WO2022257707A1 - Boîtier de dispositif électronique, procédé de fabrication, et dispositif électronique - Google Patents

Boîtier de dispositif électronique, procédé de fabrication, et dispositif électronique Download PDF

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Publication number
WO2022257707A1
WO2022257707A1 PCT/CN2022/093151 CN2022093151W WO2022257707A1 WO 2022257707 A1 WO2022257707 A1 WO 2022257707A1 CN 2022093151 W CN2022093151 W CN 2022093151W WO 2022257707 A1 WO2022257707 A1 WO 2022257707A1
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WIPO (PCT)
Prior art keywords
cover
layer
water
liquid
cooling
Prior art date
Application number
PCT/CN2022/093151
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English (en)
Chinese (zh)
Inventor
仰坪炯
戈云飞
高志伟
王国辉
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to CN202280041533.7A priority Critical patent/CN117461306A/zh
Publication of WO2022257707A1 publication Critical patent/WO2022257707A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the field of electronic equipment, in particular, to an electronic equipment casing, a manufacturing method and the electronic equipment.
  • the present application provides an electronic equipment casing.
  • the electronic equipment casing includes a light-transmitting cover plate; a light-transmitting liquid cold plate, the light-transmitting liquid cold plate is arranged on the first surface of the light-transmitting cover plate, and the inside of the light-transmitting liquid cold plate has a cooling liquid A flow channel, a cooling fluid is sealed in the cooling liquid flow channel, and the transparent liquid cold plate has a cooling liquid inlet and a cooling liquid outlet connected to the cooling liquid flow channel; a piezoelectric ceramic pump, the piezoelectric ceramic pump The ceramic pump communicates with the cooling liquid channel, the piezoelectric ceramic pump has a pump-in port and a pump-out port, the pump-in port is connected to the cooling liquid outlet, and the pump-out port is connected to the cooling liquid The entrance is connected; and a decorative film layer, the decorative film layer is arranged on the side of the transparent liquid cold plate away from the transparent cover plate.
  • the electronic equipment casing is provided with a light-transmitting liquid cold plate, it can realize uniform and rapid heat dissipation, and a flowable cooling fluid is sealed in the cooling liquid channel of the light-transmitting liquid cold plate, so that the electronic equipment casing can present a dynamic Visual effects.
  • the present application provides a method for manufacturing the above-mentioned electronic equipment casing, the method includes providing the light-transmitting liquid cold plate, and making the interior of the light-transmitting liquid cold plate have A cooling liquid flow channel, a cooling fluid is sealed in the cooling liquid flow channel, and the transparent liquid cold plate has a cooling liquid inlet and a cooling liquid outlet communicating with the cooling liquid flow channel; the piezoelectric ceramic pump is provided , and make the piezoelectric ceramic pump communicate with the cooling liquid channel; form the decorative film layer on one side of the transparent liquid cold plate; keep the transparent liquid cold plate away from the decorative film The surface of the layer is attached to the first surface of the light-transmitting cover so as to obtain the housing of the electronic device.
  • the method is simple and convenient to operate, easy to realize, and easy to industrialized production, and can effectively manufacture the above-mentioned electronic equipment housing, and the manufactured electronic equipment housing can realize uniform and rapid heat dissipation, and the electronic equipment housing can display dynamic Visual effects.
  • the present application provides an electronic device, the electronic device includes the foregoing electronic device housing. Because the electronic device has the above-mentioned electronic device casing that can dissipate heat quickly and present dynamic visual effects, it has high safety and good user experience, and has all the features and advantages of the above-mentioned electronic device casing. No more details.
  • FIG. 1 shows a schematic cross-sectional structure diagram of an electronic device casing of the present application.
  • FIG. 2 shows a schematic plan view of a partial structure of an electronic device casing of the present application.
  • FIG. 3 shows a schematic cross-sectional structure diagram of another electronic device housing of the present application.
  • FIG. 4 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 5 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 6 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 7 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 8 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 9 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 10 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 11 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 12 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 13 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • FIG. 14 shows a schematic cross-sectional structure diagram of yet another housing of an electronic device of the present application.
  • Fig. 15 shows a schematic structural diagram of a piezoelectric ceramic pump of the present application.
  • Fig. 16 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.
  • Fig. 17 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.
  • Fig. 18 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.
  • FIG. 19 shows a schematic structural diagram of another heat dissipation assembly of the present application.
  • FIG. 20 shows a partial structural schematic view of another heat dissipation assembly of the present application.
  • Fig. 21 shows a partially enlarged view of a partial structure of the heat dissipation assembly of the present application.
  • Fig. 22 shows a partial structural schematic diagram of another heat dissipation assembly of the present application.
  • FIG. 23 shows a partial structural schematic diagram of yet another heat dissipation assembly of the present application.
  • FIG. 24 shows a partial flow diagram of a method for manufacturing a heat dissipation component of the present application.
  • Fig. 25 shows a schematic structural diagram of another piezoelectric ceramic pump of the present application.
  • Fig. 26 shows a schematic structural view of a one-way valve diaphragm of the present application.
  • FIG. 27 shows a schematic flow chart of a method for manufacturing an electronic device casing according to the present application.
  • Fig. 28 shows a schematic flowchart of a step of providing a light-transmitting liquid cold plate in the present application.
  • Fig. 29 shows a schematic flowchart of a step of providing a piezoelectric ceramic pump in the present application.
  • Fig. 30 shows a schematic structural view of the device for injecting cooling fluid and sealing the cooling liquid channel of the present application.
  • Fig. 31 shows a schematic plan view of another liquid cold plate of the present application.
  • Fig. 32 shows a schematic flowchart of a step of forming a decorative film layer and a first water-oxygen barrier film or a second water-oxygen barrier film of the present application.
  • the present application provides an electronic equipment housing.
  • the housing of the electronic device includes a transparent cover plate 300;
  • the interior of the optical liquid cold plate 100 has a cooling liquid channel 10, the cooling fluid is sealed in the cooling liquid channel 10, and the transparent liquid cold plate 100 has a cooling liquid communicating with the cooling liquid channel 10 Inlet and coolant outlet (not marked in the figure);
  • piezoceramic pump 200 with reference to Fig.
  • the purpose of setting the cover plate and the liquid cold plate as a light-transmitting cover plate and a light-transmitting liquid cold plate is to make the electronic equipment casing present the texture effect of a decorative film layer.
  • the light-transmitting The inside of the liquid cold plate 100 is provided with a cooling liquid flow channel 10.
  • the cooling liquid channel 10 inside the liquid cooling plate 100 enters the cooling fluid, and the flow of the cooling fluid is accelerated by the piezoelectric ceramic pump 200, thereby realizing uniform and rapid heat dissipation of the electronic device housing, and the decorative film layer is arranged on the transparent
  • One side of the liquid cold plate can make the electronic device have a texture effect; in addition, the transparent liquid cold plate is arranged on the first surface of the transparent cover plate, and the decorative film layer is arranged on the transparent liquid cold plate
  • the side away from the light-transmitting cover plate can directly see the flow of cooling fluid inside the housing of the electronic device, so that the housing of the electronic device can not only achieve uniform and rapid heat dissipation, but also present a dynamic visual effect.
  • the light-transmitting liquid cold plate 100 may include a first cover 110 (it should be noted that, in this article, the terms “first” and “second” are only used for description purposes, It cannot be understood as indicating or implying the relative importance or implicitly specifying the number of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more This feature will not be described in detail below)
  • the first cover 110 is provided with the liquid flow channel 10
  • the first cover 110 and the decorative film layer 400 seal the liquid flow channel 10 , thus, by only providing the first cover 110 and the decorative film layer 400, the overall thickness of the electronic device casing can be made thinner, which conforms to the development trend of thinning and thinning, so that the electronic device casing has a better user experience when in use. Good, good commercial prospects, at the same time, it can also achieve uniform and rapid heat dissipation and present dynamic visual effects. It can be understood that, referring to FIG.
  • the light-transmitting liquid cold plate 100 may include a first cover 110 disposed on the first surface 310 , and the housing of the electronic device further includes The first water-oxygen barrier film 501, the first water-oxygen barrier film 501 is arranged on the side of the decorative film layer 400 close to the light-transmitting liquid cold plate 100, the first cover 110 and the second A water-oxygen barrier film 501 seals the liquid channel 10.
  • the first water-oxygen barrier film 500 can make the cooling liquid channel 10 better sealed. Therefore, the cooling liquid channel 10 is sealed between the first cover 110 and the second cover 110. Between the water and oxygen barrier films 501, the cooling fluid in the cooling liquid channel 10 is not easily volatilized, so that the housing of the electronic device can present a dynamic visual effect stably for a long time.
  • the light-transmitting liquid cold plate 100 may also include a first cover 110 and a second cover 120 oppositely arranged, and the first cover 110 is arranged on the first surface 310 Above, the second cover 120 is arranged on the side of the cooling liquid channel 10 away from the first cover 110, and the cooling fluid is sealed between the first cover 110 and the second cover.
  • a second water-oxygen barrier film 500 is also provided, thus, by setting the first cover 110 and the second cover 120, The strength of the housing of the electronic device can be further enhanced, and the second water-oxygen barrier film 500 is arranged between the second cover 120 and the decorative film layer 400, which can further make the cooling fluid in the cooling liquid channel 10 less volatile, Furthermore, the housing of the electronic equipment can present dynamic visual effects stably for a long time.
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 may further include: a first primer layer 550, the first primer layer 550 is provided on the decorative The film layer 400 is on the surface close to the liquid cooling channel 10; the inorganic barrier layer 540, and the inorganic barrier layer 540 is arranged on the surface of the first primer layer 550 close to the liquid cooling channel 10; the second An undercoat layer 530, the second undercoat layer 530 is disposed on the surface of the inorganic barrier layer 540 close to the liquid cooling channel 10; a first substrate layer 520, the first substrate layer 520 is disposed on The second undercoat layer 530 is on the surface close to the liquid cooling channel 10; and the third undercoat layer 510, the third undercoat layer 510 is disposed on the first substrate layer 520 close to the cooling channel 10; on the surface of the liquid channel 10, thus, the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 can make the cooling liquid channel
  • the material forming the first base layer 520 is not particularly limited, for example, the material forming the first base layer can be PET (polyester resin);
  • the material of the three undercoat layers may be the material of conventional undercoat layers in the related art, which will not be repeated here.
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 may further include: The primer layer 550 is arranged on the surface of the decorative film layer 400 close to the liquid cooling channel 10; the inorganic barrier layer 540, the inorganic barrier layer 540 is arranged on the first primer layer 550 close to the liquid cooling channel 10; On the surface of the flow channel 10; the second undercoat layer 530, the second undercoat layer 530 is disposed on the surface of the inorganic barrier layer 540 close to the liquid cooling flow channel 10; the first substrate layer 520, the The first substrate layer 520 is disposed on the surface of the second primer layer 530 close to the liquid cooling channel 10, thus, the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 is not provided
  • the third primer layer directly seals the cooling fluid between the first cover 110 and the first water-oxygen barrier film 501 or the second cover 120, because the first substrate layer 520 and the second cover
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 may further include: an inorganic barrier layer 540 , the inorganic barrier layer 540 Provided on the surface of the first undercoat 550 close to the liquid cooling channel 10; second undercoat 530, the second undercoat 530 is provided on the inorganic barrier layer 540 close to the liquid cooling On the surface of the flow channel 10 ; the first base material layer 520 , the first base material layer 520 is disposed on the surface of the second primer layer 530 close to the liquid cooling flow channel 10 .
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 can further improve the sealing of the cooling liquid channel 10, thereby further making the cooling fluid in the cooling liquid channel 10 less volatile, and the electronic
  • the device casing can present dynamic visual effects stably for a long time.
  • the thickness of the inorganic barrier layer is not particularly limited, as long as the thickness of the inorganic barrier layer is not greater than 500nm, it will not make the overall thickness of the electronic device casing too thick, which is in line with light and thin
  • the material forming the inorganic barrier layer is not particularly limited, for example, the material forming the inorganic barrier layer may be aluminum oxide, silicon dioxide, etc.
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 may further include: It is arranged on the surface of the decorative film layer 400 close to the liquid cooling flow channel 10; the first substrate layer 520, and the first substrate layer 520 is arranged on the organic barrier layer 560 close to the liquid cooling flow channel 10 on the surface.
  • the first water-oxygen barrier film 501 or the second water-oxygen barrier film 500 can further improve the sealing of the cooling liquid channel 10, thereby further making the cooling fluid in the cooling liquid channel 10 less volatile, and the electronic
  • the device casing can present dynamic visual effects stably for a long time.
  • the material forming the organic barrier layer may be fluoride, organic silicon oxide, and the like. After a lot of careful investigation and experimental verification, the inventors found that the material of the above-mentioned organic barrier layer can make the sealing performance of the cooling liquid flow channel better compared with other types of organic barrier layer materials, and the source of the material is wide, Easy to get and low cost.
  • the second water-oxygen barrier film 500 further includes: a third primer layer 510, the third primer layer 510 is provided on the decorative film layer 400 on the surface close to the transparent liquid cold plate 100; the first substrate layer 520, the first substrate layer 520 is arranged on the surface of the third primer layer 510 close to the transparent liquid cold plate 100 On; the second primer layer 530, the second primer layer 530 is arranged on the surface of the first substrate layer 520 close to the light-transmitting liquid cold plate 100; the inorganic barrier layer 540, the inorganic barrier layer 540 is arranged on the surface of the second primer layer 530 close to the transparent liquid cold plate 100; the first primer layer 550, the first primer layer 550 is arranged on the inorganic barrier layer 540 close to the On the surface of the light-transmitting liquid cold plate 100; the first adhesive layer 570, the first adhesive layer 570 is arranged between the first primer layer 550 and the second cover 120, and is
  • the specific manner in which the first cover is arranged on the first surface is not particularly limited, as long as the first cover can be arranged on the first surface, for example, it can be placed between the first cover and the first surface An adhesive layer is arranged between them, so that the first cover is bonded to the first surface of the light-transmitting cover by gluing.
  • the specific arrangement of the second cover is not particularly limited, as long as the second cover It only needs to be arranged on one side of the cooling liquid flow channel.
  • an adhesive layer can be provided between the second cover and the cooling liquid flow channel, so that the second cover can be glued to the light-transmitting liquid cold plate The cooling liquid channel is bonded.
  • the housing of the electronic device may include a second adhesive layer 580.
  • the second adhesive layer 580 may be disposed on the decorative film layer 400 and the second water-oxygen barrier film 500, and is used to bond the decorative film layer and the second water-oxygen barrier film (refer to FIG. 11 for a schematic view of the structure), thereby further strengthening the decorative film layer and the Adhesion between the second water and oxygen barrier films; in other examples of the present application, the second adhesive layer 580 may also be arranged between the transparent cover plate 300 and the transparent liquid cold plate 100 , and used for bonding the transparent cover plate and the transparent liquid cold plate (refer to FIG.
  • the second adhesive layer 580 may also be arranged between the decorative film layer 400 and the second water-oxygen barrier film 500 , and arranged between the transparent cover plate 300 and the second water-oxygen barrier film 500 . Between the light-transmitting liquid cold plates 100 (see FIG. 13 for a schematic view of the structure).
  • the cooling fluid may include at least one of emulsion or suspension, that is, The dispersoid in the cooling fluid is immiscible with the dispersant, the dispersoid has good dispersibility in the dispersant, the dispersoid can exist stably in the dispersant without any chemical reaction, and further, the dispersant
  • the size of the mass is smaller than the height of the cooling liquid flow channel, so that the dynamic visual effect of the electronic device housing is further enhanced, thereby significantly improving the competitiveness of the product on the premise of providing users with a refreshing, stunning and refined visual impact effect.
  • the housing of the electronic device can also meet at least one of the following conditions:
  • the material of at least one of the first cover or the second cover has a water vapor permeability greater than or equal to 5 ⁇ 10 -3 g/ m 2 ⁇ 24h;
  • the material of at least one of the first cover or the second cover has a water vapor permeability of less than 5 ⁇ 10 -3 g /m 2 ⁇ 24h, when the cooling fluid only contains polymer solvent, due to its large molecular size and high melting point, in order to save costs, the material of at least one of the first cover or the second cover can be selected A material with high water vapor transmission rate, and when the cooling fluid contains water, because the atomic size of water molecules is small and volatile, the material of at
  • the materials for forming the first cover and the second cover may be the same or different. It is understood that the materials for forming the first cover and the second cover are not particularly limited, as long as It only needs to meet the above requirements, and those skilled in the art can make flexible choices according to actual needs, and details will not be repeated here.
  • the material forming the first cover and the second cover also meets the requirements of a melting point higher than 120°C and a thickness greater than 12 ⁇ m.
  • it can be a high molecular polymer material.
  • the material of the first cover and the second cover is a polymer material, the first cover and the second cover have better bending resistance, which is beneficial to reduce the difficulty of processing and forming the housing of the electronic device and make its The scope of application is wider. Those skilled in the art can make flexible selections according to actual needs, and details will not be repeated here.
  • the material forming the cooling liquid channel can be consistent with the material forming the first cover or the second cover, that is, the material forming the cooling liquid channel can be a polymer material, and the cooling liquid
  • the surface of the flow channel may not have any coating structure, so as to prevent the coating from being washed into the cooling liquid flow channel when the cooling fluid in the cooling liquid flow channel flows, which affects the dynamic visual effect of the housing of the electronic device; and, the thickness of the cooling liquid flow channel It can be greater than 50 ⁇ m. If the side wall of the cooling liquid channel is too thin, the side wall is easily broken when the cooling fluid flows, thereby affecting the dynamic visual effect of the electronic device casing.
  • the decorative film layer 400 includes a second base material layer 410 , and the second base material layer 410 is disposed on the surface of the light-transmitting liquid cold plate 100 away from the light-transmitting cover plate 300
  • Texture layer 420 the texture layer 420 is arranged on the surface of the second substrate layer 410 away from the light-transmitting liquid cold plate 300
  • Color layer 430 the color layer 430 is arranged on the texture layer 420 away from On the surface of the light-transmitting liquid cold plate 300
  • a primer layer 440 the primer layer 440 is arranged on the surface of the color layer 430 away from the light-transmitting liquid cold plate 300, so that the user includes the When placing an electronic device in an electronic device case, it is possible to avoid seeing the internal components of the electronic device.
  • the electronic equipment casing can realize a colorful texture appearance effect, and further enhance the dynamic visual effect of the electronic equipment casing.
  • the material and thickness of the second substrate layer, texture layer, color layer and primer layer are not particularly limited, as long as the requirements are met, those skilled in the art can make flexible selections according to actual needs, and are not described here. Let me tell you more.
  • a cooling liquid channel 10 is arranged in the light-transmitting liquid cold plate, and the specific shape of the cooling liquid channel 10 is not particularly limited, as long as the cooling fluid can be sealed, and The cooling fluid can be circulated under the power provided by the piezoelectric ceramic pump 200 .
  • the interior of the light-transmitting liquid cold plate can further have a partition 130, the partition 130 has a hollow pattern, and the hollow pattern forms a cooling liquid flow channel, and there are two A through hole passing through the light-transmitting liquid cold plate or the decorative film layer, the through hole is configured as the cooling liquid inlet and the cooling liquid outlet.
  • the material for forming the separator may be consistent with the material for forming the first cover or the second cover, and those skilled in the art may flexibly select according to actual needs, so details will not be repeated here.
  • the structure of the piezoelectric ceramic pump is not particularly limited.
  • the piezoelectric ceramic pump may include: The support plate in contact with the sheets, the surface of the piezoelectric ceramic sheet 251 has an electrode that can generate an electric field, and the electric field can control the vibration of the piezoelectric ceramic sheet 251; and the valve body structure, the valve body structure is arranged on the piezoelectric diaphragm and the transparent liquid Between the cold plates, and can control one of the pump-in port and the pump-out port to open and the other to close. Heat dissipation components with better temperature uniformity can be obtained by using piezoelectric ceramic pumps with low power consumption, small size, and easy assembly.
  • the piezoelectric ceramic pump may include a piezoelectric diaphragm, a base 230 and a valve body structure, and the piezoelectric diaphragm includes a piezoelectric ceramic sheet 251 and a piezoelectric ceramic
  • the support plate 220 where the sheets are in contact with has electrodes (not shown in the figure) that can generate an electric field on the surface of the piezoelectric ceramic sheet, and the electric field can control the vibration of the piezoelectric ceramic sheet 251 .
  • two opposite surfaces of the piezoelectric ceramic sheet 251 can have two electrodes, and the piezoelectric ceramic sheet can be placed in an electric field under the condition of electrification. In this way, the controllable vibration of the piezoelectric ceramic sheet can be realized to generate the power to make the cooling liquid flow.
  • the support plate 220 is located between the piezoelectric ceramic sheet and the base 230, for example, the support plate may be a stainless steel plate.
  • the thickness of the support plate can be relatively thin, and it only needs to play a certain role in supporting the piezoelectric ceramic sheet and increasing the vibration amplitude.
  • the support plate and the piezoelectric ceramic sheet can be closely attached together, and the overall thickness of the two can be about 0.2 mm.
  • the base 230 is located on the side of the support plate away from the piezoelectric ceramic sheet, and specifically may include a side wall surrounding the support plate and a bottom surface connected to the side wall.
  • the bottom surface may have a pump-in port 21 and a pump-out port 22, that is, a pump-in port and a pump-out port 22.
  • the pump outlet port is located on the surface of the base away from the side of the support plate, whereby the base defines a fluid accommodation space 240 between the pump inlet port, the bottom surface where the pump outlet port is located, and the support plate, so that the fluid accommodation space can be used on the other side.
  • the vibration of the piezoelectric ceramic sheet on the side provides the power of pumping in and pumping out for the fluid in the fluid containing space.
  • the base needs to define a cavity structure for the piezoelectric ceramic pump, and the overall thickness of the base part can be about 2 mm.
  • the valve body structure is arranged inside the fluid containing space, and can control one of the pump-in port and the pump-out port to open and the other to close.
  • the specific structure of the valve body structure is not particularly limited, as long as the cooling liquid can be pumped in and pumped out of the fluid containing space under circulation control. For example, referring to Fig. 16, Fig. 17 and Fig.
  • the valve body structure may include two one-way valves arranged in the second direction (the first one-way valve 241 and the second one-way valve 242 shown in the figure),
  • the one-way valve is located at the pump-in port and the pump-out port, and the opening directions of the two one-way valves are opposite, and the one-way valve completely covers the opening where the pump-in port and the pump-out port communicate.
  • the piezoelectric ceramic sheet vibrates next, that is, when the second direction vibrates, the one-way valve opened toward the first direction is closed, and the one-way valve opened toward the second direction is opened.
  • the cooling fluid can enter the fluid accommodation space from the pump-in port and flow out of the accommodation space from the pump-out port, so as to realize the circulating flow of the cooling fluid.
  • the direction in and out of the cooling fluid is shown by the arrows in FIG. 17 and FIG. 18 .
  • the composition of the valve body structure is not particularly limited, and the one-way valve diaphragm 253 is configured to oscillate along with the oscillation of the piezoelectric ceramic sheet 251
  • Other parts of the valve body structure have through holes corresponding to the coolant inlet and the coolant outlet. The above through holes cooperate with the hollowed out area in the check valve diaphragm 253 to control the opening of the coolant inlet and at the same time make the coolant outlet open. Close, and make the coolant outlet open while the coolant inlet is closed, thereby realizing the pumping in and pumping out of the coolant.
  • the valve body structure includes: a one-way valve upper cover and a one-way valve diaphragm, the one-way valve upper cover has a first through hole and a second through hole, and the area of the first through hole is larger than The area of the second through hole, the one-way valve diaphragm is located between the one-way valve upper cover and the light-transmitting liquid cold plate, and the one-way valve diaphragm is configured to follow the The vibration of the piezoelectric ceramic sheet oscillates, and the one-way valve diaphragm has two hollow areas with the same shape, and each of the two hollow areas has a solid part, and the solid part is covered on the top of the one-way valve.
  • the orthographic projection on is located at the first through hole and the second through hole, and the orthographic projection of the first through hole on the light-transmitting liquid cold plate completely covers the cooling liquid inlet and the One of the cooling liquid outlets, the orthographic projection of the second through hole on the transparent liquid cold plate is located in the other range of the cooling liquid inlet and the cooling liquid outlet, and, with the The orthographic projection of the solid part corresponding to the second through hole on the upper cover of the check valve completely covers the second through hole, and the solid part corresponding to the first through hole
  • the orthographic projection on the light liquid cold plate completely covers the cooling liquid inlet and one of the cooling liquid outlets.
  • the valve body structure may include a one-way valve upper cover 252 , a one-way valve diaphragm 253 , and a one-way valve lower cover 254 .
  • the piezoelectric ceramic pump can also have a base 230 to provide a space for cooling fluid to circulate inside the piezoelectric ceramic pump.
  • the one-way valve lower cover 254 also can have two through holes, one large and one small, the through hole position of the one-way valve loam cake 252 and the through hole position of the one-way valve lower cover 254 are consistent, but the one-way valve loam cake 252
  • the projection of the upper large through hole on the check valve lower cover 254 is the position of the small through hole on the check valve lower cover 254, and the projection of the small through hole on the check valve upper cover 252 on the check valve lower cover 254 It is the position of the large through hole on the check valve lower cover 254.
  • the one-way valve diaphragm 253 can be an elastic film with a thickness of about 0.005 mm. It has two hollow areas 2531 with the same shape.
  • Each of the two hollow areas 2531 has a solid part 2532.
  • the solid part 2532 is in the one-way valve.
  • the orthographic projections on the upper cover 252 and the lower check valve cover 254 can cover the small through holes on the upper check valve cover 252 and the lower check valve cover 254 .
  • the one-way valve diaphragm 253 of the valve body structure can oscillate in the first direction or in the negative direction along with the oscillation of the piezoelectric ceramic sheet 251 .
  • the one-way valve diaphragm vibrates in the first direction
  • the one-way valve diaphragm moves toward the side of the one-way valve upper cover, and the solid part at this time blocks the small through hole of the one-way valve upper cover, while the large through hole The hole is not completely covered.
  • the flow channel on the side of the large through hole of the check valve loam cake is opened, and the flow channel on the side of the small through hole is closed.
  • the one-way valve diaphragm vibrates in the second direction
  • the one-way valve diaphragm moves toward the side of the one-way valve lower cover.
  • the solid part blocks the small through hole of the one-way valve lower cover, while the large through hole If it is not completely covered, the flow channel on the side of the large through hole of the check valve loam cake is closed, and the flow channel on the side of the small through hole is opened.
  • the plate body structure of the light-transmitting liquid cold plate can be used as a piezoelectric diaphragm and The body structure provides support and acts as a base for the pump body.
  • the piezoelectric ceramic pump can be further thinned by designing the positions and sizes of the coolant inlet and the coolant outlet.
  • the valve body structure may only include: the one-way valve upper cover 252 and the one-way valve diaphragm 253 , and the one-way valve upper cover 252 and the one-way valve diaphragm 253 may be bonded together by means of glue.
  • the one-way valve upper cover 252 has a first through hole and a second through hole, the area of the first through hole is greater than the area of the second through hole, and the check valve diaphragm 253 is located between the one-way valve upper cover 252 and the through hole.
  • the one-way valve diaphragm 253 is configured to oscillate with the oscillation of the piezoelectric ceramic sheet 251.
  • the one-way valve diaphragm 253 has two hollow areas 2531 with the same shape, and the two hollow areas 2531 Each has a solid part 2532, the orthographic projection of the solid part 2532 on the upper cover of the check valve is located at the first through hole and the second through hole, and the first through hole and the second through hole are in the light-transmitting liquid cooling
  • the orthographic projections on the plate are respectively located at the cooling liquid inlet 151 and the cooling liquid outlet 152, and the orthographic projection of the first through hole on the transparent liquid cold plate completely covers one of the cooling liquid inlet and the cooling liquid outlet 150, and the second through hole
  • the orthographic projection on the light-transmitting liquid cold plate is located in another range of the cooling liquid inlet and the cooling liquid outlet 150, and the orthographic projection of the solid part corresponding to the second through hole on the check valve upper cover 252 is completely Covering the second through hole, the orthographic projection of the solid portion corresponding to the first through hole on the light-transmitting liquid cold plate completely covers one of the cooling
  • the one-way valve diaphragm 254 of the valve body structure can oscillate in the first direction or in the negative direction along with the oscillation of the piezoelectric ceramic sheet 251 .
  • the one-way valve diaphragm vibrates in the first direction
  • the one-way valve diaphragm moves toward the side of the one-way valve upper cover, and the solid part at this time blocks the second through hole of the one-way valve upper cover, while The first through hole is not completely covered.
  • the flow channel on the side of the first through hole of the check valve upper cover is opened, and the flow channel on the side of the second through hole is closed.
  • the one-way valve diaphragm moves toward the side away from the upper cover of the one-way valve, that is, moves toward the side of the light-transmitting liquid cold plate.
  • One of the cooling liquid inlet and the cooling liquid outlet corresponding to the first through hole on the light liquid cold plate, and the other one of the cooling liquid inlet and the cooling liquid outlet corresponding to the second through hole on the transparent liquid cold plate is not is completely covered, at this time, the flow channel on the side of the first through hole of the one-way valve upper cover is closed, and the flow channel on the side of the second through hole is opened.
  • the lower cover of the one-way valve and the base of the pump body can be omitted, thereby reducing the thickness of the piezoelectric ceramic pump.
  • the thickness range of the piezoelectric diaphragm of the thinned piezoelectric ceramic pump can be 0.15-0.25mm
  • the thickness range of the one-way valve cover can be 0.17-0.23mm
  • the thickness range of the one-way valve diaphragm can be 0.03-0.07mm
  • the total thickness of the piezoelectric ceramic pump can range from 0.35-0.55mm.
  • the cover (the first cover or the second cover) on the side of the piezoelectric ceramic pump when the cover (the first cover or the second cover) on the side of the piezoelectric ceramic pump is set on the light-transmitting liquid cold plate, it has good elasticity, and can follow the piezoelectric ceramic pump.
  • the cover (the first cover or the second cover) on one side of the piezoelectric ceramic pump can be set on the light-transmitting liquid cold plate to directly act as the lower cover of the one-way valve, which is beneficial to The overall thickness of the heat dissipation component is further reduced.
  • the transparent liquid cold plate can be used for internal heat uniformity or heat exchange with an external cold source to help electronic equipment maintain a lower operating temperature.
  • the energy of the heat source enters the cooling fluid through the shell of the light-transmitting liquid cold plate, and the cooling fluid is driven by the liquid pump to bring heat to the low-temperature area passing through, and is carried by natural convection or forced cooling. away from electronic equipment.
  • the heat dissipation components in the prior art are usually rigid and inflexible metal materials. Although the thermal conductivity of metal materials is relatively high, it is more conducive to the transmission of heat in the heat dissipation components. The most significant impact is that the metal translucent liquid cold plate is large in size, and there is not enough space in the electronic equipment to place it, and the metal material will cause shielding and interference to the radio frequency antenna of the electronic equipment, affecting the operation stability of the electronic equipment .
  • the inventor has adopted a piezoelectric ceramic pump as the driving pump of the cooling fluid.
  • the size of the miniature piezoelectric ceramic pump is much smaller than that of the traditional mechanical pump, and the working current is extremely low due to the extremely poor conductivity of the piezoelectric ceramic itself. , so the driving power of the piezoelectric ceramic pump is extremely low, usually on the order of tens of milliwatts, and its small size and low energy consumption are convenient for it to be mounted on electronic equipment.
  • the piezoelectric ceramic pump also abandons the electromagnetic coil in the traditional liquid pump, and will not produce any electromagnetic interference to the electronic equipment, which is conducive to improving the operation stability of the equipment.
  • the inventor directly processes the coolant channel 10 on the cover (the first cover or the second cover) by means of etching, laser, machining, etc. , so that a communicating channel is formed on the cover (the first cover or the second cover), and the cooling fluid, such as water or organic liquid, is sealed inside the cooling liquid flow channel, and the piezoelectric ceramic pump 200 is installed At any position in the cooling liquid flow channel 10, it is used to drive the cooling fluid to flow in the cooling liquid flow channel 10, and finally obtain an ultra-thin, low-cost, easy-to-assemble, low-electromagnetic interference and good temperature uniformity performance Shell components.
  • the cooling liquid flow channel may further include a blocking structure. 140, the cooling liquid inlet and the cooling liquid outlet are arranged adjacently, and the blocking structure 140 is located between the cooling liquid inlet and the cooling liquid outlet to divide the cooling liquid flow channel into a water supply area and a return water area, and one side of the water supply area is connected to the cooling liquid inlet , the water return area is connected with the coolant outlet, and the water supply area and the return water area are connected on the side away from the coolant inlet.
  • the cooling liquid flow channel is divided into a water supply area and a return water area through the setting of the blocking structure, and then the flow rate of the cooling liquid can be accelerated through the setting of the piezoelectric ceramic pump, and the temperature uniformity performance of the heat dissipation component can be improved.
  • the blocking structure 140 may be a rib to separate the cooling liquid inlet from the cooling liquid inlet. That is: the coolant inlet and the coolant outlet can be located on the upper and lower sides of the blocking structure 140 shown in FIG. 20 . Take the water outlet of the pump near the through hole 170 of the camera in FIG.
  • the water inlet and the water outlet here are spaced apart, and the cooling fluid pumped out of the outlet of the pump will not be directly sucked into the pump by the pressure of the water inlet of the pump without passing through the upper structure of the first cover.
  • the cooling fluid can flow into the lower part of the first cover at the lower part of the camera through hole 170, and then circulate from the water inlet of the pump after flowing through a complete cooling liquid channel.
  • the flow direction of the cooling liquid in the cooling liquid flow channel can be shown by the arrow in Figure 20.
  • the blocking structure 140 may also be a gap between the cooling liquid inlet and the cooling liquid outlet.
  • the gap can be a protrusion, which can also prevent the cooling fluid pumped out of the outlet of the pump from passing through the upper structure of the first cover and being directly sucked into the pump by the pressure of the water inlet of the pump. In this way, the cooling fluid can be sucked by the pump after passing through the entire cooling liquid channel, and the next cycle is performed.
  • the flow direction of the cooling fluid in the cooling liquid channel may be as shown by the arrow in FIG. 22 .
  • the channel width and arrangement of the cooling liquid channel are not particularly limited, for example, the cooling liquid channel may be S-shaped, and the flow direction of the cooling fluid is shown by the arrow in the figure As shown, when both the water supply area and the return water area are S-shaped, the flow path of the cooling fluid in the corresponding area is the longest, so the heat exchange time between the fluids is the longest, and the heat exchange effect is the best, which helps to obtain uniform temperature
  • the cooling fluid further improves the temperature uniformity performance of the heat dissipation components.
  • the depth of the cooling liquid channel is not particularly limited, for example, the depth of the cooling liquid channel may not be less than 25 microns. When the depth of the cooling liquid channel is less than 25 microns, the volume of the cooling fluid in the cooling liquid channel is small, and the cooling effect is insufficient to meet the application requirements.
  • the volume of the piezoelectric ceramic pump and the cooling liquid flow channel is not particularly limited, such as piezoelectric ceramic pump
  • the volume of the ceramic pump and the cooling liquid channel can be configured to make the flow rate of the cooling liquid in the cooling liquid channel not less than 0.5 mL/min.
  • the cooling fluid such as water, etc.
  • the piezoelectric ceramic sheet can vibrate under the action of an electric field, and the mechanical vibration can provide the power for the cooling fluid to flow.
  • the upper and lower surfaces of the usual piezoelectric ceramic sheet are coated with conductive materials (used to form electrodes) ) sheet, the material and size of the piezoelectric ceramic sheet determine the power that the piezoelectric ceramic pump can provide.
  • the specific material of the piezoelectric ceramic sheet is not particularly limited, for example, it may be zirconium-based ceramics.
  • the area of the heat dissipation component should not be too small, otherwise the heat cannot be effectively uniformed from the heat source to the area outside the heat source, that is, the size of the heat dissipation component should at least cover the electronic equipment At least one heat source in , and a non-heat source area with a sufficiently large area outside the heat source.
  • the thickness of the piezoelectric ceramic sheet is not less than 0.1mm and not more than 0.5mm, and the diameter is not less than 3mm and not more than 0.5mm.
  • it can provide enough power for the heat dissipation component to ensure that the flow rate of the cooling liquid sealed in the heat dissipation component is no less than 0.5mL/min. At the same time, it can also ensure that the volume and weight of the heat dissipation component are moderate. placed in electronic equipment.
  • the cooling liquid flow channel adjacent to the cooling liquid inlet and the cooling liquid outlet may have a buffer section, and the width of the buffer section may be larger than that at the non-buffer section. The width of the coolant channel.
  • the pump can be
  • the outgoing or pumped cooling fluid is further buffered.
  • the width of the buffer section may be at least twice the width of the cooling liquid channel at the non-buffer section.
  • the present application provides a method for manufacturing the above-mentioned electronic device casing, in conjunction with FIG. 27 , including:
  • the formation process of the cooling liquid flow channel is not particularly limited, as long as a sealed and connected cooling liquid flow channel is formed inside the light-transmitting liquid cold plate, for example, laser cutting can be used Process the required cooling liquid flow channel.
  • step S100 may further include:
  • S120 Perform alignment welding on the cooling liquid channel and the first water-oxygen barrier film or the second cover, where the alignment welding includes at least one of high-frequency welding or infrared welding.
  • the material forming the barrier layer 80 may be firstly etched, and then the barrier layer 80 is used to form a hollow pattern penetrating through the separator sheet, thereby obtaining the separator.
  • the hollowed-out pattern is a continuous curved figure.
  • the etching process may include but not limited to photolithography, laser, direct writing, etc.
  • the barrier layer 80 may be formed by spin coating, spray coating, or coating, and then photolithography, laser, direct writing, etc. may be used to Etching on the barrier layer forms a hollow pattern that runs through the separator plate, and then obtains the separator.
  • the alignment welding process may include at least one of high-frequency welding or infrared welding to form a light-transmitting liquid cold plate, and the light-transmitting liquid cold plate manufactured by the above-mentioned welding process has better sealing performance.
  • the cooling liquid channel inside the light-transmitting liquid cold plate needs to be cleaned and dried.
  • the cleaning material and drying conditions are not particularly limited, as long as the requirements are met.
  • the thickness of the separator is controlled to control the depth of the formed cooling liquid flow channel.
  • S200 Provide the piezoelectric ceramic pump, and make the piezoelectric ceramic pump communicate with the cooling liquid channel;
  • step S200 may further include:
  • S210 Connect the pump-in port of the piezoelectric ceramic pump to the coolant outlet, and connect the pump-out port of the piezoelectric ceramic pump to the coolant inlet;
  • the structure and working method of the piezoelectric ceramic pump have been described in detail above, and will not be repeated here.
  • its surface can be coated with a high water vapor barrier Materials, such as glue, etc., so that when the piezoelectric ceramic pump is bumped or impurities contaminate its surface, it is not easy to break down and fail.
  • the preparation of the cooling fluid mainly includes the following technological process: weighing and mixing various dispersants according to the amount, and fully heating and stirring; then adding an appropriate amount of dispersoid to the prepared dispersant; The mixed liquid with the dispersant is fully stirred in a vacuum, and the cooling fluid can be obtained after uniform mixing.
  • the stirring time can be longer than 30 minutes to remove the initially dissolved gas in the solvent.
  • the process of pouring cooling fluid and sealing the cooling liquid channel mainly includes the following process: Referring to FIG. 30 , the light-transmitting liquid cold plate welded in step S100 is installed in the first vacuum chamber A, and the cold plate filled with cooling fluid The liquid storage tank is placed in the second vacuum chamber B, and the cooling fluid is heated and stirred in the liquid storage tank, so that the initially dissolved gas in the cooling fluid can be fully removed.
  • the first vacuum chamber A is connected to the second vacuum chamber B through a pipeline, one end of the pipeline is connected to the liquid injection port in the first vacuum chamber A, and the other end is connected to the liquid outlet of the liquid storage tank in the second vacuum chamber B , by adjusting the pressure difference between the first vacuum chamber A and the second vacuum chamber B, the cooling fluid in the liquid storage tank is finally introduced into the light-transmitting liquid cold plate; referring to Figure 31, after the perfusion is completed, the light-transmitting liquid
  • the liquid injection port 160 and the exhaust port 180 on the cold plate are sealed.
  • the sealing method may include but not limited to a pulse welding process.
  • the heating time is not more than 20s.
  • the gap at the liquid injection port and the exhaust port, and then further increase the temperature of the welding head, specifically, the temperature of the welding head is not less than the melting point of the first cover or the second cover material, and the temperature difference between the two
  • the temperature should not exceed 60°C, and the heating time should not exceed 5s.
  • the purpose is to achieve a dense welding effect through the instant melting of the material of the first cover or the second cover.
  • the above-mentioned liquid injection port and exhaust port can be sealed by dispensing glue, welding and the like.
  • the airtightness test of the sealed translucent liquid cold plate and piezoelectric ceramic pump can be carried out by weighing method to confirm the air tightness effect of the translucent liquid cold plate and piezoelectric ceramic pump. Wipe the surface of the plate and the piezoelectric ceramic pump clean, weigh it, then place it in an oven at 65°C for 24 hours, and then weigh it. If there is no difference in the weight of the light-transmitting liquid cold plate and the piezoelectric ceramic pump before and after drying, it means that the sealing is intact. If the weight difference between the front and back is greater than 0.001g, it means that the sealing performance is poor.
  • the aforementioned method can obtain a light-transmitting liquid cold plate with a thinner overall thickness, and the design of the piezoelectric ceramic pump and the light-transmitting liquid cold plate can ensure that the cooling fluid inside the light-transmitting liquid cold plate has a certain flow rate, so that Meet the demand for uniform temperature and heat dissipation.
  • the processing method of the light-transmitting liquid cold plate is simple, the production cost is low, and it is beneficial to realize large-scale and large-scale production.
  • the process of forming the decorative film layer on one side of the light-transmitting liquid cold plate may be a conventional process of forming a decorative film layer in the related art, and details will not be repeated here.
  • the method may also include the step of forming a first water-oxygen barrier film or a second water-oxygen barrier film between the light-transmitting liquid cold plate and the decorative film layer, the first water-oxygen barrier film or the second water-oxygen barrier film
  • the preparation process of the second water-oxygen barrier film is as follows:
  • the first water-oxygen barrier film or the second water-oxygen barrier film includes a first primer layer, a first substrate layer, a second primer layer, and an inorganic barrier layer
  • the first cover or the second cover and the cooling liquid The flow channels are connected by welding, that is, the two contacting surfaces are melted by instantaneous heating, high temperature or high pressure, so that they diffuse and fuse with each other at high temperature, and finally achieve a tight connection.
  • the inventor After a lot of careful investigation and experimental verification, it was found that since the first water-oxygen barrier film or the second water-oxygen barrier film is arranged between the light-transmitting liquid cold plate or the second cover and the decorative film layer, if the first water-oxygen barrier film The film or the second water-oxygen barrier film includes a third primer layer, the cooling fluid is between the first cover and the third primer layer, and the first water-oxygen barrier film or the second cover body and the cooling liquid flow channel During welding, the third primer layer will affect the welding effect between the first water-oxygen barrier film or the second cover and the cooling liquid flow channel, therefore, the first water-oxygen barrier film or the second water-oxygen barrier film includes the third For the primer layer, the thickness of the first water-oxygen barrier film or the second water-oxygen barrier film is usually not greater than 1 ⁇ m.
  • the first water-oxygen barrier film or the second water-oxygen barrier film when the first water-oxygen barrier film or the second water-oxygen barrier film includes the aforementioned water-oxygen barrier film, the first substrate layer is far away from the second primer layer. One side may not have the third primer layer.
  • the first water-oxygen barrier film or the second water-oxygen barrier film without the third primer layer can be obtained through the above-mentioned first water-oxygen barrier film or the second water-oxygen barrier film with the third primer layer
  • the treatment methods include but are not limited to grinding, wire drawing, sandblasting, rinsing, plasma bombardment, etc., wherein grinding, wire drawing and sandblasting are performed on the first water-oxygen barrier film or the second water by mechanical external force.
  • the surface of the oxygen barrier film is mechanically rubbed and cleaned to obtain a surface without the third primer; rinsing is to dissolve the third primer by selecting a suitable organic solution, and after cleaning and drying to obtain the surface without the third primer.
  • the method on the surface of the primer layer; plasma bombardment is to bombard the surface of the first cover or the second cover material with high-energy plasma, so that the third primer layer on the surface is destroyed and decomposed, and then no third primer layer is obtained.
  • Surface method so as to obtain a transparent liquid cold plate with high reliability and good sealing.
  • the main process is: using plasma cleaning to treat the surface of the first substrate layer, Its surface can also be treated with corona to enhance surface adhesion, first coat the second primer on the surface of the first substrate layer, and then coat a layer of inorganic barrier layer on the surface of the second primer layer, which can At least one method of evaporation, magnetron sputtering and atomic deposition is used; in addition, in order to protect the inorganic barrier layer from being damaged in subsequent processes, a first primer layer can be coated on its surface.
  • the main process is: use plasma cleaning to treat the surface of the first substrate layer, and the surface can be treated with corona Treated to enhance surface adhesion, followed by an organic barrier layer.
  • the main process is as follows: Referring to Figure 10, the water-oxygen barrier film further includes the first adhesive layer, and the inorganic barrier layer and the weldable second cover pass through the first The adhesive layer is bonded, so that the second cover is directly welded to the cooling liquid flow channel, thereby protecting the inorganic barrier layer.
  • the step of forming the decorative film layer and the first water-oxygen barrier film or the second water-oxygen barrier film may further include:
  • S310 Paste the first water-oxygen barrier film or the second water-oxygen barrier film on one surface of the second substrate layer;
  • S320 sequentially forming a texture layer, a color layer and a primer layer on the other surface of the second substrate layer, so as to form the decorative film layer;
  • the manufacturing process of the aforementioned electronic equipment casing is to first prepare the light-transmitting liquid cold plate and the ceramic piezoelectric pump, and then attach the textured film, but this preparation
  • the ceramic piezoelectric pump needs to be installed in place synchronously when making the light-transmitting liquid cold plate to ensure its airtightness; Reserve the installation position of the ceramic piezoelectric pump and cut and remove it in advance, which increases the difficulty and cumbersomeness of the overall process;
  • second, during the lamination process of the decorative film layer it is easy to generate many scraps due to foreign matter contamination or unstable process. products, resulting in greater cost losses.
  • the ceramic piezoelectric pump is located above the decorative film layer, and the decorative film layer is directly arranged on the transparent liquid cold plate away from the transparent cover plate
  • the surface of the surface that is: firstly, the texture film is processed and prepared, and the second substrate layer is bonded to the first water-oxygen barrier film or the second water-oxygen barrier film.
  • the second substrate layer and the first water-oxygen barrier film are in a roll state, and the speed of lamination can be accelerated by rolling and pasting, thereby saving time and labor costs, and then the second substrate layer is far away from the first water-oxygen barrier film or the first water-oxygen barrier film.
  • One side of the two-water oxygen barrier film is sequentially subjected to texture film UV transfer and coating processes to complete the processing of the decorative film layer; then the side of the texture film away from the first water-oxygen barrier film or the second water-oxygen barrier film is polished to remove Undercoating, after the undercoating is removed, the textured film is welded to the cooling liquid flow channel and the first cover; subsequently, the surface of the textured film near the cooling liquid flow channel is screen-printed with shading ink to form the undercoating (need to explain The most important thing is that the reason for screen printing shading ink after welding is to prevent the high temperature of the welding process from destroying the shading ink layer); the follow-up process is consistent with the aforementioned scheme, that is, ceramic piezoelectric pumps are provided, and on one side of the light-transmitting liquid cold plate Forming the decorative film layer, bonding the light-transmitting liquid cold plate and the light-transmitting cover plate, etc., will not be repeated here, and finally complete the production of the electronic device casing.
  • This production process is in the process of texture film processing.
  • the lamination of the first water-oxygen barrier film or the second water-oxygen barrier film and the texture film is completed, which reduces the overall thickness of the electronic device casing, reduces the difficulty of the process, improves the process efficiency, and helps reduce the process cost.
  • the welding process is not particularly limited, as long as the first water-oxygen barrier film or the second water-oxygen barrier film can be welded together with the light-transmitting liquid cold plate. Personnel can choose flexibly according to actual needs, so I won't go into details here.
  • S400 Attach the surface of the light-transmitting liquid-cooled plate away from the decorative film layer to the first surface of the light-transmitting cover plate, so as to obtain the housing of the electronic device.
  • the process of attaching the surface of the light-transmitting liquid-cooled plate away from the decorative film layer to the first surface of the light-transmitting cover plate is not particularly limited, and those skilled in the art can Make flexible choices, so I won't go into details here.
  • the present application provides an electronic device, comprising the above-mentioned electronic device casing, the electronic device casing has an accommodation space therein; and a display screen, the display screen is arranged on the In the accommodating space, and the light emitting surface of the display screen faces the side away from the housing of the electronic device.
  • the electronic device has the above-mentioned electronic device casing that can dissipate heat quickly and present dynamic visual effects, it has high safety and good user experience, and has all the features and advantages of the above-mentioned electronic device casing. No more details.
  • the specific type of the electronic device may be a mobile phone, of course, it may also be any other type of electronic device, which will not be repeated here. As a result, the range of applications is wide.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un boîtier de dispositif électronique, un procédé de fabrication et un dispositif électronique. Le boîtier du dispositif électronique comprend une plaque de recouvrement translucide (300), une plaque de refroidissement de liquide translucide (100) étant disposée sur une première surface (310) de la plaque de recouvrement translucide (300), un intérieur de la plaque de refroidissement de liquide translucide (100) ayant un canal d'écoulement de liquide de refroidissement (10), le fluide de refroidissement étant scellé dans le canal d'écoulement de liquide de refroidissement (10), et la plaque de refroidissement de liquide translucide (100) ayant une entrée de liquide de refroidissement et une sortie de liquide de refroidissement en communication avec le canal d'écoulement de liquide de refroidissement (10) ; une pompe céramique piézoélectrique (200), la pompe céramique piézoélectrique (200) étant en communication avec le canal d'écoulement de liquide de refroidissement (10), la pompe céramique piézoélectrique (200) ayant un orifice d'entrée de pompe (21) et un orifice de sortie de pompe (22), l'orifice d'entrée de pompe (21) étant relié à la sortie de liquide de refroidissement et l'orifice de sortie de pompe (22) étant relié à l'entrée de liquide de refroidissement ; et une couche de film décoratif (400), la couche de film décoratif (400) étant disposée sur un côté de la plaque de refroidissement de liquide translucide distant de la plaque de couverture transmettant la lumière (300).
PCT/CN2022/093151 2021-06-11 2022-05-16 Boîtier de dispositif électronique, procédé de fabrication, et dispositif électronique WO2022257707A1 (fr)

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