WO2022237352A1 - 天线结构及电子设备 - Google Patents

天线结构及电子设备 Download PDF

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Publication number
WO2022237352A1
WO2022237352A1 PCT/CN2022/083091 CN2022083091W WO2022237352A1 WO 2022237352 A1 WO2022237352 A1 WO 2022237352A1 CN 2022083091 W CN2022083091 W CN 2022083091W WO 2022237352 A1 WO2022237352 A1 WO 2022237352A1
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WO
WIPO (PCT)
Prior art keywords
point
antenna radiator
ground
frequency band
grounding
Prior art date
Application number
PCT/CN2022/083091
Other languages
English (en)
French (fr)
Inventor
姜文禹
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022237352A1 publication Critical patent/WO2022237352A1/zh
Priority to US18/505,357 priority Critical patent/US20240079796A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/30Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/27Adaptation for use in or on movable bodies
    • H01Q1/273Adaptation for carrying or wearing by persons or animals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/28Combinations of substantially independent non-interacting antenna units or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present invention relates to the field of wireless communication, in particular to an antenna structure for wireless communication and electronic equipment with the antenna structure.
  • 5G communication has gradually become popular.
  • the number of antenna radiators is more than that of 4G LTE.
  • full screens and curved screens have become the mainstream. Due to the design requirements of full screens and curved screens, the clearance area and space are getting smaller and smaller, and some antenna radiators are located very close to the ground. As a result, the isolation of the antenna radiator is reduced, causing interference between the antenna radiators, and affecting the performance of the antenna radiator.
  • Embodiments of the present application provide an antenna structure and electronic equipment to solve the above problems.
  • an electronic device in one aspect, includes a first antenna radiator, a second antenna radiator, a first feed source, and a second feed source, the first antenna radiator includes a first feed point, The first ground point, the second antenna radiator includes a second feed point and a second ground point, the first ground point is adjacent to the second ground point, and the first feed point is set at The first ground point is far away from the side of the second ground point, and the second feed point is set on the side of the second ground point far away from the first ground point; the first feed source It is electrically connected with the first feed point of the first antenna radiator, and is used to provide a feed signal for the first antenna radiator through the first feed point, and the second feed source is connected to the first antenna radiator.
  • the second feed point of the two antenna radiators is electrically connected, and is used to provide a feed signal for the second antenna radiator through the second feed point, wherein the first ground point and the second ground point are both grounding; wherein, the first antenna radiator further includes a third ground point and a ground element, the third ground point is set between the first feed point and the first ground point, and the ground element connected between the third ground point and ground.
  • an antenna structure includes a first antenna radiator and a second antenna radiator, the first antenna radiator includes a first feed point, a first ground point, and the first antenna radiator includes a first feed point and a first ground point.
  • the two antenna radiators include a second feed point and a second ground point, the first ground point is adjacent to the second ground point, and the first feed point is set far from the first ground point.
  • the first antenna radiator also includes a third ground point A location and a grounding element, the third grounding point is disposed between the first feeding point and the first grounding point, and the grounding element is connected between the third grounding point and ground.
  • the return position of the first antenna radiator is changed, so that the first antenna radiates
  • the distance between the ground return position between the antenna radiator and the second antenna radiator is increased, which improves the isolation between the first antenna radiator and the second antenna radiator, and reduces the distance between the first antenna radiator and the second antenna radiator. Interference between antenna radiators improves antenna radiator performance.
  • FIG. 1 is a schematic diagram of the principle of an electronic device in an embodiment of the present application.
  • FIG. 2 is a schematic plan view of an electronic device in an embodiment of the present application.
  • Fig. 3 is a schematic diagram of the current distribution when the second antenna radiator and the first antenna radiator of the electronic device in an embodiment of the present application work in the first frequency band.
  • FIG. 4 is a schematic diagram of a grounding element of an electronic device in an embodiment of the present application.
  • FIG. 5 is a first specific example diagram of a grounding element of an electronic device in an embodiment of the present application.
  • FIG. 6 is a second specific example diagram of a grounding element of an electronic device in an embodiment of the present application.
  • FIG. 7 is a functional block diagram illustrating some components of an electronic device in an embodiment of the present application.
  • FIG. 8 is a schematic diagram of the isolation between the first antenna radiator and the second antenna radiator when they work in the first frequency band in an embodiment of the present application.
  • FIG. 1 is a schematic schematic diagram of an electronic device in an embodiment of the present application
  • FIG. 2 is a schematic plan view of an electronic device 100 in an embodiment of the present application. As shown in FIG. 1 and FIG.
  • the electronic device 100 includes an antenna structure 200, the antenna structure 200 includes a first antenna radiator 10 and a second antenna radiator 20, and the first antenna radiator 10 includes a first Feed point 11, first ground point 12, the second antenna radiator 20 includes a second feed point 21, a second ground point 22, the first ground point 12 is adjacent to the second ground point 22 Set, the first feed point 11 is set on the side of the first ground point 12 away from the second ground point 22, and the second feed point 21 is set on the side far from the second ground point 22 One side of the first grounding point 12 .
  • the first antenna radiator 10 further includes a third ground point 13 and a ground element 14, the third ground point 13 is arranged between the first feeding point 11 and the first ground point 12, The ground element 14 is connected between the third ground point 13 and ground.
  • the electronic device 100 further includes a first feed source 30 and a second feed source 40 , the first feed source 30 and the first feed point of the first antenna radiator 10 11 is electrically connected to provide a feed signal for the first antenna radiator 10 through the first feed point 11, and the second feed source 40 is connected to the second feed of the second antenna radiator 20
  • the point 21 is electrically connected to provide a feed signal for the second antenna radiator 20 through the second feed point 21 , wherein both the first ground point and the second ground point are grounded.
  • the first antenna radiator 10 is changed. Return to the ground position, so that the distance between the first antenna radiator 10 and the second antenna radiator 20 increases, and the isolation between the first antenna radiator 10 and the second antenna radiator 20 is improved. degree, the interference between the first antenna radiator 10 and the second antenna radiator 20 is reduced, and the performance of the antenna radiator is improved.
  • the layout of the antenna radiator is relatively compact.
  • the first ground point 12 of the first antenna radiator 10 It will be closer to the second ground point 22 of the second antenna radiator 20 , resulting in ground-back interference between the first antenna radiator 10 and the second antenna radiator 20 .
  • the third ground point 13 is The location 12 is farther away from the second ground point 22, so that the distance between the first antenna radiator 10 and the second antenna radiator 20 increases, and the distance between the first antenna radiator 10 and the second antenna radiator 20 increases.
  • the isolation between the second antenna radiators 20 are feed currents generated by the first feed source 30 and the second feed source 40 .
  • the first antenna radiator 10 and the second antenna radiator 20 both support the first frequency band
  • the third ground point 13 is at least used to improve the The isolation between the radiator 10 and the second antenna radiator 20 when both work in the first frequency band, that is, improve the isolation between the first antenna radiator 10 and the second antenna radiator 20 that both work in the first frequency band Spend.
  • the first antenna radiator 10 also includes a fourth ground point 15, the fourth ground point 15 is set at the first feed point 11 away from the first ground point 12 on one side.
  • the first antenna radiator 10 also supports the second frequency band, wherein the current path formed by the first feed point 11 to the third ground point 13 and the ground element 14 is used to support the first frequency band
  • the two current paths formed from the first feed point 11 to the first ground point 12 and the fourth ground point 15 are used to support the transmission and reception of radio frequency signals in the second frequency band. That is, the feed signal received from the first feed point 11 returns to the ground through the third ground point 13 and the ground element 14, so that the first antenna radiator 10 resonates in the first frequency band, and supports all Sending and receiving of radio frequency signals in the first frequency band.
  • the feed signal received from the first feed point 11 also returns to the ground through the first ground point 12 and the fourth ground point 15, so that the first antenna radiator 10 resonates in the second frequency band , supporting the sending and receiving of radio frequency signals in the second frequency band.
  • the feed signal/feed current received from the first feed point 11 mainly returns to the ground through the first ground point 12 and the fourth ground point 15, and at least partly passes through the first ground point 12.
  • the three grounding points 13 and the grounding element 14 are returned to the ground, so as to realize the tuning/fine-tuning of the second frequency band.
  • the first frequency band is the 5G N78 frequency band (the N78 frequency band under the 5G NSA communication standard), and the second frequency band is the MHB (Middle high band) frequency band.
  • the first frequency band and the second frequency band may be other frequency bands.
  • the frequency bands supported by the second antenna radiator 20 and the first antenna radiator 10 may be the same, that is, the second antenna radiator 20 may also support the second frequency band while simultaneously supporting the first frequency band and the first frequency band.
  • Two frequency bands that is, support MHB frequency band and 5G N78 frequency band.
  • the current path from the second feed point 21 to the second ground point 22 is used to realize the transmission and reception of radio frequency signals in the first frequency band and the second frequency band, that is, from the second feed point 21
  • the received feed signal returns to the ground through the second ground point 22, so that the second antenna radiator 20 resonates in the first frequency band and the second frequency band at the same time, and realizes the first frequency band and the second frequency band at the same time. Transceiver of radio frequency signals.
  • improving the isolation between the first antenna radiator 10 and the second antenna radiator 20 specifically refers to improving the simultaneous operation of the first antenna radiator 10 and the second antenna radiator 20.
  • One frequency band such as the isolation of 5G N78 frequency band.
  • first grounding point 11 , the second grounding point 12 and the fourth grounding point 15 can be grounded through electrical connectors such as wires, FPC, and metal shrapnel.
  • FIG. 3 is a schematic diagram of current distribution when the second antenna radiator 10 and the first antenna radiator 10 of the electronic device 100 work in the first frequency band.
  • the first frequency band that is, the transmission and reception of radio frequency signals in the 5G N78 frequency band is mainly realized through the feed path from the first feed point to the third ground point 13 and the ground element 14 back to the ground, That is, at this time, the feed signal/feed current is transmitted from the first feed point 11 to the third ground point 13 and the ground element 14 and back to the ground, and the feed of the second antenna radiator 10 The signal/feed current is transmitted from the second feed point 21 to the second ground point 22 and back to ground.
  • the third ground point 13 is farther away from the second ground point 22 of the second antenna radiator 20 than the first ground point 12, therefore, when the first antenna radiator 10 and the second antenna radiator 20 When working in the 5G N78 frequency band at the same time, the distance between the first antenna radiator 10 and the second antenna radiator 20 is relatively increased, which improves the radiation of the first antenna radiator 10 and the second antenna radiator.
  • the degree of isolation between bodies 20 is relatively increased, which improves the radiation of the first antenna radiator 10 and the second antenna radiator.
  • FIG. 1 and FIG. 2 there is a gap 51 between the first feed point 11 of the first antenna radiator 10 and the third ground point 13, and the third ground point 13 is specifically located at Between the gap 51 and the first grounding point 12 .
  • the feed signal received by the first feed point 11 of the first antenna radiator 10 is coupled and transmitted to the third ground point 13 and/or the first ground point 11 by way of coupling feed.
  • the electronic device 100 includes a metal frame 50, wherein the metal frame 50 is provided with at least one slit 51, and the metal frame 50 is divided into at least one frame segment 52 .
  • FIG. 2 wherein, as shown in FIG. 1 and FIG. Paragraph 52b.
  • the first feeding point 11 of the first antenna radiator 10 is set at a position close to the second frame section 52b of the first frame section 52a, and the first feeding point 11 of the first antenna radiator 10
  • a grounding point 12 and a third grounding point 13 are set on the second frame segment 52b close to the first frame segment 52a, and the third grounding point 13 is set between the first grounding point 12 and the
  • the second feed point 21 is set at a position away from the first frame segment 52a of the second frame segment 52b
  • the second grounding point 22 is set at the second on the frame segment 52b and between the second feeding point 21 and the first grounding point 12 .
  • the first frame segment 52a is straight and located on the first side B1 of the electronic device 100, and the second frame segment 52b extends on the side of the electronic device 100.
  • the second frame segment 52b is in an inverted "L" shape.
  • the second frame segment 52b includes a first sub-frame segment 521b and a second sub-frame segment 522b, and the first sub-frame segment 521 is the second frame segment 52b located on the first A part of the side B1, the second sub-frame segment 522b is a part of the second frame segment 52b located on the second side B2 of the electronic device 100 .
  • the first feeding point 11 is arranged at a position of the first frame segment 52a close to the second frame segment 52b (namely, the first sub-frame segment 521b).
  • the first feed source 30 is connected to the first feed point 11 .
  • the first ground point 12 and the third ground point 13 of the first antenna radiator 10 are disposed on the first subframe segment 521b, and the first ground point 12 is compared with the third ground point 13 Closer to the first frame segment 52a.
  • the second feeding point 21 is set at a position of the second sub-frame segment 522b away from the first sub-frame segment 521b, and the second grounding point 22 is set at a position close to the second sub-frame segment 522b.
  • first frame segment 52 a and the first sub-frame segment 521 b of the second frame segment 52 b located on the first side B1 of the electronic device 100 constitute the first antenna radiator 10 .
  • the second sub-frame segment 522b constitutes the second antenna radiator 20 .
  • the second antenna radiator 20 After the second feed point 21 receives the feed signal/feed current of the second feed source 40, it is transmitted to the The second ground point 22 is returned to the ground, so as to realize the sending and receiving of radio frequency signals in the first frequency band and the second frequency band. That is, the second antenna radiator 20 can support the transmission and reception of radio frequency signals in the first frequency band and the second frequency band under the excitation of the feed signal generated by the second feed source 40, for example, support the MHB frequency band and the 5G N78 frequency band Transceiver of radio frequency signals.
  • the first side B1 of the electronic device 100 is a short side
  • the second side B2 is a long side adjacent to the first side B1.
  • FIG. 2 is a schematic structural diagram of the electronic device 100 showing only part of the antenna radiator.
  • the metal frame 50 also includes a plurality of other frame segments distributed on the first side B1 and its opposite side, the second side B2 and its opposite side, and separated by gaps.
  • the antenna structure 200 also includes a plurality of other antenna radiators formed by these other frame segments, which are not shown in the figure because they are irrelevant to the improvement of the present invention.
  • first antenna radiator 10 and the second antenna radiator 20 there may be no gap between the first antenna radiator 10 and the second antenna radiator 20, and they share one radiator, for example, the first antenna radiator 10 and the second antenna radiator Both the feeding point and the grounding point of the two antenna radiators 20 are connected to the same frame segment.
  • the electronic device 100 further includes a middle frame 60, which is a panel-shaped frame for supporting a display screen (not shown in the figure) of the electronic device 100, wherein the middle
  • the frame is made of metal materials, such as copper, iron, or copper-iron alloy.
  • the middle frame is used as the whole ground of the electronic device 100 .
  • first ground point 11 , the second ground point 12 , the third ground point 13 and the fourth ground point 15 are electrically connected to the middle frame 60 to achieve grounding.
  • first grounding point 11, the second grounding point 12, and the fourth grounding point 15 can be electrically connected to the middle frame 60 through electrical connectors such as wires, FPCs, and metal shrapnel to be grounded.
  • the third grounding point 13 can be electrically connected to the middle frame 60 through the aforementioned grounding element 14 to be grounded.
  • the middle frame 60 is originally a square frame whose four sides approximately extend to a position flush with the four sides of the metal frame 50 . etc. to form a clearance area, avoiding the impact on the radio frequency transmission and reception of the antenna radiator formed by the metal frame 50, and retaining a part of the area that is still in electrical contact with the metal frame 50, thereby realizing the grounding of the antenna radiator.
  • the middle frame 60 has at least one area extending to the metal frame 50, for example, area 61 shown in FIG.
  • the second ground point 22 of the antenna radiator 20 is electrically connected to the region 61 directly or through electrical contact/electrical connection through an electrical connector such as an FPC or a metal shrapnel, so as to realize grounding. That is, as shown in FIG.
  • the region 61 of the middle frame 60 extends to the corresponding position of the metal frame 50 , for example, extends to the bottom or inside of the metal frame 50 , and the first antenna radiator 10
  • the first grounding point 12 of the second antenna radiator 20 and the second grounding point 22 of the second antenna radiator 20 are both directly contacted and electrically connected to the region 61 of the middle frame 60 or electrically connected through an electrical connector such as an FPC or a metal shrapnel, And achieve grounding.
  • the metal frame 50 may be a bare metal frame, that is, the metal material of the metal frame 50 can be directly seen from the appearance of the electronic device 100 .
  • the metal frame 50 may also be a metal frame wrapped with a non-conductive material such as plastic formed by an MDA (In-Mold-Insert Integrated) process.
  • MDA In-Mold-Insert Integrated
  • the inner side of the metal frame 50 can be provided with a through hole passing through the non-conductive material, so that the antenna radiator formed by the metal frame 50 The feed point and ground point of the antenna are exposed to be electrically connected to the corresponding feed source or ground to realize the excitation of the antenna radiator.
  • the grounding element 14 can be a switching element, and the grounding element 14 is a digitally controlled switch, such as a controlled switch such as a MOS tube or a triode, which can be controlled to conduct Or disconnect, and realize that the third grounding point 13 is grounded or not grounded.
  • the grounding switch 14 can also be a matching element such as a capacitor, an inductor, or an LC parallel circuit, or a structure in which a switching element and a matching element are connected in series.
  • the matching and tuning can be effectively performed as required.
  • the first antenna radiator 10 and the second antenna radiator 20 work in the 5G N78 frequency band
  • the first antenna radiator 10 and the second antenna radiator 20 work by controlling the switch element to be turned on.
  • the isolation degree in the 5G N78 frequency band, and when the first antenna radiator 10 and the second antenna radiator 20 work in the MHB frequency band keep the switching element turned on, and further fine-tune the MHB frequency band, For example, the operating frequency point of the MHB frequency band is adjusted to improve the performance of the first antenna radiator 10 working in the MHB frequency band.
  • the grounding element 14 may also be electrical connectors such as wires, FPC, and metal shrapnel.
  • the ground element 14 may be at least one of a switch element, a capacitor, an inductor, a wire, an FPC, and a metal shrapnel.
  • FIG. 4 is a schematic diagram of the grounding element 14 in an embodiment of the present application.
  • the ground element 14 includes a plurality of parallel matching element branches Z1, each matching element branch includes a series matching element M1 and a switch SW1, and the matching elements M1 in different matching branches Z1 At least one of the types and parameters is different; by controlling the on-off of switches in different matching element branches, different matching element branches are selected to work and the frequency point of the working frequency band of the first antenna radiator 10 can be adjusted/ fine-tuning.
  • FIG. 5 is a first specific example diagram of the grounding element 14 in an embodiment of the present application.
  • the grounding element 14 includes a first inductance matching branch Z11, a first capacitance matching branch Z12, a second capacitance matching branch connected in parallel between the third ground point 13 and the ground.
  • a branch Z13 and a third capacitance matching branch Z14 the first inductance matching branch Z11 includes a series-connected first matching inductor L11 and a switch SW1
  • the first capacitance matching branch Z12 includes a series-connected first matching capacitor C11 and the switch SW1
  • the second capacitance matching branch Z13 includes a second matching capacitor C12 and a switch SW1 connected in series
  • the third capacitance matching branch Z14 includes a third matching capacitor C13 and a switch SW1 connected in series.
  • the capacitance values of the first matching capacitor C11 , the second matching capacitor C12 and the third matching capacitor C13 are different. Therefore, since the types or parameters of the first inductance matching branch Z11, the first capacitance matching branch Z12, the second capacitance matching branch Z13, and the third capacitance matching branch Z14 are different, when different matching branches are turned on or When the matching branches of different combinations are turned on, different matching parameters are generated to realize resonance matching in different frequency bands.
  • FIG. 6 is a second specific example diagram of the grounding element 14 in an embodiment of the present application.
  • the grounding element 14 includes a second inductance matching branch Z15, a third inductance matching branch Z16, a fourth capacitance matching branch Z17 and The fifth capacitance matching branch Z18
  • the second inductance matching branch Z15 includes a series-connected second matching inductor L12 and a switch SW1
  • the third inductance matching branch Z16 includes a series-connected third matching inductor L13 and a switch S21
  • the fourth capacitance matching branch Z17 includes a fourth matching capacitor C14 and a switch SW1 connected in series
  • the fifth capacitance matching branch Z18 includes a fifth matching capacitor C15 and a switch SW1 connected in series.
  • the inductance values of the second matching inductor L12 and the third matching inductor L13 are different, and the capacitance values of the fourth matching capacitor C14 and the fifth matching capacitor C15 are different. Therefore, when different matching branches are turned on or different combinations of matching branches are turned on, different matching parameters are generated to realize resonance matching in different frequency bands.
  • the switch SW1 is a digitally controlled switch, such as a MOS transistor, a BJT transistor, and the like.
  • FIG. 7 is a functional block diagram illustrating some components of the electronic device 100 .
  • the electronic device 100 includes the aforementioned antenna structure 200 , the first feed source 30 , the second feed source 40 , the metal frame 50 , and the middle frame 60 , and may further include a processor 70 and a memory 80 .
  • the memory 80 may store the corresponding relationship between each frequency point of the first frequency band and the second frequency band supported by the first antenna radiator 10 and the switch control logic in the switch unit.
  • the processor 2 may include a plurality of output control terminals, and the multiple output control terminals may be respectively connected to the controlled terminals of all switches SW1 of the ground element 14 one by one, for example, when the ground element 14
  • the switch SW1 is a MOS transistor
  • multiple output control terminals of the processor 2 can be respectively connected to the gates of all the MOS transistors of the grounding element 14 .
  • the processor 2 can determine the switch control logic according to the current tuning requirements, and control each output control terminal to output a signal of a corresponding level to the controlled terminal of the corresponding switch SW1 in the ground element 14, and control at least one switch unit Multiple switches SW1 in 16 are turned on or off accordingly.
  • the processor 2 may determine the frequency point to which the current working frequency band needs to be tuned according to the current working frequency band of the first antenna radiator 10 and the current application of the electronic device 100, and then store The corresponding relationship determines the corresponding switch control logic, and controls the plurality of switches SW1 in the grounding element 14 to be turned on or off accordingly, so that the grounding element 14 is adjusted to the corresponding matching parameters, so that the first The antenna radiator 10 is tuned to a corresponding frequency point in the corresponding first frequency band or the second frequency band.
  • the frequency point refers to the resonance center frequency of the corresponding frequency band. By tuning the frequency point, the resonance can be maximized and the performance of the antenna radiator can be optimized.
  • the processor 2 may determine that it needs to be tuned to the first frequency band of the first frequency band. point, if the currently running application is a voice call application, it is determined that the second frequency point of the first frequency band needs to be tuned.
  • the above is only an example, and it is only for illustration, and the frequency points to be tuned to are different according to different applications currently running.
  • each matching element branch includes a series matching element M1 and a switch SW1, and the types of matching elements M1 in different matching branches Z1 Different from at least one of the parameters, in addition to improving the isolation between the first antenna radiator 10 and the second antenna radiator 20 when they work in the 5G N78 frequency band, it is also possible to further tune the 5G N78 frequency band and the HMB frequency band.
  • FIG. 8 is a schematic diagram of the isolation of the first antenna radiator and the second antenna radiator in an embodiment of the present application when they work in the second frequency band, that is, when they work in the 5G N78 frequency band.
  • the isolation D1 between the first antenna radiator 10 and the second antenna radiator 20 is basically below -23db, and the isolation is relatively obvious. Interference is already very low, effectively reducing interference.
  • the S parameters of the first antenna radiator 10 and the second antenna radiator 20 in FIG. 7 are at about -15 and -10 respectively, and in fact the efficiency of the first antenna radiator 10 and the second antenna radiator 20 is also effectively improved. That is, the first antenna radiator 10 and the second antenna radiator 20 not only do not decrease, but each has a certain increase due to the improvement of the isolation, for example, an increase of 0.3-0.5db.
  • the electronic device 100 also includes other components, such as a rear case, a camera, etc., which are not related to the improvement of the present invention, so details are not repeated here.
  • the electronic device 100 involved in the embodiment of the present invention may include various handheld devices such as mobile phones and tablet computers with antenna radiators, vehicle-mounted devices, wearable devices, computing devices or other processing devices connected to wireless modems, and various In the form of user equipment (User Equipment, UE), mobile station (Mobile Station, MS) and so on.
  • UE User Equipment
  • MS Mobile Station
  • the return position of the first antenna radiator 10 is changed. , so that the distance between the first antenna radiator 10 and the second antenna radiator 20 increases, the isolation between the first antenna radiator 10 and the second antenna radiator 20 is improved, and the Or the interference between the first antenna radiator 10 and the second antenna radiator 20 is avoided, and the performance of the antenna radiator is improved.

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Abstract

本申请提供一种电子设备,包括第一天线辐射体、第二天线辐射体、第一馈源及第二馈源,第一天线辐射体包括第一馈电点、第一接地点,第二天线辐射体包括第二馈电点、第二接地点,第一接地点与第二接地点相邻设置,第一馈电点设置于第一接地点远离第二接地点的一侧,第二馈电点设置于第二接地点的远离第一接地点的一侧。第一、第二馈源分别与第一、第二馈电点电连接,分别为第一、第二天线辐射体提供馈电信号,第一、第二接地点均接地。其中,第一天线辐射体还包括第三接地点以及接地元件,第三接地点设置于第一馈电点与第一接地点之间,接地元件连接于第三接地点与地之间。还提供一种天线结构。本申请可提高天线辐射体之间的隔离度,提高天线性能。

Description

天线结构及电子设备
本申请要求于2021-05-11在中国国家知识产局递交的申请号为“202110513133.9”、申请名称为“天线结构及电子设备”的发明专利申请的优先权。
技术领域
本发明涉及无线通信领域,具体涉及一种用于无线通信的天线结构以及具有所述天线结构的电子设备。
背景技术
目前,5G通信已经逐渐普及,随着5G通信频段的增加,天线辐射体的数量相比于4G LTE更多。而同时,全面屏、曲面屏等目前已经成为主流,由于全面屏、曲面屏等设计需求,导致净空区域和空间越来越小,也导致了部分天线辐射体的回地位置靠得很近,导致天线辐射体隔离度降低,造成天线辐射体间的干扰,影响天线辐射体性能。
发明内容
本申请实施例提供了一种天线结构及电子设备,以解决上述问题。
一方面,提供一种电子设备,所述电子设备包括第一天线辐射体、第二天线辐射体、第一馈源以及第二馈源,所述第一天线辐射体包括第一馈电点、第一接地点,所述第二天线辐射体包括第二馈电点、第二接地点,所述第一接地点与所述第二接地点相邻设置,所述第一馈电点设置于所述第一接地点远离所述第二接地点的一侧,所述第二馈电点设置于所述第二接地点的远离所述第一接地点的一侧;所述第一馈源与所述第一天线辐射体的第一馈电点电连接,用于通过所述第一馈电点为所述第一天线辐射体提供馈电信号,所述第二馈源与所述第二天线辐射体的第二馈电点电连接,用于通过所述第二馈电点为所述第二天线辐射体提供馈电信号,其中,所述第一接地点、第二接地点均接地;其中,所述第一天线辐射体还包括第三接地点以及接地元件,所述第三接地点设 置于所述第一馈电点与所述第一接地点之间,所述接地元件连接于所述第三接地点与地之间。
另一方面,还提供一种天线结构,所述天线结构包括第一天线辐射体、第二天线辐射体,所述第一天线辐射体包括第一馈电点、第一接地点,所述第二天线辐射体包括第二馈电点、第二接地点,所述第一接地点与所述第二接地点相邻设置,所述第一馈电点设置于所述第一接地点远离所述第二接地点的一侧,所述第二馈电点设置于所述第二接地点的远离所述第一接地点的一侧;其中,所述第一天线辐射体还包括第三接地点以及接地元件,所述第三接地点设置于所述第一馈电点与所述第一接地点之间,所述接地元件连接于所述第三接地点与地之间。
本申请通过在所述第一馈电点与所述第一接地点之间增加所述第三接地点以及接地元件进行接地,改变了第一天线辐射体的回地位置,使得第一天线辐射体与第二天线辐射体之间的回地位置的间距增大,提高了所述第一天线辐射体与第二天线辐射体之间的隔离度,减少所述第一天线辐射体与第二天线辐射体之间的干扰,提高了天线辐射体性能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的变形方式。
图1为本申请一实施例中的电子设备的原理示意图。
图2为本申请一实施例中的电子设备的平面示意图。
图3为本申请一实施例中的电子设备的第二天线辐射体与所述第一天线辐射体工作在第一频段时的电流分布的示意图。
图4为本申请一实施例中的电子设备的接地元件的示意图。
图5为本申请一实施例中的电子设备的接地元件的第一具体示例图。
图6为本申请一实施例中的电子设备的接地元件的第二具体示例图。
图7为本申请一实施例中的电子设备的示意出部分元件的功能模块图。
图8为本申请中一实施方式中第一天线辐射体和第二天线辐射体工作在第一频段时的隔离度示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有付出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例的描述中,需要理解的是,术语“上”、“下”、“厚度”、“宽度”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是暗示或指示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
请一并参阅图1及图2,图1为本申请一实施例中的电子设备的原理示意图,图2为本申请一实施例中的电子设备100的平面示意图。如图1及图2所示,所述电子设备100包括天线结构200,所述天线结构200包括第一天线辐射体10以及第二天线辐射体20,所述第一天线辐射体10包括第一馈电点11、第一接地点12,所述第二天线辐射体20包括第二馈电点21、第二接地点22,所述第一接地点12与所述第二接地点22相邻设置,所述第一馈电点11设置于所述第一接地点12远离所述第二接地点22的一侧,所述第二馈电点21设置于所述第二接地点22的远离所述第一接地点12的一侧。
其中,所述第一天线辐射体10还包括第三接地点13以及接地元件14,所述第三接地点13设置于所述第一馈电点11与所述第一接地点12之间,所述接地元件14连接于所述第三接地点13与地之间。
如图1及图2所示,所述电子设备100还包括第一馈源30以及第二馈源40,所述第一馈源30与所述第一天线辐射体10的第一馈电点11电连接,用于通过所述第一馈电点11为所述第一天线辐射体10提供馈电信号,所述第二馈源40与所述第二天线辐射体20的第二馈电点21电连接,用于通过所述第 二馈电点21为所述第二天线辐射体20提供馈电信号,其中,所述第一接地点、第二接地点均接地。
从而,本申请中,通过在所述第一馈电点11与所述第一接地点12之间增加所述第三接地点13以及接地元件14进行接地,改变了第一天线辐射体10的回地位置,使得第一天线辐射体10与第二天线辐射体20之间的回地位置的间距增大,提高了所述第一天线辐射体10与第二天线辐射体20之间的隔离度,减少所述第一天线辐射体10与第二天线辐射体20之间的干扰,提高了天线辐射体性能。
其中,所述第一馈源30提供的馈电信号通过第一馈电点11馈入后,原本经过第一接地点12回地,而所述第二馈源40提供的馈电信号通过第二馈电点21馈入后,经过第二接地点22回地,由于5G通信所需天线辐射体较多,天线辐射体布局较为紧凑,所述第一天线辐射体10的第一接地点12和所述第二天线辐射体20的第二接地点22将较为靠近,而导致所述第一天线辐射体10和所述第二天线辐射体20的形成回地干扰。本申请中,通过在所述第一馈电点11与所述第一接地点21之间增加所述第三接地点13以及接地元件,所述第三接地点13相比所述第一接地点12更远离所述第二接地点22,从而,使得第一天线辐射体10与第二天线辐射体20之间的回地位置的间距增大,提高了所述第一天线辐射体10与第二天线辐射体20之间的隔离度。其中,所述第一馈源30提供的馈电信号与所述第二馈源40提供的馈电信号即为所述第一馈源30与所述第二馈源40产生的馈电电流。
其中,所述第一天线辐射体10和所述第二天线辐射体20均支持第一频段,所述第三接地点13通过所述接地元件14接地后,至少用于提高所述第一天线辐射体10和所述第二天线辐射体20均工作在第一频段时的隔离度,即,提高均工作在第一频段的第一天线辐射体10和第二天线辐射体20之间的隔离度。
如图1及图2所示,所述第一天线辐射体10还包括第四接地点15,所述第四接地点15设置于所述第一馈电点11的远离所述第一接地点12的一侧。其中,所述第一天线辐射体10还支持第二频段,其中,所述第一馈电点11至所述第三接地点13以及接地元件14形成的电流路径用于支持所述第一频段的射频信号的收发,所述第一馈电点11分别至所述第一接地点12以及所述第四 接地点15形成的两路电流路径用于支持第二频段的射频信号的收发。即,从所述第一馈电点11接收的馈电信号通过所述第三接地点13以及接地元件14回地,而使得所述第一天线辐射体10谐振在第一频段,而支持所述第一频段的射频信号的收发。从所述第一馈电点11接收的馈电信号还分别通过所述第一接地点12以及所述第四接地点15回地,而使得所述第一天线辐射体10谐振在第二频段,支持第二频段的射频信号的收发。其中,在第二频段下,从所述第一馈电点11接收的馈电信号/馈电电流主要通过第一接地点12以及所述第四接地点15回地,至少部分通过所述第三接地点13以及接地元件14回地,而实现对所述第二频段的调谐/微调。
本申请中,所述第一频段为5G N78频段(5G NSA通信制式下的N78频段),所述第二频段为MHB(中高频,Middle high band)频段。显然,在其他实施例中,所述第一频段和第二频段可为其他频段。
其中,所述第二天线辐射体20与所述第一天线辐射体10支持的频段可以相同,即,所述第二天线辐射体20也可还支持第二频段而同时支持第一频段和第二频段,即,支持MHB频段和5G N78频段。其中,所述第二馈电点21至所述第二接地点22的电流路径用于实现所述第一频段和第二频段的射频信号的收发,即,从所述第二馈电点21接收的馈电信号通过所述第二接地点22回地,使得所述第二天线辐射体20同时谐振在所述第一频段和第二频段,而同时实现所述第一频段和第二频段的射频信号的收发。
其中,本申请中,提高所述第一天线辐射体10与第二天线辐射体20之间的隔离度,具体是指提高了第一天线辐射体10与第二天线辐射体20同时工作在第一频段,例如5G N78频段时的隔离度。
其中,所述第一接地点11、所述第二接地点12以及所述第四接地点15可通过导线、FPC、金属弹片等电连接件接地。
请参阅图3,为所述电子设备100的第二天线辐射体10与所述第一天线辐射体10工作在第一频段时的电流分布的示意图。其中,所述第一频段,即5G N78频段的射频信号的收发,主要是通过从所述第一馈电点到所述第三接地点13以及接地元件14回地的馈电路径实现的,即,此时馈电信号/馈电电流为从所述第一馈电点11传输至所述第三接地点13以及接地元件14而回地, 而所述第二天线辐射体10的馈电信号/馈电电流为从所述第二馈电点21传输至第二接地点22而回地。而由于第三接地点13相比所述第一接地点12距离所述第二天线辐射体20的第二接地点22较远,因此,当第一天线辐射体10与第二天线辐射体20同时工作在所述5G N78频段时,第一天线辐射体10与第二天线辐射体20之间的回地位置的间距相对增大,提高了所述第一天线辐射体10与第二天线辐射体20之间的隔离度。
其中,如图1及图2所示,所述第一天线辐射体10的第一馈电点11与所述第三接地点13之间具有缝隙51,所述第三接地点13具体为位于所述缝隙51与所述第一接地点12之间。所述第一天线辐射体10的第一馈电点11接收的馈电信号为通过耦合馈电的方式耦合传输至所述第三接地点13和/或第一接地点11。
在一些实施例中,如图2所示,所述电子设备100包括金属边框50,其中,所述金属边框50开设有至少一个缝隙51,而将所述金属边框50分隔成至少一个边框段52。
其中,图2中仅示意出了金属边框50的一部分,其中,如图1及图2所示,所述至少一个边框段52至少包括通过缝隙51分隔成的第一边框段52a以及第二边框段52b。所述第一天线辐射体10的所述第一馈电点11设置于所述第一边框段52a的靠近所述第二边框段52b的位置,所述第一天线辐射体10的所述第一接地点12以及第三接地点13设置于所述第二边框段52b的靠近所述第一边框段52a的位置,所述第三接地点13设置于所述第一接地点12与所述第一边框段52a之间,所述第二馈电点21设置于所述第二边框段52b的远离所述第一边框段52a的位置,所述第二接地点22设置于所述第二边框段52b上,且位于所述第二馈电点21与所述第一接地点12之间。
具体的,如图2所示,所述第一边框段52a为直条形,而位于所述电子设备100的第一边B1上,所述第二边框段52b延伸于所述电子设备100的第一边B1以及相邻的第二边B2上,所述第二边框段52b呈倒“L”形。
其中,所述第二边框段52b包括第一子边框段521b以及第二子边框段522b,所述第一子边框段521为所述第二边框段52b的位于所述电子设备100的第一边B1的部分,所述第二子边框段522b为所述第二边框段52b的位于 所述电子设备100的第二边B2的部分。
其中,所述第一馈电点11设置于所述第一边框段52a的靠近所述第二边框段52b(即所述第一子边框段521b)的位置。所述第一馈源30与所述第一馈电点11连接。所述第一天线辐射体10的所述第一接地点12以及第三接地点13设置于所述第一子边框段521b,且所述第一接地点12相比所述第三接地点13更靠近第一边框段52a。
所述第二馈电点21设置于所述第二子边框段522b的远离所述第一子边框段521b的位置,所述第二接地点22设置于所述第二子边框段522b的靠近所述第一子边框段521b。
其中,所述第一边框段52a以及所述第二边框段52b的位于所述电子设备100的第一边B1的所述第一子边框段521b构成所述第一天线辐射体10。所述第二子边框段522b构成所述第二天线辐射体20。
对于所述第二天线辐射体20而言,所述第二馈电点21接收到所述第二馈源40的馈电信号/馈电电流后,通过第二子边框段522b传输至所述第二接地点22后回地,而可实现所述第一频段和第二频段的射频信号的收发。即,所述第二天线辐射体20可在第二馈源40产生的馈电信号的激励下支持所述第一频段和第二频段的射频信号的收发,例如,支持MHB频段和5G N78频段的射频信号的收发。
在一些实施例中,所述电子设备100的第一边B1为短边,所述第二边B2为与所述第一边B1相邻的长边。
其中,图2所示的是电子设备100的仅示意出部分天线辐射体的结构示意图。所述金属边框50还包括其他的多个分布在第一边B1及其相对边、第二边B2及其相对边上的,由缝隙间隔开的边框段。所述天线结构200还包括多个其他的由该些其他边框段形成的天线辐射体,由于与本发明改进无关,故未在图中示出。
显然,在其他实施例中,所述第一天线辐射体10和所述第二天线辐射体20之间可不开设缝隙,共用一个辐射体,例如,所述第一天线辐射体10和所述第二天线辐射体20的馈电点和接地点都连接至同一个边框段上。
其中,如图2所示,所述电子设备100还包括中框60,所述中框60为面 板状框,用于支撑电子设备100的显示屏(图中未示),其中,所述中框为金属材料制成,例如为,铜、铁、或铜铁合金等制成。所述中框用作为所述电子设备100的整机地。
其中,所述第一接地点11、所述第二接地点12、所述第三接地点13以及所述第四接地点15为与所述中框60电连接而实现接地。例如,所述第一接地点11、所述第二接地点12以及所述第四接地点15可通过导线、FPC、金属弹片等电连接件与所述中框60电连接而接地,所述第三接地点13可通过前述的接地元件14与所述中框60电连接而接地。
如图2所示,所述中框60的各边靠近金属边框50的边沿区域的大部分区域被去掉而形成净空区域,所述中框60的各边的边沿区域中的少部分区域延伸至所述金属边框50,而与所述金属边框50电接触,作为对应的天线辐射体的接地点。即,所述中框60原本是四边大致延伸至与所述金属边框50的四边平齐的位置的方形框,通过将中框60的各边靠近金属边框50的边沿区域的大部分区域通过切割等方式去除而形成净空区域,避免对金属边框50形成的天线辐射体的射频收发造成影响,而保留了部分区域仍然与金属边框50电接触,而实现了天线辐射体的接地。例如,所述中框60具有延伸至所述金属边框50的至少一区域,例如,如图2所示的区域61,前述的第一天线辐射体10的第一接地点12与所述第二天线辐射体20的第二接地点22与所述区域61直接接触电连接或通过FPC、金属弹片等电连接件电接触/电连接,而实现接地。即,如图2所示,所述中框60的所述区域61延伸至所述金属边框50的对应位置,例如延伸至所述金属边框50的下方或内侧,所述第一天线辐射体10的第一接地点12与所述第二天线辐射体20的第二接地点22均与所述中框60的所述区域61直接接触电连接或通过FPC、金属弹片等电连接件电连接,而实现接地。
在一些实施例中,所述金属边框50可为裸露的金属边框,即,从所述电子设备100的外观来看,是可以直接看到金属边框50的金属材质的。
在其他实施例中,所述金属边框50还可为通过MDA(模内嵌件一体式)工艺形成的包裹有塑胶等非导电材料的金属边框。
其中,当所述金属边框50为包裹有塑胶等非导电材料的金属边框时,所述金属边框50的内侧可开设贯穿所述非导电材料的通孔,而供金属边框50 形成的天线辐射体的馈电点以及接地点露出,以与对应的馈源或地电连接,而实现天线辐射体的激励。
在一些实施例中,如图2所示,所述接地元件14可为开关元件,且所述接地元件14为数控开关,例如可为MOS管、三极管等受控开关,而可受控导通或断开,而实现第三接地点13接地或不接地。在一些实施例中,所述接地开关14也可为电容、电感或LC并联电路等匹配元件,或者为开关元件与匹配元件串联形成的结构。
其中,通过开关串联匹配元件的结构,能根据需要有效地进行匹配调谐。例如,当所述第一天线辐射体10与所述第二天线辐射体20工作在5G N78频段时,通过控制开关元件导通,而提高第一天线辐射体10和第二天线辐射体20工作在5G N78频段时的隔离度,而当所述第一天线辐射体10与所述第二天线辐射体20工作在MHB频段时,保持所述开关元件导通,可进一步对MHB频段进行微调,例如调整MHB频段的工作频点,而提高所述第一天线辐射体10工作在MHB频段的性能。其中,当所述第一天线辐射体10与所述第二天线辐射体20工作在5G N78频段时,通过控制开关元件导通,除了提高第一天线辐射体10和第二天线辐射体20工作在5G N78频段时的隔离度之外,也能够进一步对5G N78频段进行微调。在其他实施例中,所述接地元件14也可为导线、FPC、金属弹片等电连接件。
即,在一些实施例中,所述接地元件14可为开关元件、电容、电感、导线、FPC以及金属弹片中的至少一种。
请参阅图4,为本申请一实施例中的接地元件14的示意图。如图4所示,所述接地元件14包括多个并联的匹配元件支路Z1,每一匹配元件支路包括串联的匹配元件M1和开关SW1,且不同匹配支路Z1中的匹配元件M1的类型和参数中的至少一种不同;通过控制不同匹配元件支路中的开关的通断,选择不同的匹配元件支路工作而能够对第一天线辐射体10的工作频段的频点进行调整/微调。
请参阅图5,为本申请一实施例中的接地元件14的第一具体示例图。如图5所示,在一些实施例中,所述接地元件14包括并联于第三接地点13与地之间的第一电感匹配支路Z11、第一电容匹配支路Z12、第二电容匹配支路Z13 以及第三电容匹配支路Z14,所述第一电感匹配支路Z11包括串联的第一匹配电感L11和开关SW1,所述第一电容匹配支路Z12包括串联的第一匹配电容C11和开关SW1,所述第二电容匹配支路Z13包括串联的第二匹配电容C12和开关SW1,所述第三电容匹配支路Z14包括串联的第三匹配电容C13和开关SW1。
其中,所述第一匹配电容C11、所述第二匹配电容C12以及所述第三匹配电容C13的电容值不同。从而,由于第一电感匹配支路Z11、第一电容匹配支路Z12、第二电容匹配支路Z13以及第三电容匹配支路Z14中的类型或者参数不同,当不同的匹配支路导通或者不同组合的匹配支路导通时,产生不同的匹配参数,而实现不同频段的谐振匹配。
请参阅图6,为本申请一实施例中的接地元件14的第二具体示例图。如图6所示,所述接地元件14包括并联于所述第三接地点13与地之间的第二电感匹配支路Z15、第三电感匹配支路Z16、第四电容匹配支路Z17以及第五电容匹配支路Z18,所述第二电感匹配支路Z15包括串联的第二匹配电感L12和开关SW1,所述第三电感匹配支路Z16包括串联的第三匹配电感L13和开关S21,所述第四电容匹配支路Z17包括串联的第四匹配电容C14和开关SW1,所述第五电容匹配支路Z18包括串联的第五匹配电容C15和开关SW1。
其中,所述第二匹配电感L12与所述第三匹配电感L13的电感值不同,所述第四匹配电容C14和所述第五匹配电容C15的电容值不同。从而,当不同的匹配支路导通或者不同组合的匹配支路导通时,产生不同的匹配参数,而实现不同频段的谐振匹配。
在一些实施例中,所述开关SW1为数控开关,例如可为MOS管、BJT三极管等。
请一并参阅图7,为电子设备100的示意出部分元件的功能模块图。其中,所述电子设备100包括前述的天线结构200、第一馈源30、第二馈源40、金属边框50、中框60之外,还可包括处理器70以及存储器80。其中,所述存储器80中可存储所述第一天线辐射体10支持的第一频段和第二频段的各个频点与开关单元中的开关控制逻辑的对应关系。
所述处理器2可包括多个输出控制端,所述多个输出控制端可分别与所述 接地元件14的所有开关SW1的受控端一一连接,例如,当所述接地元件14中的开关SW1为MOS管时,所述处理器2的多个输出控制端可分别与所述接地元件14的所有MOS管的栅极连接。所述处理器2可根据当前的调谐需求确定开关控制逻辑,而控制各个输出控制端输出对应电平的信号至所述接地元件14中的对应开关SW1的受控端,而控制至少一个开关单元16中的多个开关SW1进行相应的导通或断开。
例如,所述处理器2可根据当前所述第一天线辐射体10所工作的频段以及电子设备100当前运行的应用,确定当前工作的频段需要调谐至的频点,然后根据所述存储器80存储的对应关系确定对应的开关控制逻辑,而控制所述接地元件14中的多个开关SW1进行相应的导通或断开,而使得所述接地元件14调节到对应的匹配参数,而使得第一天线辐射体10在对应的第一频段或第二频段调谐到对应的频点。其中,本申请中,所述频点指的是对应频段的谐振中心频率,通过调谐频点,能够使得谐振最大,天线辐射体性能最佳。
例如,所述处理器2在当前所述第一天线辐射体10工作在第一频段,即MHB频段,且当前运行的应用为新闻浏览时,则可确定需要调谐至第一频段的第一频点,如果当前运行的应用为语音通话应用,则确定需要调谐至第一频段的第二频点。其中,上述仅仅是举例,只是为了说明,根据当前运行的应用的不同,需要调谐至的频点不同。
从而,本申请中,由于接地元件14包括多个并联的匹配元件支路Z1,每一匹配元件支路包括串联的匹配元件M1和开关SW1,且不同匹配支路Z1中的匹配元件M1的类型和参数中的至少一种不同,除了提高第一天线辐射体10和第二天线辐射体20工作在5G N78频段时的隔离度之外,也能够进一步对5G N78频段以及HMB频段进行调谐。
请参阅图8,为本申请中一实施方式中第一天线辐射体和第二天线辐射体工作在第二频段,即工作在5G N78频段时的隔离度示意图。
如图8所示,当工作在5G N78频段时,所述第一天线辐射体10与所述第二天线辐射体20的隔离度D1基本在-23db以下,隔离度已经较为明显,两者的干扰已经很低,有效降低了干扰。而从图7的第一天线辐射体10的谐振曲线Q1和第二天线辐射体20的谐振曲线Q2来看,所述第一天线辐射体10 以及第二天线辐射体20的S参数,特别是S参数中回波损耗参数的幅值,分别在大约-15和-10的位置,实际上第一天线辐射体10和第二天线辐射体20的效率也得到了有效提升。即,所述第一天线辐射体10和第二天线辐射体20不但没有降低,反倒因为隔离度的提升而各有一定的提升,例如0.3-0.5db的提升。
其中,所述电子设备100还包括其他元件,例如后壳、摄像头等等,由于与本发明改进无关,故不再赘述。
本发明实施例所涉及到的电子设备100可以包括各种具有天线辐射体的手机、平板电脑等手持设备、车载设备、可穿戴设备、计算设备或连接到无线调制解调器的其他处理设备,以及各种形式的用户设备(User Equipment,UE),移动台(Mobile Station,MS)等等。为方便描述,上面提到的设备统称为电子装置。
从而,本申请中,通过在所述第一馈电点11与所述第一接地点11之间增加所述第三接地点13以及接地元件,改变了第一天线辐射体10的回地位置,使得第一天线辐射体10与第二天线辐射体20之间的回地位置的间距增大,提高了所述第一天线辐射体10与第二天线辐射体20之间的隔离度,减少或避免了所述第一天线辐射体10与第二天线辐射体20之间的干扰,提高了天线辐射体性能。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上对本发明实施例进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的一般技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种电子设备,其中,所述电子设备包括第一天线辐射体、第二天线辐射体、第一馈源以及第二馈源,所述第一天线辐射体包括第一馈电点、第一接地点,所述第二天线辐射体包括第二馈电点、第二接地点,所述第一接地点与所述第二接地点相邻设置,所述第一馈电点设置于所述第一接地点远离所述第二接地点的一侧,所述第二馈电点设置于所述第二接地点的远离所述第一接地点的一侧;所述第一馈源与所述第一天线辐射体的第一馈电点电连接,用于通过所述第一馈电点为所述第一天线辐射体提供馈电信号,所述第二馈源与所述第二天线辐射体的第二馈电点电连接,用于通过所述第二馈电点为所述第二天线辐射体提供馈电信号,其中,所述第一接地点、第二接地点均接地;
    其中,所述第一天线辐射体还包括第三接地点以及接地元件,所述第三接地点设置于所述第一馈电点与所述第一接地点之间,所述接地元件连接于所述第三接地点与地之间。
  2. 根据权利要求1所述的电子设备,其中,所述第一天线辐射体和所述第二天线辐射体均支持第一频段,所述第三接地点通过所述接地元件接地后,至少用于提高所述第一天线辐射体和所述第二天线辐射体均工作在第一频段时的隔离度。
  3. 根据权利要求2所述的电子设备,其中,所述第一天线辐射体还包括第四接地点,所述第四接地点设置于所述第一馈电点的远离所述第一接地点的一侧,其中,所述第一天线辐射体还支持第二频段,其中,所述第一馈电点分别至所述第一接地点以及所述第四接地点形成的两路电流路径用于实现第二频段的射频信号的收发,所述第一馈电点至所述第三接地点以及接地元件形成的电流路径用于实现所述第一频段的射频信号的收发。
  4. 根据权利要求3所述的电子设备,其中,所述第二天线辐射体还支持第二频段,其中,所述第二馈电点至所述第二接地点的电流路径用于实现所述第一频段和第二频段的射频信号的收发。
  5. 根据权利要求4所述的电子设备,其中,所述第一频段为5G N78频段,所述第二频段为MHB频段。
  6. 根据权利要求1-5任一项所述的电子设备,其中,所述电子设备还包括金属边框,其中,所述金属边框开设有至少一个缝隙,而将所述金属边框分隔成至少一个边框段,所述至少一个边框段至少包括通过缝隙分隔成的相邻的第一边框段以及第二边框段;所述第一馈电点设置于所述第一边框段的靠近所述第二边框段的位置,所述第一天线辐射体的所述第一接地点以及第三接地点设置于所述第二边框段的靠近所述第一边框段的位置,所述第二馈电点设置于所述第二边框段的远离所述第一边框段的位置,所述第二接地点设置于所述第二边框段上,且位于第二馈电点与所述第一接地点之间。
  7. 根据权利要求6所述的电子设备,其中,所述第一边框段为直条形,位于所述电子设备的第一边上,所述第二边框段延伸于所述电子设备的第一边以及相邻的第二边上,其中,所述第二边框段包括第一子边框段以及第二子边框段,所述第一子边框段为所述第二边框段的位于所述电子设备的第一边的部分,所述第二子边框段为所述第二边框段的位于所述电子设备的第二边的部分,所述第一馈电点设置于所述第一边框段的靠近所述第一子边框段的位置,所述第一天线辐射体的所述第一接地点以及第三接地点设置于所述第一子边框段,所述第一边框段以及所述第一子边框段构成所述第一天线辐射体,所述第二馈电点设置于所述第二子边框段的远离所述第一子边框段的位置,所述第二接地点设置于所述第二子边框段的靠近所述第一子边框段的位置,所述第二子边框段构成所述第二天线辐射体。
  8. 根据权利要求7所述的电子设备,其中,所述电子设备的第一边为短边,所述第二边为与所述第一边相邻的长边。
  9. 根据权利要求6所述的电子设备,其中,所述电子设备还包括中框,所述中框为金属材料制成,用作为所述电子设备的整机地,所述第一接地点、所述第二接地点以及所述第三接地点与所述中框电连接而实现接地。
  10. 根据权利要求9所述的电子设备,其中,所述中框的各边靠近金属边框的边沿区域的大部分区域被去掉而形成净空区域,所述中框的各边的边沿区域中的少部分区域延伸至所述金属边框,而与所述金属边框电接触,作为对应的天线辐射体的接地点。
  11. 根据权利要求10所述的电子设备,其中,所述第一天线辐射体的第 一接地点与所述第二天线辐射体的第二接地点与所述中框的延伸至所述金属边框的同一区域直接接触或通过FPC、金属弹片等电连接件电接触,而实现接地。
  12. 根据权利要求6所述的电子设备,其中,所述金属边框为裸露的金属边框,或者为通过模内嵌件一体式工艺形成的包裹有非导电材料的金属边框。
  13. 根据权利要求1所述的电子设备,其特征在于,所述接地元件为开关元件、电容、电感、导线、FPC以及金属弹片中的至少一种。
  14. 根据权利要求1所述的电子设备,其中,所述接地元件包括多个并联的匹配元件支路,每一匹配元件支路包括串联的匹配元件和开关,且不同匹配支路中的匹配元件的类型和参数中的至少一种不同;通过控制不同匹配元件支路中的开关的通断,选择不同的匹配元件支路工作而对第一天线辐射体的工作频段的频点进行调整。
  15. 一种天线结构,包括第一天线辐射体、第二天线辐射体,所述第一天线辐射体包括第一馈电点、第一接地点,所述第二天线辐射体包括第二馈电点、第二接地点,所述第一接地点与所述第二接地点相邻设置,所述第一馈电点设置于所述第一接地点远离所述第二接地点的一侧,所述第二馈电点设置于所述第二接地点的远离所述第一接地点的一侧;
    其中,所述第一天线辐射体还包括第三接地点以及接地元件,所述第三接地点设置于所述第一馈电点与所述第一接地点之间,所述接地元件连接于所述第三接地点与地之间。
  16. 根据权利要求15所述的天线结构,其中,所述第一天线辐射体和所述第二天线辐射体均支持第一频段,所述第三接地点通过所述接地元件接地后,至少用于提高所述第一天线辐射体和所述第二天线辐射体均工作在第一频段时的隔离度。
  17. 根据权利要求16所述的天线结构,其中,所述第一天线辐射体还包括第四接地点,所述第四接地点设置于所述第一馈电点的远离所述第一接地点的一侧,其中,所述第一天线辐射体还支持第二频段,其中,所述第一馈电点分别至所述第一接地点以及所述第四接地点形成的两路电流路径用于实现第二频段的射频信号的收发,所述第一馈电点至所述第三接地点以及接地元件形 成的电流路径用于实现所述第一频段的射频信号的收发。
  18. 根据权利要求17所述的天线结构,其中,所述第二天线辐射体还支持第二频段,其中,所述第二馈电点至所述第二接地点的电流路径用于实现所述第一频段和第二频段的射频信号的收发。
  19. 根据权利要求18所述的天线结构,其中,所述第一频段为5G N78频段,所述第二频段为MHB频段。
  20. 根据权利要求15所述的天线结构,其中,所述接地元件包括多个并联的匹配元件支路,每一匹配元件支路包括串联的匹配元件和开关,且不同匹配支路中的匹配元件的类型和参数中的至少一种不同;通过控制不同匹配元件支路中的开关的通断,选择不同的匹配元件支路工作而对第一天线辐射体的工作频段的频点进行调整。
PCT/CN2022/083091 2021-05-11 2022-03-25 天线结构及电子设备 WO2022237352A1 (zh)

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