving the waterproof and dustproof performance of the electronic device.
  • a third seal groove may be formed in the circumferential direction of the push rod 720 , and a seal ring 730 may be provided in the third seal groove, and the push rod 720 and the first channel 420 may be sealed and connected through the seal ring 730 .
  • This solution can further improve the sealing performance between the push rod 720 and the first channel 420, thereby further improving the acoustic performance and sealing performance of the electronic device.
  • the electronic device disclosed in the present application further includes a waterproof and dustproof part 520 and a sealing member 530, and the circuit board 510 is sealed and connected to the casing 100 through the sealing member 530.
  • the circuit board 510 can be Sealed connection with the motherboard upper cover 120 through the sealing member 530 .
  • the sealing member 530 can be provided with an avoidance hole 531 at a position opposite to the through hole 511, and the through hole 511 and the third sub-channel 433 are connected through the avoidance hole 531, and the waterproof and dustproof part 520 can be arranged on the avoidance hole 531 and the third sub-channel 433 between.
  • the sealing member 530 can seal the connection between the circuit board 510 and the casing 100 , thereby preventing sound leakage at the gap between the circuit board 510 and the casing 100 .
  • the waterproof and dustproof part 520 can block water vapor and dust in the third sub-channel 433 , thereby preventing water vapor and dust from entering the acoustic device 300 , thereby avoiding damage to the acoustic device 300 and improving the safety and reliability of the acoustic device 300 .
  • the sealing member 530 may be a structure such as sealing foam, and of course may also be other sealing structures.
  • the waterproof and dustproof part 520 can be a structure such as a filter, and of course can also be other waterproof and dustproof structures, which are not limited herein.
  • the side of the housing 100 facing the circuit board 510 may be provided with a fourth groove 102, the third sub-channel 433 runs through the bottom of the fourth groove 102, and the waterproof and dustproof part 520 and the sealing member 530 may both be located in the fourth groove 102 .
  • This solution can reduce the stacking height of the waterproof and dustproof part 520 , the sealing member 530 and the casing 100 , thereby reducing the thickness of the electronic device.
  • the length of the thimble extending into the housing 100 is the length of the opening 410, the width of the first sub-channel 431 and the first channel 420 , the installation position of the pushing assembly 220 needs to be moved into the housing 100 at this time, and this way is likely to cause the card holder assembly 200 to interfere with other components. For this reason, the length of the pushing assembly 220 can be reduced, so that the installation position of the card tray assembly 200 remains unchanged, and it is not easy to cause the card tray assembly 200 to interfere with other components, improving the assembly safety of the electronic device.
  • the electronic devices disclosed in the embodiments of the present application may be smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), electronic game consoles and other devices, and the embodiments of the present application do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请公开了一种电子设备，属于通信设备技术领域，电子设备包括壳体、卡托组件和声学器件；卡托组件和声学器件均设置于壳体形成的腔体内，壳体上设置有沿第一方向延伸的开孔，开孔连通腔体和外界空间；壳体内设置有与开孔连通的第一通道和第二通道，第一通道沿第一方向延伸，且与开孔相对设置，开孔和第一通道用于取出卡托组件；开孔与声学器件通过第二通道相连通，第二通道包括依次相连通的第一子通道、第二子通道和第三子通道，第一子通道设置于开孔与第二子通道之间，且第一子通道沿第二方向延伸，第三子通道设置于声学器件和第二子通道之间，且第三子通道沿第三方向延伸。

Description

电子设备
交叉引用
本发明要求在2021年06月11日提交中国专利局、申请号为202110653470.8、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于通信设备技术领域，具体涉及一种电子设备。
背景技术
随着技术的进步，电子设备(例如手机、平板电脑)得到了长足的发展。作为一种功能强大的工具，电子设备较大程度地方便了用户的生活和工作。
相关技术中，电子设备的壳体上既开设有用于顶出卡托的顶针孔，又开设有用于电子设备传递声音的导音孔，从而使得电子设备上外露的开孔较多，致使电子设备的外观一致性较低。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决电子设备的外观一致性较低的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，包括壳体、卡托组件和声学器件；
所述卡托组件和所述声学器件均设置于所述壳体形成的腔体内，所述壳体上设置有沿第一方向延伸的开孔，所述开孔连通所述腔体和外界空间；
所述壳体内设置有与所述开孔连通的第一通道和第二通道，所述第一通道沿所述第一方向延伸，且与所述开孔相对设置，所述开孔和所述第一通道 用于取出所述卡托组件；
所述开孔与所述声学器件通过所述第二通道相连通，所述第二通道包括依次相连通的第一子通道、第二子通道和第三子通道，所述第一子通道设置于所述开孔与所述第二子通道之间，且所述第一子通道沿第二方向延伸，所述第三子通道设置于所述声学器件和所述第二子通道之间，且所述第三子通道沿第三方向延伸；
其中，所述第一方向、所述第二方向和所述第三方向两两相交。
在本申请实施例中，壳体上设置有开孔，开孔连通外界空间和壳体形成的腔体，因此开孔外露于壳体。壳体内设置有与开孔连通的第一通道和第二通道，第一通道和第二通道设置于壳体内，因此第一通道和第二通道不外露。第一通道与开孔相对设置，开孔和第一通道用于取出卡托组件。开孔与声学器件通过第二通道相连通，此时，开孔和第二通道用于导音。本实施例中，开孔外露，第一通道和第二通道不外露，第一通道和第二通道均通过开孔与外界空间连通，因此开孔为第一通道和第二通道的共用结构，从而减少了电子设备上外露的开孔的数量，进而提高电子设备的外观一致性。
附图说明
图1至图7是本申请实施例公开的第一种电子设备的结构示意图；
图8至图16是本申请实施例公开的第二种电子设备的结构示意图；
图17至图24是本申请实施例公开的第二种电子设备的四种中框与主板上盖的密封结构示意图。
附图标记说明：
100-壳体、101-容纳槽、102-第四凹槽、103-卡托安装孔、110-中框、111-第一密封槽、120-主板上盖、121-第二密封槽、122-第三凹槽、130-第一封堵件、140-第二封堵件、150-密封组件、160-主体部、161-第一凹槽、1611-第一弯折段、1612-第二弯折段、162-第二凹槽、
200-卡托组件、210-卡托、220-推动组件、
300-声学器件、
410-开孔、420-第一通道、430-第二通道、431-第一子通道、432-第二子通道、433-第三子通道、
510-电路板、511-通孔、520-防水防尘部、530-密封件、531-避让孔、
710-防刮层、720-推杆、730-密封圈。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
请参考图1～24图，本申请实施例公开一种电子设备，所公开的电子设备包括壳体100、卡托组件200和声学器件300。
壳体100为电子设备的卡托组件200、声学器件300以及其他组成部件提供安装基础。卡托组件200可以用于承载电子卡片，该电子卡片可以为SIM(Subscriber Identification Module，用户身份识别卡)卡，可以为TF(Trans-flash，存储器卡)卡。声学器件300可以为拾音器件，也可以为发音器件。
卡托组件200和声学器件300均设置于壳体100形成的腔体内，壳体100上设置有沿第一方向延伸的开孔410，开孔410连通腔体和外界空间，也就 是说，开孔410贯穿壳体100的外侧面，开孔410外露，用户可以直接看到开孔410。
壳体100内设置有与开孔410连通的第一通道420和第二通道430，由于第一通道420和第二通道430设置于壳体100内，因此第一通道420和第二通道430不外露。第一通道420沿第一方向延伸，且与开孔410相对设置，开孔410和第一通道420用于取出卡托组件200。卡托组件200可以包括卡托210和用于驱动卡托210的推动组件220，用户通过开孔410和第一通道420取出卡托组件200的操作其实是为了取出卡托210，卡托210用于承载电子卡片。
壳体100上沿第一方向可以开设有卡托安装孔103，卡托210可以通过卡托安装孔103安装至壳体100，推动组件220与第一通道420相对设置。
具体的取卡过程为：顶针依次伸入开孔410和第一通道420，由于第一通道420与推动组件220相对设置，顶针驱动推动组件220运动，推动组件220驱动卡托210弹出卡托安装孔103，从而取出卡托210。
开孔410与声学器件300通过第二通道430相连通，此时，开孔410和第二通道430用于导音。第二通道430包括依次相连通的第一子通道431、第二子通道432和第三子通道433，第一子通道431设置于开孔410与第二子通道432之间，且第一子通道431沿第二方向延伸，第三子通道433设置于声学器件300和第二子通道432之间，且第三子通道433沿第三方向延伸。其中，第一方向、第二方向和第三方向两两相交。
可选地，第一方向可以与电子设备的长度方向相平行，第二方向可以与电子设备的宽度方向相平行，第三方向可以与电子设备的厚度方向相平行。当然，第一方向也可以相对于电子设备的长度方向倾斜一定的角度，第二方向也可以相对于电子设备的宽度方向倾斜一定的角度，第三方向也可以相对于电子设备的厚度方向倾斜一定的角度。
具体的声音传递过程中，在声学器件300为拾音器件的情况下，当用户发出声音时，声音依次通过开孔410、第一子通道431、第二子通道432和第 三子通道433传递至声学器件300。在这种实施方式中，声学器件300可以为麦克风。在声学器件300为发声器件的情况下，当声学器件300发出声音时，声音依次通过第三子通道433、第二子通道432、第一子通道431和开孔410传递至壳体100之外。在这种实施方式中，声学器件300可以为受话器或扬声器。
本申请公开的实施例中，开孔410外露，第一通道420和第二通道430不外露，第一通道420和第二通道430均通过开孔410与外界空间连通，因此开孔410为第一通道420和第二通道430的共用结构，从而减少了电子设备上外露的开孔410的数量，进而提高电子设备的外观一致性。
另外，由于卡托组件200和声学器件300共用一个外露的开孔410，因此还能够提高电子设备的防水防尘性能。
此外，由于开孔410和第一通道420相对设置，因此第一通道420也沿第一方向延伸，第一子通道431沿第二方向延伸，由于第一方向和第二方向相交，因此用户在取卡的过程中，不容易误捅声学器件300，从而提高了电子设备的安全性和可靠性。
上述实施例中，第一子通道431沿第二方向延伸、第二子通道432沿第一方向延伸，第三子通道433沿第三方向延伸，此时，通过三个子通道不同方向上的设置，可以对声学器件300灵活设置，从而能够避免由于声学器件300的安装位置固定而造成声学器件300与电子设备的其他部件发生干涉的情况。
此外，第二通道430为弯折结构，弯折结构的侧壁能够阻挡灰尘和水汽，此时大部分灰尘和水汽能够附着在弯折结构的侧壁上，从而可以避免灰尘和水汽进入到声学器件300，进而使得声学器件300的导音口不容易堵塞，进一步提高了电子设备的安全性和可靠性。
上述实施例中，第一通道420和开孔410的方向一致，因此沿开孔410的方向继续向壳体100内加工既可以加工出第一通道420，而第二通道430为弯折结构，加工难度大，因此增加了电子设备的制造难度。
电子设备的壳体100有多种结构，请参考图1至图7所示，具体地，壳体100可以包括主体部160和封堵部，主体部160为一体式结构件，主体部160可以包括主板上盖和环绕主板上盖设置的中框，此时，中框和主板上盖为一体式结构件。主板上盖用于承载电子设备的主板等部件，中框为电子设备的外观件，可以用于承载显示模组等部件。
开孔410和第一通道420可以开设于主体部160，主体部160可以沿第三方向开设有凹槽，由于第三子通道433用于与声学器件300连通，因此可知第三方向能够贯穿主体部160的表面，此时，声学器件300设置于腔体内不外露，因此沿第三方向开设的凹槽也不外露。
开孔410和第一通道420可以分别贯穿凹槽沿第一方向相对设置的两个内壁，封堵部与主体部160相连接，且遮盖凹槽的槽口，凹槽的内壁与封堵部形成的通道可以为第二通道430的部分。具体的，封堵部与凹槽的两个侧壁和凹槽的底壁围成第二通道430的部分。
本实施例中，凹槽的内壁与封堵部可以形成第二通道430的部分，由于凹槽为敞口结构，因此凹槽加工简单，因此第二通道430加工简单，从而使得电子设备的制造难度较小。另外，凹槽沿第三方向开设，凹槽的开设方向与声学器件300和壳体100的叠置方向一致，因此凹槽不容易外露，进而提高了电子设备的外观性能。
可选地，当中框110的厚度较大时，第二通道430的至少部分、开孔410和第一通道420可以开设于中框110上。当中框110的厚度较小时，开孔410可以开设于中框110上，第一通道420和第二通道430可以开设于主板上盖120上。再或者，开孔410的一部分开设于中框110，另一部分开设于主板上盖120上，对于开孔410、第一通道420和第二通道430的具体开设位置本文不作限制。
可选地，第一子通道431和第二子通道432内嵌于壳体100，第三子通道433沿第三方向贯穿壳体100，因此第三子通道433可以沿第三方向直接开设无需采用开设工艺槽的方式。因此凹槽的内壁与封堵部形成的通道可以 是第一子通道431和第二子通道432。
可选地，封堵部可以采用PET(Polyethylene terephthalate，聚对苯二甲酸乙二酯)材料制作，也可以采用泡棉、金属等材料制作，当然封堵部还可以采用其他材料制作本文不作限制。
上述实施例中，凹槽和封堵部可以形成第一子通道431和第二子通道432，主体部160的一侧可以开设有一个或者两个凹槽，凹槽开设于同一侧需要占据主体部160该侧较大的空间，因此容易占用其他部件的安装空间，造成电子设备装配不便。
基于此，在另一种可选的实施例中，封堵部可以包括第一封堵件130和第二封堵件140，第一封堵件130和第二封堵件140可以位于主体部160的相背的两侧，凹槽可以包括第一凹槽161和第二凹槽162，第一凹槽161和第二凹槽162的朝向可以相反，第一凹槽161和第二凹槽162相连通。第一封堵件130可以遮盖第一凹槽161的槽口，且第一封堵件130与第一凹槽161的内壁形成的通道为第一子通道431。第二封堵件140可以遮盖第二凹槽162的槽口，第二封堵件140和第二凹槽162的内壁形成的通道为第二子通道432，第三子通道433贯穿第二凹槽162的槽底。
本实施例中，主体部160的两侧设置有两个方向相反的凹槽，从而使得凹槽的尺寸较小，不容易占用电子设备的其他部件的安装空间。
上述实施例中，第一子通道431和第二子通道432需要连通，因此第一凹槽161和第二凹槽162需要连通，此时可以开设贯穿第一凹槽161和第二凹槽162的连通孔511，由于第一凹槽161和第二凹槽162均为敞口结构，因此连通孔511的开设较为简单方便。
为了方便第二通道430的加工，在一种可选的实施例中，在第三方向上，第一凹槽161的投影可以与第二凹槽162的投影部分重合。第二凹槽162的槽口与第一凹槽161的槽底之间的距离小于第二凹槽162的槽口与第二凹槽162的槽底之间的距离。本实施例中，由于第一凹槽161和第二凹槽162在第三方向上具有重叠的部分，因此第二凹槽162在加工时，只要第二凹槽162 的深度大于第二凹槽162的槽口至第一凹槽161的槽底之间的距离，第二凹槽162就能够贯穿第一凹槽161，从而使得第二凹槽162和第一凹槽161相连通。因此使得第二通道430加工简单方便，简化第二通道430的加工工艺。
在另一种可选的实施例中，第一凹槽161可以包括延伸方向相交的第一弯折段1611和第二弯折段1612，第一弯折段1611可以沿第二方向延伸，第二弯折段1612可以沿背离开孔410的一侧延伸，此时，第二弯折段1612朝向壳体100内延伸。第二弯折段1612与第二凹槽162相连通，第一通道420和开孔410均贯穿第一弯折段1611沿第一方向相对的两个侧壁。此处需要注意的是，上文中的第一子通道431沿第二方向延伸，此时的第一弯折段1611和第二弯折段1612沿第二方向排布，因此第一子通道431的整体延伸方向还是朝着第二方向延伸的，只是第一子通道431分成了两部分，其中一部分沿第一方向延伸，但第一子通道431的整体的延伸方向还是沿着第二方向。
本实施例中，第一凹槽161是一个近似于L形结构的凹槽，此时增加了第一子通道431的弯折长度，因此进一步提高了电子设备的防水防尘性能。
另外，第一凹槽161是一个近似于L形结构的凹槽，也进一步防止了顶针误捅声学器件300。
请再次参考图8至图16，在另一种可选的实施例中，壳体100可以包括主板上盖120和环绕主板上盖120设置的中框110，此时，中框110和主板上盖120为分离式结构。也就是说，中框110与主板上盖120需要进行装配。
开孔410可以开设于中框110，主板上盖120与中框110相对的侧壁在第一方向上开设有第三凹槽122，中框110遮盖第三凹槽122的槽口，开孔410与第三凹槽122的槽口相对且相连通，中框110和第三凹槽122的槽口相对的侧壁与第三凹槽122的内壁围成第一子通道431，第二子通道432和第一通道420均贯穿第三凹槽122的底壁。
本实施例中，由于主板上盖120和中框110为可拆分式结构，因此在主板上盖120上开设第三凹槽122，中框110与主板上盖120装配后，中框110能够遮盖住第三凹槽122，因此第三凹槽122不会外露。同时，第三凹槽122 的槽口至槽底的方向与第一方向相平行，第二子通道432沿第一方向延伸，因此可以在第三凹槽122的槽底加工第二子通道432，由于第三凹槽122为敞口结构，因此第二子通道432可以直接朝向壳体100内加工，从而使得第二通道430方便制作，进而使得电子设备的加工难度较小。
上述实施例中，中框110与主板上盖120之间具有装配缝隙，因此容易造成电子设备漏音，从而使得电子设备的声学性能降低。为此，在另一种可选的实施例中，中框110与主板上盖120之间的装配间隙可以设置有密封组件150，密封组件150可以环绕第三凹槽122的槽口边缘设置。本实施例中，密封组件150能够实现中框110和主板上盖120之间的密封连接，从而防止电子设备漏音，进而提高电子设备的声学性能。
可选地，密封组件150可以包括第一胶层、密封垫和第二胶层，密封垫设置于第一胶层和第二胶层之间，第一胶层与中框110粘接，第二胶层与主板上盖120粘接。当然，密封组件150还可以为其他结构本文不作限制。
进一步地，中框110可以开设有第一密封槽111，第一密封槽111可以环绕第三凹槽122设置，主板上盖120可以开设有第二密封槽121，第二密封槽121可以开设于第三凹槽122的槽口边缘，第一密封槽111的朝向和第二密封槽121的朝向相反。
密封组件150的部分可以位于第一密封槽111内，第一密封槽111的内侧壁延伸至第二密封槽121内。第一密封槽111的内侧壁是指靠近开孔410的一侧的侧壁。此种结构在中框110没有装配到位之前，由于第一密封槽111的内侧壁相对凸出，因此第一密封槽111的内侧壁能够顶起中框110，进而防止中框110刮翻密封组件150，因此能够对密封组件150起到保护的作用，进而提高了电子设备的装配的可靠性。另外，由于第一密封槽111的内侧壁相对凸出，因此使得第一密封槽111与密封组件150的有效密封面积增大，从而进一步提高电子设备的密封性能。此外，密封组件150位于第一密封槽111或/和第二密封槽121内时，密封组件150占用装配间隙的空间较小，因此使得中框110和主板上盖120之间的装配间隙较小，因此使得电子设备装 配的更加紧密，外观性能更好。
如图17至图20所示，第二密封凹槽与第三凹槽122形成一个台阶形的凹槽，第一密封凹槽环绕开孔410设置。
在另一种可选的实施方式中，密封组件150的部分可以位于第二密封槽121内，第二密封槽121的内侧壁延伸至第一密封槽111内。此种实施方式与上述方案的效果相同，本文不再赘述。如图21和图22所示，第一密封槽111和开孔410形成一个台阶形结构，第二密封槽121环绕第三凹槽122设置。
在另一种可选的实施例中，如图23和图24所示，主板上盖120上可以开设有第二密封槽121，第二密封槽121的两个相对的侧壁相平齐，密封组件150设置于第二密封槽121内。
或者，中框110上开设有第一密封槽111，第一密封槽111的相对的两个侧壁相平齐，密封组件150设置于第一密封槽111内。
当然，中框110与主板上盖120之间还可以采用其他密封结构，本文不作限制。
在另一种可选的实施例中，本申请公开的电子设备还可以包括防刮层710，防刮层710贴设于中框110和主板上盖120的装配间隙之间，密封组件150可以位于防刮层710与中框110之间或防刮层710与主板上盖120之间。本实施例中，防刮层710的面积较大，进而能够牢固的粘贴在中框110和主板上盖120之间，因此中框110和主板上盖120装配时不容易将密封组件150刮翻错位，因此能够提高电子设备的装配性能。同时也进一步提高中框110和主板上盖120的密封性能。
为了更好的固定防刮层710，在另一种可选的实施例中，防刮层710和中框110中，一者可以设置有第一凸起，另一者可以设置有第一凹部，第一凸起和第一凹部相互嵌设。本实施例中，第一凹部和第一凸部限位配合，从而能够限制防刮层710错位，因此能够更好的对防刮层710进行固定，避免防刮层710发生错位。
或者，在另一种可选的实施例中，防刮层710和主板上盖120中，一者可以设置有第二凸起，另一者可以设置有第二凹部，第二凸起和第二凹部可以相互嵌设。此方案与上述方案达到的效果相同，因此本文再赘述。
在另一种可选的实施例中，壳体100可以开设有容纳槽101，卡托组件200可以位于容纳槽101内。容纳槽101的槽口至容纳槽101的槽底的方向与第三方向相交或相平行，第一通道420可以与容纳槽101相连通。第一通道420的延伸方向可以与容纳槽101的槽口至容纳槽101的槽底的方向相交。本实施例中，卡托组件200可以隐藏于容纳槽101内，从而减小了卡托组件200与壳体100的堆叠高度，进而减小了电子设备的厚度。此外，由于卡托组件200隐藏于容纳槽101内，因此也使得卡托组件200不容易与电子设备的其他部件发生干涉，从而提高了电子设备的安全性和可靠性。
可选地，上文中的卡托安装孔103与容纳槽101相连通，卡托210在安装至壳体100上时，卡托210的部分位于容纳槽101内，推动组件220设置于容纳槽101内。
进一步地，本申请公开的电子设备还可以包括电路板510，电路板510与壳体100叠置，且封盖容纳槽101，声学器件300可以位于电路板510背离卡托组件200的一侧，且与电路板510电连接，电路板510可以开设有通孔511，声学器件300通过通孔511与第三子通道433相连通。本实施例中，电路板510可以封盖容纳槽101的槽口，从而防止灰尘和水汽进入容纳槽101，进而避免卡托组件200出现卡涩等现象。
上述实施例中，声音也可以传入至第一通道420内，因此造成电子设备漏音，降低电子设备的声学性能。为此，在另一种可选的实施例中，本申请公开的电子设备还可以包括推杆720，推杆720的至少部分可以位于第一通道420内，推杆720的一端与卡托组件200相接触，具体地，推杆720与上文中的推动组件220相接触。
本实施例中，推杆720能够对第一通道420进行封堵，从而能够防止第一通道420漏音，进而提高了电子设备的声学性能。另外，顶针通过推杆720 驱动卡托组件200，顶针伸入壳体100的长度较短，受力较小。因此能够防止顶针由于长度较长，受力过大而折断在壳体100内。此外，推杆720能够对第一通道420进行封堵，从而也防止灰尘和水汽通过第一通道420进入电子设备内，因此提高了电子设备的防水防尘性能。
进一步地，推杆720的周向可以开设有第三密封槽，第三密封槽内可以设置有密封圈730，推杆720与第一通道420可以通过密封圈730密封连接。此方案能够进一步提高推杆720与第一通道420之间的密封性能，从而进一步提高电子设备的声学性能和密封性能。
在另一种可选的实施例中，本申请公开的电子设备还包括防水防尘部520和密封件530，电路板510通过密封件530与壳体100密封连接，具体的，电路板510可以通过密封件530与主板上盖120密封连接。密封件530可以与通孔511相对的位置开设有避让孔531，通孔511与第三子通道433通过避让孔531相连通，防水防尘部520可以设置于避让孔531与第三子通道433之间。
本实施例中，密封件530能够对电路板510与壳体100密封连接，从而防止电路板510与壳体100的间隙处漏音。防水防尘部520能够对第三子通道433内的水汽和灰尘进行阻挡，从而防止水汽和灰尘进入声学器件300，进而避免声学器件300损坏，提高了声学器件300的安全性和可靠性。
可选地，密封件530可以为密封泡棉等结构，当然还可以为其他密封结构。防水防尘部520可以为过滤网等结构，当然还可以为其他防水防尘结构，本文不作限制。
在另一种可选的实施例中，壳体100朝向电路板510的一侧可以设置有第四凹槽102，第三子通道433贯穿第四凹槽102的槽底，防水防尘部520和密封件530可以均位于第四凹槽102内。此方案能够减小防水防尘部520和密封件530与壳体100的堆叠高度，进而减小电子设备的厚度。
上述实施例中，由于第一通道420和第一子通道431均与开孔410连通，因此顶针伸入壳体100的长度为开孔410的长度、第一子通道431的宽度与 第一通道420的长度之和，此时推动组件220的安装位置需要向壳体100内移动，此种方式容易使得卡托组件200与其他部件发生干涉。为此，可以减小推动组件220的长度，从而使得卡托组件200的安装位置不变，进而不容易使得卡托组件200与其他部件发生干涉，提高了电子设备的装配安全性。
本申请实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等设备，本申请实施例不限制电子设备的具体种类。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (12)

  1. 一种电子设备，包括壳体(100)、卡托组件(200)和声学器件(300)；
    所述卡托组件(200)和所述声学器件(300)均设置于所述壳体(100)形成的腔体内，所述壳体(100)上设置有沿第一方向延伸的开孔(410)，所述开孔(410)连通所述腔体和外界空间；
    所述壳体(100)内设置有与所述开孔(410)连通的第一通道(420)和第二通道(430)，所述第一通道(420)沿所述第一方向延伸，且与所述开孔(410)相对设置，所述开孔(410)和所述第一通道(420)用于取出所述卡托组件(200)；
    所述开孔(410)与所述声学器件(300)通过所述第二通道(430)相连通，所述第二通道(430)包括依次相连通的第一子通道(431)、第二子通道(432)和第三子通道(433)，所述第一子通道(431)设置于所述开孔(410)与所述第二子通道(432)之间，且所述第一子通道(431)沿第二方向延伸，所述第三子通道(433)设置于所述声学器件(300)和所述第二子通道(432)之间，且所述第三子通道(433)沿第三方向延伸；
    其中，所述第一方向、所述第二方向和所述第三方向两两相交。
  2. 根据权利要求1所述的电子设备，其中，所述壳体(100)包括主体部(160)和封堵部，所述主体部(160)为一体式结构件，所述开孔(410)和所述第一通道(420)开设于所述主体部(160)，所述主体部(160)沿所述第三方向开设有凹槽，所述开孔(410)和所述第一通道(420)分别贯穿所述凹槽沿所述第一方向相对设置的两个内壁，所述封堵部与所述主体部(160)相连接，且遮盖所述凹槽的槽口，所述凹槽的内壁与所述封堵部形成的通道为所述第二通道(430)的部分。
  3. 根据权利要求2所述的电子设备，其中，所述封堵部包括第一封堵件(130)和第二封堵件(140)，所述第一封堵件(130)和所述第二封堵件(140) 位于所述主体部(160)的相背的两侧，所述凹槽包括第一凹槽(161)和第二凹槽(162)，所述第一凹槽(161)和所述第二凹槽(162)的朝向相反，所述第一凹槽(161)和所述第二凹槽(162)相连通，所述第一封堵件(130)遮盖所述第一凹槽(161)的槽口，且所述第一封堵件(130)与所述第一凹槽(161)的内壁形成的通道为所述第一子通道(431)，所述第二封堵件(140)遮盖所述第二凹槽(162)的槽口，所述第二封堵件(140)和所述第二凹槽(162)的内壁形成的通道为所述第二子通道(432)，所述第三子通道(433)贯穿所述第二凹槽(162)的槽底。
  4. 根据权利要求3所述的电子设备，其中，在所述第三方向上，所述第一凹槽(161)的投影与所述第二凹槽(162)的投影部分重合，所述第二凹槽(162)的槽口与所述第一凹槽(161)的槽底之间的距离小于所述第二凹槽(162)的槽口与所述第二凹槽(162)的槽底之间的距离。
  5. 根据权利要求3所述的电子设备，其中，所述第一凹槽(161)包括延伸方向相交的第一弯折段(1611)和第二弯折段(1612)，所述第一弯折段(1611)沿所述第二方向延伸，所述第二弯折段(1612)沿背离所述开孔(410)的一侧延伸，所述第二弯折段(1612)与所述第二凹槽(162)相连通，所述第一通道(420)和所述开孔(410)均贯穿所述第一弯折段(1611)沿所述第一方向相对的两个侧壁。
  6. 根据权利要求1所述的电子设备，其中，所述壳体(100)包括主板上盖(120)和环绕所述主板上盖(120)设置的中框(110)，所述开孔(410)开设于所述中框(110)，所述主板上盖(120)与所述中框(110)相对的侧壁在所述第一方向上开设有第三凹槽(122)，所述中框(110)遮盖所述第三凹槽(122)的槽口，所述开孔(410)与所述第三凹槽(122)的槽口相对且相连通，所述中框(110)和所述第三凹槽(122)的槽口相对的侧壁与所述第三凹槽(122)的内壁围成所述第一子通道(431)，所述第二子通道(432) 和所述第一通道(420)均贯穿所述第三凹槽(122)的底壁。
  7. 根据权利要求6所述的电子设备，其中，所述中框(110)与所述主板上盖(120)之间的装配间隙设置有密封组件(150)，所述密封组件(150)环绕所述第三凹槽(122)的槽口边缘设置。
  8. 根据权利要求7所述的电子设备，其中，所述中框(110)开设有第一密封槽(111)，所述第一密封槽(111)环绕所述第三凹槽(122)设置，所述主板上盖(120)开设有第二密封槽(121)，所述第二密封槽(121)开设于所述第三凹槽(122)的槽口边缘，所述第一密封槽(111)的朝向和所述第二密封槽(121)的朝向相反；
    所述密封组件(150)的部分位于所述第一密封槽(111)内，所述第一密封槽(111)的内侧壁延伸至所述第二密封槽(121)内；或，所述密封组件(150)的部分位于所述第二密封槽(121)内，第二密封槽(121)的内侧壁延伸至所述第一密封槽(111)内。
  9. 根据权利要求7所述的电子设备，其中，所述电子设备还包括防刮层(710)，所述防刮层(710)贴设于所述中框(110)和所述主板上盖(120)的装配间隙之间，所述密封组件(150)位于所述防刮层(710)与所述中框(110)之间或所述防刮层(710)与所述主板上盖(120)之间。
  10. 根据权利要求9所述的电子设备，其中，所述防刮层(710)和所述中框(110)中，一者设置有第一凸起，另一者设置有第一凹部，所述第一凸起和所述第一凹部相互嵌设；和/或，
    所述防刮层(710)和所述主板上盖(120)中，一者设置有第二凸起，另一者设置有第二凹部，所述第二凸起和所述第二凹部相互嵌设。
  11. 根据权利要求1所述的电子设备，其中，所述壳体(100)开设有容纳槽(101)，所述卡托组件(200)位于所述容纳槽(101)内，所述容纳槽 (101)的槽口至所述容纳槽(101)的槽底的方向与所述第三方向相交或相平行，所述第一通道(420)与所述容纳槽(101)相连通，所述第一通道(420)的延伸方向与所述容纳槽(101)的槽口至所述容纳槽(101)的槽底的方向相交；
    所述电子设备还包括电路板(510)，所述电路板(510)与所述壳体(100)叠置，且封盖所述容纳槽(101)，所述声学器件(300)位于所述电路板(510)背离所述卡托组件(200)的一侧，且与所述电路板(510)电连接，所述电路板(510)开设有通孔(511)，所述声学器件(300)通过所述通孔(511)与所述第三子通道(433)相连通。
  12. 根据权利要求1所述的电子设备，其中，所述电子设备还包括推杆(720)，所述推杆(720)的至少部分位于所述第一通道(420)内，所述推杆(720)的一端与所述卡托组件(200)相接触；
    所述推杆(720)的周向开设有第三密封槽，所述第三密封槽内设置有密封圈(730)，所述推杆(720)与所述第一通道(420)通过所述密封圈(730)密封连接。
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