WO2022247374A1

WO2022247374A1 - Electronic circuit and manufacturing apparatus therefor

Info

Publication number: WO2022247374A1
Application number: PCT/CN2022/078605
Authority: WO
Inventors: 尹涛; 朱文杰; 张金权
Original assignee: 北京梦之墨科技有限公司
Priority date: 2021-05-26
Filing date: 2022-03-01
Publication date: 2022-12-01
Also published as: CN115413122A

Abstract

Disclosed in the present application are an electronic circuit and a manufacturing apparatus therefor, which relate to the technical field of manufacturing apparatuses for electronic circuits. The apparatus comprises: an apparatus base, a motion mechanism erected on the apparatus base, and a processing kit used for realizing an electronic circuit manufacturing procedure, wherein the processing kit comprises at least two processing heads which can be mutually replaced; the motion mechanism is provided with a first assembly structure which moves along with the motion mechanism, and each processing head is respectively provided with a second assembly structure which is connected to the first assembly structure in a cooperative manner; and each processing head is detachably connected to the motion mechanism via the first assembly structure and the second assembly structure. In the embodiments of the present application, the electronic circuit manufacturing apparatus is provided with a plurality of processing heads for realizing the electronic circuit manufacturing procedure, so as to form the processing kit having consistent assembly specifications, such that the implementation of a plurality of procedures satisfying an electronic circuit can be realized by means of the processing heads, thereby reducing the apparatus cost and the space occupation of supporting apparatuses; and the manufacturing apparatus is suitable for the integration preparation of desktop-level and miniaturized electronic circuits.

Description

An electronic circuit and its manufacturing equipment

This application claims the priority of the Chinese patent application with the application number 202110574922.3 and the application name "An electronic circuit and its manufacturing equipment" submitted to the China Patent Office on May 26, 2021, the entire contents of which are incorporated in this application by reference .

technical field

The application belongs to the technical field of electronic circuit production equipment, and in particular relates to an electronic circuit and production equipment thereof.

Background technique

The market competition in the electronics manufacturing industry is becoming increasingly fierce, and realizing rapid product manufacturing and rapid verification of functional indicators has become a sharp weapon to seize the market. The manufacturing process of electronic circuits generally includes multiple processes, while traditional printers generally only have the function of printing, that is, forming conductive lines on the circuit substrate, and other processes such as drilling and cutting require matching external drill stands and cutting machines. , not only increases the equipment cost and floor space, but also affects the production efficiency due to the circulation of circuit substrates among various equipment.

application content

In view of this, an object of the present application is to propose an electronic circuit manufacturing equipment to solve the problem that the electronic circuit manufacturing equipment in the prior art cannot meet the multiple processes in the electronic circuit manufacturing process.

In some illustrative embodiments, the electronic circuit manufacturing equipment includes: an equipment base having a processing table for carrying a circuit substrate, a motion mechanism erected on the equipment base, and an electronic circuit for realizing A processing kit for manufacturing process; wherein, the processing kit includes at least two interchangeable processing heads for the same or different electronic circuit manufacturing processes; A first assembly structure above the processing table that moves in at least one dimension, each of the processing heads has a second assembly structure that is cooperatively connected with the first assembly structure; between each of the processing heads and the movement mechanism The detachable connection is realized through the first assembly structure and the second assembly structure.

In some embodiments, the connection structure between the first assembly structure and the second assembly structure includes: a clamping structure for matching to realize a fixed connection.

In some embodiments, the clamping structure is a sliding insertion structure.

In some embodiments, the connection structure between the first assembly structure and the second assembly structure further includes: an electric plug-in structure for realizing driving control of the processing head.

In some embodiments, the processing kit includes at least two of the following processing heads; a detection component for obtaining dimensional parameters on the circuit substrate; a drilling component for subtractive manufacturing of the circuit substrate; and a printing paste for use Printing components for additive fabrication on circuit substrates; blowing components to remove waste from circuit substrates; and curing components to cure printing paste.

In some embodiments, the printing assembly includes: replaceable ink tubes.

In some embodiments, a detection platform for calibrating the initial position of the processing head is also provided on the base of the device.

In some embodiments, the motion mechanism is a three-axis motion mechanism, and the first assembly structure moves along the X-axis, Y-axis, and Z-axis following the motion mechanism.

In some embodiments, the electronic circuit manufacturing equipment further includes: a casing arranged around the base of the device, and a protective cover movably connected with the casing; the protective cover is mounted on the casing Open/close on.

Another purpose of the present application is to propose an electronic circuit to solve the problems existing in the prior art.

In some demonstrative embodiments, the electronic circuit can be obtained by any one of the electronic circuit manufacturing equipment described above.

Compared with the prior art, the present application has the following advantages:

In the embodiment of the present application, the electronic circuit manufacturing equipment is equipped with a plurality of processing heads used to realize the electronic circuit manufacturing process to form a processing kit with the same assembly specifications, which can meet the implementation of multiple processes of the electronic circuit through the processing head, reducing the cost of supporting equipment. The equipment cost and occupied space are low, and it is suitable for the integrated preparation of desktop-level and miniaturized electronic circuits.

Description of drawings

Fig. 1 is the structural example of the electronic circuit manufacturing equipment (not equipped processing head) in the embodiment of the application;

Fig. 2 is the structural example of the electronic circuit manufacturing equipment (assembly processing head) in the embodiment of the present application;

3 is a perspective view of a structural example of a processing kit of an electronic circuit manufacturing device in an embodiment of the present application;

4 is a side view of a structural example of a processing kit of an electronic circuit manufacturing device in an embodiment of the present application;

FIG. 5 is a partial enlarged view of the first assembly structure of the electronic circuit manufacturing equipment example in the embodiment of the present application;

Fig. 6 is a side view of the blow-off assembly in the example of the electronic circuit manufacturing equipment in the embodiment of the present application;

Fig. 7 is a bottom view of the blow-off assembly in the example of the electronic circuit manufacturing equipment in the embodiment of the present application;

Fig. 8 is a combined top view of the first assembly structure and the second assembly structure in the embodiment of the present application;

FIG. 9 is a structural example of an electronic circuit fabrication device (closed state) in an embodiment of the present application.

Detailed ways

The following description and the accompanying drawings sufficiently illustrate specific embodiments of the application to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present application includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the application may be referred to herein individually or collectively by the term "application", which is for convenience only and is not intended to automatically limit that application if in fact more than one application is disclosed The scope is any single application or application concept.

It should be noted that the technical features in the embodiments of the present application may be combined with each other without conflict.

An electronic circuit manufacturing device is disclosed in the embodiment of the present application, specifically, as shown in Figures 1-3, Figure 1 is a structural example of the electronic circuit manufacturing device (without a processing head) in the embodiment of the present application; Figure 2 It is a structural example of the electronic circuit manufacturing equipment (assembly processing head) in the embodiment of the application; FIG. 3 is a perspective view of a structural example of the processing kit of the electronic circuit manufacturing equipment in the embodiment of the application; FIG. 4 is an example of the structure of the processing kit in the embodiment of the application. The side view of the structure example of the processing kit of the electronic circuit manufacturing equipment; FIG. 5 is a partial enlarged view of the first assembly structure of the example of the electronic circuit manufacturing equipment in the embodiment of the application; FIG. 6 is the electronic circuit in the embodiment of the application The side view of the blow-off assembly in the production equipment example; FIG. 7 is a bottom view of the blow-off assembly in the example of the electronic circuit production equipment in the embodiment of the application; FIG. 8 is the first assembly structure and the second assembly structure in the embodiment of the application The combined top view of the two assembly structures; FIG. 9 is a structural example of the electronic circuit manufacturing equipment (closed state) in the embodiment of the present application; the electronic circuit manufacturing equipment includes: an equipment base 10 with a processing table 11 carrying a circuit substrate, The motion mechanism 20 erected on the equipment base 10, and the processing kit 30 used to realize the electronic circuit manufacturing process; wherein, the processing kit 30 includes at least 2 used to realize the same or different electronic circuit manufacturing processes, and can interact with each other A replacement processing head (such as a detection assembly 30a, a drilling assembly 30b, a printing assembly 30c, and a blowing assembly 30d); the motion mechanism 20 is provided with a first assembly structure that follows the motion mechanism 20 and moves in at least one dimension on the processing table 11 21. Each processing head has a second assembly structure 31 that is mated with the first assembly structure 21, and the processing head and the motion mechanism 20 are detachably connected through the first assembly structure 21 and the second assembly structure 31, thereby The processing head assembled on the kinematic mechanism 20 can follow the kinematic mechanism 20 to move.

The processing kit in the embodiment of the present application may include a processing head that realizes one or more manufacturing processes of electronic circuit manufacturing. The manufacturing processes implemented by the processing head include but are not limited to detection, drilling, dispensing, printing, heating, and cooling , lighting, tin filling, cutting, blowing off, curing and other production processes.

Exemplarily, the detection process may refer to obtaining the size parameters of one or more dimensions on the circuit substrate by means of laser, ultrasound, photographing, contact detection, etc., not limited to length (such as X-axis direction), width (such as Y-axis direction), axis direction), height (Z axis direction), etc. In addition, defects of the circuit substrate (such as scratches, damage, pits, etc.) and subsequent processing defects on the circuit substrate (line defects, via holes, etc.) can also be obtained defects, etc.).

Exemplarily, the drilling process may refer to forming a blind hole on the circuit substrate or a via hole penetrating through the circuit substrate by means of a mechanical drill, laser ablation, punching and the like.

Exemplarily, the glue dispensing process may refer to locally applying conductive or non-conductive glue on the circuit substrate by direct writing, spraying, extrusion, etc., so as to improve the adhesion or conductive adhesion of the corresponding points on the circuit substrate. connection.

Exemplarily, the printing process may refer to using printing materials to make conductive structures and/or insulating structures on the circuit substrate through direct writing, spraying, extrusion, etc.; wherein, the conductive structures are not limited to conductive lines, metalized vias, soldering disk, and printed functional electronic components, etc.; the insulation structure is not limited to support structures, cover protection structures, identification characters, etc.

Exemplarily, the heating process may refer to performing high-temperature treatment on a part or the whole of the circuit substrate by electrothermal, photothermal and other means.

Exemplarily, the cooling process may refer to performing low-temperature treatment on a part or the whole of the circuit substrate by means of electric cooling, air cooling, and the like.

Exemplarily, the illuminating process may refer to illuminating a part or the whole of the circuit substrate through an incandescent lamp, LED, infrared light, ultraviolet light, or the like.

Exemplarily, the tin filling process may refer to forming a tin layer on the printed circuit on the circuit substrate, so as to improve the electrical performance, soldering performance and oxidation resistance of the printed circuit.

Exemplarily, the cutting process may refer to cutting the circuit substrate, the conductive structure thereon, and the insulating structure thereon.

Exemplarily, the blowing off process may refer to removing dust on the circuit substrate or waste generated during processing (such as drilling, cutting, printing, etc.).

Exemplarily, the curing process may refer to performing curing treatment on the printed structure formed by using the printing material on the circuit substrate by means of light, high temperature, low temperature, and the like.

Each production process in the embodiment of the present application can correspond to a processing head to implement the corresponding production process, such as: detection components, drilling components, dispensing components, printing components, heating components, cooling components, lighting components , refilling components, cutting components, blowing components and curing components, etc., which can respectively correspond to the above-mentioned production processes. In other embodiments, some of the manufacturing processes have the same working principle or driving control, so the same processing head can be used to realize multiple manufacturing processes.

Exemplarily, the production processes such as dispensing glue, printing insulating materials, printing conductive materials, and tin filling in the above-mentioned production processes can be implemented through the same printing component because the output methods are the same or similar. The printing material in the printing component can be replaced with the target material.

Exemplarily, the drilling and cutting in the above manufacturing process can be completed by the drilling assembly, so the drilling assembly can satisfy the implementation of the two processes.

Further, the processing kit 30 in the embodiment of the present application may at least include the following two processing heads:

A detection component 30a used to obtain dimensional parameters on the circuit substrate;

Drilling assembly 30b for subtractive manufacturing of circuit substrates;

A printing component 30c for performing additive manufacturing on a circuit substrate by using printing materials;

A blower assembly 30d for removing printing waste or dust on the circuit substrate;

A curing assembly for curing a printed structure formed with a printing material on a circuit substrate;

Heating components for high temperature treatment of circuit boards;

Cooling components for low temperature treatment of circuit substrates;

A lighting component used to provide light to the circuit substrate.

Among them, the detection component 30a can choose structures such as laser distance measuring, ultrasonic distance measuring, contact probe; the drilling component 30b can choose structures such as laser head, drill bit, punching head, etc.; Structures such as a spraying head, wherein, the printing assembly 30c has replaceable ink tubes (ink cartridges), so as to realize the printing process of different printing materials, such as realizing the functions of dispensing glue, making conductive lines, making insulating structures, and filling tin; The component 30d can choose an air pump structure, and its air outlet can be point-shaped (small-diameter air outlet), linear (long-shaped air outlet), etc.; the curing component can be selected from heat curing, infrared curing, ultraviolet curing, electronic radiation Photocure structure. Heating components can choose electric heating structure; cooling components can choose electric cooling chips; lighting components can choose incandescent lamps, LEDs, etc.

Preferably, the processing kit 30 in the embodiment of the present application may include: a detection component 30a, a drilling component 30b, a printing component 30c equipped with a plurality of replaceable printing ink tubes, and a blowing component 30d. The combination of the processing kit can satisfy most of the production processes in the production of electronic circuits.

The detection component 30a in the embodiment of the present application can at least be used to obtain the height parameter (ie, the Z-axis parameter) of the circuit substrate; for example, the FR-4 circuit substrate, which is prone to occurrence of The problem of warping and deformation, the amount of deformation is sometimes not directly detectable by the human eye, but for precision processing, the amount of deformation will lead to differences in the distance between each point of the substrate and the print head, resulting in a gap between the processing head and the circuit board. The height distance is difficult to control, so by obtaining the height parameters of the circuit substrate before processing, and using the height parameters of the circuit substrate to correct the motion parameters of the subsequent processing head (that is, the displacement of the moving component in the Z-axis direction), In this way, the precise control of the displacement of the processing head during the processing of each point on the circuit substrate can be achieved.

The drilling assembly 30b in the embodiment of the present application can at least be used for material reduction operations such as making via holes, blind holes, and cutting on the circuit substrate. Preferably, the low-cost mechanical drilling method can be used to perform blind holes, via holes, and cutting operations, and the drill bits can be replaced with different sizes and specifications according to user needs.

The printing component 30c in the embodiment of the present application can at least be used to print conductive materials on the surface of the circuit substrate or in the via holes, so as to form conductive lines and metallized via holes. It is also possible to realize dispensing, tin filling, and insulation structure production by changing the printing material. Preferably, the printing assembly in the embodiment of the present application is an extrusion-type printing needle tube, which contains printing materials inside, and a piston that acts on the printing material inside, and the external force squeezes the printing material in the tube by driving the piston. , so that the printing material comes out from the needle port at the other end to achieve ink discharge. Preferably, the printing assembly includes: a printing seat 30c1 and an extruded printing needle tube (ie ink tube) 30c2 detachably assembled on the printing seat, and the printing assembly can achieve its target printing by replacing the extruding printing needle tube containing different printing materials need. In some embodiments, other printheads can also use the same print seat structure as the print assembly as the supporting assembly structure.

Wherein, the conductive paste that can be used in the printing component is not limited to liquid metal, conductive silver paste, conductive aluminum paste, conductive copper paste, solder paste, conductive glue and the like. Insulating materials that can be used for printing components are not limited to adhesives, character inks, solder resists, curable insulating resins, and the like.

The blowing assembly 30d in the embodiment of the present application can at least be used to remove printing or cutting waste generated during the printing assembly and drilling assembly after the operation is completed.

The motion mechanism in the embodiment of the present application can move in one dimension (line), can also move in two dimensions (surface), and can also move in three dimensions (three-dimensional space), so as to realize driving processing Movement of the head in one, two or three dimensions.

Preferably, the motion mechanism in the embodiment of the present application can be a 3-axis motion mechanism, so that the movement of the processing head on the X-axis, Y-axis, and Z-axis can be realized; in other embodiments, the motion mechanism can also be a 1-axis motion mechanism The motion mechanism, 2-axis motion mechanism, 4-axis motion mechanism, 5-axis motion mechanism, and other multi-axis motion mechanisms are not limited in this application.

The matching relationship between the first assembly structure and the second assembly structure in the embodiment of the present application is not limited to one or any combination of the engagement assembly structures such as clamping, interference, and bolts.

Continuing to refer to Figures 5-8, the mating relationship between the first assembly structure 21 and the second assembly structure 31 in the embodiment of the present application can be a slide-insert structure, specifically, the first assembly structure 21 includes: chute guide rail 211; The second assembly structure 31 includes: a sliding block 311 cooperating with the chute guide rail 211 ; wherein, one side of the chute guide rail 211 is provided with a limiting structure, and the other side is used as an entrance and exit of the slide block. Further, the direction of the slideway guide rail 211 is vertical, the limit structure is arranged at the bottom thereof, and the top thereof serves as the entrance and exit of the slider 311 . When the processing head is installed, the slider 311 on the processing head can be aligned with the chute guide rail 211 on the motion mechanism 20, and the slider 311 enters the chute guide rail 211 to the limit position from top to bottom, thereby realizing processing Assembly of the head on the kinematic mechanism 20 . When replacing the processing head, it only needs to be taken out from bottom to top, and then another processing head is assembled according to the above-mentioned method.

In some embodiments, the first assembly structure 21 may further include a locking mechanism 213, which is used to provide a pressing force during the mating connection process of the first assembly structure 21 and the second assembly structure 22, so as to realize the first When the assembly structure 21 and the second assembly structure 22 are fixed, when the processing head is taken out, the extrusion force is removed first, and then the processing head is taken out.

Exemplarily, the first assembly structure includes a chute guide; the second assembly structure includes a slider; one side of the chute guide is provided with a spring extrusion perpendicular to the sliding direction of the chute guide, and its elastic direction is perpendicular to the sliding direction, In the natural state, the end of the spring extrusion occupies part of the chute, and when the processing head needs to be assembled, the spring extrusion is compressed by external force to remove the entire chute area, and then the processing head passes through it The slider enters the chute guide rail to be assembled on the motion mechanism. At this time, by removing the external force, the spring extrusion part is restored and its end is pressed against the slider, thereby further fixing the position structure of the slider in the chute guide rail.

In some embodiments, the positional relationship between the first assembly structure and the second assembly structure is not limited. The first assembly structure is located on the motion mechanism, and the second assembly structure is located on the processing head. For interchangeability, for example, the first assembly structure can also be fixed on the processing head, and the second assembly structure can also be fixed on the motion mechanism. The connection relationship between the two can refer to the above-mentioned embodiments, and will not be repeated here.

In some embodiments, the connection structure between the first assembly structure 21 and the second assembly structure 31 may also include: an electrical connection structure for realizing the drive control of the processing head; the electrical connection structure is not limited to the electrical plug-in structure, For example, the pin 212 and the socket 312 cooperate with each other. Wherein, the pins and sockets are assembled on the first assembly structure and the second assembly structure respectively, and when the pins are provided on the first assembly structure, the corresponding sockets are provided on the second assembly structure. And when the pin is arranged on the second assembly structure, the socket is located on the first assembly structure.

Exemplarily, the first assembly structure includes a chute guide rail and a socket; the second assembly structure includes a slider and a pin; when the slider completely enters the chute guide rail and touches the limit position, the pin is inserted into the opposite socket , the pins separate from the sockets when the slider is removed from the chute guide.

In some embodiments, the base of the device in the embodiment of the present application further includes: a detection table 12 for calibrating the initial position of the processing head. The detection table 12 includes four detection contacts surrounded by a square structure. During detection, the end of the processing head is located inside it, and the initial position of the processing head is corrected by touching the four detection contacts several times respectively.

Referring to FIG. 9 , in some embodiments, the electronic circuit manufacturing equipment in the embodiment of the present application may further include: a casing 40 surrounding the device base 10 and a protective cover 50 connected to the casing, wherein the protective cover 50 It is movably connected with the housing 40 , so that the protective cover 50 and the housing 40 can be opened or closed. Preferably, the protective cover and the housing can be flexibly connected by air pressure rods and hinges. Preferably, the protective cover in the embodiment of the present application can be made of a transparent material, so that the user can observe the internal components when the protective cover is closed.

Exemplarily, an example of the use of electronic circuit manufacturing equipment is disclosed in the embodiment of the present application. This example shows the process of manufacturing a double-sided circuit board by the electronic circuit manufacturing equipment in the embodiment of the present application. Specifically, it includes:

Step S1, fixing the circuit substrate on the processing platform of the equipment base;

Step S2, assembling the detection component on the motion mechanism, driving the detection component to obtain the height parameters of each point on the circuit substrate, and correcting the motion parameters for subsequent processing of each point on the circuit substrate through the obtained height parameters;

Step S3, replacing the drilling assembly and assembling it on the motion mechanism, driving the drilling assembly to form a via hole penetrating the circuit substrate on the circuit substrate;

Step S4, replace the printing assembly and assemble it on the motion mechanism, drive the printing assembly to form a first conductive circuit on the first surface of the circuit substrate, form a second conductive circuit on the second surface of the circuit substrate, and fill in the via hole The conductive paste forms a metallized via hole connecting the first conductive circuit and the second conductive circuit;

The above usage examples in the embodiment of the present application are not exclusive, and can be determined according to the user's production requirements. For example, in the case of making a single-sided circuit board, there is no need to use a drilling component. For another example, in the case of making double-sided non-interconnected circuit boards, there is also no need to use drilling components. For another example, if only via holes need to be formed on the circuit substrate, printing components and the like may not be used. The above-mentioned printing components in the embodiment of the present application can be replaced and used according to user-defined requirements, and the order of use is not limited in the embodiment of the present application.

Another object of the present application is to propose an electronic circuit that has solved the problems existing in the prior art. In some embodiments, the electronic circuit is obtained by any one of the electronic circuit manufacturing equipment described above.

Those skilled in the art should also understand that various illustrative logical blocks, modules, circuits and algorithm steps described in conjunction with the embodiments herein may be implemented as electronic hardware, computer software or a combination thereof. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims

An electronic circuit production equipment is characterized in that it includes: an equipment base with a processing table for carrying a circuit substrate, a movement mechanism erected on the equipment base, and a processing unit for realizing the electronic circuit production process Kit; wherein, the processing kit includes at least two interchangeable processing heads for realizing the same or different electronic circuit manufacturing processes;

The motion mechanism is provided with a first assembly structure that moves in at least one dimension above the processing table following the motion mechanism, and each of the processing heads has a second assembly structure that cooperates with the first assembly structure. structure;

Each processing head is detachably connected to the movement mechanism through the first assembly structure and the second assembly structure.
The electronic circuit manufacturing equipment according to claim 1, wherein the connection structure between the first assembly structure and the second assembly structure comprises: a clamping structure for matching to realize a fixed connection.
The electronic circuit manufacturing equipment according to claim 2, wherein the clamping structure is a sliding insertion structure.
The electronic circuit manufacturing equipment according to claim 2, characterized in that, the connection structure between the first assembly structure and the second assembly structure further includes: an electric plug for realizing the driving control of the processing head structure.
The electronic circuit manufacturing equipment according to claim 1, wherein the processing kit includes at least two processing heads as follows:

A detection component used to obtain dimensional parameters on the circuit substrate;

Drilling components for subtractive fabrication of circuit substrates;

Printing components for additive manufacturing on circuit substrates using printing pastes;

a blower assembly for removing waste from circuit boards; and,

Curing components used to cure printing paste.
The electronic circuit fabrication device according to claim 5, wherein the printing assembly comprises: a replaceable ink tube.
The electronic circuit manufacturing equipment according to claim 1, wherein a detection platform for calibrating the initial position of the processing head is further provided on the base of the equipment.
The electronic circuit manufacturing device according to claim 1, wherein the motion mechanism is a three-axis motion mechanism, and the first assembly structure moves along the X axis, the Y axis, and the Z axis following the motion mechanism.
The electronic circuit manufacturing device according to claim 1, further comprising: a casing arranged around the base of the device, and a protective cover movably connected with the casing; Open/close on the housing.
An electronic circuit, characterized in that it is obtained by the electronic circuit manufacturing equipment according to any one of claims 1-9.