JP7066927B1 - Power supply unit for aerosol generator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply unit of an aerosol generator in which electronic components are appropriately mounted on a circuit board. SOLUTION: A non-combustion type suction device 100 is configured to be able to control a power supply BAT, a heater connector Cn to which a heater HTR for heating an aerosol source is connected, and a power supply from the power supply BAT to the heater HTR. And. The non-combustion type suction device 100 includes an MCU mounting substrate 161 including a sub surface 161b and a main surface 161a which is a back surface of the sub surface 161b, a main surface 162a facing the sub surface 161b, and a back surface of the main surface 162a. It comprises a secondary surface 162b and a receptacle mounting substrate 162 including. The non-combustion type suction device 100 includes an operational amplifier OP2, which is mounted on the secondary surface 161b or the main surface 162a, and whose output terminal is connected to the ROM 6, the flip-flop 16, and / or the MCU 1. [Selection Diagram] FIG. 24

Description

The present invention relates to a power supply unit of an aerosol generator.

Conventionally, there has been known an aerosol generation device that generates an aerosol by heating an aerosol source, adds a flavor component to the generated aerosol, and delivers the aerosol containing the flavor component to a user. In the power supply unit of these aerosol generators, the number of circuit boards and the types of power supply voltages on the circuit boards increase in order to enhance the functionality of the aerosol generators.

Therefore, for example, Patent Document 1 describes a power supply unit of an aerosol generator including a plurality of circuit boards. The power supply unit of the aerosol generator described in Patent Document 1 includes a first circuit board arranged parallel to the longitudinal direction of the aerosol generator, a second circuit board arranged perpendicular to the longitudinal direction, and the like. To prepare for.

Japanese Patent Publication No. 2020-531015

However, in the power supply unit of the aerosol generator including a plurality of circuit boards, how to arrange the circuit boards and how to mount the electronic components on the circuit boards has not been sufficiently studied.

The present invention provides a power supply unit for an aerosol generator in which electronic components are properly mounted on a circuit board.

One aspect of the present invention relates to an aerosol generator, wherein the aerosol generator has a power source, an opening into which a flavor generating substrate having a susceptor is arranged therein, and a heat generated in the susceptor. An inductive heating coil, a connector to which the inductive heating coil is connected, a controller configured to be able to control the supply of electric power from the power source to the inductive heating coil, a first surface, and the first surface. A first circuit board including a second surface, which is the back surface of the third surface, a third surface facing the first surface, and a second circuit board including a fourth surface which is the back surface of the third surface. The storage circuit mounted on the first surface is provided.

According to the present invention, electronic components are appropriately mounted on a circuit board, the durability of the power supply unit of the aerosol generator is improved, and the operation of the power supply unit of the aerosol generator is stabilized.

It is a perspective view of the non-combustion type suction device. It is a perspective view of the non-combustion type aspirator which shows the state which attached the rod. It is another perspective view of the non-combustion type suction device. It is an exploded perspective view of the non-combustion type suction device. It is a perspective view of the internal unit of a non-combustion type suction device. It is an exploded perspective view of the internal unit of FIG. It is a perspective view of the internal unit which removed a power-source and a chassis. Another perspective view of the internal unit with the power supply and chassis removed. It is sectional drawing of the non-combustion type aspirator. It is a schematic diagram for demonstrating the operation mode of an aspirator. It is a figure which shows the schematic structure of the electric circuit of an internal unit. It is a figure which shows the schematic structure of the electric circuit of an internal unit. It is a figure which shows the schematic structure of the electric circuit of an internal unit. It is a figure for demonstrating operation of an electric circuit in a sleep mode. It is a figure for demonstrating operation of an electric circuit in an active mode. It is a figure for demonstrating operation of an electric circuit in a heating initial setting mode. It is a figure for demonstrating operation of an electric circuit at the time of heating of a heater in a heating mode. It is a figure for demonstrating operation of an electric circuit at the time of temperature detection of a heater in a heating mode. It is a figure for demonstrating operation of an electric circuit in a charge mode. It is a figure for demonstrating the operation of an electric circuit at the time of reset (restart) of an MCU. It is a figure which shows the main surface of the receptacle mounting board. It is a figure which shows the secondary surface of the receptacle mounting board. It is a figure which shows the main surface of the MCU mounting board. It is a figure which shows the secondary surface of the MCU mounting board.

Hereinafter, a suction system, which is an embodiment of the aerosol generation device of the present invention, will be described with reference to the drawings. This suction system includes a non-combustion suction device 100 (hereinafter, also simply referred to as “suction device 100”), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100. .. In the following description, a configuration in which the suction device 100 accommodates the heating unit in a detachable manner will be described as an example. However, the heating unit may be detachably configured with respect to the suction device 100. For example, a rod 500 and a heating unit integrated may be detachably configured on the suction device 100. That is, the power supply unit of the aerosol generator may be configured not to include a heating unit as a component. In addition, the term “non-detachable” refers to a mode in which the product cannot be removed as long as it is expected to be used. Alternatively, the induction heating coil provided in the suction device 100 and the susceptor built in the rod 500 may cooperate to form the heating unit.

FIG. 1 is a perspective view showing the overall configuration of the suction device 100. FIG. 2 is a perspective view of the aspirator 100 showing a state in which the rod 500 is attached. FIG. 3 is another perspective view of the aspirator 100. FIG. 4 is an exploded perspective view of the suction device 100. Further, in the following description, for convenience, the three directions orthogonal to each other will be described using a three-dimensional space orthogonal coordinate system in which the front-back direction, the left-right direction, and the up-down direction are used. In the figure, the front is shown as Fr, the back is shown as Rr, the right side is shown as R, the left side is shown as L, the upper side is shown as U, and the lower side is shown as D.

The aspirator 100 generates an aerosol containing a flavor by heating an elongated substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-producing base material having an aerosol source, a filler containing the flavor source, and the like. It is configured to do.

<Flavor component generation base material (rod)>
The rod 500 contains a filler containing an aerosol source that is heated to a predetermined temperature to produce an aerosol.

The type of aerosol source is not particularly limited, and extracts from various natural products and / or their constituents can be selected depending on the intended use. The aerosol source may be a solid, a polyhydric alcohol such as glycerin or propylene glycol, or a liquid such as water. The aerosol source may include a flavor source such as a tobacco raw material that releases a flavor component by heating or an extract derived from the tobacco raw material. The gas to which the flavor component is added is not limited to aerosols, and invisible vapors may be generated, for example.

The filling of rod 500 may contain tobacco chopped as a flavor source. The material for chopping tobacco is not particularly limited, and known materials such as lamina and middle bone can be used. The filling may contain one or more fragrances. The type of the fragrance is not particularly limited, but menthol is preferable from the viewpoint of imparting a good taste. The flavor source may contain plants other than tobacco (eg, mint, Chinese herbs, herbs, etc.). Depending on the application, the rod 500 may not contain a flavor source.

<Overall configuration of non-combustion type suction device>
Subsequently, the overall configuration of the suction device 100 will be described with reference to FIGS. 1 to 4.
The suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The case 110 constitutes a left surface by sealing a bottomed cylindrical case body 112 in which a front surface, a rear surface, an upper surface, a lower surface, and a right surface are integrally formed, and an opening 114 (see FIG. 4) of the case body 112. It includes an outer panel 115, an inner panel 118, and a slider 119.

The inner panel 118 is fixed to the case body 112 with bolts 120. The outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held in an insulating chassis 150 (see FIG. 5) housed in the case body 112 and described later. By fixing the outer panel 115 by the magnet 124, the user can replace the outer panel 115 according to his / her preference.

The inner panel 118 is provided with two through holes 126 formed so as to penetrate the magnet 124. The inner panel 118 is further provided with a vertically long elongated hole 127 and a circular round hole 128 between the two through holes 126 arranged vertically. The elongated holes 127 are for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case main body 112. A button-type operation switch OPS built in the case body 112 penetrates through the round hole 128. That is, the operation switch OPS is arranged in the round hole 128 provided in the inner panel 118. Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. Further, the user can push down the operation switch OPS via the pressing portion 117 of the outer panel 115.

As shown in FIG. 2, an opening 132 into which the rod 500 can be inserted is provided on the upper surface of the case body 112. The slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between the position where the opening 132 is closed (see FIG. 1) and the position where the opening 132 is opened (see FIG. 2).

The operation switch OPS is used to perform various operations of the suction device 100. For example, the user operates the operation switch OPS via the pressing portion 117 in a state where the rod 500 is inserted into the opening 132 and mounted as shown in FIG. As a result, the heating unit 170 (see FIG. 5) heats the rod 500 without burning it. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500, and the flavor of the flavor source contained in the rod 500 is added to the aerosol. The user can suck the aerosol containing the flavor by holding and sucking the suction port 502 of the rod 500 protruding from the opening 132.

As shown in FIG. 3, a charging terminal 134 for electrically connecting to an external power source such as an outlet or a mobile battery to receive power supply is provided on the lower surface of the case body 112. In the present embodiment, the charging terminal 134 is a USB (Universal Serial Bus) Type-C shaped receptacle, but the charging terminal 134 is not limited to this. The charging terminal 134 will also be referred to as a receptacle RCP below. An elongated hole 129 that is long in the left-right direction and penetrates in the vertical direction is provided on the lower surface of the case body 112, and the receptacle RCP is arranged in the elongated hole 129. A USB Type-C-shaped plug can be inserted into and removed from the receptacle RCP through the elongated hole 129.

The charging terminal 134 may be provided with a power receiving coil, for example, and may be configured to be able to receive power transmitted from an external power source in a non-contact manner. Wireless Power Transfer in this case
) May be an electromagnetic induction type, a magnetic resonance type, or a combination of an electromagnetic induction type and a magnetic resonance type. As another example, the charging terminal 134 may be connected to various USB terminals or the like and may have the above-mentioned power receiving coil.

The configuration of the suction device 100 shown in FIGS. 1 to 4 is only an example. The suction device 100 holds the rod 500 and applies an action such as heating to generate a gas to which a flavor component is added from the rod 500, so that the user can suck the generated gas. It can be configured in various forms.

<Internal configuration of non-combustion type suction device>
The internal unit 140 of the suction device 100 will be described with reference to FIGS. 5 to 9.
FIG. 5 is a perspective view of the internal unit 140 of the suction device 100. FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. FIG. 7 is a perspective view of the internal unit 140 from which the power supply BAT and the chassis 150 have been removed. FIG. 8 is another perspective view of the internal unit 140 from which the power supply BAT and the chassis 150 have been removed. FIG. 9 is a cross-sectional view of the aspirator 100.

The internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit unit 160, a heating unit 170, a notification unit 180, and various sensors.

The chassis 150 is made of an insulating material, for example, a resin, which has a property of not allowing heat to pass through. The chassis 150 is arranged at substantially the center of the internal space of the case 110 in the front-rear direction and is arranged at substantially the center of the internal space of the case 110 in the front-rear direction and the plate-shaped chassis main body 151 extending vertically and in the front-rear direction. A plate-shaped front-rear dividing wall 152 extending in the vertical and horizontal directions, a plate-shaped vertical dividing wall 153 extending forward from approximately the center of the front-rear dividing wall 152 in the vertical direction, and an upper edge of the front-rear dividing wall 152 and the chassis body 151. A plate-shaped chassis upper wall 154 extending rearward from the portion, and a plate-shaped chassis lower wall 155 extending rearward from the lower edge portion of the front-rear dividing wall 152 and the chassis main body 151 are provided. The left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.

In the internal space of the case 110, the heating portion accommodating area 142 is partitioned in the front upper portion by the chassis 150, the substrate accommodating area 144 is partitioned in the front lower portion, and the power supply accommodating space 146 is partitioned rearward in the vertical direction. ing.

The heating unit 170 housed in the heating unit accommodating area 142 is composed of a plurality of cylindrical members, and these are arranged concentrically to form a cylindrical body as a whole. The heating unit 170 has a rod accommodating unit 172 capable of accommodating a part of the rod 500 inside the heating unit 170, and a heater HTR (see FIGS. 11 to 20) that heats the rod 500 from the outer periphery or the center. It is preferable that the surface of the rod accommodating portion 172 and the heater HTR are insulated by the rod accommodating portion 172 made of a heat insulating material or by providing a heat insulating material inside the rod accommodating portion 172. The heater HTR may be any element capable of heating the rod 500. The heater HTR is, for example, a heat generating element. Examples of the heat generating element include a heat generating resistor, a ceramic heater, an induction heating type heater, and the like. As the heater HTR, for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used. Instead of this, a heater HTR having an NTC (Negative Temperature Coefficient) characteristic in which the resistance value decreases as the temperature increases may be used. The heating unit 170 has a function of defining a flow path of air supplied to the rod 500 and a function of heating the rod 500. The case 110 is formed with a vent (not shown) for allowing air to flow in, and is configured to allow air to flow into the heating unit 170.

The power supply BAT accommodated in the power supply accommodation space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, and is preferably a lithium ion secondary battery. The electrolyte of the power supply BAT may be composed of one or a combination of a gel-like electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid. In this embodiment, the power supply BAT has a cylindrical shape extending in the vertical direction.

The notification unit 180 notifies various information such as SOC (State Of Charge) indicating the charge state of the power supply BAT, preheating time at the time of suction, and suction enable period. The notification unit 180 of the present embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be configured by a light emitting element such as LEDs L1 to L8, may be configured by a vibrating element such as a vibration motor M, or may be configured by a sound output element. The notification unit 180 may be a combination of two or more elements among the light emitting element, the vibration element, and the sound output element.

The various sensors include an intake sensor that detects the user's puff operation (suction operation), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , A cover position sensor that detects the position of the slider 119, a panel detection sensor that detects the attachment / detachment of the outer panel 115, and the like.

The intake sensor is mainly composed of, for example, a thermistor T2 arranged in the vicinity of the opening 132. The power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged in the vicinity of the power supply BAT. The heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged in the vicinity of the heater HTR. As described above, it is preferable that the rod accommodating portion 172 is insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact with or in close proximity to the heater HTR inside the rod accommodating portion 172. When the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used for the heater temperature sensor. The case temperature sensor is mainly composed of, for example, a thermistor T4 arranged in the vicinity of the left surface of the case 110. The cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged in the vicinity of the slider 119. The panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged in the vicinity of the inner surface of the inner panel 118.

The circuit unit 160 includes four circuit boards, a plurality of ICs (Integrate Circuits), and a plurality of elements. The four circuit boards are mainly an MCU-mounted board 161 in which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are arranged, a receptacle-mounted board 162 in which a charging terminal 134 is mainly arranged, an operation switch OPS, and an LED. It includes an LED mounting board 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a hall IC mounting board 164 on which a Hall IC 14 described later including a Hall element constituting a cover position sensor is arranged.

The MCU mounting substrate 161 and the receptacle mounting substrate 162 are arranged in parallel with each other in the substrate accommodating area 144. Specifically, in the MCU mounting board 161 and the receptacle mounting board 162, the respective element placement surfaces are arranged along the left-right direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. .. An opening is provided in each of the MCU mounting substrate 161 and the receptacle mounting substrate 162. The MCU mounting substrate 161 and the receptacle mounting substrate 162 are fastened to the substrate fixing portion 156 of the front-rear dividing wall 152 with bolts 136 in a state where a cylindrical spacer 173 is interposed between the peripheral edges of these openings. That is, the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 together with the chassis 150, and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162. As a result, it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them. Further, the spacer 173 has conductivity, and the ground of the MCU mounting substrate 161 and the ground of the receptacle mounting substrate 162 may be connected via the spacer 173.

For convenience, the front facing surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are the main surfaces 161a and 162a, respectively, and the opposite surfaces of the main surfaces 161a and 162a are the secondary surfaces 161b and 162b, respectively. The main surface 161a of the above faces the front surface of the case 110, and the sub surface 162b of the receptacle mounting substrate 162 faces the front-rear dividing wall 152 of the chassis 150. The sub surface 161b of the MCU mounting substrate 161 and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined interval. Then, a space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162 is formed between the sub surface 161b of the MCU mounting board 161 and the main surface 162a of the receptacle mounting board 162.

The MCU mounting board 161 and the receptacle mounting board 162 are electrically connected to each other via the flexible wiring board 165.

The LED mounting board 163 is arranged on the left side surface of the chassis main body 151 and between two magnets 124 arranged vertically. The element arrangement surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-back direction. In other words, the element arrangement surface of each of the MCU mounting substrate 161 and the receptacle mounting substrate 162 and the element arrangement surface of the LED mounting substrate 163 are orthogonal to each other. As described above, it is preferable that the element arrangement surface of each of the MCU mounting substrate 161 and the receptacle mounting substrate 162 and the element arrangement surface of the LED mounting substrate 163 are not limited to orthogonal but intersect (non-parallel).

The vibration motor M, which constitutes the notification unit 180 together with the LEDs L1 to L8, is supported on the lower surface of the chassis lower wall 155 and is electrically connected to the MCU mounting substrate 161 via a conducting wire. In this way, the vibration motor M is arranged side by side with the power supply BAT in the vertical direction in which the power supply BAT extends.

As a result, the vibration motor M and the power supply BAT can be arranged by effectively utilizing the internal space of the case 110 of the suction device 100, so that the suction device 100 can be miniaturized.

An upper cushion member 157 is supported on the lower surface of the chassis upper wall 154, and a lower cushion member 158 is supported on the upper surface of the chassis lower wall 155. The upper cushion member 157 and the lower cushion member 158 are formed of an elastic material such as rubber or foam. The upper cushion member 157 supports a contact surface with the negative electrode terminal of the power supply BAT in the negative electrode side power bus bar 238, and the lower cushion member 158 has a positive electrode terminal of the power supply BAT in the positive electrode side power bus bar 236. The contact surface is supported.

When the power supply BAT is accommodated in the power supply accommodation space 146, the positive electrode terminal of the power supply BAT abuts on the positive electrode side power supply bus bar 236, and the negative electrode terminal of the power supply BAT abuts on the negative electrode side power supply bus bar 238. At this time, the upper cushion member 157 is arranged above the power supply BAT, and the lower cushion member 158 is arranged below the power supply BAT. Therefore, when the suction device 100 receives an impact from the outside, the lower cushion member 158 is arranged. The upper cushion member 157 and the lower cushion member 158 can alleviate the transmission of the impact to the power supply BAT and can protect the power supply BAT.

Further, the vibration motor M is arranged on the lower surface of the chassis lower wall 155, the lower cushion member 158 is arranged on the upper surface of the chassis lower wall 155, and the power supply BAT is arranged above the lower cushion member 158. Therefore, in the vertical direction, the lower cushion member 158 is arranged between the power supply BAT and the vibration motor M.

Thereby, the lower cushion member 158 can suppress the vibration of the vibration motor M from being transmitted to the power supply BAT, and further can suppress the vibration of the vibration motor M from being transmitted to other electronic components via the power supply BAT. Therefore, it is possible to realize high functionality of the suction device 100 by the vibration motor M while reducing the influence of the vibration of the vibration motor M on the power supply BAT and the circuit board.

The Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154.

<Aspirator operation mode>
FIG. 10 is a schematic diagram for explaining the operation mode of the suction device 100. As shown in FIG. 10, the operation mode of the aspirator 100 includes a charge mode, a sleep mode, an active mode, a heating initial setting mode, a heating mode, and a heating end mode.

The sleep mode is a mode for saving power by stopping the power supply to electronic components mainly required for heating control of the heater HTR.

The active mode is a mode in which most of the functions except the heating control of the heater HTR are enabled. The aspirator 100 switches the operation mode to the active mode when the slider 119 is opened while the aspirator 100 is operating in the sleep mode. The suction device 100 switches the operation mode to the sleep mode when the slider 119 is closed or the non-operation time of the operation switch OPS reaches a predetermined time while the suction device 100 is operating in the active mode.

The heating initial setting mode is a mode for initializing control parameters and the like for starting the heating control of the heater HTR. The suction device 100 switches the operation mode to the heating initial setting mode when the operation of the operation switch OPS is detected while operating in the active mode, and switches the operation mode to the heating mode when the initial setting is completed.

The heating mode is a mode for executing heating control (heating control for aerosol generation and heating control for temperature detection) of the heater HTR. The suction device 100 starts the heating control of the heater HTR when the operation mode is switched to the heating mode.

The heating end mode is a mode for executing the end process (heating history storage process, etc.) of the heating control of the heater HTR. The suction device 100 switches the operation mode to the heating end mode when the energization time to the heater HTR or the number of suctions by the user reaches the upper limit or the slider 119 is closed while the suction device 100 is operating in the heating mode. , When the end processing is completed, the operation mode is switched to the active mode. The suction device 100 switches the operation mode to the heating end mode when the USB connection is made while operating in the heating mode, and switches the operation mode to the charging mode when the end processing is completed. As shown in FIG. 10, in this case, the operation mode may be switched to the active mode before the operation mode is switched to the charge mode. In other words, the suction device 100 may switch the operation mode in the order of the heating end mode, the active mode, and the charging mode when the USB connection is made while the suction device 100 is operating in the heating mode.

The charging mode is a mode in which the power supply BAT is charged by the electric power supplied from the external power source connected to the receptacle RCP. The suction device 100 switches the operation mode to the charging mode when an external power source is connected (USB connection) to the receptacle RCP while the suction device 100 is operating in the sleep mode or the active mode. The suction device 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is disconnected while the suction device 100 is operating in the charging mode.

<Outline of circuit of internal unit>
11, 12, and 13 are diagrams showing a schematic configuration of an electric circuit of the internal unit 140. In FIG. 12, among the electric circuits shown in FIG. 11, the range 161A (the range surrounded by the thick broken line) mounted on the MCU mounting board 161 and the range 163A (the range surrounded by the thick solid line) mounted on the LED mounting board 163 are shown. It is the same as FIG. 11 except that the range) and is added. FIG. 13 is the same as FIG. 11 except that the range 162A mounted on the receptacle mounting board 162 and the range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. Is.

The wiring shown by the thick solid line in FIG. 11 is the wiring having the same potential as the reference potential (ground potential) of the internal unit 140 (wiring connected to the ground provided in the internal unit 140). Hereinafter, it is referred to as a ground line. In FIG. 11, an electronic component obtained by converting a plurality of circuit elements into chips is shown by a rectangle, and the codes of various terminals are described inside the rectangle. The power supply terminal VCC and the power supply terminal VDD mounted on the chip indicate the power supply terminal on the high potential side, respectively. The power supply terminal VSS and the ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side), respectively. In the chipped electronic component, the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side is the power supply voltage. The chipped electronic components use this power supply voltage to perform various functions.

As shown in FIG. 12, the MCU mounting substrate 161 (range 161A) has an MCU1 that controls the entire aspirator 100 as a whole, a charging IC2 that controls charging of the power supply BAT, a capacitor, and a resistor as main electronic components. A load switch (hereinafter, LSW) 3, 4, 5 configured by combining a device, a transistor, etc., a ROM (Read Only Memory) 6, a switch driver 7, and a buck-boost DC / DC converter 8 (in the figure, in the figure). The buck-boost DC / DC8), the optotype OP2, the optotype OP3, the flipflops (hereinafter, FF) 16 and 17, and the thermistor T2 that constitutes the intake sensor are electrically connected to the connector Cn (t2) ( The thermistor T2 connected to this connector is shown in the figure) and the thermistor T3 electrically connected to the thermistor T3 constituting the heater temperature sensor (t3) (in the figure, the thermistor T3 connected to this connector is shown). ), The thermistor T4 electrically connected to the thermistor T4 constituting the case temperature sensor (t4) (in the figure, the thermistor T4 connected to this connector is described), and the voltage dividing circuit Pc for detecting the USB connection. , Are provided.

The ground terminals GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, buck-boost DC / DC converter 8, FF16, and FF17 are connected to the ground line. The power supply terminal VSS of ROM 6 is connected to the ground line. The negative power supply terminals of the operational amplifier OP2 and the operational amplifier OP3 are connected to the ground line.

As shown in FIG. 12, the LED mounting substrate 163 (range 163A) communicates with Hall IC13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, and communication as main electronic components. IC15 and are provided. The communication IC 15 is a communication module for communicating with an electronic device such as a smartphone. Each of the power terminal VSS of the hall IC 13 and the ground terminal GND of the communication IC 15 are connected to the ground line. The communication IC 15 and the MCU 1 are configured to be communicable by the communication line LN. One end of the operation switch OPS is connected to the ground 163G provided inside the LED mounting board 163 via the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.

As shown in FIG. 13, on the receptacle mounting substrate 162 (range 162A), a power supply connector electrically connected to the power supply BAT (in the figure, a power supply BAT connected to this power supply BAT) is described as a main electronic component. ), A connector electrically connected to the thermistor T1 constituting the power supply temperature sensor (thermistor T1 connected to this connector is shown in the figure), and a boost DC / DC converter 9 (boost DC / DC in the figure). Converter 9), protection IC10, overvoltage protection IC11, fuel gauge IC12, receptacle RCP, switches S3 to S6 composed of MOSFETs, operational motor OP1, and heater HTR are electrically connected. A pair (positive electrode side and negative electrode side) of heater connectors Cn are provided.

The two ground terminals GND of the receptacle RCP, the ground terminal GND of the step-up DC / DC converter 9, the power supply terminal VSS of the protection IC10, the power supply terminal VSS of the fuel gauge IC12, the ground terminal GND of the overvoltage protection IC11, and the operational amplifier. Each of the negative power supply terminals of OP1 is connected to the ground line.

As shown in FIG. 13, the Hall IC mounting substrate 164 (range 164A) is provided with a Hall IC 14 including a Hall element constituting the cover position sensor. The power terminal VSS of the hall IC 14 is connected to the ground line. The output terminal OUT of the hall IC 14 is connected to the terminal P8 of the MCU1. The MCU1 detects the opening / closing of the slider 119 by the signal input to the terminal P8.

As shown in FIG. 12, a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161.

<Details of the circuit of the internal unit>
Hereinafter, the connection relationship of each electronic component and the like will be described with reference to FIG.

The two power input terminals VBUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC 11 via the fuse Fs. When a USB plug is connected to the receptacle RCP and a USB cable including this USB plug is connected to an external power supply, a USB voltage VUSB is supplied to the two power input terminals VBUS of the receptacle RCP.

The input terminal IN of the overvoltage protection IC 11 is a voltage divider circuit P composed of a series circuit of two resistors.
One end of a is connected. The other end of the voltage divider circuit Pa is connected to the ground line. The connection points of the two resistors constituting the voltage divider circuit Pa are connected to the voltage detection terminal OVLo of the overvoltage protection IC 11. The overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold value. The overvoltage protection IC 11 stops the voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo becomes equal to or higher than the threshold value (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected. The output terminal OUT of the overvoltage protection IC 11 is connected to the input terminal VIN of the LSW3 and one end of the voltage divider circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage divider circuit Pc is connected to the ground line. The connection points of the two resistors constituting the voltage divider circuit Pc are connected to the terminal P17 of the MCU1.

One end of a voltage divider circuit Pf composed of a series circuit of two resistors is connected to the input terminal VIN of the LSW3. The other end of the voltage divider circuit Pf is connected to the ground line. The connection points of the two resistors constituting the voltage divider circuit Pf are connected to the control terminal ON of the LSW3. The collector terminal of the bipolar transistor S2 is connected to the control terminal ON of the LSW3. The emitter terminal of the bipolar transistor S2 is connected to the ground line. The base terminal of the bipolar transistor S2 is connected to the terminal P19 of the MCU1. When the signal input to the control terminal ON becomes high level, the LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of the LSW3 is connected to the input terminal VBUS of the charging IC2.

The MCU1 turns on the bipolar transistor S2 while the USB connection is not made. As a result, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2, so that a low-level signal is input to the control terminal ON of the LSW3.

The bipolar transistor S2 connected to the LSW3 is turned off by the MCU1 when the USB connection is made. When the bipolar transistor S2 is turned off, the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3. As a result, the LSW3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of the LSW3 unless the MCU1 turns off the bipolar transistor S2.

The positive electrode terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC / DC converter 9, and the charging terminal bat of the charging IC 2. Therefore, the power supply voltage VBAT of the power supply BAT is supplied to the protection IC 10, the charging IC 2, and the step-up DC / DC converter 9.

A resistor Ra, a switch Sa composed of MOSFETs, a switch Sb composed of MOSFETs, and a resistor Rb are connected in series to the negative electrode terminal of the power supply BAT in this order. The current detection terminal CS of the protection IC 10 is connected to the connection point between the resistor Ra and the switch Sa. Each control terminal of the switch Sa and the switch Sb is connected to the protection IC 10. Both ends of the resistor Rb are connected to the fuel gauge IC12.

The protection IC 10 acquires the current value flowing through the resistor Ra during charging / discharging of the power supply BAT from the voltage input to the current detection terminal CS (voltage applied across the resistor Ra), and this current value is excessive. When the voltage becomes (overcurrent), the switch Sa and the switch Sb are controlled to open and close to stop the charging or discharging of the power supply BAT to protect the power supply BAT. More specifically, when the protection IC 10 acquires an excessive current value when charging the power supply BAT, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value when the power supply BAT is discharged, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT. Further, the protection IC 10 controls the opening / closing of the switch Sa and the switch Sb when the voltage value of the power supply BAT becomes abnormal (in the case of overcharge or overvoltage) from the voltage input to the power supply terminal VDD to power the power supply. The power supply BAT is protected by stopping the charging or discharging of the BAT. More specifically, when the protection IC 10 detects the overcharge of the power supply BAT, the protection IC 10 stops the charging of the power supply BAT by turning off the switch Sb. When the protection IC 10 detects an over-discharge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.

A resistor Rt1 is connected to a connector connected to the thermistor T1 arranged in the vicinity of the power supply BAT. The series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12. The connection point between the thermistor T1 and the resistor Rt1 is connected to the thermistor terminal THM of the fuel gauge IC12. The thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.

The fuel gauge IC12 detects the current flowing through the resistor Rb, and based on the detected current value, the remaining capacity of the power supply BAT, the SOC (State Of Charge) indicating the state of charge, and the SOH (State Of Health) indicating the healthy state. ) Etc. to derive battery information. The fuel gauge IC12 supplies a voltage from the built-in regulator connected to the regulator terminal TREG to the voltage dividing circuit of the thermistor T1 and the resistor Rt1. The fuel gauge IC12 acquires the voltage divided by the voltage divider circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage. The fuel gauge IC 12 is connected to the MCU 1 by a communication line LN for performing serial communication, and is configured to be able to communicate with the MCU 1. The fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1. The MCU 1 controls the discharge from the power supply BAT to the heater HTR based on the remaining capacity of the power supply BAT acquired by the fuel gauge IC12. That is, when the remaining capacity of the power supply BAT is equal to or less than a predetermined value, the MCU 1 prohibits discharging to the heater HTR and prompts charging. In addition, in order to perform serial communication, a plurality of signal lines such as a data line for data transmission and a clock line for synchronization are required. Note that in FIGS. 11-20, for simplification, only one signal line is shown.

The fuel gauge IC 12 includes a notification terminal 12a. The notification terminal 12a is connected to the terminal P6 of the MCU 1 and the cathode of the diode D2 described later. When the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it outputs a low level signal from the notification terminal 12a to notify the MCU 1 of the occurrence of the abnormality. This low level signal is also input to the CLR (￣) terminal of the FF17 via the diode D2.

One end of the reactor Lc is connected to the switching terminal SW of the step-up DC / DC converter 9. The other end of the reactor Lc is connected to the input terminal VIN of the step-up DC / DC converter 9. The step-up DC / DC converter 9 controls the on / off of the built-in transistor connected to the switching terminal SW to boost the input voltage and perform voltage conversion control to output from the output terminal VOUT. The input terminal VIN of the step-up DC / DC converter 9 is connected to the power supply BAT and constitutes a power supply terminal on the high potential side of the step-up DC / DC converter 9. The step-up DC / DC converter 9 performs a step-up operation when the signal input to the enable terminal EN is at a high level. In the state of being connected by USB, the signal input to the enable terminal EN of the step-up DC / DC converter 9 may be controlled to a low level by the MCU 1. Alternatively, in the state of being connected via USB, the potential of the enable terminal EN may be undefined by the MCU1 not controlling the signal input to the enable terminal EN of the step-up DC / DC converter 9.

The source terminal of the switch S4 configured by the P-channel MOSFET is connected to the output terminal VOUT of the step-up DC / DC converter 9. The gate terminal of the switch S4 is connected to the terminal P15 of the MCU1. One end of the resistor Rs is connected to the drain terminal of the switch S4. The other end of the resistor Rs is connected to the heater connector Cn on the positive electrode side connected to one end of the heater HTR. A voltage divider circuit Pb composed of two resistors is connected to the connection point between the switch S4 and the resistors Rs. The connection points of the two resistors constituting the voltage divider circuit Pb are connected to the terminal P18 of the MCU1. The connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.

The source terminal of the switch S3 configured by the P-channel MOSFET is connected to the connection line between the output terminal VOUT of the step-up DC / DC converter 9 and the source terminal of the switch S4. The gate terminal of the switch S3 is connected to the terminal P16 of the MCU1. The drain terminal of the switch S3 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side. In this way, the circuit including the switch S3 and the circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the step-up DC / DC converter 9 and the positive electrode side of the heater connector Cn. .. Since the circuit including the switch S3 does not have a resistor, it is a circuit having a lower resistance than the circuit including the switch S4 and the resistors Rs.

The non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side. The inverting input terminal of the operational amplifier OP1 is connected to the heater connector Cn on the negative electrode side connected to the other end of the heater HTR and the drain terminal of the switch S6 configured by the N-channel MOSFET. The source terminal of the switch S6 is connected to the ground line. The gate terminal of the switch S6 is connected to the terminal P14 of the MCU 1, the anode of the diode D4, and the enable terminal EN of the step-up DC / DC converter 9. The cathode of the diode D4 is connected to the Q terminal of the FF17. One end of the resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU 1 and the drain terminal of the switch S5 configured by the N-channel MOSFET. The source terminal of the switch S5 is connected to the ground line. The gate terminal of the switch S5 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side.

The input terminal VBUS of the charging IC 2 is connected to each anode of the LEDs L1 to L8. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS. Each cathode of the LEDs L1 to L8 is connected to the control terminals PD1 to PD8 of the MCU1 via a resistor for current limiting. The MCU1 has a built-in transistor (built-in switch) connected to each of the control terminals PD1 to PD8 and the ground terminal GND.

Therefore, the LEDs L1 to L8 are configured to be operable by the USB voltage VUSB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC 2. ..

Further, the MCU 1 energizes the LED L1 by turning on the built-in switch connected to the control terminal PD1 to turn it on, and turns off the LED L1 by turning off the built-in switch connected to the control terminal PD1. By switching on and off the built-in switch connected to the control terminal PD1 at high speed, the brightness and light emission pattern of the LED L1 can be dynamically controlled. Similarly, the lighting of LEDs L2 to L8 is controlled by the MCU1.

The charging IC 2 has a charging function for charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS. The charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wirings (not shown), and performs charge control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT) based on these. Further, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 by serial communication using the communication line LN and use it for charging control.

The charging IC 2 further includes a VBAT power path function and an OTG function. The VBAT power path function is a function of outputting the system power supply voltage Vcc0, which substantially matches the power supply voltage VBAT input to the charging terminal bat, from the output terminal SYS. The OTG function is a function to output the system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat from the input terminal VBUS. The on / off of the OTG function of the charging IC 2 is controlled by the MCU 1 by serial communication using the communication line LN. In the OTG function, the power supply voltage VBAT input to the charging terminal bat may be output as it is from the input terminal VBUS. In this case, the power supply voltage VBAT and the system power supply voltage Vcc4 are substantially the same.

The output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the buck-boost DC / DC converter 8. One end of the reactor La is connected to the switching terminal SW of the charging IC 2. The other end of the reactor La is connected to the output terminal SYS of the charging IC 2. The charge enable terminal CE (￣) of the charging IC 2 is connected to the terminal P22 of the MCU 1 via a resistor. Further, a collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE (￣) of the charging IC 2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of LSW4 described later. The base terminal of the bipolar transistor S1 is connected to the Q terminal of the FF17. Further, one end of the resistor Rc is connected to the charge enable terminal CE (￣) of the charging IC 2. The other end of the resistor Rc is connected to the output terminal VOUT of LSW4.

A resistor is connected to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. When the system power supply voltage Vcc0 is input from the output terminal SYS of the charging IC 2 to the input terminal VIN of the buck-boost DC / DC converter 8, the signal input to the enable terminal EN of the buck-boost DC / DC converter 8 is at a high level. Then, the buck-boost DC / DC converter 8 starts a step-up operation or a step-down operation. The buck-boost DC / DC converter 8 boosts or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1 and outputs the output terminal VOUT. Output from. The output terminal VOUT of the buck-boost DC / DC converter 8 includes the feedback terminal FB of the buck-boost DC / DC converter 8, the input terminal VIN of the LSW4, the input terminal VIN of the switch driver 7, and the power supply terminal VCS and D terminal of the FF16. And are connected to. The wiring to which the system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is supplied is referred to as a power supply line PL1.

When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of the LSW4 and the power supply line PL1 are connected via a resistor. Therefore, when the system power supply voltage Vcc1 is supplied to the power supply line PL1, a high-level signal is input to the control terminal ON of the LSW4. The voltage output by LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored, but in order to distinguish it from the system power supply voltage Vcc1, the voltage output from the output terminal VOUT of LSW4 is referred to as the system power supply below. It is described as voltage Vcc2.

The output terminal VOUT of the LSW4 includes the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCS of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , Is connected to the power supply terminal VCS of FF17. The wiring to which the system power supply voltage Vcc2 output from the output terminal VOUT of the LSW4 is supplied is referred to as a power supply line PL2.

When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of the LSW5 is connected to the terminal P23 of the MCU1. The voltage output by LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored, but in order to distinguish it from the system power supply voltage Vcc2, the voltage output from the output terminal VOUT of LSW5 is referred to as the system power supply below. It is described as voltage Vcc3. The wiring to which the system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied is referred to as a power supply line PL3.

A series circuit of the thermistor T2 and the resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line. The thermistor T2 and the resistor Rt2 form a voltage divider circuit, and these connection points are connected to the terminal P21 of the MCU1. The MCU1 detects the temperature fluctuation (resistance value fluctuation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the temperature fluctuation amount.

A series circuit of the thermistor T3 and the resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line. The thermistor T3 and the resistor Rt3 form a voltage divider circuit, and these connection points are connected to the terminal P13 of the MCU 1 and the inverting input terminal of the operational amplifier OP2. The MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.

A series circuit of the thermistor T4 and the resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line. The thermistor T4 and the resistor Rt4 form a voltage divider circuit, and these connection points are connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3. The MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.

The source terminal of the switch S7 configured by the MOSFET is connected to the power supply line PL2. The gate terminal of the switch S7 is connected to the terminal P20 of the MCU1. The drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line. The MCU1 controls the opening and closing of the switch S7 by manipulating the potential of the terminal P20, and can vibrate the vibration motor M in a specific pattern. A dedicated driver IC may be used instead of the switch S7.

The power supply line PL2 is connected to a positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2. The connection points of the two resistors constituting the voltage divider circuit Pd are connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (a signal corresponding to the resistance value of the thermistor T3). In this embodiment, since the thermistor T3 having NTC characteristics is used, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of the operational amplifier OP2 is connected to the ground line, and the voltage value (voltage dividing value by the thermista T3 and the resistor Rt3) input to the inverting input terminal of the operational amplifier OP2 is the non-inverting input of the operational amplifier OP2. This is because the value of the output voltage of the operational amplifier OP2 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (the voltage dividing value by the voltage dividing circuit Pd). That is, when the temperature of the heater HTR (the temperature of the thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes low level. When using a thermistor T3 having PTC characteristics, connect the output of the voltage divider circuit of the thermistor T3 and the resistor Rt3 to the non-inverting input terminal of the operational amplifier OP2, and connect the output to the inverting input terminal of the operational amplifier OP2. The output of the voltage circuit Pd may be connected.

A positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2. The connection points of the two resistors constituting the voltage divider circuit Pe are connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4). In this embodiment, since the thermistor T4 having NTC characteristics is used, the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3. This is because the negative power supply terminal of the operational amplifier OP3 is connected to the ground line, and the voltage value (voltage dividing value by the thermista T4 and the resistor Rt4) input to the inverting input terminal of the operational amplifier OP3 is the non-inverting input of the operational amplifier OP3. This is because the value of the output voltage of the operational amplifier OP3 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (the voltage dividing value by the voltage dividing circuit Pe). That is, when the temperature of the thermistor T4 becomes high, the output voltage of the operational amplifier OP3 becomes low level.
When using a thermistor T4 having PTC characteristics, connect the output of the voltage divider circuit of the thermistor T4 and the resistor Rt4 to the non-inverting input terminal of the operational amplifier OP3, and connect the output to the inverting input terminal of the operational amplifier OP3. The output of the voltage circuit Pe may be connected.

A resistor R1 is connected to the output terminal of the operational amplifier OP2. The cathode of the diode D1 is connected to the resistor R1. The anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR (￣) terminal of the FF17. A resistor R2 connected to the power supply line PL1 is connected to the connection line between the resistor R1 and the diode D1. Further, the CLR (￣) terminal of the FF16 is connected to this connection line.

One end of the resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17. The other end of the resistor R3 is connected to the power supply line PL2. Further, the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR (￣) terminal of the FF17 are connected to this connection line. The cathode of the diode D3 is connected to the terminal P5 of the MCU1.

In FF16, when the temperature of the heater HTR becomes excessive, the signal output from the operational amplifier OP2 becomes small, and the signal input to the CLR (￣) terminal becomes low level, a high level signal is transmitted from the Q (￣) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in FF16, the low level signal continues to be output from the Q (￣) terminal unless the signal input to the CLR (￣) terminal operating with negative logic becomes low level.

The signal input to the CLR (￣) terminal of the FF17 detects an abnormality from the notification terminal 12a of the fuel gauge IC12 when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and so on. The low level is obtained in any of the cases where the indicated low level signal is output. When the signal input to the CLR (￣) terminal becomes low level, the FF17 outputs a low level signal from the Q terminal. This low-level signal is input to the terminal P10 of the MCU 1, the gate terminal of the switch S6, the enable terminal EN of the step-up DC / DC converter 9, and the base terminal of the bipolar transistor S1 connected to the charging IC 2, respectively. To. When a low-level signal is input to the gate terminal of the switch S6, the gate-source voltage of the N-channel MOSFET constituting the switch S6 becomes less than the threshold voltage, so that the switch S6 is turned off. When a low-level signal is input to the enable terminal EN of the step-up DC / DC converter 9, the step-up operation is stopped because the enable terminal EN of the step-up DC / DC converter 9 is positive logic. When a low-level signal is input to the base terminal of the bipolar transistor S1, the bipolar transistor S1 is turned on (the amplified current is output from the collector terminal). When the bipolar transistor S1 is turned on, a high level system power supply voltage Vcc2 is input to the CE (￣) terminal of the charging IC2 via the bipolar transistor S1. Since the CE (￣) terminal of the charging IC 2 has negative logic, charging of the power supply BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 tries to output a low-level enable signal from the terminal P22 to the charge enable terminal CE (￣) of the charge IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1. It is input to the charge enable terminal CE (￣) of the terminal P22 and the charging IC2. It should be noted that a high level signal is input to the charge enable terminal CE (￣) of the charging IC2.

A high level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, in the FF 17, a high level signal continues to be output from the Q terminal unless the signal input to the CLR (￣) terminal operating with negative logic becomes low level. When a low-level signal is output from the output terminal of the operational amplifier OP3, a low-level signal is input to the CLR (￣) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2. .. When a high level signal is output from the output terminal of the operational amplifier OP2, it should be noted that the low level signal output from the output terminal of the operational amplifier OP3 is not affected by this high level signal by the diode D1. sea bream. Further, when a low level signal is output from the output terminal of the operational amplifier OP2, even if the high level signal is output from the output terminal of the operational amplifier OP3, the high level signal is low level via the diode D1. Replaces the signal of.

The power supply line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164. The power supply terminal VDD of the hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the hall IC 14 are connected to the branched power supply line PL2.

The output terminal OUT of the hall IC 13 is connected to the terminal P3 of the MCU 1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the hall IC 13. The MCU1 determines whether or not the outer panel 115 is mounted based on the signal input to the terminal P3.

The LED mounting board 163 is provided with a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS. This series circuit is connected to the power supply line PL2. The connection point between the resistor and the capacitor of this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7. When the operation switch OPS is not pressed, the operation switch OPS does not conduct, and the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 become high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and the operation switch OPS becomes conductive, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground 163G and become low level. The MCU1 detects the operation of the operation switch OPS by the signal input to the terminal P4.

When the operation switch OPS is pressed by the user, external noise such as static electricity easily invades the internal unit 140, but the operation switch OPS is connected to the ground 163G when the user presses it. As a result, even if external noise enters the internal unit 140 from the operation switch OPS when the operation switch OPS is pressed by the user, the external noise can be released to the ground 163G, so that the durability of the aspirator 100 is improved. improves.

Further, as described above, since the ground 163G is provided inside the LED mounting board 163, when the operation switch OPS is pressed by the user, external noise invades the internal unit 140 from the operation switch OPS. However, it is possible to suppress the external noise that has entered the internal unit 140 from the operation switch OPS from entering the circuit board other than the LED mounting board 163. As a result, it is possible to prevent electronic components mounted on circuit boards other than the LED mounting board 163 from failing due to external noise, and the durability of the suction device 100 is improved.

The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of the LSW4. When the level of the signal input to the terminal SW1 and the terminal SW2 is both low level (the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 is used. By outputting a low level signal from the reset input terminal RSTB, the output operation of the LSW4 is stopped. That is, when the operation switch OPS, which is originally pushed down via the pressing portion 117 of the outer panel 115, is pushed down directly by the user with the outer panel 115 removed, the signals input to the terminals SW1 and SW2 of the switch driver 7. All levels are low.

<Operation for each operation mode of the aspirator>
Hereinafter, the operation of the electric circuit shown in FIG. 11 will be described with reference to FIGS. 14 to 20. FIG. 14 is a diagram for explaining the operation of the electric circuit in the sleep mode. FIG. 15 is a diagram for explaining the operation of the electric circuit in the active mode. FIG. 16 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode. FIG. 17 is a diagram for explaining the operation of the electric circuit when the heater HTR is heated in the heating mode. FIG. 18 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode. FIG. 19 is a diagram for explaining the operation of the electric circuit in the charging mode. FIG. 20 is a diagram for explaining the operation of the electric circuit at the time of resetting (restarting) the MCU1. In each of FIGS. 14 to 20, among the terminals of the chipped electronic components, the terminals surrounded by the broken line ellipse are input or output from the power supply voltage VBAT, the USB voltage VUSB, the system power supply voltage, and the like. Indicates the terminal.

In any of the operation modes, the power supply voltage VBAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC / DC converter 9, and the charging terminal bat of the charging IC 2.

<Sleep mode: Fig. 14>
The MCU1 enables the VBAT power path function of the charging IC2 and disables the OTG function and the charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC 2, the VBAT power path function of the charging IC 2 becomes effective. Since the signal for enabling the OTG function from the communication line LN is not output from the MCU 1 to the charging IC 2, the OTG function is disabled. Therefore, the charging IC 2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat and outputs it from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and the enable terminal EN of the buck-boost DC / DC converter 8. The buck-boost DC / DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to the enable terminal EN, which is a positive logic, and generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0 to generate an output terminal VOUT. Output from. The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC / DC converter 8 is the input terminal VIN of LSW4, the control terminal ON of LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCS of FF16, and It is supplied to the D terminal and each.

When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the hall IC13, the power supply terminal VCS of the communication IC15, and the power supply terminal VDD of the hall IC14. Entered. Further, the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE (￣) of the charging IC2, and the FF17. It is supplied to the power supply terminal VCS, the positive power supply terminal of the operational amplifier OP3, the voltage divider circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage divider circuit Pd, respectively. The bipolar transistor S1 connected to the charging IC 2 is off unless a low-level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charge enable terminal CE (￣) of the charge IC2. Since the charging enable terminal CE (￣) of the charging IC2 has a negative logic, the charging function by the charging IC2 is turned off in this state.

As described above, in the sleep mode, since the LSW5 stops the output of the system power supply voltage Vcc3, the power supply to the electronic components connected to the power supply line PL3 is stopped. Further, in the sleep mode, since the OTG function of the charging IC 2 is stopped, the power supply to the LEDs L1 to L8 is stopped.

<Active mode: Fig. 15>
From the sleep mode state of FIG. 14, the MCU1 inputs a high-level signal from the terminal P23 to the control terminal ON of the LSW5 when it detects that the signal input to the terminal P8 becomes a high level and the slider 119 is opened. .. As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN as the system power supply voltage Vcc3 from the output terminal VOUT. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.

Further, when the MCU1 detects that the slider 119 is opened, the MCU1 activates the OTG function of the charging IC2 via the communication line LN. As a result, the charging IC 2 outputs the system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat from the input terminal VBUS. The system power supply voltage Vcc4 output from the input terminal VBUS is supplied to the LEDs L1 to L8.

<Heating initial setting mode: Fig. 16>
When the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed) from the state of FIG. 15, the MCU1 boosts the voltage from the terminal P14 after making various settings necessary for heating. A high-level enable signal is input to the enable terminal EN of the DC / DC converter 9. As a result, the step-up DC / DC converter 9 outputs the drive voltage Vbst obtained by boosting the power supply voltage VBAT from the output terminal VOUT. The drive voltage Vbst is supplied to the switch S3 and the switch S4. In this state, the switch S3 and the switch S4 are off. Further, the switch S6 is turned on by the high level enable signal output from the terminal P14. As a result, the negative electrode side terminal of the heater HTR is connected to the ground line, and if the switch S3 is turned on, the heater HTR can be heated. After the enable signal of the high level signal is output from the terminal P14 of the MCU 1, the mode shifts to the heating mode.

<Heater heating in heating mode: Fig. 17>
In the state of FIG. 16, the MCU 1 starts the switching control of the switch S3 connected to the terminal P16 and the switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the above-mentioned heating initial setting mode is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 17, the MCU1 turns on the switch S3, turns off the switch S4, supplies the drive voltage Vbst to the heater HTR, and heats the heater HTR for aerosol generation. And, as shown in FIG. 18, the switch S3 is turned off, the switch S4 is turned on, and the temperature detection control for detecting the temperature of the heater HTR is performed.

As shown in FIG. 17, during heating control, the drive voltage Vbst is also supplied to the gate of the switch S5, and the switch S5 is turned on. Further, at the time of heating control, the drive voltage Vbst that has passed through the switch S3 is input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs. The resistance value of the resistors Rs is negligibly small as compared with the internal resistance value of the operational amplifier OP1. Therefore, at the time of heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 becomes substantially the same as the drive voltage Vbst.

The resistance value of the resistor R4 is larger than the on-resistance value of the switch S5. The operational amplifier OP1 operates even during heating control, but the switch S5 is turned on during heating control. When the switch S5 is on, the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5, and is input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is larger than the on-resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 becomes sufficiently small. This makes it possible to prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.

<Heater temperature detection in heating mode: Fig. 18>
As shown in FIG. 18, during temperature detection control, the drive voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and is also input to the voltage divider circuit Pb. The voltage divided by the voltage divider circuit Pb is input to the terminal P18 of the MCU1. The MCU1 acquires the reference voltage Vtemp applied to the series circuit of the resistor Rs and the heater HTR at the time of temperature detection control based on the voltage input to the terminal P18.

Further, at the time of temperature detection control, the drive voltage Vbst (reference voltage Vtemp) is supplied to the series circuit of the resistor Rs and the heater HTR. Then, the voltage Vheat obtained by dividing the drive voltage Vbst (reference voltage Vtemp) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistors Rs is sufficiently larger than the resistance value of the heater HTR, the voltage Vheat is a value sufficiently lower than the drive voltage Vbst. At the time of temperature detection control, this low voltage Vheat is also supplied to the gate terminal of the switch S5, so that the switch S5 is turned off. The operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage Vheat input to the non-inverting input terminal.

The output signal of the operational amplifier OP1 is input to the terminal P9 of the MCU1. The MCU1 acquires the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage Vtemp acquired based on the input voltage of the terminal P18, and the electric resistance value of the known resistors Rs. The MCU1 controls the heating of the heater HTR based on the acquired temperature of the heater HTR. The heating control of the heater HTR includes control of discharge from the power supply BAT to the heater HTR, control so that the temperature of the heater HTR becomes the target temperature, and the like.

The MCU1 can acquire the temperature of the heater HTR even during the period in which the switch S3 and the switch S4 are turned off (the period in which the heater HTR is not energized). Specifically, the MCU 1 acquires the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage divider circuit composed of the thermistor T3 and the resistor Rt3).

Further, the MCU1 can also acquire the temperature of the case 110 at an arbitrary timing. Specifically, the MCU 1 acquires the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage divider circuit composed of the thermistor T4 and the resistor Rt4).

<Charging mode: Fig. 19>
FIG. 19 illustrates a case where a USB connection is made in the sleep mode. When the USB connection is made, the USB voltage VUSB is input to the input terminal VIN of the LSW3 via the overvoltage protection IC 11. The USB voltage VUSB is also supplied to the voltage divider circuit Pf connected to the input terminal VIN of the LSW3. Immediately after the USB connection is made, the bipolar transistor S2 is on, so the signal input to the control terminal ON of the LSW3 remains at a low level. The USB voltage VUSB is also supplied to the voltage divider circuit Pc connected to the terminal P17 of the MCU 1, and the voltage divided by the voltage divider circuit Pc is input to the terminal P17. The MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.

When the MCU1 detects that the USB connection has been made, it turns off the bipolar transistor S2 connected to the terminal P19. When a low-level signal is input to the gate terminal of the bipolar transistor S2, the USB voltage VUSB divided by the voltage divider circuit Pf is input to the control terminal ON of the LSW3. As a result, a high-level signal is input to the control terminal ON of the LSW3, and the LSW3 outputs the USB voltage VUSB from the output terminal VOUT. The USB voltage VUSB output from the LSW3 is input to the input terminal VBUS of the charging IC2. Further, the USB voltage VUSB output from the LSW3 is supplied to the LEDs L1 to L8 as the system power supply voltage Vcc4 as it is without passing through the charging IC2.

When the MCU1 detects that the USB connection has been made, it further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE (￣) of the charging IC2. As a result, the charging IC 2 activates the charging function of the power supply BAT and starts charging the power supply BAT by the USB voltage VUSB input to the input terminal VBUS. At this time, the MCU 1 does not heat the heater HTR for aerosol generation while the switch S3 and the switch S4 are left off. In other words, when the MCU1 detects that the USB connection is made based on the voltage input to the terminal P17, the MCU1 prohibits the supply of electric power from the power supply BAT to the heater connector Cn. Therefore, the receptacle RCP and the overvoltage protection IC11, which are electronic components that function only during charging, are electronic components that function when the voltage conversion control associated with the heating control is not executed.

When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, the bipolar transistor S2 connected to the terminal P19 is connected.
Is turned off, a low-level enable signal is output from the terminal P22 to the charge enable terminal CE (￣) of the charge IC2, and the OTG function of the charge IC2 is performed by serial communication using the communication line LN. Turn off. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 switches from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. The LEDs L1 to L8 do not operate unless the built-in switch is turned on by the MCU1. Therefore, it is possible to prevent the unstable voltage from being supplied to the LEDs L1 to L8 in the transition period from the on to the off of the OTG function.

<Reset of MCU: Fig. 20>
When the outer panel 115 is removed, the output of the hall IC 13 becomes low level, the operation switch OPS is turned on, and the signal input to the terminal P4 of the MCU1 becomes low level, the terminals SW1 and SW2 of the switch driver 7 are turned on. Both are low level. As a result, the switch driver 7 outputs a low-level signal from the reset input terminal RSTB. The low level signal output from the reset input terminal RSTB is input to the control terminal ON of the LSW4. As a result, the LSW4 stops the output of the system power supply voltage Vcc2 from the output terminal VOUT. When the output of the system power supply voltage Vcc2 is stopped, the system power supply voltage Vcc2 is not input to the power supply terminal VDD of the MCU1, so that the MCU1 is stopped.

When the time for outputting the low level signal from the reset input terminal RSTB reaches the predetermined time or the signal input to either the terminal SW1 or the terminal SW2 reaches the high level, the switch driver 7 reset input terminal RSTB. The signal output from is returned to the high level. As a result, the control terminal ON of the LSW4 becomes a high level, and the system power supply voltage Vcc2 is returned to the state of being supplied to each part.

<Detailed explanation of the board>
Next, the arrangement of ICs and elements mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described.

[Receptacle mounting board]
FIG. 21 is a diagram showing a main surface 162a of the receptacle mounting substrate 162. A heater connector Cn is mounted on the upper end portion of the main surface 162a of the receptacle mounting substrate 162 extending in the vertical direction, a receptacle RCP is mounted on the lower end portion, and a step-up DC / booster DC / is provided between the heater connector Cn and the receptacle RCP. The reactor Lc of the DC converter 9 is mounted.

Further, in the vicinity of the receptacle RCP, a battery connector 222 on the positive electrode side (hereinafter referred to as a battery connector 222 on the positive electrode side) is mounted on the upper right side, and an opening 176 for fixing the spacer 173 is arranged on the upper left side. Further, on the left side of the reactor Lc, a battery connector 224 on the negative electrode side (hereinafter referred to as a battery connector 224 on the negative electrode side) and a power supply temperature detection connector Cn (t1) connected to the thermistor T1 constituting the power supply temperature sensor are mounted. A switch S4 for detecting the temperature of the heater HTR is mounted on the side opposite to the battery connector 224 on the negative electrode side in the left-right direction. The positive electrode side power supply bus bar 236 (see FIGS. 7 and 8) extending from the positive electrode terminal of the power supply BAT is connected to the positive electrode side battery connector 222, and the negative electrode side power supply bus bar extending from the negative electrode terminal of the power supply BAT is connected to the negative electrode side battery connector 224. 238 (see FIGS. 7 and 8) is connected.

The opening 176 of the receptacle mounting substrate 162 for fixing the spacer 173 is provided at a position close to the receptacle RCP mounted on the lower end portion, in other words, on the lower end side from the upper end portion with respect to the center. Noise caused by this current may occur near the path through which the power supplied from the external power supply passes, but by providing a spacer 173 that is not affected by the noise near this path, the receptacle is mounted. The substrate area of the substrate 162 can be effectively used.

Further, the positive electrode side battery connector 222 that electrically connects the power supply BAT and the receptacle mounting board 162 is provided at a position close to the receptacle RCP mounted at the lower end portion, in other words, below the center in the vertical direction. There is. The positive electrode side battery connector 222, which is a conductor, is affected by noise to a considerable extent, but since a large current passes through the positive electrode side battery connector 222, the effect of noise is slight, so that the positive electrode side battery connector is near this path. By providing 222, the substrate area of the receptacle RCP can be effectively utilized. By these measures, it is possible to prevent the size of the receptacle mounting substrate 162 from becoming large, so that the cost and size of the suction device 100 can be reduced.

FIG. 22 is a diagram showing a secondary surface 162b of the receptacle mounting substrate 162. A step-up DC / DC converter 9, an operational amplifier OP1, a protection IC 10, an overvoltage protection IC 11, a fuse Fs, and a switch S3 for aerosol generation are mounted on the secondary surface 162b of the receptacle mounting board 162 extending in the vertical direction. To.

The overvoltage protection IC 11 and the fuse Fs are mounted below the opening 176. In this way, by mounting the overvoltage protection IC11 and the fuse Fs on the secondary surface 162b opposite to the main surface 162a on which the receptacle RCP is mounted, the overvoltage protection IC11 and the fuse Fs are mounted on the same surface as the receptacle RCP. In comparison, the substrate area can be effectively utilized, and the size of the receptacle mounting substrate 162 can be suppressed from becoming large. This can reduce the cost and size of the aspirator 100.

The overvoltage protection IC 11 is mounted on the receptacle projection area 220, which is a portion where the receptacle RCP is projected in the front-rear direction, that is, the position overlapping the receptacle RCP when viewed from the direction orthogonal to the element arrangement surface (front-back direction) of the receptacle mounting substrate 162. Orthogonal. Therefore, the distance between the VBUS pin pair of the receptacle RCP and the overvoltage protection IC 11 can be shortened to the utmost limit, and the power before being protected by the overvoltage protection IC 11 is given to other electric components mounted on the receptacle mounting board 162. The impact can be reduced. This makes it possible to improve the durability of the suction device 100 and stabilize its operation.

A step-up DC / DC converter 9, an operational amplifier OP1, a protection IC 10, and a switch S3 for aerosol generation are mounted above the opening 176.

The aerosol generation switch S3 is mounted on the upper right end of the secondary surface 162b of the receptacle mounting substrate 162. The operational amplifier OP1 is mounted near the right end portion of the auxiliary surface 162b of the receptacle mounting substrate 162 in the vertical direction in the vertical direction. The step-up DC / DC converter 9 is mounted between the aerosol generation switch S3 and the operational amplifier OP1 in the vertical direction, and to the left of the aerosol generation switch S3 and the operational amplifier OP1 in the horizontal direction. The protection IC 10 is mounted between the operational amplifier OP1 and the opening 176 in the vertical direction and between the step-up DC / DC converter 9 and the opening 176 in the horizontal direction.

[MCU mounting board]
FIG. 23 is a diagram showing a main surface 161a of the MCU mounting substrate 161. On the main surface 161a of the MCU mounting substrate 161 extending in the vertical direction, an opening 175 for fixing the spacer 173 is arranged at a position corresponding to the opening 176 of the receptacle mounting substrate 162, and is arranged in the vicinity of the opening 175. MCU1 is mounted.

On the main surface 161a of the MCU mounting board 161, a heater temperature detection connector Cn (t3) to which a thermistor T3 constituting a heater temperature sensor is connected via a conducting wire, a charging IC2, an LSW3, and a buck-boost DC / DC. The converter 8 and the FF17 are mounted.
The heater temperature detection connector Cn (t3) is mounted on the upper end portion of the main surface 161a of the MCU mounting board 161.

The charging IC 2 is mounted on the lower side of the heater temperature detecting connector Cn (t3) and above the upper and lower centers of the main surface 161a.

LSW3 is mounted between the charging IC 2 and the MCU 1.

The buck-boost DC / DC converter 8 is mounted on the left side of the LSW3 and between the charging IC 2 and the LSW3 in the vertical direction.

The FF 17 is mounted at the lower right portion below the opening 175 and the MCU1.

FIG. 24 is a diagram showing a secondary surface 161b of the MCU mounting substrate 161. A motor connector 226 to which a vibration motor M is connected via a conducting wire, a switch driver 7, and a thermistor T4 constituting a case temperature sensor connect the conducting wire to the auxiliary surface 161b of the MCU mounting board 161 extending in the vertical direction. The case temperature detection connector Cn (t4) connected via the lead wire, the intake detection connector Cn (t2) to which the thermistor T2 constituting the intake sensor is connected via the conducting wire, the FF16, the ROM6, and the operational capacitor OP2. , Is implemented.

The motor connector 226 is mounted on the upper side of the opening 175. Further, the motor connector 226 is mounted on the left side of the center of the auxiliary surface 161b of the MCU mounting board 161 in the left-right direction.

The switch driver 7 is mounted above the motor connector 226.

The case temperature detection connector Cn (t4) and the intake air detection connector Cn (t2) are mounted on the upper end portion of the secondary surface 161b of the MCU mounting board 161. In the present embodiment, the case temperature detection connector Cn (t4) is mounted on the left end side of the auxiliary surface 161b of the MCU mounting board 161 in the left-right direction, and the intake air detection connector Cn (t2) is the MCU mounting board 161. It is mounted on the right end side of the secondary surface 161b in the left-right direction.

The FF 16 is mounted between the case temperature detection connector Cn (t4) and the switch driver 7. The FF 16 is mounted on the left end side of the secondary surface 161b of the MCU mounting substrate 161 in the left-right direction.

ROM 6 is mounted on the right side of FF16. The ROM 6 is mounted slightly to the right of the center of the left and right sides of the secondary surface 161b of the MCU mounting board 161.

The operational amplifier OP2 is mounted between the intake detection connector Cn (t2) and the ROM 6. The operational amplifier OP2 is mounted between the intake detection connector Cn (t2) and the case temperature detection connector Cn (t4) in the left-right direction of the sub surface 161b of the MCU mounting board 161, and is mounted on the sub surface 161b of the MCU mounting board 161. It is mounted in the center of the left and right sides of.

The flexible wiring board 165 that electrically connects the MCU mounting board 161 and the receptacle mounting board 162 connects the FPC connection portions 231 and 232 of the MCU mounting board 161 and the receptacle mounting board 162 to each other. The FPC connection portion 231 is located at the right end portion of the MCU mounting substrate 161 and at a location extending from the substantially central portion downward in the vertical direction to the vicinity of the opening 175. The FPC connection portion 232 is located at the right end portion of the receptacle mounting substrate 162 and at a position extending from the substantially central portion downward in the vertical direction to the vicinity of the opening 176. Therefore, the flexible wiring board 165 is mounted on the right end portion of the MCU mounting board 161 and the right end portion of the receptacle mounting board 162.

In this way, the ROM 6, the FF 16, the operational amplifier OP2, and the switch driver 7 are mounted on the secondary surface 161b of the MCU mounting board 161.

Therefore, the ROM 6, the FF16, and the operational amplifier OP2 are arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. Static electricity and noise are less likely to enter the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. As a result, the ROM 6, FF16, and the operational amplifier OP2 are less likely to break down, the durability of the suction device 100 is improved, and the operation of the suction device 100 is stabilized.

Similarly, the switch driver 7 is arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. Static electricity and noise are less likely to enter the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. As a result, the switch driver 7 is less likely to break down, the durability of the suction device 100 is improved, and the operation of the suction device 100 is stabilized.

On the other hand, the aerosol generation switch S3 is not mounted on the secondary surface 161b of the MCU mounting substrate 161 and the main surface 162a of the receptacle mounting substrate 162. In this embodiment, the switch S3 is mounted on the secondary surface 162b of the receptacle mounting substrate 162.

Therefore, the switch S3 is not arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. The switch S3 that switches a large amount of power supplied to the heater HTR may generate non-negligible switching noise, but the switch S3 is not arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. .. As a result, not only external noise but also noise generated inside the suction device 100 is less likely to enter the space SP sandwiched between the MCU mounting substrate 161 and the receptacle mounting substrate 162. That is, by arranging the important electronic components in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162, the important electronic components are less likely to break down, and the durability of the aspirator 100 is improved. The operation of the aspirator 100 is stable.

Similarly, the MCU 1 is not mounted on the secondary surface 161b of the MCU mounting substrate 161 and the main surface 162a of the receptacle mounting substrate 162. In this embodiment, the MCU 1 is mounted on the main surface 161a of the MCU mounting substrate 161.

Therefore, the MCU 1 is not arranged in the space SP sandwiched between the MCU mounting substrate 161 and the receptacle mounting substrate 162. Since the MCU1 has a large number of terminals, the size tends to be large, so that the occupied area on the circuit board tends to be large. Further, it is necessary to form a conductive pattern connected to the large number of terminals on the main surface 161a of the MCU mounting substrate 161. That is, the MCU 1 can be a big constraint in mounting other electronic components mounted on the same surface. In other words, it is difficult to mount many other electronic components on the surface on which the MCU1 is mounted. Since the MCU 1 is not arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162, more electronic components can be mounted on the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. It will be possible. As a result, more important electronic components can be arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162, so that the durability of the suction device 100 is improved and the suction device 100 is improved. Operation is stable.

Further, the communication IC 15 is not mounted on the sub surface 161b of the MCU mounting board 161 and the main surface 162a of the receptacle mounting board 162. In this embodiment, the communication IC 15 is mounted on the LED mounting substrate 163.

The space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162 is difficult for communication radio waves to reach, but the communication IC 15 is not arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. The operation of the aspirator 100 including the communication function is stable.

Further, since many metals such as connection lines are present around the MCU mounting board 161 and the receptacle mounting board 162 arranged to face each other, communication radio waves are likely to be interfered with. Since the communication IC 15 is the LED mounting board 163 separated from the MCU mounting board 161 and the receptacle mounting board 162, the operation of the suction device 100 including the communication function is stable.

Further, the step-up DC / DC converter 9 and the charging IC 2 are not mounted on the sub surface 161b of the MCU mounting board 161 and the main surface 162a of the receptacle mounting board 162. The step-up DC / DC converter 9 is mounted on the secondary surface 162b of the receptacle mounting substrate 162, and the charging IC 2 is mounted on the main surface 161a of the MCU mounting substrate 161.

The step-up DC / DC converter 9 and the charging IC 2 may generate non-negligible switching noise during voltage conversion. The step-up DC / DC converter 9 and the charging IC 2 are not arranged in the space SP sandwiched between the MCU mounting substrate 161 and the receptacle mounting substrate 162. As a result, not only external noise but also noise generated inside the suction device 100 is less likely to enter the space SP sandwiched between the MCU mounting substrate 161 and the receptacle mounting substrate 162. Therefore, by arranging the important electronic components in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162, the important electronic components are less likely to break down, and the durability of the aspirator 100 is improved. The operation of the aspirator 100 is stable.

If the step-up DC / DC converter 9 and the charging IC 2 are arranged close to each other, switching noise on one side may affect the other. However, since the step-up DC / DC converter 9 is mounted on the secondary surface 162b of the receptacle mounting board 162 and the charging IC 2 is mounted on the main surface 161a of the MCU mounting board 161, the step-up DC / DC converter 9 and the charging IC 2 The MCU mounting substrate 161 and the receptacle mounting substrate 162 are interposed between them. As a result, the MCU mounting board 161 and the receptacle mounting board 162 serve as physical barriers, so that the influence of the switching noise generated in each of the step-up DC / DC converter 9 and the charging IC 2 on the other can be reduced, and the operation of the aspirator 100 can be reduced. Is stable.

Further, as shown in FIGS. 16 to 18, when the operation mode of the aspirator 100 is the heating initial setting mode and the heating mode, the step-up DC / DC converter 9 boosts the power supply voltage VBAT input to the switching terminal SW. It operates so as to output the drive voltage Vbst obtained from the output terminal VOUT. At this time, the charging IC 2 operates so that the OTG function is turned on and the system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat is output from the input terminal VBUS. As described above, the step-up DC / DC converter 9 and the charging IC 2 are configured to be operable at the same time.

Since the step-up DC / DC converter 9 is mounted on the secondary surface 162b of the receptacle mounting board 162 and the charging IC 2 is mounted on the main surface 161a of the MCU mounting board 161, it is between the step-up DC / DC converter 9 and the charging IC 2. The MCU mounting board 161 and the receptacle mounting board 162 intervene in the structure. Therefore, since the MCU mounting board 161 and the receptacle mounting board 162 serve as physical barriers, even if the step-up DC / DC converter 9 and the charging IC 2 operate at the same time, they occur in the step-up DC / DC converter 9 and the charging IC 2, respectively. It is possible to suppress the superposition of switching noise. As a result, noise that is difficult to deal with is less likely to be generated, so that the suction device 100 can be made highly functional while maintaining the stability of the operation of the suction device 100.

Further, as described above, the ROM 6, FF16, and the operational amplifier OP2 are not mounted on the main surface 162a of the receptacle mounting board 162, but are mounted on the sub surface 161b of the MCU mounting board 161. It is mounted on the main surface 162a of the mounting board 162.

Since the reactor Lc is mounted on the main surface 162a of the receptacle mounting substrate 162, it is arranged in the space SP sandwiched between the MCU mounting substrate 161 and the receptacle mounting substrate 162. Since a large current supplied to the heater HTR flows through the reactor Lc, the size of the reactor Lc is particularly large among the electronic components. Further, since the MCU mounting board 161 and the receptacle mounting board 162 are arranged so as to face each other with a predetermined distance or more in order to prevent a short circuit due to contact with each other, the MCU mounting board 161 and the receptacle mounting board are arranged so as to face each other. The space SP sandwiched by 162 has a predetermined volume or more. Therefore, by arranging the reactor Lc in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162, the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162 can be effectively utilized. The aspirator 100 can be miniaturized.

Further, the ROM 6, FF16, and the operational amplifier OP2 are not mounted on the receptacle mounting board 162 on which the reactor Lc through which a large current flows is mounted, but are mounted on the MCU mounting board 161. Therefore, problems occur in the ROM 6, FF16, and FF17. It becomes difficult and the operation of the aspirator 100 becomes stable.

Further, the buck-boost DC / DC converter 8 is mounted on the main surface 161a of the MCU mounting substrate 161.

Since the buck-boost DC / DC converter 8 is a switching regulator that generates the system power supply voltage Vcc1, the power to be handled is small and the switching noise is also minute. Therefore, by mounting the buck-boost DC / DC converter 8 on the main surface 161a of the MCU-mounted substrate 161, the switching noise generated in the buck-boost DC / DC converter 8 is sandwiched between the MCU-mounted substrate 161 and the receptacle mounting substrate 162. It is suppressed from invading the space SP. At the same time, the buck-boost DC / DC converter 8 is mounted on the same surface of the same board as the charging IC 2 that handles a larger amount of power, so that it is not necessary to separately provide a circuit board for mounting the buck-boost DC / DC converter 8. Each electronic component including the charging IC 2 can be operated stably, and the suction device 100 can be downsized and the cost can be reduced.

Although one embodiment of the present invention has been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such embodiments. It is clear that a person skilled in the art can come up with various modifications or modifications within the scope of the claims, which naturally belong to the technical scope of the present invention. Understood. Further, each component in the above-described embodiment may be arbitrarily combined as long as the gist of the invention is not deviated.

For example, the ROM 6, FF16, the operational amplifier OP2, and the switch driver 7 are mounted on the secondary surface 161b of the MCU mounting board 161 but at least a part of them is mounted on the main surface 162a of the receptacle mounting board 162. May be done. Also in this case, the ROM 6, the FF 16, the operational amplifier OP2, and the switch driver 7 are arranged in the space SP sandwiched between the MCU mounting board 161 and the receptacle mounting board 162. The ROM 6, FF16, and the operational amplifier OP2 may not all be mounted on the sub surface 161b of the MCU mounting board 161 or the main surface 162a of the receptacle mounting board 162, and at least one of them is the MCU mounting board 161. It may be mounted on the secondary surface 161b or the main surface 162a of the receptacle mounting substrate 162.

Further, for example, the switch S3 is mounted on the secondary surface 162b of the receptacle mounting board 162, but the switch S3 may be mounted on the main surface 161a of the MCU mounting board 161.

Further, for example, the buck-boost DC / DC converter 8 is mounted on the main surface 161a of the MCU mounting board 161. However, the buck-boost DC / DC converter 8 is mounted on the sub surface 162b of the receptacle mounting board 162. You may.

At least the following items are described in the present specification. The components and the like corresponding to the above-described embodiments are shown in parentheses, but the present invention is not limited thereto.

(1) Power supply (power supply BAT) and
A heater connector (heater connector Cn) to which a heater (heater HTR) that consumes the electric power supplied from the power source to heat the aerosol source is connected, and
A controller (MCU1) configured to be able to control the supply of electric power from the power source to the heater, and
A first circuit board (MCU mounting board 161) including a first surface (secondary surface 161b) and a second surface (main surface 161a) which is the back surface of the first surface.
A second circuit board (receptacle mounting board 162) including a third surface (main surface 162a) facing the first surface and a fourth surface (secondary surface 162b) which is the back surface of the third surface.
A storage circuit (ROM6, flip-flop 16) that can store input information and / or an operational amplifier (operational amplifier OP2) to which an output terminal is connected to the controller, which is mounted on the first surface or the third surface. The power supply unit of the aerosol generator (non-combustion type suction device 100).

According to (1), the storage circuit and / or the operational amplifier is arranged in the space sandwiched between the first circuit board and the second circuit board. Static electricity and noise are less likely to enter the space sandwiched between the first circuit board and the second circuit board. As a result, the storage circuit and / or the operational amplifier is less likely to fail, the durability of the power supply unit of the aerosol generator is improved, and the operation of the power supply unit of the aerosol generator is stabilized.

(2) The power supply unit of the aerosol generator according to (1).
A power supply unit for an aerosol generator, comprising the storage circuit and the operational amplifier, mounted on the first surface or the third surface.

According to (2), the storage circuit and the operational amplifier are arranged in the space sandwiched between the first circuit board and the second circuit board. As a result, the storage circuit and the operational amplifier are less likely to fail, the durability of the power supply unit of the aerosol generator is improved, and the operation of the power supply unit of the aerosol generator is stabilized.

(3) The power supply unit of the aerosol generator according to (1) or (2).
A restart circuit (switch driver 7) capable of restarting the controller is provided.
The restart circuit is a power supply unit of an aerosol generator mounted on the first surface or the third surface.

According to (3), the restart circuit is arranged in the space sandwiched between the first circuit board and the second circuit board. As a result, the restart circuit is less likely to break down, the durability of the power supply unit of the aerosol generator is improved, and the operation of the power supply unit of the aerosol generator is stabilized.

(4) The power supply unit of the aerosol generator according to any one of (1) to (3).
A switch (switch S3) connected to the heater connector and switched when supplying electric power for heating the aerosol source to the heater is provided.
The switch is a power supply unit of an aerosol generator that is not mounted on the first surface and the third surface.

According to (4), since the switch is not arranged in the space sandwiched between the first circuit board and the second circuit board, external noise is generated in the space sandwiched between the first circuit board and the second circuit board. Not only that, noise generated inside the power supply unit of the aerosol generator is less likely to enter. In particular, a switch that is switched when supplying electric power for heating an aerosol source to a heater switches a large current, and therefore noise such as switching noise is likely to occur. As a result, by arranging the important electronic components in the space sandwiched between the first circuit board and the second circuit board, the important electronic components are less likely to fail, and the durability of the power supply unit of the aerosol generator is improved. It improves and the operation of the power supply unit of the aerosol generator becomes stable.

(5) The power supply unit of the aerosol generator according to any one of (1) to (4).
The controller is a power supply unit of an aerosol generator that is not mounted on the first surface and the third surface.

According to (5), the controller that tends to occupy a large area on the circuit board is not arranged in the space sandwiched between the first circuit board and the second circuit board, so that the first circuit board and the second circuit board It is possible to mount more electronic components in the space sandwiched by. This makes it possible to place more important electronic components in the space sandwiched between the first circuit board and the second circuit board, improving the durability of the power supply unit of the aerosol generator and making the aerosol. The operation of the power supply unit of the generator is stable.

(6) The power supply unit of the aerosol generator according to any one of (1) to (5).
Equipped with a communication module (communication IC15)
The communication module is a power supply unit of an aerosol generator that is not mounted on the first surface and the third surface.

According to (6), since the communication module is not arranged in the space sandwiched between the first circuit board and the second circuit board where the communication radio wave is hard to reach, the operation of the power supply unit of the aerosol generator including the communication function is performed. Stabilize.

(7) The power supply unit of the aerosol generator according to (6).
A third circuit board (LED mounting board 163) separated from the first circuit board and the second circuit board is provided.
The communication module is a power supply unit of an aerosol generator mounted on the third circuit board.

According to (7), since the communication module is mounted on the first circuit board and the third circuit board separated from the second circuit board where the communication radio wave is hard to reach, the operation of the power supply unit of the aerosol generator including the communication function. Is stable.

(8) The power supply unit of the aerosol generator according to any one of (1) to (7).
A first switching regulator IC (boost DC / DC converter 9) connected to the power supply is provided.
The first switching regulator IC is a power supply unit of an aerosol generator that is not mounted on the first surface and the third surface.

A switching regulator such as a first switching regulator IC tends to generate noise such as switching noise during switching for voltage conversion.
According to (8), since the first switching regulator IC is not arranged in the space sandwiched between the first circuit board and the second circuit board, it is placed in the space sandwiched between the first circuit board and the second circuit board. Is less likely to invade not only external noise but also noise generated inside the power supply unit of the aerosol generator. As a result, by arranging the important electronic components in the space sandwiched between the first circuit board and the second circuit board, the important electronic components are less likely to fail, and the durability of the power supply unit of the aerosol generator is improved. It improves and the operation of the power supply unit of the aerosol generator becomes stable.

(9) The power supply unit of the aerosol generator according to (8).
The reactor (reactor Lc) connected to the first switching regulator IC and
The storage circuit and / or the operational amplifier, which are not mounted on the third surface but are mounted on the first surface, are provided.
The reactor is a power supply unit of an aerosol generator mounted on the third surface.

In order to prevent an unintended short-circuit current or the like, the space sandwiched between the first circuit board and the second circuit board has a not-so-small volume so that the boards do not come into contact with each other.
According to (9), the large-sized reactor is arranged in the space sandwiched between the first circuit board and the second circuit board, so that the space sandwiched between the first circuit board and the second circuit board can be used. It can be effectively used and the power supply unit of the aerosol generator can be miniaturized. Further, since the storage circuit and / or the operational amplifier is not mounted on the second circuit board on which the reactor through which a large current flows is mounted, but is mounted on the first circuit board, the storage circuit and / or the operational amplifier is less likely to malfunction. Therefore, the operation of the power supply unit of the aerosol generator becomes stable.

(10) The power supply unit of the aerosol generator according to (9).
A second switching regulator IC (charging IC 2 or buck-boost DC / DC converter 8) connected to the power supply is provided.
The first switching regulator IC is mounted on the fourth surface and is mounted on the fourth surface.
The second switching regulator IC is a power supply unit of an aerosol generator mounted on the second surface.

According to (10), the first circuit board and the second circuit board are interposed between the first switching regulator IC and the second switching regulator IC. As a result, the first circuit board and the second circuit board become a physical barrier, so that the switching noise generated in each of the first switching regulator IC and the second switching regulator IC becomes the other and the first circuit board and the second circuit board. The influence on the electronic components arranged in the space sandwiched by the above can be reduced, and the operation of the power supply unit of the aerosol generator is stabilized.

(11) The power supply unit of the aerosol generator according to (10).
The first switching regulator IC and the second switching regulator IC are power supply units of an aerosol generator configured to be operable at the same time.

According to (11), since the first circuit board and the second circuit board serve as physical barriers, even if the first switching regulator IC and the second switching regulator IC operate at the same time, the first switching regulator IC And it is possible to suppress the superposition of switching noise generated in each of the second switching regulator ICs. As a result, noise that is difficult to deal with is less likely to be generated, so that the power supply unit of the aerosol generator can be made highly functional while maintaining the operational stability of the power supply unit of the aerosol generator.

(12) The power supply unit of the aerosol generator according to (10) or (11).
Receptacle (Receptacle RCP) that can be electrically connected to an external power source,
A third switching regulator IC (boost-boost DC / DC converter 8) that converts the power supplied from the power supply and supplies it to the power supply terminal of the controller is provided.
The first switching regulator IC converts the electric power supplied from the power supply and supplies it to the heater.
The second switching regulator IC converts the electric power supplied from the receptacle and supplies it to the power supply.
The third switching regulator IC is a power supply unit of an aerosol generator mounted on the second surface or the fourth surface.

According to (12), since the third switching regulator IC is a switching regulator that converts the power supplied from the power supply and supplies it to the power supply terminal of the controller, the power to be handled is small and the switching noise is also minute. Therefore, by mounting the third switching regulator IC on the second or fourth surface, the switching noise generated by the third switching regulator IC invades the space sandwiched between the first circuit board and the second circuit board. Can be suppressed. At the same time, since the third switching regulator IC is mounted on the same surface of the same substrate as the first switching regulator IC or the second switching regulator IC that handles a larger amount of power, a circuit for mounting the third switching regulator IC. Each electronic component can be operated stably without the need to separately provide a substrate, and the power supply unit of the aerosol generator can be miniaturized and the cost can be reduced.

100 Non-combustion suction device (power supply unit for aerosol generator)
1 MCU (controller)
2 Charging IC (second switching regulator IC)
6 ROM (memory circuit)
7 Switch driver (restart circuit)
8 Buck-boost DC / DC converter (2nd switching regulator IC, 3rd switching regulator IC)
9 Boost DC / DC converter (1st switching regulator IC)
15 Communication IC (communication module)
16 Flip-flop (FF, memory circuit)
161 MCU mounting board (first circuit board)
161a Main surface (second surface)
161b Secondary surface (first surface)
162 Receptacle mounting board (second circuit board)
162a Main surface (third surface)
162b Secondary surface (4th surface)
163 LED mounting board (third circuit board)
BAT power supply Cn heater connector HTR heater Lc reactor OP2 operational amplifier RCP receptacle S3 switch

Claims (8)

Power supply and
An opening into which a flavor-generating base material with a susceptor can be inserted,
An induction heating coil for generating heat in the susceptor,
The connector to which the induction heating coil is connected and
A controller configured to be able to control the supply of electric power from the power source to the induction heating coil.
A first circuit board including a first surface and a second surface which is the back surface of the first surface.
A second circuit board including a third surface facing the first surface and a fourth surface which is the back surface of the third surface.
An aerosol generator comprising a storage circuit mounted on the first surface. The power supply unit of the aerosol generator according to claim 1.
It comprises a switch that is connected to the connector and is switched when supplying power to the susceptor to generate heat.
The switch is an aerosol generator mounted on the fourth surface. The aerosol generator according to claim 1 or 2.
An aerosol generator further comprising a circuit for generating a voltage for charging the power source, which is arranged on the second surface. The aerosol generator according to claim 3.
The circuit is an aerosol generation device that is arranged at a position that partially overlaps the storage circuit in an orthogonal projection onto the first surface. The aerosol generator according to any one of claims 1 to 4.
An aerosol generator further comprising an MCU arranged on the second circuit board. The aerosol generator according to claim 5.
The MCU is an aerosol generation device arranged at a position that does not overlap with the storage circuit in an orthogonal projection onto the first surface. The aerosol generator according to any one of claims 1 to 6.
It also has a button-type operation switch that can be operated by the user.
The operation switch is an aerosol generator that is not mounted on the first surface. The aerosol generator according to any one of claims 1 to 7.
The first circuit board and the second circuit board are provided between the first circuit board and the second circuit board so that the first circuit board and the second circuit board are arranged in parallel with each other. An aerosol generator further comprising a spacer for fixing the position of.

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