WO2022247688A1 - 压感模组及电子设备 - Google Patents

压感模组及电子设备 Download PDF

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Publication number
WO2022247688A1
WO2022247688A1 PCT/CN2022/093291 CN2022093291W WO2022247688A1 WO 2022247688 A1 WO2022247688 A1 WO 2022247688A1 CN 2022093291 W CN2022093291 W CN 2022093291W WO 2022247688 A1 WO2022247688 A1 WO 2022247688A1
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WO
WIPO (PCT)
Prior art keywords
piezoresistor
pressure
groove
circuit board
temperature compensation
Prior art date
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Ceased
Application number
PCT/CN2022/093291
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English (en)
French (fr)
Inventor
徐伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022247688A1 publication Critical patent/WO2022247688A1/zh
Priority to US18/518,931 priority Critical patent/US12223131B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G01L1/2243—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports the supports being parallelogram-shaped
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor

Definitions

  • the application belongs to the technical field of electronic products, and in particular relates to a pressure-sensitive module and electronic equipment.
  • a group of piezoresistors are generally arranged on the upper and lower surfaces of two steel sheets arranged at intervals, so that the two sets of piezoresistors on the upper and lower surfaces form a Wheatstone bridge structure, thereby realizing the sensing function of the piezo-sensing module. .
  • the distance between the two steel sheets may easily cause the piezoresistor to be broken during the assembly process of the piezoresistor.
  • the present application aims to provide a pressure-sensitive module and electronic equipment, which can solve the problem of low yield rate in the assembly process of the pressure-sensitive module in the related art.
  • the embodiment of the present application proposes a pressure-sensitive module, including: a first flexible circuit board, a substrate, and a second flexible circuit board that are sequentially stacked, and the substrate includes a first surface and a second flexible circuit board that are opposite to each other. two surfaces, and the first surface is provided with a first groove;
  • a first piezoresistor and a second piezoresistor are provided on the side of the first flexible circuit board facing the first surface, and both the first piezoresistor and the second piezoresistor straddle the The first groove is disposed in close contact with the first surface;
  • a third piezoresistor and a fourth piezoresistor are provided on the side of the second flexible circuit board facing the second surface, the third piezoresistor is set corresponding to the first piezoresistor, and the The fourth piezoresistors are all set corresponding to the second piezoresistors, and the third piezoresistors and the fourth piezoresistors are both set close to the second surface;
  • the first piezoresistor, the second piezoresistor, the third piezoresistor and the fourth piezoresistor form a Wheatstone bridge structure
  • the piezoresistor module also includes a The Wheatstone bridge structure is electrically connected to a detection circuit, and the detection circuit is used to detect the differential voltage of the Wheatstone bridge structure.
  • an embodiment of the present application provides an electronic device, including: a display screen and the pressure-sensing module described in the first aspect, and the pressure-sensing module is located inside the display screen.
  • the fixing structure between the first flexible circuit board and the second flexible circuit board as a substrate including the first groove, it is also possible to avoid The poor rigidity of the circuit board causes the piezoresistor to be easily broken, thereby improving the yield rate of the piezo module in the assembly process.
  • Fig. 1 is one of the structural schematic diagrams of the pressure-sensitive module provided by the embodiment of the present application.
  • Fig. 2 is the structural diagram of the Wheatstone bridge structure that the embodiment of the application provides;
  • Fig. 3 is the second structural schematic diagram of the pressure-sensitive module provided by the embodiment of the present application.
  • Fig. 4 is one of the structural schematic diagrams of the substrate provided by the embodiment of the present application.
  • Fig. 5 is the second structural schematic diagram of the substrate provided by the embodiment of the present application.
  • Fig. 6 is the third schematic diagram of the structure of the pressure-sensitive module provided by the embodiment of the present application.
  • Fig. 7 is the fourth structural schematic diagram of the pressure-sensitive module provided by the embodiment of the present application.
  • Fig. 8 is the third structural schematic diagram of the substrate provided by the embodiment of the present application.
  • Fig. 9 is the fourth structural schematic diagram of the substrate provided by the embodiment of the present application.
  • FIG. 10 is the fifth schematic diagram of the structure of the pressure-sensing module provided by the embodiment of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
  • the embodiment of the present application provides a pressure-sensitive module, which includes a first flexible circuit board 10, a substrate 20, a second flexible circuit board 30, and a substrate 20 stacked in sequence. It includes a first surface 21 and a second surface 22 arranged opposite to each other, and the first surface 21 is provided with a first groove 23;
  • a first piezoresistor 11 and a second piezoresistor 12 are provided on the side of the first flexible circuit board 10 facing the first surface 21, and the first piezoresistor 11 and the second piezoresistor 12 straddle the first groove 23. And set it close to the first surface 21;
  • a third piezoresistor 31 and a fourth piezoresistor 32 are provided on the side of the second flexible circuit board 30 facing the second surface 22, the third piezoresistor 31 is set corresponding to the first piezoresistor 11, and the fourth piezoresistor The resistor 32 is set corresponding to the second piezoresistor 12, and the third piezoresistor 31 and the fourth piezoresistor 32 are both set close to the second surface 22;
  • the piezoresistor module also includes a Wheatstone bridge structure.
  • the bridge structure is electrically connected to a detection circuit (not shown), and the detection circuit is used to detect the differential voltage of the Wheatstone bridge structure.
  • the accommodating space can effectively simplify the assembly process of the pressure-sensitive module; moreover, due to the poor rigidity of the first flexible circuit board 10 and the second flexible circuit board 30, by combining the first flexible circuit board 10 and the second flexible circuit board 30 are stacked on the integrated substrate 20, which can also improve the structural strength of the pressure-sensitive module.
  • the piezoresistor itself is relatively brittle and has poor stress resistance, by setting the fixing structure between the first flexible circuit board 10 and the second flexible circuit board 30 as the substrate 20 including the first groove 23, it is also possible The phenomenon that the piezoresistor is easily broken due to the difference in stiffness between the first flexible circuit board 10 and the second flexible circuit board 30 is avoided, thereby improving the yield rate of the piezo-sensing module during the assembly process.
  • the substrate 20 in this application is used as the first flexible circuit board 10 and the second flexible circuit board.
  • the support structure of 30 not only enables the first flexible circuit board 10 and the second flexible circuit board 30 to be effectively supported by the substrate 20, but also prevents displacement between the two substrates arranged at intervals during the assembly process, thereby affecting The sensitivity and assembly yield of the pressure-sensing module; at the same time, it can also improve the reliability of the pressure-sensing module during transportation, and avoid the phenomenon that the piezo-resistor of the pressure-sensing module is broken.
  • the opening precision of the first groove 23 can also be improved, so that the width of the first groove 23 is designed to be as small as possible, so that by reducing the first groove The width of the groove 23 is used to increase the sensitivity of the pressure-sensitive module.
  • the width of the first groove 23 is negatively correlated with the sensitivity of the pressure-sensitive module, that is, the sensitivity of the pressure-sensitive module can be improved by reducing the width of the first groove 23; and/or the first concave
  • the depth of the groove 23 is positively correlated with the sensitivity of the pressure-sensitive module, that is, the sensitivity of the pressure-sensitive module can be improved by increasing the depth of the first groove 23 .
  • the sensitivity of the pressure-sensitive module can be improved by increasing the width of the first groove 23;
  • the depth of the first groove 23 is used to enhance the sensitivity of the pressure-sensitive module.
  • the differential voltage of the Wheatstone bridge structure detected by the detection circuit also changes, and the change of the differential voltage can be transmitted to
  • the processor is used to amplify internally through the processor to sense the pressure sensed by the pressure-sensitive module, and then realize the corresponding functions of the pressure-sensitive module, such as the power button function.
  • the detection circuit is electrically connected to the Wheatstone bridge structure, which can be understood as the detection circuit is electrically connected to the first piezoresistor 11, the second piezoresistor 12, the third piezoresistor 31 and the fourth piezoresistor 32. connect.
  • the processor and the detection circuit may be arranged on the first flexible circuit board 10, or on the second flexible circuit board 30, or on the first flexible circuit board 10 and the second flexible circuit board 30 respectively; Moreover, the processor and the detection circuit are electrically connected to realize signal transmission, thereby realizing the sensing function of the pressure sensing module.
  • the processor when the pressure-sensitive module is applied to an electronic device, the processor may be a central processing unit or a microprocessor of the electronic device, and the processor may be arranged on the main board of the electronic device, and be connected to the first flexible
  • the detection circuit on the circuit board 10 or the second flexible circuit board 30 is electrically connected.
  • the resistance of the first piezoresistor 11 and the second piezoresistor 12 decreases when pressed, and the third piezoresistor 31 and the fourth piezoresistor
  • the resistance value of the sense resistor 32 increases when pressed, and a voltage U can be obtained based on the working principle of the Wheatstone bridge.
  • the greater the voltage U the higher the sensitivity of the pressure-sensitive module.
  • the width of the first groove 23 is a
  • the length change of the piezoresistor after being pressed is ⁇ a
  • the length of the substrate 20 is L
  • the thickness of the substrate 20 is t
  • the coefficient of variation of the resistance value of the resistor is ⁇ ;
  • k is related to the pressing pressure, under the same pressure, the voltage U is positively correlated and linearly related to the variation coefficient ⁇ ; therefore, the thickness t of the substrate 20 can be increased, or the second The sensitivity of the pressure-sensing module can be improved by increasing the width a of the groove 23 or increasing the length L of the substrate 20 .
  • the third piezoresistor 31 and the fourth piezoresistor 32 are arranged across the projected area of the second surface 22 where the first groove 23 is located, so that the sensitivity of the piezo module can be further improved.
  • the second surface 22 is provided with a second groove 24, the projected area of the first groove 23 on the second surface 22 at least partially overlaps with the second groove 24, and the third piezoresistor 31 and the fourth piezoresistor
  • the sensing resistor 32 is disposed across the second groove 24 .
  • the second groove 24 can form the accommodating space required for the deformation of the third piezoresistor 31 and the fourth piezoresistor 32; and by setting the second groove 24, it is equivalent to the corresponding The deformation point of the area where the second groove 24 is located is closer to the area where the external force acts, so that the substrate 20 can produce greater deformation, even if the resistance values of the third piezoresistor 31 and the fourth piezoresistor 34 change when pressed The amount becomes larger, which further improves the sensitivity of the pressure-sensitive module.
  • the second groove 24 may coincide with the projected area of the first groove 23 on the second surface 22.
  • the side of the first flexible circuit board 10 facing the first surface 21 is also provided with a first temperature compensation resistor 13 and a second temperature compensation resistor 14, and the first temperature compensation resistor 13 and the second temperature compensation resistor 14 are distributed On opposite sides of the first groove 23 , the first temperature compensation resistor 13 and the second temperature compensation resistor 14 are both attached to the first surface 21 .
  • the structure of the substrate 20 on both sides of the first groove 23 is an integrated structure, the accuracy of temperature compensation of the substrate 20 by the first temperature compensation resistor 13 and the second temperature compensation resistor 14 can be improved.
  • the side of the second flexible circuit board 30 facing the second surface 22 is also provided with a third temperature compensation resistor 33 and a fourth temperature compensation resistor 34, the third temperature compensation resistor 33 and the fourth temperature compensation resistor 34 They are distributed on two opposite sides of the second groove 24 , and the third temperature compensation resistor 33 and the fourth temperature compensation resistor 34 are both attached to the second surface 22 .
  • the structure of the substrate 20 on both sides of the second groove 24 is an integrated structure, the accuracy of temperature compensation of the substrate 20 by the third temperature compensation resistor 33 and the fourth temperature compensation resistor 34 can be improved.
  • the substrate 20 in the present application can be a thermally conductive metal plate, which can improve the thermal conductivity of the substrate 20, thereby improving the temperature consistency of the temperature compensation resistor and piezoresistor, and achieving the purpose of improving the accuracy of temperature compensation.
  • the embodiment of the present application also provides an electronic device, including a display screen (not shown) and the above-mentioned pressure-sensing module, and the pressure-sensing module is located inside the display screen.
  • the first flexible circuit board of the pressure-sensing module is arranged close to the display screen, that is, the first groove of the pressure-sensing module is arranged close to the display screen.
  • the second flexible circuit board of the pressure-sensing module is disposed close to the display screen, that is, the first groove of the pressure-sensing module is disposed away from the display screen.
  • the implementation of the above-mentioned embodiment of the pressure-sensitive module is also applicable to the embodiment of the electronic device, and can achieve the same technical effect, and will not be repeated here.
  • the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA) etc.
  • UMPC ultra-mobile personal computer
  • PDA personal digital assistant
  • references to the terms “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific examples,” or “some examples” are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application.
  • schematic representations of the above terms do not necessarily refer to the same embodiment or example.
  • the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

本申请公开了一种压感模组及电子设备，包括：依次层叠设置的第一柔性电路板、基板和第二柔性电路板，基板包括相背设置的第一表面和第二表面，且第一表面设有第一凹槽；第一柔性电路板的朝向第一表面的一侧设有第一压感电阻和第二压感电阻，第一压感电阻和第二压感电阻均横跨第一凹槽、且贴合第一表面设置；第二柔性电路板的朝向第二表面的一侧设有对应第一压感电阻的第三压感电阻和对应第二压感电阻的第四压感电阻，且第三压感电阻和第四压感电阻均贴合第二表面设置；四个电阻构成惠通斯电桥结构，压感模组还包括检测电路，检测电路用于检测惠通斯电桥结构的差分电压。

Description

压感模组及电子设备
相关申请的交叉引用
本申请主张在2021年5月24日在中国提交的中国专利申请No.202110565759.4的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于电子产品技术领域，具体涉及一种压感模组及电子设备。
背景技术
随着终端技术的发展进步，越来越多的厂商使用压感模组替代原有的物理按键，以满足各种人机交互需求。
目前，一般是在间隔设置的两个钢片的上下表面分别设置一组压感电阻，以使上下表面的两组压感电阻构成惠通斯电桥结构，进而实现压感模组的感应功能。然而，由于压感模组的压感电阻的抗应力能力差，两个钢片之间的间距，容易导致压感电阻在压感模组的装配过程中出现被拉断的现象。
可见，相关技术中的压感模组的装配过程中存在良品率低的问题。
发明内容
本申请旨在提供一种压感模组及电子设备，能够解决相关技术中的压感模组的装配过程中存在良品率低的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提出了一种压感模组，包括：依次层叠设置的第一柔性电路板、基板和第二柔性电路板，所述基板包括相背设置的第一表面和第二表面，且所述第一表面设有第一凹槽；
所述第一柔性电路板的朝向所述第一表面的一侧设有第一压感电阻和第二压感电阻，所述第一压感电阻和所述第二压感电阻均横跨所述第一凹 槽、且贴合所述第一表面设置；
所述第二柔性电路板的朝向所述第二表面的一侧设有第三压感电阻和第四压感电阻，所述第三压感电阻对应所述第一压感电阻设置，所述第四压感电阻均对应所述第二压感电阻设置，且所述第三压感电阻和所述第四压感电阻均贴合所述第二表面设置；
其中，所述第一压感电阻、所述第二压感电阻、所述第三压感电阻和所述第四压感电阻构成惠通斯电桥结构，所述压感模组还包括与所述惠通斯电桥结构电连接的检测电路，所述检测电路用于检测所述惠通斯电桥结构的差分电压。
第二方面，本申请实施例提出了一种电子设备，包括：显示屏和第一方面所述的压感模组，且所述压感模组位于所述显示屏的内侧。
在本申请的实施例中，通过将位于第一柔性电路板和第二柔性电路板之间的固定结构设置成包括第一凹槽的基板，还可以避免由于第一柔性电路板和第二柔性电路板的刚度差导致的压感电阻容易被拉断的现象，进而提高压感模组在装配过程中的良品率。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本申请实施例提供的压感模组的结构示意图之一；
图2是本申请实施例提供的惠通斯电桥结构的结构图；
图3是本申请实施例提供的压感模组的结构示意图之二；
图4是本申请实施例提供的基板的结构示意图之一；
图5是本申请实施例提供的基板的结构示意图之二；
图6是本申请实施例提供的压感模组的结构示意图之三；
图7是本申请实施例提供的压感模组的结构示意图之四；
图8是本申请实施例提供的基板的结构示意图之三；
图9是本申请实施例提供的基板的结构示意图之四；
图10是本申请实施例提供的压感模组的结构示意图之五。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
如图1至图10所示，本申请实施例提供一种压感模组，该压感模组包括依次层叠设置的第一柔性电路板10、基板20和第二柔性电路板30，基板20包括相背设置的第一表面21和第二表面22，且第一表面21设有第一凹槽23；
第一柔性电路板10的朝向第一表面21的一侧设有第一压感电阻11和第二压感电阻12，第一压感电阻11和第二压感电阻12横跨第一凹槽23、且贴合第一表面21设置；
第二柔性电路板30的朝向第二表面22的一侧设有第三压感电阻31和第四压感电阻32，第三压感电阻31对应第一压感电阻11设置，第四压感电阻32对应第二压感电阻12设置，且第三压感电阻31和第四压感电阻32均贴合第二表面22设置；
其中，第一压感电阻11、第二压感电阻12、第三压感电阻31和第四压感电阻32构成惠通斯电桥结构，所述压感模组还包括与该惠通斯电桥结构电连接的检测电路(未图示)，该检测电路用于检测惠通斯电桥结构的差分电压。
本实施方式中，通过在基板20上设置第一凹槽23，相较于在两个基板之间设置间隙，以形成供第一压感电阻11和第二压感电阻12的形变所需的容置空间，可以有效简化压感模组的装配工艺；而且，由于第一柔性电路板10和第二柔性电路板30的刚度较差，通过将第一柔性电路板10和第二柔性电路板30层叠设置在一体结构的基板20上，还可以提高压感模组的结构强度。
另外，由于压感电阻本身较脆且抗应力能力差，通过将位于第一柔性电路板10和第二柔性电路板30之间的固定结构设置成包括第一凹槽23的基板20，还可以避免由于第一柔性电路板10和第二柔性电路板30的刚度差导致的压感电阻容易被拉断的现象，进而提升压感模组在装配过程中的良品率。
而且，相较于采用两个间隔设置的基板作为第一柔性电路板10和第二柔性电路板30的支撑结构，采用本申请中的基板20作为第一柔性电路板10和第二柔性电路板30的支撑结构，不仅可以使得第一柔性电路板10和第二柔性电路板30可以得到基板20的有效支撑，而且可以避免间隔设置的两个基板之间在装配的过程中产生位移，进而影响压感模组的灵敏度 及装配良品率；同时还可以提高压感模组在运输过程中的可靠性，避免压感模组的压感电阻出现被拉断的现象。
进一步的，通过在基板20上设置第一凹槽23，还可以提高第一凹槽23的开口精度，从而使得第一凹槽23的宽度设计得尽可能的小，以通过减小第一凹槽23的宽度，来达到提升压感模组的灵敏度的目的。
可选地，第一凹槽23的宽度和压感模组的灵敏度呈负相关，即可以通过减小第一凹槽23的宽度，以提升压感模组的灵敏度；和/或者第一凹槽23的深度与压感模组的灵敏度呈正相关，即可以通过增大第一凹槽23的深度，以提升压感模组的灵敏度。
比如，在基板20的厚度较小的情况下，则可以通过增大第一凹槽23的宽度，以提升压感模组的灵敏度；而在基板20较厚的情况下，则可以通过增大第一凹槽23的深度，以提升压感模组的灵敏度。
可以理解的是，在压感模组感受到形变，导致电桥电阻产生变化的情况下，检测电路检测到的惠通斯电桥结构的差分电压也发生变化，差分电压的变化情况可以传输至处理器，并通过处理器在内部进行放大，以感应压感模组所感知到的压力大小，进而实现压感模组对应的功能，比如电源按键功能等。
一示例中，检测电路与惠通斯电桥结构电连接，可以理解为检测电路与第一压感电阻11、第二压感电阻12、第三压感电阻31和第四压感电阻32电连接。
其中，处理器和检测电路可以设置在第一柔性电路板10上，也可以设置在第二柔性电路板30上，也可以分别设置在第一柔性电路板10和第二柔性电路板30上；而且，处理器和检测电路之间电气连接，以实现信号的传输，进而实现压感模组的感应功能。
一示例中，在压感模组应用到电子设备的情况下，处理器可以电子设备的中央处理器或者微处理器，且处理器可以设置在电子设备的主板上，并与设置在第一柔性电路板10或第二柔性电路板30上的检测电路电连接。
在第一压感电阻11、第二压感电阻12、第三压感电阻31和第四压感电阻32构成如图2所示的惠通斯电桥结构的情况下，且外力作用在压感模组的第一柔性电路板10的一侧的情况下，第一压感电阻11和第二压感电阻12在按压的情况下阻值减小，第三压感电阻31和第四压感电阻32在按压的情况下阻值增大，基于惠通斯电桥工作原理，就能得到一个电压量U。而且，在同样的压力条件下，这个电压量U越大，压感模组的灵敏度越高。
一示例中，在第一凹槽23的宽度为a，受压力后压感电阻的长度变化为Δa，基板20的长度为L，基板20的厚度为t，电阻的阻值变化系数为ε；
其中，电阻的阻值变化系数的公式为ε＝k*t/2*(L/a+1)；
由于在该公式中，k与按压的压力大小有关，在同等压力的情况下，电压量U与变化系数ε正相关且成线性关系；因此，可以通过增加基板20的厚度t，或者减小第一凹槽23的宽度a，或者增加基板20的长度L等方式来提高压感模组的灵敏度。
可选地，第三压感电阻31和第四压感电阻32横跨第一凹槽23在的第二表面22的投影区域设置，这样可以进一步提升压感模组的灵敏度。
可选地，第二表面22设有第二凹槽24，第一凹槽23在第二表面22的投影区域与第二凹槽24至少部分重叠，且第三压感电阻31和第四压感电阻32横跨第二凹槽24设置。
本实施方式中，第二凹槽24可以形成供第三压感电阻31和第四压感电阻32的形变所需的容置空间；而且通过设置第二凹槽24，相当于基板20的对应第二凹槽24所在区域的形变点更加靠近外力的作用区域，以使基板20可以产生更大的形变，即使第三压感电阻31和第四压感电阻34在按压的情况下阻值变化量变得更大，进而进一步提升了压感模组的灵敏度。
一示例中，第二凹槽24可以与第一凹槽23在第二表面22的投影区域 重合。
可选地，第一柔性电路板10的朝向第一表面21的一侧还设有第一温度补偿电阻13和第二温度补偿电阻14，第一温度补偿电阻13和第二温度补偿电阻14分布于第一凹槽23的两相对侧，且第一温度补偿电阻13和第二温度补偿电阻14均贴合第一表面21设置。
本实施方式中，由于基板20的位于第一凹槽23的两侧的结构为一体结构，可以提升第一温度补偿电阻13和第二温度补偿电阻14对基板20的温度补偿的准确性。
进一步可选地，第二柔性电路板30的朝向第二表面22的一侧还设有第三温度补偿电阻33和第四温度补偿电阻34，第三温度补偿电阻33和第四温度补偿电阻34分布于第二凹槽24的两相对侧，且第三温度补偿电阻33和第四温度补偿电阻34均贴合第二表面22设置。
本实施方式中，由于基板20的位于第二凹槽24的两侧的结构为一体结构，可以提升第三温度补偿电阻33和第四温度补偿电阻34对基板20的温度补偿的准确性。
另外，本申请中的基板20可以是导热金属板，这样可以提升基板20的热传导性能，进而提高温度补偿电阻和压感电阻的温度的一致性，并达到改善温度补偿的准确度的目的。
本申请实施例还提供一种电子设备，包括显示屏(未图示)和上述压感模组，压感模组位于显示屏的内侧。
一示例中，压感模组的第一柔性电路板贴合显示屏设置，即压感模组的第一凹槽靠近显示屏设置。通过这样设置，可以实现电子设备的屏下压力感应功能。
另一示例中，压感模组的第二柔性电路板贴合显示屏设置，即压感模组的第一凹槽远离显示屏设置。通过这样设置，不仅可以实现电子设备的屏下压力感应功能；而且，由于第一凹槽远离显示屏设置，即基板的压力形变点离显示屏的距离越近，从而导致基板的形变量越大，即压感模组的 检测电路检测到的电压量U越大，即可以进一步提升压感模组的灵敏度。
另外，上述压感模组实施例的实现方式同样适应于该电子设备的实施例中，并能达到相同的技术效果，在此不再赘述。
其中，电子设备可以是为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (10)

  1. 一种压感模组，包括：依次层叠设置的第一柔性电路板、基板和第二柔性电路板，所述基板包括相背设置的第一表面和第二表面，且所述第一表面设有第一凹槽；
    所述第一柔性电路板的朝向所述第一表面的一侧设有第一压感电阻和第二压感电阻，所述第一压感电阻和所述第二压感电阻均横跨所述第一凹槽、且贴合所述第一表面设置；
    所述第二柔性电路板的朝向所述第二表面的一侧设有第三压感电阻和第四压感电阻，所述第三压感电阻对应所述第一压感电阻设置，所述第四压感电阻对应所述第二压感电阻设置，且所述第三压感电阻和所述第四压感电阻均贴合所述第二表面设置；
    其中，所述第一压感电阻、所述第二压感电阻、所述第三压感电阻和所述第四压感电阻构成惠通斯电桥结构，所述压感模组还包括与所述惠通斯电桥结构电连接的检测电路，所述检测电路用于检测所述惠通斯电桥结构的差分电压。
  2. 根据权利要求1所述的压感模组，其中，所述第二表面设有第二凹槽，所述第一凹槽在所述第二表面的投影区域与所述第二凹槽至少部分重叠，且所述第三压感电阻和所述第四压感电阻均横跨所述第二凹槽设置。
  3. 根据权利要求2所述的压感模组，其中，所述第二凹槽与所述第一凹槽在所述第二表面的投影区域重合。
  4. 根据权利要求2所述的压感模组，其中，所述第一柔性电路板的朝向所述第一表面的一侧还设有第一温度补偿电阻和第二温度补偿电阻，所述第一温度补偿电阻和所述第二温度补偿电阻分布于所述第一凹槽的两相对侧，且所述第一温度补偿电阻和所述第二温度补偿电阻均贴合所述第一表面设置。
  5. 根据权利要求4所述的压感模组，其中，所述第二柔性电路板的朝 向所述第二表面的一侧还设有第三温度补偿电阻和第四温度补偿电阻，所述第三温度补偿电阻和所述第四温度补偿电阻分布于所述第二凹槽的两相对侧，且所述第三温度补偿电阻和所述第四温度补偿电阻均贴合所述第二表面设置。
  6. 根据权利要求1所述的压感模组，其中，所述第一凹槽的宽度与所述压感模组的灵敏度呈负相关，和/或所述第一凹槽的深度与所述压感模组的灵敏度呈正相关。
  7. 根据权利要求1至6中任一项所述的压感模组，其中，所述基板为导热金属片。
  8. 一种电子设备，包括显示屏和如权利要求1至7中任一项所述的压感模组，且所述压感模组位于所述显示屏的内侧。
  9. 根据权利要求8所述的电子设备，其中，所述压感模组的第一柔性电路板贴合所述显示屏设置。
  10. 根据权利要求8所述的电子设备，其中，所述压感模组的第二柔性电路板贴合所述显示屏设置。
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