WO2022239408A1 - Power supply unit for aerosol generation device - Google Patents

Power supply unit for aerosol generation device Download PDF

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Publication number
WO2022239408A1
WO2022239408A1 PCT/JP2022/009467 JP2022009467W WO2022239408A1 WO 2022239408 A1 WO2022239408 A1 WO 2022239408A1 JP 2022009467 W JP2022009467 W JP 2022009467W WO 2022239408 A1 WO2022239408 A1 WO 2022239408A1
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WO
WIPO (PCT)
Prior art keywords
power supply
terminal
voltage
input
charging
Prior art date
Application number
PCT/JP2022/009467
Other languages
French (fr)
Japanese (ja)
Inventor
達也 青山
拓嗣 川中子
徹 長浜
貴司 藤木
亮 吉田
Original Assignee
日本たばこ産業株式会社
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Publication date
Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Publication of WO2022239408A1 publication Critical patent/WO2022239408A1/en

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    • AHUMAN NECESSITIES
    • A24TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24FSMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40Constructional details, e.g. connection of cartridges and battery parts
    • AHUMAN NECESSITIES
    • A24TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24FSMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50Control or monitoring
    • AHUMAN NECESSITIES
    • A24TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24FSMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/90Arrangements or methods specially adapted for charging batteries thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent Document 1 describes an evaporator device that can receive voltage from a USB power source or a battery and has a converter that can supply the received voltage to a heating element. This converter is configured to charge the battery with the voltage from the USB power supply.
  • Patent Document 2 discloses a primary device including a primary power source and a charging device that charges the primary power source, and a secondary device including a secondary power source that is charged by the primary power source and a load that generates heat when fed from the secondary power source.
  • a smoking system comprising: The smoking system allows direct powering of the load from the primary power source.
  • Patent Document 3 describes an electronic cigarette capable of supplying power from a charger to a heating element of a cigarette cartridge.
  • a charging IC When a charging IC is provided in an aerosol generating device equipped with a power supply, it is conceivable to use the Power Path function of the charging IC to supply power from an external power supply or a built-in power supply to a load such as a heater or controller.
  • a load such as a heater or controller.
  • the load connected to the output terminal of the charging IC increases, the current output from the output terminal increases, and it is necessary to use a large-scale and high-cost charging IC.
  • the purpose of the present invention is to provide an aerosol generator that can achieve miniaturization and cost reduction.
  • a power supply unit for an aerosol generation device is a power supply unit for an aerosol generation device that heats an aerosol source to generate an aerosol, comprising: a power source; a connector electrically connectable to an external power source; 1 load, an input terminal connected to the connector, a charging terminal connected to the power supply, and an output terminal connected to the first load; a charging IC configured to output from a terminal; a current larger than a maximum current that the output terminal can output from the power supply; and connected to a second load different from the first load. and a discharge path, wherein the charging IC is configured to be capable of supplying power input from the power supply to the charging terminal to the first load via the output terminal.
  • FIG. 1 is a perspective view of a non-combustion inhaler
  • FIG. 1 is a perspective view of a non-combustion inhaler showing a state in which a rod is attached
  • FIG. Fig. 10 is another perspective view of a non-combustion type inhaler
  • 1 is an exploded perspective view of a non-combustion inhaler
  • FIG. Fig. 3 is a perspective view of the internal unit of the non-combustion inhaler
  • FIG. 6 is an exploded perspective view of the internal unit of FIG. 5
  • FIG. 3 is a perspective view of the internal unit with the power supply and chassis removed
  • FIG. 11 is another perspective view of the internal unit with the power supply and chassis removed
  • It is a schematic diagram for demonstrating the operation mode of an aspirator.
  • FIG. 4 is a diagram for explaining the operation of an electric circuit in sleep mode; It is a figure for demonstrating the operation
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode; It is a figure for demonstrating the operation
  • FIG. 5 is a diagram for explaining the operation of the electric circuit when detecting the temperature of the heater in the heating mode;
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in charging mode;
  • FIG. 4 is a diagram for explaining the operation of an electric circuit when an MCU is reset (restarted); It is a figure which shows schematic structure inside charging IC.
  • suction system which is one embodiment of the aerosol generator of the present invention, will be described below with reference to the drawings.
  • This suction system includes a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100.
  • suction device 100 a non-combustion type suction device 100
  • the suction device 100 accommodates the heating unit in a non-detachable manner
  • the heating unit may be detachably attached to the aspirator 100 .
  • the rod 500 and the heating unit may be integrated and detachably attached to the aspirator 100 .
  • the power supply unit of the aerosol generator may have a configuration that does not include the heating section as a component.
  • “non-detachable” refers to a mode in which detachment is not possible as far as the intended use is concerned.
  • an induction heating coil provided in the aspirator 100 and a susceptor built in the rod 500 may cooperate to form a heating unit.
  • FIG. 1 is a perspective view showing the overall configuration of the aspirator 100.
  • FIG. FIG. 2 is a perspective view of the suction device 100 showing a state in which the rod 500 is attached.
  • FIG. 3 is another perspective view of the suction device 100.
  • FIG. FIG. 4 is an exploded perspective view of the aspirator 100.
  • FIG. Also, in the following description, for the sake of convenience, the orthogonal coordinate system of a three-dimensional space is used, in which the three mutually orthogonal directions are the front-back direction, the left-right direction, and the up-down direction. In the figure, the front is indicated by Fr, the rear by Rr, the right by R, the left by L, the upper by U, and the lower by D.
  • the inhaler 100 generates flavor-containing aerosol by heating an elongated, substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-generating base having a filling containing an aerosol source and a flavor source. configured to
  • Rod 500 includes a fill containing an aerosol source that is heated at a predetermined temperature to produce an aerosol.
  • the type of aerosol source is not particularly limited, and extracts from various natural products and/or their constituent components can be selected according to the application.
  • the aerosol source may be solid or liquid, for example polyhydric alcohols such as glycerin, propylene glycol, or water.
  • the aerosol source may include a flavor source such as a tobacco material or an extract derived from the tobacco material that releases flavor components upon heating.
  • the gas to which the flavor component is added is not limited to an aerosol, and for example an invisible vapor may be generated.
  • the filling of rod 500 may contain tobacco shreds as a flavor source.
  • Materials for shredded tobacco are not particularly limited, and known materials such as lamina and backbone can be used.
  • the filling may contain one or more perfumes.
  • the type of flavoring agent is not particularly limited, but menthol is preferable from the viewpoint of imparting a good smoking taste.
  • Flavor sources may contain plants other than tobacco, such as mints, herbal medicines, or herbs. Depending on the application, rod 500 may not contain a flavor source.
  • the suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface.
  • the case 110 comprises a bottomed cylindrical case body 112 in which front, rear, top, bottom, and right surfaces are integrally formed, and a left surface that seals an opening 114 (see FIG. 4) of the case body 112. It has an outer panel 115 , an inner panel 118 , and a slider 119 .
  • the inner panel 118 is fixed to the case body 112 with bolts 120 .
  • the outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held by a chassis 150 (see FIG. 5) housed in the case body 112 and described later. Since the outer panel 115 is fixed by the magnet 124, the user can replace the outer panel 115 according to his or her preference.
  • the inner panel 118 is provided with two through holes 126 through which the magnets 124 pass.
  • the inner panel 118 is further provided with a longitudinally elongated hole 127 and a circular round hole 128 between the two vertically arranged through holes 126 .
  • This long hole 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case body 112 .
  • a button-type operation switch OPS built in the case body 112 passes through the round hole 128 . Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. FIG. Also, the user can press down the operation switch OPS via the pressing portion 117 of the outer panel 115 .
  • the upper surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted.
  • the slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position for closing the opening 132 (see FIG. 1) and a position for opening the opening 132 (see FIG. 2).
  • the operation switch OPS is used to perform various operations of the aspirator 100.
  • the user operates the operation switch OPS via the pressing portion 117 while inserting the rod 500 into the opening 132 as shown in FIG.
  • the heating unit 170 (see FIG. 5) heats the rod 500 without burning it.
  • an aerosol is generated from the aerosol source contained in the rod 500 and the flavor of the flavor source contained in the rod 500 is added to the aerosol.
  • the user can inhale the flavor-containing aerosol by holding the mouthpiece 502 of the rod 500 projecting from the opening 132 and inhaling.
  • a charging terminal 134 is provided for receiving power supply by being electrically connected to an external power source such as an outlet or a mobile battery.
  • the charging terminal 134 is a USB (Universal Serial Bus) Type-C receptacle, but is not limited to this.
  • Charging terminal 134 is hereinafter also referred to as receptacle RCP.
  • the charging terminal 134 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply.
  • the wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type.
  • the charging terminal 134 can be connected to various USB terminals or the like, and may have the power receiving coil described above.
  • the configuration of the aspirator 100 shown in FIGS. 1-4 is merely an example.
  • the inhaler 100 holds the rod 500 and applies an action such as heating to generate gas to which a flavor component is added from the rod 500, and the user can inhale the generated gas. It can be configured in various forms.
  • FIG. 5 is a perspective view of the internal unit 140 of the suction device 100.
  • FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5.
  • FIG. 7 is a perspective view of internal unit 140 with power supply BAT and chassis 150 removed.
  • FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and chassis 150 removed.
  • the internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.
  • the chassis 150 includes a plate-shaped chassis body 151 arranged substantially in the center of the interior space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, and a chassis body 151 disposed substantially in the center of the interior space of the case 110 in the front-rear direction.
  • a plate-shaped front and rear dividing wall 152 extending in the vertical and horizontal directions
  • a plate-shaped upper and lower dividing wall 153 extending forward from substantially the center of the front and rear dividing wall 152 in the vertical direction
  • the front and rear dividing wall 152 and the upper edges of the chassis body 151 and a plate-shaped chassis lower wall 155 extending rearward from the front-rear dividing wall 152 and the lower edge of the chassis body 151 .
  • the left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.
  • the internal space of the case 110 is defined by a chassis 150 such that a heating unit housing area 142 is defined in the upper front, a board housing area 144 is defined in the lower front, and a power supply housing space 146 is defined in the rear to extend vertically. ing.
  • the heating part 170 housed in the heating part housing area 142 is composed of a plurality of tubular members, which are concentrically arranged to form a tubular body as a whole.
  • the heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) that heats the rod 500 from its outer circumference or center.
  • the surface of the rod housing portion 172 and the heater HTR are insulated by forming the rod housing portion 172 from a heat insulating material or providing a heat insulating material inside the rod housing portion 172 .
  • the heater HTR may be any element that can heat the rod 500 .
  • the heater HTR is, for example, a heating element.
  • Heating elements include heating resistors, ceramic heaters, induction heaters, and the like.
  • the heater HTR for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used.
  • a heater HTR having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used.
  • the heating part 170 has a function of defining a flow path of air to be supplied to the rod 500 and a function of heating the rod 500 .
  • the case 110 is formed with a vent (not shown) for introducing air, and is configured to allow air to enter the heating unit 170 .
  • the power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery.
  • the electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
  • the notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the state of charge of the power supply BAT, the preheating time during suction, and the suction possible period.
  • the notification unit 180 of this embodiment includes eight LEDs L1 to L8 and a vibration motor M.
  • the notification unit 180 may be composed of light emitting elements such as LEDs L1 to L8, may be composed of vibrating elements such as the vibration motor M, or may be composed of sound output elements.
  • the notification unit 180 may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
  • Various sensors include an intake air sensor that detects the user's puff action (sucking action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , a cover position sensor that detects the position of the slider 119, a panel detection sensor that detects attachment/detachment of the outer panel 115, and the like.
  • the intake sensor is mainly composed of a thermistor T2 arranged near the opening 132, for example.
  • the power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged near the power supply BAT.
  • the heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged near the heater HTR.
  • the rod housing portion 172 is preferably insulated from the heater HTR.
  • the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod housing portion 172 . If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor.
  • the case temperature sensor is mainly composed of, for example, a thermistor T4 arranged near the left surface of the case 110 .
  • the cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged near the slider 119 .
  • the panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged near the inner surface of the inner panel 118 .
  • the circuit section 160 includes four circuit boards, multiple ICs (Integrate Circuits), and multiple elements.
  • the four circuit boards are an MCU-mounted board 161 on which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are mainly arranged, a receptacle-mounted board 162 mainly on which charging terminals 134 are arranged, an operation switch OPS, and an LED An LED mounting substrate 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a Hall IC mounting substrate 164 on which a Hall IC 14 including a Hall element constituting a cover position sensor is arranged.
  • the MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144 . More specifically, the MCU mounting board 161 and the receptacle mounting board 162 are arranged such that their element mounting surfaces are arranged along the horizontal direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. .
  • the MCU mounting board 161 and the receptacle mounting board 162 are each provided with openings.
  • the MCU mounting board 161 and the receptacle mounting board 162 are fastened with bolts 136 to the board fixing portion 156 of the front/rear dividing wall 152 with a cylindrical spacer 173 interposed between the peripheral edges of these openings.
  • the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162 .
  • the MCU mounting board 161 and the receptacle mounting board 162 it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them.
  • the MCU mounting board 161 and the receptacle mounting board 162 have main surfaces 161a and 162a that face forward, and secondary surfaces 161b and 162b that are opposite to the main surfaces 161a and 162a. and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined gap therebetween.
  • a main surface 161 a of the MCU mounting board 161 faces the front surface of the case 110
  • a secondary surface 162 b of the receptacle mounting board 162 faces the front and rear dividing walls 152 of the chassis 150 .
  • Elements and ICs mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described later.
  • the LED mounting board 163 is arranged on the left side of the chassis body 151 and between the two magnets 124 arranged vertically.
  • the element mounting surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-rear direction.
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element mounting surface of the LED mounting board 163 .
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 and the element mounting surface of the LED mounting board 163 are not limited to being orthogonal, but preferably intersect (non-parallel).
  • the vibration motor M which forms the notification unit 180 together with the LEDs L1 to L8, is fixed to the bottom surface of the chassis bottom wall 155 and electrically connected to the MCU mounting board 161.
  • the Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154 .
  • FIG. 9 is a schematic diagram for explaining the operation modes of the aspirator 100.
  • the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initialization mode, heating mode, and heating termination mode.
  • the sleep mode is a mode for saving power by stopping the power supply to the electronic parts required for heating control of the heater HTR.
  • the active mode is a mode in which most functions except heating control of the heater HTR are enabled.
  • the operation mode is switched to the active mode.
  • the slider 119 is closed or the non-operating time of the operation switch OPS reaches a predetermined time while the aspirator 100 is operating in the active mode, the operating mode is switched to the sleep mode.
  • the heating initial setting mode is a mode for initializing control parameters and the like for starting heating control of the heater HTR.
  • the aspirator 100 detects the operation of the operation switch OPS while operating in the active mode, it switches the operation mode to the heating initial setting mode, and when the initial setting is completed, switches the operation mode to the heating mode.
  • the heating mode is a mode that executes heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection).
  • the aspirator 100 starts heating control of the heater HTR when the operation mode is switched to the heating mode.
  • the heating end mode is a mode for executing heating control end processing (heating history storage processing, etc.) of the heater HTR.
  • the operation mode is switched to the heating end mode.
  • the operation mode is switched to the active mode.
  • the USB connection is established while the aspirator 100 is operating in the heating mode, the operating mode is switched to the heating end mode, and when the end processing is completed, the operating mode is switched to the charging mode. As shown in FIG.
  • the operating mode may be switched to the active mode before switching the operating mode to the charging mode.
  • the aspirator 100 may switch the operation mode in order of the heating end mode, the active mode, and the charging mode when the USB connection is made while operating in the heating mode.
  • the charging mode is a mode in which the power supply BAT is charged with power supplied from an external power supply connected to the receptacle RCP.
  • the aspirator 100 switches the operation mode to the charge mode when an external power source is connected (USB connection) to the receptacle RCP while operating in sleep mode or active mode.
  • the aspirator 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released while operating in the charging mode.
  • FIG. 11 shows a range 161A mounted on the MCU mounting board 161 (range surrounded by thick dashed lines) and a range 163A mounted on the LED mounting board 163 (range surrounded by thick solid lines) in the electric circuit shown in FIG.
  • FIG. 12 is the same as FIG. 10 except that a range 162A mounted on the receptacle mounting board 162 and a range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. is.
  • the wiring indicated by the thick solid line in FIG. 10 is the wiring (the wiring connected to the ground provided in the internal unit 140) that has the same potential as the reference potential (ground potential) of the internal unit 140. It is described as a ground line below.
  • an electronic component in which a plurality of circuit elements are chipped is indicated by a rectangle, and the symbols of various terminals are indicated inside the rectangle.
  • a power supply terminal VCC and a power supply terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively.
  • a power supply terminal VSS and a ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side).
  • the power supply voltage is the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side. Chipped electronic components use this power supply voltage to perform various functions.
  • the MCU-mounted board 161 includes, as main electronic components, an MCU1 that controls the entire sucker 100, a charging IC2 that controls charging of the power source BAT, a capacitor, a resistor load switches (hereinafter referred to as LSW) 3, 4, 5, a ROM (Read Only Memory) 6, a switch driver 7, and a step-up/step-down DC/DC converter 8 (in the figure, buck-boost DC/DC 8), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16, 17, connector Cn (t2) (which is electrically connected to thermistor T2 constituting an intake sensor) ( The figure shows the thermistor T2 connected to this connector), and a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (the figure shows the thermistor T3 connected to this connector).
  • LSW resistor load switches
  • LSW resistor load switches
  • ROM Read Only Memory
  • switch driver 7 a switch driver 7
  • a ground terminal GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, step-up/step-down DC/DC converter 8, FF16, and FF17 is connected to a ground line.
  • a power terminal VSS of the ROM 6 is connected to the ground line.
  • a negative power supply terminal of each of the operational amplifiers OP2 and OP3 is connected to the ground line.
  • the LED mounting board 163 (area 163A) has, as main electronic components, a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, a communication IC 15 and are provided.
  • the communication IC 15 is a communication module for communicating with electronic devices such as smartphones.
  • a power supply terminal VSS of the Hall IC 13 and a ground terminal GND of the communication IC 15 are each connected to a ground line.
  • Communication IC 15 and MCU 1 are configured to be communicable via communication line LN.
  • One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.
  • the receptacle mounting board 162 (range 162A) includes a power connector electrically connected to the power supply BAT as a main electronic component (in the figure, the power supply BAT connected to this power connector is shown). ), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown), and a boost DC/DC converter 9 (in the figure, a boost DC/DC 9 ), the protection IC 10, the overvoltage protection IC 11, the fuel gauge IC 12, the receptacle RCP, the switches S3 to S6 configured by MOSFETs, the operational amplifier OP1, and the heater HTR. (positive electrode side and negative electrode side) heater connectors Cn are provided.
  • ground terminals GND of receptacle RCP, ground terminal GND of step-up DC/DC converter 9, power supply terminal VSS of protection IC 10, power supply terminal VSS of fuel gauge IC 12, ground terminal GND of overvoltage protection IC 11, and operational amplifier The negative power supply terminals of OP1 are each connected to the ground line.
  • the Hall IC mounting substrate 164 (area 164A) is provided with a Hall IC 14 including a Hall element that constitutes a cover position sensor.
  • a power terminal VSS of the Hall IC 14 is connected to the ground line.
  • the output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU1.
  • the MCU1 detects opening/closing of the slider 119 from a signal input to the terminal P8.
  • a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161 .
  • the two power supply input terminals V BUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC11 via a fuse Fs.
  • the USB voltage V USB is supplied to the two power input terminals V BUS of the receptacle RCP.
  • An input terminal IN of the overvoltage protection IC 11 is connected to one end of a voltage dividing circuit Pa consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pa is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11.
  • the overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold.
  • the overvoltage protection IC 11 stops voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected.
  • the output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of the voltage dividing circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. A connection point of the two resistors forming the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.
  • An input terminal VIN of LSW3 is connected to one end of a voltage dividing circuit Pf consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pf is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3.
  • the collector terminal of the bipolar transistor S2 is connected to the control terminal ON of LSW3.
  • the emitter terminal of the bipolar transistor S2 is connected to the ground line.
  • the base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1.
  • the output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2.
  • the MCU1 turns on the bipolar transistor S2 while the USB connection is not made.
  • the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2, so that a low level signal is input to the control terminal ON of LSW3.
  • the bipolar transistor S2 connected to LSW3 is turned off by MCU1 when the USB connection is made.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3.
  • the LSW 3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of LSW3 unless MCU1 turns off bipolar transistor S2.
  • the positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V BAT of the power supply BAT is supplied to the protection IC 10 , the charging IC 2 and the step-up DC/DC converter 9 .
  • a resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT.
  • a current detection terminal CS of the protection IC 10 is connected to a connection point between the resistor Ra and the switch Sa. Control terminals of the switches Sa and Sb are connected to the protection IC 10 . Both ends of the resistor Rb are connected to the fuel gauge IC12.
  • the protection IC 10 acquires the value of the current flowing through the resistor Ra during charging and discharging of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), the switch Sa , the switch Sb is controlled to open and close to stop the charging or discharging of the power source BAT, thereby protecting the power source BAT. More specifically, when the protection IC 10 acquires an excessive current value while charging the power supply BAT, it stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value during discharging of the power supply BAT, the protection IC 10 stops discharging the power supply BAT by turning off the switch Sa.
  • the protection IC 10 performs opening/closing control of the switch Sa and the switch Sb to The power supply BAT is protected by stopping the charging or discharging of BAT. More specifically, when the protection IC 10 detects that the power supply BAT is overcharged, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When detecting overdischarge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.
  • a resistor Rt1 is connected to a connector connected to the thermistor T1 arranged near the power supply BAT.
  • a series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12.
  • a connection point between the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the fuel gauge IC12.
  • the thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.
  • the fuel gauge IC 12 detects the current flowing through the resistor Rb, and based on the detected current value, indicates the remaining capacity of the power supply BAT, SOC (State Of Charge) indicating the state of charge, and SOH (State Of Charge) indicating the state of health. Health) and other battery information.
  • the fuel gauge IC12 supplies a voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG.
  • the fuel gauge IC 12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage.
  • the fuel gauge IC12 is connected to the MCU1 via a communication line LN for serial communication, and is configured to be able to communicate with the MCU1.
  • the fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1.
  • serial communication requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that only one signal line is shown in FIGS. 10-19 for simplicity.
  • the fuel gauge IC 12 has a notification terminal 12a.
  • the notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of a diode D2, which will be described later.
  • the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it notifies the MCU 1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low level signal is also input to the CLR ( ⁇ ) terminal of the FF 17 via the diode D2.
  • One end of the reactor Lc is connected to the switching terminal SW of the step-up DC/DC converter 9 .
  • the other end of this reactor Lc is connected to the input terminal VIN of the step-up DC/DC converter 9 .
  • the step-up DC/DC converter 9 performs on/off control of the built-in transistor connected to the switching terminal SW to step up the input voltage and output it from the output terminal VOUT.
  • the input terminal VIN of the step-up DC/DC converter 9 constitutes a power supply terminal of the step-up DC/DC converter 9 on the high potential side.
  • the boost DC/DC converter 9 performs a boost operation when the signal input to the enable terminal EN is at high level.
  • the signal input to the enable terminal EN of the boost DC/DC converter 9 may be controlled to be low level by the MCU1.
  • the MCU 1 does not control the signal input to the enable terminal EN of the boost DC/DC converter 9, so that the potential of the enable terminal EN may be made indefinite.
  • the output terminal VOUT of the step-up DC/DC converter 9 is connected to the source terminal of the switch S4 composed of a P-channel MOSFET.
  • the gate terminal of switch S4 is connected to terminal P15 of MCU1.
  • One end of the resistor Rs is connected to the drain terminal of the switch S4.
  • the other end of the resistor Rs is connected to a positive heater connector Cn connected to one end of the heater HTR.
  • a voltage dividing circuit Pb consisting of two resistors is connected to the connection point between the switch S4 and the resistor Rs.
  • a connection point of the two resistors forming the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1.
  • a connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.
  • a connection line between the output terminal VOUT of the step-up DC/DC converter 9 and the source terminal of the switch S4 is connected to the source terminal of the switch S3 composed of a P-channel MOSFET.
  • the gate terminal of switch S3 is connected to terminal P16 of MCU1.
  • a drain terminal of the switch S3 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC/DC converter 9 and the positive electrode side of the heater connector Cn. . Since the circuit including the switch S3 does not have a resistor, it has a lower resistance than the circuit including the switch S4 and the resistor Rs.
  • the non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the inverting input terminal of the operational amplifier OP1 is connected to the negative heater connector Cn connected to the other end of the heater HTR and to the drain terminal of the switch S6 composed of an N-channel MOSFET.
  • the source terminal of switch S6 is connected to the ground line.
  • a gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the step-up DC/DC converter 9.
  • the cathode of diode D4 is connected to the Q terminal of FF17.
  • resistor R4 One end of a resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. A source terminal of the switch S5 is connected to the ground line. A gate terminal of the switch S5 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1-L8.
  • the cathodes of the LEDs L1-L8 are connected to the control terminals PD1-PD8 of the MCU1 via current limiting resistors. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS.
  • the LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2.
  • the MCU 1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND.
  • the MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to light it, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1.
  • the brightness and light emission pattern of the LED L1 can be dynamically controlled.
  • LEDs L2 to L8 are similarly controlled by the MCU1.
  • the charging IC2 has a charging function of charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS.
  • the charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wiring (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Also, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 through serial communication using the communication line LN, and use it for charging control.
  • the charging IC2 further comprises a V BAT power pass function and an OTG function.
  • the V BAT power pass function is a function of outputting from the output terminal SYS a system power supply voltage Vcc0 substantially matching the power supply voltage V BAT input to the charging terminal bat.
  • the OTG function is a function for outputting from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat.
  • ON/OFF of the OTG function of the charging IC 2 is controlled by the MCU 1 through serial communication using the communication line LN.
  • the power supply voltage V BAT input to the charging terminal bat may be directly output from the input terminal VBUS. In this case, power supply voltage VBAT and system power supply voltage Vcc4 are substantially the same.
  • the output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the step-up/step-down DC/DC converter 8 .
  • One end of a reactor La is connected to the switching terminal SW of the charging IC2.
  • the other end of the reactor La is connected to the output terminal SYS of the charging IC2.
  • a charge enable terminal CE ( ⁇ ) of the charge IC2 is connected to a terminal P22 of the MCU1 via a resistor.
  • the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 which will be described later.
  • the base terminal of bipolar transistor S1 is connected to the Q terminal of FF17.
  • one end of a resistor Rc is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the other end of the resistor Rc is connected to the output terminal VOUT of LSW4.
  • a resistor is connected to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the signal input to the enable terminal EN of the step-up/step-down DC/DC converter 8 is at a high level. Then, the step-up/step-down DC/DC converter 8 starts step-up operation or step-down operation.
  • the step-up/step-down DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1, and the output terminal VOUT.
  • Output from The output terminal VOUT of the buck-boost DC/DC converter 8 includes the feedback terminal FB of the buck-boost DC/DC converter 8, the input terminal VIN of the LSW 4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF 16. and connected to A wiring to which system power supply voltage Vcc1 output from output terminal VOUT of step-up/step-down DC/DC converter 8 is supplied is referred to as power supply line PL1.
  • the LSW4 When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT.
  • the control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high level signal is input to the control terminal ON of the LSW4.
  • the voltage output from LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored. Described as voltage Vcc2.
  • the output terminal VOUT of the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , and the power supply terminal VCC of the FF 17 .
  • a wiring to which system power supply voltage Vcc2 output from output terminal VOUT of LSW4 is supplied is referred to as power supply line PL2.
  • the LSW5 When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT.
  • a control terminal ON of LSW5 is connected to terminal P23 of MCU1.
  • the voltage output from LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored. Described as voltage Vcc3.
  • a wiring to which system power supply voltage Vcc3 output from output terminal VOUT of LSW5 is supplied is referred to as power supply line PL3.
  • a series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line.
  • the thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of the MCU1.
  • the MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the amount of temperature variation.
  • a series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line.
  • the thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of the MCU1 and the inverting input terminal of the operational amplifier OP2.
  • the MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.
  • a series circuit of a thermistor T4 and a resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line.
  • the thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and the connection point between them is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3.
  • the MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.
  • a source terminal of a switch S7 composed of a MOSFET is connected to the power supply line PL2.
  • the gate terminal of switch S7 is connected to terminal P20 of MCU1.
  • a drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line.
  • the MCU1 can control the opening/closing of the switch S7 by manipulating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern.
  • a dedicated driver IC may be used instead of the switch S7.
  • a positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2.
  • the operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (signal corresponding to the resistance value of the thermistor T3).
  • the thermistor T3 since the thermistor T3 has the NTC characteristic, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2.
  • the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 is connected to the non-inverting input terminal of the operational amplifier OP2, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP2.
  • the output of the pressure circuit Pd may be connected.
  • a positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3.
  • the operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4).
  • the thermistor T4 having the NTC characteristic is used, so the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3.
  • the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 is connected to the non-inverting input terminal of the operational amplifier OP3, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP3.
  • the output of the pressure circuit Pe may be connected.
  • a resistor R1 is connected to the output terminal of the operational amplifier OP2.
  • a cathode of a diode D1 is connected to the resistor R1.
  • the anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR ( ⁇ ) terminal of the FF17.
  • a connection line between the resistor R1 and the diode D1 is connected to a resistor R2 connected to the power supply line PL1. Also, the CLR ( ⁇ ) terminal of the FF 16 is connected to this connection line.
  • resistor R3 One end of a resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17.
  • the other end of resistor R3 is connected to power supply line PL2.
  • the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR ( ⁇ ) terminal of the FF 17 are connected to this connection line.
  • the cathode of diode D3 is connected to terminal P5 of MCU1.
  • the FF16 When the temperature of the heater HTR becomes excessive and the signal output from the operational amplifier OP2 becomes low and the signal input to the CLR ( ⁇ ) terminal becomes low level, the FF16 outputs a high level signal from the Q ( ⁇ ) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in the FF 16, a low level signal continues to be output from the Q ( ⁇ ) terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • the signal input to the CLR ( ⁇ ) terminal of the FF 17 is when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and when an abnormality is detected from the notification terminal 12a of the fuel gauge IC 12.
  • the low-level signal shown When the low-level signal shown is output, it becomes low-level.
  • the FF 17 outputs a low level signal from the Q terminal when the signal input to the CLR ( ⁇ ) terminal becomes low level.
  • This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC/DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. be.
  • the CE ( ⁇ ) terminal of the charging IC2 is of negative logic, the charging of the power source BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 attempts to output a low-level enable signal from the terminal P22 to the charge enable terminal CE ( ⁇ ) of the charging IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1 and the charge enable terminal CE ( ⁇ ) of the charge IC2. Note that a high level signal is input to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • a high-level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, the FF 17 continues to output a high level signal from the Q terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • a low level signal is output from the output terminal of the operational amplifier OP3
  • a low level signal is input to the CLR ( ⁇ ) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2.
  • the low level signal output from the output terminal of the operational amplifier OP3 is not affected by the high level signal due to the diode D1. sea bream.
  • the high level signal is passed through the diode D1. signal.
  • the power line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164 side.
  • the power terminal VDD of the hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the hall IC 14 are connected to the branched power line PL2.
  • the output terminal OUT of the Hall IC 13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the Hall IC 13 .
  • the MCU 1 determines whether or not the outer panel 115 is attached based on the signal input to the terminal P3.
  • a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting board 163 .
  • This series circuit is connected to power supply line PL2.
  • a connection point between the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7.
  • FIG. When the operation switch OPS is not pressed, the operation switch OPS is not conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are at a high level due to the system power supply voltage Vcc2.
  • the operation switch OPS When the operation switch OPS is pressed and turned on, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground line, and thus become low level.
  • the MCU1 detects the operation of the operation switch OPS from the signal input to the terminal P4.
  • the switch driver 7 is provided with a reset input terminal RSTB.
  • the reset input terminal RSTB is connected to the control terminal ON of LSW4.
  • the switch driver 7 By outputting a low level signal from the reset input terminal RSTB, the output operation of LSW4 is stopped.
  • the operation switch OPS which is originally pushed down via the pressing portion 117 of the outer panel 115, is directly pushed down by the user with the outer panel 115 removed, the signal is input to the terminals SW1 and SW2 of the switch driver 7. become low level.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode.
  • FIG. 18 is a diagram for explaining the operation of the electric circuit in charging mode.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation
  • FIGS. 13 to 19 are diagrams for explaining the operation of the electric circuit when the MCU 1 is reset (restarted).
  • the terminals surrounded by dashed ellipses have inputs or outputs such as the power supply voltage V BAT , the USB voltage V USB , and the system power supply voltage. It shows the terminals that have been made.
  • the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • FIG. 1 the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • MCU1 enables the V BAT power pass function of charging IC2 and disables the OTG function and charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC2, the VBAT power pass function of the charging IC2 is enabled. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function is disabled. Therefore, the charging IC2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat, and outputs it from the output terminal SYS.
  • the system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the buck-boost DC/DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to an enable terminal EN of positive logic, generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it to an output terminal VOUT.
  • Output from The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC/DC converter 8 is applied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal and , respectively.
  • the LSW4 When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT.
  • the system power supply voltage Vcc2 output from the LSW4 is applied to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14. is entered.
  • the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE ( ⁇ ) of the charging IC2, and the FF17. They are supplied to the power supply terminal VCC, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd.
  • the bipolar transistor S1 connected to the charging IC2 is off unless a low level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE ( ⁇ ) of the charging IC2. Since the charge enable terminal CE ( ⁇ ) of the charge IC2 is of negative logic, the charge function of the charge IC2 is turned off in this state.
  • LSW 5 stops outputting system power supply voltage Vcc3, so power supply to electronic components connected to power supply line PL3 is stopped. Also, in the sleep mode, the OTG function of the charging IC 2 is stopped, so power supply to the LEDs L1 to L8 is stopped.
  • Fig. 14> When the MCU 1 detects that the signal input to the terminal P8 becomes high level from the sleep mode state of FIG. 13 and the slider 119 is opened, it inputs a high level signal from the terminal P23 to the control terminal ON of the LSW5. . As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT as the system power supply voltage Vcc3. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
  • the MCU1 detects that the slider 119 is opened, the MCU1 enables the OTG function of the charging IC2 via the communication line LN.
  • the charging IC2 outputs from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat.
  • the system power supply voltage Vcc4 output from the input terminal VBUS is It is fed to the LEDs L1-L8.
  • Fig. 15> From the state of FIG. 14, when the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then boosts the voltage from the terminal P14. A high-level enable signal is input to the enable terminal EN of the DC/DC converter 9 . As a result, the step-up DC/DC converter 9 outputs the driving voltage V bst obtained by stepping up the power supply voltage V BAT from the output terminal VOUT. The drive voltage Vbst is supplied to switch S3 and switch S4. In this state, the switches S3 and S4 are off. Also, the switch S6 is turned on by the high-level enable signal output from the terminal P14.
  • the negative terminal of the heater HTR is connected to the ground line, and the heater HTR can be heated by turning on the switch S3.
  • the mode shifts to the heating mode.
  • Fig. 16> In the state of FIG. 15, the MCU1 starts switching control of the switch S3 connected to the terminal P16 and switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the heating initial setting mode described above is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 16, the MCU 1 turns on the switch S3 and turns off the switch S4 to supply the driving voltage Vbst to the heater HTR to heat the heater HTR for generating aerosol. and temperature detection control for detecting the temperature of the heater HTR by turning off the switch S3 and turning on the switch S4 as shown in FIG.
  • the driving voltage Vbst is also supplied to the gate of the switch S5 to turn on the switch S5. Further, during heating control, the drive voltage Vbst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs.
  • the resistance value of the resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage Vbst .
  • the resistance value of the resistor R4 is greater than the ON resistance value of the switch S5.
  • the switch S5 is turned on during heating control.
  • the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is higher than the ON resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 is sufficiently reduced. This can prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.
  • Fig. 17> As shown in FIG. 17, during temperature detection control, the driving voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. Based on the voltage input to the terminal P18, the MCU1 acquires the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during temperature detection control.
  • the driving voltage V bst (reference voltage V temp ) is supplied to the series circuit of the resistor Rs and the heater HTR.
  • a voltage V heat obtained by dividing the driving voltage V bst (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistor Rs is sufficiently higher than the resistance value of the heater HTR, the voltage V heat is sufficiently lower than the driving voltage V bst .
  • the switch S5 is turned off by supplying the low voltage V heat to the gate terminal of the switch S5.
  • the operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.
  • the output signal of operational amplifier OP1 is input to terminal P9 of MCU1.
  • the MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the known electrical resistance value of the resistor Rs. . Based on the acquired temperature of the heater HTR, the MCU 1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR becomes a target temperature).
  • the MCU 1 can obtain the temperature of the heater HTR even during periods when the switches S3 and S4 are turned off (periods when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).
  • the MCU 1 can acquire the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).
  • FIG. 18 exemplifies a case where a USB connection is made in sleep mode.
  • the USB voltage VUSB is input to the input terminal VIN of LSW3 via the overvoltage protection IC11.
  • the USB voltage V USB is also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. Since the bipolar transistor S2 is ON immediately after the USB connection is made, the signal input to the control terminal ON of the LSW3 remains at a low level.
  • the USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to the terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to the terminal P17.
  • the MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.
  • the MCU1 When the MCU1 detects that the USB connection has been made, the MCU1 turns off the bipolar transistor S2 connected to the terminal P19.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3.
  • a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage VUSB from the output terminal VOUT.
  • the USB voltage VUSB output from LSW3 is input to the input terminal VBUS of charging IC2.
  • the USB voltage V_USB output from LSW3 is directly supplied to LEDs L1 to L8 as system power supply voltage Vcc4.
  • the MCU1 When the MCU1 detects that the USB connection has been established, the MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE( ⁇ ) of the charge IC2. As a result, the charging IC 2 enables the charging function of the power supply BAT, and starts charging the power supply BAT with the USB voltage VUSB input to the input terminal VBUS.
  • the MCU1 When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, it turns off the bipolar transistor S2 connected to the terminal P19. A low-level enable signal is output to the charge enable terminal CE ( ⁇ ) of , and the OTG function of the charge IC 2 is turned off by serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. . The LEDs L1 to L8 do not operate unless the MCU1 turns on the built-in transistors. This prevents an unstable voltage from being supplied to the LEDs L1-L8 during the on-to-off transition of the OTG function.
  • the switch driver 7 outputs a low-level signal from the reset input terminal RSTB when it reaches a predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the reset input terminal RSTB is output. return the signal output from to high level. As a result, the control terminal ON of LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part is restored.
  • FIG. 20 is a diagram showing a schematic configuration inside the charging IC 2. As shown in FIG.
  • the charging IC 2 includes a processor 21, a gate driver 22, and switches Q1 to Q4 configured by N-channel MOSFETs.
  • a source terminal of the switch Q1 is connected to the input terminal VBUS.
  • the drain terminal of switch Q1 is connected to the drain terminal of switch Q2.
  • a source terminal of the switch Q2 is connected to the switching terminal SW.
  • a drain terminal of the switch Q3 is connected to a connection node between the switch Q2 and the switching terminal SW.
  • a source terminal of the switch Q3 is connected to the ground terminal GND.
  • a drain terminal of the switch Q4 is connected to the output terminal SYS.
  • a source terminal of the switch Q4 is connected to the charging terminal bat.
  • the gate driver 22 is connected to the gate terminal of the switch Q2 and the gate terminal of the switch Q3, and performs on/off control of the switches Q2 and Q3 based on commands from the processor 21.
  • the processor 21 is connected to the gate driver 22, the gate terminal of the switch Q1, the gate terminal of the switch Q4, and the charge enable terminal CE( ⁇ ).
  • the processor 21 performs on/off control of the switches Q2 and Q3 and on/off control of the switches Q1 and Q4 via the gate driver 22 .
  • the charging IC 2 has a V USB power pass function and a V USB & V BAT power pass function in addition to the above-described charging function, V BAT power pass function, and OTG function.
  • V USB power pass function and a V USB & V BAT power pass function in addition to the above-described charging function, V BAT power pass function, and OTG function.
  • the contents of control inside the charging IC 2 when these functions are enabled will be described below.
  • the specific numerical values of the various voltages described above are preferably the values shown below.
  • V BAT full charge voltage
  • V BAT nominal voltage
  • Vcc1 3.3V System power supply voltage
  • Vcc2 3.3V System power supply voltage
  • Vcc3 3.3V System power supply voltage
  • Vcc4 5.0V USB voltage
  • V USB 5.0V Drive voltage
  • V bst 4.9V
  • the processor 21 performs on/off control of the switches Q2 and Q4 while controlling the switch Q1 to be on and the switch Q3 to be off. ON/OFF control of the switch Q4 is performed to adjust the charging current of the power supply BAT.
  • the processor 21 performs on/off control of the switch Q2 so that the voltage of the output terminal SYS is the same as the voltage suitable for charging the power supply BAT.
  • the USB voltage VUSB input to the input terminal VBUS is stepped down and output from the output terminal SYS.
  • the voltage output from the output terminal SYS is input to the input terminal VIN of the buck-boost DC/DC converter 8 as the system power supply voltage Vcc0, and is output from the charging terminal bat of the charging IC2.
  • the power supply BAT is charged by the voltage obtained by stepping down the USB voltage VUSB.
  • the system power supply voltage Vcc0 finally becomes the same value as the full charge voltage of the power supply BAT. Therefore, the buck-boost DC/DC converter 8 steps down the 4.2V system power supply voltage Vcc0 input to the input terminal VIN to generate and output the 3.3V system power supply voltage Vcc1.
  • the potential of the input terminal VBUS is higher than the potential of the output terminal SYS in the charging IC2, so that the power from the power supply BAT is not output from the input terminal VBUS.
  • V USB power pass function The V USB power path function is effective, for example, when the power supply BAT cannot be used due to overdischarge or the like.
  • the processor 21 turns on the switch Q1, turns on the switch Q2, turns off the switch Q3, and turns off the switch Q4.
  • the USB voltage VUSB input to the input terminal VBUS is directly output from the switching terminal SW without being stepped down.
  • the voltage output from the switching terminal SW is input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0.
  • the step-up/step-down DC/DC converter 8 steps down the 5V system power supply voltage Vcc0 input to the input terminal VIN to generate and output the 3.3V system power supply voltage Vcc1.
  • the processor 21 may perform on/off control of the switch Q2 in a state in which the switch Q1 is turned on, the switch Q3 is turned off, and the switch Q4 is turned on. good.
  • the charging IC 2 and the step-up/step-down DC/DC converter 8 can share the step-down from the USB voltage VUSB of 5.0V to the system power supply voltage Vcc1 of 3.3V. Therefore, concentration of load and heat on the step-up/step-down DC/DC converter 8 can be suppressed.
  • V USB & V BAT power pass function The V USB & V BAT power pass function is valid, for example, when the charging of the power supply BAT is completed and the USB connection is continued.
  • the processor 21 performs on/off control of the switch Q2 while controlling the switch Q1 to be on, the switch Q3 to be off, and the switch Q4 to be on.
  • the processor 21 controls the switch Q2 so that the voltage of the output terminal SYS becomes the same as the voltage of the power supply BAT (power supply voltage V BAT ).
  • the USB voltage VUSB input to the input terminal VBUS is stepped down and output from the output terminal SYS.
  • the voltage output from the output terminal SYS after stepping down the USB voltage VUSB input to the input terminal VBUS and the voltage output from the output terminal SYS from the power supply BAT via the charging terminal bat have the same value. Therefore, the power including the voltage obtained by stepping down the USB voltage V USB and the power including the power supply voltage V BAT output from the output terminal SYS are synthesized, and the input terminal VIN of the step-up/step-down DC/DC converter 8 is supplied to the input terminal VIN. supplied.
  • the V USB & V BAT power pass function is enabled, the potential of the input terminal VBUS is higher than the potential of the output terminal SYS in the charging IC2, so the power from the power supply BAT is not output from the input terminal VBUS. .
  • the buck-boost DC/DC converter 8 determines whether to step up or down depending on the magnitude of the power supply voltage V BAT .
  • the step-up/down DC/DC converter 8 steps down the system power supply voltage Vcc0 input to the input terminal VIN to generate a 3.3 V system power supply voltage Vcc1. output.
  • the buck-boost DC/DC converter 8 boosts the system power supply voltage Vcc0 input to the input terminal VIN to generate a system power supply voltage Vcc1 of 3.3 V. output.
  • V BAT power pass function The V BAT power path function is enabled in modes other than charge mode (eg, sleep mode).
  • the processor 21 turns off the switches Q1 and Q3.
  • the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0.
  • the power transmission path between the input terminal VBUS of the charging IC2 and the switching terminal SW is blocked by the parasitic diode of the switch Q1. Therefore, the power supply voltage VBAT output from the output terminal SYS is not output from the input terminal VBUS.
  • the buck-boost DC/DC converter 8 determines whether to step up or down depending on the magnitude of the power supply voltage V BAT .
  • the step-up/down DC/DC converter 8 steps down the power supply voltage V BAT to generate a 3.3 V system power supply voltage Vcc1. output.
  • the step-up/step-down DC/DC converter 8 boosts the power supply voltage V BAT to generate a system power supply voltage Vcc1 of 3.3 V. output.
  • OTG function The OTG feature is enabled at the same time as the V BAT power path feature, eg, enabled in active mode.
  • the processor 21 turns on/off the switch Q3 while turning on the switch Q1.
  • the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0.
  • the power supply voltage V BAT output from the output terminal SYS is input to the switching terminal SW of the charging IC2.
  • Processor 21 controls switch Q3 so that power supply voltage VBAT input to switching terminal SW becomes equal to system power supply voltage Vcc4 .
  • the power supply voltage VBAT input to the switching terminal SW is stepped up and output from the input terminal VBUS.
  • the voltage output from the input terminal VBUS is input to the LEDs L1 to L8 as the system power supply voltage Vcc4.
  • the charging IC 2 has both a function as a step-down converter that steps down the USB voltage VUSB and a function as a step-up converter that steps up the power supply voltage VBAT.
  • the voltage input from the charging IC 2 to the step-up/down DC/DC converter 8 fluctuates in various ways according to the functions enabled by the charging IC 2 .
  • the system power supply voltage Vcc1 power including the system power supply voltage Vcc1 can be kept constant by selectively stepping up or stepping down the step-up/step-down DC/DC converter 8. can.
  • the buck-boost DC/DC converter 8 When the voltage of the system power supply voltage Vcc0 input to the input terminal VIN of the buck-boost DC/DC converter 8 is equal to the voltage of the system power supply voltage Vcc1 of 3.3 V, the buck-boost DC/DC converter 8 The system power supply voltage Vcc0 is output from the output terminal VOUT as the system power supply voltage Vcc1 without stepping down.
  • the heater HTR is the load that consumes the most power of all the loads included in the system.
  • the power consumption P HTR of the heater HTR is greater than the power consumption P LED of each of the LEDs L1 to L8.
  • the power consumption of the heater HTR is larger than the total power consumption of all electronic components connected to the output terminal SYS of the charging IC2. Therefore, it is preferable that the current value that the boost DC/DC converter 9 connected to the heater HTR can receive from the power supply BAT is larger than the maximum current value that the output terminal SYS of the charging IC 2 can output.
  • Boost DC/DC converter 9 is preferably a switching regulator.
  • the step-up DC/DC converter 9 operates in either a PFM mode for performing PFM (Pulse Frequency Modulation) control or a PWM mode for performing PWM (Pulse Width Modulation) control. It is supposed to be done.
  • the step-up DC/DC converter 9 is equipped with a mode terminal MODE for mode switching, and is configured to be able to switch the operation mode according to the potential of the mode terminal MODE.
  • the maximum current that can be input to the switching terminal SW of the boost DC/DC converter 9 when the boost DC/DC converter 9 operates in the PFM mode is the boost DC when the boost DC/DC converter 9 operates in the PWM mode. It is preferably larger than the maximum current that can be input to the switching terminal SW of the /DC converter 9 .
  • the voltage applied to the heater HTR differs greatly between heating control and temperature detection control. That is, the load of the step-up DC/DC converter 9 fluctuates between heavy load and light load.
  • the PWM mode since the switching frequency is constant regardless of the load, switching loss becomes dominant when the load is light, and efficiency decreases.
  • the PFM mode does not require much additional power when the load is light, so the switching frequency is lowered and the switching loss is reduced. Therefore, high efficiency can be maintained even at light load.
  • the degree of load increases from light to heavy, this efficiency relationship reverses, with PWM mode being more efficient than PFM mode.
  • the degree of load for which this PWM mode is more efficient is to a limited extent. Therefore, when the load of the step-up DC/DC converter 9 fluctuates between heavy load and light load, the step-up DC/DC converter 9 preferably operates in PFM mode.
  • the efficiency of the step-up DC/DC converter 9 is trending downward.
  • the efficiency of the DC/DC converter decreases when the load is heavy, as described above. Therefore, as described above, the maximum current that can be input to the switching terminal SW of the boost DC/DC converter 9 when operating in the PFM mode is A step-up DC/DC converter 9 having a larger input current than the maximum current is used. Thereby, even if the step-up DC/DC converter 9 is operated in the PFM mode, it is possible to suppress the decrease in efficiency under heavy load.
  • the potential of the mode terminal MODE is maintained at a potential at which the PFM mode is selected.
  • the operation mode of the boost DC/DC converter 9 is fixed to the PFM mode because the mode terminal MODE is not connected to anything.
  • a larger current can be input to the switching terminal SW of the step-up DC/DC converter 9, and a larger current can be supplied to the heater HTR.
  • the PFM mode may be selected by setting the potential of the mode terminal MODE to high level or low level. In such a case, the potential of mode terminal MODE should be maintained at an appropriate potential so that the PFM mode is selected.
  • ⁇ Effect of aspirator> voltage is supplied to the LEDs L1 to L8 as the notification unit via the charging IC2 instead of directly from the power source BAT.
  • the voltage of the power supply BAT fluctuates, the LEDs L1 to L8 can be stably operated by not directly supplying the fluctuating voltage to the LEDs L1 to L8. Since the brightness of the LEDs depends on the voltage supplied, the brightness of the LEDs L1 to L8 can be stabilized if a stable voltage can be supplied to the LEDs L1 to L8.
  • the charging IC2 since the charging IC2, whose main function is to control charging of the power supply BAT, generates the system power supply voltage Vcc4 and supplies it to the LEDs L1 to L8, a dedicated IC for generating the system power supply voltage Vcc4 is unnecessary. becomes. Therefore, the size and cost of the suction device 100 can be reduced. Moreover, since the charging IC 2 boosts the power supply voltage V BAT to generate the system power supply voltage Vcc4, it is possible to supply high voltage power to the LEDs L1 to L8. As a result, the LEDs L1 to L8 can be lit with high brightness, and a good user interface can be realized.
  • the aspirator 100 power is supplied to the MCU1 via the charging IC2 instead of directly from the power supply BAT. Since the charging IC2 whose main function is to control charging of the power supply BAT generates the system power supply voltage Vcc0 and supplies it to the MCU1, a dedicated IC for generating the system power supply voltage Vcc0 is not required. Therefore, the size and cost of the suction device 100 can be reduced. Moreover, since the step-up/step-down DC/DC converter 8 is provided between the charging IC 2 and the MCU 1 , constant power can be supplied to the MCU 1 . Thereby, the operation of the MCU 1 can be stabilized.
  • the OTG function cannot be executed when the USB connection is made and the LSW 3 is closed. Therefore, the power consumption of the power supply BAT during USB connection can be suppressed, and the usable power amount of the power supply BAT can be increased.
  • the LSW3 is open immediately after the USB connection is made, noise and rush current immediately after the USB connection are not supplied to the LEDs L1 to L8, and the possibility of failure of the LEDs L1 to L8 can be reduced. Also, the OTG function can be executed immediately after the USB connection.
  • the charging IC 2 can supply the power of the power supply BAT to the MCU 1 and other loads as well. can be reduced.
  • a notification unit other than the LEDs L1 to L8 may be connected to the input terminal VBUS of the charging IC2.
  • the input terminal VBUS of the charging IC2 and the vibration motor M are connected to supply the system power supply voltage Vcc4 and the USB voltage VUSB to the vibration motor M.
  • the input terminal VBUS of the charging IC 2 may be connected to an IC other than the notification unit (an IC separate from the IC shown in FIG. 10). It is preferable that at least one of the notification unit and the separate IC is connected as a load to the input terminal VBUS of the charging IC2.
  • the sucker 100 also has a first discharge path for supplying power from the power supply BAT via the charging IC2 to the MCU1, and a second discharge path for supplying power from the power supply BAT to the heater HTR without passing through the charging IC2. , has Therefore, the current value to be passed through the first discharge path (maximum current that can be output from the output terminal SYS of the charging IC2) can be smaller than the current value to be passed through the second discharge path. Therefore, an expensive and large-scale charging IC 2 that can withstand a large current becomes unnecessary, and the size and cost of the sucker 100 can be reduced. MCU1 and heater HTR can operate simultaneously, but even if they operate simultaneously, the presence of the first discharge path and the second discharge path ensures that sufficient power is supplied to them without excessively burdening charging IC2. can supply
  • the second discharge path through which a large current flows is provided on a substrate different from the first discharge path.
  • the first discharge path is provided on the MCU mounting board 161 and the second discharge path is provided on the receptacle mounting board 162 . Therefore, heat concentration on one substrate can be avoided, and the durability of the aspirator 100 can be improved.
  • the aspirator 100 all electronic components that receive power supply from the power source BAT without passing through the charging IC 2 are provided on the same substrate (receptacle mounting substrate 162). Therefore, it is possible to prevent the electric circuit from becoming complicated.
  • the step-up DC/DC converter 9 is provided in the discharge path for discharging from the power supply BAT to the heater HTR. Therefore, high power can be supplied to the heater HTR by the boost DC/DC converter 9 without worrying about the maximum current of the output terminal SYS of the charging IC 2 . Therefore, it is possible to efficiently heat the rod 500 by the heater HTR while realizing cost reduction and miniaturization of the aspirator 100 .
  • the aspirator 100 has a discharge path (a path from the receptacle RCP to the LEDs L1 to L8) that discharges to the LEDs L1 to L8 without going through the charging IC2 when connected to the USB.
  • a discharge path (a path from the receptacle RCP to the LEDs L1 to L8) that discharges to the LEDs L1 to L8 without going through the charging IC2 when connected to the USB.
  • the electronic component connected to the input terminal VBUS of the charging IC2 is a notification unit such as LEDs L1 to L8, or an IC separate from the illustrated IC. Therefore, the power from the external power supply, which is susceptible to noise and inrush current, is supplied to precision electronic components such as the MCU 1, the step-up/step-down DC/DC converter 8, the ROM 6, the fuel gauge IC 12, the protection IC 10, and the step-up DC/DC converter 9. You can prevent it from being damaged and increase its durability.
  • an overvoltage protection IC 11 is provided between the LSW 3 and the receptacle RCP. Due to the presence of the overvoltage protection IC 11, not only the LSW 3 but also the overvoltage protection IC 11 can block noise and rush current that may occur at the moment of USB connection. Thereby, the durability of the aspirator 100 can be improved.
  • each of the LEDs L1 to L8 does not operate unless the built-in switch of the MCU1 is turned on. Therefore, it is possible to prevent noise and rush current immediately after the USB connection from being supplied to the LEDs L1 to L8, and reduce the possibility of failure of the LEDs L1 to L8. Moreover, since the switch is built in the MCU1, the durability of the switch can be improved as compared with the case where the switch is provided outside the MCU1.
  • the system power supply voltage Vcc4 and the driving voltage Vbst are the major ones.
  • System power supply voltage Vcc4 is generated from power from an external power supply and power from power supply BAT.
  • the drive voltage Vbst is generated only by power from the power supply BAT.
  • the driving voltage Vbst is not generated from the power of the external power supply, so that the line through which the high voltage power flows can be prevented from becoming complicated. This avoids complication of the circuit, so the cost of the suction device 100 can be reduced.
  • the power supply line to which the power including the system power supply voltage Vcc4 is supplied and the power supply line to which the power including the drive voltage Vbst is supplied are on different substrates.
  • a power supply line to which power including the system power supply voltage Vcc4 is supplied is provided in the MCU mounting board 161 and the LED mounting board 163 .
  • a power supply path to which power including the drive voltage Vbst is supplied is provided on the receptacle mounting board 162 .
  • the power connector connected to the power source BAT, the receptacle RCP connected to the external power source, and the heater connector Cn connected to the heater HTR are provided on the same substrate (receptacle mounting substrate 162). be done. As a result, the heat generation at various locations in the suction device 100 is suppressed, so the durability of the suction device 100 is improved.
  • a connector for connecting a heater other than the heater HTR (a heating object different from the heater HTR) and other loads is connected. It may be configured to be
  • a parallel circuit of a circuit including a switch S3 and a circuit including a switch S4 and a resistor Rs is connected between the output terminal VOUT of the step-up DC/DC converter 9 and the positive electrode side of the heater connector Cn.
  • this parallel circuit is connected between the negative electrode side of the heater connector Cn and the switch S6, and the output terminal VOUT of the step-up DC/DC converter 9 and the positive electrode side of the heater connector Cn are directly connected. good too.
  • the charging IC is configured to be capable of supplying power input from the power supply to the charging terminal to the first load via the output terminal. Power supply unit for the aerosol generator.
  • the maximum current of the output terminal can be made lower than the current supplied to the second load, thereby eliminating the need for an expensive and large-scale charging IC that can withstand a large current. Therefore, it is possible to reduce the cost and size of the aerosol generator.
  • the power supply unit of the aerosol generator includes a boost converter (boost DC/DC converter 9) capable of boosting the output voltage of the power supply and applying it to the second load, Power supply unit for the aerosol generator.
  • boost converter boost DC/DC converter 9
  • the boost converter includes a switching regulator including a mode terminal (mode terminal MODE), The switching regulator is configured to select one of a PFM mode and a PWM mode based on the potential of the mode terminal to boost the output voltage of the power supply, The potential of the mode terminal is configured to be unchangeable, Power supply unit for the aerosol generator.
  • the switching regulator is fixed to a mode with a high maximum current. Therefore, not only can a larger current be supplied to the second load, but even if a large current flows, it is difficult for the current to exceed the maximum current. As a result, the effect of the second load can be increased while stabilizing the operation of the second load. In addition, even if a large current flows, it is difficult for the current to be close to the maximum current, so the efficiency of the switching regulator is less likely to decrease.
  • the switching regulator is fixed to the PFM mode in which high conversion efficiency can be achieved in many current ranges. As a result, the power loss due to voltage conversion is reduced, and the utilization efficiency of the power stored in the power supply can be improved.
  • the power supply unit of the aerosol generator, the second load is a heater (heater HTR) capable of heating the aerosol source;
  • the switching regulator includes an input terminal (switching terminal SW), a heater connector (heater connector Cn) having a positive electrode side and a negative electrode side and to which the heater is connected; a first circuit connected between the power source and the positive electrode side of the heater connector or between the negative electrode side of the heater connector and ground and including a first switch (switch S3); a second circuit connected in parallel to the first circuit, having a resistance value higher than that of the first circuit, and including a resistor (resistor Rs) and a second switch (switch S4); a controller (MCU1) configured to control opening and closing of the first switch and the second switch;
  • the controller is a voltage applied to the resistor or the heater can be obtained when only the second switch of the first switch and the second switch is closed; configured to perform a predetermined control based on the voltage applied to the resistor or the heater; Power supply
  • the input current of the switching regulator differs greatly between when the high-resistance second circuit switch is on and when the low-resistance first circuit switch is on. Since the switching regulator is fixed to the PFM mode, high conversion efficiency can be achieved when either switch is ON. In addition, it is possible to reduce the noise given to the voltage value acquired by the controller, which is caused by an unstable current that may occur when the mode of the switching regulator is switched. Therefore, it is possible to improve the accuracy of the control executed by the controller while improving the utilization efficiency of the power stored in the power supply.
  • the power unit of the aerosol generator according to any one of (2) to (6), a first substrate (MCU mounting substrate 161); A second substrate (receptacle mounting substrate 162) separate from the first substrate, The charging IC is provided on the first substrate, The boost converter is provided on the second substrate, Power supply unit for the aerosol generator.
  • the path for discharging from the power supply to the first load via the charging IC and the discharge path are provided on different substrates.
  • the charge IC and the boost converter which tend to generate heat during operation, are provided on different substrates, heat concentration on one substrate can be avoided. As a result, the durability of the aerosol generator can be improved.
  • a power supply unit for an aerosol generator according to any one of (1) to (7), A voltage converter (buck-boost DC/DC converter 8) connected between the output terminal and the first load and configured to output a constant voltage; Power supply unit for the aerosol generator.
  • a voltage converter buck-boost DC/DC converter 8
  • the voltage converter can have a small maximum output current and a small maximum input current, so the cost and size can be reduced.
  • the charging IC since the charging IC has an important function of charging the power supply, designing it with a little margin greatly reduces the risk of failure. As a result, the cost can be reduced while improving the durability of the aerosol generating device.
  • the power supply unit of the aerosol generator a first substrate (MCU mounting substrate 161); A second substrate (receptacle mounting substrate 162) separate from the first substrate, The charging IC and the voltage converter are provided only on the first substrate out of the first substrate and the second substrate, Power supply unit for the aerosol generator.
  • the charging IC and the voltage converter become closer, and the resistance of the conductor connecting them becomes lower. Also, the current and voltage input to the voltage converter do not need to be reduced unnecessarily. As a result, the loss due to wire resistance and the loss due to voltage conversion are reduced, so that not only is the efficiency of utilization of electric power stored in the power supply improved, but also the generation of heat can be suppressed.

Abstract

Provided is an aerosol generation device achieving reductions in size and cost. An inhaler (100) comprises: a power supply (BAT); a receptacle (RCP) electrically connectable to an external power supply; an MCU (1); a charge IC (2) including an input terminal (VBUS) connected to the receptacle (RCP), a charge terminal (bat) connected to the power supply (BAT), and an output terminal (SYS) connected to the MCU (1); and a discharge path which is capable of supplying from the power supply (BAT) a current greater than a maximum current that the output terminal (SYS) can output, and which is connected to a heater (HTR). The charge IC (2) is configured to be able to supply power input to the charge terminal (bat) from the power supply (BAT) to the MCU (1) via the output terminal (SYS).

Description

エアロゾル生成装置の電源ユニットPower supply unit for aerosol generator
 本発明は、エアロゾル生成装置の電源ユニットに関する。 The present invention relates to a power supply unit for an aerosol generator.
 特許文献1には、USB電源又はバッテリから電圧を受け取ることが可能であり、受け取った電圧を発熱体に供給可能なコンバータを有する蒸発器装置が記載されている。このコンバータは、USB電源からの電圧によるバッテリの充電が可能に構成されている。 Patent Document 1 describes an evaporator device that can receive voltage from a USB power source or a battery and has a converter that can supply the received voltage to a heating element. This converter is configured to charge the battery with the voltage from the USB power supply.
 特許文献2には、一次電源及び一次電源を充電する充電装置を含む一次装置と、一次電源によって充電される二次電源及び二次電源からの給電により発熱する負荷を含む二次装置と、を備える喫煙システムが記載されている。この喫煙システムでは、一次電源から負荷への直接的な給電が可能になっている。 Patent Document 2 discloses a primary device including a primary power source and a charging device that charges the primary power source, and a secondary device including a secondary power source that is charged by the primary power source and a load that generates heat when fed from the secondary power source. A smoking system comprising: The smoking system allows direct powering of the load from the primary power source.
 特許文献3には、充電器からの電力をタバコのカートリッジの加熱素子に供給可能な電子タバコが記載されている。 Patent Document 3 describes an electronic cigarette capable of supplying power from a charger to a heating element of a cigarette cartridge.
米国特許公開2020/0120991号U.S. Patent Publication No. 2020/0120991 国際公開第2018/167817号WO2018/167817 日本国特表2015-500647号公報Japanese special table 2015-500647
 電源を搭載するエアロゾル生成装置に充電ICを設ける場合、充電ICのPower Path機能を利用して、外部電源や内蔵電源からの電力を、ヒータやコントローラ等の負荷へ供給することが考えられる。しかし、充電ICの出力端子に接続される負荷が増えると、その出力端子から出力される電流が増大することになり、大規模や高コストな充電ICを使用する必要がある。 When a charging IC is provided in an aerosol generating device equipped with a power supply, it is conceivable to use the Power Path function of the charging IC to supply power from an external power supply or a built-in power supply to a load such as a heater or controller. However, when the load connected to the output terminal of the charging IC increases, the current output from the output terminal increases, and it is necessary to use a large-scale and high-cost charging IC.
 本発明の目的は、小型化や低コスト化を実現することのできるエアロゾル生成装置を提供することにある。 The purpose of the present invention is to provide an aerosol generator that can achieve miniaturization and cost reduction.
 本発明の一態様のエアロゾル生成装置の電源ユニットは、エアロゾル源を加熱してエアロゾルを生成するエアロゾル生成装置の電源ユニットであって、電源と、外部電源へ電気的に接続可能なコネクタと、第1負荷と、前記コネクタへ接続される入力端子と前記電源へ接続される充電端子と前記第1負荷へ接続される出力端子とを含み、前記入力端子へ入力される電力を変換して前記充電端子から出力するように構成される充電ICと、前記出力端子が出力可能な最大電流より大きな電流を前記電源から供給可能であり、且つ、前記第1負荷とは別の第2負荷へ接続される放電経路と、を備え、前記充電ICは、前記電源から前記充電端子へ入力される電力を前記出力端子を介して前記第1負荷へ供給可能に構成される、ものである。 A power supply unit for an aerosol generation device according to one aspect of the present invention is a power supply unit for an aerosol generation device that heats an aerosol source to generate an aerosol, comprising: a power source; a connector electrically connectable to an external power source; 1 load, an input terminal connected to the connector, a charging terminal connected to the power supply, and an output terminal connected to the first load; a charging IC configured to output from a terminal; a current larger than a maximum current that the output terminal can output from the power supply; and connected to a second load different from the first load. and a discharge path, wherein the charging IC is configured to be capable of supplying power input from the power supply to the charging terminal to the first load via the output terminal.
 本発明によれば、小型化や低コスト化を実現することのできるエアロゾル生成装置を提供することができる。 According to the present invention, it is possible to provide an aerosol generating device that can achieve miniaturization and cost reduction.
非燃焼式吸引器の斜視図である。1 is a perspective view of a non-combustion inhaler; FIG. ロッドを装着した状態を示す非燃焼式吸引器の斜視図である。1 is a perspective view of a non-combustion inhaler showing a state in which a rod is attached; FIG. 非燃焼式吸引器の他の斜視図である。Fig. 10 is another perspective view of a non-combustion type inhaler; 非燃焼式吸引器の分解斜視図である。1 is an exploded perspective view of a non-combustion inhaler; FIG. 非燃焼式吸引器の内部ユニットの斜視図である。Fig. 3 is a perspective view of the internal unit of the non-combustion inhaler; 図5の内部ユニットの分解斜視図である。FIG. 6 is an exploded perspective view of the internal unit of FIG. 5; 電源及びシャーシを取り除いた内部ユニットの斜視図である。FIG. 3 is a perspective view of the internal unit with the power supply and chassis removed; 電源及びシャーシを取り除いた内部ユニットの他の斜視図である。FIG. 11 is another perspective view of the internal unit with the power supply and chassis removed; 吸引器の動作モードを説明するための模式図である。It is a schematic diagram for demonstrating the operation mode of an aspirator. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. スリープモードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of an electric circuit in sleep mode; アクティブモードにおける電気回路の動作を説明するための図である。It is a figure for demonstrating the operation|movement of the electric circuit in active mode. 加熱初期設定モードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode; 加熱モードにおけるヒータの加熱時の電気回路の動作を説明するための図である。It is a figure for demonstrating the operation|movement of the electric circuit at the time of the heating of the heater in heating mode. 加熱モードにおけるヒータの温度検出時の電気回路の動作を説明するための図である。FIG. 5 is a diagram for explaining the operation of the electric circuit when detecting the temperature of the heater in the heating mode; 充電モードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of the electric circuit in charging mode; MCUのリセット(再起動)時の電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of an electric circuit when an MCU is reset (restarted); 充電ICの内部の概略構成を示す図である。It is a figure which shows schematic structure inside charging IC.
 以下、本発明におけるエアロゾル生成装置の一実施形態である吸引システムについて図面を参照しながら説明する。この吸引システムは、本発明の電源ユニットの一実施形態である非燃焼式吸引器100(以下、単に、「吸引器100」ともいう)と、吸引器100によって加熱されるロッド500と、を備える。以下の説明では、吸引器100が、加熱部を着脱不能に収容した構成を例に説明する。しかし、吸引器100に対し加熱部が着脱自在に構成されていてもよい。例えば、ロッド500と加熱部が一体化されたものを、吸引器100に着脱自在に構成したものであってもよい。つまり、エアロゾル生成装置の電源ユニットは、構成要素として加熱部を含まない構成であってもよい。なお、着脱不能とは、想定される用途の限りにおいて、取外しが行えないような態様を指すものとする。または、吸引器100に設けられる誘導加熱用コイルと、ロッド500に内蔵されるサセプタが協働して加熱部を構成してもよい。 A suction system, which is one embodiment of the aerosol generator of the present invention, will be described below with reference to the drawings. This suction system includes a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100. . In the following description, a configuration in which the suction device 100 accommodates the heating unit in a non-detachable manner will be described as an example. However, the heating unit may be detachably attached to the aspirator 100 . For example, the rod 500 and the heating unit may be integrated and detachably attached to the aspirator 100 . In other words, the power supply unit of the aerosol generator may have a configuration that does not include the heating section as a component. It should be noted that "non-detachable" refers to a mode in which detachment is not possible as far as the intended use is concerned. Alternatively, an induction heating coil provided in the aspirator 100 and a susceptor built in the rod 500 may cooperate to form a heating unit.
 図1は、吸引器100の全体構成を示す斜視図である。図2は、ロッド500を装着した状態を示す吸引器100の斜視図である。図3は、吸引器100の他の斜視図である。図4は、吸引器100の分解斜視図である。また、以下の説明では、互いに直交する3方向を、便宜上、前後方向、左右方向、上下方向とした、3次元空間の直交座標系を用いて説明する。図中、前方をFr、後方をRr、右側をR、左側をL、上方をU、下方をD、として示す。 FIG. 1 is a perspective view showing the overall configuration of the aspirator 100. FIG. FIG. 2 is a perspective view of the suction device 100 showing a state in which the rod 500 is attached. FIG. 3 is another perspective view of the suction device 100. FIG. FIG. 4 is an exploded perspective view of the aspirator 100. FIG. Also, in the following description, for the sake of convenience, the orthogonal coordinate system of a three-dimensional space is used, in which the three mutually orthogonal directions are the front-back direction, the left-right direction, and the up-down direction. In the figure, the front is indicated by Fr, the rear by Rr, the right by R, the left by L, the upper by U, and the lower by D.
 吸引器100は、エアロゾル源及び香味源を含む充填物などを有する香味成分生成基材の一例としての細長い略円柱状のロッド500(図2参照)を加熱することによって、香味を含むエアロゾルを生成するように構成される。 The inhaler 100 generates flavor-containing aerosol by heating an elongated, substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-generating base having a filling containing an aerosol source and a flavor source. configured to
<香味成分生成基材(ロッド)>
 ロッド500は、所定温度で加熱されてエアロゾルを生成するエアロゾル源を含有する充填物を含む。
<Flavor component-generating base material (rod)>
Rod 500 includes a fill containing an aerosol source that is heated at a predetermined temperature to produce an aerosol.
 エアロゾル源の種類は、特に限定されず、用途に応じて種々の天然物からの抽出物質及び/又はそれらの構成成分を選択することができる。エアロゾル源は、固体であってもよいし、例えば、グリセリン、プロピレングリコールといった多価アルコールや、水などの液体であってもよい。エアロゾル源は、加熱することによって香味成分を放出するたばこ原料やたばこ原料由来の抽出物等の香味源を含んでいてもよい。香味成分が付加される気体はエアロゾルに限定されず、例えば不可視の蒸気が生成されてもよい。 The type of aerosol source is not particularly limited, and extracts from various natural products and/or their constituent components can be selected according to the application. The aerosol source may be solid or liquid, for example polyhydric alcohols such as glycerin, propylene glycol, or water. The aerosol source may include a flavor source such as a tobacco material or an extract derived from the tobacco material that releases flavor components upon heating. The gas to which the flavor component is added is not limited to an aerosol, and for example an invisible vapor may be generated.
 ロッド500の充填物は、香味源としてたばこ刻みを含有し得る。たばこ刻みの材料は特に限定されず、ラミナや中骨等の公知の材料を用いることができる。充填物は、1種又は2種以上の香料を含んでいてもよい。当該香料の種類は特に限定されないが、良好な喫味の付与の観点から、好ましくはメンソールである。香味源は、たばこ以外の植物(例えば、ミント、漢方、又はハーブ等)を含有し得る。用途によっては、ロッド500は香味源を含まなくてもよい。 The filling of rod 500 may contain tobacco shreds as a flavor source. Materials for shredded tobacco are not particularly limited, and known materials such as lamina and backbone can be used. The filling may contain one or more perfumes. The type of flavoring agent is not particularly limited, but menthol is preferable from the viewpoint of imparting a good smoking taste. Flavor sources may contain plants other than tobacco, such as mints, herbal medicines, or herbs. Depending on the application, rod 500 may not contain a flavor source.
<非燃焼式吸引器の全体構成>
 続いて、吸引器100の全体構成について、図1~図4を参照しながら説明する。
 吸引器100は、前面、後面、左面、右面、上面、及び下面を備える略直方体形状のケース110を備える。ケース110は、前面、後面、上面、下面、及び右面が一体に形成された有底筒状のケース本体112と、ケース本体112の開口部114(図4参照)を封止し左面を構成するアウターパネル115及びインナーパネル118と、スライダ119と、を備える。
<Overall configuration of non-combustion type aspirator>
Next, the overall configuration of the suction device 100 will be described with reference to FIGS. 1 to 4. FIG.
The suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The case 110 comprises a bottomed cylindrical case body 112 in which front, rear, top, bottom, and right surfaces are integrally formed, and a left surface that seals an opening 114 (see FIG. 4) of the case body 112. It has an outer panel 115 , an inner panel 118 , and a slider 119 .
 インナーパネル118は、ケース本体112にボルト120で固定される。アウターパネル115は、ケース本体112に収容された後述するシャーシ150(図5参照)に保持されたマグネット124によって、インナーパネル118の外面を覆うようにケース本体112に固定される。アウターパネル115が、マグネット124によって固定されることで、ユーザは好みに合わせてアウターパネル115を取り替えることが可能となっている。 The inner panel 118 is fixed to the case body 112 with bolts 120 . The outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held by a chassis 150 (see FIG. 5) housed in the case body 112 and described later. Since the outer panel 115 is fixed by the magnet 124, the user can replace the outer panel 115 according to his or her preference.
 インナーパネル118には、マグネット124が貫通するように形成された2つの貫通孔126が設けられる。インナーパネル118には、上下に配置された2つの貫通孔126の間に、さらに縦長の長孔127及び円形の丸孔128が設けられる。この長孔127は、ケース本体112に内蔵された8つのLED(Light Emitting Diode) L1~L8から出射される光を透過させるためのものである。丸孔128には、ケース本体112に内蔵されたボタン式の操作スイッチOPSが貫通する。これにより、ユーザは、アウターパネル115のLED窓116を介して8つのLED L1~L8から出射される光を検知することができる。また、ユーザは、アウターパネル115の押圧部117を介して操作スイッチOPSを押し下げることができる。 The inner panel 118 is provided with two through holes 126 through which the magnets 124 pass. The inner panel 118 is further provided with a longitudinally elongated hole 127 and a circular round hole 128 between the two vertically arranged through holes 126 . This long hole 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case body 112 . A button-type operation switch OPS built in the case body 112 passes through the round hole 128 . Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. FIG. Also, the user can press down the operation switch OPS via the pressing portion 117 of the outer panel 115 .
 図2に示すように、ケース本体112の上面には、ロッド500を挿入可能な開口132が設けられる。スライダ119は、開口132を閉じる位置(図1参照)と開口132を開放する位置(図2参照)との間を、前後方向に移動可能にケース本体112に結合される。 As shown in FIG. 2, the upper surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted. The slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position for closing the opening 132 (see FIG. 1) and a position for opening the opening 132 (see FIG. 2).
 操作スイッチOPSは、吸引器100の各種操作を行うために使用される。例えば、ユーザは、図2に示すようにロッド500を開口132に挿入して装着した状態で、押圧部117を介して操作スイッチOPSを操作する。これにより、加熱部170(図5参照)によって、ロッド500を燃焼させずに加熱する。ロッド500が加熱されると、ロッド500に含まれるエアロゾル源からエアロゾルが生成され、ロッド500に含まれる香味源の香味が当該エアロゾルに付加される。ユーザは、開口132から突出したロッド500の吸口502を咥えて吸引することにより、香味を含むエアロゾルを吸引することができる。 The operation switch OPS is used to perform various operations of the aspirator 100. For example, the user operates the operation switch OPS via the pressing portion 117 while inserting the rod 500 into the opening 132 as shown in FIG. Thus, the heating unit 170 (see FIG. 5) heats the rod 500 without burning it. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500 and the flavor of the flavor source contained in the rod 500 is added to the aerosol. The user can inhale the flavor-containing aerosol by holding the mouthpiece 502 of the rod 500 projecting from the opening 132 and inhaling.
 ケース本体112の下面には、図3に示すように、コンセントやモバイルバッテリ等の外部電源と電気的に接続して電力供給を受けるための充電端子134が設けられている。本実施形態において、充電端子134は、USB(Universal Serial Bus) Type-C形状のレセプタクルとしているが、これに限定されるものではない。充電端子134を、以下では、レセプタクルRCPとも記載する。  On the bottom surface of the case main body 112, as shown in Fig. 3, a charging terminal 134 is provided for receiving power supply by being electrically connected to an external power source such as an outlet or a mobile battery. In this embodiment, the charging terminal 134 is a USB (Universal Serial Bus) Type-C receptacle, but is not limited to this. Charging terminal 134 is hereinafter also referred to as receptacle RCP.
 なお、充電端子134は、例えば、受電コイルを備え、外部電源から送電される電力を非接触で受電可能に構成されてもよい。この場合の電力伝送(Wireless Power Transfer)の方式は、電磁誘導型でもよいし、磁気共鳴型でもよいし、電磁誘導型と磁気共鳴型を組み合わせたものでもよい。別の一例として、充電端子134は、各種USB端子等が接続可能であり、且つ上述した受電コイルを有していてもよい。 It should be noted that the charging terminal 134 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply. The wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type. As another example, the charging terminal 134 can be connected to various USB terminals or the like, and may have the power receiving coil described above.
 図1~図4に示される吸引器100の構成は一例にすぎない。吸引器100は、ロッド500を保持して例えば加熱等の作用を加えることで、ロッド500から香味成分が付与された気体を生成させ、生成された気体をユーザが吸引することができるような、様々な形態で構成することができる。 The configuration of the aspirator 100 shown in FIGS. 1-4 is merely an example. The inhaler 100 holds the rod 500 and applies an action such as heating to generate gas to which a flavor component is added from the rod 500, and the user can inhale the generated gas. It can be configured in various forms.
<非燃焼式吸引器の内部構成>
 吸引器100の内部ユニット140について図5~図8を参照しながら説明する。
 図5は、吸引器100の内部ユニット140の斜視図である。図6は、図5の内部ユニット140の分解斜視図である。図7は、電源BAT及びシャーシ150を取り除いた内部ユニット140の斜視図である。図8は、電源BAT及びシャーシ150を取り除いた内部ユニット140の他の斜視図である。
<Internal configuration of non-combustion type aspirator>
The internal unit 140 of the suction device 100 will be described with reference to FIGS. 5-8.
FIG. 5 is a perspective view of the internal unit 140 of the suction device 100. FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5. FIG. FIG. 7 is a perspective view of internal unit 140 with power supply BAT and chassis 150 removed. FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and chassis 150 removed.
 ケース110の内部空間に収容される内部ユニット140は、シャーシ150と、電源BATと、回路部160と、加熱部170と、通知部180と、各種センサと、を備える。 The internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.
 シャーシ150は、前後方向においてケース110の内部空間の略中央に配置され上下方向且つ前後方向に延設された板状のシャーシ本体151と、前後方向においてケース110の内部空間の略中央に配置され上下方向且つ左右方向に延びる板状の前後分割壁152と、上下方向において前後分割壁152の略中央から前方に延びる板状の上下分割壁153と、前後分割壁152及びシャーシ本体151の上縁部から後方に延びる板状のシャーシ上壁154と、前後分割壁152及びシャーシ本体151の下縁部から後方に延びる板状のシャーシ下壁155と、を備える。シャーシ本体151の左面は、前述したケース110のインナーパネル118及びアウターパネル115に覆われる。 The chassis 150 includes a plate-shaped chassis body 151 arranged substantially in the center of the interior space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, and a chassis body 151 disposed substantially in the center of the interior space of the case 110 in the front-rear direction. A plate-shaped front and rear dividing wall 152 extending in the vertical and horizontal directions, a plate-shaped upper and lower dividing wall 153 extending forward from substantially the center of the front and rear dividing wall 152 in the vertical direction, the front and rear dividing wall 152 and the upper edges of the chassis body 151 and a plate-shaped chassis lower wall 155 extending rearward from the front-rear dividing wall 152 and the lower edge of the chassis body 151 . The left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.
 ケース110の内部空間は、シャーシ150により前方上部に加熱部収容領域142が区画形成され、前方下部に基板収容領域144が区画形成され、後方に上下方向に亘って電源収容空間146が区画形成されている。 The internal space of the case 110 is defined by a chassis 150 such that a heating unit housing area 142 is defined in the upper front, a board housing area 144 is defined in the lower front, and a power supply housing space 146 is defined in the rear to extend vertically. ing.
 加熱部収容領域142に収容される加熱部170は、複数の筒状の部材から構成され、これらが同心円状に配置されることで、全体として筒状体をなしている。加熱部170は、その内部にロッド500の一部を収納可能なロッド収容部172と、ロッド500を外周または中心から加熱するヒータHTR(図10~図19参照)と、を有する。ロッド収容部172が断熱材で構成される、又は、ロッド収容部172の内部に断熱材が設けられることで、ロッド収容部172の表面とヒータHTRは断熱されることが好ましい。ヒータHTRは、ロッド500を加熱可能な素子であればよい。ヒータHTRは、例えば、発熱素子である。発熱素子としては、発熱抵抗体、セラミックヒータ、及び誘導加熱式のヒータ等が挙げられる。ヒータHTRとしては、例えば、温度の増加に伴って抵抗値も増加するPTC(Positive Temperature Coefficient)特性を有するものが好ましく用いられる。これに代えて、温度の増加に伴って抵抗値が低下するNTC(Negative Temperature Coefficient)特性を有するヒータHTRを用いてもよい。加熱部170は、ロッド500へ供給する空気の流路を画定する機能、及びロッド500を加熱する機能を有する。ケース110には、空気を流入させるための通気口(不図示)が形成され、加熱部170に空気が流入できるように構成される。 The heating part 170 housed in the heating part housing area 142 is composed of a plurality of tubular members, which are concentrically arranged to form a tubular body as a whole. The heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) that heats the rod 500 from its outer circumference or center. Preferably, the surface of the rod housing portion 172 and the heater HTR are insulated by forming the rod housing portion 172 from a heat insulating material or providing a heat insulating material inside the rod housing portion 172 . The heater HTR may be any element that can heat the rod 500 . The heater HTR is, for example, a heating element. Heating elements include heating resistors, ceramic heaters, induction heaters, and the like. As the heater HTR, for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used. Alternatively, a heater HTR having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used. The heating part 170 has a function of defining a flow path of air to be supplied to the rod 500 and a function of heating the rod 500 . The case 110 is formed with a vent (not shown) for introducing air, and is configured to allow air to enter the heating unit 170 .
 電源収容空間146に収容される電源BATは、充電可能な二次電池、電気二重層キャパシタ等であり、好ましくは、リチウムイオン二次電池である。電源BATの電解質は、ゲル状の電解質、電解液、固体電解質、イオン液体の1つ又はこれらの組合せで構成されていてもよい。 The power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery. The electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
 通知部180は、電源BATの充電状態を示すSOC(State Of Charge)、吸引時の予熱時間、吸引可能期間等の各種情報を通知する。本実施形態の通知部180は、8つのLED L1~L8と、振動モータMと、を含む。通知部180は、LED L1~L8のような発光素子によって構成されていてもよく、振動モータMのような振動素子によって構成されていてもよく、音出力素子によって構成されていてもよい。通知部180は、発光素子、振動素子、及び音出力素子のうち、2以上の素子の組合せであってもよい。 The notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the state of charge of the power supply BAT, the preheating time during suction, and the suction possible period. The notification unit 180 of this embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be composed of light emitting elements such as LEDs L1 to L8, may be composed of vibrating elements such as the vibration motor M, or may be composed of sound output elements. The notification unit 180 may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
 各種センサは、ユーザのパフ動作(吸引動作)を検出する吸気センサ、電源BATの温度を検出する電源温度センサ、ヒータHTRの温度を検出するヒータ温度センサ、ケース110の温度を検出するケース温度センサ、スライダ119の位置を検出するカバー位置センサ、及びアウターパネル115の着脱を検出するパネル検出センサ等を含む。 Various sensors include an intake air sensor that detects the user's puff action (sucking action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , a cover position sensor that detects the position of the slider 119, a panel detection sensor that detects attachment/detachment of the outer panel 115, and the like.
 吸気センサは、例えば、開口132の近傍に配置されたサーミスタT2を主体に構成される。電源温度センサは、例えば、電源BATの近傍に配置されたサーミスタT1を主体に構成される。ヒータ温度センサは、例えば、ヒータHTRの近傍に配置されたサーミスタT3を主体に構成される。上述した通り、ロッド収容部172はヒータHTRから断熱されることが好ましい。この場合において、サーミスタT3は、ロッド収容部172の内部において、ヒータHTRと接する又は近接することが好ましい。ヒータHTRがPTC特性やNTC特性を有する場合、ヒータHTRそのものをヒータ温度センサに用いてもよい。ケース温度センサは、例えば、ケース110の左面の近傍に配置されたサーミスタT4を主体に構成される。カバー位置センサは、スライダ119の近傍に配置されたホール素子を含むホールIC14を主体に構成される。パネル検出センサは、インナーパネル118の内側の面の近傍に配置されたホール素子を含むホールIC13を主体に構成される。 The intake sensor is mainly composed of a thermistor T2 arranged near the opening 132, for example. The power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged near the power supply BAT. The heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged near the heater HTR. As described above, the rod housing portion 172 is preferably insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod housing portion 172 . If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor. The case temperature sensor is mainly composed of, for example, a thermistor T4 arranged near the left surface of the case 110 . The cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged near the slider 119 . The panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged near the inner surface of the inner panel 118 .
 回路部160は、4つの回路基板と、複数のIC(Integrate Circuit)と、複数の素子と、を備える。4つの回路基板は、主に後述のMCU(Micro Controller Unit)1及び充電IC2が配置されたMCU搭載基板161と、主に充電端子134が配置されたレセプタクル搭載基板162と、操作スイッチOPS、LED L1~L8、及び後述の通信IC15が配置されたLED搭載基板163と、カバー位置センサを構成するホール素子を含む後述のホールIC14が配置されたホールIC搭載基板164と、を備える。 The circuit section 160 includes four circuit boards, multiple ICs (Integrate Circuits), and multiple elements. The four circuit boards are an MCU-mounted board 161 on which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are mainly arranged, a receptacle-mounted board 162 mainly on which charging terminals 134 are arranged, an operation switch OPS, and an LED An LED mounting substrate 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a Hall IC mounting substrate 164 on which a Hall IC 14 including a Hall element constituting a cover position sensor is arranged.
 MCU搭載基板161及びレセプタクル搭載基板162は、基板収容領域144において互いに平行に配置される。具体的に説明すると、MCU搭載基板161及びレセプタクル搭載基板162は、それぞれの素子配置面が左右方向及び上下方向に沿って配置され、MCU搭載基板161がレセプタクル搭載基板162よりも前方に配置される。MCU搭載基板161及びレセプタクル搭載基板162には、それぞれ開口部が設けられる。MCU搭載基板161及びレセプタクル搭載基板162は、これら開口部の周縁部同士の間に円筒状のスペーサ173を介在させた状態で前後分割壁152の基板固定部156にボルト136で締結される。即ち、スペーサ173は、ケース110の内部におけるMCU搭載基板161及びレセプタクル搭載基板162の位置を固定し、且つ、MCU搭載基板161とレセプタクル搭載基板162とを機械的に接続する。これにより、MCU搭載基板161とレセプタクル搭載基板162が接触し、これらの間で短絡電流が生じることを抑制できる。 The MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144 . More specifically, the MCU mounting board 161 and the receptacle mounting board 162 are arranged such that their element mounting surfaces are arranged along the horizontal direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. . The MCU mounting board 161 and the receptacle mounting board 162 are each provided with openings. The MCU mounting board 161 and the receptacle mounting board 162 are fastened with bolts 136 to the board fixing portion 156 of the front/rear dividing wall 152 with a cylindrical spacer 173 interposed between the peripheral edges of these openings. That is, the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162 . As a result, it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them.
 便宜上、MCU搭載基板161及びレセプタクル搭載基板162の前方を向く面を、それぞれの主面161a、162aとし、主面161a、162aの反対面をそれぞれの副面161b、162bとすると、MCU搭載基板161の副面161bと、レセプタクル搭載基板162の主面162aとが、所定の隙間を介して対向する。MCU搭載基板161の主面161aはケース110の前面と対向し、レセプタクル搭載基板162の副面162bは、シャーシ150の前後分割壁152と対向する。MCU搭載基板161及びレセプタクル搭載基板162に搭載される素子及びICについては後述する。 For the sake of convenience, the MCU mounting board 161 and the receptacle mounting board 162 have main surfaces 161a and 162a that face forward, and secondary surfaces 161b and 162b that are opposite to the main surfaces 161a and 162a. and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined gap therebetween. A main surface 161 a of the MCU mounting board 161 faces the front surface of the case 110 , and a secondary surface 162 b of the receptacle mounting board 162 faces the front and rear dividing walls 152 of the chassis 150 . Elements and ICs mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described later.
 LED搭載基板163は、シャーシ本体151の左側面、且つ上下に配置された2つのマグネット124の間に配置される。LED搭載基板163の素子配置面は、上下方向及び前後方向に沿って配置されている。換言すると、MCU搭載基板161及びレセプタクル搭載基板162それぞれの素子配置面と、LED搭載基板163の素子配置面とは、直交している。このように、MCU搭載基板161及びレセプタクル搭載基板162それぞれの素子配置面と、LED搭載基板163の素子配置面とは、直交に限らず、交差している(非平行である)ことが好ましい。なお、LED L1~L8とともに通知部180を構成する振動モータMは、シャーシ下壁155の下面に固定され、MCU搭載基板161に電気的に接続される。 The LED mounting board 163 is arranged on the left side of the chassis body 151 and between the two magnets 124 arranged vertically. The element mounting surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-rear direction. In other words, the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element mounting surface of the LED mounting board 163 . In this way, the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 and the element mounting surface of the LED mounting board 163 are not limited to being orthogonal, but preferably intersect (non-parallel). The vibration motor M, which forms the notification unit 180 together with the LEDs L1 to L8, is fixed to the bottom surface of the chassis bottom wall 155 and electrically connected to the MCU mounting board 161. FIG.
 ホールIC搭載基板164は、シャーシ上壁154の上面に配置される。 The Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154 .
<吸引器の動作モード>
 図9は、吸引器100の動作モードを説明するための模式図である。図9に示すように、吸引器100の動作モードには、充電モード、スリープモード、アクティブモード、加熱初期設定モード、加熱モード、及び加熱終了モードが含まれる。
<Operation mode of the aspirator>
FIG. 9 is a schematic diagram for explaining the operation modes of the aspirator 100. As shown in FIG. As shown in FIG. 9, the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initialization mode, heating mode, and heating termination mode.
 スリープモードは、主にヒータHTRの加熱制御に必要な電子部品への電力供給を停止して省電力化を図るモードである。 The sleep mode is a mode for saving power by stopping the power supply to the electronic parts required for heating control of the heater HTR.
 アクティブモードは、ヒータHTRの加熱制御を除くほとんどの機能が有効になるモードである。吸引器100は、スリープモードにて動作している状態にて、スライダ119が開かれると、動作モードをアクティブモードに切り替える。吸引器100は、アクティブモードにて動作している状態にて、スライダ119が閉じられたり、操作スイッチOPSの無操作時間が所定時間に達したりすると、動作モードをスリープモードに切り替える。 The active mode is a mode in which most functions except heating control of the heater HTR are enabled. When the slider 119 is opened while the suction device 100 is operating in the sleep mode, the operation mode is switched to the active mode. When the slider 119 is closed or the non-operating time of the operation switch OPS reaches a predetermined time while the aspirator 100 is operating in the active mode, the operating mode is switched to the sleep mode.
 加熱初期設定モードは、ヒータHTRの加熱制御を開始するための制御パラメータ等の初期設定を行うモードである。吸引器100は、アクティブモードにて動作している状態にて、操作スイッチOPSの操作を検出すると、動作モードを加熱初期設定モードに切り替え、初期設定が終了すると、動作モードを加熱モードに切り替える。 The heating initial setting mode is a mode for initializing control parameters and the like for starting heating control of the heater HTR. When the aspirator 100 detects the operation of the operation switch OPS while operating in the active mode, it switches the operation mode to the heating initial setting mode, and when the initial setting is completed, switches the operation mode to the heating mode.
 加熱モードは、ヒータHTRの加熱制御(エアロゾル生成のための加熱制御と、温度検出のための加熱制御)を実行するモードである。吸引器100は、動作モードが加熱モードに切り替わると、ヒータHTRの加熱制御を開始する。 The heating mode is a mode that executes heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection). The aspirator 100 starts heating control of the heater HTR when the operation mode is switched to the heating mode.
 加熱終了モードは、ヒータHTRの加熱制御の終了処理(加熱履歴の記憶処理等)を実行するモードである。吸引器100は、加熱モードにて動作している状態にて、ヒータHTRへの通電時間又はユーザの吸引回数が上限に達したり、スライダ119が閉じられたりすると、動作モードを加熱終了モードに切り替え、終了処理が終了すると、動作モードをアクティブモードに切り替える。吸引器100は、加熱モードにて動作している状態にて、USB接続がなされると、動作モードを加熱終了モードに切り替え、終了処理が終了すると、動作モードを充電モードに切り替える。図9に示したように、この場合において、動作モードを充電モードに切り替える前に、動作モードをアクティブモードへ切り替えてもよい。換言すれば、吸引器100は、加熱モードにて動作している状態にて、USB接続がなされると、動作モードを加熱終了モード、アクティブモード、充電モードの順に切り替えてもよい。 The heating end mode is a mode for executing heating control end processing (heating history storage processing, etc.) of the heater HTR. In a state in which the suction device 100 is operating in the heating mode, when the energization time of the heater HTR or the number of times of suction by the user reaches the upper limit, or when the slider 119 is closed, the operation mode is switched to the heating end mode. , when the termination process is completed, the operation mode is switched to the active mode. When the USB connection is established while the aspirator 100 is operating in the heating mode, the operating mode is switched to the heating end mode, and when the end processing is completed, the operating mode is switched to the charging mode. As shown in FIG. 9, in this case, the operating mode may be switched to the active mode before switching the operating mode to the charging mode. In other words, the aspirator 100 may switch the operation mode in order of the heating end mode, the active mode, and the charging mode when the USB connection is made while operating in the heating mode.
 充電モードは、レセプタクルRCPに接続された外部電源から供給される電力により、電源BATの充電を行うモードである。吸引器100は、スリープモード又はアクティブモードにて動作している状態にて、レセプタクルRCPに外部電源が接続(USB接続)されると、動作モードを充電モードに切り替える。吸引器100は、充電モードにて動作している状態にて、電源BATの充電が完了したり、レセプタクルRCPと外部電源との接続が解除されたりすると、動作モードをスリープモードに切り替える。 The charging mode is a mode in which the power supply BAT is charged with power supplied from an external power supply connected to the receptacle RCP. The aspirator 100 switches the operation mode to the charge mode when an external power source is connected (USB connection) to the receptacle RCP while operating in sleep mode or active mode. The aspirator 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released while operating in the charging mode.
<内部ユニットの回路の概略>
 図10、図11、及び図12は、内部ユニット140の電気回路の概略構成を示す図である。図11は、図10に示す電気回路のうち、MCU搭載基板161に搭載される範囲161A(太い破線で囲まれた範囲)と、LED搭載基板163に搭載される範囲163A(太い実線で囲まれた範囲)とを追加した点を除いては、図10と同じである。図12は、図10に示す電気回路のうち、レセプタクル搭載基板162に搭載される範囲162Aと、ホールIC搭載基板164に搭載される範囲164Aとを追加した点を除いては、図10と同じである。
<Outline of internal unit circuit>
10, 11, and 12 are diagrams showing the schematic configuration of the electric circuit of the internal unit 140. FIG. 11 shows a range 161A mounted on the MCU mounting board 161 (range surrounded by thick dashed lines) and a range 163A mounted on the LED mounting board 163 (range surrounded by thick solid lines) in the electric circuit shown in FIG. It is the same as FIG. 12 is the same as FIG. 10 except that a range 162A mounted on the receptacle mounting board 162 and a range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. is.
 図10において太い実線で示した配線は、内部ユニット140の基準となる電位(グランド電位)と同電位となる配線(内部ユニット140に設けられたグランドに接続される配線)であり、この配線を以下ではグランドラインと記載する。図10では、複数の回路素子をチップ化した電子部品を矩形で示しており、この矩形の内側に各種端子の符号を記載している。チップに搭載される電源端子VCC及び電源端子VDDは、それぞれ、高電位側の電源端子を示す。チップに搭載される電源端子VSS及びグランド端子GNDは、それぞれ、低電位側(基準電位側)の電源端子を示す。チップ化された電子部品は、高電位側の電源端子の電位と低電位側の電源端子の電位の差分が、電源電圧となる。チップ化された電子部品は、この電源電圧を用いて、各種機能を実行する。 The wiring indicated by the thick solid line in FIG. 10 is the wiring (the wiring connected to the ground provided in the internal unit 140) that has the same potential as the reference potential (ground potential) of the internal unit 140. It is described as a ground line below. In FIG. 10, an electronic component in which a plurality of circuit elements are chipped is indicated by a rectangle, and the symbols of various terminals are indicated inside the rectangle. A power supply terminal VCC and a power supply terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively. A power supply terminal VSS and a ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side). In a chipped electronic component, the power supply voltage is the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side. Chipped electronic components use this power supply voltage to perform various functions.
 図11に示すように、MCU搭載基板161(範囲161A)には、主要な電子部品として、吸引器100の全体を統括制御するMCU1と、電源BATの充電制御を行う充電IC2と、コンデンサ、抵抗器、及びトランジスタ等を組み合わせて構成されたロードスイッチ(以下、LSW)3,4,5と、ROM(Read Only Memory)6と、スイッチドライバ7と、昇降圧DC/DCコンバータ8(図では、昇降圧DC/DC8と記載)と、オペアンプOP2と、オペアンプOP3と、フリップフロップ(以下、FF)16,17と、吸気センサを構成するサーミスタT2と電気的に接続されるコネクタCn(t2)(図では、このコネクタに接続されたサーミスタT2を記載)と、ヒータ温度センサを構成するサーミスタT3と電気的に接続されるコネクタCn(t3)(図では、このコネクタに接続されたサーミスタT3を記載)と、ケース温度センサを構成するサーミスタT4と電気的に接続されるコネクタCn(t4)(図では、このコネクタに接続されたサーミスタT4を記載)と、USB接続検出用の分圧回路Pcと、が設けられている。 As shown in FIG. 11, the MCU-mounted board 161 (range 161A) includes, as main electronic components, an MCU1 that controls the entire sucker 100, a charging IC2 that controls charging of the power source BAT, a capacitor, a resistor load switches (hereinafter referred to as LSW) 3, 4, 5, a ROM (Read Only Memory) 6, a switch driver 7, and a step-up/step-down DC/DC converter 8 (in the figure, buck-boost DC/DC 8), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16, 17, connector Cn (t2) (which is electrically connected to thermistor T2 constituting an intake sensor) ( The figure shows the thermistor T2 connected to this connector), and a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (the figure shows the thermistor T3 connected to this connector). ), a connector Cn (t4) electrically connected to the thermistor T4 constituting the case temperature sensor (in the drawing, the thermistor T4 connected to this connector is shown), and a voltage dividing circuit Pc for detecting USB connection. , is provided.
 充電IC2、LSW3、LSW4、LSW5、スイッチドライバ7、昇降圧DC/DCコンバータ8、FF16、及びFF17の各々のグランド端子GNDは、グランドラインに接続されている。ROM6の電源端子VSSは、グランドラインに接続されている。オペアンプOP2及びオペアンプOP3の各々の負電源端子は、グランドラインに接続されている。 A ground terminal GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, step-up/step-down DC/DC converter 8, FF16, and FF17 is connected to a ground line. A power terminal VSS of the ROM 6 is connected to the ground line. A negative power supply terminal of each of the operational amplifiers OP2 and OP3 is connected to the ground line.
 図11に示すように、LED搭載基板163(範囲163A)には、主要な電子部品として、パネル検出センサを構成するホール素子を含むホールIC13と、LED L1~L8と、操作スイッチOPSと、通信IC15と、が設けられている。通信IC15は、スマートフォン等の電子機器との通信を行うための通信モジュールである。ホールIC13の電源端子VSS及び通信IC15のグランド端子GNDの各々は、グランドラインに接続されている。通信IC15とMCU1は、通信線LNによって通信可能に構成されている。操作スイッチOPSの一端はグランドラインに接続され、操作スイッチOPSの他端はMCU1の端子P4に接続されている。 As shown in FIG. 11, the LED mounting board 163 (area 163A) has, as main electronic components, a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, a communication IC 15 and are provided. The communication IC 15 is a communication module for communicating with electronic devices such as smartphones. A power supply terminal VSS of the Hall IC 13 and a ground terminal GND of the communication IC 15 are each connected to a ground line. Communication IC 15 and MCU 1 are configured to be communicable via communication line LN. One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.
 図12に示すように、レセプタクル搭載基板162(範囲162A)には、主要な電子部品として、電源BATと電気的に接続される電源コネクタ(図では、この電源コネクタに接続された電源BATを記載)と、電源温度センサを構成するサーミスタT1と電気的に接続されるコネクタ(図では、このコネクタに接続されたサーミスタT1を記載)と、昇圧DC/DCコンバータ9(図では、昇圧DC/DC9と記載)と、保護IC10と、過電圧保護IC11と、残量計IC12と、レセプタクルRCPと、MOSFETで構成されたスイッチS3~スイッチS6と、オペアンプOP1と、ヒータHTRと電気的に接続される一対(正極側と負極側)のヒータコネクタCnと、が設けられている。 As shown in FIG. 12, the receptacle mounting board 162 (range 162A) includes a power connector electrically connected to the power supply BAT as a main electronic component (in the figure, the power supply BAT connected to this power connector is shown). ), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown), and a boost DC/DC converter 9 (in the figure, a boost DC/DC 9 ), the protection IC 10, the overvoltage protection IC 11, the fuel gauge IC 12, the receptacle RCP, the switches S3 to S6 configured by MOSFETs, the operational amplifier OP1, and the heater HTR. (positive electrode side and negative electrode side) heater connectors Cn are provided.
 レセプタクルRCPの2つのグランド端子GNDと、昇圧DC/DCコンバータ9のグランド端子GNDと、保護IC10の電源端子VSSと、残量計IC12の電源端子VSSと、過電圧保護IC11のグランド端子GNDと、オペアンプOP1の負電源端子は、それぞれ、グランドラインに接続されている。 Two ground terminals GND of receptacle RCP, ground terminal GND of step-up DC/DC converter 9, power supply terminal VSS of protection IC 10, power supply terminal VSS of fuel gauge IC 12, ground terminal GND of overvoltage protection IC 11, and operational amplifier The negative power supply terminals of OP1 are each connected to the ground line.
 図12に示すように、ホールIC搭載基板164(範囲164A)には、カバー位置センサを構成するホール素子を含むホールIC14が設けられている。ホールIC14の電源端子VSSは、グランドラインに接続されている。ホールIC14の出力端子OUTは、MCU1の端子P8に接続されている。MCU1は、端子P8に入力される信号により、スライダ119の開閉を検出する。 As shown in FIG. 12, the Hall IC mounting substrate 164 (area 164A) is provided with a Hall IC 14 including a Hall element that constitutes a cover position sensor. A power terminal VSS of the Hall IC 14 is connected to the ground line. The output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU1. The MCU1 detects opening/closing of the slider 119 from a signal input to the terminal P8.
 図11に示すように、振動モータMと電気的に接続されるコネクタは、MCU搭載基板161に設けられている。 As shown in FIG. 11, a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161 .
<内部ユニットの回路の詳細>
 以下、図10を参照しながら各電子部品の接続関係等について説明する。
<Details of internal unit circuit>
The connection relationship and the like of each electronic component will be described below with reference to FIG. 10 .
 レセプタクルRCPの2つの電源入力端子VBUSは、それぞれ、ヒューズFsを介して、過電圧保護IC11の入力端子INに接続されている。レセプタクルRCPにUSBプラグが接続され、このUSBプラグを含むUSBケーブルが外部電源に接続されると、レセプタクルRCPの2つの電源入力端子VBUSにUSB電圧VUSBが供給される。 The two power supply input terminals V BUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC11 via a fuse Fs. When a USB plug is connected to the receptacle RCP and a USB cable including this USB plug is connected to an external power supply, the USB voltage V USB is supplied to the two power input terminals V BUS of the receptacle RCP.
 過電圧保護IC11の入力端子INには、2つの抵抗器の直列回路からなる分圧回路Paの一端が接続されている。分圧回路Paの他端はグランドラインに接続されている。分圧回路Paを構成する2つの抵抗器の接続点は、過電圧保護IC11の電圧検出端子OVLoに接続されている。過電圧保護IC11は、電圧検出端子OVLoに入力される電圧が閾値未満の状態では、入力端子INに入力された電圧を出力端子OUTから出力する。過電圧保護IC11は、電圧検出端子OVLoに入力される電圧が閾値以上(過電圧)となった場合には、出力端子OUTからの電圧出力を停止(LSW3とレセプタクルRCPとの電気的な接続を遮断)することで、過電圧保護IC11よりも下流の電子部品の保護を図る。過電圧保護IC11の出力端子OUTは、LSW3の入力端子VINと、MCU1に接続された分圧回路Pc(2つの抵抗器の直列回路)の一端と、に接続されている。分圧回路Pcの他端はグランドラインに接続されている。分圧回路Pcを構成する2つの抵抗器の接続点は、MCU1の端子P17に接続されている。 An input terminal IN of the overvoltage protection IC 11 is connected to one end of a voltage dividing circuit Pa consisting of a series circuit of two resistors. The other end of the voltage dividing circuit Pa is connected to the ground line. A connection point between the two resistors forming the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. The overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold. The overvoltage protection IC 11 stops voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected. The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of the voltage dividing circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. A connection point of the two resistors forming the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.
 LSW3の入力端子VINには、2つの抵抗器の直列回路からなる分圧回路Pfの一端が接続されている。分圧回路Pfの他端はグランドラインに接続されている。分圧回路Pfを構成する2つの抵抗器の接続点は、LSW3の制御端子ONに接続されている。LSW3の制御端子ONには、バイポーラトランジスタS2のコレクタ端子が接続されている。バイポーラトランジスタS2のエミッタ端子はグランドラインに接続されている。バイポーラトランジスタS2のベース端子は、MCU1の端子P19に接続されている。LSW3は、制御端子ONに入力される信号がハイレベルになると、入力端子VINに入力された電圧を出力端子VOUTから出力する。LSW3の出力端子VOUTは、充電IC2の入力端子VBUSに接続されている。MCU1は、USB接続がなされていない間は、バイポーラトランジスタS2をオンにする。これにより、LSW3の制御端子ONはバイポーラトランジスタS2を介してグランドラインへ接続されるため、LSW3の制御端子ONにはローレベルの信号が入力される。
 LSW3に接続されたバイポーラトランジスタS2は、USB接続がなされると、MCU1によってオフされる。バイポーラトランジスタS2がオフすることで、分圧回路Pfによって分圧されたUSB電圧VUSBがLSW3の制御端子ONに入力される。このため、USB接続がなされ且つバイポーラトランジスタS2がオフされると、LSW3の制御端子ONには、ハイレベルの信号が入力される。これにより、LSW3は、USBケーブルから供給されるUSB電圧VUSBを出力端子VOUTから出力する。なお、バイポーラトランジスタS2がオフされていない状態でUSB接続がなされても、LSW3の制御端子ONは、バイポーラトランジスタS2を介してグランドラインへ接続されている。このため、MCU1がバイポーラトランジスタS2をオフしない限り、LSW3の制御端子ONにはローレベルの信号が入力され続ける点に留意されたい。
An input terminal VIN of LSW3 is connected to one end of a voltage dividing circuit Pf consisting of a series circuit of two resistors. The other end of the voltage dividing circuit Pf is connected to the ground line. A connection point between the two resistors forming the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3. The collector terminal of the bipolar transistor S2 is connected to the control terminal ON of LSW3. The emitter terminal of the bipolar transistor S2 is connected to the ground line. The base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1. When the signal input to the control terminal ON becomes high level, the LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2. The MCU1 turns on the bipolar transistor S2 while the USB connection is not made. As a result, the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2, so that a low level signal is input to the control terminal ON of LSW3.
The bipolar transistor S2 connected to LSW3 is turned off by MCU1 when the USB connection is made. By turning off the bipolar transistor S2, the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3. As a result, the LSW 3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of LSW3 unless MCU1 turns off bipolar transistor S2.
 電源BATの正極端子は、保護IC10の電源端子VDDと、昇圧DC/DCコンバータ9の入力端子VINと、充電IC2の充電端子batと、に接続されている。したがって、電源BATの電源電圧VBATは、保護IC10と、充電IC2と、昇圧DC/DCコンバータ9とに供給される。電源BATの負極端子には、抵抗器Raと、MOSFETで構成されたスイッチSaと、MOSFETで構成されたスイッチSbと、抵抗器Rbと、がこの順に直列接続されている。抵抗器RaとスイッチSaの接続点には、保護IC10の電流検出端子CSが接続されている。スイッチSaとスイッチSbの各々の制御端子は、保護IC10に接続されている。抵抗器Rbの両端は、残量計IC12に接続されている。 The positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V BAT of the power supply BAT is supplied to the protection IC 10 , the charging IC 2 and the step-up DC/DC converter 9 . A resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT. A current detection terminal CS of the protection IC 10 is connected to a connection point between the resistor Ra and the switch Sa. Control terminals of the switches Sa and Sb are connected to the protection IC 10 . Both ends of the resistor Rb are connected to the fuel gauge IC12.
 保護IC10は、電流検出端子CSに入力される電圧から、電源BATの充放電時において抵抗器Raに流れる電流値を取得し、この電流値が過大になった場合(過電流)に、スイッチSaとスイッチSbの開閉制御を行って、電源BATの充電又は放電を停止させることで、電源BATの保護を図る。より具体的には、保護IC10は、電源BATの充電時に過大な電流値を取得した場合には、スイッチSbをオフすることで、電源BATの充電を停止させる。保護IC10は、電源BATの放電時に過大な電流値を取得した場合には、スイッチSaをオフすることで、電源BATの放電を停止させる。また、保護IC10は、電源端子VDDに入力される電圧から、電源BATの電圧値が異常になった場合(過充電又は過電圧の場合)に、スイッチSaとスイッチSbの開閉制御を行って、電源BATの充電又は放電を停止させることで、電源BATの保護を図る。より具体的には、保護IC10は、電源BATの過充電を検知した場合には、スイッチSbをオフすることで、電源BATの充電を停止させる。保護IC10は、電源BATの過放電を検知した場合には、スイッチSaをオフすることで、電源BATの放電を停止させる。 The protection IC 10 acquires the value of the current flowing through the resistor Ra during charging and discharging of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), the switch Sa , the switch Sb is controlled to open and close to stop the charging or discharging of the power source BAT, thereby protecting the power source BAT. More specifically, when the protection IC 10 acquires an excessive current value while charging the power supply BAT, it stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value during discharging of the power supply BAT, the protection IC 10 stops discharging the power supply BAT by turning off the switch Sa. In addition, when the voltage value of the power supply BAT becomes abnormal from the voltage input to the power supply terminal VDD (in the case of overcharge or overvoltage), the protection IC 10 performs opening/closing control of the switch Sa and the switch Sb to The power supply BAT is protected by stopping the charging or discharging of BAT. More specifically, when the protection IC 10 detects that the power supply BAT is overcharged, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When detecting overdischarge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.
 電源BATの近傍に配置されたサーミスタT1と接続されるコネクタには抵抗器Rt1が接続されている。抵抗器Rt1とサーミスタT1の直列回路は、グランドラインと、残量計IC12のレギュレータ端子TREGとに接続されている。サーミスタT1と抵抗器Rt1の接続点は、残量計IC12のサーミスタ端子THMに接続されている。サーミスタT1は、温度の増加に従い抵抗値が増大するPTC(Positive Temperature Coefficient)サーミスタであってもよいし、温度の増加に従い抵抗値が減少するNTC(Negative Temperature Coefficient)サーミスタでもよい。 A resistor Rt1 is connected to a connector connected to the thermistor T1 arranged near the power supply BAT. A series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12. A connection point between the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the fuel gauge IC12. The thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.
 残量計IC12は、抵抗器Rbに流れる電流を検出し、検出した電流値に基づいて、電源BATの残容量、充電状態を示すSOC(State Of Charge)、及び健全状態を示すSOH(State Of Health)等のバッテリ情報を導出する。残量計IC12は、レギュレータ端子TREGに接続される内蔵レギュレータから、サーミスタT1と抵抗器Rt1の分圧回路に電圧を供給する。残量計IC12は、この分圧回路によって分圧された電圧をサーミスタ端子THMから取得し、この電圧に基づいて、電源BATの温度に関する温度情報を取得する。残量計IC12は、シリアル通信を行うための通信線LNによってMCU1と接続されており、MCU1と通信可能に構成されている。残量計IC12は、導出したバッテリ情報と、取得した電源BATの温度情報を、MCU1からの要求に応じて、MCU1に送信する。なお、シリアル通信を行うためには、データ送信用のデータラインや同期用のクロックラインなどの複数の信号線が必要になる。図10-図19では、簡略化のため、1本の信号線のみが図示されている点に留意されたい。 The fuel gauge IC 12 detects the current flowing through the resistor Rb, and based on the detected current value, indicates the remaining capacity of the power supply BAT, SOC (State Of Charge) indicating the state of charge, and SOH (State Of Charge) indicating the state of health. Health) and other battery information. The fuel gauge IC12 supplies a voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG. The fuel gauge IC 12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage. The fuel gauge IC12 is connected to the MCU1 via a communication line LN for serial communication, and is configured to be able to communicate with the MCU1. The fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1. Note that serial communication requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that only one signal line is shown in FIGS. 10-19 for simplicity.
 残量計IC12は、通知端子12aを備えている。通知端子12aは、MCU1の端子P6と、後述するダイオードD2のカソードと、に接続されている。残量計IC12は、電源BATの温度が過大になった等の異常を検出すると、通知端子12aからローレベルの信号を出力することで、その異常発生をMCU1に通知する。このローレベルの信号は、ダイオードD2を経由して、FF17のCLR( ̄)端子にも入力される。 The fuel gauge IC 12 has a notification terminal 12a. The notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of a diode D2, which will be described later. When the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it notifies the MCU 1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low level signal is also input to the CLR (~) terminal of the FF 17 via the diode D2.
 昇圧DC/DCコンバータ9のスイッチング端子SWには、リアクトルLcの一端が接続されている。このリアクトルLcの他端は昇圧DC/DCコンバータ9の入力端子VINに接続されている。昇圧DC/DCコンバータ9は、スイッチング端子SWに接続された内蔵トランジスタのオンオフ制御を行うことで、入力された電圧を昇圧して、出力端子VOUTから出力する。なお、昇圧DC/DCコンバータ9の入力端子VINは、昇圧DC/DCコンバータ9の高電位側の電源端子を構成している。昇圧DC/DCコンバータ9は、イネーブル端子ENに入力される信号がハイレベルとなっている場合に、昇圧動作を行う。USB接続されている状態においては、昇圧DC/DCコンバータ9のイネーブル端子ENに入力される信号は、MCU1によってローレベルに制御されてもよい。若しくは、USB接続されている状態においては、昇圧DC/DCコンバータ9のイネーブル端子ENに入力される信号をMCU1が制御しないことで、イネーブル端子ENの電位を不定にしてもよい。 One end of the reactor Lc is connected to the switching terminal SW of the step-up DC/DC converter 9 . The other end of this reactor Lc is connected to the input terminal VIN of the step-up DC/DC converter 9 . The step-up DC/DC converter 9 performs on/off control of the built-in transistor connected to the switching terminal SW to step up the input voltage and output it from the output terminal VOUT. The input terminal VIN of the step-up DC/DC converter 9 constitutes a power supply terminal of the step-up DC/DC converter 9 on the high potential side. The boost DC/DC converter 9 performs a boost operation when the signal input to the enable terminal EN is at high level. In the USB-connected state, the signal input to the enable terminal EN of the boost DC/DC converter 9 may be controlled to be low level by the MCU1. Alternatively, in the USB-connected state, the MCU 1 does not control the signal input to the enable terminal EN of the boost DC/DC converter 9, so that the potential of the enable terminal EN may be made indefinite.
 昇圧DC/DCコンバータ9の出力端子VOUTには、Pチャネル型MOSFETにより構成されたスイッチS4のソース端子が接続されている。スイッチS4のゲート端子は、MCU1の端子P15と接続されている。スイッチS4のドレイン端子には、抵抗器Rsの一端が接続されている。抵抗器Rsの他端は、ヒータHTRの一端と接続される正極側のヒータコネクタCnに接続されている。スイッチS4と抵抗器Rsの接続点には、2つの抵抗器からなる分圧回路Pbが接続されている。分圧回路Pbを構成する2つの抵抗器の接続点は、MCU1の端子P18と接続されている。スイッチS4と抵抗器Rsの接続点は、更に、オペアンプOP1の正電源端子と接続されている。 The output terminal VOUT of the step-up DC/DC converter 9 is connected to the source terminal of the switch S4 composed of a P-channel MOSFET. The gate terminal of switch S4 is connected to terminal P15 of MCU1. One end of the resistor Rs is connected to the drain terminal of the switch S4. The other end of the resistor Rs is connected to a positive heater connector Cn connected to one end of the heater HTR. A voltage dividing circuit Pb consisting of two resistors is connected to the connection point between the switch S4 and the resistor Rs. A connection point of the two resistors forming the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1. A connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.
 昇圧DC/DCコンバータ9の出力端子VOUTとスイッチS4のソース端子との接続ラインには、Pチャネル型MOSFETにより構成されたスイッチS3のソース端子が接続されている。スイッチS3のゲート端子は、MCU1の端子P16と接続されている。スイッチS3のドレイン端子は、抵抗器Rsと正極側のヒータコネクタCnとの接続ラインに接続されている。このように、昇圧DC/DCコンバータ9の出力端子VOUTとヒータコネクタCnの正極側との間には、スイッチS3を含む回路と、スイッチS4及び抵抗器Rsを含む回路とが並列接続されている。スイッチS3を含む回路は、抵抗器を有さないため、スイッチS4及び抵抗器Rsを含む回路よりも低抵抗の回路である。 A connection line between the output terminal VOUT of the step-up DC/DC converter 9 and the source terminal of the switch S4 is connected to the source terminal of the switch S3 composed of a P-channel MOSFET. The gate terminal of switch S3 is connected to terminal P16 of MCU1. A drain terminal of the switch S3 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side. Thus, a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC/DC converter 9 and the positive electrode side of the heater connector Cn. . Since the circuit including the switch S3 does not have a resistor, it has a lower resistance than the circuit including the switch S4 and the resistor Rs.
 オペアンプOP1の非反転入力端子は、抵抗器Rsと正極側のヒータコネクタCnとの接続ラインに接続されている。オペアンプOP1の反転入力端子は、ヒータHTRの他端と接続される負極側のヒータコネクタCnと、Nチャネル型MOSFETにより構成されたスイッチS6のドレイン端子と、に接続されている。スイッチS6のソース端子はグランドラインに接続されている。スイッチS6のゲート端子は、MCU1の端子P14と、ダイオードD4のアノードと、昇圧DC/DCコンバータ9のイネーブル端子ENと、に接続されている。ダイオードD4のカソードは、FF17のQ端子と接続されている。オペアンプOP1の出力端子には抵抗器R4の一端が接続されている。抵抗器R4の他端は、MCU1の端子P9と、Nチャネル型MOSFETにより構成されたスイッチS5のドレイン端子と、に接続されている。スイッチS5のソース端子は、グランドラインに接続されている。スイッチS5のゲート端子は、抵抗器Rsと正極側のヒータコネクタCnとの接続ラインに接続されている。 The non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side. The inverting input terminal of the operational amplifier OP1 is connected to the negative heater connector Cn connected to the other end of the heater HTR and to the drain terminal of the switch S6 composed of an N-channel MOSFET. The source terminal of switch S6 is connected to the ground line. A gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the step-up DC/DC converter 9. The cathode of diode D4 is connected to the Q terminal of FF17. One end of a resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. A source terminal of the switch S5 is connected to the ground line. A gate terminal of the switch S5 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
 充電IC2の入力端子VBUSは、LED L1~L8の各々のアノードに接続されている。LED L1~L8の各々のカソードは、電流制限ための抵抗器を介して、MCU1の制御端子PD1~PD8に接続されている。すなわち、入力端子VBUSには、LED L1~L8が並列接続されている。LED L1~L8は、レセプタクルRCPに接続されたUSBケーブルから供給されるUSB電圧VUSBと、電源BATから充電IC2を経由して供給される電圧と、のそれぞれによって動作可能に構成されている。MCU1には、制御端子PD1~制御端子PD8の各々とグランド端子GNDとに接続されたトランジスタ(スイッチング素子)が内蔵されている。MCU1は、制御端子PD1と接続されたトランジスタをオンすることでLED L1に通電してこれを点灯させ、制御端子PD1と接続されたトランジスタをオフすることでLED L1を消灯させる。制御端子PD1と接続されたトランジスタのオンとオフを高速で切り替えることで、LED L1の輝度や発光パターンを動的に制御できる。LED L2~L8についても同様にMCU1によって点灯制御される。 The input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1-L8. The cathodes of the LEDs L1-L8 are connected to the control terminals PD1-PD8 of the MCU1 via current limiting resistors. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2. The MCU 1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND. The MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to light it, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1. By switching on and off the transistor connected to the control terminal PD1 at high speed, the brightness and light emission pattern of the LED L1 can be dynamically controlled. LEDs L2 to L8 are similarly controlled by the MCU1.
 充電IC2は、入力端子VBUSに入力されるUSB電圧VUSBに基づいて電源BATを充電する充電機能を備える。充電IC2は、不図示の端子や配線から、電源BATの充電電流や充電電圧を取得し、これらに基づいて、電源BATの充電制御(充電端子batから電源BATへの電力供給制御)を行う。また、充電IC2は、残量計IC12からMCU1に送信された電源BATの温度情報を、通信線LNを利用したシリアル通信によってMCU1から取得し、充電制御に利用してもよい。 The charging IC2 has a charging function of charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS. The charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wiring (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Also, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 through serial communication using the communication line LN, and use it for charging control.
 充電IC2は、更に、VBATパワーパス機能と、OTG機能とを備える。VBATパワーパス機能は、充電端子batに入力される電源電圧VBATと略一致するシステム電源電圧Vcc0を、出力端子SYSから出力する機能である。OTG機能は、充電端子batに入力される電源電圧VBATを昇圧して得られるシステム電源電圧Vcc4を、入力端子VBUSから出力する機能である。充電IC2のOTG機能のオンオフは、通信線LNを利用したシリアル通信によって、MCU1により制御される。なお、OTG機能においては、充電端子batに入力される電源電圧VBATを、入力端子VBUSからそのまま出力してもよい。この場合において、電源電圧VBATとシステム電源電圧Vcc4は略一致する。 The charging IC2 further comprises a V BAT power pass function and an OTG function. The V BAT power pass function is a function of outputting from the output terminal SYS a system power supply voltage Vcc0 substantially matching the power supply voltage V BAT input to the charging terminal bat. The OTG function is a function for outputting from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat. ON/OFF of the OTG function of the charging IC 2 is controlled by the MCU 1 through serial communication using the communication line LN. In addition, in the OTG function, the power supply voltage V BAT input to the charging terminal bat may be directly output from the input terminal VBUS. In this case, power supply voltage VBAT and system power supply voltage Vcc4 are substantially the same.
 充電IC2の出力端子SYSは、昇降圧DC/DCコンバータ8の入力端子VINに接続されている。充電IC2のスイッチング端子SWにはリアクトルLaの一端が接続されている。リアクトルLaの他端は、充電IC2の出力端子SYSに接続されている。充電IC2の充電イネーブル端子CE( ̄)は、抵抗器を介して、MCU1の端子P22に接続されている。更に、充電IC2の充電イネーブル端子CE( ̄)には、バイポーラトランジスタS1のコレクタ端子が接続されている。バイポーラトランジスタS1のエミッタ端子は、後述のLSW4の出力端子VOUTに接続されている。バイポーラトランジスタS1のベース端子は、FF17のQ端子に接続されている。更に、充電IC2の充電イネーブル端子CE( ̄)には、抵抗器Rcの一端が接続されている。抵抗器Rcの他端は、LSW4の出力端子VOUTに接続されている。 The output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the step-up/step-down DC/DC converter 8 . One end of a reactor La is connected to the switching terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. A charge enable terminal CE (~) of the charge IC2 is connected to a terminal P22 of the MCU1 via a resistor. Furthermore, the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE (~) of the charge IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 which will be described later. The base terminal of bipolar transistor S1 is connected to the Q terminal of FF17. Furthermore, one end of a resistor Rc is connected to the charge enable terminal CE (~) of the charge IC2. The other end of the resistor Rc is connected to the output terminal VOUT of LSW4.
 昇降圧DC/DCコンバータ8の入力端子VINとイネーブル端子ENには抵抗器が接続されている。充電IC2の出力端子SYSから、昇降圧DC/DCコンバータ8の入力端子VINにシステム電源電圧Vcc0が入力されることで、昇降圧DC/DCコンバータ8のイネーブル端子ENに入力される信号はハイレベルとなり、昇降圧DC/DCコンバータ8は昇圧動作又は降圧動作を開始する。昇降圧DC/DCコンバータ8は、リアクトルLbに接続された内蔵トランジスタのスイッチング制御により、入力端子VINに入力されたシステム電源電圧Vcc0を昇圧又は降圧してシステム電源電圧Vcc1を生成し、出力端子VOUTから出力する。昇降圧DC/DCコンバータ8の出力端子VOUTは、昇降圧DC/DCコンバータ8のフィードバック端子FBと、LSW4の入力端子VINと、スイッチドライバ7の入力端子VINと、FF16の電源端子VCC及びD端子と、に接続されている。昇降圧DC/DCコンバータ8の出力端子VOUTから出力されるシステム電源電圧Vcc1が供給される配線を電源ラインPL1と記載する。 A resistor is connected to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 . By inputting the system power supply voltage Vcc0 from the output terminal SYS of the charging IC 2 to the input terminal VIN of the step-up/step-down DC/DC converter 8, the signal input to the enable terminal EN of the step-up/step-down DC/DC converter 8 is at a high level. Then, the step-up/step-down DC/DC converter 8 starts step-up operation or step-down operation. The step-up/step-down DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1, and the output terminal VOUT. Output from The output terminal VOUT of the buck-boost DC/DC converter 8 includes the feedback terminal FB of the buck-boost DC/DC converter 8, the input terminal VIN of the LSW 4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF 16. and connected to A wiring to which system power supply voltage Vcc1 output from output terminal VOUT of step-up/step-down DC/DC converter 8 is supplied is referred to as power supply line PL1.
 LSW4は、制御端子ONに入力される信号がハイレベルになると、入力端子VINに入力されているシステム電源電圧Vcc1を出力端子VOUTから出力する。LSW4の制御端子ONと電源ラインPL1は、抵抗器を介して接続されている。このため、電源ラインPL1にシステム電源電圧Vcc1が供給されることで、LSW4の制御端子ONにはハイレベルの信号が入力される。LSW4が出力する電圧は、配線抵抗等を無視すればシステム電源電圧Vcc1と同一であるが、システム電源電圧Vcc1と区別するために、LSW4の出力端子VOUTから出力される電圧を、以下ではシステム電源電圧Vcc2と記載する。 When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high level signal is input to the control terminal ON of the LSW4. The voltage output from LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored. Described as voltage Vcc2.
 LSW4の出力端子VOUTは、MCU1の電源端子VDDと、LSW5の入力端子VINと、残量計IC12の電源端子VDDと、ROM6の電源端子VCCと、バイポーラトランジスタS1のエミッタ端子と、抵抗器Rcと、FF17の電源端子VCCと、に接続されている。LSW4の出力端子VOUTから出力されるシステム電源電圧Vcc2が供給される配線を電源ラインPL2と記載する。 The output terminal VOUT of the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , and the power supply terminal VCC of the FF 17 . A wiring to which system power supply voltage Vcc2 output from output terminal VOUT of LSW4 is supplied is referred to as power supply line PL2.
 LSW5は、制御端子ONに入力される信号がハイレベルになると、入力端子VINに入力されているシステム電源電圧Vcc2を出力端子VOUTから出力する。LSW5の制御端子ONは、MCU1の端子P23と接続されている。LSW5が出力する電圧は、配線抵抗等を無視すればシステム電源電圧Vcc2と同一であるが、システム電源電圧Vcc2と区別するために、LSW5の出力端子VOUTから出力される電圧を、以下ではシステム電源電圧Vcc3と記載する。LSW5の出力端子VOUTから出力されるシステム電源電圧Vcc3が供給される配線を電源ラインPL3と記載する。 When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT. A control terminal ON of LSW5 is connected to terminal P23 of MCU1. The voltage output from LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored. Described as voltage Vcc3. A wiring to which system power supply voltage Vcc3 output from output terminal VOUT of LSW5 is supplied is referred to as power supply line PL3.
 電源ラインPL3には、サーミスタT2と抵抗器Rt2の直列回路が接続され、抵抗器Rt2はグランドラインに接続されている。サーミスタT2と抵抗器Rt2は分圧回路を構成しており、これらの接続点は、MCU1の端子P21と接続されている。MCU1は、端子P21に入力される電圧に基づいて、サーミスタT2の温度変動(抵抗値変動)を検出し、その温度変動量によって、パフ動作の有無を判定する。 A series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line. The thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of the MCU1. The MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the amount of temperature variation.
 電源ラインPL3には、サーミスタT3と抵抗器Rt3の直列回路が接続され、抵抗器Rt3はグランドラインに接続されている。サーミスタT3と抵抗器Rt3は分圧回路を構成しており、これらの接続点は、MCU1の端子P13と、オペアンプOP2の反転入力端子と、に接続されている。MCU1は、端子P13に入力される電圧に基づいて、サーミスタT3の温度(ヒータHTRの温度に相当)を検出する。 A series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line. The thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of the MCU1 and the inverting input terminal of the operational amplifier OP2. The MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.
 電源ラインPL3には、サーミスタT4と抵抗器Rt4の直列回路が接続され、抵抗器Rt4はグランドラインに接続されている。サーミスタT4と抵抗器Rt4は分圧回路を構成しており、これらの接続点は、MCU1の端子P12と、オペアンプOP3の反転入力端子と、に接続されている。MCU1は、端子P12に入力される電圧に基づいて、サーミスタT4の温度(ケース110の温度に相当)を検出する。 A series circuit of a thermistor T4 and a resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line. The thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and the connection point between them is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3. The MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.
 電源ラインPL2には、MOSFETにより構成されたスイッチS7のソース端子が接続されている。スイッチS7のゲート端子は、MCU1の端子P20に接続されている。スイッチS7のドレイン端子は、振動モータMが接続される一対のコネクタの一方に接続されている。この一対のコネクタの他方はグランドラインに接続されている。MCU1は、端子P20の電位を操作することでスイッチS7の開閉を制御し、振動モータMを特定のパターンで振動させることができる。スイッチS7に代えて、専用のドライバICを用いてもよい。 A source terminal of a switch S7 composed of a MOSFET is connected to the power supply line PL2. The gate terminal of switch S7 is connected to terminal P20 of MCU1. A drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line. The MCU1 can control the opening/closing of the switch S7 by manipulating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern. A dedicated driver IC may be used instead of the switch S7.
 電源ラインPL2には、オペアンプOP2の正電源端子と、オペアンプOP2の非反転入力端子に接続されている分圧回路Pd(2つの抵抗器の直列回路)と、が接続されている。分圧回路Pdを構成する2つの抵抗器の接続点は、オペアンプOP2の非反転入力端子に接続されている。オペアンプOP2は、ヒータHTRの温度に応じた信号(サーミスタT3の抵抗値に応じた信号)を出力する。本実施形態では、サーミスタT3としてNTC特性を持つものを用いているため、ヒータHTRの温度(サーミスタT3の温度)が高いほど、オペアンプOP2の出力電圧は低くなる。これは、オペアンプOP2の負電源端子はグランドラインへ接続されており、オペアンプOP2の反転入力端子に入力される電圧値(サーミスタT3と抵抗器Rt3による分圧値)が、オペアンプOP2の非反転入力端子に入力される電圧値(分圧回路Pdによる分圧値)より高くなると、オペアンプOP2の出力電圧の値は、グランド電位の値と略等しくなるためである。つまり、ヒータHTRの温度(サーミスタT3の温度)が高温になると、オペアンプOP2の出力電圧はローレベルになる。
 なお、サーミスタT3としてPTC特性を持つものを用いる場合には、オペアンプOP2の非反転入力端子に、サーミスタT3及び抵抗器Rt3の分圧回路の出力を接続し、オペアンプOP2の反転入力端子に、分圧回路Pdの出力を接続すればよい。
A positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power supply line PL2. A connection point between the two resistors forming the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (signal corresponding to the resistance value of the thermistor T3). In this embodiment, since the thermistor T3 has the NTC characteristic, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of operational amplifier OP2 is connected to the ground line, and the voltage value input to the inverting input terminal of operational amplifier OP2 (divided voltage value by thermistor T3 and resistor Rt3) is the non-inverting input of operational amplifier OP2. This is because the value of the output voltage of the operational amplifier OP2 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (divided voltage value by the voltage dividing circuit Pd). That is, when the temperature of the heater HTR (the temperature of the thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes low level.
When a thermistor T3 having a PTC characteristic is used, the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 is connected to the non-inverting input terminal of the operational amplifier OP2, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP2. The output of the pressure circuit Pd may be connected.
 電源ラインPL2には、オペアンプOP3の正電源端子と、オペアンプOP3の非反転入力端子に接続されている分圧回路Pe(2つの抵抗器の直列回路)と、が接続されている。分圧回路Peを構成する2つの抵抗器の接続点は、オペアンプOP3の非反転入力端子に接続されている。オペアンプOP3は、ケース110の温度に応じた信号(サーミスタT4の抵抗値に応じた信号)を出力する。本実施形態では、サーミスタT4としてNTC特性を持つものを用いているため、ケース110の温度が高いほど、オペアンプOP3の出力電圧は低くなる。これは、オペアンプOP3の負電源端子はグランドラインへ接続されており、オペアンプOP3の反転入力端子に入力される電圧値(サーミスタT4と抵抗器Rt4による分圧値)が、オペアンプOP3の非反転入力端子に入力される電圧値(分圧回路Peによる分圧値)より高くなると、オペアンプOP3の出力電圧の値は、グランド電位の値と略等しくなるためである。つまり、サーミスタT4の温度が高温になると、オペアンプOP3の出力電圧が、ローレベルになる。
 なお、サーミスタT4としてPTC特性を持つものを用いる場合には、オペアンプOP3の非反転入力端子に、サーミスタT4及び抵抗器Rt4の分圧回路の出力を接続し、オペアンプOP3の反転入力端子に、分圧回路Peの出力を接続すればよい。
A positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2. A connection point between the two resistors forming the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4). In this embodiment, the thermistor T4 having the NTC characteristic is used, so the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3. This is because the negative power supply terminal of operational amplifier OP3 is connected to the ground line, and the voltage value input to the inverting input terminal of operational amplifier OP3 (divided voltage value by thermistor T4 and resistor Rt4) is the non-inverting input of operational amplifier OP3. This is because the value of the output voltage of the operational amplifier OP3 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (divided voltage value by the voltage dividing circuit Pe). That is, when the temperature of the thermistor T4 becomes high, the output voltage of the operational amplifier OP3 becomes low level.
When a thermistor T4 having a PTC characteristic is used, the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 is connected to the non-inverting input terminal of the operational amplifier OP3, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP3. The output of the pressure circuit Pe may be connected.
 オペアンプOP2の出力端子には抵抗器R1が接続されている。抵抗器R1には、ダイオードD1のカソードが接続されている。ダイオードD1のアノードは、オペアンプOP3の出力端子と、FF17のD端子と、FF17のCLR( ̄)端子と、に接続されている。抵抗器R1とダイオードD1との接続ラインには、電源ラインPL1に接続された抵抗器R2が接続されている。また、この接続ラインには、FF16のCLR( ̄)端子が接続されている。 A resistor R1 is connected to the output terminal of the operational amplifier OP2. A cathode of a diode D1 is connected to the resistor R1. The anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR (~) terminal of the FF17. A connection line between the resistor R1 and the diode D1 is connected to a resistor R2 connected to the power supply line PL1. Also, the CLR (~) terminal of the FF 16 is connected to this connection line.
 ダイオードD1のアノード及びオペアンプOP3の出力端子の接続点と、FF17のD端子との接続ラインには、抵抗器R3の一端が接続されている。抵抗器R3の他端は電源ラインPL2に接続されている。更に、この接続ラインには、残量計IC12の通知端子12aと接続されているダイオードD2のアノードと、ダイオードD3のアノードと、FF17のCLR( ̄)端子と、が接続されている。ダイオードD3のカソードは、MCU1の端子P5に接続されている。 One end of a resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17. The other end of resistor R3 is connected to power supply line PL2. Furthermore, the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR (~) terminal of the FF 17 are connected to this connection line. The cathode of diode D3 is connected to terminal P5 of MCU1.
 FF16は、ヒータHTRの温度が過大となり、オペアンプOP2から出力される信号が小さくなって、CLR( ̄)端子に入力される信号がローレベルになると、Q( ̄)端子からハイレベルの信号をMCU1の端子P11に入力する。FF16のD端子には電源ラインPL1からハイレベルのシステム電源電圧Vcc1が供給されている。このため、FF16では、負論理で動作するCLR( ̄)端子に入力される信号がローレベルにならない限り、Q( ̄)端子からはローレベルの信号が出力され続ける。 When the temperature of the heater HTR becomes excessive and the signal output from the operational amplifier OP2 becomes low and the signal input to the CLR (~) terminal becomes low level, the FF16 outputs a high level signal from the Q (~) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in the FF 16, a low level signal continues to be output from the Q (~) terminal unless the signal input to the CLR (~) terminal operating in negative logic becomes low level.
 FF17のCLR( ̄)端子に入力される信号は、ヒータHTRの温度が過大となった場合と、ケース110の温度が過大となった場合と、残量計IC12の通知端子12aから異常検出を示すローレベルの信号が出力された場合のいずれかの場合に、ローレベルとなる。FF17は、CLR( ̄)端子に入力される信号がローレベルになると、Q端子からローレベルの信号を出力する。このローレベルの信号は、MCU1の端子P10と、スイッチS6のゲート端子と、昇圧DC/DCコンバータ9のイネーブル端子ENと、充電IC2に接続されたバイポーラトランジスタS1のベース端子と、にそれぞれ入力される。スイッチS6のゲート端子にローレベルの信号が入力されると、スイッチS6を構成するNチャネル型MOSFETのゲート-ソース間電圧が閾値電圧未満となるため、スイッチS6がオフになる。昇圧DC/DCコンバータ9のイネーブル端子ENにローレベルの信号が入力されると、昇圧DC/DCコンバータ9のイネーブル端子ENは正論理であるため、昇圧動作が停止する。バイポーラトランジスタS1のベース端子にローレベルの信号が入力されると、バイポーラトランジスタS1がオンになる(コレクタ端子から増幅された電流が出力される)。バイポーラトランジスタS1がオンになると、充電IC2のCE( ̄)端子にバイポーラトランジスタS1を介してハイレベルのシステム電源電圧Vcc2が入力される。充電IC2のCE( ̄)端子は負論理であるため、電源BATの充電が停止される。これらにより、ヒータHTRの加熱と電源BATの充電が停止される。なお、MCU1が端子P22から充電IC2の充電イネーブル端子CE( ̄)に対してローレベルのイネーブル信号を出力しようとしても、バイポーラトランジスタS1がオンされると、増幅された電流が、コレクタ端子からMCU1の端子P22および充電IC2の充電イネーブル端子CE( ̄)に入力される。これにより、充電IC2の充電イネーブル端子CE( ̄)にはハイレベルの信号が入力される点に留意されたい。 The signal input to the CLR (~) terminal of the FF 17 is when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and when an abnormality is detected from the notification terminal 12a of the fuel gauge IC 12. When the low-level signal shown is output, it becomes low-level. The FF 17 outputs a low level signal from the Q terminal when the signal input to the CLR (~) terminal becomes low level. This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC/DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. be. When a low level signal is input to the gate terminal of the switch S6, the gate-source voltage of the N-channel MOSFET constituting the switch S6 becomes less than the threshold voltage, so the switch S6 is turned off. When a low level signal is input to the enable terminal EN of the boost DC/DC converter 9, the boost operation stops because the enable terminal EN of the boost DC/DC converter 9 is positive logic. When a low level signal is input to the base terminal of the bipolar transistor S1, the bipolar transistor S1 is turned on (amplified current is output from the collector terminal). When the bipolar transistor S1 is turned on, the high level system power supply voltage Vcc2 is input to the CE (~) terminal of the charging IC2 through the bipolar transistor S1. Since the CE (~) terminal of the charging IC2 is of negative logic, the charging of the power source BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 attempts to output a low-level enable signal from the terminal P22 to the charge enable terminal CE (~) of the charging IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1 and the charge enable terminal CE (~) of the charge IC2. Note that a high level signal is input to the charge enable terminal CE (~) of the charge IC2.
 FF17のD端子には電源ラインPL2からハイレベルのシステム電源電圧Vcc2が供給されている。このため、FF17では、負論理で動作するCLR( ̄)端子に入力される信号がローレベルにならない限り、Q端子からハイレベルの信号が出力され続ける。オペアンプOP3の出力端子からローレベルの信号が出力されると、オペアンプOP2の出力端子から出力される信号のレベルに拠らず、FF17のCLR( ̄)端子にはローレベルの信号が入力される。オペアンプOP2の出力端子からハイレベルの信号が出力される場合には、オペアンプOP3の出力端子から出力されるローレベルの信号は、ダイオードD1によってこのハイレベルの信号の影響を受けない点に留意されたい。また、オペアンプOP2の出力端子からローレベルの信号が出力される場合には、オペアンプOP3の出力端子からハイレベルの信号が出力されたとしても、ダイオードD1を介してこのハイレベルの信号はローレベルの信号に置き換わる。 A high-level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, the FF 17 continues to output a high level signal from the Q terminal unless the signal input to the CLR (~) terminal operating in negative logic becomes low level. When a low level signal is output from the output terminal of the operational amplifier OP3, a low level signal is input to the CLR (~) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2. . Note that when a high level signal is output from the output terminal of the operational amplifier OP2, the low level signal output from the output terminal of the operational amplifier OP3 is not affected by the high level signal due to the diode D1. sea bream. Further, when a low level signal is output from the output terminal of the operational amplifier OP2, even if a high level signal is output from the output terminal of the operational amplifier OP3, the high level signal is passed through the diode D1. signal.
 電源ラインPL2は、MCU搭載基板161からLED搭載基板163及びホールIC搭載基板164側に向けて更に分岐している。この分岐した電源ラインPL2には、ホールIC13の電源端子VDDと、通信IC15の電源端子VCCと、ホールIC14の電源端子VDDと、が接続されている。 The power line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164 side. The power terminal VDD of the hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the hall IC 14 are connected to the branched power line PL2.
 ホールIC13の出力端子OUTは、MCU1の端子P3と、スイッチドライバ7の端子SW2と、に接続されている。アウターパネル115が外れると、ホールIC13の出力端子OUTからローレベルの信号が出力される。MCU1は、端子P3に入力される信号により、アウターパネル115の装着有無を判定する。 The output terminal OUT of the Hall IC 13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the Hall IC 13 . The MCU 1 determines whether or not the outer panel 115 is attached based on the signal input to the terminal P3.
 LED搭載基板163には、操作スイッチOPSと接続された直列回路(抵抗器とコンデンサの直列回路)が設けられている。この直列回路は、電源ラインPL2に接続されている。この直列回路の抵抗器とコンデンサの接続点は、MCU1の端子P4と、操作スイッチOPSと、スイッチドライバ7の端子SW1と、に接続されている。操作スイッチOPSが押下されていない状態では、操作スイッチOPSは導通せず、MCU1の端子P4とスイッチドライバ7の端子SW1にそれぞれ入力される信号は、システム電源電圧Vcc2によりハイレベルとなる。操作スイッチOPSが押下されて操作スイッチOPSが導通状態になると、MCU1の端子P4とスイッチドライバ7の端子SW1にそれぞれ入力される信号は、グランドラインへ接続されるためローレベルとなる。MCU1は、端子P4に入力される信号により、操作スイッチOPSの操作を検出する。 A series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting board 163 . This series circuit is connected to power supply line PL2. A connection point between the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7. FIG. When the operation switch OPS is not pressed, the operation switch OPS is not conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are at a high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and turned on, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground line, and thus become low level. The MCU1 detects the operation of the operation switch OPS from the signal input to the terminal P4.
 スイッチドライバ7には、リセット入力端子RSTBが設けられている。リセット入力端子RSTBは、LSW4の制御端子ONに接続されている。スイッチドライバ7は、端子SW1と端子SW2に入力される信号のレベルがいずれもローレベルとなった場合(アウターパネル115が外されており、且つ、操作スイッチOPSが押下された状態)には、リセット入力端子RSTBからローレベルの信号を出力することで、LSW4の出力動作を停止させる。つまり、本来はアウターパネル115の押圧部117を介して押し下げられる操作スイッチOPSが、アウターパネル115が外れた状態でユーザによって直接押し下げられると、スイッチドライバ7の端子SW1と端子SW2に入力される信号のレベルがいずれもローレベルになる。 The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of LSW4. When the levels of the signals input to the terminals SW1 and SW2 are both low (the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 By outputting a low level signal from the reset input terminal RSTB, the output operation of LSW4 is stopped. In other words, when the operation switch OPS, which is originally pushed down via the pressing portion 117 of the outer panel 115, is directly pushed down by the user with the outer panel 115 removed, the signal is input to the terminals SW1 and SW2 of the switch driver 7. become low level.
<吸引器の動作モード毎の動作>
 以下、図13~図19を参照して、図10に示す電気回路の動作を説明する。図13は、スリープモードにおける電気回路の動作を説明するための図である。図14は、アクティブモードにおける電気回路の動作を説明するための図である。図15は、加熱初期設定モードにおける電気回路の動作を説明するための図である。図16は、加熱モードにおけるヒータHTRの加熱時の電気回路の動作を説明するための図である。図17は、加熱モードにおけるヒータHTRの温度検出時の電気回路の動作を説明するための図である。図18は、充電モードにおける電気回路の動作を説明するための図である。図19は、MCU1のリセット(再起動)時の電気回路の動作を説明するための図である。図13~図19の各々において、チップ化された電子部品の端子のうち、破線の楕円で囲まれた端子は、電源電圧VBAT、USB電圧VUSB、及びシステム電源電圧等の入力又は出力がなされている端子を示している。
<Operation for each operating mode of the aspirator>
The operation of the electric circuit shown in FIG. 10 will be described below with reference to FIGS. 13 to 19. FIG. FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode. FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode. FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode. FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode. FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode. FIG. 18 is a diagram for explaining the operation of the electric circuit in charging mode. FIG. 19 is a diagram for explaining the operation of the electric circuit when the MCU 1 is reset (restarted). In each of FIGS. 13 to 19, among the terminals of the chipped electronic component, the terminals surrounded by dashed ellipses have inputs or outputs such as the power supply voltage V BAT , the USB voltage V USB , and the system power supply voltage. It shows the terminals that have been made.
 いずれの動作モードにおいても、電源電圧VBATは、保護IC10の電源端子VDDと、昇圧DC/DCコンバータ9の入力端子VINと、充電IC2の充電端子batに入力されている。 In any operation mode, the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2. FIG.
<スリープモード:図13>
 MCU1は、充電IC2のVBATパワーパス機能を有効とし、OTG機能と充電機能を無効とする。充電IC2の入力端子VBUSにUSB電圧VUSBが入力されないことで、充電IC2のVBATパワーパス機能は有効になる。通信線LNからOTG機能を有効にするための信号がMCU1から充電IC2へ出力されないため、OTG機能は無効になる。このため、充電IC2は、充電端子batに入力された電源電圧VBATからシステム電源電圧Vcc0を生成して、出力端子SYSから出力する。出力端子SYSから出力されたシステム電源電圧Vcc0は、昇降圧DC/DCコンバータ8の入力端子VIN及びイネーブル端子ENに入力される。昇降圧DC/DCコンバータ8は、正論理であるイネーブル端子ENにハイレベルのシステム電源電圧Vcc0が入力されることでイネーブルとなり、システム電源電圧Vcc0からシステム電源電圧Vcc1を生成して、出力端子VOUTから出力する。昇降圧DC/DCコンバータ8の出力端子VOUTから出力されたシステム電源電圧Vcc1は、LSW4の入力端子VINと、LSW4の制御端子ONと、スイッチドライバ7の入力端子VINと、FF16の電源端子VCC及びD端子と、にそれぞれ供給される。
<Sleep mode: Fig. 13>
MCU1 enables the V BAT power pass function of charging IC2 and disables the OTG function and charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC2, the VBAT power pass function of the charging IC2 is enabled. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function is disabled. Therefore, the charging IC2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat, and outputs it from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 . The buck-boost DC/DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to an enable terminal EN of positive logic, generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it to an output terminal VOUT. Output from The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC/DC converter 8 is applied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal and , respectively.
 LSW4は、制御端子ONにシステム電源電圧Vcc1が入力されることで、入力端子VINに入力されたシステム電源電圧Vcc1を、出力端子VOUTからシステム電源電圧Vcc2として出力する。LSW4から出力されたシステム電源電圧Vcc2は、MCU1の電源端子VDDと、LSW5の入力端子VINと、ホールIC13の電源端子VDDと、通信IC15の電源端子VCCと、ホールIC14の電源端子VDDと、に入力される。更に、システム電源電圧Vcc2は、残量計IC12の電源端子VDDと、ROM6の電源端子VCCと、充電IC2の充電イネーブル端子CE( ̄)に接続された抵抗器Rc及びバイポーラトランジスタS1と、FF17の電源端子VCCと、オペアンプOP3の正電源端子と、分圧回路Peと、オペアンプOP2の正電源端子と、分圧回路Pdと、にそれぞれ供給される。充電IC2に接続されているバイポーラトランジスタS1は、FF17のQ端子からローレベルの信号が出力されない限りはオフとなっている。そのため、LSW4で生成されたシステム電源電圧Vcc2は、充電IC2の充電イネーブル端子CE( ̄)にも入力される。充電IC2の充電イネーブル端子CE( ̄)は負論理のため、この状態では、充電IC2による充電機能はオフとなる。 When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from the LSW4 is applied to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14. is entered. Furthermore, the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE (~) of the charging IC2, and the FF17. They are supplied to the power supply terminal VCC, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd. The bipolar transistor S1 connected to the charging IC2 is off unless a low level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE (~) of the charging IC2. Since the charge enable terminal CE (~) of the charge IC2 is of negative logic, the charge function of the charge IC2 is turned off in this state.
 このように、スリープモードにおいては、LSW5はシステム電源電圧Vcc3の出力を停止しているため、電源ラインPL3に接続される電子部品への電力供給は停止される。また、スリープモードにおいては、充電IC2のOTG機能は停止しているため、LED L1~L8への電力供給は停止される。 Thus, in the sleep mode, LSW 5 stops outputting system power supply voltage Vcc3, so power supply to electronic components connected to power supply line PL3 is stopped. Also, in the sleep mode, the OTG function of the charging IC 2 is stopped, so power supply to the LEDs L1 to L8 is stopped.
<アクティブモード:図14>
 MCU1は、図13のスリープモードの状態から、端子P8に入力される信号がハイレベルとなり、スライダ119が開いたことを検出すると、端子P23からLSW5の制御端子ONにハイレベルの信号を入力する。これにより、LSW5は入力端子VINに入力されているシステム電源電圧Vcc2を、システム電源電圧Vcc3として、出力端子VOUTから出力する。LSW5の出力端子VOUTから出力されたシステム電源電圧Vcc3は、サーミスタT2と、サーミスタT3と、サーミスタT4と、に供給される。
<Active mode: Fig. 14>
When the MCU 1 detects that the signal input to the terminal P8 becomes high level from the sleep mode state of FIG. 13 and the slider 119 is opened, it inputs a high level signal from the terminal P23 to the control terminal ON of the LSW5. . As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT as the system power supply voltage Vcc3. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
 更に、MCU1は、スライダ119が開いたことを検出すると、通信線LNを介して、充電IC2のOTG機能を有効化する。これにより、充電IC2は、充電端子batから入力された電源電圧VBATを昇圧して得られるシステム電源電圧Vcc4を、入力端子VBUSから出力する。入力端子VBUSから出力されたシステム電源電圧Vcc4は、
LED L1~L8に供給される。
Further, when the MCU1 detects that the slider 119 is opened, the MCU1 enables the OTG function of the charging IC2 via the communication line LN. As a result, the charging IC2 outputs from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat. The system power supply voltage Vcc4 output from the input terminal VBUS is
It is fed to the LEDs L1-L8.
<加熱初期設定モード:図15>
 図14の状態から、端子P4に入力される信号がローレベルになる(操作スイッチOPSの押下がなされる)と、MCU1は、加熱に必要な各種の設定を行った後、端子P14から、昇圧DC/DCコンバータ9のイネーブル端子ENにハイレベルのイネーブル信号を入力する。これにより、昇圧DC/DCコンバータ9は、電源電圧VBATを昇圧して得られる駆動電圧Vbstを出力端子VOUTから出力する。駆動電圧Vbstは、スイッチS3とスイッチS4に供給される。この状態では、スイッチS3とスイッチS4はオフとなっている。また、端子P14から出力されたハイレベルのイネーブル信号によってスイッチS6はオンされる。これにより、ヒータHTRの負極側端子がグランドラインに接続されて、スイッチS3をONにすればヒータHTRを加熱可能な状態になる。MCU1の端子P14からハイレベルの信号のイネーブル信号が出力された後、加熱モードに移行する。
<Heating initial setting mode: Fig. 15>
From the state of FIG. 14, when the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then boosts the voltage from the terminal P14. A high-level enable signal is input to the enable terminal EN of the DC/DC converter 9 . As a result, the step-up DC/DC converter 9 outputs the driving voltage V bst obtained by stepping up the power supply voltage V BAT from the output terminal VOUT. The drive voltage Vbst is supplied to switch S3 and switch S4. In this state, the switches S3 and S4 are off. Also, the switch S6 is turned on by the high-level enable signal output from the terminal P14. As a result, the negative terminal of the heater HTR is connected to the ground line, and the heater HTR can be heated by turning on the switch S3. After a high-level enable signal is output from the terminal P14 of the MCU1, the mode shifts to the heating mode.
<加熱モード時のヒータ加熱:図16>
 図15の状態において、MCU1は、端子P16に接続されたスイッチS3のスイッチング制御と、端子P15に接続されたスイッチS4のスイッチング制御を開始する。これらスイッチング制御は、上述した加熱初期設定モードが完了すれば自動的に開始されてもよいし、さらなる操作スイッチOPSの押下によって開始されてもよい。具体的には、MCU1は、図16のように、スイッチS3をオンし、スイッチS4をオフして、駆動電圧VbstをヒータHTRに供給し、エアロゾル生成のためのヒータHTRの加熱を行う加熱制御と、図17のように、スイッチS3をオフし、スイッチS4をオンして、ヒータHTRの温度を検出する温度検出制御と、を行う。
<Heater heating in heating mode: Fig. 16>
In the state of FIG. 15, the MCU1 starts switching control of the switch S3 connected to the terminal P16 and switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the heating initial setting mode described above is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 16, the MCU 1 turns on the switch S3 and turns off the switch S4 to supply the driving voltage Vbst to the heater HTR to heat the heater HTR for generating aerosol. and temperature detection control for detecting the temperature of the heater HTR by turning off the switch S3 and turning on the switch S4 as shown in FIG.
 図16に示すように、加熱制御時においては、駆動電圧Vbstは、スイッチS5のゲートにも供給されて、スイッチS5がオンとなる。また、加熱制御時には、スイッチS3を通過した駆動電圧Vbstが、抵抗器Rsを介して、オペアンプOP1の正電源端子にも入力される。抵抗器Rsの抵抗値は、オペアンプOP1の内部抵抗値と比べると無視できるほど小さい。そのため、加熱制御時において、オペアンプOP1の正電源端子に入力される電圧は、駆動電圧Vbstとほぼ同等になる。 As shown in FIG. 16, during heating control, the driving voltage Vbst is also supplied to the gate of the switch S5 to turn on the switch S5. Further, during heating control, the drive voltage Vbst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs. The resistance value of the resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage Vbst .
 なお、抵抗器R4の抵抗値は、スイッチS5のオン抵抗値よりも大きくなっている。加熱制御時にもオペアンプOP1は動作するが、加熱制御時にはスイッチS5がオンになる。スイッチS5がオンの状態では、オペアンプOP1の出力電圧が、抵抗器R4とスイッチS5の分圧回路によって分圧されて、MCU1の端子P9に入力される。抵抗器R4の抵抗値がスイッチS5のオン抵抗値よりも大きくなっていることで、MCU1の端子P9に入力される電圧は十分に小さくなる。これにより、オペアンプOP1からMCU1に対して大きな電圧が入力されるのを防ぐことができる。 It should be noted that the resistance value of the resistor R4 is greater than the ON resistance value of the switch S5. Although the operational amplifier OP1 operates during heating control, the switch S5 is turned on during heating control. When the switch S5 is on, the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is higher than the ON resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 is sufficiently reduced. This can prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.
<加熱モード時のヒータ温度検出:図17>
 図17に示すように、温度検出制御時には、駆動電圧VbstがオペアンプOP1の正電源端子に入力されると共に、分圧回路Pbに入力される。分圧回路Pbによって分圧された電圧は、MCU1の端子P18に入力される。MCU1は、端子P18に入力される電圧に基づいて、温度検出制御時における抵抗器RsとヒータHTRの直列回路に印加される基準電圧Vtempを取得する。
<Heater temperature detection in heating mode: Fig. 17>
As shown in FIG. 17, during temperature detection control, the driving voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. Based on the voltage input to the terminal P18, the MCU1 acquires the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during temperature detection control.
 また、温度検出制御時には、駆動電圧Vbst(基準電圧Vtemp)が、抵抗器RsとヒータHTRの直列回路に供給される。そして、この駆動電圧Vbst(基準電圧Vtemp)を抵抗器RsとヒータHTRによって分圧した電圧Vheatが、オペアンプOP1の非反転入力端子に入力される。抵抗器Rsの抵抗値はヒータHTRの抵抗値よりも十分に大きいため、電圧Vheatは、駆動電圧Vbstよりも十分に低い値である。温度検出制御時には、この低い電圧VheatがスイッチS5のゲート端子にも供給されることで、スイッチS5はオフされる。オペアンプOP1は、反転入力端子に入力される電圧と非反転入力端子に入力される電圧Vheatの差を増幅して出力する。 Further, during temperature detection control, the driving voltage V bst (reference voltage V temp ) is supplied to the series circuit of the resistor Rs and the heater HTR. A voltage V heat obtained by dividing the driving voltage V bst (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistor Rs is sufficiently higher than the resistance value of the heater HTR, the voltage V heat is sufficiently lower than the driving voltage V bst . During temperature detection control, the switch S5 is turned off by supplying the low voltage V heat to the gate terminal of the switch S5. The operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.
 オペアンプOP1の出力信号は、MCU1の端子P9に入力される。MCU1は、端子P9に入力された信号と、端子P18の入力電圧に基づいて取得した基準電圧Vtempと、既知の抵抗器Rsの電気抵抗値と、に基づいて、ヒータHTRの温度を取得する。MCU1は、取得したヒータHTRの温度に基づいて、ヒータHTRの加熱制御(例えばヒータHTRの温度が目標温度となるような制御)を行う。 The output signal of operational amplifier OP1 is input to terminal P9 of MCU1. The MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the known electrical resistance value of the resistor Rs. . Based on the acquired temperature of the heater HTR, the MCU 1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR becomes a target temperature).
 なお、MCU1は、スイッチS3とスイッチS4をそれぞれオフにしている期間(ヒータHTRへの通電を行っていない期間)においても、ヒータHTRの温度を取得することができる。具体的には、MCU1は、端子P13に入力される電圧(サーミスタT3と抵抗器Rt3から構成される分圧回路の出力電圧)に基づいて、ヒータHTRの温度を取得する。 Note that the MCU 1 can obtain the temperature of the heater HTR even during periods when the switches S3 and S4 are turned off (periods when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).
 また、MCU1は、任意のタイミングにて、ケース110の温度の取得も可能である。具体的には、MCU1は、端子P12に入力される電圧(サーミスタT4と抵抗器Rt4から構成される分圧回路の出力電圧)に基づいて、ケース110の温度を取得する。 Also, the MCU 1 can acquire the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).
<充電モード:図18>
 図18は、スリープモードの状態でUSB接続がなされた場合を例示している。USB接続がなされると、USB電圧VUSBが過電圧保護IC11を介してLSW3の入力端子VINに入力される。USB電圧VUSBは、LSW3の入力端子VINに接続された分圧回路Pfにも供給される。USB接続がなされた直後の時点では、バイポーラトランジスタS2がオンとなっているため、LSW3の制御端子ONに入力される信号はローレベルのままとなる。USB電圧VUSBは、MCU1の端子P17に接続された分圧回路Pcにも供給され、この分圧回路Pcで分圧された電圧が端子P17に入力される。MCU1は、端子P17に入力された電圧に基づいて、USB接続がなされたことを検出する。
<Charging mode: Fig. 18>
FIG. 18 exemplifies a case where a USB connection is made in sleep mode. When the USB connection is made, the USB voltage VUSB is input to the input terminal VIN of LSW3 via the overvoltage protection IC11. The USB voltage V USB is also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. Since the bipolar transistor S2 is ON immediately after the USB connection is made, the signal input to the control terminal ON of the LSW3 remains at a low level. The USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to the terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to the terminal P17. The MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.
 MCU1は、USB接続がなされたことを検出すると、端子P19に接続されたバイポーラトランジスタS2をオフする。バイポーラトランジスタS2のゲート端子にローレベルの信号を入力すると、分圧回路Pfによって分圧されたUSB電圧VUSBがLSW3の制御端子ONに入力される。これにより、LSW3の制御端子ONにハイレベルの信号が入力されて、LSW3は、USB電圧VUSBを出力端子VOUTから出力する。LSW3から出力されたUSB電圧VUSBは、充電IC2の入力端子VBUSに入力される。また、LSW3から出力されたUSB電圧VUSBは、そのままシステム電源電圧Vcc4として、LED L1~L8に供給される。 When the MCU1 detects that the USB connection has been made, the MCU1 turns off the bipolar transistor S2 connected to the terminal P19. When a low level signal is input to the gate terminal of the bipolar transistor S2, the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. As a result, a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage VUSB from the output terminal VOUT. The USB voltage VUSB output from LSW3 is input to the input terminal VBUS of charging IC2. In addition, the USB voltage V_USB output from LSW3 is directly supplied to LEDs L1 to L8 as system power supply voltage Vcc4.
 MCU1は、USB接続がなされたことを検出すると、更に、端子P22から、充電IC2の充電イネーブル端子CE( ̄)に対してローレベルのイネーブル信号を出力する。これにより、充電IC2は、電源BATの充電機能を有効化し、入力端子VBUSに入力されるUSB電圧VUSBによる電源BATの充電を開始する。 When the MCU1 detects that the USB connection has been established, the MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE(~) of the charge IC2. As a result, the charging IC 2 enables the charging function of the power supply BAT, and starts charging the power supply BAT with the USB voltage VUSB input to the input terminal VBUS.
 なお、アクティブモードの状態でUSB接続がなされた場合には、MCU1は、USB接続がなされたことを検出すると、端子P19に接続されたバイポーラトランジスタS2をオフし、更に、端子P22から、充電IC2の充電イネーブル端子CE( ̄)に対してローレベルのイネーブル信号を出力し、更に、通信線LNを利用したシリアル通信によって、充電IC2のOTG機能をオフする。これにより、LED L1~L8に供給されるシステム電源電圧Vcc4は、充電IC2のOTG機能で生成されていた電圧(電源電圧VBATに基づく電圧)から、LSW3から出力されたUSB電圧VUSBに切り替わる。LED L1~L8は、MCU1によって内蔵トランジスタのオン制御がなされない限りは作動しない。このため、OTG機能のオンからオフへの過渡期における不安定な電圧がLED L1~L8に供給されるのは防がれる。 When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, it turns off the bipolar transistor S2 connected to the terminal P19. A low-level enable signal is output to the charge enable terminal CE (~) of , and the OTG function of the charge IC 2 is turned off by serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. . The LEDs L1 to L8 do not operate unless the MCU1 turns on the built-in transistors. This prevents an unstable voltage from being supplied to the LEDs L1-L8 during the on-to-off transition of the OTG function.
<MCUのリセット:図19>
 アウターパネル115が外されてホールIC13の出力がローレベルとなり、操作スイッチOPSのオン操作がなされてMCU1の端子P4に入力される信号がローレベルになると、スイッチドライバ7の端子SW1と端子SW2が共にローレベルとなる。これにより、スイッチドライバ7は、リセット入力端子RSTBからローレベルの信号を出力する。リセット入力端子RSTBから出力されたローレベルの信号はLSW4の制御端子ONに入力される。これにより、LSW4は、出力端子VOUTからのシステム電源電圧Vcc2の出力を停止する。システム電源電圧Vcc2の出力が停止されることで、MCU1の電源端子VDDにシステム電源電圧Vcc2が入力されなくなるため、MCU1は停止する。
<Reset MCU: Fig. 19>
When the outer panel 115 is removed, the output of the hall IC 13 becomes low level, and the signal input to the terminal P4 of the MCU 1 becomes low level by turning on the operation switch OPS, the terminals SW1 and SW2 of the switch driver 7 are turned on. Both become low level. As a result, the switch driver 7 outputs a low level signal from the reset input terminal RSTB. A low-level signal output from the reset input terminal RSTB is input to the control terminal ON of LSW4. As a result, LSW4 stops outputting system power supply voltage Vcc2 from output terminal VOUT. Since the output of the system power supply voltage Vcc2 is stopped, the system power supply voltage Vcc2 is no longer input to the power supply terminal VDD of the MCU1, so the MCU1 is stopped.
 スイッチドライバ7は、リセット入力端子RSTBからローレベルの信号を出力している時間が既定時間に達するか、端子SW1と端子SW2のいずれかに入力される信号がハイレベルになると、リセット入力端子RSTBから出力する信号をハイレベルに戻す。これにより、LSW4の制御端子ONがハイレベルとなり、システム電源電圧Vcc2が各部に供給される状態に復帰する。 The switch driver 7 outputs a low-level signal from the reset input terminal RSTB when it reaches a predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the reset input terminal RSTB is output. return the signal output from to high level. As a result, the control terminal ON of LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part is restored.
<充電ICの機能の詳細)
 図20は、充電IC2の内部の概略構成を示す図である。充電IC2は、プロセッサ21と、ゲートドライバ22と、Nチャネル型MOSFETで構成されたスイッチQ1~Q4と、を備える。
<Details of charging IC functions)
FIG. 20 is a diagram showing a schematic configuration inside the charging IC 2. As shown in FIG. The charging IC 2 includes a processor 21, a gate driver 22, and switches Q1 to Q4 configured by N-channel MOSFETs.
 スイッチQ1のソース端子は入力端子VBUSに接続されている。スイッチQ1のドレイン端子は、スイッチQ2のドレイン端子に接続されている。スイッチQ2のソース端子は、スイッチング端子SWに接続されている。スイッチQ3のドレイン端子は、スイッチQ2とスイッチング端子SWの接続ノードに接続されている。スイッチQ3のソース端子は、グランド端子GNDに接続されている。スイッチQ4のドレイン端子は、出力端子SYSに接続されている。スイッチQ4のソース端子は、充電端子batに接続されている。 A source terminal of the switch Q1 is connected to the input terminal VBUS. The drain terminal of switch Q1 is connected to the drain terminal of switch Q2. A source terminal of the switch Q2 is connected to the switching terminal SW. A drain terminal of the switch Q3 is connected to a connection node between the switch Q2 and the switching terminal SW. A source terminal of the switch Q3 is connected to the ground terminal GND. A drain terminal of the switch Q4 is connected to the output terminal SYS. A source terminal of the switch Q4 is connected to the charging terminal bat.
 ゲートドライバ22は、スイッチQ2のゲート端子とスイッチQ3のゲート端子に接続されており、プロセッサ21の指令に基づき、スイッチQ2,Q3のオンオフ制御を行う。 The gate driver 22 is connected to the gate terminal of the switch Q2 and the gate terminal of the switch Q3, and performs on/off control of the switches Q2 and Q3 based on commands from the processor 21.
 プロセッサ21は、ゲートドライバ22と、スイッチQ1のゲート端子と、スイッチQ4のゲート端子と、充電イネーブル端子CE( ̄)とに接続されている。プロセッサ21は、ゲートドライバ22を介したスイッチQ2,Q3のオンオフ制御と、スイッチQ1,Q4のオンオフ制御を行う。 The processor 21 is connected to the gate driver 22, the gate terminal of the switch Q1, the gate terminal of the switch Q4, and the charge enable terminal CE(~). The processor 21 performs on/off control of the switches Q2 and Q3 and on/off control of the switches Q1 and Q4 via the gate driver 22 .
 充電IC2は、前述した充電機能、VBATパワーパス機能、及びOTG機能に加えて、VUSBパワーパス機能と、VUSB&VBATパワーパス機能と、を備える。以下では、これら各機能の有効時における充電IC2の内部の制御内容について説明する。なお、前述してきた各種電圧の具体的な数値は、好ましくは下記に示す値である。 The charging IC 2 has a V USB power pass function and a V USB & V BAT power pass function in addition to the above-described charging function, V BAT power pass function, and OTG function. The contents of control inside the charging IC 2 when these functions are enabled will be described below. The specific numerical values of the various voltages described above are preferably the values shown below.
電源電圧VBAT(満充電電圧)=4.2V
電源電圧VBAT(公称電圧)=3.7V
システム電源電圧Vcc1=3.3V
システム電源電圧Vcc2=3.3V
システム電源電圧Vcc3=3.3V
システム電源電圧Vcc4=5.0V
USB電圧VUSB=5.0V
駆動電圧Vbst=4.9V
Power supply voltage V BAT (full charge voltage) = 4.2V
Power supply voltage V BAT (nominal voltage) = 3.7V
System power supply voltage Vcc1=3.3V
System power supply voltage Vcc2=3.3V
System power supply voltage Vcc3=3.3V
System power supply voltage Vcc4=5.0V
USB voltage V USB =5.0V
Drive voltage V bst =4.9V
(充電機能)
 プロセッサ21は、スイッチQ1をオン、スイッチQ3をオフに制御した状態で、スイッチQ2及びスイッチQ4のオンオフ制御を行う。スイッチQ4のオンオフ制御は、電源BATの充電電流を調整するために行われる。プロセッサ21は、出力端子SYSの電圧が電源BATの充電に適した電圧と同じになるようにスイッチQ2のオンオフ制御を行う。これにより、入力端子VBUSに入力されたUSB電圧VUSBは降圧されて出力端子SYSから出力される。出力端子SYSから出力される電圧は、システム電源電圧Vcc0として昇降圧DC/DCコンバータ8の入力端子VINに入力されると共に、充電IC2の充電端子batから出力される。これにより、USB電圧VUSBを降圧して得た電圧による電源BATの充電が行われる。なお、充電機能の有効時には、システム電源電圧Vcc0は、最終的に、電源BATの満充電電圧と同じ値になる。このため、昇降圧DC/DCコンバータ8は、入力端子VINに入力される4.2Vのシステム電源電圧Vcc0を降圧して、3.3Vのシステム電源電圧Vcc1を生成して出力することになる。充電機能の有効時には、充電IC2において、入力端子VBUSの電位が出力端子SYSの電位よりも高電位となるため、電源BATからの電力が入力端子VBUSから出力されることはない。
(charging function)
The processor 21 performs on/off control of the switches Q2 and Q4 while controlling the switch Q1 to be on and the switch Q3 to be off. ON/OFF control of the switch Q4 is performed to adjust the charging current of the power supply BAT. The processor 21 performs on/off control of the switch Q2 so that the voltage of the output terminal SYS is the same as the voltage suitable for charging the power supply BAT. As a result, the USB voltage VUSB input to the input terminal VBUS is stepped down and output from the output terminal SYS. The voltage output from the output terminal SYS is input to the input terminal VIN of the buck-boost DC/DC converter 8 as the system power supply voltage Vcc0, and is output from the charging terminal bat of the charging IC2. As a result, the power supply BAT is charged by the voltage obtained by stepping down the USB voltage VUSB. Incidentally, when the charging function is enabled, the system power supply voltage Vcc0 finally becomes the same value as the full charge voltage of the power supply BAT. Therefore, the buck-boost DC/DC converter 8 steps down the 4.2V system power supply voltage Vcc0 input to the input terminal VIN to generate and output the 3.3V system power supply voltage Vcc1. When the charging function is enabled, the potential of the input terminal VBUS is higher than the potential of the output terminal SYS in the charging IC2, so that the power from the power supply BAT is not output from the input terminal VBUS.
(VUSBパワーパス機能)
 VUSBパワーパス機能は、例えば、電源BATが過放電等の理由で利用できない場合に有効となる。プロセッサ21は、スイッチQ1をオン、スイッチQ2をオン、スイッチQ3をオフ、スイッチQ4をオフに制御する。これにより、入力端子VBUSに入力されたUSB電圧VUSBは、降圧されることなく、そのままスイッチング端子SWから出力される。スイッチング端子SWから出力された電圧は、システム電源電圧Vcc0として昇降圧DC/DCコンバータ8の入力端子VINに入力される。この場合も、昇降圧DC/DCコンバータ8は、入力端子VINに入力される5Vのシステム電源電圧Vcc0を降圧して、3.3Vのシステム電源電圧Vcc1を生成して出力することになる。なお、VUSBパワーパス機能を有効とする場合であっても、プロセッサ21は、スイッチQ1をオン、スイッチQ3をオフ、スイッチQ4をオンに制御した状態で、スイッチQ2のオンオフ制御を行ってもよい。このようにすれば、5.0VのUSB電圧VUSBから3.3Vのシステム電源電圧Vcc1までの降圧を、充電IC2と昇降圧DC/DCコンバータ8が分け合って行うことができる。このため、昇降圧DC/DCコンバータ8へ負荷や発熱が集中することを抑制できる。
(V USB power pass function)
The V USB power path function is effective, for example, when the power supply BAT cannot be used due to overdischarge or the like. The processor 21 turns on the switch Q1, turns on the switch Q2, turns off the switch Q3, and turns off the switch Q4. As a result, the USB voltage VUSB input to the input terminal VBUS is directly output from the switching terminal SW without being stepped down. The voltage output from the switching terminal SW is input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0. In this case as well, the step-up/step-down DC/DC converter 8 steps down the 5V system power supply voltage Vcc0 input to the input terminal VIN to generate and output the 3.3V system power supply voltage Vcc1. Note that even when the V USB power path function is enabled, the processor 21 may perform on/off control of the switch Q2 in a state in which the switch Q1 is turned on, the switch Q3 is turned off, and the switch Q4 is turned on. good. In this way, the charging IC 2 and the step-up/step-down DC/DC converter 8 can share the step-down from the USB voltage VUSB of 5.0V to the system power supply voltage Vcc1 of 3.3V. Therefore, concentration of load and heat on the step-up/step-down DC/DC converter 8 can be suppressed.
(VUSB&VBATパワーパス機能)
 VUSB&VBATパワーパス機能は、例えば、電源BATの充電が完了しており且つUSB接続が継続されている場合に有効となる。プロセッサ21は、スイッチQ1をオン、スイッチQ3をオフ、スイッチQ4をオンに制御した状態で、スイッチQ2のオンオフ制御を行う。プロセッサ21は、出力端子SYSの電圧が、電源BATの電圧(電源電圧VBAT)と同じになるようにスイッチQ2を制御する。これにより、入力端子VBUSに入力されたUSB電圧VUSBは降圧されて出力端子SYSから出力される。入力端子VBUSに入力されたUSB電圧VUSBが降圧されて出力端子SYSから出力される電圧と、電源BATから充電端子batを経由して出力端子SYSから出力される電圧は同じ値となる。このため、USB電圧VUSBを降圧して得た電圧を含む電力と、出力端子SYSから出力される電源電圧VBATを含む電力が合成されて、昇降圧DC/DCコンバータ8の入力端子VINに供給される。VUSB&VBATパワーパス機能の有効時には、充電IC2において、入力端子VBUSの電位が出力端子SYSの電位よりも高電位となるため、電源BATからの電力が入力端子VBUSから出力されることはない。
(V USB & V BAT power pass function)
The V USB & V BAT power pass function is valid, for example, when the charging of the power supply BAT is completed and the USB connection is continued. The processor 21 performs on/off control of the switch Q2 while controlling the switch Q1 to be on, the switch Q3 to be off, and the switch Q4 to be on. The processor 21 controls the switch Q2 so that the voltage of the output terminal SYS becomes the same as the voltage of the power supply BAT (power supply voltage V BAT ). As a result, the USB voltage VUSB input to the input terminal VBUS is stepped down and output from the output terminal SYS. The voltage output from the output terminal SYS after stepping down the USB voltage VUSB input to the input terminal VBUS and the voltage output from the output terminal SYS from the power supply BAT via the charging terminal bat have the same value. Therefore, the power including the voltage obtained by stepping down the USB voltage V USB and the power including the power supply voltage V BAT output from the output terminal SYS are synthesized, and the input terminal VIN of the step-up/step-down DC/DC converter 8 is supplied to the input terminal VIN. supplied. When the V USB & V BAT power pass function is enabled, the potential of the input terminal VBUS is higher than the potential of the output terminal SYS in the charging IC2, so the power from the power supply BAT is not output from the input terminal VBUS. .
 VUSB&VBATパワーパス機能の有効時には、昇降圧DC/DCコンバータ8は、電源電圧VBATの大きさによって昇圧と降圧のどちらを行うかを決める。昇降圧DC/DCコンバータ8は、電源電圧VBATが3.3V以上の場合には、入力端子VINに入力されるシステム電源電圧Vcc0を降圧して、3.3Vのシステム電源電圧Vcc1を生成して出力する。昇降圧DC/DCコンバータ8は、電源電圧VBATが3.3V未満の場合には、入力端子VINに入力されるシステム電源電圧Vcc0を昇圧して、3.3Vのシステム電源電圧Vcc1を生成して出力する。 When the V USB & V BAT power path function is enabled, the buck-boost DC/DC converter 8 determines whether to step up or down depending on the magnitude of the power supply voltage V BAT . When the power supply voltage V BAT is 3.3 V or more, the step-up/down DC/DC converter 8 steps down the system power supply voltage Vcc0 input to the input terminal VIN to generate a 3.3 V system power supply voltage Vcc1. output. When the power supply voltage V BAT is less than 3.3 V, the buck-boost DC/DC converter 8 boosts the system power supply voltage Vcc0 input to the input terminal VIN to generate a system power supply voltage Vcc1 of 3.3 V. output.
(VBATパワーパス機能)
 VBATパワーパス機能は、充電モード以外のモード(例えば、スリープモード)にて有効となる。プロセッサ21は、スイッチQ1とスイッチQ3をオフに制御する。これにより、充電端子batに入力された電源電圧VBATは、そのまま、出力端子SYSから出力され、システム電源電圧Vcc0として、昇降圧DC/DCコンバータ8の入力端子VINに入力される。この制御により、充電IC2の入力端子VBUSとスイッチング端子SWの間の電力伝達経路は、スイッチQ1の寄生ダイオードによりブロックされる。このため、出力端子SYSから出力される電源電圧VBATが、入力端子VBUSから出力されることはない。
(V BAT power pass function)
The V BAT power path function is enabled in modes other than charge mode (eg, sleep mode). The processor 21 turns off the switches Q1 and Q3. As a result, the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0. By this control, the power transmission path between the input terminal VBUS of the charging IC2 and the switching terminal SW is blocked by the parasitic diode of the switch Q1. Therefore, the power supply voltage VBAT output from the output terminal SYS is not output from the input terminal VBUS.
 VBATパワーパス機能の有効時には、昇降圧DC/DCコンバータ8は、電源電圧VBATの大きさによって昇圧と降圧のどちらを行うかを決める。昇降圧DC/DCコンバータ8は、入力端子VINに入力される電源電圧VBATが3.3V以上の場合には、電源電圧VBATを降圧して、3.3Vのシステム電源電圧Vcc1を生成して出力する。昇降圧DC/DCコンバータ8は、入力端子VINに入力される電源電圧VBATが3.3V未満の場合には、電源電圧VBATを昇圧して、3.3Vのシステム電源電圧Vcc1を生成して出力する。 When the V BAT power path function is enabled, the buck-boost DC/DC converter 8 determines whether to step up or down depending on the magnitude of the power supply voltage V BAT . When the power supply voltage V BAT input to the input terminal VIN is 3.3 V or higher, the step-up/down DC/DC converter 8 steps down the power supply voltage V BAT to generate a 3.3 V system power supply voltage Vcc1. output. When the power supply voltage V BAT input to the input terminal VIN is less than 3.3 V, the step-up/step-down DC/DC converter 8 boosts the power supply voltage V BAT to generate a system power supply voltage Vcc1 of 3.3 V. output.
(OTG機能)
 OTG機能は、VBATパワーパス機能と同時に有効となり、例えば、アクティブモードにて有効となる。OTG機能とVBATパワーパス機能の両方の有効時には、プロセッサ21は、スイッチQ1をオンに制御した状態で、スイッチQ3をオンオフ制御する。これにより、充電端子batに入力された電源電圧VBATは、そのまま、出力端子SYSから出力され、システム電源電圧Vcc0として、昇降圧DC/DCコンバータ8の入力端子VINに入力される。また、出力端子SYSから出力された電源電圧VBATは、充電IC2のスイッチング端子SWに入力される。プロセッサ21は、スイッチング端子SWに入力される電源電圧VBATがシステム電源電圧Vcc4と同じになるように、スイッチQ3を制御する。これにより、スイッチング端子SWに入力された電源電圧VBATは昇圧されて入力端子VBUSから出力される。入力端子VBUSから出力された電圧は、システム電源電圧Vcc4としてLED L1~L8に入力される。
(OTG function)
The OTG feature is enabled at the same time as the V BAT power path feature, eg, enabled in active mode. When both the OTG function and the V BAT power path function are valid, the processor 21 turns on/off the switch Q3 while turning on the switch Q1. As a result, the power supply voltage V BAT input to the charging terminal bat is directly output from the output terminal SYS and input to the input terminal VIN of the step-up/step-down DC/DC converter 8 as the system power supply voltage Vcc0. Also, the power supply voltage V BAT output from the output terminal SYS is input to the switching terminal SW of the charging IC2. Processor 21 controls switch Q3 so that power supply voltage VBAT input to switching terminal SW becomes equal to system power supply voltage Vcc4 . As a result, the power supply voltage VBAT input to the switching terminal SW is stepped up and output from the input terminal VBUS. The voltage output from the input terminal VBUS is input to the LEDs L1 to L8 as the system power supply voltage Vcc4.
 このように、充電IC2は、USB電圧VUSBを降圧する降圧コンバータとしての機能と、電源電圧VBATを昇圧する昇圧コンバータとしての機能を併せ持つ。充電IC2から昇降圧DC/DCコンバータ8に入力される電圧は、充電IC2の有効としている機能に応じてさまざまに変動する。しかし、このような変動があっても、昇降圧DC/DCコンバータ8が昇圧と降圧を選択的に実行することで、システム電源電圧Vcc1(システム電源電圧Vcc1を含む電力)を一定に保つことができる。なお、昇降圧DC/DCコンバータ8の入力端子VINに入力されるシステム電源電圧Vcc0の電圧がシステム電源電圧Vcc1の電圧である3.3Vと等しい場合、昇降圧DC/DCコンバータ8は、昇圧及び降圧を実行せず、システム電源電圧Vcc0をシステム電源電圧Vcc1として、出力端子VOUTから出力する。 Thus, the charging IC 2 has both a function as a step-down converter that steps down the USB voltage VUSB and a function as a step-up converter that steps up the power supply voltage VBAT. The voltage input from the charging IC 2 to the step-up/down DC/DC converter 8 fluctuates in various ways according to the functions enabled by the charging IC 2 . However, even with such fluctuations, the system power supply voltage Vcc1 (power including the system power supply voltage Vcc1) can be kept constant by selectively stepping up or stepping down the step-up/step-down DC/DC converter 8. can. When the voltage of the system power supply voltage Vcc0 input to the input terminal VIN of the buck-boost DC/DC converter 8 is equal to the voltage of the system power supply voltage Vcc1 of 3.3 V, the buck-boost DC/DC converter 8 The system power supply voltage Vcc0 is output from the output terminal VOUT as the system power supply voltage Vcc1 without stepping down.
<電気回路の消費電力>
 吸引器100を含む吸引システムでは、システムに含まれる全ての負荷のうち最も多くの電力を消費する負荷がヒータHTRとなっている。例えば、ヒータHTRの消費電力PHTRは、LED L1~L8それぞれの消費電力PLEDよりも大きくなっている。また、ヒータHTRの消費電力は、充電IC2の出力端子SYSに接続される全ての電子部品の消費電力の合計値よりも大きくなっている。そのため、ヒータHTRに接続された昇圧DC/DCコンバータ9が電源BATから供給を受けることのできる電流値は、充電IC2の出力端子SYSが出力可能な最大電流値よりも大きくすることが好ましい。
<Electric circuit power consumption>
In an aspiration system including the aspirator 100, the heater HTR is the load that consumes the most power of all the loads included in the system. For example, the power consumption P HTR of the heater HTR is greater than the power consumption P LED of each of the LEDs L1 to L8. Further, the power consumption of the heater HTR is larger than the total power consumption of all electronic components connected to the output terminal SYS of the charging IC2. Therefore, it is preferable that the current value that the boost DC/DC converter 9 connected to the heater HTR can receive from the power supply BAT is larger than the maximum current value that the output terminal SYS of the charging IC 2 can output.
<昇降圧DC/DCコンバータ8の好ましい形態>
 昇降圧DC/DCコンバータ8のコストやサイズを小さくする観点から、昇降圧DC/DCコンバータ8の最大入力電流と最大出力電流の少なくとも一方は、充電IC2の出力端子SYSが出力可能な最大電流より小さくすることが好ましい。このような構成とすると、充電IC2の出力端子SYSが最大電流を出力した場合、昇降圧DC/DCコンバータ8には過大な電流が入力される虞がある。しかし、最も多くの電力を消費するヒータHTRが昇降圧DC/DCコンバータ8の出力端子VOUTに接続されていないため、昇降圧DC/DCコンバータ8に過大な電流が入力されることはない。従って、このような構成としても、昇降圧DC/DCコンバータ8に不具合を生じさせることなく、コストやサイズを小さくすることができる。
<Preferred Form of Buck-Boost DC/DC Converter 8>
From the viewpoint of reducing the cost and size of the step-up/step-down DC/DC converter 8, at least one of the maximum input current and the maximum output current of the step-up/step-down DC/DC converter 8 should be smaller than the maximum current that the output terminal SYS of the charging IC 2 can output. Smaller is preferred. With such a configuration, when the output terminal SYS of the charging IC 2 outputs the maximum current, there is a possibility that an excessive current will be input to the step-up/step-down DC/DC converter 8 . However, since the heater HTR that consumes the most power is not connected to the output terminal VOUT of the buck-boost DC/DC converter 8, an excessive current is not input to the buck-boost DC/DC converter 8. Therefore, even with such a configuration, the step-up/step-down DC/DC converter 8 does not cause any problems, and the cost and size can be reduced.
<昇圧DC/DCコンバータ9の好ましい形態>
 昇圧DC/DCコンバータ9は、スイッチングレギュレータであることが好ましい。図20の例では、昇圧DC/DCコンバータ9が、PFM(Pulse Frequency Modulation)制御を行うPFMモードと、PWM(Pulse Width Modulation)制御を行うPWMモードとのいずれかで動作することで、昇圧を行うものとなっている。具体的には、昇圧DC/DCコンバータ9には、モード切替用のモード端子MODEが搭載されており、モード端子MODEの電位に応じて、動作モードの切り替えが可能に構成されている。なお、昇圧DC/DCコンバータ9がPFMモードで動作する場合の昇圧DC/DCコンバータ9のスイッチング端子SWへ入力可能な最大電流は、昇圧DC/DCコンバータ9がPWMモードで動作する場合の昇圧DC/DCコンバータ9のスイッチング端子SWへ入力可能な最大電流よりも大きいことが好ましい。
<Preferred form of step-up DC/DC converter 9>
Boost DC/DC converter 9 is preferably a switching regulator. In the example of FIG. 20, the step-up DC/DC converter 9 operates in either a PFM mode for performing PFM (Pulse Frequency Modulation) control or a PWM mode for performing PWM (Pulse Width Modulation) control. It is supposed to be done. Specifically, the step-up DC/DC converter 9 is equipped with a mode terminal MODE for mode switching, and is configured to be able to switch the operation mode according to the potential of the mode terminal MODE. Note that the maximum current that can be input to the switching terminal SW of the boost DC/DC converter 9 when the boost DC/DC converter 9 operates in the PFM mode is the boost DC when the boost DC/DC converter 9 operates in the PWM mode. It is preferably larger than the maximum current that can be input to the switching terminal SW of the /DC converter 9 .
 ヒータHTRに印加される電圧は、加熱制御時と温度検出制御時とで大きく異なる。つまり、昇圧DC/DCコンバータ9の負荷は、重負荷と軽負荷で変動することになる。PWMモードは、負荷に関らずスイッチング周波数が一定なことから、軽負荷時にはスイッチング損失が支配的になり効率が低下する。一方、PFMモードは、軽負荷時には電力の追加はそれ程いらないので、スイッチング周波数が低くなってスイッチング損失が減少する。このため、軽負荷時でも高効率を維持することができる。軽負荷から重負荷へ負荷の程度が増加すると、この効率の関係は逆転し、PWMモードの方がPFMモードより高効率である。このPWMモードの方が高効率である負荷の程度は、限られた範囲である。従って、重負荷と軽負荷で昇圧DC/DCコンバータ9の負荷が変動する場合、昇圧DC/DCコンバータ9は、PFMモードで動作することが好ましい。 The voltage applied to the heater HTR differs greatly between heating control and temperature detection control. That is, the load of the step-up DC/DC converter 9 fluctuates between heavy load and light load. In the PWM mode, since the switching frequency is constant regardless of the load, switching loss becomes dominant when the load is light, and efficiency decreases. On the other hand, the PFM mode does not require much additional power when the load is light, so the switching frequency is lowered and the switching loss is reduced. Therefore, high efficiency can be maintained even at light load. As the degree of load increases from light to heavy, this efficiency relationship reverses, with PWM mode being more efficient than PFM mode. The degree of load for which this PWM mode is more efficient is to a limited extent. Therefore, when the load of the step-up DC/DC converter 9 fluctuates between heavy load and light load, the step-up DC/DC converter 9 preferably operates in PFM mode.
 PWMモードとPFMモードのどちらで動作する場合でも、昇圧DC/DCコンバータ9へ入力可能な最大電流又は昇圧DC/DCコンバータ9が出力可能な最大電流の近傍では、昇圧DC/DCコンバータ9の効率は低下する傾向にある。特に、PFMモードで動作する場合、上記のような重負荷時には効率が低下する特性を持っているため、最大電流近傍では二重の要因により、DC/DCコンバータの効率が低下する。従って、前述したように、PFMモードで動作する場合の昇圧DC/DCコンバータ9のスイッチング端子SWへ入力可能な最大電流が、PWMモードで動作する場合の昇圧DC/DCコンバータ9のスイッチング端子SWへ入力可能な最大電流よりも大きい昇圧DC/DCコンバータ9を用いる。これにより、PFMモードで昇圧DC/DCコンバータ9を動作させても、重負荷時における効率の低下を抑制できる。 In the vicinity of the maximum current that can be input to the step-up DC/DC converter 9 or the maximum current that the step-up DC/DC converter 9 can output, the efficiency of the step-up DC/DC converter 9 is is trending downward. In particular, when operating in the PFM mode, the efficiency of the DC/DC converter decreases when the load is heavy, as described above. Therefore, as described above, the maximum current that can be input to the switching terminal SW of the boost DC/DC converter 9 when operating in the PFM mode is A step-up DC/DC converter 9 having a larger input current than the maximum current is used. Thereby, even if the step-up DC/DC converter 9 is operated in the PFM mode, it is possible to suppress the decrease in efficiency under heavy load.
 上述した効率の観点から、モード端子MODEの電位は、PFMモードが選択される電位に維持されていることが好ましい。図20の例では、モード端子MODEがどこにも接続されない状態となっていることで、昇圧DC/DCコンバータ9の動作モードはPFMモードに固定されている。これにより、昇圧DC/DCコンバータ9のスイッチング端子SWには、より大きな電流を入力できるようになり、ヒータHTRへより大きな電流を流すことが可能になる。なお、このようなモード端子MODEの電位を不定にする構成は、具体的一例に過ぎない点に留意されたい。昇圧DC/DCコンバータ9の仕様に拠っては、モード端子MODEの電位をハイレベル又はローレベルにすることで、PFMモードが選択される場合がある。このような場合においては、PFMモードが選択されるように、モード端子MODEの電位が適切な電位に維持されればよい。 From the viewpoint of efficiency described above, it is preferable that the potential of the mode terminal MODE is maintained at a potential at which the PFM mode is selected. In the example of FIG. 20, the operation mode of the boost DC/DC converter 9 is fixed to the PFM mode because the mode terminal MODE is not connected to anything. As a result, a larger current can be input to the switching terminal SW of the step-up DC/DC converter 9, and a larger current can be supplied to the heater HTR. It should be noted that such a configuration in which the potential of the mode terminal MODE is made indefinite is merely a specific example. Depending on the specifications of the boost DC/DC converter 9, the PFM mode may be selected by setting the potential of the mode terminal MODE to high level or low level. In such a case, the potential of mode terminal MODE should be maintained at an appropriate potential so that the PFM mode is selected.
<吸引器の効果>
 吸引器100によれば、通知部としてのLED L1~L8に対し、電源BATから直接に電圧を供給するのではなく、充電IC2を経由して電圧が供給される。電源BATの電圧は変動するものであるが、この変動する電圧がLED L1~L8に直接供給されないことで、LED L1~L8を安定して動作させることができる。LEDの輝度は供給される電圧に依存するため、安定な電圧をLED L1~L8に供給することができれば、LED L1~L8の輝度を安定させることができる。また、電源BATの充電制御を主な機能とする充電IC2が、システム電源電圧Vcc4を生成してLED L1~L8に供給しているため、システム電源電圧Vcc4を生成するための専用のICが不要となる。このため、吸引器100の小型化や低コスト化が可能になる。また、充電IC2は、電源電圧VBATを昇圧してシステム電源電圧Vcc4を生成するため、LED L1~L8に高圧電力を供給することができる。これにより、LED L1~L8を高輝度で点灯させることができ、良好なユーザインタフェースを実現できる。
<Effect of aspirator>
According to the aspirator 100, voltage is supplied to the LEDs L1 to L8 as the notification unit via the charging IC2 instead of directly from the power source BAT. Although the voltage of the power supply BAT fluctuates, the LEDs L1 to L8 can be stably operated by not directly supplying the fluctuating voltage to the LEDs L1 to L8. Since the brightness of the LEDs depends on the voltage supplied, the brightness of the LEDs L1 to L8 can be stabilized if a stable voltage can be supplied to the LEDs L1 to L8. In addition, since the charging IC2, whose main function is to control charging of the power supply BAT, generates the system power supply voltage Vcc4 and supplies it to the LEDs L1 to L8, a dedicated IC for generating the system power supply voltage Vcc4 is unnecessary. becomes. Therefore, the size and cost of the suction device 100 can be reduced. Moreover, since the charging IC 2 boosts the power supply voltage V BAT to generate the system power supply voltage Vcc4, it is possible to supply high voltage power to the LEDs L1 to L8. As a result, the LEDs L1 to L8 can be lit with high brightness, and a good user interface can be realized.
 また、吸引器100によれば、MCU1に対し、電源BATから直接に電力を供給するのではなく、充電IC2を経由して電力が供給される。電源BATの充電制御を主な機能とする充電IC2が、システム電源電圧Vcc0を生成してMCU1に供給しているため、システム電源電圧Vcc0を生成するための専用のICが不要となる。このため、吸引器100の小型化や低コスト化が可能になる。また、充電IC2とMCU1の間には、昇降圧DC/DCコンバータ8が設けられるため、一定電力をMCU1に供給できる。これにより、MCU1の動作を安定させることができる。 Also, according to the aspirator 100, power is supplied to the MCU1 via the charging IC2 instead of directly from the power supply BAT. Since the charging IC2 whose main function is to control charging of the power supply BAT generates the system power supply voltage Vcc0 and supplies it to the MCU1, a dedicated IC for generating the system power supply voltage Vcc0 is not required. Therefore, the size and cost of the suction device 100 can be reduced. Moreover, since the step-up/step-down DC/DC converter 8 is provided between the charging IC 2 and the MCU 1 , constant power can be supplied to the MCU 1 . Thereby, the operation of the MCU 1 can be stabilized.
 また、吸引器100によれば、USB接続がなされてLSW3が閉じた状態では、OTG機能は実行不能となる。このため、USB接続中における電源BATの電力消費を抑制でき、使用可能な電源BATの電力量を多くできる。また、USB接続がなされた直後の時点では、LSW3は開いているため、USB接続直後のノイズや突入電流がLED L1~L8へ供給されなくなり、LED L1~L8が故障する可能性を低減できる。また、USB接続直後の時点では、OTG機能が実行可能である。このため、USB接続された直後の外部電源からの電力をLED L1~L8に供給できない過渡期であっても、OTG機能によって電源BATからLED L1~L8に電力を供給できる。したがって、
LED L1~L8を動作させる機会を増やすことができ、吸引器100の商品性を向上できる。
Further, according to the aspirator 100, the OTG function cannot be executed when the USB connection is made and the LSW 3 is closed. Therefore, the power consumption of the power supply BAT during USB connection can be suppressed, and the usable power amount of the power supply BAT can be increased. In addition, since the LSW3 is open immediately after the USB connection is made, noise and rush current immediately after the USB connection are not supplied to the LEDs L1 to L8, and the possibility of failure of the LEDs L1 to L8 can be reduced. Also, the OTG function can be executed immediately after the USB connection. Therefore, even in a transitional period when the power from the external power source cannot be supplied to the LEDs L1 to L8 immediately after the USB connection, power can be supplied from the power supply BAT to the LEDs L1 to L8 by the OTG function. therefore,
The opportunity to operate the LEDs L1 to L8 can be increased, and the marketability of the inhaler 100 can be improved.
 また、吸引器100によれば、充電IC2が電源BATの電力をMCU1等の負荷にも供給可能なため、これら負荷に電力を供給するための専用のICが不要となり、吸引器100のコストを低減できる。 In addition, according to the sucker 100, the charging IC 2 can supply the power of the power supply BAT to the MCU 1 and other loads as well. can be reduced.
 なお、充電IC2の入力端子VBUSには、LED L1~L8とは別の通知部が更に接続されていてもよい。例えば、充電IC2の入力端子VBUSと振動モータMとを接続して、システム電源電圧Vcc4やUSB電圧VUSBが振動モータMに供給されるようにしたり、充電IC2の入力端子VBUSと不図示のスピーカとを接続して、システム電源電圧Vcc4やUSB電圧VUSBがスピーカに供給されるようにしたりする構成であってもよい。また、充電IC2の入力端子VBUSには、通知部以外のIC(図10に示されているICとは別体のIC)が接続される構成であってもよい。充電IC2の入力端子VBUSには、負荷として、通知部とこの別体のICの少なくとも一方のみが接続されていることが好ましい。 A notification unit other than the LEDs L1 to L8 may be connected to the input terminal VBUS of the charging IC2. For example, the input terminal VBUS of the charging IC2 and the vibration motor M are connected to supply the system power supply voltage Vcc4 and the USB voltage VUSB to the vibration motor M. may be connected to supply the system power supply voltage Vcc4 and the USB voltage VUSB to the speaker. Also, the input terminal VBUS of the charging IC 2 may be connected to an IC other than the notification unit (an IC separate from the IC shown in FIG. 10). It is preferable that at least one of the notification unit and the separate IC is connected as a load to the input terminal VBUS of the charging IC2.
 また、吸引器100は、電源BATから充電IC2を経由してMCU1に電力を供給する第一放電経路と、電源BATから充電IC2を経由せずにヒータHTRに電力を供給する第二放電経路と、を有する。このため、第一放電経路に流すべき電流値(充電IC2の出力端子SYSが出力可能な最大電流)は、第二放電経路に流すべき電流値よりも小さくて済む。したがって、大電流に耐えうるような高価かつ大規模な充電IC2が不要になり、吸引器100の小型化や低コスト化が可能になる。MCU1とヒータHTRは同時に動作し得るが、これらが同時に動作した場合でも、第一放電経路と第二放電経路が存在することで、充電IC2に過度な負担をかけることなく、これらに十分な電力を供給できる。 The sucker 100 also has a first discharge path for supplying power from the power supply BAT via the charging IC2 to the MCU1, and a second discharge path for supplying power from the power supply BAT to the heater HTR without passing through the charging IC2. , has Therefore, the current value to be passed through the first discharge path (maximum current that can be output from the output terminal SYS of the charging IC2) can be smaller than the current value to be passed through the second discharge path. Therefore, an expensive and large-scale charging IC 2 that can withstand a large current becomes unnecessary, and the size and cost of the sucker 100 can be reduced. MCU1 and heater HTR can operate simultaneously, but even if they operate simultaneously, the presence of the first discharge path and the second discharge path ensures that sufficient power is supplied to them without excessively burdening charging IC2. can supply
 また、吸引器100によれば、大電流が流れる第二放電経路が、第一放電経路とは別の基板に設けられる。具体的には、第一放電経路はMCU搭載基板161に設けられ、第二放電経路はレセプタクル搭載基板162に設けられる。このため、1つの基板への熱集中を回避でき、吸引器100の耐久性を向上できる。 Also, according to the suction device 100, the second discharge path through which a large current flows is provided on a substrate different from the first discharge path. Specifically, the first discharge path is provided on the MCU mounting board 161 and the second discharge path is provided on the receptacle mounting board 162 . Therefore, heat concentration on one substrate can be avoided, and the durability of the aspirator 100 can be improved.
 また、吸引器100によれば、充電IC2を経由せずに電源BATから電力供給を受ける電子部品が全て同一の基板(レセプタクル搭載基板162)に設けられる。このため、電気回路が複雑化するのを防ぐことができる。 Further, according to the aspirator 100, all electronic components that receive power supply from the power source BAT without passing through the charging IC 2 are provided on the same substrate (receptacle mounting substrate 162). Therefore, it is possible to prevent the electric circuit from becoming complicated.
 また、吸引器100によれば、電源BATからヒータHTRへ放電する放電経路に、昇圧DC/DCコンバータ9が設けられる。このため、充電IC2の出力端子SYSの最大電流を気にせずに、昇圧DC/DCコンバータ9によって大電力をヒータHTRへ供給できる。したがって、吸引器100の低コスト化や小型化を実現しつつ、ヒータHTRによるロッド500の加熱を効率よく行うことができる。 Further, according to the aspirator 100, the step-up DC/DC converter 9 is provided in the discharge path for discharging from the power supply BAT to the heater HTR. Therefore, high power can be supplied to the heater HTR by the boost DC/DC converter 9 without worrying about the maximum current of the output terminal SYS of the charging IC 2 . Therefore, it is possible to efficiently heat the rod 500 by the heater HTR while realizing cost reduction and miniaturization of the aspirator 100 .
 また、吸引器100は、USB接続時においては、充電IC2を経由せずにLED L1~L8へ放電する放電経路(レセプタクルRCPからLED L1~L8に至る経路)を有する。これにより、外部電源から充電IC2を経由してLED L1~L8に放電する経路を設ける場合と比べて、大電流に耐えうるような高価かつ大規模な充電IC2が不要になる。このため、吸引器100の低コスト化や小型化を実現できる。 In addition, the aspirator 100 has a discharge path (a path from the receptacle RCP to the LEDs L1 to L8) that discharges to the LEDs L1 to L8 without going through the charging IC2 when connected to the USB. This eliminates the need for an expensive and large-scale charging IC 2 capable of withstanding a large current, compared to the case of providing a path for discharging from the external power supply to the LEDs L1 to L8 via the charging IC 2 . Therefore, cost reduction and miniaturization of the suction device 100 can be realized.
 また、吸引器100では、充電IC2の入力端子VBUSに接続される電子部品が、LED L1~L8等の通知部、又は、図示されているICとは別体のICである。したがって、ノイズや突入電流が混入やすい外部電源からの電力が、MCU1、昇降圧DC/DCコンバータ8、ROM6、残量計IC12、保護IC10、昇圧DC/DCコンバータ9等の精密な電子部品に供給されるのを防ぐことができ、耐久性を高めることができる。 Also, in the aspirator 100, the electronic component connected to the input terminal VBUS of the charging IC2 is a notification unit such as LEDs L1 to L8, or an IC separate from the illustrated IC. Therefore, the power from the external power supply, which is susceptible to noise and inrush current, is supplied to precision electronic components such as the MCU 1, the step-up/step-down DC/DC converter 8, the ROM 6, the fuel gauge IC 12, the protection IC 10, and the step-up DC/DC converter 9. You can prevent it from being damaged and increase its durability.
 また、吸引器100では、LSW3とレセプタクルRCPの間に過電圧保護IC11が設けられる。過電圧保護IC11が存在することで、USB接続された瞬間に生じ得るノイズや突入電流を、LSW3だけでなく、過電圧保護IC11によってもブロックできる。これにより、吸引器100の耐久性を高めることができる。 Also, in the aspirator 100, an overvoltage protection IC 11 is provided between the LSW 3 and the receptacle RCP. Due to the presence of the overvoltage protection IC 11, not only the LSW 3 but also the overvoltage protection IC 11 can block noise and rush current that may occur at the moment of USB connection. Thereby, the durability of the aspirator 100 can be improved.
 また、吸引器100では、LED L1~L8のそれぞれが、MCU1の内蔵スイッチをオンしない限りは、動作しない構成である。このため、USB接続直後のノイズや突入電流がLED L1~L8へ供給されるのを防ぐことができ、LED L1~L8が故障する可能性を低減できる。また、スイッチがMCU1に内蔵されるため、MCU1の外部にスイッチが設けられる場合に比べ、スイッチの耐久性を向上できる。 Also, in the aspirator 100, each of the LEDs L1 to L8 does not operate unless the built-in switch of the MCU1 is turned on. Therefore, it is possible to prevent noise and rush current immediately after the USB connection from being supplied to the LEDs L1 to L8, and reduce the possibility of failure of the LEDs L1 to L8. Moreover, since the switch is built in the MCU1, the durability of the switch can be improved as compared with the case where the switch is provided outside the MCU1.
 吸引器100が負荷に供給する電圧のうち大きなものとしては、システム電源電圧Vcc4と駆動電圧Vbstがある。システム電源電圧Vcc4は、外部電源からの電力と電源BATからの電力のそれぞれから生成される。一方、駆動電圧Vbstは、電源BATからの電力のみで生成される。このように、駆動電圧Vbstに関しては、外部電源の電力から生成されない構成とすることで、高電圧の電力が流れるラインが複雑化せずにすむ。これにより、回路の複雑化が回避されるので、吸引器100のコストを低減できる。また、システム電源電圧Vcc4を含む電力が供給される給電路と、駆動電圧Vbstを含む電力が供給される給電路とは別の基板上に存在する。具体的には、システム電源電圧Vcc4を含む電力が供給される給電路は、MCU搭載基板161とLED搭載基板163に設けられる。駆動電圧Vbstを含む電力が供給される給電路は、レセプタクル搭載基板162に設けられる。このように、高電圧の印加される2つの給電路が別の基板に設けられることで、これら給電路のノイズが重畳してより対処が難しいノイズになることが抑制される。このため、吸引器100を安定して動作させることができる。 Among the voltages supplied to the load by the sucker 100, the system power supply voltage Vcc4 and the driving voltage Vbst are the major ones. System power supply voltage Vcc4 is generated from power from an external power supply and power from power supply BAT. On the other hand, the drive voltage Vbst is generated only by power from the power supply BAT. As described above, the driving voltage Vbst is not generated from the power of the external power supply, so that the line through which the high voltage power flows can be prevented from becoming complicated. This avoids complication of the circuit, so the cost of the suction device 100 can be reduced. Further, the power supply line to which the power including the system power supply voltage Vcc4 is supplied and the power supply line to which the power including the drive voltage Vbst is supplied are on different substrates. Specifically, a power supply line to which power including the system power supply voltage Vcc4 is supplied is provided in the MCU mounting board 161 and the LED mounting board 163 . A power supply path to which power including the drive voltage Vbst is supplied is provided on the receptacle mounting board 162 . In this way, by providing the two feeder lines to which a high voltage is applied on different substrates, it is possible to suppress the noise of these feeder lines from being superimposed and becoming more difficult to deal with. Therefore, the aspirator 100 can be stably operated.
 また、吸引器100では、電源BATに接続される電源コネクタと、外部電源に接続されるレセプタクルRCPと、ヒータHTRに接続されるヒータコネクタCnとが、同一の基板(レセプタクル搭載基板162)に設けられる。これにより、吸引器100内の様々な箇所における熱の発生が抑制されるので、吸引器100の耐久性が向上する。 Further, in the aspirator 100, the power connector connected to the power source BAT, the receptacle RCP connected to the external power source, and the heater connector Cn connected to the heater HTR are provided on the same substrate (receptacle mounting substrate 162). be done. As a result, the heat generation at various locations in the suction device 100 is suppressed, so the durability of the suction device 100 is improved.
 以上、図面を参照しながら各種の実施の形態について説明したが、本発明はかかる例に限定されないことは言うまでもない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例又は修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。 Various embodiments have been described above with reference to the drawings, but it goes without saying that the present invention is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications or modifications within the scope described in the claims, and these also belong to the technical scope of the present invention. Understood.
 例えば、昇圧DC/DCコンバータ9の出力端子VOUTとグランドラインの間に、ヒータHTRとは別のヒータ(加熱対象がヒータHTRとは異なるもの)やその他の負荷を接続するためのコネクタが接続される構成としてもよい。 For example, between the output terminal VOUT of the step-up DC/DC converter 9 and the ground line, a connector for connecting a heater other than the heater HTR (a heating object different from the heater HTR) and other loads is connected. It may be configured to be
 また、図10では、昇圧DC/DCコンバータ9の出力端子VOUTとヒータコネクタCnの正極側との間に、スイッチS3を含む回路と、スイッチS4及び抵抗器Rsを含む回路の並列回路が接続されるものとしているが、この並列回路を、ヒータコネクタCnの負極側とスイッチS6の間に接続し、昇圧DC/DCコンバータ9の出力端子VOUTとヒータコネクタCnの正極側とを直接接続する構成としてもよい。 10, a parallel circuit of a circuit including a switch S3 and a circuit including a switch S4 and a resistor Rs is connected between the output terminal VOUT of the step-up DC/DC converter 9 and the positive electrode side of the heater connector Cn. However, this parallel circuit is connected between the negative electrode side of the heater connector Cn and the switch S6, and the output terminal VOUT of the step-up DC/DC converter 9 and the positive electrode side of the heater connector Cn are directly connected. good too.
 本明細書には少なくとも以下の事項が記載されている。なお、括弧内には、上記した実施形態において対応する構成要素等を示しているが、これに限定されるものではない。 At least the following matters are described in this specification. In addition, although the parenthesis shows the components corresponding to the above-described embodiment, the present invention is not limited to this.
(1)
 エアロゾル源を加熱してエアロゾルを生成するエアロゾル生成装置の電源ユニット(吸引器100)であって、
 電源(電源BAT)と、
 外部電源へ電気的に接続可能なコネクタ(レセプタクルRCP)と、
 第1負荷(MCU1)と、
 前記コネクタへ接続される入力端子(入力端子VBUS)と前記電源へ接続される充電端子(充電端子bat)と前記第1負荷へ接続される出力端子(出力端子SYS)とを含み、前記入力端子へ入力される電力を変換して前記充電端子から出力するように構成される充電IC(充電IC2)と、
 前記出力端子が出力可能な最大電流より大きな電流を前記電源から供給可能であり、且つ、前記第1負荷とは別の第2負荷(ヒータHTR)へ接続される放電経路と、を備え、
 前記充電ICは、前記電源から前記充電端子へ入力される電力を前記出力端子を介して前記第1負荷へ供給可能に構成される、
 エアロゾル生成装置の電源ユニット。
(1)
A power supply unit (aspirator 100) of an aerosol generator that heats an aerosol source to generate an aerosol,
a power supply (power supply BAT);
a connector (receptacle RCP) electrically connectable to an external power supply;
a first load (MCU1);
an input terminal (input terminal VBUS) connected to the connector, a charging terminal (charging terminal bat) connected to the power supply, and an output terminal (output terminal SYS) connected to the first load; a charging IC (charging IC2) configured to convert electric power input to and output from the charging terminal;
a discharge path capable of supplying a current larger than the maximum current that the output terminal can output from the power supply and connected to a second load (heater HTR) different from the first load;
The charging IC is configured to be capable of supplying power input from the power supply to the charging terminal to the first load via the output terminal.
Power supply unit for the aerosol generator.
 (1)によれば、出力端子の最大電流を第2負荷へ供給される電流より低くできることで、大電流に耐えうるような高価かつ大規模な充電ICが不要になる。このため、エアロゾル生成装置の低コスト化や小型化を実現できる。 According to (1), the maximum current of the output terminal can be made lower than the current supplied to the second load, thereby eliminating the need for an expensive and large-scale charging IC that can withstand a large current. Therefore, it is possible to reduce the cost and size of the aerosol generator.
(2)
 (1)に記載のエアロゾル生成装置の電源ユニットであって、
 前記放電経路は、前記電源の出力電圧を昇圧して前記第2負荷へ印加可能な昇圧コンバータ(昇圧DC/DCコンバータ9)を含む、
 エアロゾル生成装置の電源ユニット。
(2)
(1) The power supply unit of the aerosol generator,
The discharge path includes a boost converter (boost DC/DC converter 9) capable of boosting the output voltage of the power supply and applying it to the second load,
Power supply unit for the aerosol generator.
 (2)によれば、充電ICの出力端子の最大電流を気にせずに、昇圧コンバータによって大電力を第2負荷へ供給できる。このため、エアロゾル生成装置の低コスト化や小型化を実現しつつ、第2負荷による効果を増大できる。 According to (2), high power can be supplied to the second load by the boost converter without worrying about the maximum current of the output terminal of the charging IC. Therefore, the effect of the second load can be increased while realizing cost reduction and miniaturization of the aerosol generating device.
(3)
 (2)に記載のエアロゾル生成装置の電源ユニットであって、
 前記昇圧コンバータは、モード端子(モード端子MODE)を含むスイッチングレギュレータを含み、
 前記スイッチングレギュレータは、前記モード端子の電位に基づき、PFMモードとPWMモードのうち一方を選択して前記電源の出力電圧を昇圧するように構成され、
 前記モード端子の電位は、変更不能に構成されている、
 エアロゾル生成装置の電源ユニット。
(3)
(2) The power supply unit of the aerosol generator,
The boost converter includes a switching regulator including a mode terminal (mode terminal MODE),
The switching regulator is configured to select one of a PFM mode and a PWM mode based on the potential of the mode terminal to boost the output voltage of the power supply,
The potential of the mode terminal is configured to be unchangeable,
Power supply unit for the aerosol generator.
 (3)によれば、PFMモードとPWMモードの切り替え時に生じる得る不安定な電流を第2負荷へ供給せずに済むので、第2負荷の動作が安定する。 According to (3), it is not necessary to supply the second load with an unstable current that may occur when switching between the PFM mode and the PWM mode, so the operation of the second load is stabilized.
(4)
 (3)に記載のエアロゾル生成装置の電源ユニットであって、
 前記モード端子の電位は、前記PFMモードと前記PWMモードのうち前記スイッチングレギュレータへ入力可能な最大電流が大きい方のモードが選択される電位に維持されている、
 エアロゾル生成装置の電源ユニット。
(4)
(3) The power supply unit of the aerosol generator,
The potential of the mode terminal is maintained at a potential that selects the PFM mode or the PWM mode, whichever mode has a larger maximum current that can be input to the switching regulator.
Power supply unit for the aerosol generator.
 (4)によれば、スイッチングレギュレータが最大電流の高いモードに固定される。このため、より大きな電流を第2負荷へ供給できるだけでなく、大きな電流を流しても最大電流を越えにくくなる。この結果、第2負荷の動作を安定にしつつ、第2負荷による効果を増大できる。また、大きな電流を流しても最大電流の近傍になりにくくなるため、スイッチングレギュレータの効率が低下しにくくなる。 According to (4), the switching regulator is fixed to a mode with a high maximum current. Therefore, not only can a larger current be supplied to the second load, but even if a large current flows, it is difficult for the current to exceed the maximum current. As a result, the effect of the second load can be increased while stabilizing the operation of the second load. In addition, even if a large current flows, it is difficult for the current to be close to the maximum current, so the efficiency of the switching regulator is less likely to decrease.
(5)
 (3)に記載のエアロゾル生成装置の電源ユニットであって、
 前記モード端子の電位は、前記PFMモードが選択される電位に維持されている、
 エアロゾル生成装置の電源ユニット。
(5)
(3) The power supply unit of the aerosol generator,
a potential of the mode terminal is maintained at a potential at which the PFM mode is selected;
Power supply unit for the aerosol generator.
 (5)によれば、スイッチングレギュレータが多くの電流域で高い変換効率を実現できるPFMモードに固定される。このため、電圧変換による電力損失が減り、電源の蓄えた電力の利用効率を向上できる。 According to (5), the switching regulator is fixed to the PFM mode in which high conversion efficiency can be achieved in many current ranges. As a result, the power loss due to voltage conversion is reduced, and the utilization efficiency of the power stored in the power supply can be improved.
(6)
 (5)に記載のエアロゾル生成装置の電源ユニットであって、
 前記第2負荷は、前記エアロゾル源を加熱可能なヒータ(ヒータHTR)であり、
 前記スイッチングレギュレータは、入力端子(スイッチング端子SW)を含み、
 正極側と負極側を有し、前記ヒータが接続されるヒータコネクタ(ヒータコネクタCn)と、
 前記電源と前記ヒータコネクタの前記正極側の間又は前記ヒータコネクタの前記負極側とグランドの間に接続され、且つ、第1スイッチ(スイッチS3)を含む第1回路と、
 前記第1回路に並列接続され、前記第1回路よりも高い抵抗値を有し、抵抗器(抵抗器Rs)及び第2スイッチ(スイッチS4)を含む第2回路と、
 前記第1スイッチ及び前記第2スイッチの開閉を制御可能に構成されるコントローラ(MCU1)と、を備え、
 前記コントローラは、
 前記第1スイッチと前記第2スイッチのうち前記第2スイッチのみを閉じている時、前記抵抗器又は前記ヒータに印加される電圧を取得可能であり、
 前記抵抗器又は前記ヒータに印加される電圧に基づき、所定の制御を実行するように構成される、
 エアロゾル生成装置の電源ユニット。
(6)
(5) The power supply unit of the aerosol generator,
the second load is a heater (heater HTR) capable of heating the aerosol source;
The switching regulator includes an input terminal (switching terminal SW),
a heater connector (heater connector Cn) having a positive electrode side and a negative electrode side and to which the heater is connected;
a first circuit connected between the power source and the positive electrode side of the heater connector or between the negative electrode side of the heater connector and ground and including a first switch (switch S3);
a second circuit connected in parallel to the first circuit, having a resistance value higher than that of the first circuit, and including a resistor (resistor Rs) and a second switch (switch S4);
a controller (MCU1) configured to control opening and closing of the first switch and the second switch;
The controller is
a voltage applied to the resistor or the heater can be obtained when only the second switch of the first switch and the second switch is closed;
configured to perform a predetermined control based on the voltage applied to the resistor or the heater;
Power supply unit for the aerosol generator.
 (6)によれば、高抵抗な第2回路のスイッチをONしている時と、低抵抗な第1回路のスイッチをONしている時とで、スイッチングレギュレータの入力電流が大きく異なるが、スイッチングレギュレータがPFMモードに固定されていることで、どちらのスイッチがONの時でも高い変換効率を実現できる。また、スイッチングレギュレータのモード切替時に生じ得る不安定な電流が、コントローラが取得する電圧値に与えるノイズを低減できる。したがって、電源の蓄えた電力の利用効率を向上させつつ、コントローラが実行する制御の精度を向上できる。 According to (6), the input current of the switching regulator differs greatly between when the high-resistance second circuit switch is on and when the low-resistance first circuit switch is on. Since the switching regulator is fixed to the PFM mode, high conversion efficiency can be achieved when either switch is ON. In addition, it is possible to reduce the noise given to the voltage value acquired by the controller, which is caused by an unstable current that may occur when the mode of the switching regulator is switched. Therefore, it is possible to improve the accuracy of the control executed by the controller while improving the utilization efficiency of the power stored in the power supply.
(7)
 (2)から(6)のいずれかに記載のエアロゾル生成装置の電源ユニットであって、
 第1基板(MCU搭載基板161)と、
 前記第1基板とは別体の第2基板(レセプタクル搭載基板162)と、を備え、
 前記充電ICは、前記第1基板に設けられ、
 前記昇圧コンバータは、前記第2基板に設けられる、
 エアロゾル生成装置の電源ユニット。
(7)
The power unit of the aerosol generator according to any one of (2) to (6),
a first substrate (MCU mounting substrate 161);
A second substrate (receptacle mounting substrate 162) separate from the first substrate,
The charging IC is provided on the first substrate,
The boost converter is provided on the second substrate,
Power supply unit for the aerosol generator.
 (7)によれば、電源から充電ICを経由して第1負荷に放電される経路と、放電経路と、が異なる基板に設けられる。換言すれば、動作時に発熱しやすい充電ICと、昇圧コンバータと、が異なる基板に設けられるため、1つの基板への熱集中を回避できる。この結果、エアロゾル生成装置の耐久性を向上できる。 According to (7), the path for discharging from the power supply to the first load via the charging IC and the discharge path are provided on different substrates. In other words, since the charge IC and the boost converter, which tend to generate heat during operation, are provided on different substrates, heat concentration on one substrate can be avoided. As a result, the durability of the aerosol generator can be improved.
(8)
 (1)から(7)のいずれかに記載のエアロゾル生成装置の電源ユニットであって、
 前記出力端子と前記第1負荷の間に接続され、一定電圧を出力するように構成される電圧変換器(昇降圧DC/DCコンバータ8)を備える、
 エアロゾル生成装置の電源ユニット。
(8)
A power supply unit for an aerosol generator according to any one of (1) to (7),
A voltage converter (buck-boost DC/DC converter 8) connected between the output terminal and the first load and configured to output a constant voltage;
Power supply unit for the aerosol generator.
 (8)によれば、第1負荷に一定電圧を供給できるので、第1負荷の動作が安定する。 According to (8), since a constant voltage can be supplied to the first load, the operation of the first load is stabilized.
(9)
 (8)に記載のエアロゾル生成装置の電源ユニットであって、
 前記電圧変換器の最大入力電流と最大出力電流の少なくとも一方は、前記出力端子が出力可能な最大電流より小さい、
 エアロゾル生成装置の電源ユニット。
(9)
(8) The power supply unit of the aerosol generator,
At least one of the maximum input current and the maximum output current of the voltage converter is smaller than the maximum current that the output terminal can output,
Power supply unit for the aerosol generator.
 (9)によれば、電圧変換器はその最大出力電流と最大入力電流が小さくてよいため、コストやサイズが小さくなる。一方、充電ICは、電源の充電という重要な機能を担っているため、やや余裕がある設計とすることで、故障する虞が大幅に低減する。この結果、エアロゾル生成装置の耐久性を向上させつつ、そのコストを低減できる。 According to (9), the voltage converter can have a small maximum output current and a small maximum input current, so the cost and size can be reduced. On the other hand, since the charging IC has an important function of charging the power supply, designing it with a little margin greatly reduces the risk of failure. As a result, the cost can be reduced while improving the durability of the aerosol generating device.
(10)
 (9)に記載のエアロゾル生成装置の電源ユニットであって、
 第1基板(MCU搭載基板161)と、
 前記第1基板とは別体の第2基板(レセプタクル搭載基板162)と、を備え、
 前記充電ICと前記電圧変換器は、前記第1基板と前記第2基板のうち前記第1基板のみに設けられる、
 エアロゾル生成装置の電源ユニット。
(10)
(9) The power supply unit of the aerosol generator,
a first substrate (MCU mounting substrate 161);
A second substrate (receptacle mounting substrate 162) separate from the first substrate,
The charging IC and the voltage converter are provided only on the first substrate out of the first substrate and the second substrate,
Power supply unit for the aerosol generator.
 (10)によれば、充電ICと電圧変換器が近くなり、これらを結ぶ導線の抵抗が低くなる。また、電圧変換器に入力される電流や電圧が不要に小さくならずに済む。これらにより、導線抵抗による損失と電圧変換による損失が低減されるので、電源が蓄えた電力の利用効率が向上するばかりか、熱の発生を抑制できる。 According to (10), the charging IC and the voltage converter become closer, and the resistance of the conductor connecting them becomes lower. Also, the current and voltage input to the voltage converter do not need to be reduced unnecessarily. As a result, the loss due to wire resistance and the loss due to voltage conversion are reduced, so that not only is the efficiency of utilization of electric power stored in the power supply improved, but also the generation of heat can be suppressed.
 以上、図面を参照しながら各種の実施の形態について説明したが、本発明はかかる例に限定されないことは言うまでもない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例又は修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。また、発明の趣旨を逸脱しない範囲において、上記実施の形態における各構成要素を任意に組み合わせてもよい。 Various embodiments have been described above with reference to the drawings, but it goes without saying that the present invention is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications or modifications within the scope described in the claims, and these also belong to the technical scope of the present invention. Understood. Moreover, each component in the above embodiments may be combined arbitrarily without departing from the gist of the invention.
 なお、本出願は、2021年5月10日出願の日本特許出願(特願2021-079872)に基づくものであり、その内容は本出願の中に参照として援用される。 This application is based on a Japanese patent application (Japanese Patent Application No. 2021-079872) filed on May 10, 2021, the content of which is incorporated herein by reference.
100 吸引器
1 MCU
HTR ヒータ
BAT 電源
Cn ヒータコネクタ
RCP レセプタクル
2 充電IC
L1~L8 LED
100 aspirator 1 MCU
HTR Heater BAT Power supply Cn Heater connector RCP Receptacle 2 Charging IC
L1~L8 LEDs

Claims (10)

  1.  エアロゾル源を加熱してエアロゾルを生成するエアロゾル生成装置の電源ユニットであって、
     電源と、
     外部電源へ電気的に接続可能なコネクタと、
     第1負荷と、
     前記コネクタへ接続される入力端子と前記電源へ接続される充電端子と前記第1負荷へ接続される出力端子とを含み、前記入力端子へ入力される電力を変換して前記充電端子から出力するように構成される充電ICと、
     前記出力端子が出力可能な最大電流より大きな電流を前記電源から供給可能であり、且つ、前記第1負荷とは別の第2負荷へ接続される放電経路と、を備え、
     前記充電ICは、前記電源から前記充電端子へ入力される電力を前記出力端子を介して前記第1負荷へ供給可能に構成される、
     エアロゾル生成装置の電源ユニット。
    A power unit for an aerosol generator that heats an aerosol source to generate an aerosol,
    a power supply;
    a connector electrically connectable to an external power supply;
    a first load;
    An input terminal connected to the connector, a charging terminal connected to the power supply, and an output terminal connected to the first load, converting power input to the input terminal and outputting the power from the charging terminal. a charging IC configured to:
    a discharge path capable of supplying a current larger than the maximum current that the output terminal can output from the power supply and connected to a second load different from the first load,
    The charging IC is configured to be capable of supplying power input from the power supply to the charging terminal to the first load via the output terminal.
    Power supply unit for the aerosol generator.
  2.  請求項1に記載のエアロゾル生成装置の電源ユニットであって、
     前記放電経路は、前記電源の出力電圧を昇圧して前記第2負荷へ印加可能な昇圧コンバータを含む、
     エアロゾル生成装置の電源ユニット。
    A power supply unit of the aerosol generator according to claim 1,
    The discharge path includes a boost converter capable of boosting the output voltage of the power supply and applying it to the second load.
    Power supply unit for the aerosol generator.
  3.  請求項2に記載のエアロゾル生成装置の電源ユニットであって、
     前記昇圧コンバータは、モード端子を含むスイッチングレギュレータを含み、
     前記スイッチングレギュレータは、前記モード端子の電位に基づき、PFMモードとPWMモードのうち一方を選択して前記電源の出力電圧を昇圧するように構成され、
     前記モード端子の電位は、変更不能に構成されている、
     エアロゾル生成装置の電源ユニット。
    A power supply unit of the aerosol generator according to claim 2,
    the boost converter includes a switching regulator including a mode terminal;
    The switching regulator is configured to select one of a PFM mode and a PWM mode based on the potential of the mode terminal to boost the output voltage of the power supply,
    The potential of the mode terminal is configured to be unchangeable,
    Power supply unit for the aerosol generator.
  4.  請求項3に記載のエアロゾル生成装置の電源ユニットであって、
     前記モード端子の電位は、前記PFMモードと前記PWMモードのうち前記スイッチングレギュレータへ入力可能な最大電流が大きい方のモードが選択される電位に維持されている、
     エアロゾル生成装置の電源ユニット。
    A power supply unit of the aerosol generator according to claim 3,
    The potential of the mode terminal is maintained at a potential that selects the PFM mode or the PWM mode, whichever mode has a larger maximum current that can be input to the switching regulator.
    Power supply unit for the aerosol generator.
  5.  請求項3に記載のエアロゾル生成装置の電源ユニットであって、
     前記モード端子の電位は、前記PFMモードが選択される電位に維持されている、
     エアロゾル生成装置の電源ユニット。
    A power supply unit of the aerosol generator according to claim 3,
    a potential of the mode terminal is maintained at a potential at which the PFM mode is selected;
    Power supply unit for the aerosol generator.
  6.  請求項5に記載のエアロゾル生成装置の電源ユニットであって、
     前記第2負荷は、前記エアロゾル源を加熱可能なヒータであり、
     前記スイッチングレギュレータは、入力端子を含み、
     正極側と負極側を有し、前記ヒータが接続されるヒータコネクタと、
     前記電源と前記ヒータコネクタの前記正極側の間又は前記ヒータコネクタの前記負極側とグランドの間に接続され、且つ、第1スイッチを含む第1回路と、
     前記第1回路に並列接続され、前記第1回路よりも高い抵抗値を有し、抵抗器及び第2スイッチを含む第2回路と、
     前記第1スイッチ及び前記第2スイッチの開閉を制御可能に構成されるコントローラと、を備え、
     前記コントローラは、
     前記第1スイッチと前記第2スイッチのうち前記第2スイッチのみを閉じている時、前記抵抗器又は前記ヒータに印加される電圧を取得可能であり、
     前記抵抗器又は前記ヒータに印加される電圧に基づき、所定の制御を実行するように構成される、
     エアロゾル生成装置の電源ユニット。
    A power supply unit of the aerosol generator according to claim 5,
    the second load is a heater capable of heating the aerosol source;
    The switching regulator includes an input terminal,
    a heater connector having a positive electrode side and a negative electrode side and to which the heater is connected;
    a first circuit connected between the power source and the positive electrode side of the heater connector or between the negative electrode side of the heater connector and a ground and including a first switch;
    a second circuit connected in parallel to the first circuit and having a higher resistance value than the first circuit and including a resistor and a second switch;
    a controller configured to be able to control opening and closing of the first switch and the second switch;
    The controller is
    a voltage applied to the resistor or the heater can be obtained when only the second switch of the first switch and the second switch is closed;
    configured to perform a predetermined control based on the voltage applied to the resistor or the heater;
    Power supply unit for the aerosol generator.
  7.  請求項2から6のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
     第1基板と、
     前記第1基板とは別体の第2基板と、を備え、
     前記充電ICは、前記第1基板に設けられ、
     前記昇圧コンバータは、前記第2基板に設けられる、
     エアロゾル生成装置の電源ユニット。
    A power supply unit for an aerosol generator according to any one of claims 2 to 6,
    a first substrate;
    a second substrate separate from the first substrate,
    The charging IC is provided on the first substrate,
    The boost converter is provided on the second substrate,
    Power supply unit for the aerosol generator.
  8.  請求項1から7のいずれか1項に記載のエアロゾル生成装置の電源ユニットであって、
     前記出力端子と前記第1負荷の間に接続され、一定電圧を出力するように構成される電圧変換器を備える、
     エアロゾル生成装置の電源ユニット。
    A power supply unit for an aerosol generator according to any one of claims 1 to 7,
    a voltage converter connected between the output terminal and the first load and configured to output a constant voltage;
    Power supply unit for the aerosol generator.
  9.  請求項8に記載のエアロゾル生成装置の電源ユニットであって、
     前記電圧変換器の最大入力電流と最大出力電流の少なくとも一方は、前記出力端子が出力可能な最大電流より小さい、
     エアロゾル生成装置の電源ユニット。
    A power supply unit for an aerosol generator according to claim 8,
    At least one of the maximum input current and the maximum output current of the voltage converter is smaller than the maximum current that the output terminal can output,
    Power supply unit for the aerosol generator.
  10.  請求項9に記載のエアロゾル生成装置の電源ユニットであって、
     第1基板と、
     前記第1基板とは別体の第2基板と、を備え、
     前記充電ICと前記電圧変換器は、前記第1基板と前記第2基板のうち前記第1基板のみに設けられる、
     エアロゾル生成装置の電源ユニット。
    A power supply unit for an aerosol generator according to claim 9,
    a first substrate;
    a second substrate separate from the first substrate,
    The charging IC and the voltage converter are provided only on the first substrate out of the first substrate and the second substrate,
    Power supply unit for the aerosol generator.
PCT/JP2022/009467 2021-05-10 2022-03-04 Power supply unit for aerosol generation device WO2022239408A1 (en)

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JP2021-079872 2021-05-10

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160278433A1 (en) * 2013-08-30 2016-09-29 Zhiyong Xiang Electronic cigarette charging and discharging circuit, battery assembly and electronic cigarette
WO2020256291A2 (en) * 2019-06-18 2020-12-24 주식회사 케이티앤지 Aerosol producing device and method for operating same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160278433A1 (en) * 2013-08-30 2016-09-29 Zhiyong Xiang Electronic cigarette charging and discharging circuit, battery assembly and electronic cigarette
WO2020256291A2 (en) * 2019-06-18 2020-12-24 주식회사 케이티앤지 Aerosol producing device and method for operating same

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