WO2022239360A1 - Power supply unit for aerosol generation device - Google Patents

Power supply unit for aerosol generation device Download PDF

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Publication number
WO2022239360A1
WO2022239360A1 PCT/JP2022/007386 JP2022007386W WO2022239360A1 WO 2022239360 A1 WO2022239360 A1 WO 2022239360A1 JP 2022007386 W JP2022007386 W JP 2022007386W WO 2022239360 A1 WO2022239360 A1 WO 2022239360A1
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WO
WIPO (PCT)
Prior art keywords
switch
power supply
terminal
voltage
resistor
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Application number
PCT/JP2022/007386
Other languages
French (fr)
Japanese (ja)
Inventor
達也 青山
拓嗣 川中子
徹 長浜
貴司 藤木
亮 吉田
Original Assignee
日本たばこ産業株式会社
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Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Publication of WO2022239360A1 publication Critical patent/WO2022239360A1/en

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent Document 1 describes an operational amplifier that heats an aerosol source and outputs according to a voltage applied to a load having a correlation between temperature and electrical resistance, and a configuration that performs processing based on the voltage according to the output. and a first circuit and a second circuit electrically connected in parallel between the power supply and the load, wherein the first circuit and the second circuit connect the first switch and the second switch.
  • Control devices for aerosol inhalers are described, each including a device. This control device is configured to obtain a voltage corresponding to the output of the operational amplifier while the second switch is in the ON state.
  • Patent Document 2 discloses a heating element having a predetermined resistance value, a power supply for supplying power to the heating element, a plurality of resistors connected in parallel with the heating element, a control unit, and an on-state control unit for the heating element.
  • a configured non-combustion inhaler is described.
  • switching elements such as bipolar transistors and MOSFETs (metal-oxide-semiconductor field-effect transistors) are used to control the discharge from the power supply to the heater. There was room for examination as to what position to mount such a switching element.
  • the purpose of the present invention is to provide an aerosol generator capable of improving control stability.
  • the power supply unit of the aerosol generating device of one aspect of the present invention includes a power supply, a + pole and a - pole, and a heater that consumes power supplied from the power supply to heat the aerosol source comprises the + pole and the - pole.
  • a heater connector connected to one of the + and - poles;
  • a first branch circuit including a first switch and a fixed resistor connected to one of the + and - poles; and one of the + and - poles.
  • a second branch circuit including a second switch and connected in parallel to the first branch circuit, a third switch connected to the other of the + pole and the - pole, an A side, and the A side and a controller configured to be able to control the first switch, the second switch, and the third switch, wherein the second switch is the is mounted on side A, at least one of the first switch and the third switch is mounted on side B or a second circuit board separate from the first circuit board, and the controller is mounted on the first switch and when the third switch is ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector, and power for generating aerosol is supplied while the third switch is ON.
  • the second switch is repeatedly switched ON and OFF so as to supply the heater.
  • the power supply unit of the aerosol generating device of one aspect of the present invention includes a power supply, a + pole and a - pole, and a heater that consumes power supplied from the power supply to heat the aerosol source comprises the + pole and the - pole.
  • a heater connector connected to one of the + and - poles;
  • a first branch circuit including a first switch and a fixed resistor connected to one of the + and - poles; and one of the + and - poles.
  • a first circuit board including a second branch circuit connected in parallel to the first branch circuit and including a second switch; a surface A; a controller configured to be able to control the first switch and the second switch, the second switch being mounted on the A side, and the first switch being connected to the B side or the first circuit board. is mounted on a separate second circuit board, and the controller performs predetermined control based on the voltage applied to the fixed resistor or the heater connector when the first switch is ON, and releases the aerosol
  • the second switch is repeatedly turned on and off so as to supply electric power for generation to the heater.
  • FIG. 1 is a perspective view of a non-combustion inhaler
  • FIG. 1 is a perspective view of a non-combustion inhaler showing a state in which a rod is attached
  • FIG. Fig. 10 is another perspective view of a non-combustion type inhaler
  • 1 is an exploded perspective view of a non-combustion inhaler
  • FIG. Fig. 3 is a perspective view of the internal unit of the non-combustion inhaler
  • FIG. 6 is an exploded perspective view of the internal unit of FIG. 5
  • FIG. 3 is a perspective view of the internal unit with the power supply and chassis removed
  • FIG. 11 is another perspective view of the internal unit with the power supply and chassis removed
  • It is a schematic diagram for demonstrating the operation mode of an aspirator.
  • FIG. 4 is a diagram for explaining the operation of an electric circuit in sleep mode; It is a figure for demonstrating the operation
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode; It is a figure for demonstrating the operation
  • FIG. 5 is a diagram for explaining the operation of the electric circuit when detecting the temperature of the heater in the heating mode; FIG.
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in charging mode;
  • FIG. 4 is a diagram for explaining the operation of an electric circuit when an MCU is reset (restarted);
  • FIG. 11 is a circuit diagram of a main part of the electric circuit shown in FIG. 10, showing the main electronic components used for heating the heater and detecting the temperature. It is a figure which shows an example of the voltage change input into the gate terminal of switch S3 and switch S4 in heating mode.
  • FIG. 4 is a diagram showing current flow during heating control in a heating mode.
  • FIG. 5 is a diagram showing current flow during temperature detection control in a heating mode;
  • FIG. 22 is a diagram showing the current flow when both the switch S3 and the switch S4 are turned on in the drive example EX2 of FIG. 21;
  • FIG. 4 is a plan view of the receptacle-mounted substrate viewed from the main surface side; It is the top view which looked at the receptacle mounting board
  • suction system which is one embodiment of the aerosol generator of the present invention, will be described below with reference to the drawings.
  • This suction system includes a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100.
  • suction device 100 a non-combustion type suction device 100
  • the suction device 100 accommodates the heating unit in a non-detachable manner
  • the heating unit may be detachably attached to the aspirator 100 .
  • the rod 500 and the heating unit may be integrated and detachably attached to the aspirator 100 .
  • the power supply unit of the aerosol generator may have a configuration that does not include the heating section as a component.
  • “non-detachable” refers to a mode in which detachment is not possible as far as the intended use is concerned.
  • an induction heating coil provided in the aspirator 100 and a susceptor built in the rod 500 may cooperate to form a heating unit.
  • FIG. 1 is a perspective view showing the overall configuration of the aspirator 100.
  • FIG. FIG. 2 is a perspective view of the suction device 100 showing a state in which the rod 500 is attached.
  • FIG. 3 is another perspective view of the suction device 100.
  • FIG. FIG. 4 is an exploded perspective view of the aspirator 100.
  • FIG. Also, in the following description, for the sake of convenience, the orthogonal coordinate system of a three-dimensional space is used, in which the three mutually orthogonal directions are the front-back direction, the left-right direction, and the up-down direction. In the figure, the front is indicated by Fr, the rear by Rr, the right by R, the left by L, the upper by U, and the lower by D.
  • the inhaler 100 generates flavor-containing aerosol by heating an elongated, substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-generating base having a filling containing an aerosol source and a flavor source. configured to
  • Rod 500 includes a fill containing an aerosol source that is heated at a predetermined temperature to produce an aerosol.
  • the type of aerosol source is not particularly limited, and extracts from various natural products and/or their constituent components can be selected according to the application.
  • the aerosol source may be solid or liquid, for example polyhydric alcohols such as glycerin, propylene glycol, or water.
  • the aerosol source may include a flavor source such as a tobacco material or an extract derived from the tobacco material that releases flavor components upon heating.
  • the gas to which the flavor component is added is not limited to an aerosol, and for example an invisible vapor may be generated.
  • the filling of rod 500 may contain tobacco shreds as a flavor source.
  • Materials for shredded tobacco are not particularly limited, and known materials such as lamina and backbone can be used.
  • the filling may contain one or more perfumes.
  • the type of flavoring agent is not particularly limited, but menthol is preferable from the viewpoint of imparting a good smoking taste.
  • Flavor sources may contain plants other than tobacco, such as mints, herbal medicines, or herbs. Depending on the application, rod 500 may not contain a flavor source.
  • the suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface.
  • the case 110 comprises a bottomed cylindrical case body 112 in which front, rear, top, bottom, and right surfaces are integrally formed, and a left surface that seals an opening 114 (see FIG. 4) of the case body 112. It has an outer panel 115 , an inner panel 118 , and a slider 119 .
  • the inner panel 118 is fixed to the case body 112 with bolts 120 .
  • the outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held by a chassis 150 (see FIG. 5) housed in the case body 112 and described later. Since the outer panel 115 is fixed by the magnet 124, the user can replace the outer panel 115 according to his or her preference.
  • the inner panel 118 is provided with two through holes 126 through which the magnets 124 pass.
  • the inner panel 118 is further provided with a longitudinally elongated hole 127 and a circular round hole 128 between the two vertically arranged through holes 126 .
  • This long hole 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case body 112 .
  • a button-type operation switch OPS built in the case body 112 passes through the round hole 128 . Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. FIG. Also, the user can press down the operation switch OPS via the pressing portion 117 of the outer panel 115 .
  • the upper surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted.
  • the slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position for closing the opening 132 (see FIG. 1) and a position for opening the opening 132 (see FIG. 2).
  • the operation switch OPS is used to perform various operations of the aspirator 100.
  • the user operates the operation switch OPS via the pressing portion 117 while inserting the rod 500 into the opening 132 as shown in FIG.
  • the heating unit 170 (see FIG. 5) heats the rod 500 without burning it.
  • an aerosol is generated from the aerosol source contained in the rod 500 and the flavor of the flavor source contained in the rod 500 is added to the aerosol.
  • the user can inhale the flavor-containing aerosol by holding the mouthpiece 502 of the rod 500 projecting from the opening 132 and inhaling.
  • a charging terminal 134 is provided for receiving power supply by being electrically connected to an external power source such as an outlet or a mobile battery.
  • the charging terminal 134 is a USB (Universal Serial Bus) Type-C receptacle, but is not limited to this.
  • Charging terminal 134 is hereinafter also referred to as receptacle RCP.
  • the charging terminal 134 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply.
  • the wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type.
  • the charging terminal 134 can be connected to various USB terminals or the like, and may have the power receiving coil described above.
  • the configuration of the aspirator 100 shown in FIGS. 1-4 is merely an example.
  • the inhaler 100 holds the rod 500 and applies an action such as heating to generate gas to which a flavor component is added from the rod 500, and the user can inhale the generated gas. It can be configured in various forms.
  • FIG. 5 is a perspective view of the internal unit 140 of the suction device 100.
  • FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5.
  • FIG. 7 is a perspective view of internal unit 140 with power supply BAT and chassis 150 removed.
  • FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and chassis 150 removed.
  • the internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.
  • the chassis 150 includes a plate-shaped chassis body 151 arranged substantially in the center of the interior space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, and a chassis body 151 disposed substantially in the center of the interior space of the case 110 in the front-rear direction.
  • a plate-shaped front and rear dividing wall 152 extending in the vertical and horizontal directions
  • a plate-shaped upper and lower dividing wall 153 extending forward from substantially the center of the front and rear dividing wall 152 in the vertical direction
  • the front and rear dividing wall 152 and the upper edges of the chassis body 151 and a plate-shaped chassis lower wall 155 extending rearward from the front-rear dividing wall 152 and the lower edge of the chassis body 151 .
  • the left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.
  • the internal space of the case 110 is defined by a chassis 150 such that a heating unit housing area 142 is defined in the upper front, a board housing area 144 is defined in the lower front, and a power supply housing space 146 is defined in the rear to extend vertically. ing.
  • the heating part 170 housed in the heating part housing area 142 is composed of a plurality of tubular members, which are concentrically arranged to form a tubular body as a whole.
  • the heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) that heats the rod 500 from its outer circumference or center.
  • the surface of the rod housing portion 172 and the heater HTR are insulated by forming the rod housing portion 172 from a heat insulating material or providing a heat insulating material inside the rod housing portion 172 .
  • the heater HTR may be any element that can heat the rod 500 .
  • the heater HTR is, for example, a heating element.
  • Heating elements include heating resistors, ceramic heaters, induction heaters, and the like.
  • the heater HTR for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used.
  • a heater HTR having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used.
  • the heating part 170 has a function of defining a flow path of air to be supplied to the rod 500 and a function of heating the rod 500 .
  • the case 110 is formed with a vent (not shown) for introducing air, and is configured to allow air to enter the heating unit 170 .
  • the power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery.
  • the electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
  • the notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the state of charge of the power supply BAT, the preheating time during suction, and the suction possible period.
  • the notification unit 180 of this embodiment includes eight LEDs L1 to L8 and a vibration motor M.
  • the notification unit 180 may be composed of light emitting elements such as LEDs L1 to L8, may be composed of vibrating elements such as the vibration motor M, or may be composed of sound output elements.
  • the notification unit 180 may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
  • Various sensors include an intake air sensor that detects the user's puff action (sucking action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , a cover position sensor that detects the position of the slider 119, a panel detection sensor that detects attachment/detachment of the outer panel 115, and the like.
  • the intake sensor is mainly composed of a thermistor T2 arranged near the opening 132, for example.
  • the power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged near the power supply BAT.
  • the heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged near the heater HTR.
  • the rod housing portion 172 is preferably insulated from the heater HTR.
  • the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod housing portion 172 . If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor.
  • the case temperature sensor is mainly composed of, for example, a thermistor T4 arranged near the left surface of the case 110 .
  • the cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged near the slider 119 .
  • the panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged near the inner surface of the inner panel 118 .
  • the circuit section 160 includes four circuit boards, multiple ICs (Integrate Circuits), and multiple elements.
  • the four circuit boards are an MCU-mounted board 161 on which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are mainly arranged, a receptacle-mounted board 162 mainly on which charging terminals 134 are arranged, an operation switch OPS, and an LED An LED mounting substrate 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a Hall IC mounting substrate 164 on which a Hall IC 14 including a Hall element constituting a cover position sensor is arranged.
  • the MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144 . More specifically, the MCU mounting board 161 and the receptacle mounting board 162 are arranged such that their element mounting surfaces are arranged along the horizontal direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. .
  • the MCU mounting board 161 and the receptacle mounting board 162 are each provided with openings.
  • the MCU mounting board 161 and the receptacle mounting board 162 are fastened with bolts 136 to the board fixing portion 156 of the front/rear dividing wall 152 with a cylindrical spacer 173 interposed between the peripheral edges of these openings.
  • the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162 .
  • the MCU mounting board 161 and the receptacle mounting board 162 it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them.
  • the MCU mounting board 161 and the receptacle mounting board 162 have main surfaces 161a and 162a that face forward, and secondary surfaces 161b and 162b that are opposite to the main surfaces 161a and 162a. and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined gap therebetween.
  • a main surface 161 a of the MCU mounting board 161 faces the front surface of the case 110
  • a secondary surface 162 b of the receptacle mounting board 162 faces the front and rear dividing walls 152 of the chassis 150 .
  • Elements and ICs mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described later.
  • the LED mounting board 163 is arranged on the left side of the chassis body 151 and between the two magnets 124 arranged vertically.
  • the element mounting surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-rear direction.
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element mounting surface of the LED mounting board 163 .
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 and the element mounting surface of the LED mounting board 163 are not limited to being orthogonal, but preferably intersect (non-parallel).
  • the vibration motor M which forms the notification unit 180 together with the LEDs L1 to L8, is fixed to the bottom surface of the chassis bottom wall 155 and electrically connected to the MCU mounting board 161.
  • the Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154 .
  • FIG. 9 is a schematic diagram for explaining the operation modes of the aspirator 100.
  • the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initialization mode, heating mode, and heating termination mode.
  • the sleep mode is a mode for saving power by stopping the power supply to the electronic parts required for heating control of the heater HTR.
  • the active mode is a mode in which most functions except heating control of the heater HTR are enabled.
  • the operation mode is switched to the active mode.
  • the slider 119 is closed or the non-operating time of the operation switch OPS reaches a predetermined time while the aspirator 100 is operating in the active mode, the operating mode is switched to the sleep mode.
  • the heating initial setting mode is a mode for initializing control parameters and the like for starting heating control of the heater HTR.
  • the aspirator 100 detects the operation of the operation switch OPS while operating in the active mode, it switches the operation mode to the heating initial setting mode, and when the initial setting is completed, switches the operation mode to the heating mode.
  • the heating mode is a mode that executes heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection).
  • the aspirator 100 starts heating control of the heater HTR when the operation mode is switched to the heating mode.
  • the heating end mode is a mode for executing heating control end processing (heating history storage processing, etc.) of the heater HTR.
  • the operation mode is switched to the heating end mode.
  • the operation mode is switched to the active mode.
  • the USB connection is established while the aspirator 100 is operating in the heating mode, the operating mode is switched to the heating end mode, and when the end processing is completed, the operating mode is switched to the charging mode. As shown in FIG.
  • the operating mode may be switched to the active mode before switching the operating mode to the charging mode.
  • the aspirator 100 may switch the operation mode in order of the heating end mode, the active mode, and the charging mode when the USB connection is made while operating in the heating mode.
  • the charging mode is a mode in which the power supply BAT is charged with power supplied from an external power supply connected to the receptacle RCP.
  • the aspirator 100 switches the operation mode to the charge mode when an external power source is connected (USB connection) to the receptacle RCP while operating in sleep mode or active mode.
  • the aspirator 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released while operating in the charging mode.
  • FIG. 11 shows a range 161A mounted on the MCU mounting board 161 (range surrounded by thick dashed lines) and a range 163A mounted on the LED mounting board 163 (range surrounded by thick solid lines) in the electric circuit shown in FIG.
  • FIG. 12 is the same as FIG. 10 except that a range 162A mounted on the receptacle mounting board 162 and a range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. is.
  • the wiring indicated by the thick solid line in FIG. 10 is the wiring (the wiring connected to the ground provided in the internal unit 140) that has the same potential as the reference potential (ground potential) of the internal unit 140. It is described as a ground line below.
  • an electronic component in which a plurality of circuit elements are chipped is indicated by a rectangle, and the symbols of various terminals are indicated inside the rectangle.
  • a power supply terminal VCC and a power supply terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively.
  • a power supply terminal VSS and a ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side).
  • the power supply voltage is the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side. Chipped electronic components use this power supply voltage to perform various functions.
  • the MCU-mounted board 161 includes, as main electronic components, an MCU1 that controls the entire sucker 100, a charging IC2 that controls charging of the power source BAT, a capacitor, a resistor load switches (hereinafter referred to as LSW) 3, 4, 5, a ROM (Read Only Memory) 6, a switch driver 7, and a step-up/step-down DC/DC converter 8 (in the figure, buck-boost DC/DC 8), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16, 17, connector Cn (t2) (which is electrically connected to thermistor T2 constituting an intake sensor) ( The figure shows the thermistor T2 connected to this connector), and a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (the figure shows the thermistor T3 connected to this connector).
  • LSW resistor load switches
  • LSW resistor load switches
  • ROM Read Only Memory
  • switch driver 7 a switch driver 7
  • a ground terminal GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, step-up/step-down DC/DC converter 8, FF16, and FF17 is connected to a ground line.
  • a power terminal VSS of the ROM 6 is connected to the ground line.
  • a negative power supply terminal of each of the operational amplifiers OP2 and OP3 is connected to the ground line.
  • the LED mounting board 163 (area 163A) has, as main electronic components, a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, a communication IC 15 and are provided.
  • the communication IC 15 is a communication module for communicating with electronic devices such as smartphones.
  • a power supply terminal VSS of the Hall IC 13 and a ground terminal GND of the communication IC 15 are each connected to a ground line.
  • Communication IC 15 and MCU 1 are configured to be communicable via communication line LN.
  • One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.
  • the receptacle mounting board 162 (range 162A) includes a power connector electrically connected to the power supply BAT as a main electronic component (in the figure, the power supply BAT connected to this power connector is shown). ), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown), and a boost DC/DC converter 9 (in the figure, a boost DC/DC 9 ), the protection IC 10, the overvoltage protection IC 11, the fuel gauge IC 12, the receptacle RCP, the switches S3 to S6 configured by MOSFETs, the operational amplifier OP1, and the heater HTR. (positive electrode side and negative electrode side) heater connectors Cn are provided.
  • ground terminals GND of receptacle RCP, ground terminal GND of step-up DC/DC converter 9, power supply terminal VSS of protection IC 10, power supply terminal VSS of fuel gauge IC 12, ground terminal GND of overvoltage protection IC 11, and operational amplifier The negative power supply terminals of OP1 are each connected to the ground line.
  • the Hall IC mounting substrate 164 (area 164A) is provided with a Hall IC 14 including a Hall element that constitutes a cover position sensor.
  • a power terminal VSS of the Hall IC 14 is connected to the ground line.
  • the output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU1.
  • the MCU1 detects opening/closing of the slider 119 from a signal input to the terminal P8.
  • a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161 .
  • the two power supply input terminals V BUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC11 via a fuse Fs.
  • the USB voltage V USB is supplied to the two power input terminals V BUS of the receptacle RCP.
  • An input terminal IN of the overvoltage protection IC 11 is connected to one end of a voltage dividing circuit Pa consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pa is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11.
  • the overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold.
  • the overvoltage protection IC 11 stops voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected.
  • the output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of the voltage dividing circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. A connection point of the two resistors forming the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.
  • An input terminal VIN of LSW3 is connected to one end of a voltage dividing circuit Pf consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pf is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3.
  • the collector terminal of the bipolar transistor S2 is connected to the control terminal ON of LSW3.
  • the emitter terminal of the bipolar transistor S2 is connected to the ground line.
  • the base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1.
  • the output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2.
  • the MCU1 turns on the bipolar transistor S2 while the USB connection is not made.
  • the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2, so that a low level signal is input to the control terminal ON of LSW3.
  • the bipolar transistor S2 connected to LSW3 is turned off by MCU1 when the USB connection is made.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3.
  • the LSW 3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of LSW3 unless MCU1 turns off bipolar transistor S2.
  • the positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V BAT of the power supply BAT is supplied to the protection IC 10 , the charging IC 2 and the step-up DC/DC converter 9 .
  • a resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT.
  • a current detection terminal CS of the protection IC 10 is connected to a connection point between the resistor Ra and the switch Sa. Control terminals of the switches Sa and Sb are connected to the protection IC 10 . Both ends of the resistor Rb are connected to the fuel gauge IC12.
  • the protection IC 10 acquires the value of the current flowing through the resistor Ra during charging and discharging of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), the switch Sa , the switch Sb is controlled to open and close to stop the charging or discharging of the power source BAT, thereby protecting the power source BAT. More specifically, when the protection IC 10 acquires an excessive current value while charging the power supply BAT, it stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value during discharging of the power supply BAT, the protection IC 10 stops discharging the power supply BAT by turning off the switch Sa.
  • the protection IC 10 performs opening/closing control of the switch Sa and the switch Sb to The power supply BAT is protected by stopping the charging or discharging of BAT. More specifically, when the protection IC 10 detects that the power supply BAT is overcharged, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When detecting overdischarge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.
  • a resistor Rt1 is connected to a connector connected to the thermistor T1 arranged near the power supply BAT.
  • a series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12.
  • a connection point between the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the fuel gauge IC12.
  • the thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.
  • the fuel gauge IC 12 detects the current flowing through the resistor Rb, and based on the detected current value, indicates the remaining capacity of the power supply BAT, SOC (State Of Charge) indicating the state of charge, and SOH (State Of Charge) indicating the state of health. Health) and other battery information.
  • the fuel gauge IC12 supplies a voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG.
  • the fuel gauge IC 12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage.
  • the fuel gauge IC12 is connected to the MCU1 via a communication line LN for serial communication, and is configured to be able to communicate with the MCU1.
  • the fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1.
  • serial communication requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that only one signal line is shown in FIGS. 10-19 for simplicity.
  • the fuel gauge IC 12 has a notification terminal 12a.
  • the notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of a diode D2, which will be described later.
  • the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it notifies the MCU 1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low level signal is also input to the CLR ( ⁇ ) terminal of the FF 17 via the diode D2.
  • One end of the reactor Lc is connected to the switching terminal SW of the step-up DC/DC converter 9 .
  • the other end of this reactor Lc is connected to the input terminal VIN of the step-up DC/DC converter 9 .
  • the step-up DC/DC converter 9 performs on/off control of the built-in transistor connected to the switching terminal SW to step up the input voltage and output it from the output terminal VOUT.
  • the input terminal VIN of the step-up DC/DC converter 9 constitutes a power supply terminal of the step-up DC/DC converter 9 on the high potential side.
  • the boost DC/DC converter 9 performs a boost operation when the signal input to the enable terminal EN is at high level.
  • the signal input to the enable terminal EN of the boost DC/DC converter 9 may be controlled to be low level by the MCU1.
  • the MCU 1 does not control the signal input to the enable terminal EN of the boost DC/DC converter 9, so that the potential of the enable terminal EN may be made indefinite.
  • the output terminal VOUT of the step-up DC/DC converter 9 is connected to the source terminal of the switch S4 composed of a P-channel MOSFET.
  • the gate terminal of switch S4 is connected to terminal P15 of MCU1.
  • One end of the resistor Rs is connected to the drain terminal of the switch S4.
  • the other end of the resistor Rs is connected to a positive heater connector Cn connected to one end of the heater HTR.
  • a voltage dividing circuit Pb consisting of two resistors is connected to the connection point between the switch S4 and the resistor Rs.
  • a connection point of the two resistors forming the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1.
  • a connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.
  • a connection line between the output terminal VOUT of the step-up DC/DC converter 9 and the source terminal of the switch S4 is connected to the source terminal of the switch S3 composed of a P-channel MOSFET.
  • the gate terminal of switch S3 is connected to terminal P16 of MCU1.
  • a drain terminal of the switch S3 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC/DC converter 9 and the positive electrode side of the heater connector Cn. . Since the circuit including the switch S3 does not have a resistor, it has a lower resistance than the circuit including the switch S4 and the resistor Rs.
  • the non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the inverting input terminal of the operational amplifier OP1 is connected to the negative heater connector Cn connected to the other end of the heater HTR and to the drain terminal of the switch S6 composed of an N-channel MOSFET.
  • the source terminal of switch S6 is connected to the ground line.
  • a gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the step-up DC/DC converter 9.
  • the cathode of diode D4 is connected to the Q terminal of FF17.
  • resistor R4 One end of a resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. A source terminal of the switch S5 is connected to the ground line. A gate terminal of the switch S5 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1-L8.
  • the cathodes of the LEDs L1-L8 are connected to the control terminals PD1-PD8 of the MCU1 via current limiting resistors. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS.
  • the LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2.
  • the MCU 1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND.
  • the MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to light it, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1.
  • the brightness and light emission pattern of the LED L1 can be dynamically controlled.
  • LEDs L2 to L8 are similarly controlled by the MCU1.
  • the charging IC2 has a charging function of charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS.
  • the charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wiring (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Also, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 through serial communication using the communication line LN, and use it for charging control.
  • the charging IC2 further comprises a V BAT power pass function and an OTG function.
  • the V BAT power pass function is a function of outputting from the output terminal SYS a system power supply voltage Vcc0 substantially matching the power supply voltage V BAT input to the charging terminal bat.
  • the OTG function is a function for outputting from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat.
  • ON/OFF of the OTG function of the charging IC 2 is controlled by the MCU 1 through serial communication using the communication line LN.
  • the power supply voltage V BAT input to the charging terminal bat may be directly output from the input terminal VBUS. In this case, power supply voltage VBAT and system power supply voltage Vcc4 are substantially the same.
  • the output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the step-up/step-down DC/DC converter 8 .
  • One end of a reactor La is connected to the switching terminal SW of the charging IC2.
  • the other end of the reactor La is connected to the output terminal SYS of the charging IC2.
  • a charge enable terminal CE ( ⁇ ) of the charge IC2 is connected to a terminal P22 of the MCU1 via a resistor.
  • the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 which will be described later.
  • the base terminal of bipolar transistor S1 is connected to the Q terminal of FF17.
  • one end of a resistor Rc is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the other end of the resistor Rc is connected to the output terminal VOUT of LSW4.
  • a resistor is connected to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the signal input to the enable terminal EN of the step-up/step-down DC/DC converter 8 is at a high level. Then, the step-up/step-down DC/DC converter 8 starts step-up operation or step-down operation.
  • the step-up/step-down DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1, and the output terminal VOUT.
  • Output from The output terminal VOUT of the buck-boost DC/DC converter 8 includes the feedback terminal FB of the buck-boost DC/DC converter 8, the input terminal VIN of the LSW 4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF 16. and connected to A wiring to which system power supply voltage Vcc1 output from output terminal VOUT of step-up/step-down DC/DC converter 8 is supplied is referred to as power supply line PL1.
  • the LSW4 When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT.
  • the control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high level signal is input to the control terminal ON of the LSW4.
  • the voltage output from LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored. Described as voltage Vcc2.
  • the output terminal VOUT of the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , and the power supply terminal VCC of the FF 17 .
  • a wiring to which system power supply voltage Vcc2 output from output terminal VOUT of LSW4 is supplied is referred to as power supply line PL2.
  • the LSW5 When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT.
  • a control terminal ON of LSW5 is connected to terminal P23 of MCU1.
  • the voltage output from LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored. Described as voltage Vcc3.
  • a wiring to which system power supply voltage Vcc3 output from output terminal VOUT of LSW5 is supplied is referred to as power supply line PL3.
  • a series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line.
  • the thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of the MCU1.
  • the MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the amount of temperature variation.
  • a series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line.
  • the thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of the MCU1 and the inverting input terminal of the operational amplifier OP2.
  • the MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.
  • a series circuit of a thermistor T4 and a resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line.
  • the thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and the connection point between them is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3.
  • the MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.
  • a source terminal of a switch S7 composed of a MOSFET is connected to the power supply line PL2.
  • the gate terminal of switch S7 is connected to terminal P20 of MCU1.
  • a drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line.
  • the MCU1 can control the opening/closing of the switch S7 by manipulating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern.
  • a dedicated driver IC may be used instead of the switch S7.
  • a positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2.
  • the operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (signal corresponding to the resistance value of the thermistor T3).
  • the thermistor T3 since the thermistor T3 has the NTC characteristic, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2.
  • the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 is connected to the non-inverting input terminal of the operational amplifier OP2, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP2.
  • the output of the pressure circuit Pd may be connected.
  • a positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3.
  • the operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4).
  • the thermistor T4 having the NTC characteristic is used, so the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3.
  • the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 is connected to the non-inverting input terminal of the operational amplifier OP3, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP3.
  • the output of the pressure circuit Pe may be connected.
  • a resistor R1 is connected to the output terminal of the operational amplifier OP2.
  • a cathode of a diode D1 is connected to the resistor R1.
  • the anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR ( ⁇ ) terminal of the FF17.
  • a connection line between the resistor R1 and the diode D1 is connected to a resistor R2 connected to the power supply line PL1. Also, the CLR ( ⁇ ) terminal of the FF 16 is connected to this connection line.
  • resistor R3 One end of a resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17.
  • the other end of resistor R3 is connected to power supply line PL2.
  • the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR ( ⁇ ) terminal of the FF 17 are connected to this connection line.
  • the cathode of diode D3 is connected to terminal P5 of MCU1.
  • the FF16 When the temperature of the heater HTR becomes excessive and the signal output from the operational amplifier OP2 becomes low and the signal input to the CLR ( ⁇ ) terminal becomes low level, the FF16 outputs a high level signal from the Q ( ⁇ ) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in the FF 16, a low level signal continues to be output from the Q ( ⁇ ) terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • the signal input to the CLR ( ⁇ ) terminal of the FF 17 is when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and when an abnormality is detected from the notification terminal 12a of the fuel gauge IC 12.
  • the low-level signal shown When the low-level signal shown is output, it becomes low-level.
  • the FF 17 outputs a low level signal from the Q terminal when the signal input to the CLR ( ⁇ ) terminal becomes low level.
  • This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC/DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. be.
  • the CE ( ⁇ ) terminal of the charging IC2 is of negative logic, the charging of the power source BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 attempts to output a low-level enable signal from the terminal P22 to the charge enable terminal CE ( ⁇ ) of the charging IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1 and the charge enable terminal CE ( ⁇ ) of the charge IC2. Note that a high level signal is input to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • a high-level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, the FF 17 continues to output a high level signal from the Q terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • a low level signal is output from the output terminal of the operational amplifier OP3
  • a low level signal is input to the CLR ( ⁇ ) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2.
  • the low level signal output from the output terminal of the operational amplifier OP3 is not affected by the high level signal due to the diode D1. sea bream.
  • the high level signal is passed through the diode D1. signal.
  • the power line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164 side.
  • the power terminal VDD of the hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the hall IC 14 are connected to the branched power line PL2.
  • the output terminal OUT of the Hall IC 13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the Hall IC 13 .
  • the MCU 1 determines whether or not the outer panel 115 is attached based on the signal input to the terminal P3.
  • a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting board 163 .
  • This series circuit is connected to power supply line PL2.
  • a connection point between the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7.
  • FIG. When the operation switch OPS is not pressed, the operation switch OPS is not conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are at a high level due to the system power supply voltage Vcc2.
  • the operation switch OPS When the operation switch OPS is pressed and turned on, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground line, and thus become low level.
  • the MCU1 detects the operation of the operation switch OPS from the signal input to the terminal P4.
  • the switch driver 7 is provided with a reset input terminal RSTB.
  • the reset input terminal RSTB is connected to the control terminal ON of LSW4.
  • the switch driver 7 By outputting a low level signal from the reset input terminal RSTB, the output operation of LSW4 is stopped.
  • the operation switch OPS which is originally pushed down via the pressing portion 117 of the outer panel 115, is directly pushed down by the user with the outer panel 115 removed, the signal is input to the terminals SW1 and SW2 of the switch driver 7. become low level.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode.
  • FIG. 18 is a diagram for explaining the operation of the electric circuit in charging mode.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation
  • FIGS. 13 to 19 are diagrams for explaining the operation of the electric circuit when the MCU 1 is reset (restarted).
  • the terminals surrounded by dashed ellipses have inputs or outputs such as the power supply voltage V BAT , the USB voltage V USB , and the system power supply voltage. It shows the terminals that have been made.
  • the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • FIG. 1 the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • MCU1 enables the V BAT power pass function of charging IC2 and disables the OTG function and charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC2, the VBAT power pass function of the charging IC2 is enabled. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function is disabled. Therefore, the charging IC2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat, and outputs it from the output terminal SYS.
  • the system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the buck-boost DC/DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to an enable terminal EN of positive logic, generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it to an output terminal VOUT.
  • Output from The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC/DC converter 8 is applied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal and , respectively.
  • the LSW4 When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT.
  • the system power supply voltage Vcc2 output from the LSW4 is applied to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14. is entered.
  • the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE ( ⁇ ) of the charging IC2, and the FF17. They are supplied to the power supply terminal VCC, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd.
  • the bipolar transistor S1 connected to the charging IC2 is off unless a low level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE ( ⁇ ) of the charging IC2. Since the charge enable terminal CE ( ⁇ ) of the charge IC2 is of negative logic, the charge function of the charge IC2 is turned off in this state.
  • LSW 5 stops outputting system power supply voltage Vcc3, so power supply to electronic components connected to power supply line PL3 is stopped. Also, in the sleep mode, the OTG function of the charging IC 2 is stopped, so power supply to the LEDs L1 to L8 is stopped.
  • Fig. 14> When the MCU 1 detects that the signal input to the terminal P8 becomes high level from the sleep mode state of FIG. 13 and the slider 119 is opened, it inputs a high level signal from the terminal P23 to the control terminal ON of the LSW5. . As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT as the system power supply voltage Vcc3. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
  • the MCU1 detects that the slider 119 is opened, the MCU1 enables the OTG function of the charging IC2 via the communication line LN.
  • the charging IC2 outputs from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat.
  • the system power supply voltage Vcc4 output from the input terminal VBUS is It is fed to the LEDs L1-L8.
  • Fig. 15> From the state of FIG. 14, when the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then boosts the voltage from the terminal P14. A high-level enable signal is input to the enable terminal EN of the DC/DC converter 9 . As a result, the step-up DC/DC converter 9 outputs the driving voltage V bst obtained by stepping up the power supply voltage V BAT from the output terminal VOUT. The drive voltage Vbst is supplied to switch S3 and switch S4. In this state, the switches S3 and S4 are off. Also, the switch S6 is turned on by the high-level enable signal output from the terminal P14.
  • the negative terminal of the heater HTR is connected to the ground line, and the heater HTR can be heated by turning on the switch S3.
  • the mode shifts to the heating mode.
  • Fig. 16> In the state of FIG. 15, the MCU1 starts switching control of the switch S3 connected to the terminal P16 and switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the heating initial setting mode described above is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 16, the MCU 1 turns on the switch S3 and turns off the switch S4 to supply the driving voltage Vbst to the heater HTR to heat the heater HTR for generating aerosol. and temperature detection control for detecting the temperature of the heater HTR by turning off the switch S3 and turning on the switch S4 as shown in FIG.
  • the driving voltage Vbst is also supplied to the gate of the switch S5 to turn on the switch S5. Further, during heating control, the drive voltage Vbst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs.
  • the resistance value of the resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage Vbst .
  • the resistance value of the resistor R4 is greater than the ON resistance value of the switch S5.
  • the switch S5 is turned on during heating control.
  • the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is higher than the ON resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 is sufficiently reduced. This can prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.
  • Fig. 17> As shown in FIG. 17, during temperature detection control, the driving voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. Based on the voltage input to the terminal P18, the MCU1 acquires the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during temperature detection control.
  • the driving voltage V bst (reference voltage V temp ) is supplied to the series circuit of the resistor Rs and the heater HTR.
  • a voltage V heat obtained by dividing the driving voltage V bst (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistor Rs is sufficiently higher than the resistance value of the heater HTR, the voltage V heat is sufficiently lower than the driving voltage V bst .
  • the switch S5 is turned off by supplying the low voltage V heat to the gate terminal of the switch S5.
  • the operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.
  • the output signal of operational amplifier OP1 is input to terminal P9 of MCU1.
  • the MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the known electrical resistance value of the resistor Rs. . Based on the acquired temperature of the heater HTR, the MCU 1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR becomes a target temperature).
  • the MCU 1 can obtain the temperature of the heater HTR even during periods when the switches S3 and S4 are turned off (periods when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).
  • the MCU 1 can acquire the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).
  • FIG. 18 exemplifies a case where a USB connection is made in sleep mode.
  • the USB voltage VUSB is input to the input terminal VIN of LSW3 via the overvoltage protection IC11.
  • the USB voltage V USB is also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. Since the bipolar transistor S2 is ON immediately after the USB connection is made, the signal input to the control terminal ON of the LSW3 remains at a low level.
  • the USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to the terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to the terminal P17.
  • the MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.
  • the MCU1 When the MCU1 detects that the USB connection has been made, the MCU1 turns off the bipolar transistor S2 connected to the terminal P19.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3.
  • a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage VUSB from the output terminal VOUT.
  • the USB voltage VUSB output from LSW3 is input to the input terminal VBUS of charging IC2.
  • the USB voltage V_USB output from LSW3 is directly supplied to LEDs L1 to L8 as system power supply voltage Vcc4.
  • the MCU1 When the MCU1 detects that the USB connection has been established, the MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE( ⁇ ) of the charge IC2. As a result, the charging IC 2 enables the charging function of the power supply BAT, and starts charging the power supply BAT with the USB voltage VUSB input to the input terminal VBUS.
  • the MCU1 When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, it turns off the bipolar transistor S2 connected to the terminal P19. A low-level enable signal is output to the charge enable terminal CE ( ⁇ ) of , and the OTG function of the charge IC 2 is turned off by serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. . The LEDs L1 to L8 do not operate unless the MCU1 turns on the built-in transistors. This prevents an unstable voltage from being supplied to the LEDs L1-L8 during the on-to-off transition of the OTG function.
  • the switch driver 7 outputs a low-level signal from the reset input terminal RSTB when it reaches a predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the reset input terminal RSTB is output. return the signal output from to high level. As a result, the control terminal ON of LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part is restored.
  • FIG. 20 is a circuit diagram of main parts of the electric circuit shown in FIG. 10, showing the main electronic components used for heating and temperature detection of the heater HTR.
  • FIG. 20 shows a reactor Ld, a resistor RS4 , an npn-type bipolar transistor TS4 , and a voltage dividing circuit Pb as electronic components and nodes whose illustration or reference numerals are omitted in FIG.
  • the resistors R Pb1 and R Pb2 , the parasitic diode D5 of the switch S5, the nodes N1 to N8, and the operational amplifiers OP4, OP5, ADC (analog-digital converter) 1a, and ADC1b built in the MCU1 are It is shown.
  • Various resistors resistor R S4 , resistor Rs, resistor R Pb1 , resistor R Pb2 , and resistor R4) shown in FIG. 20 are fixed resistors having predetermined resistance values.
  • resistor RS4 One end of resistor RS4 is connected to the gate terminal of switch S4 .
  • the other end of resistor RS4 is connected to the collector terminal of bipolar transistor TS4 .
  • the emitter terminal of bipolar transistor TS4 is connected to ground.
  • the base terminal of bipolar transistor TS4 is connected to terminal P15 of MCU1.
  • the reactor Ld is provided for the purpose of reducing noise in the drive voltage Vbst output from the boost DC/DC converter 9 .
  • Reactor Ld is connected between the source terminal of switch S4 and the output terminal VOUT of boost DC/DC converter 9 .
  • another noise reduction first reactor is provided between the switch S4 and the resistor Rs
  • another noise reduction reactor is provided between the resistor Rs and the heater connector Cn(+) on the positive electrode side.
  • a second reactor for reduction may be provided. Any one of the reactor Ld, the first reactor, and the second reactor may be omitted, or any two of them may be omitted.
  • these reactors for noise reduction are not essential and can be omitted.
  • the node N1 connects the source terminal of the switch S3 and one end of the reactor Ld.
  • the node N1 is connected to the output terminal VOUT of the boost DC/DC converter 9 .
  • the node N7 connects the heater connector Cn(+) on the positive electrode side (+ pole) and the non-inverting input terminal of the operational amplifier OP1.
  • the node N2 connects the drain terminal of the switch S3 and the node N7.
  • the node N4 connects the node N2 and the resistor Rs.
  • the node N4 is connected to the gate terminal of the switch S5.
  • the node N5 connects the end of the resistor R4 opposite to the operational amplifier OP1 side and the drain terminal of the switch S5. Node N5 is connected to terminal P9 of MCU1.
  • a node N3 connects the drain terminal of the switch S4 and the opposite end of the resistor Rs on the node N4 side.
  • the node N3 is connected to the positive power supply terminal of the operational amplifier OP1 and one end of the resistor RPb1 .
  • a node N6 connects the other end of the resistor RPb1 and one end of the resistor RPb2 .
  • Node N6 is connected to terminal P18 of MCU1.
  • the other end of resistor RPb2 is connected to ground.
  • the node N8 connects the heater connector Cn(-) on the negative electrode side (- pole) and the drain terminal of the switch S6.
  • the node N8 is connected to the inverting input terminal of the operational amplifier OP1.
  • the parasitic diode D5 has a configuration in which the anode is connected to the source terminal of the switch S5 and the cathode is connected to the drain terminal of the switch S5.
  • the flow when the switch S4 is turned on is as follows. First, in a state where the drive voltage Vbst is being output from the output terminal VOUT of the step -up DC/DC converter 9, the MCU 1 turns on the bipolar transistor TS4 (current amplified from the emitter terminal of the bipolar transistor TS4 is output). This connects the gate terminal of the switch S4 to ground via the resistor R S4 , the collector terminal of the bipolar transistor T S4 and the emitter terminal of the bipolar transistor T S4 .
  • the gate voltage of the switch S4 becomes close to the ground potential (0 V in this embodiment), and the absolute value of the gate-source voltage of the switch S4 becomes larger than the absolute value of the threshold voltage of the switch S4.
  • switch S4 is turned on.
  • the bipolar transistor TS4 is turned off, the absolute value of the gate-source voltage of the switch S4 becomes equal to or less than the absolute value of the threshold voltage of the switch S4, so the switch S4 is turned off.
  • Gate-to-source voltage refers to the voltage applied between the gate and source terminals. Since the switch S4 in this embodiment is a P-channel MOSFET, a negative gate-source voltage is required to turn on the switch S4.
  • the switch S4 when the potential of the source terminal becomes lower than the potential of the gate terminal by less than the threshold voltage, the switch S4 is turned on.
  • the threshold voltage of the switch S4 is -4.5V
  • the source potential is 4.9V
  • the gate potential is 0V
  • the gate-source voltage is -4.9V. Since -4.9V is lower than the threshold voltage of -4.5V, the switch S4 is turned on.
  • the source potential is 4.9V and the gate potential is 3.3V
  • the voltage between the gate and the source Since -1.6V is higher than the threshold voltage of -4.5V, the switch S4 is turned off.
  • the gate-source voltage and the threshold voltage of a P-channel MOSFET are described as absolute values ignoring signs.
  • the system power supply voltage Vcc2 (the MCU1 power supply voltage input to the MCU1 power supply terminal VDD) and the driving voltage Vbst described above preferably have the following values.
  • FIG. 21 is a diagram showing an example of voltage changes input to the gate terminals of the switches S3 and S4 in the heating mode. Note that the switches S3 and S4 are turned on when the voltage input to the gate terminal is at a low level because the switches S3 and S4 are P-channel MOSFETs in this embodiment.
  • FIG. 21 shows a driving example EX1 and a driving example EX2.
  • the MCU1 alternately turns on and off the switches S3 and S4. That is, in the drive example EX1, the MCU1 turns off the switch S4 while the switch S3 is on, and turns on the switch S4 while the switch S3 is off.
  • the period during which the voltage input to the gate terminal of the switch S3 is at low level and the period during which the voltage input to the gate terminal of the switch S4 is at low level do not overlap.
  • the drive example EX2 is different from the drive example EX1 in that the period during which the switch S3 is turned on and the period during which the switch S4 is turned on partially overlap.
  • the period during which the voltage input to the gate terminal of the switch S3 is at low level overlaps with the period during which the voltage input to the gate terminal of the switch S4 is at low level.
  • FIG. 21 shows the control cycle Tc of the MCU1.
  • the MCU 1 keeps the switch S4 ON time constant and controls the switch S3 ON time. That is, the MCU 1 supplies power to the heater HTR by PWM (Pulse Width Modulation) control during heating control.
  • the maximum value of the time during which the switch S3 is turned on is the control period Tc, excluding the fixed time during which the switch S4 is turned on.
  • the certain time period during which the switch S4 is turned on is sufficiently smaller than the maximum value of the time period during which the switch S3 is turned on, for example, 1/10 or less of this maximum value.
  • the switch S3 may be turned on multiple times during the control period Tc. In this case, if the duty ratio calculated by the PWM control is less than 100%, the switch S3 is intermittently turned on during the control period Tc excluding the certain time during which the switch S4 is turned on. Become.
  • the MCU1 controls so that the switch S4 is switched from off to on at the timing when the switch S3 is switched from on to off. That is, the MCU 1 changes the ON time of the switch S3 by fixing the timing of turning off the switch S3 and controlling the timing of turning on the switch S3.
  • the MCU 1 may supply power to the heater HTR by PFM (Pulse Frequency Modulation) control.
  • FIG. 22 is a diagram showing current flow during heating control in the heating mode.
  • the switch S3 is turned on and the switch S4 is turned off.
  • a first heating discharge path HR1 through which current flows in the order of node N1, switch S3, node N2, node N7, heater HTR, node N8, switch S6, and ground;
  • a second heating discharge path HR2 through which current flows in order of N4 and the gate terminal of switch S5, and a current in order of node N1, switch S3, node N2, node N4, resistor Rs, node N3, and the positive power supply terminal of operational amplifier OP1.
  • a third heating discharge path HR3 through which the current flows is formed.
  • a voltage lower than the drive voltage Vbst (the voltage after stepping down the drive voltage Vbst by the resistor Rs) is supplied to the positive power supply terminal of the operational amplifier OP1, and the operational amplifier OP1 is operational. That is, during heating control, due to the presence of the third heating discharge path HR3, the voltage applied between the positive power supply terminal and the negative power supply terminal of the operational amplifier OP1 is lower than the drive voltage Vbst (however, the MCU1 power supply voltage is higher than the system power supply voltage Vcc2).
  • FIG. 23 is a diagram showing current flow during temperature detection control in the heating mode.
  • the switch S3 is turned off and the switch S4 is turned on.
  • the resistance value of reactor Ld and the ON resistance value of switch S4 are sufficiently small. Therefore, due to the presence of the third detection discharge path MR3, the positive power supply terminal of the operational amplifier OP1 is supplied with a voltage (reference voltage V temp ) that is substantially the same as the drive voltage Vbst , thereby enabling the operational amplifier OP1 to operate. .
  • V temp reference voltage
  • the power supply voltage of the operational amplifier OP1 becomes higher than during heating control, so the upper limit value of the differential input value of the operational amplifier OP1 can be increased.
  • the voltage V heat obtained by dividing the voltage of the node N3 (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1.
  • the potential of the node N7 matches the potential of the node N4 if wiring resistance is ignored. Therefore, the voltage input to the gate terminal of the switch S5 is also the same as the voltage V heat . Since the voltage V heat is equal to or lower than the threshold voltage of the switch S5, the switch S5 is turned off in the state of FIG. Thus, it is preferable to determine the resistance value of the resistor Rs so that the voltage V heat is equal to or lower than the threshold voltage of the switch S5.
  • the output voltage V OUT of the operational amplifier OP1 is input to the terminal P9 of the MCU1 without being divided.
  • the parasitic diode D5 behaves like a Zener diode. Therefore, even if the output voltage V OUT of the operational amplifier OP1 becomes excessive due to some factor, it is possible to prevent the voltage input to the terminal P9 of the MCU1 from increasing.
  • the resistance values of resistor R4 and resistor Rs are determined so that the voltage input to terminal P9 of MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of MCU1. ing.
  • the output of the operational amplifier OP1 is Voltage V OUT is represented by the following equation (1).
  • the terms excluding the amplification factor A on the right side of the equation (1) correspond to the voltage V heat .
  • the subsequent voltage is converted into a digital value (denoted as ADC_V temp ) by the built-in ADC 1a.
  • the inverting input terminals of the operational amplifier OP4 and/or the operational amplifier OP5 are not necessarily connected to the ground potential, and may be connected to another reference potential. If this reference potential is sufficiently high, the reference potential may be connected to the non-inverting input terminal, and the divided voltage value of the output voltage V OUT or the reference voltage V temp may be connected to the inverting input terminal.
  • the output of ADC1a and operational amplifier OP4 causes temperature drift error ⁇ 1 due to the temperature inside MCU1
  • the output of ADC1b and operational amplifier OP5 causes temperature drift error ⁇ 2 due to the temperature inside MCU1. That is, strictly speaking, the digital value output from ADC 1a is ADC_V temp (1+ ⁇ 1), and strictly speaking, the digital value output from ADC 1b is ADC_V OUT (1+ ⁇ 2).
  • Equation (3) is obtained by substituting the digital value ADC_V temp (1+ ⁇ 1) for V temp in equation (2) and substituting the digital value ADC_V OUT (1+ ⁇ 2) for V OUT in equation (2).
  • ADC1a and operational amplifier OP4 and ADC1b and operational amplifier OP5 are provided inside MCU1, respectively. Therefore, the temperature drift error ⁇ 1 and the temperature drift error ⁇ 2 can be regarded as substantially the same. That is, (1+ ⁇ 1) and (1+ ⁇ 2) in equation (3) are the same value. Therefore, the temperature drift error is canceled in equation (3).
  • the MCU 1 derives the resistance value RHTR of the heater HTR by calculating the equation (3). Since the heater HTR has a characteristic that the resistance value changes according to the temperature, the temperature of the heater HTR can be obtained by deriving the resistance value RHTR.
  • equation (3) allows the temperature drift error that can occur in the output voltage V OUT (more precisely, the electronic components (op-amp OP5 and ADC1b) necessary to acquire information corresponding to the output voltage V OUT ).
  • temperature drift error that may occur in the output of V temp) and temperature drift error that may occur in the reference voltage V temp can be canceled, and the resistance value RHTR of the heater HTR can be derived more accurately. In other words, the resistance value RHTR of the heater HTR can be easily derived without being affected by the temperature of the MCU1.
  • operational amplifiers OP5 and ADC1b and operational amplifiers OP4 and ADC1a are separately provided inside the MCU1. However, these may be made common. That is, the operational amplifier and ADC for obtaining information on the output voltage V OUT and the operational amplifier and ADC for obtaining information on the reference voltage V temp are shared, and the digital value ADC_V temp (1+ ⁇ 1) and the digital value ADC_V OUT (1+ ⁇ 2) may be obtained by time division. According to this configuration, temperature drift errors occurring in these two digital values can be more matched, and the resistance value RHTR of the heater HTR can be derived with higher accuracy.
  • the MCU1 may acquire the potential of the node N1 as the reference voltage V temp and use it to derive the resistance value of the heater HTR.
  • the positive power supply terminal of the operational amplifier OP1 is always supplied with voltage and the increase in power consumption is allowed, the positive power supply terminal of the operational amplifier OP1 is connected to the node N1 instead of the node N3, and the node N1 and the voltage divider circuit are connected. Pb may be connected.
  • FIG. 24 is a diagram showing current flow when both the switch S3 and the switch S4 are on in the driving example EX2 of FIG.
  • node N4, and the gate terminal of switch S5 and a third detection path, through which current flows in the order of node N1, reactor Ld, switch S4, node N3, and the positive power supply terminal of operational amplifier OP1.
  • a discharge path MR3 is formed.
  • the node N3 and the node N4 are at substantially the same potential, so that almost no current flows through the resistor Rs. Therefore, the power supply voltage of the operational amplifier OP1 becomes the drive voltage Vbst . That is, in this state, the upper limit value of the differential input value of the operational amplifier OP1 is equal to the driving voltage Vbst . Therefore, the output voltage of the operational amplifier OP1 becomes higher than in the state of FIG.
  • the resistance of the resistor R4 and the ON resistance of the switch S5 is set so that the voltage input to the terminal P9 of the MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of the MCU1. ratio is determined. Therefore, a voltage higher than the operating voltage is not input to the terminal P9 of the MCU1. That is, the operation of MCU1 is stabilized.
  • the third heating discharge path HR3 applies a voltage lower than the drive voltage Vbst to the operational amplifier OP1. It can be supplied as a power supply voltage. Further, as shown in FIG. 23, during the period in which the switch S4 is on and the switch S3 is off, a voltage equivalent to the drive voltage Vbst can be supplied as the power supply voltage of the operational amplifier OP1 through the third detection discharge path MR3. can. Therefore, as shown in FIG.
  • the period from the start of the heating of the heater HTR to the end of the heating until the end of the temperature detection of the heater HTR (from the fall of the gate voltage of the switch 3 to the period immediately after that).
  • the power supply voltage can be continuously supplied to the operational amplifier OP1. Therefore, compared with the reference example in which the power supply voltage is not supplied to the operational amplifier OP1 during the ON period of the switch S3 (heating period of the heater HTR), it is not necessary to wait until the power supply voltage of the operational amplifier OP1 sufficiently rises during the temperature detection control. Heating control and temperature detection control can be efficiently executed.
  • the drive example EX2 it is possible to supply the power supply voltage of the operational amplifier OP1 required for temperature detection control while performing heating control. Therefore, the power supply voltage of the operational amplifier OP1 can be brought into a sufficiently raised state at the timing when the heating control is finished, and the heater HTR can be turned on at an earlier timing after the heating of the heater HTR is finished, as compared with the drive example EX1. can be detected with high accuracy.
  • the power supply voltage may not be supplied to the operational amplifier OP1 during the period after the switch S4 is turned off until the switch S3 is turned on next time. be.
  • it is the heating control that is performed immediately after this period and the operation of the operational amplifier OP1 is not essential. Therefore, there is no problem even if the power supply voltage is not supplied to the operational amplifier OP1 during this period.
  • power consumption by the operational amplifier OP1 can be eliminated during this period, it is possible to contribute to power saving of the sucker 100 as a whole.
  • switch S3, switch S4, and switch S6 shown in FIG. 20 each have a preferred configuration. Preferred examples of each switch will be described below.
  • the switch S3 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR.
  • a small on-resistance value in other words, a large chip size
  • the comparison is performed under the condition that the temperature and the flowing current are the same.
  • the switch S3 is turned on and off at high speed by PWM control, PFM control, or the like when heating the heater HTR. For this reason, it is preferable that the maximum current value that can be output instantaneously (maximum current value that can be output in a pulse form) is large. Moreover, the switch S3 preferably has a maximum current value that can be continuously output larger than that of the switch S4 from the viewpoints of allowing a large amount of current to flow through the heater HTR and having a longer ON time than the switch S4.
  • the maximum current values that can be output from each of the switches S3, S4, and S6 the comparison is performed under the condition that the temperatures are the same.
  • Switch S3 is preferably a P-channel MOSFET, as illustrated in FIG.
  • the switch S3 can also be composed of an N-channel MOSFET.
  • the voltage supplied from the terminal P16 of the MCU1 to the gate terminal of the switch S3 is set to a value higher than the drive voltage Vbst in order to turn on the switch S3. It is necessary to raise the power supply voltage of MCU1.
  • the switch S3 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
  • the switch S4 preferably has a small on-resistance so that a sufficient voltage can be applied to the series circuit of the resistor Rs and the heater HTR. However, if the on-resistance value is made too small, the size increases. Therefore, in order to reduce the circuit area, the on-resistance value of the switch S4 is preferably larger than the on-resistance value of the switch S3. In order that the current for detecting the resistance value of the heater HTR does not change the temperature of the heater HTR, it is preferable that the ON resistance value of the switch S4 is not too small. Specifically, the on-resistance value of the switch S4 is preferably smaller than the resistance value of the resistor Rs and larger than the on-resistance value of the switch 3 .
  • the detection of the resistance value of the heater HTR needs to be performed in a shorter time than the heating of the heater HTR.
  • the switch S6 since the switch S6 is always turned on in the heating mode, it does not have to be highly responsive. Therefore, the responsiveness of the switch S4 is preferably higher than the responsiveness of the switches S3 and S6. Indicators of transistor responsiveness include turn-on time t on , turn-on delay time t d(on) , rise time t r , turn-off time t off , turn-off delay time t d(off) , and fall time t f . .
  • the turn-on delay time td (on) is the time required for the drain-source voltage to reach 90% of the set value after the gate-source voltage reaches 10% of the set value at turn-on.
  • the rise time tr is the time required for the drain-source voltage to reach from 90% to 10% of the set value at turn-on.
  • Turn-on time t on is the sum of turn-on delay time t d(on) and rise time t r .
  • the turn-off delay time td (off) is the time required for the drain-source voltage to reach 10% of the set value after the gate-source voltage reaches 90% of the set value at turn-off.
  • the fall time tf is the time required for the drain-source voltage to reach from 10% to 90% of the set value at turn-off.
  • the turn-off time toff is the sum of the turn- off delay time td (off) and the fall time tf .
  • the resistance value of the heater HTR must be detected in a shorter time than the heating of the heater HTR.
  • the turn-on delay or rise time of switch S4 is preferably shorter than the turn-on delay or rise time of switches S3 and S6, respectively.
  • the turn-off delay or fall time of switch S4 is preferably shorter than the turn-off delay or fall time of switches S3 and S6, respectively.
  • Switch S4 is preferably a P-channel MOSFET, as illustrated in FIG.
  • the switch S4 can also be composed of an N-channel MOSFET.
  • the voltage supplied from the terminal P15 of the MCU1 to the gate terminal of the switch S4 is set to a value higher than the drive voltage Vbst in order to turn on the switch S4. Therefore, the power supply voltage of MCU1 is increased.
  • the switch S4 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
  • the switch S6 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR.
  • the on-resistance value of the switch S6 is preferably equal to the on-resistance value of the switch S3.
  • the switch S6 needs to pass current continuously in the heating mode. Therefore, it is preferable that the maximum current value that the switch S6 can continuously output is larger than that of the switches S4 and S3. On the other hand, since the switch S6 is always turned on in the heating mode, it is preferable that the maximum current value that the switch S6 can instantaneously output (output in pulse form) is smaller than that of the switch S3, which is repeatedly turned on and off. If the maximum current value that can be instantaneously output (output in the form of a pulse) is excessively increased for the application of the switch S6, the chip size and cost of the switch S6 may increase.
  • the switch S3 is connected to a high-potential location on the circuit, it is more difficult to improve the responsiveness than the switch S6 from the viewpoint of safety. Therefore, making the switch S6 more responsive than the switch S3 is effective in improving the responsiveness of the entire circuit.
  • the turn-off delay time or fall time of switch S6 is preferably shorter than the turn-off delay time or fall time of switch S3.
  • the turn-on delay or rise time of switch S6 is preferably shorter than the turn-on delay or rise time of switch S3.
  • Switch S6 is preferably an N-channel MOSFET, as illustrated in FIG.
  • the switch S6 can also be composed of a P-channel MOSFET.
  • the switch S6 is composed of a P-channel MOSFET, it is necessary to set the voltage supplied from the terminal P14 of the MCU1 to the gate terminal of the switch S6 to a value lower than the ground level in order to turn on the switch S6. be.
  • Generating voltages below ground requires specialized circuitry such as negative power supplies and rail splitter circuits.
  • the switch S6 is composed of an N-channel MOSFET, the MCU 1 can turn on the switch S6 by inputting a voltage equivalent to its own power supply voltage to the gate terminal, thereby suppressing the complexity of the circuit. .
  • the switch S6 is composed of an N-channel MOSFET, a high level signal is input to the enable terminal EN of the boost DC/DC converter 9 at the same time when the switch S6 is turned on, and the drive voltage is output from the boost DC/DC converter 9. V bst can be output.
  • the switch S6 is composed of a P-channel MOSFET, it is necessary to connect an inverter for logic inversion between the enable terminal EN of the boost DC/DC converter 9 and the gate terminal of the switch S6.
  • an inverter can be made unnecessary, and a reduction in circuit scale and manufacturing cost can be realized.
  • the switch S3, the switch S4, and the switch S6 have different configurations.
  • the term "switches having different configurations including transistors” means that at least one of the types of transistors and the specifications of the transistors (on-resistance, responsiveness, etc.) is different. To tell. By adopting such a configuration, compared to the case where all three switches are of the same type and specifications, the type and specifications of each switch can be made to correspond to the location where each switch is connected. . Therefore, the performance of the aspirator 100 can be improved.
  • FIG. 25 is a plan view of the receptacle mounting substrate 162 viewed from the main surface 162a side.
  • FIG. 26 is a plan view of the receptacle mounting substrate 162 viewed from the side of the secondary surface 162b.
  • the main surface 162a of the receptacle mounting substrate 162 is provided with the reactor Lc, resistor Rs, switch S4, switch S6, and heater connector Cn among the electronic components shown in FIG.
  • the secondary surface 162b of the receptacle mounting board 162 is provided with the boost DC/DC converter 9, the switch S3, the resistor R Pb1 , and the resistor R Pb2 among the electronic components shown in FIG. be done.
  • resistor RPb1 and resistor RPb2 are closely spaced.
  • a resistor RPb1 and a resistor RPb2 form a voltage dividing circuit Pb that divides the potential of the node N3. If there is a temperature difference between the resistor RPb1 and the resistor RPb2 , the voltage division ratio of the voltage dividing circuit Pb fluctuates, and the accuracy of obtaining the potential of the node N3 required to derive the resistance value of the heater HTR decreases. . As shown in FIG.
  • the resistor RPb1 and the resistor RPb2 are mounted on the same surface of the receptacle mounting board 162, and are arranged close to each other, so that the resistor RPb1 and the resistor RPb2 are mounted on the same surface. It can prevent temperature differences. In order to enhance this effect, it is preferable that the electronic component closest to the resistor RPb1 among the electronic components mounted on the receptacle mounting substrate 162 is the resistor RPb2 .
  • those that can become heat sources or noise sources include the switch S3, the step-up DC/DC converter 9, the reactor Lc, and the heater connector Cn.
  • the switch S3 generates the largest amount of heat
  • the step-up DC/DC converter 9 generates the second largest amount of heat.
  • the switch S3 and the step-up DC/DC converter 9, which generate a large amount of heat, the switch S4, the switch S6, and the resistor Rs are mounted on different surfaces of the same substrate.
  • switch S3 and boost DC/DC converter 9 are mounted on minor surface 162b
  • switch S4, switch S6 and resistor Rs are mounted on main surface 162a.
  • the switch S3 and the step-up DC/DC converter 9, the switch S4, the switch S4, and the The switch S6 and the resistor Rs are arranged so as not to overlap. By doing so, the heat or noise generated by the switch S3 and the boost DC/DC converter 9 is less likely to be transmitted to the switch S4, the switch S6 and the resistor Rs through the substrate. That is, the switch S4, the switch S6, and the resistor Rs can be more strongly suppressed from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9.
  • the switch S4 or the switch S6 may be mounted on the secondary surface 162b. By doing so, either the switch S4 or the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9.
  • FIG. 25 the switch S4 or the switch S6 may be mounted on the secondary surface 162b.
  • At least one of the switches S4 and S6 among the electronic components of the circuit shown in FIG. 20 may be mounted on a board different from the receptacle mounting board 162 (for example, the MCU mounting board 161, etc.). . By doing so, at least one of the switch S4 and the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the boost DC/DC converter 9 .
  • FIG. 25 shows a distance DS4 between the mounting area where the resistor Rs is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (the straight line connecting the two mounting areas at the shortest distance). length) is shown.
  • FIG. 25 also shows a distance DS5 between the mounting area where the switch S4 is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (a straight line connecting the two mounting areas at the shortest distance). length) is shown. And the distance DS4 is shorter than the distance DS5.
  • the resistance value of the resistor Rs is less susceptible to temperature fluctuations than the on-resistance value of the switch S4. Therefore, the substrate area can be effectively utilized by arranging the resistor Rs, which is less susceptible to temperature changes, closer to the reactor Lc than the switch S4.
  • a resistor Rs is mounted between the switch S4 and the reactor Lc. That is, the mounting area of the resistor Rs exists on a straight line connecting the mounting area of the switch S4 and the mounting area of the reactor Lc. By doing so, the resistor Rs becomes a physical barrier that protects the switch S4 from the heat generated by the reactor Lc. As a result, it is possible to strongly suppress the temperature change of the switch S4. If the on-resistance value of the switch S4 fluctuates, it affects the measurement accuracy of the resistance value of the heater HTR. Therefore, it is particularly important to suppress the temperature change of switch S4.
  • FIG. 27 is an enlarged view of range H shown in FIG. 25.
  • FIG. 27 As shown in FIG. 27, on the main surface 162a of the receptacle mounting substrate 162, the mounting area of the switch S4 and the mounting area of the heater connector Cn are separated from each other. A resistor R S4 and a bipolar transistor T S4 at are implemented. In other words, the resistor R S4 and the bipolar transistor T S4 are mounted on the straight lines DL1 and DL2 connecting the mounting area of the switch S4 and the mounting area of the heater connector Cn, respectively. According to this configuration, resistor R S4 and bipolar transistor T S4 provide a physical barrier to protect switch S4 from heat generated at heater connector Cn. As a result, it is possible to strongly suppress the temperature change of the switch S4.
  • the switch S4 is arranged near the outer edge of the main surface 162a of the receptacle mounting substrate 162. As shown in FIGS. Specifically, on the main surface 162a of the receptacle mounting board 162, the switch S4 mounting area and the closest edge 162em, which is the edge closest to the switch S4 mounting area among the rightward edges 162e of the main surface 162a, are separated. The distance DS1 between them is shorter than the distance DS2 between the center of the main surface 162a of the receptacle mounting board 162 in the horizontal direction and the mounting area of the switch S4.
  • the switch S4 is arranged near the edge of the receptacle mounting board 162, so that it is less likely to be affected by heat generated by other electronic components. In particular, as shown in FIG. 27, there should be no other electronic components between the closest edge 162em and the switch S4. By using S4, the temperature change of the switch S4 can be further suppressed.
  • the distance DS3 between the mounting area of the resistor Rs on the main surface 162a of the receptacle mounting board 162 and the edge 162en closest to the mounting area of the resistor Rs among the edges 162e is the distance It is larger than DS1.
  • resistor Rs is less sensitive to temperature changes than switch S4. Therefore, by arranging the resistor Rs close to the center of the receptacle mounting board 162, the board area can be effectively utilized.
  • the voltage V GS (absolute value) applied between the gate and the source when the switch S4 is turned on is as high as possible. That is, when the switch S4 is a P-channel MOSFET, it is preferable to set the voltage VGS applied between the gate and the source when it is on to a negative value as large as possible. This is because the on-resistance value of the switch S4 can be lowered by doing so, the Joule heat generated when the switch S4 is on can be reduced, and the temperature fluctuation of the switch S4 can be suppressed.
  • the maximum rated value (absolute value) of the voltage that can be applied between the gate and source of the switch S4 is defined as voltage V GSS
  • the threshold voltage (absolute value) between the gate and source of switch S4 is defined as voltage V th .
  • the MCU 1 preferably controls the voltage applied to the gate terminal of the switch S4 so that the voltage V GS (absolute value) is closer to the voltage V GSS between the voltage V GSS and the voltage V th . .
  • the gate terminal of the switch S4 is set such that the absolute value of the difference between the voltage V GSS and the voltage V GS (absolute value) is smaller than the absolute value of the difference between the voltage V th and the voltage V GS (absolute value). It is preferable to control the voltage applied to .
  • an overvoltage protection diode such as a varistor between the gate terminal and the source terminal of the switch S4.
  • a power supply (power supply BAT); a heater connector (heater connector Cn) in which a heater (heater HTR) including a + pole and a - pole and consuming power supplied from the power supply to heat the aerosol source is connected to the + pole and the - pole; ,
  • a first branch circuit (series of reactor Ld, switch S4, and resistor Rs) including a first switch (switch S4) and a fixed resistor (resistor Rs) connected to one of the + pole and the - pole a circuit including a circuit and wiring connecting the series circuit and the node N1 and the node N2;
  • a second branch circuit (switch S3) connected in parallel to the first branch circuit and including a second switch (switch S3) connected to one of the + pole and the - pole is connected to the node N1 and the node N2.
  • circuit including wiring to a third switch (switch S6) connected to the other of the + pole and the - pole; a first circuit board (receptacle mounting board 162) including a surface A (secondary surface 162b) and a surface B (main surface 162a) that is the back surface of the surface A; a controller (MCU1) configured to be able to control the first switch, the second switch, and the third switch;
  • the second switch is mounted on the A surface, At least one of the first switch and the third switch is mounted on the B surface or on a second circuit board separate from the first circuit board,
  • the above controller is When the first switch and the third switch are ON, predetermined control (temperature detection of the heater HTR and discharge control using the detected temperature) is executed based on the voltage applied to the fixed resistor or the heater connector. death, While the third switch is ON, the second switch is repeatedly switched ON and OFF so as to supply power to the heater for generating aerosol. Power supply unit for the aerosol generator.
  • the heat and heat from the second switch which can be a heat source and a noise source because the power for generating the aerosol passes and is switched, and at least one of the first switch and the third switch. It is possible to secure a sufficient distance from the viewpoint of noise. Therefore, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
  • the switch S3, the switch S4 and the resistor Rs are connected in parallel between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side.
  • a switch S3, a switch S4 and a resistor Rs may be connected in parallel between the line and the heater connector Cn on the negative electrode side.
  • the switch S6 is connected between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side or omitted. Even in this configuration, the configuration (1) can suppress failures and malfunctions of the first switch and the third switch, and improve the stability of the control executed using these switches.
  • the power supply unit of the aerosol generator, At least one of the first switch and the third switch is mounted on the B surface. Power supply unit for the aerosol generator.
  • the first switch and the third switch are mounted to avoid such positions. Therefore, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
  • the fixed resistor is mounted at a position that is less susceptible to the heat generated by the second switch. Therefore, the resistance value of the fixed resistor is stabilized, and the stability of predetermined control can be improved.
  • the power supply unit of the aerosol generator A voltage converter (step-up DC/DC converter 9) capable of converting the voltage output from the power supply and outputting it to the heater, wherein the voltage converter is mounted on a different surface or a different substrate than at least one of the first switch and the third switch; Power supply unit for the aerosol generator.
  • a voltage converter step-up DC/DC converter 9 capable of converting the voltage output from the power supply and outputting it to the heater, wherein the voltage converter is mounted on a different surface or a different substrate than at least one of the first switch and the third switch; Power supply unit for the aerosol generator.
  • the voltage converter can supply a stable voltage to the heater, and the distance from the viewpoint of heat and noise between the voltage converter and the first switch and the third switch, which can be a noise source and a heat source. can be large enough. Therefore, while realizing stable aerosol generation, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
  • the power supply unit of the aerosol generator, the voltage converter is mounted on a different surface than at least one of the first switch and the third switch; Power supply unit for the aerosol generator.
  • the first switch and the third switch can be separated from the voltage converter, which can be a heat source and a noise source, without using a plurality of substrates. Thereby, the stability of the control executed using the first switch and the third switch can be improved without increasing the cost.
  • the second switch and the voltage converter both of which can be noise sources and heat sources, are mounted on the same surface, and the first switch and the third switch are mounted on the opposite surface. Therefore, the distance between the second switch and the voltage converter and the first switch and the third switch can be sufficiently increased from the viewpoint of heat and noise, and failures and malfunctions of the first switch and the third switch can be suppressed. .
  • the power supply unit of the aerosol generator, The first switch and the third switch do not overlap the voltage converter in a direction orthogonal to the first circuit board (front-rear direction). Power supply unit for the aerosol generator.
  • the fixed resistor is mounted at a position that is less susceptible to the heat generated by the voltage converter. Therefore, the resistance value of the fixed resistor is stabilized, and the stability of predetermined control can be improved.
  • a power supply power supply BAT
  • a heater connector in which a heater (heater HTR) including a + pole and a - pole and consuming power supplied from the power supply to heat the aerosol source is connected to the + pole and the - pole
  • a first branch circuit (series of reactor Ld, switch S4, and resistor Rs) including a first switch (switch S4) and a fixed resistor (resistor Rs) connected to one of the + pole and the - pole a circuit including a circuit and wiring connecting the series circuit and the node N1 and the node N2
  • a second branch circuit (switch S3) connected in parallel to the first branch circuit and including a second switch (switch S3) connected to one of the + pole and the - pole is connected to the node N1 and the node N2.
  • a circuit including wiring to a first circuit board (receptacle mounting board 162) including a surface A (secondary surface 162b) and a surface B (main surface 162a) that is the back surface of the surface A; a controller (MCU1) configured to be able to control the first switch and the second switch;
  • the second switch is mounted on the A surface,
  • the first switch is mounted on the B surface or on a second circuit board separate from the first circuit board,
  • the above controller is When the first switch is ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector, configured to repeatedly turn on and off the second switch so as to supply power for generating aerosol to the heater; Power supply unit for the aerosol generator.
  • the distance from the viewpoint of heat and noise between the first switch and the second switch, which can become a heat source and a noise source due to the fact that power for generating aerosol passes through and is switched can be sufficiently ensured. Therefore, it is possible to suppress failures and malfunctions of the first switch and improve the stability of the control executed using the first switch.
  • the switch S3, the switch S4 and the resistor Rs are connected in parallel between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side.
  • a switch S3, a switch S4 and a resistor Rs may be connected in parallel between the line and the heater connector Cn on the negative electrode side.
  • the switch S6 is connected between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side or omitted. Even in this configuration, the configuration (10) can suppress failures and malfunctions of the first switch and improve the stability of the control executed using the first switch.

Abstract

Provided is an aerosol generation device having improved control stability.　An inhaler (100) comprises an MCU 1 configured to execute, when a switch S4 and a switch S6 are ON, predetermined control on the basis of a voltage applied to a heater connector Cn as long as the switch S6 is ON, and configured to switch a switch S3 ON and OFF repeatedly so as to supply power for generating an aerosol to a heater HTR. The switch S3 and the switches S4 and S6 are mounted on separate faces of a receptacle-mounting substrate (162).

Description

エアロゾル生成装置の電源ユニットPower supply unit for aerosol generator
　本発明は、エアロゾル生成装置の電源ユニットに関する。 The present invention relates to a power supply unit for an aerosol generator.
　特許文献１には、エアロゾル源を加熱し且つ温度と電気抵抗値が相関を持つ負荷に印加される電圧に応じた出力を行うオペアンプと、上記出力に応じた電圧に基づく処理を行うように構成された制御部と、電源と上記負荷との間に並列に電気的に接続された第１回路及び第２回路と、を含み、第１回路及び第２回路は第１開閉器及び第２開閉器をそれぞれ含む、エアロゾル吸引器用の制御装置が記載されている。この制御装置は、第２開閉器がオン状態である間に、オペアンプの出力に応じた電圧を取得するように構成されている。 Patent Document 1 describes an operational amplifier that heats an aerosol source and outputs according to a voltage applied to a load having a correlation between temperature and electrical resistance, and a configuration that performs processing based on the voltage according to the output. and a first circuit and a second circuit electrically connected in parallel between the power supply and the load, wherein the first circuit and the second circuit connect the first switch and the second switch. Control devices for aerosol inhalers are described, each including a device. This control device is configured to obtain a voltage corresponding to the output of the operational amplifier while the second switch is in the ON state.
　特許文献２には、所定の抵抗値を有する加熱要素と、前記加熱要素に電力を供給する電源と、前記加熱要素と並列に接続される複数の抵抗と、制御部と、前記加熱要素のオン／オフを制御する第１スイッチと、前記電源と前記複数の抵抗との間に接続される第２スイッチと、前記複数の抵抗の間の配線と前記制御部との間に接続される第３スイッチとを備え、前記加熱要素の抵抗値を測定する際に、前記制御部は、前記第２スイッチと前記第３スイッチとをオンし、前記第１スイッチをオフするスイッチ制御を実行するように構成された非燃焼式吸引器が記載されている。 Patent Document 2 discloses a heating element having a predetermined resistance value, a power supply for supplying power to the heating element, a plurality of resistors connected in parallel with the heating element, a control unit, and an on-state control unit for the heating element. A first switch for controlling ON/OFF, a second switch connected between the power source and the plurality of resistors, and a third switch connected between wiring between the plurality of resistors and the control unit. and a switch, wherein when measuring the resistance value of the heating element, the control unit performs switch control to turn on the second switch and the third switch and turn off the first switch. A configured non-combustion inhaler is described.
日本国特許第６６１３００８号公報Japanese Patent No. 6613008 国際公開第２０２０／２１７９４９号WO2020/217949
　エアロゾルを吸引可能に構成したエアロゾル生成装置において、電源からヒータへの放電の制御には、バイポーラトランジスタやＭＯＳＦＥＴ（metal-oxide-semiconductor field-effect transistor）等のスイッチング素子が用いられる。こういったスイッチング素子をどのような位置に実装するかについては検討の余地があった。 In an aerosol generator configured to be able to inhale aerosol, switching elements such as bipolar transistors and MOSFETs (metal-oxide-semiconductor field-effect transistors) are used to control the discharge from the power supply to the heater. There was room for examination as to what position to mount such a switching element.
　本発明の目的は、制御の安定性を向上可能なエアロゾル生成装置を提供することにある。 The purpose of the present invention is to provide an aerosol generator capable of improving control stability.
　本発明の一態様のエアロゾル生成装置の電源ユニットは、電源と、＋極と－極とを含み、前記電源から供給される電力を消費してエアロゾル源を加熱するヒータが前記＋極と前記－極へ接続されるヒータコネクタと、前記＋極と前記－極の一方へ接続された、第１スイッチと固定抵抗器とを含む第１分岐回路と、前記＋極と前記－極の一方へ接続された、第２スイッチを含み且つ前記第１分岐回路へ並列接続される第２分岐回路と、前記＋極と前記－極の他方へ接続される第３スイッチと、Ａ面と、前記Ａ面の裏面であるＢ面と、を含む第１回路基板と、前記第１スイッチと前記第２スイッチと前記第３スイッチを制御可能に構成されるコントローラと、を備え、前記第２スイッチは、前記Ａ面に実装され、前記第１スイッチと前記第３スイッチの少なくとも一方は、前記Ｂ面又は前記第１回路基板とは別体の第２回路基板に実装され、前記コントローラは、前記第１スイッチ及び前記第３スイッチがＯＮの時、前記固定抵抗器又は前記ヒータコネクタに印加される電圧に基づき、所定の制御を実行し、前記第３スイッチがＯＮの間、エアロゾルを生成するための電力を前記ヒータへ供給するように、前記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、ものである。 The power supply unit of the aerosol generating device of one aspect of the present invention includes a power supply, a + pole and a - pole, and a heater that consumes power supplied from the power supply to heat the aerosol source comprises the + pole and the - pole. a heater connector connected to one of the + and - poles; a first branch circuit including a first switch and a fixed resistor connected to one of the + and - poles; and one of the + and - poles. a second branch circuit including a second switch and connected in parallel to the first branch circuit, a third switch connected to the other of the + pole and the - pole, an A side, and the A side and a controller configured to be able to control the first switch, the second switch, and the third switch, wherein the second switch is the is mounted on side A, at least one of the first switch and the third switch is mounted on side B or a second circuit board separate from the first circuit board, and the controller is mounted on the first switch and when the third switch is ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector, and power for generating aerosol is supplied while the third switch is ON. The second switch is repeatedly switched ON and OFF so as to supply the heater.
　本発明の一態様のエアロゾル生成装置の電源ユニットは、電源と、＋極と－極とを含み、前記電源から供給される電力を消費してエアロゾル源を加熱するヒータが前記＋極と前記－極へ接続されるヒータコネクタと、前記＋極と前記－極の一方へ接続された、第１スイッチと固定抵抗器とを含む第１分岐回路と、前記＋極と前記－極の一方へ接続された、第２スイッチを含み且つ前記第１分岐回路へ並列接続される第２分岐回路と、Ａ面と、前記Ａ面の裏面であるＢ面と、を含む第１回路基板と、前記第１スイッチと前記第２スイッチとを制御可能に構成されるコントローラと、を備え、前記第２スイッチは、前記Ａ面に実装され、前記第１スイッチは、前記Ｂ面又は前記第１回路基板とは別体の第２回路基板に実装され、前記コントローラは、前記第１スイッチがＯＮの時、前記固定抵抗器又は前記ヒータコネクタに印加される電圧に基づき、所定の制御を実行し、エアロゾルを生成するための電力を前記ヒータへ供給するように、前記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、ものである。 The power supply unit of the aerosol generating device of one aspect of the present invention includes a power supply, a + pole and a - pole, and a heater that consumes power supplied from the power supply to heat the aerosol source comprises the + pole and the - pole. a heater connector connected to one of the + and - poles; a first branch circuit including a first switch and a fixed resistor connected to one of the + and - poles; and one of the + and - poles. a first circuit board including a second branch circuit connected in parallel to the first branch circuit and including a second switch; a surface A; a controller configured to be able to control the first switch and the second switch, the second switch being mounted on the A side, and the first switch being connected to the B side or the first circuit board. is mounted on a separate second circuit board, and the controller performs predetermined control based on the voltage applied to the fixed resistor or the heater connector when the first switch is ON, and releases the aerosol The second switch is repeatedly turned on and off so as to supply electric power for generation to the heater.
　本発明によれば、制御の安定性を向上可能なエアロゾル生成装置を提供することができる。 According to the present invention, it is possible to provide an aerosol generator capable of improving control stability.
非燃焼式吸引器の斜視図である。1 is a perspective view of a non-combustion inhaler; FIG. ロッドを装着した状態を示す非燃焼式吸引器の斜視図である。1 is a perspective view of a non-combustion inhaler showing a state in which a rod is attached; FIG. 非燃焼式吸引器の他の斜視図である。Fig. 10 is another perspective view of a non-combustion type inhaler; 非燃焼式吸引器の分解斜視図である。1 is an exploded perspective view of a non-combustion inhaler; FIG. 非燃焼式吸引器の内部ユニットの斜視図である。Fig. 3 is a perspective view of the internal unit of the non-combustion inhaler; 図５の内部ユニットの分解斜視図である。FIG. 6 is an exploded perspective view of the internal unit of FIG. 5; 電源及びシャーシを取り除いた内部ユニットの斜視図である。FIG. 3 is a perspective view of the internal unit with the power supply and chassis removed; 電源及びシャーシを取り除いた内部ユニットの他の斜視図である。FIG. 11 is another perspective view of the internal unit with the power supply and chassis removed; 吸引器の動作モードを説明するための模式図である。It is a schematic diagram for demonstrating the operation mode of an aspirator. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. 内部ユニットの電気回路の概略構成を示す図である。It is a figure which shows schematic structure of the electric circuit of an internal unit. スリープモードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of an electric circuit in sleep mode; アクティブモードにおける電気回路の動作を説明するための図である。It is a figure for demonstrating the operation|movement of the electric circuit in active mode. 加熱初期設定モードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode; 加熱モードにおけるヒータの加熱時の電気回路の動作を説明するための図である。It is a figure for demonstrating the operation|movement of the electric circuit at the time of the heating of the heater in heating mode. 加熱モードにおけるヒータの温度検出時の電気回路の動作を説明するための図である。FIG. 5 is a diagram for explaining the operation of the electric circuit when detecting the temperature of the heater in the heating mode; 充電モードにおける電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of the electric circuit in charging mode; ＭＣＵのリセット（再起動）時の電気回路の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of an electric circuit when an MCU is reset (restarted); 図１０に示す電気回路のうち、ヒータの加熱と温度検出に用いられる主要な電子部品を抜き出して示した要部回路図である。FIG. 11 is a circuit diagram of a main part of the electric circuit shown in FIG. 10, showing the main electronic components used for heating the heater and detecting the temperature. 加熱モードにおけるスイッチＳ３及びスイッチＳ４のゲート端子に入力される電圧変化の一例を示す図である。It is a figure which shows an example of the voltage change input into the gate terminal of switch S3 and switch S4 in heating mode. 加熱モードの加熱制御時における電流の流れを示した図である。FIG. 4 is a diagram showing current flow during heating control in a heating mode. 加熱モードの温度検出制御時における電流の流れを示した図である。FIG. 5 is a diagram showing current flow during temperature detection control in a heating mode; 図２１の駆動例ＥＸ２におけるスイッチＳ３とスイッチＳ４が共にオンしているときの電流の流れを示した図である。FIG. 22 is a diagram showing the current flow when both the switch S3 and the switch S4 are turned on in the drive example EX2 of FIG. 21; レセプタクル搭載基板を主面側から見た平面図である。FIG. 4 is a plan view of the receptacle-mounted substrate viewed from the main surface side; レセプタクル搭載基板を副面側から見た平面図である。It is the top view which looked at the receptacle mounting board|substrate from the secondary surface side. 図２５に示す範囲Ｈの拡大図である。26 is an enlarged view of range H shown in FIG. 25; FIG.
　以下、本発明におけるエアロゾル生成装置の一実施形態である吸引システムについて図面を参照しながら説明する。この吸引システムは、本発明の電源ユニットの一実施形態である非燃焼式吸引器１００（以下、単に、「吸引器１００」ともいう）と、吸引器１００によって加熱されるロッド５００と、を備える。以下の説明では、吸引器１００が、加熱部を着脱不能に収容した構成を例に説明する。しかし、吸引器１００に対し加熱部が着脱自在に構成されていてもよい。例えば、ロッド５００と加熱部が一体化されたものを、吸引器１００に着脱自在に構成したものであってもよい。つまり、エアロゾル生成装置の電源ユニットは、構成要素として加熱部を含まない構成であってもよい。なお、着脱不能とは、想定される用途の限りにおいて、取外しが行えないような態様を指すものとする。または、吸引器１００に設けられる誘導加熱用コイルと、ロッド５００に内蔵されるサセプタが協働して加熱部を構成してもよい。 A suction system, which is one embodiment of the aerosol generator of the present invention, will be described below with reference to the drawings. This suction system includes a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100. . In the following description, a configuration in which the suction device 100 accommodates the heating unit in a non-detachable manner will be described as an example. However, the heating unit may be detachably attached to the aspirator 100 . For example, the rod 500 and the heating unit may be integrated and detachably attached to the aspirator 100 . In other words, the power supply unit of the aerosol generator may have a configuration that does not include the heating section as a component. It should be noted that "non-detachable" refers to a mode in which detachment is not possible as far as the intended use is concerned. Alternatively, an induction heating coil provided in the aspirator 100 and a susceptor built in the rod 500 may cooperate to form a heating unit.
　図１は、吸引器１００の全体構成を示す斜視図である。図２は、ロッド５００を装着した状態を示す吸引器１００の斜視図である。図３は、吸引器１００の他の斜視図である。図４は、吸引器１００の分解斜視図である。また、以下の説明では、互いに直交する３方向を、便宜上、前後方向、左右方向、上下方向とした、３次元空間の直交座標系を用いて説明する。図中、前方をＦｒ、後方をＲｒ、右側をＲ、左側をＬ、上方をＵ、下方をＤ、として示す。 FIG. 1 is a perspective view showing the overall configuration of the aspirator 100. FIG. FIG. 2 is a perspective view of the suction device 100 showing a state in which the rod 500 is attached. FIG. 3 is another perspective view of the suction device 100. FIG. FIG. 4 is an exploded perspective view of the aspirator 100. FIG. Also, in the following description, for the sake of convenience, the orthogonal coordinate system of a three-dimensional space is used, in which the three mutually orthogonal directions are the front-back direction, the left-right direction, and the up-down direction. In the figure, the front is indicated by Fr, the rear by Rr, the right by R, the left by L, the upper by U, and the lower by D.
　吸引器１００は、エアロゾル源及び香味源を含む充填物などを有する香味成分生成基材の一例としての細長い略円柱状のロッド５００（図２参照）を加熱することによって、香味を含むエアロゾルを生成するように構成される。 The inhaler 100 generates flavor-containing aerosol by heating an elongated, substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-generating base having a filling containing an aerosol source and a flavor source. configured to
＜香味成分生成基材（ロッド）＞
　ロッド５００は、所定温度で加熱されてエアロゾルを生成するエアロゾル源を含有する充填物を含む。 <Flavor component-generating base material (rod)>
Rod 500 includes a fill containing an aerosol source that is heated at a predetermined temperature to produce an aerosol.
　エアロゾル源の種類は、特に限定されず、用途に応じて種々の天然物からの抽出物質及び／又はそれらの構成成分を選択することができる。エアロゾル源は、固体であってもよいし、例えば、グリセリン、プロピレングリコールといった多価アルコールや、水などの液体であってもよい。エアロゾル源は、加熱することによって香味成分を放出するたばこ原料やたばこ原料由来の抽出物等の香味源を含んでいてもよい。香味成分が付加される気体はエアロゾルに限定されず、例えば不可視の蒸気が生成されてもよい。 The type of aerosol source is not particularly limited, and extracts from various natural products and/or their constituent components can be selected according to the application. The aerosol source may be solid or liquid, for example polyhydric alcohols such as glycerin, propylene glycol, or water. The aerosol source may include a flavor source such as a tobacco material or an extract derived from the tobacco material that releases flavor components upon heating. The gas to which the flavor component is added is not limited to an aerosol, and for example an invisible vapor may be generated.
　ロッド５００の充填物は、香味源としてたばこ刻みを含有し得る。たばこ刻みの材料は特に限定されず、ラミナや中骨等の公知の材料を用いることができる。充填物は、１種又は２種以上の香料を含んでいてもよい。当該香料の種類は特に限定されないが、良好な喫味の付与の観点から、好ましくはメンソールである。香味源は、たばこ以外の植物（例えば、ミント、漢方、又はハーブ等）を含有し得る。用途によっては、ロッド５００は香味源を含まなくてもよい。 The filling of rod 500 may contain tobacco shreds as a flavor source. Materials for shredded tobacco are not particularly limited, and known materials such as lamina and backbone can be used. The filling may contain one or more perfumes. The type of flavoring agent is not particularly limited, but menthol is preferable from the viewpoint of imparting a good smoking taste. Flavor sources may contain plants other than tobacco, such as mints, herbal medicines, or herbs. Depending on the application, rod 500 may not contain a flavor source.
＜非燃焼式吸引器の全体構成＞
　続いて、吸引器１００の全体構成について、図１～図４を参照しながら説明する。
　吸引器１００は、前面、後面、左面、右面、上面、及び下面を備える略直方体形状のケース１１０を備える。ケース１１０は、前面、後面、上面、下面、及び右面が一体に形成された有底筒状のケース本体１１２と、ケース本体１１２の開口部１１４（図４参照）を封止し左面を構成するアウターパネル１１５及びインナーパネル１１８と、スライダ１１９と、を備える。 <Overall configuration of non-combustion type aspirator>
Next, the overall configuration of the suction device 100 will be described with reference to FIGS. 1 to 4. FIG.
The suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface. The case 110 comprises a bottomed cylindrical case body 112 in which front, rear, top, bottom, and right surfaces are integrally formed, and a left surface that seals an opening 114 (see FIG. 4) of the case body 112. It has an outer panel 115 , an inner panel 118 , and a slider 119 .
　インナーパネル１１８は、ケース本体１１２にボルト１２０で固定される。アウターパネル１１５は、ケース本体１１２に収容された後述するシャーシ１５０（図５参照）に保持されたマグネット１２４によって、インナーパネル１１８の外面を覆うようにケース本体１１２に固定される。アウターパネル１１５が、マグネット１２４によって固定されることで、ユーザは好みに合わせてアウターパネル１１５を取り替えることが可能となっている。 The inner panel 118 is fixed to the case body 112 with bolts 120 . The outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held by a chassis 150 (see FIG. 5) housed in the case body 112 and described later. Since the outer panel 115 is fixed by the magnet 124, the user can replace the outer panel 115 according to his or her preference.
　インナーパネル１１８には、マグネット１２４が貫通するように形成された２つの貫通孔１２６が設けられる。インナーパネル１１８には、上下に配置された２つの貫通孔１２６の間に、さらに縦長の長孔１２７及び円形の丸孔１２８が設けられる。この長孔１２７は、ケース本体１１２に内蔵された８つのＬＥＤ（Light Emitting Diode）　Ｌ１～Ｌ８から出射される光を透過させるためのものである。丸孔１２８には、ケース本体１１２に内蔵されたボタン式の操作スイッチＯＰＳが貫通する。これにより、ユーザは、アウターパネル１１５のＬＥＤ窓１１６を介して８つのＬＥＤ　Ｌ１～Ｌ８から出射される光を検知することができる。また、ユーザは、アウターパネル１１５の押圧部１１７を介して操作スイッチＯＰＳを押し下げることができる。 The inner panel 118 is provided with two through holes 126 through which the magnets 124 pass. The inner panel 118 is further provided with a longitudinally elongated hole 127 and a circular round hole 128 between the two vertically arranged through holes 126 . This long hole 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case body 112 . A button-type operation switch OPS built in the case body 112 passes through the round hole 128 . Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. FIG. Also, the user can press down the operation switch OPS via the pressing portion 117 of the outer panel 115 .
　図２に示すように、ケース本体１１２の上面には、ロッド５００を挿入可能な開口１３２が設けられる。スライダ１１９は、開口１３２を閉じる位置（図１参照）と開口１３２を開放する位置（図２参照）との間を、前後方向に移動可能にケース本体１１２に結合される。 As shown in FIG. 2, the upper surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted. The slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position for closing the opening 132 (see FIG. 1) and a position for opening the opening 132 (see FIG. 2).
　操作スイッチＯＰＳは、吸引器１００の各種操作を行うために使用される。例えば、ユーザは、図２に示すようにロッド５００を開口１３２に挿入して装着した状態で、押圧部１１７を介して操作スイッチＯＰＳを操作する。これにより、加熱部１７０（図５参照）によって、ロッド５００を燃焼させずに加熱する。ロッド５００が加熱されると、ロッド５００に含まれるエアロゾル源からエアロゾルが生成され、ロッド５００に含まれる香味源の香味が当該エアロゾルに付加される。ユーザは、開口１３２から突出したロッド５００の吸口５０２を咥えて吸引することにより、香味を含むエアロゾルを吸引することができる。 The operation switch OPS is used to perform various operations of the aspirator 100. For example, the user operates the operation switch OPS via the pressing portion 117 while inserting the rod 500 into the opening 132 as shown in FIG. Thus, the heating unit 170 (see FIG. 5) heats the rod 500 without burning it. When the rod 500 is heated, an aerosol is generated from the aerosol source contained in the rod 500 and the flavor of the flavor source contained in the rod 500 is added to the aerosol. The user can inhale the flavor-containing aerosol by holding the mouthpiece 502 of the rod 500 projecting from the opening 132 and inhaling.
　ケース本体１１２の下面には、図３に示すように、コンセントやモバイルバッテリ等の外部電源と電気的に接続して電力供給を受けるための充電端子１３４が設けられている。本実施形態において、充電端子１３４は、ＵＳＢ（Universal Serial Bus）　Ｔｙｐｅ－Ｃ形状のレセプタクルとしているが、これに限定されるものではない。充電端子１３４を、以下では、レセプタクルＲＣＰとも記載する。 　On the bottom surface of the case main body 112, as shown in Fig. 3, a charging terminal 134 is provided for receiving power supply by being electrically connected to an external power source such as an outlet or a mobile battery. In this embodiment, the charging terminal 134 is a USB (Universal Serial Bus) Type-C receptacle, but is not limited to this. Charging terminal 134 is hereinafter also referred to as receptacle RCP.
　なお、充電端子１３４は、例えば、受電コイルを備え、外部電源から送電される電力を非接触で受電可能に構成されてもよい。この場合の電力伝送（Wireless Power Transfer）の方式は、電磁誘導型でもよいし、磁気共鳴型でもよいし、電磁誘導型と磁気共鳴型を組み合わせたものでもよい。別の一例として、充電端子１３４は、各種ＵＳＢ端子等が接続可能であり、且つ上述した受電コイルを有していてもよい。 It should be noted that the charging terminal 134 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply. The wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type. As another example, the charging terminal 134 can be connected to various USB terminals or the like, and may have the power receiving coil described above.
　図１～図４に示される吸引器１００の構成は一例にすぎない。吸引器１００は、ロッド５００を保持して例えば加熱等の作用を加えることで、ロッド５００から香味成分が付与された気体を生成させ、生成された気体をユーザが吸引することができるような、様々な形態で構成することができる。 The configuration of the aspirator 100 shown in FIGS. 1-4 is merely an example. The inhaler 100 holds the rod 500 and applies an action such as heating to generate gas to which a flavor component is added from the rod 500, and the user can inhale the generated gas. It can be configured in various forms.
＜非燃焼式吸引器の内部構成＞
　吸引器１００の内部ユニット１４０について図５～図８を参照しながら説明する。
　図５は、吸引器１００の内部ユニット１４０の斜視図である。図６は、図５の内部ユニット１４０の分解斜視図である。図７は、電源ＢＡＴ及びシャーシ１５０を取り除いた内部ユニット１４０の斜視図である。図８は、電源ＢＡＴ及びシャーシ１５０を取り除いた内部ユニット１４０の他の斜視図である。 <Internal configuration of non-combustion type aspirator>
The internal unit 140 of the suction device 100 will be described with reference to FIGS. 5-8.
FIG. 5 is a perspective view of the internal unit 140 of the suction device 100. FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5. FIG. FIG. 7 is a perspective view of internal unit 140 with power supply BAT and chassis 150 removed. FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and chassis 150 removed.
　ケース１１０の内部空間に収容される内部ユニット１４０は、シャーシ１５０と、電源ＢＡＴと、回路部１６０と、加熱部１７０と、通知部１８０と、各種センサと、を備える。 The internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.
　シャーシ１５０は、前後方向においてケース１１０の内部空間の略中央に配置され上下方向且つ前後方向に延設された板状のシャーシ本体１５１と、前後方向においてケース１１０の内部空間の略中央に配置され上下方向且つ左右方向に延びる板状の前後分割壁１５２と、上下方向において前後分割壁１５２の略中央から前方に延びる板状の上下分割壁１５３と、前後分割壁１５２及びシャーシ本体１５１の上縁部から後方に延びる板状のシャーシ上壁１５４と、前後分割壁１５２及びシャーシ本体１５１の下縁部から後方に延びる板状のシャーシ下壁１５５と、を備える。シャーシ本体１５１の左面は、前述したケース１１０のインナーパネル１１８及びアウターパネル１１５に覆われる。 The chassis 150 includes a plate-shaped chassis body 151 arranged substantially in the center of the interior space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, and a chassis body 151 disposed substantially in the center of the interior space of the case 110 in the front-rear direction. A plate-shaped front and rear dividing wall 152 extending in the vertical and horizontal directions, a plate-shaped upper and lower dividing wall 153 extending forward from substantially the center of the front and rear dividing wall 152 in the vertical direction, the front and rear dividing wall 152 and the upper edges of the chassis body 151 and a plate-shaped chassis lower wall 155 extending rearward from the front-rear dividing wall 152 and the lower edge of the chassis body 151 . The left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.
　ケース１１０の内部空間は、シャーシ１５０により前方上部に加熱部収容領域１４２が区画形成され、前方下部に基板収容領域１４４が区画形成され、後方に上下方向に亘って電源収容空間１４６が区画形成されている。 The internal space of the case 110 is defined by a chassis 150 such that a heating unit housing area 142 is defined in the upper front, a board housing area 144 is defined in the lower front, and a power supply housing space 146 is defined in the rear to extend vertically. ing.
　加熱部収容領域１４２に収容される加熱部１７０は、複数の筒状の部材から構成され、これらが同心円状に配置されることで、全体として筒状体をなしている。加熱部１７０は、その内部にロッド５００の一部を収納可能なロッド収容部１７２と、ロッド５００を外周または中心から加熱するヒータＨＴＲ（図１０～図１９参照）と、を有する。ロッド収容部１７２が断熱材で構成される、又は、ロッド収容部１７２の内部に断熱材が設けられることで、ロッド収容部１７２の表面とヒータＨＴＲは断熱されることが好ましい。ヒータＨＴＲは、ロッド５００を加熱可能な素子であればよい。ヒータＨＴＲは、例えば、発熱素子である。発熱素子としては、発熱抵抗体、セラミックヒータ、及び誘導加熱式のヒータ等が挙げられる。ヒータＨＴＲとしては、例えば、温度の増加に伴って抵抗値も増加するＰＴＣ（Positive Temperature Coefficient）特性を有するものが好ましく用いられる。これに代えて、温度の増加に伴って抵抗値が低下するＮＴＣ（Negative Temperature Coefficient）特性を有するヒータＨＴＲを用いてもよい。加熱部１７０は、ロッド５００へ供給する空気の流路を画定する機能、及びロッド５００を加熱する機能を有する。ケース１１０には、空気を流入させるための通気口（不図示）が形成され、加熱部１７０に空気が流入できるように構成される。 The heating part 170 housed in the heating part housing area 142 is composed of a plurality of tubular members, which are concentrically arranged to form a tubular body as a whole. The heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) that heats the rod 500 from its outer circumference or center. Preferably, the surface of the rod housing portion 172 and the heater HTR are insulated by forming the rod housing portion 172 from a heat insulating material or providing a heat insulating material inside the rod housing portion 172 . The heater HTR may be any element that can heat the rod 500 . The heater HTR is, for example, a heating element. Heating elements include heating resistors, ceramic heaters, induction heaters, and the like. As the heater HTR, for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used. Alternatively, a heater HTR having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used. The heating part 170 has a function of defining a flow path of air to be supplied to the rod 500 and a function of heating the rod 500 . The case 110 is formed with a vent (not shown) for introducing air, and is configured to allow air to enter the heating unit 170 .
　電源収容空間１４６に収容される電源ＢＡＴは、充電可能な二次電池、電気二重層キャパシタ等であり、好ましくは、リチウムイオン二次電池である。電源ＢＡＴの電解質は、ゲル状の電解質、電解液、固体電解質、イオン液体の１つ又はこれらの組合せで構成されていてもよい。 The power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery. The electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
　通知部１８０は、電源ＢＡＴの充電状態を示すＳＯＣ（State Of Charge）、吸引時の予熱時間、吸引可能期間等の各種情報を通知する。本実施形態の通知部１８０は、８つのＬＥＤ　Ｌ１～Ｌ８と、振動モータＭと、を含む。通知部１８０は、ＬＥＤ　Ｌ１～Ｌ８のような発光素子によって構成されていてもよく、振動モータＭのような振動素子によって構成されていてもよく、音出力素子によって構成されていてもよい。通知部１８０は、発光素子、振動素子、及び音出力素子のうち、２以上の素子の組合せであってもよい。 The notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the state of charge of the power supply BAT, the preheating time during suction, and the suction possible period. The notification unit 180 of this embodiment includes eight LEDs L1 to L8 and a vibration motor M. The notification unit 180 may be composed of light emitting elements such as LEDs L1 to L8, may be composed of vibrating elements such as the vibration motor M, or may be composed of sound output elements. The notification unit 180 may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
　各種センサは、ユーザのパフ動作（吸引動作）を検出する吸気センサ、電源ＢＡＴの温度を検出する電源温度センサ、ヒータＨＴＲの温度を検出するヒータ温度センサ、ケース１１０の温度を検出するケース温度センサ、スライダ１１９の位置を検出するカバー位置センサ、及びアウターパネル１１５の着脱を検出するパネル検出センサ等を含む。 Various sensors include an intake air sensor that detects the user's puff action (sucking action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , a cover position sensor that detects the position of the slider 119, a panel detection sensor that detects attachment/detachment of the outer panel 115, and the like.
　吸気センサは、例えば、開口１３２の近傍に配置されたサーミスタＴ２を主体に構成される。電源温度センサは、例えば、電源ＢＡＴの近傍に配置されたサーミスタＴ１を主体に構成される。ヒータ温度センサは、例えば、ヒータＨＴＲの近傍に配置されたサーミスタＴ３を主体に構成される。上述した通り、ロッド収容部１７２はヒータＨＴＲから断熱されることが好ましい。この場合において、サーミスタＴ３は、ロッド収容部１７２の内部において、ヒータＨＴＲと接する又は近接することが好ましい。ヒータＨＴＲがＰＴＣ特性やＮＴＣ特性を有する場合、ヒータＨＴＲそのものをヒータ温度センサに用いてもよい。ケース温度センサは、例えば、ケース１１０の左面の近傍に配置されたサーミスタＴ４を主体に構成される。カバー位置センサは、スライダ１１９の近傍に配置されたホール素子を含むホールＩＣ１４を主体に構成される。パネル検出センサは、インナーパネル１１８の内側の面の近傍に配置されたホール素子を含むホールＩＣ１３を主体に構成される。 The intake sensor is mainly composed of a thermistor T2 arranged near the opening 132, for example. The power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged near the power supply BAT. The heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged near the heater HTR. As described above, the rod housing portion 172 is preferably insulated from the heater HTR. In this case, the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod housing portion 172 . If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor. The case temperature sensor is mainly composed of, for example, a thermistor T4 arranged near the left surface of the case 110 . The cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged near the slider 119 . The panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged near the inner surface of the inner panel 118 .
　回路部１６０は、４つの回路基板と、複数のＩＣ（Integrate Circuit）と、複数の素子と、を備える。４つの回路基板は、主に後述のＭＣＵ(Micro Controller Unit)１及び充電ＩＣ２が配置されたＭＣＵ搭載基板１６１と、主に充電端子１３４が配置されたレセプタクル搭載基板１６２と、操作スイッチＯＰＳ、ＬＥＤ　Ｌ１～Ｌ８、及び後述の通信ＩＣ１５が配置されたＬＥＤ搭載基板１６３と、カバー位置センサを構成するホール素子を含む後述のホールＩＣ１４が配置されたホールＩＣ搭載基板１６４と、を備える。 The circuit section 160 includes four circuit boards, multiple ICs (Integrate Circuits), and multiple elements. The four circuit boards are an MCU-mounted board 161 on which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are mainly arranged, a receptacle-mounted board 162 mainly on which charging terminals 134 are arranged, an operation switch OPS, and an LED An LED mounting substrate 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a Hall IC mounting substrate 164 on which a Hall IC 14 including a Hall element constituting a cover position sensor is arranged.
　ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２は、基板収容領域１４４において互いに平行に配置される。具体的に説明すると、ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２は、それぞれの素子配置面が左右方向及び上下方向に沿って配置され、ＭＣＵ搭載基板１６１がレセプタクル搭載基板１６２よりも前方に配置される。ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２には、それぞれ開口部が設けられる。ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２は、これら開口部の周縁部同士の間に円筒状のスペーサ１７３を介在させた状態で前後分割壁１５２の基板固定部１５６にボルト１３６で締結される。即ち、スペーサ１７３は、ケース１１０の内部におけるＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２の位置を固定し、且つ、ＭＣＵ搭載基板１６１とレセプタクル搭載基板１６２とを機械的に接続する。これにより、ＭＣＵ搭載基板１６１とレセプタクル搭載基板１６２が接触し、これらの間で短絡電流が生じることを抑制できる。 The MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144 . More specifically, the MCU mounting board 161 and the receptacle mounting board 162 are arranged such that their element mounting surfaces are arranged along the horizontal direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. . The MCU mounting board 161 and the receptacle mounting board 162 are each provided with openings. The MCU mounting board 161 and the receptacle mounting board 162 are fastened with bolts 136 to the board fixing portion 156 of the front/rear dividing wall 152 with a cylindrical spacer 173 interposed between the peripheral edges of these openings. That is, the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162 . As a result, it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them.
　便宜上、ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２の前方を向く面を、それぞれの主面１６１ａ、１６２ａとし、主面１６１ａ、１６２ａの反対面をそれぞれの副面１６１ｂ、１６２ｂとすると、ＭＣＵ搭載基板１６１の副面１６１ｂと、レセプタクル搭載基板１６２の主面１６２ａとが、所定の隙間を介して対向する。ＭＣＵ搭載基板１６１の主面１６１ａはケース１１０の前面と対向し、レセプタクル搭載基板１６２の副面１６２ｂは、シャーシ１５０の前後分割壁１５２と対向する。ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２に搭載される素子及びＩＣについては後述する。 For the sake of convenience, the MCU mounting board 161 and the receptacle mounting board 162 have main surfaces 161a and 162a that face forward, and secondary surfaces 161b and 162b that are opposite to the main surfaces 161a and 162a. and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined gap therebetween. A main surface 161 a of the MCU mounting board 161 faces the front surface of the case 110 , and a secondary surface 162 b of the receptacle mounting board 162 faces the front and rear dividing walls 152 of the chassis 150 . Elements and ICs mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described later.
　ＬＥＤ搭載基板１６３は、シャーシ本体１５１の左側面、且つ上下に配置された２つのマグネット１２４の間に配置される。ＬＥＤ搭載基板１６３の素子配置面は、上下方向及び前後方向に沿って配置されている。換言すると、ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２それぞれの素子配置面と、ＬＥＤ搭載基板１６３の素子配置面とは、直交している。このように、ＭＣＵ搭載基板１６１及びレセプタクル搭載基板１６２それぞれの素子配置面と、ＬＥＤ搭載基板１６３の素子配置面とは、直交に限らず、交差している（非平行である）ことが好ましい。なお、ＬＥＤ　Ｌ１～Ｌ８とともに通知部１８０を構成する振動モータＭは、シャーシ下壁１５５の下面に固定され、ＭＣＵ搭載基板１６１に電気的に接続される。 The LED mounting board 163 is arranged on the left side of the chassis body 151 and between the two magnets 124 arranged vertically. The element mounting surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-rear direction. In other words, the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element mounting surface of the LED mounting board 163 . In this way, the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 and the element mounting surface of the LED mounting board 163 are not limited to being orthogonal, but preferably intersect (non-parallel). The vibration motor M, which forms the notification unit 180 together with the LEDs L1 to L8, is fixed to the bottom surface of the chassis bottom wall 155 and electrically connected to the MCU mounting board 161. FIG.
　ホールＩＣ搭載基板１６４は、シャーシ上壁１５４の上面に配置される。 The Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154 .
＜吸引器の動作モード＞
　図９は、吸引器１００の動作モードを説明するための模式図である。図９に示すように、吸引器１００の動作モードには、充電モード、スリープモード、アクティブモード、加熱初期設定モード、加熱モード、及び加熱終了モードが含まれる。 <Operation mode of the aspirator>
FIG. 9 is a schematic diagram for explaining the operation modes of the aspirator 100. As shown in FIG. As shown in FIG. 9, the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initialization mode, heating mode, and heating termination mode.
　スリープモードは、主にヒータＨＴＲの加熱制御に必要な電子部品への電力供給を停止して省電力化を図るモードである。 The sleep mode is a mode for saving power by stopping the power supply to the electronic parts required for heating control of the heater HTR.
　アクティブモードは、ヒータＨＴＲの加熱制御を除くほとんどの機能が有効になるモードである。吸引器１００は、スリープモードにて動作している状態にて、スライダ１１９が開かれると、動作モードをアクティブモードに切り替える。吸引器１００は、アクティブモードにて動作している状態にて、スライダ１１９が閉じられたり、操作スイッチＯＰＳの無操作時間が所定時間に達したりすると、動作モードをスリープモードに切り替える。 The active mode is a mode in which most functions except heating control of the heater HTR are enabled. When the slider 119 is opened while the suction device 100 is operating in the sleep mode, the operation mode is switched to the active mode. When the slider 119 is closed or the non-operating time of the operation switch OPS reaches a predetermined time while the aspirator 100 is operating in the active mode, the operating mode is switched to the sleep mode.
　加熱初期設定モードは、ヒータＨＴＲの加熱制御を開始するための制御パラメータ等の初期設定を行うモードである。吸引器１００は、アクティブモードにて動作している状態にて、操作スイッチＯＰＳの操作を検出すると、動作モードを加熱初期設定モードに切り替え、初期設定が終了すると、動作モードを加熱モードに切り替える。 The heating initial setting mode is a mode for initializing control parameters and the like for starting heating control of the heater HTR. When the aspirator 100 detects the operation of the operation switch OPS while operating in the active mode, it switches the operation mode to the heating initial setting mode, and when the initial setting is completed, switches the operation mode to the heating mode.
　加熱モードは、ヒータＨＴＲの加熱制御（エアロゾル生成のための加熱制御と、温度検出のための加熱制御）を実行するモードである。吸引器１００は、動作モードが加熱モードに切り替わると、ヒータＨＴＲの加熱制御を開始する。 The heating mode is a mode that executes heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection). The aspirator 100 starts heating control of the heater HTR when the operation mode is switched to the heating mode.
　加熱終了モードは、ヒータＨＴＲの加熱制御の終了処理（加熱履歴の記憶処理等）を実行するモードである。吸引器１００は、加熱モードにて動作している状態にて、ヒータＨＴＲへの通電時間又はユーザの吸引回数が上限に達したり、スライダ１１９が閉じられたりすると、動作モードを加熱終了モードに切り替え、終了処理が終了すると、動作モードをアクティブモードに切り替える。吸引器１００は、加熱モードにて動作している状態にて、ＵＳＢ接続がなされると、動作モードを加熱終了モードに切り替え、終了処理が終了すると、動作モードを充電モードに切り替える。図９に示したように、この場合において、動作モードを充電モードに切り替える前に、動作モードをアクティブモードへ切り替えてもよい。換言すれば、吸引器１００は、加熱モードにて動作している状態にて、ＵＳＢ接続がなされると、動作モードを加熱終了モード、アクティブモード、充電モードの順に切り替えてもよい。 The heating end mode is a mode for executing heating control end processing (heating history storage processing, etc.) of the heater HTR. In a state in which the suction device 100 is operating in the heating mode, when the energization time of the heater HTR or the number of times of suction by the user reaches the upper limit, or when the slider 119 is closed, the operation mode is switched to the heating end mode. , when the termination process is completed, the operation mode is switched to the active mode. When the USB connection is established while the aspirator 100 is operating in the heating mode, the operating mode is switched to the heating end mode, and when the end processing is completed, the operating mode is switched to the charging mode. As shown in FIG. 9, in this case, the operating mode may be switched to the active mode before switching the operating mode to the charging mode. In other words, the aspirator 100 may switch the operation mode in order of the heating end mode, the active mode, and the charging mode when the USB connection is made while operating in the heating mode.
　充電モードは、レセプタクルＲＣＰに接続された外部電源から供給される電力により、電源ＢＡＴの充電を行うモードである。吸引器１００は、スリープモード又はアクティブモードにて動作している状態にて、レセプタクルＲＣＰに外部電源が接続（ＵＳＢ接続）されると、動作モードを充電モードに切り替える。吸引器１００は、充電モードにて動作している状態にて、電源ＢＡＴの充電が完了したり、レセプタクルＲＣＰと外部電源との接続が解除されたりすると、動作モードをスリープモードに切り替える。 The charging mode is a mode in which the power supply BAT is charged with power supplied from an external power supply connected to the receptacle RCP. The aspirator 100 switches the operation mode to the charge mode when an external power source is connected (USB connection) to the receptacle RCP while operating in sleep mode or active mode. The aspirator 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released while operating in the charging mode.
＜内部ユニットの回路の概略＞
　図１０、図１１、及び図１２は、内部ユニット１４０の電気回路の概略構成を示す図である。図１１は、図１０に示す電気回路のうち、ＭＣＵ搭載基板１６１に搭載される範囲１６１Ａ（太い破線で囲まれた範囲）と、ＬＥＤ搭載基板１６３に搭載される範囲１６３Ａ（太い実線で囲まれた範囲）とを追加した点を除いては、図１０と同じである。図１２は、図１０に示す電気回路のうち、レセプタクル搭載基板１６２に搭載される範囲１６２Ａと、ホールＩＣ搭載基板１６４に搭載される範囲１６４Ａとを追加した点を除いては、図１０と同じである。 <Outline of internal unit circuit>
10, 11, and 12 are diagrams showing the schematic configuration of the electric circuit of the internal unit 140. FIG. 11 shows a range 161A mounted on the MCU mounting board 161 (range surrounded by thick dashed lines) and a range 163A mounted on the LED mounting board 163 (range surrounded by thick solid lines) in the electric circuit shown in FIG. It is the same as FIG. 12 is the same as FIG. 10 except that a range 162A mounted on the receptacle mounting board 162 and a range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. is.
　図１０において太い実線で示した配線は、内部ユニット１４０の基準となる電位（グランド電位）と同電位となる配線（内部ユニット１４０に設けられたグランドに接続される配線）であり、この配線を以下ではグランドラインと記載する。図１０では、複数の回路素子をチップ化した電子部品を矩形で示しており、この矩形の内側に各種端子の符号を記載している。チップに搭載される電源端子ＶＣＣ及び電源端子ＶＤＤは、それぞれ、高電位側の電源端子を示す。チップに搭載される電源端子ＶＳＳ及びグランド端子ＧＮＤは、それぞれ、低電位側（基準電位側）の電源端子を示す。チップ化された電子部品は、高電位側の電源端子の電位と低電位側の電源端子の電位の差分が、電源電圧となる。チップ化された電子部品は、この電源電圧を用いて、各種機能を実行する。 The wiring indicated by the thick solid line in FIG. 10 is the wiring (the wiring connected to the ground provided in the internal unit 140) that has the same potential as the reference potential (ground potential) of the internal unit 140. It is described as a ground line below. In FIG. 10, an electronic component in which a plurality of circuit elements are chipped is indicated by a rectangle, and the symbols of various terminals are indicated inside the rectangle. A power supply terminal VCC and a power supply terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively. A power supply terminal VSS and a ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side). In a chipped electronic component, the power supply voltage is the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side. Chipped electronic components use this power supply voltage to perform various functions.
　図１１に示すように、ＭＣＵ搭載基板１６１（範囲１６１Ａ）には、主要な電子部品として、吸引器１００の全体を統括制御するＭＣＵ１と、電源ＢＡＴの充電制御を行う充電ＩＣ２と、コンデンサ、抵抗器、及びトランジスタ等を組み合わせて構成されたロードスイッチ（以下、ＬＳＷ）３，４，５と、ＲＯＭ（Read Only Memory）６と、スイッチドライバ７と、昇降圧ＤＣ／ＤＣコンバータ８（図では、昇降圧ＤＣ／ＤＣ８と記載）と、オペアンプＯＰ２と、オペアンプＯＰ３と、フリップフロップ（以下、ＦＦ）１６，１７と、吸気センサを構成するサーミスタＴ２と電気的に接続されるコネクタＣｎ（ｔ２）（図では、このコネクタに接続されたサーミスタＴ２を記載）と、ヒータ温度センサを構成するサーミスタＴ３と電気的に接続されるコネクタＣｎ（ｔ３）（図では、このコネクタに接続されたサーミスタＴ３を記載）と、ケース温度センサを構成するサーミスタＴ４と電気的に接続されるコネクタＣｎ（ｔ４）（図では、このコネクタに接続されたサーミスタＴ４を記載）と、ＵＳＢ接続検出用の分圧回路Ｐｃと、が設けられている。 As shown in FIG. 11, the MCU-mounted board 161 (range 161A) includes, as main electronic components, an MCU1 that controls the entire sucker 100, a charging IC2 that controls charging of the power source BAT, a capacitor, a resistor load switches (hereinafter referred to as LSW) 3, 4, 5, a ROM (Read Only Memory) 6, a switch driver 7, and a step-up/step-down DC/DC converter 8 (in the figure, buck-boost DC/DC 8), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16, 17, connector Cn (t2) (which is electrically connected to thermistor T2 constituting an intake sensor) ( The figure shows the thermistor T2 connected to this connector), and a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (the figure shows the thermistor T3 connected to this connector). ), a connector Cn (t4) electrically connected to the thermistor T4 constituting the case temperature sensor (in the drawing, the thermistor T4 connected to this connector is shown), and a voltage dividing circuit Pc for detecting USB connection. , is provided.
　充電ＩＣ２、ＬＳＷ３、ＬＳＷ４、ＬＳＷ５、スイッチドライバ７、昇降圧ＤＣ／ＤＣコンバータ８、ＦＦ１６、及びＦＦ１７の各々のグランド端子ＧＮＤは、グランドラインに接続されている。ＲＯＭ６の電源端子ＶＳＳは、グランドラインに接続されている。オペアンプＯＰ２及びオペアンプＯＰ３の各々の負電源端子は、グランドラインに接続されている。 A ground terminal GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, step-up/step-down DC/DC converter 8, FF16, and FF17 is connected to a ground line. A power terminal VSS of the ROM 6 is connected to the ground line. A negative power supply terminal of each of the operational amplifiers OP2 and OP3 is connected to the ground line.
　図１１に示すように、ＬＥＤ搭載基板１６３（範囲１６３Ａ）には、主要な電子部品として、パネル検出センサを構成するホール素子を含むホールＩＣ１３と、ＬＥＤ　Ｌ１～Ｌ８と、操作スイッチＯＰＳと、通信ＩＣ１５と、が設けられている。通信ＩＣ１５は、スマートフォン等の電子機器との通信を行うための通信モジュールである。ホールＩＣ１３の電源端子ＶＳＳ及び通信ＩＣ１５のグランド端子ＧＮＤの各々は、グランドラインに接続されている。通信ＩＣ１５とＭＣＵ１は、通信線ＬＮによって通信可能に構成されている。操作スイッチＯＰＳの一端はグランドラインに接続され、操作スイッチＯＰＳの他端はＭＣＵ１の端子Ｐ４に接続されている。 As shown in FIG. 11, the LED mounting board 163 (area 163A) has, as main electronic components, a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, a communication IC 15 and are provided. The communication IC 15 is a communication module for communicating with electronic devices such as smartphones. A power supply terminal VSS of the Hall IC 13 and a ground terminal GND of the communication IC 15 are each connected to a ground line. Communication IC 15 and MCU 1 are configured to be communicable via communication line LN. One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.
　図１２に示すように、レセプタクル搭載基板１６２（範囲１６２Ａ）には、主要な電子部品として、電源ＢＡＴと電気的に接続される電源コネクタ（図では、この電源コネクタに接続された電源ＢＡＴを記載）と、電源温度センサを構成するサーミスタＴ１と電気的に接続されるコネクタ（図では、このコネクタに接続されたサーミスタＴ１を記載）と、昇圧ＤＣ／ＤＣコンバータ９（図では、昇圧ＤＣ／ＤＣ９と記載）と、保護ＩＣ１０と、過電圧保護ＩＣ１１と、残量計ＩＣ１２と、レセプタクルＲＣＰと、ＭＯＳＦＥＴで構成されたスイッチＳ３～スイッチＳ６と、オペアンプＯＰ１と、ヒータＨＴＲと電気的に接続される一対（正極側と負極側）のヒータコネクタＣｎと、が設けられている。 As shown in FIG. 12, the receptacle mounting board 162 (range 162A) includes a power connector electrically connected to the power supply BAT as a main electronic component (in the figure, the power supply BAT connected to this power connector is shown). ), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown), and a boost DC/DC converter 9 (in the figure, a boost DC/DC 9 ), the protection IC 10, the overvoltage protection IC 11, the fuel gauge IC 12, the receptacle RCP, the switches S3 to S6 configured by MOSFETs, the operational amplifier OP1, and the heater HTR. (positive electrode side and negative electrode side) heater connectors Cn are provided.
　レセプタクルＲＣＰの２つのグランド端子ＧＮＤと、昇圧ＤＣ／ＤＣコンバータ９のグランド端子ＧＮＤと、保護ＩＣ１０の電源端子ＶＳＳと、残量計ＩＣ１２の電源端子ＶＳＳと、過電圧保護ＩＣ１１のグランド端子ＧＮＤと、オペアンプＯＰ１の負電源端子は、それぞれ、グランドラインに接続されている。 Two ground terminals GND of receptacle RCP, ground terminal GND of step-up DC/DC converter 9, power supply terminal VSS of protection IC 10, power supply terminal VSS of fuel gauge IC 12, ground terminal GND of overvoltage protection IC 11, and operational amplifier The negative power supply terminals of OP1 are each connected to the ground line.
　図１２に示すように、ホールＩＣ搭載基板１６４（範囲１６４Ａ）には、カバー位置センサを構成するホール素子を含むホールＩＣ１４が設けられている。ホールＩＣ１４の電源端子ＶＳＳは、グランドラインに接続されている。ホールＩＣ１４の出力端子ＯＵＴは、ＭＣＵ１の端子Ｐ８に接続されている。ＭＣＵ１は、端子Ｐ８に入力される信号により、スライダ１１９の開閉を検出する。 As shown in FIG. 12, the Hall IC mounting substrate 164 (area 164A) is provided with a Hall IC 14 including a Hall element that constitutes a cover position sensor. A power terminal VSS of the Hall IC 14 is connected to the ground line. The output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU1. The MCU1 detects opening/closing of the slider 119 from a signal input to the terminal P8.
　図１１に示すように、振動モータＭと電気的に接続されるコネクタは、ＭＣＵ搭載基板１６１に設けられている。 As shown in FIG. 11, a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161 .
＜内部ユニットの回路の詳細＞
　以下、図１０を参照しながら各電子部品の接続関係等について説明する。 <Details of internal unit circuit>
The connection relationship and the like of each electronic component will be described below with reference to FIG. 10 .
　レセプタクルＲＣＰの２つの電源入力端子ＶＢＵＳは、それぞれ、ヒューズＦｓを介して、過電圧保護ＩＣ１１の入力端子ＩＮに接続されている。レセプタクルＲＣＰにＵＳＢプラグが接続され、このＵＳＢプラグを含むＵＳＢケーブルが外部電源に接続されると、レセプタクルＲＣＰの２つの電源入力端子ＶＢＵＳにＵＳＢ電圧ＶＵＳＢが供給される。 The two power supply input terminals V BUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC11 via a fuse Fs. When a USB plug is connected to the receptacle RCP and a USB cable including this USB plug is connected to an external power supply, the USB voltage V USB is supplied to the two power input terminals V BUS of the receptacle RCP.
　過電圧保護ＩＣ１１の入力端子ＩＮには、２つの抵抗器の直列回路からなる分圧回路Ｐａの一端が接続されている。分圧回路Ｐａの他端はグランドラインに接続されている。分圧回路Ｐａを構成する２つの抵抗器の接続点は、過電圧保護ＩＣ１１の電圧検出端子ＯＶＬｏに接続されている。過電圧保護ＩＣ１１は、電圧検出端子ＯＶＬｏに入力される電圧が閾値未満の状態では、入力端子ＩＮに入力された電圧を出力端子ＯＵＴから出力する。過電圧保護ＩＣ１１は、電圧検出端子ＯＶＬｏに入力される電圧が閾値以上（過電圧）となった場合には、出力端子ＯＵＴからの電圧出力を停止（ＬＳＷ３とレセプタクルＲＣＰとの電気的な接続を遮断）することで、過電圧保護ＩＣ１１よりも下流の電子部品の保護を図る。過電圧保護ＩＣ１１の出力端子ＯＵＴは、ＬＳＷ３の入力端子ＶＩＮと、ＭＣＵ１に接続された分圧回路Ｐｃ（２つの抵抗器の直列回路）の一端と、に接続されている。分圧回路Ｐｃの他端はグランドラインに接続されている。分圧回路Ｐｃを構成する２つの抵抗器の接続点は、ＭＣＵ１の端子Ｐ１７に接続されている。 An input terminal IN of the overvoltage protection IC 11 is connected to one end of a voltage dividing circuit Pa consisting of a series circuit of two resistors. The other end of the voltage dividing circuit Pa is connected to the ground line. A connection point between the two resistors forming the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11. The overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold. The overvoltage protection IC 11 stops voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected. The output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of the voltage dividing circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. A connection point of the two resistors forming the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.
　ＬＳＷ３の入力端子ＶＩＮには、２つの抵抗器の直列回路からなる分圧回路Ｐｆの一端が接続されている。分圧回路Ｐｆの他端はグランドラインに接続されている。分圧回路Ｐｆを構成する２つの抵抗器の接続点は、ＬＳＷ３の制御端子ＯＮに接続されている。ＬＳＷ３の制御端子ＯＮには、バイポーラトランジスタＳ２のコレクタ端子が接続されている。バイポーラトランジスタＳ２のエミッタ端子はグランドラインに接続されている。バイポーラトランジスタＳ２のベース端子は、ＭＣＵ１の端子Ｐ１９に接続されている。ＬＳＷ３は、制御端子ＯＮに入力される信号がハイレベルになると、入力端子ＶＩＮに入力された電圧を出力端子ＶＯＵＴから出力する。ＬＳＷ３の出力端子ＶＯＵＴは、充電ＩＣ２の入力端子ＶＢＵＳに接続されている。ＭＣＵ１は、ＵＳＢ接続がなされていない間は、バイポーラトランジスタＳ２をオンにする。これにより、ＬＳＷ３の制御端子ＯＮはバイポーラトランジスタＳ２を介してグランドラインへ接続されるため、ＬＳＷ３の制御端子ＯＮにはローレベルの信号が入力される。
　ＬＳＷ３に接続されたバイポーラトランジスタＳ２は、ＵＳＢ接続がなされると、ＭＣＵ１によってオフされる。バイポーラトランジスタＳ２がオフすることで、分圧回路Ｐｆによって分圧されたＵＳＢ電圧ＶＵＳＢがＬＳＷ３の制御端子ＯＮに入力される。このため、ＵＳＢ接続がなされ且つバイポーラトランジスタＳ２がオフされると、ＬＳＷ３の制御端子ＯＮには、ハイレベルの信号が入力される。これにより、ＬＳＷ３は、ＵＳＢケーブルから供給されるＵＳＢ電圧ＶＵＳＢを出力端子ＶＯＵＴから出力する。なお、バイポーラトランジスタＳ２がオフされていない状態でＵＳＢ接続がなされても、ＬＳＷ３の制御端子ＯＮは、バイポーラトランジスタＳ２を介してグランドラインへ接続されている。このため、ＭＣＵ１がバイポーラトランジスタＳ２をオフしない限り、ＬＳＷ３の制御端子ＯＮにはローレベルの信号が入力され続ける点に留意されたい。 An input terminal VIN of LSW3 is connected to one end of a voltage dividing circuit Pf consisting of a series circuit of two resistors. The other end of the voltage dividing circuit Pf is connected to the ground line. A connection point between the two resistors forming the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3. The collector terminal of the bipolar transistor S2 is connected to the control terminal ON of LSW3. The emitter terminal of the bipolar transistor S2 is connected to the ground line. The base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1. When the signal input to the control terminal ON becomes high level, the LSW3 outputs the voltage input to the input terminal VIN from the output terminal VOUT. The output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2. The MCU1 turns on the bipolar transistor S2 while the USB connection is not made. As a result, the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2, so that a low level signal is input to the control terminal ON of LSW3.
The bipolar transistor S2 connected to LSW3 is turned off by MCU1 when the USB connection is made. By turning off the bipolar transistor S2, the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3. As a result, the LSW 3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of LSW3 unless MCU1 turns off bipolar transistor S2.
　電源ＢＡＴの正極端子は、保護ＩＣ１０の電源端子ＶＤＤと、昇圧ＤＣ／ＤＣコンバータ９の入力端子ＶＩＮと、充電ＩＣ２の充電端子ｂａｔと、に接続されている。したがって、電源ＢＡＴの電源電圧ＶＢＡＴは、保護ＩＣ１０と、充電ＩＣ２と、昇圧ＤＣ／ＤＣコンバータ９とに供給される。電源ＢＡＴの負極端子には、抵抗器Ｒａと、ＭＯＳＦＥＴで構成されたスイッチＳａと、ＭＯＳＦＥＴで構成されたスイッチＳｂと、抵抗器Ｒｂと、がこの順に直列接続されている。抵抗器ＲａとスイッチＳａの接続点には、保護ＩＣ１０の電流検出端子ＣＳが接続されている。スイッチＳａとスイッチＳｂの各々の制御端子は、保護ＩＣ１０に接続されている。抵抗器Ｒｂの両端は、残量計ＩＣ１２に接続されている。 The positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V BAT of the power supply BAT is supplied to the protection IC 10 , the charging IC 2 and the step-up DC/DC converter 9 . A resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT. A current detection terminal CS of the protection IC 10 is connected to a connection point between the resistor Ra and the switch Sa. Control terminals of the switches Sa and Sb are connected to the protection IC 10 . Both ends of the resistor Rb are connected to the fuel gauge IC12.
　保護ＩＣ１０は、電流検出端子ＣＳに入力される電圧から、電源ＢＡＴの充放電時において抵抗器Ｒａに流れる電流値を取得し、この電流値が過大になった場合（過電流）に、スイッチＳａとスイッチＳｂの開閉制御を行って、電源ＢＡＴの充電又は放電を停止させることで、電源ＢＡＴの保護を図る。より具体的には、保護ＩＣ１０は、電源ＢＡＴの充電時に過大な電流値を取得した場合には、スイッチＳｂをオフすることで、電源ＢＡＴの充電を停止させる。保護ＩＣ１０は、電源ＢＡＴの放電時に過大な電流値を取得した場合には、スイッチＳａをオフすることで、電源ＢＡＴの放電を停止させる。また、保護ＩＣ１０は、電源端子ＶＤＤに入力される電圧から、電源ＢＡＴの電圧値が異常になった場合（過充電又は過電圧の場合）に、スイッチＳａとスイッチＳｂの開閉制御を行って、電源ＢＡＴの充電又は放電を停止させることで、電源ＢＡＴの保護を図る。より具体的には、保護ＩＣ１０は、電源ＢＡＴの過充電を検知した場合には、スイッチＳｂをオフすることで、電源ＢＡＴの充電を停止させる。保護ＩＣ１０は、電源ＢＡＴの過放電を検知した場合には、スイッチＳａをオフすることで、電源ＢＡＴの放電を停止させる。 The protection IC 10 acquires the value of the current flowing through the resistor Ra during charging and discharging of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), the switch Sa , the switch Sb is controlled to open and close to stop the charging or discharging of the power source BAT, thereby protecting the power source BAT. More specifically, when the protection IC 10 acquires an excessive current value while charging the power supply BAT, it stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value during discharging of the power supply BAT, the protection IC 10 stops discharging the power supply BAT by turning off the switch Sa. In addition, when the voltage value of the power supply BAT becomes abnormal from the voltage input to the power supply terminal VDD (in the case of overcharge or overvoltage), the protection IC 10 performs opening/closing control of the switch Sa and the switch Sb to The power supply BAT is protected by stopping the charging or discharging of BAT. More specifically, when the protection IC 10 detects that the power supply BAT is overcharged, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When detecting overdischarge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.
　電源ＢＡＴの近傍に配置されたサーミスタＴ１と接続されるコネクタには抵抗器Ｒｔ１が接続されている。抵抗器Ｒｔ１とサーミスタＴ１の直列回路は、グランドラインと、残量計ＩＣ１２のレギュレータ端子ＴＲＥＧとに接続されている。サーミスタＴ１と抵抗器Ｒｔ１の接続点は、残量計ＩＣ１２のサーミスタ端子ＴＨＭに接続されている。サーミスタＴ１は、温度の増加に従い抵抗値が増大するＰＴＣ（Positive Temperature Coefficient）サーミスタであってもよいし、温度の増加に従い抵抗値が減少するＮＴＣ（Negative Temperature Coefficient）サーミスタでもよい。 A resistor Rt1 is connected to a connector connected to the thermistor T1 arranged near the power supply BAT. A series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12. A connection point between the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the fuel gauge IC12. The thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.
　残量計ＩＣ１２は、抵抗器Ｒｂに流れる電流を検出し、検出した電流値に基づいて、電源ＢＡＴの残容量、充電状態を示すＳＯＣ（State Of Charge）、及び健全状態を示すＳＯＨ（State Of Health）等のバッテリ情報を導出する。残量計ＩＣ１２は、レギュレータ端子ＴＲＥＧに接続される内蔵レギュレータから、サーミスタＴ１と抵抗器Ｒｔ１の分圧回路に電圧を供給する。残量計ＩＣ１２は、この分圧回路によって分圧された電圧をサーミスタ端子ＴＨＭから取得し、この電圧に基づいて、電源ＢＡＴの温度に関する温度情報を取得する。残量計ＩＣ１２は、シリアル通信を行うための通信線ＬＮによってＭＣＵ１と接続されており、ＭＣＵ１と通信可能に構成されている。残量計ＩＣ１２は、導出したバッテリ情報と、取得した電源ＢＡＴの温度情報を、ＭＣＵ１からの要求に応じて、ＭＣＵ１に送信する。なお、シリアル通信を行うためには、データ送信用のデータラインや同期用のクロックラインなどの複数の信号線が必要になる。図１０－図１９では、簡略化のため、１本の信号線のみが図示されている点に留意されたい。 The fuel gauge IC 12 detects the current flowing through the resistor Rb, and based on the detected current value, indicates the remaining capacity of the power supply BAT, SOC (State Of Charge) indicating the state of charge, and SOH (State Of Charge) indicating the state of health. Health) and other battery information. The fuel gauge IC12 supplies a voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG. The fuel gauge IC 12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage. The fuel gauge IC12 is connected to the MCU1 via a communication line LN for serial communication, and is configured to be able to communicate with the MCU1. The fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1. Note that serial communication requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that only one signal line is shown in FIGS. 10-19 for simplicity.
　残量計ＩＣ１２は、通知端子１２ａを備えている。通知端子１２ａは、ＭＣＵ１の端子Ｐ６と、後述するダイオードＤ２のカソードと、に接続されている。残量計ＩＣ１２は、電源ＢＡＴの温度が過大になった等の異常を検出すると、通知端子１２ａからローレベルの信号を出力することで、その異常発生をＭＣＵ１に通知する。このローレベルの信号は、ダイオードＤ２を経由して、ＦＦ１７のＣＬＲ（￣）端子にも入力される。 The fuel gauge IC 12 has a notification terminal 12a. The notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of a diode D2, which will be described later. When the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it notifies the MCU 1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low level signal is also input to the CLR (~) terminal of the FF 17 via the diode D2.
　昇圧ＤＣ／ＤＣコンバータ９のスイッチング端子ＳＷには、リアクトルＬｃの一端が接続されている。このリアクトルＬｃの他端は昇圧ＤＣ／ＤＣコンバータ９の入力端子ＶＩＮに接続されている。昇圧ＤＣ／ＤＣコンバータ９は、スイッチング端子ＳＷに接続された内蔵トランジスタのオンオフ制御を行うことで、入力された電圧を昇圧して、出力端子ＶＯＵＴから出力する。なお、昇圧ＤＣ／ＤＣコンバータ９の入力端子ＶＩＮは、昇圧ＤＣ／ＤＣコンバータ９の高電位側の電源端子を構成している。昇圧ＤＣ／ＤＣコンバータ９は、イネーブル端子ＥＮに入力される信号がハイレベルとなっている場合に、昇圧動作を行う。ＵＳＢ接続されている状態においては、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮに入力される信号は、ＭＣＵ１によってローレベルに制御されてもよい。若しくは、ＵＳＢ接続されている状態においては、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮに入力される信号をＭＣＵ１が制御しないことで、イネーブル端子ＥＮの電位を不定にしてもよい。 One end of the reactor Lc is connected to the switching terminal SW of the step-up DC/DC converter 9 . The other end of this reactor Lc is connected to the input terminal VIN of the step-up DC/DC converter 9 . The step-up DC/DC converter 9 performs on/off control of the built-in transistor connected to the switching terminal SW to step up the input voltage and output it from the output terminal VOUT. The input terminal VIN of the step-up DC/DC converter 9 constitutes a power supply terminal of the step-up DC/DC converter 9 on the high potential side. The boost DC/DC converter 9 performs a boost operation when the signal input to the enable terminal EN is at high level. In the USB-connected state, the signal input to the enable terminal EN of the boost DC/DC converter 9 may be controlled to be low level by the MCU1. Alternatively, in the USB-connected state, the MCU 1 does not control the signal input to the enable terminal EN of the boost DC/DC converter 9, so that the potential of the enable terminal EN may be made indefinite.
　昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴには、Ｐチャネル型ＭＯＳＦＥＴにより構成されたスイッチＳ４のソース端子が接続されている。スイッチＳ４のゲート端子は、ＭＣＵ１の端子Ｐ１５と接続されている。スイッチＳ４のドレイン端子には、抵抗器Ｒｓの一端が接続されている。抵抗器Ｒｓの他端は、ヒータＨＴＲの一端と接続される正極側のヒータコネクタＣｎに接続されている。スイッチＳ４と抵抗器Ｒｓの接続点には、２つの抵抗器からなる分圧回路Ｐｂが接続されている。分圧回路Ｐｂを構成する２つの抵抗器の接続点は、ＭＣＵ１の端子Ｐ１８と接続されている。スイッチＳ４と抵抗器Ｒｓの接続点は、更に、オペアンプＯＰ１の正電源端子と接続されている。 The output terminal VOUT of the step-up DC/DC converter 9 is connected to the source terminal of the switch S4 composed of a P-channel MOSFET. The gate terminal of switch S4 is connected to terminal P15 of MCU1. One end of the resistor Rs is connected to the drain terminal of the switch S4. The other end of the resistor Rs is connected to a positive heater connector Cn connected to one end of the heater HTR. A voltage dividing circuit Pb consisting of two resistors is connected to the connection point between the switch S4 and the resistor Rs. A connection point of the two resistors forming the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1. A connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.
　昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴとスイッチＳ４のソース端子との接続ラインには、Ｐチャネル型ＭＯＳＦＥＴにより構成されたスイッチＳ３のソース端子が接続されている。スイッチＳ３のゲート端子は、ＭＣＵ１の端子Ｐ１６と接続されている。スイッチＳ３のドレイン端子は、抵抗器Ｒｓと正極側のヒータコネクタＣｎとの接続ラインに接続されている。このように、昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴとヒータコネクタＣｎの正極側との間には、スイッチＳ３を含む回路と、スイッチＳ４及び抵抗器Ｒｓを含む回路とが並列接続されている。スイッチＳ３を含む回路は、抵抗器を有さないため、スイッチＳ４及び抵抗器Ｒｓを含む回路よりも低抵抗の回路である。 A connection line between the output terminal VOUT of the step-up DC/DC converter 9 and the source terminal of the switch S4 is connected to the source terminal of the switch S3 composed of a P-channel MOSFET. The gate terminal of switch S3 is connected to terminal P16 of MCU1. A drain terminal of the switch S3 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side. Thus, a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC/DC converter 9 and the positive electrode side of the heater connector Cn. . Since the circuit including the switch S3 does not have a resistor, it has a lower resistance than the circuit including the switch S4 and the resistor Rs.
　オペアンプＯＰ１の非反転入力端子は、抵抗器Ｒｓと正極側のヒータコネクタＣｎとの接続ラインに接続されている。オペアンプＯＰ１の反転入力端子は、ヒータＨＴＲの他端と接続される負極側のヒータコネクタＣｎと、Ｎチャネル型ＭＯＳＦＥＴにより構成されたスイッチＳ６のドレイン端子と、に接続されている。スイッチＳ６のソース端子はグランドラインに接続されている。スイッチＳ６のゲート端子は、ＭＣＵ１の端子Ｐ１４と、ダイオードＤ４のアノードと、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮと、に接続されている。ダイオードＤ４のカソードは、ＦＦ１７のＱ端子と接続されている。オペアンプＯＰ１の出力端子には抵抗器Ｒ４の一端が接続されている。抵抗器Ｒ４の他端は、ＭＣＵ１の端子Ｐ９と、Ｎチャネル型ＭＯＳＦＥＴにより構成されたスイッチＳ５のドレイン端子と、に接続されている。スイッチＳ５のソース端子は、グランドラインに接続されている。スイッチＳ５のゲート端子は、抵抗器Ｒｓと正極側のヒータコネクタＣｎとの接続ラインに接続されている。 The non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side. The inverting input terminal of the operational amplifier OP1 is connected to the negative heater connector Cn connected to the other end of the heater HTR and to the drain terminal of the switch S6 composed of an N-channel MOSFET. The source terminal of switch S6 is connected to the ground line. A gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the step-up DC/DC converter 9. The cathode of diode D4 is connected to the Q terminal of FF17. One end of a resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. A source terminal of the switch S5 is connected to the ground line. A gate terminal of the switch S5 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
　充電ＩＣ２の入力端子ＶＢＵＳは、ＬＥＤ　Ｌ１～Ｌ８の各々のアノードに接続されている。ＬＥＤ　Ｌ１～Ｌ８の各々のカソードは、電流制限ための抵抗器を介して、ＭＣＵ１の制御端子ＰＤ１～ＰＤ８に接続されている。すなわち、入力端子ＶＢＵＳには、ＬＥＤ　Ｌ１～Ｌ８が並列接続されている。ＬＥＤ　Ｌ１～Ｌ８は、レセプタクルＲＣＰに接続されたＵＳＢケーブルから供給されるＵＳＢ電圧ＶＵＳＢと、電源ＢＡＴから充電ＩＣ２を経由して供給される電圧と、のそれぞれによって動作可能に構成されている。ＭＣＵ１には、制御端子ＰＤ１～制御端子ＰＤ８の各々とグランド端子ＧＮＤとに接続されたトランジスタ（スイッチング素子）が内蔵されている。ＭＣＵ１は、制御端子ＰＤ１と接続されたトランジスタをオンすることでＬＥＤ　Ｌ１に通電してこれを点灯させ、制御端子ＰＤ１と接続されたトランジスタをオフすることでＬＥＤ　Ｌ１を消灯させる。制御端子ＰＤ１と接続されたトランジスタのオンとオフを高速で切り替えることで、ＬＥＤ　Ｌ１の輝度や発光パターンを動的に制御できる。ＬＥＤ　Ｌ２～Ｌ８についても同様にＭＣＵ１によって点灯制御される。 The input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1-L8. The cathodes of the LEDs L1-L8 are connected to the control terminals PD1-PD8 of the MCU1 via current limiting resistors. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS. The LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2. The MCU 1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND. The MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to light it, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1. By switching on and off the transistor connected to the control terminal PD1 at high speed, the brightness and light emission pattern of the LED L1 can be dynamically controlled. LEDs L2 to L8 are similarly controlled by the MCU1.
　充電ＩＣ２は、入力端子ＶＢＵＳに入力されるＵＳＢ電圧ＶＵＳＢに基づいて電源ＢＡＴを充電する充電機能を備える。充電ＩＣ２は、不図示の端子や配線から、電源ＢＡＴの充電電流や充電電圧を取得し、これらに基づいて、電源ＢＡＴの充電制御（充電端子ｂａｔから電源ＢＡＴへの電力供給制御）を行う。また、充電ＩＣ２は、残量計ＩＣ１２からＭＣＵ１に送信された電源ＢＡＴの温度情報を、通信線ＬＮを利用したシリアル通信によってＭＣＵ１から取得し、充電制御に利用してもよい。 The charging IC2 has a charging function of charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS. The charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wiring (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Also, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 through serial communication using the communication line LN, and use it for charging control.
　充電ＩＣ２は、更に、ＶＢＡＴパワーパス機能と、ＯＴＧ機能とを備える。ＶＢＡＴパワーパス機能は、充電端子ｂａｔに入力される電源電圧ＶＢＡＴと略一致するシステム電源電圧Ｖｃｃ０を、出力端子ＳＹＳから出力する機能である。ＯＴＧ機能は、充電端子ｂａｔに入力される電源電圧ＶＢＡＴを昇圧して得られるシステム電源電圧Ｖｃｃ４を、入力端子ＶＢＵＳから出力する機能である。充電ＩＣ２のＯＴＧ機能のオンオフは、通信線ＬＮを利用したシリアル通信によって、ＭＣＵ１により制御される。なお、ＯＴＧ機能においては、充電端子ｂａｔに入力される電源電圧ＶＢＡＴを、入力端子ＶＢＵＳからそのまま出力してもよい。この場合において、電源電圧ＶＢＡＴとシステム電源電圧Ｖｃｃ４は略一致する。 The charging IC2 further comprises a V BAT power pass function and an OTG function. The V BAT power pass function is a function of outputting from the output terminal SYS a system power supply voltage Vcc0 substantially matching the power supply voltage V BAT input to the charging terminal bat. The OTG function is a function for outputting from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat. ON/OFF of the OTG function of the charging IC 2 is controlled by the MCU 1 through serial communication using the communication line LN. In addition, in the OTG function, the power supply voltage V BAT input to the charging terminal bat may be directly output from the input terminal VBUS. In this case, power supply voltage VBAT and system power supply voltage Vcc4 are substantially the same.
　充電ＩＣ２の出力端子ＳＹＳは、昇降圧ＤＣ／ＤＣコンバータ８の入力端子ＶＩＮに接続されている。充電ＩＣ２のスイッチング端子ＳＷにはリアクトルＬａの一端が接続されている。リアクトルＬａの他端は、充電ＩＣ２の出力端子ＳＹＳに接続されている。充電ＩＣ２の充電イネーブル端子ＣＥ（￣）は、抵抗器を介して、ＭＣＵ１の端子Ｐ２２に接続されている。更に、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）には、バイポーラトランジスタＳ１のコレクタ端子が接続されている。バイポーラトランジスタＳ１のエミッタ端子は、後述のＬＳＷ４の出力端子ＶＯＵＴに接続されている。バイポーラトランジスタＳ１のベース端子は、ＦＦ１７のＱ端子に接続されている。更に、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）には、抵抗器Ｒｃの一端が接続されている。抵抗器Ｒｃの他端は、ＬＳＷ４の出力端子ＶＯＵＴに接続されている。 The output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the step-up/step-down DC/DC converter 8 . One end of a reactor La is connected to the switching terminal SW of the charging IC2. The other end of the reactor La is connected to the output terminal SYS of the charging IC2. A charge enable terminal CE (~) of the charge IC2 is connected to a terminal P22 of the MCU1 via a resistor. Furthermore, the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE (~) of the charge IC2. The emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 which will be described later. The base terminal of bipolar transistor S1 is connected to the Q terminal of FF17. Furthermore, one end of a resistor Rc is connected to the charge enable terminal CE (~) of the charge IC2. The other end of the resistor Rc is connected to the output terminal VOUT of LSW4.
　昇降圧ＤＣ／ＤＣコンバータ８の入力端子ＶＩＮとイネーブル端子ＥＮには抵抗器が接続されている。充電ＩＣ２の出力端子ＳＹＳから、昇降圧ＤＣ／ＤＣコンバータ８の入力端子ＶＩＮにシステム電源電圧Ｖｃｃ０が入力されることで、昇降圧ＤＣ／ＤＣコンバータ８のイネーブル端子ＥＮに入力される信号はハイレベルとなり、昇降圧ＤＣ／ＤＣコンバータ８は昇圧動作又は降圧動作を開始する。昇降圧ＤＣ／ＤＣコンバータ８は、リアクトルＬｂに接続された内蔵トランジスタのスイッチング制御により、入力端子ＶＩＮに入力されたシステム電源電圧Ｖｃｃ０を昇圧又は降圧してシステム電源電圧Ｖｃｃ１を生成し、出力端子ＶＯＵＴから出力する。昇降圧ＤＣ／ＤＣコンバータ８の出力端子ＶＯＵＴは、昇降圧ＤＣ／ＤＣコンバータ８のフィードバック端子ＦＢと、ＬＳＷ４の入力端子ＶＩＮと、スイッチドライバ７の入力端子ＶＩＮと、ＦＦ１６の電源端子ＶＣＣ及びＤ端子と、に接続されている。昇降圧ＤＣ／ＤＣコンバータ８の出力端子ＶＯＵＴから出力されるシステム電源電圧Ｖｃｃ１が供給される配線を電源ラインＰＬ１と記載する。 A resistor is connected to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 . By inputting the system power supply voltage Vcc0 from the output terminal SYS of the charging IC 2 to the input terminal VIN of the step-up/step-down DC/DC converter 8, the signal input to the enable terminal EN of the step-up/step-down DC/DC converter 8 is at a high level. Then, the step-up/step-down DC/DC converter 8 starts step-up operation or step-down operation. The step-up/step-down DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1, and the output terminal VOUT. Output from The output terminal VOUT of the buck-boost DC/DC converter 8 includes the feedback terminal FB of the buck-boost DC/DC converter 8, the input terminal VIN of the LSW 4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF 16. and connected to A wiring to which system power supply voltage Vcc1 output from output terminal VOUT of step-up/step-down DC/DC converter 8 is supplied is referred to as power supply line PL1.
　ＬＳＷ４は、制御端子ＯＮに入力される信号がハイレベルになると、入力端子ＶＩＮに入力されているシステム電源電圧Ｖｃｃ１を出力端子ＶＯＵＴから出力する。ＬＳＷ４の制御端子ＯＮと電源ラインＰＬ１は、抵抗器を介して接続されている。このため、電源ラインＰＬ１にシステム電源電圧Ｖｃｃ１が供給されることで、ＬＳＷ４の制御端子ＯＮにはハイレベルの信号が入力される。ＬＳＷ４が出力する電圧は、配線抵抗等を無視すればシステム電源電圧Ｖｃｃ１と同一であるが、システム電源電圧Ｖｃｃ１と区別するために、ＬＳＷ４の出力端子ＶＯＵＴから出力される電圧を、以下ではシステム電源電圧Ｖｃｃ２と記載する。 When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT. The control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high level signal is input to the control terminal ON of the LSW4. The voltage output from LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored. Described as voltage Vcc2.
　ＬＳＷ４の出力端子ＶＯＵＴは、ＭＣＵ１の電源端子ＶＤＤと、ＬＳＷ５の入力端子ＶＩＮと、残量計ＩＣ１２の電源端子ＶＤＤと、ＲＯＭ６の電源端子ＶＣＣと、バイポーラトランジスタＳ１のエミッタ端子と、抵抗器Ｒｃと、ＦＦ１７の電源端子ＶＣＣと、に接続されている。ＬＳＷ４の出力端子ＶＯＵＴから出力されるシステム電源電圧Ｖｃｃ２が供給される配線を電源ラインＰＬ２と記載する。 The output terminal VOUT of the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , and the power supply terminal VCC of the FF 17 . A wiring to which system power supply voltage Vcc2 output from output terminal VOUT of LSW4 is supplied is referred to as power supply line PL2.
　ＬＳＷ５は、制御端子ＯＮに入力される信号がハイレベルになると、入力端子ＶＩＮに入力されているシステム電源電圧Ｖｃｃ２を出力端子ＶＯＵＴから出力する。ＬＳＷ５の制御端子ＯＮは、ＭＣＵ１の端子Ｐ２３と接続されている。ＬＳＷ５が出力する電圧は、配線抵抗等を無視すればシステム電源電圧Ｖｃｃ２と同一であるが、システム電源電圧Ｖｃｃ２と区別するために、ＬＳＷ５の出力端子ＶＯＵＴから出力される電圧を、以下ではシステム電源電圧Ｖｃｃ３と記載する。ＬＳＷ５の出力端子ＶＯＵＴから出力されるシステム電源電圧Ｖｃｃ３が供給される配線を電源ラインＰＬ３と記載する。 When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT. A control terminal ON of LSW5 is connected to terminal P23 of MCU1. The voltage output from LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored. Described as voltage Vcc3. A wiring to which system power supply voltage Vcc3 output from output terminal VOUT of LSW5 is supplied is referred to as power supply line PL3.
　電源ラインＰＬ３には、サーミスタＴ２と抵抗器Ｒｔ２の直列回路が接続され、抵抗器Ｒｔ２はグランドラインに接続されている。サーミスタＴ２と抵抗器Ｒｔ２は分圧回路を構成しており、これらの接続点は、ＭＣＵ１の端子Ｐ２１と接続されている。ＭＣＵ１は、端子Ｐ２１に入力される電圧に基づいて、サーミスタＴ２の温度変動（抵抗値変動）を検出し、その温度変動量によって、パフ動作の有無を判定する。 A series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line. The thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of the MCU1. The MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the amount of temperature variation.
　電源ラインＰＬ３には、サーミスタＴ３と抵抗器Ｒｔ３の直列回路が接続され、抵抗器Ｒｔ３はグランドラインに接続されている。サーミスタＴ３と抵抗器Ｒｔ３は分圧回路を構成しており、これらの接続点は、ＭＣＵ１の端子Ｐ１３と、オペアンプＯＰ２の反転入力端子と、に接続されている。ＭＣＵ１は、端子Ｐ１３に入力される電圧に基づいて、サーミスタＴ３の温度（ヒータＨＴＲの温度に相当）を検出する。 A series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line. The thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of the MCU1 and the inverting input terminal of the operational amplifier OP2. The MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.
　電源ラインＰＬ３には、サーミスタＴ４と抵抗器Ｒｔ４の直列回路が接続され、抵抗器Ｒｔ４はグランドラインに接続されている。サーミスタＴ４と抵抗器Ｒｔ４は分圧回路を構成しており、これらの接続点は、ＭＣＵ１の端子Ｐ１２と、オペアンプＯＰ３の反転入力端子と、に接続されている。ＭＣＵ１は、端子Ｐ１２に入力される電圧に基づいて、サーミスタＴ４の温度（ケース１１０の温度に相当）を検出する。 A series circuit of a thermistor T4 and a resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line. The thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and the connection point between them is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3. The MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.
　電源ラインＰＬ２には、ＭＯＳＦＥＴにより構成されたスイッチＳ７のソース端子が接続されている。スイッチＳ７のゲート端子は、ＭＣＵ１の端子Ｐ２０に接続されている。スイッチＳ７のドレイン端子は、振動モータＭが接続される一対のコネクタの一方に接続されている。この一対のコネクタの他方はグランドラインに接続されている。ＭＣＵ１は、端子Ｐ２０の電位を操作することでスイッチＳ７の開閉を制御し、振動モータＭを特定のパターンで振動させることができる。スイッチＳ７に代えて、専用のドライバＩＣを用いてもよい。 A source terminal of a switch S7 composed of a MOSFET is connected to the power supply line PL2. The gate terminal of switch S7 is connected to terminal P20 of MCU1. A drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line. The MCU1 can control the opening/closing of the switch S7 by manipulating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern. A dedicated driver IC may be used instead of the switch S7.
　電源ラインＰＬ２には、オペアンプＯＰ２の正電源端子と、オペアンプＯＰ２の非反転入力端子に接続されている分圧回路Ｐｄ（２つの抵抗器の直列回路）と、が接続されている。分圧回路Ｐｄを構成する２つの抵抗器の接続点は、オペアンプＯＰ２の非反転入力端子に接続されている。オペアンプＯＰ２は、ヒータＨＴＲの温度に応じた信号（サーミスタＴ３の抵抗値に応じた信号）を出力する。本実施形態では、サーミスタＴ３としてＮＴＣ特性を持つものを用いているため、ヒータＨＴＲの温度（サーミスタＴ３の温度）が高いほど、オペアンプＯＰ２の出力電圧は低くなる。これは、オペアンプＯＰ２の負電源端子はグランドラインへ接続されており、オペアンプＯＰ２の反転入力端子に入力される電圧値（サーミスタＴ３と抵抗器Ｒｔ３による分圧値）が、オペアンプＯＰ２の非反転入力端子に入力される電圧値（分圧回路Ｐｄによる分圧値）より高くなると、オペアンプＯＰ２の出力電圧の値は、グランド電位の値と略等しくなるためである。つまり、ヒータＨＴＲの温度（サーミスタＴ３の温度）が高温になると、オペアンプＯＰ２の出力電圧はローレベルになる。
　なお、サーミスタＴ３としてＰＴＣ特性を持つものを用いる場合には、オペアンプＯＰ２の非反転入力端子に、サーミスタＴ３及び抵抗器Ｒｔ３の分圧回路の出力を接続し、オペアンプＯＰ２の反転入力端子に、分圧回路Ｐｄの出力を接続すればよい。 A positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power supply line PL2. A connection point between the two resistors forming the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2. The operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (signal corresponding to the resistance value of the thermistor T3). In this embodiment, since the thermistor T3 has the NTC characteristic, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2. This is because the negative power supply terminal of operational amplifier OP2 is connected to the ground line, and the voltage value input to the inverting input terminal of operational amplifier OP2 (divided voltage value by thermistor T3 and resistor Rt3) is the non-inverting input of operational amplifier OP2. This is because the value of the output voltage of the operational amplifier OP2 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (divided voltage value by the voltage dividing circuit Pd). That is, when the temperature of the heater HTR (the temperature of the thermistor T3) becomes high, the output voltage of the operational amplifier OP2 becomes low level.
When a thermistor T3 having a PTC characteristic is used, the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 is connected to the non-inverting input terminal of the operational amplifier OP2, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP2. The output of the pressure circuit Pd may be connected.
　電源ラインＰＬ２には、オペアンプＯＰ３の正電源端子と、オペアンプＯＰ３の非反転入力端子に接続されている分圧回路Ｐｅ（２つの抵抗器の直列回路）と、が接続されている。分圧回路Ｐｅを構成する２つの抵抗器の接続点は、オペアンプＯＰ３の非反転入力端子に接続されている。オペアンプＯＰ３は、ケース１１０の温度に応じた信号（サーミスタＴ４の抵抗値に応じた信号）を出力する。本実施形態では、サーミスタＴ４としてＮＴＣ特性を持つものを用いているため、ケース１１０の温度が高いほど、オペアンプＯＰ３の出力電圧は低くなる。これは、オペアンプＯＰ３の負電源端子はグランドラインへ接続されており、オペアンプＯＰ３の反転入力端子に入力される電圧値（サーミスタＴ４と抵抗器Ｒｔ４による分圧値）が、オペアンプＯＰ３の非反転入力端子に入力される電圧値（分圧回路Ｐｅによる分圧値）より高くなると、オペアンプＯＰ３の出力電圧の値は、グランド電位の値と略等しくなるためである。つまり、サーミスタＴ４の温度が高温になると、オペアンプＯＰ３の出力電圧が、ローレベルになる。
　なお、サーミスタＴ４としてＰＴＣ特性を持つものを用いる場合には、オペアンプＯＰ３の非反転入力端子に、サーミスタＴ４及び抵抗器Ｒｔ４の分圧回路の出力を接続し、オペアンプＯＰ３の反転入力端子に、分圧回路Ｐｅの出力を接続すればよい。 A positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2. A connection point between the two resistors forming the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3. The operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4). In this embodiment, the thermistor T4 having the NTC characteristic is used, so the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3. This is because the negative power supply terminal of operational amplifier OP3 is connected to the ground line, and the voltage value input to the inverting input terminal of operational amplifier OP3 (divided voltage value by thermistor T4 and resistor Rt4) is the non-inverting input of operational amplifier OP3. This is because the value of the output voltage of the operational amplifier OP3 becomes substantially equal to the value of the ground potential when it becomes higher than the voltage value input to the terminal (divided voltage value by the voltage dividing circuit Pe). That is, when the temperature of the thermistor T4 becomes high, the output voltage of the operational amplifier OP3 becomes low level.
When a thermistor T4 having a PTC characteristic is used, the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 is connected to the non-inverting input terminal of the operational amplifier OP3, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP3. The output of the pressure circuit Pe may be connected.
　オペアンプＯＰ２の出力端子には抵抗器Ｒ１が接続されている。抵抗器Ｒ１には、ダイオードＤ１のカソードが接続されている。ダイオードＤ１のアノードは、オペアンプＯＰ３の出力端子と、ＦＦ１７のＤ端子と、ＦＦ１７のＣＬＲ（￣）端子と、に接続されている。抵抗器Ｒ１とダイオードＤ１との接続ラインには、電源ラインＰＬ１に接続された抵抗器Ｒ２が接続されている。また、この接続ラインには、ＦＦ１６のＣＬＲ（￣）端子が接続されている。 A resistor R1 is connected to the output terminal of the operational amplifier OP2. A cathode of a diode D1 is connected to the resistor R1. The anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR (~) terminal of the FF17. A connection line between the resistor R1 and the diode D1 is connected to a resistor R2 connected to the power supply line PL1. Also, the CLR (~) terminal of the FF 16 is connected to this connection line.
　ダイオードＤ１のアノード及びオペアンプＯＰ３の出力端子の接続点と、ＦＦ１７のＤ端子との接続ラインには、抵抗器Ｒ３の一端が接続されている。抵抗器Ｒ３の他端は電源ラインＰＬ２に接続されている。更に、この接続ラインには、残量計ＩＣ１２の通知端子１２ａと接続されているダイオードＤ２のアノードと、ダイオードＤ３のアノードと、ＦＦ１７のＣＬＲ（￣）端子と、が接続されている。ダイオードＤ３のカソードは、ＭＣＵ１の端子Ｐ５に接続されている。 One end of a resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17. The other end of resistor R3 is connected to power supply line PL2. Furthermore, the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR (~) terminal of the FF 17 are connected to this connection line. The cathode of diode D3 is connected to terminal P5 of MCU1.
　ＦＦ１６は、ヒータＨＴＲの温度が過大となり、オペアンプＯＰ２から出力される信号が小さくなって、ＣＬＲ（￣）端子に入力される信号がローレベルになると、Ｑ（￣）端子からハイレベルの信号をＭＣＵ１の端子Ｐ１１に入力する。ＦＦ１６のＤ端子には電源ラインＰＬ１からハイレベルのシステム電源電圧Ｖｃｃ１が供給されている。このため、ＦＦ１６では、負論理で動作するＣＬＲ（￣）端子に入力される信号がローレベルにならない限り、Ｑ（￣）端子からはローレベルの信号が出力され続ける。 When the temperature of the heater HTR becomes excessive and the signal output from the operational amplifier OP2 becomes low and the signal input to the CLR (~) terminal becomes low level, the FF16 outputs a high level signal from the Q (~) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in the FF 16, a low level signal continues to be output from the Q (~) terminal unless the signal input to the CLR (~) terminal operating in negative logic becomes low level.
　ＦＦ１７のＣＬＲ（￣）端子に入力される信号は、ヒータＨＴＲの温度が過大となった場合と、ケース１１０の温度が過大となった場合と、残量計ＩＣ１２の通知端子１２ａから異常検出を示すローレベルの信号が出力された場合のいずれかの場合に、ローレベルとなる。ＦＦ１７は、ＣＬＲ（￣）端子に入力される信号がローレベルになると、Ｑ端子からローレベルの信号を出力する。このローレベルの信号は、ＭＣＵ１の端子Ｐ１０と、スイッチＳ６のゲート端子と、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮと、充電ＩＣ２に接続されたバイポーラトランジスタＳ１のベース端子と、にそれぞれ入力される。スイッチＳ６のゲート端子にローレベルの信号が入力されると、スイッチＳ６を構成するＮチャネル型ＭＯＳＦＥＴのゲート－ソース間電圧が閾値電圧未満となるため、スイッチＳ６がオフになる。昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮにローレベルの信号が入力されると、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮは正論理であるため、昇圧動作が停止する。バイポーラトランジスタＳ１のベース端子にローレベルの信号が入力されると、バイポーラトランジスタＳ１がオンになる（コレクタ端子から増幅された電流が出力される）。バイポーラトランジスタＳ１がオンになると、充電ＩＣ２のＣＥ（￣）端子にバイポーラトランジスタＳ１を介してハイレベルのシステム電源電圧Ｖｃｃ２が入力される。充電ＩＣ２のＣＥ（￣）端子は負論理であるため、電源ＢＡＴの充電が停止される。これらにより、ヒータＨＴＲの加熱と電源ＢＡＴの充電が停止される。なお、ＭＣＵ１が端子Ｐ２２から充電ＩＣ２の充電イネーブル端子ＣＥ（￣）に対してローレベルのイネーブル信号を出力しようとしても、バイポーラトランジスタＳ１がオンされると、増幅された電流が、コレクタ端子からＭＣＵ１の端子Ｐ２２および充電ＩＣ２の充電イネーブル端子ＣＥ（￣）に入力される。これにより、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）にはハイレベルの信号が入力される点に留意されたい。 The signal input to the CLR (~) terminal of the FF 17 is when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and when an abnormality is detected from the notification terminal 12a of the fuel gauge IC 12. When the low-level signal shown is output, it becomes low-level. The FF 17 outputs a low level signal from the Q terminal when the signal input to the CLR (~) terminal becomes low level. This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC/DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. be. When a low level signal is input to the gate terminal of the switch S6, the gate-source voltage of the N-channel MOSFET constituting the switch S6 becomes less than the threshold voltage, so the switch S6 is turned off. When a low level signal is input to the enable terminal EN of the boost DC/DC converter 9, the boost operation stops because the enable terminal EN of the boost DC/DC converter 9 is positive logic. When a low level signal is input to the base terminal of the bipolar transistor S1, the bipolar transistor S1 is turned on (amplified current is output from the collector terminal). When the bipolar transistor S1 is turned on, the high level system power supply voltage Vcc2 is input to the CE (~) terminal of the charging IC2 through the bipolar transistor S1. Since the CE (~) terminal of the charging IC2 is of negative logic, the charging of the power source BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 attempts to output a low-level enable signal from the terminal P22 to the charge enable terminal CE (~) of the charging IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1 and the charge enable terminal CE (~) of the charge IC2. Note that a high level signal is input to the charge enable terminal CE (~) of the charge IC2.
　ＦＦ１７のＤ端子には電源ラインＰＬ２からハイレベルのシステム電源電圧Ｖｃｃ２が供給されている。このため、ＦＦ１７では、負論理で動作するＣＬＲ（￣）端子に入力される信号がローレベルにならない限り、Ｑ端子からハイレベルの信号が出力され続ける。オペアンプＯＰ３の出力端子からローレベルの信号が出力されると、オペアンプＯＰ２の出力端子から出力される信号のレベルに拠らず、ＦＦ１７のＣＬＲ（￣）端子にはローレベルの信号が入力される。オペアンプＯＰ２の出力端子からハイレベルの信号が出力される場合には、オペアンプＯＰ３の出力端子から出力されるローレベルの信号は、ダイオードＤ１によってこのハイレベルの信号の影響を受けない点に留意されたい。また、オペアンプＯＰ２の出力端子からローレベルの信号が出力される場合には、オペアンプＯＰ３の出力端子からハイレベルの信号が出力されたとしても、ダイオードＤ１を介してこのハイレベルの信号はローレベルの信号に置き換わる。 A high-level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, the FF 17 continues to output a high level signal from the Q terminal unless the signal input to the CLR (~) terminal operating in negative logic becomes low level. When a low level signal is output from the output terminal of the operational amplifier OP3, a low level signal is input to the CLR (~) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2. . Note that when a high level signal is output from the output terminal of the operational amplifier OP2, the low level signal output from the output terminal of the operational amplifier OP3 is not affected by the high level signal due to the diode D1. sea bream. Further, when a low level signal is output from the output terminal of the operational amplifier OP2, even if a high level signal is output from the output terminal of the operational amplifier OP3, the high level signal is passed through the diode D1. signal.
　電源ラインＰＬ２は、ＭＣＵ搭載基板１６１からＬＥＤ搭載基板１６３及びホールＩＣ搭載基板１６４側に向けて更に分岐している。この分岐した電源ラインＰＬ２には、ホールＩＣ１３の電源端子ＶＤＤと、通信ＩＣ１５の電源端子ＶＣＣと、ホールＩＣ１４の電源端子ＶＤＤと、が接続されている。 The power line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164 side. The power terminal VDD of the hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the hall IC 14 are connected to the branched power line PL2.
　ホールＩＣ１３の出力端子ＯＵＴは、ＭＣＵ１の端子Ｐ３と、スイッチドライバ７の端子ＳＷ２と、に接続されている。アウターパネル１１５が外れると、ホールＩＣ１３の出力端子ＯＵＴからローレベルの信号が出力される。ＭＣＵ１は、端子Ｐ３に入力される信号により、アウターパネル１１５の装着有無を判定する。 The output terminal OUT of the Hall IC 13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the Hall IC 13 . The MCU 1 determines whether or not the outer panel 115 is attached based on the signal input to the terminal P3.
　ＬＥＤ搭載基板１６３には、操作スイッチＯＰＳと接続された直列回路（抵抗器とコンデンサの直列回路）が設けられている。この直列回路は、電源ラインＰＬ２に接続されている。この直列回路の抵抗器とコンデンサの接続点は、ＭＣＵ１の端子Ｐ４と、操作スイッチＯＰＳと、スイッチドライバ７の端子ＳＷ１と、に接続されている。操作スイッチＯＰＳが押下されていない状態では、操作スイッチＯＰＳは導通せず、ＭＣＵ１の端子Ｐ４とスイッチドライバ７の端子ＳＷ１にそれぞれ入力される信号は、システム電源電圧Ｖｃｃ２によりハイレベルとなる。操作スイッチＯＰＳが押下されて操作スイッチＯＰＳが導通状態になると、ＭＣＵ１の端子Ｐ４とスイッチドライバ７の端子ＳＷ１にそれぞれ入力される信号は、グランドラインへ接続されるためローレベルとなる。ＭＣＵ１は、端子Ｐ４に入力される信号により、操作スイッチＯＰＳの操作を検出する。 A series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting board 163 . This series circuit is connected to power supply line PL2. A connection point between the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7. FIG. When the operation switch OPS is not pressed, the operation switch OPS is not conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are at a high level due to the system power supply voltage Vcc2. When the operation switch OPS is pressed and turned on, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground line, and thus become low level. The MCU1 detects the operation of the operation switch OPS from the signal input to the terminal P4.
　スイッチドライバ７には、リセット入力端子ＲＳＴＢが設けられている。リセット入力端子ＲＳＴＢは、ＬＳＷ４の制御端子ＯＮに接続されている。スイッチドライバ７は、端子ＳＷ１と端子ＳＷ２に入力される信号のレベルがいずれもローレベルとなった場合（アウターパネル１１５が外されており、且つ、操作スイッチＯＰＳが押下された状態）には、リセット入力端子ＲＳＴＢからローレベルの信号を出力することで、ＬＳＷ４の出力動作を停止させる。つまり、本来はアウターパネル１１５の押圧部１１７を介して押し下げられる操作スイッチＯＰＳが、アウターパネル１１５が外れた状態でユーザによって直接押し下げられると、スイッチドライバ７の端子ＳＷ１と端子ＳＷ２に入力される信号のレベルがいずれもローレベルになる。 The switch driver 7 is provided with a reset input terminal RSTB. The reset input terminal RSTB is connected to the control terminal ON of LSW4. When the levels of the signals input to the terminals SW1 and SW2 are both low (the outer panel 115 is removed and the operation switch OPS is pressed), the switch driver 7 By outputting a low level signal from the reset input terminal RSTB, the output operation of LSW4 is stopped. In other words, when the operation switch OPS, which is originally pushed down via the pressing portion 117 of the outer panel 115, is directly pushed down by the user with the outer panel 115 removed, the signal is input to the terminals SW1 and SW2 of the switch driver 7. become low level.
＜吸引器の動作モード毎の動作＞
　以下、図１３～図１９を参照して、図１０に示す電気回路の動作を説明する。図１３は、スリープモードにおける電気回路の動作を説明するための図である。図１４は、アクティブモードにおける電気回路の動作を説明するための図である。図１５は、加熱初期設定モードにおける電気回路の動作を説明するための図である。図１６は、加熱モードにおけるヒータＨＴＲの加熱時の電気回路の動作を説明するための図である。図１７は、加熱モードにおけるヒータＨＴＲの温度検出時の電気回路の動作を説明するための図である。図１８は、充電モードにおける電気回路の動作を説明するための図である。図１９は、ＭＣＵ１のリセット（再起動）時の電気回路の動作を説明するための図である。図１３～図１９の各々において、チップ化された電子部品の端子のうち、破線の楕円で囲まれた端子は、電源電圧ＶＢＡＴ、ＵＳＢ電圧ＶＵＳＢ、及びシステム電源電圧等の入力又は出力がなされている端子を示している。 <Operation for each operating mode of the aspirator>
The operation of the electric circuit shown in FIG. 10 will be described below with reference to FIGS. 13 to 19. FIG. FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode. FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode. FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode. FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode. FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode. FIG. 18 is a diagram for explaining the operation of the electric circuit in charging mode. FIG. 19 is a diagram for explaining the operation of the electric circuit when the MCU 1 is reset (restarted). In each of FIGS. 13 to 19, among the terminals of the chipped electronic component, the terminals surrounded by dashed ellipses have inputs or outputs such as the power supply voltage V BAT , the USB voltage V USB , and the system power supply voltage. It shows the terminals that have been made.
　いずれの動作モードにおいても、電源電圧ＶＢＡＴは、保護ＩＣ１０の電源端子ＶＤＤと、昇圧ＤＣ／ＤＣコンバータ９の入力端子ＶＩＮと、充電ＩＣ２の充電端子ｂａｔに入力されている。 In any operation mode, the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2. FIG.
＜スリープモード：図１３＞
　ＭＣＵ１は、充電ＩＣ２のＶＢＡＴパワーパス機能を有効とし、ＯＴＧ機能と充電機能を無効とする。充電ＩＣ２の入力端子ＶＢＵＳにＵＳＢ電圧ＶＵＳＢが入力されないことで、充電ＩＣ２のＶＢＡＴパワーパス機能は有効になる。通信線ＬＮからＯＴＧ機能を有効にするための信号がＭＣＵ１から充電ＩＣ２へ出力されないため、ＯＴＧ機能は無効になる。このため、充電ＩＣ２は、充電端子ｂａｔに入力された電源電圧ＶＢＡＴからシステム電源電圧Ｖｃｃ０を生成して、出力端子ＳＹＳから出力する。出力端子ＳＹＳから出力されたシステム電源電圧Ｖｃｃ０は、昇降圧ＤＣ／ＤＣコンバータ８の入力端子ＶＩＮ及びイネーブル端子ＥＮに入力される。昇降圧ＤＣ／ＤＣコンバータ８は、正論理であるイネーブル端子ＥＮにハイレベルのシステム電源電圧Ｖｃｃ０が入力されることでイネーブルとなり、システム電源電圧Ｖｃｃ０からシステム電源電圧Ｖｃｃ１を生成して、出力端子ＶＯＵＴから出力する。昇降圧ＤＣ／ＤＣコンバータ８の出力端子ＶＯＵＴから出力されたシステム電源電圧Ｖｃｃ１は、ＬＳＷ４の入力端子ＶＩＮと、ＬＳＷ４の制御端子ＯＮと、スイッチドライバ７の入力端子ＶＩＮと、ＦＦ１６の電源端子ＶＣＣ及びＤ端子と、にそれぞれ供給される。 <Sleep mode: Fig. 13>
MCU1 enables the V BAT power pass function of charging IC2 and disables the OTG function and charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC2, the VBAT power pass function of the charging IC2 is enabled. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function is disabled. Therefore, the charging IC2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat, and outputs it from the output terminal SYS. The system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 . The buck-boost DC/DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to an enable terminal EN of positive logic, generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it to an output terminal VOUT. Output from The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC/DC converter 8 is applied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal and , respectively.
　ＬＳＷ４は、制御端子ＯＮにシステム電源電圧Ｖｃｃ１が入力されることで、入力端子ＶＩＮに入力されたシステム電源電圧Ｖｃｃ１を、出力端子ＶＯＵＴからシステム電源電圧Ｖｃｃ２として出力する。ＬＳＷ４から出力されたシステム電源電圧Ｖｃｃ２は、ＭＣＵ１の電源端子ＶＤＤと、ＬＳＷ５の入力端子ＶＩＮと、ホールＩＣ１３の電源端子ＶＤＤと、通信ＩＣ１５の電源端子ＶＣＣと、ホールＩＣ１４の電源端子ＶＤＤと、に入力される。更に、システム電源電圧Ｖｃｃ２は、残量計ＩＣ１２の電源端子ＶＤＤと、ＲＯＭ６の電源端子ＶＣＣと、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）に接続された抵抗器Ｒｃ及びバイポーラトランジスタＳ１と、ＦＦ１７の電源端子ＶＣＣと、オペアンプＯＰ３の正電源端子と、分圧回路Ｐｅと、オペアンプＯＰ２の正電源端子と、分圧回路Ｐｄと、にそれぞれ供給される。充電ＩＣ２に接続されているバイポーラトランジスタＳ１は、ＦＦ１７のＱ端子からローレベルの信号が出力されない限りはオフとなっている。そのため、ＬＳＷ４で生成されたシステム電源電圧Ｖｃｃ２は、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）にも入力される。充電ＩＣ２の充電イネーブル端子ＣＥ（￣）は負論理のため、この状態では、充電ＩＣ２による充電機能はオフとなる。 When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT. The system power supply voltage Vcc2 output from the LSW4 is applied to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14. is entered. Furthermore, the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE (~) of the charging IC2, and the FF17. They are supplied to the power supply terminal VCC, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd. The bipolar transistor S1 connected to the charging IC2 is off unless a low level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE (~) of the charging IC2. Since the charge enable terminal CE (~) of the charge IC2 is of negative logic, the charge function of the charge IC2 is turned off in this state.
　このように、スリープモードにおいては、ＬＳＷ５はシステム電源電圧Ｖｃｃ３の出力を停止しているため、電源ラインＰＬ３に接続される電子部品への電力供給は停止される。また、スリープモードにおいては、充電ＩＣ２のＯＴＧ機能は停止しているため、ＬＥＤ　Ｌ１～Ｌ８への電力供給は停止される。 Thus, in the sleep mode, LSW 5 stops outputting system power supply voltage Vcc3, so power supply to electronic components connected to power supply line PL3 is stopped. Also, in the sleep mode, the OTG function of the charging IC 2 is stopped, so power supply to the LEDs L1 to L8 is stopped.
＜アクティブモード：図１４＞
　ＭＣＵ１は、図１３のスリープモードの状態から、端子Ｐ８に入力される信号がハイレベルとなり、スライダ１１９が開いたことを検出すると、端子Ｐ２３からＬＳＷ５の制御端子ＯＮにハイレベルの信号を入力する。これにより、ＬＳＷ５は入力端子ＶＩＮに入力されているシステム電源電圧Ｖｃｃ２を、システム電源電圧Ｖｃｃ３として、出力端子ＶＯＵＴから出力する。ＬＳＷ５の出力端子ＶＯＵＴから出力されたシステム電源電圧Ｖｃｃ３は、サーミスタＴ２と、サーミスタＴ３と、サーミスタＴ４と、に供給される。 <Active mode: Fig. 14>
When the MCU 1 detects that the signal input to the terminal P8 becomes high level from the sleep mode state of FIG. 13 and the slider 119 is opened, it inputs a high level signal from the terminal P23 to the control terminal ON of the LSW5. . As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT as the system power supply voltage Vcc3. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
　更に、ＭＣＵ１は、スライダ１１９が開いたことを検出すると、通信線ＬＮを介して、充電ＩＣ２のＯＴＧ機能を有効化する。これにより、充電ＩＣ２は、充電端子ｂａｔから入力された電源電圧ＶＢＡＴを昇圧して得られるシステム電源電圧Ｖｃｃ４を、入力端子ＶＢＵＳから出力する。入力端子ＶＢＵＳから出力されたシステム電源電圧Ｖｃｃ４は、
ＬＥＤ　Ｌ１～Ｌ８に供給される。 Further, when the MCU1 detects that the slider 119 is opened, the MCU1 enables the OTG function of the charging IC2 via the communication line LN. As a result, the charging IC2 outputs from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat. The system power supply voltage Vcc4 output from the input terminal VBUS is
It is fed to the LEDs L1-L8.
＜加熱初期設定モード：図１５＞
　図１４の状態から、端子Ｐ４に入力される信号がローレベルになる（操作スイッチＯＰＳの押下がなされる）と、ＭＣＵ１は、加熱に必要な各種の設定を行った後、端子Ｐ１４から、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮにハイレベルのイネーブル信号を入力する。これにより、昇圧ＤＣ／ＤＣコンバータ９は、電源電圧ＶＢＡＴを昇圧して得られる駆動電圧Ｖｂｓｔを出力端子ＶＯＵＴから出力する。駆動電圧Ｖｂｓｔは、スイッチＳ３とスイッチＳ４に供給される。この状態では、スイッチＳ３とスイッチＳ４はオフとなっている。また、端子Ｐ１４から出力されたハイレベルのイネーブル信号によってスイッチＳ６はオンされる。これにより、ヒータＨＴＲの負極側端子がグランドラインに接続されて、スイッチＳ３をＯＮにすればヒータＨＴＲを加熱可能な状態になる。ＭＣＵ１の端子Ｐ１４からハイレベルの信号のイネーブル信号が出力された後、加熱モードに移行する。 <Heating initial setting mode: Fig. 15>
From the state of FIG. 14, when the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then boosts the voltage from the terminal P14. A high-level enable signal is input to the enable terminal EN of the DC/DC converter 9 . As a result, the step-up DC/DC converter 9 outputs the driving voltage V bst obtained by stepping up the power supply voltage V BAT from the output terminal VOUT. The drive voltage Vbst is supplied to switch S3 and switch S4. In this state, the switches S3 and S4 are off. Also, the switch S6 is turned on by the high-level enable signal output from the terminal P14. As a result, the negative terminal of the heater HTR is connected to the ground line, and the heater HTR can be heated by turning on the switch S3. After a high-level enable signal is output from the terminal P14 of the MCU1, the mode shifts to the heating mode.
＜加熱モード時のヒータ加熱：図１６＞
　図１５の状態において、ＭＣＵ１は、端子Ｐ１６に接続されたスイッチＳ３のスイッチング制御と、端子Ｐ１５に接続されたスイッチＳ４のスイッチング制御を開始する。これらスイッチング制御は、上述した加熱初期設定モードが完了すれば自動的に開始されてもよいし、さらなる操作スイッチＯＰＳの押下によって開始されてもよい。具体的には、ＭＣＵ１は、図１６のように、スイッチＳ３をオンし、スイッチＳ４をオフして、駆動電圧ＶｂｓｔをヒータＨＴＲに供給し、エアロゾル生成のためのヒータＨＴＲの加熱を行う加熱制御と、図１７のように、スイッチＳ３をオフし、スイッチＳ４をオンして、ヒータＨＴＲの温度を検出する温度検出制御と、を行う。 <Heater heating in heating mode: Fig. 16>
In the state of FIG. 15, the MCU1 starts switching control of the switch S3 connected to the terminal P16 and switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the heating initial setting mode described above is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 16, the MCU 1 turns on the switch S3 and turns off the switch S4 to supply the driving voltage Vbst to the heater HTR to heat the heater HTR for generating aerosol. and temperature detection control for detecting the temperature of the heater HTR by turning off the switch S3 and turning on the switch S4 as shown in FIG.
　図１６に示すように、加熱制御時においては、駆動電圧Ｖｂｓｔは、スイッチＳ５のゲートにも供給されて、スイッチＳ５がオンとなる。また、加熱制御時には、スイッチＳ３を通過した駆動電圧Ｖｂｓｔが、抵抗器Ｒｓを介して、オペアンプＯＰ１の正電源端子にも入力される。抵抗器Ｒｓの抵抗値は、オペアンプＯＰ１の内部抵抗値と比べると無視できるほど小さい。そのため、加熱制御時において、オペアンプＯＰ１の正電源端子に入力される電圧は、駆動電圧Ｖｂｓｔとほぼ同等になる。 As shown in FIG. 16, during heating control, the driving voltage Vbst is also supplied to the gate of the switch S5 to turn on the switch S5. Further, during heating control, the drive voltage Vbst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs. The resistance value of the resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage Vbst .
　なお、抵抗器Ｒ４の抵抗値は、スイッチＳ５のオン抵抗値よりも大きくなっている。加熱制御時にもオペアンプＯＰ１は動作するが、加熱制御時にはスイッチＳ５がオンになる。スイッチＳ５がオンの状態では、オペアンプＯＰ１の出力電圧が、抵抗器Ｒ４とスイッチＳ５の分圧回路によって分圧されて、ＭＣＵ１の端子Ｐ９に入力される。抵抗器Ｒ４の抵抗値がスイッチＳ５のオン抵抗値よりも大きくなっていることで、ＭＣＵ１の端子Ｐ９に入力される電圧は十分に小さくなる。これにより、オペアンプＯＰ１からＭＣＵ１に対して大きな電圧が入力されるのを防ぐことができる。 It should be noted that the resistance value of the resistor R4 is greater than the ON resistance value of the switch S5. Although the operational amplifier OP1 operates during heating control, the switch S5 is turned on during heating control. When the switch S5 is on, the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is higher than the ON resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 is sufficiently reduced. This can prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.
＜加熱モード時のヒータ温度検出：図１７＞
　図１７に示すように、温度検出制御時には、駆動電圧ＶｂｓｔがオペアンプＯＰ１の正電源端子に入力されると共に、分圧回路Ｐｂに入力される。分圧回路Ｐｂによって分圧された電圧は、ＭＣＵ１の端子Ｐ１８に入力される。ＭＣＵ１は、端子Ｐ１８に入力される電圧に基づいて、温度検出制御時における抵抗器ＲｓとヒータＨＴＲの直列回路に印加される基準電圧Ｖｔｅｍｐを取得する。 <Heater temperature detection in heating mode: Fig. 17>
As shown in FIG. 17, during temperature detection control, the driving voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. Based on the voltage input to the terminal P18, the MCU1 acquires the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during temperature detection control.
　また、温度検出制御時には、駆動電圧Ｖｂｓｔ（基準電圧Ｖｔｅｍｐ）が、抵抗器ＲｓとヒータＨＴＲの直列回路に供給される。そして、この駆動電圧Ｖｂｓｔ（基準電圧Ｖｔｅｍｐ）を抵抗器ＲｓとヒータＨＴＲによって分圧した電圧Ｖｈｅａｔが、オペアンプＯＰ１の非反転入力端子に入力される。抵抗器Ｒｓの抵抗値はヒータＨＴＲの抵抗値よりも十分に大きいため、電圧Ｖｈｅａｔは、駆動電圧Ｖｂｓｔよりも十分に低い値である。温度検出制御時には、この低い電圧ＶｈｅａｔがスイッチＳ５のゲート端子にも供給されることで、スイッチＳ５はオフされる。オペアンプＯＰ１は、反転入力端子に入力される電圧と非反転入力端子に入力される電圧Ｖｈｅａｔの差を増幅して出力する。 Further, during temperature detection control, the driving voltage V bst (reference voltage V temp ) is supplied to the series circuit of the resistor Rs and the heater HTR. A voltage V heat obtained by dividing the driving voltage V bst (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistor Rs is sufficiently higher than the resistance value of the heater HTR, the voltage V heat is sufficiently lower than the driving voltage V bst . During temperature detection control, the switch S5 is turned off by supplying the low voltage V heat to the gate terminal of the switch S5. The operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.
　オペアンプＯＰ１の出力信号は、ＭＣＵ１の端子Ｐ９に入力される。ＭＣＵ１は、端子Ｐ９に入力された信号と、端子Ｐ１８の入力電圧に基づいて取得した基準電圧Ｖｔｅｍｐと、既知の抵抗器Ｒｓの電気抵抗値と、に基づいて、ヒータＨＴＲの温度を取得する。ＭＣＵ１は、取得したヒータＨＴＲの温度に基づいて、ヒータＨＴＲの加熱制御（例えばヒータＨＴＲの温度が目標温度となるような制御）を行う。 The output signal of operational amplifier OP1 is input to terminal P9 of MCU1. The MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the known electrical resistance value of the resistor Rs. . Based on the acquired temperature of the heater HTR, the MCU 1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR becomes a target temperature).
　なお、ＭＣＵ１は、スイッチＳ３とスイッチＳ４をそれぞれオフにしている期間（ヒータＨＴＲへの通電を行っていない期間）においても、ヒータＨＴＲの温度を取得することができる。具体的には、ＭＣＵ１は、端子Ｐ１３に入力される電圧（サーミスタＴ３と抵抗器Ｒｔ３から構成される分圧回路の出力電圧）に基づいて、ヒータＨＴＲの温度を取得する。 Note that the MCU 1 can obtain the temperature of the heater HTR even during periods when the switches S3 and S4 are turned off (periods when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).
　また、ＭＣＵ１は、任意のタイミングにて、ケース１１０の温度の取得も可能である。具体的には、ＭＣＵ１は、端子Ｐ１２に入力される電圧（サーミスタＴ４と抵抗器Ｒｔ４から構成される分圧回路の出力電圧）に基づいて、ケース１１０の温度を取得する。 Also, the MCU 1 can acquire the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).
＜充電モード：図１８＞
　図１８は、スリープモードの状態でＵＳＢ接続がなされた場合を例示している。ＵＳＢ接続がなされると、ＵＳＢ電圧ＶＵＳＢが過電圧保護ＩＣ１１を介してＬＳＷ３の入力端子ＶＩＮに入力される。ＵＳＢ電圧ＶＵＳＢは、ＬＳＷ３の入力端子ＶＩＮに接続された分圧回路Ｐｆにも供給される。ＵＳＢ接続がなされた直後の時点では、バイポーラトランジスタＳ２がオンとなっているため、ＬＳＷ３の制御端子ＯＮに入力される信号はローレベルのままとなる。ＵＳＢ電圧ＶＵＳＢは、ＭＣＵ１の端子Ｐ１７に接続された分圧回路Ｐｃにも供給され、この分圧回路Ｐｃで分圧された電圧が端子Ｐ１７に入力される。ＭＣＵ１は、端子Ｐ１７に入力された電圧に基づいて、ＵＳＢ接続がなされたことを検出する。 <Charging mode: Fig. 18>
FIG. 18 exemplifies a case where a USB connection is made in sleep mode. When the USB connection is made, the USB voltage VUSB is input to the input terminal VIN of LSW3 via the overvoltage protection IC11. The USB voltage V USB is also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. Since the bipolar transistor S2 is ON immediately after the USB connection is made, the signal input to the control terminal ON of the LSW3 remains at a low level. The USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to the terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to the terminal P17. The MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.
　ＭＣＵ１は、ＵＳＢ接続がなされたことを検出すると、端子Ｐ１９に接続されたバイポーラトランジスタＳ２をオフする。バイポーラトランジスタＳ２のゲート端子にローレベルの信号を入力すると、分圧回路Ｐｆによって分圧されたＵＳＢ電圧ＶＵＳＢがＬＳＷ３の制御端子ＯＮに入力される。これにより、ＬＳＷ３の制御端子ＯＮにハイレベルの信号が入力されて、ＬＳＷ３は、ＵＳＢ電圧ＶＵＳＢを出力端子ＶＯＵＴから出力する。ＬＳＷ３から出力されたＵＳＢ電圧ＶＵＳＢは、充電ＩＣ２の入力端子ＶＢＵＳに入力される。また、ＬＳＷ３から出力されたＵＳＢ電圧ＶＵＳＢは、そのままシステム電源電圧Ｖｃｃ４として、ＬＥＤ　Ｌ１～Ｌ８に供給される。 When the MCU1 detects that the USB connection has been made, the MCU1 turns off the bipolar transistor S2 connected to the terminal P19. When a low level signal is input to the gate terminal of the bipolar transistor S2, the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. As a result, a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage VUSB from the output terminal VOUT. The USB voltage VUSB output from LSW3 is input to the input terminal VBUS of charging IC2. In addition, the USB voltage V_USB output from LSW3 is directly supplied to LEDs L1 to L8 as system power supply voltage Vcc4.
　ＭＣＵ１は、ＵＳＢ接続がなされたことを検出すると、更に、端子Ｐ２２から、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）に対してローレベルのイネーブル信号を出力する。これにより、充電ＩＣ２は、電源ＢＡＴの充電機能を有効化し、入力端子ＶＢＵＳに入力されるＵＳＢ電圧ＶＵＳＢによる電源ＢＡＴの充電を開始する。 When the MCU1 detects that the USB connection has been established, the MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE(~) of the charge IC2. As a result, the charging IC 2 enables the charging function of the power supply BAT, and starts charging the power supply BAT with the USB voltage VUSB input to the input terminal VBUS.
　なお、アクティブモードの状態でＵＳＢ接続がなされた場合には、ＭＣＵ１は、ＵＳＢ接続がなされたことを検出すると、端子Ｐ１９に接続されたバイポーラトランジスタＳ２をオフし、更に、端子Ｐ２２から、充電ＩＣ２の充電イネーブル端子ＣＥ（￣）に対してローレベルのイネーブル信号を出力し、更に、通信線ＬＮを利用したシリアル通信によって、充電ＩＣ２のＯＴＧ機能をオフする。これにより、ＬＥＤ　Ｌ１～Ｌ８に供給されるシステム電源電圧Ｖｃｃ４は、充電ＩＣ２のＯＴＧ機能で生成されていた電圧（電源電圧ＶＢＡＴに基づく電圧）から、ＬＳＷ３から出力されたＵＳＢ電圧ＶＵＳＢに切り替わる。ＬＥＤ　Ｌ１～Ｌ８は、ＭＣＵ１によって内蔵トランジスタのオン制御がなされない限りは作動しない。このため、ＯＴＧ機能のオンからオフへの過渡期における不安定な電圧がＬＥＤ　Ｌ１～Ｌ８に供給されるのは防がれる。 When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, it turns off the bipolar transistor S2 connected to the terminal P19. A low-level enable signal is output to the charge enable terminal CE (~) of , and the OTG function of the charge IC 2 is turned off by serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. . The LEDs L1 to L8 do not operate unless the MCU1 turns on the built-in transistors. This prevents an unstable voltage from being supplied to the LEDs L1-L8 during the on-to-off transition of the OTG function.
＜ＭＣＵのリセット：図１９＞
　アウターパネル１１５が外されてホールＩＣ１３の出力がローレベルとなり、操作スイッチＯＰＳのオン操作がなされてＭＣＵ１の端子Ｐ４に入力される信号がローレベルになると、スイッチドライバ７の端子ＳＷ１と端子ＳＷ２が共にローレベルとなる。これにより、スイッチドライバ７は、リセット入力端子ＲＳＴＢからローレベルの信号を出力する。リセット入力端子ＲＳＴＢから出力されたローレベルの信号はＬＳＷ４の制御端子ＯＮに入力される。これにより、ＬＳＷ４は、出力端子ＶＯＵＴからのシステム電源電圧Ｖｃｃ２の出力を停止する。システム電源電圧Ｖｃｃ２の出力が停止されることで、ＭＣＵ１の電源端子ＶＤＤにシステム電源電圧Ｖｃｃ２が入力されなくなるため、ＭＣＵ１は停止する。 <Reset MCU: Fig. 19>
When the outer panel 115 is removed, the output of the hall IC 13 becomes low level, and the signal input to the terminal P4 of the MCU 1 becomes low level by turning on the operation switch OPS, the terminals SW1 and SW2 of the switch driver 7 are turned on. Both become low level. As a result, the switch driver 7 outputs a low level signal from the reset input terminal RSTB. A low-level signal output from the reset input terminal RSTB is input to the control terminal ON of LSW4. As a result, LSW4 stops outputting system power supply voltage Vcc2 from output terminal VOUT. Since the output of the system power supply voltage Vcc2 is stopped, the system power supply voltage Vcc2 is no longer input to the power supply terminal VDD of the MCU1, so the MCU1 is stopped.
　スイッチドライバ７は、リセット入力端子ＲＳＴＢからローレベルの信号を出力している時間が既定時間に達するか、端子ＳＷ１と端子ＳＷ２のいずれかに入力される信号がハイレベルになると、リセット入力端子ＲＳＴＢから出力する信号をハイレベルに戻す。これにより、ＬＳＷ４の制御端子ＯＮがハイレベルとなり、システム電源電圧Ｖｃｃ２が各部に供給される状態に復帰する。 The switch driver 7 outputs a low-level signal from the reset input terminal RSTB when it reaches a predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the reset input terminal RSTB is output. return the signal output from to high level. As a result, the control terminal ON of LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part is restored.
＜加熱制御と温度検出制御の詳細＞
　図２０は、図１０に示す電気回路のうち、ヒータＨＴＲの加熱と温度検出に用いられる主要な電子部品を抜き出して示した要部回路図である。図２０には、図１０では図示又は符号を省略していた電子部品やノードとして、リアクトルＬｄと、抵抗器ＲＳ４と、ｎｐｎ型のバイポーラトランジスタＴＳ４と、分圧回路Ｐｂを構成している抵抗器ＲＰｂ１及び抵抗器ＲＰｂ２と、スイッチＳ５の寄生ダイオードＤ５と、ノードＮ１～Ｎ８と、ＭＣＵ１に内蔵されたオペアンプＯＰ４、オペアンプＯＰ５、ＡＤＣ（アナログデジタル変換器）１ａ、及びＡＤＣ１ｂと、が示されている。図２０に示した各種の抵抗器（抵抗器ＲＳ４、抵抗器Ｒｓ、抵抗器ＲＰｂ１、抵抗器ＲＰｂ２、及び抵抗器Ｒ４）は、既定の抵抗値を持つ固定抵抗器である。 <Details of heating control and temperature detection control>
FIG. 20 is a circuit diagram of main parts of the electric circuit shown in FIG. 10, showing the main electronic components used for heating and temperature detection of the heater HTR. FIG. 20 shows a reactor Ld, a resistor RS4 , an npn-type bipolar transistor TS4 , and a voltage dividing circuit Pb as electronic components and nodes whose illustration or reference numerals are omitted in FIG. The resistors R Pb1 and R Pb2 , the parasitic diode D5 of the switch S5, the nodes N1 to N8, and the operational amplifiers OP4, OP5, ADC (analog-digital converter) 1a, and ADC1b built in the MCU1 are It is shown. Various resistors (resistor R S4 , resistor Rs, resistor R Pb1 , resistor R Pb2 , and resistor R4) shown in FIG. 20 are fixed resistors having predetermined resistance values.
　抵抗器ＲＳ４の一端は、スイッチＳ４のゲート端子と接続されている。抵抗器ＲＳ４の他端は、バイポーラトランジスタＴＳ４のコレクタ端子と接続されている。バイポーラトランジスタＴＳ４のエミッタ端子はグランドに接続されている。バイポーラトランジスタＴＳ４のベース端子は、ＭＣＵ１の端子Ｐ１５に接続されている。 One end of resistor RS4 is connected to the gate terminal of switch S4 . The other end of resistor RS4 is connected to the collector terminal of bipolar transistor TS4 . The emitter terminal of bipolar transistor TS4 is connected to ground. The base terminal of bipolar transistor TS4 is connected to terminal P15 of MCU1.
　リアクトルＬｄは、昇圧ＤＣ／ＤＣコンバータ９から出力される駆動電圧Ｖｂｓｔのノイズ低減を目的に設けられている。リアクトルＬｄは、スイッチＳ４のソース端子と昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴの間に接続されている。なお、リアクトルＬｄに加えて、スイッチＳ４と抵抗器Ｒｓの間に別のノイズ低減用の第１リアクトルを設け、抵抗器Ｒｓと正極側のヒータコネクタＣｎ（＋）との間に更に別のノイズ低減用の第２リアクトルを設けてもよい。これら、リアクトルＬｄ、第１リアクトル、及び第２リアクトルのうち、いずれか１つを省略したり、いずれか２つを省略したりしてもよい。また、これらのノイズ低減用のリアクトルは必須ではなく省略可能である。 The reactor Ld is provided for the purpose of reducing noise in the drive voltage Vbst output from the boost DC/DC converter 9 . Reactor Ld is connected between the source terminal of switch S4 and the output terminal VOUT of boost DC/DC converter 9 . In addition to the reactor Ld, another noise reduction first reactor is provided between the switch S4 and the resistor Rs, and another noise reduction reactor is provided between the resistor Rs and the heater connector Cn(+) on the positive electrode side. A second reactor for reduction may be provided. Any one of the reactor Ld, the first reactor, and the second reactor may be omitted, or any two of them may be omitted. Moreover, these reactors for noise reduction are not essential and can be omitted.
　ノードＮ１は、スイッチＳ３のソース端子と、リアクトルＬｄの一端とを接続している。ノードＮ１は、昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴに接続されている。 The node N1 connects the source terminal of the switch S3 and one end of the reactor Ld. The node N1 is connected to the output terminal VOUT of the boost DC/DC converter 9 .
　ノードＮ７は、正極側（＋極）のヒータコネクタＣｎ（＋）と、オペアンプＯＰ１の非反転入力端子とを接続している。 The node N7 connects the heater connector Cn(+) on the positive electrode side (+ pole) and the non-inverting input terminal of the operational amplifier OP1.
　ノードＮ２は、スイッチＳ３のドレイン端子と、ノードＮ７とを接続している。 The node N2 connects the drain terminal of the switch S3 and the node N7.
　ノードＮ４は、ノードＮ２と、抵抗器Ｒｓとを接続している。ノードＮ４は、スイッチＳ５のゲート端子に接続されている。 The node N4 connects the node N2 and the resistor Rs. The node N4 is connected to the gate terminal of the switch S5.
　ノードＮ５は、抵抗器Ｒ４におけるオペアンプＯＰ１側の反対側端と、スイッチＳ５のドレイン端子とを接続している。ノードＮ５は、ＭＣＵ１の端子Ｐ９に接続されている。 The node N5 connects the end of the resistor R4 opposite to the operational amplifier OP1 side and the drain terminal of the switch S5. Node N5 is connected to terminal P9 of MCU1.
　ノードＮ３は、スイッチＳ４のドレイン端子と、抵抗器ＲｓのノードＮ４側の反対端とを接続している。ノードＮ３は、オペアンプＯＰ１の正電源端子と、抵抗器ＲＰｂ１の一端とに接続されている。 A node N3 connects the drain terminal of the switch S4 and the opposite end of the resistor Rs on the node N4 side. The node N3 is connected to the positive power supply terminal of the operational amplifier OP1 and one end of the resistor RPb1 .
　ノードＮ６は、抵抗器ＲＰｂ１の他端と、抵抗器ＲＰｂ２の一端とを接続している。ノードＮ６は、ＭＣＵ１の端子Ｐ１８に接続されている。抵抗器ＲＰｂ２の他端はグランドに接続されている。 A node N6 connects the other end of the resistor RPb1 and one end of the resistor RPb2 . Node N6 is connected to terminal P18 of MCU1. The other end of resistor RPb2 is connected to ground.
　ノードＮ８は、負極側（－極）のヒータコネクタＣｎ（－）と、スイッチＳ６のドレイン端子とを接続している。ノードＮ８は、オペアンプＯＰ１の反転入力端子に接続されている。 The node N8 connects the heater connector Cn(-) on the negative electrode side (- pole) and the drain terminal of the switch S6. The node N8 is connected to the inverting input terminal of the operational amplifier OP1.
　寄生ダイオードＤ５は、アノードがスイッチＳ５のソース端子に接続され、カソードがスイッチＳ５のドレイン端子に接続された構成である。 The parasitic diode D5 has a configuration in which the anode is connected to the source terminal of the switch S5 and the cathode is connected to the drain terminal of the switch S5.
　図２０に示す回路において、スイッチＳ４をオンする際の流れは次の通りである。まず、昇圧ＤＣ／ＤＣコンバータ９の出力端子ＶＯＵＴから駆動電圧Ｖｂｓｔが出力されている状態にて、ＭＣＵ１は、バイポーラトランジスタＴＳ４をオンする（バイポーラトランジスタＴＳ４のエミッタ端子から増幅された電流が出力される）。これにより、スイッチＳ４のゲート端子が、抵抗器ＲＳ４、バイポーラトランジスタＴＳ４のコレクタ端子、及びバイポーラトランジスタＴＳ４のエミッタ端子を介してグランドに接続される。その結果、スイッチＳ４のゲート電圧がグランド電位（本実施形態では０Ｖとする）に近い値となり、スイッチＳ４のゲート・ソース間電圧の絶対値が、スイッチＳ４の閾値電圧の絶対値よりも大きくなって、スイッチＳ４はオンする。バイポーラトランジスタＴＳ４をオフすると、スイッチＳ４のゲート・ソース間電圧の絶対値が、スイッチＳ４の閾値電圧の絶対値以下となるため、スイッチＳ４はオフする。
　ゲート・ソース間電圧は、ゲート端子とソース端子の間に印加される電圧を指す。本実施形態におけるスイッチＳ４はＰチャネル型のＭＯＳＦＥＴであるため、スイッチＳ４をオンしようとすると、マイナスの値を持つゲート・ソース間電圧が必要となる。換言すれば、ソース端子の電位がゲート端子の電位から閾値電圧より低くなると、スイッチＳ４はオンされる。例えば、スイッチＳ４の閾値電圧を－４．５Ｖとした場合、ソース電位を４．９Ｖとし、ゲート電位を０Ｖにすると、ゲート・ソース間電圧は－４．９Ｖとなる。－４．９Ｖは、閾値電圧である－４．５Ｖより低いため、スイッチＳ４はオンされる。一方、ソース電位を４．９Ｖとし、ゲート電位を３．３Ｖにすると、ゲート・ソース間電圧は－１．６Ｖとなる。－１．６Ｖは、閾値電圧である－４．５Ｖより高いため、スイッチＳ４はオフされる。
　本明細書においては理解を容易にするため、Ｐチャネル型のＭＯＳＦＥＴのゲート・ソース間電圧と閾値電圧については、符号を無視した絶対値として説明する。 In the circuit shown in FIG. 20, the flow when the switch S4 is turned on is as follows. First, in a state where the drive voltage Vbst is being output from the output terminal VOUT of the step -up DC/DC converter 9, the MCU 1 turns on the bipolar transistor TS4 (current amplified from the emitter terminal of the bipolar transistor TS4 is output). This connects the gate terminal of the switch S4 to ground via the resistor R S4 , the collector terminal of the bipolar transistor T S4 and the emitter terminal of the bipolar transistor T S4 . As a result, the gate voltage of the switch S4 becomes close to the ground potential (0 V in this embodiment), and the absolute value of the gate-source voltage of the switch S4 becomes larger than the absolute value of the threshold voltage of the switch S4. switch S4 is turned on. When the bipolar transistor TS4 is turned off, the absolute value of the gate-source voltage of the switch S4 becomes equal to or less than the absolute value of the threshold voltage of the switch S4, so the switch S4 is turned off.
Gate-to-source voltage refers to the voltage applied between the gate and source terminals. Since the switch S4 in this embodiment is a P-channel MOSFET, a negative gate-source voltage is required to turn on the switch S4. In other words, when the potential of the source terminal becomes lower than the potential of the gate terminal by less than the threshold voltage, the switch S4 is turned on. For example, if the threshold voltage of the switch S4 is -4.5V, the source potential is 4.9V, and the gate potential is 0V, the gate-source voltage is -4.9V. Since -4.9V is lower than the threshold voltage of -4.5V, the switch S4 is turned on. On the other hand, if the source potential is 4.9V and the gate potential is 3.3V, the voltage between the gate and the source is -1.6V. Since -1.6V is higher than the threshold voltage of -4.5V, the switch S4 is turned off.
In this specification, for ease of understanding, the gate-source voltage and the threshold voltage of a P-channel MOSFET are described as absolute values ignoring signs.
　なお、前述してきたシステム電源電圧Ｖｃｃ２（ＭＣＵ１の電源端子ＶＤＤに入力されるＭＣＵ１の電源電圧）と駆動電圧Ｖｂｓｔは、好ましくは下記に示す値である。
　システム電源電圧Ｖｃｃ２＝３．３Ｖ
　駆動電圧Ｖｂｓｔ＝４．９Ｖ The system power supply voltage Vcc2 (the MCU1 power supply voltage input to the MCU1 power supply terminal VDD) and the driving voltage Vbst described above preferably have the following values.
System power supply voltage Vcc2=3.3V
Drive voltage V bst =4.9V
　次に、図２１から図２４を参照して、ヒータＨＴＲの加熱制御と、ヒータＨＴＲの温度検出制御の動作について説明する。 Next, with reference to FIGS. 21 to 24, the operation of heating control of the heater HTR and temperature detection control of the heater HTR will be described.
　図２１は、加熱モードにおけるスイッチＳ３及びスイッチＳ４のゲート端子に入力される電圧変化の一例を示す図である。本実施形態においては、スイッチＳ３及びスイッチＳ４はＰチャネル型のＭＯＳＦＥＴであるため、ゲート端子に入力される電圧がローレベルの時に、スイッチＳ３及びスイッチＳ４はオンされる点に留意されたい。図２１には、駆動例ＥＸ１と駆動例ＥＸ２が示されている。図２１の駆動例ＥＸ１では、ＭＣＵ１は、スイッチＳ３及びスイッチＳ４のそれぞれのオンとオフを交互に繰り返す。つまり、駆動例ＥＸ１では、ＭＣＵ１は、スイッチＳ３をオンしている間はスイッチＳ４をオフし、スイッチＳ３をオフしている間はスイッチＳ４をオンする。換言すれば、駆動例ＥＸ１では、スイッチＳ３のゲート端子に入力される電圧がローレベルである期間と、スイッチＳ４のゲート端子に入力される電圧がローレベルである期間が重複しない。駆動例ＥＸ２は、スイッチＳ３をオンする期間と、スイッチＳ４をオンする期間とを一部重複させている点が駆動例ＥＸ１と相違する。換言すれば、駆動例ＥＸ２では、スイッチＳ３のゲート端子に入力される電圧がローレベルである期間と、スイッチＳ４のゲート端子に入力される電圧がローレベルである期間が重複する。 FIG. 21 is a diagram showing an example of voltage changes input to the gate terminals of the switches S3 and S4 in the heating mode. Note that the switches S3 and S4 are turned on when the voltage input to the gate terminal is at a low level because the switches S3 and S4 are P-channel MOSFETs in this embodiment. FIG. 21 shows a driving example EX1 and a driving example EX2. In the drive example EX1 of FIG. 21, the MCU1 alternately turns on and off the switches S3 and S4. That is, in the drive example EX1, the MCU1 turns off the switch S4 while the switch S3 is on, and turns on the switch S4 while the switch S3 is off. In other words, in the drive example EX1, the period during which the voltage input to the gate terminal of the switch S3 is at low level and the period during which the voltage input to the gate terminal of the switch S4 is at low level do not overlap. The drive example EX2 is different from the drive example EX1 in that the period during which the switch S3 is turned on and the period during which the switch S4 is turned on partially overlap. In other words, in the drive example EX2, the period during which the voltage input to the gate terminal of the switch S3 is at low level overlaps with the period during which the voltage input to the gate terminal of the switch S4 is at low level.
　図２１には、ＭＣＵ１の制御周期Ｔｃが示されている。ＭＣＵ１は、この制御周期Ｔｃにおいて、スイッチＳ４をオンする時間を一定とし、スイッチＳ３をオンする時間を制御する。つまり、ＭＣＵ１は、加熱制御時には、ＰＷＭ（パルス幅変調）制御によって、ヒータＨＴＲへの電力の供給を行う。この制御周期Ｔｃのうち、スイッチＳ４をオンしている一定時間を除いた時間が、スイッチＳ３をオンする時間の最大値である。スイッチＳ４をオンしている一定時間は、スイッチＳ３をオンする時間の最大値よりも十分に小さく、例えば、この最大値の１０分の１以下である。なお、制御周期Ｔｃのうち、スイッチＳ３を複数回オンしてもよい。この場合において、ＰＷＭ制御によって算出されるデューティ比が１００％未満ならば、制御周期ＴｃのうちスイッチＳ４をオンしている一定時間を除いた時間において、スイッチＳ３は間欠的にオンされることとなる。 FIG. 21 shows the control cycle Tc of the MCU1. In this control period Tc, the MCU 1 keeps the switch S4 ON time constant and controls the switch S3 ON time. That is, the MCU 1 supplies power to the heater HTR by PWM (Pulse Width Modulation) control during heating control. The maximum value of the time during which the switch S3 is turned on is the control period Tc, excluding the fixed time during which the switch S4 is turned on. The certain time period during which the switch S4 is turned on is sufficiently smaller than the maximum value of the time period during which the switch S3 is turned on, for example, 1/10 or less of this maximum value. Note that the switch S3 may be turned on multiple times during the control period Tc. In this case, if the duty ratio calculated by the PWM control is less than 100%, the switch S3 is intermittently turned on during the control period Tc excluding the certain time during which the switch S4 is turned on. Become.
　駆動例ＥＸ１では、スイッチＳ３がオンからオフに切り替わるタイミングで、スイッチＳ４がオフからオンに切り替わるように、ＭＣＵ１が制御している。つまり、ＭＣＵ１は、スイッチＳ３をオフするタイミングは固定とし、スイッチＳ３をオンするタイミングを制御することで、スイッチＳ３のオン時間を変更している。なお、ＭＣＵ１は、ＰＦＭ（パルス周波数変調）制御によってヒータＨＴＲへの電力の供給を行ってもよい。 In the driving example EX1, the MCU1 controls so that the switch S4 is switched from off to on at the timing when the switch S3 is switched from on to off. That is, the MCU 1 changes the ON time of the switch S3 by fixing the timing of turning off the switch S3 and controlling the timing of turning on the switch S3. The MCU 1 may supply power to the heater HTR by PFM (Pulse Frequency Modulation) control.
　図２２は、加熱モードの加熱制御時における電流の流れを示した図である。加熱制御時には、スイッチＳ３がオン且つスイッチＳ４がオフとなる。この状態では、ノードＮ１、スイッチＳ３、ノードＮ２、ノードＮ７、ヒータＨＴＲ、ノードＮ８、スイッチＳ６、及びグランドの順に電流が流れる第１加熱放電経路ＨＲ１と、ノードＮ１、スイッチＳ３、ノードＮ２、ノードＮ４、及びスイッチＳ５のゲート端子の順に電流が流れる第２加熱放電経路ＨＲ２と、ノードＮ１、スイッチＳ３、ノードＮ２、ノードＮ４、抵抗器Ｒｓ、ノードＮ３、及びオペアンプＯＰ１の正電源端子の順に電流が流れる第３加熱放電経路ＨＲ３と、が形成される。 FIG. 22 is a diagram showing current flow during heating control in the heating mode. During heating control, the switch S3 is turned on and the switch S4 is turned off. In this state, a first heating discharge path HR1 through which current flows in the order of node N1, switch S3, node N2, node N7, heater HTR, node N8, switch S6, and ground; A second heating discharge path HR2 through which current flows in order of N4 and the gate terminal of switch S5, and a current in order of node N1, switch S3, node N2, node N4, resistor Rs, node N3, and the positive power supply terminal of operational amplifier OP1. A third heating discharge path HR3 through which the current flows is formed.
　第３加熱放電経路ＨＲ３の存在により、オペアンプＯＰ１の正電源端子には、駆動電圧Ｖｂｓｔよりも低い電圧（駆動電圧Ｖｂｓｔの抵抗器Ｒｓで降圧後の電圧）が供給されて、オペアンプＯＰ１は動作可能になっている。つまり、加熱制御時には、第３加熱放電経路ＨＲ３の存在により、オペアンプＯＰ１の正電源端子と負電源端子の間に印加される電圧は、駆動電圧Ｖｂｓｔよりも低い値（ただし、ＭＣＵ１の電源電圧であるシステム電源電圧Ｖｃｃ２よりは高い値）となる。この状態では、オペアンプＯＰ１の差動入力値が駆動電圧Ｖｂｓｔよりも高くなると、オペアンプＯＰ１の出力電圧は、オペアンプＯＰ１の正電源端子に印加されている電圧に貼り付いてしまう。この電圧は、ＭＣＵ１の電源電圧よりも高いため、この電圧がＭＣＵ１に入力されると、ＭＣＵ１は正常に動作しなくなる虞がある。そこで、第２加熱放電経路ＨＲ２の存在によってスイッチＳ５がオンされるようになっている。これにより、オペアンプＯＰ１の出力電圧は、抵抗器Ｒ４とスイッチＳ５のオン抵抗によって分圧されてＭＣＵ１の端子Ｐ９に入力される。スイッチＳ５のオン抵抗値は抵抗器Ｒ４の抵抗値よりも十分に小さい。このため、抵抗器Ｒ４とスイッチＳ５によって分圧される電圧値は微小となる。したがって、スイッチＳ５は、オンすることで、オペアンプＯＰ１の出力電圧をグランドレベルにクランプしていると見做すことができる。 Due to the presence of the third heating discharge path HR3 , a voltage lower than the drive voltage Vbst (the voltage after stepping down the drive voltage Vbst by the resistor Rs) is supplied to the positive power supply terminal of the operational amplifier OP1, and the operational amplifier OP1 is operational. That is, during heating control, due to the presence of the third heating discharge path HR3, the voltage applied between the positive power supply terminal and the negative power supply terminal of the operational amplifier OP1 is lower than the drive voltage Vbst (however, the MCU1 power supply voltage is higher than the system power supply voltage Vcc2). In this state, when the differential input value of the operational amplifier OP1 becomes higher than the drive voltage Vbst , the output voltage of the operational amplifier OP1 sticks to the voltage applied to the positive power supply terminal of the operational amplifier OP1. Since this voltage is higher than the power supply voltage of MCU1, if this voltage is input to MCU1, MCU1 may not operate normally. Therefore, the switch S5 is turned on by the presence of the second heating discharge path HR2. As a result, the output voltage of the operational amplifier OP1 is divided by the resistor R4 and the ON resistance of the switch S5 and input to the terminal P9 of the MCU1. The ON resistance of switch S5 is sufficiently smaller than the resistance of resistor R4. Therefore, the voltage value divided by the resistor R4 and the switch S5 is very small. Therefore, by turning on the switch S5, it can be considered that the output voltage of the operational amplifier OP1 is clamped to the ground level.
　図２３は、加熱モードの温度検出制御時における電流の流れを示した図である。温度検出制御時には、スイッチＳ３がオフ且つスイッチＳ４がオンとなる。この状態では、ノードＮ１、リアクトルＬｄ、スイッチＳ４、抵抗器Ｒｓ、ノードＮ２、ノードＮ７、ヒータＨＴＲ、ノードＮ８、スイッチＳ６、及びグランドの順に電流が流れる第１検出放電経路ＭＲ１と、ノードＮ１、リアクトルＬｄ、スイッチＳ４、抵抗器Ｒｓ、ノードＮ４、及びスイッチＳ５のゲート端子の順に電流が流れる第２検出放電経路ＭＲ２と、ノードＮ１、リアクトルＬｄ、スイッチＳ４、ノードＮ３、及びオペアンプＯＰ１の正電源端子の順に電流が流れる第３検出放電経路ＭＲ３と、が形成される。 FIG. 23 is a diagram showing current flow during temperature detection control in the heating mode. During temperature detection control, the switch S3 is turned off and the switch S4 is turned on. In this state, the node N1, the reactor Ld, the switch S4, the resistor Rs, the node N2, the node N7, the heater HTR, the node N8, the switch S6, and the first detection discharge path MR1 through which current flows in this order, the nodes N1, A second detection discharge path MR2 through which current flows in order of the reactor Ld, the switch S4, the resistor Rs, the node N4, and the gate terminal of the switch S5, the node N1, the reactor Ld, the switch S4, the node N3, and the positive power supply of the operational amplifier OP1 and a third detection discharge path MR3 through which current flows in order of the terminals.
　リアクトルＬｄの抵抗値とスイッチＳ４のオン抵抗値は十分に小さい。このため、第３検出放電経路ＭＲ３の存在により、オペアンプＯＰ１の正電源端子には、駆動電圧Ｖｂｓｔとほぼ同じ電圧（基準電圧Ｖｔｅｍｐ）が供給されて、オペアンプＯＰ１は動作可能になっている。このように、温度検出制御時には、オペアンプＯＰ１の電源電圧が、加熱制御時よりも大きくなるため、オペアンプＯＰ１の差動入力値の上限値を大きくすることができる。 The resistance value of reactor Ld and the ON resistance value of switch S4 are sufficiently small. Therefore, due to the presence of the third detection discharge path MR3, the positive power supply terminal of the operational amplifier OP1 is supplied with a voltage (reference voltage V temp ) that is substantially the same as the drive voltage Vbst , thereby enabling the operational amplifier OP1 to operate. . Thus, during temperature detection control, the power supply voltage of the operational amplifier OP1 becomes higher than during heating control, so the upper limit value of the differential input value of the operational amplifier OP1 can be increased.
　温度検出制御時には、オペアンプＯＰ１の非反転入力端子に、ノードＮ３の電圧（基準電圧Ｖｔｅｍｐ）を、抵抗器ＲｓとヒータＨＴＲで分圧した電圧Ｖｈｅａｔが入力される。なお、ノードＮ７は、配線抵抗を無視すれば、ノードＮ４の電位と一致する。このため、スイッチＳ５のゲート端子に入力される電圧も、電圧Ｖｈｅａｔと同じになる。電圧Ｖｈｅａｔは、スイッチＳ５の閾値電圧以下であるため、図２３の状態では、スイッチＳ５はオフになる。このように、電圧ＶｈｅａｔがスイッチＳ５の閾値電圧以下となるように、抵抗器Ｒｓの抵抗値を決めておくことが好ましい。スイッチＳ５がオフになることで、オペアンプＯＰ１の出力電圧ＶＯＵＴは、分圧されることなく、ＭＣＵ１の端子Ｐ９に入力される。なお、スイッチＳ５がオフの状態では、寄生ダイオードＤ５がツェナーダイオードのように振る舞う。このため、何らかの要因によってオペアンプＯＰ１の出力電圧ＶＯＵＴが過大となった場合でも、ＭＣＵ１の端子Ｐ９に入力される電圧が高くなるのを防ぐことができる。本実施形態では、図２３の状態において、ＭＣＵ１の端子Ｐ９に入力される電圧がＭＣＵ１の動作電圧（システム電源電圧Ｖｃｃ２）以下となるように、抵抗器Ｒ４や抵抗器Ｒｓの抵抗値が決められている。 During temperature detection control, the voltage V heat obtained by dividing the voltage of the node N3 (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Note that the potential of the node N7 matches the potential of the node N4 if wiring resistance is ignored. Therefore, the voltage input to the gate terminal of the switch S5 is also the same as the voltage V heat . Since the voltage V heat is equal to or lower than the threshold voltage of the switch S5, the switch S5 is turned off in the state of FIG. Thus, it is preferable to determine the resistance value of the resistor Rs so that the voltage V heat is equal to or lower than the threshold voltage of the switch S5. By turning off the switch S5, the output voltage V OUT of the operational amplifier OP1 is input to the terminal P9 of the MCU1 without being divided. When the switch S5 is off, the parasitic diode D5 behaves like a Zener diode. Therefore, even if the output voltage V OUT of the operational amplifier OP1 becomes excessive due to some factor, it is possible to prevent the voltage input to the terminal P9 of the MCU1 from increasing. In this embodiment, in the state of FIG. 23, the resistance values of resistor R4 and resistor Rs are determined so that the voltage input to terminal P9 of MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of MCU1. ing.
　オペアンプＯＰ１の増幅率をＡとし、ヒータＨＴＲの抵抗値をＲＨＴＲとし、抵抗器Ｒｓの抵抗値をＲRＳとし、オペアンプＯＰ１の反転入力端子に入力される電圧を０Ｖとすると、オペアンプＯＰ１の出力電圧ＶＯＵＴは、以下の式（１）により表される。式（１）の右辺の増幅率Ａを除く項が電圧Ｖｈｅａｔに相当する。 Assuming that the amplification factor of the operational amplifier OP1 is A, the resistance value of the heater HTR is RHTR, the resistance value of the resistor Rs is RRS, and the voltage input to the inverting input terminal of the operational amplifier OP1 is 0 V, the output of the operational amplifier OP1 is Voltage V OUT is represented by the following equation (1). The terms excluding the amplification factor A on the right side of the equation (1) correspond to the voltage V heat .
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000001
　式（１）を抵抗値ＲＨＴＲについて解くと、以下の式（２）が得られる。 Solving equation (1) for the resistance value RHTR yields equation (2) below.
Figure JPOXMLDOC01-appb-M000002
Figure JPOXMLDOC01-appb-M000002
　温度検出制御時において、ＭＣＵ１は、端子Ｐ９に入力された出力電圧ＶＯＵＴと、グランド電位（＝０Ｖ）の差を内蔵のオペアンプＯＰ５によって増幅し、増幅後の電圧を内蔵のＡＤＣ１ｂでデジタル値（ＡＤＣ＿ＶＯＵＴと記載）に変換する。また、ＭＣＵ１は、端子Ｐ１８に入力された基準電圧Ｖｔｅｍｐの分圧値（分圧回路Ｐｂによって分圧された値）とグランド電位（＝０Ｖ）の差を内蔵のオペアンプＯＰ４によって増幅し、増幅後の電圧を内蔵のＡＤＣ１ａでデジタル値（ＡＤＣ＿Ｖｔｅｍｐと記載）に変換する。オペアンプＯＰ４及び／又はオペアンプＯＰ５の反転入力端子は必ずしもグランド電位に接続されていなくてもよく、他の基準電位に接続されていてもよい。この基準電位が十分に高い場合、基準電位が非反転入力端子に接続され、出力電圧ＶＯＵＴや基準電圧Ｖｔｅｍｐの分圧値が反転入力端子に接続されてもよい。なお、ＡＤＣ１ａ及びオペアンプＯＰ４の出力は、ＭＣＵ１内部の温度の影響による温度ドリフト誤差ε１を生じ、ＡＤＣ１ｂ及びオペアンプＯＰ５の出力は、ＭＣＵ１内部の温度の影響による温度ドリフト誤差ε２を生じる。つまり、ＡＤＣ１ａから出力されるデジタル値は、厳密には、ＡＤＣ＿Ｖｔｅｍｐ（１＋ε１）となり、ＡＤＣ１ｂから出力されるデジタル値は、厳密には、ＡＤＣ＿ＶＯＵＴ（１＋ε２）となる。 During temperature detection control, the MCU1 amplifies the difference between the output voltage V OUT input to the terminal P9 and the ground potential (=0 V) by the built-in operational amplifier OP5, and converts the amplified voltage into a digital value ( ADC_V OUT ). In addition, the MCU1 amplifies the difference between the divided voltage value of the reference voltage V temp input to the terminal P18 (the value divided by the voltage dividing circuit Pb) and the ground potential (=0 V) by the built-in operational amplifier OP4, and amplifies the difference. The subsequent voltage is converted into a digital value (denoted as ADC_V temp ) by the built-in ADC 1a. The inverting input terminals of the operational amplifier OP4 and/or the operational amplifier OP5 are not necessarily connected to the ground potential, and may be connected to another reference potential. If this reference potential is sufficiently high, the reference potential may be connected to the non-inverting input terminal, and the divided voltage value of the output voltage V OUT or the reference voltage V temp may be connected to the inverting input terminal. The output of ADC1a and operational amplifier OP4 causes temperature drift error ε1 due to the temperature inside MCU1, and the output of ADC1b and operational amplifier OP5 causes temperature drift error ε2 due to the temperature inside MCU1. That is, strictly speaking, the digital value output from ADC 1a is ADC_V temp (1+ε1), and strictly speaking, the digital value output from ADC 1b is ADC_V OUT (1+ε2).
　デジタル値ＡＤＣ＿Ｖｔｅｍｐ（１＋ε１）を式（２）のＶｔｅｍｐに代入し、デジタル値ＡＤＣ＿ＶＯＵＴ（１＋ε２）を式（２）のＶＯＵＴに代入したものが、式（３）である。ＡＤＣ１ａ及びオペアンプＯＰ４と、ＡＤＣ１ｂ及びオペアンプＯＰ５は、それぞれＭＣＵ１内部に設けられている。そのため、温度ドリフト誤差ε１と温度ドリフト誤差ε２はほぼ同じと見做せる。つまり、式（３）における（１＋ε１）と（１＋ε２）は同じ値となる。このため、式（３）において、温度ドリフト誤差は相殺される。ＭＣＵ１は、この式（３）の演算により、ヒータＨＴＲの抵抗値ＲＨＴＲを導出する。ヒータＨＴＲは、温度に応じて抵抗値が変化する特性を持つため、抵抗値ＲＨＴＲが導出されることで、ヒータＨＴＲの温度が取得可能となる。 Equation (3) is obtained by substituting the digital value ADC_V temp (1+ε1) for V temp in equation (2) and substituting the digital value ADC_V OUT (1+ε2) for V OUT in equation (2). ADC1a and operational amplifier OP4 and ADC1b and operational amplifier OP5 are provided inside MCU1, respectively. Therefore, the temperature drift error ε1 and the temperature drift error ε2 can be regarded as substantially the same. That is, (1+ε1) and (1+ε2) in equation (3) are the same value. Therefore, the temperature drift error is canceled in equation (3). The MCU 1 derives the resistance value RHTR of the heater HTR by calculating the equation (3). Since the heater HTR has a characteristic that the resistance value changes according to the temperature, the temperature of the heater HTR can be obtained by deriving the resistance value RHTR.
Figure JPOXMLDOC01-appb-M000003
Figure JPOXMLDOC01-appb-M000003
　このように、式（３）の演算により、出力電圧ＶＯＵＴに生じ得る温度ドリフト誤差（正確には、出力電圧ＶＯＵＴに相当する情報を取得するために必要な電子部品（オペアンプＯＰ５及びＡＤＣ１ｂ）の出力に生じ得る温度ドリフト誤差）と、基準電圧Ｖｔｅｍｐに生じ得る温度ドリフト誤差（正確には、基準電圧Ｖｔｅｍｐに相当する情報を取得するために必要な電子部品（オペアンプＯＰ４及びＡＤＣ１ａ）の出力に生じ得る温度ドリフト誤差）とを相殺することができ、ヒータＨＴＲの抵抗値ＲＨＴＲをより精度よく導出することができる。換言すれば、ＭＣＵ１の温度の影響を受けずに、ヒータＨＴＲの抵抗値ＲＨＴＲが導出しやすくなる。 In this way, the calculation of equation (3) allows the temperature drift error that can occur in the output voltage V OUT (more precisely, the electronic components (op-amp OP5 and ADC1b) necessary to acquire information corresponding to the output voltage V OUT ). temperature drift error that may occur in the output of V temp) and temperature drift error that may occur in the reference voltage V temp (exactly, the electronic components (op amp OP4 and ADC1a) required to acquire information corresponding to the reference voltage V temp temperature drift error that may occur in the output) can be canceled, and the resistance value RHTR of the heater HTR can be derived more accurately. In other words, the resistance value RHTR of the heater HTR can be easily derived without being affected by the temperature of the MCU1.
　図２０の例では、ＭＣＵ１内部に、オペアンプＯＰ５及びＡＤＣ１ｂと、オペアンプＯＰ４及びＡＤＣ１ａと、が個別に設けられている。しかし、これらは共通化されていてもよい。つまり、出力電圧ＶＯＵＴの情報を取得するためのオペアンプ及びＡＤＣと、基準電圧Ｖｔｅｍｐの情報を取得するためのオペアンプ及びＡＤＣとを共通化し、デジタル値ＡＤＣ＿Ｖｔｅｍｐ（１＋ε１）と、デジタル値ＡＤＣ＿ＶＯＵＴ（１＋ε２）を時分割で得る構成としてもよい。この構成によれば、これら２つのデジタル値に生じる温度ドリフト誤差をより一致させることができ、ヒータＨＴＲの抵抗値ＲＨＴＲをより高精度に導出できる。 In the example of FIG. 20, operational amplifiers OP5 and ADC1b and operational amplifiers OP4 and ADC1a are separately provided inside the MCU1. However, these may be made common. That is, the operational amplifier and ADC for obtaining information on the output voltage V OUT and the operational amplifier and ADC for obtaining information on the reference voltage V temp are shared, and the digital value ADC_V temp (1+ε1) and the digital value ADC_V OUT (1+ε2) may be obtained by time division. According to this configuration, temperature drift errors occurring in these two digital values can be more matched, and the resistance value RHTR of the heater HTR can be derived with higher accuracy.
　なお、スイッチＳ４がオンの時におけるノードＮ３の電位は、ノードＮ１の電位とほぼ同じである。このため、ＭＣＵ１は、スイッチＳ３がオフ且つスイッチＳ４がオンの時に、ノードＮ１の電位を基準電圧Ｖｔｅｍｐとして取得し、ヒータＨＴＲの抵抗値の導出に用いてもよい。また、オペアンプＯＰ１の正電源端子に電圧を常時供給して電力消費が増えるのを許容するのであれば、オペアンプＯＰ１の正電源端子をノードＮ３ではなくノードＮ１に接続し、ノードＮ１と分圧回路Ｐｂとを接続してもよい。 Note that the potential of the node N3 when the switch S4 is on is substantially the same as the potential of the node N1. Therefore, when the switch S3 is off and the switch S4 is on, the MCU1 may acquire the potential of the node N1 as the reference voltage V temp and use it to derive the resistance value of the heater HTR. In addition, if the positive power supply terminal of the operational amplifier OP1 is always supplied with voltage and the increase in power consumption is allowed, the positive power supply terminal of the operational amplifier OP1 is connected to the node N1 instead of the node N3, and the node N1 and the voltage divider circuit are connected. Pb may be connected.
　図２４は、図２１の駆動例ＥＸ２におけるスイッチＳ３とスイッチＳ４が共にオンしているときの電流の流れを示した図である。図２４の状態では、ノードＮ１、スイッチＳ３、ノードＮ２、ノードＮ７、ヒータＨＴＲ、ノードＮ８、スイッチＳ６、及びグランドの順に電流が流れる第１加熱放電経路ＨＲ１と、ノードＮ１、スイッチＳ３、ノードＮ２、ノードＮ４、及びスイッチＳ５のゲート端子の順に電流が流れる第２加熱放電経路ＨＲ２と、ノードＮ１、リアクトルＬｄ、スイッチＳ４、ノードＮ３、及びオペアンプＯＰ１の正電源端子の順に電流が流れる第３検出放電経路ＭＲ３と、が形成される。 FIG. 24 is a diagram showing current flow when both the switch S3 and the switch S4 are on in the driving example EX2 of FIG. In the state of FIG. 24, the node N1, the switch S3, the node N2, the node N7, the heater HTR, the node N8, the switch S6, and the first heating discharge path HR1 through which the current flows in the order of the node N1, the switch S3, and the node N2. , node N4, and the gate terminal of switch S5, and a third detection path, through which current flows in the order of node N1, reactor Ld, switch S4, node N3, and the positive power supply terminal of operational amplifier OP1. A discharge path MR3 is formed.
　図２４の状態では、ノードＮ３とノードＮ４がほぼ同電位となるため、抵抗器Ｒｓにはほとんど電流が流れない。したがって、オペアンプＯＰ１の電源電圧は、駆動電圧Ｖｂｓｔとなる。つまり、この状態では、オペアンプＯＰ１の差動入力値の上限値が駆動電圧Ｖｂｓｔと等しくなる。このため、オペアンプＯＰ１の出力電圧は図２２の状態と比べて大きくなる。しかし、本実施形態では、図２４の状態において、ＭＣＵ１の端子Ｐ９に入力される電圧がＭＣＵ１の動作電圧（システム電源電圧Ｖｃｃ２）以下となるように、抵抗器Ｒ４とスイッチＳ５のオン抵抗の抵抗比が決められている。このため、ＭＣＵ１の端子Ｐ９に動作電圧以上の大きな電圧が入力されることはない。つまり、ＭＣＵ１の動作が安定する。 In the state of FIG. 24, the node N3 and the node N4 are at substantially the same potential, so that almost no current flows through the resistor Rs. Therefore, the power supply voltage of the operational amplifier OP1 becomes the drive voltage Vbst . That is, in this state, the upper limit value of the differential input value of the operational amplifier OP1 is equal to the driving voltage Vbst . Therefore, the output voltage of the operational amplifier OP1 becomes higher than in the state of FIG. However, in this embodiment, in the state shown in FIG. 24, the resistance of the resistor R4 and the ON resistance of the switch S5 is set so that the voltage input to the terminal P9 of the MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of the MCU1. ratio is determined. Therefore, a voltage higher than the operating voltage is not input to the terminal P9 of the MCU1. That is, the operation of MCU1 is stabilized.
　このように、吸引器１００では、図２２に示すように、スイッチＳ３がオン且つスイッチＳ４がオフの期間においては、第３加熱放電経路ＨＲ３によって、駆動電圧Ｖｂｓｔよりも小さい電圧をオペアンプＯＰ１の電源電圧として供給することができる。また、図２３に示すように、スイッチＳ４がオン且つスイッチＳ３がオフの期間においては、第３検出放電経路ＭＲ３によって、駆動電圧Ｖｂｓｔと同等の電圧をオペアンプＯＰ１の電源電圧として供給することができる。したがって、図２１に示したように、ヒータＨＴＲの加熱を開始し、その加熱を終了して、ヒータＨＴＲの温度検出を終了するまでの期間（スイッチ３のゲート電圧の立下りから、その直後のスイッチＳ４の立ち上がりまでの期間）において、オペアンプＯＰ１に連続して電源電圧を供給できる。したがって、スイッチＳ３のオン期間（ヒータＨＴＲの加熱期間）においてオペアンプＯＰ１に電源電圧を供給しない参考例と比較すると、温度検出制御時において、オペアンプＯＰ１の電源電圧が十分に立ち上がるまで待つ必要がなくなり、加熱制御と温度検出制御を効率的に実行することができる。 In this way, in the sucker 100, as shown in FIG. 22, during the period in which the switch S3 is on and the switch S4 is off, the third heating discharge path HR3 applies a voltage lower than the drive voltage Vbst to the operational amplifier OP1. It can be supplied as a power supply voltage. Further, as shown in FIG. 23, during the period in which the switch S4 is on and the switch S3 is off, a voltage equivalent to the drive voltage Vbst can be supplied as the power supply voltage of the operational amplifier OP1 through the third detection discharge path MR3. can. Therefore, as shown in FIG. 21, the period from the start of the heating of the heater HTR to the end of the heating until the end of the temperature detection of the heater HTR (from the fall of the gate voltage of the switch 3 to the period immediately after that). During the period until the switch S4 rises, the power supply voltage can be continuously supplied to the operational amplifier OP1. Therefore, compared with the reference example in which the power supply voltage is not supplied to the operational amplifier OP1 during the ON period of the switch S3 (heating period of the heater HTR), it is not necessary to wait until the power supply voltage of the operational amplifier OP1 sufficiently rises during the temperature detection control. Heating control and temperature detection control can be efficiently executed.
　特に、駆動例ＥＸ２によれば、加熱制御を行いながら、温度検出制御時に必要なオペアンプＯＰ１の電源電圧の供給が可能になる。このため、加熱制御が終了したタイミングで、オペアンプＯＰ１の電源電圧を十分に立ち上げた状態とすることができ、駆動例ＥＸ１と比べると、ヒータＨＴＲの加熱終了後、より早いタイミングで、ヒータＨＴＲの抵抗値を高精度に検出できるようになる。 In particular, according to the drive example EX2, it is possible to supply the power supply voltage of the operational amplifier OP1 required for temperature detection control while performing heating control. Therefore, the power supply voltage of the operational amplifier OP1 can be brought into a sufficiently raised state at the timing when the heating control is finished, and the heater HTR can be turned on at an earlier timing after the heating of the heater HTR is finished, as compared with the drive example EX1. can be detected with high accuracy.
　なお、図２１に示す駆動例ＥＸ１及び駆動例ＥＸ２のどちらにおいても、スイッチＳ４がオフになった後、次にスイッチＳ３がオンされるまでの期間は、オペアンプＯＰ１に電源電圧が供給されない場合がある。しかし、この期間の直後に行われるのは加熱制御であり、オペアンプＯＰ１の動作は必須ではない。このため、この期間においてオペアンプＯＰ１に電源電圧が供給されなくても支障はない。しかも、この期間においてはオペアンプＯＰ１による電力消費を無くすことができるため、吸引器１００全体の省電力化に寄与することができる。 In both the driving example EX1 and the driving example EX2 shown in FIG. 21, the power supply voltage may not be supplied to the operational amplifier OP1 during the period after the switch S4 is turned off until the switch S3 is turned on next time. be. However, it is the heating control that is performed immediately after this period, and the operation of the operational amplifier OP1 is not essential. Therefore, there is no problem even if the power supply voltage is not supplied to the operational amplifier OP1 during this period. Moreover, since power consumption by the operational amplifier OP1 can be eliminated during this period, it is possible to contribute to power saving of the sucker 100 as a whole.
　以上のように構成された吸引器１００において、図２０に示したスイッチＳ３、スイッチＳ４、及びスイッチＳ６は、それぞれ好ましい構成がある。以下、各スイッチの好ましい例について説明する。 In the aspirator 100 configured as above, the switch S3, switch S4, and switch S6 shown in FIG. 20 each have a preferred configuration. Preferred examples of each switch will be described below.
＜スイッチＳ３の好ましい構成＞
　スイッチＳ３は、ヒータＨＴＲを加熱する際に、ヒータＨＴＲにより多くの電流が流れるようにするために、オン抵抗値が小さい（換言すると、チップサイズが大きい）構成が好ましい。以下では、スイッチＳ３、スイッチＳ４、及びスイッチＳ６のそれぞれのオン抵抗値を比較する場合には、温度及び流れる電流が同じという条件下で比較を行うものとする。 <Preferred Configuration of Switch S3>
The switch S3 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR. In the following description, when comparing the on-resistance values of the switches S3, S4, and S6, the comparison is performed under the condition that the temperature and the flowing current are the same.
　スイッチＳ３は、ヒータＨＴＲを加熱する際に、ＰＷＭ制御又はＰＦＭ制御等によって高速でオンオフされる。このため、瞬間的に出力可能な最大電流値（パルス状で出力可能な最大電流値）は、大きいことが好ましい。また、スイッチＳ３は、多くの電流をヒータＨＴＲに流す観点と、スイッチＳ４よりもオン時間が長くなる観点とから、連続して出力可能な最大電流値は、スイッチＳ４よりも大きいことが好ましい。以下では、スイッチＳ３、スイッチＳ４、及びスイッチＳ６のそれぞれが出力可能な最大電流値を比較する場合には、温度が同じという条件下で比較を行うものとする。 The switch S3 is turned on and off at high speed by PWM control, PFM control, or the like when heating the heater HTR. For this reason, it is preferable that the maximum current value that can be output instantaneously (maximum current value that can be output in a pulse form) is large. Moreover, the switch S3 preferably has a maximum current value that can be continuously output larger than that of the switch S4 from the viewpoints of allowing a large amount of current to flow through the heater HTR and having a longer ON time than the switch S4. Hereinafter, when comparing the maximum current values that can be output from each of the switches S3, S4, and S6, the comparison is performed under the condition that the temperatures are the same.
　スイッチＳ３は、図２０に例示したように、Ｐチャネル型ＭＯＳＦＥＴであることが好ましい。スイッチＳ３は、Ｎチャネル型ＭＯＳＦＥＴで構成することも可能である。しかし、スイッチＳ３をＮチャネル型ＭＯＳＦＥＴで構成した場合には、スイッチＳ３をオンするために、ＭＣＵ１の端子Ｐ１６からスイッチＳ３のゲート端子に供給する電圧を、駆動電圧Ｖｂｓｔよりも大きい値にする必要があり、ＭＣＵ１の電源電圧を高くする必要がある。これに対し、スイッチＳ３をＰチャネル型ＭＯＳＦＥＴで構成すれば、ＭＣＵ１の電源電圧を駆動電圧Ｖｂｓｔよりも下げることができるため、ＭＣＵ１の消費電力を抑えることができる。 Switch S3 is preferably a P-channel MOSFET, as illustrated in FIG. The switch S3 can also be composed of an N-channel MOSFET. However, when the switch S3 is composed of an N-channel MOSFET, the voltage supplied from the terminal P16 of the MCU1 to the gate terminal of the switch S3 is set to a value higher than the drive voltage Vbst in order to turn on the switch S3. It is necessary to raise the power supply voltage of MCU1. On the other hand, if the switch S3 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
＜スイッチＳ４の好ましい構成＞
　スイッチＳ４は、抵抗器ＲｓとヒータＨＴＲの直列回路に十分な大きさの電圧を印加できるように、オン抵抗値を小さくすることが好ましい。ただし、オン抵抗値を小さくしすぎると、サイズが大きくなることから、回路面積を削減するために、スイッチＳ４のオン抵抗値は、スイッチＳ３のオン抵抗値よりも大きいことが好ましい。ヒータＨＴＲの抵抗値を検出するための電流がヒータＨＴＲの温度を変化させないためにも、スイッチＳ４のオン抵抗値は小さすぎないことが好ましい。具体的には、スイッチＳ４のオン抵抗値は、抵抗器Ｒｓの抵抗値より小さく、スイッチ３のオン抵抗値よりも大きい値とすることが好ましい。 <Preferred Configuration of Switch S4>
The switch S4 preferably has a small on-resistance so that a sufficient voltage can be applied to the series circuit of the resistor Rs and the heater HTR. However, if the on-resistance value is made too small, the size increases. Therefore, in order to reduce the circuit area, the on-resistance value of the switch S4 is preferably larger than the on-resistance value of the switch S3. In order that the current for detecting the resistance value of the heater HTR does not change the temperature of the heater HTR, it is preferable that the ON resistance value of the switch S4 is not too small. Specifically, the on-resistance value of the switch S4 is preferably smaller than the resistance value of the resistor Rs and larger than the on-resistance value of the switch 3 .
　図２１に例示したように、ヒータＨＴＲの抵抗値の検出は、ヒータＨＴＲの加熱よりも短時間で行う必要がある。また、スイッチＳ６は加熱モードでは常時オンされることから応答性は高くなくてよい。このため、スイッチＳ４の応答性は、スイッチＳ３及びスイッチＳ６の応答性よりも高いことが好ましい。トランジスタの応答性を示す指標としては、ターンオン時間ｔｏｎ、ターンオン遅れ時間ｔｄ（ｏｎ）、上昇時間ｔｒ、ターンオフ時間ｔｏｆｆ、ターンオフ遅れ時間ｔｄ（ｏｆｆ）、及び下降時間ｔｆがある。 As illustrated in FIG. 21, the detection of the resistance value of the heater HTR needs to be performed in a shorter time than the heating of the heater HTR. Also, since the switch S6 is always turned on in the heating mode, it does not have to be highly responsive. Therefore, the responsiveness of the switch S4 is preferably higher than the responsiveness of the switches S3 and S6. Indicators of transistor responsiveness include turn-on time t on , turn-on delay time t d(on) , rise time t r , turn-off time t off , turn-off delay time t d(off) , and fall time t f . .
　ターンオン遅れ時間ｔｄ（ｏｎ）は、ターンオン時に、ゲート・ソース間電圧が設定値の１０％に達してから、ドレイン・ソース間電圧が設定値の９０％まで達するのに要する時間である。
　上昇時間ｔｒは、ターンオン時に、ドレイン・ソース間電圧が設定値の９０％から１０％まで達するのに要する時間である。
　ターンオン時間ｔｏｎは、ターンオン遅れ時間ｔｄ（ｏｎ）と上昇時間ｔｒの合計値である。
　ターンオフ遅れ時間ｔｄ（ｏｆｆ）は、ターンオフ時に、ゲート・ソース間電圧が設定値の９０％に達してから、ドレイン・ソース間電圧が設定値の１０％まで達するのに要する時間である。
　下降時間ｔｆは、ターンオフ時に、ドレイン・ソース間電圧が設定値の１０％から９０％まで達するのに要する時間である。
　ターンオフ時間ｔｏｆｆは、ターンオフ遅れ時間ｔｄ（ｏｆｆ）と下降時間ｔｆの合計値である。 The turn-on delay time td (on) is the time required for the drain-source voltage to reach 90% of the set value after the gate-source voltage reaches 10% of the set value at turn-on.
The rise time tr is the time required for the drain-source voltage to reach from 90% to 10% of the set value at turn-on.
Turn-on time t on is the sum of turn-on delay time t d(on) and rise time t r .
The turn-off delay time td (off) is the time required for the drain-source voltage to reach 10% of the set value after the gate-source voltage reaches 90% of the set value at turn-off.
The fall time tf is the time required for the drain-source voltage to reach from 10% to 90% of the set value at turn-off.
The turn-off time toff is the sum of the turn- off delay time td (off) and the fall time tf .
　ヒータＨＴＲの抵抗値の検出は、ヒータＨＴＲの加熱よりも短時間で行う必要がある。このため、スイッチＳ４のターンオン遅れ時間又は上昇時間は、スイッチＳ３及びスイッチＳ６のそれぞれのターンオン遅れ時間又は上昇時間より短いことが好ましい。同様に、スイッチＳ４のターンオフ遅れ時間又は下降時間は、スイッチＳ３及びスイッチＳ６のそれぞれのターンオフ遅れ時間又は下降時間より短いことが好ましい。 　The resistance value of the heater HTR must be detected in a shorter time than the heating of the heater HTR. For this reason, the turn-on delay or rise time of switch S4 is preferably shorter than the turn-on delay or rise time of switches S3 and S6, respectively. Similarly, the turn-off delay or fall time of switch S4 is preferably shorter than the turn-off delay or fall time of switches S3 and S6, respectively.
　スイッチＳ４は、図２０に例示したように、Ｐチャネル型ＭＯＳＦＥＴであることが好ましい。スイッチＳ４は、Ｎチャネル型ＭＯＳＦＥＴで構成することも可能である。しかし、スイッチＳ４をＮチャネル型ＭＯＳＦＥＴで構成した場合には、スイッチＳ４をオンするために、ＭＣＵ１の端子Ｐ１５からスイッチＳ４のゲート端子に供給する電圧を、駆動電圧Ｖｂｓｔよりも大きい値にする必要があり、ＭＣＵ１の電源電圧が高くなる。これに対し、スイッチＳ４をＰチャネル型ＭＯＳＦＥＴで構成すれば、ＭＣＵ１の電源電圧を駆動電圧Ｖｂｓｔよりも下げることができるため、ＭＣＵ１の消費電力を抑えることができる。 Switch S4 is preferably a P-channel MOSFET, as illustrated in FIG. The switch S4 can also be composed of an N-channel MOSFET. However, when the switch S4 is composed of an N-channel MOSFET, the voltage supplied from the terminal P15 of the MCU1 to the gate terminal of the switch S4 is set to a value higher than the drive voltage Vbst in order to turn on the switch S4. Therefore, the power supply voltage of MCU1 is increased. On the other hand, if the switch S4 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
＜スイッチＳ６の好ましい構成＞
　スイッチＳ６は、ヒータＨＴＲを加熱する際に、ヒータＨＴＲにより多くの電流が流れるようにするために、オン抵抗値が小さい（換言すると、チップサイズが大きい）構成が好ましい。具体的には、スイッチＳ６のオン抵抗値は、スイッチＳ３のオン抵抗値と同等にすることが好ましい。 <Preferred Configuration of Switch S6>
The switch S6 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR. Specifically, the on-resistance value of the switch S6 is preferably equal to the on-resistance value of the switch S3.
　スイッチＳ６は、加熱モードにおいて継続的に電流を流す必要がある。このため、スイッチＳ６が連続して出力可能な最大電流値は、スイッチＳ４及びスイッチＳ３より大きいことが好ましい。一方、スイッチＳ６は加熱モードにおいては常時オンされるため、スイッチＳ６が瞬間的に出力可能（パルス状で出力可能）な最大電流値は、オンオフが繰り返されるスイッチＳ３より小さくすることが好ましい。スイッチＳ６の用途に対して瞬間的に出力可能（パルス状で出力可能）な最大電流値を過大にしてしまうと、スイッチＳ６のチップサイズやコストが増大してしまう虞がある。 The switch S6 needs to pass current continuously in the heating mode. Therefore, it is preferable that the maximum current value that the switch S6 can continuously output is larger than that of the switches S4 and S3. On the other hand, since the switch S6 is always turned on in the heating mode, it is preferable that the maximum current value that the switch S6 can instantaneously output (output in pulse form) is smaller than that of the switch S3, which is repeatedly turned on and off. If the maximum current value that can be instantaneously output (output in the form of a pulse) is excessively increased for the application of the switch S6, the chip size and cost of the switch S6 may increase.
　また、スイッチＳ３は、回路上の高電位な箇所に接続されるため、安全性の観点からスイッチＳ６よりも応答性を向上させにくい。そこで、スイッチＳ６の応答性をスイッチＳ３よりも高めることが、回路全体の応答性を高めるうえで有効となる。具体的には、スイッチＳ６のターンオフ遅れ時間又は下降時間は、スイッチＳ３のターンオフ遅れ時間又は下降時間より短いことが好ましい。同様に、スイッチＳ６のターンオン遅れ時間又は上昇時間は、スイッチＳ３のターンオン遅れ時間又は上昇時間より短いことが好ましい。 Also, since the switch S3 is connected to a high-potential location on the circuit, it is more difficult to improve the responsiveness than the switch S6 from the viewpoint of safety. Therefore, making the switch S6 more responsive than the switch S3 is effective in improving the responsiveness of the entire circuit. Specifically, the turn-off delay time or fall time of switch S6 is preferably shorter than the turn-off delay time or fall time of switch S3. Similarly, the turn-on delay or rise time of switch S6 is preferably shorter than the turn-on delay or rise time of switch S3.
　スイッチＳ６は、図２０に例示したように、Ｎチャネル型ＭＯＳＦＥＴであることが好ましい。スイッチＳ６は、Ｐチャネル型ＭＯＳＦＥＴで構成することも可能である。しかし、スイッチＳ６をＰチャネル型ＭＯＳＦＥＴで構成した場合には、スイッチＳ６をオンするために、ＭＣＵ１の端子Ｐ１４からスイッチＳ６のゲート端子に供給する電圧を、グランドレベルよりも小さい値にする必要がある。グランドレベルよりも小さい電圧を生成しようとすると、負電源やレール・スプリッタ回路などの専用の回路が必要になってしまう。これに対し、スイッチＳ６をＮチャネル型ＭＯＳＦＥＴで構成すれば、ＭＣＵ１は自身の電源電圧相当の電圧をゲート端子へ入力すればスイッチＳ６をオンできるため、回路が複雑になることを抑えることができる。また、スイッチＳ６をＮチャネル型ＭＯＳＦＥＴで構成すれば、スイッチＳ６のオンと同時に、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮにハイレベルの信号を入力して、昇圧ＤＣ／ＤＣコンバータ９から駆動電圧Ｖｂｓｔを出力させることができる。スイッチＳ６をＰチャネル型ＭＯＳＦＥＴで構成した場合には、昇圧ＤＣ／ＤＣコンバータ９のイネーブル端子ＥＮとスイッチＳ６のゲート端子の間に論理反転用のインバータを接続する必要がある。しかし、スイッチＳ６をＮチャネル型ＭＯＳＦＥＴで構成することで、このようなインバータを不要にでき、回路規模の削減、製造コストの削減を実現できる。 Switch S6 is preferably an N-channel MOSFET, as illustrated in FIG. The switch S6 can also be composed of a P-channel MOSFET. However, when the switch S6 is composed of a P-channel MOSFET, it is necessary to set the voltage supplied from the terminal P14 of the MCU1 to the gate terminal of the switch S6 to a value lower than the ground level in order to turn on the switch S6. be. Generating voltages below ground requires specialized circuitry such as negative power supplies and rail splitter circuits. On the other hand, if the switch S6 is composed of an N-channel MOSFET, the MCU 1 can turn on the switch S6 by inputting a voltage equivalent to its own power supply voltage to the gate terminal, thereby suppressing the complexity of the circuit. . Further, if the switch S6 is composed of an N-channel MOSFET, a high level signal is input to the enable terminal EN of the boost DC/DC converter 9 at the same time when the switch S6 is turned on, and the drive voltage is output from the boost DC/DC converter 9. V bst can be output. If the switch S6 is composed of a P-channel MOSFET, it is necessary to connect an inverter for logic inversion between the enable terminal EN of the boost DC/DC converter 9 and the gate terminal of the switch S6. However, by configuring the switch S6 with an N-channel MOSFET, such an inverter can be made unnecessary, and a reduction in circuit scale and manufacturing cost can be realized.
　このように、スイッチＳ３、スイッチＳ４、及びスイッチＳ６は、それぞれ異なる構成とすることが好ましい。本明細書において、トランジスタを含んで構成されるスイッチの構成が異なるとは、トランジスタの種類が異なること、トランジスタの仕様（オン抵抗値及び応答性等）が異なること、の少なくとも一方を満たすことを言う。このような構成とすることで、３つのスイッチの全てが同種類及び同仕様である場合に比べて、各スイッチの種類及び仕様を、それぞれが接続される箇所に応じたものとすることができる。このため、吸引器１００の性能を向上させることができる。 Thus, it is preferable that the switch S3, the switch S4, and the switch S6 have different configurations. In this specification, the term "switches having different configurations including transistors" means that at least one of the types of transistors and the specifications of the transistors (on-resistance, responsiveness, etc.) is different. To tell. By adopting such a configuration, compared to the case where all three switches are of the same type and specifications, the type and specifications of each switch can be made to correspond to the location where each switch is connected. . Therefore, the performance of the aspirator 100 can be improved.
　なお、図２０に示した回路において、スイッチＳ６を省略し、ノードＮ８をグランドに直接接続する構成とすることも可能である。この場合でも、スイッチＳ３とスイッチＳ４を異なる構成とすることで、２つのスイッチの全てが同種類及び同仕様である場合に比べて、各スイッチの種類及び仕様を、それぞれが接続される箇所に応じたものとすることができる。このため、吸引器１００の性能を向上させることができる。 In addition, in the circuit shown in FIG. 20, it is also possible to omit the switch S6 and directly connect the node N8 to the ground. Even in this case, by configuring the switch S3 and the switch S4 differently, compared to the case where all the two switches are of the same type and specifications, the type and specifications of each switch can be changed to where they are connected. can be made accordingly. Therefore, the performance of the aspirator 100 can be improved.
＜電子部品の好ましい配置＞
　次に、図２０に示す回路における主要な電子部品のレセプタクル搭載基板１６２における設置箇所の好ましい例について説明する。 <Preferred Arrangement of Electronic Components>
Next, a preferred example of the installation locations of the main electronic components in the circuit shown in FIG. 20 on the receptacle mounting board 162 will be described.
　図２５は、レセプタクル搭載基板１６２を主面１６２ａ側から見た平面図である。図２６は、レセプタクル搭載基板１６２を副面１６２ｂ側から見た平面図である。図２５に示すように、レセプタクル搭載基板１６２の主面１６２ａには、図２０に示した電子部品のうち、リアクトルＬｃ、抵抗器Ｒｓ、スイッチＳ４、スイッチＳ６、及びヒータコネクタＣｎが設けられる。図２６に示すように、レセプタクル搭載基板１６２の副面１６２ｂには、図２０に示した電子部品のうち、昇圧ＤＣ／ＤＣコンバータ９、スイッチＳ３、抵抗器ＲＰｂ１、及び抵抗器ＲＰｂ２が設けられる。 FIG. 25 is a plan view of the receptacle mounting substrate 162 viewed from the main surface 162a side. FIG. 26 is a plan view of the receptacle mounting substrate 162 viewed from the side of the secondary surface 162b. As shown in FIG. 25, the main surface 162a of the receptacle mounting substrate 162 is provided with the reactor Lc, resistor Rs, switch S4, switch S6, and heater connector Cn among the electronic components shown in FIG. As shown in FIG. 26, the secondary surface 162b of the receptacle mounting board 162 is provided with the boost DC/DC converter 9, the switch S3, the resistor R Pb1 , and the resistor R Pb2 among the electronic components shown in FIG. be done.
　副面１６２ｂにおいて、抵抗器ＲＰｂ１と抵抗器ＲＰｂ２は近接配置されている。抵抗器ＲＰｂ１と抵抗器ＲＰｂ２は、ノードＮ３の電位を分圧する分圧回路Ｐｂを構成している。抵抗器ＲＰｂ１と抵抗器ＲＰｂ２の温度に差が生じると、分圧回路Ｐｂの分圧比が変動し、ヒータＨＴＲの抵抗値を導出するために必要なノードＮ３の電位の取得精度が低下する。図２６に示すように、抵抗器ＲＰｂ１と抵抗器ＲＰｂ２が、レセプタクル搭載基板１６２の同一面に実装され、更に、近接して配置されることで、抵抗器ＲＰｂ１と抵抗器ＲＰｂ２の温度に差が生じるのを防ぐことができる。この効果を高めるために、レセプタクル搭載基板１６２に実装される電子部品のうち、抵抗器ＲＰｂ１に最も近い電子部品を、抵抗器ＲＰｂ２とすることが好ましい。 On minor surface 162b, resistor RPb1 and resistor RPb2 are closely spaced. A resistor RPb1 and a resistor RPb2 form a voltage dividing circuit Pb that divides the potential of the node N3. If there is a temperature difference between the resistor RPb1 and the resistor RPb2 , the voltage division ratio of the voltage dividing circuit Pb fluctuates, and the accuracy of obtaining the potential of the node N3 required to derive the resistance value of the heater HTR decreases. . As shown in FIG. 26, the resistor RPb1 and the resistor RPb2 are mounted on the same surface of the receptacle mounting board 162, and are arranged close to each other, so that the resistor RPb1 and the resistor RPb2 are mounted on the same surface. It can prevent temperature differences. In order to enhance this effect, it is preferable that the electronic component closest to the resistor RPb1 among the electronic components mounted on the receptacle mounting substrate 162 is the resistor RPb2 .
　図２５及び図２６に示す電子部品のうち熱源又はノイズ源となり得るものとしては、スイッチＳ３、昇圧ＤＣ／ＤＣコンバータ９、リアクトルＬｃ、及びヒータコネクタＣｎが挙げられる。これらのうち、最も発熱量が大きいのはスイッチＳ３であり、その次に発熱量が大きいのは昇圧ＤＣ／ＤＣコンバータ９である。図２５及び図２６の例では、発熱量の大きいスイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９と、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓとが同じ基板の別面に搭載されている。換言すれば、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９は副面１６２ｂに搭載され、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓは主面１６２ａに搭載される。このようにすることで、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓが、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９から熱又はノイズの影響を受けるのを抑制できる。 Among the electronic components shown in FIGS. 25 and 26, those that can become heat sources or noise sources include the switch S3, the step-up DC/DC converter 9, the reactor Lc, and the heater connector Cn. Among these, the switch S3 generates the largest amount of heat, and the step-up DC/DC converter 9 generates the second largest amount of heat. In the examples of FIGS. 25 and 26, the switch S3 and the step-up DC/DC converter 9, which generate a large amount of heat, the switch S4, the switch S6, and the resistor Rs are mounted on different surfaces of the same substrate. In other words, switch S3 and boost DC/DC converter 9 are mounted on minor surface 162b, and switch S4, switch S6 and resistor Rs are mounted on main surface 162a. By doing so, it is possible to suppress the influence of heat or noise from the switch S3 and the boost DC/DC converter 9 on the switch S4, the switch S6 and the resistor Rs.
　また、図２５に示す例では、レセプタクル搭載基板１６２の素子搭載面（主面１６２ａ及び副面１６２ｂ）に直交する方向に見た状態で、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９と、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓと、が重ならないように配置されている。このようにすることで、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９で発生した熱又はノイズが、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓへ基板を介して伝わりにくくなる。つまり、スイッチＳ４、スイッチＳ６、及び抵抗器Ｒｓが、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９から熱又はノイズの影響を受けるのをより強く抑制できる。 In the example shown in FIG. 25, the switch S3 and the step-up DC/DC converter 9, the switch S4, the switch S4, and the The switch S6 and the resistor Rs are arranged so as not to overlap. By doing so, the heat or noise generated by the switch S3 and the boost DC/DC converter 9 is less likely to be transmitted to the switch S4, the switch S6 and the resistor Rs through the substrate. That is, the switch S4, the switch S6, and the resistor Rs can be more strongly suppressed from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9.
　なお、図２５及び図２６に示す例において、例えば、スイッチＳ４又はスイッチＳ６を副面１６２ｂに実装する構成としてもよい。このようにすることでも、スイッチＳ４とスイッチＳ６のいずれかが、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９からの熱又はノイズの影響を受けるのを防ぐことができる。 In the examples shown in FIGS. 25 and 26, for example, the switch S4 or the switch S6 may be mounted on the secondary surface 162b. By doing so, either the switch S4 or the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9. FIG.
　また、図２０に示した回路の電子部品のうち、スイッチＳ４とスイッチＳ６の少なくとも一方は、レセプタクル搭載基板１６２とは別の基板（例えば、ＭＣＵ搭載基板１６１等）に実装される構成としてもよい。このようにすることでも、スイッチＳ４とスイッチＳ６の少なくとも一方が、スイッチＳ３及び昇圧ＤＣ／ＤＣコンバータ９からの熱又はノイズの影響を受けるのを防ぐことができる。 At least one of the switches S4 and S6 among the electronic components of the circuit shown in FIG. 20 may be mounted on a board different from the receptacle mounting board 162 (for example, the MCU mounting board 161, etc.). . By doing so, at least one of the switch S4 and the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the boost DC/DC converter 9 .
　図２５には、主面１６２ａにおいて抵抗器Ｒｓが実装される実装領域と、主面１６２ａにおいてリアクトルＬｃが実装される実装領域との間の距離ＤＳ４（２つの実装領域を最短距離で結ぶ直線の長さ）が示されている。また、図２５には、主面１６２ａにおいてスイッチＳ４が実装される実装領域と、主面１６２ａにおいてリアクトルＬｃが実装される実装領域との間の距離ＤＳ５（２つの実装領域を最短距離で結ぶ直線の長さ）が示されている。そして、距離ＤＳ４は、距離ＤＳ５よりも短くなっている。 FIG. 25 shows a distance DS4 between the mounting area where the resistor Rs is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (the straight line connecting the two mounting areas at the shortest distance). length) is shown. FIG. 25 also shows a distance DS5 between the mounting area where the switch S4 is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (a straight line connecting the two mounting areas at the shortest distance). length) is shown. And the distance DS4 is shorter than the distance DS5.
　抵抗器Ｒｓの抵抗値は、スイッチＳ４のオン抵抗値と比べると、温度による変動の影響を受けにくい。したがって、温度変化の影響を受けにくい抵抗器Ｒｓについては、スイッチＳ４よりもリアクトルＬｃの近くに配置することで、基板面積を有効活用することができる。 The resistance value of the resistor Rs is less susceptible to temperature fluctuations than the on-resistance value of the switch S4. Therefore, the substrate area can be effectively utilized by arranging the resistor Rs, which is less susceptible to temperature changes, closer to the reactor Lc than the switch S4.
　更に、図２５の例では、スイッチＳ４とリアクトルＬｃの間に抵抗器Ｒｓが実装されている。つまり、抵抗器Ｒｓの実装領域は、スイッチＳ４の実装領域とリアクトルＬｃの実装領域とを結ぶ直線上に存在している。このようにすることで、抵抗器Ｒｓが、リアクトルＬｃで発生する熱からスイッチＳ４を守る物理的な障壁となる。この結果、スイッチＳ４の温度が変化するのを強く抑制することができる。スイッチＳ４のオン抵抗値が変動してしまうと、ヒータＨＴＲの抵抗値の計測精度に影響が出る。そのため、スイッチＳ４の温度変化を抑制することは特に重要である。 Furthermore, in the example of FIG. 25, a resistor Rs is mounted between the switch S4 and the reactor Lc. That is, the mounting area of the resistor Rs exists on a straight line connecting the mounting area of the switch S4 and the mounting area of the reactor Lc. By doing so, the resistor Rs becomes a physical barrier that protects the switch S4 from the heat generated by the reactor Lc. As a result, it is possible to strongly suppress the temperature change of the switch S4. If the on-resistance value of the switch S4 fluctuates, it affects the measurement accuracy of the resistance value of the heater HTR. Therefore, it is particularly important to suppress the temperature change of switch S4.
　図２７は、図２５に示す範囲Ｈの拡大図である。図２７に示すように、レセプタクル搭載基板１６２の主面１６２ａにおいて、スイッチＳ４の実装領域と、ヒータコネクタＣｎの実装領域とは離間しているが、これらの間には、図２０に示した回路における抵抗器ＲＳ４及びバイポーラトランジスタＴＳ４が実装されている。換言すると、スイッチＳ４の実装領域とヒータコネクタＣｎの実装領域とを結ぶ直線ＤＬ１及び直線ＤＬ２のそれぞれの上に、抵抗器ＲＳ４とバイポーラトランジスタＴＳ４が実装されている。この構成によれば、抵抗器ＲＳ４とバイポーラトランジスタＴＳ４が、ヒータコネクタＣｎで発生する熱からスイッチＳ４を守る物理的な障壁となる。この結果、スイッチＳ４の温度が変化するのを強く抑制することができる。 27 is an enlarged view of range H shown in FIG. 25. FIG. As shown in FIG. 27, on the main surface 162a of the receptacle mounting substrate 162, the mounting area of the switch S4 and the mounting area of the heater connector Cn are separated from each other. A resistor R S4 and a bipolar transistor T S4 at are implemented. In other words, the resistor R S4 and the bipolar transistor T S4 are mounted on the straight lines DL1 and DL2 connecting the mounting area of the switch S4 and the mounting area of the heater connector Cn, respectively. According to this configuration, resistor R S4 and bipolar transistor T S4 provide a physical barrier to protect switch S4 from heat generated at heater connector Cn. As a result, it is possible to strongly suppress the temperature change of the switch S4.
　また、図２５及び図２７に示すように、スイッチＳ４は、レセプタクル搭載基板１６２の主面１６２ａにおける外縁の近傍に配置されている。具体的には、レセプタクル搭載基板１６２の主面１６２ａにおいて、スイッチＳ４の実装領域と、主面１６２ａの右方向の縁１６２ｅのうち最もスイッチＳ４の実装領域に近い縁である最近接縁１６２ｅｍとの間の距離ＤＳ１は、レセプタクル搭載基板１６２の主面１６２ａにおける左右方向の中心とスイッチＳ４の実装領域との間の距離ＤＳ２よりも短くなっている。このように、スイッチＳ４は、レセプタクル搭載基板１６２の縁の近傍に配置されることで、他の電子部品が発生する熱の影響を受けにくくなっている。特に、図２７に示すように、最近接縁１６２ｅｍとスイッチＳ４の間に他の電子部品が存在しないようにする、換言すると、レセプタクル搭載基板１６２上において最近接縁１６２ｅｍに最も近い電子部品をスイッチＳ４とすることで、スイッチＳ４の温度変化をより抑制することができる。 Also, as shown in FIGS. 25 and 27, the switch S4 is arranged near the outer edge of the main surface 162a of the receptacle mounting substrate 162. As shown in FIGS. Specifically, on the main surface 162a of the receptacle mounting board 162, the switch S4 mounting area and the closest edge 162em, which is the edge closest to the switch S4 mounting area among the rightward edges 162e of the main surface 162a, are separated. The distance DS1 between them is shorter than the distance DS2 between the center of the main surface 162a of the receptacle mounting board 162 in the horizontal direction and the mounting area of the switch S4. In this way, the switch S4 is arranged near the edge of the receptacle mounting board 162, so that it is less likely to be affected by heat generated by other electronic components. In particular, as shown in FIG. 27, there should be no other electronic components between the closest edge 162em and the switch S4. By using S4, the temperature change of the switch S4 can be further suppressed.
　また、図２７に示す例では、レセプタクル搭載基板１６２の主面１６２ａにおける抵抗器Ｒｓの実装領域と、縁１６２ｅのうち最も抵抗器Ｒｓの実装領域に近い縁１６２ｅｎとの間の距離ＤＳ３は、距離ＤＳ１よりも大きくなっている。前述したように、抵抗器Ｒｓは、スイッチＳ４よりも温度変化の影響を受けにくい。そこで、抵抗器Ｒｓについては、レセプタクル搭載基板１６２の中央に近づけて配置することで、基板面積を有効活用できる。 In the example shown in FIG. 27, the distance DS3 between the mounting area of the resistor Rs on the main surface 162a of the receptacle mounting board 162 and the edge 162en closest to the mounting area of the resistor Rs among the edges 162e is the distance It is larger than DS1. As previously mentioned, resistor Rs is less sensitive to temperature changes than switch S4. Therefore, by arranging the resistor Rs close to the center of the receptacle mounting board 162, the board area can be effectively utilized.
＜スイッチＳ４の好ましい形態＞
　スイッチＳ４は、オン時においてゲート・ソース間に印加される電圧ＶＧＳ（絶対値）を、できるだけ高い値とすることが好ましい。つまり、スイッチＳ４がＰチャネル型のＭＯＳＦＥＴである場合には、オン時においてゲート・ソース間に印加される電圧ＶＧＳを、できるだけ大きな－の値とすることが好ましい。こうすることで、スイッチＳ４のオン抵抗値を下げることができ、オン時におけるジュール熱を減らして、スイッチＳ４の温度変動を抑制できるためである。具体的には、スイッチＳ４のゲート・ソース間に印加できる電圧の最大定格値（絶対値）を電圧ＶＧＳＳとし、スイッチＳ４のゲート・ソース間の電圧の閾値（絶対値）を電圧Ｖｔｈとすると、ＭＣＵ１は、電圧ＶＧＳ（絶対値）が、電圧ＶＧＳＳと電圧Ｖｔｈのうち、電圧ＶＧＳＳに近い値となるように、スイッチＳ４のゲート端子に印加する電圧を制御することが好ましい。換言すると、電圧ＶＧＳＳと電圧ＶＧＳ（絶対値）の差の絶対値が、電圧Ｖｔｈと電圧ＶＧＳ（絶対値）との差の絶対値よりも小さくなるように、スイッチＳ４のゲート端子に印加する電圧を制御することが好ましい。 <Preferred Form of Switch S4>
It is preferable that the voltage V GS (absolute value) applied between the gate and the source when the switch S4 is turned on is as high as possible. That is, when the switch S4 is a P-channel MOSFET, it is preferable to set the voltage VGS applied between the gate and the source when it is on to a negative value as large as possible. This is because the on-resistance value of the switch S4 can be lowered by doing so, the Joule heat generated when the switch S4 is on can be reduced, and the temperature fluctuation of the switch S4 can be suppressed. Specifically, the maximum rated value (absolute value) of the voltage that can be applied between the gate and source of the switch S4 is defined as voltage V GSS , and the threshold voltage (absolute value) between the gate and source of switch S4 is defined as voltage V th . Then, the MCU 1 preferably controls the voltage applied to the gate terminal of the switch S4 so that the voltage V GS (absolute value) is closer to the voltage V GSS between the voltage V GSS and the voltage V th . . In other words, the gate terminal of the switch S4 is set such that the absolute value of the difference between the voltage V GSS and the voltage V GS (absolute value) is smaller than the absolute value of the difference between the voltage V th and the voltage V GS (absolute value). It is preferable to control the voltage applied to .
　このように、電圧ＶＧＳ（絶対値）を高い値にするために、スイッチＳ４のゲート端子とソース端子の間に、バリスタ等の過電圧保護ダイオードを設けることが好ましい。この過電圧保護ダイオードがあることで、昇圧ＤＣ／ＤＣコンバータ９におけるスイッチングにより生じ得るサージ電圧がスイッチＳ４に印加された場合でも、その値を最大定格値以下とすることができる。この結果、スイッチＳ４が故障しにくくなり、吸引器１００の耐久性を向上できる。 In order to make the voltage V GS (absolute value) high, it is preferable to provide an overvoltage protection diode such as a varistor between the gate terminal and the source terminal of the switch S4. With this overvoltage protection diode, even if a surge voltage that can be generated by switching in the boost DC/DC converter 9 is applied to the switch S4, the surge voltage can be kept below the maximum rated value. As a result, the switch S4 is less likely to fail, and the durability of the suction device 100 can be improved.
　本明細書には少なくとも以下の事項が記載されている。なお、括弧内には、上記した実施形態において対応する構成要素等を示しているが、これに限定されるものではない。 At least the following matters are described in this specification. In addition, although the parenthesis shows the components corresponding to the above-described embodiment, the present invention is not limited to this.
（１）
　電源（電源ＢＡＴ）と、
　＋極と－極とを含み、上記電源から供給される電力を消費してエアロゾル源を加熱するヒータ（ヒータＨＴＲ）が上記＋極と上記－極へ接続されるヒータコネクタ（ヒータコネクタＣｎ）と、
　上記＋極と上記－極の一方へ接続された、第１スイッチ（スイッチＳ４）と固定抵抗器（抵抗器Ｒｓ）とを含む第１分岐回路（リアクトルＬｄ、スイッチＳ４、及び抵抗器Ｒｓの直列回路と、この直列回路とノードＮ１及びノードＮ２とを接続する配線とを含む回路）と、
　上記＋極と上記－極の一方へ接続された、第２スイッチ（スイッチＳ３）を含み且つ上記第１分岐回路へ並列接続される第２分岐回路（スイッチＳ３とノードＮ１及びノードＮ２とを接続する配線を含む回路）と、
　上記＋極と上記－極の他方へ接続される第３スイッチ（スイッチＳ６）と、
　Ａ面（副面１６２ｂ）と、上記Ａ面の裏面であるＢ面（主面１６２ａ）と、を含む第１回路基板（レセプタクル搭載基板１６２）と、
　上記第１スイッチと上記第２スイッチと上記第３スイッチを制御可能に構成されるコントローラ（ＭＣＵ１）と、を備え、
　上記第２スイッチは、上記Ａ面に実装され、
　上記第１スイッチと上記第３スイッチの少なくとも一方は、上記Ｂ面又は上記第１回路基板とは別体の第２回路基板に実装され、
　上記コントローラは、
　　上記第１スイッチ及び上記第３スイッチがＯＮの時、上記固定抵抗器又は上記ヒータコネクタに印加される電圧に基づき、所定の制御（ヒータＨＴＲの温度検出及びその温度を用いた放電制御）を実行し、
　　上記第３スイッチがＯＮの間、エアロゾルを生成するための電力を上記ヒータへ供給するように、上記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、
　エアロゾル生成装置の電源ユニット。 (1)
a power supply (power supply BAT);
a heater connector (heater connector Cn) in which a heater (heater HTR) including a + pole and a - pole and consuming power supplied from the power supply to heat the aerosol source is connected to the + pole and the - pole; ,
A first branch circuit (series of reactor Ld, switch S4, and resistor Rs) including a first switch (switch S4) and a fixed resistor (resistor Rs) connected to one of the + pole and the - pole a circuit including a circuit and wiring connecting the series circuit and the node N1 and the node N2;
A second branch circuit (switch S3) connected in parallel to the first branch circuit and including a second switch (switch S3) connected to one of the + pole and the - pole is connected to the node N1 and the node N2. circuit including wiring to
a third switch (switch S6) connected to the other of the + pole and the - pole;
a first circuit board (receptacle mounting board 162) including a surface A (secondary surface 162b) and a surface B (main surface 162a) that is the back surface of the surface A;
a controller (MCU1) configured to be able to control the first switch, the second switch, and the third switch;
The second switch is mounted on the A surface,
At least one of the first switch and the third switch is mounted on the B surface or on a second circuit board separate from the first circuit board,
The above controller is
When the first switch and the third switch are ON, predetermined control (temperature detection of the heater HTR and discharge control using the detected temperature) is executed based on the voltage applied to the fixed resistor or the heater connector. death,
While the third switch is ON, the second switch is repeatedly switched ON and OFF so as to supply power to the heater for generating aerosol.
Power supply unit for the aerosol generator.
　（１）によれば、エアロゾルを生成するための電力が通り、且つ、スイッチングされることから熱源及びノイズ源になり得る第２スイッチと、第１スイッチ及び第３スイッチの少なくとも一方との熱及びノイズの観点から見た距離を十分に確保することが可能となる。このため、第１スイッチや第３スイッチの故障や誤動作を抑制して、これらのスイッチを用いて実行される制御の安定性を向上できる。
　なお、上記実施形態では、昇圧ＤＣ／ＤＣコンバータ９の出力端子と正極側のヒータコネクタＣｎの間に、スイッチＳ３と、スイッチＳ４及び抵抗器Ｒｓと、が並列接続される構成であるが、グランドラインと負極側のヒータコネクタＣｎの間に、スイッチＳ３と、スイッチＳ４及び抵抗器Ｒｓと、が並列接続される構成とすることもできる。このような構成とした場合、スイッチＳ６は、昇圧ＤＣ／ＤＣコンバータ９の出力端子と正極側のヒータコネクタＣｎの間に接続される又は省略される。この構成とする場合でも、（１）の構成とすることで、第１スイッチや第３スイッチの故障や誤動作を抑制して、これらのスイッチを用いて実行される制御の安定性を向上できる。 According to (1), the heat and heat from the second switch, which can be a heat source and a noise source because the power for generating the aerosol passes and is switched, and at least one of the first switch and the third switch. It is possible to secure a sufficient distance from the viewpoint of noise. Therefore, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
In the above embodiment, the switch S3, the switch S4 and the resistor Rs are connected in parallel between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side. A switch S3, a switch S4 and a resistor Rs may be connected in parallel between the line and the heater connector Cn on the negative electrode side. In such a configuration, the switch S6 is connected between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side or omitted. Even in this configuration, the configuration (1) can suppress failures and malfunctions of the first switch and the third switch, and improve the stability of the control executed using these switches.
（２）
　（１）に記載のエアロゾル生成装置の電源ユニットであって、
　上記第１スイッチと上記第３スイッチの少なくとも一方は、上記Ｂ面に実装される、
　エアロゾル生成装置の電源ユニット。 (2)
(1) The power supply unit of the aerosol generator,
At least one of the first switch and the third switch is mounted on the B surface.
Power supply unit for the aerosol generator.
　（２）によれば、複数の基板を用いることなく、第２スイッチと、第１スイッチ及び第３スイッチとの熱及びノイズの観点から見た距離を十分に確保できる。このため、コストが増加することなく、第１スイッチと第３スイッチを用いて実行される制御の安定性を向上できる。 According to (2), a sufficient distance can be ensured from the viewpoint of heat and noise between the second switch and the first and third switches without using a plurality of substrates. Therefore, the stability of the control executed using the first switch and the third switch can be improved without increasing the cost.
（３）
　（２）に記載のエアロゾル生成装置の電源ユニットであって、
　上記第１回路基板に直交する方向（前後方向）において、上記第１スイッチ及び上記第３スイッチは、上記第２スイッチと重ならない、
　エアロゾル生成装置の電源ユニット。 (3)
(2) The power supply unit of the aerosol generator,
The first switch and the third switch do not overlap the second switch in a direction orthogonal to the first circuit board (front-rear direction),
Power supply unit for the aerosol generator.
　第２スイッチが実装される箇所の裏側は、第２スイッチから生じた熱やノイズが到達する虞がある。（３）によれば、このような位置を避けて、第１スイッチや第３スイッチが実装される。このため、第１スイッチや第３スイッチの故障や誤動作を抑制して、これらのスイッチを用いて実行される制御の安定性を向上できる。 There is a risk that heat and noise generated from the second switch may reach the back side of the location where the second switch is mounted. According to (3), the first switch and the third switch are mounted to avoid such positions. Therefore, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
（４）
　（２）又は（３）に記載のエアロゾル生成装置の電源ユニットであって、
　上記第１回路基板に直交する方向（前後方向）において、上記固定抵抗器は、上記第２スイッチと重ならない位置に設けられる、
　エアロゾル生成装置の電源ユニット。 (4)
The power unit of the aerosol generator according to (2) or (3),
The fixed resistor is provided at a position that does not overlap the second switch in a direction orthogonal to the first circuit board (front-rear direction).
Power supply unit for the aerosol generator.
　固定抵抗器であってもその抵抗値は、温度に応じて若干ではあるが変動する。（４）によれば、固定抵抗器が第２スイッチで生じた熱の影響を受けにくい位置に実装される。このため、固定抵抗器の抵抗値が安定し、所定の制御の安定性を向上できる。 Even if it is a fixed resistor, its resistance value fluctuates slightly depending on the temperature. According to (4), the fixed resistor is mounted at a position that is less susceptible to the heat generated by the second switch. Therefore, the resistance value of the fixed resistor is stabilized, and the stability of predetermined control can be improved.
（５）
　（１）に記載のエアロゾル生成装置の電源ユニットであって、
　上記電源から出力される電圧を変換して上記ヒータへ出力可能な電圧変換器（昇圧ＤＣ／ＤＣコンバータ９）を備え、
　上記電圧変換器は、上記第１スイッチと上記第３スイッチの少なくとも一方とは異なる面又は異なる基板に実装される、
　エアロゾル生成装置の電源ユニット。 (5)
(1) The power supply unit of the aerosol generator,
A voltage converter (step-up DC/DC converter 9) capable of converting the voltage output from the power supply and outputting it to the heater,
wherein the voltage converter is mounted on a different surface or a different substrate than at least one of the first switch and the third switch;
Power supply unit for the aerosol generator.
　（５）によれば、電圧変換器によって安定した電圧をヒータへ供給できると共に、ノイズ源や熱源になり得る電圧変換器と第１スイッチや第３スイッチとの熱及びノイズの観点から見た距離を十分に大きくできる。したがって、安定したエアロゾル生成を実現しつつ、第１スイッチや第３スイッチの故障や誤動作を抑制して、これらのスイッチを用いて実行される制御の安定性を向上できる。 According to (5), the voltage converter can supply a stable voltage to the heater, and the distance from the viewpoint of heat and noise between the voltage converter and the first switch and the third switch, which can be a noise source and a heat source. can be large enough. Therefore, while realizing stable aerosol generation, failures and malfunctions of the first switch and the third switch can be suppressed, and the stability of control executed using these switches can be improved.
（６）
　（５）に記載のエアロゾル生成装置の電源ユニットであって、
　上記電圧変換器は、上記第１スイッチと上記第３スイッチの少なくとも一方とは異なる面に実装される、
　エアロゾル生成装置の電源ユニット。 (6)
(5) The power supply unit of the aerosol generator,
the voltage converter is mounted on a different surface than at least one of the first switch and the third switch;
Power supply unit for the aerosol generator.
　（６）によれば、熱源やノイズ源になり得る電圧変換器から、複数の基板を用いることなく、第１スイッチや第３スイッチを離すことができる。これにより、コストが増加することなく、第１スイッチと第３スイッチを用いて実行される制御の安定性を向上できる。 According to (6), the first switch and the third switch can be separated from the voltage converter, which can be a heat source and a noise source, without using a plurality of substrates. Thereby, the stability of the control executed using the first switch and the third switch can be improved without increasing the cost.
（７）
　（６）に記載のエアロゾル生成装置の電源ユニットであって、
　上記電圧変換器は、上記Ａ面に実装され、
　上記第１スイッチ及び上記第３スイッチは、上記Ｂ面に実装される、
　エアロゾル生成装置の電源ユニット。 (7)
(6) The power supply unit of the aerosol generator,
The voltage converter is mounted on the A surface,
The first switch and the third switch are mounted on the B surface,
Power supply unit for the aerosol generator.
　（７）によれば、共にノイズ源や熱源になり得る第２スイッチと電圧変換器が同じ面に実装され、第１スイッチと第３スイッチはこの面の反対面に実装される。このため、第２スイッチ及び電圧変換器と、第１スイッチ及び第３スイッチとの熱及びノイズの観点から見た距離を十分に大きくでき、第１スイッチや第３スイッチの故障や誤動作を抑制できる。 According to (7), the second switch and the voltage converter, both of which can be noise sources and heat sources, are mounted on the same surface, and the first switch and the third switch are mounted on the opposite surface. Therefore, the distance between the second switch and the voltage converter and the first switch and the third switch can be sufficiently increased from the viewpoint of heat and noise, and failures and malfunctions of the first switch and the third switch can be suppressed. .
（８）
　（７）に記載のエアロゾル生成装置の電源ユニットであって、
　上記第１回路基板に直交する方向（前後方向）において、上記第１スイッチ及び上記第３スイッチは、上記電圧変換器と重ならない、
　エアロゾル生成装置の電源ユニット。 (8)
(7) The power supply unit of the aerosol generator,
The first switch and the third switch do not overlap the voltage converter in a direction orthogonal to the first circuit board (front-rear direction).
Power supply unit for the aerosol generator.
　電圧変換器が実装される箇所の裏側は、第２スイッチから生じた熱やノイズが到達する虞がある。（８）によれば、このような位置を避けて、第１スイッチや第３スイッチが実装されるので、第１スイッチや第３スイッチの故障や誤動作を抑制できる。 There is a risk that heat and noise generated from the second switch may reach the back side of the location where the voltage converter is mounted. According to (8), since the first switch and the third switch are mounted while avoiding such a position, failures and malfunctions of the first switch and the third switch can be suppressed.
（９）
　（７）又は（８）に記載のエアロゾル生成装置の電源ユニットであって、
　上記第１回路基板に直交する方向（前後方向）において、上記固定抵抗器は、上記電圧変換器と重ならない、
　エアロゾル生成装置の電源ユニット。 (9)
The power unit of the aerosol generator according to (7) or (8),
The fixed resistor does not overlap the voltage converter in a direction perpendicular to the first circuit board (front-rear direction),
Power supply unit for the aerosol generator.
　固定抵抗器であってもその抵抗値は、温度の応じて若干ではあるが変動する。（９）によれば、固定抵抗器が電圧変換器で生じた熱の影響を受けにくい位置に実装される。このため、固定抵抗器の抵抗値が安定し、所定の制御の安定性を向上できる。 Even if it is a fixed resistor, its resistance value fluctuates slightly depending on the temperature. According to (9), the fixed resistor is mounted at a position that is less susceptible to the heat generated by the voltage converter. Therefore, the resistance value of the fixed resistor is stabilized, and the stability of predetermined control can be improved.
（１０）
　電源（電源ＢＡＴ）と、
　＋極と－極とを含み、上記電源から供給される電力を消費してエアロゾル源を加熱するヒータ（ヒータＨＴＲ）が上記＋極と上記－極へ接続されるヒータコネクタ（ヒータコネクタＣｎ）と、
　上記＋極と上記－極の一方へ接続された、第１スイッチ（スイッチＳ４）と固定抵抗器（抵抗器Ｒｓ）とを含む第１分岐回路（リアクトルＬｄ、スイッチＳ４、及び抵抗器Ｒｓの直列回路と、この直列回路とノードＮ１及びノードＮ２とを接続する配線とを含む回路）と、
　上記＋極と上記－極の一方へ接続された、第２スイッチ（スイッチＳ３）を含み且つ上記第１分岐回路へ並列接続される第２分岐回路（スイッチＳ３とノードＮ１及びノードＮ２とを接続する配線を含む回路）と、
　Ａ面（副面１６２ｂ）と、上記Ａ面の裏面であるＢ面（主面１６２ａ）と、を含む第１回路基板（レセプタクル搭載基板１６２）と、
　上記第１スイッチと上記第２スイッチとを制御可能に構成されるコントローラ（ＭＣＵ１）と、を備え、
　上記第２スイッチは、上記Ａ面に実装され、
　上記第１スイッチは、上記Ｂ面又は上記第１回路基板とは別体の第２回路基板に実装され、
　上記コントローラは、
　　上記第１スイッチがＯＮの時、上記固定抵抗器又は上記ヒータコネクタに印加される電圧に基づき、所定の制御を実行し、
　　エアロゾルを生成するための電力を上記ヒータへ供給するように、上記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、
　エアロゾル生成装置の電源ユニット。 (10)
a power supply (power supply BAT);
a heater connector (heater connector Cn) in which a heater (heater HTR) including a + pole and a - pole and consuming power supplied from the power supply to heat the aerosol source is connected to the + pole and the - pole; ,
A first branch circuit (series of reactor Ld, switch S4, and resistor Rs) including a first switch (switch S4) and a fixed resistor (resistor Rs) connected to one of the + pole and the - pole a circuit including a circuit and wiring connecting the series circuit and the node N1 and the node N2;
A second branch circuit (switch S3) connected in parallel to the first branch circuit and including a second switch (switch S3) connected to one of the + pole and the - pole is connected to the node N1 and the node N2. a circuit including wiring to
a first circuit board (receptacle mounting board 162) including a surface A (secondary surface 162b) and a surface B (main surface 162a) that is the back surface of the surface A;
a controller (MCU1) configured to be able to control the first switch and the second switch;
The second switch is mounted on the A surface,
The first switch is mounted on the B surface or on a second circuit board separate from the first circuit board,
The above controller is
When the first switch is ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector,
configured to repeatedly turn on and off the second switch so as to supply power for generating aerosol to the heater;
Power supply unit for the aerosol generator.
　（１０）によれば、エアロゾルを生成するための電力が通り、且つ、スイッチングされることから熱源及びノイズ源になり得る第２スイッチと、第１スイッチとの熱及びノイズの観点から見た距離を十分に確保することが可能となる。このため、第１スイッチの故障や誤動作を抑制して、第１スイッチを用いて実行される制御の安定性を向上できる。
　なお、上記実施形態では、昇圧ＤＣ／ＤＣコンバータ９の出力端子と正極側のヒータコネクタＣｎの間に、スイッチＳ３と、スイッチＳ４及び抵抗器Ｒｓと、が並列接続される構成であるが、グランドラインと負極側のヒータコネクタＣｎの間に、スイッチＳ３と、スイッチＳ４及び抵抗器Ｒｓと、が並列接続される構成とすることもできる。このような構成とした場合、スイッチＳ６は、昇圧ＤＣ／ＤＣコンバータ９の出力端子と正極側のヒータコネクタＣｎの間に接続される又は省略される。この構成とする場合でも、（１０）の構成とすることで、第１スイッチの故障や誤動作を抑制して、第１スイッチを用いて実行される制御の安定性を向上できる。 According to (10), the distance from the viewpoint of heat and noise between the first switch and the second switch, which can become a heat source and a noise source due to the fact that power for generating aerosol passes through and is switched can be sufficiently ensured. Therefore, it is possible to suppress failures and malfunctions of the first switch and improve the stability of the control executed using the first switch.
In the above embodiment, the switch S3, the switch S4 and the resistor Rs are connected in parallel between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side. A switch S3, a switch S4 and a resistor Rs may be connected in parallel between the line and the heater connector Cn on the negative electrode side. In such a configuration, the switch S6 is connected between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side or omitted. Even in this configuration, the configuration (10) can suppress failures and malfunctions of the first switch and improve the stability of the control executed using the first switch.
　以上、図面を参照しながら各種の実施の形態について説明したが、本発明はかかる例に限定されないことは言うまでもない。当業者であれば、特許請求の範囲に記載された範疇内において、各種の変更例又は修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。また、発明の趣旨を逸脱しない範囲において、上記実施の形態における各構成要素を任意に組み合わせてもよい。 Various embodiments have been described above with reference to the drawings, but it goes without saying that the present invention is not limited to such examples. It is obvious that a person skilled in the art can conceive of various modifications or modifications within the scope described in the claims, and these also belong to the technical scope of the present invention. Understood. Moreover, each component in the above embodiments may be combined arbitrarily without departing from the gist of the invention.
　なお、本出願は、２０２１年５月１０日出願の日本特許出願（特願２０２１－０７９８８０）に基づくものであり、その内容は本出願の中に参照として援用される。 This application is based on a Japanese patent application (Japanese Patent Application No. 2021-079880) filed on May 10, 2021, the contents of which are incorporated herein by reference.
１００　吸引器
１　ＭＣＵ
９　昇圧ＤＣ／ＤＣコンバータ
ＯＰ１　オペアンプ
Ｌｃ、Ｌｄ　リアクトル
ＨＴＲ　ヒータ
ＢＡＴ　電源
Ｃｎ　ヒータコネクタ
Ｓ３、Ｓ４、Ｓ５、Ｓ６　スイッチ
Ｒｓ、Ｒ４、ＲＰｂ１、ＲＰｂ２　抵抗器
Ｄ５　寄生ダイオード
Ｎ１～Ｎ８　ノード
ＨＲ１　第１加熱放電経路
ＨＲ２　第２加熱放電経路
ＨＲ３　第３加熱放電経路
ＭＲ１　第１検出放電経路
ＭＲ２　第２検出放電経路
ＭＲ３　第３検出放電経路 100 aspirator 1 MCU
9 Step-up DC/DC converter OP1 Operational amplifier Lc, Ld Reactor HTR Heater BAT Power supply Cn Heater connector S3, S4, S5, S6 Switch Rs, R4, R Pb1 , R Pb2 Resistor D5 Parasitic diodes N1 to N8 Node HR1 First heating discharge Path HR2 Second heating/discharging path HR3 Third heating/discharging path MR1 First detection discharge path MR2 Second detection discharge path MR3 Third detection discharge path

Claims (10)

  1. 　電源と、
    　＋極と－極とを含み、前記電源から供給される電力を消費してエアロゾル源を加熱するヒータが前記＋極と前記－極へ接続されるヒータコネクタと、
    　前記＋極と前記－極の一方へ接続された、第１スイッチと固定抵抗器とを含む第１分岐回路と、
    　前記＋極と前記－極の一方へ接続された、第２スイッチを含み且つ前記第１分岐回路へ並列接続される第２分岐回路と、
    　前記＋極と前記－極の他方へ接続される第３スイッチと、
    　Ａ面と、前記Ａ面の裏面であるＢ面と、を含む第１回路基板と、
    　前記第１スイッチと前記第２スイッチと前記第３スイッチを制御可能に構成されるコントローラと、を備え、
    　前記第２スイッチは、前記Ａ面に実装され、
    　前記第１スイッチと前記第３スイッチの少なくとも一方は、前記Ｂ面又は前記第１回路基板とは別体の第２回路基板に実装され、
    　前記コントローラは、
    　　前記第１スイッチ及び前記第３スイッチがＯＮの時、前記固定抵抗器又は前記ヒータコネクタに印加される電圧に基づき、所定の制御を実行し、
    　　前記第３スイッチがＯＮの間、エアロゾルを生成するための電力を前記ヒータへ供給するように、前記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、
    　エアロゾル生成装置の電源ユニット。     a power supply;
    a heater connector including a + pole and a - pole, wherein a heater that consumes power supplied from the power source to heat the aerosol source is connected to the + pole and the - pole;
    a first branch circuit including a first switch and a fixed resistor connected to one of the + pole and the - pole;
    a second branch circuit connected in parallel to the first branch circuit and including a second switch connected to one of the + pole and the - pole;
    a third switch connected to the other of the + pole and the - pole;
    a first circuit board including a surface A and a surface B that is the rear surface of the surface A;
    a controller configured to be able to control the first switch, the second switch, and the third switch;
    The second switch is mounted on the A surface,
    At least one of the first switch and the third switch is mounted on the B surface or a second circuit board separate from the first circuit board,
    The controller is
    When the first switch and the third switch are ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector,
    While the third switch is ON, the second switch is repeatedly switched ON and OFF so as to supply power to the heater for generating aerosol.
    Power supply unit for the aerosol generator.
  2. 　請求項１に記載のエアロゾル生成装置の電源ユニットであって、
    　前記第１スイッチと前記第３スイッチの少なくとも一方は、前記Ｂ面に実装される、
    　エアロゾル生成装置の電源ユニット。     A power supply unit of the aerosol generator according to claim 1,
    At least one of the first switch and the third switch is mounted on the B surface.
    Power supply unit for the aerosol generator.
  3. 　請求項２に記載のエアロゾル生成装置の電源ユニットであって、
    　前記第１回路基板に直交する方向において、前記第１スイッチ及び前記第３スイッチは、前記第２スイッチと重ならない、
    　エアロゾル生成装置の電源ユニット。     A power supply unit of the aerosol generator according to claim 2,
    the first switch and the third switch do not overlap the second switch in a direction perpendicular to the first circuit board;
    Power supply unit for the aerosol generator.
  4. 　請求項２又は３に記載のエアロゾル生成装置の電源ユニットであって、
    　前記第１回路基板に直交する方向において、前記固定抵抗器は、前記第２スイッチと重ならない位置に設けられる、
    　エアロゾル生成装置の電源ユニット。     The power supply unit of the aerosol generator according to claim 2 or 3,
    The fixed resistor is provided at a position that does not overlap the second switch in a direction perpendicular to the first circuit board,
    Power supply unit for the aerosol generator.
  5. 　請求項１に記載のエアロゾル生成装置の電源ユニットであって、
    　前記電源から出力される電圧を変換して前記ヒータへ出力可能な電圧変換器を備え、
    　前記電圧変換器は、前記第１スイッチと前記第３スイッチの少なくとも一方とは異なる面又は異なる基板に実装される、
    　エアロゾル生成装置の電源ユニット。     A power supply unit of the aerosol generator according to claim 1,
    A voltage converter capable of converting the voltage output from the power supply and outputting it to the heater,
    wherein the voltage converter is mounted on a different surface or a different substrate than at least one of the first switch and the third switch;
    Power supply unit for the aerosol generator.
  6. 　請求項５に記載のエアロゾル生成装置の電源ユニットであって、
    　前記電圧変換器は、前記第１スイッチと前記第３スイッチの少なくとも一方とは異なる面に実装される、
    　エアロゾル生成装置の電源ユニット。     A power supply unit of the aerosol generator according to claim 5,
    wherein the voltage converter is mounted on a different surface than at least one of the first switch and the third switch;
    Power supply unit for the aerosol generator.
  7. 　請求項６に記載のエアロゾル生成装置の電源ユニットであって、
    　前記電圧変換器は、前記Ａ面に実装され、
    　前記第１スイッチ及び前記第３スイッチは、前記Ｂ面に実装される、
    　エアロゾル生成装置の電源ユニット。     A power supply unit for an aerosol generator according to claim 6,
    The voltage converter is mounted on the A side,
    The first switch and the third switch are mounted on the B surface,
    Power supply unit for the aerosol generator.
  8. 　請求項７に記載のエアロゾル生成装置の電源ユニットであって、
    　前記第１回路基板に直交する方向において、前記第１スイッチ及び前記第３スイッチは、前記電圧変換器と重ならない、
    　エアロゾル生成装置の電源ユニット。     A power supply unit for an aerosol generator according to claim 7,
    In a direction orthogonal to the first circuit board, the first switch and the third switch do not overlap the voltage converter;
    Power supply unit for the aerosol generator.
  9. 　請求項７又は８に記載のエアロゾル生成装置の電源ユニットであって、
    　前記第１回路基板に直交する方向において、前記固定抵抗器は、前記電圧変換器と重ならない、
    　エアロゾル生成装置の電源ユニット。     The power unit of the aerosol generator according to claim 7 or 8,
    the fixed resistor does not overlap the voltage converter in a direction orthogonal to the first circuit board;
    Power supply unit for the aerosol generator.
  10. 　電源と、
    　＋極と－極とを含み、前記電源から供給される電力を消費してエアロゾル源を加熱するヒータが前記＋極と前記－極へ接続されるヒータコネクタと、
    　前記＋極と前記－極の一方へ接続された、第１スイッチと固定抵抗器とを含む第１分岐回路と、
    　前記＋極と前記－極の一方へ接続された、第２スイッチを含み且つ前記第１分岐回路へ並列接続される第２分岐回路と、
    　Ａ面と、前記Ａ面の裏面であるＢ面と、を含む第１回路基板と、
    　前記第１スイッチと前記第２スイッチとを制御可能に構成されるコントローラと、を備え、
    　前記第２スイッチは、前記Ａ面に実装され、
    　前記第１スイッチは、前記Ｂ面又は前記第１回路基板とは別体の第２回路基板に実装され、
    　前記コントローラは、
    　　前記第１スイッチがＯＮの時、前記固定抵抗器又は前記ヒータコネクタに印加される電圧に基づき、所定の制御を実行し、
    　　エアロゾルを生成するための電力を前記ヒータへ供給するように、前記第２スイッチのＯＮとＯＦＦの切り替えを繰り返すように構成される、
    　エアロゾル生成装置の電源ユニット。     a power supply;
    a heater connector including a + pole and a - pole, wherein a heater that consumes power supplied from the power source to heat the aerosol source is connected to the + pole and the - pole;
    a first branch circuit including a first switch and a fixed resistor connected to one of the + pole and the - pole;
    a second branch circuit connected in parallel to the first branch circuit and including a second switch connected to one of the + pole and the - pole;
    a first circuit board including a surface A and a surface B that is the rear surface of the surface A;
    a controller configured to be able to control the first switch and the second switch;
    The second switch is mounted on the A surface,
    The first switch is mounted on the B surface or on a second circuit board separate from the first circuit board,
    The controller is
    When the first switch is ON, predetermined control is performed based on the voltage applied to the fixed resistor or the heater connector,
    configured to repeatedly turn on and off the second switch so as to supply power for generating aerosol to the heater;
    Power supply unit for the aerosol generator.
PCT/JP2022/007386 2021-05-10 2022-02-22 Power supply unit for aerosol generation device WO2022239360A1 (en)

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JP2021079880 2021-05-10

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111513365A (en) * 2020-04-02 2020-08-11 深圳麦时科技有限公司 Heated aerosol generating device and method
JP6865879B1 (en) * 2020-09-07 2021-04-28 日本たばこ産業株式会社 Aerosol generation system, aspirator controller, and power supply

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111513365A (en) * 2020-04-02 2020-08-11 深圳麦时科技有限公司 Heated aerosol generating device and method
JP6865879B1 (en) * 2020-09-07 2021-04-28 日本たばこ産業株式会社 Aerosol generation system, aspirator controller, and power supply

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