CN215379349U - Electronic circuit and manufacturing equipment thereof - Google Patents
Electronic circuit and manufacturing equipment thereof Download PDFInfo
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- CN215379349U CN215379349U CN202121137657.4U CN202121137657U CN215379349U CN 215379349 U CN215379349 U CN 215379349U CN 202121137657 U CN202121137657 U CN 202121137657U CN 215379349 U CN215379349 U CN 215379349U
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Abstract
The utility model discloses an electronic circuit and manufacturing equipment thereof, and relates to the technical field of electronic circuit manufacturing equipment. The apparatus, comprising: the device comprises an equipment base, a motion mechanism arranged on the equipment base and a processing kit used for realizing the manufacturing process of an electronic circuit; the machining kit comprises at least 2 machining heads which are interchangeable; the movement mechanism is provided with a first assembly structure moving along with the movement mechanism, and each machining head is respectively provided with a second assembly structure in matched connection with the first assembly structure; each processing head is detachably connected with the motion mechanism through a first assembly structure and a second assembly structure. The electronic circuit manufacturing equipment in the embodiment of the utility model forms the processing kit with consistent assembly specifications by matching a plurality of processing heads for realizing the electronic circuit manufacturing process, can meet the implementation of a plurality of processes of the electronic circuit in a processing head mode, reduces the equipment cost and the occupied space of the matched equipment, and is suitable for the integrated preparation of desktop-level and miniaturized electronic circuits.
Description
Technical Field
The utility model belongs to the technical field of electronic circuit manufacturing equipment, and particularly relates to an electronic circuit and manufacturing equipment thereof.
Background
The market competition of the electronic manufacturing industry is increasingly intensified, and the realization of the quick manufacturing of products and the quick verification of functional indexes become interest for occupying the market. The manufacturing process of the electronic circuit generally comprises a plurality of processes, while the traditional printer generally only has a printing function, namely, a conductive circuit is formed on the circuit substrate, and other processes such as drilling, cutting and the like need to be realized by a matched external drilling platform and a cutting machine, so that the equipment cost and the occupied space are increased, and the circulation of the circuit substrate among equipment also affects the manufacturing efficiency.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide an electronic circuit manufacturing apparatus, so as to solve the problem that the electronic circuit manufacturing apparatus in the prior art cannot satisfy multiple processes in the electronic circuit manufacturing process.
In some demonstrative embodiments, the electronic circuit fabrication apparatus includes: the equipment comprises an equipment base with a processing table for bearing a circuit substrate, a motion mechanism erected on the equipment base and a processing kit for realizing an electronic circuit manufacturing process; wherein, the processing kit comprises at least 2 processing heads which are used for realizing the same or different electronic circuit manufacturing procedures and can be replaced mutually; the movement mechanism is provided with a first assembly structure which moves along with the movement mechanism in at least one dimension above the processing table, and each processing head is provided with a second assembly structure which is in fit connection with the first assembly structure; every processing head with through between the motion the first assembly structure with the second assembly structure realizes detachable the connection.
In some embodiments, the connecting structure between the first and second mounting structures comprises: the clamping structure is used for realizing fixed connection in a matching way.
In some embodiments, the retaining structure is a slip-and-insert structure.
In some embodiments, the connecting structure between the first and second mounting structures further comprises: the electric plug structure is used for realizing the drive control of the processing head.
In some embodiments, the process kit comprises at least 2 or fewer process heads; a detection component for obtaining the size parameter on the circuit substrate; the drilling assembly is used for reducing the material of the circuit substrate; the printing assembly is used for performing additive manufacturing on the circuit substrate by using the printing slurry; a blowing assembly for removing waste material on the circuit substrate; and a curing assembly to cure the printing paste.
In some embodiments, the printing assembly comprises: a replaceable ink tube.
In some embodiments, the equipment base is also provided with a detection table for calibrating the initial position of the processing head.
In some embodiments, the motion mechanism is a three-axis motion mechanism, and the first mounting structure moves along the X-axis, the Y-axis, and the Z-axis with the motion mechanism.
In some embodiments, the electronic circuit fabrication apparatus further comprises: the device comprises a shell which is annularly arranged around the device base and a protective cover which is movably connected with the shell; the protective cover is opened/closed on the housing.
Another objective of the present invention is to provide an electronic circuit to solve the problems of the prior art.
In some illustrative embodiments, the electronic circuit may be obtained by any one of the electronic circuit fabrication apparatuses described above.
Compared with the prior art, the utility model has the following advantages:
the electronic circuit manufacturing equipment in the embodiment of the utility model forms the processing kit with consistent assembly specifications by matching a plurality of processing heads for realizing the electronic circuit manufacturing process, can meet the implementation of a plurality of processes of the electronic circuit in a processing head mode, reduces the equipment cost and the occupied space of the matched equipment, and is suitable for the integrated preparation of desktop-level and miniaturized electronic circuits.
Drawings
Fig. 1 is a structural example of an electronic circuit fabrication apparatus (unassembled processing head) in an embodiment of the present invention;
fig. 2 is a structural example of an electronic circuit fabrication apparatus (assembly processing head) in the embodiment of the present invention;
fig. 3 is a perspective view showing an example of the structure of a process kit of the electronic circuit fabrication apparatus in the embodiment of the present invention;
fig. 4 is a side view showing an example of the structure of a process kit of the electronic circuit fabrication apparatus in the embodiment of the present invention;
fig. 5 is a partially enlarged view of a first mounting structure of an example of an electronic-circuit fabrication apparatus in the embodiment of the present invention;
FIG. 6 is a side view of a blow-off assembly in an example of an electronic circuit fabrication apparatus in an embodiment of the present invention;
FIG. 7 is a bottom view of a blow-off assembly in an example of an electronic circuit fabrication apparatus in an embodiment of the present invention;
FIG. 8 is a combined top view of a first mounting structure and a second mounting structure in an embodiment of the utility model;
fig. 9 is a configuration example of an electronic circuit fabrication apparatus (closed state) in the embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the utility model to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the utility model encompasses the full ambit of the claims, as well as all available equivalents of the claims. These embodiments of the utility model may be referred to herein, individually or collectively, by the term "utility model" merely for convenience and without intending to voluntarily limit the scope of this application to any single utility model or utility model concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
In the embodiment of the present invention, an electronic circuit manufacturing apparatus is disclosed, and specifically, as shown in fig. 1 to 3, fig. 1 is a structural example of an electronic circuit manufacturing apparatus (no processing head assembled) in the embodiment of the present invention; fig. 2 is a structural example of an electronic circuit fabrication apparatus (assembly processing head) in the embodiment of the present invention; fig. 3 is a perspective view showing an example of the structure of a process kit of the electronic circuit fabrication apparatus in the embodiment of the present invention; fig. 4 is a side view showing an example of the structure of a process kit of the electronic circuit fabrication apparatus in the embodiment of the present invention; fig. 5 is a partially enlarged view of a first mounting structure of an example of an electronic-circuit fabrication apparatus in the embodiment of the present invention; FIG. 6 is a side view of a blow-off assembly in an example of an electronic circuit fabrication apparatus in an embodiment of the present invention; FIG. 7 is a bottom view of a blow-off assembly in an example of an electronic circuit fabrication apparatus in an embodiment of the present invention; FIG. 8 is a combined top view of a first mounting structure and a second mounting structure in an embodiment of the utility model; fig. 9 is a configuration example of an electronic circuit fabrication apparatus (closed state) in the embodiment of the present invention; the electronic circuit manufacturing apparatus includes: a device base 10 having a processing table 11 for carrying a circuit board, a moving mechanism 20 mounted on the device base 10, and a processing kit 30 for performing an electronic circuit manufacturing process; wherein, the processing kit 30 comprises at least 2 processing heads (such as a detection assembly 30a, a drilling assembly 30b, a printing assembly 30c, a blowing assembly 30d) which are used for realizing the same or different electronic circuit manufacturing procedures and can be replaced with each other; the movement mechanism 20 is provided with a first assembly structure 21 which moves along with the movement mechanism 20 in at least one dimension on the processing table 11, each processing head is respectively provided with a second assembly structure 31 which is matched and connected with the first assembly structure 21, and the processing head and the movement mechanism 20 are detachably connected through the first assembly structure 21 and the second assembly structure 31, so that the processing head assembled on the movement mechanism 20 can move along with the movement mechanism 20.
The processing kit in the embodiment of the present invention may include a processing head for performing one or more manufacturing processes for manufacturing the electronic circuit, where the manufacturing processes performed by the processing head include, but are not limited to, detection, drilling, dispensing, printing, heating, cooling, lighting, tin supplement, cutting, blowing, curing, and other manufacturing processes.
For example, the detection process may refer to obtaining one or more dimensional parameters of the circuit substrate by laser, ultrasound, photographing, contact detection, and the like, and is not limited to length (e.g., X-axis direction), width (e.g., Y-axis direction), height (Z-axis direction), and the like, but may also obtain defects of the circuit substrate (e.g., scratches, damages, pits, and the like), and subsequent processing defects on the circuit substrate (e.g., line defects, via defects, and the like).
For example, the drilling process may refer to forming a blind hole or a via hole penetrating through the circuit substrate on the circuit substrate by means of a mechanical drill, laser ablation, punching, or the like.
For example, the dispensing process may be performed by applying a conductive adhesive or a non-conductive adhesive to a local area of the circuit substrate by direct writing, spraying, extruding, or the like, so as to improve the adhesion or conductive adhesion of corresponding points on the circuit substrate.
For example, the printing process may refer to manufacturing a conductive structure and/or an insulating structure on the circuit substrate by using a printing material through direct writing, spraying, extruding, or the like; the conductive structure is not limited to a conductive line, a metalized via hole, a bonding pad, a printing functional electronic element and the like; the insulating structure is not limited to a support structure, a covering protection structure, a logo character, etc.
For example, the heating process may be a process of performing a high temperature treatment on a part or the whole of the circuit substrate by using an electric heating method, a photo-thermal method, or the like.
The temperature lowering process may be a process of performing a low temperature treatment on a part or the whole of the circuit substrate by electric cooling, air cooling, or the like.
For example, the lighting process may be a process of lighting a part or the whole of the circuit substrate by an incandescent lamp, an LED, infrared light, ultraviolet light, or the like.
For example, the tin supplementing process may refer to forming a tin layer on a printed circuit on a circuit substrate, so as to improve electrical performance, soldering performance, oxidation resistance, and the like of the printed circuit.
For example, the cutting process may refer to a cutting process performed on the circuit substrate, the conductive structure thereon, and the insulating structure thereon.
For example, the blowing process may refer to a process of removing dust on the circuit substrate or waste generated during processing (e.g., drilling, cutting, printing, etc.).
For example, the curing process may be a curing process performed on the printed structure formed by the printing material on the circuit substrate by light, high temperature, low temperature, or the like.
In the embodiment of the present invention, each manufacturing process may correspond to a processing head to perform the corresponding manufacturing process, where the processing head includes: the device comprises a detection assembly, a drilling assembly, a dispensing assembly, a printing assembly, a heating assembly, a cooling assembly, an illumination assembly, a tin supplementing assembly, a cutting assembly, a blowing assembly, a curing assembly and the like, wherein the detection assembly, the drilling assembly, the dispensing assembly, the printing assembly, the heating assembly, the cooling assembly, the illumination assembly, the tin supplementing assembly, the cutting assembly, the blowing assembly, the curing assembly and the like can respectively correspond to the manufacturing procedures. In other embodiments, some of the manufacturing processes have similar operating principles or driving controls, so that multiple manufacturing processes can be performed by the same processing head.
In the manufacturing process, the manufacturing processes such as dispensing, printing insulating materials, printing conductive materials, tin supplement and the like are exemplarily the same or similar in discharging mode, so that the manufacturing process can be implemented by the same printing assembly, and only the printing materials in the printing assembly need to be replaced by target materials.
For example, the drilling and cutting in the above manufacturing process can be performed by the drilling assembly, so that the drilling assembly can satisfy the implementation of the two processes.
The electronic circuit manufacturing equipment in the embodiment of the utility model forms the processing kit with consistent assembly specifications by matching a plurality of processing heads for realizing the electronic circuit manufacturing process, can meet the implementation of a plurality of processes of the electronic circuit in a processing head mode, reduces the equipment cost and the occupied space of the matched equipment, and is suitable for the integrated preparation of desktop-level and miniaturized electronic circuits.
Further, the processing kit 30 in the embodiment of the present invention may include at least the following 2 processing heads:
a detecting element 30a for obtaining a dimension parameter on the circuit substrate;
a drilling assembly 30b for reducing the material of the circuit substrate;
a printing component 30c for additive manufacturing on the circuit substrate by using the printing material;
a blowing assembly 30d for removing printing waste or dust on the circuit substrate;
a curing assembly for curing a printed structure formed on the circuit substrate using the printing material;
a heating assembly for performing high temperature processing on the circuit substrate;
a cooling component for carrying out low-temperature treatment on the circuit substrate;
an illumination assembly for providing illumination to the circuit substrate.
Wherein, the detection component 30a can select structures such as laser ranging, ultrasonic ranging, contact probes and the like; the drilling assembly 30b can be selected from a laser head, a drill bit, a punching head and the like; the printing component 30c can select structures such as an extrusion head, a straight writing head, a spraying head and the like, wherein the printing component 30c is provided with a replaceable ink tube (ink box) so as to realize printing processes of different printing materials, such as functions of dispensing, conductive circuit manufacturing, insulating structure manufacturing and tin supplement; the blowing-off component 30d can be an air pump structure, and the air outlet can be a point-shaped air outlet (small-caliber air outlet), a linear air outlet (long-strip-shaped air outlet) and the like; the curing component can be a thermosetting structure, an infrared curing structure, an ultraviolet curing structure and an electronic irradiation curing structure. The heating component can be an electric heating structure; the cooling component can be an electric cooling sheet; the illumination component can be selected from incandescent lamps, LEDs and the like.
Preferably, the process kit 30 in the embodiment of the present invention may include: a sensing assembly 30a, a drilling assembly 30b, a printing assembly 30c that supports a plurality of replaceable printing ink tubes, and a blowing assembly 30 d. The combination of the processing kit can meet most manufacturing procedures in electronic circuit manufacturing.
The detecting assembly 30a in the embodiment of the present invention is at least used for obtaining a height parameter (i.e. a Z-axis parameter) of the circuit substrate; for example, in an FR-4 circuit board, the problem of warpage is likely to occur during processing, transportation, storage, trimming, and fixing, and the amount of deformation may not be directly perceived by human eyes, but for precision processing, the amount of deformation causes a difference in distance between each point of the board and the print head, and thus the height distance between the processing head and the circuit board is difficult to control.
The drilling assembly 30b of the present embodiment is at least used for material reduction operations such as via hole formation, blind hole formation, and cutting on a circuit substrate. Preferably, the operation of blind hole, via hole, cutting can be carried out with the mode of the lower mechanical drilling of optional cost, and its drill bit can change different dimensions according to user's demand.
The printing assembly 30c of the present embodiment may be used to print conductive material on at least the surface of the circuit substrate or within the vias to form conductive traces and metallized vias. The manufacture of the adhesive dispensing, tin supplementing and insulating structure can also be realized by replacing printing materials. Preferably, the printing component in the embodiment of the utility model is an extrusion type printing needle tube, the inside of the extrusion type printing needle tube contains printing materials, the top of the extrusion type printing needle tube is provided with a piston piece acting on the printing materials in the extrusion type printing needle tube, and the printing materials are extruded from a needle opening at the other end by external acting force through driving the piston piece. Preferably, the printing assembly comprises: printing seat 30c1 and extrusion type printing needle tube (i.e. ink tube) 30c2 which can be detachably assembled on the printing seat, and the printing assembly can realize the target printing requirement by replacing the extrusion type printing needle tube containing different printing materials. In some embodiments, other print heads may also use the same print head seat structure as the print assembly as the support assembly structure.
The conductive paste that can be used for the printing component is not limited to liquid metal, conductive silver paste, conductive aluminum paste, conductive copper paste, solder paste, conductive paste, and the like. The insulating material that the printing component can use is not limited to adhesives, character inks, solder resists, curable insulating resins, and the like.
The blowing assembly 30d of the present embodiment is at least used to remove printing or cutting waste generated during the printing assembly and the drilling assembly after the printing assembly and the drilling assembly are completed.
The movement mechanism in the embodiment of the utility model can move on one dimension (line), two dimensions (surfaces) and three dimensions (three-dimensional space), so that the movement of the processing head on one dimension, two dimensions or three dimensions is realized.
Preferably, the motion mechanism in the embodiment of the present invention may be a 3-axis motion mechanism, so that the movement of the processing head on the X axis, the Y axis and the Z axis can be realized; in other embodiments, the motion mechanism may also be a 1-axis motion mechanism, a 2-axis motion mechanism, a 4-axis motion mechanism, a 5-axis motion mechanism, or even other multi-axis motion mechanisms, which is not limited by the present invention.
The fitting relationship between the first fitting structure and the second fitting structure in the embodiment of the present invention is not limited to one or any combination of fitting structures such as a clamping structure, an interference structure, and a bolt.
With continued reference to fig. 5-8, the mating relationship between the first mounting structure 21 and the second mounting structure 31 in the embodiment of the present invention may be a slide-in structure, and specifically, the first mounting structure 21 includes: a chute guide 211; the second fitting structure 31 includes: a slider 311 that is engaged with the chute guide 211; wherein, one side of the chute guide rail 211 is provided with a limit structure, and the other side thereof is used as an inlet and an outlet of the slide block. Further, the direction of the chute guide rail 211 is vertical, the limiting structure is arranged at the bottom of the chute guide rail, and the top of the chute guide rail is used as an inlet and an outlet of the sliding block 311. When the machining head is installed, the sliding block 311 on the machining head can be aligned with the sliding groove guide rail 211 on the movement mechanism 20, and the sliding block 311 enters the sliding groove guide rail 211 to a limiting position from top to bottom, so that the assembly of the machining head on the movement mechanism 20 is realized. When the machining head is replaced, the machining head is only required to be taken out from bottom to top, and then the other machining head is assembled according to the mode.
In some embodiments, the first mounting structure 21 may further include a locking mechanism 213 for providing a compressive force during mating engagement of the first mounting structure 21 and the second mounting structure 22 to secure the first mounting structure 21 and the second mounting structure 22 and remove the compressive force and remove the tool head when the tool head is removed.
Illustratively, the first mounting structure includes a chute guide; the second assembly structure comprises a sliding block; one side of the chute guide rail is provided with a spring extrusion piece perpendicular to the sliding direction of the chute guide rail, the elastic direction of the spring extrusion piece is perpendicular to the sliding direction, under the natural state, the end part of the spring extrusion piece occupies part of the chute, when the machining head needs to be assembled, the spring extrusion piece is compressed through external force to enable the spring extrusion piece to be integrally removed from the chute area, the machining head enters the chute guide rail through the upper sliding block of the machining head to enable the machining head to be assembled on the moving mechanism, at the moment, the spring extrusion piece is recovered through removing the external force and the end part of the spring extrusion piece is abutted to the sliding block, and therefore the position structure of the sliding block in the chute guide rail is further fixed.
In some embodiments, the position relationship between the first assembling structure and the second assembling structure is not limited to that the first assembling structure is located on the moving mechanism, the second assembling structure is located on the processing head, and the positions of the first assembling structure and the second assembling structure are interchangeable, for example, the first assembling structure may also be fixed on the processing head, and the second assembling structure may also be fixed on the moving mechanism, and the matching connection relationship between the first assembling structure and the second assembling structure may refer to the above embodiments, and will not be described herein again.
In some embodiments, the connection structure between the first and second fitting structures 21 and 31 may further include: an electric connection structure for realizing the drive control of the processing head; the electrical connection structure is not limited to an electrical plug-in structure, such as the mating pin 212 and socket 312. The contact pin and the jack are respectively assembled on the first assembly structure and the second assembly structure, and the corresponding jack is arranged on the second assembly structure under the condition that the contact pin is arranged on the first assembly structure. And when the pin is arranged on the second assembling structure, the jack is positioned on the first assembling structure.
Illustratively, the first mounting structure includes a chute guide and a receptacle; the second assembling structure comprises a sliding block and a contact pin; when the sliding block completely enters the sliding groove guide rail and abuts against the limiting position, the contact pin is inserted into the insertion hole opposite to the sliding groove guide rail, and when the sliding block is removed from the sliding groove guide rail, the contact pin is separated from the insertion hole.
In some embodiments, the device base in embodiments of the present invention further includes: a detection station 12 for calibrating the initial position of the machining head. The inspection station 12 includes 4 inspection contacts surrounding a square structure, and the initial position of the machining head is corrected by positioning the end of the machining head inside the inspection station and by touching the 4 inspection contacts a plurality of times.
Referring to fig. 9, in some embodiments, the electronic circuit manufacturing apparatus in the embodiments of the present invention may further include: a housing 40 surrounding the device base 10 and a protective cover 50 connected with the housing, wherein the protective cover 50 is movably connected with the housing 40, so that the protective cover 50 and the housing 40 can be opened or closed. Preferably, the protective cover and the shell can be movably connected through a pneumatic rod and a hinge. Preferably, the protective cover of the embodiment of the present invention is made of a transparent material, so that the user can observe the internal device when the protective cover is closed.
Illustratively, the embodiment of the present invention discloses a use example of an electronic circuit manufacturing apparatus, which shows a process of manufacturing a double-sided circuit board by the electronic circuit manufacturing apparatus in the embodiment of the present invention, and specifically includes:
step S1, fixing the circuit substrate on a processing platform of the equipment base;
step S2, assembling the detection assembly on the motion mechanism, driving the detection assembly to obtain the height parameters of each point on the circuit substrate, and correcting the motion parameters of each point processed on the circuit substrate subsequently according to the obtained height parameters;
step S3, replacing the drilling assembly and assembling the drilling assembly on the movement mechanism, and driving the drilling assembly to form a through hole penetrating through the circuit substrate on the circuit substrate;
step S4, replacing the printing component and assembling the printing component on the motion mechanism, driving the printing component to form a first conductive circuit on the first surface of the circuit substrate, forming a second conductive circuit on the second surface of the circuit substrate, and filling conductive paste in the via hole to form a metalized via hole connecting the first conductive circuit and the second conductive circuit;
the use examples in the embodiments of the present invention are not exclusive, and may be determined according to the manufacturing requirements of users, for example, in the case of manufacturing a single-sided circuit board, a drilling assembly or the like is not required. In the case of manufacturing a double-sided non-interconnected circuit board, for example, a drilling assembly or the like is also not required. Further, for example, in the case where only the via hole needs to be formed in the circuit substrate, the printing element or the like may not be used. The printing assembly in the embodiment of the present invention may be replaced and used according to a user-defined requirement, and the use sequence of the printing assembly in the embodiment of the present invention is not limited.
It is another object of the present invention to provide an electronic circuit that solves the problems of the prior art. In some embodiments, the electronic circuit is obtained by an electronic circuit fabrication apparatus as described in any one of the above.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. An electronic circuit fabrication apparatus, comprising: the equipment comprises an equipment base with a processing table for bearing a circuit substrate, a motion mechanism erected on the equipment base and a processing kit for realizing an electronic circuit manufacturing process; wherein, the processing kit comprises at least 2 processing heads which are used for realizing the same or different electronic circuit manufacturing procedures and can be replaced mutually;
the movement mechanism is provided with a first assembly structure which moves along with the movement mechanism in at least one dimension above the processing table, and each processing head is provided with a second assembly structure which is in fit connection with the first assembly structure;
every processing head with through between the motion the first assembly structure with the second assembly structure realizes detachable the connection.
2. The electronic circuit fabrication apparatus of claim 1, wherein the connection structure between the first mounting structure and the second mounting structure comprises: the clamping structure is used for realizing fixed connection in a matching way.
3. The electronic circuit fabrication apparatus of claim 2, wherein the retaining structure is a slip-in structure.
4. The electronic circuit fabrication apparatus of claim 2, wherein the connection structure between the first mounting structure and the second mounting structure further comprises: the electric plug structure is used for realizing the drive control of the processing head.
5. Electronic circuit fabrication apparatus according to claim 1, wherein the tooling kit comprises at least 2 of the following tooling heads:
a detection component for obtaining the size parameter on the circuit substrate;
the drilling assembly is used for reducing the material of the circuit substrate;
the printing assembly is used for performing additive manufacturing on the circuit substrate by using the printing slurry;
a blowing assembly for removing waste material on the circuit substrate; and the number of the first and second groups,
a curing assembly to cure the printing paste.
6. The electronic circuit fabrication apparatus of claim 5, wherein the printing assembly comprises: a replaceable ink tube.
7. An electronic circuit fabrication apparatus as claimed in claim 1 wherein a test station is provided on the apparatus base for calibrating the initial position of the processing head.
8. The electronic circuit fabrication apparatus of claim 1, wherein the motion mechanism is a three-axis motion mechanism, and the first mounting structure moves in an X-axis, a Y-axis, and a Z-axis with the motion mechanism.
9. The electronic circuit fabrication apparatus of claim 1, further comprising: the device comprises a shell which is annularly arranged around the device base and a protective cover which is movably connected with the shell; the protective cover is opened/closed on the housing.
10. An electronic circuit, characterized in that it is obtained by an electronic circuit fabrication apparatus as claimed in any one of claims 1 to 9.
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| CN202121137657.4U CN215379349U (en) | 2021-05-26 | 2021-05-26 | Electronic circuit and manufacturing equipment thereof |
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| CN202121137657.4U CN215379349U (en) | 2021-05-26 | 2021-05-26 | Electronic circuit and manufacturing equipment thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022247374A1 (en) * | 2021-05-26 | 2022-12-01 | 北京梦之墨科技有限公司 | Electronic circuit and manufacturing apparatus therefor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022247374A1 (en) * | 2021-05-26 | 2022-12-01 | 北京梦之墨科技有限公司 | Electronic circuit and manufacturing apparatus therefor |
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