WO2022239261A1 - Case for electronic substrate, and method for manufacturing case for electronic substrate - Google Patents

Case for electronic substrate, and method for manufacturing case for electronic substrate Download PDF

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Publication number
WO2022239261A1
WO2022239261A1 PCT/JP2021/025227 JP2021025227W WO2022239261A1 WO 2022239261 A1 WO2022239261 A1 WO 2022239261A1 JP 2021025227 W JP2021025227 W JP 2021025227W WO 2022239261 A1 WO2022239261 A1 WO 2022239261A1
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Prior art keywords
plate
side plate
case
electronic board
electronic substrate
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PCT/JP2021/025227
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French (fr)
Japanese (ja)
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ティム 敬雄 相原
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Ｔｉｍ合同会社
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Publication of WO2022239261A1 publication Critical patent/WO2022239261A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electronic board case for housing an electronic board such as an audio amplifier circuit, and a manufacturing method thereof.
  • Patent Document 1 a box-shaped metal case (1) consisting of only four side walls without an upper surface and a lower surface, and a lid-like metal lid with a shallow bottom that completely covers the upper surface of this case (1) and a lid-like metal rear cover with a shallow bottom attached to the opposite side of the case (1) attached to the printed circuit board (3) across the printed circuit board (3). (4) is shown ([0008], FIG. 1). Such a structure enables electromagnetic shielding ([0008]).
  • Patent Document 1 when an electronic board is housed in a metal case (which may include a cover), electromagnetic waves can be shielded.
  • a metal case which may include a cover
  • thermal conductivity or design For example, a metal case has a relatively high thermal conductivity. Therefore, if there is a heating element around the case, heat may be conducted to the electronic substrate inside the case.
  • the present invention has been made in consideration of the above problems, and aims to provide an electronic substrate case capable of improving thermal conductivity or design and a method of manufacturing the same.
  • An electronic board case has a rectangular parallelepiped shape including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate, At least the front panel, the rear panel, the upper panel, the left panel and the right panel are made of stone.
  • At least the front plate, the rear plate, the upper plate, the left side plate and the right side plate of the rectangular parallelepiped electronic substrate case are made of stone.
  • stone has a lower thermal conductivity than metal. Therefore, when there is a heating element around the case, it is possible to protect the electronic substrate from heat.
  • an audio amplifier circuit board (especially a high-resolution type) needs to operate stably in order to produce good sound.
  • the stone since the case is made of stone, the stone gently absorbs the heat generated by the circuit board, making it easier to stably operate the circuit board (the same applies to electronic boards for other uses). .).
  • the stone material may contain minerals that have electromagnetic wave shielding properties. This makes it possible to improve the electromagnetic shielding performance for the electronic substrate inside the case.
  • the stone material may be selected from any one of granite, granite, marble, andesite, diorite, gabbros and gneiss. By using these stone materials, it is possible to bring about a dignified appearance that is used for tombstones, for example.
  • the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate may be joined together with an adhesive. This facilitates assembly of the electronic board case.
  • any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate, and the right side plate is provided with a rectangular positioning convex portion that protrudes inside the electronic board case. good too. Further, the length of each side of the positioning protrusion may be shorter than the length of each side of the internal space of the electronic board case facing the positioning protrusion. This facilitates assembly of the electronic board case.
  • a wiring hole may be formed in any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate. This facilitates wiring of the electronic substrate.
  • a manufacturing method is a method for manufacturing a rectangular parallelepiped electronic substrate case including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate, forming at least the front plate, the rear plate, the upper plate, the left side plate and the right side plate by processing stone into plates; assembling the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate to form the electronic substrate case.
  • FIG. 1 is an external perspective view of an electronic board case according to an embodiment of the present invention
  • FIG. 3 is an exploded perspective view of the electronic board case according to the embodiment
  • FIG. 4 is a flow chart showing a method of manufacturing an electronic board unit including the electronic board case and the electronic board according to the embodiment
  • FIG. 1 is an external perspective view of an electronic board case 10 according to one embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the electronic board case 10 according to this embodiment.
  • the electronic board case 10 is rectangular parallelepiped and has a front plate 20 , a rear plate 22 , an upper plate 24 , a lower plate 26 , a left plate 28 and a right plate 30 .
  • An electronic board (not shown) is arranged inside the electronic board case 10 .
  • the electronic board for example, an audio amplifier circuit board (especially a high resolution type) can be used.
  • the front plate 20 is formed with wiring holes 40 for inserting terminals of an electronic substrate. Further, as shown in FIG. 2, the rear plate 22 is formed with a positioning projection 50. As shown in FIG.
  • the convex portion 50 has a rectangular shape and protrudes inside the electronic board case 10 .
  • the length of each side of the protrusion 50 is slightly shorter than the length of each side of the internal space of the electronic board case 10 facing the protrusion 50 . This facilitates positioning of the rear plate 22 with respect to the assembled upper plate 24, lower plate 26, left side plate 28 and right side plate 30.
  • the front plate 20 also has a convex portion 50 formed thereon. This facilitates positioning of the front plate 20 with respect to the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 in the assembled state.
  • Each of the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 is made of natural or artificial stone.
  • the stone material is selected, for example, from granite, granite, marble, andesite, diorite, gabbro and gneiss. Further, the stone material of the present embodiment contains minerals (iron, copper, aluminum, nickel, etc.) having electromagnetic wave shielding properties.
  • FIG. 3 shows a method of manufacturing an electronic board unit including the electronic board case 10 and the electronic board according to the present embodiment.
  • step S1 a stone material is processed into plates to form the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left plate 28 and the right plate 30, respectively.
  • a diamond cutter or the like is used for the processing.
  • step S2 the wiring holes 40 are formed in the front plate 20 using a diamond drill or the like, and the positioning projections 50 are formed in the front plate 20 and the rear plate 22 using a diamond cutter or the like.
  • step S3 the lower plate 26, the left side plate 28, the right side plate 30 and the upper plate 24 are joined with an adhesive.
  • an adhesive for example, an ultraviolet curing resin can be used.
  • step S4 the back plate 22 is further bonded using an adhesive.
  • step S5 an electronic board is placed inside the assembly of the rear plate 22, the upper plate 24, the lower plate 26, the left plate 28 and the right plate 30.
  • an adhesive is used to bond the front plate 20 to the assembly. At that time, the terminals of the electronic board are inserted into the holes 40 of the front plate 20 .
  • the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28, and the right side plate 30 of the rectangular parallelepiped electronic substrate case 10 are each made of stone.
  • stone has a lower thermal conductivity than metal. Therefore, when there is a heating element around the case 10, it is possible to protect the electronic substrate from heat.
  • an audio amplifier circuit board (especially a high-resolution type) needs to operate stably in order to produce good sound.
  • the stone gently absorbs the heat generated by the circuit board, which makes it easier to stably operate the circuit board. is.).
  • the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 are made of stone, when compared with a metal case, the solid feeling and the like is unique. It becomes possible to bring about designability.
  • the stone material forming the electronic substrate case 10 contains minerals (iron, copper, aluminum, nickel, etc.) having electromagnetic wave shielding properties. This makes it possible to improve the electromagnetic shielding performance for the electronic substrate inside the case 10 .
  • the stone material forming the electronic substrate case 10 is selected from granite, granite, marble, andesite, diorite, gabbro, and gneiss. By using these stone materials, it is possible to bring about a dignified appearance that is used for tombstones.
  • the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 are joined together with an adhesive (ultraviolet curing resin or the like). This facilitates assembly of the electronic board case 10 .
  • the front plate 20 and the rear plate 22 are provided with rectangular positioning projections 50 that protrude inside the electronic board case 10 (FIG. 2).
  • the length of each side of the positioning protrusion 50 is slightly shorter than the length of each side of the internal space of the electronic board case facing the protrusion 50 . This facilitates assembly of the electronic board case 10 (especially the front plate 20 and the rear plate 22).
  • a wiring hole 40 is formed in the front plate 20 (Fig. 1). This facilitates wiring of the electronic substrate.
  • the present invention is not limited to the above-described embodiments, and can of course adopt various configurations based on the descriptions of this specification. For example, the following configuration can be adopted.
  • all the plate members that is, the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30
  • the front plate 20, the rear plate 22, the top plate 24, the bottom plate 26, the left plate 28 and the right plate 30 can be constructed of stone, while the bottom plate 26 can be constructed of another material (eg, metal plate). good.
  • the stone material constituting each plate material constituting the electronic substrate case 10 contains a mineral having electromagnetic wave shielding properties.
  • the stone is not limited to this, and it is also possible that the stone does not contain minerals having electromagnetic wave shielding properties.
  • an electromagnetic wave shielding material other than stone for example, metal mesh, metal sheet, or resin sheet
  • the wiring holes 40 are provided in the front plate 20 (FIG. 1).
  • the wiring holes 40 may be provided in another plate, for example, from the viewpoint of routing the wiring of the electronic substrate to the outside.
  • the width of the lower plate 26 may be made smaller than that of the front plate 20 and the rear plate 22 to provide the wiring holes 40 between the lower plate 26 and the left side plate 28 or right side plate 30 .
  • the wiring hole 40 may not be provided in the electronic substrate case 10 .
  • the positioning protrusions 50 are provided on the front plate 20 and the rear plate 22, but other plates (upper plate 24, lower plate 26, left side plate 28 and right side plate 30) may be provided as necessary. ) may be provided. Further, for example, if attention is paid to the fact that each plate is made of stone, the positioning convex portion 50 may not be provided.
  • the electronic board case 10 (or electronic board unit) was assembled in the order shown in FIG.
  • the electronic substrate case 10 may be assembled in a different order without being limited to this.
  • each plate was joined using an adhesive.
  • each plate may be provided with an engaging portion and the plates may be joined by these engaging portions.
  • the electronic substrate case 10 is closed except for the wiring hole 40 (FIG. 1), but other holes may be formed.
  • heat dissipation holes may be formed in the top plate 24 .
  • the heat radiation holes can be provided between the top plate 24 and the left side plate 28 or the right side plate 30 by making the width of the top plate 24 smaller than that of the front plate 20 and the rear plate 22 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

[Problem] The purpose of the present invention is to provide a case for an electronic substrate and a method for producing the same with which it is possible to improve thermal conductivity or design properties. [Solution] This case 10 for an electronic substrate is a rectangular parallelepiped including a front plate 20, a rear plate 22, an upper plate 24, a lower plate 26, a left-side plate 28, and a right-side plate 30. At least the front plate 20, the rear plate 22, the upper plate 24, the left-side plate 28, and the right-side plate 30 are formed using a stone material. The stone material may be selected from granite, marble, andesite, diorite, gabbro, and gneiss.

Description

電子基板用ケース及び電子基板用ケースの製造方法Electronic board case and method for manufacturing electronic board case
　本発明は、オーディオアンプ回路等の電子基板を収納する電子基板用ケース及びその製造方法に関する。 The present invention relates to an electronic board case for housing an electronic board such as an audio amplifier circuit, and a manufacturing method thereof.
　電子基板用ケースとして、電磁波シールド性を考慮して、鉄等の金属製のものが広く用いられている。例えば、特許文献１では、上面及び下面がなくて４つの側壁のみから成る箱状の金属製のケース（１）と、このケース（１）の上面をスッポリ被う底の浅い蓋状の金属製の表カバー（２）と、プリント基板（３）に取り付けられたケース（１）に対してプリント基板（３）を隔てた反対側の位置に取り付けられる底の浅い蓋状の金属製の裏カバー（４）とから基本的に構成される構造が示されている（［０００８］、図１）。このような構造により、電磁気的なシールドが可能とされている（［０００８］）。 As electronic substrate cases, those made of metal such as iron are widely used in consideration of electromagnetic shielding properties. For example, in Patent Document 1, a box-shaped metal case (1) consisting of only four side walls without an upper surface and a lower surface, and a lid-like metal lid with a shallow bottom that completely covers the upper surface of this case (1) and a lid-like metal rear cover with a shallow bottom attached to the opposite side of the case (1) attached to the printed circuit board (3) across the printed circuit board (3). (4) is shown ([0008], FIG. 1). Such a structure enables electromagnetic shielding ([0008]).
特開平０４－３４６２９６号公報JP-A-04-346296
　特許文献１のように、電子基板を金属製のケース（カバーを含み得る。）内に収納した場合、電磁波の遮蔽が可能である。しかしながら、例えば、熱伝導性又は意匠性の点で改善の余地がある。例えば、金属製ケースは、比較的熱伝導性が高い。そのため、ケース周辺に発熱体が存在すると、ケース内部の電子基板に熱が伝導してしまう可能性がある。また、金属製ケースの場合、重厚感等を与え難くなる。 As in Patent Document 1, when an electronic board is housed in a metal case (which may include a cover), electromagnetic waves can be shielded. However, there is room for improvement, for example, in thermal conductivity or design. For example, a metal case has a relatively high thermal conductivity. Therefore, if there is a heating element around the case, heat may be conducted to the electronic substrate inside the case. Moreover, in the case of a metal case, it is difficult to give a solid feeling.
　本発明は上記のような課題を考慮してなされたものであり、熱伝導性又は意匠性を改善することが可能な電子基板用ケース及びその製造方法を提供することを目的とする。 The present invention has been made in consideration of the above problems, and aims to provide an electronic substrate case capable of improving thermal conductivity or design and a method of manufacturing the same.
　本発明に係る電子基板用ケースは、前板、後ろ板、上板、下板、左側板及び右側板を含む直方体状のものであって、
　少なくとも前記前板、前記後ろ板、前記上板、前記左側板及び前記右側板が石材で形成されることを特徴とする。 An electronic board case according to the present invention has a rectangular parallelepiped shape including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate,
At least the front panel, the rear panel, the upper panel, the left panel and the right panel are made of stone.
　本発明によれば、直方体状の電子基板用ケースにおいて少なくとも前板、後ろ板、上板、左側板及び右側板が石材で形成される。一般に、石材は、金属と比較して熱伝導性が低い。従って、ケース周辺に発熱体が存在する場合、電子基板を熱から保護することが可能となる。また、例えばオーディオアンプ回路基板（特にハイレゾリューションタイプ）では良い音を出すためには、回路基板が安定して動作する必要がある。本発明では、ケースを石材で構成することにより、回路基板の発した熱を石材が緩やかに吸収するため、回路基板を安定して動作させ易くなる（他の用途の電子基板についても同様である。）。さらに、前板、後ろ板、上板、左側板及び右側板が石材で形成されることにより、金属製ケースと比較した場合、重厚感等の特有な意匠性をもたらすことが可能となる。 According to the present invention, at least the front plate, the rear plate, the upper plate, the left side plate and the right side plate of the rectangular parallelepiped electronic substrate case are made of stone. In general, stone has a lower thermal conductivity than metal. Therefore, when there is a heating element around the case, it is possible to protect the electronic substrate from heat. Also, for example, an audio amplifier circuit board (especially a high-resolution type) needs to operate stably in order to produce good sound. In the present invention, since the case is made of stone, the stone gently absorbs the heat generated by the circuit board, making it easier to stably operate the circuit board (the same applies to electronic boards for other uses). .). Furthermore, by forming the front plate, rear plate, upper plate, left side plate and right side plate from stone, it is possible to bring about a unique design such as a sense of solidity when compared with a metal case.
　前記石材は、電磁波シールド性を有する鉱物を含んでもよい。これにより、ケース内部の電子基板に対する電磁シールド性を向上可能となる。 The stone material may contain minerals that have electromagnetic wave shielding properties. This makes it possible to improve the electromagnetic shielding performance for the electronic substrate inside the case.
　前記石材は、花崗岩、御影石、大理石、安山岩、閃緑岩、斑レイ岩及び片麻岩のいずれかから選択されてもよい。これらの石材を用いることで、例えば墓石に用いられるような重厚な外観をもたらすことが可能となる。 The stone material may be selected from any one of granite, granite, marble, andesite, diorite, gabbros and gneiss. By using these stone materials, it is possible to bring about a dignified appearance that is used for tombstones, for example.
　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板は、接着剤により互いに接合されてもよい。これにより、電子基板用ケースの組立てが容易となる。 The front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate may be joined together with an adhesive. This facilitates assembly of the electronic board case.
　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板のいずれかには、前記電子基板用ケースの内側に突出する矩形状の位置決め用凸部が設けられてもよい。また、前記位置決め用凸部の各辺の長さは、前記位置決め用凸部が面する前記電子基板用ケースの内部空間の各辺の長さより短くてもよい。これにより、電子基板用ケースの組立てが容易となる。 Any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate, and the right side plate is provided with a rectangular positioning convex portion that protrudes inside the electronic board case. good too. Further, the length of each side of the positioning protrusion may be shorter than the length of each side of the internal space of the electronic board case facing the positioning protrusion. This facilitates assembly of the electronic board case.
　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板のいずれかには、配線用孔部が形成されてもよい。これにより、電子基板の配線の引き回しが容易になる。 A wiring hole may be formed in any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate. This facilitates wiring of the electronic substrate.
　本発明に係る製造方法は、前板、後ろ板、上板、下板、左側板及び右側板を含む直方体状の電子基板用ケースの製造方法であって、
　石材を板状に加工して少なくとも前記前板、前記後ろ板、前記上板、前記左側板及び前記右側板を形成するステップと、
　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板を組み立てて前記電子基板用ケースを形成するステップと
　を有することを特徴とする。 A manufacturing method according to the present invention is a method for manufacturing a rectangular parallelepiped electronic substrate case including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate,
forming at least the front plate, the rear plate, the upper plate, the left side plate and the right side plate by processing stone into plates;
assembling the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate to form the electronic substrate case.
　本発明によれば、熱伝導性又は意匠性を改善することが可能となる。 According to the present invention, it is possible to improve thermal conductivity or design.
本発明の一実施形態に係る電子基板用ケースの外観斜視図である。1 is an external perspective view of an electronic board case according to an embodiment of the present invention; FIG. 前記実施形態に係る前記電子基板用ケースの分解斜視図である。3 is an exploded perspective view of the electronic board case according to the embodiment; FIG. 前記実施形態に係る前記電子基板用ケース及び電子基板を含む電子基板ユニットの製造方法を示すフローチャートである。4 is a flow chart showing a method of manufacturing an electronic board unit including the electronic board case and the electronic board according to the embodiment;
＜Ａ．一実施形態＞
［Ａ－１．構成］
　図１は、本発明の一実施形態に係る電子基板用ケース１０の外観斜視図である。図２は、本実施形態に係る電子基板用ケース１０の分解斜視図である。図１及び図２に示すように、電子基板用ケース１０は、直方体状であり、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０を有する。電子基板用ケース１０の内部に電子基板（図示せず）が配置される。電子基板としては、例えば、オーディオアンプ回路基板（特にハイレゾリューションタイプ）を用いることができる。 <A. one embodiment>
[A-1. Constitution]
FIG. 1 is an external perspective view of an electronic board case 10 according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic board case 10 according to this embodiment. As shown in FIGS. 1 and 2, the electronic board case 10 is rectangular parallelepiped and has a front plate 20 , a rear plate 22 , an upper plate 24 , a lower plate 26 , a left plate 28 and a right plate 30 . An electronic board (not shown) is arranged inside the electronic board case 10 . As the electronic board, for example, an audio amplifier circuit board (especially a high resolution type) can be used.
　前板２０には、電子基板の端子等を挿入するための配線用孔部４０が形成されている。また、図２に示すように、後ろ板２２には位置決め用凸部５０が形成されている。凸部５０は、矩形状であり、電子基板用ケース１０の内側に突出する。凸部５０の各辺の長さは、凸部５０が面する電子基板用ケース１０の内部空間の各辺の長さより若干短い。これにより、組み立てた状態の上板２４、下板２６、左側板２８及び右側板３０に対して後ろ板２２の位置決めが容易となる。図示していないが、前板２０にも凸部５０が形成されている。これにより、組み立てた状態の上板２４、下板２６、左側板２８及び右側板３０に対して前板２０の位置決めが容易となる。 The front plate 20 is formed with wiring holes 40 for inserting terminals of an electronic substrate. Further, as shown in FIG. 2, the rear plate 22 is formed with a positioning projection 50. As shown in FIG. The convex portion 50 has a rectangular shape and protrudes inside the electronic board case 10 . The length of each side of the protrusion 50 is slightly shorter than the length of each side of the internal space of the electronic board case 10 facing the protrusion 50 . This facilitates positioning of the rear plate 22 with respect to the assembled upper plate 24, lower plate 26, left side plate 28 and right side plate 30. As shown in FIG. Although not shown, the front plate 20 also has a convex portion 50 formed thereon. This facilitates positioning of the front plate 20 with respect to the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 in the assembled state.
　前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０のそれぞれは、天然又は人工の石材で形成される。石材は、例えば、花崗岩、御影石、大理石、安山岩、閃緑岩、斑レイ岩及び片麻岩のいずれかから選択される。また、本実施形態の石材は、電磁波シールド性を有する鉱物（鉄、銅、アルミニウム、ニッケル等）を含む。 Each of the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 is made of natural or artificial stone. The stone material is selected, for example, from granite, granite, marble, andesite, diorite, gabbro and gneiss. Further, the stone material of the present embodiment contains minerals (iron, copper, aluminum, nickel, etc.) having electromagnetic wave shielding properties.
［Ａ－２．製造方法］
　次に本実施形態に係る電子基板用ケース１０の製造方法について説明する。図３は、本実施形態に係る電子基板用ケース１０及び電子基板を含む電子基板ユニットの製造方法を示す。 [A-2. Production method]
Next, a method for manufacturing the electronic substrate case 10 according to this embodiment will be described. FIG. 3 shows a method of manufacturing an electronic board unit including the electronic board case 10 and the electronic board according to the present embodiment.
　ステップＳ１において、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０それぞれを形成するために石材を板状に加工する。当該加工には、ダイヤモンドカッター等を用いる。ステップＳ２において、ダイヤモンドドリル等を用いて前板２０に配線用孔部４０を形成すると共に、ダイヤモンドカッター等を用いて前板２０及び後ろ板２２に位置決め用凸部５０を形成する。 In step S1, a stone material is processed into plates to form the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left plate 28 and the right plate 30, respectively. A diamond cutter or the like is used for the processing. In step S2, the wiring holes 40 are formed in the front plate 20 using a diamond drill or the like, and the positioning projections 50 are formed in the front plate 20 and the rear plate 22 using a diamond cutter or the like.
　ステップＳ３において、接着剤を用いて下板２６、左側板２８、右側板３０及び上板２４を接合する。接着剤としては、例えば、紫外線硬化樹脂を用いることができる。ステップＳ４において、接着剤を用いてさらに後ろ板２２を接合する。ステップＳ５において、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０の組立体の内部に電子基板を配置する。ステップＳ６において、接着剤を用いて組立体に前板２０を接合する。その際、前板２０の孔部４０に電子基板の端子を挿入する。 In step S3, the lower plate 26, the left side plate 28, the right side plate 30 and the upper plate 24 are joined with an adhesive. As the adhesive, for example, an ultraviolet curing resin can be used. In step S4, the back plate 22 is further bonded using an adhesive. At step S5, an electronic board is placed inside the assembly of the rear plate 22, the upper plate 24, the lower plate 26, the left plate 28 and the right plate 30. As shown in FIG. In step S6, an adhesive is used to bond the front plate 20 to the assembly. At that time, the terminals of the electronic board are inserted into the holes 40 of the front plate 20 .
［Ａ－３．本実施形態の効果］
　本実施形態によれば、直方体状の電子基板用ケース１０において前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０それぞれが石材で形成される。一般に、石材は、金属と比較して熱伝導性が低い。従って、ケース１０周辺に発熱体が存在する場合、電子基板を熱から保護することが可能となる。例えばオーディオアンプ回路基板（特にハイレゾリューションタイプ）では良い音を出すためには、回路基板が安定して動作する必要がある。本実施形態では、ケース１０を石材で構成することにより、回路基板の発した熱を石材が緩やかに吸収するため、回路基板を安定して動作させ易くなる（他の用途の電子基板についても同様である。）。さらに、また、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０が石材で形成されることにより、金属製ケースと比較した場合、重厚感等の特有な意匠性をもたらすことが可能となる。 [A-3. Effect of this embodiment]
According to this embodiment, the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28, and the right side plate 30 of the rectangular parallelepiped electronic substrate case 10 are each made of stone. In general, stone has a lower thermal conductivity than metal. Therefore, when there is a heating element around the case 10, it is possible to protect the electronic substrate from heat. For example, an audio amplifier circuit board (especially a high-resolution type) needs to operate stably in order to produce good sound. In this embodiment, by forming the case 10 from stone, the stone gently absorbs the heat generated by the circuit board, which makes it easier to stably operate the circuit board. is.). Furthermore, since the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 are made of stone, when compared with a metal case, the solid feeling and the like is unique. It becomes possible to bring about designability.
　本実施形態において、電子基板用ケース１０を構成する石材は、電磁波シールド性を有する鉱物（鉄、銅、アルミニウム、ニッケル等）を含む。これにより、ケース１０内部の電子基板に対する電磁シールド性を向上可能となる。 In the present embodiment, the stone material forming the electronic substrate case 10 contains minerals (iron, copper, aluminum, nickel, etc.) having electromagnetic wave shielding properties. This makes it possible to improve the electromagnetic shielding performance for the electronic substrate inside the case 10 .
　本実施形態において、電子基板用ケース１０を構成する石材は、花崗岩、御影石、大理石、安山岩、閃緑岩、斑レイ岩及び片麻岩のいずれかから選択される。これらの石材を用いることで、墓石に用いられるような重厚な外観をもたらすことが可能となる。 In this embodiment, the stone material forming the electronic substrate case 10 is selected from granite, granite, marble, andesite, diorite, gabbro, and gneiss. By using these stone materials, it is possible to bring about a dignified appearance that is used for tombstones.
　本実施形態において、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０は、接着剤（紫外線硬化樹脂等）により互いに接合されている。これにより、電子基板用ケース１０の組立てが容易となる。 In this embodiment, the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30 are joined together with an adhesive (ultraviolet curing resin or the like). This facilitates assembly of the electronic board case 10 .
　本実施形態において、前板２０及び後ろ板２２には、電子基板用ケース１０の内側に突出する矩形状の位置決め用凸部５０が設けられる（図２）。位置決め用凸部５０の各辺の長さは、凸部５０が面する電子基板用ケースの内部空間の各辺の長さより若干短い。これにより、電子基板用ケース１０（特に前板２０及び後ろ板２２）の組立てが容易となる。 In this embodiment, the front plate 20 and the rear plate 22 are provided with rectangular positioning projections 50 that protrude inside the electronic board case 10 (FIG. 2). The length of each side of the positioning protrusion 50 is slightly shorter than the length of each side of the internal space of the electronic board case facing the protrusion 50 . This facilitates assembly of the electronic board case 10 (especially the front plate 20 and the rear plate 22).
　本実施形態において、前板２０には、配線用孔部４０が形成されている（図１）。これにより、電子基板の配線の引き回しが容易になる。 In this embodiment, a wiring hole 40 is formed in the front plate 20 (Fig. 1). This facilitates wiring of the electronic substrate.
＜Ｂ．変形例＞
　なお、本発明は、上記実施形態に限らず、本明細書の記載内容に基づき、種々の構成を採り得ることはもちろんである。例えば、以下の構成を採用することができる。 <B. Variation>
In addition, the present invention is not limited to the above-described embodiments, and can of course adopt various configurations based on the descriptions of this specification. For example, the following configuration can be adopted.
［Ｂ－１．石材］
　上記実施形態では、電子基板用ケース１０を構成する全ての板材（すなわち、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０）を石材で構成した。しかしながら、例えば、電子基板用ケース１０の意匠性の観点からすれば、これに限らない。例えば、前板２０、後ろ板２２、上板２４、下板２６、左側板２８及び右側板３０は石材で構成する一方、下板２６は、別の素材（例えば金属板）から構成してもよい。 [B-1. stone]
In the above-described embodiment, all the plate members (that is, the front plate 20, the rear plate 22, the upper plate 24, the lower plate 26, the left side plate 28 and the right side plate 30) constituting the electronic substrate case 10 are made of stone. However, for example, from the viewpoint of the design of the electronic board case 10, it is not limited to this. For example, the front plate 20, the rear plate 22, the top plate 24, the bottom plate 26, the left plate 28 and the right plate 30 can be constructed of stone, while the bottom plate 26 can be constructed of another material (eg, metal plate). good.
　上記実施形態では、電子基板用ケース１０を構成する各板材を構成する石材は電磁波シールド性を有する鉱物を含んでいた。しかしながら、例えば、意匠性の観点からすれば、これに限らず、石材は、電磁波シールド性を有する鉱物を含まないことも可能である。そのような場合、ケース１０の内部において、各板の内面に石材以外の電磁波シールド材（例えば金属製メッシュ、金属製シート又は樹脂製シート）を配置してもよい。 In the above-described embodiment, the stone material constituting each plate material constituting the electronic substrate case 10 contains a mineral having electromagnetic wave shielding properties. However, for example, from the viewpoint of design, the stone is not limited to this, and it is also possible that the stone does not contain minerals having electromagnetic wave shielding properties. In such a case, inside the case 10, an electromagnetic wave shielding material other than stone (for example, metal mesh, metal sheet, or resin sheet) may be arranged on the inner surface of each plate.
［Ｂ－２．配線用孔部４０］
　上記実施形態では、配線用孔部４０を前板２０に設けた（図１）。しかしながら、例えば、電子基板の配線を外部に引き回す観点からすれば、配線用孔部４０は他の板に設けてもよい。或いは、例えば下板２６の幅を前板２０及び後ろ板２２よりも小さくすることで下板２６と左側板２８又は右側板３０の間に配線用孔部４０を設けることも可能である。さらに、ケース１０内の電子基板への給電及び信号のやり取りが無線で可能である場合、電子基板用ケース１０に配線用孔部４０を設けないことも可能である。 [B-2. Wiring hole 40]
In the above embodiment, the wiring holes 40 are provided in the front plate 20 (FIG. 1). However, the wiring holes 40 may be provided in another plate, for example, from the viewpoint of routing the wiring of the electronic substrate to the outside. Alternatively, for example, the width of the lower plate 26 may be made smaller than that of the front plate 20 and the rear plate 22 to provide the wiring holes 40 between the lower plate 26 and the left side plate 28 or right side plate 30 . Furthermore, when power supply to the electronic substrate in the case 10 and signal exchange can be performed wirelessly, the wiring hole 40 may not be provided in the electronic substrate case 10 .
［Ｂ－３．位置決め用凸部５０］
　上記実施形態では、前板２０及び後ろ板２２に位置決め用凸部５０（図２）を設けたが、必要に応じて他の板（上板２４、下板２６、左側板２８及び右側板３０のいずれか）に設けてもよい。また、例えば、各板を石材で構成する点に着目すれば、位置決め用凸部５０は設けなくてもよい。 [B-3. Positioning protrusion 50]
In the above-described embodiment, the positioning protrusions 50 (FIG. 2) are provided on the front plate 20 and the rear plate 22, but other plates (upper plate 24, lower plate 26, left side plate 28 and right side plate 30) may be provided as necessary. ) may be provided. Further, for example, if attention is paid to the fact that each plate is made of stone, the positioning convex portion 50 may not be provided.
［Ｂ－４．製造方法］
　上記実施形態では、図３に示す順番で電子基板用ケース１０（又は電子基板ユニット）を組み立てた。しかしながら、例えば、各板を石材で構成する観点からすれば、これに限らず、別の順番で電子基板用ケース１０を組み立ててもよい。 [B-4. Production method]
In the above embodiment, the electronic board case 10 (or electronic board unit) was assembled in the order shown in FIG. However, for example, from the viewpoint of configuring each plate with stone, the electronic substrate case 10 may be assembled in a different order without being limited to this.
　上記実施形態では、接着剤を用いて各板を接合した。しかしながら、例えば、各板を石材で構成する観点からすれば、これに限らない。例えば、各板に係合部を設け、これらの係合部により各板を接合してもよい。 In the above embodiment, each plate was joined using an adhesive. However, for example, from the viewpoint of configuring each plate with stone, the present invention is not limited to this. For example, each plate may be provided with an engaging portion and the plates may be joined by these engaging portions.
［Ｂ－５．その他］
　上記実施形態では、電子基板用ケース１０は配線用孔部４０を除き閉塞していたが（図１）、他に孔部を形成してもよい。例えば、放熱用孔部を上板２４に形成してもよい。或いは、前記放熱用孔部は、上板２４の幅を前板２０及び後ろ板２２よりも小さくすることで上板２４と左側板２８又は右側板３０の間に設けることも可能である。 [B-5. others]
In the above embodiment, the electronic substrate case 10 is closed except for the wiring hole 40 (FIG. 1), but other holes may be formed. For example, heat dissipation holes may be formed in the top plate 24 . Alternatively, the heat radiation holes can be provided between the top plate 24 and the left side plate 28 or the right side plate 30 by making the width of the top plate 24 smaller than that of the front plate 20 and the rear plate 22 .
１０…電子基板用ケース　　　　　　　　２０…前板
２２…後ろ板　　　　　　　　　　　　　２４…上板
２６…下板　　　　　　　　　　　　　　２８…左側板
３０…右側板　　　　　　　　　　　　　４０…配線用孔部
５０…位置決め用凸部 DESCRIPTION OF SYMBOLS 10... Electronic board case 20... Front plate 22... Rear plate 24... Upper plate 26... Lower plate 28... Left side plate 30... Right side plate 40... Wiring hole 50... Positioning projection

Claims (7)

  1. 　前板、後ろ板、上板、下板、左側板及び右側板を含む直方体状の電子基板用ケースであって、
    　少なくとも前記前板、前記後ろ板、前記上板、前記左側板及び前記右側板が石材で形成される
    　ことを特徴とする電子基板用ケース。     A rectangular parallelepiped electronic board case including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate,
    An electronic substrate case, wherein at least the front plate, the rear plate, the upper plate, the left side plate and the right side plate are made of stone.
  2. 　請求項１に記載の電子基板用ケースにおいて、
    　前記石材は、電磁波シールド性を有する鉱物を含む
    　ことを特徴とする電子基板用ケース。     In the electronic board case according to claim 1,
    An electronic substrate case, wherein the stone material includes a mineral having electromagnetic wave shielding properties.
  3. 　請求項１又は２に記載の電子基板用ケースにおいて、
    　前記石材は、花崗岩、御影石、大理石、安山岩、閃緑岩、斑レイ岩及び片麻岩のいずれかから選択される
    　ことを特徴とする電子基板用ケース。     In the electronic board case according to claim 1 or 2,
    The electronic substrate case, wherein the stone material is selected from any one of granite, granite, marble, andesite, diorite, gabbros and gneiss.
  4. 　請求項１～３のいずれか１項に記載の電子基板用ケースにおいて、
    　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板は、接着剤により互いに接合されている
    　ことを特徴とする電子基板用ケース。     In the electronic board case according to any one of claims 1 to 3,
    The electronic substrate case, wherein the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate are bonded to each other with an adhesive.
  5. 　請求項１～４のいずれか１項に記載の電子基板用ケースにおいて、
    　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板のいずれかには、前記電子基板用ケースの内側に突出する矩形状の位置決め用凸部が設けられ、
    　前記位置決め用凸部の各辺の長さは、前記位置決め用凸部が面する前記電子基板用ケースの内部空間の各辺の長さより短い
    　ことを特徴とする電子基板用ケース。     In the electronic board case according to any one of claims 1 to 4,
    Any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate, and the right side plate is provided with a rectangular positioning projection projecting inside the electronic board case,
    The electronic board case, wherein the length of each side of the positioning protrusion is shorter than the length of each side of the internal space of the electronic board case facing the positioning protrusion.
  6. 　請求項１～５のいずれか１項に記載の電子基板用ケースにおいて、
    　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板のいずれかには、配線用の孔部が形成されている
    　ことを特徴とする電子基板用ケース。     In the electronic board case according to any one of claims 1 to 5,
    An electronic substrate case, wherein a wiring hole is formed in any one of the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate.
  7. 　前板、後ろ板、上板、下板、左側板及び右側板を含む直方体状の電子基板用ケースの製造方法であって、
    　石材を板状に加工して少なくとも前記前板、前記後ろ板、前記上板、前記左側板及び前記右側板を形成するステップと、
    　前記前板、前記後ろ板、前記上板、前記下板、前記左側板及び前記右側板を組み立てて前記電子基板用ケースを形成するステップと
    　を有することを特徴とする電子基板用ケースの製造方法。     A method for manufacturing a rectangular parallelepiped electronic substrate case including a front plate, a rear plate, an upper plate, a lower plate, a left side plate and a right side plate, comprising:
    forming at least the front plate, the rear plate, the upper plate, the left side plate and the right side plate by processing stone into plates;
    and assembling the front plate, the rear plate, the upper plate, the lower plate, the left side plate and the right side plate to form the electronic board case. .
PCT/JP2021/025227 2021-05-12 2021-07-02 Case for electronic substrate, and method for manufacturing case for electronic substrate WO2022239261A1 (en)

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JPS59161680U (en) * 1983-04-14 1984-10-29 山水電気株式会社 Electronic device housing device
JP2006342624A (en) * 2005-06-10 2006-12-21 Kotobuki Kyodo Sekizai Kk Stone for grave using divided stone slab and its integrating method
JP3170549U (en) * 2011-07-05 2011-09-22 株式会社コーデック Memory device using granite for external housing
CN202113284U (en) * 2011-04-28 2012-01-18 宋振顺 Phylactery
JP2017097931A (en) * 2015-11-19 2017-06-01 ティアック株式会社 Record player turntable sheet
JP2019138125A (en) * 2018-02-08 2019-08-22 宗広 神津 Grave having ground installation type hybrid charnel chamber

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161680U (en) * 1983-04-14 1984-10-29 山水電気株式会社 Electronic device housing device
JP2006342624A (en) * 2005-06-10 2006-12-21 Kotobuki Kyodo Sekizai Kk Stone for grave using divided stone slab and its integrating method
CN202113284U (en) * 2011-04-28 2012-01-18 宋振顺 Phylactery
JP3170549U (en) * 2011-07-05 2011-09-22 株式会社コーデック Memory device using granite for external housing
JP2017097931A (en) * 2015-11-19 2017-06-01 ティアック株式会社 Record player turntable sheet
JP2019138125A (en) * 2018-02-08 2019-08-22 宗広 神津 Grave having ground installation type hybrid charnel chamber

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